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04-07-2013 дата публикации

Multilayer ceramic capacitor

Номер: US20130170094A1

Автор: Hyung Joon Kim, Jang Ho Lee, Ju Myung SUH, Jun Hee Kim, Min Gon Lee, Sang Huk Kim

Принадлежит: Samsung Electro Mechanics Co Ltd

There is provided a multilayer ceramic capacitor, including: a multilayer body having a plurality of dielectric layers and a plurality of internal electrode layers alternately laminated; wherein each internal electrode layer has a width gradually decreases from a center thereof towards both ends thereof in a length direction; and when a width of each internal electrode layer at the ends thereof in the length direction is defined as a minimum width L 2 and a width of a portion of a margin portion M in each dielectric layer is defined as a maximum width M 2 , the portion of the margin portion M having no internal electrode layer present thereon and corresponding to the ends of each internal electrode layer in the length direction, a ratio of M 2 to L 2 (M 2 /L 2 ) ranges from 0.2 to 0.3.

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Номер записи: 40

04-07-2013 дата публикации

PRINTED CIRCUIT BOARD HAVING EMBEDDED CAPACITOR AND METHOD OF MANUFACTURING THE SAME

Номер: US20130170154A1

Автор: KIM Moon Il, LEE Doo Hwan, Lee Jin Won, RYU Jong In

Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Provided is a printed circuit board having an embedded capacitor including at least one sheet-shaped capacitor, an insulating material configured to cover the sheet-shaped capacitor, and a capacitor device mounted in the insulating material to be parallelly disposed at one side of the sheet-shaped capacitor, improving reliability of the substrate. 1. A printed circuit board having an embedded capacitor comprising:at least one sheet-shaped capacitor;an insulating material configured to cover the sheet-shaped capacitor; anda chip capacitor mounted in the insulating material to be parallelly disposed at one side of the sheet-shaped capacitor.2. The printed circuit board having an embedded capacitor according to claim 1 , wherein the chip capacitor is parallelly disposed at one side of the sheet-shaped capacitor in a horizontal direction.3. The printed circuit board having an embedded capacitor according to claim 1 , wherein the chip capacitor is connected to the sheet-shaped capacitor in series or in parallel.4. The printed circuit board having an embedded capacitor according to claim 1 , wherein the sheet-shaped capacitor comprises:a dielectric body; andfirst and second pattern electrodes formed at upper and lower surfaces of the dielectric body, respectively.5. The printed circuit board having an embedded capacitor according to claim 4 , wherein the dielectric body is formed of any one of an organic material claim 4 , ceramic and a ceramic-filled organic material claim 4 , or a combination thereof.6. The printed circuit board having an embedded capacitor according to claim 4 , wherein the first and second pattern electrodes are formed of a metal foil.7. The printed circuit board having an embedded capacitor according to claim 1 , further comprising:a via formed by processing the insulating material to electrically connect the sheet-shaped capacitor and the chip capacitor; anda circuit pattern formed inside or an outermost surface of the insulating material.8. The ...

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Номер записи: 41

04-07-2013 дата публикации

TOROIDAL COMPRESSIBLE ELEMENT INCLUDING A SWITCHBACK PATTERN

Номер: US20130172949A1

Автор: Stevenson Mark

Принадлежит:

An example includes an apparatus for use within a header of an implantable medical device, the apparatus including a substantially annular spring, sized and shaped to be disposed in the header, the spring defining a loop extending about a central axis, the spring including a plurality of elastically deformable switchback portions that both zigzag and curve transversely about the loop to define a surface that at least partially encompasses the loop. 1. An apparatus for use within a header of an implantable medical device , the apparatus comprising:a substantially annular spring, sized and shaped to be disposed in the header, the spring defining a loop extending about a central axis, the spring including a plurality of elastically deformable switchback portions that both zigzag and curve transversely about the loop to define a surface that at least partially encompasses the loop.2. The apparatus of claim 1 , wherein the spring defines a toroid-shaped exterior.3. The apparatus of claim 2 , wherein the spring defines a toroid-shaped interior void.4. The apparatus of claim 3 , wherein the spring defines a gap extending from the toroid-shaped interior void through to the exterior of the toroid-shaped exterior.5. The apparatus of claim 4 , wherein the gap extends around the central axis to define a loop-shaped gap.6. The apparatus of claim 1 , wherein when in a planar state claim 1 , one or more of the switchback portions is arc-shaped claim 1 , and wherein the spring includes linear portions claim 1 , when in the planar state claim 1 , that extend between respective switch-backs.7. The apparatus of claim 6 , wherein the loop is substantially planar claim 6 , and wherein when out of the planar state claim 6 , a particular one of the linear portions is curved at least partially around a tangential axis that is tangential to the loop.8. A method comprising:obtaining or providing a sheet of material;forming from the material a member comprising a plurality of switchback ...

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Номер записи: 42

25-07-2013 дата публикации

FILM FOR USE IN FILM CAPACITORS, AND FILM CAPACITORS

Номер: US20130188293A1

Автор: Hanabusa Kakeru, KAWABE Takuma, KITAHARA Takahiro, Koh Meiten, Komatsu Nobuyuki, Mukai Eri, Tatemichi Mayuko, Yokotani Kouji

Принадлежит: DAIKIN INDUSTRIES, LTD.

Provided is a film for a film capacitor in which electrical insulation, and especially electrical properties at high temperatures are improved while a high dielectric constant of a vinylidene fluoride resin is maintained. The film for a film capacitor includes a tetrafluoroethylene resin (a1) that includes a vinylidene fluoride unit and a tetrafluoroethylene unit in the vinylidene fluoride unit/tetrafluoroethylene unit ratio (mol %) of 0/100 to 49/51 as a film-forming resin (A). 1. A film for a film capacitor comprisinga tetrafluoroethylene resin (a1) that includes a vinylidene fluoride unit and a tetrafluoroethylene unit in the vinylidene fluoride unit/tetrafluoroethylene unit (mol % ratio) of 0/100 to 49/51 as a film-forming resin (A).2. The film for a film capacitor according to claim 1 ,wherein the tetrafluoroethylene resin (a1) further includes an ethylenically unsaturated monomeric unit.3. The film for a film capacitor according to claim 2 , {'br': None, 'sup': 1', '2', '3', '4, 'sub': 2', 'n, 'CXX═CX(CF)X'}, 'wherein the tetrafluoroethylene resin (a1) includes 55.0 to 90.0 mol % of the tetrafluoroethylene unit, 5.0 to 44.9 mol % of the vinylidene fluoride unit, and 0.1 to 10.0 mol % of the ethylenically unsaturated monomeric unit represented by the formula (1){'sup': 1', '2', '3', '4, 'wherein X, X, X, and Xare the same as or different from one another, and are each represent H, F, or Cl; and n is an integer of 0 to 8, provided that compounds of the formula (1) are neither tetrafluoroethylene nor vinylidene fluoride.'}4. The film for a film capacitor according to claim 2 , {'br': None, 'sub': '2', 'sup': '1', 'CF═CF—ORf'}, 'wherein the tetrafluoroethylene resin (a1) includes 55.0 to 90.0 mol % of the tetrafluoroethylene unit, 9.2 to 44.2 mol % of the vinylidene fluoride unit, and 0.1 to 0.8 mol % of the ethylenically unsaturated monomeric unit represented by the formula (2){'sup': '1', 'wherein Rfis a C1-C3 alkyl group or a C1-C3 fluoroalkyl group.'}5. The ...

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Номер записи: 43

01-08-2013 дата публикации

PRINTED WIRING BOARD

Номер: US20130192883A1

Автор: FURUTANI Toshiki, Mikado Yukinobu, SAKAI Shunsuke, Tanaka Yusuke

Принадлежит: IBIDEN CO., LTD

A printed wiring board includes a substrate having an accommodation section having multiple opening portions, multiple electronic components accommodated in the opening portions, respectively, a filler resin provided in the opening portions in the substrate such that the electronic components are secured in the opening portions in the substrate, a resin insulation layer formed over the substrate and the electronic components, a conductive layer formed on the resin insulation layer, and via conductors formed in the resin insulation layer and connecting the conductive layer and the electronic components. The opening portions are connected to each other. 1. A printed wiring board , comprising:a substrate having an accommodation section having a plurality of opening portions;a plurality of electronic components accommodated in the plurality of opening portions, respectively;a filler resin provided in the opening portions in the substrate such that the electronic components are secured in the opening portions in the substrate;a resin insulation layer formed over the substrate and the electronic components;a conductive layer formed on the resin insulation layer; anda plurality of via conductors formed in the resin insulation layer and connecting the conductive layer and the electronic components,wherein the opening portions are connected to each other.2. The printed wiring board according to claim 1 , wherein the electronic components are chip capacitors.3. The printed wiring board according to claim 1 , wherein the opening portions in the substrate have rectangular shapes.4. The printed wiring board according to claim 1 , wherein the opening portions in the substrate are formed such that adjoining opening portions are directly connected claim 1 , and have a directly connected portion with a length which is set shorter than a length of sides of the electronic components opposite to the directly connected portion.5. The printed wiring board according to claim 1 , wherein ...

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Номер записи: 44

01-08-2013 дата публикации

Dielectric thin film element, antifuse element, and method of producing dielectric thin film element

Номер: US20130194714A1

Автор: Jun Takagi, Shinsuke Tani, Toshiyuki Nakaiso, Yuji Irie, Yutaka Ishiura, Yutaka Takeshima

Принадлежит: Murata Manufacturing Co Ltd

A dielectric thin film element having a high humidity resistance is provided. A dielectric thin film element includes a capacitance section having a dielectric layer and a pair of electrode layers formed on the respective upper and lower surfaces of the dielectric layer 22 . Furthermore, a protection layer is provided on the capacitance section, a pair of interconnect layers are drawn out to an upper surface of the protection layer, and external electrodes are formed to be electrically connected to the interconnect layers. Further, first surface metal layers cover a portion of the interconnect layers that extends along the inner surface of the openings and second surface metal layers are formed at end of the first surface metal layers.

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Номер записи: 45

08-08-2013 дата публикации

CERAMIC ELECTRONIC COMPONENT

Номер: US20130200749A1

Автор: KISUMI Tetsuya, NAGAMOTO Toshiki, NISHISAKA Yasuhiro, SANADA Yukio

Принадлежит: MURATA MANUFACTURING CO., LTD.

A ceramic electronic component includes a ceramic body; a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a coating layer covering a surface portion of the ceramic body on which the internal electrodes are exposed, the coating layer being made of a glass or resin medium in which metal powder particles are dispersed; and an electrode terminal provided directly on the coating layer and including a plating film. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal and have an elongated shape in cross section along a thickness direction of the coating layer. The metal powder particles defining the conduction paths have a maximum diameter not smaller than the thickness of the coating layer. 1. A ceramic electronic component comprising:a ceramic body;a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body;at least one coating layer covering a portion of the surface of the ceramic body on which the plurality of internal electrodes are exposed, the at least one coating layer being made of a glass medium or resin medium in which metal powder particles are dispersed; andat least one electrode terminal provided directly on the at least one coating layer and including a plating film; whereinthe metal powder particles define conduction paths electrically connecting the plurality of internal electrodes with the at least one electrode terminal;the metal powder particles have an elongated shape as viewed in cross section along a direction of thickness of the at least one coating layer; andthe metal powder particles defining the conduction paths have a maximum diameter equal to or larger than a thickness of the at least one coating layer.2. The ceramic electronic component according to claim 1 , wherein the metal powder particles are in flake form.3. The ceramic ...

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Номер записи: 46

08-08-2013 дата публикации

CERAMIC ELECTRONIC COMPONENT

Номер: US20130201600A1

Автор: Ishizuka Akira, KISUMI Tetsuya, NISHISAKA Yasuhiro, SANADA Yukio

Принадлежит: MURATA MANUFACTURING CO., LTD.

A ceramic electronic component includes a ceramic body, a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a glass coating layer covering a portion of the surface of the ceramic body on which the internal electrodes are exposed; and an electrode terminal provided directly on the glass coating layer and including a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The internal electrodes project from the surface of the ceramic body into the glass coating layer without passing through the glass coating layer. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal. 1. A ceramic electronic component comprising:a ceramic body;a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body;at least one glass coating layer covering a portion of the surface of the ceramic body on which the plurality of internal electrodes are exposed; andat least one electrode terminal provided directly on the at least one glass coating layer and including a plating film; whereinthe at least one glass coating layer is made of a glass medium in which metal powder particles are dispersed;the plurality of internal electrodes project from the surface of the ceramic body into the at least one glass coating layer without passing through the at least one glass coating layer; andthe metal powder particles define conduction paths electrically connecting the plurality of internal electrodes with the at least one electrode terminal.2. The ceramic electronic component according to claim 1 , wherein portions of the internal electrodes projecting from the surface of the ceramic body have a length of about 50% or less of a thickness of the at least one glass coating layer.3. The ceramic electronic component according to claim 2 , wherein the ...

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Номер записи: 47

08-08-2013 дата публикации

ARRAY-TYPE MULTILAYERED CERAMIC ELECTRONIC COMPONENT

Номер: US20130201603A1

Автор: CHAE Eun Hyuk, CHUNG Hae Suk, LEE Byoung Hwa, PARK Min Cheol

Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

There is provided an array-type multilayered ceramic electronic component including: a ceramic body; a plurality of external electrodes formed on one surface of the ceramic body and the other surface thereof opposing the one surface; and a plurality of internal electrode multilayered parts formed in the ceramic body and connected to the external electrodes, respectively, wherein when a gap between the internal electrode multilayered parts is G and internal electrode density is D, 40%≦D≦57%, 10 μm≦G≦200 μm, and G≧(0.0577×D)−(4.4668×D)+111.22. Therefore, delamination and cracking may be prevented. 1. An array-type multilayered ceramic electronic component comprising:a ceramic body;a plurality of external electrodes formed on one surface of the ceramic body and the other surface thereof opposing the one surface; anda plurality of internal electrode multilayered parts formed in the ceramic body and connected to the external electrodes, respectively,{'sup': '2', 'when a gap between the internal electrode multilayered parts is G and a density of the internal electrode is D, the conditions of 40%≦D≦57%, 10 μm≦G≦200 μm, and G≧(0.0577×D)=(4.4668×D)+111.22 being met.'}2. The array-type multilayered ceramic electronic component of claim 1 , wherein the number of internal electrode multilayered parts is two.3. The array-type multilayered ceramic electronic component of claim 1 , wherein each of the plurality of external electrodes formed on the one surface of the ceramic body is disposed to oppose the plurality of external electrodes formed on the other surface of the ceramic body.4. The array-type multilayered ceramic electronic component of claim 1 , wherein the external electrode covers an exposed part of the internal electrode.5. The array-type multilayered ceramic electronic component of claim 1 , wherein the external electrode is extended in a direction in which the internal electrodes are multilayered.6. The array-type multilayered ceramic electronic component of claim 1 ...

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Номер записи: 48

15-08-2013 дата публикации

ELECTRONIC DEVICE, METHOD FOR MANUFACTURING THEREOF, AND ELECTRONIC APPARATUS

Номер: US20130206465A1

Автор: TAKAGI Shigekazu

Принадлежит: SEIKO EPSON CORPORATION

An electronic device includes a first member including a reference potential terminal; a second member placed on a first surface of the first member and having conductivity; and a functional element accommodated in a cavity surrounded by the first member and the second member, wherein the second member and the reference potential terminal are electrically connected via a contact portion. 1. An electronic device comprising:a first member including a reference potential terminal;a second member placed on a first surface of the first member and having conductivity; anda functional element accommodated in a cavity surrounded by the first member and the second member, whereinthe second member and the reference potential terminal are electrically connected via a contact portion.2. The electronic device according to claim 1 , whereina recess is disposed on the side of the first surface of the first member, andthe contact portion is arranged within the recess.3. The electronic device according to claim 2 , whereinthe reference potential terminal is disposed on the side of the first surface of the first member, anda wiring which connects the contact portion with the reference potential terminal is disposed within the recess.4. The electronic device according to claim 1 , whereinthe reference potential terminal is disposed on a surface of the first member on the side opposed to the first surface, andthe contact portion and the reference potential terminal are connected via a through-electrode penetrating through the first member.5. The electronic device according to claim 1 , whereinthe reference potential terminal is electrically connected with the functional element through a second wiring, andthe contact portion is disposed on the second wiring.6. The electronic device according to claim 1 , whereinthe contact portion is disposed on the side of the second member.7. The electronic device according to claim 6 , whereinthe contact portion is disposed integrally with the ...

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Номер записи: 49

22-08-2013 дата публикации

FILTERED FEEDTHROUGH ASSEMBLY AND ASSOCIATED METHOD

Номер: US20130215553A1

Автор: Iyer Rajesh V.

Принадлежит: Medtronic, Inc.

A system and method for sealing a capacitor bottom in a filtered feedthrough. The feedthrough comprises a ferrule, a capacitor, at least one terminal pin and a support structure. The support structure includes at least one projection that extends into an aperture of the capacitor. The projection includes an opening through which the at least one terminal pin extends such that, in an assembled state, the terminal pin extends through the opening of the projection and the aperture of the capacitor. 1. A filtered feedthrough assembly , comprising:a ferrule;a capacitor comprising a top portion and a bottom portion, wherein at least one aperture is defined through the capacitor from the top portion to the bottom portion;at least one terminal pin extending through the at least one aperture; and a first side;', 'a second side opposing the first side; and', 'at least one projection extending from the first side, wherein an opening is defined through the at least one projection and extends to the second side of the support structure, wherein the at least one projection of the support structure extends into the at least one aperture of the capacitor such that a seal is created between the at least one projection and the at least one aperture defined through the capacitor, and further wherein the at least one terminal pin extends through the opening defined through the at least one projection such that the at least one terminal pin is sealed in the opening defined through the at least one projection., 'a support structure configured to be received within the ferrule, wherein the support structure comprises2. (canceled)3. (canceled)4. The filtered feedthrough assembly of claim 1 , wherein the at least one projection comprises a bifurcated cylindrical base portion.5. The filtered feedthrough assembly of claim 1 , wherein the opening tapers from the second side to the first side such that the opening has a conical cross-section.6. (canceled)7. The filtered feedthrough assembly of ...

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Номер записи: 50

29-08-2013 дата публикации

Standard Capacitance Box Output Device

Номер: US20130223040A1

Автор: Guiying Li

Принадлежит: Individual

The invention discloses a capacitance standard box output device. The number of standard capacitors is reduced, so that the structure of a changeover switch is simplified, and the number of connection wires is reduced, so as to improve the shield effect and reduce uncertainty. The technical proposal of the invention is as follows: The capacitance standard box output device comprises a changeover switch and precision capacitors, wherein the changeover switch is placed in a shield box; the shield box has an input terminal and an output terminal; the input terminal is connected to the changeover switch and the precision capacitor; the output is connected to the changeover switch and outputs the capacitance selected by the changeover switch; the selected capacitance is a product of a unit capacitance and an arbitrary integer value between 0 and 10; the number of the precision capacitors is from 4 to 9, and at least one capacitor is of a unit capacitance. The invention is mainly used for the capacitance standard box to output more accurate capacitance.

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Номер записи: 51

29-08-2013 дата публикации

Systems and methods for modifying impedance along electrical paths of electrical stimulation systems

Номер: US20130226266A1

Автор: Gaurav Gupta, Joseph M. Bocek, Rafael Carbunaru, Salomo Murtonen

Принадлежит: Boston Scientific Neuromodulation Corp

An implantable medical device system includes a control module with a connector assembly for electrically coupling to a lead. The control module includes a plurality of feedthrough interconnects extending from the connector assembly to an electronic subassembly disposed in a sealed housing. The plurality of feedthrough interconnects include a first feedthrough interconnect and a second feedthrough interconnect. Impedance circuitry disposed in the control module modulates impedance associated with terminals and conductors of the lead. The impedance circuitry includes a plurality of impedance elements each coupled electrically to a different feedthrough interconnect. Each impedance element has a pre-defined impedance. The plurality of impedance elements include a first impedance element electrically coupled to the first feedthrough interconnect and a second impedance element electrically coupled to the second feedthrough interconnect. The pre-defined impedance of the first impedance element is different than the pre-defined impedance of the second impedance element.

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Номер записи: 52

05-09-2013 дата публикации

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

Номер: US20130229748A1

Автор: CHAE Eun Hyuk, CHUNG Hae Suk, LEE Byoung Hwa, PARK Min Cheol

Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

There is provided a multilayer ceramic electronic component, including: a ceramic body having external electrodes; and internal electrodes disposed between ceramic layers within the ceramic body, the ceramic body having a width smaller than a length thereof and the number of laminated internal electrodes being 250 or more, wherein when the thickness of the ceramic layer is denoted by Tand the thickness of the internal electrode is denoted by T, 0.5≦T/T≦2.0, and when the thickness of a central portion of the ceramic body is denoted by Tand the thickness of each of side portions of the ceramic body is denoted by T, 0.9≦T/T≦0.97, and thus, a multilayer ceramic electronic component having low equivalent series inductance (ESL) may be obtained. 1. A multilayer ceramic electronic component , comprising:a ceramic body having external electrodes; andinternal electrodes disposed between ceramic layers within the ceramic body,when a direction in which the external electrodes are connected and extended is denoted as a ┌width direction┘; a direction in which the internal electrodes are laminated is denoted as a ┌thickness direction┘; and a direction perpendicular to the width direction and the thickness direction is denoted as a ┌length direction┘, the ceramic body having a width smaller than a length thereof,the number of the internal electrodes laminated being 250 or more,{'sub': d', 'e', 'e', 'd, 'when the thickness of the ceramic layer is denoted by Tand the thickness of the internal electrode is denoted by T, 0.5≦T/T≦2.0, and'}{'sub': m', 'a', 'a', 'm, 'when the thickness of a central portion in a width direction of the ceramic body is denoted by Tand the thickness of each of side portions of the ceramic body is denoted by T, in a cross section in a width-thickness direction of the ceramic body, 0.9≦T/T≦0.97.'}2. The multilayer ceramic electronic component of claim 1 , wherein the central portion in the width direction of the ceramic body is within sections inside 15% of ...

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Номер записи: 53

19-09-2013 дата публикации

MULTI LAYER CHIP CAPACITOR, AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME

Номер: US20130242461A1

Автор: HA Jae-Ho

Принадлежит: Sehyang Industrial Co., Ltd.

A method of manufacturing a multi-layer chip capacitor by depositing a dielectric layer and a conductor layer in the form of multi-layer chip, while a width of the conductor layer is narrower than a width of the dielectric layer including adjusting and setting a distance between a single shadow mask installed to a mask set to be rotated and revolved and having a plurality of slits, positioning a dielectric layer deposition source to be perpendicular to the single shadow mask and a conductor layer deposition source to be oblique to the single shadow mask, and forming the dielectric layer and the conductor layer in the vacuum deposition while controlling the mask set to move along the X-, Y-, and Z-axes (the X-axis is the width direction, the Y-axis is the longitudinal direction, and the Z-axis is the height direction). 1. A method of manufacturing a multi-layer chip capacitor by depositing a dielectric layer and a conductor layer in the form of multi-layer chip , while a width of the conductor layer is narrower than a width of the dielectric layer , comprising:adjusting and setting a distance between a single shadow mask installed to a mask set to be rotated and revolved and having a plurality of slits;positioning a dielectric layer deposition source to be perpendicular to the single shadow mask and a conductor layer deposition source to be oblique to the single shadow mask; andforming the dielectric layer and the conductor layer in the vacuum deposition while controlling the mask set to move along the X-, Y-, and Z-axes (the X-axis is the width direction, the Y-axis is the longitudinal direction, and the Z-axis is the height direction).2. The method of manufacturing a multi-layer chip capacitor according to claim 1 , further comprising forming a thermally decomposable releasing layer on the substrate before the setting.3. The method of manufacturing a multi-layer chip capacitor according to claim 1 , further comprising controlling the mask set to move in the height ...

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Номер записи: 54

19-09-2013 дата публикации

CERAMIC CAPACITOR

Номер: US20130242462A1

Автор: KAWANO HIROAKI, Oguni Toshimi

Принадлежит: MURATA MANUFACTURING CO., LTD.

When a voltage two times a rated voltage is applied between a first external electrode and a second external electrode of a ceramic capacitor, the electric field intensity generated at portion connected between a first internal electrode and an end of a portion of a second external electrode at a side of a first side surface by a shortest distance Fis about 0.34 kV/mm or less. 1. A ceramic capacitor comprising:a ceramic base including a first and a second primary surface extending along a length direction and a width direction, a first and a second side surface extending along the length direction and a thickness direction, and a first and a second end surface extending along the width direction and the thickness direction;first internal electrodes which extend in the ceramic base along the length direction and the width direction and which are exposed at the first end surface;second internal electrodes which are arranged in the ceramic base to face the first internal electrodes in the thickness direction and which are exposed at the second end surface;a first external electrode which is electrically connected to the first internal electrodes and includes a first portion arranged on the first end surface, second portions arranged on the first and second primary surfaces, and third portions arranged on the first and second side surfaces, and which includes Ag at least in a surface layer thereof; anda second external electrode which is electrically connected to the second internal electrodes and includes a fourth portion arranged on the second end surface, fifth portions arranged on the first and second primary surfaces, and sixth portions arranged on the first and second side surfaces, and which includes Ag at least in a surface layer thereof; wherein{'sub': 'S', 'when a voltage that is about two times a rated voltage is applied between the first external electrode and the second external electrode, an electric field intensity generated at a portion connected between ...

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Номер записи: 55

19-09-2013 дата публикации

Abrasive Blasted Cathode of a Wet Electrolytic Capacitor

Номер: US20130242468A1

Автор: Masheder David, Pinwill Ian

Принадлежит: AVX CORPORATION

A wet electrolytic capacitor that includes a porous anode body containing a dielectric layer, an electrolyte, and a cathode containing a metal substrate on which is disposed a conductive coating is provided. Prior to application of the conductive coating, the metal substrate is blasted with abrasive particles to enhance the ability of the substrate to adhere to the coating. The micro-roughened metal substrate can be treated after blasting so that substantially all of the abrasive particles are removed. This is accomplished by contacting the metal substrate with an extraction solution to remove the particles, and also by selectively controlling the nature of the abrasive particles so that they are dispersible (e.g., soluble) in the solution. 1. A method for forming a cathode of a wet electrolytic capacitor , the method comprising:blasting a metal substrate with a plurality of abrasive particles to form a micro-roughened surface having a plurality of pits;contacting the micro-roughened surface of the metal substrate with an extraction solution, wherein the abrasive particles are dispersed in the extraction solution; andthereafter, forming a conductive coating on the micro-roughened surface.2. The method of claim 1 , wherein the abrasive particles include ceramic particles.3. The method of claim 1 , wherein the abrasive particles are conductive.4. The method of claim 3 , wherein the abrasive particles include manganese dioxide.5. The method of claim 1 , wherein the abrasive particles have an average size of from about 25 to about 200 micrometers.6. The method of claim 1 , wherein the pits have an average depth of from about 200 to about 2500 nanometers and/or a peak-to-peak distance that ranges from about 30 to about 400 micrometers.7. The method of claim 1 , wherein the abrasive particles are propelled at a pressure of from about 10 to about 35 pounds per square inch for a time of from about 10 to about 30 seconds.8. The method of claim 1 , wherein the abrasive ...

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Номер записи: 56

26-09-2013 дата публикации

CAPACITOR AND METHOD FOR MANUFACTURING THE SAME

Номер: US20130250475A1

Автор: Furusawa Akihiro, Kubouchi Tatsuo, Mori Masayuki

Принадлежит: NIPPON CHEMI-CON CORPORATION

A capacitor includes a capacitor element that is a wound element or an element other than the wound element, and that includes electrode bodies each of which is in an anode side and a cathode side, and separators that intervenes between the electrode bodies; a sealing member that seals an opening of a case member accommodating the capacitor element; at least one electrode protrusion that protrudes from one of the electrode bodies on an element end-face of the capacitor element, at least one of current collector plate that is connected to the electric protrusion; and at least one terminal member that is disposed in the sealing member, and is superposed on the current collector plate, a side face part of the terminal member being welded to a side face part of the current collector plate. 1. A capacitor comprising:a capacitor element that is a wound element or an element other than the wound element, and that includes electrode bodies each, of which is in an anode side and a cathode side, and separators that intervenes between the electrode bodies;a sealing member that seals an opening of a case member accommodating the capacitor element;at least one electrode protrusion that protrudes from one of the electrode bodies on an element end-face of the capacitor element,at least one of current collector plate that is connected to the electric protrusion; andat least one terminal member that is disposed in the sealing member, and is superposed on the current collector plate, a side face part of the terminal member being welded to a side face part of the current collector plate.2. The capacitor of claim 1 , whereinthe electrode protrusion is an aggregate that is formed by part of one electrode body, which is in the electrode bodies, and is bent toward an element center of the capacitor element to be molded on the element end-face, and is joined to the current collector plate.3. The capacitor of claim 1 , whereinthe electrode protrusion is an anode protrusion that protrudes ...

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Номер записи: 57

03-10-2013 дата публикации

EBG STRUCTURE, SEMICONDUCTOR DEVICE, AND PRINTED CIRCUIT BOARD

Номер: US20130256009A1

Автор: Itaya Kazuhiko, Sasaki Tadahiro, YAMADA Hiroshi

Принадлежит:

An EBG structure according to an embodiment includes an electrode unit made of a first conductor and provided with a space, a patch unit provided approximately parallel to the electrode unit and made of a second conductor, an insulating layer provided between the electrode unit and the patch unit, a first via provided between the patch unit and the electrode unit in the insulating layer and connected to the patch unit and the electrode unit, and a second via provided between the patch unit and the space in the insulating layer, connected to the patch unit, and not connected to the electrode unit. 1. An EBG (Electromagnetic Band Gap) structure comprising:an electrode unit made of a first conductor and provided with a space;a patch unit provided approximately parallel to the electrode unit and made of a second conductor;an insulating layer provided between the electrode unit and the patch unit;a first via provided between the patch unit and the electrode unit in the insulating layer and connected to the patch unit and the electrode unit; anda second via provided between the patch unit and the space in the insulating layer, connected to the patch unit, and not connected to the electrode unit.2. The structure according to claim 1 , wherein a space-side end portion of the second via reaches the space.3. The structure according to claim 1 , wherein the electrode unit is a ground line or a power line.4. The structure according to claim 1 , wherein the first conductor is aluminum (Al) or gold (Au) claim 1 , and the second conductor is aluminum (Al) or gold (Au).5. A semiconductor device comprising an EBG (Electromagnetic Band Gap) structure claim 1 , the EBG structure comprising:an electrode unit made of a first conductor and provided with a space;a patch unit provided approximately parallel to the electrode unit and made of a second conductor;an insulating layer provided between the electrode unit and the patch unit;a first via provided between the patch unit and the ...

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Номер записи: 58

24-10-2013 дата публикации

Capacitors and semiconductor devices including the same

Номер: US20130277724A1

Автор: Jong-ryul JUN

Принадлежит: SAMSUNG ELECTRONICS CO LTD

A capacitor includes a lower electrode having a curved surface, a first seed on a sidewall of the lower electrode, which the first seed includes a metal silicide and has a shape corresponding to the curved surface of the lower electrode, a dielectric layer on the lower electrode, the dielectric layer covering the first seed, and an upper electrode on the dielectric layer.

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Номер записи: 59

24-10-2013 дата публикации

Multifunction Charge Transfer Device

Номер: US20130279069A1

Автор: Mantock Paul Lenworth

Принадлежит:

A multifunction charge transfer device that limits and controls a current and voltage to a circuit or load, comprising at least one input and at least one output electrode as the charging electrode and the discharging electrode respectively, both in the form of closed continuous electrical loops. The charging electrode and discharging electrode in the form of closed continuous electrical loops are arranged side by side so that the edges of the electrical conducting material and the dielectric material and forming each closed continuous electrical loop are in alignment. The two closed continuous electrical loops are separated by a gap to prevent any electrical contact between them and so that the charging electrode and discharging electrode can only be coupled by the electrostatic field concentrated at the side of the closed continuous electrical loop forming the charging electrode . The charging and discharging electrodes and are each provided with connectors and respectively as a means for connection to an electric circuit in series. 1. A multi-function charge transfer device comprising;at least one charging electrode and at least one discharging electrode and the said charging electrode and the said discharging electrode, each being in the form of a closed continuous electrical loop, as defined in the invention U.S. Pat. No. 7,782,595, where therein, each electrode in the form of the said closed continuous electrical loop has no ends electrically, thereby concentrating the electrostatic field at the side edges of the said charging electrodeand the said charging and the said discharging electrode being arranged side by side in alignment and being separated by an appropriate gap and the said appropriate gap being the means preventing any electric contact between the said charging electrode and the said discharging electrodeand the said charging electrode being provided with a connector and is the means by which the said charging electrode is connected to an electric ...

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Номер записи: 60

24-10-2013 дата публикации

Monolithic ceramic electronic component

Номер: US20130279072A1

Автор: Shingo Okuyama, Toshihiro Nakai, Yoshiji Okamoto

Принадлежит: Murata Manufacturing Co Ltd

When a monolithic ceramic electronic component is viewed from either one of end surfaces thereof, an outer electrode includes a solder-repellent portion and a solder-receivable portion. The solder-repellent portion covers the central portion of an end surface of a ceramic laminate body. The solder-receivable portion includes portions disposed on two opposing sides of the solder-repellent portion. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to a portion around the central portion of the end surface. Thus, expansion and contraction that occur as a result of application of an AC voltage are not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are reduced.

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Номер записи: 61

31-10-2013 дата публикации

MULTILAYER CERAMIC ELECTRONIC COMPONENT

Номер: US20130286535A1

Автор: CHAE Eun Hyuk, CHUNG Hae Sock, LEE Byoung Hwa, PARK Min Cheol

Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0.7p or less; external electrodes formed on external surfaces of the ceramic body; and internal electrodes respectively disposed on the dielectric layer so as to have a gap formed therebetween, wherein, when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 μm≦Gmin≦60 μm is satisfied. 1. A multilayer ceramic electronic component , comprising:a ceramic body formed by laminating dielectric layers having an average thickness of 0.7 μm or less;at least two external electrodes formed on external surfaces of the ceramic body; andinternal electrodes printed on the dielectric layers so as to be printed on a single dielectric layer and thus have a gap formed therebetween, the internal electrodes constituting at least two internal electrode lamination portions,the gap between the internal electrode of one internal electrode lamination portion and the internal electrode of the other internal electrode lamination portion adjacent to the one internal electrode lamination portion being defined by internal electrode edges with curves, adjacent to one another,when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 μm≦Gmin≦60 μm, andwhen a width of a central portion of the internal electrode is denoted by Wa, and a width of an end portion of an outline of the internal electrode is denoted by Wb, 1.1≦Wa/Wb≦1.35.2. The multilayer ceramic electronic component of claim 1 , wherein claim 1 , when a margin portion between the internal electrode edge of the internal electrode and one end surface of the ceramic body adjacent thereto is denoted by Ms claim 1 , Gmin≦Ms is satisfied.3. The multilayer ceramic electronic component of claim 1 , wherein Wa is a widest width of the internal electrode and Wb is a narrowest width of the internal ...

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Номер записи: 62

31-10-2013 дата публикации

EMI FILTERS UTILIZING COUNTER-BORED CAPACITORS TO FACILITATE SOLDER RE-FLOW

Номер: US20130286537A1

Автор: Brendel Richard L., Lorente-Adame Jose Luis, Roberts John E., Stevenson Robert A., Truex Buehl E., Woods Jason

Принадлежит:

An EMI filtered terminal assembly including at least one conductive terminal pin, a feedthrough capacitor, and a counter-bore associated with a passageway through the capacitor is described. Preferably, the feedthrough capacitor having counter-drilled or counter-bored holes on its top side is first bonded to a hermetic insulator. The counter-drilled or counter-bore holes in the capacitor provide greater volume for the electro-mechanical attachment between the capacitor and the terminal pin or lead wire, permitting robotic dispensing of, for example, thermal-setting conductive adhesive. 1. An electromagnetic interference (EMI) filter for use in an active implantable medical device (AIMD) , the EMI filter comprising:a) a capacitor comprising a thickness extending along a longitudinal axis between spaced apart first and second capacitor surfaces meeting a capacitor outer sidewall, wherein the capacitor is comprised of a dielectric material having interleaved, but spaced apart active and ground electrode plates therein, and at least one through hole having a first diameter perpendicular to the longitudinal axis thereof;b) a well comprising a well sidewall having a continuous semi-circular shape in cross-section along an imaginary plane aligned with the longitudinal axis of the through hole, the well sidewall extending from a second diameter at the one of the first and second capacitor surfaces partway into the thickness of the capacitor to the through hole, wherein the second diameter is greater than the first diameter of the through hole;c) a pin or a lead wire extending at least partially into the well and the through hole; andd) an electrically conductive material in the well conductively coupling the pin or the lead wire to one of the active or ground electrode plates.2. The EMI filter of claim I wherein the electrically conductive material is selected from the group consisting of a thermal-setting conductive adhesive , a solder , a solder preform , a solder paste , ...

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Номер записи: 63

31-10-2013 дата публикации

MIM CAPACITOR

Номер: US20130286540A1

Автор: Chhun Sonarith, Farcy Alexis, Gosset Laurent-Georges, Thomas Maryline, Torres Joaquin

Принадлежит:

A method of forming a metal- insulator-metal capacitor having top and bottom plates separated by a dielectric layer, one of the top and bottom plates having at least one protrusion extending into a corresponding cavity in the other of the top and bottom plates, the method including the steps of growing one or more nanofibers on a base surface. 1. A capacitor comprising top and bottom plates separated by a dielectric layer , at least one of the top and bottom plates being formed of metal , one of said top and bottom plates comprising at least one protrusion extending into a corresponding cavity in the other of said top and bottom plates , wherein each of said at least one protrusion comprises a nanofiber.2. The capacitor of claim 1 , wherein said nanofibers are coated with a metallic layer.3. The capacitor of claim 2 , wherein said metallic layer is coated with a layer of dielectric material forming said dielectric layer.4. The capacitor of claim 1 , wherein said nanofibers are conducting.5. The capacitor of claim 4 , wherein said nanofibers are coated with a layer of dielectric material forming said dielectric layer.6. The capacitor of claim 4 , wherein said nanofibers are formed on a base surface of a conductive material claim 4 , and wherein said nanofibers and said base surface form one of said top and bottom plates.7. The capacitor of claim 1 , wherein said nanofibers are formed on a base surface comprising at least one of nickel and cobalt.8. The capacitor of claim 1 , wherein said nanofibers comprise carbon nanofibers.9. The capacitor of claim 1 , wherein said nanofibers have a diameter of less than 50 nm.10. A capacitor comprising top and bottom plates separated by a dielectric layer claim 1 , at least one of the top and bottom plates being formed of metal claim 1 , wherein one of said top and bottom plates comprising at least one protrusion extending into a corresponding cavity in the other of said top and bottom plates claim 1 , said cavity formed by ...

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Номер записи: 64

31-10-2013 дата публикации

IMPLANTABLE MEDICAL DEVICE AND FEEDTHROUGH AND METHOD OF MAKING SAME

Номер: US20130289681A1

Автор: Iyer Rajesh V., Marinkov Michael G., Nygren Lea A., Tischendorf Brad C.

Принадлежит: Medtronic, Inc.

Implantable medical device having a feedthrough, a feedthrough and method for making such feedthrough. The feedthrough has a ferrule, an electrically conductive pin, a preform having a preform liquidus temperature, a capacitor, positioned within the ferrule abutting the preform, having a coating having a coating liquidus temperature and being configured to electrically couple with the preform, and an insulative assembly configured, at least in part, to seal against passage of a liquid through the ferrule, and having an insulative assembly liquidus temperature. The coating liquidus temperature is greater than the preform liquidus temperature and the coating liquidus temperature being greater than the insulative assembly liquidus temperature. 1. An implantable medical device , comprising:a housing forming a plurality of feedthrough openings; and a ferrule;', 'an electrically conductive pin;', 'a preform having a preform liquidus temperature;', 'a capacitor, positioned within said ferrule abutting said preform, having a coating having a coating liquidus temperature and being configured to electrically couple with said preform; and', 'an insulative assembly configured, at least in part, to seal against passage of a liquid through said ferrule, and having an insulative assembly liquidus temperature;, 'a plurality of feedthroughs, each individually positioned within one of said feedthrough openings, each feedthrough comprisingsaid coating liquidus temperature being greater than said preform liquidus temperature; andsaid coating liquidus temperature being greater than said insulative assembly liquidus temperature.2. The implantable medical device of wherein said coating liquidus temperature claim 1 , said preform liquidus temperature and said insulative assembly liquidus temperature are selected so that said preform claim 1 , said capacitor claim 1 , said insulative assembly claim 1 , said pin and said ferrule are secured with respect to one another with a single step.3. ...

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Номер записи: 65

14-11-2013 дата публикации

CLAD FIBER CAPACITOR AND METHOD OF MAKING SAME

Номер: US20130298364A1

Автор: Tuncer Enis

Принадлежит: UT-BATTELLE, LLC

A clad capacitor and method of manufacture includes assembling a preform comprising a ductile, electrically conductive fiber; a ductile, electrically insulating cladding positioned on the fiber; and a ductile, electrically conductive sleeve positioned over the cladding. One or more preforms are then bundled, heated and drawn along a longitudinal axis to decrease the diameter of the ductile components of the preform and fuse the preform into a unitized strand. 1. A method of manufacturing a capacitor comprising: i. a ductile, electrically conductive fiber having a first end and a second end;', 'ii. a ductile, electrically insulating cladding disposed on the fiber;', 'iii. a first means for electrical contact disposed in electrical connection with the first end of the fiber;', 'iv. a ductile, electrically insulating endwall disposed on the second end of the fiber and in contact with the cladding;', 'v. a ductile, electrically conductive sleeve having a first end and a second end, the sleeve disposed over the cladding so that the first end is oriented toward the first end of the fiber but is electrically insulated from the first means for electrical contact, and so that the second end is oriented toward the second end of the fiber; and', 'vi. a second means for electrical contact disposed in electrical connection with the second end of the sleeve;, 'a. providing a plurality of preform units, each of the preform units comprisingb. arranging the plurality of preforms into a bundle;c. heating the bundle to a temperature sufficient to soften ductile components of the preforms; andd. drawing the bundle along a longitudinal axis of the plurality of fibers to decrease a diameter of the bundle and fuse the preforms together into a single capacitor strand.2. The method of manufacture of wherein the preform further comprises:a ductile, electrically insulating spacer positioned around the fiber and between the first means and the sleeve to electrically insulate the first means ...

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Номер записи: 66

14-11-2013 дата публикации

Via Structure for Multi-Gigahertz Signaling

Номер: US20130299225A1

Автор: LIN Shengli

Принадлежит:

A via structure is disclosed to pass electronic signals from a first conductive pathway formed on a first outermost substrate of a multi-layer PCB to a second conductive pathway formed on a second outermost substrate of the multi-layer PCB. The via structure allows the electronic signals to pass from the first outermost substrate through one or more inner substrates to the second outermost substrate. The one or more inner substrates include one or more closed geometric structures to enclose the via structure. 1. A multi-layer printed circuit board (PCB) , comprising:a first capacitor formed by a first closed geometric structure formed onto a surface of a substrate and a second closed geometric structure formed onto the surface of the substrate to enclose the first closed geometric structure, wherein the second closed geometric structure is electrically isolated from the first closed geometric structure; anda second capacitor formed by the first closed geometric structure and a third closed geometric structure formed onto the surface of the substrate, wherein the third closed geometric structure is formed around the second closed geometric structure, and wherein the third closed geometric structure is electrically isolated from the first closed geometric structure and the second closed geometric structure.2. The multi-layer PCB of claim 1 , wherein the first capacitor and the second capacitor are arranged in series.3. The multi-layer PCB of claim 1 , further comprising:a first conductive pathway formed onto a second substrate;a second conductive pathway formed onto a third substrate; anda connecting structure formed through the substrate to connect the first conductive pathway to the second conductive pathway.4. The multi-layer PCB of claim 3 , wherein the substrate is positioned between the second substrate and the third substrate.5. The multi-layer PCB of claim 1 , wherein the first closed geometric structure and the second closed geometric structure comprise ...

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Номер записи: 67

14-11-2013 дата публикации

Semiconductor Devices and Methods of Manufacture Thereof

Номер: US20130301187A1

Автор: Kim Sun-Oo, KIM Yoon-Hae

Принадлежит:

Semiconductor devices and methods of manufacture thereof are disclosed. In a preferred embodiment, a capacitor plate includes a first propeller-shaped portion and a second propeller-shaped portion. A via portion is disposed between the first propeller-shaped portion and the second propeller-shaped portion. 1. A capacitor comprising:a first propeller-shaped portion disposed in a first metal level, wherein the first propeller-shaped portion comprises a first horizontal member oriented in a first direction and a first vertical member oriented in a second direction, the first horizontal member having a first horizontal length in the first direction and the first vertical member having a first vertical length in the second direction, the first vertical member intersecting the first horizontal member in a first intersection region having a first center point, the first direction being orthogonal to the second direction, wherein the first horizontal length is greater than the first vertical length;a second propeller-shaped portion disposed in the first metal level, wherein the second propeller-shaped portion comprises a second horizontal member oriented in the first direction and a second vertical member oriented in the second direction, the second vertical member intersecting the second horizontal member in a second intersection region having a second center point;a third propeller-shaped portion disposed in the first metal level, wherein the third propeller-shaped portion comprises a third horizontal member oriented in the first direction and a third vertical member oriented in the second direction, the third vertical member intersecting the third horizontal member in a third intersection region having a third center point; anda fourth propeller-shaped portion disposed in the first metal level, wherein the fourth propeller-shaped portion comprises a fourth horizontal member oriented in the first direction and a fourth vertical member oriented in the second direction, the ...

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Номер записи: 68

28-11-2013 дата публикации

THIN FILM CONDENSER FOR HIGH-DENSITY PACKAGING, METHOD FOR MANUFACTURING THE SAME, AND HIGH-DENSITY PACKAGE SUBSTRATE INCLUDING THE SAME

Номер: US20130314842A1

Автор: Baek Seung Hyub, CHOI Ji Won, KANG Chong Yun, Kang Min Gyu, KIM Jin Sang, Yoon Seok Jin

Принадлежит: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Provided are a thin film condenser for high-density packaging, a method for manufacturing the same and a high-density package substrate. The thin film condenser for high-density packaging, includes: a support substrate; a lower electrode formed on the support substrate; a dielectric thin film formed on the lower electrode; and an upper electrode formed on the dielectric thin film. Provided also is a method for manufacturing the same. The high-density package substrate, includes: at least two stacked substrates; thin film condensers embedded in the stacked substrates; an internal connection electrode formed in the stacked substrates and connecting the thin film condensers in series or in parallel; a surface electrode formed on the surface of the outermost substrate among the stacked substrates and connected to the internal connection electrode; and an integrated circuit connected to the surface electrode via a bump. 1. A thin film condenser for high-density packaging , comprising:a support substrate;a lower electrode formed on the support substrate;a dielectric thin film formed on the lower electrode; andan upper electrode formed on the dielectric thin film,wherein the upper electrode comprises two electrodes spaced apart from each other by a predetermined distance on the dielectric thin film.2. The thin film condenser for high-density packaging according to claim 1 , wherein the predetermined distance is 2 μm-100 μm3. The thin film condenser for high-density packaging according to claim 1 , wherein the lower electrode has a thickness of 50 nm-3 μm.4. The thin film condenser for high-density packaging according to claim 1 , wherein the dielectric thin film has a thickness of 50 nm-3 μm.5. A method for manufacturing a thin film condenser for high-density packaging claim 1 , comprising:forming a lower electrode on a support substrate;forming a dielectric thin film on the lower electrode;forming an upper electrode on the dielectric thin film; andpatterning the upper ...

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Номер записи: 69

12-12-2013 дата публикации

CAPACITOR

Номер: US20130329339A1

Автор: MASUDA Hidetoshi, TAKE Yoshinari

Принадлежит:

A capacitor includes a dielectric layer, a first external electrode layer, a second external electrode layer, a first internal electrode portion, a second internal electrode portion, and an adsorbing portion. The first internal electrode portion is provided on a first through-hole portion, one end of the first internal electrode portion being connected to the first external electrode layer. The second internal electrode portion is provided on a second through-hole portion, one end of the second internal electrode portion being connected to the second external electrode layer. The adsorbing portion adsorbs the first external electrode layer and the second external electrode layer, the adsorbing portion being provided on a third through-hole portion. 1. A capacitor , comprising: a first surface,', 'a second surface facing the first surface, and', 'a plurality of through-holes communicating between the first surface and the second surface;, 'a dielectric layer including'}a first external electrode layer disposed on the first surface;a second external electrode layer disposed on the second surface;a first internal electrode portion provided on a first through-hole portion, the first through-hole portion being a part of the plurality of through-holes, one end of the first internal electrode portion being connected to the first external electrode layer, the other end of the first internal electrode portion being insulated from the second external electrode layer;a second internal electrode portion provided on a second through-hole portion, the second through-hole portion being another part of the plurality of through-holes, one end of the second internal electrode portion being connected to the second external electrode layer, the other end of the second internal electrode portion being insulated from the first external electrode layer; andan adsorbing portion provided on a third through-hole portion, the adsorbing portion adsorbing the first external electrode layer and ...

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Номер записи: 70

12-12-2013 дата публикации

Chip-component structure

Номер: US20130329389A1

Автор: Isamu Fujimoto, Kazuo Hattori

Принадлежит: Murata Manufacturing Co Ltd

A chip-component structure includes an interposer on which a multilayer capacitor is mounted. The interposer includes component connecting electrodes, external connection electrodes, side electrodes, and in-hole electrodes. The component connecting electrodes and the external connection electrodes are electrically connected by the side electrodes and the in-hole electrodes. Outer electrodes of the capacitor are joined to the component connecting electrodes.

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Номер записи: 71

12-12-2013 дата публикации

PARTICULATE TOUGHENED CERAMIC FEEDTHROUGH

Номер: US20130331923A1

Автор: Koester Kurt J.

Принадлежит:

A feedthrough includes a ceramic body mechanically joined about a perimeter to a hermetic case. The ceramic body includes a ceramic matrix and a ductile phase distributed through at least a portion of the ceramic matrix. The ductile phase increases the resistance of the ceramic matrix to crack propagation. A plurality of electrical conductors passes through the ceramic body. 1. A feedthrough comprising: a ceramic matrix;', 'a ductile phase distributed through at least a portion of the ceramic matrix, the ductile phase being configured to increase the resistance of the ceramic matrix to crack propagation; and, 'a ceramic body mechanically joined about a perimeter to a hermetic case, the ceramic body comprisinga plurality of electrical conductors passing through the ceramic body.2. The feedthrough of claim 1 , wherein the ductile phase comprises metallic particles claim 1 ,3. The feedthrough of claim 2 , wherein the metallic particles are platinum or a platinum alloy.4. The feedthrough of claim 2 , wherein the metallic particles are configured to bridge gaps created by a crack through the ceramic body to reduce the driving force of the crack.5. The feedthrough of claim 2 , wherein the metallic particles comprises particles with a higher aspect ratio in two dimensions than in a third dimension.6. The feedthrough of claim 5 , wherein the metallic particles have a substantially uniform orientation in the ceramic body.7. The feedthrough of claim 5 , wherein the metallic particles are configured to plastically deform while bridging gaps created by a crack and are oriented to preferentially guide crack propagation trajectories through the ceramic body.8. The feedthrough of claim 1 , wherein a lower concentration of the ductile phase is disposed in portions of the ceramic matrix adjacent to the plurality of electrical conductors and a higher concentration of the ductile phase is disposed in portions of the ceramic matrix away from the plurality of electrical conductors.9. ...

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Номер записи: 72

19-12-2013 дата публикации

CAPACITOR, STRUCTURE AND METHOD OF FORMING CAPACITOR

Номер: US20130335880A1

Автор: MASUDA Hidetoshi

Принадлежит:

There is provided a capacitor including a dielectric layer having a first plane, a second plane opposite to the first plane, and a plurality of through-holes communicated with the first plane and the second plane, including a plurality of arrangement regions where arrangement directions of the plurality of through-holes are same; a first external electrode layer disposed on the first plane; a second external electrode layer disposed on the second plane; a first internal electrode housed in a part of the plurality of through-holes and connected to the first external electrode layer; and a second internal electrode housed in a part of the plurality of through-holes and connected to the second external electrode layer. 1. A capacitor , comprising:a dielectric layer having a first plane, a second plane opposite to the first plane, and a plurality of through-holes communicated with the first plane and the second plane, including a plurality of arrangement regions where arrangement directions of the plurality of through-holes are same;a first external electrode layer disposed on the first plane;a second external electrode layer disposed on the second plane;a first internal electrode housed in a part of the plurality of through-holes and connected to the first external electrode layer; anda second internal electrode housed in a part of the plurality of through-holes and connected to the second external electrode layer.2. The capacitor according to claim 1 , whereinthe through-holes in the arrangement regions have a hexagonal ordered array.3. The capacitor according to claim 2 , whereinthe dielectric layer is made of ceramics.4. The capacitor according to claim 3 , whereinthe dielectric layer is made of aluminum oxide.5. A structure claim 3 , comprising:a dielectric layer having a first plane, a second plane opposite to the first plane, and a plurality of through-holes communicated with the first plane and the second plane, including a plurality of arrangement regions where ...

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Номер записи: 73

19-12-2013 дата публикации

Microcontact Printed Thin Film Capacitors

Номер: US20130337153A1

Автор: Beeson James J., Nagata Hajime, Pinceloup Pascal G., Randall Clive A., Randall Michael S., Skamser Daniel J., Tajuddin Azizuddin, Trolier-Mckinstry Susan

Принадлежит: THE PENN STATE RESEARCH FOUNDATION

The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiO3 multilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiO3 dielectric layers and LaNiO3 internal electrodes are prepared, enabling dielectric layer thicknesses of 1 μμm or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used. 1. A method of forming a microcontact printed layer of stoichiometric barium titanate therein on a Ni foil substrate comprising ,reacting a Ba precursor solution with a Ti precursor solution to produce a precursor solution suitable for producing stoichiometric barium titanate,applying the precursor solution onto a stamp that has a predetermined pattern thereon to form a coated stamp,compressing the coated stamp onto a Ni foil substrate to form a pattern of the precursor solution on the Ni foil substrate,drying the pattern,pyrolyzing the pattern andfiring the pattern to produce a micro contact printed layer of stoichiometric barium titanate on the Ni foil substrate.2. The method of wherein the Ni foil substrate is any of annealed Ni foil claim 1 , virgin Ni foil and 99.99% pure Ni foil.4. The method of wherein the electrode is LaNiOand the dielectric is BaTiO.5. The method of wherein the electrode is LaNiOand the dielectric is Ba(TiM)Owhere M is any of Mn claim 3 , Y claim 3 , Ho claim 3 , Dy claim 3 , Er claim 3 , Mg claim 3 , Ca claim 3 , Co claim 3 , Sr claim 3 , Zr or mixtures thereof.6. A method of manufacture of a multilayer capacitor comprising claim 3 , applying the precursor solution of the dielectric on to a sapphire single crystal substrate and spin casting the substrate having the precursor ...

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Номер записи: 74

26-12-2013 дата публикации

ELECTRONIC COMPONENT

Номер: US20130342283A1

Автор: Sasaki Hiroyuki, TAMARU Ikuo

Принадлежит: MURATA MANUFACTURING CO., LTD.

An electronic component includes a capacitor having a desired capacitance value and a laminate including a plurality of laminated insulating material layers. Land electrodes are provided on a bottom surface of the laminate. Internal conductors face the land electrodes, respectively, across the insulating material layer within the laminate, have areas larger than those of the land electrodes, respectively, and contain the land electrodes, respectively, when seen in a planar view from a z-axis direction. A capacitor conductor is provided on the positive direction side of the capacitor conductors in the z-axis direction and faces the capacitor conductors. 1. (canceled)2. An electronic component comprising:a laminate including a plurality of insulating material layers that are laminated to each other;a land electrode provided on a bottom surface of the laminate;a first capacitor conductor facing the land electrode across at least one of the plurality of insulating material layers within the laminate, having an area larger than that of the land electrode, and containing the land electrode when viewed in a planar view from a lamination direction of the plurality of insulating material layers; anda second capacitor conductor provided on an upper side of the first capacitor conductor in the lamination direction and facing the first capacitor conductor.3. The electronic component according to claim 2 , wherein no conductor layer is provided between the land electrode and the first capacitor conductor.4. The electronic component according to claim 2 , wherein the second capacitor conductor is a ground conductor.5. The electronic component according to claim 2 , whereinthe first capacitor conductor and the second capacitor conductor define a capacitor; andthe capacitor defines a portion of an LC filter included in the laminate.6. The electronic component according to claim 2 , further comprising a via-hole conductor connecting the land electrode to the first capacitor ...

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Номер записи: 75

26-12-2013 дата публикации

LAMINATED CERAMIC ELECTRONIC COMPONENT

Номер: US20130342956A1

Автор: HIROI Kazumichi, KONISHI Yukihiro, KOWASE Yusuke, MIZUNO Kotaro, Sato Ayumu

Принадлежит:

A laminated ceramic electronic component has electrode layers stacked with ceramic layers, where the thickness of each electrode layer is controlled to 0.5 μm or less and the average size of crystal grains constituting the electrode layer is controlled to 0.1 μm or less. The occurrence of structural defects in the laminated ceramic electronic component can be suppressed and high continuity of the electrode layers stacked with the ceramic layers is ensured. 10.1 μm or less.. A laminated ceramic electronic component having ceramic layers and electrode layers stacked with the ceramic layers , wherein a thickness of each electrode layer is 0.5 μm or less and an average size of crystal grains constituting the electrode layer is2. A laminated ceramic electronic component according to claim 1 , wherein a surface roughness based on a maximum height of an interface between each ceramic layer and each electrode layer is one-third the thickness of the electrode layer or less.3. A laminated ceramic electronic component according to claim 2 , wherein the thickness of the electrode layer is one-half the thickness of the ceramic layer or less.4. A laminated ceramic electronic component according to claim 1 , wherein the thickness of the electrode layer is 0.5 μm or less and 0.4 μm or more.5. A laminated ceramic electronic component according to claim 2 , wherein the thickness of the electrode layer is 0.5 μm or less and 0.4 μm or more.6. A laminated ceramic electronic component according to claim 3 , wherein the thickness of the electrode layer is 0.5 μm or less and 0.4 μm or more.7. A laminated ceramic electronic component according to claim 1 , wherein each electrode layer is comprised of continuous portions and discontinuous portions along an extending direction as viewed in a cross section claim 1 , wherein the total length of the continuous portions is more than 80% but less than 100% of the length of the electrode layer.8. A multilayer ceramic capacitor comprising ceramic ...

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Номер записи: 76

26-12-2013 дата публикации

CAPACITOR WITH MULTIPLE ELEMENTS FOR MULTIPLE REPLACEMENT APPLICATIONS

Номер: US20130343029A1

Автор: Stockman Robert M.

Принадлежит: American Radionic Company, Inc.

A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal. 118-. (canceled)19. An apparatus comprising:a case capable of receiving a plurality of capacitive elements, one or more of the capacitive elements providing at least one capacitor having a first capacitor terminal and a second capacitor terminal; and a common cover terminal, mounted to the cover assembly generally at the center of the cover assembly, having a contact extending from the cover,', 'at least two capacitor cover terminals mounted to the cover assembly, each of the at least two capacitor cover terminals having at least one contact extending from the cover and configured to provide an electrical connection to at least one capacitor provided by one of the plurality of capacitive elements,', 'a first conductor capable of electrically connecting the first capacitor terminal of a capacitor provided by one of the plurality of capacitive elements to one of the at least two capacitor cover terminals and a second conductor capable of electrically connecting the second capacitor terminal of a capacitor provided by one of the plurality of capacitive elements to the common cover terminal, and', 'a cover insulation barrier mounted to the cover assembly, including an insulation structure substantially surrounding the common cover terminal and an insulation structure substantially surrounding each of the at least two capacitor cover terminals, wherein each of the insulator structures substantially surrounding each of the at least two capacitor cover ...

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Номер записи: 77

26-12-2013 дата публикации

RESERVE POWER SUPPLY WITH ELECTRODE PLATES JOINED TO AUXILIARY CONDUCTORS

Номер: US20130344419A1

Автор: YANG Tai-Her

Принадлежит:

The present invention relates to one or more electrode plates, which are installed with current collecting terminals at two or more sides thereof, and joined to an auxiliary conductor made of a material having a conductivity that is higher than that of the electrode plates. Current collecting terminals are installed at two or more sides of the auxiliary conductor, for linking with current collecting terminals installed at two or more sides of the electrode plates, and at least one of linked terminals is used as a general current collecting terminal to output current to an external part or to receive input current from the external part. Finally, insulators installed between the auxiliary conductor and the electrode plates to constitute an electrode unit. 1. A winding type electrode unit for a reserve power supply , comprising:{'b': 1011', '1011', '120, 'at least two anode side electrode plates (), said at least two anode side electrode plates () each having an anode active surface on which is coated an anode active substance (); and'}{'b': 1001', '1011', '1011, 'at least one anode side auxiliary conductor () sandwiched between said at least two anode side electrode plates () and having a conductivity higher than a conductivity of the at least two anode side electrode plates ();'}{'b': 1012', '1012', '120, 'at least two cathode side electrode plates (), said at least two cathode side electrode plates () each having a cathode active surface on which is coated a cathode active substance (); and'}{'b': 1002', '1012, 'at least one cathode side auxiliary conductor () sandwiched between the at least two cathode side electrode plates having a conductivity higher than a conductivity of the at least two cathode side electrode plates (); and'}{'b': 1020', '1011', '1012, 'a first insulator () sandwiched between a first one of said at least two anode side electrode plates () and a first one of said at least two cathode side electrode plates (); and'}{'b': 1020', '1011', '1012, ' ...

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Номер записи: 78

02-01-2014 дата публикации

METHODS OF MANUFACTURING AN IMPLANTABLE PULSE GENERATOR

Номер: US20140000107A1

Автор: Imani Reza, RUNDLE Nicholas A.

Принадлежит: PACESETTER, INC.

Disclosed herein is an implantable pulse generator feedthru configured to make generally planar electrical contact with an electrical component housed within a can of an implantable pulse generator. The feedthru may include a feedthru housing including a header side and a can side, a core within the feedthru housing, a generally planar electrically conductive interface adjacent the can side, and a feedthru wire extending through the core. The feedthru wire may include an interface end and a header end, wherein the header end extends from the header side and the interface end is at least one of generally flush with the generally planar interface and generally recessed relative to the generally planar interface. 1. A method of manufacturing an implantable pulse generator , the method comprising:providing a header and a can;extending a feedthru between the header and the can, the feedthru having a header side, a can side, and a feedthru wire, the can side having a first generally planar electrically conductive interface, the feedthru wire having a header end and a can end, and the feedthru wire extending through the feedthru from the first interface to project from the header side into the header;disposing an electrical component inside the can, the electrical component having a side abutted and attached to the can side such that the side of the electrical component covers the can end of the feedthru wire, and the side of the electrical component having a second generally planar electrically conductive interface; andplacing the interfaces in physical contact with each other.2. The method of claim 1 , wherein the interfaces are placed in physical contact via a pick-and-place process.3. The method of claim 1 , wherein the electrical component comprises at least one of a hybrid claim 1 , output flex and printed circuit board.4. The method of claim 3 , wherein the first generally planar electrically conductive interface comprises a power electrical trace and a ground ...

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Номер записи: 79

09-01-2014 дата публикации

METALLIZED FILM CAPACITOR AND CASE MOLD TYPE CAPACITOR INCLUDING SAME

Номер: US20140009865A1

Автор: Fujii Hiroshi, Kubota Hiroshi, OHCHI Yukikazu, Shimasaki Yukihiro, TAKEOKA Hiroki

Принадлежит: Panasonic Corporation

A metallized film capacitor includes a dielectric film and two metal vapor-deposition electrodes facing each other across the dielectric film. At least one of the metal vapor-deposition electrodes is made of substantially only aluminum and magnesium. This metallized film capacitor has superior leak current characteristics and moisture resistant performances, and can be used for forming a case mold type capacitor with a small size. 2. The metalized film capacitor according to claim 1 , whereinthe first metal vapor-deposition layer of the first metal vapor-deposition electrode mainly contains aluminum, andthe second metal vapor-deposition layer of the first metal vapor-deposition electrode contains magnesium.3. The metalized film capacitor according to claim 1 , whereinthe first electrode is provided on an end of the dielectric film,the low resistance portion is connected to the first electrode at the end of the dielectric film.4. The metalized film capacitor according to claim 1 , wherein the lower surface of the second metal vapor-deposition layer of the first metal vapor-deposition electrode is situated on the upper surface of the first metal vapor-deposition layer and extends onto an upper surface of the low resistance portion.5. The metalized film capacitor according to claim 4 , whereinthe first metal vapor-deposition layer of the first metal vapor-deposition electrode mainly contains aluminum, andthe second metal vapor-deposition layer of the first metal vapor-deposition electrode contains magnesium. This application is a continuation of U.S. patent application Ser. No. 13/505,303, filed May 1, 2012, which is a U.S. National Phase Application of PCT International Application PCT/JP2010/006391, which is incorporated herein by reference.The invention relates to a metallized film capacitor that is used for various electronic devices, electric equipment, industrial equipment, and automobiles, and especially, suitable for smoothing, filtering or snubbering a motor ...

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Номер записи: 80

09-01-2014 дата публикации

CAPACITOR, STRUCTURE AND METHOD OF FORMING CAPACITOR

Номер: US20140009866A1

Автор: MASUDA Hidetoshi, MASUNO Shinya, TAKE Yoshinari

Принадлежит:

There is provided a capacitor including a dielectric layer having a first plane, a second plane opposite to the first plane, and a plurality of through-holes communicated with the first plane and the second plane; a first external conductor layer disposed on a part of the first plane; a second external conductor layer disposed on the second plane; a third external conductor layer disposed on another part of the first plane; a first internal conductor housed in a part of a plurality of the through-holes and connected to the first external conductor layer; a second internal conductor housed in another part of a plurality of the through-holes and connected to the second external conductor layer; and a third internal conductor housed in the other part of a plurality of the through-holes and connected to the second external conductor layer and the third external conductor layer. 1. A capacitor , comprising:a dielectric layer having a first plane, a second plane opposite to the first plane, and a plurality of through-holes communicated with the first plane and the second plane;a first external conductor layer disposed on a part of the first plane;a second external conductor layer disposed on the second plane;a third external conductor layer disposed on another part of the first plane;a first internal conductor housed in a part of a plurality of the through-holes and connected to the first external conductor layer;a second internal conductor housed in another part of a plurality of the through-holes and connected to the second external conductor layer; anda third internal conductor housed in the other part of a plurality of the through-holes and connected to the second external conductor layer and the third external conductor layer.2. The capacitor according to claim 1 , further comprising:a first protective layer coating the first external conductor layer and the third external conductor layer;a second protective layer coating the second external conductor layer;a first ...

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Номер записи: 81

23-01-2014 дата публикации

Capacitor and multilayer circuit board using same

Номер: US20140020943A1

Автор: Hsiao-Yun Su, Ying-Tso Lai

Принадлежит: Hon Hai Precision Industry Co Ltd

A capacitor includes a first patterned conductive layer, a second patterned conductive layer and a patterned dielectric layer. The first patterned conductive layer is interlaced with the second patterned conductive layer in one plane so as to present, within the smallest overall volume, the greatest surface area of one conductive layer in the closest proximity to the parts of the second conductive layer. The patterned dielectric layer is within a same plane as the first and second patterned conductive layers and in fills all gaps between the first and second patterned conductive layers to form a capacitor between the first and second conductive layers. The first and second patterned conductive layer and the patterned dielectric layer are stacked within and contained by a multilayer circuit board.

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Номер записи: 82

23-01-2014 дата публикации

METALLIZED FILM AND METALLIZED FILM CAPACITOR USING SAME

Номер: US20140022697A1

Автор: OHCHI Yukikazu

Принадлежит: Panasonic Corporation

A metallized film composed of a dielectric film, a metal thin film layer and a dielectric layer, the metal thin film layer being formed on at least one surface of the dielectric film, the dielectric layer being formed on the metal thin film layer, and the dielectric layer being composed of acrylic acid ester resin as a main component being composed of dimethylol tricyclodecane diacrylate and monoacrylate containing a heterocycle 1. A metallized film comprising:a dielectric film;a metal thin film layer formed on at least one surface of the dielectric film; anda dielectric layer formed on the metal thin film layer,wherein the dielectric layer is chiefly made of acrylic acid ester resin that includes dimethylol tricyclodecane diacrylate and monoacrylate containing a heterocycle.2. The metallized film according to claim 1 ,wherein the monoacrylate containing a heterocycle is tetrahydrofurfuryl acrylate.3. The metallized film according to claim 2 ,wherein a weight ratio of the dimethylol tricyclodecane diacrylate to a sum of the dimethylol tricyclodecane diacrylate and the tetrahydrofurfuryl acrylate contained in the acrylic acid ester resin is within a range of at least 0.7 and at most 0.9, inclusive.4. The metallized film according to claim 1 ,wherein the dielectric film is made of one of polypropylene resin, polyethylene terephthalate resin, polyethylene naphthalate resin and polyphenylene sulfide.5. A metallized film capacitor claim 1 ,{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'wherein the metallized film as defined in further includes a metal layer formed on an opposite surface of the dielectric film to the surface whereon the metal thin film layer is formed,'}the metalized film capacitor comprising:a wound body formed by winding the metallized film; andmetallikon electrodes formed on both end faces, undergone metal spray, of the wound body in an axial direction of the winding, respectively.6. The metallized film capacitor according to claim 5 ,wherein a ...

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Номер записи: 83

30-01-2014 дата публикации

ELECTRONIC COMPONENT

Номер: US20140029158A1

Автор: Inoue Noriyuki, NAKANO Makito, NISHIHARA Mayuko, Shimizu Masayoshi

Принадлежит: MURATA MANUFACTURING CO., LTD.

In an electronic component, capacitor conductors include linear portions parallel or substantially parallel to a lower surface of a laminate, and lead-out portions led out respectively from the linear portions to the lower surface. Outer electrodes are disposed on the lower surface and cover exposed portions where the lead-out portions are exposed at the lower surface, respectively. At least one of the linear portions includes a groove, which is recessed in a direction away from the lower surface, in a region thereof overlapping with the corresponding outer electrode when looking at the electronic component in a plan view from a z-axis direction. 1. (canceled)2. An electronic component comprising:a laminate including a plurality of stacked dielectric layers and a mounting surface defined by continuously-arranged outer edges of the plurality of dielectric layers;a first capacitor conductor and a second capacitor conductor stacked together with the dielectric layers in opposed relation to each other, the first capacitor conductor and the second capacitor conductor respectively including a first linear portion and a second linear portion extending along outer edges thereof and parallel or substantially parallel to the mounting surface, the first capacitor conductor and the second capacitor conductor further respectively including a first lead-out portion and a second lead-out portion led out to the mounting surface from the first linear portion and the second linear portion; anda first outer electrode and a second outer electrode disposed on the mounting surface and not disposed on end surfaces of the laminate, which are adjacent to the mounting surface and which are each defined by continuously-arranged outer edges of the plurality of dielectric layers, the first outer electrode and the second outer electrode covering respective portions where the first lead-out portion and the second lead-out portion are exposed at the mounting surface; whereinthe first linear ...

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Номер записи: 84

30-01-2014 дата публикации

LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

Номер: US20140029159A1

Автор: SAWADA Takashi, SHIMADA Yasuyuki

Принадлежит:

In a laminated ceramic electronic component, a side-surface outer electrode includes a first electrode portion including side-surface electrode portions located on first and second side surfaces and wrap-around electrode portions arranged to extend around from the side-surface electrode portions of the first electrode portion to portions of third and fourth side surfaces; and a second electrode portion including side-surface electrode portions located on the third and fourth side surfaces and wrap-around electrode portions arranged to extend around from the side-surface electrode portions of the second electrode portion to portions of the first and second side surfaces. The wrap-around electrode portions of the second electrode portion reach regions covering portions of outermost inner electrodes located at an outermost side portion among inner electrodes, which portions are exposed in the first and second side surfaces. 110-. (canceled)11. A laminated ceramic electronic component comprising:a ceramic element assembly including a plurality of laminated ceramic layers and including first and second end surfaces opposed to each other, first and second side surfaces which connect the first and second end surfaces and are opposed to each other, and third and fourth side surfaces which connect the first and second end surfaces and are opposed to each other;a plurality of inner electrodes provided within the ceramic element assembly and extended to the first and second side surfaces; anda strip-shaped side-surface outer electrode located on the first, second, third and fourth side surfaces of the ceramic element assembly so as to extend around the ceramic element assembly and connected to the inner electrodes extended to the first and second side surfaces; whereinthe side-surface outer electrode extending around the ceramic element assembly includes a first electrode portion including side-surface electrode portions located on the first and second side surfaces of the ...

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Номер записи: 85

06-02-2014 дата публикации

METALIZED FILM CAPACITOR

Номер: US20140036405A1

Автор: Fujii Hiroshi, Hiraki Yasuhiro, Kamiura Ryosuke, Kubota Hiroshi, Majima Ryo, OHCHI Yukikazu, Shimasaki Yukihiro, TAKEOKA Hiroki

Принадлежит: Panasonic Corporation

A metalized film capacitor includes metalized films, each of which is formed of an insulating film made of dielectric, and a vapor deposited metal electrode formed on an upper surface of the insulating film. An end of the vapor deposited metal electrode extends together with an end of the insulating film, and both the ends are connected to an electrode terminal. The vapor deposited metal electrode of the metalized film includes a center region and a low resistance section that is made of Al—Zn—Mg alloy. The low resistance section is disposed at an end of the electrode and is thicker than the center region. This metalized film capacitor has high humidity resistance. 1. A metalized film capacitor comprising:a metalized film including an insulating film made of dielectric material, a first electrode that is a vapor deposited metal electrode disposed on an upper surface of the insulating film;a second electrode disposed on a lower surface of the insulating film, the second electrode facing the first electrode across the insulating film;a first electrode terminal connected to the first electrode; anda second electrode terminal connected to the second electrode,wherein an end of the first electrode and an end of the insulating film extends to be connected to the first electrode terminal, and a center region away from the end of the first electrode and faces the second electrode across the insulating film; and', 'a low resistance section made of Al—Zn—Mg alloy disposed at the end of the first electrode, the low resistance section being thicker than the center region., 'wherein the first electrode includes2. The metalized film capacitor according to claim 1 , wherein the low resistance section contains Mg claim 1 , and a peak of an atomic percentage of the Mg is located within a range not greater than 5 nm from a surface of the low resistance section.3. The metalized film capacitor according to claim 1 ,wherein the center region of the first electrode is made of Al—Mg alloy ...

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Номер записи: 86

06-02-2014 дата публикации

EMI Filtered Co-Connected Hermetic Feedthrough, Feedthrough Capacitor and Leadwire Assembly for an Active Implantable Medical Device

Номер: US20140036409A1

Автор: Brendel Richard L., Frustaci Dominick J., Frysz Christine A., Marzano Thomas, Seitz Keith W., Stevenson Robert A., Tang Xiaohong, Thiebolt William C., Winn Steven W., Woods Jason

Принадлежит: Greatbatch Ltd.

A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire. 1. A co-connected hermetic feedthrough , feedthrough capacitor , and leadwire assembly , comprising:a dielectric substrate;a via hole disposed through the dielectric substrate from a body fluid side to a device side;a conductive fill disposed within the via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side;a feedthrough capacitor attached to the dielectric substrate, the feedthrough capacitor comprising a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed on an outside of the feedthrough capacitor, and a set of capacitor ground electrode plates electrically coupled to the outer metallization;a conductive leadwire disposed within the unfilled capacitor via hole; andan electrical joint connecting the conductive fill, the capacitor inner metallization along with the ...

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Номер записи: 87

06-02-2014 дата публикации

MULTI-LEVEL THIN FILM CAPACITOR ON A CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Номер: US20140037835A1

Автор: Cervin Andrew Vladimir Claude, KOUTSAROFF Ivoyl P., Patel Atin J., Vandermeulen Mark

Принадлежит: BlackBerry Limited

In accordance with the teachings described herein, a multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same are provided. The multi-level thin film capacitor (MLC) may include at least one high permittivity dielectric layer between at least two electrode layers, the electrode layers being formed from a conductive thin film material. A buffer layer may be included between the ceramic substrate and the thin film MLC. The buffer layer may have a smooth surface with a surface roughness (Ra) less than or equal to 0.08 micrometers (um). 1. A method , comprising:smoothing a surface of a dielectric buffer layer;forming multiple layers of a thin film multi-level capacitor over the dielectric buffer layer, the forming of the multiple layers including providing high permittivity dielectric layers interleaved between electrode layers to form multiple capacitors stacked on each other, wherein pairs of the multiple capacitors share a common electrode therebetween, and wherein a bottom electrode of a bottom capacitor of the multiple capacitors is formed directly on the dielectric buffer layer;annealing each capacitor layer before forming a successive capacitor layer;forming a high density interconnect layer, wherein the dielectric buffer layer provides electrical isolation between the high density interconnect layer and the thin film multi-level capacitor; andforming a contact via through the dielectric buffer layer and the high density interconnect layer to provide electrical contact for the thin film multi-level capacitor.2. The method of claim 1 , wherein the smoothing of the surface is to a surface roughness (Ra) of less than or equal to 0.08 microns and substantially free of surface micropores.3. The method of claim 1 , comprising performing a heat treatment after each electrode layer of the multi-level capacitor is formed claim 1 , wherein the multiple capacitors are formed in a mesa structure.4. The method of claim 1 , comprising ...

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Номер записи: 88

13-02-2014 дата публикации

LAMINATED CAPACITOR

Номер: US20140043719A1

Автор: TOGASHI Masaaki

Принадлежит: TDK Corporation

Provided is a laminated capacitor that achieves low impedance in a wide band. The laminated capacitor includes an element assembly , terminal electrodes , internal electrodes that are connected to the terminal electrodes , and an internal electrode that is not connected to the terminal electrodes . In the laminated capacitor , an interval between each of the first electrode parts of the first and second terminal electrodes and the internal electrode is smaller than an interval between the internal electrode and the internal electrode or the internal electrode located adjacent to the internal electrode 1. A laminated capacitor comprising:an element assembly having a pair of first and second end surfaces opposed to each other, a pair of first and second main surfaces extending so as to connect between a pair of the first and second end surfaces and opposed to each other, and a pair of first and second side surfaces extending so as to connect a pair of the first and second main surfaces and opposed to each other;first and second terminal electrodes disposed on both end portions of the element assembly, and each having a first electrode part located on at least the first main surface;first and second internal electrodes that are connected to corresponding terminal electrodes out of the first and second terminal electrodes, and disposed in the element assembly so as to be opposed to each other in a first direction in which the first main surface and the second main surface are opposed; anda third internal electrode that is disposed in the element assembly so as to be located, adjacent to the first main surface, outside in the first direction further than the first and second internal electrodes and be opposed to each of the first electrode parts of the first and second terminal electrodes, and not connected to the first and second terminal electrodes, whereina first capacitance unit composed of the first internal electrode and the second internal electrode, a second ...

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Номер записи: 89

13-02-2014 дата публикации

Multilayer ceramic electronic component and method of manufacturing the same

Номер: US20140043721A1

Автор: Eung Soo Kim, Jae Yeol Choi, Jong Han Kim, Seung Ho Lee

Принадлежит: Samsung Electro Mechanics Co Ltd

There are provided a multilayer ceramic electronic component and a method of manufacturing the same, the multilayer ceramic electronic component, including: a ceramic body including a plurality of dielectric layers laminated therein, each dielectric layer having an average thickness of 0.65 μM or less; internal electrodes disposed to face each other while having each dielectric layer interposed therebetween in the ceramic body; and external electrodes electrically connected to the internal electrodes, wherein, when td denotes the average thickness of each of the dielectric layers and te denotes an average thickness of each of the internal electrodes, te/td≦0.77 is satisfied.

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Номер записи: 90

13-02-2014 дата публикации

Implantable Medical Devices and Related Connector Enclosure Assemblies Utilizing Conductors Electrically Coupled to Feedthrough Pins

Номер: US20140043739A1

Автор: Michael J. Baade, Rajesh V. Iyer, Steven T. Deininger

Принадлежит: MEDTRONIC INC

Implantable medical devices include connector enclosure assemblies that utilize conductors electrically coupled to feedthrough pins that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.

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Номер записи: 91

13-02-2014 дата публикации

ELECTRONIC CIRCUIT AND POSITION INDICATOR

Номер: US20140043777A1

Автор: Fujitsuka Hiroyuki, Fukushima Yasuyuki

Принадлежит:

Disclosed herein is a position indicator that includes: an enclosure forming a hollow and rod-shaped tubular body; a substrate disposed in the hollow portion of the enclosure and having a circuit configured to process signals exchanged with a position detection sensor; and a film-shaped capacitor having first and second conductor layers. The first conductor layer is formed on one side of a sheet-shaped dielectric, and the second conductor layer is formed on another side of the sheet-shaped dielectric and is opposed to the first conductor layer with the sheet-shaped dielectric provided therebetween. The film-shaped capacitor is fastened to the substrate in such a manner as to make up part of said circuit, and the size of an area over which the first and second conductor layers of the film-shaped capacitor are opposed is changeable by changing the size of the film-shaped capacitor to specify a constant for said circuit. 1. A position indicator comprising:an enclosure forming a hollow and rod-shaped tubular body;a substrate disposed in the hollow portion of the enclosure and having a circuit configured to process signals exchanged with a position detection sensor; anda film-shaped capacitor having first and second conductor layers, the first conductor layer being formed on one side of a sheet-shaped dielectric, the second conductor layer being formed on another side of the sheet-shaped dielectric and being opposed to the first conductor layer with the sheet-shaped dielectric provided therebetween, whereinthe film-shaped capacitor is fastened to the substrate in such a manner as to make up part of said circuit, and the size of an area over which the first and second conductor layers of the film-shaped capacitor are opposed to each other is changeable by changing the size of the film-shaped capacitor so as to specify a constant of said circuit disposed on the substrate.2. The position indicator of claim 1 , whereinthe circuit includes a resonance circuit made up of an ...

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Номер записи: 92

06-03-2014 дата публикации

Anchor group for monolayers of organic compounds on metal and component produced therewith by means of organic electronics

Номер: US20140060900A1

Автор: Dan Taroata, Guenter Schmid

Принадлежит: SIEMENS AG

An anchor group anchors organic dielectric compounds used in the production of organically based capacitors. The capacitors referred to are those that can be produced in a parallel process on a prepeg or other common printed circuit board substrate without additional metallisation on copper. The pre-fabricated capacitor layer can then be built into the printed circuit board, thereby gaining on space and cost for the surface of the printed circuit board.

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Номер записи: 93

06-03-2014 дата публикации

Multilayer ceramic electronic component and method of manufacturing the same

Номер: US20140063685A1

Автор: Ro Woon Lee, Ye Jun PARK, Yoon Hee Lee

Принадлежит: Samsung Electro Mechanics Co Ltd

There is provided a multilayer ceramic electronic component, including: a ceramic body including dielectric layers; first and second internal electrodes disposed to face each other within the ceramic body with the dielectric layer interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the ceramic body includes a capacitance forming part contributing to capacitance formation and a non-capacitance forming part provided on at least one of upper and lower surfaces of the capacitance forming part, and when the capacitance forming part is divided into three areas in a thickness direction of the ceramic body, a difference in continuity between internal electrodes in a middle area of the three areas and internal electrodes in upper and lower areas thereof is 1% to 5%.

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Номер записи: 94

06-03-2014 дата публикации

DIELECTRIC MATERIAL TO ENHANCE CAPACITANCE OF A CAPACITOR

Номер: US20140063689A1

Автор: BLAIR CHRISTOPHER LORNE

Принадлежит:

A dielectric material suitable for use between electrodes of a capacitor includes dipole-impregnated fullerenes able to increase a dielectric constant of the dielectric material in order to enhance the energy storage capacity of the capacitor is provided. The dielectric material includes buckminsterfullerenes each having a dipole molecule impregnated within the buckminsterfullerene, the dipole molecules within the buckminsterfullerenes able to rotate and align with forces of an electric field when in the presence of the electric field so that, when in use between the electrodes of the capacitor, they counteract the electric field between the electrodes and increase the energy storage capacity of the capacitor. 1. A dielectric material suitable for use between electrodes of a capacitor , the material comprising impregnated fullerenes configured to increase a dielectric constant of the dielectric material in order to enhance the energy storage capacity of the capacitor , the dielectric material comprising a plurality of buckminsterfullerenes each comprising a dipole molecule impregnated within the buckminsterfullerenes , the buckminsterfullerenes configured to restrict the translational movement of the dipole impregnated buckminsterfullerenes and their interaction with other neighboring atoms or molecules , the dipole molecules within the buckminsterfullerenes being configured to rotate and align with forces of an electric field when in the presence of the electric field so that , when in use between the electrodes of the capacitor , they counteract the electric field between the electrodes and increase the energy storage capacity of the capacitor.2. A capacitor comprising a cathode and an anode claim 1 , the capacitor further comprising the dielectric material of .3. The dielectric material of claim 1 , wherein the dipole molecule comprises NaCl or KCl.4. The dielectric material of claim 1 , wherein the plurality of impregnated buckminsterfullerenes are suspended in ...

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Номер записи: 95

13-03-2014 дата публикации

Capacitors in Integrated Circuits and Methods of Fabrication Thereof

Номер: US20140071587A1

Автор: Chae Moosung, Kim Sun-Oo, Moon Bum Ki

Принадлежит: INFINEON TECHNOLOGIES AG

In one embodiment, a capacitor includes a first via level having first metal bars and first vias, such that the first metal bars are coupled to a first potential node. The first metal bars are longer than the first vias. Second metal bars and second vias are disposed in a second via level, the second metal bars are coupled to the first potential node. The second metal bars are longer than the second vias. The second via level is above the first via level and the first metal bars are parallel to the second metal bars. Each of the first metal bars has a first end, an opposite second end, and a middle portion between the first and the second ends. Each of the middle portions of the first metal bars and the second ends of the first metal bars do not contact any metal line. 1. A method of fabricating a semiconductor device , the method comprising:depositing a first insulating layer over a workpiece;forming first metal bars in the first insulating layer over a first region of the workpiece;forming a second insulating layer over the first insulating layer;forming metal lines over a second region of the workpiece and not directly over the first metal bars;forming a third insulating layer over the second insulating layer; andforming second metal bars in the third insulating layer over the first region of the workpiece.2. The method of claim 1 , wherein the first metal bars are parallel to the second metal bars claim 1 , wherein each of the first metal bars has a first end claim 1 , an opposite second end claim 1 , and a middle portion between the first and the second ends claim 1 , and wherein each of the middle portions of the first metal bars and the second ends of the first metal bars do not contact any metal line.3. The method of claim 2 , wherein each of the second metal bars has a first end claim 2 , an opposite second end claim 2 , and a middle portion between the first and the second ends claim 2 , wherein each of the middle portions of the second metal bars and the ...

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Номер записи: 96

20-03-2014 дата публикации

LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR

Номер: US20140078641A1

Автор: Hiramatsu Takashi, Hirata Yosuke, OMORI Nagato, SAITO Yoshito, Tsuji Hideaki, Wada Hiroyuki

Принадлежит: MURATA MANUFACTURING CO., LTD.

A laminated body is divided into a large grain region and a small grain region. The large grain region is located outside the small grain region, and a boundary surface between the regions is located inside the outer surface of the laminated body while surrounding a section in which internal electrodes are present in the laminated body. To obtain the laminated body, firing is carried out with a profile in which the average rate of increase from room to the maximum temperature is 40° C./second or more. 1. A laminated ceramic electronic component comprising:a laminated body including a plurality of stacked ceramic layers and internal electrodes formed along specific interfaces between the ceramic layers; andan external electrode on an outer surface of the laminated body electrically connected to specific ones of the internal electrodes,wherein the laminated body is divided into a large grain region in which a ceramic constituting the ceramic layers has a relatively large grain diameter and a small grain region in which the ceramic has a relatively small grain diameter, the large grain region is located outside the small grain region, and a boundary surface between the large grain region and the small grain region is located inside the outer surface of the laminated body while surrounding a section in which internal electrodes are present in the laminated body.2. The laminated ceramic electronic component according to claim 1 , wherein the internal electrodes comprise a base metal.3. A laminated ceramic electronic component according to whereinthe laminated body has a rectangular parallelepiped shape including a LW surface defined by a length-direction dimension L and a width-direction dimension W of the laminated body, a LT surface defined by the length-direction dimension L and a thickness-direction dimension T of the laminated body, and a WT surface defined by the width-direction dimension W and the thickness-direction dimension T of the laminated body,the external ...

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Номер записи: 97

27-03-2014 дата публикации

Multi-Level Circuit Board for High-Frequency Applications

Номер: US20140083756A1

Автор: Moeller Ulrich, Schaefer Maik

Принадлежит: Conti Temic Microelectronic GmbH

The invention relates to a multi-level circuit board for high-frequency applications with at least one first carrier substrate (PCB1) made of a first material suitable for high frequencies and with at least one second carrier substrate (PCB2,3) made of a second material, which second material has higher dielectric losses than the first material. 1. A multi-level circuit board for high-frequency applicationswith at least one first carrier substrate (PCB1) made of a first material suitable for high frequencies, andwith at least one second carrier substrate (PCB2,3) made of a second material, which second material has higher dielectric losses than the first material,{'b': 1', '1', '2', '2, 'as well as with at least one signal line structure (S, C) provided on the first carrier substrate (PCB1) and with at least one ground layer (M) connected to electric ground potential, said at least one ground layer (M) being provided on a side of at least one second carrier substrate (PCB2, PCB3),'}{'b': 2', '4', '3', '2', '4', '3', '1', '1', '3, 'as well as with electrical vias (V) extending through the carrier substrates (PCB1,2,3), characterized in that a capacitance for removing high-frequency power to ground potential is formed through the at least one second carrier substrate (PCB2, PCB3) toward the ground layer (M, M) in that a metallization surface (C) having a size corresponding to the desired capacitance is formed on that side of the second carrier substrate (PCB2,4) which is opposite the ground layer (M, M) and the metallization surface (C) is connected to the signal line structure (C) by means of a via (V(C-C)).'}2. The multi-level circuit board according to claim 1 , characterized in thata first ground layer is provided between the first carrier substrate (PCB1) and the second carrier substrate (PCB2) s and a third carrier substrate (PCB3), which is also made of the second material, is arranged at the second carrier substrate (PCB2),{'b': '3', 'wherein the metallization ...

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Номер записи: 98

27-03-2014 дата публикации

Feedthrough assembly for an implantable device

Номер: US20140083762A1

Автор: Derek John Boettger, Patrick J. Barry

Принадлежит: Cardiac Pacemakers Inc

A feedthrough assembly includes a metallic ferrule, an insulator mounted within the ferrule, a plurality of feedthrough wires mounted within and extending through the insulator, and a ground wire directly attached to the ferrule, wherein the ground wire does not pass through or alongside the insulator.

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Номер записи: 99

27-03-2014 дата публикации

CONDUCTIVE COATINGS FOR CAPACITORS AND CAPACITORS EMPLOYING THE SAME

Номер: US20140084218A1

Автор: Chen Changjing, WANG MINGHAI

Принадлежит:

The present invention provides a novel conductive coating for capacitors, and a capacitor employing the conductive coating. The conductive coating of the present invention includes two types of coatings, i.e. thermosetting conductive coatings and thermoplastic conductive coatings. The thermosetting conductive coating of the present invention includes an epoxy resin, a curing agent for the epoxy resin, nonmetallic silver-plated particles and a solvent. The thermoplastic conductive coating of the present invention includes a thermoplastic resin, nonmetallic silver-plated particles and a solvent; wherein the thermoplastic resin is a fluorine rubber. 1. A conductive coating for capacitors , comprising:5 to 30 wt % of an epoxy resin;0.5 to 5 wt % of a curing agent for the epoxy resin;20 to 50 wt % of nonmetallic silver-plated particles; and40 to 70 wt % of a solvent.2. The conductive coating according to claim 1 , wherein the epoxy resin is a biphenol based epoxy resin or novolac based epoxy resin.3. The conductive coating according to claim 2 , wherein the epoxy resin is a biphenol A based epoxy resin.4. The conductive coating according to claim 1 , wherein the curing agent is an amine based curing agent or an imidazole based curing agent.5. The conductive coating according to claim 4 , wherein the curing agent is triethanolamine.6. The conductive coating according to claim 1 , wherein the nonmetallic silver-plated particles satisfy at least one of the following conditions:{'sup': '3', 'a density is 3 to 5 g/cm,'}an average particles size is 5 to 100 μm, andan amount of plated silver of 20 to 60 wt %, based on the total amount of the nonmetallic silver-plated particles.7. The conductive coating according to claim 1 , wherein the nonmetallic material of the nonmetallic silver-plated particles is one or more selected from glass claim 1 , boron nitride claim 1 , calcium carbonate claim 1 , carbon black claim 1 , carbon fiber claim 1 , alumina and polymer materials.8. The ...

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Номер записи: 100