16-01-2014 дата публикации
Номер: US20140013990A1
Принадлежит:
A frangible projectile with a specific gravity similar to a lead projectile. The projectile comprises 34-94%, by weight, binder. The binder comprises poly ether block amide resin. The projectile further comprises 6-66%, by weight, ballast. The ballast comprises at least one member selected from a group consisting of tungsten, tungsten carbide, molybdenum, tantalum, ferro-tungsten, copper, bismuth, iron, steel, brass, aluminium bronze, beryllium copper, tin, aluminium, titanium, zinc, nickel silver alloy, cupronickel and nickel. The projectile can be prepared with a particularly preferred specific gravity of 5-14 and more preferably 11-11.5. 132-. (canceled)33. A frangible essentially lead free projectile comprising:a binder comprising about 10-30%, by weight, a resin comprising linear chains of rigid polyamide segments interspaced with flexible poly ether segments; anda ballast comprising copper.34. The frangible essentially lead free projectile of wherein said ballast further comprises at least one member selected from a group consisting of tungsten claim 33 , tungsten carbide claim 33 , molybdenum claim 33 , tantalum claim 33 , ferro-tungsten claim 33 , bismuth claim 33 , iron claim 33 , steel claim 33 , brass claim 33 , aluminium bronze claim 33 , beryllium copper claim 33 , tin claim 33 , aluminium claim 33 , titanium claim 33 , zinc claim 33 , nickel silver alloy claim 33 , cupronickel and nickel.35. The frangible essentially lead free projectile of further comprising a plasticizer.36. The frangible essentially lead free projectile of wherein said plasticizer is a sulfonamide.37. The frangible essentially lead free projectile of wherein said plasticizer is an aromatic sulfonamide.38. The frangible essentially lead free projectile of wherein said plasticizer is n-butylbenzene sulfonamide. The present application is a divisional application of pending U.S. patent application Ser. No. 10/783,066 which is a continuation-in-part of U.S. patent application Ser. No. ...
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