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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 968. Отображено 100.
02-05-2013 дата публикации

SYSTEM AND METHOD TO CACHE HYPERVISOR DATA

Номер: US20130111474A1
Автор: AGARWAL Anurag, JOSHI Prasad, MITRA Anand, RASTOGI Kanishk
Принадлежит: STEC, INC.

Systems and methods for caching data from a plurality of virtual machines are disclosed. In one particular exemplary embodiment, the systems and methods may be realized as a method for caching data from a plurality of virtual machines. The method may comprise detecting, using a computer processor executing cache management software, initiation of migration of a cached virtual machine from a first virtualization platform to a second virtualization platform, disabling caching for the virtual machine on the first virtualization platform, detecting completion of the migration of the virtual machine to the second virtualization platform, and enabling caching for the virtual machine on the second virtualization platform. 1. A method for caching data from a plurality of virtual machines , the method comprising:detecting, using a computer processor executing cache management software, initiation of migration of a cached virtual machine from a first virtualization platform to a second virtualization platform;disabling caching for the virtual machine on the first virtualization platform;detecting completion of the migration of the virtual machine to the second virtualization platform; andenabling caching for the virtual machine on the second virtualization platform.2. The method of claim 1 , wherein the cache management software is implemented on a hypervisor.3. The method of claim 2 , wherein the cache management software is implemented on the hypervisor as a virtual machine and is exposed to the hypervisor as a storage device.4. The method of claim 1 , wherein detection of the completion of the migration of the virtual machine to the second virtualization platform is performed using a computer processor executing cache management software.5. The method of claim 1 , wherein at least one of the first virtualization platform and the second virtualization platform comprises a host.6. The method of claim 1 , further comprising:invalidating, in cache storage, one or more blocks ...

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Номер записи: 1
11-07-2013 дата публикации

Systems and processes of operating fuel cell systems

Номер: US20130177824A1
Автор: Erik Edwin Engwall, Jingyu Cui, John William Johnston, Mahendra Ladharam Joshi, Scott Lee Wellington
Принадлежит: Shell Oil Co

The present invention is directed to systems and processes for operating molten carbonate fuel cell systems. A process for operating the molten carbonate fuel cell includes providing a hydrogen-containing stream comprising molecular hydrogen to a molten carbonate fuel cell anode; heating a hydrocarbon stream, at least a majority of which is comprised of hydrocarbons that are liquid at 20° C. and atmospheric pressure, with a heat source comprising an anode exhaust from the molten carbonate fuel cell anode; contacting at least a portion of the heated hydrocarbon stream with a catalyst to produce a steam reforming feed comprising gaseous hydrocarbons, hydrogen, and at least one carbon oxide; separating at least a portion of the molecular hydrogen from the steam reforming feed; and providing at least a portion of the separated molecular hydrogen to the molten carbonate fuel cell anode as at least a portion of the stream comprising molecular hydrogen.

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Номер записи: 2
03-10-2013 дата публикации

Methods And Apparatus For Synthesizing Multi-Port Memory Circuits

Номер: US20130258757A1
Автор: Chuang Shang-Tse, Iyer Sundar, Joshi Sanjeev, Kablanian Adam, Nguyen Thu
Принадлежит: MEMOIR SYSTEMS, INC.

Multi-port memory circuits are often required within modern digital integrated circuits to store data. Multi-port memory circuits allow multiple memory users to access the same memory cell simultaneously. Multi-port memory circuits are generally custom-designed in order to obtain the best performance or synthesized with logic synthesis tools for quick design. However, these two options for creating multi-port memory give integrated circuit designers a stark choice: invest a large amount of time and money to custom design an efficient multi-port memory system or allow logic synthesis tools to inefficiently create multi-port memory. An intermediate solution is disclosed that allows an efficient multi-port memory array to be created largely using standard circuit cell components and register transfer level hardware design language code. 1. A multi-port static random access memory cell , said multi-port static random access memory cell comprising:a memory element cell, said memory element cell for storing a bit of data;at least one write port cell, each of said write port cells comprising a tri-state buffer, outputs from each of said write port cells coupled to said memory element cell; andat least one read port cell, each of said read port cells comprising a tri-state buffer, coupling said memory element cell to inputs of each of said read port cells.2. The multi-port static random access memory cell as set forth in wherein said memory element cell comprises a bus keeper circuit.3. The multi-port static random access memory cell as set forth in wherein said bus keeper circuit comprises a pair of inverters.4. The multi-port static random access memory cell as set forth in wherein said memory element cell further comprises an output buffer.5. The multi-port static random access memory cell as set forth in wherein said write port cells claim 1 , said memory element cell claim 1 , and said read port cells are standard cells placed in a common circuit row.6. The multi-port ...

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Номер записи: 3
21-11-2013 дата публикации

TWO-PHASE HEAT TRANSFER ASSEMBLIES AND POWER ELECTRONICS MODULES INCORPORATING THE SAME

Номер: US20130308277A1
Автор: Dede Ercan Mehmet, JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A two-phase heat transfer assembly includes a cold plate having an impingement surface, an array of heat generating device coupled to the cold plate, and an array of spray nozzles. The impingement surface has an array of central hydrophilic regions. Each individual central hydrophilic region is surrounded by a hydrophobic perimeter. A wettability of the impingement surface gradually progresses from hydrophilic at each individual central hydrophilic region to hydrophobic at each hydrophobic perimeter. The array of heat generating devices is coupled to a heated surface of the cold plate such that the array of central hydrophilic regions is aligned with the array of heat generating devices. The array of spray nozzles is configured to direct coolant droplets toward the impingement surface. The wettability profile of the impingement surface of the cold plate causes the coolant droplets to move inwardly toward the individual central hydrophilic regions from each hydrophobic perimeter. 1. A two-phase heat transfer assembly comprising:a cold plate comprising an impingement surface, the impingement surface comprising a central hydrophilic region surrounded by a hydrophobic perimeter, wherein a wettability of the impingement surface gradually progresses from hydrophilic at the central hydrophilic region to hydrophobic at the hydrophobic perimeter, and the central hydrophilic region receives a heat flux from a heat generating device coupled to the cold plate; anda spray nozzle configured to direct coolant droplets toward the impingement surface, wherein the wettability of the impingement surface of the cold plate causes the coolant droplets to move inwardly toward the central hydrophilic region from the hydrophobic perimeter.2. The two-phase heat transfer assembly of claim 1 , wherein the cold plate comprises a heated surface opposite from the impingement surface claim 1 , and the heat generating device is coupled to the heated surface opposite from the central hydrophilic ...

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Номер записи: 4
05-12-2013 дата публикации

CONTROLLING A FLUID FLOW WITH A MAGNETIC FIELD

Номер: US20130318962A1
Автор: JOSHI Shailesh N., Lee Jaewook
Принадлежит: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC. (TEMA)

A device, system and method for controlling the fluid flow of a process fluid in a tube with a magnetic field. A ferrogel can be included in the tube with the process fluid. A membrane can encapsulate the ferrogel. A mounting support can secure the membrane within the tube, and a magnetic field generator can generate the magnetic field to deform the membrane and the ferrogel from a natural position to a deformed position. 1. A device , comprising:a tube including a process fluid;a membrane encapsulating a ferrogel;a mounting support to secure the membrane within the tube; anda magnetic field generator to generate a magnetic field to deform the membrane and the ferrogel from a natural position to a deformed position.2. The device according to claim 1 , wherein the membrane has a natural position in the shape of a foil.3. The device according to claim 2 , wherein the magnetic field generator is configured to generate the magnetic field so as to adjust a surface of the foil shaped membrane.4. The device according to claim 3 , wherein the magnetic field generator is configured to selectively modify a first surface of the foil shaped membrane without modifying a second surface of the foil shaped membrane.5. The device according to claim 1 , wherein the magnetic field generator includes:a plurality of individually controlled magnetic field generating sources; anda controller to control operation of the magnetic field generating sources.6. The device according to claim 1 , wherein an elasticity of the membrane returns the membrane and the ferrogel to the natural position after the magnetic field is removed.7. The device according to claim 1 , wherein the membrane and the ferrogel are deformed to a deformed position by the magnetic field so as to modify a flow of the process fluid in the tube.8. The device according to claim 1 , wherein the mounting support secures the membrane to a center of a cross section of the tube.9. The device according to claim 1 , wherein claim 1 , ...

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Номер записи: 5
19-12-2013 дата публикации

MANIFOLD FOR FLOW DISTRIBUTION

Номер: US20130333778A1
Автор: Ferrarese Frank A., Khatavkar Shailesh N., Salikeri Rajesh R.
Принадлежит: AUTOMATIC SWITCH COMPANY

A manifold () comprising an inlet port () for receiving a fluid flow, said inlet port defining a flow passage (); a plurality of outlet ports (-); wherein some of the outlet ports are provided with direct communication with said flow passage (); and the ports being connected by auxiliary passages adapted to convey fluid between said outlet ports to reduce stagnation pressure zones and maintain desired pressure distribution at each outlet port. 1100. A manifold () comprising:{'b': 102', '122, 'an inlet port () for receiving a fluid flow, said inlet port defining a flow passage () for traversing the fluid;'}{'b': 104', '106', '108', '110', '112', '114, 'a plurality of outlet ports (, , , , and ) positioned in linear sets on either side of said flow passage for discharging the fluid flow;'}{'b': 108', '110', '112', '114', '122', '124', '126, 'wherein, some of said plurality of outlet ports (, , and ) in each set are provided with direct operative communication with said flow passage () by means of apertures (, ) adapted to receive the fluid flow; and'}{'b': '128', 'the ports in each set of outlet ports on either side of said flow channel are operatively connected by auxiliary passages (), said auxiliary passages being adapted to convey fluid between said outlet ports to reduce the stagnation pressure zone and maintain a desired pressure distribution at each outlet port.'}2122. The manifold as claimed in claim 1 , wherein each set of outlet ports consists of three outlet ports on each side of said flow passage ().3104106102122. The manifold as claimed in claim 2 , wherein outlet ports ( claim 2 , ) nearest to said inlet port () are not in direct operative communication with said flow passage ().4108110122124. The manifold as claimed in claim 2 , wherein outlet ports ( claim 2 , ) are in direct operative communication with said flow passage () by means of a first aperture ().5112114122126. The manifold as claimed in claim 2 , wherein outlet ports ( claim 2 , ) are in ...

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Номер записи: 6
26-12-2013 дата публикации

DIAPHRAGM PUMP

Номер: US20130343913A1
Автор: Dede Ercan Mehmet, JOSHI Shailesh N., Lee Jaewook
Принадлежит: Toyota Motor Eng. & Mtfg. North America

An apparatus that includes a chamber. The chamber includes an inlet via which process fluid enters the chamber and an outlet via which the process fluid exits the chamber. A diaphragm is fixed in position in the chamber at a periphery of the diaphragm. The diaphragm includes a magnetic fluid therein. 1. An apparatus , comprising:a chamber;an inlet via which process fluid enters the chamber;an outlet via which the process fluid exits the chamber; anda diaphragm including a magnetic fluid therein, a periphery of the diaphragm being fixed in position in the chamber.2. The apparatus according to claim 1 , further comprising a magnetic field source that creates a magnetic field claim 1 , in response to which the diaphragm flexes to pump the process fluid through the chamber.3. The apparatus according to claim 1 , wherein the diaphragm is filled with the magnetic fluid.4. The apparatus according to claim 1 , wherein the diaphragm flexes in response to a magnetic field claim 1 , andwherein an intensity of the magnetic field determines a magnitude of flexure of the diaphragm.5. The apparatus according to claim 1 , wherein the diaphragm encloses a portion of the chamber and flexes in opposite directions claim 1 , depending on a magnetic field created near the diaphragm claim 1 , so as to increase or decrease a volume of the portion of the chamber claim 1 , thereby pumping the process fluid through the portion of the chamber claim 1 , andwherein when the volume of the portion of the chamber increases, the process fluid is drawn into the chamber, and when the volume of the portion of the chamber decreases, the process fluid is expelled from the chamber.6. The apparatus according to claim 1 , wherein the inlet includes a unidirectional valve.7. The apparatus according to claim 1 , wherein the outlet includes a unidirectional valve.8. The apparatus according to claim 1 , wherein the inlet and the outlet are disposed on a portion of a wall of the chamber claim 1 , the portion of ...

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Номер записи: 7
30-01-2014 дата публикации

ELECTRONIC DEVICE ASSEMBLIES AND VEHICLES EMPLOYING DUAL PHASE CHANGE MATERIALS

Номер: US20140029203A1
Автор: Dede Ercan Mehmet, JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor device having a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state, a coolant fluid thermally coupled to the surface of the semiconductor device, and a phase change material thermally coupled to the surface of the semiconductor device. The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state. 1. An electronic device assembly comprising:a semiconductor device comprising a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state;a coolant fluid thermally coupled to the surface of the semiconductor device; anda phase change material thermally coupled to the surface of the semiconductor device, the phase change material having a phase change temperature at which the phase change material changes from a first phase to a second phase, wherein the phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state.2. The electronic device assembly of claim 1 , wherein the phase change material is a solid when it is at a temperature below the phase change temperature.3. The electronic device assembly of claim 2 , further comprising one or more thermally conductive features thermally coupled to the surface of the semiconductor device claim 2 , wherein the phase change material is disposed within the one or more thermally conductive features.4. The electronic device assembly of claim 3 , wherein the one or more thermally conductive features are located at one or more edges of the surface of the semiconductor device.5. The ...

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Номер записи: 8
07-01-2016 дата публикации

A process for preparation of (2S, 5R)-7-oxo-6-sulphooxy-2-[((3R)-piperidine-3-carbonyl)-hydrazino carbonyl]-1,6-diaza-bicyclo [3.2.1]-octane

Номер: US20160002235A1
Автор: AHIRRAO Vinod Kashinath, Bhawsar Satish, Deshpande Prasad Keshav, Jadhav Sunil Bhaginath, Joshi Sanjeev, PATEL Mahesh Vithalbhai, Pawar Shivaji Sampatrao, WANKHEDE Karuna Suresh, YEOLE Ravindra Dattatraya
Принадлежит:

A process for preparation of (2S,5R)-7-oxo-6-sulphooxy-2-[((3R)-piperidine-3-carbonyl)-hydrazino carbonyl]-1,6-diaza-bicyclo[3.2.1]octane of Formula (I) is disclosed which is comprising reacting a compound of Formula (II) with a compound of Formula (III) to obtain a compound of Formula (IV). Crystalline compounds of Formula (I) are claimed. 2. A process according to claim 1 , wherein the reaction of a compound of Formula (II) with a compound of Formula (III) to obtain a compound of Formula (IV) is carried out in presence of 1-hydroxybenzotriazole and 1-ethyl-3-(3-dimethylaminopropyl) carbodiimide hydrochloride.3. A process according to claim 1 , wherein the reaction of a compound of Formula (II) with a compound of Formula (III) to obtain a compound of Formula (IV) is carried out in presence of water as a solvent.4. A process according to claim 1 , wherein the hydrogenolysis of a compound of Formula (IV) to obtain a compound of Formula (V) is carried out in presence of a transition metal catalyst and a hydrogen source.5. A process according to claim 4 , wherein the transition metal catalyst is palladium on carbon and hydrogen source is hydrogen gas.6. A process according to claim 1 , wherein the sulfonation of a compound of Formula (V) to obtain a compound of Formula (VI) is carried out by reacting a compound of Formula (V) with sulfur trioxide-pyridine complex claim 1 , followed by treatment with tetra butyl ammonium hydrogen sulfate.7. A process according to claim 1 , wherein a compound of Formula (VI) is converted to a compound of Formula (I) by reacting a compound of Formula (VI) with trifluoroacetic acid.8. A compound of Formula (I) in a crystalline form.9. A compound of Formula (I) according to claim 8 , having an X-ray powder diffraction pattern comprising a peak selected from the group consisting of 10.28 (±0.2) claim 8 , 10.57 (±0.2) claim 8 , 12.53 (±0.2) claim 8 , 13.82 (±0.2) claim 8 , 15.62 (±0.2) claim 8 , 18.16 (±0.2) claim 8 , 18.49 (±0.2) claim 8 , ...

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Номер записи: 9
01-01-2015 дата публикации

Nitrogen containing compounds

Номер: US20150005285A1
Автор: Bhagwat Sachin, Bhawasar Satish, Deshpande Prasad Keshav, GUPTA Sunil, Jafri Mohammad Alam, Joshi Sanjeev, Kale Rajesh, Mishra Amit, PATEL Mahesh Vithalbhai, PAVASE Laxmikant
Принадлежит: WOCKHARDT LIMITED

Compounds of Formula (I), their preparation and use in preventing or treating bacterial infection is disclosed. 130-. (canceled)32. A method according to claim 31 , wherein the compound of Formula (I) is selected from:trans-sulfuric acid mono-[2-(N′-[(S)-pyrrolidin-2-carbonyl]-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′((R)-piperidin-3-carbonyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-hydrazinocarbonyl-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-(amino-acetyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-(3-amino-propioyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-(4-amino-butanoyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-((2S)-2-amino-3-hydroxy-propioyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-[(2S,4S)-4-fluoro-pyrrolidin-2-carbonyl]-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-[(2S,4R)-4-methoxy-pyrrolidin-2-carbonyl]-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-(piperidin-4-carbonyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-((RS)-piperidin-3-carbonyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-((S)-piperidin-3-carbonyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-((RS)-piperidin-2-carbonyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-((S)-piperidin-2-carbonyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-((R)-piperidin-2-carbonyl)-hydrazinocarbonyl)-7-oxo-1, ...

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Номер записи: 10
07-01-2016 дата публикации

METHODS AND APPARATUS FOR TESTING AND REPAIRING DIGITAL MEMORY CIRCUITS

Номер: US20160005493A1
Автор: Iyer Sundar, Joshi Sanjeev, Nazar Shadab
Принадлежит:

An ActiveTest solution for memory is disclosed which can search for memory errors during the operation of a product containing digital memory. The ActiveTest system tests memory banks that are not being accessed by normal memory users in order to continually test the memory system in the background. When there is a conflict between the ActiveTest system and a memory user, the memory user is generally given priority. 1. A memory test system comprising:a set of memory banks;a pointer configured to point to a next memory bank in the set of memory banks to be tested such that said next memory bank is skipped when a memory access is currently blocking access said next memory bank;a first deficit bank pointer configured to identify a first deficit memory bank among the set of memory banks that has been skipped due to a blocking memory access; anda first deficit counter associated with said first deficit bank pointer, said first deficit counter configured to store a count of a number of times that said first deficit memory bank has been skipped for testing;wherein said first deficit memory bank identified by said first deficit bank pointer is given priority for testing over said next memory bank pointed to by said pointer when said first deficit counter is not zero.2. The memory test system as set forth in claim 1 , further comprising a memory row pointer for each memory bank in said set of memory banks.3. The memory test system as set forth in claim 1 , wherein said first deficit bank counter is decremented upon testing said first deficit memory bank identified by said first deficit bank pointer.4. The memory test system as set forth in claim 1 , wherein said pointer is incremented upon testing said next memory bank identified by said pointer.5. The memory test system as set forth in claim 1 , further comprising:a second deficit bank pointer configured to identify a second deficit memory bank that has been blocked from a recent testing attempt; anda second deficit counter ...

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Номер записи: 11
02-01-2020 дата публикации

POWER ELECTRONICS ASSEMBLIES WITH CIO BONDING LAYERS AND DOUBLE SIDED COOLING, AND VEHICLES INCORPORATING THE SAME

Номер: US20200006198A1
Автор: Dede Ercan Mehmet, JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A 2-in-1 power electronics assembly includes a frame with a lower dielectric layer, an upper dielectric layer spaced apart from the lower dielectric layer, and a sidewall disposed between and coupled to the lower dielectric layer and the upper dielectric layer. The lower dielectric layer includes a lower cooling fluid inlet and the upper dielectric layer includes an upper cooling fluid outlet. A first semiconductor device assembly and a second semiconductor device assembly are included and disposed within the frame. The first semiconductor device is disposed between a first lower metal inverse opal (MIO) layer and a first upper MIO layer, and the second semiconductor device is disposed between a second lower MIO layer and a second upper MIO layer. An internal cooling structure that includes the MIO layers provides double sided cooling for the first semiconductor device and the second semiconductor device. 1. An electronic assembly comprising:a lower MIO layer;an upper MIO layer; and a lower surface of the semiconductor device is bonded to an upper surface of the lower MIO layer; and', 'an upper surface of the semiconductor device is bonded to a lower surface of the upper MIO layer., 'a semiconductor device, wherein2. The electronic assembly of claim 1 , further comprising an isolating MIO layer claim 1 , wherein the isolating MIO layer is spaced apart from the lower MIO layer.3. The electronic assembly of claim 2 , wherein the isolating MIO layer is bonded to the lower surface of the semiconductor device.4. The electronic assembly of claim 1 , further comprising an isolating MIO layer claim 1 , wherein the isolating MIO layer is spaced apart from the upper MIO layer.5. The electronic assembly of claim 4 , wherein the isolating MIO layer is bonded to the upper surface of the semiconductor device.6. The electronic assembly of claim 1 , wherein:the lower MIO layer is bonded to a lower dielectric layer; andthe upper MIO layer is bonded to an upper dielectric layer.7. ...

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Номер записи: 12
08-01-2015 дата публикации

Cooling Assemblies Having Porous Three Dimensional Surfaces

Номер: US20150007965A1
Автор: JOSHI Shailesh N.
Принадлежит:

Cooling assemblies including a porous three dimensional surface such as a heat sink are disclosed. In one embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface, a metal mesh bonded to a surface of the thermally conductive fin, and sintered metal particles bonded to the metal mesh and the surface of the thermally conductive fin. The metal mesh defines a macro-level porosity, and the sintered metal particles define a micro-level porosity. In another embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface of the heat transfer substrate, and sintered metal particles bonded to the surface of the thermally conductive fin. An average diameter of the sintered metal particles increases from a base of the thermally conductive fin to a top of the thermally conductive fin. 1. A cooling assembly comprising:a heat transfer substrate having a surface;a thermally conductive fin extending from the surface of the heat transfer substrate; andsintered metal particles bonded to the surface of the thermally conductive fin, wherein the sintered metal particles define a micro-level porosity, and an average diameter of the sintered metal particles increases from a base of the thermally conductive fin to a top of the thermally conductive fin.2. The cooling assembly of claim 1 , wherein the thermally conductive fin is an individual thermally conductive fin of an array of thermally conductive fins extending from the surface of the heat transfer substrate claim 1 , and the sintered metal particles are bonded to each thermally conductive fin of the array of thermally conductive fins.3. The cooling assembly of claim 2 , wherein the sintered metal particles are bonded to the surface of the heat transfer substrate between adjacent thermally conductive fins of the array of thermally conductive fins.4. The cooling assembly of claim 1 , ...

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Номер записи: 13
08-01-2015 дата публикации

Cooling Assemblies and Power Electronics Modules Having Multiple-Porosity Structures

Номер: US20150009631A1
Автор: JOSHI Shailesh N.
Принадлежит:

Cooling assemblies and power electronics modules having multiple-level porosity structures with both a micro- and macro-level porosity are disclosed. In one embodiment, a cooling assembly includes a jet impingement assembly including a fluid inlet channel fluidly coupled an array of orifices provided in a jet plate, and a heat transfer substrate having a surface. The heat transfer substrate is spaced apart from the jet plate. A first array of metal fibers is bonded to the surface of the heat transfer substrate in a first direction, and a second array of metal fibers is bonded to the first array of metal fibers in a second direction. Each metal fiber of the first array of metal fibers and the second array of metal fibers includes a plurality of metal particles defining a micro-porosity. The first array of metal fibers and the second array of metal fibers define a macro-porosity. 1. A cooling assembly comprising:a heat transfer substrate having a surface;a first array of metal fibers bonded to the surface of the heat transfer substrate in a first direction; each metal fiber of the first array of metal fibers and the second array of metal fibers comprises a plurality of metal particles defining a micro-porosity; and', 'the first array of metal fibers and the second array of metal fibers define a macro-porosity., 'a second array of metal fibers bonded to the first array of metal fibers in a second direction, wherein2. The cooling assembly of claim 1 , wherein the second direction is orthogonal to the first direction.3. The cooling assembly of claim 1 , wherein individual metal particles of the first array of metal fibers have a size that is smaller than a size of individual metal particles of the second array of metal fibers.4. The cooling assembly of claim 1 , wherein individual metal particles of the plurality of metal particles of the first array of metal fibers and the second array of metal fibers have a size between about 10 μm and about 100 μm.5. The cooling ...

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Номер записи: 14
11-01-2018 дата публикации

SWITCHABLE RADIATIVE ENERGY HARVESTING SYSTEMS

Номер: US20180010505A1
Автор: Banerjee Debasish, Honnikoppa Shashi, JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

Switchable radiative energy harvesting systems and methods of harvesting radiation are disclosed. A system includes an optical filter that includes at least one of an active material and a passive material. The optical filter is switchable between a shield mode and a harvesting mode such that the at least one of the active material and the passive material is in a reflecting state during the shield mode such that the optical filter blocks passage of radiation from a thermal emitter to a thermophotovoltaic cell and a transmitting state during the harvesting mode such that that the optical filter allows the radiation to pass from the thermal emitter to the thermophotovoltaic cell. 1. A switchable radiative energy harvesting system comprising:an optical filter comprising at least one of an active material and a passive material, a reflecting state during the shield mode such that the optical filter blocks passage of radiation from a thermal emitter to a thermophotovoltaic cell, and', 'a transmitting state during the harvesting mode such that that the optical filter allows the radiation to pass from the thermal emitter to the thermophotovoltaic cell., 'wherein the optical filter is switchable between a shield mode and a harvesting mode such that the at least one of the active material and the passive material is in2. The switchable radiative energy harvesting system of claim 1 , wherein the optical filter is arranged in a stack having the active material and the passive material layered between one another.3. The switchable radiative energy harvesting system of claim 1 , wherein the optical filter comprises the active material and the passive material.4. The switchable radiative energy harvesting system of claim 1 , further comprising a first contact claim 1 , a second contact claim 1 , and an electrical conductor electrically coupled between the first contact and the second contact claim 1 , wherein the optical filter is positioned between the first contact and the ...

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Номер записи: 15
12-01-2017 дата публикации

Systems of Bonded Substrates and Methods for Bonding Substrates with Bonding Layers

Номер: US20170012016A1
Автор: JOSHI Shailesh N., Noguchi Masao
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A first substrate may be bonded to a second substrate in a method that may include providing the first substrate, providing a second substrate, providing a bonding layer precursor, positioning the bonding layer precursor between the first substrate and the second substrate, and bonding the first substrate to the second substrate by heating the bonding layer precursor to form a bonding layer. The first substrate may include a bonding surface, and a geometry of the bonding surface of the first substrate may include a plurality of microchannels. The second substrate may include a complementary bonding surface and the bonding layer precursor may include a metal. The bonding layer may fill the microchannels of the first substrate and may contact substantially the entire bonding surface of the first substrate. 1. A method for bonding a first substrate to a second substrate , the method comprising:providing the first substrate comprising a bonding surface comprising a plurality of microchannels spaced apart from one another such that one or more portions of the bonding surface of the first substrate are the microchannels and other portions of the bonding surface are positioned between the microchannels;providing the second substrate comprising a complementary bonding surface;providing a bonding layer precursor comprising a metal;positioning the bonding layer precursor between the first substrate and the second substrate, wherein the first surface of the bonding layer precursor is in contact with at least a portion of the bonding surface of the first substrate, and the second surface of the bonding layer precursor is in contact with at least a portion of the complementary bonding surface of the second substrate; andbonding the first substrate to the second substrate by heating the bonding layer precursor to form a bonding layer, wherein the bonding layer fills the microchannels of the first substrate and contacts substantially the entire bonding surface of the first ...

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Номер записи: 16
14-01-2021 дата публикации

METAL INVERSE OPAL SUBSTRATE WITH INTEGRATED JET COOLING IN ELECTRONIC MODULES

Номер: US20210013126A1
Автор: JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

Embodiments of the disclosure relate to an MIO substrate with integrated jet cooling for electronic modules and a method of forming the same. In one embodiment, a substrate for an electronic module includes a thermal compensation base layer having an MIO structure and a cap layer overgrown on the MIO structure. A plurality of orifices extends through the thermal compensation base layer between an inlet face and an outlet face positioned opposite to the inlet face, defining a plurality of jet paths. A plurality of integrated posts extends outward from the cap layer, wherein each integrated post of the plurality of integrated posts is positioned on the outlet face between each orifice of the plurality of orifices. 1. A substrate for an electronic module , the substrate comprising:a thermal compensation base layer comprising a metal inverse opal (MIO) structure and a cap layer overgrown on the MIO structure;a plurality of orifices extending through the thermal compensation base layer between an inlet face and an outlet face positioned opposite to the inlet face, the plurality of orifices defining a plurality of jet paths; anda plurality of integrated posts extending outward from the cap layer, wherein each integrated post of the plurality of integrated posts is positioned on the outlet face between each orifice of the plurality of orifices.2. The substrate of claim 1 , wherein the metal of the MIO structure comprises copper claim 1 , nickel claim 1 , aluminum claim 1 , silver claim 1 , zinc claim 1 , magnesium claim 1 , or alloys thereof.3. The substrate of claim 1 , wherein the MIO structure further comprises a plurality of voids and a predefined porosity.4. The substrate of claim 1 , wherein:the MIO structure comprises a plurality of core-shell phase change (PC) particles encapsulated therein; and a core comprising a phase change material (PCM) with a melting point between about 100° C. and about 250° C.; and', 'a shell comprising a shell material having a melting ...

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Номер записи: 17
14-01-2021 дата публикации

FLEXIBLE ELECTRONIC ASSEMBLY FOR PLACEMENT ON A VEHICLE MOTOR ASSEMBLY

Номер: US20210014958A1
Автор: JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

Embodiments of the disclosure relate to flexible electronic substrates for placement on an external surface of a vehicle motor assembly. In one embodiment, a motor assembly includes a motor comprising an external surface and one or more electronic assemblies positioned on the external surface of the motor. Each electronic assembly includes a metal substrate disposed on the external surface of the motor, a dielectric layer disposed on the metal substrate, a flexible metal base layer disposed on the dielectric layer, a bonding layer disposed on the flexible metal base layer, and one or more electronic devices disposed on the bonding layer. The bonding layer bonds the one or more electronic devices to the flexible metal base layer. 1. An electronic assembly comprising:a metal substrate directly disposed on a curved surface;a dielectric layer disposed on the metal substrate;a flexible metal base layer disposed on the dielectric layer;a bonding layer disposed on the flexible metal base layer; andone or more electronic devices disposed on the bonding layer, wherein the bonding layer bonds the one or more electronic devices to the flexible metal base layer.2. The electronic assembly of claim 1 , wherein the metal substrate comprises copper claim 1 , nickel claim 1 , aluminum or alloys thereof.3. The electronic assembly of claim 1 , wherein the dielectric layer comprises aluminum oxide claim 1 , aluminum nitride claim 1 , silicon nitride claim 1 , beryllium oxide or silicon carbide.4. The electronic assembly of claim 1 , wherein:the flexible metal base layer comprises a stress buffer layer disposed on the dielectric layer and an encapsulating layer encapsulating the stress buffer layer; anda melting temperature of the encapsulating layer is higher than a melting temperature of the stress buffer layer and a maximum operating temperature of the one or more electronic devices.5. The electronic assembly of claim 4 , wherein the stress buffer layer comprises indium claim 4 , tin ...

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Номер записи: 18
16-01-2020 дата публикации

Glass-ceramic articles with increased resistance to fracture and methods for making the same

Номер: US20200017399A1
Автор: Alana Marie Whittier, Andrew Peter Kittleson, Carol Ann Click, Charlene Marie Smith, Dhananjay Joshi, Indrajit Dutta, James Clark Walck, JR., James Howard Edmonston, Jill Marie Hall, John Robert SALTZER, Jr., Mathieu Gerard Jacques HUBERT, Matthew Artus Tuggle, Matthew Daniel Trosa, Michael S. Fischer, Ozgur Gulbiten, Qiang Fu, Rohit Rai, Zheming ZHENG
Принадлежит: Corning Inc

A glass-ceramic article having one or more crystalline phases; a residual glass phase; a compressive stress layer extending from a first surface to a depth of compression (DOC); a maximum central tension greater than 70 MPa; a stored tensile energy greater than 22 J/m2; a fracture toughness greater than 1.0 MPa√m; and a haze less than 0.2.

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Номер записи: 19
17-04-2014 дата публикации

Methods and Apparatus for Designing and Constructing High-Speed Memory Circuits

Номер: US20140104960A1
Автор: Chuang Shang-Tse, Iyer Sundar, Joshi Sanjeev, Kablanian Adam, Nguyen Thu
Принадлежит:

Static random access memory (SRAM) circuits are used in most digital integrated circuits to store digital data bits. SRAM memory circuits are generally read by decoding an address, reading from an addressed memory cell using a set of bit lines, outputting data from the read memory cell, and precharging the bit lines for a subsequent memory cycle. To handle memory operations faster, a bit line multiplexing system is proposed. Two sets of bit lines are coupled to each memory cell and each set of bit lines are used for memory operations in alternating memory cycles. During a first memory cycle, a first set of bit lines accesses the memory array while precharging a second set of bit lines. Then during a second memory cycle following the first memory cycle, the first set of bit lines are precharged while the second set of bit lines accesses the memory array to read data. 1. A high-speed digital memory system for storing data bits , said high-speed digital memory system comprising:a plurality of memory cells, each of said plurality of memory cells storing a bit of data;a first set of bit lines coupled to said plurality of memory cells for accessing said bit of data stored in said plurality of memory cells, said first set of bit lines coupled to said plurality of memory cells using a first set of word lines;a second set of bit lines coupled to said plurality of memory cells for accessing said bit of data stored in said plurality of memory cells, said second set of bit lines coupled to said plurality of memory cells using a second set of word lines; anda memory control system, said memory control system accessing a first target memory cell in said plurality of memory cells using said first set of bit lines while precharging said second set of bit lines during a first memory cycle, said memory control system accessing a second target memory cell in said plurality of memory cells using said second set of bit lines while precharging said first set of bit lines during a second ...

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Номер записи: 20
10-02-2022 дата публикации

ILLUMINATION APPARATUS

Номер: US20220039642A1
Автор: Joshi Shirish, Ketkale Sourabh
Принадлежит: Maxer Endoscopy GmbH

An illumination apparatus () for illuminating the operating field during open surgery with radiation to cause fluorescence, the apparatus including a main body () including an opening () configured to release the radiation (), is characterized by an attachment unit or assembly () for removably attaching the main body () sideways to an endoscope (). 111. Illumination apparatus () for illuminating the operating field during open surgery with radiation to cause fluorescence , the apparatus () comprising{'b': 2', '3', '18, 'a main body () comprising an opening () configured to release the radiation (),'}{'b': '1', 'wherein the apparatus () comprises'}{'b': 4', '2', '5, 'attachment means () for attaching the main body () sideways to an endoscope imager ().'}214. Illumination apparatus () according to claim 1 , wherein the attachment means () are selected from the group consisting of snap-on means claim 1 , clip-on-means claim 1 , strapping-on-means claim 1 , positive-locking means claim 1 , screw-means claim 1 , silicone rubber or other non-permanent adhesive means.312. Illumination apparatus () according to claim 1 , wherein the main body () comprises a radiation source which provides the radiation.412. Illumination apparatus () according to claim 1 , wherein the main body () is connected to a radiation source which provides the radiation.5126. Illumination apparatus () according to claim 1 , wherein the main body () comprises finger accommodation means ().6115. Illumination apparatus () according to claim 1 , wherein the main body comprises means () allowing it to be connected to a stand or a robotic arm or a semi-automatic arm.713. Illumination apparatus () according to claim 1 , wherein a filter is inserted in the opening () which allows only the radiation used to cause fluorescence to pass.8115. Illumination apparatus () according to claim 1 , further comprising means for varying the inclination of the radiation exiting the illumination apparatus () when it is ...

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Номер записи: 21
23-01-2020 дата публикации

Carbohydrate-binding small molecules with antiviral activity

Номер: US20200024265A1
Автор: Adam B. Braunschweig, Anjali Joshi, Himanshu Garg, Kalanidhi Palanichamy, M. Fernando Bravo, Milan A. Shlain
Принадлежит: Research Foundation Of City University of New York, Texas Tech University System

A variety of heteroaromatic groups have been found to be biologically active against the Zika (ZIKV) virus. In some embodiments, a dimeric compound is provided with each monomer linked by a repeating glycol linking group.

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Номер записи: 22
31-01-2019 дата публикации

SERVICING SCHEDULE METHOD BASED ON PREDICTION OF DEGRADATION IN ELECTRIFIED VEHICLES

Номер: US20190035170A1
Автор: DEDE Ercan M., JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A method includes collecting, via processing circuitry, a first set of multi-load data from a power control unit of a vehicle and usage data at a first servicing of the vehicle, computing, via the processing circuitry, a Mahalanobis Distance (MD) using the first set of multi-load data, defining, via the processing circuitry, a healthy state and an anomaly threshold based on the MD, correlating, via the processing circuitry, the first set of usage data to the anomaly threshold; generating, via the processing circuitry, a usage based servicing schedule for a vehicle; collecting, via the processing circuitry, a next set of multi-load data and usage data at a next servicing of the vehicle; updating, via the processing circuitry, the MD, a servicing schedule and evaluating the performance of the vehicle; determining, via the processing circuitry, whether the MD crosses the anomaly threshold; and transmitting, via a network, a servicing alert. 1. A method for generating a servicing schedule of an electrified vehicle , the method comprising:collecting, via processing circuitry, a first set of multi-load data from a power control unit of a vehicle and usage data at a first servicing of the vehicle;computing, via the processing circuitry, a Mahalanobis Distance (MD) using the first set of multi-load data;defining, via the processing circuitry, a healthy state and an anomaly threshold based on the MD;correlating, via the processing circuitry, the first set of usage data to the anomaly threshold;generating, via the processing circuitry, a usage based servicing schedule for a vehicle;collecting, via the processing circuitry, a next set of multi-load data and usage data at a next servicing of the vehicle;updating, via the processing circuitry, the MD, a servicing schedule and evaluating the performance of the vehicle;determining, via the processing circuitry, whether the MD crosses the anomaly threshold; andtransmitting, via a network, a servicing alert upon exceeding the ...

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Номер записи: 23
12-02-2015 дата публикации

JET IMPINGEMENT COOLING APPARATUSES HAVING ENHANCED HEAT TRANSFER ASSEMBLIES

Номер: US20150043164A1
Автор: JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

Enhanced heat transfer assemblies and jet impingement cooling apparatuses having target surfaces with surface fins and microslots are disclosed. In one embodiment, an enhanced heat transfer assembly includes a target surface, a plurality of surface fins extending from the target surface, and a plurality of microslot matrices formed on the target surface. Each microslot matrix includes individual microslots positioned adjacent to each other, and each microslot matrix is adjacent to a jet impingement zone and at least one of the plurality of surface fins. Jet impingement cooling apparatuses and power electronics modules haying an enhanced heat transfer assembly with surface fins and matrices of microslots are also disclosed. 1. An enhanced heat transfer assembly comprising:a target surface;a plurality of surface fins extending from the target surface; and each microslot matrix comprises individual microslots positioned adjacent to each other, and', 'each microslot matrix is adjacent to a jet impingement zone and at least one of the plurality of surface fins., 'a plurality of microslot matrices formed on the target surface wherein2. The enhanced heat transfer assembly of claim 1 , wherein the individual microslots have a uniform length claim 1 , a uniform width claim 1 , and a uniform depth.3. The enhanced heat transfer assembly of claim 1 , wherein the individual microslots are non-uniform.4. The enhanced heat transfer assembly of claim 1 , wherein the individual microslots are linear.5. The enhanced heat transfer assembly of claim 1 , wherein the individual microslots are substantially parallel to the plurality of surface fins.6. The enhanced heat transfer assembly of claim 1 , wherein the plurality of surface fins is defined by straight surface fins arranged in a radial configuration around the jet impingement zone.7. The enhanced heat transfer assembly of claim 1 , wherein the target surface is comprised of copper or aluminum.8. A cooling apparatus comprising:a ...

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Номер записи: 24
03-03-2022 дата публикации

COOLING ASSEMBLIES HAVING CHANNELS TO SUPPLY FLUID TO WICK STRUCTURES

Номер: US20220065549A1
Автор: Fujioka Hitoshi, JOSHI Shailesh N., Lohan Danny J., Nagai Shohei, Ukegawa Hiroshi, Zhou Feng
Принадлежит:

A cooling assembly includes a housing defining a fluid chamber, wick structures arranged on an interior surface of the fluid chamber such that one or more flow channels are present therebetween, and a divider. The divider includes an outer frame comprising a first side and a second side and one or more bridging supports extending between and connecting the first side and the second side of the outer frame. The one or more bridging supports are aligned with the one or more flow channels between the wick structures. Each one of the one or more bridging supports define a plurality of vapor flow paths extending therethrough. The one or more bridging supports further define a plurality of vapor spaces between the one or more bridging supports that are aligned with the wick structures. The plurality of vapor flow paths are fluidly coupled to the vapor spaces. 1. A cooling assembly , comprising:a housing defining a fluid chamber;a plurality of wick structures arranged on an interior surface of the fluid chamber such that one or more flow channels are present between the plurality of wick structures; and an outer frame comprising a first side and a second side, and', 'one or more bridging supports extending between and connecting the first side and the second side of the outer frame, the one or more bridging supports aligned with the one or more flow channels between the plurality of wick structures, each one of the one or more bridging supports defining a plurality of vapor flow paths extending therethrough, the one or more bridging supports further defining a plurality of vapor spaces between the one or more bridging supports that are aligned with the plurality of wick structures, wherein the plurality of vapor flow paths are fluidly coupled to the vapor spaces., 'a divider comprising2. The cooling assembly of claim 1 , further comprising:a second plurality of wick structures arranged on an second interior surface facing the interior surface of the fluid chamber such that ...

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Номер записи: 25
14-02-2019 дата публикации

METHOD AND SYSTEM FOR CONTROLLING AN INTEGRATED STARTER-GENERATOR

Номер: US20190048839A1
Автор: AMIT Dixit, ANAYKUMAR Joshi
Принадлежит:

The invention relates to a method for controlling an integrated starter-generator, including receiving a start signal; determining an initial position of a rotor with respect to a stator phase winding integrated starter-generator of the integrated starter-generator; applying a pulse-width-modulated signal to the stator winding corresponding to determined initial position of the rotor; measuring current of the stator winding in response to applied pulse-width-modulated signal to determine current variation; if current variation is more than a threshold value, determining updated rotor position and applying a pulse-width-modulated signal to the stator winding corresponding to the updated rotor position; determining speed of the rotor, if speed of the rotor is more than a threshold value, monitoring a trigger signal from an ignition trigger sensor coupled to the engine; and if the trigger signal is received, determining the updated rotor position and exciting the stator winding corresponding to the updated rotor position. 1. A method for controlling an integrated starter-generator , the integrated starter-generator coupled to an internal combustion engine and comprises a rotor having a plurality of permanent magnet poles , and a stator having a plurality of phase windings disposed on the stator , each phase winding including a plurality of coils , the method comprising the steps of:receiving a start signal;determining an initial position of the rotor with respect to a stator phase winding;applying a pulse-width-modulated signal to the stator winding corresponding to determined initial position of the rotor;measuring current of the stator winding in response to applied pulse-width-modulated signal to determine current variation;if current variation is more than a threshold value, determining updated rotor position and applying a pulse-width-modulated signal to the stator winding corresponding to the updated rotor position;determining speed of the rotor, if speed of the ...

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Номер записи: 26
21-02-2019 дата публикации

LAWNMOWER ATTACHMENT ASSEMBLY

Номер: US20190053428A1
Автор: HAGLER Ty, JOSHI Prasad, Murphy Patrick, Parker Timmy J., Peeples Seth, Wallace James B.
Принадлежит:

The assembly described herein is secured to lawn equipment for adding additional functionality, such as weed eating. The assembly includes a base having at least one base bracket for selectively coupling the assembly to the lawn equipment. Further, a stem is included having a stem bracket coupled to the base, a stem housing extending from the stem bracket, and a shoulder in rotational engagement with the stem housing. For maneuvering the assembly, an arm is pivotally engaged with the shoulder of the stem and pivotally coupled to the arm actuator. The arm may be radially, angularly and translatably repositioned during use. 1. An assembly for use with lawn equipment , comprising:a base including at least one base bracket for selectively coupling the assembly to the lawn equipment;a stem including a stem bracket coupled to the base, a stem housing extending from the stem bracket, and a shoulder in rotational engagement with the stem housing; andan arm pivotally engaged with the shoulder of the stem and pivotally coupled to the arm actuator.2. The assembly of claim 1 , wherein the rail defines tracks for permitting translation of the stem.3. The assembly of claim 1 , wherein the stem includes a stem bracket defining a top portion conformed to a top side of the rail claim 1 , a bottom conformed to a bottom side of the rail claim 1 , and side portion extending between the top portion and the bottom portion.4. The assembly of claim 3 , further including rack fasteners extending through tracks defined by the rails and apertures defined by the stem bracket.5. The assembly of claim 1 , wherein the base bracket further includes:a clamp for partially enwrapping a portion of a deck of the lawn equipment;a flap pivotally coupled to the clamp for completely enwrapping a portion of the deck;a base fastener for locking the flap into position.6. The assembly of claim 1 , wherein the stem further includes a stem handle for adjusting a height of the stem.7. The assembly of claim 1 , ...

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Номер записи: 27
04-03-2021 дата публикации

COOLING SYSTEMS COMPRISING PASSIVELY AND ACTIVELY EXPANDABLE VAPOR CHAMBERS FOR COOLING POWER SEMICONDUCTOR DEVICES

Номер: US20210063088A1
Автор: JOSHI Shailesh N., Sudhaker Srivathsan
Принадлежит:

A cooling system that includes an expandable vapor chamber having a condenser side opposite an evaporator side, a condenser side wick coupled to a condenser side wall, an evaporator side wick coupled to an evaporator side wall, and a vapor core positioned between the evaporator side wick and the condenser side wick. The cooling system also includes a vapor pressure sensor communicatively coupled to a controller and a bellow actuator disposed in the vapor core and communicatively coupled to the controller. The bellow actuator is expandable based on a vapor pressure measurement of the vapor pressure sensor. 1. A cooling system comprising: a condenser side opposite an evaporator side;', 'a condenser side wick coupled to a condenser side wall;', 'an evaporator side wick coupled to an evaporator side wall; and', 'a vapor core positioned between the evaporator side wick and the condenser side wick;, 'an expandable vapor chamber comprisinga vapor pressure sensor communicatively coupled to a controller; anda bellow actuator disposed in the vapor core and communicatively coupled to the controller, wherein the bellow actuator is expandable based on a vapor pressure measurement of the vapor pressure sensor.2. The cooling system of claim 1 , wherein the bellow actuator is coupled to the condenser side wick and the evaporator side wick.3. The cooling system of claim 1 , wherein the bellow actuator is coupled to the condenser side wall and the evaporator side wall.4. The cooling system of claim 1 , further comprising a sealing layer extending between the evaporator side wick and the condenser side wick claim 1 , wherein the sealing layer comprises a flexible material and hermetically seals the vapor core.5. The cooling system of claim 4 , wherein the sealing layer is coupled to a side surface of the evaporator side wick and a side surface of the condenser side wick.6. The cooling system of claim 1 , wherein:the condenser side wall comprises an end portion and shoulder portions ...

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Номер записи: 28
22-05-2014 дата публикации

Cooling Apparatuses Having Sloped Vapor Outlet Channels

Номер: US20140140006A1
Автор: Ercan Mehmet DEDE, Joshua Sean Kuhlmann, Matthew Joseph Rau, Shailesh N. Joshi
Принадлежит: Toyota Motor Engineering and Manufacturing North America Inc

Jet impingement and two-phase cooling apparatuses with sloped vapor outlet channels are disclosed. In one embodiment, a cooling apparatus includes a fluid inlet channel, a jet orifice surface having one or more jet orifices fluidly coupled to the fluid inlet channel such that coolant fluid within the fluid inlet channel flows through the one or more jet orifices as one or more impingement jets, and a target surface. The target surface and the jet orifice surface define an impingement chamber where the one or more impingement jets impinge the target surface at an impingement region such that at least some of the coolant fluid changes to a vapor. The cooling apparatus further includes a plurality of sloped vapor outlet channels that are fluidly coupled to the impingement chamber. Coolant fluid flows through the plurality of sloped vapor outlet channels after it impinges the target surface.

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Номер записи: 29
02-03-2017 дата публикации

Multi-Step Processes For High Temperature Bonding And Bonded Substrates Formed Therefrom

Номер: US20170062304A1
Автор: JOSHI Shailesh N., Noguchi Masao
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A method for high temperature bonding of substrates may include providing a top substrate and a bottom substrate, and positioning an insert between the substrates to form a assembly. The insert may be shaped to hold at least an amount of Sn having a low melting temperature and a gap shaped to hold at least a plurality of metal particles having a high melting temperature greater than the low melting temperature. The assembly may be heated to below the low melting temperature and held for a first period of time. The assembly may further be heated to approximately the low melting temperature and held for a period of time at a temperature equal to or greater than the low melting temperature such that the amount of Sn and the amount of metal particles form one or more intermetallic bonds. The assembly may be cooled to create a bonded assembly. 1. A method for high temperature bonding of substrates , the method comprising:providing a top substrate and a bottom substrate; the insert is positioned around at least a portion of the top substrate and comprises at least one of a porous material and one or more channels;', 'the insert comprises a gap that is shaped to be disposed between the top and bottom substrates and that is configured to hold a plurality of metal particles having a high melting temperature, wherein at least one of the insert and the gap holds an amount of Sn having a low melting temperature; and', 'the high melting temperature is greater than the low melting temperature;, 'positioning an insert between the top and bottom substrates to form a assembly, whereinheating the assembly during a first heating to a first temperature that is below the low melting temperature;holding the assembly at the first temperature for a first period of time;heating the assembly during a second heating to a second temperature that is approximately equal to the low melting temperature;holding the assembly at a holding temperature for a second period of time such that the amount ...

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Номер записи: 30
12-03-2015 дата публикации

METHOD FOR FINDING VARIANTS FROM TARGETED SEQUENCING PANELS

Номер: US20150073724A1
Автор: Ashutosh , Joshi Devendra, Le Cocq Christian A.
Принадлежит:

Provided herein is a method for identifying a sequence variant in an enriched sample. In certain embodiments, this method may comprise: (a) obtaining: (i) a plurality of sequence reads from a sample that has been enriched for a genomic region and (ii) a reference sequence for the genomic region; (b) assembling the sequence reads to obtain a plurality of discrete sequence assemblies that correspond to potential variants; (c) determining which of the potential variants are true and which are artifacts by examining the sequence reads that make up each of the discrete sequence assemblies; (d) optionally determining whether each of the true potential variants contains a mutation that is known to be associated with the reference sequence; and (e) outputting a report indicating whether the sample comprises a sequence variant. 1. A method for identifying a sequence variant , comprising:(a) obtaining: (i) a plurality of sequence reads from a sample that has been enriched for a genomic region and (ii) a reference sequence for the genomic region;(b) assembling the sequence reads to obtain a plurality of discrete sequence assemblies each of which corresponding to a potential variant;(c) determining which of the potential variants are true and which are artifacts by examining the sequence reads that make up each of the discrete sequence assemblies;(d) optionally determining whether each of the true potential variants contains a mutation that is known to be associated with the reference sequence; and(e) outputting a report indicating whether said sample comprises a sequence variant.2. The method of claim 1 , wherein the genomic region is associated with cancer.3. The method of claim 1 , wherein the genomic region comprises at least a portion of at least one of the following genes: PIK3CA claim 1 , NRAS claim 1 , KRAS claim 1 , JAK2 claim 1 , HRAS claim 1 , FGFR3 claim 1 , FGFR1 claim 1 , EGFR claim 1 , CDK4 claim 1 , BRAF claim 1 , RET claim 1 , PGDFRA claim 1 , KIT and ERBB2.4. ...

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Номер записи: 31
12-03-2015 дата публикации

Determining process variation using device threshold sensitivites

Номер: US20150073738A1
Автор: Amol A. Joshi, Dileep N. NETRABILE, Eric A. Foreman, Hemlata Gupta, Jeffrey G. Hemmett, Nathan Buck, Vladimir Zolotov
Принадлежит: International Business Machines Corp

Embodiments of the present invention relate to determining process variations using device threshold sensitivities. A computing device determines first and second threshold voltages for first and second transistors, respectively, wherein the first and second transistors are included in an integrated circuit and are n-channel and p-channel field effect transistors, respectively. The computing device also determines process parameters that are associated with the integrated circuit using a combination of determined first and second threshold voltages, wherein the process parameter reflects random sensitivities, timing delay differences, timing delay and slew rate changes, and/or variations between low, high, and regular threshold voltages which are associated with the first and second transistors.

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Номер записи: 32
29-05-2014 дата публикации

1,6- Diazabicyclo [3,2,1] octan-7-one derivatives and their use in the treatment of bacterial infections

Номер: US20140148431A1
Автор: Bhagwat Sachin, Bhawsar Satish, Deshpande Prasad Keshav, GUPTA Sunil, Jafri Mohammed Alam, Joshi Sanjeev, Kale Rajesh, Mishra Amit, PATEL Mahesh Vithalbhai, PAVASE Laxmikant
Принадлежит:

Compounds of Formula (I), their preparation and use in preventing or treating bacterial infection is disclosed. 2. A compound according claim 1 , selected from:trans-sulfuric acid mono-[2-(N′—[(S)-pyrrolidin-2-carbonyl]-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′—((R)-piperidin-3-carbonyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′—[(R)-pyrrolidin-3-carbonyl]-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-{7-oxo-2-[N′—((R)-piperidin-3-carbonyl)-hydrazinocarbonyl]-1,6-diaza-bicyclo[3.2.1]-oct-6-yloxy}-acetic acid;trans-difluoro-{7-oxo-2-[N′—((R)-piperidin-3-carbonyl)-hydrazinocarbonyl]-1,6-diaza-bicyclo[3.2.1]-oct-6-yloxy}-acetic acid;trans-sulfuric acid mono-[2-hydrazinocarbonyl-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-(amino-acetyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-(3-amino-propioyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-(4-amino-butanoyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-((2S)-2-amino-3-hydroxy-propioyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-[(2S,4S)-4-fluoro-pyrrolidin-2-carbonyl]-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-[(2S,4R)-4-methoxy-pyrrolidin-2-carbonyl]-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-(piperidin-4-carbonyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′—((RS)-piperidin-3-carbonyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′—((S)-piperidin-3-carbonyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2 ...

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Номер записи: 33
31-03-2022 дата публикации

BASSINET

Номер: US20220095812A1
Автор: HAGLER Ty, JOSHI Prasad, Kirk Charity Grace, Murphy Patrick, Seashore Carl John, Stuebe Alison Mann, Sullivan Catherine, Tully Kristin Patricia
Принадлежит:

A bassinet includes a base, a column assembly rotatably connected to the base at a first end of the column assembly, an arm rotatably connected to a second end of the column assembly, a tub frame pivotably connected to the arm, an infant tub retained within the tub frame, the infant tub including a front wall, a back wall, and two side walls and having areas of reduced height along the front wall and at least one of the side walls to provide enhanced access to the infant located within the infant tub, and an insert configured to reversibly fit within an interior of the infant tub. 1. A bassinet comprising:a base;a column assembly connected to the base;an arm rotatably connected to the column assembly;a tub frame connected to the arm;an infant tub comprising a front wall, a back wall, and two side walls and having areas of reduced height along the front wall and at least one of the side walls to provide enhanced access to an infant within the infant tub; andan insert for removably positioning within an interior of the infant tub.2. The bassinet according to claim 1 , wherein:the infant tub has a length, a width, and a height; andthe side walls of the infant tub have a full height portion that is at least half of the width of the infant tub.3. The bassinet according to claim 1 , wherein the infant tub comprises a recessed portion that engages within the tub frame claim 1 , the recessed portion having a reduced width and/or length from the width and/or length of the infant tub.4. The bassinet according to claim 1 , wherein the infant tub comprises a visual indicator within an area defined by the recessed portion of the infant tub claim 1 , the visual indicator being positioned and configured to provide a visual indication to a user when the infant tub is not fully seated within the tub frame.5. The bassinet according to claim 1 , wherein claim 1 , in the areas of reduced height claim 1 , an upper edge of the infant tub is rolled to provide distributed points of contact ...

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Номер записи: 34
14-03-2019 дата публикации

TRANSIENT LIQUID PHASE BONDING COMPOSITIONS AND POWER ELECTRONICS ASSEMBLIES INCORPORATING THE SAME

Номер: US20190078212A1
Автор: JOSHI Shailesh N., Liu Yanghe
Принадлежит:

A transient liquid phase (TLP) composition includes a plurality of first high melting temperature (HMT) particles, a plurality of second HMT particles, and a plurality of low melting temperature (LMT) particles. Each of the plurality of first HMT particles have a core-shell structure with a core formed from a first high HMT material and a shell formed from a second HMT material that is different than the first HMT material. The plurality of second HMT particles are formed from a third HMT material that is different than the second HMT material and the plurality of LMT particles are formed from a LMT material. The LMT particles have a melting temperature less than a TLP sintering temperature of the TLP composition and the first, second, and third HMT materials have a melting point greater than the TLP sintering temperature. 1. A transient liquid phase (TLP) composition comprising:a plurality of first high melting temperature (HMT) particles, wherein each of the plurality of first HMT particles comprise a core-shell structure with a core formed from a first HMT material and a shell formed from a second HMT material;a plurality of second HMT particles, wherein each of the plurality of second HMT particles are formed from a third HMT material;a plurality of low melting temperature (LMT) particles, wherein each of the plurality of LMT particles are formed from a LMT material;wherein the first HMT material, the second HMT material, and the third HMT material have a melting point greater than a TLP sintering temperature of the TLP composition and the plurality of LMT particles have a melting point less than the TLP sintering temperature.2. The TLP composition of claim 1 , wherein the first HMT material is nickel claim 1 , silver claim 1 , copper claim 1 , aluminum claim 1 , or an alloy thereof.3. The TLP composition of claim 1 , wherein the second HMT material is nickel claim 1 , silver copper or an alloy thereof.4. The TLP composition of claim 1 , wherein the third HMT ...

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Номер записи: 35
14-03-2019 дата публикации

THERMAL STRESS COMPENSATION BONDING LAYERS AND POWER ELECTRONICS ASSEMBLIES INCORPORATING THE SAME

Номер: US20190078227A1
Автор: Dede Ercan Mehmet, JOSHI Shailesh N.
Принадлежит:

A thermal stress compensation layer includes a metal inverse opal (MIO) layer with a plurality of hollow spheres and a predefined porosity disposed between a pair of bonding layers. The thermal stress compensation layer has a melting point above a TLP sintering temperature and the pair of bonding layers each have a melting point below the TLP sintering temperature such that the MIO layer can be transient liquid phase bonded between a metal substrate and a semiconductor device. The pair of bonding layers may comprise a first pair of bonding layers and a second pair of bonding layers with the first pair of bonding layers disposed between the MIO layer and the second pair of bonding layers. The first pair of bonding layers may have a melting point above the TLP sintering temperature and the second pair of bonding layers may have a melting point below the TLP sintering temperature. 1. A transient liquid phase (TLP) bonding layer comprising:a thermal stress compensation layer disposed between at least one pair of bonding layers, the thermal stress compensation layer comprising a metal inverse opal (MIO) layer with a plurality of hollow spheres and a predefined porosity;wherein the thermal stress compensation layer has a melting point above a TLP sintering temperature and the at least one pair of bonding layers each have a melting point below the TLP sintering temperature.2. The TLP bonding layer of claim 1 , wherein the MIO layer comprises a first surface claim 1 , a second surface and a graded porosity between the first surface and the second surface.3. The TLP bonding layer of claim 1 , wherein the MIO layer comprises a first surface claim 1 , a second surface and a graded stiffness between the first surface and the second surface.4. The TLP bonding layer of claim 1 , wherein:the at least one pair of bonding layers comprise a first pair of bonding layers and a second pair of bonding layers, wherein:the first pair of bonding layers are disposed between the MIO layer and ...

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Номер записи: 36
31-03-2022 дата публикации

Trans-Tympanic Membrane Delivery Platform and Uses Thereof

Номер: US20220096372A1
Автор: Amit Joshi, Gayatri Sharma, Joseph Edward Kerschner, Wenzhou Hong
Принадлежит: MEDICAL COLLEGE OF WISCONSIN

Provided herein are methods and composition for trans-tympanic membrane delivery of therapeutic agents such as antimicrobial agents, anti-inflammatory agents, and anti-biofilm agents to the middle ear for rapid, localized treatment and prevention of diseases and conditions associated with a middle ear infection. In particular, provided herein are cationic, anionic, and polymer-based nanoparticles that provide a platform for delivery of therapeutic cargo, as well as cationic, anionic, and polymer-based nanoparticles compositions for rapid, localized delivery of therapeutic agents to the middle ear.

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Номер записи: 37
23-03-2017 дата публикации

Methods For Evaluating The Properties Of Transient Liquid Phase Bonds

Номер: US20170080493A1
Автор: JOSHI Shailesh N., Noguchi Masao
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

According to embodiments described herein, the properties of a transient liquid phase bond may be evaluated by a method that includes forming a bulk material sample. The bulk material sample may include the material of the transient liquid phase bond. Forming the bulk material sample may include providing a bonding material precursor and forming the bulk material sample by transient liquid phase bonding the bonding material precursor by spark plasma sintering the bonding material precursor. The bonding material precursor may include metal particles of a first metal composition and metal particles of a second metal composition. The method may further include testing the bulk material sample for one or more properties. 1. A method for evaluating the properties of a transient liquid phase bond , the method comprising: providing a bonding material precursor comprising metal particles of a first metal composition and metal particles of a second metal composition; and', 'forming the bulk material sample by transient liquid phase bonding the bonding material precursor by spark plasma sintering the bonding material precursor., 'forming a bulk material sample comprising the material of the transient liquid phase bond, wherein forming the bulk material sample comprises2. The method of claim 1 , wherein the spark plasma sintering comprises applying a direct current to the bonding material precursor.3. The method of claim 2 , wherein the application of the direct current heats the bonding material precursor.4. The method of claim 2 , wherein the direct current is pulsed.5. The method of claim 1 , wherein the spark plasma sintering comprises applying pressure to the bonding material precursor.6. The method of claim 1 , wherein the spark plasma sintering takes place in a vacuum environment.7. The method of claim 1 , further comprising testing the bulk material sample for one or more properties.8. The method of claim 7 , wherein the bulk material sample is tested for one or more ...

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Номер записи: 38
14-03-2019 дата публикации

LOW TEMPERATURE SINTERING POROUS METAL FOAM LAYERS FOR ENHANCED COOLING AND PROCESSES FOR FORMING THEREOF

Номер: US20190078847A1
Автор: JOSHI Shailesh N., Liu Yanghe
Принадлежит:

A heat transfer surface with a convective cooling layer includes a metal substrate and a porous metal foam layer transient liquid phase (TLP) bonded on the metal substrate. The porous metal foam layer includes a plurality of high melting temperature (HMT) particles and a plurality of micro-channels. A first TLP intermetallic layer is positioned between, and TLP bonds together, adjacent HMT particles to form the porous metal foam layer. A second TLP intermetallic layer is positioned between and TLP bonds a subset of the plurality of HMT particles to the metal substrate such that the porous metal foam layer is TLP bonded to the metal substrate. The plurality of micro-channels extend from an outer surface of the porous metal foam layer to the metal substrate such that a cooling fluid may be wicked through the plurality of micro-channels to the surface of the metal substrate. 1. A heat transfer surface with a convective cooling layer comprising:a metal substrate; and a plurality of high melting temperature (HMT) particles and a plurality of micro-channels;', 'a first TLP intermetallic layer positioned between and TLP bonding together adjacent HMT particles to form the porous metal foam layer; and, 'a porous metal foam layer transient liquid phase (TLP) bonded on the metal substrate, the porous metal foam layer comprisinga second TLP intermetallic layer positioned between and TLP bonding a subset of the plurality of HMT particles to the metal substrate such that the porous metal foam layer is TLP bonded to the metal substrate;wherein the plurality of micro-channels extend from an outer surface of the porous metal foam layer to the metal substrate for a cooling fluid to be wicked through the plurality of micro-channels to the surface of the metal substrate.2. The heat transfer surface of claim 1 , wherein the plurality of HMT particles comprises a plurality of first HMT particles coated with a plurality of second HMT particles claim 1 , wherein the plurality of first HMT ...

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Номер записи: 39
14-03-2019 дата публикации

SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF WICK STRUCTURE FOR VAPOR CHAMBER

Номер: US20190082560A1
Автор: Dede Ercan, JOSHI Shailesh N., Zhou Feng
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A vapor chamber includes a wick structure created by an additive selective laser sintering process. The wick structure includes a substrate, a first copper powder layer, a second copper powder layer, and a plurality of additional layers. The first copper powder layer is deposited across the substrate, wherein the first copper powder layer is subsequently selectively fused via a fusing instrument. The second copper powder layer is deposited across the first copper powder layer, wherein the second copper powder layer is subsequently selectively fused via the fusing instrument. Additionally, a plurality of additional copper powder layers are deposited wherein each additional layer is deposited on the previous layer, wherein each of the additional copper powder layers is selectively fused with a predetermined structure. 1. A vapor chamber , comprising: a substrate,', 'a first copper powder layer deposited across the substrate, wherein the first copper powder layer is subsequently selectively fused via a fusing instrument,', 'a second copper powder layer deposited across the first copper powder layer, wherein the second copper powder layer is subsequently selectively fused via the fusing instrument, and', 'a plurality of additional copper powder layers, wherein each additional layer is deposited on the previous layer, wherein each of the additional copper powder layers is selectively fused with a predetermined structure., 'a wick structure, wherein the wick structure includes'}2. The vapor chamber of claim 1 , wherein the predetermined structure includes liquid supply posts and each liquid supply post includes an arch structure.3. The vapor chamber of claim 1 , wherein the fusing instrument is a laser.4. The vapor chamber of claim 1 , wherein the predetermined structure includes surface enhancement features claim 1 , wherein the surface enhancement features include enhancements to a base wick or enhancements to the base wick and the substrate.5. The vapor chamber of ...

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Номер записи: 40
31-03-2022 дата публикации

POWER ELECTRONIC MODULES INCLUDING ONE OR MORE LAYERS INCLUDING A POLYMER PRODUCED VIA A FRONTAL RING-OPENING POLYMERIZATION PROCESS

Номер: US20220102241A1
Автор: JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

In one or more embodiments of the present disclosure, a power electronic module may be described. The power electronic module may comprise a power semiconductor device, a substrate coupled to the power semiconductor device, and a base plate coupled to the substrate. The substrate may include from 50 weight percent (wt. %) to 99.9 wt. % of a poly(dicyclopentadiene) polymer. In one or more other embodiments of the present disclosure, a method for manufacturing a power electronic module may be described. The method may include disposing a solution on a base plate. The solution may include dicyclopentadiene monomer, a ruthenium-based catalyst, and a trialkyl phosphite initiator. The method may further include initiating a polymerization front within the solution to produce a substrate formed directly on the base plate. Furthermore, the method may include coupling a power semiconductor device on the substrate to produce the power electronic module. 1. A power electronic module comprising:a power semiconductor device;a substrate coupled to the power semiconductor device, wherein the substrate comprises from 50 weight percent (wt. %) to 99.9 wt. % of a poly(dicyclopentadiene) polymer; anda base plate coupled to the substrate.2. The power electronic module of claim 1 , wherein the power semiconductor device comprises an insulated gate bipolar transistor (IGBT) claim 1 , a reverse conducting insulated gate bipolar transistor (RC-IGBT) claim 1 , a metal-oxide-semiconductor field-effect transistor (MOSFET) claim 1 , a power metal-oxide-semiconductor field-effect transistor (MOSFET) claim 1 , a diode claim 1 , a power diode claim 1 , a transistor claim 1 , a power bipolar transistor claim 1 , or combinations thereof.3. The power electronic module of claim 1 , wherein the power semiconductor device comprises silicon carbide (SiC) claim 1 , silicon dioxide (SiO) claim 1 , aluminum nitride (AlN) claim 1 , gallium nitride (GaN) claim 1 , boron nitride (BN) claim 1 , or combinations ...

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Номер записи: 41
31-03-2022 дата публикации

Method, electronic apparatus, and system for defect detection

Номер: US20220102620A1
Автор: Shailesh N. Joshi, Srivatsava Krishnan, Vijay Venkatesh, Vishnu Baba SUNDARESAN
Принадлежит: Ohio State Innovation Foundation, Toyota Motor Engineering and Manufacturing North America Inc

Aspects of the disclosure provide a method including determining a measurement configuration for one or more piezoelectric devices in an electronic apparatus. The electronic apparatus includes an electronic device mounted on a substrate block using a bonding layer. The one or more piezoelectric devices including a first subset and a second subset are attached to one of the electronic device and the bonding layer. The method includes performing, based on the measurement configuration, a defect measurement on the electronic apparatus by causing the first subset to transmit and the second subset to receive one or more acoustic signals. The method includes determining whether at least one mechanical defect is located in at least one of (i) the bonding layer, (ii) the electronic device, (iii) the substrate block, (iv) interfaces of the electronic device, the bonding layer, and the substrate block based on the received one or more acoustic signals.

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Номер записи: 42
05-05-2022 дата публикации

POWER ELECTRONICS ASSEMBLY HAVING STAGGERED AND DIAGONALLY ARRANGED TRANSISTORS

Номер: US20220134889A1
Автор: Fujioka Hitoshi, JOSHI Shailesh N., Lohan Danny J.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc

Methods, apparatuses and systems to provide for technology to that includes a first power electronics module including a plurality of first transistors that are diagonally offset from each other, and a second power electronics module stacked on the first power electronics module. The second power electronics module includes second transistors that are diagonally offset from each other. The second transistors are staggered relative to the first transistors.

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Номер записи: 43
05-05-2022 дата публикации

Power electronics assembly having vertically stacked transistors

Номер: US20220140706A1
Автор: Danny J. LOHAN, Hitoshi Fujioka, Shailesh N. Joshi
Принадлежит: Toyota Motor Engineering and Manufacturing North America Inc

Methods, apparatuses and systems provide technology that includes a first transistor, a second transistor stacked on the first transistor, at least one electrical conductor that is positioned between the first and second transistors and electrically connected to the first and second transistors, and a busbar that is electrically connected to the first and second transistors through the at least one electrical conductor.

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Номер записи: 44
05-05-2022 дата публикации

POWER ELECTRONICS ASSEMBLY HAVING A GATE DRIVE DEVICE DISPOSED BETWEEN A PLURALITY OF TRANSISTORS

Номер: US20220141991A1
Автор: Fujioka Hitoshi, JOSHI Shailesh N., Lohan Danny J., Zhou Feng
Принадлежит: Toyota Motor Engineering and Manufacturing North America, Inc.

Methods, apparatuses and systems to provide for technology to that includes a plurality of transistors including first transistors and second transistors. The first transistors are disposed opposite the second transistors in a lateral direction with a first space between the first transistors and the second transistors in the lateral direction. A gate driver is electrically connected to the plurality of transistors to operate the plurality of transistors. The gate driver has a first portion disposed between the first transistors and the second transistors in the first space.

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Номер записи: 45
05-05-2022 дата публикации

DOUBLE-SIDED HYBRID COOLING OF PCB EMBEDDED POWER ELECTRONICS AND CAPACITORS

Номер: US20220142017A1
Автор: Dede Ercan Mehmet, Fujioka Hitoshi, JOSHI Shailesh N., Lohan Danny J., Nagai Shohei, Ukegawa Hiroshi, Zhou Feng
Принадлежит:

A cold plate includes a first cooling surface comprising a first cooling structure bonded to an inner surface of the first cooling surface, a second cooling surface comprising a second cooling structure bonded to an inner surface of the second cooling surface, a manifold comprising an internal cavity defined by a first length, a first width, and a first height, and a flow divider defined by a second length, a second width, and a second height. The manifold is enclosed by the first cooling surface and the second cooling surface on opposing surfaces of the manifold separated by the first height. The flow divider is positioned within the internal cavity of the manifold. The flow divider supports and separates the first cooling structure and the second cooling structure by a portion of the second height of the flow divider.

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Номер записи: 46
30-03-2017 дата публикации

TWO-PHASE JET IMPINGEMENT COOLING DEVICES AND ELECTRONIC DEVICE ASSEMBLIES INCORPORATING THE SAME

Номер: US20170094837A1
Автор: DEDE Ercan M., JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

Two-phase jet impingement cooling devices and electronic device assemblies are disclosed. In one embodiment, a cooling device includes a manifold having a fluid inlet surface, a fluid outlet surface defining an outlet manifold, and a fluid outlet. The fluid inlet surface includes an inlet channel fluidly coupled to a first jet region and a second jet region each including a plurality of jet orifices and a plurality of surface features extending from the fluid inlet surface. A target plate is coupled to the fluid outlet surface of the manifold that includes a target surface, a first heat sink, and a second heat sink. A cover plate is coupled to the fluid inlet surface of the manifold, which includes a fluid inlet port fluidly coupled to the inlet channel of the manifold, and a fluid outlet port fluidly coupled to the fluid outlet of the manifold. 1. A cooling device comprising: the fluid outlet surface is opposite the fluid inlet surface;', 'the fluid inlet surface comprises an inlet channel fluidly coupled to a first jet region and a second jet region;', 'the first jet region and the second jet region each comprise a plurality of jet orifices and a plurality of surface features extending from the fluid inlet surface;', 'an individual surface feature of the plurality of surface features is positioned adjacent an individual jet orifice of the plurality of jet orifices;', 'the first jet region and the second jet region are symmetrical about a line disposed in a center of the inlet channel; and', 'the fluid outlet is fluidly coupled to the outlet manifold;, 'a manifold comprising a fluid inlet surface, a fluid outlet surface defining an outlet manifold, and a fluid outlet, whereina target plate coupled to the fluid outlet surface of the manifold, the target plate comprising a target surface, a first heat sink at the target surface, and a second heat sink at the target surface, wherein the first heat sink is aligned with the first jet region of the manifold, and the ...

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Номер записи: 47
12-04-2018 дата публикации

Systems and Methods for Degassing and Charging Phase-Change Thermal Devices

Номер: US20180099363A1
Автор: Dede Ercan Mehmet, JOSHI Shailesh N., Liu Yanghe, Zhou Feng
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

Systems and methods for degassing and charging phase-change thermal devices are disclosed. In one embodiment, a system includes a flask, a first shut-off valve fluidly coupled to an outlet of the flask, and a first valve fluidly coupled to the first shut-off valve by a fluid line. The system further includes a second valve fluidly coupled to the first valve, wherein the second valve is operable to be fluidly coupled to the phase-change thermal device, a second shut-off valve fluidly coupled to the second valve, a third valve fluidly coupled to the first valve, a vacuum pump fluidly coupled to the third valve, and a fluid injection device fluidly coupled to the fluid line between the first valve and the first shut-off valve. The fluid injection device draws the working fluid from the flask and injects a desired amount into the phase-change thermal device. 1. A system for degassing and charging a phase-change thermal device comprising:a flask comprising an inlet for receiving a working fluid, and an outlet;a first shut-off valve fluidly coupled to the outlet of the flask;a first valve fluidly coupled to the first shut-off valve by a fluid line;a second valve fluidly coupled to the first valve, wherein the second valve is operable to be fluidly coupled to the phase-change thermal device;a second shut-off valve fluidly coupled to the second valve;a third valve fluidly coupled to the first valve;a vacuum pump fluidly coupled to the third valve; anda fluid injection device fluidly coupled to the fluid line between the first valve and the first shut-off valve, wherein the fluid injection device is operable to draw the working fluid from the flask and inject a desired amount of the working fluid into the phase-change thermal device.2. The system of claim 1 , further comprising a heating element thermally coupled to the flask and operable to heat the working fluid within the flask.3. The system of claim 1 , wherein the second shut-off valve is fluidly coupled to atmosphere.4 ...

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Номер записи: 48
08-04-2021 дата публикации

Microfilter, manufacturing method and microfiltration unit

Номер: US20210101117A1
Автор: Frank Lin, Leo Liu, Pankaj Kumar Joshi, Richard Wang, Tsong Chin Lin
Принадлежит: General Biologicals Corp

A microfilter, a manufacturing method thereof, and a microfiltration unit for holding the microfilter are provided. The microfilter has: a non-epoxy based microfilm; and a plurality of microholes provided on the surface of the non-epoxy based microfilm and penetrating therethrough via UV laser ablation, wherein the surface of the non-epoxy based microfilm is patterned into predetermined sections for locating isolated targets and quick enumeration.

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Номер записи: 49
02-06-2022 дата публикации

ELECTROSTATIC AIR FILTER FOR ELECTRIC VEHICLE MOTORS

Номер: US20220168680A1
Автор: Gandhi Umesh, JOSHI Shailesh N., Tsuruta Ryohei
Принадлежит:

Disclosed is a vehicle comprising a wheel with an associated air-cooled motor, and a ventilation path for passing outside air from outside the vehicle into the motor. An electrostatic device is disposed proximate to the ventilation path. When the electrostatic device is energized, particles or debris in the outside air are attracted toward or repelled from the electrostatic device, such that the particles or debris are removed from the outside air before the outside air enters the motor. 1. A vehicle comprising:a wheel;an air-cooled motor associated with the wheel;a ventilation path for passing outside air from outside the vehicle into the air-cooled motor; andan electrostatic device disposed proximate to the ventilation path,wherein, when the electrostatic device is energized, particles or debris in the outside air are attracted toward or repelled from the electrostatic device,such that the particles or debris are removed from the outside air before the outside air enters the motor.2. The vehicle of claim 1 , wherein the electrostatic device comprises an electrostatic chuck claim 1 , film claim 1 , or coating.3. The vehicle of claim 1 , wherein the electrostatic device comprises a Coulomb-force electrostatic chuck or a Johnsen-Rahbek electrostatic chuck.4. The vehicle of claim 1 , wherein the electrostatic device is disposed on a hub claim 1 , spoke claim 1 , or rim of the wheel.5. The vehicle of claim 1 , further comprising wiring claim 1 , wherein the wiring operably couples the electrostatic device to an electrical system of the vehicle.6. The vehicle of claim 1 , wherein the particles or debris comprise metal claim 1 , metal oxide claim 1 , semiconductor claim 1 , semiconductor oxide claim 1 , or organic material.7. The vehicle of claim 1 , wherein the electrostatic device is energized while the vehicle is moving and de-energized while the vehicle is stopped.8. A motor claim 1 , comprising:an inlet through which cool air enters the motor;an outlet through which ...

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Номер записи: 50
23-04-2015 дата публикации

Electronic Device Assemblies and Vehicles Employing Dual Phase Change Materials

Номер: US20150109736A1
Автор: Dede Ercan Mehmet, JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor device having a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state, a coolant fluid thermally coupled to the surface of the semiconductor device, and a phase change material thermally coupled to the surface of the semiconductor device. The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state. 1. A cooling system comprising:a cold plate comprising a cooling surface;a housing coupled to the cooling surface of the cold plate and defining an enclosure to receive a coolant fluid;one or more thermally conductive features thermally coupled to the cooling surface of the cold plate; anda phase change material disposed within the one or more thermally conductive features, the phase change material thermally coupled to the cooling surface of the cold plate, wherein the phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase.2. The cooling system of claim 1 , wherein the phase change material is a solid when it is at a temperature below the phase change temperature.3. The cooling system of claim 1 , wherein at least one of the one or more thermally conductive features is physically connected to the cooling surface of the cold plate.4. The cooling system of claim 1 , wherein at least one of the one or more thermally conductive features is not physically coupled to the cooling surface of the cold plate.5. The cooling system of claim 1 , wherein the one or more thermally conductive features are located at one or more edges of the cooling surface of the ...

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Номер записи: 51
03-07-2014 дата публикации

Methods And Apparatus For Designing And Constructing Multi-Port Memory Circuits

Номер: US20140185364A1
Автор: Chuang Shang-Tse, Iyer Sundar, Joshi Sanjeev, Kablanian Adam, Nguyen Thu
Принадлежит: MEMOIR SYSTEMS, INC.

Static random access memory (SRAM) circuits are used in most digital integrated circuits to store data. To handle multiple memory users, an efficient dual port six transistor (6T) SRAM memory cell is proposed. The dual port 6T SRAM cell uses independent word lines and bit lines such that the true side and the false side of the SRAM cell may be accessed independently. Single-ended reads allow the two independent word lines and bit lines to handle two reads in a single cycle using spatial domain multiplexing. Writes can be handled faster that read operations such that two writes can be handled in a single cycle using time division multiplexing. To further improve the operation of the dual port 6T SRAM cell a number of algorithmic techniques are used to improve the operation of the memory system. 2. The dual port static random access memory cell as set forth in wherein said memory element comprises a pair of inverters.3. The dual port static random access memory cell as set forth in wherein said dual port static random access memory cell comprises a total of six transistors.5. A dual port memory system claim 1 , said dual port memory system comprising the elements of: a first bidirectional memory port, said first bidirectional memory port coupled to said true side, said first bidirectional memory port controlled by a first word line, said first bidirectional memory port coupled to a first bit line, and', 'a second bidirectional memory port, said second bidirectional memory port coupled to said false side, said second bidirectional memory port controlled by a second word line, said second bidirectional memory port coupled to a second bit line;, 'a plurality of memory elements arranged in an array, each said memory element having a true side and a false side, each of said memory elements comprising'}a sense amplifier circuit located substantially in the center of said array of memory elements dividing said array of memory elements into a first array half and a second ...

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Номер записи: 52
21-04-2016 дата публикации

Transient Liquid Phase Compositions Having Multi-Layer Particles

Номер: US20160108204A1
Автор: DEDE Ercan M., JOSHI Shailesh N., KATO Takehiro, Miyagi Kyosuke
Принадлежит:

Transient liquid phase compositions and bonding assemblies are disclosed. In one embodiment, a transient liquid phase composition includes a plurality of particles. Each particle includes a core, an inner shell surrounding the core, the inner shell, and an outer shell surrounding the inner shell. The core is made of a first high melting temperature material, the inner shell is made of a second high melting temperature material, and the outer shell is made of a low melting temperature material. The melting temperature of the low melting temperature material is less than the melting temperature of both the first and second high melting temperature materials. 1. A transient liquid phase composition comprising a plurality of particles , each particle comprising:a core comprising a first high melting temperature material;an inner shell surrounding the core, the inner shell comprising a second high melting temperature material; andan outer shell surrounding the inner shell, the outer shell comprising a low melting temperature material, wherein a melting point temperature of the low melting temperature material is less than a melting point temperature of both the first and second high melting temperature materials.2. The transient liquid phase composition of claim 1 , wherein the first high melting temperature material of the core is nickel claim 1 , silver claim 1 , copper claim 1 , or aluminum.3. The transient liquid phase composition of claim 1 , wherein the second high melting temperature material of the inner shell is nickel or silver.4. The transient liquid phase composition of claim 3 , wherein the low melting temperature material of the outer shell is tin.5. The transient liquid phase composition of claim 1 , wherein the low melting temperature material of the outer shell is tin.6. The transient liquid phase composition of claim 5 , wherein a diameter of the core claim 5 , a thickness of the inner shell claim 5 , and a thickness of the outer shell are such that the ...

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Номер записи: 53
08-04-2021 дата публикации

HIGH-DENSITY INTEGRATED POWER CONTROL ASSEMBLIES HAVING SHARED COOLING SYSTEM WITH A MOTOR

Номер: US20210104970A1
Автор: JOSHI Shailesh N., Liu Yanghe, Lohan Danny J., Suenaga Shohei
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

An integrated power control assembly mounted on an axial end of a three-phase motor includes a substrate, two input busbars each of positive and negative polarities alternatively spaced apart on the substrate, a plurality of sets of paired devices, and three output busbars corresponding to the three phases of the motor, wherein a set of paired devices includes a switching semiconductor and a diode. An inner input busbar has edges adjacent to an inner input busbar of opposite polarity and an outer input busbar of opposite polarity and configured to have at least twice as many devices as the outer input busbars. One or more sets of paired devices are disposed axially on outer input busbars and on inner input busbars along the edges. An individual output busbar is disposed over and electrically coupled to one or more sets of paired devices disposed on adjacent input busbars of opposite polarity. 1. An integrated power control assembly configured as an inverter to be mounted directly on an axial end of a motor having three phases , the integrated power control assembly comprising:a substrate; inner input busbars of opposite polarity are arranged between outer input busbars of opposite polarity, an inner input busbar having an edge adjacent to an inner input busbar of opposite polarity and an edge adjacent to an outer input busbar of opposite polarity; and', 'the inner input busbars are configured to have at least twice as many devices disposed thereon as the outer input busbars;, 'four input busbars laterally spaced apart on the substrate, the four input busbars comprising two input busbars of positive polarity arranged alternatively with two input busbars of negative polarity, whereinone or more sets of paired devices disposed axially on the outer input busbars, wherein a set of paired devices comprises a switching semiconductor device and a diode;one or more sets of paired devices disposed axially on the inner input busbar along the edge adjacent to the inner input ...

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Номер записи: 54
10-07-2014 дата публикации

Modular Jet Impingement Cooling Apparatuses With Exchangeable Jet Plates

Номер: US20140190665A1
Автор: Dede Ercan Mehmet, Gaikwad Mayur Prakash, Garimella Suresh V., JOSHI Shailesh N., Rau Matthew Joseph
Принадлежит:

Modular cooling apparatuses are disclosed. In one embodiment, a cooling apparatus includes an inlet manifold, a jet plate manifold, a plurality of jet plates, a vapor manifold, and a target layer. The inlet manifold includes a fluid distribution chamber, and a plurality of fluid distribution channels symmetrically located within the fluid distribution chamber. The jet plate manifold is coupled to the inlet manifold such that the plurality of jet plate openings is vertically aligned with respect to the plurality of fluid distribution channels. The plurality of jet plates is removably disposed in the jet plate manifold. The vapor manifold has a plurality of walls that define a vapor manifold opening and at least one outlet channel through at least one of the walls. The target layer is coupled to the vapor manifold such that the jet orifice surface of each jet plate is positioned above the target layer. 1. A cooling apparatus comprising: a fluid distribution chamber; and', 'a plurality of fluid distribution channels symmetrically located within the fluid distribution chamber;, 'an inlet manifold comprisinga jet plate manifold comprising a plurality of jet plate openings, wherein the jet plate manifold is coupled to the inlet manifold such that the plurality of jet plate openings is vertically aligned with respect to the plurality of fluid distribution channels; a jet orifice surface comprising one or more jet orifices; and', 'a jet channel, wherein the jet channel is fluidly coupled to an individual fluid distribution channel of the plurality of fluid distribution channels, and the coolant fluid flows through the one or more jet orifices as one or more impingement jets;, 'a plurality of jet plates disposed within the plurality of jet plate openings, each jet plate of the plurality of jet plates comprisinga vapor manifold coupled to the jet plate manifold, the vapor manifold comprising a plurality of walls defining a vapor manifold opening, and at least one outlet ...

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Номер записи: 55
10-07-2014 дата публикации

Cooling Apparatuses Having A Jet Orifice Surface With Alternating Vapor Guide Channels

Номер: US20140190668A1
Автор: Gaikwad Mayur Prakash, JOSHI Shailesh N., Kuhlmann Joshua Sean, Rau Matthew Joseph
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

Jet-impingement, two-phase cooling apparatuses having alternating vapor outlet channels are disclosed. In one embodiment, a cooling apparatus includes a fluid inlet channel, a jet orifice surface, and a target surface. The jet orifice surface includes an array of jet orifices. The jet orifices are arranged in rows. Coolant fluid within the fluid inlet channel flows through the array of jet orifices as impingement jets. The jet orifice surface further includes a plurality of vapor guide channels positioned between the plurality of jet orifice rows and parallel to a first axis such that the jet orifice surface is defined by alternating jet orifice rows and vapor guide channels. The target surface has a plurality of surface fins extending from a surface of the target surface and parallel to a second axis that is orthogonal to the first axis, wherein the jet orifice surface is positioned proximate the surface fins. 1. A cooling apparatus comprising:a fluid inlet channel; an array of jet orifices comprising a plurality of jet orifice rows, wherein coolant fluid within the fluid inlet channel flows through the array of jet orifices as impingement jets; and', 'a plurality of vapor guide channels positioned between the plurality of jet orifice rows and parallel to a first axis such that the jet orifice surface is defined by alternating jet orifice rows and vapor guide channels; and, 'a jet orifice surface comprisinga target surface comprising a plurality of surface fins extending from a surface of the target surface and parallel to a second axis that is orthogonal to the first axis, wherein the jet orifice surface is positioned proximate the plurality of surface fins.2. The cooling apparatus of claim 1 , wherein:the impingement jets of coolant fluid impinge the target surface between adjacent surface fins;at least a portion of the coolant fluid enters the plurality of vapor guide channels and flows away from an impingement region of the target surface in directions along ...

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Номер записи: 56
10-07-2014 дата публикации

VEHICLES, POWER ELECTRONICS MODULES AND COOLING APPARATUSES WITH SINGLE-PHASE AND TWO-PHASE SURFACE ENHANCEMENT FEATURES

Номер: US20140192485A1
Автор: Dede Ercan Mehmet, Garimella Suresh V., JOSHI Shailesh N., Rau Matthew Joseph
Принадлежит:

Jet-impingement, two-phase cooling apparatuses and power electronics modules having a target surface with single- and two-phase surface enhancement features are disclosed. In one embodiment, a cooling apparatus includes a jet plate surface and a target layer. The jet plate surface includes a jet orifice having a jet orifice geometry, wherein the jet orifice is configured to generate an impingement jet of a coolant fluid. The target layer has a target surface, single-phase surface enhancement features, and two-phase surface enhancement features. The target surface is configured to receive the impingement jet, and the single-phase surface enhancement features and the two-phase enhancement features are arranged on the target surface according to the jet orifice geometry. The single-phase surface enhancement features are positioned on the target surface at regions associated with high fluid velocity, and the two-phase surface enhancement features are positioned on the target surface at regions associated with low fluid velocity. 1. A cooling apparatus comprising:a jet channel;a jet plate surface comprising a jet orifice having a jet orifice geometry, wherein the jet orifice is in fluid communication with the jet channel and is configured to generate an impingement jet of a coolant fluid; and the target surface is configured to receive the impingement jet at an impingement region;', 'the single-phase surface enhancement features are positioned on the target surface at high fluid velocity regions; and', 'the two-phase surface enhancement features are positioned on the target surface at low fluid velocity regions., 'a target layer comprising a target surface, single-phase surface enhancement features, and two-phase surface enhancement features, wherein2. The cooling apparatus of claim 1 , wherein the two-phase surface enhancement features comprise micro- and/or nano-features.3. The cooling apparatus of claim 2 , wherein the micro- and/or nano-features are pillars.4. The ...

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Номер записи: 57
11-04-2019 дата публикации

METHOD AND APPARATUS FOR PREDICTING DEGRADATION IN POWER MODULES

Номер: US20190109556A1
Автор: DEDE Ercan M., JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A system, computer readable medium, and a method for monitoring power module degradation in a vehicle are provided. The method includes determining a structure function of a power module, determining a change in the structure function based on a comparison between the structure function and an initial or baseline structure function associated with the power module, outputting a degradation determination result based on the change in the structure function, and generating an alert when the degradation determination result exceeds a predetermined or adaptively determined degradation criterion value. 1. A method for monitoring power module degradation in a vehicle , comprising:determining, using processing circuitry, a structure function of a power module, the structure function being representative of, a thermal capacitance and a thermal resistance of the power module;determining, using the processing circuitry, a change in the structure function based on a comparison between the structure function and an initial structure function associated with the power module;outputting a degradation determination result based on the change in the structure function; andgenerating an alert when the degradation determination result exceeds a degradation criterion value.2. The method of claim 1 , further comprising:controlling one or more systems of the vehicle associated with the power module to maximize a life of the power module when the degradation determination result exceeds the degradation criterion value.3. The method of claim 1 , further comprising:determining the initial structure function of the power module when the power module is initially put into service.4. The method of claim 1 , wherein the structure function is determined when the vehicle has accumulated a predetermined mileage.5. The method of claim 1 , wherein the power module includes a plurality of layers and a change in a first section of the structure function is associated with degradation in a first layer ...

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Номер записи: 58
26-04-2018 дата публикации

Fluidly Cooled Power Electronics Assemblies Having a Thermo-Electric Generator

Номер: US20180116076A1
Автор: Dede Ercan Mehmet, JOSHI Shailesh N., WANG Chi-Ming
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A power electronics assembly that includes a first cooling chip fluidly coupled to a second cooling chip. The first cooling chip and the second cooling chip each include a cooling chip fluid inlet, a cooling chip fluid outlet, and one or more cooling chip fluid channels extending between and fluidly coupled to the cooling chip fluid inlet and the cooling chip fluid outlet. The power electronics assembly also includes a semiconductor device positioned between and thermally coupled to the first cooling chip and the second cooling chip and a thermo-electric generator positioned between and thermally coupled to the semiconductor device and one of the first cooling chip or the second cooling chip. 1. A power electronics assembly comprising: a cooling chip fluid inlet;', 'a cooling chip fluid outlet; and', 'one or more cooling chip fluid channels extending between and fluidly coupled to the cooling chip fluid inlet and the cooling chip fluid outlet;, 'a first cooling chip fluidly coupled to a second cooling chip, wherein the first cooling chip and the second cooling chip each comprisea semiconductor device positioned between and thermally coupled to the first cooling chip and the second cooling chip; anda thermo-electric generator positioned between and thermally coupled to the first cooling chip and the second cooling chip.2. The power electronics assembly of claim 1 , wherein the semiconductor device is positioned within a semiconductor device stack claim 1 , the semiconductor device stack is positioned between and thermally coupled to the first cooling chip and the second cooling chip claim 1 , and the semiconductor device stack further comprises:a first electrode electrically and thermally coupled to a first device surface of the semiconductor device; anda second electrode electrically and thermally coupled to a second device surface of the semiconductor device, wherein the first device surface is opposite the second device surface.3. The power electronics assembly of ...

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Номер записи: 59
27-05-2021 дата публикации

METHODS OF FORMING ELECTRONIC ASSEMBLIES WITH INVERSE OPAL SURFACES USING VARIABLE CURRENT DENSITY ELECTROPLATING

Номер: US20210159143A1
Автор: Braun Paul, JOSHI Shailesh N., Kohanek Julia, Singhal Gaurav
Принадлежит:

A method of forming an inverse opal structure along a substrate that includes depositing polymer spheres along the substrate and electroplating the substrate and spheres at a first current density to form a first solid metal layer such that the spheres are raised from the substrate. The method includes electroplating the substrate and the spheres at a second current density to diffuse metals from the substrate and deposit the metal about the spheres. The second current density is greater than the first current density. The method includes electroplating the substrate and spheres to form a second solid metal layer disposed over the spheres, and removing the spheres to form the inverse opal structure disposed between the first and second solid metal layers. The first and second solid metal layers define planar interface surfaces disposed over a porous structure of the inverse opal structure. 1. A method of forming an inverse opal structure along a metal substrate comprising:depositing a plurality of polymer spheres along the metal substrate;electroplating the metal substrate and the plurality of polymer spheres at a first current density to form a first solid metal layer between the metal substrate and the plurality of polymer spheres such that the plurality of polymer spheres is raised from the metal substrate;electroplating the metal substrate and the plurality of polymer spheres at a second current density to diffuse metals from the metal substrate and deposit the metal about the plurality of polymer spheres, wherein the second current density is greater than the first current density;electroplating the metal substrate and the plurality of polymer spheres to form a second solid metal layer disposed over the plurality of polymer spheres; andremoving the plurality of polymer spheres to form the inverse opal structure disposed between the first solid metal layer and the second solid metal layer and having a porous structure, wherein the first solid metal layer and the ...

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Номер записи: 60
27-05-2021 дата публикации

Methods of forming electronic assemblies with textured surfaces using low current density electroplating

Номер: US20210159146A1
Автор: Gaurav Singhal, Julia Kohanek, Paul Braun, Shailesh N. Joshi
Принадлежит: Toyota Motor Engineering and Manufacturing North America Inc, University of Illinois

A method of forming a textured surface layer along a substrate that includes disposing a plurality of polymer spheres on a surface of the metal substrate, and electroplating the metal substrate at a current density to deposit a metal layer along a body of each of the plurality of polymer spheres disposed on the surface of the metal substrate. The metal layer does not extend above a top surface of the plurality of polymer spheres. The method further includes removing the plurality of polymer spheres from the metal layer to form the textured surface defined by a size and shape of the plurality of polymer spheres.

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Номер записи: 61
11-05-2017 дата публикации

Methods And Apparatuses For High Temperature Bonding Controlled Processing And Bonded Substrates Formed Therefrom

Номер: US20170129031A1
Автор: Greve Hannes Martin Hinrich, JOSHI Shailesh N., McCluskey F. Patrick
Принадлежит:

Methods and apparatuses for controlled processing of high temperature bonding systems via devices to control heating and cooling systems of a high temperature heating bonding includes use of a sinter fixture device including a plate surface, that is shaped to contact and conform to a contacting surface of a TLPS substrate assembly, and a plurality of channels below the plate surface within a base body of the sinter fixture device shaped to receive heating and cooling elements. A first set of the one or more channels includes a plurality of cross-channels, a cooling medium inlet, and a cooling medium outlet, which cross-channels, cooling medium inlet, and cooling medium outlet are in fluid communication with one another. A second set of the one or more channels includes a plurality of heating element passageways. 1. A sinter fixture device for use in a controlled processing of high temperature bonding of substrates , the sinter fixture device comprising:a base body comprising a metal that is at least one of copper and aluminum;a plate surface that is shaped to contact and conform to a contacting surface of a substrate assembly, wherein the substrate assembly comprises a low melting point material and one or more high melting point materials between first and second substrates, the one or more high melting point materials having a melting temperature that is higher than a melting temperature of the low melting point material; and a first set of the plurality of channels includes a plurality of cross-channels, a cooling medium inlet, and a cooling medium outlet, which cross-channels, cooling medium inlet, and cooling medium outlet are in fluid communication with one another; and', 'a second set of the plurality of channels includes a plurality of heating element passageways., 'a plurality of channels below the plate surface within the base body of the sinter fixture device shaped to receive heating and cooling elements, wherein2. The sinter fixture device of claim 1 , ...

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Номер записи: 62
27-05-2021 дата публикации

SYSTEMS AND METHODS OF FORMING POWER ELECTRONIC ASSEMBLIES WITH COOLING CHANNELS AND INTEGRATED ELECTRODES

Номер: US20210161026A1
Автор: Braun Paul, JOSHI Shailesh N., Kohanek Julia, Singhal Gaurav
Принадлежит:

A method for forming an assembly is provided. The method includes depositing a colloidal template onto a substrate, wherein the colloidal template is porous, depositing a metal layer onto and within the colloidal template, depositing a cap structure onto the colloidal template opposite of the substrate, and removing the colloidal template from between the substrate and the cap structure to form a metal inverse opal structure disposed therebetween. The method continues by depositing an electrical isolation layer in contact with the cap structure opposite the metal inverse opal structure, and attaching the electrical isolation layer to a cooling device. 1. A method for forming an assembly , the method comprising:depositing a colloidal template onto a substrate, wherein the colloidal template is porous;depositing a metal layer onto and within the colloidal template;depositing a cap structure onto the colloidal template opposite of the substrate;removing the colloidal template from between the substrate and the cap structure to form a metal inverse opal structure disposed therebetween;depositing an electrical isolation layer in contact with the cap structure opposite the metal inverse opal structure; andattaching the electrical isolation layer to a cooling device.2. The method of claim 1 , wherein the depositing of the metal layer onto and within the colloidal template is via electrodepositing with a metal.3. The method of claim 2 , wherein the metal is a copper that forms copper inverse opals.4. The method of claim 2 , wherein the depositing of the cap structure is by electroplating which forms the cap structure by electroplating the metal beyond a tallest level of the colloidal template in a system vertical direction.5. The method of claim 1 , further comprising depositing a collector electrode attached on the cap structure.6. The method of claim 5 , wherein depositing the collector electrode comprises electrodepositing the collector electrode on the cap structure.7. ...

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Номер записи: 63
27-05-2021 дата публикации

SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF WICK STRUCTURE FOR VAPOR CHAMBER

Номер: US20210161029A1
Автор: Dede Ercan, JOSHI Shailesh N., Zhou Feng
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A vapor chamber includes a wick structure created by an additive selective laser sintering process. The wick structure includes a substrate, a first copper powder layer, a second copper powder layer, and a plurality of additional layers. The first copper powder layer is deposited across the substrate, wherein the first copper powder layer is subsequently selectively fused via a fusing instrument. The second copper powder layer is deposited across the first copper powder layer, wherein the second copper powder layer is subsequently selectively fused via the fusing instrument. Additionally, a plurality of additional copper powder layers are deposited wherein each additional layer is deposited on the previous layer, wherein each of the additional copper powder layers is selectively fused with a predetermined structure. 1. A method for additive selective laser sintering , comprising:depositing a first copper powder layer across a substrate;subsequently selectively fusing the first copper powder layer via a fusing instrument;depositing a second copper powder layer across the first copper powder layer;selectively fusing the second copper powder layer via the fusing instrument; anddepositing a plurality of additional copper powder layers wherein each additional layer is deposited on the previous layer;selectively fusing each of the additional copper powder layers; andcreating a predetermined wick structure based on the selective fusing of each additional copper powder layer.2. The method of claim 1 , wherein each copper powder layer is deposited via a print nozzle.3. The method of claim 2 , wherein the print nozzle is pre-programmed with the porous multi-layer wick structure.4. The method of claim 1 , further comprising:removing loose copper powder remaining after selectively fusing each copper powder layer.5. The method of claim 4 , further comprising:replacing the removed loose copper powder with sacrificial carbonate particles, wherein the sacrificial carbonate ...

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Номер записи: 64
11-05-2017 дата публикации

Methods And Apparatuses For Assessing High Temperature Bonding Systems And Bonded Substrates Therefrom

Номер: US20170132354A1
Автор: Greve Hannes Martin Hinrich, JOSHI Shailesh N., McCluskey F. Patrick
Принадлежит:

Methods and apparatuses for assessing the behavior of high temperature bonding systems such as sinter joint models of virtual interconnect microstructures via simulations that analyze sinter joint model properties include defining a plurality of sinter joint objects in a virtual interconnect microstructure, each sinter joint object having a type and a size, and determining a location of individual sinter joint objects with respect to one another in a virtual joint space to create a sinter joint model. The type is at least one of an intermetallic compound, a void, and a metal particle. The location is determined by, for each object, creating three-dimensional coordinates, and based on a determination that the sinter joint object is spaced from and non-overlapping with previously placed sinter joint objects, locking a position and size of the sinter joint object. 1. A method for assessing an interconnect microstructure of a virtual assembly of a high temperature bonding of substrates , the method comprising:defining, by a processor, a plurality of sinter joint objects in the interconnect microstructure of the virtual assembly, each sinter joint object of the plurality of sinter joint objects having a type and a size, wherein the type is at least one of an intermetallic compound, a void, and a metal particle; and creating three-dimensional coordinates for the sinter joint object; and', 'based on a determination that the sinter joint object is spaced from and non-overlapping with previously placed sinter joint objects, locking a position and size of the sinter joint object in the virtual joint space., 'determining, by the processor, a location of individual sinter joint objects of the plurality of sinter joint objects with respect to one another in a virtual joint space to create a sinter joint model, wherein the location is determined by, for each individual sinter joint object2. The method of claim 1 , further comprising:creating, by the processor, a three-dimensional ...

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Номер записи: 65
03-06-2021 дата публикации

Stable Cell Line Secreting Chikungunya Virus (CHIKV) Virus Like Particles (VLP) for Vaccines

Номер: US20210163544A1
Автор: Anjali Joshi, Himanshu Garg
Принадлежит: Texas Tech University System

The present invention includes nucleic acids, proteins, Chikungunya virus (CHIKV) Virus Like Particles (VLP), and methods of making a Chikungunya virus (CHIKV) Virus Like Particles (VLP) comprising: inserting one or more nucleic acids into a lentiviral backbone, wherein the nucleic acid encodes one or more Chikungunya virus (CHIKV) proteins; transfecting the one or more nucleic acids into the lentiviral backbone into a cell line; culturing the transfected cell line under conditions in which the Chikungunya virus (CHIKV) Virus Like Particles (VLP) are released from the cell line; and isolating the Chikungunya virus (CHIKV) Virus Like Particles (VLP) from a culture supernatant.

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Номер записи: 66
23-04-2020 дата публикации

ELECTRONIC ASSEMBLIES HAVING A MESH BOND MATERIAL AND METHODS OF FORMING THEREOF

Номер: US20200126943A1
Автор: JOSHI Shailesh N., TAKE Naoya
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

Embodiments of the present disclosure include a method of forming an electronic assembly with a mesh bond layer. The method may include forming a mesh bond material comprising a first surface spaced apart from a second surface by a thickness of the mesh bond material and one or more openings extending from the first surface through the thickness of the mesh bond material to the second surface. The method may further include adjusting at least one of: the thickness of the mesh bond material, a geometry of the one or more openings, or a size of the one or more openings of the mesh bond material, where the adjusting modifies a Young's modulus of the mesh bond material, and bonding the first surface of the mesh bond material to a surface of a semiconductor device. 1. A method of forming an electronic assembly with a mesh bond layer , the method comprising:forming a mesh bond material comprising a first surface spaced apart from a second surface by a thickness of the mesh bond material and one or more openings extending from the first surface through the thickness of the mesh bond material to the second surface;adjusting at least one of: the thickness of the mesh bond material, a geometry of the one or more openings, or a size of the one or more openings of the mesh bond material, wherein the adjusting modifies a Young's modulus of the mesh bond material; andbonding the first surface of the mesh bond material to a surface of a semiconductor device.2. The method of claim 1 , further comprising bonding the second surface of the mesh bond material to a surface of a substrate.3. The method of claim 1 , further comprising coating the mesh bond material with a layer of Sn to facilitate bonding with the semiconductor device.4. The method of claim 1 , wherein adjusting comprises decreasing the thickness of the mesh bond material to decrease the Young's modulus of the mesh bond material.5. The method of claim 1 , wherein adjusting comprises increasing the size of the one or more ...

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Номер записи: 67
23-04-2020 дата публикации

POWER ELECTRONIC ASSEMBLIES WITH SOLDER LAYER AND EXTERIOR COATING, AND METHODS OF FORMING THE SAME

Номер: US20200126944A1
Автор: JOSHI Shailesh N., TAKE Naoya
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

An assembly that includes a first substrate, a second substrate, and a pair of bonding layers disposed between and bonded to the first and second substrates. The assembly further includes a solder layer disposed between the pair of bonding layers such that the solder layer is isolated from contacting the first substrate and the second substrate. The solder layer has a low melting temperature relative to a high melting temperature of the bonding layers. A coating is disposed over at least the pair of bonding layers and the solder layer such that the coating encapsulates the solder layer between the pair of bonding layers. The solder layer melts into a liquid form when the assembly operates at a temperature above the low melting temperature of the solder layer and the coating maintains the liquid form of the solder layer between the pair of bonding layers. 1. An assembly comprising:a first substrate;a second substrate;a pair of bonding layers disposed between and bonded to the first and second substrates;a solder layer disposed between the pair of bonding layers such that the solder layer is isolated from contacting the first substrate and the second substrate, wherein the solder layer has a low melting temperature relative to a high melting temperature of the bonding layers; anda coating disposed over at least the pair of bonding layers and the solder layer such that the coating encapsulates the solder layer between the pair of bonding layers;wherein the solder layer melts into a liquid form when the assembly operates at a temperature above the low melting temperature of the solder layer and the coating maintains the liquid form of the solder layer between the pair of bonding layers.2. The assembly of claim 1 , wherein the low melting temperature of the solder layer is greater than or equal to 230 degrees Celsius.3. The assembly of claim 2 , wherein the high melting temperature of the pair of bonding layers is such that the pair of bonding layers remain in solid form ...

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Номер записи: 68
23-04-2020 дата публикации

ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIES INCORPORATING THE SAME

Номер: US20200126946A1
Автор: JOSHI Shailesh N., TAKE Naoya
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

Encapsulated stress mitigation layers and assemblies having the same are disclosed. An assembly that includes a first substrate, a second substrate, an encapsulating layer disposed between the first and second substrates, and a stress mitigation layer disposed in the encapsulating layer such that the stress mitigation layer is encapsulated within the encapsulating layer. The stress mitigation layer has a lower melting temperature relative to a higher melting temperature of the encapsulating layer. The assembly includes an intermetallic compound layer disposed between the first substrate and the encapsulating layer such that the encapsulating layer is separated from the first substrate by the intermetallic compound layer. The stress mitigation layer melts into a liquid when the assembly operates at a temperature above the low melting temperature of the stress mitigation layer and the encapsulating layer maintains the liquid of the stress mitigation layer within the assembly. 1. An assembly comprising:a first substrate;a second substrate; an intermetallic compound layer bonded to the first substrate;', 'an encapsulating layer bonded to the first substrate and the second substrate such that the encapsulating layer is disposed between the intermetallic compound layer and the second substrate; and', 'a stress mitigation layer disposed between the encapsulating layer and the second substrate such that the stress mitigation layer is encapsulated therein, wherein the stress mitigation layer has a low melting temperature relative to a higher melting temperature of the encapsulating layer;, 'a bonding structure disposed between the first and the second substrates, wherein the bonding structure compriseswherein the stress mitigation layer is capable of melting melts into a liquid when the assembly operates at a temperature above the lower melting temperature of the stress mitigation layer and at least the encapsulating layer is capable of maintaining maintains the liquid of ...

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Номер записи: 69
30-04-2020 дата публикации

VAPOR CHAMBER HEAT SPREADERS HAVING IMPROVED TRANSIENT THERMAL RESPONSE AND METHODS OF MAKING THE SAME

Номер: US20200132392A1
Автор: JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A vapor chamber heat spreader includes an evaporator plate, a condenser plate, and a plurality of sidewalls extending from the evaporator plate to the condenser plate to define a vapor chamber. An evaporator wick is coupled to an evaporating surface of the evaporator plate and a thermal compensation layer is coupled to an inner surface of the sidewalls. The thermal compensation layer comprising a plurality of core-shell phase change particles embedded in a metal. The core-shell PC particles include a core that includes a PCM having a phase change temperature of from 50° C. to 250° C. and a shell encapsulating the core. A heat transfer fluid is disposed within the vapor chamber. The vapor chamber heat spreader exhibits superior transient thermal response compared to commercially available heat spreaders. A power electronics assembly includes an electronics device coupled to a surface of the vapor chamber heat spreader. 1. A vapor chamber heat spreader comprising:an evaporator plate;a condenser plate spaced apart from the evaporator plate;a plurality of sidewalls and a plurality of fins, each of the plurality of sidewalls and the plurality of fins extending between and coupled to the evaporator plate and to the condenser plate, the plurality of sidewalls and the plurality of fins cooperating to define a plurality of vapor chambers disposed between the evaporator plate and the condenser plate, wherein each of the plurality of vapor chambers is isolated from each of the other vapor chambers; and a core comprising a phase change material (PCM) having a PC temperature within an operating temperature range of the vapor chamber heat spreader; and', 'a shell encapsulating the core, the shell comprising a shell material having a melt temperature greater than the PC temperature of the PCM., 'a thermal compensation layer coupled to an inner surface of each of the plurality of sidewalls and the fin surfaces of each of the plurality of fins, the thermal compensation layer ...

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Номер записи: 70
30-04-2020 дата публикации

THERMAL COMPENSATION LAYERS WITH CORE-SHELL PHASE CHANGE PARTICLES AND POWER ELECTRONICS ASSEMBLIES INCORPORATING THE SAME

Номер: US20200132394A1
Автор: Dede Ercan Mehmet, JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100° C. to 250° C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device. 1. A thermal compensation layer comprising:a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer, a core comprising a phase change material (PCM) with a PC temperature in a range of from 100° C. to 250° C.; and', 'a shell comprising a shell material having a melt temperature greater than the PC temperature of the PCM., 'wherein each of the core-shell PC particles comprises2. The thermal compensation layer of claim 1 , further comprising a cap layer overgrown onto the MIO layer.3. The thermal compensation layer of claim 1 , wherein the PCM comprises a paraffin or a metal.4. The thermal compensation layer of claim 3 , wherein the PCM comprises tin.5. The thermal compensation layer of claim 1 , wherein the shell material has a melt temperature greater than a sintering temperature of a bonding layer in contact with the thermal compensation layer.6. The thermal compensation layer of claim 1 , wherein the shell material comprises a metal oxide or an electrically insulating polymer capable of surviving temperatures greater ...

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Номер записи: 71
30-04-2020 дата публикации

SELF-HEALING METAL STRUCTURES

Номер: US20200132400A1
Автор: JOSHI Shailesh N., TAKE Naoya
Принадлежит:

A self-healing metal structure is provided for transferring heat between an electronics component and a substrate. The self-healing metal structure includes a base metal structural component. A phase change material is provided adjacent at least a portion of the base metal structural component. A protective component at least partially encapsulates the phase change material. Upon the presence of a spatial defect in the base metal structural component, the phase change material reacts with the base structural component to form an intermetallic compound to at least partially occupy the spatial defect. The phase change material at least partially encapsulated with the protective component may be disposed within the base metal structural component as a plurality of separate capsules incorporated therein, or the phase change material at least partially surrounds the base metal structural component. 1. A self-healing metal structure , comprising:a base metal structural component;a phase change material adjacent at least a portion of the base metal structural component; anda protective component at least partially encapsulating the phase change material,wherein, upon the presence of a spatial defect in the base metal structural component, the phase change material reacts with the base metal structural component to form an intermetallic compound to at least partially occupy the spatial defect.2. The self-healing metal structure according to claim 1 , wherein the base metal structural component comprises at least one of nickel claim 1 , copper claim 1 , and tin.3. The self-healing metal structure according to claim 1 , wherein the phase change material comprises at least one of tin and indium.4. The self-healing metal structure according to claim 1 , wherein the base metal structural component defines a plurality of cooling structures configured for transferring heat from an electronics component to a substrate.5. The self-healing metal structure according to claim 1 , ...

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Номер записи: 72
30-04-2020 дата публикации

POWER ELECTRONIC ASSEMBLIES WITH HIGH PURITY ALUMINUM PLATED SUBSTRATES

Номер: US20200135681A1
Автор: JOSHI Shailesh N., TAKE Naoya
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

An assembly that includes a first substrate, a second substrate, and a stress mitigation layer disposed between the first and the second substrates. The stress mitigation layer is directly bonded onto the second substrate, and the second substrate is separated from the intermetallic compound layer by the stress mitigation layer. The stress mitigation layer has a high purity of at least 99% aluminum such that the stress mitigation layer reduces thermomechanical stresses on the first and second substrates. The assembly further includes an intermetallic compound layer disposed between the first substrate and the stress mitigation layer such that the stress mitigation layer is separated from the first substrate by the intermetallic compound layer. 1. An assembly comprising:a first substrate;a second substrate; the stress mitigation layer is directly bonded onto the second substrate, and', 'the second substrate is separated from the intermetallic compound layer by the stress mitigation layer; and', 'the stress mitigation layer has a high purity of at least 99% aluminum such that the stress mitigation layer reduces thermomechanical stresses on the first and second substrates; and, 'a stress mitigation layer disposed between the first and the second substrates, whereinan intermetallic compound layer disposed between the first substrate and the stress mitigation layer such that the stress mitigation layer is separated from the first substrate by the intermetallic compound layer.2. The assembly of claim 1 , wherein the first substrate is a semiconductor device.3. The assembly of claim 1 , wherein the stress mitigation layer is formed of aluminum having a purity of at least 99.0%.4. The assembly of claim 1 , wherein the stress mitigation layer is formed of aluminum with at least 99.99% purity.5. The assembly of claim 1 , wherein the first substrate comprises silicon.6. The assembly of claim 1 , wherein the second substrate comprises copper or nickel.7. The assembly of claim 1 ...

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Номер записи: 73
09-05-2019 дата публикации

SYSTEMS FOR PROTECTING AND MONITORING POWER ELECTRONIC DEVICES

Номер: US20190140560A1
Автор: JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A system for protecting a power electronic device is provided. The system includes a power electronic device and a controller. The power electronic device includes a piezoelectric substrate, a metal substrate coupled to the piezoelectric substrate, a semiconductor device, and a bonding layer positioned between the metal substrate and the semiconductor device such that the metal substrate is bonded to the semiconductor device. The controller includes a power supply, one or more processors, and one or more memory modules storing computer readable and executable instructions. The computer readable and executable instructions, when executed by the one or more processors, cause the controller to: receive a temperature of the power electronic device, and provide a voltage determined based on the temperature of the power electronic device across the piezoelectric substrate. 1. A system for protecting a power electronic device , the system comprising: a piezoelectric substrate;', 'a metal substrate coupled to the piezoelectric substrate;', 'a semiconductor device; and', 'a bonding layer positioned between the metal substrate and the semiconductor device such that the metal substrate is bonded to the semiconductor device; and, 'a power electronic device comprising a power supply;', 'one or more processors; and', receive a temperature of the power electronic device; and', 'provide a voltage determined based on the temperature of the power electronic device across the piezoelectric substrate., 'one or more memory modules storing computer readable and executable instructions which, when executed by the one or more processors, cause the controller to], 'a controller comprising2. The system of claim 1 , wherein the piezoelectric substrate includes a lead zirconate titanate substrate.3. The system of claim 1 , further comprising a temperature sensor configured to measure the temperature of the power electronic device.4. The system of claim 1 , wherein the semiconductor device is a ...

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Номер записи: 74
30-04-2020 дата публикации

THERMAL MANAGEMENT SYSTEMS INCLUDING MULTIPLE PHASE CHANGING MATERIALS AND VEHICLES INCLUDING THE SAME

Номер: US20200136209A1
Автор: Dede Ercan Mehmet, JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A battery module including a battery cell and a thermal management system for removing heat from the battery cell. The thermal management system includes two or more unit cells in an array. Each unit cell includes a primary shell comprising a primary phase change material (PCM), and a secondary shell comprising a secondary PCM that is thermally coupled to the primary shell. The battery cell is thermally coupled to the primary shell at a heat transfer interface and the secondary shells of adjacent unit cells in the array are separate. 1. A battery module comprising:a battery cell; and a primary shell comprising a primary phase change material (PCM); and', 'a secondary shell comprising a secondary PCM that is thermally coupled to the primary shell, wherein:, 'two or more unit cells in an array, each unit cell comprising, 'a thermal management system for removing heat from the battery cell comprisingthe battery cell is thermally coupled to the primary shell at a heat transfer interface and the secondary shells of adjacent unit cells in the array are separate.2. The thermal management system of claim 1 , wherein the primary PCM has a lower melting temperature than the secondary PCM.3. The thermal management system of claim 1 , wherein the secondary PCM has a lower melting temperature than the primary PCM.4. The thermal management system of claim 1 , wherein the heat per unit volume capacity of the primary PCM varies along a length of the array.5. The thermal management system of claim 4 , wherein the heat per unit volume capacity of the primary PCM increases along the length of the array.6. The thermal management system of claim 1 , wherein the heat per unit volume capacity of the secondary PCM varies along a length of the array.7. The thermal management system of claim 6 , wherein the heat per unit volume capacity of the secondary PCM increases along the length of the array.8. The thermal management system of claim 1 , wherein the battery cell is directly thermally ...

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Номер записи: 75
30-04-2020 дата публикации

Thermal Management Systems Including Vapor Chambers and Phase Change Materials and Vehicles Including the Same

Номер: US20200136216A1
Автор: Dede Ercan Mehmet, JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A thermal management system for removing waste heat from a battery cell. The thermal management system includes a unit cell that includes a vapor chamber including an evaporator surface and a condenser surface. The evaporator surface and the condenser surface are fluidly connected by a wick. The unit cell also includes a phase change material (PCM) shell encapsulating a PCM. The evaporator surface is thermally coupled to the battery cell and absorbs waste heat generated by the battery cell. The condenser surface is thermally coupled to the PCM and rejects waste heat to the PCM. 1. A thermal management system for removing waste heat from a battery cell comprising: a vapor chamber comprising an evaporator surface and a condenser surface, wherein the evaporator surface and the condenser surface are fluidly connected by a wick; and', 'a phase change material (PCM) shell encapsulating a PCM, wherein, 'a unit cell that comprisesthe evaporator surface is thermally coupled to the battery cell and absorbs waste heat generated by the battery cell, andthe condenser surface is thermally coupled to the PCM and rejects waste heat to the PCM.2. The thermal management system of claim 1 , wherein the PCM shell comprises one or more ducts.3. The thermal management system of claim 1 , wherein the PCM shell comprises a metal foam including one or more pores wherein the PCM fills one or more of the one or more pores.4. The thermal management system of claim 3 , wherein the first capsule comprises a first PCM and the second capsule comprises a second PCM.5. The thermal management system of claim 4 , wherein the specific heat capacity of the first PCM and the second PCM are different.6. The thermal management system of claim 5 , wherein the first capsule is thermally coupled directly to the battery cell through the PCM shell.7. The thermal management system of claim 1 , wherein the unit cell further comprises:a second vapor chamber comprising a second working fluid and a second evaporator ...

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Номер записи: 76
22-09-2022 дата публикации

USING AN ELECTROSTATIC FORCE TO CAUSE AN OBJECT TO ADHERE TO A SURFACE OF A VEHICLE

Номер: US20220297609A1
Автор: Gandhi Umesh N., JOSHI Shailesh N., Tsuruta Ryohei
Принадлежит:

A system for using an electrostatic force to cause an object to adhere to a surface of a vehicle can include an electrode and a device. The electrode can be configured to be disposed within a structure of the vehicle. The structure can define the surface. A shape of the electrode can define a shape of a region of the surface. The device can be configured to connect the electrode to a voltage source so that, at a time at which the electrode is connected to the voltage source, an electric charge is produced on the electrode to produce the electrostatic force capable of causing the object to adhere to the surface. For example, the surface can include a dashboard, a dashboard vent frame, a sunglasses holder cover, or the like. For example, the object can include a mobile device, a cup, a pair of sunglasses, or the like. 1. A system , comprising:an electrode configured to be disposed within a structure of a vehicle, the structure defining a surface of the vehicle, a shape of the electrode defining a shape of a region of the surface; anda first device configured to connect the electrode to a voltage source so that, at a time at which the electrode is connected to the voltage source, an electric charge having a first polarity is produced on the electrode to produce an electrostatic force capable of causing an object to adhere to the surface.2. The system of claim 1 , wherein the object is made of a material having a property associated with an ability to hold an electric charge having a second polarity claim 1 , a value of the property for the material being greater than an average value of the property for materials.3. The system of claim 2 , wherein the property comprises at least one of a surface potential discharge rate claim 2 , a layer capacitance claim 2 , or a volume resistance.4. The system of claim 1 , wherein the object comprises at least one of a mobile device claim 1 , a cup claim 1 , a pair of sunglasses claim 1 , an item made of paper claim 1 , or a piece of ...

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Номер записи: 77
14-05-2020 дата публикации

Bendable laminated article including anisotropic layer

Номер: US20200147932A1
Автор: Arlin Lee Weikel, Dhananjay Joshi, Inna Igorevna KOUZMINA, Shinu BABY, Yousef Kayed Qaroush
Принадлежит: Corning Inc

A laminated glass article including a base layer, an anisotropic layer disposed over a top surface of the base layer, and a glass layer disposed over the anisotropic layer. The anisotropic layer may include homogeneous mechanical anisotropic properties measured at intervals of 250 microns. In some embodiments, the anisotropic layer may be an orthotropic layer including homogeneous mechanical orthotropic properties measured at intervals of 250 microns. The homogenous mechanical anisotropic or orthotropic properties of the anisotropic layer may provide a flexible laminated glass article with a high resistance to impact and puncture forces. In some embodiments, the laminated glass article may define all or a portion of a cover substrate for a consumer product.

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Номер записи: 78
14-05-2020 дата публикации

SYSTEMS AND METHODS FOR PROVIDING HEATING AND COOLING TO A VEHICLE CABIN OF AUTONOMOUS VEHICLES

Номер: US20200148029A1
Автор: Dede Ercan Mehmet, Fan Tianzhu, JOSHI Shailesh N., Zhou Feng
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

Systems and methods for providing heating and cooling to a cabin of an autonomous or semiautonomous electric vehicle. A system includes one or more autonomous or semiautonomous electric vehicle components generating thermal energy as a byproduct of operation, a radiator fluidly coupled to the one or more vehicle components and positioned downstream from the one or more vehicle components such that the radiator receives at least a portion of the thermal energy, a thermoelectric cooler thermally coupled to and located downstream from the radiator, and one or more bypass valves that control fluid flow from the radiator such that fluid flows directly to a cabin of the vehicle or flows through the thermoelectric cooler before flowing into the cabin. 121-. (canceled)22. A vehicle system , the vehicle system comprising:one or more autonomous or semiautonomous vehicle components generating thermal energy as a byproduct of operation;a radiator fluidly coupled to the one or more vehicle components and positioned downstream from the one or more vehicle components such that the radiator receives at least a portion of the thermal energy;a thermoelectric generator thermally coupled to and located downstream from the radiator; andone or more bypass valves that control fluid flow from the radiator such that fluid flows directly to a cabin of a vehicle or flows into the thermoelectric generator.23. The vehicle system of claim 22 , wherein:the thermoelectric generator generates electrical energy from excess thermal energy delivered in the fluid from the radiator; andthe electrical energy is stored in an energy storage device.24. The vehicle system of claim 22 , further comprising:a charger fluidly coupled to the cabin of the vehicle and positioned upstream from the cabin via the one or more bypass valves.25. The vehicle system of claim 22 , further comprising:an auxiliary blower fluidly coupled to the charger and positioned upstream from the charger, the auxiliary blower facilitating ...

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Номер записи: 79
14-05-2020 дата публикации

POWER ELECTRONICS MODULES INCLUDING INTEGRATED COOLING

Номер: US20200152548A1
Автор: Dede Ercan Mehmet, JOSHI Shailesh N., Liu Yanghe, TAKE Naoya
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A power electronics module includes a power electronics device, and an electrically-conductive substrate directly coupled to the power electronics device, the electrically-conductive substrate defining a plurality of channels extending through the electrically-conductive substrate, and a plurality of electrical pathways extending through the electrically-conductive substrate around the plurality of channels. 1. A power electronics module comprising:a power electronics device; and a plurality of channels extending through the electrically-conductive substrate; and', 'a plurality of electrical pathways extending through the electrically-conductive substrate around the plurality of channels., 'an electrically-conductive substrate directly coupled to the power electronics device, the electrically-conductive substrate defining2. The power electronics module of claim 1 , wherein the plurality of channels extend through the electrically-conductive substrate in a longitudinal direction claim 1 , and the plurality of electrical pathways extend through the electrically-conductive substrate in a direction that is transverse to the longitudinal direction.3. The power electronics module of claim 1 , wherein the power electronics device defines a power electronics lower surface directly coupled to the electrically-conductive substrate claim 1 , and wherein the plurality of channels extends in a direction aligned with the power electronics lower surface of the power electronics device.4. The power electronics module of claim 1 , wherein the electrically-conductive substrate defines a plurality of walls that are positioned between individual channels of the plurality of channels and that define the plurality of electrical pathways.5. The power electronics module of claim 4 , wherein the electrically-conductive substrate further comprises an upper substrate surface and a lower substrate surface positioned opposite the upper substrate surface claim 4 , wherein the plurality of walls ...

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Номер записи: 80
14-05-2020 дата публикации

Power electronics modules including integrated jet cooling

Номер: US20200152549A1
Автор: Ercan Mehmet DEDE, Naoya TAKE, Shailesh N. Joshi
Принадлежит: Toyota Motor Engineering and Manufacturing North America Inc

A power electronics module includes an electrically-conductive substrate including a base portion defining a plurality of orifices that extend through the base portion, the plurality of orifices defining a plurality of jet paths extending along and outward from the plurality of orifices, and a plurality of posts extending outward from the base portion, where individual posts of the plurality of posts are positioned between individual orifices of the plurality of orifices, and a power electronics device coupled to the plurality of posts opposite the base portion, the power electronics device defining a bottom surface that is oriented transverse to the plurality of jet paths.

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Номер записи: 81
25-06-2015 дата публикации

NITROGEN CONTAINING COMPOUNDS

Номер: US20150174133A1
Автор: Bhagwat Sachin, Bhawasar Satish, Deshpande Prasad Keshav, GUPTA Sunil, Jafri Mohammad Alam, Joshi Sanjeev, Kale Rajesh, Mishra Amit, PATEL Mahesh Vithalbhai, PAVASE Laxmikant
Принадлежит: WOCKHARDT LIMITED

Compounds of Formula (I), their preparation and use in preventing or treating bacterial infection is disclosed. 2. A method according to claim 1 , wherein the compound of Formula (I) is selected from:trans-sulfuric acid mono-[2-(N′-[(S)-pyrrolidin-2-carbonyl]-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-((R)-piperidin-3-carbonyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-hydrazinocarbonyl-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-(amino-acetyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-(3-amino-propioyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-(4-amino-butanoyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-((2S)-2-amino-3-hydroxy-propioyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-[(2S,4S)-4-fluoro-pyrrolidin-2-carbonyl]-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-[(2S,4R)-4-methoxy-pyrrolidin-2-carbonyl]-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-(piperidin-4-carbonyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-((RS)-piperidin-3-carbonyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-((S)-piperidin-3-carbonyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-((RS)-piperidin-2-carbonyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-((S)-piperidin-2-carbonyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3.2.1]oct-6-yl]ester;trans-sulfuric acid mono-[2-(N′-((R)-piperidin-2-carbonyl)-hydrazinocarbonyl)-7-oxo-1,6-diaza-bicyclo[3 ...

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Номер записи: 82
24-06-2021 дата публикации

THERMAL MANAGEMENT ASSEMBLIES FOR ELECTRONIC ASSEMBLIES CIRCUMFERENTIALLY MOUNTED AROUND A MOTOR USING A FLEXIBLE SUBSTRATE

Номер: US20210194323A1
Автор: JOSHI Shailesh N., Suenaga Shohei
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

An electronic assembly includes a flexible printed circuit board (PCB) circumferentially disposed around a motor and a thermal management assembly (TMA) thermally connected to the flexible PCB. One or more switching semiconductor devices are disposed on a first surface of the flexible PCB. The TMA includes a cooling jacket, at least one jacket manifold formed through the cooling jacket and a thermal compensation base layer thermally coupled to the cooling jacket. The cooling jacket is mounted around a circumference of the motor and has a mounting surface concentric with the circumference of the motor. The mounting surface is coupled to the first surface of the flexible PCB. The at least one jacket manifold has a fluid inlet and a fluid outlet defining a fluid flow area therebetween. The thermal compensation base layer is thermally coupled to the cooling jacket and the one or more switching semiconductor devices. 1. A thermal management assembly for cooling an electronic assembly on a flexible printed circuit board circumferentially disposed around a motor , the thermal management assembly comprising:a cooling jacket configured to be mounted around a circumference of the motor, the cooling jacket having a mounting surface concentric with the circumference of the motor;at least one jacket manifold formed through the cooling jacket, the at least one jacket manifold having a fluid inlet and a fluid outlet and defining a fluid flow area therebetween; anda thermal compensation base layer thermally coupled to the cooling jacket and configured to thermally connect the cooling jacket and one or more devices on the flexible printed circuit board.2. The thermal management assembly of claim 1 , wherein the cooling jacket is formed from one or more of the following: copper claim 1 , aluminum claim 1 , and nickel.3. The thermal management assembly of claim 1 , wherein the thermal compensation base layer is formed from one or more of the following: copper claim 1 , aluminum claim ...

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Номер записи: 83
24-06-2021 дата публикации

THERMAL MANAGEMENT ASSEMBLIES FOR ELECTRONIC ASSEMBLIES MOUNTED ON A MOTOR END

Номер: US20210195810A1
Автор: JOSHI Shailesh N., Suenaga Shohei
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

An electronic assembly includes a PCB disposed on an end-face of a motor proximate to a first surface thereof and a thermal management assembly (TMA) thermally connected to the PCB. One or more switching semiconductor devices are disposed on the first surface. The TMA includes a cooling jacket disposed around a circumference of the motor, at least one jacket manifold formed through the cooling jacket, a thermal compensation base layer thermally coupled to the cooling jacket and the one or more switching semiconductor devices, and a cooling manifold disposed through the PCB to form a fluid flow path therethrough. The at least one jacket manifold has a fluid inlet and a fluid outlet. Two or more electrically insulated posts, each having a cooling channel, are disposed between the at least one jacket manifold and the cooling manifold and form a fluid circuit between the fluid inlet and the fluid outlet. 1. A thermal management assembly for cooling an electronic assembly disposed on a printed circuit board on an end-face of a motor , the thermal management assembly comprising:a cooling jacket configured to be disposed around a circumference of the motor;at least one jacket manifold formed through the cooling jacket, the at least one jacket manifold having a fluid inlet and a fluid outlet and defining a fluid flow area therebetween;a thermal compensation base layer thermally coupled to the cooling jacket and configured to thermally connect the cooling jacket and one or more devices on the printed circuit board;a cooling manifold configured to be disposed through the printed circuit board and form a fluid flow path through the printed circuit board; andtwo or more electrically insulated posts disposed between the at least one jacket manifold and the cooling manifold and having a cooling channel through individual electrically insulated posts, wherein the cooling channel in at least a first electrically insulated post fluidly connects the fluid inlet to the cooling ...

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Номер записи: 84
30-05-2019 дата публикации

MULTILAYER COMPOSITE BONDING MATERIALS AND POWER ELECTRONICS ASSEMBLIES INCORPORATING THE SAME

Номер: US20190164760A1
Автор: JOSHI Shailesh N.
Принадлежит:

A multilayer composite bonding material for transient liquid phase bonding a semiconductor device to a metal substrate includes thermal stress compensation layers sandwiched between a pair of bonding layers. The thermal stress compensation layers may include a core layer with a first stiffness sandwiched between a pair of outer layers with a second stiffness that is different than the first stiffness such that a graded stiffness extends across a thickness of the thermal stress compensation layers. The thermal stress compensation layers have a melting point above a sintering temperature and the bonding layers have a melting point below the sintering temperature. The graded stiffness across the thickness of the thermal stress compensation layers compensates for thermal contraction mismatch between the semiconductor device and the metal substrate during cooling from the sintering temperature to ambient temperature. 1. A multilayer composite bonding material for transient liquid phase bonding comprising:thermal stress compensation layers sandwiched between a pair of bonding layers, the thermal stress compensation layers comprising a first core layer with a first stiffness sandwiched between a pair of outer layers with a second stiffness that is different than the first stiffness, wherein the pair of outer layers with the second stiffness is sandwiched between a pair of second core layers with one of the first stiffness and a third stiffness, the third stiffness different from the first stiffness and the second stiffness, such that a graded stiffness extends across a thickness of the thermal stress compensation layers; the thermal stress compensation layers each have a melting point above a sintering temperature and the pair of bonding layers each have a melting point below the sintering temperature;', 'the sintering temperature is in a range between about 280° C. and 350° C., 'wherein2. The multilayer composite bonding material of claim 1 , wherein the first stiffness ...

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Номер записи: 85
21-05-2020 дата публикации

COOLING CHIP STRUCTURES HAVING A JET IMPINGEMENT SYSTEM AND ASSEMBLY HAVING THE SAME

Номер: US20200161217A1
Автор: JOSHI Shailesh N., TAKE Naoya
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

Embodiments described herein generally relate to an electronics assembly that includes a semiconductor device, a substrate layer, a first mesh layer and a second mesh layer. Jet channels that have a first inner diameter are disposed within the substrate layer. The first mesh layer includes a first plurality of pores that have a perimeter opening. The second mesh layer includes a second plurality of pores that have a second inner diameter. The jet channels, the first and the second plurality of pores are concentric to create a fluid path for a fluid to impinge a first device surface of the semiconductor device. The second inner diameter is smaller than the perimeter opening and the first inner diameter of the substrate layer such that a cooling fluid velocity increases when flowing from the substrate layer through the second mesh layer. 1. An assembly comprising:an electrode, a first substrate layer surface,', 'a second substrate layer surface opposite the first substrate layer surface, and', 'one or more jet channels disposed within the substrate layer between the first substrate layer surface and the second substrate layer surface, each jet channel of the one or more jet channels having a first opening at the first substrate layer surface and a second opening at the second substrate layer surface,, 'a substrate layer spaced apart from the electrode, the substrate layer comprisinga first mesh layer positioned between the electrode and the substrate layer, the first mesh layer comprising a first plurality of pores, each one of the first plurality of pores is concentric with a corresponding second opening of the jet channels, anda second mesh layer positioned between the electrode and the first mesh layer, the second mesh layer comprising a second plurality of pores, each one of the second plurality of pores is concentric with a corresponding one of the first plurality of pores.2. The assembly of claim 1 , wherein:each jet channel of the one or more jet channels has a ...

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Номер записи: 86
23-06-2016 дата публикации

HIERARCHICAL MEMORY SYSTEM COMPILER

Номер: US20160179394A1
Автор: Chuang Shang-Tse, Iyer Sundar, Joshi Sanjeev
Принадлежит:

Designing memory subsystems for integrated circuits can be time-consuming and costly task. To reduce development time and costs, an automated system and method for designing and constructing high-speed memory operations is disclosed. The automated system accepts a set of desired memory characteristics and then methodically selects different potential memory system design types and different implementations of each memory system design type. The potential memory system design types may include traditional memory systems, optimized traditional memory systems, intelligent memory systems, and hierarchical memory systems. A selected set of proposed memory systems that meet the specified set of desired memory characteristics is output to a circuit designer. When a circuit designer selects a proposed memory system, the automated system generates a complete memory system design, a model for the memory system, and a test suite for the memory system. 1. (canceled)2. (canceled)3. (canceled)4. (canceled)5. (canceled)6. (canceled)7. (canceled)8. (canceled)9. (canceled)10. (canceled)11. A method of designing a target hierarchical intelligent memory system , said method comprising:receive a specification for a memory system that can handle N read operations and M write operations simultaneously;generate an initial intelligent memory module, said initial intelligent memory module handling fewer than N read operations and fewer M write operations simultaneously; andgenerating a series of subsequent hierarchical intelligent memory modules from said initial intelligent memory module wherein each subsequent hierarchical intelligent memory module handles at least one more read operation or one more write operation until a hierarchical intelligent memory module that handles N read operations and M write operations is reached.12. The method of designing a target hierarchical intelligent memory system as set forth in wherein each of said subsequent hierarchical intelligent memory modules ...

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Номер записи: 87
02-07-2015 дата публикации

JET IMPINGEMENT COOLING APPARATUSES HAVING NON-UNIFORM JET ORIFICE SIZES

Номер: US20150184947A1
Автор: JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

Jet impingement cooling apparatuses are disclosed. One cooling apparatus includes at least one fluid inlet channel, at least one fluid outlet channel, a target surface, and a jet orifice surface that is offset from the target surface. The jet orifice surface includes an array of jet orifices fluidly coupled to the at least one fluid inlet channel, wherein each individual jet orifice of the array of jet orifices has an area corresponding to a distance of the individual jet orifice to the at least one fluid outlet channel such that individual jet orifices closer to the at least one fluid outlet have an area that is smaller than individual jet orifices further from the at least one fluid outlet. The area of each individual jet orifice of the array of jet orifices increases radially from a central region of the array of jet orifices. 1. A cooling apparatus comprising:at least one fluid inlet channel;at least one fluid outlet channel;a target surface; and each individual jet orifice of the array of jet orifices has an area corresponding to a distance of the individual jet orifice to the at least one fluid outlet channel such that individual jet orifices closer to the at least one fluid outlet channel have an area that is smaller than individual jet orifices further from the at least one fluid outlet channel, and', 'the area of the individual jet orifices of the array of jet orifices increases radially from a central region of the array of jet orifices., 'a jet orifice surface that is offset from the target surface and comprising an array of jet orifices fluidly coupled to the at least one fluid inlet channel, wherein2. The cooling apparatus of claim 1 , wherein the array of jet orifices are configured such that coolant fluid within the fluid inlet channel flows through the array of jet orifices as an array of impingement jets comprising individual impingement jets that impinge the target surface at substantially equal fluid velocity.3. The cooling apparatus of claim 2 , ...

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Номер записи: 88
08-07-2021 дата публикации

METHOD AND SYSTEM FOR CRANKING AN INTERNAL COMBUSTION ENGINE

Номер: US20210211077A1
Автор: ANAYKUMAR Joshi
Принадлежит:

The invention relates to a method for cranking an internal combustion engine, including the steps of: (a) receiving a start signal; (b) determining an initial position of the rotor with respect to a stator phase winding; (c) applying a pulse-width-modulated signal to the stator winding corresponding to determined initial position of the rotor; (d) determining a threshold value of the stator current variation; (e) measuring current of the stator winding in response to applied pulse-width-modulated signal to determine current variation; (f) if current variation is more than the threshold value, determining updated rotor position, applying a pulse-width-modulated signal to the stator winding corresponding to the updated rotor position; and repeating steps (d)-(f); and (g) if current variation is less than the threshold value, applying a pulse-width-modulated signal to the stator winding corresponding to the last updated rotor position and repeating steps (d)-(g). 1. A method for cranking an internal combustion engine , the engine coupled to a permanent magnet machine comprising a rotor having a plurality of permanent magnets poles , and a stator having a plurality of phase windings disposed on the stator , each phase winding including a plurality of coils , the method comprising the steps of:(a) receiving a start signal;(b) determining an initial position of the rotor with respect to a stator phase winding;(c) applying a pulse-width-modulated (PWM) signal to the stator winding corresponding to determined initial position of the rotor;(d) determining a threshold value of the stator current variation;(e) measuring current of the stator winding in response to applied pulse-width-modulated signal to determine current variation;(f) if current variation is more than the threshold value: determining updated rotor position, applying a pulse-width-modulated signal to the stator winding corresponding to the updated rotor position; and repeating steps (d)-(f); and(g) if current ...

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Номер записи: 89
29-06-2017 дата публикации

RAPID WARM-UP SCHEMES OF ENGINE AND ENGINE COOLANT FOR HIGHER FUEL EFFICIENCY

Номер: US20170183979A1
Автор: Dede Ercan Mehmet, JOSHI Shailesh N.
Принадлежит:

A system for rapidly heating a vehicle engine when the engine is below a pre-determined temperature allows for improved fuel efficiency after a vehicle cold-start. The system includes an organic Rankine cycle (ORC) loop having a two-phase ORC fluid traveling circuitously through a conduit. The ORC fluid is vaporized by a power electronics cooling device and by an evaporator in thermal communication with exhaust waste heat. The vaporized ORC fluid is passed through an expander to generate electrical power. When the vehicle engine is below the pre-determined temperature, heat from the vaporized ORC fluid is transferred directly or indirectly to the engine. When the vehicle engine is at or above the pre-determined temperature, heat from the vaporized ORC fluid is instead transferred to an alternate heat sink. 1. A system for rapidly heating a vehicle engine , the system comprising:an engine block; and direct vaporized ORC fluid through the engine block when the engine is operating below a pre-determined temperature; and', 'direct condensed ORC fluid through the engine block when the engine is operating at or above the pre-determined temperature., 'an ORC fluid conduit in direct thermal communication with the engine block, the ORC fluid conduit being configured to direct an ORC fluid through a circuit, the ORC loop being configured to selectively, 'an organic Rankine cycle (ORC) loop comprising2. The system as recited in claim 1 , further comprising at least one of a power electronics cooler and an evaporator to vaporize the ORC fluid.3. The system as recited in claim 1 , further comprising an expander configured to decrease a pressure of the vaporized ORC fluid claim 1 , wherein the expander is in mechanical communication with an electric generator configured to produce electrical power.4. The system as recited in claim 1 , further comprising a heat sink in thermal communication with the ORC loop and configured to remove heat from low pressure vaporized ORC fluid.5. ...

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Номер записи: 90
04-06-2020 дата публикации

COOLING DEVICES INCLUDING A VARIABLE ANGLE CONTACT SURFACE AND METHODS FOR COOLING HEAT-GENERATING DEVICES WITH A COOLING DEVICE

Номер: US20200173733A1
Автор: JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A cooling device includes a substrate defining a substrate upper surface, and a fin positioned on the substrate upper surface, the fin including a deformable encapsulating layer coupled to the substrate upper surface and defining an interior region, and a phase-change material encapsulated within the interior region, where the phase-change material changes from a first matter phase to a second matter phase at a boiling point of a working fluid positioned on the deformable encapsulating layer. 1. A cooling device comprising:a substrate defining a substrate upper surface;a deformable encapsulating layer coupled to the substrate upper surface and defining an interior region; anda phase-change material encapsulated within the interior region, wherein the phase-change material changes from a first matter phase to a second matter phase at a boiling point of a working fluid positioned on the deformable encapsulating layer.2. The cooling device of claim 1 , wherein the phase-change material has a melting point that is within 5 degrees Celsius of the boiling point of the working fluid.3. The cooling device of claim 1 , wherein the deformable encapsulating layer hermetically seals the phase-change material on the substrate upper surface to form a fin positioned on the substrate upper surface.4. The cooling device of claim 1 , wherein the deformable encapsulating layer comprises a thickness that is less than 100 nanometers.5. The cooling device of claim 1 , wherein the phase-change material comprises a static state thickness that is between 100 micrometers and 500 micrometers.6. A cooling system comprising: a substrate defining a substrate upper surface;', 'a deformable encapsulating layer coupled to the substrate upper surface, wherein the deformable encapsulating layer is repositionable between a static position, in which the deformable encapsulating layer is oriented to face upward in a vertical direction, and a dynamic position, in which the deformable encapsulating layer ...

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Номер записи: 91
15-07-2021 дата публикации

SYSTEMS AND METHODS FOR FALSE-POSITIVE REDUCTION IN POWER ELECTRONIC DEVICE EVALUATION

Номер: US20210215760A1
Автор: Bazzi Ali M., JOSHI Shailesh N., KAMINSKI John, McMenemy Donald, PATTIPATI Krishna
Принадлежит:

Systems and methods of testing the health of vehicular power devices are disclosed herein. A method may include producing operating points as a function of cycling current (I) and voltage drain to source (V) when a subject device is conducting current. The method may further include determining a mean of moving distribution to adapt a center of the moving distribution contrasted with a plurality of known healthy devices. The method may also include indicating an imminent fault in the subject device based upon a discontinuity among operating points above a threshold. 1. A method comprising:{'sub': ds', 'ds, 'producing operating points as a function of cycling current (I) and voltage drain to source (V) when a subject device is conducting current;'}determining a mean of moving distribution to adapt a center of the moving distribution contrasted with a plurality of known healthy devices; andindicating an imminent fault in the subject device based upon a discontinuity among operating points above a threshold.2. The method of further comprising determining a mean of the moving distribution through an exponentially weighted moving average.3. The method of further comprising:modelling the moving distribution via a principal component analysis process; andforming the moving distribution from a portion of data observed during a time period when the subject device was in a healthy condition.4. The method of further comprising updating the mean of the moving distribution to account for observed measurements drifting under accelerated aging tests within healthy operation.5. The method of further comprising determining an imminent fault based upon discontinuities in features above a threshold before the subject device is powered on.6. The method of further comprising computing median values for each cycle when the subject device is powered on.7. The method of further comprising removing an exponentially weighted moving average estimate of the mean of observed measurements.8. The ...

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Номер записи: 92
15-07-2021 дата публикации

SYSTEMS AND METHODS FOR AUTO-ENCODER BEHAVIOR MODELLING OF VEHICLE COMPONENTS

Номер: US20210216876A1
Автор: Bazzi Ali M., JOSHI Shailesh N., KAMINSKI John, McMenemy Donald, PATTIPATI Krishna
Принадлежит:

Systems and methods of auto-encoder behavior modelling of vehicle components are described herein. A method for electronic device health prediction may include encoding input data into a reduced feature set via an auto-encoder as part of an artificial neural network. The method may further include decoding the reduced feature set. The method may also include reading the reduced feature set as output. The method may still further include encoding features of a subject device and other devices, wherein at least one of the other devices is designated as a healthy device. The method may additionally include associating the features of the other devices with a healthy device cluster based on a threshold distance. The method may also additionally include associating the features of the subject device with the healthy device cluster, wherein the subject device is flagged as faulty based upon exceeding the threshold distance from the healthy device cluster. 1. A method for electronic device health prediction comprising:encoding input data into a reduced feature set via an auto-encoder as part of an artificial neural network;decoding the reduced feature set;reading the reduced feature set as output;encoding features of a subject device and other devices, wherein at least one of the other devices is designated as a healthy device;associating the features of the other devices with a healthy device cluster based on a threshold distance; andassociating the features of the subject device with the healthy device cluster, wherein the subject device is flagged as faulty based upon exceeding the threshold distance from the healthy device cluster.2. The method of further comprising receiving a multi-dimensional input feature set of three or more dimensions.3. The method of wherein the multi-dimensional input feature set comprises a plurality of diode temperatures claim 2 , a case to heat-sink temperature difference claim 2 , a voltage drain to source claim 2 , a current drain to ...

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Номер записи: 93
25-09-2014 дата публикации

JET IMPINGEMENT COOLING APPARATUSES HAVING NON-UNIFORM JET ORIFICE SIZES

Номер: US20140284787A1
Автор: JOSHI Shailesh N.
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

Jet impingement cooling apparatuses having non-uniformly sized jet orifices for producing an array of impingement jets that impinge a target surface are disclosed. In one embodiment, a cooling apparatus includes at least one fluid inlet channel, at least one fluid outlet channel, a target surface, and a jet orifice surface that is offset from the target surface. The jet orifice surface includes an array of jet orifices fluidly coupled to the at least one fluid inlet channel, wherein each individual jet orifice of the array of jet orifices has an area corresponding to a distance of the individual jet orifice to the at least one fluid outlet channel such that individual jet orifices closer to the at least one fluid outlet have an area that is smaller than individual jet orifices further from the at least one fluid outlet. Power electronics modules are also disclosed. 1. A cooling apparatus comprising:at least one fluid inlet channel;at least one fluid outlet channel;a target surface; anda jet orifice surface that is offset from the target surface and comprising an array of jet orifices fluidly coupled to the at least one fluid inlet channel, wherein each individual jet orifice of the array of jet orifices has an area corresponding to a distance of the individual jet orifice to the at least one fluid outlet channel such that individual jet orifices closer to the at least one fluid outlet channel have an area that is smaller than individual jet orifices further from the at least one fluid outlet channel.2. The cooling apparatus of claim 1 , wherein the array of jet orifices are configured such that coolant fluid within the fluid inlet channel flows through the array of jet orifices as an array of impingement jets comprising individual impingement jets that impinge the target surface at substantially equal fluid velocity.3. The cooling apparatus of claim 2 , wherein the individual jet orifices of the array of jet orifices are sized such that each individual impingement ...

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Номер записи: 94
13-07-2017 дата публикации

Process for preparation of (2S, 5R)-7-oxo-6-sulphooxy-2-[((3R)-piperidine-3-carbonyl)-hydrazino carbonyl]-1,6-diaza-bicyclo [3.2.1]-octane

Номер: US20170197963A1
Автор: AHIRRAO Vinod Kashinath, Bhawsar Satish, Deshpande Prasad Keshav, Jadhav Sunil Bhaginath, Joshi Sanjeev, PATEL Mahesh Vithalbhai, Pawar Shivaji Sampatrao, WANKHEDE Karuna Suresh, YEOLE Ravindra Dattatraya
Принадлежит:

A process for preparation of (2S, 5R)-7-oxo-6-sulphooxy-2-[((3R)-piperidine-3-carbonyl)-hydrazino carbonyl]-1,6-diaza-bicyclo[3.2.1]octane is disclosed. 3. The compound of claim 1 , having a purity of at least about 95% as determined by HPLC.4. The compound of claim 1 , having an X-ray powder diffraction pattern substantially as shown in .5. The compound of claim 1 , having an X-ray powder diffraction pattern comprising a peak selected from the group consisting of 10.28 (±0.2) claim 1 , 10.57 (±0.2) claim 1 , 12.53 (±0.2) claim 1 , 13.82 (±0.2) claim 1 , 15.62 (±0.2) claim 1 , 18.16 (±0.2) claim 1 , 18.49 (±0.2) claim 1 , 20.35 (±0.2) claim 1 , 20.64 (±0.2) claim 1 , 21.33 (±0.2) claim 1 , 22.99 (±0.2) claim 1 , 23.18 (±0.2) claim 1 , 24.27 (±0.2) claim 1 , 24.81 (±0.2) claim 1 , 25.45 (±0.2) claim 1 , 29.85 (±0.2) claim 1 , 30.45 (±0.2) claim 1 , 32.39 (±0.2) claim 1 , and 36.84 (±0.2) degrees 2 theta.6. The compound of claim 1 , having an X-ray powder diffraction pattern comprising a peak selected from the group consisting of 10.28 (±0.2) claim 1 , 10.57 (±0.2) claim 1 , 12.53 (±0.2) claim 1 , 13.82 (±0.2) claim 1 , 15.62 (±0.2) claim 1 , 18.16 (±0.2) claim 1 , 18.49 (±0.2) claim 1 , 20.35 (±0.2) claim 1 ,20. 64 (±0.2) claim 1 , 21.33 (±0.2) claim 1 , 24.27 (±0.2) claim 1 , 24.81 (±0.2) claim 1 , and 25.45 (±0.2) degrees 2 theta.7. A pharmaceutical composition comprising the compound of .8. A pharmaceutical composition comprising the compound of .9. A pharmaceutical composition comprising the compound of .10. A pharmaceutical composition comprising the compound of .11. A pharmaceutical composition comprising the compound of .12. A pharmaceutical composition comprising the compound of . This application is a Continuation of U.S. application Ser. No. 14/769,815, filed Aug. 23, 2015, now pending, which entered the National Phase of Serial No. PCT/IB2013/059326, filed Oct. 12, 2013 which claims the benefit of Indian Patent Application No. 717/MUM/2013 filed on Mar. 8, ...

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Номер записи: 95
11-06-2020 дата публикации

COOLING DEVICES INCLUDING JET COOLING WITH AN INTERMEDIATE MESH AND METHODS FOR USING THE SAME

Номер: US20200187392A1
Автор: JOSHI Shailesh N., TAKE Naoya
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

An assembly includes a substrate including a base portion defining a plurality of orifices that extend through the base portion, the plurality of orifices defining a plurality of jet paths extending along and outward from the plurality of orifices, a mesh coupled to the base portion, the mesh defining a plurality of pores aligned with the plurality of jet paths, and a heat-generating device coupled to the mesh opposite the base portion, the heat-generating device defining a bottom surface that is oriented transverse to the plurality of jet paths. 1. An assembly comprising:a substrate comprising a base portion defining a plurality of orifices that extend through the base portion, the plurality of orifices defining a plurality of jet paths extending along and outward from the plurality of orifices;a mesh coupled to the base portion, the mesh defining a plurality of apertures aligned with the plurality of jet paths;a heat-generating device coupled to the mesh opposite the base portion, the heat-generating device defining a bottom surface that is oriented transverse to the plurality of jet paths; andan intermediate layer positioned on the bottom surface of the heat-generating device, the intermediate layer intersecting the plurality of jet paths, wherein the intermediate layer comprises a phase-change material selected to transition from one phase to another phase at a temperature that corresponds to an operating temperature of the heat-generating device.2. The assembly of claim 1 , wherein a span of each orifice of the plurality of orifices of the base portion is different than a span of each of the apertures of the plurality of apertures of the mesh.3. The assembly of claim 1 , wherein the mesh is spaced apart from the base portion in a vertical direction extending between the base portion and the heat-generating device.4. The assembly of claim 1 , wherein the mesh comprises a planar portion defining the plurality of apertures claim 1 , and wherein the planar portion ...

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Номер записи: 96
05-08-2021 дата публикации

Methods For Forming Flow Channels In Metal Inverse Opal Structures

Номер: US20210238033A1
Автор: Braun Paul, JOSHI Shailesh N., Kohanek Julia, Singhal Gaurav
Принадлежит:

A method for forming a flow channel in a MIO structure includes positioning a plurality of sacrificial spheres along a base substrate, heating a region of the plurality of sacrificial spheres above a melting point of the plurality of sacrificial spheres, thereby fusing the plurality of sacrificial spheres together and forming a solid channel, electrodepositing material between the plurality of sacrificial spheres and around the solid channel, removing the plurality of sacrificial spheres to form the MIO structure, and removing the solid channel to form the flow channel extending through the MIO structure. 1. A method for forming a flow channel in a MIO structure , the method comprising:positioning a plurality of sacrificial spheres along a base substrate;heating a region of the plurality of sacrificial spheres above a melting point of the plurality of sacrificial spheres, thereby fusing the plurality of sacrificial spheres together and forming a solid channel, wherein heating the region of the plurality of sacrificial spheres comprises directing electromagnetic energy onto the region of the plurality of sacrificial spheres with an electromagnetic energy source;electrodepositing material between the plurality of sacrificial spheres and around the solid channel;removing the plurality of sacrificial spheres to form the MIO structure; andremoving the solid channel to form the flow channel extending through the MIO structure.2. The method of claim 1 , wherein removing the plurality of sacrificial spheres comprises dissolving the plurality of sacrificial spheres with a solution.3. The method of claim 1 , wherein removing the solid channel comprises dissolving the solid channel with a solution.4. The method of claim 1 , wherein electrodepositing the material comprises electrodepositing copper or nickel between the plurality of sacrificial spheres and around the solid channel.5. The method of claim 1 , further comprising positioning a capping layer over the MIO structure.6. ...

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Номер записи: 97
05-08-2021 дата публикации

Glass ceramic articles having improved properties and methods for making the same

Номер: US20210238083A1
Автор: Andrew Peter Kittleson, Bin Yang, Carol Ann Click, Charlene Marie Smith, Dhananjay Joshi, Erika Lynn STAPLETON, Galan Gregory Moore, James Howard Edmonston, Jill Marie Hall, John Richard RIDGE, John Robert SALTZER, Jr., Katherine Weber KROEMER, Ljerka Ukrainczyk, Mathieu Gerard Jacques HUBERT, Matthew Daniel Trosa, Qiang Fu, Rohit Rai, Shelby Kerin WILSON, Zheming ZHENG
Принадлежит: Corning Inc

A glass ceramic article including a lithium disilicate crystalline phase, a petalite crystalline phased, and a residual glass phase. The glass ceramic article has a warp (μm)<(3.65×10−9/μm×diagonal2) where diagonal is a diagonal measurement of the glass ceramic article in μm, a stress of less than 30 nm of retardation per mm of glass ceramic article thickness, a haze (%)<0.0994t+0.12 where t is the thickness of the glass ceramic article in mm, and an optical transmission (%)>0.91×10(2−0.03t) of electromagnetic radiation wavelengths from 450 nm to 800 nm, where t is the thickness of the glass ceramic article in mm.

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Номер записи: 98
05-08-2021 дата публикации

METHODS FOR FORMING A FLAT SURFACE MIO STRUCTURE

Номер: US20210238761A1
Автор: Braun Paul, JOSHI Shailesh N., Singhal Gaurav
Принадлежит:

Embodiments of the disclosure relate to methods for forming a flat surface MIO structure for bonding and cooling electronic assemblies. In one embodiment, the method includes providing a plurality of particles on a surface of a base substrate. A metal is then deposited onto the plurality of particles up to a desired level to form a metal layer such that the plurality of particles is partially covered by the metal layer. An adhesive member is then applied to the plurality of particles exposed above the metal layer. Finally the adhesive member is pulled to remove individual particles of the plurality of particles that are exposed above the metal layer. 1. A method of forming a flat surface on an MIO structure , the method comprising:providing a plurality of particles on a surface of a base substrate;depositing a metal onto the plurality of particles up to a desired level to form a metal layer such that the plurality of particles is partially covered by the metal layer;applying an adhesive member to the plurality of particles exposed above the metal layer; andpulling the adhesive member to remove individual particles of the plurality of particles that are exposed above the metal layer.2. The method of claim 1 , wherein the plurality of particles comprise polystyrene.3. The method of claim 1 , wherein the metal of the MIO structure comprises copper claim 1 , nickel claim 1 , aluminum claim 1 , silver claim 1 , zinc claim 1 , magnesium claim 1 , or alloys thereof.4. The method of claim 1 , wherein the metal layer is deposited through electrodeposition.5. The method of further comprising forming a cap layer above the metal layer with further deposition of the metal above the plurality of particles.6. The method of further comprising:removing the plurality of particles to form a plurality of voids within the MIO structure by dissolving the MIO structure in an organic solution.7. The method of claim 6 , wherein the organic solution is selected from one of: toluene claim 6 , ...

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Номер записи: 99
05-08-2021 дата публикации

METHODS AND SYSTEMS TO DETECT SUB-SURFACE DEFECTS IN ELECTRONICS MODULES USING SHEAR FORCE MICROSCOPY

Номер: US20210239653A1
Автор: JOSHI Shailesh N., SUNDARESAN Vishnu Baba, Venkatesh Vijay
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A method of detecting sub-surface voids in a sample comprises positioning a probe adjacent to a first point on the sample, emitting an ultrasonic wave from the probe towards the sample, moving the probe towards the sample, measuring a shear force amplitude of a reflection of the ultrasonic wave at the probe as the probe moves towards the sample, creating an approach curve by plotting the measured shear force amplitude of the reflection of the ultrasonic wave as a function of a distance between the probe and the sample, and determining whether a sub-surface void exists at the first point on the sample based on a slope of the approach curve. 1. A method of detecting sub-surface voids in a sample:positioning a probe adjacent to a first point on the sample;emitting an ultrasonic wave from the probe towards the sample;moving the probe towards the sample;measuring a shear force amplitude of a reflection of the ultrasonic wave at the probe as the probe moves towards the sample;creating an approach curve by plotting the measured shear force amplitude of the reflection of the ultrasonic wave as a function of a distance between the probe and the sample; anddetermining whether a sub-surface void exists at the first point on the sample based on a slope of the approach curve.2. The method of claim 1 , wherein the probe comprises a glass electrode.3. The method of claim 1 , wherein the probe comprises a dither to emit ultrasonic waves and a receiver to detect reflected ultrasonic waves.4. The method of claim 1 , wherein the ultrasonic wave has a frequency that is sensitive to sub-surface voids in the sample.5. The method of claim 1 , wherein the slope of the approach curve is lower when a sub-surface void exists at the first point on the sample compared to when a sub-surface void does not exist at the first point on the sample.6. The method of claim 1 , further comprising:determining an optimum frequency to which sub-surface voids are most sensitive; andemitting the ultrasonic ...

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