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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 3864. Отображено 100.
26-01-2012 дата публикации

Golf ball

Номер: US20120021852A1
Автор: Kazuhiko Isogawa
Принадлежит: SRI Sports Ltd

A golf ball 2 includes a spherical core 4 , an adhesive layer 6 covering the core 4 , and a cover 8 covering the adhesive layer 6 . The core 4 includes a spherical center 10 and a mid layer 12 covering the center 10 . The adhesive layer 6 is formed from an adhesive. The base polymer of the adhesive is a two-component curing type epoxy resin obtained by curing a bisphenol A type epoxy resin with a curing agent including a polyamine compound. The gel fraction of the adhesive is equal to or greater than 40% but equal to or less than 80%. The ratio of the epoxy equivalent to the amine active hydrogen equivalent in the adhesive is equal to or greater than 2.0/1.0 but equal to or less than 13.0/1.0. The amine active hydrogen equivalent of the curing agent is equal to or greater than 100 g/eq but equal to or less than 800 g/eq. In the adhesive, the proportion of water to the entire volatile component is equal to or greater than 90% by weight.

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Номер записи: 1
08-03-2012 дата публикации

Stable Solution of the Polymer Prepared from N,O-Heterocycles and its Preparation Method and Use

Номер: US20120059096A1
Автор: Chih-Wei Liao, Hsien-Te Chen, Hsuan-Hao HSU, Shih-Hao Liao, Tsung-Hsien Lin
Принадлежит: Taiwan Union Technology Corp

A stable solution of the polymer prepared from N,O-heterocyclic compound and its preparing method are provided, wherein the stable solution is prepared by making the N,O-heterocyclic compound of formulae I or II carry out a ring-opening polymerization: wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification. The stable solution can be used as a hardener for curing epoxy resin.

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Номер записи: 2
22-11-2012 дата публикации

Polymide resin composition, adhesive agent and laminate each comprising same, and device

Номер: US20120295085A1
Автор: Kenji Iida, Kiyomi Imagawa, Yusuke Tomita
Принадлежит: Mitsui Chemicals Inc

Provided are a polyimide resin composition containing a polyimide obtained by the condensation of: a diamine component containing an aromatic diamine (A) represented by the general formula (1-1) or the like, a silicone diamine (B) represented by the general formula (2) and an aliphatic diamine (C) represented by the general formula (3); and an acid anhydride component containing a specific aromatic tetracarboxylic dianhydride (D); and a laminate and a device using the polyimide resin composition.

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Номер записи: 3
18-04-2013 дата публикации

PHOTOSENSITIVE POLYMIDES

Номер: US20130095426A1
Автор: CHOU Meng-Yen, LEE Chuan-Zong
Принадлежит: ETERNAL CHEMICAL CO., LTD.

The invention pertains to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board. 12. A photosensitive composition claim 1 , which comprises claim 1 , based on the total weight of the composition claim 1 , at least 1% by weight of the photosensitive polyimide according to and at least one photoinitiator.13. The photosensitive composition according to claim 12 , further comprising a reactive monomer or oligomer.14. The photosensitive composition according to or claim 12 , which is a liquid photo resist composition or a solid dry film photo resist composition. The invention relates to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board.Electronic products recently have more and more miniaturized and lighter in weight. In accordance with this, various electronic parts are required to be downsized. Based on the ground that flexible printed wiring boards have the advantage of flexibility and light weight, their demand greatly increases.With respect to the materials used, coverlay films can be divided into the following three types: photosensitive coverlay film (first type), non-photosensitive coverlay film (second type) and thermal plastic coverlay film (third type). The photosensitive coverlay film (first type) also can be divided into polyimide based coverlay film (PT based coverlay film) and non-polyimide based coverlay film (non-PI based coverlay film). Since the non-PI based coverlay film has poor heat resistance, higher ...

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Номер записи: 4
02-05-2013 дата публикации

RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME

Номер: US20130109798A1
Автор: OKUBO Hikaru, TANAKA Nobuki, WATANABE Itaru
Принадлежит: SUMITOMO BAKELITE CO., LTD.

A resin composition which is excellent in quick curing and can be used for curing in conventionally used ovens, and a semiconductor device which is excellent in reliability such as solder crack resistance or the like when the resin composition is used as a die attach material for semiconductor. Further preferably, a resin composition which has a sufficient low stress property, good adhesion and excellent bleeding property. 141-. (canceled)43. A semiconductor device according to claim 42 , wherein Rin the structure represented by formula (8) of the allyl ester compound (G) does not contain an aromatic group.46. A semiconductor device according to claim 45 , wherein Rin the structure represented by formula (8) of the allyl ester compound (G) does not contain an aromatic group. The present invention relates to a resin composition and a semiconductor device using the same.Aiming at improvement on productivity in a die-bonding process, in the production of semiconductors, the in-line curing method in which a die bonder, a wire bonder and the like are arranged on the same line is employed and it is tending to be more widely used from now on. Hence, in comparison with a curing condition of a die attach paste in the conventionally employed batch method, time required for curing is significantly limited. For example, with respect to the conventional oven curing method wherein curing is performed at 150 to 200° C. for 60 to 90 minutes, curing is required in a short time such as at 150 to 200° C. for 15 to 90 seconds in the case of the in-line curing method (for example, see Japanese Patent Application Laid-Open (JP-A) No. 2000-63452).With the enhancement of the processing speed of semiconductor devices, a chip surface layer which is weak in mechanical strength is growing popular. In order to decrease stress against the chip surface, it is required to minimize warpage of a semiconductor chip due to the difference in thermal expansion coefficient between the semiconductor chip ...

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Номер записи: 5
09-05-2013 дата публикации

Liquid crystal display and method of manufacturing the same

Номер: US20130114030A1
Автор: Dong Gi Seong, Jin-Lak KIM, Jinhyeong LEE, Joon-Hyung Park, Kangsub JUNG, Keunchan Oh, Kyungseon TAK
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A liquid crystal display includes a first substrate, a second substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The first substrate includes a first base substrate, a pixel electrode disposed on the first base substrate and including a plurality of branch portions, and a first alignment layer disposed on the pixel electrode. The second substrate includes a second base substrate, a common electrode disposed on the second base substrate, and a second alignment layer disposed on the common electrode.

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Номер записи: 6
23-05-2013 дата публикации

Tackifiers For Composite Articles

Номер: US20130131231A1
Автор: Bouguettaya Mohamed, Foley Nicholas
Принадлежит: BASF SE

A composite article comprises a plurality of lignocellulosic pieces and an adhesive system disposed on the plurality of lignocellulosic pieces for bonding the plurality of lignocellulosic pieces. The adhesive system comprises a binder component and a tackifier component. The tackifier component comprises a cationic polymer. The tackifier component is useful for maintaining orientation of the plurality of lignocellulosic pieces during manufacture of the composite article. The composite article may be various engineered lignocellulosic composites, such as particleboard. 1. A composite article comprising:a plurality of lignocellulosic pieces; andan adhesive system disposed on said plurality of lignocellulosic pieces for bonding said plurality of lignocellulosic pieces; a binder component, and', 'a tackifier component comprising a cationic polymer for maintaining orientation of said plurality of lignocellulosic pieces during manufacture of said composite article., 'wherein said adhesive system comprises'}2. A composite article as set forth in wherein said polymer is a polyethylenimine.3. A composite article as set forth in wherein said polymer is a polyvinylamine.4. A composite article as set forth in wherein said polymer is a polyvinylformamide.5. A composite article as set forth in wherein said adhesive system is formed from said binder and said tackifier components.6. A composite article as set forth in wherein said polymer has a glass transition temperature (Tg) of from about +50° C. to about +200° C.7. A composite article as set forth in wherein said polymer has a weight average molecular weight (Mw) of from about 500 to about 3 claim 1 ,500 claim 1 ,000.8. A composite article as set forth in wherein said binder component comprises an isocyanate component claim 1 , a formaldehyde resin claim 1 , a protein-based adhesive claim 1 , or a combination thereof.9. A composite article as set forth in wherein said binder component comprises said isocyanate component claim 8 ...

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Номер записи: 7
30-05-2013 дата публикации

POLYIMIDE FIBER WITH HIGH STRENGTH AND HIGH MODULUS AND ITS PREPARATION METHOD

Номер: US20130137846A1
Автор: HAN ENLIN, NIU HONGQING, QI SHENGLI, TIAN GUOFENG, Wang Xiaodong, WU DEZHEN, WU ZHANPENG, YAN XIAONA
Принадлежит: Beijing University of Chemical Technology

A high-strength high-modulus polyimide fiber and its preparation method pertain to the technical field of high-performance organic fiber. This fiber includes the polyimide (PI) fiber made from 3,3′,4,4′-biphenyl tetracarboxylic diandhydride (BPDA), p-phenylenediamine (pPDA) and 2-(4-aminophenyl)-1H-benzimidazol-5-amine (BIA), wherein the molar ratio between PPDA and BIA is 1:10˜3:1. During the synthesis, other diamine and diandhydride monomers may also be added. In the preparation process, the gradient temperature reaction method and one-step continuous preparation method are adopted, the synthesis and processing difficulty caused by the increase of the content of BIA is overcome, the problem of poor uniformity and stability of fiber is solved and PI fiber with high strength and high modulus is obtained. Its strength may reach 4.5 GPa and modulus may reach 201 GPa. Moreover, the sources of the raw materials are extensive, the spinning process is continuous, the cost is low, the efficiency is high and industrial production may be realized. 144. A high-strength high-modulus polyimide fiber , comprising polyimide fiber obtained from random copolymerization of 3 , 3′ , , ′-benzophenone tetracarboxylic dianhydride (BPDA) , p-phenylenediamine (pPDA) and 2-(4-aminophenyl)-1H-benzimidazol-5-amine (BIA) , wherein molar ratio between pPDA and BIA is 1:10˜3:1.2. The high-strength high-modulus polyimide fiber according to claim 1 , wherein the polyimide fiber comprises copolymerization of BPDA claim 1 , pPDA and BIA with other diamine or/and dianhydride claim 1 , wherein molar ratio between said other diamine and the total addition amount of pPDA and BIA is 1:10˜1:4 claim 1 , molar ratio between said other dianhydride and BPDA is 1:10˜3:7.3. A method for preparing the high-strength high-modulus polyimide fiber according to claim 1 , comprising the following steps:A: providing pPDA, BIA and BPDA at a molar ratio of 1:0.95˜1:1.05 between pPDA and BPDA And at a molar ratio of 1:10 ...

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Номер записи: 8
13-06-2013 дата публикации

HOLE TRANSPORT COMPOSITION

Номер: US20130150536A1
Автор: CHESTERFIELD REID JOHN
Принадлежит: E I DU PONT DE NEMOURS AND COMPANY

There is provided a hole transport composition having (i) a first hole transport polymer having crosslinkable groups, and (ii) a second hole transport polymer having substantially no crosslinkable groups. There is also provided a crosslinked hole transport layer and an electronic device containing the crosslinked hole transport layer. 1. A hole transport composition comprising (i) a first hole transport polymer having crosslinkable groups , and (ii) a second hole transport polymer having substantially no crosslinkable groups2. The hole transport composition of claim 1 , wherein the first hole transport polymer has a narrower band gap than the second hole transport polymer.3. The hole transport composition of claim 1 , wherein the first hole transport polymer is a copolymer of a triarylamine derivative and a fluorene derivative and the second hole transport polymer is a triarylamine polymer.45.-. (canceled)911.-. (canceled) This application claims priority tinder 35 §119(e) from U.S. Provisional Application No. 61/053,679 filed May 16, 2008 which is incorporated by reference in its entirety.1. Field of the DisclosureThis disclosure relates in general to hole transport compositions having more than one component. Such layers are useful in electronic devices.2. Description of the Related ArtIn organic photoactive electronic devices, such as organic light emitting diodes (“OLED”), that make up OLED displays, the organic active layer is sandwiched between two electrical contact layers. In an OLED the organic photoactive layer emits light through the light-transmitting electrical contact layer upon application of a voltage across the electrical contact layers.It is well known to use organic electroluminescent compounds as the active component in light-emitting diodes. Simple organic molecules, conjugated polymers, and organometallic complexes have been used. Devices that use photoactive materials frequently include one or more charge transport layers, which are positioned ...

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Номер записи: 9
04-07-2013 дата публикации

POLYIMIDE RESINS FOR HIGH TEMPERATURE APPLICATIONS

Номер: US20130171396A1
Автор: Burch Robert Ray, Moralez Jesus G
Принадлежит: E.I. Du Pont De Nemours and Company

Polyimide resin compositions that contain an aromatic polyimide, graphite, and acicular titanium dioxide are found to exhibit high thermal oxidative stability. Such compositions are especially useful in molded articles that are exposed to high temperatures, such as bushings, bearings, and seal rings that are used in aerospace, transportation, and materials handling applications. 2. The composition according to wherein component (a) is present in an amount between about 40 and 54 weight parts; component (b) is present in an amount between about 0.5 and about 10 weight parts; and component (c) is present in an amount between about 46 and about 60 weight parts.3. A composition comprising in admixture(a) an aromatic polyimide in an amount between about 35 and about 90 weight parts;(b) acicular titanium dioxide particles in an amount between about 0.5 and about 4.8 weight parts, wherein the average particle diameter is between about 10 and about 500 nm and the average particle length is between about 1 and about 100 μm, provided that the particle aspect ratio is at least 3; and(c) graphite in an amount between about 0 and about 60 weight parts;wherein all weight parts combined together total to 100 weight parts.7. The article according to wherein greater than 60 to about 85 mol % of the Rgroups comprise p-phenylene radicals claim 6 , and about 15 to less than 40 mol % comprise m-phenylene radicals.8. The article according to further comprising as a component (d) one or more additives in an amount in the range of about 5 to about 70 wt % based on the weight of the total (a)+(b)+(c)+(d) composition.9. The article according to which is in the form of a rod claim 4 , a rube claim 4 , a plaque claim 4 , a ring claim 4 , a disc claim 4 , or a bar.10. The article according to which comprises a bushing claim 4 , bearing claim 4 , washer claim 4 , seal ring claim 4 , wear pad claim 4 , wear strip claim 4 , spline claim 4 , gasket claim 4 , slide block claim 4 , or valve component ...

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Номер записи: 10
25-07-2013 дата публикации

MELAMINE EPOXY RESIN MONOMER AND RESIN COMPOSITION

Номер: US20130190424A1
Автор: HIGASHI Hideo, Takamatsu Hiroaki, YAMAMOTO Kyoko
Принадлежит: NIPPON CARBIDE INDUSTRIES CO., INC.

A melamine epoxy resin monomer including: a glycidyl group; and a structural unit having a melamine residue and being represented by the following Formula (I) is disclosed. In Formula (I), each of Rto Rindependently represents a hydrogen atom, a group represented by ROCH—, or a group derived from a melamine derivative and represented by the following Formula (II). Rrepresents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a glycidyl group. In Formula (II), each of Rto Rindependently represents a hydrogen atom, a group represented by ROCH—, or a group derived from a melamine derivative and represented by Formula (II). Rrepresents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a glycidyl group. 3. The melamine epoxy resin monomer according to claim 1 , wherein the number of the contained glycidyl groups is 2 or more.4. The melamine epoxy resin monomer according to claim 1 , wherein the number of the contained melamine residues is 8 or less.5. A resin composition comprising: the melamine epoxy resin monomer according to ; and an inorganic filler.6. The resin composition according to claim 5 , further comprising a curing agent.7. A composition for light reflection claim 5 , which is a cured product of the resin composition according to .8. The melamine epoxy resin monomer according to claim 2 , wherein the number of the contained glycidyl groups is 2 or more.9. The melamine epoxy resin monomer according to claim 2 , wherein the number of the contained melamine residues is 8 or less.10. A resin composition comprising: the melamine epoxy resin monomer according to ; and an inorganic filler.11. The resin composition according to claim 10 , further comprising a curing agent.12. A composition for light reflection claim 11 , which is a cured product of the resin composition according to .13. The melamine epoxy resin monomer according to claim 1 , wherein:the number of the contained glycidyl groups is 2 or more; andthe number of the contained ...

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Номер записи: 11
01-08-2013 дата публикации

MATTE FINISH POLYIMIDE FILMS AND METHODS RELATING THERETO

Номер: US20130196134A1
Автор: BARTOLIN JEFFREY MICHAEL, Carney Thomas Edward, Dunbar Meredith L., Herrmann Scott John
Принадлежит: E I DU PONT DE NEMOURS AND COMPANY

The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 71 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 9 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer. 1. A base film comprising: i. at least 50 mole percent of an aromatic dianhydride, based upon a total dianhydride content of the polyimide, and', 'ii. at least 50 mole percent of an aromatic diamine based upon a total diamine content of the polyimide;, 'A. a chemically converted polyimide in an amount from 40 to 90 weight percent of the base film, the chemically converted polyimide being derived from 'wherein the thickness of the base film is from 8 to 152 microns.', 'B. a filler, excluding low conductivity carbon black and pigments, in an amount from 10 to 60 wt % of the base film; and'}2. The base film in accordance with wherein the chemically converted polyimide is made by the step of mixing a polyamic acid solution with a catalyst or dehydrating agent capable of converting a polyamic acid to a polyimide.3. The base film in accordance with wherein: pyromellitic dianhydride,', '3,3′,4,4′-biphenyl tetracarboxylic dianhydride,', '3,3′,4,4′-benzophenone tetracarboxylic dianhydride;', '4,4′-oxydiphthalic anhydride,', '3,3′,4,4′-diphenyl sulfone tetracarboxylic dianhydride,', '2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane,', 'Bisphenol A dianhydride, and', ' ...

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Номер записи: 12
08-08-2013 дата публикации

USE OF MOLECULES CARRYING ASSOCIATIVE GROUPS AS PLASTICISERS

Номер: US20130203944A1
Автор: Couturier Jean-Luc, DUFAURE Nicolas, Hidalgo Manuel
Принадлежит: Arkema France

The invention relates to the field of plasticisers, compounds used as additives in polymers for facilitating the transformation thereof or modifying the mechanical properties thereof especially rigidity. 111-. (canceled)12. A method of plasticizing a plastic , comprising:adding a plasticizer to the plastic, wherein the plasticizer comprises a molecule with an average molecular mass of greater than 500 g/mol, wherein the molecule comprises at least one associative group comprising a nitrogenous heterocycle.13. The method of claim 12 , wherein the molecule comprising at least one associative group is a supramolecular polymer obtained by reacting at least one compound A with at least one compound B;wherein compound A comprises at least a first functional group and a second functional group;wherein compound B comprises at least one reactive group that is capable of reacting with the first functional group of compound A, and optionally, capable of reacting with the second functional group of compound A; andwherein compound B further comprises at least one associative group.14. The method of claim 13 , wherein the supramolecular polymer obtained by the reaction of compound A with compound B is further reacted with at least one compound C;wherein compound C comprises at least a first functional group and a second functional group;wherein the first functional group and second functional group of compound C are capable of reacting with the second functional group of compound A to form ester, thioester, or amide bridges, when the second functional group of compound A has not reacted with compound B.15. The method of claim 13 , wherein the supramolecular polymer is capable of reacting with urea.16. The method of claim 13 , wherein compound A is a mixture of fatty acid trimer and a linear or branched alkyldicarboxylic acid.17. The method of claim 16 , wherein the linear or branched alkyldicarboxylic acid is chosen from glutaric acid claim 16 , adipic acid claim 16 , pimelic ...

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Номер записи: 13
15-08-2013 дата публикации

ANTICORROSION COATINGS

Номер: US20130209812A1
Автор: Gorodisher Ilya, Grootaert Werner M., Perez Mario A.
Принадлежит: 3M INNOVATIVE PROPERTIES COMPANY

Curable compositions comprising a benzoxazine component, a polyamine component and an ortho-dihydroxyaryl component are described. The compositions may be cured to produce compositions useful in coating, sealants, adhesive and many other applications. 1. A curable composition comprising:e) a polybenzoxazine,f) a polyamineg) an ortho-dihydroxyaryl component, andh) an optional acid catalyst.2. The curable composition of wherein the polybenxoxazine is derived from an aromatic amine.4. The polybenzoxazine of where Ris an aryl group and m is 1.6. The curable composition of claim 1 , wherein said amine is of the formula:{'br': None, 'sup': 10', '9, 'sub': 'p', 'R(NHR), wherein'}{'sup': '10', 'Ris (hetero)hydrocarbyl group;'}{'sup': '9', 'p is 1 to 6, and each Ris H or a hydrocarbyl group.'}7. The curable composition of claim 1 , wherein the molar ratio of amine equivalents of the polyamine compound to the benzoxazine groups is from 1:2 to 2:1.8. The curable composition of wherein the ortho-dihydroxy aryl component is present between 0.5% and 20% by wt of the total composition.9. The curable composition of claim 1 , further comprising a superacid catalyst.10. The curable composition of further comprising an epoxy resin.11. The curable composition of wherein the epoxy resin is present in amounts of 5 to 25% molar equivalents of epoxy functional groups relative to moles of benzoxazine functional groups.12. The curable composition of further comprising a toughening agent.13. The curable composition of further comprising a particulate filler.14. The curable composition of wherein the polyamine is an amidine compound having at least two amine equivalents.16. The curable composition of wherein the polyamine is a guanidine compound having at least two amine equivalents.18. The curable composition of wherein the ortho-dihydroxy aryl component is present between 0.5% and 20% by weight of the total composition19. An article comprising a metallic substrate and the cured coating of on ...

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Номер записи: 14
19-09-2013 дата публикации

ADHESIVE COMPOSITION, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING THE ADHESIVE COMPOSITION OR THE ADHESIVE SHEET

Номер: US20130245160A1
Автор: Nonaka Toshihisa, Shimada Akira, Shinba Yoichi
Принадлежит: Toray Industries, Inc.

The purpose of the present invention is to provide an adhesive composition, which has high thermal conductivity and excellent adhesion, and wherein dispersibility of a thermally conductive filler is controlled. The adhesive composition is configured to contain (A) a soluble polyimide, (B) an epoxy resin and (C) a thermally conductive filler. The adhesive composition is characterized in that the soluble polyimide (A) contains a structure represented by general formula (1) as a component derived from a diamine and the amount of the thermally conductive filler (C) contained in the adhesive composition is not less than 60% by volume. (In general formula (1), X represents an integer of 1-10 (inclusive) and n represents an integer of 1-20 (inclusive).) 2. The adhesive composition according to claim 1 , wherein the thermally conductive filler (C) includes two or more fillers differing in the average particle diameter and at least one filler has an average particle diameter of 6 μm or more.3. The adhesive composition according to claim 1 , wherein the thermally conductive filler (C) includes two or more fillers differing in the average particle diameter and contains at least a filler with an average particle diameter of 6 μm or more and 15 μm or less and a filler with an average particle diameter of 30 μm or more.4. The adhesive composition according to claim 1 , wherein the thermally conductive filler (C) includes a filler that the pH of the liquid prepared when 10 g of the thermally conductive filler is added to 100 g of water is not more than 6.0.5. The adhesive composition according to claim 1 , wherein the thermally conductive filler (C) includes alumina.8. The adhesive sheet according to claim 7 , wherein the thermally conductive filler (C) includes two or more fillers differing in the average particle diameter and at least one filler has an average particle diameter of 6 μm or more.9. The adhesive sheet according to claim 7 , wherein the thermally conductive filler ( ...

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Номер записи: 15
10-10-2013 дата публикации

Benzoxazines and Compositions Containing the Same

Номер: US20130267659A1
Автор: Harriman Mark, Ward Steven
Принадлежит: CYTEC TECHNOLOGY CORP.

Disclosed herein are monofunctional benzoxazine compounds having at least one electron-withdrawing group. The monofunctional benzoxazine compounds may be combined with one or more multifunctional benzoxazine compounds to form a unique benzoxazine blend. This benzoxazine blend may be combined with additional components such as catalysts and toughening agents to form a curable resin composition suitable for forming resinous films or composite materials. The presence of monofunctional benzoxazine improves the processability of the benzoxazine-based resin composition by reducing the viscosity of the resin composition, and results in improved tack and drape in the films and composite materials formed from the composition without the loss of modulus in the cured resin. 2. The benzoxazine blend of claim 1 , wherein claim 1 , with reference to Formula I and R claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , said alkyl is Calkyl claim 1 , said cycloalkyl is Ccycloalkyl claim 1 , and said cycloalkyl and aryl groups are optionally substituted by Calkyl claim 1 , halogen or amine groups.3. The benzoxazine blend of claim 1 , wherein claim 1 , with reference to Formula I and X claim 1 , X claim 1 , X claim 1 , X claim 1 , said alkyl is Calkyl claim 1 , said cycloalkyl is Ccycloalkyl claim 1 , and wherein the cycloalkyl and aryl groups are optionally substituted by Calkyl claim 1 , halogen or amine groups.6. The benzoxazine blend of claim 5 , wherein X is F or Cl claim 5 , and Y is OCH.7. The benzoxazine blend of claim 1 , wherein the weight ratio of multifunctional benzoxazine to substituted monofunctional benzoxazine is within the range of 99.9:0.1 to 50:50.8. The benzoxazine blend of claim 1 , wherein the multifunctional benzoxazine compound is a di-functional benzoxazine.10. The benzoxazine blend of claim 9 , wherein Zis selected from —[C(R)(R)]-arylene-[C(R)(R)]— claim 9 , and the chain linking the two benzoxazine groups further comprises claim 9 , or is interrupted ...

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Номер записи: 16
17-10-2013 дата публикации

Halogen-Free High-Tg Resin Composition And Prepreg And Laminate Fabricated By Using The Same

Номер: US20130273796A1
Автор: He Yueshan, Su Shiguo
Принадлежит:

The present invention relate to a halogen-free high-Tg resin composition and a prepreg and a laminate fabricated by using the same. The composition comprises, based on parts by weight of organic solids: (A) 10-50 parts by weight of a cyanate ester resin; (B) at least one compound having a dihydrobenzoxazine ring; (C) 10-50 parts by weight of at least one bismaleimide resin; (D) 10-50 parts by weight of at least one polyepoxy compound; and (E) 5-30 parts by weight of at least one phosphorus-containing flame retardant. The halogen-free high-Tg resin composition has the performance of low water absorption, low CTE, high Tg, and good dielectric properties, and a prepreg and a laminate fabricated by using the same has the characteristics of a high glass transition temperature, a low CTE, a low dielectric constant, a low water absorption, and a high heat resistance, and thus being applicable to a multi-layer circuit board 1. A halogen-free high-Tg resin composition , comprising , based on parts by weight of organic solids , (A) 10-50 parts by weight of at least one cyanate and prepolymer of cyanate; (B) 10-50 parts by weight of at least one compound having a dihydrobenzoxazine ring; (C) 10-50 parts by weight of at least one bismaleimide resin; (D) 10-50 parts by weight of at least one polyepoxy compound; and (E) 5-30 parts by weight of at least one phosphorus-containing flame retardant.5. The halogen-free high-Tg resin composition according to claim 1 , wherein the polyepoxy compound comprises at least one compound selected from the group consisting of(1) bifunctional epoxy resin, comprising biphenol A-type epoxy resin, biphenol F-type epoxy resin, biphenyl-type epoxy resin;(2) novolac epoxy resin, comprising phenol-type novolac epoxy resin, biphenol A-type novolac epoxy resin, orthocresol novolac epoxy resin, dicyclopentadiene phenol-type epoxy resin;(3) phosphorus-containing epoxy resin, comprising 9,10-dihydro-9-ova-10-phosphaphenanthrene-10-oxide modified epoxy resin, ...

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Номер записи: 17
17-10-2013 дата публикации

TRANSPARENT POLYIMIDE FILM AND PREPARATION METHOD THEREOF

Номер: US20130274394A1
Автор: JU Chul Ha, JUNG Hak Gee, Park Hyo Jun
Принадлежит: KOLON INDUSTRIES, INC.

The present invention relates to a transparent polyimide film with improved tensile strength and a preparation method thereof, and more specifically to a colorless, transparent polyimide film having excellent optical properties and improved tear strength at the same time through the use of a monomer containing a functional group or an improver for improving tensile strength, and a preparation method thereof, wherein the functional group is selected from the group consisting of a hexafluoro group, a sulfone group, and an oxy group. 1. A method of preparing a transparent polyimide film , comprising the steps of:copolymerizing an aromatic dianhydride and an aromatic diamine to obtain polyamic acid; andcasting the polyamic acid on a support to imidize the polyamic acid,wherein the method further comprises the step of introducing an additive for improving tear strength before or after obtaining the polyamic acid, orthe step of introducing a monomer including a functional group selected from the group consisting of a hexafluro group, a sulfone group and an oxy group before obtaining the polyamic acid.2. The method of claim 1 , wherein the additive is at least one selected from among polyphenylsilsesquioxane claim 1 , tetramethoxy silane claim 1 , tetraethoxy silane claim 1 , tetrabutoxy silane claim 1 , 3-aminopropyl triethoxy silane claim 1 , and 3-aminopropyl trimethoxy silane.3. The method of claim 1 , wherein the additive is included in an amount of 0.001-20 parts by weight based on 100 parts by weight of the polyamic acid.4. A transparent polyimide film claim 1 , comprising:a unit structure derived from an aromatic dianhydride and an aromatic diamine,wherein the transparent polyimide film further comprises an additive for improving tear strength, ora unit structure derived from a monomer including a functional group selected from the group consisting of a hexafluro group, a sulfone group and an oxy group.5. The transparent polyimide film of claim 4 , wherein the ...

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Номер записи: 18
31-10-2013 дата публикации

Polyimide resin composition and laminate including polyimide resin composition

Номер: US20130288120A1
Автор: Kenji Iida, Kiyomi Imagawa, Shigeo Kiba, Yusuke Tomita
Принадлежит: Mitsui Chemicals Inc

To provide a resin composition that contains a solvent-soluble polyimide and can provide a film exhibiting high viscoelasticity and flexibility at high temperatures. To attain this, a polyimide resin composition is provided that includes a polyimide having a polycondensation unit of a tetracarboxylic acid dianhydride and a diamine, wherein the tetracarboxylic acid dianhydride includes an (α1) tetracarboxylic acid dianhydride represented by general formula (1), or the diamine includes an (β1) aromatic diamine represented by general formula (2), the diamine includes an (β2) aliphatic diamine represented by general formula (3) or (4), a total amour of the (α1) tetracarboxylic acid dianhydride and the (β1) aromatic diamine is 5 to 49 mol % with respect to a total amount of the tetracarboxylic acid dianhydride and the diamine, and an amine equivalent of the polyimide is 4,000 to 20,000.

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Номер записи: 19
31-10-2013 дата публикации

POLYAMIC ACID RESIN COMPOSITION AND METHOD OF PRODUCING THE SAME

Номер: US20130289202A1
Автор: Miyazaki Daichi, Miyoshi Kazuto, Tomikawa Masao
Принадлежит: Toray Industries, Inc.

The disclosed polyamic acid resin composition contains (a) a polyamic acid represented by general formula (1) or (2), and (b) a solvent. (A, A′, C, C′ are end-capped polyamic acid blocks comprising diaminobenzanilide and pyromellitic dianhydride or benzophenone tetracarboxylic dianhydride, and B, or D, is a polyamic acid block comprising a repeating unit other than A, A′, or C, C′. 4. The polyamic acid resin composition according to claim 1 , further comprising (c) inorganic particles. The present invention relates to a polyamic acid resin composition. More specifically, the present invention relates to a polyamic acid resin composition to be used suitably for, e.g., flexible substrates of a flat-panel display, electronic paper, a solar battery, and the like; a surface protective coat for a semiconductor device; a dielectric film among layers; an insulation layer or spacer layer of an organic electro-luminescence device (organic EL device); a planarization layer of a thin film transistor substrate; an insulation layer of an organic transistor; a flexible printed circuit board; and a binder for electrodes of a lithium ion secondary battery.Organic films are advantageous in that they are excellent in flexibility and less prone to rupture as compared with glass. Recently, there is an increasing move toward rendering displays more flexible by replacing the substrates of flat display panels from conventional glass to organic films.In the event that a display is produced on an organic film, a process is common in which the organic film is formed on a substrate and the organic film is peeled off from the substrate after the production of a device. An organic film can be formed on a substrate by the following methods. One example is a method in which an organic film is stuck on a glass substrate with an adhesive (e.g., Patent Document 1). Alternatively, another example is a method in which a substrate is coated with a solution containing a resin as a raw material of a film ...

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Номер записи: 20
14-11-2013 дата публикации

CHLORO-SUBSTITUTED POLYETHERIMIDES HAVING IMPROVED RELATIVE THERMAL INDEX

Номер: US20130303698A1
Автор: Chiong Hendrich, de Castro Miguel Angel Navarro, Guggenheim Thomas Link, Khouri Farid Fouad, Kuhlman Matthew L., Odle Roy Ray, Smith Brennan Alexander
Принадлежит: SABIC INNOVATIVE PLASTICS IP B.V.

A polyetherimide having an OH content that is greater than 0 and equal or less than 100 ppm; and a chlorine content that is greater than 0 ppm is disclosed herein. A method for preparing the polyetherimide is also disclosed. 1. A polymer comprising a polyetherimide having an OH content that is greater than 0 and less than or equal to 100 parts per million by weight (ppm) and a chlorine content that is greater than 0 ppm.3. The polyetherimide of claim 1 , wherein chlorine content is present in an amount greater than 0 to 4 claim 1 ,000 ppm.4. The polyetherimide of claim 1 , wherein the polyetherimide has a flame retardant rating of V0 at 1.5 mm.5. The polyetherimide of claim 3 , wherein the polyetherimide has a flame retardant rating of V0 at 0.8 mm.7. A composition comprising the polyetherimide of claim 6 , and an additional polymer.8. The composition of claim 6 , wherein the polymer is selected from the group consisting of polyesters claim 6 , polycarbonates claim 6 , polyolefins claim 6 , polysulfones claim 6 , polyphenylene sulfides claim 6 , polyetheretherketones claim 6 , polyethersulfones claim 6 , polyamides claim 6 , polyamideimides claim 6 , polyimides other than the polyetherimide of claim 6 , and combinations thereof.9. A composition comprising the polyetherimide of and an additional polymer.10. The composition of claim 1 , wherein the polymer is selected from the group consisting of polyesters claim 1 , polycarbonates claim 1 , polyolefins claim 1 , polysulfones claim 1 , polyphenylene sulfides claim 1 , polyetheretherketones claim 1 , polyethersulfones claim 1 , polyamides claim 1 , polyamideimides claim 1 , polyimides other than the polyetherimide of claim 1 , and combinations thereof.11. A method for preparing the polyetherimide of claim 1 , which comprises contacting claim 1 , in o-dichlorobenzene or anisole as diluent claim 1 , substantially equimolar amounts of a disodium salt of a dihydroxy compound of formula HO—R′—OH claim 1 , and a slurry of a ...

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Номер записи: 21
21-11-2013 дата публикации

THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF THE SAME, AND INTERLAMINAR ADHESIVE FILM USED FOR PRINTED WIRING BOARD

Номер: US20130309489A1
Автор: Hazama Masaki, Ichinose Eijyu, Mihara Takashi, Miyagaki Atsushi, Murakami Kouichi
Принадлежит: DIC CORPORATION

There is provided a thermosetting polyimide resin composition which enables production of a cured product exhibiting excellent dimensional stability and which exhibits excellent meltability; there are also provided a cured product of such a composition and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film being formed of the composition. In particular, there are provided a thermosetting polyimide resin composition containing a thermosetting polyimide resin (A) having a biphenyl backbone directly linked to a nitrogen atom of a five-membered cyclic imide backbone and a weight-average molecular weight (Mw) of 3,000 to 150,000, a phosphorus compound (B) represented by specific Formula (b1) or (b2), and an epoxy resin (C); a cured product of such a composition; and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film including a layer formed of the composition, the layer being formed on a carrier film. 2. (canceled)3. The thermosetting polyimide resin composition according to claim 1 , wherein the thermosetting polyimide resin (A) is a polyimide resin having a benzophenone structure.4. The thermosetting polyimide resin composition according claim 1 , wherein the thermosetting polyimide resin (A) is a polyimide resin having a tolylene structure.5. The thermosetting polyimide resin composition according to claim 1 , wherein the thermosetting polyimide resin (A) is a polyimide resin that is free from an alkylene structure.6. The thermosetting polyimide resin composition according to claim 1 , wherein the thermosetting polyimide resin (A) is a polyimide resin produced through a reaction of a polyisocyanate having a biphenyl backbone with an acid anhydride.7. The thermosetting polyimide resin composition according to claim 6 , wherein the polyisocyanate having a biphenyl backbone is tolidinediisocyanate or a polyisocyanate derived from tolidinediisocyanate.8. The thermosetting polyimide resin ...

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Номер записи: 22
21-11-2013 дата публикации

CARBOXYL GROUP-CONTAINING POLYIMIDE, THERMOSETTING RESIN COMPOSITION AND FLEXIBLE METAL-CLAD LAMINATE

Номер: US20130310486A1
Автор: KAWAKUSU Tetsuo
Принадлежит: TOYOBO CO., LTD.

The present invention aims to provide a carboxyl group-containing polyimide, and prepolymer thereof which give a cured product highly satisfying thermosetting property, PCT resistance, solvent resistance and peel strength at the same time. The present invention relates to a terminal acid anhydride group-containing imide prepolymer which is characterized by being produced by reacting an acid anhydride group in a tetracarboxylic acid dianhydride with an isocyanate group in a diisocyanate compound, and a carboxyl group-containing polyimide which is characterized in having such a structure where the chain of said terminal acid anhydride group-containing imide prepolymer is extended via a polyol compound. The present invention also relates to a thermosetting resin composition and a flexible metal-clad laminate which utilize such carboxyl group-containing polyimide. 119-. (canceled)20. A thermosetting resin composition to be used as a resist layer of a printed circuit board which is characterized in that it contains a carboxyl group-containing polyimide and an oxirane ring-containing compound , and in that said carboxyl group-containing polyimide has such a structure where the chain of a terminal acid anhydride group-containing imide prepolymer is extended via a polyol compound , wherein said terminal acid anhydride group-containing imide prepolymer has been produced by reacting an acid anhydride group in a tetracarboxylic acid dianhydride with an isocyanate group in a diisocyanate compound.21. The thermosetting resin composition according to claim 20 , wherein the using amount of an oxirane ring-containing compound is 2 to 100 parts by weight to 100 parts by weight of the carboxyl group-containing polyimide.22. The thermosetting resin composition according to claim 20 , wherein it further contains a phosphorus atom-containing organic filler.23. The thermosetting resin composition according to claim 22 , wherein the ratio by weight of the carboxyl group-containing ...

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Номер записи: 23
28-11-2013 дата публикации

FLEXIBLE BENZOXAZINE RESIN

Номер: US20130317155A1
Автор: Hunrath Christopher A., Tran Khang
Принадлежит: INTEGRAL TECHNOLOGY, INC.

One or more embodiments contained herein disclose an adhesive for printed circuit board (PCB) applications. The improved adhesive may comprise a benzoxazine resin and a polyester plasticizer. 1. A composition of matter comprising a thermoset resin and a polyester plasticizer.2. The composition of claim 1 , wherein the thermoset resin comprises benzoxazine resin.3. The composition of claim 1 , comprising about 5 wt % to about 25 wt % polyester plasticizer.4. The composition of claim 2 , comprising about 75 wt % to about 95 wt % benzoxazine resin.5. The composition of claim 1 , wherein the thermoset resin comprises an uncured benzoxazine resin claim 1 , the uncured benzoxazine resin being present in the composition in an amount in the range of about 75% by weight to about 95% by weight based on the total weight of the composition; and the polyester plasticizer being present in the composition in an amount in the range of about 5% by weight to about 25% by weight based on the total weight of the composition.6. The composition of claim 5 , wherein the composition further comprises a cured benzoxazine resin claim 5 , the cured benzoxazine resin being present in an amount in the range of about 5% by weight to about 25% by weight based on the total weight of the composition.7. The composition of claim 5 , wherein the uncured benzoxazine resin is present in an amount of about 85% or about 80% by weight based on the total weight of the composition.8. An adhesive film layer comprising about 75 wt % to about 95 wt % benzoxazine resin and about 5 wt % to about 25 wt % of polyester plasticizer.9. The adhesive film layer of claim 8 , comprising about 85 wt % benzoxazine resin and about 15 wt % polyester plasticizer.10. A layered film comprising an adhesive film layer claim 8 , wherein the adhesive film layer comprises about 75 wt % to about 95 wt % of an uncured benzoxazine resin and about 5 wt % to about 25 wt % of polyester plasticizer.11. A printed circuit board comprising a ...

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Номер записи: 24
05-12-2013 дата публикации

AQUEOUS AMINE-CARBOHYDRATE THERMOSETS HAVING REDUCED WEIGHT LOSS UPON CURE AND IMPROVED EARLY DRY STRENGTH

Номер: US20130323492A1
Автор: Finch William Christopher, Lee Haksu, RAND Charles J., RODOWSKI C. Damien, WEINSTEIN Barry
Принадлежит: Rohm and Haas Company

The present invention provides thermosetting aqueous binder compositions comprising one or more reducing sugar, one or more diprimary diamine or poly(primary amine), and from 7 to 45 wt. %, based on total solids, of one or more polysaccharide having a dextrose equivalent (DE) value of from 5 to 30. The compositions provide treated articles, such as fiberglass mat. The binders provide articles having a dramatically reduced binder weight loss upon cure and a reduction in cure energy needed to achieve early dry strength. 1. An aqueous thermosetting binder composition comprise i) one or more reducing sugar , ii) one or more diprimary diamine or poly(primary amine) , wherein the weight ratio of the total diprimary diamine or poly(primary amine) solids to total reducing sugar solids ranges from 1.2:1 to 0.12:1; iii) from 7 to 45 wt. % , based on total solids , of one or more polysaccharide having a dextrose equivalent (DE) value of from 5 to 30.2. The composition as claimed in claim 1 , wherein the reducing sugar is dextrose.3. The composition as claimed in claim 1 , wherein the diprimary diamine or poly(primary amine) is a diprimary diamine.4. The composition as claimed in claim 3 , wherein diprimary diamine is hexamethylene diamine (NMDA).5. The composition as claimed in claim 1 , wherein the one or more polysaccharide has a DE value of from 7 to 23.6. The compositions as claimed in claim 5 , wherein the one or more polysaccharide is a maltodextrin.7. The composition as claimed in claim 1 , wherein the one or more polysaccharide is present in the amount of from 10 to 30 wt. % based on total solids.8. The composition as claimed in claim 1 , further comprising one or more stabilizer.9. A method of using the aqueous thermosetting binder composition as claimed in comprising:applying the binder composition to or mixing it with a substrate and then heating the thus treated substrate or mixture to cure the binder at from 100 to 400° C.10. A treated fiber matt containing a ...

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Номер записи: 25
12-12-2013 дата публикации

Polyimide seamless belt and process for production thereof, and polyimide precursor solution composition

Номер: US20130327982A1
Автор: Akira Kawabata, Kensuke Hiroshige, Susumu Takasaki, Takeshige Nakayama, Tomonori Nakayama
Принадлежит: UBE Industries Ltd

A seamless belt formed of a polyimide including a repeating unit represented by the formula (1): in which 25 mol % to 95 mol % of A is a tetravalent unit represented by the formula (2): 75 mol % to 5 mol % of A is a tetravalent unit represented by the formula (3): 15 mol % to 95 mol % of B is a divalent unit represented by the formula (4): and 85 mol % to 5 mol % of B is a divalent unit represented by the formula (5):

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Номер записи: 26
12-12-2013 дата публикации

Hybrid Adhesive and the Use Thereof in Engineered Wood Boards

Номер: US20130331484A1
Автор: Braum Roger, Gier Andreas, Hasch Joachim
Принадлежит: KRONOTEC AG

The present invention relates to a hybrid adhesive, in particular for use in the production of engineered wood such as particle boards, fiber boards, plywood or glued-laminated timber, comprising at least one polycondensation adhesive, at least one polyaddition adhesive, and at least one particular, in particular a nanoparticle smaller than 500 nm, wherein the at least one particle is modified with at least one compound of the general Formula (I) RSiX, or the general Formula (II) OX(OH)RSiO. The present invention also relates to the use of the adhesive in engineered wood boards and to methods for the production thereof. 2. The adhesive according to claim 1 , wherein X is selected from a group including fluorine claim 1 , chlorine claim 1 , bromine claim 1 , iodine claim 1 , Calkoxy claim 1 , in particular methoxy claim 1 , ethoxy claim 1 , n-propoxy and butoxy claim 1 , Caryloxy claim 1 , in particular phenoxy claim 1 , Cacyloxy claim 1 , in particular acetoxy or propionoxy claim 1 , Calkylcarbonyl claim 1 , in particular acetyl claim 1 , monoalkylamino or dialkylamino with Cto C claim 1 , in particular Cto C.3. The adhesive according to claim 1 , wherein R is selected from a group comprising substituted and non-substituted C-Calkyl claim 1 , in particular C-Calkyl claim 1 , substituted and non-substituted C-Calkenyl claim 1 , substituted and non-substituted C-Calkinyl claim 1 , and substituted and non-substituted C-Caryl.4. The adhesive according to claim 1 , wherein R is selected from the group including methyl claim 1 , ethyl claim 1 , n-propyl claim 1 , isopropyl claim 1 , n-butyl claim 1 , s-butyl claim 1 , t-butyl claim 1 , pentyl claim 1 , hexyl claim 1 , cyclohexyl claim 1 , vinyl claim 1 , 1-propenyl claim 1 , 2-propenyl claim 1 , butenyl claim 1 , acetylenyl claim 1 , propargyl claim 1 , phenyl and naphthyl.5. The adhesive according to claim 1 , wherein the functional group Q is an epoxide claim 1 , in particular a glycidyl or glycidyloxy group claim 1 , ...

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Номер записи: 27
19-12-2013 дата публикации

AMIDE-EXTENDED CROSSLINKING COMPOUNDS AND METHODS FOR USE THEREOF

Номер: US20130338313A1
Автор: Dershem Stephen M., Mizori Farhad G.
Принадлежит: DESIGNER MOLECULES, INC.

The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved by incorporating amide-extended maleimides into an adhesive formulation. Amide-extended maleimides described herein can be used to toughen bismaleimide thermosetting materials without sacrificing any thermal stability. Amide-extended maleimides are readily prepared by reacting a bismaleimide with an appropriate amine via the well-known Michael addition reaction. Acylation of the resulting secondary amines provides the amide-extended maleimide. The acylating agent can also be used to introduce polymerizable functional groups into the backbones of these thermoset monomers. Amide-extended acrylate and methacrylate monomers can also be prepared. 1. An amide-extended monomer , oligomer or polymer prepared according to a method comprising:(a) reacting an ethylenically unsaturated monomer, oligomer or polymer with a primary amine via a Michael addition reaction to form an amine-terminated intermediate; and(b) acylating the amine-terminated intermediate,to thereby form the amide-extended monomer, oligomer or polymer having thermal resistance that is higher than the thermal resistance of the amine-terminated intermediate.3. The compound of claim 2 , wherein Ris an aryl and Ris selected from the group consisting of an unsubstituted or a substituted aliphatic moiety and a cycloaliphatic moiety.4. The compound of claim 2 , wherein each of Rand Ris independently selected from the group consisting of a Cto about a Csubstituted or unsubstituted alkenyl claim 2 , aliphatic and cycloaliphatic moiety.5. The compound of claim 2 , wherein at least one of Rand Ris independently selected from the group consisting of a Csubstituted or unsubstituted alkenyl claim 2 , aliphatic and cycloaliphatic moiety.7. The compound of claim 2 , wherein:{'sub': '3', '(a) Ris selected from the group consisting of an unsubstituted or a substituted methyl, ethyl, propyl, iso- ...

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Номер записи: 28
26-12-2013 дата публикации

POLYMER COMPOSITIONS, POLYMER FILMS, AND METHODS FOR FORMING SAME

Номер: US20130345350A1
Автор: Klaehn John R., Orme Christopher J., Peterson Eric S.
Принадлежит: BATTELLE ENERGY ALLIANCE, LLC

Stable, high performance polymer compositions including polybenzimidazole (PBI) and a melamine-formaldehyde polymer, such as methylated, poly(melamine-co-formaldehyde), for forming structures such as films, fibers and bulky structures. The polymer compositions may be formed by combining polybenzimidazole with the melamine-formaldehyde polymer to form a precursor. The polybenzimidazole may be reacted and/or intertwined with the melamine-formaldehyde polymer to form the polymer composition. For example, a stable, free-standing film having a thickness of, for example, between about 5 μm and about 30 μm may be formed from the polymer composition. Such films may be used as gas separation membranes and may be submerged into water for extended periods without crazing and cracking. The polymer composition may also be used as a coating on substrates, such as metal and ceramics, or may be used for spinning fibers. Precursors for forming such polymer compositions are also disclosed. 1. A precursor of a polymer composition , the precursor comprising a solution of polybenzimidazole and a melamine-formaldehyde polymer.2. The precursor of claim 1 , wherein the melamine-formaldehyde polymer comprises methylated claim 1 , poly(melamine-co-formaldehyde).3. The precursor of claim 1 , wherein the solution consists of the polybenzimidazole claim 1 , methylated claim 1 , poly(melamine-co-formaldehyde) claim 1 , and at least one solvent.4. The precursor of claim 3 , wherein the at least one solvent comprises at least one of a polar claim 3 , aprotic solvent and an organic solvent.5. The precursor of claim 1 , wherein the polybenzimidazole and the melamine-formaldehyde polymer are homogeneously dispersed in at least one solvent.6. The precursor of claim 1 , wherein the solution is formulated to comprise less than or equal to about 40% by weight of the melamine-formaldehyde polymer.7. The precursor of claim 1 , wherein the solution is formulated to comprise a ratio of between about 2:1 and ...

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Номер записи: 29
02-01-2014 дата публикации

POLYAMIDE-IMIDE RESIN COMPOSITION, POLYAMIDE-IMIDE RESIN FILM USING THE RESIN COMPOSITION, AND SEAMLESS BELT INCLUDING THE RESIN FILM

Номер: US20140005328A1
Автор: Kitagawa Hisae, Masaki Shunsuke
Принадлежит:

A polyamide-imide resin composition according to embodiment of the present invention, including a polyamide-imide resin obtained by causing acid components (A) containing a dimer acid and a polyisocyanate component (B) to react with each other, wherein a ratio of the dimer acid in the acid components (A) is 3 mol % to 55 mol %. 1. A polyamide-imide resin composition , comprising a polyamide-imide resin obtained by causing acid components (A) containing a dimer acid and a polyisocyanate component (B) to react with each other , wherein a ratio of the dimer acid in the acid components (A) is 3 mol % to 55 mol %.2. A polyamide-imide resin composition according to claim 1 , wherein the acid components (A) contain a hydrogenated dimer acid.3. A polyamide-imide resin composition according to or claim 1 , wherein the polyisocyanate component comprises contain an aromatic diisocyanate.4. A polyamide-imide resin composition according to or claim 1 , wherein the acid components (A) further contain a tricarboxylic anhydride and a ratio of the tricarboxylic anhydride in the acid components (A) is 90 mol % to 97 mol %.5. A polyamide-imide resin film claim 1 , which is obtained by using the polyamide-imide resin composition according to .6. A polyamide-imide resin film according to claim 5 , wherein the film has a rupture elongation of 60% or more.7. A polyamide-imide resin film according to claim 5 , wherein the film has a remaining solvent amount of 2% or less.8. A seamless belt claim 5 , comprising the polyamide-imide resin film according to . This application claims priority under 35 U.S.C. Section 119 to Japanese Patent Application No. 2012-144173 filed on Jun. 27, 2012, which are herein incorporated by references.1. Field of the InventionThe present invention related to a polyamide-imide resin composition, a polyamide-imide resin film using the resin composition, and a seamless belt including the resin film.2. Description of the Related ArtA polyamide-imide resin is a resin ...

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Номер записи: 30
09-01-2014 дата публикации

Resin-transfer-moldable terminal-modified imide oligomer using 2-phenyl-4,4' diaminodiphenyl ether and having excellent moldability, mixture thereof, varnish containing same, and cured resin thereof and fiber-reinforced cured resin thereof made by resin transfer molding and having excellent heat resistance

Номер: US20140011950A1
Автор: Masahiko Miyauchi, Rikio Yokota, Toshio Ogasawara, Yuichi Ishida
Принадлежит: Japan Aerospace Exploration Agency JAXA, Kaneka Corp

A novel resin-transfer-moldable terminal-modified imide oligomer having a residue of a tetravalent aromatic tetracarboxylic acid and represented by general formula (1), and the imide oligomer contains an oligomer where n is 0 in an amount of 10% by mole or more. In the formula, R 1 and R 2 are a hydrogen atom or an aromatic hydrocarbon group having 6 to 10 carbon atoms, and one of R 1 and R 2 is the aromatic hydrocarbon group having 6 to 10 carbon atoms; R 3 is an aromatic organic group surrounded by four carbonyl groups in the aromatic tetracarboxylic acid, and for a formula where n is 2 or more, R 3 s are optionally the same as or different from each other; and n is an integer of 0 or more and 6 or less.

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Номер записи: 31
23-01-2014 дата публикации

Material for alignment layer of liquid crystal display

Номер: US20140024751A1
Автор: Hongji Huang, Kuancheng Lee, Xinhui Zhong
Принадлежит: Shenzhen China Star Optoelectronics Technology Co Ltd

The present invention provides a material for alignment layer of liquid crystal display, which includes a solvent and a polymer dissolved in the solvent. The polymer includes a backbone and a first side chain linked to the backbone. The first side chain has a stronger lateral dipole moment. The material for alignment layer of liquid crystal display is characterized in that a first side chain that contains both a flexible chain segment and rigid chain segment is linked to the backbone of the polymer and the first side chain has a stronger lateral dipole moment, making it taking a rotation or tilting motion under the application of an electric field so as to effect alignment of the liquid crystal molecules in the pre-tilt angle.

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Номер записи: 32
03-01-2019 дата публикации

POLYIMIDE LAMINATED FILM AND METHOD OF PREPARING POLYIMIDE LAMINATED FILM

Номер: US20190001644A1
Автор: Imai Takashi, NUKADA Katsumi, SASAKI Tomoya
Принадлежит: FUJI XEROX CO., LTD.

A polyimide laminated film includes a porous polyimide layer that has a porosity of from 30% to 90% and pores having a spherical shape and a non-porous polyimide layer that has a porosity of 5% or less. 1. A polyimide laminated film comprising:a porous polyimide layer that has a porosity of from 30% to 90% and pores having a spherical shape; anda non-porous polyimide layer that has a porosity of 5% or less.2. The polyimide laminated film according to claim 1 , [{'br': None, 'Tp>Tn \u2003\u2003(1)'}, {'br': None, 'i': 'Tp+Tn≤', '10 μm≤100 μm \u2003\u2003(2)'}], 'wherein the polyimide laminated film, satisfies the following Expressions (1) and (2)wherein Tp represents an average film thickness of the porous polyimide layer (in a case of including a plurality of the porous polyimide layers, a sum of respective average film thicknesses of the porous polyimide layers), and Tn represents an average film thickness of the non-porous polyimide layer (in a case of including a plurality of the non-porous polyimide layers, a sum of respective average film thicknesses of the non-porous polyimide layers).3. The polyimide laminated film according to claim 1 ,wherein the porous polyimide layer contacts the non-porous polyimide layer.4. The polyimide laminated film according to claim 3 ,wherein in a cross-section in a direction orthogonal to an interface between the non-porous polyimide layer and the porous polyimide layer, a maximum, cross-section height Zt obtained from a sum of a maximum value of a mountain height Zp of a contour curve of the interface and a maximum value of a valley depth Zv is 0.5 μm or less.5. The polyimide laminated film according to claim 1 ,wherein the porosity of the porous polyimide layer is 50% or more.6. The polyimide laminated film according to claim 1 ,wherein Tp is from 5 μm to 100 μm.7. The polyimide laminated film according to claim 1 ,wherein Tp is from 5 μm to 70 μm.8. The polyimide laminated film according to claim 1 ,wherein Tn is from 1 μm. to ...

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Номер записи: 33
05-01-2017 дата публикации

ADHESIVE COMPOSITION USING POLYAMIDE-IMIDE RESIN

Номер: US20170002242A1
Автор: EBIHARA Satoshi, HAMANO Masami, KOYANAGI Hideyuki, OBA Hisae, OKANO Kouji, YANE Takehisa
Принадлежит:

The present invention provides an adhesive composition for a flexible printed wiring board containing (A) an epoxy resin; (B) no phosphorus-containing epoxy resin; and (C) a polyamide-imide resin. 1. An adhesive composition wherein a polyamide-imide resin and an epoxy resin are compounded , characterized in that said adhesive composition has characteristics of the following (A) to (C):(A) 15 parts by mass to 40 parts by mass of the epoxy resin is compounded to 85 parts by mass to 60 parts by mass of the polyamide-imide resin;(B) No phosphorus-containing epoxy resin is used as the epoxy resin or, even if used, a compounding amount of the phosphorus-containing epoxy resin to 100 parts by mass of the polyamide-imide resin is less than 1 part by mass; and(C) The polyamide-imide resin is a polyamide-imide resin comprising a constituent unit derived from acid ingredients of the following (a) to (c) and a constituent unit derived from a diisocyanate ingredient having an aromatic ring or derived from a diamine ingredient having an aromatic ring and,when the constituent units derived from total acid ingredients in the polyamide-imide resin are taken as 100 mol %, a rate of each constituent unit derived from each acid ingredient is 1 to 6 mol % for (a), 10 to 80 mol % for (b) and 10 to 89 mol % for (c):(a) acrylonitrile-butadiene rubber which has carboxyl groups in both terminals, has weight-average molecular weight of 500 to 5,000, and has a rate of an acrylonitrile moiety of 10 to 50% by mass;(b) aliphatic dicarboxylic acid which has a carbon number of 4 to 12; and(c) anhydride of polycarboxylic acid which has an aromatic ring.2. The adhesive composition according to claim 1 , wherein a phosphorus-type flame retardant is further compounded therewith and a content of phosphorus in a nonvolatile ingredient in the adhesive composition is 1.0 to 5.0% by mass.3. The adhesive composition according to claim 2 , wherein a phosphorus-type flame retardant having no functional group ...

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Номер записи: 34
02-01-2020 дата публикации

LIQUID CRYSTAL ALIGNING AGENT COMPOSITION, METHOD FOR PRODUCING LIQUID CRYSTAL ALIGNMENT FILM USING SAME, AND LIQUID CRYSTAL ALIGNMENT FILM USING SAME

Номер: US20200002614A1
Автор: JO Jung Ho, Lee Sang Mi, PARK Hang Ah, YOON Jun Young, YUN Hyeong Seuk
Принадлежит: LG CHEM, LTD.

The present invention provides a liquid crystal aligning agent composition that has excellent storage stability, can secure a high imidization rate, and can produce a liquid crystal alignment film having improved film strength together with liquid crystal alignment properties, a method for producing a liquid crystal alignment film using the same, and a liquid crystal alignment film and a liquid crystal display device using the same. 2. The liquid crystal aligning agent composition of claim 1 , wherein the functional group substituted in the primary or secondary amine is capable of being substituted with a hydrogen atom at a temperature of 90° C. or higher.3. The liquid crystal aligning agent composition of claim 1 , wherein the primary or secondary amine compound is included in an amount of 0.03 parts by weight to 30 parts by weight claim 1 , based on a total of 100 parts by weight of the first polymer for the liquid crystal aligning agent and the second polymer for the liquid crystal aligning agent.4. The liquid crystal aligning agent composition of claim 1 , wherein the primary amine or the secondary amine in the primary or secondary amine compounds each independently has a linear or cyclic structure.6. The liquid crystal aligning agent composition of claim 1 , wherein a weight ratio between the first polymer for a liquid crystal aligning agent and the second polymer for a liquid crystal aligning agent is 1:9 to 9:1.7. The liquid crystal aligning agent composition of claim 1 , wherein the molecular weight of the compound having two or more epoxy groups in a molecule is 100 g/mol to 10 claim 1 ,000 g/mol.8. The liquid crystal aligning agent composition of claim 1 , wherein the compound having two or more epoxy groups in a molecule is a cycloaliphatic-based epoxy claim 1 , a bisphenol-based epoxy claim 1 , or a novolac-based epoxy.9. The liquid crystal aligning agent composition of claim 1 , wherein the compound having two or more epoxy groups in a molecule is ...

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Номер записи: 35
02-01-2020 дата публикации

PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM COMPRISING THE SAME

Номер: US20200004149A1
Автор: Choi Dai Seung, Lee Min Hyung
Принадлежит: LG CHEM, LTD.

The present invention relates to a photosensitive resin composition including a poly(imide-benzoxazine) block copolymer, and a cured film. The poly(imide-benzoxazine) block copolymer included in the photosensitive resin composition enables the formation of a cured film having excellent mechanical and insulation even at a low temperature of less than 200° C. 6. The photosensitive resin composition according to claim 1 , wherein in the poly(imide-benzoxazine) block copolymer claim 1 , the weight ratio of the repeat unit having a polymerization degree m and the repeat unit having a polymerization degree n is 1:0.01 to 1:100.7. The photosensitive resin composition according to claim 1 , wherein the poly(imide-benzoxazine) block copolymer has a weight average molecular weight of 5000 to 100 claim 1 ,000 g/mol.8. The photosensitive resin composition according to claim 1 , wherein the photocurable multifunctional acrylic compound includes one or more acrylic compounds selected from the group consisting of an acrylate-based compound claim 1 , a polyester acrylate-based compound claim 1 , a polyurethane acrylate-based compound claim 1 , an epoxy acrylate-based compound claim 1 , and a caprolactone modified acrylate-based compound.9. The photosensitive resin composition according to claim 1 , wherein the composition comprises 1 to 50 parts by weight of the photocurable multifunctional acrylic compounds claim 1 , based on 100 parts by weight of the poly(imide-benzoxazine) block copolymer.10. A cured film formed by curing the photosensitive resin composition according to .11. The cured film of claim 10 , wherein the curing is performed at a temperature of from 160 to 220° C. This application is a 35 U.S.C. § 371 National Phase Entry Application from PCT/KR2018/008367, filed on Jul. 24, 2018, and designating the United States, which claims the benefit of Korean Patent Application No. 10-2017-0118859 filed on Sep. 15, 2017 and Korean Patent Application No. 10-2018-0085443 filed ...

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Номер записи: 36
08-01-2015 дата публикации

CARBOHYDRATE BASED BINDER SYSTEM AND METHOD OF ITS PRODUCTION

Номер: US20150010949A1
Автор: Hampson Carl, Jackson Roger, Pacorel Benedicte, ROBINSON JAMES
Принадлежит: KNAUF INSULATION

The present invention relates to an aqueous carbohydrate based binder composition, comprising a carbohydrate component and an amine component, wherein the carbohydrate component comprises one or more pentose sugars, as well as to a method of its production. 1. An aqueous binder composition , comprising a carbohydrate component (a) and an amine component (b) , wherein the carbohydrate component (a) comprises one or more pentose(s) in a total amount of 3 to 70 mass % , based on the mass of the total carbohydrate component (a).2. The binder composition according to claim 1 , wherein the carbohydrate component (a) further comprises one or more hexose(s) in a total amount of 97 to 30 mass % claim 1 , based on the mass of the total carbohydrate component (a).3. The binder composition according to claim 1 , wherein the one or more pentose(s) is/are selected from the group consisting of xylose claim 1 , arabinose claim 1 , ribose claim 1 , lyxose claim 1 , ribulose and xylulose claim 1 , or any combination thereof.4. The binder composition according to claim 1 , wherein the amine component (b) is selected from the group consisting of proteins claim 1 , peptides claim 1 , amino acids claim 1 , organic amines claim 1 , polyamines claim 1 , ammonia claim 1 , ammonium salts of a monomeric polycarboxylic acid claim 1 , ammonium salts of a polymeric polycarboxylic acid claim 1 , and ammonium salts of an inorganic acid claim 1 , or any combination thereof.5. The binder composition according to claim 1 , wherein said binder composition further comprises an amino acid component (c).6. A binder obtainable by heating the binder composition according to .7. A method of producing an aqueous binder composition claim 1 , comprising a carbohydrate component (a) and an amine component (b) claim 1 , wherein the carbohydrate component (a) comprises one or more pentose(s) in a total amount of 3 to 70 mass % claim 1 , based on the mass of the total carbohydrate component (a) claim 1 ,wherein ...

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Номер записи: 37
27-01-2022 дата публикации

BONDING A GLASS-RESIN COMPOSITE MONOFILAMENT TO A THERMOPLASTIC MATRIX

Номер: US20220024811A1
Автор: Delfino Antonio, Fedurco Milan, TORNARE MARCEL
Принадлежит:

Use of a benzoxazine resin () for the bonding of a monofilament () made of glass-resin composite including glass filaments () embedded in a thermosetting polyester resin (), to a thermoplastic material (), notably polyester; process for adhering such a monofilament to the thermoplastic material (), including at least the following steps: —impregnating the monofilament () with a benzoxazine resin () in the liquid state; —after impregnation, heat-treating the monofilament () thus impregnated, so as to at least partly polymerize the benzoxazine resin (); —depositing, onto the monofilament () thus adhesively coated, the thermoplastic material () in the molten state; —after cooling, optionally heat-treating the monofilament thus coated (R-1, R-2) to totally polymerize the benzoxazine resin () on contact with the thermoplastic material (). 115.-. (canceled)16. A method of bonding a monofilament made of glass-resin composite including glass filaments embedded in a thermoset polyester resin to a thermoplastic material , the method comprising the step of:using a benzoxazine resin.17. The method according to claim 16 , wherein the benzoxazine resin includes a benzoxazine monomer.19. The method according to claim 17 , wherein the benzoxazine monomer is a bis-benzoxazine.24. The method according to claim 16 , wherein the thermoset polyester resin is a vinyl ester resin.25. The method according to claim 16 , wherein the thermoplastic material is a polyester.26. The method according to claim 25 , wherein the polyester is selected from the group consisting of PET (polyethylene terephthalate) claim 25 , PEN (polyethylene naphthalate) claim 25 , PBT (polybutylene terephthalate) claim 25 , PBN (polybutylene naphthalate) claim 25 , PPT (polypropylene terephthalate) claim 25 , PPN (polypropylene naphthalate) and mixtures thereof.27. A process for adhering a monofilament claim 25 , made of glass-resin composite including glass filaments embedded in a thermosetting polyester resin claim ...

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Номер записи: 38
14-01-2021 дата публикации

CURABLE RESIN COMPOSITION, ADHESIVE AGENT, ADHESIVE FILM, CIRCUIT SUBSTRATE, INTERLAYER INSULATING MATERIAL, AND PRINTED WIRING BOARD

Номер: US20210009749A1
Автор: BABA Susumu, HAYASHI Tatsushi, KAWAHARA Yuko, OATARI Yuta, SHINDO Masami, SHINJO Takashi, Takeda Kohei, WAKIOKA Sayaka
Принадлежит: Sekisui Chemical Co., Ltd.

A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided. 1. A curable resin composition comprising:a curable resin; anda curing agent containing an imide oligomer,the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less.2. The curable resin composition according to claim 1 ,wherein the aliphatic diamine residue and/or the aliphatic triamine residue are/is an aliphatic diamine residue and/or an aliphatic triamine residue derived from a dimer acid and/or a trimer acid.3. The curable resin composition according to claim 1 ,wherein the proportion of the aliphatic diamine residue and/or aliphatic triamine residue in the polyvalent amine residues contained in the entire imide oligomer is 5 mol % or more.4. The ...

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Номер записи: 39
09-01-2020 дата публикации

WAVELENGTH-CONVERTING COMPONENT, PROJECTION APPARATUS AND MANUFACTURING METHOD OF THE WAVELENGTH-CONVERTING COMPONENT

Номер: US20200012179A1
Автор: KAO WEI-HUA, Tsai Yu-Lin
Принадлежит:

A wavelength-converting component includes a substrate, a wavelength-converting layer and a reflective layer. The wavelength-converting layer is disposed on the substrate. The reflective layer is disposed between the substrate and the wavelength-converting layer. The reflective layer includes a plurality of diffuse reflection particles and a first organic adhesive. The diffuse reflection particles are mixed in the first organic adhesive. The first organic adhesive includes an aromatic polyimide. The invention further provides a projection apparatus using the wavelength-converting component and provides a manufacturing method of the wavelength-converting component. The wavelength-converting component of the invention can improve mechanical properties such as shear strength, tensile strength and fatigue strength, temperature resistance and reflectivity, and can reduce rates of moisture absorption. The projection apparatus of the invention can reduce degradation in image brightness. 1. A wavelength-converting component , comprising:a substrate;a wavelength-converting layer, disposed on the substrate; anda reflective layer, disposed between the substrate and the wavelength-converting layer, the reflective layer comprises a plurality of diffuse reflection particles and a first organic adhesive, the diffuse reflection particles are mixed in the first organic adhesive, and the first organic adhesive comprises an aromatic polyimide.2. The wavelength-converting component according to claim 1 , wherein curing temperatures of the first organic adhesive are from 200° C. to 300° C.3. The wavelength-converting component according to claim 1 , wherein the wavelength-converting layer comprises a wavelength-converting material and a second organic adhesive claim 1 , the wavelength-converting material is mixed in the second organic adhesive claim 1 , and the second organic adhesive comprises an aromatic polyimide.4. The wavelength-converting component according to claim 3 , wherein ...

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Номер записи: 40
14-01-2021 дата публикации

ANTI-FOULING AND SPECIFIC BINDING SURFACE, DISPERSIONS COMPRISING PARTICLES HAVING SUCH SURFACES, AND METHODS OF MAKING THESE

Номер: US20210012935A1
Автор: DIAS Aylvin Jorge Angelo Athanasius, Qiu Jun, VAN DEN BOSCH Edith Elisabeth M, ZONG MengMeng
Принадлежит:

Disclosed are anti-fouling and optionally specific binding surfaces, methods for forming anti-fouling and optionally specific binding surfaces, and molecules that may be useful for forming anti-fouling and optionally specific binding surfaces. The surfaces may be formed by employing a molecule comprising a poly(2-oxazoline) having functional groups. In an embodiment, the poly(2-oxazoline) comprises a carboxyl endgroup, an amine endgroup, an N- hydroxysuccinimide endgroup, an oxirane endgroup, an oxetane endgroup, or an isocyanate endgroup, which may enable attachment of a specific binding moiety to the poly(2-oxazoline). In an embodiment, the poly(2-oxazoline) molecule comprises a (meth)acrylate functionality that may allow for attachment to a surface comprising a moiety capable of nucleophilic conjugate addition. 118-. (canceled)22. The dispersion according to claim 21 , wherein the particles are magnetic particles.23. The dispersion according to claim 21 , wherein the number average molecular weight of the compound according to formula (3) claim 21 , not including the surface of the particle or the group attached to the surface of a particle claim 21 , is from 500 g/mol to 5 claim 21 ,000 g/mol.24. The dispersion according to claim 22 , wherein the number average molecular weight of the compound according to formula (3) claim 22 , not including the surface of the particle or the group attached to the surface of a particle claim 22 , is from 500 g/mol to 5 claim 22 ,000 g/mol.25. The dispersion according to claim 21 , wherein Rcomprises a carboxyl endgroup claim 21 , an amine endgroup claim 21 , an N-hydroxysuccinimide endgroup claim 21 , an oxirane endgroup claim 21 , an oxetane endgroup claim 21 , or an isocyanate endgroup.26. The dispersion according to claim 21 , wherein Rcomprises a specific binding moiety that has at least one specific binding group claim 21 , which specific binding group is a functional group capable of binding a desired species or molecule. ...

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Номер записи: 41
03-02-2022 дата публикации

THICK POLYIMIDE FILM HAVING IMPROVED SURFACE QUALITY AND METHOD OF MANUFACTURING SAME

Номер: US20220033597A1
Автор: JO Hyong Sop, SON Won Ho
Принадлежит:

The present invention provides a polyimide film in which a parameter A for the relationship of the viscosity (V) of a polyamic acid solution, the number average molecular weight (Mn) of polyamic acid, and the thickness (T) of a polyimide film falls within a range from 0.4 to 1.13. 1. A polyimide film manufactured by imidizing a polyamic acid solution , wherein a following parameter A falls within a range from 0.4 to 1.13:{'br': None, 'i': A', 'V·Mn', 'T, 'sup': '2', '=log(()·√{square root over ()})−21'}wherein V is a viscosity of the polyamic acid solution and is 200,000 cP to 250,000 cP as measured at 23° C. when a solid content thereof is 18.5 wt %, Mn is a number average molecular weight of polyamic acid dissolved in the polyamic acid solution and is 100,000 g/mole to 150,000 g/mole, and T is a thickness of the polyimide film and is 55 μm to 110 μm.2. The polyimide film of claim 1 , wherein the polyamic acid has a weight average molecular weight/number average molecular weight ratio (=Mw/Mn) of 1.5 to 1.8.3. The polyimide film of claim 1 , wherein the polyamic acid comprises:a first polymer chain having a number average molecular weight of 10,000 g/mole to 80,000 g/mole;a second polymer chain having a number average molecular weight of greater than 80,000 g/mole to 170,000 g/mole; anda third polymer chain having a number average molecular weight of greater than 170,000 g/mole to 400,000 g/mole.4. The polyimide film of claim 1 , wherein claim 1 , based on a total weight of the polyamic acid claim 1 ,an amount of the first polymer chain is 5% to 20%,an amount of the second polymer chain is 70% to 90%, andan amount of the third polymer chain is 5% to 10%.5. The polyimide film of claim 1 , wherein when the polyimide film is subjected to corona treatment and is tested using an adhesive claim 1 , an adhesion of the polyimide film is 1 claim 1 ,100 gf/mm or more.6. The polyimide film of claim 1 , having a modulus of 3.3 Gpa or more claim 1 , an elongation of 75% or more ...

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Номер записи: 42
18-01-2018 дата публикации

STABILIZING EXCIPIENTS FOR THERAPEUTIC PROTEIN FORMULATIONS

Номер: US20180015168A1
Автор: Greene Daniel G., Mahoney Robert P., Soane David S., Wuthrich Philip
Принадлежит:

The invention encompasses therapeutic formulations comprising a protein active ingredient and a stabilizing excipient, methods of improving stability in a therapeutic formulation comprising a protein active ingredient by adding a stability-improving amount of a stabilizing excipient to the therapeutic formulation, and methods of reducing adverse infusion-related effects in a patient, comprising administering to a patient in need thereof a therapeutic formulation comprising a protein active ingredient and a stabilizing excipient. 1. A therapeutic formulation comprising a protein active ingredient and a stabilizing excipient.2. The formulation of claim 1 , wherein the formulation contains between about 1μg/mL and about 1 mg/mL of protein active ingredient.38-. (canceled)9. The formulation of claim 1 , wherein the protein active ingredient is selected from the group consisting of an antibody claim 1 , an antibody-drug conjugate claim 1 , an enzyme claim 1 , a cytokine claim 1 , a neurotoxin claim 1 , a fusion protein claim 1 , an immunogenic protein claim 1 , a PEGylated protein claim 1 , and an antibody fragment.10. The formulation of claim 1 , wherein the formulation contains at least about 1 to about 5000 ppm of the stabilizing excipient.11. (canceled)12. (canceled)13. The formulation of claim 1 , wherein the stabilizing excipient excludes polypropylene block copolymers.14. The formulation of claim 1 , wherein the stabilizing excipient is selected from the group consisting of polypropylene glycol claim 1 , adducts of polypropylene glycol claim 1 , and random copolymers comprising propylene oxide units.15. The formulation of claim 14 , wherein the stabilizing excipient is a polypropylene glycol homopolymer.1621-. (canceled)22. The formulation of claim 14 , wherein the polypropylene glycol is a branched polymer.23. The formulation of claim 22 , wherein the branched polymer is formed by addition of propylene glycol units to a branched or multifunctional alcohol or a ...

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Номер записи: 43
18-01-2018 дата публикации

STABILIZING EXCIPIENTS FOR THERAPEUTIC PROTEIN FORMULATIONS

Номер: US20180015169A1
Автор: Greene Daniel G., Mahoney Robert P., Soane David S., Wuthrich Philip
Принадлежит:

The invention encompasses therapeutic formulations comprising a protein active ingredient and a stabilizing excipient, methods of improving stability in a therapeutic formulation comprising a protein active ingredient by adding a stability-improving amount of a stabilizing excipient to the therapeutic formulation, and methods of reducing adverse infusion-related effects in a patient, comprising administering to a patient in need thereof a therapeutic formulation comprising a protein active ingredient and a stabilizing excipient. 1. A therapeutic formulation comprising a therapeutically-effective amount of a therapeutic protein and a stabilizing amount of a polypropylene glycol polymer , wherein the polypropylene glycol polymer has a number-average molecular weight between about 300 and 5000.2. The therapeutic formulation of claim 1 , wherein the therapeutic protein is an antibody.3. The therapeutic formulation of claim 2 , where the formulation is suitable for injection.4. The therapeutic formulation of claim 3 , wherein the formulation further comprises an aqueous medium.5. The therapeutic formulation of claim 2 , wherein the formulation contains between about 1 μg/mL and about 1 mg/mL of the antibody.6. The therapeutic formulation of claim 2 , wherein the formulation contains at least about 100 mg/mL of the antibody.7. The therapeutic formulation of claim 1 , wherein the formulation contains at least about 1 to about 500 ppm of the polypropylene glycol polymer.8. The therapeutic formulation of claim 1 , wherein the formulation contains at least about 10 to about 100 ppm of the polypropylene glycol polymer.9. The therapeutic formulation of claim 1 , wherein the polypropylene glycol polymer has a number-average molecular weight of about 425 Daltons.10. The therapeutic formulation of claim 1 , wherein the polypropylene glycol polymer is a linear polymer comprising at least two hydroxyl groups.11. The therapeutic formulation of claim 1 , wherein the formulation does ...

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Номер записи: 44
21-01-2016 дата публикации

Hydrocolloid Wound Dressings with Increased WVTR

Номер: US20160015851A1
Автор: Chiou Herbert C., Lee Hae-Seung
Принадлежит: 3M INNOVATIVE PROPERTIES COMPANY

Hydrocolloid compositions, wound dressings, methods of using such compositions and such wound dressings, and methods of forming such hydrocolloid compositions, wherein the hydrocolloid compositions include a hydrophobic, unsaturated, elastomeric polymer; a hydrocolloid absorbent; and a hydrophilic polymer including an unsaturated polymer backbone having polyalkylene ether groups bonded thereto. 1. A hydrocolloid composition comprising:a hydrophobic, unsaturated, elastomeric polymer;a hydrocolloid absorbent; anda hydrophilic polymer comprising an unsaturated polymer backbone having polyalkylene ether groups bonded thereto, wherein the hydrophilic polymer is present in an amount that increases the WVTR of the hydrocolloid composition relative to the same hydrocolloid composition without the hydrophilic polymer.2. The hydrocolloid composition of wherein the hydrophobic and hydrophilic polymers are crosslinked to provide the composition with a crosslinked matrix comprising partial unsaturation.3. The hydrocolloid composition of which is in the form of an adhesive.4. The hydrocolloid composition of which is in the form of a pressure sensitive adhesive.5. (canceled)6. The hydrocolloid composition of wherein the hydrophobic claim 1 , unsaturated claim 1 , elastomeric polymer is present in an amount of 20-50 wt-% claim 1 , based on the total weight of the composition.7. The hydrocolloid composition of wherein the hydrophilic polymer is present in an amount of 0.5-20 wt-% claim 1 , based on the total weight of the composition.8. The hydrocolloid composition of wherein the hydrocolloid absorbent is present in an amount of 5-60 wt-% claim 1 , based on the total weight of the composition.9. The hydrocolloid composition of wherein the polyalkylene ether groups are derived from a hydrophilic polyalkylene oxide-containing compound.10. The hydrocolloid composition of wherein the hydrophilic polyalkylene oxide-containing compound comprises ethylene oxide units and optionally co- ...

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Номер записи: 45
15-01-2015 дата публикации

POLYIMIDE RESIN, RESIN COMPOSITION AND LAMINATED FILM THAT USE SAME

Номер: US20150017370A1
Автор: Lee ChungSeon, Watanabe Takuo
Принадлежит: Toray Industries, Inc.

An object is to provided a polyimide resin that is prevented from generation of volatiles due to decomposition or the like even at high temperatures equal to or higher than 250° C. and has good adhesiveness, and a resin composition and a laminated film using the same. Provided is a polyimide resin having at least a tetracarboxylic dianhydride residue and a di-amine residue and having a glass transition temperature of 30° C. or lower, wherein a residue of a polysiloxane di-amine represented by general formula (1) is contained as the di-amine residue, 2. The polyimide resin according to claim 1 , wherein the residue of the polysiloxane di-amine represented by general formula (1) is contained as the di-amine residue in an amount of 60 mol % or more of all di-amine residues.3. The polyimide resin according to claim 1 , wherein a residue of an aromatic di-amine is further contained as the di-amine residue in an amount of 1 to 40 mol % of all di-amine residues.5. The polyimide resin according to claim 4 , wherein the aromatic di-amine represented by general formula (2) is 1 claim 4 ,3-bis(3-aminophenoxy)benzene or 3 claim 4 ,3′-diamino diphenyl sulfone.6. The polyimide resin according to claim 1 , wherein the tetracarboxylic dianhydride residue is a residue of an aromatic tetracarboxylic dianhydride.7. A resin composition comprising at least the polyimide resin according to .8. The resin composition according to claim 7 , wherein the glass transition temperature is 30° C. or lower.9. A laminated film in which the resin composition according to is laminated on at least one side of a heat-resistant insulation film.10. The laminated film according to claim 9 , wherein the surface of the heat-resistant insulation film on which the resin composition is laminated is release treated.11. A laminated film according to claim 9 , wherein a release treated film is further laminated on the surface of the laminated resin composition.12. The polyimide resin according to claim 2 , ...

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Номер записи: 46
17-01-2019 дата публикации

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM USING THE SAME

Номер: US20190016928A1
Автор: KIRIKAE Noriyuki, MIHARA Naoaki, Sugiyama Jirou
Принадлежит: FURUKAWA ELECTRIC CO., LTD.

The electrically conductive adhesive film comprises a metal particle (P), a resin (M) and a prescribed sulfide compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (P) has an average particle size (d50) of 20 μm or less and comprises 10% by mass or more of a first metal particle (P1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state. 2. The electrically conductive adhesive film according to claim 1 , wherein the first metal particle (P1) is a dendritic metal powder.3. The electrically conductive adhesive film according to claim 1 , wherein claim 1 , in the general formula (1) claim 1 , each K independently includes claim 1 , in its moiety claim 1 , one or more group selected from a vinyl group claim 1 , an acrylic group claim 1 , a methacrylic group claim 1 , a maleic acid ester group claim 1 , a maleic acid amide group claim 1 , a maleic acid imide group claim 1 , a primary amino group claim 1 , a secondary amino group claim 1 , a thiol group claim 1 , a hydrosilyl group claim 1 , a hydroboron group claim 1 , a phenolic hydroxyl group and an epoxy group.4. The electrically conductive adhesive film according to claim 1 , wherein the metal particle (P) further comprises a second metal particle (P2) made of a spherical metal powder.5. The electrically conductive adhesive film according to claim 4 , wherein the second metal particle (P2) has an average particle size (d50) of less than 7 μm.6. The electrically conductive adhesive film according to claim 4 , wherein the second metal particle (P2) comprises a metal particle made of tin or a tin-containing alloy.7. The electrically conductive adhesive film according to claim 1 , wherein a loss tangent (tan δ) defined by a ratio (G″/G′) of a loss elastic modulus (G″) to a storage elastic modulus (G′) at 60° C. and 1 Hz in a B-stage state is 1.4 or higher.8. The electrically conductive adhesive film according to claim 1 , wherein the ...

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Номер записи: 47
17-01-2019 дата публикации

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM USING THE SAME

Номер: US20190016929A1
Автор: KIRIKAE Noriyuki, MIHARA Naoaki, Sugiyama Jirou
Принадлежит: FURUKAWA ELECTRIC CO., LTD.

The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and a prescribed organophosphorus compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (Q) has an average particle size (d50) of 20 μm or less and comprise 10% by mass or more of a first metal particle (Q1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state. 2. The electrically conductive adhesive film according to claim 1 , wherein the first metal particle (Q1) is a dendritic metal powder.3. The electrically conductive adhesive film according to claim 1 , wherein the organophosphorus compound (A) is at least one compound selected from alkyl phosphine claim 1 , aryl phosphine and organic phosphorous acid ester.4. The electrically conductive adhesive film according to claim 1 , wherein claim 1 , in the general formula (1) claim 1 , each R independently includes claim 1 , in its moiety claim 1 , one or more group selected from a vinyl group claim 1 , an acrylic group claim 1 , a methacrylic group claim 1 , a maleic acid ester group claim 1 , a maleic acid amide group claim 1 , a maleic acid imide group claim 1 , a primary amino group claim 1 , a secondary amino group claim 1 , a thiol group claim 1 , a hydrosilyl group claim 1 , a hydroboron group claim 1 , a phenolic hydroxyl group and an epoxy group.5. The electrically conductive adhesive film according to claim 1 , wherein the metal particle (Q) further comprises a second metal particle (Q2) made of a spherical metal powder.6. The electrically conductive adhesive film according to claim 5 , wherein the second metal particle (Q2) has an average particle size (d50) of less than 7 μm.7. The electrically conductive adhesive film according to claim 5 , wherein the second metal particle (Q2) comprises a metal particle made of tin or a tin-containing alloy.8. The electrically conductive adhesive film according to claim 1 , wherein a loss tangent ( ...

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Номер записи: 48
21-01-2016 дата публикации

Photosensitive polyimide composition, base agent thereof, method of making the base agent, and solder-resistant polyimide thin film made from the composition

Номер: US20160018733A1
Автор: Hsiu-Ming Chang, Shih-Chang Lin, Tzu-Ching Hung
Принадлежит: Taiflex Scientific Co Ltd

A photosensitive polyimide composition; the composition comprises a base agent and a curing agent comprising a photoinitiator. By applying an aliphatic diamine monomer, which has a long carbon chain, and a grafting monomer, which has a main carbon chain having a double bond and an epoxy group at two ends respectively, to a method of making the base agent, a mixture of the base agent and the curing agent can be screen printed to form a photosensitive polyimide film on a copper foil. Also, the photosensitive polyimide film can be exposed under low exposure energy, and can be developed to a solder-resistant polyimide thin film by a weak alkaline developer after exposed. In addition, the solder-resistant polyimide thin film has low dielectric constant, low dielectric loss, good flame resistance, good solder resistance, and good pencil hardness. Accordingly, the photosensitive polyimide composition is applicable to high density flexible printed circuit boards.

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Номер записи: 49
16-01-2020 дата публикации

LIQUID CRYSTAL DISPLAY DEVICE, ALIGNMENT FILM FORMING MATERIAL, AND POLYMER COMPOUND

Номер: US20200019022A1
Автор: Katayama Takashi, Mizusaki Masanobu, Nakamura Kimiaki
Принадлежит:

A liquid crystal display device () includes a pair of substrates (), a liquid crystal layer () sandwiched between the pair of substrates (), an alignment film () disposed between the liquid crystal layer () and at least one substrate (), and an alignment-sustaining layer () disposed between the alignment film () and the liquid crystal layer () and regulating the tilt direction of at least liquid crystal molecules close to the alignment film () among the liquid crystal molecules constituting the liquid crystal layer (). The alignment film () contains a polymer compound having a functional group represented by the following Formula (1): 6. The liquid crystal display device according to claim 1 , wherein the alignment film is made of a polyimide claim 1 , a polyamic acid claim 1 , or a polysiloxane.7. The liquid crystal display device according to claim 1 , wherein the alignment film contains a polymer compound having a photoreactive functional group.8. The liquid crystal display device according to claim 7 , wherein the photoreactive functional group is a group having a cinnamate group claim 7 , a chalcone group claim 7 , a coumarin group claim 7 , an azobenzene group claim 7 , or a tolan group.10. The liquid crystal display device according to claim 1 , wherein the alignment-sustaining layer is formed by radical polymerizations of a radical polymerizable monomer. Some aspects of the present invention relate to a liquid crystal display device, an alignment film-forming material, and a polymer compound.The present application claims priority from Japanese Patent Application No. 2017-069987, filed Mar. 31, 2017, the disclosure of which is hereby incorporated by reference herein in its entirety.A liquid crystal display device includes a pair of substrates and a liquid crystal layer disposed therebetween, and performs display by utilizing that the alignment direction of liquid crystal molecules changes depending on the voltage applied to a liquid crystal layer. The ...

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Номер записи: 50
25-01-2018 дата публикации

BIS(AZOBENZENE) DIAMINES AND PHOTOMECHANICAL POLYMERS MADE THEREFROM

Номер: US20180022872A1
Автор: Tan Loon-Seng, Wang David Huabin, White Timothy J., Wie Jeong Jae
Принадлежит: Government of the United States, as represented by the Secretary of the Air Force

Bis(azo-benzene) diamine monomers and a method of synthesizing the monomers are provided. The bis(azo-benzene) diamine monomers, in combination with amine reactive monomers, form polymers, such as polyimides and copolyimides, having photomechanical and thermomechanical properties. 3. The bis(azobenzene)-containing copolyimide of claim 2 , wherein L is —O—.4. The bis(azobenzene)-containing copolyimide of claim 2 , wherein L is —S—. This application is a divisional of U.S. application Ser. No. 15/584,464 (pending), filed May 2, 2017, which was a divisional of U.S. application Ser. No. 14/845,450, filed Sep. 4, 2015, which claims benefit of and priority to U.S. Provisional Patent Application Serial Nos. 62/046,433 and 62/046,372, each of which was filed on Sep. 5, 2014. The disclosure of each of these applications is incorporated herein by reference, in its entirety.The invention described herein may be manufactured and used by or for the Government of the United States for all governmental purposes without the payment of any royalty.The invention generally relates to bis(azobenzene)-containing diamines, as well as the polymers and copolymers made therefrom. More particularly, the invention relates to bis(azobenzene)-containing diamines, which are useful for preparing polyimide, polyamide, and poly(amide-imide) polymers and copolymers having photomechanical properties and methods of making the same.Photomechanical polymers are a special class of stimuli-responsive materials that can transduce light into mechanical work. Photo-initiated shape adaptivity or force generation (actuation) are particularly intriguing due to the salient features of light, namely, remote and wireless (contactless) triggering with ease of spatial, temporal, directional (through polarization), and magnitude (with intensity) control.Considerable effort has been undertaken in both the synthesis of photoresponsive polymers and the characterization of their photomechanical outputs. To date, ...

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Номер записи: 51
25-01-2018 дата публикации

Adhesive Composition with High Frequency Characteristics and Application thereof

Номер: US20180022976A1
Автор: Chuang Chao-Chin, Du Donghai, Jheng Sih-Ci
Принадлежит:

An adhesive composition with high frequency characteristics and the application thereof; wherein, the adhesive composition has a total weight of (A), (B) and (C) in 100 parts by weight, comprising: (A) 40-80 parts by weight of solvent-soluble polyimide; (B) 5-30 parts by weight of propenyl-modified polyphenylene oxide resin; (C) 10-30 parts by weight of epoxy resin; and optionally comprising at least one of the following components: (D) flexibilizer; (E) flame retardant; (F) inorganic filler; (G) coupling agent; and (H) catalyst. The adhesive composition has the advantages of low dielectric constant, low dielectric loss, favorable heat resistance and low-temperature (<180° C.) adhesion. The adhesive composition can be used for preparing high-frequency protective membrane and high-frequency adhesive film. 1. An adhesive composition with high frequency characteristics , wherein , the adhesive composition has a total weight of the following components in 100 parts by weight , comprising:A: 40-80 parts by weight of solvent-soluble polyimide;B: 5-30 parts by weight of propenyl-modified polyphenylene oxide resin; 'the adhesive composition also optionally comprises at least one of the following components:', 'C: 10-30 parts by weight of epoxy resin;'}D: flexibilizer;E: flame retardant;F: inorganic filler;G: coupling agent; andH: catalyst.2. The adhesive composition with high frequency characteristics according to claim 1 , wherein claim 1 , the volume of addition of the flexibilizer does not exceed 25 parts by weight as the total weight of A claim 1 , B and C is 100 parts by weight.3. The adhesive composition with high frequency characteristics according to claim 1 , wherein claim 1 , the volume of addition of the flame retardant does not exceed 30 parts by weight as the total weight of A claim 1 , B and C is 100 parts by weight.4. The adhesive composition with high frequency characteristics according to claim 1 , wherein claim 1 , the volume of addition of the inorganic ...

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Номер записи: 52
24-01-2019 дата публикации

MATERIALS FOR USE AS ADHESIVE AND FOR SURFACE SEALING

Номер: US20190023955A1
Автор: Endres Klaus, Kockler Ralf, Pfeifer Stefan, Schneider Heike
Принадлежит: EPG (ENGINEERED NANOPRODUCTS GERMANY) AG

Materials from the group consisting of 1. The use of one or more materials from the group consisting ofa) one or more hybrid materials containing an organic polymer from the group of the polyamides, polyimides and epoxy resins and an inorganic oligo- or polymer from the group of the oligo- and polysiloxanes and heterocondensates of Si with Ti, Zr and/or Al, wherein the organic and the inorganic component are covalently bound to one another, in combination with one or more inorganic sols based on silyl alkoxylates and/or titanium alkoxylates, wherein hybrid material and inorganic sol are crosslinked,b) one or more hybrid materials containing an organic polymer from the group of the polyamides, polyimides and epoxy resins and an inorganic oligo- or polymer from the group of the oligo- and polysiloxanes and heterocondensates of Si with Ti, Zr and/or Al, wherein the organic and the inorganic component are covalently bound to one another,c) one or more inorganic sols based on silyl alkoxylates and/or titanium alkoxylates andd) one or more polyamides, polyimides and/or epoxy resins mixed with oxidic and/or non-oxidic metal and/or metalloid particles, preferably from the group of the oxides, nitrides, carbides and mixtures thereof,as adhesive for the bonding of metals, plastics, concrete and/or ceramics.2. The use according to claim 1 , wherein one or more materials from the group a) are used.3. The use according to claim 1 , wherein one or more materials from the group b) are used.4. The use according to claim 1 , wherein one or more materials from the group c) are used.5. The use according to claim 1 , wherein one or more materials from the group d) are used.6. The use according to claim 1 , wherein the adhesive contains encapsulated curing accelerators claim 1 , preferably selected from the group consisting of water claim 1 , Lewis acids claim 1 , Lewis bases and mixtures of these components.7. The use according to claim 1 , wherein the adhesive is doped with magnetic ...

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Номер записи: 53
23-01-2020 дата публикации

LIQUID CRYSTAL DISPLAY DEVICE

Номер: US20200024399A1
Автор: Mizusaki Masanobu, Okazaki Tsuyoshi, Teraoka Yuko
Принадлежит:

The present invention provides a liquid crystal display device with a high degree of freedom in molecular structure design of an alignment film and with reduced image sticking. The liquid crystal display device includes a pair of substrates; a liquid crystal layer held between the substrates; an alignment film disposed on a liquid crystal layer side surface of at least one of the substrates; and a polymer layer disposed between the liquid crystal layer and the alignment film, the alignment film containing a first polymer containing at least one structure represented by the following formula (1) in a side chain, 3. The liquid crystal display device according to claim 2 ,wherein the first polymer contains the structure represented by the above formula (1-1) in a side chain.6. The liquid crystal display device according to claim 1 ,wherein the first polymer contains at least one of a polyamic acid structure or a polyimide structure in a main chain.8. The liquid crystal display device according to claim 1 ,wherein the first polymer contains at least one photo-functional group.9. The liquid crystal display device according to claim 8 ,wherein the first polymer contains at least one photo-functional group selected from the group consisting of a cinnamate group, an azobenzene group, a chalcone group, and a coumarin group, each of which optionally contains a substituent.10. The liquid crystal display device according to claim 1 ,wherein the second polymer is a polymer obtained by radically polymerizing the at least one monomer.12. The liquid crystal display device according to claim 1 ,wherein the liquid crystal display device is in a liquid crystal driving mode of an MVA mode, a 4D-RTN mode, an FFS mode, or an IPS mode. The present application claims priority under 35 U.S.C. § 119 to U.S. Provisional Patent Application No. 62/702,112 filed on Jul. 23, 2018, the contents of which are incorporated herein by reference in their entirety.The present invention relates to liquid ...

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Номер записи: 54
23-01-2020 дата публикации

LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE

Номер: US20200026128A1
Автор: ITOH Tomonori, Mizusaki Masanobu
Принадлежит:

The present invention provides a liquid crystal display device that includes: a pair of substrates; a liquid crystal layer held between the substrates; and an alignment film disposed on a liquid crystal layer side surface of at least one of the substrates, the liquid crystal layer containing a liquid crystal material that has a nematic-isotropic phase transition temperature of 75° C. or lower and a nematic phase temperature range narrower than 100° C., the alignment film containing a first polymer and a second polymer, the first polymer having in its main chain at least one selected from a polyamic acid structure and a polyimide structure or a polysiloxane structure, the second polymer being obtained by polymerizing at least one monomer including at least one monomer containing an azobenzene group. 3. The liquid crystal display device according to claim 1 ,wherein the first polymer contains at least one photo-functional group selected from the group consisting of a cinnamate group, an azobenzene structure, a chalcone group, and a coumarin group, each of which may contain a substituent.4. The liquid crystal display device according to claim 1 ,wherein the alignment film includes a lower layer containing the first polymer and an upper layer disposed on a liquid crystal layer side of the lower layer and containing the second polymer.5. The liquid crystal display device according to claim 4 ,wherein the lower layer is a photo-alignment layer.6. The liquid crystal display device according to claim 4 ,wherein the lower layer is a vertical alignment layer.7. The liquid crystal display device according to claim 4 ,wherein the lower layer is a horizontal alignment layer.8. The liquid crystal display device according to claim 1 ,wherein the liquid crystal layer contains a liquid crystal material that has a nematic-isotropic phase transition temperature of 75° C. or lower and a nematic phase temperature range narrower than 100° C.9. The liquid crystal display device according ...

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Номер записи: 55
23-01-2020 дата публикации

LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE

Номер: US20200026129A1
Автор: Mizusaki Masanobu
Принадлежит:

The present invention provides a liquid crystal display device includes: a pair of substrates; a liquid crystal layer held between the substrates; an alignment film disposed on a liquid crystal layer side surface of at least one of the substrates; and a polymer layer disposed between the liquid crystal layer and the alignment film, the liquid crystal layer containing liquid crystal compounds aligned in a predetermined direction with no voltage applied, the alignment film containing a first polymer containing in its main chain at least one selected from a polyamic acid structure and a polyimide structure, the polymer layer containing a second polymer obtained by polymerizing at least one monomer containing an azobenzene group, the second polymer covalently bonded to the first polymer. 4. The liquid crystal display device according to claim 3 ,wherein the first polymer contains a functional group represented by the formula (3-1).6. The liquid crystal display device according to claim 1 ,wherein the first polymer contains at least one photo-functional group.7. The liquid crystal display device according to claim 6 ,wherein the first polymer contains at least one photo-functional group selected from the group consisting of a cinnamate group, an azobenzene group, a chalcone group, and a coumarin group, each of which may contain a substituent.8. The liquid crystal display device according to claim 1 ,wherein the liquid crystal display device is in a liquid crystal driving mode of a horizontal alignment mode, andthe polymer layer aligns the liquid crystal compounds in a directional parallel to surfaces of the substrates.9. The liquid crystal display device according to claim 1 ,wherein the liquid crystal display device is in a liquid crystal driving mode of an FFS mode, an IPS mode, an MVA mode, or a 4D-RTN mode.13. The method for manufacturing a liquid crystal display device according to claim 12 ,wherein the first polymer contains a functional group represented by the ...

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Номер записи: 56
29-01-2015 дата публикации

Anticorrosion Coatings

Номер: US20150031819A1
Автор: Gorodisher Ilya, Perez Mario A., Rungta Atri A.
Принадлежит: 3M INNOVATIVE PROPERTIES COMPANY

Curable compositions comprising a benzoxazine component, a polyamine component and a fluoropolymer component are described. The compositions may be cured to produce compositions useful in coating, sealants, adhesive and many other applications. 1. A curable composition comprising:a) a polybenzoxazine,b) a polyamine,c) fluoropolymer component; andd) an optional acid catalyst.2. The curable composition of wherein the polybenxoxazine is derived from an aromatic amine.4. The polybenzoxazine of where Ris an aryl group and m is 1.6. The curable composition of claim 1 , wherein said polyamine is of the formula:{'sup': 10', '9, 'sub': 'p', 'R(NHR), wherein'}{'sup': '10', 'Ris (hetero)hydrocarbyl group;'}{'sup': '9', 'p is 1 to 6, and each Ris H or a hydrocarbyl group.'}7. The curable composition of claim 1 , wherein the molar ratio of amine equivalents of the polyamine compound to the benzoxazine groups is from 1:2 to 2:1.8. The curable composition of claim 1 , further comprising an acid catalyst.9. The curable composition of further comprising a toughening agent.10. The curable composition of further comprising a particulate filler.11. The curable composition of comprising 1 to 50 parts by weight of filler claim 10 , relative to 100 parts by weight of the benzoxazine and polyamine.12. The curable composition of wherein the polyamine is an amidine or guanidine compound having at least two amine equivalents.14. The curable composition of wherein the fluoropolymer is selected from fluoroolefin (co)polymers claim 1 , perfluoroolefin(co)polymers claim 1 , perfluoroalkyl vinyl ether (co)polymers and perfluoroalkoxy vinyl ether (co)polymers.15. The curable composition of wherein the fluoroolefin (co)polymers are selected from tetrafluoroethylene (TFE) and hexafluoropropylene (HFP)) claim 14 , chlorotrifluoroethylene (CTFE) and vinylidine fluoride (co)polymers.16. The curable composition of wherein the fluoroolefin comprises:5 to about 90 mol % of its interpolymerized units ...

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Номер записи: 57
05-02-2015 дата публикации

Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release

Номер: US20150035173A1
Автор: Bing Dang, Cornelia Kang-I Tsang, Eric Peter Lewandowski, John U. Knickerbocker
Принадлежит: International Business Machines Corp

Methods are provided to form adhesive materials that are used to temporarily bond handler wafers to device wafers, and which enable mid-wavelength infrared laser ablation release techniques to release handler wafers from device wafers.

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Номер записи: 58
30-01-2020 дата публикации

QUINONE CURABLE COMPOSITIONS AND ADHESIVE COMPOSITIONS COMPRISING SAME

Номер: US20200032011A1
Автор: HAHN Jung Seok, Hwang Hong Gu, Lee Haeshin, WANG Younseon
Принадлежит:

The present invention relates to a curable composition and a use thereof and, more particularly, to a curable composition and a use thereof, the curable composition comprising: (a) a compound capable of being denatured to a quinone-based compound by oxygen; (b) an amine-based polymeric compound; and (c) an oxygen clathrate structure. The curable composition is rapidly cured and can be cured not only at an interface of a conventional film but also to the inside of the film, such that the curable composition has uniform physical properties throughout the entire film and excellent physical properties compared to a curing film obtained by curing at an existing interface. 1. A curable composition comprising ,(a) a catechol-based organic compound capable of being denatured to quinone by oxidation;(b) an amine-based polymeric compound; and(c) an oxygen clathrate structure.2. The curable composition according to claim 1 , wherein the oxygen clathrate structure is included in the entire curable composition in an amount of 1 to 99 wt. %.3. The curable composition according to claim 1 , wherein the catechol-based organic compound comprises functional groups of two or more hydroxyl groups in the benzene ring and is a compound that can be oxidized by oxygen.4. The curable composition according to claim 3 , wherein the catechol-based organic compound is at least one selected from the group consisting of L-dopa claim 3 , pyrogallol claim 3 , dopamine claim 3 , pyrocatechol claim 3 , norepinephrine and 3 claim 3 ,4-dihydroxycinnamic acid (DHCA).5. The curable composition according to claim 1 , wherein the amine-based polymeric compound is a polymer having an amine group in the molecular structure.6. The curable composition according to claim 5 , wherein the polymer having an amine group is at least one selected from polyethyleneimine claim 5 , polyamine claim 5 , polyamideamine claim 5 , polyvinylamine claim 5 , polyamidoimine claim 5 , polyallylamine claim 5 , polylysine claim 5 , ...

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Номер записи: 59
11-02-2016 дата публикации

Poly(amide-imide) block copolymer, article including same, and display device including the article

Номер: US20160039977A1
Автор: ANDROSOV Dmitry, Chung Kun Cho, KALININA Fedosya, KOVALEV Mikhail, Won-Cheol Jung, Yoon Seok Ko
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A poly(amide-imide) block copolymer that includes: a first segment including a structural unit represented by Chemical Formula 1C, and a second segment including a structural unit represented by Chemical Formula 2: In Chemical Formula 1C and Chemical Formula 2, R 5 to R 13 , and n3 to n8 are the same as in the specification.

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Номер записи: 60
09-02-2017 дата публикации

FIBER REINFORCED POLYETHERIMIDE COMPOSITIONS

Номер: US20170037246A1
Автор: Moniruzzaman Mohammad
Принадлежит: Sabic Global Technologies B.V.

Disclosed herein are compositions comprising a polyetherimide, a polyester carbonate, and a reinforcement agent; wherein the composition comprises the reinforcement agent in an amount ranging from 1 wt % to 70 wt % relative to the total weight of the composition; wherein the polyester carbonate comprises at least 40 mole % resorcinol based aryl ester linkages. Also, disclosed herein are articles comprising the compositions disclosed. 1. A composition comprising a polyetherimide , a polyester carbonate , and a reinforcement agent;wherein the composition comprises the reinforcement agent in an amount ranging from 1 wt % to 70 wt % relative to the total weight of the composition; andwherein the polyester carbonate comprises at least 40 mole % resorcinol based aryl ester linkages.2. The composition of claim 1 , wherein the composition comprises the polyetherimide in an amount ranging from 25 wt % to 60 wt % relative to the total weight of the composition; and wherein the composition comprises the polyester carbonate in an amount ranging from 20 wt % to 50 wt % relative to the total weight of the composition.3. The composition claim 1 , wherein the reinforcement agent comprises a carbon fiber or a glass fiber or a combination thereof.4. The composition of claim 1 , wherein the polyester carbonate comprises the resorcinol based aryl ester linkages in an amount ranging from 40 mole % to 95 mole % based on the total mole % of the polyester carbonate.5. The composition of claim 1 , wherein the composition comprises the reinforcement agent in an amount ranging from 5 wt % to 35 wt % relative to the total weight of the composition.6. (canceled)7. (canceled)8. (canceled)9. (canceled)10. The composition of claim 1 , wherein the composition further comprises a polyetherimide-siloxane copolymer.11. The composition of claim 10 , wherein the polyetherimide-siloxane copolymer is present in an amount ranging from 0.1 wt % to 10 wt % relative to the total weight of the composition.12. ...

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Номер записи: 61
12-02-2015 дата публикации

THERMOPLASTIC COPOLYIMIDES

Номер: US20150045501A1
Автор: Jeol Stéphane
Принадлежит:

The present invention relates to semiaromatic semicrystalline thermoplastic copolyimides obtained by polymerization of at least: (a) an aromatic compound comprising two anhydride functions and/or carboxylic acid and/or ester derivatives thereof; (b) a diamine of formula (I) NH2-R—NH2 in which R is a divalent aliphatic hydrocarbon-based radical optionally comprising heteroatoms, the two amine functions being separated by a number X of carbon atoms, X being between 4 and 12; and (c) a diamine of formula (II) NH2-R′—NH2 in which R′ is a divalent aliphatic hydrocarbon-based radical optionally comprising heteroatoms, the two amine functions being separated by a number Y of carbon atoms, Y being between 10 and 20; it being understood that diamine (b) is different from diamine (c). 133-. (canceled)34. A semiaromatic semicrystalline thermoplastic copolyimide obtained by polymerization of at least:(a) an aromatic compound comprising two anhydride functions and/or carboxylic acid and/or ester derivatives thereof;(b) a diamine of formula (I) NH2-R—NH2 selected from the group consisting of: 1,4-diaminobutane, 1,5-diaminopentane, 2-methyl-1,5-diaminopentane, hexamethylenediamine, 3-methylhexamethylenediamine, 2,5-dimethylhexamethylenediamine, 2,2,4- and 2,4,4-trimethyl-hexamethylenediamine, 1,7-diaminoheptane, 1,8-diaminooctane; and(c) a diamine of formula (II) NH2-R′—NH2 in which R′ is a saturated or unsaturated divalent aliphatic hydrocarbon-based radical, optionally comprising heteroatoms, wherein the two amine functions are separated by a number Y of carbon atoms, Y is between 10 and 20, and the radical R′ comprises not more than 20 carbon atoms.35. The copolyimide as claimed in claim 34 , wherein the copolyimide is obtained with addition of chain limiter(s) and/or supplemented with an excess of one of the monomers claim 34 , so as to create a stoichiometric imbalance.36. The copolyimide as claimed in claim 34 , wherein the copolyimide has a melting point Tf of between 50 ...

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Номер записи: 62
08-02-2018 дата публикации

FLEXIBLE SUBSTRATE ASSEMBLY AND ITS APPLICATION FOR FABRICATING FLEXIBLE PRINTED CIRCUITS

Номер: US20180042125A1
Автор: Huang Yen-Po, TSAI Tsung-Hsien
Принадлежит:

A method of fabricating a flexible printed circuit includes providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other, forming a flexible substrate on the carrying support, the formed flexible substrate being adhered in contact with the release layer, applying one or more processing step on the flexible substrate while the flexible substrate is supported by the carrying support, and peeling the flexible substrate with an electric circuit formed thereon from the release layer while the release layer remains adhered in contact with the support base. 1. A method of fabricating a flexible printed circuit , comprising:providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other;forming a flexible substrate on the carrying support, the formed flexible substrate being adhered in contact with the release layer;while the flexible substrate is supported by the carrying support, applying one or more processing step on the flexible substrate; andwhile the release layer remains adhered in contact with the support base, peeling the flexible substrate with an electric circuit formed thereon from the release layer;wherein the release layer and the flexible substrate respectively comprise a polyimide layer.2. The method according to claim 1 , wherein the step of providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other includes:providing a rigid support base; andforming a first polyimide layer serving as the release layer on the support base, wherein the step of forming the first polyimide layer includes incorporating in a polyamic acid solution an adhesion promoting agent for promoting adhesion between the release layer and the support base, and a release agent for achieving a peeling strength between the release layer and the flexible substrate that is less than a peeling strength between the first ...

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Номер записи: 63
06-02-2020 дата публикации

Cyanate ester based adhesive and method for producing cyanate ester based adhesive

Номер: US20200040238A1
Автор: Alfredo MÜLLER, Erika Zimmermann, Markus LÄPPLE, Stephan Buser
Принадлежит: NOLAX AG

A cyanate ester based adhesive comprising component A which has at least one cyanate ester with at least two OCN groups, and component B which comprises at least one catalyst for the trimerisation reaction of OCN groups to form a triazine ring. The catalyst is retained releasably on a carrier, particularly a pyrogenic silica.

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Номер записи: 64
16-02-2017 дата публикации

Poly(amic acid) composition and polyimide composition

Номер: US20170044321A1
Автор: Hiroaki Mori, Youhei Inoue
Принадлежит: JFE Chemical Corp

There is provided a polyimide composition that is useful for electronic substrate materials, retains high heat resistance and mechanical strength intrinsic to polyimides, and has a lower dielectric constant and dielectric loss tangent. A polyimide composition for use in electronic substrate materials, containing a polyimide produced by polymerization between a diamine component containing 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindan and an acid component containing 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride.

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Номер записи: 65
15-02-2018 дата публикации

ELECTRICAL TRACKING RESISTANCE COMPOSITIONS, ARTICLES FORMED THEREFROM, AND METHODS OF MANUFACTURE THEREOF

Номер: US20180044522A1
Автор: MEDIRATTA Gaurav, Ramalingam Hariharan, Sheth Kapil Chandrakant
Принадлежит:

A composition comprises, based on the total weight of the composition, 45 wt % to 75 wt % of a polyetherimide; and 20 wt % to 45 wt % of talc; and 5 wt % to 15 wt % of a fluorinated polymer; wherein the composition has a number of drops to tracking at 250 volts of greater than or equal to 50 drops according to ASTM D-3638-85. 4. The composition of claim 3 , wherein R is m-phenylene and Q is isopropylidene.5. The composition of claim 3 , whereinat least 50 mole percent (mol %) of the R groups are bis(3,4′-phenylene)sulfone, bis(3,3′-phenylene)sulfone, or a combination comprising at least one of the foregoing and the remaining R groups are p-phenylene, m-phenylene or a combination comprising at least one of the foregoing; and Z is 2,2-(4-phenylene)isopropylidene.6. The composition of claim 1 , wherein the fluorinated polymer comprises polytetrafluoroethylene.8. The composition of claim 7 , wherein the composition has:a tensile strength greater than or equal to 70 MPa determined according to ASTM D638;a tensile modulus of greater than or equal to 6500 GPa determined according to ASTM method D638, anda heat deflection temperature of greater than or equal to 200° C. measured on 3.2 millimeter injection molded bar at 1.82 MPa stress according to ASTM D648.10. The composition of claim 9 , wherein the composition has:a tensile strength greater than or equal to 40 MPa determined according to ASTM D638;a tensile modulus of greater than or equal to 11,000 GPa determined according to ASTM method D638, anda heat deflection temperature of greater than or equal to 210° C. measured on 3.2 millimeter injection molded bar at 1.82 MPa stress according to ASTM D648.11. The composition of claim 1 , further comprising an additive selected from a processing aid claim 1 , a heat stabilizer claim 1 , a dye claim 1 , a flame retardant claim 1 , or a combination comprising at least one of the foregoing.12. An insulating material comprising the composition of .13. An article selected from a ...

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Номер записи: 66
18-02-2016 дата публикации

METHOD FOR MANUFACTURING COMPOSITE BODY AND COMPOSITION

Номер: US20160049343A1
Автор: Kayaba Yasuhisa, Kohmura Kazuo, Mio Shigeru, Ono Shoko, Suzuki Tsuneji, Tanaka Hirofumi
Принадлежит: Mitsui Chemicals, Inc.

Provided is a method for manufacturing a composite body, the method containing: a composition preparation process of preparing a composition that contains a polymer having a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000, and that has a pH of from 2.0 to 11.0; a composite member preparation process of preparing a composite member that includes a member A and a member B, a surface of the member B having a defined isoelectric point, and that satisfies a relationship: the isoelectric point of a surface of the member B< the pH of the composition Подробнее

Номер записи: 67
14-02-2019 дата публикации

POLY(AMIDE-IMIDE) COPOLYMER, COMPOSITION FOR PREPARING POLY(AMIDE-IMIDE) COPOLYMER, ARTICLE INCLUDING POLY(AMIDE-IMIDE) COPOLYMER, AND DISPLAY DEVICE INCLUDING THE ARTICLE

Номер: US20190048144A1
Автор: CHAE Jungha, JU Kyeong-sik
Принадлежит:

A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, a dicarbonyl compound represented by Chemical Formula 3, and a tetracarboxylic acid dianhydride represented by Chemical Formula 4: 2. The poly(amide-imide) copolymer according to claim 1 , wherein in Chemical Formula 1 claim 1 , Lis a C1 to C20 alkylene group claim 1 , Rand Rare each independently F or Cl claim 1 , both a and b are 1 claim 1 , and c and d are each independently an integer ranging from 0 to 2.3. The poly(amide-imide) copolymer according to claim 1 , wherein in Chemical Formula 1 claim 1 , Lis methylene group claim 1 , both a and b are 1 claim 1 , and both c and d are 0.4. The poly(amide-imide) copolymer according to claim 1 , wherein the diamine represented by Chemical Formula 2 comprises a ring system comprising two C6 to C12 aromatic rings linked by a single bond claim 1 , wherein each of the two C6 to C12 aromatic rings are independently substituted by an electron-withdrawing group selected from a halogen atom claim 1 , a nitro group claim 1 , a cyano group claim 1 , a C1 or C2 haloalkyl group claim 1 , a C2 to C6 alkanoyl group claim 1 , or a C1 to C6 ester group.7. The poly(amide-imide) copolymer according to claim 1 , wherein in Chemical Formula 3 claim 1 , Ris a phenylene group claim 1 , and each X is independently Cl or Br.8. The poly(amide-imide) copolymer according to claim 1 , wherein the tetracarboxylic acid dianhydride represented by Chemical Formula 4 comprises at least one selected from 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-biphenyl tetracarboxylic dianhydride (BPDA) claim 1 , 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-diphenylsulfone tetracarboxylic dianhydride (DSDA) claim 1 , 4 claim 1 ,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) claim 1 , and 4 claim 1 ,4′-oxydiphthalic anhydride (ODPA).9. The poly(amide-imide) copolymer according to claim 1 , wherein the tetracarboxylic acid ...

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Номер записи: 68
14-02-2019 дата публикации

POLY(AMIDE-IMIDE) COPOLYMER, COMPOSITION FOR PREPARING POLY(AMIDE-IMIDE) COPOLYMER, ARTICLE INCLUDING POLY(AMIDE-IMIDE) COPOLYMER, AND DISPLAY DEVICE INCLUDING THE ARTICLE

Номер: US20190048145A1
Автор: CHAE Jungha, JU Kyeong-sik
Принадлежит:

A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, a dicarbonyl compound represented by Chemical Formula 3, and a tetracarboxylic acid dianhydride represented by Chemical Formula 4: 2. The poly(amide-imide) copolymer according to claim 1 , wherein in Chemical Formula 1 claim 1 , Lis a C1 to C20 alkylene group claim 1 , Rand Rare each independently F or Cl claim 1 , both a and b are 1 claim 1 , and c and d are each independently an integer ranging from 0 to 2.3. The poly(amide-imide) copolymer according to claim 1 , wherein in Chemical Formula 1 claim 1 , Lis methylene group claim 1 , both a and b are 1 claim 1 , and both c and d are 0.4. The poly(amide-imide) copolymer according to claim 1 , wherein the diamine represented by Chemical Formula 2 comprises a ring system comprising two C6 to C12 aromatic rings linked by a single bond claim 1 , wherein each of the two C6 to C12 aromatic rings are independently substituted by an electron-withdrawing group selected from a halogen atom claim 1 , a nitro group claim 1 , a cyano group claim 1 , a C1 or C2 haloalkyl group claim 1 , a C2 to C6 alkanoyl group claim 1 , or a C1 to C6 ester group.7. The poly(amide-imide) copolymer according to claim 1 , wherein in Chemical Formula 3 claim 1 , Ris a phenylene group claim 1 , and each X is independently Cl or Br.8. The poly(amide-imide) copolymer according to claim 1 , wherein the tetracarboxylic acid dianhydride represented by Chemical Formula 4 comprises at least one selected from 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-biphenyl tetracarboxylic dianhydride (BPDA) claim 1 , 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-diphenylsulfone tetracarboxylic dianhydride (DSDA) claim 1 , 4 claim 1 ,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) claim 1 , and 4 claim 1 ,4′-oxydiphthalic anhydride (ODPA).9. The poly(amide-imide) copolymer according to claim 1 , wherein the tetracarboxylic acid ...

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Номер записи: 69
14-02-2019 дата публикации

BENZOXAZINE BASED COPOLYMER AEROGELS

Номер: US20190048164A1
Автор: Sakalyte Asta, Salhi Fouad, Torres Cano Elisabet, Torres Sanglas Joaquim, Vega Fernandez Maria Lourdes, Zuniga Ruiz Camilo Javier
Принадлежит:

The present invention relates to a benzoxazine based copolymer aerogel obtained by reacting a benzoxazine monomer or oligomer and a comonomer selected from the group consisting of an isocyanate compound, a cyclic ether compound and an acid anhydride compound in a presence of a catalyst and a solvent, wherein said catalyst is an optional ingredient when said comonomer is an acid anhydride compound or an isocyanate compound. Benzoxazine based copolymer aerogel according to the present invention provides high thermal insulation material, while good mechanical properties and performance is maintained. 1. A benzoxazine based copolymer aerogel obtained by reacting a benzoxazine monomer or oligomer and a comonomer selected from the group consisting of an isocyanate compound , a cyclic ether compound and an acid anhydride compound in a presence of a catalyst and a solvent , wherein said catalyst is an optional ingredient when said comonomer is an acid anhydride or an isocyanate compound.2. A benzoxazine based copolymer aerogel according to claim 1 , wherein said benzoxazine monomer has a functionality from 1 to 4 claim 1 , and said isocyanate compound has a functionality from 1 to 6 claim 1 , or said cyclic ether compound has a functionality from 1 to 5 claim 1 , or said acid anhydride compound has a functionality from 1 to 2.4. A benzoxazine based copolymer aerogel according to claim 1 , wherein said isocyanate compound is an aromatic isocyanate compound or an aliphatic isocyanate compound claim 1 ,6. A benzoxazine based copolymer aerogel according to claim 1 , wherein said cyclic ether compound is an epoxy compound or an oxetane compound.9. A benzoxazine based copolymer aerogel according to claim 1 , wherein said solvent is a polar solvent or a polar aprotic solvent.10. A benzoxazine based copolymer aerogel according to claim 1 , wherein said solvent is selected from the group consisting of dimethylsulfoxide claim 1 , dimethylformamide claim 1 , dimethylacetamide claim 1 ...

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Номер записи: 70
14-02-2019 дата публикации

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing Flat Inorganic Particle Fillers and Method of Use

Номер: US20190048238A1
Автор: Fraivillig James B.
Принадлежит:

A compound and method of use thereof consisting of an A-staged thermoplastic-polyimide (TPI) adhesive, a viscous uncured liquid of polyamic-acid polymer (PAA), the TPI precursor, synthesized and dissolved in a polar aprotic organic solvent, and including, as appropriate, combinations of flat particulate inorganic ceramic and/or metallic electrically insulating, and/or electrically conducting, and/or thermally conducting fillers for interface-bonding to create a robust joint between surfaces with conventional lamination processes that utilize relatively moderate temperatures and applied pressures, such particles resulting in the reduction of the occurrence and size of gas voids within the adhesive bondline. 1. The process of reducing the occurrence and size of gas voids in a bondline formed by the thermoplastic polyimide adhesive interface bonding of two surfaces , said process comprising in combination: 1. a quantity of polar aprotic organic solvent;', '2. a quantity of TPI precursor polyamic-acid polymer (PAA) synthesized and dissolved in said solvent wherein said polyamic-acid polymer comprises a mixture of diamine and dianhydride monomers, said monomers selected, in combination, to result in a thermoplastic polyimide having the characteristic of being insoluble in an organic solvent in the fully imidized, fully cured state, and', '3. a quantity of flat particulate filler; said filler comprising an inorganic material having a particle size of between 0.1 and 2.0 um in thickness, and 1.0 and 20.0 um in width and wherein the width of said particles is greater than the thickness;, 'A. providing an adhesive solution consisting of an A-staged uncured thermoplastic-polyimide (TPI) solution, said thermoplastic polyimide having the characteristic of being insoluble in an organic solvent in the fully imidized, fully cured state, in the form of a viscous liquid solution containing in combinationB. applying said uncured solution to at least one of said surfaces;C. applying ...

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Номер записи: 71
25-02-2016 дата публикации

CURABLE MIXTURES BASED ON XYLYLENE BISMALEIMIDE

Номер: US20160053054A1
Автор: Evsyukov Sergey, Pohlmann Tim, Stenzenberger Horst
Принадлежит:

The invention relates to a curable mixture comprising: RM % of m-xylylene bismaleimide of formula (I) 119-. (canceled)23. Curable mixture according to claim 20 , wherein the comonomer component consists of at least one comonomer selected from: 3 claim 20 ,3′-diallylbisphenol A claim 20 , diallyl ether of bisphenol A claim 20 , bis-(o-propenylphenoxy)benzophenone claim 20 , m-aminobenzhydrazide claim 20 , bisphenol A dicyanate ester claim 20 , diallyl phthalate claim 20 , triallyl isocyanurate claim 20 , triallyl cyanurate claim 20 , styrene claim 20 , and divinylbenzene.26. Curable mixture according to claim 20 , wherein the polyimide component consists of at least one polyimide selected from 4 claim 20 ,4′-bismaleimidodiphenylmethane claim 20 , bis(3-methyl-5-ethyl-4-maleimidophenyl)methane claim 20 , bis(3 claim 20 ,5-dimethyl-4-maleimidophenyl)methane claim 20 , 4 claim 20 ,4′-bismaleimidodiphenyl ether claim 20 , 4 claim 20 ,4′-bismaleimidodiphenylsulfone claim 20 , 3 claim 20 ,3′-bismaleimidodiphenylsulfone claim 20 , bismaleimidodiphenylindane claim 20 , 2 claim 20 ,4-bismaleimidotoluene claim 20 , 2 claim 20 ,6-bismaleimidotoluene claim 20 , 1 claim 20 ,3-bismaleimidobenzene claim 20 , 1 claim 20 ,2-bismaleimidobenzene claim 20 , 1 claim 20 ,4-bismaleimidobenzene claim 20 , 1 claim 20 ,2-bismaleimidoethane claim 20 , 1 claim 20 ,6-bismaleimidohexane claim 20 , 1 claim 20 ,6-bismaleimido-(2 claim 20 ,2 claim 20 ,4-trimethyl)hexane claim 20 , 1 claim 20 ,6-bismaleimido-(2 claim 20 ,4 claim 20 ,4-trimethyl)hexane claim 20 , 1 claim 20 ,4-bismaleimidocyclohexane claim 20 , 1 claim 20 ,3-bis(maleimidomethyl)cyclohexane claim 20 , 1 claim 20 ,4-bis(maleimidomethyl)cyclohexane claim 20 , and 4 claim 20 ,4′-bismaleimidodicyclohexylmethane.27. Curable mixture according to claim 20 , whereinRM % is defined as 5 wt % to 70 wt %;RP % is defined as 1 wt % to 60 wt %; andRC % is defined as 20 wt % to 80 wt %.28. Curable mixture according to claim 20 , further comprisinga ...

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Номер записи: 72
25-02-2016 дата публикации

Polyetherimide Composition

Номер: US20160053117A1
Автор: David A. McIlroy, Kamlesh P. Nair, Syed Mazahir
Принадлежит: Ticona LLC

A polymer composition that contains a polyetherimide and a liquid crystalline polymer that includes repeating units derived from naphthenic hydroxycarboxylic acids, naphthenic dicarboxylic acids, or a combination thereof in an amount of more than about 15 mol. % of the polymer is provided.

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Номер записи: 73
25-02-2016 дата публикации

Composition Containing a Polyetherimide and Low Naphthenic Liquid Crystalline Polymer

Номер: US20160053118A1
Автор: Mazahir Syed, McIlroy David A., Nair Kamlesh P.
Принадлежит:

A polymer composition that comprises from about 1 to about 60 parts of at least one liquid crystalline polymer and 100 parts of at least one polyetherimide is provided. The liquid crystalline polymer includes repeating units derived from naphthenic hydroxycarboxylic acids, naphthenic dicarboxylic acids, or a combination thereof in an amount of about 15 mol. % or less of the polymer. 1. A polymer composition comprising from about 1 to about 60 parts of at least one liquid crystalline polymer and 100 parts of at least one polyetherimide , wherein the liquid crystalline polymer includes repeating units derived from naphthenic hydroxycarboxylic acids , naphthenic dicarboxylic acids , or a combination thereof in an amount of about 15 mol. % or less of the polymer , and wherein the polymer composition exhibits a tensile break stress of about 85 MPa or more , as determined according to ISO Test No. 527 at a temperature of 23° C.2. The polymer of claim 1 , wherein the repeating units derived from naphthenic hydroxycarboxylic acids claim 1 , naphthenic dicarboxylic acids claim 1 , or a combination thereof constitute about 8 mol. % or less of the liquid crystalline polymer.3. The polymer composition of claim 1 , wherein the liquid crystalline polymer comprises repeating units derived from 4-hydroxybenzoic acid.4. The polymer composition of claim 3 , wherein the liquid crystalline polymer further comprises repeating units derived from terephthalic acid claim 3 , isophthalic acid claim 3 , or a combination thereof.5. The polymer composition of claim 4 , wherein the monomer units derived from 4-hydroxybenzoic acid constitute from about 40 mol. % to about 95 mol. % of the polymer claim 4 , the monomer units derived from terephthalic acid constitute from about 1 mol. % to about 30 mol. % of the polymer claim 4 , and the monomer units derived from isophthalic acid constitute from about 1 mol. % to about 30 mol. % of the polymer.6. The polymer composition of claim 4 , wherein the ...

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Номер записи: 74
25-02-2021 дата публикации

POLYIMIDES FOR TEMPORARY BONDING ADHESIVES, METHODS FOR MANUFACTURING OF THERMOPLASTIC POLYIMIDE MATERIALS, AND METHODS FOR THIN WAFER BONDING USING THE SAME

Номер: US20210054147A1
Автор: Furutani Hiroyuki, Kyran Samuel
Принадлежит: Kaneka Americas Holding, Inc.

Methods may include coating a substrate with a polyimide precursor composition prepared from a reaction of a diamine component and a dianhydride component, wherein the reaction includes: a diamine component containing one or more diamines having the formula: wherein R3 is selected from hydrogen, methyl, and halogen; a dianhydride component containing one or more dianhydrides, wherein the one or more dianhydrides include 4,4′-bisphenol A dianhydride (BPADA); and at least one comonomer selected from: one or more additional diamine comonomers, wherein the one or more additional diamine comonomers are present at 1 to 40 mol % of the diamine component; and/or one or more additional dianhydride comonomers, wherein the one or more additional dianhydride comonomers are present at 1 to 40 mol % of the dianhydride component; and curing the polyimide precursor composition to generate a polyimide adhesive on the substrate. 2. The method of claim 1 , further comprising affixing a device wafer to the polyimide adhesive.3. The method of claim 2 , further comprising removing the polyimide adhesive from the device wafer using a polar solvent.4. The method of claim 1 , wherein the polyimide precursor composition comprises 50 to 95 wt % of a polar solvent.5. The method of claim 1 , wherein the one or more additional diamine comonomers are selected from a group consisting of 2-bis[2-(4-aminophenoxy)ethoxy]ethane (DA3EG) claim 1 , 1 claim 1 ,3-bis(4-aminophenoxy) propane (DA3MG) claim 1 , 1 claim 1 ,5-bis(4-aminophenoxy) pentane (DASMG) claim 1 , polydimethyl siloxane (PDMS) claim 1 , and 1 claim 1 ,6-hexamethylenediamine (HMD); and wherein the molar ratio the one or more additional diamine comonomers in the diamine component is in the range of 0.1 to 0.40.6. The method of claim 1 , wherein the one or more additional dianhydride comonomers are selected from a group consisting of pyromellitic dianhydride (PMDA) claim 1 , biphenyl-3 claim 1 ,4 claim 1 ,3′ claim 1 ,4′-tetracarboxylic ...

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Номер записи: 75
13-02-2020 дата публикации

SUBSTRATE LAMINATED BODY AND METHOD OF MANUFACTURING SUBSTRATE LAMINATED BODY

Номер: US20200048515A1
Автор: KAMADA Jun, Kayaba Yasuhisa, Kohmura Kazuo
Принадлежит: Mitsui Chemicals, Inc.

A body, comprising stacked substrates, wherein: a first substrate, an adhesion layer comprising a reaction product of a compound (A), which has a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and which has a defined weight average molecular weight, and a crosslinking agent (B), which has three or more —C(═O)OX groups in a molecule, in which from one to six of the three or more —C(═O)OX groups are —C(═O)OH groups and which has a weight average molecular weight of from 200 to 600, X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms, and a second substrate, are layered in this order, and the compound (A) comprises at least one selected from the group consisting of a defined aliphatic amine and a defined compound having a siloxane bond and an amino group. 1. A body , comprising stacked substrates , wherein:a first substrate,an adhesion layer comprising a reaction product of a compound (A), which has a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and which has a weight average molecular weight of from 90 to 400,000, and a cross-linking agent (B), which has three or more —C(═O)OX groups in a molecule, in which from one to six of the three or more —C(═O)OX groups are —C(═O)OH groups and which has a weight average molecular weight of from 200 to 600, X being a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms, anda second substrate,are layered in this order, andthe compound (A) comprises at least one selected from the group consisting of an aliphatic amine having a weight average molecular weight of from 10,000 to 400,000 and a compound having a siloxane bond (Si—O bond) and an amino group and having a weight average molecular weight of from 130 to 10,000.2. The body claim 1 , comprising stacked substrates claim 1 , according to claim 1 , wherein the adhesion layer has a thickness of from 0.1 nm to 5 claim 1 ,000 nm.3. The ...

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Номер записи: 76
23-02-2017 дата публикации

FIBER OPTIC CONNECTOR SUB-ASSEMBLIES AND RELATED METHODS

Номер: US20170052328A1
Автор: Baca Adra Smith, Burt Rebecca Lynn, Danley Jeffrey Dean, Miller Darrin Max, Morrison Dennis Craig
Принадлежит:

A fiber optic connector sub-assembly includes a ferrule having a front end, a rear end, and a ferrule bore extending between the front and rear ends along a longitudinal axis. The fiber optic connector sub-assembly also includes a bonding agent disposed in the ferrule bore and having first and second ends along the longitudinal axis. The bonding agent has been melted and solidified at the first and second ends. 1. A fiber optic connector sub-assembly , comprising:a ferrule having a front end, a rear end, and a ferrule bore extending between the front and rear ends along a longitudinal axis; anda bonding agent disposed in the ferrule bore and having first and second ends along the longitudinal axis, wherein the bonding agent has been melted and solidified at the first and second ends.2. The fiber optic connector sub-assembly of claim 1 , wherein the at least a portion of the bonding agent between the first and second ends has not been melted and solidified.3. The fiber optic connector sub-assembly of claim 2 , wherein the at least a portion of the bonding agent between the first and second ends has not been melted and solidified comprises a powdered material.4. The fiber optic connector sub-assembly of claim 3 , wherein the powdered material comprises particles of the bonding agent claim 3 , the particles having an average size between about 5% and about 10% of a minimum diameter of the ferrule bore.5. The fiber optic connector sub-assembly of claim 2 , wherein the bonding agent that has been melted and solidified has a density between about 1.0 g/cc and about 1.5 g/cc claim 2 , and further wherein the at least a portion of the bonding agent between the first and second ends that has not been melted and solidified has a bulk density that is less than 1.0 g/cc.6. The fiber optic connector sub-assembly of claim 2 , wherein the bonding agent that has been melted and solidified has a density between about 1.3 g/cc and about 1.4 g/cc claim 2 , and further wherein the at ...

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Номер записи: 77
26-02-2015 дата публикации

Robust Interface Bonding with B-staged Thermoplastic Polyimide Adhesive

Номер: US20150057396A1
Автор: Fraivillig James B.
Принадлежит:

Thermoplastic Polyimide (TPI) polymer adhesive coated laminating film in which the TPI coating is under cured or B-staged as well as the process for preparing the film is disclosed. 1. A heat activated thermoplastic laminating film for joining two surfaces comprising in combination:A. a substrate; and i. a solvent; and', 'ii. a mixture of polyamic-acid polymer and thermoplastic polyimide polymer solids disposed in said solvent, said mixture containing no greater than 50% thermoplastic polyimide of the total polymer mass and said mixture further containing an amount of solvent of between 20 and 60% of the total mass of the mixture., 'B. a heat activated thermoplastic adhesive coated on said substrate, said adhesive comprising in combination2. The laminating film of wherein said solvent is selected from the group consisting of NMP and DMAC.3. The laminating film of wherein said polyamic-acid polymer comprises a mixture of diamine and dianhydride monomers claim 1 , said diamine monomer is selected from the group consisting of DABA claim 1 , 3 claim 1 ,3′-DABP claim 1 , 3 claim 1 ,4′-DABP claim 1 , RDEDA claim 1 , TPER claim 1 , 3 claim 1 ,4′-ODA claim 1 , 4 claim 1 ,4′-ODA claim 1 , 4 claim 1 ,4′-MDA claim 1 , an aliphatic diamine claim 1 , and a silicon-diamine; and said dianhydride monomer is selected from the group consisting of APD claim 1 , BPDA claim 1 , BTDA claim 1 , ODPA claim 1 , PMDA claim 1 , and 6FDA.4. The process of fabricating a heat activated thermoplastic laminating film for joining two surfaces comprising in combination the steps of:A. providing a substrate;B. providing a solvent;C. providing a quantity of polyamic-acid polymer diamine and dianhydride constituent monomers;D. adding said monomers to said solvent to create a polyamic-acid solution coating bath;E. providing a gravure coating roller arranged to rotate through said bath and hold a quantity of said polyamic-acid solution on its surface;F. passing said substrate in contact with said surface ...

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Номер записи: 78
01-03-2018 дата публикации

Ionically Crosslinked Polyelectrolytes as Underwater Adhesives and Controlled Release Vehicles

Номер: US20180055942A1
Автор: Huang Yan, Lapitsky Yakov
Принадлежит: The University of Toledo

Underwater adhesive materials, methods of making the same, and methods of using the same are described. 1. A method for controllably releasing a small molecule comprising:adding a small molecule to either (i) a first solution comprising non-polysaccharide polymer having two or more amine groups, or (ii) a second solution comprising a multivalent phosphate crosslinker;mixing the first solution with the second solution, at a pH ranging from about 4 to about 10, to form an adhesive gel; andapplying the adhesive gel to a target location, wherein the small molecule is released from the adhesive gel over a period of time.2. A method of delivering an adhesive to a target location comprising:mixing a polyamine with a multivalent phosphate crosslinker in acidic or basic solution to obtain a mixture;injecting the mixture to a target location; andadjusting the pH of the mixture to ambient pH to form an adhesive gel-like complex in the target location.3. The method of claim 2 , further comprising adjusting the pH to an acidic or basic pH to dissolve the adhesive gel.4. A method of delivering an adhesive to a target location comprising:mixing a polyamine with a multivalent phosphate crosslinker in a solution to obtain a mixture;injecting the mixture to a target location; andadjusting the ionic strength of the solution to form an adhesive gel-like complex in the target location.5. The method of claim 4 , further comprising adjusting the pH to an acidic or basic pH to dissolve the adhesive gel.6. A composition comprising:a non-polysaccharide polymer having two or more amine groups; anda multivalent phosphate crosslinker;the composition comprising an ionically crosslinked network that forms a gel-like coacervate at a pH in the range of from about 4 to about 10.7. The composition of claim 6 , wherein the multivalent phosphate crosslinker is selected from the group consisting of a tetravalent phosphate and a pentavalent phosphate.8. The composition of claim 6 , wherein the ...

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Номер записи: 79
05-03-2015 дата публикации

COLORED POLYIMIDE FILM AND METAL LAMINATE STRUCTURE INCLUDING THE POLYIMIDE FILM

Номер: US20150064484A1
Автор: Chung Wen-Hsuan, Lee Mei-Hui
Принадлежит: Taimide Technology Incorporation

A colored polyimide film includes a polyimide polymer obtained by reacting diamine monomers with dianhydride monomers, wherein the diamine monomers are oxydianiline (ODA) and phenylene diamine (PDA) monomers, and the dianhydride monomers are pyromellitic dianhydride (PMDA); a matting agent comprised of polyimide particles; and one or more color pigment. The polyimide films described herein have low gloss, low transparency, and low coefficient of thermal expansion. 1. A base film comprising:a polyimide polymer obtained by reacting diamine monomers with dianhydride monomers, the diamine monomers being oxydianiline (ODA) and phenylene diamine (PDA) monomers, and the dianhydride monomers being pyromellitic dianhydride (PMDA);a matting agent comprised of polyimide particles; andone or more color pigments.2. The base film according to claim 1 , wherein a diamine molar ratio of ODA:PDA is about 0.9:0.1 to about 0.5:0.5.3. The base film according to claim 1 , wherein the matting agent is present in an amount between about 4 and about 15 wt % based on the total weight of the base film.4. The base film according to claim 1 , wherein the color pigment is selected from a group consisting of a red pigment claim 1 , a white pigment and a black pigment.5. The base film according to claim 1 , wherein the color pigment contains a red pigment and a white pigment claim 1 , and the red pigment is present in an amount between about 6 and about 15 wt % based on the total weight of the film.6. The base film according to claim 5 , wherein the white pigment is present in an amount between about 10 and about 22 wt % based on the total weight of the film.7. The base film according to claim 1 , wherein the color pigment contains a black pigment that is present in an amount between about 3 and about 8 wt % based on the total weight of the film.8. The base film according to claim 1 , having a 60° gloss equal to or lower than 15 claim 1 , a coefficient of thermal expansion (CTE) equal to or lower ...

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Номер записи: 80
29-05-2014 дата публикации

Gas Separation Membrane

Номер: US20140144325A1
Автор: SUDA Takeshi, UOYAMA Hiroki, YAMANAKA Kazuhiro
Принадлежит:

A gas separation membrane having a polyimide structure. The polyimide structure is provided to contain a repeating unit represented by general formula (1): 7. A gas separation membrane as claimed in claim 1 , wherein a hydrogen atom of —OH group that a HFIP group contained in Rhas is substituted with a glycidyl group.8. A gas separation membrane as claimed in claim 7 , wherein the glycidyl group forms crosslinking in a manner that its cyclic ether moiety is opened.9. A gas separation membrane as claimed in claim 1 , obtained by being mixed with an epoxy compound and then heated.12. A cured product comprising:{'claim-ref': {'@idref': 'CLM-00011', 'claim 11'}, 'a polyimide having a glycidyl group, as claimed in ,'}wherein the glycidyl group forms crosslinking in a manner that its cyclic ether moiety is opened.13. A cured product comprising:{'claim-ref': {'@idref': 'CLM-00011', 'claim 11'}, 'a polyimide as claimed in ; and'}an epoxy compound,wherein the cured product is obtained by mixing the polyimide with the epoxy compound and then by heating it. The present invention relates to a gas separation membrane.From long ago, the separation of gas using a gas separation membrane has attracted attention as being a simple and facilitative technique capable of separating a mixture gas continuously while maintaining a gaseous state, the technique not involving a phase change. The separation of gas is a technique for selectively separating a gas with the aid of the presence or absence of permeation and the differences in permeation rate according to the kind of gas (hereinafter, sometimes referred to as gas) which is to permeate through a gas separation membrane.As materials for the gas separation membrane, there have been known some polymers such as cellulose acetate, polysulfone, polyimide and the like. Of these, polyimide is known as a material having a strength suitable for being used for a gas separation membrane, resistant to breakage, and excellent in heat resistance so ...

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Номер записи: 81
10-03-2016 дата публикации

ADHESIVE COMPOSITION AND ARTICLE INCLUDING THE SAME

Номер: US20160068726A1
Автор: Hable Christopher T., Snyder Desiree Nicole
Принадлежит:

An adhesive composition (“composition”) comprises an epoxy resin, a binder, and a curing agent. Typically, the composition further comprises an aqueous solvent (e.g. water) such that the composition can be referred to as an aqueous adhesive composition. The epoxy resin is typically encapsulated to prevent premature cure of the composition. After rupture of the encapsulated epoxy resin, the composition cures to form an adhesive. The composition is useful for articles such as fasteners (e.g. nuts and bolts) such that it can be referred to as a fastener adhesive. Typically, the composition is disposed on a threaded surface of the fastener. The fastener can be used for an assembly in which the composition generally cures after installation of the fastener. To make the fastener, the adhesive composition can be applied on the threaded surface. After application, the composition can be dried in instances where the composition still includes the aqueous solvent. 1. An adhesive composition for forming an adhesive , said adhesive composition comprising:an epoxy resin;a binder;a curing agent different from said binder; andwherein at least one of said epoxy resin or curing agent is encapsulated.2. The adhesive composition as set forth in claim 1 , wherein said curing agent comprises at least one of a tertiary aromatic amine claim 1 , an aromatic amine claim 1 , or a tertiary amine.3. The adhesive composition as set forth in claim 1 , wherein said curing agent is a tertiary aromatic amine.4. The adhesive composition as set forth in claim 3 , wherein said tertiary aromatic amine is 2 claim 3 ,4 claim 3 ,6-tris(dimethylaminomethyl)phenol.5. The adhesive composition as set forth in claim 1 , wherein said curing agent comprises 1 claim 1 ,3-Bis[3-(dimethylamino)propyl]urea.6. The adhesive composition as set forth in claim 1 , wherein said curing agent is present in an amount of from about 1 to about 30 parts by weight based on 100 parts by weight of said adhesive composition.7. The ...

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Номер записи: 82
27-02-2020 дата публикации

POLYARYLETHER KETONE IMIDE ADHESIVES

Номер: US20200062905A1
Автор: Bogucki Gregg R., Childers Christopher H., HEINZ Stephen R., STEINMAN Christopher S.
Принадлежит:

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formula (IV): 2. The method of claim 1 , wherein introducing the aluminum chloride into the reactor comprises introducing the aluminum chloride into the reactor at a temperature of about −10° C. claim 1 , followed by allowing a temperature of the composition to increase to about 10° C. claim 1 , followed by cooling the composition to a temperature of about −10° C.3. The method of claim 1 , further comprising introducing a solvent into the reactor claim 1 , wherein the composition comprises the solvent.4. The method of claim 3 , wherein the solvent is selected from the group consisting of o-dichlorobenzene claim 3 , dichloromethane claim 3 , dichloroethane claim 3 , and mixture(s) thereof.5. The method of claim 3 , wherein introducing the solvent is performed by preheating the solvent before introducing the solvent into the reactor.6. The method of claim 5 , wherein preheating is performed at a temperature of from about 160° C. to about 190° C.7. The method of claim 1 , wherein mixing is performed at a temperature of from about −30° C. to about 25° C.8. The method of claim 1 , wherein obtaining the polymer comprises introducing water and ammonia to the composition.10. The method of claim 9 , wherein the molecular weight of the polymer is from about 90 kDa to about 110 kDa.11. The method of claim 9 , wherein the polymer is a random copolymer.12. The method of claim 9 , wherein the polymer is a block copolymer.14. The method of claim 13 , wherein the molecular weight of the polymer is from about 90 kDa to about 110 kDa.15. The method of claim 13 , wherein the polymer is a random copolymer.16. The method of claim 13 , wherein the polymer is a block copolymer.17. The method of claim 13 , wherein the adherend is selected from the group consisting of a thermoset composite claim 13 , a thermoplastic composite claim 13 ...

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Номер записи: 83
27-02-2020 дата публикации

COMPOSITION, ADHESIVE, SINTERED BODY, JOINED BODY, AND METHOD OF PRODUCING JOINED BODY

Номер: US20200063008A1
Автор: MATSUURA Yoshitsugu, SAKAIRI Yoko, Takeuchi Masaki, UENO Fumitaka, Yamagishi Hideaki
Принадлежит:

A composition includes metal particles capable of transient liquid phase sintering and a polyamide imide resin. 1. A composition , comprising:metal particles capable of transient liquid phase sintering; anda polyamide imide resin.2. The composition according to claim 1 , wherein the metal particles comprise first metal particles containing Cu and second metal particles containing Sn.3. The composition according to claim 1 , wherein a mass ratio of the metal particles with respect to total solid content is 80% by mass or more.4. The composition according to claim 1 , wherein the polyamide imide resin has an elastic modulus of from 0.01 GPa to 1.0 GPa at 25° C.5. The composition according to claim 1 , wherein the polyamide imide resin comprises at least one of a polyalkylene oxide structure or a polysiloxane structure.9. The composition according to claim 1 , wherein the polyamide imide resin comprises a structural unit derived from a diimide carboxylic acid or a derivative thereof and a structural unit derived from an aromatic diisocyanate or an aromatic diamine.18. The composition according to claim 10 , wherein a total proportion of the structural unit represented by Formula (4) and the structural unit represented by Formula (5) with respect to the structural unit derived from a diimide carboxylic acid or a derivative thereof is 60 mol % or more.19. An adhesive claim 1 , comprising the composition according to .20. A sintered body claim 1 , produced using the composition according to .21. A joined body claim 20 , comprising an element and a support member that are joined via the sintered body according to .22. A method of producing a joined body claim 20 , the method comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'providing the composition according to to at least one of a portion of a support member to which an element is to be joined, or a portion of the element to which the support member is to be joined, so as to form a composition layer;'} ...

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Номер записи: 84
12-03-2015 дата публикации

Adhesive sheet for production of semiconductor device with bump electrode, and method for production of semiconductor device

Номер: US20150072477A1
Автор: Kazuyuki Matsumura, Koichi Fujimaru, Toshihisa Nonaka
Принадлежит: TORAY INDUSTRIES INC

An adhesive sheet for production of a semiconductor device with bump electrode, including a soft film and an alkali-soluble adhesive film formed on the soft film is capable of exposing the bump electrode without imparting damage to the bump electrode, and then wet etching of an adhesive on bump tops using an aqueous alkali solution makes it possible to put into a state where no adhesive exists on the bump tops, thus enabling the production of a semiconductor device which is excellent in connection reliability after flip chip packaging.

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Номер записи: 85
28-02-2019 дата публикации

ANTI-FOULING AND SPECIFIC BINDING SURFACE, DISPERSIONS COMPRISING PARTICLES HAVING SUCH SURFACES, AND METHODS OF MAKING THESE

Номер: US20190066891A1
Автор: DIAS Aylvin, Qiu Jun, VAN DEN BOSCH Edith, ZONG MengMeng
Принадлежит:

Disclosed are anti-fouling and optionally specific binding surfaces, methods for forming anti-fouling and optionally specific binding surfaces, and molecules that may be useful for forming anti-fouling and optionally specific binding surfaces. The surfaces may be formed by employing a molecule comprising a poly(2-oxazoline) having functional groups. In an embodiment, the poly(2-oxazoline) comprises a carboxyl endgroup, an amine endgroup, an N-hydroxysuccinimide endgroup, an oxirane endgroup, an oxetane endgroup, or an isocyanate endgroup, which may enable attachment of a specific binding moiety to the poly(2-oxazoline). In an embodiment, the poly(2-oxazoline) molecule comprises a (meth)acrylate functionality that may allow for attachment to a surface comprising a moiety capable of nucleophilic conjugate addition. 1. A method of attaching a polymer chain to a surface comprising the steps ofa. providing a surface comprising a moiety capable of nucleophilic conjugate addition,b. providing a poly(2-oxazoline) compound having at least one endgroup selected from a (meth)acrylate, (meth)acrylamide, and a thioester group,c. reacting the endgroup of the poly(2-oxazoline) compound with the moiety capable of nucleophilic conjugate addition, thereby forming via a conjugate addition reaction a polymer chain attached to the surface.3. The method according to claim 2 , wherein Rcomprises a hydroxyl endgroup claim 2 , a carboxyl endgroup claim 2 , an amine endgroup claim 2 , an N-hydroxysuccinimide endgroup claim 2 , an oxirane endgroup claim 2 , an oxetane endgroup claim 2 , or an isocyanate endgroup.4. The method according to claim 3 , further comprising the step ofd. attaching a specific binding moiety to the polymer chain via the hydroxyl, carboxyl, amine, N-hydroxysuccinimide, oxirane, oxetane, or isocyanate endgroup.6. The method according to claim 2 , wherein Rcomprises a tert-butyl carbamate claim 2 , a benzyl carbamate claim 2 , a phthalimide claim 2 , ap- ...

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Номер записи: 86
19-03-2015 дата публикации

SEALING RESIN, SEMICONDUCTOR DEVICE, AND PHOTOCOUPLER

Номер: US20150076524A1
Автор: Ikedo Yuichi, Inoue Kayo, MURANAKA Tetsuya
Принадлежит: KABUSHIKI KAISHA TOSHIBA

A semiconductor device includes: a sealing resin and a semiconductor element. The sealing resin includes a base resin and a curing agent. The base resin includes isocyanuric acid having an epoxy group. The curing agent includes an acid anhydride having an acid anhydride group. A mole ratio of the acid anhydride group to the epoxy group is not less than 0.67 and not more than 0.8. A semiconductor element is covered with the sealing resin. 1. A semiconductor device , comprising:a sealing resin including a base resin and a curing agent, the base resin including isocyanuric acid having an epoxy group, the curing agent including an acid anhydride having an acid anhydride group, a mole ratio of the acid anhydride group to the epoxy group being not less than 0.67 and not more than 0.8; anda semiconductor element covered with the sealing resin.2. The semiconductor device according to claim 1 , wherein the semiconductor element includes a light emitting element or a light receiving element.3. The semiconductor device according to claim 2 , whereinthe isocyanuric acid includes 1,3,5-tris(2,3-epoxypropyl)isocyanuric acid, andthe acid anhydride includes isomethyltetrahydrophthalic anhydride.4. A photocoupler claim 2 , comprising:a sealing resin including a base resin and a curing agent, the base resin including isocyanuric acid having an epoxy group, the curing agent including an acid anhydride having an acid anhydride group, a mole ratio of the acid anhydride group to the epoxy group being not less than 0.67 and not more than 0.8;a light emitting element configured to be driven by an input electrical signal, the sealing resin being provided around the light emitting element; anda light receiving element configured to convert light emitted by the light emitting element into an electrical signal and output the electrical signal, the sealing resin being provided around the light receiving element.5. The photocoupler according to claim 4 , whereinthe isocyanuric acid includes 1,3, ...

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Номер записи: 87
17-03-2016 дата публикации

BLOCK POLYIMIDE, BLOCK POLYAMIDE ACID IMIDE AND USE THEREOF

Номер: US20160075830A1
Автор: Fukukawa Kenichi, Okazaki Masaki, Okubo Atsushi, Sakata Yoshihiro, Urakami Tatsuhiro
Принадлежит: Mitsui Chemicals, Inc.

The purpose of the present invention is to provide a block polyamide acid imide having an appropriate solubility in aqueous alkaline solutions, and block polyimides that are obtained using same and have high transparency and a low coefficient of linear thermal expansion (low CTE). This block polyimide comprises blocks configured from repeating structural units represented by formula (1A) and blocks configured from repeating structural units represented by formula (1B). 2. The block polyimide according to claim 1 , wherein the average values of m and n each independently are 2 to 1 claim 1 ,000.4. The block polyimide according to having a logarithmic viscosity of 0.1 to 3.0 dl/g claim 1 , the logarithmic viscosity being measured in a mixed solvent of p-chlorophenol/phenol=9:1 (weight ratio) at a concentration of 0.5 g/dl and at 35° C.5. The block polyimide according to claim 1 , wherein a film of the block polyimide has a glass transition temperature (Tg) of 260° C. or more as measured by TMA method under a tensile mode at a temperature range of 25° C. to 350° C. claim 1 , a temperature-raising rate of 5° C./min. claim 1 , and a load of 14 g/mm.6. The block polyimide according to claim 1 , wherein the film of the block polyimide has a coefficient of linear thermal expansion of 30 ppm/K or less as measured by TMA method under a tensile mode at a temperature range of 25° C. to 350° C. claim 1 , a temperature-raising rate of 5° C./min. claim 1 , and a load of 14 g/mm.7. The block polyimide according to claim 1 , wherein the film of the block polyimide has a total light transmittance of 80% or more as measured in accordance with JIS K 7105.9. The block polyamic acid imide according to claim 8 , wherein the average values of m and n each independently are 2 to 1 claim 8 ,000.10. The block polyamic acid imide according to claim 8 , wherein a polyimide composed of the repeating structural units represented by formula (2B) is soluble in an aprotic polar solvent.11. The block ...

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Номер записи: 88
19-03-2015 дата публикации

POLYETHERIMIDES, METHODS OF MANUFACTURE, AND ARTICLES FORMED THEREFROM

Номер: US20150079376A1
Автор: Kuhlman Matthew L.
Принадлежит:

A polyetherimide composition comprising a polyetherimide manufactured by reaction of an alkali metal salt of a dihydroxy aromatic compound with a bis(halophthalimide) composition comprising, based on the weight of the bis(halophthalimide) composition, at least 15 wt. % of a 3,3′-bis(halophthalimide) of the formula 2. The composition of claim 1 , wherein the bis(halophthalimide) composition comprises from more than 47 wt. % to less than 85 wt. % of the 4 claim 1 ,3′-bis(halophthalimide).3. The composition of claim 1 , wherein the bis(halophthalimide) composition comprisesfrom 15 to less than 85 wt. % of the 3,3′-bis(halophthalimide),from more than 47 to less than 85 wt. % of the 4,3′-bis(halophthalimide), andfrom more than 0 to less than 27 wt. % of the 4,4′-bis(halophthalimide).5. The composition of claim 1 , wherein Z is 2 claim 1 ,2-(4-phenylene)isopropylidene and R is m-phenylene claim 1 , p-phenylene diarylsulfone claim 1 , or a combination thereof.6. The composition of claim 1 , further comprising an additive selected from impact modifiers claim 1 , fillers claim 1 , reinforcing agents claim 1 , anti-oxidants claim 1 , heat stabilizers claim 1 , light stabilizers claim 1 , ultraviolet light absorbers claim 1 , plasticizers claim 1 , lubricants claim 1 , mold release agents claim 1 , antistatic agents claim 1 , colorants claim 1 , blowing agents claim 1 , flame retardants claim 1 , anti-drip agents claim 1 , and radiation stabilizers claim 1 , and a combination thereof.7. The composition of claim 1 , further comprising an additive selected from an antioxidant claim 1 , an ultraviolet light absorber claim 1 , a mold release agent claim 1 , and a combination thereof.9. The composition of claim 8 , wherein the bis(chlorophthalimide) composition comprisesfrom 15 to less than 85 wt. % of the 3,3′-bis(chlorophthalimide),from 47 to less than 85 wt. % of the 4,3-bis(chlorophthalimide), andfrom more than 0 to less than 27 wt. % of the 4,4′-bis(chlorophthalimide).11. The ...

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Номер записи: 89
19-03-2015 дата публикации

POLYETHERIMIDES, METHODS OF MANUFACTURE, AND ARTICLES FORMED THEREFROM

Номер: US20150079377A1
Автор: Kuhlman Matthew L.
Принадлежит:

A polyetherimide manufactured by reaction of an alkali metal salt of a dihydroxy aromatic compound with a bis(halophthalimide) composition comprising, based on the weight of the bis(halophthalimide) composition, from more than 45 to less than 75 weight percent of a 3,3′-bis(halophthalimide), less than 10 weight percent of a 3,4′-bis(halophthalimide), and from more than 45 to less than 75 weight percent of a (4,4′-bis(halophthalimide. 2. The polymer composition of claim 1 , wherein the composition exhibits a viscosity that is from 50% to 95% lower than the viscosity of a polyetherimide made from a ClPAMI component having 3 claim 1 ,4-ClPAMI in an amount that is less than 10%.3. The polymer composition of claim 1 , wherein the composition exhibits a viscosity that is from 53% to 93% lower than the viscosity of a polyetherimide made from a ClPAMI component having 3 claim 1 ,4-ClPAMI in an amount that is less than 10%.4. The composition of claim 1 , wherein the polyetherimide has a total cyclic content (cyclic n=1 claim 1 , 2 claim 1 , and 3) of less than 3.5 weight % claim 1 , based on the total weight of the polymer claim 1 , and shows no observable plate-out at molding temperature conditions.5. The composition of claim 1 , wherein the bis(halophthalimide) composition comprises from 92 wt. % to 98 wt. % of the 3 claim 1 ,3′-bis(halophthalimide).8. The composition of claim 1 , wherein Z is 2 claim 1 ,2-(4-phenylene)isopropylidene and R is m-phenylene claim 1 , p-phenylene diarylsulfone claim 1 , or a combination thereof.9. The composition of claim 1 , further comprising an additive selected from impact modifiers claim 1 , fillers claim 1 , reinforcing agents claim 1 , anti-oxidants claim 1 , heat stabilizers claim 1 , light stabilizers claim 1 , ultraviolet light absorbers claim 1 , plasticizers claim 1 , lubricants claim 1 , mold release agents claim 1 , antistatic agents claim 1 , colorants claim 1 , blowing agents claim 1 , flame retardants claim 1 , anti-drip ...

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Номер записи: 90
05-03-2020 дата публикации

COMPOSITION, ADHESIVE, SINTERED BODY, JOINED BODY, AND METHOD OF PRODUCING JOINED BODY

Номер: US20200071488A1
Автор: MATSUURA Yoshitsugu, Takeuchi Masaki, UENO Fumitaka, YASU Katsuhiko
Принадлежит:

A composition includes metal particles capable of transient liquid phase sintering and a thermoplastic resin having a thermal decomposition rate of 2.0% by mass or less, the thermal decomposition rate being measured under a nitrogen stream using a thermogravimetric measurement device. 1. A composition , comprising:metal particles capable of transient liquid phase sintering; anda thermoplastic resin having a thermal decomposition rate of 2.0% by mass or less, the thermal decomposition rate being measured under a nitrogen stream using a thermogravimetric measurement device.2. The composition according to claim 1 , wherein the metal particles comprise first metal particles containing Cu and second metal particles containing Sn.3. The composition according to claim 1 , wherein a mass ratio of the metal particles with respect to total solid content is 80% by mass or more.4. The composition according to claim 1 , wherein the thermoplastic resin has an elastic modulus of from 0.01 GPa to 1.0 GPa at 25° C.5. The composition according to claim 1 , wherein the thermoplastic resin comprises at least one selected from the group consisting of an amide bond claim 1 , an imide bond claim 1 , and a urethane bond.6. The composition according to claim 1 , wherein the thermoplastic resin comprises at least one selected from the group consisting of a polyamide resin claim 1 , a polyamide imide resin claim 1 , a polyimide resin claim 1 , and a polyurethane resin.7. The composition according to claim 1 , wherein the thermoplastic resin comprises at least one of a polyalkylene oxide structure or a polysiloxane structure.12. An adhesive claim 1 , comprising the composition according to .13. A sintered body claim 1 , produced using the composition according to .14. A joined body claim 13 , comprising an element and a support member that are joined via the sintered body according to .15. A method of producing a joined body claim 13 , the method comprising:{'claim-ref': {'@idref': 'CLM-00001 ...

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Номер записи: 91
19-03-2015 дата публикации

POLYETHERIMIDES, METHODS OF MANUFACTURE, AND ARTICLES FORMED THEREFROM

Номер: US20150080489A1
Автор: Haralur Gurulingamurthy, Kuhlman Matthew L.
Принадлежит:

A polyetherimide composition comprising a polyetherimide manufactured by reaction of an alkali metal salt of a dihydroxy aromatic compound with a bis(halophthalimide) composition comprising, based on the weight of the bis(halophthalimide) composition, at least 15 wt. % of a 3,3′-bis(halophthalimide) of the formula 2. The composition of claim 1 , wherein the bis(halophthalimide) composition comprises claim 1 , based on the weight of the bis(halophthalimide) composition claim 1 , from more than 45 wt. % to less than 75 wt. % of the 4 claim 1 ,3′-bis(halophthalimide) claim 1 , whereinthe composition comprises less than 1 wt. % of total cyclics (n=1, 2, and 3) based on the total weight of the polyetherimide; andthe composition has a greater chemical resistance to a halogenated solvent than the same polyetherimide except made from a 1,3-bis[N-(halophthalimido)]benzene composition comprising less than 10 wt. % of 1,3-[N-(4-chlorophthalimido)][N-(3-chlorophthalimido)]benzene based on the weight of the 1,3-bis[N-(halophthalimido)]benzene composition.3. The composition of claim 2 , wherein the halogenated solvent is dichloromethane.4. The composition of claim 1 , wherein the bis(halophthalimide) composition comprises claim 1 , based on the weight of the bis(halophthalimide) composition claim 1 , from more than 0 wt. % to less than 15 wt. % of the 4 claim 1 ,4′-bis(halophthalimide) claim 1 , wherein:{'sub': 'g', 'the Tof the polyetherimide is at least 30° C. higher than the same polyetherimide except made from a 1,3-bis[N-(halophthalimido)]benzene composition comprising less than 10 wt. % of 1,3-[N-(4-chlorophthalimido)][N-(3-chlorophthalimido)]benzene and more than 15 wt. % of 1,3-bis[N-(4-chlorophthalimido)]benzene, each based on the weight of the 1,3-bis[N-(halophthalimido)]benzene composition;'}the polyetherimide retains at least 40% higher stiffness than the same polyetherimide except made from a 1,3-bis[N-(halophthalimido)]benzene composition comprising less than 10 wt. ...

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Номер записи: 92
19-03-2015 дата публикации

Polyoxazolines with Inert Terminating Groups, Polyoxazolines Prepared from Protected Initiating Groups and Related Compounds

Номер: US20150080538A1
Автор: Bentley Michael D., Harris J. Milton, JORDAN Rainer, REIF Michael, YOON Kunsang
Принадлежит:

The present disclosure provides novel functional polyoxazoline derivatives prepared by terminating polyoxazoline polymerization with inert chemical groups. In addition, the present disclosure demonstrates the synthesis of novel electrophilic initiators with protected functional groups capable of initiating oxazoline polymerization and capable of surviving the conditions of polymerization. These initiators are used to synthesize the above inert-terminal polyoxazoline derivatives as well as other polyoxazolines with active terminal groups. Furthermore, the present disclosure provides for polyoxazoline-lipid conjugates and liposomal compositions prepared using such polyoxazoline-lipid conjugates. Methods of using the foregoing to prepare conjugates with target molecules are also disclosed. 1. A monofunctional polyoxazoline derivative of the general structure:{'br': None, 'X—R′-POZ-S—R*'}wherein:{'sub': 2', '2', '2', 'n, 'POZ is a polyoxazoline polymer of the structure —[N(COR)CHCH]'}X is an active functional group or a group capable of being converted to an active functional group, the active functional group capable of forming a linkage with a binding partner on a target molecule;R′ is a linking group;{'sub': '2', 'Ris independently selected for each repeating unit of the polyoxazoline polymer from an unsubstituted or substituted alkyl, alkenyl, aralkyl or heterocycylalkyl group;'}R* is an inert group selected from an unsubstituted or substituted alkyl, alkenyl, aralkyl or heterocycylalkyl group; andn is an integer from 3-1000.2. The monofunctional polyoxazoline derivative of claim 1 , wherein X is an alkyne claim 1 , an oxyamine claim 1 , an aldehyde claim 1 , a ketone claim 1 , an acetal claim 1 , a ketal claim 1 , an ester claim 1 , a carboxylic acid claim 1 , an activated carboxylic acid claim 1 , an active carbonate claim 1 , a chloroformate claim 1 , an alcohol claim 1 , an azide claim 1 , a hydrazide claim 1 , an amine claim 1 , a protected amine claim 1 , a ...

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Номер записи: 93
26-03-2015 дата публикации

CURABLE COMPOSITE MANUFACTURING ADHESIVE

Номер: US20150083321A1
Автор: Yuodelis Robert R.
Принадлежит:

A curable adhesive that is modified to allow spray application and polymerization seamlessly during the process of epoxy resin vacuum infusion. 1. An improved composite manufacturing vacuum infusion process , comprising:preparing a laminate structure, said laminate structure further comprising,a core layer having a first and a second surface;a cross-linking adhesive applied to at least one of said surfaces;and a reinforcing layer in contact with said at least one of said surface containing said adhesive, wherein said adhesive is further comprises a melamine resin and a tack enhancing substance;placing said laminate structure within a vacuum bag;drawing a vacuum on said vacuum bag with a vacuum source;driving a liquid epoxy infusion resin into said vacuum bag, infusing said laminate structure; andcuring said liquid epoxy infusion resin to form a matrix comprising of said adhesive, cross-linked and hardened together with said liquid epoxy infusion resin as an integrated structure.2. The process of claim 1 , wherein said liquid epoxy infusion resin is bisphenol A/epichlorohydrin.3. The process of claim 1 , wherein said cross-linking is free-radical initiated.4. The process of claim 1 , further comprising the preliminary step of dissolving said adhesive in an acetone carrier.5. The process of claim 1 , further comprising the step of initiating a catalyst system for said liquid epoxy infusion resin before driving said infusion resin into said vacuum bag.6. A cross-linking adhesive composition comprising:Melamine resin; and tackifier, wherein said adhesive is dissolved in an organic ketone.7. The adhesive of claim 6 , wherein said melamine resin is hexa(methoxymethyl) melamine.8. The adhesive of claim 6 , further comprising one or more adducts.9. The adhesive of claim 6 , wherein said organic ketone is acetone.10. The adhesive of claim 8 , wherein said melamine resin has a carboxyl terminated butadiene nitrile adduct.11. The adhesive of claim 6 , wherein said tackifier is ...

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Номер записи: 94
26-03-2015 дата публикации

LIQUID CRYSTAL PHOTOALIGNMENT AGENT, LIQUID CRYSTAL DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SAME

Номер: US20150085237A1
Автор: JEON Baek Kyun, KANG Suk Hoon, KIM Hoi-Lim, LEE Jun Woo, LEE Mi Hwa, PARK Yeong Rong
Принадлежит: Samsung Display Co., Ltd.

A liquid crystal photoalignment agent is provided. The liquid crystal photoalignment agent is a copolymer of a cyclobutane dianhydride (“CBDA”) and a CBDA derivative. 1. A liquid crystal photoalignment agent comprising:a copolymer of a cyclobutane dianhydride and a cyclobutane dianhydride derivative.4. The liquid crystal photoalignment agent of claim 3 , whereinin Chemical Formula C, a ratio of Unit 1 to Unit 2 is about 20:80 to about 80:20.5. The liquid crystal photoalignment agent of claim 4 , wherein claim 4 ,the ratio of Unit 1 to Unit 2 is about 40:60 to about 60:40.6. A liquid crystal display comprising:a first substrate;a thin film transistor disposed on the first substrate;a first electrode connected to the thin film transistor; anda first alignment layer disposed on the first electrode,wherein the first alignment layer comprises a liquid crystal photoalignment agent comprising a copolymer of a cyclobutane dianhydride and a cyclobutane dianhydride derivative.9. The liquid crystal display of claim 8 , further comprisinga second electrode disposed on the first substrate,an insulating layer disposed between the first electrode and the second electrode, wherein the first electrode comprises a plurality of branch electrodes and the second electrode has a planar shape.10. The liquid crystal display of claim 9 , wherein the plurality of branch electrodes overlap the planar shaped second electrode.11. The liquid crystal display of claim 10 , further comprising a passivation layer between the thin film transistor and the second electrode claim 10 , wherein the thin film transistor is connected to the first electrode through a contact hole defined in the passivation layer and in the insulating layer.12. The liquid crystal display of claim 6 , further comprising:a second substrate facing the first substrate;a second alignment layer disposed on the second substrate; anda liquid crystal layer disposed between the first substrate and the second substrate, wherein the ...

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Номер записи: 95
14-03-2019 дата публикации

Polyamic Acid Resin and Polyamideimide Film

Номер: US20190077960A1
Автор: Jang Tae Sug, KIM Hyeon Jeong, Park Jin Hyung, PARK Sang Yoon
Принадлежит:

Provided are a polyamic acid resin derived from an aromatic diamine, an aromatic dianhydride, a cycloaliphatic dianhydride and an aromatic diacid dichloride, and a polyamideimide film including polyamideimide derived from an aromatic diamine, an aromatic dianhydride, a cycloaliphatic dianhydride and an aromatic diacid dichloride. 2. The polyamideimide film of claim 1 , wherein the aromatic diamine includes 2 claim 1 ,2′-bis(trifluoromethyl)-benzidine.3. The polyamideimide film of claim 1 , wherein the aromatic dianhydride includes 4 claim 1 ,4′-hexafluoroisopropylidene diphthalic anhydride and biphenyltetracarboxylic dianhydride.4. The polyamideimide film of claim 1 , wherein the aromatic diacid dichloride includes terephthaloyl dichloride.5. The polyamideimide film of claim 1 , wherein a content of the aromatic diacid dichloride is more than 50 mol claim 1 , based on 100 mol of the aromatic diamine.6. The polyamideimide film of claim 1 , wherein a content of the aromatic dianhydride is 10 to 50 mol claim 1 , based on 100 mol of the aromatic diamine.7. The polyamideimide film of claim 3 , wherein a content of the aromatic dianhydride is 5 to 25 mol of 4 claim 3 ,4′-hexafluoroisopropylidene diphthalic anhydride and 5 to 25 mol of biphenyltetracarboxylic dianhydride claim 3 , based on 100 mol of the aromatic diamine.8. The polyamideimide film of claim 1 , wherein a content of the cycloaliphatic dianhydride is 5 to 30 mol claim 1 , based on 100 mol of the aromatic diamine.9. The polyamideimide film of claim 1 , wherein the polyamideimide film has a modulus of 5.0 GPa or more claim 1 , as measured at an extension speed of 25 mm/min using UTM 3365 available from Instron.10. The polyamideimide film of claim 1 , wherein the polyamideimide film has a yellow index of 3.0 or less claim 1 , as measured in accordance with the ASTM E313 standard.11. The polyamideimide film of claim 9 , wherein the polyamideimide film has a modulus of 5.0 GPa or more claim 9 , as measured at an ...

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Номер записи: 96
21-03-2019 дата публикации

QUICK RESPONSIVE, SHAPE MEMORY THERMOSET POLYIMIDE AND PREPARATION METHOD THEREOF

Номер: US20190085133A1
Автор: KONG Deyan, LENG Jingsong, LIU Yanju, XIAO Xinli
Принадлежит: Harbin Institute of Technology

A fast-response thermoplastic shape-memory polyimide and a preparation method thereof, related to a polyimide and a preparation method thereof. The present invention aims to solve the problem in high-temperature conditions of slow shape recovery poor stability, and poor mechanical properties of a shape-memory polymer prepared by utilizing an existing method. The structural formula of the polyamide of the present invention is as represented by formula (I). The preparation method is: 1. preparation of a diamine solution; 2. preparation of an anhydride-terminated high molecular weight polyamic acid; 3. preparation of a viscous sol-gel; and, 4. preparation of the thermoplastic shape-memory polyimide. The thermoplastic shape-memory polyimide prepared per the present invention is provided with a very fast shape recovery rate and improved shape-memory effect. The present invention is applicable in the field of polyimide preparation. 1. A method for preparing a quick responsive , high-performance , thermoset shape memory polyimide , having the following steps of:I. preparation of a diamine solution:weighting out 1,3-bis(3-aminophenoxy)benzene monomer and charging it into a three-neck flask containing N,N-dimethylacetamide solvent, then stirring the contents in the flask under the protection of dry nitrogen at room temperature until the 1,3-bis-(3-aminophenoxy)benzene monomer is completely dissolved, so as to obtain a diamine solution;wherein the molar ratio by volume between N,N-dimethylacetamide solvent and 1,3-bis(3-aminophenoxy)benzene monomer is 1 mL: (0.2-0.33) mmoL;II. preparation of an anhydride-terminated high molecular weight polyamic acid: adding bis-phenol A type diether-dianhydride monomer for 4-6 times to the diamine solution obtained in step I, then stirring the resultant for 16-20 hours at a speed of 200-300 r/min at room temperature to obtain the anhydride-terminated high molecular weight polyamic acid; wherein the amount of each addition of the bisphenol A ...

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Номер записи: 97
19-03-2020 дата публикации

CASE, PREPARATION METHOD THEREOF AND ELECTRONIC PRODUCT

Номер: US20200086539A1
Автор: LIU Chencen, WANG Jihou, ZHAO Changtao
Принадлежит:

The present disclosure provides a case, a preparation method thereof and an electronic product. The case includes a glass cover plate, a plastic frame body and a metal substrate frame, where the glass cover plate, the plastic frame body and the metal substrate frame are sequentially bonded without steps. The method includes: (1) coating an edge of a glass cover plate with a first activator, and then drying; and (2) bonding the glass cover plate obtained in step (1) with a metal substrate frame by injection molding. 1. A case , comprising:a glass cover plate, a plastic frame body and a metal substrate frame,wherein the glass cover plate, the plastic frame body and the metal substrate frame are sequentially bonded without steps.2. The case according to claim 1 , wherein a material of the plastic frame body is at least one of polyamide claim 1 , glass fiber claim 1 , polycarbonate and polyphenylene sulfide.3. The case according to claim 1 , wherein a material of the plastic frame body is a mixture of glass fiber and at least one of polyamide claim 1 , polycarbonate and polyphenylene sulfide.4. The case according to claim 1 , wherein a material of the plastic frame body is a mixture of polyamide and glass fiber.5. The case according to claim 2 , wherein a ratio of a total weight of at least one of the polyamide claim 2 , the polycarbonate and the polyphenylene sulfide to a weight of the glass fiber is (0.5 to 5):1 in the plastic frame body.6. The case according to claim 2 , wherein a ratio of a total weight of at least one of the polyamide claim 2 , the polycarbonate and the polyphenylene sulfide to a weight of the glass fiber is (1 to 3):1 in the plastic frame body.7. The case according to claim 1 , wherein a material of the metal substrate frame is a stainless steel substrate or an aluminum alloy substrate.8. The case according to claim 1 , wherein an anodic oxide film layer is formed on a surface of the metal substrate frame claim 1 , and a micropore is formed in an ...

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Номер записи: 98
07-04-2016 дата публикации

COMPOSITION FOR PREPARING POLYIMIDE-INORGANIC PARTICLE COMPOSITE, ARTICLE PREPARED THEREFROM, AND OPTICAL DEVICE COMPRISING SAME

Номер: US20160096927A1
Автор: Jee Sang Soo, JEON Hyun Jeong, KANG Young Jae, SOHN Byung Hee
Принадлежит:

A composition for preparing a polyimide-inorganic particle composite, including a tetracarboxylic acid dianhydride represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, and an inorganic particle having an amino group on its surface: 6. The composition according to claim 1 , wherein the inorganic particle comprises two or more amino groups on its surface.7. The composition according to claim 1 ,wherein the inorganic particle is an oxide, an alkoxide, a hydroxide, a carbonate, a carboxylate, a silicate, an aluminosilicate, a carbide, or nitride of at least one element selected from Ti, Si, Al, Zr, Zn, Sn, B, Ce, Sr, Ca, Ba, In, and W, or a graphene oxide, andwherein a compound comprising an amino group end is attached to a surface of the inorganic particle, andwherein the amino group on the surface of the inorganic particle reacts with the tetracarboxylic acid dianhydride represented by Chemical Formula 1 to form an imide.8. The composition according to claim 1 , wherein the inorganic particle is selected from SiO claim 1 , AlO claim 1 , TiO claim 1 , ZrO claim 1 , ZnO claim 1 , Indium Tin Oxide claim 1 , SrCO claim 1 , ZrWO claim 1 , antimony doped tin oxide claim 1 , and graphene oxide.10. The composition according to claim 9 , wherein the compound represented by Chemical Formula 3 is selected from 3-aminopropyl trimethoxysilane 3-aminopropyl triethoxysilane claim 9 , or 3-aminophenyl trimethoxysilane.11. The composition according to claim 1 ,wherein an amount of the inorganic particle is less than or equal to about 5 percent by weight based on the total weight of a solid content of the polyimide, orwherein an amount of the inorganic particle is less than or equal to about 2 percent by volume based on the total volume of a solid content of the polyimide.12. The composition according to claim 1 ,wherein an amount of the inorganic particle is from about 0.05 percent by weight to about 3 percent by weight based on the total weight of a solid ...

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Номер записи: 99
05-04-2018 дата публикации

RESIN COMPOSITION, POLYIMIDE RESIN FILM, AND METHOD FOR PRODUCING SAME

Номер: US20180093461A1
Автор: Iizuka Yasuhito, UTASHIRO Yuka
Принадлежит: ASAHI KASEI KABUSHIKI KAISHA

Provided is a resin composition characterized by containing (a) a polyimide precursor that has a nm absorbance of 0.1-0.8 when formed into 0.1-μm-thick polyimide resin film by heating for one hour at 350° C., and (b) an alkoxysilane compound having a 308 nm absorbance of 0.1-1.0 at a solution thickness of 1 cm when made into a 0.001-mass % NMP solution. 1. A resin composition , comprising(a) a polyimide precursor having absorbance at 308 nm of 0.1 to 0.8 when heated for 1 hour at 350° C. to form a polyimide resin film having a film thickness of 0.1 μm, and(b) an alkoxysilane compound having absorbance at 308 nm of 0.1 to 1.0 when in the form of a 0.001% by weight NMP solution at a solution thickness of 1 cm.6. The resin composition according to claim 5 , wherein the molar ratio of the structural unit represented by the formula (5-1) to the structural unit represented by the formula (5-2) is 90/10 to 50/50.8. A polyimide resin film claim 1 , which is a cured product of the resin composition according to .9A resin film claim 8 , comprising the polyimide resin film according to .10. A method for producing a polyimide resin film claim 8 , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a step for coating the resin composition according to on the surface of a support,'}a step for drying the coated resin composition and removing the solvent,a step for heating the support and the resin composition to form a polyimide resin film, anda step for separating the polyimide resin film from the support.11. The method for producing a polyimide resin film according to claim 10 , wherein the step for separating the polyimide resin film from the support comprises a step for separating the polyimide resin film after irradiating with laser light from the support side.12. A laminate comprising a support and a polyimide resin film which is a cured product of the resin composition according to on the surface of the support.13. A method for producing a laminate claim 1 , ...

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Номер записи: 100