Настройки

Укажите год
-

Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

Подробнее
-

Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

Подробнее

Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Укажите год
Укажите год
Применить Всего найдено 5077. Отображено 100.
05-01-2012 дата публикации

Electrical connecting apparatus and contacts used therefor

Номер: US20120003864A1
Автор: Kenji Sasaki, Satoshi Narita
Принадлежит: Micronics Japan Co Ltd

An electrical connecting apparatus 10 comprises: a base plate 16 provided on its underside 14 with a plurality of pedestals 12 at intervals in a front-back direction; and multiple contact groups, each of which has a first contact 18 and a second contact 19. Each first contact 18 includes a needle body portion 24 having a rear end portion 20 supported on the pedestal 12 and a front end portion 22 which is a free end and extending leftward. Each second contact 19 includes a needle body portion 25 having a rear end portion 21 supported on the pedestal 12 and a front end portion 23 which is a free end and extending rightward. When the first contact 18 is broken, the second contacts 19 can be used.

Подробнее
Номер записи: 1
02-02-2012 дата публикации

Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies

Номер: US20120023730A1
Автор: Anna Litza, Douglas L. McKay, Erh-Kong Chieh, Fu Chiung Chong, Roman L. Milter, SHA Li, W.R. Bottoms
Принадлежит: Individual

Enhanced microfabricated spring contact structures and associated methods, e.g. such as for electrical contactors and interposers, comprise improvements to spring structures that extend from the substrate surface, and/or improvements to structures on or within the support substrate. Improved spring structures and processes comprise embodiments having selectively formed and etched, coated and/or plated regions, which are optionally further processed through planarization and/or annealment. Enhanced solder connections and associated processes provide a gap between substrates for componentry, and or improved manufacturing techniques using distributed spacers. Enhanced probe card assembly structures and processes provide improved planarization adjustment and thermal stability.

Подробнее
Номер записи: 2
08-03-2012 дата публикации

Singulated semiconductor device separable electrical interconnect

Номер: US20120058653A1
Автор: James Rathburn
Принадлежит: HSIO Technologies LLC

A socket assembly that forms a solderless electrical interconnection between terminals on a singulated integrated circuit device and another circuit member. The socket housing has an opening adapted to receive the singulated integrated circuit device. The compliant printed circuit is positioned relative to the socket housing to electrically couple with the terminals on a singulated integrated circuit device located in the opening. The compliant printed circuit includes a dielectric base layer printed onto a surface of a fixture, while leaving cavities in the surface of the fixture exposed. A plurality of contact members are formed in the plurality of cavities in the fixture and coupled to the dielectric base layer. The contact members are exposed wherein the compliant printed circuit is removed from the fixture. At least one dielectric layer with recesses corresponding to a target circuit geometry is printed on the dielectric base layer. A conductive material is deposited in at least a portion of the recesses to form conductive traces electrically coupling the contact members to the other circuit member.

Подробнее
Номер записи: 3
19-04-2012 дата публикации

Insulated probe pin and method for fabricating the same

Номер: US20120091999A1
Автор: Hiroyuki Kamibayashi, Kenji Kawamura, Masayuki Ataka, Toshihiro Zushi, Toyokazu Nagato
Принадлежит: Mitsubishi Cable Industries Ltd

An insulated probe pin 10 includes a conductor probe pin 11 and an insulator coating 12 covering a periphery of the conductor probe pin 10 such that a sensing-side end portion of the conductor probe pin 10 is exposed. An end portion 12 a of the insulator coating 12 toward the sensing-side end of the conductor probe pin 11 has a thickness larger than that of an end portion of the insulator coating 12 toward a connection-side end of the conductor probe pin 11 in an entire periphery of the insulator coating 12.

Подробнее
Номер записи: 4
27-12-2012 дата публикации

Wiring board and method of manufacturing the same

Номер: US20120325529A1
Автор: Akinori Shiraishi, Hideaki Sakaguchi, Mitsutoshi Higashi
Принадлежит: Shinko Electric Industries Co Ltd

A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.

Подробнее
Номер записи: 5
07-03-2013 дата публикации

Connection terminal and connection jig

Номер: US20130057308A1
Автор: Akihiro Yano, Masami Yamamoto, Norihiro Ohta, Satoshi Furukawa, Yusuke Yokota
Принадлежит: Nidec Read Corp

Provided is a connection terminal that maintains an approximately circular shape before or after a cylindrical part is fixed by resistance welding. The connection terminal used for a connection jig interconnecting target points includes a small-diameter conductive part and a large-diameter cylindrical part disposed to surround the small-diameter conductive part. The small-diameter conductive part has a front end protruding from a front end of the large-diameter cylindrical part. A part of the small-diameter conductive part is joined to a part of the large-diameter cylindrical part. A cutout part is formed in a part of a strip portion around an axis of the cylindrical part that at least includes the portion of the large-diameter cylindrical part which is joined to the small-diameter conductive part.

Подробнее
Номер записи: 6
14-03-2013 дата публикации

CIRCUIT BOARD SENSOR AND METHOD FOR PRODUCING THE SAME

Номер: US20130063905A1
Автор: BRINKHAUS Bernhard, Waser Werner
Принадлежит:

The invention relates to a circuit board sensor () for measuring physical variables, comprising a substrate board () and a second board () both made of glass, wherein at least the second board () is designed such that said board is elastically deformable, wherein the substrate board () and the second board () each comprise a first and a second side (), wherein the second side () of the substrate board () and the first side () of the second board () are disposed opposite each other, and wherein a spacer element () is disposed between the substrate board () and the second board () and holds the substrate board () and the second board () at a mutual distance, wherein the substrate board () and the second board () extend in particular parallel to each other, wherein the second side () of the substrate board () comprises a first metal or polymer surface () and the first side () of the second board () comprises a second metal or polymer surface (), and wherein the first and second metal or polymer surfaces () are disposed at least partially opposite each other, and wherein conductors () are attached on the first side of the substrate board (), and wherein the substrate board () comprises at least one first and one second through-plating () disposed such that the first through-plating () electrically conductively connects the conductors () to the first metal or polymer surface (), and such that the second through-plating () electrically conductively connects the conductor () to the second metal or polymer surface (). 1. A circuit board sensor for measuring physical parameters , comprisinga base plate as well as a second plate which are both composed of glass,wherein at least the second plate is designed such that it is elastically deformable,wherein the base plate as well as the second plate each have a first side and a second side,{'b': '3', 'i': 'a', 'wherein the second side of the base plate as well as the first side () of the second plate are arranged opposite to one ...

Подробнее
Номер записи: 7
21-03-2013 дата публикации

ELECTROMAGNETIC COIL STRUCTURE HAVING A FLAT CONDUCTIVE TRACK, MAGNETIC CORE AND MAGNETO ELECTRONIC ANGLE SENSOR

Номер: US20130069475A1
Автор: Mertens Guus, Ocket Tom, Van Cauwenberge Jan, Van Tomme Marc
Принадлежит: TYCO ELECTRONICS BELGIUM EC BVBA

The present invention relates to an electromagnetic coil structure for being mounted on a magnetic core. Such a magnetic core is for instance a part of a rotating electric machine or of a magneto electronic angle sensor. The present invention further relates to a belonging magnetic core and to a magneto electronic angle sensor, in particular a reluctance resolver. Furthermore, the present invention relates to a method for fabricating such an angle sensor. The coil structure () comprises at least one electrically conductive winding formed as a flat conductive track (), and at least one flexible electrically insulating carrier () for carrying said winding. Said coil structure has at least one opening () for receiving a magnetic flux guiding element () of said core. The circumferential surface of the core whereto said electromagnetic coil structure () is mounted has a polygonal shape. 120.-. (canceled)21. Electromagnetic coil structure for being mounted on a magnetic core , said coil structure comprising:at least one electrically conductive winding formed as a flat conductive track;at least one flexible electrically insulating carrier for carrying said winding;wherein said structure can be mounted on said core to induce and/or receive a magnetic flux in said core.22. Electromagnetic coil structure according to claim 21 , wherein said coil structure has at least one opening for receiving a magnetic flux guiding element of said core.23. Electromagnetic coil structure according to claim 21 , wherein in a mounted state claim 21 , said coil structure is bent at least once to have a three-dimensional form.24. Electromagnetic coil structure according to claim 23 , wherein in a mounted state claim 23 , said coil structure is bent twice to encompass a magnetic core of a stator or a rotor in a U-shaped manner.25. Electromagnetic coil structure according to claim 21 , wherein said coil structure is bent several times to reduce the length of said coil structure for a reduced ...

Подробнее
Номер записи: 8
28-03-2013 дата публикации

HIDDEN SENSORS IN AN ELECTRONIC DEVICE

Номер: US20130075613A1
Автор: Dinh Richard Hung Minh, Huppi Brian Q., Mullens Christopher T., TAM Ching Yu John
Принадлежит: Apple Inc.

An electronic device having one or more sensors is provided. The sensors may include any suitable type of sensor that emits or receives radiation (e.g., light waves) from the environment. The electronic device may include openings through which radiation may reach the sensors while keeping the sensors hidden from view. In some embodiments, the sensors may be placed underneath an opening used for an audio receiver such that radiation is piped to the sensors using a light path or a chamfered surface along the opening. In some embodiments, the sensors may be embedded in a screen such that the radiation emitted by the sensors exits the screen instead of being reflected on the screen. In some embodiments, the sensors may be placed along the periphery of the display, such that access to the sensors is provided via discontinuities in a gasket used to couple the display to the electronic device. 120-. (canceled)21. An electronic device comprising:an audio opening;an emitter positioned underneath the audio opening and configured to emit first radiation through the audio opening into an environment of the electronic device; anda receiver positioned adjacent to the emitter and configured to receive second radiation through the audio opening from the environment.22. The electronic device of claim 21 , wherein the audio opening comprises a speaker opening.23. The electronic device of claim 21 , wherein the emitter comprises an infrared light emitting diode (“LED”).24. The electronic device of claim 23 , wherein the receiver comprises an infrared detector.25. The electronic device of claim 21 , wherein the emitter is separated from the receiver by a divider.26. The electronic device of further comprising an audio mesh positioned between a portion of the audio opening and at least one of the emitter and the receiver.27. The electronic device of claim 21 , wherein the receiver is positioned adjacent to the emitter in a direction that is orthogonal to a direction of at least one of ...

Подробнее
Номер записи: 9
28-03-2013 дата публикации

SENSOR PART FOR AN INFRARED SENSOR AND METHOD FOR PRODUCING SAME

Номер: US20130075616A1
Автор: Kram Martin, Röhner Gerhard
Принадлежит:

A sensor part for an infrared sensor, including an IR-sensitive detector (), at least one reference source () emitting IR radiation, and an IR-sensitive reference detector () which, in the direction of the incident IR radiation, is at a distance from the detector (), wherein the at least one reference source () is arranged at the side of the reference detector (), and including a support (), on the first side () of which the detector (), the at least one reference source () and the reference detector () are arranged. The support () includes a blank made of a flexible material bent in some sections, in particular a blank made of a flexible printed circuit board bent in some sections. The invention achieves the aim of specifying a three-dimensional sensor part for an IR sensor that can be produced by a simple method. The invention further relates to a method for producing a sensor part and to an IR sensor. 1. A sensor part for an infrared sensor , comprising:an IR-sensitive detector,at least one reference source that emits IR radiation, andan IR-sensitive reference detector that is spaced in a direction of incidence of the IR radiation from the detector,wherein the at least one reference source is arranged to a side of the reference detector, anda support on a first side on which the detector, the at least one reference source, and the reference detector are arranged, the support includes a blank of a flexible material with bent sections.2. The sensor part as claimed in claim 1 , wherein a body of the support includes a main section claim 1 , which extends in the direction of incident radiation claim 1 , and a detector section claim 1 , the detector is arranged on the detector section claim 1 , and the detector section projects away from the main section at a second bending edge at an angle.3. The sensor part as claimed in claim 1 , wherein the body of the support includes a main section claim 1 , which extends in the direction of incident radiation claim 1 , and a ...

Подробнее
Номер записи: 10
11-04-2013 дата публикации

Probe card and manufacturing method thereof

Номер: US20130088251A1
Автор: Dae Hyeong Lee, Ki Pyo Hong, Won Chul Ma, Yong Seok Choi
Принадлежит: Samsung Electro Mechanics Co Ltd

There are provided a probe substrate and a manufacturing method thereof that may prevent an electrode pad bonded with a probe pin from being released from the probe substrate. The probe card includes: a ceramic substrate having at least one electrode pad on one surface thereof; and a probe pin bonded to the electrode pad, and the electrode pad has a larger dimension than a bonding surface of the probe pin.

Подробнее
Номер записи: 11
02-05-2013 дата публикации

TEST PROBE FOR TEST AND FABRICATION METHOD THEREOF

Номер: US20130106457A1
Автор: Lee Jae Hak
Принадлежит:

A method of fabricating a test probe includes a first conductive providing operation in which a first conductive member formed of a conductive metal material is provided, the first conductive member including a probe portion that has a probe shape and is formed in an upper portion of the first conductive member by a micro-electromechanical systems (MEMS) process, a second conductive member providing operation in which a second conductive member formed of a conductive metal material is provided, the second conductive member having an insertion portion formed in an upper portion of the second conductive member for inserting the first conductive member to be coupled to the insertion portion, an insertion operation in which the first conductive member is inserted into the insertion portion of the second conductive member, and a fixing and coupling operation in which the first conducive member is fixedly coupled to the second conductive member by deforming a part of the second conductive member. 1. A method of fabricating a test probe , the method comprising:a first conductive member providing operation in which a first conductive member formed of a conductive metal material is provided, the first conductive member comprising a probe portion that has a probe shape and is formed in an upper portion of the first conductive member by a micro-electromechanical systems (MEMS) process;a second conductive member providing operation in which a second conductive member formed of a conductive metal material is provided, the second conductive member having an insertion portion formed in an upper portion of the second conductive member for inserting the first conductive member to be coupled to the insertion portion;an insertion operation in which the first conductive member is inserted into the insertion portion of the second conductive member; anda fixing and coupling operation in which the first conducive member is fixedly coupled to the second conductive member by deforming a ...

Подробнее
Номер записи: 12
09-05-2013 дата публикации

CURRENT DETECTION DEVICE AND METHOD FOR PRODUCING SAME

Номер: US20130113463A1
Автор: Fukuyama Susumu, Nakajima Hirokatsu
Принадлежит:

A current detection device includes a bus bar for current detection. The bus bar for current detection is constituted by a conductor provided with a first portion penetrating through a hollow portion of a magnetic material core in a first direction in which a current passes and plate-shaped second portions each linked to both sides in the first direction with respect to the first portion, the bus bar for current detection formed such that a width of the second portion is greater than a maximum width of the hollow portion of the magnetic material core and a minimum width of a contour of a section in the first portion is greater than a thickness of the second portion. 1. A current detection device for detecting a current flowing to a bus bar , comprising:a magnetic material core having both ends opposed to each other across a gap portion and continuously formed around a hollow portion:a magneto-electric converting element disposed in said gap portion for detecting a magnetic flux to be varied depending on a current passing through said hollow portion; anda bus bar for current detection constituted by a conductor provided with a first portion penetrating through said hollow portion of said magnetic material core in a current passing direction and plate-shaped second portions each linked to both sides in said current passing direction with respect to said first portion, the bus bar for current detection being formed such that a width of said second portion is greater than a maximum width of said hollow portion and a minimum width of a contour of a section in said first portion is greater than a thickness of said second portion.2. The current detection device according to claim 1 , wherein said bus bar for current detection is a member having a structure in which both end portions of a tubular metal member are crushed into a plate shape claim 1 , said both end portions crushed into the plate shape constitute said second portion and a portion provided therebetween ...

Подробнее
Номер записи: 13
16-05-2013 дата публикации

MRT System with a Magnetic Coil and Method for Manufacturing a Circuit Arrangement for Switching a Coil Current

Номер: US20130119989A1
Автор: Albrecht Adam
Принадлежит:

In a magnetic resonance tomography (MRT) system, a current strength of a coil current is controllable by a plurality of semiconductor power switches as a function of a control signal. The plurality of semiconductor power switches receive the control signal at respective control inputs from a control line. In each of at least two semiconductor power switches of the plurality of semiconductor power switches, a compensation resistance element is connected between the control input and the control line. Resistance values of the compensation resistance elements are different. 1. A magnetic resonance tomography (MRT) system comprising:at least one magnetic coil for producing a magnetic resonance, a current strength of a coil current in the at least one magnetic coil being controllable by a plurality of semiconductor power switches as a function of a control signal,wherein the plurality of semiconductor power switches is operable to receive the control signal at a respective control input from a control line, andwherein in each of at least two semiconductor power switches of the plurality of semiconductor power switches, a compensation resistance element is connected between the control input and the control line, and resistance values of the compensation resistance elements are different.2. The MRT system as claimed in claim 1 , wherein at least one compensation resistance element is connected immediately in front of a terminal of an electronic component that an associated semiconductor power switch of the plurality of semiconductor power switches includes.3. The MRT system as claimed in claim 1 , wherein the resistance values are selected such that claim 1 , during operation of the MRT system claim 1 , for a prespecified curve of the control signal claim 1 , current strengths of part currents claim 1 , of which each flows through a semiconductor power switch of the plurality of semiconductor power switches and which together form the coil current claim 1 , have a smaller ...

Подробнее
Номер записи: 14
23-05-2013 дата публикации

Gradient-Independent Shim Coil for a Local Coil of a Magnetic Resonance Device

Номер: US20130127468A1
Автор: Biber Stephan
Принадлежит:

A shim coil device for installation and/or arrangement within a local coil of a magnetic resonance device is provided. The shim coil device includes at least one shim coil formed by at least one conductor loop, and at least one compensation coil formed by at least one conductor loop. The at least one shim coil and the at least one compensation coil are arranged in a same coil plane. An overall arrangement of the at least one shim coil and the at least one compensation coil is symmetrical about a first central axis and a second central axis. The first central axis and the second central axis are perpendicular to each other and lie in the coil plane. An overall induction surface is enclosed by the at least one conductor loop of the at least one compensation coil corresponding to an overall induction surface enclosed by the at least one conductor loop of the at least one shim coil. 1. A shim coil device for a magnetic resonance device , the shim coil device , comprising:at least one shim coil formed by at least one conductor loop; andat least one compensation coil formed by at least one conductor loop,wherein the at least one shim coil and the at least one compensation coil are arranged in a same coil plane, and an overall arrangement of the at least one shim coil and the at least one compensation coil is symmetrical about a first central axis and a second central axis of the coil plane, andwherein the first central axis and the second central axis are perpendicular to each other and lie in the coil plane, and an overall induction surface is enclosed by the at least one conductor loop of the at least one compensation coil corresponding to an induction surface enclosed by the at least one conductor loop of the at least one shim coil.2. The shim coil device of claim 1 , wherein the shim coil device is arranged within a local coil so that a central plane containing the first central axis is perpendicular to the second central axis and contains the isocenter of the ...

Подробнее
Номер записи: 15
06-06-2013 дата публикации

SUSPENDED IO TRACE DESIGN FOR SSP CANTILEVER DATA READ / WRITE

Номер: US20130141131A1
Автор: Chou Tsung-Kuan Allen, Harrar, II David
Принадлежит:

A suspended IO trace design for SSP cantilever Read/Write is described. Instead of having the whole I/O trace attached to surface of the cantilever, the cantilever is designed with fish-bone-like support and the I/O traces are anchored to cantilever structures at some specific attachment locations with dielectric insulation in between. This design provides very compliant trace compared to cantilever's see-saw actuation around the torsional beam pivot and is also insensitive to residual stress variations from I/O trace in fabrication. 1. A seek-scan probe , comprising:a pair of lateral actuation structures;a cantilever structure having a probe tip on its terminal end and attached to a bottom actuation electrode at its opposite end;a pair of I/O pads electrically connected to traces on corresponding ones of the lateral actuation structures; andthe traces suspended from the pair of lateral actuation structures to the cantilever structure over a dielectric layer connecting to the probe tip.2. The seek-scan probe as recited in wherein the traces on the cantilever structure comprise a step trace design pattern.3. The seek-scan probe as recited in wherein the traces on the cantilever structure comprise a curved suspended trace design pattern.4. The seek-scan probe as recited in further comprising a torsional beam pivot for the cantilevered structure.5. The seek-scan probe as recited in further comprising frame supports for the lateral actuation structures.6. The seek-scan probe as recited in further comprising trace anchors to anchor the trace to the cantilevered structure.7. A method claim 1 , comprising:providing a pair of lateral actuation structures;providing a cantilever structure having a probe tip on its terminal end and attached to a bottom actuation electrode at its opposite end;providing a pair of I/O pads electrically connected to traces on corresponding ones of the lateral actuation structures; andsuspending the traces from the pair of lateral actuation ...

Подробнее
Номер записи: 16
20-06-2013 дата публикации

Magnetostrictive torque sensor and method of manufacturing the same

Номер: US20130152703A1
Автор: Atsuhiko Yoneda, Yasuo Shimizu, Yutaka Arimura
Принадлежит: Honda Motor Co Ltd

A magnetostrictive torque sensor includes a housing configured to house a magnetostrictive element provided on a rotary shaft, a single coil bobbin and detection coils wound on the coil bobbin. The housing includes a plastic housing body having a generally cylindrical shape and molded integrally with the coil bobbin having the detection coils wound thereon, a metal flange portion disposed on an axial end portion of the generally cylindrical plastic housing body, and a plastic fastener member firmly connecting the metal flange portion to the axial end portion of the plastic housing body. A method of manufacturing such torque sensor is also disclosed.

Подробнее
Номер записи: 17
04-07-2013 дата публикации

Wiring board and probe card using the same

Номер: US20130169305A1
Автор: Kenji Terada, TAKAYUKI Taguchi
Принадлежит: Kyocera SLC Technologies Corp

A wiring board 3 according to the present invention includes a first resin layer 18 a formed of a thermoplastic resin; a conductive layer 16 formed partially on the first resin layer 18 a ; a through hole P for insertion of a screw formed in a region where the conductive layer 16 is not formed and penetrating through the first resin layer 18 a in a thickness direction thereof; and a dummy via hole D formed in a region between the through hole P and the conductive layer 16 and penetrating through the first resin layer 18 a.

Подробнее
Номер записи: 18
18-07-2013 дата публикации

MAGNETO-IMPEDANCE SENSOR ELEMENT AND METHOD FOR PRODUCING THE SAME

Номер: US20130181705A1
Автор: Hamada Norihiko, Honkura Yoshinobu, Yamamoto Michiharu
Принадлежит: Aichi Steel Corporation

An MI sensor element includes a substrate formed of a non-magnetic material, a plurality of magneto-sensitive bodies , and a plurality of detecting coils . The plurality of magneto-sensitive bodies are formed of an amorphous material, and are fixed on the substrate , and are electrically connected to each other. The detecting coils are wound around each of the magneto-sensitive bodies , and are electrically connected to each other. The MI sensor element outputs a voltage corresponding to a magnetic field strength acting on the magneto-sensitive bodies from the detecting coil by flowing a pulse current or a high-frequency current to the magneto-sensitive body . The plurality of magneto-sensitive bodies are formed by fixing one amorphous wire on the substrate , and then cutting the wire. 1. A method for producing a magneto-impedance sensor element , wherein the magneto-impedance sensor element includesa substrate formed from a non-magnetic material,a plurality of magneto-sensitive bodies, which are formed from an amorphous material, are fixed on the substrate, and are electrically connected to each other, anda plurality of detecting coils, each of which is wound around each of the magneto-sensitive bodies, and which are electrically connected to each other,the magneto-impedance sensor element being configured to output a voltage corresponding to a magnetic field strength acting on the magneto-sensitive bodies from the detecting coils by flowing a pulse current or high-frequency current to the magneto-sensitive bodies,the method for producing the magneto-impedance sensor element comprising:a fixing step in which an amorphous wire is fixed on the substrate;a cutting step in which the amorphous wire is cut to divide it in an axis line direction, thereby forming the plurality of magneto-sensitive bodies; anda connecting step in which the plurality of magneto-sensitive bodies are electrically connected to each other.2. A magneto-impedance sensor element comprising:a ...

Подробнее
Номер записи: 19
18-07-2013 дата публикации

CAPACITIVE SENSOR SHEET AND PRODUCTION METHOD THEREOF

Номер: US20130181727A1
Автор: Kobayashi Yusuke, Komatsu Hiroto, NISHIZAWA Koji
Принадлежит:

A production method of a capacitive sensor sheet, comprising: a film forming step forming of a optically-transparent electroconductive film on the surface of a substrate having optical transparency; a supplemental electrode forming step of setting an electrode region which functions as the transparent electrode at least in part of the film , and laminating a supplemental electrode which has a lower electrical resistance than the electrical resistance of the film to cover at least part of a periphery of the electrode region ; a wire forming step of laminating a wire in which one end thereof is connected to the supplemental electrode on the film ; a resist laminating step of laminating a resist to cover all of the electrode region and at least part of the supplemental electrode ; and a conductive film removing step of removing a part of the film formed on the substrate having optical transparency placed at a position not overlapping with the resist , the supplemental electrode , or the wire 1. A production method of a capacitive sensor sheet , comprising:a film forming step of forming an optically-transparent electroconductive film on at least one surface of a substrate having optical transparency;a supplemental electrode forming step of setting an electrode region which functions as the transparent electrode at least in part of the optically-transparent electroconductive film, and laminating a supplemental electrode which has a lower electrical resistance than the electrical resistance of the optically-transparent electroconductive film to cover at least part of a periphery of the electrode region;a wire forming step of laminating a wire in which one end thereof is connected to the supplemental electrode on the optically-transparent electroconductive film;a resist laminating step of laminating a resist to cover all of the electrode region and at least part of the supplemental electrode; andan electroconductive film removing step of removing a part of the optically- ...

Подробнее
Номер записи: 20
18-07-2013 дата публикации

LOW-PROFILE TEMPERATURE SENSOR PROBE

Номер: US20130182745A1
Автор: Gang Xue, Hertel Amy
Принадлежит: Therm-O-Disc, Incorporated

A low-profile temperature sensor probe is disclosed as including a probe circuit subassembly having a temperature sensing thermistor, the subassembly being overmolded with a durable insulating material to form the probe body. The probe body forms a connector block portion and a flexible extension portion. The flexible extension portion enables the sensor probe to conform to the surface of the object to be sensed without undue strain on the components. The thermistor element is located in a protective pocket and positioned relative the probe body to ensure direct contact with the object to be sensed. The connector block is configured to accommodate a standard plug-in type electrical connector. 1. A low-profile temperature sensor probe comprising:a probe circuit encapsulated by an integral dielectric body that is molded over the probe circuit;the probe circuit comprising:a thermistor element including a pair of insulated thermistor leads;a first protective tubular material surrounding both of the thermistor leads;a pair of insulated lead wires having a first end and a second end, each lead wire electrically connected at the first end to a respective one of the thermistor leads, thereby creating two electrical splice connections between insulated thermistor leads and the insulated lead wires;a pair of terminals, each lead wire electrically connected at the second end to a respective one of the terminals;a first heat-shrinkable, dielectric tubular material surrounding one of the pair of electrical splice connections, the tubular material isolating the electrical splice connections from each other; anda second heat-shrinkable, dielectric tubular material surrounding both of the pair of electrical splice connections and the first tubular material;the body comprising a connector block portion and an extension portion, the connector block portion housing the electric terminals and being configured to accommodate a plug-in type electrical connector, the extension portion ...

Подробнее
Номер записи: 21
08-08-2013 дата публикации

Methods and Systems for Cleaning Needles of a Probe Card

Номер: US20130200914A1
Автор: Hwang In-Seok, KANG Sang-Boo, KIM Do-Yun
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

A method of cleaning needles of a probe card in a test system includes mounting the probe card, which has a plurality of device under tests (DUTs) and needles, in a card mounting part. The DUTs and needles are scanned using a camera positioned in the test system to provide a scan result. A laser beam is focused on at least one of the needles based on the scan result and the laser beam is irradiated on the at least one of the needles to clean the at least one of the needles. 1. A method of cleaning needles of a probe card in a test system , the method comprising:mounting the probe card having a plurality of device under tests (DUTs) and needles in a card mounting part;scanning the DUTs and needles using a camera positioned in the test system to provide a scan result;focusing a laser beam on at least one of the needles based on the scan result; andirradiating the laser beam on the at least one of the needles to clean the at least one of the needles.2. The method of claim 1 , wherein the laser beam comprises a plurality of laser beams and the at least one needle comprises a plurality of needles and wherein focusing the laser beams comprises comparing the scan result with a stored image corresponding a case where the laser beams are focused on the needles and moving the laser beams or the probe card to focus the laser beams on the needles based on the comparison of the scan result and the stored image.3. The method of claim 2 , wherein irradiating the laser beams is followed by scanning the cleaned needles using the camera to provide a cleaning result image.4. The method of claim 3 , wherein scanning the cleaned needles is followed by:identifying ones of the needles that are not yet clean based on the cleaning result image; andrepeating focusing the laser beams and irradiating the laser beams to clean the identified ones of the needles that are not yet cleaned.5. The method of claim 4 , wherein identifying ones of the needles includes displaying the cleaning result ...

Подробнее
Номер записи: 22
22-08-2013 дата публикации

ELECTRIC SENSOR WEB, SYSTEM AND A METHOD FOR ITS MANUFACTURE

Номер: US20130213928A1
Автор: JOUTSENOJA TIMO, KYYNY KARI, VIRTANEN JUHANI
Принадлежит: MARIMILS OY

A method for manufacturing a sensor web. A metal foil attached to a surface of a release web is die-cut to form electrically conductive areas and conductors. A first protective film is attached to the release web so that the first protective film covers the electrically conductive areas and conductors. The release web is replaced with a backing film. 110-. (canceled)11. A method for manufacturing of a sensor web , the method comprising:die-cutting a metal foil attached to a surface of a release web to form electrically conductive areas and conductors,attaching a first protective film to the release web so that the first protective film covers the electrically conductive areas and conductors, andreplacing the release web with a backing film.12. The method according to claim 11 , further comprising:die-cutting the metal foil attached to the surface of the release web to form RF loops and conductors so that the RF loops and conductors are formed in a same process step as the electrically conductive areas and conductors, andattaching the first protective film to the release web so that the first protective film covers the electrically conductive areas and conductors and the RF loops and conductors.13. The method according to claim 11 , further comprising:die-cutting a metal foil attached to a surface of a second release web to form RF loops and conductors so that the RF loops and conductors are formed in a different process step as the electrically conductive areas and conductors, andattaching a second protective film to the second release web so that the second release web covers the RF loops and their conductors.14. The method according to claim 13 , further comprising:removing one of the release webs, andsuperimposing the first protective film and the second protective film.15. The method according to claim 14 , wherein the first protective film and the second protective film are laminated together.16. The method according to claim 15 , wherein the first protective ...

Подробнее
Номер записи: 23
29-08-2013 дата публикации

ELECTRICAL CURRENT SENSOR AND METHOD OF MANUFACTURING THE SAME

Номер: US20130221959A1
Автор: NISHIYAMA Yoshihiro, OKI Naruaki
Принадлежит: ALPS GREEN DEVICES CO., LTD.

An electrical current sensor includes a first laminated body having a magnetic detection element disposed over a first substrate, a protective film formed over the first substrate and the magnetic detection element, and a coil formed over the protective film, and a second laminated body having a shield layer formed over a second substrate and which is formed by bonding the first laminated body and the second laminated body to each other with an adhesion layer interposed therebetween such that the magnetic detection element and the shield layer face each other. 1. An electrical current sensor comprising:a first laminated body having a first substrate, a magnetic detection element disposed over the first substrate, a protective film formed over the first substrate and the magnetic detection element, and a coil formed on the protective film; anda second laminated body having a second substrate and a shield layer formed on the second substrate,wherein the first laminated body and the second laminated body are bonded to each other with an adhesion layer interposed therebetween such that the magnetic detection element and the shield layer face each other.2. An electrical current sensor comprising:a first laminated body having a first substrate and a magnetic detection element disposed over the first substrate; anda second laminated body having a second substrate, a shield layer formed on the second substrate, a protective film formed over the second substrate and the shield layer, and a coil formed on the protective film,wherein the first laminated body and the second laminated body are bonded to each other with an adhesion layer interposed therebetween such that the magnetic detection element and the shield layer face each other.3. The electrical current sensor according to claim 1 , further comprising:an aluminum oxide layer formed between the first substrate and the magnetic detection element.4. A method of manufacturing an electrical current sensor claim 1 , the ...

Подробнее
Номер записи: 24
29-08-2013 дата публикации

WIRING BOARD AND PROBE CARD USING THE SAME

Номер: US20130222003A1
Автор: TAGUCHI Takayuki, TERADA Kenji
Принадлежит: KYOCERA SLC TECHNOLOGIES CORPORATION

A wiring board and a probe card using the wiring board which respond to a demand for improving electrical reliability. 1. A wiring board comprising:a core substrate; anda buildup layer formed on the core substrate, a plurality of resin layers laminated on the core substrate;', 'a plurality of pads formed on a topmost layer of the resin layers and to which a plurality of probes are respectively connected;', 'a plurality of wiring conductors formed on either the resin layers or the core substrate and electrically connecting the plurality of pads individually to an external circuit;', 'a via conductor penetrating through the resin layer in a thickness direction thereof and electrically connecting the pad and the wiring conductor together; and', 'a dummy via conductor penetrating through the resin layer in the thickness direction thereof without electrically connecting the pad and the wiring conductor together,, 'wherein the buildup layer includeswherein the via conductor and the dummy via conductor are arranged immediately below each of the pads,the pads include a first pad with at least one of the dummy via conductors arranged immediately therebelow, and a second pad with only the via conductor arranged immediately therebelow, andwherein a total amount of the dummy via conductors and a quantity of the via conductors formed immediately below the first pad is equal to an amount of the via conductors formed immediately below the second pad.2. The wiring board according to claim 1 ,wherein the plurality of wiring conductors include a first wiring conductor electrically connected to the first pad, and a second wiring conductor positioned in a layer different from a layer in which the first wiring conductor is positioned and electrically connected to the second pad.3. The wiring board according to claim 1 ,wherein the first dummy via conductor and the first via conductor formed immediately below the first pad are distanced away from each other with the resin layer ...

Подробнее
Номер записи: 25
12-09-2013 дата публикации

FINE PITCH PROBE ARRAY FROM BULK MATERIAL

Номер: US20130234747A1
Автор: NAMBURI Lakshmikanth
Принадлежит: ADVANTEST CORPORATION

Fine pitch probe array from bulk material. In accordance with a first method embodiment, an article of manufacture includes an array of probes. Each probe includes a probe tip, suitable for contacting an integrated circuit test point. Each probe tip is mounted on a probe finger structure. All of the probe finger structures of the array have the same material grain structure. The probe fingers may have a non-linear profile and/or be configured to act as a spring. 1. An article of manufacture comprising: a probe tip, suitable for contacting an integrated circuit test point;', 'said probe tip mounted on a probe finger structure,, 'an array of probes, wherein each probe compriseswherein all said probe finger structures of said array have the same material grain structure.2. The article of manufacture of wherein said probe finger structure has a non-linear profile.3. The article of manufacture of wherein said probe finger structure is configured to act as a spring.4. The article of manufacture of further comprising a conductive metal coating on said probe finger structure claim 1 , wherein said coating is in electrical contact with said probe tip claim 1 ,5. The article of manufacture of wherein said probe tip comprises a noble metal excluding gold.6. The article of manufacture of wherein said probe tips of said array of probes are arranged on a grid of less than 50 μm.7. The article of manufacture of wherein said array of probes is functionally coupled to a space transforming substrate claim 1 , for transforming a pitch of said array of probes to a larger pitch.8. A method comprising:accessing a bulk material with first and second substantially parallel faces;forming a probe base on said first face;forming a probe tip suitable for contacting an integrated circuit test point on said probe base;mounting said second face to a carrier wafer;removing portions of said bulk material to form a probe finger structure coupled to said probe base and said probe tip; andcoating said ...

Подробнее
Номер записи: 26
12-09-2013 дата публикации

TRANSFERRING ELECTRONIC PROBE ASSEMBLIES TO SPACE TRANSFORMERS

Номер: US20130234748A1
Автор: CROS Florent, NAMBURI Lakshmikanth
Принадлежит: ADVANTEST CORPORATION

Transferring electronic probe assemblies to space transformers. In accordance with a first method embodiment, a plurality of probes is formed in a sacrificial material on a sacrificial substrate via microelectromechanical systems (MEMS) processes. The tips of the plurality of probes are formed adjacent to the sacrificial substrate and the remaining structure of the plurality of probes extends outward from the sacrificial substrate. The sacrificial material comprising the plurality of probes is attached to a space transformer. The space transformer includes a plurality of contacts on one surface for contacting the plurality of probes at a probe pitch and a corresponding second plurality of contacts on another surface at a second pitch, larger than the probe pitch, wherein each of the second plurality of contacts is electrically coupled to a corresponding one of the plurality of probes. The sacrificial substrate is removed, and the sacrificial material is removed, leaving the plurality of probes intact. 1. A method comprising:forming a plurality of probes in a sacrificial material on a sacrificial substrate via microelectromechanical systems (MEMS) processes,wherein tips of said plurality of probes are formed adjacent to said sacrificial substrate and the remaining structure of said plurality of probes extends outward from said sacrificial substrate;attaching said sacrificial material comprising said plurality of probes to a space transformer,wherein said space transformer comprises a plurality of contacts on one surface for contacting said plurality of probes at a probe pitch and a corresponding second plurality of contacts on another surface at a second pitch, larger than said probe pitch, wherein each of said second plurality of contacts is electrically coupled to a corresponding one of said plurality of probes;removing said sacrificial substrate; andremoving said sacrificial material, while leaving said plurality of probes intact.2. The method of wherein said ...

Подробнее
Номер записи: 27
26-09-2013 дата публикации

Sensing systems and methods

Номер: US20130253422A1
Автор: Ian B. Hanson, Paul F. Bente, IV
Принадлежит: Medtronic Minimed Inc

A fluidic media detection system for detecting a presence of fluidic media includes a first housing portion adapted to be carried by a user; a second housing portion configured to be selectively operatively engaged with and disengaged from the first housing portion, the second housing portion for supporting a reservoir having an interior volume for containing fluidic media; a fluid conduit supported by one of the first housing portion and the second housing portion for providing fluid communication between the reservoir and the user when the first housing portion and the second housing portion are operatively engaged; and at least one interactive element, positioned near a portion of the fluid conduit, that interacts with the fluidic media when the fluidic media is present in the fluid conduit.

Подробнее
Номер записи: 28
03-10-2013 дата публикации

METHOD FOR MANUFACTURING PRESSURE SENSING DEVICE

Номер: US20130255069A1
Автор: Fuji Yoshihiko, FUKUZAWA Hideaki, Hara Michiko, Higashi Yoshihiro, NAGATA Tomohiko, Yuasa Hiromi
Принадлежит:

According to one embodiment, a method for manufacturing a pressure sensing device includes preparing a sensor unit and a mounting substrate. The sensor unit includes: a membrane body; and an element unit provided on the membrane body. The element unit includes: a first electrode; a second electrode; and a first magnetic layer provided between the first electrode and the second electrode and having magnetization in a first direction. The mounting substrate includes: a base; a first electrode pad provided on the base; and a second electrode pad provided on the base and provided apart from the first electrode pad. The method further includes joining the first electrode pad to the first electrode while heated, and joining the second electrode pad to the second electrode while heated, with an external magnetic field along the first direction applied to the sensor unit. 1. A method for manufacturing a pressure sensing device comprising: [ a membrane body; and', the element unit including:', 'a first electrode;', 'a second electrode; and', 'a first magnetic layer provided between the first electrode and the second electrode and having magnetization in a first direction;, 'an element unit provided on the membrane body,'}], 'the sensor unit including, a base;', 'a first electrode pad provided on the base; and', 'a second electrode pad provided on the base and provided apart from the first electrode pad; and, 'the mounting substrate including], 'preparing a sensor unit and a mounting substrate,'}joining the first electrode pad to the first electrode while heated, and joining the second electrode pad to the second electrode while heated, with an external magnetic field along the first direction applied to the sensor unit.2. The method according to claim 1 , whereinthe first electrode has a first portion and a second portion;the second electrode has a third portion and a fourth portion; andthe first magnetic layer is provided between the second portion and the third portion.3. ...

Подробнее
Номер записи: 29
10-10-2013 дата публикации

Apparatus and Method for Securing an Enclosure

Номер: US20130263430A1
Автор: John Edward Stachowiak, Jr.
Принадлежит: Dewalch Technologies Inc

The present invention relates to an apparatus and method for securing a box cover to a watthour meter socket box. In certain embodiments, the apparatus has a clamping member that fits over a wall of a meter box, and a lock housing that locks to the clamping member after a box cover has been installed, thereby securing the cover to the box in a manner such that the box cover cannot be installed unless the clamping member has been installed correctly. In various other embodiments, the clamping member consists of a clamp disposed between a clamp actuating member and a fastening shelf. In various other embodiments, the clamp includes a stopping member for indicating when the clamp actuating member is actuated into a fully secured position. Other embodiments relate to a locking bracket and a lock housing wherein the locking bracket generally comprises a clamping member and a fastening lever that attaches to a wall of a meter box base. The lock housing generally comprises a unitary member with a perpendicular flange. The meter box lid is secured to the meter box base when the locking bracket is secured to the side wall (or another wall) and used in combination with the lock housing and a locking shaft.

Подробнее
Номер записи: 30
10-10-2013 дата публикации

Probe Card And Manufacturing Method Therefor

Номер: US20130265073A1
Автор: Matsuda Kazuhiro, Nakano Hirofumi, Uemura Taishi
Принадлежит: Japan Electronic Materials Corporation

The present invention provides a ST board that is formed with an lower surface electrode ; a unit attachment plate that is fastened on the ST board and formed with an opening part exposing the lower surface electrode ; a probe unit that includes a probe substrate formed with a contact probe and a probe electrode and is fastened on the unit attachment plate ; and an electrically conductive wire that connects the lower surface electrode and the probe electrode to each other through the opening part . The probe unit can be fastened on the ST board with the unit attachment plate intervening, and through the opening part of the unit attachment plate , the probe electrode and the lower surface electrode can be electrically connected to each other. 1. A probe card comprising:a wiring substrate that is formed with an electrode terminal;a unit attachment plate that is fastened on said wiring substrate and formed with an opening part exposing said electrode terminal;a probe unit that includes a probe substrate formed with a contact probe and a probe electrode and is fastened on said unit attachment plate; andan electrically conductive wire that connects said electrode terminal and said probe electrode to each other through said opening part.2. The probe card according to claim 1 , wherein:two or more said electrode terminals are exposed from said opening part in common; andtwo or more said probe electrodes on said probe unit are respectively connected to corresponding ones of said electrode terminals through two or more electrically conductive wires passing through said opening part in common.3. The probe card according to claim 2 , wherein:two or more probe units are arranged on said unit attachment plate in common; andsaid opening part has a long narrow shape that extends along outer edge parts of said probe units.4. A probe card manufacturing method comprising:a step of fastening a probe substrate formed with a contact probe and a probe electrode on a unit attachment plate ...

Подробнее
Номер записи: 31
17-10-2013 дата публикации

APPARATUS AND METHOD FOR AUTOMATED SORT PROBE ASSEMBLY AND REPAIR

Номер: US20130269173A1
Автор: Albertson Todd P., Craig David M., Kaza Anil, Shia David
Принадлежит:

An apparatus comprising a robot; an end effector coupled to the robot and configured to grasp or transfer a probe of a size for use in a probe card; and instructions stored on a machine readable medium coupled to the robot, the instructions comprising to configure the robot to transfer a probe to a probe card substrate or, where the probe is attached to a probe card substrate, to move the probe. A method comprising automatically transferring a probe to a probe card substrate in an assembly process or, where the probe is attached to a probe card substrate, moving the probe in a repair process; and after transferring or moving the probe, heating the probe with a heat source. 1. An apparatus comprising:a robot;an end effector coupled to the robot and configured to grasp or transfer a probe of a size for use in a probe card substrate; andinstructions stored on a machine readable medium coupled to the robot, the instructions comprising to configure the robot to transfer a probe to a probe card substrate or, where the probe is attached to a probe card substrate, to move the probe.2. The apparatus of claim 1 , further comprising a heat source and the instructions further comprise instructions to heat a grasped probe with the heat source.3. The apparatus of claim 1 , wherein the instructions to move a probe comprise instructions to move a grasped probe from a first position to a second position and the instructions to heat a grasped probe to a predetermined temperature for a predetermined time.4. The apparatus of claim 1 , wherein the instructions to transfer a probe to a probe card substrate further comprise instructions to move the probe card substrate to a predetermined position to provide a location for the transfer of the probe.5. The apparatus of claim 1 , wherein the robot comprises a work envelope and the end effector comprises gripper and the instructions to transfer a probe to a probe card substrate further comprise instructions to move the gripper to a first ...

Подробнее
Номер записи: 32
17-10-2013 дата публикации

Wiring Substrate With Filled Vias To Accommodate Custom Terminals

Номер: US20130271175A1
Автор: Powell Shawn
Принадлежит: FORMFACTOR, INC.

A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via. 1. A process for providing a custom electrically conductive terminal on a first surface of a wiring substrate , wherein said wiring substrate comprises electrically conductive vias from said first surface to an opposite surface of said wiring substrate , said process comprising:forming a hole at a first one of said vias from said first surface into said wiring substrate and thereby removing all electrically conductive material of said first via in a gap from said first surface into said wiring substrate;depositing an electrically insulating material into said hole such that said electrically insulating material is disposed between all remaining electrically conductive material of said first via and said first surface of said wiring substrate; andproviding on said first surface of wiring substrate and said insulating material said custom terminal such that said custom terminal overlaps said first via and a second one of said vias that is adjacent to said first via without electrically contacting said first via.2. The process of claim 1 , wherein said custom terminal overlaps said first via and said second via and a third one of said vias.3. The process of ...

Подробнее
Номер записи: 33
24-10-2013 дата публикации

SENSOR FOR DETECTING DAMAGE TO AN OBJECT

Номер: US20130278275A1
Автор: Iwamoto Takashi
Принадлежит: EMPIRE TECHNOLOGY DEVELOPMENT LLC

A sensor for detecting damage to an object may include a housing, a first coating provided on a surface of a first end of the housing, and a second coating provided on a surface of a second end of the housing opposing the first end. The first coating may be configured to be exposed to an environment in which the object is placed, while the second coating may be configured to be hermitically sealed. The sensor may further include a plurality of electrodes placed in the housing connected to the first end and the second end so as to measure an electrical signal generated therebetween. 1. A sensor for detecting damage to an object , the sensor comprising:a housing;a first coating provided on a surface of a first end of the housing configured to be exposed to an environment in which the object is placed;a second coating hermetically sealed and provided on a surface of a second end of the housing opposing the first end; anda plurality of electrodes placed in the housing connected to the first end and the second end to measure an electrical signal generated therebetween.2. The sensor of claim 1 , wherein the first coating is made of an ionic-conductive material claim 1 , and the second coating is made of an ionic-conductive material.3. The sensor of claim 2 , wherein the first coating and the second coating are made of the same material.4. The sensor of claim 2 , wherein the ionic-conductive material comprises an electrolyte comprising a lithium salt and polyethylene oxide.5. The sensor of claim 1 , wherein the first coating and the second coating comprise a polymethylmethacrylate (PMMA) resin containing carbon nanotubes therein.6. The sensor of claim 1 , further comprising a cover arranged at the second end and configured to hermetically seal the second coating.7. The sensor of claim 1 , further comprising a Wheatstone bridge circuit electrically connected to the plurality of electrodes.8. The sensor of claim 1 , further comprising a transmitter configured to transmit the ...

Подробнее
Номер записи: 34
24-10-2013 дата публикации

METHOD FOR THERMAL STABILIZATION OF PROBE CARD AND INSPECTION APPARATUS

Номер: US20130278279A1
Автор: ISHII Kazunari, Koizumi Shinya, Matsuzaki Koichi, Watanabe Tetsuji
Принадлежит: TOKYO ELECTRON LIMITED

In a method for thermal stabilization of a probe card, a probe card is adjusted to a prescribed temperature in a short time by making a heat source directly contact the probe card and is accurately determined whether the probe card is thermally stable. A heat transfer substrate is mounted on a mounting table. The temperature of the heat transfer substrate is adjusted through the mounting table. The mounting table is raised, and a plurality of probes is brought into contact with the heat transfer substrate at a prescribed target load. The contact load between the heat transfer substrate and the probes, which changes according to the thermal changes in the probe card, is detected. The mounting table is controlled vertically through a vertical drive mechanism such that the contact load becomes the target load until the probe card is thermally stable. 1. A method for thermal stabilization of a probe card by using an inspection apparatus including: a horizontally and vertically movable mounting table; a probe card having a plurality of probes , disposed above the mounting table; a vertical drive mechanism configured to vertically move the mounting table; a temperature control unit configured to control a temperature of the mounting table; and a control unit configured to control the vertical drive mechanism and the temperature control unit , wherein before inspecting electrical characteristics of an inspection target at a predetermined temperature , the probe card is thermally stabilized by mounting a heat transfer substrate on the mounting table , adjusting the probe card to a predetermined temperature through the heat transfer substrate on the mounting table of which temperature is adjusted by the temperature control unit , and controlling a contact load between the heat transfer substrate and the probes to a predetermined target load by vertically moving the mounting table through the vertical drive mechanism , the method comprising:a first step of mounting the heat ...

Подробнее
Номер записи: 35
31-10-2013 дата публикации

TEST SOCKET INCLUDING ELECTRODE SUPPORTING PORTION AND METHOD OF MANUFACTURING TEST SOCKET

Номер: US20130285692A1
Автор: Lee Jae Hak
Принадлежит: ISC CO., LTD.

The test socket includes: an elastic conductive sheet including a conductive portion and an insulating supporting portion; a sheet type connector including an electrode portion that is disposed on the conductive portion and is formed of a metal, and a sheet member that supports the electrode portion, wherein the sheet member comprises a cut portion formed by cutting at least a portion of the sheet member between adjacent electrode portions; and an electrode supporting portion including an upper supporting portion that contacts an upper edge of the electrode portion to support the electrode portion and exposes an upper center portion of the electrode portion to be open and an electrode supporting portion including a connection supporting portion that connects the upper supporting portion and the insulating supporting portion. 1. A test socket including an electrode supporting portion , which is disposed between a terminal of a subject device and a pad of an inspection device to electrically connect the terminal and the pad , the test socket comprising:an elastic conductive sheet including a conductive portion, in which a plurality of conductive particles are arranged in an insulating material so that conductivity is exhibited in a thickness direction, at each position of a subject device corresponding to a terminal, and an insulating supporting portion that supports and insulates the conductive portion at a same time;a sheet type connector including an electrode portion that is disposed on the conductive portion and is formed of a metal, and a sheet member that supports the electrode portion, wherein the sheet member comprises a cut portion formed by cutting at least a portion of the sheet member between adjacent electrode portions; andan electrode supporting portion including an upper supporting portion that contacts an upper edge of the electrode portion to support the electrode portion and exposes an upper center portion of the electrode portion to be open and an ...

Подробнее
Номер записи: 36
14-11-2013 дата публикации

MANUFACTURING METHOD FOR ELECTRONIC COMPONENT, INSPECTION METHOD FOR ELECTRONIC COMPONENT, SHEET SUBSTRATE, ELECTRONIC COMPONENT, AND ELECTRONIC APPARATUS

Номер: US20130300447A1
Автор: HORIE Kyo
Принадлежит: SEIKO EPSON CORPORATION

A manufacturing method for an electronic component includes arranging, across boundaries of a first substrate region, wires for electrically connecting a piezoelectric resonator element arranged in the first substrate region and a lid arranged in a second substrate regions to a sheet substrate, performing, after arranging the piezoelectric resonator element and the lid in the substrate regions, input and output of a signal to and from the piezoelectric resonator element via the lid connected to the wires, and dividing the sheet substrate in each of the boundaries. 1. A manufacturing method for an electronic component comprising:preparing a sheet substrate on which a first substrate region, a second substrate region arranged to be integrated with the first substrate region, two terminals arranged in the first substrate region, a first conductive pattern arranged in the first substrate region, a second conductive pattern arranged in the second substrate region, and a first wire that electrically connects one of the two terminals and the second conductive pattern are arranged;electrically connecting an electronic element to the two terminals;arranging a first lid body on the first conductive pattern and electrically connecting the first conductive pattern and the first lid body, arranging a second lid body on the second conductive pattern and electrically connecting the second conductive pattern and the second lid body, and measuring a signal from the electronic element via the second lid body; andseparating the sheet substrate into the first substrate region and the second substrate region.2. The manufacturing method for an electronic component according to claim 1 , whereina second wire is further arranged on the sheet substrate and the second wire includes a path returning from the first substrate region to the first substrate region through the second substrate regions and electrically connects the other of the two terminals and the first conductive pattern, andthe ...

Подробнее
Номер записи: 37
21-11-2013 дата публикации

Method Of Manufacturing A Probe Comprising A Cantilever With A Conduit

Номер: US20130305519A1
Автор: Sarajlic Edin
Принадлежит: SMARTTIP B.V.

The present invention relates to a method of manufacturing a probe comprising a cantilever with a conduit. According to the invention, an etchant window is provided in a layer covering an elongated sacrificial conduit core that is to form the conduit. This allows for an etching process where the elongated sacrificial conduit core is etched away before all material of a substrate is etched away, the remaining material of the substrate material making the probe stronger without being in the way during use of the probe. 1. A method of manufacturing a probe , said probe comprisinga planar substrate, anda cantilever extending from said planar substrate, said cantilever having a base end connected to the planar substrate and a distal end, anda conduit extending from i) a first opening at the planar substrate at a location on the planar substrate away from the cantilever to a second opening in the cantilever away from the base end;the method involving etching a planar half-product, said planar half-product comprising a sandwich of a first layer of a first material, a second layer of a second material, a third layer of a third material on top of i) the second layer and ii) an elongated sacrificial conduit core of a fourth material, the second and third material being different from the first and fourth material, the planar half-product having a first side at the side of the first layer and a second side at the side of the third material, the second side being provided with a cover having a cover hole, the second layer having a patterned cantilever structure, the elongated sacrificial conduit core of the fourth material extending from the first layer at the patterned cantilever structure to the second side at the location of the cover hole, characterized in that the third layer is provided with an etchant window with an elongated shape extending from the cover hole towards the cantilever over part of the distance from the cover hole to the base end, said etchant window ...

Подробнее
Номер записи: 38
28-11-2013 дата публикации

MIXED CURRENT SENSOR AND METHOD FOR FITTING SAID SENSOR

Номер: US20130314083A1
Автор: LOGLISCI David
Принадлежит: Schneider Electric Industries SAS

The invention relates to a mixed current sensor comprising in a case: 1. A mixed current sensor comprising in a case:a magnetic current sensor having a coil wound around a magnetic circuit,a current measuring device comprising a Rogowski coil arranged in such a way that a primary circuit of the magnetic sensor corresponds to the primary circuit of said current measuring device,electronic means for performing acquisition and measurement of the electric current, said means being supplied by the coil of the magnetic sensor; first fixing means arranged to position and secure said cassette by clip-fastening onto the measuring device;', 'second fixing means arranged to position and secure said cassette and the measuring device by clip-fastening onto the case;', 'electric pins respectively connected to the Rogowski coil and to the electronic acquisition means., 'a sensor comprising a linking cassette comprising'}2. The mixed current sensor according to claim 1 , wherein the Rogowski coil is composed of an insulating shell on which a metal wire is wound claim 1 , said shell comprising clip-fastening means designed to collaborate with the first fixing means of the linking cassette.3. The mixed current sensor according to claim 2 , wherein the clip-fastening means of the shell and the first fixing means of the linking cassette form a system of mortise and tenon type.4. The mixed current sensor according to claim 1 , wherein the second fixing means comprise at least one centring and fixing pin to position and secure the linking cassette and the measuring device by clip-fastening on the case.5. The mixed current sensor according to claim 1 , wherein the case comprises a base comprising a first housing for the electronic acquisition and measuring means claim 1 , one of the walls of said housing comprising an opening for passage of the linking cassette.6. The mixed current sensor according to claim 5 , wherein the case comprises a first cover designed to be fixed by soldering ...

Подробнее
Номер записи: 39
28-11-2013 дата публикации

ELECTRONIC DEVICE INCLUDING DEVICE GROUND COUPLED FINGER COUPLING ELECTRODE AND ARRAY SHIELDING ELECTRODE AND RELATED METHODS

Номер: US20130314105A1
Автор: Gozzini Giovanni, SETLAK Dale R.
Принадлежит: Apple Inc.

An electronic device may include a housing and circuitry carried by the housing and having a device ground associated therewith. The electronic device may also include an array of biometric finger sensing pixel electrodes and an array shielding electrode outside the array of biometric finger sensing pixels. A finger coupling electrode may be outside the array shielding electrode and coupled to the device ground. The electronic device may also include drive circuitry capable of generating a drive signal for the array of biometric finger sensing pixel electrodes and a compensating drive signal for the array shielding electrode. 1. An electronic device comprising:a housing;circuitry carried by said housing and having a device ground associated therewith;an array of biometric finger sensing pixel electrodes;an array shielding electrode outside said array of biometric finger sensing pixels;a finger coupling electrode outside said array shielding electrode and coupled to the device ground; anddrive circuitry capable of generating a drive signal for said array of biometric finger sensing pixel electrodes and a compensating drive signal for said array shielding electrode.2. The electronic device of claim 1 , wherein said drive circuitry is capable of generating the compensating drive signal comprising a scaled replica of the drive signal.3. The electronic device of claim 1 , further comprising sense amplifier circuitry coupled to said array of biometric finger sensing pixel electrodes and having a circuit reference associated therewith different than the device ground; and wherein said drive circuitry is capable of generating the drive signal between the device ground and the circuit reference.4. The electronic device of claim 1 , wherein said array shielding electrode comprises a plurality of shielding pixel electrodes.5. The electronic device of claim 1 , further comprising a reference electrode between said array shielding electrode and said array of biometric finger ...

Подробнее
Номер записи: 40
05-12-2013 дата публикации

SENSOR ASSEMBLIES

Номер: US20130321002A1
Автор: Elliott Howard
Принадлежит: FUTURE TECHNOLOGY (SENSORS) LTD

The present invention provides a sensor body (′) that can be used as part of a sensor assembly, optionally a capacitive sensor that is used to measure the clearance between the tip of a gas turbine engine blade and the surrounding casing. The sensor body includes a core layer () having an electrically conductive electrode layer (). An outer insulating layer () substantially surrounds the core layer () and extends along a front part () of the sensor body to define a window layer () that provides a hermetic seal that excludes gas from any interface between the constituent layers of the sensor body. The core layer () and the outer insulating layer () are formed from the same electrically non-conducting ceramic material to avoid any problems with differential thermal expansion. The electrode layer () is embedded within a front part of the sensor body and extends between the core layer () and the window layer (). 1. A sensor body comprising:a core layer;an outer insulating layer that substantially surrounds the core layer and extends along a front part of the sensor body to define a window layer that provides a hermetic seal that excludes gas from any interface between the constituent layers of the sensor body, the core layer and the outer insulating layer being formed as separate components from the same electrically non-conducting ceramic material and bonded together to form the integral, multi-layer, sensor body; andan electrically conductive electrode layer between the core layer and the outer insulating layer, including between the core layer and the window layer.2. The sensor body according to claim 1 , wherein the component forming the outer insulating layer is a single-piece component having a main part and a window part that defines the window layer of the sensor body.3. The sensor body according to claim 1 , wherein the component forming the outer insulating layer is a two-piece component having a main part and a separate disc part that is bonded to the main ...

Подробнее
Номер записи: 41
26-12-2013 дата публикации

PROBE CARD AND MANUFACTURING METHOD

Номер: US20130342232A1
Автор: Park Young Geun
Принадлежит: M2N INC.

There is provided a probe card in contact with pads formed on a plurality of semiconductor dies on a wafer to test the semiconductor dies. The probe card includes a printed circuit board on which a plurality of pads are formed; a block plate having a plurality of grooves and attached to the printed circuit board; a plurality of sub-probe units equipped with a plurality of probe tips in contact with the pads of the semiconductor dies and detachably coupled to the plurality of grooves; and a plurality of interposer/space transformer units interposed between the sub-probe units and the printed circuit board and configured to electrically connect the probe tips to the pads of the printed circuit board and transform a pitch of the pads formed on the printed circuit to a pitch of the plurality of probe tips. 1. A probe card in contact with pads formed on a plurality of semiconductor dies on a wafer to test the semiconductor dies , the probe card comprising:a printed circuit board on which a plurality of pads are formed;a block plate having a plurality of grooves and attached to the printed circuit board;a plurality of sub-probe units equipped with a plurality of probe tips in contact with the pads of the semiconductor dies and detachably coupled to the plurality of grooves; anda plurality of interposer/space transformer units interposed between the sub-probe units and the printed circuit board and configured to electrically connect the probe tips to the pads of the printed circuit board and transform a pitch of the pads formed on the printed circuit to a pitch of the plurality of probe tips.2. The probe card of claim 1 , a body part having a plurality of slits that define a space transformation path; and', 'a plurality of micro pins that are inserted into the plurality of slits to electrically connect the printed circuit board to the sub-probe units., 'wherein the interposer/space transformer unit comprises3. The probe card of claim 2 ,wherein one of the interposer/space ...

Подробнее
Номер записи: 42
26-12-2013 дата публикации

Wafer Level Integrated Circuit Contactor and Method of Construction

Номер: US20130342233A1
Автор: Edwards Jathan, Halvorson Brian, Marks Charles
Принадлежит:

A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin () are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (). The elastomer is precompressed from its natural rest state between a top () plate and a bottom (). Pre compression improves the resilient response of the pins. The pin crows () are maintained relatively coplanar by the engagement of at least one flang (-) against an up-stop surface of plate , thereby insuring coplanarity of the crowns. The pin guide () is maintained in alignment with the retainer by establishing a registration corner () and driving the guide into the corner by elastomers in at least one diagonally opposite corner. 1. A test contact pin assembly for temporary contact with a test pad on a wafer level integrated circuit device under test (DUT) comprising:a. at least one slideable upper terminal pin, further having, a top extension for contacting the DUT, portion, at least one lateral cross member flange and a contact surface; said upper pin being slideable between an out of test position and an in-test position;b. at least one lower terminal pin having a foot and a like contact surface;c. said upper and lower pins being held in contact by bias forces which maintain their respective contacts surfaces together but in a slideable relationship to each other;d. an elastomeric material of predetermined height when in an uncompressed state, said material surrounding the pins to create said bias force;e. a substantially rigid top pin guide surface located atop said elastomeric material, including a pair of spaced part parallel walls defining a guide channel for said flange, an upper wall between said parallel walls defining an up-stop surface for said pin and an aperture in said up-stop surface for receiving an extended portion of said upper pin which protrudes beyond said guide surface to make contact with said DUT, said channel being sized to be large ...

Подробнее
Номер записи: 43
26-12-2013 дата публикации

Probe-on-substrate

Номер: US20130344694A1
Автор: David M. Audette, Dustin M. Fregeau, Kevin Bocash, S. Jay Chey, Steven A. Cordes
Принадлежит: International Business Machines Corp

Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls.

Подробнее
Номер записи: 44
09-01-2014 дата публикации

TEST MACHINE AND THE TEST METHOD FOR LIGHT EMITTING DIODE BACKLIGHT DRIVER, AND, MANUFACTURING METHOD FOR MONITOR POWER BOARD

Номер: US20140009161A1
Автор: LIU TIA-JING
Принадлежит: WISTRON CORP.

A test machine and a test method for a Light Emitting Diode (LED) backlight driver and a manufacturing method for a monitor power board are disclosed. A switch-controlled LED-light-bar load is coupled to an LED backlight driver on a monitor power board. The switch-controlled LED-light-bar load includes a plurality of light bars and a plurality of switches. Each light bar has a plurality of the LEDs which are connected in series. Each switch is connected in parallel to a portion of the LEDs of one light bar such that an effective amount of the LEDs of each light bar is adjustable. The switches are controlled according to a monitor specification that the monitor power board is adapted to. 1. A test machine for an LED backlight driver , comprising:a test instrument, providing testing probes to contact welds of a monitor power board; anda switch-controlled LED-light-bar load, coupled to the test instrument, wherein, via the testing probes of the test instrument, the switch-controlled LED-light-bar load is coupled to the LED backlight driver, a plurality of light bars, wherein each light bar includes a plurality of the LEDs connected in series;', 'a plurality of switches, wherein each switch is connected in parallel to a portion of the LEDs of one light bar such that an effective amount of the LEDs of each light bar is adjustable, and, the switches are controlled according to a monitor specification that the monitor power board is adapted to., 'wherein the switch-controlled LED-light-bar load comprises2. The test machine as claimed in claim 1 , wherein the test instrument further couples an AC power source to a switched power source of the monitor power board claim 1 , and the switched power source is further coupled to the LED backlight driver claim 1 , and the test instrument further provides the LED backlight driver with a backlight on/off control signal and a backlight intensity control signal.3. The test machine as claimed in claim 2 , wherein the test instrument ...

Подробнее
Номер записи: 45
09-01-2014 дата публикации

POSITION DETECTION APPARATUS AND MANUFACTURING METHOD OF THE SAME

Номер: US20140012537A1
Автор: KONO Yoshiyuki, Kubota Takamitsu, MIZUTANI Akitoshi
Принадлежит:

A position detection apparatus includes a magnetic generator, a magnetic detector, a storage, and a rotation angle calculator. The rotation angle calculator calculates a relative rotation angle of the magnetic generator with respect to the magnetic detector based on a voltage output from the magnetic detector and a relational expression of θ=sin((VH−c)/V)−b. In the relational expression, the relative rotation angle is defined as θ, the voltage output from the magnetic detector is defined as VH, a true maximum value of the voltage output from the magnetic detector is defined as V, a first true correction value is defined as b, and a second true correction value is defined as c. 1. A position detection apparatus comprising:a magnetic generator;a magnetic detector that outputs a voltage corresponding to a change of a magnetic flux density generated by a relative rotational movement between the magnetic detector and the magnetic generator;a storage that stores a relational expression indicating a relationship between a relative rotation angle of the magnetic generator with respect to the magnetic detector and the voltage output from the magnetic detector; anda rotation angle calculator electrically coupled to the magnetic detector and the storage, the rotation angle calculator calculating the relative rotation angle of the magnetic generator with respect to the magnetic detector based on the voltage output from the magnetic detector and the relational expression stored in the storage,{'sub': 0', '0, 'sup': '−1', 'wherein, when the relative rotation angle of the magnetic generator with respect to the magnetic detector is defined as θ, the voltage output from the magnetic detector corresponding to the rotation angle θ is defined as VH, a true maximum value of the voltage output from the magnetic detector is defined as V, a first true correction value that corrects a position shift of the magnetic generator with respect to the magnetic detector in a rotational direction of ...

Подробнее
Номер записи: 46
16-01-2014 дата публикации

HIGH FREQUENCY PROBE CARD

Номер: US20140015561A1
Автор: Chang Chia-Tai, CHANG Keng-Shieng, CHEN Chiu-Kuei, HUANG Yun-Ru, LAI Chien-Chang, TSAI Chin-Yi, Yang Chin-Tien, YANG Hui-Pin, YU Chen-Chih
Принадлежит:

A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and having a third opening corresponding to the at least one first and second openings, and at least one probe module including at least one N-type ground probe and at least one high frequency signal probe passing through the corresponding substrate, the interposing plate and the third opening and being electrically connected with the circuit board. Each high frequency signal probe includes an N-type signal probe and a first conductor corresponding to the N-type signal probe and being electrically connected with the N-type ground probe. An insulation layer is disposed between the first conductor and the N-type signal probe. 1. A high frequency probe card comprising:at least one substrate each having at least one first opening;an interposing plate disposed on the at least one substrate and provided with at least one second opening corresponding to the at least one first opening respectively;a circuit board disposed on the interposing plate and provided with a third opening corresponding to the at least one first opening and the at least one second opening; and at least one N-type ground probe; and', an N-type signal probe; and', 'a first conductor corresponding to the N-type signal probe and being electrically connected with the N-type ground probe; wherein an insulation layer is disposed between the N-type signal probe and the first conductor., 'at least one high frequency signal probe penetrating through the corresponding at least one substrate and the interposing plate, passing through the third opening and being electrically connected with the circuit board; each said high frequency signal probe comprising], 'at least one probe module disposed on the at least one substrate ...

Подробнее
Номер записи: 47
30-01-2014 дата публикации

Device Intended For Measuring Pressure From A Flexible, Foldable, And/Or Extendable Object Made Of A Textile Material And Comprising A Measurement Device

Номер: US20140026678A1
Автор: Cannard Francis, DIOT Bruno, Payan Yohann, VUILLERME Nicolas
Принадлежит:

The present invention relates to a device for measuring the pressure and/or the tension exerted at different points of a flexible, foldable and/or extensible textile material capable of being used as a garment, lapel, or the like; said device is remarkable in that it includes, on the one hand, at least one sensor obtained from a single layer (1), formed of an arrangement of at least three types of fibers, piezoresistive fibers forming piezoresistive areas (2), conductive fibers forming electrically-conductive areas (3), and insulating fibers forming electrically-insulating areas (4) and, on the other hand, an electronic circuit (5) capable of measuring the electric resistance variation of the piezoresistive areas submitted to one or several forces. 1. A device for measuring a pressure and/or a tension exerted at different points of a flexible , foldable , and/or extensible material , capable of being used as a garment , lapel , or the like , characterized in that it comprises at least one sensor having a single layer comprising an arrangement of at least three types of fibers , the at least three types of fibers including piezoresistive fibers forming piezoresistive areas , conductive fibers forming electrically-conductive areas , and insulating fibers forming electrically-insulating areas , and an electronic circuit capable of measuring the electric resistance variation of the piezoresistive areas submitted to at least one force.2. The device of claim 1 , characterized in that the layer comprises at least one piezoresistive area and at least two electrically-conductive areas insulated from each other by at least one electrically-insulating area and in contact by with the at least one piezoresistive area claim 1 , and each of said piezoresistive claim 1 , electrically conductive claim 1 , and electrically-insulative areas are formed of at least one row of fibers.3. The device of claim 1 , characterized in that the layer comprises a plurality of piezoresistive areas ...

Подробнее
Номер записи: 48
30-01-2014 дата публикации

Probe Card Assemblies And Probe Pins Including Carbon Nanotubes

Номер: US20140028342A1
Автор: Brandorff Alexander
Принадлежит:

A probe card assembly for testing circuit boards is disclosed. In some embodiments, the assembly includes the following: a multi-layered dielectric plate aligned with an integrated circuit, the integrated circuit having on its surface a first plurality of electrical contacts arranged in a pattern, the dielectric plate having arrayed upon its surface a second plurality of electrical contacts arranged in a pattern substantially matching the first plurality of electrical contacts; a nanotube interposer interposed between the dielectric plate and the integrated circuit, the nanotube interposer having compliant carbon nanotubes that are arranged to match the pattern of electrical contacts on the integrated circuit and the dielectric plate; and a plurality of vertical probes arrayed upon the nanotube interposer and joined with the nanotubes, the vertical probes making electrical contact with the first plurality of electrical contacts and the second plurality of electrical contacts via the nanotubes. 1. A probe card assembly for testing circuit boards comprising:a multi-layered dielectric plate aligned with an integrated circuit, said integrated circuit having arrayed upon its surface a first plurality of electrical contacts arranged in a pattern, said dielectric plate having arrayed upon its surface a second plurality of electrical contacts arranged in a pattern substantially matching said first plurality of electrical contacts;a carbon nanotube interposer interposed between said dielectric plate and said integrated circuit, said nanotube interposer having compliant carbon nanotubes that are arranged to match the pattern of electrical contacts on said integrated circuit and said dielectric plate; anda plurality of substantially non-compliant vertical probes arrayed in a pattern upon said nanotube interposer and joined with said nanotubes, said vertical probes making electrical contact with said first plurality of electrical contacts and said second plurality of electrical ...

Подробнее
Номер записи: 49
06-02-2014 дата публикации

CAPACITIVE SENSOR SHEET PRODUCING METHOD AND CAPACITIVE SENSOR SHEET

Номер: US20140035599A1
Автор: Komatsu Hiroto, Shimata Satoshi
Принадлежит: SHIN-ETSU POLYMER CO., LTD.

A capacitive sensor sheet producing method for producing a capacitive sensor sheet uses a base having an insulative base layer on which a binder resin layer including conductive nanowires is formed. The conductive nanowires partially projecting from a surface of the binder resin layer. The method includes removing a binder resin from projections of conductive nanowires partially projected from a plurality of detection electrodes by implementing a surface etching and shaping treatment on a surface of the binder resin layer, or surface ends of at least partial detection electrodes of the plurality of detection electrodes, forming wiring lines of the conductive pattern layer, and connecting the wiring lines to the surface ends of at least partial detection electrodes in the pattern layer. The projections of the conductive nanowires removed the binder resin are put into contact with the connecting portions. 1. A capacitive sensor sheet producing method for producing a capacitive sensor sheet by using a base having an insulative base layer on which a binder resin layer including conductive nanowires is formed , the conductive nanowires partially projecting from a surface of the binder resin layer , comprising the steps of:when a plurality of detection electrodes of a conductive pattern layer are formed by shaping a binder resin layer of a base, removing a binder resin from projections of conductive nanowires partially projected from the detection electrodes by implementing a surface etching and shaping treatment on a surface of the binder resin layer, or surface ends of at least partial detection electrodes of the plurality of detection electrodes;forming wiring lines of the conductive pattern layer by applying a conductive material on a base layer of the base and drying and curing the applied conductive material; and,connecting the wiring lines to the surface ends of at least partial detection electrodes in the pattern layer,wherein the projections of the conductive ...

Подробнее
Номер записи: 50
13-02-2014 дата публикации

METHOD FOR ADJUSTING MAGNETIC RESONANCE IMAGING APPARATUS AND SUPERCONDUCTIVE MAGNET EXCITATION DOCK

Номер: US20140043030A1
Автор: Tsuda Munetaka
Принадлежит:

An adjustment method of a magnetic resonance imaging apparatus includes: a cooling and excitation step in which work of transporting a superconducting magnet to a facility different from a facility where the superconducting magnet is to be installed, cooling a superconducting coil of the superconducting magnet with a refrigerant, and supplying a current from an external power supply for excitation is repeated until a predetermined rated current flows; a demagnetization and transportation step of demagnetizing the superconducting coil and transporting the superconducting magnet to the facility where the superconducting magnet is to be installed in a state where the superconducting coil is cooled by the refrigerant; and an installation step of installing the superconducting magnet in the facility where the superconducting magnet is to be installed and supplying a predetermined rated current from an external power supply to the superconducting coil in order to excite the superconducting coil. 110-. (canceled)11. A dock for superconducting magnet excitation comprising:a plant for condensing helium gas to liquid helium;a frame on which a superconducting magnet is mounted;a supply pipe used to send liquid helium from the plant to the superconducting magnet;a recovery pipe used to send helium gas from the superconducting magnet to the plant;a power supply for supplying an excitation current to the superconducting magnet; anda power lead which connects the power supply to the superconducting magnet.12. The dock for superconducting magnet excitation according to claim 11 ,wherein at least two recovery pipes with different diameters used to send the helium gas from the superconducting magnet to the plant are disposed, andthe recovery pipe with a larger diameter is connected to an emergency exhaust hole for exhausting helium gas, which evaporates in the superconducting magnet in the event of a quench, to the outside.13. The dock for superconducting magnet excitation according ...

Подробнее
Номер записи: 51
13-02-2014 дата публикации

HIGH-PRESSURE, HIGH-TEMPERATURE MAGIC ANGLE SPINNING NUCLEAR MAGNETIC RESONANCE DEVICES AND PROCESSES FOR MAKING AND USING SAME

Номер: US20140044598A1
Автор: Hu Jian Zhi, Hu Mary Y., Lercher Johannes A., Peden Charles H. F., Townsend Mark R.
Принадлежит: BATTELLE MEMORIAL INSTITUTE

Re-usable ceramic magic angle spinning (MAS) NMR rotors constructed of high-mechanic strength ceramics are detailed that include a sample compartment that maintains high pressures up to at least about 200 atmospheres (atm) and high temperatures up to about least about 300° C. during operation. The rotor designs minimize pressure losses stemming from penetration over an extended period of time. The present invention makes possible a variety of in-situ high pressure, high temperature MAS NMR experiments not previously achieved in the prior art. 1. A magic angle sample spinning (MAS) nuclear magnetic resonance (NMR) rotor for high pressure and high temperature operation , comprising:a rotor cylinder composed of a high mechanical strength ceramic;a ceramic insert configured to insert along the length of inner wall of the rotor cylinder with an opening at one end thereof and an inner bore that extends to a selected depth therein that defines a sample compartment when the ceramic insert is inserted into the rotor cylinder;a threaded sealing cap configured to thread into matching threads disposed along the length of the inner wall of the ceramic insert above the sample compartment, the sealing cap when threaded into the ceramic insert compresses a high temperature O-ring that seals the sample compartment that maintains a combined high pressure and high temperature therein during operation.2. The rotor of claim 1 , wherein the ceramic insert defines a sample compartment within the rotor cylinder that maintains a combined temperature of at least up to about 250° C. and a pressure at least up to about 10 atm during operation.3. The rotor of claim 1 , wherein the sample compartment includes a volume defined by the depth of the inner bore within the ceramic insert with an inner diameter that spans the diameter of the ceramic insert less the wall thickness of the ceramic insert surrounding the sample compartment.4. The rotor of claim 1 , wherein the sealing cap includes an ...

Подробнее
Номер записи: 52
13-02-2014 дата публикации

PROBE FABRICATION USING COMBINED LASER AND MICRO-FABRICATION TECHNOLOGIES

Номер: US20140044985A1
Автор: Kister January
Принадлежит: FORMFACTOR, INC.

A method of making a probe (and the resulting probe) comprising providing a metal foil, creating a tip on an edge of the foil, and laser cutting a body of the probe from the foil with one or more tips at an end of the body. 1. A method of making a probe , the method comprising the steps of:providing a metal foil;creating a tip on an edge of the foil; andlaser cutting a body of the probe from the foil with one or more tips at an end of the body.2. The method of wherein the creating step comprises one or more of laser cutting claim 1 , plating claim 1 , depositing claim 1 , and sputtering material.3. The method of wherein the creating step comprises layering the material by one or more of plating claim 2 , depositing claim 2 , and sputtering.4. The method of wherein the material comprises Rhodium or Palladium.5. The method of wherein the creating step additionally comprises etching spring material prior to the one or more of plating claim 3 , depositing claim 3 , and sputtering material.6. The method of wherein the spring material comprises BeCu.7. The method of wherein the laser cutting employs one or more picosecond lasers.8. The method of additionally comprising creating a distal end of the probe proximate an edge of the metal foil opposite the edge having the tip.9. The method of wherein creating the distal end comprises one or more of laser cutting claim 8 , plating claim 8 , depositing claim 8 , and sputtering material.10. The method of wherein creating the distal end additionally comprises etching spring material prior to one or more of plating claim 9 , depositing claim 9 , and sputtering material.11. A probe made via the steps of:providing a metal foil;creating a tip on an edge of the foil; andlaser cutting a body of the probe from the foil with one or more tips at an end of the body.12. The probe of wherein the creating step comprises one or more of laser cutting claim 11 , plating claim 11 , depositing claim 11 , and sputtering material.13. The probe of ...

Подробнее
Номер записи: 53
13-02-2014 дата публикации

INTEGRATED PLASMONIC SENSING DEVICE AND APPARATUS

Номер: US20140045730A1
Автор: WALTERS Robert Joseph
Принадлежит: Integrated Plasmonics Corporation

An integrated plasmonic sensing device is monolithically integrated and provides marker-free detection (eliminating the need to use fluorescent or absorbing markers) and in-situ monitoring of conditions at each detection region. The integrated plasmonic sensing device includes a plasmonic backplane disposed on a monolithically integrated image sensor. One or more plasmonic scattering regions and one or more plasmonic via regions laterally offset from the plasmonic scattering regions are provided in the plasmonic sensing device. Guided plasmonic modes mediate power transfer through the plasmonic backplane to one or more underlying image sensor pixels. 1. A sensor comprising:a plurality of measurement regions supporting changes in surface plasmon excitation in response to incident light at each measurement region,a plurality of photodetectors, with each photodetector connected to one or more measurement regions by plasmon vias capable of supporting guided plasmons, andwherein the plurality of measurement regions and plurality of photodetectors are monolithically integrated and together form an integrated sensor capable of producing electrical signals in response to molecular recognition events at each measurement region.2. A sensor in accordance with wherein the plurality of photodetectors together comprise an image sensor formed in a semiconductor substrate and the plurality of measurement regions form part of a plasmonic backplane located between a fluid chamber and the plurality of photodetectors.3. A sensor in accordance with wherein more than one of the plurality of photodetectors are connected to one of the plurality of measurement regions by one or more plasmon vias.4. A sensor in accordance with wherein more than one of the plurality of measurement regions are connected to one of the plurality of photodetectors by one or more plasmon vias.5. A sensor in accordance with wherein at least some of the plurality of measurement regions are laterally offset from and ...

Подробнее
Номер записи: 54
27-02-2014 дата публикации

Integrated Circuit Die Having Input and Output Circuit Pads, Test Circuitry, and Multiplex Circuitry

Номер: US20140055158A1
Автор: Hales Alan, Whetsel Lee D.
Принадлежит: TEXAS INSTRUMENTS INCORPORATED

Test circuits located on semiconductor die enable a tester to test a plurality of die/ICs in parallel by inputting both stimulus and response patterns to the plurality of die/ICs. The response patterns from the tester are input to the test circuits along with the output response of the die/IC to be compared. Also disclosed is the use of a response signal encoding scheme whereby the tester transmits response test commands to the test circuits, using a single signal per test circuit, to perform: (1) a compare die/IC output against an expected logic high, (2) a compare die/IC output against an expected logic low, and (3) a mask compare operation. The use of the signal encoding scheme allows functional testing of die and ICs since all response test commands (i.e. 1-3 above) required at each die/IC output can be transmitted to each die/IC output using only a single tester signal connection per die/IC output. In addition to functional testing, scan testing of die and ICs is also possible. 1. An integrated circuit die comprising:A. input and output circuit pads;B. core circuits having core input leads and core output leads coupled with the input and output circuit pads; i. a core input lead;', 'ii. a first circuit pad lead connected with a first circuit pad;', 'iii. a second circuit pad lead connected with a second circuit pad;', 'iii. a tristate output buffer having an input connected with the core input lead, an output connected with the first circuit pad lead, and a control input;', 'iv. compare circuitry having a first input connected with the core input lead, a second input connected with the first circuit pad lead, a third input coupled with the second circuit pad lead, a scan input, a scan output, and a scan control input; and, 'C. test circuitry havingD. multiplex circuitry having inputs connected to core output leads of the core circuits, a core select input, and a selected core output connected to the core input lead of the compare circuitry.2. The integrated ...

Подробнее
Номер записи: 55
27-02-2014 дата публикации

Interposer with Edge Probe Points

Номер: US20140055159A1
Автор: Everson Dennis D., Graham Kenneth W., Shelsky Robert C.
Принадлежит: Nexus Technology

An interposer is shown with contact points on a lateral edge. When assembled between a board under test and an integrated circuit, traces of the interposer carry signals between the board under test and the integrated circuit and also between signal lines of the integrated circuit and the lateral edge contact points. The signals can then be accessed by test equipment at the lateral edge contact points. The interposer may include additional components connected to the traces. 1. An interposer associated with an integrated circuit package and a board under test including: a top surface;', 'a bottom surface;', 'edge surfaces connecting the top and bottom surfaces;', 'an array of contacts on the substrate top surface soldered to an array of contacts of the integrated circuit package;', 'a corresponding array of contacts on the substrate bottom surface soldered to contacts of the board under test;', 'through connections between corresponding top and bottom contacts;', 'a plurality of contacts on the edge surfaces; and', 'an electrical connection between at least one of the plurality of edge surface contacts and at least one through connection., 'a substrate with2. The interposer of where the substrate is soldered to the integrated circuit package and the board under test.3. The interposer of where signals pass between the integrated circuit and the board under test through the through connections.4. The interposer of where the at least one of the plurality of edge surface contacts is connected to a signal line.5. The interposer of where the at least one edge contact is insulated from the board under test.6. The interposer of where the electrical connection between at least one of the plurality of edge surface contacts and at least one through connection includes components to condition the electrical signal.7. The interposer of where the edge surface contact is a portion of a via.8. The interposer of where the edge surface contact is a plated conductor.9. A circuit test ...

Подробнее
Номер записи: 56
06-03-2014 дата публикации

Method and device for testing sensorsto be applied on a patient's skin forthe detection of fluid or moisture

Номер: US20140059837A1
Автор: Alexander Schroers, John Heppe, Roland RULLOF
Принадлежит: FRESENIUS MEDICAL CARE DEUTSCHLAND GMBH

A method and device for testing sensors to be applied on a patient's skin for detection of liquid or moisture are described, in particular for monitoring vascular access in an extracorporeal blood treatment, in which a patient's blood is carried away from the patient via an arterial line and is fed to the patient via a venous line. A method for producing sensors to be applied on a patient's skin for detection of liquid or moisture is also described. The method and device according to the present invention are based on the testing of one or more moisture sensors which are taken from current production. The method includes providing a large number of twists of the moisture sensor applied onto a torsion body, the mechanical stresses thus recreating the stresses that can occur in practice when the moisture sensor is applied or stuck onto the patient's skin or forearm.

Подробнее
Номер записи: 57
06-03-2014 дата публикации

RADIATION SENSOR

Номер: US20140061447A1
Автор: Campbell Colin, Herard Laurent
Принадлежит:

A sensor package includes a radiation source and a radiation detector provided on a substrate. A cover member is mounted on or affixed to the substrate over the source and detector. The cover member includes an opaque housing, a first transparent portion provided over the source, a second transparent portion provided over the detector and a transparent insert within the housing and positioned at one of said transparent portions. An opaque protrusion is provided on the housing separating a region associate with the first transparent portion (and radiation source) from a region associated with the second transparent portion (and detector), the protrusion attached to a surface of the substrate. 1. A sensor package , comprising:a radiation source and radiation detector provided on a substrate; an opaque housing;', 'a first transparent portion provided over the source;', 'a second transparent portion provided over the detector; and', 'a transparent plate positioned at one of said transparent portions, the transparent plate having a perimeter portion bounded at both its upper and lower surfaces by the housing., 'a cover member mounted on or affixed to the substrate over the source and detector, said cover member comprising2. The sensor package of claim 1 , wherein the transparent plate comprises a window.3. The sensor package of claim 1 , wherein the transparent plate comprises a surface shaped to provide a focusing function.4. The sensor package of claim 1 , wherein the transparent plate comprises a surface shaped to provide a collimation function.5. The sensor package of claim 1 , wherein the transparent plate spans the transparent portion.6. The sensor package of claim 1 , wherein both first and second transparent portions comprise a transparent plate within the housing.7. The sensor package of claim 1 , wherein one of said first and second transparent portions comprises a transparent plate within the housing and the other of said first and second transparent portions ...

Подробнее
Номер записи: 58
06-03-2014 дата публикации

Space Transformation Methods

Номер: US20140062522A1
Автор: Armen Y. Balian, Erkan Acar, Ethan Caughey, Pooya Tadayon
Принадлежит: Intel Corp

A test system includes a test printed circuit board (PCB), a flip chip package mounted on the PCB, one or more test probes coupled to the flip chip package and a first integrated circuit (IC) coupled to the test probes to enable testing of the first IC using electrical circuitry of the flip chip package.

Подробнее
Номер записи: 59
20-03-2014 дата публикации

Hidden sensors in an electronic device

Номер: US20140077094A1
Автор: Brian Q. Huppi, Ching Yu John Tam, Christopher T. MULLENS, Richard Hung Minh Dinh
Принадлежит: Apple Inc

An electronic device having one or more sensors is provided. The sensors may include any suitable type of sensor that emits or receives radiation (e.g., light waves) from the environment. The electronic device may include openings through which radiation may reach the sensors while keeping the sensors hidden from view. In some embodiments, the sensors may be placed underneath an opening used for an audio receiver such that radiation is piped to the sensors using a light path or a chamfered surface along the opening. In some embodiments, the sensors may be embedded in a screen such that the radiation emitted by the sensors exits the screen instead of being reflected on the screen. In some embodiments, the sensors may be placed along the periphery of the display, such that access to the sensors is provided via discontinuities in a gasket used to couple the display to the electronic device.

Подробнее
Номер записи: 60
20-03-2014 дата публикации

PROBE CARD AND MANUFACTURING METHOD THEREOF

Номер: US20140077833A1
Автор: Chen Ming-Chi, Chen Tsung-Yi, LEE CHUNG-TSE, Wu Chien-Chou
Принадлежит: MPI corporation

A probe card for being abutted against a plurality of probes is provided. The probe card includes a substrate, at least two IC boards, and a plurality of probe pads. The IC boards are located on the substrate, and a predetermined distance is formed between the IC boards. Each of the IC boards has a plurality of lead connection points. The probe pads are plated on the IC boards, and are respectively connected to the lead connection points to cover the lead connection points. A probe area is surrounded by the probe pads on each of the IC boards. The probe pads are used to abut against the probes. In addition, a method of manufacturing the probe card is provided. 1. A probe card for being abutted against a plurality of probes , the probe card comprising:a substrate;at least two IC boards located on the substrate and having a predetermined distance between the two IC boards, and each of the two IC boards having a plurality of lead connection points; anda plurality of probe pads plated on the two IC boards and respectively connected to the lead connection points to cover the lead connection points, wherein a probe area is surrounded by the probe pads on each of the IC boards, the probe pads are for respectively being abutted against the probes, and a gap between the two probe areas of the two adjacent IC boards is larger than a width of each of the two probe areas.2. The probe card of claim 1 , wherein the gap between the two probe areas of the two adjacent IC boards is twice larger than the width of each of the two probe areas.3. The probe card of claim 1 , wherein the gap between the two probe areas of the two adjacent IC boards is smaller than or equal to 40 μm.4. The probe card of claim 1 , wherein a thickness of each of the probe pads is larger than or equal to 10 μm.5. The probe card of claim 1 , wherein the substrate comprises a printed circuit board having a circuit layout claim 1 , and the lead connection points of the two IC boards are electrically connected to ...

Подробнее
Номер записи: 61
03-04-2014 дата публикации

CURRENT DETECTOR

Номер: US20140091788A1
Автор: Fukuyama Susumu, Misaki Takashi, Nakajima Hirokatsu, Nishi Kouji
Принадлежит:

A current detector includes a magnetic core that is molded by sintering powder made from a magnetic material, and a current detection busbar. The current detection busbar is a conductor including a penetrating portion that penetrates a hole portion of the magnetic core in a first direction in which a current flows, and terminal portions that are in connection with the penetrating portion on both sides in the first direction. The width of the terminal portions is larger than the maximum width of the hole portion, and the minimum width of the cross-sectional contour of the penetrating portion is larger than the thickness of the terminal portions. An insulating casing holds the magnetic core, the current detection busbar, and the Hall element, while keeping them from coming into contact with each other. 1. A current detector for detecting a current that flows through a busbar , comprising: the magnetic core having at least two ends facing each other across a gap portion, and', 'the magnetic core being formed in one piece so as to surround a hole portion;, 'a magnetic core configured to be molded by sintering powder made from a magnetic material,'}a magneto-electric conversion element being disposed in the gap portion of the magnetic core and detecting a magnetic flux that changes in accordance with a current that passes through the hole portion of the magnetic core; and the current detection busbar including a penetrating portion that penetrates the hole portion of the magnetic core and terminal portions that are in connection with the penetrating portion on both sides in a direction in which the penetrating portion penetrates the hole portion;', 'the terminal portions being configured to be joined with an upstream connection end and a downstream connection end respectively of a current transmission path,', 'a width of the terminal portion being larger than a width of the hole portion., 'a current detection busbar made of a conductor;'}2. The current detector according ...

Подробнее
Номер записи: 62
03-04-2014 дата публикации

FINE PITCH INTERFACE FOR PROBE CARD

Номер: US20140091826A1
Автор: Chui Ka Ng
Принадлежит:

A probe card interface for interfacing a probe head with a first circuit. The probe card interface includes an impedance control element to interface a first set of pins of the probe head with the first circuit. The impedance control element is further configured to control the impedance of the first set of pins. The probe card interface includes a printed circuit board (PCB) to interface a second set of pins of the probe head with the first circuit. The PCB is further coupled to provide at least one of power or ground to the second set of pins. For some embodiments, the PCB comprises a flexible polyimide substrate coupled between a first conductive layer and a second conductive layer. The first conductive layer is coupled to ground. The second conductive layer is coupled to a power source on the first circuit. 1. A probe card interface comprising:an impedance control element to interface a first set of pins of a probe head with a first circuit, wherein the impedance control element is configured to control the impedance of the first set of pins; anda printed circuit board (PCB) to interface a second set of pins of the probe head with the first circuit, wherein the PCB is coupled to provide at least one of power or ground to the second set of pins.2. The probe card interface of claim 1 , wherein the impedance control circuitry comprises a dielectric substrate coupled between two ground planes claim 1 , and wherein the first set of pins is disposed claim 1 , at least in part claim 1 , within the dielectric substrate.3. The probe card interface of claim 2 , wherein one or more of the pins of the first set of pins comprises a conductive wire.4. The probe card interface of claim 2 , wherein the PCB comprises a flexible polyimide substrate coupled between a first conductive layer and a second conductive layer.5. The probe card interface of claim 4 , wherein the first conductive layer is coupled to ground claim 4 , and wherein the second conductive layer is coupled to a ...

Подробнее
Номер записи: 63
03-04-2014 дата публикации

PROBE CARD FOR CIRCUIT-TESTING

Номер: US20140091827A1
Автор: HUNG Chien-Yao
Принадлежит: Hermes-Epitek Corp.

A probe card for circuit-testing comprising a testing PCB, a probe head, and a silicon interposer substrate is provided. The probe head has a plurality of probes provided with a fine pitch arrangement and held inside. The silicon interposer substrate is used for conveying signals between said probes and said test PCB. The interconnection of said silicon interposer substrate is formed by utilizing the through-silicon via process. A plurality of upper terminals and a plurality of lower terminals are respectively array-arranged on the top surface and the bottom surface of said silicon interposer substrate. The pitch between the upper terminals is larger than the pitch between the lower terminals and the pitch between adjacent lower terminals is equal to the fine pitch of the arrangement of probes. 1. A probe card for circuit-testing c comprising:a testing print circuit board;a probe head having a plurality of probes provided with a fine pitch arrangement and held inside; anda silicon interposer substrate for conveying signals between said probes and said test PCB, wherein the interconnection of said silicon interposer substrate is formed by utilizing the through-silicon via process; a plurality of upper terminals and a plurality of lower terminals are respectively array-arranged on the top surface and the bottom surface of said silicon interposer substrate; the pitch between said upper terminals is larger than the pitch between said lower terminals; and the pitch between adjacent lower terminals is equal to the fine pitch of the arrangement of probes.2. The probe card for circuit-testing as claimed in claim 1 , wherein said silicon interposer substrate comprises:a silicon substrate with a TSV conductive structure; anda redistribution layer arranged on the upper surface of said silicon substrate, wherein said upper terminals are arranged on the upper surface of said redistribution layer.3. The probe card for circuit-testing as claimed in claim 1 , wherein said silicon ...

Подробнее
Номер записи: 64
07-01-2016 дата публикации

Meter puller with safety shield

Номер: US20160001430A1
Автор: James R. Stillwagon
Принадлежит: KILVERT LLC

A tool for installing and removing an electrical power meter comprising a sleeve member adapted for sliding movement about the meter and having a first end opposite a second end, a plurality of releasable gripping hooks mounted on the first end of the sleeve member for selectively engaging the meter, an attaching hook member extending outwardly from the first end of the sleeve member, and a shield secured to the second end of the sleeve member.

Подробнее
Номер записи: 65
01-01-2015 дата публикации

Probe tip formation for die sort and test

Номер: US20150002181A1
Автор: Kamil S. Salloum, Keith J. Martin, Kip P. Stevenson, Todd P. Albertson
Принадлежит: Intel Corp

Probe tip formation is described for die sort and test. In one example, the tips of wires of a test probe head are prepared for use as test probes. The wires are attached to a test probe head substrate. The end opposite the substrate has a tip. The tips of the wires are polished when attached to the test probe head to form a sharpened point.

Подробнее
Номер записи: 66
05-01-2017 дата публикации

ORGANIC PROBE SUBSTRATE

Номер: US20170003318A1
Автор: Audette David M., CHEY Sukjay J., Cordes Steven A., FORTIN Anthony D., Gardell David L., III Frederick H., III John R., Maher, RAJALINGAM Sankeerth, ROY
Принадлежит:

An organic probe substrate structure includes a daughter card; an organic laminate attached to the daughter card; and multiple probes built onto a top surface of the organic laminate. 1. A method of manufacturing an organic probe substrate structure comprising:attaching an organic laminate to a daughter card;planarizing a top surface of the organic laminate after attaching the organic laminate to the daughter card; andbuilding a plurality of probes on top of the organic laminate.2. The method of claim 1 , wherein planarizing the top surface of the organic laminate comprises milling a sacrificial layer on the top surface of the organic laminate.3. The method of claim 2 , wherein the top surface is planar.4. The method of claim 1 , wherein the daughter card includes a ledge on each side claim 1 , each of which includes a fastening hole claim 1 , wherein when mounted claim 1 , the daughter card is unsupported at corners of the daughter card.5. The method of claim 1 , wherein the attaching the organic laminate to the daughter card is through solder connection.6. The method of claim 5 , further comprising applying soldering paste on a bottom surface of the organic laminate and a top surface of the daughter card claim 5 , wherein attaching the organic laminate to the daughter card further comprises attaching the organic laminate to the daughter cards via the solder paste.7. The method of claim 6 , further comprising applying a filling material between the organic laminate claim 6 , the daughter card claim 6 , and about a plurality of solder connections.8. The method of claim 1 , wherein attaching the organic laminate to the daughter card further comprises attaching the organic laminate to the daughter card using a solder reflow process.9. The method of claim 1 , wherein the daughter card includes a plurality of through vias.10. The method of claim 9 , wherein the organic laminate includes a plurality of probe vias on a pitch that is less than a pitch of the through vias ...

Подробнее
Номер записи: 67
05-01-2017 дата публикации

PROBE MODULE SUPPORTING LOOPBACK TEST

Номер: US20170003319A1
Автор: HO CHIH-HAO, Ku Wei-Cheng, LAI JUN-LIANG, Wei Hao
Принадлежит: MPI corporation

A probe module, which supports loopback test and is provided between a PCB and a DUT, includes an adapter, two probes, two inductive components provided at the adapter, and a capacitive component. The adapter has two connecting circuits. An end of each of the probes is connected to one of the connecting circuits, while another end thereof, which is a tip, contacts the DUT. Each of the inductive components has an end electrically connected to one of the connecting circuits, and another end electrically connected to the PCB through a conductive member, which is provided at the adapter, wherein two ends of the capacitive component are electrically connected to one of the connecting circuits, respectively. Whereby, the signal paths are changed by the differences between frequencies of signals, and the transmission path of high-frequency signals is effectively shortened. 1. A probe module , which is provided between a printed circuit board (PCB) and a device-under-test (DUT) to perform a loopback test , comprising:an adapter, which has a surface, and is provided with two connecting circuits;two probes, wherein each of which has an end electrically connected to one of the connecting circuits, while another end thereof, which is a tip, contacts a tested pad on the DUT;two inductive components provided at the surface of the adapter, wherein each of the inductive components has two ends, and one of the ends is electrically connected to one of the connecting circuits, while the other one of the ends is electrically connected to the PCB through a conductive member; anda capacitive component provided at the surface of the adapter, wherein the capacitive component has two ends, and one of the ends is electrically connected to one of the connecting circuits, while the other one of the ends is electrically connected to the other one of the connecting circuits.2. The probe module of claim 1 , wherein the adapter has a first surface claim 1 , a second surface opposite to the first ...

Подробнее
Номер записи: 68
07-01-2016 дата публикации

Manufacturing a Low Profile Current Measurement Connector

Номер: US20160003870A1
Автор: Pasternak David R.
Принадлежит:

A current measurement connector may include a first part and a second part. Each part may include a mount and a joint. The first and second part may be joined via the respective joints through a current transformer interposed between the first and second parts. The respective mounts may be configured to receive a current from a current source and pass the received current through the current transformer via the first and second parts inducing a current in the current transformer. The induced current may be useable to measure the current from the current source. Methods for fabricating the current measurement connector may include die casting the first and second parts and press fitting the first and second parts at the respective joints through the current transformer. Methods for use may include withstanding a fault current pulse and dissipating heat associated with the pulse via the first and second parts. 1. A method for manufacturing a current measurement connector , the method comprising: a first mount; and', 'a first joint;, 'casting a first part of the current measurement connector, wherein the first part comprises a second mount; and', 'a second joint; and, 'casting a second part of the current measurement connector, wherein the second part comprisesjoining the first part and the second part via the first and second joints through a current transformer interposed between the first part and the second part, thereby electrically coupling the first mount to the second mount, wherein the first mount and the second mount are configured to receive a first current from a current source;wherein the current measurement connector is configured to pass the first current through the first and second joints thereby inducing a second current in the current transformer, wherein the second current is useable to measure the first current.2. The method of claim 1 , wherein the first part further comprises:one or more soldering pins, wherein the one or more soldering pins are ...

Подробнее
Номер записи: 69
04-01-2018 дата публикации

DESIGNED ASPERITY CONTACTORS, INCLUDING NANOSPIKES, FOR SEMICONDUCTOR TEST, AND ASSOCIATED SYSTEMS AND METHODS

Номер: US20180003737A1
Автор: Johnson Morgan T., Preston Douglas A.
Принадлежит: Translarity, Inc.

Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package. 125-. (canceled)26. An apparatus for testing semiconductor dies , comprising:a translator having a wafer side positioned to face toward a device under test, and an inquiry side facing away from the wafer side;a plurality of wafer-side sites carried by the translator at the wafer side of the translator; anda plurality of nanospikes carried by at least one wafer-side site.27. The apparatus of claim 26 , wherein the nanospikes are made of a material selected from a group consisting of tantalum nitride claim 26 , tungsten carbide claim 26 , hafnium carbide claim 26 , titanium carbide claim 26 , titanium diboride claim 26 , molybdenum carbide claim 26 , rhenium diboride claim 26 , and a combination thereof.28. The apparatus of claim 26 , wherein a cross-section of the nanospikes is selected from a group consisting of generally concave claim 26 , triangular claim 26 , convex claim 26 , and a combination thereof.29. The apparatus of claim 26 , wherein a shape of the nanospikes is selected from a group consisting of a star claim 26 , a blade claim 26 , a cross claim 26 , a spike claim 26 , and a combination thereof.30. The apparatus of claim 26 , wherein the nanospikes comprise a cover material.31. The apparatus of claim 26 , wherein the nanospikes are approximately 0 ...

Подробнее
Номер записи: 70
04-01-2018 дата публикации

CONDUCTIVE TEST PROBE

Номер: US20180003738A1
Автор: Russell Wayne
Принадлежит: Power Probe TEK, LLC

A conductive probe may include a probe body for communicating with a circuit tester or a jumper. The probe body may be formed of metal and may have a free end. A probe tip may be mounted to the end of the probe body. The probe tip may be formed of thorium-tungsten. The probe tip may be configured for contacting a circuit node. 120.-. (canceled)21. A conductive probe , comprising:a probe body comprised of a conductor;a probe tip coupled with the probe body; anda probe plug configured to couple the probe body with a circuit tester or a jumper.22. The conductive probe of claim 21 , wherein the probe body is configured to conduct an electrical current between the probe plug and the probe tip mounted to an end of probe body.23. The conductive probe of claim 21 , wherein the probe body includes portions that are enclosed in an insulating layer so as to prevent unintended electrical shorting to a test environment.24. The conductive probe of claim 21 , wherein the probe tip is configured to provide a low contact resistance with a circuit node and minimize the electrical resistance of the conductive probe.25. The conductive probe of claim 21 , wherein the circuit tester is comprised of a multi-meter electrical circuit tester or other electrical test equipment that may be used to diagnose or repair an electrical circuit.26. The conductive probe of claim 21 , wherein the probe plug is configured to electrically mate with a circuit tester jack of the circuit tester.27. The conductive probe of claim 26 , wherein the probe plug is configured to slidably couple with the circuit tester jack.28. The conductive probe of claim 26 , wherein the probe plug is configured to threadably couple with the circuit tester jack.29. The conductive probe of claim 21 , wherein the probe tip is comprised of a buried end configured to be coupled with a socket disposed in the probe body and a narrowed end configured for contacting a circuit node to be measured.30. The conductive probe of claim 29 , ...

Подробнее
Номер записи: 71
02-01-2020 дата публикации

Probe Card Support Apparatus for Automatic Test Equipment

Номер: US20200003803A1
Автор: Nelson Scott
Принадлежит:

Various implementations of automatic test equipment are disclosed having a number of innovative features. In one implementation, the equipment includes a test head having a probe card support apparatus that provides stiffening support and/or planarization to the device under test (DUT) area of a probe card. In another implementation, the test head can include a planar surface and the wafer prober can include a corresponding planar surface. The planar surfaces can be brought into contact with each other to planarize the DUT area of the probe card and the wafer chuck in the wafer prober relative to each other. 1. A test head comprising:a probe card support apparatus;wherein the probe card support apparatus is configured to be positioned over a device under test (DUT) area of a probe card and provide stiffening support and planarization to the DUT area of the probe card; andwherein the test head is configured to be used with an automated test unit to test electronic components.2. The test head of comprising a probe card locking frame claim 1 , wherein the probe card support apparatus is positioned in a center area of the probe card locking frame.3. The test head of wherein the probe card support apparatus is configured to be connected to the probe card over the DUT area.4. The test head of wherein the probe card support apparatus comprises a fastener configured to be positioned over the DUT area of the probe card and connect the probe card support apparatus to the probe card.5. The test head of wherein the probe card support apparatus comprises a planar surface configured to contact an opposing planar surface on the probe card and planarize the test head relative to the probe card.6. The test head of wherein the test head comprises a fastener configured to connect the test head to a wafer prober.7. The test head of wherein the test head includes a planar surface configured to contact an opposing planar surface on the wafer prober to planarize the test head relative to ...

Подробнее
Номер записи: 72
07-01-2021 дата публикации

PLATE SPRING-TYPE CONNECTING PIN

Номер: US20210003610A1
Автор: PAK Sangyang
Принадлежит:

A plate spring-type connection pin is proposed. The connection pin includes: a support pin that has a bending lip portion at an upper portion thereof and a base portion at a lower portion thereof, and is vertically elongated; a plate spring that has an upper probe portion vertically extending adjacent to the lip portion, a lower probe portion disposed at the same height as the base portion, a laterally lying V-shaped portion disposed between the upper probe portion and the lower probe portion, an upper bending portion connecting an upper end of the V-shaped portion and a lower end of the upper probe portion, and a lower bending portion connecting a lower end of the V-shaped portion and an upper end of the lower probe portion; and a bridge that is disposed between the base portion of the support pin and the lower probe portion of the plate spring.

Подробнее
Номер записи: 73
03-01-2019 дата публикации

Electrically Conductive Pins Microcircuit Tester

Номер: US20190004091A1
Автор: Michalko Gary W., Nelson John E., Sherry Jeffrey C., Warwick Brian
Принадлежит:

The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted. 112.-. (canceled)13. A test contactor to be interposed between a contact load board and a device under test (DUT) , the DUT including a plurality a plurality of contact pads , each contact pad being laterally arranged , a plurality of upper and lower pin pairs , the pin pairs having distal ends and proximal ends , the proximal end of the upper pin being configured to engage the DUT and the proximal end of the lower pin being configured to engage a load board , the pairs having an outer surface and an overlapping inner mating surface capable of sliding longitudinally along the mating surface ,the inner mating surfaces being inclined and planar and the outer surfaces being partially arcuate and wherein the pins are tapered toward their distal ends;an engagement feature including a narrowed neck on each of said pins proximate the proximal ends providing an engagement recess;an interposer comprising:a longitudinally compressible resilient non-electrically conductive membrane matrix having a plurality of spaced part apertures defining cross sectional areas and forming passages, each passage extending through said interposer, each passage sized to engage said pin pairs with horizontal elastomeric compression ...

Подробнее
Номер записи: 74
03-01-2019 дата публикации

TESTING APPARATUS AND METHOD FOR MICROCIRCUIT TESTING WITH CONICAL BIAS PAD AND CONDUCTIVE TEST PIN RINGS

Номер: US20190004093A1
Автор: Andres Michael, Campion Dan, DeBauche John, Eshult Brian, Halvorson Brian, Rott Steve, Sherry Jeffrey
Принадлежит:

The test system provides an array of test probes. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and flex circuits continue the electrical connection from the probes to a load board. The test probes are bonded to the flex circuits by ring shaped flowable conductive material. The flex circuits are biased against a load board by an elastomeric pad of spaced part conical projections. 1. A test system for testing integrated circuits (IC) comprising:a. an upper probe guide plate having an array of spaced apart upper apertures for receiving a test probe;b. an anti-intrusion layer proximate said upper probe guide plate, said layer having a like array of spaced apart lower apertures, collinearly aligned with the apertures of said upper guide, or receiving a test probe;c. an elastomeric block have a like a like array of spaced apart apertures, collinearly aligned with the passages of said upper guide, for receiving a test probe;d. a plurality of elongated test probes having a probe tip at its distal end and a connecting end at its proximal end, and a cross member extending generally orthogonally from each of said probes, said cross member being of such extent that it cannot pass through said upper apertures or said passages in said elastomeric material;e. said test probes passing through said upper and lower apertures and said passages, with said cross member located between said upper probe guide plate and said anti-intrusion later, so that the bias force of the elastomer drives said probes upwardly thorough said upper plate to a stop where said cross member engages said upper plate;f. said proximal ends of said test probes being group into a plurality of subgroups, each of the ends in said subgroup having the same height as measured from the lower probe ...

Подробнее
Номер записи: 75
20-01-2022 дата публикации

INSPECTION APPARATUS AND CONTROL METHOD FOR INSPECTION APPARATUS

Номер: US20220018889A1
Автор: NAKAYAMA Hiroyuki
Принадлежит:

An inspection apparatus includes a stage on which a substrate having an inspection target is placed, a probe card, a light irradiator, and a controller. The probe card has probes that supply a current to the inspection target. The light irradiator irradiates light to heat the substrate. The controller controls the light irradiator to excecute uniformly heating the inspection target by the light from the light irradiator, and heating an outer peripheral portion of the inspection target by the light from the light irradiator. 1. An inspection apparatus comprising:a stage on which a substrate having an inspection target is placed;a probe card having probes that supply a current to the inspection target;a light irradiator to irradiate light to heat the substrate; and uniformly heat the inspection target by the light from the light irradiator, and', 'heat an outer peripheral portion of the inspection target by the light from the light irradiator., 'a controller to control the light irradiator configured to2. The inspection apparatus of claim 1 , wherein the uniformly heating of the inspection target is switched to the heating of the outer peripheral portion of the inspection target by the controller based on heat generation of the inspection target.3. The inspection apparatus of claim 1 , wherein the uniformly heating of the inspection target is switched to the heating of the outer peripheral portion of the inspection target by the controller based on an internal variables for controlling the light irradiator.4. The inspection apparatus of claim 1 , further comprising:a tester connected to the probe card to inspect the inspection target,wherein the uniformly heating of the inspection target is switched to the heating of the outer peripheral portion of the inspection target by the controller based on a signal from the tester that indicates start of the inspection of the inspection target.5. The inspection apparatus of claim 1 , further comprising:a tester connected to the ...

Подробнее
Номер записи: 76
08-01-2015 дата публикации

ELECTRIC CONNECTING APPARATUS

Номер: US20150008946A1
Автор: ARAI Osamu, Inoue Tatsuo, KIYOFUJI Hidehiro
Принадлежит:

An apparatus includes a wiring base plate arranged on an upper side of a chuck top and having a wiring path connected to a tester, a probe card having a probe board spaced from the wiring base plate with a first surface thereof opposed to the wiring base plate and having a wiring path corresponding to the wiring path and probes provided on a second surface of the probe board to be connected to the wiring path and enabling to respectively contact connection pads of a semiconductor wafer on the chuck top, and an electric connector connecting the wiring base plate to the probe board by low heat conduction supporting members and decreasing heat conduction therebetween and electrically connecting the wiring paths.

Подробнее
Номер записи: 77
08-01-2015 дата публикации

MANUFACTURING ADVANCED TEST PROBES

Номер: US20150008950A1
Автор: FISCHER Paul B., Kwong Charlotte C., Swart Roy E.
Принадлежит:

Embodiments relate to the formation of test probes. One method includes providing a bulk sheet of an electrically conductive material. A laser is used to cut through the bulk sheet in a predetermined pattern to form a test probe. Other embodiments are described and claimed. 1. A method , comprising:providing a bulk sheet of an electrically conductive material; andusing a laser to cut through the bulk sheet in a predetermined pattern to form a test probe.2. The method of claim 1 , wherein the bulk sheet of an electrically conductive material comprises tungsten.3. The method of claim 1 , wherein the bulk sheet of an electrically conductive material comprises a material selected from the group consisting of NiW claim 1 , NiMn claim 1 , CrMo claim 1 , and BeCu.4. The method of claim 1 , wherein the using the laser to cut through the bulk sheet includes forming the test probe to include a plurality of flat sidewalls.5. The method of claim 1 , wherein the using the laser to cut through the bulk sheet includes forming the test probe to include a curved section.6. The method of claim 1 , further comprising positioning the test probe in a test probe card.7. The method of claim 1 , wherein the using a laser to cut through the bulk sheet includes multiple passes of the laser over the same portion of the bulk sheet.8. The method of claim 1 , further comprising forming a sacrificial layer on the bulk sheet claim 1 , the sacrificial layer positioned to minimize the size heat affected zone.9. The method of claim 1 , further comprising performing a deburring operation after the forming the test probe claim 1 , the deburring operation adapted to smooth shape edges on the test probe.10. A method comprising:providing a test probe card comprising a structure adapted to hold a plurality of test probes therein; andpositioning a plurality of laser cut test probes within the probe test card.11. The method of claim 10 , wherein the test probes are formed from a material comprising tungsten. ...

Подробнее
Номер записи: 78
14-01-2021 дата публикации

SECURE HOLDER FOR PROBE AND TEST JIG USING THE SAME

Номер: US20210011054A1
Автор: SU RUO-CHUN
Принадлежит:

A probe holder for securely holding a probe within a certain location includes a base and a limiting block. The base defines a first receiving cavity having a bottom. The bottom of the first receiving cavity defines at least one first through hole penetrating the base. The first through hole is stepped for abutting the probe in one direction. The limiting block is disposed on the base opposite to the first receiving cavity. The limiting block defines at least one second through hole corresponding to the first through hole, the second through hole is also stepped and serves as a second abutting portion against the probe moving in an opposite direction. A test jig using the probe holder is also provided. 1. A probe holder for fixing a probe , comprising a base and a limiting block , wherein the base defines a first receiving cavity having a bottom , the bottom of the first receiving cavity defines at least one first through hole penetrating the base , the first through hole is stepped and comprises a first step , the first step serves as a first abutting portion for abutting the probe and limiting the probe toward a direction , the limiting block is disposed on the base opposite to the first receiving cavity , the limiting block defines at least one second through hole corresponding to the first through hole , the second through hole is stepped and comprises a second step , the second step serves as a second abutting portion for abutting the probe and limiting the probe toward an opposite direction.2. The probe holder according to claim 1 , wherein the first through hole comprises a first cylindrical hole portion away from the first receiving cavity and a second cylindrical hole portion adjacent to the first receiving cavity claim 1 , the second cylindrical hole portion has a diameter smaller than a diameter of the first cylindrical hole portion.3. The probe holder according to claim 1 , wherein the second through hole comprises a third cylindrical hole portion ...

Подробнее
Номер записи: 79
14-01-2021 дата публикации

Apparatus and Method for Securing an Enclosure

Номер: US20210011055A1
Автор: John Edward Stachowiak, Jr.
Принадлежит: Dewalch Technologies Inc

The present invention relates to an apparatus and method for securing a box cover to a watthour meter socket box. In certain embodiments, the apparatus has a clamping member that fits over a wall of a meter box, and a lock housing that locks to the clamping member after a box cover has been installed, thereby securing the cover to the box in a manner such that the box cover cannot be installed unless the clamping member has been installed correctly. In various other embodiments, the clamping member consists of a clamp disposed between a clamp actuating member and a fastening shelf. In various other embodiments, the clamp includes a stopping member for indicating when the clamp actuating member is actuated into a fully secured position. Other embodiments relate to a locking bracket and a lock housing wherein the locking bracket generally comprises a clamping member and a fastening lever that attaches to a wall of a meter box base. The lock housing generally comprises a unitary member with a perpendicular flange. The meter box lid is secured to the meter box base when the locking bracket is secured to the side wall (or another wall) and used in combination with the lock housing and a locking shaft.

Подробнее
Номер записи: 80
10-01-2019 дата публикации

METHOD FOR PRODUCING PROBES FOR TESTING INTEGRATED ELECTRONIC CIRCUITS

Номер: US20190011484A1
Автор: PAGANI Alberto
Принадлежит: STMICROELECTRONICS S.R.L.

Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe. 1. A method , comprising:inserting a probe body made electrically conductive materials in an opening of a support such that an end of the probe body is exposed from said opening;polishing the exposed end of the probe body;depositing an electrically conductive contact region having a first hardness value equal to or greater than 300 HV to the polished exposed end of the probe body.2. The method of claim 1 , wherein depositing comprises forming a conductive layer directly on said polished exposed end of the probe body.3. The method of claim 2 , wherein said conductive layer is formed by a conductive layer made of a material selected from the group consisting of nickel claim 2 , manganese claim 2 , palladium claim 2 , cobalt claim 2 , rhodium claim 2 , iron claim 2 , molybdenum claim 2 , iridium claim 2 , ruthenium claim 2 , tungsten claim 2 , rhenium and alloys thereof.4. The method of claim 1 , wherein depositing comprises:forming at least one support conductive layer directly on said polished exposed end of the probe body; andforming a conductive layer directly on said at least one support conductive layer.5. The method of claim 4 , wherein said conductive layer is formed by a conductive layer made of a material selected from the group consisting of nickel claim 4 , manganese claim 4 , palladium claim 4 , cobalt claim 4 , rhodium claim 4 , iron claim 4 , molybdenum claim 4 , iridium claim ...

Подробнее
Номер записи: 81
10-01-2019 дата публикации

Test Fixture with Sintered Connections Between Mother Board and Daughter Board

Номер: US20190011497A1
Автор: Randal LeRay Newby
Принадлежит: Texas Instruments Inc

A test fixture includes a mother board that has test signal lines configured to couple to a test station. The mother board includes a recessed region with contact pads coupled to the test signal lines. A daughter board is engaged with the recessed region such that a top surface of the daughter board is approximately coplanar with a top surface of the mother board. The daughter board includes test signal lines coupled to contact pads on the daughter board. The contact pads on the daughter board align with the contact pads on the mother board and are permanently coupled by sintered bonds.

Подробнее
Номер записи: 82
15-01-2015 дата публикации

TESTING APPARATUS AND METHOD FOR MICROCIRCUIT AND WAFER LEVEL IC TESTING

Номер: US20150015287A1
Автор: Andres Michael, Campion Dan, DeBauche John, Eshult Brian, Halvorson Brian, Rott Steve, Sherry Jeffrey
Принадлежит:

The test system provides an array of test probes having a cross beam. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. The probes are biased upwardly through the retainer by an elastomeric block having a similar array of slots. The elastomer is then capped at its bottom by a second or lower retainer with like slots to form a sandwich with the elastomer therebetween. The bottom ends of the probes are group by probe height. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and take continue the circuits to a probe card where test signals originate. 1. A test system for testing integrated circuits (IC) comprising:a. an upper probe guide plate having an array of spaced apart upper apertures for receiving a test probe;b. a lower probe guide plate having a like array of spaced apart lower apertures, collinearly aligned with the apertures of said upper guide, for receiving a test probe;c. an elastomeric block have a like a like array of spaced apart apertures, collinearly aligned with the passages of said upper guide, for receiving a test probe; said block having a top and bottom surface and a central region therebetween; at least some of said apertures being tapered from said bottom surface toward said top surface;d. a plurality of elongated test probes having a probe tip at its distal end and a connecting end at its proximal end, and a cross member extending generally orthogonally from each of said probes, said cross member being of such extent that it cannot pass through said upper apertures or said passages in said elastomeric material;e. said test probes passing through said upper and lower apertures and said passages, with said cross member located between said upper probe guide plate and said elastomer, so that the bias force of the elastomer drives said probes upwardly thorough said upper plate to a ...

Подробнее
Номер записи: 83
15-01-2015 дата публикации

SIGNAL PATH SWITCH AND PROBE CARD HAVING THE SIGNAL PATH SWITCH

Номер: US20150015295A1
Автор: Chen Wei, Chou Kuang-Chung, HUANG Chun-Chung, Ku Wei-Cheng, LAI JUN-LIANG, Liu Hsin-Hsiang
Принадлежит: MPI corporation

A probe card, which is between a tester and a device under test (DUT), includes two first electrical lines, two second electrical lines, two inductive elements, and a capacitor. The first electrical lines are electrically connected to the probes respectively. The second first electrical lines are electrically connected to the first electrical lines respectively. The inductive elements are electrically connected the first electrical lines and the tester respectively; and the capacitor has opposite ends connected to the second first electrical lines respectively. 1. A signal path switch , which is provided between a tester and two probes , comprising:two first electrical lines electrically connected to the probes respectively;two second first electrical lines electrically connected to the first electrical lines respectively;two inductive elements, each of which is electrically connected each of the first electrical lines and the tester respectively; anda capacitor having opposite ends electrically connected to the second first electrical lines respectively.2. The signal path switch of claim 1 , further comprising a substrate claim 1 , wherein the substrate is provided with the first electrical lines claim 1 , the second electrical lines claim 1 , the inductive elements claim 1 , and the capacity.3. The signal path switch of claim 2 , wherein the substrate has a first board and a second board; the first board is provided with the first electrical lines claim 2 , the second electrical lines claim 2 , and the capacity claim 2 , and the second board is provided with the inductive elements; the first board is connected to the second board.4. The signal path switch of claim 2 , wherein the inductive elements are embedded in the substrate.5. The signal path switch of claim 2 , wherein the capacitor is embedded in the substrate.6. The signal path switch of claim 2 , wherein the inductive elements are fixed to a surface of the substrate by welding.7. The signal path switch of ...

Подробнее
Номер записи: 84
03-02-2022 дата публикации

METHOD AND APPARATUS FOR JUDGING ABNORMALITY OF PROBE CARD

Номер: US20220034939A1
Автор: YANG Cheng-Jer
Принадлежит: CHANGXIN MEMORY TECHNOLOGIES, INC.

A method for judging abnormality of a probe card includes: a unit failure rate of chips at the same test position in each measurement unit is obtained, and whether the unit failure rate of the chips at the same test position respectively meets the first abnormality condition is judged; when the unit failure rate of the chips at the same test position of each measurement unit meets a first abnormality condition, whether a test sequence for the measurement units meeting the first abnormality condition meets a second abnormality condition is judged; and when the test sequence for the measurement units meeting the first abnormality condition meets the second abnormality condition, it is determined that the probe card is abnormal. 1. A method for judging abnormality of a probe card , comprising:selecting measurement units, and obtaining a unit failure rate of chips at a same test position in each measurement unit respectively;judging whether the unit failure rate of the chips at the same test position of each measurement unit respectively meets a first abnormality condition;when the unit failure rate of the chips at the same test position of any one measurement unit meets the first abnormality condition, judging whether a test sequence for measurement units meeting the first abnormality condition meets a second abnormality condition; andwhen the test sequence for the measurement units meeting the first abnormality condition meets the second abnormality condition, determining that the probe card is abnormal.2. The method for judging the abnormality of the probe card of claim 1 , wherein said selecting the measurement units and obtaining the unit failure rate of the chips at the same test position in each measurement unit respectively comprises:selecting the measurement units and detecting failed chips in each measurement unit respectively;obtaining a number of the failed chips at the same test position in each measurement unit; andcalculating the unit failure rate of the ...

Подробнее
Номер записи: 85
03-02-2022 дата публикации

Probe head for a testing apparatus of electronic devices with enhanced filtering properties

Номер: US20220034966A1
Автор: Flavio Maggioni
Принадлежит: Technoprobe SpA

A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.

Подробнее
Номер записи: 86
18-01-2018 дата публикации

APPARATUS FOR CLAMPING A PROBE CARD AND PROBE CARD INCLUDING THE SAME

Номер: US20180017595A1
Автор: JOO Jae-Hoon, KANG Sang-Boo, KIM Jae-Geun, KIM Sung-Hyup, Na Jeong-min, Park Jae-Hyoung, Park Sung-Yong, YOO Sang-Kyu
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased. 1. An apparatus configured to clamp a probe card , the apparatus comprising:a body portion between a printed circuit board (PCB) of the probe card and a test head;an inner clamping portion integrally formed with an upper surface of the body portion and configured to affix a central portion of the PCB to the test head; anda plurality of outer clamping portions integrally formed with a side surface of the body portion to affix a portion of the PCB to the test head, the plurality of outer clamping portions configured to surround the central portion of the PCB.2. The apparatus of claim 1 , wherein the inner clamping portion includes a protrusion configured to protrude from the side surface of the body portion claim 1 , the protrusion having a slant lower surface.3. The apparatus of claim 2 , wherein the inner clamping portion has a gradually decreasing thickness in a radius direction of the body portion.4. The apparatus of claim 1 , wherein the plurality of outer clamping portions are configured to radially extend from a center point of the body portion.5. The apparatus of claim 1 , wherein at least two of the plurality of outer clamping portions are spaced apart from each other by a substantially similar angle.6. The apparatus of claim 1 , ...

Подробнее
Номер записи: 87
17-01-2019 дата публикации

ON-WAFER CALIBRATION DEVICE

Номер: US20190017940A1
Автор: Ziegler Robert
Принадлежит:

An on-wafer calibration device comprises on a substrate at least a first measuring port, at least a first switch element, at least two calibration standards, and a controller unit or a control interface for control of the first switch element. The first switch element is controlled in a manner that it selectively connects a wafer probe tip connectable to the first measuring port to the at least two calibration standards. 1. An on-wafer calibration device comprising on a substrate:at least a first measuring port,at least a first switch element,at least two calibration standards, anda controller unit or a control interface for control of the first switch element,wherein the first switch element is controlled in a manner that it selectively connects a wafer probe tip connectable to the first measuring port to the at least two calibration standards.2. The on-wafer calibration device according to claim 1 , wherein the first measuring port is implemented as a probe tip pad.3. The on-wafer calibration device according to claim 1 , wherein the on-wafer calibration device comprises a second measuring port being arranged non-in-line with respect to the first measuring port.4. The on-wafer calibration device according to claim 3 , wherein the second measuring port is arranged in a perpendicular or side-by-side manner with respect to the first measuring port.5. The on-wafer calibration device according to claim 1 , wherein the on-wafer calibration device comprises at least two measuring ports claim 1 , wherein the at least two measuring ports are arranged in groups of two to calibrate for mixed mode signals comprising common mode or differential mode signals.6. The on-wafer calibration device according to claim 1 , wherein the on-wafer calibration device comprises at least four measuring ports claim 1 , wherein the at least four measuring ports are arranged in groups of two to calibrate for mixed mode signals comprising common mode or differential mode signals.7. The on-wafer ...

Подробнее
Номер записи: 88
16-01-2020 дата публикации

Intermediate Connection Member and Inspection Apparatus

Номер: US20200018778A1
Автор: FUJIHARA Jun, Sakamoto Hiroaki
Принадлежит:

There is provided an intermediate connection member which is provided between a first member having a plurality of first terminals and a second member having a plurality of second terminals and electrically connects the plurality of first terminals and the plurality of second terminals, respectively, the intermediate connection member including: a pogo block including a main body and a plurality of pogo pins provided in the main body, the pogo block configured to connect the plurality of first terminals and the plurality of second terminals, respectively; and a pogo frame having an insertion hole into which the pogo block is inserted, wherein the pogo block has a positioning pin, and the pogo frame has a positioning hole into which the positioning pin is inserted, and wherein the pogo block is positioned with respect to the pogo frame when the positioning pin is inserted into the positioning hole. 1. An intermediate connection member which is provided between a first member having a plurality of first terminals and a second member having a plurality of second terminals and electrically connects the plurality of first terminals and the plurality of second terminals , respectively , the intermediate connection member comprising:a pogo block including a main body and a plurality of pogo pins provided in the main body, the pogo block configured to connect the plurality of first terminals and the plurality of second terminals, respectively; anda pogo frame having an insertion hole into which the pogo block is inserted,wherein the pogo block has a positioning pin, and the pogo frame has a positioning hole into which the positioning pin is inserted, andwherein the pogo block is positioned with respect to the pogo frame when the positioning pin is inserted into the positioning hole.2. The intermediate connection member of claim 1 , wherein the pogo block is formed in a rectangular shape having a long side and a short side in a plan view claim 1 , andwherein the positioning ...

Подробнее
Номер записи: 89
16-01-2020 дата публикации

PROBE, INSPECTION JIG, AND INSPECTION APPARATUS

Номер: US20200018779A1
Автор: Chia Matthias Joseph Chin Chieh, Hayashi Akio, Kato Minoru, MIYATAKE Tadakazu, NAGANUMA Masaki, Ong Cheng Ghee, Singh Raminderjit
Принадлежит:

A probe is a probe having a substantially bar-like shape and includes a distal end portion with a substantially columnar shape adapted to be in contact with an inspection point provided on a device under test, a base end portion with a substantially columnar shape on an opposite side of the distal end portion, and a main body portion formed in a flat ribbon shape and extended to connect the distal end portion to the base end portion. The distal end portion is provided with a distal end surface inclined relative to and intersecting with an axial center of the probe. 1. A probe having a bar-like shape , comprising:a distal end portion with a columnar shape adapted to be in contact with an inspection point provided on a device under test;a base end portion on an opposite side of the distal end portion; anda main body portion formed in a flat ribbon shape and extended to connect the distal end portion to the base end portion,wherein the distal end portion is provided with a distal end surface inclined relative to and intersecting with an axial center of the probe.2. The probe according to claim 1 , wherein claim 1 , on both edge portions on lateral sides of the distal end surface claim 1 , chamfered surfaces that communicate with a circumferential surface of the distal end portion and that are tapered are formed.3. The probe according to claim 1 , wherein a width direction of the distal end surface and a width direction of the main body portion formed in the ribbon shape are in an equal direction.4. The probe according to claim 1 , wherein a width direction of the distal end surface and a width direction of the main body portion formed in the ribbon shape are perpendicular to each other.5. The probe according to claim 1 , wherein the main body portion is curved to protrude in a direction perpendicular to a wide width surface formed in the ribbon shape.6. An inspection jig comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a plurality of probes each of which ...

Подробнее
Номер записи: 90
21-01-2021 дата публикации

Integrated circuit contact test apparatus with and method of construction

Номер: US20210018533A1
Автор: Jeffrey Sherry, Joel Erdman
Принадлежит: Johnstech International Corp

A test socket for a device under test (DUT) is disclosed in several embodiments. One embodiment shows a test socket base ( 16 ) with apertures ( 30 ) for insertion of test pin insert blocks ( 28 ). The blocks are inserted top—in or bottom—in and are provided with registration bosses 80 and teeth 92 or other means for maintaining registration. Blocks are provided with dielectric constants to achieve different frequency response relative to other pins. To achieve great EMI and cross talk isolation, the socket may be made of aluminum with hard anodize coating to insulate test pins ( 32 ) from the housing.

Подробнее
Номер записи: 91
19-01-2017 дата публикации

MULTILAYER CIRCUIT BOARD AND PROBE CARD INCLUDING THE SAME

Номер: US20170019990A1
Автор: OTSUBO Yoshihito, TAKEMURA Tadaji
Принадлежит:

A multilayer circuit board includes a ceramic multilayer body that is a stack of multiple ceramic layers, a resin multilayer body on the ceramic multilayer body that is a stack of multiple resin layers, conductive vias in the uppermost ceramic layer, and conductive vias in the lowermost resin layer. The upper end faces of the conductive vias are exposed on the interface between the ceramic multilayer body and the resin multilayer body. The lower end faces of the conductive vias are exposed on the interface between the ceramic multilayer body and the resin multilayer body and directly connected to the upper end faces of the conductive vias in the uppermost ceramic layer. The lower end faces of the conductive vias on the resin layer side are within the upper end faces of the conductive vias on the ceramic layer side in plan view. 1. A multilayer circuit board comprising:a ceramic multilayer body comprising a stack of a plurality of ceramic layers;a resin multilayer body on the ceramic multilayer body, the resin multilayer body comprising a stack of a plurality of resin layers;a first interlayer coupling conductor in an uppermost one of the ceramic layers, an upper end face thereof being exposed on an interface between the ceramic and resin multilayer bodies; anda second interlayer coupling conductor in a lowermost one of the resin layers, a lower end face thereof being exposed on the interface between the ceramic and resin multilayer bodies and directly connected to the upper end face of the first interlayer coupling conductor,wherein the lower end face of the second interlayer coupling conductor is within the upper end face of the first interlayer coupling conductor in plan view.2. The multilayer circuit board according to claim 1 , further comprising a circuit layer between any two of the resin layers claim 1 , the circuit layer having a planar electrode pattern that overlaps the resin multilayer body in plan view except at a periphery of the resin multilayer body.3 ...

Подробнее
Номер записи: 92
25-01-2018 дата публикации

PROBE MODULE HAVING CANTILEVER MEMS PROBE AND METHOD OF MAKING THE SAME

Номер: US20180024163A1
Автор: FAN Horng-Kuang, HSU Yu-Chen, SHEN Mao-Fa, Wang Yu-Wen
Принадлежит:

A method of making a cantilever MEMS probe module includes the steps of forming a cantilever MEMS probe on a first surface of a circuit substrate by a MEMS fabrication process in a way that the cantilever MEMS probe has a support post electrically and mechanically connected with an electric contact of the first surface, a cantilever arm connected with the support post, and a needle connected with the cantilever arm, and forming a through hole penetrating through the first surface and a second surface opposite to the first surface of the circuit substrate and corresponding in position to the needle and a part of the cantilever arm by using a cutting tool to cut the circuit substrate from the second surface toward the first surface of the circuit substrate. A probe module made by the method is disclosed too. 1. A method of making a probe module , comprising the steps of:a) providing a circuit substrate having a first surface on which an electric contact is provided, and a second surface opposite to the first surface;b) forming a cantilever MEMS probe on the first surface of the circuit substrate by a MEMS fabrication process in a way that the cantilever MEMS probe has a support post electrically and mechanically connected with the electric contact of the first surface, a cantilever aim connected with the support post, and a needle connected with the cantilever arm; andc) forming a through hole penetrating through the first and second surfaces of the circuit substrate and corresponding in position to the needle and a part of the cantilever arm by using a cutting tool to cut the circuit substrate from the second surface toward the first surface.2. The method as claimed in claim 1 , wherein in the step c) the through hole of the circuit substrate is surrounded by a wall cut by the cutting tool claim 1 , and the wall has a tip portion adjacent to the first surface of the circuit substrate claim 1 , and a guiding surface extending from the tip portion towards the second ...

Подробнее
Номер записи: 93
25-01-2018 дата публикации

PROBE CARD FOR A TESTING APPARATUS OF ELECTRONIC DEVICES WITH ENHANCED FILTERING PROPERTIES

Номер: US20180024167A1
Автор: MAGGIONI Flavio
Принадлежит:

A probe card for a testing apparatus of electronic devices comprises at least one testing head housing a plurality of contact probes, each contact probe having at least one contact tip abutting onto contact pads of a device under test, as well as at least one space transformer realizing a spatial transformation of the distances between contact pads made on its opposite sides and connected by means of suitable conductive tracks or planes, as well as a plurality of filtering capacitors provided between the space transformer and a PCB, which comprises direct conductive tracks or planes contacting conductive portions of the filtering capacitors. 1. A probe card for a testing apparatus of electronic devices comprises:a testing head housing a plurality of contact probes having respective contact tips configured to abut onto contact pads of a device under test, and first contact pads made on a first side of the space transformer;', 'second contact pads made on a second side, opposite to the first side, of the space transformer; and', 'conductive tracks or planes connecting at least some of the first contact pads to the second contact pads,', 'the space transformer realizing a spatial transformation of distances between the first contact pads and distances between the second contact pads,, 'a space transformer comprisinga printed circuit board (PCB),a first plurality of filtering capacitors provided between the space transformer and the PCB,wherein the PCB comprises direct conductive tracks or planes electrically contacting conductive portions of the filtering capacitors.2. The probe card of claim 1 , wherein at least some of the the conductive tracks or planes of the space transformer electrically contact the conductive portions of the filtering capacitors claim 1 , a combination of the conductive tracks or planes of the space transformer claim 1 , the direct conductive tracks or planes of the PCB claim 1 , and the conductive portions allowing a signal transmission between ...

Подробнее
Номер записи: 94
24-04-2014 дата публикации

Oximeter integrated with wireless devices, that can be worn comfortably on the ear and can be connected to computing devices to provide the wearer information on their heart rate, oxygen saturation, breathing and calories expended whilst the device is worn. Data captured whilst wearing the device can be use at a future time to show, on a computing device, historic readings of the users heart rate, oxygen saturation levels, breathing rate, breathing volume and calories burned.

Номер: US20140109390A1
Автор: Manning Robert Leslie
Принадлежит:

Wearable Oximeters integrated with wireless devices and computing devices that provide the wearers of the device information on their heart rate, oxygen saturation, breathing and calories expended whilst the device is worn. Using these biometric readings, software on the computing device will enable users to compare the readings from previous sessions when the device was worn. It is envisaged that amateur and professional athletes will use the devices and software to monitor their performance during physical activities. 1. The method for creating convenient , comfortable wearable devices (Ear Unit) that can be worn on the ear and used by anyone to measure and wirelessly transmit the PPG signals , and/or derived parameters: heart rate , breathing rate , breathing volume , calories , and blood oxygen levels to a nearby wireless receiver.2. The method of claim 1 , further comprising a wireless receiver that can be physically connected to computing devices such as a cellular phone claim 1 , personal computer claim 1 , tablet computer or purpose built device. The power for the wireless receiver is provided by the computing device.3. The method of claim 2 , further comprising software that can calculate the heart rate claim 2 , oxygen level claim 2 , breathing rate claim 2 , breathing volume and calories used by the user of the Ear Unit from the PPG signals.4. The method of claim 3 , further comprising software that displays to the wearer of the Ear Unit their current heart rate claim 3 , oxygen level claim 3 , calories claim 3 , breathing volume and breathing rate of the user at the time the Ear Unit is being worn.5. The method of claim 4 , further comprising software that stores the heart rate claim 4 , oxygen level claim 4 , breathing rate claim 4 , breathing volume and calories used with the time the data was collected.6. The method of claim 5 , further comprising software that displays the heart rate claim 5 , oxygen level claim 5 , breathing rate claim 5 , breathing ...

Подробнее
Номер записи: 95
10-02-2022 дата публикации

PROBE MODULE HAVING MICROELECTROMECHANICAL PROBE AND METHOD OF MANUFACTURING THE SAME

Номер: US20220043027A1
Автор: HSU Ming-Ta, HSU Yu-Chen, KU Ya-Fan, LIU Bang-Shun, TANG Fuh-Chyun, Wang Yu-Wen, WEI Shao-Lun
Принадлежит: MPI corporation

A probe module includes a circuit board and at least one probe formed on a probe installation surface of the circuit board by a microelectromechanical manufacturing process and including a probe body and a probe tip. The probe body includes first and second end portions and a longitudinal portion having first and second surfaces facing toward opposite first and second directions. The probe tip extends from the probe body toward the first direction and is processed with a gradually narrowing shape by laser cutting. The first and/or second end portion has a supporting seat protruding from the second surface toward the second direction and connected to the probe installation surface, such that the longitudinal portion and the probe tip are suspended above the probe installation surface. The probe has a tiny pinpoint for detecting tiny electronic components, and its manufacturing method is time-saving and high in yield rate. 1. A probe module comprising:a circuit board having a probe installation surface; andat least one microelectromechanical probe formed on the probe installation surface of the circuit board by a microelectromechanical manufacturing process, the microelectromechanical probe comprising a probe body and a probe tip, the probe body comprising a first end portion, a second end portion, a longitudinal portion extending from the first end portion to the second end portion along a longitudinal axis, and a probe tip seat having a top surface, the longitudinal portion having a first surface facing toward a first direction substantially perpendicular to the longitudinal axis and a second surface facing toward a second direction opposite to the first direction, the probe tip extending from a part of the top surface of the probe tip seat of the probe body toward the first direction and being processed with a gradually narrowing shape by laser cutting in a way that the probe tip has a pinpoint, and a slot is formed on the top surface of the probe tip seat adjacent ...

Подробнее
Номер записи: 96
10-02-2022 дата публикации

COAXIAL PROBE

Номер: US20220043029A1
Автор: Cavegn Marty, Feng Yukang, Mroczkowski Jason
Принадлежит:

An apparatus and method for the manufacturing and use in a semiconductor test system is disclosed. The apparatus includes a signal probe and a dielectric sleeve surrounding the signal probe. A method includes forming a mold to receive a component of a contactor assembly, inserting the component into the mold, and forming a dielectric sleeve in at least one of the one or more signal probe holes through an injection molding process. The component includes one or more signal probe holes. 1. An apparatus comprising:a signal probe; anda dielectric sleeve surrounding the signal probe.2. The apparatus of claim 1 , wherein the dielectric sleeve comprises a liquid crystal polymer.3. The apparatus of claim 2 , wherein the dielectric sleeve includes two separated sleeves.4. The apparatus of claim 3 , wherein the signal probe is a radio-frequency signal probe.5. An apparatus comprising:a contactor assembly having a signal probe hole; anda dielectric sleeve located in the signal probe hole.6. The apparatus of claim 5 , further comprising a radio frequency signal probe inserted into the dielectric sleeve claim 5 , the radio frequency signal probe having a device under test contact and a test circuit contact.7. The apparatus of claim 6 , wherein the radio frequency signal probe has a return loss of less than between about minus 10 dB and about minus 30 dB between about 50 gigahertz and about 60 gigahertz.8. The apparatus of claim 6 , wherein the radio frequency signal probe includes a plurality of radio frequency signal probes and each of the plurality of radio frequency signal probes exhibits a cross-talk value lower than about 35 dB below about 40 gigahertz and lower than about 25 dB between about 20 and 60 gigahertz.9. The apparatus of claim 6 , wherein the radio frequency signal probe has an insertion loss of less than about 1.0 dB between about zero and about 60 GHz.10. The apparatus of claim 5 , further comprising a test circuit coupled to the test circuit contact and a ...

Подробнее
Номер записи: 97
24-01-2019 дата публикации

PROBER AND PROBER OPERATION METHOD

Номер: US20190025342A1
Автор: MORI Toshiro, NISHIDA TOMOYA
Принадлежит:

A prober for preventing a collision between a probe and a probe position detecting camera and a prober operation method are provided. A prober that performs an inspection by bringing a probe into contact with an electrode of a wafer W includes: a probe position detecting camera for detecting the position of the tip of the probe to perform relative positional alignment between the electrode of the wafer W and the probe; a probe height detector, provided separately from the probe position detecting camera, for detecting the height of the tip of the probe from a reference plane serving as a reference for the height of the probe position detecting camera; and a first height adjusting mechanism for changing the height of the probe position detecting camera from the reference plane, based on the detection result of the probe height detector. 1. A prober for performing an inspection by bringing a probe into contact with an electrode of a wafer arranged to face the probe , the prober comprising:a probe position detecting camera configured to detect positions of a tip of the probe including a position in a direction on a horizontal plane and a height position in a direction perpendicular to the horizontal plane, at a position facing the probe; anda probe height detector provided integrally with the probe position detecting camera and configured to detect a height position of the tip of the probe, at a position facing the probe.2. The prober according to claim 1 , further comprisinga height adjusting mechanism configured to change the height of the probe position detecting camera from a reference plane serving as a reference for a height of the probe position detecting camera, based on a detection result by the probe height detector.3. The prober according to claim 1 ,wherein the probe height detector includes a variable differential transformer configured to detect contact of the tip of the probe.4. The prober according to claim 1 ,wherein the probe height detector is a ...

Подробнее
Номер записи: 98
24-04-2014 дата публикации

SPIRAL PROBE AND METHOD OF MANUFACTURING THE SPIRAL PROBE

Номер: US20140111238A1
Автор: Shingai Noboru
Принадлежит: Meiko Electronics Co., Ltd.

A spiral probe includes a tapered distal end portion () configured to be brought into direct contact with an inspection object, a hollow, nearly cylindrical distal body () extending in one direction from the base of the distal end portion (), a hollow, nearly cylindrical flexible portion () integral with and continuously extending in the one direction from the distal body () and having a spiral outer peripheral surface, and a hollow, nearly cylindrical proximal end portion () integral with and continuously extending in the one direction from the flexible portion (), wherein the distal body (), the flexible portion () and the proximal end portion () have outer peripheral surfaces aligned with each other in the one direction. 1. A spiral probe comprising:a tapered distal end portion configured to be brought into direct contact with an inspection object to be inspected;a hollow, nearly cylindrical distal body extending in one direction from a base of the distal end portion;a hollow, nearly cylindrical flexible portion integral with and continuously extending in the one direction from the distal body and having a spiral outer peripheral surface; anda hollow, nearly cylindrical proximal end portion integral with and continuously extending in the one direction from the flexible portion,wherein the distal body, the flexible portion and the proximal end portion have outer peripheral surfaces aligned with each other in the one direction.2. The spiral probe according to claim 1 , wherein:the distal end portion, the distal body, the flexible portion and the proximal end portion are all made of an identical material, andthe material is any one of nickel, gold alloy containing nickel or cobalt, a two-layer material having a gold film laminated on a nickel film, and nickel-tin alloy.3. A method of manufacturing the spiral probe according to claim 1 , comprising:subjecting a fine wire member, which is a fine wire of metal, to plating process by immersing the fine wire member, ...

Подробнее
Номер записи: 99
29-01-2015 дата публикации

Magnetic field probe sealed with a metallic plug

Номер: US20150028871A1
Автор: Jan Frederik Suijver, Johannes Wilhelmus Weekamp
Принадлежит: Koninklijke Philips NV

The invention provides for a magnetic field probe ( 100, 2202 ) comprising a container ( 104, 702, 1400, 1500, 1600, 1700, 1800 ) with a hollow cavity ( 106, 602 ). The hollow cavity comprises a duct ( 110, 700 ) connecting the hollow cavity with an exterior surface ( 109, 702 ) of the container. The container further comprises metallization ( 108, 800 ) surrounding the duct on the exterior surface. The container further comprises a metallic plug ( 400, 1000 ). The metallic plug at least partially fills the duct. The metallic plug forms a seal ( 402, 1002 ) with the metallization. The magnetic field probe further comprises a sample ( 300, 900, 1608 ) comprising fluorine 19. The sample at least partially fills the hollow cavity. The magnetic field probe further comprises an antenna ( 102 ) adjacent to the container for manipulating the magnetic spins of the fluid sample and for receiving magnetic resonance signals from the fluid sample.

Подробнее
Номер записи: 100