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20-05-2001 дата публикации

УСТАНОВКА ФОРМИРОВАНИЯ МАГНИТНО-АНИЗОТРОПНОГО ЭЛЕМЕНТА ПРОИЗВОЛЬНОЙ ФОРМЫ И ОБЪЕМА

Номер: RU0000018116U1
Автор: Парилов А.А.
Принадлежит: Парилов Анатолий Александрович

1. Установка формирования рабочего слоя магнитно-анизотропного элемента (МАЭ) произвольной форм и объема с заданным распределением силовых линий магнитного потока над поверхностью рабочего слоя методом физического осаждения ионов, содержащая вакуумную камеру с источником (Ист) ионов, основание с креплением для подложки и маскировочного трафарета, систему высокотемпературных нагревателей (Нагр) до температуры не менее чем 800C, систему датчиков контроля, отличающаяся тем, что содержит механизм вращения, который для крепления несущих элементов - подложек (НЭ) различной формы содержит узлы крепления для одного или нескольких (до 2-8 штук) оснований с одним или несколькими НЭ, механизм вращения дополняется подъемным механизмом, на каждом из оснований размещены система удержания одного или более НЭ и система периодического поворота и/или стабильного вращения НЭ вокруг одной или нескольких его осей и/или одной или нескольких внешних осей, плавное вращение (от 0,1 до 10 об/мин) или поворот плоского, шарообразного, конической, цилиндрической, кубической или другой формы НЭ осуществляется при контроле стабильного вращения или периодического поворота НЭ с заданной скоростью вращения или периодом поворота, НЭ выполнены полыми или цельнолитыми, плоской формы и/или различной конфигурации, в количестве от 2 до 10-15 НЭ с малыми размерами (от 20-60 мкм до 3-8 мм), материал магнитного слоя МАЭ имеет магнитную анизотропию в направлении поперек толщины магнитного слоя со степенью анизотропии не менее 0,8, система вращения НЭ вокруг их оси и/или осей обеспечивает медленное и/или быстрое вращение от 1 до 10 об/с (от 0,1 до 10 обор/мин), соответственно и/или поворот на заданный угол (от 3-5 до 180) через заданный промежуток времени одного НЭ или групповое вращение и/или поворот НЭ в потоке осаждаемых ионов Ист, с возможностью выключения Ист ионов на весь цикл смены осей вращения НЭ, при смене вращения НЭ и перехвата (перехода) МАЭ на другую ось вращения, одиночный цилиндрический, ...

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Номер записи: 1
20-07-2004 дата публикации

УСТРОЙСТВО ДЛЯ ЛАКИРОВАНИЯ ЛИСТОВ ЭЛЕКТРОТЕХНИЧЕСКОЙ СТАЛИ

Номер: RU0000039096U1
Автор: Зыкин В.К., Пермяков Л.А., Эсаулов В.Л.
Принадлежит: Холдинговая компания Открытое акционерное общество "Привод"

1. Устройство для лакирования листов электротехнической стали, включающее привод, два лакирующих вала, установленных друг над другом и связанных с ним кинематически, отличающееся тем, что со стороны верхнего лакирующего вала установлен с зазором и связан с ним кинематически дополнительный металлический калибрующий вал, ось вращения которого параллельна и расположена выше его оси вращения. 2. Устройство для лакирования листов электротехнической стали по п.1, отличающееся тем, что зазор для подачи лака между калибрующим и верхним лакирующим валами выполнен регулируемым. 2. Устройство для лакирования листов электротехнической стали по пп.1 и 2, отличающееся тем, что диаметр калибрующего вала значительно меньше диаметра лакирующего вала. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 39 096 (13) U1 (51) МПК B05C 11/10 (2000.01) B05C 11/02 (2000.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21), (22) Заявка: 2004105483/20 , 27.02.2004 (24) Дата начала отсчета срока действия патента: 27.02.2004 (46) Опубликовано: 20.07.2004 (73) Патентообладатель(и): Холдинговая компания Открытое акционерное общество "Привод" (RU) U 1 3 9 0 9 6 R U Ñòðàíèöà: 1 U 1 Формула полезной модели 1. Устройство для лакирования листов электротехнической стали, включающее привод, два лакирующих вала, установленных друг над другом и связанных с ним кинематически, отличающееся тем, что со стороны верхнего лакирующего вала установлен с зазором и связан с ним кинематически дополнительный металлический калибрующий вал, ось вращения которого параллельна и расположена выше его оси вращения. 2. Устройство для лакирования листов электротехнической стали по п.1, отличающееся тем, что зазор для подачи лака между калибрующим и верхним лакирующим валами выполнен регулируемым. 2. Устройство для лакирования листов электротехнической стали по пп.1 и 2, отличающееся тем, что диаметр калибрующего вала значительно меньше диаметра лакирующего вала. 3 9 0 ...

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Номер записи: 2
10-09-2004 дата публикации

УСТРОЙСТВО ДЛЯ НАНЕСЕНИЯ ПОКРЫТИЯ НА БУМАЖНОЕ ПОЛОТНО

Номер: RU0000040220U1
Автор: Грушелевская С.Я., Грушелевский И.М., Поляков В.В., Четвериков В.Н.
Принадлежит: Общество с ограниченной ответственностью "ПКФ ВОСТОК-ПЛЮС"

1. Устройство для нанесения покрытия на бумажное полотно, содержащее тыльную опору, ракельное устройство, взаимодействующее с опорой, лезвие которого установлено под острым углом к направлению перемещения полотна, и средство поддержания локальной ванны с наносимой средой, отличающееся тем, что тыльная опора по крайней мере в зоне взаимодействия с лезвием ракельного устройства выполнена упругой и образована газонаполненной оболочкой, при этом усилие поджатия лезвия к полотну устанавливают величиной давления газа в оболочке, для чего последняя сообщена со средствами создания и регулирования давления газа, а локальная ванна ограничена лезвием ракельного устройства и бумажным полотном. 2. Устройство по п.1, отличающееся тем, что тыльная опора снабжена гибкой прокладкой из антифрикционного материала, преимущественно из полиэтилентерефталата. 3. Устройство по п.1, отличающееся тем, что лезвие ракеля установлено под углом 15-30° к направлению, перпендикулярному основанию тыльной опоры и проходящему через линию контакта опоры с лезвием. 4. Устройство по п.1, отличающееся тем, что оболочка выполнена цилиндрической из полимерного материала, преимущественно поливинилхлорида. 5. Устройство по п.1, отличающееся тем, что газонаполненная оболочка состоит из мембраны из упругого материала, присоединенной к открытой стенке герметичного металлического короба. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 40 220 (13) U1 (51) МПК B05C B05C B05B D21H 11/02 3/12 5/08 19/32 (2000.01) (2000.01) (2000.01) (2000.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ Адрес для переписки: 101000, Москва, Старосадский пер., 8, стр.1А, НИЦ ЭЛДИС РАН, пат.пов. М.А.Земляницин, рег.№ 332 (73) Патентообладатель(и): Общество с ограниченной ответственностью "ПКФ ВОСТОК-ПЛЮС" (RU) (24) Дата начала отсчета срока действия патента: 17.06.2004 Ñòðàíèöà: 1 U 1 4 0 2 2 0 R U U 1 Формула полезной модели 1. Устройство для нанесения покрытия на бумажное ...

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Номер записи: 3
27-11-2009 дата публикации

УСТРОЙСТВО ДЛЯ ФОРМИРОВАНИЯ ПЛЕНОК ИЗ ЖИДКОЙ ФАЗЫ И СИСТЕМА НАНЕСЕНИЯ, ЕГО ВКЛЮЧАЮЩАЯ

Номер: RU0000089004U1
Автор: Бобров Юрий А., МакМартри Дэвид, Паукшто Михаил Витольдович
Принадлежит: КоллЭнджин, Инк., США

1. Устройство для формирования пленки, включающее: левую и правую клиновидные детали, выполненные в форме рельса, каждая из которых имеет верхнюю и нижнюю поверхности, где нижние поверхности обеих деталей лежат в одной базовой плоскости; верхняя поверхность левой детали имеет образующую составляющую с базовой плоскостью угол α, верхняя поверхность правой детали имеет образующую составляющую с базовой плоскостью угол α; мост в виде поперечной балки, нижняя поверхность которой включает плоскую наносящую часть; нижнюю левую часть, соприкасающуюся с верхней поверхностью левого рельса, и нижнюю правую часть, соприкасающуюся с верхней поверхностью правого рельса, причем угол, формируемый образующей поверхности левой части с наносящей плоскостью равен α, а угол, формируемый образующей поверхности правой части с наносящей плоскостью равен α; соединяющее устройство, фиксирующее упомянутый мост между двумя клиновидными деталями таким образом, что плоскость наносящей части была сонаправлена базовой плоскости, и расстояние d от базовой плоскости до центра наносящей части могло изменяться в пределах величины от 0 до 100 мкм, при смещении моста вдоль клиновидных деталей. 2. Устройство по п.1, отличающееся тем, что часть передней поверхности моста, прилегающая к наносящей части нижней поверхности, имеет цилиндрическую форму. 3. Устройство по п.2, отличающееся тем, что радиус кривизны цилиндрической поверхности не менее 50 мкм. 4. Устройство по п.1, отличающееся тем, что балка моста состоит из верхней и нижней деталей, имеющих общую плоскость сопряжения, причем эта плоскость образует с плоскостью наносящей части угол γ. 5. Устройство по п.4, отличающееся тем, что угол γ≤α или γ≤α. 6. Устройство по п.1, отличающееся тем, что плоскость наносящей части составляет с базовой плоскостью угол от 0 до 2°. 7. Устройство по п.6, отличающееся тем, что названный угол не более 10′. 8. Устройство по п.1, отличающееся тем, что плоскость наносящей части параллельна базовой плоскости. 9. Устройство ...

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Номер записи: 4
27-05-2010 дата публикации

ЗАРЯДНОЕ УСТРОЙСТВО ДЛЯ СНАРЯЖЕНИЯ СЖАТЫМ ВОЗДУХОМ АВТОНОМНОГО ПРИБОРА СПЕЦИАЛЬНОЙ ОБРАБОТКИ

Номер: RU0000094487U1
Автор: Бондаренко Виктор Борисович, Никонов Вадим Сергеевич, Прокопенко Вячеслав Алексеевич, Тырышкин Сергей Николаевич
Принадлежит: 33 Центральный научно-исследовательский испытательный институт МО РФ

Зарядное устройство для снаряжения сжатым воздухом автономного прибора специальной обработки, включающее узел вскрытия автономного источника давления и дренажную муфту, отличающееся тем, что узел вскрытия автономного источника давления располагается не внутри прибора, а при помощи гибкого резинотканевого рукава через накидную гайку посредством дренажной муфты соединяется со штатным дренажным штуцером автономного прибора специальной обработки. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 94 487 (13) U1 (51) МПК B05C 11/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21), (22) Заявка: 2009147955/22, 23.12.2009 (24) Дата начала отсчета срока действия патента: 23.12.2009 (45) Опубликовано: 27.05.2010 (73) Патентообладатель(и): 33 Центральный научно-исследовательский испытательный институт МО РФ (RU) U 1 9 4 4 8 7 R U Ñòðàíèöà: 1 ru CL U 1 Формула полезной модели Зарядное устройство для снаряжения сжатым воздухом автономного прибора специальной обработки, включающее узел вскрытия автономного источника давления и дренажную муфту, отличающееся тем, что узел вскрытия автономного источника давления располагается не внутри прибора, а при помощи гибкого резинотканевого рукава через накидную гайку посредством дренажной муфты соединяется со штатным дренажным штуцером автономного прибора специальной обработки. 9 4 4 8 7 (54) ЗАРЯДНОЕ УСТРОЙСТВО ДЛЯ СНАРЯЖЕНИЯ СЖАТЫМ ВОЗДУХОМ АВТОНОМНОГО ПРИБОРА СПЕЦИАЛЬНОЙ ОБРАБОТКИ R U Адрес для переписки: 412918, Саратовская обл., г. Вольск-18, 33 Центральный научно-исследовательский испытательный институт МО РФ (72) Автор(ы): Бондаренко Виктор Борисович (RU), Тырышкин Сергей Николаевич (RU), Никонов Вадим Сергеевич (RU), Прокопенко Вячеслав Алексеевич (RU) U 1 U 1 9 4 4 8 7 9 4 4 8 7 R U R U Ñòðàíèöà: 2 RU 5 10 15 20 25 30 35 40 45 50 94 487 U1 Полезная модель относится к области проведения специальной обработки, а именно к области обеспечения безопасности объектов, ...

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Номер записи: 5
27-04-2012 дата публикации

КОНТЕЙНЕР-ДОЗАТОР ДЛЯ ХРАНЕНИЯ И ОБЪЕМНОГО ДОЗИРОВАНИЯ МОМЕНТАЛЬНЫХ КЛЕЕВЫХ КОМПОЗИЦИЙ

Номер: RU0000115246U1
Автор: Исаев Игорь Магомедович
Принадлежит: Исаев Игорь Магомедович

1. Контейнер-дозатор для хранения и объемного дозирования моментальных клеевых композиций, содержащих мономер цианакрилата, выполненный в форме блистера и состоящий из монолитной профилированной подложки, имеющей множество изолированных друг от друга мерных полостей, каждая из которых имеет открытый торец для заливки клеевой композиции, и изготовленной из термопластичного полимера, а также расположенного на всей поверхности указанной подложки со стороны открытых торцов мерных полостей сплошного слоя алюминиевой фольги. 2. Контейнер-дозатор по п.1, характеризующийся тем, что в качестве термопластичного полимера для монолитной профилированной подложки использован материал из ряда: полиэтилен, полипропилен или тефлон. 3. Контейнер-дозатор по п.1, характеризующийся тем, что каждая мерная полость, содержащая клеевую композицию, образована подложкой из термопластичного полимера и слоем алюминиевой фольги, а также снабжена со стороны подложки выступом для прокалывания слоя алюминиевой фольги. 4. Контейнер-дозатор по п.1, характеризующийся тем, что мерные полости монолитной профилированной подложки для заливки клеевой композиции имеют емкость в диапазоне от 1 мг до 1 г либо в пределах одного блистера, либо от блистера к блистеру. 5. Контейнер-дозатор по п.1, характеризующийся тем, что блистер с мерными полостями одинаковой емкости выполнен в виде полосы. 6. Контейнер-дозатор по п.1, характеризующийся тем, что термопластичный полимер содержит добавки для защиты от ультрафиолетового излучения. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (51) МПК B05C 11/00 (13) 115 246 U1 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ (21)(22) Заявка: ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ 2011137496/05, 12.09.2011 (24) Дата начала отсчета срока действия патента: 12.09.2011 (72) Автор(ы): Исаев Игорь Магомедович (RU) (73) Патентообладатель(и): Исаев Игорь Магомедович (RU) R U Приоритет(ы): (22) Дата подачи заявки: 12.09.2011 (45) Опубликовано: 27.04.2012 Бюл. № 12 1 1 5 2 4 6 R U ...

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Номер записи: 6
29-12-2018 дата публикации

БАК

Номер: RU0000186096U1
Автор: Вяткин Вячеслав Владимирович
Принадлежит: Вяткин Вячеслав Владимирович

Полезная модель относится к таре, имеющей в поперечном сечении прямоугольный контур, корпус которой выполнен путем соединения двух жестких составных частей и отличается конструкцией стенок, содержащих усиливающие и упрочняющие элементы. Технический результат заключается в создании эффекта силовой рамы, удерживающей грани бака от деформаций под действием веса находящейся в баке жидкости. Бак выполнен в виде полого параллелепипеда с основанием 1, двумя одинаковыми боковыми гранями 2, 3 и 4, 5 и двумя одинаковыми меньшими боковыми гранями 6 и 7. При этом бак содержит лонжеронную раму, которая включает два выполненных из металла трехслойных лонжерона 8 и 9, каждый из которых содержит жестко соединенные между собой плоские параллельно расположенные слои (10, 11, 12 и 13, 14, 15 соответственно), и поперечины 16. Боковые грани параллелепипеда бака образованы двумя одинаковыми швеллерными коробами 17 и 18, каждый из которых имеет швеллерный в поперечном сечении профиль. Свободные ребра полок швеллеров (т.е. свободные ребра полуграней 2, 3, 4, 5) выполнены с поперечными отгибами 10, 12, 13, 15, ориентированными наружу и образующими крайние плоские элементы лонжерона 8 (т.е. его крайние плоские элементы 10 и 12) и лонжерона 9 (т.е. его крайние плоские элементы 13 и 15). Крайние плоские элементы 10, 12 и средний плоский элемент 11 жестко соединены между собой с образованием трехслойного лонжерона 8. Крайние плоские элементы 13, 15 и средний плоский элемент 14 жестко соединены между собой с образованием трехслойного лонжерона 9. Средние плоские элементы 11 и 14 лонжеронов рамы жестко соединены с поперечинами 16, образуя тем самым лонжеронную раму с трехслойными лонжеронами 8, 9 и поперечинами 16. Указанные лонжероны выполняют троякую функцию: они соединяют швеллерные коробы 17 и 18 для образования параллелепипеда бака; они являются усиленными (благодаря трехслойной структуре) аксиальными ребрами жесткости бака, повышая тем самым пространственную жесткость бака; они являются ...

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Номер записи: 7
22-12-2020 дата публикации

АКВАРЕЗЕРВУАР

Номер: RU0000201574U1
Автор: Вяткин Вячеслав Владимирович
Принадлежит: Вяткин Вячеслав Владимирович

Полезная модель относится к таре, имеющей в поперечном сечении криволинейный контур, корпус которой выполнен путем соединения двух и более жестких составных частей, изготовленных из металла, и отличается конструкцией стенок и соединениями между стенками, содержащими усиливающие элементы. Техническая проблема заключается в необходимости расширения функциональных возможностей акварезервуара за счет обеспечения возможности установки на этом акварезервуаре технических средств подготовки питьевой воды для наполнения этого акварезервуара этой водой, получаемой ее соответствующей обработкой из водопроводной воды. Технический результат заключается в том, что благодаря эффекту силовой рамы, создаваемому лонжеронами и поперечинами рамы, удерживающими большие грани емкости от деформаций под действием давления находящейся в емкости питьевой воды, обеспечивается возможность интеграции в эту емкость технических средств подготовки питьевой воды, с тем чтобы не устанавливать для этой цели отдельные модули водоподготовки, а осуществлять эту водоподготовку непосредственно на акварезервуаре при помощи технических средств, закрепленных на большей грани емкости акварезервуара с ее (емкости) наружной стороны. Акварезервуар представляет собой емкость 1, выполненную в виде полого параллелепипеда с двумя одинаковыми большими боковыми гранями 2, 3 и 4, 5, двумя одинаковыми меньшими боковыми гранями 6 и 7. Емкость 1 содержит лонжеронную раму, включающую два вертикально ориентированных лонжерона 8 и 9 и как минимум одну горизонтальную поперечину 16, соединенную с лонжеронами. Боковые грани параллелепипеда емкости 1 образованы первым 17 и вторым 18 швеллерными коробами. Свободные ребра полок швеллеров этих швеллерных коробов выполнены с поперечными отгибами 10, 13, 12, 15, ориентированными наружу и жестко соединенными между собой с образованием указанных лонжеронов на больших боковых гранях этого параллелепипеда. Акварезервуар также содержит третий швеллерный короб 19, стенка 20 которого ...

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Номер записи: 8
24-01-2022 дата публикации

БАК ДЛЯ ЖИДКОСТИ

Номер: RU0000208952U1
Автор: Вяткин Вячеслав Владимирович
Принадлежит: Вяткин Вячеслав Владимирович

Полезная модель относится к таре, имеющей в поперечном сечении криволинейный, а именно прямоугольный, контур, корпус которой выполнен путем соединения жестких составных частей, отличающейся конструкцией стенок, содержащих усиливающие и упрочняющие элементы. Бак для жидкости, выполненный в виде вертикально ориентированного прямоугольного параллелепипеда, в котором две противоположные по оси X в прямоугольной системе X-Y координат плана бака боковые грани его параллелепипеда механически связаны между собой с возможностью предотвращения выпуклых деформаций этих граней в направлении оси X, причем две другие противоположные по оси Y грани этого параллелепипеда бака механически связаны между собой с возможностью предотвращения выпуклых деформаций этих других граней в направлении оси Y, при этом Х-поперечина и Y-поперечина жестко соединены между собой с образованием единой крестовой Х-Y-поперечины, механически связывающей между собой все четыре боковые грани параллелепипеда бака для предотвращения их выпуклых деформаций. Технический результат заключается в предотвращении возможных выпуклых деформаций всех четырех граней параллелепипеда бака без увеличения толщины их стенок благодаря дополнительному предотвращению возможных выпуклых деформаций противоположных по оси Y граней параллелепипеда в прямоугольной системе X-Y координат плана бака. 2 з.п. ф-лы, 1 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 208 952 U1 (51) МПК B65D 8/08 (2006.01) B05C 11/11 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК B65D 7/12 (2021.08); B05C 11/11 (2021.08) (21)(22) Заявка: 2021119659, 05.07.2021 (24) Дата начала отсчета срока действия патента: (73) Патентообладатель(и): Вяткин Вячеслав Владимирович (RU) Дата регистрации: 24.01.2022 Приоритет(ы): (22) Дата подачи заявки: 05.07.2021 (45) Опубликовано: 24.01.2022 Бюл. № 3 2 0 8 9 5 2 R U (54) БАК ДЛЯ ЖИДКОСТИ (57) Реферат: Полезная модель относится к таре, имеющей в поперечном сечении ...

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Номер записи: 9
19-01-2012 дата публикации

Substrate processing apparatus, substrate processing method and non-transitory computer storage medium

Номер: US20120013730A1
Автор: Norihisa Koga
Принадлежит: Tokyo Electron Ltd

A substrate processing apparatus includes: a holding unit holding a substrate; a rotation driving unit rotating the substrate held on the holding unit; a moving mechanism moving the holding unit between a delivery position and an edge exposure position; an exposure unit provided on the edge exposure position side and exposing an edge portion of a coating film above the substrate held on the holding unit; an image capturing unit provided on the edge exposure position side and above the exposure unit and capturing an image of the substrate held on the holding unit; and a direction change unit changing a direction of an optical path formed between the substrate held on the holding unit and the image capturing unit. The direction change unit includes a first reflecting mirror, a second reflecting mirror, and a third reflecting mirror.

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Номер записи: 10
09-02-2012 дата публикации

Method for forming pattern and method for manufacturing liquid crystal display device

Номер: US20120033172A1
Автор: Gug-Rae Jo, Hyun-seok Kim, Jae-Hyuk Chang, Seung-Jun Lee, Sin Kwon, Sung Hee Lee
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A method of forming a pattern and a manufacturing method of a liquid crystal display includes forming the pattern with a thin thickness by coating a pattern material on a printing roll using a nozzle, removing a surplus portion of the pattern material from the printing roll by using a plate, and transferring the pattern material remaining on the printing roll to a substrate to form the pattern.

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Номер записи: 11
01-03-2012 дата публикации

Method for manufacturing coating rod

Номер: US20120049405A1
Автор: Atsushi Ooshima, Nobuyuki Sone, Yuuki OOI
Принадлежит: Fujifilm Corp

A method for manufacturing a coating rod, comprising the steps of preparing a rod material, disposing a pair of form rolling dies having a plurality of helical convex threads, so that the closure angle of a main axis of each of the form rolling dies in the horizontal direction of the main axis is substantially 0.25° or larger but not larger than 0.35° with respect to an axial direction of the rod material, and form-rolling the rod material by feeding the rod material along the axial direction thereof and rotating the pair of form rolling dies around the main axes thereof, while clamping the rod material with the pair of form rolling dies.

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Номер записи: 12
26-04-2012 дата публикации

Coating appratus having two coating devices for successively coating same surface of substrate

Номер: US20120097098A1
Автор: shao-kai Pei
Принадлежит: Hon Hai Precision Industry Co Ltd

A coating apparatus includes a first coating device, a number of second coating devices and a number of substrate holders. Each of the substrate holders is rotatable relative to the first coating device and the second coating devices such that one of two opposite holding surfaces of the substrate holder alternately faces the first coating device and the second coating devices.

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Номер записи: 13
31-05-2012 дата публикации

Device and method for coating a micro- and/or nano-structured structural substrate and coated structural substrate

Номер: US20120135143A1
Автор: Erich Thallner
Принадлежит: Individual

The present invention relates to a device and a method for coating a microstructured and/or nanostructured structured substrate. According to the present invention, the coating is performed in a vacuum chamber. The pressure level in the vacuum chamber is elevated during or after the charging of the vacuum chamber with coating substance.

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Номер записи: 14
31-05-2012 дата публикации

Coating treatment method, computer-readable storage medium, and coating treatment apparatus

Номер: US20120135358A1
Автор: Takashi Tanaka
Принадлежит: Tokyo Electron Ltd

A substrate is first rotated at a first rotation speed, and a resist solution is applied. Rotation of the substrate is decelerated to a second rotation speed lower than the first rotation speed so that the substrate is rotated at the low speed to smooth the resist solution on the substrate. Rotation of the substrate is then accelerated to a third rotation speed higher than the second rotation speed, and a solvent for the coating solution and/or a dry gas are/is supplied to the resist solution on the substrate. The solvent gas is supplied to a portion of the resist solution on the substrate thicker than a set thickness, and the dry gas is supplied to a portion of the coating solution on the substrate thinner than the set thickness. This thins the thicker portion of the resist solution and thickens the thinner portion to uniform the resist solution.

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Номер записи: 15
07-06-2012 дата публикации

Method for controlling glue flow

Номер: US20120138222A1
Автор: William Halliday
Принадлежит: STMicroelectronics Research and Development Ltd

A method for controlling a contact angle between a glue and a surface of a substrate during manufacture of microchip packages is disclosed. The method includes applying a glue to a surface of a substrate, and placing an electrode in electrical connection with the glue. A potential difference is applied between the electrode and the substrate. The potential difference is applied across the glue and causes a contact angle between the glue and the surface of the substrate to be altered.

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Номер записи: 16
07-06-2012 дата публикации

Coating apparatus, coating method and coating-film forming apparatus

Номер: US20120141682A1
Автор: Akihiko Nakamura, Seiji Ohishi
Принадлежит: Tokyo Ohka Kogyo Co Ltd

A coating method, which uses a coating apparatus including a rotatable tray having a recessed portion for accommodating a substrate and rotatable together with the substrate, a nozzle for supplying a coating liquid, and an applicator for spreading the coating liquid, includes the steps of placing a substrate into the recessed portion of the tray, positioning the nozzle over a non-recessed portion of the upper surface of the tray, supplying a coating liquid from the nozzle, and forming a coating liquid pool only on the non-recessed portion of the upper surface of the tray, moving the applicator in a horizontal direction while maintaining a certain distance with respect to the upper surface of the substrate for spreading the coating liquid of the coating liquid pool over the entire upper surface of the substrate, and releasing the substrate from the recessed portion of the tray.

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Номер записи: 17
19-07-2012 дата публикации

Device for applying a protective material on the edge of an element

Номер: US20120180718A1
Автор: Xavier Martin
Принадлежит: AIRBUS OPERATIONS SAS

Device for applying a protective material on one edge of a part, includes a body equipped with elements for applying the protective material on the edge, elements for calibrating the protective material in terms of height after application, at least one stop to position the body relative to the edge and elements for calibrating the edges of the protective material including two smoothing plates that rest respectively against the right and the left surfaces of the part adjacent to the edge, at least one of the two smoothing plates being movable relative to the other smoothing plate. The body includes at least one arm that supports a smoothing plate and pivots relative to the body around an axis of rotation so as to regulate the spacing between the two smoothing plates and return elements that tend to make the arm pivot so as to bring the smoothing plates close together.

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Номер записи: 18
26-07-2012 дата публикации

Deposition of viscous material

Номер: US20120186514A1
Автор: Nitin H. Parbhoo, Spyridon Skordas
Принадлежит: International Business Machines Corp

Embodiments of the invention provide methods and systems for depositing a viscous material on a substrate surface. In one embodiment, the invention provides a method of depositing a viscous material on a substrate surface, the method comprising: applying a pre-wet material to a surface of a substrate; depositing a viscous material atop the pre-wet material; rotating the substrate about an axis to spread the viscous material along the surface of the substrate toward a substrate edge; and depositing additional pre-wet material in a path along the surface and adjacent the spreading viscous material.

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Номер записи: 19
26-07-2012 дата публикации

Coating treatment apparatus, coating treatment method, and non-transitory computer storage medium

Номер: US20120189773A1
Автор: Akira Nishiya, Kouzou Tachibana, Takahisa OTSUKA
Принадлежит: Tokyo Electron Ltd

A coating treatment apparatus includes: a rotating and holding part; a nozzle supplying a coating solution; a moving mechanism moving the nozzle; and a control unit that controls the rotating and holding part, the nozzle, and the moving mechanism to supply the coating solution onto a central portion of the substrate and rotate the substrate at a first rotation speed, then move a supply position of the coating solution from a central position toward an eccentric position of the substrate with the substrate being rotated at a second rotation speed lower than the first rotation speed while continuing supply of the coating solution, then stop the supply of the coating solution with the rotation speed of the substrate decreased to a third rotation speed lower than the second rotation speed, and then increase the rotation speed of the substrate to be higher than the third rotation speed.

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Номер записи: 20
20-09-2012 дата публикации

Coating apparatus and coating method

Номер: US20120238075A1
Автор: Hidenori Miyamoto, Tsutomu Sahoda
Принадлежит: Tokyo Ohka Kogyo Co Ltd

A coating apparatus including a coating part which applies a liquid material containing an oxidizable metal and a solvent to a substrate; a chamber having a coating space in which the coating part applies the liquid material to the substrate and a transport space into which the substrate is transported; and a removal part which removes the liquid material from the atmosphere inside the chamber when a concentration of the solvent in the atmosphere inside the chamber exceeds a threshold value.

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Номер записи: 21
22-11-2012 дата публикации

Apparatus and method for jetting liquid material in desired patterns

Номер: US20120292405A1
Автор: Daniel T. Smulders, Edward C. Taylor, John M. Riney, Steve Clark
Принадлежит: Nordson Corp

An apparatus 10 for jetting liquid material in desired patterns includes a jetting module 18 that is couplable to a source of liquid material 12. A piston 46 is disposed for movement within an interior chamber 42 to rapidly develop high pressure within the module 18 so that liquid material 12 is jetted from through a pattern plate 70 in a desired pattern.

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Номер записи: 22
20-12-2012 дата публикации

Method for manufacturing semiconductor device and semiconductor manufacturing apparatus

Номер: US20120318431A1
Автор: Atsushi Yoshimura, Fumihiro Iwami, Yasuo Tane, Yukio KATAMURA
Принадлежит: Toshiba Corp

In one embodiment, a method for manufacturing a semiconductor device is disclosed. The method can include, upon attaching a bonding material containing a resin and a solvent to a second surface opposed to a first surface including a circuit pattern of a wafer, heating the bonding material to evaporate the solvent and decreasing vapor pressure of the solvent in an atmosphere faced with the bonding material and heating the attached bonding material to form a bonding layer.

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Номер записи: 23
20-12-2012 дата публикации

Coating film forming method and coating film forming apparatus

Номер: US20120322273A1
Автор: Tomoya Oori
Принадлежит: Toshiba Corp

A coating film forming method according to an embodiment, includes rotating a substrate, supplying a chemical solution for forming a coating film onto the rotating substrate, and supplying a liquid having a lower temperature than an atmosphere of the substrate to an edge of the substrate from a back side of the substrate while a film is formed by supplying the chemical solution onto the rotating substrate.

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Номер записи: 24
24-01-2013 дата публикации

Semiconductor device manufacturing method and semiconductor device manufacturing apparatus

Номер: US20130023117A1
Автор: Masanori Shindou
Принадлежит: Lapis Semiconductor Co Ltd

A method of manufacturing a semiconductor device includes: preparing a wafer member, the wafer member including a wafer, a conductive layer formed on a surface of the wafer and a negative photoresist formed on the conductive layer; applying a light blocking material so as to cover at least a part of an outer edge of the wafer member from an upper surface of the negative photoresist to a side surface of the negative photoresist; exposing the negative photoresist to exposure light; removing the light blocking material; and developing the negative photoresist.

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Номер записи: 25
31-01-2013 дата публикации

Electric application head for dispensing a free-flowing medium, and device comprising such an electric application head

Номер: US20130026198A1
Автор: Hanspeter Felix, Heinz Mueller, Roman Kappeler
Принадлежит: Robatech AG

The invention relates to an application head ( 15 ) for dispensing a free-flowing medium. The application head ( 15 ) comprises an injection chamber ( 10 ) inside the application head ( 15 ) and an injection needle ( 11 ) movably mounted inside the injection chamber ( 10 ). An opening movement (P) of the injection needle ( 11 ) opens an outlet ( 12 ). A supply channel ( 13 ) and a supply line are also provided in order to introduce the free-flowing medium into the injection chamber ( 10 ). A drive ( 20 ) generates the opening movement (P) of the injection needle ( 11 ). The application head ( 15 ) also comprises a lever arm ( 30 ), the first end ( 31 ) of said arm being movably fixed to a rear end ( 14 ) of the injection needle ( 11 ) and the second end ( 32 ) thereof being connected to the drive. A membrane suspension ( 33 ) comprising a membrane ( 34 ) is provided, and the lever arm ( 30 ) extends through the membrane ( 34 ) of the membrane suspension ( 33 ). The membrane suspension ( 33 ) is used to movably connect the lever arm ( 30 ) to the application head ( 15 ), and as a seal to prevent the free-flowing medium from leaking out.

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Номер записи: 26
07-02-2013 дата публикации

Substrate processing apparatus, substrate processing method and storage medium

Номер: US20130032179A1
Автор: Tomohiro Kaneko
Принадлежит: Tokyo Electron Ltd

Provided is a substrate processing apparatus which can efficiently transfer substrates using a conveying mechanism including a plurality of substrate holding members. The substrate processing apparatus transfers a processed substrate to an intermediate conveying unit using a transport mechanism when the processed substrate returns to a substrate receiving unit. When a conveying mechanism withdraws the processed substrate from the intermediate conveying unit and transfers the processed substrate to the substrate receiving unit, a control unit determines whether both of a first substrate processed first among a plurality of substrates withdrawn from the substrate receiving unit as a set and a succeeding substrate processed later than the first substrate should be transferred together after waiting until the succeeding substrate is transferred to the intermediate conveying unit or to transfer the first substrate without waiting for the succeeding substrate, when the first substrate is transferred to the intermediate conveying unit.

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Номер записи: 27
07-03-2013 дата публикации

Dispenser, and refill

Номер: US20130056552A1
Автор: Matthew Teeling, Paul Wonnacott
Принадлежит: Vectair Systems Ltd

A dispenser capable of dispensing a fluid via a vertically-oriented piezo device comprises a reservoir containing a fluid to be dispensed, an outlet at a base portion of the reservoir, leading to a dispensing port that comprises a piezo element drivable to vibrate and thereby dispense fluid from the dispensing port, a bleed tube communicating at one end with the dispensing port, extending therefrom to a location above the dispensing port, and including a selectively closeable valve, and a source of below-atmospheric pressure to the portion of the reservoir above the fluid. Embodiments of refills suitable for such a dispensing apparatus are also described.

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Номер записи: 28
11-04-2013 дата публикации

Coating method and coating apparatus

Номер: US20130089664A1
Автор: Tomohiro Goto, Yukihiko Inagaki
Принадлежит: Screen Semiconductor Solutions Co Ltd

A coating method includes a step of forming a film of a coating solution having a larger thickness in a central region of a substrate than in an edge region of the substrate by discharging droplets of the coating solution from a plurality of nozzles formed on an inkjet head to the substrate, and a step of moving the coating solution in the film from the central region toward the edge region of the substrate by rotating the substrate. This reduces a difference in thickness of the film between the central region and the edge region of the substrate, thereby to make the film thickness substantially uniform. At the same time, the movement of the coating solution in the film can make the surface of the film smoother.

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Номер записи: 29
09-05-2013 дата публикации

DEVICE FOR APPLYING FLUID MEDIA

Номер: US20130112136A1
Автор: Mensing Heinrich
Принадлежит:

The invention relates to a device for applying fluid media to material that is moved in a web-like manner, in particular for applying hot-melt adhesive () to a textile material, and in particular for reinforcing the back of a carpet or a synthetic turf (), comprising a gap-shaped application region (), for the medium (), which extends transversely to the web direction and is delimited in the transport direction of the web () by a trailing doctor blade () facing the surface of the web (). According to the invention, a smoothing contour () cooperating with the applied medium () is provided downstream of the doctor blade () in the transport direction of the web (). 19-. (canceled)10. A device for applying fluid media onto material being moved in a web-like manner , in particular for applying hot-melt adhesive onto a textile material , and in particular for reinforcing the back of a carpet or a synthetic turf , comprising a gap-shaped application region for the medium , which extends transversely to the web direction and is delimited in the transport direction of the web by a trailing doctor blade facing the surface of the web , whereina smoothing contour cooperating with the applied medium is arranged downstream of the doctor blade in the transport direction of the web.11. The device according to claim 10 , wherein the smoothing contour is a part of a bar extending parallel to the doctor blade.12. The device according to claim 10 , wherein the smoothing contour is a part of a structure formed to the doctor blade.13. The device according to claim 10 , wherein the smoothing contour is a part of a housing supporting the doctor blade.14. The device according to claim 10 , wherein the smoothing contour is adjustable claim 10 , with the aid of adjusting means claim 10 , relative to the doctor blade upstream of the smoothing contour and thus relative to the surface of the article.15. The device according to claim 14 , wherein the distance from the smoothing contour to the ...

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Номер записи: 30
09-05-2013 дата публикации

Quick change hopper

Номер: US20130115016A1
Автор: Daniel P. Ross, Paul R. Quam
Принадлежит: GRACO MINNESOTA INC

An adhesive melt system includes a hopper, a feed system, a valve, and a releasable coupling. The hopper stores hot melt pellets and the valve regulates movement of the pellets from the hopper to the feed system. The feed system delivers the hot melt pellets from the hopper. The releasable coupling allows for connection and disconnection of the hopper to and from the feed system. In one embodiment, the hopper is interchangeable with a second hopper. Both hoppers have a coupling that allows for quick connection to and disconnection from the feed system

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Номер записи: 31
16-05-2013 дата публикации

Panel, method for producing panel, solar cell module, printing apparatus, and printing method

Номер: US20130122645A1
Автор: Koji Sakamoto
Принадлежит: TAKANOHA TRADING CO Ltd

A printing apparatus according to the present invention includes a printing section configured to print ink on a surface of a substrate. The printing section prints conductive ink containing a conductive material by offset printing and prints conductive ink containing a conductive material different from the conductive material on the conductive ink by offset printing. Preferably, the printing apparatus further includes a conveyor configured to convey the substrate. Further, the printing section preferably includes a first printing machine configured to print first conductive ink and a second printing machine configured to print second conductive ink.

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Номер записи: 32
16-05-2013 дата публикации

DELIVERY UNIT FOR AN APPLICATION SYSTEM

Номер: US20130123975A1
Автор: Duckworth David
Принадлежит: Henkel AG & Co. KGaa

Delivery unit for an application system for an industrial application of an adhesive and/or sealant comprising a line system for the adhesive and/or sealant and an input suitable for the connection of a storage container to the delivery unit and an output suitable for the connection of a dispensing means to dispense the adhesive and/or sealant and a feed pump and a measuring unit to collect data especially about the amount of fed adhesive and/or sealant and an interface to tap the data collected by the measuring unit. 1. Delivery unit for an application system for industrial application of an adhesive and/or sealant comprising:a line system for the adhesive and/or sealant;an input for the connection of a storage container to the delivery unit;an output for the connection of a dispensing means to dispense the adhesive and/or sealant;a feed pump;a measuring unit to collect data; andan interface to tap the data collected by the measuring unit.2. Delivery unit according to comprising a control unit with a data processing program to process the data collected by the measuring unit.3. Delivery unit according to comprising a control unit for regulation of the feed pump to control the amount of adhesive and/or sealant to be fed by the feed pump in response to the data read by the measuring unit.4. Delivery unit according to claim 1 , wherein the interface comprises a telemetric module to transfer the data to and for from a different location.5. Delivery unit according to comprising input means for input of further data claim 1 , wherein the further data is tappable via the interface.6. The delivery unit of where the measuring unit collects data about the amount of dispensed adhesive and/or sealant.7. Application system for industrial application of an adhesive and/or sealant comprising:a storage container for an adhesive and/or sealant,a delivery unit with a line system for the adhesive and/or sealant, which is connected to the storage container via an input, with an output ...

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Номер записи: 33
23-05-2013 дата публикации

ATOMIZER WITH LIQUID SUPPLEMENT CONTAINER

Номер: US20130126637A1
Автор: FANG TUN-YING, HSIEH SHU-PIN, HSU YU-CHUNG, HUANG CHIA-CHEN, LAI HSIANG-YUAN, LIN TAI-SHUAN
Принадлежит: MICRO BASE TECHNOLOGY CORPORATION

In an atomizer with a liquid supplement container, the atomizer includes a casing and an atomization device covered by the casing, and the container is filled with a supplementary liquid and has a seal disposed at an opening of the container for easy storage and carry. The casing further includes at least one installing slot, and a seal destruction structure installed in the installing slot, and the installing slot is coupled with the atomization device. When the container is installed in the installing slot, the seal destruction structure destruct the seal to allow the supplementary liquid to flow into the installing slot for the atomization by the atomization device, so as to improve the convenience of use, prevent the supplementary liquid from contaminating the casing or causing failure of the atomization device. 1. An atomizer with a liquid supplement container , characterized in that the liquid supplement container is filled with a supplementary liquid , and has a seal disposed at an opening of the liquid supplement container; andthe atomizer, comprises:a casing, having a containing space defined therein, at least one installing slot formed on the casing and interconnected with the containing space, and a seal destruction structure installed in the installing slot; andan atomization device, installed in the containing space of the casing, and having at least one spray hole formed on a surface of the casing for atomizing the supplementary liquid and spraying the supplementary liquid out from the spray hole;thereby, when the liquid supplement container is installed in the installing slot, the seal destruction structure is provided for destructing the seal, so that the supplementary liquid flows into the installing slot for an atomization by the atomization device.2. The atomizer with a liquid supplement container according to claim 1 , wherein the container is made of a material selected from the collection of glass claim 1 , plastic and metal claim 1 , and the ...

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Номер записи: 34
06-06-2013 дата публикации

SYSTEMS AND METHODS FOR IMPROVING FRONT-SIDE PROCESS UNIFORMITY BY BACK-SIDE METALLIZATION

Номер: US20130143411A1
Автор: Cheng Kezia
Принадлежит: SKYWORKS SOLUTIONS, INC.

Disclosed are systems and methods for improving front-side process uniformity by back-side metallization. In some implementations, a metal layer can be formed on the back side of a semiconductor wafer prior to certain process steps such as plasma-based processes. Presence of such a back-side metal layer reduces variations in, for example, thickness of a deposited and/or etched layer resulting from the plasma-based processes. Such reduction in thickness variations can result from reduced variation in radio-frequency (RF) coupling during the plasma-based processes. Various examples of wafer types, back-side metal layer configurations, and plasma-based processes are disclosed. 1. A method for processing a semiconductor wafer , the method comprising:providing a wafer having a back side and a front side;forming a metal layer on one side of the wafer; andperforming a plasma-based process on the other side of the wafer, the metal layer facilitating improved uniformity in thickness of a layer resulting from the plasma-based process.2. The method of wherein the metal layer is formed on the back side of the wafer and the plasma-based process is performed on the front side of the wafer.3. The method of wherein the metal layer covers substantially the entire area of the back side of the wafer.4. The method of wherein the wafer is a gallium arsenide (GaAs) wafer.5. The method of wherein the metal layer includes tungsten titanium (W—Ti).6. The method of wherein the metal layer metal layer is formed using a sputtering process.7. The method of wherein the metal layer has a thickness in a range of approximately 500 angstroms to 2 claim 6 ,000 angstroms.8. The method of wherein the plasma-based process includes a deposition process.9. The method of wherein the deposition process includes a plasma-enhanced chemical vapor deposition (PECVD) process.10. The method of wherein the plasma-based process includes an etching process.11. The method of wherein the etching process includes a ...

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Номер записи: 35
04-07-2013 дата публикации

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING APPARATUS, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM

Номер: US20130171838A1
Автор: Okuda Kazuyuki
Принадлежит: HITACHI KOKUSAI ELECTRIC INC.

Provided is a method of manufacturing a semiconductor device capable of forming a nitride layer having high resistance to hydrogen fluoride at low temperatures. The method includes forming a nitride film on a substrate by performing a cycle a predetermined number of times, the cycle including supplying a source gas to the substrate, supplying a plasma-excited hydrogen-containing gas to the substrate, supplying a plasma-excited or thermally excited nitriding gas to the substrate, and supplying at least one of a plasma-excited nitrogen gas and a plasma-excited rare gas to the substrate. 1. A method of manufacturing a semiconductor device , the method comprising forming a nitride film on a substrate by performing a cycle a predetermined number of times , the cycle including:(a) supplying a source gas to the substrate;(b) supplying a plasma-excited hydrogen-containing gas to the substrate;(c) supplying a plasma-excited or thermally excited nitriding gas to the substrate; and(d) supplying at least one of a plasma-excited nitrogen gas and a plasma-excited rare gas to the substrate.2. The method of claim 1 , wherein the step (b) is performed during one of a time period after the step (a) and a time period after the step (c) claim 1 , andthe step (d) is performed during one of the time period after the step (a) and the time period after the step (c) other than the time period where the step (b) is performed.3. The method of claim 1 , wherein the step (b) is performed during one of a time period after the step (a) where a supply of the plasma-excited or thermally excited nitriding gas is suspended and a time period after the step (c) where a supply of the source gas is suspended claim 1 , andthe step (d) is performed during one of the time period after the step (a) where the supply of the plasma-excited or thermally excited nitriding gas is suspended and the time period after the step (c) where the supply of the source gas is suspended other than the time period where the ...

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Номер записи: 36
11-07-2013 дата публикации

PRECURSOR SUPPLIES, MATERIAL PROCESSING SYSTEMS WITH WHICH PRECURSOR SUPPLIES ARE CONFIGURED TO BE USED AND ASSOCIATED METHODS

Номер: US20130177699A1
Автор: Cao Liulei, Sorenson Max, Stevens Blake
Принадлежит: HZO, INC.

In various aspects and embodiments, the present disclosure relates to the manner in which precursor materials are provided to processing equipment and, more specifically, to the manner in which precursor materials of organic polymers are delivered to systems for forming and, in some embodiments, depositing the organic polymers. In one aspect, the disclosure relates to precursor supplies, which comprise vehicles, such as binders, supports and cartridges, for delivering a precursor material to a material processing system, such as a deposition system or other processing equipment. In another aspect, the disclosure relates to material processing systems with which the precursor supplies are configured to be used. Methods for preparing precursor supplies, using precursor supplies, providing process control, and recycling precursor supplies are also disclosed. 1. A precursor supply for introduction into a system for depositing an organic polymer onto a substrate , comprising:a prepackaged precursor supply specifically configured for introduction into a complementary receptacle of a material processing system; anda precursor material in the prepackaged precursor supply, the precursor material comprising a material that, when processed by the material processing system, will deposit an organic polymer onto a substrate.2. The precursor supply of claim 1 , wherein the prepackaged precursor supply comprises a solid mass including the precursor material.3. The precursor supply of claim 2 , wherein the solid mass further includes a binder for holding the precursor material in the solid mass.4. The precursor supply of claim 1 , wherein the prepackaged precursor supply comprises a support for carrying the precursor material.5. The precursor supply of claim 4 , wherein a configuration of the prepackaged precursor supply resembles a configuration of the support.6. The precursor supply of claim 1 , wherein the prepackaged precursor supply includes a container with a reservoir for ...

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Номер записи: 37
25-07-2013 дата публикации

Aerosol generators

Номер: US20130186975A1
Автор: Brendan Hogan, Daniela Butan, David Shiel, Mark Southern, Michael Pomeroy, Seamus Clifford
Принадлежит: Stamford Devices Ltd

An aperture plate is formed from a palladium nickel alloy comprising about 89% palladium and about 11% nickel. There is a generally fine substantially equiaxed grain microstructure throughout the thickness of the aperture plate. The average grain width (W) is in the range of from 0.2 μm to 5.0 μm, in some cases from 0.2 μm to 2.0 μm. Because the grain structure is equiaxed (L/W=1) the grain length (L) is the same as the grain width. The improved aperture plate extends the life of nebulisers, eliminates the risk of premature and unpredictable failure of a nebuliser in service, eliminates the risk of product returns from hospitals and patients, and eliminates the possible risk of fragments of the aperture plate breaking free from the nebulizer.

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Номер записи: 38
01-08-2013 дата публикации

Developing method

Номер: US20130194557A1
Автор: Kousuke Yoshihara, Taro Yamamoto, Yuichi Yoshida
Принадлежит: Tokyo Electron Ltd

A method of developing a substrate including rotating the substrate and supplying a developing liquid from a discharge port of a developer nozzle onto the surface of the substrate, while moving the developer nozzle, disposed above the substrate, from a central portion towards a peripheral portion of the substrate, and supplying a first rinse liquid from a discharge port of a first rinse nozzle onto the surface of the substrate, while moving the first rinse nozzle, disposed above the substrate, from the central portion towards the peripheral portion of the substrate. The supplying of the developing liquid and the first rinse liquid are performed concurrently, with the first rinse nozzle being maintained nearer to a center of the substrate than the developer nozzle.

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Номер записи: 39
01-08-2013 дата публикации

Slotted electrostatic shield modification for improved etch and cvd process uniformity

Номер: US20130196510A1
Автор: Andreas Kadavanich, Daniel J. Devine, Rene George, Stephen E. Savas
Принадлежит: Mattson Technology Inc

A more uniform plasma process is implemented for treating a treatment object using an inductively coupled plasma source which produces an asymmetric plasma density pattern at the treatment surface using a slotted electrostatic shield having uniformly spaced-apart slots. The slotted electrostatic shield is modified in a way which compensates for the asymmetric plasma density pattern to provide a modified plasma density pattern at the treatment surface. A more uniform radial plasma process is described in which an electrostatic shield arrangement is configured to replace a given electrostatic shield in a way which provides for producing a modified radial variation characteristic across the treatment surface. The inductively coupled plasma source defines an axis of symmetry and the electrostatic shield arrangement is configured to include a shape that extends through a range of radii relative to the axis of symmetry.

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Номер записи: 40
08-08-2013 дата публикации

Devices Including Metal-Silicon Contacts Using Indium Arsenide Films and Apparatus and Methods

Номер: US20130200518A1
Автор: Ahmed Khaled Z., Chang Mei, Gopalraja Prabu, Noori Atif
Принадлежит:

Described are apparatus and methods for forming films comprise indium and arsenic. In particular, these films may be formed in a configuration of two or more chambers under “load lock” conditions. These films may include additional components as dopants, such as aluminum and/or gallium. Such films can be used in metal/silicon contacts having low contact resistances. Also disclosed are devices including the films comprising indium arsenide. 1. A substrate processing apparatus comprising:a first processing chamber to clean a substrate to provide a cleaned substrate;a second processing chamber in communication with the first processing chamber to deposit a layer comprising indium arsenide on the cleaned substrate;a third processing chamber in communication with the second processing chamber to deposit a metal layer on the layer comprising indium arsenide; anda control system in communication with the first, second and third processing chambers,wherein the first, second and third processing chambers are in communication under load lock conditions.2. The apparatus of claim 1 , wherein the first processing chamber performs atomic hydrogen cleaning or cleaning with a fluorine-containing precursor.3. The apparatus of claim 1 , wherein the second processing chamber is an atomic layer deposition (ALD) chamber claim 1 , physical vapor deposition (PVD) chamber claim 1 , chemical vapor deposition (CVD) chamber or molecular beam epitaxy (MBE) chamber.4. The apparatus of claim 3 , wherein the second processing chamber is an ALD chamber.5. The apparatus of claim 3 , wherein the PVD chamber is a sputtering chamber.6. The apparatus of claim 1 , wherein the indium arsenide layer further comprises one or more of gallium claim 1 , aluminum claim 1 , antimony and phosphorus.7. The apparatus of claim 1 , wherein the third processing chamber is an ALD chamber.8. The apparatus of claim 1 , wherein the control system controls the second processing chamber to deposit a layer comprising indium ...

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Номер записи: 41
15-08-2013 дата публикации

RESIN COATING DEVICE AND RESIN COATING METHOD

Номер: US20130210174A1
Автор: Nonomura Masaru
Принадлежит: Panasonic Corporation

In a resin coating used for manufacturing an LED package including an LED element coated with resin containing phosphor, a light-transmitting member test-coated with resin for an emission characteristic measurement on a light-transmitting member placing section including a light source unit, a deviation between a measurement result of an emission characteristic of light emitted from the resin coated on the light-transmitting member measured by an emission characteristic measurement unit by irradiating the resin with excitation light emitted from the light source unit and a prescribed emission characteristic is obtained, and an appropriate resin coating amount of the resin to be coated on the LED element for an actual production is derived based on the deviation. 1. A resin coating device which is used in an LED package manufacturing system for manufacturing an LED package comprising an LED element mounted on a substrate and coated with resin containing phosphor , and which coats the LED element mounted on the substrate with the resin , said resin coating device comprising:a resin coating section which discharges the resin by variably adjusting an amount thereof and which coats an arbitrary coating target position with the resin;a coating control unit which controls the resin coating section to execute a measurement coating process in which a light-transmitting member is test-coated with the resin for measuring an emission characteristic and a production coating process in which the LED element is coated with the resin for an actual production;a light-transmitting member placing section which comprises a light source unit which emits excitation light which excites the phosphor, and on which the light-transmitting member coated with the test-coated resin is to be placed in the measurement coating process;an emission characteristic measurement unit which measures an emission characteristic of light emitted from the resin coated on the light-transmitting member by ...

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Номер записи: 42
15-08-2013 дата публикации

METHOD AND APPARATUS FOR DIVIDING THIN FILM DEVICE INTO SEPARATE CELLS

Номер: US20130210224A1
Автор: Brunton Adam North
Принадлежит:

A method and apparatus for dividing a thin film device having a first layer which is a lower electrode layer, a second layer which is an active layer and a third layer which is an upper electrode layer, the layers each being continuous over the device, into separate cells each having a width W, which are electrically interconnected in series by interconnect structures. The dividing of the cells and the formation of the interconnect structures between adjacent cells are carried out by a process head which is arranged to operate on more than one interconnect structure at a time in a sequence of passes to and fro over the device, the process head performing the following steps: a) making a first cut through the first, second and third layers; b) making a second cut through the second and third layers, the second cut being adjacent to the first cut; c) making a third cut through the third layer the third cut being adjacent to the second cut and on the opposite side of the second cut to the first cut; d) using a first ink jet print head to deposit a non-conducting material into the first cut; and e) using a second ink jet print head to apply conducting material to bridge the non-conducting material in the first cut and either fully or partially fill the second cut such to form an electrical connection between the first layer and the third layer, wherein step (a) precedes step (d), step (d) precedes step (e) and step (b) precedes step (e), (otherwise the steps may be carried out in any order in the single pass of the process head across the device). The thin film device may be a solar panel, a lighting panel or a battery. 1. A method for dividing a thin film device having a first layer which is a lower electrode layer , a second layer which is an active layer and a third layer which is an upper electrode layer , all the layers being continuous over the device , into separate cells which are electrically interconnected in series by interconnect structures , the dividing of ...

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Номер записи: 43
29-08-2013 дата публикации

APPARATUS FOR APPLYING COATING LIQUID AND COATING BAR

Номер: US20130220218A1
Автор: HORIKAWA Akihiro, MURAGISI Isao, TSUCHIDA Shuzo
Принадлежит: Panasonic Corporation

A coating bar in a coating apparatus includes grooves that are formed, on the surface of a cylindrical shaft, from a contact point between the coating bar and a substrate in a traveling direction and a direction opposite to the traveling direction, and are arranged in the width direction of the shaft. Thus, a uniform film can be stably applied to the curved or wavy substrate having high rigidity. 1. A coating bar having a cylindrical body drawn to spread a coating liquid in a scraping manner on a substrate to be coated with a thin film ,wherein the coating bar includes a plurality of grooves on a surface of the cylindrical body, andthe groove is shorter than a circumference of the cylindrical body in cross section.2. The coating bar according to claim 1 , wherein the groove comprises:a wire substantially circular in cross section; anda coating material partially covering the wire, anda region exposed from the coating material in a gap on the wire serves as the groove.3. The coating bar according to claim 2 , wherein the coating material is one of resin and rubber.4. The coating bar according to claim 2 , wherein the coating material is rubber movable on the surface of the cylindrical body in a circumferential direction of a circular section of the cylindrical body.5. The coating bar according to claim 1 , wherein the cylindrical body has a diameter of 2 mm to 6 mm in cross section.6. The coating bar according to claim 2 , wherein the cylindrical body has a diameter of 2 mm to 6 mm in cross section.7. The coating bar according to claim 1 , wherein the groove has one end from 90° to 120° in a first direction and an other end from an angle larger than 0° to 60° in a second direction opposite to the first direction claim 1 , with respect to a straight line connecting an axis of the cylindrical body to a contact point on the surface of the cylindrical body that comes into contact with the substrate when the cylindrical body is drawn.8. The coating bar according to claim ...

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Номер записи: 44
29-08-2013 дата публикации

Substrate cleaning method

Номер: US20130220368A1
Автор: Tomoatsu Ishibashi
Принадлежит: Ebara Corp

A substrate cleaning method can prevent corrosion of copper interconnects even when the cleaning method, which uses two-fluid jet cleaning, is used for cleaning of a surface of a substrate after polishing. The substrate cleaning method includes: carrying out primary cleaning of a surface of a substrate by scrub cleaning using a neutral or alkaline liquid chemical as a cleaning liquid; carrying out finish cleaning of the surface of the substrate by two-fluid jet cleaning which cleans the surface of the substrate in a non-contact manner by jetting carbonated water, comprising pure water or ultrapure water containing dissolved CO 2 gas, from a two-fluid nozzle toward the surface of the substrate; and subsequently carrying out final finish cleaning of the surface of the substrate by scrub cleaning using a neutral or alkaline liquid chemical as a cleaning liquid, and then drying the surface of the substrate.

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Номер записи: 45
12-09-2013 дата публикации

PLASMA PROCESSING CHAMBER FOR BEVEL EDGE PROCESSING

Номер: US20130233490A1
Автор: Bailey, III Andrew D., Kim Yunsang
Принадлежит: LAM RESEARCH CORPORATION

A process chamber includes a wafer support to mount a wafer to be processed in the process chamber, with the wafer having an annular edge exclusion area. A first electrically grounded ring extends in an annular path radially outward of the edge exclusion area and is electrically isolated from the wafer support. A second electrode is configured with a center area opposite to the wafer support. A second electrically grounded ring extends in an annular path radially outward of the second electrode and the edge exclusion area. The second electrically grounded ring is electrically isolated from the center area. An annular mount section has a DC bias ring, and the DC bias ring opposes the edge exclusion area when the wafer is present. A DC control circuit is provided for applying a DC voltage to the DC bias ring. 1. Apparatus for protecting a central device area of a wafer from charged particles in a process chamber , the apparatus comprising:a first electrode configured to mount the wafer in the process chamber with the central device area within a device border centered on a wafer axis and with a wafer edge exclusion area extending radially away from both the axis and the border;a second electrode configured with a field ring mount section extending radially relative to the border and away from the axis and being adjacent to the border;a field ring arrangement configured to establish a field capable of exerting force on the charged particles to repel the particles from moving to the central device area, the field ring arrangement being mounted in the field ring mount section and being configured so that the field has a field strength gradient configured with a peak value adjacent to the border, the field strength gradient defining increasing field strength inversely proportional to increased radial distance away from the axis and away from the border, the gradient and the peak value of the field strength repelling the charged particles from moving radially past the ...

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Номер записи: 46
12-09-2013 дата публикации

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM

Номер: US20130237064A1
Автор: KIRIKIHIRA Kaori, ORIHASHI Yugo, SHIMAMOTO Satoshi
Принадлежит: HITACHI KOKUSAI ELECTRIC INC.

A method of manufacturing a semiconductor device, includes: forming a film on a substrate by performing a cycle a predetermined number of times, the cycle including: supplying a raw material gas to a substrate in a process chamber, exhausting the raw material gas remaining in the process chamber through an exhaust line, supplying an amine-based gas; and exhausting the amine-based gas through the exhaust line with the supply of the amine-based gas stopped. A degree of valve opening of an exhaust valve disposed in the exhaust line is changed in multiple steps in the process of exhausting the amine-based gas. 1. A method of manufacturing a semiconductor device , comprising:forming a film on a substrate by performing a cycle a predetermined number of times, the cycle comprising:supplying a raw material gas to a substrate in a process chamber;exhausting the raw material gas remaining in the process chamber through an exhaust line in a state where the supply of the raw material gas is being stopped;supplying an amine-based gas to the substrate in the process chamber; andexhausting the amine-based gas remaining in the process chamber through the exhaust line in a state where the supply of the amine-based gas is being stopped,wherein a degree of valve opening of an exhaust valve disposed in the exhaust line is changed in multiple steps in the act of exhausting the amine-based gas remaining in the process chamber.2. The method of claim 1 , wherein the act of exhausting the amine-based gas remaining in the process chamber includes:exhausting the amine-based gas remaining in the process chamber with the degree of valve opening as a first degree of valve opening; andexhausting the amine-based gas remaining in the process chamber with the degree of valve opening as a second degree of valve opening which is higher than the first degree of valve opening.3. The method of claim 2 , wherein the second degree of valve opening is fully-opened.4. The method of claim 1 , wherein the act ...

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Номер записи: 47
19-09-2013 дата публикации

GAS WIPING DEVICE

Номер: US20130239884A1
Автор: KOGA Shinichi
Принадлежит: NISSHIN STEEL CO., LTD.

A gas wiping device for preventing splash on a steel band including a box-shaped body enclosing the steel band and gas wiping nozzles is provided with a plating bath for storing molten metal, and a box-shaped body placed above the plating bath. The box-shaped body is provided, in the interior, with gas wiping nozzles disposed facing one another on the respective tubular members so as to sandwich a band-shaped body. Gas wiping nozzle is provided with a first spraying unit capable of spraying gas to the steel band, and a second spraying unit and a third spraying unit capable of spraying gas towards the direction of gas wiping nozzle. Gas wiping nozzle is provided with a fourth spraying unit capable of spraying gas to the steel band, and a fifth spraying unit and a sixth spraying unit capable of spraying gas towards the direction of gas wiping nozzle. 1. A gas wiping device comprising:a first gas wiping nozzle and a second gas wiping nozzle arranged to face each other across a steel band pulled up from a molten-metal plating bath, the first and second gas wiping nozzles capable of removing excess molten metal adhering on a surface of the steel band;a first tubular member disposed along a width direction of the steel band, the first tubular member connected to the first gas wiping nozzle;a second tubular member disposed along a width direction of the steel band, the second tubular member connected to the second gas wiping nozzle;a box-shaped body housing the first and second gas wiping nozzles, and the first and second tubular members;a first partition member having one end thereof fixed to an outer wall of the first tubular member, and having the other end thereof fixed to an inner wall of the box-shaped body; anda second partition member having one end thereof fixed to an outer wall of the second tubular member, and having the other end thereof fixed to an inner wall of the box-shaped body, whereinthe first gas wiping nozzle includesa first spraying segment capable of ...

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Номер записи: 48
19-09-2013 дата публикации

Coating treatment method, coating treatment apparatus, and computer-readable storage medium

Номер: US20130239887A1
Автор: Koji Takayanagi, Kousuke Yoshihara, Tomohiro Iseki
Принадлежит: Tokyo Electron Ltd

In a coating step, a substrate is rotated at a high speed, and in that state a resist solution is discharged from a first nozzle to a central portion of the substrate to apply the resist solution over the substrate. Subsequently, in a flattening step, the rotation of the substrate is decelerated and the substrate is rotated at a low speed to flatten the resist solution on the substrate. In this event, the discharge of the resist solution by the first nozzle in the coating step is performed until a middle of the flattening step, and when the discharge of the resist solution is finished in the flattening step, the first nozzle is moved to move a discharge position of the resist solution from the central portion of the substrate. According to the present invention, the resist solution can be applied uniformly within the substrate.

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Номер записи: 49
26-09-2013 дата публикации

Heater chips with silicon die bonded on silicon substrate, including offset wire bonding

Номер: US20130250004A1
Автор: Carl Sullivan, Frank Anderson, II Burton Joyner, Timothy Strunk
Принадлежит: Funai Electric Co Ltd

A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die. A wire bond connects to the front of the substrate, but is offset from die.

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Номер записи: 50
03-10-2013 дата публикации

Substrate processing apparatus and substrate processing method

Номер: US20130260574A1
Автор: Hirofumi MASUHARA, Kenichiro Arai, Masahiro Miyagi, Toru Endo
Принадлежит: Dainippon Screen Manufacturing Co Ltd

In a substrate processing apparatus, with an internal space of a chamber brought into a reduced pressure atmosphere, a first processing liquid is supplied onto an upper surface of a substrate while the substrate is rotated, and the first processing liquid is thereby quickly spread from a center portion toward a peripheral portion on the upper surface of the substrate. It is thereby possible to coat the upper surface of the substrate with the first processing liquid in a shorter time as compared with under normal pressure. Further, by sucking the first processing liquid from the vicinity of an edge of the substrate, it is possible to coat the upper surface of the substrate with the first processing liquid in a still shorter time. As a result, it is possible to shorten the time required for the processing of the substrate.

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Номер записи: 51
10-10-2013 дата публикации

Method of jetting a liquid crystal, liquid crystal jetting apparatus for performing the method and method of manufacturing a liquid crystal panel using the apparatus

Номер: US20130267143A1
Автор: Seung-Yeon CHAE, Tae-gyun Kim, Tae-Woon Cha
Принадлежит: Samsung Display Co Ltd

A method of jetting a liquid crystal includes loading a substrate on a stage, controlling a surface temperature of an inkjet head and a substrate to be a setting temperature, and jetting the liquid crystal molecules on the substrate having the setting temperature.

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Номер записи: 52
17-10-2013 дата публикации

Nebulization structure with nozzle plate and nebulization apparatus thereof

Номер: US20130270358A1
Автор: mei-hui Huang, Shu-Pin Hsieh, Tun-Ying Fang, Yu-Ta Chen
Принадлежит: Microbase Technology Corp

A nebulization structure with a nozzle plate includes a nozzle plate and a driving element. The nozzle plate is composed of a polymer and a support plate, and the support plate includes a plurality of connecting portions and a through hole, and the polymer covers the support plate and has a plurality of penetrating holes corresponding to the through hole. The driving element is coupled to the nozzle plate through the connecting portions for producing a high-frequency vibration wave through a piezoelectric effect after power is supplied and driving the nozzle plate to vibrate and break up the molecular structure of a solution into a mist, so as to achieve the nebulization effect. The nebulization structure can be installed in a nebulization apparatus to achieve a high-efficiency nebulization effect by the nozzle plate and the driving element, so as to facilitate the manufacturing process and save costs.

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Номер записи: 53
17-10-2013 дата публикации

POWDER CUP SPRAY GUN AND SPRAY-COATING DEVICE COMPRISING A POWDER CUP SPRAY GUN

Номер: US20130270365A1
Автор: JUTERBOCK Karsten, LUTZ Gilbert, PLASCAR Pierre, SCHMID Rene, SCHWARZ Thomas
Принадлежит: J. WAGNER AG

At the rear end, the powder cup spray gun has an injector, a powder cup and a receptacle for the powder cup. The powder inlet of the injector is connected to the receptacle. The powder cup and the receptacle are designed in such a way that the powder cup can be fitted into the receptacle. In addition, a grip with a connection for conveying air, a connection for atomising air, and a connection for metering air is provided. The connection for the conveying air and the connection for the metering air are connected to the injector via lines running in the grip. 1. A powder cup spray gun , comprising:a housing at a rear end of which an injector with a powder inlet is included, anda powder cup and a receptacle for the powder cup,wherein the powder inlet of the injector is connected to the receptacle,wherein the powder cup and the receptacle are configured so that the powder cup can be fitted into the receptacle,wherein a grip for the housing is included with a connection for conveying air, a connection for atomising air and a connection for metering air, andwherein the connection for the conveying air and the connection for the metering air are connected to the injector via lines running in the grip.2. The powder cup spray gun according to claim 1 , wherein the housing is configured so that the injector can be unscrewed from the outside.3. The powder cup spray gun according to claim 1 , further comprising a ring seal in the receptacle for the powder cup.4. The powder cup spray gun according to claim 3 , further comprising a further ring seal is provided in the receptacle for the powder cup.5. The powder cup spray gun according to claim 1 , further comprising:a powder line, anda metering air duct, which discharges annularly into the powder line.6. The powder cup spray gun according to claim 1 ,wherein the injector includes a driving nozzle and a collector nozzle,wherein the driving nozzle has a driving nozzle duct, and the collector nozzle has a mixing tube portion, and{'b ...

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Номер записи: 54
17-10-2013 дата публикации

Multi-step process for fully coloured construction elements

Номер: US20130273329A1
Автор: Bart Louwagie, Patrick Goegebeur
Принадлежит: Deceuninck NV

A multiple step coating process is disclosed. The multiple step coating process is for coating a substrate construction element having side portions whereby at least three sides portions are coated. The process includes the steps of (A) advancing the element past a first coating station on its transport side for applying a surface layer onto one or more of the non transport side portions of the element and (B) subsequently advancing the element into further coating stations for applying a surface layer to the transport side of (A) and/or one or more of the remaining sides of the element.

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Номер записи: 55
24-10-2013 дата публикации

ELECTRONIC SPRAY DEVICE IMPROVEMENTS

Номер: US20130277446A1
Автор: Crichton Daniel, Selby Robert Gordon Maurice
Принадлежит: The Technology Partnership Plc.

An electronic spray device comprising a spray generator and a spray controller for providing a drive signal to the spray generator, wherein the spray generator includes a perforate membrane which vibrates ultrasonically in response to the drive signal, said vibration causing liquid droplets to be ejected from one side of the perforate membrane, wherein the spray controller is adapted to modulate the drive signal sent to the spray generator, wherein such modulation of the drive signal is arranged to set the mean power level supplied to the spray generator to a target level. 120-. (canceled)21. An electronic spray device comprising:a spray generator; anda spray controller for providing a drive signal to the spray generator;wherein the spray generator includes a perforate membrane which vibrates ultrasonically in response to the drive signal, said vibration causing liquid droplets to be ejected from one side of the perforate membrane;wherein the drive signal is time based modulated;wherein the liquid to air interface surface in the perforations is drawn back from the ejection side of the membrane during the time based modulation off periods.22. An electronic spray device according to claim 21 , wherein the liquid to air interface would move onto the ejection side of the membrane if the spray generator operated continuously.23. An electronic spray device according to claim 21 , wherein the overall period of the time based modulation is between 4 milliseconds and 32 milliseconds claim 21 , more ideally between 8 milliseconds and 16 milliseconds.24. An electronic spray device according to claim 21 , wherein the duty cycle is 50% or less claim 21 , more preferably 20% or less.25. An electronic spray device according to claim 21 , wherein a smoothing period exists when transitioning from the on to off and/or off to on periods claim 21 , the smoothing period being characterised by the voltage being at an intermediate level or levels between the off voltage and the on voltage ...

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Номер записи: 56
31-10-2013 дата публикации

Substrate Cleaning System Using Stabilized Fluid Solutions

Номер: US20130284217A1
Автор: de Larios John M., Freer Erik M., Korolik Mikhail, Mikhaylichenko Katrina, Ravkin Michael, Redeker Fred C.
Принадлежит:

A substrate cleaning systems are provided. One system includes a proximity head system for applying a meniscus to a surface of a substrate during a cleaning operation. Also provided is a container for holding the solution, the solution being mixed from at least a continuous medium, a polymer material, and a solid material, the polymer material in the solution imparting a finite yield stress to the material, such that the solution is maintained in a stable elastic gel form. A pump coupled to the container is also provided for moving the solution from the container to the proximity head system, where the pump applies at least a minimum shear stress on the solution. The pump provides agitation that exceeds the finite yield stress causing the solution to flow. A conduit is provided between the container and the proximity head system. 1. A substrate cleaning system , comprising:a proximity head system for applying a meniscus to a surface of a substrate during a cleaning operation, the meniscus being defined by a solution;a container holding the solution, the solution being mixed from at least a continuous medium, a polymer material, and a solid material, the polymer material in the solution imparting a finite yield stress to the material, such that the solution is maintained in a stable elastic gel form, the stable elastic gel form being configured to hold the solid material form in place and prevent the solid material from fluid flow in the solution if stresses less than the finite yield stress is imparted on the solid material after synthesis of the solution and during any storage of the solution;a pump for moving the solution from the container to the proximity head system, the pump applies at least a minimum shear stress on the solution, and the pump provides agitation that exceeds the finite yield stress causing the solution to flow;a head of the proximity head system receiving the solution that is configured to be applied to the surface of the substrate in the form ...

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Номер записи: 57
31-10-2013 дата публикации

SUBSTRATE PROCESSING APPARATUS AND METHOD OF SUPPLYING PROCESSING SOLUTION

Номер: US20130284367A1
Автор: CHOO YOUNG HO, KANG Byung Chul, Kang Byung Man, KIM Bong Joo
Принадлежит:

Provided is a substrate processing apparatus. The apparatus includes a processing chamber containing a substrate and processing the substrate by using a processing solution and a supplying unit supplying the processing solution to the processing chamber. The supplying unit includes a supply line through which the processing solution is supplied, a preliminary heater installed on the supply line and preliminary heating the processing solution, a main heater installed on the supply line at a lower stream of the preliminary heater and secondarily heating the processing solution, a first detour line connected to the supply line to detour to the preliminary heater and comprising a first valve, a second detour line connected to the supply line to detour the preliminary heater and the main heater or the main heater and comprising a second valve, and a controller controlling the first valve and the second valve. 1. A substrate processing apparatus comprising:a processing chamber containing a substrate and processing the substrate by using a processing solution; anda supplying unit supplying the processing solution to the processing chamber, a supply line through which the processing solution is supplied;', 'a preliminary heater installed on the supply line and preliminary heating the processing solution;', 'a main heater installed on the supply line at a lower stream of the preliminary heater and secondarily heating the processing solution;', 'a first detour line connected to the supply line to detour to the preliminary heater and comprising a first valve; and', 'a controller controlling the first valve., 'wherein the supplying unit comprises2. The apparatus of claim 1 , further comprising a second detour line connected to the supply line to detour to the preliminary heater and the main heater or the main heater and comprising a second valve controlled by the controller.3. The apparatus of claim 1 , further comprising a return line connected to the supply line to allow the ...

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Номер записи: 58
07-11-2013 дата публикации

Monitoring apparatus and method particularly useful in photolithographically processing substrates

Номер: US20130293872A1
Автор: Giora Dishon, Moshe Finarov, Yoel Cohen, Zvi Nirel
Принадлежит: Nova Measuring Instruments Ltd

Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.

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Номер записи: 59
14-11-2013 дата публикации

Mixing Apparatus for Mixing Bonding Adhesive at Die Bonder Before Dispense

Номер: US20130298827A1
Автор: Hsieh Eric, Jin Kevin, Yu Frank
Принадлежит: TEXAS INSTRUMENTS INCORPORATED

A moveable dispenser assembly including is shown. The dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier. An opening at an end of said dispenser dispenses the bonding adhesive onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. A one controller for sends a control signal that triggers moving of said moveable dispenser assembly for mixing said bonding adhesive before dispensing said volume of bonding adhesive onto said surface of said workpiece. The controller includes logic to control of movements such as oscillations to keep the bonding adhesive well mixed based on a comparing a parameter to be in a predetermined limit or range. 110-. (canceled)11. A die bonding apparatus , comprising:a moveable dispenser assembly including at least one dispenser having a reservoir for holding a bonding adhesive comprising particles and a fluid carrier, said dispenser for dispensing a volume of said bonding adhesive onto a surface of a workpiece in said bonding location;wherein movement of said moveable dispenser assembly provides mechanical agitation to said dispenser for mixing said bonding adhesive into a homogeneous mixture of said particles and said liquid carrier;an opening at an end of said dispenser for dispensing said bonding adhesive to said surface of said workpiece for attaching an integrated circuit (IC) die, andat least one controller for sending a control signal that triggers moving of said moveable dispenser assembly for mixing said bonding adhesive before dispensing said volume of bonding adhesive onto said surface of said workpiece, said controller including logic to control of movements such as oscillations to keep the bonding adhesive well mixed based on a comparing a parameter to be in a predetermined ...

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Номер записи: 60
28-11-2013 дата публикации

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

Номер: US20130312659A1
Автор: INATOMI Yuichiro
Принадлежит: TOKYO ELECTRON LIMITED

A solvent vapor is made to adhere efficiently to the surface of a resist pattern without using an ultraviolet irradiation process to improve processing accuracy, to reduce processing time and to suppress the diffusion of the solvent outside a substrate processing system. The surface of a resist pattern R formed on a semiconductor wafer W by an exposure process and a developing process is coated with water molecules m. A solvent vapor of a water-soluble solvent, such as NMP, is spouted on the surface of the resist pattern R coated with the water molecules m. A surface layer of the resist pattern R is swollen by the solvent vapor combined with the water molecules m to achieve a smoothing process. The water molecules m and the solvent s remaining on the resist pattern R on the wafer W after the smoothing process are removed by drying. 1. A substrate processing system for smoothing an irregular surface of a resist pattern formed on a surface of a substrate by an exposure process and a developing process , said substrate processing system comprising:a substrate holding table for holding a substrate thereon with the surface of the substrate facing up, the substrate holding table being provided with a cooling means for cooling the substrate;a water molecule spraying nozzle for spraying water molecules on a surface of the resist pattern on the substrate under a condition that the substrate is cooled by the cooling means;a solvent vapor spouting nozzle for spouting a solvent vapor of a water-soluble solvent onto the surface of the resist pattern on the substrate; anda drying means for removing the water molecules and the solvent adhering to the surface of the resist pattern.2. The substrate processing system according to claim 1 , wherein the drying means is a rotational driving mechanism for rotating the substrate holding table about a vertical axis.3. The substrate processing system according to claim 1 , wherein the drying means is a heating device provided with a hot ...

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Номер записи: 61
12-12-2013 дата публикации

Liquid-application device and liquid-application method

Номер: US20130330480A1
Автор: Masaru Nonomura, Seikou Abe
Принадлежит: Panasonic Corp

In the liquid application device 1 , when the magazine 5 for feeding the substrate installed in the substrate feed part is exchanged for a new magazine 5 for feeding the substrate, the magazine 5 for collecting the substrate is removed from the substrate collecting part R 2 , the magazine 5 for feeding the substrate that is installed in the substrate feed part R 1 so far is moved to the substrate collecting part R 2 as a subsequently used magazine 5 for collecting the substrate, and then, the new magazine 5 for feeding the substrate is installed in the substrate feed part R 1.

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Номер записи: 62
19-12-2013 дата публикации

LAMINAR FLOW DROPLET GENERATOR DEVICE AND METHODS OF USE

Номер: US20130334335A1
Автор: Germinario Louis Thomas, Hunter Charles Eric, Lynch Iyam, Wilkerson Jonathan Ryan
Принадлежит:

A piezoelectric ejector device is provided which is designed to minimize the intake of air into the device upon actuation by providing for laminar flow of the fluid. In an ejector mechanism that includes a generator plate and a piezoelectric actuator operable to directly or indirectly oscillate the generator plate, at a frequency to generate a directed stream of droplets of fluid, the generator plate includes a fluid facing surface, a droplet ejection surface, and a plurality of holes formed through its thickness between the surfaces. The plurality of holes are configured so as to minimize airflow through the plurality of openings from the droplet ejection surface to the fluid facing surface during generation of the directed stream of droplets by configuring the shape of the holes to minimize turbulence. 1. A device for generating a directed stream of droplets , the device comprising:a housing;a reservoir disposed within the housing for receiving a volume of fluid; andan ejector mechanism in fluid communication with the reservoir and configured to generate a directed stream of droplets of said fluid, the ejector mechanism comprising a generator plate and a piezoelectric actuator;wherein the generator plate includes a fluid facing surface, a droplet ejection surface, and a plurality of holes formed through its thickness between said surfaces;wherein the piezoelectric actuator is operable to directly or indirectly oscillate the generator plate, at a frequency to generate a directed stream of droplets of said fluid; andwherein the plurality of openings of the generator plate are configured so as to reduce airflow through the plurality of openings from the droplet ejection surface to the fluid facing surface during generation of the directed stream of droplets by configuring the holes to provide the fluid with laminar flow as it passes through the holes.2. The device of claim 1 , wherein the shape of each the plurality of holes is configured to have a gradual slope of ...

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Номер записи: 63
19-12-2013 дата публикации

Single scent engine arranged to produce a variable scent output

Номер: US20130334337A1
Автор: Joseph Slupsky, Tsafrir Sasson, Yossi Haran
Принадлежит: Scentcom Ltd

A scent producing apparatus, the apparatus constituted of: a single atomizer; a control circuitry; and a plurality of scent reservoirs each with a respective controllable release mechanism arranged to release a controlled quantity of the contents of the scent reservoir to the atomizer responsive to the control circuitry. Optionally, at least one solvent reservoir with a respective controllable release mechanism is further provided and arranged to release a controlled quantity of the contents of the at least one solvent reservoir to the single atomizer responsive to the control circuitry. Optionally, a neutralizing agent is provided thus enabling scent production with a pre-determined persistence.

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Номер записи: 64
19-12-2013 дата публикации

METHOD FOR PRODUCING AN APERTURE PLATE

Номер: US20130334338A1
Автор: HOGAN Brendan
Принадлежит: Stamford Devices Limited

A photo-resist () is applied in a pattern of vertical columns having the dimensions of holes or pores of the aperture plate to be produced. This mask pattern provides the apertures which define the aerosol particle size, having up to 2500 holes per square mm. There is electro-deposition of metal () into the spaces around the columns (). There is further application of a second photo-resist mask () of much larger (wider and taller) columns, encompassing the area of a number of first columns () The hole diameter in the second plating layer is chosen according to a desired flow rate. 1. A method of manufacturing an aperture plate wafer , the method comprising providing a mandrel of conductive material , applying a mask over the mandrel in a pattern of columns , electroplating the spaces around the columns , removing the mask to provide a wafer of the electroplated material with aerosol-forming holes where the mask columns were.2. The method as claimed in claim 1 , wherein the columns have a depth in the range of 5 μm to 40 μm claim 1 , and preferably 15 μm to 25 μm.3. The method as claimed in claim 1 , wherein the columns have a width dimension in the plane of the mandrel in the range of 1 μm to 10 μm claim 1 , preferably 2 μm to 6 μm.4. The method as claimed in claim 1 , wherein the electroplating is continued until the plated material is substantially flush with the tops of the columns.5. The method as claimed in claim 1 , wherein there is substantially no overlap between the plated material and the mask material.6. The method as claimed in claim 1 , wherein said masking and plating steps are followed by at least one subsequent second cycle of masking and plating to increase the wafer thickness.7. The method as claimed in claim 1 , wherein said masking and plating steps are followed by at least one subsequent second cycle of masking and plating to increase the wafer thickness; and wherein the subsequent plating step or steps bring the overall wafer thickness up to ...

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Номер записи: 65
19-12-2013 дата публикации

PHOTODEFINED APERTURE PLATE AND METHOD FOR PRODUCING THE SAME

Номер: US20130334339A1
Автор: Xu Hong
Принадлежит: STAMFORD DEVICES LTD.

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments. 1. A method for manufacturing an aperture plate , the method comprising:depositing a releasable seed layer above a substrate;applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern;electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask;applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity;electroplating a second material above the exposed portions of the first material and defined by the second mask;removing both masks; andetching the releasable seed layer to release the first material and the second material,wherein the first material and the second material form an aperture plate for use in aerosolizing a liquid.2. The method as recited in claim 1 , wherein the first patterned photolithography mask imparts apertures ...

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Номер записи: 66
19-12-2013 дата публикации

METHOD FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM

Номер: US20130337168A1
Автор: IWABUCHI Motoaki, OGIHARA Tsutomu, YOSHIHARA Takao
Принадлежит: SHIN-ETSU CHEMICAL CO., LTD.

The invention provides a method for forming a silicon-containing resist underlayer film, the method for coating and forming a silicon-containing resist underlayer film by spin coating method comprising: feeding an aqueous alkaline solution in a pipe of an apparatus for coating and forming a film by spin coating method to clean therein; supplying a silicon-containing resist underlayer film composition via the pipe; and coating the silicon-containing resist underlayer film on a substrate to form a film. There can be provided a method for forming a silicon-containing resist underlayer film capable of reducing coating defects after forming a film by cleaning and removing a precipitate derived from silicon-containing resist underlayer film composition that precipitates and adheres in a pipe of an apparatus for coating and forming a film. 1. A method for forming a silicon-containing resist underlayer film , the method for coating and forming a silicon-containing resist underlayer film by spin coating method comprising: feeding an aqueous alkaline solution in a pipe of an apparatus for coating and forming a film by spin coating method to clean therein; supplying a silicon-containing resist underlayer film composition via the pipe; and coating the silicon-containing resist underlayer film on a substrate to form a film.2. The method for forming a silicon-containing resist underlayer film according to claim 1 , wherein an aqueous tetraalkylammonium hydroxide solution is used as the aqueous alkaline solution. 1. Field of the InventionThe present invention relates to a method for forming a silicon-containing resist underlayer film by spin coating method.2. Description of the Related ArtIn LSIs, advanced integration and higher process speed have made growing demands for more micro pattern size. Lithography technology has achieved further fine patterning by introducing a shorter wavelength of a light source and a resist composition appropriately selected according thereto.Even in ...

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Номер записи: 67
23-01-2014 дата публикации

Substrate processing apparatus and substrate processing method

Номер: US20140022521A1
Автор: Koji Kaneyama, Masahiko Harumoto, Tadashi Miyagi, Yukihiko Inagaki
Принадлежит: Screen Semiconductor Solutions Co Ltd

An underlayer is formed to cover the upper surface of a substrate and a guide pattern is formed on the underlayer. A DSA film constituted by two types of polymers is formed in a region on the underlayer where the guide pattern is not formed. Thermal processing is performed while a solvent is supplied to the DSA film on the substrate. Thus, a microphase separation of the DSA film occurs. As a result, patterns made of the one polymer and patterns made of another polymer are formed. Exposure processing and development processing are performed in this order on the DSA film after the microphase separation such that the patterns made of another polymer are removed.

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Номер записи: 68
23-01-2014 дата публикации

Spectral reflectometry window heater

Номер: US20140024142A1
Автор: John Christopher Shriner, Kevin Wiederhold, Maja Imamovic
Принадлежит: Texas Instruments Inc

A plasma processing tool for fabricating a semiconductor device on a semiconductor wafer includes an optical window disposed on a plasma chamber, remotely from a plasma region. The window is thermally connected to an electrical heater element capable of maintaining the window at a temperature of at least 30° C. A heater controller provides electrical power to the heater element. During operation of the plasma processing tool, the heater controller provides power to the heater element so as to maintain the window at a temperature of at least 30° C. during at least a portion of a plasma process step in which by-products are produced in the plasma chamber.

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Номер записи: 69
06-02-2014 дата публикации

PROCESS LIQUID SUPPLY APPARATUS OPERATING METHOD, PROCESS LIQUID SUPPLY APPARATUS AND NON-TRANSITORY STORAGE MEDIUM

Номер: US20140034584A1
Автор: Adachi Kenji, MARUMOTO Hiroshi, TAKAYANAGI Koji
Принадлежит: TOKYO ELECTRON LIMITED

According to an embodiment of the present disclosure, a process liquid supply apparatus operating method is provided. The method includes filling a filter unit with a process liquid from an upstream side of the filter unit to a downstream side of the filter unit after newly mounting or replacing the filter unit and repeating a depressurization filtering process and a pressurization filtering process for a predetermined number of times. The depressurization filtering process depressurizes the process liquid in the downstream side of the filter unit and thereby allows the process liquid to permeate through the filter unit. The pressurization filtering process pressurizes the process liquid from the upstream side of the filter unit and thereby allows the process liquid to permeate through the filter unit. 1. A method of operating a process liquid supply apparatus , the process liquid supply apparatus including a filter unit , a discharge outlet for a gas in a process liquid , and a liquid sending unit which are provided in a flow passage located between a process liquid supply source and a nozzle in that order from an upstream side , the process liquid supply apparatus supplying the process liquid to target objects through the nozzle by the liquid sending unit , the method comprising:filling the filter unit with the process liquid from an upstream side of the filter unit to a downstream side of the filter unit after newly mounting or replacing the filter unit; andrepeating a depressurization filtering process and a pressurization filtering process for a predetermined number of times, the depressurization filtering process depressurizing the process liquid in the downstream side of the filter unit and thereby allowing the process liquid to permeate through the filter unit, the pressurization filtering process pressurizing the process liquid from the upstream side of the filter unit and thereby allowing the process liquid to permeate through the filter unit.2. The method ...

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Номер записи: 70
06-02-2014 дата публикации

METERING SYSTEM FOR HOT MELT ADHESIVES WITH VARIABLE ADHESIVE VOLUMES

Номер: US20140034682A1
Автор: McGUFFEY GRANT
Принадлежит: Illinois Tool Work Inc.

A hot melt adhesive material dispensing system comprises two separate and independent rotary, gear-type metering pumps, or two separate and independent sets of pumps, which are able to output precisely metered amounts of hot melt adhesive material. The hot melt adhesive materials discharged are able to be independently outputted through suitable output devices onto a substrate to result in different outputted volumes of the hot melt adhesive material in accordance with predeterminedly desired patterns, or at predeterminedly desired locations. The hot melt adhesive materials may also have their volumetric outputs combined such that the discharged or outputted volumes of the hot melt adhesive material onto the substrate may be, for example, twice the outputted volumes of the hot melt adhesive outputted onto the substrate from only one of the two pumps, or from only one of the two pumps. 1. A fluid dispensing system , comprising:a supply of fluid to be dispensed;an output device having at least one dispensing nozzle;at least two pumps for fluidically pumping fluid from said supply of fluid to said at least one dispensing nozzle; andvalve means interposed between said at least two pumps and said at least one dispensing nozzle for permitting said fluid dispensing system to dispense a varied volume of fluid through THREE dispensing states, a FIRST OFF state wherein said valve means is CLOSED with respect to both of said at least two pumps such that fluid outputs from both of said at least two pumps is prevented from reaching said at least one dispensing nozzle, a SECOND PARTIAL VOLUME state wherein said valve means is CLOSED with respect to a first one of said at least two pumps but OPENED with respect to a second one of said at least two pumps so as to permit the fluid output from said second one of said at least two pumps to reach said at least one dispensing nozzle, and a THIRD FULL VOLUME state wherein said valve means is OPENED with respect to both of said at least ...

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Номер записи: 71
13-02-2014 дата публикации

Substrate cleaning apparatus, substrate cleaning system, substrate cleaning method and memory medium

Номер: US20140041685A1
Автор: Itaru Kanno, Masami Yamashita, Miyako Kaneko, Satoru Shimura, Takehiko Orii
Принадлежит: Tokyo Electron Ltd

An apparatus for cleaning a substrate includes a cleaning chamber which accommodates a substrate inside the cleaning chamber, a treatment solution supply device which supplies a treatment solution having a volatile component and capable of solidifying or being cured to form a treatment film through vaporization of the volatile component, and a removal solution supply device which supplies a removal solution capable of removing the treatment film formed on a surface of the substrate. The treatment solution supply device supplies the treatment solution on the surface of the substrate set inside the cleaning chamber, and the removal solution supply device supplies the removal solution onto the treatment film formed on the surface of the substrate.

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Номер записи: 72
27-02-2014 дата публикации

SURFACE TREATING APPARATUS

Номер: US20140053774A1
Автор: HOTTA Teruyuki, ISHIZAKI Takahiro, UTSUMI Masayuki, YAMAMOTO Hisamitsu
Принадлежит: C. UYEMURA & CO., LTD.

A tank body includes a liquid receiving part for receiving processing solution Q applied to a plate-like work and a liquid retaining part for retaining liquids to be applied to the plate-like work and a liquid outflowing part for causing a flow of the processing solution Q which is spilled out of the liquid retaining part and traveled down toward the plate-like work wherein a tip of the liquid outflowing part is projected from a connecting part connecting to the liquid retaining part (or the liquid receiving part ). 1. A surface treating apparatus , comprising:a transport hanger for transporting a treatment object;a tank body for attaching processing solution to the treatment object which is transported by the transport hanger interiorly; anda transport mechanism for transporting the transport hanger into the tank body,wherein the tank body includes a liquid receiving part for receiving the processing solution applied to the treatment object and a liquid retaining part placed at a position higher than the liquid receiving part for retaining liquids to be applied to the treatment object and a liquid outflowing part for causing a flow of the processing solution which is spilled out. of the liquid retaining part and traveled down toward the treatment object, wherein a tip of the liquid outflowing part is projected from a connecting part connecting to the liquid retaining part or the liquid receiving part.2. The surface treating apparatus according to claim 1 , further comprising a guide rail for transporting the transport hanger in a nearly horizontal direction claim 1 , wherein the transport hanger is controlled by a control part so as to move back and forth a predetermined number of times on an impact generator arranged on the guide rail.3. The surface treating apparatus according to claim 1 , further comprising a guide rail for transporting the transport hanger in a nearly horizontal direction claim 1 , wherein the transport hanger is controlled by a control part so ...

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Номер записи: 73
27-02-2014 дата публикации

Method and apparatus for liquid treatment of wafer shaped articles

Номер: US20140054280A1
Автор: Christoph SEMMELROCK, Karl-Heinz Hohenwarter, Vijay BADAM
Принадлежит: LAM RESEARCH AG

In an apparatus and process for treating wafer-shaped articles, a spin chuck holds a wafer-shaped article in a predetermined orientation relative to an upper surface of the spin chuck. The apparatus includes a heating assembly having a housing that contains at least one infrared heating element. The heating assembly is mounted above an upper surface of the spin chuck and adjacent a wafer-shaped article when mounted on the spin chuck. The housing comprises a gas inlet connected to a gas supply, and at least one outlet for discharging gas from the housing.

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Номер записи: 74
27-02-2014 дата публикации

LEVER ARM SUSPENSION FOR USE IN AN ADHESIVE APPLICATION HEAD AND ADHESIVE APPLICATION HEAD WITH LEVER ARM SUSPENSION

Номер: US20140054331A1
Автор: Hümbelli Felix, Käppeli Christoph, Muller Heinz
Принадлежит: Robatech AG

An application head for dispensing a flowable medium includes a nozzle chamber in the application head and a nozzle needle movably mounted in the nozzle chamber. A supply channel and a supply line introduce the medium into the nozzle chamber. A drive moves the movable element. A lever arm is movably fastened to the nozzle needle and connected to the drive. The lever arm extends through a membrane of a membrane suspension connect the lever arm movably to the application head and form a seal to prevent escape of the flowable medium. Alternatively, a rocker suspension has a lever arm connectable to the movable element and the drive, a plate element has an opening through which the lever arm extends, a rocker mounting device connects the lever arm movably to the application head and a sealing device prevents any escape of adhesive from the chamber through the plate element opening. 1331331511515. Lever arm suspension ( , ) , which is designed for use in an adhesive application head ( , ) , wherein the application head () comprises:{'b': 10', '15, 'a chamber () in the interior of the application head (),'}{'b': 11', '111', '10, 'a movable element (, ), which is mounted movably in the interior of the chamber () and which releases an outlet opening through an opening movement (P),'}{'b': 20', '11', '111, 'a drive () for generating the opening movement (P) of the movable element (, ),'}{'b': 33', '133, 'wherein the lever arm suspension (, ) is configured according to one of variants (A) or (B){'b': '33', '(A) the lever arm suspension is a membrane suspension () with{'b': 30', '11', '20', '1', '11, 'a lever arm () which can be connected to the movable element () and the drive () in order to convert a drive-side movement (P) into the opening movement (P) of the movable element () and'}{'b': 34', '30, 'a membrane () which is operatively connected to the lever arm (),'}{'b': 33', '30', '15, 'wherein the membrane suspension () is designed to movably connect the lever arm () to ...

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Номер записи: 75
06-03-2014 дата публикации

METHOD AND APPARATUS FOR FORMING GATE STACK ON Si, SiGe or Ge CHANNELS

Номер: US20140065798A1
Автор: Ahmed Khaled Z., Hung Steven, Ramamurthy Sundar, Singh Kaushal K.
Принадлежит:

Provided are methods and apparatus for functionalizing a substrate surface used as the channel in a gate stack. Silicon, germanium and silicon germanium substrates surfaces are functionalized with one or more of sulfur and selenium by plasma processing. 1. A method of functionalizing a surface of a substrate , the method comprising exposing a clean surface of the substrate to a functionalizing element to form a functionalized substrate surface , the substrate selected from the group consisting of silicon , germanium and silicon germanium , and the functionalizing element selected from the group consisting of sulfur , selenium and mixtures thereof.2. The method of claim 1 , wherein the functionalizing element comprises sulfur.3. The method of claim 2 , wherein the sulfur is generated by a plasma of one or more of hydrogen sulfide and sulfur selenide.4. The method of claim 1 , wherein the functionalizing element comprises selenium.5. The method of claim 4 , wherein the selenium is generated by a plasma of one or more of hydrogen selenide and sulfur selenide.6. The method of claim 5 , wherein the plasma is pulsed.7. The method of claim 1 , further comprising exposing the substrate surface to an atomic hydrogen cleaning process to form the clean substrate surface.8. The method of claim 6 , wherein the clean substrate surface is exposed to the functionalizing element without exposure to oxygen.9. The method of claim 1 , further comprising forming a silicon dioxide film on the functionalized substrate surface.10. The method of claim 1 , further comprising forming a silicon film on the functionalized substrate surface.11. The method of claim 9 , further comprising forming a silicon dioxide film on the silicon film.12. A method of forming a gate stack on a surface of a substrate claim 9 , the method comprising:cleaning the surface of the substrate with an atomic hydrogen cleaning process to form a clean substrate surface;functionalizing the clean substrate surface with a ...

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Номер записи: 76
13-03-2014 дата публикации

Spin coating apparatus and method

Номер: US20140072709A1
Автор: Keisuke Nakazawa
Принадлежит: Toshiba Corp

In one embodiment, a spin coating apparatus includes a coating liquid feeding module to drop a coating liquid onto a substrate, and a motor to rotate the substrate. The module drops a first drop amount of the coating liquid onto the substrate at a first discharge rate, while the motor rotates the substrate at a first number of rotations. The module drops a second drop amount of the coating liquid onto the substrate at a second discharge rate larger than the first discharge rate, while the motor rotates the substrate at a second number of rotations smaller than the first number of rotations, after the first drop amount of the coating liquid is dropped. The module discharges the coating liquid onto the substrate at a third discharge rate smaller than the second discharge rate, after the coating liquid is discharged onto the substrate at the second discharge rate.

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Номер записи: 77
10-04-2014 дата публикации

METHOD FOR APPLYING AN IMAGE OF AN ELECTRICALLY CONDUCTIVE MATERIAL ONTO A RECORDING MEDIUM AND DEVICE FOR EJECTING DROPLETS OF AN ELECTRICALLY CONDUCTIVE FLUID

Номер: US20140099788A1
Автор: RASA Mircea V., SLOT Marcel
Принадлежит: OCE-TECHNOLOGIES B.V.

The invention relates to a method for applying an image of an electrically conductive material onto a recording medium. In the method, the recording medium is heated and the electrically conductive material is jetted onto the recording medium. The invention further relates to a device for ejecting droplets of an electrically conductive fluid onto a recording medium. 2. The method according to claim 1 , wherein in step b) the recording medium is heated using a laser.3. The method according to claim 1 , wherein the electrically conductive material is a metal or a semiconductor.4. The method according to claim 3 , wherein the electrically conductive material is selected from at least one of the group consisting of silver claim 3 , gold claim 3 , copper.5. The method according to claim 1 , wherein the electrically conductive material has a melting point of at least 300° C.6. The method according to claim 1 , wherein the recording medium is a silicon substrate.8. The device according to claim 7 , wherein the heating means for heating the recording medium comprises a laser.9. The device according to claim 7 , wherein the device further comprises a control unit configured to control the heating means for heating at least a part of the recording medium.10. The method according to claim 2 , wherein the electrically conductive material is a metal or a semiconductor.11. The method according to claim 10 , wherein the electrically conductive material is selected from at least one of the group consisting of silver claim 10 , gold claim 10 , copper.12. The method according to claim 2 , wherein the electrically conductive material has a melting point of at least 300° C.13. The method according to claim 3 , wherein the electrically conductive material has a melting point of at least 300° C.14. The method according to claim 4 , wherein the electrically conductive material has a melting point of at least 300° C.15. The method according to claim 10 , wherein the electrically conductive ...

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Номер записи: 78
06-01-2022 дата публикации

ADHESIVE DISPENSING SYSTEM WITH CONVERTIBLE NOZZLE ASSEMBLIES

Номер: US20220001415A1
Автор: Saine Joel E.
Принадлежит:

An adhesive dispensing system for applying liquid adhesive to a substrate using different nozzles with the same manifold is disclosed. The adhesive dispensing system includes a manifold having a body, a first clamp configured to engage the body of the manifold, a second clamp configured to engage the body of the manifold, and a nozzle. The first and second clamps secure the nozzle to the body of the manifold. The body of the manifold has a first contact surface that engages the first clamp and a second contact surface that engages the second clamp and the nozzle, where the second contact surface is angularly offset from the first contact surface. 1. A manifold for a liquid adhesive dispensing system , the manifold comprising:a body having a first contact surface that engages a first clamp and a second contact surface that engages a second clamp and a first nozzle, wherein said first and second clamps secure said first nozzle to said body of said manifold, and said second contact surface is angularly offset from said first contact surface.2. The manifold of claim 1 , wherein said body has a top surface claim 1 , a bottom surface opposite said top surface along a vertical direction claim 1 , a front surface claim 1 , and a back surface opposite said front surface along a longitudinal direction that is perpendicular to the vertical direction claim 1 , wherein said second contact surface is spaced from said bottom surface along the vertical direction.3. The manifold of claim 2 , wherein the body has a third contact surface that extends from said second contact surface to said bottom surface claim 2 , said third contact surface being angularly offset from said second contact surface.4. The manifold of claim 2 , wherein said front surface includes said first contact surface.5. The manifold of claim 1 , wherein said first contact surface defines at least one bore that is configured to receive at least one fastener claim 1 , wherein said at least one fastener secures said ...

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Номер записи: 79
07-01-2021 дата публикации

LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD

Номер: US20210001370A1
Автор: HORIGUCHI Ryoichi, ITAHASHI Takuya, NOBUKUNI Chikara, OJIMA Tomoaki, WAKAYAMA Shota
Принадлежит:

A liquid processing apparatus includes: a tank configured to store a processing liquid supplied from a processing liquid supply source; a circulation passage connected to the tank; a pump installed at the circulation passage; a plurality of liquid processors configured to perform liquid processing on a substrate; and a plurality of supply passages configured to supply the processing liquid to the plurality of liquid processors respectively, wherein the circulation passage includes a main passage portion provided with the pump, and a first branch passage portion and a second branch passage portion branching from the main passage portion, and the processing liquid flowing out from the tank passes through the main passage portion, then flows into the first branch passage portion and the second branch passage portion, and then returns to the tank through the first branch passage portion and the second branch passage portion. 1. A liquid processing apparatus comprising:a tank configured to store a processing liquid supplied from a processing liquid supply source;a circulation passage connected to the tank;a pump installed at the circulation passage;a plurality of liquid processors configured to perform liquid processing on a substrate; anda plurality of supply passages configured to supply the processing liquid to the plurality of liquid processors respectively,wherein the circulation passage includes a main passage portion provided with the pump, and a first branch passage portion and a second branch passage portion branching from the main passage portion, and the processing liquid flowing out from the tank passes through the main passage portion, then flows into the first branch passage portion and the second branch passage portion, and then returns to the tank through the first branch passage portion and the second branch passage portion,wherein the liquid processors are divided into a first processor group to which a portion of the liquid processors belong and a ...

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Номер записи: 80
07-01-2016 дата публикации

ATOMISATION APPARATUS USING SURFACE ACOUSTIC WAVE GENERATION

Номер: US20160001316A1
Автор: FRIEND James, QI Aisha, YEO Leslie
Принадлежит: RMIT UNIVERSITY

An apparatus for atomising liquid, including a piezoelectric substrate () having a working surface (), and a peripheral edge () extending along a side of the working surface, an interdigital transducer () located on the working surface for generating surface acoustic waves (SAW) in the working surface, and a liquid delivery arrangement including a porous member () for supplying the liquid to be atomised, wherein the porous member is in contact with the peripheral edge of the piezoelectric substrate. 1. An apparatus for atomising liquid , including a piezoelectric substrate having a working surface , and a peripheral edge extending along a side of the working surface , an interdigital transducer located on the working surface for generating surface acoustic waves (SAW) in the working surface , and a liquid delivery arrangement including a porous member for supplying the liquid to be atomised , wherein the porous member is in contact with the peripheral edge of the piezoelectric substrate.2. An apparatus for atomising liquid according to claim 1 , wherein the porous member is positioned relative to the upper edge such that an upper surface of the porous member is spaced a distance from the working surface equal to or less than the thickness of a boundary layer located adjacent the working surface within the liquid drawn from the porous member by the SAW.3. An apparatus for atomising liquid according to claim 1 , wherein the interdigital transducer is a DART-SPUDT.4. An apparatus for atomising liquid according to claim 1 , wherein the interdigital transducer has a thickness of at least 1% of the SAW wavelength.5. An apparatus for atomising liquid according to claim 4 , wherein the thickness of the interdigital transducer is between 1 to 5% of the SAW wavelength.6. A method of pulmonary delivery of biological substances using an apparatus as claimed in .7. A method of pulmonary delivery according to claim 6 , wherein the biological substance includes stem cells.8. A ...

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Номер записи: 81
07-01-2016 дата публикации

HIGH SPEED GRANUALE DELIVERY SYSTEM AND METHOD

Номер: US20160001319A1
Автор: Svec James A.
Принадлежит:

A high speed granule delivery system and method is disclosed for dispensing granules in intermittent patterns onto a moving asphalt coated strip in the manufacture of roofing shingles. The system includes a granule hopper and a rotationally indexable pocket wheel in the bottom of the hopper. A series of pockets are formed in the circumference of the wheel and the pockets are separated by raised lands. A seal on the bottom of the hopper seals against the raised lands as the wheel is indexed. In use, the pockets of the pocket wheel drive through and are filled with granules in the bottom of the hopper. As each pocket is indexed beyond the seal, it is exposed to the moving asphalt coated strip below and its granules fall onto the strip to be embedded in the hot tacky asphalt. The speed at which the wheel is indexed is coordinated with the speed of the asphalt coated strip so that granules and strip are moving at about the same forward speed or at a preselected ratio of speeds when the granules fall onto the strip. Well defined patterns of granules are possible at high production rates. 1. A shingle manufacturing system comprising:a conveyor for moving an asphalt coated strip in a downstream direction at a predetermined rate;a hopper disposed above the conveyor and defining an interior volume for receiving and containing granules to he dispensed to a moving asphalt coated strip below, the hopper having a lower end potion;a wheel having a periphery and being rotatably mounted at the lower end portion of the hopper;at least one depressed pocket and at least one raised land formed in the periphery of the wheel;the wheel being positioned such that rotation of the wheel causes the at least one depressed pocket to move repeatedly through a first position exposed to granules contained in the hopper and a second position exposed to an asphalt coated strip below the hopper; anda drive mechanism operatively coupled to the pocket wheel for rotating the pocket wheel according to ...

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Номер записи: 82
05-01-2017 дата публикации

SYSTEMS AND METHODS TO DISPENSE AND MIX REAGENTS

Номер: US20170001165A1
Автор: CRNOGORAC Filip, Li Bolan, McGall Glenn
Принадлежит:

The present disclosure provides methods, device, and system for wafer processing. The wafer processing apparatus uses lid dispenser to disperse at least one reagent to the surface of the wafer. Further, the wafer is positioned on top of a rotatable vacuum chuck configured to spread at least one reagent over the surface of the wafer via a centrifugal force or surface tension, thereby permitting the at least one reagent to react with an additional reagent. Further, when dispensing the at least one reagent, a separation gap between the lid dispenser and the wafer is at a predetermined distance, for example, from 50 μm to 2 mm. 1. A wafer processing apparatus comprising:a wafer conveyance robot configured to move a first wafer from a first position to a second position;a vacuum chuck at the second position, the vacuum chuck rotatably holding the first wafer;a lid dispenser at the second position, the lid dispenser aligned with the first wafer along a vertical axis;a nozzle provided by the lid dispenser and above the first wafer, the nozzle dispensing at least one reagent onto a surface of the first wafer;wherein the vacuum chuck is configured to rotate the first wafer to spread the at least one reagent over the surface of the first wafer by centrifugal force or surface tension, thereby permitting the at least one reagent to react with an additional reagent.2. The wafer processing apparatus of claim 1 , wherein when the at least one reagent is dispensed onto the surface of the first wafer claim 1 , a separation gap between the lid dispenser and the first wafer ranges from 50 μm to 2 mm.3. The wafer processing apparatus of further comprises a first wafer cassette at the first position claim 1 , the first wafer cassette being configured to hold at least one second wafer.4. The wafer processing apparatus of claim 3 , wherein the at least one second wafer includes the first wafer.5. The wafer processing apparatus of further comprises a second wafer cassette at a third ...

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Номер записи: 83
03-01-2019 дата публикации

AEROSOL GENERATOR DEVICE AND NEBULIZER SYSTEM WITH SUCH A DEVICE

Номер: US20190001366A1
Автор: Von Hollen Dirk Ernest
Принадлежит:

The present invention relates to aerosol generation. In order to provide an improved way of protecting and sealing of a vibrating element, an aerosol generator device () for a nebulizer is provided. The aerosol generator device comprises a base structure (), a mesh () with a plurality of apertures, and a vibrating element (). The vibrating element is a piezo-element arranged to generate an oscillating movement. The piezo-element is connected to the base structure to transfer the oscillating movement as vibrational movement to the base structure. Further, the mesh is mounted to the base structure, and the vibrational movement is transferred to the mesh in order to generate a plurality of small droplets to form an aerosol when supplied by a fluid. An encapsulation () of the piezo-element is provided to provide a sealing of the piezo-element. The encapsulation is provided as a three-dimensional casing structure rigidly connected to the base structure while leaving a distance space () between an inner side of the casing structure and the piezo-element. 1. An aerosol generator device for a nebulizer , the aerosol generator device comprising:a base structure;a mesh with a plurality of apertures; anda vibrating element;wherein the vibrating element is a piezo-element arranged to generate an oscillating movement;wherein the piezo-element is connected to the base structure to transfer the oscillating movement as vibrational movement to the base structure;wherein the mesh is mounted to or integrated as part of the base structure, and the vibrational movement is transferred to the mesh in order to generate a plurality of small droplets to form an aerosol;wherein an encapsulation of the piezo-element is provided to provide a sealing of the piezo-element;wherein the encapsulation is provided as a three-dimensional casing structure rigidly connected to the base structure while leaving a distance space between an inner side of the casing structure and the piezo-element.2. Aerosol ...

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Номер записи: 84
01-01-2015 дата публикации

Coating film forming apparatus, coating film forming method, and recording medium

Номер: US20150004311A1
Автор: Katsunori Ichino, Kousuke Yoshihara, Yuichi Terashita
Принадлежит: Tokyo Electron Ltd

A coating film forming apparatus includes: a substrate holding unit to horizontally hold a substrate; a rotating mechanism to rotate the substrate held by the substrate holding unit; a coating liquid supplying mechanism to supply coating liquid to form a coating film on the substrate; an annular member to rectify a gas stream above a periphery of the substrate when liquid film of the coating liquid is dried by rotation of the substrate, the annular member being provided above the periphery of the substrate and along a circumferential direction of the substrate so as to cover the periphery of the substrate; and a protrusion provided on an inner periphery of the annular member along circumferential direction of the annular member so as to protrude upward to reduce component of the gas stream flowing directly downward near an inner peripheral edge of the annular member.

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Номер записи: 85
01-01-2015 дата публикации

Dispensing apparatus and dispensing method

Номер: US20150004719A1
Автор: Jae-Seok Park, Yun-Mi Lee
Принадлежит: Samsung Display Co Ltd

A dispensing apparatus includes a dispensing unit having a main body, a channel through the main body, and a plurality of nozzles connected to the main body, the plurality of nozzles being configured to dispense fluid flowing in the channel, a gap sensor unit configured to determine size of gaps between adjacent nozzles in the dispensing unit, and a thermal expansion adjusting unit configured to thermally expand or contract the main body of the dispensing unit to adjust the gap size between adjacent nozzles to a predetermined size, based on the gap size determined by the gap sensor unit.

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Номер записи: 86
02-01-2020 дата публикации

Photolithography Method and Photolithography System

Номер: US20200003701A1
Автор: Cheng Wei Chang, Liao Chi-Hung
Принадлежит:

A photolithography method includes dispensing a first liquid onto a first target layer formed over a first wafer through a nozzle at a first distance from the first target layer; capturing an image of the first liquid on the first target layer; patterning the first target layer after capturing the image of the first liquid; comparing the captured image of the first liquid to a first reference image to generate a first comparison result; responsive to the first comparison result, positioning the nozzle and a second wafer such that the nozzle is at a second distance from a second target layer on the second wafer; dispensing a second liquid onto the second target layer formed over the second wafer through the nozzle at the second distance from the second target layer; and patterning the second target layer after dispensing the second liquid. 1. A photolithography method , comprising:dispensing a first liquid onto a first target layer formed over a first wafer through a nozzle at a first distance from the first target layer;capturing an image of the first liquid on the first target layer;patterning the first target layer after capturing the image of the first liquid;comparing the captured image of the first liquid to a first reference image to generate a first comparison result;responsive to the first comparison result, positioning the nozzle relative to a second wafer such that the nozzle is at a second distance from a second target layer on the second wafer wherein the second distance is different from the first distance;dispensing a second liquid onto the second target layer formed over the second wafer through the nozzle at the second distance from the second target layer; andpatterning the second target layer after dispensing the second liquid.2. The photolithography method of claim 1 , wherein capturing the image of the first liquid is performed during dispensing of the first liquid.3. (canceled)4. The photolithography method of claim 1 , further comprising:curing ...

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Номер записи: 87
03-01-2019 дата публикации

MODULATED RESONATOR GENERATING A SIMULATED FLAME

Номер: US20190003670A1
Автор: Angelotti Philip
Принадлежит:

An artificial flame apparatus produces a simulated flame using a plume of mist that is illuminated around, about, and through an artificial wick. A mist may be produced by a transducer, such as an ultrasonic transducer that is in contact with liquid from a liquid reservoir. The rate of mist exiting the housing may be modulated to produce a more realistic looking artificial flame. A light source is configured to illuminate the mist and/or the artificial wick. The artificial wick may be in the shape of a wick or flame and may include a light source. One or more light sources may be configured as the artificial wick. The light intensity, color and rate of change of light may be modulated to produce a more realistic looking artificial flame. A standing wave tube may vary the rate of mist exiting one or more enclosure openings in the tube enclosure. 1. An artificial flame apparatus comprising:a) a housing;b) a liquid reservoir within said housing and containing a liquid;c) an artificial wick extending from said housing; 'wherein said liquid from the liquid reservoir contacts the transducer surface to produce a mist;', 'd) a transducer having a transducer surface;'}e) a controller configured to generate a modulation signal, wherein the modulation signal is configured to drive the transducer to create said mist from said liquid in contact with the transducer surface;f) a housing opening in the housing that is proximal to the artificial wick; wherein said mist exits the housing through said housing opening and around said artificial wick; 'wherein the illuminated mist appears as an artificial flame.', 'g) a light source configured to illuminate said mist exiting the housing;'}2. The artificial flame apparatus of claim 1 , wherein the artificial wick comprises said light source.3. The artificial flame apparatus of claim 2 , wherein the artificial wick comprises a fiber optic light source.4. The artificial flame apparatus of claim 2 , wherein the artificial wick comprises a ...

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Номер записи: 88
07-01-2021 дата публикации

Injection device, semiconductor testing system and its testing method

Номер: US20210003550A1
Автор: Bo-Lung Chen, Wen-Yuan Hsu
Принадлежит: Hermes Testing Solutions Inc

An injection device is disclosed herein. The injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a base, a reservoir, a first testing pipe, a cleaning pipe and a liquid-draining pipe. The reservoir set on the base is provided with at least one connecting port and a dropping port, wherein the dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to at least one connecting port, wherein a first liquid is injected from the first testing pipe into the reservoir, and wherein the a cleaning liquid is injected from the cleaning pipe into the reservoir to clean the reservoir and the test area. The dropping port is utilized to drain off the first testing liquid and the cleaning liquid in the reservoir. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.

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Номер записи: 89
13-01-2022 дата публикации

MASK ASSEMBLY, MASK MANUFACTURED USING THE SAME, AND METHOD OF MANUFACTURING DISPLAY PANEL

Номер: US20220010421A1
Автор: IM SUNGSOON, Jo Junho, MOON MINHO, MOON YOUNGMIN, SONG SEUNGYONG
Принадлежит:

A mask assembly includes a mask frame through which a plurality of openings is defined and a plurality of cell masks disposed to respectively correspond to the cell openings. Each of the cell masks includes a mask main body substantially parallel to a plane defined by a first direction and a second direction crossing the first direction, where a plurality of holes is defined through the mask main body, a bonding portion disposed along an edge of the mask main body, and a tensile portion extending from the bonding portion and disposed spaced apart from the mask main body. The tensile portion includes first tensile portions spaced apart from each other in the first direction and disposed at opposite sides of the mask main body and second tensile portions spaced apart from each other in the second direction and disposed at opposite sides of the mask main body. 1. A mask assembly comprising:a mask frame through which a plurality of cell openings is defined; anda plurality of cell masks disposed to respectively correspond to the cell openings, a mask main body substantially parallel to a plane defined by a first direction and a second direction crossing the first direction, wherein a plurality of holes is defined through the mask main body;', 'a bonding portion disposed along an edge of the mask main body; and', 'a tensile portion extending from the bonding portion and disposed spaced apart from the mask main body,', first tensile portions spaced apart from each other in the first direction and disposed at opposite sides of the mask main body; and', 'second tensile portions spaced apart from each other in the second direction and disposed at opposite sides of the mask main body., 'wherein the tensile portion comprises], 'wherein each of the cell masks comprises2. The mask assembly of claim 1 , whereinthe first tensile portions comprise first and second side tensile portions disposed at the opposite sides of the mask main body, which face each other in the first direction ...

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Номер записи: 90
02-01-2020 дата публикации

Dispensing Nozzle Design and Dispensing Method Thereof

Номер: US20200004153A1
Автор: Cheng Wei Chang, Liao Chi-Hung
Принадлежит:

An apparatus for dispensing fluid includes a fluid source; a nozzle having an inner layer and an outer layer, the inner layer defining a bore in fluid communication with the fluid source; and a plurality of pins each moveable to be in physical contact with the outer layer, wherein the plurality of pins is operable to apply a force towards the outer layer to adjust a cross-section of the bore. 1. An apparatus for dispensing fluid , comprising:a fluid source;a nozzle having an inner layer and an outer layer, the inner layer defining a bore in fluid communication with the fluid source; anda plurality of pins each moveable to be in physical contact with the outer layer, wherein the plurality of pins is operable to apply a force towards the outer layer to adjust a cross-section of the bore.2. The apparatus of claim 1 , wherein each of the plurality of pins is moveable in a direction perpendicular to a longitudinal axis of the bore.3. The apparatus of claim 1 , wherein each of the plurality of pins is movable by applying a gaseous pressure.4. The apparatus of claim 1 , wherein the inner and outer layers are made of elastic material.5. The apparatus of claim 4 , wherein the elastic material of the inner layer is more rigid than that of the outer layer.6. The apparatus of claim 1 , wherein the inner and outer layers form a cavity that can be inflated by pumping in gas.7. The apparatus of claim 1 , wherein the cross-section of the bore is adjustable to vary in shapes.8. The apparatus of claim 7 , wherein the shapes are selected from triangle claim 7 , rectangle claim 7 , square claim 7 , circle claim 7 , oval claim 7 , and polygon.9. The apparatus of claim 1 , wherein the cross-section of the bore is adjustable to vary in cross-sectional areas along a longitudinal axis of the bore.10. The apparatus of claim 1 , further comprising:a gas outlet nozzle in a proximity region of an orifice of the nozzle, wherein the gas outlet nozzle is operable to increase an ambient pressure in ...

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Номер записи: 91
03-01-2019 дата публикации

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Номер: US20190004427A1
Автор: ASAI Masaya, HARUMOTO Masahiko, KANEYAMA Koji, Tanaka Yuji
Принадлежит:

A substrate processing apparatus includes a spin chuck that holds a substrate, a processing liquid supply unit that supplies a first processing liquid having first specific gravity and a second processing liquid having second specific gravity smaller than the first specific gravity to a surface to be processed of the substrate held by the spin chuck, a collection tank that stores the used first and second processing liquids that have been supplied to the substrate, and a processing liquid separating mechanism that separates the first processing liquid and the second processing liquid based on specific gravity, the first and second processing liquids being stored in the collection tank. 1. A substrate processing apparatus comprising:a substrate holder that holds a substrate;a processing liquid supply unit that supplies a first processing liquid having first specific gravity and a second processing liquid having second specific gravity smaller than the first specific gravity to a surface to be processed of the substrate held by the substrate holder;a storage that stores the used first and second processing liquids that have been supplied to the substrate; anda processing liquid separating mechanism that separates the first processing liquid and the second processing liquid based on specific gravity, the first and second processing liquids being stored in the storage.2. The substrate processing apparatus according to claim 1 , whereinthe processing liquid separating mechanism includesa first discharge pipe provided to discharge the used first processing liquid from the storage,a second discharge pipe provided to discharge the used second processing liquid from the storage,a first discharge valve inserted into the first discharge pipe,a boundary surface detector that detects a boundary surface between the first processing liquid and the second processing liquid that are stored in the storage, anda controller that acquires the boundary surface detected by the boundary ...

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Номер записи: 92
05-01-2017 дата публикации

Substrate processing method and recording medium

Номер: US20170004993A1
Автор: Keiichi Tanaka
Принадлежит: Tokyo Electron Ltd

Electric charging of a substrate caused by a friction between a fluid and a surface of the substrate being rotated can be suppressed. At least a part of a surface insulating layer (thermal oxide film) on a peripheral portion of a substrate W is removed, and an underlayer (silicon wafer) having higher conductivity than a material of the surface insulating layer is exposed. Then, a process is performed on the substrate while holding and rotating the substrate by a substrate holding device. Here, at least a portion of the substrate holding device which comes into contact with the underlayer is made of a conductive material. In performing the process on the substrate, an electric charge generated in the surface insulating layer of the substrate is removed via the underlayer and the substrate holding device.

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Номер записи: 93
04-01-2018 дата публикации

SUBSTRATE TREATING APPARATUS

Номер: US20180005849A1
Автор: CHOI Jungbong, HEO CHAN YOUNG, HEO Pil Kyun, Kang Byung Man, LEE Ji-hwan
Принадлежит:

Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a spin head, a support shaft connected to a lower portion of the spin head to support the spin head, a pin located on an upper surface of the spin head to support the substrate and having a space in the interior thereof, and a nozzle member configured to supply a liquid to the substrate located on the spin head. 1. A substrate treating apparatus comprising:a spin head;a support shaft connected to a lower portion of the spin head to support the spin head;a pin located on an upper surface of the spin head to support the substrate and having a space in the interior thereof; anda nozzle member configured to supply a liquid to the substrate located on the spin head.2. The substrate treating apparatus of claim 1 , wherein the space formed in the interior of the pin extends to a lower end of the pin.3. The substrate treating apparatus of claim 1 , wherein the space formed in the interior of the pin is vacuumed.4. The substrate treating apparatus of claim 1 , wherein the pin comprises:a support pin configured to support a bottom surface of the substrate; anda chucking pin configured to support a side surface of the substrate.5. The substrate treating apparatus of claim 4 , wherein a thickness claim 4 , between the space and an outer surface of the chucking pin claim 4 , of a part of the chucking pin claim 4 , which faces a part which faces the substrate is larger than a thickness of a part of the chucking pin claim 4 , which contacts the substrate.6. The substrate treating apparatus of claim 4 , wherein the chucking pin has a reinforcement part protruding outwards at a part of the chucking pin claim 4 , which faces a part which faces the substrate.7. The substrate treating apparatus of claim 4 , wherein a communication part configured to provide a path along which the liquid applied to the substrate flows to an outside is formed at an upper end of the chucking pin.8. The substrate ...

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Номер записи: 94
07-01-2021 дата публикации

APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

Номер: US20210005470A1
Автор: Jung Jinwoo, LEE Yong Hee, LEE Young Hun, LIM Eui Sang
Принадлежит:

Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber. 1. A method for processing a substrate , the method comprising:a liquid processing step for performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber;a transfer step for transferring the substrate from the liquid processing chamber to a drying chamber; anda drying step for drying the substrate in the drying chamber,wherein in the transfer step, a height of the processing liquid remaining on an edge region of the substrate is higher than a height of the processing liquid remaining on a central region of the substrate.2. The method of claim 1 , wherein the liquid processing step comprises:a liquid supply step for rotating the substrate and supplying the processing liquid toward the substrate, anda liquid level adjustment step for stopping supplying the processing liquid and rotating the substrate after the liquid supply step.3. The method of claim 2 , wherein in the liquid level adjustment step claim 2 , a liquid level of the processing liquid on the substrate is controlled such that a height of the processing liquid on ...

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Номер записи: 95
02-01-2020 дата публикации

Materials and Methods for Forming Resist Bottom Layer

Номер: US20200006048A1
Автор: Chang Ching-Yu, CHANG Shang-Wern, Huang Jing Hong, Wang Chien-Wei
Принадлежит:

A method includes forming a bottom layer over a semiconductor substrate, where the bottom layer includes a polymer bonded to a first cross-linker and a second cross-linker, the first cross-linker being configured to be activated by ultraviolet (UV) radiation and the second cross-linker being configured to be activated by heat at a first temperature. The method then proceeds to exposing the bottom layer to a UV source to activate the first cross-linker, resulting in an exposed bottom layer, where the exposing activates the first cross-linker. The method further includes baking the exposed bottom layer, where the baking activates the second cross-linker. 1. A method comprising:forming a bottom layer over a semiconductor substrate, wherein the bottom layer includes a polymer bonded to a first cross-linker and a second cross-linker, wherein the first cross-linker is configured to be activated by ultraviolet (UV) radiation, and wherein the second cross-linker is configured to be activated by heat at a first temperature;exposing the bottom layer to a UV source, resulting in an exposed bottom layer, wherein the exposing activates the first cross-linker; andbaking the exposed bottom layer, wherein the baking activates the second cross-linker.2. The method of claim 1 , wherein the first cross-linker includes HC═CH—R— claim 1 , and wherein R includes —(C═O)— claim 1 , —(C═O)—O— claim 1 , —CH═CH— claim 1 , phenyl claim 1 , phenol claim 1 , or combinations thereof.3. The method of claim 1 , wherein the second cross-linker includes phenyl claim 1 , alkyl-substituted phenyl claim 1 , epoxy claim 1 , hydroxyl claim 1 , ether claim 1 , ester claim 1 , novolac claim 1 , or combinations thereof.4. The method of claim 1 , wherein the baking is a first baking process claim 1 , further comprising performing a second baking process to the bottom layer before the exposing of the bottom layer claim 1 , the second baking process being configured to smooth a top surface of the bottom layer.5 ...

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Номер записи: 96
02-01-2020 дата публикации

COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVICE, COMPONENT MOUNTING METHOD, AND RESIN SHAPING METHOD

Номер: US20200006099A1
Автор: Yamauchi Akira
Принадлежит: BONDTECH CO., LTD.

A chip mounting system () includes: a chip supplying unit () for supplying a chip (CP); a stage () for holding a substrate (WT) in an orientation in which a mounting face (WTf) for mounting the chip (CP) faces vertically downward (−Z direction); a head (H) for holding the chip (CP) from the vertically downward direction (−Z direction); and a head drive unit () for, by causing vertically upward (+Z direction) movement of the head (H) holding the chip (CP), causes the head (H) to approach the stage () to mount the chip (CP) on the mounting face (WTf) of the substrate (WT). 1. A component mounting system for mounting a component on a substrate , the mounting system comprising:a component supplying unit configured to supply the component;a substrate holding unit configured to hold the substrate in an orientation such that a mounting face for mounting the component on the substrate is facing vertically downward;a head configured to hold the component from vertically below; anda head drive unit that, by causing vertically upward movement of the head holding the component, causes the head to approach the substrate holding unit to mount the component on the mounting face of the substrate.2. The component mounting system according to claim 1 , wherein the component supplying unit comprises (i) a sheet holding unit configured to hold a dicing substrate such that a sheet is positioned vertically upward of the dicing substrate claim 1 , the dicing substrate being the substrate diced and attached to the sheet claim 1 , and (ii) a picking mechanism configured to the component included in the dicing substrate by pick out vertically downward from vertically above the sheet.3. The component mounting system according to claim 1 , wherein the component mounting system further comprises a component conveying unit configured to convey the component supplied from the component supplying unit to a receiving position for the head to receive the component.4. The component mounting system ...

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Номер записи: 97
12-01-2017 дата публикации

NOZZLE, APPLICATION DEVICE, AND METHOD OF APPLYING FLUID

Номер: US20170008023A1
Автор: Suhara Nobuhisa, WAKIZAWA Hideaki
Принадлежит: HEISHIN Ltd.

The purpose of the present invention is to provide a nozzle and an application apparatus which can obtain sufficient application quality even when fluid with high viscosity is applied, and a method of applying the fluid thereof. The nozzle includes a discharging means having a wide discharge port that is opened so that the fluid is dischargeable in a belt shape to be applied to an application object, and a cutting means for cutting the fluid discharged from the discharge port. In the nozzle, the cutting means is cuttable of the fluid by a wire that is movable from one side to the other side of an opening area that constitutes the discharge port. 1. A nozzle , comprising:a discharging unit having a wide discharge port that is opened so that fluid is dischargeable in a belt shape to be applied to an application object; anda cutting unit for cutting the fluid discharged from the discharge port,wherein the cutting unit is cuttable of the fluid by a wire that is movable from one side to the other side of an opening area that constitutes the discharge port.2. A nozzle , comprising:a discharging unit having a wide discharge port that is opened so that fluid is dischargeable in a belt shape to be applied to an application object;a fixing unit for fixing the fluid to the application object by blowing compressed gas to the fluid discharged from the discharging unit toward the application object; anda cutting unit for cutting the fluid discharged from the discharge port.3. The nozzle according to claim 2 , wherein the cutting unit is cuttable of the fluid by a wire that is movable from one side to the other side of an opening area that constitutes the discharge port.4. The nozzle according to claim 3 , wherein the wire is oriented in short-side directions of the opening area that constitutes the discharge port claim 3 , and is cuttable of the fluid by moving from one side to the other side in a long-side direction.5. The nozzle according to claim 2 , wherein the cutting unit ...

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Номер записи: 98
20-01-2022 дата публикации

Protective component forming apparatus

Номер: US20220020607A1
Автор: Makoto Saito, Yoshikuni MIGIYAMA, Yoshinori KAKINUMA
Принадлежит: Disco Corp

A protective component forming apparatus includes a chuck table, a resin supply unit having a pump and a pipe that supply a liquid resin from a tank to a resin sheet held by the chuck table, a pressing unit that presses a workpiece against the liquid resin supplied to the resin sheet held by the chuck table, a curing unit that irradiates the liquid resin pressed by the pressing unit with ultraviolet and cures the liquid resin, a resin inspecting part that senses the viscosity of the liquid resin, and an informing unit.

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Номер записи: 99
14-01-2016 дата публикации

CHEMICAL LIQUID DISCHARGE MECHANISM, LIQUID PROCESSING APPARATUS, CHEMICAL LIQUID DISCHARGE METHOD, AND STORAGE MEDIUM

Номер: US20160008840A1
Автор: Hamada Masahito, Inada Hiroichi, Sasagawa Norihiko
Принадлежит:

Disclosed is a chemical liquid discharge mechanism. The mechanism includes: a storage portion including a chemical liquid storage space; a diluent supply port opened to supply a diluent for reducing a viscosity of the chemical liquid to the storage space; a vertex flow forming portion that forms vortex flows in the diluent and the chemical liquid by supplying a fluid to the storage space to stir the diluent and the chemical liquid; and a liquid discharge port opened to an upper side of the diluent supply port in the storage space such that, by the supply of the diluent, the diluent and the chemical liquid flow into the liquid discharge port to be discharged from the storage space. Thus, the viscosity of the waste liquid discharged from the liquid discharge port may be reduced, and thus, it is not necessary to largely set the inclination of the liquid discharge path. 1. A chemical liquid discharge mechanism comprising:a storage portion including a storage space where a chemical liquid is stored;a diluent supply port opened so as to supply a diluent for reducing a viscosity of the chemical liquid to the storage space;a vertex flow forming portion configured to form vortex flows in the diluent and the chemical liquid by supplying a fluid to the storage space so as to stir the diluent and the chemical liquid; anda liquid discharge port opened to an upper side of the diluent supply port in the storage space such that, by the supply of the diluent after stirring of the diluent and the chemical liquid is terminated, the diluent and the chemical liquid flow into the liquid discharge port to be discharged from the storage space.2. The chemical liquid discharge mechanism of claim 1 , wherein the storage space has a circular shape in plan view claim 1 , andthe vortex flow forming portion is configured by the diluent supply port that supplies the diluent in a tangential direction of the storage space in plan view.3. The chemical liquid discharge mechanism of claim 2 , wherein ...

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Номер записи: 100