Quantum chip system, quantum computing processing system and electronic apparatus

Embodiments of the disclosure provide a quantum chip system, a quantum computing processing system and an electronic apparatus, wherein one quantum chip system includes at least one first qubit, each first qubit includes at least two control electrodes, and a first event register for controlling the control electrode, wherein each first event register is configured for storing a control signal of the control electrode, and each first qubit corresponds to at least two first event registers.

Active noise reduction method, system, and new energy vehicle

The present disclosure provides an active noise reduction method, a system, and a new energy vehicle. The active noise reduction method includes: obtaining a frequency of a high-frequency noise signal in an acoustic environment, constructing and generating a harmonic masking signal according to the frequency of the high-frequency noise signal, where the harmonic masking signal includes a harmonic signal and a masking signal, and the harmonic signal is a subharmonic wave of the high-frequency noise signal, and inputting the harmonic masking signal into a sound playback apparatus for playback to output a noise reduction construction sound, and performing noise reduction on the acoustic environment.

Side wall and boxcar of railway wagon

The present invention provides a side wall of railway wagon and a boxcar of railway wagon. The side wall of the railway wagon comprises an upper side plate, a lower side plate, an inner side stake and an outer side stake, wherein the said inner side stake is arranged at the inner side of the said upper side plate and the said lower side plate, and the said outer side stake is arranged at the upper part of the said side wall of railway wagon and is arranged at the outer side of the said upper side plate. By applying the side wall in the form of internal stakes, the side wall of railway wagon and the boxcar of railway wagon of the present invention can make full use of the width space between the outer surface of the side plate and the outer surface of the side stake on the basis that the external dimension of the railway wagon is not changed, thereby effectively improving the volume of the railway wagon and the transporting capability of the train.

Mount for a medical instrument

Quantum chip test structure and fabrication method therefor, and test method and fabrication method for quantum chip

Disclosed are a quantum chip test structure and a fabrication method therefor, and a test method and a fabrication method for a quantum chip. The quantum chip test structure includes: a superconducting Josephson junction and a connection structure of the superconducting Josephson junction that are located on a substrate; a first isolation layer located on the connection structure, where a connection window penetrating through the first isolation layer is formed in the first isolation layer; a second isolation layer located on the first isolation layer, where a deposition window is formed in the second isolation layer; and an electrical connection portion located in the connection window and an electrical connection layer located in the deposition window, and the electrical connection layer is configured to implement electrical contact with a test device.

Service data transmission method and related device

This application provides a service data transmission method and a related device, applied to a mobile phone. The method includes: establishing a first Bluetooth logical channel with a first main control chip of a wearable device and a second Bluetooth logical channel with a second main control chip of the wearable device, where the first main control chip and the second main control chip have different processing capabilities and energy consumption; and sending, based on an interaction channel corresponding to a service, service data to the first main control chip through the first Bluetooth logical channel, or to the second main control chip through the second Bluetooth logical channel. In this application, a channel for transmitting the service data from the mobile phone to the wearable device may be determined, thereby reducing a quantity of times of waking up a main control chip with high energy consumption in the wearable device, and improving standby time of the wearable device.

Quantum state information processing system, quantum measurement and control system and quantum computer

Disclosed are a quantum state information processing system, a quantum measurement and control system, and a quantum computer. In this system, a sampling module is used to perform sampling processing on an analog signal collected from a qubit, a frequency mixing module is used to perform mixing processing on the sampled signal, a demodulation module is used to perform demodulation processing on a mixed signal, and a determining module is used to perform state classification on a demodulated signal by using a state classification equation, so as to acquire quantum state information. Embodiments of the present disclosure provide a hardware system architecture, which fills a technical gap of a hardware system for parsing a quantum state of a qubit in conventional technologies.

Superconducting quantum chip structure and superconducting quantum chip preparation method

The present application discloses a superconducting quantum chip structure and a fabrication method for a superconducting quantum chip. The superconducting quantum chip structure includes a first structural member, a second structural member, and a support and connection member, where the first structural member is provided with a qubit, a read cavity, and a first connection terminal, the qubit is coupled to the read cavity, and the qubit is electrically connected to the first connection terminal; the second structural member is provided with a signal transmission line and a second connection terminal electrically connected to each other; and two ends of the support and connection member are electrically connected to the first connection terminal and the second connection terminal, respectively, and the support and connection member is configured to transmit a control signal received on the signal transmission line to the qubit. According to the technical solutions of the present application, a planar size of a superconducting quantum chip structure is reduced, and an integration degree of a multi-bit superconducting quantum chip is improved.

Reticle preparation method, reticle, josephson junction element, and quantum chip

A mask fabrication method, mask, Josephson junction element, and quantum chip is provided, which belong to the field of quantum information, especially the field of quantum computing. The mask fabrication method includes: providing a dielectric layer, wherein a ratio of a thickness of the dielectric layer to a line width of a target pattern to be fabricated is greater than a cutting depth-to-width ratio allowed by a patterning apparatus; determining a first sublayer and a second sublayer of the dielectric layer, wherein a ratio of a thickness of the second sublayer to the line width of the target pattern is less than or equal to the cutting depth-to-width ratio; forming the target pattern on the second sublayer and a first pattern on the first sublayer, wherein the first pattern exposes the target pattern. The present application is capable of fabricating a mask containing the target pattern when the ratio of the provided dielectric layer thickness to the line width of the target pattern to be fabricated is greater than the cutting depth-to-width ratio allowed by the patterning apparatus.

Quantum chip test structure and manufacturing method therefore, and quantum chip test method and manufacturing method

The present application discloses a quantum chip test structure and a fabrication method therefor, and a test method and a fabrication method for a quantum chip. The quantum chip test structure includes: a superconducting Josephson junction and a connection structure of the superconducting Josephson junction that are located on a substrate; a first isolation layer located on the connection structure, where a connection window penetrating through the first isolation layer is formed in the first isolation layer; a second isolation layer located on the first isolation layer, where a deposition window is formed in the second isolation layer, the deposition window is configured to define a deposition region that is located on the first isolation layer, and the connection window is connected to the deposition window; and an electrical connection portion located in the connection window and an electrical connection layer located in the deposition window, where the electrical connection portion has one end connected to the connection structure and the other end connected to the electrical connection layer, and the electrical connection layer is configured to implement electrical contact with a test device. According to the present application, a contact test of a superconducting Josephson junction can be implemented.

Quantum chip controller, quantum computation processing system, and electronic device

Active noise reduction method and system, and new energy vehicle

Superconducting quantum chip structure and superconducting quantum chip preparation method

Quantum device, manufacturing method thereof, and quantum computer

A quantum device includes: a quantum chip, provided with an I/O port; and a superconducting substrate, provided with transmission lines on the superconducting substrate. Each of the transmission lines includes a first section and a second section that form an included angle, a bonding connection structure is formed between one end of the first section and the I/O port, a pad for connecting to a connector is formed at one end of the second section, and a distribution spacing between the first sections is smaller than a distribution spacing between the second sections. The second sections are distributed in a region away from the quantum chip. The first section connected to the 1/0 port via aluminum wire bonding can be wired at higher density. The size of the pad on a wiring spacing is reduced, and density of the transmission lines on the superconducting substrate is increased.

Superconducting quantum chip structure and fabrication method for superconducting quantum chip

Disclosed are a superconducting quantum chip structure and a fabrication method for a superconducting quantum chip. The superconducting quantum chip structure includes a first structural member, a second structural member, and a support and connection member, where the first structural member is provided with a qubit, a read cavity, and a first connection terminal, the qubit is coupled to the read cavity, and the qubit is electrically connected to the first connection terminal; the second structural member is provided with a signal transmission line and a second connection terminal electrically connected to each other; and two ends of the support and connection member are electrically connected to the first connection terminal and the second connection terminal, respectively, and the support and connection member is configured to transmit a control signal received on the signal transmission line to the qubit.

Quantum measurement and control system and quantum computer

A quantum measurement and control system and a quantum computer are disclosed. The quantum measurement and control system includes: a first signal output module (2) configured to generate waveforms to be processed corresponding to qubits connected with a qubit measurement bus based on a preset time sequence and process the waveforms to be processed into one synthesized waveform, and output a qubit reading signal corresponding to the synthesized waveform to the qubit measurement bus, wherein a waveform to be processed for a qubit includes a measurement waveform when the qubit needs to be measured or an empty waveform when the qubit does not need to be measured; a signal acquisition module (3) configured to acquire and process a qubit reading feedback signal output by the qubit measurement bus based on the preset time sequence, to obtain quantum state information of each qubit which needs to be measured; and a control module (4) configured to output a synchronous trigger signal as a start time of the preset time sequence to the first signal output module and the signal acquisition module. The utilization rate of qubits on the quantum chip can be improved.

Active noise reduction method and system, and new energy vehicle

To resolve problems that a manner of performing high-frequency noise reduction by constructing a harmonic signal is relatively monotonous, and that there is still space for further improvement of sound quality of an acoustic environment thereof, the present invention provides an active noise reduction method, a system, and a new energy vehicle. According to an aspect of the present invention, an active noise reduction method is provided, including the following steps: obtaining a frequency of a high-frequency noise signal in an acoustic environment, constructing and generating a harmonic masking signal according to the frequency of the high-frequency noise signal, where the harmonic masking signal includes a harmonic signal and a masking signal, and the harmonic signal is a subharmonic wave of the high-frequency noise signal, and inputting the harmonic masking signal into a sound playback apparatus for playback to output a noise reduction construction sound, and performing noise reduction on the acoustic environment. According to the active noise reduction method disclosed by the present invention, the sound quality of the acoustic environment may be further improved. In addition, the method is simple and easy to operate and has low costs.

蜂窝煤炉

本实用新型提供了一种蜂窝煤炉，属于取暖设备技术领域，包括外壳、内胆以及设置于外壳与内胆之间的保温层，内胆横向设置，其两端分别设有进煤口和出渣口；内胆的上方设有与其连通的燃烧室，燃烧室连通烟道；外壳的侧壁对应进煤口的位置设有方孔，方孔的外侧设有推拉门，推拉门的内表面设置若干根水平分布、用于穿设于方形蜂窝煤的通风孔的插条，并且插条的长度至少为两倍方形蜂窝煤的高度。本实用新型提供的蜂窝煤炉，在推拉门上设置插条，填煤时将蜂窝煤插刮在插条上，保证蜂窝煤横置(通风孔水平布置)，蜂窝煤从上到下多层，从左到右多列，侧向燃烧，侧向出渣，火焰燃烧稳定，容易封火，不易熄火，封火后起火快。

Mask Fabrication Method, Mask, Josephson Junction Element and Quantum Chip

A mask fabrication method, mask, Josephson junction element, and quantum chip is provided, which belong to the field of quantum information, especially the field of quantum computing. The mask fabrication method includes: providing a dielectric layer, wherein a ratio of a thickness of the dielectric layer to a line width of a target pattern to be fabricated is greater than a cutting depth-to-width ratio allowed by a patterning apparatus; determining a first sublayer and a second sublayer of the dielectric layer, wherein a ratio of a thickness of the second sublayer to the line width of the target pattern is less than or equal to the cutting depth-to-width ratio; forming the target pattern on the second sublayer and a first pattern on the first sublayer, wherein the first pattern exposes the target pattern. The present application is capable of fabricating a mask containing the target pattern when the ratio of the provided dielectric layer thickness to the line width of the target pattern to be fabricated is greater than the cutting depth-to-width ratio allowed by the patterning apparatus.

Quantum chip test structure and fabrication method therefor, and test method and fabrication method for quantum chip

Disclosed are a quantum chip test structure and a fabrication method therefor, and a test method and a fabrication method for a quantum chip. The quantum chip test structure includes: a superconducting Josephson junction and a connection structure of the superconducting Josephson junction that are located on a substrate; a first isolation layer located on the connection structure, where a connection window penetrating through the first isolation layer is formed in the first isolation layer; a second isolation layer located on the first isolation layer, where a deposition window is formed in the second isolation layer; and an electrical connection portion located in the connection window and an electrical connection layer located in the deposition window, and the electrical connection layer is configured to implement electrical contact with a test device.

Semiconductor quantum dot device and preparation method therefor, and signal reading method and manipulation method

The present application discloses a semiconductor quantum dot device structure, fabrication method, signal reading method and manipulation method. The structure includes: a silicon substrate formed to be provided with a first ion region and a second ion region; a dielectric layer located on the silicon substrate layer, with a carrier channel formed at an interface between the silicon substrate and the dielectric layer; the first electrode in ohmic contact with the first ion region, and the second electrode in ohmic contact with the second ion region; A confining electrode located on the dielectric layer, configured to confine carriers within the carrier channel to form quantum dots; and a magnetic electrode, the magnetic electrode is configured to form a magnetic field gradient at the interface and to The quantum dots are manipulated. The application also discloses a semiconductor quantum dot device.

Carrier transport simulation method, apparatus, medium, and electronic device

Disclosed are a carrier transport simulation method, a carrier transport simulation apparatus, a medium, and an electronic device. A physical simulation model, and an initial condition and/or a boundary condition for carrier transport in a semiconductor device are determined; a mathematical physical equation correspondingly for solving the physical simulation model is determined; and a carrier density in the semiconductor device is determined based on the initial condition and/or the boundary condition, and the mathematical physical equation, to implement a simulation of carrier transport in the semiconductor device, so as to implement a simulation of carrier transport in a semiconductor device.

Quantum chip test structure and manufacturing method therefore, and quantum chip test method and manufacturing method

Message Processing Method and Apparatus, and First Electronic Device

In a message processing method, after receiving a message from a second electronic device, a first electronic device controls, using a microcontroller unit (MCU), a display of the first electronic device to display the message. Then, the first electronic device obtains an operation performed on the message and processes, using the MCU, the operation when the operation is a first operation type.

Active noise reduction method and system, and vehicle using alternative energy

Message processing method and apparatus, and first electronic device

Embodiments of this application provide a message processing method and apparatus, and a first electronic device. In the message processing method, after receiving a message sent by a second electronic device, the first electronic device controls, by using an MCU, a display of the first electronic device to display the message. Then, the first electronic device obtains an operation performed, on the message, by a user that uses the first electronic device, and processes, by using the MCU, the operation when a type of the operation is a first operation type. In this way, the operation of the user can be processed by using the MCU. This avoids frequently waking up an AP and can improve a battery life of the first electronic device.

Probe apparatus, and measurement method and measurement system of junction resistance of superconducting qubit

Disclosed are a probe apparatus, and a measurement method and a measurement system of a junction resistance of a superconducting qubit. The probe apparatus is configured to measure a superconducting quantum chip, and includes a probe set, a probe control mechanism, and a power supply module; the probe set includes two probes that are independent; the probe control mechanism is configured to control the probe set to be connected to an oxide layer on a surface of an electrode of a Josephson junction on the superconducting quantum chip; and the power supply module is configured to apply an electrical breakdown signal to two probes, to break down the oxide layer, so that the probe set forms a conductive connection with the electrode of the Josephson junction.

Quantum state information processing system, quantum measurement and control system, and quantum computer

Disclosed are a quantum state information processing system, a quantum measurement and control system, and a quantum computer. In this system, a sampling module is used to perform sampling processing on an analog signal collected from a qubit, a frequency mixing module is used to perform mixing processing on the sampled signal, a demodulation module is used to perform demodulation processing on a mixed signal, and a determining module is used to perform state classification on a demodulated signal by using a state classification equation, so as to acquire quantum state information.

Quantum measurement and control system and quantum computer

Service data transmission method and related device

The present disclosure relates to service data transmission methods and devices. One example method includes establishing a first Bluetooth logical channel with a first main control chip of a wearable device and a second Bluetooth logical channel with a second main control chip of the wearable device, where the first main control chip and the second main control chip have different processing capabilities and energy consumption, and sending, based on an interaction channel corresponding to a service, service data to the first main control chip through the first Bluetooth logical channel or to the second main control chip through the second Bluetooth logical channel.

Quantum state information processing system, quantum measurement and control system and quantum computer

Application development system and method, and device

This application provides an application development system and method, and a device. In the application development system, a first electronic device sends an original installation package of a target application to a server, where the original installation package of the target application indicates a function and/or a page layout corresponding to at least one type of device information. The server determines at least one target installation package based on the original installation package, where the at least one target installation package one-to-one corresponds to the at least one type of device information. The server receives a first download request sent by a second electronic device, and sends a first installation package to the second electronic device, where the first installation package is a target installation package corresponding to device information of the second electronic device; and the server receives a second download request sent by a third electronic device, and sends a second installation package to the third electronic device, where the second installation package is a target installation package corresponding to device information of the third electronic device. Based on the foregoing application development system, a plurality of types of installation packages of a same application do not need to be released a plurality of times, thereby reducing development costs.

Service data transmission method and related device

A settlement monitoring device and monitoring method for tunnel under-crossing existing ground objects

The present invention discloses a settlement monitoring device and monitoring method for tunnel under-crossing existing ground objects, including a monitoring host, the monitoring host is equipped with a display screen and a sound and light alarm, and the monitoring host is installed with a control circuit board, it also includes multiple fiber Bragg grating sensors, displacement sensors and pressure sensors, wherein multiple fiber Bragg grating sensors, displacement sensors and pressure sensors are connected to the monitoring host. The present invention has simple working principle and high intelligence, it can monitor the settlement signal of existing ground objects in real time, once the settlement value exceeds the normal value, an early warning signal is issued immediately, and the measured settlement value is of high precision, which ensures the safety of existing ground objects and tunnels.