Rigid polyurethanepolyisocyanurate foams and process for preparing the same

УСТАНОВКА ДЛЯ ПОЛУЧЕНИЯ УЛЬТРАФИЛЬТРАЦИОННОЙ ТЕРМОСТОЙКОЙ ПОЛИМЕРНОЙ МЕМБРАНЫ

1. Установка для получения ультрафильтрационной термостойкой полимерной мембраны, содержащая аппарат для приготовления формовочного раствора, фильеру, ванны с промывочными растворами, термостат для сушки и термообработки получаемой мембраны, отличающаяся тем, что она снабжена рабочей камерой для приготовления формовочного раствора, имеющей контейнеры с исходными компонентами, часть контейнеров соединена патрубками со смесителем, сообщенным с рабочей камерой, рабочее пространство аппарата соединено с вакуумной установкой для отвода парогазовых фаз, а выходной патрубок аппарата соединен с фильерой, имеющей регулируемый зазор, в этот патрубок введены детекторы, соединенные с жидкостным хроматографом, при этом установка оснащена ультрафильтрационной ячейкой для исследования транспортных и структурных характеристик получаемой мембраны. 2. Установка по п.1, отличающаяся тем, что в качестве термостата выбран прибор, имеющий ступенчатую регулировку температуры. 3. Установка по п.1, отличающаяся тем, что в качестве хроматографа использован двухдетекторный хроматограф с рефрактометрическим и ультрафиолетовым детекторами. 4. Установка по п.1, отличающаяся тем, что в качестве прибора исследования мембраны использована ультрафильтрационная ячейка. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 77 273 (13) U1 (51) МПК C08L 45/00 C08L 79/00 C08L 99/00 (2006.01) (2006.01) (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21), (22) Заявка: 2008119542/22 , 20.05.2008 (24) Дата начала отсчета срока действия патента: 20.05.2008 (45) Опубликовано: 20.10.2008 (73) Патентообладатель(и): Институт высокомолекулярных соединений Российской Академии наук (ИВС РАН) (RU) Ñòðàíèöà: 1 U 1 7 7 2 7 3 R U U 1 Формула полезной модели 1. Установка для получения ультрафильтрационной термостойкой полимерной мембраны, содержащая аппарат для приготовления формовочного раствора, фильеру, ванны с промывочными растворами, термостат для сушки ...

УСТАНОВКА ДЛЯ ПОЛУЧЕНИЯ КОМПОЗИТНЫХ ПОЛИМЕРНЫХ МЕМБРАН

1. Установка для получения композитных полимерных мембран, содержащая подложку для формирования мембраны, ультразвуковой излучатель, сушильную камеру, контейнеры с исходными компонентами, отличающаяся тем, что она снабжена дополнительными контейнерами с дополнительными исходными компонентами для формирования поверхностного слоя мембраны, имеет смеситель полимера и фуллерена, реакционную камеру, содержащую контейнеры с реагентами, подаваемыми в реакционную камеру для процесса первапорационного разделения равновесной смеси реакции этерификации четырехкомпонентной системы. 2. Установка по п.1, отличающаяся тем, что контейнеры заполнены компонентами соответственно: контейнер с хлороформом, контейнер с толуолом, контейнер с раствором фуллеренсодержащего композита в смеси хлороформ-толуол. 3. Установка по п.1, отличающаяся тем, что дополнительные контейнеры заполнены соответственно: этанолом, водой, этилацетатом, уксусной кислотой. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 88 009 (13) U1 (51) МПК C01B C08L C08L C08L 31/00 (2006.01) 45/00 (2006.01) 79/00 (2006.01) 99/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21), (22) Заявка: 2009129016/22, 27.07.2009 (24) Дата начала отсчета срока действия патента: 27.07.2009 (45) Опубликовано: 27.10.2009 (73) Патентообладатель(и): Учреждение Российской академии наук Институт высокомолекулярных соединений РАН (RU) U 1 8 8 0 0 9 R U Ñòðàíèöà: 1 ru CL U 1 Формула полезной модели 1. Установка для получения композитных полимерных мембран, содержащая подложку для формирования мембраны, ультразвуковой излучатель, сушильную камеру, контейнеры с исходными компонентами, отличающаяся тем, что она снабжена дополнительными контейнерами с дополнительными исходными компонентами для формирования поверхностного слоя мембраны, имеет смеситель полимера и фуллерена, реакционную камеру, содержащую контейнеры с реагентами, подаваемыми в реакционную камеру для процесса ...

Stable Solution of the Polymer Prepared from N,O-Heterocycles and its Preparation Method and Use

A stable solution of the polymer prepared from N,O-heterocyclic compound and its preparing method are provided, wherein the stable solution is prepared by making the N,O-heterocyclic compound of formulae I or II carry out a ring-opening polymerization: wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification. The stable solution can be used as a hardener for curing epoxy resin.

Composite article and method of manufacture

The present invention relates to a composite article and to a process for manufacturing the composite article. The composite article comprises multiple layers including high tenacity fibers incorporated into a fabric and a core thermoplastic resin. The fabric may be coated with a surface treatment agent and a polymer matrix resin. Single or multiple layers of the composite articles may be formed into a composite part having high strength, rigidity, fast molding cycle time and extremely good conformability in a 3-dimensional mold. The composite parts formed by this process have high part strength in all directions.

Porous polymeric materials for hydrogen storage

A porous polymer, poly-9,9′-spirobifluorene and its derivatives for storage of H 2 are prepared through a chemical synthesis method. The porous polymers have high specific surface area and narrow pore size distribution. Hydrogen uptake measurements conducted for these polymers determined a higher hydrogen storage capacity at the ambient temperature over that of the benchmark materials. The method of preparing such polymers, includes oxidatively activating solids by CO 2 /steam oxidation and supercritical water treatment.

Composition, coated film formed of the composition, layered product containing the coated film, and electronic device incorporating the layered product

An object is to provide a composition that has good viscosity stability and flowability at the time of processing, good shape retention after the processing, and good drying property in a temperature range of not degrading the conductor layer at the time of drying and that enables a coated film excellent in strength of adhesion with metal•polyimide, flame resistance, heat resistance, flexibility, mechanical properties, and chemical resistance to obtained after being dried. To meet this object, a composition is prepared containing (A) polyimide and (B) mixed solvent of two kinds or more, and the solubility parameter of the mixed solvent of two kinds or more ranges from 9 to 14.

Alignment film, composition for forming alignment film and liquid crystal display device

Disclosed is a liquid crystal display device including: a first substrate and a second substrate, one of which is transparent; a liquid crystal layer disposed between the first substrate and the second substrate; a group of electrodes for applying an electric field to the liquid crystal layer, which is formed on one of the first substrate and the second substrate; a plurality of active elements connected to the group of electrodes; and an alignment film disposed on one of the first substrate and the second substrate, wherein the alignment film contains a polyimide and a precursor of the polyimide, each of which is formed from a diamine and an acid anhydride, and the diamine contains a first diamine having an acidic group and a second diamine having a nitrogen atom-containing functional group other than two amino groups.

Composition for Solid Electrolyte and Solar Cell Using the Same

A composition for a solid electrolyte includes a polymer compound (A) and a charge transfer material. The polymer compound (A) is obtained by polymerizing a monomer (a) comprising a monomer (a-2) having chelating ability. The charge transfer material is preferably a carbon material and/or a π-conjugated polymer (β). When a polymer electrolyte layer of a dye-sensitized solar cell is formed from the above solid electrolyte, efficient charge transfer and sufficient charge life can be reconciled with each other.

Polyimide precursor solution composition containing filler, and polyimide film using same

There is provided a filler-containing dispersion solution exhibiting very improved filler dispersion stability by dispersing a filler in a solvent using a polyimide precursor solution composition. Furthermore, in the filler-containing dispersion solution, a tetracarboxylic dianhydride and/or its derivative is reacted with a diamine compound to prepare a filler-containing polyimide precursor solution composition, which is then used to provide a polyimide in which a filler is dispersed.

Liquid crystal polyimide, liquid crystal resin composition containing same, and resin film for semiconductor elements

A liquid crystal polyimide, containing: repeating units of formula (I) and having liquid crystallinity, wherein A 1 and A 2 are each independently a tetravalent residue of a tetracarboxylic acid, B 1 is a residue of a bis(amino)polysiloxane of formula (II), and C 1 is a residue of an organic diamine, wherein R 1 to R 6 are each independently a lower alkyl group, x is from 0 to 10, D 1 is an alkylene group, y is 0 or 1, and Z 1 is selected from the group consisting of —H, —CH 3 , CF 3 , —F, —CN and —NO 2 . In addition, a liquid crystal resin composition and a resin film for a semiconductor element containing the liquid crystal polyimide.

Binder for lithium secondary battery, negative electrode for lithium secondary battery, lithium secondary battery, binder precursor solution for lithium secondary battery, and method for manufacturing negative electrode for lithium secondary battery

Provided is a binder capable of realizing a lithium secondary battery that includes a negative electrode including a negative-electrode active material layer containing at least one of silicon and a silicon alloy as a negative-electrode active material and also containing a binder and has an excellent charge-discharge cycle characteristic. The binder for the lithium secondary battery contains a polyimide resin that is formed by imidizing either a tetracarboxylic acid or a tetracarboxylic anhydride and a diamine, the polyimide resin having a hydrolyzable silyl group.

Charge-dynamic polymers and delivery of anionic compounds

The present invention provides dynamic charge state cationic polymers that are useful for delivery of anionic molecules. The dynamic charge state cationic polymers are designed to have cationic charge densities that decrease by removal of removable functional groups from the polymers. The present invention also provides interpolyelectrolyte complexes containing the polymers complexed to a polyanion. Methods for using the interpolyelectrolyte complexes to deliver anionic compounds are also provided.

Stable reactive thermosetting formulations of reducing sugars and amines

The present invention provides stable aqueous thermosetting binder compositions having a total solids content of 15 wt. % or higher, preferably, 20 wt. % or higher, and having extended shelf life comprising one or more reducing sugar, one or more primary amine compound, and one or more stabilizer acid or salt having a pKa of 8.5 or less. The total amount of stabilizer used may range from 5 to 200 mole %, based on the total moles of primary amine present in the binder. The stabilizer may be an organic stabilizer chosen from a monocarboxylic acid, a dicarboxylic acid, a fatty acid, an acid functional fatty acid ester, an acid functional fatty acid ether, or an inorganic stabilizer chosen from a mineral acid, a mineral acid amine or ammonia salt, and a Lewis acid, and mixtures thereof. The compositions can be used to provide binders for substrate materials including, for example, glass fiber.

Tire with component containing polybenzobisoxazole short fiber and epoxidized polyisoprene

The present invention is directed to a pneumatic tire comprising at least one component selected from the group consisting of apexes, flippers and chippers, the at least one component comprising a rubber composition, the rubber composition comprising a diene based elastomer and from 1 to 30 parts by weight, per 100 parts by weight of elastomer (phr), of a polybenzobisoxazole (PBO) short fiber having a length ranging from 0.5 to 20 mm having a thickness ranging from 10 to 30 microns, and from 1 to 50 phr of an epoxidized polyisoprene having a number-average molecular weight of 5000 to 100000.

Sol-gel based antireflective (ar) coatings with controllable pore size using organic nanocrystals and dendrimers

Embodiments of the invention relate generally to methods and compositions for forming porous low refractive index coatings on substrates. In one embodiment, a method for forming a porous coating on a substrate is provided. The method comprises coating a substrate with a sol-gel composition, comprising at least one porosity forming agent, wherein the porosity forming agent is selected from at least one of dendrimers and organic nanocrystals and removing the at least one porosity forming agent to form the porous coating. Use of at least one of the dendrimers and organic nanocrystals leads to the formation of stable pores with larger volume fraction in the film. Further, the size and interconnectivity of the pores may be controlled via selection of the organic nanocrystal or dendrimer structure, the total organic nanocrystal or dendrimer molecule fraction, polarity of the organic nanocrystal or dendrimer molecule and solvent, and other physiochemical properties of the gel phase.

Electrically insulating and thermally conductive composition and electronic device

An embodiment of the invention provides an electrically insulating and thermally conductive composition including 5-80 parts by weight of a resin, 20-95 parts by weight of an electrically insulating and thermally conductive powder, and 0.0001-2 parts by weight of a graphene. Another embodiment of the invention also provides an electronic device including the electrically insulating and thermally conductive composition.

Thermally and dimensionally stable polyimide films and methods relating thereto

The present disclosure is directed to a polyimide film. The film is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

Coverlay compositions and methods relating thereto

The present disclosure is directed to a coverlay comprising a polyimide film and an adhesive layer. The polyimide film is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

Polyimide resins for high temperature wear applications

Polyimide resin compositions that contain an end-capped rigid aromatic polyimide, graphite and, optionally, a filler selected from sepiolite, attapulgite, kaolinite, or a mixture thereof, are found to exhibit low wear at high temperatures. Such compositions are especially useful in molded articles that are exposed to wear conditions at high temperatures such as aircraft engine parts.

Laminate structure, method for manufactuing laminate structure, electronic element array, image displaying medium, image displaying apparatus, diamine, polyamic acid, and polyimide

Disclosed is a laminate structure including a substrate, a wettability changing layer, and an electrical conductor layer, wherein the wettability changing layer and the electrical conductor layer are laminated on the substrate in order, wherein the wettability changing layer contains a polyimide, wherein the polyimide is obtainable by dehydrating and ring-opening a polyamic acid, wherein the polyamic acid is obtainable by ring-opening and addition-polymerizing a diamine and a tetracarboxylic acid dianhydride, wherein the diamine includes a compound represented by a general formula of: or a compound represented by a general formula of: wherein each of R 1 and R 2 in formula ( 1 ) is defined in the specification, and wherein R 1 in formula ( 2 ) is defined in the specification.

Photoaligning material with lateral substitution

The present invention relates to photoaligning material with lateral substitution, compositions thereof, and its use for optical and electro optical devices, especially liquid crystal devices (LCDs).

Polyetherimide compositions and methods for the manufacture and use thereof

This disclosure relates to polyetherimide compositions whose residual phenolic monomers exhibit little or no estradiol binding activity. Also disclosed are methods for making the disclosed polyetherimides and articles of manufacture comprising the disclosed polyetherimides.

NANOCOMPOSITE COATINGS FOR THREADED CONNECTIONS

A coating which provides corrosion resistance, wear resistance, and, optionally, lubrication, for deposition on a threaded article is disclosed. The coating comprises a polymer matrix, such as a polyimide, which is modified with small amounts of a fluorine containing polymer modifier, as well as other compounds or additives to improve performance of the coating. Additionally, the coating can further comprise a solid lubricant or an anticorrosion compound dispersed within the polymer matrix. 1. A threaded article comprising: a polymer selected from the group consisting of epoxies and polyimides;', 'about 0.5 to about 15 wt. % of a fluorine containing polymer modifier;', 'about 5 to about 15 wt. % of an anticorrosion compound;', 'about 10 to about 15 wt. % of an adhesion additive comprising zinc oxide, said zinc oxide provided in an effective amount to promote adhesion of the first coating composition to the thread portion., 'a first coating composition deposited on a thread portion of the threaded article, comprising2. The threaded article of claim 1 , wherein the mean diameter of the zinc oxide ranges between approximately 10 nm to approximately 10 μm.3. The threaded article of claim 1 , wherein the fluorine containing polymer modifier comprises perfluoropolyether.4. The threaded article of claim 1 , wherein the first coating composition comprises a single layer.5. The threaded article of claim 1 , wherein the first coating composition further comprises about 3 to about 30 wt. % of a solid lubricant.6. The threaded article of claim 5 , wherein the solid lubricant is selected from the group consisting of graphite claim 5 , molybdenum disulfide claim 5 , HDPE and PTFE.7. The threaded article of claim 1 , wherein the first coating composition further comprises at least one of:about 3 to about 8 wt % zinc;about 1 to about 5 wt. % zinc(II)phosphate;about 1 to about 5 wt. % Carbon black; andabout 10 to about 20 wt. % of polydimethylsiloxane.8. The threaded article of ...

WATER VAPOR BARRIER FILM AND METHOD FOR PRODUCING SAME

The present invention provides a film for a back sheet of a solar cell exhibiting excellent water vapor barrier properties, water resistance and gas barrier properties, has flexibility and mechanical strength and has excellent heat stability, and a method for producing the film. 1. A laminated film , comprising a clay membrane coated and dried on a resin film substrate , wherein:the clay membrane is formed of a clay and an additive consisting of a thermoplastic or thermosetting resin;a weight ratio of the clay relative to total solid in the clay membrane is 60 to 90% by weight;a water resistance imparting heat treatment is performed after coating and drying of the clay membrane on the resin film substrate; and{'sup': −15', '2', '−1', '−1', '2, 'the resin film of the resin film substrate has an oxygen gas transmission coefficient at a room temperature of less than 4.0×10cmscmHg, a volume resistivity in the perpendicular direction of 10 MΩ or more, and a water vapor transmission rate of less than 3 g/m·day (test method: Dish method, test period: 140 hr).'}2. The laminated film according to claim 1 , wherein the clay is purified bentonite or synthetic smectite and at least 90% by mole of intercalating exchangeable ions of the clay is lithium ion.3. The laminated film according to claim 1 , wherein the additive is a polyimide.4. The laminated film according to claim 1 , wherein the resin film substrate comprises a polyethylene terephthalate (PET).5. A method for producing the laminated film according to claim 1 , the method comprising:applying a clay paste prepared from a clay, an additive consisting of a thermoplastic or thermosetting resin, and a dispersion medium as a solvent to a resin film having a flat surface, to form a coated substrate;drying the coated substrate;removing the dispersion medium; andperforming a water resistance imparting heat treatment to form the laminated film,wherein:the clay comprises lithium ion which is at least 90% by mole of intercalating ...

PHOTOSENSITIVE POLYMIDES

The invention pertains to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board. 12. A photosensitive composition claim 1 , which comprises claim 1 , based on the total weight of the composition claim 1 , at least 1% by weight of the photosensitive polyimide according to and at least one photoinitiator.13. The photosensitive composition according to claim 12 , further comprising a reactive monomer or oligomer.14. The photosensitive composition according to or claim 12 , which is a liquid photo resist composition or a solid dry film photo resist composition. The invention relates to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board.Electronic products recently have more and more miniaturized and lighter in weight. In accordance with this, various electronic parts are required to be downsized. Based on the ground that flexible printed wiring boards have the advantage of flexibility and light weight, their demand greatly increases.With respect to the materials used, coverlay films can be divided into the following three types: photosensitive coverlay film (first type), non-photosensitive coverlay film (second type) and thermal plastic coverlay film (third type). The photosensitive coverlay film (first type) also can be divided into polyimide based coverlay film (PT based coverlay film) and non-polyimide based coverlay film (non-PI based coverlay film). Since the non-PI based coverlay film has poor heat resistance, higher ...

POLYMERS FOR DELIVERING MOLECULES OF INTEREST

The present invention relates to a new class of cationic polymers that self-assemble with a pH-sensitive dissolution switch, and their uses to deliver molecules of interest to a cell. The present invention also relates to compositions comprising said cationic polymers non-covalently associated with a molecule of interest, in particular with a siRNA. 134-. (canceled)36. The polyethylenimine of claim 35 , wherein the polyethylenimine is branched.37. The polyethylenimine of claim 35 , wherein the polyethylenimine has a molecular weight of at least 400 Da or between 500 Da to 200 claim 35 ,000 Da.38. The polyethylenimine of claim 35 , wherein the amine functions are modified or substituted by a radical X at a ratio of p from 0.1 to 0.9 claim 35 , or a ratio of p from 0.15 to 0.5 claim 35 , or a ratio of p from 0.2 to 0.4 claim 35 , or a ratio of p of about 0.30.39. The polyethylenimine of claim 35 , wherein R is independently selected from the group consisting of H claim 35 , OH claim 35 , OCH claim 35 , and NH.40. The polyethylenimine of claim 35 , wherein r is 0 or 1.42. The polyethylenimine of claim 41 , wherein Z is S.46. The polyethylenimine of claim 35 , wherein at least 3 or 4 of the 5 R are H and the other R is selected from the group consisting of H claim 35 , OH claim 35 , NH claim 35 , and OCH.47. The polyethylenimine of claim 44 , wherein at least 3 or 4 of the 5 R are H and the other R is selected from the group consisting of H claim 44 , OH claim 44 , NH claim 44 , and OCH.48. The polyethylenimine of claim 45 , wherein at least 3 or 4 of the 5 R are H and the other R is selected from the group consisting of H claim 45 , OH claim 45 , NH claim 45 , and OCH.50. The polyethylenimine of claim 49 , wherein Z is O.52. The polyethylenimine of claim 51 , wherein Z is S and r is O.54. The polyethylenimine of claim 53 , wherein Z is O.56. A composition comprising a polyethylenimine according to and a molecule of interest non-covalently associated with the ...

Polysiloxane-grafted polyimide resin composition and applications thereof

A polysiloxane-grafted polyimide resin composition includes a polysiloxane-grafted polyimide resin, and a solvent. The polysiloxane-grafted polyimide resin is represented by formula (I): wherein W represents a tetravalent organic group, R represents a trivalent organic group, and X represents a polysiloxane-containing group.

Liquid crystal display and method of manufacturing the same

A liquid crystal display includes a first substrate, a second substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The first substrate includes a first base substrate, a pixel electrode disposed on the first base substrate and including a plurality of branch portions, and a first alignment layer disposed on the pixel electrode. The second substrate includes a second base substrate, a common electrode disposed on the second base substrate, and a second alignment layer disposed on the common electrode.

High Capacity Oxoanion Chelating Media From Hyperbranched Macromolecules

A resin is provided for selectively binding to certain anions in aqueous solution. The beads are prepared by cross-linking macromolecules such as hyperbranched PEI, and functionalizing with groups containing vicinal diol moieties. 1. An oxoanion-selective microparticle comprising a hyperbranched macromolecular structure (A) comprising a plurality of branches , a plurality of terminal functional groups , and a plurality of cross-linking moieties within the same molecular structure;wherein each of said plurality of branches comprises an N-substituted or N,N-substituted n-aminoalkyl moiety (B) comprising one or two substituent moieties; (a) another of said plurality of branches;', '(b) one of the plurality of terminal functional groups; or', '(c) one of the cross-linking moieties attached at a first cross-linking end, wherein the cross-linking moiety further comprises a second cross-linking end, by which the moiety is also one of said substituent moieties of one of said plurality of branches at a different location within the hyperbranched macromolecular structure A;, 'wherein each of said substituent moieties comprises one of the followingwherein A has a molecular weight of at least 1500 grams per mole;wherein A comprises essentially no primary amine moieties; andwherein each of the plurality of terminal functional groups comprises a vicinal diol moiety.2. The microparticle of claim 1 , wherein the cross-linking moieties consist of a carbon backbone of at least three carbon atoms claim 1 , each carbon atom optionally substituted with one or more functional groups.3. The microparticle of claim 2 , wherein the cross-linking moieties are selected from the group consisting of —CH—CHOH—CH— and —CH—CH—CH—4. The microparticle of claim 1 , wherein the terminal functional groups are 2 claim 1 ,3-dihydroxypropyl.5. The microparticle of claim 1 , wherein the terminal functional groups are (2R claim 1 ,3S claim 1 ,4R claim 1 ,5R)-2 claim 1 ,3 claim 1 ,4 claim 1 ,5 claim 1 ,6- ...

Fuser member

The present teachings provide a fuser member. The fuser member includes a substrate layer comprising a thermoplastic polyimide/polybenzimidazole blend. A method of making the fuser member is provided.

Composition, composite prepared from the composition, electrode using the composition or the composite, composite membrane including the composite, and fuel cell including the composite membrane

A composition including a cross-linkable compound and at least one selected from compounds represented by Formula 1, a composite obtained from the composition, an electrode including the composition or the composite, a composite membrane including the composite, and a fuel cell including the composite membrane, wherein, in Formula 1, a and R are as defined in the specification.

FINE GRAPHITE PARTICLES, GRAPHITE PARTICLE-DISPERSED LIQUID CONTAINING THE SAME, AND METHOD FOR PRODUCING FINE GRAPHITE PARTICLES

Fine graphite particles include plate-like graphite particles; and an aromatic vinyl copolymer which is adsorbed on the plate-like graphite particles, and which contains a vinyl aromatic monomer unit represented by the following formula (1): 1. Fine graphite particles comprising:plate-like graphite particles; and {'br': None, 'sub': '2', '—(CH—CHX)—\u2003\u2003(1)'}, 'an aromatic vinyl copolymer which is adsorbed on the plate-like graphite particles, and which contains a vinyl aromatic monomer unit represented by the following formula (1)(in the formula (1), X represents a phenyl group, a naphthyl group, an anthracenyl group, or a pyrenyl group, provided that these groups may have each a substituent).2. The fine graphite particles according to claim 1 , whereinthe aromatic vinyl copolymer comprises the vinyl aromatic monomer unit and another monomer unit derived from at least one monomer selected from the group consisting of (meth)acrylic acid, (meth)acrylates, (meth)acrylamides, vinylpyridines, maleic anhydride, and maleimides.3. The fine graphite particles according claim 1 , whereinthe aromatic vinyl copolymer is a block copolymer.4. The fine graphite particles according to claim 1 , whereinthe plate-like graphite particles have thicknesses of 0.3 to 1000 nm.5. The fine graphite particles according to claim 1 , whereinat least one functional group selected from the group consisting of hydroxyl group, carboxyl group, and epoxy group is bonded to 50% or less of all carbon atoms near a surface of the plate-like graphite particle.6. The fine graphite particles according to claim 1 , further comprising at least one hydrocarbon chain which is bonded to the aromatic vinyl copolymer claim 1 , and which is selected from the group consisting of alkyl chains claim 1 , oligoolefin chains claim 1 , and polyolefin chains.7. The fine graphite particles according to claim 6 , whereinthe aromatic vinyl copolymer has a functional group, andthe hydrocarbon chain is formed by ...

AMORPHOUS HEAT-FUSIBLE FIBER, FIBER STRUCTURE, AND HEAT-RESISTANT MOLDED ARTICLE

Provided are a heat-fusible fiber having excellent heat resistance, flame retardancy and dimensional stability; a fiber structure comprising the heat-fusible fiber; and a molded article produced by applying a heat fusion treatment to the fiber structure and having excellent heat resistance. The heat-fusible fiber comprises an amorphous PES type polymer (A) not substantially having a melting point and an amorphous PEI type polymer (B) in the mixture ratio (weight) of (A)/(B)=5/95 to 95/5, the fiber having a single glass transition temperature in the range between 80° C. and 200° C., and being amorphous. The fiber structure comprises 10% by weight or higher of the amorphous heat-fusible fiber. The molded article comprises at least a fiber structure comprising 10% by weight or higher of the amorphous heat-fusible fiber, to be fusion-bonded at a temperature higher than the glass transition temperature of the amorphous heat-fusible fiber. 1: An amorphous heat-fusible fiber , comprising:(A) an amorphous polyester not substantially having a melting point; and(B) an amorphous polyetherimide,wherein:a weight ratio of (A)/(B) is 5/95 to 95/5; andthe fiber has a single glass transition temperature in a range between 80° C. and 200° C.2: The amorphous heat-fusible fiber of claim 1 , wherein the amorphous polyester (A) comprises a terephthalic acid component (D) and an isophthalic acid component (E) claim 1 , wherein a copolymerization ratio (mole % ratio) of (D)/(E) ranges from 70/30 to 40/60.4: The amorphous heat-fusible fiber of claim 1 , having a dry heat shrinkage percentage of 3% or less at a temperature of (glass transition temperature −10) ° C.5: The amorphous heat-fusible fiber of claim 1 , wherein the fiber is a melt-spun and un-drawn fiber.6: A fiber structure claim 1 , comprising 10% by weight or higher of the amorphous heat-fusible fiber of .7: A heat-resistant molded article claim 1 , comprising a fiber structure claim 1 , comprising 10% by weight or higher of the ...

POLYAMINE AND METHOD FOR PRODUCING THEREOF

A method for producing a polyamine is described that provides excellent safety, a lot of flexibility regarding a variety of its productions, and that can produce a polyamine of high-molecular weight easily and inexpensively. 1. A polyamine comprising a combination of units of formula (1) or (2):{'br': None, 'sub': 2', 'm', '2', 'n, '—(NH—(CH)—NH—(CH))—\u2003\u2003(1)'} {'br': None, '—(NH—Y—NH—Z)—\u2003\u2003(2)'}, '(in the formula (1), independently in every unit, “m” indicates an integral number of 0 or more and “n” indicates an integral number of 3 or more.)'}(in the formula (2), independently in every unit, “Y” and “Z” are the same as or different from each other, and they indicate substituted or unsubstituted groups comprising unsaturated aliphatic, cyclic aliphatic or aromatic hydrocarbon radicals that can include hetero atoms.)2. The polyamine according to claim 1 , wherein the m and/or n of the formula (1) are the same as each other among the combined units.3. The polyamine as defined by claim 1 , wherein the Y and/or Z of the formula (2) are the same as each other among combined units.4. The polyamine as defined by claim 1 , wherein the polyamine comprises a polymer with a molecular weight of 1 claim 1 ,000 or more as it is measured by a mass spectrum.5. A polyamine obtained by a reductive polycondensation polymerization of diamine and dinitrile claim 1 , the diamine is at least one member selected from the group consisting of a substituted diamine claim 1 , an unsubstituted diamine claim 1 , an aliphatic diamine claim 1 , an aromatic diamine and an aliphatic-aromatic combined diamine.6. The polyamine according to claim 5 , whereinthe aliphatic diamine is at least one member selected from the group consisting of ethylenediamine, 1,2-propylenediamine, 1,3-propylenediamine, 1,2-butylenediamine, 1,3-butylenediamine, 1,4-butylenediamine, 2,3-butylenediamine, 1,2-cyclohexanediamine, 1,3-cyclohexanediamine, 1,4-cyclohexanediamine, hydrazine, pentamethylenediamine, ...

Crosslinked blends of polyphenylene sulfide and polyphenylsulfone for downhole applications, methods of manufacture, and uses thereof

A composition includes a crosslinked product of a polyphenylene sulfide and a polyphenylsulfone. A method for the manufacture of the crosslinked product of a polyphenylene sulfide and a polyphenylsulfone includes heating the polyphenylene sulfide and the polyphenylsulfone in presence of a crosslinking agent at a temperature and for a time effective to form the crosslinked product of polyphenylene sulfide and polyphenylsulfone.

POLYIMIDE FIBER WITH HIGH STRENGTH AND HIGH MODULUS AND ITS PREPARATION METHOD

A high-strength high-modulus polyimide fiber and its preparation method pertain to the technical field of high-performance organic fiber. This fiber includes the polyimide (PI) fiber made from 3,3′,4,4′-biphenyl tetracarboxylic diandhydride (BPDA), p-phenylenediamine (pPDA) and 2-(4-aminophenyl)-1H-benzimidazol-5-amine (BIA), wherein the molar ratio between PPDA and BIA is 1:10˜3:1. During the synthesis, other diamine and diandhydride monomers may also be added. In the preparation process, the gradient temperature reaction method and one-step continuous preparation method are adopted, the synthesis and processing difficulty caused by the increase of the content of BIA is overcome, the problem of poor uniformity and stability of fiber is solved and PI fiber with high strength and high modulus is obtained. Its strength may reach 4.5 GPa and modulus may reach 201 GPa. Moreover, the sources of the raw materials are extensive, the spinning process is continuous, the cost is low, the efficiency is high and industrial production may be realized. 144. A high-strength high-modulus polyimide fiber , comprising polyimide fiber obtained from random copolymerization of 3 , 3′ , , ′-benzophenone tetracarboxylic dianhydride (BPDA) , p-phenylenediamine (pPDA) and 2-(4-aminophenyl)-1H-benzimidazol-5-amine (BIA) , wherein molar ratio between pPDA and BIA is 1:10˜3:1.2. The high-strength high-modulus polyimide fiber according to claim 1 , wherein the polyimide fiber comprises copolymerization of BPDA claim 1 , pPDA and BIA with other diamine or/and dianhydride claim 1 , wherein molar ratio between said other diamine and the total addition amount of pPDA and BIA is 1:10˜1:4 claim 1 , molar ratio between said other dianhydride and BPDA is 1:10˜3:7.3. A method for preparing the high-strength high-modulus polyimide fiber according to claim 1 , comprising the following steps:A: providing pPDA, BIA and BPDA at a molar ratio of 1:0.95˜1:1.05 between pPDA and BPDA And at a molar ratio of 1:10 ...

Formulated Benzoxazine Based System for Transportation Applications

The present disclosure provides a halogen-free thermosetting composition including a benzoxazine compound, a monobenzoxazine monomer, and a naphthalene epoxy. The halogen-free thermosetting composition is especially suited for use in aerospace, automobile, rail and marine applications. 2. The halogen-free thermosetting composition according to wherein R is phenyl.3. The halogen-free thermosetting composition according to wherein X is phenyl.5. The halogen-free thermosetting composition according to further comprising at least one of a solvent claim 1 , a catalyst claim 1 , a flame retardant and fillers.6. The halogen-free thermosetting composition according to wherein the solvent is selected from the group consisting of methylethylketone claim 5 , acetone claim 5 , N-methyl-2-pyrrolidone claim 5 , N claim 5 ,N-dimethyl formamide claim 5 , pentanol claim 5 , butanol claim 5 , dioxolane claim 5 , isopropanol claim 5 , methoxy propanol claim 5 , methoxy propanol acetate claim 5 , dimethylformamide claim 5 , glycol claim 5 , glycol acetate claim 5 , toluene claim 5 , xylene and mixtures thereof.8. The halogen-free thermosetting composition according to claim 7 , wherein the glass transition temperature is greater than 180° C.10. A halogen-free thermosetting composition produced according to the method of .11. A method for producing a flame retarded composite article including the steps of: (i) providing a layer or bundle of reinforcement fibers; and (ii) providing the halogen-free thermosetting composition; (iii) contacting the reinforcement fibers with the halogen-free thermosetting composition to coat and/or impregnate the reinforcement fibers; and (iv) curing the coated and/or impregnated reinforcement fibers at a temperature of least about 80° C.12. A flame retarded article produced according to the method of .13. A process for producing a flame retarded composite article comprising the steps of: a) introducing a fiber preform comprising reinforcement fibers into a ...

LIQUID CRYSTAL ALIGNMENT FILM, METHOD FOR PREPARING SAME AND LIQUID CRYSTAL DISPLAY DEVICE COMPRISING SAME

The invention provides a liquid crystal alignment film, a method for preparing the same and a liquid crystal display device comprising the same. The alignment film comprises polyimide obtained by reacting the compound as shown in Formula 2 or Formula 3 with the aromatic diamine as shown in Formula 1, wherein the R, R, R, R, R, R, R, R′, R′, R′, R′, R′, R′, R′, or R′ substituent is H, alkyl, aralkyl or haloalkyl, and the Ar is aryl. The liquid crystal alignment film has a tactic spatial configuration, decreases the π-π attractive interaction between the polyimide backbones, allows the directional and homogenous alignment of the liquid crystal molecules on the surface of the polyimide, and thereby increases the contrast of the liquid crystal display. 3. The liquid crystal alignment film according to claim 1 , wherein the R claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , R′ claim 1 , R′ claim 1 , R′ claim 1 , R′ claim 1 , R′ claim 1 , R′ claim 1 , R′ claim 1 , or R′ substituent is alkyl containing 1-10 carbon atoms claim 1 , aralkyl containing 6-20 carbon atoms or haloalkyl containing 1-10 carbon atoms; and the Ar is phenyl claim 1 , biphenylyl or diphenyl ether radical.4. The liquid crystal alignment film according to claim 3 , wherein the alkyl is methyl claim 3 , ethyl claim 3 , n-propyl claim 3 , isopropyl claim 3 , n-butyl claim 3 , isobutyl or t-butyl.5. The liquid crystal alignment film according to claim 3 , wherein the aralkyl is phenyl claim 3 , tolyl claim 3 , benzyl or triphenylmethyl.6. The liquid crystal alignment film according to claim 3 , wherein the haloalkyl is difluoromethyl or trifluoromethyl.7. A liquid crystal display device claim 1 , wherein said liquid crystal display device comprises the liquid crystal alignment film according to .9. The method of preparation according to claim 8 , whereinthe duration of mixing and agitation in the step 1) is about 24 h; andin the step 2), after the polyamic acid is evenly ...

HOLE TRANSPORT COMPOSITION

There is provided a hole transport composition having (i) a first hole transport polymer having crosslinkable groups, and (ii) a second hole transport polymer having substantially no crosslinkable groups. There is also provided a crosslinked hole transport layer and an electronic device containing the crosslinked hole transport layer. 1. A hole transport composition comprising (i) a first hole transport polymer having crosslinkable groups , and (ii) a second hole transport polymer having substantially no crosslinkable groups2. The hole transport composition of claim 1 , wherein the first hole transport polymer has a narrower band gap than the second hole transport polymer.3. The hole transport composition of claim 1 , wherein the first hole transport polymer is a copolymer of a triarylamine derivative and a fluorene derivative and the second hole transport polymer is a triarylamine polymer.45.-. (canceled)911.-. (canceled) This application claims priority tinder 35 §119(e) from U.S. Provisional Application No. 61/053,679 filed May 16, 2008 which is incorporated by reference in its entirety.1. Field of the DisclosureThis disclosure relates in general to hole transport compositions having more than one component. Such layers are useful in electronic devices.2. Description of the Related ArtIn organic photoactive electronic devices, such as organic light emitting diodes (“OLED”), that make up OLED displays, the organic active layer is sandwiched between two electrical contact layers. In an OLED the organic photoactive layer emits light through the light-transmitting electrical contact layer upon application of a voltage across the electrical contact layers.It is well known to use organic electroluminescent compounds as the active component in light-emitting diodes. Simple organic molecules, conjugated polymers, and organometallic complexes have been used. Devices that use photoactive materials frequently include one or more charge transport layers, which are positioned ...

CONDUCTING POLYMER MATERIALS BASED ON CARBONYL-FUNCTIONALIZED POLYSILICONES AND METHODS FOR THEIR PREPARATION

Polymer compositions based on polyaniline and carbonyl-functionalized polysilicones, and methods for making these polymer compositions are disclosed in the present application. The polymer compositions have, for example, good solubility, processability, mechanical performance and conductivity. 2. The composition of claim 1 , wherein Ris selected from the group consisting of hydrogen claim 1 , C-Calkyl claim 1 , and R—COOR claim 1 , wherein Ris absent or C-Calkyl claim 1 , Ris hydrogen or C-Calkyl; and Ris C-Calkyl.3. The composition of claim 1 , wherein Rand Rare each independently C-Calkyl.4. The composition of claim 1 , wherein R claim 1 , Rand Rare each independently selected from the group consisting of C-Calkyl claim 1 , C-Calkenyl claim 1 , C-Calkynyl claim 1 , phenyl claim 1 , and C-Ccycloalkyl.5. The composition of claim 1 , wherein R claim 1 , Rand Rare each independently selected from the group consisting of methyl claim 1 , ethyl claim 1 , propyl claim 1 , butyl claim 1 , octyl claim 1 , trifluoropropyl claim 1 , phenyl claim 1 , and vinyl.8. The composition of claim 1 , wherein the second polymer is selected from the group consisting of polyaniline claim 1 , polyphenylene claim 1 , polythiophene claim 1 , polyfuran claim 1 , polypyrrole claim 1 , polycarbozole claim 1 , polyphenylenevinylene (PPV) claim 1 , polyphenylene ethynylene (PPE) and derivatives thereof.9. The composition of claim 1 , wherein the composition has a weight ratio of the first polymer to the second polymer of about 1:99 to about 99:1.10. (canceled)11. The composition of claim 1 , wherein the first polymer and the second polymer are coupled through hydrogen bonding.12. (canceled)13. (canceled)14. (canceled)15. The composition of claim 1 , wherein the composition has an electrical conductivity of about 10S/cm to about 20 S/cm.16. (canceled)17. (canceled)18. The composition of claim 1 , wherein the composition has the form of a film claim 1 , membrane claim 1 , rod claim 1 , filament ...

Coating Composition Including High Molecular Weight Polycarbodiimide, Method Of Preparing Same, And Method Of Preparing Coating On A Substrate

A coating composition comprises a high molecular weight polycarbodiimide. The high molecular weight polycarbodiimide is produced via a method. A method of preparing the coating composition and a method of forming a coating on a substrate with the coating composition are also disclosed. 1. A coating composition , comprising: providing an isocyanate component comprising toluene diisocyanate (TDI);', 'providing a carbodiimidization catalyst;', 'providing a first solvent having a boiling point temperature of from about 50 to about 150° C.;', 'polymerizing the isocyanate component for a first period of time in the first solvent and in the presence of the carbodiimidization catalyst to produce a reaction mixture including at least one carbodiimide compound and the first solvent;', 'combining a second solvent, which is the same as or different from the first solvent, and the reaction mixture; and', 'polymerizing the at least one carbodiimide compound for a second period of time in the first and second solvents and in the presence of the carbodiimidization catalyst to produce said high molecular weight polycarbodiimide., 'a high molecular weight polycarbodiimide, which is formed from the steps of2. A coating composition set forth in wherein said high molecular weight polycarbodiimide has a mole fraction percentage greater than 0 having a molecular weight of at least about 100 claim 1 ,000.3. A coating composition as set forth in wherein said high molecular weight polycarbodiimide has a mole fraction percentage greater than 0 having a molecular weight of at least about 500 claim 1 ,000.4. A coating composition as set forth in wherein the first solvent comprises an aromatic solvent.5. A coating composition as set forth in wherein the second solvent comprises a cyclic ether.6. A coating composition as set forth in wherein the first solvent comprises toluene and the second solvent comprises tetrahydrofuran (THF).7. A coating composition as set forth in wherein the first period ...

POLYIMIDE RESINS FOR HIGH TEMPERATURE APPLICATIONS

Polyimide resin compositions that contain an aromatic polyimide, graphite, and acid-washed fibrous clay are found to exhibit high thermal oxidative stability. Such compositions are especially useful in molded articles that are exposed to high temperatures, such as bushings, bearings, and seal rings that are used in aerospace, transportation, and materials handling applications. 1. A composition comprising in admixture(a) an aromatic polyimide in an amount between about 30 and about 90 weight parts;(b) acid-washed fibrous clay in an amount between about 0.5 and about 12 weight parts, and(c) graphite in an amount between about 0 and about 60 weight parts; wherein all weight parts combined together total to 100 weight parts.2. The composition according to wherein the fibrous clay is sepiolite or attapulgite.3. The composition according to wherein the fibrous clay is rheological grade sepiolite or rheological grade attapulgite.4. The composition according to wherein component (a) is present in an amount between about 40 and 54 weight parts; component (b) is present in an amount between about 0.5 and about 12 weight parts; andcomponent (c) is present in an amount between about 46 and about 60 weight parts.5. A three-dimensional article comprising an aromatic polyimide resin composition claim 1 , said composition comprising in admixture(a) an aromatic polyimide in an amount between about 30 and about 90 weight parts;(b) acid-washed fibrous clay in an amount between about 0.5 and about 12 weight parts; and(c) graphite in an amount between about 0 and about 60 weight parts; wherein all weight parts combined together total to 100 weight parts.6. The article according to wherein the fibrous clay is sepiolite or attapulgite.7. The article according to wherein the fibrous clay is rheological grade sepiolite or rheological grade attapulgite.10. The article according to wherein greater than 60 to about 85 mol % of the Rgroups comprise p-phenylene radicals claim 9 , and about 15 ...

POLYIMIDE RESINS FOR HIGH TEMPERATURE APPLICATIONS

Polyimide resin compositions that contain an aromatic polyimide, graphite, and acicular titanium dioxide are found to exhibit high thermal oxidative stability. Such compositions are especially useful in molded articles that are exposed to high temperatures, such as bushings, bearings, and seal rings that are used in aerospace, transportation, and materials handling applications. 2. The composition according to wherein component (a) is present in an amount between about 40 and 54 weight parts; component (b) is present in an amount between about 0.5 and about 10 weight parts; and component (c) is present in an amount between about 46 and about 60 weight parts.3. A composition comprising in admixture(a) an aromatic polyimide in an amount between about 35 and about 90 weight parts;(b) acicular titanium dioxide particles in an amount between about 0.5 and about 4.8 weight parts, wherein the average particle diameter is between about 10 and about 500 nm and the average particle length is between about 1 and about 100 μm, provided that the particle aspect ratio is at least 3; and(c) graphite in an amount between about 0 and about 60 weight parts;wherein all weight parts combined together total to 100 weight parts.7. The article according to wherein greater than 60 to about 85 mol % of the Rgroups comprise p-phenylene radicals claim 6 , and about 15 to less than 40 mol % comprise m-phenylene radicals.8. The article according to further comprising as a component (d) one or more additives in an amount in the range of about 5 to about 70 wt % based on the weight of the total (a)+(b)+(c)+(d) composition.9. The article according to which is in the form of a rod claim 4 , a rube claim 4 , a plaque claim 4 , a ring claim 4 , a disc claim 4 , or a bar.10. The article according to which comprises a bushing claim 4 , bearing claim 4 , washer claim 4 , seal ring claim 4 , wear pad claim 4 , wear strip claim 4 , spline claim 4 , gasket claim 4 , slide block claim 4 , or valve component ...

MELAMINE EPOXY RESIN MONOMER AND RESIN COMPOSITION

A melamine epoxy resin monomer including: a glycidyl group; and a structural unit having a melamine residue and being represented by the following Formula (I) is disclosed. In Formula (I), each of Rto Rindependently represents a hydrogen atom, a group represented by ROCH—, or a group derived from a melamine derivative and represented by the following Formula (II). Rrepresents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a glycidyl group. In Formula (II), each of Rto Rindependently represents a hydrogen atom, a group represented by ROCH—, or a group derived from a melamine derivative and represented by Formula (II). Rrepresents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a glycidyl group. 3. The melamine epoxy resin monomer according to claim 1 , wherein the number of the contained glycidyl groups is 2 or more.4. The melamine epoxy resin monomer according to claim 1 , wherein the number of the contained melamine residues is 8 or less.5. A resin composition comprising: the melamine epoxy resin monomer according to ; and an inorganic filler.6. The resin composition according to claim 5 , further comprising a curing agent.7. A composition for light reflection claim 5 , which is a cured product of the resin composition according to .8. The melamine epoxy resin monomer according to claim 2 , wherein the number of the contained glycidyl groups is 2 or more.9. The melamine epoxy resin monomer according to claim 2 , wherein the number of the contained melamine residues is 8 or less.10. A resin composition comprising: the melamine epoxy resin monomer according to ; and an inorganic filler.11. The resin composition according to claim 10 , further comprising a curing agent.12. A composition for light reflection claim 11 , which is a cured product of the resin composition according to .13. The melamine epoxy resin monomer according to claim 1 , wherein:the number of the contained glycidyl groups is 2 or more; andthe number of the contained ...

METHOD AND MATERIALS FOR SEPARATING NUCLEIC ACID MATERIALS

Nucleic acid material can be effectively separated from a fluid under mild conditions by the use of a positively charged polymer which binds the nucleic acid material. Disclosed is a novel positively charged polymer which may be employed in the separation process. This polymer comprises an acidified polyamine, such as polyethyleneimine which has been reacted with a nonacidified polyethyleneimine in a coupling reaction. The acidified polyethyleneimine may be a coarboxylated and/or sulfonated polyethyleneimine. 1. A method for preparing a partially positively charged polyethyleneimine polymer , said method comprising the steps of:providing a first volume of a polyethyleneimine polymer;reacting said first volume of polyethyleneimine polymer with an acidifying agent so as to produce an acidified polyethyleneimine;providing a second volume of a polyethyleneimine polymer; andreacting said second volume of polyethyleneimine with said acidified polyethyleneimine so as to couple at least some of said carboxylated polyethyleneimine to said polyethyleneimine of said second volume.2. The method of claim 1 , wherein said acidifying agent is a carboxylating agent or a sulfonating agent.3. The method of claim 1 , wherein said acidifying agent is sodium chloroacetate.4. The method of claim 1 , wherein said first volume of polyethyleneimine and/or said second volume of polyethyleneimine has a molecular weight of approximately 400 to 200 claim 1 ,000.5. A system for separating a nucleic acid material from a fluid claim 1 , said system comprising:a positively charged polymer which is operative to bind said nucleic acid material; anda releasing agent, said releasing agent comprising a solution of an alkaline material and a glycol, said solution having a pH of no more than 12, said agent being operative to cause said nucleic acid material to be released from said polymer.6. The system of claim 5 , wherein said polyethyleneimine derivatized solid matrix material comprises a carboxylated ...

Liquid crystal display

A liquid crystal display including a first substrate; a second substrate facing the first substrate; a thin film transistor disposed on the first substrate; an organic layer disposed on the thin film transistor; a pixel electrode disposed on the organic layer; a lower alignment layer disposed on the pixel electrode; a common electrode disposed on the second substrate; and an upper alignment layer disposed on the common electrode, wherein a first free radical included in the organic layer and a second free radical included in at least one of the lower alignment layer and the upper alignment layer are radical bonded.

METHOD FOR PRODUCING THERMOPLASTIC RESIN COMPOSITION, THERMOPLASTIC RESIN COMPOSITION, AND MOLDED ARTICLE

The present invention provides a thermoplastic resin composition, which is excellent in low-temperature toughness and high-temperature creep characteristics, by a method for producing a thermoplastic resin composition by melt-kneading: 1. A method for producing a thermoplastic resin composition by melt-kneading:(a) a polyphenylene sulfide resin, with{'sup': '2', '(b) a polyetherimide resin or a polyethersulfone resin, wherein the thermoplastic resin composition contains 99 to 1% by weight of the component (a) and 1 to 99% by weight of the component (b) based on 100% by weight of the total amount of the component (a) and the component (b); the melt-kneading step is the step of melt-kneading by an extruder provided with an elongational flow zone which is a zone in which melt-kneading is performed while being allowed to undergo elongational flow; and a flow effect pressure drop before and after the elongational flow zone is from 50 to 1,000 kg/cm.'}2. The method for producing a thermoplastic resin composition according to claim 1 , wherein a ratio of the total length of the elongational flow zone to the full length of a screw of the extruder is from 5 to 60%.3. The method for producing a thermoplastic resin composition according to claim 1 , which satisfies the equation Lk/D=0.2 to 10 claim 1 , where Lk denotes the length of one elongational flow zone in a screw of the extruder claim 1 , and D denotes a screw diameter.4. A thermoplastic resin composition comprising:(a) a polyphenylene sulfide resin, and(b) a polyetherimide resin or a polyethersulfone resin, wherein the thermoplastic resin composition contains 99 to 1% by weight of the component (a) and 1 to 99% by weight of the component (b) based on 100% by weight of the total amount of the component (a) and the component (b), and also satisfies the following conditions:(i) tensile elongation, measured in accordance with ASTM-D638 under the conditions of a tension speed of 10 mm/minute and an ambient temperature of − ...

MATTE FINISH POLYIMIDE FILMS AND METHODS RELATING THERETO

The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 71 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 9 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer. 1. A base film comprising: i. at least 50 mole percent of an aromatic dianhydride, based upon a total dianhydride content of the polyimide, and', 'ii. at least 50 mole percent of an aromatic diamine based upon a total diamine content of the polyimide;, 'A. a chemically converted polyimide in an amount from 40 to 90 weight percent of the base film, the chemically converted polyimide being derived from 'wherein the thickness of the base film is from 8 to 152 microns.', 'B. a filler, excluding low conductivity carbon black and pigments, in an amount from 10 to 60 wt % of the base film; and'}2. The base film in accordance with wherein the chemically converted polyimide is made by the step of mixing a polyamic acid solution with a catalyst or dehydrating agent capable of converting a polyamic acid to a polyimide.3. The base film in accordance with wherein: pyromellitic dianhydride,', '3,3′,4,4′-biphenyl tetracarboxylic dianhydride,', '3,3′,4,4′-benzophenone tetracarboxylic dianhydride;', '4,4′-oxydiphthalic anhydride,', '3,3′,4,4′-diphenyl sulfone tetracarboxylic dianhydride,', '2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane,', 'Bisphenol A dianhydride, and', ' ...

POLYIMIDE SHEET AND MANUFACTURING METHOD THEREOF

[Problem] 1. A polyimide sheet formed by laminating at least two polyimide films , such that a thickness of the polyimide sheet is at least 0.2 mm , and a linear expansion coefficient in any two orthogonal directions in a plane is at most 10 ppm/° C.2. The polyimide sheet described in claim 1 , which is obtained by laminating at least two polyimide films having a linear expansion coefficient in the tensile mode in at least one planar direction of at least 10 ppm/° C.3. The polyimide sheet described in or claim 1 , wherein the following relationships apply claim 1 , when αT is a modulus of elasticity in a direction TD and αM is a modulus of elasticity in a direction MD claim 1 , in a bend test of a polyimide sheet obtained by laminating polyimide films in a same direction claim 1 , and when β2 is a modulus of elasticity in a direction orthogonal to β1 and β1 claim 1 , which are moduli of elasticity in desired directions claim 1 , in a bend test of a polyimide sheet obtained by laminating after rotating each polyimide film to a desired angle:{'br': None, 'i': M+αT', 'αM+αT, '(α)/2)−0.5[GPa]≦β1≦()/2)+0.5[GPa],'}{'br': None, 'and'}{'br': None, 'i': M+αT', 'αM+αT, '(α)/2)−0.5[GPa]≦β2≦()/2)+0.5[GPa].'}4. The polyimide sheet described in any of through 3 claims 1 , wherein the following relationships apply claims 1 , when yT is a maximum stress in a direction TD and yM is a maximum stress in a direction MD claims 1 , in a bend test of a polyimide sheet obtained by laminating polyimide films in a same direction claims 1 , and when δ2 is a maximum stress in a direction orthogonal to δ1 and δ1 claims 1 , which are maximum stresses in desired directions claims 1 , in a bend test of a polyimide sheet obtained by laminating after rotating each polyimide film to a desired angle:{'br': None, 'i': M+γT', 'γM+γT, '(γ)/2)−20[MPa]≦δ1≦()/2)+20[MPa],'}{'br': None, 'and'}{'br': None, 'i': M+γT', 'γM+γT, '(γ)/2)−20[MPa]≦δ2≦()/2)+20[MPa].'}5. A method of manufacturing a polyimide sheet ...

USE OF MOLECULES CARRYING ASSOCIATIVE GROUPS AS PLASTICISERS

The invention relates to the field of plasticisers, compounds used as additives in polymers for facilitating the transformation thereof or modifying the mechanical properties thereof especially rigidity. 111-. (canceled)12. A method of plasticizing a plastic , comprising:adding a plasticizer to the plastic, wherein the plasticizer comprises a molecule with an average molecular mass of greater than 500 g/mol, wherein the molecule comprises at least one associative group comprising a nitrogenous heterocycle.13. The method of claim 12 , wherein the molecule comprising at least one associative group is a supramolecular polymer obtained by reacting at least one compound A with at least one compound B;wherein compound A comprises at least a first functional group and a second functional group;wherein compound B comprises at least one reactive group that is capable of reacting with the first functional group of compound A, and optionally, capable of reacting with the second functional group of compound A; andwherein compound B further comprises at least one associative group.14. The method of claim 13 , wherein the supramolecular polymer obtained by the reaction of compound A with compound B is further reacted with at least one compound C;wherein compound C comprises at least a first functional group and a second functional group;wherein the first functional group and second functional group of compound C are capable of reacting with the second functional group of compound A to form ester, thioester, or amide bridges, when the second functional group of compound A has not reacted with compound B.15. The method of claim 13 , wherein the supramolecular polymer is capable of reacting with urea.16. The method of claim 13 , wherein compound A is a mixture of fatty acid trimer and a linear or branched alkyldicarboxylic acid.17. The method of claim 16 , wherein the linear or branched alkyldicarboxylic acid is chosen from glutaric acid claim 16 , adipic acid claim 16 , pimelic ...

SULFONATED POLYOXADIAZOLE POLYMERS ARTICLES

A shaped article having a polymer having repeat units of Formula (I) and one or both of Formula (II) and (IIa): 2. The shaped article of wherein M is H claim 1 , Li claim 1 , Na claim 1 , K claim 1 , or NH.3. The shaped article of wherein Formula (I) is present at about 5 molar % to about 50 molar % claim 1 , and one or both of Formula (II) and (IIa) is present at about 50 molar % to about 95 molar %.4. The shaped article of wherein Formula (I) is present at about 10 molar % to about 30 molar % claim 1 , and one or both of Formula (II) and (IIa) is present at about 70 molar % to about 90 molar %.6. The shaped article of wherein Formula (I) is present at about 5 molar % to about 50 molar % claim 1 , one or both of Formula (II) and (IIa) is present at about 50 molar % to about 95 molar % claim 1 , and one or both of Formula (III) and Formula (IIIa) is present at about 1 molar % to about 50 molar %.7. The shaped article of wherein Formula (I) is present at about 10 molar % to about 30 molar % claim 1 , one or both of Formula (II) and (IIa) is present at about 70 molar % to about 90 molar % claim 1 , and one or both of Formula (III) and Formula (IIIa) is present at about 5 molar % to about 20 molar %.8. The shaped article of having a limiting oxygen index of about 24 or greater.9. The shaped article of having a limiting oxygen index of about 28 or greater.10. The shaped article of having a limiting oxygen index of about 30 or greater.11. The shaped article of that is a fiber.12. A spun yarn comprising the fiber of .13. A woven fabric comprising the yarn of .14. A garment comprising the yarn of . This application claims the benefit of priority of U.S. Provisional Application Nos. 61/423,616, filed on Dec 16, 2010, the entirety of which is herein incorporated by reference.The invention is directed to articles prepared from sulfonated polyoxadiazole polymers.Workers that can be exposed to flames, high temperatures, and/or electrical arcs and the like, need protective ...

Precursors for the polymer-assisted deposition of films

A polymer assisted deposition process for deposition of metal oxide films is presented. The process includes solutions of one or more metal precursor and soluble polymers having binding properties for the one or more metal precursor. After a coating operation, the resultant coating is heated at high temperatures to yield metal oxide films. Such films can be epitaxial in structure and can be of optical quality. The process can be organic solvent-free. 110-. (canceled)11. A composition of matter comprising a solution of at least two metal precursors , ethylenediaminetetraacetic acid or salts of ethylenediaminetetraacetic acid , and a soluble polymer selected from the group consisting of polyethylenimine , carboxylated polyethylenimine , polypyrolidone , and poly(ethylene-maleic acid) , said polymer characterized as having binding properties for said at least two metal precursors , wherein the binding constant for the polymer-metal complex interaction is greater than about 10000 molL , said at least two metal precursors are present in a pre-selected ratio , wherein said at least two metals are selected from the group consisting of lanthanide metals.1214-. (canceled)15. A composition of matter comprising a solution of at least two metal precursors , ethylenediaminetetraacetic acid or salts of ethylenediaminetetraacetic acid , and a soluble polymer selected from the group consisting of polyethylenimine , carboxylated polyethylenimine , polypyrolidone , and poly(ethylene-maleic acid) , said polymer characterized as having binding properties for said at least two metal precursors , wherein the binding constant for the polymer-metal complex interaction is greater than about 10000 molL , said at least two metal precursors are present in a pre-selected ratio , wherein said at least two metals are indium and tin.16. A composition of matter comprising a solution of at least two metal precursors , ethylenediaminetetraacetic acid or salts of ethylenediaminetetraacetic acid , and ...

PREPARATION OF SULFONATED POLYOXADIAZOLE POLYMERS

Described is the preparation of sulfonated polyoxadiazole polymers with a high degree of sulfonation and good flammability properties. The polymers are useful in articles such as fibers. 1. A process for preparing a polymer , comprising the steps of:{'sub': '3', 'a) combining hydrazine, oleum, 4,4′-oxybis(benzoic acid), and one or both of terephthalic acid and isophthalic acid, to form a reaction mixture, wherein the oleum is added in an amount of at least about 5 molar equivalents of SObased on the number of moles of hydrazine; and'}b) heating the reaction mixture to a temperature of about 100° C. to about 180° C. until a polymer is prepared.2. The process of wherein the oleum is added in an amount of at least about 6 molar equivalents of SObased on the number of moles of hydrazine.3. The process of wherein the oleum is added in one step.4. The process of wherein the heating is performed at about 120° C. to about 140° C. for at least about 0.5 hours.5. The process of wherein step a) comprises the steps of:1) combining hydrazine or salt thereof, 4,4′-oxybis(benzoic acid), and one or both of terephthalic acid and isophthalic acid to form a pre-mixture;2) stirring the pre-mixture for at least 5 minutes; and{'sub': '3', '3) adding oleum to the pre-mixture in an amount of at least about 5 molar equivalents of SObased on the number of moles of hydrazine to form a reaction mixture.'}6. The process of wherein the reaction mixture comprises about 1 molar % to about 50 molar % of 4 claim 1 ,4′-oxybis(benzoic acid) and about 50 molar % to about 99 molar % of one or both of terephthalic acid and isophthalic acid claim 1 , based on the total amount of 4 claim 1 ,4′-oxybis(benzoic acid) claim 1 , terephthalic acid and isophthalic acid present.7. The process of wherein the reaction mixture comprises about 10 molar % to about 30 molar % of 4 claim 1 ,4′-oxybis(benzoic acid) and about 70 molar % to about 90 molar % of one or both of terephthalic acid and isophthalic acid claim 1 , ...

SULFONATED POLYOXADIAZOLE POLYMERS

Described are sulfonated polyoxadiazole polymers with a high degree of sulfonation and good flammability properties. The polymer has repeat units of Formula (I) and one or both of Formula (II) and (IIa): 2. The polymer of wherein M is H claim 1 , Li claim 1 , Na claim 1 , K claim 1 , or NH.3. The polymer of wherein Formula (I) is present at about 5 molar % to about 50 molar % claim 1 , and one or both of Formula (II) and (IIa) is present at about 50 molar % to about 95 molar %.4. The polymer of wherein Formula (I) is present at about 10 molar % to about 30 molar % claim 1 , and one or both of Formula (II) and (IIa) is present at about 70 molar % to about 90 molar %.6. The polymer of wherein Formula (I) is present at about 5 molar % to about 50 molar % claim 1 , one or both of Formula (II) and (IIa) is present at about 50 molar % to about 95 molar % claim 1 , and one or both of Formula (III) and Formula (IIIa) is present at about 1 molar % to about 50 molar %.7. The polymer of wherein Formula (I) is present at about 10 molar % to about 30 molar % claim 1 , one or both of Formula (II) and (IIa) is present at about 70 molar % to about 90 molar % claim 1 , and one or both of Formula (III) and Formula (IIIa) is present at about 5 molar % to about 20 molar %.8. The polymer of having a limiting oxygen index of about 24 or greater.9. The polymer of having a limiting oxygen index of about 28 or greater.10. The polymer of having a limiting oxygen index of about 30 or greater. This application claims the benefit of priority of U.S. Provisional Application No. 61/423,616 filed on Dec. 16, 2010, the entirety of which is herein incorporated by reference.The invention is directed to sulfonated polyoxadiazole polymers and methods of making said polymers.Workers that can be exposed to flames, high temperatures, and/or electrical arcs and the like, need protective clothing and articles made from thermally resistant fabrics. Any increase in the effectiveness of these protective ...

PIGMENTED POLYIMIDE FILMS AND METHODS RELATING THERETO

The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 63 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 35 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer. 1. A base film comprising:A. a chemically converted polyimide in an amount from 63 to 96 weight percent of the base film, the chemically converted polyimide being derived from:a. at least 50 mole percent of an aromatic dianhydride, based upon a total dianhydride content of the polyimide, andb. at least 50 mole percent of an aromatic diamine based upon a total diamine content of the polyimide;B. a pigment, other than carbon black, present in an amount from 2 to 35 weight percent of the base film; andC. a particulate matting agent that is alumina, barium sulfate, mixtures of at least two of alumina, barium sulfate and silica, the matting agent:a. is present in an amount from 1.6 to 10 weight percent of the base film,b. has a median particle size from 1.3 to 10 microns,c. has a density from 2 to 4.5 g/cc such that the base film has a 60 degree gloss from 2 to 35.2. The base film in accordance with wherein:a. the aromatic dianhydride is selected from the group consisting of:pyromellitic dianhydride,3,3′,4,4′-biphenyl tetracarboxylic dianhydride,3,3′,4,4′-benzophenone tetracarboxylic dianhydride,4,4′-oxydiphthalic anhydride,3,3′,4,4′-diphenyl sulfone tetracarboxylic ...

POLYETHERIMIDE POLYCARBONATE BLENDS

The disclosure relates to compositions exhibiting a UV resistance of ΔE ranging from more than 0 to less than or equal to 10 units after exposure to ultraviolet light for 300 hours, per ASTM D-4459 protocol. The compositions can include at least 15 wt. % of a polyetherimide; at least 35 wt. % of a polycarbonate; a polyetherimide siloxane; and optionally, at least one UV stabilizer. The disclosure also relates to methods of shaping such compositions and articles produced from such compositions. 2. The composition of claim 1 , wherein the polyetherimide is a homopolymer.3. The composition of claim 1 , wherein the weight ratio of polycarbonate to polyetherimide provides the composition with a melt index ranging from 1.5 to 6 g/min. claim 1 , at 295° C. and at a loading level of 6.7 kg claim 1 , wherein the melt index is sufficient to enable the composition to be molded into a cavity having a dimension greater than 0 and less than or equal to 3 mm.4. The composition of claim 3 , wherein the melt index is sufficient to enable the composition to be molded into a cavity having a dimension greater than 0 and less than or equal to 1 mm.5. The composition of wherein the polycarbonate is present in an amount of at least 50 wt. %.6. The composition of claim 1 , wherein the polycarbonate is a copolymer of polycarbonate and siloxane.7. The composition of claim 1 , wherein the polycarbonate is a homopolymer.8. The composition of claim 1 , wherein the weight ratio of polycarbonate to polyetherimide is from 2:5 to 4:5.9. The composition of claim 8 , wherein the impact strength is greater than 50 μm.10. The composition of claim 1 , further comprising a phosphorus stabilizer in an amount of between 0.1-10 wt. %.11. The composition of claim 1 , having a tensile modulus of elasticity (MPa) of from 2800 MPa to 3300 MPa.12. The composition of claim 1 , wherein the tensile elongation at yield ranges from 2% to 20%.13. The composition of claim 1 , wherein the tensile elongation at break ...

RESIN COMPOSITION, COMPOSITE CURED PRODUCT USING SAME, AND METHOD FOR PRODUCING THE COMPOSITE CURED PRODUCT

A resin composition including 10 to 90% by mass of (A) a component to be polymerized containing a compound represented by Formula (1), and 90 to 10% by mass of (B) a thermosetting resin, the (A) and (B) each being capable of undergoing a reaction to increase molecular weight by itself when heated: 2. The resin composition according to claim 1 , wherein said compound represented by Formula (1) is one selected from the group consisting of a cyclic polyphenylene sulfide claim 1 , a cyclic polyphenylene ether ether ketone claim 1 , a cyclic polyphenylene ether ketone and a cyclic polyphenylene ether sulfone.3. The resin composition according to claim 1 , wherein said (B) is one selected from the group consisting of an epoxy resin claim 1 , a bismaleimide resin and a polyimide resin.4. The resin composition according to claim 1 , further comprising a zero-valent transition metal compound.5. The resin composition according to claim 4 , wherein said zero-valent transition metal compound comprises a metal belonging to Groups 8 to 11 and Periods 4 to 6 of the periodic table.6. The resin composition according to claim 1 , further comprising an alkali metal salt.7. The resin composition according to claim 1 , further comprising (C) a reinforcement fiber.8. The resin composition according to claim 7 , wherein said (C) reinforcement fiber is a carbon fiber.9. A method of producing a composite cured product comprising allowing the resin composition according to to react by heating to obtain a composite cured product.10. A method of producing a composite cured product comprising impregnating the resin composition according to into a reinforcement fiber and then allowing said resin composition to react by heating to obtain a composite cured product.12. The composite cured product according to claim 11 , further comprising (C) a reinforcement fiber.13. The resin composition according to claim 2 , wherein said (B) is one selected from the group consisting of an epoxy resin claim 2 , ...

Benzoxazines and Compositions Containing the Same

Disclosed herein are monofunctional benzoxazine compounds having at least one electron-withdrawing group. The monofunctional benzoxazine compounds may be combined with one or more multifunctional benzoxazine compounds to form a unique benzoxazine blend. This benzoxazine blend may be combined with additional components such as catalysts and toughening agents to form a curable resin composition suitable for forming resinous films or composite materials. The presence of monofunctional benzoxazine improves the processability of the benzoxazine-based resin composition by reducing the viscosity of the resin composition, and results in improved tack and drape in the films and composite materials formed from the composition without the loss of modulus in the cured resin. 2. The benzoxazine blend of claim 1 , wherein claim 1 , with reference to Formula I and R claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , said alkyl is Calkyl claim 1 , said cycloalkyl is Ccycloalkyl claim 1 , and said cycloalkyl and aryl groups are optionally substituted by Calkyl claim 1 , halogen or amine groups.3. The benzoxazine blend of claim 1 , wherein claim 1 , with reference to Formula I and X claim 1 , X claim 1 , X claim 1 , X claim 1 , said alkyl is Calkyl claim 1 , said cycloalkyl is Ccycloalkyl claim 1 , and wherein the cycloalkyl and aryl groups are optionally substituted by Calkyl claim 1 , halogen or amine groups.6. The benzoxazine blend of claim 5 , wherein X is F or Cl claim 5 , and Y is OCH.7. The benzoxazine blend of claim 1 , wherein the weight ratio of multifunctional benzoxazine to substituted monofunctional benzoxazine is within the range of 99.9:0.1 to 50:50.8. The benzoxazine blend of claim 1 , wherein the multifunctional benzoxazine compound is a di-functional benzoxazine.10. The benzoxazine blend of claim 9 , wherein Zis selected from —[C(R)(R)]-arylene-[C(R)(R)]— claim 9 , and the chain linking the two benzoxazine groups further comprises claim 9 , or is interrupted ...

Resin composition, and protective film, dry film, circuit board, and multilayer circuit board containing same

A resin composition which is capable of forming a film that has excellent heat resistance and slidability/bendability; a protective film for circuits, which uses the resin composition; and a dry film or the like which comprises the protective film are provided. Other aspects are a circuit board and a multilayer circuit board, each of which has excellent heat resistance and slidability/bendability. Furthermore, a protective film for circuit boards is provided, which is arranged in contact with a circuit of a printed wiring board, and contains a polyoxazolidone resin that has a weight average molecular weight of 3×10 4 or more.

Liquid crystal display deviceand methods for manufacturing the same

A liquid crystal display device includes a first substrate having a first alignment base layer disposed thereon, a second substrate facing the first substrate and having a second alignment base layer disposed thereon, and ferroelectric liquid crystals vertically aligned between the first substrate and the second substrate. The first alignment controller combines with the first alignment base layer and includes a side chain longer than that of the first alignment base layer. The second alignment controller combines with the second alignment base layer and includes a side chain longer than that of the second alignment base layer. The ferroelectric liquid crystals are pre-tilted by the first alignment controller and the second alignment controller, and as a result, transmittance may be improved. Because the ferroelectric liquid crystals are pre-tilted, a cell gap may be decreased and high-speed driving may be possible at a low voltage.

Device for treating the surface of a cork stopper, treatment method, and stopper obtained by said method

Disclosed is a device for treating the outer surface of a cork plug ( 3 ), including: a first so-called reactive liquid composition including: a so-called bi-epoxyde composition of at least one compound having a molecular mass between 340 g/mol and 800 g/mol; a so called reactive solvent; a so-called curing liquid composition including at least one polyamine adapted for forming a protection film by polymerization at the surface of a cork plug ( 3 ); characterized in that the reactive composition includes a load of a solid in the divided state dispersed in the reactive composition, the solid in the divided state including barium sulphate.

Halogen-Free High-Tg Resin Composition And Prepreg And Laminate Fabricated By Using The Same

The present invention relate to a halogen-free high-Tg resin composition and a prepreg and a laminate fabricated by using the same. The composition comprises, based on parts by weight of organic solids: (A) 10-50 parts by weight of a cyanate ester resin; (B) at least one compound having a dihydrobenzoxazine ring; (C) 10-50 parts by weight of at least one bismaleimide resin; (D) 10-50 parts by weight of at least one polyepoxy compound; and (E) 5-30 parts by weight of at least one phosphorus-containing flame retardant. The halogen-free high-Tg resin composition has the performance of low water absorption, low CTE, high Tg, and good dielectric properties, and a prepreg and a laminate fabricated by using the same has the characteristics of a high glass transition temperature, a low CTE, a low dielectric constant, a low water absorption, and a high heat resistance, and thus being applicable to a multi-layer circuit board 1. A halogen-free high-Tg resin composition , comprising , based on parts by weight of organic solids , (A) 10-50 parts by weight of at least one cyanate and prepolymer of cyanate; (B) 10-50 parts by weight of at least one compound having a dihydrobenzoxazine ring; (C) 10-50 parts by weight of at least one bismaleimide resin; (D) 10-50 parts by weight of at least one polyepoxy compound; and (E) 5-30 parts by weight of at least one phosphorus-containing flame retardant.5. The halogen-free high-Tg resin composition according to claim 1 , wherein the polyepoxy compound comprises at least one compound selected from the group consisting of(1) bifunctional epoxy resin, comprising biphenol A-type epoxy resin, biphenol F-type epoxy resin, biphenyl-type epoxy resin;(2) novolac epoxy resin, comprising phenol-type novolac epoxy resin, biphenol A-type novolac epoxy resin, orthocresol novolac epoxy resin, dicyclopentadiene phenol-type epoxy resin;(3) phosphorus-containing epoxy resin, comprising 9,10-dihydro-9-ova-10-phosphaphenanthrene-10-oxide modified epoxy resin, ...

TRANSPARENT POLYIMIDE FILM AND PREPARATION METHOD THEREOF

The present invention relates to a transparent polyimide film with improved tensile strength and a preparation method thereof, and more specifically to a colorless, transparent polyimide film having excellent optical properties and improved tear strength at the same time through the use of a monomer containing a functional group or an improver for improving tensile strength, and a preparation method thereof, wherein the functional group is selected from the group consisting of a hexafluoro group, a sulfone group, and an oxy group. 1. A method of preparing a transparent polyimide film , comprising the steps of:copolymerizing an aromatic dianhydride and an aromatic diamine to obtain polyamic acid; andcasting the polyamic acid on a support to imidize the polyamic acid,wherein the method further comprises the step of introducing an additive for improving tear strength before or after obtaining the polyamic acid, orthe step of introducing a monomer including a functional group selected from the group consisting of a hexafluro group, a sulfone group and an oxy group before obtaining the polyamic acid.2. The method of claim 1 , wherein the additive is at least one selected from among polyphenylsilsesquioxane claim 1 , tetramethoxy silane claim 1 , tetraethoxy silane claim 1 , tetrabutoxy silane claim 1 , 3-aminopropyl triethoxy silane claim 1 , and 3-aminopropyl trimethoxy silane.3. The method of claim 1 , wherein the additive is included in an amount of 0.001-20 parts by weight based on 100 parts by weight of the polyamic acid.4. A transparent polyimide film claim 1 , comprising:a unit structure derived from an aromatic dianhydride and an aromatic diamine,wherein the transparent polyimide film further comprises an additive for improving tear strength, ora unit structure derived from a monomer including a functional group selected from the group consisting of a hexafluro group, a sulfone group and an oxy group.5. The transparent polyimide film of claim 4 , wherein the ...

COMPOSITES INCLUDING SILICON-OXY-CARBIDE LAYERS AND METHODS OF MAKING THE SAME

Composites comprising at least one silicon-oxy-carbide (SOC) layer deposited onto a polymeric matrix substrate to enhance their thermo-oxidative stability are provided. The SOC layer is formed onto the polymeric matrix substrate by atmospheric plasma deposition to produce an thermo-oxidative barrier coating or an adhesion-promoting layer to enable the deposition of a variety of known (or future developed) metallic and/or ceramic materials as oxygen and/or thermal barriers. 1. A composite , comprising: a polymeric substrate and a thermo-oxidative barrier coating comprising a silicon-oxy-carbide (SOC) layer having a thickness from about 100 to about 900 nm and covering at least one surface of the polymeric substrate.2. The composite of claim 1 , wherein the SOC layer is formed by atmospheric plasma deposition.3. The composite of claim 2 , wherein the SOC layer includes a carbon content ranging from about 3% to about 50%.4. The composite of claim 2 , wherein the SOC layer includes a silicon content ranging from about 3% to about 50%.5. The composite of claim 2 , wherein the SOC layer includes an oxygen content ranging from about 3% to about 50%.6. The composite of claim 2 , wherein the SOC layer reduces oxygen diffusion into the polymeric substrate.7. The composite of claim 6 , wherein said composite comprises a thermo-oxidative stability (TOS) of less than about 5.0% weight loss relative to a composite comprising the same polymeric substrate and being devoid of the SOC layer.8. The composite of claim 6 , wherein said composite comprises a thermo-oxidative stability (TOS) of less than about 2.0% weight loss relative to a composite comprising the same polymeric substrate and being devoid of the SOC layer.9. The composite of claim 2 , wherein the polymeric substrate comprises a polymeric matrix selected from a polyimide claim 2 , an epoxy claim 2 , bismaleimide claim 2 , and a cyanate ester.10. The composite of claim 2 , wherein the polymeric substrate comprises a ...

METHODS OF SOLUBILIZING MILLING MEDIA IN PIGMENT PARTICLE DISPERSIONS

The present invention describes methods for preparing a pigment particle dispersion. Specifically, a premix composition including pigments, dispersants and a liquid carrier is milled by a solid milling agent to predetermined particle size. The solid milling agent is solubilized in the liquid carrier which eliminates the need for separating the solid milling agent from the dispersion. 1. A method for preparing an in-situ , pigment particle dispersion comprising:providing a premix composition including one or more pigments, one or more dispersants, and a liquid carrier;milling said premix composition in the presence of a solid milling agent to a predetermined particle size whereby said solid milling agent is substantially insoluble in said liquid carrier; andsolubilizing said solid milling agent in said liquid carrier.2. The method according to claim 1 , wherein said solubilizing said solid milling agent is carried out after obtaining said predetermined particle size.3. The method according to or claim 1 , wherein said solubilizing said solid milling agent is carried out by neutralizing via pH adjustment.4. The method according to claim 3 , wherein said pH adjustment is addition of an acid.5. The method according to claim 3 , wherein pH adjustment is addition of a base.6. The method according to claim 4 , wherein said acid is selected from acetic acid claim 4 , lactic acid claim 4 , phosphoric acid claim 4 , hydrochloric acid claim 4 , or combinations thereof.7. The method according to claim 5 , wherein said base is selected from ammonia claim 5 , monoethylamine claim 5 , triethylamine claim 5 , sodium hydroxide claim 5 , potassium hydroxide claim 5 , or combinations thereof.8. The method according to or claim 5 , wherein said solubilizing said solid milling agent is carried out by adding one or more additional solvents to said premix composition.9. The method according to or claim 5 , wherein said solubilizing said solid milling agent is carried out by neutralizing ...

POLYMER PARTICLE, AQUEOUS DISPERSION INCLUDING THE SAME, AND FLUORORESIN COATING COMPOSITION USING THE SAME

The present invention provides a polymer particle comprising a polymer and a filler contained therein, wherein the polymer is soluble in an organic solvent and is also water insoluble, and wherein the polymer particle contains from 5 to 500 parts by weight of filler per 100 parts by weight of polymer, and a mean particle size of 75 μm or less. The invention also provides an aqueous dispersion including this particle; an aqueous fluororesin coating composition that uses this aqueous dispersion; and a fluororesin laminate or layered coating having a layer obtained from this fluororesin coating composition. 1. A polymer particle comprising a polymer and a filler contained therein , wherein the polymer is soluble in an organic solvent and is also water insoluble , and wherein the polymer particle contains from 5 to 500 parts by weight of filler per 100 parts by weight of polymer , and a mean particle size of 75 μm or less.2. The polymer particle according to claim 1 , wherein the polymer is at least one selected from polyimides claim 1 , polyamide imides claim 1 , polyamides claim 1 , polyesters claim 1 , polyethylene terephthalate claim 1 , polyphenylene sulfide claim 1 , polysulfones claim 1 , polyetherimides claim 1 , and polyethersulfones.3. The polymer particle according to or claim 1 , wherein the filler is an organic particle or inorganic particle.4. The polymer particle according to claim 3 , wherein the inorganic particle is at least one selected from silicon carbide claim 3 , silicon oxide claim 3 , aluminum oxide claim 3 , zinc oxide claim 3 , tin oxide claim 3 , titanium dioxide claim 3 , barium sulfate claim 3 , and carbon black.5. The polymer particle according to claim 3 , wherein the organic particle is at least one selected from polyphenylene sulfide claim 3 , polyetheretherketone claim 3 , and aramid.6. A polymer particle aqueous dispersion comprising a polymer particle according to and an organic solvent in which the polymer of said polymer particle ...

POLYAMIC ACID RESIN COMPOSITION AND METHOD OF PRODUCING THE SAME

The disclosed polyamic acid resin composition contains (a) a polyamic acid represented by general formula (1) or (2), and (b) a solvent. (A, A′, C, C′ are end-capped polyamic acid blocks comprising diaminobenzanilide and pyromellitic dianhydride or benzophenone tetracarboxylic dianhydride, and B, or D, is a polyamic acid block comprising a repeating unit other than A, A′, or C, C′. 4. The polyamic acid resin composition according to claim 1 , further comprising (c) inorganic particles. The present invention relates to a polyamic acid resin composition. More specifically, the present invention relates to a polyamic acid resin composition to be used suitably for, e.g., flexible substrates of a flat-panel display, electronic paper, a solar battery, and the like; a surface protective coat for a semiconductor device; a dielectric film among layers; an insulation layer or spacer layer of an organic electro-luminescence device (organic EL device); a planarization layer of a thin film transistor substrate; an insulation layer of an organic transistor; a flexible printed circuit board; and a binder for electrodes of a lithium ion secondary battery.Organic films are advantageous in that they are excellent in flexibility and less prone to rupture as compared with glass. Recently, there is an increasing move toward rendering displays more flexible by replacing the substrates of flat display panels from conventional glass to organic films.In the event that a display is produced on an organic film, a process is common in which the organic film is formed on a substrate and the organic film is peeled off from the substrate after the production of a device. An organic film can be formed on a substrate by the following methods. One example is a method in which an organic film is stuck on a glass substrate with an adhesive (e.g., Patent Document 1). Alternatively, another example is a method in which a substrate is coated with a solution containing a resin as a raw material of a film ...

CHLORO-SUBSTITUTED POLYETHERIMIDES HAVING IMPROVED RELATIVE THERMAL INDEX

A polyetherimide having an OH content that is greater than 0 and equal or less than 100 ppm; and a chlorine content that is greater than 0 ppm is disclosed herein. A method for preparing the polyetherimide is also disclosed. 1. A polymer comprising a polyetherimide having an OH content that is greater than 0 and less than or equal to 100 parts per million by weight (ppm) and a chlorine content that is greater than 0 ppm.3. The polyetherimide of claim 1 , wherein chlorine content is present in an amount greater than 0 to 4 claim 1 ,000 ppm.4. The polyetherimide of claim 1 , wherein the polyetherimide has a flame retardant rating of V0 at 1.5 mm.5. The polyetherimide of claim 3 , wherein the polyetherimide has a flame retardant rating of V0 at 0.8 mm.7. A composition comprising the polyetherimide of claim 6 , and an additional polymer.8. The composition of claim 6 , wherein the polymer is selected from the group consisting of polyesters claim 6 , polycarbonates claim 6 , polyolefins claim 6 , polysulfones claim 6 , polyphenylene sulfides claim 6 , polyetheretherketones claim 6 , polyethersulfones claim 6 , polyamides claim 6 , polyamideimides claim 6 , polyimides other than the polyetherimide of claim 6 , and combinations thereof.9. A composition comprising the polyetherimide of and an additional polymer.10. The composition of claim 1 , wherein the polymer is selected from the group consisting of polyesters claim 1 , polycarbonates claim 1 , polyolefins claim 1 , polysulfones claim 1 , polyphenylene sulfides claim 1 , polyetheretherketones claim 1 , polyethersulfones claim 1 , polyamides claim 1 , polyamideimides claim 1 , polyimides other than the polyetherimide of claim 1 , and combinations thereof.11. A method for preparing the polyetherimide of claim 1 , which comprises contacting claim 1 , in o-dichlorobenzene or anisole as diluent claim 1 , substantially equimolar amounts of a disodium salt of a dihydroxy compound of formula HO—R′—OH claim 1 , and a slurry of a ...

CARBOXYL GROUP-CONTAINING POLYIMIDE, THERMOSETTING RESIN COMPOSITION AND FLEXIBLE METAL-CLAD LAMINATE

The present invention aims to provide a carboxyl group-containing polyimide, and prepolymer thereof which give a cured product highly satisfying thermosetting property, PCT resistance, solvent resistance and peel strength at the same time. The present invention relates to a terminal acid anhydride group-containing imide prepolymer which is characterized by being produced by reacting an acid anhydride group in a tetracarboxylic acid dianhydride with an isocyanate group in a diisocyanate compound, and a carboxyl group-containing polyimide which is characterized in having such a structure where the chain of said terminal acid anhydride group-containing imide prepolymer is extended via a polyol compound. The present invention also relates to a thermosetting resin composition and a flexible metal-clad laminate which utilize such carboxyl group-containing polyimide. 119-. (canceled)20. A thermosetting resin composition to be used as a resist layer of a printed circuit board which is characterized in that it contains a carboxyl group-containing polyimide and an oxirane ring-containing compound , and in that said carboxyl group-containing polyimide has such a structure where the chain of a terminal acid anhydride group-containing imide prepolymer is extended via a polyol compound , wherein said terminal acid anhydride group-containing imide prepolymer has been produced by reacting an acid anhydride group in a tetracarboxylic acid dianhydride with an isocyanate group in a diisocyanate compound.21. The thermosetting resin composition according to claim 20 , wherein the using amount of an oxirane ring-containing compound is 2 to 100 parts by weight to 100 parts by weight of the carboxyl group-containing polyimide.22. The thermosetting resin composition according to claim 20 , wherein it further contains a phosphorus atom-containing organic filler.23. The thermosetting resin composition according to claim 22 , wherein the ratio by weight of the carboxyl group-containing ...

HALOGEN-FREE RESIN COMPOSITION

A halogen-free resin composition includes 100 parts by weight of epoxy resin; 10 to 100 parts by weight of benzoxazine resin; 10 to 100 parts by weight of styrene-maleic anhydride copolymer; and 10 to 90 parts by weight of dicyclopentadiene phenol novolac resin. The halogen-free resin composition features specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dielectric dissipation factor, high heat resistance and high non-flammability and produce prepregs or resin film, and is thus applicable to copper clad laminates and printed circuit boards. 1. A halogen-free resin composition , comprising:(A) 100 parts by weight of epoxy resin;(B) 10 to 100 parts by weight of benzoxazine resin;(C) 10 to 100 parts by weight of styrene-maleic anhydride copolymer; and(D) 10 to 90 parts by weight of dicyclopentadiene phenol novolac resin2. The composition of claim 1 , wherein the epoxy resin is at least one selected from the group consisting of bisphenol A epoxy resin claim 1 , bisphenol F epoxy resin claim 1 , bisphenol S epoxy resin claim 1 , bisphenol AD epoxy resin claim 1 , phenol novolac epoxy resin claim 1 , bisphenol A phenol novolac epoxy resin claim 1 , bisphenol F phenol novolac epoxy resin claim 1 , o-cresol novolac epoxy resin claim 1 , trifunctional epoxy resin claim 1 , tetrafunctional epoxy resin claim 1 , multifunctional epoxy resin claim 1 , dicyclopentadiene (DCPD) epoxy resin claim 1 , phosphorus-containing epoxy resin claim 1 , DOPO-containing epoxy resin claim 1 , DOPO-HQ epoxy resin claim 1 , p-xylene epoxy resin claim 1 , naphthalene epoxy resin claim 1 , benzopyran epoxy resin claim 1 , diphenyl phenol novolac epoxy resin claim 1 , isocyanate modified epoxy resin claim 1 , phenol benzaldehyde epoxy resin claim 1 , and phenol aralkyl novolac epoxy resin.3. The composition of claim 1 , wherein the benzoxazine resin is at least one selected from the group consisting of bisphenol A benzoxazine resin claim 1 , bisphenol B ...

METHOD FOR PRODUCING RESIN FILM USING ELECTROCONDUCTIVE RESIN COMPOSITION

There is provided a production method for a resin film according to which an application liquid raw material (polyaniline solution) does not gelate over a long period of time and a resin film can be stably produced. A production method for a resin film according to an embodiment of the present invention includes the step of heating and kneading a polyaniline in an emeraldine base state and a protonic acid to prepare a conductive resin composition. 1. A production method for a resin film , comprising the step of heating and kneading a polyaniline in an emeraldine base state and a protonic acid to prepare a conductive resin composition.2. A production method for a resin film according to claim 1 , further comprising a step of supplying an application liquid containing the conductive resin composition and a heat-resistant resin to a support claim 1 , so as to form a coating film on the support.3. A production method for a resin film according to claim 2 , wherein claim 2 , a conductive polyaniline doped with the protonic acid are generated by the heating and kneading claim 2 , andin the application liquid, an arithmetic average particle diameter of the conductive polyaniline is 10 μm or less.4. A production method for a resin film according to claim 2 , wherein the heat-resistant resin comprises a polyamide-imide-based resin.5. A production method for a resin film according to claim 2 , wherein an addition amount of the polyaniline when the conductive resin composition is prepared is 1 part by weight to 5 parts by weight with respect to 100 parts by weight of the heat-resistant resin.6. A resin film claim 1 , which is produced by the production method according to .7. A seamless belt claim 6 , comprising the resin film according to .8. A conductive resin composition claim 6 , which is obtained by heating and kneading a polyaniline in an emeraldine base state and a protonic acid.9. A polyaniline solution claim 8 , which is obtained by mixing the conductive resin ...

AQUEOUS AMINE-CARBOHYDRATE THERMOSETS HAVING REDUCED WEIGHT LOSS UPON CURE AND IMPROVED EARLY DRY STRENGTH

The present invention provides thermosetting aqueous binder compositions comprising one or more reducing sugar, one or more diprimary diamine or poly(primary amine), and from 7 to 45 wt. %, based on total solids, of one or more polysaccharide having a dextrose equivalent (DE) value of from 5 to 30. The compositions provide treated articles, such as fiberglass mat. The binders provide articles having a dramatically reduced binder weight loss upon cure and a reduction in cure energy needed to achieve early dry strength. 1. An aqueous thermosetting binder composition comprise i) one or more reducing sugar , ii) one or more diprimary diamine or poly(primary amine) , wherein the weight ratio of the total diprimary diamine or poly(primary amine) solids to total reducing sugar solids ranges from 1.2:1 to 0.12:1; iii) from 7 to 45 wt. % , based on total solids , of one or more polysaccharide having a dextrose equivalent (DE) value of from 5 to 30.2. The composition as claimed in claim 1 , wherein the reducing sugar is dextrose.3. The composition as claimed in claim 1 , wherein the diprimary diamine or poly(primary amine) is a diprimary diamine.4. The composition as claimed in claim 3 , wherein diprimary diamine is hexamethylene diamine (NMDA).5. The composition as claimed in claim 1 , wherein the one or more polysaccharide has a DE value of from 7 to 23.6. The compositions as claimed in claim 5 , wherein the one or more polysaccharide is a maltodextrin.7. The composition as claimed in claim 1 , wherein the one or more polysaccharide is present in the amount of from 10 to 30 wt. % based on total solids.8. The composition as claimed in claim 1 , further comprising one or more stabilizer.9. A method of using the aqueous thermosetting binder composition as claimed in comprising:applying the binder composition to or mixing it with a substrate and then heating the thus treated substrate or mixture to cure the binder at from 100 to 400° C.10. A treated fiber matt containing a ...

Polyimide seamless belt and process for production thereof, and polyimide precursor solution composition

A seamless belt formed of a polyimide including a repeating unit represented by the formula (1): in which 25 mol % to 95 mol % of A is a tetravalent unit represented by the formula (2): 75 mol % to 5 mol % of A is a tetravalent unit represented by the formula (3): 15 mol % to 95 mol % of B is a divalent unit represented by the formula (4): and 85 mol % to 5 mol % of B is a divalent unit represented by the formula (5):

Organic electroluminescent element, composition for organic electroluminescent element, and organic electroluminescent device

The present invention relates to an organic electroluminescent element which comprises two or more hole injection/transport layers each formed by a wet film formation method using a composition containing, as a hole-injecting/transporting compound, an arylamine polymer compound that has a repeating unit having a triarylamine structure therein, in which when the number of atoms present on the path which is the smallest in the number of atoms present thereon, of the paths which each connect the nonaromatic tertiary nitrogen atoms contained in any two triarylamine structures present in each polymer compound, is taken as N: the minimum number of atoms between nitrogen atoms in the compound, then the N in each hole injection/transport layer is in a specific state.

PREPARATION OF SULFONATED NAPHTHALENE POLYOXADIAZOLES POLYMERS

Described is the preparation of sulfonated polyoxadiazole polymers with a high degree of sulfonation and good flammability properties. The polymers are useful in articles such as fibers. 1. A process for preparing a polymer , comprising the steps of:{'sub': '3', 'a) combining hydrazine, oleum, 2,6-naphthalene dicarboxylic acid and one or both of terephthalic acid and isophthalic acid, to form a reaction mixture, wherein the oleum is added in an amount of at least about 4 molar equivalents of SObased on the number of moles of hydrazine; and'}b) heating the reaction mixture to a temperature of about 100° C. to about 180° C. until a polymer is prepared.2. The process of wherein the oleum is added in an amount of at least about 5 molar equivalents of SObased on the number of moles of hydrazine.3. The process of wherein the oleum is added in one step.4. The process of wherein the heating is performed at about 120° C. to about 140° C. for at least about 0.5 hours.5. The process of wherein step a) comprises the steps of:1) combining hydrazine or salt thereof, 2,6-naphthalene dicarboxylic acid, and one or both of terephthalic acid and isophthalic acid to form a pre-mixture;2) stirring the pre-mixture for at least 5 minutes; and{'sub': '3', '3) adding oleum to the pre-mixture in an amount of at least about 5 molar equivalents of SObased on the number of moles of hydrazine to form a reaction mixture.'}6. The process of wherein the reaction mixture comprises about 1 molar % to about 50 molar % of 2 claim 1 ,6-naphthalene dicarboxylic acid and about 50 molar % to about 99 molar % of one or both of terephthalic acid and isophthalic acid claim 1 , based on the total amount of 2 claim 1 ,6-naphthalene dicarboxylic acid claim 1 , terephthalic acid and isophthalic acid present.7. The process of wherein the reaction mixture comprises about 10 molar % to about 30 molar % of 2 claim 1 ,6-naphthalene dicarboxylic acid and about 70 molar % to about 90 molar % of one or both of ...

POLYETHERIMIDES, METHODS OF MANUFACTURE, AND ARTICLES FORMED THEREFROM

Polyetherimide compositions are described wherein the polyetherimide composition comprises a polyetherimide comprising a reacted combination of alkali metal salts comprising an alkali metal salt of a dihydroxy aromatic compound and an alkali metal salt of a monohydroxy aromatic compound with a bis(halophthalimide), wherein the alkali metal salt of the monohydroxy aromatic compound is included in an amount of greater or equal to 5 mole percent based on the total moles of the alkali metal salts, and the polyetherimide has a weight average molecular weight less than 43,000 Daltons. The polyetherimide exhibits lower levels of chlorine and chlorine end groups, lower levels of bis(halophthalimide) and bis(phthalimide), and low plate-out during manufacturing. 3. The polyetherimide composition of claim 1 , wherein the polyetherimide comprises from 0.5 to 4 weight percent of a monohydroxy aromatic compound substituent claim 1 , based on the total weight of the polyetherimide.4. The polyetherimide composition of claim 1 , wherein a total content of residual bis(halophthalimide) and residual bis(phthalimide) is less than 0.05 weight percent claim 1 , based on the total weight of the polyetherimide.5. The polyetherimide composition of claim 1 , wherein a total content of residual bis(halophthalimide) is less than 600 ppm claim 1 , based on the total weight of the polyetherimide.6. The polyetherimide composition of claim 1 , wherein a content of chloride is less than 3000 ppm claim 1 , based on the total weight of the polyetherimide.7. The polyetherimide composition of claim 1 , wherein the composition has a plate-out weight of less than 1.1 mg claim 1 , when determined using 200 shots from a 100° F. (37.8° C.) mold having the dimensions of 5×6×0.16 inches (12.7×15.2×0.4 cm).8. The polyetherimide composition of claim 1 , wherein the composition has a plate-out weight of less than 1.1 mg claim 1 , when determined using 200 shots from a 350° F. (177° C.) Dynatup having the ...

POLYMER COMPOSITIONS, POLYMER FILMS, AND METHODS FOR FORMING SAME

Stable, high performance polymer compositions including polybenzimidazole (PBI) and a melamine-formaldehyde polymer, such as methylated, poly(melamine-co-formaldehyde), for forming structures such as films, fibers and bulky structures. The polymer compositions may be formed by combining polybenzimidazole with the melamine-formaldehyde polymer to form a precursor. The polybenzimidazole may be reacted and/or intertwined with the melamine-formaldehyde polymer to form the polymer composition. For example, a stable, free-standing film having a thickness of, for example, between about 5 μm and about 30 μm may be formed from the polymer composition. Such films may be used as gas separation membranes and may be submerged into water for extended periods without crazing and cracking. The polymer composition may also be used as a coating on substrates, such as metal and ceramics, or may be used for spinning fibers. Precursors for forming such polymer compositions are also disclosed. 1. A precursor of a polymer composition , the precursor comprising a solution of polybenzimidazole and a melamine-formaldehyde polymer.2. The precursor of claim 1 , wherein the melamine-formaldehyde polymer comprises methylated claim 1 , poly(melamine-co-formaldehyde).3. The precursor of claim 1 , wherein the solution consists of the polybenzimidazole claim 1 , methylated claim 1 , poly(melamine-co-formaldehyde) claim 1 , and at least one solvent.4. The precursor of claim 3 , wherein the at least one solvent comprises at least one of a polar claim 3 , aprotic solvent and an organic solvent.5. The precursor of claim 1 , wherein the polybenzimidazole and the melamine-formaldehyde polymer are homogeneously dispersed in at least one solvent.6. The precursor of claim 1 , wherein the solution is formulated to comprise less than or equal to about 40% by weight of the melamine-formaldehyde polymer.7. The precursor of claim 1 , wherein the solution is formulated to comprise a ratio of between about 2:1 and ...

POLYAMIDE-IMIDE RESIN COMPOSITION, POLYAMIDE-IMIDE RESIN FILM USING THE RESIN COMPOSITION, AND SEAMLESS BELT INCLUDING THE RESIN FILM

A polyamide-imide resin composition according to embodiment of the present invention, including a polyamide-imide resin obtained by causing acid components (A) containing a dimer acid and a polyisocyanate component (B) to react with each other, wherein a ratio of the dimer acid in the acid components (A) is 3 mol % to 55 mol %. 1. A polyamide-imide resin composition , comprising a polyamide-imide resin obtained by causing acid components (A) containing a dimer acid and a polyisocyanate component (B) to react with each other , wherein a ratio of the dimer acid in the acid components (A) is 3 mol % to 55 mol %.2. A polyamide-imide resin composition according to claim 1 , wherein the acid components (A) contain a hydrogenated dimer acid.3. A polyamide-imide resin composition according to or claim 1 , wherein the polyisocyanate component comprises contain an aromatic diisocyanate.4. A polyamide-imide resin composition according to or claim 1 , wherein the acid components (A) further contain a tricarboxylic anhydride and a ratio of the tricarboxylic anhydride in the acid components (A) is 90 mol % to 97 mol %.5. A polyamide-imide resin film claim 1 , which is obtained by using the polyamide-imide resin composition according to .6. A polyamide-imide resin film according to claim 5 , wherein the film has a rupture elongation of 60% or more.7. A polyamide-imide resin film according to claim 5 , wherein the film has a remaining solvent amount of 2% or less.8. A seamless belt claim 5 , comprising the polyamide-imide resin film according to . This application claims priority under 35 U.S.C. Section 119 to Japanese Patent Application No. 2012-144173 filed on Jun. 27, 2012, which are herein incorporated by references.1. Field of the InventionThe present invention related to a polyamide-imide resin composition, a polyamide-imide resin film using the resin composition, and a seamless belt including the resin film.2. Description of the Related ArtA polyamide-imide resin is a resin ...

POLYANILINE COMPOSITE, METHOD FOR PRODUCING SAME, AND COMPOSITION

A polyaniline composite including substituted or unsubstituted polyaniline molecules and a proton donar, the polyaniline molecules being doped with the proton donar, the composite having a chlorine content of 0.6 wt % or less and the composite satisfying the following formula (1): 1. A polyaniline composite comprising substituted or unsubstituted polyaniline molecules and a proton donor ,the polyaniline molecules being doped with the proton donor,the composite having a chlorine content of 0.6 wt % or less, and {'br': None, 'i': P', '/P, 'sub': 10000', 'ALL, '≦0.15\u2003\u2003(1)'}, 'the composite satisfying formula (1){'sub': '10000', 'wherein Pis a total sum of weights of the polyaniline molecules in the polyaniline composite having a molecular weight of 10000 or less; and'}{'sub': 'ALL', 'Pis a total sum of weights of all polyaniline molecules in the polyaniline composite.'}2. The polyaniline composite of claim 1 , wherein a weight average molecular weight of the polyaniline molecules is 52000 or more.3. The polyaniline composite of claim 1 , wherein the proton donor is a compound represented by formula (I):{'br': None, 'i': n', 'm, 'M(XAR)\u2003\u2003(I)'}wherein M is a hydrogen atom, an organic free radical or an inorganic free radical; and m is a value of (valence of M)/(valence of X);X is an anion group;A is a hydrocarbon group which may comprise a substituent;{'sup': 1', '1', '1', '1', '1', '1, 'R is a group represented by —H, —R, —OR, —COR, —COOR, —(C═O)—(COR) or —(C═O)—(COOR);'}{'sup': 1', '2', '3', '3', '3', '2', '3, 'sub': '2', 'Ris a hydrocarbon group which may have a substituent, a silyl group, an alkylsilyl group, a group represented by —(RO)x-Ror a group represented by —(OSiR)x-OR, wherein each Ris independently an alkylene group, each Ris independently a hydrocarbon group and x is an integer of 1 or more; and'}n is an integer of 1 or more.5. A solution comprising 1 g or more of the polyaniline composite of dissolved in a mixed solvent of 95 g of ...

Resin-transfer-moldable terminal-modified imide oligomer using 2-phenyl-4,4' diaminodiphenyl ether and having excellent moldability, mixture thereof, varnish containing same, and cured resin thereof and fiber-reinforced cured resin thereof made by resin transfer molding and having excellent heat resistance

A novel resin-transfer-moldable terminal-modified imide oligomer having a residue of a tetravalent aromatic tetracarboxylic acid and represented by general formula (1), and the imide oligomer contains an oligomer where n is 0 in an amount of 10% by mole or more. In the formula, R 1 and R 2 are a hydrogen atom or an aromatic hydrocarbon group having 6 to 10 carbon atoms, and one of R 1 and R 2 is the aromatic hydrocarbon group having 6 to 10 carbon atoms; R 3 is an aromatic organic group surrounded by four carbonyl groups in the aromatic tetracarboxylic acid, and for a formula where n is 2 or more, R 3 s are optionally the same as or different from each other; and n is an integer of 0 or more and 6 or less.

Organic el element, radiation-sensitive resin composition, and cured film

The organic EL display element is constituted by having a substrate, a TFT disposed on the substrate, a protective film covering the TFT, an anode disposed on the protective film, an organic luminescent layer disposed on the anode, a bank that defines an arranging area for the organic luminescent layer, and a cathode disposed on the organic luminescent layer. At least one of the protective film and bank is constituted as a cured film that is formed by using a radiation-sensitive resin composition containing a resin and a compound having a quinonediazide structure, contains a resin and at least one of a compound having a quinonediazide structure and a compound having an indenecarboxylic acid structure, and has an excellent patterning property.

Biodegradable And Compostable Component For Cosmetic Packaging

A biodegradable component for a package for storing and dispensing a cosmetic product or a beauty care product is made from compressed fibrous biomass bound by a cosmetically compatible and compostable binder in a mold having a sidewall draft angle of 0 to 30 degrees. 1. A biodegradable component for a package for storing and dispensing cosmetic and beauty care products , the component comprising:a compressed fibrous biomass bound by a cosmetically compatible and compostable binder, the component adapted to store, dispense or apply cosmetic or beauty care products, wherein the component is formed in a mold having a sidewall draft angle that is about 0 degrees to about 30 degrees.2. The component of wherein the draft angle is about 0.1 degree to about 17 degrees.3. The component of wherein the draft angle is about 1 degree to about 7 degrees.4. The component of wherein the component is a pressed powder pan5. The component of wherein the pan is adapted to be used in a filling operation at powder pressing pressures in the range of 0.1 p.s.i to 2 claim 4 ,500 p.s.i.6. The method of wherein the cosmetically compatible and compostable binder is a resin selected from the group consisting of a biodegradable one of polyurethane resin claim 1 , polyester claim 1 , aliphatitic polyester claim 1 , polyvinyl alcohol claim 1 , polycaprolactone claim 1 , polyhydroxyalkanoate claim 1 , denatured starch claim 1 , a natural polymer claim 1 , a polyisocyanate claim 1 , polyglycolic acid claim 1 , polylactic acid claim 1 , polyhydroxybutyric acid claim 1 , polyhydroxyvaleric acid claim 1 , a polyhydroxycarboxylic acids claim 1 , polybutylene succinate and polybutylene adipatea.7. The method of wherein the cosmetically compatible and compostable binder is a naturally occurring constituent of the fibrous biomass. 1. Field of the InventionThe present invention relates to cosmetic and personal care packaging. In particular, the present invention is directed to biodegradable cosmetic and ...

Material for alignment layer of liquid crystal display

The present invention provides a material for alignment layer of liquid crystal display, which includes a solvent and a polymer dissolved in the solvent. The polymer includes a backbone and a first side chain linked to the backbone. The first side chain has a stronger lateral dipole moment. The material for alignment layer of liquid crystal display is characterized in that a first side chain that contains both a flexible chain segment and rigid chain segment is linked to the backbone of the polymer and the first side chain has a stronger lateral dipole moment, making it taking a rotation or tilting motion under the application of an electric field so as to effect alignment of the liquid crystal molecules in the pre-tilt angle.

EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME

Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a curing agent; (C) an inorganic filler including manganese oxide; and (D) a curing accelerator. 1. A prepreg produced by impregnating a reinforcing material with an epoxy resin composition to form an impregnated substrate , and drying the impregnated substrate to a semi-cured state , the epoxy resin composition comprising:(A) an epoxy resin having at least two epoxy groups in one molecule;(B) a curing agent; and{'sub': 3', '4', '3', '4', '3', '4, '(C) MnOas an inorganic filler, wherein MnOhas an average particle diameter of less than 150 μm, and MnOis present in an amount of 0.1 to 10 parts by weight, based on 100 parts by weight of the epoxy resin.'}2. The prepreg as claimed in claim 1 , the manganese oxide is present in an amount of 0.3 to 3 parts by weight claim 1 , based on 100 parts by weight of the epoxy resin.3. The prepreg as claimed in claim 1 , Wherein the inorganic filler further comprises at least one of silica claim 1 , alumina claim 1 , aluminum hydroxide claim 1 , mica claim 1 , talc claim 1 , and kaolin clay.4. The prepreg as claimed in claim 1 , wherein the epoxy resin is selected from the group consisting of bisphenol A epoxy resin claim 1 , bisphenol F epoxy resin claim 1 , bisphenol S epoxy resin claim 1 , phenol novolak epoxy resin claim 1 , and cresol novolak epoxy resin.5. The prepreg as claimed in claim 4 , the bisphenol A epoxy resin includes a brominated bisphenol A epoxy resin.6. The prepreg as claimed in claim 4 , the phenol novolak epoxy resin includes DOPO-PNE which is obtained by reacting 10-dihydro-9-oxa-10-phosphahenanthrene-10-oxide (DOPO) with phenol novolac epoxy resin (PNE).7. The prepreg as claimed in claim 1 , wherein the curing agent is present in an amount of 10 to 30 parts by weight claim 1 , based on 100 parts by weight of the epoxy resin.8. The prepreg as claimed in claim 1 , wherein the curing agent is selected from ...

ACRYLIC RESIN FILM

Disclosed herein is an acrylic resin film having excellent heat resistance and mechanical strength, less fish-eyes, and high transparency. The acrylic resin film is obtained by molding a resin composition containing a glutarimide acrylic resin (G) and a (meth)acrylic resin (F) obtained by polymerization of a vinyl group-containing compound in the presence of alkyl acrylate-based cross-linked elastic particles having an average particle size of less than 80 nm. 3. The acrylic resin film according to claim 1 , wherein claim 1 , when an amount of the resin composition is taken as 100 wt % claim 1 , an amount of the alkyl acrylate-based cross-linked elastic particles contained in the resin composition is 5 to 40 wt %.4. The acrylic resin film according to claim 1 , wherein claim 1 , when an amount of the resin composition is taken as 100 wt % claim 1 , amounts of the glutarimide acrylic resin (G) and the (meth)acrylic resin (F) contained in the resin composition are 40 to 90 wt % and 60 to 10 wt % claim 1 , respectively.5. The acrylic resin film according to claim 1 , wherein the (meth)acrylic resin (F) is obtained by polymerization of a monomer mixture (E) containing 60 to 100 wt % of alkyl methacrylate and 0 to 40 wt % of alkyl acrylate in the presence of alkyl acrylate-based cross-linked elastic particles (B) having an average particle size of less than 80 nm and obtained by copolymerization of 100 parts by weight of a monomer mixture containing 50 to 100 wt % of alkyl acrylate and 50 to 0 wt % of alkyl methacrylate and 0.5 to 5 parts by weight of a polyfunctional monomer having two or more non-conjugated double bonds per molecule.6. The acrylic resin film according to claim 1 , wherein the (meth)acrylic resin (F) is obtained by polymerization of a monomer mixture (E) containing more than 10 wt % but 35 wt % or less of unsaturated carboxylic acid claim 1 , 50 wt % or more but less than 90 wt % of alkyl methacrylate and 0 wt % or more but less than 40 wt % of alkyl ...

POLYIMIDE FILM INCORPORATING POLYIMIDE POWDER DELUSTRANT, AND MANUFACTURE THEREOF

A polyimide film includes a polyimide layer including a polyimide base polymer, and a polyimide powder distributed in the polyimide base polymer, the polyimide powder being obtained by reacting a diamine with a dianhydride at a molar ratio of about 1:0.950 to about 1:0.995. Moreover, the polyimide film may have a multilayered structure including at least a second polyimide layer stacked on a surface of the polyimide layer. The second polyimide can also include the polyimide powder at a weight ratio less than about 20 wt % of the total weight of the second polyimide layer. Embodiments described herein also include methods of preparing the polyimide films. 1. A polyimide film comprising:a polyimide layer including a polyimide base polymer; anda polyimide powder distributed in the polyimide base polymer, the polyimide powder being obtained by reacting a diamine with a dianhydride at a molar ratio of about 1:0.950 to about 1:0.995.2. The polyimide film according to claim 1 , wherein the diamine is oxydianiline (ODA) claim 1 , and the dianhydride is pyromellitic dianhydride (PMDA).3. The polyimide film according to claim 1 , wherein the polyimide powder has an average particle size between about 2 μm and about 10 μm.4. The polyimide film according to claim 1 , further comprising a color pigment distributed in the polyimide base polymer.5. The polyimide film according to claim 4 , wherein the color pigment has a weight ratio between about 2 and about 10 wt % of the weight of the polyimide layer.6. The polyimide film according to claim 4 , wherein the color pigment is carbon black.7. The polyimide film according to claim 1 , wherein the polyimide powder has a weight ratio between about 20 and about 50 wt % of the total weight of the polyimide layer.8. The polyimide film according to claim 1 , further including a second polyimide layer stacked on a surface of the polyimide layer.9. The polyimide film according to claim 8 , wherein the second polyimide layer also includes ...

ORGANIC SULFONIC ACID COMPOUND, DOPANT HAVING SAME, AND CONDUCTIVE POLYMER COMPLEX HAVING THE DOPANT

The present disclosure relates to an organic sulfonic acid-based compound and a preparation method thereof, a dopant including the compound, and a conductive polymer composite including the dopant, and more specifically, provides a dopant including a derivative compound containing a sulfonic acid group connected to a benzene ring via a flexible chain to enhance the solubility and the dispersibility in a general solvent, and the environment-resistance thereof, thus increasing the electric conductivity and significantly improving not only the processability but also the mechanical feature. 1. An organic sulfonic acid-based compound in which an aryl group having a substituent is bonded by a flexible hydrocarbon chain , represented by the following Chemical Formula 1:{'br': None, 'sub': 3', '2', '1', '3, 'Ar(R)(R)O—R—SOZ;\u2003\u2003[Chemical Formula 1]'}wherein in Chemical Formula 1,Ar represents an aryl group,{'sub': 1', '1', '20', '2', '20', '1', '20', '2', '20', '2', '2', 'n, 'Rrepresents C-Calkyl, C-Calkenyl, halo-C-Calkyl, halo-C-Calkenyl, or —(CHCHO),'}{'sub': 2', '3', '3', '6', '5', '6', '4', '3', '2', '6', '5', '1', '20', '2', '20', '1', '20', '2', '20', '2', '2', 'n', '2', '3, 'Rand Rare independently selected from —H, —OH, —CH, —CH, —CHOCH, —OCHCH, C-Calkyl, C-Calkenyl, halo-C-Calkyl, halo-C-Calkenyl, and —(CHCHO), respectively, provided that Rand Rare not —H at the same time,'}{'sup': +', '+', '+, 'sub': 3', '2', '1', '3, 'Z represents —H or a metal cation M, and if Z is M, the organic sulfonic acid-based compound has a salt form represented by Ar(R)(R)O—R—SOM, and'}n represents an integer of 1 or more.2. The organic sulfonic acid-based compound of claim 1 ,{'sub': 2', '3, 'wherein both of Rand Rare not —H.'}3. The organic sulfonic acid-based compound of claim 1 ,{'sub': 2', '3', '6', '5', '6', '4', '3', '2', '6', '5, 'wherein if one of Rand Ris —CH, —CHOCH, or —OCHCH, the other one is H.'}4. The organic sulfonic acid-based compound of claim 1 ,wherein the ...

Method for producing masterboard alignment film and transfer printing plate and alignment solution

Embodiments of the present invention disclose a method for producing a masterboard alignment film, and a transfer printing plate and an alignment solution. The method comprises coating the alignment solution on a masterboard having two or more substrates using the transfer printing plate which has a transfer region simultaneously covering the two or more substrates, so that the alignment solution forms an alignment film on the masterboard; and removing the alignment film on the masterboard which is located in regions that are out of the display regions of the substrates and where there is no need to retain the alignment film. This method can solve the existing display defect issues that are caused by too thick peripheral regions of the alignment film, and the overlapping of the too thick peripheral regions of the alignment film with the sealant region.

METHOD OF PRODUCING POLYIMIDE RESIN, METHOD OF PRODUCING POLYIMIDE COATING, METHOD OF PRODUCING POLYAMIC ACID SOLUTION, POLYIMIDE COATING, AND POLYAMIC ACID SOLUTION

A polyimide resin produced by heating a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in N,N,N′,N′-tetramethylurea. 1. A method of producing a polyimide resin , comprising heating a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component at a temperature between 120° C. and 350° C. in N ,N ,N′ ,N′-tetramethylurea.2. A method of producing a polyimide coating , comprising heating a polyimide precursor coating formed by coating on a base substance a polyamic acid solution resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component at a temperature between 120° C. and 350° C. in N ,N ,N′ ,N′-tetramethylurea.3. The method of producing a polyimide coating according to claim 2 , wherein the amount of N claim 2 ,N claim 2 ,N′ claim 2 ,N′-tetramethylurea is from 20 to 2000 parts by mass based on 100 parts by mass of total amount of the tetracarboxylic acid dianhydride component and the diamine component.4. A polyimide film produced by the method according to .5. A method of producing a polyamic acid solution claim 2 , comprising reacting a tetracarboxylic acid dianhydride component and a diamine component in N claim 2 ,N claim 2 ,N′ claim 2 ,N′-tetramethylurea.6. The method of producing a polyamic acid solution according to claim 5 , wherein the amount of N claim 5 ,N claim 5 ,N′ claim 5 ,N′-tetramethylurea is from 20 to 2000 parts by mass based on 100 parts by mass of total amount of the tetracarboxylic acid dianhydride component and the diamine component.7. A polyamic acid solution produced by the method according to . This application claims priority under 35 U.S.C. §119(a)-(d) to Japanese Patent Application No. 2012-182348, filed Aug. 21, 2012, the content of which is incorporated herein by reference.1. Field of the InventionThe present invention relates to a method of producing a polyimide resin, a method ...

CONDUCTIVE RESIN COMPOSITION

Disclosed herein is a conductive resin composition. The conductive resin composition includes a polyolefin resin, a specific compatibilizer, and polyaniline nanofibers. The conductive resin composition may provide a resin molded article having high conductivity and heat resistance together with excellent antistatic properties while securing high compatibility between respective components. 1. A conductive resin composition , comprising:a polyolefin resin;a compatibilizer selected from the group consisting of modified polyolefin grafted with ethylene acrylate, dicarboxylic acid or an acid anhydride thereof, ethylene vinyl acetate, ethylene vinyl alcohol, and an acrylate copolymer; andpolyaniline nanofibers having a cross-sectional diameter of 1 nm to 100 nm and a length of 0.05 μm to 2 μm.2. The conductive resin composition according to claim 1 , comprising:a melt compounded material of the polyolefin resin, the compatibilizer, and the polyaniline nanofibers.3. The conductive resin composition according to claim 1 , comprising:40 wt % to 99.5 wt % of the polyolefin resin;0.1 wt % to 30wt % of the compatibilizer; and0.1 wt % to 50wt % of the polyaniline nanofibers.4. The conductive resin composition according to claim 1 , whereinthe polyolefin resin comprises at least one polymer resin selected from the group consisting of low density polyethylene, high density polyethylene, polypropylene, propylene copolymers, or mixtures thereof.5. The conductive resin composition according to claim 1 , whereinthe dicarboxylic acid or acid anhydride thereof is present in an amount of 1 wt % or more in the modified polyolefin resin grafted with the dicarboxylic acid or acid anhydride thereof.6. The conductive resin composition according to claim 1 , whereinthe ethylene acrylate comprises a random copolymer comprising an ethylene repeating unit and an acrylic acid repeating unit.7. The conductive resin composition according to claim 1 , wherein{'sup': 3', '3, 'the ethylene vinyl ...

NITRILE COPOLYMER LATEX COMPOSITION AND NITRILE COPOLYMER RUBBER COMPOSITION

A nitrile copolymer latex composition containing a latex of a nitrile copolymer rubber (A) having α,β-ethylenically unsaturated nitrile monomer units in 10 to 75 wt %, conjugated diene monomer units in 5 to 89.9 wt %, and cationic monomer units and/or monomer units able to form cations in 0.1 to 20 wt %, an inorganic filler (B) having an aspect ratio of 30 to 2,000, and a plasticizer (C) having an SP value by the HOY method of 8 to 10.2 (cal/cm), wherein a content of said plasticizer (C) is 0.1 to 200 parts by weight with respect to said nitrile copolymer rubber (A) as 100 parts by weight is provided. 1. A nitrile copolymer latex composition containing a latex of a nitrile copolymer rubber (A) having α ,β-ethylenically unsaturated nitrile monomer units in 10 to 75 wt % , conjugated diene monomer units in 5 to 89.9 wt % , and cationic monomer units and/or monomer units able to form cations in 0.1 to 20 wt % , an inorganic filler (B) having an aspect ratio of 30 to 2 ,000 , and a coupling agent (D) , whereina content of said coupling agent (D) is 0.1 to 20 parts by weight with respect to said nitrile copolymer rubber (A) as 100 parts by weight.2. The nitrile copolymer latex composition as set forth in claim 1 , wherein the composition further contains a plasticizer (C) having an SP value by the HOY method of 8 to 10.2 (cal/cm).3. The nitrile copolymer latex composition as set forth in claim 1 , wherein the composition further contains claim 1 , with respect to said nitrile copolymer rubber (A) as 100 parts by weight claim 1 , 10 to 150 parts by weight of a vinyl chloride-based resin and/or acryl-based resin.4. A method of producing a nitrile copolymer rubber composition by coagulation of the nitrile copolymer latex composition as set forth in claim 1 , whereinthe coagulation of said nitrile copolymer latex composition is performed by using a coagulating agent comprised of a salt containing metal ions whose ionic valency is 1 to 3 under conditions of pH 5.0 or less.5. ...

Protective Barrier for Tires and Application Thereof

A tire has a material diffusion barrier, and a method produces the same. In an embodiment, a method for producing a material diffusion barrier on a tire comprises exposing a surface of the tire to a cationic solution to produce a cationic layer on the surface. The method further comprises exposing the cationic layer to an anionic solution to produce an anionic layer on the cationic layer, wherein a layer comprises the cationic layer and the anionic layer. The layer comprises the material diffusion barrier. 1. A method for producing a material diffusion barrier on a tire , comprising:(A) exposing a surface of the tire to a cationic solution to produce a cationic layer on the surface; and(B) exposing the cationic layer to an anionic solution to produce an anionic layer on the cationic layer, wherein a layer comprises the cationic layer and the anionic layer, and wherein the layer comprises the material diffusion barrier.2. The method of claim 1 , further comprising:(C) exposing the anionic layer to a second cationic solution to produce a second cationic layer on the anionic layer, and wherein the layer comprises a trilayer comprising the cationic layer, the anionic layer, and the second cationic layer.3. The method of claim 1 , further comprising:(C) exposing the anionic layer to a second cationic solution to produce a second cationic layer on the anionic layer; and(D) exposing the second cationic layer to a second anionic solution to produce a second anionic layer on the second cationic layer, wherein the layer comprises a quadlayer comprising the cationic layer, the anionic layer, the second cationic layer, and the second anionic layer.4. The method of claim 1 , wherein the cationic solution comprises cationic materials claim 1 , and wherein the cationic materials comprise a polymer claim 1 , a colloidal particle claim 1 , a nanoparticle claim 1 , or any combinations thereof.5. The method of claim 4 , wherein the polymer comprises a polymer with hydrogen bonding ...

POLYIMIDE LAMINATED FILM AND METHOD OF PREPARING POLYIMIDE LAMINATED FILM

A polyimide laminated film includes a porous polyimide layer that has a porosity of from 30% to 90% and pores having a spherical shape and a non-porous polyimide layer that has a porosity of 5% or less. 1. A polyimide laminated film comprising:a porous polyimide layer that has a porosity of from 30% to 90% and pores having a spherical shape; anda non-porous polyimide layer that has a porosity of 5% or less.2. The polyimide laminated film according to claim 1 , [{'br': None, 'Tp>Tn \u2003\u2003(1)'}, {'br': None, 'i': 'Tp+Tn≤', '10 μm≤100 μm \u2003\u2003(2)'}], 'wherein the polyimide laminated film, satisfies the following Expressions (1) and (2)wherein Tp represents an average film thickness of the porous polyimide layer (in a case of including a plurality of the porous polyimide layers, a sum of respective average film thicknesses of the porous polyimide layers), and Tn represents an average film thickness of the non-porous polyimide layer (in a case of including a plurality of the non-porous polyimide layers, a sum of respective average film thicknesses of the non-porous polyimide layers).3. The polyimide laminated film according to claim 1 ,wherein the porous polyimide layer contacts the non-porous polyimide layer.4. The polyimide laminated film according to claim 3 ,wherein in a cross-section in a direction orthogonal to an interface between the non-porous polyimide layer and the porous polyimide layer, a maximum, cross-section height Zt obtained from a sum of a maximum value of a mountain height Zp of a contour curve of the interface and a maximum value of a valley depth Zv is 0.5 μm or less.5. The polyimide laminated film according to claim 1 ,wherein the porosity of the porous polyimide layer is 50% or more.6. The polyimide laminated film according to claim 1 ,wherein Tp is from 5 μm to 100 μm.7. The polyimide laminated film according to claim 1 ,wherein Tp is from 5 μm to 70 μm.8. The polyimide laminated film according to claim 1 ,wherein Tn is from 1 μm. to ...

RESIN POWDER, SEALING MATERIAL, ELECTRONIC COMPONENT, AND RESIN POWDER MANUFACTURING METHOD

Resin powder includes aggregates of spherical particles of a resin composition. The resin composition contains: a resin component including a thermosetting resin; and a non-resin component including at least one electrically insulative inorganic particle and/or at least one magnetic particle. 1. Resin powder comprising aggregates of spherical particles of a resin composition ,the resin composition containing: 'a non-resin component including at least one electrically insulative inorganic particle and/or at least one magnetic particle.', 'a resin component including a thermosetting resin; and'}2. The resin powder of claim 1 , wherein 'a core including the at least one electrically insulative inorganic particle and the resin component covering the core.', 'each of the spherical particles includes'}3. The resin powder of claim 1 , wherein 'a core including the at least one magnetic particle and the resin component covering the core.', 'each of the spherical particles includes'}4. The resin powder of claim 1 , whereinin volume particle size distribution, a mean particle size of the resin powder is larger than or equal to 10 μm and smaller than or equal to 200 μm.5. The resin powder of claim 1 , whereinin the volume particle size distribution, a ratio of the spherical particles whose particle size is larger than or equal to 50 μm and smaller than or equal to 100 μm to the resin powder is greater than or equal to 70 wt. %.6. The resin powder of claim 1 , whereinthe volume particle size distribution has one frequency peak.7. The resin powder of claim 1 , whereinan average circularity of the aggregates is greater than or equal to 0.90 and less than or equal to 1.00.8. The resin powder of claim 1 , whereinthe resin component is in an uncured state.9. The resin powder of claim 1 , whereinthe resin powder further contains nanofiller.10. The resin powder of claim 9 , whereina content of the nanofiller is greater than or equal to 0.1 wt. % and less than or equal to 2 wt. % with ...

PREPREG AND MOLDED ARTICLE

Provided is a prepreg containing a urethane-modified epoxy (meth)acrylate (A) that is a reaction product of an epoxy (meth)acrylate (a1) having an average of 1.8 to 2.6 hydroxy groups and a polyisocyanate (a2) having an average of 2 to 3 isocyanate groups, an ethylenically unsaturated monomer (B), a polymerization initiator (C), and reinforcing fibers (D) as essential components, in which the molar ratio (NCO/OH) of isocyanate groups (NCO) in the polyisocyanate (a2) to hydroxy groups in the epoxy (meth)acrylate (a1) is 0.6 to 1.1, and the proportion of the ethylenically unsaturated monomer (B) in the total mass of the epoxy (meth)acrylate (a1) and the ethylenically unsaturated monomer (B) is 10% to 50% by mass. The prepreg has good workability and good moldability and can be appropriately used for various molded articles such as automotive members because various excellent physical properties such as interlaminar shear strength and heat resistance are provided. 1. A prepreg comprising a urethane-modified epoxy (meth)acrylate (A) that is a reaction product of an epoxy (meth)acrylate (a1) having an average of 1.8 to 2.6 hydroxy groups per molecule and a polyisocyanate (a2) having an average of 2 to 3 isocyanate groups per molecule , an ethylenically unsaturated monomer (B) , a polymerization initiator (C) , and reinforcing fibers (D) as essential components , wherein the molar ratio (NCO/OH) of isocyanate groups (NCO) in the polyisocyanate (a2) to hydroxy groups in the epoxy (meth)acrylate (a1) is 0.6 to 1.1 , and the proportion of the ethylenically unsaturated monomer (B) in a total mass of the epoxy (meth)acrylate (a1) and the ethylenically unsaturated monomer (B) is 10% to 50% by mass.2. The prepreg according to claim 1 , wherein the ethylenically unsaturated monomer (B) is a monofunctional (meth)acrylate having a molecular weight of 150 to 250.3. The prepreg according to claim 1 , wherein the ethylenically unsaturated monomer (B) is phenoxyethyl (meth)acrylate and ...

LIQUID CRYSTAL ALIGNING AGENT COMPOSITION, METHOD FOR PRODUCING LIQUID CRYSTAL ALIGNMENT FILM USING SAME, AND LIQUID CRYSTAL ALIGNMENT FILM USING SAME

The present invention provides a liquid crystal aligning agent composition that has excellent storage stability, can secure a high imidization rate, and can produce a liquid crystal alignment film having improved film strength together with liquid crystal alignment properties, a method for producing a liquid crystal alignment film using the same, and a liquid crystal alignment film and a liquid crystal display device using the same. 2. The liquid crystal aligning agent composition of claim 1 , wherein the functional group substituted in the primary or secondary amine is capable of being substituted with a hydrogen atom at a temperature of 90° C. or higher.3. The liquid crystal aligning agent composition of claim 1 , wherein the primary or secondary amine compound is included in an amount of 0.03 parts by weight to 30 parts by weight claim 1 , based on a total of 100 parts by weight of the first polymer for the liquid crystal aligning agent and the second polymer for the liquid crystal aligning agent.4. The liquid crystal aligning agent composition of claim 1 , wherein the primary amine or the secondary amine in the primary or secondary amine compounds each independently has a linear or cyclic structure.6. The liquid crystal aligning agent composition of claim 1 , wherein a weight ratio between the first polymer for a liquid crystal aligning agent and the second polymer for a liquid crystal aligning agent is 1:9 to 9:1.7. The liquid crystal aligning agent composition of claim 1 , wherein the molecular weight of the compound having two or more epoxy groups in a molecule is 100 g/mol to 10 claim 1 ,000 g/mol.8. The liquid crystal aligning agent composition of claim 1 , wherein the compound having two or more epoxy groups in a molecule is a cycloaliphatic-based epoxy claim 1 , a bisphenol-based epoxy claim 1 , or a novolac-based epoxy.9. The liquid crystal aligning agent composition of claim 1 , wherein the compound having two or more epoxy groups in a molecule is ...

POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE FILM MANUFACTURED USING SAME

The present invention relates to a polyimide precursor composition, and a polyimide film manufactured using same. According to the present invention, since a polyimide film is manufactured from a mixture of a polyimide precursor having a structure that is advantageous to surface charge accumulation and a polyimide precursor having a structure capable of exhibiting high heat-resistant characteristics, a flexible device using the polyimide film as a substrate can have both improved charge accumulation characteristics caused by an electric field to be generated during the operation of a TFT device and heat high heat-resistant characteristics. 2. The polyimide precursor composition according to claim 1 , wherein the reactive functional group of the end capper in the formula 1 is at least one reactive structure selected from a maleic-based reactive structure claim 1 , a cyclobutene-based reactive structure claim 1 , an acetylene-based reactive structure claim 1 , a nadic-based reactive structure claim 1 , an epoxy-based reactive structure or a phenylethynyl-based reactive structure.4. The polyimide precursor composition according to claim 1 , wherein the first polyamic acid and the second polyamic acid are contained in a molar ratio of 20:80 to 80:20.5. The polyimide precursor composition according to claim 1 , wherein each of the first polyamic acid and the second polyamic acid comprises a reaction product of para-phenylenediamine and 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-biphenylcarboxylic dianhydride claim 1 , and the reaction product is obtained by reacting para-phenylenediamine in excess of the equivalent ratio relative to 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-biphenylcarboxylic dianhydride.6. The polyimide precursor composition according to claim 5 , wherein the first polyamic acid is a reaction product from reacting para-phenylenediamine with 3 claim 5 ,3′ claim 5 ,4 claim 5 ,4′-biphenylcarboxylic dianhydride in the presence of 1 to 10 moles of reactive end capper ...

PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM COMPRISING THE SAME

The present invention relates to a photosensitive resin composition including a poly(imide-benzoxazine) block copolymer, and a cured film. The poly(imide-benzoxazine) block copolymer included in the photosensitive resin composition enables the formation of a cured film having excellent mechanical and insulation even at a low temperature of less than 200° C. 6. The photosensitive resin composition according to claim 1 , wherein in the poly(imide-benzoxazine) block copolymer claim 1 , the weight ratio of the repeat unit having a polymerization degree m and the repeat unit having a polymerization degree n is 1:0.01 to 1:100.7. The photosensitive resin composition according to claim 1 , wherein the poly(imide-benzoxazine) block copolymer has a weight average molecular weight of 5000 to 100 claim 1 ,000 g/mol.8. The photosensitive resin composition according to claim 1 , wherein the photocurable multifunctional acrylic compound includes one or more acrylic compounds selected from the group consisting of an acrylate-based compound claim 1 , a polyester acrylate-based compound claim 1 , a polyurethane acrylate-based compound claim 1 , an epoxy acrylate-based compound claim 1 , and a caprolactone modified acrylate-based compound.9. The photosensitive resin composition according to claim 1 , wherein the composition comprises 1 to 50 parts by weight of the photocurable multifunctional acrylic compounds claim 1 , based on 100 parts by weight of the poly(imide-benzoxazine) block copolymer.10. A cured film formed by curing the photosensitive resin composition according to .11. The cured film of claim 10 , wherein the curing is performed at a temperature of from 160 to 220° C. This application is a 35 U.S.C. § 371 National Phase Entry Application from PCT/KR2018/008367, filed on Jul. 24, 2018, and designating the United States, which claims the benefit of Korean Patent Application No. 10-2017-0118859 filed on Sep. 15, 2017 and Korean Patent Application No. 10-2018-0085443 filed ...

HALOGEN-FREE FLAME RETARDANT TYPE RESIN COMPOSITION

The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition. 1. A halogen-free flame-retardant resin composition , based on the weight parts of organic solids , comprising (A) from 1 to 10 parts by weight of bismaleimide resin , (B) from 30 to 60 parts by weight of benzoxazine resin , (C) from 10 to 40 parts by weight of polyepoxy compound , (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant , and (E) from 1 to 25 parts by weight of curing agent , which is amine curing agent and/or phenolic resin curing agent.3. The composition according to claim 1 , characterized in that the benzoxazine resin is any one selected from the group consisting of bisphenol-A benzoxazine resin claim 1 , bisphenol-F benzoxazine resin claim 1 , phenolphthalein benzoxazine resin and MDA benzoxazine resin claim 1 , or a combination of at least two selected therefrom.4. The composition according to claim 1 , characterized in that the polyepoxy compound is any one selected from the group consisting of bisphenol-A epoxy resin claim 1 , bisphenol-F epoxy resin claim 1 , phenol novolac epoxy resin claim 1 , o-cresol formaldehyde epoxy resin claim 1 , bisphenol-A novolac epoxy resin claim 1 , epoxy resin having biphenyl structure claim 1 , epoxy resin having aralkyl structure claim 1 , dicyclopentadiene epoxy resin claim 1 , halogen-free epoxy resin having oxazolidinone ring or epoxidised polybutadiene claim 1 , or ...

BONDING A GLASS-RESIN COMPOSITE MONOFILAMENT TO A THERMOPLASTIC MATRIX

Use of a benzoxazine resin () for the bonding of a monofilament () made of glass-resin composite including glass filaments () embedded in a thermosetting polyester resin (), to a thermoplastic material (), notably polyester; process for adhering such a monofilament to the thermoplastic material (), including at least the following steps: —impregnating the monofilament () with a benzoxazine resin () in the liquid state; —after impregnation, heat-treating the monofilament () thus impregnated, so as to at least partly polymerize the benzoxazine resin (); —depositing, onto the monofilament () thus adhesively coated, the thermoplastic material () in the molten state; —after cooling, optionally heat-treating the monofilament thus coated (R-1, R-2) to totally polymerize the benzoxazine resin () on contact with the thermoplastic material (). 115.-. (canceled)16. A method of bonding a monofilament made of glass-resin composite including glass filaments embedded in a thermoset polyester resin to a thermoplastic material , the method comprising the step of:using a benzoxazine resin.17. The method according to claim 16 , wherein the benzoxazine resin includes a benzoxazine monomer.19. The method according to claim 17 , wherein the benzoxazine monomer is a bis-benzoxazine.24. The method according to claim 16 , wherein the thermoset polyester resin is a vinyl ester resin.25. The method according to claim 16 , wherein the thermoplastic material is a polyester.26. The method according to claim 25 , wherein the polyester is selected from the group consisting of PET (polyethylene terephthalate) claim 25 , PEN (polyethylene naphthalate) claim 25 , PBT (polybutylene terephthalate) claim 25 , PBN (polybutylene naphthalate) claim 25 , PPT (polypropylene terephthalate) claim 25 , PPN (polypropylene naphthalate) and mixtures thereof.27. A process for adhering a monofilament claim 25 , made of glass-resin composite including glass filaments embedded in a thermosetting polyester resin claim ...