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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 6. Отображено 6.
04-04-2023 дата публикации

Fine concrete processing technology

Номер: CN115890906A
Автор: ZHAO YUJUN
Принадлежит:

The invention relates to the technical field of concrete, in particular to a fine concrete processing technology which comprises the following steps: step 1, weighing cement, fine sand, fly ash and ore sand slag; step 2, adding the cement, the fine sand, the fly ash and the ore sand slag which are subjected to weight reduction into a preparation device respectively; 3, stirring and mixing the various raw materials in the preparation device; 4, the mixed raw materials are added into a stirring tank, and then qualified coarse sand and metered water are added into the stirring tank; step 5, moving the stirring tank while stirring; 6, after the stirring tank reaches a construction site, processing of the fine concrete can be completed, finer raw material powder can be rapidly processed through the method, and the time for processing the fine concrete is further shortened.

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Номер записи: 1
14-07-2023 дата публикации

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

Номер: CN116435194A
Автор: TANG QINGYUAN, ZHAO YUJUN
Принадлежит:

The invention relates to an electronic package and a method of manufacturing the same. The electronic package includes a semiconductor die having a first surface and an opposing second surface, a circuit integrated on the semiconductor die, where corresponding terminals electrically connected to the circuit are arranged on both the first surface and the second surface; a conductive element spaced apart from the semiconductor die and having a top surface and a bottom surface; a molded plastic body is cured, the body at least partially encapsulating the semiconductor die and the conductive element and having a top side facing the first surface and a bottom side facing the second surface, a first package terminal at the top side, the first package terminal being electrically connected to the terminal on the first surface, and a second package terminal at the top side, the second package terminal being electrically connected to the terminal on the second surface. The second package terminal ...

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Номер записи: 2
14-07-2023 дата публикации

Semiconductor package substrate made of non-metallic material and manufacturing method thereof

Номер: CN116435284A
Автор: ZHAO YUJUN, YI JUN, LI YUZHUO, BURMEISTER FRANK, TURNER EDWARD
Принадлежит:

The present disclosure proposes a semiconductor package substrate (1) made of a non-metallic material and a method of manufacturing the same, the semiconductor package substrate (1) having a first (top) surface (6), a second (bottom) surface (7) opposite the first surface, and at least one side surface (8), the substrate comprises at least two pads (2) located on a first surface (6) and adapted to receive an electronic component (3), an encapsulation material layer (4) covering the first surface (6), at least two terminals (5) located on a second surface and electrically connected to the pads (2), wherein a portion of at least one of the two terminals (5) is exposed at the at least one side surface (8) and is configured as a wettable flank (9).

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Номер записи: 3
19-05-2023 дата публикации

Substrate-based packaged semiconductor device with wettable sides

Номер: CN116137255A
Автор: ZHAO YUJUN, YEE JANET, LEE LINDA, BURMEISTER FRANK, SCHUTTE JENNIFER, TIERTA JAYA DICKEY, TANG CHARLES
Принадлежит:

The invention relates to a carrier and a substrate-based packaged semiconductor device. The present disclosure also relates to a carrier comprising a plurality of unsingulated substrate-based packaged semiconductor devices and a method of manufacturing the same. In an embodiment according to the present disclosure, the lowermost insulating layer has a cavity disposed adjacent to and associated with one or more package terminals, where an inner wall of the cavity is covered with an electrical conductor connected with a corresponding associated package terminal. Further, the unsingulated substrate-based packaged semiconductor device is separated by a separation region of the substrate, where the cavity is at least partially formed in the separation region.

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Номер записи: 4
13-06-2023 дата публикации

Desulfurization treatment system for low-pressure high-sulfur-content oilfield associated gas

Номер: CN116254139A
Автор: ZHAO YUJUN, HE JUN, ZHU GUOCHENG, ZHANG WENCHAO, BAI JIANFENG, WANG MENG, LIANG XUANJI, QIAO WENBO, ZHANG JUNYAO
Принадлежит:

The invention relates to the technical field of purification of high-sulfur-content associated gas and natural gas, in particular to a low-pressure high-sulfur-content oilfield associated gas desulfurization treatment system which is used for carrying out desulfurization treatment on low-pressure high-sulfur-content oilfield associated gas through a desulfurization separation unit, a regeneration separation unit, a sulfur treatment unit and a desulfurizer storage unit. The corrosion problem of a sulfur-containing oil field ground system is solved, and the safety is improved; the increasing requirement for desulfurization of associated gas of high-concentration H2S is met, and the adaptability of the system is improved; the by-product sulfur of the system meets the standard requirement, and the economic benefit is increased; in addition, the non-aqueous-phase organic iron-based ionic liquid is adopted as a desulfurizing agent, no secondary pollutants are generated in the production process ...

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Номер записи: 5
16-06-2023 дата публикации

Sealed recovery device for associated gas condensate

Номер: CN116262194A
Автор: BAI JIANFENG, WANG QING, WANG HAN, ZHU GUOCHENG, ZHAO YUJUN, LI XINXIN, CAI QIANG, TIAN PENG, ZHU YUAN, CHEN QINGXUAN
Принадлежит:

The invention provides an associated gas condensate closed recovery device. The associated gas condensate closed recovery device comprises an integrated structure of a pipeline type gas-liquid separator, a liquid storage pipe, a Y-shaped filter and a condensate lifting pump. Wherein the pipeline type gas-liquid separator, the liquid storage pipe, the Y-shaped filter and the condensate lifting pump are sequentially connected through all pipelines and valves. Based on the influence of the gas-liquid separation heat exchange area, flow distribution and the like during application, the pipeline type gas-liquid separator provided by the invention adopts a U-shaped tube bundle type structure, so that the associated gas temperature can be reduced to the ground temperature of the buried depth of the pipeline, and condensate precipitation of a gas collecting pipeline and freezing blockage of the pipeline in winter are avoided. The device provided by the invention has the advantages of high gas-liquid ...

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Номер записи: 6