09-06-2023 дата публикации
Номер: CN116247045A
Принадлежит:
The invention provides a light-emitting diode package capable of avoiding the problems of chip displacement and optical interference. The light-emitting diode package comprises a redistribution circuit layer, a light-emitting diode, a first dielectric layer, a plurality of wavelength conversion structures and transparent packaging glue. The light emitting diode is disposed on the redistribution layer and electrically connected to the redistribution layer. The light-emitting diodes comprise a first light-emitting diode, a second light-emitting diode and a third light-emitting diode. The first dielectric layer is disposed on the redistribution layer and covers the light emitting diode. The plurality of wavelength conversion structures are arranged on the first dielectric layer and are respectively contacted with the second light emitting diode and the third light emitting diode. The transparent packaging adhesive is arranged on the first dielectric layer and wraps the wavelength conversion ...
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