PROCEDURE FOR INTERLACING SAEUREANHYDRIDGRUPPEN ABSTENTION ETHYLEN POLYMERS, INTERLACE-CASH COMPOSITIONS AND THE APPLICATION OF THESE COMPOSITIONS FOR PAINTING.

In the warmth into india rubber reading tables of plastic products convertible molding material

IMIDYL-BENZENEDICARBOXYLIC ACID DERIVATIVES

THERMOSETTING COMPOSITIONS CONTAINING A PREPOLYMER WITH AN IMIDE GROUP, AND AN EPOXY RESIN

La présente invention a pour objet des compositions thermodurcissables stables au stockage. Elles comprennent un prépolymère à groupement imides obtenu par réaction d'un polyimide d'acide carboxylique insaturé avec le N-vinylpyrro-lidone-2 et éventuellement un polyester insaturé et une résine époxy. Ces compositions entrent dans la fabrication d'objets moulés et articles composites.

THERMOSETTING COMPOSITIONS CONTAINING A PREPOLYMER WITH AN IMIDE GROUP, AND AN EPOXY RESIN

Verfahren zum Härten von Epoxydharzen

Elastomeric polyadducts are prepared by reacting with heating, polyester-polyamide-dicarboxylic acids of the formula:- HO-(CO-R'-NH)a-CO-A-CO-(NH-R1-CO)b-OH whe

Elastomeric polyadducts are prepared by reacting with heating, polyester-polyamide-dicarboxylic acids of the formula:- HO-(CO-R'-NH)a-CO-A-CO-(NH-R1-CO)b-OH where R1 is an (un)branched alkylene residue with 2-11 carbon atoms in the linear chain, preferably the pentamethylene residue, and a and b are O or an integer and a+b-1-8, and A is an (un)branched hydrocarbon residue interrupted by is not 2 ester groups, -O-C=O, with diepoxy compounds; 0.6-1.2, preferably 0.8-1.0 equivalents of COOH groups are used per equivalent of epoxy groups. In the polyester residue A, the number of carbon atoms in hydrocarbon residues, divided by the number of oxygen bridges is 3-32, and the total number of, carbon atoms in hydrocarbon residues in A is is not 10.

PROCEDE DE PREPARATION DE NOUVEAUX OLIGOMERES A GROUPEMENTS IMIDE.

Machine pour le galbage et la finition des pneumatiques

Härtbare Epoxydharzmassen

Härtbare, füllstoffhaltige Epoxydharzmischungen

Verfahren zum Härten von bei gewöhnlicher Temperatur flüssigen Polyglycidyläthern

Verfahren zur Herstellung von wasserverdünnbaren, vinylmodifizierten Kunstharzen auf der Grundlage von Polyäthern

Procédé de préparation d'une composition thermodurcissable à base d'une résine époxy

Verfahren zur Herstellung stabiler Zubereitungen von in Wasser unlöslichen oder dispergierbaren Umsetzungsprodukten aus Epoxyden, polymeren Fettsäuren und basischen Polyamiden

HARDENABLE MIXTURES ON BASIS OF EPOXY CONNECTIONS.

PROCEDURE FOR THE PRODUCTION OF NEW IMIDYL BENZOLDICARBONSAEUREN, THEIR ESTERS OR SALTS AND USE THAT IMIDYL BENZOLDICARBONSAEUREN OR THEIR SALTS FOR PRODUCTION THE SAEURECHLORIDE.

PROCEDURE FOR the PRODUCTION OF IMIDYL BENZOLDICARBONSAEUREN, - TRI CARBONIC ACIDS, ESTERS, SALTS OR ANHYDRIDES OF it OR OF 5-IMIDYL-TRIMELLITHSAEUREANHYDRID-CHLORIDEN.

STABILISED LIQUID DICARBOXYLIC ACID ANHYDRIDE MIXTURES

SETTING MIXTURES CONTAINING RESINS EPOXYDIQUES

Improvements in or relating to machines for shaping pneumatic tyre carcasses

IMIDYL-BENSENDIKARBONSYRA-DERIVAT

Composition of epoxy and anhydride components, antioxidant and phosphor material

A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.

EPOXY RESIN COMPOSITION FOR FLOW CASTING

PROBLEM TO BE SOLVED: To obtain the subject composition capable of providing a resin board having a good accuracy of thickness, and a transparent resin board for a liquid crystal display element in good efficiency by a flow casting method by including an epoxy resin and a specific acid anhydride-based hardening agent. SOLUTION: This epoxy resin composition comprises (A) an epoxy resin preferably containing 25-70 wt.% epoxy resin solid at normal temperature, [e.g. an alicyclic epoxy resin of formula I [B is formula II; (a)+b+c=15], and (B) an acid anhydride-based hardening agent containing 0.5-10 mol% carboxylic acid such as methylhexahydrophthalic acid, preferably in an amount regulated so that the acid anhydride group of the component B may be 0.7-1.2 eq. based on 1 eq. epoxy group of the component A. For example, a compound obtained by partially esterifying 4-methylhexahydrophthalic anhydride with a cyclic alcohol of formula III can be used as the component B. A resin board obtained from ...

OKISAZORIDON ISOSHIANUREETOFUOOMUNO SEIZOHO

КОМПОЗИЦИЯ ДЛЯ ЗАЩИТНОГО ПОКРЫТИЯ

... 1. Композиция для защитного покрытия, включающая полимерное связующее, модификатор, отвердитель - кремнийорганический амин, по меньшей мере один пигмент, по меньшей мере один минеральный наполнитель и по меньшей мере один органический растворитель, отличающаяся тем, что в качестве полимерного связующего содержит диановый эпоксидный олигомер, в качестве модификатора - акриловый сополимер, в качестве пигмента - вещество, являющееся ингибитором коррозии, при следующем соотношении компонентов, мас. ч.:Полимерное связующее - 90-110Модификатор - 10-50Отвердитель - 30,0-80Пигмент - 35-100Минеральный наполнитель - 50-120Органический растворитель 150-600.2. Композиция по п. 1, отличающаяся тем, что в качестве пигмента она содержит по меньшей мере одно вещество, выбранное из группы, содержащей хромат стронция, хромат бария, фосфат хрома, фосфат алюминия, фосфат кальция или их смеси.3. Композиция по п. 1, отличающаяся тем, что в качестве минерального наполнителя она содержит по меньшей мере одно вещество ...

LEUCHTSTOFFHALTIGE EPOXY MOLDING MATERIALS AND PROCEDURES FOR THEIR PRODUCTION

Procedure for hardening liquid Polyglycidyläthern

Use of stable preparations of conversion products of Epoxyden, polymere fatty acids and basic PP, for the felt fastening of wool

PROCEDURE FOR THE PRODUCTION OF NEW IMIDYL BENZENE DICARBONIC ACID DERIVATIVES

OLIGOMERS POSSESSING IMIDE GROUPS

Ethanol-resistant gasoline coating composition and application method thereof on oil-adding pump

THERMOHARDENING COMPOSITIONS CONTAINING PREPOLYMERE HAS GROUPING IMIDE AND OF EPOXY RESIN

HEAT RESISTIVE RESIN COMPOSITION COMPRISING AN EPOXY, ORGANIC ACID ANHYDRIDE, AND MALEIMIDE

CURABLE COMPOSITIONS OF MATTER

THERMOHARDENING COMPOSITIONS CONTAINING PREPOLYMERE HAS GROUPING IMIDE AND OF EPOXY RESIN

ACIDS IMIDYL-BENZENE-DIET - TRI-CARBOXYLIQUES AND THEIR DERIVATIVES, USABLE INTER ALIA LIKE RESIN EPOXYDIQUES HARDENERS

Resin composition for forming hard coat layer

Epoxy resin composition for casting and resin plate comprising the same for use in a liquid crystal display

An epoxy resin composition having a viscosity of from 50 to 400 P at 25 DEG C is disclosed. The composition provides by casting a resin plate, particularly a transparent resin plate for a liquid crystal display, which has satisfactory thickness precision.

COMPOSITION COMPRISING AN EPOXY RESIN, ACID ANHYDRIDE AND A N,N'-BIS-IMIDE

Procedure for the production of new Poly (phenylmethylenen)

RESIN COMPOSITION AND PROCEDURE FOR THE PRODUCTION AND PROCESSING OF THIS RESIN COMPOSITION.

REACTIVE HARDENABLE ONES BONDING AGENT MIXTURE, PROCEDURE FOR THE PRODUCTION OF HARDENED PRODUCTS AND USE OF THE MIXTURE FOR THE PRODUCTION OF COATINGS.

VERFAHREN ZUR HERSTELLUNG VON NEUEN IMIDYL BENZOLDICARBONSAEURE-DERIVATEN

ANHYDRIDE-BASED FORTIFIERS FOR ANHYDRIDE-CURED EPOXY RESINS

EPOXIDE ADDUCTS AND THEIR SALTS AS DISPERSANTS

The invention relates to addition compounds suitable for use as wetting agents and dispersants and obtainable by reacting monofunctional or polyfunctional aromatic epoxides with polyoxyalkylenemonoamines having a number-average molecular weight of > 400 g/mol, one primary or secondary amino group and at least 4 ether oxygens per molecule, from 90 to 100% of the epoxide groups of the starting material having undergone reaction, the weight fraction of aromatic groups in the addition compounds being not more than 50% and the addition compounds containing per molecule at least one amino group on which salts can be formed, or being present as a salt. The invention also relates to a process for preparing the addition compounds, to their use as wetting agents and/or dispersants and to pigments or fillers coated with the addition compounds and to pigment pastes which comprise pigments, binders and the addition compounds of the invention.

PROCESS FOR PREPARING AND PROCESSING A RESIN COMPOSITION

Resin compositions comprising two resins A and B, wherein resin A consists of the reaction product of an epoxidized fatty acid ester of a polyvalent alcohol and a monovalent carboxylic acid and resin B consists of a carboxylic acid modified fatty acid ester of a polyvalent alcohol. These resins compositions are suitable for linoleum manufacture.

CURABLE EPOXIDE RESIN MIXTURES

Curable mixtures of ta) epoxide compounds, (b) adducts containing mercapto groups, which adducts are produced by an advancement reaction of dimercapto compounds with diglycidyl compounds in an amount less than the equivalent amount, and (c) carboxylic anhydrides. The curable mixtures are suitable as casting resin mixtures, particularly for producing moulded articles of large volume.

RESIN COMPOSITION CURABLE AT LOW TEMPERATURE

Disclosed is a resin composition curable at low temperature comprising, (A) epoxy resins having an epoxy equivalence of 100 to 4,000; (B) .alpha.-ketoecter compounds expressed by the following formula; (wherein R is an organic group having a molecular weight of 1 to 100,000, X is a carbon, oxygen- or sulfur atom and -NR2-, R1 and R2 are independently an alkyl-, alkenyl-, alkynyl-, aryl-, alalkyl-, alkaryl-, cychloalkyland heterocyclic group, and n is an integer of 1 or more,! and (C)polyamine compound or polyamide compound having a primary and/or secondary amino group; a solid weight ratio of the component (A) and (B) meeting the following relation (A)/(B)-99/1 to 5/95 and an epoxy equivalent of the component (A), and .alpha. -ketoester equivalent of the component (B) and an active hydrogen equivalent of the component (C) meeting the following relation; (A)+(B)/(C)= 100/10 to 100/200.

ACIDS IMIDYL-BENZENE-DIET - TRI-CARBOXYLIQUES AND THEIR DERIVATIVES, USABLE INTER ALIA LIKE RESIN EPOXYDIQUES HARDENERS

[...] -BENZENE-DICARBOXYLIC ACIDS AND DERIVATIVES THEREOF

Setting mixtures, containing loads, containing cycloaliphatic epoxy resins

COMPOSITION COMPRISING AN EPOXY RESIN, ACID ANHYDRIDE AND A N,N'?BIS?IMIDE

Glycidylamine epoxy curing composition

THERMOSETTING RESIN COMPOSITION, AND PREPREG, METAL-LAMINATED LAMINATION PLATE AND PRINTED WIRE BOARD USING THE SAME

PROBLEM TO BE SOLVED: To provide a printed wire board material which is excellent in dielectric characteristics, heat resistance, moisture resistance, electric corrosion resistance, adhesiveness, mechanical properties, and chemical resistance, and exhibits an excellent flame retardancy without using a halogen flame retardant. SOLUTION: The subject thermosetting resin composition contains (A) a copolymerization resin exemplified by the formula having a specified repeating unit, (B) a cyanate compound having two or more cyanato groups in the molecule, and (C) at least one kind of phosphoric flame retardant selected from the group consisting of phosphazene compounds and disubstituted phosphinic acid metal salts. COPYRIGHT: (C)2005,JPO&NCIPI ...

EPOXY RESIN COMPOSITION FOR SEALANT OF LED, AND LED DEVICE

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing an LED providing a resin in which crack formation by a thermal cycle test is reduced and which has excellent light resistance, and to provide the LED device sealed by the composition. SOLUTION: The epoxy resin composition for sealing the LED comprises the following components (A), (B) and (C): component (A): an epoxy resin obtained by hydrogenating an aromatic epoxy resin and having 230-1,000 g/eq. epoxy equivalent, and/or an epoxy resin obtained by reacting an epoxy resin obtained by hydrogenating an aromatic epoxy resin with a polybasic carboxylic acid compound, and having 230-1,000 g/eq. epoxy equivalent; component (B): an alicyclic epoxy resin obtained by epoxidizing a cyclic olefin; and component (C): a curing agent of an acid anhydride or a cationic polymerization initiator. COPYRIGHT: (C)2004,JPO ...

КОМПОЗИЦИЯ ДЛЯ ЗАЩИТНОГО ПОКРЫТИЯ

Изобретение относится к области полимерных композиций на основе модифицированных эпоксидных олигомеров, а именно к составам адгезионных и антикоррозионных грунтовочных покрытий, применяемых для защиты деталей и агрегатов из алюминиевых, магниевых сплавов и сталей в системах покрытий, применяемых для защиты авиационной техники. Композиция для защитного покрытия включает полимерное связующее, модификатор, отвердитель - кремнийорганический амин, по меньшей мере один пигмент, по меньшей мере один минеральный наполнитель и по меньшей мере один органический растворитель. В качестве полимерного связующего он содержит диановый эпоксидный олигомер с молекулярной массой от 900 до 1600 и массовой долей эпоксидных групп от 6,0 до 12,0, в качестве модификатора - акриловый сополимер, в качестве пигмента - вещество, являющееся ингибитором коррозии, при следующем соотношении компонентов, мас. ч.: полимерное связующее - 90-110; модификатор - 10-50; отвердитель - 30-80; пигмент - 35-100; минеральный наполнитель ...

HYBRIDHAERTUNGSSMITTEL FUER PULVERLACKE.

REACTIVE CURABLE BINDER MIXTURE, PROCESS FOR THE PRODUCTION OF CURED PRODUCTS AND USE OF THE MIXTURE IN THE PRODUCTION OF COATINGS

Verfahren zum Haerten von fluessigen Polyglycidylaethern

EPOXY RESIN COMPOSITIONS

... 1276638 Curing epoxy resins RHONEPOULENC SA 14 Jan 1971 [15 Jan 1970] 1963/71 Heading C3B A thermosetting composition comprises (I) an epoxy resin, (II) a polycarboxylic acid anhydride and (III) a N,N1-bis-imide of formula in which D is a divalent radical containing an ethylenic double bond and A is a divalent radical containing at least 2 carbon atoms. The ratio of (I) : (II) may be such that there are 0À4-1À5 anhydride groups per epoxy group. (III) may be present at 40-250% of the wt. of (I). (I) preferably contains at least 3 epoxy groups per molecule. (III) may be phthalic, maleic, tetra- or hexa-hydrophthalic, endomethylenetetrahydrophthalic, itaconic, dodecylsuccinic, trimellitic, pyromellitic, azophthalic, benzophenonetetracarboxylic, cyclopentanetetracarboxylic, 3,4,41- benzophenonetricarboxylic or benzoylpyromellitic anhydride. Examples of (III) are N,N1- 4,41-diphenylmethane-bis-maleimide and N,N1- 4,4-diphenylether-bis-maleimide. The ...

A process for hardening liquid polyglycidyl ethers

Polyglycidyl ethers are cured with an acid curing agent in the presence of a tertiary carboxylic amide of general formula as accelerator. R, R1 and R11 are the same or different aliphatic hydrocarbon groups, especially branched-chain alkyl groups containing 4 to 18 carbon atoms. Examples are: N,N-diisononyl-isobutyric acid amide, N,N-diisononyl-isooctanoic acid amide, N,N-diisononyl-isononanoic acid amide and N,N-diisononyl-isotridecanoic acid amide. The accelerator may be used at 1 to 20% by wt. based on the polyglycidyl ether.

EPOXY ADDUCTS AND THEIR SALTS AS DISPERSING AGENTS

REACTIVE HARDENABLE BINDER MIXTURE, PROCESS FOR PREPARING HARDENED PRODUCTS AND USE OF THE MIXTURE FOR THE PREPARATION OF COATINGS

A reactive hardenable binder composition based on A) at least one aliphatic, cycloaliphatic or aliphatic-cyclo- aliphatic polyepoxide wherein at least 2 epoxidized cycloaliphatic radicals are bound via an aliphatic bridge B) at least one polycarboxylic acid unit of formula (I) having an acid number between 30 and 400 wherein R1 is a radical of an at least oligomer product selected from the group consting of polyesters and polymers having initially free OH-groups R2 is a radical of a dicarboxylic carbocyclic acid having a COOH-group in ortho-position to its ester bond and C) a catalyst component of the fonnula (II) wherein R3 is a radical of a homo- or copolymer or combination of both of an unsaturated carboxylic acid with a statistically distributed number of COOH side groups or the radical of a polyester having initially free COOH-groups and Me is one equivalent of an alkaline or an alkaline earth metal, thus being present in its salt form, a process for the preparation of ...

FORTIFIERS FOR ANHYDRIDE-CURED EPOXY RESINS

TITLE ANHYDRIDE-BASED FORTIFIERS FOR ANHYDRIDE-CURED EPOXY RESINS INVENTORS Andrew Garton Paul Douglas McLean An anhydride-cured epoxy resin (epoxy resin + anhydride curing agent + catalyst) may be fortified (i.e. increased in strength and modulus without being made brittle) by the addition of a carboxylic acid and the reaction product of a carboxylic acid anhydride and a substituted aromatic amine. Strengths as high as 125 MPa and moduli as high as 3500 MPa have been attained, as well as elongations up to 6% and an increase in the ability of the plastic to yield before fracture (ductility), compared to 80 MPa strength, 3000 MPa modulus and 2.4% elongation for the unfortified system (strengths and moduli are tensile).

OLIGOMERS POSSESSING 8MIDE GROUPS

STABILISED LIQUID DICARBOXYLIC ACID ANHYDRIDE MIXTURES

Epoxy compositions of resins

PROCEDE DE RETICULATION DE POLYMERES D'ETHYLENE CONTENANT DES FONCTIONS ANHYDRIDE, COMPOSITIONS POLYMERES RETICULABLES ET APPLICATION DE CES COMPOSITIONS A L'ENDUCTION DE SUBSTRATS

LE PROCEDE DE RETICULATION D'UN POLYMERE CONTENANT DES MOTIFS DERIVES DE L'ETHYLENE ET DES MOTIFS DERIVES DE L'ANHYDRIDE MALEIQUE, ET LE CAS ECHEANT DES MOTIFS DERIVES D'AU MOINS UN TROISIEME MONOMERE CONSISTE A FAIRE REAGIR A UNE TEMPERATURE DE 10 A 160C, SOUS UNE PRESSION DE 1 A 300BARS ET PENDANT AU MOINS 0,5HEURE LEDIT POLYMERE AVEC AU MOINS UN COMPOSE POLYEPOXYDE EN PRESENCE D'AU MOINS UN CATALYSEUR. LA COMPOSITION RETICULABLE COMPREND : A. UN POLYMERE D'ETHYLENE ET D'ANHYDRIDE MALEIQUE CONTENANT : A.DE 42 A 99 EN POIDS DE MOTIFS DERIVES DE L'ETHYLENE, B.DE 1 A 8 EN POIDS DE MOTIFS DERIVES DE L'ANHYDRIDE MALEIQUE, C.DE 0 A 50 EN POIDS DE MOTIFS DERIVES D'AU MOINS UN TROISIEME MONOMERE ET EST CARACTERISEE EN CE QUE, POUR 100PARTIES EN POIDS DU POLYMERE A, LADITE COMPOSITION COMPREND EN OUTRE : B. DE 1 A 10PARTIES EN POIDS D'AU MOINS UN COMPOSE POLYEPOXYDE, C. DE 0,02 A 2PARTIES EN POIDS D'UN CATALYSEUR DE REACTION ENTRE LES FONCTIONS EPOXYDE. APPLICATION A L'ENDUCTION D'UN SUBSTRAT ...

VINYL ETHERIFIED EPOXY RESINS COPOLYMERIZED WITH CARBOXY AND VINYL CONTAINING MONOMERS

A method for hardening liquid ethers of polyglycidyle

CURABLE COMPOSITIONS OF SUBSTANCE

VINYL ETHERIFIED EPOXY RESINS COPOLYMERIZED WITH CARBOXY AND VINYL CONTAINING MONOMERS

Molding compositions comprised of polyimide/N-vinylpyrrolidone prepolymer and epoxy resin

Novel thermosetting compositions, including a polyimide/N-vinylpyrrolidone prepolymer, optionally comprising an unsaturated polyester, and an epoxy resin, are well adapted for the molding of a variety of useful shaped articles.

RESIN COMPOSITION FOR LIQUID SEALING

PROBLEM TO BE SOLVED: To provide a one-package epoxy resin composition, a liquid sealing agent to be used for a semiconductor connecting part, etc., obtaining a hardened product having the suppressed generation of ionic impurities and acidic substances which induce the corrosion of electric and electronic circuits, and thereby giving a semiconductor package having high reliability. SOLUTION: A resin composition for liquid sealing contains (A) an epoxy resin, (B) an acid anhydride hardening agent such as methylhexahydrophthalic anhydride, (C) hydrotalcite (Mg6Al2(OH)16CO3.4H2O), the substance obtained by removing the crystal water from hydrotalcite or a burned product of hydrotalcite, as an adsorbent, and (D) a filler such as silica powder, as essential components. COPYRIGHT: (C)2002,JPO ...

POWDERED PAINT COMPOSITION

PURPOSE: To provide titled compsn. which forms a coating film having excellent smoothness, gloss, brilliancy and weathering resistance, consisting of a dibasic acid and a vinyl copolymer contg. a glycidyl gp.-contg. vinyl monomer and a phosphated vinyl monomer as copolymer components. CONSTITUTION: (II) An aliph. dibasid acid (e.g. sebacic acid) and, if necessary, a curing reaction catalyst (e.g. an amine) and an epoxy resin are blended with (I) a vinyl copolymer having a number-average MW of 1,500W30,000 and a softening point of 80W150°C, consisting of (i) 5W50wt% of a glycidyl gp.-contg. vinyl monomer (e.g. glycidyl acrylate), (ii) 0.001W10wt% of a phosphated vinyl monomer (e.g. phosphoric monoester of β-hydroxyethyl acrylate) and (iii) 94.999W40wt% of another vinyl monomer to obtain the desired powdered paint. The paint is coated on a steel plate, etc. by electrostatic coating, fluidization dip coating, etc. and baked to form a coating film. COPYRIGHT: (C)1981,JPO&Japio ...

CURABLE EPOXIDE RESIN MIXTURES

Method of preparing a shaped article having a photochromic coating thereon

OLIGOMERES A GROUPEMENTS IMIDE

REACTIVE HARDENABLE BINDER MIXTURE, PROCESS FOR PREPARING HARDENED PRODUCTS AND USE OF THE MIXTURE FOR THE PREPARATION OF COATINGS

Machine for the shaping and the completion of the tires

SETTING MIXTURES CONTAINING RESINS EPOXYDIQUES

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

AMIDOAMINE AND POLYAMIDE CURING AGENTS, COMPOSITIONS, AND METHODS

A composition including an amidoamine curing agent composition or a polyamide curing agent composition are disclosed. The composition includes the reaction products of (1) an amine component including at least one multifunctional amine of structure (I): wherein each R is independently H or CH2CH2CH2NH2; R1 is H, CH3CH2CH2N-, C1-C21 alkyl, or C1-C21 alkenyl; n is 2; and m is 1 or 2, with (2) a fatty acid or ester component selected from the group consisting of a dimer fatty acid or ester component, a monofunctional fatty acid or ester component, and combinations thereof. The amidoamine curing agent composition remains as liquid at ambient temperature.

METHOD OF PREPARING A SHAPED ARTICLE HAVING A PHOTOCHROMIC COATING THEREON

Process for cross-linking ethylene polymers containing acid anhydride groups, the cross-linkable compositions and the use of these compositions as a spread

A crosslinking process wherein at a temperature of about 10 DEG to 160 DEG C., under a pressure of about 1 to 300 bars and for at least about 0.5 hour, a polymer, containing from about 42 to 99% by weight of units derived from ethylene and, where appropriate, also from an alpha -olefin, from about 1 to 8% by weight of units derived from maleic anhydride and from 0 to about 50% by weight of units derived from at least one additional monomer selected from an ester of an unsaturated carboxylic acid with an alcohol containing from 1 to 12 carbon atoms, is reacted with at least one polyepoxide compound, preferably present in an amount of from about 1 to 10 parts by weight, based on 100 parts by weight of the polymer, in the presence of at least one catalyst suitable for reacting the anhydride functions with the epoxide functions. The catalyst is preferably present in an amount from about 0.02 to 2 parts by weight, based on 100 parts by weight of the polymer. The crosslinkable compositions may ...

CURABLE EPOXY RESIN COMPOSITION

PURPOSE: The titled composition which has excellent storage stability and a long pot life and quickly cures when heated, prepared by mixing an epoxy resin with a polycarboxylic acid anhydride curing agent and a specified cure accelerator. CONSTITUTION: An epoxy resin having at least two epoxy groups in the molecule is mixed with a polycarboxylic acid anhydride curing agent (e.g., maleic anhydride) and a quat. ammonium triazolate compound of the formula [wherein R1W4 are each a 1W18C (un)substituted alkyl or benzyl, and R5 is H or methyl] as a cure accelerator. COPYRIGHT: (C)1985,JPO&Japio ...

Epoxy composition of resin

OLIGOMERS POSSESSING 8MIDE GROUPS

EPOXIDE RESIN COMPOSITIONS COMPRISING A POLYCARBOXYLIC ACID ANHYDRIDE HARDENER AND A SUBSTITUTED AMIDE ACCELERATOR

複合材料用の高Tgエポキシ系

... 少なくとも1種の脂環式エポキシ樹脂を含むエポキシ混合物;脂環式無水物硬化剤;及び触媒の反応生成物であって、210℃又はそれ以上のガラス転移温度を有する反応生成物を含む熱硬化樹脂。少なくとも1種の脂環式エポキシ樹脂を含む2種又はそれ以上のエポキシ樹脂を脂環式無水物硬化剤と混合して硬化性組成物を形成し;前記硬化性組成物を少なくとも150℃の温度で熱硬化させて、少なくとも210℃のガラス転移温度を有する熱硬化樹脂を形成する、熱硬化樹脂の形成方法も開示する。このような硬化性組成物は、35~65重量%の少なくとも1種の脂環式エポキシ樹脂を含むエポキシ樹脂混合物;35~65重量%の脂環式無水物硬化剤;及び0重量%超~10重量%の触媒を含むことができる。 ...

HAERTBARE MISCHUNGEN AUS DIEPOXIDVERBINDUNGEN UND POLYESTER-POLYAMID-DICARBONSAEUREN

HEAT CURABLE COMPOSITIONS BASED ON PREPOLYMERS CONTAINING IMIDE GROUPS AND ON EPOXY RESINS

IMIDYL-BENZENE-DICARBOXYLIC AND -TRICARBOXYLIC ACID DERIVATIVES

IMIDYL-BENZENE-DICARBOXYLIC AND -TRICARBOXYLIC ACID DERIVATIVES

New imidyl-benzenedicarboxylic and -tricarboxylic acid derivatives of the formulae and wherein A denotes a radical of the formula , , , , or , R1 and R2 independently of one another denote hydrogen, chlorine or bromine and R3 and R4 denote various functional groups, such as-OH or alkoxy groups, and a process for their manufacture are described. These imidyl-benzenedicarboxylic and -tri-carboxylic acid derivatives are suitable for the manufacture of crosslinkable polymers, particularly polycondendation and polymerisation products which are distinguished by good processability and good solubility in customary organic solvents. Imidyl compounds of the above formulae wherein two R4 s form an anhydride grouping can also be used as curing agents for optionally modified epoxide resins.

Curable epoxy resin composition

Curable epoxy resin composition including an epoxy resin component and a filler component and optionally a hardener component and further additives, wherein (a) the curable epoxy resin composition has been produced by separately mixing together at least a part of the epoxy resin component and at least a part of the filler component and optionally some or all of the optional additives, prior to mixing theses components with the optional hardener component and with any remaining optional additives present in the curable epoxy resin composition, and that (b) the mixing together of at least a part of the epoxy resin component and at least a part of the filler component and optionally some or all of the optional additives has been carried out at a temperature higher than the casting temperature of the curable epoxy resin composition, and electrical insulation systems made therefrom.

Epoxy resin blend

Embodiments of the present disclosure set forth a sintered talc powder. The sintered talc powder comprising a first X-ray diffraction peak from about 29° to about 30° and having a first intensity and a second X-ray diffraction peak from about 25° to about 27° and having a second intensity, wherein the first intensity is greater than the second intensity.

Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device

A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 100 nm.

Composite surfacing film with ultraviolet light and abrasion resistance

The present invention is a one-part ultraviolet light and abrasion resistant pigmented surfacing film composition adapted for co-curing with an amine cured composite prepreg material using a chain extended base cycloaliphatic epoxy resin. The chain extended cycloaliphatic epoxy resin is formed through the pre-reaction of a base cycloaliphatic epoxy resin with a chain extension agent such as bisphenol and a high molecular weight elastomer in the presence of triphenyl phosphine to chain link the base cycloaliphatic epoxy resin to form a film formable cycloaliphatic resin prereact capable of low temperature curing when added to a latent amine based epoxy curing agent; an amine catalyst; at least one filler; at least one pigment; and a flow control agent to form surfacing film composition. The surfacing film composition adapted for co-curing with an amine curable composite from about 180° F. to about 350° F.

CURING OF EPOXY RESIN COMPOSITIONS COMPRISING CYCLIC CARBONATES USING MIXTURES OF AMINO HARDENERS

A process for curing an epoxy resin composition containing an epoxy resin and a compound of the general formula I: 2. The process according to claim 1 , wherein the epoxy resins are polyglycidyl ethers of aromatic claim 1 , aliphatic or cycloaliphatic polyols.3. The process according to or claim 1 , wherein R1 in formula I is selected from hydrogen and C1-C4-alkyl claim 1 , and R2 in formula I is selected from C1-C4-alkyl and C1-C4-alkoxy-C1-C4-alkyl claim 1 , or R1 and R2 together are a C4-C6-alkylene group.4. The process according to any of to claim 1 , wherein R1 and R2 in formula I independently of one another are C1-C4-alkyl.5. The process according to any of to claim 1 , wherein R3 and R4 are hydrogen.6. The process according to any of to claim 1 , wherein the co-hardeners are aliphatic compounds having two primary amino groups.7. The process according to any of to claim 1 , wherein the co-hardeners are aliphatic compounds having one primary and one tertiary amino group.8. The process according to any of to claim 1 , wherein the co-hardeners are aliphatic compounds having one primary amino group and one or two hydroxyl groups.9. The process according to any of to claim 1 , wherein the co-hardeners are aromatic or cycloaliphatic compounds having two aminomethylene groups.10. The process according to any of to claim 1 , wherein the co-hardeners are used in amounts of 0.1 to 20 parts by weight claim 1 , based on the epoxy resin a).11. The process according to any of to claim 1 , wherein the other amine hardeners are selected from polyamidoamines claim 1 , phenalkamines claim 1 , epoxy-amine adducts claim 1 , polyetheramines or other amine compounds different from the co-hardeners (referred to below for short as hardeners).12. A two-component epoxy resin composition comprising a separate binder composition claim 1 , comprisinga) an epoxy resin andb) a compound of the formula I,and a separate hardener mixture comprising amine hardeners, comprisingc) a co-hardener ...

EPOXIDE/(METH) ACRYLATE COMPOSITION

A composition having at least one radically polymerisable monomer M; at least one radical former, at least one epoxide resin A including an average of more than one epoxide group per molecule, and at least one compound of formula (I). Such compositions are suitable as adhesives, sealants or coatings. Shortly after the application thereof, they have a high initial strength and, after further hardening at room temperature, they reach a high level of final strength. 2. The composition as claimed in claim 1 , wherein the free-radically polymerizable monomer M is a methacrylate.3. The composition as claimed in claim 1 , wherein the proportion of the free-radically polymerizable monomer M is 10 to 90% by weight of the overall composition.4. The composition as claimed in claim 1 , wherein the free-radical former is a peroxide claim 1 , a hydroperoxide or a perester.5. The composition as claimed in claim 1 , comprising:at least one tertiary amine or a transition metal salt or a transition metal complex as a catalyst for free-radical formation.6. The composition as claimed in claim 1 , wherein the epoxy resin A is obtained from a reaction of epichlorohydrin and/or 2-methylepichlorohydrin with a diphenol.7. The composition as claimed in claim 1 , wherein the proportion of the epoxy resin A is 5 to 40% by weight of the overall composition.8. The composition as claimed in claim 1 , wherein the bifunctional monomer L is glycidyl (meth)acrylate.9. The composition as claimed in claim 1 , formed as a two-pack composition comprising:a first pack K1 having the free-radically polymerizable monomer M, the compound of the formula (I) and the bifunctional monomer L; anda second pack K2 having the free-radical former and the epoxy resin A.10. The composition as claimed in claim 1 , wherein the composition is curable at room temperature.11. The composition as claimed in claim 1 , configured as an adhesive or sealant or as a coating.13. The method as claimed in claim 12 , where Rand/or ...

WATER-DISPERSIBLE EPOXY RESIN, WATER-BASED EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF

An object of the present invention is to provide a water-soluble epoxy resin that has high water-solubility, maintains emulsion stability for epoxy resin, and is capable of forming a cured product that has excellent coating film strength corrosion resistance and water resistance. 1. A water-dispersible epoxy resin obtained by allowing a compound (A) having two or more carboxy groups in a molecule to react with an epoxy resin (B) having two or more epoxy groups in a molecule ,wherein the compound (A) is obtained by an esterification reaction of a polyethylene glycol monoalkyl ether (A-1) having a number-average molecular weight of 400 to 10000 and an acid anhydride (A-2) derived from a polyvalent carboxylic acid having three or four carboxy groups in a molecule in such a manner that two or more carboxy groups are present in a molecule.3. The water-dispersible epoxy resin according to claim 2 , wherein claim 2 , in general formula (I) claim 2 , R is an alkyl group having 1 to 4 carbon atoms claim 2 , R′ is a methylene group or a 2 claim 2 ,2-propylene group claim 2 , and m is 1.4. A method for producing a water-dispersible epoxy resin claim 2 , the method comprising a step of obtaining a compound (A) having two or more carboxy groups in a molecule by an esterification reaction of a polyethylene glycol monoalkyl ether (A-1) having a number-average molecular weight of 400 to 10000 and an acid anhydride (A-2) derived from a polyvalent carboxylic acid having three or four carboxy groups in a molecule in such a manner that the ratio of acid anhydride groups (—COOCO—) of the acid anhydride (A-2) to hydroxyl groups of the polyethylene glycol monoalkyl ether (A-1) is within the range of 1 to 1.2; and a step of allowing the compound (A) to react with an epoxy resin (B) having two or more epoxy groups in a molecule.5. A water-dispersible epoxy resin composition comprising 5 to 70 parts by mass of the water-dispersible epoxy resin (α) according to and 30 to 95 parts by mass of ...

CURABLE EPOXY RESIN COMPOSITIONS AND COMPOSITES MADE THEREFROM

A diluent-free curable epoxy resin composition for preparing a composite comprising: (A) at least one epoxy resin composition comprising a blend of: (A1) at least one epoxy resin, and (A2) at least one divinylarene dioxide; and (B) at least one hardener composition; and (C) at least one reinforcement materials; wherein the viscosity of the curable composition is the range of from about 0.15 Pa-s to about 1.5 Pa-s; and wherein the curable composition is adapted for providing a cured composite product made from the curable composition such that the composition being cured provides a cured composite product having an increased Tg of greater than about 5° C. as compared to a curable composition having a reactive diluent. 1. A diluent-free curable epoxy resin composition for preparing a composite comprising: (A1) at least one epoxy resin, and', '(A2) at least one divinylarene dioxide;, '(A) at least one epoxy resin composition comprising a blend of(B) at least one hardener composition; and(C) at least one reinforcement materials;wherein the viscosity of the curable composition is the range of from about 0.15 Pa-s to about 1.5 Pa-s; and wherein the curable composition is adapted for providing a cured composite product made from the curable composition such that the composition being cured provides a cured composite product having an increased Tg of greater than about 5° C. as compared to a curable composition having a reactive diluent.2. The curable epoxy resin composition of claim 1 , wherein the curable composition is adapted for providing a cured composite product made from the curable composition such that the composition being cured provides a cured composite product having an increased modulus of greater than about 10 percent compared to a curable composition having a reactive diluent3. The curable epoxy resin composition of claim 1 , wherein the curable composition is adapted for providing a cured composite product made from the curable composition such that the ...

EPOXY RESIN COMPOSITION FOR PREPREG, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD

The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg. 1. An epoxy resin composition for a prepreg , comprising , as essential components ,a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element;a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule;a multi-functional epoxy resin that contains 2.8 or more on ...

WAFER BACKSIDE COATING PROCESS WITH PULSED UV LIGHT SOURCE

A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation. 1. A process for coating a semiconductor wafer with a coating composition comprising:(A) providing a coating composition(B) disposing the coating composition onto the semiconductor wafer; and(C) B-stage curing the coating composition by exposing the composition to pulsed UV light in an amount sufficient to cure the coating composition.2. The process according to in which the coating composition is exposed to a total of 0.1 to 10 J/cm.3. The process according to in which the pulsed UV light source is used at a distance of 12 to 38 cm from wafer to bulb for 15 to 300 seconds.4. The process according to in which the semiconductor wafer is 100 μm or less in thickness.5. The process of in which the coating composition comprises a resin that can be cured thermally and a resin that can be cured by free radical polymerization.6. The process of in which the resin that can be cured thermally is an epoxy resin and the resin that can be cured by free radical polymerization is an acrylate resin.8. A semiconductor wafer coated using the process of9. A semiconductor wafer coated using the process of in which the coating composition comprises (i) a solid epoxy resin with a melting point between 80° and 130° C. claim 1 , and (ii) an acrylate resin having a viscosity less than 50 mPas and a boiling point greater than 150° C. This invention relates to a process for coating the inactive side (backside) of a semi-conductor wafer in which the coating is cured using a pulsed UV light source.Recent advancements in semiconductor packaging have led to the downsizing of the package through the use of thinner dies in a stacked ...

ANTIMICROBIAL COMPOSITION

An antimicrobial composition containing coniferous resin acids and/or their derivates, an antimicrobial polymer composition including coniferous resin acids and/or their derivates and processes for preparing thereof, and the use of the derivates of coniferous resin acids as an antimicrobial agent. 1. A process for manufacturing a polymer composition , comprising impregnation of coniferous resin acids and/or their derivates in a solution into a polymer composition matrix for a sufficient time to render the polymer composition antimicrobial.2. The process of claim 1 , wherein the amount of coniferous resin acids and/or their derivates is 0.1 to 20% w/w or w/v of the polymer composition.3. The process of claim 1 , wherein the polymer composition is natural or synthetic fibre or fabric claim 1 , thermosetting plastic or thermoplast claim 1 , rubber claim 1 , or silicone.4. The process of claim 3 , wherein the polymer composition is polypropylene fibre.5. The process of claim 3 , wherein the polymer composition is epoxy resin.6. The process of claim 3 , wherein the polymer composition isa paint,a plastic cloth for protection of surgical sites, such as skin, and injuries,coatings to be spread onto the skin or tissues,a coating for suture thread, hooks and clamps,a protective glove, hair cover, apron and coatings thereof,a plaster, wound dressing,a biomedical device, like a plastic catheter such as an urinary catheter and drain, hose, cannula and coatings thereof,a bandage for surgical wounds and skin openings made during operations, e.g. colostomy, ileostomy,artificial plastic parts for the body or body cavities like prostheses and artificial transplants, oral prostheses, dental bridges, implants, tubes, nails, and coatings thereof,coatings for artificial parts to be placed into the body and made of metal or material other than plastic, plasters, splints, supporting prostheses, protective bandages, shoes, insoles and coatings thereof.7. The process of claim 6 , wherein ...

COMPOSITION, COMPOSITION BEING FOR END-FACE SEALING DISPLAY DEVICES AND CONSISTING OF THE COMPOSITION, DISPLAY DEVICES, AND PROCESS FOR PRODUCING SAME

An end-face sealing agent for display devices, which consists of a resin composition containing (1) a liquid epoxy resin, (2) an epoxy resin curing agent that is liquid at 23° C. and that is selected from the group consisting of acid anhydrides and thiol compounds having two or more mercapto groups in the molecule, (3) a secondary or tertiary amine that is solid at 233° C., or microcapsules that contain a secondary or tertiary amine therein, and (4) a filler, and in which the content of the component (4) is 50 to 150 parts by weight relative to 100 parts by weight of the sum total of the components (1), (2) and (3), and the viscosity as determined using an E-type viscometer at 253° C. and 2.5 rpm is 0.5 to 50 Pas. 1. A resin composition comprising:(1) an epoxy resin that is liquid at 23° C.;(2) an epoxy resin curing agent that is liquid at 23° C., the epoxy resin curing agent being selected from the group consisting of an acid anhydride and a thiol compound having two or more mercapto groups in a molecule thereof;(3) a secondary or tertiary amine that is solid at 23° C., or microcapsules encapsulating therein the secondary or tertiary amine; and(4) a filler, whereinan amount of the component (4) in the composition is 50 to 150 parts by weight based on 100 parts by weight of the total amount of the components (1), (2) and (3), andthe composition has a viscosity at 25° C. and 2.5 rpm of 0.5 to 50 Pa·s as measured by an E-type viscometer.2. A composition for a display edge-face sealing agent comprising the composition according to .3. The composition according to claim 2 , wherein the composition has a moisture content of 0.5 wt % or less.4. The composition according to claim 2 , wherein the filler comprises an inorganic filler and an organic filler.5. The composition according to claim 2 , wherein the filler is a spherical filler having an average particle size of 0.1 to 20 μm.6. The composition according to claim 2 , wherein the epoxy resin that is liquid at 23° C. ...

Toughening agent for epoxy resin compositions

A curable epoxy resin composition comprising (a) at least one epoxy resin; (b) at least one curing agent; and (c) at least one high molecular weight poly(propylene oxide) polyol toughening agent; and a process for preparing the curable epoxy resin composition.

Functional particle, functional particle group, filler, resin composition for electronic component, electronic component and semiconductor device

A functional particle ( 100 ) contains an inorganic particle ( 101 ), a first layer ( 103 ) coating the inorganic particle ( 101 ), and a second layer ( 105 ) coating the first layer ( 103 ). Any one or two component(s) of a resin, a curing agent and a curing accelerator is (are) contained in the first layer ( 103 ), and the others are (is) contained in the second layer ( 105 ).

ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME

An adhesive film for a semiconductor may include about 60 wt % to about 80 wt % of a thermoplastic resin based on a total solid content of the adhesive film, a phenolic curing agent, and an amine curing agent, and the adhesive film may have a storage modulus of about 2 MPa or more and a reaction curing rate of about 50% or more when cured at 150° C. for 20 minutes. 1. An adhesive film for a semiconductor , the adhesive film comprising:about 60 wt % to about 80 wt % of a thermoplastic resin based on a total solid content of the adhesive film;a phenolic curing agent; andan amine curing agent, the adhesive film having a storage modulus of about 2 MPa or more and a reaction curing rate of about 50% or more when cured at 150° C. for 20 minutes.2. The adhesive film as claimed in claim 1 , wherein the adhesive film has a void area ratio of about 10% or less when cured at 150° C. for 20 minutes and molded at 175° C. for 120 seconds.3. The adhesive film as claimed in claim 1 , wherein the amine curing agent includes at least two amine groups.5. The adhesive film as claimed in claim 4 , wherein:the amine curing agent includes the compound represented by Formula 1,{'sub': 1', '3, 'at least one of Rto Ris an amine group, and'}{'sub': 8', '10, 'at least one of Rto Ris an amine group.'}6. The adhesive film as claimed in claim 5 , wherein Rand Rare each an amine group.7. The adhesive film as claimed in claim 1 , wherein the thermoplastic resin has a weight average molecular weight of about 50 claim 1 ,000 g/mol to about 5 claim 1 ,000 claim 1 ,000 g/mol.8. The adhesive film as claimed in claim 1 , further comprising about 5 wt % to about 30 wt % of an epoxy resin claim 1 , wherein:the thermoplastic resin is an epoxy group containing thermoplastic resin, and the epoxy resin and the thermoplastic resin are different.9. The adhesive film as claimed in claim 1 , wherein a weight ratio of the phenolic curing agent to the amine curing agent ranges from about 3:1 to about 1:11.10. The ...

INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD INCLUDING THE SAME

Disclosed herein is an insulating resin composition for a printed circuit board, including 40 to 70 wt % of a liquid crystal oligomer shown in formula 1, 10 to 30 wt % of an epoxy resin, 10 to 30 wt % of a cyanate-based resin, and 0.1 to 0.5 wt % of a curing catalyst, and a printed circuit board including the same. 2. The insulating resin composition according to claim 1 , wherein the liquid crystal oligomer has a number average molecular weight of 500 to 10 claim 1 ,000 g/mol.3. The insulating resin composition according to claim 1 , wherein the structure unit of the formula 1 is included in an amount of 5 to 60 mol % based on a total amount of the liquid crystal oligomer claim 1 , and the structure unit of the formula 2 is included in an amount of 40 to 95 mol % based on the total amount of the liquid crystal oligomer.4. The insulating resin composition according to claim 1 , wherein Lof the formula 4-7 is an ether group claim 1 , a sulfide group claim 1 , a ketone group claim 1 , sulfoxide claim 1 , a sulfone group claim 1 , an azo group claim 1 , a cyanide group claim 1 , a substituted or unsubstituted Cto Calkylene group claim 1 , a substituted or unsubstituted Cto Calkenylene group claim 1 , or a substituted or unsubstituted Cto Carylene group.5. The insulating resin composition according to claim 1 , wherein Lof the formula 5-6 is an ether group claim 1 , a sulfide group claim 1 , a ketone group claim 1 , an amide group claim 1 , sulfoxide claim 1 , a sulfone group claim 1 , an azo group claim 1 , a cyanide group claim 1 , a substituted or unsubstituted Cto Calkylene group claim 1 , a substituted or unsubstituted Cto Calkenylene group claim 1 , a substituted or unsubstituted Cto Carylene group claim 1 , a divalent organic functional group substituted or not substituted with at least one functional group of the formula 6 claim 1 , or a divalent organic functional group of the formulas 7-1 to 7-3.8. The insulating resin composition according to claim 7 , ...

CATALYZED EPOXY-CARBOXYLIC ACID SPRAY FOAMS AND METHODS OF USING SAME

A foamable composition, foamed product and method of forming a foamed product are disclosed. The foamed product includes an epoxy resin crosslinked with a polycarboxylic acid to form a polymeric foam having cells filled with a blowing agent. The reaction between the epoxy resin and the carboxylic acid is catalyzed by a chromium (III) catalyst, particularly an active, carboxylated chromium salt, so as to speed the reaction at ambient temperature to allow the foam to set and cure so rapidly that, when applied to a vertical surface, the effects of gravity do not destroy the foam by pulling it down before the foam sets. Other ingredients preferably include a rheology modifier or thixotrope. The foams may be used for a wide variety of applications including sealing and/or insulating building structures. 1. A two-part foamable composition comprising: 'an epoxy resin;', 'a first part comprising a polycarboxylic acid; and', 'a chromium (III) catalyst complex capable of catalyzing a reaction between the epoxy resin and the carboxylic acid at ambient temperature; and, 'a second part comprisingthe composition further comprising a blowing agent for initiating a foaming reaction.2. The foamable composition of claim 1 , wherein the epoxy resin comprises an aliphatic backbone selected from polyesters and polyethers.3. The foamable composition of claim 1 , wherein the epoxy resin comprises an aromatic backbone.4. The foamable composition of claim 1 , wherein the carboxylic acid is a polyacrylate.5. The foamable composition of claim 1 , wherein the blowing agent is a low-boiling point hydrocarbon.6. The foamable composition of claim 1 , wherein the blowing agent is selected from FEA-1100 and HFC 254.7. The foamable composition of claim 1 , further comprising a rheology modifier.8. The foamable composition of claim 7 , wherein the rheology modifier is selected from associative thickeners claim 7 , inorganic clays claim 7 , and modified clays.9. A method of sealing or insulating part ...

EPOXY RESIN COMPOSITION AND ITS PREPARING METHOD

The invention relates to an epoxy resin composition and preparation thereof. The composition comprises the following blended components: 100 weight parts of epoxy resins; 30 to 120 weight parts of anhydride curing agents; 1 to 45 weight parts of powdery nitrile rubbers; no curing accelerator is included in the composition. The composition of the invention has both higher heat resistance and higher toughness, and is suitable for the fields which require high heat resistance, such as circuit board, electronics packaging, binder and electrical insulating coating etc. 1. An epoxy resin composition comprising the following blended components: 100 weight parts of epoxy resin; 30 to 120 weight parts , preferably 50 to 90 weight parts of anhydride curing agent; 1 to 45 weight parts , preferably 2 to 29 weight parts , more preferably 3 to 25 weight parts , most preferably 3 to 19 weight parts of powdery nitrile rubber;No curing accelerator is included in the composition;Wherein the powdery nitrile rubber are rubber particles having homogeneous structure, mean particle diameter of 20 to 500 nm and gel content of 60 wt % or greater.2. The epoxy resin composition according to claim 1 , wherein the anhydride curing agent are at least one selected from the group consisting of phthalic anhydride claim 1 , tetrahydrophthalic anhydride claim 1 , hexahydrophthalic anhydride claim 1 , methyl tetrahydrophthalic anhydride claim 1 , methyl hexahydrophthalic anhydride claim 1 , methyl nadic anhydride claim 1 , dodecylsuccinic anhydride claim 1 , chlorendic anhydride claim 1 , pyromellitic anhydride claim 1 , benzophenone tetracarboxylic acid dianhydride claim 1 , methyl cyclohexene tetracarboxylic acid dianhydride claim 1 , diphenyl ether tetracarboxylic acid dianhydride claim 1 , trimellitic anhydride claim 1 , polyazelaic polyanhydride claim 1 , maleic anhydride claim 1 , 70 anhydride claim 1 , tung oil anhydride and 647 anhydride; preferably at least one selected from the group ...

POLYETHER AMINES USEFUL AS ACCELERANTS IN EPOXY SYSTEMS

The present invention relates to the speeded curing of a composition comprising an epoxy compound, an amino or anhydride hardener and a high-branched polyether amine accelerant. The high-branched polyether amine may have terminal hydroxyl groups (polyol) and/or amino groups (amino modified). The amino-modified high-branched polyether amines are obtainable by subsequently modifying the terminal hydroxyl groups of high-branched polyether amine polyols. 1. A curable composition comprising at least one epoxy compound , at least one amino or anhydride hardener and at least one high-branched polyether amine , wherein the epoxy compounds has 2 to 10 epoxy groups.2. The curable composition according to wherein the hardener is an amino hardener having at least one primary or two secondary amino groups.3. The curable composition according to wherein the hardener is an anhydride hardener having at least one intramolecular carboxylic anhydride group.4. The curable composition according to any one of to wherein the high-branched polyether amine is a high-branched polyether amine polyol having at least 3 terminal hydroxyl groups.5. The curable composition according to any one of to wherein the high-branched polyether amine is an amino-modified high-branched polyether amine having at least three terminal hydroxyl groups coupled with on average at least 1% of the reagent having at least one primary or secondary amino group.6. The curable composition according to wherein the reagent is a mono- or polyhydric aminoalcohol.7. The curable composition according to any one of to wherein the high-branched polyether amine comprises triethanolamine claim 5 , tripropanolamine claim 5 , triisopropanolamine or tributanolamine as monomer unit claim 5 , the monomer units in the polyether amine being linked to each other via their hydroxyl groups to form ether bridges.8. The curable composition according to any one of to wherein the high-branched polyether amine has a weight average molecular ...

TWO COMPONENT RESIN SYSTEM

Two component resin system consisting of a first component A and a second component B characterized in that component A comprises: a. a compound capable of undergoing a radical copolymerization selected from the group consisting of unsaturated polyester resins, vinyl ester resins and mixtures thereof, b. an epoxide functional resin as compound capable of reacting with an aliphatic amine and in that component B comprises a mixture of c. an aliphatic amine d. a perester. 2. Two component resin system according to claim 1 , characterized in that the compound (a) capable of undergoing radical copolymerization is an unsaturated polyester resin or a vinyl ester resin.3. Two component resin system according to claim 1 , characterized in that the compound (a) capable of undergoing radical copolymerization is a vinyl ester resin.4. Two component resin system according to claim 1 , characterized in that the vinyl ester resin is an oligomer or polymer containing at least one (meth)acrylate functional end group.5. Two component resin system according to claim 1 , characterized in that the epoxide functionalitly is a glycidyl ether.6. Two component resin system according to claim 1 , characterized in that component A further comprises a reactive diluent and that at least part of the reactive diluent is capable of a radical copolymerization.7. Two component resin system according to claim 6 , characterized in that at least part of the reactive diluent is capable of reacting with an aliphatic amine.8. Two component resin system according to characterized in that component B comprises a primary and/or secondary aliphatic amine as compound (c).9. Two component resin system according to claim 1 , characterized in that component B comprises a primary aliphatic amine as compound (c).10. Two component resin system according to claim 1 , characterized in that the perester in component B is an aromatic perester.11. Two component resin system according to characterized in that component A ...

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL

Provided are a fiber-reinforced composite material excellent in heat resistance and strength properties, an epoxy resin composition to obtain the fiber-reinforced composite material, and a prepreg obtained by using the epoxy resin composition. Further provided are a fiber-reinforced composite material having less volatile matters during the curing time, and having excellent heat resistance and strength properties, an epoxy resin composition to obtain the fiber-reinforced composite material, and a prepreg obtained by using the epoxy resin composition. Provided are: an epoxy resin composition for a fiber-reinforced composite material, comprising an amine type epoxy resin [A], an aromatic amine curing agent [B], and a block copolymer [C] having a reactive group capable of reacting with an epoxy resin; a prepreg obtained by impregnating a reinforced fiber with the epoxy resin composition; and a fiber-reinforced composite material obtained by curing the prepreg. Further provided are: an epoxy resin composition comprising an epoxy resin [A] having two or more of four- or more-membered ring structures, and having either one of a glycidyl amino group directly bonded to the ring structure or a glycidyl ether group directly bonded to the ring structure, epoxy resin [B] having three or more of functional groups, a curing agent [C], and an elastomer component [D]; a prepreg obtained by impregnating a reinforced fiber with the epoxy resin composition; and a fiber-reinforced composite material obtained by curing the prepreg. 1. An epoxy resin composition for fiber-reinforced composite materials comprising at least components [A] , [B] , and [C] listed below and characterized by containing 70 to 100 parts by mass of [A] and 2 to 15 parts by mass of [C] per 100 parts by mass of total epoxy resin content:[A] An amine-type epoxy resin,[B] An aromatic amine curing agent, and[C] A block copolymer having a reactive group capable of reacting with an epoxy resin.2. An epoxy resin ...

NOVEL RESIN CURING AGENTS

A curable resin comprising a curing agent, wherein the curing agent comprises an adjustable structural unit having a stable chain-like arrangement which is adjustable to a stable ring-like arrangement, wherein the ring-like arrangement comprises the constituents of the chain-like arrangement with two terminal constituents exhibiting an attractive chemical interaction, and is adjustable back from the ring-like arrangement to the chain-like arrangement by separation of the two terminal constituents. 1. A cured resin comprising a curing agent , wherein the curing agent is adjustable between a chain-like arrangement and a ring-like arrangement in response to tensile stress , shear stress , impact stress or flexure stress.214-. (canceled)15. A cured resin according to wherein said curing agent has the formula X1-B—X2 wherein X1 and X2 each comprise at least one functional reactive group claim 1 , which is attached to a rigid non-functional ring-like unit and the B-sequence comprises a backbone bonded to the ring-like unit in each of the X1 and X2.16. A cured resin according to claim 15 , wherein the functional reactive groups on the ring-like units of X1 and X2 groups are located at the meta or para position with respect to the B-sequence.17. A cured resin according to wherein each rigid non-functional ring-like unit of X1 and X2 is a benzene ring and wherein said functional reactive groups are —NH.18. A cured resin according to claim 15 , wherein the B-sequence includes at least two —CO— groups.19. A cured resin according to claim 18 , wherein the B-sequence comprises two —CO—NH— structures claim 18 , separated by from 1 to 8 atomic constituents.20. A cured resin according to claim 18 , wherein the B-sequence comprises two —CO—O— structures claim 18 , separated by from 1 to 8 atomic constituents.21. A cured resin according to claim 15 , wherein the B-sequence comprises a cycloaliphatic group.22. (canceled)23. (canceled)24. A cured resin according to wherein said cured ...

EPOXY RESIN COMPOSITION, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIALS

An epoxy resin composition containing an epoxy resin [A], epoxy resin [B], epoxy resin [C] and curing agent [D] wherein [A] is a bisphenol-type epoxy resin with a softening point of 90° C. or more, [B] is a tri- or higher functional amine-type epoxy resin, [C] is a bisphenol F-type epoxy resin with a number average molecular weight of 450 or less, and the epoxy resins [A] to [C] satisfy the following contents per 100 parts by mass of total epoxy resin content: [A] 20 to 50 parts by mass, [B] 30 to 50 parts by mass and [C] 10 to 40 parts. The present invention provides low-viscosity epoxy resin compositions that are excellent in impregnating reinforcing fibers and capable of producing cured resins with excellent modulus and toughness, as well as prepregs and fiber-reinforced composite materials based on those epoxy resin compositions. 111111111111. An epoxy resin composition containing an epoxy resin [A] , epoxy resin [B] , epoxy resin [C] and curing agent [D] wherein [A] is a bisphenol-type epoxy resin with a softening point of 90° C. or more , [B] is a tri- or higher functional amine-type epoxy resin , [C] is a bisphenol F-type epoxy resin with a number average molecular weight of 450 or less , and the epoxy resins [A] to [C] satisfy the following contents per 100 parts by mass of total epoxy resin content: [A] 20 to 50 parts by mass , [B] 30 to 50 parts by mass and [C] 10 to 40 parts by mass.211. An epoxy resin composition as described in wherein a cured resin obtained by curing the epoxy resin composition has a phase separation structure involving an [A]-rich phase and a [B]-rich phase with a phase separation structural period of 1 nm to 5 μm.3222. An epoxy resin composition containing an epoxy resin [A] claim 1 , epoxy resin [B] claim 1 , epoxy resin [C] and curing agent [D] and satisfies the conditions (1) to (4) below:{'b': 2', '2', '2', '2', '2', '2, '(1) The SP value of the cured resin [B′], obtained by having the epoxy resin [B] react with the curing agent ...

BLENDS FOR COMPOSITE MATERIALS

The subject matter of the present invention relates to a blend comprising an epoxy resin, a cyclic carbonate, and a hardener comprising a polyalkoxypolyamine, another amine, and a catalyst, to a process for producing said blend, to the use of the blend of the invention for producing cured epoxy resin, and also to an epoxy resin cured with the blend of the invention, and in particular to fiber-reinforced cured epoxy resins for use in rotor blades for wind turbines. 1. A blend comprising a1) from 75 to 97 parts by weight, based on epoxy resin component a), of one or more epoxy resins selected from the group of aromatic epoxy resins and/or cycloaliphatic epoxy resins, and', 'a2) from 3 to 18 parts by weight, based on epoxy resin component a), of one or more cyclic carbonates selected from the group of cyclic carbonates having from 1 to 10 carbon atoms, and', 'a3) from 0 to 15 parts by weight, based on epoxy resin component a), of one or more reactive diluents,, 'a. an epoxy resin component comprising'}where the parts by weight of components a1) to a3) always give a total of 100, and b1) from 10 to 79 parts by weight, based on the hardener b), of one or more polyalkoxypolyamines, and', 'b2) from 20 to 89 parts by weight, based on the hardener b), of one or more other amines selected from the group of aromatic, arylaliphatic, cycloaliphatic, heterocyclic and aliphatic polyamines having at least 3 carbon atoms and at least 4 reactive NH functions in primary and/or secondary amino groups, and', 'b3) from 0.5 to 30 parts by weight, based on the hardener b), of one or more catalysts selected from the group of tertiary amines, imidazoles, imidazolines, guanidines having less than 3 carbon atoms and/or less than 4 reactive NH functions in amino groups, secondary amines having less than 4 reactive NH functions, substituted ureas, guanamines and ketimines,, 'b. a hardener comprising'}where the parts by weight of components b1) to b3) always give a total of 100,where the ratio of ...

CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PHENOLIC RESIN, EPOXY RESIN, AND SEMICONDUCTOR SEALING MATERIAL

A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below: 2. The thermosetting resin composition according to claim 1 , wherein the phenolic resin (B) has a melt viscosity of 0.1 to 100 dPa·s measured at 150° C. with an ICI viscometer.3. A semiconductor sealing material comprising the epoxy resin (A) and the phenolic resin (B) according to ; and an inorganic filler in an amount of 70% to 95% by mass in the composition.4. A cured product obtained by curing the thermosetting resin composition according to .6. The phenolic resin according to claim 5 , wherein a melt viscosity measured at 150° C. with an ICI viscometer is 0.1 to 100 dPa·s.8. The thermosetting resin composition according to claim 7 , wherein the epoxy resin (A′) has a melt viscosity of 0.1 to 100 dPa·s measured at 150° C. with an ICI viscometer.9. A semiconductor sealing material comprising the epoxy resin and the curing agent according to ; and an inorganic filler in an amount of 70% to 95% by mass in the composition.10. A cured product obtained by curing the thermosetting resin composition according to .12. The epoxy resin according to claim 11 , wherein the epoxy resin has a melt viscosity of 0.1 to 100 dPa·s measured at 150° C. with an ICI viscometer.13. A semiconductor sealing material comprising the epoxy resin (A) and the phenolic resin (B) according to ; and an inorganic filler in an amount of 70% to 95% by mass in the composition.14. A cured product obtained by curing the thermosetting resin composition according to .15. A semiconductor sealing material comprising the epoxy resin and the curing agent ...

REINFORCED POLYMETRIC MATERIALS, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME

Disclosed herein is a polymeric composite comprising a first organic polymer that forms a first organic polymer phase; and a low molecular weight compound that exists in the form of a second crystalline phase; wherein the second crystalline phase is dispersed within the first organic polymer phase. Disclosed herein too is a polymeric composite comprising a first organic polymer that forms a first organic polymer phase; and a second phase that comprises a crystalline organic polymer, wherein the crystalline organic polymer has a different molecular structure from the first organic polymer; wherein the second phase is not covalently bonded to the first organic polymer phase and wherein the second phase has an average particle size of about 1 to about 20 micrometers. 1. A polymeric composite comprising:a first organic polymer that forms a first organic polymer phase;a second phase that comprises a crystalline organic polymer, wherein the crystalline organic polymer has a different molecular structure from the first organic polymer; wherein the second phase is not covalently bonded to the first organic polymer phase, wherein the polymeric composite has a tensile strength at break that is greater than the tensile strength of the first organic polymer without the low molecular weight compound, when tested as per ASTM D 638, an elongation at break that is greater than the elongation at break of the first organic polymer without the low molecular weight compound, when tested as per ASTM D 638 and an impact toughness that is greater than the impact toughness of the first organic polymer without the low molecular weight compound, when tested as per ASTM D 5045-99.2. The polymeric composite of claim 1 , wherein the polymeric composite has a melt viscosity that is lower than the melt viscosity of the first organic polymer without the low molecular weight compound.3. The polymeric composite of claim 1 , having a tensile strength at break that is at least 10% greater than the ...

CURABLE COMPOSITIONS

A curable composition or system including (a) at least one divinylarene dioxide, (b) at least one polythiol compound curing agent; and (c) at least one catalyst; wherein the resulting curable composition may be cured at ambient conditions to provide durable cured material. 1. A curable composition comprising (a) at least one divinylarene dioxide; (b) at least one polythiol compound curing agent; and (c) at least one catalyst; wherein the curable composition is capable of being cured at ambient conditions.2. The curable composition of claim 1 , wherein the at least one divinylarene dioxide comprises divinylbenzene dioxide.3. The curable composition of claim 1 , wherein the concentration of the at least one divinylarene dioxide comprises from about 1 weight percent to about 99 weight percent.4. The curable composition of claim 1 , wherein the at least one polythiol compound curing agent comprises a compound containing at least one thiol moiety.5. The curable composition of claim 1 , wherein the concentration of the at least one polythiol compound curing agent comprises from about 99 weight percent to about 1 weight percent.7. The curable composition of claim 6 , wherein n comprises an integer of 2 up to less than or equal to 10; m comprises an integer of 0 up to about 8; and wherein m+n comprises an integer of less than or equal to about 18.8. The curable composition of claim 6 , wherein n comprises an integer of 2 up to less than or equal to 6; m comprises an integer of 0 up to about 4; and m+n comprises an integer of less than or equal to about 6.9. The curable composition of claim 6 , wherein the curing catalyst comprises 1 claim 6 ,4-diazabicyclo[2.2.2]octane; N claim 6 ,N claim 6 ,N′ claim 6 ,N″ claim 6 ,N″-pentamethyldiethylenetriamine; 1 claim 6 ,4-dimethylpiperazine; 1-methyl-4-(2-dimethylaminoethyl)piperazine; bis-(2-dimethylaminoethyl)ether; N claim 6 ,N claim 6 ,N′ claim 6 ,N″ claim 6 ,N″-pentamethyldipropylenetriamine; N claim 6 ,N claim 6 ,N claim 6 ,- ...

Epoxy Resin Composition, and Prepreg and Copper Clad Laminate Made Therefrom

The present invention relates to an epoxy resin composition, and a prepreg and a copper clad laminate made therefrom. The epoxy resin composition comprises the following essential components: (A) at least an epoxy resin, of which the melt viscosity is not more than 0.5 Pa·s under the temperature of 150 ° C.; (B) phenolic resin, of which the structure is as shown in the formula 1: 2. The epoxy resin composition of claim 1 , wherein the epoxy resin of the component (A) is mutifunctional epoxy resin with the functionality thereof being not less than 2 and epoxy equivalent weight thereof being not more than 300 g/eq.4. The epoxy resin composition of claim 1 , wherein the epoxy resin composition also comprises flame retardant claim 1 , and the flame retardant is bromine-containing flame retardant or halogen-free flame retardant; the bromine-containing flame retardant non-reactive or reactive bromine-containing flame retardant; the reactive bromine-containing flame retardant is brominated epoxy resin claim 1 , which is one or more selected from brominated bisphenol A type epoxy resin claim 1 , brominated novolac type epoxy resin and brominated isocyanate modified epoxy resin; the non-reactive bromine-containing flame retardant is one or more selected from decabromodiphenyl ether claim 1 , decabromobibenzyl claim 1 , brominated styrene claim 1 , ethylenebistetrabromophthalimide claim 1 , and brominated polycarbonate.5. The epoxy resin composition of claim 4 , wherein the bromine content of the brominated epoxy resin is 15-55%; taking the total amount of the component (A) and component (B) in the epoxy resin composition as 100 parts by weight claim 4 , the usage amount of the brominated epoxy resin is 10-50 parts by weight.6. The epoxy resin composition of claim 1 , wherein the epoxy resin composition also comprises inorganic filler or organic filler claim 1 , of which the particle diameter is 0.1-10 μm; the inorganic filler is irregular or spherical inorganic filler claim ...

METHOD OF CONTROLLING ORIENTATION OF DOMAINS IN BLOCK COPOLYMER FILMS

A method of orienting microphase-separated domains is disclosed, comprising applying a composition comprising an orientation control component, and a block copolymer assembly component comprising a block copolymer having at least two microphase-separated domains in which the orientation control component is substantially immiscible with the block copolymer assembly component upon forming a film; and forming a compositionally vertically segregated film on the surface of the substrate from the composition. The orientation control component and block copolymer segregate during film forming to form the compositionally vertically-segregated film on the surface of a substrate, where the orientation control component is enriched adjacent to the surface of the compositionally segregated film adjacent to the surface of the substrate, and the block copolymer assembly is enriched at an air-surface interface. 1. A composition comprising:a block copolymer assembly component comprising a diblock copolymer or triblock copolymer of styrene and methyl methacrylate;an orientation control component; anda solvent in which both the orientation control component and block copolymer assembly component are soluble;wherein the orientation control component is configured to segregate from the block copolymer assembly component upon forming a film from the composition and become enriched at the surface of the substrate and induce the block copolymer domains to orient perpendicular to a plane of the substrate to form an oriented domain pattern.2. The composition of claim 1 , wherein the block copolymer assembly component is a PS-b-PMMA block copolymer.3. The composition of claim 1 , wherein the orientation control component is an epoxy-containing polymer comprising a repeat unit derived from a (meth)acrylate monomer having a Cepoxy-containing group claim 1 , a Cepoxy-containing olefinic monomer claim 1 , or a combination comprising at least one of the foregoing epoxy-containing monomers.4. The ...

WATER SWELLABLE RUBBER COMPOSITION HAVING STABLE SWELLING PROPERTY AT HIGH TEMPERATURES

A water swellable rubber composition comprising (a) a non-water swellable base rubber, (b) an ethylene oxide based hydrophilic elastomer having from zero up to and including 20 mole % of a crosslinkable curable functional group, and (c) a water swellable non-elastomeric material. The composition has excellent water swell characteristics under prolonged exposure to high temperature and various electrolyte solutions (strongly saline as well as acid conditions) and is particularly suitable for oil field applications. When the ethylene oxide based hydrophilic elastomer (b) has from zero to less than 5 mole % of crosslinkable functional group, the amount of (b) is between about 30 parts and 300 parts by weight based on 100 parts by weight of the base rubber (a) and the amount of (c) is between about 20 parts and 200 parts by weight based on 100 parts by weight of the base rubber (a), the composition is characterized by good shape retention after undergoing constrained swell, as well as a high degree of constrained swell at elevated temperatures in different saline concentrations. 1. A water swellable rubber composition comprising:(a) a non-water swellable base rubber,(b) an ethylene oxide based hydrophilic elastomer having from zero up to and including 20 mole % of a crosslinkable curable functional group, and(c) a water swellable non-elastomeric material, 100 phr of the base rubber (a),', '10-200 phr of the ethylene oxide based hydrophilic elastomer (b), and', '50-200 phr of the water swellable non-elastomeric material (c),', 'when the elastomer (b) has at least 65 mole % of ethylene oxide, and from 0.1 mole % up to and including 20 mole % of a crosslinkable curable functional group, and, 'wherein the composition comprises'} 100 phr of the base rubber (a),', '30-300 phr of the ethylene oxide based hydrophilic elastomer (b), and', '20-200 phr of the water-swellable non-elastomeric material (c),', 'when the elastomer (b) has from zero to less than 5 mole % of a ...

EPOXY RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE

The present invention provides an epoxy resin composition for sealing that demonstrates favorable adhesion to a copper lead frame in which oxidation has progressed and has superior mold release and continuous moldability. The epoxy resin composition for sealing includes (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) a curing accelerator. The curing accelerator (D) has an average particle diameter of 10 μm or less, and the ratio of particles having a particle diameter in excess of 20 μm is 1% by weight or less. Also, the curing accelerator (D) includes at least one type of curing accelerator selected from the group consisting of a phosphobetaine compound having a specific structure; adduct of a phosphine compound having a specific structure, and quinone compound; and an adduct of a phosphonium compound having a specific structure, and a silane compound. An electronic component device in which an electronic component is sealed by a cured product of the aforementioned epoxy resin composition for sealing is provided. 2. The epoxy resin composition for sealing according to claim 1 , wherein adhesive strength with oxidized copper as determined in the measurement experiment described below is 14 N or more.{'sup': '2', 'After integrally molding an oxidized copper base material, in which oxidization of the surface has progressed as a result of subjecting to heat treatment in air at 220° C. for 120 seconds, and the tableted epoxy resin composition under conditions of 175° C. and 6.9 MPa for 2 minutes to obtain a molded product in the shape of a circular truncated cone (measuring 3 mm in upper diameter×3.6 mm in lower diameter×3 mm thick, contact surface area between oxidized copper base material and resin cured product: 10 mm) on the oxidized copper base material (diameter: 3.6 mm, thickness: 0.5 mm), the cured site of the epoxy resin composition was pressed from the horizontal direction followed by ...

CURABLE COMPOSITION

Provided is a curable composition that has low modulus, high elongation and low viscosity, and can be used for building sealing materials. This curable composition includes: an organic polymer (A) containing on average at least 1.4 reactive silyl groups per molecule; and an organic polymer (B) containing on average less than one reactive silyl group per molecule, wherein the number average molecular weight of component (B) is lower than the number average molecular weight of component (A) by at least 3,000, and the ratio (y)/(x) of the number of moles (y) of organic polymers containing only one reactive silyl group per molecule among components (A) and (B) to the number of moles (x) of organic polymers containing at least 2 reactive silyl groups per molecule among components (A) and (B) is not more than 5. 1. A curable composition , comprising:an organic polymer (A) containing on average at least 1.4 reactive silyl groups per molecule; andan organic polymer (B) containing on average less than 1 reactive silyl group per molecule,wherein the number average molecular weight of component (B) is lower than the number average molecular weight of component (A) by at least 3,000, andthe ratio (y)/(x) of the number of moles (y) of organic polymers each containing only one reactive silyl group per molecule among components (A) and (B) to the number of moles (x) of organic polymers each containing at least 2 reactive silyl groups per molecule among components (A) and (B) is not more than 5.2. The curable composition according to claim 1 ,wherein the number average molecular weight of component (B) is at least 2,000.3. The curable composition according to claim 1 ,wherein the organic polymer (A) has a linear structure.4. The curable composition according to claim 1 ,wherein the backbones of components (A) and (B) are each at least one selected from a polyoxyalkylene polymer, a poly(meth)acrylic polymer and a hydrocarbon polymer.5. The curable composition according to claim 1 , ...

CYANATE ESTER COMPOUND, CURABLE RESIN COMPOSITION CONTAINING CYANATE ESTER COMPOUND, AND CURED PRODUCT THEREOF

There is provided a novel dicyanatophenyl-based difunctional cyanate ester which is in a liquid form at ordinary temperature and can obtain a cured product having an excellent low thermal expansion rate. There is disclosed a cyanate ester compound represented by the following formula (I): 2. The cyanate ester compound according to claim 1 , wherein the compound of the formula (I) is 1 claim 1 ,1-bis(4-cyanatophenyl)isobutane.3. A curable resin composition comprising a cyanate ester compound (A) according to .4. The curable resin composition according to claim 3 , wherein the curable resin composition is a non-crystalline liquid at 50° C.6. The curable resin composition according to claim 5 , wherein the epoxy resin is one or more selected from the group consisting of a bisphenol A-based epoxy resin claim 5 , a bisphenol F-based epoxy resin claim 5 , a phenol novolac-based epoxy resin claim 5 , and a dihydroxy naphthalene-based epoxy resin.8. The curable resin composition according to claim 5 , wherein the curable resin composition comprises 0 to 250 parts by mass of the cyanate ester compound (B) claim 5 , 0 to 250 parts by mass of the epoxy resin (C) claim 5 , and 0 to 100 parts by mass of the maleimide compound (D) claim 5 , based on 100 parts by mass of the cyanate ester compound (A).9. The curable resin composition according to claim 8 , wherein the curable resin composition comprises 0 to 100 parts by mass of the cyanate ester compound (B) claim 8 , 0 to 100 parts by mass of the epoxy resin (C) claim 8 , and 0 to 50 parts by mass of the maleimide compound (D) claim 8 , based on 100 parts by mass of the cyanate ester compound (A).10. The curable resin composition according to claim 3 , wherein the curable resin composition comprises a metal complex compound containing zinc as a polymerization catalyst.11. A cured product obtained by curing the curable resin composition according to .12. A sealing material comprising the curable resin composition according to .13 ...

EPOXY RESIN, EPOXY RESIN COMPOUND COMPRISING THE SAME, AND RADIANT HEAT CIRCUIT BOARD USING THE COMPOUND

An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided. 4. The epoxy resin compound of claim 1 , wherein the inorganic filler is included in 40 wt % to 97 wt % with respect to a total weight of the epoxy resin compound.5. The epoxy resin compound of claim 1 , wherein the inorganic filler includes at least one of alumina claim 1 , boron nitride claim 1 , aluminum nitride claim 1 , crystalline silica and silicon nitride.6. The epoxy resin compound of claim 1 , wherein the epoxy resin is included in 3 wt % to 60 wt % with respect to a total weight of the epoxy resin compound.7. The epoxy resin compound of claim 1 , wherein the epoxy resin further comprises at least one non-crystalline epoxy resin.9. The epoxy resin compound of claim 1 , wherein the epoxy resin represented by Chemical Formula 1 is included in 12 wt % or more with respect to the whole epoxy resin.10. A radiant heat circuit board comprising:a metal plate;an insulating layer formed on the metal plate; anda circuit pattern formed on the insulating layer,{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'wherein the insulating layer is formed by hardening the epoxy resin compound of .'}11. The radiant heat circuit board of claim 10 , wherein the inorganic filler is included in 40 wt % to 97 wt % with respect to a total weight of the epoxy resin compound.12. The radiant heat circuit board of claim 11 , wherein the inorganic filler includes at least one of alumina claim 11 , boron nitride claim 11 , aluminum nitride claim 11 , crystalline silica and silicon nitride.13. The radiant heat ...

Cross-linked polymer particle for epoxy resin, epoxy resin composition, and epoxy cured material

The invention discloses a cross-linked polymer particle for an epoxy resin, an epoxy resin composition containing the cross-linked polymer particle, the epoxy resin and a curing agent, and an epoxy cured material having qualities of colorless transparency and crack resistance as a result of curing the resin composition. The cross-linked polymer particle for the epoxy resin contains a (meth)acrylate monomer unit and a crosslinking monomer unit, wherein a volume average primary particle diameter is 0.5 to 10 μm, and a glass transition temperature of the monomer components excluding the crosslinking monomer is 30° C. or more by FOX formula calculation, and the refractivity at 23° C. is 1.490 to 1.510.

Thermosetting Compositions Containing Isocyanurate Ring

The invention relates to thermosetting compositions containing isocyanurate ring(s) prepared through chain extension of an epoxy resin (a) with carboxyl-functional oligomers (b), which are the reaction product of polyols (i) containing one or more isocyanurate ring(s) and polycarboxylic acids or their anhydrides (ii). The polyols (i) containing one or more isocyanurate ring(s) can be prepared from the reactions of tris (2-hydroxyalkyl) isocyanurates with a modifier from a caprolactone or alkylene oxide, or glycidyl ester or glycidyl ether and mixtures thereof. The epoxy-functional thermosetting compositions containing an isocyanurate ring(s) can be further reacted with unsaturated acids, preferably (meth)acrylic acid, to obtain a curable polyacrylate. Both epoxy-functional isocyanurate and acrylate-functional isocyanurate thermosetting compositions can be further modified with a polyisocyanate to produce a composition that is useful as a reactive adhesive, binder or in other applications. 1. An epoxy-functional thermosetting composition containing isocyanurate ring(s) , comprising the reaction product of:(a) a polyepoxide containing at least two epoxide groups per molecule; (i) a polyol containing isocyanurate ring(s) comprising the reaction product of a tris (2-hydroxyalkyl) isocyanurate or derivative thereof with a modifier selected from the group consisting of caprolactones, alkylene oxides, glycidyl esters, glycidyl ethers, and mixtures therefor, and', '(ii) one or more polycarboxylic acids or acid anhydrides thereof; and, '(b) a carboxyl functional oligomer comprising the reaction product of an equivalent quantity of(c) an unsaturated carboxylic acid; whereinthe molar ratio of epoxy functional groups in component (a) to acid functional groups in component (b) is greater than 1.0, and both epoxy and unsaturated groups are present.2. The composition according to claim 1 , wherein the molar ratio of epoxy functional groups to acid functional groups is greater than ...

RESIN COMPOSITION FOR EXPANSION MOLDING

The present invention provides a resin composition for foam molding which can achieve high expansion ratio and can significantly improve tactile impression and vibration damping properties of the foam molding to be obtained. 1. A resin composition for foam molding comprising:a thermally expandable microcapsule that includes a shell containing an epoxy resin and a core agent that is a volatile expansion agent encapsulated by the shell;a thermoplastic resin; anda curable compound having two or more functional groups each selected from the group consisting of a carboxy group, a hydroxy group, an amino group, an amido group, and an acid anhydride group in each molecule.2. The resin composition for foam molding according to obtainable by mixing: a thermally expandable microcapsule that includes a shell containing an epoxy resin and a core agent that is a volatile expansion agent encapsulated by the shell,', 'a thermoplastic resin as a matrix, and', 'a curable compound having two or more functional groups each selected from the group consisting of a carboxy group, a hydroxy group, an amino group, an amido group, and an acid anhydride group in each molecule; and, 'a foamable masterbatch containinga thermoplastic resin for molding.3. The resin composition for foam molding according to obtainable by mixing: a thermally expandable microcapsule that includes a shell containing an epoxy resin and a core agent that is a volatile expansion agent encapsulated by the shell, and', 'a thermoplastic resin as a matrix;, 'a foamable masterbatch containinga curable compound having two or more functional groups each selected from the group consisting of a carboxy group, a hydroxy group, an amino group, an amido group, and an acid anhydride group in each molecule; anda thermoplastic resin for molding.4. A resin composition for foam molding claim 1 , comprising:a thermally expandable microcapsule that includes a shell containing a curable compound having at least one functional group ...

Epoxy resin composition, and prepreg and printed circuit board usng the same

Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic anhydride as a curing agent; (C) a curing accelerator; (D) an optional silane dispersing agent; (E) an optional phosphorous-containing flame retardant; (F) an optional toughening agent; and (G) an optional inorganic filler.

HALOGEN-FREE RESIN COMPOSITION

A halogen-free resin composition includes 100 parts by weight of epoxy resin; 10 to 100 parts by weight of benzoxazine resin; 10 to 100 parts by weight of styrene-maleic anhydride copolymer; and 10 to 90 parts by weight of dicyclopentadiene phenol novolac resin. The halogen-free resin composition features specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dielectric dissipation factor, high heat resistance and high non-flammability and produce prepregs or resin film, and is thus applicable to copper clad laminates and printed circuit boards. 1. A halogen-free resin composition , comprising:(A) 100 parts by weight of epoxy resin;(B) 10 to 100 parts by weight of benzoxazine resin;(C) 10 to 100 parts by weight of styrene-maleic anhydride copolymer; and(D) 10 to 90 parts by weight of dicyclopentadiene phenol novolac resin2. The composition of claim 1 , wherein the epoxy resin is at least one selected from the group consisting of bisphenol A epoxy resin claim 1 , bisphenol F epoxy resin claim 1 , bisphenol S epoxy resin claim 1 , bisphenol AD epoxy resin claim 1 , phenol novolac epoxy resin claim 1 , bisphenol A phenol novolac epoxy resin claim 1 , bisphenol F phenol novolac epoxy resin claim 1 , o-cresol novolac epoxy resin claim 1 , trifunctional epoxy resin claim 1 , tetrafunctional epoxy resin claim 1 , multifunctional epoxy resin claim 1 , dicyclopentadiene (DCPD) epoxy resin claim 1 , phosphorus-containing epoxy resin claim 1 , DOPO-containing epoxy resin claim 1 , DOPO-HQ epoxy resin claim 1 , p-xylene epoxy resin claim 1 , naphthalene epoxy resin claim 1 , benzopyran epoxy resin claim 1 , diphenyl phenol novolac epoxy resin claim 1 , isocyanate modified epoxy resin claim 1 , phenol benzaldehyde epoxy resin claim 1 , and phenol aralkyl novolac epoxy resin.3. The composition of claim 1 , wherein the benzoxazine resin is at least one selected from the group consisting of bisphenol A benzoxazine resin claim 1 , bisphenol B ...

EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL

The present invention relates to an epoxy resin composition which comprises a phosphorus-containing modified epoxy resin (A) consisting of a compound (a) represented by Formula (a); a novolak epoxy resin (B); a hardener (C) for epoxy resins; and a metal hydroxide (D), wherein the content in mass % of the phosphorus-containing modified epoxy resin (A), C, and the content in mass % of the metal hydroxide (D), C, relative to the total amount of the epoxy resin composition, satisfy the following Formulas (1), (2), and (3): (1) 2.5C+C≧5; (2) 6≦C≦40; and (3) 3≦C≦30. This epoxy resin composition can give a composite material which has excellent flame retardancy even when neither a halogenated flame retardant, nor red phosphorus, nor a phosphoric acid ester is contained therein. According to the invention, it is also possible to provide a prepreg and a fiber-reinforced composite material obtained using the prepreg. 2. The epoxy resin composition according to claim 1 , further comprising a trisphenolmethane epoxy resin (E).3. The epoxy resin composition according to claim 1 , wherein the metal hydroxide (D) is an aluminum hydroxide.4. A prepreg obtained by impregnating the epoxy resin composition according to into reinforcement fibers.5. The prepreg according to claim 4 , wherein the epoxy resin composition further comprises a trisphenolmethane epoxy resin (E).6. The prepreg according to claim 4 , wherein the metal hydroxide (D) is an aluminum hydroxide.7. The prepreg according to claim 6 , wherein the median particle size of the aluminum hydroxide is no more than the diameter of the reinforcement fiber.8. A fiber-reinforced composite material obtained by curing the prepreg according to .9. A prepreg obtained by impregnating an epoxy resin composition containing a phosphorus compound and an aluminum hydroxide into reinforcement fibers claim 4 , wherein the median particle size of the aluminum hydroxide is no more than the diameter of the reinforcement fiber.10. A fiber- ...

Geopolymer and epoxy simultaneous interpenetrating polymer network composition, and methods for the same

A simultaneous interpenetrating polymer network—geopolymer epoxy composition includes a first component comprised of a waterborne epoxy curing agent and an alkaline silicate solution, and a second component comprised of an epoxy resin and an aluminosilicate. The two components are mixed to produce a SIN-GE composition that cures at ambient temperatures. The SIN-GE composition may be a low-viscosity, sprayable composition, or may be a higher-viscosity composition. The compositions may be used as coatings, adhesives, mortars, casting materials, and the like.

Ultrafine Poly(phenylene ether) Particles and Compositions Derived Therefrom

Disclosed are compositions comprising: 2. The composition of claim 1 , further comprising a hardener.3. The composition of claim 1 , wherein the poly(phenylene ether) is poly(2 claim 1 ,6-dimethyl-1 claim 1 ,4-phenylene ether) having an intrinsic viscosity of between 0.30 deciliters to 1.5 deciliters per gram claim 1 , measured in chloroform at 25° C.4. The composition of claim 1 , comprising ultrafine particles of poly(phenylene ether) having a mean particle size of 3.8 microns to 8.4 microns.5. The composition of claim 1 , comprising ultrafine particles of poly(phenylene ether) of having a mean particle size of 6 microns.6. The composition of claim 1 , comprising ultrafine particles of poly(phenylene ether) claim 1 , wherein 90 percent of the particle volume distribution of the ultrafine particulate poly(phenylene ether) is below 8 microns.7. The composition of claim 1 , comprising(a) 10 to 40 percent by weight of the ultrafine particulate poly(phenylene ether);(b) 30 to 80 percent by weight of an epoxy resin; and(c) 1 to 30 percent by weight of a hardener.8. The composition of claim 1 , comprising:(a) 15 to 35 percent by weight of the ultrafine particulate poly(phenylene ether);(b) 30 to 80 percent by weight of DGEBPA; and(c) 5 to 25 percent by weight of MDA; wherein the impact strength of the composition is greater than or equal to 500 J/m as measured by ASTM D4812.9. A process for preparing a composition comprising:(a) 15 to 35 percent by weight of the ultrafine particulate poly(phenylene ether), wherein the mean particle size of the poly(phenylene ether) is 6 to 40 microns;(b) 40 to 70 percent by weight of an epoxy resin; and (i) combining the poly(phenylene ether) and epoxy resin at ambient temperature to form a mixture;', '(ii) adding the hardener to the mixture of (i);', '(iii) heating the mixture of (ii) from ambient to 200° C., '(c) 5 to 25 percent by weight of a hardener; comprising the steps of10. The process of claim 9 , further comprising blending the ...

Hardener for epoxy resin systems and use thereof

A hardener system for epoxy resins comprising i) at least one aromatic dianhydride compound A having a melting point of at least 35° C., ii) at least one monoanhydride compound B having a melting point of not more than 30° C. and iii) at least one catalyst C, is provided. The aromatic dianhydride compound A is dispersed in the hardener system. The present invention further provides for the use of said hardener systems and to processes for hardening epoxy resin systems.

THERMALLY CURABLE RESIN COMPOSITION WITH GOOD COATABILITY AND RE-COATABILITY

The present invention relates to a thermally curable binder resin including an epoxy group-containing ethylenic unsaturated monomer and an aqueous monomer including an ethylene oxide group; or an epoxy group-containing ethylenic unsaturated monomer, a compound including an acidic component, and an aqueous monomer including an ethylene oxide group, a thermally curable resin composition including the same, a cured film prepared therefrom, a color filter, and a liquid crystal display device. The thermally curable binder resin of the present invention may significantly enhance the coatability of a cured film forming composition and increase the surface energy of a coated protective film to significantly enhance the recoating properties in subsequent processes after formation of the protective film. 1. A thermally curable binder resin , comprising as components:an epoxy group-containing ethylenic unsaturated monomer; andan aqueous monomer including an ethylene oxide group.2. The resin of claim 1 , wherein the thermally curable binder resin further comprises a compound including an acidic component.4. The resin of claim 2 , wherein the compound including an acidic component is one or more selected from the group consisting of an unsaturated carboxylic acid claim 2 , an unsaturated carboxylic acid anhydride claim 2 , and an ethylenic unsaturated monomer including a latent acid group.5. The resin of claim 4 , wherein the ethylenic unsaturated monomer including a latent acid group is a compound which is decomposed in a range of 150° C. to 250° C. to produce an acid.7. The resin of claim 4 , wherein the unsaturated carboxylic acid or unsaturated carboxylic acid anhydride is one or more selected from the group consisting of (meth)acrylic acid claim 4 , crotonic acid claim 4 , itaconic acid claim 4 , maleic acid claim 4 , fumaric acid claim 4 , monomethyl maleic acid claim 4 , isoprene sulfonic acid claim 4 , styrene sulfonic acid claim 4 , 5-norbornene-2-carboxylic acid claim ...

POLYMERIC FORMULATIONS WITH CHEMICALLY ADJUSTABLE RHEOLOGY FOR THE MANUFACTURE OF PREPREGS AND ARTICLES MADE OF COMPOSITE MATERIAL

A polymeric formulation comprising at least one first epoxy resin having a density between 100 and 10,000 Pa·s, a blocked isocyanate, a polymer comprising hydroxy functional groups, a thermoplastic resin and a cross-linking agent, the polymer comprising hydroxyl functional groups with a hydroxyl content in the range 0.65 to 0.95 meq/g, the isocyanate-equivalents-to-polymer-OH-equivalents rate being in the range 0.60 to 1.1. The first epoxy resin is substantially semisolid at room temperature, the formulation comprising at least one second epoxy resin substantially liquid at room temperature, the first and second epoxy resins being present in a weight ratio from 60:40 to 80:20. These formulations are advantageously used for manufacturing prepregs and articles of composite material according to a dry winding process. By virtue of improved stability, a higher glass transition temperature, and a rheological profile result which can be chemically tailored to the needs of the impregnation/dry winding process. 112-. (canceled)13. A polymeric formulation comprising at least one first epoxy resin having a viscosity in the range between 100 and 10 ,000 Pa·s , a blocked isocyanate , a polymer comprising hydroxyl functional groups and a latent cross-linking agent , characterised in that the polymer comprising hydroxyl functional groups has a hydroxyl content in the range 0.65 to 0.95 meq/g , the isocyanate-equivalents-to-polymer-OH-equivalents rate being in the range 0.60 to 1.1.14. The polymeric formulation of claim 13 , wherein the polymer comprising hydroxyl functional groups has a hydroxyl content in the range 0.70 to 0.92 meq/g.15. The polymeric formulation of claim 13 , wherein the isocyanate-equivalents-to-polymer-OH-equivalents rate is in the range 0.70 to 1.0.16. The polymeric formulation according to claim 13 , wherein said first epoxy resin is a substantially semisolid resin at room temperature claim 13 , the formulation comprising at least a second epoxy resin ...

OLIGOMERIC PHOSPHONATES AND COMPOSITIONS INCLUDING THE SAME

Disclosed are oligomeric phosphonates including oligophosphonates, random or block co-oligo(phosphonate ester)s and co-oligo(phosphonate carbonate)s produced using a condensation process terminated with hydroxyl, epoxy, vinyl, vinyl ester, isopropenyl, isocyanate groups, and the like. These materials can be used as a reactive additive to other polymers, oligomers or monomer mixtures to impart flame resistance without diminishing melt processability which is important in the fabrication of polymers for many applications. 1. A composition comprising oligomeric phosphonates having a total number of termini with reactive end groups of from about 80% to 100% , wherein the each reactive end group is independently selected from hydroxyl , epoxy , vinyl , vinyl ester , isopropenyl , isocyanate , and combinations thereof.2. The composition of claim 1 , wherein each reactive end-group is hydroxyl.3. The composition of claim 1 , wherein the oligomeric phosphonates comprise an oligophosphonate claim 1 , random co-oligo(phosphonate ester) claim 1 , block co-oligo(phosphonate ester) claim 1 , random co-oligo(phosphonate carbonate) claim 1 , or block co-oligo(phosphonate carbonate).4. The composition of claim 1 , wherein the oligomeric phosphonates comprise linear oligomeric phosphonates claim 1 , branched oligomeric phosphonates claim 1 , or a combination thereof.5. The composition of claim 1 , wherein the oligomeric phosphonates comprise a number averaged molecular weight of from about 500 g/mole to about 5000 g/mole.6. The composition of claim 1 , wherein the oligomeric phosphonates comprise units derived from bisphenol.8. The composition of claim 7 , wherein —O—Ar—O— is derived from resorcinol claim 7 , hydroquinone claim 7 , bisphenol A claim 7 , bisphenol F claim 7 , and 4 claim 7 ,4′-biphenol claim 7 , phenolphthalein claim 7 , 4 claim 7 ,4′-thiodiphenol claim 7 , 4 claim 7 ,4′-sulfonyldiphenol claim 7 , 1 claim 7 ,1-bis(4-hydroxyphenyl)-3 claim 7 ,3 claim 7 ,5-trimethyl- ...

Epoxy Resin Composition

The present technology is an epoxy resin composition containing an epoxy resin (A), a urethane resin (B) in which the terminal isocyanate of the urethane prepolymer is blocked by at least one of an ε-polycaprolactam, an oxime, or a pyrazole, and in which bisphenol A is included in the backbone of the aforementioned urethane prepolymer, and a curing agent (C). 1. An epoxy resin composition comprising: an epoxy resin (A) ,a urethane resin (B) in which the terminal isocyanate of the urethane prepolymer is blocked by at least one of an ε-polycaprolactam, an oxime, or a pyrazole, and in which bisphenol A is included in the backbone of the urethane prepolymer, anda curing agent (C).2. The epoxy resin composition according to claim 1 , wherein the urethane resin (B) is obtained by reacting one or more polyol compounds selected from the group consisting of a poly(tetramethylene glycol) and a polycarbonate polyol with one or more isocyanate compounds selected from the group consisting of hexamethylene diisocyanate and isophorone diisocyanate.3. The epoxy resin composition according to claim 2 , wherein a content of the bisphenol A is such that a molar ratio of the number of moles of hydroxy groups in the polyol and the number of moles of hydroxy groups in the bisphenol A ((polyol-OH)/(BisA-OH)) is not lower than 1/0.1 and not higher than 1/3.0.4. The epoxy resin composition according to claim 3 , wherein a content of the urethane resin (B) is not less than 10 parts by mass and not more than 80 parts by mass per 100 parts by mass of the epoxy resin (A).5. The epoxy resin composition according to claim 4 , comprising a rubber-modified epoxy resin (D).6. The epoxy resin composition according to claim 2 , wherein a content of the urethane resin (B) is not less than 10 parts by mass and not more than 80 parts by mass per 100 parts by mass of the epoxy resin (A).7. The epoxy resin composition according to claim 2 , comprising a rubber-modified epoxy resin (D).8. The epoxy resin ...

EPOXYBENZYL-TERMINATED POLY(ARYLENE ETHER)S, METHOD FOR PREPARATION THEREOF, AND CURABLE COMPOSITIONS COMPRISING SAME

An epoxybenzyl-terminated poly(arylene ether) has the structure R—W—R wherein W is a divalent poly(arylene ether) residue terminated with phenolic oxygen atoms, and R is an epoxybenzyl group, wherein each occurrence of R is the same or different. The epoxybenzyl-terminated poly(arylene ether) is formed by reacting a peroxide-containing reagent with a vinybenzyl-terminated poly(arylene ether). Also disclosed is a curable composition including the epoxybenzyl-terminated poly(arylene ether)s, a curing promoter, and, optionally, an auxiliary epoxy resin. The curable composition is useful for the preparation of composites, and in particular, composites used in manufacturing printed circuit boards. 4. The curable composition of claim 1 , wherein the curing promoter comprises a hardener selected form the group consisting of amines claim 1 , dicyandiamide claim 1 , polyamides claim 1 , amidoamines claim 1 , Mannich bases claim 1 , anhydrides claim 1 , phenol-formaldehyde resins claim 1 , carboxylic acid functional polyesters claim 1 , polysulfides claim 1 , polymercaptans claim 1 , isocyanates claim 1 , cyanate esters claim 1 , and combinations thereof.5. The curable composition of claim 1 , wherein the curing promoter comprises an amine hardener claim 1 , and wherein the poly(arylene ether) and the curing promoter provide a ratio of total epoxy equivalents to total amine equivalents of about 1:1 to about 1.3:1.6. The curable composition of claim 1 , wherein the curing promoter comprises a hardener selected from the group consisting of m-phenylenediamine claim 1 , 4 claim 1 ,4′-diaminodiphenylmethane claim 1 , and combinations thereof.7. The curable composition of claim 1 , further comprising an auxiliary epoxy resin.8. The curable composition of claim 7 , wherein the auxiliary epoxy resin is selected from the group consisting of aliphatic epoxy resins claim 7 , cycloaliphatic epoxy resins claim 7 , bisphenol A epoxy resins claim 7 , bisphenol-F epoxy resins claim 7 , ...

RESIN COMPOSITION FOR THERMAL RADIATION BOARD AND THERMAL RADIATION BOARD COMPRISING THE SAME

There is provided a resin composition for a thermal radiation board including: 20 wt % to 50 wt % of a liquid crystal oligomer represented by particular Chemical Formulas; 10 wt % to 40 wt % of an epoxy resin; and 10 wt % to 40 wt % of an inorganic filter. 2. The resin composition for a thermal radiation board of claim 1 , wherein the epoxy resin is a phenol-based glycidyl ether epoxy resin such as a phenol novolak epoxy resin claim 1 , a cresol novolak epoxy resin claim 1 , naphtol-modified novolak epoxy resin claim 1 , a bisphenol A type epoxy resin claim 1 , a bisphenol F type epoxy resin claim 1 , a biphenyl epoxy resin claim 1 , triphenyl epoxy resin claim 1 , and the like; a dicyclopentadiene epoxy resin having a dicyclopentadiene frame; a naphthalene epoxy having a naphthalene frame; a dihydroxybenzopyran epoxy resin; a glycidylamine epoxy resin using a polyamine such as diaminophenylmethane claim 1 , or the like claim 1 , as a raw material; a triphenolmethane epoxy resin; a tetraphenylethane epoxy resin; or a mixture thereof.3. The resin composition for a thermal radiation board of claim 1 , wherein the epoxy resin is N claim 1 ,N claim 1 ,N′ claim 1 ,N′-Tetraglycidyl-4 claim 1 ,4′-methylenebisbenzenamine.4. The resin composition for a thermal radiation board of claim 1 , wherein the inorganic filler is one or more of natural silica claim 1 , fused silica claim 1 , amorphous silica claim 1 , hollow silica claim 1 , aluminum hydroxide claim 1 , beohmite claim 1 , magnesium hydroxide claim 1 , molybdenum oxide claim 1 , zinc molybdate claim 1 , zinc borate claim 1 , zincstannate claim 1 , aluminum borate claim 1 , potassium titanate claim 1 , magnesium sulfate claim 1 , silicon carbide claim 1 , zinc oxide claim 1 , silicon nitride claim 1 , silicon oxide claim 1 , aluminum titanate claim 1 , barium titanate claim 1 , barium strontium titanate claim 1 , aluminum oxide claim 1 , alumina claim 1 , clay claim 1 , kaolin claim 1 , talc claim 1 , calcinated clay ...

THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND CIRCUIT BOARD

Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D) of 1 to 15 μm; (B) aluminum oxide particles having an average particle size (D) of 1.5 μm or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%. 1. A thermosetting resin composition , containing 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler ,{'sub': 50', '50, 'wherein the inorganic filler contains: (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D) of 1 to 15 μm; (B) aluminum oxide particles having an average particle size (D) of 1.5 μm or less; and (C) a molybdenum compound, and'}blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%.2. The thermosetting resin composition according to claim 1 , further containing claim 1 , as an inorganic filler claim 1 , (D) boehmite particles having an average particle size (D) of 0.1 to 3 μm claim 1 ,wherein blending ratios (by volume) of the component (A), the component (B), the component (C) and the component (D) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 30%, ...

THERMOSET/SUPRAMOLECULAR HYBRID COMPOSITES AND RESINS THAT CAN BE HOT-FORMED AND RECYCLED

Thermoset/supramolecular hybrid composites and resins, resulting from bringing at least one thermosetting resin precursor, this thermosetting resin precursor comprising hydroxyl functions and/or epoxy groups, and optionally ester functions, into contact with at least one hardener chosen from carboxylic acids and acid anhydrides, and with at least one compound comprising, on the one hand, at least one associative group, and on the other hand at least one function enabling the grafting thereof to the thermosetting resin precursor, to the hardener or to the product resulting from the reaction of the thermosetting resin precursor and the hardener, in the presence of at least one transesterification catalyst. Process for manufacturing these materials, process for transforming and process for recycling these materials. Novel solid forms of hybrid composites and resins which can be used in the implementation of these processes. 1. A resin composition resulting from bringing:at least one thermosetting resin precursor, this thermosetting resin precursor comprising hydroxyl functions and/or epoxy groups, and optionally ester functions,into contact with at least one hardener chosen from carboxylic acids and acid anhydrides,andwith at least one compound comprising, on the one hand, at least one associative group and, on the other hand, at least one function allowing the grafting thereof to the thermosetting resin precursor, to the hardener or to the product resulting from the reaction of the thermosetting resin precursor and of the hardener,in the presence of at least one transesterification catalyst.2. The composition as claimed in claim 1 , wherein the transesterification catalyst is present in a total molar amount ranging from 1% to 25% of the total molar amount of hydroxyl and epoxy that are contained in the thermosetting resin precursor.3. The composition as claimed in claim 1 , wherein the thermosetting resin precursor is an epoxy resin precursor.4. The composition as ...

PHOTO-CURABLE RESIN COMPOSITION

The invention relates to a radiation curable composition comprising from about 50 wt % to about 70 wt % of a cycloaliphatic diepoxide, from about 5 wt % to about 15 wt % of a polyol, from about 5 wt % to about 15 wt % of an oxetane, from about 10 wt % to about 20 wt % of an aromatic diacrylate, a radical photoinitiator and a cationic photoinitiator. The invention further relates to a process for making a three dimensional article from the resin composition of the invention, to the three-dimensional article itself and to the use of the composition of the invention. 119.-. (canceled)20. A radiation curable composition comprising:a. from about 50 wt % to about 70 wt % of a cycloaliphatic diepoxide;b. from about 5 wt % to about 15 wt % of a polyol;c. from about 5 wt % to about 15 wt % of an oxetane;d. from about 10 wt % to about 20 wt % of an aromatic diacrylate;e. a radical photoinitiator; andf. a cationic photoinitiator.wherein the tensile strength of the cured composition, measured 1 week after UV post-cure in a post-curing apparatus, is from about 40 MPa to about 75 MPa.21. The radiation curable composition according to claim 20 , wherein the composition comprisesa. from about 50 wt % to about 60 wt % of a cycloaliphatic diepoxide;b. from about 10 wt % to about 15 wt % of a polyol;c. from about 7 wt % to about 10 wt % of an oxetane; andd. from about 10 wt % to about 20 wt % of an aromatic diacrylate.22. The radiation curable composition according to claim 20 , wherein the cycloaliphatic diepoxide is chosen from the group consisting of 3 claim 20 ,4-epoxycyclohexylmethyl-3 claim 20 ,4-epoxycyclohexanecarboxylate claim 20 , 3 claim 20 ,4-epoxy-6-methylcyclohexylmethyl-3 claim 20 ,4-epoxy-6-methylcyclohexanecarboxylate claim 20 , di(3 claim 20 ,4-epoxycyclohexylmethyl)hexanedioate claim 20 , di(3 claim 20 ,4-epoxy-6-methylcyclohexylmethyl)hexanedioate claim 20 , ethylene bis(3 claim 20 ,4-epoxycyclohexanecarboxylate) claim 20 , ethanediol di(3 claim 20 ,4- ...

PRODUCTION METHOD OF RUBBER COMPOSITION

A method for producing a rubber composition which gives a cross-linked rubber which has a low volume resistivity value, which is low in hardness, and which is kept down in contamination of the photoconductor when used as a conductive member is provided, that is, a production method of a rubber composition comprising a step of mixing a polyether rubber which is dissolved in a solvent at 0.1 to 30 wt % of concentration and a liquid ethylenically unsaturated nitrile-conjugated diene copolymer rubber in a solution is provided. 1. A production method of a rubber composition comprising a step of mixing a polyether rubber which is dissolved in a solvent at 0.1 to 30 wt % of concentration and a liquid ethylenically unsaturated nitrile-conjugated diene copolymer rubber in a solution.2. The production method of a rubber composition as set forth in claim 1 , wherein claim 1 , in a rubber component which forms the rubber composition claim 1 , the ratio of said polyether rubber is 60 to 99 wt % and the ratio of said liquid ethylenically unsaturated nitrile-conjugated diene copolymer rubber is 40 to 1 wt %.3. The production method of a rubber composition as set forth in claim 1 , wherein said liquid ethylenically unsaturated nitrile-conjugated diene copolymer rubber is a liquid acrylonitrile-butadiene rubber.4. The production method of a rubber composition as set forth in claim 1 , wherein said polyether rubber contains ethylene oxide monomer units in an amount of 40 to 80 mol %.5. A rubber composion obtained by the production method as set forth in .6. A cross-linked rubber obtained by cross-linking the rubber composition as set forth in .7. A conductive member obtained by using the cross-linked rubber as set forth in . The present invention relates to a production method of a rubber composition, more particularly relates to a production method of a rubber composition which gives a cross-linked rubber which has a low volume resistivity value, which is low in hardness, and which ...

EPOXY RESIN COMPOSITIONS CONTAINING AN INTERNAL MOLD RELEASE AGENT

Alkoxylated hydrophobes that include a poly(alkylene oxide) chain of at least 5 oxyalkylene units having a terminal secondary hydroxyl group or a terminal Chydrocarbyl group are effective internal mold release agents for epoxy resin moldings. The alkoxylated hydrophobe, when mixed with an epoxy resin, forms a mixture that is highly stable when heated to 80 to 100° C. and held at that temperature for a period of as much as 22 days. 1. An epoxy resin mixture comprising at least one epoxy resin mixed with 0.2 to 5 parts by weight , per 100 parts by weight of the at least one epoxy resin , of one or more alkoxylated hydrophobes that include a poly(alkylene oxide) chain of at least 5 oxyalkylene units having i) a terminal hydroxyl group , provided that at least 50% of the hydroxyl groups provided by the one or more alkoxylated hydrophobes are secondary hydroxyl groups , or ii) a terminal Chydrocarbyl group , the poly(alkylene oxide) chain being bonded at one end through a linking group to a hydrophobe that includes an unsubstituted aliphatic hydrocarbyl group of at least 10 carbon atoms.2. The epoxy resin mixture of claim 1 , wherein the hydrophobe is a straight-chain alkyl group having 10 to 24 carbon atoms; a straight-chain mono- claim 1 , di- or tri-alkene having 10 to 24carbon atoms; or an alkyl- or alkenyl-substituted phenyl in which the alkyl or alkenyl group is a straight-chain group having 10 to 24 claim 1 , carbon atoms.3. The epoxy resin mixture of claim 1 , wherein the poly(alkylene oxide) chain is a poly(1 claim 1 ,2-propylene oxide) claim 1 , a block copolymer having an internal poly(ethylene oxide) block and a terminal poly(1 claim 1 ,2-propylene oxide) block claim 1 , a block copolymer having an internal poly(ethylene oxide) block and a terminal poly(1 claim 1 ,2-butylene oxide) block claim 1 , a block copolymer having a poly(1 claim 1 ,2-propylene oxide) block and a poly(1 claim 1 ,2-butylene oxide) block or a random copolymer of 1 claim 1 ,2-propylene ...

EPOXY COMPOUND, METHOD FOR PRODUCING THE SAME, EPOXY RESIN COMPOSITION, AND CURED PRODUCT THEREOF

The present invention provides an epoxy compound which is 2,2′,7,7′-tetraglycidyloxy-1,1′-binaphthalene. Also, the present invention provides a method for producing [1,1′-binaphthalene]-2,2′,7,7′-tetraol, the method including a step of bringing a crude product produced by dimerization reaction of naphthalene-2,7-diol or a naphthalene-2,7-diol derivative into contact with an aromatic solvent; a step of separating [1,1′-binaphthalene]-2,2′,7,7′-tetraol dissolved in the aromatic solvent from insoluble substances; and a step of removing the solvent from a solution of [1,1′-binaphthalene]-2,2′,7,7′-tetraol. The present invention also provides a method for producing an epoxy compound, the method including reacting [1,1′-binaphthalene]-2,2′,7,7′-tetraol or [1,1′-binaphthalene]-2,2′,7,7′-tetraol monohydrate with epihalohydrin. 1. An epoxy compound which is 2 ,2′ ,7 ,7′-tetraglycidyloxy-1 ,1′-binaphthalene.2. A method for producing an epoxy compound , the method comprising reacting [1 ,1′-binaphthalene]-2 ,2′ ,7 ,7′-tetraol or [1 ,1′-binaphthalene]-2 ,2′ ,7 ,7′-tetraol monohydrate with epihalohydrin.3. An epoxy compound produced by the method according to .4. An epoxy resin composition comprising the epoxy compound according to and a curing agent.5. A cured product produced by curing the epoxy resin composition according to .611.-. (canceled)12. An epoxy resin composition comprising the epoxy compound according to and a curing agent.13. A cured product produced by curing the epoxy resin composition according to . This application is a divisional application of U.S. Ser. No. 14/431,968 filed on Mar. 27, 2015, which claims the right of priority under 35 U.S.C. §119 based on Japanese Patent Application Nos. 2012-261035 filed on Nov. 29, 2012 and 2012-216516 filed on Sep. 28, 2012. The entire contents of these applications are incorporated herein by reference in their entirety.The present invention relates to an epoxy compound and a method for producing the compound which ...

EPOXY RESIN COMPOSITION, PREPREG, FIBER REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER REINFORCED PLASTIC MATERIAL

An embodiment relates to a resin composition containing a tetraglycidyl amine; a bisphenol epoxy; a dicyandiamide; and an aromatic urea; wherein the tetraglycidyl amine has a EEW of 110 g/eq to 140 g/eq and is an amount of 30 to 60 PHR per 100 PHR of total epoxy resin in the resin composition; wherein the resin composition has a Tg of at least 160° C. when cured at 143° C. for 3 min and also maintains a Tg of greater than 160° C. when cured at 177C for 1 min or longer. 1. A resin composition comprising:(a) a tetraglycidyl amine;(b) a first bisphenol epoxy;(c) a dicyandiamide; and(d) an aromatic urea;wherein the tetraglycidyl amine has a EEW of 110 g/eq to 140 g/eq and is an amount of 30 to 60 PHR per 100 PHR of total epoxy resin in the resin composition;wherein the resin composition has a Tg of at least 160° C. when cured at 143° C. for 3 min and also maintains a Tg of greater than 160° C. when cured at 177° C. for 1 min or longer.2. The resin composition of claim 1 , wherein an EEW of the first bisphenol epoxy is from 500 to 1500 g/eq and an amount of the first bisphenol epoxy is from 10 to 25 PHR per 100 PHR of the total epoxy resin.3. The resin composition of claim 2 , further comprising a second bisphenol epoxy having an EEW of 150 to 200 g/eq.4. The resin composition of claim 1 , wherein an EEW of the first bisphenol epoxy is from 500 to 1000 g/eq and an amount of the first bisphenol epoxy is from 10 to 40 PHR per 100 PHR of the total epoxy resin.5. The resin composition of claim 1 , wherein the difference between a maximum G″ value and a minimum G″ value of the resin composition after being cured is no more than 15 MPa when the minimum G″ value is measured in a temperature range of 55° C. to 140° C.6. The resin composition of claim 1 , wherein an amount of the aromatic urea ranges from 0.5 to 7 PHR per 100 PHR of the total epoxy resin.7. The resin composition of claim 1 , wherein an amount of the dicyandiamide is in a range of 3 to 7 PHR per 100 PHR of the ...

EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PREPARED USING THE SAME

An epoxy resin composition and a semiconductor device, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a silicon compound, wherein the curing catalyst includes a phosphonium compound represented by the following Formula 4 and the silicon compound comprises a silicon compound represented by the following Formula 7: 2. The epoxy resin composition as claimed in claim 1 , wherein R claim 1 , R claim 1 , R claim 1 , and Rare each independently a substituted or unsubstituted Cto Caryl group.3. The epoxy resin composition as claimed in claim 2 , wherein at least one of R claim 2 , R claim 2 , R claim 2 , and Ris a hydroxyl group-substituted Cto Caryl group.6. The epoxy resin composition as claimed in claim 1 , wherein the epoxy resin includes a bisphenol A epoxy resin claim 1 , a bisphenol F epoxy resin claim 1 , a phenol novolac epoxy resin claim 1 , a tert-butyl catechol epoxy resin claim 1 , a naphthalene epoxy resin claim 1 , a glycidylamine epoxy resin claim 1 , a cresol novolac epoxy resin claim 1 , a biphenyl epoxy resin claim 1 , a linear aliphatic epoxy resin claim 1 , a cycloaliphatic epoxy resin claim 1 , a heterocyclic epoxy resin claim 1 , a spiro ring-containing epoxy resin claim 1 , a cyclohexane dimethanol epoxy resin claim 1 , a trimethylol epoxy resin claim 1 , or a halogenated epoxy resin.7. The epoxy resin composition as claimed in claim 1 , wherein the curing agent includes a phenol aralkyl phenol resin claim 1 , a phenol novolac phenol resin claim 1 , a xyloc phenol resin claim 1 , a cresol novolac phenol resin claim 1 , a naphthol phenol resin claim 1 , a terpene phenol resin claim 1 , a polyfunctional phenol resin claim 1 , a dicyclopentadiene-based phenol resin claim 1 , a novolac phenol resin synthesized from bisphenol A and resorcinol claim 1 , a polyhydric phenolic compound claim 1 , an acid anhydride claim 1 , or an aromatic amine.8. The epoxy resin composition as claimed in claim 1 , ...

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

Provided are an epoxy resin composition for semiconductor encapsulation; and a semiconductor device having a cured product of such composition. The composition has a superior curability, and a metal layer (plated layer) can be selectively and easily formed on the surface of or inside the cured product of this composition via an electroless plating treatment. The composition of the present invention contains: 1. An epoxy resin composition for semiconductor encapsulation , comprising:(A) an epoxy resin;(B) a phenolic curing agent;(C) a curing accelerator having a urea structure;(D) a laser direct structuring additive; and(E) an inorganic filler.3. The epoxy resin composition for semiconductor encapsulation according to claim 1 , wherein the component (D) is added in an amount of 20 to 100 parts by mass per a total of 100 parts by mass of the components (A) and (B).4. The epoxy resin composition for semiconductor encapsulation according to claim 1 , wherein the component (D) has an average particle size of 0.01 to 5 μm.5. The epoxy resin composition for semiconductor encapsulation according to claim 1 , wherein the component (D) is such that after an aqueous dispersion of the component (D) is prepared by immersing 10 parts by mass of the component (D) in 50 parts by mass of pure water claim 1 , and then left to stand at 125±3° C. for 20±1 hours claim 1 , a sodium ion concentration in the aqueous dispersion of the component (D) is not higher than 50 ppm claim 1 , and a chloride ion concentration in the aqueous dispersion of the component (D) is not higher than 50 ppm.6. The epoxy resin composition for semiconductor encapsulation according to claim 1 , wherein a top cut particle size of the component (E) in a wet sieve method is 5 to 25 μm claim 1 , and an average particle size of the component (E) is 0.5 to 10 μm.7. A semiconductor device having a cured product of the epoxy resin composition for semiconductor encapsulation according to .8. The semiconductor device ...

FIBER-REINFORCED RESIN COMPOSITE BODY, AND REINFORCED MATRIX RESIN FOR FIBER-REINFORCED RESIN

The present invention provides a fiber-reinforced resin composite as a fiber-reinforced resin composite (E) including a fiber-reinforced resin (C), which contains a reinforcing fiber (A) and a matrix resin (B), and a reinforcing material (D), in which the reinforcing material (D) contains a cellulose nanofiber (F), and the cellulose nanofiber (F) is obtained by micronizing cellulose in a fibrillated resin (G), and provides a reinforced matrix resin for the fiber-reinforced resin. The present invention also provides a fiber-reinforced resin composite in which the cellulose nanofiber (F) is a modified cellulose nanofiber (F1) that is obtained by micronizing cellulose in the fibrillated resin (G) and then reacting the cellulose with a cyclic polybasic acid anhydride (J). 1. A fiber-reinforced resin composite as a fiber-reinforced resin composite (E) comprising:a fiber-reinforced resin (C) which contains a reinforcing fiber (A) and a matrix resin (B); anda reinforcing material (D),wherein the reinforcing material (D) contains a cellulose nanofiber (F), and the cellulose nanofiber (F) is obtained by micronizing cellulose in a fibrillated resin (G).2. The fiber-reinforced resin composite according to claim 1 ,wherein the cellulose nanofiber (F) is a modified cellulose nanofiber (F1) that is obtained by micronizing cellulose in the fibrillated resin (G) and then reacting the cellulose with a cyclic polybasic acid anhydride (J).3. The fiber-reinforced resin composite according to claim 1 ,wherein the reinforcing material (D) further contains the fibrillated resin (G) or a modified fibrillated resin (K) that is obtained by modifying the fibrillated resin (G) with the cyclic polybasic acid anhydride (J).4. The fiber-reinforced resin composite according to claim 1 ,wherein the reinforcing fiber (A) is a carbon fiber (A1) or a glass fiber (A2).5. A reinforced matrix resin as a reinforced matrix resin (H) for a fiber-reinforced resin comprising:a matrix resin (B); anda ...

MATRIX MATERIAL

The present invention relates to a matrix material for a carbon fiber-reinforced composite. The matrix material for the carbon fiber composite contains a matrix resin as a resin component. The matrix resin contains at least a first epoxy resin containing a polyfunctional glycidylamine-type epoxy resin having four epoxy groups in one molecule. The matrix resin may further contain at least one of a p-aminophenol-type epoxy resin having three epoxy groups in one molecule, and a tetramethylbiphenol-type solid epoxy resin having two epoxy groups in one molecule. The matrix resin has an average epoxy equivalency of 99 to 163. 1. A matrix material for a carbon fiber-reinforced composite comprising a matrix resin containing both a first epoxy resin and a second epoxy resin , or containing only the first epoxy resin , wherein:the first epoxy resin contains a polyfunctional glycidylamine-type epoxy resin having four epoxy groups in one molecule;the second epoxy resin contains at least one of a p-aminophenol-type epoxy resin having three epoxy groups in one molecule, and a tetramethylbiphenol-type solid epoxy resin having two epoxy groups in one molecule; and {'br': None, 'average epoxy equivalency of the matrix resin=[epoxy equivalency of first epoxy resin×(weight percentage of first epoxy resin/100)]+average epoxy equivalency of second epoxy resin\u2003\u2003(A);'}, 'the matrix resin has an average epoxy equivalency of 99 to 163, which is calculated using a following equation (A) {'br': None, 'average epoxy equivalency of second epoxy resin=[epoxy equivalency of p-aminophenol-type epoxy resin×(weight percentage of p-aminophenol-type epoxy resin/100)]+[epoxy equivalency of tetramethylbiphenol-type solid epoxy resin×(weight percentage of tetramethylbiphenol-type solid epoxy resin/100)]\u2003\u2003(B).'}, 'the average epoxy equivalency of the second epoxy resin is calculated using a following equation (B)2. The matrix material according to claim 1 , wherein the matrix resin ...

ROOM TEMPERATURE STABLE ONE-PART VOID FILLER

A curable void filler composition comprising at least one epoxy resin; at least one epoxy curing agent comprising at least one bicyclic carboxylic acid anhydride; and at least one epoxysilane compound according to formula (1), where formula (1) is Glycidoxy-R1Si(OR2)(OR3)(OR4), and R1 is selected from linear or branched alkyl comprising from 1 and 15 carbon atoms; and R2, R4 and R4 may be different or the same, and are independently selected from linear or branched alkyl comprising from 2 to 15 carbon atoms. 1. A curable void filler composition comprising:(a) at least one epoxy resin;(b) at least one epoxy curing agent comprising at least one bicyclic carboxylic acid anhydride; {'br': None, 'Glycidoxy-R1Si(OR2)(OR3)(OR4)\u2003\u2003formula (1)'}, '(c) at least one epoxysilane compound according to formula (1)'}whereinR1 is selected from linear or branched alkyl comprising from 1 and 15 carbon atoms;R2, R4 and R4 may be different or the same, and are independently selected from linear or branched alkyl comprising from 2 to 15 carbon atoms.2. The curable void filler composition according to claim 1 , wherein R1 of the at least one epoxysilane compound is selected from linear or branched ethyl claim 1 , propyl claim 1 , butyl claim 1 , pentyl claim 1 , hexyl claim 1 , heptyl and octyl.3. The curable void filler composition according to claim 1 , wherein R2 claim 1 , R3 claim 1 , and R4 of the at least one epoxysilane compound are independently selected from linear or branched ethyl claim 1 , propyl claim 1 , butyl claim 1 , pentyl claim 1 , hexyl claim 1 , heptyl and octyl.4. The curable void filler composition according to claim 1 , wherein the at least one epoxysilane compound is contained in an amount of from 0.1 to 20 wt.-%.5. The curable void filler composition according to claim 1 , wherein the at least one bicyclic carboxylic acid anhydride is a sterically hindered bicyclic compound.6. The curable void filler composition according to claim 5 , wherein the at ...

FILLERS FOR POLYMERS

This invention relates to a composite material comprising a core comprising an organosilica such as a polyhedral oligomeric silsesquioxane (POSS) and a functionalized elastomeric polymer such as poly(n-butyl acrylate) bonded onto said core. The elastomer is preferably functionalised with an amine moiety. The present invention also relates to a polymer comprising a resin such as Bisphenol A diglycidylether (DGEBA) and the aforementioned composite material, and a method for making the composite material. The composite material can improve both the material strength and material toughness of the polymer into which it is mixed. 1. A composite material comprising a chalcogen core and a functionalized elastomeric polymer bonded onto the chalcogen core.2. The composite material according to claim 1 , wherein the chalcogen core comprises a composition selected from the group consisting of organosilica claim 1 , silica claim 1 , clay claim 1 , graphene oxide claim 1 , carbon nanotubes claim 1 , carbon black claim 1 , glass fibres and any mixture thereof or wherein the chalcogen core comprises organosilica.3. (canceled)4. The composite material according to claim 2 , wherein the organosilica is polyhedral oligomeric silsesquioxane (POSS) or wherein the polyhedral oligomeric silsesquioxane (POSS) is an octahedral oligomeric silsesquioxane.5. (canceled)6. The composite material according to claim 1 , wherein the functionalized elastomeric polymer is covalently bonded onto the chalcogen core or wherein the elastomeric polymer is a thermoset elastomer or a thermoplastic elastomer.7. (canceled)8. The composite material according to claim 1 , wherein the elastomeric polymer is selected from the group consisting of poly(n-butylacrylate) claim 1 , polysiloxane claim 1 , polyisoprene claim 1 , polybutadiene claim 1 , polychloroprene claim 1 , polyisobutylene claim 1 , polyacrylate claim 1 , polyvinyl polyvinylidine claim 1 , poly(methyl methacrylate) and any mixture thereof or wherein ...

CURABLE COMPOSITIONS

A curable epoxy resin formulation useful for making an insulator for a high-voltage gas insulated switchgear, the curable formulation including (A) an epoxy resin composition comprising a mixture of: (A1) at least one solid epoxy resin, (A2) at least one novolac epoxy resin, and (A3) at least one cycloaliphatic epoxy resin; (B) at least one anhydride hardener; (C) at least one filler; and (D) optionally, at least one catalyst or at least one accelerator. 1. A curable epoxy resin formulation comprising: (A1) at least one solid epoxy resin,', '(A2) at least one novolac epoxy resin, and', '(A3) at least one cycloaliphatic epoxy resin;, '(A) an epoxy resin composition comprising a mixture of(B) at least one anhydride hardener;(C) at least one filler; and(D) optionally, at least one catalyst or at least one accelerator.2. The curable epoxy resin formulation of claim 1 , wherein the solid epoxy resin is a bisphenol A type epoxy resin.3. The curable epoxy resin formulation of claim 2 , wherein the bisphenol A type epoxy resin has a softening point of no less than about 50° C. and an epoxide equivalent weight of from about 400 to about 600.4. The curable epoxy resin formulation of claim 1 , wherein the novolac epoxy resin is a condensate of a phenol with formaldehyde that is obtained under acid conditions.5. The curable epoxy resin formulation of claim 4 , wherein the novolac epoxy resin is a phenol novolac claim 4 , a bisphenol A novolac claim 4 , a cresol novolac claim 4 , or a mixture thereof.6. The curable epoxy resin formulation of claim 1 , wherein the cycloaliphatic epoxy resin is a hydrocarbon compound comprising at least one non-aryl hydrocarbon ring structure and at least one epoxy group.7. The curable epoxy resin formulation of claim 1 , wherein the anhydride hardener is a compound having an anhydride functional group claim 1 , adapted to react with an oxirane group to form a bond thereto and adapted to extend a polymer chain.8. The curable epoxy resin ...

Storage Stable and Curable Resin Compositions

Disclosed are a storage stable resin composition, comprising an epoxy resin, a block-copolymer with silicone and organic blocks, and a silane, a process for obtaining such storage stable resin composition, a curable resin composition obtainable from the above storage stable resin composition as well as a cured article obtainable from the latter and uses thereof. 1. A storage stable resin composition , comprising an epoxy resin , a block-copolymer with silicone and organic blocks , and a silane.2. The storage stable resin composition according to claim 1 , wherein the epoxy resin is a bisphenol-A epoxy resin.3. The storage stable resin composition according to claim 1 , wherein the block-copolymer is present in the storage stable resin composition in an amount ranging from 4 to 8 wt. % claim 1 , based on the total weight of the epoxy resin claim 1 , the block-copolymer and the silane.4. The storage stable resin composition according to claim 1 , wherein the silane is an epoxy silane.5. The storage stable resin composition according to claim 1 , wherein the silane is present in the storage stable resin composition in an amount ranging from 0.6 to 1.5 wt. % claim 1 , based on the total weight of the epoxy resin claim 1 , the block-copolymer and the silane.6. A process for obtaining a storage stable resin claim 1 , comprising:blended blending an epoxy resin with a block-copolymer at a temperature of 80° C. or more to obtain a blend,cooling the blend to a temperature of 60° C. or below, andmixing the blend with a silane.7. A curable resin composition comprising the storage stable resin composition according to and a hardener component.8. The curable resin composition according to claim 7 , wherein the hardener component is based on an anhydride claim 7 , amine claim 7 , dicyandiamide or a catalyst that triggers epoxy polymerization.9. The curable resin composition according to claim 7 , wherein the composition further comprises a filler component.10. The curable resin ...

EPOXY RESIN COMPOSITION, PREPREG, AND CARBON FIBER-REINFORCED COMPOSITE MATERIAL

An object of the present invention is to provide an epoxy resin composition capable of providing a carbon fiber-reinforced composite material that is excellent in moldability, heat resistance, and mechanical properties such as tensile strength and compression strength, and a prepreg. The present invention provides an epoxy resin composition containing at least components [A] to [D] shown below: [A]: an epoxy resin having a xylene group; [B]: a glycidyl amine epoxy resin having three or more glycidyl groups in a molecule; [C]: a thermoplastic resin; and [D]: an aromatic polyamine, the epoxy resin composition containing 10 to 80 parts by mass of the component [A] and 20 to 90 parts by mass of the component [B] based on 100 parts by mass in total of epoxy resins, and also 1 to 25 parts by mass of the component [C] based on 100 parts by mass in total of epoxy resins. 18-. (canceled)10. The epoxy resin composition according to claim 9 , comprising 40 to 80 parts by mass of the component [A] and 60 to 20 parts by mass of the component [B] based on 100 parts by mass in total of epoxy resins.11. The epoxy resin composition according to claim 9 , wherein the component [D] is an aromatic polyamine having 1 to 4 phenyl groups in a molecule claim 9 , and at least one of the phenyl groups has an amino group at an ortho position or a meta position.12. A prepreg comprising a carbon fiber claim 9 , and the epoxy resin composition according to impregnated into the carbon fiber.13. The prepreg according to claim 12 , wherein the carbon fiber is in a form of a woven fabric.14. A carbon fiber-reinforced composite material that is a cured product of the prepreg according to .15. A carbon fiber-reinforced composite material comprising a cured product of the epoxy resin composition according to claim 9 , and a carbon fiber.16. The epoxy resin composition according to claim 10 , wherein the component [D] is an aromatic polyamine having 1 to 4 phenyl groups in a molecule claim 10 , and at ...

POLYETHER-EPOXIDE POLYMER COMPOSITIONS

Polyether-epoxide polymer compositions are disclosed. The compositions comprise a reaction product of a polyepoxide compound and a polyol composition comprising a polyether polyol. The ratio of epoxy equivalents to hydroxyl equivalents is within the range of 0.5:1 to 3:1. The polyether-epoxide composition has a Twithin the range of −40° C. to 60° C. The polyether polyol has a hydroxyl value within the range of 150 to 800 mg KOH/g and an average hydroxyl functionality within the range of 3.5 to 8.0. In some aspects, the polyol composition further comprises a polyester polyol. Low- and elevated-temperature processes catalyzed by bases or Lewis acids for making the polyether-epoxide compositions are also disclosed. In a simple yet innovative approach, a new class of polymers useful for coatings, elastomers, adhesives, sealants, and other valuable products is assembled from readily available starting materials without reliance on polyamines or polyisocyanates. 1. A polyether-epoxide polymer composition which comprises a reaction product of:(a) a polyepoxide compound having an equivalent weight within the range of 125 to 250 g/eq.; and(b) a polyol composition comprising a polyether polyol, wherein the polyether polyol has a hydroxyl value within the range of 150 to 800 mg KOH/g and an average hydroxyl functionality within the range of 3.5 to 8.0; andwherein the ratio of epoxy equivalents of the polyepoxide compound to hydroxyl equivalents of the polyol composition is within the range of 0.5:1 to 3:1, and the polyether-epoxide polymer composition has a glass-transition temperature as measured by differential scanning calorimetry within the range of −40° C. to 60° C.2. The polyether-epoxide polymer composition of wherein the polyol composition further comprises a polyester polyol.3. The polyether-epoxide polymer composition of wherein the polyepoxide compound is an aromatic polyepoxide.4. The polyether-epoxide polymer composition of wherein the aromatic polyepoxide is a ...

LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE

With the use of a photoalignment film, the present invention provides a liquid crystal display device capable of maintaining a favorable voltage holding ratio and reducing or preventing image sticking, stains, and a decrease in contrast ratio for a long time not only in a room-temperature environment but also in a high-temperature environment; and a method for producing such a liquid crystal display device. The liquid crystal display device of the present invention includes paired substrates; a liquid crystal layer disposed between the substrates; a photoalignment film disposed between at least one of the substrates and the liquid crystal layer; and a polymer layer disposed between the photoalignment film and the liquid crystal layer, wherein the polymer layer has a structure derived from a specific epoxy-based monomer and a structure derived from a specific curing agent. 3. The liquid crystal display device according to claim 1 ,wherein the photoalignment film contains a photoreactive functional group-containing polymer, andthe photoreactive functional group is an azobenzene group, a chalcone group, or a cinnamate group.4. The liquid crystal display device according to claim 3 ,wherein the photoreactive functional group-containing polymer further contains a carboxyl group.5. The liquid crystal display device according to claim 3 ,wherein the photoreactive functional group-containing polymer further contains an epoxy group.6. The liquid crystal display device according to claim 1 ,wherein the photoalignment film contains a polymer containing a carboxyl group.7. The liquid crystal display device according to claim 1 ,wherein the photoalignment film contains a polymer containing an epoxy group.8. The liquid crystal display device according to claim 4 ,wherein the carboxyl group and the epoxy-based monomer are bonded to each other.9. The liquid crystal display device according to claim 5 ,wherein the epoxy group and the curing agent are bonded to each other.10. The ...

RESIN COMPOSITION FOR PRINTED WIRING BOARD MATERIAL, AND PREPREG, RESIN SHEET, METAL FOIL CLAD LAMINATE, AND PRINTED WIRING BOARD USING SAME

A resin composition forms a roughened surface with low roughness on an insulating layer regardless of roughening conditions when used as an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. The resin composition includes an epoxy compound, a cyanate ester compound and an inorganic filler, wherein the cyanate ester compound is at least selected from a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound is 60 to 75% by weight based on the total amount of the epoxy compound and the cyanate ester compound. 1. A resin composition which is used as a material of an insulating layer of a printed wiring board including the insulating layer , and a conductor layer formed by plating on a surface of the insulating layer , comprising an epoxy compound (A) , a cyanate ester compound (B) and an inorganic filler (C) , wherein the cyanate ester compound (B) is at least one selected from the group consisting of a naphthol aralkyl type cyanate ester compound , an aromatic hydrocarbon formaldehyde type cyanate ester compound , a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound , and the content of the epoxy compound (A) is 60 to 75% by weight based on the total amount of the epoxy compound (A) and the cyanate ester compound (B).2. The resin composition according to claim 1 , wherein the cyanate ester compound (B) is at least one selected from the group consisting of a naphthol aralkyl type cyanate ester compound claim 1 , an aromatic hydrocarbon formaldehyde type cyanate ester compound and a biphenyl aralkyl type cyanate ...

RESIN COMPOSITION FOR REFLECTING LIGHT, SUBSTRATE FOR MOUNTING OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE

A resin composition for reflecting light of the present invention includes an epoxy resin B having a unit structure X of alicyclic acid anhydride and a unit structure Y of hydrogenated bisphenol, and a colorant. The epoxy resin B preferably further has a unit structure Z of bisphenol-type epoxy. In addition, the resin composition for reflecting light of the present invention preferably further includes an epoxy resin A having a structure represented by the following formula (1). Then, when a content of the epoxy resin A is M [% by mass], and a content of the epoxy resin B is N [% by mass], it is preferable to satisfy a relationship of 0.1≦M/N≦10.

RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

Provided is a resin composition for encapsulation including: a curing resin; and an inorganic filler, in which the resin composition encapsulates a semiconductor element provided over a substrate and fills a gap between the substrate and the semiconductor element, and when a particle diameter at a cumulative frequency of 5% in order from the largest particle diameter in a volume particle diameter distribution of particles contained in the inorganic filler is represented by R(μm), and when a maximum peak diameter in the volume particle diameter distribution of the particles contained in the inorganic filler is represented by R (μm), R Подробнее

SHEET MOLDING COMPOUND AND FIBER-REINFORCED COMPOSITE MATERIAL

The present invention enables the achievement of: an SMC which has excellent flexibility, while being suppressed in tackiness; and a fiber-reinforced composite material which uses this SMC, thereby being reduced in voids after molding. In order to achieve the above, a sheet molding compound according to the present invention has the configuration described below. Specifically, a sheet molding compound according to the present invention is formed from reinforcing fibers and a resin composition, and has a weight content of the fibers of from 40% to 60% (inclusive) and an air bubble content of from 5% by volume to 30% by volume (inclusive), while satisfying the formulae below in a dynamic viscoelasticity measurement at 25° C. 10Pa G′ (s)≤10Pa 1≤G′(s)/G″ (s)≤5 G′(s): storage elastic modulus (Pa) of sheet molding compound at 25° C. G″(s): loss elastic modulus (Pa) of sheet molding compound at 25° C. 1. A sheet molding compound comprising a reinforcing fiber and a resin composition , having a weight content of the reinforcing fiber of 40% or more and 60% or less , having a porosity of 5% by volume or more and 30% by volume or less , and satisfying the following formulas in dynamic viscoelasticity measurement at 25° C.:{'br': None, 'sup': 5', '9, 'i': G', 's, '10Pa≤′()≤10Pa'}{'br': None, 'i': G', 's', 'G', 's, '1≤′()/″()≤5'}G′(s): Storage modulus [Pa] of sheet molding compound at 25° C.G″(s): Loss modulus [Pa] of sheet molding compound at 25° C.2. The sheet molding compound according to claim 1 , wherein the storage modulus G′(s) at 70° C. is 10Pa or more and 10Pa or less.3. The sheet molding compound according to claim 1 , which satisfies the following formulas in the dynamic viscoelasticity measurement at 25° C. of the resin composition claim 1 ,{'br': None, 'sup': 4', '8, 'i': G', 'r, '10Pa≤′()≤10Pa'}{'br': None, 'i': ≤G', 'r', 'G', 'r, '1′()/″()≤30'}G′(r): Storage modulus [Pa] of resin composition at 25° C.G″(r): Loss modulus [Pa] of resin composition at 25° C.4. The ...

RESIN COMPOSITION AND SEMICONDUCTOR MOUNTING SUBSTRATE OBTAINED BY MOLDING SAME

A resin composition which contains at least constituent elements (A)-(E) described below and wherein the epoxy resin (A) contains 80-100% by mass of a bifunctional epoxy resin and component (D) is contained in an amount of 60-85% by mass relative to 100% by mass of the total mass of the resin composition. This resin composition does not substantially contain a solvent and is in a liquid state at room temperature. (A) an epoxy rein (B) an amine-based curing agent (C) an accelerator that has at least one functional group selected from among a dimethylureide group, an imidazole group and a tertiary amino group (D) silica particles (E) a silane coupling agent Provided is a resin composition which has excellent curability at low temperatures and a sufficiently low linear expansion coefficient after curing. This resin composition does not suffer from warping in cases where applied to a copper thin film and molded, and does not suffer from separation or cracks even if a substrate obtained therefrom is bent. Also provided is a semiconductor mounting substrate which is obtained by molding the resin composition. 113.-. (canceled)15. The resin composition according to claim 14 , further comprising (F) a phosphorus-containing flame retardant.16. The resin composition according to claim 14 , wherein the amine curing agent (B) is an aliphatic amine curing agent.17. The resin composition according to claim 14 , wherein the amine curing agent (B) is dicyandiamide or a derivative thereof.18. The resin composition according to wherein the accelerator (C) having at least one functional group selected from dimethylureido group claim 14 , imidazole group claim 14 , and tertiary amino group is at least one compound selected from phenyldimethylurea claim 14 , methylenebis(phenyldimethylurea) claim 14 , tolylenebis(dimethylurea) claim 14 , and halogenated derivatives thereof.19. The resin composition according to claim 14 , wherein the accelerator (C) having at least one functional group ...

FIBER-REINFORCED RESIN COMPOSITE BODY, AND REINFORCED MATRIX RESIN FOR FIBER-REINFORCED RESIN

The present invention provides a fiber-reinforced resin composite as a fiber-reinforced resin composite (E) including a fiber-reinforced resin (C), which contains a reinforcing fiber (A) and a matrix resin (B), and a reinforcing material (D), in which the reinforcing material (D) contains a cellulose nanofiber (F), and the cellulose nanofiber (F) is obtained by micronizing cellulose in a fibrillated resin (G), and provides a reinforced matrix resin for the fiber-reinforced resin. The present invention also provides a fiber-reinforced resin composite in which the cellulose nanofiber (F) is a modified cellulose nanofiber (F1) that is obtained by micronizing cellulose in the fibrillated resin (G) and then reacting the cellulose with a cyclic polybasic acid anhydride (J). 17.-. (canceled)8. A method for producing a fiber-reinforced resin composite , comprising:a step of obtaining a cellulose nanofiber (F) by micronizing cellulose in a fibrillated resin (G);a step of obtaining a reinforced matrix resin (H) by compounding a reinforcing material (D) which contains the fibrillated resin (G) and the cellulose nanofiber (F) with a matrix resin (B); anda step of obtaining a fiber-reinforced resin composite (E) by compounding the reinforced matrix resin (H) with a reinforcing fiber (A).9. A method for producing a fiber-reinforced resin composite , comprising:a step of obtaining a cellulose nanofiber (F) by micronizing cellulose in a fibrillated resin (G);a step of obtaining a modified cellulose nanofiber (F1) by reacting hydroxyl groups contained in the cellulose nanofiber (F) with a cyclic polybasic acid anhydride (J) in the fibrillated resin (G);a step of obtaining a reinforced matrix resin (H) by compounding a matrix resin (B) with a reinforcing material (D) containing the fibrillated resin (G) or a modified fibrillated resin (K) obtained by modifying the fibrillated resin (G) with a cyclic polybasic acid anhydride (J) and a modified cellulose nanofiber (F1); anda step of ...

ALKALI-SOLUBLE RESIN (ASR) SHELL EPOXY RDP EXHIBITING IMPROVED SHELF STABILITY

The present invention provides shelf stable redispersible multilayer polymer particles (RDPs) comprising a major proportion of epoxy resins, a methacrylic acid or anhydride containing alkali soluble polymer outer layer and a hydrophobic chain transfer agent or a high glass transition temperature colloidal stabilizer, such as poly(vinyl pyrrolidinone) or its copolymer, as well as to methods of making the same.

ADHESIVE MATERIAL AND METHOD OF USE THEREOF

An adhesive material which comprises an epoxy component including a first flame retardant and a curing component which includes an adhesion promoter and a second flame retardant The epoxy component and curing component are present in a ratio of about 1:1 and the adhesive is formed when the epoxy component is combined with the curing component 1. A composition comprising:a. an epoxy component including a first flame retardant; andb. a curing component which includes an adhesion promoter and a second flame retardant;wherein an adhesive is formed when the epoxy component is combined with the curing component.2. The composition of claim 1 , wherein after cure claim 1 , upon applying a flame for about 80-seconds the material composition has about a 6.0″ burn length or less claim 1 , the flame takes about 15 seconds or less to extinguish claim 1 , and drippings from the adhesive do not continue to flame for more than about 3 seconds after falling claim 1 ,3. The composition of claim 1 , wherein after cure claim 1 , upon applying a flame to the material composition for 12-seconds the material composition has about a 8.0″ burn length or less claim 1 , the flame takes about 15 seconds or less to extinguish claim 1 , and drippings from the adhesive do not continue to flame for more than about 3 seconds after falling claim 1 ,4. The composition of claim 1 , wherein the adhesive has a gel time greater than or equal to about three minutes and less than or equal to about 60 minutes after the epoxy component and the curing component have been combined.5. The composition of claim 2 , wherein the adhesive has a gel time greater than or equal to about three minutes and less than or equal to about 10 minutes after the epoxy component and the curing component have been combined.6. The composition of wherein the adhesive has a gel time greater than or equal to about 5 minutes and less than or equal to about 20 minutes after the epoxy component and the curing component have been combined ...

REACTIVE FRIABLE POLYIMIDE AND METHOD OF MAKING

Disclosed herein is a friable polyimide powder having a weight average molecular weight, as determined by gel permeation chromatography (GPC) using polystyrene standards, of less than or equal to 24,500 Daltons and a reactive aromatic amine end group concentration greater than or equal to 3 mole percent, wherein 90 weight percent of the powder particles are reducible to less than or equal to 75 micrometers by mechanical grinding. Also disclosed is a method of making the friable polyimide powder, a processed polyimide resulting from the friable polyimide powder and compositions comprising the processed polyimide. 1. A friable polyimide powder havinga weight average molecular weight, as determined by gel permeation chromatography using polystyrene standards, of less than or equal to 24,500 Daltons, anda reactive aromatic amine end group concentration greater than 3 mole percent,wherein 90 weight percent of the powder particles are reducible to less than or equal to 75 micrometers by mechanical grinding.2. The friable polyimide powder of claim 1 , having a weight average molecular weight of 5 claim 1 ,000 to 24 claim 1 ,500 Daltons.3. The friable polyimide powder of claim 1 , having a reactive aromatic amine end group concentration of 3.1 to 40 mole percent.4. The friable polyimide powder of claim 1 , wherein 90 weight percent of the particles are reducible to 1 to 75 micrometers.5. The friable polyimide powder of claim 1 , wherein 90 weight percent of the particles are reducible to 25 to 75 micrometers by mechanical grinding.8. The friable polyimide powder of claim 7 , wherein each R is independently meta-phenylene claim 7 , para-phenylene claim 7 , 4 claim 7 ,4′-diphenylene sulfone claim 7 , a combination comprising at least one of the foregoing claim 7 , and Z is 4 claim 7 ,4′-diphenylene isopropylidene.12. A method of making a processed polyimide powder comprising mechanically grinding the friable polyimide powder of claim 1 , sieving the product of grinding with a ...

HEAT-CURABLE EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION AND OPTICAL SEMICONDUCTOR DEVICE USING SAME

A heat-curable epoxy resin composition for optical semiconductor element encapsulation capable of being pressure molded and transfer molded under room temperature, comprising: 1. A heat-curable epoxy resin composition for optical semiconductor element encapsulation capable of being pressure molded and transfer molded under room temperature , comprising:(A) a prepolymer obtained by reacting at least one component of (A-1), (A-2) and (A-3); and (A-4),(A-1) a triazine derivative epoxy resin having not less than three epoxy groups in one molecule,(A-2) at least one epoxy resin that is non-fluid at 25° C. and selected from the group consisting of a bisphenol-type epoxy resin, a hydrogenated bisphenol-type epoxy resin, an alicyclic epoxy resin and monoalkyl diglycidyl isocyanurate,(A-3) a cyclic siloxane compound having not less than two epoxy groups in one molecule, and(A-4) an acid anhydride curing agent which is an acid anhydride curing agent in a liquid state at 25° C.; or a liquid mixture prepared by dissolving an acid anhydride in a solid state at 25° C. into an acid anhydride in a liquid state at 25° C.,wherein a ratio of a total number of epoxy groups in (A-1), (A-2) and (A-3) to a total number of acid anhydride groups in (A-4) is 0.6 to 2.0, wherein at least one of components (A-1), (A-2) and (A-3) is reacted with component (A-4) to prepare (A);(A′) all of component(s) among (A-1) to (A-3) that is/are not used in said prepolymer (A), said component(s) (A-1), (A-2) and (A-3) being optional if all of said components (A-1), (A-2) and (A-3) are reacted with component (A-4) to prepare (A); and(B) a curing accelerator.2. The heat-curable epoxy resin composition for optical semiconductor element encapsulation according to claim 1 , wherein said prepolymer (A) is obtained by reacting at least one component of (A-1) claim 1 , (A-2) and (A-3); (A-4); and an antioxidant as a component (C).3. The heat-curable epoxy resin composition for optical semiconductor element ...

FILM AND IMAGE DISPLAY DEVICE

A film including a single-layered, self-supporting structure which is a cured product of a resin composition including an alicyclic epoxy compound (A), a polyol compound (B) and an acid generator (C). The resin composition includes the alicyclic epoxy compound (A) in an amount of from 50 to 80 mass % with respect to a total amount of the alicyclic epoxy compound (A) and the polyol compound (B). The resin composition includes the acid generator (C) in an amount of from 0.05 to 0.5 parts by mass per 100 parts by mass of a total of the alicyclic epoxy compound (A) and the polyol compound (B). 1. A film , comprising:a single-layered, self-supporting structure which is a cured product of a resin composition including an alicyclic epoxy compound (A), a polyol compound (B) and an acid generator (C),wherein the resin composition includes the alicyclic epoxy compound (A) in an amount of from 50 to 80 mass % with respect to a total amount of the alicyclic epoxy compound (A) and the polyol compound (B), andthe resin composition includes the acid generator (C) in an amount of from 0.05 to 0.5 parts by mass per 100 parts by mass of a total of the alicyclic epoxy compound (A) and the polyol compound (B).2. The film of claim 1 , wherein the alicyclic epoxy compound (A) consists of at least one of 3′ claim 1 ,4′-epoxycyclohexyl-3 claim 1 ,4-epoxycyclohexane carboxylate and ε-caprolactone-modified 3′ claim 1 ,4′-epoxycyclohexyl-3 claim 1 ,4-epoxycyclohexane carboxylate.3. The film of claim 1 , wherein the polyol compound (B) consists of at least one of polycaprolactone triol and polycarbonate diol.4. The film of claim 2 , wherein the polyol compound (B) consists of at least one of polycaprolactone triol and polycarbonate diol.5. The film of claim 1 , wherein the acid generator (C) includes a sulfonium salt.6. The film of claim 4 , wherein the acid generator (C) includes a sulfonium salt.7. The film of claim 1 , wherein the polyol compound (B) has a number average molecular weight ...

HEAT-CURABLE EPOXY RESIN COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE USING SAME

Provided is a heat-curable epoxy resin composition for encapsulating an optical semiconductor element. The resin composition exhibits a high strength and elastic modulus even in a high-temperature environment, hardly turns yellow due to an uneven hardening that occurs immediately after molding, and is solid under a room temperature such that the resin composition can be handled easily. The resin composition includes: a prepolymer obtained through a reaction of (A) a triazine derivative epoxy resin, (B) at least one epoxy resin selected from a group of (B-1) a bisphenol A-type epoxy resin, (B-2) a bisphenol F-type epoxy resin, (B-3) a hydrogenated bisphenol A-type epoxy resin and (B-4) an alicyclic epoxy resin and (C) an acid anhydride curing agent, at an epoxy group equivalent/acid anhydride group equivalent ratio of 0.6 to 2.0; and (D) a curing accelerator, such resin composition capable of being pressure molded under a room temperature before thermally cured. 1. A heat-curable epoxy resin composition for encapsulating an optical semiconductor element , comprising: (A) a triazine derivative epoxy resin,', '(B) at least one epoxy resin selected from the group consisting of (B-1) a bisphenol A-type epoxy resin, (B-2) a bisphenol F-type epoxy resin, (B-3) a hydrogenated bisphenol A-type epoxy resin and (B-4) an alicyclic epoxy resin, and', '(C) an acid anhydride curing agent, in an epoxy group equivalent to acid anhydride group equivalent ratio of 0.6 to 2.0; and', '(D) a curing accelerator,', 'wherein said heat-curable epoxy resin composition is capable of being pressure molded under a room temperature before being thermally cured., 'a prepolymer obtained through a reaction of'}2. A heat-curable epoxy resin composition for encapsulating an optical semiconductor element , comprising:(A) a triazine derivative epoxy resin;(B) at least one epoxy resin selected from the group consisting of (B-1) a bisphenol A-type epoxy resin, (B-2) a bisphenol F-type epoxy resin, (B-3) a ...

Epoxy Resin Composition For Fiber-Reinforced Composite Material

The present technology is an epoxy resin composition for a fiber-reinforced composite material comprising a phosphorus-containing epoxy resin containing phosphorus in the skeleton thereof, a dicyandiamide, and a curing promoter containing at least one selected from 1,1′-(4-methyl-1,3-phenylene)bis(3,3-dimethylurea), phenyl-dimethylurea represented by the following formula (1), and methylene-diphenyl-bisdimethylurea represented by the following formula (2); wherein the phosphorus content of the phosphorus-containing epoxy resin is at least 1.0 mass % and at most 5.0 mass % in the epoxy resin composition. 2. The epoxy resin composition for a fiber-reinforced composite material according to claim 1 , wherein the content of the curing accelerator is at least 1 part by mass and at most 15 parts by mass with respect to 100 parts by mass of a sum of the mass of the phosphorus-containing epoxy resin and other epoxy resins.3. The epoxy resin composition for a fiber-reinforced composite material according to claim 1 , comprising a phenoxy resin.4. The epoxy resin composition for a fiber-reinforced composite material according to claim 3 , wherein the content of the phenoxy resin is at least 5 parts by mass and at most 40 parts by mass with respect to 100 parts by mass of a sum of the mass of the phosphorus-containing epoxy resin and the other epoxy resins.5. A prepreg obtained by impregnating reinforcing fibers with the epoxy resin composition for a fiber-reinforced composite material according to .6. The epoxy resin composition for a fiber-reinforced composite material according to claim 2 , comprising a phenoxy resin.7. The epoxy resin composition for a fiber-reinforced composite material according to claim 6 , wherein the content of the phenoxy resin is at least 5 parts by mass and at most 40 parts by mass with respect to 100 parts by mass of a sum of the mass of the phosphorus-containing epoxy resin and other epoxy resins.8. A prepreg obtained by impregnating reinforcing ...

BLENDS COMPRISING EPOXY RESINS AND MIXTURES OF AMINES WITH GUANIDINE DERIVATIVES

The present invention provides a blend comprising one or more epoxy resins and a mixture which comprises 0.3 to 0.9 amine equivalent, per equivalent of epoxide of the epoxy resin used, of a hardener component a) and as hardener component b) a compound of the formula I, a process for preparing this blend, the use of the blend of the invention for producing cured epoxy resin, and an epoxy resin cured with the blend of the invention. 2. The blend according to claim 1 , wherein the hardener component a) is at least one amine having a functionality≧2.3. The blend according to claim 1 , wherein the hardener component a) comprises at least two hardener components a1) and a2) claim 1 , the hardener component a1) being at least one polyetheramine having a functionality≧2 and the hardener component a2) being at least one further amine having a functionality≧2.4. The blend according to claim 3 , whereinthe hardener component a1) is selected from the group consisting of 3,6-dioxa-1,8-octanediamine, 4,7,10-trioxa-1,13-tridecanediamine, 4,7-dioxa-1,10-decanediamine, 4,9-dioxa-1,12-dodecanediamine, polyetheramine based on triethylene glycol with an average molar mass of 148, difunctional, primary polyetheramine prepared by aminating an ethylene glycol grafted with propylene oxide, with an average molar mass of 176, difunctional, primary polyetheramine based on propylene oxide with an average molar mass of 4000, difunctional, primary polyetheramine prepared by aminating a polyethylene glycol grafted with propylene oxide, with an average molar mass of 2003, aliphatic polyetheramine based on polyethylene glycol grafted with propylene oxide, with an average molar mass of 900, aliphatic polyetheramine based on polyethylene glycol grafted with propylene oxide, with an average molar mass of 600, difunctional, primary polyetheramine prepared by aminating a diethylene glycol grafted with propylene oxide, with an average molar mass of 220, aliphatic polyetheramine based on a copolymer of ...

EPOXY RESIN COMPOSITION

The present invention provides an epoxy resin composition capable of exhibiting high moisture resistance and reducing reduction in adhesion at high temperature and high humidity. Provided is an epoxy resin composition containing: a modified polyvinyl acetal resin containing a hydrogen-bonding group-containing constitutional unit; and an epoxy resin, the modified polyvinyl acetal resin having an equilibrium moisture absorption of 5 to 20% by weight as measured with an infrared moisture meter after standing at 40° C. and 90% RH for seven days. 1. An epoxy resin composition comprising:a modified polyvinyl acetal resin containing a hydrogen-bonding group-containing constitutional unit; andan epoxy resin,the modified polyvinyl acetal resin having an equilibrium moisture absorption of 5 to 20% by weight as measured with an infrared moisture meter after standing at 40° C. and 90% RH for seven days.2. The epoxy resin composition according to claim 1 ,wherein the modified polyvinyl acetal resin contains the hydrogen-bonding group-containing constitutional unit having an SP value of 11.0 to 18.5.3. The epoxy resin composition according to claim 1 ,wherein the modified polyvinyl acetal resin contains a hydroxyl group in an amount of 10.0 to 50.0 mol %.4. The epoxy resin composition according to claim 1 ,wherein the modified polyvinyl acetal resin contains the hydrogen-bonding group-containing constitutional unit in an amount of 5.1 to 30.0 mol %.5. The epoxy resin composition according to claim 1 ,wherein the modified polyvinyl acetal resin contains a hydroxyl group and the hydrogen-bonding group-containing constitutional unit in a total amount of 15.1 to 65.0 mol %.6. The epoxy resin composition according to claim 1 ,wherein the modified polyvinyl acetal resin has an average degree of polymerization of 150 to 6,000.7. The epoxy resin composition according to claim 1 ,wherein the modified polyvinyl acetal resin contains an acetal group in an amount of 35.0 to 85.0 mol %.8. The ...

THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN-COATED METAL FOIL, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

To provide a thermosetting resin composition that has low elasticity, high heat resistance, high elongation under an ordinary temperature environment and a high temperature environment, high electric insulation reliability, and high adhesion strength to a metal foil, and is capable of providing a prepreg that is excellent in crack resistance; a prepreg including the thermosetting resin composition; a metal foil with a resin including the thermosetting resin composition and a metal foil laminated on each other; a laminate including the prepreg or the metal foil with a resin; a printed wiring board including the laminate; and a semiconductor package including the printed wiring board. Specifically, the thermosetting resin composition contains (A) a phenol-based resin, and the component (A) contains (A-1) a phenol-based resin having an aliphatic hydrocarbon group having 10 to 25 carbon atoms. 1. A thermosetting resin composition comprising (A) a phenol-based resin ,the component (A) containing (A-1) a phenol-based resin having an aliphatic hydrocarbon group having 10 to 25 carbon atoms.3. The thermosetting resin composition according to claim 2 , wherein a molar ratio of the structural unit (a1) with respect to the structural unit (a2) (structural unit (a1)/structural unit (a2)) is from 0 to 5.0.4. The thermosetting resin composition according to claim 1 , wherein the component (A-1) has a weight average molecular weight (Mw) of 4 claim 1 ,000 or less.5. The thermosetting resin composition according to claim 1 , wherein the component (A-1) has a hydroxy group equivalent of 90 to 350 g/eq.6. The thermosetting resin composition according to claim 1 , wherein a content of the component (A-1) is from 0.1 to 40 parts by mass per 100 parts by mass of the total resin content of the thermosetting resin composition.7. The thermosetting resin composition according to claim 1 , wherein the component (A) further contains (A-2) a phenol-based resin that does not have an aliphatic ...

CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF AND PRINTED WIRING BOARD

Provided is a curable resin composition which can be suitably used as a hole filling material for a printed wiring board having excellent characteristics such as noise suppression and a high flexibility in wiring formation. A curable resin composition comprising at least a curable resin and a magnetic filler, wherein the viscosity of the curable resin composition is 100 to 3000 (dPa·s) at 5.0 rpm as measured by a cone-flat plate type rotational viscometer (cone-plate type) in accordance with JIS-Z 8803:2011, and a cured product obtained by curing the curable resin composition at 150° C. for 30 minutes has an insulation resistance value of 1.0×10Ω or more. 1. A curable resin composition , comprising:a curable resin; anda magnetic filler,{'sup': '5', 'wherein the viscosity of the curable resin composition is in a range of 100 to 3000 dPa·s at 5.0 rpm as measured by a cone-flat plate type rotational viscometer in accordance with JIS-Z 8803:2011, and a cured product obtained by a process comprising curing the curable resin composition at 150° C. for 30 minutes has an insulation resistance value of 1.0×10Ω or more.'}2. The curable resin composition according to claim 1 , wherein a content of the magnetic filler is in a range of 30 to 70 vol % based on a total amount of the curable resin composition.3. The curable resin composition according to claim 1 , wherein the magnetic filler comprises a magnetic material comprising magnetic particles and an insulating material covering surfaces of the magnetic particles.4. A filling material for a penetrating hole or a recess part of a printed wiring board claim 1 , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the curable resin composition of .'}5. A cured product obtained by a process comprising curing the curable resin composition of .6. A printed wiring board claim 1 , comprising:{'claim-ref': {'@idref': 'CLM-00005', 'claim 5'}, 'the cured product of .'}7. The curable resin composition according to claim 2 , ...

WATER REDISPERSIBLE EPOXY POLYMER POWDER AND METHOD FOR MAKING THE SAME

An aqueous dispersion of epoxy resin and a redispersible epoxy polymer powder contains particles of 50-90 weight-percent epoxy resin with 10-50 weight-percent alkali soluble shell around the particles and 2-25 weight-percent dispersing aid, with weight-percent based on total combined weight of epoxy resin, alkali soluble polymer shell and dispersing aid. 2. The aqueous redispersible epoxy polymer powder of claim 1 , further characterized by the epoxy resin particles having an average particle size of two micrometers or less as measured by laser diffraction according to ISO 13320-2009 using a Coulter Counter particle size and count analyzers when the water aqueous redispersible polymer powder is dispersed in an aqueous liquid having a pH in a range of 9-11.3. The aqueous redispersible epoxy polymer powder of claim 1 , further characterized by the epoxy resin being present at a concentration of at least 75 weight-percent based on total combined weight of epoxy resin claim 1 , alkali soluble polymer shell and dispersing aid.4. The aqueous redispersible polymer powder of claim 1 , further characterized by the epoxy resin having a glass transition temperature of 20 degrees Celsius or lower as measure by ASTM D7426-08 using a heating and cooling rate of 10° C. per minute.5. The aqueous redispersible epoxy polymer powder of claim 1 , further characterized by the alkali soluble polymer shell comprising a copolymer of methyl methacrylate and methacrylic acid and having a glass transition temperature of at least 100 degrees Celsius as calculated by the Fox equation.6. The aqueous redispersible epoxy polymer powder of claim 1 , further characterized by the dispersing aid comprising polyvinyl alcohol at a concentration of at least five weight-percent based on total weight of epoxy resin claim 1 , alkali soluble polymer shell and dispersing aid.7. The aqueous redispersible epoxy polymer powder of claim 1 , further characterized by the epoxy resin having a glass transition ...

PARTIALLY ESTERIFIED EPOXY RESIN AND EPOXY RESIN COMPOSITION APPLIED WITH THE SAME, AND METHOD FOR PREPARING THE COMPOSITION

A partially esterified epoxy resin and an epoxy resin composition applied with the same, and a method for preparing the composition are provided. The preparation method includes the following steps. A bifunctional epoxy resin and an anhydride are mixed and heated, wherein the number of equivalent moles of the bifunctional epoxy resin is greater than that of the anhydride, to form a partially esterified epoxy resin. A curing agent is mixed into the partially esterified epoxy resin to form a mixed solution. The mixed solution is cured to form the partially esterified epoxy resin composition. 3. The partially esterified epoxy resin according to claim 1 , further comprising a bifunctional epoxy resin.4. The partially esterified epoxy resin according to claim 3 , wherein the bifunctional epoxy resin comprises at least one of bisphenol A epoxy resin claim 3 , bisphenol A epoxy resin derivative claim 3 , hydrogenated bisphenol A epoxy resin claim 3 , hydrogenated bisphenol A epoxy resin derivative claim 3 , bisphenol F epoxy resin claim 3 , bisphenol F epoxy resin derivative claim 3 , hydrogenated bisphenol F epoxy resin claim 3 , hydrogenated bisphenol F epoxy resin derivative claim 3 , aliphatic epoxy resin claim 3 , or alicyclic epoxy resin claim 3 , or the combinations thereof.5. The partially esterified epoxy resin according to claim 1 , wherein the partially esterified epoxy resin is a reaction product of a bifunctional epoxy resin with an anhydride claim 1 , and the ratio of the number of equivalent moles of the bifunctional epoxy resin to the number of equivalent moles of the anhydride is 1:0.1-1:0.49.8. The partially esterified epoxy resin composition according to claim 6 , further comprising a bifunctional epoxy resin.9. The partially esterified epoxy resin composition according to claim 8 , wherein the bifunctional epoxy resin comprises at least one of bisphenol A epoxy resin claim 8 , bisphenol A epoxy resin derivative claim 8 , hydrogenated bisphenol A epoxy ...

CURABLE COMPOSITIONS

Embodiments of the present disclosure provide a curable composition having an epoxy resin component having an epoxide equivalent weight of 75 grams/equivalent to 210 grams/equivalent, an amine component having a hydrogen equivalent weight of 18 grams/equivalent to 70 grants/equivalent, and an acrylate component having an acrylate equivalent weight of 85 grams/equivalent to 160 grams/equivalent, wherein the acrylate component is 1 part per hundred parts epoxy resin to less than 5 parts per hundred parts epoxy resin. 1. A curable composition comprising:an epoxy resin component having an epoxide equivalent weight of 75 grams/equivalent to 210 grams/equivalent;an amine component having a hydrogen equivalent weight of 18 grams/equivalent to 70 grams/equivalent; andan acrylate component having an acrylate equivalent weight of 85 grams/equivalent to 160 grams/equivalent, wherein the acrylate component is from 1 part per hundred parts epoxy resin to less than 5 parts per hundred parts epoxy resin.2. The composition of claim 1 , wherein the epoxy resin component includes an epoxide selected from the group consisting of glycidyl ethers claim 1 , glycidyl esters claim 1 , glycidyl amines claim 1 , divinylbenzene dioxide claim 1 , and combinations thereof.3. The composition of claim 1 , wherein the amine component is selected from the group consisting of aliphatic polyamines claim 1 , arylaliphatic polyamines claim 1 , cycloaliphatic polyamines claim 1 , alkanolamines claim 1 , polyetherpolyamines claim 1 , and combinations thereof.4. The composition of claim 1 , wherein the acrylate component consists of a plurality of acrylate compounds and each of the plurality acrylate compounds includes two or more acrylate groups.5. The composition of claim 1 , wherein the epoxy resin component claim 1 , the amine component claim 1 , and the acrylate component are included such that a sum of the epoxide equivalent weight and the acrylate equivalent weight divided by the hydrogen ...

POLYTHIOETHER SEALANTS

Certain polythioether polymers are presented, as well as compositions which are radiation curable to polythioether polymers and seals and sealants comprising same. The compositions radiation curable to polythioether polymers include those comprising: a) at least one dithiol monomer; b) at least one diene monomer; c) at least one multifunctional monomer having at least three ethenyl groups; and d) at least one photoinitiator. In another aspect, the compositions radiation curable to polythioether polymers include those comprising: f) at least one dithiol monomer; g) at least one diene monomer; h) at least one multifunctional monomer having at least three thiol groups; and i) at least one photoinitiator. In another aspect, the compositions radiation curable to poly-thioether polymers include those comprising: k) at least one thiol terminated polythioether polymer; l) at least one multifunctional monomer having at least three ethenyl groups; and m) at least one photoinitiator. 1. A composition which is radiation curable to a polythioether polymer , comprising:a) at least one dithiol monomer;b) at least one diene monomer;c) at least one multifunctional monomer having at least three ethenyl groups; andd) at least one photoinitiator.2. The composition according to additionally comprising:e) at least one epoxy resin.3. The composition according to or wherein said at least one multifunctional monomer has three ethenyl groups.4. A composition which is radiation curable to a polythioether polymer claim 1 , comprising:f) at least one dithiol monomer;g) at least one diene monomer;h) at least one multifunctional monomer having at least three thiol groups; andi) at least one photoinitiator.5. The composition according to additionally comprising:j) at least one epoxy resin.6. The composition according to or wherein said at least one multifunctional monomer has three thiol groups.7. A composition which is radiation curable to a polythioether polymer claim 4 , comprising:k) at least ...

RESIN COMPOSITION AND MULTILAYER SUBSTRATE

There is provided a resin composition with which the desmear properties can be enhanced, a cured product thereof can be made low in dielectric loss tangent, and the cured product can be made high in heat resistance. The resin composition according to the present invention includes a compound having a structure represented by formula (1), a structure in which a substituent is bonded to a benzene ring in the structure represented by formula (1), a structure represented by formula (2), a structure in which a substituent is bonded to a benzene ring in the structure represented by formula (2), a structure represented by formula (3), a structure in which a substituent is bonded to a benzene ring in the structure represented by formula (3), a structure represented by formula (4), or a structure in which a substituent is bonded to a benzene ring in the structure represented by formula (4) and an active ester compound and the structure represented by the formula (1), (2), (3), or (4) has a phenylene group or a naphthylene group and a hetero atom, a group in which a hydrogen atom is bonded to a hetero atom, or a carbonyl group. 2. The resin composition according to claim 1 , wherein the compound having a structure represented by the formula (1) claim 1 , a structure in which a substituent is bonded to a benzene ring in the structure represented by the formula (1) claim 1 , a structure represented by the formula (2) claim 1 , a structure in which a substituent is bonded to a benzene ring in the structure represented by the formula (2) claim 1 , a structure represented by the formula (3) claim 1 , a structure in which a substituent is bonded to a benzene ring in the structure represented by the formula (3) claim 1 , a structure represented by the formula (4) claim 1 , or a structure in which a substituent is bonded to a benzene ring in the structure represented by the formula (4) has an epoxy group within a moiety other than the structure represented by the formula (1) claim 1 ...

PHENYLENE ETHER COPOLYMER AND COMPOSITIONS COMPRISING SAME

A copolymer having the structure (I) wherein Q, Q, Q, Q, m, and n are defined herein. The copolymer can be formed by oxidative copolymerization of 2,4,6-trimethyIresorcinoI with a monohydric phenol. Also describes are a composition comprising the copolymer and a solvent, and a composition comprising the copolymer and a thermosetting resin. 2. The copolymer of claim 1 , wherein the sum of m and n is 3 to 15.3. The polymer of claim 1 , wherein each occurrence of Qand Qis independently hydrogen claim 1 , methyl claim 1 , N claim 1 ,N-diethylaminomethyl claim 1 , N-ethylaminomethyl claim 1 , and phenyl claim 1 , provided that at least one of Qand Qis not hydrogen; each occurrence of Qis hydrogen; and each occurrence of Qis hydrogen claim 1 , methyl claim 1 , or phenyl.4. The copolymer of claim 1 , wherein each occurrence of Qand Qis independently methyl or N claim 1 ,N-diethylaminomethyl or N-ethylaminomethyl; and each occurrence of Qand Qis hydrogen.5. The copolymer of claim 1 , wherein m and n are each claim 1 , on average claim 1 , greater than zero.6. The copolymer of claim 1 , whereinthe sum of m and n is 3 to 15;{'sup': 1', '2, 'each occurrence of Qand Qis methyl or N,N-diethylaminomethyl or N-ethylaminomethyl; and'}{'sup': 3', '4, 'each occurrence of Qand Qis hydrogen.'}7. A composition comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the copolymer of ; and'}{'sub': 3', '8', '3', '8', '4', '16', '6', '12', '1', '3', '3', '6', '2', '6', '2', '6, 'a solvent selected from the group consisting of C-Cketones, C-CN,N-dialkylamides, C-Cdialkyl ethers, C-Caromatic hydrocarbons, C-Cchlorinated hydrocarbons, C-Calkyl alkanoates, C-Calkyl cyanides, C-Cdialkyl sulfoxides, and mixtures thereof.'}8. The composition of comprising claim 7 , based on the total weight of the composition claim 7 ,10 to 50 weight percent of the copolymer; and50 to 90 weight percent of the solvent.9. The composition of comprising claim 7 , based on the total weight of the composition ...

CURED BODY AND MULTILAYERED SUBSTRATE

Provided is a cured body that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The cured body according to the present invention is a cured body of a resin composition that includes an epoxy compound, a curing agent, an inorganic filler, and a polyimide, in which the content of the inorganic filler is 30% by weight or more and 90% by weight or less in 100% by weight of the cured body, the cured body has a sea-island structure having a sea part and an island part, the island part has an average long diameter of 5 μm or less, and the island part contains the polyimide. 1. A cured body of a resin composition including an epoxy compound , a curing agent , an inorganic filler , and a polyimide ,a content of the inorganic filler being 30% by weight or more and 90% by weight or less in 100% by weight of the cured body,the cured body having a sea-island structure having a sea part and an island part, the island part having an average long diameter of 5 μm or less, and the island part containing the polyimide.2. The cured body according to claim 1 , whereina content of the polyimide is 3% by weight or more and 50% by weight or less in 100% by weight of components excluding the inorganic filler in the cured body.3. The cured body according to claim 1 , whereinthe curing agent contains an active ester compound.4. The cured body according to claim 1 , whereinthe resin composition contains a curing accelerator.5. The cured body according to claim 1 , whereinthe inorganic filler contains a silica.6. The cured body according to claim 5 , whereina content of the silica is 40% by weight or more in 100% by weight of the cured body.7. The cured body according claim 1 , whereinthe polyimide has an aliphatic structure having 6 or more carbon atoms.8. The cured body according to claim 1 , whereinthe polyimide is a polyimide excluding a polyimide having a siloxane skeleton.9. The cured body ...

EPOXY RESIN FORMULATIONS FOR TEXTILES, MATS AND OTHER FIBROUS REINFORCEMENTS FOR COMPOSITE APPLICATIONS

This invention relates to epoxy resin formulations for preforms to be used in molding processes, especially resin transfer molding processes and to methods for preparing the performs. The epoxy formulation is based on liquid or solid epoxy resins blended, with medium to high molecular weight, phenoxy resins. These formulations are highly compatible with epoxy curable injection resins, and more over are reacted in the polymeric matrix, without reducing the glass transition temperature (Tg) of the cured composite material. 1. An epoxy resin formulation for preforms , textiles or preimpregnated textiles comprising a blend of a solid phenoxy resin and an epoxy resin , wherein the solid phenoxy resin is present in an amount from 5 to 25 weight % and wherein the formulation is free of rubber modified thermoplastic resins.2. The epoxy formulations of with the solid phenoxy resin has an average molecular weight between 30 000 and 65 000 dalton and the epoxy resin is a liquid epoxy resin selected from a diglycidyl ether of biphenol claim 1 , bisphenol claim 1 , hydrocarbyl-substituted biphenol claim 1 , hydrocarbyl-substituted bisphenol claim 1 , phenol- or hydrocarbyl-substituted bisphenol-aldehyde novolac resin claim 1 , unsaturated hydrocarbon-phenol or hydrocarbyl-substituted phenol resin.3. The epoxy formulation of wherein the solid phenoxy resin has an average molecular weight between 30 000 to 65 000 dalton and the epoxy resin is a solid epoxy resin selected from a diglycidyl ether of biphenol claim 1 , bisphenol claim 1 , hydrocarbyl-substituted biphenol claim 1 , hydrocarbyl-substituted bisphenol claim 1 , phenol- or hydrocarbyl-substituted bisphenol-aldehyde novolac resin claim 1 , unsaturated hydrocarbon-phenol or hydrocarbyl-substituted phenol resin.4. The epoxy formulation of wherein the solid phenoxy resin is present in an amount between 8 and 23 weight %.5. The epoxy formulation of wherein the epoxy resin is a diglycidyl ether of biphenol having an epoxide ...

RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATED BOARD AND PRINTED WIRING BOARD

The present invention relates to a resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less. 1. A resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x) , when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis , and also surrounded by the x axis , is greater than an area surrounded by a stress-strain curve f2(x) , when the amount of strain is decreased from 0.3% , and also surrounded by the x axis , and the amount of change in the amount of strain when tensile stress is 0 , before and after applying tensile stress , is 0.05% or less.2. The resin composition according to claim 1 , wherein the cured product exhibits a feature in whichthe ratio of a second proportion of a change in stress relative to a change in the amount of strain between a first amount of strain when stress is 0 and a second amount of strain resulting from adding 0.1% to the first amount of strain on the curve f2(x) toa first proportion of a change in stress relative to a change in the amount of strain at an amount of strain of 0% to 0.1% on the curve f1(x) is 0.5 or less.3. The resin composition according to claim 1 , wherein the cured product exhibits a feature in which the ratio of tensile stress on a stress-strain curve f2(0 ...

INTERMEDIATE FOR RESIN MOLDED ARTICLE AND RESIN MOLDED ARTICLE

An intermediate for a resin molded article includes a curable epoxy resin, a reinforcing fiber, and a resin including at least one of an amide bond and an imide bond. 1. An intermediate for a resin molded article , comprising:a curable epoxy resin;a reinforcing fiber; anda resin including at least one of an amide bond and an imide bond.2. The intermediate for a resin molded article according to claim 1 ,wherein the resin including at least one of an amide bond and an imide bond covers a surface of the reinforcing fiber.3. The intermediate for a resin molded article according to claim 1 ,wherein the resin including at least one of an amide bond and an imide bond is polyamide.4. The intermediate for a resin molded article according to claim 2 ,wherein the resin including at least one of an amide bond and an imide bond is polyamide.5. The intermediate for a resin molded article according to claim 1 ,wherein a melting point of the resin including at least one of an amide bond and an imide bond is lower than a thermal curing temperature of the curable epoxy resin.6. The intermediate for a resin molded article according to claim 2 ,wherein a melting point of the resin including at least one of an amide bond and an imide bond is lower than a thermal curing temperature of the curable epoxy resin.7. The intermediate for a resin molded article according to claim 3 ,wherein a melting point of the resin including at least one of an amide bond and an imide bond is lower than a thermal curing temperature of the curable epoxy resin.8. The intermediate for a resin molded article according to claim 1 ,wherein a melting point of the resin including at least one of an amide bond and an imide bond is 180° C. or lower.9. The intermediate for a resin molded article according to claim 2 ,wherein a melting point of the resin including at least one of an amide bond and an imide bond is 180° C. or lower.10. The intermediate for a resin molded article according to claim 3 ,wherein a melting ...

PREPARATION METHOD FOR EMULSIFIER, EMULSIFIER, AQUEOUS EPOXY RESIN DISPERSION AND FORMULATION METHOD

A preparation method for an emulsifier, an emulsifier, an aqueous epoxy resin dispersion, and a formulation method. The preparation method for an emulsifier comprises reacting aminosulfonic acid and/or a sulfamate as a first reaction raw material with an epoxy resin in the presence of water, so as to obtain an ionic active emulsifier. The ionic active emulsifier molecule comprises at least one epoxy group from an epoxy resin and at least one sulfonic acid or sulfonate group from the first reaction raw material. The aqueous epoxy resin dispersion prepared by using the emulsifier has the characteristics of good stability and good corrosion resistance after curing, and can be used in the fields of coatings, adhesives, etc. 1. A preparation method for an ionic active emulsifier , comprising: reacting sulfamic acid and/or sulfamate as a first reaction raw material with an epoxy resin to obtain the ionic active emulsifier , wherein the molecule of the ionic active emulsifier comprises at least one epoxy group from the epoxy resin and at least one sulfonic acid or sulfonate group from the first reaction raw material.2. The preparation method according to claim 1 , wherein in the reaction system for preparing the ionic active emulsifier claim 1 , the molar ratio of the total amount of epoxy groups provided by the epoxy resin to the total amount of active hydrogens comprised in the amino (amine) groups in the first reaction raw material is at least 2:1.313-. (canceled)14. The preparation method according to claim 1 , wherein in the reaction system for preparing the ionic active emulsifier claim 1 , the mass ratio of water to the first reaction raw material is not less than 1:20.15. The preparation method according to claim 1 , wherein in the process of preparing the ionic active emulsifier claim 1 , after the first reaction raw material is mixed with water claim 1 , the mixture is reacted with the epoxy resin optionally in the presence of a solvent used for reducing the ...

ADDUCTS AS TOUGHENERS IN THERMOSETTABLE EPOXY SYSTEMS

A liquid adduct consisting essentially of a reaction product of (a) an aliphatic epoxy resin, and (b) an isocyanate compound, wherein the viscosity of the adduct comprises less than about 60 Pa-s at about 25° C. is disclosed. The adduct can be used in an epoxy resin composition. 1. A liquid adduct consisting essentially of a reaction product of(a) an aliphatic epoxy resin, and(b) an isocyanate compound; wherein the viscosity of the adduct comprises less than about 60 Pa-s at about 25° C.2. The adduct of claim 1 , wherein the epoxy resin comprises a polyglycol epoxy resin.3. The adduct of claim 1 , wherein the polyglycol epoxy resin comprises polypropylene glycol claim 1 , polyethylene glycol claim 1 , and mixtures thereof.4. (canceled)5. The adduct of wherein the isocyanate compound is a polyfunctional isocyanate compound.6. (canceled)7. The adduct of including (c) a catalyst.8. The adduct of wherein the weight ratio of (a) to (b) is between 60 to 98 for component (a) and 40 to 2 for component (b).9. The adduct of wherein the isocyanate compound is selected from the group consisting of MDI claim 1 , TDI claim 1 , hydrogenated MDI claim 1 , hydrogenated TDI claim 1 , and combinations thereof.10. The adduct of wherein the polyglycol epoxy resin is selected from the group consisting of poly propyleneglycol diglycidyl ether claim 1 , dipropyleneglycol diglycidyl ether claim 1 , 1 claim 1 ,6-Hexanediol diglycidyl ether claim 1 , 1 claim 1 ,4-Butanediol diglycidyl ether and combinations thereof.12. The adduct of wherein the catalyst is selected from the group consisting of 2-methyl imidazole claim 7 , 2-phenyl imidazole claim 7 , an imidazole derivative claim 7 , 1 claim 7 ,8-diazabicyclo[5.4.0]undec-7-ene (DBU) claim 7 , 2-methylimidazole-epoxy adduct claim 7 , an isocyanate-amine adduct claim 7 , and combinations thereof.13. A composition comprising (a) the adduct of ; (b) at least one epoxy resin; and (c) at least one hardener.14. The composition according to claim 13 ...

COMPOSITION FOR MANUFACTURING VITRIMER RESINS OF EPOXY/ANHYDRIDE TYPE COMPRISING A POLYOL

The present invention relates to a composition containing, besides a thermosetting resin of epoxy type and/or a hardener, at least one vitrimer effect catalyst and at least one polyol selected from linear, branched or cyclic alkanes containing at least two hydroxyl functions. This composition enables the manufacture of vitrimer resins, that is to say resins that can be deformed in the thermoset state. It also relates to an object obtained from this composition and also to a process for deforming this object. 1. A composition comprising:at least one of a thermosetting resin of epoxy type or a curing agent,at least one polyol, andat least one vitrimer effect catalyst;wherein the polyol is a compound containing at least two hydroxyl functions, selected from the group consisting of: diols; polyalkylene glycols; triols; tetraols; polyvinyl alcohols, and mixtures thereof;and wherein the vitrimer effect catalyst is selected from the group consisting of:pyridines; phosphazenes; compounds of guanidine type; organic and inorganic metal salts and complexes and organometallic compounds, of metals selected from the group consisting of: rare earth metals, alkali metals and alkaline earth metals; and mixtures thereof.2. The composition as claimed in claim 1 , wherein the polyol is selected from the group consisting of 1 claim 1 ,3-propylene glycol claim 1 , 1 claim 1 ,3-butanediol claim 1 , 1 claim 1 ,4-butanediol claim 1 , 2 claim 1 ,5-hexanediol claim 1 , 1 claim 1 ,6-hexanediol claim 1 , butadiene diol claim 1 , ethylene glycol claim 1 , 1 claim 1 ,2-propylene glycol claim 1 , neopentylglycol; polyethylene glycols (PEGs) claim 1 , polypropylene glycols (PPGs); glycerol claim 1 , trimethylolethane claim 1 , trimethylolpropane (TMP) claim 1 , trimethylolbutane claim 1 , 1 claim 1 ,2 claim 1 ,6-hexanetriol; erythritol claim 1 , pentaerythritol; and mixtures thereof.3. The composition as claimed in claim 1 , wherein the polyol represents from 0.5 mol % to 40 mol % of hydroxyl ...

THERMOSETTING RESIN COMPOSITION FOR LDS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

A thermosetting resin composition for laser direct structuring (LDS) which is used for LDS includes the following components: (A) a thermosetting resin; (B) an inorganic filler; (C) a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays; and (D) a coupling agent, in which the component (A) contains one or more selected from the group consisting of an epoxy resin and a bismaleimide resin, and at least one of the following conditions is satisfied.

THERMOSETTING RESIN COMPOSITION

The invention provides a thermosetting resin composition that demonstrates superior peel strength while retaining excellent heat resistance and tensile shear adhesion strength. The thermosetting resin composition comprises: an epoxy resin A containing an epoxy group and a thermoplastic resin B containing a functional group f having reactivity with an epoxy group, the thermoplastic resin B being obtained by modifying a thermoplastic resin b1 containing an unsaturated bond with a nitrone b2 containing the functional group f, and the content of the nitrone b2 relative to the unsaturated bonds being not less than 0.5 mol % and less than 10 mol %, and the content of the thermoplastic resin B being from 10 to 50 parts by mass per 100 parts by mass of the epoxy resin A. 1. A thermosetting resin composition comprising:an epoxy resin A containing an epoxy group; anda thermoplastic resin B containing a functional group f having reactivity with an epoxy group,the thermoplastic resin B being obtained by modifying a thermoplastic resin b1 containing an unsaturated bond with a nitrone b2 containing the functional group f, and a content of the nitrone b2 relative to the unsaturated bonds being not less than 0.5 mol % and less than 10 mol %, anda content of the thermoplastic resin B being from 10 to 50 parts by mass per 100 parts by mass of the epoxy resin A.2. The thermosetting resin composition according to claim 1 , wherein the functional group f is a nitrogen-containing group having reactivity with an epoxy group.3. The thermosetting resin composition according to claim 2 , wherein the functional group f which is the nitrogen-containing group is an imidazole residue.4. The thermosetting resin composition according to claim 1 , wherein the thermoplastic resin b1 is a diene rubber component.5. The thermosetting resin composition according to claim 1 , further comprising a curing agent C containing a functional group having reactivity with an epoxy group.6. The thermosetting resin ...

CURABLE COMPOSITIONS

Embodiments include a curable composition comprising an epoxy resin, a non-halogen flame retardant agent comprising at least two of an aryl-cyanato group and at least two of a phosphorus group, and a styrene and maleic anhydride copolymer. Embodiments include method of preparing the curable composition, prepregs that include a reinforcement component and the curable composition, and an electrical laminate formed with the curable composition. 2. (canceled)5. The curable composition of claim l , where Aris benzene.6. The curable composition of claim 1 , where an epoxy group of the epoxy resin to a maleic anhydride group of the styrene and maleic anhydride copolymer has a molar ratio within a range of from 1.0:1.0 to 2.6:1.0.7. The curable composition of claim 1 , where an epoxy group of the epoxy resin to a maleic anhydride group of the styrene and maleic anhydride copolymer has a molar ratio within a range of from 1.3:1.0 to 1.8:1.0.8. The curable composition of claim 1 , where an epoxy group of the epoxy resin to a maleic anhydride group of the styrene and maleic anhydride copolymer has a molar ratio within a range of from 1.3:1.0 to 1.4:1.0.9. The curable composition of claim 1 , where the curable composition has a phosphorus content within a range of from 0.1 weight percent to 3.5 weight percent based on a total weight of the curable composition.10. The curable composition of claim 1 , where the curable composition has a phosphorus content within a range of from 2.2 weight percent to 3.0 weight percent based on the total weight of the curable composition.11. The curable composition of claim 1 , where the styrene and maleic anhydride copolymer has a molar ratio of styrene to maleic anhydride within a range of from 1:1 to 8:1.12. The curable composition of claim 1 , where the non-halogen flame retardant agent is 1 weight percent to 90 weight percent of a total weight of the curable composition.13. The curable composition of claim 11 , where the non-halogen flame ...