МНОГОРЕЖИМНЫЙ НОСИМЫЙ БЕСПРОВОДНОЙ МИКРОФОН

Изобретение относится к акустике, в частности к микрофонам. Устройство содежит микрофон, многопозиционный переключатель, схему обнаружения касания пользовательского интерфейса с неграфическим отображением информации, светодиодный индикатор, USB порт, процессор, внешнюю и внутреннюю память, Wi-Fi передатчик, батарею. Пользователь узла микрофона управляет работой узла микрофона. Например, пользователь может коснуться схемы обнаружения касания пользовательского интерфейса, а различные последовательности касания могут соответствовать различным режимам работы узла микрофона. Голосовая запись передается через схему беспроводной связи к первому пункту назначения сети, когда имеет место первая последовательность касания. Голосовая запись передается через схему беспроводной связи ко второму пункту назначения сети, отличному от первого пункта назначения сети, когда вторая последовательность касания, соответствующая второму режиму работы, обнаруживается посредством схемы обнаружения касания пользовательского ...

АКУСТИЧЕСКИЙ ВЫНОСНОЙ БЛОК ГРОМКОГОВОРЯЩЕГО РАДИОСВЯЗНОГО УСТРОЙСТВА

... 1. Акустический выносной блок громкоговорящего радиосвязного устройства, содержащий корпус с акустическим входом и выходом, в упомянутом корпусе установлены микрофон, громкоговоритель и коммутирующее устройство, отличающийся тем, что упомянутые микрофон и громкоговоритель выполнены электродинамическими катушечными.2. Акустический выносной блок громкоговорящего радиосвязного устройства по п. 1, отличающийся тем, что упомянутые микрофон и громкоговоритель выполнены в виде единой магнитной цепи, имеющей на своих торцах кольцевые магнитные воздушные зазоры, в которых расположены катушки подвижных систем микрофона и громкоговорителя.3. Акустический выносной блок громкоговорящего радиосвязного устройства по п. 1, отличающийся тем, что упомянутые микрофон и громкоговоритель в режиме передачи подключены последовательно к входу радиосвязного устройства посредством упомянутого коммутационного устройства.4. Акустический выносной блок громкоговорящего радиосвязного устройства по п. 1, отличающийся ...

Микрофон

Полезная модель относится к микрофону, который обладает повышенной зоной обхвата звука без потери чёткости и чистоты звучания. Микрофон, имеющий корпус, основание корпуса выполнено в виде треугольной пирамиды, на каждой боковой стороне при вершине пирамиды выполнены области перфорации, микрофонные головки расположены за областями перфорации, при этом микрофоны размещены под углом 120 градусов с каждой стороны пирамиды. Полезная модель обеспечивает увеличение площади захвата звука в локации на 25%, в сравнении с размещение микрофона в ровной плоскости. 4 ил.

ПЬЕЗОЭЛЕКТРИЧЕСКИЙ ПРЕОБРАЗОВАТЕЛЬ

Использование: в электроакустике. Сущность изобретения: пьезоэлектрический преобразователь содержит корпус, диафрагму в виде металлической пластины с пьезоэлементом, закрепленным в центральной части, эластичный кольцевой элемент, стаканообразное донное основание, два электрических контактных элемента в виде гвоздей, выполненных в стенках донного основания сквозных отверстий и выходящих наружу преобразователя. Диафрагма установлена между открытым торцом донного основания и эластичным кольцевым элементом, контактирующим с перфорированной стенкой корпуса. Шляпки электрических контактных элементов с одной стороны контактируют с открытым торцом донного основания и соответственно с металлической пластиной и электродом пьезокерамического элемента, на его периферийном участке с другой стороны. 3 з.п. ф-лы, 3 ил.

Микрофонно-телефонный усилитель

Sound recording equipment with built-in microphone - has microphone housing designed as hinged section

The housing of the microphone (4) forms a hinged section (2) which is capable of swinging out from the position of rest in the plane of the housing wall (13) into the position of operation. The hinged section (2) is in operational contact with an electric switch (9) which switches on the microphone (4). A tub shaped projection (7) is formed on the part of the hinged section (2) which does not face the operating surface. The switch (9) is a known two-position depression switch and its switching plunger (8) lies against the tub-shaped projection (7) of the hinged section (2) so that it deflects the latter.

ELEKTROAKUSTISCHER WANDLER

Mikrofoneinrichtung

Mikrofoneinrichtung, mit einem Mikrofon und einer Aufzeichnungseinheit zur Aufzeichnung der von einem Mikrofonwandler des Mikrofons erzeugten Signale, wobei die Aufzeichnungseinheit und das Mikrofon über eine lösbare Steckverbindung miteinander verbunden sind und über die Steckverbindung die von dem Mikrofonwandler erzeugten Signale zur Aufzeichnungseinheit übertragen werden.

VIBRATOR

Microphone

The microphone comprises a body (6) including an electrical conductor system connected with the microphone lead leaving through the sleeve (12). The conductor system comprises a jack-plug socket (20) into which a microphone head or acoustic transducer module (4) is removably plugged by manual effort using a jack-plug (50) on the module to establish electrical connection between the module (4) and the conductor system of the body (6). A number of different heads or modules (4) each with a jack-plug can be provided so each may be mounted in turn on the body (6) as desired. ...

VIBRATOR

A vibrator for providing revolving vibration to a body to be vibrated such as a dispersion table of a vibration feeder or a sieve stack of a screening machine. In this vibrator, it is possible not only to control the amplitude of vibration but also to obtain a uniform vibration amplitude everywhere in the vibrating body inclusive of its center. A unique feature of this vibrator involves a plurality of armatures fixed to and around a vibrating member and actuated by associated electromagnets energized with multiphase a.c. power.

Electrostatic microphone

A condenser microphone includes a diaphragm, a stationary electrode and a supporting member which supports the diaphragm and the electrode in spaced parallel relationship. The supporting member is provided with an inner annular projection adapted to support the stationary electrode and an outer annular projection for supporting the diaphragm. An air chamber is defined between the inner and outer annular projections and communicated with an air gap between the diaphragm and the stationary electrode at the periphery of the air gap.

Improvements in or relating to microphones

... 553,030. Microphones. FOUNTAIN, Ltd., G. R., FOUNTAIN, G. R., SNELL, A. E. C., HOULGATE, H. J., GILBERT, E. P., and HAINES, W. J. Oct. 31, 1941, No. 14046. [Class 40 (iv)] In a differential carbon microphone having a member 5 with apertures therein to receive the carbon granules, the apertures are closed on one side by a metal disc 8 which is slightly dished so that on tightening the central fixing means 17 the disc 8 is flattened. The fixing means 17 is a double-ended screw carried by the member 5, the electrodes 7, 8 for closing the granule chambers being secured by nuts at opposite ends of the screw. The periphery of the diaphragm 13 is spaced from the apertured member 5 by spacing rings 23. The whole assembly is clamped together by rivets 24 extending from the member 5 to a metal ring 22 on the other side of the diaphragm. Specifications 507,183 and 537,524 are referred to.

Microphone

The microphone includes a handle portion 100, a control portion (200, fig 1), and a microphone head (300, fig 1). The control portion includes a first circuit board (not shown) and multiple light-emitting assemblies 220 arranged along a perimeter of the control portion. The first circuit board is electrically connected to the multiple light-emitting assemblies for controlling them to emit light in selectable preset light-emitting modes. The multiple light-emitting assemblies are arranged in the control portion, so that when in use, the colour of the light and the brightness of the light-emitting assembly can be automatically changed according to the microphone song or through a control button.

New hydrophone.

EQUIPMENT WITH SPRACHSIGNAL AND CONTROL SIGNAL INPUT DEVICE

IMPACT SOUND-COMPENSATING MICROPHONE COMBINATION

CYLINDRICAL MICROPHONE WITH A ELEKTRETANORDNUNG IN THE FINAL COVER

NOISE CONTROLLING DEVICE

PIEZOELECTRIC TRANSDUCER.

Mikrofonhalterung für Funkgeräte

Die Erfindung betrifft eine Mikrofonhalterung (1) zur Anbringung am Gehäuse (8) eines Funkgerätes, das mit einer damit verbundenen Stabantenne (9) versehen ist, wobei die Mikrofonhalterung (1) als auf dem Funkgerätegehäuse (8) aufsetzbarer Clip ausgebildet ist, der die Stabantenne (9) umschließt, und eine Aufnahmetasche (2) für das Mikrofon (10), eine Hülse (3) für die Aufnahme der Stabantenne (9) sowie eine Klammer (4) zum Festklemmen der Mikrofonhalterung (1) am Funkgerätegehäuse (8) umfasst.

Switch in a microphone housing

CONDENSER MICROPHONE

CONDENSER MICROPHONE

Piezo-electric transducer arrangement

An electrical contact free microphone attachment for a flip-type radio phone

Microphone with range switching

TOUCH BUTTON SWITCH FOR DICTATION HANDSET

... "TOUCH BUTTON SWITCH FOR DICTATION HANDSET" A handset for use in connection with a dictate station in a dictation system. The handset has a plurality of control switches which are operable to initiate control functions in the dictation recorder merely by touching the control buttons and without the need for exerting any pressure on the buttons. In this manner, a dictation recorder may be operated in the record, playback or reverse modes of operation merely by touching the control buttons on the handset. The contact made by the operator of the dictate station with the control buttons completes an electrical circuit which, as a result of the body resistance of the operator, alters the voltage levels within the electrical circuit. The altered voltages are compared with reference voltages to provide a control output when the comparison indicates that the voltage level in the electrical circuit has been altered by the interposition of the body resistance of the operator into the circuit.

MULTI-MODE, WEARABLE, WIRELESS MICROPHONE

A microphone assembly that captures audio/voice recordings and wirelessly transmits them to different desired network destinations based on an operating mode specified by the user. The microphone assembly may comprise a non-graphical-display user interface tap detection circuit, through which a user of the microphone assembly controls operation of the microphone assembly. For example, the user may tap the user interface tap detection circuit, and different tap sequences may correspond to different operating modes for the microphone assembly. The microphone assembly may also comprise a clip for clipping the microphone assembly to a garment of the user.

ULTRASONIC MICROPHONE ENCLOSURE

An apparatus includes a housing having a printed circuit board having a top surface and a bottom surface. The top surface of the printed circuit board forms an outer surface of the housing. The apparatus further includes a bottom-port microphone sensor mounted on the bottom surface of the printed circuit board. The printed circuit board has a port opening formed therein to provide an acoustic path from outside of the housing to the microphone sensor. A method of detecting ultrasonic signals includes receiving ultrasonic signals within a port opening of a printed circuit board forming part of a surface of a housing, and directing ultrasonic signals to a microphone sensor secured to a printed circuit board through the port of the printed circuit board.

MULTI-MODE, WEARABLE, WIRELESS MICROPHONE

A microphone assembly that captures audio/voice recordings and wirelessly transmits them to different desired network destinations based on an operating mode specified by the user. The microphone assembly may comprise a non-graphical-display user interface tap detection circuit, through which a user of the microphone assembly controls operation of the microphone assembly. For example, the user may tap the user interface tap detection circuit, and different tap sequences may correspond to different operating modes for the microphone assembly. The microphone assembly may also comprise a clip for clipping the microphone assembly to a garment of the user.

SWITCHING APPARATUS FOR SINGLE BUTTON HAND MICROPHONE

NOISE CANCELLATION AND NOISE REDUCTION APPARATUS

This invention relates to a method and an apparatus for reducing ambient noi se for use with a headset or a boom headset attached to a boom microphone devic e or the like. The apparatus can include a sensor microphone to detect a background noise signal (MIC 14), a desired input audio transmission (MIC 12 ), and signal processing means (16) for canceling the noise signals to create a n inverted antinoise signal within an acoustical waveguide located adjacent to the earphone of headset. The method for reducing noise according to this invention is provided by an open loop circuit allowing the input audio signa l from an operator or caller ("FROM TELEPHONE LINES") to be transmitted to the user's ear without the disturbance of unwanted ambient noise.

AN ELECTRICAL CONTACT FREE MICROPHONE ATTACHMENT FOR A FLIP-TYPE RADIO PHONE

An electrical contact free microphone attachment for a flip-type radio phone which has a flip (201), a microphone (211) mounted in said flip, a main set, an audio circuit installed in the main set, and a connecting device (202) fo r connecting the flip with the main set. The invention comprises a transformer having a primary coil (212), a secondary coil (214) and a core (213). The primary coil is arranged in the flip to connect with the microphone (211). T he secondary coil is arranged in the main set to connect with the audio circuit . The core is fixedly arranged in an axial hole formed in the connecting devic e.

Handmikrophon für Tonaufnahme- und -wiedergabegeräte

Sprechkapsel mit Transistorverstärker

Mikrophon-Schalter-Kombination für ein Magnettongerät

Elektronisches Gerät mit elektroakustischem Wandler

Handmikrofon mit Druckknopfschalter

ELEKTROAKUSTISCHE WANDLERANORDNUNG.

Multi-application radio microphone, having an extractable printed circuit

MULTI-MODE, WEARABLE, WIRELESS MICROPHONE

Voice response wall-in type device

Sound with touch operation key function

The invention relates to a sound with a touch operation key function. The existing press key type or knob type sound is not convenient and quick enough to operate. The sound comprises a shell, horns, a display mirror and a PCB (Printed Circuit Board) part, wherein a back shell of the shell is arranged to an arc-shaped trapezoid, a panel is arranged in the front middle of the back shell, the display mirror is arranged on the face of the panel, arc-shaped cloth net racks are respectively arranged on two sides in the front of the back shell, and the horns are arranged in cavity parts between the cloth net racks and the back shell; the PCB part comprises a touch PCB, a display PCB and an output PCB, the touch PCB is arranged below the back face of the panel, the display PCB is arranged at the back of the panel, and the output PCB is arranged in one cavity of the back shell; wall hanging hole baffles are arranged in the cavities of the back shell, and a rear panel is arranged at the back face ...

Mini audio amplifier

The utility model relates to a portable audio amplifier discloses a mini audio amplifier. The utility model discloses be applied to the female head of earphone and lie in the mobile terminal with one side with the female head of USB, contain: the public head of headphone plug, USB and contain the audio amplifier main part of casing, headphone plug with the public head of USB set up in same one side of casing, and respectively corresponding to the female head of earphone with the female head of USB. Compared with the prior art, the utility model discloses but lug connection is positioned mobile terminal, not only can satisfy people and play the demand to mobile terminal's big volume, and frivolous small and exquisite, portable has improved user's use and has experienced moreover.

Microphone conductive connecting plate

MICROPHONE HAVING A MUTE SWITCH, AND BREATHING MASK COMPRISING SUCH A MICROPHONE

La présente invention concerne un microphone comprenant un transducteur (20) pour transformer des oscillations acoustiques ou vibratoires en un signal électrique ; un préamplificateur (24) pour amplifier le signal électrique, et un interrupteur commandable (25) agencé électriquement entre le transducteur (20) et le préamplificateur (24), l'interrupteur (25) étant propre à être piloté par un signal de commande. En outre, la présente invention concerne un masque comprenant un tel microphone.

DEVICE OF FRUIT HARVEST BY SHAKING FOR MACHINE TO BE GATHERED THE GRAPES IN PARTICULAR

ELECTROACOUSTIC TRANSDUCERS

ELECTROMECHANICAL CASE OF MICROSYSTEM AND ITS METHOD FOR REALIZATION

Boîtier de puce MEMS (200) comprenant : une première et une seconde puce (1, 2) reliées par un premier élément de couplage pour former une première cavité entre les puces (1, 2), et une première couche de câblage périphérique en contact avec un substrat (15). Une puce comporte un élément de structure microélectromécanique (8) et un élément de cadre (9). L'autre puce comporte un circuit de commande (4) noyé dans la couche de masse coulée et qui commande l'élément.

MICROPHONE FOR SIMULTANEOUSLY MONITORING HEART PULSE AND HEART NOISE

SWITCHING APPARATUS FOR SINGLE BUTTON HAND MICROPHONE

Electret Condenser Microphone And Assembling Method Thereof

표면 장착 가능 마이크 패키지, 마이크 장치, 모바일 폰 및 마이크 신호를 녹음하기 위한 방법

... 표면 장착 가능 마이크 패키지는 제 1 마이크 및 제 2 마이크를 포함한다. 더욱이, 표면 장착 가능 마이크 패키지는 제 1 마이크를 위한 제 1 개구 및 제 2 마이크를 위한 제 2 개구를 포함한다. 제 1 개구 및 제 2 개구는 표면 장착 가능 마이크 패키지의 대향 측면 상에 배치된다.

Smart speaker system for health and life management of the elderly

APPARATUS AND A METHOD FOR TESTING A WIRELESS HEADSET MODULE, CAPABLE OF IMPROVING TEST EFFICIENCY

PURPOSE: An apparatus and a method for testing a wireless headset module are provided to minimize an idle period of a test apparatus by simultaneously performing an RF test and an audio test by replacing the wireless head set module after mounting two wireless head set module on a jig and simultaneously performing the RF test and the audio test of respective wireless head set modules. CONSTITUTION: A jig(25) receives a first wireless headset module and a second wireless headset module. An RF test apparatus(22) performs an RF test of the first wireless headset module and the second wireless headset module. An audio test apparatus(21) performs an audio test of the first wireless headset module and the second wireless headset module. A controller controls the RF test apparatus and the audio test apparatus. COPYRIGHT KIPO 2010 ...

Frequency searching system for wireless microphone

The primary objective of the present invention is to provide a frequency searching system for a wireless microphone, which comprises a microphone having an infrared receiving unit, an audio input unit, an audio signal transforming unit, a radio frequency projecting unit, a microphone function control unit, an user input interface and a displayer; and a frequency control device further having a radio frequency receiving unit, an audio frequency processing unit, an audio output unit, a main control unit, an infrared signal projecting unit, an user input unit and a displayer unit. Consequently, the present invention allows the wireless microphone to be applied between several rooms with an automatic frequency searching function, so as to economize time for setting frequency manually.

Microphone

The present invention discloses a microphone comprising a first electrode, a second electrode, a printed circuit board and a shielding layer. The microphone is configured into a mobile communication device. The shielding layer located on the printed circuit board is disposed on the microphone. When the mobile communication device is connected to an AC power supply for charging, the user in communication by the mobile communication device could avoid listening the 50~60Hz noise produced by the AC power supply owing to the shielding layer reducing EMI effect, and thereby talking quality of the mobile communication device is enormously improved.

Improvements in or relating to microphones

Mems microphone module

MEMS MICROPHONE PACKAGE

Provided is a micro electro mechanical system (MEMS) microphone package. In the MEMS microphone package, a PCB on which a MEMS microphone chip is mounted is inserted into a metal case. The metal case is directly attached to a main board using an assembling process in which an end portion of the metal case is bent and clamped to shield the MEMS microphone chip from a nose, thereby significantly improving an acoustic quality and reducing manufacturing costs. The end portion of the metal case having a square shape is chamfered such that a curling process is performed in the microphone having a square shape. A support member is disposed to provide a space between the PCB on which the MEMS microphone chip is mounted and the metal case. Such a MEMS microphone package includes: a metal case in which edges of an opened end portion are chamfered to easily perform a curling process in a square box shape in which one surface is opened to insert components through the opened surface; a PCB on which ...

BANDGAP REFERENCE CIRCUIT AND METHOD FOR PROVIDING A REFERENCE VOLTAGE

The bandgap reference circuit (BG) comprises a voltage generator (BC), a supply circuit (SC) and a control loop. The voltage generator (BC) comprises a first and a second branch and is configured to produce a reference voltage (vref) with a temperature coefficient lower than a given threshold. The supply circuit (SC) is configured to provide a first current to the first branch and a second current to the second branch of the voltage generator (BC). The control loop comprises a transconductance amplifier (OTA) configured and arranged to provide an output signal representative of a difference between a first voltage of the first branch and a second voltage of the second branch. Furthermore, the control loop comprises a filter coupled with an output of the transconductance amplifier (OTA). The filter provides an output signal controlling the provided first current and second current of the current source.

INTEGRATED MICROPHONE AND ANTENNA APPARATUS AND METHOD OF OPERATION

An integrated microphone and antenna. The microphone includes a housing and an acoustic transducer. The housing defines a cavity and includes a conductive layer. The acoustic transducer is positioned within the cavity and structured to generate an acoustic signal. The antenna is at least partially integrated with the microphone and structured to transmit and receive radio frequency signals. The antenna is structured to utilize the conductive layer of the housing as a radiating element.

PACKAGED MICROPHONE SYSTEM WITH INTEGRATED PASSIVE DEVICE DIE

A transducer system (17), has a package (38) forming an interior chamber (50), and a MEMS transducer (42), e.g., a MEMS microphone, secured within the interior chamber (50). The package (38) forms an aperture (52) for permitting acoustic access to the interior of the chamber (50) and thus, the MEMS transducer (42). The system (17) also has two dies (44, 46); namely, the system (17) has a primary circuit die (44) within the interior chamber (50), and an integrated passive device die (46) electrically connected with the primary circuit die (44). The primary circuit die (44) is electrically connected with the MEMS transducer (42) and has at least one active circuit element.

TEMPERATURE COMPENSATED MICROPHONE

A method and a device for eliminating or minimizing the sensitivity changes in a microphone due to temperature changes. The temperature-induced changes in the sensitivity can be caused by the changes in the sound-to-electrical signal transducer, in the microphone membrane, in the ASIC or other reasons. One or more temperature dependent components in the microphone or in a microphone module are used to offset the temperature-induced changes in the sensitivity. Sensitivity of a microphone is defined as the output voltage for a specific acoustic stimulus and load condition.

MEMS MICROPHONE ASSEMBLY AND METHOD OF OPERATING THE MEMS MICROPHONE ASSEMBLY

The present invention concerns a MEMS microphone assembly (1), comprising a MEMS transducer element (2) comprising a back plate (17) and a diaphragm (18) displaceable in relation to the back plate (17), a bias voltage generator (6) adapted to provide a DC bias voltage applicable between the diaphragm (18) and the back plate (17), an amplifier (7) for receiving an electrical signal from the MEMS transducer element (2) and for providing an output signal, the amplifier (7) being adapted to amplify the electrical signal from the MEMS transducer element (2) according to an amplifier gain setting, and a processor (8) adapted to carry out a calibration routine at power-on of the microphone assembly (1) determining information regarding the DC bias voltage and/or the amplifier gain setting. Furthermore, the present invention concerns a method of operating said MEMS microphone assembly.

OUTDOOR SECURITY COMMUNICATION DEVICE

An outdoor security communication device comprises: a fixing substrate; a base that is combined with the fixing substrate and has a first waterproof washer, a groove and an anti-thief unit being further disposed on the base; an upper lid combined with the base to form an accommodating space; and a cover plate covering over the surface opposite to the one where the upper lid and the base are combined. A main circuit board, an amplifier module, a shooting module, an audio input module and a button module are further disposed in the accommodating space for operation of the outdoor security communication device. 1. An outdoor security communication device comprising:a fixing substrate being a plate structure and attached to a particular outside wall surface; the fixing substrate comprising four screw holes and a plurality of fixing holes; where in the fixing substrate can be fixed on wall through the fixing holes; a first waterproof washer being disposed on peripheries of said base and said fixing substrate, said peripheries making the combination of said base and said fixing substrate, in order to prevent that water permeates from a joint border of said base and said fixing substrate into said outdoor security communication device;', {'b': 13', '17, 'a groove being disposed on a surface of said base, which combining with said fixing substrate by said surface, and having an inclined plane, wherein the inclined plane is able to lead water out of the groove with angle ° to ° ; and an anti-thief unit being disposed on the surface where said base is combined with said fixing substrate, wherein when said base and said fixing substrate are separated by an external force, said anti-thief unit being then deformed so as to trigger an anti-thief system; where in the anti-thief unit further comprises a first side and a second side;'}, {'b': '102', 'four second screw holes, being corresponded to four first screw holes respectively;'}, 'an upper lid being combined with said base to ...

Electroacoustic transducer

Microphone switch key

A microphone and stand assembly for either hand held use or use with the base resting on a flat surface. An arm parallel to the microphone supporting structure which activates a switch when depressed to turn the microphone on, a spring mechanism to bias the arm in a normally off position. A key mechanism which can be engaged by the fingers or thumb and when minimum pressure is exerted will co-act with the switch arm to turn the microphone on. When the fingers or thumb pressure is released the microphone switch will return to the normally off position.

Microphone with molded block amplifier electrostatic

A condenser microphone having an integrally molded unit with an active electronic element and a plurality of leads thereto encapsulated therein, and a backplate electrically coupled thereto via an axially adaptable connection providing improved manufacturing capabilities, and in which unidirectional and non-directional capabilities are incorporated without envelope modification.

MEMS MICROPHONE PACKAGE USING LEAD FRAME

The present disclosure discloses an MEMS microphone package. The MEMS microphone package in accordance with the present disclosure comprises a lead frame; an integrated MEMS chip mounted on the lead frame, having a vibration unit comprising a diaphragm and a backplate spaced each other with an air gap between them and a signal processing unit for amplifying electric signals generated in the vibration unit formed on a single silicon substrate; and an electric connection means for connecting the lead frame to the integrated MEMS chip.

MEMS microphone assembly and method of operating the MEMS microphone assembly

A MEMS microphone assembly includes a MEMS transducer element having a back plate and a diaphragm displaceable relative to the back plate. A bias voltage generator is adapted to provide a DC bias voltage applicable between the diaphragm and the back plate. An amplifier receives an electrical signal from the MEMS transducer element and provides an output signal. The amplifier is adapted to amplify the electrical signal from the MEMS transducer element according to an amplifier gain setting. A processor is adapted to carry out a calibration routine at power-on of the microphone assembly determining information regarding the DC bias voltage and/or the amplifier gain setting.

Integrated Circuit, Circuit Assembly and a Method for its Operation

An integrated circuit, a circuit assembly and a method for operation the integrated circuit are disclosed. In embodiments an integrated circuit includes at least one supply voltage terminal configured to receive a supply voltage for operation of the integrated circuit, at least one input terminal configured to receive an analog input signal corresponding to an audio signal, at least one output terminal configured to provide an analog output signal, a signal strength detector configured to detect a signal strength of the analog input signal provided at the at least one input terminal and a signaling circuit configured to indicate an amplification setting of the integrated circuit at the at least one output terminal, wherein the integrated circuit is configured to amplify the audio signal based on the detected signal strength and to output a corresponding amplified signal at the at least one output terminal.

Electronic device

The embodiment of the disclosure provides an electronic device. The main body includes a first end portion and a side portion coupled to the first end portion, the main body is enabled in a standing state by the supporting of the first end portion, the side portion defines at least two first electroacoustic holes, the at least two first electroacoustic holes are spaced apart in a direction surrounding the side portion. The at least one electroacoustic component is disposed in the main body and configured to transmit sound signals through the at least two electroacoustic holes. The embodiment of the disclosure can transmit sound signals multi-directionally.

Microphone structure and flip-type electronic device

The invention discloses a novel microphone structure and a flip-type electronic device, comprising: a first layer plate, an acoustic sensor and a circuit chip being connected to the first layer plate; a second layer plate, covered on the first layer plate; wherein, the first layer plate and second layer plate form a microphone acoustic cavity, and the microphone acoustic cavity is provided with two acoustic through-holes located at two opposite sides or two adjacent sides of the microphone acoustic cavity. The beneficial effects of the technical schemes of the invention include: two acoustic through-holes are provided on the microphone acoustic cavity of the novel microphone structure, and the two acoustic through-holes are disposed on two opposing sides or two adjacent sides of the microphone acoustic cavity, such that sound received from inside corresponds to that received from outside when using the flip-type electronic device.

Package structure of MEMS microphone

The present invention discloses a package structure of a MEMS microphone. The package structure comprises a closed inner cavity formed by a package shell in a surrounding manner, as well as a MEMS chip and an ASIC chip which are located in the closed inner cavity, wherein a sound hole allowing sound to flow into the closed inner cavity is formed in the package shell; the MEMS chip comprises a substrate as well as a vibrating diaphragm and a back plate which are provided on the substrate; the vibrating diaphragm divides the closed inner cavity into a front cavity and a back cavity; and a sound-absorbing structure is provided in the back cavity.

PROCESSING AUDIO SIGNALS

An apparatus, method and computer program is described comprising: receiving a near-field audio source signal from a near-field microphone (22); receiving a far-field audio signal from an array comprising one or more far-field microphones (23); determining a filter length of a first portion of a room impulse response filter for the near-field microphone, wherein said filter length of said first portion is the same at each of a plurality of frequency bands of the filter and wherein said filter length of said first portion includes a direct acoustic propagation delay; and determining a filter length of a second portion of the room impulse response filter at each of the plurality of frequency bands, wherein the filter length of said second portion is frequency-dependent.

ELECTRONIC DEVICE

An electronic device is provided. The electronic device includes a circuit board having a sound input hole penetrating through both surfaces of the circuit board, a microphone mounted on the circuit board, the microphone configured to receive a sound through the sound input hole, a first grounding pad surrounding the sound input hole on a surface of the circuit board, and a second grounding pad surrounding the first grounding pad on the surface of the circuit board. The microphone is mounted on the circuit board by soldering the microphone to the first and second grounding pads. 1. An electronic device comprising:a circuit board having a sound input hole penetrating through both surfaces of the circuit board;a microphone mounted on the circuit board, the microphone configured to receive a sound through the sound input hole;a first grounding pad surrounding the sound input hole on a surface of the circuit board; anda second grounding pad surrounding the first grounding pad on the surface of the circuit board,wherein the microphone is mounted on the circuit board by soldering the microphone to the first and second grounding pads.2. The electronic device of claim 1 , wherein a gap between the microphone and the circuit board is sealed by soldering the microphone to the first and second grounding pads.3. The electronic device of claim 1 , wherein the second grounding pad is shaped in a closed curve or a polygon in correspondence with one surface of the microphone facing the circuit board.4. The electronic device of claim 1 , further comprising:at least one signal terminal disposed in an area between the first grounding pad and the second grounding pad.5. The electronic device of claim 1 , further comprising:a housing configured to accommodate the circuit board; anda second sound input hole formed in the housing,wherein an external sound input through the second sound input hole travels to the microphone through the sound input hole.6. The electronic device of claim 5 , ...

Microphone and housing of microphone

A microphone includes a microphone unit configured to convert a sound wave into an electrical signal. A cylindrical housing accommodates the microphone unit, and includes a a first opening portion that transmits the sound wave to the microphone unit. A sheet member having an air-permeable property and a water-repellent property covers the first opening portion. A frame including a second opening portion having a shape corresponding to a shape of the first opening portion covers the sheet member at a position of the first opening portion. A wind screen having a drainage property covers an exterior of the housing.

Cylindrical microphone having an electret assembly in the end cover

A microphone includes a separate end cover with a sound port. A diaphragm is directly attached to the end cover. The backplate is positioned within the housing against a ridge near an end of the housing. A spacer is positioned against the backplate. The diaphragm engages the spacer when the end cover, with its attached diaphragm, is installed in the housing. The backplate of the microphone has an integral connecting wire that is made of the same material as the backplate. The integral connecting wire may have an inherent spring force to provide a pressure contact with the accompanying electrical components. The integral connecting wire electrically couples the backplate to the electronic components within the housing and transmits the raw audio signal corresponding to movement of the diaphragm. The housing may have first and second ridges on which the printed circuit board and the electret assembly are mounted, respectively.

MICROPHONE DEVICE WITH COMMUNICATION INTERFACE

This disclosure provides methods, systems, and apparatuses, for a microphone. In particular, the microphone includes a housing having an external device interface with a plurality of contacts including a data contact. An electro-acoustic transducer is configured to generate an electrical signal in response to sound. An electrical circuit is coupled to contacts of the interface, the electrical circuit including an ADC having an input coupled to an output of the conditioning circuit and configured to convert the electrical signal to audio data after conditioning. A controller is configured to communicate data, other than the audio data, via the data contact of the external device interface during a start-up transition period of the microphone assembly, wherein the controller is configured to communicate the audio data via the data contact of the external device interface only after the start-up transition period is complete.

SUBMERSIBLE MICROPHONE SYSTEM WITH A COMPRESSIBLE SPACER

A camera with image and audio capture capabilities is configured to protect the internal audio components from the external environment. The camera includes a housing that allows passage of sound waves via a port from an external area of the camera to an internal area of the camera. The camera includes a circuit board with an opening and a microphone attached to a first surface of the circuit board adjacent to the opening. The camera includes a compressible spacer attached to a second surface of the circuit board. The second surface of the circuit board may be diametrically opposite to the first surface. The camera includes a waterproof membrane between the housing and the compressible spacer.

METHODS OF MAKING SIDE-PORT MICROELECTROMECHANICAL SYSTEM MICROPHONES

A side-port piezoelectric microelectromechanical system microphone package includes a microelectromechanical system die disposed on the microphone substrate and including a microphone membrane and a membrane support substrate, the microphone membrane being disposed on a wall of a membrane support substrate, and an acoustic port defined by an aperture passing through a portion of the wall of the membrane support substrate.

REDUCED FOOTPRINT MICROPHONE SYSTEM WITH SPACER MEMBER HAVING THROUGH-HOLE

SOUND PROCESSING SYSTEM AND SOUND PROCESSING METHOD

ELECTRONIC MUSICAL SOUND GENERATOR

PROBLEM TO BE SOLVED: To provide an electronic musical sound generator that provides semiautomatic playing functions in which rhythms are easily taken while singing and a karaoke function is also provided for easy singing. SOLUTION: The generator is provided with a microphone 4, a merge section 5 in which audio signals outputted from the microphone 4 are converted into digital signals by an A/D converting circuit 124, inputted and added to musical sound signals outputted from a musical sound generating circuit 119, a progress control switch 1 and a cancel switch 2 provided on the microphone 4 and a control section 3 which receives operating signals of the switches and treats the key pressing information in the semiautomatic playing mode or treats them as a releasing instruction of the mode and conducts various controls. COPYRIGHT: (C)2003,JPO ...

WIRELESS MICROPHONE

PROBLEM TO BE SOLVED: To provide an antenna for a wireless microphone capable of attaining excellent matching of impedance without being affected by the structure of a microphone case body. SOLUTION: A lead wire 4 is connected to an antenna element 1 and a connector 5 for power supply is connected to the prescribed position of a printed board 2. The antenna element 1 and the printed board 2 are parallelly disposed and an inverted L-type antenna structure is constituted. A parasitic element 3 for impedance matching is disposed so as to face the antenna element 1 and a distance 6 between the antenna element 1 and the parasitic element 3 for impedance matching is changed so as to optimize the matching of the impedance. COPYRIGHT: (C)1997,JPO ...

ELECTRET CONDENSER MICROPHONE

PROBLEM TO BE SOLVED: To provide a electret condenser microphone which is hardly affected by the magnitude of stray capacitance and is capable of preventing the occurrence of a malfunction in acoustic performance by the force working on a fixed pole and so on by the pressure or the like from the outside of the electret condenser microphone. SOLUTION: The electret condenser microphone has a microphone capsule section 10 comprising a diaphragm 12, a fixed pole 13 and an electrode lead-out member 50. The electrode lead-out member 50 is a conductive material and formed into a cylindrical shape having a bottom. A hole is made in the fixed pole 13 so that an air chamber 53 between the diaphragm 12 and the fixed pole 13 communicates with an air chamber 53 made of the electrode lead-out member 50. The fixed pole 13 forms the air chamber 53 having an acoustic capacity inside the electrode lead-out member 50 by being fixed to a shoulder 50a formed on the electrode lead-out member 50. COPYRIGHT: ( ...

DIGITAL WIRELESS TRANSMITTER

PURPOSE: To keep transmission with high quality and to attain remote control without mistake by providing digitally modulated 2-way transmission path for the transmission between a reproducing device main body and headphone receiver so as to send a video signal and an audio digital signal at a high speed. CONSTITUTION: A 1st signal processing circuit 110 of a 1st equipment (cassette player main body) 100 converts video, audio or other data into a prescribed format, a digital modulation circuit 120 applies digital modulation to the data and the signal is sent in an optical signal or a radio wave. Furthermore, a remote control reception circuit 170 receives remote command data and a 1st control circuit 160 receives the data to control the entire operation. A 2nd equipment (headphone receiver) 200 receives the transmission signal from the 1st equipment 100, demodulates digitally the signal to reproduce the video, audio or other data. Furthermore, a remote control transmission circuit 270 sends ...

Трансформатор для микрофонов с фантомным питанием

Заявленная полезная модель относится к акустике, в частности к микрофонам, выполненным по бестрансформаторной схеме, путем подключения к выходу микрофона специального трансформатора. Для обеспечения питания микрофона по фантомной схеме трансформатор выполнен из магнитопровода и двух обмоток с отводами от середины, причем отводы первой и второй обмоток соединены. Технический результат заключается в обеспечении симметрии выходного сигнала микрофона и придании микрофону «трансформаторного» звука. 1 з.п. ф-лы, 1 ил.

Phantom Power Circuit

A phantom power circuit has a detection circuit and a limiting circuit, the detection circuit detecting a pulse current generated in association with connection or disconnection of a condenser microphone, the limiting circuit limiting the output of the condenser microphone. The detection circuit detects a pulse current generated between input terminals of the condenser microphone. The limiting circuit reduces the output from the condenser microphone when the detection circuit detects the pulse current.

Mems-microphone

A MEMS microphone having an improved noise performance due to reduced DC leakage current is provided. For that, a minimum distance between a signal line of the MEMS microphone and other conducting structures is maintained. Further, a DC guard structure fencing at least a section of the signal line is provided.

Surface-Mounted Microphone Arrays on Flexible Printed Circuit Boards

A microphone array, having a three-dimensional (3D) shape, has a plurality of microphone devices mounted onto (at least one) flexible printed circuit board (PCB), which is bent to achieve the 3D dimensional shape. Output signals from the microphone devices can be combined (e.g., by weighted or unweighted summation or differencing) to form sub-element output signals and/or element output signals, and ultimately a single array output signal for the microphone array. The PCB may be uniformly flexible or may have rigid sections interconnected by flexible portions. Possible 3D shapes include (without limitation) cylinders, spirals, serpentines, and polyhedrons, each formed from a single flexible PCB. Alternatively, the microphone array may be an assembly of multiple, interconnecting sub-arrays, each having two or more rigid portions separated by one or more flexible portions, where each sub-array has at least one cut-out portion for receiving a rigid portion of another sub-array.

MICROPHONE UNIT AND SOUND INPUT DEVICE INCORPORATING SAME

An enclosure () of a microphone unit () includes a mounting portion () which has a mounting surface () where a first vibration portion () and a second vibration portion () are mounted and in which, in the back surface () of the mounting surface (), a first sound hole () and a second sound hole () are provided; in the enclosure (), a first sound path () is provided that transmits sound waves input through the first sound hole () to one surface of a first diaphragm () and that also transmits the sound waves to one surface of a second diaphragm () and a second sound path () is provided that transmits sound waves input through the second sound hole to the other surface of the second diaphragm (). 18-. (canceled)9. A microphone unit comprising:a first vibration portion that converts a sound signal into an electrical signal based on vibration of a first diaphragm;a second vibration portion that converts a sound signal into an electrical signal based on vibration of a second diaphragm; andan enclosure that holds the first vibration portion and the second vibration portion therewithin and that includes a first sound hole and a second sound hole which face outward, a mounting portion having a mounting surface on which the first vibration portion and the second vibration portion are mounted, the mounting surface having a back surface in which are provided the first sound hole and the second sound hole;', 'a second sound path that transmits sound waves input through the second sound hole to the other surface of the second diaphragm; and', 'a first sound path that transmits sound waves input through the first sound hole to one surface of the first diaphragm and also transmits the sound waves to one surface of the second diaphragm;'}, 'an airtight space facing the other surface of the first diaphragm., 'wherein the enclosure includes10. The microphone unit of claim 9 , wherein the enclosure further includes:a lid portion that covers the mounting portion so as to form, together ...

Printed Circuit Boards with Embedded Components

Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be mounted. Recesses may be provided with solder pads to which the wires may be soldered or attached with conductive adhesive. An integrated switch may be provided in an opening within a printed circuit board substrate. The integrated switch may have a dome switch member that is mounted within the opening. A cover member for the switch may be formed from a flexible layer that covers the dome switch member. Terminals for the integrated switch may be formed from conductive structures in an interior printed circuit board layer. Interconnects may be used to electrically connect embedded components such as switches, integrated circuits, solder pads for wires, and other devices. 1. Apparatus , comprising:a printed circuit board substrate;a conductive planar contact pad in an opening in the printed circuit board substrate; anda wire that is connected to the contact pad.2. The apparatus defined in further comprising an embedded switch in the printed circuit board substrate.3. The apparatus defined in further comprising a stiffener connected to the printed circuit board substrate under the embedded switch.4. The apparatus defined in further comprising a buried channel in the printed circuit board substrate claim 1 , wherein the wire passes through the buried channel.5. The apparatus defined in further comprising conductive adhesive with which the wire is connected to the contact pad.6. The apparatus defined in further comprising a wire opening in the printed circuit board substrate in which the wire is located and further comprising solder that connects the wire to the contact pad.7. The apparatus defined in claim 1 , wherein the wire comprises an insulating coating.8. Apparatus claim 1 , comprising:a printed circuit ...

Noise Mitigating Microphone System and Method

A microphone system has a base coupled with first and second microphone apparatuses. The first microphone apparatus is capable of producing a first output signal having a noise component, while the second microphone apparatus is capable of producing a second output signal. The first microphone apparatus may have a first back-side cavity and the second microphone may have a second back-side cavity. The first and second back-side cavities may be fluidly unconnected. The system also has combining logic operatively coupled with the first microphone apparatus and the second microphone apparatus. The combining logic uses the second output signal to remove at least a portion of the noise component from the first output signal. 1. A microphone system comprising:a base;a first microphone apparatus coupled to the base, the first microphone apparatus capable of producing a first output signal having a noise component, the first microphone apparatus having a first back-side cavity;a second microphone apparatus coupled to the base, the second microphone apparatus capable of producing a second output signal, the second microphone apparatus having a second back-side cavity, the first and second back-side cavities being fluidly unconnected; andcombining logic operatively coupled with the first microphone apparatus and the second microphone apparatus, the combining logic using the second output signal to remove at least a portion of the noise component from the first output signal.2. The microphone system as defined by wherein the second output signal comprises data relating to the mechanical response of the first microphone apparatus.3. The microphone system as defined by wherein the second microphone apparatus has a diaphragm and a cap acoustically sealing the diaphragm.4. The microphone system as defined by wherein the second microphone apparatus comprises a microphone and a low pass filter.5. The microphone system as defined by wherein the first microphone apparatus comprises a ...

MICROPHONE UNIT

A microphone unit () includes: an electroacoustic conversion element () that converts a sound signal into an electrical signal based on vibration of a diaphragm (); and an enclosure () that holds the electroacoustic conversion element (). A first sound guide space (SP) holding the electroacoustic conversion element () and a second sound guide space (SP) separated by the diaphragm () from the first sound guide space (SP) are provided in the enclosure. In an inward side of the second sound guide space (SP) apart from the second opening (), a cross-sectional area reduction portion (AR) is provided that locally reduces, as compared with forward and backward portions thereof, an area of a sound path cross section substantially perpendicular to a direction in which the sound wave travels. 1. A microphone unit comprising:an electroacoustic conversion element that converts a sound signal into an electrical signal based on vibration of a diaphragm; andan enclosure that holds the electroacoustic conversion element,wherein a first sound guide space holding the electroacoustic conversion element and a second sound guide space separated by the diaphragm from the first sound guide space are provided in the enclosure,the first sound guide space guides a sound wave from outside the enclosure to one surface of the diaphragm through a first opening formed in an external surface of the enclosure,the second sound guide space guides a sound wave from the outside the enclosure to the other surface of the diaphragm through a second opening formed in the external surface of the enclosure andin an inward side of the second sound guide space apart from the second opening, a cross-sectional area reduction portion is provided that locally reduces, as compared with forward and backward portions thereof, an area of a sound path cross section substantially perpendicular to a direction in which the sound wave travels.2. The microphone unit of claim 1 ,wherein the second sound guide space has a ...

MICROPHONE PROTECTIVE DEVICE

In order to protect a microphone from moisture and/or dirt, there is provided a microphone protective device that needs only relatively little space for installation into an electroacoustic device for a relatively large effective surface area. For this purpose, the novel microphone protective device has an at least partially cylindrical-shell-shaped membrane, for preventing dirt and/or moisture from entering a sound inlet opening of the microphone. 115-. (canceled)16. In combination with a microphone disposed in vicinity of a sound inlet opening , a microphone protective device , comprising:a membrane disposed for preventing a penetration of dirt and/or moisture into the sound inlet opening of the microphone, said membrane having characteristics selected from the group of being dirt-repelling, moisture-repelling, dirt-impermeable, and moisture-impermeable; andsaid membrane being formed at least partly in a shape of a cylindrical shell or being disposed on a cylindrical shell surface.17. The microphone protective device according to claim 16 , which further comprises an outer envelope at least partly enveloping said membrane.18. The microphone protective device according to claim 17 , wherein said outer envelope is formed at least partly in the shape of a cylindrical shell.19. The microphone protective device according to claim 17 , wherein said membrane and said outer envelope are aligned relative to one another with a substantially common axis of symmetry.20. The microphone protective device according to claim 17 , wherein said membrane and said outer envelope have mutually different diameters and/or are spaced apart from one another claim 17 , defining a spacing distance between said membrane and said envelope.21. The microphone protective device according to claim 17 , wherein said membrane and said outer envelope have a substantially equal height.22. The microphone protective device according to wherein claim 17 , at least at one end of said membrane and said ...

Dynamic Microphone Unit and Dynamic Microphone

A dynamic microphone unit includes: a diaphragm that vibrates in response to received sound waves; a voice coil that is fixed to the diaphragm and vibrates together with the diaphragm; a magnetic circuit that generates a magnetic field in a magnetic gap, the voice coil being disposed in the magnetic gap; a resonator that is disposed adjacent to the obverse of the diaphragm; and a noise canceling coil that is fixed to a surface of the resonator so as to face a position of fixing the voice coil, the surface facing the diaphragm. The noise canceling coil is connected in series with the voice coil and has a winding direction different from that of the voice coil. 1. A dynamic microphone unit comprising:a diaphragm that vibrates in response to received sound waves;a voice coil that is fixed to the diaphragm and vibrates together with the diaphragm;a magnetic circuit that generates a magnetic field in a magnetic gap, the voice coil being disposed in the magnetic gap;a resonator that is disposed adjacent to the obverse of the diaphragm; anda noise canceling coil fixed to a surface of the resonator, the surface facing a surface of the diaphragm, the noise cancelling coil facing the voice coil.2. The dynamic microphone unit according to claim 1 , whereinthe noise canceling coil is connected in series with the voice coil, anda winding direction of the noise canceling coil being different from a winding direction of the voice coil.3. The dynamic microphone unit according to claim 1 , wherein the resonator has a convex surface on its surface that faces the diaphragm claim 1 , the convex surface being formed along a circle concentric with the voice coil claim 1 , the noise canceling coil being aligned along the convex surface.4. The dynamic microphone unit according to claim 1 , wherein the noise canceling coil has the same wound diameter as that of the voice coil.5. The dynamic microphone unit according to claim 1 , wherein the noise canceling coil has the same number of turns ...

MULTI-FUNCTIONAL MICROPHONE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

A multi-functional microphone assembly that has a reduced number of components by installing circuit devices for additional functions in a printed circuit board (PCB) of a microphone so as to reduce the number of components and to increase an area of a back electrode plate, thereby improving sound quality, and a method of manufacturing the multi-functional microphone assembly. The multi-functional microphone assembly includes a microphone cell unit; and a printed circuit board (PCB) assembly that is coupled to the microphone cell unit and in which components for a microphone function and components for an additional function are mounted on a PCB on which a metal pattern and a connection terminal are formed. 1. A multi-functional microphone assembly comprising:a microphone cell unit; anda printed circuit board (PCB) assembly that is coupled to the microphone cell unit and in which components for a microphone function and components for an additional function are mounted on a PCB on which a metal pattern and a connection terminal are formed.2. The multi-functional microphone assembly of claim 1 , wherein the microphone cell unit is welded on the metal pattern claim 1 , and a connection surface between the microphone cell unit and the PCB assembly is sealed by a sealing member.3. The multi-functional microphone assembly of or claim 1 , further comprising a flexible printed circuit board (FPCB) for interfacing with an external device.4. The multi-functional microphone assembly of or claim 1 , wherein the PCB assembly comprises:a PCB having one surface on which a metal pattern is formed and the other surface on which a connection terminal is formed,a conductive member that is mounted on the PCB and electrically connects the microphone cell unit and the PCB assembly to each other,components for a microphone function, which are mounted on an upper surface of the PCB, andmount components for additional functions, which are respectively mounted on the upper surface of the ...

MICROPHONE ARRANGEMENT FOR A BREATHING MASK

An electro-acoustical transducer device includes a body structure () and a differential microphone () located in an aperture of a wall of the body structure. The microphone includes a front side for receiving an acoustical signal and a rear side for receiving the acoustical signal in modified form. The differential microphone is arranged to produce an electrical output signal proportional to the difference of the acoustical signals at the front and rear sides. The body structure is arranged to form a chamber () shared with the rear side of the microphone. There are tubular channels () to the chamber so that the channels and the chamber constitute an acoustical filter for filtering the acoustical signal falling to the rear side of the microphone. With proper design of the chamber and the channels, it is possible to achieve acoustical filtering for background noise rejection. 2. An electro-acoustical transducer device according to claim 1 , wherein the body structure is arranged to form at least one additional chamber and at least one second tubular channel between the chambers so that the chambers claim 1 , the at least one first tubular channel claim 1 , and the at least one second tubular channel constitute the acoustical filter.3. An electro-acoustical transducer device according to claim 1 , wherein the electro-acoustical transducer device further comprises an acoustical resistor element arranged to cover at least one of the following: the front side of the differential microphone claim 1 , an opening of the at least one first tubular channel.4. An electro-acoustical transducer device according to claim 1 , wherein the electro-acoustical transducer device further comprises a vented cover element allowing both the front side of the differential microphone and the opening of the at least one first tubular channel to receive the acoustical signal in the same form.5. An electro-acoustical transducer device according to claim 1 , wherein the differential microphone is ...

Microphone System with Offset Apertures

A microphone system has a base forming a base aperture, and a lid coupled to the base to form a package having an interior chamber. The system also has a member coupled with the base within the interior chamber, and a microphone die coupled to the member within the interior chamber. The member is positioned between the base and the microphone die and has a member aperture that is laterally offset from the base aperture. The member aperture, member, and base together form an acoustic path between the base aperture and the microphone die. 1. A microphone system comprising:a base;a lid coupled to the base to form a package having an interior chamber, the package having an inlet aperture;a member coupled with the base within the interior chamber, the member having a member aperture; anda microphone die coupled to the member within the interior chamber, the member being between the base and the microphone die,the member aperture and inlet aperture being laterally offset,the member aperture, member, and base forming an acoustic path between the inlet aperture and the microphone die.2. The microphone system as defined by wherein the member comprises a circuit die.3. The microphone system as defined by wherein the member comprises an inactive die.4. The microphone system as defined by wherein the package comprises metal to protect against electromagnetic interference.5. The microphone system as defined by wherein the base includes a base recess that at least in part forms the acoustic path.6. The microphone system as defined by wherein the member includes a bottom face that is adjacent to the base claim 1 , the bottom face having member recess that at least in part forms the acoustic path.7. The microphone system as defined by wherein the member and microphone die are in a stacked configuration.8. The microphone system as defined by wherein the microphone die includes a backplate and a diaphragm that together form a variable capacitor claim 1 , the backplate being between ...

Microphone Shield with Common Mode Interference Reduction

A microphone assembly includes a microphone composed of a case having an open end and a printed circuit board. The printed circuit board is disposed in the open case end. The microphone assembly further includes a conductive ring coupled to the microphone case and extending beyond the open case end for shielding the microphone from electromagnetic interference. 1. A microphone assembly comprising: a microphone case having an open case end;', 'a printed circuit board, wherein the printed circuit board is disposed in the open case end; and, 'a microphone comprisinga conductive ring electrically coupled to the microphone case and extending beyond the open case end of the microphone, wherein the metal ring shields the microphone from electromagnetic interference.2. The microphone assembly of claim 1 , wherein the conductive ring extends beyond the open case end of the microphone by at least 75% of a microphone case diameter.3. The microphone assembly of claim 1 , wherein the conductive ring is mounted on the microphone case using a friction fit.4. The microphone assembly of claim 1 , wherein the printed circuit board comprises an acoustic port and the metal ring shields the microphone from electromagnetic interference while allowing passage of an acoustic signal to the acoustic port.5. The microphone assembly of claim 1 , wherein the conductive ring is made of metal.6. The microphone assembly of claim 5 , wherein the conductive ring is a spring type metal ring.7. The microphone assembly of claim 1 , wherein the microphone case comprises a first port disposed opposite of the open case end.8. A microphone assembly comprising: [ a first end;', 'a second end opposite of the first end, the second end having an open end;, 'a microphone case comprising, 'a first acoustic port; and, 'a microphone comprisinga conductive element electrically coupled to the microphone at the second end, wherein the conductive element shields the microphone from electromagnetic interference.9. The ...

ELECTRONIC DEVICE

A foldable tongue piece portion formed to extend at an end of a microphone bush. An insertion hole in which a lead wire is inserted is formed near the tongue piece portion. By storing a microphone, to which the microphone bush is attached, in a container portion, the tongue piece portion is folded and the lead wire drawn through the insertion hole is pressed. 1. An electronic device , comprising:a microphone which includes a lead wire;a microphone bush which is made of an elastic material and is configured to be attached to the microphone; anda main body member which includes a container portion configured to store the microphone to which the microphone bush is attached,wherein a foldable tongue piece portion is formed to extend at an end of the microphone bush,wherein insertion hole in which the lead wire is inserted is formed near the tongue piece portion,wherein the tongue piece portion is folded by storing, in the container portion, the microphone to which the microphone bush is attached, andwherein the lead wire drawn through the insertion hole is pressed by folding the tongue piece portion.2. The electronic device according to claim 1 ,wherein the container portion includes a slit in which the lead wire drawn through the insertion hole is disposed at the time of storing, in the container portion, the microphone to which the microphone bush has been attached, andwherein the tongue piece portion is folded such that the lead wire drawn through the insertion hole is disposed within the tongue piece portion inside the slit by storing, in the container portion, the microphone to which the microphone bush has been attached.3. The electronic device according to claim 2 ,wherein the microphone bush includes a first insertion hole through which the lead wire is drawn from the inside of the microphone bush to the outside of the microphone bush at the time of attaching the microphone bush to the microphone, and a second insertion hole in which the lead wire drawn through ...

DISPLAY MEANS AND SHIELD

A microphone apparatus, which includes a microphone comprising at least one display means provided about a head thereof, wherein the display means comprises at least one of a static display for displaying a static communication and an electronically variable display means for displaying electronically variable communication/s. The microphone further comprising a microphone windshield defining a fitment aperture for receiving at least the head of the microphone and at least one display aperture which is positioned such that, in use, at least a portion of the display means is alignable with the display aperture 1. A microphone apparatus , which includesa microphone comprising at least one display means provided on or about a head thereof, wherein the display means comprises at least one of a static display means for displaying the static communication and an electronically variable display means for displaying electronically variable communication/s; anda microphone windshield defining a fitment aperture for receiving at least the head of the microphone and at least one display aperture which is positioned such that, in use, at least a portion of the display means is alignable with the display aperture.2. The microphone apparatus as claimed in claim 1 , wherein the display aperture is shaped and dimensioned to align substantially with the display means claim 1 , in use.3. The microphone apparatus as claimed in claim 1 , wherein the display means is provided with a microphone accessory which is attachable to the microphone apparatus.4. The microphone apparatus as claimed in claim 3 , wherein the microphone accessory comprises a body defining one or more planar wall/s claim 3 , and attachment means for attaching the accessory to the microphone head.5. The microphone apparatus as claimed in claim 1 , wherein the fitment aperture is axially located and the display aperture is located on a hollow body of the microphone windshield corresponding to a location of the display ...

Base Station, Wireless Headset and Headband Thereto

A base station and wireless headset where the headset is powered by a contained rechargeable battery and where the base station has a cradle with charging output contact points and the headset has a cradle-neck with charging input contact points. The base station in a surface region at the cradle includes a first surface mounted magnetic means displaying a first magnetic polarization and a second surface mounted magnetic means adjacent thereto and displaying a second magnetic polarization which is opposite the first magnetic polarization. The headset at a corresponding surface region at the cradle neck includes at least a further surface mounted magnetic means displaying only one of the first or the second polarization so as to ensure attraction forces and repulsion forces respectively between this further magnetic means and the two magnetic means at the bases station cradle. 112-. (canceled)13. A combination of a base station and a wireless headset which is mountable on said base station ,said base station comprising a cradle with electrical charging output contact points, a first surface-mounted magnetic means displaying a first magnetic polarization at said cradle, and a second surface-mounted magnetic means displaying a second magnetic polarization opposite the first-magnetic polarization adjacent said first magnetic means, andsaid wireless headset comprises a rechargeable battery, a cradle neck, electrical charging input contact points which contact said electrical charging output contact points when said cradle neck is mounted on said cradle, and a third surface-mounted magnetic means displaying only one of the first and second polarizations so as to ensure attractive and repulsive forces, respectively, with said first and second magnetic means.14. The combination as claimed in claim 13 , and wherein said headset comprises an electronics housing part at a proximal end thereof claim 13 , said electronics end housing parts including a loudspeaker claim 13 , and ...

SENSOR MODULE

A cost-effective and extremely space-saving module approach is provided for at least two micromechanical sensor elements having the same packaging requirements. The sensor module described here includes at least two micromechanical sensor elements whose sensor function is based on the direct or indirect impact of a measuring medium. The at least two sensor elements are situated in a shared housing having at least one access opening for the measuring medium, and the at least two sensor elements are stacked with one component back side on one component front side, so that the upper sensor element at least partially covers the active area of the lower sensor element, while still ensuring the impact of the measuring medium, which is used for the sensor function, on the active area of the lower sensor element. 1. A sensor module , comprising:at least two micromechanical sensor elements with a sensor function based on one of a direct and an indirect impact of a measuring medium; and 'the at least two sensor elements are stacked in which one component back side is on one component front side, so that an upper sensor element of the at least two sensor elements at least partially covers an active area of the lower sensor element of the at least two sensor elements, while still ensuring the impact of the measuring medium for the sensor function on the active area of the lower sensor element.', 'a housing in which the at least two sensor elements are situated, the housing including at least one access opening for the measuring medium, wherein2. The sensor module as recited in claim 1 , wherein:each of the at least two sensor elements includes a pressure-sensitive diaphragm structure,one of the at least two sensor elements functions as a pressure sensor,another one of the at least two sensor elements functions as a microphone, andat least the diaphragm structure of the sensor element functioning as the microphone spans a cavern in a component back side.3. The sensor module as ...

MICROPHONE

Provided is a microphone capable of reducing a plane area seen from above, and further increasing a capacity of a back chamber of an acoustic sensor. An interposer is mounted on a top surface of a circuit board and an acoustic sensor is mounted on the top surface thereof. A signal processing circuit is accommodated in a space provided in the interposer and mounted on the circuit board The acoustic sensor is connected to the circuit board through a wiring structure provided in the interposer The acoustic sensor the interposer and the like are covered by a cover put on the top surface of the circuit board In the cover a sound introduction hole is opened in a position opposed to the front chamber of the acoustic sensor The interposer is formed with a ventilation notch for acoustically communicating a space below a diaphragm of the acoustic sensor with a space inside the cover and outside the interposer 1. A microphone , comprising:a circuit board;a supporting member, mounted on a top surface of the circuit board;an acoustic sensor, mounted on the supporting member;a signal processing circuit, accommodated inside a hollow that is formed inside the supporting member, and mounted on the top surface of the circuit board; anda cover, covering the acoustic sensor, the supporting member, and the signal processing circuit and fixed to the top surface of the circuit board,whereinthe acoustic sensor is formed with a space to serve as a front chamber on the top surface side and is also provided with a space to serve as a back chamber on the under surface side, andthe supporting member is formed with an acoustic transmission path capable of transmitting an acoustic vibration between a space located outside the acoustic sensor and the supporting member and the space to serve as the back chamber inside the acoustic sensor, out of spaces surrounded by the cover and the circuit board.2. The microphone according to claim 1 , whereina sound introduction hole for introducing an acoustic ...

Host unit with docking headset

A portable combination device, capable of delivering music and other audio messages including a host unit containing a front side and a circuit for producing audio messages and wireless representative signals of the audio messages; a headset containing a circuit for receiving the wireless representative signals and playing back the audio messages through an earbud, formed and sized to fit in a user's ear canal; and a docking mechanism for docking the headset onto the host unit such that a substantial part of the ear-bud protrudes beyond an edge of the host unit and is visible from the front of the host unit when docked, and the docking mechanism keeps the docking port on the host unit substantially recess-free. 12-. (canceled)3. A system , comprising:a wireless headset module having a wireless headset body, the wireless headset body includes a microphone;an ear-bud module of the wireless headset module having a neck and an ear-bud, the ear-bud includes a speaker and is mechanically coupled to the wireless headset body by the neck, the ear-bud is formed to fit into an outer portion of a user ear canal;a housing configured to couple with at least the wireless headset module;a docking module of the housing configured to retain at least a portion of the wireless headset body,wherein the ear-bud extends above the docking module with the wireless headset body retained in the docking module.4. The system of claim 3 , wherein the housing is the housing of an electronic device.5. The system of claim 3 , wherein the housing is configured to attach to an electronic device.6. The system of claim 3 , further comprising one or more retaining ends configured to at least partially secure the housing to the electronic device.7. The system of claim 6 , further comprising at least one hook of the one or more retaining ends configured to wrap around at least one edge of the electronic device.8. The system of claim 3 , further comprising two or more sides of the housing claim 3 , the ...

Microphone Assembly With Barrier To Prevent Contaminant Infiltration

A microphone assembly includes a cover, a base coupled to the cover, a microelectromechanical system (MEMS) device disposed on the base. An opening is formed in the base and the MEMS device is disposed over the opening. The base includes a barrier that extends across the opening and is porous to sound. The remaining portions of the base do not extend across the opening. 1. A microphone assembly comprising:a cover;a base coupled to the cover;a microelectromechanical system (MEMS) device disposed on the base;an opening in the base and wherein the MEMS device is disposed over the opening;wherein the base is comprised of a barrier that extends across the opening and is porous to sound, and wherein the remaining portions of the base do not extend across the opening.2. The microphone assembly of wherein the barrier is embedded in the base.3. The microphone assembly of further comprising an integrated circuit coupled to the MEMS device.4. The microphone assembly of wherein the integrated circuit is an application specific integrated circuit (ASIC).5. The microphone assembly of wherein the base comprises a cavity that communicates with the opening and the barrier is disposed within the cavity.6. The microphone assembly of wherein the base comprises multiple layers of materials and the barrier comprises one of the multiple layers.7. The microphone assembly of wherein the barrier comprises a patterned flex printed circuit board (PCB).8. The microphone assembly of wherein the patterned flex PCB comprises a polyimide film.9. The microphone assembly of wherein the barrier is coupled to a bottom surface of the base over the opening.10. The microphone assembly of wherein the base comprises a membrane.11. A microphone assembly comprising:a cover;a base that is attached to the cover;a microelectromechanical system (MEMS) device disposed on the base;wherein the base includes a first opening over which the MEMS device is disposed, a channel, and a second opening communicating with the ...

IMPLANTABLE MICROPHONE

An implantable microphone, comprising a source of incoherent light, a light detector for outputting a signal corresponding to the total light intensity impinging onto a detector surface, a housing for housing the light source and the detector, and a sensor membrane for being exposed to surrounding soft tissue, the membrane being arranged to seal an opening of the housing and comprising reflector means provided at the inner side of the sensor membrane for reflecting light from the light source onto the detector in manner that the total light intensity reflected onto the detector varies as a function of the position of the reflector means relative to the detector. 1. An implantable microphone , comprising:a source of incoherent light,a light detector for outputting a signal corresponding to a total light intensity of the incoherent light and impinging onto a detector surface,a housing for housing the light source and the detector, anda sensor membrane for being exposed to surrounding soft tissue, the membrane being arranged to seal an opening of the housing and comprising reflector means provided at the inner side of the sensor membrane for reflecting light from the light source onto the detector in manner that the total light intensity reflected onto the detector varies as a function of the position of the reflector means relative to the detector.2. The microphone of claim 1 , wherein at least part of the reflected light impinges at an oblique angle onto detector surface.3. The microphone of claim 2 , wherein at the detector surface is essentially parallel to the sensor membrane.4. The microphone of claim 1 , wherein the reflector means is a reflector element provided in a central region of the sensor membrane.5. The microphone of claim 4 , wherein the reflector element comprises at least one light reflecting surface which is angled with regard to the sensor membrane.6. The microphone of claim 4 , wherein the reflector element has a convex shape.7. The microphone of ...

MICROPHONE ASSEMBLY

A microphone assembly includes a cover, a substrate, at least one wall disposed and between and attached to the cover and the substrate, an acoustic transducer acoustically sealed to the lid, and an interposer. The interposer and the acoustic transducer are electrically connected without using the lid as an electrical conduit. The transducer and interposer are disposed one above the other and the transducer is supported by the interposer or by a pedestal. 1. An microphone assembly comprising:a cover having an acoustic port;a substrate attached to the cover;an acoustic transducer acoustically sealed to the acoustic port of the cover;an interposer;such that the interposer and the acoustic transducer are electrically connected together without using the cover as an electrical conduit; andsuch that the transducer and interposer are disposed one above the other and the transducer is supported by the interposer or by a pedestal.2. The microphone assembly of wherein the cover comprises a wall and lid.3. The microphone assembly of wherein the acoustic transducer comprises a Microelectromechanical system (MEMS) device.4. The microphone assembly of wherein the imposer is an element selected from the group consisting of an application specific integrated circuit (ASIC) claim 1 , an integrated circuit claim 1 , and a ceramic plate.5. The microphone assembly of wherein the transducer is disposed upon bumps and the bumps are disposed on the interposer.6. The microphone assembly of wherein the bumps provide an electrical connection between the transducer and the interposer.7. The microphone assembly of wherein a wire bond couples the interposer to conductive traces on the substrate.8. The microphone assembly of further comprising an opening in the cover comprising an etched nozzle.9. The microphone assembly of further comprising an opening in the cover and a nozzle or tube disposed in the opening.10. The microphone assembly of further comprising an opening in the cover and a ...

SYSTEMS AND METHODS FOR RETAINING A MICROPHONE

Systems and methods for retaining a microphone using a microphone boot are disclosed. The microphone boot may include a sound channeling structure for receiving and delivering sound, and a microphone retaining block for retaining a microphone and passing the sound to the microphone. The sound channeling structure may be secured to a housing of an electronic device. The sound channeling structure may include a sound tube and a hooking component that may be insertable into a tunnel and a slot, respectively, of the microphone retaining block. The sound tube may deliver the sound into the tunnel for passing to the microphone. The hooking component may lock into the slot to secure the sound channeling structure to the microphone retaining block. Thus, the microphone boot may be tightly sealed to prevent leakage of the sound, and may fix the microphone within the electronic device even in the presence of external force. 1. A microphone boot comprising:a sound channeling structure comprising a frame, a sound tube, and at least one hooking component, the sound tube and the at least one hooking component extending away from a first side of the frame; anda microphone retaining block comprising a front face, a microphone retaining cavity, a tunnel, and at least one slot, the tunnel extending from the front face to the microphone retaining cavity, wherein the tunnel is operative to receive the sound tube and each slot of the at least one slot is operative to releasably couple a respective one of the at least one hooking component when the sound channeling structure is coupled to the microphone retaining block.2. The microphone boot of claim 1 , wherein the first side of the frame is flush with the front face of the microphone retaining block when the sound channeling structure is coupled to the microphone retaining block.3. The microphone boot of claim 1 , wherein the frame comprises a sound receiving aperture on a second side of the frame claim 1 , the sound receiving aperture ...

Implantable microphone

An implantable microphone for placement in soft tissue, comprising a sensor arrangement comprising a housing, a first pressure sensor having a first membrane for being exposed to surrounding soft tissue and a second pressure sensor having a second membrane for being exposed to surrounding soft tissue and a compensation circuitry for combining the output signals of the first and second sensor in a manner so as to eliminate signals resulting from acceleration forces acting on the sensor arrangement, wherein the first and the second sensor are of a mirror-symmetric design with regard to each other, with the first and the second membrane being arranged parallel to each other.

MOBILE TERMINAL

Provided is a mobile terminal including a terminal body, a printed circuit board provided in the terminal body, and a microphone provided on the printed circuit board a prescribed distance from the terminal body. The printed circuit board may be provided between an opening in the terminal body and the microphone, and a channel may be provided that extends from the opening in the terminal body to the microphone. 1. A mobile terminal comprising:a terminal body;a printed circuit board provided in the terminal body; anda microphone provided on the printed circuit board a prescribed distance from the terminal body,wherein the printed circuit board is provided between an opening in the terminal body and the microphone, and a channel is provided that extends from the opening in the terminal body to the microphone.2. The mobile terminal of claim 1 , wherein a first surface of the printed circuit board is provided closer to the opening in the terminal body than a second surface of the printed circuit board claim 1 , the microphone being provided at the second surface.3. The mobile terminal of claim 2 , wherein the first surface is an upper surface of the printed circuit board and second surfaces is a lower surface of the printed circuit board claim 2 , the first and second surfaces being opposite surfaces.4. The mobile terminal of claim 3 , wherein the printed circuit board extends perpendicular to the terminal body and a connection member is provided adjacent the terminal body and the printed circuit board claim 3 , andwherein the channel is provided in the connection member and extends from the opening in the terminal body to the first surface of the printed circuit board.5. The mobile terminal of claim 4 , wherein a hole is formed through the printed circuit board to correspond to the microphone and the channel.6. The mobile terminal of claim 5 , wherein a diameter of the channel is greater than a diameter of the opening in the terminal body or the hole in the printed ...

Systems and methods for using a speaker as a microphone in a mobile device

In accordance with methods and systems of the present disclosure, a mobile device may include an enclosure adapted such that the enclosure is readily transported by a user of the mobile device, a speaker associated with the enclosure for generating sound, and a controller within the enclosure, communicatively coupled to the speaker. The controller may be configured to receive a signal from the speaker, the signal induced at least in part by sound incident on the speaker other than sound generated by the speaker and process the signal.

Magnetic earphones holder

One or more sensors are configured to contextualize a series of user generated movements to control one or more electronic devices. For example, a set of earphones comprises one or more sensors for sensing a location of the earphones. The one or more sensors enable earphones such as a pair of bluetooth or earphones wirelessly coupled to a bluetooth enabled electronic device, the capability to understand the configuration of use of the earphones. Based on a location and use or non-use of the earphones, one or more contextual responses is able to be applied for a given action. In addition, a garment comprises one or more sensors for sensing a motion of a user as the garment is being used. The one or more sensors allow the user to control one or more electronic devices through a series of user generated movements.

ELECTRONIC DEVICE, WEARABLE DEVICE, PRESSURE REGULATOR VALVE AND METHOD FOR MANUFACTURING PRESSURE REGULATOR VALVE

An electronic device includes a housing and an internal pressure regulator valve. The internal pressure regulator valve includes a valve body of flexible material. The valve body has a valve hole and a hollow. The hollow is continuous with the valve hole and opens into the housing. Through the valve hole, gas is released to outside. 1. An electronic device comprising:a housing; andan internal pressure regulator valve including a valve body of flexible material having: a valve hole through which gas is released to outside; and a hollow which is continuous with the valve hole and opens into the housing.2. The electronic device according to claim 1 , wherein the valve body further has a projection which projects to the outside claim 1 , containing the valve hole.3. The electronic device according to claim 1 , wherein the internal pressure regulator valve opens claim 1 , thereby releasing the gas in the housing to the outside claim 1 , when an internal pressure of the housing is higher than an external pressure.4. The electronic device according to claim 3 , wherein the internal pressure regulator valve opens claim 3 , thereby releasing the gas in the housing to the outside claim 3 , when (i) the internal pressure is higher than the external pressure and (ii) a difference between the internal pressure and the external pressure is equal to or larger than a first predetermined difference.5. The electronic device according to claim 1 , wherein the internal pressure regulator valve closes claim 1 , thereby blocking liquid from entering the housing from the outside claim 1 , when an internal pressure of the housing is lower than an external pressure.6. The electronic device according to claim 5 , wherein the internal pressure regulator valve closes claim 5 , thereby blocking the liquid from entering the housing claim 5 , when (i) the internal pressure is lower than the external pressure and (ii) a difference between the internal pressure and the external pressure is equal to ...

Voice Enhancing Device with Audio Focusing Function

A voice enhancing device with an audio focusing function is disclosed. The voice enhancing device has an audio focusing function capable of selectively enhancing voice depending on a speaking person's location. The voice enhancing device, which is wearable on a human body, includes: left and right earphones configured to fit into left and right ears of a wearer of the voice enhancing device, respectively; two or more microphones configured to acquire a sound; and a processing part configured to at least perform signal processing tasks for active noise cancellation on sound signals from the microphones and output processed sound signals to the earphones. The processing part is configured to perform the signal processing tasks to amplify only sound signals picked up from an interested direction and to attenuate sound signals picked up from other directions. 1. A voice enhancing device with an audio focusing function , which is wearable on a human body , comprising:left and right earphones configured to fit into left and right ears of a wearer of the voice enhancing device, respectively;two or more microphones configured to acquire a sound; anda processing part configured to at least perform signal processing tasks for active noise cancellation on sound signals from the microphones and output processed sound signals to the earphones,wherein the processing part is configured to perform the signal processing tasks to amplify only sound signals picked up from an interested direction and to attenuate sound signals picked up from other directions.2. The voice enhancing device of claim 1 , wherein the processing part is configured to at least determine the directions of the sounds picked up and detected by the two or more microphones claim 1 , respectively claim 1 , based on the difference in phase between the sounds.3. The voice enhancing device of claim 1 , further comprising:a housing that receives at least some of the earphones, the microphones and the processing part, ...

Multi-microphone pop noise control

Disclosed is a method and a headset for reducing pop-noise in voice communication between a user and a far-end device. The headset has a first, a second and a third electro-acoustic input transducer for reception of audio input signals. The headset also has a first beamformer to provide a voice signal. The first beamformer is configured to optimize the voice-to-background noise ratio. The headset comprises a second beamformer configured for providing a pop-noise signal. The pop-noise signal is based on the first input signal from the first input transducer, the second input signal from the second input transducer, and a third input signal from the third input transducer. The second beamformer is adaptively configured to cancel voice and background noise while not cancelling pop-noise. The headset compares the pop-noise signal to the voice signal to determine time periods and frequency bands having pop-noise. 2. A headset according to claim 1 , wherein pop-noise is wind turbulence caused by airflow from at least the mouth of the user wearing the headset.3. A headset according to claim 1 , wherein the first input transducer and the second input transducer are arranged on the microphone boom with a shorter distance from the first end than the distance between the first end and the third input transducer.4. A headset according to claim 1 , wherein reducing the pop-noise in the output signal comprises replacing the voice signal with the third input signal from the third input transducer in time periods and frequency bands having pop-noise.5. A headset according to claim 1 , wherein reducing the pop-noise in the output signal comprises mixing the voice signal claim 1 , in time periods and frequency bands having pop-noise claim 1 , with a comfort signal and/or with the third input signal.6. A headset according to claim 1 , wherein reducing the pop-noise in the output signal comprises suppressing claim 1 , such as removing the voice signal in time periods and frequency ...

MICROELECTROMECHANICAL MICROPHONE

A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip. 1. A microelectromechanical microphone comprising:a substrate;a sensor chip bonded to the substrate and integrating a microelectromechanical acoustic transducer; anda control chip bonded to the substrate and operatively coupled to the sensor chip, the sensor chip having a first portion that is overlying and bonded to the control chip.2. The microelectromechanical microphone according to claim 1 , wherein the control chip has a first face claim 1 , wherein the first portion of the sensor chip is bonded to the first face of the control chip claim 1 , wherein the acoustic transducer includes a transduction member acoustically communicating with a sound port in the substrate.3. The microelectromechanical microphone according to claim 2 , wherein the substrate includes an assembly base claim 2 , the sensor chip has a second portion coupled to the base.4. The microelectromechanical microphone according to claim 3 , comprising an adhesive layer that is partially on the base and partially on the first face of the control chip along a perimeter of the sensor chip claim 3 , the sensor chip being bonded to the base and to the control chip through the adhesive layer.5. The microelectromechanical microphone according to claim 3 , wherein the base has a first thickness and the control chip has a second thickness that is substantially the same thickness as the first thickness.6. The microelectromechanical microphone according to claim 3 , wherein the base extends around the sound port.7. The ...

BENDABLE MICROPHONE

A bendable boom microphone. In one embodiment, the bendable boom microphone includes a bendable boom, a microphone, a sensor, and a controller. The bendable boom has a first end and a second end opposite the first end. The first end of the bendable boom is anchored. The microphone is positioned at the second end of the bendable boom. The sensor detects a bend angle of the bendable boom. The controller receives an indication of the bend angle from the sensor and operates the bendable boom microphone in one of a plurality of modes based on the bend angle. 1. A bendable boom microphone comprising:a bendable boom having a first end and a second end, the second end opposite the first end, the first end anchored;a microphone positioned at the second end of the bendable boom;a sensor attached to the bendable boom for detecting a bend angle of the bendable boom; anda controller receiving an indication of the bend angle from the sensor and operating the bendable boom microphone in one of a plurality of modes based on the bend angle;wherein the bendable boom is bendable in a two-dimensional plane having an axis parallel to a user's mouth.2. The bendable boom microphone of claim 1 , wherein the controller operates the bendable boom microphone in a first mode when the bend angle is less than a first threshold.3. The bendable boom microphone of claim 2 , wherein the controller operates the bendable boom microphone in a second mode when the bend angle is greater than the first threshold.4. The bendable boom microphone of claim 3 , wherein the controller operates the bendable boom microphone in the second mode when the bend angle is greater than the first threshold and less than a second threshold.5. The bendable boom microphone of claim 4 , wherein the controller operates the bendable boom microphone in a third mode when the bend angle is greater than the second threshold.6. The bendable boom microphone of claim 1 , wherein the plurality of modes includes a mute operation and an ...

IMAGE CAPTURING DEVICE

An image capturing device includes a circuit board, an image capturing module, a light source module disposed on the circuit board and a connection body disposed above the light source module. The image capturing module has a first lens set and a second lens set disposed on the circuit board. The connection body has a first connection section having a first open end and a second open end. The first open end of the first connection section abuts against the light-emitting component or the upper side of the circuit board in adjacency to the light-emitting component. The first and second open ends together define a first light passage. The light-emitting component is positioned in the first light passage. The image capturing device can effectively avoid light leakage of the image. 1. An image capturing device comprising:a circuit board having an upper side and a lower side;an image capturing module having a first lens set and a second lens set, the first and second lens sets being respectively disposed on the upper side of the circuit board and electrically connected therewith;a light source module having an light-emitting component disposed on the upper side of the circuit board and electrically connected therewith; anda connection body correspondingly disposed above the light source module, the connection body having a first connection section, the first connection section having a first open end and a second open end corresponding to the first open end, the first open end abutting against the light-emitting component or the upper side of the circuit board in adjacency to the light-emitting component, the first and second open ends together defining a first light passage, the light-emitting component being positioned in the first light passage.2. The image capturing device as claimed in claim 1 , wherein the light-emitting component has a base seat and a lens disposed on the base seat claim 1 , the first open end outward extending from the connection body to abut ...

SYSTEMS AND METHODS FOR REDUCING NOISE IN MICROPHONES

A microphone assembly comprises a substrate and an enclosure disposed on the substrate. A port is defined in one of the substrate or the enclosure. An acoustic transducer is configured to generate an electrical signal in response to acoustic activity. The acoustic transducer comprises a membrane separating a front volume from a back volume of the microphone assembly. The front volume is in fluidic communication with the port, and the back volume is filled with a first gas having a thermal conductivity lower than a thermal conductivity of air. An integrated circuit is electrically coupled to the acoustic transducer and configured to receive the electrical signal from the acoustic transducer. At least a portion of a boundary defining at least one of the front volume or the back volume is configured to have compliance so as to allow pressure equalization. The first gas is different from the second gas. 1. A microphone assembly , comprising:a substrate;an enclosure disposed on the substrate, a port defined in one of the substrate or the enclosure;an acoustic transducer configured to generate an electrical signal responsive to acoustic activity, the acoustic transducer comprising a membrane separating a front volume from a back volume of the microphone assembly, the front volume in fluidic communication with the port;an integrated circuit electrically coupled to the acoustic transducer and configured to receive the electrical signal from the acoustic transducer and generate an output signal representing the acoustic activity; anda thermal barrier layer comprising an aerogel and formulated to have a thermal conductivity less than a thermal conductivity of air and a thickness of less than 50 microns, the thermal barrier layer positioned on at least one interior surface of a boundary defining the back volume.2. The microphone assembly of claim 1 , wherein the thermal barrier layer has a thickness of less than 25 microns.3. The microphone assembly of claim 1 , wherein the ...

IN-EAR HEADPHONE

An in-ear headphone includes a shell, a speaker, a circuit board, and a sensing structure. The shell has an accommodating space. The speaker is disposed in the accommodating space. The circuit board is disposed in the accommodating space, and the circuit board is electrically connected to the speaker. A sensing chip is disposed on the circuit board. The sensing structure includes a sensing sound tube and a transmission member. The sensing sound tube protrudes from a front end of the shell and has a conductor. The sensing sound tube is electrically connected to the sensing chip by the transmission member. A material of the sensing sound tube is different from a material of the shell. 1. An in-ear headphone , comprising:a shell, internally comprising an accommodating space;a speaker, disposed in the accommodating space;a circuit board, disposed in the accommodating space, electrically connected to the speaker, and provided with a sensing chip;a sensing structure, comprising a sensing sound tube and a transmission member, wherein the sensing sound tube protrudes from a front end of the shell and the whole sensing sound tube is a conductor, the sensing sound tube is electrically connected to the sensing chip by the transmission member, and a material of the sensing sound tube is different from a material of the shell,wherein the accommodating space is defined with a front cavity and a rear cavity by location of the speaker, the front cavity is communicated with the rear cavity through a guide channel, and pressure of the front cavity is guided to the rear cavity by the guide channel; andan inner support, disposed in the accommodating space, the speaker is located inside the inner support, and the guide channel is formed in at least one of the inner support and the shell.2. The in-ear headphone according to claim 1 , wherein the circuit board is located in the rear cavity claim 1 , and the sensing sound tube is partially located in the front cavity and is communicated ...

Small Earpiece Enhanced On-Ear Detection with Multiple Cap Sense

An earpiece including an earbud. The earbud includes a stem having a proximal end and a distal end, a speaker disposed inside the stem at the distal end, and a sleeve disposed inside the stem. The earpiece also includes a housing connected to the proximal end of the stem. The housing contains firmware configured to communicate electronically with the speaker and to communicate wirelessly with an external device. The housing also contains curved partial sleeves. Each of the curved partial sleeves is adjacent an inner surface of a wall of the housing. 1. An earpiece comprising: a stem having a proximal end and a distal end,', 'a speaker disposed inside the stem at the distal end, and', 'a sleeve disposed inside the stem; and, 'an earbud comprising firmware configured to communicate electronically with the speaker and to communicate wirelessly with an external device, and', 'a plurality of curved partial sleeves, each of the plurality of curved partial sleeves adjacent an inner surface of a wall of the housing., 'a housing connected to the proximal end of the stem, the housing containing2. The earpiece of claim 1 , further comprising: measure a first change in electrical capacitance of the sleeve,', 'measure a plurality of changes in electrical capacitance of corresponding ones of the plurality of curved partial sleeves, and', the first change in electrical capacitance exceeds a first threshold, and', 'a preselected number of the plurality of curved partial sleeves have changes in electrical capacitance that exceed corresponding individual thresholds set for each of the plurality of curved partial sleeves., 'set the earpiece to an “on ear” condition when the following conditions are satisfied], 'a processor in communication with the firmware, the sleeve, and the plurality of partially curved sleeves, the processor programmed to3. The earpiece of claim 1 , wherein each of the individual thresholds are equal to each other.4. The earpiece of claim 1 , wherein the sleeve ...

PHANTOM POWER SUPPLY DEVICE

A phantom power supply device supplies a power supply current to a condenser microphone from a positive terminal of the first DC power supply through a hot and cold supply resistors in the hot and the cold signal line, and includes a remote control switch. A negative terminal, being connected in series to a negative terminal of the first DC power supply in a voltage-adding manner, of the second DC power supply is connected to the switch, and an added voltage of the first and second DC supply is fed to the current drive element on the condenser microphone by an ON operation of the remote control switch. This configuration enables the LEDs connected in series mounted on the condenser microphone to be lit up with enough light emitting luminance even when a low voltage, such as 12 V, is selected as a phantom power supply voltage. 1. A phantom power supply device for supplying power to a condenser microphone from which an audio signal is outputted through a balanced line having a hot signal line and a cold signal line , the phantom power supply device comprising:a remote operation switch that supplies a power supply current from a positive terminal of a first DC power supply to the condenser microphone in the hot signal line and the cold signal line through a hot supply resistor and a cold supply resistor, respectively, and controls a current drive device mounted on the condenser microphone to be conducted,wherein a power supply current from a positive terminal of the first DC power supply is fed to the condenser microphone through a hot supply resistor and a cold supply resistor in the hot signal line and the cold signal line, respectively; the remote control switch controls a feeding current to a current drive element mounted on the microphone; a negative terminal, being connected in series to a negative terminal of the first DC power supply in the voltage-adding manner, of the second DC power supply is connected to the switch, and an added voltage of the first DC ...

MEMS Microphone System with Low Pressure Gap and Back Volume

A MEMS microphone system comprises a transducer die having a pierce-less diaphragm and a motion sensor suspended from the diaphragm. The system further comprises a housing and the diaphragm divided a volume inside the housing into a front volume and a back volume. The motion sensor suspended from the diaphragm is located in the back volume having a gas pressure that is substantially equal or lower than an ambient pressure.

Microphone Structure for Cell Phone Real-Time Voice Translation in Traveling

A microphone structure for cell phone real-time voice translation in traveling includes primarily a set of microphone screens, a hollow tube, a transmission line, an electret condenser PCB assembly, a set of PCB assembly covers (front and rear), and a plug. Upon being used with voice translation software, the microphone structure is used by inserting into a cell phone charging jack and turning off a microphone on the cell phone. The disclosed structure can utilize two unidirectional microphones or one bidirectional microphone, with a transmission line being added between the microphone and the plug, so as to maintain a clear sound quality for a cell phone owner and a dialogue person within a social distance zone, thereby enabling the voice translation to be accurate and smooth. 1. A microphone structure for cell phone real-time voice translation in traveling , comprising:a set of first unidirectional microphone, front microphone screen, second unidirectional microphone and rear microphone screen which are disposed respectively on each end of a hollow tube;the hollow tube further comprising an annular surface having a hole for transfixing with a microphone head and a PCB (Printed Circuit Board) assembly connection wire; andan electret condenser PCB assembly, which is provided with a plug and is affixed to a front PCB assembly cover and a rear PCB assembly cover;wherein the first and second unidirectional microphones are a bidirectional microphone.2. The microphone structure for cell phone real-time voice translation in traveling claim 1 , according to claim 1 , wherein a transmission line is disposed between an upper-end microphone assembly and a lower-end plug assembly.3. The microphone structure for cell phone real-time voice translation in traveling claim 1 , according to claim 1 , wherein the microphone is sheathed into a fitted clothes peg. The present invention relates to a microphone structure which is directly used in cell phone real-time voice translation, ...

Magnetic earphones holder

One or more sensors are configured to contextualize a series of user generated movements to control one or more electronic devices. For example, a set of earphones comprises one or more sensors for sensing a location of the earphones. The one or more sensors enable earphones such as a pair of bluetooth or earphones wirelessly coupled to a bluetooth enabled electronic device, the capability to understand the configuration of use of the earphones. Based on a location and use or non-use of the earphones, one or more contextual responses is able to be applied for a given action. In addition, a garment comprises one or more sensors for sensing a motion of a user as the garment is being used. The one or more sensors allow the user to control one or more electronic devices through a series of user generated movements.

SYSTEM, METHOD AND APPARATUS FOR TRANSLATING, CONVERTING AND/OR TRANSFORMING AUDIO ENERGY INTO HAPTIC AND/OR VISUAL REPRESENTATION

A device can be worn by a user and can include a microphone to analyze music and other sound in the surrounding environment. In one embodiment, the device can translate audio into a haptic and/or light of the sound's or music's bassline, in real-time. In one embodiment, no music is recorded by the device. The haptic or vibrational representation of the music can be generated by a motor. In some examples, the light representation of the music can be generated via a red/green/blue light emitting diode. 1. A system for translating , converting or transforming audio energy into at least one haptic or a visual representation , comprising:a microphone that converts a plurality of physical sound waves into an output signal;a plurality of first filters that smooth frequencies of the output signal in an audible range;a second filter that attenuates frequencies of the output signal in the audible range above a predetermined frequency;a processor; and apply a moving window across a plurality of time intervals that comprise the output signal to measure a plurality of power values from the plurality of time intervals that comprise the output signal;', 'calculate a minimum average power value and a maximum average power value across the plurality of time intervals;', 'apply a linear compression and a non-linear compression that scale the output signal to a normalized range; and', 'render a plurality of visual outputs or a haptic output in response to the normalized range., 'a memory operatively coupled to the processor and having computer readable instructions stored thereon which, when executed by the processor, causes the processor to2. The system of claim 1 , wherein at least one the plurality of first filters allows all frequencies below a predetermined frequency to pass through it.3. The system of claim 1 , wherein the visual output is based on a power value.4. The system of claim 1 , wherein the haptic output and visual output is rendered in real-time.5. The system of claim ...

GRADIENT MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) MICROPHONE

In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal. 1. A micro-electro-mechanical systems (MEMS) microphone assembly comprising:an enclosure;a single micro-electro-mechanical systems (MEMS) transducer positioned within the enclosure; anda plurality of substrate layers to support the single MEMS transducer,wherein the plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.2. The microphone assembly of :wherein the enclosure defines a first acoustic port and a second acoustic port;wherein the first acoustic port is acoustically coupled to the first transmission mechanism to enable the first side of the single MEMS transducer to receive the audio input signal; andwherein the second port is acoustically coupled to the second transmission mechanism to enable the second side of the single MEMS transducer to receive the audio input signal.3. The microphone assembly of wherein the enclosure defines a first acoustic cavity on the first side of the single MEMS transducer and a second acoustic cavity on the second side of the single MEMS transducer claim 1 , wherein the first transmission mechanism includes a first acoustic hole that is directly acoustically coupled with the first acoustic cavity; and wherein ...

INTRINSICALLY-SAFE MICROPHONE ASSEMBLY

A microphone assembly includes a housing having a host device interface, a MEMS transducer disposed in the housing and configured to generate electrical signals in response to acoustic activity, an integrated circuit disposed in the housing and configured to process the electrical signals from the MEMS transducer and generate an output representative of the acoustic activity, a host communication path between the integrated circuit and contacts of the host device interface, and a secure communication path between the integrated circuit and an output interface. The secure communication path is isolated from the host communication path. The integrated circuit is configured to indicate a state of the microphone assembly at the output interface via the secure communication path in response to a command received at the microphone assembly. 130-. (canceled)31. A microphone assembly comprising:a housing having a host device interface;a microelectromechanical systems (MEMS) transducer disposed in the housing and configured to generate electrical signals in response to acoustic activity;an integrated circuit disposed in the housing and configured to process the electrical signals from the MEMS transducer and generate an output representative of the acoustic activity;a host communication path between the integrated circuit and contacts of the host device interface;a secure communication path between the integrated circuit and an output interface, the secure communication path isolated from the host communication path;the integrated circuit configured to indicate a state of the microphone assembly at the output interface via the secure communication path in response to a command received at the microphone assembly.32. The microphone assembly of claim 31 , wherein the integrated circuit is configured to change the state of the microphone assembly to a new state in response to a command and to provide a new state indication signal at the output interface via the secure ...

MICROPHONE AND MANUFACTURING METHOD THEREOF

A microphone includes: a case that is vibrated by a vibration signal, a sound inlet through which a sound signal is input being formed at a portion of the case; a first sound element that is formed in the case at a position corresponding to the sound inlet and receives the sound signal and the vibration signal to output a first initial signal; a second sound element that is formed to be adjacent to the first sound element and receives the vibration signal to output a second initial signal; and a semiconductor chip that is connected to the first sound element and the second sound element and receives the first initial signal and the second initial signal to output a final signal. 1. A microphone comprising:a case that is vibrated by a vibration signal, a sound inlet through which a sound signal is input being formed at a portion of the case;a first sound element that is formed in the case at a position corresponding to the sound inlet and receives the sound signal and the vibration signal to output a first initial signal;a second sound element that is formed to be adjacent to the first sound element and receives the vibration signal to output a second initial signal; anda semiconductor chip that is connected to the first sound element and the second sound element and receives the first initial signal and the second initial signal to output a final signal.2. The microphone of claim 1 , wherein the semiconductor chip: i) divides the first initial signal into a sound signal and a vibration signal claim 1 , ii) modulates a phase of the second initial signal claim 1 , iii) merges the first initial signal with the divided sound signal and vibration signal claim 1 , and iv) merges the second initial signal with the phase-modulated signal to cancel the vibration signal and extract the sound signal.3. The microphone of claim 1 , wherein an air passage is formed at a side of a lower portion of the second sound element.4. The microphone of claim 1 , wherein the case includes:a ...

MICROPHONE ARRAY SPEECH ENHANCEMENT

Speech received from a microphone array is enhanced. In one example, a noise filtering system receives audio from the plurality of microphones, determines a beamformer output from the received audio, applies a first auto-regressive moving average smoothing filter to the beamformer output, determines noise estimates from the received audio, applies a second auto-regressive moving average smoothing filter to the noise estimates, and combines the first and second smoothing filter outputs to produce a power spectral density output of the received audio with reduced noise. 133.-. (canceled)34. A method of filtering audio from a microphone array comprising:receiving audio from a plurality of microphones;determining a beamformer output from the received audio;applying a first auto-regressive moving average smoothing filter to the beamformer output;determining noise estimates from the received audio;applying a second auto-regressive moving average smoothing filter to the noise estimates; andcombining the first and second smoothing filter outputs to produce a power spectral density output of the received audio with reduced noise.35. The method of claim 34 , further comprising determining a harmonic noise model using the first smoothing filter and wherein combining comprises combining the harmonic noise model claim 34 , wherein the harmonic noise model is determined by determining an estimate for a log spectral power of harmonic voice components of a gain from the first smoothing filter.36. The method of claim 35 , wherein determining an estimate for a log spectral power comprises combining a log of the power spectral density of the beamformer output with a log of the gain from the first smoothing filter.37. The method of claim 34 , further comprising determining a comfort noise using the second smoothing filter and wherein combining comprises combining the comfort noise claim 34 , wherein the comfort noise is determined by applying a function of the second smoothing filter ...

MICROPHONE ARRAY NOISE SUPPRESSION USING NOISE FIELD ISOTROPY ESTIMATION

Noise is suppressed from a microphone array by estimating a noise field isotropy. In some examples audio is received from a plurality of microphones. A power spectral density of a beamformer output is determined and a power spectral density of microphone noise differences is determined. A noise power spectral density is determined using a transfer function and the noise power spectral density is applied to the beamformer output power spectral density to produce a power spectral density output of the received audio with reduced noise. 1. A method of filtering audio from a microphone array comprising:receiving audio from a plurality of microphones;determining a beamformer output from the received audio;determining a power spectral density of the beamformer output;determining pair-wise microphone power spectral density noise differences;multiplying a transfer function by a sum of the pair-wise microphone power spectral density differences;determining a noise power spectral density using the transfer function multiplication; andapplying the noise power spectral density to the beamformer output power spectral density to produce a power spectral density output of the received audio with reduced noise.2. The method of claim 1 , wherein the transfer function is determined by estimating a running median of logarithms of per-frame transfer functions.3. The method of claim 1 , wherein the transfer function is a transfer function between the pair-wise noise power spectral density differences and the beamformer output noise power spectral density.4. The method of claim 1 , further comprising determining the transfer function by summing differences between a log of the beamformer output power spectral density and a log of the pair-wise microphone power spectral density over frequencies that are likely to contain primarily the desired audio.5. The method of claim 4 , wherein determining the noise power spectral density comprises applying the transfer function to the pair-wise ...

MICROPHONE SENSOR

A microphone sensor provides, a receiving space disposed on a cover and a control module and positioned with a sound sensing module in the receiving space. The microphone sensor includes a cover having a receiving groove formed at a lower portion and an air inlet that a sound signal flow in through within a control module coupled to the lower portion of the cover. Furthermore, a sound sensing module is coupled to the control module and positioned at the receiving groove. 1. A microphone sensor , comprising:a cover including a receiving groove formed at a lower portion and an air inlet that inflows a sound signal;a control module coupled to the lower portion of the cover; anda sound sensing module coupled to the control module and positioned at the receiving groove.2. The microphone sensor of claim 1 , wherein the control module includes a circuit unit formed within the receiving groove.3. The microphone sensor of claim 2 , wherein the sound sensing module is electrically connected to the circuit unit of the control module through the contact unit.4. The microphone sensor of claim 3 , wherein the contact unit includes:a transmitting unit formed at both sides of a substrate of the sound sensing module; anda coupling unit having a first side coupled to the transmitting unit and the lower portion of the sound sensing module and a second side coupled to the control module.5. The microphone sensor of claim 4 , wherein the transmitting unit includes:a penetration aperture formed at both sides of a substrate of the sound sensing module; anda filler disposed within the penetration aperture.6. The microphone sensor of claim 4 , wherein the contact unit is coupled to the coupling unit and further includes a pad formed within the control module.7. The microphone sensor of claim 1 , wherein the air inlet is formed on at least one of an upper portion claim 1 , a right and a left portion claim 1 , and both sides of the cover.8. The microphone sensor of claim 1 , wherein the cover ...

MICROPHONE

A microphone includes a case including a plurality of sound holes; a first sound device installed at positions corresponding to at least two sound holes in the case; a second sound device spaced apart from the first sound device in the case and installed at a position corresponding to at least one sound hole; and a semiconductor chip electrically connected to the first sound device and the second sound device, where the at least two sound holes formed in the positions corresponding to the first sound device are each formed in upper and lower surfaces of the case on the basis of the first sound device. 1. A microphone comprising:a case in which a plurality of sound holes are formed;a first sound device mounted in the case and installed at a position corresponding to at least two sound holes formed in an upper surface and a lower surface of the case, respectively;a second sound device mounted in the case, installed to be spaced apart from the first sound device by a predetermined interval, and installed at a position corresponding to another sound hole formed in the case; anda semiconductor chip electrically connected to the first sound device and the second sound device.2. The microphone of claim 1 , wherein:the first sound device and the second sound device are omnidirectional sound devices.3. The microphone of claim 1 , wherein:the first sound device receives sound source signals through each of the at least two sound holes formed in the upper and lower surfaces of the case and transmits a first sound output signal, which is a bi-directional signal, to the semiconductor chip.4. The microphone of claim 3 , wherein:the semiconductor chip receives a second sound output signal, which is an omnidirectional signal, from the second sound device, and outputs a final sound signal, which is a uni-directional signal, using the first sound output signal and the second sound output signal.5. The microphone of claim 1 , wherein:the semiconductor chip is electrically connected to ...

MICROELECTROMECHANICAL MICROPHONE HAVING A STATIONARY INNER REGION

A microelectromechanical microphone has a stationary region or another type of mechanically supported region that can mitigate or avoid mechanical instabilities in the microelectromechanical microphone. The stationary region can be formed in a diaphragm of the microelectromechanical microphone by rigidly attaching, via a rigid dielectric member, an inner portion of the diaphragm to a backplate of the microelectromechanical microphone. The rigid dielectric member can extend between the backplate and the diaphragm. In certain embodiments, the dielectric member can be hollow, forming a shell that is centrosymmetric or has another type of symmetry. In other embodiments, the dielectric member can define a core-shell structure, where an outer shell of a first dielectric material defines an inner opening filled with a second dielectric material. Multiple dielectric members can rigidly attach the diaphragm to the backplate. An extended dielectric member can rigidly attach a non-planar diaphragm to a backplate. 1. A microelectromechanical microphone , comprising:a stationary plate defining multiple openings; anda movable plate defining an outer portion and an inner opening substantially centered at geometric center of the movable plate,the movable plate is rigidly attached to the stationary plate via a hollow dielectric member extending from a surface of the stationary plate to a surface of the movable plate in a vicinity of the inner opening, wherein a region containing an interface between with the movable plate and the hollow dielectric member is acoustically inactive.2. The microelectromechanical microphone of claim 1 , wherein the hollow dielectric member defines a substantially centrosymmetric shell having a thickness and defining a cross-section claim 1 , and wherein a ratio between a width of the cross-section and the thickness is in a range from about 10 to about 25.3. The microelectromechanical microphone of claim 2 , wherein the stationary plate comprises silicon ...

TRANSDUCER PACKAGE WITH THROUGH-VIAS

A microphone includes a microelectromechanical system (MEMS) die configured to sense an acoustic signal, a base, and a lid. The base has a top surface and a bottom surface. The bottom surface includes a first electrical pad and a second electrical pad. The first electrical pad and the second electrical pad are configured to transmit an electrical signal indicative of the acoustic signal. The lid has a top surface and a bottom surface. The lid includes a cavity that surrounds the MEMS die. The top surface of the lid includes a third electrical pad and a fourth electrical pad. The first electrical pad and the third electrical pad are electrically connected, and the second electrical pad and the fourth electrical pad are electrically connected. 1. A microphone comprising:a microelectromechanical system (MEMS) die configured to sense an acoustic signal,a base with a top surface and a bottom surface, wherein the bottom surface comprises a first electrical pad and a second electrical pad, wherein the first electrical pad and the second electrical pad are configured to transmit an electrical signal indicative of the acoustic signal; anda lid with a top surface and a bottom surface, wherein the lid comprises a cavity that surrounds the MEMS die, and wherein the top surface of the lid comprises a third electrical pad and a fourth electrical pad, wherein the first electrical pad and the third electrical pad are electrically connected, and wherein the second electrical pad and the fourth electrical pad are electrically connected.2. The microphone of claim 1 , wherein the base comprises a port that allows the acoustic signal to pass through the base.3. The microphone of claim 1 , wherein the first electrical pad and the third electrical pad are electrically connected by way of a first via through the lid claim 1 , and wherein the second electrical pad and fourth electrical pad are electrically connected by way of a second via through the lid.4. The microphone of claim 1 , ...

MEMS SENSOR WITH PARTICLE FILTER AND METHOD FOR PRODUCING IT

The semiconductor device includes a microelectromechanical system (MEMS) chip having a first main surface and a second main surface situated opposite the first main surface, a first glass-based substrate, on which the MEMS chip is arranged by its first main surface, and a second substrate, which is arranged on the second main surface of the MEMS chip, wherein the MEMS chip has a first recess connected to the surroundings by way of a plurality of perforation holes arranged in the first substrate. 1. A semiconductor device , comprising:a microelectromechanical system (MEMS) chip having a first main surface and a second main surface situated opposite the first main surface;a first glass-based substrate on which the first main surface of the MEMS chip is arranged, wherein the first glass-based substrate includes a plurality of perforation holes; anda second substrate which is arranged on the second main surface of the MEMS chip,wherein the first main surface of the MEMS chip has a first recess connected to an external environment by way of the plurality of perforation holes that extend through the first glass-based substrate between the first recess and the external environment.2. The semiconductor device as claimed in claim 1 , wherein the MEMS chip has a sensor or a microphone arranged in the first recess.3. The semiconductor device as claimed in claim 2 , wherein the MEMS chip has a membrane claim 2 , wherein the first recess extends to the membrane.4. The semiconductor device as claimed in claim 2 , wherein:the sensor is one or more of a pressure sensor, a sound sensor, a microphone, a gas sensor, or a combined pressure and acceleration sensor.5. The semiconductor device as claimed in claim 1 , wherein:a diameter of each of the plurality of perforation holes is in a range of 3 μm to 50 μm.6. The semiconductor device as claimed in claim 1 , wherein:the plurality of perforation holes are arranged regularly, in a matrix-shaped fashion or point-symmetrically around a ...

MICROPHONE PACKAGE

A microphone includes a substrate defining an embedded cavity between a first surface of the substrate and an opposing second surface of the substrate, the first surface defining a first opening into the embedded cavity, a distance between the first surface and the second surface defining a substrate thickness. A cover is disposed over the first surface of the substrate and forms a housing, the cover including a port, the substrate thickness being greater than a height of the cover from the first surface of the substrate. A microelectromechanical systems (MEMS) transducer is disposed in the housing and mounted on the first surface of the substrate over the first opening, and an integrated circuit (IC) is disposed in the housing and electrically coupled to the MEMS transducer. The MEMS transducer and the IC are disposed in a front volume of the housing defined by the cover and the substrate. 1. A microphone comprising:a substrate defining an embedded cavity between a first surface of the substrate and an opposing second surface of the substrate, the first surface defining a first opening into the embedded cavity, a distance between the first surface and the second surface defining a substrate thickness;a cover disposed over the first surface of the substrate and forming a housing, the cover including a port, the substrate thickness being greater than a height of the cover from the first surface of the substrate;a microelectromechanical systems (MEMS) transducer disposed in the housing and mounted on the first surface of the substrate over the first opening; andan integrated circuit (IC) disposed in the housing and electrically coupled to the MEMS transducer,the MEMS transducer and IC disposed in a front volume of the housing, the front volume defined by the cover and the substrate,wherein the port extends between the front volume and an exterior of the housing.2. The microphone of claim 1 , wherein the cover includes a thin region claim 1 , a thickness of the thin ...

MICROPHONE AND METHOD OF TESTING A MICROPHONE

The microphone comprises a housing (), which has an inner volume () filled with a gas, an opening () of the housing, an acoustic sensor () arranged in the housing, a diaphragm () of the acoustic sensor located above the opening, and a heater () in the inner volume. The acoustic sensor may especially comprise a microelectromechanical system. The gas is heated from inside the inner volume to increase the pressure and generate a corresponding signal of the acoustic sensor (). This signal can be used for self-calibration of the sensitivity or for self-diagnostics to check the function of the microphone. 1. A microphone , comprising:a housing, an inner volume of the housing being filled with a gas;an opening of the housing;an acoustic sensor in the housing;a diaphragm of the acoustic sensor above the opening, the diaphragm separating the inner volume from the opening, anda heater in the inner volume, the heater being configured to increase the pressure of the gas by heating and thus causing the diaphragm, to deflect towards the opening.2. The microphone of claim 1 , further comprising:an integrated circuit chip in the housing; andan electric connection between the integrated circuit chip and the acoustic sensor.3. The microphone of claim 1 , wherein the heater is integrated in the acoustic sensor.4. The microphone of claim 2 , wherein the heater is integrated in the integrated circuit chip.5. The microphone of claim 1 , further comprising:a heater chip in the housing, the heater being integrated in the heater chip.6. The microphone of claim 1 , further comprising: a pressure sensor in the inner volume of the housing.7. The microphone of claim 1 , wherein the diaphragm is a deflectable membrane.8. The microphone of claim 1 , wherein the diaphragm is a transparent or semitransparent plate.9. The microphone of claim 1 , wherein the acoustic sensor is a microelectromechanical system.10. A method of testing a microphone having a housing with an opening claim 1 , an inner ...

Electronic Device

An electronic device. The electronic device includes: a microphone module, a data input/output interface module, and a sound transmission channel. The data input/output interface module includes an input/output interface jack. The sound transmission channel includes a first port and a second port, the first port meets the input/output interface jack, and the second port meets the microphone module. 1. An electronic device , comprising:a microphone module;at least one data input/output interface module, comprising an input/output interface jack; andat least one sound transmission channel, comprising a first port and a second port,wherein the first port meets the input/output interface jack, and the second port meets the microphone module.2. The electronic device according to claim 1 , wherein the data input/output interface module further comprises a plastic part claim 1 , and the sound transmission channel is located in the plastic part of the data input/output interface module.3. The electronic device according to claim 1 , wherein the first port of the sound transmission channel is disposed on a side wall of the input/output interface jack.4. The electronic device according to claim 1 , wherein the at least one data input/output interface module includes a plurality of data input/output interface modules claim 1 , the at least one sound transmission channel includes a plurality of sound transmission channels which are in one-to-one correspondence with the plurality of data input/output interface modules claim 1 , and an input/output interface jack of each of the plurality of data input/output interface modules meets the microphone module through a corresponding sound transmission channel.5. The electronic device according to claim 1 , wherein the data input/output interface module further comprises a conductive-shielding shell claim 1 , the conductive-shielding shell comprises an opening claim 1 , and the input/output interface jack meets the microphone module ...

Digitally Controlled Microphone with Audio Compressor

A digitally controlled microphone with audio compressor includes a capsule; a compressor circuitry having a compressor engine, a digitally controlled root mean square (RMS) detector and a digitally controlled analog processor; a bypass switch to the compressor circuitry; an analog to digital converter (ADC); a digital processor that sends digital audio to a host and receives a second digital audio signal; a digital to analog converter (DAC) and a summing circuit that combine the audio with the audio from the host and send it to a digitally-controlled headphone amplifier and a headphone jack; a microphone body; a serial host interface connector; and hardware controls on the microphone body. 1. A microphone comprising:a capsule that converts sound waves into an analog audio signal;a compressor circuitry that receives and compresses the analog audio signal; anda microphone body that encloses the compressor circuitry and capsule.2. The microphone of claim 1 , further comprising:an interface that outputs the compressed analog audio signal.3. The microphone of claim 1 , further comprising:an analog to digital converter (ADC) that converts the compressed analog audio signal into a compressed digital audio signal; andan interface that outputs the compressed digital audio signal.4. The microphone of claim 3 , further comprising:a digital processor that receives a second digital audio signal;a digital to analog converter (DAC) that converts the second digital audio signal into a second analog audio signal; anda headphone jack on the microphone body that outputs the second analog audio signal.5. The microphone of claim 1 , further comprising:a bypass switch that receives the analog audio signal and allows for a bypass path to the compressor circuitry, thereby providing an optionally-compressed analog audio signal; andan interface that outputs the optionally compressed digital audio signal.6. The microphone of claim 1 , further comprising:a bypass switch that receives the ...

STACKED CHIP MICROPHONE

A microphone device comprises a base, a port formed in the base, a cover attached to the base that forms a housing interior with the base, an MEMS element disposed in the housing interior and on top of the port, and an integrated circuit stacked on top of the MEMS element. The MEMS element includes a diaphragm and a backplate opposing the diaphragm. The integrated circuit includes an active surface and a substrate supporting the active surface. Circuitry and/or connectors are formed on the active surface for processing signals produced by the MEMS element. The substrate faces the MEMS element. 1. A microphone device comprising:a base;a port formed in the base;a cover attached to the base that forms a housing interior with the base;an MEMS element disposed in the housing interior and on top of the port, wherein the MEMS element includes a diaphragm and a backplate opposing the diaphragm;an integrated circuit stacked on top of the MEMS element, wherein the integrated circuit includes an active surface and a substrate supporting the active surface, wherein the active surface comprises circuitry for processing signals produced by the MEMS element, wherein the substrate is between the MEMS element and the active surface; andsolder bumps forming a connection between the MEMS element and the integrated circuit, the solder bumps forming air gaps between the MEMS element, the integrated circuit, and the solder bumps through which air flows from the MEMS element to a back volume of the microphone device.2. The microphone device of claim 1 , wherein the integrated circuit is an application specific integrated circuit (ASIC).3. (canceled)4. The microphone device of claim 1 , wherein the solder bumps are substantially spherical with a diameter of about 100 μm.5. The microphone device of claim 1 , wherein the integrated circuit further comprises conductive vias extending therethrough that electrically connect the solder bumps to the active surface.6. (canceled)7. The microphone ...

ACTIVE HEARING PROTECTION DEVICE AND METHOD THEREFORE

An earpiece adapts to the acoustics characteristics and needs of its user to provide a perceptually transparent hearing protection, apart from uniform loudness reduction. An occlusion effect (OE) active noise control (ANC) system reduces the augmented perception of one's own voice while occluded. This occlusion effect active control adapts to the specific acoustic characteristics N of the user to provided better control of the details occlusion effect reduction, and enhanced performances relative to fixed or one-size-fits-all solutions. An isolation effect (IE) filtering algorithm adapts itself to the user's acoustic characteristics to provide a uniform attenuation either in dB or in phons. Additionally, the device may be used as an in-ear monitor that also adapts to its user characteristics to provide in-ear quality sound. 1. A hearing protection device for protecting an ear of a user while reducing an occlusion effect and/or an isolation effect induced by the hearing protection device , the device comprising:an earpiece adapted to be located into the ear for occluding an ear canal of the ear, said earpiece having an inner-ear microphone (IEM) adapted to be in fluid communication with the occluded ear canal, an outer-ear microphone (OEM) adapted to be in fluid communication with an adjacent environment outside the ear, and a receiver adapted to be in fluid communication with the occluded ear canal; anda controller connecting to the inner-ear microphone (IEM) to receive an internal signal therefrom over a predetermined frequency range and to the outer-ear microphone (OEM) to receive an external signal therefrom over the predetermined frequency range, said controller digitally actively processing the internal and external signals taking into account individual acoustic characteristics of the occluded ear canal and sending a processed signal to the receiver, the processed signal and the internal signal producing an actual signal having an actual sound pressure level ...

MICROPHONE AND MANUFACTURING METHOD THEREOF

A microphone includes: a case that is vibrated by a vibration signal, a sound inlet through which a sound signal is input being formed at a portion of the case; a first sound element that is formed in the case at a position corresponding to the sound inlet and receives the sound signal and the vibration signal to output a first initial signal; a second sound element that is formed to be adjacent to the first sound element and receives the vibration signal to output a second initial signal; and a semiconductor chip that is connected to the first sound element and the second sound element and receives the first initial signal and the second initial signal to output a final signal. 1. A microphone comprising:a case that is vibrated by a vibration signal, a sound inlet through which a sound signal is input being formed at a portion of the case;a first sound element that is formed in the case at a position corresponding to the sound inlet and receives the sound signal and the vibration signal to output a first initial signal;a second sound element that is formed to be adjacent to the first sound element and receives the vibration signal to output a second initial signal; anda semiconductor chip that is connected to the first sound element and the second sound element and receives the first initial signal and the second initial signal to output a final signal.2. The microphone of claim 1 , wherein the semiconductor chip: i) divides the first initial signal into a sound signal and a vibration signal claim 1 , ii) modulates a phase of the second initial signal claim 1 , iii) merges the first initial signal with the divided sound signal and vibration signal claim 1 , and iv) merges the second initial signal with the phase-modulated signal to cancel the vibration signal and extract the sound signal.3. The microphone of claim 1 , wherein an air passage is formed at a side of a lower portion of the second sound element.4. The microphone of claim 1 , wherein the case includes:a ...

Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals

A surface mountable microphone package includes a first microphone and a second microphone. Furthermore, the surface mountable microphone package includes a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package. 1. A surface mountable microphone package comprising:a first microphone;a second microphone;a first opening for the first microphone; anda second opening for the second microphone;wherein the first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.2. The surface mountable microphone package according to claim 1 , wherein the surface mountable microphone package comprises no further microphone inside the surface mountable microphone package.3. The surface mountable microphone package according to claim 1 , wherein the first microphone and the second microphone are monolithically integrated together.4. The surface mountable microphone package according to claim 1 ,wherein the first microphone comprises a first chip and the second microphone comprises a second chip; andwherein the first chip of the first microphone and the second chip of the second microphone are separated from each other.5. The surface mountable microphone package according to claim 1 ,wherein the first opening is fluidically connected to a first diaphragm of the first microphone such that sound waves entering the first opening are recorded by the first microphone; andwherein the second opening is fluidically connected to a second diaphragm of the second microphone such that sound waves entering the second opening are recorded by the second microphone.6. The surface mountable microphone package according to claim 1 , wherein the first opening and the second opening are fluidically separated from each other in the surface mountable microphone package.7. The surface mountable microphone package ...

WEARABLE MICROPHONE HOUSING WITH BUILT-IN REDUNDANCY

A wearable audio apparatus used to support multiple audio components, namely, microphones. The audio apparatus can have a single housing that contains the multiple audio components, or can have multiple housings that contain individual audio components. The housing can be easily worn by a user, such as by coupling to a headset, ear mount/hook, user's clothing, or user's body. The microphones can be acoustically matched for rapid swapping without requiring a separate audio setup. The audio components can be mounted astride, offset or near one another in the audio apparatus. The audio components can also be separately wired so that each audio component can be independently activated. 1. A wearable audio apparatus , comprising:a first microphone housing having a first internal cavity;a first microphone positioned and secured within the first internal cavity of the first microphone housing, the first microphone having a first audio responsiveness;a second microphone housing having a second internal cavity;a second microphone positioned and secured within the second internal cavity of the second microphone housing, the second microphone having a second audio responsiveness;a base member;a first microphone extension having a forward end and a base end, the forward end being coupled to the first microphone housing, the rear end being coupled to the base member; anda second microphone extension having a forward end and a base end, the forward end being coupled to the second microphone housing, the rear end being coupled to the base member.2. A wearable audio apparatus as recited in claim 1 , wherein the wearable audio apparatus comprises:a restraining member being configured to secure the rear end of the first microphone extension adjacent the rear end of the second microphone extension.3. A wearable audio apparatus as recited in claim 1 , wherein the second microphone extension has shorter length than the length of the first microphone extension.4. A wearable audio ...

AIRCRAFT GROUND SAFETY FOR ULTRASONIC SENSORS

An acoustic sensor system for an aircraft includes a transmitter configured to emit acoustic signals external to the aircraft, and at least one microphone positioned on an exterior of the aircraft and configured to sense the acoustic signals as sensed data. The acoustic sensor system is configured to direct the acoustic signals to the at least one microphone such that a sound pressure level is attenuated perpendicular to the aircraft. 1. An acoustic sensor system for an aircraft , the acoustic sensor system comprising:a transmitter configured to emit acoustic signals external to the aircraft; andat least one microphone positioned on an exterior of the aircraft and configured to sense the acoustic signals as sensed data;wherein the acoustic sensor system is configured to direct the acoustic signals toward the at least one microphone such that a sound pressure level is attenuated perpendicular to the aircraft.2. The acoustic sensor system of claim 1 , further comprising:an echo protector fixed over the transmitter and shaped to direct the acoustic signals toward the at least one microphone such that the sound pressure level is attenuated perpendicular to the aircraft.3. The acoustic sensor system of claim 2 , wherein the echo protector comprises:a housing that extends from a base to an end; anda directivity feature positioned within the housing and configured to direct the acoustic signals to the at least one microphone.4. The acoustic sensor system of claim 3 , wherein the base includes an opening configured to permit the acoustic signals to reach the directivity feature.5. The acoustic sensor system of claim 4 , wherein the directivity feature is an inverted pyramid connected to the end of the housing claim 4 , and wherein each of a plurality of faces of the inverted pyramid are positioned to direct the acoustic signals.6. The acoustic sensor system of claim 5 , wherein the at least one microphone comprises a plurality of microphones claim 5 , and wherein each of ...

COMPACT ELECTROACOUSTIC TRANSDUCER AND LOUDSPEAKER SYSTEM AND METHOD OF USE THEREOF

An improved loudspeaker that has a plurality of stacks of cards having electrostatic transducers, in which one stack of cards has a different width as another stack of cards in the plurality of stacks. At frequencies above 200 Hz, and at the same drive voltage and current, the stack of lesser width produced significantly greater microphone voltage as compared to the stack of greater width cards. By combining the plurality of stacks of cards with different widths, this provides for the elimination of conventional cone drivers, and provides for improved sound both above and below 200 Hz using only electrostatic transducers. It also assists in maintaining a null sound plane that is beneficial for voice recognition. 1. A loudspeaker comprising:(a) a first stack of cards comprising electrostatic transducers, wherein the first stack has a plurality of first cards having a first width; and (i) the second stack has a plurality of second cards having a second width,', '(ii) the second width is greater than the first width, and', '(iii) the first cards have a mic voltage characteristic relative to the second cards, wherein the mic voltage characteristic comprises that, throughout a range of 300 Hz to 1000 Hz, the first stack has a first height and is operable to produce a greater mic voltage than a same height stack of a plurality of the second cards stacked to the first height when operated at a same drive voltage and current., '(b) a second stack of cards comprising electrostatic transducers, wherein'}2. The loudspeaker of claim 1 , wherein the mic characteristic further comprises that claim 1 , throughout the range of 300 Hz to 1000 Hz claim 1 , the first stack of the first cards is operable to produce a mic voltage that is at least 2.5 times greater than the same height stack of the second cards when operated at the same drive voltage and current.3. The loudspeaker of claim 1 , wherein the mic characteristic further comprises that claim 1 , throughout the range of 300 Hz ...

PIEZOELECTRIC MEMS DIAPHRAGM MICROPHONE

A piezoelectric microelectromechanical systems diaphragm microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can have two or more piezoelectric film layers disposed over the top end of the substrate and defining a diaphragm structure. Each of the two or more piezoelectric film layers can have a predefined residual stress that substantially cancel each other out so that the diaphragm structure is substantially flat with substantially zero residual stress. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when the diaphragm is subjected to sound pressure via the opening in the substrate. 1. A piezoelectric microelectromechanical systems diaphragm microphone , comprising:a substrate defining an opening between a bottom end of the substrate and a top end of the substrate;two or more piezoelectric film layers disposed over the top end of the substrate and defining a diaphragm structure, each of the two or more piezoelectric film layers having a predefined residual stress that substantially cancel each other out so that the diaphragm structure is substantially flat with substantially zero residual stress; andone or more electrodes disposed over the diaphragm structure,wherein the diaphragm structure is configured to deflect when the diaphragm structure is subjected to sound pressure via the opening in the substrate.2. The microphone of wherein the diaphragm structure has a circular shape.3. The microphone of wherein the one or more electrodes disposed over the diaphragm structure include a circumferential electrode disposed over a circumference of the diaphragm structure and a center electrode disposed generally over a center of the diaphragm structure claim 2 , at least a portion of the center electrode spaced apart from the circumferential ...

MICROPHONE AND MANUFACTURE THEREOF

A microphone and its manufacturing method, relating the semiconductor techniques, are presented. The microphone comprises: a substrate comprising an opening, a first electrode layer at the bottom of the opening, and at least one groove adjacent to the first electrode layer, with the groove and the opening on two opposing sides of a bottom surface of the first electrode layer; a separation material layer filling the groove; and a second electrode layer on the separation material layer, wherein the first electrode layer, the separation material layer, and the second electrode layer form a cavity. In this inventive concept, the separation material layer on the groove works as an anchor node embedding in the substrate to increases the effective contact area and the bonding power, and to improve the bonding quality between the second electrode layer and the substrate, which results in a strengthened second electrode layer. 1. A microphone manufacturing method , comprising:providing a first semiconductor structure, comprising a substrate that has at least one groove, and a separation material layer on the substrate filling the groove;providing a second semiconductor structure, comprising a second electrode layer;bonding the first semiconductor structure with the second semiconductor structure, with the separation material layer separating the second electrode layer and the substrate;forming an opening by etching the back side of the substrate;forming a first electrode layer at the bottom of the opening, with the opening and the groove on two opposing sides of a bottom surface of the first electrode layer; andremoving at least a portion of the separation material layer outside the groove, so that the first electrode layer, the separation material layer on the groove, and the second electrode layer form a cavity.2. The method of claim 1 , wherein the first electrode layer comprises:a plurality of first through-holes connecting the opening and the cavity, and being ...

Electronic Devices With Environmental Sensors

An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, a gas sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display. 1. An electronic device comprising:a housing having a first opening;a printed circuit;a rigid support structure attached to the printed circuit;an acoustic component attached to the printed circuit; anda sensor attached to the printed circuit, wherein the rigid support structure and a portion of the printed circuit form an enclosure that surrounds the sensor and the acoustic component, wherein the enclosure comprises a second opening, and wherein air passes through the first and second openings into the enclosure.2. The electronic device defined in claim 1 , wherein the sensor comprises a sensor selected from the group consisting of: a gas sensor claim 1 , a smoke detector claim 1 , a pressure sensor claim 1 , a temperature sensor claim 1 , and a humidity sensor.3. The electronic device defined in claim 2 , wherein the acoustic component comprises a microphone.4. The electronic device defined in claim 1 , wherein the sensor comprises a gas sensor that is configured to measure a concentration of a gas.5. The electronic device defined in claim 4 , ...

Digital Wearable Monitoring Device with Dual Locking System

A digital wearable monitoring device with dual locking system allows parents to monitor and locate a missing or wandering child. The monitoring device is secured to a child and can be removed through biometric signatures of a parent or authorized guardians. The monitoring device is preferred to be a wrist strap; however, the present invention may take the form of a belt, necklace, bracelet, earring, or any other applicable clothing accessory. The monitoring device includes a tactile sensor and at least one input device. The tactile sensor allows the wearer to write, draw, or tap a message to be processed and transmitted to a parent or authority. A location device then allows the parent or authority to locate and rescue the wearer. 1. A digital wearable monitoring device with dual locking system comprises:a band housing;a strap lock;a strap lock receiver;a tactile sensor;at least one biometric input device;a first emergency button;a second emergency button;a microprocessor;a locating device;a wireless transceiver;the band housing comprises a first band strap, a second band strap, and a band face;the first band strap and the second band strap being oppositely positioned to each other along the band face;the strap lock being terminally integrated to the first band strap;the strap lock receiver being terminally integrated into the second band strap;the tactile sensor, the at least one biometric input device, the first emergency button, and the second emergency button being externally mounted into the band housing;the tactile sensor being centrally positioned along the band face;the first emergency button being adjacently positioned to the tactile sensor;the second emergency button being adjacently positioned to the strap locking mechanism;the microprocessor, the locating device, and the wireless transceiver being internally mounted to the band housing; andthe tactile sensor, the at least one biometric input device, the first emergency button, the second emergency button ...

Article of Manufacture Having Microphone Devices Mounted on a Non-Planar Printed Circuit Board

In one embodiment, a microphone array, having a three-dimensional (3D) shape, has a plurality of microphone devices mounted onto (at least one) flexible printed circuit board (PCB), which is bent to achieve the 3D dimensional shape. Output signals from the microphone devices can be combined (e.g., by weighted or unweighted summation or differencing) to form sub-element output signals and/or element output signals, and ultimately a single array output signal for the microphone array. The PCB may be uniformly flexible or may have rigid sections interconnected by flexible portions. Possible 3D shapes include (without limitation) cylinders, spirals, serpentines, and polyhedrons, each formed from a single flexible PCB. Alternatively, the microphone array may be an assembly of multiple, interconnecting sub-arrays, each having two or more rigid portions separated by one or more flexible portions, where each sub-array has at least one cut-out portion for receiving a rigid portion of another sub-array. 1. An article of manufacture comprising:a non-planar printed circuit board (PCB) having a three-dimensional (3D) shape; and each microphone device is an individual transducer that converts acoustic vibrations into an electrical device output signal; and', {'figref': {'@idref': 'DRAWINGS', 'FIGS. 1-6'}, 'the non-planar PCB provides electrical connections that transfer the device output signals from the plurality of microphone devices towards one or more signal-processing stages that process the device output signals from the plurality of microphone devices [e.g., ].'}], 'a plurality of microphone devices mounted on the non-planar PCB, wherein2. The article of claim 1 , further comprising the one or more signal-processing stages [e.g. claim 1 , ].3. The article of claim 2 , wherein at least one of the one or more signal-processing stages is mounted on the non-planar PCB [e.g. claim 2 , Paragraph [0066]].4. The article of claim 2 , wherein at least one of the one or more signal- ...

MICROPHONE WITH PRESSURE SENSOR

A microphone includes a base, a MEMS device, and an integrated circuit. The MEMS device includes a diaphragm and a back plate. The MEMS device is connected to the integrated circuit. The microphone also includes a pressure sensor. A lid enclosed the MEMS device and the integrated circuit. 1. A microphone comprising:a base;a micro electro mechanical system (MEMS) device including a diaphragm and a back plate;an integrated circuit connected to the MEMS device;a pressure sensor; anda lid, wherein the base and the lid enclose the MEMS device and the integrated circuit.2. The microphone of claim 1 , wherein the pressure sensor is coupled to the lid.3. The microphone of claim 2 , wherein the MEMS device is disposed on the base.4. The microphone of claim 3 , wherein the integrated circuit is disposed on the base.5. The microphone of claim 4 , wherein the base comprises a port that extends through the port claim 4 , wherein the MEMS device covers the port to create a front volume.6. The microphone of claim 1 , wherein the pressure sensor comprises a standoff claim 1 , a flexible element claim 1 , and an electrode claim 1 , wherein the flexible element and the standoff define an air pocket.7. The microphone of claim 6 , wherein the flexible element is tape.8. The microphone of claim 7 , wherein the tape comprises a polymide tape.9. The microphone of claim 6 , wherein the air pocket is formed between the standoff and the lid.10. The microphone of claim 9 , wherein the flexible element comprises an opening.11. The microphone of claim 6 , wherein the integrated circuit is configured to sense a change in capacitance from the flexible element claim 6 , the electrode claim 6 , and the standoff.12. The microphone of claim 11 , wherein the integrated circuit is configured to provide a value of pressure based upon the change in capacitance via an external pad.13. The microphone of claim 12 , wherein the integrated circuit is configured to convert the change in capacitance to the ...

MICROPHONE WITH TEMPERATURE SENSOR

A microphone includes a base, a MEMS device, and an integrated circuit. The MEMS device includes a diaphragm and a back plate. The MEMS device is connected to the integrated circuit. The microphone also includes a temperature sensor. A lid enclosed the MEMS device and the integrated circuit. 1. A microphone comprising:a base;a micro electro mechanical system (MEMS) device including a diaphragm and a back plate;a temperature sensor;an integrated circuit connected to the MEMS device and the temperature sensor;a lid, wherein the base and the lid enclose the MEMS device and the integrated circuit.2. The microphone of claim 1 , wherein the temperature sensor is a resistive temperature device.3. The microphone of claim 1 , wherein the temperature sensor is attached to the lid.4. The microphone of claim 3 , wherein the lid comprises a port that extends through the lid.5. The microphone of claim 4 , wherein the integrated circuit is attached to the base.6. The microphone of claim 1 , wherein the temperature sensor is contained within the lid.7. The microphone of claim 1 , wherein the temperature sensor is contained on the MEMS device.8. The microphone of claim 1 , wherein the temperature sensor is attached to the base.9. The microphone of claim 8 , wherein the base comprises a port that extends through the base.10. The microphone of claim 9 , wherein the integrated circuit is attached to the lid.11. The microphone of claim 1 , wherein the temperature sensor comprises plating traces.12. The microphone of claim 11 , further comprising a flex board claim 11 , wherein the plating traces are formed on the flex board claim 11 , and wherein the flex board is attached to the lid.13. A microphone comprising:a base;a micro electro mechanical system (MEMS) device including a diaphragm and a back plate;a temperature sensor, wherein the temperature sensor comprises a metallic structure;an integrated circuit connected to the MEMS device and the temperature sensor;a lid, wherein the base ...

MICROPHONE MODULE FOR ELECTRONIC DEVICE

A microphone module for an electronic device is provided. The microphone module includes a window having at least one microphone hole in a part of an edge of the window, a microphone installed in a position corresponding to the microphone hole of the window, and a case frame coupled with the window and forming an appearance of the electronic device. The microphone module receives an external voice through the microphone hole of the window. 1. A microphone module for an electronic device , the microphone module comprising:a window having at least one microphone hole in a part of an edge of the window; anda microphone installed in a position corresponding to the microphone hole of the window,wherein the microphone module receives an external voice through the microphone hole of the window.2. The microphone module of claim 1 , further comprising a bracket interposed between the window and the microphone claim 1 , wherein the bracket comprises a first surface for installing the microphone claim 1 , a second surface facing the first surface and getting in surface contact with an inner surface of the window claim 1 , a through-hole passing from a position in which the microphone of the first surface is installed claim 1 , to the second surface claim 1 , and a wave guide groove provided to communicate from the through-hole to the microphone hole.3. The microphone module of claim 2 , further comprising a slit of a constant depth and a constant length provided in a position corresponding to the wave guide groove in the inner surface of the window.4. The microphone module of claim 3 , wherein the slit is provided by a double coated tape attached to the inner surface of the window.5. The microphone module of claim 3 , wherein claim 3 , when the window is formed claim 3 , the slit is molded together.6. The microphone module of claim 3 , wherein the microphone is mounted and fixed to a fixing housing installed in an installation groove provided in the first surface of the ...

ASSISTIVE LISTENING DEVICE AND HUMAN-COMPUTER INTERFACE USING SHORT-TIME TARGET CANCELLATION FOR IMPROVED SPEECH INTELLIGIBILITY

An assistive listening device includes a set of microphones including an array arranged into pairs about a nominal listening axis with respective distinct intra-pair microphone spacings, and a pair of ear-worn loudspeakers. Audio circuitry performs arrayed-microphone short-time target cancellation processing including (1) applying short-time frequency transforms to convert time-domain audio input signals into frequency-domain signals for every short-time analysis frame, (2) calculating ratio masks from the frequency-domain signals of respective microphone pairs, wherein the calculation of a ratio mask includes a frequency domain subtraction of signal values of a microphone pair, (3) calculating a global ratio mask from the plurality of ratio masks, and (4) applying the global ratio mask, and inverse short-time frequency transforms, to selected ones of the frequency-domain signals, thereby generating audio output signals for driving the loudspeakers. The circuitry and processing may also be realized in a machine hearing device executing a human-computer interface application. 1. An assistive listening device , comprisingan array of microphones arranged into a plurality of microphone pairs positioned about a nominal listening axis with respective distinct intra-pair microphone spacings, each microphone of the array of microphones generating a respective audio input signal;a pair of ear-worn loudspeakers; andaudio circuitry configured to perform arrayed-microphone short-time target cancellation processing, (1) applying a short-time frequency transform to each of the respective audio input signals, thereby converting the respective time domain signals into respective frequency-domain signals for every short-time analysis frame, (2) calculating ratio masks from the frequency-domain signals of respective microphone pairs, wherein the calculation of a ratio mask includes a frequency domain subtraction of signal values of a microphone pair, (3) calculating a global ratio ...

MOBILE DEVICE HAVING A TUBULAR MICROPHONE INTEGRATED INTO A COVER ASSEMBLY

A mobile device may include an enclosure and a rear cover assembly affixed to a back portion of the enclosure. The rear cover assembly may include a protruding portion that extends above a surrounding portion of the rear cover assembly. The protruding portion may include a number of through holes that extend through the protruding portion of the rear cover assembly. In one through hole, a tubular microphone may be provided. The tubular microphone may include a microphone enclosure which may contain a MEMS microphone device, an integrated circuit, and an interposer positioned between the MEMS microphone device and the integrated circuit. A height of the tubular microphone may be substantially similar to a thickness of the protruding portion and the tubular microphone may be entirely or partially disposed within a through hole of the protruding portion. 1. A mobile device comprising:a touch-sensitive display;an enclosure at least partially surrounding the touch-sensitive display;a glass component coupled to the enclosure and defining a hole that extends through the glass component; and a microphone enclosure positioned within the hole and coupled to the glass component, the microphone enclosure defining an acoustic port;', 'a micro-electro-mechanical system (MEMS) microphone device positioned within the microphone enclosure and adjacent to the acoustic port;', 'an integrated circuit positioned within the microphone enclosure; and', 'an interposer positioned between the MEMS microphone device and the integrated circuit, the interposer operatively coupling the MEMS microphone device and the integrated circuit., 'a microphone assembly comprising2. The mobile device of claim 1 , wherein:the glass component further defines a protruding portion and a base portion surrounding the protruding portion;the protruding portion extends outward from the base portion; andthe hole extends through the protruding portion of the glass component.3. The mobile device of claim 2 , wherein: ...

Compact Home Assistant Having a Controlled Sound Path

A compact electronic device has a touch sensor and/or a microphone that are concealed within a housing at least partially wrapped by an acoustically porous cover. In some implementations, the touch sensor includes a sensing portion and a contact portion extending from the sensing portion. While the sensing portion is placed in proximity to an interior surface of the housing to detect a touch on the housing, the contact portion is bent to electrically couple the sensing portion to a circuit board via two distinct electrical paths. In some implementations, an exterior surface of the housing includes a sealing area surrounding an aperture on the housing, and the acoustically porous cover is affixed to the sealing area via an adhesive. The adhesive covers the sealing area and permeates a thickness of the acoustically porous cover, thereby enabling formation of a controlled sound path to access the microphone via the aperture. 1. An electronic device , comprising:a housing having an exterior surface and an aperture;a microphone enclosed in the housing and having a diaphragm, wherein the diaphragm of the microphone faces the aperture and is configured to receive sound via the aperture; andan acoustically porous cover at least partially covering the exterior surface of the housing, wherein the acoustically porous cover conceals the aperture of the housing;wherein the exterior surface of the housing includes a sealing area surrounding but not including the aperture, and the acoustically porous cover is affixed to the sealing area of the exterior surface via an adhesive;wherein the adhesive covers the sealing area and permeates a thickness of the acoustically porous cover above the sealing area, thereby enabling formation of a controlled sound path to the microphone by coupling of a microphone testing fixture to a region of the acoustically porous cover corresponding to the sealing area.2. The electronic device of claim 1 , wherein the aperture of the housing includes a ...

THROWABLE MICROPHONE LIGHTING WITH LIGHT INDICATION

Some embodiments include a throwable microphone system. A throwable microphone system may include: a throwable microphone body; a throwable microphone disposed within the throwable microphone body; a throwable wireless transceiver that receives audio signals from the throwable microphone and wirelessly communicates the audio signals to a remote transceiver and receives a light configuration signal from the remote transceiver; a controller in electrical communication with the throwable microphone and the throwable wireless transceiver that establishes a light configuration state based at least in part on the light configuration signal; and a plurality of lights in electrical communication with the controller, the plurality of lights illuminate based on the light configuration state. 1. A smart microphone system comprising: a control microphone;', 'a control wireless transmitter that receives control audio signals from the control microphone and configured to wirelessly communicates the control audio signals; and', 'a button that switches between a control microphone state and a throwable microphone state;, 'a control microphone subsystem comprising a throwable microphone body;', 'a throwable microphone disposed within the throwable microphone body; and', 'a throwable wireless transmitter that receives throwable audio signals from the throwable microphone and wirelessly communicates the throwable audio signals; and, 'a throwable microphone subsystem comprising a wireless receiver that receives the control audio signals from the control wireless transmitter and the throwable audio signals from the throwable transmitter; and', 'an output that outputs the throwable audio signals when the button is in the throwable microphone state and outputs the control audio signals when the button is in the control microphone state., 'a smart microphone receiver comprising2. The smart microphone system according to claim 1 , wherein the control microphone subsystem comprises one or ...

THROWABLE MICROPHONE WITH VIRTUAL ASSISTANT INTERFACE

A smart microphone system is disclosed that includes a control microphone subsystem and a smart microphone receiver subsystem. The control microphone subsystem may include a microphone; a wireless transmitter that receives audio signals from the microphone and is configured to wirelessly communicate the audio signals; and a button that switches between a virtual assistant state and audio output state. The smart microphone receiver subsystem may include a wireless receiver that receives audio signals from the wireless transmitter; an audio output that outputs the audio signals from the wireless receiver when the button is in the audio output state; and a virtual assistant that receives the audio signals from the wireless receiver when the button is in the virtual assistant enable state. 1. A smart microphone system comprising: a microphone;', 'a wireless transmitter that receives audio signals from the microphone and is configured to wirelessly communicate the audio signals; and', 'a button that switches between a virtual assistant state and audio output state; and, 'a control microphone subsystem comprising a wireless receiver that receives audio signals from the wireless transmitter;', 'an audio output that outputs the audio signals from the wireless receiver when the control microphone is in the audio output state; and', 'a virtual assistant that receives the audio signals from the wireless receiver when the control microphone is in the virtual assistant enable state., 'a smart microphone receiver subsystem comprising2. The smart microphone system according to claim 1 , further comprising a throwable microphone subsystem comprising:a throwable microphone body;a throwable microphone disposed within the throwable microphone body; anda throwable wireless transmitter that receives throwable audio signals from the throwable microphone and is configured to wirelessly communicates the throwable audio signals;wherein the wireless receiver receives audio signals from the ...

WIRELESS HEADSET

A wireless headset includes a first headset part and a second headset part. The first headset part includes a first earplug, a battery box, and a first part of a cable control box. The first part of the cable control box includes a first interface, a first wireless chip configured to receive and send a wireless signal, and a processor configured to process the wireless signal. The battery box includes a first battery. The second headset part includes a second earplug and a second part of the cable control box, and the second part of the cable control box includes a second interface. The first interface is detachably connected to the second interface. When the first interface is electrically connected to the second interface, a data path is formed between the second earplug and the processor, and the first battery supplies power to the second earplug. 127-. (canceled)28. A wireless headset , comprising a first headset part and a second headset part , whereinthe first headset part comprises a first earplug, a battery box wiredly connected to the first earplug, and a first part of a cable control box wiredly connected to the battery box, wherein the first part of the cable control box comprises a first interface, a first wireless chip configured to receive and send a wireless signal, and a processor configured to process the wireless signal, and the battery box comprises a first battery; andthe second headset part comprises a second earplug and a second part of the cable control box wiredly connected to the second earplug, wherein the second part of the cable control box comprises a second interface;the first interface is detachably connected to the second interface;when the first interface is electrically connected to the second interface, a data path is formed between the second earplug and the processor of the first part of the cable control box, and the first battery supplies power to the second earplug; andthe first interface is configured to: when being detached ...

Device and Process for Powering Smart Speakers and Providing Internet Connectivity for the Same

A device configured to provide wireless service and power for a smart speaker includes at least one transceiver configured to wirelessly connect to a mobile broadband network and further configured to obtain internet access and the at least one transceiver further configured to wirelessly connect to the smart speaker and provide the internet access to the smart speaker. The device further includes a power supply configured to store power and the power supply further configured to provide power to the at least one transceiver. The power supply further configured to store power and the power supply further configured to provide power to the smart speaker. The device further includes a housing configured to house the at least one transceiver and the power supply. 1. A device configured to provide wireless service and power for a smart speaker comprising:at least one transceiver configured to wirelessly connect to a mobile broadband network and further configured to obtain internet access;the at least one transceiver further configured to wirelessly connect to the smart speaker and provide the internet access to the smart speaker;a power supply configured to store power and the power supply further configured to provide power to the at least one transceiver;the power supply further configured to store power and the power supply further configured to provide power to the smart speaker; anda housing configured to house the at least one transceiver and the power supply.2. The device of claim 1 , wherein the housing is configured with a surface that is configured to receive the smart speaker.3. The device of claim 1 , wherein the at least one transceiver is further configured to wirelessly connect to at least one wireless device and provide the internet access to the at least one wireless device.4. The device of claim 1 , wherein the housing is configured with a cylindrical form factor having a diameter between 2 inches and 3 inches.5. The device of claim 1 , wherein the ...

MICROPHONE ASSEMBLY AND ELECTRONIC DEVICE COMPRISING A MICROPHONE ASSEMBLY

A microphone assembly () comprising a microphone unit () secured to a mounting element (). The microphone unit () has a first side () comprising an audio port (), and the mounting element () comprises a rigid body having a mounting side (). The first side () of the microphone unit () is arranged at a right angle to the mounting side () of the mounting element (). The microphone unit may () comprise a microelectromechanical systems (MEMS) microphone package holding a MEMS microphone die, and the mounting side () of the mounting element may be configured for being mounted or soldered to a printed circuit board (). The microphone assembly () may be mounted to a device printed circuit board. 115-. (canceled)16. A microphone assembly comprising a microphone unit including a housing that encloses a microphone component secured to a mounting element , the housing of said microphone unit being provided with a first side comprising an audio port , the housing of said microphone unit including a second side , said mounting element comprising a rigid body having a mounting side and said second side of the housing of the microphone unit being arranged at a substantially right angle to said mounting side.17. A microphone assembly according to claim 16 , wherein said mounting side is configured for being mounted or soldered to a printed circuit board.1820.-. (canceled)21. A microphone assembly according to claim 17 , wherein said microphone unit comprises a base printed circuit board claim 17 , and wherein said housing is secured to said base printed circuit board with the audio port facing away from said base printed circuit board.22. A microphone assembly according to claim 21 , wherein said base printed circuit board has a substantially planar first contact side facing away from said first side claim 21 , said first contact side being provided with a number of first electrical contacts for providing electrical contact between the microphone unit and the mounting element.23. A ...

MICROPHONE UNITS WITH MULTIPLE OPENINGS

According to examples, an apparatus may include a chamber having a hole and a microphone unit. The microphone unit may include a first substrate having a first opening aligned with the hole of the chamber, a second substrate positioned with respect to the first substrate to form a gap between the second substrate and the first substrate, the second substrate having a second opening, and a diaphragm housed within the gap formed between the first substrate and the second substrate, in which the first opening is positioned on a first side of the diaphragm and the second opening is positioned on a second side of the diaphragm. 1. An apparatus comprising:a chamber having a hole; and a first substrate having a first opening aligned with the hole of the chamber;', 'a second substrate positioned with respect to the first substrate to form a gap between the second substrate and the first substrate, the second substrate having a second opening; and', 'a diaphragm housed within the gap formed between the first substrate and the second substrate, wherein the first opening is positioned on a first side of the diaphragm and the second opening is positioned on a second side of the diaphragm., 'a microphone unit including2. The apparatus of claim 1 , wherein the chamber is larger than the microphone unit and is sealed other than through the hole.3. The apparatus of claim 1 , wherein the diaphragm comprises a microelectromechanical system (MEMS) diaphragm.4. The apparatus of claim 1 , further comprising:a housing, wherein the chamber is formed in the housing, wherein the housing comprises a sound port, and wherein the microphone unit is positioned adjacent to the sound port.5. The apparatus of claim 1 , further comprising:a printed circuit board (PCB), wherein the PCB is to form a wall of the chamber, wherein the hole of the chamber is formed through the PCB, and wherein the microphone unit is mounted to the PCB.6. The apparatus of claim 1 , wherein the first substrate includes ...

MICROPHONE DEVICE FOR REDUCING NOISE COUPLING EFFECT

A microphone device includes a carrier board, a micro electro-mechanical system unit, an integrated circuit and an upper cover. The micro electro-mechanical system unit includes a substrate, a cap and a capacitive microphone. The cap is installed on the substrate, and is composed of electrically conductive material. The capacitive microphone is positioned between the cap and the carrier board, wherein the capacitive microphone and the cap form a resonant cavity. The integrated circuit is installed on the carrier board, and arranged to control the capacitive microphone. The upper cover is connected to the carrier board, wherein the micro-electro mechanical system unit and the integrated circuit are both positioned inside a space formed by the carrier board and the upper cover. 1. A microphone device , comprising:a carrier board; a substrate;', 'a cap, installed on the substrate, and composed of electrically conductive material; and', 'a capacitive microphone, positioned between the cap and the carrier board, wherein the capacitive microphone and the cap form a resonant cavity;, 'a micro electro-mechanical system (MEMS) unit, comprisingan integrated circuit (IC), installed on the carrier board, and arranged to control the capacitive microphone; andan upper cover, connected to the carrier board, wherein the MEMS unit and the integrated circuit are both positioned inside a space formed by the carrier board and the upper cover.2. The microphone device of claim 1 , wherein the cap has an opening.3. The microphone device of claim 2 , wherein the upper cover has an opening claim 2 , and the opening of the upper cover is not directly over the opening of the cap.4. The microphone device of claim 1 , wherein the carrier board has an opening claim 1 , the substrate of the MEMS unit is configured on the carrier board claim 1 , and the capacitive microphone is directly over the opening of the carrier board.5. The microphone device of claim 1 , wherein the substrate of the MEMS ...

Microphone module with sound pipe

A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.

BLENDED PASSIVE MICROPHONE

A blended passive microphone includes a dynamic first microphone, a dynamic second microphone, and a blending circuit adjusting outputs of the dynamic first microphone and the dynamic second microphone. 1. A blended passive microphone that does not require a power source , comprising:a dynamic first microphone including a first microphone output;a dynamic second microphone including a second microphone output;a blending circuit adjusting outputs of the dynamic first microphone and the dynamic second microphone, the blending circuit includes a cable output and a dual gang potentiometer including a first potentiometer and a second potentiometer, the first potentiometer being connected to the first microphone output and the cable output, the second potentiometer being connected to the second microphone output and the cable output, and the cable output being connected to the first and second microphone outputs; anda housing in which the dynamic first microphone, the dynamic second microphone and the blending circuit are positioned.2. (canceled)3. The blended passive microphone according to claim 1 , wherein the dynamic first microphone includes a dynamic microphone cartridge.4. The blended passive microphone according to claim 3 , wherein the dynamic second microphone includes a dynamic microphone cartridge.5. (canceled)6. The blended passive microphone according to claim 5 , wherein the cable output is an XLR cable output for connection to an audio pro mixer or microphone input on audio accessory equipment.7. The blended passive microphone according to claim 6 , wherein the XLR cable output is a three-pin XLR cable output.8. The blended passive microphone according to claim 1 , wherein the blending circuit includes a first input electrically coupled to POS & NEG outputs of the dynamic first microphone and a second input electrically coupled to POS & NEG outputs of the dynamic second microphone.912-. (canceled) The present invention generally relates to a microphone ...

DIAPHRAGM ASSEMBLY AND LOUDSPEAKER HAVING SAME

A diaphragm assembly and a loudspeaker having the diaphragm assembly. The diaphragm assembly comprises a silica gel diaphragm, the diaphragm comprises an annular bending portion, and a diaphragm center portion and a diaphragm edge portion arranged on inner and outer sides of the bending portion respectively; an annular support member () is joined to the diaphragm edge portion through injection modeling; a dome () is joined to the diaphragm center portion; the support member () is a metallic member; and the diaphragm edge is at least joined to two surfaces of the support member () through injection modeling. 1. A diaphragm assembly , comprising a silica gel diaphragm , wherein the diaphragm comprises an annular bending portion , and a diaphragm center portion and a diaphragm edge portion arranged at an inner side and an outer side of the bending portion , respectively , wherein the diaphragm edge portion is coupled with an annular support member through injection molding , and the diaphragm center portion is coupled with a dome; the support member is a metallic member; and the diaphragm edge portion is coupled with at least two surfaces of the support member through injection molding.2. The diaphragm assembly according to claim 1 , wherein the diaphragm edge portion is simultaneously coupled with an inner lateral surface claim 1 , an outer lateral surface and an upper surface of the support member through injection molding.3. The diaphragm assembly according to claim 1 , wherein the diaphragm edge portion is simultaneously coupled with an outer lateral surface and an upper surface of the support member through injection molding.4. The diaphragm assembly according to claim 1 , wherein the diaphragm edge portion is simultaneously coupled with an inner lateral surface and an upper surface of the support member through injection molding.5. The diaphragm assembly according to claim 1 , wherein the diaphragm edge portion is simultaneously coupled with an inner lateral ...

DIFFERENTIAL-CAPACITANCE TYPE MEMS MICROPHONE

The present invention discloses a differential-capacitance type MEMS microphone, comprising a circuit board, a first MEMS chip and a second MEMS chip; wherein the first MEMS chip comprises a first substrate disposed on the circuit board, and a first capacitor disposed on the first substrate, the first capacitor comprising a first back pole plate located above, a first vibrating diaphragm located below, and a first isolating layer disposed between the first back pole plate and the first vibrating diaphragm; the second MEMS chip comprises a second substrate disposed on the circuit board, and a second capacitor disposed on the second substrate, the second capacitor comprising a second back pole plate located below, a second vibrating diaphragm located above, and a second isolating layer disposed between the second back pole plate and the second vibrating diaphragm; and the first capacitor and the second capacitor form a pair of differential capacitors. 1. A differential-capacitance type MEMS microphone , the MEMS microphone comprising:a circuit board, a first MEMS chip and a second MEMS chip,wherein the first MEMS chip comprises a first substrate disposed on the circuit board, the first substrate being provided with a first opening running through from top to bottom; and a first capacitor disposed on the first substrate, the first capacitor comprising a first back pole plate located above, a first vibrating diaphragm located below and opposite to the first back pole plate, and a first isolating layer disposed between the first back pole plate and the first vibrating diaphragm;the second MEMS chip comprises a second substrate disposed on the circuit board, the second substrate being provided with a second opening running through from top to bottom; and a second capacitor disposed on the second substrate, the second capacitor comprising a second back pole plate located below, a second vibrating diaphragm located above and opposite to the second back pole plate, and a ...

MEMS DEVICE AND ELECTRONICS APPARATUS

The present invention discloses a MEMS device and an electronics apparatus. The MEMS device comprises: a substrate; a MEMS element placed on the substrate; a cover encapsulating the MEMS element together with the substrate; and a port for the MEMS element to access outside, wherein the port is provided with a filter which has mesh holes and includes electrets to prevent particles from entering into the MEMS element. 1. A MEMS device , comprising:a substrate;a MEMS element placed on the substrate;a cover encapsulating the MEMS element together with the substrate; anda port for the MEMS element to access outside,wherein the port is provided with a filter which has mesh holes and includes electrets to prevent particles from entering into the MEMS element.2. The MEMS device according to claim 1 , wherein the MEMS element is one of the following elements: a MEMS microphone element claim 1 , a MEMS pressure sensor element claim 1 , a MEMS humidity sensor element claim 1 , a MEMS gas sensor element claim 1 , a MEMS chemical sensor element and a MEMS speaker element.3. The MEMS device according to claim 1 , wherein the electrets of the filter are surface charged electrets.4. The MEMS device according to claim 1 , wherein the electrets of the filter are bulk charged electrets.5. The MEMS device according to claim 1 , wherein the electrets are placed on two surfaces of the filter and are charged with opposite charges.6. The MEMS device according to claim 1 , wherein the filter is a meshed plate or membrane.7. The MEMS device according to claim 1 , wherein the filter is made of metal plate claim 1 , the surfaces of the metal plate are covered by polymer claim 1 , and the polymer is charged with electret charges.8. The MEMS device according to claim 1 , further comprising a support substrate claim 1 , wherein the support substrate is attached with the filter to support the filter.9. The MEMS device according to claim 1 , wherein the port is provided in the substrate or the ...

PARTICULAR-SOUND DETECTOR AND METHOD, AND PROGRAM

The present technology relates to a particular-sound detector and method, and a program that make it possible to improve the performance of detecting particular sounds. 1. A particular-sound detector comprising:a particular-sound detecting section that detects a particular sound on a basis of a plurality of audio signals obtained by collecting sounds by a plurality of microphones provided to a wearable device, whereinthe plurality of the microphones includes two microphones that are equidistant at least from a sound source of the particular sound, and one microphone arranged at a predetermined position.2. The particular-sound detector according to claim 1 , wherein the particular-sound detecting section includes a detector with a neural network structure.3. The particular-sound detector according to claim 1 , wherein the particular sound is a voice of a wearer of the wearable device.4. The particular-sound detector according to claim 1 , wherein at least one microphone of the plurality of the microphones is a feedback microphone for noise canceling.5. The particular-sound detector according to claim 4 , wherein the one microphone arranged at the predetermined position is the feedback microphone.6. The particular-sound detector according to claim 4 , wherein the feedback microphone is arranged inside a housing of the wearable device.7. The particular-sound detector according to claim 1 , wherein at least one microphone of the plurality of the microphones is a bone conduction microphone.8. The particular-sound detector according to claim 7 , wherein the one microphone arranged at the predetermined position is the bone conduction microphone.9. The particular-sound detector according to claim 1 , wherein at least one microphone of the plurality of the microphones is a microphone for calls.10. The particular-sound detector according to claim 9 , wherein the one microphone arranged at the predetermined position is the microphone for calls.11. The particular-sound detector ...

MICROPHONE BOOM STRUCTURE

A microphone boom structure includes a first and second end boom segments, and intermediate boom segments sequentially disposed between the first end boom segment and the second end boom segment. An end of the first end boom segment is hinged with an end of the adjacent intermediate boom segment, an end of the second end boom segment is hinged with an end of the adjacent intermediate boom segment, and the ends of two adjacent intermediate boom segments are hinged. An adjusting structure is provided between the first end boom segment and the adjacent intermediate boom segment, between the second end boom segment and the adjacent intermediate boom segment, and between the two adjacent intermediate boom segments. The adjusting structure includes an axial hole formed in a boom segment, an adjusting bar inserted into the axial hole, and an elastic compression member disposed between the axial hole and the adjusting bar. 1. A microphone boom structure , comprising a first end boom segment , a second end boom segment , and a plurality of intermediate boom segments sequentially disposed between the first end boom segment and the second end boom segment;an end of the first end boom segment is hinged with an end of the adjacent intermediate boom segment, an end of the second end boom segment is hinged with an end of the adjacent intermediate boom segment, and the ends of two adjacent intermediate boom segments are hinged;an adjusting structure is further provided between the end of the first end boom segment and the end of the adjacent intermediate boom segment, the end of the second end boom segment and the end of the adjacent intermediate boom segment, and the ends of two adjacent intermediate boom segments, respectively; andthe adjusting structure comprises an axial hole provided in a boom segment, an adjusting bar inserted into the axial hole, and an elastic compression member disposed between the axial hole and the adjusting bar.2. The microphone boom structure according ...

System, Method and Apparatus for Translating, Converting and/or Transforming Audio Energy into Haptic and/or Visual Representation

A device can be worn by a user and can include a microphone to analyze music and other sound in the surrounding environment. In one embodiment, the device can translate audio into a haptic and/or light of the sound's or music's bassline, in real-time. In one embodiment, no music is recorded by the device. The haptic or vibrational representation of the music can be generated by a motor. In some examples, the light representation of the music can be generated via a red/green/blue light emitting diode. 1. A system for translating , converting or transforming audio energy into at least one haptic and visual representation , comprising:a microphone;a processor; anda memory operatively coupled to the processor and having computer readable instructions stored thereon which, when executed by at least one of the one or more processors, causes the at least one of the one or more processors to:receive audio input through the microphone of the worn device; andtranslate, convert or transform signals representing the received audio input to one or more representations produced by the worn device.2. The system of claim 1 , wherein the one or more representations comprise haptic representations.3. The system of claim 1 , wherein the one or more representations comprise visual representations.4. The system of claim 1 , wherein the one or more representations comprise haptic representations and visual representations.5. The system of claim 1 , further comprising a worn device claim 1 , wherein the microphone claim 1 , the processor and the memory are housed in the worn device.6. A system claim 1 , comprising:a non-transitory computer-readable medium having a computer-readable code stored thereon that, when executed by one or more computing devices, causes the one or more computing devices to:receive audio input through a microphone of a worn device; andtranslate, convert or transform signals representing the received audio input to one or more representations produced by the worn ...

GAME CONTROL METHOD, DOCKING STATION AND GAME CONTROL SYSTEM

A game control method, a docking station and a game control system are provided to solve that mobile terminals such as mobile phones cannot be connected to a display device and an input device at the same time, causing that mobile game interface is small and the control is inconvenient. The method includes steps: receiving manipulation information from an input device via a first port; receiving video information from a mobile device via a second port; obtaining touch position information of a game interface corresponding to the manipulation information according to a mapping relationship, then transmitting it to the mobile device from the second port; and transmitting the video information to the display device from a third port. The docking station includes a computer program that performs the above steps. The system includes the docking station, and mobile device, display device and input device connected through the docking station.

SOUND COLLECTING METHOD, DEVICE AND MEDIUM

A method for sound collection includes: converting time domain signals with a number of M collected by devices for sound collecting with a number of M into original frequency domain signals with a number of M; performing beam-forming on the M original frequency domain signals at each of preset grid points, to obtain beam-forming frequency domain signals with a number of N in one-to-one correspondence with the preset grid points; determining an average amplitude of frequency components with a number of N corresponding to each of frequency points with a number of K based on the beam-forming frequency domain signals with a number of N, and synthesizing a synthesized frequency domain signal including the frequency points and having an average amplitude as an amplitude at the each of the frequency points with a number of K; and converting the synthesized frequency domain signal into a synthesized time domain signal. 1. A method for sound collection , comprising:converting time domain signals with a number of M collected by devices for sound collecting with a number of M into original frequency domain signals with a number of M;performing beam-forming on the original frequency domain signals with a number of M at each of preset grid points with a number of N, to obtain beam-forming frequency domain signals with a number of N in one-to-one correspondence with the preset grid points with a number of N;determining, based on the beam-forming frequency domain signals with a number of N, an average amplitude of frequency components with a number of N corresponding to each of frequency points with a number of K and synthesizing a synthesized frequency domain signal comprising the frequency points with a number of K and having the average amplitude as an amplitude at each of the frequency points with a number of K, wherein a phase of the synthesized frequency domain signal at each of the frequency points with a number of K is a corresponding phase in an original frequency domain ...

SPEAKER, AUDIO DEVICE THEREOF, AND METHOD OF REGULATING FREQUENCY RESPONSE

The invention provides a speaker, an audio device thereof, and a method of regulating frequency response. The speaker comprises a back cavity and a magnetic circuit system connected to the back cavity, and further comprises: an intermediate-frequency frequency response regulation module disposed in the back cavity for regulating a length of a first effective air passage of the back cavity where an air flow passes, such that a resonant frequency of the back cavity is equivalent to a frequency of intermediate-frequency frequency response of the speaker to be improved; and/or a high-frequency frequency response regulation module disposed in the back cavity for regulating a length of a second effective air passage of the back cavity where the air flow passes, such that the resonant frequency of the back cavity is equivalent to a frequency of high-frequency frequency response of the speaker to be improved. 1. A speaker , comprising a back cavity and a magnetic circuit system connected to the back cavity , and further comprising:an intermediate-frequency frequency response regulation module disposed in the back cavity for regulating a length of a first effective air passage of the back cavity where an air flow passes, such that a resonant frequency of the back cavity is equivalent to a frequency of intermediate-frequency frequency response of the speaker to be improved;and/or a high-frequency frequency response regulation module disposed in the back cavity for regulating a length of a second effective air passage of the back cavity where the air flow passes, such that the resonant frequency of the back cavity is equivalent to a frequency of high-frequency frequency response of the speaker to be improved.2. The speaker according to claim 1 , wherein the intermediate-frequency frequency response regulation module is the intermediate-frequency frequency response regulation module that regulates the air flow passing through the back cavity to be an ascending spiral structure ...

TERMINAL ASSEMBLY STRUCTURE OF MEMS MICROPHONE

The present disclosure provides a terminal assembly structure of a MEMS microphone, including a signal let out board disposed at a terminal and a silicon microphone disposed on the signal let out board. The silicon microphone includes a housing, a substrate forming an accommodation space with the housing, an MEMS chip and a waterproof member. The substrate is configured with a sound inlet connected to the outside. The waterproof member is sandwiched between the MEMS chip and the substrate. A position where the signal let out board corresponds to the silicon microphone is configured with an accommodation hole. The housing is accommodated in the accommodation hole. The substrate abuts a surface of the signal let out board and covers the accommodation hole. A surface of the substrate where the housing is assembled, is provided with at least one pad electrically connected with the signal let out board. 1. A terminal assembly structure of a MEMS microphone , comprising: a signal let out board disposed at a terminal and a silicon microphone disposed on the signal let out board , the silicon microphone comprising a housing , a substrate which form an accommodation space cooperatively with the housing , an ASIC chip and an MEMS chip both accommodated in the accommodation space , the ASIC chip being electrically connected to the substrate , the ASIC chip being electrically connected to the MEMS chip , a sound inlet communicated to outside is configured at a position of the substrate corresponding to the MEMS chip , wherein the silicon microphone further comprises a waterproof member accommodated in the accommodating space and covering the sound inlet , the waterproof member is sandwiched between the MEMS chip and the substrate , an accommodation hole is configured at a position of the signal let out board corresponding to the silicon microphone , the housing is accommodated in the accommodation hole , the substrate abuts a surface of the signal let out board and covers the ...

MEMS MICROPHONE

The present utility model provides a MEMS microphone including a package housing, a substrate forming an accommodation space with the package housing, a MEMS chip accommodated in the accommodation space and having a rear cavity, and an ASIC chip electrically connected with the MEMS chip. The substrate includes an accommodation slot formed in the substrate, and the ASIC chip is accommodated in the accommodation slot and electrically connected with the substrate. In the MEMS microphone provided in the present disclosure, that the ASIC chip is packaged in the substrate avoid corrosion of the ASIC chip caused by direct contact of the ASIC chip and the air, and saves space of the substrate, which facilitate miniaturization of the MEMS microphone. 1. A MEMS microphone , comprising a package housing , a substrate forming an accommodation space cooperatively with the package housing , a MEMS chip accommodated in the accommodation space and having a rear cavity , and an ASIC chip electrically connected with the MEMS chip , wherein the substrate comprises an accommodation slot formed in the substrate , and the ASIC chip is accommodated in the accommodation slot and electrically connected with the substrate.2. The MEMS microphone according to claim 1 , wherein the MEMS chip is fixed to the substrate.3. The MEMS microphone according to claim 2 , wherein the substrate further comprises a substrate body connected with the MEMS chip and a sound inlet penetrated through the substrate body claim 2 , and the sound inlet is in communication with the rear cavity of the MEMS and is separated from the accommodation slot.4. The MEMS microphone according to claim 3 , wherein the substrate body comprises a first base layer connected with the MEMS chip claim 3 , a second base layer provided at a side of the first base layer claim 3 , the side being away from the MEMS chip and the second base layer being separated from the first base layer claim 3 , and a third base layer sandwiched between ...

TERMINAL ASSEMBLY STRUCTURE OF MEMS MICROPHONE

A terminal assembly structure of a MEMS microphone, including a signal let out board disposed at a terminal and a silicon microphone disposed at the signal let out board. The silicon microphone includes a housing, a substrate forming an accommodation space with the housing, and an MEMS chip accommodated in the accommodation space. A position of the substrate corresponding to the MEMS chip is disposed with a sound inlet connected to the outside, wherein a position where the signal let out board corresponding to the silicon microphone is disposed with an accommodation hole. The housing is accommodated in the accommodation hole. The substrate abuts a surface of the signal let out board and covers the accommodation hole. A surface of the substrate disposed with the housing is provided with a pad which is electrically connected with the signal let out board. 1. A terminal assembly structure of a MEMS microphone , comprising: a signal let out board disposed at a terminal and a silicon microphone disposed on the signal let out board , the silicon microphone comprising a housing , a substrate which form an accommodation space cooperatively with the housing , an ASIC chip and an MEMS chip both accommodated in the accommodation space , the ASIC chip being electrically connected to the substrate , the ASCI chip being electrically connected to the MEMS chip , a sound inlet communicated to outside is configured at a position of the substrate corresponding to the MEMS chip , wherein an accommodation hole is configured at a position of the signal let out board corresponds to the silicon microphone , the housing is accommodated in the accommodation hole , the substrate abuts a surface of the signal let out board and covers the accommodation hole , at least one pad is configured on a surface of the substrate where the housing is assembled , and the pad is electrically connected to the signal let out board.2. The terminal assembly structure of the MEMS microphone according to claim 1 ...

DUAL BAND MEMS ACOUSTIC DEVICE

A device includes a first microelectromechanical systems (MEMS) transducer, a second MEMS transducer and a summing device. A first dimension of the first MEMS transducer is predefined to configure the first MEMS transducer to have a first resonance frequency. A second dimension of the second MEMS transducer is predefined to configure the second MEMS transducer to have a second resonance frequency different than the first resonance frequency. The summing device is coupled to the first MEMS transducer and the second MEMS transducer and provides an output representing a combination of information from the first MEMS transducer and the second MEMS transducer. 1. A microelectromechanical systems (MEMS) acoustic device , comprising:a first MEMS transducer including a first diaphragm and a first back plate, wherein at least one of the first diaphragm and the first back plate has a first dimension; anda second MEMS transducer including a second diaphragm and a second back plate, wherein at least one of the second diaphragm and the second back plate has a second dimension, and wherein a magnitude of the second dimension is less than a magnitude of the first dimension.2. The MEMS acoustic device of claim 1 , wherein the first dimension and the second dimension refer to a length claim 1 , width claim 1 , radius claim 1 , thickness claim 1 , area claim 1 , or circumference.3. The MEMS acoustic device of claim 1 , wherein the first MEMS transducer has a first resonance frequency and the second MEMS transducer has a second resonance frequency that is higher than the first resonance frequency.4. The MEMS acoustic device of claim 3 , wherein the first resonance frequency is a human-audible frequency and the second resonance frequency is an ultrasonic frequency.5. The MEMS acoustic device of claim 3 , wherein the first resonance frequency is a first ultrasonic frequency and the second resonance frequency is a second ultrasonic frequency.6. The MEMS acoustic device of claim 1 , ...

PACKAGE STRUCTURE OF MEMS MICROPHONE

The present invention discloses a package structure of a MEMS microphone. The package structure comprises a closed inner cavity formed by a package shell in a surrounding manner, as well as a MEMS chip and an ASIC chip which are located in the closed inner cavity, wherein a sound hole allowing sound to flow into the closed inner cavity is formed in the package shell; the MEMS chip comprises a substrate as well as a vibrating diaphragm and a back plate which are provided on the substrate; the vibrating diaphragm divides the closed inner cavity into a front cavity and a back cavity; and a sound-absorbing structure is provided in the back cavity. 1. A package structure of a MEMS microphone , the package structure comprising a closed inner cavity formed by a package shell , as well as a MEMS chip and an ASIC chip which are located in the closed inner cavity , wherein a sound hole allowing sound to flow into the closed inner cavity is formed on the package shell; the MEMS chip comprises a substrate as well as a vibrating diaphragm and a back plate which are provided on the substrate; the vibrating diaphragm divides the closed inner cavity into a front cavity and a back cavity; and a sound-absorbing structure is provided in the back cavity.2. The package structure according to claim 1 , wherein the package shell comprises a package substrate and a package housing provided on the package substrate; the MEMS chip is mounted on the package substrate through its substrate; and the vibrating diaphragm claim 1 , the substrate and the package substrate together form the back cavity in a surrounding manner.3. The package structure according to claim 2 , wherein the sound-absorbing structure is provided on the package substrate.4. The package structure according to claim 2 , wherein the package substrate is provided with a groove in which the sound-absorbing structure is arranged.5. The package structure according to claim 2 , wherein the sound-absorbing structure is arranged on a ...

MICROPHONE AND METHODS OF ASSEMBLING MICROPHONES

A microphone can include a cover having a series of slits and a nest. The nest can be configured to receive a first diaphragm, a second diaphragm, and a PCB in a stacked arrangement, such that the PCB is positioned between the first diaphragm and the second diaphragm. Also the first diaphragm can define a first plane, the second diaphragm can define a second plane, and the PCB can define a third plane and the first plane, the second plane, and the third plane can extend parallel to one another. The cover can also include slits having a first length and a second length, and the first length can be greater than the second length. The slits can extend both radially and axially. 1. A microphone comprising:a cartridge; anda nest configured to be placed within the cartridge, the nest including a first diaphragm, a second diaphragm, and a printed circuit board (PCB) placed in a stacked arrangement, such that the PCB is positioned between the first diaphragm and the second diaphragm, wherein the first diaphragm defines a first plane, the second diaphragm defines a second plane, and the PCB defines a third plane and wherein the first plane, the second plane, and the third plane extend substantially parallel to one another.2. (canceled)3. The microphone of further comprising a cover having a series of elongated slits wherein the slits extend both radially and axially and curve radially inward.4. The microphone of wherein the slits have a first length and a second length and wherein the first length is greater than the second length.5. The microphone of wherein the nest further comprises a first washer claim 1 , a second washer claim 1 , a first back plate claim 1 , a second back plate claim 1 , and a contact spacer and wherein the contact spacer is placed into direct electrical contact with the first back plate and the PCB and the second back plate is placed into direct electrical contact with the PCB.6. The microphone of wherein the nest includes a first ledge for receiving ...

Over-Under Sensor Packaging with Sensor Spaced Apart from Control Chip

An embodiment device includes a body structure having an interior cavity, a control chip disposed on a first interior surface of the interior cavity, and a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface. The sensor has a mounting pad on a second side of the sensor that faces the first interior surface, and the sensor is vertically spaced apart from the control chip by an air gap, with the sensor is aligned at least partially over the control chip. The device further includes an interconnect having a first end mounted on the mounting pad, the interconnect extending through the interior cavity toward the first interior surface, and the control chip is in electrical communication with the sensor by way of the interconnect. 1. A method , comprising:attaching a first side of a sensor to a first side of a lid, the sensor having a contact pad disposed on a second side of the sensor opposite the first side;providing an interconnect on the contact pad, wherein a first end of the interconnect is attached to the contact pad, and wherein the interconnect extends away from the contact pad;attaching a control chip to a first side of a substrate and electrically connecting the control chip to a landing pad disposed at the first side of the substrate; andaffixing the lid over the substrate, wherein the affixing forms an interior cavity between the lid and the substrate;wherein, after the affixing, the sensor and the control chip each extend into the interior cavity and an air gap is provided between the sensor and the control chip, and wherein, after the affixing, the interconnect extends through the interior cavity, and a second end of the interconnect makes electrical contact with the landing pad.2. The method of claim 1 , wherein claim 1 , after the affixing claim 1 , the sensor is at least partly laterally aligned over the control chip.3. The method of claim 2 , wherein the providing the interconnect ...