Package and method of forming same

The method includes forming a composite package substrate. Formation of the composite package substrate includes sealing an interconnect die in an encapsulant, wherein the interconnect die includes a plurality of vias therein; and forming a first plurality of redistribution lines (RDLs) and a second plurality of RDLs on opposite sides of the interconnect die. The method further includes bonding the organic package substrate to the composite package substrate; and bonding the first package component and the second package component to the first plurality of RDLs. The first package component and the second package component are electrically interconnected through the interconnect die and the first plurality of RDLs. The embodiment of the invention also relates to a package and a method of forming the same.