07-02-2019 дата публикации
Номер: US20190045620A1
Принадлежит:
A sensor device for integration in an electrical circuit includes a support layer (′), which is formed with a release layer; at least one flexible insulating layer (), which is made using a printing method; and at least one flexible electrical conductor structure (), which is applied with a printing method onto the insulating layer (). The insulating layer () and the conductor structure () form a flexible unit, which is removable without damage from the support layer (′). 1. A sensor device arrangement for integration into an electrical circuit , comprising:{'b': 14', '14', '32, 'at least one flexible insulating layer (, ′, );'}{'b': 20', '20', '34', '14', '14', '32, 'at least one flexible electrical conductor structure (, ′, ), which is applied with a printing method onto the insulating layer (, ′, ),'}{'b': 22', '20', '20', '34, 'an adhesive layer () arranged above the electrical conductor structure (, ′, ), and'}{'b': 40', '14', '14', '32', '20', '20', '34', '22', '40', '40, 'a substrate () having an absorbent material, wherein the insulating layer (, ′, ) and the at least one flexible conductor structure (, ′, ) form a flexible unit, and wherein the adhesive layer () is adhered to the substrate () for attachment of the flexible unit to the substrate ().'}2141432. The sensor device arrangement according to claim 1 , wherein the insulating layer ( claim 1 , ′ claim 1 , ) is made from a lacquer.3. The sensor device arrangement according to claim 2 , wherein the lacquer is a modified lacquer.4. The sensor device arrangement according to claim 1 , wherein the insulating layer is formed at least in regions as multi-layered.5202032. The sensor device arrangement according to claim 1 , wherein the conductor structure ( claim 1 , ′ claim 1 , ) is formed from a conductive printing material claim 1 , wherein said conductive printing material is selected from the group consisting of copper claim 1 , silver claim 1 , a carbon bond claim 1 , a conductive polymer structure ...
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