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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 7. Отображено 7.
30-06-2023 дата публикации

Semiconductor packaging structure with uniform-temperature enhanced heat dissipation function and packaging method thereof

Номер: CN116364687A
Автор: YUAN XUEPENG, CHEN YIXI, TANG YONG, YAO JIANFENG, PANG LONGJI, YAN ZHIYANG, CHEN FAJUN
Принадлежит:

The invention provides a semiconductor packaging structure with a uniform-temperature enhanced heat dissipation function and a packaging method of the semiconductor packaging structure. The semiconductor packaging structure comprises a plastic packaging material wrapping layer, a frame base island, a frame pin, a metal lead and a chip, the frame base island consists of an upper shell plate, a lower shell plate, a liquid absorption core and a powder column; the chip is welded on the frame base island and is connected with the frame pin through a metal lead; the frame base island is wholly wrapped in the plastic package material wrapping layer, and the bottom surface of the frame base island and the frame pins are exposed out of the plastic package material wrapping layer; the upper shell plate, the lower shell plate, the liquid absorption core and the powder column are prepared by adopting a uniform temperature plate; and a plurality of fins integrally formed with the lower shell plate are ...

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Номер записи: 1
23-05-2023 дата публикации

Automobile door unlocking control strategy based on AEB system and automobile

Номер: CN116146053A
Автор: DONG CHUANLIN, YAO JIANFENG, PENG CHANGKUN, FU JIAN
Принадлежит:

The invention discloses a car door unlocking control strategy based on an AEB system and a car, and relates to the technical field of car safety, and the car door unlocking control strategy comprises the steps that an active safety sensor monitors obstacles in front of the car and transmits monitoring data to a whole car control unit; the whole vehicle control unit analyzes and judges the monitoring data and sends a collision risk signal to the vehicle body control module when a collision risk exists; the vehicle body control module unlocks the vehicle lock and monitors whether a collision situation occurs within a set time, and if the collision situation does not occur within the set time, the vehicle lock is controlled according to an actual vehicle body; according to the control strategy, when the collision risk exists, the vehicle door unlocking action is started, and unlocking is completed, so that the situation that the vehicle door cannot be unlocked due to power failure of a storage ...

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Номер записи: 2
21-07-2023 дата публикации

Semiconductor packaging structure with temperature equalizing function and packaging method thereof

Номер: CN116469864A
Автор: YUAN XUEPENG, CHEN YIXI, TANG YONG, YAO JIANFENG, PANG LONGJI, YAN ZHIYANG, CHEN FAJUN
Принадлежит:

The invention provides a semiconductor structure with a temperature equalizing function and a packaging method. The semiconductor structure comprises a molding compound wrapping layer, a frame base island, frame pins, metal leads and chips, the frame base island consists of an upper shell plate, a lower shell plate, a liquid absorption core and a powder column; the chip is welded on the frame base island and is connected with the frame pin through a metal lead; the frame base island is wholly wrapped in the plastic package material wrapping layer, and the bottom surface of the frame base island and the frame pins are exposed out of the plastic package material wrapping layer; a micro groove is formed in the upper surface of the molding compound wrapping layer; and the upper shell plate, the lower shell plate, the liquid absorption core and the powder column are prepared by adopting a uniform temperature plate. By adopting the uniform-temperature plate and the high-thermal-conductivity filler ...

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Номер записи: 3
08-06-2016 дата публикации

Prevent smoke damper door

Номер: CN0205298723U
Автор: YAO KUN, YAO JIANFENG
Принадлежит:

... 本实用新型提供了种防排烟系统用阀门(以下简称防排烟阀门)，包括阀体和设于其内部的阀叶，设于阀体外侧的执行机构，以及设于阀体内部的支架，阀叶的中间设有V形区，V形区的两侧设有弯曲部位，而且执行机构包括杠杆、拉绳、锁轴装置、执行机构轴、叶片轴、电磁体以及熔断器。该防排烟阀门的设计使得其有更好的气密性、灵活性、安全性、致性，当发生火灾时，在定的时间内，该阀门有很好地耐火稳定性和耐火完整性，更好地起到隔烟阻火的作用。 ...

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Номер записи: 4
23-05-2023 дата публикации

Charging workbench for semiconductor molding compound

Номер: CN116142555A
Автор: YAO JIANFENG, QIU HUANSHU, LI WEIGUANG, YI XUCHENG, CHEN KEHUAN
Принадлежит:

The invention relates to the technical field of semiconductor production equipment, and provides a loading workbench for a semiconductor molding compound, a collecting box with filter holes and a packaging mold, the collecting box is used for containing the semiconductor molding compound, and the workbench comprises a rack; the filtering frame is arranged on the rack in the horizontal direction and used for bearing the collecting box and the packaging mold; the material guiding cavity is arranged below the filtering frame and is used for collecting powder falling from the filtering frame; the powder barrel is arranged below the material guide cavity and receives the powder flowing down from the interior of the material guide cavity; and the powder cleaning mechanism is arranged on the filtering frame and is used for cleaning the powder on the filtering frame and in the material guide cavity into the powder barrel. The problems that in the prior art, powder is likely to scatter on a workbench ...

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Номер записи: 5
06-06-2023 дата публикации

Structure device for preventing jumper flashover of power transmission tower

Номер: CN116231569A
Автор: YAO JIANFENG, TU ZHIBIN, ZHENG GENSHENG, MENG JIAHAO, ZHOU XING
Принадлежит:

The invention discloses a structure device for preventing jumper flashover of a power transmission tower. The power transmission tower section is provided with a main rod, the main rod is provided with a secondary rod and a transverse separation surface rod, the transverse separation surface rod is located beside the secondary rod, and the transverse separation surface rod is provided with a power transmission line; the power transmission line is connected with the jumper through the insulator, the middle of the jumper droops, and a permanent magnet aluminum pipe structure is arranged in the middle of the jumper. An electromagnet photovoltaic mechanism is mounted on the outer side of the main rod at the same height as the middle of the jumper wire; and the electromagnet photovoltaic mechanism and the permanent magnet aluminum pipe structure are matched to work. According to the method, jumper flashover of the power transmission tower can be prevented, jumper flashover of the power transmission ...

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Номер записи: 6
29-08-2023 дата публикации

Semiconductor structure capable of automatically adjusting heat dissipation capability along with power change and packaging method thereof

Номер: CN116666343A
Автор: YUAN XUEPENG, CHEN YIXI, TANG YONG, YAO JIANFENG, PANG LONGJI, YAN ZHIYANG, CHEN FAJUN
Принадлежит:

The invention discloses a semiconductor structure capable of automatically adjusting heat dissipation capacity along with power change and a packaging method of the semiconductor structure, and relates to the field of semiconductor manufacturing. The semiconductor structure comprises a frame base island uniform temperature plate, a chip, a frame pin and a packaging layer. The grooves are formed in the inner wall of the steam cavity of the frame base island temperature-uniforming plate, the electric response hydrogel is arranged in the grooves, and the steam cavity is filled with the liquid working medium matched with the electric response hydrogel, so that the frame base island temperature-uniforming plate forms the self-adaptive temperature-uniforming plate based on phase change heat transfer. When the input power changes, the electric response hydrogel shrinks and swells under the stimulation of an electric signal to change the width-depth ratio of the groove of the frame base island ...

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Номер записи: 7