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Применить Всего найдено 17985. Отображено 100.
10-11-2004 дата публикации

УСТАНОВКА ДЛЯ ДИФФУЗИОННОГО НАСЫЩЕНИЯ ЛОПАТОК В ЦИРКУЛИРУЮЩЕЙ ГАЗОВОЙ СРЕДЕ

Номер: RU0000041731U1

1. Установка для диффузионного насыщения лопаток в циркулирующей газовой среде, содержащая нагревательную камеру с муфелем, внутри которого расположены экран, вентилятор, решетка для лопаток и полочка для насыщающей смеси, отличающаяся тем, что в экране выполнены дозирующие отверстия, ниже которых, на внешней стороне экрана, расположена полочка для насыщающей смеси, выполненная в виде кольцевой емкости. 2. Установка для диффузионного насыщения лопаток в циркулирующей газовой среде по п.1, отличающаяся тем, что центр дозирующего отверстия находится на уровне среднего сечения лопатки. 3. Установка для диффузионного насыщения лопаток в циркулирующей газовой среде по п.1, отличающаяся тем, что центр дозирующего отверстия, ось каждой лопатки и ось симметрии установки расположены в одной плоскости. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 41 731 (13) U1 (51) МПК C23C 18/06 (2000.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21), (22) Заявка: 2004117470/22 , 11.06.2004 (24) Дата начала отсчета срока действия патента: 11.06.2004 (45) Опубликовано: 10.11.2004 (73) Патентообладатель(и): Открытое акционерное общество "Пермский моторный завод" (RU) U 1 4 1 7 3 1 R U Ñòðàíèöà: 1 U 1 Формула полезной модели 1. Установка для диффузионного насыщения лопаток в циркулирующей газовой среде, содержащая нагревательную камеру с муфелем, внутри которого расположены экран, вентилятор, решетка для лопаток и полочка для насыщающей смеси, отличающаяся тем, что в экране выполнены дозирующие отверстия, ниже которых, на внешней стороне экрана, расположена полочка для насыщающей смеси, выполненная в виде кольцевой емкости. 2. Установка для диффузионного насыщения лопаток в циркулирующей газовой среде по п.1, отличающаяся тем, что центр дозирующего отверстия находится на уровне среднего сечения лопатки. 3. Установка для диффузионного насыщения лопаток в циркулирующей газовой среде по п.1, отличающаяся тем, что центр ...

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27-07-2005 дата публикации

УСТРОЙСТВО ДЛЯ ДИФФУЗИОННОГО НАСЫЩЕНИЯ ДЕТАЛЕЙ В ЦИРКУЛИРУЮЩЕЙ ГАЗОВОЙ СРЕДЕ

Номер: RU0000046752U1

1. Установка для диффузионного насыщения деталей в циркулирующей газовой среде, содержащая футерованную нагревательную камеру с расположенным в ней муфелем и установленные в муфеле экран, вентилятор, решетку для деталей, отличающаяся тем, что внутренняя поверхность футеровки образована правильной призмой, основанием которой является шестиугольник. 2. Установка по п.1, отличающаяся тем, что узлы крепления нагревательных элементов расположены на ребрах призмы. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 46 752 (13) U1 (51) МПК C23C 18/06 (2000.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21), (22) Заявка: 2005105778/22 , 01.03.2005 (24) Дата начала отсчета срока действия патента: 01.03.2005 (45) Опубликовано: 27.07.2005 (73) Патентообладатель(и): ОТКРЫТОЕ АКЦИОНЕРНОЕ ОБЩЕСТВО "ПЕРМСКИЙ МОТОРНЫЙ ЗАВОД" (RU) U 1 4 6 7 5 2 R U Ñòðàíèöà: 1 U 1 Формула полезной модели 1. Установка для диффузионного насыщения деталей в циркулирующей газовой среде, содержащая футерованную нагревательную камеру с расположенным в ней муфелем и установленные в муфеле экран, вентилятор, решетку для деталей, отличающаяся тем, что внутренняя поверхность футеровки образована правильной призмой, основанием которой является шестиугольник. 2. Установка по п.1, отличающаяся тем, что узлы крепления нагревательных элементов расположены на ребрах призмы. 4 6 7 5 2 (54) УСТРОЙСТВО ДЛЯ ДИФФУЗИОННОГО НАСЫЩЕНИЯ ДЕТАЛЕЙ В ЦИРКУЛИРУЮЩЕЙ ГАЗОВОЙ СРЕДЕ R U Адрес для переписки: 614990, г.Пермь, ГСП, Комсомольский пр-кт, 93, ОАО "Пермский Моторный Завод", патентно-лицензионный отдел (72) Автор(ы): Кузнецов В.П. (RU), Лесников В.П. (RU), Цыпков С.В. (RU) U 1 U 1 4 6 7 5 2 4 6 7 5 2 R U R U Ñòðàíèöà: 2 RU 5 10 15 20 25 30 35 40 45 50 46 752 U1 Полезная модель относится к химико-термической обработке. Известна установка для диффузионного насыщения деталей в циркулирующей газовой среде, содержащая футерованную нагревательную камеру с расположенным в ...

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10-12-2009 дата публикации

УСТРОЙСТВО ДЛЯ ЭЛЕКТРОКОНТАКТНОГО НАПЕКАНИЯ МЕТАЛЛИЧЕСКОГО ПОРОШКА

Номер: RU0000089530U1

Устройство для электроконтактного напекания металлического порошка, содержащее токарный станок, устройство ролика напекающего, промежуточную плиту, источник тока, отличающееся тем, что имеет поддерживающее устройство с двумя симметричными, вращающимися, подпружиненными роликами. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 89 530 (13) U1 (51) МПК C23C 18/54 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21), (22) Заявка: 2009100777/22, 20.07.2009 (24) Дата начала отсчета срока действия патента: 20.07.2009 (45) Опубликовано: 10.12.2009 U 1 8 9 5 3 0 R U Формула полезной модели Устройство для электроконтактного напекания металлического порошка, содержащее токарный станок, устройство ролика напекающего, промежуточную плиту, источник тока, отличающееся тем, что имеет поддерживающее устройство с двумя симметричными, вращающимися, подпружиненными роликами. Ñòðàíèöà: 1 ru CL U 1 (54) УСТРОЙСТВО ДЛЯ ЭЛЕКТРОКОНТАКТНОГО НАПЕКАНИЯ МЕТАЛЛИЧЕСКОГО ПОРОШКА 8 9 5 3 0 (73) Патентообладатель(и): Лобанов Иван Николаевич (RU), Барышников Сергей Александрович (RU) R U Адрес для переписки: 454029, г.Челябинск-29, ЧВВАКИУ(ВИ), НИО, И.Н. Лобанову, С.А. Барышникову (72) Автор(ы): Лобанов Иван Николаевич (RU), Барышников Сергей Александрович (RU), Никитин Денис Николаевич (RU), Журавлев Дмитрий Васильевич (RU), Сахабутдинов Егор Борисович (RU), Вишняк Антон Владимирович (RU), Белов Александр Владимирович (RU), Богатырев Артем Владимирович (RU), Шарафудинов Ренат Султанович (RU), Стрельчик Дмитрий Валерьевич (RU), Абдрахманов Ринат Шакирзянович (RU), Габбасов Тимур Салихьянович (RU), Прощенко Денис Геннадьевич (RU) U 1 U 1 8 9 5 3 0 8 9 5 3 0 R U R U Ñòðàíèöà: 2 RU 5 10 15 20 25 30 35 40 45 50 89 530 U1 Предложение относится к транспортному машиностроению, в частности к деталям, имеющим форму вращения, подвергающихся при эксплуатации знакопеременным нагрузкам типа валов. Наиболее близким техническим решением к ...

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10-12-2012 дата публикации

УСТАНОВКА МЕТАЛЛИЗАЦИИ ДИЭЛЕКТРИЧЕСКИХ ЧАСТИЦ

Номер: RU0000122655U1

Установка для металлизации диэлектрических частиц, содержащая основную гальваническую ванну для электролита и помещенную в нее ячейку для размещения металлизируемых частиц, отличающаяся тем, что она дополнительно содержит вспомогательную гальваническую ванну и систему перекачки электролита из вспомогательной ванны в основную гальваническую ванну, состоящую из соплового аппарата, помещенного на дно основной гальванической ванны и соединенного с ячейкой, насосом и трубопроводом. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 122 655 U1 (51) МПК C23C 18/00 (2006.01) C25D 17/16 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ (21)(22) Заявка: ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ 2012108388/02, 05.03.2012 (24) Дата начала отсчета срока действия патента: 05.03.2012 (73) Патентообладатель(и): Открытое акционерное общество "Технологическое оснащение" (RU) (45) Опубликовано: 10.12.2012 Бюл. № 34 R U 1 2 2 6 5 5 Формула полезной модели Установка для металлизации диэлектрических частиц, содержащая основную гальваническую ванну для электролита и помещенную в нее ячейку для размещения металлизируемых частиц, отличающаяся тем, что она дополнительно содержит вспомогательную гальваническую ванну и систему перекачки электролита из вспомогательной ванны в основную гальваническую ванну, состоящую из соплового аппарата, помещенного на дно основной гальванической ванны и соединенного с ячейкой, насосом и трубопроводом. Стр.: 1 U 1 U 1 (54) УСТАНОВКА МЕТАЛЛИЗАЦИИ ДИЭЛЕКТРИЧЕСКИХ ЧАСТИЦ 1 2 2 6 5 5 Адрес для переписки: 197342, Санкт-Петербург, ул. Белоостровская, 28, ОАО "Технологическое оснащение", патентоведу И.Г. Астраханцевой R U Приоритет(ы): (22) Дата подачи заявки: 05.03.2012 (72) Автор(ы): Мушенко Василий Дмитриевич (RU), Кудрявцева Ольга Васильевна (RU), Радимушкин Павел Михайлович (RU) U 1 U 1 1 2 2 6 5 5 1 2 2 6 5 5 R U R U Стр.: 2 RU 5 10 15 20 25 30 35 40 45 122 655 U1 Настоящая заявка относится к области гальванопластики, а именно к металлизации диэлектрических ...

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27-09-2014 дата публикации

УСТРОЙСТВО ДЛЯ ХИМИЧЕСКОЙ ОБРАБОТКИ ИЗДЕЛИЙ

Номер: RU0000145919U1

Устройство для химической обработки изделий в технологических ваннах с растворами, содержащее подвески с элементами для установки изделий, захваты с вертикальными щеками и несущую штангу, отличающееся тем, что несущая штанга выполнена в виде продольно вытянутой рамки с поперечно расположенными планками для крепления подвесок с элементами установки изделий и установлена в верхней части между вертикальными щеками, при этом в нижней части между щеками размещен ловитель изделий, выполненный корытообразной формы с вогнутым сетчатым дном. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 145 919 U1 (51) МПК C23C 18/00 (2006.01) C25D 17/06 (2006.01) B65G 49/02 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ (21)(22) Заявка: ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ 2014116718/02, 24.04.2014 (24) Дата начала отсчета срока действия патента: 24.04.2014 (72) Автор(ы): Горячева Наталья Александровна (RU), Назаров Евгений Васильевич (RU) (45) Опубликовано: 27.09.2014 Бюл. № 27 R U 1 4 5 9 1 9 Формула полезной модели Устройство для химической обработки изделий в технологических ваннах с растворами, содержащее подвески с элементами для установки изделий, захваты с вертикальными щеками и несущую штангу, отличающееся тем, что несущая штанга выполнена в виде продольно вытянутой рамки с поперечно расположенными планками для крепления подвесок с элементами установки изделий и установлена в верхней части между вертикальными щеками, при этом в нижней части между щеками размещен ловитель изделий, выполненный корытообразной формы с вогнутым сетчатым дном. Стр.: 1 U 1 U 1 (54) УСТРОЙСТВО ДЛЯ ХИМИЧЕСКОЙ ОБРАБОТКИ ИЗДЕЛИЙ 1 4 5 9 1 9 Адрес для переписки: 422546, Респ. Татарстан, г. Зеленодольск, ул. Привокзальная, 4, Открытое акционерное общество "Производственное Объединение "Завод имени Серго" R U (73) Патентообладатель(и): Открытое акционерное общество "Производственное объединение "Завод имени Серго" (RU) Приоритет(ы): (22) Дата подачи заявки: 24.04.2014 U 1 U 1 1 4 5 9 1 9 1 4 5 9 1 9 ...

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12-10-2017 дата публикации

Стальное изделие с композиционным износостойким покрытием

Номер: RU0000174415U1

Полезная модель относится к нанесению износостойких покрытий на поверхность стальных изделий, работающих в условиях интенсивного износа при эксплуатации, и может быть использована в машиностроении. Предложено стальное изделие с композиционным износостойким покрытием, содержащим промежуточный слой никеля и основной износостойкий пиролитический карбидохромовый слой. Промежуточный слой никеля имеет твердость, которая больше, чем твердость поверхности стального изделия, и меньше твердости основного износостойкого пиролитического карбидохромового слоя, имеющего микротвердость до 15 ГПа. Промежуточный слой никеля имеет толщину 3-5 мкм. Промежуточный слой никеля имеет твердость 700-1000 МПа. Обеспечивается упрощение процесса нанесения и улучшение качества пиролитического карбидохромового покрытия. 1 з.п. ф-лы, 1 ил., 1 пр. И 1 174415 ко РОССИЙСКАЯ ФЕДЕРАЦИЯ 7 ВУ’? 174 415 91 ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ИЗВЕЩЕНИЯ К ПАТЕНТУ НА ПОЛЕЗНУЮ МОДЕЛЬ ММ9К Досрочное прекращение действия патента из-за неуплаты в установленный срок пошлины за поддержание патента в силе Дата прекращения действия патента: 01.12.2018 Дата внесения записи в Государственный реестр: 02.09.2019 Дата публикации и номер бюллетеня: 02.09.2019 Бюл. №25 Стр.: 1 па ЧУДА ЕП

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12-01-2012 дата публикации

Resin complex and laminate

Номер: US20120009385A1
Принадлежит: Fujifilm Corp

A resin complex which is capable of being plated, is highly hydrophobic, and has excellent molding properties and good adhesion to a plated layer, a laminate including a layer of the resin complex, and a method of manufacturing the laminate are provided. The resin complex capable of being plated includes a hydrophobic compound A having a functional group capable of interacting with a plating catalyst, its precursor or a metal, and a hydrophobic resin B incompatible with the hydrophobic compound A. The resin complex has a phase-separated morphology in which the hydrophobic compound A forms a dispersed phase and the hydrophobic resin B forms a continuous phase and the hydrophobic compound A is exposed on at least part of a surface of the resin complex.

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23-02-2012 дата публикации

Tailoring the band gap of solar cells made of liquid silane by adding germanium

Номер: US20120042951A1
Принадлежит: EVONIK DEGUSSA GmbH

The present invention relates to a method for decreasing or increasing the band gap shift in the production of photovoltaic devices by means of coating a substrate with a formulation containing a silicon compound, e.g., in the production of a solar cell comprising a step in which a substrate is coated with a liquid-silane formulation, the invention being characterized in that the formulation also contains at least one germanium compound. The invention further relates to the method for producing such a photovoltaic device.

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01-03-2012 дата публикации

Biosensor test member and method for making the same

Номер: US20120051972A1
Автор: Abner David Joseph
Принадлежит: Roche Diagnostics Operations Inc

A biological test member, and method of making the same, is disclosed with the member including a substrate. The test member has usefulness, for example, in testing a person's blood glucose level. A first layer and a second layer of conductive metal are printed or otherwise applied on the substrate in an electrode pattern. The metal or metals are cured or sintered at a low, non-damaging temperature, such as by applying one or more pulses of a high-energy broad spectrum light. A layer of reagent may be provided on said second metal layer.

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08-03-2012 дата публикации

Electroless nickel alloy plating bath and process for depositing thereof

Номер: US20120058259A1
Принадлежит: OMG Electronic Chemicals LLC

An aqueous nickel phosphorus tin alloy electroless plating bath and process for depositing a nickel phosphorus tin alloy onto a substrate, particularly an aluminum substrate for memory disk applications, wherein the nickel phosphorus tin alloy deposit provides enhanced thermal stability, as defined by the inhibition of crystallization and suppression of magnetization upon high temperature annealing when compared to typical NiP deposits.

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15-03-2012 дата публикации

Process for coating glass onto a flexible stainless steel substrate

Номер: US20120060559A1
Принадлежит: EI Du Pont de Nemours and Co

The present disclosure relates to a method of manufacturing of a glass coated metal product. This invention also relates to a coated metallic substrate material that is suitable for manufacturing flexible solar cells and other articles in which a passivated stainless steel surface is desirable.

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12-04-2012 дата публикации

Method of providing solar cell electroless platting and an activator used therein

Номер: US20120088653A1
Принадлежит: E Chem Enterprise Corp

A method of providing solar cell electrode by electroless plating and an activator used therein are disclosed. The method of the present invention can be performed without silver paste, and comprises steps: (A) providing a silicon substrate; (B) contacting the silicon substrate with an activator, wherein the activator comprises: a noble metal or a noble metal compound, a thickening agent, and water; (C) washing the silicon substrate by a cleaning agent; (D) dipping the silicon substrate in an electroless nickel plating solution to perform electroless plating. The method of providing solar cell electrode by electroless plating of the present invention has high selectivity between silicon nitride and silicon, large working window, and is steady, easily to be controlled, therefore is suitable for being used in the fabrication of the electrodes of the solar cell substrate.

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10-05-2012 дата публикации

Treating solution for forming fluoride coating film and method for forming fluoride coating film

Номер: US20120111232A1
Принадлежит: Individual

A conventional method for forming an insulating film on a magnet has a difficulty in achieving sufficient improvement in magnetic characteristics due to nonuniformity of a coating film, and an extended time and higher temperature which are required in a thermal treatment. In order to solve the problems, the present invention provides a treating solution composed of an alcohol based solvent and a rare earth fluoride or alkaline earth metal fluoride dispersing in the solvent. In the treating solution, at least one X-ray diffraction peak has a half-value width larger than 1°. The present invention also provides a method for forming an insulating film using the treating solution.

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10-05-2012 дата публикации

Metalized plastic articles and methods thereof

Номер: US20120114968A1
Принадлежит: BYD Co Ltd

Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

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17-05-2012 дата публикации

Metalized plastic articles and methods thereof

Номер: US20120121928A1
Принадлежит: BYD Co Ltd

Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe 2 O 4-δ , Ca 0.25 Cu 0.75 TiO 3-β , and TiO 2-σ , wherein δ, β, σ denotes oxygen vacancies in corresponding accelerators and 0.05≦δ≦0.8, 0.05≦β≦0.5, and 0.05≦σ≦1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

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24-05-2012 дата публикации

Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution

Номер: US20120125659A1
Принадлежит: Hitachi Chemical Co Ltd

Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.

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21-06-2012 дата публикации

Electroless Deposition from Non-Aqueous Solutions

Номер: US20120152147A1
Принадлежит: Individual

A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided.

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21-06-2012 дата публикации

Solution and process for activating the surface of a semiconductor substrate

Номер: US20120156892A1
Принадлежит: Alchimer SA

The present invention relates to a solution and a process for activating the surface of a substrate comprising at least one area formed from a polymer, for the purpose of subsequently covering it with a metallic layer deposited via an electroless process. According to the invention, this composition contains: A) an activator formed from one or more palladium complexes; B) a binder formed from one or more organic compounds chosen from compounds comprising at least two glycidyl functions and at least two isocyanate functions; C) a solvent system formed from one or more solvents capable of dissolving said activator and said binder. Application: Manufacture of electronic devices such as, in particular, integrated circuits, especially in three dimensions.

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19-07-2012 дата публикации

Protective layer against hot gas corrosion in the combustion chamber of an internal combustion engine

Номер: US20120180748A1
Автор: Gunter BÜRKLE
Принадлежит: KS KOLBENSCHMIDT GMBH

A coating for a tribologically heavily loaded component, wherein the coating is in the form of a ceramic coating made of an organic-inorganic prepolymer which is pyrolyzed after being applied to the component.

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23-08-2012 дата публикации

Device mounting board and method of manufacturing the same, semiconductor module, and mobile device

Номер: US20120211269A1
Принадлежит: Sanyo Electric Co Ltd

A device mounting board includes: an insulating resin layer; a wiring layer formed on one of the principal surfaces of the insulating resin layer; a protection layer covering the insulating resin layer and the wiring layer; a protruding electrode electrically connected to the wiring layer, the protruding electrode protruding from the wiring layer toward the insulating resin layer and penetrating through the insulating resin layer; a wiring-layer-side convex portion protruding from the wiring layer toward the insulating resin layer and having the top end thereof located inside the insulating resin layer; and a resin-layer-side convex portion protruding from the protection layer toward the insulating resin layer and having the top end thereof located inside the insulating resin layer.

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23-08-2012 дата публикации

Composite ptfe plating

Номер: US20120214924A1
Принадлежит: Michael David Feldstein

The present invention is directed to compositions, baths, and methods for composite plating including polytetrafluoroethylene (PTFE), and more particularly, to compositions, baths, and methods of composite plating with PTFE in a metal or alloy matrix where the materials used in the process contain no or essentially no PFOS (perfluorooctane sulfonate) and/or no PFOA (perfluorooctanoic acid).

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04-10-2012 дата публикации

Method of controlling silicon oxide film thickness

Номер: US20120252228A1
Автор: Yuanchang Zhang
Принадлежит: Natcore Technology Inc

A deposition process for coating a substrate with films of a different thickness on front and rear surface of a substrate can be achieve in one growth. The thickness of the film deposition can be controlled by the separation between the substrates. Different separation distances between the substrates in the same chemical bath will result in different film thicknesses on the substrate. Substrates may be arranged to have different separation distances between front and back surfaces, a V-shaped arrangement, or placed next to a curtain with varying separation distances between a substrate and the curtain.

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08-11-2012 дата публикации

Transparent conductive thin film and method of manufacturing the same

Номер: US20120280188A1
Автор: Tongjun Liu

An embodiment of the disclosed technology discloses a transparent conductive thin film and a method of manufacturing the same. The embodiment of the disclosed technology employs tin (II) oxalate (Sn 2 C 2 O 4 ) as a raw material, acetic acid and ammonia as complex agents to form a neutral complex system with a pH=6.5˜7.5, and trifluoroacetic acid as dopant to form a stable doping of F ions, and has a high doping efficiency.

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08-11-2012 дата публикации

Circuit module and manufacturing method for the same

Номер: US20120281370A1
Принадлежит: Murata Manufacturing Co Ltd

A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.

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29-11-2012 дата публикации

Semiconductor device and manufacturing method of the same

Номер: US20120298989A1
Автор: Gen Fujii
Принадлежит: Semiconductor Energy Laboratory Co Ltd

The manufacturing method of the present invention includes steps of selectively forming a photocatalyst material or a material including an amino group by discharging a composition including the photocatalyst material or the material including an amino group; immersing the photocatalyst material or the material including an amino group in a solution including a plating catalyst material so as to adsorb or deposit the plating catalyst material onto the photocatalyst material or the material including an amino group; and immersing the plating catalyst material in a plating solution including a metal material so as to form a metal film on a surface of the photocatalyst material or the material including an amino group adsorbing or depositing the plating catalyst material, thereby manufacturing a semiconductor device. The pH of the solution including the plating catalyst material is adjusted in a range of 3 to 6.

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06-12-2012 дата публикации

Palladium precursor composition

Номер: US20120308719A1
Автор: Ping Liu, Yiliang Wu
Принадлежит: Xerox Corp

A palladium precursor composition contains a palladium salt and an organoamine. The composition permits the use of solution processing methods to form palladium layers.

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13-12-2012 дата публикации

Immersion platinum plating solution

Номер: US20120315503A1
Принадлежит: Unity Semiconductor Corp

A platinum plating solution for immersion plating a continuous film of platinum on a metal structure. The immersion platinum plating solution is free of a reducing agent. The plating process does not require electricity (e.g., electrical current) and does not require electrodes (e.g., anode and/or cathode). The solution includes a platinum source and a complexing agent including Oxalic Acid. The solution enables immersion plating of platinum onto a metal surface, a metal substrate, or a structure of which at least a portion is a metal. The resulting platinum plating comprises a continuous thin film layer of platinum having a thickness not exceeding 300 Å. The solution can be used for plating articles including but not limited to jewelry, medical devices, electronic structures, microelectronics structures, MEMS structures, nano-sized or smaller structures, structures used for chemical and/or catalytic reactions (e.g., catalytic converters), and irregularly shaped metal surfaces.

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20-12-2012 дата публикации

Pre-treatment process for electroless nickel plating

Номер: US20120321781A1
Автор: Elisabeth Zettelmeyer
Принадлежит: Individual

The present invention discloses a process for electroless plating of nickel onto copper features of a printed circuit board which suppresses extraneous nickel plating. The process comprises the steps i) activation of the copper features with palladium ions; ii) removal of excessive palladium ions or precipitates formed thereof with a pre-treatment composition comprising at least two different types of acids wherein one type is an organic amino carboxylic acid and iii) electroless plating of nickel.

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24-01-2013 дата публикации

Grooved circuit board accommodating mixed-size components

Номер: US20130021763A1
Принадлежит: Research in Motion Ltd

A circuit board, associated assembly, and method of manufacture. The circuit board comprises an elongated groove, extending into the circuit board, for accommodating a footing of a large component such as an RF shield. The groove allows solder paste to be deposited therein via a stencil, to a depth greater than the stencil thickness. Thus the same stencil can be used for depositing solder paste for both small and large components.

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28-02-2013 дата публикации

Nano-seeding via dual surface modification of alkyl monolayer for site-controlled electroless metallization

Номер: US20130052366A1
Принадлежит: Individual

Self-assembled-monolayer grafted seeding and electroless plating processes for patterning of metal-alloy thin films, comprising the steps of treating the surface of the substrate by organic species, covering the organic species-SAM coated surface of dielectric substrate with a template, treating the surface by vacuum plasma, immersing the substrate into an aqueous solution, removing the hydrogen from the surface of the substrate, immersing the negatively charged dielectric surface into an aqueous metal salt solutions for adsorbing metal ions, reducing the positively charged metallic cations into neutral metal particles which act as catalysts by a reducing agent, and immersing the dielectric substrate into an electroless-plating solution for deposition of metal and metal-alloy thin film patterns.

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18-04-2013 дата публикации

TCO Coating and Coated Substrate for High Temperature Applications

Номер: US20130095292A1
Принадлежит: Cardinal Solar Technologies Company

A glass substrate is provided having a major surface on which there is a coating comprising a transparent conductive oxide film. The TCO film may comprise aluminum-doped zinc aluminum oxide (“AZO”) or tin-doped indium oxide (“ITO”). When the coated glass substrate is heat-treated, the coating exhibits desirable sheet resistance and absorption values. In some cases, the coating comprises a first transparent dielectric film, a second transparent dielectric film, a transparent conductive oxide film comprising AZO or ITO, and a third transparent dielectric film. 1. A glass substrate having a major surface bearing thereover a coating comprising , in sequence outward from the substrate:a first transparent dielectric film comprising a dielectric material having an index of refraction higher than the index of refraction of glass;a second transparent dielectric film comprising silicon dioxide;a transparent conductive oxide film comprising aluminum-doped zinc oxide; anda third transparent dielectric film comprising tin oxide and having a thickness ranging from about 400 Å to about 1500 Å.2. The glass substrate of wherein the first transparent dielectric comprises tin oxide.3. The glass substrate of wherein the transparent conductive oxide film comprises zinc oxide doped with about 0.5% to about 4% aluminum.4. The glass substrate of wherein the transparent conductive oxide film has a thickness ranging from about 5000 Å and about 6000 Å.5. The glass substrate of wherein the first transparent dielectric film has a thickness ranging from about 100 Å and about 200 Å.6. The glass substrate of wherein the second transparent dielectric film has a thickness ranging from about 250 Å and about 350 Å.7. The glass substrate of wherein the third transparent dielectric film has a thickness ranging from about 1000 Å and about 1500 Å.8. The glass substrate of wherein the third transparent dielectric film has a bi-layer structure comprising a first partially absorbing layer and a second claim ...

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18-04-2013 дата публикации

Process For The Surface-Modification Of Flyash And Industrial Applications Thereof

Номер: US20130095995A1
Принадлежит:

Processes for the surface-modification of flyash and industrial applications thereof are described in this invention, which involve surface-sensitization, surface-activation, and subsequent Cu or Ag coating of as-received flyash particles in a conventional electroless bath. These new surface-modification processes offer efficient and cost-effective alternatives to conventional processes which modify the surface of flyash particles with a costlier Sn—Pd catalyst-system. Flyash processed with the inventive processes is also suitable for a greater number of industrial applications relative to that processed with the costlier Sn—Pd catalyst-system. The as-received flyash particles, processed via the inventive surface-modification processes, find industrial applications as conductive fillers for manufacturing conducting polymers, paints, adhesives, sealers, and resins used for EMI shielding of electronic devices, in lead-based composites used in the automobile industries, and as a catalyst to purify industrial waste-water by decomposing longer chains of organic molecules into smaller ones. 1. A process for the surface-modification of flyash containing sufficient amount of titania (TiO) or any other semiconductor oxide on its surface , wherein said process comprises the steps of:{'sub': '4', 'i. suspending flyash particles in a surface-activation bath consisting of an aqueous solution of metal-salt at pH˜10-12 obtained using an aqueous NHOH solution (25-28 wt. %);'}ii. stirring the suspension as obtained in step (i) continuously under UV, visible, or solar-radiation for a period ranging between 4-6 hours to deposit metal-clusters over the surface of flyash particles;iii. separating the surface-activated flyash particles as obtained in step (ii) via filtration followed by washing with distilled-water several times to remove unwanted ions from the surface;{'sup': −1', '−1', '−1, 'sub': 4', '4', '6, 'iv. stirring the surface-activated flyash particles, as obtained in step ( ...

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02-05-2013 дата публикации

COATED ARTICLE WITH LOW-E COATING INCLUDING TIN OXIDE INTERLAYER

Номер: US20130108848A1
Принадлежит: Guardian Industries Corp.

A coated article is provided which may be heat treated (e.g., thermally tempered) in certain instances. In certain example embodiments, an interlayer of or including a metal oxide such as tin oxide is provided under an infrared (IR) reflecting layer so as to be located between respective layers comprising silicon nitride and zinc oxide. It has been found that the use of such a tin oxide inclusive interlayer results in significantly improved mechanical durability, thermal stability and/or haze characteristics. 140-. (canceled)41. A coated article including a coating supported by a substrate , the coating comprising:a first dielectric layer;a first IR reflecting layer, wherein the first dielectric layer is located between at least the substrate and the first IR reflecting layer;a second IR reflecting layer, wherein the first IR reflecting layer is located between the substrate and the second IR reflecting layer;a dielectric film located between at least the first and second IR reflecting layers, wherein the dielectric film located between at least the first and second IR reflecting layers comprises first and second layers comprising tin oxide that are spaced apart by at least a layer comprising silicon nitride, and wherein the first layer comprising tin oxide is located closer to the substrate than is the second layer comprising tin oxide and wherein the first layer comprising tin oxide is significantly thicker than is the second layer comprising tin oxide.42. The coated article of claim 41 , wherein the first layer comprising tin oxide is from 200-700 angstroms thick claim 41 , and the second layer comprising tin oxide is no greater than 100 angstroms thick.43. The coated article of claim 41 , wherein the first layer comprising tin oxide is from 200-700 angstroms thick claim 41 , and the layer comprising silicon nitride is from 80-200 angstroms thick.44. The coated article of claim 41 , wherein a layer comprising zinc oxide is located below and directly contacting ...

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16-05-2013 дата публикации

Chemical bath deposition system and related chemical bath deposition method

Номер: US20130122190A1
Принадлежит: Axuntek Solar Energy Co Ltd

A chemical bath deposition system is used for forming a buffer layer and a ZnO window layer on a back electrode substrate having a photoelectric transducing layer. The chemical bath deposition system includes a first bath tank and a second bath tank. The first bath tank is used for storing a buffer-layer solution. The buffer-layer solution forms the buffer layer on the photoelectric transducing layer when the back electrode substrate is immersed in the buffer-layer solution. The second bath tank is for storing a window-layer solution. The window-layer solution forms the ZnO window layer on the buffer layer when the back electrode substrate is immersed in the window-layer solution. The first bath tank and the second bath tank are in an in-line arrangement.

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23-05-2013 дата публикации

Zinc oxide anti-reflection layer having a syringe-like structure and method for fabricating the same

Номер: US20130129974A1

The disclosure provides a zinc oxide anti-reflection layer having a syringe-like structure and method for fabricating the same. The zinc oxide anti-reflection layer includes: a zinc oxide lower portion, wherein the zinc oxide lower portion has a nanorod array structure; and a zinc oxide upper portion connected to the zinc oxide lower portion, wherein the zinc oxide anti-reflection layer has a syringe-like structure.

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23-05-2013 дата публикации

COLOR METALLIC PIGMENT, METHOD FOR PRODUCING SAME, AND COATING COMPOSITION AND COSMETIC CONTAINING SAME

Номер: US20130131187A1
Принадлежит: TOYO ALUMINIUM KABUSHIKI KAISHA

A color metallic pigment according to the present invention contains at least a metallic pigment, an amorphous silicon oxide film layer that is formed on the surface of the metallic pigment, a metal oxide layer that is formed on the surface of the amorphous silicon oxide film layer and contains a metal oxide other than silicon oxide, and metal particles that are formed on the surface of the metal oxide layer, wherein the metal particles are so formed as to directly cover a part of the metal oxide layer. 18-. (canceled)9. A color metallic pigment comprising at least a metallic pigment , an amorphous silicon oxide film layer that is formed on the surface of the metallic pigment , a metal oxide layer that is formed on the surface of the amorphous silicon oxide film layer and comprises a metal oxide other than silicon oxide , and metal particles that are formed on the surface of the metal oxide layer ,wherein the metal particles are so formed as to directly cover a part of the metal oxide layer,the surface of the metal oxide layer has a region on which the metal particles are not formed,the region corresponds to the spacing between the metal particles, andthe spacing is greater than or equal to 0.1 and less than or equal to 10 nm.10. The color metallic pigment according to claim 9 , wherein the metal oxide layer comprises an oxide of at least one element selected from the group consisting of Mg claim 9 , Sn claim 9 , Zn claim 9 , Co claim 9 , Ni claim 9 , Fe claim 9 , Zr claim 9 , Ti claim 9 , and Ce.11. The color metallic pigment according to claim 9 , wherein each of the metal particles comprises at least one element selected from the group consisting of Cu claim 9 , Ni claim 9 , and Ag.12. The color metallic pigment according to claim 9 , wherein the amorphous silicon oxide film layer has a thickness ranging from 10 to 500 nm and the metal particles have an average particle diameter of less than or equal to 50 nm.13. A method for producing the color metallic pigment ...

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13-06-2013 дата публикации

Method of manufacturing patterned graphene film

Номер: US20130149463A1
Принадлежит: BOE Technology Group Co Ltd

Embodiments of the invention provide a method of manufacturing a patterned graphene film. The method comprises the following steps: Step 1: a photoresist layer/electron-beam resist layer is coated on a substrate and patterned, the photoresist layer/electron-beam resist layer in a region for forming the patterned graphene film is removed; Step 2: a solution of oxidized graphene is coated on the substrate formed with the photoresist layer/electro-beam resist layer patterned in Step 1, so that a film of oxidized graphene is formed; Step 3: the substrate obtained in Step 2 is placed in a hydrazine steam, so that the film of oxidized graphene formed in Step 2 is reduced and a graphene film is obtained; and Step 4: the photoresist layer/electron-beam resist layer and the graphene film on the photoresist layer/electrone-beam resist layer are removed, so that the patterned graphene film is obtained.

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20-06-2013 дата публикации

Method for forming interconnection pattern and semiconductor device

Номер: US20130154087A1
Принадлежит: Individual

According to one embodiment, a method for forming an interconnection pattern includes forming an insulating pattern, forming a self-assembled film, and forming a conductive layer. The insulating pattern has a side surface on a major surface of a matrix. The self-assembled film has an affinity with a material of the insulating pattern on the side surface of the insulating pattern. The forming the conductive layer includes depositing a conductive material on a side surface of the self-assembled film.

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20-06-2013 дата публикации

FIREPROOF GLAZING

Номер: US20130157036A1
Принадлежит: AGC Glass Europe

The invention relates to fireproof glazing comprising at least one intumescent layer of hydrated alkaline silicate having a thickness of no less than 2.5 mm and containing water and optionally compounds partially substituting the water, namely either glycerin or ethylene glycol, said compounds and water combined representing between 25 and 45 wt.-% of the layer, with a molar ratio SiO/MO of between 2.5 and 6. The viscosity of the intumescent layer prevents the layer from creeping over time. 1. Fire-resistant glazing comprising at least one intumescent layer of hydrated alkali silicate , the thickness of which is not less than 2.5 mm , which contains water and possibly hydroxylated compounds that are partly substituted for this , said compounds being either glycerine or ethylene glycol , wherein those with water are present to an amount of 25% to 45% by weight of the layer , and with an SiO/MO molar ratio of 2.5 to 6 , and the intumescent layer has a viscosity that is not less than 0.8. 10Pa.s and is preferably not lower than 1.10Pa.s measured in accordance with standard ASTM C1351M-96.2. Fire-resistant glazing comprising at least one intumescent layer of hydrated alkali silicate , the thickness of which is not less than 2 mm , which contains water and possibly hydroxylated compounds (H) that are partly substituted for this , said compounds being either glycerine or ethylene glycol , wherein the alkali silicate is a mixed silicate constituent of sodium and potassium complying with one of the following combinations of conditions between the NaO/MO molar ratio , the content by weight of water and hydroxylated compounds (W+H) and the RSiO/MO molar ratio (M being the sum of Na and K):{'sub': 2', '2', 'M', 'M', 'M, 'NaO/MO of 67% to 100% and W+H of 40% to 45% R>3.5 or W+H of 35% to 40% R>2.75 or W+H of 25% to 35% R>2.25'}{'sub': 2', '2', 'M', 'M', 'M', 'M, 'NaO/MO of 34% to 66% and W+H of 40% to 45% R>4.25 or W+H of 35% to 40% R>4.0 or W+H of 30% to 35% R>3.75 or W+H of ...

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04-07-2013 дата публикации

Structured Layers Composed of Crosslinked or Crosslinkable Metal-Organic Compounds, Shaped Bodies Containing Them as well as Processes for Producing Them

Номер: US20130168597A1
Принадлежит: Individual

The invention relates to a process for producing a structured shaped body or a layer of this type from a precursor of a metal oxide or mixed oxide selected from among magnesium, strontium, barium, aluminum, gallium, indium, silicon, tin, lead and the transition metals.

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11-07-2013 дата публикации

Coating composition and uses thereof

Номер: US20130177759A1
Принадлежит: Individual

A coating composition is provided. The coating composition comprises (a) an aluminum oxide precursor and (b) a solvent, wherein the aluminum oxide precursor (a) comprises aluminum elements and the following groups bound thereon: (a1) a —OR 1 group, wherein R 1 is H or a substituted or unsubstituted C1 to C13 alkyl; (a2) a bidentate chelating group; and (a3) a tetrahedral coordinating group, wherein, the amount of the aluminum oxide precursor (a) is about 1 wt % to about 50 wt %, based on the total weight of the composition, and the total amount of the groups (a1), (a2) and (a3) is no more than 3 moles per 1 mole of the aluminum elements. The coating composition can be used in a semiconductor process for providing a passivation layer.

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25-07-2013 дата публикации

Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid Using an Improved Anode

Номер: US20130186861A1
Принадлежит: MacDermid Acumen Inc

An electrolytic cell and a method of electrochemical oxidation of manganese (II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of 9 to 15 molar sulfuric acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, and woven carbon fibers.

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25-07-2013 дата публикации

Method for manufacturing sensing electrical device and sensing electrical device

Номер: US20130187813A1
Принадлежит: Taiwan Green Point Enterprise Co Ltd

A method for manufacturing a sensing electrical device includes the following steps; (a) forming a conductive trace on an insulating substrate; (b) placing the insulating substrate with the conductive trace in a mold cavity of a mold; (c) injecting an insulating material into the mold cavity to encapsulate the conductive trace to form an injection product; and (d) removing the injection product from the mold cavity.

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08-08-2013 дата публикации

Method for Depositing a Nickel-Metal Layer

Номер: US20130202910A1
Автор: Koppe Stefan
Принадлежит:

A method for depositing nickel-metal layers for colouring surfaces, and a bath for depositing such a layer. This is made possible by depositing a nickel-metal layer from a bath for the electroless deposition of nickel which contains at least one further metal compound, a voltage being additionally applied enable the metal of the metal compound to be incorporated while forming a nickel-metal layer. 1. A method for depositing a nickel-metal layer , comprising the following steps:a) providing a nickel bath for electroless deposition of a nickel layer, wherein the bath additionally contains a compound of another metal; b1) deposition of nickel from the nickel bath and', 'b2) voltage-supported deposition of the other metal compound from the bath provided., 'b) depositing a nickel-metal layer by simultaneous'}2. The method as claimed in claim 1 , 'the electroless deposited metal layer is a nickel/phosphorus or a nickel/boron layer, which further contains at least one other metal.', 'characterized in that'}3. The method as claimed in claim 1 , 'the voltage-supported deposition is carried out at a temperature above 50° C.', 'characterized in that'}4. The method as claimed in claim 1 , 'the other metal compound is a zinc compound.', 'characterized in that'}5. The method as claimed in claim 1 , 'the other metal compound is present in the bath in a range between 0.05 mol/l and 0.5 mol/l relative to the metal.', 'characterized in that'}6. The method as claimed in claim 1 , 'a graphite electrode is used for the voltage-supported deposition.', 'characterized in that'}7. The method as claimed in claim 1 , 'the bath additionally contains at least one conducting salt.', 'characterized in that'}8. The method as claimed in claim 1 , {'sup': '2', 'the voltage-supported deposition is carried out with current densities between 0.01 and 5 A/dm.'}, 'characterized in that'}9. The method as claimed in claim 1 , 'electroless deposition of a nickel layer or nickel-metal layer is carried out ...

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15-08-2013 дата публикации

Process for Electroless Deposition of Metals Using Highly Alkaline Plating Bath

Номер: US20130209698A1
Принадлежит: UNIVERSITY OF WINDSOR

A plating process using an electroless plating bath formed from two separate prepared component solutions. The component solutions mixed within 120 hours prior to plating operations, to provide a highly alkaline plating bath solution. One component solution of the two-part plating bath, is provided with a metal salt or source of plating ions, and which is initially kept in a separate solution from the second other prepared component solution. The second component solution contains formaldehyde, and preferably paraformaldehyde, used to reduce the metal salts into the metal to be deposited on a substrate. Each component solution further includes sodium hydroxide in concentrations selected so that when the two solutions are preferably mixed the final plating bath solution has a pH greater than 11.5. 1. (canceled)2. (canceled)3. (canceled)4. (canceled)5. (canceled)6. (canceled)7. (canceled)8. (canceled)9. (canceled)10. (canceled)11. (canceled)12. (canceled)13. (canceled)14. (canceled)15. (canceled)16. (canceled)17. (canceled)18. (canceled)19. (canceled)20. (canceled)21. (canceled)22. A process for electroless plating nickel or a nickel alloy plating metal on a magnesium metal substrate comprising: '25 to 60 g/L nickel chloride hexahydrate,', 'preparing a first bath solution comprising 40 to 75 ml/L ethylenediamine,', '30 to 50 g/L sodium hydroxide, and', '3 to 8 g/L sodium borohydride,', 'immersing a substrate in the mixed solution.', 'mixing the first and second bath solutions to form a mixed plating bath solution having a pH of at least 12, and'}], 'preparing a second bath solution physically separated from the first bath solution comprising23. The process of claim 22 , wherein the plating metal is a Nickel-Boron alloy.24. The process of claim 22 , wherein the mixed solution has a pH of at least 13 and the metal substrate is immersed in the mixed solution for a period of between about 1 and 60 minutes.25. The process of claim 22 , wherein the mixed solution is ...

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22-08-2013 дата публикации

STABLE CATALYST FOR ELECTROLESS METALLIZATION

Номер: US20130216718A1
Принадлежит: Rohm and Haas Electronic Materials LLC

Catalysts include nanoparticles of catalytic metal and cellulose or cellulose derivatives. The catalysts are used in electroless metal plating. The catalysts are free of tin. 2. The aqueous catalyst of claim 1 , wherein at least one of R claim 1 , R claim 1 , R claim 1 , Rand Ris —CHCOOX or —C(O)—CH.3. The aqueous catalyst of claim 1 , wherein the nanoparticles are 1 nm to 1000 nm.4. The aqueous catalyst of claim 1 , wherein the cross-linking agent is chosen from one or more of haloepoxy compounds and di-epoxy compounds.6. The method of claim 5 , wherein the substrate comprises a plurality of through-holes.7. The method of claim 5 , wherein the electroless metal plating bath is chosen from a copper claim 5 , copper alloy claim 5 , nickel and nickel alloy bath.8. The method of claim 5 , wherein at least one of R claim 5 , R claim 5 , R claim 5 , Rand Ris —CHCOOX or —C(O)—CH.9. The method of claim 5 , wherein the cross-linking agent is chosen from one or more of haloepoxy compounds and di-epoxy compounds.10. The method of claim 5 , wherein the nanoparticles are 1 nm to 1000 nm. This application claims the benefit of priority under 35 U.S.C. §119(e) to U.S. Provisional Application No. 61/524,414, filed Aug. 17, 2011, the entire contents of which application are incorporated herein by reference.The present invention is directed to stable aqueous catalysts for electroless metallization. More specifically, the present invention is directed stable aqueous catalysts for electroless metallization which are tin free and are stabilized by cellulose and cellulose derivatives.Electroless metal deposition is a well-known process for depositing metallic layers on substrate surfaces. Electroless plating of a dielectric surface requires the prior application of a catalyst. The most commonly used method of catalyzing or activating dielectrics, such as non-conductive sections of laminated substrates used in the manufacture of printed circuit boards, is to treat the substrate with an ...

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22-08-2013 дата публикации

Method of metal deposition

Номер: US20130217227A1

A method of forming a metal layer on an electrically insulating substrate comprises depositing a photocatalyst layer onto the substrate and depositing a mask layer comprising voids on the substrate, such as a layer of latex microparticles with voids between them, to give an open pore structure to the mask. An electroless plating solution is then provided on the photocatalyst layer, and the photocatalyst layer and electroless plating solution are illuminated with actinic radiation whereby deposition of metal from the electroless plating solution to form a metal layer on the photocatalyst layer is initiated whereby the metal deposits in the voids of the mask layer. The mask layer is subsequently removed to leave a porous metal layer on the substrate. The method allows for deposition of porous metal films with controlled thickness and excellent adhesion onto electrically insulating substrates. The method is suitable for providing metal layers with controlled, regular porosity.

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19-09-2013 дата публикации

Process for production of functional device, process for production of ferroelectric material layer, process for production of field effect transistor, thin film transistor, field effect transistor, and piezoelectric inkjet head

Номер: US20130240871A1
Принадлежит: JAPAN SCIENCE AND TECHNOLOGY AGENCY

A method of producing a functional device according to the present invention includes, in this order: the functional solid material precursor layer formation step of applying a functional liquid material onto a base material to form a precursor layer of a functional solid material; the drying step of heating the precursor layer to a first temperature in a range from 80° C. to 250° C. to preliminarily decrease fluidity of the precursor layer; the imprinting step of imprinting the precursor layer that is heated to a second temperature in a range from 80° C. to 300° C. to form an imprinted structure on the precursor layer; and the functional solid material layer formation step of heat treating the precursor layer at a third temperature higher than the second temperature to transform the precursor layer into a functional solid material layer.

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26-09-2013 дата публикации

Method of coating a part of a heat exchanger and heat exchanger

Номер: US20130248157A1
Автор: Jie Zheng
Принадлежит: ALFA LAVAL CORPORATE AB

A method of coating an internal surface of an assembled heat exchanger is provided. The heat exchanger comprising a first passage for a first heat exchange fluid, and a second passage for a second heat exchange fluid. The first and second passages are separated by at least one heat transfer element. The heat transfer element has a first surface facing the first passage. The method comprises; pre-treating the first surface by circulating at least one pre-treatment liquid through the first passage of the heat exchanger and a pre-treatment liquid storage separate from the heat exchanger, and electroless nickel plating the first surface by circulating a solution comprising nickel ions through the first passage of the heat exchanger and a solution container separate from the heat exchanger. A heat exchanger comprising a nickel plating is also disclosed.

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03-10-2013 дата публикации

Ferroelectric thin film-forming sol-gel solution

Номер: US20130256580A1
Принадлежит: Mitsubishi Materials Corp

When a ferroelectric thin film-forming sol-gel solution contains a PZT-based compound, a viscosity-adjusting macromolecular compound including polyvinylpyrrolidone, and an organic dopant including a formamide-based solvent, the PZT-based compound is included at 17 mass % or more in terms of an oxide, the molar ratio of the polyvinylpyrrolidone to the PZT-based compound is PZT-based compound:polyvinylpyrrolidone=1:0.1 to 0.5 in terms of a monomer, and the formamide-based solvent is included at 3 mass % to 13 mass % of the sol-gel solution, it is possible to form a thick layer by coating the sol-gel solution once, the production efficiency improves, and crack-free and dense film formation even after calcination and firing becomes possible.

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03-10-2013 дата публикации

Apparatuses and Methods for Maskless Mesoscale Material Deposition

Номер: US20130260056A1
Принадлежит: Optomec Design Co, Optomec Inc

Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100° C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.

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17-10-2013 дата публикации

CERAMIC COATED RING AND PROCESS FOR APPLYING CERAMIC COATING

Номер: US20130273313A1
Принадлежит: Applied Materials, Inc.

To manufacture a ceramic coated article, at least one surface of a quartz substrate having a ring shape is roughened to a roughness of approximately 100 micro-inches (μin) to approximately 300 μin. The quartz substrate is then coated with a ceramic coating comprising a yttrium containing oxide. The quartz substrate is then polished. 1. A method of manufacturing an article , comprising:roughening at least one surface of a quartz substrate having a ring shape to a roughness of approximately 100 micro-inches (μin) to approximately 300 μin;coating the at least one surface of the quartz substrate with a ceramic coating comprising a yttrium containing oxide; andpolishing the ceramic coating.2. The method of claim 1 , further comprising:masking a side of the quartz substrate with a first mask prior to the roughening, wherein the masked side is not roughened;masking the side of the quartz substrate with a second mask prior to the coating, wherein the masked side is not coated; andremoving the second mask and cleaning the side of the quartz substrate with acetone prior to the polishing.3. The method of claim 2 , wherein the first mask is a hard mask claim 2 , the second mask is a soft mask claim 2 , and the masked side of the quartz substrate corresponds to an inner side of the quartz substrate's ring shape.4. The method of claim 1 , wherein the ceramic coating has a thickness of approximately 1-12 mil prior to the polishing and a thickness of approximately 1-10 mil after the polishing.5. The method of claim 1 , wherein coating the quartz substrate comprises:heating the quartz substrate to a temperature of approximately 10° C. to 300° C.; andplasma spraying the quartz substrate using a plasma spray power of approximately 50 kW to 90 kW.6. The method of claim 1 , wherein the quartz substrate is a process chamber component for covering a portion of an electrostatic chuck used in a plasma etch reactor.7. The method of claim 1 , wherein the ceramic coating is selected from a ...

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07-11-2013 дата публикации

Methods for improving corrosion resistance and applications in electrical connectors

Номер: US20130292161A1
Принадлежит: Tyco Electronics Corp

A method of manufacturing an electrical conductor includes providing a substrate layer, depositing a graphene layer on the substrate layer and selectively depositing boundary cappings on defects of the graphene layer to inhibit corrosion of the substrate layer at the defects. Optionally, the boundary cappings may include nano-sized crystals deposited only at the defects. The selectively depositing may include electrodepositing boundary cappings on exposed portions of the substrate layer at the defects. The selectively depositing may include reacting boundary capping material with exposed portions of the substrate layer at the defects to deposit the boundary cappings only at the defects.

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07-11-2013 дата публикации

ELECTROLESS COPPER PLATING BATH AND ELECTROLESS COPPER PLATING METHOD

Номер: US20130295294A1
Принадлежит: C. UYEMURA & CO., LTD.

Provided are an electroless copper plating bath and an electroless copper plating method using the electroless copper plating bath, the electroless copper plating bath not containing formaldehyde; being usable under approximately neutral pH conditions; improving plating bath stability; and capable of forming a plating film with a good thickness while controlling deposition outside a pattern. The electroless copper plating bath according to the present invention contains a water-soluble copper salt, and amine borane or a substituted derivative thereof as a reducing agent; does not contain formaldehyde; and has a pH of 4 to 9, wherein polyaminopolyphosphonic acid as a complexing agent, an anionic surface-active agent, an antimony compound, and a nitrogen-containing aromatic compound are contained. 1. An electroless copper plating bath , comprising a water-soluble copper salt , and amine borane or a substituted derivative thereof as a reducing agent;not comprising formaldehyde; and having a pH of 4 to 9, wherein polyaminopolyphosphonic acid as a complexing agent, an anionic surface active agent, an antimony compound, and a nitrogen-containing aromatic compound are comprised.2. The electroless copper plating bath according to claim 1 , wherein a concentration of the polyaminopolyphosphonic acid is 0.01 to 1 mol/L.3. The electroless copper plating bath according to claim 1 , wherein a concentration of the anionic surface active agent is 0.01 to 2000 mg/L.4. The electroless copper plating bath according to claim 1 , wherein a concentration of the antimony compound is 0.1 to 20 mg/L.5. The electroless copper plating bath according to claim 1 , wherein a concentration of the nitrogen-containing aromatic compound is 0.01 to 1000 mg/L.6. An electroless copper plating method claim 1 , wherein a copper plating film is formed on a base material by using the electroless copper plating bath according to .7. The electroless copper plating method according to claim 6 , wherein the ...

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14-11-2013 дата публикации

Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers

Номер: US20130299226A1
Принадлежит: Intel Corp

In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.

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14-11-2013 дата публикации

Method of forming low-resistance metal pattern, patterned metal structure, and display devices using the same

Номер: US20130299450A1
Принадлежит: Samsung Display Co Ltd

Disclosed herein is a method of forming low-resistance metal pattern, which can be used to obtain a metal pattern having stable and excellent characteristics by performing sensitization treatment using a copper compound before an activation treatment for forming uniform and dense metal cores, a patterned metal structure, and display devices using the same.

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21-11-2013 дата публикации

Autocatalytic plating bath composition for deposition of tin and tin alloys

Номер: US20130309404A1
Принадлежит: Atotech Deutschland GmbH and Co KG

An autocatalytic tin plating bath containing Sn 2+ ions, Ti 3+ ions as reducing agent, an organic complexing agent and phenanthroline or a derivative thereof as stabilizing agent is disclosed. The plating bath is suitable for manufacture of printed circuit boards, IC substrates and metallization of semiconductor wafers.

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28-11-2013 дата публикации

METHOD FOR DIRECT METALLIZATION OF NON-CONDUCTIVE SUBSTRATES

Номер: US20130316082A1
Принадлежит: ENTHONE INC.

The present invention relates to a method for direct metallization of non-conductive substrates as well as a conductor solution used in such a method. According to the invention, it is proposed to contact a non-conductive substrate surface after activation by a noble metal colloid-containing activator solution with a conductor solution, which comprises a metal that is reducible by a metal of the activator solution, a complexing agent and a reducing agent. 1. A method for direct metallization of a non-conductive substrate , comprising:contacting the substrate with an aqueous metal-containing activator formulation comprising a noble metal/metal-colloid, said noble metal/metal-colloid comprising a colloidal noble metal selected from the group consisting of gold, silver, platinum and palladium and oxidizable ions of a metal selected from the group consisting of iron, tin, lead, cobalt, and germanium, thereby depositing colloidal noble metal on the substrate and activating the substrate for deposition of another metal;contacting the activated substrate with a conductor solution comprising an ion of said another metal that is reducible by a metal ion of the activator formulation, a complexing agent, at least one Group IA or Group II metal ion selected from the group consisting of lithium, sodium, potassium, rubidium, cesium and beryllium, a counteranion selected from the group consisting of fluoride, chloride, bromide, iodide, nitrate, sulfate and combinations thereof, and a reducing agent other than formaldehyde, the ratio of the sum of the molar concentration(s) of said counteranion(s) to the sum the molar concentration(s) of all reducing agents for said reducible metal ion in said conductor solution at the time of initial contact with said activated substrate is between about 0.70 and about 50, preferably between about 2 and about 30, more preferably between about 5 and about 20, and the ratio of the total concentration of reducible metal cations to nickel ions is at ...

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05-12-2013 дата публикации

Zinc oxide film-forming composition, zinc oxide film production method, and zinc compound

Номер: US20130323413A1
Принадлежит: Adeka Corp

Disclosed are a composition for forming a zinc oxide-based film, said composition containing, as an essential component, a zinc compound represented by the following formula (1): wherein R 1 and R 2 mutually independently represent an alkyl group having 1 to 4 carbon atoms, a process for producing the zinc oxide-based film, and the zinc compound. The composition makes it possible to form a high-quality zinc oxide-based film, which has transparency, homogeneity and electrical conductivity, at a low temperature of 300° C. or lower.

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19-12-2013 дата публикации

HEAT PROTECTION GLAZING AND METHOD FOR PRODUCING SAME

Номер: US20130337393A1
Принадлежит: SCHOTT AG

A heat protection glazing is provided that includes an infrared-reflective coating on temperature resistant substrates, which are transparent in the visible spectral range. The coating is resistant and effective relative to long-term thermal loads. 118-. (canceled)19. A thermal process unit comprising:{'sup': '−6', 'a hot space and a window closing the hot space, the window comprising a heat protection glazing with a high-temperature infrared reflecting filter coating, wherein the heat protection glazing comprises a glass or glass-ceramic sheet having a linear coefficient of thermal expansion a of less than 4.2*10/K, wherein at least one surface of the glass or glass-ceramic sheet is coated with a titanium dioxide layer which is doped with a compound of at least one of transition metal selected from the group consisting of Nb, Ta, Mo, and V so that the titanium dioxide layer has a sheet resistance of not more than 2 MW, and wherein the titanium dioxide layer has a layer thickness of an optical thickness corresponding to a quarter wavelength of the maximum of a black body radiator at a temperature between 400° C. and 3000° C.'}20. The thermal process unit as claimed in claim 19 , wherein the titanium dioxide layer is doped with a transition metal oxide.21. The thermal process unit as claimed in claim 19 , wherein the titanium dioxide layer comprises at least one crystalline phase.22. The thermal process unit as claimed in claim 21 , wherein the titanium dioxide layer comprises an X-ray amorphous phase.23. The thermal process unit as claimed in claim 21 , wherein the titanium dioxide layer comprises an anatase crystalline phase.24. The thermal process unit as claimed in claim 23 , wherein the titanium dioxide layer further comprises an X-ray amorphous phase.25. The thermal process unit as claimed in claim 24 , wherein the X-ray amorphous phase has a substance amount fraction that is greater than a substance amount fraction of the anatase crystalline phase.26. The ...

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26-12-2013 дата публикации

Electroless Deposition of Platinum on Copper

Номер: US20130340648A1
Принадлежит: INTERMOLECULAR, INC.

Embodiments of the current invention describe a method of plating platinum selectively on a copper film using a self-initiated electroless process. In particular, platinum films are plated onto very thin copper films having a thickness of less than 300 angstroms. The electroless plating solution and the resulting structure are also described. This process has applications in the semiconductor processing of logic devices, memory devices, and photovoltaic devices. 1. An electroless plating solution , comprising:a platinum supply chemical mother solution having a pH between about 13 and about 14;a reducing agent comprising hydrazine; anddeionized water;{'sub': 2', '6', '2', '6, 'sup': '2−', 'wherein the platinum supply chemical mother solution comprises chloroplatinic acid (HPtCl) and hydrogen hexahydroxyplatinate (HPt(OH));'}wherein a platinum concentration in the electroless plating solution is between about 2 mM and about 50 mM; andwherein a hydrazine concentration in the electroless plating solution is between about 0.1M and about 1M. [0015] [0016] [0017]2. The electroless plating solution of claim 1 , further comprising an accelerator. [0015]3. The electroless plating solution of claim 2 , wherein the accelerator comprises a derivative of aliphatic sulfonic acid. [0017]4. The electroless plating solution of claim 2 , wherein a concentration of the accelerator is between about 0.001 and about 0.5M. [0017]5. The electroless plating solution of claim 1 , further comprising a stabilizer. [0015]6. The electroless plating solution of claim 5 , wherein the stabilizer comprises about 2 mM to about 20 mM 5-sulfosalicylic acid and about 1 mM to about 10 mM EDTA. [0018]7. The electroless plating solution of claim 5 , wherein the stabilizer comprises about 5 mM to about 50 mM hydroxyl amine. [0018]8. The electroless plating solution of claim 1 , further comprising a surfactant. [0015]9. The electroless plating solution of claim 8 , wherein the surfactant comprises about 2 ppm ...

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26-12-2013 дата публикации

AUTOCATALYTIC ELECTROLESS COPPER USING HYPOPHOSPHITE REDUCER

Номер: US20130344235A1
Автор: Grunwald John J.
Принадлежит:

This invention discloses compositions and methods that afford sustainable deposition of electroless copper coatings, using aqueous hypophosphite compositions as opposed to formaldehyde (FA) 1. An aqueos alkaline electroless copper composition comprising copper or silver ions , at least three complexing agents , and hypophosphite.2. An aqoueous alkaline electroless copper plating composition comprising copper ions , nickel ions , at least two complexing agents , one of which is MEA and sodium hypophosphite.3. An aqueous composition according to claim 1 , comprising at least four complexing agents.4. An aqueous composition according to claim 2 , wherein copper ions are replaced by silver ions.5. An aqoueos composition according to claim 1 , wherein at least one com plexor is a hydroxy acid.6. An aqueous composition according to claim 1 , wherein at least one of the complexors is an amine.7. An aqueous solution according to claim 1 , wherein the complexing agents are aliphatic.8. The method of depositing electroless copper or silver on a solid substrate by immersing said substrate in any one composition of .9. The method of claim 8 , wherein said substrate is kept stationary for at least 30 seconds following immersion in the coppper solution.10. The method of plating electroless copper on a solid substrate according to claim 1 , wherein plating is carried out in a horizontal conveyorized automatic plating machine.11. The method of plating electroless copper on a solid substrate according to claim 2 , wherein plating is carried out in a horizontal conveyorized automatic plating machine.1211. The method of plating electroless copper on a solid substrate according to claim 3 , wherein plating is carried out in a horizontal conveyorized automatic plating machine .13. The method of plating electroless copper on a solid substrate according to claim 4 , wherein plating is carried out in a horizontal conveyorized automatic plating machine.14. The method of plating electroless ...

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26-12-2013 дата публикации

METHOD FOR COATING SURFACES AND USE OF THE ARTICLES COATED USING SAID METHOD

Номер: US20130344310A1
Принадлежит: Chemetall GmbH

A method for electroless coating of substrates by applying an activating coat of polyelectrolyte or salt with a first aqueous composition; rinsing the activating coat such that the activating coat not being entirely removed; contacting and coating of the activated surfaces that have remained after rinsing with an aqueous composition in the form of a solution, emulsion or suspension, to form an organic secondary coat; and drying. The activating coat is a solution, emulsion or suspension containing a anionic polyelectrolyte or at least one anionic salt in solution in water. The aqueous composition forming the secondary coat has constituents which can be precipitated, deposited or salted out and which are anionically, zwitterionically, sterically or cationically stabilized. The dry film formed in the process, comprising the activating coat and the secondary coat, has a thickness of at least 1 μm. 115.-. (canceled)16. A method for electroless coating of substrates , comprising the steps of:I. providing of a substrate,II. optionally cleaning the substrate,III. applying an activating coat of polyelectrolyte and salt with a first aqueous composition,IV. optional intermediate drying of the activating coat,V. rinsing the activating coat, the activating coat not being entirely removed,VI. contacting and coating of the activated surfaces that have remained after rinsing, with an aqueous composition in the form of a solution, emulsion and/or suspension, to form an organic secondary coat (=precipitation coat),VII. optionally rinsing of the secondary coat, andVIII. optionally drying of the secondary coat,wherein an activating coat is formed with an aqueous activating agent in the form of a solution, emulsion/or suspension which comprises at least one anionic polyelectrolyte or at least one anionic salt in solution in water,wherein the aqueous composition to form a secondary coat has constituents which can be precipitated, deposited and/or salted out and which are anionically, ...

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16-01-2014 дата публикации

Deposition Of N-Metal Films Comprising Aluminum Alloys

Номер: US20140017408A1
Принадлежит: Individual

Provided are methods of depositing films comprising alloys of aluminum, which may be suitable as N-metal films. Certain methods comprise exposing a substrate surface to a metal halide precursor comprising a metal halide selected from TiCl 4 , TaCl 5 and HfCl 4 to provide a metal halide at the substrate surface; purging metal halide; exposing the substrate surface to an alkyl aluminum precursor comprising one or more of dimethyaluminum hydride, diethylhydridoaluminum, methyldihydroaluminum, and an alkyl aluminum hydrides of the formula [(CxHy) 3-a AlH a ] n , wherein x has a value of 1 to 3, y has a value of 2x+2, a has a value of 1 to 2, and n has a value of 1 to 4; and exposing the substrate surface to an alane-containing precursor comprising one or more of dimethylethylamine alane, methylpyrrolidinealane, di(methylpyrolidine)alane, and trimethyl amine alane borane. Other methods comprise exposing a substrate surface to a metal precursor and trimethyl amine alane borane.

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16-01-2014 дата публикации

INSULATING BASE PLATED WITH METAL LAYER, PLATING METHOD THEREOF, AND TRANSPARENT ELECTRODE INCLUDING INSULATING BASE

Номер: US20140017508A1
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Disclosed herein are an insulating base plated with a metal layer, a plating method thereof, and a transparent electrode including the insulating base. During the manufacture of a polymer layer, a structure of an interface layer between a surface of the polymer layer and a metal layer is modified, adhesion with metal is excellent and the polishability of the interface layer is reduced, and thus, the reflectivity of the metal layer is reduced and particular color impression of metal is reduced to obtain black-oxide treated properties. When the metal layer formed on the insulating base is used in a mesh-type transparent electrode having a fine pattern, sufficient adhesion with metal for forming a pattern is obtained and the reflectivity of an adhesion layer of the metal layer is reduced, thereby increasing the visibility. Accordingly, the insulating base may be suitable for products such as transparent electrodes or touch panels. 1. An insulating base , comprising:an insulating base layer;an interface layer that is formed on the insulating base layer, has a thickness of 40 to 80 nm and has pores with a size of 20 to 200 nm and porosity of 30 to 50%; anda metal layer plated on the interface layer.2. The insulating base as set forth in claim 1 , wherein the insulating base layer has a surface arithmetic mean roughness (Ra) of 100 nm or less.3. The insulating base as set forth in claim 1 , wherein the insulating base layer is a transparent insulating base layer claim 1 , andwherein an adhesive surface between the interface layer and the metal layer is plated with a metal layer that has a color difference value having ΔE*ab of 50 or less and C*ab of 20 or less.4. The insulating base as set forth in claim 1 , wherein the insulating base includes any one of polyethyleneterephthalate (PET) claim 1 , polyimide (PI) claim 1 , polycarbonate (PC) claim 1 , and a triacetylcellulose (TAC) film.5. The insulating base as set forth in claim 1 , wherein a surface of the insulating ...

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23-01-2014 дата публикации

Metallic nanoparticle synthesis with carbohydrate capping agent

Номер: US20140024026A1
Принадлежит: Michigan State University MSU

The disclosure relates to metal nanoparticle compositions and their methods of formation and use, in particular gold nanoparticles (AuNP) and gold-coated magnetic nanoparticles. Compositions according to the disclosure include aqueous suspensions of metal nanoparticles that are stabilized with one or more carbohydrate capping agents and/or that are functionalized with one or more binding pair members for capture/detection of a target analyte. The nanoparticle suspensions are stable for extended periods and can be functionalized as desired at a later point in time, typically prior to use in an assay for the detection of a target biological analyte. The stable nanoparticle suspension can be formed by the aqueous reduction of oxidized metal precursors at non-acidic pH values in the presence of a carbohydrate-based capping agent such as dextrin or other oligosaccharides.

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30-01-2014 дата публикации

Method of manufacturing copper electrode

Номер: US20140030658A1
Принадлежит: EI Du Pont de Nemours and Co

A method for manufacturing an electrode comprising the steps of: applying onto a substrate a conductive paste to form a conductive paste layer comprising; (i) 100 parts by weight of a copper powder coated with a metal oxide selected from the group consisting of silicon oxide (SiO 2 ), zinc oxide (ZnO), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), magnesium oxide (MgO) and a mixture thereof; (ii) 5 to 30 parts by weight of a boron powder; and (iii) 0.1 to 10 parts by weight of a glass frit; dispersed in (iv) an organic vehicle; and firing the conductive paste in air.

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20-02-2014 дата публикации

Aluminum precursor composition

Номер: US20140050848A1
Принадлежит: UP Chemical Co Ltd

The present disclosure is related to an aluminum-containing precursor composition, especially a precursor composition which is vaporized to be used for vapor phase deposition processes such as chemical vapor deposition (CVD) or atomic layer deposition (ALD).

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20-03-2014 дата публикации

Tribologically Loadable Mixed Noble Metal/Metal Layers

Номер: US20140076798A1
Автор: Stefan Koppe
Принадлежит: Schauenburg Ruhrkunststoff GmbH

The invention relates to a method for producing a noble metal/metal layer, which has particularly advantageous tribological properties, comprising the following steps: providing a bath for the currentless deposition of a metal layer, which additionally contains at least one type of noble metal ions; introducing a substrate into the bath; and applying a voltage.

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27-03-2014 дата публикации

PLATING CATALYST AND METHOD

Номер: US20140087062A1
Принадлежит:

Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices. 2. The method of wherein the pH is 7.5 to 14.3. The method of wherein the zero-valent metal and stabilizer compound are in a molar ratio of from 1:1 to 1:20.4. The method of further comprising the step of contacting the surface of the through-holes with an oxidizing agent prior to step (b).5. The method of further comprising the step of contacting the surface of the through-holes with a surfactant prior to step (b).6. The method of wherein the metal is selected from the group consisting of copper claim 1 , nickel claim 1 , gold claim 1 , silver and copper/nickel alloys.7. The method of further comprising a step of electrolytically depositing a second metal onto the electrolessly deposited metal of step (c).8. The method of wherein the second metal is selected from the group consisting of copper claim 6 , copper alloys claim 6 , tin and tin alloys. This application is a divisional of application Ser. No. 12/968,219, filed on Dec. 14, 2010.The present invention generally relates to the field of electroless metal plating, and more specifically to the field of catalysts useful in electroless metal plating of non-conductive substrates used in the manufacture of electronic devices.Printed circuit boards include laminated non-conductive dielectric substrates that rely on drilled and plated through-holes to form connections between opposite sides of the circuit board or between innerlayers of the board. Electroless metal plating is well known for preparing metallic coatings on surfaces. Electroless metal plating of dielectric surfaces requires the prior deposition of a catalyst. A common method used to catalyze or activate laminated non-conductive dielectric substrates, prior to electroless plating, is to ...

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27-03-2014 дата публикации

ELECTRODE PAD, PRINTED CIRCUIT BOARD USING THE SAME, AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

Номер: US20140087205A1
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer. 1. An electrode pad , comprising:a connection terminal part;a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; anda second plating layer including palladium (Pd) formed on the first plating layer.2. The electrode pad of claim 1 , wherein the connection terminal part includes copper (Cu).3. The electrode pad of claim 1 , wherein a content of phosphorus (P) included in the palladium phosphorus (Pd—P) is 0.1 to 6 wt %.4. The electrode pad of claim 1 , wherein a thickness of the first plating layer is 0.01 to 0.5 μm.5. The electrode pad of claim 1 , wherein the second plating layer is formed of pure palladium (Pd).6. The electrode pad of claim 1 , wherein a thickness of the second plating layer is 0.01 to 0.5 μm.7. The electrode pad of claim 1 , further comprising a third plating layer including gold (Au) formed on the second plating layer.8. The electrode pad of claim 7 , wherein a thickness of the third plating layer is 0.01 to 0.5 μm.9. A printed circuit board claim 7 , comprising:an insulating substrate;a connection terminal part formed on the insulating substrate;a first plating layer including palladium phosphorus (Pd—P) formed on the insulating substrate and an outer side of the connection terminal part; anda second plating layer including palladium (Pd) formed on the insulating substrate and an outer side of the first plating layer.10. The printed circuit board of claim 9 , wherein the connection terminal part includes copper (Cu).11. The printed circuit board of claim 9 , wherein a content of phosphorus (P) included in the palladium phosphorus (Pd—P) is 0.1 to 0.6 wt %.12. A method of manufacturing a printed circuit board claim 9 , the method comprising: ...

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27-03-2014 дата публикации

Method of depositing metallic layers based on nickel or cobalt on a semiconducting solid substrate; kit for application of said method

Номер: US20140087560A1
Принадлежит: Alchimer SA

The present invention relates to a kit intended for the deposition of nickel or cobalt in the cavities of a semiconductor substrate intended to form through-silicon vias (TSV) for making interconnections in integrated circuits in three dimensions. The invention also relates to a method of metallization of the insulating surface of such a substrate which comprises contacting the surface with a liquid aqueous solution containing: at least one metal salt of nickel or cobalt; at least one reducing agent; at least one polymer bearing amine functions, and at least one agent stabilizing the metal ions. The step coverage of the layer of nickel or cobalt obtained can be greater than 80%, which facilitates subsequent filling of the vias with copper by electrodeposition.

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03-04-2014 дата публикации

ELECTRICAL DEVICE WITH TEETH JOINING LAYERS AND METHOD FOR MAKING THE SAME

Номер: US20140091053A1
Принадлежит:

A multilayer electrical device, such as a printed circuit board, having a tooth structure including a metal layer set in a dielectric. The device includes a base; a conductive layer adjacent to the base; a dielectric material adjacent to conductive layer; a tooth structure including a metal layer set in the dielectric material to join the dielectric material to the metal layer; and wherein the metal layer forms a portion of circuitry. 1. (canceled)2. A process of making an article of manufacture , the process comprising:implementing a circuit design for an electrical device by coupling a dielectric material delivered with solid content sufficient that etching the dielectric material forms a non-uniformly roughened surface of cavities located in, and underneath an initial surface of, the dielectric material, sufficient that the etching of the dielectric material uses non-homogeneity with the solid content in bringing about formation of the non-uniformly roughened surface of the cavities and sufficient that the etching of the dielectric material is such that a plurality of the cavities have a cross-sectional width that is greater than a maximum depth with respect to the initial surface, wherein the etching forms the non-uniformly roughened surface of cavities, witha conductive material, a portion of the conductive material in the cavities thereby forming numerous sized and shaped teeth in the cavities, in circuitry of the electrical device.3. A process of making an article of manufacture , the process comprising:implementing a circuit design for an electrical device by coupling a dielectric material delivered with solid content sufficient that etching the dielectric material forms a non-uniformly roughened surface comprising cavities located in, and underneath a surface of, the dielectric material, and sufficient that the etching of the dielectric material uses non-homogeneity with the solid content in bringing about formation of the non-uniformly roughened surface ...

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10-04-2014 дата публикации

Recovery method of nickel from spent electroless nickel plating solutions by electrolysis

Номер: US20140097094A1

A recovery method of nickel according to the present invention comprises pretreatment step to prepare a solution for electrolysis by adding hexanesulfonate salt to a treatment solution including nickel, and nickel recovery step to recover nickel in a metal form by electrolysis of the above solution for electrolysis. The present invention can produce nickel in high purity with simple process with low cost, and can recover and reproduce nickel in a metal form with at least 99.5% of high purity and at least 90% of recovery rate.

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01-01-2015 дата публикации

PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES

Номер: US20150001177A1
Автор: Middeke Hermann
Принадлежит:

The present invention relates to a process for metallizing electrically nonconductive plastic surfaces of articles. During the process, the rack to which the said articles are fastened is subjected to a treatment for protection against metallization. Subsequently, the articles are metallized by means of known processes, wherein the racks remain free of metal.

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05-01-2017 дата публикации

THERMAL ACOUSTIC INSULATION BLANKETS

Номер: US20170001709A1
Принадлежит: SOLVAY SPECIALTY POLYMERS ITALY S.P.A.

The present invention pertains to an insulation system comprising one or more insulation blankets, wherein each of said multilayer insulation blankets comprises: —a core consisting of an insulation material [material (I)], and —a shell encapsulating said core, said shell comprising at least one multilayer assembly comprising: (1) an outer layer [layer (L1)] consisting of a composition [composition (C1)] comprising, preferably consisting of at least one thermoplastic polymer [polymer (1)] having a limiting oxygen index (LOI) of at least 20% by volume, wherein at least one surface, preferably the inner surface, of said layer (L1) comprises one or more grafted functional groups [surface (L1-f)], (2) directly adhered to said at least one surface (L1-f), a layer consisting of at least one metal compound (M1) [layer (L2)], and (3) optionally, directly adhered to the opposite side of the layer (L2), a layer consisting of at least one metal compound (M2) [layer (L3)], said metal compound (M2) being equal to or different from said metal compound (M1). The present invention also pertains to a process for the manufacture of said insulation system and to uses of said insulation system in various applications including aircraft applications. 1. A process for the manufacture of an insulation system comprising one or more insulation blankets , said process comprising:encapsulating a core consisting of an insulation material (I) with a shell comprising a multilayer assembly, said multilayer assembly being obtainable by:treating at least one surface of a layer (L1) by a radio-frequency glow discharge process in the presence of an etching gas medium, wherein layer (L1) consists of a composition (C1) comprising at least one thermoplastic polymer (1) having a limiting oxygen index (LOI) of at least 20% by volume,applying by electroless deposition a layer (L2) onto said at least one treated surface of layer (L1), wherein layer (L2) consists of at least one metal compound (M1), ...

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05-01-2017 дата публикации

BLISTER PACKAGES

Номер: US20170001781A1
Принадлежит: SOLVAY SPECIALTY POLYMERS ITALY S.P.A.

The present invention pertains to a process for packaging one or more products, said process comprising the following steps: (i) providing a package having an opening, said package comprising at least one sheet, said sheet comprising the following layers: a layer [layer (L1)] consisting of a composition [composition (C1)] comprising, preferably consisting of, at least one thermoplastic polymer [polymer (T1)], said layer (L1) having two opposite surfaces, wherein one surface comprises one or more grafted functional groups [surface (L1-S1-f)], directly adhered to the surface (L1-S1-f), a layer [layer (L2)] consisting of at least one metal compound [compound (M1)], and optionally, directly adhered to the layer (L2), a layer (L3) consisting of a composition [composition (C3)] comprising, preferably consisting of at least one thermoplastic polymer [polymer (T2)], said polymer (T2) being equal to or different from the polymer (T1); (ii) feeding the package provided in step (i) with one or more products; and (iii) sealing the package provided in step (ii). The present invention also pertains to said package, to a process for the manufacture of said package and to uses of said package in various applications. 1. A process for manufacturing a package , said process comprising:treating one surface of a layer (L1) with a radio-frequency glow discharge process in the presence of an etching gas medium, wherein layer (L1) is part of a sheet, wherein layer (L1) consists of a composition (C1) comprising, at least one thermoplastic polymer (T1), and wherein layer (L1) has two opposite surfaces;applying by electroless deposition a layer (L2) onto the surface of the layer (L1), said layer (L2) consisting of at least one metal compound (M1);optionally, directly adhering to layer (L2), a layer (L3) consisting of a composition (C3) comprising at least one thermoplastic polymer (T2), said polymer (T2) being equal to or different from polymer (T1); andshaping the sheet, thereby providing a ...

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05-01-2017 дата публикации

HIGH MODULUS LASER DIRECT STRUCTURING POLYCARBONATE COMPOSITES WITH ENHANCED PLATING PERFORMANCE AND BROAD LASER WINDOW BY REFLECTION ADDITIVES

Номер: US20170002193A1
Принадлежит:

The present disclosure relates to a polymer composition comprising a polycarbonate polymer, a laser direct structuring additive capable of being activated by electromagnetic radiation and thereby forming elemental metal nuclei, and a reflection additive. Also disclosed is a method for making the disclosed polymer composition and an article of manufacture comprising the disclosed polymer composition. 1. A polymer composition comprising:a polycarbonate polymer;a laser direct structuring additive capable of being activated by electromagnetic radiation and thereby forming elemental metal nuclei; anda reflection additive, wherein the polymer composition is capable of being plated after being activated using a laser.2. The polymer composition of claim 1 , wherein the laser direct structuring additive comprises a heavy metal mixture oxide spinel or a copper salt or a combination thereof.3. The polymer composition of claim 2 , wherein the copper salt comprises a copper hydroxide phosphate.4. The polymer composition of any of - claim 2 , wherein the reflection additive comprises titanium oxide or aluminum or a combination thereof.5. The polymer composition of any of - claim 2 , wherein the polycarbonate polymer comprises a bisphenol A polycarbonate polymer.6. The polymer composition of claim 5 , wherein the bisphenol A polycarbonate polymer comprises a blend of at least two different bisphenol A polycarbonates.7. The polymer composition of any of - claim 5 , wherein the polycarbonate polymer is present in an amount in the range from about 10 weight % to about 90 weight % relative to the total weight of the polymer composition claim 5 , and wherein the combined weight percent value of all components is 100.8. The polymer composition of any of - claim 5 , wherein the laser direct structuring additive is present in an amount in the range from about 1 weight % to about 10 weight % relative to the total weight of the polymer composition claim 5 , and wherein the combined weight ...

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07-01-2016 дата публикации

METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE STRUCTURE ON A NON-CONDUCTIVE SUBSTRATE MATERIAL, AND ADDITIVE AND SUBSTRATE MATERIAL INTENDED THEREFOR

Номер: US20160002791A1
Принадлежит:

A method for producing an electrically conductive structure, e.g., a conducting track, on a non-conductive substrate material, having an additive () having at least one metal compound. The substrate material may be irradiated using a laser to selectively activate the metal compounds, for example inorganic metal compounds, contained in the additive (). The metal seeds formed by the activation are then metallized to create the electrically conductive structure on the substrate material. Because the additive () has a preferably full-surface coating before the additive is introduced into the substrate material, such that the additive () is reduced and the coating is oxidized by the laser activation, the reaction partners necessary for the required chemical reaction with the additive () are provided by the coating. Because of the thereby significantly reduced interaction with the substrate material, the limitation to certain plastics or plastic groups also is lifted. 1. A method for producing an electrically conductive structure on a non-conductive substrate material , the method comprising:irradiating, using a laser, the substrate material, which comprises an additive comprising a first region, comprising a metal compound, and a second region, thereby selectively activating the metal compound in the additive;forming catalytically active seeds in regions, which are laser activated;reducing an oxidation number of a metal in a different chemical composition in the second region, which is laser activated; andthen, metallizing the regions comprising catalytically active seeds, thereby creating the electrically conductive structure on the non-conductive substrate material.2. The method of claim 1 , wherein the metal compound forms core of the additive claim 1 , andwherein the core is surrounded at least in portions by the second region.3. The method of claim 1 , wherein the metal compound is penetrated at least in portions by the second region.4. The method of claim 1 , ...

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04-01-2018 дата публикации

IMPELLER FOR ROTARY MACHINE, COMPRESSOR, SUPERCHARGER, AND METHOD FOR PRODUCING IMPELLER FOR ROTARY MACHINE

Номер: US20180002812A1
Принадлежит: MITSUBISHI HEAVY INDUSTRIES, LTD.

An impeller for a rotary machine includes: a base material of the impeller comprising Al or an Al alloy; a surface layer for the impeller formed by an electroless plating layer comprising a Ni—P based alloy; and an under layer disposed between the base material and the surface layer, the under layer having a smaller Vickers hardness than the surface layer. 116-. (canceled)17. An impeller for a rotary machine , comprising:a base material of the impeller comprising Al or an Al alloy;a surface layer for the impeller formed by an electroless plating layer comprising a Ni—P based alloy; andan under layer disposed between the base material and the surface layer, the under layer having a smaller Vickers hardness than the surface layer,wherein the surface layer has a P content rate of not less than 4 wt % and not more than 10 wt %.18. The impeller for a rotary machine according to claim 17 , wherein the surface layer has an amorphous structure.19. An impeller for a rotary machine claim 17 , comprising:a base material of the impeller comprising Al or an Al alloy;a surface layer for the impeller formed by an electroless plating layer comprising a Ni—P based alloy; andan under layer disposed between the base material and the surface layer, the under layer having a smaller Vickers hardness than the surface layer,wherein the under layer comprises a plating layer containing Ni.20. The impeller for a rotary machine according to claim 19 , wherein the plating layer serving as the under layer comprises a Ni—P based alloy having an amorphous structure claim 19 , the Ni—P based alloy having a P content rate of not less than 10 wt % and not more than 13 wt % in the under layer.21. The impeller for a rotary machine according to claim 19 , wherein the Ni plating layer serving as the under layer is an electrolytic plating layer having a Vickers hardness of not more than 350 HV.22. The impeller for a rotary machine according to claim 17 , wherein the under layer is a plating layer ...

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02-01-2020 дата публикации

METHOD FOR NO-SILANE ELECTROLESS METAL DEPOSITION USING HIGH ADHESIVE CATALYST AND PRODUCT THEREFROM

Номер: US20200002817A1
Принадлежит:

A method for electroless metal deposition and an electroless metal layer included substrate are provided. The method for electroless metal deposition includes steps as follows. a) cleaning a substrate, applying a hydrofluoric acid onto the substrate; and then applying a modifying agent onto the substrate to form a chemical oxide layer on the substrate; b) a catalyst layer is formed on the chemical oxide layer, wherein, the catalyst layer includes a plurality of colloidal nanoparticles, and each of the plurality of colloidal nanoparticles includes a palladium nanoparticle and a polymer which encapsulates the palladium nanoparticle, and c) depositing a metal on the catalyst layer through an electroless metal deposition to form an electroless metal layer. 1. A method for electroless metal deposition , comprising:a) cleaning a substrate, applying a hydrofluoric acid onto the substrate, and then applying a modifying agent onto the substrate to form a chemical oxide layer on the substrate;b) forming a catalyst layer on the chemical oxide layer, wherein the catalyst layer includes a plurality of colloidal nanoparticles, and each of the plurality of colloidal nanoparticles includes a palladium nanoparticle and a polymer which encapsulates the palladium nanoparticle, andc) depositing a metal on the catalyst layer through an electroless metal deposition to form an electroless metal layer.2. The method for electroless metal deposition as claimed in claim 1 , wherein in the step a) claim 1 , the modifying agent is selected from the group consisting of: ozone claim 1 , nitrate claim 1 , hydrofluoric acid claim 1 , mixture of sulfuric acid and hydrogen peroxide claim 1 , and mixture of nitrate and hydrofluoric acid.3. The method for electroless metal deposition as claimed in claim 1 , wherein the step b) further includes using a protective agent and a precursor to form the catalyst layer on the chemical oxide layer claim 1 , and the protective agent and the precursor have a ...

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01-01-2015 дата публикации

PROCESS FOR SMOOTHING THE SURFACE OF A PART MADE OF CMC MATERIAL

Номер: US20150004324A1
Принадлежит:

A method of smoothing the surface of a ceramic matrix composite material part that presents a surface that is undulating and rough. The method includes depositing a refractory vitreous coating on the surface of the part, the vitreous coating essentially containing silica, alumina, baryte, and lime. 1. A method of smoothing the surface of a ceramic matrix composite material part that presents a surface that is undulating and rough , the method comprising depositing a refractory vitreous coating on the surface of the part , the vitreous coating comprising silica , alumina , BaO , and lime , and wherein the vitreous coating comprises , in percentages by weight , 55% to 70% of silica , 5% to 20% of alumina , 5% to 15% of BaO and 5% to 10% of lime.2. A method according to claim 1 , further comprising claim 1 , prior to depositing the vitreous coating on the surface of the part claim 1 , forming a ceramic coating made by applying a liquid composition to the surface of the part claim 1 , the liquid composition containing a ceramic precursor polymer and a solid refractory filler claim 1 , curing the polymer claim 1 , and transforming the cured polymer into ceramic by heat treatment.3. A method according to wherein the part comprises carbon fiber reinforcement densified by a silicon carbide matrix.4. A method according to claim 1 , wherein the part comprises carbon fiber reinforcement densified by a silicon-based matrix.5. A method according to claim 1 , wherein the vitreous coating also contains at least one additional compound selected at least from an alkaline-earth oxide and an alkali oxide.6. A method according to claim 1 , wherein the vitreous coating presents a coefficient of thermal expansion departing by no more than ±0.5×10Kfrom the coefficient of thermal expansion of the CMC material of the part.7. A method according to claim 1 , wherein the vitreous coating presents a melting temperature greater than or equal to 1300° C.8. A method according to claim 1 , wherein ...

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01-01-2015 дата публикации

INK COMPOSITION FOR MAKING A CONDUCTIVE SILVER STRUCTURE

Номер: US20150004325A1
Принадлежит:

An ink composition for making a conductive silver structure comprises a silver salt and a complex of (a) a complexing agent and a short chain carboxylic acid or (b) a complexing agent and a salt of a short chain carboxylic acid, according to one embodiment. A method for making a silver structure entails combining a silver salt and a complexing agent, and then adding a short chain carboxylic acid or a salt of the short chain carboxylic acid to the combined silver salt and a complexing agent to form an ink composition. A concentration of the complexing agent in the ink composition is reduced to form a concentrated formulation, and the silver salt is reduced to form a conductive silver structure, where the concentrated formulation and the conductive silver structure are formed at a temperature of about 120° C. or less. 1. An ink composition for making a conductive silver structure , the ink composition comprising:a silver salt; anda complex of (a) a complexing agent and a short chain carboxylic acid or (b) a complexing agent and a salt of a short chain carboxylic acid.2. The ink composition of claim 1 , wherein the short chain carboxylic acid is selected from the group consisting of formic acid claim 1 , acetic acid claim 1 , propionic acid claim 1 , pentanoic acid claim 1 , and butyric acid.3. The ink composition of claim 2 , wherein the short chain carboxylic acid is formic acid.4. The ink composition of claim 1 , wherein the complexing agent is selected from the group consisting of an alkyl amine and ammonia.5. The ink composition of claim 4 , wherein the alkyl amine is selected from the group consisting of methylamine claim 4 , ethylamine claim 4 , propylamine claim 4 , butylamine claim 4 , and amylamine.6. The ink composition of claim 1 , wherein the silver salt is selected from the group consisting of silver acetate claim 1 , silver formate claim 1 , silver carbonate claim 1 , silver fluoride claim 1 , silver nitrate claim 1 , silver nitrite claim 1 , silver ...

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07-01-2021 дата публикации

COMPOSITE MEMBER AND METHOD OF MANUFACTURING COMPOSITE MEMBER

Номер: US20210002769A1
Принадлежит:

A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coating layer includes a metal coating portion, and a grain coating portion. A ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80. The coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm. 1. A composite member comprising: a plurality of diamond grains, and', 'a metal phase that bonds the diamond grains; and, 'a substrate formed of a composite material containing'}a coating layer made of metal and coating at least a part of a surface of the substrate, wherein a surface of the metal phase, and', 'a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase,, 'the surface of the substrate includes'} a metal coating portion coating the surface of the metal phase, and', 'a grain coating portion coating the protrusion and not coating the surface of the metal phase,, 'in a plan view, the coating layer includes'}a ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80, andthe coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm.2. The composite member according to claim 1 , whereinmetal that forms the metal phase is silver or a silver alloy.3. The composite member according to claim 1 , whereinthe metal that forms the coating layer is a nickel alloy containing phosphorus.4. A method of manufacturing a composite member claim 1 , the method comprising:etching a surface of a material plate formed of a ...

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03-01-2019 дата публикации

PRETREATMENT OF PLASTIC SURFACES FOR METALLIZATION TO IMPROVE ADHESION

Номер: US20190003057A1
Принадлежит:

The present invention relates to the adhesional pretreatment of plastics surface prior to their metallization by chemical or electrochemical methods and may be used in those industrial fields where decorative or functional metalic coatings on top of the plastic surfaces are needed. The purpose of the proposed invention is a high-quality adhesional pretreatment of plastic surface prior to metallization. The purpose is achieved by treating the plastic before to etch it 5-15 min at 50-70° C. in the alcaline permanganic solution containing 1-3M NaOH and 0.1-0.5 M permanganate ions and acidic permanganic etching solution additionally contains 0.5-8.0 M of copper nitrate and the etching is performed at room temperature during 5-60 min. 1. A method for adhesional pretreatment of plastic surfaces prior to their metallization comprising its etching with acidic permanganic solution, characterized in that the plastic before etching is maintained 5-15 minutes at 50-70° C. in an alcaline permanganic solution containing 1-3 M NaOH and 0.1-0.5 permanganate ions while 0.5-8.0 M of copper nitrate are additionally introduced into acidic permanganic etching solution and the etching is performed at room temperature for 5-60 minutes. The present invention relates to the adhesional pretreatment of plastics surface prior to their metallization by chemical or electrochemical methodes and may be used in those industrial fields where decorative or functional metalic coatings on top of the plastic surfaces are needed.A conventional method of plastic surface pretreatment prior to metallization consist of etching the surface with solution containing permanganate or other Mn ions which are the etchants-oxydizers. Permanganate as oxidizing agent is commonly proposed to be used in the acidic media, because only in this case the surfaces of acrylo-nitryl-butadien-styrene copolymere (ABS), ABS mixed with polycarbonate (PC/ABS), polyetherimides (PEI) and polyetheretherketones (PEEK) are able to be ...

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04-01-2018 дата публикации

PRINTED CIRCUIT BOARD PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

Номер: US20180004031A1
Принадлежит:

A display device includes a display substrate including a display area and a pad region, a first pad portion including a plurality of first pad terminals, the plurality of first pad terminals being arranged in a first direction, and a printed circuit board (PCB) including a base film and a second pad portion. The second pad is electrically connected to the first pad portion. The second pad portion includes a plurality of second pad terminals electrically connected to the plurality of first pad terminals, and a plurality of first test lines. The plurality of second pad terminals includes a plurality of sub-pad terminals. One of the plurality of first lines is connected to a first sub-pad terminal of the plurality of sub-pad terminals, and a second sub-pad terminal of the plurality of sub-pad terminals is not connected to any of the plurality of first lines. 1. A display device , comprising:a display substrate including a display area for displaying an image and a pad region disposed at a side of the display area;a first pad portion including a plurality of first pad terminals, the first pad portion being disposed in the pad region, the plurality of first pad terminals being arranged in a first direction; anda printed circuit board (PCB) including a base film and a second pad portion, wherein the second pad portion is disposed at a side of the base film and is electrically connected to the first pad portion, a plurality of second pad terminals electrically connected to the plurality of first pad terminals; and', 'a plurality of first test lines,', 'wherein the plurality of second pad terminals includes a plurality of sub-pad terminals,', 'wherein one of the plurality of first test lines is connected to a first sub-pad terminal of the plurality of sub-pad terminals, and a second sub-pad terminal of the plurality of sub-pad terminals is not connected to any of the plurality of first test lines, and, 'wherein the second pad portion includeswherein each of the plurality ...

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07-01-2016 дата публикации

ELECTROLESS PLATING METHOD AND CERAMIC SUBSTRATE

Номер: US20160007476A1
Принадлежит: Mitsubishi Electric Corporation

Provided is an electroless plating method for a low temperature co-fired glass ceramic substrate, the method including: a degreasing and activation treatment step of degreasing and activating a surface of a wiring pattern formed of a silver sintered body; a catalyzing step of providing a catalyst onto the surface of the wiring pattern formed of a silver sintered body; and an electroless multi-layered coating plating treatment step. The electroless plating method further includes, between the degreasing and activation treatment step and the catalyzing step, a silver precipitation treatment step of precipitating silver on a glass component present on the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step, and the catalyzing step includes providing the catalyst also to the silver precipitated in the silver precipitation treatment step. 1. An electroless plating method for a glass ceramic substrate comprising an insulating base material formed of glass ceramic , and a wiring pattern formed of a silver sintered body , the electroless plating method comprising:a degreasing and activation treatment step of degreasing and activating a surface of the wiring pattern formed of a silver sintered body;a catalyzing step of providing a catalyst onto the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step; andan electroless multi-layered coating plating treatment step of forming a multi-layered electroless plating coating on the surface of the wiring pattern formed of a silver sintered body on which the catalyst is provided,the electroless plating method further comprising, between the degreasing and activation treatment step and the catalyzing step, a silver precipitation treatment step of precipitating silver on a glass component present on the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step, ...

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20-01-2022 дата публикации

METHOD FOR PRODUCING PACKAGE SUBSTRATE FOR LOADING SEMICONDUCTOR DEVICE

Номер: US20220020602A1
Принадлежит: MITSUBISHI GAS CHEMICAL COMPANY, INC.

A method for manufacturing a package substrate including an insulating layer and a wiring conductor, including: forming, on one or both sides of a core resin layer, a substrate including a peelable first metal layer that has a thickness of 1-70 μm, a first insulating resin layer, and a second metal layer; forming a non-through hole reaching a surface of the first metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and first metal layers; arranging a second insulating resin layer and a third metal layer and heating and pressurizing the first substrate to form a substrate; forming a non-through hole reaching a surface of the second metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and third metal layers; peeling a third substrate; and patterning the first and third metal layers to form the wiring conductor. 1. A method for manufacturing a package substrate for mounting a semiconductor device comprising an insulating layer and a wiring conductor provided on the insulating layer , the method comprising:forming a first substrate comprising a first metal layer that has a thickness of 1 μm to 70 μm and that is peelable from the core resin layer, a first insulating resin layer, and a second metal layer in this order on one side or both sides of a core resin layer;forming a non-through hole reaching a surface of the first metal layer on a surface of the first substrate, carrying out electrolytic copper plating and/or electroless copper plating on an inner wall of the non-through hole, and connecting the second metal layer and the first metal layer;forming a second substrate by heating and pressurizing a laminate formed by arranging a second insulating resin layer and a third metal layer in this order on a surface of the second metal layer of the first substrate;forming a non-through hole reaching the surface of the second metal layer on a surface ...

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08-01-2015 дата публикации

METHOD FOR ELECTROLESS NICKEL-PHOSPHOROUS ALLOY DEPOSITION ONTO FLEXIBLE SUBSTRATES

Номер: US20150009638A1
Принадлежит: ATOTECH DEUTSCHLAND GMBH

The present invention relates to a method for electroless deposition of a bendable nickel-phosphorous alloy layer onto flexible substrates such as flexible printed circuit boards and the like. The nickel-phosphorous alloy layer is deposited from an aqueous plating bath comprising nickel ions, hypophosphite ions, at least one complexing agent and a grain refining additive selected from the group consisting of formaldehyde and formaldehyde precursors. The nickel-phosphorous alloy layers obtained have a columnar microstructure oriented perpendicular to the flexible substrate and are sufficiently bendable. 1. A method for electroless deposition of a bendable nickel-phosphorous alloy layer onto a flexible substrate , comprising , in this order , the stepsi. providing a flexible substrate having attached to at least one side a copper circuitry, 1. nickel ions,', '2. hypophosphite ions,', '3. at least one complexing agent and', '4. a grain refining additive selected from the group consisting of formaldehyde and formaldehyde precursors,, 'ii. contacting the flexible substrate with an aqueous plating bath comprising'}wherein the contacting deposits the bendable nickel-phosphorous alloy layer onto the copper circuitry attached to at least one side of the flexible substrate.2. The method for electroless deposition of a bendable nickel-phosphorous alloy layer according to wherein the flexible substrate is a flexible printed circuit board.3. The method for electroless deposition of a bendable nickel-phosphorous alloy layer according to wherein the concentration of nickel ions in the aqueous plating bath ranges from 1 to 18 g/l.4. The method for electroless deposition of a bendable nickel-phosphorous alloy layer according to the concentration of hypophosphite ions ranges from 2 to 60 g/l.5. The method for electroless deposition of a bendable nickel-phosphorous alloy layer according to wherein the concentration of the at least one complexing agent ranges from 1 to 200 g/l.6. The ...

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08-01-2015 дата публикации

Wiring substrate and semiconductor package

Номер: US20150009645A1
Принадлежит: Shinko Electric Industries Co Ltd

A wiring substrate includes an insulating layer that is an outermost layer of the wiring substrate and includes an external exposed surface, a pad forming part formed on a side of the external exposed surface, and a pad that projects from the external exposed surface. The pad forming part includes a recess part recessed from the external exposed surface, and a weir part that projects from the external exposed surface and encompasses the recess part from a plan view. The pad includes a pad body formed within the recess part and the weir part, and an eave part formed on the weir part. The pad body includes an end part that projects to the weir part. The eave part projects in a horizontal direction from the end part of the pad body. The end part of the pad body includes a flat surface.

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11-01-2018 дата публикации

MULTIFUNCTIONAL FLUORESCENT AND MRI-ACTIVE NANOSTRUCTURE

Номер: US20180008730A1
Принадлежит: William Marsh Rice University

A Magnetic Resonance Imaging (MRI) enhancement agent includes a plurality of particles, each particle including: a metal core; a dielectric shell disposed on the metal core comprising at least one MRI contrast agent; and a metal shell disposed on the exterior surface of the dielectric shell that encapsulates the dielectric shell. 1. A Magnetic Resonance Imaging (MRI) enhancement agent , comprising: a metal core;', 'a dielectric shell disposed on the metal core comprising at least one MRI contrast agent; and', 'a metal shell disposed on the exterior surface o the dielectric shell that encapsulates the dielectric shell., 'a plurality of particles, each particle comprising2. The magnetic resonance imaging enhancement agent of claim 1 , wherein a radius of the metal core is between about 5 nm and 60 nm.3. The magnetic resonance imaging enhancement agent of claim 1 , wherein a thickness of the silica shell is between about 5 and 40 nm.4. The magnetic resonance imaging enhancement agent of claim 1 , wherein a thickness of the metal shell is between 1 and 100 nm.5. The magnetic resonance imaging enhancement agent of claim 1 , wherein at least a portion of the plurality of particles supports a plasmon resonance centered at greater than 400 nm and less than 1200 nm.6. The magnetic resonance imaging enhancement agent of claim 1 , wherein at least a portion of the plurality of particles supports a plasmon resonance centered in the near-IR range of the electromagnetic spectrum.7. The magnetic resonance imaging enhancement agent of claim 1 , wherein the dielectric shell is amorphous silica.8. The magnetic resonance imaging enhancement agent of claim 7 , wherein the amorphous silica is doped with an amine.9. The magnetic resonance imaging enhancement agent of claim 8 , wherein the amine is 3-aminopropyl-triethoxysilane.10. The magnetic resonance enhancement agent of claim 1 , wherein the MRI contrast agent is comprised of at least one selected from the group containing a type 1 ...

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12-01-2017 дата публикации

METHOD OF PRODUCING STANNOUS OXIDE, STANNOUS OXIDE, METHOD OF Sn PLATING SOLUTION, AND METHOD OF REMOVING IMPURITIES FROM SN PLATING SOLUTION

Номер: US20170009078A1
Принадлежит: MITSUBISHI MATERIALS CORPORATION

The method of producing stannous oxide includes: a Sn ion-containing acid solution forming step (S); a first neutralizing step (S), which is a step of forming Sn precipitates by adding one or more of alkaline solutions of ammonium carbonate, ammonium bicarbonate, and aqueous ammonia to the Sn ion-containing acid solution to retain pH at 3-6 therein; a Sn precipitate separating step (S); a Sn precipitate dispersing step (S), which is a step of dispersing the separated Sn precipitates in a solvent liquid to obtain a dispersion liquid; and a second neutralizing step (S), which is a step of forming SnO by adding an alkaline solution to the dispersion liquid of the Sn precipitates and then by heating, wherein Na, K, Pb, Fe, Ni, Cu, Zn, Al, Mg, Ca, Cr, Mn, Co, In, and Cd reside in the Sn ion-containing acid solution in the first neutralizing step (S). 1. A method of producing stannous oxide comprising:a Sn ion-containing acid solution forming step, which is a step of preparing a Sn ion-containing acid solution by adding Sn ions to an acid solution;a first neutralizing step, which is a step of forming Sn precipitates by adding one or more of alkaline solutions of ammonium carbonate, ammonium bicarbonate, and aqueous ammonia to the Sn ion-containing acid solution to retain pH at 3-6 therein;a Sn precipitate separating step, which is a step of separating the Sn precipitates from the Sn ion-containing acid solution;a Sn precipitate dispersing step, which is a step of dispersing the separated Sn precipitates in a solvent liquid to obtain a dispersion liquid; anda second neutralizing step, which is a step of forming SnO from the Sn precipitates by adding an alkaline solution to the dispersion liquid of the Sn precipitates and then by heating, whereinNa, K, Pb, Fe, Ni, Cu, Zn, Al, Mg, Ca, Cr, Mn, Co, In, and Cd reside in the Sn ion-containing acid solution in the first neutralizing step.2. The method of producing stannous oxide according to claim 1 , further comprising an acid ...

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12-01-2017 дата публикации

METALLIC COATING AND A METHOD FOR PRODUCING THE SAME

Номер: US20170009350A1
Принадлежит:

The present invention relates to metal plating solution comprising at least one source of metal ions and detonation nanodiamonds, wherein the detonation nanodiamonds are substantially free of negatively charged functionalities, and to a method for producing the solution. The present invention further relates to metal plating method and to a metallic coating comprising metal and detonation nanodiamonds substantially free of negatively charged functionalities. 1. An electroless metal plating solution comprising at least one source of metal ions , a reducing agent and detonation nanodiamonds , wherein acid value of the detonation nanodiamonds is less than 5.0.2. The electroless metal plating solution according to claim 1 , wherein the metal is selected from the group consisting of nickel claim 1 , copper claim 1 , gold claim 1 , cobalt claim 1 , palladium claim 1 , iron claim 1 , silver claim 1 , and mixtures thereof.3. The electroless metal plating solution according to claim 2 , wherein the metal is nickel.4. The electroless metal plating solution according to claim 1 , wherein amount of the detonation nanodiamonds in the plating solution is 0.005-15 g/l.5. The electroless metal plating solution according to claim 1 , wherein particle size distribution D90 of the detonation nanodiamond dispersion added to the electrolyte is not more than 100 nm.6. The electroless metal plating solution according to claim 1 , wherein the detonation nanodiamond dispersion exhibits zeta potential at least +40 mV claim 1 , measured with Laser Doppler Micro-electrophoresis7. The electroless metal plating solution according to claim 1 , wherein acid value of the detonation nanodiamonds is 0.8. The electroless metal plating solution according to claim 1 , wherein the solution further comprises additional components selected from the group consisting of graphite claim 1 , graphene claim 1 , carbon nanotubes claim 1 , diamond particles larger than 15 nm claim 1 , boron carbide claim 1 , ...

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10-01-2019 дата публикации

HEXAVALENT CHROMIUM FREE ETCH MANGANESE RECOVERY SYSTEM

Номер: US20190009184A1
Принадлежит: SRG GLOBAL, INC.

Methods for recovering manganese etchant solutions are provided wherein a process solution used to rinse or neutralize a nonconductive substrate after etching the substrate is collected and evaporated to provide a concentrated process solution that is fed back into the manganese etchant solution or acid rinse. 1. A method for recovering manganese etchant solution , the method comprising:neutralizing with a neutralizer a nonconductive substrate after etching the substrate with an etchant solution, wherein the neutralizer comprises a solution comprising an acid and an oxidizer;removing from the neutralizer or manganese containing rinsate at least a portion of the process solution to an evaporator assembly;evaporating the process solution in the evaporator assembly to remove the water to form a concentrated process solution; andadding the concentrated process solution to the etchant solution or an Acid Rinse.2. The method according to claim 1 , wherein the concentrated process solution is concentrated to greater than or equal to about 2 g/L Mn.3. The method according to claim 1 , wherein the evaporator assembly further comprises an atmospheric evaporator or vacuum evaporator.4. The method according to claim 1 , wherein the evaporator assembly further comprises an evaporating processing tank.5. The method according to claim 1 , wherein the evaporating processing tank is operated under temperature control and with controlled air treatment.6. The method according to claim 5 , wherein the temperature is from about 155° F. to about 180° F.7. The method according to claim 5 , wherein the controlled air treatment is at a flowrate from about 1880 lb/hr to about 2090 lb/hr.8. The method according to claim 6 , wherein the controlled air treatment is at a flowrate from about 1880 lb/hr to about 2090 lb/hr.9. The method according to claim 1 , wherein the process solution comprises a source of manganese ions.10. A method for recovering manganese etchant solution claim 1 , the ...

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08-01-2015 дата публикации

METHOD OF DEPOSITING A METAL LAYER ON AN ELECTRICALLY NON-CONDUCTIVE PLASTIC MEMBER, AND HOUSING FOR A MOBILE DEVICE

Номер: US20150011270A1
Принадлежит:

A method of depositing a metal layer on an electrically non-conductive plastic member includes: mixing a plastic material and a laser-sensitive additive to form a mixture, followed by injection molding the mixture to form an electrically non-conductive plastic member; irradiating a part of a surface of the electrically non-conductive plastic member with laser to engrave the electrically non-conductive plastic member so as to form a roughened region; forming an activating layer on the roughened region; and forming a metal layer on the activating layer on the roughened region of the electrically non-conductive plastic member. This method is suitable for making a housing for a mobile device. 1. A method of depositing a metal layer on an electrically non-conductive plastic member , comprising the steps of:(a) mixing a plastic material and a laser-sensitive additive to form a mixture, followed by injection molding the mixture to form an electrically non-conductive plastic member that has a surface;(b) irradiating a part of the surface of the electrically non-conductive plastic member with laser to engrave the electrically non-conductive plastic member so as to form a roughened region in the electrically non-conductive plastic member;(a) forming an activating layer on the roughened region of the electrically non-conductive plastic member for metalizing the roughened region in the electrically non-conductive plastic member; and(d) forming a metal layer on the activating layer on the roughened region of the electrically non-conductive plastic member.2. The method as claimed in claim 1 , wherein in step (c) claim 1 , the activating layer is made of palladium.3. The method as claimed in claim 2 , wherein in step (c) claim 2 , a tin-palladium alloy layer is formed on the roughened region of the electrically non-conductive plastic member by deposition claim 2 , followed by removing tin ion from the tin-palladium alloy layer by acid pickling so that palladium remains on the ...

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14-01-2016 дата публикации

Composite Electroless Nickel Plating

Номер: US20160010214A1
Принадлежит: MacDermid Acumen Inc

A method of producing a composite electroless nickel layer on a substrate is described. The method includes the steps of contacting the substrate with a composite electroless nickel plating bath and generating an electrostatic field in the electroless nickel plating bath. The electric field is generated by placing an anode in the electroless nickel plating bath and connecting the anode to a positive terminal of a DC rectifier, and connecting the substrate to a negative terminal of the DC rectifier, and preferably inserting a capacitor into the circuit to prevent passage of current. An attractive force generated by the electrostatic field increases the attraction of the positively charged PTFE particles to the negatively charged substrate and drives the positively charged PTFE particles to the negatively charged substrate.

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14-01-2016 дата публикации

PRIMER FOR ELECTROLESS PLATING

Номер: US20160010215A1
Принадлежит:

It is an object of the present invention to provide a novel primer for use in pretreatment steps in electroless plating which is environmentally friendly, by which process is easy with fewer steps, and which can realize cost reduction. A primer for forming a metal plating film on a base material by electroless plating, the primer including: a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 500 to 5,000,000; a metal fine particle; and an alkoxysilane. 1. A primer for forming a metal plating film on a base material by electroless plating , the primer comprising:(a) a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 500 to 5,000,000;(b) a metal fine particle; and(c) an alkoxysilane having an amino group optionally substituted with an aliphatic group or an epoxy group, or an oligomer of the alkoxysilane.2. The primer according to claim 1 , whereinthe ammonium group of the hyperbranched polymer (a) is attached to the metal fine particle (b) to form a complex.5. The primer according to claim 1 , whereinthe metal fine particle (b) is a fine particle of at least one selected from the group consisting of iron (Fe), cobalt (Co), nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), tin (Sn), platinum (Pt), and gold (Au).6. The primer according to claim 5 , whereinthe metal fine particle (b) is a palladium fine particle.7. The primer according to claim 5 , whereinthe metal fine particle (b) is a fine particle having an average particle diameter of 1 to 100 nm.9. A priming layer for electroless plating claim 1 , obtained by forming a layer of the primer as claimed in .10. A metal plating film claim 9 , formed on the priming layer by performing electroless plating on the priming layer for electroless plating as claimed in .11. A metal-coated base material comprising:a base material;{'claim-ref': {'@idref': 'CLM-00009', 'claim 9'}, 'the priming layer for ...

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14-01-2016 дата публикации

Conductive Fibres

Номер: US20160010273A1

A method for making a fibre electrically conductive comprises the steps of: (a) providing a fibre having a negative electric charge at the surface of the fibre, (b) applying to the fibre a substance (such as a polyelectrolyte) which provides a layer of said substance on the fibre and changes the electric charge at the surface of the fibre from negative to positive, wherein said substance is not chitosan, and (c) making the surface of the fibre electrically conductive with a metal, wherein the metal of step (c) is provided in the form of metal ions and wherein a reducing agent (for example) is employed to reduce the metal ions to elemental metal. Fabrics formed from conductive fibres are also provided.

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10-01-2019 дата публикации

Method for producing electroconductive laminate, laminate, and electroconductive laminate

Номер: US20190010608A1
Принадлежит: Fujifilm Corp

An object of the present invention is to provide a method for producing an electroconductive laminate, which is capable of forming a metal layer having low resistance at a position corresponding to a patterned plated layer, a laminate, and an electroconductive laminate. The method for producing an electroconductive laminate of the present invention includes: a step of forming a plated layer forming layer on a base material using a predetermined plated layer forming composition; a step of subjecting the plated layer forming layer to a patternwise exposure treatment and a development treatment to form a patterned plated layer containing a portion having a line width of less than 3 μm; a step of applying a plating catalyst or a precursor thereof to the patterned plated layer using an alkaline plating catalyst-applying liquid containing the plating catalyst or the precursor thereof; and a step of subjecting the patterned plated layer to which the plating catalyst or the precursor thereof has been applied to a plating treatment using a plating liquid containing aminocarboxylic acids to form a metal layer on the patterned plated layer.

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10-01-2019 дата публикации

MEANS FOR CARRYING OUT ELECTROLESS METAL DEPOSITION WITH ATOMIC SUB-MONOLAYER PRECISION

Номер: US20190010609A1
Принадлежит:

The present invention relates to a method of deposition of thin metal layers on different substrates by electroless chemical method. In the method of the invention, the potential of the plating solution, i.e. a solution from which the metal deposition is carried out, is controlled with a redox buffer. The appropriate plating solution is also disclosed. 1. A method of electroless deposition of a metal monolayer or sub-monolayer or a metal multilayer deposit onto a substrate from a plating solution , wherein the deposition process is controlled by means of a redox buffer having comparable concentration of oxidized and reduced form of a redox pair , which is used to adjust the potential of the plating solution and wherein such adjustment of the potential results in deposition of a metal monolayer or sub-monolayer , or a metal multilayer deposit , onto the substrate , which is immersed into said plating solution.2. A method of claim 1 , wherein the adjustment of the plating solution potential by means of a redox buffer is carried out in the presence of a depositing metal precursor claim 1 , and wherein the plating solution potential adjustment results in deposition of the metal onto the substrate.3. A method of claim 1 , wherein the adjustment of the plating solution potential by means of a redox buffer is followed by addition of a depositing metal precursor into said plating solution claim 1 , and wherein the deposition of a metal is controlled by concentration of said depositing metal precursor.4. The method of claim 1 , wherein adjustment of the plating solution potential is carried out before or after the substrate is immersed into said plating solution.5. The method of claim 1 , wherein the addition of the depositing metal precursor is carried out before or after the substrate is immersed into said plating solution.6. The method of claim 1 , wherein the plating solution is an aqueous solution.7. The method of claim 1 , wherein the redox buffer is selected from a ...

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