15-03-2018 дата публикации
Номер: US20180074272A1
Принадлежит:
Method of making an optoelectronic device package. 1. A method of making an optoelectronic device package , comprising:providing a base substrate comprising an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region;forming a fiber groove in the base substrate disposed along an optical axis at a location external to the lid mounting region;bonding an optoelectronic device to the optoelectronic device mounting region;mounting a lid on the lid mounting region to form an enclosed volume between the base substrate and the lid, wherein the optoelectronic device is in the enclosed volume, wherein at least a portion of the lid mounting region is disposed along the optical path below the surface of the base substrate to a depth below the optical path;providing an optical fiber segment in the fiber groove; andplacing an encapsulant over the optical element and/or the fiber segment.2. The method of claim 1 , wherein the lid comprises silicon.3. The method of claim 1 , comprising oxidizing a sidewall portion of a silicon lid through its depth to provide an optically transmissive silicon dioxide sidewall region. This application is a continuation of U.S. patent application Ser. No. 15/584,542, filed May 2, 2017, which issued as U.S. Pat. No. 9,817,199 on Nov. 13, 2017, which is a continuation of U.S. patent application Ser. No. 15/230,944, filed Aug. 8, 2016, which issued as U.S. Pat. No. 9,647,420 on May 9, 2017, which is a continuation of U.S. patent application Ser. No. 14/657,131, filed Mar. 13, 2015, which issued as U.S. Pat. No. 9,410,799 on Aug. 9, 2016, which is a continuation of U.S. patent application Ser. No. 14/258,358, filed Apr. 22, 2014, which issued as U.S. Pat. No. 8,993,450 on Mar. 31, 2015, which is a continuation of U.S. patent application Ser. No. 12/944,040, filed Nov. 11, 2010, which issued as U.S. Pat. No. 8,703,603 on Apr. 22, 2014, which is a continuation of U.S. patent application Ser. No. 11/590,099, filed ...
Подробнее