30-06-2023 дата публикации
Номер: CN116364778A
Принадлежит:
The invention relates to an HJD-integrated SiC VDMOSFET device and a preparation method thereof. The HJD-integrated SiC VDMOSFET device comprises a metalized drain, an N + substrate layer, an N-epitaxial layer, a P-base region, a P + injection region, an N + injection region, an N-doped region, a P + polycrystalline silicon region, a gate dielectric layer, an N + polycrystalline silicon gate and a metalized source. Wherein the depths of the P-base region, the P + injection region and the N-doped region are the same, the contact interface between the source electrode and the P + injection region, the contact interface between the N + injection region and the P + polycrystalline silicon region are ohmic contact, and the interface between the P + polycrystalline silicon region and the N-doped region is heterojunction contact. The heterojunction diode structure is integrated in the device, the utilization rate of the cellular area is improved, the gate capacitance is reduced while the turn-on ...
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