01-08-2023 дата публикации
Номер: CN116512614A
Принадлежит:
The invention provides a hot-pressing bonding device for a micro-fluidic chip. The hot-pressing bonding device comprises an upper beam, a lower beam, a movable beam, an upper pressing head, a lower pressing head, a lower beam and a workbench, the upper beam and the lower beam are provided with two parallel stand columns. The lifter is fixed above the upper beam, and the extending end part is fixed with the upper end of the movable beam; the movable beam is sleeved on the upright post through an upper guide device; the upper pressing head is fixed below the upper beam, the lower end face of the upper pressing head is provided with a chip mold, and the two sides of the upper pressing head are each provided with an upper pressing head chip taking device; the worktable is sleeved on the upright post through a lower guide device, and the lower guide device is in sliding fit with a rod body of the upright post for guiding and is positioned below the movable beam; a lower pressing head is fixed ...
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