Method for controlling glue flow

A method for controlling a contact angle between a glue and a surface of a substrate during manufacture of microchip packages is disclosed. The method includes applying a glue to a surface of a substrate, and placing an electrode in electrical connection with the glue. A potential difference is applied between the electrode and the substrate. The potential difference is applied across the glue and causes a contact angle between the glue and the surface of the substrate to be altered.

Method of Using a Mask to Provide a Patterned Substrate

A method of producing substrates having a patterned mask layer with fine features such as repeating stripes. The method including the steps of forming a substrate having a transfer layer with a predetermined pattern on a first major surface of the substrate; providing the substrate having the transfer layer on the first major surface; providing a structured tool having a body and a plurality of contact portions, the contact portions having a Young's Modulus between about 0.5 Gpa to about 30 Gpa; heating either the structured tool or the substrate; contacting the transfer layer with the structured tool; cooling the transfer layer; and withdrawing the structured tool from the transfer layer such that portions of the transfer layer separate with the structured tool leaving openings in the transfer layer that extend all the way through the transfer layer to the substrate forming the transfer layer with the predetermined pattern.

Method of fabricating micro structured surfaces with electrically conductive patterns

A method comprises forming a first pattern on a first flat surface and forming an inverse of the pattern on a second flat surface. The method further comprises attaching the second flat surface to a roller to produce an embossing tool and applying pressure between the embossing tool and a substrate thereby forming a second pattern in the substrate. The substrate is coated with a radiation curable resin material. The method also comprises transferring ink to the substrate, the ink containing a catalyst, and coating the substrate with the second pattern in an electroless plating bath. The first pattern alternatively may be formed on a sleeve which is then attached to a drum/roller.

Print Compatible Designs and Layout Schemes for Printed Electronics

Embodiments of the present invention relate to circuit layouts that are compatible with printing electronic inks, printed circuits formed by printing an electronic ink or a combination of printing and conventional blanket deposition and photolithography, and methods of forming circuits by printing electronic inks onto structures having print-compatible shapes. The layouts include features having (i) a print-compatible shape and (ii) an orientation that is either orthogonal or parallel to the orientation of every other feature in the layout. 1. A layout for a printed circuit , comprising:a first layout consisting essentially of a first plurality of features, each of the first plurality of features being orthogonal or parallel to every other feature in the first plurality of features, the first plurality of features comprising (i) first print-compatible shape features and (ii) first and second subsets of features; anda second layout consisting essentially of a second plurality of features, each of the second plurality of features being orthogonal or parallel to every other feature in the first and second plurality of features, the second plurality of features comprising (i) second print-compatible shape features, (ii) a first subset that crosses over the first subset of the first plurality of features, and (iii) a second subset that crosses over the second subset of the first plurality of features.2. The layout of claim 1 , wherein each of the print-compatible shape features is independently selected from the group consisting of a rectangle claim 1 , a square claim 1 , a line claim 1 , a circle and an oval.3. The layout of claim 2 , wherein each of the first and second plurality of features consists essentially of a rectangle claim 2 , square claim 2 , or line having a length and a width claim 2 , wherein the length and width of each of the first and second plurality of features is either orthogonal or parallel to the length and width of every other feature in the ...

COMPOSITE BUILD-UP MATERIAL FOR EMBEDDING OF CIRCUITRY

Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding circuitry such as microvias, trenches and pads. The composite build-up materials comprise a carrier layer (), a resin layer without reinforcement (), and a resin layer with reinforcement (). The circuitry () is embedded into the resin layer without reinforcement (). 1. A method for embedding of circuitry , the method comprising , in this order , the stepsi. providing a carrier layer having a thickness of 1 to 200 μm,ii. coating the carrier layer with a first resin to form a resin layer without reinforcement having a thickness of 1 to 150 μm,iii. coating the resin layer without reinforcement with a second resin,iv. laminating a reinforcement into the second resin coated in step (iii) to form a resin layer with reinforcement having a thickness of 1 to 200 μm,v. detaching said carrier layer andvi. generating tracks inside the resin layer without reinforcement by a laser ablating technique.2. A method for embedding of circuitry according to wherein the carrier layer is selected from the group consisting of copper claim 1 , aluminum claim 1 , tin claim 1 , paper claim 1 , polymer foils made of polymers selected from the group consisting of polyethylene terephthalate (PET) claim 1 , polyethylene naphthalate (PEN) claim 1 , polyimide claim 1 , polyether ether ketone (PEEK) claim 1 , cyclic olefin copolymer (COC) claim 1 , polyamide claim 1 , polytetrafluoroethylene (PTFE) claim 1 , fluorinated ethylene propylene (FEP) claim 1 , ethylene tetrafluoroethylene (ETFE) claim 1 , THV (co-polymer of tetrafluoroethylene claim 1 , hexafluoropropylene and vinylidene fluoride) claim 1 , polychlorotrifluoroethylene (PCTFE) claim 1 , polyvinylfluoride (PVF) claim 1 , polyvinylidene fluoride (PVDF) claim 1 , perfluoro alkoxy (PFA) claim 1 , MFA (co-polymer of tetrafluoroethylene and per-fluoro ...

Printed circuit board and method of manufacturing the same

Gradation exposure is performed on an insulating layer by irradiating the insulating layer with exposure light using a photomask having a partial light-transmitting region that is configured to be partially transmittable of the exposure light. After the gradation exposure, development processing is performed on the insulating layer such that a recess is formed in a portion of the insulating layer that has been irradiated with the exposure light through the partial light-transmitting region. The partial light-transmitting region of the photomask has a plurality of first holes that are transmittable of the exposure light and a plurality of second holes that are arranged to surround the plurality of first holes and transmittable of the exposure light, and the area of each second hole is larger than the area of each first hole.

POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WITH CAP LAYERS

One embodiment of the present invention is a method of fabricating an integrated circuit. The method includes providing a substrate having a metal and dielectric damascene metallization layer and depositing substantially on the metal a cap. After deposition of the cap, the substrate is cleaned with a solution comprising an amine to provide a pH for the cleaning solution of 7 to about 13. Another embodiment of the presented invention is a method of cleaning substrates. Still another embodiment of the present invention is a formulation for a cleaning solution. 234-. (canceled)35. A method of fabricating an integrated circuit , the method comprising:providing a substrate having a metal and dielectric damascene metallization layer; cobalt and', 'nickel;, 'using electroless deposition to deposit substantially on the metal a cap comprising at least one of the chemical elements'}cleaning the substrate after deposition of the cap with a cleaning solution comprising an amine to provide a pH for the cleaning solution of 7 to 13 and all values and subranges subsumed therein.36. The method of claim 35 , wherein the cleaning solution further comprises one or more complexing agents claim 35 , and at least one of the one or more complexing agents is a non-amine.37. The method of claim 36 , wherein the cleaning solution further comprises at least one corrosion inhibitor.38. The method of claim 36 , wherein the cleaning solution further comprises at least one oxygen scavenger to provide a lower concentration of dissolved oxygen in the cleaning solution.39. The method of claim 36 , wherein the cleaning solution further comprises at least one reducing agent; the least one reducing agent being substantially incapable of scavenging for dissolved oxygen.40. The method of claim 37 , wherein the cleaning solution further comprises at least one oxygen scavenger so as to lower the concentration of dissolved oxygen in the cleaning solution.41. The method of claim 37 , wherein the cleaning ...

METHOD OF GENERATING HOLE, RECESS OR WELL IN ELECTRICALLY INSULATING OR SEMICONDUCTING SUBSTRATE

A method of generating a hole or the like in an electrically insulating or semiconducting substrate, includes a) providing a substrate; b) melting a volume of material of the substrate; c) removing the molten volume of material by applying a voltage across the substrate using two electrodes, thereby applying a defined amount of electrical energy to the substrate and dissipating the electrical energy from the substrate, wherein the rate of dissipating the applied electrical energy is controlled by at least one current and/or power modulating element, the at least one current and/or power modulating element being part of the electrical connection between the voltage source and the electrodes, and wherein the current and/or power modulating element is a resistor, a capacitor, an inductor or any combination of the foregoing, with the proviso that, if there is only one current and/or power modulating element, it is not an ohmic resistor. 1. A method of generating a hole , recess , well , continuous line-like structure or arrays thereof in an electrically insulating or semiconducting substrate , comprising:a) providing a substrate which is electrically insulating or semiconducting at room temperature, placed between two electrodes;b) melting a volume of material of the substrate by heating the volume using a heat source, the volume extending fully or partially from a first surface of the substrate to a second surface of the substrate, the second surface being opposite the first surface;c) removing the molten volume of material resulting from step b) by applying a voltage across the substrate using two electrodes connected to a user-controlled voltage source and placed at a distance from and on opposite sides of the substrate, thereby applying a defined amount of electrical energy to the substrate and dissipating the electrical energy from the substrate,wherein the rate of dissipating the applied electrical energy is controlled by at least one current and/or power ...

PCB REPAIR OF DEFECTIVE INTERCONNECTS BY DEPOSITION OF CONDUCTIVE INK

There may be provided a system that may include a computer arranged to process images of areas of missing conductive material defects of an electrical circuit and to determine a defect correction scheme that defines a manner in which at least one of the missing conductive material defects should be amended; and 1. A system , comprising:a computer arranged to process images of areas of missing conductive material defects of an electrical circuit and to determine a defect correction scheme that defines a manner in which at least one of the missing conductive material defects should be amended; anda conductive ink printer arranged to print conductive ink, in response to the defect correction scheme, to repair the at least one of the missing conductive material defects.2. The system according to claim 1 , further comprising an image sensor arranged to acquire the images of the areas of missing conductive materials defects.3. The system according to claim 1 , wherein the conductive ink printer is arranged to:select, based upon the defect correction scheme, a selected conductive ink out of multiple conductive inks that differ from each other and are accessible to the conductive ink printer; andprint the selected conductive ink so as to treat one of the missing conductive material defects.4. The system according to claim 3 , wherein the conductive ink printer comprises multiple print heads claim 3 , wherein different print heads are used for printing different conductive inks.5. The system according to claim 3 , wherein the different conductive inks differ from each other by conductivity.6. The system according to claim 3 , wherein the different conductive inks differ from each other by viscosity.7. The system according to claim 3 , wherein the different conductive inks differ from each other by at least one of a chemical characteristic and a physical characteristic.8. The system according to claim 1 , wherein the conductive ink printer is arranged to print multiple layers ...

Method of manufacturing printed circuit board

Disclosed herein is a method of manufacturing a printed circuit board, the method including: preparing a base substrate having an insulating layer and a connection pad formed in the insulating layer; forming a photosensitive resist on the insulating layer; forming an opening part of which a side surface has a foot shape by patterning the photosensitive resist; forming a via hole exposing the connection pad by etching the insulating layer exposed by the opening part; and forming a via by filling the via hole.

SCREEN PRINTING MACHINE

Disclosed is an inexpensive small-sized screen printing machine having low redundancy and high production efficiency and applicable to a dual conveying-type component mounting machine. The screen printing machine comprises a pair of substrate supporting tables provided to hold a respective substrate that is a print object and which is juxtaposed in a direction that is perpendicular to a conveying direction of the substrate, and a print executing section that performs a printing process alternately on the substrate held by the pair of substrate supporting tables. Due to the print executing section being driven in the direction under control of a control unit, a print position where the substrate supporting tables execute alternate printing is changed within a range in which one of the pair of substrate supporting tables and the other of the pair of substrate supporting tables oppose each other in the direction. 1. A screen printing machine comprising:a pair of substrate supporting tables, each of which is provided for holding a substrate that is a print object, the substrate supporting tables being juxtaposed along a specific direction that is perpendicular to a conveying direction of the substrate;a print executing section which performs a printing process alternately on respective substrates held by the pair of substrate supporting tables;a print executing section driving mechanism that drives the print executing section along the specific direction; anda print position setting section configured to set a print position that is a position of the print executing section within a range where one of the pair of substrate supporting tables and the other of the pair of substrate supporting tables oppose each other in the specific direction, by controlling a drive of the print executing section driving mechanism.2. The screen printing machine according to claim 1 , further comprising:a substrate supporting table driving mechanism that individually drives each of the pair ...

Method and system of depositing a viscous material into a surface cavity

A method of depositing a viscous material into a surface cavity of a target object. The method includes providing the target object having the surface cavity. The target object has an exterior surface with a cavity opening that provides access to the surface cavity. The method also includes evacuating air from the surface cavity through the cavity opening and covering the cavity opening to seal the surface cavity. The surface cavity constitutes a partial vacuum when the surface cavity is sealed. The method also includes permitting a viscous material to flow into the surface cavity through the cavity opening as the cavity opening is uncovered.

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

The present invention discloses a printed circuit board including a lower wiring layer, an insulating layer which buries the lower wiring layer, and an upper wiring layer formed on the insulating layer to improve reliability of interlayer electrical connection between the wiring layers, wherein the interlayer connection between the upper wiring layer and the lower wiring layer is performed by a via electrode which is provided between the upper wiring layer and the lower wiring layer and has an upper surface bonded to the upper wiring layer and a lower surface bonded to the lower wiring layer, wherein the lower surface of the via electrode is larger than the upper surface thereof. 1. A printed circuit board comprising a lower wiring layer , an insulating layer which buries the lower wiring layer , and an upper wiring layer formed on the insulating layer , wherein the interlayer connection between the upper wiring layer and the lower wiring layer is performed by a via electrode which is provided between the upper wiring layer and the lower wiring layer and has an upper surface bonded to the upper wiring layer and a lower surface bonded to the lower wiring layer , wherein the lower surface of the via electrode is larger than the upper surface thereof.2. The printed circuit board according to claim 1 , wherein the via electrode has a tapered sidewall so that the diameter thereof increases downward.3. The printed circuit board according to claim 1 , wherein the insulating layer is formed to bury the lower wiring layer and the via electrode after the via electrode is formed.4. The printed circuit board according to claim 1 , wherein the wiring layer consists of one or a combination of a signal line claim 1 , a power line claim 1 , and a ground line.5. A printed circuit board formed by repeatedly stacking a wiring layer and an insulating layer which buries the wiring layer on one or both surfaces of a substrate member claim 1 , wherein the interlayer connection between the ...

Circuit substrate and process for preparing the same

The present invention relates to a process for preparing a bonding sheet for composing circuit substrate, comprising pre-treating glass fabrics with a pre-treating varnish having a same or close dielectric constant (DK) to glass fabrics being used. The present invention further relates to bonding sheets prepared by the process, as well as circuit substrate. The process for preparing circuit substrate of the invention, which has a lower cost, does not need to upgrade or adjust the equipment. The circuit substrates prepared thereby have less warp-wise and weft-wise difference in dielectric constant, and thus can effectively solve the problem of signal time delay.

Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate

The present invention provides a dry film capable of forming a cured coating film having an excellent laser processability and a desmear resistance, and a printed writing board using the same. Further, the present invention provides a method of producing a printed writing board for a flip-chip mounting substrate capable of simply and inexpensively forming a dam preventing from spreading an underfill, a printed writing board obtained by the method of producing, and a flip-chip mounting substrate in which a chip is subjected to flip chip mounting on the printed writing board. A dry film comprising: a carrier film and a photocurable resin composition layer (L1) formed by applying and drying a photocurable resin composition; and at least a thermosetting resin composition layer (L2) formed by applying and drying a thermosetting resin composition in a gap between the photocurable resin composition layer (L1) and the carrier film. A method of producing a printed writing board comprising: a process in which a resin insulation layer which includes a thermosetting resin composition layer (L2) and a photocurable resin composition layer (L1) in order from a side of a substrate surface is formed on the substrate surface; a process to perform patterning by photolithographic approach; and a process to perform patterning by laser processing.

Surface treating apparatus

An tank such as an electroless copper plating tank 200 , includes a liquid squirting part 4 having a squirt port 6 for squirting the processing solution Q from the squirt port 6 toward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like work 10 so that the processing solution Q runs down the plate-like work 10.

3D Printed Microelectrode Arrays

A high-density bioprobe array is provided comprising conductive or optical shanks. A method of making high-density bioprobe arrays also is provided. A bioprobe system using the array also is provided. 1. A method of preparing a high-density array of electrically-conductive , or optically-conductive shanks , comprising:depositing by aerosol jet printing, a plurality of shanks onto a surface of a substrate in a density of greater than 100 shanks per square centimeter of the surface of the substrate, each shank having a diameter ranging from 10 μm to 1 mm, and a length ranging from 10 μm to 10 cm, wherein the shanks are formed by depositing over the surface of the substrate a plurality of layers of a shank material solution comprising a conductive material dispersed in a liquid or a waveguide-forming material in a solvent, where each layer of the plurality of layers is deposited as an open shape having ends and a gap defined by the ends.2. The method of claim 1 , further comprising after deposition of every one to 50 layers claim 1 , exposing the shanks to a heat or energy source claim 1 , such as continuous heat claim 1 , such as from 90° C. to 110° C. claim 1 , to remove the liquid or solvent claim 1 , and/or to at least partly cros slink the waveguide-forming material.3. The method of claim 1 , wherein the shanks have an aspect ratio of diameter to length ranging from 1:1 to 1:1000.4. The method of claim 1 , wherein gaps of one or more adjacent layers are offset with respect to each other.5. The method of claim 1 , wherein layers are deposited to form a tapered shank.6. The method of claim 1 , wherein one or more of the shanks is prepared by depositing a waveguide-forming material over a light-emitting diode (LED) on the substrate.7. The method of claim 1 , wherein the substrate is a circuit board or an integrated circuit claim 1 , wherein traces on the printed circuit board are deposited by aerosol jet printing.8. The method of claim 1 , wherein an electrically- ...

PRINTED CIRCUIT BOARD STRUCTURE

Provided is a printed circuit board structure that needs minimum manufacturing costs and in which there is little possibility that a solder bridge is formed. The printed circuit board structure is formed with via holes for electrically conductively connecting electrically conductive layers of a printed circuit board, and the via holes include a coated via hole with a land coated with solder resist and a non-coated via hole with a land not coated with solder resist, wherein the coated via hole is arranged in a place of the printed circuit board where a solder bridge or a solder ball is highly likely to be generated, and is electrically connected to at least one of the non-coated via hole in parallel. 1. A printed circuit board structure comprising:a plurality of via holes for electrically conductively connecting a plurality of electrically conductive layers of a printed circuit board, the plurality of via holes including a coated via hole with a land coated with solder resist and a non-coated via hole with a land not coated with solder resist,whereinthe coated via hole is arranged in a place of the printed circuit board where a solder bridge or a solder ball is highly likely to be generated, and is electrically connected to at least one of the non-coated via hole in parallel.2. The printed circuit board structure according to claim 1 , wherein the coated via hole is arranged in a place where a distance between adjacent via holes is equal to or less than a predetermined distance claim 1 , one of the adjacent via holes is a coated via hole and an other of the adjacent via holes is a non-coated via hole.3. The printed circuit board structure according to claim 1 , wherein the coated via hole is arranged in a place where a distance from a metal member arranged on the printed circuit board is equal to or less than a predetermined distance.4. The printed circuit board structure according to claim 1 , comprising:a first region in which an electronic component is soldered by ...

HIGH VOLTAGE POLYMER DIELECTRIC CAPACITOR ISOLATION DEVICE

An electronic isolation device is formed on a monolithic substrate and includes a plurality of passive isolation components. The isolation components are formed in three metal levels. The first metal level is separated from the monolithic substrate by an inorganic PMD layer. The second metal level is separated from the first metal level by a layer of silicon dioxide. The third metal level is separated from the second metal level by at least 20 microns of polyimide or PBO. The isolation components include bondpads on the third metal level for connections to other devices. A dielectric layer is formed over the third metal level, exposing the bondpads. The isolation device contains no transistors. 1. An isolation device , comprising:a monolithic substrate;a pre-metal dielectric (PMD) layer disposed over said monolithic substrate, said PMD layer including silicon dioxide;a first metal level disposed over said PMD layer;a silicon dioxide layer disposed over said first metal layer;a second metal layer disposed over said silicon dioxide layer, said second metal level extending into lower via holes in said silicon dioxide layer to form lower vias which make electrical connections to said first metal level;a polymer dielectric layer disposed over said second metal level, said polymer dielectric layer comprising primarily a layer of polymer selected from the group consisting of polyimide and poly(p-phenylene-2,6-benzobisoxazole) (PBO), said polymer being at least 20 microns thick;a third metal level disposed over said polymer dielectric layer, said third metal level extending into upper via holes in said polymer dielectric layer to form upper vias which make electrical connections to said second metal level;bondpads disposed over said third metal level; anda dielectric overcoat dielectric layer disposed over said third metal level, said dielectric overcoat dielectric layer exposing said bondpads;said isolation device containing a plurality of isolation components, selected ...

DEVICE, SYSTEM, AND METHOD FOR TRACKING THE CONFIGURATION OR OPERATIONAL HISTORY OF A NOZZLE IN A FLUID JETTING SYSTEM

Apparatus for use with an applicator, systems for dispensing fluids, methods of using a nozzle (), and a nozzle (). The nozzle () includes a communication device () having a memory (). The memory () stores data relating to the operational history and configuration of the nozzle (). In response to receiving a query signal () from an interrogation device (), the communication device () transmits the data residing in the memory (). The communication device () also receives and stores data in the query signal () to the memory () so that the operational history of the nozzle () is maintained in the memory () of the communication device (). 1. An apparatus for use with an applicator , the apparatus comprising:a nozzle configured to be removably coupled to the applicator and to receive fluid therefrom, the nozzle having an outlet through which amounts of fluid are discharged; anda communication device coupled to the nozzle and including a memory, the communication device configured to transmit a response signal containing data residing in the memory in response to receiving a query signal.2. The apparatus of wherein the communication device is a radio frequency identification (RFID) tag including a transceiver coupled to the memory and configured to transmit the response signal as a wireless response signal in response to receiving the query signal as a wireless query signal.3. The apparatus of wherein the nozzle includes an exterior surface having a recess claim 1 , and the communication device is located in the recess.4. The apparatus of wherein the nozzle comprises a valve seat coupled with the outlet claim 1 , and the data residing in the memory comprises a size of an opening in the valve seat claim 1 , a cumulative number of operation cycles to which the valve seat has been subjected claim 1 , an identity of the applicator to which the nozzle has been removably coupled claim 1 , a type of fluid that has been dispensed by the nozzle claim 1 , a type of material ...

Filling Assembly

A filling assembly for filling holes formed in a board with a filling material, including: a board holding device having a carrier frame formed by frame elements to hold the board; a filling device arranged on a side of the carrier frame and includes a filling material feeding device with a filling head to provide filling material to the board, wherein the filling head is movable relative to the carrier frame parallel to the carrier frame surface; a screen holding frame formed by screen holding frame elements to hold a screen between the carrier frame and the filling device, wherein the screen includes a screen cloth surrounded by a screen frame; and a fixing device with an expansion element arranged in a frame element, wherein the expansion element can provide a temporary compressive force to the screen frame to fixedly press the screen frame against a screen holding frame. 1. A filling assembly for filling holes formed in a board with a filling material , comprising:a board holding device which includes a carrier frame which is formed by frame elements and which defines an at least substantially vertical carrier frame surface, wherein the carrier frame is configured to hold the board at least substantially parallel to the carrier frame surface;at least one filling device which is arranged on a side of the carrier frame and which includes a filling material feeding device with a filling head, wherein the filling material feeding device is configured to provide a filling material, via the filling head, to the board held by the carrier frame from a board side, wherein the filling head is movable relative to the carrier frame at least substantially parallel to the carrier frame surface along at least one dimension;at least one screen holding frame which is formed by screen holding frame elements and defines a screen holding frame surface and is configured to hold a screen between the carrier frame and the filling device, wherein the filling head is configured to ...

METHOD FOR CURING SOLDER PASTE ON A THERMALLY FRAGILE SUBSTRATE

A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste. 1. A method for curing solder paste on a thermally fragile substrate , said method comprising:printing a first optically reflective layer and an optically absorptive layer on a thermally fragile substrate;selectively depositing a plurality of conductive traces on said optically reflective layer and on said optically absorptive layer;applying solder paste on selective locations corresponding to locations of said optically absorptive layer;selectively depositing a second optically reflective layer on said conductive traces and on said first optically absorptive layer;placing a component on said solder paste; andirradiating said substrate from two sides with uniform pulsed light, wherein said optically absorptive layer and said component absorb said pulsed light and becomes heated, and the heat is subsequently transferred to said solder paste via thermal conduction to melt said solder paste.2. The method of claim 1 , wherein locations of said optically absorptive layer correspond to locations of said solder paste utilized to connect to said components.3. The method of claim 1 , wherein said thermally fragile substrate is optically transparent.4. The method of claim 1 , wherein said thermally fragile ...

Method and apparatus for monitoring and controlling a cleaning process

A method of accurately measuring the concentration of at least one of an aqueous cleaning agent and soil in an aqueous cleaning process which includes providing a source of near infrared light emitting useful amounts of light with wavelengths between approximately 0.8 μm and 2.5 μm, transmitting the near infrared light from the light source to a probe, contacting the probe with a cleaning bath sample such that one of the absorption and the reflection of the light at one or more wavelengths can be measured, transmitting the light that has interacted with the sample to a detector, measuring the change in light intensity at one or more wavelengths in the near infrared region using a near infrared detector, generating an electronic signal that is representative of the change in intensity, applying chemometric techniques to quantitatively determine the concentration of the cleaning agent and or soil, and outputting the measured cleaning agent or soil concentration. The light source is connected to the probe via a fiber-optic cable and the probe is connected to the detector via a fiber-optic cable.

APPARATUS AND METHOD FOR THE MANUFACTURING OF PRINTED WIRING BOARDS AND COMPONENT ATTACHMENT

An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data. 1. An apparatus for producing a printed circuit board on a substrate , comprising:a table for supporting the substrate;a function head configured to effect printing conductive and non-conductive materials on the substrate;a positioner configured to effect movement of said function head relative to said table; anda controller configured to operate said function head and said positioner to effect said printing of conductive and non-conductive materials on the substrate.2. The apparatus of wherein said controller comprises:a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of said PCB multilayer circuit board files to printing data files for controlling said function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of said multilayer circuit board layout data;a printing control module configured to control said function head to print said conductive material and said nonconductive material onto the substrate on said substrate in ...

METHODS FOR FORMING AND USING SILVER METAL

A method is used to provide electrically-conductive silver metal from a photosensitive thin film or photosensitive thin film pattern on a substrate using a non-hydroxylic-solvent soluble silver complex represented by the following formula (I): 2. The method of claim 1 , wherein after photochemically converting the reducible silver ions to electrically-conductive silver metal in the electrically-conductive silver metal-containing thin film or electrically-conductive silver metal-containing thin film pattern claim 1 , the electrically-conductive silver metal-containing thin film or electrically-conductive silver metal-containing thin film pattern has a resistivity of less than 1000 ohms/□.3. The method of claim 1 , whereinafter photochemically converting the reducible silver ions to electrically-conductive silver metal, contacting the electrically-conductive silver metal-containing thin film or electrically-conductive silver metal-containing thin film pattern with water or an aqueous or non-aqueous salt solution, andoptionally, drying the electrically-conductive silver metal-containing thin film or electrically-conductive silver metal-containing thin film pattern.4. The method of claim 1 , whereinafter photochemically converting the reducible silver ions to electrically-conductive silver metal, contacting the electrically-conductive silver metal-containing thin film or electrically-conductive silver metal-containing thin film pattern with water or an aqueous or non-aqueous non-salt solution, andoptionally, drying the electrically-conductive silver metal-containing thin film or electrically-conductive silver metal-containing thin film pattern.5. The method of claim 1 , whereinafter photochemically converting the reducible silver ions to electrically-conductive silver metal, contacting the electrically-conductive silver metal-containing thin film or electrically-conductive silver metal-containing thin film pattern with water or an aqueous or non-aqueous salt solution, ...

TRANSPORT ROLLER

The present invention refers to a new type of transport roller providing a modified surface to provide improved transport properties for new substrates. Furthermore, it refers to horizontal transport systems beneficially utilizing such transport rollers, especially for providing retaining roller pairs. Additionally, the present invention refers to a treatment device containing such transport roller or horizontal transport system. Furthermore, it refers to a method for treating a substrate and the use of such transport roller. 1112311. A transport roller ( , ′) for a horizontal transport system () for transporting a substrate () , wherein the transport roller ( , ′) essentially has the form of [{'b': 1', '1', '4, 'the transport roller (, ′) further contains a modified surface () and'}, {'b': '3', 'provides non-uniform contacting of the substrate (),'}], 'a solid body roller characterized in that'}{'b': 4', '5', '5', '5', '5', '3', '6', '6', '6', '6', '5', '5', '5', '5, 'wherein the modified surface () contains contact areas (, ′, ″, ′″) for contacting the substrate () and recesses (, ′, ″, ′″) between the contact areas (, ′, ″, ′″) not contacting the substrate,'}{'b': 4', '1', '1', '1', '1', '4, 'wherein the modified surface () is adapted to provide a liquid or gas exchange on both sides of the transport roller (, ′) while being transported using the transport roller (, ′); wherein the modified surface () consists of an essentially homogenous material, wherein said homogenous material is not made from a fibrous material or a foam.'}21146666. The transport roller ( claim 1 , ′) according to claim 1 , wherein the modified surface () provides line shaped recesses ( claim 1 , ′ claim 1 , ″ claim 1 , ″′).3116666666611116666. The transport roller ( claim 1 , ′) according to claim 1 , wherein each recess ( claim 1 , ′ claim 1 , ″ claim 1 , ′″) provides a surface and an area is enclosed between the surface of each recess ( claim 1 , ′ claim 1 , ″ claim 1 , ′″) and a contact ...

Method for manufacturing photo cured material

Provided is a method for manufacturing a photo cured material, by which transferring precision can be improved and a small surface roughness can be obtained. The method includes the steps of: placing a photo-curable composition on a substrate; brining a mold into contact with the photo-curable composition; irradiating the photo-curable composition with light; and releasing the mold from the photo-curable composition. The contact is performed in a condensable gas atmosphere, the condensable gas condensing under a temperature condition at the contact and under a pressure condition that the condensable gas receives when the photo-curable composition intrudes gaps between the substrate and the mold or concavities provided on the mold, and the photo-curable composition includes a gas dissolution inhibitor having a rate of weight change with reference to the condensable gas that is −1.0% to 3.0%.

CONDUCTIVE FILMS HAVING LOW-VISIBILITY PATTERNS AND METHODS OF PRODUCING THE SAME

A patterned transparent conductor including a conductive layer coated on a substrate is described. More specifically, the transparent conductor has low-visibility patterns. 1. A patterned transparent conductor comprising:a non-conductive substrate,a first conductive line on the non-conductive substrate, the first conductive line comprising a first network of conductive nanostructures and having a first lengthwise direction;a second conductive line on the non-conductive substrate, the second conductive line comprising a second network of conductive nanostructures and having a second lengthwise direction; andan insulating region electrically isolating the first conductive line from the second conductive line, the insulating region having a first non-conductive boundary laterally abutting the first conductive line along the first lengthwise direction and a second non-conductive boundary laterally abutting the second conductive line along the second lengthwise direction,wherein the insulating region comprises a plurality of conductive material islands disposed on the non-conductive substrate and electrically isolated from each other by non-conductive gaps, each conductive material island comprising a respective plurality of conductive nanostructures, and wherein the non-conductive gaps, the first and second non-conductive boundaries do not have any conductive network of metal nanostructures.2. The patterned transparent conductor of wherein the first lengthwise direction and the second lengthwise direction are substantially parallel to each other.3. The patterned transparent conductor of wherein the first non-conductive boundary is straight.4. The patterned transparent conductor of wherein the second non-conductive boundary is straight.5. The patterned transparent conductor of wherein the first non-conductive boundary is irregular.6. The patterned transparent conductor of wherein the second non-conductive boundary is straight.7. The patterned transparent conductor of ...

Contact structure, substrate holder, apparatus for plating, and method of feeding electric power to substrate

There is provided a contact structure, comprising a substrate contact including a first contact portion that is located on a leading end side of the substrate contact and that comes into contact with a substrate and a second contact portion that is located nearer to a base end side of the substrate contact than the first contact portion; a seal member configured to cover a periphery of the substrate contact and to have a sealing surface that comes into contact with the substrate to seal the substrate contact; a first pressing portion configured to elastically apply a contact pressure on the substrate to the substrate contact; and a second pressing portion configured to come into contact with the seal member and to apply a contact pressure on the substrate to the seal member independently of the first pressing portion, wherein the first contact portion adheres to the seal member, and the second contact portion is fit in the seal member to be displaceable relative to the seal member.

METHOD OF CUTTING CONDUCTIVE PATTERNS

A method includes: providing a first layout of a first layer over a substrate, the first layer having at least one metal pattern, and generating a second layout by placing a cut mask at a first position relative to the substrate to remove material from a first region of the at least one metal pattern to provide a first metal pattern and placing the cut mask at a second position relative to the first layer over the substrate to remove material from a second region of the at least one metal pattern to provide a second metal pattern. 1. A method comprising:providing a first layout of a first layer over a substrate, the first layer having at least one metal pattern, andgenerating a second layout by placing a cut mask at a first position relative to the substrate to remove material from a first region of the at least one metal pattern to provide a first metal pattern and placing the cut mask at a second position relative to the first layer over the substrate to remove material from a second region of the at least one metal pattern to provide a second metal pattern.2. The method of claim 1 , wherein the first metal pattern comprises a plurality of first metal patterns claim 1 , each of the plurality of first metal patterns having a respective first region; andthe cut mask has a plurality of cut patterns, each respective cut pattern to be used during a first cut patterning step for removing material from the respective first region of a respective one of the first metal patterns, to divide a respective first metal pattern into a respective third metal pattern and a respective fourth metal pattern.3. The method of claim 2 , whereinat least one of the cut patterns is positioned so as to perform a dummy cut during the second cut patterning step.4. The method of claim 2 , wherein the generating step includes:providing pairs of cut regions in the second layout, each pair having a respective first cut region in a respective first metal pattern and a respective second cut region ...

METHOD AND APPARATUS FOR AUTOMATICALLY ADJUSTING DISPENSING UNITS OF A DISPENSER

A dispensing apparatus includes a frame having a gantry configured to provide movement in the X axis and Y axis directions, and first and second dispensing units coupled to the gantry and configured to dispense material onto a substrate. The second dispensing unit is coupled to the gantry by an automatic adjustment mechanism. The dispensing apparatus further includes a controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism. The automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing. Methods of dispensing material on the substrate are further disclosed. 1. A dispensing apparatus comprising:a frame including a gantry configured to provide movement in the X axis and Y axis directions;a support coupled to the frame, the support being configured to support at least one electronic substrate under the gantry;a first dispensing unit coupled to the gantry, the first dispensing unit being configured to dispense material;a second dispensing unit coupled to the gantry by an automatic adjustment mechanism, the second dispensing unit being configured to dispense material; anda controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism,wherein the automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing.2. The dispensing apparatus of claim 1 , wherein the automatic adjustment mechanism includes a linear bearing secured to the gantry and a mounting block claim 1 , configured to ride along the linear bearing claim 1 , coupled to the second dispensing unit.3. The dispensing apparatus of claim 2 , wherein the automatic adjustment mechanism ...

Direct Exposure Device for the Direct Exposure of Solder Resists in a 2-Dimensional, Quickly Temperature-Controlled Environment

The invention generally relates to an exposure device, in particular an exposure device for exposing and structuring a substrate coated with a solder resist, as well as the corresponding method for exposure with the exposure device according to the invention. In particular, the invention relates to an exposure device having at least one light beam, formed preferably by two or more laser beams of different UV wavelengths, which is deflected relative to the substrate by a variable deflection device, in order to generate structures on the substrate. In particular, the light beam is superimposed, spatially in the image plane and temporally in the exposure, by a spatially limited, high-energy, preferably externally mounted heat source, wherein preferably infrared laser diodes having linear optics are used.

HYBRID MAGNETIC MATERIAL STRUCTURES FOR ELECTRONIC DEVICES AND CIRCUITS

Embodiments are generally directed to hybrid magnetic material structures for electronic devices and circuits. An embodiment of an inductor includes a first layer of magnetic film material applied on a substrate, one or more conductors placed on the first layer of magnetic film material, and a second layer of magnetic particles, wherein the magnetic particles are suspended in an insulating medium. 1. An inductor comprising:a first layer of magnetic film material applied on a substrate, wherein the first layer has a top surface with one or more tapered sides;one or more conductors placed on the first layer of magnetic film material; anda second layer of magnetic particles, the magnetic particles being suspended in an insulating medium, wherein the second layer is disposed on and around one or more sides of the one or more conductors and the one or more tapered sides of the first layer.2. The inductor of claim 1 , wherein the second layer is a coating applied with a particle application process.3. The inductor of claim 2 , wherein the particle application process includes one or more of:3D printing;cold spraying;spin coating; orscreen printing.4. The inductor of claim 1 , wherein the insulating medium includes one of a polyimide or an adhesive.5. The inductor of claim 1 , wherein the magnetic particles include carbonyl iron particles.6. The inductor of claim 5 , wherein the carbonyl iron particles are anodized.7. The inductor of claim 1 , wherein the magnetic particles have a diameter in a range of 0.5 micrometers to 10.0 micrometers.8. The inductor of claim 1 , wherein the second layer is wrapped around one or more sides of the inductor and is in contact with the first layer.9. The inductor of claim 1 , wherein the magnetic film material includes one or more of a cobalt alloy claim 1 , a nickel alloy claim 1 , an iron alloy claim 1 , Permalloy (alloy of nickel and iron) claim 1 , or other soft magnetic material.10. The inductor of claim 9 , wherein a cobalt alloy is ...

Fine line 3d non-planar conforming circuit

A method of producing a non-planar conforming circuit on a non-planar surface includes creating a first set of conforming layers. The first set of conforming layers is created by applying an oxide dielectric layer to the surface, applying a conductive material layer to the oxide dielectric layer, applying a resist layer to the conductive material layer, patterning the resist layer according to a desired circuit layout, etching the surface to remove exposed conductive material, and stripping the resist layer. The process may be repeated to form multiple layers of conforming circuits with electrical connections between layers formed by blind microvias. The resulting set of conforming layers can be sealed.

COMPOUND, PHOTOCURABLE COMPOSITION, AND METHODS FOR PRODUCING PATTERNED FILM, OPTICAL COMPONENT, CIRCUIT BOARD, ELECTRONIC COMPONENT BY USING THE PHOTOCURABLE COMPOSITION, AND CURED PRODUCT

A compound that increases the photocuring rate of a photocurable composition and reduces the force for releasing a cured product from a mold is provided. 2. The compound according to claim 1 , wherein Rrepresents a repeated structure of an oxyethylene group or an oxypropylene group.3. The compound according to claim 1 , wherein Rrepresents an alkyl group.4. The compound according to claim 3 , wherein Rand Reach represent a linear alkyl group having 1 to 5 carbon atoms.6. The compound according to claim 5 , wherein a claim 5 , b claim 5 , and c in general formula (5) each independently represent an integer in a range of 1 to 10.7. The compound according to claim 5 , wherein b in general formula (5) represents an integer in a range of 1 to 5.8. The compound according to claim 5 , wherein Rin general formula (5) represents an alkyl group.9. The compound according to claim 8 , wherein Rand Rin general formula (5) each represent a linear alkyl group having 1 to 5 carbon atoms.10. A photocurable composition comprising:a component (A) which is a polymerizable compound;a component (B) which is a photopolymerization initiator; and{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a component (C) which is a hydrogen donor and which is the compound according to .'}11. A method for producing a patterned film claim 8 , the method comprising:{'claim-ref': {'@idref': 'CLM-00010', 'claim 10'}, 'a placement step of placing the photocurable composition according to on a substrate;'}a mold contact step of bringing the photocurable composition into contact with a mold having an original pattern for transferring a pattern shape;an irradiation step of irradiating the photocurable composition with light to form a cured film; anda mold releasing step of releasing the cured film from the mold.12. The method according to claim 11 , wherein a surface of the original pattern of the mold has hydroxyl groups.13. The method according to claim 12 , wherein the surface of the original pattern of ...

Apparatus and method for manufacturing multilayer circuit boards

An apparatus for manufacturing printing circuit boards is provided. The apparatus includes a microcontroller, power supply, two-dimensional stage, laser, and one or more chemical treatment tanks. The apparatus may include a mutlifunctional print module, or multiple independent modules capable of being exchanged, to perform various different processes on a substrate on the same build plate, and may include mechanical means for transporting the substrate during different stages between the build plate, chemical processing chamber(s), and a pressing chamber.

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

The invention provides a method for manufacturing a circuit board comprising the steps of: (a) forming a through hole in a substrate; (b) providing a photo resist to cover a predetermined area adjacent to the through hole on a first surface and a second surface opposite to the first surface of the substrate; and (c) performing an etching process to make the through hole has a shape of dumbbell. 1. A method for manufacturing a circuit board , comprising steps of:(a) forming a through hole in a substrate having a first surface and a second surface opposite to the first surface, wherein the through hole includes a first part adjacent to the first surface, a second part adjacent to the second surface and a third part located between the first part and the second part;(b) providing a photo resist to cover a predetermined area adjacent to the through hole on the first surface and the second surface of the substrate to expose a part of area of the first surface adjacent to the first part and a part of area of the second surface adjacent to the second part; and(c) performing an etching process to make the diameters of the first part and the second part of the through hole get narrower toward the third part.2. The method for manufacturing a circuit board of claim 1 , further comprising a clean process for the substrate before step (c).3. The method for manufacturing a circuit board of claim 2 , wherein the clean process includes a step of cleaning the substrate by ultrasonic vibration.4. The method for manufacturing a circuit board of claim 2 , wherein the clean process is performed for 5-10 minutes.5. The method for manufacturing a circuit board of claim 1 , wherein the etching process of step (c) uses an etching solution including 50-70 wt % H3PO4 claim 1 , 10-20 wt % HNO3 claim 1 , 10-20 wt % CH3COOH and 5-10 wt % deionized water.6. The method for manufacturing a circuit board of claim 1 , wherein the etching process of step (c) is performed by immersing the substrate ...

Fabrication of Intra-Structure Conductive Traces and Interconnects for Three-Dimensional Manufactured Structures

A method for forming a three-dimensional object with at least one conductive trace comprises providing an intermediate structure that is generated (e.g., additively or subtractively generated) from a first material in accordance with a model design of the three-dimensional object. The intermediate structure may have at least one predefined location for the at least one conductive trace. The model design includes the at least one predefined location. Next, the at least one conductive trace may be generated adjacent to the at least one predefined location of the intermediate structure. The at least one conductive trace may be formed of a second material that has an electrical and/or thermal conductivity that is greater than the first material.

SYSTEM FOR DIRECT WRITING ON AN UNEVEN SURFACE OF A WORKPIECE THAT IS COVERED WITH A RADIATION SENSITIVE LAYER USING EXPOSURES HAVING DIFFERENT FOCAL PLANES

The technology disclosed relates to accommodating embedded substrates during direct writing onto a printed circuit board and to other patterning problems that benefit from an extended depth of focus. In particular, it relates to multi-focus direct writing of a workpiece by the continuous or step-wise movement of the workpiece during the sequence of exposures having different focus planes. In one implementation, a multi-arm rotating direct writer is configured for interleaved writing focused on two or more focal planes that generally correspond to two or more surface heights of a radiation sensitive layer that overlays the uneven workpiece. Alternating arms can produce interleaved writing to the two or more focal planes. 1. A system that direct writes on an uneven surface of a workpiece that is covered with a radiation sensitive layer and is moving in a lateral direction , the system comprising:one or more laser sources configured to generate a first writing beam and a second writing beam;one or more optics configured to project the first writing beam and the second writing beam onto the uneven surface of the workpiece, respectively, as a first laser energy exposure and a second laser energy exposure; and perform laser energy pattern imaging on the uneven surface of the workpiece by exposing the uneven surface using the first laser energy exposure and the second laser energy exposure in direct writing operations at a particular lateral point on the workpiece to form a pattern in the radiation sensitive layer,', 'wherein a first height of a first focal plane of the first laser energy exposure at the particular lateral point on the workpiece is different from a second height of a second focal plane of the second laser energy exposure at the particular lateral point on the workpiece, such that the first laser energy exposure at the particular lateral point on the workpiece and the second laser energy exposure at the particular lateral point on the workpiece form an ...

METHOD AND APPARATUS FOR EXPOSURE OF FLEXOGRAPHIC PRINTING PLATES USING LIGHT EMITTING DIODE (LED) RADIATION SOURCES

Apparatus, method, and system for exposing a photosensitive printing plate to radiation, including a plurality of LED point sources configured to emit UV light. The plurality of LED point sources in at least one of a front side set or back side set are controllable in subsets smaller than an entirety of the collective irradiation field corresponding to the respective set. A holder receives the printing plate in a stationary position to receive incident radiation and a controller is configured to control the plurality of LED source subsets. A first LED point source subset is configured to be controlled at a first intensity differing by a factor relative to a second intensity of a second LED point source subset to give the radiation emitted by the respective set an intended degree of homogeneity. 1. An apparatus for exposing a printing plate , the printing plate comprising a photosensitive polymer activated by exposure to radiation , the printing plate having a non-printing back side and a printing front side with a mask for defining an image to be printed , the apparatus comprising:a plurality of radiation sources collectively arranged to expose the front side and the back side of the printing plate to radiation, including a back side radiation source, and a front side radiation source, the front side radiation source comprising a front side set of LED point sources and the back side radiation source comprising a back side set of LED point sources, each LED point source configured to emit UV light, one or both of the front side set of LED point sources and the back side set of LED point sources comprising a plurality of independently controllable LED point source subsets smaller than an entirety of the collective irradiation field corresponding to the respective front side or back side set;a holder configured to receive the printing plate in a stationary position to receive incident radiation from the one or more radiation sources during irradiating the printing ...

SENSOR SYSTEM UPGRADE KIT FOR CONVEYORIZED OVEN

A kit for retrofitting an oven processing system can be used to upgrade temperature monitoring capability. The oven processing system includes an oven and a conveyor belt. The oven defines a heated tunnel. The conveyor belt travels through the tunnel along a lateral axis. The kit at least includes a plurality of sensor modules. The sensor modules are elongate bodies with a sensing end that is mounted inside the oven. The sensor modules individually include a gas conduit and an electrical cable. The gas conduit is coupled to a pressurized source of gas. The electrical cable is coupled to a data acquisition unit that is located outside of the heated tunnel. 1. An oven processing system comprising:an oven having a heated tunnel passing laterally therethrough;a conveyor belt that travels laterally through the heated tunnel along a first axis; [ an enclosure containing a substrate and a thermopile lens, the substrate having a first side and a second side, the first side having a thermopile configured to output a first signal indicative of a surface temperature of an object on the conveyor belt relative to the substrate, the second side having a temperature sensor configured to output a second signal indicative of a temperature of the substrate, the thermopile lens overlying the thermopile and aligned with an opening in the enclosure;', 'a housing enclosing the enclosure and including an opening aligned with the thermopile lens to allow infrared light from the object to reach the thermopile;', 'a gas conduit coupled to the housing; and', 'an electrical cable coupled to the substrate;, 'a plurality of sensor modules individually including, 'a data acquisition unit coupled to the electrical cable that receives the first and second signals from the sensor modules and outputs information indicative of a surface temperature of the object; and', 'a source of pressurized gas coupled to the gas conduit whereby gas flows through the conduit, to the housing, and out the opening in ...

SELECTIVE VACUUM PRINTING MACHINE

A system that may include a apertured structure that is configured to support a substrate and a vacuum supply unit that is configured to (i) prevent a supply of vacuum to a first area of the substrate during a first processing period during which the first area is processed and a second area of the substrate is not processed; (ii) provide vacuum to the second area during the first processing period; (iii) prevent the supply of vacuum to the second area during a second processing period during which the second area is processed and the first area is not processed; and (iv) provide vacuum to the first area during the second processing period. 1. A system , comprising:a apertured structure that is configured to support a substrate;a vacuum supply unit that is configured to:prevent a supply of vacuum to a first area of the substrate during a first processing period during which the first area is processed and a second area of the substrate is not processed;provide vacuum to the second area during the first processing period;prevent the supply of vacuum to the second area during a second processing period during which the second area is processed and the first area is not processed; andprovide vacuum to the first area during the second processing period.2. The system according to claim 1 , wherein the vacuum supply unit comprises (a) a blocking module that is configured to selectively prevent the supply of vacuum and (b) a positioning module that is configured to determine a position of the blocking module.3. The system according to claim 2 , comprising:a first conduit for providing vacuum to the first area of the substrate;a second conduit for providing vacuum to the second area of the substrate;wherein the positioning module is configured to position, during the first processing period, the blocking module at a first position thereby blocking the first conduit; andwherein the positioning module is configured to position, during the second processing period, the ...

AUTOMATICALLY CONTROLLING A LIQUID SPRAY PATTERN

A dispensing control system, including a frame component having a first side surface and a second side surface, a first sensor portion positioned proximate the first side surface, and a second sensor portion positioned proximate the second side surface, the second sensor portion being separated from the first sensor portion a distance to allow a liquid spray stream exiting a dispenser of a conformal coating machine to pass therebetween, wherein the first sensor portion transmits a beam of light towards the second sensor portion to measure the liquid spray stream exiting the dispenser, the beam of light encompassing both edges of the liquid spray stream while the dispenser is stationary, is provided. Furthermore, an associated method is also provided. 1. A dispensing control system , comprising:a frame component having a first side surface and a second side surface;a first sensor portion positioned proximate the first side surface; anda second sensor portion positioned proximate the second side surface, the second sensor portion being separated from the first sensor portion a distance to allow a liquid spray stream exiting a dispenser of a conformal coating machine to pass therebetween;wherein the first sensor portion transmits a beam of light towards the second sensor portion to measure an actual width of the liquid spray stream exiting the dispenser based on light not received by the second sensor, the beam of light having a width greater than the actual width of the liquid spray pattern, and contacting an entire width of the liquid spray stream while the dispenser and the first sensor and the second sensor are stationary.2. The system of claim 1 , wherein the measured liquid spray stream is compared with a desired liquid spray stream.3. The system of claim 1 , wherein the measured liquid spray stream is adjusted to be closer to the desired liquid spray stream.4. The system of claim 1 , wherein the second sensor portion receives the beam of light emitted from the ...

FLEXIBLE CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME

A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI). 1. A method of manufacturing a flexible circuit board , comprising:providing a substrate having an upper surface and a lower surface;forming a polyamic acid layer on the surface of the substrate, and conducting a first pre-curing process on the polyamic acid layer such that the polyamic acid layer is semi-cured;depositing a photoresist on the polyamic acid layer, and conducting a second pre-curing process on the photoresist and the polyamic acid layer;exposing and developing the photoresist according to a circuit configuration diagram to partially remove the photoresist and the polyamic acid layer thereunder, partially revealing the surface of the substrate and leaving a remaining photoresist and a remaining polyamic acid layer thereunder, wherein the remaining polyamic acid layer and the remaining photoresist jointly defines a compartment having an inner wall surface including at least a side wall and a bottom wall;forming an adhesion enhancing layer on the side wall and the bottom wall by using an adhesion enhancer;forming a first electrically conducting layer on the adhesion enhancing layer to fix the first electrically conducting layer on the bottom wall and the side wall;removing the remaining photoresist and revealing the polyamic acid layer thereunder;curing the remaining polyamic acid layer which ...

HOLDING DEVICE FOR HOLDING PRINTED CIRCUIT BOARDS AND THE LIKE

The invention relates to a holding device for holding substrates such as printed circuit boards, metal sheets, foils or the like, comprising a suction surface, the suction surface having a plurality of suction nozzles and the suction nozzles being subjected to a negative pressure relative to the ambient pressure by means of a device providing negative pressure for providing a holding force for one or more substrates, wherein the device providing negative pressure provides negative pressure, such that the ratio of the cumulated drop in pressure of all suction nozzles to the cumulated drop in pressure of all suction nozzles and supply lines of the suction nozzles up to the device providing negative pressure is greater than 0.25%, in particular greater than 1%, preferably greater than 25%, in particular greater than 35%, preferably greater than 40%. 1. A holding device for holding substrates such as printed circuit boards , metal sheets , foils or the like ,comprisinga suction surface, wherein the suction surface has a plurality of suction nozzles and wherein the suction nozzles can be subjected to a negative pressure relative to the ambient pressure by means of a device providing negative pressure for providing a holding force for one or more substrates,characterised in that,the device providing negative pressure provides a negative pressure such that the ratio of the cumulated drop in pressure of all suction nozzles and the cumulated drop in pressure of all suction nozzles and supply lines of the suction nozzles to the device providing negative pressure is greater than 0.25%, in particular greater than 1%, preferably greater than 25%, in particular greater than 35%, preferably greater than 40%.2. The holding device according to claim 1 , at least one of the suction nozzles having a suction opening such that a cross-sectional area of the suction opening is larger than the cross-sectional area of the suction nozzle.3101. The holding device according to claim 2 , the ...

Photopolymer for anti-yellowing and anti-thermal cracking applications

An acrylate based photopolymer with high yellowing resistance, excellent photo sensitivity, high toughness, and high glass transition temperature, methods of preparation and used thereof, and solders comprising the same.

ZERO-MISALIGNMENT VIA-PAD STRUCTURES

A photoresist is deposited on a seed layer on a substrate. A first region of the photoresist is removed to expose a first portion of the seed layer to form a via-pad structure. A first conductive layer is deposited onto the first portion of the seed layer. A second region of the photoresist adjacent to the first region is removed to expose a second portion of the seed layer to form a line. A second conductive layer is deposited onto the first conductive layer and the second portion of the seed layer. 1. An apparatus , comprisinga via-pad structure over a substrate; anda conductive line adjacent to the via-pad structure over a second portion of a substrate, wherein the via-pad structure comprises: a lower portion of a first conductive layer that represents a pad portion, and a first portion of a second conductive layer on an upper portion of the first conductive layer that represents a via portion, wherein a size of the pad portion and the size of the via portion are substantially similar.2. The apparatus of claim 1 , wherein the via portion comprises a sidewall extending in a direction of the conductive line.3. The apparatus of claim 1 , wherein the conductive line comprises a second portion of the second conductive layer over the second portion of the substrate.4. The apparatus of claim 1 , wherein the via-pad structure is over a first portion of a seed layer on the substrate claim 1 , wherein the seed layer is deposited between at least one of the first conductive layer and the second conductive layer and the substrate.5. The apparatus of claim 1 , wherein at least one of the first conductive layer and the second conductive layer comprises copper.6. An apparatus claim 1 , comprising:a via-pad structure comprising: a first conductive layer on substrate, wherein a lower portion of the first conductive layer represents a pad portion; and a first portion of a second conductive layer on an upper portion of the first conductive layer represents a via portion; anda ...

COATING DEVICE AND COATING METHOD

The disclosure provides a coating device and a coating method. The coating device is used for coating viscous ink on a substrate to form a film. The substrate includes two opposite mounting surfaces. The coating device comprising: an accommodating mechanism, a coating mechanism and a forming mechanism. The coating mechanism includes two coating units. Each coating unit includes a rotatable filling roller for filling with pressure the viscous ink in the hole on the corresponding mounting surface to form an initial layer. The forming mechanism is used for scraping the initial layer covering on the mounting surfaces to form the film. The method of coating and then adjusting the thickness of the film may improve the quality of the products. By using the above disclosure, the production line can be simplified to lower the device costs, and the manufacturing time can be reduced to improve the manufacturing efficiency. 1. A coating device for coating viscous ink on a substrate to form a film , the substrate conveyed along a plummet direction , the substrate comprising two opposite mounting surfaces and a plurality of holes , the mounting surfaces being opposite and uneven , the holes separately formed on the mounting surfaces , the coating device comprising:an accommodating mechanism, for accommodating the viscous ink and comprising a channel for providing the substrate to pass through;a coating mechanism, disposed above the accommodating mechanism, and for coating the viscous ink on the substrate passing through the channel, the coating mechanism comprising two coating units, the two coating units separately disposed on two opposite sides of the substrate, wherein the coating units separately transfer the viscous ink in the accommodating mechanism onto the mounting surfaces, each coating unit comprises a rotatable filling roller for filling with pressure the viscous ink in the hole on the corresponding mounting surface to form an initial layer; anda forming mechanism, ...

METHOD AND APPARATUS FOR AUTOMATICALLY ADJUSTING DISPENSING UNITS OF A DISPENSER

A dispensing apparatus includes a frame having a gantry configured to provide movement in the X axis and Y axis directions, and first and second dispensing units coupled to the gantry and configured to dispense material onto a substrate. The second dispensing unit is coupled to the gantry by an automatic adjustment mechanism. The dispensing apparatus further includes a controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism. The automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing. Methods of dispensing material on the substrate are further disclosed. 1. A dispensing apparatus comprising:a frame including a gantry configured to provide movement in X axis and Y axis directions;a first dispenser and a second dispenser coupled to the gantry with the gantry being configured to move the first dispenser and the second dispenser in the X axis and Y axis directions, the first dispenser and the second dispenser each being configured to dispense material, one of the first dispenser and the second dispenser being coupled to the gantry by an automatic adjustment mechanism, the first dispenser and the second dispenser being offset from one another a distance, with the automatic adjustment mechanism being configured to adjust the distance by moving the one of the first dispenser and the second dispenser a distance in one of the X axis direction and the Y axis directions separate from and in addition to the X axis and Y axis movement provided by the gantry;an imager coupled to one of the frame and the gantry, the imager being configured to capture at least one image of a first pattern and a second pattern of at least one electronic substrate, the second pattern being substantially identical to the first pattern; anda controller configured to control the ...

Method and apparatus for automatically adjusting dispensing units of a dispenser

A dispensing apparatus includes a frame having a gantry configured to provide movement in the X axis and Y axis directions, and first and second dispensing units coupled to the gantry and configured to dispense material onto a substrate. The second dispensing unit is coupled to the gantry by an automatic adjustment mechanism. The dispensing apparatus further includes a controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism. The automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing. Methods of dispensing material on the substrate are further disclosed.

METHOD AND APPARATUS FOR AUTOMATICALLY ADJUSTING DISPENSING UNITS OF A DISPENSER

A dispensing apparatus includes a frame having a gantry configured to provide movement in the X axis and Y axis directions, and first and second dispensing units coupled to the gantry and configured to dispense material onto a substrate. The second dispensing unit is coupled to the gantry by an automatic adjustment mechanism. The dispensing apparatus further includes a controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism. The automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing. Methods of dispensing material on the substrate are further disclosed. 1. A dispensing apparatus comprising:a frame including a gantry configured to provide movement in X axis and Y axis directions, the gantry including a beam configured to move in the Y axis direction to achieve Y axis movement, the gantry further including a carriage mounted on the beam, the carriage being configured to move along the length of the beam in the X axis direction;a support coupled to the frame, the support being configured to support at least one electronic substrate under the gantry;a first dispenser and a second dispenser coupled to the carriage, the first dispenser and the second dispenser each being configured to dispense material, one of the first dispenser and the second dispenser being coupled to the carriage by an automatic adjustment mechanism; anda controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism,wherein the automatic adjustment mechanism is configured to move the one of the first dispenser and the second dispenser in the X axis direction to adjust a spacing between the first dispenser and the second dispenser during a dispensing operation, andwherein the automatic adjustment ...

Shielded RF Transmission Lines in Low Temperature Co-fired Ceramic Constructs and Method of Making Same

An integrated circuit assembly which includes stacked printed ceramic substrate layers, and incorporates a shielding enclosure extending about the electrical conductor traces and interconnects which form the assembly circuitry. The shielding enclosure is configured to reduce electric and/or magnetic field leakage or interference with the traces and interconnects. The enclosure is provided as a cage about the assembly circuitry, and which is formed as arrays of ground conductors in electrical communication with ground plates. 1. An integrated circuit assembly comprising:a low temperature co-fired ceramic (LTCC) layer, said LTCC layer having a transverse thickness and opposed top and bottom surfaces; 'at least one electrical interconnect member extending transversely through said LTCC layer;', 'an electrical conductor comprisinga shielding enclosure comprising a ground plate assembly and an array of ground conductor members, each of said ground conductor members extending transversely through said LTCC layer from a respective first conductor end to a second conductor end, the ground conductor members of said array being disposed in an orientation spaced from and extending about at least part of a periphery of said electrical interconnect member, wherein the first and second conductor ends of the ground conductor members each electrically communicate with the ground plate assembly, andthe spacing of the ground conductors members in the conductor array is selected to reduce at least one of electric and/or magnetic field interference with or from the electrical interconnect member.2. The assembly as claimed in claim 1 , comprising a further low temperature co-fired ceramic (LTCC) layer claim 1 , a bottom surface of said further LTCC layer being positioned substantially in juxtaposition with a top surface of said LTCC layer claim 1 , said electrical conductor further comprising:an electric conductor trace extending longitudinally along said top surface,said electric ...

PATTERN FORMING METHOD

A pattern forming method comprises dispensing a curable composition onto an underlayer of a substrate; bringing the curable composition into contact with a mold; irradiating the curable composition with light to form a cured film; and separating the cured film from the mold. The proportion of the number of carbon atoms relative to the total number of atoms in the underlayer is 80% or more. The dispensing step comprises a first dispensing step of dispensing a curable composition (A1) substantially free of a fluorosurfactant onto the underlayer, and a second dispensing step of dripping a droplet of a curable composition (A2) having a fluorosurfactant concentration in components excluding a solvent of 1.1% by mass or less onto the curable composition (A1) discretely. 1. A pattern forming method comprising in this order:a dispensing step of dispensing a curable composition onto an underlayer of a substrate having the underlayer on a surface;a mold contacting step of bringing the curable composition into contact with a mold;a light irradiation step of irradiating the curable composition with light to form a cured film; anda mold releasing step of separating the cured film from the mold, whereina proportion of the number of carbon atoms relative to the total number of atoms excluding hydrogen in the underlayer is 80% or more, andthe dispensing step comprises a first dispensing step of dispensing a curable composition (A1) substantially free of a fluorosurfactant onto the underlayer, and a second dispensing step of dripping a droplet of a curable composition (A2) having a fluorosurfactant concentration in components excluding a solvent of 1.1% by mass or less onto the curable composition (A1) discretely.2. The pattern forming method according to claim 1 , wherein the curable composition (A1) has substantially no photoreactivity.3. The pattern forming method according to claim 1 , wherein surface tension of the curable composition (A1) excluding a solvent is greater than ...

Methods and Systems For Connecting Inter-Layer Conductors and Components in 3D Structures, Structural Components, and Structural Electronic, Electromagnetic and Electromechanical Components/Devices

The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device. 1. A method of connecting a first component or conductor to a second component or conductor in a three-dimensional electronic , electromagnetic or electromechanical component/device comprising the steps of:providing at least a first layer of a substrate material having the first component or conductor disposed on or within the first layer;depositing a second layer of the substrate material on the first layer, wherein the second layer includes an elongated cavity having a first end and a second end such that the first end is disposed above a first exposed portion of the first component or conductor;attaching a first end of the filament to the first exposed portion of the first component or conductor via the first end of the elongated cavity;placing a second end of the filament within the second end of the elongated cavity such that the filament is disposed within the elongated cavity;depositing a third layer of the substrate material on the second layer such that a first portion of the elongated cavity proximate to the first end of the elongated cavity is covered by the third layer and a second portion of the elongated cavity is exposed;depositing the second component or conductor on or within the third layer proximate to the second portion of the elongated cavity;depositing a fourth layer of the substrate material on the third layer such that a second portion of the second component or conductor is exposed and the second portion of the elongated cavity is exposed; andremoving the second end of the filament from the second portion of the elongated cavity and attaching the second end of the filament to the exposed portion of the second component or conductor.2. The method as recited in ...

FLUX RESIDUE DETECTION

A system for flux residue detection is provided. The system includes a flux heater, where the flux heater controls a temperature of a flux spray applied to a printed circuit board, and an infrared camera, wherein the infrared camera provides a thermal image of the flux on the printed circuit board. A method, a computer system, and a computer program product for flux residue detection is provided, including setting flux application parameters, applying flux to a printed circuit board, and capturing an infrared image of the flux applied to the printed circuit board. A method, a computer system, and a computer program product for flux residue detection is provided, including setting flux application parameters, applying flux to a printed circuit board, capturing an infrared image of the flux applied to the printed circuit board, and determining there is excess flux residue on the printed circuit board. 1. An apparatus comprising:a flux heater, wherein the flux heater controls a temperature of flux applied to a printed circuit board; andan infrared camera, wherein the infrared camera provides a thermal image of the flux on the printed circuit board.2. The apparatus according to claim 1 , further comprising:an infrared camera controller, wherein the infrared camera controller stores a thermal image of the flux applied printed circuit board.3. The apparatus according to claim 1 , further comprising:a flux spray controller, wherein the flux spray controller determines a pressure of the flux, a temperature of the flux heater, a spray pattern of the flux, a flux duration, and a pre-heater temperature.4. The apparatus according to claim 1 , further comprising:a conveyor for carrying the printed circuit board sequentially through a flux spray, a pre-heater, and a wave solder bath.5. The apparatus according to claim 1 , wherein the flux heater comprises a heating element wrapped around a fluxer claim 1 , the flux is dispensed by the fluxer.6. The apparatus according to claim 1 ...

Germanium oxide pre-clean module and process

In some embodiments, a method for integrated circuit fabrication includes removing oxide material from a surface of a substrate, where the surface includes silicon and germanium. Removing the oxide material includes depositing a halogen-containing pre-clean material on a silicon oxide-containing surface and sublimating a portion of the halogen-containing pre-clean material to expose the silicon on the surface. A passivation film is deposited on the exposed silicon. The passivation film may include chlorine. The passivation film may prevent contamination of the silicon surface by chemical species from the later sublimation, which may be at a higher temperature than the earlier sublimation. Subsequently, a remaining portion of the halogen-containing pre-clean material and the passivation film are sublimated. A target material, such as a conductive material, may subsequently be deposited on the substrate surface.

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

A wiring board of an embodiment includes a through via, a first insulating film disposed around the through via, a second insulating film disposed around the first insulating film, a third insulating film disposed around the second insulating film and a resin disposed around the third insulating film. The resin includes fillers. The second insulating film has a relative permittivity lower than a relative permittivity of the first insulating film. The third insulating film has a relative permittivity higher than a relative permittivity of the second insulating film. 1. A wiring board comprising:a through via;a first insulating film disposed around the through via;a second insulating film disposed around the first insulating film, the second insulating film having a relative permittivity lower than a relative permittivity of the first insulating film;a third insulating film disposed around the second insulating film, the third insulating film having a relative permittivity higher than the relative permittivity of the second insulating film; anda resin disposed around the third insulating film, the resin including fillers.2. The wiring board according to claim 1 , wherein the relative permittivity of the first insulating film and the relative permittivity of the third insulating film are not less than 2.4 and not more than 9.3. The wiring board according to claim 1 , wherein a film thickness of the second insulating film is not less than 2.7% and not more than 20% of a sum of a film thickness of the first insulating film and a film thickness of the third insulating film.4. The wiring board according to claim 1 , wherein a ratio of (i) a difference between a distance from an inside surface of the first insulating film to a center of the film thickness of the second insulating film and a half of a distance from the inside surface of the first insulating film to an outside surface of the third insulating film to (ii) the distance from the inside surface of the first ...

CARRYING DEVICE, WET ETCHING APPARATUS AND USAGE METHOD THEREOF

The present invention discloses a carrying device, a wet etching apparatus and a usage method thereof. The carrying device comprises a carrying body and a heating unit both disposed under a to-be-processed substrate, the carrying body is used for carrying the to-be-processed substrate such that the to-be-processed substrate is placed inclined; the heating unit is used for heating the to-be-processed substrate, such that temperature of the to-be-processed substrate rises gradually from a top portion to a bottom portion thereof. In the technical solution of the present invention, by disposing the heating unit under the to-be-processed substrate, the temperature of the to-be-processed substrate rises gradually from the top portion to the bottom portion thereof, thus etch rate of the etchant on the bottom portion of the to-be-processed substrate can be increased, and uniformity of etch rate in the inclined wet etching process is improved. 110-. (canceled)11. A carrying device , used for carrying a to-be-processed substrate in a wet etching process , the carrying device comprising:a carrying body, disposed under the to-be-processed substrate and used for carrying the to-be-processed substrate such that the to-be-processed substrate is placed inclined;a heating unit, disposed under the to-be-processed substrate and used for heating the to-be-processed substrate, such that temperature of the to-be-processed substrate rises gradually along an inclined direction from a top portion to a bottom portion thereof.12. The carrying device of claim 11 , wherein the heating unit includes a plurality of thermal light sources claim 11 , and light generated by the thermal light sources is emitted to a back face of the to-be-processed substrate.13. The carrying device of claim 12 , wherein distances of the thermal light sources to the to-be-processed substrate are equal claim 12 , the thermal light sources have equal output powers claim 12 , the top portion of the to-be-processed ...

Laser ablation for wire bonding on organic solderability preservative surface

A printed circuit board is disclosed. The printed circuit board includes: a substrate layer; a copper layer disposed on the substrate layer; and an organic solderability preservative (OSP) layer disposed on the copper layer. The OSP layer defines one or more laser treated OSP surfaces.

SCREEN PRINTER

A screen printer comprising: a conveyance device configured to convey a board; a board holding device configured to position a conveyed board at a printing position; a stencil holding device configured to attach a stencil above the held board; a squeegee device configured to fill pattern holes of the stencil with solder paste; a board raising and lowering device configured to raise and lower the board positioned by the board holding device; and a control device configured to perform drive control of each the above devices, the control device including a standby printing processing section configured to raise the board from below with respect to the stencil such that the board contacts the stencil, stand by in a state with solder paste filled in the pattern holes, and lower the board to separate the board from the stencil in accordance with a board conveyance signal. 13.-. (canceled)4. A screen printer comprising:a conveyance device configured to convey a board;a board holding device configured to position a conveyed board at a printing position;a stencil holding device configured to attach a stencil above the held board;a squeegee device configured to fill pattern holes of the stencil with solder paste;a board raising and lowering device configured to raise and lower the board positioned by the board holding device; anda control device configured to perform drive control of each the above devices, the control device including a standby printing processing section configured to raise the board from below with respect to the stencil such that the board contacts the stencil, stand by in a state with solder paste filled in the pattern holes, and lower the board to separate the board from the stencil in accordance with a board conveyance signal.5. The screen printer according to claim 4 , whereinthe control device is configured to lower the board to separate the board from the stencil in accordance with the board conveyance signal that is issued from another machine or ...

PROCESS AND APPARATUS FOR CONTROLLED EXPOSURE OF FLEXOGRAPHIC PRINTING PLATES AND ADJUSTING THE FLOOR THEREOF

A method and apparatus to expose photosensitive printing plates with a predetermined radiation density from the main side (top) and a predetermined radiation density from the back side (bottom). The method comprises executing the main exposure with a time delay after the back exposure. The time delay between back exposure and main exposure is optimized to create smaller stable single dot elements on the photosensitive printing plate after processing and smaller single element dot sizes printed on the print substrate. The plate floor may be adjusted by performing a back-side-only exposure prior to executing the combined back and main exposure with the time delay. 1. An apparatus for preparing a printing plate comprising a photosensitive polymer activated by exposure to radiation , the printing plate having a non-printing back side and a printing front side with a mask for defining an image to be printed , the apparatus comprising:a plurality of radiation sources, comprising at least one front source positioned to expose the front side of the plate to radiation, and at least one back source positioned to expose the back side of the plate to radiation, the at least one front source and the at least one back source each having an irradiation field covering an area at least coextensive with a width of the plate, the irradiation field of the linear front source and the irradiation field of the linear back source spaced apart from one another by a lateral distance along the length of the plate;a holder configured to receive the printing plate in a position to receive incident radiation from the plurality of radiation sources;a controller connected to the plurality of radiation sources;means for causing relative movement between the printing plate and the at least one front source and the at least one back source;the apparatus configured to, for each specific coordinate corresponding to a cross-sectional portion of the plate, first (a) commence irradiating the back side of ...

STEPPED VIAS FOR NEXT GENERATION SPEEDS

A circuit board assembly of an information handling system has stepped diameter vias that carry communication signals through printed circuit board (PCB) substrates. Each stepped diameter via has a first barrel portion of a first diameter that is drilled through a first portion of the PCB substrates and that is at least lined with a conductive material to electrically conduct a selected one of: (i) a direct current and (ii) a communication signal from an outer layer to an internal layer of the more than one PCB substrate. Each stepped diameter via further includes a second barrel portion that extends from the first barrel portion deeper into the PCB substrates. The second barrel portion has a second diameter that is less than the first diameter and the smaller second diameter improves signal integrity (SI). 1. A circuit board assembly comprising:more than one printed circuit board (PCB) substrate comprising an upper signal conductor, a buried signal conductor, and a plurality of ground conductors including upper ground conductors and lower ground conductors; a first barrel portion of a first diameter that is drilled through a first upper portion of the more than one PCB substrate and that is at least lined with a conductive material to electrically conduct a selected one of: (i) a direct current and (ii) a communication signal from an outer layer having the upper signal conductor to an internal layer of the more than one PCB substrate, the internal layer having the buried signal conductor, the upper ground conductors terminating proximate to the first barrel portion, with signal integrity maintained by anti-pad-spacing; and', 'a second barrel portion that extends from the first barrel portion deeper into the more than one PCB substrate and that has a second diameter that is less than the first diameter, the second barrel portion being proximate to the lower ground conductors, wherein the second diameter being less than the first diameter increases anti-pad spacing ...

METHOD AND APPARATUS FOR AUTOMATICALLY ADJUSTING DISPENSING UNITS OF A DISPENSER

A dispensing apparatus includes a frame having a gantry configured to provide movement in the X axis and Y axis directions, and first and second dispensing units coupled to the gantry and configured to dispense material onto a substrate. The second dispensing unit is coupled to the gantry by an automatic adjustment mechanism. The dispensing apparatus further includes a controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism. The automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing. Methods of dispensing material on the substrate are further disclosed. 1. A dispensing apparatus comprising:a frame including a gantry configured to provide movement in X axis and Y axis directions;a first dispenser and a second dispenser coupled to the gantry, the first dispenser and the second dispenser each being configured to dispense material, one of the first dispenser and the second dispenser being coupled to the gantry by an automatic adjustment mechanism;an imager coupled to one of the frame and the gantry, the imager being configured to capture at least one image of a first pattern and a second pattern of at least one electronic substrate, the second pattern being substantially identical to the first pattern; anda controller configured to control the operation of the gantry, the first dispenser, the second dispenser, the automatic adjustment mechanism, and the imager,wherein the automatic adjustment mechanism is configured to adjust a spacing between the first dispenser and the second dispenser during a dispensing operation,wherein the controller is configured to use the at least one image to verify whether the first pattern and the second pattern are properly positioned, andwherein if the first pattern and the second pattern are not properly positioned, ...

DESMEAR MODULE OF A HORIZONTAL PROCESS LINE AND A METHOD FOR SEPARATION AND REMOVAL OF DESMEAR PARTICLES FROM SUCH A DESMEAR MODULE

A desmear module for a horizontal galvanic or wet-chemical process line for metal, in particular copper, deposition on a substrate to be treated for a removal of precipitates comprising a desmear container connectable to a desmear unit, a pump and at least a first liquid connection element for connecting said pump with the desmear unit, wherein said pump is in conjunction with said desmear unit by said at least first liquid connection element; and wherein a treatment liquid level is provided inside the desmear module, which is above an intake area of the pump; wherein the desmear module further comprises at least a first liquid area, at least an adjacent second liquid area comprising the intake area of the pump, and at least a first separating element arranged between said at least first liquid area and said at least second liquid area. 1. Desmear module for a horizontal galvanic or wet-chemical process line for metal , deposition on a substrate to be treated for a removal of precipitates comprising a desmear container being connectable to a desmear unit , a pump and at least a first liquid connection element for connecting said pump with the desmear unit , wherein said pump is in conjunction with said desmear unit by said at least first liquid connection element and wherein a treatment liquid level is provided inside of the desmear module , which is above of an intake area of the pump characterized in thatthe desmear module further comprises at least a first liquid area, at least an adjacent second liquid area comprising the intake area of the pump, and at least a first separating element arranged between said at least first liquid area and said at least second liquid area,{'b': '9', 'wherein the first separating element is a non-permeable liquid weir being arranged below the treatment liquid level inside of the desmear module comprising an overflow edge to allow treatment liquid to flow from the first liquid area () to the second liquid area or'}wherein the term ...

METHOD FOR CURING SOLDER PASTE ON A THERMALLY FRAGILE SUBSTRATE

A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the cornponent via thermal conduction in order to heat and melt the solder paste. 1. A method for curing solder paste on a thermally fragile substrate , said method comprising:printing an optically reflective layer and an optically absorptive layer on a thermally fragile substrate;selectively depositing a plurality of conductive traces on said optically reflective layer and on said optically absorptive layer;applying solder paste on selective locations corresponding to locations of said optically absorptive layer;placing a component on said solder paste; andirradiating said thermally fragile substrate from one side with uniform pulsed light, wherein said optically absorptive layer absorbs said pulsed light and becomes heated, and said heat is subsequently transferred to said solder paste and said component via thermal conduction to melt said solder paste.2. method of claim 1 , wherein locations of said optically absorptive layer correspond to locations of said solder paste utilized to connect to said components.3. The method of claim 1 , wherein said thermally fragile substrate is optically transparent.4. The method of . wherein said thermally fragile substrate is PEN.5. The method of claim 1 , wherein said thermally fragile substrate is PET.6. The method of claim 1 , wherein ...

TRANSPARENT CONDUCTIVE ELEMENT, METHOD FOR MANUFACTURING THE SAME, INPUT DEVICE, ELECTRONIC APPARATUS, AND METHOD FOR MACHINING TRANSPARENT CONDUCTIVE LAYER

A large-area transparent conductive element easy to form a fine pattern includes a substrate having a surface, and transparent conductive portions and transparent insulating portions that are alternately provided on the surface in a planar manner. At least one type of unit section including a random pattern is repeated in at least either the transparent conductive portions or the transparent insulating portions. 1. A transparent conductive element comprising:a substrate having a surface; andtransparent conductive portions and transparent insulating portions that are alternately formed on the surface in a planar manner,at least one type of unit section including a random pattern being repeated in at least either the transparent conductive portions or the transparent insulating portions.2. The transparent conductive element according to claim 1 , wherein boundary portions between the transparent conductive portions and the transparent insulating portions include part of the random pattern.3. The transparent conductive element according to claim 2 , wherein:the unit section has a side which a pattern element of the random pattern is in contact with or cut by; andthe side is provided at boundaries between the transparent conductive portions and the transparent insulating portions.4. The transparent conductive element according to claim 1 , wherein a unit section including a boundary pattern is repeated in the boundary portions between the transparent conductive portions and the transparent insulating portions.5. The transparent conductive element according to claim 1 , wherein:the random pattern of the transparent conductive portions is a pattern of a plurality of insulating elements that are provided apart from each other; andthe random pattern of the transparent insulating portions is a pattern of a plurality of conductive elements that are provided apart from each other.6. The transparent conductive element according to claim 5 , wherein:the insulating elements are ...

MEMBER FOR FLEXIBLE ELEMENT AND MANUFACTURING METHOD THEREOF

In the present invention, a copper electrode having a nanohole structure is prepared by using a polymer substrate in the form of nanopillars in order to avoid fatigue fracture that causes degradation of electrical and mechanical properties of a flexible electrode during repetitive bending of a typical metal electrode. The nanohole structure may annihilate dislocations to suppress the initiation of fracture and may blunt crack tips to delay the propagation of damage. Therefore, the nanohole electrode exhibits very small changes in electrical resistance during a bending fatigue test. 1. A member for a flexible device , the member comprising:a substrate; anda metal electrode which is formed on the substrate and includes at least one nanohole.2. The member of claim 1 , wherein the substrate comprises a substrate on which at least one or more nanopillars is formed claim 1 , andthe nanopillars penetrate through the nanoholes.3. The member of claim 2 , wherein the nanopillars are formed integrally with the substrate and extend upward from a top surface of the substrate.4. The member of claim 2 , wherein the metal electrode comprises a plate-shaped metal electrode that is formed on the entire surface of the substrate.5. The member of claim 2 , wherein the nanopillar is spaced apart from a sidewall of the nanohole.6. The member of claim 2 , wherein the substrate and the nanopillar include polyimide claim 2 , andthe metal electrode includes copper.7. The member of claim 2 , wherein the at least one or more nanopillars includes a plurality of nanopillars claim 2 , andthe at least one or more nanoholes includes a plurality of nanoholes.8. The member of claim 7 , wherein each of the plurality of nanopillars penetrates through each of the plurality of nanoholes.9. The member of claim 7 , wherein the metal electrode comprises a metal that is composed of a plurality of crystal grains claim 7 , andat least one crystal grain of the plurality of crystal grains comprises the at least ...

PRODUCTION METHOD AND DEVICE OF SURFACE ROUGHENED COPPER PLATE, AND SURFACE ROUGHENED COPPER PLATE

PROBLEMS TO BE SOLVED: To provide a process for roughening both sides of a copper plate by forming a protrusion with a fine bump shape on the both sides of the copper plate, and then to provide a process for a deterioration of an electroplating solution for plating copper to become hard to progress therein. 1. A device for producing a copper plate with a roughened surface , comprising:an electrolytic bath for retaining an electroplating copper solution;one pair or a plurality of pairs of positive electrodes arranged in the electrolytic bath to face each other in a tandem arrangement;one pair or a plurality of pairs of negative electrodes arranged in the electrolytic bath to face each other in a tandem arrangement;a negative electrode bus bar arranged horizontally at an upper side between the one pair or the plurality of pairs of the positive electrodes for hanging the copper plate;a positive electrode bus bar arranged horizontally at an upper side between the one pair or the plurality of pairs of the negative electrodes for hanging the copper plate; andan insulating bar for connecting the negative electrode bus bar and the positive electrode bus bar.2. A device for producing a copper plate with a roughened surface , comprising:an electrolytic bath for retaining an electroplating copper solution;one pair or a plurality of pairs of positive electrodes and one pair or a plurality of pairs of negative electrodes alternately arranged in the electrolytic bath to face each other in a tandem arrangement;a negative electrode bus bar arranged horizontally at an upper side between the one pair or the plurality of pairs of the positive electrodes for hanging the copper plate;a positive electrode bus bar arranged horizontally at an upper side between the one pair or the plurality of pairs of the negative electrodes for hanging the copper plate; andan insulating bar for connecting the negative electrode bus bar and the positive electrode bus bar.3. A copper plate with a roughened ...

Advanced Manufacturing Method for the Manufacturing of High-Precision Electronic Flexible Circuit Boards enabling the Democratization of design, development, and production of electronic and electrical devices

The present invention is a novel method of preparing copper sheeting for exposure to UV or optical light in the process of manufacturing flexible printed circuit boards. This method seeks to remove the need for the highly complex, costly, and capital-intensive use of collimated UV lights and vacuum chambers in conventional FPCB manufacturing by preparing copper sheeting for non-vacuum non-collimated UV exposure with a relatively trivial method using clear vinyl stickers, conventional toner-adhering decorative foil, and UV reflective glue. This in turn will “democratize” the design, development, fabrication, production, and distribution of advanced electronics that depend upon the use of high-precision FPCBs.

OPTICAL PROCESSING DEVICE AND OPTICAL PROCESSING METHOD

Disclosed herein is an optical processing device and an optical processing method. The optical processing device comprises: a light source unit configured to emit light; and a processing unit configured to expose an object to be processed to the light emitted from the light source unit. The processing unit includes: a processing region in which the object to be processed is held and exposed to the light in an atmosphere of a processing gas; and a preparatory region through which the processing gas passes, while being exposed to the light, to move toward the processing region, the preparatory region being configured to prevent the object to be processed from being arranged thereon. 1. An optical processing device , comprising:a light source unit configured to emit light; anda processing unit configured to expose an object to be processed to the light emitted from the light source unit,the processing unit includes:a processing region in which the object to be processed is held and exposed to the light in an atmosphere of a processing gas; anda preparatory region through which the processing gas passes, while being exposed to the light, to move toward the processing region, the preparatory region being configured to prevent the object to be processed from being arranged thereon.2. The optical processing device according to claim 1 , wherein the processing unit includes:a placing base configured to place the object to be processed thereon; anda forming instrument configured to prevent the object to be processed from being placed on a part of the placing base to form the preparatory region.3. The optical processing device according to or claim 1 , whereinthe light source unit is provided with a window plate configured to transmit light,the processing unit is provided with a placing base opposing to the window plate and configured to place the object to be processed thereon, andthe preparatory region is a region lying between the window plate and a part of the placing ...

Metal-Free Monolithic Epitaxial Graphene-On-Diamond PWB with Optical Waveguide

According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by thermolysis of layers of a preceramic polymer. A plurality of tubes are formed within the circuit board and comprise a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of graphene that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius. The apparatus also includes a plurality of optical waveguides formed within the circuit board. Each optical waveguide comprises a core of polycrystalline silicon carbide surrounded by polycrystalline diamond. The polycrystalline diamond is formed by thermolysis of poly(hydridocarbyne) and the silicon carbide is formed by thermolysis of poly(methylsilyne). 1. An apparatus comprising:a circuit board made of polycrystalline diamond, the circuit board having been formed by thermolysis of layers of a preceramic polymer;a plurality of tubes formed within the circuit board and comprising a plurality of terminations at one or more surfaces of the circuit board, each tube comprising a layer of graphene that is operable to permit each tube to conduct electrical current, each layer of graphene having been formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius; anda plurality of optical waveguides formed within the circuit board, each optical waveguide comprising a core of polycrystalline silicon carbide surrounded by polycrystalline diamond, the polycrystalline diamond having been formed by thermolysis of poly(hydridocarbyne), and the silicon carbide having been formed by thermolysis of poly(methylsilyne).2. The apparatus of claim 1 , wherein the preceramic polymer comprises one or more of poly(hydridocarbyne) and poly( ...

AUTOMATICALLY CONTROLLING A LIQUID SPRAY PATTERN

A dispensing control system, including a frame component having a first side surface and a second side surface, a first sensor portion positioned proximate the first side surface, and a second sensor portion positioned proximate the second side surface, the second sensor portion being separated from the first sensor portion a distance to allow a liquid spray stream exiting a dispenser of a conformal coating machine to pass therebetween, wherein the first sensor portion transmits a beam of light towards the second sensor portion to measure the liquid spray stream exiting the dispenser, the beam of light encompassing both edges of the liquid spray stream while the dispenser is stationary, is provided. Furthermore, an associated method is also provided. 1. A dispensing control system , comprising:a frame component having a first side surface and a second side surface;a first sensor portion positioned proximate the first side surface; anda second sensor portion positioned proximate the second side surface, the second sensor portion being separated from the first sensor portion a distance to allow a liquid spray stream exiting a dispenser of a conformal coating machine to pass therebetween;wherein the first sensor portion transmits a beam of light towards the second sensor portion to measure the liquid spray stream exiting the dispenser, the beam of light encompassing both edges of the liquid spray stream while the dispenser is stationary.2. The system of claim 1 , wherein the first sensor portion and the second sensor portion are stationary as the entire liquid spray stream is measured.3. The system of claim 1 , wherein the measured liquid spray stream is compared with a desired liquid spray stream.4. The system of claim 3 , wherein the measured liquid spray stream is adjusted to be closer to the desired liquid spray stream.5. The system of claim 1 , wherein the second sensor portion receives the beam of light emitted from the first sensor portion claim 1 , and a width ...

METHOD AND APPARATUS FOR AUTOMATICALLY ADJUSTING DISPENSING UNITS OF A DISPENSER

A dispensing apparatus includes a frame having a gantry configured to provide movement in the X axis and Y axis directions, and first and second dispensing units coupled to the gantry and configured to dispense material onto a substrate. The second dispensing unit is coupled to the gantry by an automatic adjustment mechanism. The dispensing apparatus further includes a controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism. The automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing. Methods of dispensing material on the substrate are further disclosed. 1. A method of dispensing viscous material on an electronic substrate , the method comprising:delivering a first electronic substrate pattern to a dispense position;delivering a second electronic substrate pattern to a dispense position;moving first and second dispensing units over the first and second electronic substrate patterns with a gantry configured to move the first and second dispensing units in an X axis direction and a Y axis direction;aligning the first electronic substrate pattern with the first dispensing unit and the second electronic substrate pattern with the second dispensing unit with an automatic adjustment mechanism configured to move the second dispensing unit in the X axis direction and the Y axis direction a predetermined distance from the first dispensing unit;dispensing material from the first dispensing unit at desired locations on the first electronic substrate pattern; anddispensing material from the second dispensing unit at desired locations on the second electronic substrate pattern.2. The method of claim 1 , wherein dispensing material from the first dispensing unit at desired locations on the first electronic substrate pattern includes lowering the first ...

SUBSTRATE COMPRISING AN ELECTRICAL CIRCUIT PATTERN, METHOD AND SYSTEM FOR PROVIDING SAME

The present disclosure concerns an electrical circuit pattern on a substrate, as well as a method and system for forming same. In a typical embodiment, a light pattern is projected through a transparent layer to cause a patterned release of adhesion between a continuous material layer and the transparent layer. A release layer adhered to the patterned material layer is pulled off the substrate to separate the material having lower adhesion while leaving the material that was not exposed to form the electrical circuit pattern thereon. 1. Method for forming an electrical circuit pattern on a substrate , the method comprisingproviding a stack comprising a continuous material layer adhered between a release layer on one side and a transparent layer on the other side, wherein the continuous material layer is a continuous metal layer or a continuous layer of semiconductor material;providing a light source projecting light onto the stack from the side of the transparent layer; andproviding a mask between the light source and the stack to pattern the projected light onto the stack, wherein the light pattern is projected through the transparent layer to cause a patterned release of adhesion between the continuous material layer and the transparent layer at locations matching the projected light pattern.2. Method according to claim 1 , further comprising separating the release layer from the transparent layer claim 1 , whereina pattern formed in the continuous material layer adheres to the transparent layer at locations where the adhesion between the continuous material layer and the transparent layer was not released by the projected light pattern, anda reciprocal pattern formed in the continuous material layer adheres to the release layer at locations where the adhesion between the continuous material layer and the transparent layer was released by the projected light pattern.3. Method according to claim 1 , wherein the circuit pattern is formed by the patterned continuous ...

Novel Terminations and Couplings Between Chips and Substrates

A method of attaching a chip to the substrate with an outer layer comprising via pillars embedded in a dielectric such as solder mask, with ends of the via pillars flush with said dielectric, the method comprising the steps of: (o) optionally removing organic varnish, (p) positioning a chip having legs terminated with solder bumps in contact with exposed ends of the via pillars, and (q) applying heat to melt the solder bumps and to wet the ends of the vias with solder. 1. A multilayer composite electronic structure comprising at least one pair of feature layers extending in an X-Y plane , each adjacent pair of feature layer being separated by an inner via layer , the via layer comprising via posts that couple adjacent feature layers in a Z direction perpendicular to the X-Y plane , the via posts being embedded in an inner layer dielectric , the multilayer composite structure further comprising terminations consisting of an outer layer of via pillars embedded in an outer dielectric material , thinned to expose ends of the outer layer of via pillars.2. The multilayer composite electronic structure of claim 1 , wherein the exposed outer layer of via pillars is interconnectable with flip chip bumps.3. The multilayer composite electronic structure of claim 1 , wherein the thinned outer layer of via pillars with exposed ends embedded in an outer dielectric material is substantially planar.4. The multilayer composite electronic structure of claim 3 , wherein the thinned outer layer of via pillars with exposed ends embedded in an outer dielectric material has a roughness of less than 3 microns.5. The multilayer composite electronic structure of claim 2 , wherein the via pillars are connected to the flip chip bumps by a solderable metal through reflow.6. The multilayer composite electronic structure of claim 2 , wherein the via pillars are connected to the flip chip bumps by a Z-conductive anisotropic adhesive material.7. The multilayer composite electronic structure of ...

Zero-misalignment via-pad structures

A photoresist is deposited on a seed layer on a substrate. A first region of the photoresist is removed to expose a first portion of the seed layer to form a via-pad structure. A first conductive layer is deposited onto the first portion of the seed layer. A second region of the photoresist adjacent to the first region is removed to expose a second portion of the seed layer to form a line. A second conductive layer is deposited onto the first conductive layer and the second portion of the seed layer.

METHOD AND APPARATUS FOR AUTOMATICALLY ADJUSTING DISPENSING UNITS OF A DISPENSER

A dispensing apparatus includes a frame having a gantry configured to provide movement in the X axis and Y axis directions, and first and second dispensing units coupled to the gantry and configured to dispense material onto a substrate. The second dispensing unit is coupled to the gantry by an automatic adjustment mechanism. The dispensing apparatus further includes a controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism. The automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing. Methods of dispensing material on the substrate are further disclosed. 1. A dispensing apparatus comprising:a frame including a gantry configured to provide movement in X axis and Y axis directions, the gantry including a first side rail, a second side rail and a beam that extends between the first side rail and the second side rail, the beam being configured to move in the Y axis direction along the first and second side rails to achieve Y axis movement, the gantry further including a carriage mounted on the beam, the carriage being configured to move along the length of the beam in the X axis direction;a support coupled to the frame, the support being configured to support at least one electronic substrate under the gantry;a first dispenser coupled to the carriage, the first dispenser being configured to dispense material;a second dispenser coupled to the carriage by an automatic adjustment mechanism, the second dispenser being configured to dispense material;an imager coupled to one of the frame and the gantry, the imager being configured to capture at least one image of a first pattern and a second pattern of an electronic substrate, the second pattern being substantially identical to the first pattern; anda controller configured to control the operation of ...

MICROREACTOR-ASSISTED PRINTING OF CONDUCTIVE TRACES WITH IN-SITU REACTIVE INKS

Highly conductive silver may be fabricated at room temperature using in-situ reactive silver precursor inks by microreactor-assisted printing without any post-processing. Reactive silver nanoinks, synthesized in-situ from the microreactor, may be directly delivered onto glass and polymeric substrates without any surface treatment to form a highly dense and uniform silver feature. The distribution of the reactive silver nanoinks can be controlled by adjusting the flow rate of the continuous flow. Silver lines may be fabricated using the in-situ reactive precursors delivered via a micro-channel applicator. 1. A method of printing a conductive trace on a substrate , the method comprising:transporting a first liquid comprising a first reagent through a first conduit;transporting a second liquid comprising second reagent through a second conduit, wherein one or more of the first and second liquids comprise a metal species;generating a metallic precursor liquid comprising metal nanocrystals by reacting a solution of the first and second liquids as the solution is transported from a union of the first and second conduits through a reaction chamber toward a surface of a substrate; anddepositing the metal nanocrystals onto the surface of the substrate by transporting the metallic precursor liquid through a third conduit defining the surface of the substrate over which the conductive trace is to be disposed.2. The method of claim 1 , wherein:the third conduit comprises a microchannel having a lateral width less than 100 μm defined by a molding plate face mated to the substrate surface; andthe method further comprises separating the molding plate face from the substrate surface after depositing the metal nanocrystals.3. The method of claim 1 , wherein the metal species comprises at least one of Au claim 1 , Cu claim 1 , Co claim 1 , Cr claim 1 , Ni claim 1 , Pt claim 1 , Pd claim 1 , Rh claim 1 , CoNiP claim 1 , CoWP claim 1 , CoReP claim 1 , CoMnP claim 1 , CoNiZnP claim 1 , ...

Method of cutting conductive patterns

A method includes patterning a layer over a substrate with a first metal pattern; using a cut mask in a first position relative to the substrate to perform a first cut patterning for removing material from a first region within the first pattern; and using the same cut mask to perform a second cut patterning while in a second position relative to the same layer over the substrate, for removing material from a second region in a second metal pattern of the same layer over the substrate.

DEVICE, SYSTEM, AND METHOD FOR TRACKING THE CONFIGURATION OR OPERATIONAL HISTORY OF A NOZZLE IN A FLUID JETTING SYSTEM

Apparatus for use with an applicator, systems for dispensing fluids, methods of using a nozzle (), and a nozzle (). The nozzle () includes a communication device () having a memory (). The memory () stores data relating to the operational history and configuration of the nozzle (). In response to receiving a query signal () from an interrogation device (), the communication device () transmits the data residing in the memory (). The communication device () also receives and stores data in the query signal () to the memory () so that the operational history of the nozzle () is maintained in the memory () of the communication device (). The transmitted data may be received by the interrogation device () and used to adjust a fluid dispensing operation, determine when the nozzle () has reached the end of its operational life, for process improvement, or for inventory tracking. 1. (canceled)2. An apparatus , comprising:a nozzle configured to be removably coupled to a body of an applicator and to receive fluid therefrom, the nozzle comprising a valve seat and an outlet, wherein the valve seat is configured to be contacted by a valve member of the applicator when the nozzle is coupled to the body so as to dispense amounts of fluid through the outlet; anda communication device configured to be coupled to the applicator and including a memory, the communication device configured to transmit information that resides in the memory and relates to the applicator to an interrogation device in response to receiving a query signal from the interrogation device.3. The apparatus of claim 2 , wherein the information relates to (i) operational history data of the applicator claim 2 , (ii) configuration data of the applicator claim 2 , or (iii) both the operational history data and the configuration data of the applicator.4. The apparatus of claim 2 , wherein the information comprises at least one of (i) a size of an opening in the valve seat claim 2 , (ii) a cumulative number of ...

SYSTEM OF DISPENSING MATERIAL ON A SUBSTRATE WITH A SOLENOID VALVE OF A PNEUMATICALLY-DRIVEN DISPENSING UNIT

A system for dispensing material on a substrate includes a dispensing unit having a dispensing piston. The dispensing piston is pneumatically driven from a first lower position to a second upper position. The system further includes a solenoid valve coupled to the dispensing unit, with the solenoid valve being configured to control air flow to and from the dispensing piston. The solenoid valve includes a solenoid coil and an amplifier connected to the solenoid coil. The system further includes a controller coupled to the amplifier, with the controller being configured to generate a command signal to the amplifier to control current in the solenoid coil. 1. A system for dispensing material on a substrate , the system comprising:a dispensing unit including a dispensing piston, the dispensing piston being pneumatically driven from a first lower position to a second upper position;a solenoid valve coupled to the dispensing unit, the solenoid valve being configured to control air flow to and from the dispensing piston, the solenoid valve including a solenoid coil;an amplifier connected to the solenoid coil; anda controller coupled to the amplifier, the controller being configured to generate a command signal to the amplifier to control current in the solenoid coil.2. The system of claim 1 , wherein the amplifier is a transconductance pulse-width modulated amplifier.3. The system of claim 2 , wherein the amplifier is connected to the solenoid coil through passive electrical filter components.4. The system of claim 1 , wherein the solenoid coil of the solenoid valve is connected as a load for the amplifier.5. The system of claim 4 , wherein the solenoid coil of the solenoid valve is connected either directly to the amplifier or through intermediate filter components.6. The system of claim 1 , wherein the solenoid coil of the solenoid valve is maintained in an on state with a reduced holding current to minimize a time required for the solenoid field to collapse when the ...

Method For Estimating The Simulated Contour Of A Material Composed Of Longitudinal And Transverse Line Elements

A method of estimating a virtual contour of an insulating material is disclosed. The method includes the following steps: obtaining a first and a second images at a pair of diagonal locations of the insulating material respectively; determining a first and a second corner locations from the first and the second images respectively; selecting a first set of longitudinal end-point positions and a first set of transverse end-point positions within a range between a first specific distance and a second specific distance from the first corner location; selecting a second set of longitudinal end-point positions and a second set of transverse end-point positions within a range between the first specific distance and the second specific distance from the second corner location; and determining a first transverse axis direction, a first longitudinal axis direction, a second transverse axis direction and a second longitudinal axis direction based on these positions. 1. A method of estimating a virtual contour of an insulating material for manufacturing a multilayer circuit board , wherein the insulating material has a rectangular shape and a pair of diagonal locations , and is a prepreg material composed of a plurality of crossed glass fibers , the method comprising the following steps:obtaining a first and a second images at the pair of diagonal locations of the insulating material respectively;determining a first corner location and a second corner location from the first and the second images respectively;selecting a first set of longitudinal end-point positions and a first set of transverse end-point positions within a range between a first specific distance and a second specific distance from the first corner location;selecting a second set of longitudinal end-point positions and a second set of transverse end-point positions within a range between the first specific distance and the second specific distance from the second corner location;determining a first transverse ...

Piezoelectric jetting system and method with amplification mechanism

A jetting dispenser includes an actuator with a piezoelectric unit that lengthens by a first distance in response to an applied voltage, and an amplifier operatively coupled to the piezoelectric unit. The amplifier includes first and second ends and the second end moves through a second distance, larger than the first distance under the applied voltage. First and second springs are positioned on opposite sides of the piezoelectric unit. The springs are coupled to the piezoelectric unit in a manner that maintains the piezoelectric unit under constant compression. A fluid body includes a movable shaft operatively coupled with the second end of the amplifier and includes a fluid bore and an outlet orifice. The movable shaft is moved by the second end of the amplifier under the applied voltage and jets an amount of fluid from the fluid bore through the outlet orifice.

MICROETCHING SOLUTION FOR COPPER, REPLENISHMENT SOLUTION THEREFOR AND METHOD FOR PRODUCTION OF WIRING BOARD

Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount. 112-. (canceled)13. A replenishment solution for copper microetching solution , whereinthe replenishment solution is an aqueous solution containing: an organic acid; a halide ion; an amino group-containing compound having a molecular weight of 17 to 400; and a polymer, andthe polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more, andwhere a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, and a value of A/B is 50 or more and 6000 or less.14. The replenishment solution according to claim 13 , wherein where a concentration of the halide ion is C % by weight and the concentration of the polymer is B % by weight claim 13 , and a value of CB is 1500 or more to 15000 or less.15. The replenishment solution according to claim 13 , wherein a concentration of the polymer is 0.0001 to 0.02% by weight.16. The replenishment solution according to claim 13 , wherein a concentration of the halide ion is 0.1 to 20% by weight.17. The replenishment solution according to ...

PRINTED CIRCUIT BOARD STRUCTURE

A circuit board design device judging whether a circuit board has a pair of via holes which are adjacent within a solder bridge formation distance within which a solder bridge can be formed; when the affirmative, the circuit board design device judging whether each of the pair of via holes is electrically connected in parallel to other via hole with a land not coated with solder resist; when the circuit board design device judges that at least one of the pair of via holes is electrically connected in parallel to the other via hole with a land not coated with solder resist, the circuit board design device determining the at least one of the pair of via holes which is electrically connected in parallel to the other via hole with a land not coated with solder resist as a coated via hole with a land coated with solder resist. 1. A method for designing a circuit board comprising ,judging, by a circuit board design device, whether or not the circuit board has a pair of via holes which are adjacent within a solder bridge formation distance within which a solder bridge can be formed;when the circuit board design device judges that the circuit board has the pair of via holes, the circuit board design device judging whether or not that each of the pair of via holes is electrically connected in parallel to other via hole with a land not coated with solder resist;when the circuit board design device judges that at least one of the pair of via holes is electrically connected in parallel to the other via hole with a land not coated with solder resist, the circuit board design device determining the at least one of the pair of via holes which is electrically connected in parallel to the other via hole with a land not coated with solder resist as a coated via hole with a land coated with solder resist.2. The method for designing a circuit board according to claim 1 , when the circuit board design device judges that none of the pair of via holes is electrically connected in parallel ...

WORKPIECE TRANSFER AND PRINTING

A printing apparatus for printing workpieces comprises a rotary table supporting first and second platens rotatable between a loading position located in-line between input and output lines. The transfer apparatus is operable to cyclically perform first and second movement operations, in which the rotary table rotates to move the first platen from a loading position to a printing position and vice versa. The platens may be rotatable relative to each other. 1. A transfer apparatus for conveying workpieces between a production line and a printing unit , comprising:a rotary table supporting first and second platens at spatially separated locations thereon, each platen being rotatable with respect to the rotary table and also rotatable relative to the other platen about respective first and second platen rotation axes and configured to support a respective workpiece thereon in use;the rotary table being rotatable about a table rotation axis, parallel to the first and second platen rotation axes, so that each platen can be moved between a loading position proximate the production line in use and a printing position proximate a printing unit in use, through rotation of said table; anda table drive device for rotating the rotary table about the table rotation axis;wherein the transfer apparatus is operable to cyclically perform first and second movement operations, such that in the first movement operation the rotary table rotates to move the first platen from the loading position to the printing position while the second platen moves from the printing position to the loading position, and in the second movement operation the rotary table rotates to move the first platen from the printing position to the loading position while the second platen moves from the loading position to the printing position.2. The transfer apparatus according to claim 1 , wherein in each of the first and second movement operations claim 1 , one of said first and second platens rotates relative to ...

SOLDER MASK INKJET INKS FOR MANUFACTURING PRINTED CIRCUIT BOARDS

A radiation curable solder mask inkjet ink contains a photo-initiator, a polymerizable compound and a flame retardant wherewith a high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties and flame retardancy may be produced. 115-. (canceled)17. The radiation curable inkjet ink according to claim 16 , wherein at least two of the groups Rto Rrepresent a substituted or unsubstituted aryl group.18. The radiation curable inkjet ink according to claim 16 , wherein Rto Reach represent a substituted or unsubstituted aryl group.20. The radiation curable inkjet ink according to claim 19 , wherein the flame retardant is a diphosphate ester of a difunctional phenol compound selected from the group consisting of bisphenol A claim 19 , bisphenol AP claim 19 , bisphenol B claim 19 , bisphenol BP claim 19 , bisphenol C claim 19 , bisphenol E claim 19 , bisphenol F claim 19 , bisphenol G claim 19 , bisphenol M claim 19 , bisphenol S claim 19 , bisphenol P claim 19 , bisphenol PH claim 19 , bisphenol TMC claim 19 , bisphenol Z claim 19 , and resorcinol.21. The radiation curable inkjet ink according to claim 16 , wherein the radiation curable inkjet ink is a free radical polymerizable inkjet ink or a cationic polymerizable inkjet ink.22. The radiation curable inkjet ink according to claim 16 , wherein the radiation curable inkjet ink is a cationic polymerizable inkjet ink including a cationic polymerizable compound that includes at least one epoxy claim 16 , at least one vinyl ether claim 16 , or at least one oxetane group.23. The radiation curable inkjet ink according to claim 22 , wherein the cationic polymerizable compound is selected from the group consisting of 7-oxabicyclo[4.1.0]hept-3-ylmethyl 7-oxabicyclo[4.1.0]heptane-3-carboxylate claim 22 , bis[1-Ethyl(3-oxetanyl)]methylether claim 22 , Poly[(2-oxiranyl)-1 claim 22 ,2-cyclohexanediol]-2-ethyl-2-(hydroxymethyl)-1 claim 22 ,3-propanediol ether ...

METHOD AND APPARATUS FOR EXPOSURE OF FLEXOGRAPHIC PRINTING PLATES USING LIGHT EMITTING DIODE (LED) RADIATION SOURCES

A method and apparatus to expose photosensitive printing plates with a predetermined radiation density from the main side (top) and a predetermined radiation density from the back side (bottom). The method comprises executing the main exposure with a time delay after the back exposure. The time delay between back exposure and main exposure is optimized to create smaller stable single dot elements on the photosensitive printing plate after processing and smaller single element dot sizes printed on the print substrate. The plate floor may be adjusted by performing a back-side-only exposure prior to executing the combined back and main exposure with the time delay. 1. An apparatus for preparing a printing plate comprising a photosensitive polymer activated by exposure to actinic radiation , the printing plate having a non-printing back side and a printing front side with a mask for defining an image to be printed , the printing plate having a lateral width and a lateral length and disposed in a stationary position , the apparatus comprising: a set of front LED sources positioned to emit radiation toward the front side of the plate, the plurality of stationary front LED sources together defining a collective irradiation field covering an area at least coextensive with the lateral length and lateral width of the plate;', 'a set of back LED sources positioned to emit radiation toward the back side of the plate, the plurality of stationary back LED sources together defining a collective irradiation field covering an area at least coextensive with the lateral length and lateral width of the plate; and, 'a plurality of radiation sources configured to emit the actinic radiation toward the printing plate in the stationary position, each of the radiation sources comprises a light emitting diode (LED) configured to emit actinic ultraviolet (UV) radiation, the plurality of radiation sources includinga controller connected to the plurality of radiation sources and configured to ...

VERTICAL CIRCUIT BOARD PRINTER

A vertical circuit board printer includes a multi-layer conveyor, a printer assembly, and a control system. The multi-layer conveyor includes a number of front conveyors and one rear conveyor. Each upper front conveyor is coupled to a lower front conveyor by a circuit board-lowering mechanism to transport a number of circuit boards in sequence from the number of front conveyors to the rear conveyor. The printer assembly includes a number of printers arranged in sequence above the number of front conveyors. The control system controls operation of the multi-layer conveyor and controls operation of the printing assembly through a software system. 1. A vertical circuit board printer comprising:a multi-layer conveyor comprising a plurality of front conveyors and one rear conveyor, each upper front conveyor is coupled to a lower front conveyor by a circuit board-lowering mechanism to transport a plurality of circuit boards in sequence from the plurality of front conveyors to the rear conveyor;a printer assembly comprising a plurality of printers arranged in sequence above the plurality of front conveyors; anda control system controlling operation of the multi-layer conveyor and controlling operation of the printing assembly through a software system.2. The vertical circuit board printer of claim 1 , wherein a plurality of trays are equally spaced apart on the plurality of front conveyors; the trays are controlled by the control system to move cyclically on the front conveyor and carry the circuit board claim 1 , hold or release the circuit board claim 1 , and position the tray opposite to the corresponding printer of the printing assembly.3. The vertical circuit board printer of claim 1 , wherein the plurality of front conveyors are in a stacked arrangement and supported by load-bearing brackets; a bottom side of the front conveyors is coupled to the rear conveyor; a quantity of the rear conveyors and width of the front conveyors and rear conveyor are adjustable ...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

An electronic device includes: a substrate; a Cu-containing wiring layer formed over the substrate; a barrier metal layer that covers a surface of the Cu-containing wiring layer and suppresses diffusion of Cu; and a coating insulating layer that covers the barrier metal layer, wherein the barrier metal layer has a void that does not reach the Cu-containing wiring layer, and the void is filled with the coating insulating layer. 1. An electronic device comprising:a substrate;a Cu-containing wiring layer formed over the substrate;a barrier metal layer that covers a surface of the Cu-containing wiring layer and suppresses diffusion of Cu; anda coating insulating layer that covers the barrier metal layer,wherein the barrier metal layer has a void that does not reach the Cu-containing wiring layer, and the void is filled with the coating insulating layer.2. The electronic device according to claim 1 ,wherein an organic-substance coating film is provided on at least part of an interface between the Cu-containing wiring layer and the barrier metal layer, andthe void is formed at an interface between grown particles in the barrier metal layer.3. The electronic device according to claim 2 ,wherein the organic-substance coating film is a coating film formed of any one of a glycol ether and a water-soluble resin.4. The electronic device according to claim 3 ,wherein the glycol ether is any one of ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol isopropyl ether, ethylene glycol dimethyl ether, ethylene glycol t-butyl ether, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol propyl ether, dipropylene glycol monomethyl ether, and tripropylene glycol monomethyl ether.5. The electronic device according to claim 3 ,wherein the water-soluble resin is any one of polyvinylpyrrolidone, polyvinylphenol, polyvinyl ...

SUBSTRATE WITH GLASS SHEET, RESIN LAYER AND THROUGH-GLASS VIA

A method for producing a glass substrate according to the present invention includes the steps of: (I) forming a through hole () in a glass sheet (); (II) forming a resin layer () on a first principal surface of the glass sheet () using a resin composition sensitive to light having a predetermined wavelength λ; (III) photoexposing an area of the resin layer () that covers the through hole () by irradiating the area with light U having the wavelength λand applied from the direction of a second principal surface of the glass sheet (); and (IV) forming a through-resin hole () by removing the area photoexposed in the step (III). The glass sheet () protects the resin layer () from the light U so as to prevent the resin layer () from being photoexposed by beams of the light U that are incident on the second principal surface of the glass sheet () in the step (III). 19-. (canceled)10. A substrate comprising ,{'sub': '1', 'a glass sheet that has a light transmittance of 1% or less at a wavelength λwithin a wavelength range of 120 nm to 300 nm, the glass sheet having a first through hole;'}{'sub': '1', 'a resin layer that is formed on a first principal surface of the glass sheet and is sensitive to light having the wavelength λ, the resin layer having a second through hole that is aligned with the first through hole; and'}a through-glass via that is formed inside the first through hole and the second through hole.11. The substrate according to claim 10 , wherein the glass sheet has a light absorption coefficient of 50 cm′ or less at a wavelength λwithin a wavelength range of 250 nm to 535 nm.12. The substrate according to claim 10 , wherein the through-glass via has a bare portion adjacent to a surface of the resin layer.13. The substrate according to claim 10 , wherein the resin layer is formed of a resin composition of a positive photoresist.14. The substrate according to claim 10 , wherein the through-glass via contains copper.15. The substrate according to claim 10 , ...

MANUFACTURING LINE FOR SOLDERING

The disclosure relates to a manufacturing line for soldered components on a circuit board, comprising a soldering oven including at least two temperature zones having a predetermined temperature profile, a transport apparatus embodied to transport circuit boards through the temperature zones, and a control system, wherein, in at least one of the temperature zones, at least two heating elements are arranged such that a to-be-soldered surface of each circuit board is heated by the heating elements, wherein, in at least one of the temperature zones, at least two air circulators are arranged in the transport direction offset from one another and facing the surface to be soldered, and wherein the control system is configured to control the heating elements and the air circulators such that the to-be-soldered surface of the circuit board is heated according to the predetermined temperature profile. 115-. (canceled)16. A manufacturing line for soldering components on a circuit board , the manufacturing line comprising:a soldering oven including at least two temperature zones having a predetermined temperature profile along a transport direction through the soldering oven, wherein at least one of the at least two temperature zones includes at least two air circulators offset from one another in the transport direction;a transport apparatus embodied to transport circuit boards through the at least two temperature zones of the soldering oven in the transport direction; and in at least one of the at least two temperature zones, at least two heating elements are disposed such that a to-be-soldered surface of each circuit board transported through the soldering oven is heated by the at least two heating elements;', 'the at least two heating elements are offset from one another in the transport direction and are directed toward the to-be-soldered surface;', 'the at least two air circulators are directed toward the to-be-soldered surface; and', 'the control system is configured to ...

Methods of selectively filling apertures

A novel method of filling apertures in substrates, such as through holes, is provided. The method utilizes a photoimageable film, and comprises the following steps: applying a photoimagable, hole fill film over the apertures; reflowing the hole fill film to flow into the apertures; exposing the hole fill film to actinic radiation, preferably ultraviolet light, through a phototool, which preferably has openings slightly larger than the diameter of the apertures; then at least partially curing the hole fill film; and developing the hole fill film to remove the unexposed hole fill film. An advantage of the present method is that the apertures may be selectively filled. After the apertures are filled, the hole fill film is cured, preferably by baking. Thereafter, the substrate is preferably subjected to further processing steps; for example, nubs of cured hole fill film are preferably removed. If desired, the substrate is circuitized. If desired, features are gold plated, such as for example, electrolessly gold plated. The hole fill film preferably has solids which comprise 0 to about 20% of a thixotrope and about 80% to about 100% parts of an epoxy resin system; the epoxy resin system comprises: from about 10% to about 80% of phenoxy polyol resin which is the condensation product of epichlorohydrin and bisphenol A, having a molecular weight of from about 40,000 to about 130,000; from about 20% to about 90% of an epoxidized multifunctional bisphenol A formaldehyde novolac resin having a molecular weight of from about 4,000 to about 10,000; from about 35% to about 50% of a diglycidyl ether of bisphenol A, preferably halogenated, and having a molecular weight of from about 600 to about 2,500; and from about 0.1 to about 15 parts by weight of the total resin weight, a cationic photoinitiator. The invention also relates to circuitized structures produced according to the method.

SCANNING DEVICE AND METHOD

Method for forming images

Images are formed by the following process: (i) a substrate is treated with a layer of a liquid composition comprising (A) a residue that is polymerizable by means of free radicals, such as an acrylic ester, (B) a radiation-activated polymerization initiator for (A), such as a metallocene or a mixture of a Group IVA organometallic compound with a photoreducible dye. (C) a radiation-curable residue that is different from (A), such as an epoxide resin, and optionally (D) a radiation-activated catalyst for the cure of (C), such as an aromatic onium salt, (ii) the composition is subjected to actinic radiation having a wavelength at which the initiator (B) is activated but at which the residue (C) and/or the catalyst (D) are not substantially activated, thereby polymerizing (A) such that the layer of liquid composition is solidified, but remains curable, (iii) the solidified layer is subjected in a predetermined pattern to actinic radiation having a wavelength that is shorter than that of the radiation used in stage (ii) and at which the radiation-curable residue (C) and/or the catalyst (D) is activated, such that in the exposed areas (C) is substantially cured, and (iv) removing areas of the solidified layer that have not been substantially cured.

Process for the production of multilayers and device for carrying out this process

Laser-induced thermal transfer recording process

Improved processes for laser thermal imaging and imaged laserable assemblages obtained using the improved processes of this invention are described. These improved processes operate effectively at high speeds and also afford high image densities and good durability of images present on receiver elements upon thermal imaging done in accordance with these improved processes.

Vorrichtung und Verfahren zur Oberflächenbehandlung von Substraten

Vorrichtung zur Oberflächenbehandlung von Silizium-Wafern, mit Transportwalzen zum Transport der Silizium-Wafer in einer von den Transportwalzen bestimmten Transportebene und mit zumindest einer Fördereinrichtung, die für eine Benetzung des Silizium-Wafers mit einem flüssigen Prozessmedium ausgebildet ist, wobei die Fördereinrichtung derart unterhalb der Transportebene angeordnet ist, dass sie die Transportebene berührt oder zumindest nahezu an die Transportebene heranreicht zur Benetzung der nach unten gerichteten Substratoberfläche mit Prozessmedium in direktem mechanischen Kontakt zwischen Fördereinrichtung und Substratoberfläche.

Microetching solution for copper, replenishment solution therefor and method for production of wiring board

Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

Microetching solution for copper, replenishment solution therefor and method for production of wiring board

Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.