20-03-2014 дата публикации
Номер: US20140080064A1
A pattern is printed by forming a photoresist layer on a wafer, forming a protective film thereon, exposure, and development. The protective film is formed from a composition comprising a copolymer comprising recurring units derived from a styrene, indene, benzofuran or benzothiophene monomer having 1,1,1,3,3,3-hexafluoro-2-propanol, and recurring units derived from a styrene, vinylnaphthalene, indene, benzofuran, benzothiophene, stilbene, styrylnaphthalene or dinaphthylethylene monomer and an ether solvent. 2. The protective film-forming composition of which is soluble in an alkaline developer.3. The protective film-forming composition of claim 1 , further comprising an ether solvent selected from the group consisting of diisopropyl ether claim 1 , diisobutyl ether claim 1 , diisopentyl ether claim 1 , di-n-pentyl ether claim 1 , methyl cyclopentyl ether claim 1 , methyl cyclohexyl ether claim 1 , di-n-butyl ether claim 1 , di-sec-butyl ether claim 1 , diisopentyl ether claim 1 , di-sec-pentyl ether claim 1 , di-tert-amyl ether claim 1 , and di-n-hexyl ether.4. The protective film-forming composition of claim 3 , further comprising an alcohol solvent in admixture with the ether solvent claim 3 , said alcohol solvent being selected from the group consisting of 1-butyl alcohol claim 3 , 2-butyl alcohol claim 3 , isobutyl alcohol claim 3 , tert-butyl alcohol claim 3 , 1-pentanol claim 3 , 2-pentanol claim 3 , 3-pentanol claim 3 , tert-amyl alcohol claim 3 , neopentyl alcohol claim 3 , 2-methyl-1-butanol claim 3 , 3-methyl-1-butanol claim 3 , 3-methyl-3-pentanol claim 3 , cyclopentanol claim 3 , 1-hexanol claim 3 , 2-hexanol claim 3 , 3-hexanol claim 3 , 2 claim 3 ,3-dimethyl-2-butanol claim 3 , 3 claim 3 ,3-dimethyl-1-butanol claim 3 , 3 claim 3 ,3-dimethyl-2-butanol claim 3 , 2-ethyl-1-butanol claim 3 , 2-methyl-1-pentanol claim 3 , 2-methyl-2-pentanol claim 3 , 2-methyl-3-pentanol claim 3 , 3-methyl-1-pentanol claim 3 , 3-methyl-2-pentanol claim 3 , 3-methyl-3- ...
Подробнее