Reduced pth pad for enabling core routing and substrate layer count reduction

Embodiments are directed to semiconductor packaging having reduced sized plated through hole (PTH) pads by eliminating the margin of the pad-to-PTH alignment and enabling finer traces on the core of the substrate.

Base substrate, electronic device, and method of manufacturing base substrate

Abase substrate includes an insulator board comprising through holes penetrating between two opposed principal surfaces, penetrating electrodes provided within the through holes, and intermediate layers sandwiched between inner surfaces of the through holes and the penetrating electrodes and having surfaces with smaller concavities and convexities than those of the inner surfaces at the penetrating electrode sides.

Wiring substrate, multi-piece wiring substrate, and method for producing same

Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate is formed of a ceramic material, has a square (rectangular) shape in plan view, and which has a front surface, a back surface, and side surfaces each being located between the front surface and the back surface, wherein each side surface has a belt-like uneven surface including a plurality of alternate and parallel convex portions and concave portions which are formed so as to extend along the front surface, and also has a fracture surface located on a side toward the back surface.

Reduced pth pad for enabling core routing and substrate layer count reduction

Embodiments are directed to semiconductor packaging having reduced sized plated through hole (PTH) pads by eliminating the margin of the pad-to-PTH alignment and enabling finer traces on the core of the substrate.

MANUFACTURING METHOD OF A CIRCUIT BOARD HAVING A GLASS FILM

Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A plurality of first conductive vias are formed in the glass film. A first circuit layer is formed on an upper surface of the glass film, such that the first circuit layer is electrically connected with the first conductive vias. A first polymer layer is formed on the first circuit layer. The first polymer layer covers a surface of the first circuit layer and the upper surface of the glass film. A plurality of second conductive vias are formed in the first polymer layer. A second circuit layer is formed on the first polymer layer, such that the second circuit layer is electrically connected with the second conductive vias. The E-chuck is removed. 1. A manufacturing method of a circuit board structure , comprising:providing a glass film having an upper surface and a lower surface, and the lower surface of the glass film being disposed on an electrostatic chuck;forming a plurality of first conductive vias in the glass film, and the plurality of the first conductive vias penetrate the upper surface and the lower surface of the glass film;forming a first circuit layer on the upper surface of the glass film, such that the first circuit layer is electrically connected with the first conductive vias;forming a first polymer layer on the first circuit layer, and the first polymer layer covering a surface of the first circuit layer and the upper surface of the glass film;forming a plurality of second conductive vias in the first polymer layer, wherein the second conductive vias are electrically connected with the first circuit layer;forming a second circuit layer on the first polymer layer, such that the second circuit layer is electrically connected with the second conductive vias; andremoving the electrostatic chuck, so as to form a first circuit board structure.2. The manufacturing method of the circuit board structure ...

GLASS-BASED SUBSTRATE WITH VIAS AND PROCESS OF FORMING THE SAME

A glass sensor substrate including metallizable through vias and related process is provided. The glass substrate has a first major surface, a second major surface and an average thickness of greater than 0.3 mm. A plurality of etch paths are created through the glass substrate by directing a laser at the substrate in a predetermined pattern. A plurality of through vias through the glass substrate are etched along the etch paths using a hydroxide based etching material. The hydroxide based etching material highly preferentially etches the substrate along the etch path. Each of the plurality of through vias is long compared to their diameter for example such that a ratio of the thickness of the glass substrate to a maximum diameter of each of the through vias is greater than 8 to 1. 1. A process for forming vias in a glass-based substrate having a first major surface and an opposing second major surface , the process comprising:creating a plurality of etch paths extending from the first major surface of the glass substrate by directing a laser at the substrate in a predetermined pattern; andetching a plurality of vias extending from the first major surface of the glass substrate along the etch paths using a hydroxide based etching material, wherein the hydroxide based etching material preferentially etches the substrate along the etch path such that an etch rate of the etching material along the etch path is at least 12 times greater than an etch rate of the etching material outside of the etch paths.2. The process of claim 1 , wherein each of the plurality of vias have a ratio of the length of the via to a maximum diameter of the via is greater than 8 to 1.3. The process of claim 1 , wherein at least one of the plurality of vias is a through via.4. The process of claim 1 , wherein at least one of the plurality of vias is a blind via.5. The process of claim 1 , wherein the laser is a picosecond laser.6. The process of claim 1 , wherein the maximum diameter of each of ...

GLASS SUBSTRATE

A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 μm or less. Perpendicularity expressed by P=t/tranges from 1.00000 to 1.00015, where P is the perpendicularity, tis the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and tis the thickness of the glass substrate. 1. A glass substrate comprising:a first surface and a second surface that are opposite to each other with a plurality of through holes piercing through the glass substrate from the first surface to the second surface,wherein each of five through holes randomly selected from the plurality of through holes includes a first opening at the first surface and a second opening at the second surface,an approximate circle of the first opening has a diameter greater than a diameter of an approximate circle of the second opening,the first opening has a roundness of 5 μm or less, and{'sub': c', '0', 'c', '0, 'a perpendicularity expressed by P=t/tranges from 1.00000 to 1.00015, where P is the perpendicularity, tis a distance between a center of the approximate circle of the first opening and a center of the approximate circle of the second opening, and tis a thickness of the glass substrate.'}2. The glass substrate as claimed in claim 1 , whereinthe first opening has a substantially circular shape, andthe diameter of the approximate circle of the first opening ranges from 20 μm to 160 μm.3. The glass substrate as claimed in claim 2 , whereinthe second ...

Glass core substrate and method for manufacturing the same

Disclosed herein are a glass core substrate and a method for manufacturing the same. According to an embodiment of the present invention, there is provided the glass core substrate including: a glass core laminate including a glass layer and insulating layers which are stacked on upper and lower portions of the glass layer; a through hole formed by penetrating through the glass core laminate and provided with at least one crack which is formed at a penetrating inner wall by penetrating into the glass layer; and a conductive material filled in the through hole and the crack. Further, the method for manufacturing a glass core substrate is provided.

WIRING BOARD

A wiring board of the present disclosure includes: a first insulating layer including a surface; a second insulating layer including un upper surface and a lower surface and locating above the surface of the first insulating layer; a wiring conductor layer formed on the surface of the first insulating layer, includes a via land; and a via hole conductor penetrating from the upper surface to the lower surface of the second insulating layer. The via hole conductor includes a via bottom being in contact with the via land. Crystal grains in the via bottom are smaller than crystal grains in the via land. 1. A wiring board comprising:a first insulating layer comprising a surface;a second insulating layer comprising un upper surface and a lower surface and locating above the surface of the first insulating layer;a wiring conductor layer formed on the surface of the first insulating layer, includes a via land; anda via hole conductor penetrating from the upper surface to the lower surface of the second insulating layer,wherein the via hole conductor comprises a via bottom being in contact with the via land, andwherein crystal grains in the via bottom are smaller than crystal grains in the via land.2. The wiring board according to claim 1 , whereinthe via hole conductor comprises a first portion located above the via bottom, andthe crystal grains in the via bottom are smaller than crystal grains in the first portion.3. The wiring board according to claim 1 , wherein a mean grain size of the crystal grains in the via bottom is 1 to 20 claim 1 , as a relative value when a mean grain size of the crystal grains in the via land is assumed to be 100.4. The wiring board according to claim 1 , wherein a thickness of the via bottom is 0.1 to 10 claim 1 , as a relative value when a height of the via hole conductor is assumed to be 100.5. The wiring board according to claim 1 , whereinthe via hole conductor comprises a second portion located in an outer peripheral portion of the via ...

SUBSTRATE STRUCTURE AND METHOD OF MANUIFACTURING THE SAME

A method of manufacturing a substrate structure is provided. An insulation substrate having an upper surface is provided. A portion of the upper surface of the insulation substrate is irradiated by a first laser beam so as to form a first intaglio pattern. The first laser beam is IR laser beam or fiber laser beam. The first intaglio pattern has a modification surface. A first metal layer is formed on the upper surface of the insulation substrate, and covers the upper surface of the insulation layer and the modification surface of the first intaglio pattern, and fills up the first intaglio pattern. A grinding process is performed on the first metal layer so as to expose the upper surface of the insulation substrate and define a first patterned circuit layer. A first upper surface of the first patterned circuit layer is aligned with the upper surface of the insulation substrate. 1. A method of manufacturing a substrate structure , comprising:providing an insulation substrate having an upper surface;irradiating a portion of the upper surface of the insulation substrate with a first laser beam so as to form a first intaglio pattern, wherein the first laser beam is infrared (IR) laser beam or fiber laser beam, and the first intaglio pattern has a modification surface;forming a first metal layer on the upper surface of the insulation substrate, wherein the first metal layer covers the upper surface of the insulation layer and the modification surface of the first intaglio pattern, and fills up the first intaglio pattern; andperforming a grinding process on the first metal layer so as to expose the upper surface of the insulation substrate and define a first patterned circuit layer, wherein a first upper surface of the first patterned circuit layer is coplanar with the upper surface of the insulation substrate.2. The method of manufacturing the substrate structure as claimed in claim 1 , wherein a material of the insulation substrate comprises ceramics or glass.3. The ...

INTERPOSER AND METHOD FOR PRODUCING HOLES IN AN INTERPOSER

An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a board-shaped base substrate made of glass having a coefficient of thermal expansion ranging from 3.1×10/K to 3.4×10/K. The interposer further includes a number of holes having diameters ranging from 20 μm to 200 μm. The number of holes ranging from 10 to 10,000 per square centimeter. Conductive paths running on one surface of the board extend right into respective holes and therethrough to the other surface of the board in order to form connection points for the chip. 1. A method for producing holes in a board-shaped base substrate of an interposer which is adapted for electrical connection between a CPU chip and a circuit board , the method comprising the steps of:providing the board-shaped base substrate to be perforated, the board-shaped base substrate being made of glass;aligning laser beams to predetermined perforation points of the board-shaped base substrate;triggering focused laser pulses in a wavelength range between 1600 and 200 nm in which the glass is at least partially transparent and with a radiation intensity that causes local non-thermal destruction of the glass along filamentary channels at the predetermined perforation points; andwidening the filamentary channels to a desired diameter of the holes.2. The method of claim 1 , wherein the widening step comprises electro-thermal heating and evaporation of perforation material in the filamentary channels due to dielectric breakdowns.3. The method of claim 1 , wherein the widening step comprises directing reactive gases onto the filamentary channels.4. The method of claim 1 , wherein the widening step comprises etching.5. The method of claim 1 , wherein the board-shaped base substrate is made of a single layer of glass having a first and a second substrate surface.6. The method of claim 5 , wherein the board-shaped base substrate has transversely to the first and second substrate surfaces ...

Methods for forming vias in glass substrates

Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.

Adapter board and method for making adapter board

Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.

MANUFACTURING METHOD OF A MULTI-LAYER FOR A PROBE CARD

A method of manufacturing a multi-layer for a probe card comprises providing first contact pads on an exposed face of a first dielectric layer and second contact pads on an exposed face of a last dielectric layer. Each dielectric layer is laser ablated to realize pass-through structures and the pass-through structures are conductively filled to realize conductive structures. The dielectric layers are superimposed in a way that each conductive structure contacts a corresponding conductive structure of a contiguous dielectric layer in the multi-layer and forms conductive paths electrically connected the first and second contact pads. The second contact pads having a greater distance between its symmetry centers than the first contact pads, the multi-layer thus performing a spatial transformation between the first and second contact pads connected through the connective paths. 1. A manufacturing method of manufacturing a multi-layer for a probe card , comprising:providing a plurality of dielectric layers starting from a first dielectric layer to a last dielectric layer;providing a first plurality of contact pads realized on a first face of the multi-layer in correspondence of an exposed face of the first dielectric layer;providing a second plurality of contact pads realized on an opposite, second face of the multi-layer, in correspondence of an exposed face of the last dielectric layer;realizing, by laser ablation, in each dielectric layer of the plurality of dielectric layer a plurality of pass-through structures occurring in matching number in each dielectric layer, the matching number of pass-through structures being adapted to put into communication opposite faces of each dielectric layer;filling the plurality of pass-through structures with a conductive material to realize in each dielectric layer a plurality of conductive structures; andsuperimposing the plurality of dielectric layers in a way that each conductive structure of the plurality of conductive ...

WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD

A wiring board manufacturing method includes: forming a first groove structure in a first principal surface of a base by scanning with laser light in a first irradiation pattern such that the first groove structure has a first width; irradiating an inside of the first groove structure with laser light in a second irradiation pattern that is different from the first irradiation pattern to form recessed portions inside the first groove structure; and forming a first wiring pattern by filling the first groove structure with a first electrically-conductive material to form a first wiring pattern whose shape matches with a shape of the first groove structure in a top view. 1. A wiring board manufacturing method comprising:forming a first groove structure in a first principal surface of a base by scanning with laser light in a first irradiation pattern such that the first groove structure has a first width;irradiating an inside of the first groove structure with laser light in a second irradiation pattern that is different from the first irradiation pattern to form recessed portions inside the first groove structure; andforming a first wiring pattern by filling the first groove structure with a first electrically-conductive material to form a first wiring pattern whose shape matches with a shape of the first groove structure in a top view.2. The wiring board manufacturing method of claim 1 , whereinthe irradiating of the inside of the first groove structure includes forming a plurality of first recessed portions having dot shapes inside the first groove structure, andthe forming of the first wiring pattern includes filling the first electrically-conductive material in the plurality of first recessed portions.3. The wiring board manufacturing method of claim 2 , whereinthe forming of the first groove structure includes forming a plurality of first grooves each having a second width that is smaller than the first width, andeach of the plurality of first recessed portions ...

MULTILAYER INTERCONNECTION SUBSTRATE FOR HIGH FREQUENCY AND MANUFACTURING METHOD THEREOF

[Problem] To realize high reliability and high functionalization while suppressing characteristics variation in a multilayer interconnection substrate used in a microwave or millimeter-wave band integrated with an antenna. [Resolution Means] A multilayer substrate for high frequency with an antenna element formed on a surface. The multilayer substrate for high frequency has an intermediate substrate. The intermediate substrate consists of a low-temperature co-fired glass-ceramic substrate and has intermediate insulating layers consisting of a glass-ceramic and an internal conductor formed between these intermediate insulating layers. A surface insulating layer consisting of an organic material having a dielectric constant lower than a glass-ceramic material is stacked on a surface of the intermediate substrate. An outer-side via conductor penetrating this surface insulating layer is configured by a sintered metal that forms a metallic bond with a wiring conductor in the substrate. The outer-side via conductor is formed at the same time as sintering the glass-ceramic multilayer substrate. 1. A multilayer interconnection substrate for high frequency , comprising:an intermediate substrate where an internal conductor layer of a predetermined pattern is formed between intermediate insulating layers consisting of a glass-ceramic or on a surface of the intermediate insulating layer;an intermediate via conductor that penetrates the intermediate insulting layer and connects the internal conductor layers present in different interlayer positions to each other;a surface insulating layer consisting of an organic material integrally formed on at least one surface of the intermediate substrate; and the outer-side via conductor is comprised of a sintered metal integrally sintered with the internal conductor layer or the intermediate via conductor; and', 'a relative dielectric constant of the surface insulating layer is lower than a relative dielectric constant of the intermediate ...

SUBSTRATE HAVING THROUGH VIA AND METHOD OF FABRICATING THE SAME

A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.

METHOD OF MANUFACTURING THE PRINTED BOARD

A method of manufacturing a printed board, the method comprising: a first step of preparing a laminate having a base member in which a plurality of layers of glass cloths and a plurality of resin layers are alternately laminated, a first metal layer attached to one surface of the base member, and a second metal layer attached an opposite surface of the base member; a second step of forming a protective layer removable with a predetermined solvent on each of the first metal layer and the second metal layer; and a third step of irradiating the laminate on which the protective layer is formed with a laser beam to thereby form a through-hole penetrating in a thickness direction of the laminate. 1. A method of manufacturing a printed board , the method comprising:a first step of preparing a laminate having a base member in which a plurality of layers of glass cloths and a plurality of resin layers are alternately laminated, a first metal layer attached to one surface of the base member, and a second metal layer attached an opposite surface of the base member;a second step of forming a protective layer removable with a predetermined solvent on each of the first metal layer and the second metal layer; anda third step of irradiating the laminate on which the protective layer is formed with a laser beam to thereby form a through-hole penetrating in a thickness direction of the laminate.2. The method of manufacturing a printed board according to claim 1 ,wherein the protective layer is formed of a dry film made of a resin selected from acrylic resin, epoxy-based resin, and urethane-based resin.3. The method of manufacturing a printed board according to claim 1 ,wherein the protective layer has a thickness of at least 15 micrometer (μm) and at most 75 micrometer (μm).4. The method of manufacturing a printed board according to claim 1 ,wherein the base member has at least three layers of glass cloths, andwherein the base member has a thickness of at least 200 micrometer (m) and ...

GLASS-BASED SUBSTRATE WITH VIAS AND PROCESS OF FORMING THE SAME

A glass sensor substrate including metallizable through vias and related process is provided. The glass substrate has a first major surface, a second major surface and an average thickness of greater than 0.3 mm. A plurality of etch paths are created through the glass substrate by directing a laser at the substrate in a predetermined pattern. A plurality of through vias through the glass substrate are etched along the etch paths using a hydroxide based etching material. The hydroxide based etching material highly preferentially etches the substrate along the etch path. Each of the plurality of through vias is long compared to their diameter for example such that a ratio of the thickness of the glass substrate to a maximum diameter of each of the through vias is greater than 8 to 1. 1. A process for forming vias in a glass-based substrate having a first major surface and an opposing second major surface , the process comprising:creating a plurality of etch paths extending from the first major surface of the glass substrate by directing a laser at the substrate in a predetermined pattern; andetching a plurality of vias extending from the first major surface of the glass substrate along the etch paths using a hydroxide based etching material, wherein the hydroxide based etching material preferentially etches the substrate along the etch path such that an etch rate of the etching material along the etch path is at least 12 times greater than an etch rate of the etching material outside of the etch paths.2. The process of claim 1 , wherein each of the plurality of vias have a ratio of the length of the via to a maximum diameter of the via is greater than 8 to 1.3. The process of claim 1 , wherein at least one of the plurality of vias is a through via.4. The process of claim 1 , wherein at least one of the plurality of vias is a blind via.5. The process of claim 1 , wherein the laser is a picosecond laser.6. The process of claim 1 , wherein the maximum diameter of each of ...

CERAMIC-METAL SUBSTRATE WITH LOW AMORPHOUS PHASE

A ceramic-metal substrate in which the ceramic substrate has a low content of an amorphous phase. The ceramic-metal substrate includes a ceramic substrate and on at least one side of the ceramic substrate a metallization. The ceramic-metal substrate has at least one scribing line, at least one cutting edge, or both at least one scribing line and at least one cutting edge. Amorphous phases extend parallel to the scribing line and/or the cutting edge in a width of at most 100 μm or of at least 0.50 μm. 1. A ceramic-metal substrate comprising:a ceramic substrate having sides and at least one scribing line and/or cutting edge;a metallization on at least one side of the ceramic substrate; andamorphous phases that extend parallel to the scribing line and/or the cutting edge and have a width in a range of at least 0.50 μm and at most 100 μm.2. (canceled)3. The ceramic-metal substrate according to claim 1 , wherein the ceramic substrate has at least one scribing line with an edge and the amorphous phases extend claim 1 , starting from the scribing line and running parallel to the scribing line claim 1 , and the width claim 1 , calculated from the edge of the scribing line claim 1 , is at least 0.50 μm and at most 50 μm.4. (canceled)5. The ceramic-metal substrate according to claim 1 , wherein the ceramic substrate has at least one scribing line with a center line and the amorphous phases extend claim 1 , starting from the scribing line and running parallel to the scribing line claim 1 , and the width claim 1 , calculated from the center line of the scribing line claim 1 , is at least 0.50 μm and at most 100 μm.6. (canceled)7. The ceramic-metal substrate according to claim 1 , wherein the ceramic substrate has at least one cutting edge with an inner edge and the amorphous phases extend claim 1 , starting from the inner edge of the cutting edge and running parallel to the cutting edge claim 1 , and the width claim 1 , calculated from the inner edge of the cutting edge claim 1 ...

INTER-LAYER SLOT FOR INCREASING PRINTED CIRCUIT BOARD POWER PERFORMANCE

A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane. 1. A printed circuit board , comprising:a first voltage plane disposed on a first surface of a first electrically insulating layer; anda second voltage plane, whereinan inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.2. The printed circuit board of claim 1 , wherein the second voltage plane is disposed on a second surface of the first electrically insulating layer.3. The printed circuit board of claim 1 , further comprising a second electrically insulating layer claim 1 , wherein the second voltage plane is disposed on a first surface of the second electrically insulating layer.4. The printed circuit board of claim 3 , wherein the inter-layer slot also is formed through the second electrically insulating layer.5. The printed circuit board of claim 1 , wherein the electrically conductive material comprises electroplated copper.6. The printed circuit board of claim 5 , wherein the electroplated copper substantially fills the inter-layer slot.7. The printed circuit board of claim 1 , wherein the first voltage plane comprises a ground plane or a power plane.8. The printed circuit board of claim 7 , wherein the power plane is configured to be electrically coupled to a power source when the power source is mounted on the printed circuit board claim 7 , and wherein the power plane is further configured to be electrically coupled to an integrated circuit when the integrated circuit is mounted on the printed circuit board.9. The printed circuit board of claim 7 , wherein ...

MULTI-PIECE WIRING SUBSTRATE, WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING MULTI-PIECE WIRING SUBSTRATE

A wiring substrate includes a substrate with a first principal face and a second principal face. The first principal face has a first corner and first and second sides. The second principal face has a second corner corresponding to the first corner, and a third and a fourth side, respectively corresponding to the first and second sides. The substrate further comprising a first side surface connected to the first side, a second side surface connected to the second side, a third side surface connected to the third side, a fourth side surface connected to the fourth side, a first fracture part located between the first and third side surfaces to connect them, and a second fracture part located between the second and the fourth side surfaces to connect them. In the substrate's thickness direction, the length of the second side surface is smaller than the first side surface. 1. A wiring substrate , comprising:a substrate comprising a first principal face and a second principal face opposite to the first principal face and having a rectangular shape in a plan view thereof; anda wiring conductor,the first principal face comprising a first corner, a first side, and a second side, the first corner being located between the first side and the second side in a plan view of the first principal face,the second principal face comprising a second corner which is located at a position corresponding to the first corner, a third side which is located at a position corresponding to the first side, and a fourth side which is located at a position corresponding to the second side, in a plan view of the second principal face,the substrate comprising a first side surface which is connected to the first side, a second side surface which is connected to the second side, a third side surface which is connected to the third side, a fourth side surface which is connected to the fourth side, a first fracture part which is located between the first side surface and the third side surface to ...

PRINTED CIRCUIT BOARD, ELECTRONIC MODULE AND METHOD OF MANUFACTURING THE SAME

A printed circuit board, an electronic module and a method of manufacturing the printed circuit board are provided. The printed circuit board includes a plurality of insulation layers, metal layers formed on the plurality of insulation layers, a via formed for interlayer electrical connection of the metal layers, a trench penetrating the insulation layers, and a heat-transfer structure formed in the trench. 1. A printed circuit board comprising:a plurality of insulation layers;metal layers formed on the plurality of insulation layers;a via formed for interlayer electrical connection of the metal layers;a trench penetrating the insulation layers; anda heat-transfer structure formed in the trench.2. The printed circuit board as set forth in claim 1 , wherein the heat-transfer structure has a rod shape.3. The printed circuit board as set forth in claim 1 , wherein the plurality of insulation layers each comprise a heat-transfer structure.4. The printed circuit board as set forth in claim 1 , wherein the heat-transfer structure comprises at least one core and an outer layer surrounding the at least one core.5. The printed circuit board as set forth in claim 4 , wherein the at least one core and the outer layer each comprise at least one plating layer.6. The printed circuit board as set forth in claim 1 , wherein a volume of the heat-transfer structure is greater than a volume of the via.7. The printed circuit board as set forth in claim 1 , wherein a lateral surface of the heat-transfer structure is tilted so that the heat-transfer structure has a tapered shape.8. An electronic module comprising:a printed circuit board comprising a plurality of insulation layers, metal layers formed on the plurality of insulation layers, a via formed for interlayer electrical connection of the metal layers, a trench penetrating the insulation layers, and a heat-transfer structure formed in the trench; anda device mounted on the printed circuit board.9. The electronic module as set forth ...

Printed circuit board and method of manufacturing the same

There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board include a glass plate, an insulating member penetrating through the glass plate, insulating layers disposed on a first surface and a second surface of the glass plate, and a via through the insulating member.

Component Carrier Comprising at Least Two Components

A component carrier includes a stack with at least one electrically conductive layer structure and a plurality of electrically insulating layer structure, a first component, a second component, a central core in which both the first component and the second component are embedded. A first electrically insulating structure encapsulates the first component. A second electrically insulating structure encapsulates the second component. The first component and the second component are electrically connected to an external electrically conductive structure through at least one electrically conductive contact passing through the first electrically insulating structure and/or the second electrically insulating structure. 1. A component carrier , comprising:a stack comprising at least one electrically conductive layer structure and a plurality of electrically insulating layer structure;a first component;a second component;a central core in which both the first component and the second component are embedded;a first electrically insulating structure encapsulating the first component;a second electrically insulating structure encapsulating the second component;wherein the first component and the second component are electrically connected to an external electrically conductive structure through at least one electrically conductive contact passing through the first electrically insulating structure and/or the second electrically insulating structure.2. The component carrier according to claim 1 , wherein at least one of the first and the second components comprises at least one pad provided on a first main surface of the first or second component claim 1 , the at least one pad being electrically connected to the external electrically conductive structure and passes through the first electrically insulating structure and/or the second electrically insulating structure.3. The component carrier according claim 1 , wherein at least one of the first and the second components ...

Reduced pth pad for enabling core routing and substrate layer count reduction

Embodiments are directed to semiconductor packaging having reduced sized plated through hole (PTH) pads by eliminating the margin of the pad-to-PTH alignment and enabling finer traces on the core of the substrate.

Method for manufacturing ceramic-metal layer assembly, method for manufacturing ceramic circuit board, and metal-board-joined ceramic base material board

Provided is a method for manufacturing a metal-layer-joined ceramic base material board, in which at least one scribe line is formed, on each of the front and back surfaces of a ceramic base material board, along dividing lines for dividing the ceramic base material board into a plurality of ceramic boards, a metal board covering at least a portion of the dividing lines is joined to each of the front and back surface of the ceramic base material board, the metal boards are etched along the dividing lines to form a plurality of metal layers, and the plurality of metal layers are joined to each of the front and back surfaces of the ceramic base material board.

Overhang-Compensating Annular Plating Layer in Through Hole of Component Carrier

A component carrier with an electrically insulating layer having a front side and a back side, a first and a second electrically conductive layer covering the front side and the back side of the electrically insulating layer, respectively. A through hole extends through both electrically conductive layers and the electrically insulating layer. An overhang is formed along one of the electrically conductive layers and sidewalls of the electrically insulating layer structure delimiting the through hole. An annular plating layer covers the sidewalls and fills part of the overhang such that a horizontal extension of the overhang after plating is less than 20 μm and/or such that a ratio between a horizontal extension of the overhang after plating and a width of a first window through the first electrically conductive layer and/or a width of a second window through the second electrically conductive layer is smaller than 20%.

Low surface roughness substrate having a via and methods of making the same

Methods of forming a via in substrates include etching a damage region extending through a thickness of a stack of a plurality of substrates removably bonded together. Each of the substrates in the stack has at least one surface removably bonded to a surface of another substrate in the stack, wherein when the substrates in the stack are debonded, each substrate has at least one surface that has a surface roughness (Ra) of less than or equal to about 0.6 nm.

PRINTED CIRCUIT BOARD

A printed circuit board includes an insulating material and a circuit, formed on a surface of the insulating material. The circuit comprises a seed layer formed on the surface of the insulating material, an anti-reflection layer formed on the seed layer, and an electroplating layer formed on the anti-reflection layer. 1. A printed circuit board comprising:an insulating material; and a seed layer formed on the surface of the insulating material,', 'an anti-reflection layer formed on the seed layer, and', 'an electroplating layer formed on the anti-reflection layer., 'a circuit, formed on a surface of the insulating material, comprising'}2. The printed circuit board of claim 1 , wherein a thickness of the anti-reflection layer is smaller than a thickness of the seed layer.3. The printed circuit board of claim 1 , wherein the anti-reflection layer comprises films claim 1 , and{'sub': 2', '2, 'each of the films comprises either one or both of HfOand SiO.'}4. The printed circuit board of claim 3 , wherein the anti-reflection layer is formed by alternately stacking of the films comprising HfOand the films comprising SiO.5. The printed circuit board of claim 1 , wherein the surface of the insulating material is roughened.6. The printed circuit board of claim 5 , wherein the seed layer and the anti-reflection layer are formed along an undulating surface of the roughened surface.7. The printed circuit board of claim 5 , wherein the insulating material comprises a filler material.8. The printed circuit board of claim 7 , wherein the roughened surface of the insulating material undulates based on a shape of the filler material.9. The printed circuit board of claim 1 , further comprising:a via penetrating through the insulating material,wherein the seed layer and the anti-reflection layer extend along a side surface and a lower surface of the via.10. The printed circuit board of claim 9 , further comprising:a pad formed in a lower portion of the via,wherein the seed layer and ...

Method of manufacturing an intermediate product for an interposer and intermediate product for an interposer

A method of manufacturing an intermediate product for an interposer including a glass substrate having a plurality of through holes is provided. The method includes a step of forming a resin layer on a support substrate, and a step of forming a laminated body by adhering the glass substrate having the plurality of through holes on the resin layer. The glass substrate having the plurality of through holes has a thickness within a range of 0.05 mm to 0.3 mm.

Glass substrate assemblies having low dielectric properties

Glass substrate assemblies having low dielectric properties, electronic assemblies incorporating glass substrate assemblies, and methods of fabricating glass substrate assemblies are disclosed. In one embodiment, a substrate assembly includes a glass layer 110 having a first surface and a second surface, and a thickness of less than about 300 μm. The substrate assembly further includes a dielectric layer 120 disposed on at least one of the first surface or the second surface of the glass layer. The dielectric layer has a dielectric constant value of less than about 3.0 in response to electromagnetic radiation having a frequency of 10 GHz. In some embodiments, the glass layer is made of annealed glass such that the glass layer has a dielectric constant value of less than about 5.0 and a dissipation factor value of less than about 0.003 in response to electromagnetic radiation having a frequency of 10 GHz. An electrically conductive layer 142 is disposed on a surface of the dielectric layer, within the dielectric layer or under the dielectric layer.

INTERPOSER MANUFACTURING METHOD

A plurality of interposers are made from a material substrate. The material substrate includes a glass substrate partitioned by a plurality of crossing division lines to define a plurality of separate regions. A multilayer member is provided on a first surface or a second surface opposite to the first surface of the glass substrate and has an insulating layer and a wiring layer. An exposed surface of the multilayer member is cut along each division line by using a first cutting blade to form a cut groove on the exposed surface of the multilayer member, the cut groove having a depth not reaching the glass substrate. The glass substrate is cut along each cut groove by using a second cutting blade having a thickness smaller than the width of each cut groove to thereby divide the glass substrate and manufacture the plural interposers. 1. An interposer manufacturing method for manufacturing a plurality of interposers from a material substrate including a glass substrate having a first surface and a second surface opposite to said first surface and a multilayer member provided on said first surface or said second surface of said glass substrate , said glass substrate being partitioned by a plurality of crossing division lines to define a plurality of separate regions , said multilayer member including an insulating layer and a wiring layer , said interposer manufacturing method comprising:a cut groove forming step of cutting an exposed surface of said multilayer member along each division line by using a first cutting blade to thereby form a cut groove on said exposed surface of said multilayer member, said cut groove having a depth not reaching said glass substrate; anda dividing step of cutting said glass substrate along each cut groove by using a second cutting blade having a thickness smaller than the width of each cut groove to thereby divide said glass substrate and manufacture said plurality of interposers.2. The interposer manufacturing method according to claim 1 ...

Ceramic circuit board of laser plate copper and manufacturing method thereof

A ceramic circuit board of laser plate copper and manufacturing method thereof is provided. The method includes: providing a ceramic substrate; laser engraving, on a surface of the ceramic substrate, so as to form a circuit pattern of a plurality of groove structures; roughening and activating, on the surface of the ceramic substrate, by washing the surface of the ceramic substrate with a roughening and activating solution; and plating a metal layer, on the groove structures, so as to form a conductive loop defined by the circuit pattern.

WORK PIECES AND METHODS OF LASER DRILLING THROUGH HOLES IN SUBSTRATES USING AN EXIT SACRIFICIAL COVER LAYER

Work pieces and methods of forming through holes in substrates are disclosed. In one embodiment, a method of forming a through hole in a substrate by drilling includes affixing an exit sacrificial cover layer to a laser beam exit surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location for the through hole, and forming the through hole by repeatedly pulsing the laser beam into an entrance surface of the substrate and through a bulk of the substrate. The method further includes forming a hole in the exit sacrificial cover layer by repeatedly pulsing the laser beam into the through hole formed in the substrate such that the laser beam passes through the laser beam exit surface of the substrate and into the exit sacrificial cover layer. 119.-. (canceled)20. A work piece having through holes , the work piece comprising: the substrate comprises a laser beam entrance surface and a laser beam exit surface;', 'a longitudinal axis of each through hole extends from the laser beam entrance surface to the laser beam exit surface;', 'each through hole comprises an entrance diameter at the laser beam entrance surface of the substrate and an exit diameter at the laser beam exit surface;', 'the entrance diameter is less than about 40 μm; and', 'a ratio of the entrance diameter to the exit diameter is greater than about 0.7; and, 'a substrate having the through holes formed therein, whereinan exit sacrificial cover layer detachably affixed to the laser beam exit surface of the substrate, wherein the exit sacrificial cover layer has a different composition than the substrate, and the exit sacrificial cover layer comprises holes, each hole having a longitudinal axis aligned with the longitudinal axis of a corresponding through hole;wherein a thickness of the exit sacrificial cover layer is greater than about 100 μm.21. The work piece of claim 20 , wherein:a thickness of the substrate is less than ...

ADAPTER BOARD AND METHOD FOR MAKING ADAPTOR BOARD

Disclosure provides an adaptor board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface. 1. An adaptor board , characterized in that the adaptor board comprises a board body and a plurality of wires provided in the board body , and the board body comprises a first surface and a second surface arranged opposite the first surface; the first surface is provided with a plurality of first connection pads , and the second surface is , provided with a plurality of second connection pads; each of the first connection pads is connected to one of the second connection pads through a said one of the wires; the first connection pads have a first span , the plurality of second connection pads have a second span , and the first span is not equal to the second span.2. The adapter board according to claim 1 , wherein the plurality of wires have a third span claim 1 , the third span is greater than the first span of two connected first connection pads claim 1 , and smaller than the second span of two connected second connection pads.3. The adaptor board according to claim 2 , wherein the third span becomes smaller and smaller as the wires extend from the second connection pads to the first ...

REDISTRIBUTION PLATE

A single-layer redistribution plate functioning as a space translator between a device under testing (“DUT”) and a testing PCB may comprise a hard ceramic plate. A DUT side of the plate may have pads configured to interface with a device under testing. Both sides of the plate may comprise traces, vias, and pads to fan out the DUT pad pattern so that the plate side opposite the DUT side has spatially translated pads configured to interface with the pads on a testing PCB. Fabricating a redistribution plate may comprise calibrating and aligning, laser milling vias, laser milling trenches and pads, copper plating, grinding and polishing, removing residual copper, and coating the copper surfaces. 1. An apparatus comprising a circuit board substrate having a first side and a second side , wherein:the first side comprises a DUT pad and a DUT via;the greatest dimension of the DUT pad is less than 40 um;the greatest dimension of the DUT via is less than 40 um;the DUT pad is conductively connected by a first trace on the first side of the circuit board to a first via that goes through the circuit board and is conductively connected to a first test pad on the second side of the circuit board;the DUT via is conductively connected through the circuit board to a second trace on the second side of the circuit board, and the second trace is conductively connected to a second test pad on the second side of the circuit board;the area of the first test pad is at least twice the area of the DUT pad; andthe area of the second test pad is at least twice the area of the DUT via.2. A method for fabricating a redistribution plate , comprising:fabricating a first via and a second via in a substrate plate having a first side and a second side, wherein the first via and the second via both go through the substrate plate;fabricating a trace conductively connecting the first via on the second side to a pad;fabricate a trace conductively connecting the second via on the first side to a pad; A ...

SUBSTRATE MANUFACTURE

The invention relates to a method of forming a void with a circular cross section in a substrate, more particularly to forming through holes electronic substrates The method comprising the steps of causing a laser cutter to traverse in an arc to an intended circumference of the void, traversing the intended circumference of the void at least once, wherein the lead in from the arc to the circumference comprises a radius. 1. A method of forming a void with a circular cross section in a substrate , said method comprising:causing a laser cutter to traverse in an arc to an intended circumference of the void; andtraversing the intended circumference of the void at least once;wherein the lead in from the arc to the circumference comprises a radius.2. A method according to claim 1 , wherein the laser cutter is traversed in a spiral pattern towards the circumference of the void.3. A method according to claim 1 , wherein said substrate is selected from a ceramic claim 1 , polymer or composite material.4. A method according to claim 3 , wherein the ceramic is aluminium nitride.5. A method according to claim 1 , wherein said laser cutter is a carbon dioxide laser with an assist gas.6. A method according to claim 1 , wherein said laser cutter starts from the centre of the intended circumference of the void.7. A method according to claim 1 , wherein said laser cutter ends at the centre of the intended circumference of the void.8. A method according to claim 1 , wherein the intended circumference of the void is traversed in the range of from 1 to 4 times.9. A method according to claim 1 , wherein the void has an inner wall slope of between 0 and 20 degrees.10. A method according to claim 9 , wherein the void has a frustroconical shape.11. A method according to claim 1 , wherein the intended circumference of the void is traversed in the range of from 2 to 4 times.12. A method according to claim 1 , wherein the intended circumference of the void is traversed in 2 times.13. A method ...

METHOD OF MANUFACTURING AN INTERMEDIATE PRODUCT FOR AN INTERPOSER AND INTERMEDIATE PRODUCT FOR AN INTERPOSER

A method of manufacturing an intermediate product for an interposer including a glass substrate having a plurality of through holes is provided. The method includes a step of forming a resin layer on a support substrate, and a step of forming a laminated body by adhering the glass substrate having the plurality of through holes on the resin layer. The glass substrate having the plurality of through holes has a thickness within a range of 0.05 mm to 0.3 mm. 2. The method according to claim 1 , wherein the through holes are formed by irradiating laser light on the glass substrate.3. The method according to claim 1 , wherein a maximum size of an opening of at least one of the through holes at a surface of the glass substrate on an opposite side of the resin layer is from 5 μm to 100 μm.4. The method according to claim 1 , wherein the through holes are formed on the glass substrate at a pitch of from 10 μm to 500 μm.5. (canceled)6. The method according to claim 1 , wherein the binding layer has release characteristics with respect to the glass substrate.7. (canceled)8. The method according to claim 1 , further comprising:filling at least one of the through holes of the glass substrate with a conductive material after the adhering of the glass substrate on the binding layer.9. The method according to claim 8 , further comprising:forming a conductive wiring pattern on a surface of the glass substrate on an opposite side of the resin layer, wherein the conductive wiring pattern is electrically connected to the conductive material filled in the at least one of the through holes.10. The method according to claim 8 , further comprising:separating the binding layer and the glass substrate from each other.11. An intermediate product for a glass substrate with via electrode claim 8 , comprising:a glass substrate having a plurality of through holes;a support substrate; anda binding layer arranged between the support substrate and the glass substrate for binding together the ...

METHOD OF MANUFACTURING COMPOSITE CIRCUIT BOARD AND COMPOSITE CIRCUIT BOARD

A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window. 1. A method of manufacturing a composite circuit board , the method comprising:providing a composite circuit board unit comprising a first adhesive material layer, a first circuit layer located on one side of the first adhesive material layer, and a second circuit layer located on another side of the first adhesive material layer, the first circuit layer comprising a first inner conductive circuit and a first outer conductive circuit located at both ends of the first inner conductive circuit, and the second circuit layer comprising a second inner conductive circuit and a second outer conductive circuit located at both ends of the second inner conductive circuit;forming a first metal protection layer on a surface of the first inner conductive circuit, and forming a second metal protection layer on a surface of the second inner conductive circuit;forming a first solder mask and a second solder mask respectively on a portion of a surface of the first metal protection layer and a portion of a surface of the second metal protection layer, the first solder mask defining a first opening revealing a portion of the first metal protective layer, the second solder mask defining a second opening revealing a portion of the second metal protective layer;providing two second adhesive material layers, each of the two second adhesive material layers defining a third opening, a size of the third opening being smaller than a size of the ...

MANUFACTURING METHOD OF DISPLAY DEVICE, AND DISPLAY DEVICE

A manufacturing method of a display device includes locating a base member on a support substrate; and removing a part of the support substrate by preventing a first surface portion having a predetermined region in a border plane between the support substrate and the base member from being irradiated with laser light through the support substrate, whereas irradiating a second surface portion, other than the predetermined region, in the border plane between the support substrate and the base member with the laser light through the support substrate. 1. A manufacturing method of a display device , comprising:locating a base member on a support substrate; andremoving a part of the support substrate by preventing a first surface portion having a predetermined region in a border plane between the support substrate and the base member from being irradiated with laser light through the support substrate, whereas irradiating a second surface portion, other than the predetermined region, in the border plane between the support substrate and the base member with the laser light through the support substrate.2. The manufacturing method of a display device according to claim 1 , further comprising claim 1 , after locating the base member on the support substrate but before irradiating the second surface portion with the laser light:attaching an electronic element to the base member; andbonding the electronic element, the base member and the support substrate together.3. The manufacturing method of a display device according to claim 2 , further comprising claim 2 , after bonding the electronic element claim 2 , the base member and the support substrate together but before irradiating the second surface portion with the laser light:forming a scribe line in a surface of the support substrate at a position on the side of the second surface portion and away from a border between the second surface portion and the first surface portion by a predetermined distance.4. The ...

Methods of Continuous Fabrication of Features in Flexible Substrate Webs and Products Relating to the Same

Methods of continuous fabrication of features in flexible substrates are disclosed. In one embodiment, a method of fabricating features in a substrate web includes providing the substrate web arranged in a first spool on a first spool assembly, advancing the substrate web from the first spool and through a laser processing assembly comprising a laser, and creating a plurality of defects within the substrate web using the laser. The method further includes advancing the substrate web through an etching assembly and etching the substrate web at the etching assembly to remove glass material at the plurality of defects, thereby forming a plurality of features in the substrate web. The method further includes rolling the substrate web into a final spool. 1. A method of fabricating features in a substrate web , the method comprising:advancing the substrate web from a first spool;advancing the substrate web through a laser processing assembly comprising a laser;creating a plurality of defects within the substrate web using the laser;advancing the substrate web through an etching assembly;etching the substrate web at the etching assembly to remove material at the plurality of defects, thereby forming a plurality of features in the substrate web; androlling the substrate web into a final spool.2. The method of claim 1 , wherein the substrate web comprises a glass substrate web claim 1 , a glass-ceramic substrate web claim 1 , or a ceramic substrate web.3. (canceled)4. The method of claim 1 , further comprising claim 1 , prior to advancing the substrate web through the etching assembly claim 1 , rolling the substrate web into an intermediate spool claim 1 , and advancing the substrate web from the intermediate spool toward the etching assembly.5. The method of claim 1 , further comprising claim 1 , prior to advancing the substrate web through the etching assembly claim 1 , rolling the substrate web into an intermediate spool claim 1 , and after advancing the substrate web ...

METHOD FOR MANUFACTURING A DOUBLE-SIDED PRINTED CIRCUIT BOARD

The method for manufacturing printed circuit boards includes providing through hole vias in a non-conductive substrate at given coordinates in a printed circuit board topology, then an adhesive undercoat, a conductive layer and a metal mask layer are applied, in a single process, to the surface of the substrate and to the walls of the vias. A soluble protective layer is applied to the mask layer and to the walls of the vias, then a circuit board pattern is formed by laser evaporation, then the conductive layer and the adhesive undercoat in the regions exposed by laser evaporation are removed by selective chemical etching. The protective layer is removed from the regions that are not exposed by laser evaporation and the vias, then the metal mask layer is removed. Finally, a protective barrier layer and a layer that provides solderability and/or weldability of the surface are applied. 1. A method for manufacturing a double-sided printed circuit board , said method comprising the steps of:assembling via through-holes according to given coordinates of a PCB layout in a non-conductive substrate;depositing an adhesion sub-layer, a conductive layer and a metal mask layer onto the substrate on two sides of the substrate and on walls of said via through-holes;applying a soluble protective layer, said soluble protective layer being stable toward chemical etchants, onto the mask layer on the substrate;forming a PCB pattern by laser evaporation of at least the protective layer and the mask layer in regions that are not occupied by conductive traces;removing the conductive layer and the adhesion sub-layer in regions not occupied by conductive traces by selective chemical etching;removing the protective layer from conductive traces and in said via through-holes by using a solvent;removing the metal mask layer from conductive traces and in said via through-holes by selective chemical etching; andapplying a protective barrier layer and a layer enabling solderability and/or ...

PROCESS FOR METALLIZING A COMPONENT

The present invention relates to a process for producing one or more electrical contacts on a component, comprising (a) applying one or more coatings on the component, where at least one of the coatings is a coating of an electrically conductive material, (b) applying a self-passivating metal or semiconductor and/or a dielectric material on the coated component, (c) structuring the passivating coating by laser treatment or etching, (d) contacting the structured coating with an electroplating bath, (e) etching the regions not covered with the galvanically deposited metal. 1. A process for producing one or more electrical contacts on a component having a front side and a back side , comprising the following steps:(a) applying one or more coatings on the front side and/or back side of the component to obtain a coated component, where at least one of the coatings is a coating of an electrically conductive material,(b) applying a self-passivating metal or semiconductor and/or a dielectric material on the coated component to obtain a passivating coating,(c) treating defined regions of the passivating coating with a laser or by etching to obtain a structured coating,(d) contacting the structured coating with an electroplating bath, wherein a metal is galvanically deposited in the regions treated with the laser or the etching medium,(e) etching the regions not covered with the galvanically deposited metal until the front side and/or back side of the component has been exposed in these regions.2. The process as claimed in claim 1 , wherein the component is an electrical component claim 1 , especially a solar cell or a precursor of a solar cell claim 1 , a light-emitting diode or a precursor of a light-emitting diode claim 1 , or a precursor of a printed circuit board.3. The process as claimed in claim 2 , wherein the solar cell is a heterojunction solar cell.4. The process as claimed in claim 1 , wherein the electrically conductive material of the coating in step (a) is a ...

Conductive glass substrate, and system and method for manufacturing the same

A conductive glass substrate, and a system and a method for manufacturing the same are provided. The conductive glass substrate includes a glass substrate structure, a conductive base structure and a conductive extending structure. The glass substrate structure includes at least one through hole connected between a bottom surface and a top surface thereof. The conductive base structure is disposed on the bottom surface of the glass substrate structure. The conductive extending structure is electrically connected to the conductive base structure, and the conductive extending structure is extended from the conductive base structure to the top surface of the glass substrate structure along an inner surface of the at least one through hole. Hence, the conductive glass substrate can provide at least one conductive via so as to electrically connect an upper circuit and a lower circuit.

GLASS INTERPOSER WITH EMBEDDED THERMOELECTRIC DEVICES

The present invention relates generally to integrated circuit (IC) chip packaging, and more particularly, to a structure and method of forming a glass interposer having one or more embedded peltier devices, alongside electrically conductive vias, to help dissipate heat from one or more IC chips in a multi-dimensional chip package through the glass interposer and into an organic carrier, where it can be dissipated into an underlying substrate. 1. A method comprising:forming vias in a glass interposer;forming an embedded peltier device in two adjacent vias; anddepositing an electrically conductive material in an additional via, on the embedded peltier device, and on the glass interposer.2. The method of claim 1 , wherein the forming vias in the glass interposer comprises:etching an entire thickness of the glass interposer.3. The method of claim 1 , wherein the forming vias in the glass interposer comprises:etching the glass interposer to form an opening that extends only through an upper portion of the glass interposer, such that the vias have a bottom that is separated from a bottom surface of the glass interposer by a lower portion of the glass interposer.4. The method of claim 3 , further comprising:removing the lower portion of the glass interposer to expose the bottom of the vias;forming a bottom seed layer on an exposed portion of the glass interposer and the exposed bottom vias;forming a bottom conductive material on the bottom seed layer;forming an opening in the bottom conductive material and the bottom seed layer;forming an insulator in the opening and on the bottom conductive material; andforming a solder connection on the bottom conductive material.5. The method of claim 1 , wherein the depositing the electrically conductive material in the additional via claim 1 , on the embedded peltier device claim 1 , and on the glass interposer comprises:forming a seed layer on exposed surfaces of the glass interposer and the embedded peltier device; andforming a ...

METHOD OF MANUFACTURING GLASS SUBSTRATE THAT HAS THROUGH HOLE, METHOD OF FORMING THROUGH HOLE IN GLASS SUBSTRATE AND SYSTEM FOR MANUFACTURING GLASS SUBSTRATE THAT HAS THROUGH HOLE

A method of manufacturing a glass substrate that has a through hole, includes (1) forming an initial hole in a glass substrate by irradiating laser light from a first surface side of the glass substrate; (2) performing a first etching process using a first etching solution to form, from the initial hole, a first through hole that extends from a first opening formed at a first surface to a second opening formed at a second surface, and to make a ratio “d/R” of a thickness “d” of the glass substrate with respect to a diameter “R” of the first opening to be within a range between 10 to 20; and (3) performing a second etching process to enlarge the first through hole using a second etching solution, whose etching rate with respect to the glass substrate is faster than that of the first etching solution. 1. A method of manufacturing a glass substrate that has a through hole , comprising:(1) forming an initial hole in a glass substrate, having first and second surfaces opposing each other, by irradiating laser light from a first surface side of the glass substrate;{'sub': 1', 't1', '1', 't1, '(2) performing a first etching process on the glass substrate using a first etching solution to form, from the initial hole, a first through hole that extends from a first opening formed at the first surface to a second opening formed at the second surface, and to make a ratio “d/R” of a thickness “d” of the glass substrate with respect to a diameter “R” of the first opening to be within a range between 10 to 20; and'}(3) after performing the step (2), performing a second etching process on the glass substrate to enlarge the first through hole using a second etching solution, whose etching rate with respect to the glass substrate is faster than an etching rate of the first etching solution with respect to the glass substrate.2. The method of manufacturing the glass substrate that has the through hole according to claim 1 , wherein a ratio “V/V” of an etching rate “V” of the second ...

PRINTED WIRING BOARD

A printed wiring board includes a laminated structure including insulating layers, and conductive layers laminated on the insulating layer, respectively, such that the conductive layers include an outermost conductive layer having a radiation slot, and an inner-side conductive layer having an excitation portion facing the radiation slot in a lamination direction. The laminated structure has a recess portion recessed from the radiation slot toward the excitation portion such that a bottom surface of the recess portion is positioned between the outermost conductive layer and the excitation portion, and the insulating layers include an insulating layer having at least a portion covering the excitation portion. 1. A printed wiring board , comprising:a laminated structure comprising a plurality of insulating layers, and a plurality of conductive layers laminated on the insulating layer, respectively, such that the plurality of conductive layers includes an outermost conductive layer having a radiation slot, and an inner-side conductive layer having an excitation portion facing the radiation slot in a lamination direction,wherein the laminated structure has a recess portion recessed from the radiation slot toward the excitation portion such that a bottom surface of the recess portion is positioned between the outermost conductive layer and the excitation portion, and the plurality of insulating layers includes an insulating layer having at least a portion covering the excitation portion.2. The printed wiring board according to claim 1 , wherein the laminated structure is formed such that the bottom surface of the recess portion is formed in middle of the insulating layer in a thickness direction.3. The printed wiring board according to claim 1 , wherein the laminated structure is formed such that at least one of the insulating layers including the insulating layer is remaining between the bottom surface of the recess portion and the excitation portion.4. The printed ...

METHOD OF MANUFACTURING GLASS COMPONENT, GLASS COMPONENT, AND GLASS INTERPOSER

A method of manufacturing a glass component includes preparing a glass substrate having a thickness greater than or equal to 300 μm, forming first electric wires on a first surface of the glass substrate, forming a structure by joining the glass substrate via a resin layer to a support substrate such that the first surface of the glass substrate faces the resin layer, thinning the glass substrate from a second surface of the glass substrate to a thickness between 10 μm and 80 μm, forming through holes in the glass substrate by irradiating the glass substrate from the second surface with a laser beam, forming second electric wires on the second surface of the glass substrate such that the second electric wires are electrically connected to the corresponding first electric wires via conductors filling the through holes, and separating the glass substrate from the support substrate. 1. A method of manufacturing a glass component , the method comprising in the following order:preparing a glass substrate including a first surface and a second surface and having a thickness greater than or equal to 300 μm;forming first electric wires on the first surface of the glass substrate;forming a structure by joining the glass substrate via a resin layer to a support substrate such that the first surface of the glass substrate faces the resin layer;thinning the glass substrate from the second surface to a thickness between 10 μm and 80 μm;forming through holes in the glass substrate by irradiating the glass substrate from the second surface with a laser beam;forming second electric wires on the second surface of the glass substrate such that the second electric wires are electrically connected to the corresponding first electric wires via conductors filling the through holes; andseparating the glass substrate from the support substrate.2. The method as claimed in claim 1 , wherein the forming of the first electric wires includesforming a first seed layer on the first surface of the ...

WORK PIECES AND METHODS OF LASER DRILLING THROUGH HOLES IN SUBSTRATES USING AN EXIT SACRIFICIAL COVER LAYER

Work pieces and methods of forming through holes in substrates are disclosed. In one embodiment, a method of forming a through hole in a substrate by drilling includes affixing an exit sacrificial cover layer to a laser beam exit surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location for the through hole, and forming the through hole by repeatedly pulsing the laser beam into an entrance surface of the substrate and through a bulk of the substrate. The method further includes forming a hole in the exit sacrificial cover layer by repeatedly pulsing the laser beam into the through hole formed in the substrate such that the laser beam passes through the laser beam exit surface of the substrate and into the exit sacrificial cover layer. 1. A method of forming a through hole in a substrate by drilling , the method comprising:affixing an exit sacrificial cover layer to a laser beam exit surface of the substrate;positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location for the through hole;forming the through hole by repeatedly pulsing the laser beam into an entrance surface of the substrate and through a bulk of the substrate; andforming a hole in the exit sacrificial cover layer by repeatedly pulsing the laser beam into the through hole formed in the substrate such that the laser beam passes through the laser beam exit surface of the substrate and into the exit sacrificial cover layer.2. The method of claim 1 , wherein a thickness of the exit sacrificial cover layer is greater than about 100 μm.3. The method of claim 1 , wherein:the laser beam is pulsed through the substrate and the exit sacrificial cover layer such that the through hole of the substrate has an entrance diameter and an exit diameter;the method further comprises etching the substrate with an etching solution; anda ratio between the exit diameter and the ...

GLASS SUBSTRATE AND MANUFACTURING METHOD OF GLASS SUBSTRATE

A glass substrate having a plurality of holes includes a first surface and a second surface, which are opposite to each other. Each of the holes is arranged so as to have an aperture on the first surface. The plurality of holes includes a first hole group including a plurality of first holes having a first aperture diameter including a first variation, and a second hole group including a second hole or a plurality of second holes having a second aperture diameter including a second variation. Each of the first holes has an aspect ratio of greater than 1, and a surface roughness on an inner wall (arithmetic average roughness Ra) of less than 0.1 μm. The second aperture diameter is greater than the first aperture diameter by 15% or more, or less than the first aperture diameter by 15% or more. 1. A glass substrate having a plurality of holes , comprising:a first surface; anda second surface, the first surface and the second surface being opposite to each other,wherein each of the holes is arranged so as to have an aperture on the first surface,wherein the plurality of holes includes a first hole group and a second hole group,{'sub': '1', 'wherein the first hole group includes a plurality of first holes having a first aperture diameter ϕincluding a first variation, on the first surface,'}{'sub': '2', 'wherein the second hole group includes a second hole or a plurality of second holes having a second aperture diameter ϕincluding a second variation, on the first surface,'}wherein each of the first holes has an aspect ratio of greater than 1, and a surface roughness on an inner wall (arithmetic average roughness Ra) of less than 0.1 μm, and{'sub': 2', '1', '1, 'wherein the second aperture diameter ϕis greater than the first aperture diameter ϕby 15% or more, or less than the first aperture diameter ϕby 15% or more.'}2. The glass substrate according to claim 1 ,wherein the second holes are holes for position alignment or holes for display marks.3. The glass substrate ...

MULTI-PIECE WIRING SUBSTRATE, WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING MULTI-PIECE WIRING SUBSTRATE

A multi-piece wiring substrate includes a matrix substrate provided with dividing grooves arranged along boundaries of wiring substrate regions in a first principal face and a second principal face, the dividing grooves including first dividing grooves, second dividing grooves, third dividing grooves, and fourth dividing grooves, depths of the first dividing grooves and depths of the second dividing grooves being set to be greater than depths of the third dividing grooves and depths of the fourth dividing grooves, first curved parts being provided so that the depths of the third dividing grooves gradually increase as going toward respective corners of the wiring substrate regions, and second curved parts being provided so that the depths of the fourth dividing grooves gradually increase as going toward the respective corners of the wiring substrate regions. 1. A multi-piece wiring substrate , comprising:a matrix substrate including a first principal face and a second principal face opposite to the first principal face, the matrix substrate being provided with a plurality of wiring substrate regions,the matrix substrate being provided with dividing grooves arranged along boundaries of the wiring substrate regions in the first principal face and the second principal face, first dividing grooves located along respective first sides of the wiring substrate regions in the first principal face,', 'second dividing grooves arranged in the second principal face so as to be opposite to the first dividing grooves, respectively,', 'third dividing grooves located along respective second sides of the wiring substrate regions in the first principal face, and', 'fourth dividing grooves arranged in the second principal face so as to be opposite to the third dividing grooves, respectively,, 'the dividing grooves including'}depths of the first dividing grooves and depths of the second dividing grooves being set to be greater than depths of the third dividing grooves and depths of the ...

MANUFACTURING METHOD OF GLASS SUBSTRATE AND GLASS SUBSTRATE

A manufacturing method of a glass substrate having through holes includes 1. A manufacturing method of a glass substrate having through holes , comprising:(i) irradiating at a through hole forming target position on a first surface of the glass substrate with a laser light; and(ii) performing a wet etching treatment on the glass substrate,wherein during the wet etching treatment being performed on the glass substrate, an ultrasonic vibration with a frequency of less than 40 kHz is applied to an etchant over at least a part of a wet etching period, referred to as an ultrasonic vibration application period.2. The manufacturing method according to claim 1 ,{'sub': 'f', 'wherein the wet etching treatment starts at time 0 and ends at time t, and'}{'sub': 'f', 'wherein the application of the ultrasonic vibration is performed over at least a period from the time 0 to the time 0.5 t.'}3. The manufacturing method according to claim 1 ,wherein during the wet etching treatment being performed on the glass substrate, the glass substrate is subjected to the wet etching treatment at an etching speed that is less than or equal to 0.3 μm/minute.4. The manufacturing method according to claim 1 ,wherein during the ultrasonic vibration is applied to the etchant, an oscillatory motion is applied to the glass substrate.5. The manufacturing method according to claim 1 ,wherein the laser light is a pulsed laser with a pulse width of 100 nsec or less.6. The manufacturing method according to claim 1 ,wherein during the through hole forming target position being irradiated with the laser light, an initial through hole having a first aperture is formed at the through hole forming target position, andwherein after performing the wet etching treatment on the glass substrate, a through hole is formed from the initial through hole.7. The manufacturing method according to claim 6 ,{'sub': '1', 'wherein the through hole has a first aperture with a diameter of ϕon the first surface of the glass ...

Laser cutting of metal-ceramic substrates

The present application relates to a method of laser ablation of a metal-ceramic substrate, in which a laser is used under process conditions in which the formation of solid metal particles on the metal-ceramic substrate, which can separate from metal particles released by laser ablation near the ablation edge, is essentially avoided. Further the present application relates to a ceramic-metal substrate comprising a ceramic substrate and a metallization on at least one side of the ceramic substrate, wherein the ceramic substrate and the metallization have flush cutting edge.

Device mounting board, semiconductor module, mobile device, and manufacturing method of device mounting board

A device mounting board is provided with: a substrate structural unit including a substrate made of a composition containing amorphous silicon, a first adhesive layer provided on one of the main surfaces of the substrate, and a second adhesive layer provided on the other main surface of the substrate; a first wiring layer provided on the main surface of the first adhesive layer on the opposite side from the substrate; a second wiring layer provided on the main surface of the second adhesive layer on the opposite side from the substrate; and a via conductor, which is provided in a via hole that penetrates the substrate, the first adhesive layer, and the second adhesive layer, which electrically connects the first wiring layer and the second wiring layer.

Heat-conductive metal ceramic composite material panel system for improved heat dissipation

For use as a substrate for a heat generating microelectronic integrated circuit, a ceramic panel is provided having small thickness in comparison to its length and breadth, having on at least the surface opposite the one bearing the microelectronic integrated circuit, a layer of heat conductive metal and having a plurality of closely spaced, small cross section extensions of the heat conductive metal layer extending into the ceramic material to a depth of at least about one fifth of its thickness. The substrate is particularly useful for the mounting of hybrid microelectronic circuits to improve the heat dissipation capability of the ceramic substrate.

Printed circuit board, printed circuit board strip and manufacturing method thereof

본 발명은 코어부와 코어부의 적어도 일면에 형성된 도체 패턴을 포함하는 인쇄회로기판에 있어서, 코어부는 유리 코어를 포함하고, 유리 코어의 측면부는 화학적으로 연마된 인쇄회로기판 및 그 제조방법에 관한 것이다. The present invention relates to a printed circuit board comprising a core portion and a conductor pattern formed on at least one side of the core portion, the core portion including a glass core, the side portion of the glass core being chemically polished, and a method of manufacturing the same .

Hermetic metallized via with improved reliability

An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of −40° C. and heating the article to a temperature of 125° C., and the article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 100 hours of HAST at a temperature of 130° C. and a relative humidity of 85%.

Apparatus for separating non-metallic substrates

An apparatus for physically separating non-metallic substrates by forming a microcrack in the substrate and controlling propagating the microcrack. An initial mechanical or pulsed laser scribing device forms a microcrack in the substrate. If a pulsed laser is used, it forms a crack in the substrate between its top and bottom surf. A scribe beam is applied onto the substrate on a separation line. A helium coolant stream intersets with, or is adjacent to, the trailing edge of the scribe beam. The temperature differential between the heat affected zone of the substrate and the coolant stream propagates the microcrack. Two breaking beams on opposing sides of the separation line follow the coolant stream. The breaking beams create controlled tensile forces that extend the crack to the bottom surface of the substrate for full separation. The scribe and break beams and coolant stream are simultaneously moved relative to the substrate. A preheat beam preheats the heat affected area on the substrate. The beams are formed by an arrangement of lases and mirrors and lenses. A movable mirror selectively diverts a beam to form either the preheat beam or one or more of the break and scribe beams. Spherical aberration is introduced in the break and scribe beams to flatten their energy distribution profiles and evenly apply the beam energy. A supplement a mechanical force, applied by vertically movable wheels or by restraining the substrate against a curved frame, creates a bending moment to facilitate the separation process.

Method for machining ceramic green sheet and apparatus for machining the same

Interposer and method for making holes in an interposer

Interposer zur elektrischen Verbindung zwischen einem CPU-Chip und einer Schaltungsplatte, mit folgenden Merkmalen: ein plattenförmiges Basissubstrat (1) aus Glas mit einer ersten und einer zweiten Plattenseite; das Basissubstrat (1) weist einen Wärmeausdehnungskoeffizienten im Bereich zwischen 3,1·10–6/°C und 3,4·10–6/°C auf; das Basissubstrat weist Löcher (12) quer zu den Plattenseiten in einer Anzahl auf, die im Bereich zwischen 10 und 10.000 cm–2 liegt; es gibt Löcher (12) mit Durchmessern, die im Bereich zwischen 20 μm und 200 μm liegen können; der Abstand der Löcher (12), gemessen von Lochmitte zu Lochmitte, liegt im Bereich zwischen 50 μm und 700 μm; auf der ersten Plattenseite verlaufen Leiterbahnen (13), die sich jeweils bis in die Löcher (12) hinein und durch diese hindurch (14) auf die zweite Plattenseite erstrecken, um Anschlusspunkte für den CPU-Chip zu bilden. Interposer for the electrical connection between a CPU chip and a circuit board, having the following features: a plate-shaped base substrate (1) made of glass with a first and a second plate side; the base substrate (1) has a coefficient of thermal expansion in the range between 3.1 · 10-6 / ° C and 3.4 · 10-6 / ° C; the base substrate has holes (12) across the plate sides in a number ranging from 10 to 10,000 cm-2; there are holes (12) with diameters that can range between 20 μm and 200 μm; the distance between the holes (12), measured from the center of the hole to the center of the hole, is in the range between 50 μm and 700 μm; Conductor tracks (13) run on the first side of the board, each extending into the holes (12) and through them (14) to the second side of the board in order to form connection points for the CPU chip.

Methods for forming vias in glass substrates

Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.

Method for machining ceramic green sheet

A plurality of feedthrough holes are efficiently formed on the present invention by splitting a laser beam emitted from a laser source into plural laser beams by allowing the beam to pass through a diffraction grating, followed by simultaneously forming a plurality of the feedthrough holes on the ceramic green sheet by irradiating the ceramic green sheet with the split laser beam.

Laser method for machining through holes in a ceramic green sheet

Method for introducing at least one cutout or aperture into a sheetlike workpiece

Glass substrate assemblies having low dielectric properties

Glass substrate assemblies having low dielectric properties, electronic assemblies incorporating glass substrate assemblies, and methods of fabricating glass substrate assemblies are disclosed. In one embodiment, a substrate assembly includes a glass layer 110 having a first surface and a second surface, and a thickness of less than about 300 μιη. The substrate assembly further includes a dielectric layer 120 disposed on at least one of the first surface or the second surface of the glass layer. The dielectric layer has a dielectric constant value of less than about 3.0 in response to electromagnetic radiation having a frequency of 10 GHz. In some embodiments, the glass layer is made of annealed glass such that the glass layer has a dielectric constant value of less than about 5.0 and a dissipation factor value of less than about 0.003 in response to electromagnetic radiation having a frequency of 10 GHz. An electrically conductive layer 142 is disposed on a surface of the dielectric layer, within the dielectric layer or under the dielectric layer.

Method of manufacturing glass substrate that has through hole, method of forming through hole in glass substrate and system for manufacturing glass substrate that has through hole

A method of manufacturing a glass substrate that has a through hole, includes (1) forming an initial hole in a glass substrate by irradiating laser light from a first surface side of the glass substrate; (2) performing a first etching process using a first etching solution to form, from the initial hole, a first through hole that extends from a first opening formed at a first surface to a second opening formed at a second surface, and to make a ratio “d 1 /R t1 ” of a thickness “d 1 ” of the glass substrate with respect to a diameter “R t1 ” of the first opening to be within a range between 10 to 20; and (3) performing a second etching process to enlarge the first through hole using a second etching solution, whose etching rate with respect to the glass substrate is faster than that of the first etching solution.

Low surface roughness substrate having a via and methods of making the same

在基板中形成通孔的方法包括蝕刻損傷區域，損傷區域延伸通過可移除地黏結在一起的複數個基板的堆疊之厚度。堆疊中各個基板具有至少一個表面可移除地黏結至堆疊中另一基板的表面，其中當堆疊中的基板脫黏時，各個基板具有至少一個表面的表面粗糙度(Ra)小於或等於約0.6 nm。

Glass substrate and manufacturing method of glass substrate

Glass substrate and glass substrate for high frequency device

A glass substrate includes a plurality of through holes that penetrate from a first surface to a second surface of the glass substrate. Each through hole has an upper aperture with a first diameter on the first surface and a lower aperture with a second diameter on the second surface. For each of ten through holes selected from the plurality of through holes, a side wall length is obtained from the first and second diameters and the thickness of the glass substrate, and an R value is obtained by dividing the side wall length by the thickness of the glass substrate. The R values fall within a range of 1 to 1.1. A B value, obtained from dividing a difference between the greatest R value and the smallest R value by an average of the R values followed by multiplication with 100, is 5% or less.

Manufacture of metallic conductor tracks on glass

Die vorliegende Erfindung betrifft ein Verfahren zur Herstellung von Glasträgern mit Leiterbahnen aus Metall. Die Glasträger weisen Ausnehmungen auf, die Mikrostrukturen bilden, wobei in den Ausnehmungen Metall angeordnet ist und auf der Oberfläche des Glasträgers, von der sich die Ausnehmungen in das Volumen des Glasträgers erstrecken, im Wesentlichen kein Metall vorliegt The present invention relates to a method for producing glass supports with metal conductor tracks. The glass carriers have recesses which form microstructures, metal being arranged in the recesses and essentially no metal being present on the surface of the glass carrier from which the recesses extend into the volume of the glass carrier

Laser processing method

Method for forming duct in glass baseplate

本发明涉及一种通过激光钻孔和酸蚀刻在玻璃基材中形成孔道的方法。在一种实施方式中，一种在玻璃基材中形成孔道的方法包括从玻璃基材的入射表面利用激光钻过该玻璃基材的厚度的至少一部分以形成孔道。本方法还包括对该玻璃基材进行一段蚀刻时间的蚀刻，以增加该孔道的入射开口的直径，并在蚀刻时间的至少一部分内对该玻璃基材施加超声波能量。所施加的超声波能量的频率为40kHz～192kHz。

Interposer and method for producing holes in an interposer

CPU 칩과 회로 기판 사이의 전기 접속을 위한 인터포저가 제공된다. 유리로 형성된 보드 형상 베이스 기판(1)은 열팽창 계수가 3.1·10 -6　 /K 내지 3.4·10 -6　 범위이고, 구멍(12)의 갯수가 10개 내지 10, 000개 cm -2 범위이다. 구멍(12)은 20 ㎛ 내지 200 ㎛ 범위일 수 있는 직경을 갖는다. 보드의 일면 상에서 전도성 트랙(13)이 연장되고, 칩에 대한 접속 지점을 형성하기 위해 상기 전도성 트랙은 각각의 구멍(12)으로 바로 뻗고, 이 구멍을 통하여 보드의 다른 면으로 뻗는다.

Overhang compensation annular coating in through-hole of component carrier

一种部件承载件，包括：具有前侧和后侧的电绝缘层结构；覆盖电绝缘层结构的前侧的第一导电层结构；覆盖电绝缘层结构的后侧的第二导电层结构；延伸穿过第一导电层结构、电绝缘层结构和第二导电层结构的通孔，其中，在一方面的第一导电层结构与第二导电层结构中的至少一者与另一方面的电绝缘层结构的对通孔进行限界的侧壁之间形成悬伸部；以及环形镀层，该环形镀层覆盖侧壁并且填充悬伸部的至少一部分，使得悬伸部的在镀覆之后的水平延伸部小于20μm，和/或使得一方面的悬伸部的在镀覆之后的水平延伸部与另一方面的延伸穿过第一导电层结构的第一窗口的宽度和/或延伸穿过第二导电层结构的第二窗口的宽度之间的比率小于20％。

Substrate cutting appartus and method for cutting substrate using the same

본 발명은 기판 절단 장치 및 이를 이용한 기판 절단 방법에 관한 것으로서, 본 발명의 실시예에 따른 기판 절단 장치는 가상의 절단 라인을 따라 절단될 기판을 지지하는 스테이지부와, 상기 절단 라인을 따라 상기 기판의 일부를 가열하기 위한 레이저빔을 방출하는 레이저 발생부와, 상기 레이저빔의 광경로 상에 배치되어 상기 절단 라인으로 향하는 상기 레이저빔의 경사각을 흔들어 광스윙시키는 광스윙부, 그리고 상기 레이저빔에 의해 가열된 상기 기판을 냉각시키는 냉각부를 포함한다. The present invention relates to a substrate cutting apparatus and a substrate cutting method using the same. According to an embodiment of the present invention, a substrate cutting apparatus includes a stage unit supporting a substrate to be cut along a virtual cutting line, and the substrate along the cutting line. A laser generator for emitting a laser beam for heating a portion of the laser beam; an optical swing portion disposed on an optical path of the laser beam to shake the inclination angle of the laser beam toward the cutting line; and the laser beam. It includes a cooling unit for cooling the substrate heated by. 유리 기판, 절단, 광스윙, 적외선 레이저, 기판 절단 장치, 기판 절단 방법 Glass substrate, cutting, optical swing, infrared laser, substrate cutting device, substrate cutting method

Method and apparatus for processing ceramic green sheet

본 발명에 따른 세라믹 그린시트 가공방법에서는, X-Y 테이블 상에서 유지된 세라믹 그린시트의 한쪽 표면위에 마스크를 올려놓는다. 마스크에는 복수개의 관통홀 투광부들이 형성되어 있다. 이 마스크에 펄스 레이저 빔을 인가한다. 레이저 빔의 크기는 적어도 수개의 상기한 관통홀 투광부들을 에워쌀 수 있을 만큼 충분히 크다. 레이저 빔은 관통홀 투광부를 통과하여 세라믹 그린시트에 복수개의 관통홀들을 동시에 형성한다. 세라믹 그린시트의 표면에(또는 적어도 인접부에) 마스크를 올려놓았기 때문에, 관통홀들의 크기와 형상은 대략 관통홀 투광부의 크기 및 형상과 거의 동일하며, 이것에 의해 관통홀의 크기와 형상을 정밀하게 제어할 수 있다. In the ceramic green sheet processing method according to the present invention, a mask is placed on one surface of the ceramic green sheet held on the X-Y table. A plurality of through hole light transmitting parts are formed in the mask. A pulsed laser beam is applied to this mask. The size of the laser beam is large enough to enclose at least some of the above-mentioned through hole light transmitting portions. The laser beam passes through the through hole light transmitting part and simultaneously forms a plurality of through holes in the ceramic green sheet. Since the mask is placed on (or at least adjacent to) the surface of the ceramic green sheet, the size and shape of the through-holes are approximately the same as the size and shape of the through-hole light transmitting portion, thereby precisely adjusting the size and shape of the through-holes. Can be controlled. 본 발명의 가공방법에 사용된 레이저 가공장치는 레이저 광원; 레이저 광원을 구동시키는 레이저 광원 구동회로; 마스크가 위에 배치된 피가공물(object)을 유지하는 테이블; 테이블 쪽으로 향한 갈바노미러(galvanomirror); 갈바노미러의 반사각을 변화시키는 갈바노미러 구동회로; 레이저 광원 구동회로와 갈바노미러 구동회로에 제어신호를 보내는 제어회로; 및 레이저 광원과 마스크 사이에 배치되어, 레이저 광원으로부터 방사된 레이저 빔을 집광하는 집광렌즈를 구비하고 있다. The laser processing apparatus used in the processing method of the present invention comprises a laser light source; A laser light source driving circuit for driving a laser light source; A table for holding an object on which a mask is placed; Galvanomirror towards the table; A galvano mirror driving circuit for changing a reflection angle of the galvano mirror; A control circuit for sending a control signal to the laser light source driving circuit and the galvano mirror driving ...

Method of ablating an opening in a hard, non-metallic substrate

본 발명에 따라, 경질의 비금속 기판(24) 내로 호울을 어블레이팅하는 방법이 개시된다. 축에 대해 상대적으로 이동할 수 있는 초점을 갖는 축 내에서 레이저 빔(16a)을 발생시킬 수 있는 적어도 하나의 레이저 어셈블리(12)가 제공된다. 레이저 빔(16a)의 초점은 기판(24)의 적어도 하나의 표면에 인접하게 위치된다. 기판(24)의 제1 층(Pass-1)은 레이저 빔(16a)에 의해 어블레이팅된다. 초점은 기판(24)의 깊이에 대응하는 축에 상대적으로 이동함으로써, 기판(24) 내로 호울(32)을 발생시키기 위해 어블레이팅되는 기판(24)의 연속 층들(Pass 2-10)의 어블레이션을 가능케 한다. In accordance with the present invention, a method of ablating a hole into a rigid nonmetallic substrate 24 is disclosed. At least one laser assembly 12 is provided that can generate a laser beam 16a within an axis having a focal point that can be moved relative to the axis. The focal point of the laser beam 16a is located adjacent to at least one surface of the substrate 24. The first layer Pass-1 of the substrate 24 is abbreviated by the laser beam 16a. The focal point moves relative to the axis corresponding to the depth of the substrate 24, thereby ablating the continuous layers Pass 2-10 of the substrate 24 that are abbreviated to generate the holes 32 into the substrate 24. Makes it possible.

Insulating substrate having a through hole

導体用の貫通孔（２）が配列されている絶縁基板（１）を提供する。絶縁基板（１）の厚さが２５〜３００μｍであり、貫通孔（２）の径（Ｗ）が２０μｍ〜１００μｍであり、絶縁基板（１）がアルミナ焼結体からなる。アルミナ焼結体の相対密度が９９．５％以上であり、平均粒径が２〜５０μｍである。 Provided is an insulating substrate (1) in which through holes (2) for conductors are arranged. The thickness of the insulating substrate (1) is 25 to 300 μm, the diameter (W) of the through hole (2) is 20 μm to 100 μm, and the insulating substrate (1) is made of an alumina sintered body. The relative density of the alumina sintered body is 99.5% or more, and the average particle size is 2 to 50 μm.

Printed circuit board and manufacturing method thereof

본 발명은 유리판; 상기 유리판을 관통하여 형성된 수지 절연부; 상기 유리판의 일면 및 타면에 배치된 절연층; 및 상기 수지 절연부를 관통하여 형성된 비아;를 포함하는 인쇄회로기판에 관한 것이다. The present invention relates to a glass plate; A resin insulating portion formed through the glass plate; An insulating layer disposed on one surface and the other surface of the glass plate; And a via formed through the resin insulating portion.

Ceramic electronic device and method of producing the same

본 발명은, 각종 전기기기에 사용되는 디지틀회로등의 노이즈대책부품등의 용도로 사용되고 있는 각종 세라믹전자부품에 있어서, 구멍의 주변에는 세라믹적층체를 형성할 수 없었다고 하는 과제를 해결하고, 소형의 세라믹전자부품과, 그것을 제조하는 방법을 제공하는 것을 목적으로 한 것이며, 그 구성에 있어서, 복수개의 구멍(12)을 가진 베이스기판(11) 표면에 상기 구멍(12)을 막도록 형성된 세라믹적층체(8)에 대해서, 상기 베이스기판을 마스크로해서 샌드블라스트방법등을 사용하여, 상기 세라믹적층체(8)에 복수개의 관통구멍(24)을 형성한 후, 상기 관통구멍(24)을 외부전극(10)의 형성에 용융함으로써, 상기 베이스기판의 구멍주변까지 각종 세라믹적층부분을 형성할 수 있는, 소형화를 실현할 수 있는 것을 특징으로 한다. SUMMARY OF THE INVENTION The present invention solves the problem that a ceramic laminate cannot be formed around a hole in various ceramic electronic components used for noise countering components such as digital circuits used in various electrical apparatuses. An object of the present invention is to provide a ceramic electronic component and a method of manufacturing the same, and in the structure thereof, a ceramic laminated body formed so as to close the hole 12 on the surface of the base substrate 11 having the plurality of holes 12. (8) A plurality of through holes 24 are formed in the ceramic laminate 8 using a sand blast method or the like using the base substrate as a mask, and then the through holes 24 are external electrodes. By melting to form (10), it is possible to realize miniaturization that can form various ceramic laminated portions up to the periphery of the base substrate.

Interposer and method for producing holes in an interposer

CPU 칩과 회로 기판 사이의 전기 접속을 위한 인터포저가 제공된다. 유리로 형성된 보드 형상 베이스 기판(1)은 열팽창 계수가 3.1　·　10 -6　 /K 내지 3.4 · 10 -6　 범위이고, 구멍(12)의 갯수가 10개 내지 10, 000개 cm -2 범위이다. 구멍(12)은 20 ㎛ 내지 200 ㎛ 범위일 수 있는 직경을 갖는다. 보드의 일면 상에서 전도성 트랙(13)이 연장되고, 칩에 대한 접속 지점을 형성하기 위해 상기 전도성 트랙은 각각의 구멍(12)으로 바로 뻗고, 이 구멍을 통하여 보드의 다른 면으로 뻗는다. An interposer for electrical connection between the CPU chip and the circuit board is provided. The board-shaped base substrate 1 formed of glass has a thermal expansion coefficient in the range of 3.1 · 10 -6 / K to 3.4 · 10 -6 , and the number of the holes 12 is in the range of 10 to 10 000 cm -2 . The hole 12 has a diameter that can range from 20 [mu] m to 200 [mu] m. The conductive tracks 13 extend on one side of the board and the conductive tracks extend directly into the respective holes 12 and extend through the holes to the other side of the board to form connection points for the chip.

Patent JPH0516185B2

Insulating substrates including through holes

도체용의 관통 구멍(2)이 배열되어 있는 절연 기판(1)을 제공한다. 절연 기판(1)의 두께가 25~300 ㎛이고, 관통 구멍(2)의 직경(W)이 20 ㎛~100 ㎛이고, 절연 기판(1)이 알루미나 소결체로 이루어진다. 알루미나 소결체의 상대 밀도가 99.5% 이상이며, 평균 입경이 2~50 ㎛이다. An insulating substrate 1 in which through holes 2 for conductors are arranged is provided. The thickness of the insulating substrate 1 is 25 to 300 µm, the diameter W of the through hole 2 is 20 µm to 100 µm, and the insulating substrate 1 is made of an alumina sintered body. The alumina sintered body has a relative density of 99.5% or more, and an average particle diameter of 2 to 50 µm.

Process for cutting or shaping of a substrate by laser

A process for cutting or shaping of a ceramic substrate with laser light, comprising pulsing the laser light and moving the pulsing laser light source with respect to the substrate so that individual light pulses strike different spots along the substrate, defining a path; the laser light may pierce the substrate.

Circuit board and manufacturing method thereof

Glass substrate assembly with low dielectric properties

本文公开了具有低介电性质的玻璃基材组装件、结合有玻璃基材组装件的电子组装件以及制造玻璃基材组装件的方法。在一种实施方式中，基材组装件包含具有第一表面和第二表面且厚度小于约300μm的玻璃层110。所述基材组装件还包含设置在玻璃层的第一表面或第二表面中的至少一者上的介电层120。所述介电层响应具有10GHz的频率的电磁辐射具有小于约3.0的介电常数值。在一种实施方式中，玻璃层由退火玻璃制成，以使玻璃层响应频率为10GHz的电磁辐射具有小于约5.0的介电常数值和小于约0.003的耗散因子值。导电层142设置在介电层的表面上、介电层中或介电层下。

Printed circuit board and method of manufacturing the same

본 발명은 인쇄회로기판 및 그 제조방법에 관한 것이다. 본 발명의 인쇄회로기판은, 글라스 재질의 코어; 상기 코어의 측면을 비롯한 외주면 전체를 감싸는 절연재; 상기 절연재 상에 형성된 내부 회로층; 및 상기 코어와 절연재를 관통하여 상기 내부 회로층을 연결하는 비아;를 포함한다. The present invention relates to a printed circuit board and a manufacturing method thereof. A printed circuit board of the present invention comprises: a core made of a glass material; An insulating material surrounding the entire circumferential surface including the side surface of the core; An internal circuit layer formed on the insulating material; And vias passing through the core and the insulating material to connect the internal circuit layers.

Protective layer during scribing

회로 기판의 표면 상의 복수의 노출된 접촉점 위에 화학적 가용성 코팅을 형성하는 단계, 스크라이빙 영역을 따라 상기 기판의 상기 표면을 스크라이빙하는 단계, 및 스크라이빙 후 상기 코팅의 일부를 제거하는 단계를 포함하는 방법을 개시한다. 또한, 표면 상에 복수의 노출된 접촉점을 포함하는 회로 구조를 형성하는 단계(상기 노출된 접촉점의 위치는 복수의 스크라이빙 스트리트에 의하여 정의됨), 상기 노출된 접촉점 상에 화학적 가용성 물질을 포함하는 코팅을 형성하는 단계, 상기 스크라이빙 스트리트를 따라 상기 기판의 상기 표면을 스크라이빙하는 단계, 및 스크라이빙 후 상기 코팅을 제거하는 단계를 포함하는 방법을 개시한다. 또한, 화학적 가용성 물질로 복수의 노출된 접촉점을 포함하는 회로 기판의 표면을 코팅하는 단계, 스크라이빙 영역을 따라 상기 기판의 상기 표면을 스크라이빙하는 단계, 상기 코팅을 제거하는 단계, 및 상기 스크라이빙 영역 내에서 상기 기판을 절단하는 단계를 포함하는 방법을 개시한다. 회로 제조, 회로 기판, 화학적 가용성 코팅, 스크라이빙

Built-in inserted plate and the method for manufacturing hole in built-in inserted plate

用于在CPU芯片和电路板之间电连接的内插板。由玻璃制成的板状基础基底（1）具有在介于3.1×10 -6 和3.4×10 -6 之间的范围内的热膨胀系数和数量在介于10和10000cm -2 之间的范围内的孔（12）。存在直径可以在介于20μm和200μm之间的范围内的孔（12）。在一个板侧面上分布有导电通路（13），这些导电通路（13）各延伸进入孔（12）中并穿过孔（12）到另一板侧面上，以便形成针对芯片的接点。

Method and apparatus for forming through hole in ceramic green sheet

본 발명에 따른 세라믹 그린시트 가공방법에서는, X-Y 테이블 상에서 유지된 세라믹 그린시트의 한쪽 표면위에 마스크를 올려놓는다. 마스크에는 복수개의 관통홀 투광부들이 형성되어 있다. 이 마스크에 펄스 레이저 빔을 인가한다. 레이저 빔의 크기는 적어도 수개의 상기한 관통홀 투광부들을 에워쌀 수 있을 만큼 충분히 크다. 레이저 빔은 관통홀 투광부를 통과하여 세라믹 그린시트에 복수개의 관통홀들을 동시에 형성한다. 세라믹 그린시트의 표면에(또는 적어도 인접부에) 마스크를 올려놓았기 때문에, 관통홀들의 크기와 형상은 대략 관통홀 투광부의 크기 및 형상과 거의 동일하며, 이것에 의해 관통홀의 크기와 형상을 정밀하게 제어할 수 있다. 본 발명의 가공방법에 사용된 레이저 가공장치는 레이저 광원; 레이저 광원을 구동시키는 레이저 광원 구동회로; 마스크가 위에 배치된 피가공물(object)을 유지하는 테이블; 테이블 쪽으로 향한 갈바노미러(galvanomirror); 갈바노미러의 반사각을 변화시키는 갈바노미러 구동회로; 레이저 광원 구동회로와 갈바노미러 구동회로에 제어신호를 보내는 제어회로; 및 레이저 광원과 마스크 사이에 배치되어, 레이저 광원으로부터 방사된 레이저 빔을 집광하는 집광렌즈를 구비하고 있다.

Interposer and how to create holes in the interposer

Method for producing an enamelled printed circuit board having through-enamelled holes

Substrate manufacturing method

Method for forming channels in a glass substrate

本发明涉及一种通过激光钻孔和酸蚀刻在玻璃基材中形成孔道的方法。在一种实施方式中，一种在玻璃基材中形成孔道的方法包括从玻璃基材的入射表面利用激光钻过该玻璃基材的厚度的至少一部分以形成孔道。本方法还包括对该玻璃基材进行一段蚀刻时间的蚀刻，以增加该孔道的入射开口的直径，并在蚀刻时间的至少一部分内对该玻璃基材施加超声波能量。所施加的超声波能量的频率为40kHz～192kHz。

Method for manufacturing an interposer

(과제) 유리 기판을 사용한 인터포저의 내열성을 높일 수 있는 인터포저의 제조 방법을 제공한다. (해결 수단) 격자상으로 설정된 복수의 분할 예정 라인에 의해 복수의 영역으로 구획되는 유리 기판과, 유리 기판의 제 1 면 또는 제 1 면과는 반대측의 제 2 면에 적층되고 절연층과 배선층을 포함하는 적층체를 구비하는 재료 기판으로부터 복수의 인터포저를 제조하는 인터포저의 제조 방법으로서, 분할 예정 라인을 따라 적층체의 노출된 면에 제 1 절삭 블레이드를 절입시켜, 유리 기판에 도달하지 않는 깊이의 절삭 홈을 적층체에 형성하는 절삭 홈 형성 공정과, 절삭 홈보다 폭이 좁은 제 2 절삭 블레이드를 절삭 홈을 따라 유리 기판에 절입시켜, 유리 기판을 분할하여 복수의 인터포저를 제조하는 분할 공정을 포함한다. (Project) The manufacturing method of the interposer which can improve the heat resistance of the interposer using a glass substrate is provided. (Solution Means) A glass substrate divided into a plurality of regions by a plurality of division lines set in a grid shape, and laminated on a first surface of the glass substrate or a second surface opposite to the first surface, an insulating layer and a wiring layer A method of manufacturing an interposer for manufacturing a plurality of interposers from a material substrate having a laminate comprising A cutting groove forming step of forming a deep cutting groove in the laminate, and a second cutting blade, which is narrower than the cutting groove, is cut into the glass substrate along the cutting groove to divide the glass substrate to manufacture a plurality of interposers includes the process.

Method for regulating capacitance value of built-in capacitor in multilayered ceramic substrate, and multilayered ceramic substrate and process for producing the same

本发明提供对于多层陶瓷基板，不会使电容器电极间的绝缘电阻值和电容器的Q值大幅变化，可以高精度地对内置电容器的电容值进行激光微调的方法。对于在层叠多个陶瓷层(3～5)而成的陶瓷层叠体(6)内具有以第1电容器电极(7)、第2电容器电极(8)和电介质玻璃陶瓷层(4)形成的内置电容器(2)的多层陶瓷基板(1)，通过第1电容器电极(7)的激光微调来调整内置电容器(2)的电容值。该情况下，由含TiO 2 的电介质晶粒的含有比例为10～35体积％的TiO 2 类电介质玻璃陶瓷层构成电介质玻璃陶瓷层(4)。

Producing metal-coated vias

A method is described in which groups 17 of close-spaced, discrete, small diameter, vias 11 are cut in a substrate 3 of ceramic material using a pulsed laser 1. Each via is cut with a single laser pulse. This eliminates residue deposition and consequential problems in metallisation. This method is applicable to both thin and thick film processing. Examples are given for thin film processing in which vias of diameter 40 to 60 mu m, and 90 to 110 mu m, are cut in ceramic substrates of standard thicknesses 0.24mm and 0.63mm, respectively. An example is also given for thick film processing in which vias of diameter 150 to 170 mu m are cut. <IMAGE>

Methods for forming vias in glass substrates

Method of production of double-sided printed board

FIELD: printing industry.SUBSTANCE: in non-conductive substrate in predetermined coordinates of PC board layout the through via holes are performed, then on the surface of the said substrate on both sides and on the walls of the via holes the adhesive underlayer is applied in a single process, as well as a conductive layer and a metal mask layer, then on the mask layer on both sides of the substrate and on the walls of the via holes a soluble protective layer is applied, resistant to chemical etchants, then the printed board pattern is formed by laser evaporation on both sides, at least of the protective layer and the mask layer on the areas not occupied by conducting paths, then the conductive layer and the adhesive underlayer is removed by selective chemical etching on the areas opened by laser evaporation, then the protective layer is removed with a solvent on the areas unopened by laser evaporation (conducting paths of printed board) and in the via holes, then the metal layer of mask is removed by selective chemical etching from the conducting paths and in the via holes, finally, the protective barrier layer is applied and a layer that provides solderability and/or weldability of the surface on both sides of the substrate on the conducting paths and in the via holes.EFFECT: improvement of quality of metallization pattern, improvement of reliability of switching between the sides of the board, improvement of electrical parameters of the conductive layer, increase in efficiency of the method.11 cl, 13 dwg, 8 tbl, 2 ex РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 543 518 C1 (51) МПК H05K 3/46 (2006.01) H05K 3/42 (2006.01) H05K 3/06 (2006.01) H05K 3/38 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ (21)(22) Заявка: ИЗОБРЕТЕНИЯ К ПАТЕНТУ 2013144431/07, 03.10.2013 (24) Дата начала отсчета срока действия патента: 03.10.2013 (45) Опубликовано: 10.03.2015 Бюл. № 7 (56) Список документов, цитированных в отчете о поиске: RU 2040129 C1, 20.07.1995. ...