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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 8528. Отображено 100.
01-03-2012 дата публикации

Gelator-stabilized crystalline resins

Номер: US20120052284A1
Автор: Chris Harrington, Philip C. Hadley
Принадлежит: Hexcel Composites Ltd

A resin composition that is storable at ambient temperatures. The resin composition forms a cured resin when exposed to a curing agent and heated to a curing temperature that is relatively close to ambient temperature. The resin composition includes a resin component that is composed of a liquid part that is made up of one or more liquid thermosetting resins and a solid part that includes particles of one or more solid thermosetting resins. The liquid part further includes a gelation agent that is present in a sufficient amount to maintain the particles in suspension within the liquid part at ambient temperatures. The viscosity of the resin component changes from a high viscosity state to a low viscosity state when the temperature is increased from ambient temperature to the curing temperature. The high viscosity state is substantially more viscous than the low viscosity state.

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Номер записи: 1
15-03-2012 дата публикации

Method for manufacturing printed circuit board including flame retardant insulation layer

Номер: US20120064231A1
Автор: Choon-Keun Lee, Hee-Sun Chun, Hwa-Young Lee, Jae-Choon Cho, Myeong-Ho Hong
Принадлежит: Samsung Electro Mechanics Co Ltd

The present invention relates to a method for manufacturing a printed circuit board including a flame retardant insulation layer. The printed circuit board of the present invention exhibits excellent thermal stability and excellent mechanical strength, is suitable for imprinting lithography process, provides improved reliability by reducing coefficient of thermal expansion, and has excellent adhesion between circuit patterns and an insulation layer.

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Номер записи: 2
09-08-2012 дата публикации

Homogenous dispensing process for an epoxy-composition with high filler content

Номер: US20120202922A1
Автор: Yoke Ai Gan
Принадлежит: Henkel AG and Co KGaA

The present invention relates to a process for the production of a ready-to-use epoxy composition having a filler content of at least 55 vol.-%, relative to the complete ready-to-use epoxy composition, which comprises: providing a liquid A, which comprises at least one epoxy resin, providing a liquid B, which comprises at least one curing agent, providing a solid component C, which comprises at least one filler, wherein in a first step one of the liquids A or B is filled in a mixing container, in a second step the solid component C is deposited on top of the liquid in the mixing container, in a third step the remaining liquid A or B is deposited on top of the solid component C, and in a fourth step the components are mixed to obtain the ready-to-use epoxy composition.

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Номер записи: 3
20-09-2012 дата публикации

Amine adducts

Номер: US20120238710A1
Автор: Ludwig Huelskaemper, Marcus Hummel, Markus Schroetz
Принадлежит: Individual

Embodiments include an amine adduct obtainable by reacting an amine compound having at least two amino groups and a monoalkylpolyalkylene glycidyl ether having the formula (C 2 H 3 O)—CH 2 —O—(CH 2 —(CHR 1 )—O) n , —R 2 , wherein n is 1 to 50, each R 1 is independently H or CH 3 , and R 2 is an alkyl group. Embodiments include a curable composition including a resin component and a hardener component that includes the amine adduct.

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Номер записи: 4
22-11-2012 дата публикации

Room temperature ionic liquid-epoxy systems as dispersants and matrix materials for nanocomposites

Номер: US20120296012A1
Автор: Arianna L. Watters, Giuseppe R. Palmese
Принадлежит: DREXEL UNIVERSITY

Formulations containing a mixture of an epoxy resin and an ionic liquid or an adduct of an epoxy resin and an ionic liquid which may initiate curing of the epoxy resin, the mixture having nano-materials dispersed or dissolved therein. These formulations can be used for the preparation of nanocomposites. Methods of preparing nanocomposites by curing a dispersion of nano-materials in a mixture of an epoxy resin and an ionic liquid or an adduct of an epoxy resin and an ionic liquid which may initiate curing of the epoxy resin. Nanocomposites comprising a cured product formed by curing an epoxy resin with an ionic liquid or an adduct of an epoxy resin and an ionic liquid having nano-materials dispersed or dissolved therein. Embodiments of the invention permit manufacture of nanocomposites having relatively high fracture toughness, relatively high loadings of nano-materials and the ability to tailor the properties of the nano-composites.

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Номер записи: 5
11-04-2013 дата публикации

POWDER COATINGS COMPOSITIONS

Номер: US20130090435A1
Автор: Marks Maurice J., Vargas Fabio Aguirre
Принадлежит:

A solid epoxy resin powder coating composition which includes a divinylarene dioxide resin as one component; and wherein the solid epoxy resin powder coating composition can be formed by blending or reacting various other components with the divinylarene dioxide resin. For example, other components can include other epoxy resins; phenolic resins; or monomeric and/or polymeric isocyanates. The powder coating composition or formulation may advantageously provide, for example, a Fusion Bonded Epoxy coating on a substrate. 1. A composition comprising a solid curable powder coating formulation including (i) at least one divinylarene dioxide resin; and (ii) at least one curing component.2. The composition of claim 1 , wherein the divinylarene dioxide resin is epoxy functional claim 1 , phenolic functional claim 1 , or mixtures thereof.3. The composition of claim 1 , wherein the divinylarene dioxide resin is epoxy functional; and wherein the curing component comprises an epoxy curing agent claim 1 , an epoxy curing catalyst claim 1 , or mixtures thereof.4. The composition of claim 3 , wherein the divinylarene dioxide resin is phenolic functional; and wherein the curing component comprises an epoxy resin claim 3 , a blend of an epoxy resin and a curing catalyst claim 3 , or mixtures thereof.5. The composition of claim 1 , wherein the divinylarene dioxide resin comprises (i) a blend of a solid epoxy resin and a divinylarene dioxide compound; or (ii) an epoxy oxazolidone resin prepared from a divinylarene dioxide compound and a monomeric isocyanate or a polymeric isocyanate; or (iii) a phenolic hardener prepared from a divinylarene dioxide compound and a diphenol.6. The composition of any one of the previous claims wherein the divinylarene dioxide compound comprises divinylbenzene dioxide.7. The composition of claim 5 , wherein the solid epoxy resin comprises an epoxy resin prepared from a stoichiometric excess of bisphenol A diglycidyl ether and bisphenol A having a Tg of ...

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Номер записи: 6
02-05-2013 дата публикации

AQUEOUS RADIATION-CURABLE EPOXY ACRYLATE DISPERSIONS

Номер: US20130109784A1
Автор: Baro Juergen, Birnbrich Paul, Druene Laurence, Thomas Hans-Josef
Принадлежит:

The invention relates to aqueous radiation-hardenable epoxy acrylate dispersions comprising (a) an epoxy acrylate resin (P*) with at least two acrylate groups per molecule, wherein at 25 degrees Celsius, said epoxy acrylate resin is not self-disperging in water; and (b) a dispergator (D*) with at least one acrylate group per molecule, wherein said dispersions can be produced by converting, in a first step (i), in the presence of a catalyst if need be, one or several compounds (A) selected from the group of non-ionic compounds having a HLB value of less than 12, and containing at least two oxirane groups per molecule, with one or several compounds (B) selected from the group of non-ionic compounds having a HLB value in the range from 12 to 20, and which contain at least one h-acid group (ZH) per molecule. The compounds (A) and (B) are employed at an equivalence ratio EpO (A):ZH (B) in the range from 1.3:1 to 400:1, and in a second step (ii), the reactive mixture thus obtained is converted, in the presence of a catalyst if need be, with one or several non-ionic compounds having a HLB value of less than 12, and containing at least two oxirane groups per molecule (compounds A), and with one or several compounds (C) selected from the group of non-ionic compounds having a HLB value of less than 12, and which contain at least two H-acid groups. The compounds (A) and (C) are employed at an equivalence ratio EpO (A):ZH (C) in the range from 1.1:1 to 20:1. In a third step (iii), the reactive mixture thus obtained is converted, in the presence of a catalyst if need be, with acrylic acid by ring opening of all epoxy groups. In a fourth step (iv), the reactive mixture thus obtained is disperged in water. 1. An aqueous radiation-curable epoxy acrylate dispersion comprising:(a) an epoxy acrylate resin (P*) having at least 2 acrylate groups per molecule, said epoxy acrylate resin being not self-dispersing in water at 25° C., and (i) reacting one or more nonionic compounds (A), ...

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Номер записи: 7
09-05-2013 дата публикации

MAGNETIC STEEL SHEET WITH SEMI-ORGANIC INSULATION COATING

Номер: US20130115444A1
Автор: Fujibayashi Nobue, Nakagawa Nobuko, Ogata Hiroyuki, Sasaki Kenichi, Sashi Kazumichi, Shigekuni Tomofumi, Tada Chiyoko
Принадлежит: JFE STEEL CORPORATION

A semi-organic insulation coating includes an inorganic component and an organic resin, a Zr compound and an Si compound contains a plate-like silica as an inorganic component and are included in a ratio in a dry coating of 20 to 70 mass % of Zr compound (converted to ZrO) and 10 to 50 mass % of Si compound containing plate-like silica (converted to SiO), and the remainder is substantially an organic resin, whereby a magnetic steel sheet with a semi-organic insulation coating has no deterioration of corrosion resistance and water resistance without containing a chromium compound and being excellent in powdering resistance, scratch resistance, sticking resistance, TIG weldability, punchability and coating appearance. 1. A magnetic steel sheet having on surface thereof a semi-organic insulation coating comprising an inorganic component and an organic resin , wherein the inorganic component of the coating comprises a Zr compound and an Si compound containing a plate-like silica as a ratio in a dry coating of 20-70 mass % of Zr compound (converted to ZrO) a and 10-50 mass % of Si compound containing a plate-like silica (converted to SiO) , and the remainder of the coating is the organic resin.2. The magnetic steel sheet according to claim 1 , wherein the plate-like silica has an average particle size of 10 to 600 nm.3. The magnetic steel sheet according to claim 1 , wherein the plate-like silica has an aspect ratio (average length/average thickness ratio) of 2 to 400.4. The magnetic steel sheet according to claim 1 , wherein the inorganic component further comprises a B compound in a dry coating of 0.1-5 mass % of B compound (converted at BO).5. The magnetic steel sheet according to claim 1 , wherein the coating further comprises not more than 30 mass % in total of one or more selected from the group consisting of a nitric acid compound (converted to NO) claim 1 , a silane coupling agent (converted to a solid content) and a phosphorus compound (converted to PO) in a dry ...

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Номер записи: 8
16-05-2013 дата публикации

EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

Номер: US20130119564A1
Автор: KOTANI Takahiro, Maeda Masakatsu, NISHITANI Yoshinori, SEKI Hidetoshi, SHIGENO Kazuya
Принадлежит: SUMITOMO BAKELITE CO., LTD.

An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): 135-. (canceled)38. The epoxy resin composition for encapsulating a semiconductor chip as claimed in claim 36 ,wherein said butadiene-acrylonitrile copolymer (C-2) is contained in the amount of 0.05 wt % to 0.5 wt % both inclusive in the total epoxy resin composition.40. The epoxy resin composition for encapsulating a semiconductor chip as claimed in claim 36 , further comprising a curing accelerator (E).4140. A semiconductor device wherein a semiconductor chip is encapsulated with the epoxy resin composition for encapsulating a semiconductor chip as claimed in any one of -.4240. The epoxy resin composition for encapsulating a semiconductor chip as claimed in any one of - used for encapsulating an area mounting type semiconductor device claims 36 ,wherein a semiconductor chip is mounted on one side of the substrate and substantially only the side of the substrate mounting the semiconductor chip is encapsulated.43. An area mounting type semiconductor device claim 42 , wherein a semiconductor chip is encapsulated with the area mounting type epoxy resin composition for encapsulating a semiconductor chip as claimed in . This application is a continuation of U.S. patent application Ser. No. 11/289,265, which is based on Japanese patent application Nos. 2004-347743, 2004-368714, 2005-002381, 2005-039050 and 2005-099390, the contents of which are incorporated hereinto by reference.1. Technical FieldThis invention relates to an epoxy resin composition for encapsulating a semiconductor chip and a semiconductor device. In particular, this invention is suitably used in an area mounting type semiconductor device where a semiconductor chip is mounted on one side of a printed-wiring board or metal lead frame and substantially only the mounted side is encapsulated with a resin.2. Related ...

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Номер записи: 9
23-05-2013 дата публикации

EPOXY FOIL(S)

Номер: US20130130038A1
Автор: Woudsma Jacob
Принадлежит:

The invention relates to products and/or methods and/or systems of epoxy foils for the protection and/or sealing of material as wood, metal, steel, stone, concrete, glass etc. for houses, buildings, cars, ships, boats, bridges, roads, floors, ceilings, walls, textiles, paper, airplanes etc. The reactivity and/or the elasticity of epoxy foils are adjustable and are applicable directly or indirectly for the protection and/or sealing of all materials such as wood, concrete, glass, metal, plastic etc. The epoxy foils are universal in use, self fixing, self cleanable, highly durable, very economical, safer, and less harmful to the environment. 1. New product(s) and/or methods of one or more component curable polymers protecting and/or sealing of wood , metal , glass , stone , plastic , concrete , etc. applied on windows , buildings , houses , cars etc. are characterized in that an epoxy foil is applied using a equivalent and/or a non-equivalent amount of hardener.2. Method or product according to claim 1 , characterized in that an elastic epoxy foil is used in which a hardener is applied in mixtures varying from an undercured to an overcured ratio.32. Method or product according to - claim 1 , characterized in that a reactive elastic epoxy foil is used by using a combination of an undercured and/or an overcured amount of hardener.43. Method or product according to - claim 1 , characterized in that a reactive and/or an elastic and/or an epoxy foil is based e.g. on an epoxy resin from A. a modified liquid epoxy A/F <700 Mol weight Poly Service 700 or 237 (includes a polysulfonate) claim 1 , W804 claim 1 , DER 358 etc. and B from one or more hardeners such Aradur (polyetherurethane-amine/polyamine) and/or Aradur 76 (polyetherpolyamine) or Aradur 3275 claim 1 , and/or a polysulfide of e.g. Akzo Nobel and/or C a hardener such as Aradur 90 or Flep 60 claim 1 , a polymercaptane or a linear aliphatic polyamine such as ethylenediamine claim 1 , polyethylene polyamine ...

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Номер записи: 10
23-05-2013 дата публикации

THERMOSETTING EPOXY RESIN COMPOSITION AND USES THEREOF

Номер: US20130131216A1
Автор: Sakane Masanori
Принадлежит: Daicel Corporation

Disclosed is a liquid thermosetting epoxy resin composition including a base resin, a curing agent (D), and curing accelerator (E) or including a base resin and a curing catalyst (D′), each base resin including an alicyclic epoxy compound (A) having at least one alicyclic skeleton and two or more epoxy groups per molecule; a polyester polyol and/or a polycarbonate polyol (B), each polyol having two or more terminal hydroxyl groups; and a phosphorous ester (C). The liquid thermosetting epoxy resin composition exhibits excellent viscosity stability and can give a cured article which is homogeneous even when having a large thickness, does not crack under heat cycle conditions, and is highly thermally stable and satisfactorily optically transparent. 1. A liquid thermosetting epoxy resin composition comprising a base resin; a curing agent (D); and a curing accelerator (E) , the base resin comprising an alicyclic epoxy compound (A) having at least one alicyclic skeleton and two or more epoxy groups per molecule; a polyester polyol and/or a polycarbonate polyol (B) , each polyol having two or more terminal hydroxyl groups; and a phosphorous ester (C).2. A liquid thermosetting epoxy resin composition comprising a base resin; and a curing catalyst (D′) , the base resin comprising an alicyclic epoxy compound (A) having at least one alicyclic skeleton and two or more epoxy groups per molecule; a polyester polyol and/or a polycarbonate polyol (B) , each polyol having two or more terminal hydroxyl groups; and a phosphorous ester (C).3. The liquid thermosetting epoxy resin composition of claim 1 , comprising: 50 to 150 parts by weight of the curing agent (D) per 100 parts by weight of the total amount of the component (A) and the component (B); and', '0.05 to 5 parts by weight of the curing accelerator (E) per 100 parts by weight of the total amount of the component (A) and the component (B),', 95 to 50 parts by weight of the alicyclic epoxy compound (A) having at least one ...

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Номер записи: 11
06-06-2013 дата публикации

PREPREG AND PRINTED CIRCUIT BOARD COMPROMISING THE SAME

Номер: US20130143030A1
Автор: KIM Yoon Shik
Принадлежит: C/O SAMSUNG ELECTRO-MECHANICS CO., LTD.

Disclosed herein are a prepreg including an insulating resin composition impregnated into a porous support, and a printed circuit board including the same as an insulating layer. According to the present invention, the porous support used for impregnation of the insulating resin composition has excellent thermal stability and wide surface area, a coefficient of thermal expansion (CTE) of the porous support is not changed according to directivity, and the prepreg has a structure in which fillers included in the insulating resin composition are dispersed between the porous supports, such that the CTE may be efficiently improved. In addition, although damage is generated from the outside, the damage is not enlarged due to adjacent porous supports but is only locally generated and physical properties for pressure load is excellent due to the porous structure, such that damage of the printed circuit board may be reduced. 1. A prepreg comprising an insulating resin composition impregnated into a porous support.2. The prepreg according to claim 1 , wherein the porous support has a specific surface area of 200 to 2000 m/g.3. The prepreg according to claim 1 , wherein a size of a pore of the porous support is sop or less.4. The prepreg according to claim 1 , wherein the porous support is made of at least one kind selected from at least one porous inorganic material selected from a group consisting of aerogel claim 1 , silica claim 1 , fused silica claim 1 , glass claim 1 , alumina claim 1 , platinum claim 1 , nickel claim 1 , titania claim 1 , zirconia claim 1 , ruthenium claim 1 , cobalt claim 1 , and a combination thereof; and at least one porous polymer selected from a group consisting of urea resins claim 1 , phenol resins claim 1 , polystyrene resins claim 1 , and a combination thereof.5. The prepreg according to claim 1 , wherein the insulating resin composition includes a base resin and a filler.6. The prepreg according to claim 5 , wherein the base resin is at least ...

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Номер записи: 12
13-06-2013 дата публикации

CATALYST FOR URETHANE BOND FORMATION

Номер: US20130150486A1
Автор: Cvetko Norbert, Feola Roland, Gmoser Johann, Paar Willy
Принадлежит:

The invention relates to titanium compounds ABC comprising tetravalent titanium A, a moiety derived from a glycol B by removing two hydrogen atoms from hydroxyl groups, and a moiety derived from an N-alkylol-β-hydroxyamine C synthesised by reacting a β-hydroxyamine C12 with an aldehyde C3, to a process for their preparation, and to a method of use thereof as a curing catalyst in coating compositions. 2. The titanium compounds of wherein the glycols B are dihydric aliphatic linear or branched alcohols claim 1 , preferably having from three to twelve carbon atoms.3. The titanium compounds of wherein the β-hydroxyamine C12 is a reaction product of an epoxide C1 having at least one claim 1 , and preferably claim 1 , at least two claim 1 , epoxide groups claim 1 , and an amine C2 have at least one primary or secondary NH group claim 1 , and which is preferably selected from the group consisting of primary aliphatic monoamines claim 1 , primary aliphatic diamines claim 1 , diamino-oligo-ethylene-imines claim 1 , primary-tertiary aliphatic diamines claim 1 , and secondary alkanolamines.4. The titanium compounds of wherein the aldehyde C3 is an aliphatic monoaldehyde selected from the group consisting of formaldehyde claim 1 , acetaldehyde claim 1 , propionic aldehyde claim 1 , butyric aldehyde and isobutyric aldehyde.6. A method of use of the titanium compounds ABC as a catalyst in coating compositions claim 1 , which method comprises the steps of adding the titanium compounds ABC to a paste resin claim 1 , mixing claim 1 , and then adding pigments and optionally other additives such as defoamers claim 1 , antisettling agents claim 1 , and wetting agents claim 1 , or adding the titanium compounds ABC to a pigment paste prepared by mixing a paste resin with pigments and optionally other additives such as defoamers claim 1 , antisettling agents claim 1 , and wetting agents claim 1 , or adding the titanium compounds ABC to a binder resin claim 1 , or adding the titanium ...

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Номер записи: 13
20-06-2013 дата публикации

RESIN COMPOSITION, AND PREPREG AND LAMINATED SHEET USING THE SAME

Номер: US20130157061A1
Автор: Ohtsuka Hajime, Sogame Masanobu, Ueyama Daisuke
Принадлежит: MITSUBISHI GAS CHEMICAL COMPANY, INC.

There is provided a resin composition that exhibits excellent heat resistance, heat conductivity, and water absorption. The resin composition comprises a cyanate ester resin (A) represented by formula (I), an epoxy resin (B), and an inorganic filler (C), the content of the inorganic filler (C) being 301 to 700 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the epoxy resin (B) 2. The resin composition according to claim 1 , wherein the inorganic filler (C) is selected from the group consisting of aluminum hydroxide claim 1 , heat treated products of aluminum hydroxide claim 1 , boehmite claim 1 , metal hydrates of magnesium hydroxide claim 1 , zinc borate claim 1 , aluminum oxide claim 1 , boron nitride claim 1 , magnesium oxide claim 1 , aluminum nitride claim 1 , and silicon nitride.3. The resin composition according to claim 1 , wherein the content of the cyanate ester resin (A) is 10 to 90 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the epoxy resin (B).4. The resin composition according to claim 1 , wherein the content of the epoxy resin (B) is 10 to 90 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the epoxy resin (B).5. The resin composition according to claim 1 , which further comprises a maleimide compound (D).6. The resin composition according to claim 5 , wherein the content of the maleimide compound (D) is 5 to 75 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the maleimide compound (D).7. A prepreg comprising: a base material; and a resin composition according to impregnated into or coated on the base material.8. A laminated sheet comprising a cured product of a prepreg according to .9. A metal foil-clad laminated sheet comprising a lamination and cured product of a prepreg according to and a metal foil. The present invention relates to a resin composition and more specifically relates ...

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Номер записи: 14
20-06-2013 дата публикации

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED WITH THE SAME

Номер: US20130158165A1
Автор: HAN Seung, KIM Ju Mi, Lee Eun Jung, PARK Sung Su
Принадлежит:

An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated with the composition, the composition including an epoxy resin; an inorganic filler; a curing accelerator; and a curing agent, the curing agent including a compound having a multifunctional novolac structure including at least one biphenyl moiety, the compound being represented by Formula 1: 2. The epoxy resin composition as claimed in claim 1 , further comprising a non-halogenated flame retardant.3. The epoxy resin composition as claimed in claim 2 , wherein the epoxy resin composition includes:about 1 to about 13% by weight of the epoxy resin,about 74 to about 94% by weight of the inorganic filler,about 0.001 to about 1.5% by weight of the curing accelerator,about 0.001 to about 10% by weight of the non-halogenated flame retardant, andabout 1 to about 15% by weight of the curing agent.4. The epoxy resin composition as claimed in claim 2 , wherein the non-halogenated flame retardant includes at least one of phosphazene claim 2 , zinc borate claim 2 , aluminum hydroxide claim 2 , and magnesium hydroxide.5. The epoxy resin composition as claimed in claim 1 , wherein the curing agent has a hydroxyl equivalent weight of about 100 g/eq to about 350 g/eq.6. The epoxy resin composition as claimed in claim 1 , wherein the curing agent has a melt viscosity of about 0.08 poise to about 3 poise at 150° C.7. The epoxy resin composition as claimed in claim 1 , wherein the curing agent has a softening point of about 50 to about 140° C.8. The epoxy resin composition as claimed in claim 1 , wherein the compound represented by Formula 1 is present in the composition an amount of about 1 to about 15% by weight claim 1 , based on a total weight of the epoxy resin composition.9. The epoxy resin composition as claimed in claim 1 , wherein the curing agent further includes at least one additional compound claim 1 , the additional compound including two or more phenolic hydroxyl ...

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Номер записи: 15
11-07-2013 дата публикации

Advanced epoxy resin compositions

Номер: US20130178590A1
Автор: Bernhard Kainz, Jerry W. White, Ray E. Drumright, Robert E. Hefner, Jr., XIN Jin
Принадлежит: Dow Global Technologies LLC

An epoxy resin composition of the following chemical structure (I), where n is a number from 1 to about 3000; each m independently has a value of 0 or 1; each R0 is independently —H or —CH 3 ; each R 1 is independently —H or a C 1 to C 6 alkylene radical (saturated divalent aliphatic hydrocarbon radical), Ar is a divalent aryl group or heteroarylene group; and X is a cycloalkylene group, including a substituted cycloalkylene group, where the substituent group include an alkyl, cycloalkyl, an aryl or an aralkyl group or other substituent group, for example, a halogen, a nitro, or a blocked isocyanate, an alkyloxy group; the combination of cycloalkylene and alkylene groups and the combination of alkylene and cycloalkylene group with a bridging moiety in between.

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Номер записи: 16
18-07-2013 дата публикации

Epoxy resin hardener compositions and epoxy resin compositions containing such hardener compositions

Номер: US20130184378A1
Автор: Bernhard Kainz, Carola Rosenthal, Emile C. Trottier, Joseph Gan, Matthieu M. Eckert
Принадлежит: Dow Global Technologies LLC

An epoxy resin hardener composition including a reaction product of (i) a compound having at least one vicinal epoxy group, and (ii) an amino alcohol; an epoxy resin composition including the epoxy resin hardener composition and a compound having at least one vicinal epoxy group; and a powder coating composition including particles of the epoxy resin hardener composition and particles of a compound having at least one vicinal epoxy group.

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Номер записи: 17
25-07-2013 дата публикации

RADIATION CURABLE COMPOSITION

Номер: US20130187144A1
Автор: Briers David
Принадлежит: Henkel AG & Co. KGaa

The present invention relates to a curable composition, which comprises a) at least one radiation-curable resin, b) at least one specific anti-oxidant and c) at least one photoinitiator salt. The invention further relates to a cured product made from the curable composition. The curable compositions and/or the cured products thereof are particularly suitable as laminating adhesives, sealants, and/or encapsulants for electronic or optoelectronic devices. 2) The curable composition of claim 1 , wherein the radiation-curable resin is selected from radiation-curable epoxy resins.4) The curable composition of claim 3 , wherein X and Y are O.5) The curable composition of claim 1 , wherein the cation Y of the photoinitiator salt is selected from iodonium or sulfonium cations and/or the anion X of the photoinitiator salt is selected from phosphorous or antimony containing anions.6) The curable composition of claim 5 , wherein the cation Y of the photoinitiator salt is selected from sulfonium cations and the anion X of the photoinitiator salt is selected from phosphorous or antimony containing anions.7) The curable composition according to claim 1 , further comprising at least one additive selected from adhesion promoters claim 1 , plasticizers claim 1 , thickeners claim 1 , oils claim 1 , pigments claim 1 , flame retardants claim 1 , fillers claim 1 , or rheology modifiers.9) The cured product of the curable composition according to .10) The cured product of claim 9 , wherein said cured product has water vapor transmission rate of less than 10 g/m·day.11) An electronic or optoelectronic device coated with the cured product of .12) The electronic or optoelectronic device of claim 11 , in which the device is selected from organic light emitting diode (OLED) displays claim 11 , OLED microdisplays claim 11 , liquid crystal displays (LCD) claim 11 , electrophoretic displays claim 11 , plasma displays claim 11 , microelectromechanical (MEMS) devices claim 11 , liquid crystal-on ...

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Номер записи: 18
08-08-2013 дата публикации

HYPERBRANCHED POLYMERS FOR MODIFYING THE TOUGHNESS OF CURED EPOXY RESIN SYSTEMS

Номер: US20130203898A1
Автор: BRUCHMANN Bernd, Haberecht Monika, Henningsen Michael, Kaffee Achim, Mueller-Cristadoro Anna, SCHERR Guenter, Stumbe Jean-Francois, Yin Chunhong, Yu Miran
Принадлежит:

The invention relates to a curable composition comprising one or more epoxy compounds, one or more amino hardeners, and an addition of one or more dendritic polymers selected from the group of the dendritic polyester polymers, where the dendritic polyester polymers can be produced through an Ax+By synthesis route. 1. A curable composition comprising one or more epoxy compounds , one or more amino hardeners for the curing of epoxy compounds , and an addition of one or more dendritic polymers selected from the group of the dendritic polyester polymers.2. The curable composition according to claim 1 , comprising one or more epoxy compounds claim 1 , one or more amino hardeners for the curing of epoxy compounds claim 1 , and an addition of one or more dendritic polymers selected from the group of the dendritic polyester polymers claim 1 , where the dendritic polyester polymers can be produced through an Ax+By synthesis route.3. The curable composition according to or claim 1 , where the amino hardener is one selected from the group of diethylenetetramine and aminopropylimidazole.4. The curable composition according to any of to claim 1 , where the dendritic polymer is a dendritic polyester polymer.5. The curable composition according to claim 4 , where the dendritic polyester polymer is a polyol having terminal alcohol groups and/or carboxy groups.6. A cured epoxy resin that can be produced through curing of the curable composition according to any of to .7. A molding made of the cured epoxy resin according to .8. A composite material comprising glass fibers or carbon fibers and the cured epoxy resin according to .9. A fiber which has been preimpregnated with the curable composition according to any of to . The invention relates to a curable composition comprising one or more epoxy compounds, one or more amino hardeners and an addition of one or more dendritic polymers selected from the group consisting of the dendritic polyester polymers.The invention further relates ...

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Номер записи: 19
15-08-2013 дата публикации

CURABLE COMPOSITION FOR INKJET, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

Номер: US20130208064A1
Автор: Inoue Takanori, Kage Shuuji, Nakamura Shigeru, Takahashi Toshio, Ueda Michihisa, Watanabe Takashi
Принадлежит:

Provided is a curable composition for inkjet capable of improving uniformity of a cured product film and heat resistance of a cured product. The curable composition for inkjet according to the present invention contains a compound having a (meth)acryloyl group and a cyclic ether group, a photoreactive compound, a compound having a cyclic ether group, a photopolymerization initiator, and a potential curing agent, the photoreactive compound and the compound having a cyclic ether group each are a compound other than the compound having a (meth)acryloyl group and a cyclic ether group, the compound having a (meth)acryloyl group and a cyclic ether group has one or two (meth)acryloyl groups, and the viscosity at 25° C. of the curable composition for inkjet according to the present invention is 160 mPa·s or more and 1200 mPa·s or less. 1. A curable composition for inkjet that is applied by an inkjet method and is able to cure by light irradiation and heat addition , comprising:a compound having a (meth)acryloyl group and a cyclic ether group;a photoreactive compound other than the compound having a (meth)acryloyl group and a cyclic ether group;a photopolymerization initiator;a compound having a cyclic, ether group other than the compound having a (meth)acryloyl group and a cyclic ether group; anda potential curing agent,wherein the compound having a (meth)acryloyl group and a cyclic ether group has one or two (meth)acryloyl groups, andthe viscosity at 25° C. measured in conformance with JIS K2283 is 160 mPa·s or more and 1200 mPa·s or less.2. The curable composition for inkjet according to claim 1 ,wherein the compound having a (meth)acryloyl group and a cyclic, ether group is at least one selected from the group consisting of glycidyl(meth)acrylate, 3,4-epoxycyclohexylmethyl(meth)acrylate, 4-hydroxybutyl(meth)acrylate glycidyl ether, and a reaction product between an epoxy compound and (meth)acrylic acid.3. The curable composition for inkjet according to claim 1 ,wherein ...

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Номер записи: 20
22-08-2013 дата публикации

CURABLE COMPOSITION FOR INKJET AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

Номер: US20130216726A1
Автор: Kage Shuuji, Nakamura Shigeru, Takahashi Toshio, Ueda Michihisa, Watanabe Takashi
Принадлежит: Sekisui Chemical Co., Ltd.

Provided is a curable composition for inkjet applied by an inkjet method, that has a long pot life even in the environment in an inkjet device warmed to 50° C. or higher and excellent insulation reliability by the cured product after curing despite containing a compound having a cyclic ether group. The composition for inkjet according to the present invention is applied by an inkjet method, and cures by heat addition, the composition for inkjet according to the present invention contains a compound having a cyclic ether group and a curing agent, and the curing agent is a reaction viscous product obtained by reacting dicyandiamide with a functional group-containing compound having a functional group reactive with the dicyandiamide. 1. A curable composition for inkjet that is applied by an inkjet method and is curable by heat addition , comprising:a compound having a cyclic ether group, anda curing, agent,wherein the curing agent is a reaction viscous product obtained by reacting dicyandiamide with a functional group-containing compound having a functional group capable of reacting with the dicyandiamide.2. The curable composition for inkjet according to claim 1 ,wherein the functional group-containing compound that reacts with the dicyandiamide has at least one functional group selected from the group consisting of a hydroxyl group, a cyclic ether group, a carboxyl group and an isocyanate group.3. The curable composition for inkjet according to claim 2 ,wherein the functional group-containing compound that reacts with the dicyandiamide is a compound having an epoxy group.4. The curable composition for inkjet according to claim 3 ,wherein the compound having an epoxy group that reacts with the dicyandiamide has one epoxy group.5. The curable composition for inkjet according to claim 1 ,wherein the functional group-containing compound that reacts with the dicyandiamide has an aromatic backbone.6. The curable composition for inkjet according to claim 1 ,wherein the ...

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Номер записи: 21
12-09-2013 дата публикации

EPOXY SILOXANE COATING COMPOSITIONS

Номер: US20130234070A1
Автор: Mowrer Norman R.
Принадлежит: PPG Industries Ohio, Inc.

Epoxy-polysiloxane based coating and flooring compositions exhibiting improved flexibility, and excellent weatherability and corrosion resistance after curing are described. The epoxy-polysiloxane polymer coating composition may be prepared by combining a polysiloxane, an epoxide resin material and a cure system including a blend of compounds selected from a dialkoxy functional aminosilane, a trialkoxy functional aminosilane, and an amino functional polysiloxane resin, where the blend has an average alkoxy functionality value of 2.0 to 2.8. 3. The composition of claim 2 , wherein Ris a difunctional organic radical selected from (C-C)alkyl or (C-C)alkylamino(C-C)alkyl groups and each Ris independently a (C-C)alkyl group.4. The composition of claim 1 , wherein the at least one trialkoxy functional aminosilane comprises aminopropyltrimethoxysilane claim 1 , aminopropyltriethoxysilane claim 1 , aminopropyltripropoxysilane claim 1 , aminoneohexyltrimethoxysilane claim 1 , N-β-aminoethyl-γ-aminopropyltrimethoxysilane claim 1 , N-β-aminoethyl-γ-aminopropyltriethoxysilane claim 1 , N-phenylaminopropyl trimethoxysilane claim 1 , trimethoxysilylpropyl diethylene triamine claim 1 , 3-(3-aminophenoxy)propyl trimethoxysilane claim 1 , aminoethyl aminomethyl phenyl trimethoxysilane claim 1 , 2-aminoethyl-3-aminopropyl-tris-2-ethylhexoxysilane claim 1 , N-aminohexyl aminopropyl trimethoxysilane claim 1 , and/or trisaminopropyl trismethoxyethoxysilane5. The composition of claim 1 , wherein the at least one amino functional polysiloxane resin has a structure where Rincludes greater than 70% of phenyl groups claim 1 , less than 30% of (C-C)alkyl groups and less than 2.0% (C-C)alkoxy groups.6. The composition of claim 5 , wherein Rincludes less than 0.5% of (C-C)alkoxy groups.7. The composition of claim 1 , wherein the at least one amino functional polysiloxane resin comprises an amino-functional phenyl methyl polysiloxane resin.8. The composition of claim 7 , wherein the at least one ...

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Номер записи: 22
12-09-2013 дата публикации

D1364 BT SECONDARY COATINGS ON OPTICAL FIBER

Номер: US20130237643A1
Автор: CATTRON Wendell Wayne, Murphy Edward Joseph, SCHMID Steven Robert, TORTORELLO Anthony Joseph, ZIMMERMAN John Monroe
Принадлежит: DSM IP ASSETS B.V.

The invention relates to a Radiation Curable Secondary Coating composition for use on an Optical Fiber. The Radiation Curable Secondary Coating composition is a urethane-free Alpha Oligomer prepared by reaction of the following: (a) an acrylate compound selected from an alcohol-containing acrylate or alcohol-containing methacrylate compound, (b) an anhydride compound, (c) an epoxy-containing compound, (d) optionally an extender compound, and (e) optionally a catalyst. The invention also relates to a coated wire and to a coated optical fiber. 18.-. (canceled)9. A radiation curable secondary coating composition comprising a secondary coating oligomer blend;wherein said secondary coating oligomer blend comprises alpha oligomer, a beta oligomer, and a gamma oligomer;wherein said alpha oligomer is urethane free, has an acid value of about 5 mg KOH/g or less; has a number average molecular weight of about 500 g/mol or more and equal to or less than about 2,000 g/mol;and is prepared by reaction comprising:an acrylate compound selected from an alcohol containing acrylate or alcohol containing methacrylate compound,an anhydride compound,an epoxy containing compound,an extender compound, andan alpha oligomer catalyst selected from the group consisting of triarylphosphine catalyst, phosphonium salt, tertiary amine and metal catalyst;wherein said beta oligomer is different from said alpha oligomer;wherein said beta oligomer has a number average molecular weight in the range of from about 3,000 g/mol to about 10,000 g/mol, and is prepared by reaction comprising:hydroxyethyl acrylate,one or more diisocyanates,a polyol selected from the group consisting of polyester polyols and polyether polyols, said polyol having a number average molecular weight in the range of from 300 g/mol to 10,000 g/mol, anda beta oligomer catalyst selected from the group consisting of dibutyl tin dilaurate, metal carboxylate, sulfonic acid, amino base catalyst, organo base catalyst, triphenyl phosphine, ...

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Номер записи: 23
19-09-2013 дата публикации

RESIN COMPOSITION FOR INSULATION FILM

Номер: US20130245161A1
Автор: HSIEH CHEN-YU, Yu Yi-Fei
Принадлежит: ELITE MATERIAL CO., LTD.

A resin composition includes (A) 100 parts by weight of epoxy resin; (B) 20 to 100 parts by weight of polybutadiene styrene divinylbenzene graft terpolymer resin; (C) 2 to 20 parts by weight of di-tert-butylhydroquinone (DTBHQ); (D) 5 to 50 parts by weight of polyphenyl ether modified cyanate ester resin; and at least one of (E) inorganic filler, (F) chain extending sealing agent, and (G) catalyst. The resin composition is characterized by specific ingredients and proportions thereof to attain high heat resistance, low dielectric constant Dk, and low dielectric dissipation factor Df, and being halogen-free, and therefore is applicable to protective film of printed circuit boards, insulating protective film of electronic components, and resin insulation film of leadframes. 1. A resin composition , comprising:(A) 100 parts by weight of epoxy resin;(B) 20 to 100 parts by weight of polybutadiene styrene divinylbenzene graft terpolymer resin;(C) 2 to 20 parts by weight of di-tert-butylhydroquinone (DTBHQ); and(D) 5 to 50 parts by weight of polyphenyl ether modified cyanate ester resin,wherein the resin composition further selectively comprises at least one of (E) inorganic filler, (F) chain extending sealing agent, and (G) catalyst.2. The resin composition of claim 1 , wherein the (E) inorganic filler is contained in an amount of 10 to 150 parts by weight.3. The resin composition of claim 1 , wherein the (F) chain extending sealing agent is contained in an amount of 0.1 to 25 parts by weight.4. The resin composition of claim 1 , wherein the (G) catalyst is contained in an amount of 0.001 to 10 parts by weight.5. The resin composition of claim 1 , wherein the epoxy resin comprises at least one selected from the group consisting of bisphenol A epoxy resin claim 1 , bisphenol F epoxy resin claim 1 , bisphenol S epoxy resin claim 1 , phenol novolac epoxy resin claim 1 , bisphenol A novolac epoxy resin claim 1 , o-cresol novolac epoxy resin claim 1 , trifunctional epoxy resin ...

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Номер записи: 24
26-09-2013 дата публикации

NON-SINTERING ISOCYANATE MODIFIED EPOXY RESIN FOR FUSION BONDED EPOXY APPLICATIONS

Номер: US20130251931A1
Автор: Aguirre Vargas Fabio, Gulyas Gyongyi, Liao Zeng Kun, Pham Ha Q.
Принадлежит: Dow Global Technologies LLC

Thermosetting epoxy-terminated oxazolidinone ring containing polymers which are obtainable by reacting at least one polyisocyanate compound with at least one hydroxy group containing epoxy resin and/or a combination of at least one epoxy resin and at least one di- or multifunctional nucleophilic compound that is capable of forming crosslinks between epoxy groups. The polymers have an onset glass transition temperature of at least about 45° C. and are capable of showing an onset glass transition temperature in the cured state at least about 160° C. Powder coating compositions comprising these polymers are also disclosed. 1. A thermosetting powder coating composition , wherein the composition comprises (a) a thermosetting polymer , wherein the polymer is obtainable by reacting at least one of (i) at least one hydroxy group containing epoxy resin and (ii) a combination of at least one epoxy resin and at least one di- or multifunctional nucleophilic compound that is capable of forming crosslinks between epoxy groups with (iii) at least one polyisocyanate compound in the presence of (iv) at least one catalyst which is capable of promoting a formation of oxazolidone rings and a branching of the polymer and wherein the polymer in an uncured state has an onset glass transition temperature of at least about 45° C. and is capable of showing an onset glass transition temperature in a cured state of at least about 160° C. and (b) one or more curing catalysts for (a).2. A substrate having thereon a fusion-bonded epoxy coating made from the powder coating composition of ; wherein the substrate comprises a metal substrate; and wherein the substrate comprises a pipe.3. A method for providing a substrate with a fusion-bonded epoxy (FBE) coating claim 1 , wherein the method comprises subjecting the substrate to a powder coating process with the powder coating composition of .4. A coated substrate made by the method of .5. A coated substrate made by the method of .6. A method of ...

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Номер записи: 25
03-10-2013 дата публикации

Reactive diluents, methods of reacting, and thermoset polymers derived therefrom

Номер: US20130261254A1
Автор: Brian D. Mullen, Dorie J. Yontz, Marc D. Rodwogin
Принадлежит: Segetis Inc

A thermosetting composition comprises in combination an ethylenically unsaturated polymer, and a lactone reactive diluent of the formula wherein b=0 or 1. A method of manufacture of a thermoset polymer comprises reacting the unsaturated polymer and the lactone to form the thermoset polymer. The thermoset polymers are described, as well as articles comprising the thermoset polymers.

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Номер записи: 26
17-10-2013 дата публикации

Powder Corrosion and Chip-Resistant Coating

Номер: US20130273364A1
Автор: Breidenstein Jason Paul, Cinoman Douglas S., Horinka Paul R., Nicholl Edward G.
Принадлежит: AKZO NOBEL COATINGS INTERNATIONAL B.V.

A powder composition including a resin and from 5% to 70%, by weight based on powder composition weight, of a corrosion-inhibiting pigment, optionally including from 0% to 65%, by weight based on powder composition weight, zinc, the composition being substantially free from pigment providing a metallic effect is provided. The corrosion-inhibiting pigment may be present in amounts of up to 50%, by weight based on powder composition weight, for example, up to 35%. A method for coating a substrate with the powder composition and the coated substrate so formed are also provided. 110.-. (canceled)11. A coated substrate comprising a coating , said coating comprising:an epoxy resin and at least one corrosion-inhibiting pigment selected from the group consisting of molybdates, chromates, metal phosphides, silicates and phosphates.12. The coated substrate of wherein said coating further comprises from 0% to 65% claim 11 , by weight based on powder composition weight claim 11 , zinc.13. The coated substrate according to wherein said coating further comprises a minimal amount to 65% claim 12 , by weight based on coating weight claim 12 , zinc.14. The coated substrate according to wherein the at least one corrosion-inhibiting pigment is selected from the group consisting of simple molybdates claim 11 , complex molybdates claim 11 , simple chromates claim 11 , complex chromates claim 11 , metal phosphides claim 11 , silicates claim 11 , simple phosphates and complex phosphates.15. The coated substrate of wherein the at least one corrosion-inhibiting pigment is used in an amount from 5% to 70% by weight based on powder composition weight.16. The coated substrate according to further comprising at least one technology selected from the group consisting of toughening claim 11 , foaming claim 11 , and reinforcing.17. The coated substrate according to wherein said at least one technology is a toughening technology selected from the group consisting of elastomeric modifications claim ...

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Номер записи: 27
24-10-2013 дата публикации

RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIAL, MOLDING OF FIBER-REINFORCED RESIN, AND PROCESS FOR PRODUCTION THEREOF

Номер: US20130281576A1
Автор: Kobayashi Atsuko, Ogura Ichirou
Принадлежит:

The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity and impregnation into a fiber base material and which produces a cured product having excellent heat resistance. A resin composition for a fiber-reinforced composite material contains, as essential components, a poly(glycidyloxyaryl) compound (A), a polymerizable monomer (B) which is an unsaturated carboxylic acid or an anhydride thereof and has a molecular weight of 160 or less, an aromatic vinyl compound or a (meth)acrylate (C), and a radical polymerization initiator (D), wherein an equivalent ratio [glycidyloxy group/acid group] of a glycidyloxy group in the component (A) to an acid group in the component (B) is 1/1 to 1/0.48, and a molar ratio [(B)/(C)] of the component (B) to the component (C) is in the range of 1/0.55 to 1/2. 18-. (canceled)9. A fiber-reinforced plastic molding material comprising , as essential components , reinforcing fibers and a resin composition for a fiber-reinforced plastic molding , wherein the composition comprises , as essential components , a poly(glycidyloxyaryl) compound (A) selected from the group consisting of bisphenol epoxy resins and novolac epoxy resins , a polymerizable monomer (B) selected from the group consisting of acrylic acid , methacrylic acid and anhydrides thereof , an aromatic vinyl compound or a (meth)acrylate (C) , and a radical polymerization initiator (D) , wherein an equivalent ratio [glycidyloxy group/acid group] of a glycidyloxy group in the component (A) to an acid group in the component (B) is 1/1 to 1/0.48 , and a molar ratio [(B)/(C)] of the component (B) to the component (C) is in the range of 1/0.55 to 1/2.10. The fiber-reinforced plastic molding material according to claim 9 , wherein the volume content of the reinforcing fibers is in the range of 40 to 85%.11. A fiber-reinforced plastic molding comprising claim 9 , as essential components claim 9 , reinforcing fibers and a cured ...

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Номер записи: 28
07-11-2013 дата публикации

ELASTOMERIC INSULATION MATERIALS AND THE USE THEREOF IN SUBSEA APPLICATIONS

Номер: US20130291992A1
Автор: Duggal Rajat, Medina Juan Carlos, Schrock Alan K., Shah Harshad M., Wilmot Nathan
Принадлежит: Dow Global Technologies LLC

The invention provides an insulation material comprising an epoxy-terminated prepolymer and an amine curing agent. The reaction production of the epoxy-terminated prepolymer and amine curing agent provides for an elastomer that combines the processing and mechanical properties of polyurethane elastomers with improved thermal-hydrolytic stability. The insulation material is particularly useful as thermal insulation and coating for subsea oil and gas applications. 1. A method of thermally insulating an object from a surrounding fluid , the method comprising interposing an insulation material between the object and the fluid wherein the insulating material comprises the reaction product of(a) an ambient temperature liquid epoxy-terminated prepolymer formed by reacting one or more polyoxyalkyleneamines having a molecular weight of from 3000 to 20,000 with a molar excess of epoxide, wherein the polyether-polyamine has at least 3 active hydrogens and(b) a curing agent comprising at least one amine or polyamine having an equivalent weight of less than 200 and having 2 to 5 active hydrogen atoms.3. The method of wherein U is an alkyl group containing 1 or 2 carbon groups and T and V are independently hydrogen or an alkyl group containing one carbon.5. The method of wherein the epoxide is one or more of diglycidyl ethers of resorcinol claim 4 , catechol claim 4 , hydroquinone claim 4 , bisphenol claim 4 , bisphenol A claim 4 , bisphenol AP (1 claim 4 ,1-bis(4-hydroxylphenyl)-1-phenyl ethane) claim 4 , bisphenol F claim 4 , bisphenol K claim 4 , bisphenol S claim 4 , tetrabromobisphenol A claim 4 , phenol-formaldehyde novolac resins claim 4 , alkyl substituted phenol-formaldehyde resins claim 4 , phenol-hydroxybenzaldehyde resins claim 4 , cresol-hydroxybenzaldehyde resins claim 4 , dicyclopentadiene-phenol resins claim 4 , dicyclopentadiene-substituted phenol resins tetramethylbiphenol claim 4 , tetramethyl-tetrabromobiphenol claim 4 , tetramethyltribromobiphenol claim 4 , ...

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Номер записи: 29
05-12-2013 дата публикации

COATING COMPOSITIONS

Номер: US20130324640A1
Автор: Parish David M.
Принадлежит:

An unsaturated polyester resin composition comprising an unsaturated polyester, an acetoacetate functional monomer; a multifunctional di- or tri-acrylate monomer; and an allyl ether-functional monomer/oligomer, wherein the resin composition is substantially free of styrene. 1. An unsaturated polyester resin composition comprising:(1) an unsaturated polyester;(2) an acetoacetate functional monomer;(3) a multifunctional di- or tri-acrylate monomer; and(4) an allyl ether-functional monomer/oligomer, wherein the resin composition is substantially free of styrene.2. The resin composition as defined by wherein the concentration of the unsaturated polyester is from 10 weight percent to 90 weight percent.3. The resin composition as defined by wherein the unsaturated polyester has a weight average molecular weight of less than 1000.4. The resin composition as defined by wherein the unsaturated polyester is derived from the dihydric alcohol of a group consisting of bisphenol A claim 1 , ethylene glycol claim 1 , 1 claim 1 ,2-propylene glycol claim 1 , 1 claim 1 ,3-propylene glycol claim 1 , 1 claim 1 ,6-hexanediol claim 1 , 1 claim 1 ,4-butanediol claim 1 , diethylene glycol claim 1 , di-1 claim 1 ,2-propylene glycol claim 1 , neopentyl glycol claim 1 , and mixtures thereof.5. The resin composition as defined by claim 1 , wherein the unsaturated polyester is derived from a bisphenolic type epoxy compound.6. The resin composition as defined by claim 1 , wherein the unsaturated polyester is derived from an epoxy novolac.7. The resin composition as defined by claim 1 , wherein the unsaturated polyester is derived from an aliphatic epoxy resin or an alicyclic epoxy resin.8. The resin composition as defined by wherein the allyl ether-functional monomer/oligomer is from 20 weight percent to 30 weight percent of the resin composition.9. The resin composition as defined by wherein the concentration of the acetoacetate functional monomer is from 1 weight percent to 10 weight percent ...

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Номер записи: 30
05-12-2013 дата публикации

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT

Номер: US20130324641A1
Автор: KATSURAYAMA Satoru, MAEJIMA Kenzou, MEURA Toru
Принадлежит: SUMITOMO BAKELITE CO., LTD.

Provided is a method for manufacturing an electronic component by using a solder joining method for bonding a first electronic component having a metal electrode with a second electronic component having a solder electrode, the method comprising; (i) forming a resin layer containing a thermosetting resin on at least one of the solder joint surfaces of said first electronic component and said second electronic component; (ii) positioning said metal electrode of said first electronic component and said solder electrode of said second electronic component to face each other, heating said positioned electrodes and applying pressure, and thereby bringing said metal electrode and said solder electrode into contact; (iii) heating electronic components while applying pressure thereby fusion bonding said solder to said metal electrode; and (iv) heating said resin layer. 1. A resin film comprising a thermosetting resin.2. The resin film according to claim 1 , wherein the thermosetting resin includes an epoxy resin.3. The resin film according to claim 1 , wherein the resin film comprises a flux activating compound.4. The resin film according to claim 1 , wherein the amount of the thermosetting resin in the resin film is 25% to 90% by weight.5. The resin film according to claim 2 , wherein the epoxy resin comprises an epoxy resin which is liquid at room temperature.6. The resin film according to claim 1 , wherein the resin film comprises a curing agent.7. The resin film according to claim 6 , wherein the curing agent is at least one selected from the group consisting of phenols claim 6 , amines and thiols.8. The resin film according to claim 3 , wherein the flux activating compound is a compound having a carboxyl group and/or a phenolic hydroxyl group.9. The resin film according to claim 3 , wherein the amount of the flux activating compound in the resin film is 1% to 30% by weight.10. The resin film according to claim 1 , wherein the resin film comprises a film-forming resin. ...

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Номер записи: 31
12-12-2013 дата публикации

Production Method for Obtaining Fiber-Reinforced Composite Material, and Epoxy Resin Composition Used Therein

Номер: US20130330478A1
Автор: Fukuhara Yasuhiro, Koga Kazuki, Mitani Kazutami, Sano Tomoo, Ushiyama Hisaya
Принадлежит: MITSUBISHI RAYON CO., LTD.

Provided is a method for producing a good epoxy resin composition for obtaining fiber-reinforced plastics. A production method for obtaining a fiber-reinforced composite material by impregnating a fiber assembly with an epoxy resin composition and then curing the epoxy resin composition, wherein the epoxy resin composition contains a component [A], a component [B] and a component [C] respectively satisfying the conditions described below. When the blending amount of the component [B] is set to b parts by mass and the blending amount of the component [C] is set to c parts by mass relative to 100 parts by mass of the component [A] contained in the epoxy resin composition, formula (2) is satisfied within the range of formula (1), formula (4) is satisfied within the range of formula (3), and formula (6) is satisfied within the range of formula (5). 1. A production method for obtaining a fiber-reinforced composite material by impregnating a fiber assembly with an epoxy resin composition and curing , the method comprisingpreparing the epoxy resin composition including a constitutional element [A], a constitutional element [B], and a constitutional element [C] by blending at a temperature of at least 60° C. and no higher than 80° C., wherein, given that a blending amount of the constitutional element [B] is b parts by mass and a blending amount of the constitutional element [C] is c parts by mass with respect to 100 parts by mass of the constitutional element [A], the epoxy resin composition satisfies equation (2) in a range of equation (1), equation (4) in a range of equation (3), and equation (6) in a range of equation (5), whereinthe constitutional element [A] is an epoxy resin of a converted molecular weight a;the constitutional element [B] is 3,3′-diaminodiphenyl sulfone; and [{'br': None, '150 Подробнее

Номер записи: 32
12-12-2013 дата публикации

MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE PLATE AND PRINTED WIRING BOARD USING SAME

Номер: US20130330563A1
Автор: Hashimoto Shintaro, INOUE Yasuo, KOTAKE Tomohiko, MIYATAKE Masato, MURAI Hikari, NAGAI Shunsuke, Takanezawa Shin
Принадлежит: HITACHI CHEMICAL COMPANY, LTD.

There are provided a modified silicone compound prepared by reacting: (A) a siloxane diamine represented by the general formula (1); (B) a maleimide compound with at least two N-substituted maleimide groups in the molecular structure; and (C) an amine compound with an acidic substituent; and also provided a thermosetting resin composition, a prepreg, a laminated plate, and a printed wiring board that are formed by using this compound. The multi-layered printed wiring board produced by using the laminated plate formed by using the prepreg obtained from the modified silicone compound and the thermosetting resin composition of the present invention through laminate molding has an excellent glass transition temperature, coefficient of thermal expansion, copper foil adhesion, hygroscopicity, hygroscopic solder heat resistance, and copper-stuck solder heat resistance. Therefore, the multi-layered printed wiring board is useful as a highly integrated semiconductor package and a printed wiring board for an electronic device. 3. A thermosetting resin composition comprising the modified silicone compound according to .4. The thermosetting resin composition according to claim 3 , further comprising an epoxy resin and/or a cyanate resin are contained as a thermosetting resin.5. The thermosetting resin composition according to claim 3 , further comprising an inorganic filler.6. A prepreg formed by using the thermosetting resin composition according to .7. A laminated plate formed by using the prepreg according to through laminate molding.8. A multi-layered printed wiring board produced by using the laminated plate according to .9. A thermosetting resin composition comprising the modified silicone compound according to .10. The thermosetting resin composition according to claim 9 , further comprising an epoxy resin and/or a cyanate resin are contained as a thermosetting resin.11. The thermosetting resin composition according to claim 9 , further comprising an inorganic filler.12. ...

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Номер записи: 33
19-12-2013 дата публикации

CARGO TANK COATING

Номер: US20130337203A1
Автор: Jackson Paul Anthony, Jones Peter Robert
Принадлежит: AKZO NOBEL COATINGS INTERNATIONAL BV

The invention relates to compositions that can be used as coatings for the inner lining of cargo tanks. The compositions comprise a mixture of epoxy resins, a curing agent, an accelerator or mixture of accelerator(s), and one or more filler(s) or pigment(s), wherein the mixture of epoxy resins comprises 60-80 wt. % of an RDGE epoxy resin and 20-40 wt. % of an epoxy novolac resin, wherein the wt. % is based upon the total weight of the mixture of epoxy resins. 19-. (canceled)10. A coating composition comprising:a. a mixture of epoxy resins;b. a curing agent;c. an accelerator or a mixture of accelerators; and wherein the mixture of epoxy resins comprises 60 to 80 weight % of an RDGE epoxy resin and 20 to 40 weight % of an epoxy novolac resin, wherein the weight % is based upon the total weight of the mixture of epoxy resins; and', 'wherein the amount of curing agent present in the coating composition is such that the equivalent ratio of active hydrogens in the curing agent to the epoxy groups of the mixture of epoxy resins is between about 0.2 and 0.6., 'd. one or more filler(s) or pigment(s);'}11. The coating composition of claim 10 , wherein at least one of the accelerators speeds up the homopolymerization reaction between the epoxy groups of the epoxy resins.12. The coating composition of claim 11 , wherein at least one of the accelerators speeds up the curing reaction between the epoxy groups of the epoxy resins and the functional groups of the curing agent having an active hydrogen.13. The coating composition of claim 10 , wherein the curing agent is an amine curing agent.14. The coating composition of claim 10 , wherein the amount of curing agent present in the coating composition is such that the equivalent ratio of active hydrogens in the curing agent to the epoxy groups of the mixture of epoxy resins is between about 0.2 and 0.4.15. The coating composition of claim 10 , wherein the curing agent is a polyamine curing agent.16. A method for coating a cargo tank ...

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Номер записи: 34
30-01-2014 дата публикации

INTERLAYER FILLER COMPOSITION FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT, COATING FLUID AND PROCESS FOR PRODUCING THREE-DIMENSIONAL INTEGRATED CIRCUIT

Номер: US20140030848A1
Автор: Hirai Takayoshi, IKEMOTO Makoto, KAMIMURA Iho, Kawase Yasuhiro, Murase Tomohide, Takahashi Makoto
Принадлежит: MITSUBISHI CHEMICAL CORPORATION

To provide an interlayer filler composition which, in 3D lamination of semiconductor device chips, forms a highly thermally conductive filling interlayer simultaneously with the bonding of solder bumps or the like and lands between semiconductor device chips, a coating fluid and a process for producing a three-dimensional integrated circuit. 1. An interlayer filler composition for a three-dimensional integrated circuit , which comprises a resin (A) having a melt viscosity at 120° C. of at most 100 Pa·s and a flux (B) , the content of the flux (B) being at least 0.1 part by weight and at most 10 parts by weight per 100 parts by weight of the resin (A).2. The interlayer filler composition for a three-dimensional integrated circuit according to claim 1 , which further contains a curing agent (C).3. The interlayer filler composition for a three-dimensional integrated circuit according to claim 1 , which further contains an inorganic filler (D) having a coefficient of thermal conductivity of at least 1 W/mK in an amount of at least 50 parts by weight and at most 400 parts by weight per 100 parts by weight of the resin (A).4. An interlayer filler composition for a three-dimensional integrated circuit claim 1 , which comprises a resin (A) having a melt viscosity at 120° C. of at most 100 Pa·s and a coefficient of thermal conductivity of at least 0.2 W/mK claim 1 , an inorganic filler (D) having a coefficient of thermal conductivity of at least 2 W/mK claim 1 , a volume average particle size of at least 0.1 μm and at most 5 μm and a maximum volume particle size of at most 10 μm claim 1 , and a curing agent (C) and/or a flux (B).5. The interlayer filler composition for a three-dimensional integrated circuit according to claim 1 , wherein the melt viscosity of the resin (A) at 50° C. is at least 2 claim 1 ,000 Pa·s.6. The interlayer filler composition for a three-dimensional integrated circuit according to claim 1 , wherein the resin (A) is a thermosetting resin.7. The ...

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Номер записи: 35
06-02-2014 дата публикации

Thermoset cross-linked network

Номер: US20140039136A1
Автор: Jean-François Gerard, Jocelyne Galy, Ludo Aerts, Matteo TRAINA, Tamara Dikic, Tom VERBRUGGE
Принадлежит: Dow Global Technologies LLC

Embodiments of the present disclosure include a thermoset cross-linked network and a method of producing the thermoset cross-linked network from a reaction product of a curable epoxy system in a liquid phase and cross-linked reactive polymer microparticles in a solid phase. For the various embodiments, the cross-linked reactive polymer microparticles have a cross-link density and reactive groups that covalently react with the curable epoxy system to provide the thermoset cross-linked network in a single contiguous phase having a topological heterogeneity.

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Номер записи: 36
13-02-2014 дата публикации

TRIMETHYL BORATE IN EPOXY RESINS

Номер: US20140045973A1
Автор: Banda Lameck, Bharadwaj Ashwin R., II William E., Mercer, Mullins Michael J.
Принадлежит: Dow Global Technologies LLC

A composition comprising a polyepoxide, a hardener, trimethyl borate, and a flame retardant is disclosed. Methods for preparing the composition and its end uses are also disclosed. 1. A composition comprising:a) a polyepoxide;b) a hardener;c) trimethyl borate; andd) a flame retardant.2. A composition in accordance with wherein said trimethyl borate is not dispersed in a solvent before becoming part of said composition.3. A composition in accordance with wherein said polyepoxide is also a flame retardant comprising elements selected from the group consisting of bromine claim 1 , phosphorus claim 1 , nitrogen claim 1 , boron claim 1 , and silicon.4. A composition in accordance with wherein said composition has a solids content in the range of from about 76 weight percent to about 79 weight percent.5. A composition in accordance with wherein said polyepoxide contains a derivative of tetrabromobisphenol A.6. A composition in accordance with wherein said polyepoxide is a condensation product of an epoxy novolac with DOPO (6H-dibenz[c claim 1 ,e][1 claim 1 ,2]oxaphosphorin claim 1 , 6-oxide).7. A reactive mixture comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, '(a) a composition of ; and'}(b) an epoxy resin catalyst. and(c) optionally an epoxy resin curing agent.8. A composition in accordance with wherein the gel time measured at 140° C. is increased by at least 10% when compared with the same formulation that does not contain (ii) a trialkyl borate.9. A composition in accordance with wherein the glass transition temperature after full cure is increased by at least 5° C. when compared with the same formulation that does not contain (ii) a trialkyl borate.10. A composition in accordance with further comprising: (d) a fibrous reinforcement.11. A varnish produced from the composition of .12. A prepreg prepared from the varnish of .13. An electrical laminate prepared from the varnish of .14. A printed circuit board prepared from the varnish of .15. A coating ...

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Номер записи: 37
20-03-2014 дата публикации

EPOXY RESIN COMPOSITION FOR INSULATION, INSULATING FILM, PREPREG, AND PRINTED CIRCUIT BOARD

Номер: US20140076198A1
Автор: Kim Jin Young, Lee Keun Yong, Lee Sa Yong, Yun Geum Hee
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Disclosed herein are an epoxy resin composition for insulation, and an insulating film, a prepreg, and a printed circuit board, manufactured using the same, the epoxy resin composition including: a chitin nanoparticle or a chitin nanofiber; a liquid crystal oligomer or a soluble liquid crystal thermosetting oligomer; an epoxy resin; and an inorganic filler, so that the epoxy resin composition, the insulating film, and the prepreg can have a low coefficient of thermal expansion, a high glass transition temperature, and high rigidity. 1. An epoxy resin composition for insulation , the epoxy resin composition comprising:a chitin nanoparticle or a chitin nanofiber;a liquid crystal oligomer or a soluble liquid crystal thermosetting oligomer;an epoxy resin; andan inorganic filler.4. The epoxy resin composition as set forth in claim 1 , wherein it contains 0.5 to 30 wt. % of the chitin nanoparticle or the chitin nanofiber claim 1 , 5 to 60 wt. % of the liquid crystal oligomer claim 1 , 5 to 50 wt. % of the epoxy resin claim 1 , and 30 to 80 wt. % of the inorganic filler.5. The epoxy resin composition as set forth in claim 1 , wherein the liquid crystal oligomer or the soluble liquid crystal thermosetting oligomer has a number average molecular weight of 2 claim 1 ,500 to 6 claim 1 ,500.6. The epoxy resin composition as set forth in claim 1 , further comprising at least one epoxy resin selected from a naphthalene based epoxy resin claim 1 , a bisphenol A type epoxy resin claim 1 , a phenol novolac epoxy resin claim 1 , a cresole novolac epoxy resin claim 1 , a rubber modified epoxy resin claim 1 , and a phosphorous based epoxy resin.7. The epoxy resin composition as set forth in claim 1 , further comprising at least one hardener selected from amide based hardeners claim 1 , polyamine based hardeners claim 1 , acid anhydride hardeners claim 1 , phenol novolac type hardeners claim 1 , polymercaptan hardeners claim 1 , tertiary amine hardeners claim 1 , and imidazole hardeners ...

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Номер записи: 38
20-03-2014 дата публикации

RESIN COMPOSITION FOR INSULATION, INSULATING FILM, PREPREG, AND PRINTED CIRCUIT BOARD.

Номер: US20140080940A1
Автор: Kim Jin Young, Lee Keun Yong, Lee Sa Yong
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Disclosed herein are a resin composition for insulation, and an insulating film, a prepreg, and a printed circuit board, manufactured using the same, the resin composition including: a cellulose nanoparticle or a cellulose nanofiber; a liquid crystalline oligomer or a soluble liquid crystalline thermohardenable oligomer; an epoxy resin; and an inorganic filler, so that the resin composition, the insulating film, and the prepreg can have a low coefficient of thermal expansion, a high glass transition temperature, and high rigidity. 1. A resin composition for insulation , the resin composition comprising:a cellulose nanoparticle or a cellulose nanofiber;a liquid crystalline oligomer or a soluble liquid crystalline thermohardenable oligomer;an epoxy resin; andan inorganic filler.4. The resin composition as set forth in claim 1 , wherein it contains 0.5 to 30 wt. % of the cellulose nanoparticle or the cellulose nanofiber claim 1 , 5 to 60 wt. % of the liquid crystalline oligomer claim 1 , 5 to 50 wt. % of the epoxy resin claim 1 , and 30 to 80 wt. % of the inorganic filler.5. The resin composition as set forth in claim 1 , wherein the liquid crystalline oligomer or the soluble liquid crystalline thermohardenable oligomer has a number average molecular weight of 2 claim 1 ,500 to 6 claim 1 ,500.6. The resin composition as set forth in claim 1 , further comprising at least one epoxy resin selected from a naphthalene based epoxy resin claim 1 , a bisphenol A type epoxy resin claim 1 , a phenol novolac epoxy resin claim 1 , a cresol novolac epoxy resin claim 1 , a rubber modified epoxy resin claim 1 , and a phosphorous based epoxy resin.7. The resin composition as set forth in claim 1 , further comprising at least one hardener selected from amide based hardeners claim 1 , polyamine based hardeners claim 1 , acid anhydride hardeners claim 1 , phenol novolac type hardeners claim 1 , polymercaptan hardeners claim 1 , tertiary amine hardeners claim 1 , and imidazole hardeners.8 ...

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Номер записи: 39
10-04-2014 дата публикации

Water-Based Amine Curing Agents for Curable Resin Systems

Номер: US20140099508A1
Автор: Kincaid Derek Scott, Zhou Hui
Принадлежит: Huntsman Advanced Materials Americas LLC

The present disclosure relates to a water-based amine curing agent which is a reaction product obtained from the reaction of an aqueous epoxy resin dispersion and a polyamine component. The water-based amine curing agent may be used as part of a two component coating system in the curing of modified or unmodified liquid or pre-dispersed curable resin. 2. The water-based amine curing agent of claim 1 , wherein the reaction product is formed in the presence of a surfactant.3. The water-based amine curing agent of claim 1 , wherein the aqueous epoxy resin dispersion has an epoxy equivalent weight of 450 g/eq-2000 g/eq.4. The water-based amine curing agent of claim 3 , wherein the aqueous epoxy resin dispersion has an epoxy equivalent weight of 475 g/eq-600 g/eq.5. The water-based amine curing agent of claim 1 , wherein water is added during and/or after formation of the reaction product such that the curing agent has a solids level of 20% by weight or more.6. The water-based amine curing agent of claim 5 , wherein water is added during and/or after formation of the reaction product such that the curing agent has a solids level of 50% by weight or more.7. The water-based amine curing agent of claim 2 , wherein the surfactant comprises a condensation product of (i) an aliphatic polyol having an average molecular weight of 200-20 claim 2 ,000 g/mol and (ii) a diepoxide having an equivalent weight of 90-3000 g/mol and wherein the equivalent ratio of the OH groups to the epoxy groups is 1:0.85 to 1:3 and the epoxide equivalent weight of the condensation product is between 500-400 claim 2 ,000 g/eq.8. The water-based amine curing agent of claim 1 , wherein the equivalent ratio of polyamine component (B) to aqueous epoxy resin dispersion (A) used in forming the reaction product ranges from about 2:1 to about 12:1.9. The water-based amine curing agent of claim 8 , wherein the equivalent ratio of polyamine component (B) to aqueous epoxy resin dispersion (A) used in forming the ...

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Номер записи: 40
07-01-2016 дата публикации

Oxygen Barrier Compositions and Related Methods

Номер: US20160002492A1
Автор: Galla Matthew P., Golden Josh H., Navarro Luis A.
Принадлежит: TYCO ELECTRONICS CORPORATION

Oxygen barrier compositions for electrical devices and their related methods are provided. In certain embodiments, the oxygen barrier compositions comprise a meta-substituted aromatic resin and an additional aromatic epoxy resin. In some embodiments, the compositions have a chlorine content of less than approximately 1000 ppm. The compositions may have an oxygen permeability of less than approximately 0.4 cm·mm/m·atm·day at approximately 0% relative humidity and approximately 23° C. In certain embodiments, methods of curing the oxygen barrier compositions comprise partially curing the composition where, the partial cure is achieved through ultraviolet radiation or heat. 1. A polymeric positive temperature coefficient device sealed with an oxygen barrier composition comprising:a meta-substituted aromatic resin selected from the group consisting of: meta-substituted resorcinol epoxy resins, meta-substituted acrylic resorcinol resins, meta-substituted methacrylic-resorcinol resins, meta-substituted tetraglycidyl xylenediamine resins, resorcinol, and combinations thereof; andan additional aromatic epoxy resin selected from the group consisting of: bisphenol-F diglycidyl ether, bisphenol-A diglycidyl ether, epoxidized phenol novolac resins, epoxidized cresol novolac resins, polycyclic epoxy resins, naphthalene diepoxides, and combinations thereof;wherein the composition is capable of undergoing a B-stageable cure or a photoinitiated cure, and{'sup': 3', '2, 'wherein the composition has an oxygen permeability of less than approximately 0.4 cm·mm/m·atm·day at approximately 0% relative humidity and approximately 23° C.'}2. A method of coating an electrical device comprising:providing a oxygen barrier composition having: (i) a meta-substituted aromatic resin selected from the group consisting of: meta-substituted resorcinol epoxy resins, meta-substituted acrylic resorcinol resins, meta-substituted methacrylic-resorcinol resins, meta-substituted tetraglycidyl xylenediamine ...

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Номер записи: 41
04-01-2018 дата публикации

SPRAY-COATING METHOD WITH PARTICLE ALIGNMENT CONTROL

Номер: US20180002550A1
Автор: ASKAR KHALID, Chen Dayong, Cohen Robert E., Polak Roberta, Rubner Michael F., Song Kenan
Принадлежит: Massachusetts Institute of Technology

A simple spray coating process can be utilized to create epoxy/HNT nanocomposites with vertically aligned nanotubes. Important mechanical properties such as modulus and hardness values can be optimized and enhanced by controlling the level of nanotube dispersion during processing and the final orientation of the nanotubes. Thus, a technologically relevant processing scheme can be used to fabricate HNT nanocomposites with a high level of control over nanotube alignment and the resulting mechanical properties. 1. A method of making a coating comprising:preparing a surface; andspraying a mixture of a polymer with a plurality of nanotubes through a nozzle onto the surface.2. The method of claim 1 , wherein the nanotubes include halloysite nanotubes.3. The method of claim 1 , wherein the nanotubes include carbon nanotubes claim 1 , graphene claim 1 , nanoclay claim 1 , or silica.4. The method of claim 1 , wherein the polymer includes epoxy.5. The method of claim 1 , wherein the polymer is starch claim 1 , chitosan claim 1 , gelatin claim 1 , cellulose claim 1 , pectin claim 1 , or polyvinyl alcohol.6. The method of claim 1 , wherein the plurality of nanotubes are aligned unidirectionally.7. The method of claim 1 , wherein the plurality of nanotubes are aligned vertically to the surface.8. The method of claim 1 , further comprising flowing a compressed air to facilitate spraying the mixture.9. The method of claim 1 , wherein the mixture further includes a solvent.10. The method of . wherein the solvent is acetone.11. The method of claim 1 , further comprising curing the coating with UV.12. A coating comprising: a polymer; and', 'a plurality of nanotubes; wherein the nanotubes are aligned vertically to a surface., 'a polymer composite comprising'}13. The method of claim 12 , wherein the nanotubes include halloysite nanotubes.14. The method of claim 12 , wherein the nanotubes include carbon nanotubes claim 12 , graphene claim 12 , nanoclay claim 12 , or silica.15. The ...

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Номер записи: 42
02-01-2020 дата публикации

Method for Applyling Intumescent Mesh Coating

Номер: US20200002553A1
Автор: Kreh Robert Paul
Принадлежит: United States Mineral Products Company

The present disclosure relates to intumescent fireproofing coatings and methods to apply these coatings. In particular, the disclosure relates to epoxy-based intumescent fireproofing coatings and methods of applying these coating having a mesh reinforcement. 1. A method for applying an intumescent composition to a substrate , comprising:(i) applying a first epoxy-resin layer to a substrate, the epoxy-resin layer including a first intumescent material and defining an exposed surface when applied to the substrate;(ii) applying a one-part adhesive layer to the exposed surface of the first epoxy-resin layer, wherein the one-part adhesive layer defines an exposed layer surface when applied to the first epoxy-resin layer and includes a polymer selected from the group consisting of a synthetic rubber, a water-based latex polymer, a cyanoacrylate, a polyurethane and a silicone;(iii) applying a mesh to the exposed layer surface of the one-part adhesive layer, wherein the mesh is retained in place by the one-part adhesive; and(iv) applying a second epoxy-resin layer to the mesh-retained adhesive layer, wherein the second epoxy-resin layer includes a second intumescent material.2. The method of claim 1 , wherein the one-part adhesive layer is applied by a roller claim 1 , by a brush claim 1 , or is spray-applied.3. The method of claim 1 , wherein the one-part adhesive layer is spray-applied.4. The method of claim 1 , wherein the first epoxy-resin layer is substantially cured prior to application of the one-part adhesive layer.5. The method of claim 1 , wherein the one-part adhesive layer is a synthetic rubber that includes a rubber material dissolved in an organic solvent.6. The method of claim 1 , wherein the one-part adhesive layer is a polymeric material in a water-based emulsion.7. The method of claim 1 , wherein the one-part adhesive layer is non-continuous and wherein the second epoxy-resin layer makes contact with the first epoxy-resin layer when applied to the non- ...

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Номер записи: 43
12-01-2017 дата публикации

CURING METHOD FOR POLYETHER

Номер: US20170009004A1
Автор: CUNLIFFE Anthony Vernon, TOD David Arthur, TORRY Simon Andrew
Принадлежит:

This invention relates to a novel curing method of oligomers, using metal triflates, and particularly to the curing of hydroxyl terminated elastomers to achieve crosslinked polymers. The method finds particular use as an alternative cure methodology to replace isocyanate curing. There is further provided a cured and crosslinked polymer binder, which is particularly suitable and compatible for use with energetic materials. 125.-. (canceled)27. A method according to claim 26 , wherein at least one of the at least one hydroxy terminated oligomer and the at least one epoxy terminated oligomer comprises at least 5 to 10% w/w of an oligomer which has 3 to 5 functional groups selected from the group consisting of hydroxyl and epoxy functional groups.27. A method according to claim 26 , wherein the admixture comprises a further epoxy terminated oligomer claim 26 , which contains an average of 2.5 to 4 epoxy groups per oligomer chain claim 26 , and is present in the range of from 5-10% w/w.28. A method according to wherein the metal of the at least one metal catalyst is a lanthanide or group III metal.29. A method according to wherein the metal of the at least one metal catalyst is scandium or yttrium.30. A method according to claim 26 , wherein the curing step is carried out in the temperature range of from 40 to 85° C.31. A method according to claim 30 , wherein the curing step is carried out in the temperature range of from 40 to 60° C.32. A method according to claim 26 , wherein the catalyst is added to the admixture in a minimum quantity of a volatile solvent claim 26 , wherein said solvent is removed prior to curing the admixture.33. A method according to claim 26 , wherein the admixture is formed in the substantial absence of solvent.34. A method according to wherein the catalyst is present in an amount of from 0.01% to 2% by mass of the reaction mixture.35. A method according to wherein the admixture further comprises at least one filler material.36. A method ...

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Номер записи: 44
14-01-2016 дата публикации

COMPOSITION AND METHOD OF MAKING WATER BORNE EPOXY HARDENER FOR USE IN TWO-COMPONENT EPOXY SELF LEVELLING COMPOUNDS WITH LONG POT LIFE, FAST CURE AND LOW SHRINKAGE CHARACTERISTICS

Номер: US20160009853A1
Автор: CARTER Neil, Evans Craig, LIU Shuyuan, Martin Ian
Принадлежит: SIKA TECHNOLOGY AG

The present invention is directed at water-reducible curing agents for epoxy resins, obtainable by reacting at least one diprimary amine, at least one mono-primary amine and at least one polyepoxy compound, wherein the molar ratio of the primary amino groups to the epoxy groups in the reaction is in the range of about 1.7:1 to 1:1, the ratio of the primary amines in the diprimary amine to secondary amines optionally present in the diprimary amine is more than 1:1, and the molecular weight (Mw) of the diprimary amine is 500 Daltons or less. These water-reducible curing agents show excellent utility in combination with epoxy resins for self-levelling applications and provide excellent finished properties such as high compressive strength, low shrinkage, high impact resistance and high wear resistance in comparison to the commercially available products. 1. A water-reducible curing agent for epoxy resins , obtained by a reaction of at least one diprimary amine , at least one mono-primary amine and at least one polyepoxy compound , wherein a molar ratio of primary amino groups to the epoxy groups in the reaction is in a range of about 1.7:1 to 1:1 , a ratio of primary amines in the diprimary amine to secondary amines optionally present in the diprimary amine is more than 1:1 , and a molecular weight of the diprimary amine is 500 Dalton or less.2. A water-reducible curing agent according to claim 1 , wherein the molar ratio of the primary amino groups to the epoxy groups in the reaction is about 1.5:1 or less.3. A water-reducible curing agent according to claim 1 , wherein the molar ratio of the at least one diprimary amine to the at least one mono-primary amine is at least 1:1.4. A water-reducible curing agent according to claim 1 , wherein a mass ratio of the primary amines in the diprimary amine claim 1 , with regard to the molar mass of the diprimary amines is at least 20% or more.5. A water-reducible curing agent according to claim 1 , wherein the diprimary amine is ...

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Номер записи: 45
09-01-2020 дата публикации

METALLIC BOTTLE CAN AND METHOD FOR PRODUCING THE SAME

Номер: US20200010242A1
Автор: SHIMIZU Yuusaku, YAMADA Kouji, YUKAWA Yasuhiro
Принадлежит: TOYO SEIKAN CO., LTD.

A metallic bottle can including a metallic base material of the bottle shape that has a mouth portion having a threaded portion, a shoulder portion, a body portion and a bottom portion, wherein, on the outer surface of said mouth portion, a finishing varnish layer is provided directly on said metallic base material, and said finishing varnish layer has an MEK extractability of 2 to 8% by mass. 1. A metallic bottle can including a metallic base material of a bottle shape that has a mouth portion having a threaded portion , a shoulder portion , a body portion and a bottom portion , wherein:on an outer surface of said mouth portion, a finishing varnish layer is provided directly on said metallic base material; andsaid finishing varnish layer has an MEK extractability of 2 to 8% by mass.2. The metallic bottle can according to claim 1 , wherein said finishing varnish layer has the MEK extractability of 7 to 8% by mass.3. The metallic bottle can according to claim 1 , wherein said metallic bottle can is capable of being retort-sterilized.4. The metallic bottle can according to claim 1 , wherein said metallic base material is made from aluminum.5. The metallic bottle can according to claim 1 , wherein the matrix of said finishing varnish layer is a mixed resin containing a polyester resin claim 1 , an epoxy resin and an amino resin.6. The metallic bottle can according to claim 5 , wherein said mixed resin contains no acrylic resin.7. A method for producing the metallic bottle can of claim 1 , including steps of:providing a metallic base material of a bottle shape that has a mouth portion having a threaded portion, a shoulder portion, a body portion, and a bottom portion;applying, on an outer surface of said metallic base material, a coating material for forming a finishing varnish layer;primarily baking the coating material for forming said finishing varnish layer;applying, on an inner surface of said metallic base material, a coating material for forming an inner surface ...

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Номер записи: 46
03-02-2022 дата публикации

IONIC AQUEOUS EPOXY CURING AGENT, PREPARATION METHOD THEREFOR AND USE THEREOF

Номер: US20220033569A1
Автор: Deng Junying, GONG Ji, Ji Xueshun, Li Weifei, Qu Rui, Sun Jiakuan, Wang Qiao, Wang Xiao, ZHANG Chengbin, Zhou Bin
Принадлежит:

An ionic aqueous epoxy curing agent, a preparation method therefor and the use thereof. The aqueous epoxy curing agent is prepared by reacting the following raw materials in parts by weight: a) 1 part of a polyepoxy compound, b) 1.3-6 parts of a multifunctional compound, c) 0.2 to 1.25 parts of a monoepoxy compound, and d) 0.01 to 0.23 parts of a sultone, wherein the multifunctional compound has four or more active hydrogens. The curing agent obtained has a good hydrophilic effect and very good thinning performance, the paint film prepared by mixing same with an epoxy dispersion has the following advantages: excellent salt spray resistance and water resistance, strong adhesion, high hardness, etc.; in addition, the preparation process of the curing agent is simple, the conditions are mild, and room temperature curing is carried out. 1. An ionic aqueous epoxy curing agent , prepared by reacting the following raw materials in parts by weight:a) 1 part of a polyepoxy compound;b) 1.3 to 6 parts of a multifunctional compound;c) 0.2 to 1.25 parts of a monoepoxy compound; andd) 0.01 to 0.23 parts of a sultone;wherein the multifunctional compound has four or more active hydrogens.2. The aqueous epoxy curing agent according to claim 1 , wherein the multifunctional compound is a polyamine compound;the polyamine compound is selected from one or more of aliphatic polyamines, cycloaliphatic polyamines, and aromatic polyamines, whose molar mass does not exceed 1000 g/mol.3. The aqueous epoxy curing agent according to claim 1 , wherein the polyepoxy compound is an aliphatic epoxy resin and/or an aromatic epoxy resin; the epoxide equivalent of the polyepoxy compound is 150 g/mol to 4000 g/mol.4. The aqueous epoxy curing agent according to claim 1 , wherein the monoepoxy compound is selected from one or more of epoxy ethers of phenols claim 1 , epoxy esters of unsaturated alcohols claim 1 , epoxy esters of unsaturated carboxylic acids claim 1 , aliphatic glycidyl ethers claim 1 , ...

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Номер записи: 47
19-01-2017 дата публикации

ANTIFOGGING AGENT COMPOSITION, ANTIFOGGING ARTICLE, AND MANUFACTURING METHOD THEREOF

Номер: US20170015861A1
Автор: KODAIRA Hirokazu, Mori Yusuke, Sugihara Yosuke, Yoneda Takashige
Принадлежит: Asahi Glass Company, Limited

There are provided an antifogging agent composition enabling formation of an antifogging layer excellent in yellowing resistance and bleed resistance and an antifogging article made using the same. The antifogging agent composition contains: a water-soluble epoxy resin; an aluminum compound; and an alkoxysilane compound and/or a partially hydrolyzed condensate of an alkoxysilane compound, wherein the water-soluble epoxy resin is a polyfunctional aliphatic epoxy resin. Further, the antifogging article includes: a substrate; and a resin layer disposed on at least a part of a region on the substrate, having a saturated water absorption amount of 50 mg/cmor more, and having a Martens hardness of 2 N/mmor more. 1. An antifogging agent composition comprising:a water-soluble epoxy resin;an aluminum compound; andan alkoxysilane compound and/or a partially hydrolyzed condensate of an alkoxysilane compound,wherein the water-soluble epoxy resin is a polyfunctional aliphatic epoxy resin.2. The antifogging agent composition according to claim 1 , wherein the aluminum compound is a compound represented by formula (I) claim 1 ,{'br': None, 'sub': n', '(3-n), 'AlXY\u2003\u2003(I)'}{'sup': 1', '2', '3', '4', '1', '2', '3', '4, 'sub': 2', '2, 'where X each independently represents an alkoxy group having 1 to 4 carbon atoms, and Y is each independently a ligand derived from a compound selected from the group consisting of MCOCHCOMand MCOCHCOOM, where M, M, and Meach independently represent an alkyl group having 1 to 4 carbon atoms and Mrepresents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and n represents a number of 0 to 2.'}3. The antifogging agent composition according to claim 1 , wherein the alkoxysilane compound is a compound represented by formula (II) claim 1 ,{'br': None, 'sup': 1', '2, 'sub': p', '(4-p), '(RO)SiR\u2003\u2003(II)'}{'sup': 1', '2, 'where Reach independently represents an alkyl group having 1 to 4 carbon atoms, Reach independently represents ...

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Номер записи: 48
21-01-2016 дата публикации

CURING AGENT FOR TIE-COAT COMPOSITION COMPRISING AN AMINO-SILANE ADDUCT

Номер: US20160017172A1
Автор: PAULSEN Andreas Lundtang, Thorlaksen Peter Christian Weinrich
Принадлежит: HEMPEL A/S

The application discloses a method for applying a fouling-release coating system to a surface, said surface suitably provided with an anticorrosive coat, and an article comprising a substrate, said substrate having a surface, preferably an anticorrosive coat on at least a part of the surface of said substrate and a tie-coat on said substrate. A curing agent composition comprising an amino-silane adduct comprising a high molecular weight amine, HMWA, as well as a tie-coat comprising said curing agent composition are also provided.

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Номер записи: 49
16-01-2020 дата публикации

CURING AGENT FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS

Номер: US20200017629A1
Автор: BURCKHARDT Urs, KASEMI Edis, KRAMER Andreas, STADELMANN Ursula
Принадлежит: SIKA TECHNOLOGY AG

A curing agent for epoxy resins, containing at least one amine adduct of formula (I) which can be obtained as an addition product of a mixture of a primary diamine, a monoalkylated other diamine and a polyepoxide. The curing agent makes it possible to produce low-odor, low-emission epoxy resin products, in particular coatings, which have a surprisingly low viscosity, a high curing rate, a high final hardness, and a surprisingly appealing surface. 2. The curing agent as claimed in claim 1 , wherein Ais selected from the group consisting of 2-methyl-1 claim 1 ,5-pentylene claim 1 , 1 claim 1 ,6-hexylene claim 1 , 2 claim 1 ,2(4) claim 1 ,4-trimethyl-1 claim 1 ,6-hexamethylene claim 1 , 1 claim 1 ,3-cyclohexylenebis(methylene) claim 1 , 1 claim 1 ,4-cyclohexylenebis(methylene) claim 1 , 1 claim 1 ,3-phenylenebis(methylene) claim 1 , 1 claim 1 ,4-phenylenebis(methylene) claim 1 , 1 claim 1 ,2-cyclohexylene claim 1 , 1 claim 1 ,3-cyclohexylene claim 1 , 1 claim 1 ,4-cyclohexylene claim 1 , (1 claim 1 ,5 claim 1 ,5-trimethylcyclohexan-1-yl)methane-1 claim 1 ,3 claim 1 , 4(2)-methyl-1 claim 1 ,3-cyclohexylene claim 1 , 3-aza-1 claim 1 ,5-pentylene claim 1 , 3 claim 1 ,6-diaza-1 claim 1 ,8-octylene claim 1 , 3 claim 1 ,6 claim 1 ,9-triaza-1 claim 1 ,11-undecylene claim 1 , 3 claim 1 ,6 claim 1 ,9 claim 1 ,12-tetraaza-1 claim 1 ,14-tetradecylene claim 1 , 3 claim 1 ,6 claim 1 ,9 claim 1 ,12 claim 1 ,15-pentaaza-1 claim 1 ,17-heptadecylene claim 1 , 4-aza-2 claim 1 ,6-heptylene claim 1 , 4-aza-1 claim 1 ,7-heptylene claim 1 , 4 claim 1 ,7-diaza-1 claim 1 ,10-decylene and 7-aza-1 claim 1 ,13-tridecylene.3. The curing agent as claimed in claim 1 , wherein Ais an alkylene radical having 2 to 6 carbon atoms.4. The curing agent as claimed in claim 1 , wherein Ais 1 claim 1 ,2-propylene and Ais selected from the group consisting of 2-methyl-1 claim 1 ,5-pentylene claim 1 , 1 claim 1 ,6-hexylene claim 1 , 2 claim 1 ,2(4) claim 1 ,4-trimethyl-1 claim 1 ,6-hexamethylene claim 1 , 1 ...

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Номер записи: 50
21-01-2021 дата публикации

ARTICLES COMPRISING DURABLE ICEPHOBIC COATINGS

Номер: US20210017395A1
Автор: KATUGAHA Herath, MCCREA Jonathan, PALUMBO Gino, PANAGIOTOPOULOS Konstantinos, TOMANTSCHGER Klaus
Принадлежит:

Articles including durable and icephobic polymeric coatings are disclosed. The polymeric coatings include a bonding layer which may contain a substantially fully cured polymeric resin providing excellent adhesion to metallic or polymer substrates. The polymeric coating further includes an outer surface layer which is smooth, hydrophobic and icephobic and, in addition to a substantially fully cured resin, contains silicone comprising additives near the exposed outer surface. The anisotropic polymeric coatings are particularly suited for strong and lightweight parts required in aerospace, automotive and sporting goods applications. A process for making the articles is disclosed as well. 1. A non-isotropic article comprising:at least one metallic material layer having a total thickness of at least 25 microns comprising at least one metal chosen from the group consisting of Al, Co, Cu, Fe, Ni, Sn, Ti and Zn; (a) a cured first chemical composition comprising a polymeric resin at an interface between said polymeric coating and said metallic material layer extending at least 2.5 microns in height from the outer surface of the metallic material layer;', (i.b) contains an icephobic material addition composed entirely of solids representing up to 25% by weight of the cured second chemical composition;', '(ii.b) has a Shore D-Scale Hardness of at least 20,', {'sup': '3', '(iii.b) has a sand erosion value according to standard ASTM G76 at an impingement angle of 90 degrees of less than 10 mm/kg;'}, '(iv.b) is hydrophobic; and', '(v.b) has an ice adhesion of less than 200kPa as prepared and of less than 350 kPa after 5 icing/deicing cycles when measured according to ERDC/CRREL Technical Note 03-4;, '(b) a cured second chemical composition comprising a polymeric resin and an icephobic material addition forming an exposed outer surface of said non-isotropic article extending at least 2.5 microns in depth from the exposed outer surface which, after curing], '(ii) a layered and/or ...

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Номер записи: 51
17-04-2014 дата публикации

TWO-COMPONENT COATING COMPOSITIONS

Номер: US20140106075A1
Автор: Becker Wiebke, Dreger Katharina, Flosbach Carmen
Принадлежит:

Two-component coating compositions include: A) a cross-linkable binder compound having at least one functional group reactive towards isocyanate groups, B) a cross-linking agent having at least one free isocyanate group and C) a catalyst component comprising C1) a catalyst for the for the curing reaction between the functional groups of component A) and the isocyanate groups of component B), said catalyst being an organo-metal compound, and C2) an oligomeric or polymeric binder compound having a glass transition temperature Tg of ≧about 20° C., measured by DSC (differential scanning calorimetry) at a heating rate of 10 K/min. The glass transition temperature Tg of the binder compound C2) is above the temperature at which the two-component coating composition is applied, preferably about 10° C. above the temperature at which the two-component coating composition is applied. 1. Two-component coating composition , comprising:A) a cross-linkable binder compound (“cross-linkable binder compound A)”) having a functional group reactive towards isocyanate groups,B) a cross-linking agent having a free isocyanate group andC) a catalyst component (“catalyst component C)”) comprisingC1) a catalyst (“catalyst C1)”) for the curing reaction between the functional groups of component A) and the isocyanate groups of component B), said catalyst being an organo-metal catalyst, andC2) an oligomeric or polymeric binder compound (“binder compound C2)”) having a glass transition temperature Tg of ≧about 20° C., measured by DSC (differential scanning calorimetry) at a heating rate of about 10 K/min, wherein the glass transition temperature Tg of the binder compound C2) is above the temperature at which the two-component coating composition is applied.2. The coating composition of claim 1 , wherein the glass transition temperature of the binder compound C2) is at least about 10° C. above the temperature at which the two-component coating composition is applied.3. The coating composition of ...

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Номер записи: 52
28-01-2016 дата публикации

Aminic hardeners with improved chemical resistance

Номер: US20160024295A1
Автор: Eric B. Ripplinger, Krishnan KARUNAKARAN, Rajesh H. Turakhia
Принадлежит: Blue Cube IP LLC

A hardener composition comprising: a) an epoxy-amine adduct of i) a novolac epoxy resin; and ii) a first amine and b) a modifier wherein the hardener has a viscosity in the range of from 50 to 20,000 mPa·s and wherein a cured epoxy thermoset comprising the hardener exhibits no more than 1% weight loss or gain after immersion in concentrated mineral acid for 7 days at a temperature in the range of from 25° C. to 130° C., is disclosed. The hardener composition can be used with an epoxy resin to form a curable composition.

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Номер записи: 53
28-01-2016 дата публикации

POCESS FOR PROVIDING METALLIC SUBSTRATES WITH CORROSION RESISTANCE

Номер: US20160024310A1
Автор: Coppola Michael, Hanitzsch Ninja, McMullin Robert
Принадлежит:

The present invention relates to the technical field of providing corrosion resistant coatings or anticorrosion coatings on substrates which are susceptible to corrosion, particularly on metallic substrates, especially of providing chromate-free corrosion resistant (anticorrosion) coatings on such substrates. 1. A process for providing a substrate , particularly a metallic substrate , with corrosion resistance and/or with anticorrosion properties ,wherein the process comprises the process step of treating at least one surface of the substrate at least partially with an anticorrosion composition;wherein the anticorrosion composition comprises:(i) a continuous phase, particularly a dispersion medium, preferably a binder (binding agent), especially in an amount from 3 to 99.999% by weight, particularly in an amount from 20 to 99.999% by weight, preferably in an amount from 50 to 99.999% by weight, based on the anticorrosion composition;(ii) at least one carbon-based additive selected from the group consisting of carbon nanotubes (CNTs) and analogous carbon allotropes as well as mixtures and combinations thereof, especially in an amount from 0.001 to 5% by weight based on the anticorrosion composition;(iii) optionally, at least one dispersing agent (dispersant), preferably a polymeric dispersing agent, especially in an amount from 0.0001 to 20% by weight based on the anticorrosion composition;wherein the anticorrosion composition is a dispersion comprising the carbon-based additive dispersed in the continuous phase.2. The process according to claim 1 ,wherein the substrate comprises or consists of at least one metal susceptible to corrosion, especially selected from the group consisting of iron, copper, zinc, aluminum, silver, titanium, tin as well as mixtures, combinations and alloys thereof; and/orwherein the substrate comprises or consists of iron, steel, stainless steel, brass, aluminum, copper as well as mixtures, combinations and alloys thereof.3. The process ...

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Номер записи: 54
28-01-2016 дата публикации

Sour Gas Resistant Coating

Номер: US20160024312A1
Автор: "ODell George William", Decker Owen H., He Lingyun, Kirby Kurt A.
Принадлежит: Valspar Sourcing, Inc.

Coating compositions that include one or more epoxy resin compositions, one or more metal-containing compound and one or more curing agents are described. The compositions can be applied to steel substrates, including steel substrates such as steel pipe to resist attack by sour gas. When applied to a substrate and cured, these coating compositions demonstrate reduced permeability to hydrogen sulfide. 2. The coating composition of claim 1 , comprisingabout 30 to 85 wt % of an epoxy functional polymer having a Tg of above 45° C.;{'sub': '2', 'about 10 to 50 wt % of a metal-containing compound capable of reacting with HS to produce a metal sulfide having low solubility; and'}{'sub': '2', 'about 0.5 to 35 wt % of a curing agent capable of reacting with the epoxy-functional polymer, wherein the composition forms a coating resistant to HS permeation when applied to a steel pipe or vessel.'}3. A method of protecting a steel substrate from HS permeation claim 1 , the method comprising:providing a steel substrate;{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'applying on the steel substrate the coating composition of and'}{'sub': '2', 'curing the composition to form a coating resistant to HS permeation.'}4. The composition of claim 1 , wherein the epoxy-functional polymer is glycidylated.5. The composition of claim 1 , wherein the epoxy-functional polymer is selected from glycidylated novolac resins claim 1 , glycidylated cresol novolac resins claim 1 , glycidylated polyamines claim 1 , or mixtures or combinations thereof.6. The composition of claim 1 , wherein the metal-containing compound is selected from metal oxide claim 1 , metal carbonate claim 1 , metal sulfate claim 1 , metal phosphate claim 1 , metal carboxylate claim 1 , or mixtures or combinations thereof.7. The composition of claim 1 , wherein the metal-containing compound comprises one or more oxides or salts of Fe(II).8. The composition of claim 1 , wherein the metal-containing compound comprises one or ...

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Номер записи: 55
28-01-2016 дата публикации

DISPERSED COMPOSITION, COATING COMPOSITION, COATING FILM, AND COLORED ITEM

Номер: US20160024327A1
Автор: HAYASAKA Tsutomu, NISHINAKA Takeshi, OIZUMI Tetsuro, Ookawa Masahiro
Принадлежит:

The present invention provides a dispersed composition containing an ultramarine (A), a black inorganic pigment (B) (excluding carbon black), and a dispersion medium (C), wherein the weight ratio of ultramarine (A)/black inorganic pigment (B) is from 80/20 to 4.3/95.7. As a result, the invention provides a coating film and a colored item having a high surface resistivity (an antistatic effect) and resistance to overheating by sunlight, as well as a coating composition for forming this coating film and colored item, for use in fields such as black matrices for color filters and automotive coating materials. 1: A dispersed composition comprising an ultramarine (A) , a black inorganic pigment (B) (excluding carbon black) , and a dispersion medium (C) , wherein a weight ratio of ultramarine (A)/black inorganic pigment (B) is from 80/20 to 4.3/95.7.2: The dispersed composition according to claim 1 , wherein the black inorganic pigment (B) is a black inorganic pigment composed of a metal oxide.3: The dispersed composition according to claim 1 , wherein the black inorganic pigment (B) is C.I. Pigment Black 11 or C.I. Pigment Black 33.4: The dispersed composition according to claim 1 , wherein a D50 average particle size of the ultramarine (A) is from 0.1 to 1 μm claim 1 , and a D50 average particle size of the black inorganic pigment (B) is from 0.1 to 1 μm.5: The dispersed composition according to claim 1 , wherein a D99 average particle size of the ultramarine (A) is from 1 to 10 μm.6: The dispersed composition according to claim 1 , wherein a D99 average particle size of the black inorganic pigment (B) is from 1 to 10 μm.7: The dispersed composition according to claim 1 , further comprising a dispersant (D).8: The dispersed composition according to claim 1 , wherein the dispersion medium (C) comprises an organic solvent.9: The dispersed composition according to claim 1 , wherein the dispersion medium (C) comprises one or more organic solvents selected from the group ...

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Номер записи: 56
28-01-2016 дата публикации

LIGHT-SHIELDING PAINT, LIGHT-SHIELDING PAINT SET, LIGHT-SHIELDING FILM, OPTICAL ELEMENT, AND METHOD FOR PRODUCING OPTICAL ELEMENT

Номер: US20160024335A1
Автор: Kubota Reiko, Teramoto Yoji, Yamamoto Shuhei
Принадлежит:

An optical element has a lanthanum-containing glass substrate and a light-shielding film on part of the surface of the glass substrate. The light-shielding film is made from a light-shielding paint that contains at least an epoxy resin, fine particles of titania, a dye, an organic solvent, and an amine-based curing agent. The organic solvent in the light-shielding paint has a vapor pressure of 160 Pa or more and 960 Pa or less at a temperature of 20° C. The viscosity of the light-shielding paint is 10.0 mPa·s or more and 100 mPa·s or less. 1. An optical element comprising:a glass substrate; anda light-shielding film on part of a surface of the glass substrate,wherein:the glass substrate contains lanthanum;the light-shielding film is made from a light-shielding paint containing at least an epoxy resin, fine particles of titania, a dye, an organic solvent, and an amine-based curing agent; andthe organic solvent in the light-shielding paint has a vapor pressure of 160 Pa or more and 960 Pa or less at a temperature of 20° C.2. The optical element according to claim 1 , whereina viscosity of the light-shielding paint is 10.0 mPa·s or more and 100 mPa·s or less.3. The optical element according to claim 1 , wherein:the organic solvent includes a first organic solvent and a second organic solvent; andthe first organic solvent has a boiling point of 150° C. or more and 210° C. or less.4. The optical element according to claim 3 , whereinthe first organic solvent is benzyl alcohol, 2-ethyl-1-hexanol, butyl cellosolve, 1-butoxy-2-propanol, or a mixture thereof.5. The optical element according to claim 3 , whereinthe second organic solvent is propylene glycol monomethyl ether.6. The optical element according to claim 1 , whereinthe substrate is a lens or a prism.7. The optical element according to claim 1 , whereinthe substrate has a refractive index of 1.60 or more and 2.00 or less.8. A light-shielding paint comprising:an epoxy resin;fine particles of titania;a dye;an organic ...

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Номер записи: 57
28-01-2016 дата публикации

POWDER COATINGS COMPOSITIONS

Номер: US20160024336A1
Автор: Aguirre Vargas Fabio, Marks Maurice J.
Принадлежит: Blue Cube IP LLC

A solid epoxy resin powder coarting composition which includes a divinylarene dioxide resin as one component; and wherein the solid epoxy resin powder coating composition can be formed by blending or reacting various other components with the divinylarene dioxide resin. For example, other components can include other epoxy resins; phenolic resins; or monomeric and/or polymeric isocyanates. The powder coating composition or formulation may advantageously provide, for example, a Fusion Bonded Epoxy coating on a substrate. 1. A composition comprising a solid curable powder coating formulation including (i) at least one divinylarene dioxide resin , wherein the at least one divinylarene dioxide resin eposxy functional; and (ii) at least one curing component , wherein the at least one curing component is an epoxy resin , a blend of an epoxy resin and a curing catalyst , or mixtures thereof.24-. (canceled)5. The composition of claim 1 , wherein the divinylarene dioxide resin claim 1 , component (i) claim 1 , comprises (a) a blend of a solid epoxy resin and a divinylarene dioxide compound; or (b) an epoxy oxazolidone resin prepared from a divinylarene dioxide compound and a monomeric isocyanate or a polymeric isocyanate; or (c) a phenolic hardener prepared from a divinylarene dioxide compound and a diphenol.6. The composition of claim 1 , wherein the divinylarene dioxide compound comprises divinylbenzene dioxide.7. The composition of claim 5 , wherein the solid epoxy resin comprises an epoxy resin prepared from a stoichiometric excess of bisphenol A diglycidyl ether and bisphenol A having a Tg of greater than about 30° C.8. The composition of claim 5 , wherein the epoxy oxazolidone resin comprises the reaction product of a stoichiometric excess of divinylbenzene dioxide and a monomeric or polymeric isocyanate selected from toluene diisocyanate claim 5 , methylenediphenyl diisocyanate claim 5 , xylylene diisocyanate claim 5 , isophorone diisocyanate claim 5 , hexamethylene ...

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Номер записи: 58
22-01-2015 дата публикации

LIQUID COATING COMPOSITION AND A COATING METHOD USING THE SAME

Номер: US20150024213A1
Автор: CHIANG CHWAN-HWA, WANG CHIEH-HSIANG
Принадлежит:

A liquid coating composition to protect electronic elements on a circuit board includes a heat curable resin composition, a photocurable resin, a photoinitiator, a curing agent, and a solvent. The heat curable resin composition includes poly(acrylic acid) oligomer and at least one compound selected from the group consisting of an epoxy resin and polyester polyol. The curing agent includes at least one compound selected from the group consisting of dicarboxylic anhydride and isocyanate. A method for applying and solidifying the liquid coating composition to form a cured film on a substrate and a resulting composite structure are also provided. 1. A liquid coating composition , comprising:a heat curable resin composition comprising poly (acrylic acid) oligomer and at least one compound selected from the group consisting of an epoxy resin and polyester polyol;a photocurable resin;a photoinitiator;a curing agent comprising at least one compound selected from the group consisting of dicarboxylic anhydride and isocyanate; anda solvent.2. The liquid coating composition of claim 1 , wherein if the heat curable resin composition includes the epoxy resin claim 1 , the curing agent includes at least the dicarboxylic anhydride of the group consisting of dicarboxylic anhydride and isocyanate claim 1 , and if the heat curable resin composition comprises the polyester polyol claim 1 , the curing agent includes at least the isocyanate of the group consisting of dicarboxylic anhydride and isocyanate.3. The liquid coating composition of claim 1 , wherein the photocurable resin is acrylic monomer.4. The liquid coating composition of claim 3 , wherein the acrylic monomer is selected from the group consisting of trimethtylol propane triacrylate claim 3 , tripropylene glycol diacrylate claim 3 , dipropylene glycol diacrylate claim 3 , 1 claim 3 ,6-hexanediol diacrylate claim 3 , and dipentaerythritol hexa(meth)acrylate.5. The liquid coating composition of claim 1 , wherein the poly( ...

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Номер записи: 59
17-04-2014 дата публикации

LOW-EMISSION HARDENER FOR EPOXY RESINS

Номер: US20140107313A1
Автор: BURCKHARDT Urs, KASEMI Edis, KRAMER Andreas, STADELMANN Ursula
Принадлежит: SIKA TECHNOLOGY AG

The present invention concerns a low-odor, low-viscosity hardener for epoxy resins comprising the amine of formula (I), 2. Hardener according to claim 1 , wherein it furthermore comprises at least one polyamine claim 1 , which has at least three amine hydrogens reactive to epoxy groups.3. Hardener according to claim 2 , wherein the polyamine is chosen from the group consisting of 1 claim 2 ,3-pentane diamine claim 2 , 1 claim 2 ,5-diamino-2-methylpentane claim 2 , 2-butyl-2-ethyl-1 claim 2 ,5-pentane diamine claim 2 , 1 claim 2 ,6-hexane diamine claim 2 , 2 claim 2 ,2 claim 2 ,4- and 2 claim 2 ,4 claim 2 ,4-trimethylhexamethylene diamine claim 2 , 1 claim 2 ,12-dodecane diamine claim 2 , 1 claim 2 ,3-diaminocyclohexane claim 2 , bis-(4-aminocyclohexyl)methane claim 2 , bis-(4-amino-3-methylcyclohexyl)methane claim 2 , 1-amino-3-aminomethyl-3 claim 2 ,5 claim 2 ,5-trimethylcyclohexane claim 2 , 1 claim 2 ,3-bis-(aminomethyl)cyclohexane claim 2 , 1 claim 2 ,3-bis-(aminomethyl)benzene claim 2 , bis-hexamethylene triamine claim 2 , diethylene triamine claim 2 , triethylene tetramine claim 2 , tetraethylene pentamine claim 2 , pentaethylene hexamine and higher homologues of linear polyethylene amines such as polyethylene polyamines with 5 to 7 ethylene amine units claim 2 , dipropylene triamine claim 2 , N-(2-aminoethyl)-1 claim 2 ,3-propane diamine claim 2 , N claim 2 ,N′-bis(3-aminopropyl)ethylene diamine claim 2 , polyoxyalkylene diamines and polyoxyalkylene triamines with a molecular weight in the range of 200 to 500 g/mol claim 2 , polyamidoamines claim 2 , phenalkamines claim 2 , compounds of the mentioned polyamines fully or partly alkylated to primary amino groups and adducts of the mentioned polyamines with epoxides and epoxy resins.4. Hardener according to claim 2 , wherein the polyamine has at least one secondary amino group.5. Hardener according to claim 2 , wherein the ratio of the number of amine hydrogens of the amine of formula (I) that are reactive to ...

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Номер записи: 60
25-01-2018 дата публикации

Moisture Barrier Coatings

Номер: US20180022661A1
Автор: Achille Felix, Glover A. Jaeton, Granquist Victor, Hudson Alice
Принадлежит:

Moisture barrier coatings and sealants comprised of mixtures of organic wax and wax soluble polymer dispersed into one or more components of a thermoset polymer which may form a semi-interpenetrating polymer network when the thermoset polymer is subsequently cured on the substrate. The organic wax and wax soluble polymer substantially improve the moisture barrier properties of the thermoset polymer and provides an effective moisture barrier coating that is non-tacky at the cure temperature of the thermoset polymer, without the requirement for a cooling step. 2. The moisture barrier coating of claim 1 , wherein the organic wax is at least one selected from the group consisting of:a. petroleum waxes;b. synthetic waxes;c. natural waxes; and,d. hydrogenated triglycerides.3. The moisture barrier coating of claim 1 , wherein the wax soluble polymera. is substantially non-reactive with the said thermoset polymerb. forms a homogeneous mixture with the said wax at 100° C.c. has a viscosity of less than 10.000 centipoise at 100° C. when at least 2 percent by weight is mixed with the said wax.4. The moisture barrier coating of claim 3 , wherein the wax soluble polymer is at least one selected from the group consisting of:a. ethylene-vinyl acetate copolymers and terpolymers;b. modified polyolefins;c. acrylate ester polymers and copolymers; and,d. tackifying resins5. The moisture barrier coating of claim 1 , wherein the thermoset polymer is at least one selected from the group consisting of:a. polyurethanes;b. polyepoxides; and,c. alkyd resins.6. The moisture barrier coating of claim 1 , wherein the composition is a semi-interpenetrating polymer network.7. The moisture barrier coating of claim 1 , wherein the organic wax is a paraffin.8. The moisture barrier coating of claim 1 , wherein the wax soluble polymer is at least one selected from the group consisting of ethylene vinyl acetate copolymers and terpolymers.9. The moisture barrier coating of claim 1 , comprising at least ...

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Номер записи: 61
25-01-2018 дата публикации

COATING COMPOSITIONS FOR COIL COATING, METHODS FOR MAKING SUCH COATING COMPOSITIONS AND COIL COATING METHODS

Номер: US20180022935A1
Автор: Calhoun Eric, Uhlianuk Peter W.
Принадлежит: AXALTA COATING SYSTEMS IP CO., LLC

Coating compositions for coil coating, methods for making such coating compositions and coil coating methods are provided. In an exemplary embodiment, a coating composition includes an organic solvent carrier and a film-forming binder dispersed in the organic solvent carrier. The film-forming binder contains an epoxy-amine adduct and a blocked or unblocked polyisocyanate crosslinking agent. The film-forming binder has associated amine groups until subjected to a temperature of at least about 165.5° C. (330° F.). The coating composition also contains a pigment and a grinding resin. The coating composition has a solids content of at least about 50 wt. % based on a total weight of the coating composition. 1. A coating composition comprising:an organic solvent carrier;a film-forming binder dispersed in the organic solvent carrier, the film-forming binder comprising an epoxy-amine adduct and a blocked or unblocked polyisocyanate crosslinking agent, wherein the film-forming binder has associated amine groups until subjected to a temperature of at least about 165.5° C. (330° F.);a pigment; anda grinding resin,wherein the coating composition has a solids content of at least about 50 wt. % based on a total weight of the coating composition.2. The coating composition of claim 1 , wherein the coating composition has the solids content of from about 50 wt. % to about 70 wt. % based on the total weight of the coating composition.3. The coating composition of claim 1 , wherein the coating composition has the solids content of from about 70 wt. % based on the total weight of the coating composition.4. The coating composition of claim 1 , wherein the epoxy-amine adduct comprises a reaction product of a polyepoxide and a polyether polyol.5. The coating composition of claim 4 , wherein the polyepoxide is a polyglycidyl ether of a cyclic polyol.6. The coating composition of claim 4 , wherein the polyepoxide comprises a bisphenol A/epichlorohydrin-derived liquid epoxy resin.7. The ...

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Номер записи: 62
24-01-2019 дата публикации

POWDER COATINGS AND COMPOSITIONS THEREOF AND METHODS FOR COATING AN ARTICLE

Номер: US20190023908A1
Автор: Eliseeva Tatiana
Принадлежит: AXALTA COATING SYSTEMS IP CO., LLC

Powder coatings and compositions thereof, and methods for coating an article are provided. In one example, a composition for a powder coating includes a binder including a binder resin portion and a binder curing portion. The binder resin portion includes a first epoxy resin having an epoxide equivalent weight of from about 500 to about 560 g/eq. A second epoxy resin has an epoxide equivalent weight of from about 1600 to about 1950 g/eq. A third epoxy resin has an epoxide equivalent weight of from about 850 to about 1050 g/eq. 1. A composition for a powder coating , the composition comprising: a first epoxy resin having an epoxide equivalent weight of from about 500 to about 560 g/eq;', 'a second epoxy resin having an epoxide equivalent weight of from about 1600 to about 1950 g/eq; and', 'a third epoxy resin having an epoxide equivalent weight of from about 850 to about 1050 g/eq., 'a binder comprising a binder resin portion and a binder curing portion, wherein the binder resin portion comprises2. The composition of claim 1 , wherein the first epoxy resin is a novolac modified epoxy resin having an epoxide group content of from about 1790 to about 2000 mmol/kg.3. The composition of claim 1 , wherein the first epoxide resin has a softening point T(g) of from about 90 to about 98° C.4. The composition of claim 1 , wherein the second epoxy resin is a product reaction of epichlorohydrin and bisphenol A.5. The composition of claim 1 , wherein the second epoxy resin has a softening point T(g) of from about 126 to about 137° C.6. The composition of claim 1 , wherein the third epoxy resin is a carboxyl-terminated-butadiene-nitrile (CTBN) modified epoxy resin that is an adduct of a bisphenol A epoxy resin and carboxyl-terminated-butadiene-nitrile rubber.7. The composition of claim 1 , wherein the third epoxy resin has a softening point T(g) of from about 65 to about 85° C.8. The composition of claim 1 , wherein the binder resin portion consists of the first epoxy resin claim ...

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Номер записи: 63
24-01-2019 дата публикации

RESIN COMPOSITION, COATING COMPOSITION AND ARTICLE BY USING THE SAME

Номер: US20190023936A1
Автор: HWANG Kuen-Yuan, LAI I-Chiang, LIN Ying-Jui, LIN Yung-Sheng, WONG Yi-Sern
Принадлежит:

An epoxy resin composition comprising a blend of at least (i) at least one epoxy group containing a polycyclic group, and (ii) at least one epoxy group that is different from the epoxy resin in component (i). As exemplary of component (i) is an epoxidized tricyclo decanedimethanol. A renewable epoxy of component (ii) is cardanol epoxy, derived from cashew nut shell oil (CNSL). Optionally, a component (iii) which is any other epoxy from that of (i) and (ii) can be included, such as Bisphenol-A/F diglycidal ether. The blend is characterized by low viscosity, making it amenable to airless spray application, high solids content and excellent solvent resistance and abrasion resistance. 1. A resin composition comprising:a component (i): an epoxy resin comprising an epoxidized tricyclo decanedimethanol, anda component (ii): an epoxy resin comprising an epoxidized cardanol.2. The resin composition according to claim 1 , further comprising at least one component (iii) which comprises one epoxy resin other than the component (i) and the component (ii).4. The resin composition according to claim 1 , wherein the tricyclo decanedimethanol is one selected from the group consisting of{'sup': '2-6', '3,8-bis(hydroxymethyl)tricyclo[5.2.1.0]decane;'}{'sup': '2-6', '3,9-bis(hydroxymethyl)tricyclo[5.2.1.0]decane;'}{'sup': '2-6', '4,8-bis(hydroxymethyl)tricyclo[5.2.1.0]decane;'}{'sup': '2-6', '4,9-bis(hydroxymethyl)tricyclo[5.2.1.0]decane;'}{'sup': '2-6', '5,8-bis(hydroxymethyl)tricyclo[5.2.1.0]decane;'}{'sup': '2-6', '5,9-bis(hydroxymethyl)tricyclo[5.2.1.0]decane and combinations thereof.'}5. The resin composition according to claim 2 , wherein the component (iii) is one selected from the group consisting of epoxidized Bisphenol-A claim 2 , epoxidized Bisphenol-F claim 2 , epoxidized Bisphenol B claim 2 , epoxidized Bisphenol BP claim 2 , epoxidized Bisphenol E claim 2 , epoxidized Bisphenol G claim 2 , epoxidized Bisphenol P claim 2 , epoxidized Bisphenol PH claim 2 , epoxidized ...

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Номер записи: 64
24-01-2019 дата публикации

COATED SPRING

Номер: US20190024745A1
Автор: GROSS Marcel, HYMON Kerstin, LECHNER Dieter, SIMOS Pashalis
Принадлежит:

An electrically conductive component, which can be used in motor vehicles, may include a surface having a layered covering. The layered covering may be a melted and cured product of coating with a powder composition. Further, the layered covering may have a layer thickness of greater than 150 μm, and the layered covering may be a single-layer covering. The layered covering may also include a pore-like layer structure. The pore-like layer structure of the layered covering may be responsible for an at-least-15% reduction in density of the layered covering relative to a density of the layered covering without the pore-like layer structure. 115.-. (canceled)16. An electrically conductive component comprising a surface with a layered covering , wherein the layered coveringhas a layer thickness of greater than 150 μm,is a melted and cured product of coating with a powder composition,is a single-layer covering, andcomprises a pore-like layer structure.17. The electrically conductive component of wherein the layered covering comprises less than 3% by weight of one or more corrosion inhibitors based on the layered covering.18. The electrically conductive component of wherein the pore-like layer structure of the layered covering is responsible for an at-least-15% reduction in density of the layered covering relative to a density of the layered covering without the pore-like layer structure.19. The electrically conductive component of wherein the pore-like layer structure comprises pores having a mean pore diameter of greater than 5 μm.20. The electrically conductive component of wherein the layered covering comprises at least 10% by weight of a fiber component based on the layered covering.21. A layered covering on a surface of the electrically conductive component claim 16 , wherein the layered coveringhas a layer thickness of greater than 150 μm,is a melted and cured product of coating with a powder composition,is a single-layer covering, andcomprises a pore-like layer ...

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Номер записи: 65
28-01-2021 дата публикации

STEPPED SUBSTRATE COATING COMPOSITION CONTAINING COMPOUND HAVING CURABLE FUNCTIONAL GROUP

Номер: US20210024773A1
Автор: Endo Takafumi, HASHIMOTO Keisuke, Nakajima Makoto, OGATA Hiroto, TOKUNAGA Hikaru
Принадлежит: NISSAN CHEMICAL CORPORATION

A stepped substrate coating composition for forming a coating film having planarity on a substrate, including: a main agent and a solvent, the main agent containing a compound (A), a compound (B), or a mixture thereof, the compound (A) having a partial structure Formula (A-1) or (A-2): 2. The stepped substrate coating composition according to claim 1 , wherein the aromatic ring is a benzene ring claim 1 , a naphthalene ring claim 1 , or an anthracene ring.3. The stepped substrate coating composition according to claim 1 , wherein the polymer containing the aromatic ring is prepared by substitution of a hydroxyl group of a polymer having a hydroxyaryl novolac structure with an organic group of Formula (A-1) or (A-2).4. The stepped substrate coating composition according to claim 1 , wherein the monomer containing the aromatic ring is prepared by substitution of a hydroxyl group of the aromatic ring with an organic group of Formula (A-1) or (A-2).5. The stepped substrate coating composition according to claim 1 , wherein claim 1 , when the main agent is a mixture of the compound (A) and the compound (B) claim 1 , the ratio by mole of an epoxy group to a vinyl group is 100:1 to 1:100.6. The stepped substrate coating composition according to claim 1 , wherein the composition further comprises an acid generator.7. The stepped substrate coating composition according to claim 1 , wherein the composition further comprises a surfactant.8. A method for producing a coated substrate claim 1 , the method comprising a step (i) of applying the stepped substrate coating composition according to to a stepped substrate; and a step (ii) of exposing the composition applied in the step (i) to light or heating the composition during or after light exposure.9. The method for producing a coated substrate according to claim 8 , wherein the method further comprises a step (ia) of heating the stepped substrate coating composition at a temperature of 70° C. to 400° C. for 10 seconds to five ...

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Номер записи: 66
02-02-2017 дата публикации

EPOXY RESIN COMPOSITION

Номер: US20170029556A1
Автор: Drumright Ray E., SHEN Yue, Wu Yan, Zhan Fu
Принадлежит:

An epoxy resin composition having desirable drying time and capable of providing coating films with satisfactory weathering resistance, good adhesion to an epoxy primer coat and good flexibility, and high impact strength; a process for preparing the epoxy resin composition; and a curable coating composition comprising the epoxy resin composition. 2. The epoxy resin composition of claim 1 , wherein z is 0 and —CHO— is a Cto Ccycloalkylene group claim 1 , a Cto Caliphatic hydrocarbon group claim 1 , or a mixture thereof.3. The epoxy resin composition of claim 1 , wherein Rand Reach is independently a Cto Ccycloalkylene group claim 1 , a Cto Caliphatic hydrocarbon group claim 1 , or a mixture thereof.5. The epoxy resin composition of claim 1 , having an acid value of one milligram potassium hydroxide per gram or less.6. A process of preparing the epoxy resin composition of claim 1 , comprising:(i) reacting a cycloaliphatic saturated carboxylic acid or its anhydride with an alcohol to form a carboxylic acid-containing half-ester compound, wherein the alcohol is an alkyl alcohol having two hydroxyl groups and/or its dimer; and(ii) reacting the half-ester compound with a polyglycidyl ether component selected from a saturated polyglycidyl ether of an alkyl alcohol, a saturated cycloaliphatic polyglycidyl ether, or mixtures thereof; wherein at least one saturated polyglycidyl ether in the polyglycidyl ether component has an epoxy functionality more than 2; and the molar ratio of the polyglycidyl ether component to the half-ester compound is larger than 1 and smaller than 2.7. The process of claim 6 , wherein the molar ratio of the polyglycidyl ether component to the half-ester compound is larger than 1 and no more than 1.5.8. The process of claim 6 , wherein the alcohol used to form the half-ester compound is a cycloaliphatic alcohol.9. The process of claim 6 , wherein the alcohol used to form the half-ester compound is selected from neopentylglycol claim 6 , propylene ...

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Номер записи: 67
02-02-2017 дата публикации

Compositions for Containers and Other Articles and Methods of Using Same

Номер: US20170029657A1
Автор: "OBrien Robert M.", Evans Richard H., Niederst Jeffrey, Romagnoli Kevin, Von Maier Mark S.
Принадлежит: Valspar Sourcing, Inc.

This invention provides a polymer, which is preferably a polyether polymer. The polymer may be uses in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings. 120-. (canceled)22. The article of claim 21 , wherein Ris —CH—.23. The article of claim 21 , wherein Rincludes at least 10 carbon atoms.24. The article of claim 21 , wherein Rincludes at least 12 carbon atoms.25. The article of claim 21 , wherein Rincludes 8 to 15 carbon atoms.26. The article of claim 21 , wherein Rincludes 10 to 15 carbon atoms.27. The article of claim 21 , wherein Rhas an atomic weight of less than 500 Daltons.28. The article of claim 21 , wherein Rincludes at least 8 carbon atoms and includes one or more cyclic groups.29. The article of claim 28 , wherein the carbon atom of Rthat is attached to a carbon atom of each of the depicted phenylene groups is not present in a monocyclic cyclohexyl group.30. The article of claim 28 , wherein the one or more cyclic groups comprises one or more aromatic groups.31. The article of claim 29 , wherein the one or more cyclic groups comprises one or more alicyclic groups.32. The article of claim 21 , wherein each depicted oxygen atom in Formula (I) is located at a para position relative to R.33. The article of claim 21 , wherein each Ris independently a methyl moiety.34. The article of claim 21 , wherein v is independently 2 to 4 claim 21 , and wherein both depicted phenylene groups includes an Rgroup located at each ortho ring position claim 21 , relative to each depicted oxygen atom claim 21 , that includes only one carbon atom.35. The article of claim 21 , wherein the dihydric phenol comprises hydroquinone claim 21 , catechol claim 21 , resorcinol claim 21 , a substituted ...

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Номер записи: 68
02-02-2017 дата публикации

ANTI-SLIP FLOORING MATERIAL, METHOD FOR MANUFACTURING ANTI-SLIP FLOORING MATERIAL, AND METHOD FOR CONSTRUCTING FLOOR BY USING ANTI-SLIP FLOORING MATERIAL

Номер: US20170029678A1
Автор: CHUNG Hwayoung, HWANG Seokhwan, NOH Taejoon, YUN Kangjae
Принадлежит: TWO H CHEM LTD.

Disclosed are an anti-slip flooring material, a method of manufacturing the anti-slip flooring material, and a method of constructing a floor using the anti-slip flooring material. The anti-slip flooring material includes a polyolefin powder, the polyolefin powder being coated with silane. The anti-slip flooring material also includes: a base for a flooring material, including a polyolefin powder and a polymer for a flooring material, and a curing agent for a flooring material, including a polymer curing agent, wherein the polyolefin powder is coated with silane. The method of manufacturing the anti-slip flooring material includes: forming a polyolefin powder by grinding a polyolefin pellet and coating the polyolefin powder with silane. The method of constructing a floor using the anti-slip flooring material includes forming an anti-slip layer by applying, on the floor, the anti-slip flooring material including a polyolefin powder coated with silane. 1. An anti-slip flooring material , comprising:a polyolefin powder,wherein the polyolefin powder is coated with silane.2. The anti-slip flooring material of claim 1 , wherein the polyolefin comprises at least one selected from among polyethylene claim 1 , ultrahigh-molecular-weight polyethylene claim 1 , low-density polyethylene claim 1 , linear low-density polyethylene claim 1 , high-density polyethylene claim 1 , and polypropylene.3. The anti-slip flooring material of claim 1 , wherein the polyolefin powder has a particle size of 30 to 1 claim 1 ,000 μm.4. The anti-slip flooring material of claim 1 , wherein the silane comprises at least one selected from among dimethyldimethoxysilane claim 1 , methyltrimethoxysilane claim 1 , methyltriethoxysilane claim 1 , and tetraethoxysilane.5. An anti-slip flooring material claim 1 , comprising:a base for a flooring material, comprising a polyolefin powder and a polymer for a flooring material; anda curing agent for a flooring material, comprising a polymer curing agent,wherein ...

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Номер записи: 69
04-02-2016 дата публикации

HARD COAT FILM AND METHOD FOR MANUFACTURING SAME

Номер: US20160032139A1
Автор: Ito Daisuke, KIKUCHI Shinji
Принадлежит: Daicel Corporation

Provided is a hard coat film including a hard coat layer that has high pencil hardness and high scratch resistance and still offers excellent transparency. 1. A hard coat film comprising:a plastic substrate; anda hard coat layer disposed on or over at least one surface of the plastic substrate, 3,4,3′,4′-diepoxybicyclohexyl;', 'at least one selected from the group consisting of hydroxy-containing silicon compounds and silica fillers; and', 'an acid generator., 'wherein the hard coat layer is formed from a curable composition comprising2. The hard coat film according to claim 1 ,wherein the hard coat layer has a thickness of 20 μm or more.3. The hard coat film according to one of and claim 1 ,wherein the hard coat layer comprises surface elements comprising:silicon; andat least one element selected from the group consisting of sulfur, phosphorus, fluorine, and antimony,where the surface elements are analyzed by ESCA of a surface of the hard coat layer.4. The hard coat film according to claim 1 ,wherein the hard coat film has a haze of 1.5% or less.5. A method for producing the hard coat film according to claim 1 , the method comprising the steps of:applying a curable composition to a surface of a plastic substrate; andcuring the applied curable composition, 3,4,3′,4′-diepoxybicyclohexyl;', 'at least one selected from the group consisting of hydroxy-containing silicon compounds and silica fillers; and', 'an acid generator., 'the curable composition comprising6. A hard coat film comprising:a plastic substrate; anda hard coat layer disposed on or over at least one surface of the plastic substrate,wherein the hard coat layer has a ratio a2/a1 of 0.1 or less and a ratio a3/a1 of 0.1 or less,where, in an ATR-IR spectrum of a surface of the hard coat layer, a1 represents an absorbance of an absorption peak assigned to an ether bond C—O stretching vibration; a2 represents an absorbance of an absorption peak assigned to an ester bond C═O stretching vibration; and a3 ...

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Номер записи: 70
01-02-2018 дата публикации

TWO-PART ADHESIVE INCLUDING TOUGHENED CURATIVE

Номер: US20180030318A1
Автор: Chen Lianzhou
Принадлежит:

A two-part adhesive is provided comprising: A) a curative part comprising: i) an epoxy curative; and ii) a reaction intermediate which is the reaction product of a suspension of core/shell rubber nanoparticles in a liquid epoxy resin and an excess of the epoxy curative; wherein the curative part comprises greater than 1.1 wt % core/shell rubber nanoparticles; and B) an epoxy part comprising: iii) a liquid epoxy resin; and iv) greater than 9.1 wt % core/shell rubber nanoparticles. In some embodiments, the epoxy part additionally comprises greater than 5.1 wt % solid epoxy resin, such as, e.g., triglycidyl ether of trisphenol-methane. In some embodiments, the sum of the wt % solid epoxy resin and the wt % core/shell rubber nanoparticles in the epoxy part is greater than 41.0%. In some embodiments, the sum of the wt % solid epoxy resin and the wt % core/shell rubber nanoparticles in the mixed adhesive is greater than 26.0%. 1. A two-part adhesive comprising: i) an epoxy curative; and', 'ii) a reaction intermediate which is the reaction product of a suspension of core/shell rubber nanoparticles in a liquid epoxy resin and an excess of the epoxy curative;, 'A) a curative part comprisingwherein the curative part comprises greater than 1.1 wt % core/shell rubber nanoparticles;and iii) a liquid epoxy resin; and', 'iv) greater than 9.1 wt % core/shell rubber nanoparticles., 'B) an epoxy part comprising2. The two-part adhesive according to wherein said curative part comprises greater than 6.1 wt % core/shell rubber nanoparticles.3. The two-part adhesive according to wherein said epoxy part comprises less than 23.8 wt % core/shell rubber nanoparticles core/shell rubber nanoparticles.4. The two-part adhesive according to wherein claim 1 , upon mixing of the curative par and the epoxy part to form a mixed adhesive claim 1 , the mixed adhesive comprises greater than 11.1 wt % core/shell rubber nanoparticles.5. The two-part adhesive according to wherein the epoxy part additionally ...

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Номер записи: 71
31-01-2019 дата публикации

PRIMER COATING COMPOSITION AND METHOD FOR FORMING COATING FILM

Номер: US20190031887A1
Автор: Fujimoto Hiromi
Принадлежит: NIPPON PAINT AUTOMOTIVE COATINGS CO., LTD.

The present invention relates to a primer coating composition including an aqueous polyolefin-based resin (A), an aqueous epoxy resin (B), a hydrophilicized-modified carbodiimide compound (C), and an aqueous polyurethane resin (D), in which the aqueous polyolefin-based resin (A) includes an aqueous polypropylene-based resin having a weight-average molecular weight of 50,000 to 200,000, and the hydrophilicized-modified carbodiimide compound (C) is a hydrophilicized-modified carbodiimide compound (C) having a prescribed structure. 2. The primer coating composition according to claim 1 , wherein a content of the aqueous polyolefin-based resin (A) is 15 to 60 parts by mass based on 100 parts by mass of a resin solid content of the primer coating composition.3. The primer coating composition according to claim 1 , wherein a content of the hydrophilicized-modified carbodiimide compound (C) is 3 to 10 parts by mass based on 100 parts by mass of the resin solid content of the primer coating composition.5. The primer coating composition according to claim 4 , whereinin the hydrophilicized-modified carbodiimide compound (C) represented by the formula (III) above, one Y is (i) and another Y is (ii), anda ratio of the structure (i) to the structure (ii) is within a range of (i):(ii)=1:0.7 to 1:8.6. The primer coating composition according to claim 1 , whereinthe aqueous polyurethane resin (D) has a glass transition point (Tg) of −50° C. or less, anda cured film of the aqueous polyurethane resin (D) has an elongation at break of 400% or more at −20° C.7. The primer coating composition according to claim 1 , wherein a content of the aqueous polyurethane resin (D) is 15 parts by mass or more based on 100 parts by mass of the resin solid content of the primer coating composition.8. The primer coating composition according to claim 1 , wherein the content of the aqueous polyurethane resin (D) is 25 parts by mass or more and 45 parts by mass or less based on 100 parts by mass of the ...

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Номер записи: 72
11-02-2016 дата публикации

LIGHT-SHIELDING PAINT, LIGHT-SHIELDING PAINT SET, LIGHT-SHIELDING FILM, OPTICAL ELEMENT, METHOD FOR PRODUCING LIGHT-SHIELDING FILM, AND METHOD FOR PRODUCING OPTICAL ELEMENT

Номер: US20160040031A1
Автор: Kubota Reiko, Teramoto Yoji, Yamamoto Shuhei
Принадлежит:

A light-shielding paint includes an epoxy group-containing compound, an inorganic fine particle, a coloring agent, and an amine curing agent. The ratio (A′/A) of the mass (A′) of the amine curing agent to the active hydrogen equivalent (A) of the amine curing agent and the ratio (E′/E) of the mass (E′) of the epoxy group-containing compound to the epoxy equivalent (E) of the epoxy group-containing compound satisfy 0.1≦[(A′/A)/(E′/E)]≦0.45. 1. A light-shielding paint comprising:an epoxy group-containing compound;an inorganic fine particle;a coloring agent; andan amine curing agent, {'br': None, 'i': A′/A', 'E′/E, '0.1≦[()/()]≦0.45\u2003\u2003Formula (1).'}, 'wherein a ratio (A′/A) of a mass (A′) of the amine curing agent to an active hydrogen equivalent (A) of the amine curing agent and a ratio (E′/E) of a mass (E′) of the epoxy group-containing compound to an epoxy equivalent (E) of the epoxy group-containing compound satisfy formula (1) below'}2. The light-shielding paint according to claim 1 ,wherein the light-shielding paint comprising a curing catalyst.3. The light-shielding paint according to claim 2 ,wherein the curing catalyst is a tertiary amine or an imidazole compound.4. The light-shielding paint according to claim 1 ,wherein the inorganic fine particle has a refractive index of 2.2 or more and 3.5 or less.5. A light-shielding paint set for an optical element claim 1 , comprising:two or more units which comprise a unit comprising an epoxy group-containing compound and a unit comprising an amine curing agent,wherein the light-shielding paint set comprises an inorganic fine particle and a coloring agent in any of the units, and {'br': None, 'i': A′/A', 'E′/E, '0.1≦(()/())≦0.45\u2003\u2003Formula (1).'}, 'a ratio (A′/A) of a mass (A′) of the amine curing agent to an active hydrogen equivalent (A) of the amine curing agent and a ratio (E′/E) of a mass (E′) of the epoxy group-containing compound to an epoxy equivalent (E) of the epoxy group-containing compound ...

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Номер записи: 73
09-02-2017 дата публикации

BRANCHED SILOXANES AND METHODS FOR SYNTHESIS

Номер: US20170037065A1
Автор: Jacobsson MIchael B., OGAWA Tsuyoshi, Willson C. Grant
Принадлежит:

The present invention describes branched and functionalized siloxanes and methods for making such compounds. The compounds have a variety of uses. One preferred application is as novel planarizing material for lithogaphy, in which case functionalized branched siloxane, such as an epoxy-modified branched siloxane is particularly useful. 114-. (canceled)15. A method of reverse-tone step and flash imprint lithography comprising:a) providing a substrate;b) imprinting features upon said substrate;c) planarizing using a branched and functionalized siloxane to create a layer over the features;d) etching said layer with fluorine; and{'sub': '2', 'e) etching with O.'}16. A method of claim 15 , wherein said features in step b) are imprinted by a quartz template mold.18. A method of claim 15 , wherein said substrate in step a) is coated with an underlayer prior to step b).19. A method of claim 15 , wherein said layer created in step c) further includes a photoacid generator.23. A method of claim 22 , wherein said layer created in step e) further includes a photoacid generator. The present invention relates to branched siloxanes and methods for synthesis of branched siloxanes, including, but not limited to, functionalized branched siloxanes. Such compounds have many uses including multiple applications in the semiconductor industry including planarizing layers, patternable insulators, and the like.Liquid branched siloxanes having low viscosity, low vapor pressure and high silicon content are useful for the semiconductor industry such as the manufacturing of micro processors, flash memory, visual display devices and optical devices (light emitting diodes), etc. For example, Michael Lin et al. reported a UV curable liquid branched siloxane named Si-14 for the use in nano imprint lithography [1, 2]. They concluded that Si-14 functionalized with methacrylate as UV cross-linkable groups showed promising properties as planarizing layer on topology, patternable material and etch ...

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Номер записи: 74
12-02-2015 дата публикации

POLY(PHENYLENE ETHER)/EPOXY HOMOGENEOUS SOLID AND POWDER COATING COMPOSITION INCORPORATING SAME

Номер: US20150045477A1
Автор: Fisher Scott Michael, Peters Edward Norman
Принадлежит:

A homogeneous solid composition includes an aromatic epoxy resin and a poly(phenylene ether) having a number average molecular weight of 600 to 2000 atomic mass units and an average of 1.5 to 3 hydroxyl groups per molecule. The molecular weight and hydroxyl functionality of the poly(phenylene ether) allow it to be dissolved in the epoxy resin at relatively low temperature, and remain dissolved as the solution is cooled and solidified. The homogeneous solid composition facilitates incorporation of the poly(phenylene ether) into powder coating compositions that exhibit reduced water absorption in the cured state. 1. A solid composition comprising:an aromatic epoxy resin; anda poly(phenylene ether) having a number average molecular weight of 600 to 2000 atomic mass units and an average of 1.5 to 3 hydroxyl groups per molecule;wherein the solid composition comprises the aromatic epoxy resin and the poly(phenylene ether) in amounts effective to produce a single glass transition temperature in the range 40 to 92° C.; andwherein the solid composition exhibits no other glass transition temperature in the range −20 to 200° C.2. The solid composition of claim 1 , wherein the aromatic epoxy resin comprises a bisphenol A epoxy resin claim 1 , a bisphenol-F epoxy resin claim 1 , a phenol novolac epoxy resin claim 1 , a cresol-novolac epoxy resin claim 1 , a biphenyl epoxy resin claim 1 , a naphthalene epoxy resin claim 1 , a divinylbenzene dioxide claim 1 , 2-glycidylphenylglycidyl ether claim 1 , a dicyclopentadiene-substituted aromatic epoxy resin claim 1 , or a combination thereof.3. The solid composition of claim 1 , wherein the aromatic epoxy resin comprises a bisphenol A epoxy resin.6. The solid composition of claim 1 , excluding solvents.7. The solid composition of claim 1 , excluding curing agents for the aromatic epoxy resin.8. The solid composition of claim 1 , consisting of the aromatic epoxy resin and the poly(phenylene ether).10. A powder coating composition ...

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Номер записи: 75
16-02-2017 дата публикации

Coating Composition, Method for Making the Coating and Use Thereof

Номер: US20170044380A1
Автор: Bischoff Claus, Holberg Stefan
Принадлежит: Teknologisk Institut

A curable coating composition and the use, especially in heat exchangers, for heating and/or cooling water, in particular tap water, is described. The curable coating comprises, based on solids after curing, 35-80% by weight of an epoxysilane according to the general structure 1 and/or its hydrolysation and/or condensation products, 1: RRSiRwith R1 being 3-glycidyloxypropyl, Rbeing methyl, Rbeing alkyloxy or acyloxy, a being 0, 1 or 2 and b being 3−a and 20-65% by weight of a blocked polyisocyanate and optionally further components. The coating provides improved corrosion protection on aluminium surfaces, reduces limescale formation on heat exchanger surfaces and is able to withstand lateral and/or temporal temperature gradients when coated on heat exchanging surfaces. 17-. (canceled)8. A curable coating composition comprising , based on solids after curing , 35-80% by weight of an epoxysilane according to the general structure 1 and/or its hydrolysation and/or condensation products ,{'br': None, 'sup': 1', '2', '3, 'sub': a', 'b, 'RRSiR\u2003\u20031'}{'sup': 1', '2', '3, 'with Rbeing 3-glycidyloxypropyl, Rbeing methyl, Rbeing alkyloxy or acyloxy, a being 0, 1 or 2 and b being 3−a'}and 20-65% by weight of a blocked polyisocyanate and optionally further components wherein the coating further comprises, based on solids after curing, 0.1 to 4% by weight of an OH-functional silicone modified polyacrylate, said silicone used to modify the polyacrylate being polydimethylsiloxane, said OH-function leading to an OH-equivalent weight of said polyacrylate of 500-5000 g/mol.9. A curable coating composition according to claim 8 , said curable coating composition claim 8 , when cured to form a coating film claim 8 , provides a coating film that initially provides a receding water contact angle of at least 70°.10. A curable coating composition according to claim 8 , further comprising claim 8 , based on solids after curing claim 8 , 0.1 to 4% by weight of a metal complex ...

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Номер записи: 76
16-02-2017 дата публикации

AQUEOUS PRIMER COMPOSITION FOR ENHANCED FILM FORMATION AND METHOD OF USING THE SAME

Номер: US20170044381A1
Автор: KOHLI Dalip K., Shah Gaurang Kunal, Zhao Yiqiang
Принадлежит: Cytec Industries Inc.

A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or more curing agents, a silane compound, a low amount of propylene carbonate (PC), and optional additives. The bonding primer composition can form substantially smooth films by spraying, and at the same time, meet environmental regulations and provide high bonding performance. 117-. (canceled)18. A water-based primer composition that has a pH within the range of 6-8 and can be sprayed , the primer composition comprising:(i) 20-60 wt. % one or more epoxy resins;(ii) 2-30 parts curing agent, solely or in combination with one or more catalysts, per 100 parts of epoxy resin(s) in total;(iii) organosilane in an amount of 0.1 to 10 parts per 100 parts of water;(iv) 1-10 wt. % propylene carbonate;(v) 1-7 wt. % at least one chromate or non-chromate corrosion inhibitor; and(vi) water to provide 10%-25% solids.19. The water-based primer composition of further comprising 0.1-2 wt. % of an additive selected from: inorganic fillers in particulate form claim 18 , pigments claim 18 , dyes claim 18 , and combination thereof.21. The water-based primer composition of claim 18 , wherein the curing agent is water-soluble claim 18 , and without propylene carbonate claim 18 , the pH of the primer composition would be higher.22. The water-based primer composition of claim 18 , wherein the curing agent is selected from: amino triazine; polyamine; and dicyandiamide (DICY). In the manufacture of composite structures, particularly in the aerospace and automotive industries, it is conventional to bond a fabricated metallic structure to metallic or composite adherends utilizing structural adhesives or to laminate one or more prepreg plies of resin impregnated fibrous reinforcement to the fabricated metallic structure. Bonding typically requires curing the ...

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Номер записи: 77
06-02-2020 дата публикации

SEMICONDUCTOR PACKAGE WITH FILLER PARTICLES IN A MOLD COMPOUND

Номер: US20200043753A1
Автор: Gurrum Siva Prakash, Nangia Amit Sureshkumar, Seetharaman Janakiraman
Принадлежит:

A semiconductor package includes an integrated circuit formed on a semiconductor substrate. A stress buffer layer is provided on the integrated circuit. Further, a mold compound is provided on a surface of the stress buffer layer opposite the integrated circuit. The mold compound comprises a resin. The resin includes filler particles. The filler particles have multiple sizes with the largest of the particles having a size between 5 microns and 32 microns. 1. A semiconductor package , comprising:a semiconductor substrate; wherein the mold compound comprises a resin, and the resin includes filler particles; and', 'wherein a largest particle of the filler particles include a size between 5 microns and 32 microns., 'a mold compound in contact with the semiconductor substrate;'}2. The semiconductor package of claim 1 , further comprising an integrated circuit formed on the semiconductor substrate.3. The semiconductor package of claim 2 , further comprising a stress buffer layer on and directly in contact with the semiconductor substrate.4. The semiconductor package of claim 2 , wherein the mold compound is on a surface of the stress buffer layer opposite the integrated circuit.5. The semiconductor package of claim 1 , wherein the largest of the particles has a size between 10 microns and 25 microns.6. The semiconductor package of claim 1 , wherein the integrated circuit includes an analog-to-digital converter.7. The semiconductor package of claim 1 , wherein the mold compound is on portions of the semiconductor substrate.8. The semiconductor package of claim 1 , wherein the mold comprises at least one of polyimide or a silicone-based material.9. The semiconductor package of claim 3 , wherein the stress buffer layer has a thickness that is between 1 micrometer and 50 micrometers.10. The semiconductor package of claim 1 , wherein the size of the particles includes a largest distance between two opposite surfaces of each of the filler particle.11. The semiconductor package ...

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Номер записи: 78
03-03-2022 дата публикации

PREPARATION METHOD OF CARDANOL-MODIFIED POLYAMINE CURING AGENT WITH HIGH CORROSION RESISTANCE

Номер: US20220064368A1
Автор: Chen Jian, GU Qi, Li Xufeng, LV Yunxing, WANG Qiuwei
Принадлежит: Zhejiang Wansheng Co.,Ltd

The present invention discloses a preparation method of a cardanol-modified polyamine curing agent with high corrosion resistance. The method includes the following steps: subjecting cardanol, paraformaldehyde and an amine compound to Mannich reaction, after the Mannich reaction, adding a water-soluble initiator for polymerization reaction, then evaporating water and excessive amine compound under reduced pressure after the polymerization reaction, thus obtaining a cardanol-modified polyamine curing agent. The coating obtained by curing the curing agent with an epoxy resin has greatly improved chemical resistance and corrosion resistance, indicating that the use of the water-soluble initiator in this present invention enables olefins to be polymerized very well, and molecules are reinforced obviously after polymerization, thereby greatly improving the chemical resistance and corrosion resistance.

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Номер записи: 79
14-02-2019 дата публикации

LOW-EMISSION EPOXY RESIN COMPOSITION

Номер: US20190048127A1
Автор: BURCKHARDT Urs, KASEMI Edis, KRAMER Andreas, STADELMANN Ursula
Принадлежит: SIKA TECHNOLOGY AG

An epoxy resin composition, the curing components of which contain at least one amine of formula (I) and optionally at least one amine A which is, in particular, an adduct of a polyamine and an epoxide. The amine for formula (I) is used in particular in the form of a reaction product of the reductive alkylation of 1,2-ethylenediamine and an aldehyde or ketone. The epoxy resin composition is used in particular as a low-emission, room-temperature-curing epoxy-resin coating. It is characterised by good processibility, quick curing, high hardness, a nice surface and a low tendency to yellowing. 2. The epoxy resin composition as claimed in claim 1 , wherein R is a hydrogen radical or is methyl.3. The epoxy resin composition as claimed in claim 1 , wherein R is a hydrogen radical and n is 0.4. The epoxy resin composition as claimed in claim 1 , wherein R is a hydrogen radical claim 1 , n is 1 and X is methoxy or dimethylamino in para position.6. The epoxy resin composition as claimed in claim 5 , wherein 1 claim 5 ,2-ethylenediamine is used in a stoichiometric excess over the carbonyl groups of the aldehyde or ketone of the formula (II) claim 5 , and the excess is removed by distillation after the reduction.7. The epoxy resin composition as claimed in claim 1 , wherein the amine A is an adduct of at least one polyamine having 2 to 12 carbon atoms and at least one epoxide.8. The epoxy resin composition as claimed in claim 7 , wherein the epoxide is an aromatic monoepoxide claim 7 , the polyamine and the aromatic monoepoxide being reacted approximately in a molar ratio of 1/1.9. The epoxy resin composition as claimed in claim 7 , wherein the epoxide is an aromatic diepoxide claim 7 , the polyamine and the aromatic diepoxide being reacted approximately in a molar ratio of 2/1.10. The epoxy resin composition as claimed in claim 1 , wherein the hardener component contains 5 to 65 weight % of amine of the formula (I).11. A coating comprising an epoxy resin composition as ...

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Номер записи: 80
25-02-2016 дата публикации

Hardeners for cold-curing epoxy systems

Номер: US20160053046A1
Автор: Carmen Wiedmann, Ludwig Huelskaemper, Marcus PFARHERR, Markus Schroetz, Sabine Dobler
Принадлежит: Blue Cube IP LLC, Dow Global Technologies LLC

A hardener composition comprising: a) an isolated adduct comprising a reaction product of i) a polymer with a functionality of at least three, wherein said polymer contains at least one epoxy group; and ii) an amine wherein the isolated adduct is present as an aqueous solution; and b) a capping agent. This hardener can be used with a liquid epoxy resin to form a curable composition.

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Номер записи: 81
26-02-2015 дата публикации

RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC DEVICE USING THE SAME

Номер: US20150054180A1
Автор: Tanaka Yusuke, Ukawa Ken, Yoshida Kenji
Принадлежит:

The present invention provides a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which either the phenol resin curing agent or the epoxy resin has a biphenyl structure; a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which a glass transition temperature of a cured material is equal to or higher than 200° C., and a weight reduction rate of the cured material is equal to or lower than 0.3%; and an electronic device that includes an electronic component encapsulated with the resin composition. 2. The resin composition for encapsulation according to claim 1 ,wherein the phenol resin curing agent is a phenol resin curing agent represented by the Formula (1A), and a hydroxyl equivalent of the phenol resin curing agent is equal to or more than 90 g/eq and equal to or less than 190 g/eq.3. The resin composition for encapsulation according to claim 1 ,wherein the epoxy resin is an epoxy resin represented by the Formula (2A), and an epoxy equivalent of the epoxy resin is equal to or more than 160 g/eq and equal to or less than 290 g/eq.4. The resin composition for encapsulation according to claim 1 ,wherein the epoxy resin is an epoxy resin represented by the Formula (2A), and provided that a total number of glycidyl ether group contained in the epoxy resin is M, and a total number of hydroxyl group contained in the epoxy resin is N, a value of M/(M+N) is equal to or greater than 0.50 and equal to or less than 0.97.5. The resin composition for encapsulation according to claim 1 ,wherein the phenol resin curing agent is a phenol resin curing agent represented by the Formula (1A), and the epoxy resin is an epoxy resin represented by the Formula (2A).6. The resin composition for encapsulation according to claim 1 ,wherein provided that a content of the phenol resin curing agent in the resin composition is A1 (% by mass), and a ...

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Номер записи: 82
08-05-2014 дата публикации

HARDENER FOR EPOXY RESINS

Номер: US20140128506A1
Автор: KASEMI Edis, KRAMER Andreas
Принадлежит: SIKA TECHNOLOGY AG

The present invention concerns low-odor, low-viscosity hardeners for epoxy resins, including an amine with at least one amino group of formula (I) and an amine with at least one amino group of formula (II), wherein the amino groups of formulas (I) and (II) are present in a particular ratio. 2. Hardener according to claim 1 , wherein the ratio between the number of amino groups of formula (I) and the number of amino groups of formula (II) has a value of 0.08 to 0.7.3. Hardener according to claim 1 , wherein R and R′ independently of each other stand for a hydrogen atom or a methyl group.4. Hardener according to claim 1 , wherein X stands for a hydrocarbon residue with 1 to 12 C atoms claim 1 , which optionally has hydroxyl groups claim 1 , ether groups or amino groups.5. Hardener according to claim 4 , wherein the hydrocarbon residue stands for an optionally substituted aryl residue with 5 to 12 C atoms.9. Hardener according to claim 8 , wherein that A stands for a residue of an amine after removal of the primary amino groups claim 8 , wherein the amine is chosen from the group consisting of 1 claim 8 ,5-diamino-2-methylpentane claim 8 , 2-butyl-2-ethyl-1 claim 8 ,5-pentane diamine claim 8 , 1 claim 8 ,6-hexane diamine claim 8 , 2 claim 8 ,5-dimethyl-1 claim 8 ,6-hexane diamine claim 8 , 2 claim 8 ,2 claim 8 ,4- and 2 claim 8 ,4 claim 8 ,4-trimethylhexamethylene diamine claim 8 , 1 claim 8 ,12-dodecane diamine claim 8 , 1 claim 8 ,4-diaminocyclohexane claim 8 , bis-(4-aminocyclohexyl)methane claim 8 , bis-(4-amino-3-methylcyclohexyl)methane claim 8 , 1-amino-3-aminomethyl-3 claim 8 ,5 claim 8 ,5-trimethylcyclohexane claim 8 , 1 claim 8 ,3-bis-(aminomethyl)cyclohexane claim 8 , 2 claim 8 ,5(2 claim 8 ,6)-bis-(aminomethyl)-bicyclo[2.2.1]heptane claim 8 , 3(4) claim 8 ,8(9)-bis-(aminomethyl)-tricyclo[5.2.1.0]decane claim 8 , 1 claim 8 ,3-bis-(aminomethyl)benzene claim 8 , bis-hexamethylene triamine claim 8 , diethylene triamine claim 8 , triethylene-tetramine claim 8 , ...

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Номер записи: 83
08-05-2014 дата публикации

Thermosetting Compositions Containing Isocyanurate Rings

Номер: US20140128511A1
Автор: Hsu Chih-Pin, Zhao Ming Yang
Принадлежит: CCP COMPOSITES US LLC

The invention relates to thermosetting compositions containing isocyanurate ring(s) prepared through chain extension of an epoxy resin (a) with carboxyl-functional oligomers (b), which are the reaction product of polyols (i) containing one or more isocyanurate ring(s) and polycarboxylic acids or their anhydrides (ii). The polyols (i) containing one or more isocyanurate ring(s) can be prepared from the reactions of tris (2-hydroxyalkyl) isocyanurates with a modifier from a caprolactone or alkylene oxide, or glycidyl ester or glycidyl ether and mixtures thereof. The epoxy-functional thermosetting compositions containing an isocyanurate ring(s) can be further reacted with unsaturated acids, preferably (meth)acrylic acid, to obtain a curable polyacrylate. Both epoxy-functional isocyanurate and acrylate-functional isocyanurate thermosetting compositions can be further modified with a polyisocyanate to produce a composition that is useful as a reactive adhesive, binder or in other applications. 1. An epoxy-functional thermosetting composition containing isocyanurate ring(s) , comprising the reaction product of: (a) a polyepoxide containing at least two epoxide groups per molecule; and', (i) a polyol containing isocyanurate ring(s) comprising the reaction product of a tris (2-hydroxyalkyl) isocyanurate or derivative thereof with a modifier selected from the group consisting of caprolactones, alkylene oxides, glycidyl esters, glycidyl ethers, and mixtures therefor, and', '(ii) one or more polycarboxylic acids or acid anhydrides thereof;, '(b) a carboxyl functional oligomer comprising the reaction product of an equivalent quantity of, 'wherein the molar ratio of epoxy functional groups in component (a) to acid functional groups in component (b) is greater than 1.0; and, 'A. The reaction product ofB. A polyisocyanate.2. The composition according to claim 1 , wherein said polyisocyanate is from about 0.1 to 30% by weight of the total composition.3. The composition according to ...

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Номер записи: 84
22-02-2018 дата публикации

BLACK MOLECULAR ADSORBER COATING SYSTEM

Номер: US20180051177A1
Автор: Abraham Nithin S., Hasegawa Mark M., PETRO JOHN C., Straka Sharon A.
Принадлежит:

A black molecular adsorber coating (MAC-B) composition is provided that exhibits adsorptive capabilities and reduces the effects of optical path degradation and system performance degradation when formed into a black coating having low reflectivity. The coating can be used in stray light control applications or within light paths between optical systems to absorb light and reduce the effects of optical path degradation. The coating can be used in vacuum systems to adsorb molecular contaminants and to reduce vacuum pressure levels. The coating composition can be sprayed onto interior surfaces, such as optical cavities of cameras, telescopes, lasers, baffles, detectors systems, and electronics boxes to control performance degradation due to outgassed molecular contaminants. The sprayable black molecular adsorber coating composition eliminates the major drawbacks of previous puck style adsorbers, slurry coated systems, and other bulky adsorber systems, resulting in cost savings, mass savings, easier utilization, greater adsorber surface area, more flexibility, and higher efficiency. 1. A coating composition comprising a black zeolite pigment dispersed in a colloidal silica binder , the black zeolite pigment comprising a zeolite , a black inorganic colorant , and colloidal silica binder , and the colloidal silica binder comprising finely dispersed silica particles and water.2. The coating composition of claim 1 , wherein a mass ratio of the colloidal silica binder to the black zeolite pigment is in a range of from 0.5 to 2.5.3. The coating composition of claim 1 , wherein the black zeolite pigment has a mass ratio of colloidal silica binder to the dry mix of zeolite and black inorganic colorant of 0.5 to 3.0.4. The coating composition of claim 1 , wherein the black zeolite pigment is produced by processing and drying the zeolite claim 1 , a black inorganic colorant claim 1 , and colloidal silica binder mixture.5. The coating composition of claim 1 , wherein the amount ...

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Номер записи: 85
22-02-2018 дата публикации

METHOD FOR PREPARING CATIONIC ELECTRODEPOSITION COATING COMPOSITION

Номер: US20180051181A1
Автор: KOTANI Masayuki, MIYAMAE Nobuhiro, OHARA Tetsuya
Принадлежит: NIPPON PAINT AUTOMOTIVE COATINGS CO., LTD

The objective of the present invention is to provide a method for preparing a cationic electrodeposition coating composition that contains a bismuth compound and exhibits excellent coating material stability, curability, coating film appearance and the like. The present invention provides a method for preparing a cationic electrodeposition coating composition, which comprises a step for mixing a resin emulsion (i) and a pigment-dispersed paste, and wherein: the resin emulsion (i) contains an aminated resin (A) and a blocked isocyanate curing agent (B); the pigment-dispersed paste contains a bismuth mixture (C) that is obtained by mixing a bismuth compound (c1) and an organic acid (c2) in advance, a pigment-dispersed resin (D), an amine-modified epoxy resin emulsion (ii) that contains an amine-modified epoxy resin (E), and a pigment (F); the pigment-dispersed resin (D) has a hydroxyl number of 20-120 mgKOH/g; and the amine-modified epoxy resin (E) has a hydroxyl number of 150-650 mgKOH/g. 1. A method for preparing a cationic electrodeposition coating composition comprising a step of mixing a resin emulsion (i) and a pigment dispersion paste , whereinthe resin emulsion (i) comprises an aminated resin (A) and a blocked isocyanate curing agent (B),the pigment dispersion paste comprises a bismuth mixture (C) obtained by mixing a bismuth compound (c1) and an organic acid (c2) in advance; a pigment dispersion resin (D); an amine-modified epoxy resin emulsion (ii) comprising an amine-modified epoxy resin (E); and a pigment (F),the pigment dispersion resin (D) has a hydroxyl value of 20 to 120 mg KOH/g,the amine-modified epoxy resin (E) has a hydroxyl value of 150 to 650 mg KOH/g,the pigment dispersion paste is prepared according to any one of the following methods of:mixing the bismuth mixture (C) and the pigment dispersion resin (D), then the obtained mixture being mixed with the amine-modified epoxy resin emulsion (ii), and next, the pigment (F) being mixed in the ...

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Номер записи: 86
23-02-2017 дата публикации

Coating Method for Surfaces in Chemical Installations

Номер: US20170051176A1
Автор: Cameron Colin, Unthank Matthew George, Wright Anthony Colin
Принадлежит:

The invention pertains to a method for providing a metallic or concrete surface of a chemical installation with a coating, which comprises the steps of—providing a coating composition comprising epoxy-functional resin, and amine curing agent for the epoxy-functional resin, wherein the coating composition comprises an organic silicon-containing compound selected from the group of organosilanes and organosiloxanes, with the molar ratio between the silicon atoms of the organic silicon-containing compound and the epoxy-groups in the coating composition being in the range of 0.20-0.75:1.00, —applying the coating composition to a metallic or concrete surface of a chemical installation to form a coating layer, and—allowing the coating layer to cure at a temperature in the range of 0 to 50° C. The invention also pertains to a chemical installation comprising a metallic or concrete surface provided with a lining of a cured coating composition and to a coating composition suitable for providing a metallic or concrete surface of a chemical installation with a coating. It has been found that the coating composition of the present invention shows a wide application spectrum and a high chemical resistance. 1. A method for providing a metallic or concrete surface of a chemical installation with a coating , of the method comprisingproviding a coating composition comprising epoxy-functional resin and amine curing agent for the epoxy-functional resin, wherein the coating composition comprises an organic silicon-containing compound selected from the group of organosilanes and organosiloxanes, with the molar ratio between the silicon atoms of the organic silicon-containing compound and the epoxy-groups in the coating composition being in the range of 0.25-0.75:1.00,applying the coating composition to a metallic or concrete surface of a chemical installation to form a coating layer, andallowing the coating layer to cure at a temperature in the range of 0 to 50° C.2. The method according ...

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Номер записи: 87
01-03-2018 дата публикации

TWO-COMPONENT PAINT SYSTEM

Номер: US20180056260A1
Автор: BURSTEDT Malin, KARJUS Kristian, Silvander Mats, WIKSTRAND Carl Tommy
Принадлежит:

A two-component paint system () comprises a medium pressure canister () with a paint, at least one solvent and at least one propellant, and a high pressure canister () with a hardener, at least one solvent, at least one propellant and an inert gas or inert gas mixture. An adapter () is configured to transfer the content of the high pressure canister () into the content of the medium pressure canister (). The internal pressure of the high pressure canister () is at least 2 bars higher than the internal pressure of the medium pressure canister (). 127.-. (canceled)28. A two-component paint system comprising: a paint;', 'at least one solvent; and', 'at least one propellant at 20 to 50 weight % of the content of said medium pressure canister;, 'a medium pressure canister comprising a hardener;', 'at least one solvent;', 'at least one propellant at 30 to 70 weight % of the content of said high pressure canister; and', 'an inert gas or inert gas mixture; and, 'a high pressure canister comprisingan adapter configured to transfer said content of said high pressure canister into said content of said medium pressure canister, wherein said high pressure canister has an internal pressure that is at least 2 bars higher than an internal pressure of said medium pressure canister.29. The two-component paint system according to claim 28 , wherein said at least one solvent is selected from the group consisting of ketones claim 28 , acetates claim 28 , alcohols claim 28 , aromatic solvents claim 28 , ethers claim 28 , water claim 28 , aliphatic solvents and mixtures thereof.30. The two-component paint system according to claim 29 , wherein said at least one solvent is selected from the group consisting of 1-methoxy-2-propyl acetate claim 29 , xylene claim 29 , ethylbenzene claim 29 , n-butanol and mixtures thereof.31. The two-component paint system according to claim 30 , wherein said at least one solvent is selected from the group consisting of a mixture of 1-methoxy-2-propyl acetate ...

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Номер записи: 88
21-02-2019 дата публикации

REACTIVE EPOXY COMPOUNDS AND METHOD FOR PRODUCING THE SAME, CORE-SHELL TYPE EPOXY RESIN PARTICLES, WATERBORNE EPOXY RESIN COMPOSITION, AND COATING COMPOSITION CONTAINING THE REACTIVE EPOXY COMPOUNDS

Номер: US20190055397A1
Автор: HWANG Kuen-Yuan, LAI I-Chiang, LIN Ying-Jui, LIN Yung-Sheng, LIU Liang-Hsing, WONG Yi-Sern
Принадлежит:

This disclosure relates to reactive epoxy compounds that have high water solubility. The reactive epoxy compounds are obtained by mixing an epoxy resin having at least two epoxy groups per molecule with a carboxyl group-containing compound obtained by reacting a polyetheramine comprising a primary amine and an acid anhydride derived from a polyvalent carboxylic acid. This disclosure also relates to waterborne epoxy resin composition comprising core-shell type epoxy resin particles dispersed in a solvent, wherein the particles are formed by an epoxy resin encapsulated in the reactive epoxy compounds of the present invention. The waterborne epoxy resin composition is low in volatile organic compounds (“VOC”). 7. A core-shell type epoxy resin particle , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'an epoxy resin encapsulated in the reactive epoxy compound according to .'}8. A waterborne epoxy resin composition , comprising:{'claim-ref': {'@idref': 'CLM-00007', 'claim 7'}, 'the core-shell type epoxy resin particles according to dispersed in a solvent.'}9. The waterborne epoxy resin composition of claim 8 , wherein the core-shell type epoxy resin particles have a distribution of particle size such that Dof the particle size is less than about 0.7 μm.10. The waterborne epoxy resin composition of claim 8 , wherein the reactive epoxy compound is of the structure of formula (S1) according to .11. The waterborne epoxy resin composition of claim 8 , wherein the reactive epoxy compound is of the structure of formula (S2) according to .12. The waterborne epoxy resin composition of claim 8 , wherein the reactive epoxy compound is of the structure of formula (S3) according to .13. The waterborne epoxy resin composition of claim 8 , wherein the reactive epoxy compound is of the structure of formula (S4) according to .14. The waterborne epoxy resin composition of claim 8 , wherein the reactive epoxy compound is of the structure of formula (S5) according to .15. A ...

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Номер записи: 89
01-03-2018 дата публикации

ANTI-CORROSION NANOCOMPOSITE COATING

Номер: US20180057696A1
Автор: Pourhashem Sepideh, Rashidi Ali Morad, Vaezi Jezeh Mohammad Reza
Принадлежит:

An anti-corrosion coating and a method for fabricating the anti-corrosion coating is disclosed. The coating includes a polymer, a curing agent, and quantum dots. The method includes adding carbon quantum dots to a polymer coating as a nanofiller to enhance the corrosion resistance properties of the polymer coating. The coating is configured to provide improved anti-corrosion properties at a lower cost. 1. A method of fabricating an anti-corrosion coating , the method comprising:synthesizing quantum dots; andadding the synthesized quantum dots to a polymer.2. The method according to claim 1 , further comprising functionalizing the quantum dots.3. The method according to claim 1 , wherein the quantum dots are selected from the group consisting of carbon quantum dots claim 1 , graphene quantum dots claim 1 , polymer quantum dots and combinations thereof.4. The method according to claim 1 , wherein the polymer is selected from the group consisting of vinyl polymers claim 1 , condensation polymers claim 1 , chain-growth polymers claim 1 , step-growth polymers claim 1 , polyacrylamides claim 1 , polyacrylates claim 1 , polystyrene claim 1 , polybutadiene claim 1 , polyacrylonitrile claim 1 , polysaccharides claim 1 , polyacrylic acid claim 1 , polyesters claim 1 , polyamides claim 1 , polyurethanes claim 1 , polyimides claim 1 , nylons claim 1 , polyvinyl alcohol claim 1 , polyethylene oxide claim 1 , polypropylene oxides claim 1 , polyethylene glycol claim 1 , poly(ethylene terephthalate) claim 1 , poly(methyl methacrylate) claim 1 , epoxies claim 1 , acrylics claim 1 , silicones and combinations thereof.5. The method according to claim 2 , wherein functionalizing the quantum dots includes:dissolving the quantum dots in deionized water to obtain a first solution;adding the first solution to a solution containing a functionalizing agent to obtain a second solution;refluxing the second solution to obtain a refluxed solution; anddrying the refluxed solution to obtain ...

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Номер записи: 90
02-03-2017 дата публикации

Coatings with Molecular Flexibility for Ice Adhesion Mitigation

Номер: US20170058168A1
Автор: JR. Christopher J., JR. Joseph G., Smith, Wohl
Принадлежит:

Embodiments provide ice adhesion mitigating surface coatings and methods for generating the same. Embodiments may provide anti-icing coating with at least one monomeric species exhibiting molecular flexibility. The molecular flexibility in the monomeric species may be imparted through an aliphatic or heteroaliphatic chain that may exist as a portion of the monomer backbone, as a pendant group, or as both the portion of the monomer backbone and the pendant group. In various embodiments epoxy coatings including an epoxy resin and an amine-terminated hardener may be generated. At least a portion of the amine-terminated hardener may include at least a monomeric species that exhibits molecular flexibility arising from an aliphatic chain or heteroaliphatic chain that may be within the polymer backbone and/or may persist as a pendant group. 1. An anti-icing coating , comprising:at least one monomeric species exhibiting molecular flexibility.2. The anti-icing coating of claim 1 , wherein the molecular flexibility is imparted by an aliphatic chain or a heteroaliphatic chain of the monomeric species that exists as a portion of a monomer backbone claim 1 , as a pendant group claim 1 , or as both the portion of the monomer backbone and the pendant group.3. The anti-icing coating of claim 1 , further comprising:an epoxy resin, andan amine-terminated hardener including the monomeric species.4. The anti-icing coating of claim 3 , wherein the amine-terminated hardener comprises two di-substituted benzene rings connected by the aliphatic chain or the heteroaliphatic chain and the aliphatic chain or the heteroaliphatic chain is 1 to 25 atoms long.5. The anti-icing coating of claim 4 , wherein the aliphatic chain or the heteroaliphatic chain is 2 to 20 atoms long.6. The anti-icing coating of claim 5 , wherein the aliphatic chain or the heteroaliphatic chain is 4 to 12 atoms long.8. The anti-icing coating of claim 7 , wherein Y is H.12. The anti-icing coating of claim 11 , wherein R is ...

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Номер записи: 91
17-03-2022 дата публикации

Barrier System

Номер: US20220079137A1
Автор: Gonzales Aaron, Gonzales Tony
Принадлежит: 95 Applications, L.L.C.

A barrier system includes a substantially vertical structure with a coating layer disposed on and circumscribing a majority of the substantially vertical structure. The coating layer has a height of at least 0.25 inches, has a dried film thickness of at least 5 mils, and has an average surface roughness (R) of less than 10 microns. 1. A barrier system comprising:a substantially vertical structure; anda coating layer disposed over and circumscribing a majority of said substantially vertical structure;{'sub': 'a', 'wherein said coating layer has a height of at least 0.25 inches, has a dried film thickness of at least 5 mils, and has an average surface roughness (R) of less than 10 microns.'}2. The barrier system of wherein said substantially vertical structure is an exterior surface of a home.3. The barrier system of wherein said substantially vertical structure is a leg of a crib.4. The barrier system of wherein a pesticide is applied on said coating layer claim 1 , below said coating layer claim 1 , or both.5. The barrier system of wherein said pesticide includes a polymeric component that encapsulates an active ingredient in said pesticide.6. The barrier system of wherein said coating layer comprises an acrylic polymer.7. The barrier system of wherein said coating layer comprises a copolymer of styrene and 2-ethylhexylacrylate.8. The barrier system of claim 1 , wherein said coating layer is formed from a liquid coating having a solid content of at least 40 wt. % claim 1 , based on the total weight of said liquid coating and said liquid coating has a total wet film thickness of at least 10 microns.9. The barrier system of wherein the average surface roughness of said coating layer is configured to prevent pests from reaching an upper portion of said substantially vertical structure that is located above said coating layer.10. The barrier system of wherein said pests are scorpions claim 9 , cockroaches claim 9 , or both.11. The barrier system of wherein said coating ...

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Номер записи: 92
27-02-2020 дата публикации

Reinforced Powder Paint for Composites

Номер: US20200062970A1
Автор: McPherson Mathew A.
Принадлежит: MCP IP, LLC

A fiber reinforced powder paint provides improved flexural fatigue resistance for composites substrates. Fiber loading in the powder is greater than 40%. Aramid fiber loading in an epoxy based powder paint is exemplified. A composite bow limb coated with the powder paint survives a remarkably greater number of bending cycles before failure when coated with the powder paint. 1. A method comprising:providing an article;applying a powder coating mixture to a surface of the article, the powder coating mixture comprising powder paint and reinforcing fibers; andcuring the powder paint.2. The method of claim 1 , the article comprising a thermoset composite material.3. The method of claim 1 , comprising machining the article prior to applying the powder coating mixture.4. The method of claim 3 , wherein the machining exposes ends of reinforcement fiber embedded in the article.5. The method of claim 1 , comprising mixing powder paint and reinforcing fibers to form the powder coating mixture.6. The method of claim 1 , wherein the reinforcing fibers comprise at least 40% of the powder coating mixture.7. The method of claim 1 , wherein the reinforcing fibers comprise at least 60% of the powder coating mixture.8. The method of claim 1 , the powder paint comprising epoxy resin.9. The method of claim 1 , the reinforcing fibers comprising polymer fibers claim 1 , carbon fibers or glass fibers.10. The method of claim 1 , the reinforcing fibers comprising aramid fibers.11. The method of claim 1 , the reinforcing fibers having a maximum dimension 100 μm.12. The method of claim 11 , the reinforcing fibers having a minor dimension of 50 nm or less.13. The method of claim 1 , the powder paint comprising epoxy resin and the reinforcing fibers comprising polymer.14. The method of claim 1 , wherein said curing comprises applying heat.15. A method comprising:providing a thermoset composite article comprising reinforcement fiber;machining a surface of the article to expose ends of the ...

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Номер записи: 93
29-05-2014 дата публикации

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND PRINTED CIRCUIT BOARD

Номер: US20140147639A1
Автор: Lee Hyun Jun, Lee Keun Yong, Moon Jin Seok, Yoo Seong Hyun
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Disclosed herein are a resin composition of a printed circuit board including a liquid crystal oligomer, an epoxy resin, and a phenolic curing agent having five or more functional groups, an insulating film and a prepreg manufactured using the resin composition, and a printed circuit board including the insulating film or the prepreg. The resin composition for a printed circuit board according to the present invention, and the insulating film and the prepreg manufactured using the same, may have low coefficient of thermal expansion, excellent heat resistance property, and a high glass transition temperature. 2. The resin composition as set forth in claim 1 , further comprising an inorganic filler.4. The resin composition as set forth in claim 1 , wherein it contains 39 to 60 weight % of the liquid crystal oligomer claim 1 , 39 to 60 weight % of the epoxy resin claim 1 , and 0.1 to 1 weight % of the phenolic curing agent having five or more functional groups.5. The resin composition as set forth in claim 2 , wherein it contains 9 to 30 weight % of the liquid crystal oligomer claim 2 , 9 to 30 weight % of the epoxy resin claim 2 , 0.01 to 0.5 weight % of the phenolic curing agent having five or more functional groups claim 2 , and 50 to 80 weight % of the inorganic filler.6. The resin composition as set forth in claim 1 , wherein the liquid crystal oligomer has a number average molecular weight of 2 claim 1 ,500 to 6 claim 1 ,500.7. The resin composition as set forth in claim 1 , wherein the epoxy resin is at least one selected from a naphthalene type epoxy resin claim 1 , a bisphenol A type epoxy resin claim 1 , a phenol novolac epoxy resin claim 1 , a cresol novolac epoxy resin claim 1 , a rubber modified epoxy resin claim 1 , and a phosphorous type epoxy resin.8. The resin composition as set forth in claim 1 , wherein the epoxy resin has four or more epoxy functional groups.9. The resin composition as set forth in claim 2 , wherein the inorganic filler is at least ...

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Номер записи: 94
24-03-2022 дата публикации

HIGH-PURITY 3,4-EPOXYCYCLOHEXYLMETHYL METHACRYLATE

Номер: US20220089808A1
Автор: NAKAI Yoshito, Suzuki Hirose
Принадлежит: Daicel Corporation

To provide 3,4-epoxycyclohexylmethyl methacrylate that is highly pure and that is useful as a raw material for functional materials or optical members having excellent transparency and heat resistance. An alicyclic epoxy compound product having a purity of 3,4-epoxycyclohexylmethyl methacrylate of 98.0 wt. % or greater and a total content of a compound represented by Formula (a) below and a compound represented by Formula (b) below of 1.3 wt. % or less. This alicyclic epoxy compound product preferably has a Hazen color number of 25 or less. 4. The alicyclic epoxy compound product according to claim 1 , wherein a Hazen color number is 25 or less.5. A curable composition containing the alicyclic epoxy compound product according to .6. The curable composition according to claim 5 , further comprising a curing agent and a curing accelerator.7. The curable composition according to claim 5 , further comprising a curing catalyst.8. A cured product of the curable composition according to .9. An encapsulant comprising the curable composition according to .10. An adhesive agent comprising the curable composition according to .11. A coating agent comprising the curable composition according to .12. An optical member comprising a member formed from the cured product according to . The present invention relates to a high-purity 3,4-epoxycyclohexylmethyl methacrylate, a curable composition containing the same, and a cured product thereof, an encapsulant, an adhesive agent, a coating agent, and an optical member. The present application claims priority to JP 2018-247154 filed in Japan on Dec. 28, 2018, the content of which is incorporated herein.3,4-Epoxycyclohexylmethyl methacrylate is a compound having two different types of curable groups, which are a cationically polymerizable epoxy group and a radically polymerizable methacryloyl group and can produce a cured product having various physical properties and characteristics by curing. The cured product obtained as described ...

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Номер записи: 95
16-03-2017 дата публикации

COATING SYSTEM FOR FIBER CEMENT ARTICLES

Номер: US20170073543A1
Автор: Gonzalez Luisa, Joecken John Andrew, Luo Caidian
Принадлежит:

A coating system which provides a stain finish on a fiber cement building article. The coating system comprising a sealing agent, a basecoat and a topcoat, wherein the coating system is disposed on at least one surface of the fiber cement building article whereby the sealing agent is disposed adjacent to the at least one surface of the fiber cement building article, the basecoat is disposed on the sealing agent remote from the surface of the fiber cement building article and the topcoat is disposed on the basecoat remote from the fiber cement building article. 1. A coating system for a fiber cement composite article comprising a textured surface having a depth of relief , the coating system comprising:a sealing agent selected for application to the textured surface of the fiber cement composite article, said sealing agent having a dry film thickness (DFT) of about 0.05 to 2 mils (1.27 μm to 50.8 μm);a basecoat disposed on at least a portion of the sealing agent, said basecoat having a DFT of 0.5 to 5 mils (12.7 μm to 127 μm);a topcoat disposed on at least a portion of the basecoat, said topcoat having a DFT of 0.05 to 2 mils (1.27 μm to 50.8 μm);wherein the difference between the lightness value (DL) between the topcoat and the basecoat is negative;wherein the textured surface has a depth of relief of about 5 to 50 mils (127 μm to 1.3 mm); andwherein the ratio of the of sealing agent DFT to depth of relief is about 0.5:1 to about 5:1.2. The coating system of claim 1 , wherein the sealing agent comprises at least one resin selected for film formation.3. The coating system of claim 1 , wherein the sealing agent comprises an epoxy silane resin.4. The coating system of claim 1 , wherein the difference in lightness value (DL) between the topcoat and the basecoat is approximately −25 to −35.5. The coating system of claim 1 , wherein the difference in the red/green value (Da) between the topcoat and the basecoat is approximately 0.01 to 1.6. The coating system of claim 1 , ...

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Номер записи: 96
19-03-2015 дата публикации

WATERBORNE DISPERSIONS

Номер: US20150079402A1
Автор: Drumright Ray E., Guo Yinzhong, Sekharan Manesh Nadupparambil, Tang Houxiang
Принадлежит:

A waterborne dispersion containing a high molecular weight cycloaliphatic epoxy resin based on a diglycidyl ether of a cycloaliphatic diol polymerized with, for example, a diphenolic or diacid compound. 1. A waterborne dispersion composition comprising (a) a high molecular weight cycloaliphatic epoxy resin dispersed in (b) a liquid aqueous vehicle.2. The dispersion of claim 1 , wherein the cycloaliphatic epoxy resin is prepared from a cycloaliphatic diglycidyl ether having an oligomer content in the range of from 0.01 wt % to 20 wt %; and/or a monoglycidyl ether content of from 0.01 wt % to 10 wt %.3. The dispersion of claim 1 , comprising an acrylic polymer or a polymerized product prepared from at least one acrylic monomer.4. The dispersion of claim 3 , wherein the acrylic polymer comprises an acrylate and a methacrylate monomer.5. The dispersion of claim 4 , wherein the acrylate and methacrylate monomers comprise methyl acrylate claim 4 , ethyl acrylate claim 4 , butyl acrylate claim 4 , 2-ethylhexyl acrylate claim 4 , decyl acrylate claim 4 , methyl methacrylate claim 4 , ethyl methacrylate claim 4 , butyl methacrylate claim 4 , acrylic acid claim 4 , methacrylic acid claim 4 , itaconic acid claim 4 , maleic acid claim 4 , fumaric acid claim 4 , styrene claim 4 , substituted styrene claim 4 , acrylonitrile claim 4 , vinyl acetate claim 4 , other alkyl acrylates having from one to twelve carbon alkyl groups.6. The dispersion of claim 1 , including a dispersant; wherein the dispersant comprising an ionic claim 1 , a nonionic or an anionic compound.7. The dispersion of claim 1 , wherein the particle size of the solids is in the range of from 100 nanometers to 2000 nanometers.8. The dispersion of claim 1 , wherein the cycloaliphatic epoxy resin is modified with acid groups; or wherein the cycloaliphatic epoxy resin is modified with an anhydride.9. The dispersion of claim 1 , wherein the cycloaliphatic epoxy resin comprises a diglycidyl ether of cyclohexanedimethanol ...

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Номер записи: 97
18-03-2021 дата публикации

CORROSION PROTECTION FOR METALLIC SUBSTRATES COMPRISING ONE OR MORE 2D MATERIAL PLATELETS

Номер: US20210079231A1
Автор: Chikosha Lynn, Johnson Gaven, SHARP Matthew David, Weaver William
Принадлежит:

A composition comprising a carrier medium, a first corrosion inhibitor, and a second corrosion inhibitor having a barrier mechanism. The first corrosion inhibitor comprises at least one of an ion exchanged pigment, a silica, a calcium exchanged silica, an oxyaminophosphate salt of magnesium, and/or a mixture of an organic amine, a phosphoric acid and/or an inorganic phosphate and a metal oxide and/or a metal hydroxide, and the second corrosion inhibitor comprises one or more 2D material platelets in which the 2D material platelets comprise: nanoplates of one or more 2D materials and or nanoplates of one or more layered 2D materials and or graphite flakes in which the graphite flakes have one nanoscale dimension and 35 or less layers of atoms. 1. A composition comprising a carrier medium , a first corrosion inhibitor having a passivation mechanism , and a second corrosion inhibitor having a barrier mechanism in which the first corrosion inhibitor comprises at least one of an ion exchanged pigment , a silica , a calcium exchanged silica , an oxyaminophosphate salt of magnesium , and/or a mixture of an organic amine , a phosphoric acid and/or an inorganic phosphate and a metal oxide and/or a metal hydroxide , and the second corrosion inhibitor comprises one or more 2D material platelets in which the 2D material platelets comprise; nanoplates of one or more 2D materials and or nanoplates of one or more layered 2D materials and or graphite flakes in which the graphite flakes have one nanoscale dimension and 35 or less layers of atoms , wherein the second corrosion inhibitor has a D50 particle size of less than 45 μm , less than 30 μm , or less than 15 μm.2. A composition according to in which the 2D materials are one or more of graphene (C) claim 1 , hexagonal boron nitride (hBN) claim 1 , molybdenum disulphide (MoS2) claim 1 , tungsten diselenide (WSe2) claim 1 , silicene (Si) claim 1 , germanene (Ge) claim 1 , Graphyne (C) claim 1 , borophene (B) claim 1 , phosphorene ...

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Номер записи: 98
22-03-2018 дата публикации

EPOXY RESIN POWDER COATING MATERIAL

Номер: US20180079911A1
Автор: Toyoda Masaaki
Принадлежит:

An epoxy resin powder coating material is provided, by which, while workability and coating property are not deteriorated, a coating film having excellent heat cycle resistance can be formed also on recent metal parts having a configuration of intricately combining a plurality of different kinds of metals of different material qualities and required to have high-standard performance. The epoxy resin powder coating material is manufactured by blending a spherical inorganic particle and acryl-based core shell type particle having an average particle diameter of 16 to 50 μm in a bisphenol A-type epoxy resin, wherein an average particle diameter of the acryl-based core shell type particle is preferably 0.1 to 0.4 μm. 1. An epoxy resin powder coating material , comprising (A) bisphenol A-type epoxy resin , (B) spherical inorganic particle having an average particle diameter of 16 to 50 μm , and (C) acryl-based core shell type particle as essential components.2. The epoxy resin powder coating material according to claim 1 , wherein an average particle diameter of the (C) is 0.1 to 0.4 μm.3. The epoxy resin powder coating material according to claim 2 , wherein a ratio of an average particle diameter of the (C) to an average particle diameter of the (B) (acryl-based core shell type particle/spherical inorganic particle) is 0.002 to 0.025.4. The epoxy resin powder coating material according to claim 1 , wherein the (C) includes an acryl-based core shell type rubber particle.5. The epoxy resin powder coating material according to claim 4 , wherein the (C) includes a glycidyl-containing acryl-based core shell type rubber particle at its outermost layer.6. The epoxy resin powder coating material according to claim 1 , wherein a blending amount of the (B) is 180 to 250 parts by weight with respect to 100 parts by weight of component (A).7. The epoxy resin powder coating material according to claim 1 , wherein a blending amount of the (C) is 3 to 25 parts by weight with respect ...

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Номер записи: 99
26-03-2015 дата публикации

Low Application Temperature Powder Coating

Номер: US20150086711A1
Автор: Sandy ZHANG, Wilson Xu
Принадлежит: Valspar Sourcing Inc

Powder coating compositions that include an epoxy resin composition and a curing agent are described. The powder coating compositions can be applied at low application temperatures of about 165° C. to 185° C. The coating compositions can be used to form fusion-bonded single layer and dual-layer epoxy pipe coatings, and demonstrate optimal corrosion resistance and flexibility with reduced cathodic disbondment.

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Номер записи: 100