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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 8994. Отображено 100.
16-08-1996 дата публикации

СТАНОК ДЛЯ УКАТКИ ОГРАНОЧНЫХ ДИСКОВ

Номер: RU0000002534U1

1. Станок для укатки ограночных дисков, содержащий станину со столешней и верхней и нижней траверсами, установленные на траверсах пиноли механизма зажатия ограночного диска, привод вращения ограночного диска, укаточную головку, размещенную на столешне с возможностью радиального перемещения и несущую баллас, снабженный приводом вращения и механизмом вертикального перемещения, отличающийся тем, что одна из пинолей механизма зажатия ограночного диска выполнена в виде пневмоцилиндра, а на столешне с возможностью радиального перемещения размещена вторая укаточная головка с балласом, снабженным приводом вращения, при этом механизмы вертикального перемещения балласов обеих головок выполнены в виде пневмоцилиндров, связанных с пневмопультом задания давления воздуха по программе с пульта управления. 2. Станок по п.1, отличающийся тем, что привод вращения ограночного диска включает электродвигатель, связанный клиноременной передачей с ограночным диском, и снабжен механизмом снятия-надевания ремня. 3. Станок по п.1, отличающийся тем, что привод вращения ограночного диска снабжен тормозом. (19) RU (11) (13) 2 534 U1 (51) МПК B24B 57/00 (1995.01) РОССИЙСКОЕ АГЕНТСТВО ПО ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К СВИДЕТЕЛЬСТВУ (21), (22) Заявка: 95102868/20, 27.02.1995 (46) Опубликовано: 16.08.1996 (71) Заявитель(и): Винницкий завод "Кристалл" (UA), Vinnitskij zavod "Kristall" (UA) 2 5 3 4 R U (57) Формула полезной модели 1. Станок для укатки ограночных дисков, содержащий станину со столешней и верхней и нижней траверсами, установленные на траверсах пиноли механизма зажатия ограночного диска, привод вращения ограночного диска, укаточную головку, размещенную на столешне с возможностью радиального перемещения и несущую баллас, снабженный приводом вращения и механизмом вертикального перемещения, отличающийся тем, что одна из пинолей механизма зажатия ограночного диска выполнена в виде пневмоцилиндра, а на столешне с возможностью радиального перемещения размещена ...

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10-10-2005 дата публикации

ЦЕНТРИФУГА ДЛЯ РАЗДЕЛЕНИЯ БИОЛОГИЧЕСКОЙ ЖИДКОСТИ

Номер: RU0000048296U1

Центрифуга для разделения биологической жидкости, преимущественно крови, включающая ротор с размещаемой в нем одноразового применения камерой разделения, выполненной из полимерного материала в виде пустотелого прямоугольного профиля разомкнутого кольца, и вертюг-блок коаксиального типа, обеспечивающий соединение каналов трубопроводов вращающейся камеры разделения с каналами неподвижных магистралей экстракорпорального контура, отличающаяся тем, что трубопровод подачи крови из вертюг-блока в камеру разделения одним концом сопряжен по форме и размерам с круглым сечением канала трудопровода подачи крови из вертюг-блока, а другим - с прямоугольным сечением канала камеры разделения. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 48 296 (13) U1 (51) МПК B24B 55/03 (2000.01) B24B 57/00 (2000.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21), (22) Заявка: 2004129053/22 , 29.09.2004 (24) Дата начала отсчета срока действия патента: 29.09.2004 (45) Опубликовано: 10.10.2005 (73) Патентообладатель(и): Арзамасский филиал Нижегородского государственного технического университета (АФНГТУ) (RU) U 1 4 8 2 9 6 R U Ñòðàíèöà: 1 U 1 Формула полезной модели Центрифуга для разделения биологической жидкости, преимущественно крови, включающая ротор с размещаемой в нем одноразового применения камерой разделения, выполненной из полимерного материала в виде пустотелого прямоугольного профиля разомкнутого кольца, и вертюг-блок коаксиального типа, обеспечивающий соединение каналов трубопроводов вращающейся камеры разделения с каналами неподвижных магистралей экстракорпорального контура, отличающаяся тем, что трубопровод подачи крови из вертюг-блока в камеру разделения одним концом сопряжен по форме и размерам с круглым сечением канала трудопровода подачи крови из вертюг-блока, а другим - с прямоугольным сечением канала камеры разделения. 4 8 2 9 6 (54) ЦЕНТРИФУГА ДЛЯ РАЗДЕЛЕНИЯ БИОЛОГИЧЕСКОЙ ЖИДКОСТИ R U Адрес для переписки: 607220 ...

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10-06-2006 дата публикации

ШЛИФОВАЛЬНЫЙ КРУГ

Номер: RU0000053961U1

1. Шлифовальный круг, состоящий из корпуса тарельчатой формы, являющегося упругим элементом, к которому через массивное кольцо, присоединена плоская металлическая пружина с закрепленными на ней шлифовальными сегментами, которые образуют прерывистый режущий слой, отличающийся тем, что массивное кольцо выполнено из ферромагнитного материала. 2. Шлифовальный круг по п.1, отличающийся тем, что внутри корпуса закреплен электромагнитный силовой элемент. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 53 961 (13) U1 (51) МПК B24B 55/03 B24B 57/00 (2006.01) (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21), (22) Заявка: 2005113399/22 , 03.05.2005 (24) Дата начала отсчета срока действия патента: 03.05.2005 (45) Опубликовано: 10.06.2006 (73) Патентообладатель(и): Арзамасский политехнический институт (филиал) Нижегородского государственного технического университета (RU) U 1 5 3 9 6 1 R U Ñòðàíèöà: 1 U 1 Формула полезной модели 1. Шлифовальный круг, состоящий из корпуса тарельчатой формы, являющегося упругим элементом, к которому через массивное кольцо, присоединена плоская металлическая пружина с закрепленными на ней шлифовальными сегментами, которые образуют прерывистый режущий слой, отличающийся тем, что массивное кольцо выполнено из ферромагнитного материала. 2. Шлифовальный круг по п.1, отличающийся тем, что внутри корпуса закреплен электромагнитный силовой элемент. 5 3 9 6 1 (54) ШЛИФОВАЛЬНЫЙ КРУГ R U Адрес для переписки: 607227, Нижегородская обл., г. Арзамас, ул. Калинина, 15, кв.49, Д.А. Игнатьеву (72) Автор(ы): Пучков Вячеслав Павлович (RU), Сорокин Виталий Матвеевич (RU), Глебов Владимир Владимирович (RU), Игнатьев Дмитрий Анатольевич (RU) U 1 U 1 5 3 9 6 1 5 3 9 6 1 R U R U Ñòðàíèöà: 2 RU 5 10 15 20 25 30 35 40 45 50 53 961 U1 Полезная модель относится к области механической обработки и может быть использована в конструкциях виброустойчивых сборных шлифовальных кругов, применяемых при торцовом ...

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27-07-2006 дата публикации

НЕПРЕРЫВНО-ПРОТОЧНАЯ ВЕРТИКАЛЬНАЯ ЦЕНТРИФУГА ДЛЯ РАЗДЕЛЕНИЯ НЕОДНОРОДНОЙ ЖИДКОЙ СИСТЕМЫ

Номер: RU0000054853U1

1. Непрерывно-проточная вертикальная центрифуга для разделения жидкости (неоднородной жидкой системы - НЖС) на составные фракции, включающая ротор с закрепленной в нем камерой разделения, выполненной в виде пустотелого прямоугольного профиля разомкнутого кольца с патрубком ввода разделяемой жидкости на одном концевом его сечении и с патрубками вывода разделенных фракций на другом, отличающаяся тем, что центрифуга содержит жестко закрепленную на верхнем торце вала ротора промежуточную емкость, соединенную трубопроводом с камерой разделения, а также содержит неподвижно закрепленные на основании центрифуги расположенные ниже ротора внешне коаксиально ему промежуточные цилиндрические приемники, свободно (неконтактно) сопряженные своими кольцевыми входами с механически прочными жесткими трубопроводами вывода фракций из вращающейся камеры разделения. 2. Непрерывно-проточная центрифуга по п.1, отличающаяся тем, что промежуточная емкость 5 жестко связана с неподвижным корпусом 8 центрифуги и сообщается с камерой 2 посредством патрубка 9, который жестко закреплен на роторе 1 концентрично его оси вращения и сопряжен с корпусом 8 через самоустанавливающий радиальный с соответствующим уплотнительным устройством подшипник 10, кроме того, для поддержания уровня НЖС в камере 5 она снабжена клапаном 11 с поплавком. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 54 853 (13) U1 (51) МПК B24B 55/03 B24B 57/00 (2006.01) (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21), (22) Заявка: 2004129054/22 , 29.09.2004 (24) Дата начала отсчета срока действия патента: 29.09.2004 (45) Опубликовано: 27.07.2006 (73) Патентообладатель(и): Арзамасский филиал Нижегородского государственного технического университета (АФНГТУ) (RU) R U (54) НЕПРЕРЫВНО-ПРОТОЧНАЯ ВЕРТИКАЛЬНАЯ ЦЕНТРИФУГА ДЛЯ РАЗДЕЛЕНИЯ НЕОДНОРОДНОЙ ЖИДКОЙ СИСТЕМЫ 5 4 8 5 3 5 4 8 5 3 Формула полезной модели 1. Непрерывно-проточная вертикальная центрифуга для разделения ...

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27-11-2015 дата публикации

УСТАНОВКА ДЛЯ КЛАССИФИКАЦИИ ЗЕРЕН АБРАЗИВНОГО МАТЕРИЛА

Номер: RU0000157317U1

РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 157 317 U1 (51) МПК B24B 57/00 (2006.01) B03B 9/00 (2006.01) B03B 5/32 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ (21)(22) Заявка: ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ 2015121355/03, 05.06.2015 (24) Дата начала отсчета срока действия патента: 05.06.2015 (45) Опубликовано: 27.11.2015 Бюл. № 33 R U 1 5 7 3 1 7 Формула полезной модели Установка для классификации зерен абразивного материла, включающая в себя перемешивающее устройство, ротор, приемные лотки и насос, отличающаяся тем, что рабочее колесо насоса и ротор закрепляются на одном валу и приводятся во вращение одним двигателем, а подача жидкости к насосу осуществляется через воронку, являющуюся основанием для размещения приемных лотков. Стр.: 1 U 1 U 1 (54) УСТАНОВКА ДЛЯ КЛАССИФИКАЦИИ ЗЕРЕН АБРАЗИВНОГО МАТЕРИЛА 1 5 7 3 1 7 Адрес для переписки: 603950, обл. Нижегородская, г. Нижний Новгород, ул. Минина, д. 24, НГТУ, ОТТиИС (73) Патентообладатель(и): федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Нижегородский государственный технический университет им. Р.Е. Алексеева" (НГТУ) (RU) R U Приоритет(ы): (22) Дата подачи заявки: 05.06.2015 (72) Автор(ы): Шурыгин Алексей Юрьевич (RU), Глебов Владимир Владимирович (RU), Курненков Антон Валерьевич (RU), Курненков Даниял Надырович (RU) U 1 U 1 1 5 7 3 1 7 1 5 7 3 1 7 R U R U Стр.: 2 RU 5 10 15 20 25 30 35 40 45 157 317 U1 Установка для классификации зерен абразивного материала Полезная модель относится к области очистки смазочно-охлаждающих жидкостей (СОЖ), рекуперации и классификации зерен абразивного материла и может быть использована в составе шлифовального оборудования при обработке материалов, в частности хрупких неметаллических, алмазными или эльборовыми инструментами. Известна станция подачи СОЖ [1], в которую входит устройство для рекуперации и классификации абразивных зерен из СОЖ [2], состоящее из ротора и приемника для сбора фракций. Недостатком ...

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11-08-2021 дата публикации

Сепаратор плоских пластин прямоугольной формы для их двухсторонней обработки на плоскодоводочном станке

Номер: RU0000205870U1

Полезная модель относится к абразивной обработке и может быть использована в шлифовании и полировании плоских пластин прямоугольной формы на плоскодоводочных станках для двусторонней доводки поверхностей пластин абразивом. Техническим результатом является обеспечение повышения плоскопараллельности обработанных поверхностей плоских пластин прямоугольной формы при их двухсторонней доводке на плоскодоводочном станке. Для этого предлагается сепаратор с гнездами некруглой конфигурации для плоских пластин прямоугольной формы с размерами длины-ширины w и h, а именно: гнезда в сепараторе имеют форму отверстия шестиугольника, образованного последовательным чередованием через одну трех сторон размером а и трех сторон размером b, которые связаны с размерами длины-ширины w и h обрабатываемой пластины следующими соотношениями: а=w+0,5…1,5 мм; b=h+0,5…1,5 мм (прим.: толщина пластины в расчетах не участвует. В общем случае а≠b, w≠h). Зазоры (или ход) 0,5…1,5 мм нужны для облегчения перекатывания пластины по сторонам шестиугольного отверстия. Благодаря такой форме и размерам гнезд сепаратора, пластины при обработке могут перекатываться по сторонам своих гнезд в процессе абразивной доводки. При вращении притиров и сепаратора под действием сил трения пластина многократно совершает полный оборот вокруг оси, перпендикулярной обрабатываемым поверхностям пластины, по гнезду за шесть переориентирований по шести сторонам гнезда. Тем самым обеспечивается вращение пластины в сепараторе и это существенно снижает неравномерность абразивного удаления с нее материала, обусловленную некруглостью ее формы, и тем самым повышает плоскопараллельность обработанных поверхностей пластин прямоугольной формы при их двухсторонней абразивной доводке на плоскодоводочном станке. 4 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 205 870 U1 (51) МПК B24B 37/04 (2012.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК B24B 37/04 (2021.05) (21)(22) Заявка: ...

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15-03-2012 дата публикации

Method of polishing object to be polished and polishing pad

Номер: US20120064803A1
Принадлежит: NGK Insulators Ltd

The present invention provides: a method of polishing an object to be polished for processing a surface of the object to be polished into a concave or convex state with a high degree of accuracy; and a polishing pad. An object to be polished 20 is placed on a polishing pad 10 over the boundary between the first polishing region 11 and the second polishing region 12 , the first polishing region 11 has grooves and the second polishing region 12 has grooves different from those of the first polishing region 11 , and either one of the two regions being formed on a region on the center side, and the other on the outer side in a radial direction on the surface of the polishing pad; and the object to be polished 20 is polished by rotating the polishing pad 10 and the object to be polished 20.

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15-03-2012 дата публикации

Finisher with on-board loading and unloading mechanism

Номер: US20120064804A1
Принадлежит: Hammond Machinery Inc

A finisher arrangement for surface finishing of parts, including a bowl-type centrifugal finishing device for agitating a mixture of parts and treating media within the bowl, and a handler for loading and unloading the parts/media to and from the bowl, respectively. The finishing device and handler are positioned sidewardly adjacent but on opposite sides of a rotary drive unit which defines a transfer horizontal drive axis. Arm linkages couple each of the finishing device and handler to the drive unit so that each is independently vertically swingable about the drive axis into respective loading and unloading positions.

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19-04-2012 дата публикации

Cmp polishing liquid and polishing method

Номер: US20120094491A1
Принадлежит: Hitachi Chemical Co Ltd

The invention relates to a CMP polishing liquid comprising a medium and silica particles as an abrasive grain dispersed into the medium, characterized in that: (A1) the silica particles have a silanol group density of 5.0/nm 2 or less; (B1) a biaxial average primary particle diameter when arbitrary 20 silica particles are selected from an image obtained by scanning electron microscope observation is 25 to 55 nm; and (C1) an association degree of the silica particles is 1.1 or more. The invention provides a CMP polishing liquid which has the high barrier film polishing speed, the favorable abrasive grain dispersion stability, and the high interlayer dielectric polishing speed, and a polishing method producing semiconductor substrates or the like, that have excellent microfabrication, thin film formation, dimension accuracy, electric property and high reliability with low cost.

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10-05-2012 дата публикации

Chemical-mechanical polishing wafer and method of use

Номер: US20120115398A1
Автор: James Bopp
Принадлежит: Individual

The present invention is directed to systems and methods for assisting personnel in discerning which side of a dummy wafer has been polished more and for differentiating one side of a dummy wafer from the other. In a preferred embodiment, dummy wafers include a first plurality of depth indicia on a first surface and a second plurality of depth indicia on a second opposing surface. In one embodiment, each of the depth indicia of the first plurality of depth indicia extends a depth into the dummy wafer beyond the first surface, and each of the depth indicia of the second plurality of depth indicia extends a depth into the dummy wafer beyond the second surface. Other embodiments include depth indicia of the first plurality of depth indicia located at depths beyond the first surface that each have a corresponding depth indicia in the second plurality of depth indicia located at a substantially similar depth beyond the second surface. In other embodiments, each of the depth indicia of the first and second pluralities of depth indicia are located at different depths.

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28-06-2012 дата публикации

Method and apparatus for measurement and control of magnetic particle concentration in a magnetorheological fluid

Номер: US20120164916A1
Принадлежит: QED Technologies International Inc

A system for sensing and controlling concentration of magnetic particles in magnetorheological fluid comprising a wire coil and an AC voltage generator that, when energized, creates a magnetic flux field including a fringing field. When the fringing field extends through the magnetorheological fluid, the impedance in the circuit is proportional to the concentration of magnetic particles. A reference wire coil identical to the sensing wire coil is connected therewith. A demodulator is connected to each of the coils sends an impedance difference signal to a feedback controller connected to controllable dispensing apparatus for adding a calculated amount of replenishing fluid to the magnetorheological fluid. The system may be incorporated into an integrated fluid management module having apparatus for receiving and replenishing spent magnetorheological fluid and a sensor system in accordance with the present invention for use in a magnetorheological finishing system having a carrier wheel.

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02-08-2012 дата публикации

Polishing pad and method of fabricating semiconductor device

Номер: US20120196512A1
Автор: Tetsuya Shirasu
Принадлежит: Fujitsu Semiconductor Ltd

A polishing pad includes a first pad portion and a second pad portion disposed therearound, and each of the first and second pad portions is replaced individually. A CMP apparatus with the polishing pad (first and second pad portions) attached thereto conducts polishing of a semiconductor wafer. The second pad portion is replaced with a replacement second pad portion when the total polishing time reaches a predetermined period of time.

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23-08-2012 дата публикации

Slurry Concentration System and Method

Номер: US20120211418A1

A system and method for concentrating a slurry is disclosed. A preferred embodiment comprises a filter that is used to filter a slurry into a concentrate and a permeate. A portion of the permeate is used in a backflow operation of the filter once a pressure differential of 0.8 bar is obtained from the filter inlet to the permeate outlet of the filter.

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30-08-2012 дата публикации

Method and device for the injection of cmp slurry

Номер: US20120220206A1
Принадлежит: Araca Inc

Disclosed is an apparatus for injecting slurry onto the polishing pad surface of a chemical mechanical polishing (CMP) tool. The disclosed apparatus includes a rectilinear shaped injector bottom, where multiple slots are created in the top surface of the injector bottom, allowing the injector bottom to flex and to conform to the polishing pad profile. CMP slurry or components thereof are introduced through one or more top surface openings, travel through the injector body, and exit through a slit or bottom surface opening. The slurry is spread into a thin film by the injector, and is introduced at the gap between the surface of the polishing pad and the wafer, along the leading edge of the wafer, in quantities small enough that all or most of the slurry is introduced between the wafer and the polishing pad.

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27-09-2012 дата публикации

Polishing method and polishing system

Номер: US20120244785A1

A polishing method and a polishing system are provided. By means of adjusting a rotational center of a polishing article corresponding to positions of a polishing pad or polishing pads, a polishing rate of the polishing article surface has a better uniformity, resulted from compensation of polishing rates at the rotational center of the polishing article.

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08-11-2012 дата публикации

Method and apparatus for multiple cutoff machining of rare earth magnet block, cutting fluid feed nozzle, and magnet block securing jig

Номер: US20120282847A1
Принадлежит: Shin Etsu Chemical Co Ltd

In a method for multiple cutoff machining a rare earth magnet block, a cutting fluid feed nozzle having a plurality of slits is combined with a plurality of cutoff abrasive blades coaxially mounted on a rotating shaft, each said blade comprising a base disk and a peripheral cutting part. The slits in the feed nozzle into which the outer peripheral portions of cutoff abrasive blades are inserted serve to restrict any axial run-out of the cutoff abrasive blades during rotation. Cutting fluid is fed from the feed nozzle through slits to the rotating cutoff abrasive blades and eventually to points of cutoff machining on the magnet block.

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08-11-2012 дата публикации

Method and apparatus for multiple cutoff machining of rare earth magnet block, cutting fluid feed nozzle, and magnet block securing jig

Номер: US20120282848A1
Принадлежит: Shin Etsu Chemical Co Ltd

In a method for multiple cutoff machining a rare earth magnet block, a cutting fluid feed nozzle having a plurality of slits is combined with a plurality of cutoff abrasive blades coaxially mounted on a rotating shaft, each said blade comprising a base disk and a peripheral cutting part. The slits in the feed nozzle into which the outer peripheral portions of cutoff abrasive blades are inserted serve to restrict any axial run-out of the cutoff abrasive blades during rotation. Cutting fluid is fed from the feed nozzle through slits to the rotating cutoff abrasive blades and eventually to points of cutoff machining on the magnet block.

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13-12-2012 дата публикации

Device and Method for Measuring Physical Parameters of Slurry and Chemical Mechanical Polishing Apparatus Comprising the Device

Номер: US20120315826A1
Принадлежит: TSINGHUA UNIVERSITY

The present disclosure discloses a device for measuring physical parameters of a slurry used in a chemical mechanical polishing apparatus and measuring method using the same. The chemical mechanical polishing apparatus comprises a polishing head, a rotary table, a polishing platen and a polishing pad having a through-hole. The device for measuring physical parameters of slurry comprises: a sensor disposed in the polishing platen and adapted to contacted the slurry via the through-hole of the polishing pad for measuring the physical parameters of the slurry; a converter disposed in the rotary table and coupled to the sensor for converting a measuring signal of the sensor into a standard electrical signal; and a processing unit coupled to the converter for acquiring the standard electrical signal to calculate physical parameters of the slurry. According to the device for measuring the physical parameters of the slurry of an embodiment of the present disclosure, the physical parameters of slurry between the polishing head and the polishing pad may be in-suit measured and obtained. The present disclosure further discloses a chemical mechanical polishing apparatus having the device for measuring the physical parameters of the slurry.

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20-12-2012 дата публикации

Apparatus for chemical mechanical polishing

Номер: US20120322345A1
Принадлежит: Applied Materials Inc

Embodiments of the invention generally relate to systems and methods to CMP substrates. The systems generally include a polishing system that has a polishing module and cleaning module. Each of the polishing module and the cleaning module can be partitioned into independently operable sections. Each section of the polishing module includes a platen, at least one load cup, and at least one polishing head. Each section of the cleaning module includes a cleaning station and one or more robots adapted to advance substrates through the cleaning station. The methods generally include polishing a plurality of substrates in a polishing system having independently operable sections. During the polishing of the substrates in one section, a second of the independently operable stations may be maintained or cleaned.

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24-01-2013 дата публикации

Waxing device

Номер: US20130019800A1
Принадлежит: Hon Hai Precision Industry Co Ltd

A waxing device is used for applying a waxing treatment to a polishing wheel, and includes a supporting assembly, an adjusting assembly, a driving mechanism, a mounting assembly, a motor, a wax block and a resisting mechanism. The supporting assembly includes a sliding rail, and the adjusting assembly is slidably positioned on the sliding rail; the driving mechanism is mounted on the adjusting assembly; the mounting assembly includes a mounting member positioned on the driving mechanism; the motor is mounted on mounting member; the wax block is positioned on the motor and rotated by the motor; the resisting mechanism is positioned on the supporting assembly and resists the adjusting assembly for adjusting a pressure applied to the polishing wheel during the waxing process.

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28-03-2013 дата публикации

System, method and apparatus for enhanced cleaning and polishing of magnetic recording disk

Номер: US20130078890A1

Cleaning or polishing magnetic recording media (MRM) may comprise mounting and rotating the MRM on a spindle; circulating a tape adjacent to a surface of the MRM; and applying an electrostatic (ES) voltage to the tape and attracting particles located on the MRM to the tape. The ES voltage may apply an ES load to the tape to force the tape into contact with the surface of the MRM. No mechanical load may be applied to the tape to force the tape into contact with the surface of the MRM. Additionally, a mechanical load may be applied to the tape to force the tape into contact with the surface of the MRM.

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23-05-2013 дата публикации

Polishing agent and polishing method

Номер: US20130130595A1
Автор: Yuiko YOSHIDA
Принадлежит: Asahi Glass Co Ltd

The present invention relates to a polishing agent for polishing a surface to be polished of an object to be polished, the polishing agent including: first silicon oxide fine particles having an average primary particle size of 5 to 20 nm; second silicon oxide fine particles having an average primary particle size of 40 to 110 nm; and water, in which a ratio of the first silicon oxide fine particles to a total amount of the first silicon oxide fine particles and the second silicon oxide fine particles is from 0.7 to 30% by mass.

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23-05-2013 дата публикации

CHEMICAL MECHANICAL POLISHING MACHINE AND CHEMICAL MECHANICAL POLISHING APPARATUS COMPRISING THE SAME

Номер: US20130130601A1
Принадлежит:

A chemical-mechanical polishing machine includes a work table, polishing platen mounted onto the work table, pad conditioner and slurry-delivery device mounted on the work table and disposed near the polishing platen, and polishing-head support mounted on the work table and including a base plate and supporting side plates. The base plate is formed with a groove in a “thickness” direction. A loading and unloading table is mounted on the work table, disposed below the base plate, and opposed to the polishing platen. A polishing head is rotatably disposed on the polishing-head support, movable in the longitudinal direction, and passes through the groove to extend downwardly. A robotic manipulator is disposed near the work table for placing a wafer on the loading and unloading table and taking the wafer away from it. A chemical-mechanical polishing apparatus includes an array of a plurality of the machine. 1. A chemical-mechanical polishing machine comprising:a work table;a polishing platen mounted onto an upper surface of said work table;a pad conditioner and slurry-delivery device that are mounted on said upper surface of said work table and disposed near said polishing platen;a polishing-head support mounted on said upper surface of said work table and including a substantially horizontal base plate and plurality of supporting side plates, said horizontal base plate being formed with a groove penetrating therethrough in a substantially “thickness” direction thereof, said groove being open at a first longitudinal end of said horizontal base plate and extending toward a second longitudinal end of said horizontal base plate, said supporting side plates being connected to said horizontal base plate and disposed at corresponding sides of said groove in a substantially transverse direction of said horizontal base plate for supporting said horizontal base plate, and said first longitudinal end of said horizontal base plate being extended beyond said supporting side plates ...

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01-08-2013 дата публикации

SUBSTRATE HOLDER, POLISHING APPARATUS, AND POLISHING METHOD

Номер: US20130196573A1
Принадлежит: EBARA CORPORATION

The substrate holder is a device for holding a substrate and pressing it against a polishing pad. The substrate holder includes: an inner retaining ring vertically movable independently of the top ring body and arranged around the substrate; an inner pressing mechanism to press the inner retaining ring against the polishing surface of the polishing pad; an outer retaining ring to vertically movable independently of the inner retaining ring and the top ring body; an outer pressing mechanism to press the outer retaining ring against the polishing surface; and a supporting mechanism to receive a lateral force applied to the inner retaining ring from the substrate during polishing of the substrate and to tiltably support the outer retaining ring. 1. A substrate holder , comprising:a top ring body configured to hold a flexible membrane for pressing a substrate against a polishing surface;an inner retaining ring configured to be vertically movable independently of said top ring body and arranged so as to surround the substrate;an inner pressing mechanism configured to press said inner retaining ring against the polishing surface;an outer retaining ring arranged radially outwardly of said inner retaining ring and configured to vertically movable independently of said inner retaining ring and said top ring body;an outer pressing mechanism configured to press said outer retaining ring against the polishing surface; anda supporting mechanism configured to receive a lateral force applied to said inner retaining ring from the substrate during polishing of the substrate and to tiltably support said outer retaining ring.2. The substrate holder according to claim 1 , wherein said supporting mechanism comprises a spherical bearing.3. The substrate holder according to claim 1 , wherein said inner pressing mechanism and said outer pressing mechanism are configured to be able to press said inner retaining ring and said outer retaining ring against the polishing surface independently ...

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29-08-2013 дата публикации

Manufacturing method of a slider and manufacturing apparatus thereof

Номер: US20130219699A1
Принадлежит: SAE Magnetics HK Ltd

A manufacturing method of a slider includes steps of: (a) providing a row bar with a plurality of slider elements connecting together; (b) lapping surfaces of the row bar so as to obtain a predetermined requirement; (c) lowering the temperature of the surfaces lapped in the step (b) before and/or during lapping; and (d) cutting the row bar into a plurality of sliders. The present invention can prevent a local high temperature generated on the magnetic head during lapping so that the performance of the magnetic head is improved.

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29-08-2013 дата публикации

DEVICE FOR SUPPLYING SLURRY FOR SEMICONDUCTOR, PROVIDED WITH PIPE CLOGGING PREVENTION MEANS

Номер: US20130225053A1
Принадлежит: C&C HI TECH CO., LTD.

Disclosed is a device for supplying slurry for semiconductor in a polishing process when the semiconductor is manufactured. The slurry supply apparatus includes: a storage tank in which the slurry is stored; a plurality of pressure vessels connected to the storage tank, respectively, for receiving the slurry from the storage tank and discharging the slurry to the outside; an aspiration unit connected to the pressure vessels, for generating a vacuum pressure in the pressure vessels; and a centrifugal separation unit installed in a connection line of the aspiration unit between the pressure vessels and the aspiration unit, for separating foreign substances contained in the introduced compressed air from the compressed air by using a centrifugal force. 1. A device for supplying slurry for semiconductor in a polishing process when the semiconductor is manufactured , the device comprising:a storage tank in which the slurry is stored;a plurality of pressure vessels connected to the storage tank, respectively, for receiving the slurry from the storage tank and discharging the slurry to the outside;an aspiration unit connected to the pressure vessels, for generating a vacuum pressure in the pressure vessels; anda centrifugal separation unit installed in a connection line of the aspiration unit between the pressure vessels and the aspiration unit, for separating foreign substances contained in the introduced compressed air from the compressed air by using a centrifugal force.2. The device of claim 1 , wherein the centrifugal separation unit corresponds to a cylindrical tubular body in which a suction port connected to the pressure vessels is formed on a side surface thereof and an exhaust port is formed perpendicular to the suction port such that the compressed air introduced into the suction port forms vortices in the tubular body to separate heavy slurry from the compressed air by using a centrifugal force.3. The device of claim 2 , wherein the tubular body is formed such ...

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17-10-2013 дата публикации

Method of manufacturing semiconductor device

Номер: US20130273817A1
Принадлежит: Toshiba Corp

According to one embodiment, the method of manufacturing a semiconductor device includes contacting a film formed on a semiconductor substrate with a rotating polishing pad which is supported on a turntable, and feeding polishing foam to a region of the polishing pad with which the film is contacted, thereby polishing the film. The polishing foam is obtained by turning the aqueous dispersion into a foamy body. The aqueous dispersion includes 0.01-20% by mass of abrasive grain and 0.01-1% by mass of foam forming and retaining agent, all based on a total mass of the aqueous dispersion.

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14-11-2013 дата публикации

Method for Recovering Abrasive Material Component from used Abrasive Material Slurry, and Cerium Oxide Recovered through Method

Номер: US20130298476A1
Принадлежит:

Provided is a method for recovering an abrasive material component from used slurry having cerium oxide as the principle component of the abrasive material therein, the abrasive component recovery method being one in which post-recovery treatment of the abrasive agent and waste liquid is easy. Also provided is cerium oxide recovered through the novel recovery method. A method for recovering an abrasive material component from used abrasive slurry containing cerium oxide in the abrasive material thereof is characterized in that the abrasive material component is recovered by: adding a magnesium salt to the used abrasive slurry; coagulating the abrasive material component and causing the sale to sediment from the abrasive slurry, which contains the abrasive material component and components derived from the material subjected to abrasion; and separating the solids and liquids. 1. A method for recovering an abrasive component from a used slurry of an abrasive , the abrasive including cerium oxide , the method comprising:adding a magnesium salt to the used slurry of the abrasive;aggregating and precipitating the abrasive component from the used slurry of the abrasive including the abrasive component and a component derived from a polished object;separating a solid component from a liquid component; andrecovering the abrasive component.2. The method for recovering the abrasive component from the used slurry of the abrasive of claim 1 , whereinthe magnesium salt is magnesium chloride or magnesium sulfate.3. The method for recovering the abrasive component from the used slurry of the abrasive of claim 1 , whereinin the adding the magnesium salt to the used slurry of the abrasive, the magnesium salt is added to the used slurry of the abrasive so that a concentration of the magnesium salt in the used slurry of the abrasive ranges from 5 to 26 mmol/L.4. Cerium oxide recovered by the method for recovering the abrasive component from the used slurry of the abrasive of . The ...

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19-12-2013 дата публикации

ABRASIVE RECOVERY METHOD AND ABRASIVE RECOVERY DEVICE

Номер: US20130333299A1
Принадлежит: NOMURA MICRO SCIENCE CO., LTD.

There is provided an abrasive recovery device and an abrasive recovery method capable of recovering a slurry which is condensed until a concentration of its abrasive becomes high while suppressing an increase in pressure loss and a great decrease in a recovery ratio ascribable to membrane clogging. The abrasive recovery device is a device which recovers an abrasive from a used polishing slurry which has been used in a CMP process, the device including a separation membrane having a cylindrical hole passage to which the used polishing slurry is led, wherein an effective filtration part of the hole passage of the separation membrane has a 0.8 m length or less, and the abrasive recovery device condenses the used polishing slurry until a concentration of the abrasive becomes 10 mass % or more. 1. An abrasive recovery device , comprising;a first separation membrane having a first cylindrical hole passage to lead a used polishing slurry in a CMP process, the first cylindrical hole passage having a first effective filtration part,a second separation membrane provided on a subsequent stage of the first separation membrane,the second separation membrane having a second cylindrical hole passage to lead a condensate from the first separation membrane,the second cylindrical hole passage having a second effective filtration part shorter than the first effective filtration part in length,the second effective filtration part being not longer than 0.8 m,circulation mechanism configured to pass the condensate from the first separation membrane through the second separation membrane sequentially and condense the used polishing slurry until a concentration of the abrasive becomes 10 mass % or more and recover an abrasive from the used polishing slurry.2. The abrasive recovery device according to claim 1 ,wherein at least one of hollow portions of the first separation membrane and the second separation membrane is passed through by the used polishing slurry in a cross-flow method.3. ...

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26-12-2013 дата публикации

Polishing composition, method for fabricating thereof and method of chemical mechanical polishing using the same

Номер: US20130344777A1

Provided are a polishing composition for chemical mechanical polishing, a method of preparing the polishing composition, and a chemical mechanical polishing method using the polishing composition. The polishing composition which is a water-based polishing composition for planarizing a metal compound thin film including two or more metal elements includes nano-diamond particles as a polishing material and poly(sodium 4-styrenesulfonate) as a dispersion stabilizer for the nano-diamond particles in the polishing composition. Since the nano-diamond particles in the polishing composition have hydrophobic surfaces and poly(sodium 4-styrenesulfonate) effectively stabilizes the nano-diamond particles to prevent the nano-diamond particles from aggregating, excellent polishing characteristics for the metal compound thin film may be obtained due to the nano-diamond particles which have a nano size, high hardness, and excellent dispersibility.

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09-01-2014 дата публикации

METHOD AND DEVICE FOR THE INJECTION OF CMP SLURRY

Номер: US20140011432A1
Принадлежит: Araca, Inc.

In a certain embodiment, the invention comprises an apparatus for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising an injector the leading edge of which possess bays, depressions or notches that capture spent slurry and hold it long enough for it to transfer heat from the polishing reaction to the pad or through the injector to the new slurry before the said spent slurry is thrown from the polishing pad. The effect is to considerably improve the removal rate, reduce slurry consumption and reduce operating time. 1. A device for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising an injector , the bottom surface of the le ading edge of which possesses one or more bays , depressions or notches.2. A device for injecting slurry according to wherein number of bays claim 1 , depressions or notches is five or more.3. A device for injecting slurry according to wherein the number of bays depressions or notches is 10 or more.4. A device for injecting slurry according to claiml wherein the bays claim 2 , depressions or notches are all the same shape.5. A device for injecting slurry according to wherein the bays claim 1 , depressions or notches are all the same size.6. A device for injecting slurry according to wherein the bays claim 1 , depressions or notches are all progressively larger along the leading edge.7. A device for injecting slurry according to wherein the shape of the bays claim 1 , depressions or notches is a channel with perpendicular walls ending in a semicircle.8. A device for injecting slurry according to wherein the orientation of the lengthwise axis of the bays claim 7 , depressions or notches is parallel to the direction of motion of the polishing pad at the point of contact with the leading edge of the injector traversed by the said axis.9. A method for injecting slurry between the wafer and the pad in chemical mechanical ...

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13-03-2014 дата публикации

Substrate polishing and fluid recycling system

Номер: US20140069890A1
Автор: Simon Yavelberg
Принадлежит: Applied Materials Inc

Embodiments of the present invention are generally directed to a substrate polishing and slurry recycling system. The system includes an extendable gutter that may be positioned to collect processing slurry from the polishing pad during processing and deliver the consumed slurry to a reclamation tank. The reclaimed slurry may be treated and mixed with fresh slurry for delivery to the polishing pad during subsequent substrate polishing. The extendable gutter may be positioned in a second position during rinsing of the polishing pad so that rinsing fluid passes underneath the gutter and is removed from the system without mixing with the reclaimed slurry.

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07-01-2016 дата публикации

Polishing composition and method for producing polished article

Номер: US20160001416A1
Принадлежит: Fujimi Inc

This invention provides a polishing composition comprising an abrasive, a water-soluble polymer and water. The water-soluble polymer comprises a polymer A having an adsorption ratio of lower than 5% and a polymer B having an adsorption ratio of 5% or higher, but lower than 95% based on a prescribed adsorption ratio measurement. Herein, the polymer B is selected from polymers excluding hydroxyethyl celluloses.

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07-01-2016 дата публикации

CMP APPARATUS AND CMP METHOD

Номер: US20160001418A1
Автор: TERADA Tokinori
Принадлежит:

A chemical mechanical polishing apparatus in which a rotating head having a polishing pad mounted thereon whose contact area with a polishing object is smaller than surface area of the polishing object is pressed against and brought into contact with a surface of the polishing object mounted face up on a table, and is rotated with the table at rest while supplying slurry onto a contact surface to polish for a predetermined time, and then the rotating head is moved within the surface of the polishing object to polish the entire surface of the polishing object sequentially, including a pressure adjustment mechanism for maintaining a pressing load on the contact surface constant during polishing. 1. A chemical mechanical polishing apparatus , comprising a rotating head having a polishing pad mounted thereon whose contact area with a polishing object is smaller than surface area of the polishing object is pressed against and brought into contact with a surface of the polishing object mounted face up on a table , and is rotated with the table at rest while supplying slurry onto a contact surface to polish for a predetermined time , and then the rotating head is moved within the surface of the polishing object to polish the entire surface of the polishing object sequentially , further comprising a pressure adjustment mechanism for maintaining a pressing load on the contact surface constant during polishing.2. The chemical mechanical polishing apparatus according to claim 1 , wherein the pressure adjustment mechanism comprises: a support shaft supporting the table along its central axis; a cylinder slidably holding the support shaft along the central axis; a pressure chamber having an air inlet and an air outlet and formed in the cylinder; and an air pressure adjustment means provided on the support shaft located in the pressure chamber.3. The chemical mechanical polishing apparatus according to claim 2 , wherein the air pressure adjustment means comprises a separation ...

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02-01-2020 дата публикации

Temperature Control of Chemical Mechanical Polishing

Номер: US20200001427A1
Принадлежит:

A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface. The body supports a thermal control module positioned over the polishing pad. 1. A chemical mechanical polishing apparatus comprising:a platen to hold a polishing pad;a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process;a dispenser to supply a polishing liquid to the polishing surface; anda temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface, the body supporting a thermal control module positioned over the polishing pad.2. The apparatus of claim 1 , wherein the body comprises a linear arm of substantially uniform width.3. The apparatus of claim 1 , wherein the body comprises a wedge-shaped arm.4. The apparatus of claim 1 , wherein a portion of the body is positioned between the thermal control module and the polishing pad or the polishing liquid.5. The apparatus of claim 1 , wherein the thermal control module directly contacts the polishing pad or the polishing liquid.6. The apparatus of claim 1 , wherein at least a portion of the body that contacts the polishing pad or polishing liquid comprises a ceramic.7. The apparatus of claim 6 , wherein the body is ceramic.8. The apparatus of claim 6 , wherein the portion of the body comprises a coating of ceramic on another material.9. The apparatus of claim 1 , wherein at least a portion of the body that contacts the polishing pad or polishing liquid comprises silicon carbide claim 1 , silicon nitride aluminum nitride claim 1 , diamond or diamond-like carbon.10. The apparatus of claim 1 , ...

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07-01-2021 дата публикации

TEMPERATURE CONTROLLED SUBSTRATE CARRIER AND POLISHING COMPONENTS

Номер: US20210005479A1
Принадлежит:

Temperature controlled polishing pads are disclosed. In one aspect, a CMP system includes the use of any type of atomizing system to cool or remove energy and/or heat from the polishing pad of a CMP system. The atomizing system can use of any liquid medium in combination of any compressed gas through an orifice to cool or remove the energy and/or heat from the pad, thereby allowing for higher removal rates during CMP. 1. A substrate carrier head , comprising:a carrier body;a substrate retainer attached to the carrier body, the substrate retainer comprising an aperture configured to receive a substrate;a resilient membrane having a first surface configured to contact a surface of the substrate and a second surface opposing the first surface;a membrane cavity formed along the second surface;an inlet configured to allow liquid to flow into the membrane cavity; andan outlet configured to allow liquid to flow from the membrane cavity.2. The substrate carrier head of claim 1 , wherein the outlet is located at a farther radial position from a center of the carrier body than the inlet.3. The substrate carrier head of claim 2 , wherein the inlet is located at approximately the center of the carrier body.4. The substrate carrier head of claim 1 , further comprising:a secondary resilient membrane having a width that is less than a width of the resilient membrane.5. The substrate carrier head of claim 1 , further comprising a liquid tight seal between the resilient membrane and the carrier body.6. A substrate carrier system claim 1 , comprising: a carrier body;', 'a substrate retainer attached to the carrier body, the substrate retainer configured to retain a substrate on the carrier body;', 'a resilient membrane having a first surface configured to contact a surface of the substrate and a second surface opposing the first surface; and', 'a membrane cavity formed along the second surface, the membrane cavity configured to allow a liquid to flow along the second surface; and, 'a ...

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14-01-2016 дата публикации

Polishing apparatus

Номер: US20160008948A1
Принадлежит: Ebara Corp

A polishing apparatus which can continue stable operation of the apparatus without generating torsional vibration in a rotary joint and without generating an abnormal sound at an engagement part between a cooling water pipe and a polishing table is disclosed. The polishing apparatus includes a rotary joint fixed to a rotating part of the polishing table or a rotating part of the top ring to supply a fluid into the polishing table or the top ring and discharge the fluid from the polishing table or the top ring, and a rotation-prevention mechanism which connects the rotary joint with an apparatus frame to prevent the rotary joint from being rotated. The rotation-prevention mechanism includes a link mechanism having at least one spherical plain bearing.

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11-01-2018 дата публикации

Chemical mechanical polishing apparatus

Номер: US20180009078A1
Автор: Kyutae Park
Принадлежит: SAMSUNG ELECTRONICS CO LTD

Disclosed is a chemical mechanical polishing apparatus. The chemical mechanical polishing apparatus comprises a lower base, a platen configured to rotate and provided on a top surface of the lower base, a polishing pad on the platen; and at least one slurry supply device that is disposed adjacent to the polishing pad and supplies a slurry to the polishing pad. The slurry supply device comprises a capillary nozzle that is disposed over the polishing pad and includes a pin-type conductive tip therein, a slurry supply unit that supplies the slurry into the capillary nozzle, and a voltage supply unit that applies a voltage to the pin-type conductive tip.

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09-01-2020 дата публикации

SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD

Номер: US20200013640A1
Принадлежит:

A substrate cleaning device includes: a pressing member that cleans a substrate by contacting the substrate; a load measurement unit that measures a pressing load of the cleaning member; and a control unit that repeats an operation of comparing the measurement value of the load measurement unit with the setting load, changing the pressing amount of the cleaning member by a first movement amount so that a difference value decreases, when the difference value is larger than a first threshold value and equal to or smaller than a second threshold value, and changing the pressing amount of the cleaning member by a second movement amount larger than the first movement amount so that the difference value decreases, when the difference value is larger than the second threshold value, until the difference value becomes equal to or smaller than the first threshold value. 1. A substrate cleaning device comprising:a cleaning member configured to clean a substrate by contacting the substrate;a member rotation unit configured to rotate the cleaning member;a member drive unit configured to press the cleaning member against the substrate;a load measurement unit configured to measure a pressing load of the cleaning member; anda control unit configured to control a pressing amount of the cleaning member by the member drive unit, on the basis of a measurement value of the load measurement unit, so that the pressing load of the cleaning member becomes a setting load, whereinthe control unit repeats an operation of comparing the measurement value of the load measurement unit with the setting load, changing the pressing amount of the cleaning member by a first movement amount so that a difference value decreases, when the difference value is larger than a first threshold value and equal to or smaller than a second threshold value, and changing the pressing amount of the cleaning member by a second movement amount larger than the first movement amount so that the difference value ...

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15-01-2015 дата публикации

POLISHING METHOD AND POLISHING APPARATUS

Номер: US20150017745A1
Принадлежит:

A polishing method capable of preventing damage to a substrate is disclosed. The polishing method includes inspecting a periphery of a substrate for an abnormal portion, polishing the substrate if the abnormal portion is not detected, and not polishing the substrate if the abnormal portion is detected. The abnormal portion of the substrate may be an foreign matter, such as an adhesive, attached to the periphery of the substrate. After polishing of the substrate, the periphery of the substrate may be inspected again for an abnormal portion. 1. A polishing method , comprising:inspecting a periphery of a substrate for an abnormal portion;polishing the substrate if the abnormal portion is not detected; andnot polishing the substrate if the abnormal portion is detected.2. The polishing method according to claim 1 , further comprising:after polishing of the substrate, inspecting the periphery of the substrate again for an abnormal portion.3. The polishing method according to claim 2 , further comprising:not starting polishing of a subsequent substrate if the abnormal portion is detected in the periphery of the polished substrate.4. The polishing method according to claim 2 , further comprising:changing polishing conditions for a subsequent substrate if the abnormal portion is detected in the periphery of the polished substrate.5. The polishing method according to claim 1 , wherein inspecting the periphery of the substrate for an abnormal portion comprises obtaining an image of the periphery of the substrate and inspecting the periphery of the substrate for an abnormal portion based on the image.6. The polishing method according to claim 5 , wherein inspecting the periphery of the substrate for an abnormal portion based on the image comprises inspecting the periphery of the substrate for an abnormal portion by comparing an index value claim 5 , which indicates a characteristic of the abnormal portion appearing on the image claim 5 , with a predetermined threshold value.7. ...

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25-01-2018 дата публикации

SYSTEM FOR POLISHING WALLS OF AQUATIC ENCLOSURES

Номер: US20180020645A1
Автор: BERANGUER Jerome
Принадлежит:

A system for the polishing treatment of inner walls of aquatic enclosures includes at least one tank of abrasive mixture and at least one surface treatment head which communicates fluidically with the tank of abrasive mixture, a mover allowing the treatment head to be moved along the wall to be treated, and a supply allowing the treatment head to be supplied with a substantially continuous flow of abrasive mixture. 1. A system for polishing internal walls of aquatic enclosures , comprising:at least one abrasive mixture tank and:,at least one surface treatment head in fluid communication with the abrasive mixture tank;a mover for moving the treatment head along one of the internal walls; anda supply for supplying the abrasive mixture to the at least one treatment head with a substantially continuous flow,wherein the at least one treatment head comprises a containment chamber, a treatment disc rotatably arranged in the containment chamber, and a hollow rotating and feeding shaft connected to the treatment disc and to the supply,wherein the treatment disc is connected to a treatment disc motor, andwherein the treatment disc carries a friction foam.2. The system according to claim 1 , wherein the containment chamber comprises at least one outlet orifice in fluid communication with at least one recovered mixture tank.3. The system according to claim 1 , wherein the movers comprise at least one horizontal rail and a vertical rail.4. The system according to claim 3 , wherein at least one of the rails is movably mounted.5. The system according to claim 1 , wherein the at least one treatment head includes at least one treatment head thrust propeller claim 1 , positioned substantially opposite to the containment chamber.6. The system according to claim 1 , further comprising a circuit for recirculating the abrasive mixture.7. A method for by polishing internal walls of aquatic enclosures claim 1 , comprising:feeding a surface treatment head with an abrasive mixture;receiving ...

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25-01-2018 дата публикации

Slurry Supply and/or Chemical Blend Supply Apparatuses, Processes, Methods of Use and Methods of Manufacture

Номер: US20180021921A1
Принадлежит: Versum Materials US, LLC

A slurry and/or chemical blend supply apparatus suitable for providing slurry and/or chemical blend to chemical mechanical planarization (CMP) tools or other tools in a semiconductor fabrication facility, related processes, methods of use and methods of manufacture. The slurry and/or chemical blend supply apparatus includes one or more of the following: feed module, blend module, analytical module and distribution module. 1. A slurry supply apparatus comprising a blend module that combines two or more flowing component streams to form a blended slurry in a pipe , wherein said blend module comprises a blend module pump and a pipe for each component stream and at least one flow controller in each of at least two of the component pipes to control the flow rate of the components and wherein said component pipes are connected and combined into a single pipe to form the blended slurry stream upstream of said blend module pump , and further comprising:A) a distribution module comprising at least one distribution module tank and at least one distribution module pump and wherein at least a portion of the blended slurry stream from the blend module flows to the distribution module;B) an optional feed module, said feed module comprising at least one feed tank for holding raw slurry, at least one circulation loop and a pump in the at least one circulation loop connected to the at least one feed tank, said pump for pumping said raw slurry from the feed tank through the circulation loop and back to the feed tank, wherein the circulation loop further comprises a pipe that supplies only a portion of the raw slurry from the circulation loop to said blend module when the blend module is blending slurry, said circulation loop further comprises a back pressure controller, and a pressure sensor that measures a pressure in the circulation loop that is used to regulate a valve in said back pressure controller to maintain said raw slurry circulating through all of the circulation loop; ...

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10-02-2022 дата публикации

ON-DEMAND IN-LINE-BLENDING AND SUPPLY OF CHEMICALS

Номер: US20220040653A1
Принадлежит:

This in-line active and reverse calculating mass balance blending system can maintain a chemical at desired control points, such as with respect to concentration, temperature, and/or pressure, while the output flow rate is changing dynamically to a point of use. A blending unit is configured to receive and blend at least two species and deliver a mixture at selected concentrations to points of use. A controller can be configured to determine a mass balance to maintain the concentrations in the mixture using information from metrology systems and a flow in an output to the at least one point of use. The controller also can be configured to maintain a concentrations in the mixture within a concentration range by controlling flow rates to the blending unit. 1. A blending system for maintaining a mixture at a desired concentration comprising:a first species input that provides a first species;a second species input that provides a second species; an input flow path;', 'an output flow path;', 'a chemical injection nozzle proximate the input flow path, wherein the chemical injection nozzle includes an insertable injection nozzle;', 'a directional flow perforated plate downstream of the input flow path and the chemical injection nozzle;', 'a homogenizing turbulence mix zone void disposed downstream of the input flow path and the chemical injection nozzle and upstream of the directional flow perforated plate;', 'a flow directional cone disposed downstream of the input flow path and the chemical injection nozzle and upstream of the homogenizing turbulence mix zone void;', 'a first mixing zone flow directional cone disposed downstream of the homogenizing turbulence mix zone void and upstream the directional flow perforated plate; and', 'a turbulence break void disposed between the directional flow perforated plate and the output flow path;, 'a blending unit in fluid communication with the first species input, the second species input, and an output that is in fluid ...

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28-01-2021 дата публикации

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Номер: US20210023677A1
Автор: MIURA Yoshitaka
Принадлежит:

A substrate processing apparatus includes: a processing container; an injector provided inside the processing container and having a shape extending in a longitudinal direction along which a processing gas is supplied; a holder fixed to the injector; a first magnet fixed to the holder and disposed inside the processing container; a second magnet separated from the first magnet by a partition plate and disposed outside the processing container; and a driving part configured to rotate the second magnet, wherein the first magnet and the second magnet are magnetically coupled to each other, and wherein by rotating the second magnet by the driving part, the first magnet magnetically coupled to the second magnet is rotated, and the injector rotates about the longitudinal direction as an axis. 1. A substrate processing apparatus comprising:a processing container;an injector provided inside the processing container and having a shape extending in a longitudinal direction along which a processing gas is supplied;a holder fixed to the injector;a first magnet fixed to the holder and disposed inside the processing container;a second magnet separated from the first magnet by a partition plate and disposed outside the processing container; anda driving part configured to rotate the second magnet,wherein the first magnet and the second magnet are magnetically coupled to each other, andwherein by rotating the second magnet by the driving part, the first magnet magnetically coupled to the second magnet is rotated, and the injector rotates about the longitudinal direction as an axis.2. The substrate processing apparatus of claim 1 , further comprising a driving controller configured to control the driving part claim 1 ,wherein the driving controller performs a control to alternately perform rotating the second magnet in a first direction and rotating the second magnet in a second direction opposite the first direction.3. The substrate processing apparatus of claim 2 , wherein the ...

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28-01-2021 дата публикации

System and Method of Chemical Mechanical Polishing

Номер: US20210023678A1
Принадлежит:

A system controls a flow of a chemical mechanical polish (CMP) slurry into a chamber to form a slurry reservoir within the chamber. Once the slurry reservoir has been formed within the chamber, the system moves a polishing head to position and force a surface of a wafer that is attached to the polishing head into contact with a polishing pad attached to a platen within the chamber. A wafer/pad interface is formed at the surface of the wafer forced into contact with the polishing pad and the wafer/pad interface is disposed below an upper surface of the slurry reservoir. During CMP processing, the system controls one or more of a level, a force, and a rotation of the platen, a position, a force and a rotation of the polishing head to conduct the CMP processing of the surface of the wafer at the wafer/pad interface. 1. A system comprising:a platen within a chamber;a polishing head;a first slurry input/output; anda second slurry input/output, wherein both the first slurry input/output and the second slurry input/output are located on an opposite side of the platen than the polishing head.2. The system of claim 1 , further comprising a level sensor located within the chamber.3. The system of claim 2 , wherein the level sensor is located at least partially above a polishing pad located adjacent to the platen.4. The system of claim 1 , further comprising a motor to physically move the platen from a first distance away from a bottom of the chamber to a second distance away from the bottom of the chamber.5. The system of claim 1 , further comprising a slurry reservoir within the chamber claim 1 , wherein the platen is immersed within the slurry reservoir.6. The system of claim 1 , further comprising a restoration system connected to both the first slurry input/output and the second slurry input/output.7. A system claim 1 , comprising:a chemical mechanical polishing chamber;a first port and a second port both located at a first level within the chemical mechanical polishing ...

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30-01-2020 дата публикации

AUTOMATIC SANDPAPER REPLACEMENT DEVICE FOR CNC PRODUCTION LINE

Номер: US20200030935A1
Автор: HANG Yujie, WANG Peng, WU Jiafu
Принадлежит: SUZHOU RS TECHNOLOGY CO., LTD.

The present invention discloses an automatic sandpaper replacement device for CNC production line, comprising an automatic sandpaper supply mechanism which comprises a bracket assembly, and a sandpaper receiving assembly and a sandpaper extracting plate disposed on bracket assembly; and an automatic sandpaper peeling mechanism that is mated with bracket assembly, and comprises a mounting plate, and a peeling drive assembly and a peeling assembly mounted on mounting plate; wherein peeling assembly is drivingly connected with peeling drive assembly, peeling assembly periodically peels off waste sandpaper on a sanding head under driving of peeling drive assembly, and sandpaper extracting plate periodically supplies new sandpaper to sanding head after peeling off sandpaper. The automatic sandpaper replacement device improves peeling efficiency, effectively solves problems of uncleanly peeling and peeling residue, saves cost, solves sandpaper jamming problem in a sandpaper supply process, and improves sandpaper replacement efficiency and success rate, thereby further improving productivity. 1. An automatic sandpaper replacement device for CNC production line , being characterized in that it comprises:an automatic sandpaper supply mechanism, the automatic sandpaper supply mechanism comprising a bracket assembly, and a sandpaper receiving assembly and a sandpaper extracting plate disposed on the bracket assembly; andan automatic sandpaper peeling mechanism that is mated with the bracket assembly, the automatic sandpaper peeling mechanism comprising a mounting plate, and a peeling drive assembly and a peeling assembly mounted on the mounting plate;wherein the peeling assembly is drivingly connected with the peeling drive assembly, the peeling assembly periodically peels off waste sandpaper on a sanding head under driving of the peeling drive assembly, and the sandpaper extracting plate periodically supplies new sandpaper to the sanding head after peeling off sandpaper.2. ...

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08-02-2018 дата публикации

GRINDING APPARATUS, METHOD OF MANUFACTURING ROLLING BEARING, METHOD OF MANUFACTURING VEHICLE AND METHOD OF MANUFACTURING MACHINE

Номер: US20180036857A1
Автор: Egami Kazutaka, Utada Eiji
Принадлежит: NSK LTD.

A grinding apparatus includes: a grinding stone in which an outer circumferential surface thereof is pressed against the workpiece while being rotated and driven; and a fluid injection apparatus that has a fluid injection nozzle including an injection port from which a fluid is injected to the outer circumferential surface of the grinding stone, and a grinding oil supply apparatus that supplies a grinding oil to a processing point and that includes a grinding oil supply nozzle separate from the fluid injection nozzle, the processing point being an abutting section of the grinding stone and the workpiece, wherein the injection port is arranged so as to face the outer circumferential surface of the grinding stone in a state capable of injecting the fluid to a position different from the processing point in a radial direction of the grinding stone among the outer circumferential surface of the grinding stone. 1. A grinding apparatus for performing grinding process on a workpiece , the grinding apparatus comprising:a grinding stone in which an outer circumferential surface thereof is pressed against the workpiece while being rotated and driven; anda fluid injection apparatus that has a fluid injection nozzle including an injection port from which a fluid is injected to the outer circumferential surface of the grinding stone, anda grinding oil supply apparatus that supplies a grinding oil to a processing point and that includes a grinding oil supply nozzle separate from the fluid injection nozzle, the processing point being an abutting section of the grinding stone and the workpiece,wherein the injection port is arranged so as to face the outer circumferential surface of the grinding stone in a state capable of injecting the fluid to a position different from the processing point in a radial direction of the grinding stone among the outer circumferential surface of the grinding stone.2. The grinding apparatus according to claim 1 ,wherein the workpiece is a ring shaped ...

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24-02-2022 дата публикации

NOVEL AUTOMATED POLISHING SYSTEMS AND METHODS RELATING THERETO

Номер: US20220055178A1
Автор: KIM Myung Ki
Принадлежит: PHOENIX TECHNOLOGY SERVICES LLC

Polishing systems and methods are described. An exemplar polishing system includes: (i) a jig designed to secure mobile device; (ii) a polishing head designed to contact and polish a mobile device surface; (iii) a spindle disposed above the jig and fitted with the polishing head; (iv) a slurry dispenser arranged adjacent to the spindle and designed to store and dispense polishing slurry on the mobile device surface; and (v) a central controller programmed to control operation of the jig, the spindle, and the slurry dispenser such that during an operative state of the jig and the spindle, and under control of the central controller, the slurry dispenser dispenses polishing slurry to facilitate polishing of the mobile device surface. 1. A polishing system , comprising:a jig designed to secure mobile device;a polishing head designed to contact and polish mobile device;a spindle disposed above said jig and fitted with said polishing head;a slurry dispenser arranged adjacent to said spindle and designed to store and dispense polishing slurry on surface of mobile device; anda central controller programmed to control operation of said jig, said spindle, and said slurry dispenser such that during an operative state of said jig and said spindle, and under control of said central controller, said slurry dispenser dispenses polishing slurry to facilitate polishing surface of mobile device.2. The polishing system of claim 1 , further comprising a first tray that has disposed thereon one or more jig guides that guide displacement of said jig in an X-direction.3. The polishing system of claim 2 , further comprising a first ball-screw drive subassembly that is coupled to said first tray and in conjunction with one or more of said jig guides claim 2 , displaces said jig in said X-direction.4. The polishing system of claim 3 , further comprising:an X-axis motor that operates in conjunction with said first ball-screw drive subassembly to displace said jig in said X-direction; andan X ...

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07-02-2019 дата публикации

SUBSTRATE PROCESSING APPARATUS

Номер: US20190039203A1
Автор: Toriyabe Toyonaga
Принадлежит:

A substrate processing apparatus has a polishing table configured to have a polishing surface, a polishing liquid supply nozzle that supplies slurry to a slurry supply position set on the polishing table, a top ring that presses a substrate against the polishing surface of the polishing table at a polishing position set on the polishing table on a downstream side from the slurry supply position in a rotation direction of the polishing table, and a slurry returning bar that is disposed at a predetermined gap from the polishing surface and extends from an outer peripheral portion of the polishing table to a central portion at a specified position on the polishing table on a downstream side from the polishing position in the rotation direction of the polishing table. 1. A substrate processing apparatus comprising:a polishing table configured to have a polishing surface;a supply device configured to supply slurry to a supply position set on the polishing table;a pressing device configured to press a substrate against the polishing surface of the polishing table at a polishing position set on the polishing table on a downstream side from the supply position in a rotation direction of the polishing table; anda slurry recovery member disposed at a predetermined gap from the polishing surface and extending from an outer peripheral portion of the polishing table to a central portion of the polishing table at a specified position on the polishing table on a downstream side from the polishing position in the rotation direction of the polishing table.2. The substrate processing apparatus of claim 1 , further comprising:a dresser disposed above the polishing table on a downstream side from the slurry recovery member in the rotation direction of the polishing table and configured to dress the polishing surface.3. The substrate processing apparatus of claim 1 , further comprising:a movement mechanism configured to move the slurry recovery member between the specified position on ...

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06-02-2020 дата публикации

APPARATUS FOR POLISHING AND METHOD FOR POLISHING

Номер: US20200039031A1
Принадлежит:

An object of the present invention is to reduce an amount of use of the polishing liquid. There is provided an apparatus for polishing an object to be polished using a polishing pad having a polishing surface, the apparatus including: a polishing table for supporting the polishing pad, the polishing table being configured to be rotatable; a substrate holding unit configured to hold the object to be polished and press the object against the polishing pad; a supplying device for supplying polishing liquid to the polishing surface in a state in which the supplying device is pressed against the polishing pad; and a pressing mechanism configured to press the supplying device against the polishing pad, in which the pressing mechanism is capable of respectively adjusting pressing forces for pressing the sidewalls of on the upstream side and the downstream side of the supplying device against the polishing surface. 1. An apparatus for polishing an object to be polished using a polishing pad having a polishing surface , the apparatus comprising:a polishing table for supporting the polishing pad, the polishing table being configured to be rotatable;a substrate holding unit configured to hold the object to be polished and press the object to be polished against the polishing pad;a supplying device for supplying polishing liquid to the polishing surface in a state in which the supplying device is pressed against the polishing pad; anda pressing mechanism configured to press the supplying device against the polishing pad, wherein a sidewall pressed against the polishing surface, the sidewall including a first wall on an upstream side in a rotating direction of the polishing table and a second wall on a downstream side in the rotating direction of the polishing table; and', 'a holding space surrounded by the sidewall and opened to the polishing surface, the holding space holding the polishing liquid and supplying the polishing liquid to the polishing surface, and, 'the supplying ...

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18-02-2021 дата публикации

SLURRY TEMPERATURE CONTROL BY MIXING AT DISPENSING

Номер: US20210046603A1
Принадлежит:

A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of a heating fluid, a reservoir to hold a polishing liquid, and a dispenser having one or more apertures suspended over the platen to direct the polishing liquid onto the polishing surface, wherein the source of the heating fluid is coupled to the dispenser and configured to deliver the heating fluid into the polishing liquid to heat the polishing liquid after the polishing liquid leaves the reservoir and before the polishing liquid is dispensed onto the polishing surface. 1. A chemical mechanical polishing system , comprising:a platen to support a polishing pad having a polishing surface;a source of a heating fluid;a reservoir to hold a polishing liquid; anda dispenser having one or more apertures suspended over the platen to direct the polishing liquid onto the polishing surface,wherein the source of the heating fluid is coupled to the dispenser and configured to deliver the heating fluid into the polishing liquid to heat the polishing liquid after the polishing liquid leaves the reservoir and before the polishing liquid is dispensed onto the polishing surface.2. The system of claim 1 , wherein the heating fluid comprises one or more of water claim 1 , de-ionized water claim 1 , or water that includes additives or chemicals.3. The system of claim 1 , wherein the source of heating fluid comprises a steam generator and the heating fluid comprises steam.4. The system of claim 3 , comprising a controller coupled to a power source for the steam generator and configured to cause the steam generator to heat the steam to 40-120° C.5. The system of claim 1 , wherein the source of heating fluid is coupled to the dispenser in a dispenser arm that extends over the platen so as to deliver heating fluid into the polishing liquid in the dispenser arm.6. The system of claim 5 , wherein the source of heating fluid is coupled to the dispenser in a mixing chamber ...

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18-02-2016 дата публикации

SLURRY SUPPLY DEVICE AND POLISHING APPARATUS INCLUDING THE SAME

Номер: US20160045999A1
Автор: Bae Jae Hyun, HAN Kee Yun
Принадлежит:

Disclosed is a slurry supply device including a nozzle configured to eject slurry, a slurry supply unit configured to receive the slurry from the nozzle and to discharge the slurry through at least one slurry hole, a receiving unit configured to allow the slurry supply unit to be mounted, inserted, seated, coupled, supported, or placed therein so as to enable discharge of the slurry from the slurry supply unit, the receiving unit being configured to receive a flowing material around the slurry supply unit and a slurry protection unit configured to enclose a space for passage of the slurry from an exit of the nozzle to an entrance of the slurry supply unit in conjunction with the flowing material. 1. A slurry supply device , comprising:a nozzle configured to eject slurry;a slurry supply unit configured to receive the slurry from the nozzle and to discharge the slurry through at least one slurry hole;a receiving unit configured to allow the slurry supply unit to be mounted, inserted, seated, coupled, supported, or placed therein so as to enable discharge of the slurry from the slurry supply unit, the receiving unit being configured to receive a flowing material around the slurry supply unit; anda slurry protection unit configured to enclose a space for passage of the slurry from an exit of the nozzle to an entrance of the slurry supply unit in conjunction with the flowing material.2. The device according to claim 1 , wherein the slurry protection unit includes:a nozzle receiving recess arranged to face an entrance of the slurry supply unit, the nozzle receiving recess being configured to allow the nozzle to be mounted, seated, inserted, or coupled therein; anda main cover configured to hermetically seal the space for passage of the slurry in conjunction with the flowing material.3. The device according to claim 2 , wherein the main cover includes:an upper end portion; anda first sidewall portion extending from the upper end portion.4. The device according to claim 3 , ...

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06-02-2020 дата публикации

INDIUM PHOSPHIDE SUBSTRATE, METHOD OF INSPECTING INDIUM PHOSPHIDE SUBSTRATE, AND METHOD OF PRODUCING INDIUM PHOSPHIDE SUBSTRATE

Номер: US20200041247A1
Принадлежит: Sumitomo Electric Industries, Ltd.

An indium phosphide substrate, a method of inspecting thereof and a method of producing thereof are provided, by which an epitaxial film grown on the substrate is rendered excellently uniform, thereby allowing improvement in PL characteristics and electrical characteristics of an epitaxial wafer formed using this epitaxial film. The indium phosphide substrate has a first main surface and a second main surface, a surface roughness Ra1 at a center position on the first main surface, and surface roughnesses Ra2, Ra3, Ra4, and Ra5 at four positions arranged equidistantly along an outer edge of the first main surface and located at a distance of 5 mm inwardly from the outer edge. An average value m1 of the surface roughnesses Ra1, Ra2, Ra3, Ra4, and Ra5 is 0.5 nm or less, and a standard deviation σ1 of the surface roughnesses Ra1, Ra2, Ra3, Ra4, and Ra5 is 0.2 nm or less. 1. An indium phosphide substrate having a first main surface and a second main surface ,the first main surface having a surface roughness Ra1 at a center position and surface roughnesses Ra2, Ra3, Ra4, and Ra5 at four positions, the four positions being arranged equidistantly along an outer edge of the first main surface and located at a distance of 5 mm inwardly from the outer edge,{'b': '1', 'an average value m of the surface roughnesses Ra1, Ra2, Ra3, Ra4, and Ra5 being 0.4 nm or less,'}a standard deviation σ1 of the surface roughnesses Ra1, Ra2, Ra3, Ra4, and Ra5 being 10% or less of the average value m1,the second main surface having a surface roughness Ra6 at a center position and surface roughnesses Ra7, Ra8, Ra9, and Ra10 at four positions, the four positions being arranged equidistantly along an outer edge of the second main surface and located at a distance of 5 mm inwardly from the outer edge,an average value m2 of the surface roughnesses Ra6, Ra7, Ra8, Ra9, and Ra10 being more than 0.4 nm and 3 nm or less, anda standard deviation σ2 of the surface roughnesses Ra6, Ra7, Ra8, Ra9, and Ra10 ...

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06-02-2020 дата публикации

Chemical mechanical polishing apparatus

Номер: US20200043746A1

The present disclosure provides an apparatus and a method for polishing a semiconductor substrate in semiconductor device manufacturing. The apparatus can include: a carrier configured to hold the substrate; a polishing pad configured to polish a first surface of the substrate; a chemical mechanical polishing (CMP) slurry delivery arm configured to dispense a CMP slurry onto the first surface of the substrate; and a pad conditioner configured to condition the polishing pad. In some embodiments, the pad conditioner can include: a conditioning disk configured to scratch the polishing pad; a conditioning arm configured to rotate the conditioning disk; a plurality of magnetic screws configured to secure the conditioning disk onto the conditioning arm and including a respective plurality of screw heads; and a plurality of blocking devices respectively positioned beneath the plurality of screw heads and configured to block debris particles from entering a respective plurality of screw holes.

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06-02-2020 дата публикации

Magnetic Slurry for Highly Efficient CMP

Номер: US20200043747A1
Принадлежит:

A chemical-mechanical polishing (CMP) system includes a head, a polishing pad, and a magnetic system. The slurry used in the CMP process contains magnetizable abrasives. Application and control of a magnetic field, by the magnetic system, allows precise control over how the magnetizable abrasives in the slurry may be drawn toward the wafer or toward the polishing pad. 1. A chemical-mechanical polishing (CMP) system , comprising:a head;a polishing pad; anda first magnetic system disposed over the polishing pad, the first magnetic system configured to apply a first magnetic field to a slurry disposed over the polishing pad, and the slurry comprising magnetizable abrasives.2. The CMP system of claim 1 , wherein the magnetizable abrasives are a material selected from the group consisting of titanium (III) oxide claim 1 , cerium (IV) oxide claim 1 , titanium dioxide claim 1 , zirconium dioxide claim 1 , aluminum oxide claim 1 , silicon dioxide claim 1 , or any combination thereof.3. The CMP system of claim 1 , wherein all of the magnetizable abrasives are either paramagnetic or diamagnetic.4. The CMP system of claim 1 , wherein the head is disposed above the polishing pad claim 1 , the head configured to hold a wafer such that the wafer is interposed between the head and the slurry claim 1 , the magnetizable abrasives having an absolute magnetic susceptibility greater than or substantially equal to 5×10; andwherein the first magnetic field forces the magnetizable abrasives toward the wafer.5. The CMP system of claim 4 , wherein the CMP system is configured to produce the first magnetic field simultaneously with a rotating of the wafer or the polishing pad or both.6. The CMP system of claim 4 , wherein the first magnetic system is configured to produce a second magnetic field over the polishing pad claim 4 , and wherein the second magnetic field forces the magnetizable abrasives away from the wafer.7. The CMP system of claim 1 , wherein the first magnetic system comprises ...

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06-02-2020 дата публикации

Substrate holding apparatus, substrate suction determination method, substrate polishing apparatus, substrate polishing method, method of removing liquid from upper suface of wafer to be polished, elastic film for pressing wafer against polishing pad, substrate release method, and constant amount gas supply apparatus

Номер: US20200043773A1
Принадлежит: Ebara Corp

A substrate holding apparatus is provided, which includes a top ring main body to which an elastic film having a surface that can suck a substrate can be attached, a first line communicating with a first area of the plurality of areas, a second line communicating with a second area different from the first area of the plurality of areas, a pressure adjuster that can pressurize the first area by feeding fluid into the first area through the first line and can generate negative pressure in the second area through the second line, and a determiner that performs determination of whether or not the substrate is sucked to the elastic film based on a volume of the fluid fed into the first area or a measurement value corresponding to pressure in the first area.

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22-02-2018 дата публикации

POLISHING APPARATUS

Номер: US20180050436A1
Автор: Yamanaka Satoshi
Принадлежит:

A polishing apparatus includes a slurry circulating unit for storing a slurry below a chuck table having a holding surface for holding a wafer, and circulating the slurry to a polishing surface of a polishing pad for polishing the wafer. The slurry circulating unit includes an annular cup-shaped receptacle that surrounds the chuck table and the polishing pad overhanging from the holding surface of the chuck table in a polishing position where the polishing surface is in contact with the wafer, an air blow opening formed through a bottom plate of the receptacle for blowing air to thereby spray the slurry stored in the receptacle toward the polishing pad, a pipe for connecting the air blow opening to an air source, an opening formed through a side wall of the pipe, and a valve for controlling the supply and stop of air from the air source to the pipe. 1. A polishing apparatus comprising:a chuck table having a holding surface for holding a wafer;polishing means including a rotatable polishing pad having a polishing surface for polishing the wafer held on the chuck table;slurry supplying means for supplying a slurry to the polishing surface;feeding means for feeding the polishing means in a direction toward or away from an upper surface of the wafer held on the chuck table; andslurry circulating means for storing the slurry below the chuck table and circulating the slurry to the polishing surface of the polishing pad; an annular cup-shaped receptacle configured so as to surround the chuck table and the polishing pad overhanging from the holding surface of the chuck table in a polishing position where the polishing surface of the polishing pad is in contact with the wafer held on the chuck table,', 'an air blow opening formed through a bottom plate portion of the receptacle for blowing air to thereby spray the slurry stored in the receptacle toward the polishing surface of the polishing pad overhanging from the holding surface of the chuck table,', 'a pipe for connecting ...

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15-05-2014 дата публикации

SMALL AUTOMATIC POLISHING LIQUID CLEANING DEVICE FOR RIGID GAS PERMEABLE CONTACT LENS

Номер: US20140130913A1
Принадлежит:

A small automatic polishing liquid cleaning device for rigid gas permeable contact lens includes a container; a containing chamber is provided inside the container; an exhaust pipe, and a liquid suction pipe which communicates with the containing chamber disposed on the container; an outlet end of the exhaust pipe communicates with a vacuum orifice of a vacuum generator via a connector, a gas inlet of the vacuum generator communicates with a pipeline for a compressed gas, and a liquid inlet of the liquid suction pipe is disposed at the bottom of a waste liquid trough. 1. A small automatic polishing liquid cleaning device for a rigid gas permeable contact lens , comprisinga container; the container is internally provided with a containing chamber;an exhaust pipe; and 'an outlet end of the exhaust pipe communicates with a vacuum orifice of a vacuum generator via a connector; a gas inlet of the vacuum generator communicates with a pipeline for a compressed gas; and a liquid inlet of the liquid suction pipe is disposed at the bottom of a waste liquid trough.', 'a liquid suction pipe communicating with the containing chamber disposed on the container;'}2. The small automatic polishing liquid cleaning device for a rigid gas permeable contact lens of claim 1 , wherein the gas inlet of the vacuum generator communicates with the pipeline for the compressed gas via an gas flow control switch.3. The small automatic polishing liquid cleaning device for a rigid gas permeable contact lens of claim 1 , wherein the gas inlet of the vacuum generator communicates with the pipeline for the compressed gas via a pressure reducing valve; and the pressure reducing valve is provided with a pressure gage and a pressure adjusting knob claim 1 , wherein the pressure gage communicates with an internal channel.4. The small automatic polishing liquid cleaning device for a rigid gas permeable contact lens of claim 1 , wherein the pressure reducing valve and the gas flow control switch are ...

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10-03-2022 дата публикации

SUBSTRATE HANDLING SYSTEMS AND METHODS FOR CMP PROCESSING

Номер: US20220072682A1
Принадлежит:

A system and method for sequential single-sided CMP processing of opposite facing surfaces of a silicon carbide (SiC) substrate are disclosed. A method includes urging a first surface of a substrate against one of plurality of polishing pads, wherein the plurality of polishing pads are disposed on corresponding ones of a plurality of rotatable polishing platens. The method includes transferring, using the first side of the end effector, the substrate from the substrate carrier loading station to a substrate alignment station. The method includes transferring, using the first side of the end effector, the substrate from the substrate alignment station to a substrate carrier loading station. The method includes urging a second surface of the substrate against one of the plurality of polishing platens. 1. A substrate polishing system , comprising:a substrate alignment station;a plurality of polishing stations, each comprising a rotatable polishing platen;a substrate carrier loading station;a substrate handler comprising an end effector having a first side and a second side that is opposite of the first side; and (a) urging a first surface of a substrate against one of a plurality of polishing pads, wherein the plurality of polishing pads are disposed on corresponding ones of the plurality of rotatable polishing platens;', '(b) transferring, using the first side of the end effector, the substrate from the substrate carrier loading station to the substrate alignment station;', '(c) transferring, using the first side of the end effector, the substrate from the substrate alignment station to the substrate carrier loading station; and', '(d) urging a second surface of the substrate against one of the plurality of polishing pads., 'a computer readable medium having instructions stored thereon for a substrate processing method, the method comprising sequentially2. The system of claim 1 , wherein the substrate handler further comprises an arm movable along an overhead track ...

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03-03-2016 дата публикации

BUFFING APPARATUS, AND SUBSTRATE PROCESSING APPARATUS

Номер: US20160059376A1
Принадлежит:

A buffing module for buffing a substrate is provided. The buffing module comprises a buff table for supporting the substrate, the buff table being rotatable; and a buff head to which a buff pad is attached, being rotatable and movable in a direction of approaching the buff table and a direction of moving away from the buff table. The buff pad includes a first part and a second part arranged so as to surround the first part on an outer side of the first part, the first part and the second part have different characteristics from each other. 1. A buffing module for buffing a substrate , comprising:a buff table for supporting the substrate, the buff table being rotatable; anda buff head to which a buff pad is attached, being rotatable and movable in a direction of approaching the buff table and a direction of moving away from the buff table;wherein the buff pad includes a first part and a second part arranged so as to surround the first part on an outer side of the first part, the first part and the second part have different characteristics from each other.2. The buff module according to claim 1 ,wherein the characteristics include at least one of a material, hardness, a density, a difference between a single layer and stacked layers, a thickness, a groove shape, compressibility, a pore density, a pore size, a foam structure, a level of water repellency, and a level of hydrophilicity.3. The buff module according to claim 1 ,wherein Shore D hardness is lower in the second part than in the first part.4. The buff module according to claim 1 , whereinan internal supply line for supplying a process liquid for the buffing to the substrate is formed inside the buff head.5. The buff module according to claim 1 , whereinthe first part and the second part are attached to the buff head, andthe first part and the second part are arranged at a certain distance.6. The buff module according to claim 1 ,wherein the buff head further includesan elastic member to which the buff pad is ...

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01-03-2018 дата публикации

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Номер: US20180056470A1
Принадлежит:

A substrate processing apparatus includes a polisher configured to polish a substrate using a polishing liquid, a first cleaner configured to clean the substrate polished by the polisher using sulfuric acid and hydrogen peroxide water, a second cleaner configured to clean the substrate cleaned by the first cleaner using a basic chemical liquid and hydrogen peroxide water, and a drier configured to dry the substrate cleaned by the second cleaner. 1. A substrate processing apparatus , the apparatus comprising:a polisher configured to polish a substrate using polishing liquid;a first cleaner configured to clean, using sulfuric acid and hydrogen peroxide water, the substrate polished by the polisher;a second cleaner configured to clean, using a basic chemical liquid and hydrogen peroxide water, the substrate cleaned by the first cleaner; anda drier configured to dry the substrate cleaned by the second cleaner.2. The substrate processing apparatus according to claim 1 , wherein the substrate processing apparatus does not have a mechanism configured to dry the substrate after being polished by the polisher and before being cleaned by the first cleaner.3. The substrate processing apparatus according to claim 1 , further comprising a transporter configured to transport the substrate polished by the polisher to the first cleaner without drying the substrate.4. The substrate processing apparatus according to claim 3 , further comprising a first liquid supply mechanism configured to shower liquid on the substrate that is being transported by the transporter.5. The substrate processing apparatus according to claim 1 , further comprising a substrate station on which the substrate after being polished by the polisher and before being cleaned by the first cleaner is mounted; anda second liquid supply mechanism configured to shower liquid on the substrate mounted on the substrate station.6. The substrate processing apparatus according to claim 1 , whereinthe first cleaner is housed ...

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01-03-2018 дата публикации

SUBSTRATE GRINDING DEVICE

Номер: US20180056471A1
Автор: Chen Changxu, Hu Weiqin
Принадлежит:

The present application has disclosed a substrate grinding device, which includes a carrying platform, a lifting platform and a grinding head, the lifting platform is located above the carrying platform and configured to be movable in a direction perpendicular to an upper surface of the carrying platform with respect to the carrying platform upwardly or downwardly; and the grinding head is mounted to the lifting platform and configured to grind a grind region of a substrate to be ground disposed on the carrying platform, the grind region being a region of the substrate where there is a partial scratch. 1. A substrate grinding device , comprising:a carrying platform;a lifting platform located above the carrying platform and configured to be movable in a direction perpendicular to an upper surface of the carrying platform upwardly or downwardly; anda grinding head mounted to the lifting platform and configured to grind a grind region of a substrate to be ground disposed on the upper surface of the carrying platform, the grind region being a region of the substrate where there is a partial scratch.2. The substrate grinding device according to claim 1 , further comprising an up-down guiding pillar provided at an edge of the upper surface of the carrying platform and perpendicular to the upper surface of the carrying platform claim 1 , wherein the lifting platform is mounted on the up-down guiding pillar and configured to be movable in a length direction of the up-down guiding pillar upwardly or downwardly.3. The substrate grinding device according to claim 2 , wherein the upper surface of the carrying platform has a rectangular shape claim 2 , the number of the up-down guiding pillar is two claim 2 , and the two up-down guiding pillars are located at two opposite edges of the upper surface of the carrying platform respectively; andwherein the lifting platform comprises a supporting beam, to which the grinding head is mounted; two opposite ends of the supporting beam are ...

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21-02-2019 дата публикации

POLISHING METHOD AND POLISHING APPARATUS

Номер: US20190054589A1
Автор: Hoshina Manao, SEKI Masaya
Принадлежит: EBARA CORPORATION

The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape. 18.-. (canceled)9. A polishing apparatus comprising:a substrate holder having a substrate-holding surface, the substrate holder being configured to hold a substrate with the substrate-holding surface and to rotate the substrate; anda polishing unit configured to polish an edge portion of the substrate with use of a polishing tape, a disk head having a circumferential surface for supporting the polishing tape, the disk head having a central axis which is parallel to the substrate-holding surface and is perpendicular to a tangential direction of the substrate; and', 'an elevating mechanism configured to elevate and lower the disk head., 'the polishing unit including10. The polishing apparatus according to claim 9 , wherein the polishing unit further includes:a base supporting the disk head;a horizontal linear guide extending parallel to the tangential direction of the substrate, the base being movably supported by the linear guide, the disk head being movable together with the base.11. The polishing apparatus according to claim 10 , wherein the elevating mechanism includes:an elevation table supporting the horizontal linear guide; andan elevating actuator configured to elevate and lower the elevation table.12. The polishing apparatus according to claim 11 , wherein the elevating actuator includes:a ball screw rotatably coupled to the elevation table; anda servomotor coupled to the ball screw.13. The polishing apparatus according to claim 11 , wherein the elevating mechanism further includes a vertical linear guide configured to restrict movement of the elevation table to a vertical direction claim 11 , the elevation table being coupled to the vertical linear guide.14. The polishing apparatus according to claim ...

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21-02-2019 дата публикации

NOVEL CHEMICAL-MECHANICAL PLANARIZATION SYSTEM

Номер: US20190054590A1
Принадлежит:

An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value. 1. An apparatus for performing a polishing process , comprising:a rotatable polishing pad;a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad;a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; anda second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad,wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.2. The apparatus of claim 1 , further comprising:a carrier configured to hold a sample to be polished against the top surface of the rotatable polishing pad in a presence of a mixture of the first and second slurries.3. The apparatus of claim 2 , wherein the mixture of the first and second slurries is at a temperature between the first and second temperatures.4. The apparatus of claim 2 , wherein the sample is a silicon wafer.5. The apparatus of claim 1 , wherein the first and second slurries have a same abrasive fluid.6. The apparatus of claim 1 , further comprising:a first reservoir, coupled to the first dispenser, and configured to contain the first slurry maintained at the first temperature ...

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01-03-2018 дата публикации

RECOVERY METHOD FOR ABRASIVE

Номер: US20180056483A1
Принадлежит:

A method for collecting an abrasive from an abrasive slurry which has been used for polishing an object including silicon as a main component includes: (i) adding a solvent to the abrasive slurry; (ii) dissolving particles of the polished object among components of the polished object contained in the abrasive slurry; and (iii) filtering the abrasive slurry to collect the abrasive, in which the steps (i) to (iii) are carried out without a pH adjuster to remove components of the polished object to collect the abrasive. 1. A method for collecting an abrasive from an abrasive slurry which has been used for polishing an object including silicon as a main component , the method at least comprising:(i) adding a solvent to the abrasive slurry;(ii) dissolving particles of the polished object among components of the polished object contained in the abrasive slurry; and(iii) filtering the abrasive slurry to collect the abrasive,wherein the steps (i) to (iii) are carried out without a pH adjuster to remove components of the polished object to collect the abrasive.2. The method according to claim 1 , wherein an amount of the solvent added in the steps (i) and (ii) is adjusted in accordance with a concentration of the components of the polished object contained in the abrasive slurry.3. The method according to claim 2 , wherein the solvent is added to the abrasive slurry so that the concentration of the components of the polished object becomes claim 2 , at the most claim 2 , 1.8 times a saturation solubility of the polished object.4. The method according to claim 1 , wherein claim 1 , in the step (ii) claim 1 , heating is carried out after the solvent is added to the abrasive slurry.5. The method according to claim 4 , wherein the heating is carried out so that a temperature of the abrasive slurry comes within a range between 40° C. and 90° C. The present invention relates to a method for collecting an abrasive. In particular, it relates to a method for collecting an abrasive ...

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04-03-2021 дата публикации

Lapping Tool

Номер: US20210060724A1
Автор: Cloutier Daniel R.
Принадлежит:

Lapping tools are provided that include at least one angled feature that forms at least one surface angle with the lapping surface. In some examples, angled features may include a first surface angle and a second surface angle. Each surface angle of the angled feature is configured to retain abrasive grit and provide a desired type of finish. 1. A lapping tool comprising a lapping surface , wherein the lapping surface includes at least one angled feature that forms at least one surface angle with the lapping surface , the at least one angled feature being configured to receive abrasive grit , and the at least one surface angle being selected according to a finish type to be imparted onto a workpiece by the lapping tool.2. The lapping tool of claim 1 , wherein the lapping tool comprises a lapping sleeve claim 1 , and the lapping sleeve includes the at least one angled feature.3. The lapping tool of claim 1 , wherein the lapping tool is a flat lapping tool.4. The lapping tool of claim 1 , wherein the at least one surface angle is configured as an optimum lapping angle.5. The lapping tool of claim 1 , wherein the at least one angled feature forms a first surface angle with the lapping surface and a second surface angle with the lapping surface.6. The lapping tool of claim 5 , wherein the first surface angle is oriented to provide a first finish when the lapping tool is moved in a first direction claim 5 , and the second surface angle is oriented to provide a second finish when the lapping tool is moved in a second direction.7. The lapping tool of claim 6 , wherein the lapping tool is a flat lapping tool.8. The lapping tool of claim 1 , wherein the at least one angled feature is a helical groove.9. The lapping tool of claim 1 , wherein the lapping tool comprises a first angled feature and a second angled feature.10. The lapping tool of claim 9 , wherein the first angled feature is a right-handed helical groove claim 9 , and the second angled feature is a left-handed ...

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28-02-2019 дата публикации

PLATEN STOPPER

Номер: US20190061094A1

A stopper includes a head portion sized and configured to be coupled to an upper platen of a chemical-mechanical planarization system and a stopper leg sized and configured to direct a flow of liquid slurry applied to an upper planar surface of the upper platen substantially away from a lower surface of the upper platen. 1. A stopper for a wet platen , comprising;a head portion sized and configured to be coupled to an upper platen of a chemical-mechanical planarization system: anda stopper leg extending from the head portion, wherein the stopper leg is sized and configured to direct a flow of liquid slurry applied to an upper planar surface of the upper platen substantially away from a lower surface of the upper platen.2. The stopper of claim 1 , wherein the head portion comprises:a top section extending from a first end to a second end; anda first side leg extending at a first angle from the first end of the top section.3. The stopper of claim 2 , wherein the first angle is equal to 90°.4. The stopper of claim 2 , wherein the stopper leg extends at the second end of the top section.5. The stopper of claim 2 , comprising a second side leg extending at a second angle from the second end of the top section.6. The stopper of claim 5 , wherein the second angle is equal to the first angle.7. The stopper of claim 5 , wherein the stopper leg extends from the second side leg at a third angle such that the stopper leg is substantially perpendicular to the top section of the head portion.8. The stopper of claim 1 , wherein the head portion is sized and configured to be received within a cavity defined in the lower surface of the upper platen.9. The stopper of claim 1 , wherein the stopper leg is configured to direct the flow of liquid slurry in a direction substantially perpendicular to the lower surface of the upper platen.10. The stopper of claim 1 , wherein the head portion is tapered.11. A system claim 1 , comprising: a platen having an upper planar surface and a lower ...

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17-03-2022 дата публикации

POLISHING LIQUID SUPPLY DEVICE

Номер: US20220080552A1
Принадлежит:

Provided is a polishing liquid supply device capable of selectively supplying a plurality of different polishing liquids to a vessel for storing the polishing liquid used in a polishing apparatus. The polishing liquid supply device includes a plurality of ejection nozzles provided according to the plurality of different polishing liquids, a sensor that detects a position corresponding to one of the plurality of ejection nozzles at which a supplied port of the vessel is disposed, a storage device that stores information concerning the polishing liquid selected from the plurality of polishing liquids, and a processing device that performs a control to eject the polishing liquid from the ejection nozzle corresponding to the polishing liquid indicated by the information stored in the storage device. 1. A polishing liquid supply device capable of selectively supplying a plurality of different polishing liquid to a vessel for storing the polishing liquid used in a polishing apparatus , the polishing liquid supply device comprising:a plurality of ejection nozzles provided according to the plurality of different polishing liquids;a sensor that detects a position corresponding to one of the plurality of ejection nozzles at which a supplied port of the vessel is disposed;a storage device that stores information concerning the polishing liquid selected from the plurality of polishing liquids; anda processing device that performs a control to eject the polishing liquid from the ejection nozzle corresponding to the polishing liquid indicated by the information stored in the storage device in a case where the ejection nozzle corresponding to the polishing liquid indicated by the information stored in the storage device and a position of the supplied port of the vessel detected by the sensor correspond to each other.2. The polishing liquid supply device according to claim 1 , further comprising:a fitting member that is fitted in a recess provided at a bottom portion of the vessel ...

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09-03-2017 дата публикации

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

Номер: US20170066101A1
Автор: YAMAGUCHI Kuniaki
Принадлежит:

The present invention relates to a substrate processing system and a substrate processing method capable of cleaning a processing-liquid supply line. A substrate processing system includes: a substrate processing apparatus () configured to process a substrate W; and a flushing device for cleaning a distribution line () and a processing-liquid supply line (). The flushing device includes: a cleaning-liquid supply line () coupled to the distribution line (); a drain mechanism () configured to direct a cleaning liquid, supplied into the processing-liquid supply line () through the distribution line (), to a liquid disposal area (); a supply switching valve () configured to allow only the processing liquid or the cleaning liquid to flow in the distribution line (); and an operation controller () configured to control operations of the drain mechanism () and the supply switching valve (). 1. A substrate processing system comprising:a substrate processing apparatus configured to process a substrate while directly or indirectly supplying a processing liquid from a processing-liquid supply nozzle onto the substrate, the processing-liquid supply nozzle being coupled to a processing-liquid supply line;a distribution line that couples the processing-liquid supply line to a processing-liquid supply source; and a cleaning-liquid supply line coupled to the distribution line;', 'a drain mechanism configured to direct a cleaning liquid, supplied into the processing-liquid supply line through the distribution line, to a liquid disposal area;', 'a supply switching valve attached to the distribution line and the cleaning-liquid supply line, the supply switching valve being configured to allow only the processing liquid or the cleaning liquid to flow into the distribution line; and', 'an operation controller configured to control operations of the drain mechanism and the supply switching valve,, 'a flushing device configured to clean the distribution line and the processing-liquid ...

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12-03-2015 дата публикации

UNIT CONTROL PANEL, SUBSTRATE TRANSFER TEST METHOD, AND SUBSTRATE PROCESSING APPARATUS

Номер: US20150071742A1
Принадлежит:

It is an object of the embodiment of the invention to enhance the work efficiency of a substrate transfer test between a plurality of units. A test control section (CPU) which is provided in a loading/unloading unit performs a substrate transfer test for the loading/unloading unit alone by receiving a wafer mounted on a substrate table or which is installed outside the loading/unloading unit and transporting the wafer into the loading/unloading unit by a transport mechanism or transporting a wafer placed in the loading/unloading unit to a substrate table and mounting the wafer on the substrate table by the transport mechanism while the loading/unloading unit is not assembled together with the cleaning unit and the polishing unit. 1. A unit control panel provided in at least one of units of a substrate processing apparatus , the substrate processing apparatus processing a substrate with transferring the substrate between the units assembled together , comprisinga test control section configured to perform a substrate transfer test for a unit provided with the unit control panel using a substrate table which is installed outside the unit while the unit is not assembled together with another unit.2. The unit control panel according to claim 1 , whereinthe test control section performs the substrate transfer test by transporting the substrate placed in the unit to the substrate table and mounting the substrate on the substrate table by a substrate transport mechanism which is provided in the unit or receiving the substrate mounted on the substrate table and transporting the substrate into the unit by the transport mechanism.3. The unit control panel according to claim 1 , whereinthe substrate table is installed for the substrate transfer test at a location where a substrate transfer section of another unit which is used at a time of transfer of the substrate between the unit and another unit is located when the unit and another unit are assembled together.4. The unit ...

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05-03-2020 дата публикации

WET CHEMICAL HEATING SYSTEM AND A METHOD OF CHEMICAL MECHANICAL POLISHING

Номер: US20200070301A1
Принадлежит:

The present disclosure provides a wet chemical heating system, including a first conduit for transporting wet chemical, a dispensing head connected to the first conduit, and a radiative heating element configured to heat the wet chemical in the first conduit and positioned at an upper stream of the dispensing head. 1. A wet chemical heating system , comprising:a first conduit for transporting wet chemical;a dispensing head connected to the first conduit; anda radiative heating element configured to heat the wet chemical in the first conduit and positioned at an upper stream of the dispensing head.2. The wet chemical heating system of claim 1 , wherein the radiative heating element comprises a microwave source.3. The wet chemical heating system of claim 1 , wherein the radiative heating element comprises an infrared light source.4. The wet chemical heating system of claim 1 , further comprising a temperature control unit communicatively coupling with the radiative heating element.5. The wet chemical heating system of claim 1 , further comprising a second conduit transporting DI water.6. The wet chemical heating system of claim 1 , wherein the first conduit is composed of fluoropolymers.7. A heating device for heating chemical mechanical polishing (CMP) slurry claim 1 , comprising:a CMP platen;a slurry conduit, configured to transport a CMP slurry and dispense the CMP slurry on the CMP platen; anda first radiative heating element configured to heat the CMP slurry.8. The heating device for heating CMP slurry of claim 7 , wherein the first radiative heating element is positioned at an upper stream of the slurry conduit to heat the CMP slurry in the slurry conduit.9. The heating device for heating CMP slurry of claim 7 , further comprising a second radiative heating element claim 7 , configured to heat the CMP platen to a temperature less than or equal to 75 degree Celsius.10. The heating device for heating CMP slurry of claim 9 , wherein the first radiative heating ...

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05-03-2020 дата публикации

SLURRY RECYCLING FOR CHEMICAL MECHANICAL POLISHING SYSTEM

Номер: US20200070308A1
Автор: Liu Wen-Kuei

The present disclosure describes an apparatus and a method for a chemical mechanical polishing (CMP) process that recycles used slurry as another slurry supply. The apparatus includes a pad on a rotation platen, a first feeder and a second feeder where each of the first and the second feeder is configured to dispense a slurry on the pad, and a flotation module configured to process a first fluid sprayed from the pad. The flotation module further includes an outlet fluidly connected to the second feeder and configured to output a second fluid, and a first tank configured to store a plurality of chemicals where the plurality of chemicals include a frother and a collector configured to chemically bond with chemicals in the first fluid. 1. A polishing system , comprising:a pad on a rotating platen;a first feeder and a second feeder, wherein each of the first and the second feeder is configured to dispense a slurry on the pad; and an outlet fluidly connected to the second feeder and configured to output a second fluid; and', 'a first tank configured to store a plurality of chemicals, wherein the plurality of chemicals comprise a frother and a collector configured to chemically bond with chemicals in the first fluid., 'a flotation module configured to process a first fluid generated from the pad, wherein the flotation module comprises2. The polishing system of claim 1 , wherein the second fluid comprises a recycled slurry.3. The polishing system of claim 1 , further comprising a filter module fluidly connected between the second feeder and the outlet and configured to remove particles from the second fluid.4. The polishing system of claim 1 , further comprising a detection module fluidly connected between the outlet and the second feeder claim 1 , wherein the detection module is configured to examine chemical or physical properties of the second fluid.5. The polishing system of claim 1 , wherein the first tank further comprises an inlet and an other outlet claim 1 , ...

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18-03-2021 дата публикации

EXTERNAL HEATING SYSTEM FOR USE IN CHEMICAL MECHANICAL POLISHING SYSTEM

Номер: US20210078129A1
Принадлежит:

A chemical mechanical polishing (CMP) system includes a polishing pad configured to polish a substrate. The CMP system further includes a heating system configured to adjust a temperature of the polishing pad. The heating system comprises at least one heating element spaced apart from the polishing pad. The CMP system further includes a sensor configured to measure the temperature of the polishing pad. 1. A chemical mechanical polishing (CMP) system , comprising:a polishing pad configured to polish a substrate;a heating system configured to adjust a temperature of the polishing pad, wherein the heating system comprises at least one heating element spaced apart from the polishing pad; anda sensor configured to measure the temperature of the polishing pad.2. The CMP system of claim 1 , wherein the heating system is free from physical contact with the polishing pad.3. The CMP system of claim 1 , wherein the heating system comprises a single heating element at a side of the polishing pad.4. The CMP system of claim 1 , wherein the heating system comprises a single heating element above the polishing pad.5. The CMP system of claim 1 , wherein the heating system comprises a plurality of heating elements around a perimeter of the polishing pad.6. The CMP system of claim 5 , wherein the plurality of heating elements is evenly spaced apart from each other around the perimeter of the polishing pad.7. The CMP system of claim 5 , wherein at least one of the plurality of heating elements comprises a plurality of heating lamps over a support plate.8. The CMP system of claim 7 , wherein the support plate is square shaped or circular shaped.9. The CMP system of claim 1 , wherein the heating system comprises at least one ceramic lamp or at least one quartz lamp.10. A chemical mechanical polishing (CMP) system claim 1 , comprising:a polishing head configured to hold a substrate during a CMP process;a polishing pad configured to polish the substrate;a slurry delivery system configured ...

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31-03-2022 дата публикации

METHOD AND DEVICE OF CHEMICAL MECHANICAL POLISHING

Номер: US20220097199A1
Автор: SHA Youhe, XIE Yue
Принадлежит: Zing Semiconductor Corporation

The present application provides a method and a device of chemical mechanical polishing (CMP). The method comprises providing a semiconductor wafer to be subjected to polishing; conducting a CMP process to the wafer, wherein the wafer is on a first plane; conducting a hanging treatment, wherein, in the hanging treatment, the wafer is on a second plane above the first plane, the wafer is hanged to expose the lower surface, and the wafer is in rotation. According to the present application, the hanging treatment can remove the slurry, the polishing particles and byproducts from the wafer surface, therefore, it prevents from the adverse effects caused by the polishing particles and byproducts on the wafer in the following process. 1. A method of chemical mechanical polishing (CMP) comprising:providing a semiconductor wafer to be subjected to polishing;conducting a CMP process to the wafer, wherein the wafer is on a first plane during the CMP process;conducting a hanging treatment, wherein, in the hanging treatment, the wafer is on a second plane above the first plane, the wafer is hanged to expose the lower surface, and the wafer is in rotation.2. The method of claim 1 , wherein the wafer is at a first position of the first plane during the CMP process claim 1 , and at a second position above the first position during the hanging treatment.3. The method of claim 2 , wherein the CMP process comprises a first CMP process and a second CMP process claim 2 , and the hanging treatment comprises a first hanging treatment conducted after the first CMP process and before the second CMP process.4. The method of claim 3 , wherein the first CMP process is stock polishing claim 3 , and the second CMP process is fine polishing.5. The method of claim 3 , wherein the hanging treatment further comprises a second hanging treatment conducted after the second CMP process.6. The method of claim 1 , further comprising a washing step for the semiconductor wafer claim 1 , wherein the second ...

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29-03-2018 дата публикации

Grinding Booth Assembly and Method for Grinding a Work Piece

Номер: US20180085883A1
Принадлежит:

A portable booth assembly for receiving a work piece to facilitate working on a work area of the work piece including a housing and an inner core disposed within an interior area of the housing is provided. The portable booth assembly includes an aperture that is formed in the housing and the inner core. The aperture is configured to receive the work piece. The inner core defining the aperture is configured to be supported by the work piece if the work piece is large, or support the work piece if the work piece is small, and isolate the work area within the portable booth assembly. The portable booth assembly further includes a cut out formed in the housing. The cut out is configured to enable access to the work area for working on the work area. 1. A portable booth assembly for receiving a work piece to facilitate working on a work area of the work piece comprising:a housing, wherein said housing defines an interior area;an inner core disposed within said interior area;an aperture formed in said housing and said inner core, wherein said aperture is configured to receive said work piece, wherein said inner core defining said aperture is configured to support said work piece and isolate said work area within said portable booth assembly; anda cut out formed in said housing, wherein said cut out is configured to enable access to said work area for working on said work area.2. The portable booth assembly of wherein said housing and said inner core are configured to be in fluid communication with a vacuum source such that a vacuum is created at the work area through operation of said vacuum source to vacuum dirt and fumes generated from working on said work area.3. The portable booth assembly of wherein said inner core has a density that is higher at a periphery of said inner core than the density of the other portions of said inner core.4. The portable booth assembly of wherein said inner core is axially spaced a predetermined gap from said housing to enable the work ...

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31-03-2016 дата публикации

SLURRY DISPERSION SYSTEM WITH REAL TIME CONTROL

Номер: US20160089765A1

A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least one parameter of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the parameter, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry. 1. A slurry dispersion system , comprising:a slurry source system configured to provide a slurry for a chemical mechanical polishing (CMP) process;an in-line analyzer configured to measure at least one parameter of a sampled slurry sampled from the slurry source system and generate an indication signal based on the at least one parameter, wherein the indication signal indicates at lease one characteristic of the slurry; anda controller configured to receive the indication signal and generate a control signal based on the indication signal, thereby performing a real time control on the slurry dispersion system for controlling quality of the slurry.2. The slurry dispersion system of claim 1 , wherein the at least one parameter comprises a large particle counts (LPC) value claim 1 , and the in-line analyzer is configured to analyze the LPC value of the sampled slurry and compare the LPC value with a first predetermined threshold claim 1 , thereby generating the indication signal.3. The slurry dispersion system of claim 1 , wherein the at least one parameter comprises an abrasive concentration value claim 1 , and the in-line analyzer is configured to analyze the abrasive concentration value of the sampled slurry and determine whether the abrasive concentration value is in a predetermined ...

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29-03-2018 дата публикации

TREATMENT COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, AND CLEANING METHOD

Номер: US20180086943A1
Принадлежит: JSR Corporation

A treatment composition for chemical mechanical polishing includes: (A) a water-soluble amine; (B) a water-soluble polymer having an aromatic hydrocarbon group-containing repeating unit; and an aqueous medium. The treatment composition for chemical mechanical polishing preferably further includes (C) an organic acid having an aromatic hydrocarbon group and has a pH of 9 or more. 1: A treatment composition , comprising:(A) a water-soluble amine;(B) a water-soluble polymer comprising an aromatic hydrocarbon group-containing repeating unit, andan aqueous medium.2: The treatment composition according to claim 1 , further comprising (C) an organic acid comprising an aromatic hydrocarbon group.3: The treatment composition according to claim 1 , wherein the treatment composition has a pH of 9 or more.4: The treatment composition according to claim 1 , wherein the component (A) comprises at least one amine selected from the group consisting of alkanolamines claim 1 , hydroxylamine claim 1 , morpholine claim 1 , morpholine derivatives claim 1 , piperazine claim 1 , and piperazine derivatives.5: The treatment composition according to claim 1 , wherein the component (B) comprises a polymer comprising a structural unit derived from alkyl group-substituted or unsubstituted styrene.6: The treatment composition according to claim 2 , wherein the component (C) comprises at least one selected from the group consisting of phenylsuccinic acid claim 2 , phenylalanine claim 2 , benzoic acid claim 2 , phenyllactic acid claim 2 , and naphthalenesulfonic acid.7: A treatment method claim 1 , comprising treating a surface of a wiring board with the treatment composition according to claim 1 , a wiring material comprising copper or tungsten; and', 'a barrier metal material comprising at least one selected from the group consisting of tantalum, titanium, cobalt, ruthenium, manganese, and compounds thereof., 'wherein the wiring board comprises, on the surface to be treated8: The treatment ...

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30-03-2017 дата публикации

Ultrasonic polishing systems and methods of polishing brittle components for electronic devices

Номер: US20170087687A1
Принадлежит: Apple Inc

Ultrasonic polishing systems and methods of polishing brittle components for electronic devices using ultrasonic polishing systems are disclosed. The ultrasonic polishing system may include an ultrasonic driver and a polishing head operatively coupled to the ultrasonic driver. The ultrasonic drive may have a surface shape that corresponds to a non-planar feature formed in the brittle component. The ultrasonic polishing system may also include an abrasive slurry configured to be disposed between the non-planar feature of the brittle component and the polishing head. The ultrasonic driver may be configured to displace the polishing head toward and away from the non-planar feature formed in the brittle component.

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19-03-2020 дата публикации

Chemical Mechanical Polishing Apparatus and Methods

Номер: US20200086452A1
Принадлежит:

A substrate polishing apparatus is disclosed that includes a polishing platform having two or more zones, each zone adapted to receive a different slurry component. A substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects. 2521. The apparatus of claim , comprising a rinsing liquid source to provide a rinsing liquid , and wherein the dispenser is configured to distribute the rinsing liquid to the polishing pad.26. The apparatus of claim 25 , wherein the dispenser is configured to distribute the rinsing liquid to a different third zone on the polishing pad.27. The apparatus of claim 26 , wherein the third zone is located between the first zone and the second zone.2821. The apparatus of claim claim 26 , comprising a controller configured to cause the dispenser to deliver the plurality of different slurry components concurrently to the polishing pad.29. A chemical mechanical polishing apparatus claim 26 , comprising:a platen to support a polishing pad;a carrier head to hold a substrate in contact with the polishing pad;a plurality of slurry component supplies to provide a plurality of different slurry components, each respective slurry component including exactly one from i) an abrasive and/or etchant, ii) an oxidizer, or iii) a corrosion inhibitor; anda dispenser configured to distribute the plurality of different slurry components to a plurality of different zones on the polishing pad.30. The apparatus of claim 29 , wherein the dispenser comprises a plurality of separate distributor heads including one distributor head for each slurry component.31. ...

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19-03-2020 дата публикации

NON-CONTACT ROTARY UNION

Номер: US20200086453A1
Автор: Golubovsky Edward
Принадлежит:

Embodiments described herein relate to rotary unions for use in wafer cleaning processes. The rotary union includes a process media and a supporting media that interact in a gap between a nozzle and rotary element. By regulating the supporting media pressure, a non-contact seal is created within the gap. The non-contact seal prevents or controls process media leakage in a rotary union while enabling delivery of the process media through a platen directly underneath of a wafer without the risk of additional contamination of the process media, reducing the defect to the wafer. Additionally, the non-contact seal precludes particle generation due to seal wear, caused for example in face seals, and does not leech out any additional foreign elements. 1. A rotary union , comprising:a rotary element rotationally coupled to a stationary element by a bearing, wherein a surface of the rotary element is spaced a distance from a first surface of the stationary element to form a first gap, and a nozzle region that has an external surface disposed at one end of the nozzle region;', 'a first channel that extends through the nozzle region and the external surface of the nozzle region; and', 'a second channel that is in fluid communication with a first plenum, wherein the first plenum is defined by one or more surfaces of the stationary element and one or more surfaces of the rotary element, and the first plenum is in fluid communication with the space formed within the first gap., 'wherein the stationary element comprises2. The rotary union of claim 1 , further comprising a seal positioned between the stationary element and the rotary element claim 1 , wherein the first plenum is disposed between the space formed within the first gap and the seal.3. The rotary union of claim 2 , wherein the seal is a labyrinth seal that comprises a plurality of regularly spaced features.4. The rotary union of claim 2 , wherein the stationary element comprises a plastic material.5. The rotary union ...

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19-03-2020 дата публикации

METHODS FOR A WEB-BASED CMP SYSTEM

Номер: US20200086456A1
Принадлежит:

Embodiments of the present disclosure generally provide methods, polishing systems with computer readable medium having the methods stored thereon, to facilitate consistent tensioning of a polishing article disposed on a web-based polishing system. In one embodiment, a substrate processing method includes winding a used portion of a polishing article onto a take-up roll of a polishing system by rotating a first spindle having the take-up roll disposed thereon; measuring, using an encoder wheel, a polishing article advancement length of the used portion of the polishing article wound onto the take-up roll; determining a tensioning torque to apply to a supply roll using the measured polishing article advancement length; and tensioning the polishing article by applying the tensioning torque to the supply roll. 1. A substrate processing method , comprising:winding a used portion of a polishing article onto a take-up roll of a polishing system by rotating a first spindle having the take-up roll disposed thereon;measuring, using an encoder wheel, a polishing article advancement length of the used portion of the polishing article wound onto the take-up roll;determining a tensioning torque to apply to a supply roll using the polishing article advancement length measurement; andtensioning the polishing article by applying the tensioning torque to the supply roll.2. The method of claim 1 , wherein the polishing system comprises:a take-up roll assembly comprising a first spindle, the take-up roll disposed on the first spindle, a first actuator coupled to the first spindle, and the encoder wheel; anda supply roll assembly comprising a second spindle, the supply roll disposed on the second spindle, and a second actuator coupled to the second spindle,wherein the polishing article extends between the take-up roll and the supply roll in a machine direction, andwherein the polishing article advancement length is measured in the machine direction.3. The method of claim 2 , wherein ...

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05-04-2018 дата публикации

Processing apparatus

Номер: US20180093361A1
Автор: Satoshi Yamanaka
Принадлежит: Disco Corp

Disclosed herein is a carrying mechanism that carries a plate-shaped workpiece in which a substrate larger than a wafer in area is stacked on a lower surface of the wafer. The carrying mechanism includes a carrying pad for covering an upper surface of the wafer, holding sections for holding the substrate on outside of the outer periphery of the wafer, and a water supply source for supplying water to the wafer. The carrying mechanism forms a predetermined gap between the lower surface of the carrying pad and the upper surface of the wafer, and carries the plate-shaped workpiece in a condition where the gap is supplied with a predetermined amount of water.

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12-05-2022 дата публикации

POLISHING HEAD WITH LOCAL WAFER PRESSURE

Номер: US20220143779A1
Принадлежит:

A polishing system includes a carriage arm having an actuator disposed on a lower surface thereof. The actuator includes a piston and a roller coupled to a distal end of the piston. The polishing system includes a polishing pad and a substrate carrier suspended from the carriage arm and configured to apply a pressure between a substrate and the polishing pad. The substrate carrier includes a housing, a retaining ring, and a membrane. The substrate carrier includes an upper load ring disposed in the housing. The roller of the actuator is configured to contact the upper load ring during relative rotation between the substrate carrier and the carriage arm. The actuator is configured to apply a load to a portion of the upper load ring thereby altering the pressure applied between the substrate and the polishing pad. 1. A substrate carrier configured to be attached to a polishing system for polishing a substrate , the substrate carrier comprising:a housing;a retaining ring coupled to the housing; a bottom portion configured to contact the substrate;', 'an upper portion opposite the bottom portion; and', 'a side portion extending orthogonally between the bottom portion and the upper portion, wherein an outer edge region connects the side portion to the bottom portion; and, 'a membrane assembly disposed within the housing and spanning an inner diameter of the retaining ring, the membrane assembly havingan actuator configured to apply a load to the membrane assembly thereby altering a pressure applied between the substrate disposed in the substrate carrier and a polishing pad.2. The substrate carrier of claim 1 , wherein:the side portion includes an annular recess formed along an outer edge of the side portion;an annular sleeve is disposed in the annular recess; andthe load applied to the membrane assembly is applied to the outer edge region of the membrane via the annular sleeve.3. The substrate carrier of claim 2 , wherein the actuator comprises a piston that engages the ...

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14-04-2016 дата публикации

METHOD OF PRODUCING POLISHING HEAD AND POLISHING APPARATUS

Номер: US20160101503A1
Принадлежит:

A method of producing a polishing head including: a backing pad, for holding a workpiece back surface, stuck on a lower portion of a rigid body; and a ring template, for holding a workpiece edge, disposed on a lower surface of the backing pad. This polishing head brings a front surface of the workpiece into sliding contact with a polishing pad attached on a turn table while holding the workpiece back surface on the lower surface of the backing pad. The method includes sticking the backing pad on the lower portion of the rigid body with a double-sided tape under a reduced pressure without heating; and sticking the template on the backing pad with a double-sided tape or a liquid or paste reaction curable adhesive containing no solvent under a reduced pressure without heating. This method can polish the workpiece into a very flat workpiece. 14-. (canceled)5. A method of producing a polishing head including: a backing pad that is configured to hold a back surface of a workpiece and stuck on a lower portion of a rigid body; and a ring template that is configured to hold an edge of the workpiece and disposed on a lower surface of the backing pad , the polishing head being configured to bring a front surface of the workpiece into sliding contact with a polishing pad attached on a turn table while holding the back surface of the workpiece on the lower surface of the backing pad , the method comprising:sticking the backing pad on the lower portion of the rigid body with a double-sided tape under a reduced pressure without heating the backing pad; andsubsequently sticking the template on the backing pad with a double-sided tape or a liquid or paste reaction curable adhesive containing no solvent under a reduced pressure without heating the template.6. The method according to claim 5 , wherein the step of sticking the backing pad includes sticking the backing pad by pressing the backing pad with a pressing component made of a porous material claim 5 , and/or the step of ...

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26-03-2020 дата публикации

High Oxide VS Nitride Selectivity, Low And Uniform Oxide Trench Dishing In Shallow Trench Isolation(STI) Chemical Mechanical Planarization Polishing(CMP)

Номер: US20200095502A1
Принадлежит: Versum Materials US LLC

Present invention provides Chemical Mechanical Planarization Polishing (CMP) compositions for Shallow Trench Isolation (STI) applications. The CMP compositions contain ceria coated inorganic oxide particles as abrasives, such as ceria-coated silica particles or any other ceria-coated inorganic oxide particles as core particles; suitable chemical additives comprising at least one organic carboxylic acid group, at least one carboxylate salt group or at least one carboxylic ester group and two or more hydroxyl functional groups in the same molecule; and a water soluble solvent; and optionally biocide and pH adjuster; wherein the composition has a pH of 2 to 12, preferably 3 to 10, and more preferably 4 to 9.

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02-06-2022 дата публикации

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING PHOTOCATALYST

Номер: US20220168866A1
Автор: Baba Erina, KOBATA Itsuki
Принадлежит:

Provided is an apparatus and a method that allow a control of a removal amount at an atomic level and allow a selective removal from a projecting portion of a process target. 1. A substrate processing apparatus comprising:a table for holding a substrate;a nozzle for supplying a process liquid to a surface to be processed of the substrate held onto the table;a head for holding a photocatalyst;a conditioner for conditioning the photocatalyst;a first moving mechanism for moving the head in a direction perpendicular to a surface of the table; anda second moving mechanism for moving the head between the table and the conditioner.2. The substrate processing apparatus according to claim 1 , whereinthe conditioner includes a conditioning tank for holding the process liquid, andthe conditioning tank has a dimension enough to accept the photocatalyst held onto the head.3. The substrate processing apparatus according to claim 1 , comprisinga first light source for emitting a light including a first wavelength for exciting the photocatalyst wherein a base transparent to the first wavelength;', 'the photocatalyst held onto a surface of the base; and', 'an optical system for directing the light emitted from the first light source to the photocatalyst from a back surface of the base., 'the head includes4. The substrate processing apparatus according to claim 3 , whereinthe optical system is configured to uniformly irradiate the photocatalyst held onto the surface of the base with the light.5. The substrate processing apparatus according to claim 3 , comprisinga light introduction path for introducing the light from the first light source to the head.6. The substrate processing apparatus according to claim 3 , whereinthe head includes the first light source.7. The substrate processing apparatus according to claim 1 , whereinthe first light source includes a plurality of light sources, and the first light source has a plurality of regions and is configured to adjust an optical ...

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29-04-2021 дата публикации

Small batch polishing fluid delivery for cmp

Номер: US20210122008A1
Принадлежит: Applied Materials Inc

In one embodiment, a fluid delivery apparatus includes a vessel body having a first chamber and a second chamber disposed therein, a plurality of first delivery lines fluidly coupled to the first chamber, a dispense nozzle fluidly coupled to the second chamber, a second delivery line fluidly coupled to the second chamber, and a valve disposed between the first and second chambers. Here, fluid communication between the first chamber and the second chamber is controlled by the valve disposed therebetween. Polishing fluid components are flowed into the first chamber through the plurality of first delivery lines fluidly coupled thereto to form a batch of polishing fluid. Once formed, the batch of polishing fluid is transferred to the second chamber by opening the valve. Typically, the valve is then closed and the transferred batch can be delivered to a polishing pad through the dispense nozzle fluidly coupled to the second chamber, often by pressurizing the second chamber using pressurized gas delivered thereinto through the second delivery line.

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30-04-2015 дата публикации

Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning

Номер: US20150114430A1
Принадлежит: Applied Materials Inc

In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substrate; and (3) a swing arm coupled to the buff pad and configured to position and rotate the buff pad along the front side of the substrate, and control an amount of force applied by the buff pad against the front side of the substrate during cleaning. The substrate chuck, buff pad assembly and swing arm are configured to buff clean the substrate. Numerous additional aspects are disclosed.

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02-04-2020 дата публикации

COMPONENTS FOR A CHEMICAL MECHANICAL POLISHING TOOL

Номер: US20200101581A1
Автор: ATTUR Sreenidhi
Принадлежит:

A component in a CMP tool disclosed herein having a surface and a hydrophobic layer deposited on the surface. In one example, the component is a component for delivering a fluid in a CMP tool. The component for delivering a fluid in a CMP tool includes an elongated member having a first end and a second end, and an elongated upper surface extending between the two ends. A hydrophobic layer is deposited on the elongated upper surface. In another example, the component is a ring shaped body having an upper side and a lower side. A hydrophobic layer is deposited on the inner surfaces of both the upper and lower sides. In another example, the component is a disk shaped body having a top surface, bottom surface, and ledge defined by the top and bottom surfaces. A hydrophobic layer is deposited on the surfaces and the ledge. 2. The component of claim 1 , wherein the second hydrophobic layer has a contact angle of 140°.3. The component of claim 1 , wherein the second hydrophobic layer has a thickness of at least 400 nm.4. The component of claim 3 , wherein the thickness of the second hydrophobic layer is 1600 nm.5. The component of claim 1 , wherein the first hydrophobic layer has a contact angle of 140°.6. The component of claim 1 , wherein the first hydrophobic layer has a thickness of at least 400 nm.7. The component of claim 6 , wherein the thickness of the first hydrophobic layer is 1600 nm.8. A component in a CMP tool claim 6 , the component comprising: a top surface;', 'a bottom surface, wherein the bottom surface is substantially parallel to the top surface;', an outer diameter;', 'a first end, the first end of the outer wall integral with the bottom surface; and', 'a second end opposite the first end;, 'an outer wall, the outer wall perpendicular to the bottom surface, wherein the outer wall further comprises, an inner diameter, wherein the inner diameter is less than the outer diameter;', 'a first end; and', 'a second end, the second end of the inner wall ...

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02-04-2020 дата публикации

SYSTEM AND METHOD OF CHEMICAL MECHANICAL POLISHING

Номер: US20200101582A1
Принадлежит:

A system controls a flow of a chemical mechanical polish (CMP) slurry into a chamber to form a slurry reservoir within the chamber. Once the slurry reservoir has been formed within the chamber, the system moves a polishing head to position and force a surface of a wafer that is attached to the polishing head into contact with a polishing pad attached to a platen within the chamber. A wafer/pad interface is formed at the surface of the wafer forced into contact with the polishing pad and the wafer/pad interface is disposed below an upper surface of the slurry reservoir. During CMP processing, the system controls one or more of a level, a force, and a rotation of the platen, a position, a force and a rotation of the polishing head to conduct the CMP processing of the surface of the wafer at the wafer/pad interface. 1. A method , comprising:attaching a semiconductor wafer to a polishing head within a chamber;placing a polishing pad on a platen within the chamber;flowing a slurry into the chamber to form a slurry reservoir; andperforming a chemical mechanical polishing process at an interface between a surface of the semiconductor wafer and the polishing pad, the interface being below an upper surface of the slurry reservoir.2. The method of claim 1 , further comprising raising the surface of the slurry reservoir to cover a surface of the polishing pad prior to the performing the chemical mechanical polishing process.3. The method of claim 1 , further comprising lowering the polishing head into the slurry reservoir to form the interface.4. The method of claim 1 , further comprising lowering the polishing head to cover a surface of the polishing pad with the slurry prior to the performing the chemical mechanical polishing process.5. The method of claim 4 , further comprising lowering the polishing head into the slurry reservoir to form the interface.6. The method of claim 1 , further comprising:purging the slurry from the chamber; andflowing a cleaning solution into the ...

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11-04-2019 дата публикации

ADVANCED FLUID PROCESSING METHODS AND SYSTEMS

Номер: US20190105620A1
Принадлежит:

This disclosure features methods of forming chemical compositions. The method includes (1) mixing a plurality of continuous material flows in a mixing tank to form a chemical composition, each continuous material flow including at least one component of the composition; and (2) moving a continuous flow of the chemical composition to a packaging station downstream of the mixing tank. The mixing and moving steps are performed continuously. This disclosure also features systems that can be used to perform such methods. 1. A method of forming a chemical composition , the method comprising:mixing a plurality of continuous material flows in at least one mixing tank to form a chemical composition, each continuous material flow comprising at least one component of the chemical composition; andmoving a continuous flow of the chemical composition to a packaging station downstream of the at least one mixing tank;wherein the mixing and moving steps are performed continuously,wherein the material and chemical composition flows are in an in-process steady state; andwherein the mixing step in the at least one mixing tank comprises at least one mixing method selected from the group consisting of turbulent mixing of the material flows, mechanical agitation of the material flows, recirculation of the chemical composition, and a combination thereof.2. The method of claim 1 , further comprising obtaining a material flow having a substantially constant flow rate prior to the mixing step.3. The method of claim 2 , wherein obtaining a material flow having a substantially constant flow rate comprises continuous recirculation of the material flow in a material tank through at least one fluid transfer unit and at least one flow control unit until a predetermined flow rate is reached.4. The method of claim 1 , further comprising performing an in-process quality control measurement of the chemical composition in the mixing tank without interrupting the continuous process.5. The method of claim ...

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10-07-2014 дата публикации

Substrate cleaning apparatus and polishing apparatus

Номер: US20140190530A1
Принадлежит: Ebara Corp

A substrate cleaning apparatus capable of preventing a cleaning vessel from being corroded by a chemical liquid while constituting the cleaning vessel with a low-price material is provided. The substrate cleaning apparatus includes: a cleaning vessel for holding a substrate therein; a substrate holder arranged in the cleaning vessel; a chemical liquid nozzle for supplying a chemical liquid onto the substrate held by the substrate holder; and a plurality of cleaning liquid nozzles for supplying a cleaning liquid onto an inner surface of the cleaning vessel. The inner surface of the cleaning vessel has been subjected to a hydrophilization treatment.

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10-07-2014 дата публикации

Substrate cleaning apparatus and polishing apparatus

Номер: US20140190633A1
Принадлежит: Ebara Corp

A substrate cleaning apparatus capable of efficiently cleaning a substrate, such as a wafer, is provided. The substrate cleaning apparatus includes: a substrate holder for holding and rotating a substrate; a chemical liquid nozzle for supplying a chemical liquid onto the substrate; a two-fluid nozzle for supplying a two-fluid jet onto the substrate; and a moving mechanism for moving the chemical liquid nozzle and the two-fluid nozzle together from a center to a periphery of the substrate. The chemical liquid nozzle and the two-fluid nozzle are adjacent to each other with a predetermined distance therebetween, and the chemical liquid nozzle is located forward of the two-fluid nozzle with respect to a movement direction of the chemical liquid nozzle and the two-fluid nozzle.

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30-04-2015 дата публикации

SLURRY FEED SYSTEM AND METHOD OF PROVIDING SLURRY TO CHEMICAL MECHANICAL PLANARIZATION STATION

Номер: US20150117135A1

A slurry feed system includes a valve manifold, a mixing tank, a slurry feed pump, a surface tension meter and suction piping, discharge piping as well as slurry return piping. The valve manifold includes inlet piping, outlet piping fluidly coupled to the inlet piping, and a slurry discharge header for supplying slurry to CMP stations. The slurry feed pump is connected to the mixing tank by the suction piping. The discharge piping is routed from the slurry feed pump to the inlet piping of the valve manifold. The slurry return piping is routed from the outlet piping of the valve manifold to the mixing tank. The suction piping, the discharge piping, the inlet piping, the outlet piping and the slurry return piping define a first slurry supply loop. The surface tension meter is coupled to the first slurry supply loop. 1. A slurry feed system for chemical mechanical planarization (CMP) in a semiconductor fabrication facility , the system comprising: inlet piping;', 'outlet piping fluidly coupled to the inlet piping; and', 'a slurry discharge header for supplying slurry to at least one CMP station;, 'a valve manifold comprisinga first mixing tank for preparing dilute slurry;a first slurry feed pump connected to the first mixing tank by first suction piping;first discharge piping routed from the first slurry feed pump to the inlet piping of the valve manifold; andfirst slurry return piping routed from the outlet piping of the valve manifold to the first mixing tank, wherein the first suction piping, the first discharge piping, the inlet piping, the outlet piping and the first slurry return piping define a first slurry supply loop, anda surface tension meter coupled to the first slurry supply loop.2. The slurry feed system according to claim 1 , wherein the surface tension meter is capable of providing a signal according a measured surface tension.3. The slurry feed system according to claim 2 , further comprising a programmable logic controller configured to receive the ...

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30-04-2015 дата публикации

Polishing apparatus, method for attaching polishing pad, and method for replacing polishing pad

Номер: US20150118944A1
Принадлежит: Ebara Corp

The work of replacing a polishing pad is easily performed, and thermal damage is prevented from occurring in a polishing table. A polishing apparatus 100 includes a polishing table 110 having an attachment surface 110 a to which a polishing pad 108 used to polish a substrate 102 is attached. The polishing apparatus 100 also includes a silicone layer 111 provided on the attachment surface 110 a of the polishing table 110 and interposed between the polishing table 110 and the polishing pad 108 . By interposing the silicone layer 111 , it is possible to easily detach and attach the polishing pad 108 . In addition, since a heat treatment for coating the silicone layer 111 on the polishing table 110 is performed at a relatively low temperature, it is possible to prevent thermal damage from occurring in the polishing table 110 due to the heat treatment.

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09-06-2022 дата публикации

Polishing method, polishing monitoring method and polishing monitoring apparatus for workpiece

Номер: US20220176513A1
Принадлежит: Ebara Corp

A polishing method capable of accurately determining a thickness of a polishing-target layer without being affected by noises is disclosed. The polishing method for polishing a polishing-target layer of a workpiece includes: rotating a polishing table supporting a polishing pad; polishing the polishing-target layer by pressing the workpiece against the polishing pad; irradiating the workpiece with light; receiving reflected light from the workpiece; measuring an intensity of the reflected light at each of wavelengths; generating a spectral waveform showing a relationship between the intensity and wavelength of the reflected light; performing a Fourier transform process on the spectral waveform to generate a frequency spectrum; moving a peak search range for the frequency spectrum according to a polishing time; determining a peak of the frequency spectrum within the peak search range; and determining a thickness of the polishing-target layer corresponding to the determined peak.

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13-05-2021 дата публикации

SUBSTRATE HOLDING APPARATUS AND METHOD OF MANUFACTURING A DRIVE RING

Номер: US20210138606A1
Принадлежит:

The present invention relates to a substrate holding apparatus used to polish a surface of the substrate by pressing the substrate against a polishing tool, such as a polishing pad. Further, the present invention relates to a method of manufacturing a drive ring used for the substrate holding apparatus. A substrate holding apparatus () includes a polishing head body (), a drive ring () disposed below the polishing head body (), and a retainer ring () fixed to the drive ring (). The drive ring () has an annular contact surface () that contacts the retainer ring (). A flatness in the circumferential direction of the contact surface () is 4.6 μm or less. The flatness represents a difference in a height between the highest position and the lowest position of the contact surface (). 1. A substrate holding apparatus comprising:a polishing head body;a drive ring disposed below the polishing head body; anda retainer ring fixed to the drive ring,wherein the drive ring has an annular contact surface that contacts the retainer ring,the contact surface has a flatness of not more than 4.6 μm in a circumferential direction of the contact surface, andthe flatness represents a difference in a height between a highest position and a lowest position of the contact surface.2. The substrate holding apparatus according to claim 1 , wherein an inner area of the contact surface has a flatness of not more than 4.6 μm in the circumferential direction of the contact surface claim 1 , and the inner area is an area including an innermost edge of the contact surface.3. The substrate holding apparatus according to claim 1 , wherein an outer area of the contact surface has a flatness of not more than 4.6 μm in the circumferential direction of the contact surface claim 1 , and the outer area is an area including an outermost edge of the contact surface.4. The substrate holding apparatus according to claim 1 , wherein an intermediate area of the contact surface has a flatness of not more than 4.6 μ ...

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07-05-2015 дата публикации

DEVICE AND METHOD FOR SEPARATING GRINDING OIL FROM GRINDING SLURRIES

Номер: US20150122739A1
Принадлежит:

An apparatus has a stirred tank with a stirrer movable upwards and downwards. Oil-containing grinding sludge is introduced into the stirred tank by a supply conduit. Separating agent is introduced into the stirred tank for separating the grinding oil from the grinding sludge. The sludge is discharged into a receiving tank via a discharge conduit. In the stirred tank, a movable annular plate is guided to form a seal on a stirrer guide tube and/or on the inner face of the wall of the tank. The plate has a passage for discharging the grinding oil. A discharge conduit for the de-oiled grinding sludge is at the lowest point of the tank. The stirrer achieves a homogeneous mixture of separating agent and grinding sludge, so that the grinding oil can be separated from grinding particles of the sludge. The grinding oil can then float and be removed. 119-. (canceled)2025. Apparatus for separating off grinding oil () from grinding sludge , comprising:{'b': 1', '3', '2, 'a) a stirred tank () with a stirrer () which can be moved upwards and downwards in the stirred tank and is supported in a stirrer guide tube ();'}{'b': 4', '1, 'b) a supply conduit () for oil-containing grinding sludge disposed in the upper region of the stirred tank ();'}{'b': 6', '24', '25', '28', '1, 'c) a supply and discharge conduit () for a separating agent () for separating off the grinding oil () from the grinding sludge and a discharge conduit () for de-oiled grinding sludge, which conduits are disposed in the lower region of the stirred tank ();'}{'b': 9', '1', '5', '4', '6, 'd) an annular plate () which can move upwards and downwards in the stirred tank () between a region above a delivery opening () of the supply conduit () for the oil-containing grinding sludge and a region above the supply and discharge conduit () for the separating agent;'}{'b': 10', '2', '7', '1', '11', '1, 'e) which, as it moves upwards and downwards, slides in a sealing manner on an outer face () of the stirrer guide tube () ...

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07-05-2015 дата публикации

Chemical mechanical polishing apparatus and polishing method using the same

Номер: US20150126095A1

A chemical mechanical polishing apparatus includes a platen, a polishing head, a magnetizable polishing pad, and an electromagnetic component. The magnetizable polishing pad is disposed between the polishing head and the platen. The electromagnetic component is configured for fastening the magnetizable polishing pad on the platen.

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25-08-2022 дата публикации

SUBSTRATE POLISHING APPARATUS

Номер: US20220266415A1
Принадлежит: KCTECH CO., LTD.

A substrate polishing apparatus according to an example embodiment may include a substrate carrier configured to grasp and move a substrate, a polishing pad configured to come into contact with a polishing target surface of the substrate and polish the polishing target surface of the substrate, and a spray unit including a spray member configured to spray a fluid toward the substrate carrier. 1. A substrate polishing apparatus comprising:a substrate carrier configured to grasp and move a substrate;a polishing pad configured to come into contact with a polishing target surface of the substrate and polish the polishing target surface of the substrate; anda spray unit comprising a spray member configured to spray a fluid toward the substrate carrier.2. The substrate polishing apparatus of claim 1 , wherein the substrate carrier comprises:a carrier head configured to adjust a position of the substrate;a membrane connected to the carrier head and configured to define a pressure chamber for applying a pressure to the substrate; anda retainer ring connected to the carrier head and configured to grasp the substrate.3. The substrate polishing apparatus of claim 2 , wherein the spray member sprays the fluid toward the retainer ring.4. The substrate polishing apparatus of claim 3 , wherein the spray member sprays the fluid toward a lateral side of the retainer ring in a direction parallel to an upper surface of the polishing pad.5. The substrate polishing apparatus of claim 3 , wherein the spray member sprays the fluid toward a lateral side of the retainer ring at an angle of 30 degrees to 60 degrees with respect to a ground surface.6. The substrate polishing apparatus of claim 3 , wherein the spray member sprays the fluid toward the retainer ring claim 3 , such that a surface temperature of the retainer ring is maintained within a predetermined range.7. The substrate polishing apparatus of claim 1 , wherein the spray unit further comprises:a spray body disposed at one side of ...

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