OPTISCHES SYSTEM ZUR BAUELEMENT/-TRÄGER-JUSTIERUNG

Teachen von Bestückpositionen

Beschrieben wird ein Verfahren zum Modifizieren einer Beschreibung eines Bauelementeträgers (150), welche geometrische Soll-Daten von elektronischen Bauelementen (172, 174, 178, 180) umfasst. Das Verfahren weist auf (a) Erfassen, mittels einer Kamera (340), eines ersten Bildes (242) eines ersten Ausschnitts von einer Oberfläche des Bauelementeträgers (150); (b) Speichern des ersten Bildes (242); (c) Darstellen des ersten Bildes (242) für eine erste Zeitspanne; (d) Ermitteln von Ist-Positionen von ersten Bauelement-Anschlussflächen (292, 294, 296) innerhalb des ersten Bildes (242), welche einer ersten Bestückposition für ein erstes Bauelement (180) zugeordnet sind; (e) Vergleichen der Ist-Positionen mit Soll-Positionen von ersten Bauelement-Anschlusskontakten (282, 284, 286) des in der ersten Bestückposition zu bestückenden ersten Bauelements (180), welche einen Teil der geometrischen Soll-Daten repräsentieren; (f) Modifizieren der Beschreibung des Bauelementeträgers in Bezug auf eine Soll-Lage ...

Optical measurement system for components

METHOD FOR DETERMINING THE RELATIVE SPATIAL POSITION BETWEEN TWO CAMERAS, AND CAMERA FOR OPTICALLY DETECTING OBJECTS

COMPONENT MOUNTING APPARATUS

This component mounting apparatus includes a head portion capable of mounting a component suctioned by a nozzle on a board, a board imaging portion provided on the head portion to be movable relative to the head portion so as to image the board, and an imaging position correction mark provided in the head portion to be capable of being imaged by the board imaging portion and is configured to correct the displacement of the board imaging portion relative to the head portion on the basis of an image of the imaging position correction mark imaged by the board imaging portion.

PROCEDURE AND DEVICE FOR CALIBRATING A VERFAHRWEGS AND/OR A WINKELLAGE OF A HOLDING DEVICE IN A MECHANISM FOR THE PRODUCTION OF ELECTRICAL BUILDING GROUPS AS WELL AS CALIBRATION SUBSTRATE

Component holding state detection method and component mounting machine

A component mounting machine includes a part camera in which a suction nozzle for sucking a component P and a fiducial mark are provided on a head, a sub-lens is installed in a visual field of a lens, the component is imaged through a main lens, and it is possible to image the fiducial mark through the lens and the sub-lens. Distortion correction values of the main lens portion are measured, distortion correction values of the sub-lens portion are measured, and the distortion correction values are stored in advance as a distortion correction table. During component mounting, when the component P which is sucked by the suction nozzle and the fiducial mark are imaged at the same time by the part camera, the obtained image is corrected using the distortion correction table, and a suction state of the component P is detected based on the corrected image.

Apparatus and system for operating an automatic component mounting unit for mounting components onto a substrate of an electrical assembly

A method, apparatus and system are for operating an automatic component mounting unit for mounting an electrical component onto a substrate of an electrical assembly. The automatic component mounting unit utilizes a number of different mounting members, such as a head, feeding and sensor members, for mounting a variety of different components. Each of the mounting members includes a data storage device. The automatic component mounting unit also includes a control device for communicating with a data storage device of each of the mounting members for processing an amount of process data that is specific to each of the mounting members and that is generated prior to installation. As a result, the mounting members are readily configured for optimal use upon installation of the mounting members.

Method of calibrating a dispenser

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.

Verfahren zur Bestimmung der relativen räumlichen Lage zwischen zwei Kameras und Kamera zum optischen Erfassen von Objekten

Die Erfindung schafft ein Verfahren zur Bestimmung der relativen räumlichen Lage zwischen zwei Kameras, wobei ein Sensor 105, 205 einer ersten Kamera 100, 200 durch eine Dunkelfeld- und/oder eine Hellfeldbeleuchtung beleuchtet wird, so dass aufgrund der Umkehrbarkeit der Strahlengänge in der Objektebene 146, 246 ein reelles Zwischenbild 145, 245 des Kamerasensors 105, 205 erzeugt wird. Erfindungsgemäß wird die zweite Kamera 150, 250 derart angeordnet, dass dieses Zwischenbild 145, 245 mit der zweiten Kamera 150, 250 aufgenommen werden kann und so der räumliche Zusammenhang zwischen den beiden Kameras herstellbar ist. Die Erfindung schafft ferner eine Kamera 100, 200, welche als erste Kamera bei der Durchführung des Verfahrens zur Bestimmung der relativen räumlichen Lage zwischen zwei Kameras verwendbar ist. Die Kamera 100, 200 weist einen flächigen Sensor 105, 205 auf, welcher mittels einer Beleuchtungseinheit dahingehend beleuchtbar ist, dass nach einer Abbildung über eine Optik 110, 210 ...

Verfahren und Vorrichtung zur Platzierung elektronischer Bauteile

Verfahren zur Platzierung elektronischer Bauteile auf einer Platine umfassend die folgenden Schritte: Platzieren eines zu platzierenden Bauteils eines ersten Bauteiltyps in einer Startposition; Erstellen eines Bauteilbilds des zu platzierenden Bauteils in der Startposition; Erstellen eines Platinenbereichsbilds einer Platine eines ersten Platinenbereichstyps; Berechnen eines Verfahrwegs zum Verfahren des zu platzierenden Bauteils in eine Endposition auf der Platine basierend auf einer Bildüberlagerung des Bauteilbilds und eines zuvor abgespeicherten Referenzbauteilbilds eines Referenzbauteils des ersten Bauteiltyps und basierend auf einem zuvor abgespeicherten Referenzverfahrweg des Referenzbauteils von einer Referenzstartposition in eine Referenzendposition auf einer Referenzplatine des ersten Platinenbereichstyps und basierend auf einer Bildüberlagerung des Platinenbereichsbilds und eines zuvor abgespeicherten Referenzplatinenbereichsbilds der Referenzplatine; Verfahren des zu platzierenden ...

OPTICAL SYSTEM FOR ELEMENT/CCARRIER ADJUSTMENT

Component mounting machine

A component mounting machine including a camera configured to capture an image of a component held by a suction nozzle; and an image processing section configured to process the image captured by the camera, recognize the shape of the component, and measure shape data of the component; wherein, when the deviation amount of the measurement value of the shape data of the component exceeds the allowable value, the deviation amount of the measurement value of the shape data of the component is compared to a retry determination that is larger than the allowance value, and if the deviation amount of the measurement value of the shape data of the component exceeds the retry determination value, the component is determined to be abnormal and is discarded to a specified discard location.

Verfahren und Vorrichtung zum Kalibrieren eines Verfahrwegs und/oder einer Winkellage einer Haltevorrichtung in einer Einrichtung zur Herstellung von elektrischen Baugruppen sowie Kalibriersubstrat

Bekannte Verfahren kalibrieren den Verfahrweg und/oder die Winkellage von Haltevorrichtungen in Einrichtungen zur Herstellung von elektrischen Baugruppen durch optische Messungen der Lage von Nachbildungen (2) elektrischer Bauelemente, die auf ein Kalibriersubstrat (1) bestückt sind. Dazu dienen Markierungen (4) auf den Nachbildungen (2) und lokale Referenzmarken (3) auf dem Kalibriersubstrat (1). Leiterplattenkameras, die als optische Sensoren eingesetzt werden, weisen eine ausgeprägte Kameraverzerrung auf, die die Kalibrierung erschwert. DOLLAR A Durch das erfindungsgemäße Verfahren, die Vorrichtung sowie das Kalibriersubstrat (1) wird ein Sensorkorrekturfaktor ermittelt, in dem die Lage zweier Korrekturmarken (5, 6), die in einem vorgegebenen Nennabstand (a) und einer vorgegebenen Lage zueinander auf dem Kalibriersubstrat (1) angebracht sind, mit der Leiterplattenkamera vermessen werden und das Ergebnis der Messung mit dem Nennabstand (a) verglichen wird.

VERFAHREN UND VORRICHTUNG ZUM KALIBRIEREN EINES VERFAHRWEGS UND/ODER EINER WINKELLAGE EINER HALTEVORRICHTUNG IN EINER EINRICHTUNG ZUR HERSTELLUNG VON ELEKTRISCHEN BAUGRUPPEN SOWIE KALIBRIERSUBSTRAT

Method for processing substrates, in particular wafers, masks or flat panel displays, with a semi-conductor industry machine

A method for processing substrates, in particular wafers, masks or flat panel displays, with a semi-conductor industry machine, wherein a computer-supported process is used to determine the presence and/or position and/or orientation of the substrate. Further, a system designed to execute the method. The computer-supported process includes an artificial neural network. 1. Method for processing substrates , in particular wafers , masks or flat panel displays , with a semi-conductor industry machine , wherein an artificial neural network is used to determine the presence and/or position and/or orientation and/or type of a substrate ,to determine the presence and/or position and/or orientation and/or type of the substrate based on at least one image, which shows a location in or on the semi-conductor industry machine or in the environment of the machine where a substrate may be located when operating the semi-conductor industry machine,wherein the at least one image is taken by at least one acquisition unit,and wherein the artificial neural networkgenerates and/or allows for an information data set comprising information about the determined presence and/or position and/or orientation and/or type of the substrate and/or generates and/or allows for a control command, which is used todirectly control the semi-conductor industry machine, or that is used by the machine's control system,or is passed on to a higher-level control system,or is passed on to a user who draws conclusions from this information for his actions operating the machine,or who passes on this information to control systems or other users,or is saved for later or further evaluation.2. Method according to claim 1 , wherein the artificial neural network forms at least one model that comprises at least one convolutional layer and/or at least one neuronal layer claim 1 , and may comprise additional components claim 1 , such as activation layers claim 1 , and wherein the artificial neural network can be taught ...

INFORMATION MANAGEMENT DEVICE AND INFORMATION MANAGEMENT METHOD

An information management device for managing information in a mounting system that mounts a component after determining usability of the component when the component is picked up from a wafer divided into multiple components and is mounted on a base material, includes an information storage section that stores various types of information, an information acquisition section that acquires information on a pickup position of the component on the wafer and information on a determination result of usability of the component, and an information processing section that stores information obtained by associating the pickup position of the component with the determination result of the usability in the information storage section. 1. An information management device for managing information in a mounting system that mounts a component after determining usability of the component , when the component is picked up from a wafer divided into multiple components and is mounted on a base material , the information management device comprising:an information storage section configured to store various types of information;an information acquisition section configured to acquire information on a pickup position of the component on the wafer and information on a determination result of usability of the component; andan information processing section configured to store information obtained by associating the pickup position of the component with the determination result of the usability in the information storage section.2. The information management device according to claim 1 , wherein the information processing section generates statistical information on an unusable rate in which the determination result of the usability is unusable for each pickup position of the component claim 1 , and stores the statistical information in the information storage section.3. The information management device according to claim 2 , further comprising:an information output section configured to ...

Calibration methods for placement machines incorporating on-head linescan sensing

Calibration methods for placement machines incorporating on-head linescan sensing

A method of calibrating a pick and place machine (31) having an on-head linescan sensor (64) is disclosed. The calibration includes obtaining z-axis height information of one or more nozzle tips via focus metric methods, including a Fourier transform method and a normalized correlation method. Additionally, other physical characteristics such as linear detector tilt, horizontal scale factor, and vertical scale factor are measured and compensated for in the process of placing the component. Nozzle runout, another physical characteristic, is also measured by a sinusoidal curve fit method, and the resulting Z-height calibration data is used to later place the component.

Glass parts pick-up jig

A method apparatus for assisting in the calibration of a pick and place machine including a parts pick up jig having a first feeder shoe for placement over the end of one of the feeder stations and second feeder shoe for placement over the end of an adjacent feeder station allowing for the safe and accurate pick-up of glass chips by the part placement nozzle. The feeder shoes are placed over the ends of the feeder stations with the end of feeder stations extending inside the feeder shoes against feeder shoe nose panels to assure accurate placement of the parts pick up jig on the "Y" axis. The parts pick up jig may also index against an inner or outer edge of the feeder station to assure accurate placement of parts pick up jig on the "X" axis. A bridge section extends between the feeder shoes and connects the two feeder shoes together. Formed on the upper surface of the bridge section are a series of recesses for receiving and aligning chips to be picked and placed during a calibration procedure ...

Optical measurement system for components

A measurement system has a robotic system mounted over a base plate which provides a vertical height reference (Fig.2, not shown). In the optical head (8), a CCD camera (17) is adjustable to be pre-set in height. The optical head (8) also has an upper light source (18) comprising LEDs and a lower light source (25) comprising a white fluorescent lamp (26) for lateral component illumination. An image analysis computer (10) automatically performs various tests to co-ordinate optical and mechanical operation, including determination of optimum head acceleration and automatic scaling. The system is used e.g. to identify components on a circuit board and measure their locations.

A measurement system

SYSTEM FOR MONITORING OUTSIDE WORK AREA OF COMPONENT MOUNTING MACHINE

Image analysis for pick and place machines with in situ component placement inspection

The present invention includes a method of determining a location of a component on a workpiece. A before-placement standard image is acquired of an intended placement location on a standard workpiece. Then, a standard component is placed upon the standard workpiece and the placement is verified. An after-placement standard image is acquired and a standard difference image is created from the before and after standard images. Then, a before-placement test image is acquired of an intended placement location on the workpiece. A component is then placed upon the workpiece, and after-placement test image is acquired. A test difference image is created from the before and after test images. A first offset is calculated between the before standard difference image and the before test image. Then, the test difference is transformed based on the first offset to generate a difference test image (DTR) that is registered to the standard difference image. The standard difference image is correlated ...

Test apparatus for optical recognition system used during assembly of components onto printed circuit board compares output of recognition system when used on test plate with known test plate characteristics

A test plate has differing components such as resistors and capacitors mounted in a two dimensional array. Each component is oriented at a 90 degree angle relative to its neighboring components. The optical recognition system is tested by comparing its output measurements of the test carrier plate with accurate measurement data pre-stored on a data carrier. An Independent claim is included for a method for producing the test apparatus.

Calibration methods for placement machines incorporating on-head linescan sensing

AUTOMATED POSITIONING SYSTEM

AUTOMATED POSITIONING SYSTEM Abstract of the Disclosure Automated positioning apparatus for positioning multi-contact components on a circuit board utilizes automated members having a high degree of repetitive movement but not in themselves accurate, such member being relatively inexpensive. A positioning member picks up a component and moves it over a first viewing head. The component is viewed and its orientation determined. A viewing head on the positioning member is then positioned over a target on a circuit board and its position and orientation determined. The results enable the positioning member to position the component on the circuit board in the correct position and orientation. The viewing heads are calibrated for aspect ratio and pixel dimension. Also, the fields of view of the viewing heads are calibrated for orientation relative to the positioning member. The position and orientation of the viewing head on the positioning member relative to a pick-up member on the positioning member is also obtained.

OPTICAL SYSTEM FOR MUTUALLY POSITIONING A PAD CARRYING MEMBER AND A MULTILEADED COMPONENT

The invention relates to a simple and economic optical system for mutually positioning SMD components having connecting leads and the corresponding pads on pad carrying members with the object of bringing the connecting leads and pads together in one plane through translation or rotation, of positioning them and fixing them. The optical system utilizes a beam splitter, so that it is possible to observe simultaneously with the human eye the spaces in front of and behind the beam splitter. For considerations of robustness the semi transparent mirror used to this end is evaporated on a transparent substrate which has a finite thickness. A substrate having finite thickness leads to an apparent displacement of the space behind the substrate relative to the space in front of the substrate. The invention relates to the compensation of this displacement by the installation of a compensation plate having identical optical properties in the space over the semi transparent mirror on the substrate.

Method and apparatus for three dimensional inspection of electronic components

An apparatus for three dimensional inspection of an electronic part which has a camera and illuminator for imaging a first view of the electronic part. An optical element is positioned to reflect a different view of the electronic part into the camera, and the camera thus provides an image of the electronic part having differing views of the electronic part. An image processor applies calculations on the differing views to calculate a three dimensional position of at least one portion of the electronic part.

COMPONENT MOUNTING MACHINE

A component mounting machine including a camera configured to capture an image of a component held by a suction nozzle; and an image processing section configured to process the image captured by the camera, recognize the shape of the component, and measure shape data of the component; wherein, when the deviation amount of the measurement value of the shape data of the component exceeds the allowable value, the deviation amount of the measurement value of the shape data of the component is compared to a retry determination that is larger than the allowance value, and if the deviation amount of the measurement value of the shape data of the component exceeds the retry determination value, the component is determined to be abnormal and is discarded to a specified discard location.

Calibration methods for placement machines incorporating on-head linescan sensing

A method of calibrating a pick and place machine having an on-head linescan sensor is disclosed. The calibration includes obtaining z-axis height information of one or more nozzle tips via focus metric methods, including a Fourier transform method and a normalized correlation method. Additionally, other physical characteristics such as linear detector tilt, horizontal scale factor, and vertical scale factor are measured and compensated for in the process of placing the component. Nozzle runout, another physical characteristic, is also measured by a sinusoidal curve fit method, and the resulting Z-height calibration data is used to later place the component.

Method of determining the relative spatial position between two cameras based on detection of the position of a marking in the field of view of the second camera

The method determines the relative positioning between a first camera (60) having a first sensor (61) and first optics (62) and a second camera (40) having a second sensor (41) and second optics (42). The two cameras are positioned such that the second camera is in the field of view of the first and vice versa. A marking (65) positioned in the first camera a fixed distance from the first sensor is detected by the second camera. The relative spatial positioning between the two cameras is determined from the position of the detected marking in the field of view of the second camera. Independent claims also cover apparatus for carrying out the method.

Bestimmung der Orientierung einer Kamera relativ zu einer Referenzebene

Verfahren zum Bestimmen der Orientierung einer Kamera (240) relativ zu einer Referenzebene (261), welches Verfahren folgende Schritte aufweist: Erfassen einer optischen Verschiebung (268) einer in der Referenzebene (261) befindlichen Referenzstruktur (262), wobei die optische Verschiebung (268) durch ein refraktives optisches Element (265) verursacht wird, welches zwischen der Kamera (240) und der Referenzstruktur (262) angeordnet ist, und Ermitteln der Orientierung der Kamera (240) relativ zu der Referenzebene (261) basierend auf der erfassten optischen Verschiebung (268) mittels einer der Kamera (140, 240) nachgeschalteten Auswerteeinheit (151), wobei das Erfassen der optischen Verschiebung (268) der Referenzstruktur (262) folgende Schritte aufweist: Aufnehmen eines ersten Kamerabildes von zumindest einem Teil der Referenzstruktur (262), Einbringen des refraktiven optischen Elements (265) zwischen der Referenzstruktur (262) und der Kamera (240), und Aufnehmen eines zweiten Kamerabildes ...

MOUNTING ACCURACY MEASUREMENT SYSTEM FOR COMPONENT MOUNTING LINE, AND MOUNTING ACCURACY MEASUREMENT METHOD

Each of multiple component mounting machines constituting a component mounting line is configured to switch between a production mode in which a component is mounted on a circuit board that has been conveyed in and then conveyed out, a mounting accuracy measurement mode in which a mounting accuracy measurement component is mounted at a predetermined position on a mounting accuracy measurement board and the mounting accuracy is measured, and a pass mode in which a component is conveyed out without being mounted on the board conveyed in. When the control mode of two or more component mounters among the multiple component mounting machines is the mounting accuracy measurement mode, the mounting accuracy is measured by conveying the mounting accuracy measurement board along the board conveyance path, and the two or more component mounting machines sequentially use the mounting accuracy measurement board to measure the mounting accuracy.

Method and device for the placement of electronic components

A method for placing electronic components onto a circuit board, comprising the following steps: Placing a component to be placed of a first component type into a starting position; creating a component image of the component to be placed in the starting position; creating a circuit board region image of a circuit board of a first circuit board region type; calculating a travel path for moving the component to be placed into a final position on the circuit board based upon an image overlay of the component image and a previously saved reference component image of a reference component of the first component type, and based upon a previously saved reference travel path of the reference component from a reference starting position into a reference final position on a reference circuit board of the first circuit board region type, and based upon an image overlay of the circuit board region image and a previously saved reference circuit board region image of the reference circuit board; moving ...

Prüfnormal zum Prüfen von in der SMD-Montage eingesetzten optischen Erkennungssystemen und Verfahren zum Herstellen desselben

Prüfnormal zum Prüfen von in der SMD-Montage eingesetzten optischen Erkennungssystemen, bei dem ein Trägerbauteil (29) als Ersatz für ein in der Montage zum Einsatz kommendes Substrat vorgesehen ist, dadurch gekennzeichnet, dass Erhebungen (13) als Nachbildungen von in der Fertigung auf dem Substrat hergestellten Lotpastendepots zumindest mit einer Decklage (28) des Trägerbauteils (29) zusammen als einstückiges Urformteil ausgebildet sind.

AUTOMATISCHES LEHRVERFAHREN FÜR EIN LEITERPLATTEN-UNTERSUCHUNGSSYSTEM

A measurement system

Method and apparatus for calibrating a travel path and/or an angular position of a holding device in a means for manufacturing electrical assemblies as well as a calibration substrate

Prior art methods calibrate the travel path and/or the angular position of holding devices in equipment for manufacturing electrical assemblies by optical measurements of the position of simulations of electrical components that are equipped on a calibration substrate. Markings on the simulations and local reference marks on the calibration substrate serve this purpose. Printed circuit board cameras that are utilized as optical sensors exhibit a pronounced camera distortion that makes the calibration more difficult. As a result of the method, the apparatus as well as the calibration substrate, a sensor correction factor is determined in that the position of two correction marks that are applied on the calibration substrate at a predetermined nominal spacing and a predetermined position relative to one another are measured with the printed circuit board camera. The result of the measurement is compared to the nominal spacing.

Verfahren zum Betrieb eines Bestückautomaten, Bestückautomat, auswechselbare Komponente für einen Bestückautomaten und System aus einem Bestückautomaten und einer auswechselbaren Komponente

Exchangeable components (3, 5, 17) are mounted in a pick-and-place device (7) and the latter is calibrated in order to unambiguously allocate the exchanged components (3, 5, 17) and the pick-and-place device (7) in terms of their position. So far, this calibration has been carried out by placing glass plates on glass substrates that are provided with gauge marks, which is a very time-consuming method. According to the invention, the exchangeable components (3, 5, 17) are calibrated before being mounted and the geometrical data of the exchangeable components (3, 5, 17) are stored in a memory (15, 16, 18) of the exchangeable components (3, 5, 17). The control device (6) of the pick-and-place device (7) reads out the memory (15, 16, 18) once the exchangeable components (3, 5, 17) are mounted and uses said data for the placement process.

Oberflächenmontagegerät und Verfahren zum Korrigieren von Erkennungsfehlern

Ein Oberflächenmontagegerät 1 zum Montieren eines elektronischen Bauteils auf einer Leiterplatte umfasst ein Gestell 10, einen Montageabschnitt 60, eine Kamera 90, eine Markierung 67 und einen Steuer- bzw. Regelabschnitt 150. Der Montageabschnitt 60 ist in einer ebenen Richtung des Gestells 10 beweglich und ausgestaltet, um das elektronische Bauteil auf der Leiterplatte zu montieren. Die Kamera 90 ist entweder auf dem Gestell 19 oder dem Montageabschnitt 60 vorgesehen. Die Markierung 67 ist entweder auf dem Gestell 19 oder dem Montageabschnitt 60 vorgesehen, auf dem die Kamera 90 nicht vorgesehen ist. Der Steuer- bzw. Regelabschnitt 150 ist ausgestaltet, um Folgendes auszuführen: einen Markierungserkennungsprozess, umfassend Aufnehmen von Abbildungen der Markierung 67 an mehreren Positionen in einem Sichtfeld der Kamera, und Ausführen von Abbildungserkennung; einen einen Korrekturwert erzeugenden Prozess, umfassend Erzeugen von Korrekturwerten zum Korrigieren von Erkennungsfehlern an den ...

Method of calibrating a dispenser

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a tile for later use, and using the stored data to make small corrections prior to dispensing additional material.

Apparatus for three dimensional inspection of electronic components

A three dimensional inspection apparatus for ball array devices, where the ball array device is positioned in a fixed optical system. An illumination apparatus is positioned for illuminating the ball array device. A first camera is disposed in a fixed focus position relative to the ball array device for taking a first image of the ball array device to obtain a characteristic circular doughnut shape image from a ball. A second camera is disposed in a fixed focus position relative to the ball array device for taking a second image of the ball array device to obtain a top surface image of the ball. A processor applies triangulation calculations on related measurements of the first image and the second image to calculate a three dimensional position of the ball with reference to a pre-calculated calibration plane.

Prüfnormal zum Prüfen von in der SMD-Montage eingesetzten optischen Erkennungssystemen und Verfahren zum Herstellen desselben

Es wird ein Prüfnormal (11) zum Prüfen von in der SMD-Montage eingesetztem optischem Erkennungssystem vorgeschlagen. Erfindungsgemäß ist vorgesehen, dass das Prüfnormal beispielsweise mittels eines Mikroabformungsverfahrens von einer mit Lotpastendepots versehenen Leiterplatte abgeformt wird, so dass sich die Lotpastendepots (13) sowie die Kontaktpads (14) als Abguss ergeben und einstückig mit dem Prüfnormal (11) oder wie dargestellt zumindest dessen Deckschicht (28) ausgebildet sind. Hierdurch lässt sich vorteilhaft eine Reproduzierbarkeit immer genau derselben Geometrie des Prüfnormals erreichen, wodurch sich die erzielten Prüfungsergebnisse untereinander vergleichen lassen. Außerdem ist das so gewonnene Prüfnormal wenig anfällig gegenüber Umwelteinflüssen, so dass dessen Geometrie auch über einen längeren Zeitraum erhalten bleibt. Zur Angleichung der optischen Eigenschaften des Prüfnormals an die Oberflächen des Originals können die nachgebildeten Lotpastendepots (13) und Kontaktpads (14) mit einer Goldschicht (35) und einer Nickelschicht (36) versehen werden. Zusätzlich kann ein Lötstoplack (32) aufgebracht werden.

AUTOMATIC TEACHING METHOD FOR PRINTED CIRCUIT BOARD INSPECTION SYSTEM

Method and apparatus for three dimensional inspection of electronic components

A three dimensional inspection system for inspecting ball array devices having a plurality of balls, where the ball array device is positioned in an optical system. An illuminator is located to illuminate at least one ball on the ball array device. A first optical element is positioned to transmit light to the sensor. A second optical element is positioned to direct light from the at least one ball to the sensor, where the sensor, the first optical element and the second optical element cooperate to obtain at least two differing views of the at least one ball, the sensor providing an output representing the at least two differing views. A processor is coupled to receive the output, where the processor processes the output by using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane.

Method of manufacturing electronic components including a method for three dimensional inspection

A calibration and part inspection method for the inspection of ball grid array, BGA, devices. One or more cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into the camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution. The reticle with the pattern mask is removed after calibration and the BGA to be inspected is placed with the balls facing downward, in such a manner as to be imaged by a single camera, or optionally, via additional cameras. The scene of the part can thus be triangulated and the ...

MOUNTING ACCURACY MEASUREMENT SYSTEM FOR COMPONENT MOUNTING LINE, AND MOUNTING ACCURACY MEASUREMENT METHOD

OPTISCHES SYSTEM ZUR BAUELEMENT/-TRÄGER-JUSTIERUNG

Bestimmung der Orientierung einr Kamera ralativ zu einer Referenzebene

Die Erfindung beschreibt ein Verfahren zum Bestimmen der Orientierung einer Kamera (240) relativ zu einer Referenzebene (261). Das Verfahren umfasst folgende Schritte: Erfassen einer optischen Verschiebung (268) einer i9n der Referenzebene (261) ausgebildeten Referenzstruktur (262), wobei die optische Verschiebung (268) durch ein refraktives optisches Element (265) verursacht wird, welches zwischen der Kamera (240) und der Referenzstruktur (262) angeordnet ist, und Ermitteln der Orientierung der Kamera (240) relativ zu der Referenzebenen (261), basierend auf der erfassten optischen Verschiebung (268), mittels einer Auswerteeinheit. Die optische Verschiebung kann durch die sequentielle Aufnahme von zwei Kamerabildern erfolgen, wobei zwischen der Aufnahme eines ersten und des zweiten Kamerabildes das refraktive optische Element (265) zwischen die Referenzstruktur (262) und die Kamera (240) eingebracht wird. Die optische Verschiebung (268) kann auch durch Auswertung eines einzigen Kamerabildes ...

Bestückungsmaschine mit Bauteilplazierungskontrolle

Bestückungsmaschine zur Plazierung eines Bauteils auf einem Werkstück, wobei die Maschine aufweist: einen Plazierungskopf mit mindestens einer Düse zum lösbaren Halten des Bauteils; ein Robotersystem zur Erzeugung einer Relativbewegung zwischen dem Plazierungskopf und dem Werkstück; eine erste Bilderfassungsvorrichtung, die angeordnet ist, um eine erste Ansicht eines Bildes zuvor eines beabsichtigten Plazierungsorts vor der Plazierung des Bauteils und eine erste Ansicht eines Bildes danach des beabsichtigten Plazierungsorts nach der Plazierung des Bauteils zu erhalten; eine zweite Bilderfassungsvorrichtung, die angeordnet ist, um eine zweite Ansicht eines Bildes zuvor eines beabsichtigten Plazierungsorts vor der Plazierung des Bauteils und eine zweite Ansicht eines Bildes danach des beabsichtigten Plazierungsorts nach der Plazierung des Bauteils zu erhalten; und wobei die ersten und zweiten Ansichten voneinander beabstandet sind, um eine Stereosicht-Kontrolle des beabsichtigten Plazierungsorts ...

Kalibrierungsverfahren für Bestückungsmaschinen mit On-head-Linescan-Erfassung

Component mounting machine

A component mounting machine, including a component transfer device, having a component mounting tool configured to collect and mount a component, a mounting head configured to hold the component mounting tool, and a head driving mechanism configured to horizontally drive the mounting head, which performs a mounting work of mounting the component collected from a component supply device on a predetermined coordinate position of a board carried in and positioned by a board conveyance device, and a control device configured to control the mounting work, and configured to implement a thermal correction process for reducing an influence on mounting accuracy of the component, of which influence being caused by thermal deformation due to a temperature change in at least one of the head driving mechanism and the mounting head.

Automated apparatus and method for positioning multicontact component

MOUNTING DEVICE AND MOUNTING METHOD

A mounting device for executing a mounting process of mounting a component on a board includes: a mounting head that includes at least one pickup section for picking up the component and moves the picked up component; a storage section configured to store at least a first correction value determined at a first position on XYZ axes on which the mounting head works and a second correction value determined at a second position different from the first position; and a control section configured to execute the mounting process by using the first correction value and/or the second correction value stored in the storage section.

ERKENNUNGSPARAMETEROPTIMIERUNGSVORRICHTUNG, KOMPONENTENMONTIER-SYSTEM UND ERKENNUNSPARAMETEROPTIMIERUNGSVERFAHREN

Es werden Bilddaten Dp, die bezogen werden, indem eine Komponente P bei einer Komponentenerkennung (Schritt S102) aufgenommen wird, wenn der Komponentenmontierer 10 die Komponente P auf der Platte B montiert, in einem Speicher 92 gespeichert (Schritt S103), und es wird eine luminanzbezogene Bedingung auf Grundlage der Bilddaten Dp optimiert (Schritte S201, S301 bis S311). Daher kann eine passende luminanzbezogene Bedingung entsprechend der gerade zu montierenden Komponente P bezogen werden.

Method of manufacturing electronic components including a method for three dimensional inspection

A calibration and part inspection method for the inspection of ball grid array, BGA, devices. One or more cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into the camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution. The reticle with the pattern mask is removed after calibration and the BGA to be inspected is placed with the balls facing downward, in such a manner as to be imaged by a single camera, or optionally, via additional cameras. The scene of the part can thus be triangulated and the ...

METHOD AND DEVICE FOR THE PLACEMENT OF ELECTRONIC COMPONENTS

A method for placing electronic components onto a circuit board, comprising the following steps: Placing a component to be placed of a first component type into a starting position; creating a component image of the component to be placed in the starting position; creating a circuit board region image of a circuit board of a first circuit board region type; calculating a travel path for moving the component to be placed into a final position on the circuit board based upon an image overlay of the component image and a previously saved reference component image of a reference component of the first component type, and based upon a previously saved reference travel path of the reference component from a reference starting position into a reference final position on a reference circuit board of the first circuit board region type, and based upon an image overlay of the circuit board region image and a previously saved reference circuit board region image of the reference circuit board; moving ...

Zero-point setting and adjusting device for circuit board electrical components equipping device, uses video units to specifically generate coordinate signals for alignment of reference points

Simultaneous adjustment and setting of the zero point marking of first and second module heads (30,40) installed in the dual (X-Y) portal (100) of a circuit-board equipping device is carried out via first (50) and second (60) linear motors of the X-Y portal for the X-axis, and via first (70) and second (80) linear motors for the Y-axis, and in which the X-Y plane has a first reference point (A) and a second reference point (B), as well as a zero point marking (O), established on it. First and second video units (10;20) specifically generate corresponding coordinate signals when the reference points (A;B) and the zero point markings (O) are centrally aligned.

Pick and place machine with component placement inspection

Improved component placement inspection and verification is performed by a pick and place machine. Improvements include stereovision imaging of the intended placement location; enhanced illumination to facilitate the provision of relatively high-power illumination in the restricted space near the placement nozzle(s); optics to allow image acquisition device to view the placement location from an angle relative to a plane of the placement location, thereby reducing the possibility of such images being obstructed by the component; techniques for rapidly acquiring images with commercially available CCD arrays such that acquisition of before and after images does not substantially impact system throughput; and image processing techniques to provide component inspection and verification information.

Surface mounter and method of correcting recognition error

A surface mounter for mounting an electronic component on a printed circuit board includes a stage, a mounter, a camera, a mark, and a controller. The mounter is movable in a plane direction of the stage and mounts the electronic component on the printed circuit board. The camera is on the stage or mounter, and the mark is on the other of the stage or mounter. The controller executes processing to capture images of the mark at multiple positions in a field of view of the camera and perform image recognition; calculate correction values for correcting recognition errors at the recognition positions based on recognition of the mark; capture an image of the printed circuit board or the electronic component by the camera and perform image recognition; and correct results of the recognition of the printed circuit board or the electronic component based on the correction values.

Testmittel zur Qualifizierung von optischen Erkennungssystemen sowie Verfahren zur Herstellung und Anwendung desselben

Testmittel zur Qualifizierung von bei der Leiterplattenbestückung mit Bauelementen eingesetzten optischen Erkennungssystemen, aufweisend eine Testplatte (11) mit einer Trägerplatte (20), die mit Bauelementen (15) in einer vorgegebenen Anordnung bestückt ist, wobei die Ist-Geometrie der Testplatte (11) im Vergleich zur Messgenauigkeit der zu qualifizierenden optischen Erkennungssysteme genauer vermessen ist, dadurch gekennzeichnet, - dass auf einem Datenträger die Messdaten der genaueren Vermessung der Testplatte (11) gespeichert sind und - mit der vorgegebenen Anordnung der Bauelemente Montagefehler vorgegeben sind und auf dem oder einem anderen Datenträger Referenzdaten einer die vorgegebenen Montagefehler nicht berücksichtigenden Soll-Geometrie der Testplatte (11) gespeichert sind.

3D Inspektion elektronischer Pins mit einem optischen Element, welches auf der Oberseite einer transparenten Markenplatte angeordnet ist

Reference position determining method and apparatus for electronic component mounting

In a printing apparatus, individual positional data for positions of four object marks provided on a plurality of FPCs held on a conveyance tray are acquired by a mark position acquisition section based on an image acquired by an image acquisition unit. In a displaced mark specifying section, relative positional relations of four object marks are determined, and compared with a reference positional relation, by which a displaced object mark is specified. Then, in a reference position determining section, a reference position for a plurality of FPCs on a conveyance tray is determined based on a plurality of object marks resulting from excluding the displaced object mark out of the four object marks. Thus, a reference position in execution of printing in a printing unit can be determined with high precision.

Placement accuracy gauge for electrical components and method of using same

Surface mounted electrical components are typically assembled on printed wiring boards by automatic machines. It is important that the machines accurately move with respect to both X and Y rotational axes in order to insure that components are positioned precisely on connector pads of the printed wiring board being assembled. In accordance with the instant invention, a gauge is used to facilitate convenient accuracy checks. The gauge is a glass substrate on which grids of 0.005 inch lines are scribed to form location and orientation fields where components are to be placed. The grids are referenced from either fiducial marks or the edge of the substrate to establish known positions within the grids. The equipment to be evaluated is programmed to place components in known positions and the components are held in place by tacky adhesive that is sprayed on the substrate prior to placing the components. The accuracy of the component position is then compared to the programmed position by placing ...

Bestimmen der Genauigkeit einer Bestückmaschine bei mehrfacher Verwendung eines Test-Bauelements

Beschrieben wird ein Verfahren zum Bestimmen der Bestückgenauigkeit einer Bestückmaschine (100) sowie eine Bestückmaschine. Das Verfahren weist auf (a) Einbringen einer Referenzplatte (280) in einen Bestückbereich der Bestückmaschine, wobei die Referenzplatte eine Mehrzahl von Referenzmarkierungen (282) aufweist; (b) Aufgreifen eines Test-Bauelementes (290) von einem Bestückkopf (130); (c) Platzieren des aufgegriffenen Test-Bauelementes an einer Test-Bestückposition auf der Referenzplatte unter Verwendung des Bestückkopfes; (d) Ermitteln einer Ist-Position des platzierten Test-Bauelementes unter Berücksichtigung der Position von zumindest einer Referenzmarkierung mittels einer Kamera und einer der Kamera nachgeschalteten Auswerteeinheit (160); (e) erneutes Aufgreifen des platzierten Test-Bauelementes von dem Bestückkopf; (f) erneutes Platzieren des erneut aufgegriffenen Test-Bauelementes, nun an einer weiteren Test-Bestückposition, auf der Referenzplatte unter Verwendung des Bestückkopfes ...

Camera position-correcting method and system and dummy component for use in camera position correction

There are provided a method and device for correcting a camera position, and a dummy component for use in camera position correction. A board-sensing camera for sensing a position of a circuit board is caused to take an image of a dummy component in an attitude-fixed state in a first coordinate system peculiar to a board-sensing camera. A component-sensing camera for sensing a position of an electronic component to be mounted on the circuit board is caused to take an image of the dummy component in an attitude-fixed state in a second coordinate system peculiar to a component-sensing camera. An amount of deviation of a center of the dummy component from a sensing center of the board-sensing camera and an amount of deviation of the center of the dummy component from a sensing center of the component-sensing camera are calculated from results of the taking of the image of the dummy component by the board-sensing camera and results of the taking of the image of the dummy component by the component-sensing ...

Process for compensating for the position of a camera in a chip mount system and process for mounting chips using the compensation method

Disclosed is a process for mounting chips exactly on a PCB without making a camera coordinate system coincide with a table coordinate system of a rotary-type chip mount system. The process comprises the steps of reading positional difference and angular difference between a camera coordinate system and a table coordinate system as values in the camera coordinate system by means of a jig nozzle, transforming the values to those of the table coordinate system, and using the transformed values as compensation data when mounting chips on PCB.

Method of manufacturing ball array devices using an inspection apparatus having two or more cameras and ball array devices produced according to the method

A calibration and part inspection method for the inspection of ball grid array, BGA, devices. Two cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A first camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into a second camera and a second additional mirror or prism located below the bottom plane of the reticle reflects the opposite side view of the reticle pattern mask through prisms or mirrors into a second camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution. The reticle with the pattern mask is removed after calibration and the BGA to be inspected ...

3D Inspektion elektronischer Pins mit einem optischen Element, welches auf der Oberseite einer transparenten Markenplatte angeordnet ist

VERFAHREN ZUM BETRIEB EINES BESTÜCKAUTOMATEN, BESTÜCKAUTOMAT, AUSWECHSELBARE KOMPONENTE FÜR EINEN BESTÜCKAUTOMATEN UND SYSTEM AUS EINEM BESTÜCKAUTOMATEN UND EINER AUSWECHSELBAREN KOMPONENTE

METHOD OF CALIBRATING A DISPENSER

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.

METHOD OF CALIBRATING A DISPENSER

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.

COMPONENT MOUNTING MACHINE AND COMPONENT MOUNTING METHOD

A component mounting machine including: a moving device configured to move between a component supply position and a circuit board; a mounting head provided on the moving device and configured to pick up a component supplied to the component supply position and mount the picked-up component on the circuit board; a component camera configured to image the component held by the mounting head from below the mounting head; a board camera provided on the moving device and configured to image the circuit board from above; an imaging position memory section configured to memorize imaging position coordinates that are position coordinates of the moving device during imaging by the component camera, based on image data acquired by imaging of the mounting head by the component camera; a relative position memory section configured to memorize relative position coordinates that are a relative position of the mounting head with respect to the board camera; and a correction necessity determining section configured to perform imaging of the mounting head by the component camera when the moving device has arrived at the imaging position coordinates, and determine whether it is necessary to correct the relative position coordinates memorized in the relative position memory section, based on a position of the mounting head understood from image data acquired from the imaging.

METHOD OF CALIBRATING A DISPENSER

Component mounting apparatus and method

A component mounting apparatus includes a component holding and conveying device for holding and conveying a component and mounting the component onto a circuit board, a circuit board holding device for holding the circuit board, an image recognition optical system for performing recognition of the component and the circuit board with different fields of view, respectively, and a control section. The control section repeatedly determines an optical axis shift amount with the two fields of view between a position of the component and a position of the circuit board recognized by the image recognition optical system. Based on these determination results, the control section determines an optical axis shift amount for calibration, wherein calibration of the image recognition optical system is performed based on the optical-axis shift amount for calibration determined by the control section. Then, the component is mounted onto the circuit board.

Apparatus for adjusting the origins of module heads of a surface mounting apparatus and method therefor

There is disclosed an apparatus for adjusting the origins of module heads of a surface mounting apparatus for a dual gantry, the adjusting apparatus, and method therefor. The invention includes the X-Y gantry consisting of first and second X-axis linear motors and first and second Y-axis linear motors, and having X-Y plane on which first and second reference points and a mark indicating the origin (MIO) are set, first and second module heads installed at the first a nd second X-axis linear motors, first and second vision units installed in vicinity of the first and second module heads, respectively, and for sensing the first and second reference points and the MIO and generating and outputting coordinates of the sensed first and second reference points and the MIO, and a controller for driving the first and second X-axis linear motors and the first and second Y-axis linear motors to move the first and second vision units to the first and second reference points and the MIO, receiving the ...

PRÜFVERFAHREN, PRÜFSYSTEM UND PROGRAMM

Es wird eine Technik bereitgestellt, die die Wahl der Prüfpunkte und/oder der Prüfstandards, die im Herstellungsprozess angewendet werden, leicht gestaltet und im Herstellungsprozess eine Anwendung von passenden Prüfpunkten und/oder Prüfstandards ermöglicht. Ein Prüfverfahren, das durch ein Prüfprogramm eine Prüfung eines Artikels, der mit Komponenten versehen ist, vornimmt, umfasst einen Festlegeschritt (S101), bei dem für die einzelnen Komponenten Prüfinformationen, die Prüfpunkte und/oder Prüfstandards enthalten, festgelegt werden; und einen Bestimmungsschritt (S106), bei dem die Qualität des Artikels bestimmt wird, wobei die Prüfinformationen bei dem Festlegeschritt auf Basis einer Bauteilnummerdatengruppe festgelegt werden und in dem Bestimmungsschritt die Qualität für jede Komponente auf Basis der Prüfinformationen, die unter Bezugnahme auf die Bauteilnummerdatengruppe erlangt werden, bestimmt wird, wobei das Verfahren ferner einen Bezugsdatenaktualisierungsschritt (S114) umfasst, bei dem die Bauteilnummerdatengruppe, auf die das Prüfprogramm Bezug nimmt, aktualisiert wird, wobei bei dem Bezugnahmedatenaktualisierungsschritt eine Aktualisierung zu einer neuesten Bauteilnummerdatengruppe erfolgt, während bestimmte Prüfinformationen in der Bauteilnummerdatengruppe eine bestimmte Bedingung erfüllen.

Pick and place machine with component placement inspection

Improved component placement inspection and verification is performed by a pick and place machine. Improvements include stereovision imaging of the intended placement location; enhanced illumination to facilitate the provision of relatively high-power illumination in the restricted space near the placement nozzle(s); optics to allow image acquisition device to view the placement location from an angle relative to a plane of the placement location, thereby reducing the possibility of such images being obstructed by the component; techniques for rapidly acquiring images with commercially available CCD arrays such that acquisition of before and after images does not substantially impact system throughput; and image processing techniques to provide component inspection and verification information.

Method of calibrating a dispenser

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.

OPTISCHES SYSTEM ZUR BAUELEMENT/-TRÄGER-JUSTIERUNG

Kontrolleinrichtung und Verfahren zum Überprüfen von optischen Abtastvorrichtungen für Werkstücke in einer Montageeinrichtung für elektrische Baugruppen

Eine Kontrolleinrichtung (14) zum Überprüfen von optischen Abtastvorrichtungen (10, 12) in einer Montagelinie für elektrische Baugruppen ist einer solchen Baugruppe nachgebildet und wird wie eine solche sukzessive einzelnen Bestückplätzen (7) mit den Abtastvorrichtungen (10, 12) zugeführt. Die Kontrolleinrichtung (14) trägt Kontrollelemente (15) mit Vergleichsflächen, die den Werkstücken entsprechende optische Eigenschaften aufweisen. Aus Vergleichsmessungen an den verschiedenen Bestückplätzen (7) werden Korrekturwerte für Beleuchtungseinrichtungen der Abtastvorrichtungen (10, 12) ermittelt und den jeweiligen Steuereinrichtungen zugeordnet.

AUSWAHL VON REFERENZMARKEN ZUR SCHNELLSCHÄTZUNG DER POSITION EINES BILDAUFNAHMEGERÄTS

OPERATION MACHINE

BASE BOARD OPERATION SYSTEM

A board work system including ark arrangement members, on which are arranged multiple marks that have a specified relative positional relationship, are arranged straddling first work area in which first work head moves and second work area in which second work head moves, and, when performing work with respect to a board, which is a single board held by a board holding device in a state straddling the first work area and the second work area, based on positions of the marks in first work area measured based on image data of first imaging device that is moved along with the first work head and positions of the marks in second work area measured based on image data of second imaging device that is moved along with the second work head.

SYSTEM FOR MONITORING OUTSIDE WORK AREA OF COMPONENT MOUNTING MACHINE

A component mounting includes an external monitoring camera that images an outside work area that is an area outside of the component mounting machine at which an operator performs work with respect to the component mounting machine. The outside work area of the component mounting machine includes at least an area where a feeder is set, and a monitoring target is at least a state during and after completion of setting the feeder on the component mounting machine and during and after completion of setting component supply tape on the feeder. By looking at a recorded image or a real time image displayed on a display device by using the external monitoring camera to capture an outside work area of the component mounting machine, it is possible to check the state of the monitoring target on which an operator performed work in the outside work area of the component mounter.

Dummy template determining tolerances when populating circuit boards

The transparent body (1) carries machine-readable codes on its top or base, determining position. It is protected in a casing (2) so constructed, that it can be adhered to the board.

BOARD INSPECTING APPARATUS AND BOARD INSPECTING METHOD USING THE SAME

The board inspecting apparatus include a measuring section obtaining measurement data for at least a portion of a board, a processing section comparing the measurement data and pre-obtained reference data, based on feature objects set on the board, to perform warpage compensation and inspecting the board with warpage compensated, a display section displaying ranges adjusting a first level of an inspection speed and a second level of a precision of the warpage compensation, and an input section receiving, from a user, inputs for the first and second levels as a specific setting combination having a trade-off relationship. The processing section, when the inspection speed and the precision are established, designates a specific option corresponding to the inspection speed and the precision among options increasing the precision so that the specific option is applied. Thus, users' convenience may be improved, and users may easily set options for distortion compensation.

OPERATION MACHINE

If the moving direction of a suction nozzle during raising and lowering deviates from a vertical direction, appropriate work cannot be guaranteed because the holding position of a component by the suction nozzle will vary depending on the holding height of the component by the suction nozzle. Thus, a component loaded at a specified height (H) position from the upper surface of a stage is held by a suction nozzle, and that component is loaded at a specified position. Then, the component is imaged and the loading position (first height component loading position) of the component is calculated. Further, the component loaded on the stage is held by the suction nozzle and the component is loaded at the above specified position. Then, the component is imaged and the component loading position (second height component loading position) is calculated. Next, the deviation amount between the first height component loading position and the second height component loading position is calculated. Thus ...

Platziervorrichtung und Platzierverfahren zum lagegenauen Ausrichten und /oder Bestücken eines Substrates mit einem Bauelement

Die Erfindung betrifft eine Platziervorrichtung zum lagegenauen Ausrichten und / oder Bestücken eines Substrates (1) mit mindestens einem dazu komplementären Bauelement (2), mit einer ersten Haltevorrichtung (10) für das mindestens eine Bauelement (2) oder das Substrat (1) am freien Ende eines um eine Schwenkachse (A) schwenkbaren Hebelarms (11), einer zweiten Haltevorrichtung (3) für das jeweils komplementäre Substrat (1) oder Bauelement, gekennzeichnet durch a) eine erste optische Achse (32) einer ersten Kameravorrichtung (31), die auf die erste Haltevorrichtung (10) mit mindestens einem Bauelement (1) oder einem Substrat (2) ausgerichtet ist, und b) eine zweite optische Achse (34) einer zweiten Kameravorrichtung (33), die auf die zweite Haltevorrichtung (20) mit dem jeweils komplementären Substrat oder Bauelement (1, 2) ausgerichtet ist, und durch c) eine Lageauswertungsvorrichtung (50) zur Erstellung eines Ausgabedatensatzes (41) aus einer Verarbeitung der Bilder der Kameravorrichtungen ...

Electronic component products and method of manufacturing electronic component products

A calibration and part inspection method for the inspection of ball grid array, BGA, devices. Two cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A first camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into a second camera and a second additional mirror or prism located below the bottom plane of the reticle reflects the opposite side view of the reticle pattern mask through prisms or mirrors into a second camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution. The reticle with the pattern mask is removed after calibration and the BGA to be inspected ...

Pick and place machine with component placement inspection

Improved component placement inspection and verification is performed by a pick and place machine. Improvements include stereovision imaging of the intended placement location; enhanced illumination to facilitate the provision of relatively high-power illumination in the restricted space near the placement nozzle(s); optics to allow image acquisition device to view the placement location from an angle relative to a plane of the placement location, thereby reducing the possibility of such images being obstructed by the component; techniques for rapidly acquiring images with commercially available CCD arrays such that acquisition of before and after images does not substantially impact system throughput; and image processing techniques to provide component inspection and verification information.

Three-dimensional surface structure inspection device e.g. for surface mount technology (SMT) circuit board solder application

An inspection device examines three-dimensional surface structures of mainly flat test items (3) by means of a camera (8). An optical sensor (7) is provided for carrying out three-dimensional detection of at least a part-zone of the test item surface, with the sensor (7) and the camera (8) combined in a sensor unit (6). A calibration mark (16) is fixed on the inspection device independent of the test-item (3) and enables the position of the camera (8) and the optical sensor (7) to be determined after photographing an object or after measuring the calibration mark (16).

Phantom component item for use in circuit boards' automatic equipping machines

A phantom or dummy component (1) having an array of connection terminals of an actual component simulated by locations (8) on its bottom face, the locations corresponding in size and geometry to the terminals of an actual component, and differing in certain reflection characteristics from the background of the bottom face. At least part of the locations (8) specifically have a different reflection characteristic from the remaining locations or more specifically, groups (4-7) of adjacent locations (8) have different reflection characteristics.

Electronic component products made according to a process that includes a method for three dimensional inspection

A calibration and part inspection method for the inspection of ball grid array, BGA, devices. One or more cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into the camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution. The reticle with the pattern mask is removed after calibration and the BGA to be inspected is placed with the balls facing downward, in such a manner as to be imaged by a single camera, or optionally, via additional cameras. The scene of the part can thus be triangulated and the ...

Inspection method, inspection system and program

本發明在於容易選擇生產步驟中所應用的檢查項目及/或檢查基準，且能夠將恰當的檢查項目及/或檢查基準應用於生產步驟中。一種檢查方法，其藉由檢查程式來進行搭載有零件的物品的檢查，包括：設定步驟（S101），針對每個零件來設定包含檢查項目及/或檢查基準的檢查資訊；以及判定步驟（S106），藉由檢查程式來判定物品的品質，於設定步驟中，基於產品編號資料群來設定檢查資訊，於判定步驟中，基於參照產品編號資料群而獲得的檢查資訊，針對每個所述零件來判定品質，且進而包括參照資料更新步驟（S114），更新檢查程式參照的產品編號資料群，於參照資料更新步驟中，將產品編號資料群中的規定的檢查資訊在滿足規定條件的範圍內更新為最新的產品編號資料群。

Machine suitable for placing a component on a substrate, as well as a method therefor

Machine ( 1 ) comprising a placement element ( 7 ) connected to an imaging device ( 6 ), and comprising an optical system ( 4 ) for detecting the position of a component ( 16 ) relative to the placement element ( 7 ) by means of the imaging device ( 6 ). The optical system ( 4 ) comprises at least one marking element ( 11 ). The marking element ( 11 ) and the component ( 16 ) can be displayed simultaneously by means of the optical system ( 4 ) in an image ( 17 ) to be made by means of the imaging device ( 6 ).

Base board operation system

A board work system including ark arrangement members, on which are arranged multiple marks that have a specified relative positional relationship, are arranged straddling first work area in which first work head moves and second work area in which second work head moves, and, when performing work with respect to a board, which is a single board held by a board holding device in a state straddling the first work area and the second work area, based on positions of the marks in first work area measured based on image data of first imaging device that is moved along with the first work head and positions of the marks in second work area measured based on image data of second imaging device that is moved along with the second work head.

Method and apparatus for three dimensional inspection of electronic components

A three dimensional inspection method for inspecting ball array devices having a plurality of balls, where the ball array device is positioned in an optical system. The inspection method includes the steps of illuminating at least one ball on the ball array device, and disposing a sensor, a first optical element and a second optical element in relation to the ball array device so that the sensor obtains at least two differing views of the at least one ball, the sensor providing an output representing the at least two differing views. The output is processed using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane.

BASE BOARD OPERATION SYSTEM

SUBSTRATE WORKING DEVICE AND IMAGE PROCESSING METHOD

A substrate working device including: an imaging device configured to image a substrate; a memory device configured to memorize various information; and an image processing device configured to perform, when specified work is performed with respect to multiple substrates, for a leading substrate, leading-substrate processing of performing imaging processing for detecting a specified detection target required for the specified work with respect to a leading image obtained by imaging the leading substrate using the imaging device, acquiring region information related to a region in the leading image in which the detection target was detected, and memorizing the region information in the memory device, and, for subsequent substrates except for the leading substrate, subsequent-substrate processing of setting a partial processing region in a subsequent image of the subsequent substrate captured by the imaging device based on the region information, and performing the image processing with respect to the set processing region. 1. A substrate working device comprising:an imaging device configured to image a substrate;a memory device configured to memorize various information; andan image processing device configured to perform, for a leading substrate among multiple of the substrates that are a target for specified work, leading-substrate processing of performing imaging processing for detecting a specified detection target required for the specified work with respect to a leading image obtained by imaging the leading substrate using the imaging device, acquiring region information related to a region in the leading image in which the detection target was detected, and memorizing the region information in the memory device, and, for subsequent substrates among the multiple of the substrates that are the target for specified work except for the leading substrate, subsequent-substrate processing of setting a partial processing region in a subsequent image of the subsequent ...

BOARD INSPECTING APPARATUS AND BOARD INSPECTING METHOD USING THE SAME

The board inspecting apparatus include a measuring section obtaining measurement data for at least a portion of a board, a processing section comparing the measurement data and pre-obtained reference data, based on feature objects set on the board, to perform warpage compensation and inspecting the board with warpage compensated, a display section displaying ranges adjusting a first level of an inspection speed and a second level of a precision of the warpage compensation, and an input section receiving, from a user, inputs for the first and second levels as a specific setting combination having a trade-off relationship. The processing section, when the inspection speed and the precision are established, designates a specific option corresponding to the inspection speed and the precision among options increasing the precision so that the specific option is applied. Thus, users' convenience may be improved, and users may easily set options for distortion compensation.

COMPONENT MOUNTING MACHINE

A component mounting machine, including a component transfer device, having a component mounting tool configured to collect and mount a component, a mounting head configured to hold the component mounting tool, and a head driving mechanism configured to horizontally drive the mounting head, which performs a mounting work of mounting the component collected from a component supply device on a predetermined coordinate position of a board carried in and positioned by a board conveyance device, and a control device configured to control the mounting work, and configured to implement a thermal correction process for reducing an influence on mounting accuracy of the component, of which influence being caused by thermal deformation due to a temperature change in at least one of the head driving mechanism and the mounting head. 1. A component mounting machine comprising:a component transfer device, having a component mounting tool configured to collect and mount a component, a mounting head configured to hold the component mounting tool, and a head driving mechanism configured to horizontally drive the mounting head, which performs a mounting work of mounting the component collected from a component supply device on a predetermined coordinate position of a board carried in and positioned by a board conveyance device, anda control device configured to control the mounting work, and configured to implement a thermal correction process for reducing an influence on mounting accuracy of the component, of which influence being caused by thermal deformation due to a temperature change in at least one of the head driving mechanism and the mounting head, wherein the control device includes:an implementation timing determination section configured to determine an implementation timing of the thermal correction process, based on a required level of the mounting accuracy or in consideration of a change timing in which an implementation state of the mounting work changes with the ...

COMPONENT MOUNTING MACHINE

A component mounting machine including a camera configured to capture an image of a component held by a suction nozzle; and an image processing section configured to process the image captured by the camera, recognize the shape of the component, and measure shape data of the component; wherein, when the deviation amount of the measurement value of the shape data of the component exceeds the allowable value, the deviation amount of the measurement value of the shape data of the component is compared to a retry determination that is larger than the allowance value, and if the deviation amount of the measurement value of the shape data of the component exceeds the retry determination value, the component is determined to be abnormal and is discarded to a specified discard location. 17.-. (canceled)8. A component mounting machine comprising:a camera configured to capture an image of a component held by a suction nozzle;an image processing section configured to process the image captured by the camera, recognize a shape of the component, and measure shape data of the component; anda control section configured to control operation of mounting the component on a circuit board in a case of determining that the component is normal based on whether a deviation amount of a measurement value of the shape data of the component is within a specified allowable value by comparing the measurement value of the shape data of the component measured by the image processing section with image-processing-use component shape data,whereinthe control section is configured to compare the deviation amount of the measurement value of the shape data of the component when the deviation amount of the measurement value of the shape data of the component exceeds the allowable value to a retry determination value that is larger than the allowable value, and (1) determine the component is abnormal and discard the component to a specified discard location if the deviation amount of the measurement ...

Temperature measurement and ambient light measurement in the case of self-luminous display technologies in automotive applications

A display device with self-luminous display elements, which are arranged in a panel. The panel is provided, on its rear side opposite the light-emitting surface used for display, with a heat distribution element, on the side of which facing away from the rear side at least one temperature sensor is arranged. The heat distribution element has at least one opening, behind which a light sensor is arranged, wherein the light sensor and the temperature sensor are arranged on a common carrier.

How to check the placement of parts

Board inspection apparatus and board inspection method using the same

기판 검사장치는, 측정 데이터를 획득하는 측정부, 복수의 특징객체들을 기초로 기판의 워피지 보상을 수행하고 워피지가 보상된 기판을 검사하는 처리부, 워피지 보상에 따른 검사속도의 제1 레벨 및 워피지 보상의 정밀도의 제2 레벨을 조절하기 위한 범위들을 디스플레이하는 디스플레이부, 및 사용자로부터, 검사속도의 제1 레벨 및 정밀도의 제2 레벨을, 트레이드-오프 관계의 특정한 세팅 조합으로서 입력받는 입력부를 포함한다. 처리부는, 검사속도 및 정밀도가 설정될 때, 워피지 보상의 정밀도를 향상시키기 위한 복수의 옵션들 중에서, 설정된 검사속도 및 정밀도에 상응하는 특정 옵션이 적용되도록 지정한다. 이에 따라, 사용자의 편의성을 향상시킬 수 있고, 사용자가 왜곡 보상을 위한 옵션들을 용이하게 설정할 수 있다. The substrate inspection apparatus includes a measurement unit for acquiring measurement data, a processing unit for performing a warpage compensation of a substrate based on a plurality of characteristic objects and inspecting a substrate on which a warp is compensated, And a display unit for displaying ranges for adjusting a second level of the precision of the warp compensation and for receiving from the user a first level of inspection speed and a second level of precision as a specific set combination of trade- And an input unit. The processing unit specifies that, when the inspection speed and the precision are set, a specific option corresponding to the set inspection speed and precision is applied among the plurality of options for improving the accuracy of the warp compensation. Accordingly, the convenience of the user can be improved, and the user can easily set options for distortion compensation.

Module head zero point adjusting device of surface mounting device and a zero point adjusting method thereof

본 발명은 듀얼 갠트리(dual gantry)가 적용된 표면실장장치에서 각각의 갠트리의 모듈 헤드의 원점을 동시에 조정할 수 있는 모듈 헤드 원점조정장치 및 방법에 관한 것이다. The present invention relates to a module head origin adjustment device and method that can simultaneously adjust the origin of the module head of each gantry in a surface mounting device to which a dual gantry is applied. 상기 본 발명은 복수의 모듈 헤드를 X/Y축 평면상으로 이동시키기 위해 복수의 X축 구동장치와 복수의 Y축 구동장치를 구비한 듀얼 X-Y 갠트리와, 복수의 Y축 구동장치 중 하나와 복수의 X축 구동장치에 각각 설치되어 복수의 X축 구동장치의 Y축 원점좌표를 감지하는 복수의 원점센서와, 복수의 원점센서에 의해 복수의 모듈 헤드의 Y축 원점을 감지함과 동시에 상기 복수의 X축 구동장치와 동시에 이동되도록 설치된 듀얼 X-Y 갠트리의 프레임에 설치된 원점마크를 감지하여 X축 원점을 감지하는 복수의 비젼장치로 구성되는 것을 특징으로 한다. The present invention provides a dual XY gantry having a plurality of X-axis drives and a plurality of Y-axis drives, and one of the plurality of Y-axis drives to move the plurality of module heads on the X / Y axis plane. A plurality of origin sensors respectively installed at the X-axis driving apparatuses for detecting the Y-axis origin coordinates of the plurality of X-axis driving apparatuses, and the Y-axis origins of the plurality of module heads are sensed by the plurality of origin sensors. It is characterized by consisting of a plurality of vision device for detecting the origin of the X-axis by detecting the origin mark installed on the frame of the dual XY gantry installed to move simultaneously with the X-axis drive of the. 상기 본 발명에서는 복수의 비젼장치를 이용하여 듀얼 갠트리에 적용된 복수의 모듈 헤드의 원점을 동시에 조정할 수 있으며 원점조정장치의 반복 정밀도를 향상시킬 수 있는 이점이 있다. In the present invention, it is possible to simultaneously adjust the origin of the plurality of module heads applied to the dual gantry using a plurality of vision devices, and there is an advantage of improving the repeatability of the origin adjustment device.

Recognition parameter optimization device, component mounting system, and recognition parameter optimization method

在元件安装机(10)将元件(P)安装于基板(B)时，在元件识别(步骤S102)中通过对该元件(P)进行拍摄而取得的图像数据(Dp)被存储于存储部(92)(步骤S103)，并基于该图像数据(Dp)使亮度关联条件最优化(步骤S201、S301～S311)。因此，能够取得与实际成为元件安装的对象的元件(P)相应的适当的亮度关联条件。

Method for correcting camera deviation angle of chip mount system

노즐의 단부에 직육면체 지그를 구비한 지그노즐을 마운트헤드에 그 측면은 XY 테이블좌표계의 y축과 평행하기 취부하고, 그지그노즐을 카메라로 촬영하여 카메라 좌표계와 지그노즐의 틀어진 각을 산출하고, 기준노즐을 촬영하여 상기 지그노즐의 틀어진 각을 이용하여 기준노즐의 중심좌표를 XY테이블 좌표로 변환하고, 노즐에 부품을 흡착한 상태에서 카메라로 촬영하여 그 부품의 중심좌표및 틀어진 각을 산출한후, XY테이블 좌표계로 변환된 상기 기준노즐의 중심좌표와 상기 부품의 중심좌표를 XY테이블 좌표계로 변환한 좌표를 더하여 XY테이블이 이동할 거리를 산출한다. Mount a jig nozzle with a cuboid jig at the end of the nozzle to the mount head, the side of which is parallel to the y axis of the XY table coordinate system, and photograph the jig nozzle with a camera to calculate the twisted angle of the camera coordinate system and the jig nozzle, Taking a reference nozzle and converting the center coordinates of the reference nozzle to XY table coordinates using the misaligned angles of the jig nozzles, and calculating the center coordinates and the distorted angles of the components by photographing the camera with the parts adsorbed on the nozzle. Thereafter, the coordinates obtained by converting the center coordinates of the reference nozzle converted into the XY table coordinate system and the coordinates obtained by converting the center coordinates of the component into the XY table coordinate system are calculated to calculate the distance to which the XY table moves.

Recognition parameter optimization device, component mounting system, recognition parameter optimization method

部品実装機１０が基板Ｂに部品Ｐを実装する際に部品認識（ステップＳ１０２）で当該部品Ｐを撮像することで取得された画像データＤｐが記憶部９２に記憶され（ステップＳ１０３）、この画像データＤｐに基づき輝度関連条件が最適化される（ステップＳ２０１、Ｓ３０１〜Ｓ３１１）。したがって、実際に部品実装の対象となった部品Ｐに応じた適切な輝度関連条件を取得することが可能となる。 When the component mounting machine 10 mounts the component P on the substrate B, the image data Dp acquired by imaging the component P in the component recognition (step S102) is stored in the storage unit 92 (step S103), and this image. The brightness-related conditions are optimized based on the data Dp (steps S201, S301 to S311). Therefore, it is possible to acquire appropriate luminance-related conditions according to the component P that is actually the target of component mounting.

Work machine

Method and apparatus for calibrating the moving distance and / or angular position of a holding device provided in a manufacturing apparatus for an electrical component group, and a calibration substrate

(57)【要約】 公知の方法は、電気的な構成群の製作装置に設けられた保持装置の移動距離及び／又は角度位置を、校正基板（１）に装着された電気的な校正素子モデル（２）の位置を光学的に測定することによって校正する。このためには、モデル（２）上のマーキング（４）と、校正基板（１）上の局所的な基準マーク（３）とが役立つ。光学センサとして使用されるプリント配線板カメラは、校正を困難にする顕著なひずみを有している。本発明による方法、装置及び校正基板（１）に基づき、この校正基板（１）において予め規定された定格距離（ａ）で予め規定された位置に付与された２つの修正マーク（５，６）の位置がプリント配線板カメラによって測定され、測定結果が前記定格距離（ａ）と比較されるセンサ修正ファクタが求められる。

Component mounting apparatus and method

Pick and place machine with component placement inspection

Improved component placement inspection and verification is performed by a pick and place machine (301). Improvements include stereovision imaging of the intended placement location; enhanced illumination to facilitate the provision of relatively high-power illumination in the restricted space near the placement nozzle(s) (208, 210, 212); optics (380) to allow image acquisition device (300, 302) to view the placement location (360) from an angle relative to a plane of the placement location, thereby reducing the possibility of such images being obstructed by the component (304); techniques for rapidly acquiring images with commercially available CCD arrays such that acquisition of before and after images does not substantially impact system throughput; and image processing techniques to provide component inspection and verification information.

Recognition parameter optimization device, component mounting system, and recognition parameter optimization method

According to the present invention, when a component mounting machine 10 mounts a component P on a board B, image data Dp, which is acquired by imaging the component P by means of component recognition (step S102), is stored in a storage unit 92 (step S103), and a brightness-related condition is optimized on the basis of the image data Dp (steps S201, S301-S311). Accordingly, it becomes possible to acquire a suitable brightness-related condition according to the component P which is the component to be actually mounted.

Operation machine

Method and device for placing electronic components

Method for operating a pick-and-place device, pick-and-place device, exchangeable component for a pick-and-place device and system that consists of a pick-and-place device and an exchangeable component

Exchangeable components (3, 5, 17) are mounted in a pick-and-place device (7) and the latter is calibrated in order to unambiguously allocate the exchanged components (3, 5, 17) and the pick-and-place device (7) in terms of their position. So far, this calibration has been carried out by placing glass plates on glass substrates that are provided with gauge marks, which is a very time-consuming method. According to the invention, the exchangeable components (3, 5, 17) are calibrated before being mounted and the geometrical data of the exchangeable components (3, 5, 17) are stored in a memory (15, 16, 18) of the exchangeable components (3, 5, 17). The control device (6) of the pick-and-place device (7) reads out the memory (15, 16, 18) once the exchangeable components (3, 5, 17) are mounted and uses said data for the placement process.

Recognition parameter optimization device, component mounting system, and recognition parameter optimization method

在元件安装机(10)将元件(P)安装于基板(B)时，在元件识别(步骤S102)中通过对该元件(P)进行拍摄而取得的图像数据(Dp)被存储于存储部(92)(步骤S103)，并基于该图像数据(Dp)使亮度关联条件最优化(步骤S201、S301～S311)。因此，能够取得与实际成为元件安装的对象的元件(P)相应的适当的亮度关联条件。

Component mounting machine

本发明提供一种元件装配机，具备：元件移载装置，具有元件装配件、装配头以及头驱动机构，进行将从元件供给装置拾取的元件向由基板搬运装置搬入以及定位的基板的预定的坐标位置装配的装配作业；以及控制装置，控制装配作业，并且实施热校正处理，该热校正处理用于降低与头驱动机构以及装配头中的至少一方的温度变化相伴的热变形对元件的装配精度造成的影响，其中，控制装置具有：实施时期判定部，基于所要求的装配精度的高低，或者考虑装配作业的实施状况发生变化而装配精度可能发生变化的变化时期，判定热校正处理的实施时期；以及热校正实施部，根据实施时期判定部的判定结果来实施热校正处理。

Mounting order determination device, mounting order examination device, mounting order determination method, and mounting order examination method

A mounting order determination device for determining a mounting order of multiple electronic components prior to mounting work using a component mounting machine or a component mounting line, the mounting order determination device including a level setting section for setting level information, in which mounting order priorities are ranked, for each component type, the target of which being of at least one of a multilayer mounting component type group, including a component type of multiple electronic components having a possibility of being mounted in the up-down direction in layers, and a close-proximity mounting component type group.

Method and apparatus for calibrating a moving distance and / or an angular position of a holding device provided in a manufacturing apparatus of an electrical component group, and a calibration substrate

Element hold mode detection method and element fixing apparatus

设有用于将元件(P)吸附于头的吸嘴和基准标记，并且具备零件相机，该零件相机在透镜的视野内设置子透镜且能够通过透镜(主透镜部)拍摄元件(P)，并且通过透镜及子透镜(子透镜部)拍摄基准标记。根据由主透镜部拍摄校准板(CP1)而获得的图像来测定主透镜部的变形校正值，并且根据由子透镜部拍摄校准板(CP2)而获得的图像来测定子透镜部的变形校正值，并作为变形校正表预先进行存储。并且，在元件安装时，当由零件相机同时拍摄保持于吸嘴的元件(P)和基准标记时，使用变形校正表来校正所获得的图像，并基于校正图像来检测元件(P)的吸附状态。

Pick and place machine with component placement inspection

由抓取式设备(301)实行改进的元件布局检查和确认。这些改进包括：预期元件布局位置的立体成像；强化照明，以促进在置放管嘴(208，210，212)附近的有限空间内提供相当高功率的照明；光学装置(380)使图像获取设备(300，302)能够从相对于放置位置平面成一定角度观察放置位置(360)；利用以商业上适用的CCD阵列快速获取图像的技术，使放置前和放置后图像的获取不致明显影响整个系统；图像处理技术可以提供元件检查和确认的信息。

High speed lead inspection system

An inspection system determines if leads of a semiconductor device are in proper positions. Images from at least two sides of the semiconductor device are captured along with calibration marks formed in the side of a track upon which the semiconductor device is mounted. All leads and calibration marks are captured in a single video image, the images from one side of the semiconductor device being off set from the image from the other side.

Component mounting apparatus

元件安装机具备头、头移动装置、拍摄装置以及控制装置。控制装置执行以下动作：下元件安装动作，向基板安装下元件；上元件安装动作，向被安装于基板上的下元件之上安装上元件；以及下元件安装检查动作，在进行了下元件安装动作之后且进行上元件安装动作之前，对安装了下元件的基板进行拍摄，并且基于拍摄图像进行下元件的安装检查。进而，控制装置在向被安装于基板上的多个下元件中的不同的下元件之上分别安装上元件的情况下，作为下元件安装检查动作的执行时机，根据从包括第一检查模式和第二检查模式在内的多个检查模式中选择出的检查模式来执行下元件安装检查动作，该第一检查模式是在即将进行各上元件的上元件安装动作之前进行位于安装对象的上元件之下的下元件的安装检查的模式，该第二检查模式是连续地进行多个下元件全部的安装检查的模式。

Automatically positioning system

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Component mounting apparatus and calibration method in component mounting apparatus

Component mounting machine

This component mounting machine comprises: a component transfer device having a component mounting tool, a mounting head, and a head driving mechanism, wherein the component transfer device performs a mounting operation whereby a component collected from a component supplying device is mounted at a predetermined coordinate position on a board which has been sent-in and positioned by a board transport device; and a control device for controlling the mounting operation while performing heat correction processing for mitigating the influence of thermal deformation on component mounting accuracy accompanying a temperature change in at least one among the head driving mechanism and the mounting head. The control device comprises: a performance period determination unit for determining the performance period for the heat correction processing, on the basis of whether the level of the mounting accuracy required is high or low, or, taking into consideration a period of change during which the performance status of the mounting operation changes and during which the mounting accuracy may change; and a heat correction performing unit for performing the heat correction processing according to the result of the determination from the performance period determination unit.

Mounting order determination device, mounting order examination device, mounting order determination method, and mounting order examination method

Substrate working device and image processing method

A substrate working device comprises an imaging device for imaging a substrate, a storage device for storing a variety of items of information, and an image processing device. When prescribed work is performed on a plurality of substrates, as regards the lead substrate, the image processing device performs image processing for detecting a prescribed object of detection necessary for the prescribed work in the captured image for which the lead substrate was imaged by the imaging device, and performs lead substrate processing for acquiring region information pertaining to a region within a captured image necessary for detection of the object of detection and storing the region information in the storage device. As regards subsequent substrates other than the lead substrate, the image processing device executes subsequent substrate processing for setting a partial processing region on the basis of the region information in the captured image for which the subsequent substrate was imaged by the imaging device, and performing image processing on the set processing region.

Three dimensional inspection system

A part inspection and calibration method for the inspection of printed circuit boards and integrated circuits includes a camera to image a precision pattern mask deposited on a transparent reticle. Small parts are placed on or above the transparent reticle to be inspected. An overhead mirror or prism reflects a side view of the part under inspection to the camera. The scene of the part is triangulated and the dimensions of the system can thus be calibrated. A precise reticle mask with dot patterns gives an additional set of information needed for calibration. By imagining more than one dot pattern the missing state values can be resolved using an iterative trigonometric solution. The system optics are designed to focus images for all perspectives without the need for an additional focusing element.

Method for registering an inspection standard for solder inspection and substrate inspection device using the method

[課題]作成根據焊料填角(tillet)之具體的形狀進行檢查，而且可簡單地設定該檢查的基準。[解決手段]為了對安裝於基板之元件的焊料填角，設定根據藉運算求得表示其3維形狀之數值參數後判定其是否適當的方法之檢查的基準，顯示包含表示設定對象之元件的影像之影像顯示區域51與檢查基準列表513的設定畫面，並受理使用者的操作。在檢查基準列表513，顯示將複數種檢查項目之項目名稱與在各個檢查項目所測量之數值參數的基準值之輸入欄賦予對應列表513。使用者係除了顯示於影像顯示區域51的影像以外，適當地還叫出表示數值參數之概念的參考圖K1，判別並輸入適合基準值的數值。

Calibration methods for placement machines incorporating on-head linescan sensing

A method of calibrating a pick and place machine (31) having an on-head linescan sensor (64) is disclosed. The calibration includes obtaining z-axis height information of one or more nozzle tips via focus metric methods, including a Fourier transform method and a normalized correlation method. Additionally, other physical characteristics such as linear detector tilt, horizontal scale factor, and vertical scale factor are measured and compensated for in the process of placing the component. Nozzle runout, another physical characteristic, is also measured by a sinusoidal curve fit method, and the resulting Z-height calibration data is used to later place the component.

Optimizing selection of reference markings used in estimating the position of an imaging device

A method of estimating the position of the field of view of an imaging device, such as a camera, relative to a board involves designating groups of markings on the board as reference groups and detecting the respective shifts in a set of these reference groups within the field of view of the camera compared to known positions therein. . A choice is made between the various possible sets of unambiguously-identifiable reference groups to be used for position estimation. This choice is based on a genetic algorithm optimization process in which the individuals in the population are different sets of candidate reference groups, a plurality of generations of individuals is generated, and the individual having the highest measure of a fitness parameter is selected to provide the set of reference groups to be used in position estimation. Advantageously, detection and localization of the reference groups involves analysis of only respective subsets of the image produced by the imaging device.

Method and apparatus for three-dimensional inspection of electronic components

A calibration and part inspection method and apparatus for the inspection of ball grid array, BGA, devices (70). Two cameras (10, 15) image a precision pattern mask (22) with dot patterns deposited on transparent reticle (20). The precision pattern mask (22) is used for calibration of the system. A light source and overhead light reflective diffuser (5) provide illumination. A first camera (10) images the reticle precision pattern mask (22) from directly below. An additional mirror (32, 36) or prism (30, 34) located below the bottom plane of the reticle (20) reflects the reticle pattern mask (22) from a side view, through prisms (30, 34) or reflective surfaces (32, 36, 38), into a second camera (15) and a second additional mirror (32, 36, 38) or prism (30, 34) located below the bottom plane of the reticle (20) reflects the opposite side view of the reticle pattern mask (22) through prisms (30, 34) or mirrors (32, 36, 38) into a second camera (15).

3D inspection system

(57)【要約】 透明レティクル（２０）上に置かれた精密パターンマスクを撮像するためのカメラ（１０）を含む、集積回路を検査するための部品検査及び校正方法。検査される小さい部品（３０）は、透明レティクル（２０）上に、またはそれから離して上方に配置される。オーバヘッドミラーまたはプリズム（４０）は、被検査部品（３０）の側面ビューをカメラ（１０）へ反射する。部品（３０）の画像シーンは三角形分割され、それによってシステムの次元を校正することができる。

Machine suitable for placing a component on a substrate, as well as a method therefor

Machine (1) comprising a placement element (7) connected to an imaging device (6), and comprising an optical system (4) for detecting the position of a component (16) relative to the placement element (7) by means of the imaging device (6). The optical system (4) comprises at least one marking element (11). The marking element (11) and the component (16) can be displayed simultaneously by means of the optical system (4) in an image (17) to be made by means of the imaging device (6).

Component mounter

Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components

公开了一种三维视觉检查对象诸如电子元件的方法，该电子元件具有作为待检查特征的突起，诸如输入/输出接触球。该方法包括以下步骤：确定一对照相机的内部和外部参数；由两个照相机的参数形成校正的坐标系，该参数是在前面就第二图像捕捉装置关于第一图像捕捉装置的相对姿态而确定的。由照相机系统捕捉对象的一对图像，该对象在一表面上具有多个共面的突起，其中图像的图像坐标被变换成校正的坐标系的坐标。然后，为测量每个突起的共面性以及高度，确定每个突起的共轭点。也公开了用于捕捉图像和处理图像数据的装置的不同布局。

Mounting device and mounting method

実装装置は、部品を基板上へ実装する実装処理を実行する実装装置であって、部品を採取する採取部を１以上備えこの採取した部品を移動する実装ヘッドと、実装ヘッドが作業するＸＹＺ軸上の第１位置において定められた第１補正値と第１位置とは異なる第２位置において定められた第２補正値とを少なくとも記憶する記憶部と、記憶部に記憶された第１補正値及び／又は第２補正値を用いて実装処理を実行する制御部と、を備える。 The mounting device is a mounting device that executes a mounting process for mounting components on a board, and has one or more sampling units for collecting components, a mounting head for moving the sampled components, and an XYZ axis on which the mounting head works. A storage unit that stores at least a first correction value determined at the first position above and a second correction value determined at a second position different from the first position, and a first correction value stored in the storage unit. And / or a control unit that executes the mounting process using the second correction value.

Component mounting apparatus

This component mounting apparatus (100, 300) includes a head portion (50, 250, 350, 450) capable of mounting a component (2) suctioned by a nozzle (5) on a board (1), a board imaging portion (73, 73, 270, 470) provided on the head portion to be movable relative to the head portion so as to image the board, and an imaging position correction mark (59, 202) provided in the head portion to be capable of being imaged by the board imaging portion and is configured to correct the displacement of the board imaging portion relative to the head portion on the basis of an image of the imaging position correction mark imaged by the board imaging portion.

Method and device for calibrating a displacement path and/or angular position of a holding device in a device for producing electrical assembly groups and calibration substrate

Mounting accuracy measurement system for component mounting line, and mounting accuracy measurement method

Each of multiple component mounting machines constituting a component mounting line is configured to switch between a production mode in which a component is mounted on a circuit board that has been conveyed in and then conveyed out, a mounting accuracy measurement mode in which a mounting accuracy measurement component is mounted at a predetermined position on a mounting accuracy measurement board and the mounting accuracy is measured, and a pass mode in which a component is conveyed out without being mounted on the board conveyed in. When the control mode of two or more component mounters among the multiple component mounting machines is the mounting accuracy measurement mode, the mounting accuracy is measured by conveying the mounting accuracy measurement board along the board conveyance path, and the two or more component mounting machines sequentially use the mounting accuracy measurement board to measure the mounting accuracy.

Laser height measuring device and component mounting machine

This laser height measuring device is provided with: a laser height sensor (6) comprising a laser beam irradiation section (61) for emitting a laser beam (L1) and a reflected light detection section (62) for detecting the laser beam reflected off an object to be irradiated; a sensor movement mechanism (head drive mechanism (41-43)) for moving the laser height sensor (6) within a plane; an imaging camera (component camera (5)) that is provided at a predetermined calibrating position (light incidence axis (AO); a neutral density filter (71) that allows the laser beam (L1) to pass while attenuating the laser beam; a laser beam imaging means that positions the laser height sensor (6) at the calibrating position (AO), emits the laser beam (L1), and captures an image of the laser beam which has passed the neutral density filter (71) using the imaging camera (5) in order to obtain a laser beam image; and a correction value acquisition means that obtains values for correcting the coordinates of the laser beam on the basis of the position of the laser beam in the laser beam image. Thus, the measuring position can be controlled accurately, and the accuracy of measuring position control can be maintained without requiring a sensor installation position adjustment mechanism or a positional adjustment operation.

Method and apparatus for three dimensional inspection of electronic components

A three dimensional inspection method for inspecting ball array devices having a plurality of balls, where the ball array device is positioned in an optical system. The inspection method includes the steps of illuminating at least one ball on the ball array device, and disposing a sensor, a first optical element and a second optical element in relation to the ball array device so that the sensor obtains at least two differing views of the at least one ball, the sensor providing an output representing the at least two differing views. The output is processed using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane.

Working rig

在吸嘴升降时的移动方向从铅垂方向偏离的情况下，吸嘴保持元件的保持位置根据吸嘴保持元件的保持高度而不同，因此无法确保适当的作业。因此，通过吸嘴来保持在比工作台的上表面高出预定高度(H)的位置载置的元件，并将该元件载置于预定位置。而且，拍摄该元件，并运算元件的载置位置即第一高度元件载置位置。另外，通过吸嘴来保持载置于工作台上的元件，并将该元件载置于上述预定位置。而且，拍摄该元件，运算元件的载置位置即第二高度元件载置位置。接下来，运算第一高度元件载置位置与第二高度元件载置位置的偏离量。由此，通过基于该偏离量来进行元件的保持位置的修正、元件的载置位置的修正等，可确保适当的作业。

Mounting accuracy measuring system and mounting accuracy measuring method for component mounting line

部品実装ライン（１０）を構成する複数台の部品実装機（１４）の各々は、搬入した回路基板（１１）に部品を実装して搬出する生産モードと、実装精度測定用部品（４２）を実装精度測定用基板（４１）の所定位置に実装してその実装精度を測定する実装精度測定モードと、搬入された基板に部品を実装することなく搬出するパスモードとを切り替え可能に構成されている。部品実装ライン（１０）を構成する複数台の部品実装機のうちの２台以上の部品実装機の制御モードが前記実装精度測定モードである場合に、少なくとも当該２台以上の部品実装機の間を基板搬送路（１２）に沿って前記実装精度測定用基板を搬送することで、当該２台以上の部品実装機が順番に当該実装精度測定用基板を使用して実装精度を測定する。

Working machine

在吸嘴升降时的移动方向从铅垂方向偏离的情况下，吸嘴保持元件的保持位置根据吸嘴保持元件的保持高度而不同，因此无法确保适当的作业。因此，通过吸嘴来保持在比工作台的上表面高出预定高度(H)的位置载置的元件，并将该元件载置于预定位置。而且，拍摄该元件，并运算元件的载置位置即第一高度元件载置位置。另外，通过吸嘴来保持载置于工作台上的元件，并将该元件载置于上述预定位置。而且，拍摄该元件，运算元件的载置位置即第二高度元件载置位置。接下来，运算第一高度元件载置位置与第二高度元件载置位置的偏离量。由此，通过基于该偏离量来进行元件的保持位置的修正、元件的载置位置的修正等，可确保适当的作业。

Mounting device and mounting method

This mounting device is for carrying out a mounting process of mounting components on a substrate, and is provided with: a mounting head that is provided with one or more picking-up parts for picking up components and that moves the picked-up components; a storage unit that stores at least a first correction value set at a first position on XYZ axes on which the mounting head operates and a second correction value set at a second position different from the first position; and a control unit that executes the mounting process by using the first correction value and/or the second correction value stored in the storage unit.

一种自动贴片流水线上的整理传输装置

本发明公开了一种自动贴片流水线上的整理传输装置，包括机架、整形机构、传输驱动机构、分流整理机构和检测机构，其中：机架包括整形台和至少两台分流台，所述分流台上中部竖直设有分流板，所述分流板内部中空且连通两侧相对设有滑槽；所述整形机构设于整形台下且包括顶升气缸、整形夹和定时器，所述顶升气缸用于驱动整形夹顶部向整形台两侧边缘处分离，使流水线上的板材靠近整形台边缘一侧与传输方向平行；所述传输驱动机构用于带动板材在整形台和分流台上传输；所述分流整理机构包括多个平行传输的整理块，每个整理块内插设有驱动轴。本发明通过整形、分流、位置检测、再次整理，实现传输的准确性，提高生产效率。

Verfahren und vorrichtung zum kalibrieren eines verfahrwegs und/oder einer winkellage einer haltevorrichtung in einer einrichtung zur herstellung von elektrischen baugruppen sowie kalibriersubstrat

Método de calibração de um distribuidor

Choice of reference markings for enabling fast estimating of the position of an imaging device

A method of estimating the position of the field of view of an imaging device, such as a camera, relative to a board involves designating markings on the board as references and detecting the shift in these reference markings within the field of view of the camera compared to a known position therein. The reference markings are selected such that detection thereof involves analysis of only a subset of the image produced by the imaging device. The selection of a group of one or more markings to serve as a reference involves determination of the image region (error window) in which the reference marking(s) may appear, given the maximal positional error of the imaging device. It is also checked (step T4) that the entire error window will be within the useable field of view of the imaging device and that, within the error window, no other group of markings will appear that could be confused with the selected group of markings (step T5). Detection of the reference group of markings involves generation of an image profile along a line crossing the center of the error window and finding the best match between the markings along this profile and the markings in the reference group.

Smt 장비를 위한 하이브리드 제어 시스템

본 발명은 PCB의 표면에 부품을 자동으로 실장하는 공정을 수행하는 SMT 장비에 대한 제어와 해당 SMT 장비가 소속된 라인에 대한 제어를 분리하여 상이한 방식으로 각각을 제어함으로써 생산성과 작동성, 보안성을 높인 SMT 장비를 위한 하이브리드 제어 시스템에 관한 것으로, 표면 실장을 위한 하나의 라인을 구성하는 복수개의 장비가 수행할 각 동작과 순서가 프로그래밍되어 있는 시퀀스 제어모듈과, 라인 매니지부와 근거리 통신망(LAN)을 통하여 데이터와 제어신호를 송수신하는 제1 통신모듈을 구비하는 장비 매니지부; 및 상기 장비 매니지부와 근거리 통신망(LAN)을 통하여 데이터와 제어신호를 송수신하는 제2 통신모듈과, 다수의 상기 장비 매니지부에서 전송되는 데이터를 통하여 각 라인 별로 운용 상태를 모니터링하는 라인 모니터링 모듈을 구비하는 라인 매니지부;를 포함하는 것을 특징으로 한다.

取付け公差点検用試験体

电路板的偏移校正方法、锡膏检查设备及存储介质

本申请涉及电路板生产技术领域，公开了一种电路板的偏移校正方法、锡膏检查设备及存储介质，该方法通过将电路板对应的标准文件中的每一预设标记点划分到一个视场角区域，确定一个预设标记点，并确定该预设标记点对应的视场角区域；将摄像单元移动到预设标记点对应的视场角区域，并记录摄像单元对应的第一视场角坐标；获取电路板的第一图像以及预设标记点的检测区域；若识别到预设标记点，则记录摄像单元对应的第二视场角坐标；根据第一视场角坐标和第二视场角坐标，确定预设标记点的移动偏移量，以校正电路板的整板坐标，从而取消手动对位，无需拍摄整版图像，使得标准文件的位置与电路板的位置匹配，能够提高检测程序的编程效率。

Component orientation determination data creation device and component orientation determination data creation method

部品装着機及び部品装着方法

部品供給位置と回路基板との間を移動する移動装置と、移動装置に設けられ、部品供給位置に供給された部品を採取し、採取した部品を前記回路基板に装着する装着ヘッドと、装着ヘッドにより採取された部品を装着ヘッドの下方から撮像可能な部品カメラと、移動装置に設けられ、前記回路基板を上方から撮像可能な基板カメラと、部品カメラによる装着ヘッドの撮像で得られる画像データに基づき、部品カメラの撮像時における移動装置の位置座標である撮像位置座標を記憶する撮像位置記憶部と、基板カメラに対する装着ヘッドの相対位置である相対位置座標を記憶する相対位置記憶部と、移動装置が撮像位置座標に到達した際に部品カメラによる装着ヘッドの撮像を行い、当該撮像で得られる画像データから把握される装着ヘッドの位置に基づき、相対位置記憶部に記憶する相対位置座標の補正の要否を判定する補正要否判定部と、を備える、部品装着機。

Sposób kalibracji dozownika

Test device for establishing, verifying, and/or managing accuracy

정확도를 확립, 확인 및/또는 관리하기 위한 테스트 디바이스

테스트 디바이스는 집기-놓기 프로세스의 정확도를 확인하기 위해 개시된다. 테스트 디바이스는 구성요소들을 수용하도록 구성된 표면, 및 표면 아래에 위치된 강자성 층을 포함한다. 시스템이 테스트 디바이스 및 각각이 자기 요소를 포함하는 복수의 구성요소를 포함하여 추가로 개시되며, 복수의 구성요소는 테스트 디바이스의 복수의 포켓에 의해 수용되도록 구성된다. 구성요소를 집어서 테스트 디바이스로 놓는 방법이 추가로 개시된다.

Temperatur- und umgebungslichtmessung bei selbstleuchtenden anzeigetechnologien in automobilanwendungen

Component mounting apparatus, component mounting method, and component positional relationship information acquiring method

A mounting nozzle is capable of holding an electronic component having multiple patterns provided on its pattern surface based on pattern design information. A camera is capable of capturing an image of the pattern surface of the electronic component. A movement mechanism is capable of moving the mounting nozzle between a location where capturing of the image by the camera is performed and a component mounting location. A control unit is capable of controlling the mounting nozzle and the movement mechanism. The control unit stores positional relationship information indicating positional relationship based on the pattern design information between a position of a registration pattern representative point identified by at least one registration pattern selected from the multiple patterns provided on the pattern surface and a position of a positioning reference point on which positioning of the electronic component at the component mounting location for mounting is based.

Substrate working device and image processing method

一种修正元件载体的方法及自动装配机

本发明描述了一种用来对元件载体（150）的描述进行修正的方法，该描述包括电子元件（172、174、178、180）的几何形状方面的额定数据。所述方法具有：（a）借助照相机（340）探测元件载体（150）的表面的第一部分的第一图像（242）；（b）将第一图像存储在（242）中；（c）在第一时间段中示出第一图像（242）；（d）得出第一元件‑连接面（292、294、296）在第一图像（242）内的实际位置，所述元件‑连接面配属于用于第一元件（180）的第一装配位置；（e）将实际位置与在第一装配位置中待装配的第一元件（180）的第一元件‑连接触点（282、284、286）的额定位置进行比较，所述代表几何形状方面的额定数据的一部分，（f）就第一元件（180）的额定位置而言，对元件载体的描述进行修正，因此产生了修正的额定位置，为此扩大了在修正的额定位置上待装配的第一元件（180）的第一元件‑A连接触点（282、284、286）和的第一元件‑连接面（292、294、296）之间的空间重合；（g）在第一时间段内将照相机（340）移至第二位置；（h）借助照相机（340）探测元件载体（150）的表面的第二部分的第二图；（i）存储第二图像；（j）在第一时间段中示出第二图像。本发明还涉及一种用来装配元件载体（150）的方法、一种计算机程序以及自动装配机（300），它们设计得用来执行所述修正方法。

Component orientation determination data creation device and component orientation determination data creation method

元件方向判定数据生成装置及元件方向判定数据生成方法

元件方向判定数据生成装置对由相机(12)拍摄的元件的图像中的元件方向判定数据所指定的判定区域的亮度值与判定阈值进行比较来生成对该元件的方向进行判定的元件方向判定系统中使用的所述元件方向判定数据，其中，取得相对于上述相机而改变作为上述元件方向判定数据的生成对象的元件的方向而拍摄到的多个方向的元件的图像，并运算出正确方向的元件的图像与其他方向的元件的图像之间的差分图像。并且，求出该差分图像中的亮度差最大或为预定值以上的区域，并运算出包含用于在该区域内指定上述判定区域的位置信息的上述元件方向判定数据。元件方向判定数据中，除了判定区域的位置信息之外，还包含最佳拍摄条件的信息和判定阈值。

Component orientation determination data creation device and component orientation determination data creation method

A component orientation determination data creation device for creating component orientation determination data used in a component orientation determination system that determines an orientation of the component by comparing a brightness value of a determination region specified in the component orientation determination data within an image of the component captured by a camera with a determination threshold. A difference image between an image of the component in a correct orientation and an image of the component in another orientation is calculated by acquiring multiple images of the component in different orientations by changing the orientation with respect to the camera of the component that is the target for the component orientation determination data creation.

部品向き判定データ作成装置及び部品向き判定データ作成方法

カメラ（１２）で撮像した部品の画像のうちの部品向き判定データで指定された判定領域の輝度値を判定しきい値と比較して当該部品の向きを判定する部品向き判定システムで使用する前記部品向き判定データを作成する部品向き判定データ作成装置において、前記カメラに対して前記部品向き判定データの作成対象となる部品の向きを変えて撮像した複数の向きの部品の画像を取得して正しい向きの部品の画像と他の向きの部品の画像との差分画像を演算する。そして、この差分画像のうちの輝度差が最大又は所定値以上となる領域を求めて当該領域内に前記判定領域を指定する位置情報を含む前記部品向き判定データを演算する。部品向き判定データには、判定領域の位置情報の他に、最適な撮像条件の情報と判定しきい値が含まれる。

Choice of reference markings for enabling fast estimating of the position of an imaging device

A method of estimating the position of the field of view of an imaging device, such as a camera, relative to a board involves designating markings on the board as references and detecting the shift in these reference markings within the field of view of the camera compared to a known position therein. The reference markings are selected such that detection thereof involves analysis of only a subset of the image produced by the imaging device. The selection of a group of one or more markings to serve as a reference involves determination of the image region (error window) in which the reference marking(s) may appear, given the maximal positional error of the imaging device. It is also checked (step T4) that the entire error window will be within the useable field of view of the imaging device and that, within the error window, no other group of markings will appear that could be confused with the selected group of markings (step T5). Detection of the reference group of markings involves generation of an image profile along a line crossing the center of the error window and finding the best match between the markings along this profile and the markings in the reference group.

Choice of reference markings for enabling fast estimating of the position of an imaging device

A method of estimating the position of the field of view of an imaging device, such as a camera, relative to a board involves designating markings on the board as references and detecting the shift in these reference markings within the field of view of the camera compared to a known position therein. The reference markings are selected such that detection thereof involves analysis of only a subset of the image produced by the imaging device. The selection of a group of one or more markings to serve as a reference involves determination of the image region (error window) in which the reference marking(s) may appear, given the maximal positional error of the imaging device. It is also checked (step T4) that the entire error window will be within the useable field of view of the imaging device and that, within the error window, no other group of markings will appear that could be confused with the selected group of markings (step T5). Detection of the reference group of markings involves generation of an image profile along a line crossing the center of the error window and finding the best match between the markings along this profile and the markings in the reference group.

Choice of reference markings for enabling fast estimating of the position of an imaging device

A method of estimating the position of the field of view of an imaging device, such as a camera, relative to a board involves designating markings on the board as references and detecting the shift in these reference markings within the field of view of the camera compared to a known position therein. The reference markings are selected such that detection thereof involves analysis of only a subset of the image produced by the imaging device. The selection of a group of one or more markings to serve as a reference involves determination of the image region (error window) in which the reference marking(s) may appear, given the maximal positional error of the imaging device. It is also checked (step T4) that the entire error window will be within the useable field of view of the imaging device and that, within the error window, no other group of markings will appear that could be confused with the selected group of markings (step T5). Detection of the reference group of markings involves generation of an image profile along a line crossing the center of the error window and finding the best match between the markings along this profile and the markings in the reference group.

Component mounting machine and component mounting method

A component mounting machine including: a moving device configured to move between a component supply position and a circuit board; a mounting head provided on the moving device and configured to pick up a component supplied to the component supply position and mount the picked-up component on the circuit board; a component camera configured to image the component held by the mounting head from below the mounting head; a board camera provided on the moving device and configured to image the circuit board from above; an imaging position memory section configured to memorize imaging position coordinates that are position coordinates of the moving device during imaging by the component camera, based on image data acquired by imaging of the mounting head by the component camera; a relative position memory section configured to memorize relative position coordinates that are a relative position of the mounting head with respect to the board camera; and a correction necessity determining section configured to perform imaging of the mounting head by the component camera when the moving device has arrived at the imaging position coordinates, and determine whether it is necessary to correct the relative position coordinates memorized in the relative position memory section, based on a position of the mounting head understood from image data acquired from the imaging.

通过多次使用测试元件确定装配机的精度

本发明描述了一种用于确定装配机的装配精度的方法以及一种装配机。所述方法包括：(a)将参考板引入到装配机的装配区域中；(b)由装配头拾取测试元件；(c)使用装配头将所拾取的测试元件放置在参考板上的测试装配位置处；(d)借助相机和评估单元测定所放置的测试元件的实际位置；(e)由装配头重新拾取所放置的测试元件；(f)使用装配头将所重新拾取的测试元件重新放置在参考板上的另外测试装配位置处；(g)借助相机和评估单元重新测定所重新放置的测试元件的另外实际位置；以及(h)确定装配机的装配精度是基于(i)所测定的实际位置与(ii)测试装配位置的目标位置之间的偏差，并且基于(i)所重新测定的另外实际位置与(ii)另外测试装配位置的另外目标位置之间的另外偏差。

情報管理装置及び情報管理方法

複数の部品に分割されたウェハから部品を採取して基材に実装する際に部品の使用可否を判定してから実装する実装システムにおける情報を管理する情報管理装置は、各種情報を記憶する情報記憶部と、ウェハにおける部品の採取位置に関する情報と、部品の使用可否の判定結果に関する情報とを取得する情報取得部と、部品の採取位置と、使用可否の判定結果とを関連付けた情報を情報記憶部に記憶させる情報処理部と、を備えるものである。

Test device for establishing, verifying, and/or managing accuracy

A test device is disclosed for verifying the accuracy of a pick and place process. The test device includes a surface configured to receive components, and a ferromagnetic layer located under the surface. A system is further disclosed including the test device and a plurality of components each including a magnetic element, the plurality of components configured to be received by a plurality of pockets of the test device. A method of picking and placing a component onto the test device is further disclosed.

部件搭载装置、部件搭载方法和位置关系信息获取方法

提供能够简化将电子部件定位于目标位置的过程的部件搭载装置、部件搭载方法和位置关系信息获取方法。具有搭载吸嘴能、相机、移动机构以及控制装置。控制装置存储位置关系信息，该位置关系信息是表示根据从设置于图案面的多个图案中选择出的至少一个登记图案而确定出的登记图案代表点的位置和在将电子部件向部件搭载地点搭载时的成为定位的基准的定位基准点的位置之间的基于图案设计信息的位置关系的信息。并且，获取由相机拍摄电子部件的图案面而得到的图像。对图像进行解析而求出登记图案代表点的位置。将根据对图像进行解析而得到的登记图案代表点的位置和位置关系信息求出的定位基准点定位于部件搭载地点的目标位置来搭载电子部件。

部品搭載装置、部品搭載方法、及び部品位置決め方法

【課題】電子部品を目標位置に位置決めする手順を簡素化することが可能な部品搭載装置を提供する。【解決手段】パターン設計情報に基づいて、パターン面に、複数のパターンが設けられた電子部品を搭載ノズルが保持可能である。カメラが電子部品のパターン面の撮影を行い、搭載ノズル及び搭載ノズルの移動機構を制御可能である。パターン面に設けられた複数のパターンから選択された少なくとも１つの登録パターンから特定される登録パターン代表点の位置と、電子部品を部品搭載場所に搭載するときの位置決めの基準となる位置決め基準点の位置との、パターン設計情報に基づく位置関係を示す位置関係情報３４を記憶する。さらに、電子部品のパターン面をカメラで撮影した画像を取得する。画像を解析して、登録パターン代表点の位置を求める。登録パターン代表点の位置と位置関係情報とから位置決め基準点を求め、目標位置に電子部品を搭載する。【選択図】図５

Calibrating method for part mounting apparatus

A calibrating method for a part mounting apparatus including a support table on which a mounting board is supported, a part supply portion, a mounting head, a part recognition portion for detecting the position of an electrical part in the part supply portion, and a board recognition portion provided to the mounting head so as to detect the position of the mounting board on the support table, comprises a first step for calibrating the coordinate system of the part recognition portion on the basis of the coordinate system of the mounting head, a second step for calibrating the coordinate system of the board recognition portion on the basis of the coordinate system of the mounting head, a third step for calibrating the coordinate system of the reference board on the basis of the coordinate system of the mounting head, a fourth step for calibrating the coordinate system of the fixed recognition portion on the basis of the coordinate system of the mounting head, and a fifth step for calculating the rotational center position of the mounting head.

Information management device and information management method

An information management device for managing information in a mounting system that mounts a component after determining usability of the component when the component is picked up from a wafer divided into multiple components and is mounted on a base material, includes an information storage section that stores various types of information, an information acquisition section that acquires information on a pickup position of the component on the wafer and information on a determination result of usability of the component, and an information processing section that stores information obtained by associating the pickup position of the component with the determination result of the usability in the information storage section

贴片机多吸杆高度调节方法

本发明提供了一种贴片机多吸杆高度调节方法，包括对基准吸杆拍摄并记录第一机械坐标组与第一影像坐标组；计算第一比例值S 1 ；对调整吸杆的Z轴零点位置进行调整后，将调整吸杆在Z轴方向机械回零；将调整吸杆在Z轴方向移动第一固定距离D 1 ，拍摄并记录第二机械坐标组与第二影像坐标组；计算调整吸杆第二比例值S nd ；拍摄并记录调整吸杆的吸嘴在标定点位置时调整吸杆的第三机械坐标组与上视相机中吸嘴的第三影像坐标组；计算第三比例值S nu ；通过平行截割定理，计算出调整吸杆Z轴方向机械回零后与基准吸杆的基准高度的差值；重复上述步骤四至九。与现有技术相比，实现了自动化校正，操作简单快捷，降低了设备的生产和维护成本。

以半導體工業機器加工特別是晶圓、遮罩或平板顯示器的基板之方法

本發明係一種以半導體工業機器加工特別是晶圓、遮罩或平板顯示器的基板之方法，其中電腦支援過程用於判定基板的存在及/或定位及/或定向。本發明亦涉及經設計以執行該方法的系統。電腦支援過程包含人工類神經網路。

Merenje temperature i ambijentalnog svetla kod tehnologija prikaza sa samostalnim osvetljenjem u primenama kod automobila

Temperatur- und umgebungslichtmessung bei selbstleuchtenden anzeigetechnologien in automobilanwendungen

Die vorliegende Erfindung betrifft eine Anzeigeeinrichtung mit selbstleuchtenden Anzeigeelementen, die in einem Panel (1) angeordnet sind. Das Panel (1) ist auf seiner, der zur Anzeige dienenden Leuchtfläche (2) gegenüberliegenden Rückseite (3) mit einem Wärmeverteilelement (4) versehen, auf dessen der Rückseite (3) abgewandten Seite (5) zumindest ein Temperatursensor 6 angeordnet ist. Das Wärmeverteilelement (4) weist zumindest eine Öffnung (8) auf, hinter der ein Lichtsensor (7) angeordnet ist, wobei der Lichtsensor (7) und der Temperatursensor (6) auf einem gemeinsamen Träger (9) angeordnet sind.

回路基板検査装置用自動ティーチング方法

実際回路基板に実装される部品の実装データを活用して正確な自動ティーチングができるようにさせ、ティーチング作業を短時間で完了させると共に新しい回路基板に対するセットアップ時間も短縮させる回路基板検査装置用の自動ティーチング方法を提供する。 本発明は、回路基板検査用の自動ティーチング方法に関するもので、実装データをティーチング用データに変換するデータ変換段階と、該データ変換段階により変換されたティーチング用データについての座標を検査装置座標として一致させる座標変換段階と、前記データ変換段階と前記座標変換段階とにより生成された部品座標、部品名、参照名、部品角度などのティーチング用データに基づき検査する内容をプログラミングするティーチング段階と、を含む。