04-07-2023 дата публикации
Номер: CN116373145A
Принадлежит:
The invention belongs to the technical field of semiconductors, and particularly relates to semiconductor processing equipment and a semiconductor processing method.The semiconductor processing equipment comprises a base, a mounting table is fixedly mounted on the upper surface of the base, a set of movable grooves are formed in the surface of the mounting table, and fixing rods are rotationally mounted on the inner walls of the movable grooves; a set of motors are fixedly installed on the surface of the base, threaded rods are fixedly connected to output shafts of the motors, the surfaces of the threaded rods are in threaded connection with binding rings, the motors drive the threaded rods to rotate, the threaded rods drive the binding rings to move in the direction away from the base, the binding rings abut against fixing rods when moving, and the fixing rods are tightened towards the center. The wafer fixing device has the advantages that the fixing rods are arranged on the fixing rods ...
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