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Применить Всего найдено 2. Отображено 2.
14-04-2023 дата публикации

SEMICONDUCTOR PACKAGE

Номер: CN115968207A
Автор: OH DONG-JOON, KANG UN-BYOUNG, KIM BYUNG-CHAN, PARK JUM-YONG, SONG ZHI, LEE CHUNGSUN, HWANG HYUN-SOO
Принадлежит:

A semiconductor package includes: a first semiconductor chip including a first semiconductor substrate having a first active surface and a first passive surface opposite each other, and a plurality of first chip pads on the first active surface; a second semiconductor chip including a second semiconductor substrate having a second active surface and a second passive surface opposite to each other, and a plurality of second chip pads on the second active surface, a second semiconductor chip stacked on the first semiconductor chip such that the second active surface faces the first passive surface; a bonding insulating material layer that is interposed between the first semiconductor chip and the second semiconductor chip; and a plurality of bonding pads, which are surrounded by the bonding insulating material layer, and which electrically connect the first semiconductor chip to the second semiconductor chip.

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Номер записи: 1
28-04-2023 дата публикации

Semiconductor device and semiconductor package including same

Номер: CN116031228A
Автор: OH JOON-YOUNG, KANG UN-BYOUNG, KIM BYUNG-CHAN, PARK JUM-YONG, LEE CHUNGSUN
Принадлежит:

The semiconductor device may include a substrate, a first insulating layer on a bottom surface of the substrate, an interconnect structure in the first insulating layer, a second insulating layer on a bottom surface of the first insulating layer, and a plurality of lower pads disposed in the second insulating layer. Each lower pad may be disposed such that a width of a top surface thereof is smaller than a width of a bottom surface thereof. The lower pads may include a first lower pad, a second lower pad, and a third lower pad. In a plan view, the first and third lower pads may be adjacent to a center portion and an edge portion of the substrate, respectively, while the second lower pad may be disposed therebetween. A width of a bottom surface of the second lower pad may be less than a width of a bottom surface of the first lower pad and may be greater than a width of a bottom surface of the third lower pad.

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Номер записи: 2