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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 15. Отображено 15.
31-05-2019 дата публикации

THERMALLY CURABLE RESIN COMPOSITION, INSULATING FILM, INTER-LAYER INSULATING FILM, MULTILAYER WIRING BOARD, AND SEMICONDUCTOR DEVICE

Номер: WO2019103086A1
Автор: SATO Junya, KUROKAWA Tsuyoshi, YOSHIDA Masaki, TERAKI Shin
Принадлежит:

The purpose of the present invention is to provide a polyphenylene ether (PPE)-based thermally curable resin composition that has excellent high-frequency characteristics and heat resistance reliability (small variation in dielectric tangent (tanδ)), and has excellent resistance to soldering heat. This thermally curable resin composition is characterized by including: (A) polyphenylene ether having an unsaturated double bond at an end and having a number average molecular weight of 800-4500; (B) a phenolic antioxidant having a melting point of 200°C or above; and (C) a thermoplastic elastomer.

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Номер записи: 1
15-09-2011 дата публикации

COMPOSITION FOR FILM, AND ADHESIVE FILM AND COVER LAY FILM FORMED THEREFROM

Номер: WO2011111471A1
Автор: TERAKI Shin, YOSHIDA Masaki, TAKAHASHI Satoko
Принадлежит:

Provided are an adhesive film and a cover lay film both for use in electrical/electronic applications, the films having excellent flame retardancy and being capable of attaining a reduction in permittivity and a reduction in dielectric loss in a high-frequency region. Also provided is a composition for use in producing these films. The composition for films is characterized by comprising (A) an epoxy resin containing no hydroxy group, (B) a urethane resin containing a phosphorus-containing polyol as a component, (C) a compound having a maleimide group, and (D) a hardener, the ingredients (B) and (C) being contained in amounts of 100-975 parts by mass and 25-100 parts by mass, respectively, per 100 parts by mass of the ingredient (A), the ingredient (D) being contained in an effective amount, and the proportion by mass of the phosphorus to the sum of the ingredients (A) to (D) being 2-7%.

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Номер записи: 2
31-05-2019 дата публикации

THERMOSETTING RESIN COMPOSITION, DIELECTRIC FILM, INTERLAYER DIELECTRIC FILM, MULTILAYER WIRING BOARD, AND SEMICONDUCTOR DEVICE

Номер: WO2019103082A1
Автор: KUROKAWA Tsuyoshi, SATO Junya, YOSHIDA Masaki, TERAKI Shin
Принадлежит:

A purpose of the present invention is to provide a thermosetting resin composition which is excellent in terms of heat resistance, reliability concerning moisture resistance, and moisture-absorption reflow characteristics. The thermosetting resin composition is characterized by comprising (A) a thermosetting resin having an unsaturated double bond at an end, (B) a silica filler surface-treated with a specific long-chain spacer type silane coupling agent including an alkyl group having an unsaturated double bond at at least an end, and (C) a flexibility-imparting resin (excluding component (A)). It is preferable that the unsaturated double bond of component (B) be a vinyl group.

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Номер записи: 3
13-02-2014 дата публикации

RESIN COMPOSITION, AND ADHESIVE FILM AND COVERLAY FILM EACH OF WHICH IS FORMED OF SAME

Номер: WO2014024678A1
Автор: TAKAHASHI Satoko, TERAKI Shin, YOSHIDA Masaki
Принадлежит:

The purpose of the present invention is to provide: an adhesive film for electrical/electronic applications and a coverlay film, each of which enables the achievement of a lower dielectric constant and a lower dielectric loss in the frequency range of 1-10 GHz, while having a flame retardancy meeting V-0 or VTM-0 according to UL-94 standard; and a resin composition which is used for the purpose of producing the adhesive film and the coverlay film. The present invention provides a resin composition which is characterized by containing (A) a vinyl compound represented by general formula (1) and having a mass average molecular weight (Mw) of 500-4,000, (B) a thermoplastic elastomer, (C) a thermosetting resin other than the vinyl compound represented by general formula (1), (D) a curing agent and (E) an organic aluminum phosphinate. This resin composition is also characterized in that the component (E) is contained in an amount of 10-50 parts by mass per 100 parts by mass of the total of the ...

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Номер записи: 4
30-08-2018 дата публикации

MULTI-LAYER WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

Номер: WO2018155418A1
Автор: YOSHIDA, Masaki, OHASHI, Satoko
Принадлежит:

The purpose of the present invention is to provide a multi-layer wiring substrate that enables suppressing inter-layer misalignment, and restraining transmission loss of an electric signal by using an adhesive layer having a superior peel strength when a fluorine resin substrate is used. Provided is a multi-layer wiring substrate 1 which comprises: a fluorine resin substrate 30 having a conductor pattern 20 formed at least on one surface thereof; and an adhesive layer 10 for adhering the fluorine resin substrate 30, wherein the adhesive layer 10 contains a cured product of a thermosetting resin, and has a fracture elongation of 20-300%.

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Номер записи: 5
08-06-2017 дата публикации

THERMALLY CURABLE RESIN COMPOSITION, THERMALLY CURABLE RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

Номер: WO2017094489A1
Автор: KUROKAWA Tsuyoshi, OHASHI Satoko, YOSHIDA Masaki
Принадлежит:

The purpose of the present invention is to provide a thermally curable resin composition which is capable of forming an insulating film having excellent dielectric properties, high flame retardancy, and high adhesive force, without requiring the use of any conventional halogen-compound flame retardant. The thermally curable resin composition is characterized by comprising (A) an aromatic polyphosphate ester, (B) melamine cyanurate, and (C) a resin having a relative permittivity of 2.9 or less at a frequency of 1.9 GHz, the sum of the components (A) and (B) being 45 parts by mass or more per 100 parts by mass of the component (C), and the content of the component (A) being higher than that of the component (B). It is preferable that the thermally curable resin composition have a relative permittivity of 3.0 or less at a frequency of 1.9 GHz.

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Номер записи: 6
01-02-2018 дата публикации

NEEDLE ATTACHMENT INSTRUMENT AND SEWING MACHINE

Номер: WO2018020809A1
Автор: TAKAHASHI Hideyuki, YOSHIDA Masaki, FUNATO Nobuhiko
Принадлежит:

The purpose of the present invention is to provide a needle attachment instrument which is capable of firmly attaching a punch needle to a needle bar, and a sewing machine in which the needle attachment instrument is mounted upon the needle bar. Provided is a needle attachment instrument (2), which is for attaching a punch needle (9) which is for needle punch working, to a needle bar of a sewing machine. The needle attachment instrument comprises: a bar-shaped insertion part (4) which passes through a mounting part which is disposed upon the needle bar in order to mount a sewing needle; an engagement mechanism (5) which is capable of engaging with the needle bar in the direction in which the insertion part extends and in a different position from the position of the insertion part; and an anchoring part (3D) which anchors the punch needle.

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Номер записи: 7
19-05-2016 дата публикации

RESIN COMPOSITION, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING SAME

Номер: WO2016076167A1
Автор: KOMATSU Fumikazu, YOSHIDA Masaki, TERAKI Shin
Принадлежит:

Provided are: an insulating film having excellent adhesive strength to metal foil that forms FPC wiring and to FPC substrate material such as polyimide film and exhibiting electrical characteristics in the high frequency range, specifically, low dielectric constant (ε) and low dielectric tangent (tanδ) in the 1-10 GHz frequency range; and a resin composition used in manufacturing said insulating film. This resin composition contains (A) a thermosetting resin having styrene groups on the ends and having a phenylene ether backbone, (B) a hydrogenated styrene thermoplastic elastomer, and (C) a polytetrafluoroethylene filler, and contains 40 mass% to 80 mass% of the component (C) with respect to the total mass of the components (A)-(C).

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Номер записи: 8
25-09-2014 дата публикации

RESIN COMPOSITION AND ADHESIVE FILM, COVERLAY FILM, AND INTERLAYER ADHESIVE USING RESIN COMPOSITION

Номер: WO2014148155A1
Автор: TERAKI Shin, KUSAMA Munetoshi, YOSHIDA Masaki
Принадлежит:

Provided are: a resin composition that can be thermally cured at 180°C or lower, the resin composition having excellent adhesive strength to substrate materials, electrical properties in the high-frequency region of a frequency of 1 GHz or higher, specifically, a low dielectric constant (ε) and a low dielectric loss tangent (tan δ) in the region of a frequency of 1 GHz or higher, as well as little shrinkage stress during thermal curing; and an adhesive film and a coverlay film produced using this resin composition. This resin composition includes (A) a vinyl compound indicated by general formula (1), (B) a polystyrene-poly(ethylene/butylene) block copolymer having a styrene content of 25-40%, (D) an epoxy resin, (E) bismaleimide, and (F) an organic peroxide having an exothermic peak measured by differential scanning calorimetry (DSC) of 100-180°C, the mass ratio of each component being (A + E)/(B + C) = 0.81-1.00, (B)/(C) = 1.00-4.00, and the resin composition containing 1-10 mass% of component ...

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Номер записи: 9
27-02-2020 дата публикации

BONE EXPANDING DEVICE AND BONE EXPANDING SYSTEM

Номер: WO2020039642A1
Автор: KATSURAGI, Ryosei, YOKOYAMA, Yasuharu, YOSHIDA, Masaki
Принадлежит:

In order to expand an incision in a bone while easily preventing retroversion of the bone, this bone expanding device (1) is provided with: a pair of pivoting members (3, 4) which are coupled so as to be pivotable around an axis (A) of a hinge part (2); a pair of opening/closing members (5, 6) which are inserted into the incision formed in the bone and expand the incision by moving away from each other due to the relative pivoting of the pivoting members (3, 4) around axes (B1, B2); and opening/closing mechanisms (7, 8) which cause the pivoting members (3, 4) to pivot around the axis (A). The opening/closing members (5, 6) are respectively provided with contact surfaces (5b, 6b) that come into contact with cut surfaces of the bone while inserted into the incision, and the bone opening device (1) has a shape in which the distance between the contact surfaces (5b, 6b) is greater at the rear side than the front side of the bone.

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Номер записи: 10
05-12-2019 дата публикации

THERMOSETTING RESIN COMPOSITION, FILM CONTAINING SAME, AND MULTILAYER WIRING BOARD USING SAME

Номер: WO2019230531A1
Автор: KUROKAWA Tsuyoshi, YOSHIDA Masaki, TERAKI Shin
Принадлежит:

Provided are: a film; and a thermosetting resin composition used in the production of the film. This film has excellent adhesive strength with respect to a substrate material and a metal foil which forms the wiring of a printed circuit board. Furthermore, this film exhibits excellent electrical properties in a high-frequency region. Specifically, this film exhibits a low dielectric constant (ε) and a low dielectric loss tangent (tan δ) in the frequency range of 1-100 GHz. Moreover, this film can be cured at lower temperatures. The thermosetting resin composition used in the production of the film contains (A) a thermosetting resin having a styrene group at the end, (B) a styrene-based thermoplastic elastomer, (C) a sulfide-based silane coupling agent, and (D) a dialkyl peroxide-based radical polymerization initiator.

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Номер записи: 11
01-10-2015 дата публикации

BONE PLATE AND BONE PLATE SYSTEM

Номер: WO2015146866A1
Автор: KURODA, Koichi, URATA, Mitsuya, YOSHIDA, Masaki
Принадлежит:

The purpose of the present invention is to prevent dislodgement of artificial bone or an increase in the backward inclination angle of an articular surface even when a vertical load is applied to a joint in an upright state after treatment. The invention is a bone plate (1) provided with: a strip-shaped main body (1a) that is fixed along the longitudinal direction of a tibia to an obliquely anterior medial surface of the tibia, lower than a cut formed in the medial surface of the tibia; a transverse section (1b) fixed along a direction intersecting with the longitudinal direction of the tibia to the medial surface of the tibia, higher than the cut; and a coupling section (1c) coupling together the main body (1a) and the transverse section (1b). A plurality of screw holes (5, 6, 7) that are arrayed at intervals from one another and penetrate through the thickness direction are provided to the transverse section (1b) and the main body (1a).

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Номер записи: 12
31-05-2018 дата публикации

RESIN COMPOSITION, THERMOSETTING FILM USING SAME, RESIN CURED PRODUCT, LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE

Номер: WO2018097010A1
Автор: SATO, Junya, KUROKAWA, Tsuyoshi, YOSHIDA, Masaki
Принадлежит:

Provided are: a thermosetting film which has excellent bonding strength to a metal foil contained in wiring lines of a printed wiring board and a substrate material such as a polyimide, while exhibiting dielectric characteristics in a high frequency region, specifically, a low dielectric constant (ε) and a low dielectric loss tangent (tan δ) in a frequency region of 1-100 GHz; and a resin composition which is used for the production of this thermosetting film. A resin composition which contains (A) an epoxy resin, (B) a resin that has a dielectric loss tangent (tan δ) of less than 0.005 in a frequency region of 1-100 GHz and (C) an imidazole compound wherein a side chain having an alkyl group with 5 or more carbon atoms is present at the 1-position of a heterocyclic ring.

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Номер записи: 13
14-03-2013 дата публикации

RESIN FILM

Номер: WO2013035350A1
Автор: YOSHIDA Masaki, TERAKI Shin
Принадлежит:

The present invention provides a resin film which is suitable for use as a sacrificial layer that is used in the technical field of MEMS. The present invention is a resin film which is composed of (A) an acrylic resin that has a glass transition point (Tg) of 40-80˚C, while having a functional group that is reactive with an epoxy resin, (B) an epoxy resin, (C) a phenolic resin, and (D) tetraphenylphosphonium tetra(p-tolyl)borate.

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Номер записи: 14
11-06-2020 дата публикации

RESIN COMPOSITION FOR MILLIMETER-WAVE SUBSTRATE, ADHESIVE FILM FOR MILLIMETER-WAVE SUBSTRATE, MILLIMETER-WAVE SUBSTRATE, MILLIMETER-WAVE RADAR SUBSTRATE, AND SEMICONDUCTOR DEVICE

Номер: WO2020116408A1
Автор: KUROKAWA Tsuyoshi, YOSHIDA Masaki, SATO Junya
Принадлежит:

The present invention provides a resin composition that is for a millimeter-wave substrate, that provides a cured product having excellent high-frequency characteristics, a small temperature dependence of tanδ, and superior flame retardance, and that can be used as an insulator for a millimeter-wave radar. The resin composition for a millimeter-wave substrate contains a hydrogenated styrene-based elastomer (A), a cross-linkable compound (B) having a biphenyl backbone, and a flame retardant (C) containing a metal salt of phosphinic acid, and is characterized in that: component (C) accounts for 15-50 parts by mass with respect to a total of 100 parts by mass of component (A), component (B), and component (C); and the rate of change of dielectric tangent of a cured product of said resin composition at 10 GHz at 120°C is at most 30% with respect to that at 25°C.

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Номер записи: 15