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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 17. Отображено 16.
02-01-2020 дата публикации

MONITORING OF PROCESS CHAMBER

Номер: US20200006101A1
Автор: CHEN Bo Chen, TSAI Yung-Li, Wu Sheng-Wei
Принадлежит: Taiwan Semiconductor Manufacturing Co., Ltd.

The present disclosure describes a method for controlling a wet processing system includes dispensing one or more chemicals into a processing chamber according to one or more process parameters. The method also includes injecting one or more illumination markers into the processing chamber and obtaining images representing locations of the one or more illumination markers. The method further includes determining a trajectory of an illumination marker of the one or more illumination markers based on the images and determining whether the determined trajectory is outside a predetermined trajectory range. In response to the determined trajectory being outside the predetermined trajectory range, the method further includes adjusting the one or more process parameters. 1. A method for controlling a wet processing system , comprising:dispensing one or more chemicals into a processing chamber according to one or more process parameters;injecting one or more illumination markers into the processing chamber;obtaining images representing locations of the one or more illumination markers;determining a trajectory of an illumination marker of the one or more illumination markers based on the images;determining whether the determined trajectory is outside a predetermined trajectory range; andin response to the determined trajectory being outside the predetermined trajectory range, adjusting the one or more process parameters.2. The method of claim 1 , wherein the dispensing the one or more chemicals comprises dispensing claim 1 , by a spray nozzle claim 1 , one or more wet chemical solutions into a target inspection area of the processing chamber.3. The method of claim 2 , wherein the one or more process parameters comprise at least one of an angle of the spray nozzle claim 2 , a height of the spray nozzle claim 2 , and a lateral scanning speed of the spray nozzle.4. The method of claim 1 , wherein the one or more process parameters comprise at least one of a flow rate and a ...

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Номер записи: 1
02-01-2020 дата публикации

CONTAMINATION CONTROL IN SEMICONDUCTOR MANUFACTURING SYSTEMS

Номер: US20200006104A1
Автор: CHEN Bo Chen, TSAI Yung-Li, Wu Sheng-Wei
Принадлежит: Taiwan Semiconductor Manufacturing Co., Ltd.

The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level. 1. A semiconductor processing system , comprising:a processing chamber configured to process a wafer and comprising a door;a contamination detection system configured to determine whether a contamination level on a surface of the door is greater than a baseline level; anda contamination removal system configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.2. The semiconductor processing system of claim 1 , wherein the contamination detection system is configured to determine the contamination level on a side surface of the door when the door is in a closed position.3. The semiconductor processing system of claim I claim 1 , wherein the contamination detection system is configured to determine the contamination level on a bottom surface of the door when the door is in an open position.4. The semiconductor processing system of claim 1 , wherein the contamination removal system is configured to remove the contaminants from a side surface of the door when the door is in a closed position.5. The semiconductor processing system of claim 1 , wherein the contamination removal system is configured to wipe the contaminants off a bottom surface of the door when the door is in an open position.6. The semiconductor processing system of claim 1 , wherein the ...

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Номер записи: 2
20-02-2020 дата публикации

WAFER CLEANING WITH DYNAMIC CONTACTS

Номер: US20200058521A1
Автор: CHEN Bo-Chen, PENG Chui-Ya, SHIH Kun-Hsiung, TSAI Yung-Li
Принадлежит:

In an embodiment, a system includes: a pedestal configured to secure a wafer; a nozzle configured to deposit a cleaning solution on the wafer disposed on the pedestal during a cleaning session; and a plurality of contacts configured to secure the wafer to the pedestal while the cleaning solution is deposited on the wafer, wherein a first subset of the plurality of contacts is configured to contact the wafer at a first time interval and a second subset of the plurality of contacts is configured to contact the wafer at a second time interval. 1. A system , comprising:a pedestal configured to secure a wafer;a nozzle configured to deposit a cleaning solution on the wafer disposed on the pedestal during a cleaning session; anda plurality of contacts configured to secure the wafer to the pedestal while the cleaning solution is deposited on the wafer, wherein a first subset of the plurality of contacts is configured to contact the wafer at a first time interval and a second subset of the plurality of contacts is configured to contact the wafer at a second time interval.2. The system of claim 1 , wherein the first time interval and the second time interval are continuous.3. The system of claim 1 , wherein the plurality of contacts are all configured to contact the wafer at a third time interval between the first time interval and the second time interval.4. The system of claim 1 , wherein the first subset of the plurality of contacts comprise different contacts than the second subset of the plurality of contacts.5. The system of claim 1 , wherein the pedestal is configured to be rotated.6. The system of claim 1 , wherein the plurality of contacts are each cylindrical in shape.7. The system of claim 1 , wherein each of the plurality of contacts are configured to contact the wafer at a circumference of the wafer.8. The system of claim 1 , wherein the first subset of the plurality of contacts comprise contacts that are also part of the second subset of the plurality of ...

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Номер записи: 3
22-05-2014 дата публикации

LOADING PORT, SYSTEM FOR ETCHING AND CLEANING WAFERS AND METHOD OF USE

Номер: US20140141541A1
Автор: CHANG Jui-Chuan, CHIANG Yuan Chih, Ku Shao-Yen, TSAI Wen-Chang, TSAI Yung-Li, WEI Hsieh-Ching
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

A loading port includes a housing and a plurality of stations defined in the housing configured to receive a front opening universal pod (FOUP). The loading port further includes a connector configured to receive an inert gas. At least one of the plurality of stations is configured to deliver the inert gas to the FOUP to purge an interior of the FOUP of moisture. A system including the loading port and a method of using the system are also described. 1. A loading port comprising:a housing;a plurality of stations defined in the housing configured to receive a front opening universal pod (FOUP);a connector configured to receive an inert gas;a nozzle in at least one of the plurality of stations, the nozzle being configured to convey the inert gas from the connector to the FOUP to purge an interior of the FOUP of moisture; anda controller configured to control the nozzle to regulate flow of the inert gas, the controller being configured to determine a time duration following the purge, compare the determined time duration with a predetermined threshold, and actuate the nozzle to allow the inert gas to flow into the FOUP if the measured time exceeds the predetermined threshold.2. The loading port of claim 1 , wherein the inert gas is nitrogen gas.34-. (canceled)5. The loading port of claim 1 , wherein each of the plurality of stations is configured to deliver the inert gas to the FOUP.6. A wafer processing system comprising: a first housing;', 'a first plurality of stations defined in the first housing configured to receive a front opening universal pod (FOUP); and', 'a first connector configured to receive an inert gas,', 'a first nozzle in at least one of the first plurality of stations, the first nozzle being configured to convey the inert gas from the first connector to the FOUP to purge an interior of the FOUP of moisture;, 'a first loading port, the first loading port comprisingan etching chamber configured to perform an etching process on a wafer; a second housing ...

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Номер записи: 4
05-03-2020 дата публикации

SYSTEMS AND METHODS FOR SHUTTERED WAFER CLEANING

Номер: US20200075352A1
Автор: PENG Chui-Ya, TSAI Yung-Li, WANG Tsui-Wei
Принадлежит:

In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state. 1. A system , comprising:a wafer support configured to secure a wafer;a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing;a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and move the shutter to the first position in response to the nozzle being in an inactive state;', 'move the shutter to a second position away from the first position in response to the nozzle being in the active state., 'a shutter actuator configured to2. The system of claim 1 , wherein the shutter in the first position contacts and covers the nozzle.3. The system of claim 1 , wherein the shutter is separated from the nozzle in the first position.4. The system of claim 1 , wherein the shutter is directly below the nozzle in the first position.5. The system of claim 1 , wherein the shutter is laterally displaced from the nozzle in the second position.6. The system of claim 1 , wherein the nozzle is configured to dispense the liquid and not the gas in the active state.7. The system of claim 1 , wherein the shutter comprises a concavity.8. The system of claim 1 , wherein the nozzle is configured to dispense the gas on the shutter in the first position.9. A method claim 1 , comprising:securing a wafer via a wafer support;moving a shutter to a first position below a nozzle in response to the nozzle being in an ...

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Номер записи: 5
10-12-2015 дата публикации

Method of etching and cleaning wafers

Номер: US20150357198A1
Автор: Hsieh-Ching WEI, Jui-Chuan Chang, Shao-Yen Ku, Wen-Chang Tsai, Yuan Chih CHIANG, Yung-Li TSAI
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

A method of operating a wafer processing system includes etching a batch of wafers. The method also includes transferring at least a portion of the batch of wafers to a first front opening universal pod (FOUP). The method further includes purging an interior of the first FOUP with an inert gas. The method additionally includes transporting the first FOUP from a first loading port to a second loading port. The method also includes monitoring an elapsed time from the purging. The method further includes performing a second purging of the interior of the first FOUP if the elapsed time exceeds a threshold time. The method additionally includes cleaning the batch of wafers.

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Номер записи: 6
28-11-2019 дата публикации

SYSTEMS AND METHODS FOR DRY WAFER TRANSPORT

Номер: US20190362990A1
Автор: PENG Chui-Ya, TSAI Yung-Li, WANG Tsui-Wei
Принадлежит:

In an embodiment, a system includes: a first robotic arm configured to transport a wafer into a cleaning chamber, wherein the first robotic arm comprises a first hood that substantially covers the wafer when transported on the first robotic arm; the cleaning chamber configured to clean the wafer; a second robotic arm configured to transport the wafer out of the cleaning chamber, wherein the second robotic arm comprises a second hood that substantially covers the wafer when transported on the second robotic arm, wherein the second robotic arm is different than the first robotic arm. 1. A system , comprising:a cleaning chamber configured to clean a wafer;a first robotic arm configured to transport the wafer into the cleaning chamber, wherein the first robotic arm comprises a first hood that substantially covers the wafer when transported on the first robotic arm;a second robotic arm configured to transport the wafer out of the cleaning chamber, wherein the second robotic arm comprises a second hood that substantially covers the wafer when transported on the second robotic arm, wherein the second robotic arm is different than the first robotic arm.2. The system of claim 1 , wherein the first hood comprises a slope configured to drain liquid from the first hood along the slope.3. The system of claim 1 , wherein the first hood comprises a greater cross sectional area than the wafer.4. The system of claim 1 , wherein the first hood comprises a drip edge along an extremity of the first hood claim 1 , wherein the drip edge is configured to direct dripping liquid away from the wafer.5. The system of claim 1 , wherein the cleaning chamber comprises a nozzle plate disposed over the wafer while the wafer is secured in the cleaning chamber claim 1 , wherein the nozzle plate is coated with a hydrophobic layer along a surface configured to face the wafer.6. The system of claim 1 , wherein the cleaning chamber is configured to:secure the wafer within the cleaning chamber;spin the ...

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Номер записи: 7
30-06-2022 дата публикации

Contamination control in semiconductor manufacturing systems

Номер: US20220208581A1
Автор: Bo Chen Chen, Sheng-Wei Wu, Yung-Li TSAI
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.

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Номер записи: 8
01-06-2014 дата публикации

裝載埠、晶圓處理系統、操作一晶圓處理系統之方法

Номер: TW201421606A
Автор: Ching-Wei Hsieh, Jui-Chuan Chang, Shao-Yen Ku, Wen-Chang Tsai, Yuan-Chih Chiang, Yung-Li TSAI
Принадлежит: Taiwan Semiconductor Mfg

一種裝載埠，包括一殼體、複數個站及一連接器。複數個站係被界定於殼體之中，用以接收一前開口通用盒。連接器係用以接收一惰性氣體。複數個站之至少一個係從連接器傳遞惰性氣體至前開口通用盒，以淨化前開口通用盒之內部中之水氣。

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Номер записи: 9
26-09-2023 дата публикации

Apparatus and method for wafer cleaning

Номер: US11766703B2
Автор: Bo Chen Chen, Sheng-Wei Wu, Yung-Li TSAI
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

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Номер записи: 10
16-04-2024 дата публикации

Apparatus and method for wafer cleaning

Номер: US11958090B2
Автор: Bo Chen Chen, Sheng-Wei Wu, Yung-Li TSAI
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

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Номер записи: 11
16-05-2024 дата публикации

Apparatus And Method For Wafer Cleaning

Номер: US20240157412A1
Автор: Bo Chen Chen, Sheng-Wei Wu, Yung-Li TSAI
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

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Номер записи: 12
25-06-2024 дата публикации

Contamination control in semiconductor manufacturing systems

Номер: US12020964B2
Автор: Bo Chen Chen, Sheng-Wei Wu, Yung-Li TSAI
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.

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Номер записи: 13
12-09-2024 дата публикации

Contamination Control In Semiconductor Manufacturing Systems

Номер: US20240304481A1
Автор: Bo Chen Chen, Sheng-Wei Wu, Yung-Li TSAI
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.

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Номер записи: 14
20-08-2024 дата публикации

Systems and methods for shuttered wafer cleaning

Номер: US12068179B2
Автор: Chui-Ya Peng, Tsui-Wei Wang, Yung-Li TSAI
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.

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Номер записи: 15
28-02-2017 дата публикации

Method of etching and cleaning wafers

Номер: US09583352B2
Автор: Hsieh-Ching WEI, Jui-Chuan Chang, Shao-Yen Ku, Wen-Chang Tsai, Yuan Chih CHIANG, Yung-Li TSAI
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

A method of operating a wafer processing system includes etching a batch of wafers. The method also includes transferring at least a portion of the batch of wafers to a first front opening universal pod (FOUP). The method further includes purging an interior of the first FOUP with an inert gas. The method additionally includes transporting the first FOUP from a first loading port to a second loading port. The method also includes monitoring an elapsed time from the purging. The method further includes performing a second purging of the interior of the first FOUP if the elapsed time exceeds a threshold time. The method additionally includes cleaning the batch of wafers.

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Номер записи: 16