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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 2666. Отображено 100.
28-03-2013 дата публикации

Valve controlled, node-level vapor condensation for two-phase heat sink(s)

Номер: US20130077247A1
Автор: Levi A. Campbell, Madhusudan K. Iyengar, Michael J. Ellsworth, Jr., Milnes P. DAVID, Richard C. Chu, Robert E. Simons
Принадлежит: International Business Machines Corp

A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The coolant provides two-phase cooling to the electronic component, and is discharged from the heat sink as coolant exhaust which comprises coolant vapor to be condensed. The cooling apparatus further includes a node-level condensation module, associated with the electronic subsystem, and coupled in fluid communication with the heat sink to receive the coolant exhaust from the heat sink. The condensation module is liquid-cooled, and facilitates condensing of the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module.

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Номер записи: 1
17-10-2013 дата публикации

Cold plate with reduced bubble effects

Номер: US20130271918A1
Автор: John Philip Neville Hughes, Robert J. Lipp
Принадлежит: CLUSTERED SYSTEMS COMPANY Inc

An electronic system cooling apparatus including a cold plate coupled vertically within an enclosure, the cold plate including a plurality of fluidly isolated, thermally coupled, adjacently nested boustrophedonic channels that terminate in a common upper end and a common lower end. Each turn of each channel includes a top arm and a bottom arm fluidly coupled by a side segment, wherein the top arm is stacked above the bottom arm along the height of the cold plate. An outlet manifold is fluidly coupled to the common upper end of the plurality of channels and an inlet manifold is fluidly coupled to the common lower end the plurality of channels, wherein the inlet manifold is disposed below the outlet manifold to facilitate an upward coolant flow path.

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Номер записи: 2
26-12-2013 дата публикации

TWO-PHASE COOLING SYSTEM FOR ELECTRONIC COMPONENTS

Номер: US20130340978A1
Автор: Agostini Francesco, Fabbri Matteo, GRADINGER Thomas
Принадлежит:

A two-phase heat exchanger for cooling at least one electronic and/or electric component includes an evaporator and a condenser. The evaporator transfers heat from the electronic and/or electric component to a working fluid. The condenser includes a roll-bonded panel, which has a first channel which has a first connection port and a second connection port. The evaporator has a second channel and first connection openings and second connection openings. The first connection port of the first channel is connected to one first connection opening of the evaporator and the second connection port of the first channel is connected to one second connection opening of the evaporator and the working fluid is provided to convey heat by convection from the evaporator to the condenser by flowing from the second channel through the first connection opening or the second connection opening of the evaporator towards the first channel. 1. A two-phase heat exchanger for cooling at least one of an electronic and an electric component , the heat exchanger comprising:a condenser body including a plurality of roll-bonded panels having a first channel arranged between a first and a second sheet such that a first connection port delimits the first channel at one end and a second connection port delimits the first channel at another end, wherein the first sheet is connected to the second sheet by roll-bonding to form the roll-bonded panel; andan evaporator body including a second channel, wherein the second channel is delimited at one end by a third connection opening for each roll-bonded panel and at another end by a fourth connection opening for each roll-bonded panel, wherein the evaporator body includes a thermal connection surface to which at least one of an electronic and an electric component is thermally connectable,wherein the first connection port is connected to the third connection opening and wherein the second connection port is connected to the fourth connection opening such ...

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Номер записи: 3
13-02-2014 дата публикации

HEAT DISSIPATION DEVICE WITH PARALLEL AND PERPENDICULAR FINS

Номер: US20140041837A1
Автор: TANG XIAN-XIU
Принадлежит:

A heat dissipation device includes a heat pipe, a first fin unit, a second fin unit, and a fan arranged on the first fin unit for drawing air from the first fin unit to the second fin unit. The heat pipe includes an evaporation section, a first condensing section and a second condensing section. The first fin unit includes a plurality of stacked first fins with a first channel defined between adjacent first fins. A notch is defined in the first fin unit receiving the evaporation section, and a canal is defined in the first fin unit receiving the first condensing section of the heat pipe. The second fin unit includes a plurality of stacked second fins. A second channel is defined between adjacent second fins perpendicular to the first channels. A passage is defined in the second fin unit receiving the second condensing section of the heat pipe. 1. A heat dissipation device , comprising:a heat pipe comprising an evaporation section, a first condensing section and a second condensing section;a first fin unit comprising a plurality of stacked first fins, a first channel defined between adjacent first fins, a notch defined in the first fin unit receiving the evaporation section, and a canal defined in the first fin unit receiving the first condensing section of the heat pipe;a second fin unit comprising a plurality of stacked second fins, a passage defined in the second fin unit receiving the second condensing section of the heat pipe, and a second channel defined between adjacent second fins of the second fin unit, the second channels being perpendicular to the first channels; anda fan arranged on the first fin unit for drawing air from the first fin unit to the second fin unit, the fan comprising a base wall, a top wall, an annular wall between the base wall and the top wall, and an impeller, the base wall, the top wall and the annular wall cooperatively defining a space for receiving the impeller therein, the impeller comprising a hub, a plurality of blades ...

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Номер записи: 4
13-03-2014 дата публикации

CHIP STACK STRUCTURES THAT IMPLEMENT TWO-PHASE COOLING WITH RADIAL FLOW

Номер: US20140071628A1
Автор: Brunschwiler Thomas J., Colgan Evan G., Knickerbocker John U., Michael Bruno, Ong Chin Lee, Tsang Cornelia K.
Принадлежит:

A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold. 1. A package structure , comprising:a chip stack disposed on a substrate; anda package lid which covers and encloses the chip stack; a plurality of conjoined chips;', 'a central inlet manifold formed through a central region of the chip stack, the central inlet manifold comprising a plurality of inlet nozzles to feed liquid coolant from the central input manifold into flow cavities formed between adjacent conjoined chips in the chip stack; and', 'a peripheral outlet manifold formed by the flow cavities around a periphery of the chip stack to output heated liquid and vapor which exits from the flow cavities; and, 'wherein the chip stack comprises a central inlet that is aligned to the central inlet manifold of the chip stack to supply liquid coolant to the central inlet manifold; and', 'a peripheral liquid-vapor outlet which is aligned to an interior region of the package lid that collects the heated liquid and vapor output from the peripheral outlet manifold of the chip stack., 'wherein the package lid ...

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Номер записи: 5
13-01-2022 дата публикации

SYSTEM FOR PARALLEL COOLING OF COMPONENTS ON A CIRCUIT BOARD

Номер: US20220015222A1
Автор: He Qinghong, HO MAN TAK, Schnell Arnold Thomas
Принадлежит:

A cooling system for cooling a set of components on a circuit board includes a vapor chamber for distributing heat over a larger surface area, a fan in a housing configured to direct a first airflow in a first direction to a first heatsink and direct a second airflow in a second direction opposite the first direction to a second heatsink. The heatsinks can have different sizes and the fan can be located relative to a midpoint of the vapor chamber or the circuit board or positioned relative to a component on the circuit board. 1. A cooling system for cooling a set of components on a circuit board , the cooling system comprising:a vapor chamber comprising a first side coupled to the circuit board;a first heatsink and a second heatsink coupled to a second side of the vapor chamber;a fan positioned on the second side of the vapor chamber between the first heatsink and the second heatsink; anda housing configured to direct a first airflow in a first direction to the first heatsink and direct a second airflow in a second direction opposite the first direction to the second heatsink.2. The cooling system of claim 1 , wherein the first heatsink and the second heatsink are approximately the same size.3. The cooling system of claim 2 , wherein the fan is positioned near the middle of the vapor chamber.4. The cooling system of claim 3 , wherein the fan is positioned near the middle of the circuit board.5. The cooling system of claim 1 , wherein:the circuit board comprises a plurality of components;one component in the set of components generates most of the heat associated with the circuit board; andthe fan is positioned relative to a position of the component generating most of the heat.6. The cooling system of claim 5 , wherein the first heatsink is larger than the second heatsink.7. The cooling system of claim 6 , wherein the vapor chamber comprises a length approximately equal to a usable length of the circuit board and a width approximately equal to a usable width of the ...

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Номер записи: 6
13-01-2022 дата публикации

VAPOR CHAMBER

Номер: US20220015265A1
Автор: CHANG Tien-Yao, Chen Chih-Wei, CHUANG Hsiang-Chih, KUO Che-Wei
Принадлежит:

A vapor chamber is provided, which includes: a substrate; a diversion layer disposed on the substrate and having first openings and second openings; and at least one liquid passage formed between the substrate and the diversion layer, where the vapor chamber is defined with an evaporation area corresponding to a heat source and at least one condensation area, and the size of the first openings corresponding to the evaporation area and the condensation area is different from the size of the second openings corresponding to a non-evaporation area and a non-condensation area. 1. A vapor chamber defined with an evaporation area corresponding to a heat source and at least one condensation area , the vapor chamber comprising:a first substrate;a diversion layer disposed on the first substrate and having a plurality of first openings and a plurality of second openings, wherein locations of the plurality of first openings correspond to the evaporation area and the condensation area, locations of the plurality of second openings do not correspond to the evaporation area and the condensation area, and a size of each of the plurality of first openings is different from a size of each of the plurality of second openings;a plurality of liquid passages formed between the first substrate and the diversion layer; anda second substrate disposed above the diversion layer to form air flow channels between the diversion layer and the second substrate.2. The vapor chamber of claim 1 , wherein a density of the plurality of first openings is greater than a density of the plurality of second openings.3. The vapor chamber of claim 2 , wherein a ratio of an aperture of each of the plurality of first openings to an interval between the plurality of first openings is 1:1.4. The vapor chamber of claim 2 , wherein a ratio of an aperture of each of the plurality of second openings to an interval between the plurality of second openings ranges from 1:2 to 1:4.5. The vapor chamber of claim 1 , ...

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Номер записи: 7
04-01-2018 дата публикации

Switchgear Cooling System Comprising A Heat Pipe, Fan And Thermoelectric Generation

Номер: US20180006436A1
Автор: Buehler Tilo, Kaufmann Patrik, Molitor Francoise, Sologubenko Oleksandr
Принадлежит:

A cooling system includes an evaporator associated with a heat source. A condenser is located at a higher elevation than the evaporator. A heat pipe structure fluidly connects the evaporator with the condenser. A fan forces air through the condenser. A working fluid is in the evaporator so as to be heated to a vapor state, with the heat pipe structure transferring the vapor to the condenser and passively returning condensed working fluid back to the evaporator for cooling of the heat source. A plurality of thermoelectric generators is associated with the condenser and converts heat, obtained from the working fluid in the vapor state, to electrical energy to power the fan absent an external power source. The thermoelectric generators provide the electrical energy to the fan so that a rotational speed of the fan is automatically self-regulating to either increase or decrease based on a varying heat load. 1. A cooling system comprising:an evaporator constructed and arranged to be associated with a heat source so as to remove heat therefrom,a condenser located at a higher elevation than the evaporator,a heat pipe structure fluidly connecting the evaporator with the condenser,at least one fan constructed and arranged to force air through the condenser,working fluid in the evaporator so as to be heated to a vapor state by the heat source, with the heat pipe structure being constructed and arranged to transfer the vapor to the condenser and to passively return condensed working fluid back to the evaporator for cooling of the heat source, anda plurality of thermoelectric generators associated with the condenser and constructed and arranged to convert heat, obtained from the working fluid in the vapor state, to electrical energy to power the fan absent an external power source,wherein the thermoelectric generators are constructed and arranged to provide the electrical energy to the fan so that a rotational speed of the fan is automatically self-regulating to either increase ...

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Номер записи: 8
27-01-2022 дата публикации

SYSTEM AND METHOD FOR SERVICE LIFE MANAGEMENT BASED ON CONDENSATION REMOVAL

Номер: US20220026968A1
Автор: Embleton Steven, Farkas Sandor T., Fitch Jon Taylor, King Joseph Danny
Принадлежит:

A method for environmentally managing a computing device of an information handling system includes monitoring an environmental corrosion risk associated with a component of the computing device, a corrosion management component that reduces a rate of corrosion of the component due to an ambient environment in which the component resides by removing condensation from the component is associated with the component; making a determination that the component is associated with the corrosion management component; in response to the determination: estimating a corrosion risk of the component based on: the environmental corrosion risk, and a risk reduction factor associated with the corrosion management component; making a second determination that the corrosion risk of the component indicates a premature failure of the component; and remediating, in response to the second determination, the corrosion risk of the component. 1. A computing device of an information handling system , comprising:a component that is sensitive to corrosion; anda corrosion management component, directly disposed on a surface of the component, adapted to evaporate condensation associated with the component.2. The computing device of claim 1 , wherein the corrosion management component comprises:a portion that transfers condensation from the surface of the component to an evaporative surface of the corrosion management component that evaporates the condensation.3. The computing device of claim 2 , wherein the portion comprises a plurality of capillaries through a support material.4. The computing device of claim 3 , wherein the capillaries are adapted to transfer the condensation through capillary action.5. The computing device of claim 1 , wherein the corrosion management component comprises an open cell foam.6. The computing device of claim 5 , wherein the open cell foam is a metal foam.7. The computing device of claim 5 , wherein a structure of the open cell foam is adapted to absorb condensed ...

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Номер записи: 9
10-01-2019 дата публикации

Cooling System In A Hybrid Electric Propulsion Gas Turbine Engine For Cooling Electrical Components Therein

Номер: US20190010866A1
Автор: Andrew M. Bollman, Douglas J. Snyder
Принадлежит: Rolls Royce North American Technologies Inc

A cooling system is provided in a hybrid electric propulsion gas turbine engine for cooling electrical components therein. The cooling system includes an electrical component disposed in proximity to a power generation component in the hybrid electric propulsion gas turbine engine. The cooling system further includes a vapor chamber having an evaporator portion and a condenser portion, wherein the evaporator portion is disposed adjacent to and in thermal communication with the electrical component to transfer heat away from the electrical component. The vapor chamber includes biphasic working fluid therein that transitions between liquid and gaseous states as the working fluid flows proximal to the condenser portion and the evaporator portion respectively.

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Номер записи: 10
09-01-2020 дата публикации

Disconnect assembly for active cooling of packaged electronics

Номер: US20200011617A1
Автор: Gerd Schlottig, Ingmar G. Meijer, Stephan Paredes, Thomas Brunschwiler
Принадлежит: International Business Machines Corp

A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.

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Номер записи: 11
12-01-2017 дата публикации

Cooling apparatus and method

Номер: US20170013747A1
Автор: Bruno Agostini, Daniele Torresin, Francesco Agostini, Gernot Riedel, Mathiew Habert
Принадлежит: ABB Schweiz AG

This invention relates to a cooling apparatus comprising a base plate, an evaporator and a condenser. In order to obtain a simple and efficient cooling apparatus the evaporator is a porous aluminum evaporator having a capillary structure with pores and a plurality of larger sized evaporator channels extending through the evaporator between a second end and the first end of the evaporator. A compensation chamber extending along a second surface of the evaporator receives first fluid from the condenser such that pores opening up into the second surface of the evaporator are provided with first fluid.

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Номер записи: 12
14-01-2016 дата публикации

COOLING MECHANISM FOR DATA CENTER

Номер: US20160014934A1
Автор: KANEO Hidetoshi, SHIRAIWA Hiroyuki
Принадлежит:

[Problem to be Solved] A technical object is to develop a novel cooling mechanism for a data center that can be operated at low running costs, can eliminate dust penetration, water droplet occurrence, and water leakage, can reduce temperature unevenness in the indoor space, and can achieve prompt fire extinction with little damage even in the case where a fire breaks out. 1. A cooling mechanism for a data center , comprising:an evaporative condenser and a liquid receiver arranged outside of the data center; andan evaporator arranged in an indoor space of the data center, whereinthe indoor space is cooled by evaporating a refrigerant in the evaporator, andthe refrigerant is condensed by the evaporative condenser.2. The cooling mechanism for the data center according to claim 1 , wherein a first cooling cycle including the evaporative condenser claim 1 , the liquid receiver claim 1 , and the evaporator claim 1 , and a second cooling cycle including a compressor claim 1 , a condenser claim 1 , and an evaporator are arranged in parallel with each other.3. The cooling mechanism for the data center according to claim 1 , comprising:a primary cooling cycle including, outside of the data center, a variable-speed turbo compressor, the evaporative condenser, a high-pressure liquid receiver, a liquid level controlling mechanism, a low-pressure liquid receiver, and a cascade condenser; anda secondary cooling cycle formed as a loop circuit, the evaporator arranged in the indoor space of the data center being connected to a liquid receiver and a liquid pump by pipe lines in the loop circuit, and carbon dioxide as a secondary refrigerant being condensed by the cascade condenser downstream of the evaporator, whereinwhen a condensation temperature of the evaporative condenser is equal to or lower than a predetermined temperature, the primary cooling cycle circulates a primary refrigerant without causing the compressor to function, and the indoor space is cooled by the secondary ...

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Номер записи: 13
10-01-2019 дата публикации

COOLING SYSTEM IN HYBRID ELECTRIC PROPULSION GAS TURBINE ENGINE

Номер: US20190014687A1
Автор: Snyder Douglas J.
Принадлежит:

A cooling system in a hybrid electric propulsion gas turbine engine is provided for cooling electrical components therein. The cooling system includes an electrical component disposed in proximity to an aircraft power generation component in the hybrid electric propulsion gas turbine engine such that the electrical component is thermally heated by the aircraft power generation component. A loop heat pipe structure is in thermal communication with the electrical component to transfer heat away from the electrical component. Wherein the loop heat pipe includes an evaporator portion, a condenser portion, a first pipe to supply a biphasic working fluid in a liquid state to the evaporator portion, and a second pipe to return the biphasic working fluid in a gaseous state to the condenser portion. 1. A cooling system in a hybrid electric propulsion gas turbine engine for cooling electrical components therein , the cooling system comprising:an electrical component disposed in proximity to an aircraft power generation component in the hybrid electric propulsion gas turbine engine such that the electrical component is thermally heated by the aircraft power generation component; an evaporator portion;', 'a condenser portion;', 'a first pipe to supply a biphasic working fluid in a liquid state to the evaporator portion; and', 'a second pipe to return the biphasic working fluid in a gaseous state to the condenser portion., 'a loop heat pipe structure in thermal communication with the electrical component to transfer heat away from the electrical component, wherein the loop heat pipe comprises2. The cooling system of claim 1 , wherein the condenser portion is disposed in proximity to a heat sink section to cool the working fluid from the gaseous state to the liquid state.3. The cooling system of claim 2 , wherein the heat sink section comprises at least one of engine oil claim 2 , engine fuel claim 2 , fan stream air claim 2 , ram stream air claim 2 , an engine nacelle claim 2 , ...

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Номер записи: 14
10-01-2019 дата публикации

VAPOR CHAMBER HEAT SPREADERS AND METHODS OF MANUFACTURNG THEREOF

Номер: US20190014688A1
Автор: Garimella Suresh V., Weibel Justin A.
Принадлежит: PURDUE RESEARCH FOUNDATION

Vapor chambers suitable for applications with power densities of one kW/cmor greater over a heat input area of one cmor greater and methods of manufacturing the same are provided. The vapor chambers include a housing having a thermally conductive substrate, a working fluid contained within the housing, a base layer formed of a porous thermally conductive material and located on and in thermal contact with the substrate, a cap layer formed of a porous thermally conductive material having through-holes formed therein defining vapor vents, and a plurality of conduits connecting the cap layer and the base layer with interstitial gaps therebetween. The conduits are capable of conveying the working fluid from the cap layer to the base layer. Heat entering the base layer causes the working fluid to evaporate from the base layer and the base layer is replenished with the working fluid through the conduits. 130. A vapor chamber heat spreader () comprising:{'b': '32', 'a housing having a thermally conductive substrate ();'}a working fluid contained within the housing;{'b': 42', '32, 'a base layer () formed of a porous thermally conductive material and located on and in thermal contact with the substrate ();'}{'b': 46', '48, 'a cap layer () formed of a porous thermally conductive material having through-holes defined therein defining vapor vents (); and'}{'b': 44', '46', '42', '44', '45', '44', '46', '42, 'a plurality of conduits () connecting the cap layer () and the base layer (), the conduits () having interstitial gaps () therebetween, the conduits () being functionally operable to convey the working fluid from the cap layer () to the base layer ();'}{'b': 42', '44', '42, 'wherein the working fluid is capable of being evaporated by heat entering the base layer (), condensing, and then flowing through the conduits () to replenish the base layer ().'}23042. The vapor chamber heat spreader () of claim 1 , wherein the base layer () is formed of sintered powder.33046. The vapor ...

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Номер записи: 15
18-01-2018 дата публикации

THERMAL MANAGEMENT SYSTEMS FOR ELECTRONICS

Номер: US20180020573A1
Автор: Bouras Scott R., Campbell Kris H., Katsumata Shin, Shepard Charles
Принадлежит:

A refrigeration system for electronics includes a compressor disposed on a main line and configured to compress a refrigerant in the refrigeration system and a condenser disposed downstream of the compressor on the main line. An evaporator line is in fluid communication with the main line downstream of the condenser and has an evaporator configured to receive heat into the refrigerant from an external heat source. The system also includes an immersion line in fluid communication with main line downstream of the condenser. The immersion line includes an immersion cooling container that is configured to at least partially house electronics such that the electronics are in direct fluid communication with the refrigerant to cool the electronics. 1. A refrigeration system for electronics , comprising:a compressor configured to compress a refrigerant in the refrigeration system and disposed on a main line;a condenser disposed downstream of the compressor on the main line;an evaporator line in fluid communication with the main line downstream of the condenser, the evaporator line having an evaporator configured to receive heat into the refrigerant from an external heat source; andan immersion line in fluid communication with main line downstream of the condenser, the immersion line having an immersion cooling container, the immersion cooling container configured to at least partially house electronics such that the electronics are in direct fluid communication with the refrigerant to cool the electronics.2. The system of claim 1 , wherein the evaporator line includes a first expansion valve and the immersion line includes a second expansion valve disposed in parallel with the first expansion valve claim 1 , wherein the evaporator is downstream of the first expansion valve and the immersion cooling container is downstream of the second expansion valve claim 1 , wherein the condenser is upstream of both of the first expansion valve and the second expansion valve.3. The ...

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Номер записи: 16
22-01-2015 дата публикации

METHOD AND SYSTEM FOR AN IMMERSION BOILING HEAT SINK

Номер: US20150022975A1
Автор: Browne Eric Ayres, Gunturi Satish Sivarama, Lai Rixin, Rush Brian Magann, Subramanyam Anurag Kasyap Vejjupalle
Принадлежит: GENERAL ELECTRIC COMPANY

A method and system for cooling a heat-generating component are provided. The system includes a heat generating electronic component including a heat conductive face, a heat sink device including at least one open face pin fin array surface directly coupled to the conductive face, each fin including a distal end including an outwardly facing contact area, the contact areas covering only a portion of the conductive face, the contact areas configured to carry electrical current therethrough, and an immersion of dielectric fluid contained in a vessel, the vessel including a heat-conductive hull at least partially submerged in a heat sink fluid. 1. An electronic component cooling system comprising:a heat generating electronic component comprising a heat conductive face;a heat sink device including at least one open face pin fin array surface directly coupled to said conductive face, each fin including a distal end comprising an outwardly facing contact area, the contact areas covering only a portion of said conductive face, said contact areas configured to carry electrical current therethrough; andan immersion of dielectric fluid contained in a vessel, the vessel comprising a heat-conductive hull at least partially submerged in a heat sink fluid,where heat generated in the electronic component is transferred through the face into the dielectric fluid and the fins of the heat sink device and into the dielectric fluid to generate boiling of the dielectric fluid, at least a portion of the dielectric fluid vapor from boiling transfers heat to the bulk dielectric fluid and returns to a liquid state, a second portion of the dielectric fluid vapor escapes the bulk dielectric fluid and condenses on an inner surface of the vessel.2. The system of claim 1 , further comprising an electronic component assembly comprising one or more electronic components and one or more heat sink devices clamped together in a press-pack stack configuration.3. The system of claim 1 , wherein said ...

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Номер записи: 17
03-02-2022 дата публикации

SYSTEM FOR COOLING SERVER BOARDS IN A DATA CENTER

Номер: US20220039296A1
Автор: Dupont Vincent
Принадлежит:

A cooling system, for cooling a plurality of server boards, includes at least one main two-phase fluid circuit, with a descending pipe, an ascending pipe, a loop bottom connector and an upper portion thermally coupled with at least one heat rendering exchanger. The cooling system also includes at least one evaporator coupled to a hot source to be cooled down in the server boards, a plurality of local circuits respectively serving one of the server boards and operating in bypass with respect to the main circuit. Each local circuit includes, on the one hand, a first branch, forming a feed-in on the descending pipe and, on the other hand, a second branch forming a fluid return in the ascending pipe of the main circuit, as well as an auxiliary circuit internal to the server board connected to one or several evaporator(s). 2. The cooling system according to claim 1 , wherein each evaporator comprises a porous member which ensures a capillary pumping claim 1 , so as to suck in the liquid from the first branch.3. The cooling system according to claim 1 , wherein an injection nozzle forming the outlet of the second branch is provided for rendering the fluid into the ascending pipe claim 1 , said injection nozzle delivering the fluid into the ascending pipe.4. The cooling system according to claim 1 , wherein the server boards are disposed horizontally and are spaced apart on top of one another in the vertical direction in a computer rack claim 1 , said computer rack having a front face and a rear face claim 1 , the descending and ascending pipes covering the rear face of the computer rack claim 1 , the first and second quick-disconnect fluid connectors being arranged on the rear face side.5. The cooling system according to claim 1 , the descending and ascending pipes of the main two-phase fluid circuit have a first cross-section and the first and second branches of the local circuits have a second cross-section claim 1 , the first cross-section being at least twice as large ...

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Номер записи: 18
17-01-2019 дата публикации

HIGH-DENSITY, FAIL-IN-PLACE SWITCHES FOR COMPUTER AND DATA NETWORKS

Номер: US20190020597A1
Автор: Coteus Paul W., Doany Fuad E., Hall Shawn A., SCHULTZ Mark D., Takken Todd E., Tian Shurong
Принадлежит:

A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards. 1. A network switch comprising:a plurality of spine cards each comprising a liquid cooling plate in direct contact with one or more spine chips, the plurality of spine cards are stacked vertically one on top of another and separated by a predetermined space;a plurality of leaf cards each comprising one or more leaf chips in direct contact with a heat sink, the plurality of leaf cards are perpendicular to and circumferentially arrayed around the stack of spine cards, the spine chips of each spine card are electrically connected to the leaf chips of each leaf card; anda heat exchanger comprising supply piping connecting it to the liquid cooling plate and return piping connecting it from the liquid cooling plate;lower card guide plate comprising perforations and guiding features corresponding with each of the plurality of leaf cards; andupper card guide plate comprising perforations and guiding features corresponding with each of the plurality of leaf cards.2. The structure according to claim 1 , wherein each leaf card is removably coupled to all of the spine cards.3. The structure according to claim 1 , wherein an orthogonal connector connects all the spine cards to each of the leaf cards.4. The structure according to claim 1 , wherein the leaf cards surround the stack of spine cards on all four sides claim 1 , and all the leaf cards along each side of the stack of spine cards are separated from each other by a space at all four corners of the stack of spine cards.5. The structure according to claim 1 , wherein ...

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Номер записи: 19
21-01-2021 дата публикации

COOLING APPARATUS WITH TWO-TIER VAPOR CHAMBER

Номер: US20210022266A1
Автор: Dhandapani Kathiravan, Raju Prakash Kurma, Shaikh Javed
Принадлежит: Intel Corporation

In one embodiment, a system includes a chip package and a cooling apparatus coupled to the chip package. The chip package includes one or more processors, and the cooling apparatus includes a first cavity defined at least partially by a first metal wall and a second metal wall and a second cavity defined at least partially by a flat third metal wall and the second metal wall. An internal pressure of the first cavity is lower than an ambient pressure outside the sealed first cavity. The second cavity includes a liquid disposed therein and wick material coupled to an interior surface of the third wall, and the chip package is positioned such that it coupled to the flat third metal wall of the cooling apparatus. 1. A two-tier vapor chamber apparatus comprising:a sealed first cavity defined at least partially by a first metal wall and a second metal wall, wherein an internal pressure of the sealed first cavity is lower than an ambient pressure outside the sealed first cavity; anda sealed second cavity defined at least partially by a flat third metal wall and the second metal wall, wherein the second cavity comprises a liquid disposed therein and wick material coupled to an interior surface of the third wall.2. The apparatus of claim 1 , wherein the sealed first cavity is disposed within the sealed second cavity.3. The apparatus of claim 1 , wherein an internal pressure of the first cavity is below 0.1 torr.4. The apparatus of claim 1 , further comprising a material within the first cavity having a thermal conductivity less than air.5. The apparatus of claim 4 , wherein the material is an aerogel.6. The apparatus of claim 1 , further comprising one or more support structures in the first cavity claim 1 , the support structures in contact with the first metal wall and the second metal wall.7. The apparatus of claim 6 , wherein the support structures are at least partially orthogonal to the first metal wall and second metal wall.8. The apparatus of claim 6 , wherein the ...

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Номер записи: 20
24-01-2019 дата публикации

RADIANT AIR CONDITIONING SYSTEM FOR HEAT-PRODUCING DEVICE

Номер: US20190024914A1
Автор: YAN Jiguang
Принадлежит:

The present invention provides a radiant air conditioning system for a heat-producing device (), comprising a compressor (), a condenser (), an expansion valve (), and at least one radiant panel evaporator () which are connected through a connecting pipe to form a recycling refrigerant loop, wherein each of the radiant panel evaporators comprises a refrigerant pipe () and a radiant panel () which exchanges heat with the refrigerant pipe (). The radiant air conditioning system further comprises at least one heat transfer plate (), configured to perform radiant heat transfer with the heat-producing device () and transmit an amount of absorbed heat to the radiant panel (). The present invention improves heat transfer effect between the radiant panel () and the heat-producing device (), and is particularly suitable for cooling a plurality of densely distributed heat-producing devices (). 110-. (canceled)11. A radiant air conditioning system for heat-producing device , comprising a compressor , a condenser , an expansion valve , and at least one radiant panel evaporator which are connected through a connecting pipe to form a recycling refrigerant loop ,wherein each of the radiant panel evaporators comprises a refrigerant pipe and a radiant panel which exchanges heat with the refrigerant pipe,wherein the radiant air conditioning system further comprises at least one heat transfer plate in which the heat transfer plate performs radiant heat transfer with the heat-producing device and transmits the absorbed heat to the radiant panel, andwherein the radiant air conditioning system is used for cooling a plurality of heat-producing devices, and wherein a plurality of heat transfer plates are arranged, the plurality of heat-producing devices and the plurality of heat transfer plates are arranged in an array, and the plurality of heat-producing devices and the plurality of heat transfer plates are alternately arranged in sequence in at least one array direction.12. The radiant ...

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Номер записи: 21
29-01-2015 дата публикации

Vapor chamber structure

Номер: US20150027668A1
Автор: Hsiu-Wei Yang
Принадлежит: Asia Vital Components Co Ltd

A vapor chamber structure is disclosed and includes a main body and a working fluid. The main body has a condensation section and an evaporation section and a chamber. The condensation section and the evaporation section are respectively disposed on two sides of the chamber. The evaporation section has a first face and a second face. A raised section is formed on the first face. The working fluid is filled in the chamber. The raised section is formed by means of mechanical processing as a support structure for enhancing the structural strength of the vapor chamber structure. The vapor chamber structure is manufactured at a much lower cost.

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Номер записи: 22
23-01-2020 дата публикации

VAPOR CHAMBER, ELECTRONIC DEVICE, METALLIC SHEET FOR VAPOR CHAMBER AND MANUFACTURING METHOD OF VAPOR CHAMBER

Номер: US20200025458A1
Автор: HASHIMOTO Taizo, HIRATA Kenro, OTA Takayuki, TAKAHASHI Shinichiro, TAKEMATSU Kiyotaka
Принадлежит: Dai Nippon Printing Co., Ltd.

A liquid flow path portion of a vapor chamber according to this invention includes a first main flow groove, a second main flow groove and a third main flow groove. A first convex array including a plurality of first convex portions arranged via a first communicating groove is provided between the first main flow groove and the second main flow groove. A second convex array including a plurality of second convex portions arranged via a second communicating groove is provided between the second main flow groove and the third main flow groove. The main flow groove includes a first intersection at which at least a part of the first communicating groove faces each second convex portion and a second intersection at which at least a part of the second communicating groove faces each first convex portion. 1. A vapor chamber in which a working fluid is enclosed , the vapor chamber comprising:a first metallic sheet;a second metallic sheet provided on the first metallic sheet; anda sealed space which is provided between the first metallic sheet and the second metallic sheet and which includes a vapor flow path portion through which a vapor of the working fluid passes and a liquid flow path portion through which the working fluid in liquid form passes,wherein the liquid flow path portion is provided in a surface of the first metallic sheet on a side of the second metallic sheet,the liquid flow path portion includes a first main flow groove, a second main flow groove and a third main flow groove, each of which extends in a first direction and through which the working fluid in liquid form passes,the first main flow groove, the second main flow groove and the third main flow groove are arranged in this order in a second direction orthogonal to the first direction,a first convex array which includes a plurality of first convex portions arranged in the first direction via a first communicating groove is provided between the first main flow groove and the second main flow groove,a ...

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Номер записи: 23
26-01-2017 дата публикации

INTEGRATED BUILDING BASED AIR HANDLER FOR SERVER FARM COOLING SYSTEM

Номер: US20170027086A1
Автор: Noteboom Scott, Robison Albert Dell
Принадлежит: Yahoo! Inc.

An air handler building structure is disclosed, which includes a floor, a plurality of lateral walls, a roof, and one or more openings located either on the roof or on at least one of the lateral walls. The lateral walls include a lower and an upper lateral walls opposing to each other having different respective heights determined in accordance with a ratio. The roof has a pitch consistent with the ratio associated with the lower and upper lateral walls. The shape of the building structure allows air within the building structure to rise via natural convection. In addition, a first dimension along a first direction defined between the lower and upper lateral walls relative to a second dimension along a second direction perpendicular to the first direction is such that the building structure provides access to outside natural air via one or more openings on the lower lateral wall. 1. An air handler building structure , comprising:a floor;a plurality of lateral walls, including a lower and an upper lateral walls opposing to each other having different respective heights determined in accordance with a ratio;a roof with a pitch consistent with the ratio associated with the lower and upper lateral walls; andone or more openings located on at least one of the roof and at least one of the lateral walls, whereinthe shape of the building structure allows air within the building structure to rise via natural convection, anda first dimension along a first direction defined between the lower and upper lateral walls relative to a second dimension along a second direction perpendicular to the first direction such that the building structure provides access to outside natural air via one or more openings on the lower lateral wall.2. The building structure of claim 1 , further comprising:a ceiling having one or more openings;a first space defined between the floor and the ceiling; anda second space defined between the ceiling and the roof, whereinthe outside natural air enters ...

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Номер записи: 24
23-01-2020 дата публикации

Display cooler and display device using same

Номер: US20200029460A1
Автор: Han Choon Lee, Min Woo JEONG, Se Hyeon KIM, Sung Wook Han
Принадлежит: LG ELECTRONICS INC

The present invention relates to: a cooler capable of simplifying a structure, increasing heat exchange efficiency, and slimming a display device; and a display device using the same. A cooler structure applied to the display device uses a heat pipe allowing a refrigerant, which is a volatile liquid, to flow therein and a fin structure expanding a heat transfer cross section, so as to rapidly absorb, through evaporation of the refrigerant, heat from the air in a closed air circulation path circulating around a display unit, and quickly dissipate heat from an outside space (an open air circulation path) of the closed air circulation path through condensation of the refrigerant, thereby enabling heat exchange to occur very efficiently while occupying less volume. Additionally, the present invention provides the cooler structure in which the heat pipe is made in a circular fashion such that the refrigerant efficiently flows therein. Particularly, when a section in which the heat pipe generates heat is disposed on the side of the display unit, the display device can be formed to be just as slim.

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Номер записи: 25
23-01-2020 дата публикации

COOLING SYSTEMS FOR COOLING ELECTRONIC COMPONENTS

Номер: US20200029465A1
Автор: CHAINER Timothy J., PARIDA Pritish R.
Принадлежит:

A first fluid is heated in a preheating section and passes into an evaporator coupled to a first electronic component. Operational heat from the first electronic component vaporizes the first fluid. A second fluid passes into a cold plate coupled to a second electronic component. Operational heat from the second electronic component heats the second fluid. First and second portions of the second fluid output from the cold plate pass through first and second routes, respectively. The first portion becomes thermally coupled to the preheating section and the second portion bypasses the preheating section. Heat transfer from the first portion to the preheating section causes the heating of the first fluid in the preheating section. 1. A computer program product comprising a computer readable storage medium having program instructions embodied therewith , the program instructions configured to cause a processor to control a set of mechanical pumps such that the set of mechanical pumps performs a method comprising:pumping a first fluid through an evaporator thermally coupled to a first set of electronic components while circulating within a first cooling loop such that the first fluid is vaporized, at least partially, using operational heat generated by the first set of electronic components as it passes through the evaporator;pumping the first fluid through a preheating section disposed in the first cooling loop between an output of a condenser and an input of the evaporator;pumping a second fluid through a cold plate thermally coupled to a second set of electronic components while circulating within a second cooling loop such that the second fluid is heated using operational heat generated by the second set of electronic components as it passes through the cold plate such that there is an increase in a temperature of the second fluid;pumping a first portion of the second fluid as output from the cold plate toward an input of a heat exchanger via a first route disposed ...

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Номер записи: 26
23-01-2020 дата публикации

Liquid-heat-transmission device

Номер: US20200029466A1
Автор: Haixia Wang, Ling Long, Tonghu XIA
Принадлежит: Shanghai Luyao Energy Technology Co Ltd

A liquid-heat-transmission device includes a vapor chamber, a cover, and a channel structure. The cover covers on a surface of the vapor chamber and a flow chamber is defined thereby. A water inlet and a water outlet respectively communicated with the flow chamber are defined on the cover. The channel structure is arranged in the flow chamber. The flow channel structure includes multiple fins arranged between the water inlet and the water outlet and with an interval apart. Each fin is extended in a longitudinal direction on a surface of the vapor chamber and connected to the vapor chamber and the cover. The vapor chamber is attached to a heat source, and a working fluid flows through the flow chamber from the water inlet of the cover and is drained after fully exchanging heat with the vapor chamber.

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Номер записи: 27
05-02-2015 дата публикации

APPARATUS AND METHOD FOR COOLING ELECTRIC COMPONENTS

Номер: US20150033772A1
Автор: Agostini Bruno, Agostini Francesco, Habert Mathieu, Paul Thomas
Принадлежит: ABB RESEARCH LTD.

An apparatus is disclosed which includes a generator receiving a heat load from first electric components, an evaporator for receiving a heat load from second electric components, a tight enclosure, and an absorber-condenser arranged outside of the tight enclosure. For efficient cooling of the apparatus, one or more of the generator, evaporator and absorber-condenser is entirely or partly manufactured of aluminum. The inert and refrigerant can be selected such that R134a is used as the inert and butane as the refrigerant fluid, or R32 is used as the inert and cyclopropane is used as the refrigerant, and the absorber is selected to include an alkyl acetamide, a carbonate ester or a glycol ester. 1. An apparatus comprising:a generator;an evaporator; andan absorber-condenser for circulating an absorber, an inert fluid and a refrigerant, wherein:the generator is configured to receive a heat load from first electric components, the generator including a fluid channel for receiving fluid including a mixture of the absorber and the inert fluid, and being configured to evaporate a part of the received fluid with the heat load from the first electric components;the evaporator is configured to receive a heat load from second electric components, the evaporator including a fluid channel for a fluid mixture of the inert fluid and the refrigerant for transferring heat received from the second electric components into the fluid mixture of the fluid channel;the absorber-condenser is configured to receive heated absorber from the generator and heated inert fluid and refrigerant from the evaporator, and to transfer heat from the received fluids to surroundings; andone or more of the generator, evaporator and absorber-condenser is entirely or partly manufactured of aluminum.2. The apparatus according to claim 1 , comprising:an enclosure for enclosing the generator and the evaporator, the absorber-condenser being arranged outside of the enclosure for transferring heat to outside of ...

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Номер записи: 28
30-01-2020 дата публикации

Wick, loop heat pipe, cooling device, electronic device, method of manufacturing porous body, and method of manufacturing wick

Номер: US20200033068A1
Автор: Akihiko Moki, Atsuo Hirai, Takashi Tanaka, Takeshi Endoh
Принадлежит: Ricoh Co Ltd

A wick includes a porous body. The porous body includes a plurality of bubbles, a plurality of composite cells, and a plurality of communication holes. The plurality of bubbles has sizes in a range from 0.1 μm to 50 μm, both inclusive, in a cross section obtained when the porous body is cut. The plurality of composite cells is formed by spherical bubbles partially overlapping each other. Bubbles of pore sizes from 5 μm to 10 μm, both inclusive, are most present among the plurality of composite cells. The plurality of communication holes of 5 μm or smaller is between the plurality of bubbles.

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Номер записи: 29
31-01-2019 дата публикации

SYSTEMS AND METHODS FOR COOLING AN ELECTRONIC DEVICE

Номер: US20190035713A1
Автор: PRAJAPATI RUPAL GOVINDBHAI, WANG Peng, Wang Shujuan
Принадлежит:

An apparatus for cooling an electronic device is disclosed. In an aspect, the apparatus includes a vapor chamber coupled to a heat generating component of the electronic device. In an aspect, the vapor chamber is coupled to an inner surface of an outer cover of the electronic device and conforms to a shape of the inner surface of the outer cover. In another aspect, the vapor chamber forms the outer cover of the electronic device. The vapor chamber comprises a sealed container, a wick structure disposed on an inner surface of the sealed container, and a fluid contained in the sealed container, wherein as heat is applied to an evaporator side of the sealed container coupled to the heat generating component, the fluid vaporizes over a condenser side of the sealed container opposite the evaporator side and returns to the evaporator side via the wick structure. 1. An apparatus for cooling an electronic device , comprising: a sealed container having an evaporator side and a condenser side opposite the evaporator side;', 'a wick structure disposed on an inner surface of the sealed container; and', 'a fluid contained in the sealed container, wherein:, 'a vapor chamber coupled to a heat generating component of the electronic device, the vapor chamber comprisingthe evaporator side of the sealed container is coupled to the heat generating component;the condenser side of the sealed container is coupled to an inner surface of an outer cover of the electronic device;the condenser side of the sealed container conforms to a shape of the inner surface of the outer cover of the electronic device; andas heat is generated by the heat generating component, the fluid vaporizes over the condenser side of the sealed container and returns to the evaporator side of the sealed container via the wick structure.2. The apparatus of claim 1 , wherein the vapor chamber is thermally coupled to the inner surface of the outer cover of the electronic device.3. The apparatus of claim 1 , wherein the ...

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Номер записи: 30
17-02-2022 дата публикации

Embedded cooling systems utilizing heat pipes

Номер: US20220053634A1
Автор: Ercan Mehmet DEDE, FENG Zhou
Принадлежит: Toyota Motor Engineering and Manufacturing North America Inc

Embedded cooling systems and methods of forming the same are disclosed. An embedded cooling system includes a PCB having a first major surface opposite a second major surface and power device stacks embedded within the PCB between the first major surface and the second major surface. Each power device stack includes a first substrate and a second substrate, and an electrical insulation layer disposed between the first substrate and the second substrate. The embedded cooling system further includes a power device coupled to the first substrate of each power device stack and heat pipes having a first end and a second end spaced a distance apart from the first end. The first end is embedded within the PCB substrate and the second end extends outside of the PCB substrate. The second substrate of the one or more power device stacks is coupled to the one or more heat pipes.

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Номер записи: 31
17-02-2022 дата публикации

HEAT DISSIPATION SYSTEM AND AN ASSOCIATED METHOD THEREOF

Номер: US20220053673A1
Автор: Chan Mark Aaron Chan, Fernahl Michael, Schelenz Owen Jannis, Waddell Alistair Martin
Принадлежит:

Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices. 1. A heat dissipation system comprising:a condenser;a first cooling loop coupled to the condenser, wherein the first cooling loop comprises a first two-phase heat transfer device coupled to a first component of a power converter; anda second cooling loop coupled to the condenser, wherein the second cooling loop comprises a second two-phase heat transfer device coupled to a second component of the power converter, wherein the condenser is disposed above the first and second two-phase heat transfer devices, and wherein the second cooling loop further comprises a single-phase heat transfer device coupled to a third component of the power converter, wherein the first and second components are power electronics components of the power converter and the third component is an auxiliary component of the power converter, wherein the first and second components are configured to generate substantially more heat than the third component, and wherein the single-phase heat transfer device is further coupled to and disposed upstream relative to the second two-phase heat transfer device.2. The heat dissipation system of claim 1 , further comprising a third cooling loop coupled to the condenser claim 1 , wherein the third cooling loop comprises a third two-phase heat transfer device claim 1 , wherein the first and second components are each at least one of a power inverter and a power converter claim 1 , and wherein the third ...

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Номер записи: 32
04-02-2021 дата публикации

BLENDED OPERATION MODE FOR PROVIDING COOLING TO A HEAT LOAD

Номер: US20210037677A1
Автор: LePoudre Philip Paul
Принадлежит:

Conditioning systems and methods for providing cooling to a heat load can include an evaporative cooler arranged in a scavenger plenum with a recovery coil downstream of the evaporative cooler. The conditioning systems can operate in various modes, including an adiabatic mode and an evaporative mode, depending on outdoor air conditions. The systems can operate in a blended mode between the adiabatic mode and the evaporative mode by varying the distribution of return water from the recovery coil into at least partially isolated sections of a storage tank, and selectively directing cold water from the evaporative cooler into the tank. The mix of warm and cold water exiting the tank can be varied to maintain the cold-water supply at or near a set point temperature for the heat load. In an example, the systems can include a pre-cooler in the plenum upstream of the evaporative cooler for pre-conditioning the scavenger air. 1. A method of controlling operation of a conditioning system configured to provide cooling to a heat load , the conditioning system having an evaporative cooler and a downstream recovery coil arranged inside a scavenger plenum configured to direct scavenger air from an air inlet to an air outlet , the method comprising:selectively directing scavenger air through the evaporative cooler depending on outdoor air conditions, wherein the evaporative cooler circulates water through the evaporative cooler during operation of the evaporative cooler;directing the scavenger air through the recovery coil, wherein the recovery coil circulates water through the recovery coil;selectively directing discharge water exiting the evaporative cooler into a discharge area of a storage tank, the water from the tank used to provide cooling to the heat load;directing return water exiting the recovery coil into at least one of a first bay and a second bay of the tank, wherein a first pump is fluidly connected to a first outlet of the tank in proximity to the first bay and a ...

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Номер записи: 33
08-02-2018 дата публикации

SERVER RACK HEAT SINK SYSTEM WITH COMBINATION OF LIQUID COOLING DEVICE AND AUXILIARY HEAT SINK DEVICE

Номер: US20180042140A1
Автор: Chen Hua, LI Minhua, OUYANG Ti, PAN Zhanhua, QIU Yuqun, Xie Chunhui, ZHANG Xuewei
Принадлежит:

A server heat dissipation system is provided, comprising a liquid cooling server cabinet comprising a cabinet body and multiple liquid cooling servers provided inside the cabinet body, wherein it is provided with a liquid cooling device to perform direct liquid cooling to the liquid cooling servers, and with an auxiliary heat dissipation device to perform auxiliary heat dissipation to the liquid cooling servers. The present invention provides high density cooling, high heat exchange efficiency, no local overheating, small space occupied, high reliability, low noise, and long life. 1. A server heat dissipation system , comprising a liquid cooling server cabinet comprising a cabinet body and multiple liquid cooling servers provided inside the cabinet body , wherein the system is provided with a liquid cooling device to perform direct liquid cooling to the liquid cooling servers , and with an auxiliary heat dissipation device to perform auxiliary heat dissipation to the liquid cooling servers.2. The server heat dissipation system of claim 1 , wherein the liquid cooling device comprises a liquid heat dissipater claim 1 , a distributor claim 1 , a collector claim 1 , and a primary heat transfer medium claim 1 , wherein the liquid heat dissipater is provided for performing heat dissipation to server chips claim 1 , the distributor is connected with the liquid heat dissipater by a plurality of liquid inlet pipes claim 1 , the liquid heat dissipater is then connected with the collector by a plurality of liquid outlet pipes claim 1 , the primary heat transfer medium flows into the liquid heat dissipater through the distributor and the liquid inlet pipes claim 1 , and then flows out from the liquid heat dissipater through the liquid outlet pipes claim 1 , and then is collected by the collector.3. The server heat dissipation system of claim 1 , wherein the liquid cooling device comprises an internal circulation system and an external circulation system claim 1 , wherein the ...

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Номер записи: 34
08-02-2018 дата публикации

HEAT REMOVAL ASSEMBLY FOR USE WITH A POWER CONVERTER

Номер: US20180042145A1
Автор: Chan Mark Aaron Chan, Kocur Michael Bernhard, Meyer Christian, Schelenz Owen, Waddell Alistair Martin
Принадлежит:

A heat removal assembly for use with a power converter that includes a condenser and an evaporator coupled in flow communication with the condenser. The evaporator is configured to channel working fluid therebetween. The evaporator includes a supply housing, a receiving housing, and at least one expansion housing extending between the supply housing and the receiving housing. The at least one expansion housing includes a flow inlet defined at the supply housing and a flow outlet defined at said receiving housing, and the flow inlet is sized smaller in cross-sectional size than the flow outlet. 1. A heat removal assembly for use with a power converter , said heat removal assembly comprising:a condenser; and a supply housing;', 'a receiving housing; and', 'at least one expansion housing extending between said supply housing and said receiving housing, wherein said at least one expansion housing comprises a flow inlet defined at said supply housing and a flow outlet defined at said receiving housing, said flow inlet sized smaller in cross-sectional size than said flow outlet, 'an evaporator coupled in flow communication with said condenser, said evaporator configured to channel working fluid therebetween, said evaporator comprisingwherein said at least one expansion housing comprises a plurality of expansion housings arranged in parallel between said supply housing and said receiving housing.2. The assembly in accordance with claim 1 , wherein said at least one expansion housing comprises an interior that progressively increases in size from said flow inlet towards said flow outlet.3. The assembly in accordance with claim 1 , wherein said at least one expansion housing has an asymmetric design such that said flow inlet has a smaller cross-sectional area than said flow outlet.4. The assembly in accordance with claim 1 , wherein a ratio of a cross-sectional area of said flow inlet relative to a cross-sectional area of said flow outlet is less than or equal to about 0.5.5 ...

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Номер записи: 35
19-02-2015 дата публикации

Cooling Apparatus For Switchgear With Heat Pipe Structure Having Integrated Busbar Tube

Номер: US20150047372A1
Автор: Buehler Tilo, Kaufmann Patrik, Schuler Gabriel, Unternaehrer Peter
Принадлежит: ABB TECHNOLOGY AG

A cooling apparatus is provided for a switchgear. The switchgear has one or more primary contacts constructed and arranged to connect to a terminal of a circuit breaker. The cooling apparatus includes an evaporator constructed and arranged to be associated with each primary contact. A condenser is located at a higher elevation than the evaporator. Fluid conduit structure fluidly connects the evaporator with the condenser. A portion of the fluid conduit structure defines a busbar tube electrically connected with an associated primary contact and defining a busbar of the switchgear. Working fluid is in the evaporator so as to be heated to a vapor state, with the fluid conduit structure being constructed and arranged to transfer the vapor to the condenser and to passively return condensed working fluid back to the evaporator for cooling the at least one primary contact and the associated busbar tube. 1. A cooling apparatus for a switchgear , the switchgear having one or more primary contacts constructed and arranged to connect to a terminal of a circuit breaker , the cooling apparatus comprising:an evaporator constructed and arranged to be associated with each primary contact,a condenser located at a higher elevation than the evaporator,fluid conduit structure fluidly connecting the evaporator with the condenser, a portion of the fluid conduit structure defining a busbar tube electrically connected with an associated primary contact and defining a busbar of the switchgear, andworking fluid in the evaporator so as to be heated to a vapor state, with the fluid conduit structure being constructed and arranged to transfer the vapor to the condenser and to passively return condensed working fluid back to the evaporator for cooling the at least one primary contact and the associated busbar tube.2. The apparatus of claim 1 , wherein in the busbar tube is made of electrically conductive material and is constructed arranged to carry current of about 4000 A.3. The apparatus of ...

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Номер записи: 36
18-02-2021 дата публикации

COOLING SYSTEM FOR HIGH DENSITY RACKS WITH MULTI-FUNCTION HEAT EXCHANGERS

Номер: US20210051819A1
Автор: Gao Tianyi
Принадлежит:

A cooling system and a multi-function heat exchanger design for electronics racks has one or more liquid-to-liquid heat exchangers (or their functions) and one or more liquid-to-air heat exchangers (or their functions). Each liquid-to-liquid heat exchanger has a rack-liquid channel, and an external-liquid channel, the rack-liquid channel and the external-liquid channel being fluidly isolated from each other, and thermally coupled to each other to transfer thermal energy between rack-liquid that circulates through the rack-liquid channel and external-liquid that circulates through the external-liquid channel. The one or more liquid-to-air heat exchangers each have an air path that circulates air between the electronics racks and ambient space around the electronics racks, the air path being thermally coupled to an external-liquid channel of the liquid-to-air heat exchanger to transfer thermal energy between the air and the external-liquid. 1. A cooling system for an electronics rack , comprising:a liquid-to-liquid heat exchanger having a rack-liquid channel, and a first external liquid channel, the rack-liquid channel and the first external-liquid channel being a) fluidly isolated from each other and b) thermally coupled to each other to transfer thermal energy between rack-liquid that circulates through the rack-liquid channel and external-liquid that circulates through the first external-liquid channel; anda liquid-to-air heat exchanger having an air path that circulates air from a hot aisle air section that traps hot air received from the electronics rack, to ambient space around the electronics rack, the air path being thermally coupled to a second external-liquid channel to transfer thermal energy between the air and external-liquid that circulates through the second external-liquid channel.2. The cooling system of claim 1 , wherein an outlet of the second external-liquid channel of the liquid-to-air heat exchanger connects to an inlet of the first external- ...

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Номер записи: 37
03-03-2022 дата публикации

Highly modularized cooling system design

Номер: US20220065537A1
Автор: Tianyi Gao
Принадлежит: Baidu USA LLC

A modular cooling system for data center. An airflow section forms a duct for air flow and a plurality of core units are serially attached to each other and to the airflow section. A blower unit is attached to each of the core units. A plurality of motorized dampers are provided: between each of the core units and the airflow unit, in between each two core units, and between each core unit and its corresponding blower unit. A plurality of fluid ports are attached to each of the core units. At least one of the core units is loaded with one or more equipment selected from: air filter, humidifier, dehumidifier, heat exchanger, evaporator, condenser, chiller, computer room air conditioner (CRAC), dry cooler, a cooling tower or other types of cooling equipment. A combination operation of the components on the compartment and the cooling units enables fast deployment and operation.

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Номер записи: 38
03-03-2022 дата публикации

Evaporator and loop heat pipe

Номер: US20220065547A1
Автор: Kazuhide Hakamada, Keiji SAKAGAWA, RYOSUKE MITANI, Yu HARUKI
Принадлежит: Kawasaki Jukogyo KK

An evaporator includes: a housing having a plurality of surfaces including a front surface and a back surface, at least one of the front and back surfaces having the largest area among the plurality of surfaces; and a heat-absorbing element disposed on at least one of the front and back surfaces and thermally connected to a heat source. The housing includes: at least one working fluid inlet located in a surface of the housing, the surface being other than a top surface of the housing; and at least one pair of working fluid outlets located respectively in opposite longitudinal end portions of the top surface.

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Номер записи: 39
15-02-2018 дата публикации

CIRCUIT CARD CARTRIDGE FOR AN ELECTRONIC SYSTEM

Номер: US20180049307A1
Автор: de Bock Hendrik Pieter Jacobus, Lassini Stefano Angelo Mario, Rush Brian Magann
Принадлежит:

An electronic system includes a chassis. The chassis includes a first endwall, a second endwall, and a sidewall. The electronic system also includes at least one circuit card cartridge coupled to the chassis. The at least one circuit card cartridge is positioned between the first endwall and the second endwall. The at least one circuit card cartridge includes a printed circuit board including a first surface and at least one electronic component. The at least one electronic component is mounted on the first surface. The at least one circuit card cartridge further includes at least one heat transfer assembly coupled to the printed circuit board. The at least one heat transfer assembly is configured to contact the at least one electronic component and extend adjacent the printed circuit board across the first surface. 1. An electronics system comprising:a chassis comprising a first endwall, a second endwall, and a sidewall; and a printed circuit board comprising a first surface and at least one electronic component, said at least one electronic component coupled to said first surface; and', 'at least one heat transfer assembly coupled to said printed circuit board, said at least one heat transfer assembly comprising a heat transfer component defining a heat transfer surface directly coupled to said at least one electronic component, wherein said at least one heat transfer component extends adjacent said printed circuit board across said first surface., 'at least one circuit card cartridge coupled to said chassis, said at least one circuit card cartridge positioned between said first endwall and said second endwall, said at least one circuit card cartridge comprising2. The electronics system in accordance with claim 1 , wherein said heat transfer assembly includes a solid conducting element.3. The electronics system in accordance with claim 1 , wherein said chassis defines an interior space and said chassis is further configured to receive said at least one circuit ...

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Номер записи: 40
15-02-2018 дата публикации

MULTI-PHASE HEAT DISSIPATING DEVICE EMBEDDED IN AN ELECTRONIC DEVICE

Номер: US20180049346A1
Автор: Anderson Jon, Chiriac Victor, Molloy Stephen, Rosales Jorge
Принадлежит:

A device that includes a region comprising an integrated device and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a first condenser configured to condense the fluid, where the first condenser is located in a first wall of the device, an evaporation portion coupled to the evaporator and the first condenser, and a collection portion coupled to the first condenser and the evaporator. The evaporation portion is configured to channel an evaporated fluid from the evaporator to the first condenser. The collection portion is configured to channel a condensed fluid from the first condenser to the evaporator through the help of gravity. 1. A device comprising:a region comprising an integrated device; and a fluid;', 'an evaporator configured to evaporate the fluid;', 'a first condenser configured to condense the fluid, wherein the first condenser is located in the first wall of the device;', 'an evaporation portion coupled to the evaporator and the first condenser, the evaporation portion configured to channel an evaporated fluid from the evaporator to the first condenser; and', 'a collection portion coupled to the first condenser and the evaporator, the collection portion configured to channel a condensed fluid from the first condenser to the evaporator, wherein the collection portion is located in at least another wall of the device., 'a heat dissipating device coupled to the region comprising the integrated device, the heat dissipating device implemented in at least a first wall of the device, the heat dissipating device configured to dissipate heat away from the region, wherein the heat dissipating device comprises2. The device of claim 1 , wherein the heat dissipating device further comprises a second condenser configured to condense the fluid.3. The device of ...

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Номер записи: 41
22-02-2018 дата публикации

DRIVE SYSTEM COMPRISING AT LEAST ONE HEAT PIPE, AND THE USE OF SAME IN A DRIVE SYSTEM

Номер: US20180054108A1
Автор: GONSER Uwe, MÜLLER Eberhard
Принадлежит: AMK ARNOLD MÜLLER GMBH & CO. KG

A drive system includes at least one drive unit, and at least one control device which at least partially influences the functionality of the drive unit and is connected to the drive unit along a connection region such that a thermal bridge is formed, and wherein the waste heat produced inside the thermal bridge during operation of the system, caused by the respective operating temperature of the drive unit and/or control device, can be discharged from the connection region by at least one heat pipe. 1. Drive system , comprising at least one drive unit and at least one control device at least partially influencing the operation of the drive unit , which is connected to the drive unit along a connection area to form a thermal bridge , comprising at least one heat pipe to remove the waste heat generated inside the thermal bridge during operation of the system inside the thermal bridge and caused by the respective operating temperatures of the drive unit and/or the control device , wherein the heat pipe is split at least into an evaporator area and a condenser area , and the evaporator area is arranged inside the connection area and the condenser area outside the latter , and wherein the condenser area of the heat pipe is heat-conducting contact with at least one heat exchanger which as a further unit part is an integral part of the drive system.23-. (canceled)410. Drive system according to claim 1 , wherein at least one heat pipe is separated by means of a thermal insulation () at least from the drive unit.5. Drive system according to claim 1 , wherein the drive unit is an electrically drivable servo and/or actuator motor claim 1 , the control device contains a heat-sensitive power electronic unit claim 1 , and the heat exchanger comprises a plate-like basic cooling element claim 1 , from which protrude finger-like cooling fins which each lead with their free ends into the surroundings.6. Drive system according to claim 1 , wherein at least one heat pipe is bent at a ...

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Номер записи: 42
22-02-2018 дата публикации

COOLING ARRANGEMENT FOR AIR CONDITIONING AN IT ENVIRONMENT AND ESPECIALLY FOR CLIMATE CONTROL IN A DATA PROCESSING CENTER

Номер: US20180054925A1
Автор: LAZZARO Andrea
Принадлежит:

A cooling arrangement for air conditioning an IT environment and especially for climate control in a data processing center, in which a first heat exchanger packet and a least a first blower are incorporated, wherein the first blower is set up to draw air from the building or the data processing center over a first of two oppositely positioned housing sides, convey it through the housing and the first heat exchanger packet and blow it out of the housing over a second housing side located opposite the first housing side, and wherein outside of the building or data processing center a second heat exchanger packet is disposed and air is blown through it by at least one second blower. 11234467232768591038910. A cooling arrangement () for air conditioning an IT environment comprising: a cooling unit housing () set up in an IT environment and especially in a data processing center , and in which a first heat exchanger packet () and a least a first blower () are incorporated , wherein the first blower () is set up to draw air from the building or the data processing center over a first of two oppositely positioned housing sides ( ,) , convey it through the housing () and the first heat exchanger packet () and blow it out of the housing () over a second housing side () located opposite the first housing side () , and wherein outside of the building or data processing center a second heat exchanger packet () is disposed and air is blown through it by at least one second blower () , wherein a first and a second coolant circuit ( , ) are carried fluidically separate from one another between the first heat exchanger packet () and the second heat exchanger packet () , wherein the first coolant circuit () is a passive cooling circuit and the second coolant circuit () is a compressor cooling circuit.2131112. The cooling arrangement () according to claim 1 , in which the first heat exchanger packet () has a first air-coolant heat exchanger () claim 1 , which is an evaporator of the ...

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Номер записи: 43
23-02-2017 дата публикации

Thermosiphon Systems for Electronic Devices

Номер: US20170055377A1
Автор: Dailey Bill, Rice Jeremy, Spaulding Jeffrey S.
Принадлежит:

A thermosiphon system includes a condenser and an evaporator fluidly coupled to the condenser by a condensate line. The evaporator includes a housing having an opening to the condensate line, a wick located in the housing, and a flow restrictor located in the housing configured to restrict flow of a working fluid from the condensate line onto a portion of the wick 1. A thermosiphon system , comprising:a condenser; andan evaporator fluidly coupled to the condenser by a condensate line, the evaporator comprising a housing having an opening to the condensate line, a wick located in the housing, and a flow restrictor located in the housing configured to restrict flow of a working fluid from the condensate line onto a portion of the wick.2. The thermosiphon system of claim 1 , wherein the housing has a bottom interior surface claim 1 , the wick is positioned on the bottom interior surface claim 1 , and the flow restrictor comprises a fluid-impermeable barrier on the bottom interior surface between the wick and the opening.3. The thermosiphon system of claim 2 , wherein the barrier has a plurality of apertures therethrough to permit the working fluid to flow to the wick.4. The thermosiphon system of claim 3 , wherein the plurality of apertures through the barrier are positioned adjacent the bottom interior surface.5. The thermosiphon system of claim 2 , wherein the bottom interior surface is a planar surface.6. The thermosiphon system of claim 2 , wherein the fluid-impermeable barrier dams the working fluid so that the working fluid pools on a side of the barrier closer to the opening.7. The thermosiphon system of claim 2 , wherein the flow restrictor is configured such that a depth of the working fluid is greater over a region of the housing between the barrier and the opening than over the portion of the wick.8. The thermosiphon system of claim 2 , wherein the fluid-impermeable barrier surrounds the portion of the wick.9. The thermosiphon system of claim 1 , wherein the ...

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Номер записи: 44
05-03-2015 дата публикации

VALVE CONTROLLED, NODE-LEVEL VAPOR CONDENSATION FOR TWO-PHASE HEAT SINK(S)

Номер: US20150062804A1
Автор: CAMPBELL Levi A., CHU Richard C., DAVID Milnes P., ELLSWORTH, IYENGAR Madhusudan K., JR. Michael J., SIMONS Robert E.
Принадлежит:

Apparatuses are provided for cooling an electronic component(s), which include a heat sink coupled to the electronic component(s), and having a coolant-carrying channel for a first coolant. The first coolant provides two-phase cooling to the electronic component(s), and is discharged from the heat sink as coolant exhaust, which includes coolant vapor. The apparatus further includes a node-level condensation module coupled to the heat sink to receive the coolant exhaust. The condensation module is cooled via a second coolant, and facilitates condensing the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module. A control valve adjusts a flow rate of the second coolant of the node-level condensation module, with the valve being automatically controlled by the controller based on a characterization of the coolant vapor in the coolant exhaust. 1. A cooling apparatus comprising:at least one heat sink to cool at least one electronic component of an electronic subsystem of multiple electronic subsystems of an electronics rack, the at least one heat sink comprising at least one coolant-carrying channel for a first coolant to flow therethrough, the first coolant providing two-phase cooling to the at least one electronic component, and being discharged from the at least one heat sink as coolant exhaust with coolant vapor;a node-level condensation module disposed within the electronic subsystem comprising the at least one electronic component, the node-level condensation module being coupled in fluid communication with the at least one heat sink and receiving the coolant exhaust therefrom, the node-level condensation module being liquid-cooled via a second coolant to facilitate condensing the coolant vapor in the received coolant exhaust within the electronic subsystem before return to a rack-level coolant return manifold of the electronics rack, the node- ...

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Номер записи: 45
05-03-2015 дата публикации

Cooling Structure for Electronic Circuit Board, and Electronic Device Using the Same

Номер: US20150062821A1
Автор: Chiba Masaki, Inaba Kenichi, Matsunaga Arihiro, SAKAMOTO Hitoshi, Shoujiguchi Akira, Yoshikawa Minoru
Принадлежит: NEC Corporation

The size of an electronic device using a cooling structure for an electronic circuit board is increased when using a heating element with a large amount of heat generation, therefore, a cooling structure for an electronic circuit board according to an exemplary aspect of the present invention includes an evaporator with an evaporation container storing a refrigerant; a condenser condensing and liquefying a vapor-phase refrigerant vaporized in the evaporator and radiating heat; and a pipe connecting the evaporator to the condenser, wherein the evaporator includes a heat receiving area, on one side of the evaporation container, thermally connecting to a heating element disposed on the electronic circuit board, and a plurality of flow path plates, in an area including the heat receiving area, extending in the direction parallel to the electronic circuit board; and a vapor-liquid interface of the refrigerant is positioned above or at the level of a lower end and below an upper end of the heat receiving area in the vertical direction, in the arrangement condition that the drawing direction of the flow path plates is approximately parallel to the vertical direction. 1. A cooling structure for an electronic circuit board , comprising:an evaporator with an evaporation container storing a refrigerant;a condenser condensing and liquefying a vapor-phase refrigerant vaporized in the evaporator and radiating heat; anda pipe connecting the evaporator to the condenser,wherein the evaporator comprises a heat receiving area, on one side of the evaporation container, thermally connecting to a heating element disposed on the electronic circuit board, and a plurality of flow path plates, in an area comprising the heat receiving area, extending in the direction parallel to the electronic circuit board; anda vapor-liquid interface of the refrigerant is positioned above or at the level of a lower end and below an upper end of the heat receiving area in the vertical direction, in the ...

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Номер записи: 46
22-05-2014 дата публикации

PUMPED LIQUID COOLING SYSTEM USING A PHASE CHANGE FLUID WITH ADDITIONAL SUBAMBIENT COOLING

Номер: US20140137582A1
Автор: Louvar Timothy, Sathe Abhijit, Wegmann Brandon
Принадлежит:

Provided is a cooling system wherein a first two-phase refrigerant can be circulated by a pump through an evaporator, to a first condenser, to a refrigerant-to-refrigerant heat exchanger and back to the pump. By providing the refrigerant-to-refrigerant heat exchanger in series with the condenser, a first environment can be cooled without having to operate a vapor compression circuit when an ambient temperature outside the first environment is a predetermined amount below an ambient temperature in the first environment. 1. A cooling system including:a pumped loop cooling circuit including at least one pump and at least one evaporator located in a first environment having a first ambient temperature, and a first condenser located in a second environment having a second ambient temperature;a vapor compression circuit including an expansion valve, a second condenser, and a compressor, the vapor compression circuit located in the second environment; anda refrigerant-to-refrigerant heat exchanger having first and second flow passages in heat exchange relationship, the first flow passage forming part of the pump loop cooling circuit and the second flow passage forming part of the vapor compression circuit and serving as an evaporator in the vapor compression circuit;whereby a first two-phase fluid can be circulated by the pump through the evaporator, to the first condenser, to the refrigerant-to-refrigerant heat exchanger and back to the pump, and a second two-phase fluid can be circulated through the compressor, the second condenser, the expansion valve, and the refrigerant-to-refrigerant heat exchanger.2. The cooling system according to claim 1 , wherein the refrigerant-to-refrigerant heat exchanger is in series with the first condenser.3. The cooling system according to claim 1 , wherein the refrigerant-to-refrigerant heat exchanger is downstream of the first condenser and upstream of the one or more evaporators.4. The cooling system according to claim 1 , wherein when ...

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Номер записи: 47
01-03-2018 дата публикации

PORTABLE ELECTRONIC DEVICE

Номер: US20180059730A1
Автор: Hsieh Cheng-Wen, Ke Jau-Han, LIAO Wen-Neng, WANG Yung-Chih
Принадлежит: ACER INCORPORATED

A portable electronic device includes a body, a heat source, an evaporator, a pipe, and at least one structural component. An inner space of the body is divided into a first space and a second space. The heat source is disposed at the first space and in thermal contact with the evaporator. The pipe is connected with the evaporator to form a loop and passes through at least one of the first space and the second space. At least a portion of the pipe surrounds and is in thermal contact with the structural component disposed inside the body. A working fluid is filled and is circulated in the loop. By absorbing heat in the evaporator, the working fluid in liquid state is vaporized to exit the evaporator. While passing through the pipe, the working fluid in vapor state dissipates heat to be condensed into liquid and flow into the evaporator. 1. A portable electronic device , comprising:a body, wherein an inner space of the body is divided into a first space and a second space separated from one another;a heat source, disposed at the first space;an evaporator, being in thermal contact with the heat source and absorbing heat from the heat source;a pipe, connected with the evaporator to form a loop, wherein a working fluid is filled in the loop, and the pipe passes through at least one of the first space and the second space; andat least one structural component, disposed inside the body and at least one portion of the pipe is surrounded and in thermal contact with the at least one structural component, wherein the working fluid in liquid state is vaporized by absorbing heat in the evaporator to exit the evaporator, and the working fluid in vapor state dissipates heat so as to be condensed into liquid while passing through the pipe and then flows into the evaporator, such that the working fluid is circulated in the loop.2. The portable electronic device as recited in claim 1 , wherein the at least one structural component comprises a battery disposed at the second space.3. ...

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Номер записи: 48
10-03-2022 дата публикации

STACK-TYPE VERTICAL HEAT DISSIPATION DEVICE

Номер: US20220078943A1
Автор: HUANG Hui-Fen, Su Chun-Hsien, Wan Cheng-Chien, WAN Cheng-Jui
Принадлежит:

The present invention provides a stack-type vertical heat dissipation device comprising an evaporator unit and a condenser unit. The evaporator unit has a side configured for direct or indirect contact with, and thereby receiving heat from, a high-temperature device in order for the heat to convert a heat conduction medium inside the evaporator unit into a gaseous state. The condenser unit is stacked on a top side of a housing of the evaporator unit, and is provided therein with a flow channel that is in communication with the evaporator unit and allows passage of the heat conduction medium so that the heat conduction medium is able to return to the evaporator unit under a force of gravity after condensing from the gaseous state into a liquid state and thereby complete a thermal cycle. 1. A stack-type vertical heat dissipation device , comprising:an evaporator unit having a side configured for direct or indirect contact with, and thereby receiving heat from, a high-temperature device in order for the heat to convert a heat conduction medium inside the evaporator unit into a gaseous state; anda condenser unit stacked on a top side of the evaporator unit, the condenser unit being provided therein with a flow channel, the flow channel being in communication with the evaporator unit and allowing passage of the heat conduction medium so that the heat conduction medium is able to return to the evaporator unit under a force of gravity after condensing from the gaseous state into a liquid state and thereby complete a thermal cycle.2. The stack-type vertical heat dissipation device of claim 1 , wherein the evaporator unit includes a housing claim 1 , an evaporation chamber provided inside the housing claim 1 , and a skived structure provided in the evaporation chamber; the condenser unit includes an upper main duct claim 1 , a lower main duct claim 1 , a plurality of flat tubes each having two opposite ends coupled to and communicating with the upper main duct and the lower ...

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Номер записи: 49
01-03-2018 дата публикации

HEAT DISSIPATION ASSEMBLY

Номер: US20180063994A1
Автор: TAN Li-Kuang, WU Wei-Fang
Принадлежит:

A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber. 1. A heat dissipation assembly , comprising:a condenser having a condensing chamber therein;an evaporator;a vapor conduit, wherein two ends of the vapor conduit are respectively connected to the condenser and the evaporator; anda liquid conduit, wherein two ends of the liquid conduit are respectively connected to the condenser and the evaporator,wherein a geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.2. The heat dissipation assembly of claim 1 , wherein the evaporator has an evaporating chamber claim 1 , and a geometric center of the liquid conduit in the evaporating chamber is lower than or equal to a geometric center of the evaporating chamber.3. The heat dissipation assembly of claim 2 , wherein the evaporating chamber has a first portion and a second portion that communicates with the first portion claim 2 , and the first portion is located at an edge of the second portion.4. The heat dissipation assembly of claim 2 , wherein the liquid conduit has a water outlet in the evaporating chamber claim 2 , and the evaporator comprises:a liquid working fluid, wherein the water outlet of the liquid conduit is lower than a liquid level of the liquid working fluid.5. The heat dissipation assembly of claim 4 , wherein the water outlet of the liquid conduit rotates along an axis of the liquid conduit.6. The heat dissipation assembly of claim 5 , wherein the water outlet rotates from a horizontal direction to an ...

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Номер записи: 50
29-05-2014 дата публикации

COOLING SYSTEM AND DEVICE HOUSING APPARATUS USING THE SAME

Номер: US20140144169A1
Автор: Chiba Masaki, Inaba Kenichi, Matsunaga Arihiro, SAKAMOTO Hitoshi, Yoshikawa Minoru
Принадлежит: NEC Corporation

A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrigerant flowing; an upper part evaporator, arranged between the upper part header and the middle header, including an upper part steam generating tube having a first flow path for leading a refrigerant of the middle header to the upper part header while making the refrigerant of the middle header perform heat exchange with outside air and having a second flow path for leading a refrigerant of the lower part header to the upper part header while making the refrigerant of the lower part header perform heat exchange with outside air; and a lower part evaporator, arranged between the lower part header and the middle header, including a lower part steam generating tube having a third flow path inserted into the middle header while making a refrigerant of the lower part header perform heat exchange with outside air, the lower part steam generating tube communicated with the second flow path of the upper part steam generating tube. 1. A cooling system for cooling an ...

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Номер записи: 51
19-03-2015 дата публикации

COOLING SYSTEM FOR ELECTRONICS

Номер: US20150075000A1
Автор: Cox Aaron R., Grady, IV William J., Matteson Jason A., Minyard Jason E.
Принадлежит:

A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel. 1. A method for conveying heat away from an electronic component , comprising:positioning a conformable thermal interface sleeve embracing the electronic component in an installed position;positioning a heat conducting wedge in contact with the conformable thermal interface sleeve;positioning a thermal channel in contact with the heat conducting wedge; andpositioning a manifold in contact with the thermal channel.2. The method of claim 1 , wherein the electronic component is a circuit board having at least one memory module.3. The method of claim 1 , wherein the thermal channel is a heat pipe.4. The method of claim 1 , wherein the thermal channel includes a fluid channel.5. The method of claim 1 , further comprising:positioning a ridge and mating groove on the conformable thermal interface sleeve and the heat conducting wedge.6. The method of claim 1 , wherein the conformable thermal interface sleeve includes a contact surface having a profile sculpted to conform to a configuration of the electronic component.7. The method of claim 1 , further comprising:positioning a latching mechanism that secures the conformable thermal interface sleeve to the heat conducting wedge.8. A method for conveying heat away from an electronic component claim 1 , comprising:positioning a conformable thermal interface sleeve embracing the electronic component in an installed position, wherein the electronic component is a circuit board having at least one memory module, and wherein the conformable thermal interface sleeve includes a contact ...

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Номер записи: 52
17-03-2022 дата публикации

Hood for mems-based cooling systems

Номер: US20220087059A1
Автор: Brian James Gally, Prabhu Sathyamurthy, Prathima Kapa, Seshagiri Rao Madhavapeddy, Shekhar Halakatti, Suryaprakash Ganti
Принадлежит: WISKA HOPPMANN GMBH

A system including a tile and a hood is described. The tile includes a plurality of cooling cells. Each of the cooling cells includes a support structure and a cooling element. The cooling element is supported by the support structure and is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The hood is coupled to the tile and directs the fluid around the plurality of cooling cells.

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Номер записи: 53
28-02-2019 дата публикации

Phase Change Evaporator with Heat-Dissipating Fins and Phase Change Cooling Device Using the Same

Номер: US20190069444A1
Автор: Lin Hao-Hui, Wan Cheng-Chien, Wan Cheng-Feng
Принадлежит:

A phase change evaporator includes multiple heat-dissipating fins formed on an evaporator body of the evaporator. A cooling device includes the evaporator, a condenser, a coolant output pipe and a coolant return pipe connected between the evaporator and the condenser, and coolant filled inside a closed coolant circulation loop formed by the evaporator, the condenser, the coolant output pipe and the coolant return pipe. When the evaporator body absorbs heat, the coolant inside the evaporator body is converted into a gaseous state by the heat and then quickly dissipates the heat absorbed thereby through the heat-dissipating fins for a part of the gaseous coolant to be condensed to resume heat absorption and for the remaining part to flow to the condenser through the coolant output pipe to be condensed to a liquid state and return to the evaporator body along the coolant return pipe for heat absorption. 1. A phase change evaporator comprising:an evaporator body having:a space defined inside the evaporator body;a partition board mounted in the space and dividing the space into a top chamber and a bottom chamber and having multiple through holes formed through the partition board for the top chamber and the bottom chamber to communicate with each other via the multiple through holes;a coolant exit formed through a top wall of the top chamber of the evaporator body above the partition board and directly communicating with the top chamber; anda coolant inlet formed through a sidewall of the bottom chamber of the evaporator body below the partition board and directly communicating with the bottom chamber, with the partition plate being intermediate the coolant exit and the coolant inlet;a conducting bottom plate mounted on a bottom of the evaporator body and configured to absorb heat generated by a heat-generating source, with the coolant inlet located intermediate the bottom of the evaporation body and the partition board; andmultiple heat-dissipating fins conductively ...

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Номер записи: 54
09-03-2017 дата публикации

Evaporative Induction Cooling System For A Data Center

Номер: US20170071077A1
Автор: Carlson Andrew B., Clidaras Jimmy, Malone Christopher Gregory
Принадлежит:

A data center cooling system includes an evaporative cooling system. The evaporative cooling system includes fans configured to circulate outside air at ambient conditions through an entry zone of a data center, and atomizers positioned upstream of the entry zone configured to spray atomized water into the circulating outside air. The atomized water evaporates in an evaporation zone and cools the outside air to produce cooled air, which is directed through racks of computers positioned downstream of the evaporation zone. 121-. (canceled)22. A data center cooling system comprising:a plurality of fans configured to draw outside air at ambient conditions into an entry zone of a data center;a plurality of atomizers positioned downstream of the entry zone configured to spray atomized water into the outside air;an evaporation zone where the atomized water evaporates and cools the outside air to produce cooled air;a rack zone positioned downstream of the evaporation zone that comprises a plurality of computer racks arranged in a plurality of substantially parallel rows; andan air-to-air heat exchanger positioned between the evaporation zone and the rack zone.23. The system of claim 22 , wherein the air-to-air heat exchanger comprises:one or more heat wheels;a first conduit positioned on the evaporation zone-side of the one or more heat wheels and configured to receive the cooled air and direct the cooled air through the one or more heat wheels; anda second conduit positioned on the rack zone-side of the one or more heat wheels and configured to receive hot air from the rack zone, direct the hot air through the one or more heat wheels and redirect the now cooled air back into the rack zone.24. The system of claim 23 , further comprising:a second plurality of atomizers positioned downstream of the heat exchanger and configured to spray atomized water into the cooled air before the cooled air enters the rack zone; anda second evaporation zone where the atomized water from the ...

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Номер записи: 55
27-02-2020 дата публикации

THERMAL MATERIALS FOR INCREASING A RATE OF HEAT PIPE COOLING

Номер: US20200068746A1
Автор: COOPER James, Juma James
Принадлежит:

Techniques of controlling heat from a heat source in an electronic device using a heat pipe, improved techniques include placing a thermal conductor such as graphite sheet in thermal contact with a heat pipe and an external surface such as a surface of a battery in an electronic device. In some implementations, the graphite sheet covers an area encompassing an end of the heat pipe. In some implementations, the graphite sheet is attached to the heat pipe using an adhesive. 1. An apparatus , comprising:an enclosure,a heat source within the enclosure,a heat pipe within the enclosure, the heat pipe including (a) an evaporating portion in thermal contact with the heat source and at which heat is removed from the heat source to evaporate a liquid into a heated vapor and (b) a condensing portion at which the heated vapor is cooled back into the liquid, the heat pipe terminating at a first heat pipe end and a second heat pipe end, the liquid traveling away from the first heat pipe end and/or the second heat pipe end,an external component located externally to the heat pipe and the heat source and within the enclosure, anda thermal conductor in thermal contact with the heat pipe and a surface of the external component, the thermal conductor having a thermal conductivity greater than that of the surface of the external component.2. The apparatus as in claim 1 , wherein the thermal conductor includes a graphite sheet.3. The apparatus as in claim 2 , wherein the graphite sheet covers an area encompassing the condensing portion of the heat pipe.4. The apparatus as in claim 2 , wherein the graphite sheet is attached to the heat pipe using an adhesive.5. The apparatus as in claim 4 , wherein the adhesive includes a thermal conductor.6. The apparatus as in claim 5 , wherein the adhesive includes a copper tape.7. The apparatus as in claim 1 , wherein the heat source includes a central processing unit (CPU) of a computer.8. The apparatus as in claim 7 , wherein the external component ...

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Номер записи: 56
19-03-2015 дата публикации

VARIABLE CONDUCTANCE THERMOSIPHON

Номер: US20150077938A1
Автор: Espersen Morten
Принадлежит: DANTHERM COOLING A/S

The present invention relates cooling system comprising at least one Thermo syphon, which Thermo syphon comprises at least one indoor evaporator, which is by first tubing connected to at least one outdoor condenser. It is the object of the present application to achieve effective automatic cooling of electronic systems placed inside a housing. This can be achieved by a system as disclosed in that the second tubing comprises a valve, which valve comprises a valve seat and a moveable valve piston, which valve piston is by decreasing temperature by the actuator moving towards the valve seat for closing the valve. Hereby a highly efficient cooling system can be achieved which can operate automatically without any energy supply from the outside, due to the use of the Thermo syphon principle. In situations where the outdoor temperature is decreasing to a low level which could occur in situations where the outdoor condensers in winter periods is cooled to a low temperature, there is a valve, which reduces or stops condensate and liquid refrigerant backwards to the evaporator. 119-. (canceled)20. A cooling system comprising at least one thermosiphon with at least one indoor evaporator configured for evaporation of a liquid refrigerant and is heat conductively connected to indoor cooling fins , and which indoor evaporator by a first tubing is connected to at least one outdoor condenser , which first tubing conducts evaporated refrigerant from the evaporator to the outdoor condenser that is heat conductively connected to outdoor cooling fins for cooling the outdoor condenser , and which outdoor condenser relatively to the indoor evaporator is placed at a defined vertical distance to use the gravity to generate a flow of the liquid refrigerant from the outdoor condenser through a second tubing back to the indoor evaporator , wherein the second tubing comprises a valve with a valve seat and a moveable valve piston with—the valve piston being movable by a valve actuator so that ...

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Номер записи: 57
11-03-2021 дата публикации

Heat-Sinking Improved Structure for Evaporators

Номер: US20210076536A1
Автор: Chen Chih-Wei, HSU Chi-Feng, LIANG Cheng-Jen
Принадлежит:

A heat-sinking improved structure for evaporators includes at least one heat-sinking component having an outer wall board; an inner wall board extending upwards at the bottom of the outer wall board and dividing the lower portion of the interior of the outer wall board to form two water evaporation areas, and a gas concentration area formed at the top portion of the interior of the outer wall board; then, continuously arranging and combining such a plurality of heat-sinking components in the same direction thereby constituting a heat-sinking module which can be installed and sealed within an outer case in order to operate as a heat-sinking improved structure for the evaporator. 1. A heat-sinking improved structure for evaporators , comprising:a heat-sinking component, including an outer wall board which is respectively installed with a first board surface, a second board surface and a third board surface, wherein the second board surface and the third board surface are individually located on the two opposite sides of the first board surface such that the second board surface and the third board surface individually form a preset angle with respect to the first board surface so that the interior of the outer wall board forms a semi-open space; in addition, an inner wall board extends upwards at the bottom of the outer wall board and is applied to divide the lower portion of the interior of the outer wall board to form two water evaporation areas, and also a gas concentration area is formed at the top portion of the interior of the outer wall board;accordingly, such a plurality of heat-sinking components can be continuously arranged and combined in the same direction thereby constituting a heat-sinking module which can be installed and sealed within an outer case in order to operate as a heat-sinking improved structure for the evaporator,wherein the upper end of the inner wall board is respectively formed with massive first protrusions and second protrusions, wherein ...

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Номер записи: 58
05-03-2020 дата публикации

DISCONNECT ASSEMBLY FOR ACTIVE COOLING OF PACKAGED ELECTRONICS

Номер: US20200072562A1
Автор: Brunschwiler Thomas, Meijer Ingmar G., Paredes Stephan, Schlottig Gerd
Принадлежит:

A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit. 1. A disconnect assembly for active cooling of packaged electronics , the assembly comprising:a solid frame comprising a slit and a first liquid coolant circuit portion leading to a frame outlet defined in an inner wall of the slit;an insert element, insertable in the slit so as to reach a sealing position defining a shut state to seal the frame outlet; anda cold plate, comprising a second liquid coolant circuit portion with a duct open on a side of the cold plate, wherein the cold plate is insertable in the slit so as to push the insert element for the insert element to leave the sealing position and the cold plate to reach a fluid communication position defining an open state, in which the duct is vis-à-vis the frame outlet.2. The disconnect assembly according to claim 1 , further comprisinga gasket arrangement extending on both the insert element and the cold plate, the gasket arrangement designed to prevent liquid leakage from the insert element and the cold plate in each of said shut state and said open state.3. The disconnect assembly according to claim 2 , whereinthe gasket arrangement is further designed to prevent ...

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Номер записи: 59
05-03-2020 дата публикации

Cooling device and projector

Номер: US20200073217A1
Автор: Katsuya Shimizu, Norio Imaoka
Принадлежит: Seiko Epson Corp

A cooling device includes an evaporator, a condenser, a vapor pipe, and a liquid pipe. The evaporator includes a housing having a reservoir, a wick disposed in the housing and retaining the working fluid in the liquid phase, and a groove member having a plurality of flow channels through which the working fluid in the vapor phase flows. The wick has first, second and third layers. The first layer has a plurality of first apertures, and is higher in thermal conductivity than both the second and third layers. The third layer transports the working fluid in the liquid phase in the reservoir to the second layer. The second layer has a plurality of second apertures corresponding to the first apertures, the second apertures having aperture area larger than corresponding one of the first apertures. The second layer transports the working fluid in the liquid phase to the first layer.

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Номер записи: 60
07-03-2019 дата публикации

LOOP HEAT PIPE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE

Номер: US20190075682A1
Автор: Abe Tomoyuki, Shioga Takeshi
Принадлежит: FUJITSU LIMITED

A loop heat-pipe includes an evaporator; a condenser; a first line which connects the evaporator to the condenser and in which working fluid of vapor phase flows; and a second line which connects the condenser to the evaporator and in which working fluid of liquid phase flows, wherein each of the evaporator, the condenser, the first line, and the second line is bonded to a first and second plate, the first plate includes in a region for the evaporator: first protrusions that extend in a length direction, and second protrusions that extend in a width direction, which intersects with the length direction; the second plate includes in a region for the evaporator: either or both of third protrusions extending in the length direction and fourth protrusions extending in the width direction, and recesses partitioned by either or both of the third protrusions and the fourth protrusions. 1. A loop heat pipe comprising:an evaporator;a condenser;a first line which connects the evaporator to the condenser and in which working fluid of vapor phase flows; anda second line which connects the condenser to the evaporator and in which working fluid of liquid phase flows, whereinthe evaporator, the condenser, the first line, and the second line constitute a structure by bonding a first plate and a second plate,the first plate includes in a region for the evaporator:a plurality of first protrusions that extend in a length direction of the evaporator from an end side connected to the second line toward an end side connected to the first line;a plurality of second protrusions that extend in a width direction of the evaporator, which intersects with the length direction; anda plurality of first recesses which are partitioned by the plurality of first protrusions and the plurality of second protrusions,the second plate includes in a region for the evaporator:either or both of a plurality of third protrusions extending in the length direction and a plurality of fourth protrusions extending ...

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Номер записи: 61
18-03-2021 дата публикации

LOOP HEAT PIPE AND FABRICATION METHOD THEREFOR, AND ELECTRONIC DEVICE

Номер: US20210080192A1
Автор: Abe Tomoyuki, Shioga Takeshi
Принадлежит: FUJITSU LIMITED

A evaporator of a loop heat pipe includes a liquid inlet side portion that extends in a widthwise direction crossing with a lengthwise direction from a liquid inlet side to a vapor outlet side, a plurality of portions that continue to the liquid inlet side portion and extend in the lengthwise direction, a plurality of vapor flow paths that are provided between the plurality of portions and extend in the lengthwise direction, and a vapor outlet side vapor flow path that extends in the widthwise direction and continues to the vapor flow paths. Each of the plurality of portions includes a first groove communicating two adjacent ones of the vapor flow paths. 111-. (canceled)12. A fabrication method for a loop heat pipe , comprising:processing a region of a first plate-like member, in which an evaporator is to be formed, to form, in a region in which a plurality of portions extending in a lengthwise direction from the side of a liquid inlet toward the side of a vapor outlet of the region serving as the evaporator are to be formed, a first groove extending in a widthwise direction crossing with the lengthwise direction and capable of generating capillary force such that, from among regions in which a plurality of vapor flow paths are to be formed provided between the regions in which the plurality of portions are to be formed, regions in which two vapor flow paths adjacent to each other are to be formed are communicated with each other, form, in a region in which a liquid inlet side portion is to be formed, a third groove extending in the widthwise direction and capable of generating capillary force and form a first wide groove having a width greater than those of the first groove and the third groove in the region in which the plurality of vapor flow paths are to be formed and a region in which a vapor outlet side vapor flow path is to be formed;processing a region of a second plate-like member, in which the evaporator is to be formed, to form, in the region in which the ...

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Номер записи: 62
26-03-2015 дата публикации

HEAT DISSIPATION STRUCTURE FOR HAND-HELD MOBILE DEVICE

Номер: US20150083371A1
Автор: HSIEH Kuo-Chun, Huang Chuan-Chin
Принадлежит: ASIA VITAL COMPONENTS CO., LTD.

A heat dissipation structure for hand-held mobile device includes a supporting body having a first and an opposite second side and including at least one heat dissipation area. In the heat dissipation area, a heat dissipation element is correspondingly fitted without increasing an overall thickness and volume of the supporting body for the hand-held mobile device. With the heat dissipation element fitted in the heat dissipation area on the supporting body, heat produced by the hand-held mobile device during operation thereof can be quickly transferred to the heat dissipation element for dissipating into ambient air. 1. A heat dissipation structure for hand-held mobile device , comprising a supporting body; the supporting body having a first side and an opposite second side , and including at least one heat dissipation area , at where a heat dissipation element is located.2. The heat dissipation structure for hand-held mobile device as claimed in claim 1 , wherein the heat dissipation area is an opening extended through the supporting body in a thickness direction thereof to communicate the first side with the second side; the heat dissipation element being correspondingly fitted in the opening and having a heat absorption surface and an opposite heat dissipation surface; the heat absorption surface being flush with the first side of the supporting body claim 1 , and the heat dissipation surface being flush with the second side of the supporting body.3. The heat dissipation structure for hand-held mobile device as claimed in claim 1 , wherein the heat dissipation element is selected from the group consisting of a vapor chamber and a thin heat pipe.4. The heat dissipation structure for hand-held mobile device as claimed in claim 1 , wherein the heat dissipation element is joined to the supporting body by a means selected from the group consisting of riveting claim 1 , diffusion bonding claim 1 , welding and gluing.5. The heat dissipation structure for hand-held mobile ...

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Номер записи: 63
12-06-2014 дата публикации

ELECTRONIC DEVICE COOLING WITH MICROJET IMPINGEMENT AND METHOD OF ASSEMBLY

Номер: US20140160677A1
Автор: Bahadur Raj, Browne Eric Ayres, de Bock Hendrik Pieter Jacobus, JR. Stanton Earl, Mandrusiak Gary Dwayne, Weaver
Принадлежит: GENERAL ELECTRIC COMPANY

An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet. 1. An integrated circuit device , comprising: at least one of an array of spaced-apart nanoscale structures and an array of spaced-apart microscale structures formed on at least a portion of said second surface; and', 'a wettability coating covering at least a portion of said second surface;, 'a die having a substrate including a first surface and a second surface opposite said first surface, said die including at least one circuit element positioned on said first surface, said second surface including a wetting feature comprisinga spacer coupled to said die adjacent said second surface; and at least one microjet defined therethrough; and', 'at least one exit hole defined therethrough, wherein said at least one exit hole is adjacent said at least one microjet., 'an injector plate coupled to said spacer, said injector plate comprising2. The integrated circuit device in accordance with claim 1 , wherein said at least one microjet is positioned opposite said at least one circuit element positioned on said first surface.3. The integrated circuit device in accordance with claim 1 , wherein said injector plate further comprises an array of ...

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Номер записи: 64
18-03-2021 дата публикации

PCM-BASED HEAT SINK STRUCTURE

Номер: US20210084794A1
Автор: Liu I-Ming
Принадлежит:

A PCM (phase change material)-based heat sink structure includes an evaporation unit, a condensation unit, and a connecting pipe. The evaporation unit has a first space provided with a plurality of spaced first partitions that are integrally formed by an aluminum extrusion process. The first partitions partition the first space into a plurality of first branch passages. The first partitions are formed with a first main passage communicating with each first branch passage. The condensation unit has a second space provided with a plurality of spaced second partitions that are integrally formed by an aluminum extrusion process. The second partitions partition the second space into a plurality of second branch passages. The second partitions are formed with a second main passage communicating with each second branch passage. The connecting pipe is connected between the condensation unit and the evaporation unit to form a circulating heat dissipation loop. 1. A PCM (phase change material)-based heat sink structure , comprising:an evaporation unit, having a sealed first space therein, the first space being provided with a plurality of spaced first partitions that are integrally formed by an aluminum extrusion process, the first partitions partitioning the first space into a plurality of first branch passages, the first partitions being formed with a first main passage, the first main passage being in communication with each of the first branch passages;a condensation unit, the condensation unit and the evaporation unit forming a circulating heat dissipation loop, the condensation unit having a sealed second space therein, the second space being provided with a plurality of spaced second partitions that are integrally formed by an aluminum extrusion process, the second partitions partitioning the second space into a plurality of second branch passages, the second partitions being formed with a second main passage, the second main passage being in communication with each of ...

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Номер записи: 65
22-03-2018 дата публикации

SYSTEM AND METHOD FOR COOLING A COMPUTER PROCESSOR

Номер: US20180084679A1
Автор: STOLYAR ALEXEY, YUQUE WILBERT
Принадлежит:

A system for cooling one or more computer processors is provided. The system includes a server chassis and one or more server nodes. The server chassis is selectively mountable to a server rack. The one or more server nodes each include a body, at least one of the one or more computer processors, and a refrigeration circuit. The body is selectively mountable to the server chassis. The at least one of the one or more computer processors is disposed on-board the body. The refrigeration circuit is for cooling the at least one computer processor and includes an evaporator and a compressor disposed on-board the body. 1. A system for cooling one or more computer processors , the system comprising:a server chassis that is selectively mountable to a server rack; a body that is selectively mountable to the server chassis;', 'at least one of the one or more computer processors disposed on-board the body;', 'a refrigeration circuit for cooling the at least one computer processor; and', 'wherein the refrigeration circuit includes an evaporator and a compressor disposed on-board the body., 'one or more server nodes each including2. The system of claim 1 , wherein the evaporator is disposed on the at least one computer processor.3. The system of claim 1 , wherein claim 1 , the refrigeration circuit further includes a condenser disposed on-board the body.4. The system of claim 1 , wherein the refrigeration circuit further includes a metering device disposed on-board the body.5. The system of claim 1 , wherein the refrigeration circuit further includes a filter disposed on-board the body.6. The system of claim 1 , wherein at least three server nodes are selectively mounted to the server chassis.7. The system of claim 6 , whereinthe body of each of the server nodes includes a first end and a second end,the at least one computer processor and the compressor of a first server node and of a second server node of the at least three server nodes are disposed at the first end and at the ...

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Номер записи: 66
19-06-2014 дата публикации

COOLING DEVICE AND ELECTRONIC DEVICE MADE THEREWITH

Номер: US20140165638A1
Автор: Inaba Kenichi, Matsunaga Arihiro, SAKAMOTO Hitoshi, Shoujiguchi Akira, Yoshikawa Minoru
Принадлежит: NEC Corporation

A cooling device employing a boiling cooling method cannot exhibit sufficient cooling performance when it is installed in a low-profile electronic device. 1. A cooling device comprising:an evaporation unit storing refrigerant;a condensation unit performing heat radiation by condensing and liquefying vapor-phase refrigerant vaporized at said evaporation unit; andpiping connecting said evaporation unit with said condensation unit;wherein said evaporation unit comprises an evaporation container and a partition wall section arranged within said evaporation container and constitutes a flow path of said refrigerant; andthe height of said partition wall section is equal to or larger than the height of the vapor-liquid interface of said refrigerant and is smaller than the height of said evaporation container.2. The cooling device according to claim 1 , wherein said evaporation unit and said condensation unit are located at approximately the same height in the vertical direction.3. The cooling device according to claim 1 , whereinsaid piping comprises a vapor pipe flowing said vapor-phase refrigerant and a liquid pipe flowing liquid-phase refrigerant generated by condensation and devolatization;said vapor pipe is connected to said evaporation container at a position of a height equal to or higher than the height of said partition wall section; andsaid liquid pipe is connected to said evaporation container at a position of a height equal to or lower than the height of the vapor-liquid interface of said refrigerant.4. The cooling device according to claim 3 , whereinsaid liquid pipe is connected to a side surface of said evaporation container; andsaid vapor pipe is arranged onto a surface facing said surface to which said liquid pipe of said evaporation container is connected.5. The cooling device according to claim 3 , wherein said liquid pipe is connected to the bottom surface of said evaporation container.6. The cooling device according to claim 3 , wherein claim 3 ,said ...

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Номер записи: 67
25-03-2021 дата публикации

Leak Detection Apparatus for an Information Handling System

Номер: US20210088404A1
Автор: Li Chao Hung (Brian), Lu Wen Hung (Steven)
Принадлежит:

A leak inhibition/detection device includes an absorbent material, a leak sensor in contact with the absorbent material, and an enclosure surrounding the absorbent material. The leak inhibition/detection device is configured to surround a joint between tubing and a cold plate/evaporator or a radiator/condenser of a liquid cooling module of an information handling system. 1. An information handling system , comprising:a processor; and a cold plate/evaporator configured to transfer heat from the processor to a coolant;', 'a radiator/condenser configured to removing heat from the coolant;', 'tubing connecting the cold plate/evaporator and the radiator/condenser;', 'a pump to circulate the coolant through the tubing; and', 'at least one leak inhibition/detection device positioned to surround a joint between the tubing and the cold plate/evaporator or the radiator/condenser, the leak inhibition/detection device including an absorbent material, a leak sensor, and an enclosure., 'a liquid cooling module thermally coupled to the processor, the liquid cooling module including2. The information handling system of claim 1 , wherein the absorbent material includes a fiber or a polymer.3. The information handling system of claim 2 , wherein the fiber includes a natural fiber or a synthetic fiber.4. The information handling system of claim 1 , wherein the leak sensor is a hygristor.5. The information handling system of claim 1 , wherein the processor is configured to:receive a signal from the leak sensor; andshut down the system.6. The information handling system of claim 5 , wherein shutting down the system includes writing unsaved data from a memory to a storage and powering down the information handling system.7. The information handling system of claim 5 , wherein the processor is further configured to notify a user of the information handling system after receiving the signal from the leak sensor and prior to shutting down the system.8. The information handling system of ...

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Номер записи: 68
12-03-2020 дата публикации

Apparatus and Method for Cooling an Electronic Assembly

Номер: US20200084916A1
Автор: Moser Tim, SANDER Joerg
Принадлежит:

An apparatus configured to cool an electronic assembly includes an evaporator configured to evaporate a cooling medium using heat of the electronic assembly, and a power transformer configured to transform energy stored in the evaporated cooling medium into electric power. The cooling medium has an evaporating temperature at atmospheric pressure within a temperature range of 50° C. to 80° C. 1. An apparatus configured to cool an electronic assembly , the apparatus comprising:an evaporator configured to evaporate a cooling medium using heat of the electronic assembly; anda power transformer configured to transform energy stored in the evaporated cooling medium into electric power,wherein the cooling medium has an evaporating temperature at atmospheric pressure within a temperature range of 50° C. to 80° C.2. The apparatus according to claim 1 , further comprising a feedback line configured to supply the electric power from the power transformer to the electronic assembly to use the electric energy generated by the power transformer.3. The apparatus according to claim 1 , wherein the power transformer includes at least one of the following: a generator claim 1 , a condenser claim 1 , and a turbine.4. The apparatus according to claim 3 , wherein the turbine is adapted to provide a fluid channel for the evaporated cooling medium with a diameter within the range of 5 to 20 mm or an adequate cutting area related to.5. The apparatus according to claim 1 , further comprising a reservoir for the cooling medium that is formed upstream from the evaporator.6. The apparatus according to claim 1 , wherein the cooling medium comprises one or more of the following: ammonia claim 1 , ethanol claim 1 , n-butane claim 1 , b-pentane claim 1 , HFC-245fa claim 1 , HFC-245ca claim 1 , n-perfluoropentane claim 1 , water or a mixture thereof.8. The electronic assembly according to claim 7 , wherein the electric circuitry includes at least one electronic component with high thermal ...

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Номер записи: 69
12-03-2020 дата публикации

HEAT PIPE AND VAPOR CHAMBER HEAT DISSIPATION

Номер: US20200084917A1
Автор: VanDEVENTER Allan C., Wei Xiaojin
Принадлежит:

The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers. 1. A heat dissipation device comprising:a baseplate; wherein the first heat pipe has an internal cavity,', 'wherein a first outer dimension of the first heat pipe is more than five times a second outer dimension of the first heat pipe and more than five time a third outer dimension of the first heat pipe;, 'a first heat pipe in thermal communication with the baseplate,'} wherein the vapor chamber has an internal cavity,', 'wherein a first outer dimension and a second outer dimension of the vapor chamber is more than five times a third outer dimension of vapor chamber,, 'a vapor chamber coupled to the first heat pipe,'} 'wherein the vapor chamber extends from the first heat pipe; and', 'wherein the internal cavity of the first heat pipe and the internal cavity of the vapor chamber are contiguous,'} 'wherein the one or more heat conducting fins extends from the vapor chamber.', 'one or more heat conducting fins coupled to the vapor chamber,'}2. The heat dissipation device of further comprising:a second heat pipe in thermal communication with the baseplate; and wherein the first heat pipe is positioned over the first high heat density area,', 'wherein the second heat pipe is positioned over the second heat density area., 'an ...

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Номер записи: 70
21-03-2019 дата публикации

COOLING DEVICE, PROJECTOR, AND HEAT RECEIVING UNIT

Номер: US20190086777A1
Автор: Iyoda Makoto, Kano Ichiro
Принадлежит:

A cooling device includes a heat receiving unit, a working fluid, a radiator, and a pump. The heat receiving unit includes a first member, a second member, an inlet housing, and an outlet housing. The first member receives heat. The second member is disposed to face the first member. The inlet housing is connected to the pump and disposed between the first member and the second member. The outlet housing is connected to the radiator and disposed on a side of the second member facing away from the inlet housing. The first member and the second member are disposed at a predetermined distance away from each other. A vaporization space portion is disposed between the first member and the second member. An outlet space portion is disposed on a side of the second member facing away from the vaporization space portion. 1. A cooling device comprising:a heat receiving unit configured to receive heat from a heating element;a working fluid transferring the heat received by the heat receiving unit;a radiator configured to cool the working fluid from the heat receiving unit; anda pump configured to transport, to the heat receiving unit, the working fluid discharged from the radiator,whereinthe heat receiving unit includes:a first member configured to receive the heat from the heating element and vaporize the working fluid;a second member disposed to face the first member and having slits disposed in the second member;an inlet housing connected to the pump and disposed between the first member and the second member; andan outlet housing connected to the radiator and disposed on a side of the second member facing away from the inlet housing,the first member and the second member are disposed at a predetermined distance away from each other, and a vaporization space portion is disposed between the first member and the second member, andan outlet space portion is disposed on a side of the second member facing away from the vaporization space portion.2. The cooling device according ...

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Номер записи: 71
31-03-2022 дата публикации

LIQUID COOLING RADIATOR BASED ON A WORKING MEDIUM CAPABLE OF LIQUID-LIQUID PHASE SEPARATION

Номер: US20220104397A1
Автор: Ding Bin, Gong Liang, XU Minghai, Zhang Yuan, ZHU Chuanyong
Принадлежит:

A liquid cooling radiator based on a working medium capable of liquid-liquid phase separation includes a cooling fan, a micro liquid pump, a mixing pipe and a heat exchanger which are connected in sequence via a plastic tube. The liquid cooling radiator uses a solution capable of liquid-liquid phase separation at a lower critical separation temperature as a working medium, and is sealed after filling the solution into pipelines of the liquid cooling radiator. By replacing a working medium of the active CPU liquid cooling radiator, a heat dissipation performance in a limited space under a condition of a same pump power consumption, is greatly improved, a viscosity of the working medium in a heat-carrying state is reduced to decrease a flow resistance, which realizes both an enhancement of heat transfer and a reduction of flow resistance. 1. A liquid cooling radiator based on a working medium capable of liquid-liquid phase separation , comprising a cooling fan , a micro liquid pump , a mixing pipe and a heat exchanger which are connected in sequence via a plastic tube , wherein the liquid cooling radiator employs a solution capable of liquid-liquid phase separation at a lower critical separation temperature as a working medium , and the liquid cooling radiator is sealed after filling the solution into pipelines of the liquid cooling radiator.2. The liquid cooling radiator according to claim 1 , wherein the liquid cooling radiator is configured for heat dissipation of CPU or GPU claim 1 , when the micro liquid pump is activated claim 1 , the solution in the pipelines of the liquid cooling radiator flows into the heat exchanger through an inlet of the heat exchanger and is in a stable single-phase state claim 1 , by convective heat transfer with internal extended surfaces of the heat exchanger claim 1 , the solution is heated by the internal extended surfaces of the heat exchanger claim 1 , and a temperature of the solution rapidly raises to the lower critical ...

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Номер записи: 72
31-03-2022 дата публикации

COOLING APPARATUS WITH TWO-TIER VAPOR CHAMBER

Номер: US20220104399A1
Автор: Dhandapani Kathiravan, Kurma Raju Prakash, Shaikh Javed
Принадлежит: Intel Corporation

In one embodiment, a system includes a chip package and a cooling apparatus coupled to the chip package. The chip package includes one or more processors, and the cooling apparatus includes a first cavity defined at least partially by a first metal wall and a second metal wall and a second cavity defined at least partially by a flat third metal wall and the second metal wall. An internal pressure of the first cavity is lower than an ambient pressure outside the sealed first cavity. The second cavity includes a liquid disposed therein and wick material coupled to an interior surface of the third wall, and the chip package is positioned such that it coupled to the flat third metal wall of the cooling apparatus. 1. A two-tier vapor chamber apparatus comprising:a sealed first cavity defined at least partially by a first metal wall and a second metal wall, wherein an internal pressure of the sealed first cavity is lower than an ambient pressure outside the sealed first cavity; anda sealed second cavity defined at least partially by a flat third metal wall and the second metal wall, wherein the second cavity comprises a liquid disposed therein and wick material coupled to an interior surface of the third wall.2. The apparatus of claim 1 , wherein the sealed first cavity is disposed within the sealed second cavity.3. The apparatus of claim 1 , wherein an internal pressure of the first cavity is below 0.1 torr.4. The apparatus of claim 1 , further comprising a material within the first cavity having a thermal conductivity less than air.5. The apparatus of claim 4 , wherein the material is an aerogel.6. The apparatus of claim 1 , further comprising one or more support structures in the first cavity claim 1 , the support structures in contact with the first metal wall and the second metal wall.7. The apparatus of claim 6 , wherein the support structures are at least partially orthogonal to the first metal wall and second metal wall.8. The apparatus of claim 6 , wherein the ...

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Номер записи: 73
31-03-2022 дата публикации

HEAT RECOVERY FOR DATACENTER COOLING SYSTEMS

Номер: US20220104403A1
Автор: Heydari Ali
Принадлежит:

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an absorption chiller includes a generator vessel to enable removal of heat from fluid returned from at least one computing component of the datacenter. 1. A heat recovery system for datacenter cooling system , comprising:an absorption chiller comprising a generator vessel to enable removal of heat from fluid returned in a datacenter, the fluid associated with at least one computing component of the datacenter.2. The heat recovery system of claim 1 , further comprising:the generator vessel to be maintained at a pressure that is lower than atmospheric pressure and to use the heat to enable an absorber material to separate from a carrier material;a condenser to enable condensation of the absorber material;an evaporative area to enable phase change of the absorber material;an absorber vessel to combine the phase-changed absorber material with a recycled carrier material from the generator vessel.3. The heat recovery system of claim 1 , further comprising:a flow path to enable further cooling of the fluid in an evaporative area of the absorption chiller.4. The heat recovery system of claim 1 , further comprising:an entry path from the heat recovery system, for the fluid, to the at least one computing component or to a cooling distribution unit (CDU), the CDU to enable exchange of a residual heat in the fluid with a primary coolant of a primary cooling loop associated with a chiller located external relative to the datacenter.5. The heat recovery system of claim 1 , further comprising:a secondary coolant associated with a secondary cooling loop and operatively used as the fluid; anda diverter system of flow controllers associated with the secondary cooling loop to enable diversion of the secondary coolant from the secondary cooling loop to the heat recovery system and to enable return of the fluid to a cooling distribution unit (CDU) or to the at least one computing component.6. The ...

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Номер записи: 74
05-05-2022 дата публикации

Joint, Cooling System, and Computer Apparatus

Номер: US20220136634A1
Автор: Gaoliang XIA, Haofeng Chen, Xinhu GONG
Принадлежит: Huawei Technologies Co Ltd

A joint includes a male module and a female module capable of docking with each other. The male module includes a core rod and a sliding cylinder that is slidably sleeved on an outer periphery of the core rod. A first valve port is disposed in the sliding cylinder, and the core rod is provided with a piston head that is in hermetic fit with the first valve port. The female module includes a valve body and a piston. A first channel is disposed in the valve body, the piston is slidably disposed in the first channel, and a second valve port that is in hermetic fit with the piston is disposed in the first channel.

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Номер записи: 75
31-03-2016 дата публикации

CIRCUIT CARD ASSEMBLY AND METHOD OF MANUFACTURING THEREOF

Номер: US20160095199A1
Автор: Chauhan Shakti Singh, Connolly Stuart, HODEN Brian, KIM Joo Han, Shah Binoy Milan
Принадлежит:

A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component. 1. A circuit card assembly comprising:a first printed circuit board;at least one electronic component mounted on said first printed circuit board at a predetermined location;a frame coupled to said first printed circuit board; and a first plate extending over at least a portion of said first printed circuit board;', 'a heat pipe coupled to said first plate; and', 'a thermally conductive member positioned between said at least one electronic component and said heat pipe, wherein said thermally conductive member is selectively mounted at predetermined locations along said first plate based on the predetermined location of said at least one electronic component., 'a heat transfer assembly coupled to said frame, wherein said heat transfer assembly comprises2. The assembly in accordance with claim 1 , wherein said heat pipe is partially embedded within said first plate thereby defining an exposed surface of said heat pipe claim 1 , wherein said exposed surface is coupled to said thermally conductive member.3. The assembly in accordance with claim 1 , wherein said heat pipe comprises an evaporator portion and a condenser portion claim 1 , said evaporator portion positioned adjacent said at least one electronic component and said ...

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Номер записи: 76
31-03-2016 дата публикации

Managing heat transfer for electronic devices

Номер: US20160095254A1
Автор: Arvind K. Sinha, Karl Stathakis, Kevin M. O'Connell, Phillip V. Mann
Принадлежит: International Business Machines Corp

An apparatus for cooling a heat-producing electronic device is disclosed. The apparatus may include a thermally conductive vessel to mate with and contain a working fluid in contact with the heat-producing electronic device. A bottom side of the thermally conductive vessel may include a sealing surface defining an aperture and configured to mate with, and inside a perimeter of, a top surface of the heat-producing electronic device. The thermally conductive vessel may also include an evaporative cavity formed by mating the thermally conductive vessel with the heat-producing electronic device, and having a wall that is the top surface of the heat-producing electronic device and a wall that is an interior surface of the thermally conductive vessel. The thermally conductive vessel may also include a condensing cavity adjoining the evaporative cavity, to receive heat by condensing the working fluid from a vapor state to a liquid state.

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Номер записи: 77
05-05-2022 дата публикации

LOOP THERMOSYPHON DEVICES AND SYSTEMS, AND RELATED METHODS

Номер: US20220142001A1
Автор: Pokharna Himanshu, Tan Gin Hwee
Принадлежит:

A loop thermosyphon can combine the best of heat-pipes and traditional liquid-cooling systems that include a mechanical pump. A disclosed heat-transfer device includes a first heat-transfer component and a second heat-transfer component fluidly coupled with each other by a first conduit and a second conduit. A first manifold is positioned in the first heat-transfer component and defines a first plurality of liquid pathways. The first manifold fluidly couples with the first conduit. A second manifold is also positioned in the first heat-transfer component and defines a second plurality of liquid pathways fluidly coupled with and extending from the first plurality of liquid pathways. The second manifold further defines a plurality of boiling channels, a plurality of accumulator channels and a vapor manifold. The boiling channels extend transversely relative to and are fluidly coupled with the second plurality of liquid pathways. The plurality of accumulator channels extends transversely relative to and are fluidly coupled with the plurality of boiling channels. The vapor manifold is configured to collect vapor from one or more of the plurality of boiling channels, one or more of the plurality of accumulator channels, or both. The first heat-transfer component further defines an outlet fluidly coupling the vapor manifold with the second conduit. Electrical devices incorporating such a heat-transfer device also are disclosed, as well as associated methods.

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Номер записи: 78
29-03-2018 дата публикации

Server Cooling System Capable of Performing a Two-Phase Immersion Typed Heat Dissipation Process

Номер: US20180092251A1
Автор: CHEN HUNG-JU, Tung Kai-Yang
Принадлежит:

A server cooling system includes a container, a heat dissipation device, and a housing. The container is used for containing non-conductive fluid. An electronic device is completely soaked in the non-conductive fluid to cool down. The heat dissipation device is disposed above the container for cooling vapor generated from the non-conductive fluid. The housing covers the container and the heat dissipation device for forming an enclosed space. When the temperature of the electronic device is higher than a vaporization temperature of the non-conductive fluid, the non-conductive fluid is vaporized gradually. After the vapor reaches the heat dissipation device, the vapor is condensed to become condensed fluid. The condensed fluid is then dropped to the container so as to cool the non-conductive fluid to be below the vaporization temperature. 1. A server cooling system , comprising:a container configured to contain non-conductive fluid for cooling down an electronic device soaked in the non-conductive fluid;a heat dissipation device disposed above the container and configured to cool vapor generated from the non-conductive fluid; anda housing configured to enclose the container and the heat dissipation device in order to form an enclosed space;wherein when a temperature of the electronic device exceeds a vaporization temperature of the non-conductive fluid, the non-conductive fluid is vaporized gradually, the vapor is condensed to become condensed fluid after the vapor reaches the heat dissipation device, and the condensed fluid is dropped to the container so as to cool the non-conductive fluid to be below the vaporization temperature and to stabilize a depth of the non-conductive fluid.2. The system of claim 1 , wherein the non-conductive fluid is non-conductive refrigerant claim 1 , the heat dissipation device is a condenser claim 1 , and the condenser comprises a plurality of metal fins.3. The system of claim 1 , further comprising a liquidometer disposed on the ...

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Номер записи: 79
21-03-2019 дата публикации

LOOP HEAT PIPE AND MANUFACTURING METHOD FOR LOOP HEAT PIPE AND ELECTRONIC DEVICE

Номер: US20190090386A1
Автор: Abe Tomoyuki, Shioga Takeshi
Принадлежит: FUJITSU LIMITED

A loop heat pipe includes an evaporator; a condenser; a first pipe configured to connect the evaporator and the condenser and in which vapor-phase working fluid flows; and a second pipe configured to connect the condenser and the evaporator and in which liquid-phase working fluid flows, wherein the evaporator, the condenser, the first pipe, and the second pipe is joined to a first tabular and a second tabular, respectively, the first tabular includes a first recessed section in a region to be formed as the evaporator and a region to be formed as a condensation pipe configuring the condenser and the second tabular includes a second recessed section in the region to be formed as the evaporator, the region to be formed as the condensation pipe. 1. A loop heat pipe comprising:an evaporator;a condenser;a first pipe configured to connect the evaporator and the condenser and in which vapor-phase working fluid flows; anda second pipe configured to connect the condenser and the evaporator and in which liquid-phase working fluid flows, whereinthe evaporator, the condenser, the first pipe, and the second pipe is configured to join a first tabular and a second tabular,the first tabular includes a first recessed section in a region to be formed as the evaporator, a region to be formed as a condensation pipe configuring the condenser, a region to be formed as the first pipe, and a region to be formed as the second pipe and includes, in the region to be formed as the evaporator, grooves capable of generating a capillary force,the second tabular includes a second recessed section in the region to be formed as the evaporator, the region to be formed as the condensation pipe, the region to be formed as the first pipe, and the region to be formed as the second pipe, anda porous structure is provided in the second recessed section.2. The loop heat pipe according to claim 1 , wherein the porous structure is provided in the entire second recessed section.3. The loop heat pipe according ...

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Номер записи: 80
30-03-2017 дата публикации

COOLING SYSTEM WITH DESICCANT DEHUMIDIFICATION

Номер: US20170094841A1
Автор: CZAMARA MICHAEL PHILLIP, EICHELBERG JOHN WILLIAM, MORALES OSVALDO P., TOWNER RICHARD CHADWICK
Принадлежит: Amazon Technologies, Inc.

A system for removing heat from electrical systems includes a dehumidification device including a desiccant, an evaporative cooling device, air moving devices, and an air flow control devices. The air moving device moves air through the dehumidification device, the evaporative cooling device, and the electrical systems. The air flow control device controls a rate of flow through the dehumidification device. 123-. (canceled)24. A data center , comprising:rack-mounted computing devices that include heat producing components; and one or more desiccant wheels;', 'one or more evaporative cooling devices downstream from at least one of the desiccant wheels; and', 'one or more air moving devices;, 'a cooling system, comprising at least one of the air moving devices is configured to move air through at least one of the desiccant wheels, at least of the one or more evaporative cooling devices, and at least one of the heat producing components of the rack-mounted computing devices; and', 'the cooling system is configured to transfer heat from the rack-mounted computing devices to at least a portion of air being moved through the at least one of the desiccant wheels to promote reactivation of the at least one of the desiccant wheels., 'wherein25. The data center of claim 24 , further comprising:one or more air flow control devices, wherein at least one of the air flow control devices is configured to control a rate of air flow through the at least one of the desiccant wheels.26. The data center of claim 24 , wherein the one or more evaporative cooling devices are configured to evaporate a liquid into a stream of air flowing through the one or more evaporative cooling devices to cool the stream of air.27. The data center of claim 24 , wherein the cooling system is configured such that at least a portion of the stream of air that flows through the one or more evaporative cooling devices flows through at least one of the desiccant wheels upstream of the one or more evaporative ...

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Номер записи: 81
12-05-2022 дата публикации

COOLING MODULE

Номер: US20220146206A1
Автор: Horng Alex, Liao Chin-Chun
Принадлежит:

A cooling device includes at least one heat pipe and a fin unit. Each of the at least one heat pipe includes a condensing section between a first end and a second end of the heat pipe, a first vaporization section between the condensing section and the first end of the heat pipe, and a second vaporization section between the condensing section and the second end of the heat pipe. The condensing section intercommunicates with the first vaporization section and the second vaporization section. The fin unit is mounted to the condensing section of each of the at least one heat pipe. 1. A cooling device comprising:at least one heat pipe, wherein each of the at least one heat pipe includes a condensing section between a first end and a second end of the heat pipe, a first vaporization section between the condensing section and the first end of the heat pipe, and a second vaporization section between the condensing section and the second end of the heat pipe, and wherein the condensing section intercommunicates with the first vaporization section and the second vaporization section;a fin unit mounted to the condensing section of each of the at least one heat pipe; anda connector connected to the first end and the second end of each of the at least one heat pipe, and wherein an interior of the connector intercommunicates with the first vaporization section and the second vaporization section of each of the at least one heat pipe.2. The cooling device as claimed in claim 1 , wherein the condensing section forms at least one U-shaped portion partially protruding beyond the fin unit.3. The cooling device as claimed in claim 1 , further comprising a heat conducting board in thermal connection to the first vaporization section and the second vaporization section of each of the at least one heat pipe.4. The cooling device as claimed in claim 2 , further comprising a heat conducting board in thermal connection to the first vaporization section and the second vaporization section ...

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Номер записи: 82
16-04-2015 дата публикации

Phase Change Module and Electronic Device Mounted with Same

Номер: US20150103486A1
Автор: Fumio Takeda, Shigemasa Sato, Shigeyasu Tsubaki, Takayuki Fujimoto, Yoshihiro Kondou
Принадлежит: HITACHI LTD

To provide a phase change module as a cooling system capable of saving energy and miniaturizing of the cooling system utilizing a thermo siphon, and an electronic device suitable to mounting such a phase change module. The phase change module 300 includes a jacket case 312 attached with an evaporator surface 311 with the evaporator surface 311 being arranged on a heat generating body, a radiator case 321 attached with cooling fins (radiator) 322 arranged at a position departing from the heat generating body, and a connecting plate 330 that connects the jacket case 312 and the radiator case 321 , in which holes are bored in the connecting plate 330 at a position where the jacket case 312 and the radiator case 321 overlap.

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Номер записи: 83
12-05-2022 дата публикации

THERMAL MANAGEMENT SYSTEM WITH DUAL-USE SERIAL THERMAL ENERGY STORAGE FOR SYSTEM SIZE REDUCTION

Номер: US20220151102A1
Автор: Snyder Douglas J.
Принадлежит: Rolls-Royce North American Technologies Inc.

Thermal management systems for cooling high-power, low-duty-cycle thermal loads by rejecting heat from the thermal loads to the ambient environment are provided. The thermal management systems include a two-phase pump loop in fluid communication with a vapor compression system loop, evaporators disposed in parallel between the two-phase pump loop and the vapor compression system loop, and a thermal energy storage loop including a cold-temperature tank and a warm-temperature tank thermally coupled to the two-phase pump loop and the vapor-compression system loop. Methods of transferring heat from one or more thermal loads to an ambient environment are also provided. 1. A thermal management system , comprising:a thermal energy storage (“TES”) loop comprising a TES medium disposed in the TES loop, a TPPL condenser, a first tank, a first liquid pump, a first TES evaporator, a second tank, and a second liquid pump; anda primary fluid flow path comprising a primary fluid disposed in the primary fluid flow path, a two-phase pump loop (“TPPL”), a vapor compression system (“VCS”) loop, an accumulator, and a first-TES-evaporator branch; andwherein the TPPL is configured to cool a primary thermal load, the TPPL comprising a TPPL liquid pump and the TPPL condenser, the TPPL condenser configured to transfer heat from the primary fluid in the TPPL to the TES medium;wherein the VCS loop is configured to transfer heat from the primary fluid in the primary fluid flow path to an ambient environment via a VCS condenser;wherein the accumulator is configured to separate the primary fluid received from the TPPL and the VCS loop into a vapor-phase primary fluid and a liquid-phase primary fluid;wherein the first-TES-evaporator branch comprises the first TES evaporator and is in fluid communication with the TPPL downstream of the accumulator and with the VCS loop upstream of the compressor, wherein the first TES evaporator is configured to transfer heat from the TES medium to the VCS loop; ...

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Номер записи: 84
13-04-2017 дата публикации

Multi-chamber heat sink module

Номер: US20170105313A1
Автор: Brett A. LINDEMAN, Mark A. Rodarte, Robert A. Buchanan, Timothy A. Shedd
Принадлежит: eBullient LLC

A multi-chamber heat sink module can provide fluid cooling of one or more heat providing surfaces. The module can include a first plurality of orifices fluidly connecting a first inlet chamber to a first outlet chamber. The first outlet chamber can be configured to be bounded by a portion of a heat providing surface. The first plurality of orifices can be configured to deliver a first plurality of jet streams of coolant into the first outlet chamber and against the portion of the heat providing surface when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the first inlet chamber. The heat sink module can include a second inlet chamber fluidly connected to a first outlet passage and a second plurality of orifices fluidly connecting the second inlet chamber to a second outlet chamber.

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Номер записи: 85
04-04-2019 дата публикации

Thermal vapor chamber arrangement

Номер: US20190103290A1
Автор: Chih C. Shih, Ernesto Ferrer Medina, Niru Kumari, Sergio Escobar-Vargas
Принадлежит: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

In some examples, a multiple chip module (MCM) includes a heat sink; a circuit board; a first chip secured to a first location on the circuit board; a first vapor chamber thermally coupled to the first chip to pass heat generated by the first chip to the heat sink; a second chip secured to a second location on the circuit board; and a second vapor chamber thermally coupled to the second chip to pass heat generated by the second chip to the heat sink. In some examples, a portion of the second vapor chamber is positioned between a portion of the first vapor chamber and the heat sink. In some examples, the first vapor chamber is substantially thermally insulated from the second vapor chamber.

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Номер записи: 86
29-04-2021 дата публикации

HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE

Номер: US20210127527A1
Автор: CHEN SHIN-WEN, DING SHENG-JIE, LI JING-WEI, SONG JIAN-CHAO
Принадлежит:

A heat dissipation structure mounted in an electronic device includes a base body defining a seal chamber, a heat transfer medium in the seal chamber, and a connecting element. The seal chamber includes interconnected evaporation and condensation portions. The connecting element is coupled to the evaporation portion and a camera module of the electronic device. Heat generated by the camera module is transferred to the evaporation portion via the connecting element, the heat transfer medium turns to gas, and the gas flows into the condensation portion and condenses, dissipating the heat to the outside of the electronic device. The disclosure further provides an electronic device using the heat dissipation structure. 1. A heat dissipation structure comprising:a base body defining a seal chamber, the seal chamber comprising an evaporation portion and a condensation portion communicating with the evaporation portion;a heat transfer medium sealed in the seal chamber; anda connecting element coupled to the evaporation portion and configured to fix a heating element;wherein heat generated by the heating element is transferred to the evaporation portion via the connecting element, the heat transfer medium in the evaporation portion becomes gaseous as the heat transfer medium absorbs heat, the gaseous heat transfer medium flows into the condensation portion and condenses to dissipate the heat to an exterior of the condensation portion.2. The heat dissipation structure of claim 1 , wherein the base body carries a capillary structure on an inner wall.3. The heat dissipation structure of claim 1 , wherein the heat transfer medium is water claim 1 , methanol claim 1 , or ethanol.4. The heat dissipation structure of claim 1 , wherein material of the heat dissipation structure is metal.5. An electronic device comprising:a first heating element; and a first base body defining a first seal chamber, the first seal chamber comprising a first evaporation portion and a first ...

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Номер записи: 87
27-04-2017 дата публикации

Heat dissipation structure and water block having the same

Номер: US20170115071A1
Автор: Chun-Hung Lin
Принадлежит: Taiwan Microloops Corp

A heat dissipation structure and water block having the same are provided in the present disclosure. The heat dissipation structure includes a vapor chamber and a heat dissipation component. A through opening is disposed on and through the vapor chamber, and the vapor chamber includes a heated surface. The heat dissipation component includes a base plate and multiple fins extended from the base plate, and the base plate includes a bottom surface. The heat dissipation component is configured corresponding to the through opening, and a coplanar structure is formed by the bottom surface and the heated surface. Heat conductive and heat dissipation performances of the heat dissipation structure and the water block are thereby improved.

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Номер записи: 88
13-05-2021 дата публикации

HEAT DISSIPATION DEVICE AND ROBOT USING SAME

Номер: US20210138669A1
Автор: Chang Hung-Sheng, Shao Chi-Huan
Принадлежит:

A heat dissipation device and a robot using the same are provided. The heat dissipation device comprises a porous material layer, a transporting tube and a liquid. The at least one porous material layer is disposed on a housing surface of a robot. The porous material layer has an evaporation surface and an accommodation space. The evaporation surface is disposed through and exposed from the housing surface. The evaporation surface and the accommodation space are in fluid communication with each other. The transporting tube is connected to the at least one porous material layer and in fluid communication with the accommodation space. The liquid is transported into the at least one accommodation space through the transporting tube and exposed from the evaporation surface. Thus, the liquid evaporates at the evaporation surface to reduce a temperature of the housing surface of the robot via convection and evaporation. 1. A heat dissipation device comprising:at least one porous material layer disposed on a housing surface of a robot, wherein the at least one porous material layer has at least one evaporation surface and at least one accommodation space, the at least one evaporation surface is disposed through and exposed from the housing surface, and the at least one evaporation surface and the at least one accommodation space are in fluid communication with each other;a transporting tube connected to the at least one porous material layer and in fluid communication with the at least one accommodation space; anda liquid transported into the at least one accommodation space through the transporting tube and exposed through the evaporation surface, wherein the liquid evaporates at the at least one evaporation surface to reduce a temperature of the housing surface of the robot.2. The heat dissipation device according to claim 1 , wherein the at least one porous material layer has an average pore diameter and a porosity claim 1 , the average pore diameter is less than 0.1 mm ...

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Номер записи: 89
18-04-2019 дата публикации

SYSTEMS AND METHODS FOR PROVIDING COOLING TO A HEAT LOAD

Номер: US20190113247A1
Автор: Gerber Manfred, Ghadiri Moghaddam Davood, LePoudre Philip Paul
Принадлежит:

Conditioning systems and methods for providing cooling to a heat load can include an evaporative cooler arranged in a scavenger plenum with a pre-cooler upstream and a recovery coil downstream of the evaporative cooler. Outdoor or scavenger air can be conditioned in the evaporative cooler such that the conditioned scavenger air can provide cooling to a cooling fluid circulating through the recovery coil. The reduced-temperature cooling fluid can provide liquid cooling or air cooling for an enclosed space (for example, a data center) or for one or more devices that are enclosed or open to the atmosphere. Given the design and arrangement of the pre-cooler, evaporative cooler and recovery coil in the plenum, the system can operate in multiple modes. The pre-cooler can be configured to circulate a cooling fluid to condition the scavenger air. The pre-cooler fluid circuit can be coupled or de-coupled from a process cooling fluid circuit. 151-. (canceled)52. A conditioning system for providing cooling to a heat load , the conditioning system comprising: a scavenger plenum having an air inlet and outlet, the scavenger plenum configured to direct scavenger air in an air flow path from the air inlet to the air outlet;', 'an evaporative cooler arranged inside the scavenger plenum in the air flow path and having a first cooling fluid circuit configured to circulate a first cooling fluid through the evaporative cooler, the evaporative cooler configured to selectively evaporate a portion of the first cooling fluid;', 'a first cooling component arranged inside the scavenger plenum between the air inlet and the evaporative cooler, the first cooling component configured to selectively condition the scavenger air flowing through the first cooling component; and', 'a second cooling component arranged inside the scavenger plenum between the evaporative cooler and the air outlet and having a second cooling fluid circuit configured to circulate a second cooling fluid through the second ...

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Номер записи: 90
09-04-2020 дата публикации

Leak detection in a fluid compression system

Номер: US20200110000A1
Автор: Robert J. Roth
Принадлежит: Trane International Inc

Methods and systems for leak detection in a fluid compression system using a purge system are disclosed herein. In an embodiment, a method for detecting leaks includes determining, during a period of vacuum, a purge exhaust rate of non-condensables from a purge system integrated with a chiller unit. The method includes determining a differential pressure, the differential pressure based on a vacuum side pressure of the chiller unit, where the vacuum side pressure includes at least one of a pressure of a condenser and pressure of an evaporator. The method includes calculating, via a controller, the purge exhaust rate and the differential pressure to identify a leak size based at least in part on the purge exhaust rate.

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Номер записи: 91
27-04-2017 дата публикации

Heat Dissipation from ACB Toes

Номер: US20170117103A1
Автор: Kennelly Patrick
Принадлежит:

A heat dissipation apparatus, system and method for an air circuit breaker (ACB) switchgear has at least one pair of primary contact toes constructed and arranged to connect to a terminal of the circuit breaker. A bus bar joint is connected to the primary contact toes. The heat dissipation apparatus comprises an evaporator clamped to the primary contact toes. A condenser is located at a higher elevation than the evaporator and at least two electrically isolating pipes fluidly connect the evaporator with the condenser. A dielectric fluid in the evaporator can be heated to a vapour state, with one of the pipes transferring the vapour to the condenser and the second pipe returning the condensed dielectric fluid back to the evaporator for cooling the at least one pair of primary contact toes. 1. A heat dissipation apparatus for an air circuit breaker (ACB) switchgear having at least one pair of primary contact toes constructed and arranged to connect to a terminal of the circuit breaker , with a bus bar joint being connected to the primary contact toes , the heat dissipation apparatus comprising:an evaporator constructed and arranged to be clamped to the primary contact toes, a condenser located at a higher elevation than the evaporator, at least two electrically isolating pipes fluidly connecting the evaporator with the condenser, and a dielectric fluid in the evaporator adapted to be heated to a vapour state, with one of the pipes being constructed and arranged to transfer the vapour to the condenser and the second pipe being arranged to return the condensed dielectric fluid back to the evaporator for cooling the at least one pair of primary contact toes.2. A heat dissipation apparatus as claimed in claim 1 , wherein the condenser includes a plurality of fins in spaced relation claim 1 , with the fins being arranged to transfer heat from the condenser to surrounding air by natural convection.3. A heat dissipation apparatus as claimed in claim 2 , wherein the fins of ...

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Номер записи: 92
27-04-2017 дата публикации

REFRIGERATION SYSTEM AND COOLING METHOD OF ELECTRONIC CONTROL UNIT THEREOF

Номер: US20170118872A1
Автор: HUANG Jianxin, Stark Michael A., Wang Lei, Yan Chaoqun
Принадлежит:

A refrigeration system, including: an electronic control unit, including a housing and an electronic device arranged in the housing; a refrigeration loop, including a compressor, a condenser, a primary throttling element, and an evaporator sequentially connected through a pipeline and forming a closed loop; and an electronic device cooling branch connected into the refrigeration loop from the condenser, and connected back to the refrigeration loop from the evaporator; the electronic device cooling branch including an electronic device cooling unit, a secondary throttling element, and an electromagnetic valve; and the electronic device cooling unit being arranged in the housing and spaced apart from the electronic device, for reducing the temperature and humidity of the electronic device and an environment in the housing. 1. A refrigeration system , including:an electronic control unit, including a housing and an electronic device arranged in the housing;a refrigeration loop, including a compressor, a condenser, a primary throttling element, and an evaporator sequentially connected through a pipeline and forming a closed loop; andan electronic device cooling branch connected into the refrigeration loop from the condenser, and connected back to the refrigeration loop from the evaporator; the electronic device cooling branch including an electronic device cooling unit, a secondary throttling element, and an electromagnetic valve; and the electronic device cooling unit being arranged in the housing and spaced apart from the electronic device, for reducing the temperature and humidity of the electronic device and an environment in the housing.2. The refrigeration system according to claim 1 , wherein the electronic device cooling unit includes an air-refrigerant heat exchanger and a fan that provides forced air convection claim 1 , wherein the air-refrigerant heat exchanger is connected in parallel to the primary throttling element.3. The refrigeration system according ...

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Номер записи: 93
27-04-2017 дата публикации

Cooling Systems For Small Equipment Rooms And Methods Of Cooling Small Equipment Rooms

Номер: US20170118874A1
Автор: Dolcich Benedict J., Jain Gaurav, Lin Wanlai, VOIGT Tyler
Принадлежит: Liebert Corporation

A cooling system for an equipment closet in a building has a direct expansion cooling circuit. The cooling system has two basic modes of operation. A first mode where the direct expansion cooling circuit is off and transfer air from an area of the building outside the equipment closet is used to cool the interior of the equipment closet without any cooling provided by the direct expansion cooling circuit and a second mode where the direct expansion cooling circuit is on and provides direct expansion cooling that is used to cool the interior of the equipment closet. 1. A method of cooling an equipment closet in a building with a cooling system , the cooling system having a direct expansion cooling circuit that includes a compressor , a condenser having a condenser coil and a condenser fan , an expansion device and an evaporator having an evaporator coil and an evaporator fan that are arranged in the direct expansion cooling circuit , at least the evaporator disposed in a cabinet in the equipment closet , the method comprising:operating the cooling system in a first mode of operation with the direct expansion cooling circuit off to cool an interior of the equipment closet with transfer air drawn in from an area of the building outside of the equipment closet and operating the cooling system in a second mode of operation with the direct expansion cooling circuit running to cool the interior of the equipment closet with air cooled by the direct expansion cooling circuit; andcontrolling operation of the cooling system with a controller by having the controller operate the cooling system in the first mode of operation when the controller determines that operating the cooling system in the first mode of operation will meet a cooling demand due to heat load in the interior of the equipment closet and having the controller operate the cooling system in the second mode of operation when the controller determines that operating the cooling system in the first mode of operation ...

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Номер записи: 94
09-04-2020 дата публикации

SYSTEM AND METHOD FOR COOLING ELECTRONIC DEVICES

Номер: US20200113083A1
Автор: Ortega Alfonso, Schon Steven G.
Принадлежит: Villanova University

A system and a method are provided for cooling heat-generating devices. A plurality of heat exchangers are in thermal communication with a plurality electronic devices. Each of the plurality of heat exchangers includes at least one channel configured to receive and circulate a working liquid. Each of the plurality of heat exchangers may be a cold plate, an air cooler, and a combination thereof. The plurality of heat exchangers include at least one cold plate in direct contact with at least one of the plurality of electronic device. At least one air cooler circulates air and convectively absorbs heat from the remaining electronic devices. 1. A system for cooling heat-generating electronic devices , comprising:a plurality of heat exchangers in thermal communication with a plurality electronic devices, each of the plurality of heat exchangers comprising at least one channel configured to receive and circulate a working liquid,wherein the plurality of heat exchangers include at least one cold plate configured to contact at least one of the plurality of electronic device,and at least one air cooler configured to circulate air to and convectively absorb heat from one or more electronic devices.2. The system of claim 1 , wherein the plurality of heat exchangers and a plurality electronic devices are disposed in an enclosure.3. The system of claim 1 , wherein the plurality of heat exchangers are in a closed-loop circulation of the working fluid claim 1 , and the at least one cold plate and at least one air cooler are connected in parallel.4. The system of claim 1 , wherein the system is in a closed loop and the working fluid is in gravity-driven circulation.5. The system of claim 1 , further comprising a pump configured to circulate the working liquid to the plurality of heat exchangers.6. The system of claim 1 , wherein the working liquid is configured to remain in liquid form claim 1 , each of the plurality of heat exchangers is configured to be liquid-cooled heat ...

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Номер записи: 95
03-05-2018 дата публикации

LEAK DETECTION IN A FLUID COMPRESSION SYSTEM

Номер: US20180120194A1
Автор: ROTH Robert J.
Принадлежит:

Methods and systems for leak detection in a fluid compression system using a purge system are disclosed herein. In an embodiment, a method for detecting leaks includes determining, during a period of vacuum, a purge exhaust rate of non-condensables from a purge system integrated with a chiller unit. The method includes determining a differential pressure, the differential pressure based on a vacuum side pressure of the chiller unit, where the vacuum side pressure includes at least one of a pressure of a condenser and pressure of an evaporator. The method includes calculating, via a controller, the purge exhaust rate and the differential pressure to identify a leak size based at least in part on the purge exhaust rate. 1. A method for detecting leaks , comprising:determining, during a period of vacuum, a purge exhaust rate of non-condensables from a purge system integrated with a chiller unit;determining a differential pressure, the differential pressure based on a vacuum side pressure of the chiller unit, wherein the vacuum side pressure includes at least one of a pressure of a condenser and pressure of an evaporator; andcalculating, via a controller, the purge exhaust rate and the differential pressure to identify a leak size based at least in part on the purge exhaust rate.2. The method of claim 1 , further comprising determining an expected purge rate based on the purge exhaust rate for a vacuum side pressure of the chiller circuit upon termination of the period of vacuum.3. The method of claim 1 , wherein a reduction of the purge exhaust rate indicates the leak size is associated with a vacuum side pressure of the chiller unit upon termination of the period of vacuum.4. The method of claim 1 , wherein the differential pressure includes a condenser differential pressure claim 1 , evaporator differential pressure claim 1 , and a chiller unit differential pressure claim 1 , each of which is in reference to surrounding atmospheric pressure.5. The method of claim 1 , ...

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Номер записи: 96
12-05-2016 дата публикации

THIN FILM SYSTEMS AND METHODS FOR USING AND MAKING SAME

Номер: US20160129367A1
Автор: Wang Hao
Принадлежит:

Systems and methods for generating a thin film of a fluid are described. In an embodiment, a fluid support structure may be configured to receive a fluid, such as water, at a top surface and to support the fluid over at least a portion of the top surface. Channels may be formed in the top surface of the fluid support structure. Wiper blades may be configured to move over the top surface in contact with at least a portion of the fluid to form the fluid into a thin film. The wiper blades may include protrusions corresponding to the channels. As the wiper blades move over the top surface, the protrusions may move within the channels forming a thin film of the fluid within the channels. According to some embodiments, the fluid support structure may be configured as an evaporation surface configured to facilitate the evaporation of the fluid. 1. A thin film system configured to form a thin film of a fluid to promote evaporation of the fluid , the system comprising:an evaporation structure configured to facilitate evaporation of a fluid on a top surface thereof and within at least one channel formed within the top surface; andat least one wiper blade comprising at least one protrusion corresponding to the at least one channel, the at least one wiper being configured to move over the top surface with at least a portion of the at least one protrusion moving within the at least one channel, wherein the at least one wiper blade and the at least one protrusion are in contact with at least a portion of the fluid to form a thin film of the fluid on the top surface and within the at least one channel.2. The system of claim 1 , wherein the fluid comprises at least one of water claim 1 , ammonia claim 1 , refrigeration fluids claim 1 , hydrocarbons claim 1 , methanol claim 1 , ethanol claim 1 , petroleum distillates claim 1 , benzene claim 1 , and toluene.3. The system of claim 1 , wherein the thin film system is configured as part of one of a heat pipe claim 1 , a condenser claim ...

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Номер записи: 97
04-05-2017 дата публикации

COOLING SYSTEMS FOR COOLING ELECTRONIC COMPONENTS

Номер: US20170127563A1
Автор: CHAINER Timothy J., PARIDA Pritish R.
Принадлежит:

A first fluid is heated in a preheating section and passes into an evaporator coupled to a first electronic component. Operational heat from the first electronic component vaporizes the first fluid. A second fluid passes into a cold plate coupled to a second electronic component. Operational heat from the second electronic component heats the second fluid. First and second portions of the second fluid output from the cold plate pass through first and second routes, respectively. The first portion becomes thermally coupled to the preheating section and the second portion bypasses the preheating section. Heat transfer from the first portion to the preheating section causes the heating of the first fluid in the preheating section. 1. A system comprising:an evaporator thermally coupled to a first set of electronic components such that operational heat generated by the first set of electronic components causes at least partial vaporization of a first fluid as the first fluid passes through the evaporator;a preheating section through which the first fluid passes before entering the evaporator;a cold plate thermally coupled to a second set of electronic components such that operational heat generated by the second set of electronic components causes an increase in a temperature of a second fluid as the second fluid passes through the cold plate;a first route through which a first portion of the second fluid output from the cold plate passes, wherein the first portion becomes thermally coupled to the preheating section such that heat transfer from the first portion to the preheating section causes an increase in a temperature of the first fluid as the first fluid passes through the preheating section; anda second route through which a second portion of the second fluid output from the cold plate passes, wherein the second portion bypasses the preheating section.2. The system of further comprising:an adjustable valve configured to divide the second fluid output from the cold ...

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Номер записи: 98
04-05-2017 дата публикации

LIQUID LOOP COOLING APPARATUS, ELECTRONIC INSTRUMENT, AND METHOD FOR MANUFACTURING LIQUID LOOP COOLING APPARATUS

Номер: US20170127564A1
Автор: Aoki Nobumitsu, KUBO Hideo, SO Tsuyoshi, UZUKA Yoshinori
Принадлежит: FUJITSU LIMITED

A liquid loop cooling apparatus includes: an evaporator thermally coupled to a heating element; a condenser configured to be cooled by an airflow; a pump configured to circulate a refrigerant between the evaporator and the condenser; a first piping configured to couple the evaporator and the condenser; a second piping configured to couple the condenser and the pump; and a third piping configured to couple the pump and the evaporator, wherein the first piping is arranged on a destination side of the airflow, and the second piping is arranged on a source side of the airflow. 1. A liquid loop cooling apparatus comprising:an evaporator thermally coupled to a heating element;a condenser configured to be cooled by an airflow;a pump configured to circulate a refrigerant between the evaporator and the condenser;a first piping configured to couple the evaporator and the condenser;a second piping configured to couple the condenser and the pump; anda third piping configured to couple the pump and the evaporator,wherein the first piping is arranged on a destination side of the airflow, and the second piping is arranged on a source side of the airflow.2. The liquid loop cooling apparatus according to claim 1 , wherein the evaporator is arranged on a leeward side of the condenser.3. The liquid loop cooling apparatus according to claim 1 , wherein the pump is arranged at a side of claim 1 , above claim 1 , or below the condenser when viewed from the source side of the airflow.4. The liquid loop cooling apparatus according to claim 1 , wherein the refrigerant changes in state from liquid to gas by heat transmitted from the heating element claim 1 , and is cooled by the airflow and changes in state from gas to liquid inside the condenser.5. The liquid loop cooling apparatus according to claim 1 , wherein the first piping claim 1 , the second piping claim 1 , and the third piping are each made of metal.6. An electronic instrument comprising:a circuit board equipped with an electronic ...

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Номер записи: 99
04-05-2017 дата публикации

COOLING STRUCTURE FOR ELECTRONIC COMPONENTS AND ELECTRIC COMPRESSOR

Номер: US20170127566A1
Автор: Imura Akihiro, TAKEMOTO Tsuyoshi
Принадлежит:

A cooling structure for electronic components includes: a case having a refrigerant intake port and a refrigerant channel through which a refrigerant introduced from the refrigerant intake port flows, the refrigerant channel being formed by a wall section; a cooling section having a plurality of flat surfaces formed inside of the case in a manner to interpose the wall section between the flat surfaces and the refrigerant channel; and a plurality of electronic components arranged inside of the case and each of which is in contact with one of the flat surfaces. Each of the electronic components is cooled by the refrigerant via a corresponding flat surface of the flat surfaces and the wall section. 1. A cooling structure for electronic components comprising:a case having a refrigerant intake port and a refrigerant channel through which a refrigerant introduced from the refrigerant intake port flows, the refrigerant channel being formed by a wall section;a cooling section having a plurality of flat surfaces formed inside of the case in a manner to interpose the wall section between the flat surfaces and the refrigerant channel; anda plurality of electronic components arranged inside of the case and each of which is in contact with one of the flat surfaces, whereineach of the electronic components is cooled by the refrigerant via a corresponding flat surface of the flat surfaces and the wall section, a side wall having a cylindrical shape;', 'a bottom section arranged on one side in an axial direction of the side wall; and', 'a projected section arranged on the one side in the axial direction of the side wall and projected from the bottom section to the other side in the axial direction, the projected section closing the one side in the axial direction of the side wall with the bottom section,, 'the case includesthe cooling structure for the electronic components further comprises: a plate arranged on the one side in the axial direction with respect to the case to cover ...

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Номер записи: 100