Substrate preparation method for enhancing binding force between Cu wiring layer and ABF film

The invention discloses a substrate preparation method for enhancing the binding force of a Cu wiring layer and an ABF film, and belongs to the field of integrated circuit packaging. Coating PR glue I on the Si carrier plate, exposing and developing, electroplating a Cu wiring layer in the electroplating liquid I, and removing the PR glue I; coating PR glue II, exposing and developing, electroplating the nanoneedle array in the electroplating liquid II, and removing the PR glue II; coating PR glue III, exposing and developing, electroplating a Cu column in the electroplating liquid I, and removing the PR glue III; heating the laminated ABF film, curing, and grinding the ABF film until the Cu column is exposed; repeating the processes of electroplating, laminating and grinding the ABF membrane until the required number of layers is reached; and grinding to remove the Si carrier plate, and finally manufacturing a bonding pad and cutting to obtain the packaging substrate. The signal transmission ...