22-11-2017 дата публикации
Номер: KR101800306B1
Принадлежит:
HK CO., LTD.
The present invention relates to a laser processing control method comprising: a piercing step, a lead-in step, and a cutting step. In the piercing step, laser beams are radiated from a processing head placed on an upper part of a metal plate in order to form a penetration hole on the metal plate. In the lead-in step, the processing head to radiate the laser beams moves from a penetration hole to a cutting starting point of a cutting proposed line. In the cutting step, the processing head to radiate the laser beams cuts the metal plate in a designated shape while moving along the cutting proposed line. The processing head in the piercing step is placed in a first position which is separated as much as a piercing height toward the upper part of the metal plate. The processing head in the cutting step is placed in a second position which is separated as much as a cutting height, lower than the piercing height, toward the upper part of the metal plate. Upon completion of the piercing step, ...
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