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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 36. Отображено 36.
12-11-2015 дата публикации

CURABLE COMPOSITION, ELECTROCONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

Номер: WO2015170682A1
Автор: ISHIZAWA, Hideaki, KUBOTA, Takashi, YASUI, Hidefumi, SHINJOU, Takashi
Принадлежит:

Provided is a curable composition with which the adhesiveness of a member to be connected can be enhanced. This curable composition comprises: a curable compound obtained by using a first compound obtained by a reaction between a compound represented by formula (11) and a diol compound and causing a second compound having an isocyanate group and an unsaturated double bond to react with the first compound; and a thermal curing agent and/or photo-curing initiator. In formula (11), X represents a C2-10 alkylene group or phenylene group, and R1 and R2 each represent a hydrogen atom or C1-4 alkyl group.

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Номер записи: 1
24-07-2014 дата публикации

CURABLE COMPOSITION FOR ELECTRONIC COMPONENT, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE

Номер: WO2014112541A1
Автор: ISHIZAWA, Hideaki, KUBOTA, Takashi
Принадлежит:

Provided is a curable composition that is for an electronic component, can be rapidly cured, and furthermore can have increased conductivity even when connected to a copper electrode. The curable composition for an electronic component is used when connecting to a copper electrode. The curable composition for an electronic component contains a heat-curable compound, a latent curing agent, and an imidazole compound having an aromatic skeleton.

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Номер записи: 2
02-03-2017 дата публикации

CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Номер: WO2017033931A1
Автор: ITOU, Masahiro, SADANAGA, Shuujirou, ISHIZAWA, Hideaki, KUBOTA, Takashi
Принадлежит:

Provided is a conductive material that allows selective arrangement of solder in conductive particles between vertically arranged electrodes, that makes arrangement of solder in conductive particles between horizontally arranged electrodes difficult, and that can enhance conduction reliability and insulation reliability. The conductive material according to the present invention contains, in the outer surface portion of a conductive part thereof, a thermosetting component and a plurality of conductive particles having solder. The minimum value of the viscosity of the conductive material is 25-255 Pa·s at a temperature from 25°C to the melting point °C of the solder in the conductive particles. The average particle diameter of the conductive particles is 3-15 μm. When the average particle diameter μm of the conductive particles is A and the viscosity Pa·s of the conductive material at the melting point °C of the solder in the conductive particles is B, B is not less than (-5A+100) and not ...

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Номер записи: 3
24-10-2019 дата публикации

ELECTROCONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

Номер: WO2019203053A1
Автор: SOU, Shike, ISHIZAWA, Hideaki, SAITOU, Satoshi, ITOU, Masahiro
Принадлежит:

Provided is an electroconductive material with which it is possible to effectively improve the reliability of conduction between upper and lower electrodes to be connected, even when the electroconductive material is heated by high-temperature reflow. The electroconductive material according to the present invention contains a heat-curable component and a plurality of solder particles. The solder particles contain tin, silver, and copper. The heat-curable component contains a heat-curable compound. The heat-curable compound content in 100 wt% of the electroconductive material is 10 wt% or above.

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Номер записи: 4
27-06-2019 дата публикации

SOLDER PARTICLES, ELECTROCONDUCTIVE MATERIAL, SOLDER PARTICLE STORAGE METHOD, ELECTROCONDUCTIVE MATERIAL STORAGE METHOD, ELECTROCONDUCTIVE MATERIAL PRODUCTION METHOD, CONNECTION STRUCTURE, AND CONNECTION STRUCTURE PRODUCTION METHOD

Номер: WO2019124513A1
Автор: SOU, Shike, SADANAGA, Shuujirou, ITOU, Masahiro, SAITOU, Satoshi, ISHIZAWA, Hideaki
Принадлежит:

Provided are solder particles capable of effectively increasing the coalescence of solder when forming electroconductive connections. The solder particles according to the present invention comprise a solder particle body and an oxide film disposed on the outer surface of the solder particle body. The particle size of the solder particles is at least 0.01 μm and less than 1 μm. The average thickness of the oxide film is 5 nm or less.

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Номер записи: 5
02-03-2017 дата публикации

ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Номер: WO2017033932A1
Автор: ITOU, Masahiro, ISHIZAWA, Hideaki, KUBOTA, Takashi, SADANAGA, Shuujirou
Принадлежит:

To provide an electroconductive material with which it is possible to selectively dispose solder in electroconductive particles on an electrode, and improve conduction reliability. In the electroconductive material according to the present invention, the outer surface portion of an electroconductive part includes a thermosetting component, a phosphoric acid compound, and a plurality of electroconductive particles having solder, the viscosity of the electroconductive material at 50°C being 10-100 Pa•s.

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Номер записи: 6
20-10-2011 дата публикации

ATTACHMENT MATERIAL FOR SEMICONDUCTOR CHIP BONDING, ATTACHMENT FILM FOR SEMICONDUCTOR CHIP BONDING, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE

Номер: WO2011129272A1
Автор: TAKEDA Kohei, ISHIZAWA Hideaki, KIM Chizuru, HATAI Munehiro, NISHIMURA Yoshio, OKAYAMA Hisatoshi
Принадлежит:

Disclosed is an attachment material for semiconductor chip bonding, whereby manufacturing a highly reliable semiconductor device, controlling such that a fillet shape does not take on a convex shape, is possible. The disclosed attachment material for semiconductor chip bonding has a shear modulus (Gr) as measured with a viscoelasticity measurement device that is greater than or equal to 1*106 Pa at 25 degrees C; a minimum complex viscosity (η*min) up to the melting point of solder as measured by a rheometer that is less than or equal to 5x101 Pa•s; and the complex viscosity (η*(1Hz)) when measured at 140 degrees C, 1 rad distortion, and a frequency of 1Hz is 0.5-4.5 times the complex viscosity (η*(10Hz)) when measured at 140 degrees C, 1 rad distortion, and a frequency of 10Hz.

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Номер записи: 7
02-03-2017 дата публикации

ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Номер: WO2017033933A1
Автор: SADANAGA, Shuujirou, NAGATA, Mai, ITOU, Masahiro, KUBOTA, Takashi, ISHIZAWA, Hideaki, NATSUI, Hiroshi
Принадлежит:

Provided is an electroconductive material in which solder can be selectively disposed in the electroconductive particles on an electrode without an inorganic filler excessively inhibiting the movement of the solder, electroconductivity can be made more reliable, and the dimensions of the cured electroconductive material can be made more stable. The electroconductive material according to the present invention includes, in an outer surface portion of an electroconductive part: a plurality of electroconductive particles that have solder; a heat-curable component; and an inorganic filler having a degree of hydrophobization of 40 or more, the viscosity of the electroconductive material at 50°C being 10-200 Pa·s.

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Номер записи: 8
29-08-2013 дата публикации

CONDUCTIVE PARTICLES, METHOD FOR PRODUCING CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Номер: WO2013125517A1
Автор: MASUI, Ryohei, KUBOTA, Takashi, ISHIZAWA, Hideaki
Принадлежит:

Provided are conductive particles and a conductive material which are capable of providing a connection structure wherein the connection resistance is low and the generation of voids is suppressed if the connection structure is obtained by electrically connecting electrodes with use of the conductive particles or the conductive material. Each of conductive particles (1) of the present invention has a solder (3) on a conductive surface (1a). A group containing a carboxyl group is covalently bonded to the surface of the solder (3). A conductive material of the present invention contains the conductive particles (1) and a binder resin.

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Номер записи: 9
19-11-2015 дата публикации

CONDUCTIVE PASTE, PRODUCTION METHOD FOR CONDUCTIVE PASTE, CONNECTION STRUCTURE, AND PRODUCTION METHOD FOR CONNECTION STRUCTURE

Номер: WO2015174299A1
Автор: YAMAGIWA, Hitoshi, KUBOTA, Takashi, ISHIZAWA, Hideaki
Принадлежит:

Provided is a conductive paste capable of improving coating properties, capable of efficiently arranging conductive particles upon electrodes, and capable of improving conduction reliability between electrodes. This conductive paste includes a thermosetting component and a plurality of conductive particles. The thermosetting component contains a thermosetting compound that is solid at 25°C and a thermosetting agent. The thermosetting compound that is solid at 25°C is scattered as particles in the conductive paste.

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Номер записи: 10
30-12-2021 дата публикации

LAMINATE, CURABLE RESIN COMPOSITION, METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SUBSTRATE HAVING JUNCTION ELECTRODE, SEMICONDUCTOR DEVICE, AND IMAGE CAPTURING DEVICE

Номер: WO2021261403A1
Автор: SHIOJIMA, Taro, SATO, Kenichiro, DEGUCHI, Hidenobu, ISHIZAWA, Hideaki, HATAI, Munehiro, SHICHIRI, Tokushige
Принадлежит:

The purpose of the present invention is to provide a laminate having high electrical connection reliability, a curable resin composition that can be used in the laminate, a method for manufacturing the laminate, a method for manufacturing a substrate having a junction electrode used in manufacturing the laminate, a semiconductor device having the laminate, and an image capturing device. A laminate according to the present invention has, in this order, a first substrate having an electrode, an organic film, and a second substrate having an electrode. The electrode of the first substrate and the electrode of the second substrate are electrically connected via a through hole that passes through the organic film.

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Номер записи: 11
19-01-2017 дата публикации

CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Номер: WO2017010445A1
Автор: ISHIZAWA, Hideaki, NISHIOKA, Keizo
Принадлежит:

Provided is a conductive material in which the dispersibility of conductive particles in the conductive material is high and the solder in the conductive particles can be efficiently disposed on electrodes, thereby making it possible to improve the reliability of conduction between electrodes. This conductive material includes a plurality of conductive particles, a heat curable compound, and a heat curing agent. The conductive particles each have solder on an outer surface portion of a conductive section and have an O-Si bond on the outer surface of the solder of the conductive section.

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Номер записи: 12
27-10-2011 дата публикации

ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Номер: WO2011132658A1
Автор: KOBAYASHI, Hiroshi, TATENO, Akihiko, ISHIZAWA, Hideaki, SAITOU, Satoshi
Принадлежит:

Provided is an anisotropic conductive material which facilitates connection between electrodes when the anisotropic conductive material is used for connection between electrodes, and which can improve conduction reliability, and also provided is a connection structure which uses the anisotropic conductive material. The anisotropic conductive material includes conductive particles (1) and binder resin. The conductive particles (1) are composed of resin particles (2) and a conductive layer (3) which covers the surfaces (2a) of the resin particles (2). The surface layer on at least the outside of the conductive layer (3) is a solder layer (5). The connection structure is provided with a first member to be connected, a second member to be connected, and a connection part for connecting the first and second members to be connected. The connection part is formed from the anisotropic conductive material.

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Номер записи: 13
10-03-2016 дата публикации

METHOD OF MANUFACTURING CONNECTION STRUCTURE

Номер: WO2016035637A1
Автор: ISHIZAWA, Hideaki, UENOYAMA, Shinya
Принадлежит:

Provided is a method of manufacturing a connection structure, which is capable of ensuring conductivity even if a solder resist film protrudes further than electrodes, and in which solder particles can be efficiently disposed between the electrodes and the reliability of conduction between the electrodes can thus be improved. This method of manufacturing a connection structure comprises: a step for disposing a conductive paste on the surface of a first member to be connected; a step for disposing, on the surface of the conductive paste, a second member to be connected; and a step for heating the conductive paste to at least the melting temperature of the solder particles and at least the curing temperature of a thermosetting component to form a connection part, wherein a first member to be connected, which has a solder resist film in a region, in which the first electrode is not provided, on the surface at the first electrode side, and in which the outer surface of the solder resist film ...

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Номер записи: 14
14-02-2013 дата публикации

CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Номер: WO2013021895A1
Автор: YUUKI, Akira, SHIMAOKA, Junichi, KOBAYASHI, Hiroshi, ISHIZAWA, Hideaki
Принадлежит:

Provided are a conductive material with which it is possible to improve conduction reliability and insulation reliability of a connection structure obtained in a case where electrodes of members to be connected are electrically connected regardless of the use of a cation generator, as well as a connection structure that uses the conductive material. This conductive material contains a curable component, a cation exchanger, an anion exchanger, and conductive particles (5). The curable component comprises a curable compound and a cation generator. This connection structure (1) has a first member to be connected (2), a second member to be connected (4), and a connecting part (3) for electrically connecting the first member to be connected (2) and the second member to be connected (4). The connecting part (3) is formed by curing the conductive material.

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Номер записи: 15
24-07-2014 дата публикации

CURABLE COMPOSITION FOR ELECTRONIC COMPONENT AND CONNECTION STRUCTURE

Номер: WO2014112540A1
Автор: ISHIZAWA, Hideaki, KUBOTA, Takashi
Принадлежит:

Provided is a curable composition that is for an electronic component, can be quickly cured, and furthermore can have increased storage stability. The curable composition for an electronic component contains an epoxy compound, an anionic curing agent, a flux, and a basic compound that is not the anionic curing agent.

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Номер записи: 16
25-08-2016 дата публикации

ELECTROCONDUCTIVE PASTE AND CONNECTION STRUCTURE

Номер: WO2016133113A1
Автор: MASUI, Ryohei, ISHIZAWA, Hideaki, UENOYAMA, Shinya
Принадлежит:

Provided is an electroconductive paste with which it is possible to dispose solder particles on electrodes in an efficient manner, prevent positional displacement between the electrodes, and increase the reliability of conduction between the electrodes. This electroconductive paste contains a plurality of solder particles and a binder. The solder particles are particles in which both a center portion and the outer surface of an electroconductive part are made of solder. A group having at least one carboxyl group is convalently bonded to the surface of the solder of the solder particles interposed therebetween by a group represented by the following formula (X), an ether bond, or an ester bond. The minimum value of the viscosity of the electroconductive paste in a temperature range extending from 10°C below the melting point of the solder to the melting point of solder is 100 mPa·s or higher and the maximum value of the viscosity of the electroconductive paste in a temperature range extending ...

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Номер записи: 17
26-05-2016 дата публикации

CONDUCTIVE PARTICLES, METHOD FOR MANUFACTURING CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

Номер: WO2016080515A1
Автор: ISHIZAWA, Hideaki, UENOYAMA, Shinya
Принадлежит:

Provided are conductive particles with which it is possible to reduce connection resistance between electrodes when the electrodes are electrically connected. Conductive particles according to the present invention have solder on the surface of a conductive portion, and a group having at least one carboxyl group is bonded to the surface of the solder via a group including a group represented by formula (X).

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Номер записи: 18
03-08-2017 дата публикации

CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Номер: WO2017130892A1
Автор: NATSUI, Hiroshi, SADANAGA, Shuujirou, ITOU, Masahiro, YASUI, Hidefumi, ISHIZAWA, Hideaki
Принадлежит:

Provided is a conductive material capable of providing high conduction reliability since the conductive material has high storage stability, and shows, after being arranged on a member to be connected, excellent solder cohesiveness performance, even if being left for a long time. The conductive material according to the present invention contains, in the outer surface portion of a conductive portion: a plurality of conductive particles having solder; a thermosetting component; and flux. The flux is a salt of an acid and a base. The flux is present as a solid in the conductive material at 25°C.

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Номер записи: 19
12-03-2015 дата публикации

CURABLE COMPOSITION AND CONNECTION STRUCTURE

Номер: WO2015033834A1
Автор: ISHIZAWA, Hideaki, KUBOTA, Takashi
Принадлежит:

This invention provides a curable composition that uses a phenoxy resin that makes it possible to obtain a curable composition that, when cured, is highly adhesive in high-temperature, high-humidity environments. This curable composition contains conductive particles and a phenoxy resin that has a hydrolyzable group in a side chain.

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Номер записи: 20
12-03-2015 дата публикации

CURABLE COMPOSITION AND CONNECTION STRUCTURE

Номер: WO2015033833A1
Автор: ISHIZAWA, Hideaki, KUBOTA, Takashi
Принадлежит:

This invention provides a curable composition that exhibits good storage stability and cures rapidly at low temperatures. Said curable composition contains an organic peroxide, a pH adjuster, and a radically polymerizable compound that has a radically polymerizable group and a morpholine group. The pH of said curable composition is between 4 and 9, inclusive.

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Номер записи: 21
02-03-2017 дата публикации

CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Номер: WO2017033934A1
Автор: NAGATA, Mai, SADANAGA, Shuujirou, ITOU, Masahiro, KUBOTA, Takashi, ISHIZAWA, Hideaki
Принадлежит:

Provided is a conductive material capable of improving conduction reliability by selectively disposing solder in conductive particles on an electrode. This conductive material includes, in an outer surface section of a conductive part, a plurality of conductive particles having solder, and a thermosetting component, and when difference scanning calorimetry is performed by heating the conductive particles and the thermosetting component at a temperature increase rate of 25-10°C/min, a temperature region indicating an endothermic peak derived from melting of the solder in the conductive particles and a temperature region indicating a exothermic peak derived from curing of the thermosetting component at least partially overlap each other.

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Номер записи: 22
21-02-2013 дата публикации

EPOXY COMPOUND, EPOXY COMPOUND MIXTURE, CURABLE COMPOSITION, AND CONNECTING STRUCTURE

Номер: WO2013024844A1
Автор: ISHIZAWA, Hideaki, KUBOTA, Takashi, YUUKI, Akira
Принадлежит:

An epoxy compound that can be rapidly cured and in which a cured article has excellent adhesiveness and moisture resistance, a curable composition that uses the epoxy compound, and a connecting structure that uses the curable composition are provided. The epoxy compound has an epoxy group at both ends, and has a vinyl group or an epoxy group in a side chain. The weight-average molecular weight of this epoxy compound is 500-150000 inclusive. The curable composition contains the epoxy compound and a thermosetting agent. The connecting structure (1) comprises a first member (2) to be connected, a second member (4) to be connected, and a connector (3) connecting together the first and second members (2, 4) to be connected. The connector (3) is formed using the curable composition.

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Номер записи: 23
25-08-2016 дата публикации

CONNECTION STRUCTURAL BODY MANUFACTURING METHOD

Номер: WO2016133114A1
Автор: YAMAGIWA, Hitoshi, ISHIZAWA, Hideaki, UENOYAMA, Shinya
Принадлежит:

A connection structural body manufacturing method according to the present invention comprises: a first heating step of locating a conductive material (11) between a first member to be connected (2) and a second member to be connected (3) and then heating the conductive material from a temperature lower than the melting point of a solder particle (11A) to a temperature that is equal to or higher than the melting point of the solder particle (11A) and that does not complete the curing of the binder; and a second heating step of heating, after the first heating step, the conductive material (11) to a temperature higher than the temperature in the first heating step, wherein the first heating step includes causing a solder particle (11A) not positioned between the first electrode (2a) and the second electrode (3a) to start moving toward a position between the first electrode (2a) and the second electrode (3a) before the solder particle (11A) not positioned between the first electrode (2a) ...

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Номер записи: 24
10-12-2015 дата публикации

CONDUCTIVE PASTE, CONNECTED STRUCTURE AND METHOD FOR PRODUCING CONNECTED STRUCTURE

Номер: WO2015186704A1
Автор: KUBOTA, Takashi, ISHIZAWA, Hideaki
Принадлежит:

Provided is a conductive paste which is capable of efficiently disposing solder particles on an electrode and enhancing conduction reliability between electrodes. A conductive paste according to the present invention contains a thermosetting component, a flux and a plurality of solder particles. This conductive paste has a viscosity of from 0.1 Pa·s to 3 Pa·s (inclusive) at the melting point of the flux, and a viscosity of from 0.1 Pa·s to 5 Pa·s (inclusive) at the melting point of the solder particles.

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Номер записи: 25
02-03-2017 дата публикации

ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Номер: WO2017033935A1
Автор: SADANAGA, Shuujirou, NAGATA, Mai, ITOU, Masahiro, KUBOTA, Takashi, ISHIZAWA, Hideaki, NATSUI, Hiroshi
Принадлежит:

Provided is an electroconductive material with which it is possible to selectively dispose solder in electroconductive particles on an electrode, and minimize migration and keep the connection resistance low even when the electrode width and the electrode pitch are reduced. The electroconductive material according to the present invention: contains, on the outer surface portion of an electroconductive part, a heat-curable compound, an acid anhydride heat curing agent, and a plurality of electroconductive particles having solder; and exhibits a viscosity at 50°C of 10-200 Pa•s.

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Номер записи: 26
27-08-2015 дата публикации

CONNECTION STRUCTURE MANUFACTURING METHOD

Номер: WO2015125779A1
Автор: ISHIZAWA, Hideaki, KUBOTA, Takashi
Принадлежит:

Provided is a connection structure manufacturing method by which it is possible to efficiently dispose solder particles on electrodes and by which it is possible to increase conduction reliability between the electrodes. This connection structure manufacturing method comprises: a step for disposing a conductive paste on a surface of a first member to be connected, said conductive paste containing a plurality of solder particles and a thermosetting component; a step for disposing a second member to be connected on the reverse surface of the conductive paste from the first member to be connected side in a manner such that a first electrode and a second electrode oppose one another; and a step for forming a connection part from the conductive paste by heating the conductive paste, said connection part connecting the first member to be connected and the second member to be connected. In the step for disposing the second member to be connected and the step for forming the connection part, the ...

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Номер записи: 27
02-03-2017 дата публикации

ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Номер: WO2017033930A1
Автор: ITOU, Masahiro, SADANAGA, Shuujirou, ISHIZAWA, Hideaki, KUBOTA, Takashi
Принадлежит:

... [Problem] To provide an electroconductive material with which it is possible to suppress the occurrence of black soot in a cured object, selectively dispose solder in electroconductive particles on an electrode, and improve electroconductive reliability. [Solution] An electroconductive material according to the present invention includes, in an outer surface portion of an electroconductive part, a plurality of electroconductive particles that have solder, a heat-curable component, and flux, and includes as the heat-curable component or the flux a compound having an isocyanuric backbone, the viscosity of the electroconductive material at the melting point of the solder in the electroconductive particles being 0.1-20 Pa·s.

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Номер записи: 28
27-11-2014 дата публикации

CONDUCTIVE MATERIAL AND CONNECTED STRUCTURE

Номер: WO2014189028A1
Автор: ISHIZAWA, Hideaki, KUBOTA, Takashi
Принадлежит:

Provided is a conductive material which has a high reaction rate and a high fluxing effect. The conductive material according to the invention comprises conductive particles (1), at least the outer surface of which is a solder, an anionically curable compound, an anionic hardener, and an organic acid having a carboxyl group and a functional group formed by esterification of a carboxyl group.

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Номер записи: 29
03-10-2013 дата публикации

CONDUCTIVE MATERIAL AND CONNECTING STRUCTURE

Номер: WO2013146604A1
Автор: ISHIZAWA, Hideaki, KUBOTA, Takashi
Принадлежит:

The present invention provides a conductive material capable of reducing the connection resistance in a connecting structure obtained when an electrical connection is established between electrodes to yield the connecting structure. This conductive material contains a binder resin, and conductive particles having solder on a conductive surface. The binder resin includes a curing compound that hardens through heating, and a thermosetting agent. When the binder resin and the solder in the conductive particles are heated at a rate of temperature rise of 10°C/minute and differential scanning calorimetry is performed, an exothermic peak top P1t temperature in the curing of the binder resin is lower than the endothermic peak top P2t temperature in the molten solder.

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Номер записи: 30
09-06-2016 дата публикации

ELECTROCONDUCTIVE PASTE, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

Номер: WO2016088664A1
Автор: ISHIZAWA, Hideaki, UENOYAMA, Shinya
Принадлежит:

Provided is an electroconductive paste with which it is possible to control with high precision gaps between electrodes, and with which it is further possible to efficiently dispose solder particles on the electrodes, and to increase conduction reliability between electrodes. The electroconductive paste according to the present invention is used for connecting a first member to be connected having a first electrode on the surface thereof and a second member to be connected having a second electrode on the surface thereof, and electrically connecting the first electrode and the second electrode. The electroconductive paste includes a thermosetting component, a plurality of solder particles, and a plurality of spacers having a melting point of 250°C or higher, the average particle diameter of the spacers being greater than the average particle diameter of the solder particles.

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Номер записи: 31
27-08-2015 дата публикации

CONDUCTIVE PASTE, CONNECTION STRUCTURE, AND CONNECTION STRUCTURE MANUFACTURING METHOD

Номер: WO2015125778A1
Автор: ISHIZAWA, Hideaki, KUBOTA, Takashi, YAMAGIWA, Hitoshi, MIYAZAKI, Danichi, HASEGAWA, Atsushi, SAITOU, Satoshi
Принадлежит:

Provided is a conductive paste with which solder particles can be efficiently disposed onto an electrode and the reliability of conduction between electrodes can be improved. This conductive paste includes thermosetting components and a plurality of solder particles. The zeta potential on the surface of the solder particles is positive.

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Номер записи: 32
28-01-2016 дата публикации

METHOD FOR PRODUCING CONNECTION STRUCTURE

Номер: WO2016013474A1
Автор: ISHIZAWA, Hideaki, UENOYAMA, Shinya
Принадлежит:

Provided is a method for producing a connection structure which is capable of suppressing the amount of change in impedance. A method for producing a connection structure according to the present invention comprises: a step for arranging a conductive paste on the surface of a first connection object member; a step for arranging a second connection object member on the surface of the conductive paste such that a first electrode and a second electrode face each other; and a step for electrically connecting the first electrode and the second electrode by means of a solder part in a connection part by heating the conductive paste to a temperature that is not less than the melting point of solder particles and is not less than the curing temperature of a thermosetting component. The thickness of the solder part is set to be larger than the average particle diameter of the solder particles and to be 80 μm or less.

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Номер записи: 33
11-09-2015 дата публикации

CONDUCTIVE PASTE, CONNECTION STRUCTURE, AND PRODUCTION METHOD FOR CONNECTION STRUCTURE

Номер: WO2015133343A1
Автор: KUBOTA, Takashi, ISHIZAWA, Hideaki
Принадлежит:

Provided is a conductive paste that enables solder particles to be effectively arranged on an electrode and conduction reliability between electrodes to be increased. The conductive paste according to the present invention contains a heat-curable component and a plurality of solder particles, and when the heat-curable component and the solder particles are each heated at a temperature elevation rate of 10℃/minute and subjected to differential scanning calorimetry, the temperature of the exothermic peak top during the full curing of the heat-curable component is higher than the temperature of the endothermic peak top during the melting of the solder particles. The absolute difference between the temperature of the exothermic peak top during the full curing of the heat-curable component and the temperature of the endothermic peak top during the melting of the solder particles is 10-70℃ inclusive.

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Номер записи: 34
24-03-2016 дата публикации

ELECTRICALLY CONDUCTIVE PASTE, JOINED STRUCTURE, AND METHOD FOR MANUFACTURING JOINED STRUCTURE

Номер: WO2016043265A1
Автор: ISHIZAWA, Hideaki, SAITOU, Satoshi, UENOYAMA, Shinya
Принадлежит:

Provided is an electrically conductive paste whereby it becomes possible to efficiently arrange solder particles on an electrode, it also becomes possible to prevent the positional displacement between electrodes and it also becomes possible to increase the reliability of electric continuity between electrodes. The electrically conductive paste according to the present invention comprises a heat-curable compound that serves as a heat-curable component, a heat-curing agent and multiple solder particles, wherein the heat-curable compound comprises a crystalline heat-curable compound, and the solder particles are particles in each of which each of the center portion and the electrically conductive outer surface is made from a solder material.

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Номер записи: 35
07-05-2015 дата публикации

METHOD FOR PRODUCING RECYCLED ELECTRONIC COMPONENT AND CONNECTION STRUCTURE

Номер: WO2015064440A1
Автор: ISHIZAWA, Hideaki, KUBOTA, Takashi
Принадлежит:

Provided is a method for producing a recycled electronic component which is capable of effectively removing a residue from a detached electronic component, even when using conductive particles having solder on the conductive surface thereof. This method for producing a recycled electronic component is provided with a step for obtaining a recycled electronic component from which a residue (54A) has been removed by: starting with a detached electronic component comprising a detached first electronic component (52A) and/or a detached second electronic component (53A) which are obtained by detaching the first and second electronic components from one another; and in order to remove the residue (54A) present on the surface of the detached electronic component, wiping away the residue (54A) by using a wiping member having a lower elasticity than that of the electrode on the detached electronic component on which the residue (54A) is present.

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Номер записи: 36