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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 4646. Отображено 100.
23-02-2012 дата публикации

Signal transmission line and circuit board

Номер: US20120043117A1
Автор: Jun Sasaki, Noboru Kato
Принадлежит: Murata Manufacturing Co Ltd

A signal line and a circuit board that can be easily bent in a U shape and prevent unwanted emission include a line portion includes a plurality of laminated line portion sheets made of a flexible material. Signal lines extend within the line portion in an x-axis direction. Ground lines are provided within the line portion on a positive direction side in a z-axis direction with respect to the signal lines and have line widths equal to or smaller than the line widths of the signal lines. Ground lines are provided within the line portion on a negative direction side in the z-axis direction with respect to the signal lines. The signal lines overlap the ground lines when seen in a planar view from the z-axis direction.

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08-03-2012 дата публикации

Wiring Design Support Apparatus and Wiring Design Support Method

Номер: US20120060134A1
Принадлежит: Individual

According to one embodiment, a wiring design support apparatus comprises a display, a drawing module, and a data creation module. The display is configured to display a three-dimensional object. The drawing module is configured to draw a line connecting two points on a surface of the three-dimensional object displayed by the display. The data creation module is configured to create first three-dimensional data indicating a wiring based on the line drawn by the drawing module.

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10-05-2012 дата публикации

Curved touch sensor

Номер: US20120111491A1
Принадлежит: Apple Inc

A method of forming a curved touch surface is disclosed. The method can include depositing and patterning a conductive thin film on a flexible substrate to form at least one touch sensor pattern, while the flexible substrate is in a flat state. According to certain embodiments, the method can include supporting the flexible substrate in the flat state on at least one curved forming substrate having a predetermined curvature; and performing an anneal process, or an anneal-like high-heat process, on the conductive thin film, wherein the anneal process can cause the flexible substrate to conform to the predetermined curvature of the at least one curved forming substrate. According to an embodiment, the curved forming substrate can include a first forming substrate having a first predetermined curvature and a second forming substrate having a second predetermined curvature complementing the first predetermined curvature.

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26-07-2012 дата публикации

Multi-layer flexible printed circuit board for electronic device

Номер: US20120186856A1
Автор: Hyun-Sik Min, Jong-Hun AN
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A multi-layer Flexible Printed Circuit Board (FPCB) for an electronic device, in which a plurality of components are provided alternately on a top surface and a bottom surface of a base layer and the components are removed from the other region. The multi-layer FPCB includes a base layer, a first circuit pattern provided on a side region on a top surface of the base layer, a first adhesive layer provided in the first circuit pattern, a second circuit pattern provided on a bottom surface of the base layer and in an other-side region opposite to the side region, a second adhesive layer provided in the second circuit pattern, a first insulating/protecting layer provided on a top surface of the first adhesive layer, and a second insulating/protecting layer provided on a bottom surface of the second adhesive layer.

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26-07-2012 дата публикации

Carrier tape for tab-package and manufacturing method thereof

Номер: US20120186862A1
Принадлежит: LG Innotek Co Ltd

The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.

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11-10-2012 дата публикации

Fabrication method of substrate

Номер: US20120258573A1
Автор: Jing-Yi Yan, Shu-Tang Yeh

A fabricating method of a substrate board is provided. The substrate board includes a substrate having rigid areas and flexible areas, and at least an electronic component disposed on the substrate, wherein each of the rigid areas is thicker than the flexible areas. A patterned high-extensive material may be additionally disposed on the substrate to improve reliability thereof. The rigid areas and the flexible areas may be formed by molds or cutters. By using an above structure, the electronic component is less affected when the substrate is under stress, so that good characteristics are maintained.

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25-10-2012 дата публикации

Multilayer stacked circuit arrangement with localized separation section

Номер: US20120267156A1
Принадлежит: Advanced Flexible Circuits Co Ltd

A multilayer stacked circuit arrangement with localized separation section, has a first flat cable and first signal transmission lines arranged on the first flat cable. A second flat cable is stacked on and bonded to the first flat cable. The second flat cable further has signal transmission lines arranged on it. A bonding substance layer is formed between a first non-separation section of the first flat cable and a second non-separation section of the second flat cable for properly stacking the first and second flat cables where the separation sections are spaced apart from each other. A conductive via extends between the first non-separation section and the second non-separation section. At least some of the second signal transmission lines of the second flat cable are connected through the conductive via to the first signal transmission lines of the first flat cable.

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28-02-2013 дата публикации

Base member

Номер: US20130048350A1
Принадлежит: Shinko Electric Industries Co Ltd

A base member includes: a core layer including: a plate-like body, made of aluminum oxide; and plural linear conductors, which penetrate through the plate-like body in a thickness direction of the plate-like body; a bonding layer, formed on at least one of a first surface and a second surface of the core layer; and a silicon layer or a glass layer, formed on the bonding layer.

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16-05-2013 дата публикации

THINNED FINGER SENSOR AND ASSOCIATED METHODS

Номер: US20130119488A1
Принадлежит: AuthenTec, Inc.

An electronic device may include a housing with a connector member opening therein, electronic circuitry within the housing, and a finger sensor assembly carried by the housing. The finger assembly may include a thinned finger sensing integrated circuit (IC) secured to the housing that has a thickness less than 200 microns. The finger sensor assembly may also include a connector member extending through the connector member opening in the housing and coupling together the thinned finger sensing IC and the electronic circuitry. The thinned finger sensing IC may be adhesively secured to the housing, such as using a pressure sensitive adhesive, and the thinned finger sensing IC may conform to a non-planar surface. 132-. (canceled)33. An electronic device comprising:a housing having at least one connector member opening therein;a thinned finger sensing integrated circuit (IC) carried by said housing and having a thickness less than 200 microns; andat least one connector member coupled to said thinned finger sensing IC and extending through the at least one connector member opening in said housing.34. The electronic device according to wherein said thinned finger sensing IC comprises a monocrystalline substrate.35. The electronic device according to wherein said housing has a non-planar surface; and wherein said thinned finger sensing IC is secured to the non-planar surface and conforms in shape thereto.36. The electronic device according to further comprising an adhesive layer adhesively securing said thinned finger sensing IC to said housing.37. The electronic device according to wherein said adhesive layer comprises a pressure sensitive adhesive.38. The electronic device according to wherein said thinned finger sensing IC has a thickness less than 50 microns.39. The electronic device according to wherein said thinned finger sensing IC comprises a finger sensing area and a plurality of bond pads adjacent thereto; and wherein said at least one connector member comprises ...

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23-05-2013 дата публикации

Driving printed circuit board and liquid crystal display device including the same

Номер: US20130128474A1
Принадлежит: LG Display Co Ltd

The present disclosure discloses a driving printed circuit board (PCB) for use in a display device. More particularly, a driving printed circuit board improving the bonding by preventing PCB warpage is provided. The rear surface stiffener plate includes polygonal patterns to prevent a PCB warpage of the driving printed circuit board due to different heat shrinkage from that of the board during the surface mounting technology (SMT) process.

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30-05-2013 дата публикации

Flexible Circuit Sheet

Номер: US20130137954A1
Принадлежит: Medtronic Xomed, Inc.

A flexible circuit assembly can include a base layer, a plurality of circuit traces and an insulative layer. The plurality of circuit traces can each be coupled to a pair of circuit pads, and the circuit traces can be formed on an upper side of the base layer. The insulative layer can be formed over the circuit traces to isolate the circuit traces from an external environment. The base layer, plurality of circuit traces and insulative layer can form a flexible circuit sheet. The base layer and the insulative layer can include material properties and a thickness configured to facilitate the flexible circuit sheet being flexible such that the flexible circuit sheet is adapted to conform to a non-planar surface of the medical device. 1. A flexible circuit assembly for a navigated medical instrument , comprising:a base layer;a plurality of circuit traces each coupled to a pair of circuit pads, the circuit traces formed on an upper side of the base layer; andan insulative layer formed over the circuit traces to isolate the circuit traces from an external environment, wherein the base layer, plurality of circuit traces and insulative layer form a flexible circuit sheet;wherein the base layer and the insulative layer include material properties and a thickness configured to facilitate the flexible circuit sheet being flexible such that the flexible circuit sheet is adapted to conform to a non-planar surface of the medical device.2. The flexible circuit assembly of claim 1 , wherein the flexible circuit sheet includes a thickness of approximately 0.05 mm.3. The flexible circuit assembly of claim 2 , wherein the flexible circuit sheet includes a thickness of 0.04 mm.4. The flexible circuit assembly of claim 1 , wherein the base layer and the insulative layer are formed from polyimide or a photoimageable coverlay.5. The flexible circuit assembly of claim 1 , further comprising an adhesive configured to contact a lower side of the base layer and adapted to adhere the flexible ...

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20-06-2013 дата публикации

Wiring board and method for manufacturing the same

Номер: US20130153269A1
Принадлежит: Ibiden Co Ltd

A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such that the second multilayer wiring board has a surface facing the surface of the first multilayer wiring board, and an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board. The first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, and the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer.

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20-06-2013 дата публикации

FLEXIBLE PRINTED CIRCUIT BOARD AND COMBINATION THEREOF

Номер: US20130155632A1
Автор: Lo Wei-Zen
Принадлежит: LINTES TECHNOLOGY CO., LTD

A flexible printed circuit board for connecting external modules, includes a high-frequency signal wiring board and a low-frequency signal wiring board. Side edges of the high-frequency signal wiring board and the low-frequency signal wiring board are connected to each other. The low-frequency signal wiring board is folded toward the high-frequency signal wiring board to form a stacked double-layer board structure. Each of two ends of the high-frequency signal wiring board extends to form a connecting board for connecting the external module. A flexible printed circuit board combination includes two flexible printed circuit boards. 1. A flexible printed circuit board , for connecting external modules , comprising:a high-frequency signal wiring board and a low-frequency signal wiring board,wherein side edges of the high-frequency signal wiring board and the low-frequency signal wiring board are connected to each other, the low-frequency signal wiring board is folded toward the high-frequency signal wiring board to form a stacked double-layer board structure, and each of two ends of the high-frequency signal wiring board extends to form a connecting board for connecting the external module.2. The flexible printed circuit board according to claim 1 , wherein at least one groove is formed at a folded position of the high-frequency signal wiring board and the low-frequency signal wiring board.3. The flexible printed circuit board according to claim 2 ,wherein each of the connecting boards is provided with a plurality of high-frequency signal contacts and a plurality of low-frequency signal contacts;wherein the high-frequency signal wiring board is provided with a plurality of high-frequency signal traces correspondingly connected to the high-frequency signal contacts on the two connecting boards;wherein the low-frequency signal wiring board is provided with at least one low-frequency signal trace correspondingly connected to the low-frequency signal contacts on the two ...

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11-07-2013 дата публикации

METHOD FOR PRODUCING A CIRCUIT BOARD CONSISTING OF A PLURALITY OF CIRCUIT BOARD AREAS AND CIRCUIT BOARD

Номер: US20130176692A1

For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled. 1. A method for producing a circuit board consisting of a plurality of circuit board areas , wherein the individual circuit board areas comprise at least one layer made of an in particular insulating base material and a conducting or conductive pattern located on or in the base material , said method comprising the steps of:providing a substrate material,forming at least one registration mark in the substrate material,arranging a first circuit board area on the substrate material while orienting the first circuit board area relative to the registration mark, andconnecting the conducting or conductive pattern of the first circuit board area to the conducting or conductive pattern of at least one further circuit board area, comprising the following additional step:arranging the at least one additional circuit board area adjoining the first circuit board area, or at least partially overlapping the first circuit board area, on the same or common surface of the substrate material while orienting the same relative to the registration mark.2. The method according to ...

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01-08-2013 дата публикации

MOTOR CONTROL DEVICE

Номер: US20130194762A1
Принадлежит: MINEBEA CO., LTD.

A motor control device includes a circuit board having a control circuit controlling electric power to be supplied to a motor, a base fixedly supporting the circuit board, a flexible printed circuit supplying electric power to the motor, a pin terminal disposed on the circuit board, being electrically connected with the control circuit, a dummy pin terminal disposed on the circuit board, being electrically free from the control circuit, a wiring pattern land disposed on the FPC, being electrically connected with the pin terminal, and a dummy wiring pattern land disposed on the FPC, being connected with the dummy pin terminal. 1. A motor control device , comprising:a circuit board having a control circuit controlling electric power to be supplied to the motor;a base fixedly supporting the circuit board;a flexible printed circuit (FPC) supplying electric power to the motor;a pin terminal disposed on the circuit board, being electrically connected with the control circuit;a dummy pin terminal disposed on the circuit board, being electrically free from the control circuit;a wiring pattern land disposed on the FPC, being electrically connected with the pin terminal; anda dummy wiring pattern land disposed on the FPC, being connected with the dummy pin terminal.2. The motor control device according to claim 1 , wherein the dummy pin terminal and the dummy wiring pattern land are disposed toward a side claim 1 , where the FPC is drawn to the motor claim 1 , than the pin terminal and the wiring pattern land claim 1 , respectively.3. The motor control device according to claim 1 , wherein each of the dummy pin terminal and the dummy wiring pattern land is disposed in plural and same number.4. The motor control device according to claim 1 , wherein the dummy pin terminal and the dummy wiring pattern land are disposed outward than the pin terminal and the wiring pattern land claim 1 , respectively.5. The motor control device according to claim 1 , further comprising a FPC ...

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08-08-2013 дата публикации

Printed circuit board (PCB) connecting cable and manufacturing method thereof

Номер: US20130199840A1
Автор: Dong-Jin Seo
Принадлежит: Individual

A light emitting diode (LED) connecting cable is provided. The LED connecting cable includes a conductive strip which is formed as a metallic semicircular rod and which includes a plurality of connecting pins or connecting pads to be connected to an externally-provided printed circuit board (PCB) in a blockwise unit, an outer protection casing formed from an insulating material on an upper surface of the conductive strip, and an antishocking material charged in between the conductive strip and the outer protection casing, wherein the PCB includes a fixing support formed therein to fix the outer protection casing.

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29-08-2013 дата публикации

Programmable breadboard matrix interconnection box

Номер: US20130223029A1
Принадлежит: Individual

The present device is a programmable breadboard matrix interconnection box capable of receiving data from a computer or controller and automatically establishing connections between contact points. A conductor layer, a magnetic layer, and a contact layer are used to automate the connections between contact points. The conductor layer provides conductors which move between ‘ON’ and ‘OFF’ positions and rows/columns which can receive electric current. The magnetic layer provides a necessary magnetic field. The contact layer connects the conductor to the designated contact point. A controller activates each conductor using the Laplace Force generated by the magnetic field and electric current.

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21-11-2013 дата публикации

Electronic device, electronic apparatus, method of manufacturing base substrate, and method of manufacturing electronic device

Номер: US20130306367A1
Автор: Yukihiro Hashi
Принадлежит: Seiko Epson Corp

An electronic device has a package and a piezoelectric element accommodated in an accommodating space formed inside the package. The package has a frame-like metallization layer bonding a base substrate and a lid together and electrodes formed on and in the base substrate and electrically connected with the piezoelectric element. The metallization layer is insulated from the electrodes.

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28-11-2013 дата публикации

DYNAMIC LOOP WITH FOLD

Номер: US20130314882A1
Принадлежит: NITTO DENKO CORPORATION

A single layer dynamic loop is provided. A single layer dynamic loop includes a set of traces divided by a slit on the single layer dynamic loop, wherein the set of traces are divided into a first region and a second region; and wherein the single layer dynamic loop is folded along the slit to move at least part of the first region in relation to the second region. 1. A single layer dynamic loop , comprising:a set of traces divided by a slit on the single layer dynamic loop, wherein the set of traces are divided into a first region and a second region; andwherein the single layer dynamic loop is folded along the slit to move at least part of the first region in relation to the second region.2. The single layer dynamic loop of claim 1 , wherein the single layer dynamic loop is folded along the slit to move at least part of the first region behind the second region.3. The single layer dynamic loop of claim 1 , wherein the first region and the second region are of equal height after folding.4. The single layer dynamic loop of claim 1 , wherein the first region and the second region are of different height after folding.5. The single layer dynamic loop of claim 1 , wherein the first region is a region to be folded and the second region is a region not to be folded.6. The single layer dynamic loop of claim 1 , further comprising at least one of a spacer claim 1 , adhesive patch and damper claim 1 , at least partially disposed on the second region.7. The single layer dynamic loop of claim 1 , further comprising voice coil motor (VCM) lines claim 1 , wherein the VCM lines are at least partially folded behind the second region.8. The single layer dynamic loop of claim 7 , further comprising a shield layered above the VCM lines.9. The single layer dynamic loop of claim 8 , wherein if the shield is layered above the VCM lines claim 8 , the first region is folded toward the second region so that the shield is between the first region and the second region.10. A single layer ...

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05-12-2013 дата публикации

MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD

Номер: US20130319732A1
Принадлежит: Raytheon Company

A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole. 1. An interconnect assembly for a corrugated printed circuit board comprising:a first flat flexible layer having a top surface and a bottom surface and having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line;a second folded flexible layer having a top surface and a bottom surface and having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions;a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer;a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and connecting the signal conductor of the first flat flexible layer to the signal conductor of the second folded flexible layer; andtwo ground through-holes extending through the non-conductive adhesive layer and the second folded ...

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12-12-2013 дата публикации

Notched Display Layers

Номер: US20130328051A1
Принадлежит:

An electronic device may have a display mounted in a housing. The display may have layers such as polarizer layers, a color filter layer, and a thin-film transistor layer. Display layers such as color filter layers and thin-film-transistor layers may have glass substrates. Notches or other openings may be formed in the layers of a display. For example, a notch with a curved chamfered edge may be formed in a lower end of a thin-film-transistor layer. A component such as a button may overlap the notch. Structures such as sensors, cameras, acoustic components, and other electronic components, buttons, communications path structures such as flexible printed circuit cables and wire bonding wires, and housing structures may be received within a display layer notch. 1. An electronic device , comprising:a display having display layers;a notch in at least a given one of the display layers; anda component that is at least partly received within the notch.2. The electronic device defined in wherein the component comprises a button.3. The electronic device defined in wherein the button comprises a movable button member that overlaps the notch.4. The electronic device defined in wherein the given one of the display layers comprises a thin-film-transistor layer.5. The electronic device defined in wherein the notch has a curved edge.6. The electronic device defined in wherein the display layers comprise a color filter layer on the thin-film-transistor layer claim 5 , wherein the color filter layer is recessed relative to the thin-film-transistor layer to form a thin-film-transistor layer ledge claim 5 , and wherein the notch is formed from the ledge.7. The electronic device defined in wherein the component comprises a component selected from the group consisting of: a sensor claim 1 , a camera claim 1 , a button claim 1 , a light-emitting diode claim 1 , and an acoustic component.8. The electronic device defined in wherein the given one of the display layers comprises a thin-film- ...

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12-12-2013 дата публикации

BENDABLE CIRCUIT BOARD FOR LED MOUNTING AND INTERCONNECTION

Номер: US20130330533A1
Принадлежит: E.I. Du Pont De Nemours and Company

This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection. 2. The structure of wherein the copper layer is about 35 um thick claim 1 , the polyimide layer is at about 0.12 millimeters thick and the aluminum layer is about 0.2 millimeters to 0.247 millimeters thick.3. The structure of wherein the aluminum metal layer is about 0.4 mm to about 2 mm in thickness.4. The structure of claim 1 , where the copper layer is a circuitized layer.5. The structure of wherein the aluminum is anodized.6. The structure of wherein the aluminum is treated with a chemical conversion coating.7. The structure of wherein the aluminum is aluminum Alloy 5005.8. A method of manufacturing a laminated structure for mounting light emitting diodes (“LED”) to a 90° or greater configured angle claim 1 , comprising: i. an aluminum metal layer of about 0.2 mm to about 2 mm in thickness;', 'ii. a polyimide composite layer having a first surface directly contacting the first surface of the aluminum metal layer; and', 'iii. a copper foil layer directly contacting a second surface of the polyimide composite layer; and, 'a. providing a bendable a laminate circuit structure, the bendable laminate circuit structure having at least the following laminated layersb. bending the laminated layers 90° or more, such that after bending the laminated layers the bendable circuit structure for mounting LED mounting has an increase in electrical resistance of less than 10%.9. The method of wherein the providing step include providing a laminate wherein the copper layer is about 35 um thick claim 8 , the polyimide layer is about 12 um thick and the aluminum layer is about 200 um to 247 um thick.10. The laminate of wherein the providing step includes providing an aluminum metal layer of about 0.4 mm to about 2 mm in thickness.11. The method of claim 8 , wherein the bendable laminate structure has a thickness to about 3 millimeters.12. The method of claim 8 , where the ...

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19-12-2013 дата публикации

CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING SAME

Номер: US20130333926A1
Принадлежит: MURATA MANUFACTURING CO., LTD.

A circuit substrate capable of reducing and preventing deviations of circuit characteristics includes a relatively hard region and a relatively soft region. A main body of the circuit substrate includes a stack of a plurality of flexible sheets made of a flexible material and includes rigid regions and a flexible region, the flexible region being more easily deformable than the rigid regions. Wiring conductors are disposed in the main body and define circuitry. Reinforcing insulative films are disposed so as to cover the portions where the wiring conductors are not disposed in the rigid regions on the flexible sheets when seen in plan view from the z-axis direction. 1. (canceled)2. A circuit substrate comprising:a main body including a stack of a plurality of first insulator layers made of a flexible material, the main body including a rigid region and a flexible region, the flexible region being more easily deformable than the rigid region;a conductive layer disposed in the main body and defining circuitry; anda second insulator layer disposed so as to cover at least a portion of an area in which the conductive layer is not disposed in the rigid region on at least one of the plurality of first insulator layers when viewed in plan from a stacking direction in which the plurality of first insulator layers are stacked; whereinthe second insulator layer is disposed in the main body; andthe second insulator layer has a thickness equal to or less than a thickness of the conductive layer in the stacking direction.3. The circuit substrate according to claim 2 , wherein the second insulator layer is made of a material that is harder than a material of the plurality of first insulator layers.4. The circuit substrate according to claim 2 , wherein the conductive layer extends across a border between the rigid region and the flexible region.5. The circuit substrate according to claim 2 , wherein the main body further includes a semi-rigid region disposed between the rigid ...

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16-01-2014 дата публикации

Means to provide electrical connections to borderless flexible display

Номер: US20140016284A1
Принадлежит: Universal Display Corp

Systems and methods for the design and fabrication of flexible devices, including high-performance large-area OLEDs, narrow border display panels and lighting panels are provided. Various described fabrication- and design-processes may be used to provide the necessary electrical drive to lighting and display panels. Electrical drive may be provided to one or more row- and column-signals by patterning conductive elements near the panel edge. The electrical elements may further be folded over a region near the panel edge back on itself, such that electrical traces may route around the display edge. This may allow the display active area to be substantially the same area as its viewing area, and furthermore may allow pixels go substantially all the way to the edge of the viewing area.

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23-01-2014 дата публикации

Three-dimensional circuit component, method of making the same, and physical-quantity measuring instrument

Номер: US20140022735A1
Принадлежит: Nagano Keiki Co Ltd

For producing a three-dimensional circuit component, an electronic component is mounted on a synthetic resin block. A plurality of electrically-conductive patterns used to establish an electrical connection to the electronic component are formed on the block along a three-dimensional shape of the block. An end of each electrically-conductive patterns is provided with a solder-disposed section. A solder is provided between the solder-disposed section and an opposed surface of the electronic component. The section of each electrically-conductive patterns other than the solder-disposed section and a section on which the electronic component is mounted is internally formed in the block. Since the section of each electrically-conductive patterns other than the section on which the electronic component is mounted is internally formed in the block, the electrically-conductive patterns are not unnecessarily exposed.

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30-01-2014 дата публикации

FOLDABLE DISPLAY DEVICE

Номер: US20140029212A1
Принадлежит: Samsung Display Co., Ltd.

A foldable display device having an excellent folding characteristic without image quality deterioration on a folding portion is provided. The foldable display device includes a flexible display panel and a cover window positioned outside the flexible display panel and protecting the flexible display panel from an external impact, wherein the cover window includes a folding region where concave grooves are formed. 1. A foldable display device , comprising:a flexible display panel; anda cover window positioned outside the flexible display panel and protecting the flexible display panel from an external impact, said cover window includes a folding region where concave grooves are formed.2. The foldable display device of claim 1 , whereinthe concave grooves are formed in a stripe pattern, and are positioned according to a direction crossing a direction in which the cover window is folded.3. The foldable display device of claim 2 , wherein each length of the concave grooves is the same as a width of the cover window.4. The foldable display device of claim 1 , whereinthe concave grooves are formed with a dot shape, and are positioned according to a first direction in which the cover window is folded and a second direction crossing the first direction.5. The foldable display device of claim 1 , whereinthe concave grooves are formed with a bar shape,the cover window is folded according to a first direction, andeach long edge of the concave grooves is positioned according to a second direction crossing the first direction.6. The foldable display device of claim 1 , wherein the concave grooves include first concave grooves of a bar shape and second concave grooves of a dot shape.7. The foldable display device of claim 6 , wherein the first concave grooves and the second concave grooves are alternately positioned one by one according to a second direction crossing a first direction in which the cover window is folded.8. The foldable display device of claim 2 , wherein each ...

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06-02-2014 дата публикации

Flexible multilayer substrate

Номер: US20140034365A1
Автор: Yoshihito OTSUBO
Принадлежит: Murata Manufacturing Co Ltd

A flexible multilayer substrate includes a multilayer body including a plurality of laminated resin layers. The multilayer body includes an innermost surface, which is a surface on an inner side when the substrate is bent, and an outermost surface, which is a surface on an outer side when the substrate is bent. Each of the plurality of resin layers includes a skin layer on one surface. Lamination of the multilayer body includes a skin layer joint plane at one location at a central portion in the thickness direction, and the skin layer and other surface come in contact with each other at another location along the central portion in the thickness direction. A skin layer joint plane is arranged on a side closer to the innermost surface than a central plane in the thickness direction of the multilayer body.

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13-02-2014 дата публикации

Flexible Displays

Номер: US20140042406A1
Принадлежит: Apple Inc

An electronic device may be provided with an organic light-emitting diode display with minimized border regions. The border regions may be minimized by providing the display with bent edge portions having neutral plane adjustment features that facilitate bending of the bent edge portions while minimizing damage to the bent edge portions. The neutral plane adjustment features may include a modified backfilm layer of the display in which portions of the backfilm layer are removed in a bend region. A display device may include a substrate, a display panel on the substrate having display pixels, and peripheral circuitry proximate the display panel and configured to drive the display pixels. A portion of the periphery of the substrate may be bent substantially orthogonal to the display panel to reduce an apparent surface area of the display device. The bent portion may include an electrode for communication with the peripheral circuitry.

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13-02-2014 дата публикации

Signal wiring of touch panel

Номер: US20140043776A1
Принадлежит: Young Fast Optoelectronics Co Ltd

A signal wiring of a touch panel mainly extends a boding portion of a touch sensing unit from a signal wire on a substrate outside the substrate. The bonding portion is further attached to a signal bus so as to shrink the wiring area of the touch sensing unit and the edge frame as well. The bonding portion outside the substrate is allowed to be formed larger for improve the stability and yield of the connection between the touch sensing unit and the signal bus.

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27-02-2014 дата публикации

Conductive component and preparation method thereof

Номер: US20140054076A1
Принадлежит: Shenzhen OFilm Tech Co Ltd

A conductive component is disclosed in the present invention, which includes an insulating layer and a metal mesh arranged on the insulating layer, the metal mesh defines a plurality of voids arranged in array, the aperture ratio K of the voids of the metal mesh and the optical transmittance T 1 of the conductive component and the optical transmittance T 2 of the insulating layer being described as formula: T 1 =T 2 *K. The metal mesh is arranged on the insulating layer in the conductive component, a patterned sensing layer on the insulating layer by the metal mesh treated by exposure and development as needed when in use, and then applied to touch screen, the use of indium tin oxide is avoided in the conductive component, thus the cost of the conductive component is low. A method of preparing the conductive component is also provided.

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27-02-2014 дата публикации

NOVEL FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH CONDUCTIVE LAYER

Номер: US20140054081A1
Принадлежит: KANEKA CORPORATION

A conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film on the electromagnetic-shielding conductive film (A); and (C) a wiring-pattern-equipped film on the insulator film (B), the insulator film (B) containing at least (a) a binder polymer and (b) spherical organic beads. 1. A conductive-layer-integrated flexible printed circuit board comprising:(A) an electromagnetic-shielding conductive layer;(B) an insulator film on the electromagnetic-shielding conductive film (A); and(C) a wiring-pattern-equipped film on the insulator film (B),the insulator film (B) containing at least (a) a binder polymer and (b) spherical organic beads.2. The conductive-layer-integrated flexible printed circuit board as set forth in claim 1 , wherein the insulator film (B) contains (c) fine particles containing at least one type of element selected from the group consisting of phosphorus claim 1 , aluminum claim 1 , and magnesium.3. The conductive-layer-integrated flexible printed circuit board as set forth in claim 1 , wherein the electromagnetic-shielding conductive layer (A) contains (f) at least one type of element selected from the group consisting of silver claim 1 , copper claim 1 , aluminum claim 1 , and nickel.4. The conductive-layer-integrated flexible printed circuit board as set forth in claim 1 , wherein the insulator film (B) is made from a resin composition containing (d) a thermosetting resin.5. The conductive-layer-integrated flexible printed circuit board as set forth in claim 1 , wherein the insulator film (B) is made from a photosensitive resin composition containing (e) a photopolymerization initiator. The present invention relates to a conductive-layer-integrated flexible printed circuit board which is excellent in adhesion between an electromagnetic-shielding conductive layer and an insulator film, which is excellent in flexibility that can withstand repeated folding, in flame ...

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06-03-2014 дата публикации

Flexible Substrate, Support Platform, Flexible Display And Manufacturing Method Thereof

Номер: US20140065388A1
Автор: Zhou Weifeng
Принадлежит: BOE Technology Group Co., Ltd.

The invention relates to manufacturing of displays. A flexible substrate is disclosed, which has a plurality of spacers arranged at intervals on one side thereof. The invention also discloses a support platform with spacers arranged at intervals, a flexible display formed from the flexible substrate with the spacers arranged at intervals and a method for manufacturing the flexible display. 1. A flexible substrate , wherein a plurality of spacers are arranged at intervals on one side of the flexible substrate.2. The flexible substrate in accordance with claim 1 , wherein the distance between any two adjacent ones of the plurality of spacers is from 10 to 500 μm.3. The flexible substrate in accordance with claim 2 , wherein the spacers are arranged in an array claim 2 , and each of the spacers has a cuboid structure with a height thereof ranging from 0.25 to 10 μm.4. The flexible substrate in accordance with claim 3 , wherein each of the spacers has a length and a width ranging from 10 to 500 μm.5. The flexible substrate in accordance with claim 2 , wherein each of the spacers has a cross-section shape of a trapezoid claim 2 , a triangle claim 2 , or a diamond.6. The flexible substrate in accordance with claim 5 , wherein the spacers are made of one of resin. silicon oxide claim 5 , silicon nitride and metal oxide claim 5 , or a combination thereof.7. The flexible substrate in accordance with claim 1 , wherein the flexible substrate is one of an ultra-thin glass substrate claim 1 , a plastic substrate claim 1 , a metal substrate or a combination thereof.8. A support platform for a flexible substrate claim 1 , comprising a plurality of spacers arranged at intervals on a surface of the support platform for flexible substrate.9. The support platform in accordance with claim 8 , wherein a distance between any two adjacent ones of the plurality of spacers is from 10 to 500 μm.10. The support platform in accordance with claim 9 , wherein the spacers are arranged in an array ...

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03-04-2014 дата публикации

In-Situ Fold-Assisting Frame for Flexible Substrates

Номер: US20140090243A1
Автор: Primavera Anthony A.
Принадлежит: BIOTRONIK SE & Co. KG

A method for manufacturing devices built on flexible substrates employs an in-situ, fold-assisting device frame. The fold-assisting frame conforms to a portion of the interior volume within the package, such that one or more pivoting members of the frame may be used as an in-situ, bending jig, in place of conventional bending equipment, to support and fold the planar flexible substrate into a desired three-dimensional configuration. The frame may accommodate placement of an unfolded or partially folded flexible circuit board so that a fold-assisting feature, such as a hinge, incorporated into the frame attaches to the flexible circuit board and closes around a pivot point to gently bend the circuit board into place, thus creating a three-dimensional folded circuit. Such a fixture and method facilitate packaging electronic devices in a compact form, with application to a wide range of mobile consumer electronics, including, for example, implantable medical devices. 16-. (canceled)7. A method of folding a flexible substrate , in situ , within a device frame , the method comprising the steps of:providing a flexible frame of which at least a portion conforms to an interior shape of a device housing;aligning a pivoting portion of the flexible frame to a corresponding portion of the flexible substrate;securing the pivoting portion to the flexible substrate portion; andbending the pivoting portion of the flexible frame and the flexible substrate portion together into a desired three-dimensional configuration to fit conformally within the housing.8. The method of claim 7 , wherein aligning the pivoting portion of the flexible frame to a corresponding portion of the flexible substrate comprises placing the flexible substrate into a central compartment of the flexible frame.9. The method of claim 7 , wherein securing the pivoting portion to the flexible substrate portion comprises securing an upper substrate extension of the flexible substrate to the pivoting member by a ...

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03-04-2014 дата публикации

Electronic Devices With Flexible Circuit Light Shields

Номер: US20140092034A1
Принадлежит: Apple Inc.

Electronic devices may include displays. A display may include backlight structures that generate light and display layers that generate images using the generated light. An electronic device may include an opaque flexible printed circuit that is wrapped around one or more edges of the backlight structures. The opaque flexible printed circuit may prevent light from the backlight structures from reaching other electronic components or escaping from the device. The opaque flexible printed circuit may include signal lines that communicate signals between a printed circuit board and the display. The opaque flexible printed circuit may be a layer of the printed circuit board that extends from an edge of the printed circuit board. The printed circuit board may include an additional flexible extended printed circuit layer that wraps around a surface of the printed circuit board and forms a portion of a conductive shield over that surface. 1. An electronic device , comprising:a display having backlight structures and display layers, wherein the backlight structures are configured to generate light that passes through the display layers during operation of the display; anda printed circuit board having a plurality of printed circuit layers, wherein one of the printed circuit layers is an opaque flexible printed circuit layer that extends from an edge of the printed circuit board around an edge of the backlight structures and wherein the opaque flexible printed circuit layer has an end that is attached to the display layers.2. The electronic device defined in claim 1 , further comprising an electronic component claim 1 , wherein the opaque flexible printed circuit layer prevents additional light that has been generated by the backlight structures from reaching the electronic component.3. The electronic device defined in wherein the display layers include a thin-film transistor layer and wherein the end of the opaque flexible printed circuit layer is attached to the thin-film ...

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10-04-2014 дата публикации

For Electrical Circuits

Номер: US20140097010A1
Автор: Plant Philip
Принадлежит: Plasyl Limited

An electrically conductive pathway including a plurality of pathway sections which are connected end to end, and wherein each pathway section includes: 1. An electrically conductive pathway including a plurality of pathway sections which are connected end to end , and wherein each pathway section includes:a) a first elongate part;b) a second elongate part;c) a first resiliently flexible part connected at one end to an second end of the first part and connected at its opposite end to a first end of the second part; andd) a second resiliently flexible part connected at one end to an second end of the second part and connected at its opposite end to a first end of the first part of an adjacent pathway section.2. An electrically conductive pathway according to wherein the plurality of pathway sections are substantially identical to each other.3. An electrically conductive pathway according to wherein the first and second elongate parts of the pathway section are one of:a) substantially rectilinear;b) oblique to an elongate axis of the pathway; orc) each inclined at an angle to an elongate axis of the pathway.4. (canceled)5. (canceled)6. An electrically conductive pathway according to wherein the angle is in the range of 15° to 75°.7. An electrically conductive pathway according to wherein the angle is in the range of 30° to 60°.8. (canceled)9. (canceled)10. An electrically conductive pathway according to wherein each resiliently flexible part includes a plurality of portions which are connected claim 1 , and resiliently moveable relative claim 1 , to each other.11. An electrically conductive pathway according to any wherein;a) at least one of the portions of each resiliently flexible part is substantially rectilinear, or oblique to an elongate axis of the pathway; orb) all portions of each resiliently flexible part are oblique to an elongate axis of the pathway; orc) adjacent portions of each resiliently flexible part are inclined at an angle to each other.12. (canceled ...

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03-01-2019 дата публикации

LIQUID EJECTION HEAD

Номер: US20190001674A1
Принадлежит:

The liquid ejection head includes an element substrate including an energy-generating element that applies ejection energy to liquid, a first electric wiring board electrically connected to the element substrate and a second electric wiring board on which an integrated circuit element is mounted and which is electrically connected to the first electric wiring board An electric signal is supplied to the integrated circuit element mounted on the second electric wiring board through the first electric wiring board processed by the integrated circuit element and supplied to the energy-generating element through the second electric wiring board and the first electric wiring board 1. A liquid ejection head comprising:an element substrate including an energy-generating element that applies energy for ejecting liquid;a first electric wiring board electrically connected to the element substrate; anda second electric wiring board on which an integrated circuit element is mounted, the second electric wiring board being electrically connected to the first electric wiring board, whereinan electric signal is supplied to the integrated circuit element mounted on the second electric wiring board through the first electric wiring board, the electric signal is processed by the integrated circuit element, and the electric signal is supplied to the energy-generating element through the second electric wiring board and the first electric wiring board.2. The liquid ejection head according to claim 1 , wherein the second electric wiring board is further away from the element substrate than the first electric wiring board.3. The liquid ejection head according to claim 1 , wherein the element substrates claim 1 , the first electric wiring board claim 1 , and the second electric wiring board form part of a heat conduction path made of a solid medium which is continuously connected from the integrated circuit element to the element substrate claim 1 , and on the heat conduction path claim 1 , ...

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01-01-2015 дата публикации

FLEXIBLE ELECTRONIC DEVICE

Номер: US20150003024A1
Принадлежит: AU OPTRONICS CORP.

A flexible electronic device includes a flexible film, an electronic element layer, and a protecting film, wherein the electronic element layer is disposed on a top surface of the flexible film, and the protecting film is disposed on the top surface of the flexible film and covers the electronic element layer. The protecting film has at least one side wall connected to the top surface of the flexible film to form an included angle between the side wall and the flexible film, wherein the included angle is an acute angle. 1. A flexible electronic device , comprising:a flexible film, having a top surface;an electronic element layer, disposed on the top surface of the flexible film; anda protecting film, disposed on the top surface of the flexible film and covering the electronic element layer, the protecting film having at least one side wall connected to the top surface of the flexible film to form an included angle between the side wall and the top surface, wherein the included angle is an acute angle.2. The flexible electronic device according to claim 1 , wherein the included angle is equal to or less than about 60 degrees.3. The flexible electronic device according to claim 2 , wherein the included angle has a range from about 30 degrees to about 60 degrees.4. The flexible electronic device according to claim 1 , wherein an area of the protecting film is less than an area of the flexible film claim 1 , and a side edge of the flexible film is uncovered with the protecting film.5. The flexible electronic device according to claim 1 , wherein the protecting film comprises one of a water/oxygen barrier film claim 1 , an explosion proof film claim 1 , an anti-glare layer and a polarizer.6. The flexible electronic device according to claim 1 , wherein the protecting film comprises plastic material or metal material.7. The flexible electronic device according to claim 1 , wherein the protecting film is a single layer structure or a multilayer structure.8. The flexible ...

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01-01-2015 дата публикации

FLEXIBLE PRINTED WIRING BOARD, FLEXIBLE CIRCUIT BOARD, AND ELECTRONIC APPARATUS USING THE FLEXIBLE CIRCUIT BOARD

Номер: US20150003083A1
Автор: UEHARA Hiroharu
Принадлежит:

An FPC includes: a base film including a first metal sheet; a first adhesive layer laminated on one of surfaces of the base film; and a conductor pattern bonded by the first adhesive layer; wherein a plurality of planar portions held in a planar shape and bending portions to be bent provided between the planar portions are arranged in a longitudinal direction, and the conductor pattern is covered by a metal support cover film including a second metal sheet and a second adhesive layer at the planar portions and is covered by a solder resist at the bending portions. 1. A flexible printed wiring board comprising: a base film including a first metal sheet; a first adhesive layer laminated on one of surfaces of the base film; a conductor pattern bonded by the first adhesive layer; and a cover layer that covers the conductor pattern , whereina plurality of planar portions held in a planar shape and bending portions provided between the planar portions are arranged in a longitudinal direction,the cover layer provided to the planar portions includes a second metal sheet and a second adhesive layer, andthe cover layer provided to the bending portions includes a resin cover coat.2. The flexible printed wiring board according to claim 1 , whereinthe second metal sheet is made of aluminum foil of 15 to 50 μm in thickness.3. The flexible printed wiring board according to claim 1 , whereinthe planar portions include two planar portions which are an LED-mount planar portion provided with an LED and a connection planar portion not provided with an LED, and the bending portions are connected and arranged in the longitudinal direction between the two planar portions.4. The flexible printed wiring board according to claim 1 , whereinboth surfaces of at least one of the first metal sheet and the second metal sheet are covered by organic insulating films including a polyimide resin of 4 μm in thickness.5. The flexible printed wiring board according to claim 1 , whereinthe first metal ...

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06-01-2022 дата публикации

OPTICAL MODULE

Номер: US20220007496A1
Принадлежит: FURUKAWA ELECTRIC CO., LTD.

An optical module includes a box-shaped housing with an optical element mounted therein. Further, a wiring substrate is bonded to a part of a surface of a housing part of the housing, and an electric wiring, which is formed in the wiring substrate or on a surface of the wiring substrate, and an electric wiring, which is introduced into the housing part or onto a surface of the housing part, are electrically connected to each other. 1. An optical module having a box-shaped housing with an optical element mounted therein , whereina wiring substrate is bonded to a part of a surface of a housing part of the housing, andan electric wiring, which is formed in the wiring substrate or on a surface of the wiring substrate, and an electric wiring, which is introduced into the housing part or onto a surface of the housing part, are electrically connected to each other.2. The optical module according to claim 1 , wherein the wiring substrate is a flexible substrate.3. The optical module according to claim 1 , wherein the wiring substrate is formed of polyimide claim 1 , a liquid crystal polymer resin claim 1 , or polytetrafluoroethylene resin.4. The optical module according to claim 1 , wherein the electric wiring formed in or on the wiring substrate is a coplanar line claim 1 , a microstrip line claim 1 , or a coplanar line having a ground surface.5. The optical module according to claim 4 , wherein a sheet formed of an organic matter is thermally bonded onto a signal line claim 4 , or an organic sheet is resin-bonded onto the signal line claim 4 , or the signal line has a resin coating thereon; ground surfaces are formed on an upper surface of the sheet claim 4 , the organic sheet claim 4 , or the resin coating; and electrically conductive via holes are formed at narrow pitches of 0.03 mm to 5 mm between the two or three ground surfaces.6. The optical module according to claim 1 , wherein the wiring substrate has a resin coating on all of surfaces of the wiring substrate ...

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07-01-2016 дата публикации

DISPLAY APPARATUS

Номер: US20160004275A1
Автор: PARK Sunghwan
Принадлежит:

A display apparatus including: a display panel including a substrate and an encapsulating member and realizing an image; a circuit member arranged to overlap at least a portion of the substrate of the display panel; and a shield member arranged between a surface portion of the substrate of the display panel and the circuit member, the surface portion overlapping the circuit member. 1. A display apparatus comprising:a display panel configured to form an image and comprising a substrate and an encapsulating member;a circuit member overlapping at least a portion of the substrate of the display panel; anda shield member arranged between the substrate of the display panel and the circuit member.2. The display apparatus of claim 1 , wherein the shield member faces the encapsulating member.3. The display apparatus of claim 1 , wherein:the encapsulating member covers a first portion of a surface of the substrate and exposes a second portion of the surface of the substrate; andthe shield member is disposed on the exposed second portion of the surface of the s substrate.4. The display apparatus of claim 1 , wherein the shield member is disposed adjacent to or apart from a side surface of the encapsulating member.5. The display apparatus of claim 1 , wherein a first side of the shield member contacts the substrate and an opposing second side of the shield member contacts the circuit member.6. The display apparatus of claim 1 , wherein the shield member comprises an adhesive material.7. The display apparatus of claim 1 , wherein the shield member comprises double-sided tape adhering the substrate and the circuit member.8. The display apparatus of claim 1 , further comprising an integrated circuit (IC) disposed on the substrate claim 1 ,wherein the shield member is disposed between the IC and a side of the encapsulating member.9. The display apparatus of claim 1 , further comprising a pad portion disposed on a surface of the encapsulating member that faces away from the ...

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03-01-2019 дата публикации

ARRAY SUBSTRATE, LIQUID CRYSTAL PANEL, AND LIQUID CRYSTAL DISPLAY

Номер: US20190004358A1
Автор: YANG Chengao

The present invention discloses an array substrate, a liquid crystal panel and a liquid crystal display. The array substrate includes a main substrate and an auxiliary substrate, and a plurality of gate scan lines are provided on the main substrate; a gate driver circuit and a plurality of first wires connected to the gate driver circuit are provided on the auxiliary substrate; wherein the auxiliary substrate is bonded to the main substrate so that the plurality of first wires are electrically connected to the plurality of gate scan lines, and the auxiliary substrate is a flexible substrate and is capable of being bent and disposed corresponding to the main substrate. The present invention can realize the ultra-narrow frame of the liquid crystal panel and improve the driving ability of the display. 1. A liquid crystal panel , wherein the liquid crystal panel comprises an array substrate and a counter substrate disposed opposite to a main substrate of the array substrate , the array substrate comprising:the main substrate, a plurality of gate scan lines being provided on the main substrate;an auxiliary substrate, a gate driver circuit and a plurality of first wires connected to the gate driver circuit being provided on the auxiliary substrate;wherein the auxiliary substrate is bonded on the main substrate so that the plurality of first wires are electrically connected to the plurality of gate scan lines respectively, and the auxiliary substrate is a flexible substrate and is capable of being bent and disposed corresponding to the main substrate;the gate driver circuit is a GOA circuit, the plurality of first wires are formed by extending at least one metal layer in the GOA circuit; andthe first wires in a bent region of the auxiliary substrate is provided with a hole-like hollow structure.2. The array substrate according to claim 1 , wherein the main substrate is further provided with a display driver chip claim 1 , and the auxiliary substrate is further provided ...

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13-01-2022 дата публикации

CONNECTION MODULE

Номер: US20220013867A1
Принадлежит:

A connection module is a module mounted on a power storage element group including power storage elements having electrode terminals and connecting the power storage elements. The connection module includes a FPC including wiring portions and bus bars connected to the wiring portions and connecting the electrode terminals of the power storage elements that are adjacent to each other. The FPC includes a first multi-layered portion including the wiring portions that are overlapped with each other by folding the FPC and includes a second multi-layered portion including the wiring portions that are overlapped with each other by folding the FPC. 1. A connection module to be mounted on a power storage element group including power storage elements having electrode terminals and connecting the power storage elements , the connection module comprising:a flexible printed circuit board including routing portions; andconnection members connected to the routing portions and connecting the electrode terminals of the power storage elements that are adjacent to each other, whereinthe flexible printed circuit board includes a multi-layered portion including the routing portions that are overlapped with each other by folding the flexible printed circuit board.2. The connection module according to claim 1 , further comprising a holding member that holds the connection members and the multi-layered portion. The technology disclosed herein relates to a connection module.A connection module for an electric automobile or a hybrid automobile includes a battery block and a connection module. The battery block includes battery cells and the connection module is attached to the battery block to connect the battery cells. A flexible printed wiring board with bus bars has been known as such a connection module (refer to Patent Document 1). The flexible printed wiring board includes a flexible printed circuit board (FPC) and bus bars that are connected to the flexible printed circuit board and ...

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05-01-2017 дата публикации

FOLDABLE DISPLAY APPARATUS

Номер: US20170006725A1
Принадлежит:

A foldable display apparatus that is adjustable between a folded configuration and unfolded configuration includes a flexible display panel that is foldable; a case including a first case that supports a first side of the flexible display panel and a second case that supports a second side of the flexible display panel; a link member connecting the first case to the second; and a locking unit configured to prevent rotation of the first case and the second case in a folding direction when the foldable display apparatus is in the unfolded configuration. 1. A foldable display apparatus that is adjustable between a folded configuration and an unfolded configuration , the foldable display apparatus comprising:a flexible display panel that is foldable; a first case that supports a first side of the flexible display panel; and', 'a second case that supports a second side of the flexible display panel;, 'a case comprisinga link member connecting the first case to the second case; anda locking unit configured to prevent rotation of the first case and the second case in a folding direction when the foldable display apparatus is in the unfolded configuration.2. The foldable display apparatus of claim 1 , wherein the locking unit comprises:a slide cover rotatably coupled to the first case and slidably coupled to the second case; anda locking lever rotatably mounted on the second case and configured to prevent sliding of the slide cover when the locking lever is in a locked position.3. The foldable display apparatus of claim 2 , wherein the slide cover slides along a rail groove in the second case when the first case and the second case are rotated to move the foldable display apparatus between the folded configuration and the unfolded configuration claim 2 , andwherein rotation of the first and second cases is inhibited when movement of the slide cover along the rail groove is blocked.4. The foldable display apparatus of claim 3 , wherein a body center of the slide cover is ...

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08-01-2015 дата публикации

PRINTED CIRCUIT BOARD

Номер: US20150008017A1
Принадлежит:

Provided is a printed circuit board, comprising: a supporting substrate including a first region and a second region extending to be bent from the first region; an insulating substrate above the supporting substrate; a bending portion bent between the first region and the second region; and an adhesive layer between the supporting substrate and the insulating substrate and except for the bending portion. 1. A printed circuit board , comprising:a supporting substrate including a first region and a second region extending to be bent from the first region;an insulating substrate on the supporting substrate;a bending portion between the first region and the second region; andan adhesive layer between the supporting substrate and the insulating substrate except for the bending portion.2. The printed circuit board of claim 1 , wherein the insulating substrate has wrinkles in a region corresponding to the bending portion.3. The printed circuit board of claim 1 , wherein a part of the supporting substrate is removed in a shape corresponding to the bending portion.4. The printed circuit board of claim 1 , wherein a thickness of the supporting substrate corresponding to the bending portion is smaller than that of the supporting substrate of the first region and the second region.5. The printed circuit board of claim 4 , wherein the adhesive layer has the same area as that of each of the first region and the second region.6. The printed circuit board of claim 1 , further comprising a filling material layer formed by filling the bending portion with the same material as a material which constitutes the insulating substrate.7. The printed circuit board of claim 1 , further comprising a filling material layer formed by filling the bending portion with a different material from the material which constitutes the insulating substrate.8. The printed circuit board of claim 2 , wherein the wrinkles have a larger roughness than that of the first region and the second region.9. The ...

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08-01-2015 дата публикации

Circuit board and method of manufacturing the same

Номер: US20150008029A1
Автор: Chien-Cheng Lee
Принадлежит: Boardtek Electronics Corp

A circuit board includes a substrate and a through via. The substrate has a first surface and a second surface opposite to the first surface. The substrate includes circuit layers and insulation layers. The insulation layers are sandwiched between the circuit layers. The through via goes through the substrate and has portions defining a first portion and a second portion. The first portion of the through via is coated with a first metal layer and electrically connected to at least one of the circuit layer by the first metal layer. The second portion of the through via is coated with a second metal layer and electrically connected to at least one of the circuit layer by the second metal layer. The first and second portions are electrically insulted, and the diameter of the second portion is larger than that of the first portion.

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07-01-2016 дата публикации

FOLDING TYPE DISPLAY APPARATUS AND ELECTRIC EQUIPMENT

Номер: US20160007441A1
Автор: Matsueda Yojiro
Принадлежит: NLT TECHNOLOGIES, LTD.

Disclosed are folding type display apparatuses. The folding type display apparatus comprises a flexible display section, and a plurality of housings, which includes a first housing having a space formed therein, and second and third housings bendably connected to both ends of the first housing. The display section is fixed to the second and third housings, and in a closed state of the second and third housings, a folding portion of the display section is housed in the space formed by the first housing, while in an open state of the second and third housings away from each other, the display section becomes flat, and the first housing functions as a leg protruding from flat surfaces of the second and third housings, so that the second and third housings are fixed to each other and the folding portion of the display section is supported, by a holding member for connecting these housings. 1. A folding type display apparatus , comprising:a sheet-shaped display section having flexibility; anda plurality of housings which hold the sheet-shaped display section,wherein the plurality of housings include a first housing which has a cross section of a channel shape with a space formed therein, and a plate-shaped second housing and a plate-shaped third housing which are bendably connected to both ends of the first housing in a direction being separated from each other,the display apparatus further comprises a holding member which is held in the second and/or the third housing,the sheet-shaped display section is fixed to the second housing and the third housing so as to be folded on a side of the first housing,in a closed state of the second housing and the third housing, a folding portion of the display section is housed in the space formed by the first housing,in an open state of the second housing and the third housing away from each other to form the flat display section, and the first housing functions as a leg which protrudes from flat surfaces of the second housing and ...

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07-01-2016 дата публикации

REINFORCING MEMBER FOR FLEXIBLE PRINTED WIRING SUBSTRATE, FLEXIBLE PRINTED WIRING SUBSTRATE, AND SHIELD PRINTED WIRING SUBSTRATE

Номер: US20160007444A1
Принадлежит: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of a base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 μm thick. 1. A reinforcing member for a printed wiring board , which is disposed opposite to a predetermined part of a ground wiring pattern of the printed wiring board and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern via a conductive composition layer and the other surface in electrical conduction with an external ground member which is at a ground potential , the one surface and the other surface opposing each other , the reinforcing member comprising:a metal base which is conductive; anda surface layer which is formed on a surface of the metal base to constitute at least a part of the other surface,the surface layer having higher conductivity and corrosion resistance than the metal base, andthe surface layer being 0.004 to 0.2 μm thick.2. The reinforcing member according to claim 1 , wherein claim 1 , the surface layer is formed of alloy which is made of noble metal or is mainly made of noble metal.3. The reinforcing member according to claim 2 , wherein claim 2 , the noble metal is gold or palladium.4. The reinforcing member according to ...

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07-01-2021 дата публикации

FLEXIBLE PRINTED CIRCUIT BOARD AND MOBILE TERMINAL COMPRISING SAME

Номер: US20210007213A1
Принадлежит: LG ELECTRONICS INC.

A mobile terminal includes a case; a circuit board disposed inside the case; a flexible printed circuit board electrically connected to the circuit board, and having insulating layers and conductive layers stacked in an alternating manner; a first antenna disposed on a first region of the flexible printed circuit board and facing an end surface of the case and configured to transmit radio signals in a direction toward the end surface of the case; a plurality of microstrip lines disposed on a bent second region of the flexible printed circuit board at a side portion of the first region; and a copper clad laminate stacked second antenna disposed on a third region of the flexible printed circuit board positioned on another side portion of the second region and configured to transmit radio signals in a direction toward a side surface of the case. 120-. (canceled)21. A mobile terminal comprising:a case;a circuit board disposed inside the case;a flexible printed circuit board electrically connected to the circuit board, and having insulating layers and conductive layers stacked in an alternating manner;a first antenna disposed on a first region of the flexible printed circuit board and facing an end surface of the case and configured to transmit radio signals in a direction toward the end surface of the case;a plurality of microstrip lines disposed on a bent second region of the flexible printed circuit board at a side portion of the first region; anda copper clad laminate stacked second antenna disposed on a third region of the flexible printed circuit board positioned on another side portion of the second region and configured to transmit radio signals in a direction toward a side surface of the case.22. The mobile terminal of claim 21 , wherein the second antenna comprises an array antenna disposed on an outer surface of the third region.23. The mobile terminal of claim 21 , wherein the flexible printed circuit board includes a plurality of through holes in the first ...

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04-01-2018 дата публикации

FLEXIBLE BOARD AND PRODUCTION METHOD FOR METAL WIRING BONDING STRUCTURE

Номер: US20180007780A1
Принадлежит: NGK Insulators, Ltd.

A connection FPC includes a plurality of metal wires between a support layer and a covering layer , and an exposed region including contacts serving as end portions of the metal wires is exposed from the covering layer . A bending-position guide is provided on the surface of the support layer opposite from the surface on which the metal wires are provided. An edge of the bending-position guide serves as a bending line along which the connection FPC is bent and is disposed in a covering-layer projection area E where the covering layer is projected on the support layer . The connection FPC is bent at portions of the metal wires covered with the covering layer , that is, at reinforced portions. 1. A flexible board including a plurality of metal wires between a first resin layer and a second resin layer , and an exposed region including contacts serving as end portions of the Metal wires and exposed from the second resin layer ,wherein a bending-position guide is provided on a surface of the first resin layer opposite from a surface on which the metal wires are provided, andan edge of the bending-position guide serves as a bending line along which the flexible board is bent and is disposed in a projection area where the second resin layer is projected on the first resin layer.2. The flexible board according to claim 1 ,wherein the bending-position guide is provided so as to cross a boundary between portions of the metal wires that are covered with the second resin layer and portions of the metal wires that are not covered with the second resin layer.3. The flexible board according to claim 1 ,wherein a distance from the boundary between the portions of the metal wires that are covered with the second resin layer and the portions of the metal wires that are not covered with the second resin layer to the edge of the bending-position guide is set to be equal to or more than a thickness of a portion of the flexible board in contact with the edge.4. The flexible board ...

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04-01-2018 дата публикации

FLEXIBLE PRINTED CIRCUIT, CHIP ON FILM, AND BONDING METHOD AND DISPLAY DEVICE USING THE SAME

Номер: US20180007793A1
Принадлежит:

This disclosure discloses a flexible printed circuit, a chip on film, and a bonding method and a display device using this flexible printed circuit and chip on film. The flexible printed circuit/chip on film of this disclosure a humidity detection layer located between a flexible base film and a metal foil, wherein the humidity detection layer and the flexible base film, and/or the humidity detection layer and the metal foil, are optionally bonded by an adhesive layer. The humidity detection layer can change resistance and/or color according to the humidity, so that intuitive and rapid localization of coating badness is performed directly (by color change) or by means of a detecting lead and an impedance/voltage detecting circuit, and finally the object of reducing the ratio of defective products is achieved. 1. A flexible printed circuit , comprising a humidity detection layer located between a flexible base film and a metal foil , wherein the humidity detection layer and the flexible base film , and/or the humidity detection layer and the metal foil , are optionally bonded by an adhesive layer.2. The flexible printed circuit according to claim 1 , wherein the humidity detection layer comprises a hygroscopic film sheet.3. The flexible printed circuit according to claim 2 , wherein the hygroscopic film sheet comprises a carbon film hygristor and a lithium chloride humidity sheet.4. The flexible printed circuit according to claim 2 , wherein the humidity detection layer further comprises a color changeable material located above the hygroscopic film sheet claim 2 , and the color of the color changeable material changes as the humidity changes.5. The flexible printed circuit according to claim 4 , wherein the color changeable material comprises color changeable silica gel and anhydrous copper sulfate.6. The flexible printed circuit according to claim 4 , wherein the color changeable material is distributed on the hygroscopic film sheet in a dot-like or net-like form.7 ...

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08-01-2015 дата публикации

IMAGE DISPLAY DEVICE

Номер: US20150009635A1
Принадлежит: LG ELECTRONICS INC.

An image display device includes a flexible display unit bendable by an external force between a first state and a second state having different radii of curvature from each other, a pressing member disposed to face the flexible display unit and configured to apply the external force to the flexible display unit in a bending manner, and a drive part configured to pull both ends of the pressing member such that the pressing member is bent.

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08-01-2015 дата публикации

ELECTROMAGNETIC SHIELDING FILM, FLEXIBLE PRINTED WIRING BOARD WITH ELECTROMAGNETIC SHIELDING FILM, ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME

Номер: US20150009637A1
Автор: Kawaguchi Toshiyuki
Принадлежит:

A electromagnetic shielding film includes a conductive supporting substrate which includes a cured material of a thermosetting resin including a conductive filler; a metal thin film layer which covers one surface of the conductive supporting substrate; a thermosetting adhesive layer which covers a surface of the metal thin film layer; and a peeling substrate which covers the other surface of the conductive supporting substrate. 1. An electromagnetic shielding film comprising:a conductive supporting substrate which includes a cured material of a thermosetting resin including a conductive filler;a metal thin film layer which covers one surface of the conductive supporting substrate;a thermosetting adhesive layer which covers a surface of the metal thin film layer; anda peeling substrate which covers the other surface of the conductive supporting substrate.2. The electromagnetic shielding film according to claim 1 , wherein a storage modulus of the conductive supporting substrate at 180° C. is from 8×10to 1×10Pa.3. The electromagnetic shielding film according to claim 1 , whereinthe conductive filler is a fibrous conductive filler.4. A flexible printed wiring board with the electromagnetic shielding film comprising:a flexible printed wiring board which includes a base film including polyimide and a printed circuit positioned on at least one surface of the base film; and{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the electromagnetic shielding film according to in which the thermosetting adhesive layer is adhered to at least one surface of the flexible printed wiring board and the thermosetting adhesive layer is cured.'}5. A flexible printed wiring board with the electromagnetic shielding film comprising:a flexible printed wiring board which includes a base film including polyimide and a printed circuit positioned on at least one surface of the base film; andan electromagnetic shielding film,wherein the electromagnetic shielding film comprises:a conductive ...

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03-01-2019 дата публикации

PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT

Номер: US20190008035A1
Принадлежит:

A printed circuit board according to an embodiment of the present invention includes a base film containing, as a main component, a polyimide and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film. An external transmittance for a wavelength of 500 nm in a conductive pattern non-formed region of the base film is 70% or less of an internal transmittance for a wavelength of 500 nm in a middle layer portion of the base film. 1. A printed circuit board comprising:a base film containing, as a main component, a polyimide; anda conductive pattern disposed on at least one surface of the base film,wherein the conductive pattern includes a copper particle bond layer which is fixed to the base film, andan external transmittance for a wavelength of 500 nm in a conductive pattern non-formed region of the base film is 70% or less of an internal transmittance for a wavelength of 500 nm in a middle layer portion of the base film.2. The printed circuit board according to claim 1 , wherein the middle layer portion of the base film is a portion excluding at least a modified surface layer.3. The printed circuit board according to claim 1 , wherein the base film does not substantially contain a pigment.4. The printed circuit board according to claim 1 , wherein the external transmittance for a wavelength of 500 nm in the conductive pattern non-formed region of the base film is 15% or less.5. An electronic component comprising the printed circuit board according to and an element mounted on the printed circuit hoard. The present invention relates to a printed circuit board and an electronic component.The present application is based upon and claims the benefit of priority from Japanese Patent Application No. 2015-160591, filed Aug. 17, 2015, the entire contents of which are incorporated herein by reference.There is a known printed circuit board which includes a base film and a ...

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11-01-2018 дата публикации

ROLLABLE DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME

Номер: US20180011510A1
Принадлежит:

A rollable display device includes a rollable structure including a plurality of unit structures, a display panel structure attached to the rollable structure, and a plurality of magnetic objects on a bezel region of the rollable structure, wherein respective widths of the unit structures increase in a direction from a first side of the rollable structure to a second side of the rollable structure, wherein the unit structures collectively form first through (n)th rolling cycles, as the rollable structure is rolled, and a (k)th rolling cycle encircles a (k−1)th rolling cycle, and wherein the plurality of magnetic objects aligns the (k)th rolling cycle with the (k−1)th rolling cycle by causing a magnetic attraction between the (k)th rolling cycle and the (k−1)th rolling cycle. 1. A rollable display device , comprising:a rollable structure including a plurality of unit structures, the rollable structure being rollable and unrollable based on the unit structures;a display panel structure attached to the rollable structure; anda plurality of magnetic objects on a bezel region of the rollable structure,wherein respective widths of the unit structures increase in a direction from a first side of the rollable structure to a second side of the rollable structure, the first side of the rollable structure being opposite to the second side of the rollable structure,wherein the unit structures collectively form first through (n)th rolling cycles, where n is an integer greater than or equal to 2, as the rollable structure is rolled, and a (k)th rolling cycle encircles a (k−1)th rolling cycle, where k is an integer between 2 and n, andwherein the plurality of magnetic objects aligns the (k)th rolling cycle with the (k−1)th rolling cycle by causing a magnetic attraction between the (k)th rolling cycle and the (k−1)th rolling cycle.2. The rollable display device as claimed in claim 1 , wherein claim 1 , when the rollable structure is rolled:a first surface of the (k)th rolling cycle ...

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27-01-2022 дата публикации

IMAGING MODULE AND IMAGING DEVICE

Номер: US20220030715A1
Принадлежит:

An imaging module includes an electric cable including a plurality of wirings, an imager having an imaging surface intersecting an axial direction of a distal end of the electric cable, and a flexible wiring board configured to electrically connect the imager and the electric cable. The wiring board includes a plurality of extending portions that extend from at least three portions of a connection portion connected with the imager. At least one wiring pad to which at least one of the plurality of wirings of the electric cable is connected is provided in each of the plurality of extending portions. 1. An imaging module comprising:an electric cable including a plurality of wirings;an imager having an imaging surface intersecting an axial direction of a distal end of the electric cable; anda flexible wiring board configured to electrically connect the imager and the electric cable,wherein the wiring board includes a plurality of extending portions that extend from at least three portions of a connection portion connected with the imager, andat least one wiring pad to which at least one of the plurality of wirings of the electric cable is connected is provided in each of the plurality of extending portions.2. The imaging module according to claim 1 , wherein one wiring pad to which one of the plurality of wirings is connected is provided in at least one of the plurality of extending portions.3. The imaging module according to claim 1 , wherein one wiring pad to which each of the plurality of wirings is connected is provided in each of the plurality of extending portions.4. The imaging module according to claim 3 , whereinthe electric cable includes four wirings as the plurality of wirings, and the wiring board includes four extending portions as the plurality of extending portions, andone wiring pad to which each of the four wirings is connected is provided in each of the four extending portions.5. The imaging module according to claim 1 , wherein each of the plurality ...

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15-01-2015 дата публикации

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Номер: US20150014026A1
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Disclosed herein are a printed circuit board and a manufacturing method thereof. The printed circuit board includes a rigid substrate having a solder resist applied thereon and a flexible substrate connected to the rigid substrate in order to increase productivity by simplifying a process of manufacturing the printed circuit board. The manufacturing method includes: attaching a coverlay onto an upper surface of the flexible substrate; attaching an electromagnetic interference (EMI) film onto an upper surface of the coverlay; attaching and pressurizing a substrate molding subsidiary material onto an upper surface of the EMI film; and separating the substrate molding subsidiary material. 1. A manufacturing method of a printed circuit board including a rigid substrate having a solder resist applied thereon and a flexible substrate connected to the rigid substrate , the method comprising:attaching a coverlay onto an upper surface of the flexible substrate;attaching an electromagnetic interference (EMI) film onto an upper surface of the coverlay;attaching and pressurizing a substrate molding subsidiary material onto an upper surface of the EMI film; andseparating the substrate molding subsidiary material.2. The method according to claim 1 , wherein the coverlay and the EMI film are attached and cured by the substrate molding subsidiary material.3. The method according to claim 1 , wherein the substrate molding subsidiary material is thermoformed at a temperature of 170° C. or more.4. The method according to claim 1 , wherein the substrate molding subsidiary material is applied and cured with a pressure of 25 kg/cmor more.5. A printed circuit board manufactured by the manufacturing method according to .6. The method according to claim 3 , wherein the substrate molding subsidiary material is applied and cured with a pressure of 25 kg/cmor more. This application claims the benefit under 35 U.S.C. Section 119 of Korean Patent Application Serial No. 10-2013-0080409, entitled ...

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12-01-2017 дата публикации

DISPLAY DEVICE

Номер: US20170013704A1
Принадлежит:

A curved display device including: a display panel having a curvature; a frame which supports the display panel; and a control circuit coupled to the frame, where the control circuit includes a circuit board coupled to the frame, and an electronic element on a surface of the circuit board opposing the frame. 1. A curved display device comprising:a display panel having a curvature;a frame which supports the display panel; anda control circuit coupled to the frame, a circuit board coupled to the frame; and', 'an electronic element on a surface of the circuit board opposing the frame., 'wherein the control circuit comprises2. The curved display device of claim 1 , further comprising:a coupling portion which couples the frame and the circuit board,wherein the coupling portion is coupled to the frame at an acute angle with respect to a tangent line to a surface of a portion of the frame coupled to the coupling portion .3. The curved display device of claim 2 , wherein the circuit board is spaced apart from the frame at a distance increasing as further away from a center portion of the circuit board.4. The curved display device of claim 3 , wherein the frame comprises a protrusion protruding toward the circuit board.5. The curved display device of claim 4 , wherein the coupling portion is coupled to the protrusion.6. The curved display device of claim 5 , wherein the circuit board contacts the protrusion.7. The curved display device of claim 3 , further comprising:an insulating member between the frame and the circuit board.8. The curved display device of claim 7 , further comprising:a protection member on the circuit board.9. The curved display device of claim 3 , further comprising:a plurality of coupling portions which couples the frame and the circuit board,wherein the coupling portions have different lengths from one another.10. The curved display device of claim 9 , wherein one of the coupling portions on a lower portion of the frame has a greater length than a ...

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12-01-2017 дата публикации

DISPLAY DEVICE

Номер: US20170013726A1
Принадлежит:

A display device that includes a housing with at least one Printed Circuit Board (PCB) and a plurality of rollers disposed in the housing. The display device also includes a display unit which, in turn, includes a display panel and a module cover. The display device further includes a driving unit that is connected to the display panel and the module cover. The driving unit moves the display panel and the module cover between a first state and a second state. In the first state, the panel and module cover are wound around at least one of the plurality of rollers, and in the second state they are unwound from the at least one of the plurality of rollers and exposed by being drawn out from the housing. 1. A display device comprising:a housing having at least one Printed Circuit Board (PCB) for performing a function of the display device and mounted therein; a plurality of rollers disposed in the housing;a display unit which comprises a display panel and a module cover; anda driving unit connected to the display panel and the module cover so as to cause the display panel and the module cover to move from a first state to a second state, wherein the display panel in the first state is wound around at least one of the plurality of rollers, and in the second state is unwound from the at least one of the plurality of rollers and exposed by being drawn out from the housing, wherein the module cover is, in the first state, wound around at least one other of the plurality of rollers, and, in the second state, unwound from the at least one other of the plurality of rollers to contact a rear surface of the display panel.2. The display device of claim 1 , further comprising:an elastic piece disposed on the module cover in a minor axis direction of the display unit and configured to strengthen the display unit in the second state.3. The display device of claim 2 ,wherein there are a plurality of elastic pieces, and the plurality of elastic pieces are spaced apart from each other. ...

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12-01-2017 дата публикации

DRIVING ASSEMBLY TO CURVE DISPLAY MODULE AND DISPLAY DEVICE INCLUDING THE SAME

Номер: US20170013733A1
Принадлежит:

A display device includes: a display module including a display panel which displays an image; a main driving unit on a side of the display module; a first auxiliary driving assembly hinge-connected to a first side of the main driving unit; and a second auxiliary driving assembly hinge-connected to a second side of the main driving unit opposite to the first side thereof. The main driving unit includes: a fixing bracket attached to the side of the display module; a first main actuator hinge-connected to a first side of the fixing bracket; and a second main actuator hinge-connected to a second side of the fixing bracket opposite to the first side thereof. 1. A display device comprising:a display module comprising a display panel which displays an image;a main driving unit on a side of the display module;a first auxiliary driving assembly hinge-connected to a first side of the main driving unit; anda second auxiliary driving assembly hinge-connected to a second side of the main driving unit opposite to the first side thereof, a fixing bracket attached to the side of the display module;', 'a first main actuator hinge-connected to a first side of the fixing bracket; and', 'a second main actuator hinge-connected to a second side of the fixing bracket opposite to the first side thereof., 'wherein the main driving unit comprises2. The display device of claim 1 , whereinthe first auxiliary driving assembly fixed to the side of the display module and comprising a first auxiliary driving unit provided in plural arranged in a row in a first direction from the main driving unit and hinge-connected to each other, andthe second auxiliary driving assembly fixed to the side of the display module and comprising a second auxiliary driving unit provided in plural arranged in a row in a second direction from the main driving unit opposite to the first direction and hinge-connected to each other.3. The display device of claim 2 , wherein the first auxiliary driving unit comprises:a ...

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11-01-2018 дата публикации

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

Номер: US20180014399A1
Принадлежит:

A display device includes: a flexible substrate including a display unit and a plurality of peripheral units which surrounds the display unit and are bent to overlap a part of the display unit; a display member positioned at the display unit and which displays an image; and a signal line positioned at the plurality of peripheral units, where the plurality of peripheral units is bent in a way such that parts of the signal line, which are respectively positioned at adjacent peripheral units, are in contact with each other. 1. A display device comprising:a flexible substrate comprising a display unit and a plurality of peripheral units which surrounds the display unit and are bent to overlap a part of the display unit;a display member positioned at the display unit and which displays an image; anda signal line positioned at the plurality of peripheral units,wherein the plurality of peripheral units is bent in a way such that parts of the signal line, which are respectively positioned at adjacent peripheral units, are in contact with each other.2. The display device of claim 1 , wherein the plurality of peripheral units comprises:a first peripheral unit;a second peripheral unit opposite to the first peripheral unit; anda third peripheral unit positioned between the first peripheral unit and the second peripheral unit, andone end part of the first peripheral unit and one end part of the third peripheral unit overlap each other.3. The display device of claim 2 , whereinthe third peripheral unit comprises the one end part, the other end part spaced apart from the one end part, and a third main peripheral unit between the one end part and the other end part,the one end part of the third peripheral unit is bent from the third main peripheral unit to overlap the one end part of the first peripheral unit, a first signal line positioned at the one end part of the first peripheral unit,', 'a second signal line positioned at one end part of the second peripheral unit; and', 'a ...

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11-01-2018 дата публикации

FLEXIBLE DISPLAY DEVICE AND ELECTRONIC APPARATUS

Номер: US20180014406A1
Автор: LIU Zihong, YANG Songling
Принадлежит: SHENZHEN ROYOLE TECHNOLOGIES CO. LTD.

A flexible display device and an electronic device, applied to the technical field of display, are provided and aim at solving the technical problem in the related art that a driving IC is prone to rupture and/or breakage following bending of a flexible display panel. The flexible display device may include a flexible display panel, a flexible circuit board, and a driving IC. The flexible circuit board may include a body portion including an element arrangement region and a reserved region, and a connecting portion protruding from the reserved region and extending toward the flexible display panel, and is connected to the flexible display panel. A separation space is defined among the body portion, the connecting portion, and the flexible display panel. The driving IC is electrically installed in the element arrangement region. 1. A flexible display device , comprising:a flexible display panel, the flexible display panel being bendable and deformable;a flexible circuit board electrically coupled to the flexible display panel, and comprising:a body portion comprising an element arrangement region, and a reserved region;a connecting portion protruding from the reserved region and extending toward the flexible display panel, and connected to the flexible display panel;wherein a separation space is defined among the body portion, the connecting portion, and the flexible display panel; anda driving IC electrically installed in the element arrangement region.2. The flexible display device of claim 1 , wherein the connecting portion is connected to a connecting side edge of the flexible display panel.3. The flexible display device of claim 2 , wherein the body portion is divided into the element arrangement region and the reserved region along the connecting side edge.4. The flexible display device of claim 2 , wherein an arrangement direction of the driving IC is parallel to the connecting side edge.5. The flexible display device of claim 2 , wherein the reserved region ...

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14-01-2016 дата публикации

DISPLAY DEVICE

Номер: US20160014880A1
Автор: Lee Min Woo
Принадлежит:

A display device includes having a display panel, a light source disposed on a rear surface of the display panel, and an optical member disposed between the display panel and the light source. An optical member supporter is configured to support at least one side of the optical member and includes at least one pair of a first hook and a second hook formed on a rear surface. The display device also induces a bottom chassis having a first inserting hole and a second inserting hole into which the first hook and the second hook are respectively inserted, a driving circuit substrate disposed between the bottom chassis and the second hook, and at least one flexible printed circuit board configured to connect the display panel and the driving circuit substrate. 1. A display device comprising:a display panel;a light source disposed on a rear surface of the display panel;an optical member disposed between the display panel and the light source;an optical member supporter configured to support at least one side of the optical member and comprising at least one pair of a first hook and a second hook formed on a rear surface;a bottom chassis having a first inserting hole and a second inserting hole into which the first hook and the second hook are respectively inserted; 'at least one flexible printed circuit board configured to connect the display panel and the driving circuit substrate.', 'a driving circuit substrate disposed between the bottom chassis and the second hook; and'}2. The display device of claim 1 , wherein at least one of the first hook and the second hook comprises an inserting body extending from the rear surface of the optical member supporter in a perpendicular direction and a hooking unit extending outwards from the inserting body.3. The display device of claim 2 , wherein the first hook comprises a first inserting body having a width smaller than the first inserting hole and a first hooking unit having a width larger than the first inserting hole.4. The ...

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14-01-2016 дата публикации

FOLDABLE DISPLAY DEVICE

Номер: US20160014881A1
Принадлежит:

A foldable display device includes: a display panel having a folded portion bendable along a fold line; and a cover window disposed on the display panel, wherein the cover window includes: at least a soft pattern disposed on the folded portion of the display panel; and a hard coating layer disposed on the display panel having the soft pattern formed thereon, and the soft pattern has a triangular cross section. 1. A foldable display device comprising:a display panel having a folded portion bendable along a fold line; anda cover window disposed on the display panel,wherein the cover window includes:at least a soft pattern disposed on the folded portion of the display panel; anda hard coating layer disposed on the display panel having the soft pattern formed thereon, andthe soft pattern has a triangular cross section.2. The foldable display device of claim 1 , wherein the soft pattern is disposed to be parallel with respect to the fold line.3. The foldable display device of claim 1 , wherein the soft pattern has a hardness lower than a hardness of the hard coating layer.4. The foldable display device of claim 3 , wherein the soft pattern has a hardness of about 2 hardness (H) or lower.5. The foldable display device of claim 3 , wherein the hard coating layer has a hardness of higher than or equal to about 2 H.6. The foldable display device of claim 1 , wherein the soft pattern has a width decreased as farther away from the display panel.710. The foldable display device of claim 1 , wherein the cover window includes a plurality of soft patterns spaced apart from one another at an interval in a range of about micrometers (μm) to about 100 μm8. The foldable display device of claim 7 , wherein the hard coating layer is disposed between the soft patterns.9. The foldable display device of claim 1 , wherein the hard coating layer has a thickness in a range of about 10 μm to about 100 μm.10. The foldable display device of claim 1 , wherein the hard coating layer is disposed to ...

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14-01-2016 дата публикации

SENSOR DEVICE WITH A FLEXIBLE ELECTRICAL CONDUCTOR STRUCTURE

Номер: US20160014884A1
Принадлежит:

A sensor device for integration in an electrical circuit, including a support layer (), which is formed with a release layer; at least one flexible insulating layer (), which is made using a printing method; and at least one flexible electrical conductor structure (), which is applied with a printing method onto the insulating layer (). The insulating layer () and the conductor structure () form a flexible unit, which is removable without damage from the support layer (). 1. A sensor device for integration into an electrical circuit , comprising:{'b': '12', 'a support layer (′), which is formed with a release layer;'}{'b': 14', '14', '32, 'at least one flexible insulating layer (, ′, ) produced by a printing method; and'}{'b': 10', '20', '34', '14, 'at least one flexible electrical conductor structure (, ′, ), which is applied with a printing method onto the insulating layer (),'}{'b': 14', '14', '32', '10', '20', '34', '12, 'wherein the insulating layer (, ′, ) and the conductor structure (, ′, ) form a flexible unit, wherein said flexible unit is removable without damage from the support layer ().'}2141432202034. The sensor device according to claim 1 , wherein the insulating layer ( claim 1 , ′ claim 1 , ) and/or the conductor structure ( claim 1 , ′ claim 1 , ) is made with a print screen method.322. The sensor device according to claim 1 , further comprising an adhesive layer () for attachment to a substrate.424. The sensor device according to claim 3 , wherein the substrate is provided with a covering ().5141432. The sensor device according to claim 1 , wherein the insulating layer ( claim 1 , ′ claim 1 , ) is made from a lacquer.6. The sensor device according to claim 5 , wherein the lacquer is a modified lacquer.7. The sensor device according to claim 1 , wherein the insulating layer is formed at least in regions as multi-layered.8202032. The sensor device according to claim 1 , wherein the conductor structure ( claim 1 , ′ claim 1 , ) is formed from a ...

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14-01-2016 дата публикации

FLEXIBLE PRINT CIRCUIT BOARD AND DISPLAY DEVICE

Номер: US20160014888A1
Автор: XIA Long
Принадлежит:

A flexible printed circuit board and a display device are disclosed by embodiments of the invention. The flexible printed circuit board has one or more waveform structures disposed on its cross section. 1. A flexible print circuit board comprising one or more waveform structures disposed on a cross section thereof.2. The flexible printed circuit board of claim 1 , comprising: a base layer and a conductive layer disposed on a side of the base layer claim 1 , a semiconductor chip to be mounted on the conductive layer claim 1 , wherein the one or more waveform structures are disposed on a cross section of at least one of the base layer and the conductive layer.3. The flexible printed circuit board of claim 2 , wherein in the case that the waveform structures are disposed on both the base layer and the conductive layer claim 2 , the waveform structures disposed on the base layer and the conductive layer overlap each other.4. The flexible printed circuit board of claim 2 , further comprising a solder resist layer claim 2 , wherein the one or more waveform structures are disposed on a cross section of at least one of the base layer claim 2 , the conductive layer and the solder resist layer.5. The flexible printed circuit board of claim 4 , wherein in the case that the waveform structures are disposed on the base layer claim 4 , the conductive layer and the solder resist layer claim 4 , the waveform structures disposed on the base layer claim 4 , the conductive layer and the solder resist layer overlap each other.6. The flexible printed circuit board of claim 1 , wherein the waveform structures are disposed to surround the semiconductor chip to be mounted.7. The flexible printed circuit board of claim 1 , wherein two waveform structures are symmetrically disposed at two sides of the semiconductor chip to be mounted.8. The flexible printed circuit board of claim 1 , wherein the waveform structure comprises one or plural wave structure units claim 1 , and the plural wave ...

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14-01-2016 дата публикации

ELASTIC CIRCUIT

Номер: US20160014889A1
Принадлежит:

The present invention is an elastic electronic circuit adapted to provide three-dimensional elasticity. This is accomplished through a first pattern, a second pattern embedded within the first pattern, and a third pattern. The three-dimension elastic electronic circuit is adapted to conform to a flexible substrate, such as flexible plastic substrates and the like. The resulting three-dimensional elasticity enables the use of electronic circuits on such flexible substrates. 1. An elastic circuit comprising:a first pattern attached to a flexible substrate;a second pattern embedded within the first pattern; anda third pattern applied to said flexible substrate;wherein said first, second, and third patterns provide three-dimensional elasticity to said elastic circuit.2. The elastic circuit of claim 1 , wherein said first pattern is generally horseshoe shaped and further comprises a pattern path claim 1 , a radius of curvature claim 1 , and a turning degree offset.3. The elastic circuit of claim 2 , wherein said turning degree offset further comprises a range between 30 and 60 degrees.4. The elastic circuit of claim 2 , wherein said second pattern is identical in shape to said first pattern.5. The elastic circuit of claim 1 , wherein said third pattern is generally horseshoe shaped and further comprises a radius of curvature and a turning degree offset.6. The elastic circuit of claim 5 , wherein said turning degree offset further comprises a range between 30 and 60 degrees.7. The elastic circuit of claim 6 , wherein a cross-sectional view of said flexible substrate will represent said third pattern.8. The elastic circuit of claim 7 , wherein said flexible substrate is curved claim 7 , and wherein said third pattern is adapted to conform to said curved flexible substrate.9. The elastic circuit of claim 8 , wherein said curved flexible substrate further comprises a convex side and a concave side claim 8 , wherein the horseshoe patterns on said convex side are generally ...

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14-01-2016 дата публикации

MULTILAYER BOARD

Номер: US20160014893A1
Автор: YOSUI Kuniaki
Принадлежит:

In a flexible board including laminated resin layers containing the same thermoplastic resin as a principal material, a rigid portion includes a region in which a first resin layer is disposed between a second resin layer defining an upper principal surface and a third resin layer defining a lower principal surface so that the rigid portion has a large thickness, and a flexible portion includes a region in which the first resin layer is not disposed between the second and third resin layers so that the flexible portion has flexibility, a step portion at which a thickness changes is between the rigid and flexible portions, and the second and third resin layers extend in a region from the rigid portion beyond the step portion to the flexible portion. 1. A multilayer board comprising:a first resin base material portion;a second resin base material portion; anda third resin base material portion; whereinthe first, second and third resin base material portions include a same thermoplastic resin as a principal material and are laminated on each other; whereinthe first resin base material portion defines a first principal surface of the multilayer board;the second resin base material portion defines a second principal surface of the multilayer board;the third resin base material portion is provided between the first resin base material portion and the second resin base material portion in a lamination direction of the multilayer board;a step portion at which a thickness of the multilayer board changes is provided between a flexible portion which has flexibility and in which the third resin base material portion is not disposed and a thick portion in which the third resin base material portion is disposed so that the thick portion has a thickness larger than that of the flexible portion;the first resin base material portion and the second resin base material portion extend in a region from the thick portion beyond the step portion to the flexible portion; andthe first resin ...

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14-01-2016 дата публикации

FLEXIBLE DISPLAY DEVICE AND METHOD FOR PRODUCING THE SAME

Номер: US20160014912A1
Автор: SHIH PingI
Принадлежит:

A flexible display device and a releasing method thereof are provided. A flexible electronic assemblage including an adhesion region and an effective light emitting region is formed on a supporting carrier board. At least one flexible circuit board and at least one integrated circuit module is bonded on the adhesion region. A cutting line is provided on the supporting carrier board to divide the supporting carrier board into two parts respectively corresponding to the adhesion region and the effective light emitting region of the flexible electronic assemblage. The supporting carrier board is cut along the cutting line, and a part of the supporting carrier board under the effective light emitting region is released. The connection between the adhesion region and the supporting carrier board is reserved. Deforming of the adhesion region during the releasing process is avoided, without affecting with the bending of the flexible display device. 1. A method for producing a flexible display device , comprising:providing a flexible electronic assemblage on a supporting carrier board, wherein the flexible electronic assemblage comprises an adhesion region and an effective light emitting region;bonding at least one flexible circuit board and at least one integrated circuit module on the adhesion region of the flexible electronic assemblage;providing a cutting line on the supporting carrier board to divide the supporting carrier board into two parts respectively corresponding to the adhesion region and the effective light emitting region of the flexible electronic assemblage;cutting the supporting carrier board along the cutting line; andreleasing and removing a part of the supporting carrier board under the effective light emitting region.2. The method for producing a flexible display device according to claim 1 , wherein the flexible electronic assemblage is a releasable electronic assemblage.3. The method for producing a flexible display device according to claim 2 , ...

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10-01-2019 дата публикации

OPTICAL MODULATOR WITH FPC, AND OPTICAL TRANSMISSION APPARATUS USING SAME

Номер: US20190014657A1
Принадлежит: Sumitomo Osaka Cement Co., Ltd

To suppress peeling-off or cracks of a solder-fixing portion, which are caused by vibration during transportation or operation, in an optical modulator with FPC, thereby suppressing deterioration of radio-frequency characteristics of a signal path in an effective manner at low cost. 1. An optical modulator comprising:a flexible printed circuit that performs electrical connection with a circuit substrate,wherein the flexible printed circuit has a substantially quadrilateral shape,in the flexible printed circuit, a pad, which is electrically connected to the circuit substrate, is provided along one side of the substantial quadrilateral, and signal patterns, which are connected to signal lead pins for signal transmission which are provided in the optical modulator, are provided in another side opposite to the one side, andthe flexible printed circuit includes an additional fixing portion and/or a notched portion which are configured to increase a natural vibration frequency of the flexible printed circuit in a state of being connected to the signal lead pin and the circuit substrate.2. The optical modulator according to claim 1 ,wherein the additional fixing portion includes an additional pattern that is connected to an additional lead pin that is additionally provided in the optical modulator in addition to the signal lead pin.3. The optical modulator according to claim 2 ,wherein the additional pattern is configured to electrically connect a ground pattern provided in the flexible printed circuit and a housing of the optical modulator to each other.4. The optical modulator according to claim 2 ,wherein the additional fixing portions are configured with the additional patterns provided at respective sites between two sides excluding the one side and the other side of the substantial quadrilateral, and respective ends of an arrangement portion of the signal patterns, the number of the additional pattern provided at each of the sites being at least one.5. The optical ...

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10-01-2019 дата публикации

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

Номер: US20190014669A1
Принадлежит:

A display device includes a display panel, first circuit board, a second circuit board, a first adhesive element, and a conductive element. The display panel includes a non-bending region and a bending region that is bent from the non-bending region. The bending region includes a curvature region having a specific curvature and a facing region facing the non-bending region in a thickness direction of the display module. The first adhesive element is disposed to combine the first circuit board with the second circuit board, and the conductive element is disposed to electrically connect the first circuit board to the second circuit board. 1. A display device , comprising:a window member; anda display module disposed on a rear surface of the window member, a display panel comprising a non-bending region and a bending region that is bent from the non-bending region, the bending region comprising a curvature region having a specific curvature and a facing region facing the non-bending region in a thickness direction of the display module;', 'a first circuit board disposed on a rear surface of the display panel;', 'a second circuit board electrically connecting the display panel to the first circuit board;', 'a first adhesive element disposed between the first circuit board and the second circuit board in the thickness direction of the display module to combine the first circuit board with the second circuit board; and', 'a conductive element disposed between the first circuit board and the second circuit board in the thickness direction of the display module to electrically connect the first circuit board to the second circuit board., 'wherein the display module comprises2. The display device of claim 1 , wherein the display panel has a plurality of first adhesion regions that is disposed with the first adhesive element on the rear surface of the display panel.3. The display device of claim 2 , wherein the plurality of first adhesion regions comprises a left region and a ...

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10-01-2019 дата публикации

ELECTRONIC DEVICE

Номер: US20190014671A1
Принадлежит:

An electronic device may include a window member and a display module disposed on a rear surface of the window member. The display module may include a display panel with a non-bending region and a bending region, a first circuit substrate disposed on a rear surface of the display panel, a second circuit substrate electrically connecting the display panel to the first circuit substrate, a first adhesion member disposed on a rear surface of the first circuit substrate to combine the first circuit substrate with a first member different from the first circuit substrate, and a second adhesion member disposed on a rear surface of the second circuit substrate to combine the second circuit substrate with a second member different from the first circuit substrate. 1. An electronic device , comprising:a window member; anda display module disposed on a rear surface of the window member,wherein the display module comprises:a display panel comprising a non-bending region and a bending region bent from the non-bending region, the bending region comprising a curvature region with a specific curvature and an opposite region facing the non-bending region in a thickness direction of the display module;a first circuit substrate disposed on a rear surface of the display panel;a second circuit substrate electrically connecting the display panel with the first circuit substrate;a first adhesion member disposed on a rear surface of the first circuit substrate to combine the first circuit substrate with a first member different from the first circuit substrate; anda second adhesion member disposed on a rear surface of the second circuit substrate to combine the second circuit substrate with a second member different from the first circuit substrate.2. The electronic device of claim 1 , wherein the first member and the second member are the same.3. The electronic device of claim 2 , wherein the first member is the display panel claim 2 , and the first adhesion member and the second ...

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09-01-2020 дата публикации

PRINTED WIRING BOARD FOR HIGH FREQUENCY TRANSMISSION

Номер: US20200015351A1
Принадлежит: NIPPON MEKTRON, LTD.

A printed wiring board for high frequency transmission according to an embodiment of the present invention includes: an insulating base material a signal line extending in a longitudinal direction of the insulating base material ground wirings extending in the longitudinal direction while being spaced apart from the signal line by a predetermined distance; a ground layer formed on a major surface a plurality of ground connection vias electrically connecting the ground wiring and the ground layer and a plurality of ground connection vias electrically connecting the ground wiring and the ground layer A width of the ground wirings is smaller than a land diameter of the ground connection vias Then, the ground connection vias and the ground connection vias are arranged not to overlap each other in a width direction perpendicular to the longitudinal direction throughout a cable portion 1. A printed wiring board for high frequency transmission , comprising:an insulating base material having a first major surface and a second major surface opposite to the first major surface, and extending in a longitudinal direction thereof;a first signal line formed on the first major surface and extending in the longitudinal direction;a first ground wiring formed on the first major surface and extending in the longitudinal direction while being spaced apart from the first signal line by a predetermined distance;a second ground wiring formed on an opposite side of the first ground wiring with the first signal line interposed therebetween on the first major surface, and extending in the longitudinal direction while being spaced apart from the first signal line by a predetermined distance;a ground layer formed on the second major surface;a plurality of first ground connection vias electrically connecting the first ground wiring and the ground layer; anda plurality of second ground connection vias electrically connecting the second ground wiring and the ground layer, whereina width of the ...

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21-01-2021 дата публикации

ELECTRONIC DEVICE INCLUDING FORCE KEY STRUCTURE

Номер: US20210018388A1
Принадлежит:

Disclosed is an electronic device. The electronic device includes a sidewall structure that forms a surface of the electronic device and that includes a key area formed on the surface of the electronic device. The electronic device also includes an internal frame that is formed inside the electronic device and faces an inner surface of the sidewall structure. The electronic device further includes a sensor assembly disposed between the internal frame and the sidewall structure, at least part of the sensor assembly is aligned with the key area. The sensor assembly includes a sensor that senses a force applied to the key area, based on displacement of an inner surface of the key area. The sensor assembly also includes a support member having one surface supported on the sensor and an opposite surface supported on the internal frame. 1. An electronic device comprising:a sidewall structure configured to form a surface of the electronic device, the sidewall structure including a key area formed on the surface of the electronic device;an internal frame formed inside the electronic device and configured to face an inner surface of the sidewall structure; anda sensor assembly disposed between the internal frame and the sidewall structure, at least part of the sensor assembly being aligned with the key area, a sensor configured to sense a force applied to the key area, based on displacement of an inner surface of the key area, and', 'a support member including one surface that is supported on the sensor and an opposite surface that is supported on the internal frame., 'wherein the sensor assembly includes2. The electronic device of claim 1 , wherein the support member includes an elastic member configured to exert an elastic force on the sensor and a damping member disposed between the elastic member and the internal frame.3. The electronic device of claim 2 , wherein:the elastic member is a thin plate, andthe damping member is foam.4. The electronic device of claim 1 , ...

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16-01-2020 дата публикации

POLARIZER, DISPLAY PANEL AND DISPLAY DEVICE

Номер: US20200018880A1
Принадлежит:

A polarizer, a display panel and a display device are disclosed. The polarizer includes a view area (VA) and a peripheral area. A notch is disposed in the peripheral area. A side of the notch away from the view area is configured to place a circuit board. 1. A polarizer , comprising: a view area and a peripheral area ,wherein a notch is disposed in the peripheral area, and a side of the notch away from the view area is configured to place a circuit board.2. The polarizer according to claim 1 , wherein the notch and a boundary of the view area close to the notch have a gap therebetween.3. The polarizer according to claim 1 , wherein the notch is a first through hole having a strip shape.4. The polarizer according to claim 3 , wherein an extending direction of the first through hole in a plane where the polarizer is located is parallel to a boundary of the view area close to the notch.5. The polarizer according to claim 1 , wherein the notch includes a plurality of second through holes which are alternately arranged.6. The polarizer according to claim 5 , wherein an arrangement direction of the plurality of second through holes is parallel to a boundary of the view area close to the notch.7. The polarizer according to claim 5 , wherein pore diameters of the plurality of second through holes are the same claim 5 , and gaps between every two adjacent ones of the plurality of second through holes are equal.8. The polarizer according to claim 5 , wherein a cross-sectional shape of each of the plurality of second through holes includes rectangle.9. A display panel claim 5 , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the polarizer according to ;'}a functional layer; anda circuit board,wherein the circuit board is at least partially disposed between the polarizer and the functional layer, electrically connected with the functional layer, and disposed on a side of the notch away from the view area.10. The display panel according to claim 9 , wherein the ...

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21-01-2016 дата публикации

FLEXIBLE DEVICE CARRIER AND METHOD FOR ATTACHING MEMBRANE ON FLEXIBLE DEVICE

Номер: US20160021733A1
Принадлежит:

The present invention provides a flexible device carrier for a flexible display panel and a method for attaching a membrane on the flexible device. The flexible device carrier comprises: a bottom plate; a position-limiting plate provided opposite to the bottom plate and detachably mounted on the bottom plate through a position-limiting mechanism, wherein a slotted hole is provided on the position-limiting plate to match with one side of the bottom plate facing the position-limiting plate, so as to form a positioning groove for the flexible device. By using the flexible device carrier, the membrane can be tightly attached on the side of the flexible device away from the bottom plate of the flexible device carrier, reducing probability of defects such as occurrence of bubbles between the membrane and the flexible device, improving quality of attaching the membrane on the flexible device and improving product yield of the flexible display panel.

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19-01-2017 дата публикации

FLEXIBLE SUBSTRATE

Номер: US20170019984A1
Принадлежит:

A flexible substrate includes a circuit board, a flexible heat-dissipating structure and an adhesive. The circuit board has a substrate and a circuit layer formed on a top surface of the substrate, and the flexible heat-dissipating structure has a flexible supporting plate and a flexible heat-dissipating metal layer formed on a surface of the flexible supporting plate. The flexible heat-dissipating metal layer of the flexible heat-dissipating structure is connected with a bottom surface of the substrate by the adhesive. The circuit layer and the flexible heat-dissipating metal layer are made of same material. 1. A flexible substrate comprising:a circuit board including a substrate and a circuit layer, wherein the substrate has a top surface and a bottom surface, the circuit layer is formed on the top surface, and the top surface has a chip-disposing area;a flexible heat-dissipating structure connected with the bottom surface of the substrate including a flexible supporting plate and a flexible heat-dissipating metal layer, wherein the flexible supporting plate comprises a surface facing toward the bottom surface of the substrate, the flexible heat-dissipating metal layer is formed on the surface of the flexible supporting plate, located underneath the chip-disposing area and not electrically connected to the circuit layer, wherein the substrate and the flexible supporting plate are made of same material; andan adhesive formed on the flexible heat-dissipating metal layer, wherein the flexible heat-dissipating metal layer is directly connected with the bottom surface of the substrate by the adhesive.2. The flexible substrate in accordance with claim 1 , wherein the flexible heat-dissipating metal layer has a lateral surface claim 1 , and the flexible supporting plate has a side wall coplanar with the lateral surface.3. The flexible substrate in accordance with claim 2 , wherein the flexible heat-dissipating structure further includes a protecting layer covering the ...

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18-01-2018 дата публикации

FLEXIBLE AND CONFORMAL ELECTRONICS USING RIGID SUBSTRATES

Номер: US20180020536A1
Принадлежит:

A flexible electronics assembly includes a single-piece substrate having two regions of rigidity separated by a localized region of flexibility. The localized region of flexibility has a lower rigidity than the two regions of rigidity. The two regions of rigidity are angularly deflectable from a planar configuration of the single-piece substrate to a non-planar configuration of the single-piece substrate by hinging action of the localized region of flexibility. At least one electronic component is mounted on at least one of the two regions of rigidity. 1. A flexible electronics assembly comprising:a single-piece substrate, the substrate including two regions of rigidity separated by a localized region of flexibility, the localized region of flexibility having a lower rigidity than the two regions of rigidity; andat least one electronic component mounted on at least one of the two regions of rigidity,the two regions of rigidity being angularly deflectable from a planar configuration of the single-piece substrate to a non-planar configuration of the single-piece substrate by hinging action of the localized region of flexibility.2. The flexible electronics assembly of claim 1 , wherein the localized region of flexibility elastically accommodates substantially all stresses and strains in the single-piece substrate caused by angular deflection of the two regions of rigidity.3. The flexible electronics assembly of claim 1 , wherein the localized region of flexibility is a geometrically modified region of the single-piece substrate.4. The flexible electronics assembly of claim 3 , wherein the localized region of flexibility includes at least one compliant joint formed by geometrical shaping of the single-piece substrate.5. The flexible electronics assembly of claim 4 , wherein the least one compliant joint formed by geometrical shaping of the single-piece substrate is a lamina emergent torsional (LET) joint.6. The flexible electronics assembly of claim 4 , wherein the LET ...

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18-01-2018 дата публикации

METHOD FOR PRODUCING FLEXIBLE MOUNTING MODULE BODY

Номер: US20180020537A1
Автор: MATSUSHIMA Takayuki
Принадлежит: DEXERIALS CORPORATION

A method for producing a flexible mounting substrate. The method comprises preparing a flexible substrate having a mounting region for mounting an electronic component on an arrangement surface of the flexible substrate, the electronic component including at least one bump, arranging a thermosetting anisotropic conductive film having conductive particles on the mounting region, arranging the electronic component on the anisotropic conductive film, and pressing the electronic component while heating to electrically connect the at least one bump of the electronic component to the mounting region of the flexible substrate, and adhering an adhesion film having an adhesive layer including an adhesive and a base film laminated together on a support surface that is opposite to the arrangement surface of the flexible substrate at least at a portion located on a back surface side of the mounting region before electrically connecting the electronic component and the mounting region. 1. A method for producing a flexible mounting substrate , the method comprising:preparing a flexible substrate having a mounting region for mounting an electronic component on an arrangement surface of the flexible substrate, the electronic component including at least one bump;arranging a thermosetting anisotropic conductive film having conductive particles on the mounting region;arranging the electronic component on the anisotropic conductive film;pressing the electronic component while heating to electrically connect the at least one bump of the electronic component to the mounting region of the flexible substrate; andadhering an adhesion film having an adhesive layer including an adhesive and a base film laminated together on a support surface that is opposite to the arrangement surface of the flexible substrate at least at a portion on a back surface side of the mounting region before electrically connecting the electronic component and the mounting region,wherein the adhesive layer includes ...

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18-01-2018 дата публикации

Multilayer flexible printed circuit board

Номер: US20180020538A1
Автор: Li-Kun Liu, Yan-Lu Li

A flexible printed circuit board with multiple layers includes an inner wiring substrate and at least one outer wiring plate. Each outer wiring plate is connected to one surface of the inner wiring substrate, and defines at least one through hole which passes through the outer wiring plate to expose the inner wiring substrate. Each outer wiring plate further includes an adhesive plate connected to the inner wiring substrate. The adhesive plate includes a stepped portion extending towards a center of the through hole.

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18-01-2018 дата публикации

METHOD OF MANUFACTURING FLEXIBLE ELECTRONIC CIRCUITS HAVING CONFORMAL MATERIAL COATINGS

Номер: US20180020546A1
Автор: Lu Bo, Pepin Brian Marc
Принадлежит:

A method of manufacturing a flexible electronic circuit is provided. The method may include forming a positive photoresist mold on a flexible polymer substrate having a plurality of metal traces. The method may also include applying a conformal material coating over the positive photoresist mold, the flexible polymer substrate, and the metal traces. The method may further include removing an excess of the conformal material coating by running a blade over the positive photoresist mold. The method may also include removing the positive photoresist mold to reveal a cavity defined by the conformal material coating. The method may further include dispensing an anisotropic conductive paste into the cavity and inserting a chip into the cavity and bonding the chip to the metal traces. 1. A method of manufacturing a flexible electronic circuit , comprising:forming a positive photoresist mold on a flexible polymer substrate having a plurality of metal traces;applying a conformal material coating over the positive photoresist mold, the flexible polymer substrate, and the metal traces;removing an excess of the conformal material coating by running a blade across the conformal material coating, over the positive photoresist mold;removing the positive photoresist mold to reveal a cavity defined by the conformal material coating;dispensing an anisotropic conductive paste into the cavity; andinserting a chip into the cavity and bonding the chip to the metal traces.2. The method of claim 1 , further comprising treating the flexible polymer substrate with oxygen plasma to produce hydroxyl groups on a surface of the polymer substrate.3. The method of claim 2 , wherein a first oxygen plasma treatment is conducted prior to applying the conformal material coating and a second oxygen plasma treatment is conducted after removing the positive photoresist mold.4. The method of claim 1 , wherein the conformal material coating is silicone.5. The method of claim 1 , wherein the conformal ...

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22-01-2015 дата публикации

FLEXIBLE PRINTED CIRCUIT FILM AND DISPLAY DEVICE INCLUDING THE SAME

Номер: US20150022953A1
Автор: CHO YONG-HEON
Принадлежит: Samsung Display Co., Ltd.

A display device includes: a display substrate, and a flexible printed circuit film connected to the display substrate. The flexible printed circuit film includes a main body including a bending region, and a first cover layer disposed on a first side of the main body, and the first cover layer has a first opening exposing a portion of the bending region. 1. A display device comprising:a display substrate; anda flexible printed circuit film connected to the display substrate,wherein the flexible printed circuit film includes:a main body including a bending region, anda first cover layer disposed on a first side of the main body, andwherein the first cover layer has a first opening exposing a portion of the bending region.2. The display device of claim 1 , wherein the first cover layer is disposed on opposing edges of the bending region on the first side of the main body.3. The display device of claim 2 , wherein a width of the first cover layer disposed on the opposing edges of the bending region on the first side of the main body is in a range from about 0.5 mm to about 1.5 mm.4. The display device of claim 3 , further comprising a second cover layer disposed on a second side of the main body which is opposite to the first side of the main body.5. The display device of claim 4 , wherein the second cover layer includes a second opening exposing a portion of the bending region.6. The display device of claim 5 , wherein the second cover layer is disposed on opposing edges of the bending region on the second side of the main body.7. The display device of claim 6 , wherein a width of the second cover layer disposed on the opposing edges of the bending region on the second side of the main body is in a range from about 0.5 mm to about 1.5 mm.8. The display device of claim 1 , wherein the display substrate is a flexible substrate.9. A flexible printed circuit film comprising:a main body including a bending region; anda first cover layer disposed on a first side of the ...

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22-01-2015 дата публикации

Circuit Assembly and Corresponding Methods

Номер: US20150022978A1
Принадлежит: MOTOROLA MOBILITY LLC

A circuit assembly () includes a first circuit substrate () defining a first major face () and a second circuit substrate () defining a second major face (). A plurality of electrical components () can be disposed on one or more of the first major face or the second major face. One or more substrate bridging members () are disposed between the first circuit substrate and the second circuit substrate. Each substrate bridging member can define a unitary structure having a first end bonded to the first major face and a second end bonded to the second major face to bridge the first circuit substrate and the second circuit substrate. 1. A circuit assembly , comprising:a first substrate defining a first side of the circuit assembly;a second substrate defining a second side of the circuit assembly; andone or more substrate bridging members disposed interior to the circuit assembly and having a unitary structure with a first end soldered to the first substrate and a second end soldered to the second substrate;a circuit element disposed along at least one substrate bridging member.2. The circuit assembly of claim 1 , the circuit element comprising a push button switch.3. The circuit assembly of claim 1 , the circuit element comprising an electrical connector.4. The circuit assembly of claim 1 , further comprising another circuit substrate spanning the at least one substrate bridging member claim 1 , the circuit element disposed on the another circuit substrate.5. The circuit assembly of claim 4 , the circuit element comprising a circuit component.6. The circuit assembly of claim 5 , the circuit component comprising a surface mount circuit component soldered to the another circuit substrate.7. The circuit assembly of claim 4 , the another circuit substrate comprising a flexible substrate.8. A circuit assembly claim 4 , comprising:a first substrate defining one side of the circuit assembly;a second substrate defining another side of the circuit assembly; andone or more ...

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22-01-2015 дата публикации

DISPLAY DEVICE

Номер: US20150022979A1
Автор: Cho Won-Gu, Kang Mi-Young
Принадлежит:

A display device according to an exemplary embodiment of the present invention includes: a display panel displaying an image; a window disposed on a first surface of the display panel; a first cover film disposed on a second surface of the display panel; a flexible printed circuit (FPC) disposed under the first cover film; a flexible printed circuit film connecting the display panel and the flexible printed circuit (FPC); and a second cover film disposed under the first cover film and the flexible printed circuit film. The second cover film and the flexible printed circuit film are adhered by an adhesive. 1. A display device comprising:a display panel displaying an image;a window disposed on a first surface of the display panel;a first cover film disposed on a second surface of the display panel;a flexible printed circuit (FPC) disposed under the first cover film;a flexible printed circuit film connecting the display panel and the flexible printed circuit (FPC); anda second cover film disposed under the first cover film and the flexible printed circuit film, wherein the second cover film and the flexible printed circuit film are adhered together by an adhesive.2. The display device of claim 1 , wherein the flexible printed circuit (FPC) is connected to an extension of the flexible printed circuit film.3. The display device of claim 2 , wherein the second cover film is adhered to the extension of the flexible printed circuit film.4. The display device of claim 1 , wherein the first cover film and the second cover film are formed of a same material.5. The display device of claim 4 , wherein an area of the first cover film is bigger than an area of the second cover film.6. The display device of claim 1 , further comprising a polarizing plate disposed between the display panel and the window.7. The display device of claim 6 , further comprising a touch panel disposed between the polarizing plate and the window.8. The display device of claim 7 , further comprising a ...

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03-02-2022 дата публикации

Flexible substrate

Номер: US20220039248A1
Автор: Takumi Sano
Принадлежит: Japan Display Inc

According to one embodiment, a flexible substrate includes an insulating base material including an island-shaped portion, a first portion having a band shape and connected to the island-shaped portion, and a second portion having a band shape and connected to the island-shaped portion, and a wiring layer provided on the insulating base material. The first portion includes a first curved portion and a first straight portion connecting the island-shaped portion and the first curved portion, and the second portion includes a second curved portion and a second straight portion connecting the island-shaped portion and the second curved portion.

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17-01-2019 дата публикации

MULTI-MATERIAL STRUCTURE WITH EMBEDDED ELECTRONICS

Номер: US20190021168A1
Принадлежит:

A method for manufacturing a multilayer structure for an electronic device includes obtaining a flexible substrate film; printing a number of conductor traces on the flexible substrate film; providing a number of electronic components on a first surface area of the flexible substrate film, wherein the flexible substrate film further includes a second surface area adjacent to the first surface area; molding first thermoplastic material on the number of electronic components and the related first surface area of the flexible substrate film accommodating the components; and molding second thermoplastic material on the adjacent second surface area and on at least part of the first surface area, wherein the first thermoplastic material exhibits a first elasticity and the second thermoplastic material exhibits a second, different elasticity. 1. A method for manufacturing a multilayer structure for an electronic device , the method comprising:obtaining a flexible substrate film for accommodating electronics;printing a number of conductor traces on the flexible substrate film for electrically connecting electronic components with each other and/or a number of predefined areas on the flexible substrate film;providing a number of electronic components on a first surface area of the flexible substrate film, wherein the flexible substrate film further comprises a second surface area adjacent to the first surface area;overmolding a first thermoplastic material to the number of electronic components and the related first surface area of the flexible substrate film accommodating the components; andmolding a second thermoplastic material on the adjacent second surface area and on at least part of the first surface area so that at least part of the electronic components and the first thermoplastic material thereon are substantially embedded between the flexible substrate film and the second thermoplastic material,wherein the first thermoplastic material exhibits a first elasticity ...

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28-01-2016 дата публикации

LIQUID CRYSTAL DISPLAY APPARATUS

Номер: US20160026030A1
Принадлежит: LG DISPLAY CO., LTD.

Provided is a liquid crystal display apparatus according to an exemplary embodiment of the present disclosure. The liquid crystal display apparatus includes: a liquid crystal display panel; a first chassis; a second chassis; a circuit unit; a flexible substrate; a shield unit; and a pem-nut. The shield unit is disposed to surround at least a part of the flexible substrate and circuit unit and be bonded to at least a part of the flexible substrate. The pem-nut is exposed through a hole penetrating the shield unit and the circuit unit, and a bolt-insertion part is disposed. A top side of the pem-nut is positioned to be higher than a top side of the circuit unit. In the liquid crystal display apparatus according to an exemplary embodiment of the present disclosure, the reliability of the liquid crystal display apparatus is improved. 1. A liquid crystal display apparatus comprising:a liquid crystal display panel;a chassis unit configured to surround the liquid crystal display panel;a circuit unit disposed to be in contact with the chassis unit;a shield unit configured to surround at least a part of the chassis unit and circuit unit; anda fixing structure configured to fix the shield unit and the circuit unit to the chassis unit,wherein the fixing structure has an edge joint structure that suppresses a movement of the shield unit caused by an external impact.2. The liquid crystal display apparatus according to claim 1 , wherein the fixing structure includes a pem-nut provided at the chassis unit and a bolt fastened to the pem-nut through a hole of the shield unit and a hole of the circuit unit claim 1 , and has an edge joint structure in which a lateral side of the pem-nut is in contact with the hole of the shield unit.3. The liquid crystal display apparatus according to claim 2 , wherein the fixing structure further includes an annular ring disposed between the bolt and the pem-nut claim 2 , andthe annular ring is in contact with a top side of the shield unit and a top ...

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25-01-2018 дата публикации

FPC-ATTACHED OPTICAL MODULATOR AND OPTICAL TRANSMISSION DEVICE USING THE SAME

Номер: US20180024411A1
Принадлежит: Sumitomo Osaka Cement Co., Ltd.

An optical modulator including a flexible printed circuit performing an electrical connection with an external circuit substrate, in which the flexible printed circuit includes a plurality of first pads and the like provided on one surface of the flexible printed circuit along one side of the flexible printed circuit, a plurality of second pads and the like provided on the other surface of the flexible printed circuit at locations that respectively correspond to the plurality of first pads, and a plurality of metal films and the like provided at locations that respectively correspond to the first pads on a side surface of the flexible printed circuit along the one side of the flexible printed circuit. 1. An optical modulator comprising:a flexible printed circuit performing an electrical connection with a circuit substrate, a plurality of first pads provided on one surface of the flexible printed circuit along one side of the flexible printed circuit,', 'a plurality of second pads provided on the other surface of the flexible printed circuit at locations that respectively correspond to the plurality of first pads, and', 'a plurality of metal films provided at locations that respectively correspond to the first pads on a side surface of the flexible printed circuit along the one side of the flexible printed circuit., 'wherein the flexible printed circuit includes'}2. The optical modulator according to claim 1 ,wherein each of the plurality of metal films is constituted of one metal film connecting one first pad of the plurality of first pads and one second pad of the plurality of second pads which correspond to each other, oreach of the plurality of metal films is constituted of a plurality of metal films including a metal film connected to the corresponding first pad and a metal film connected to the corresponding second pad.3. The optical modulator according to claim 1 ,wherein the flexible printed circuit includes through-holes or vias that thermally connect the ...

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25-01-2018 дата публикации

CONDUCTIVE PATTERN

Номер: US20180024671A1
Принадлежит: Dongwoo Fine-Chem Co., Ltd.

Provided is a conductive pattern having at least one unit conductive pattern forming one touch pixel according to an aspect of the present invention. The at least one unit conductive pattern includes a plurality of nanostructures each having opposite ends. A ratio of nanostructures, both opposite ends of which are in contact with edges of the at least one unit conductive pattern to all nanostructures included in the at least one unit conductive pattern is 70% or more. 1. A conductive pattern including at least one unit conductive pattern comprising a touch pixel , the unit conductive pattern comprises:a plurality of nano structures having both ends,wherein a ratio of the nano structure in which both ends are in contact with side surfaces of the unit conductive pattern is 70% or more of a total nano structure.2. The conductive pattern of claim 1 , further comprises:a connection portion connecting adjacent unit conductive patterns,wherein a ratio of the nano structure in which both ends are in contact with side surfaces of the connection portion of a total nano structure of the connection portion is different from the ratio of the nano structure in which both ends are in contact with side surfaces of the unit conductive pattern.3. The conductive pattern of claim 2 , wherein the ratio of the nano structure in which both ends are in contact with side surfaces of the connection portion of a total nano structure of the connection portion is 80% or more.4. The conductive pattern of claim 2 , wherein a width of the connection portion is 50% to 60% of a width of the unit conductive pattern.5. The conductive pattern of claim 1 , wherein the nano structure comprises a silver (Ag) material.6. The conductive pattern of claim 1 , wherein the nano structure is formed by electro-spinning.7. The conductive pattern of further comprises a matrix containing the plurality of the nano structures.8. The conductive pattern of claim 7 , wherein an end of the nano structure in contact with a ...

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26-01-2017 дата публикации

HIGH-FREQUENCY TRANSMISSION LINE AND ELECTRONIC DEVICE

Номер: US20170025731A1
Принадлежит:

A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region. 1. A high-frequency transmission line comprising:a flexible planar dielectric element elongated in one direction, the dielectric element having a predetermined width in a direction perpendicular or substantially perpendicular to a longitudinal direction and having a predetermined thickness;a signal conductor disposed in the dielectric element and configured to extend along the longitudinal direction; anda first ground conductor opposing the signal line conductor and extending in the longitudinal direction; whereinat least one of the signal conductor and the first ground conductor has a characteristic impedance cyclically varied along the longitudinal direction, and includes a first region and a second region with different variation widths of the characteristic impedance;the variation width of the characteristic impedance in the second region is larger than the variation width of the characteristic impedance in the first region; anda width of the second region of the dielectric element is larger than a width of the first region of the dielectric element.2. The high-frequency transmission line according to claim 1 , wherein in the first region claim 1 , the first ground conductor is ...

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26-01-2017 дата публикации

FLEXIBLE WIRING BOARD

Номер: US20170025733A1
Автор: KATO Ryuhei, Kondo Hayato
Принадлежит: HOSIDEN CORPORATION

A flexible wiring board including a base, at least one cover, a signal conductor, and a ground conductor. The base is an elongate flexible dielectric including first and second lengthwise portions. The first portion has opposed faces in the thickness direction. The cover, dielectric being lower in permittivity than the base, is fixedly cover at least one of the faces. The signal and ground conductors at the base extend in parallel with and in spaced relation to each other. The conductors each include a first portion covered by the cover and a second portion not covered by the cover. A part of the second portion of the ground conductor situated in a second region of the second portion of the base is smaller in area than a part of the first portion of the ground conductor situated in a first region of the first portion of the base, the first region being equal in area to the second region. 1. A flexible wiring board comprising:a base being an elongate flexible dielectric including a first portion and a second portion, the first portion being a portion in a lengthwise direction of the base and having a first face and a second face opposite to each other in a thickness direction of the base, the second portion being another portion in the lengthwise direction of the base;at least one cover of dielectric material being lower in permittivity than the base, the at least one cover being fixed on and covering at least one of the first and second faces of the first portion of the base;a signal conductor being provided at the base and extending in the lengthwise direction, the signal conductor including a first portion covered by the at least one cover and a second portion not covered by the at least one cover; anda ground conductor being provided at the base and extending in parallel with and in spaced relation to the signal conductor, the ground conductor including a first portion covered by the at least one cover and a second portion not covered by the at least one cover; ...

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24-01-2019 дата публикации

OPTICAL MODULATOR

Номер: US20190025612A1
Принадлежит:

Provided is an optical modulator in which a phenomenon of a resonance mode or the like is prevented from being generated in a recess portion of a housing that mounts a flexible printed circuit and of which broadband characteristics are improved. 1. An optical modulator in which an optical modulation element is mounted inside a housing , in which at least a portion of an electric line is connected to an external circuit board through a flexible printed circuit , and which is disposed on the external circuit board ,wherein a recess portion that mounts the flexible printed circuit is formed on an outer bottom surface of the housing and at a part where the flexible printed circuit is connected,a plurality of signal lines are disposed in the flexible printed circuit, andmeans for preventing a resonance mode or the like is provided such that a resonance mode of a microwave and a millimeter wave or a parallel plate mode is prevented from being generated among a surface A of the recess portion facing the flexible printed circuit, an electric wiring part B provided on the flexible printed circuit overlapping the surface A when seen in a plan view, and an electric wiring part C provided on the external circuit board overlapping the surface A when seen in a plan view.2. The optical modulator according to claim 1 ,wherein in the means for preventing a resonance mode or the like, at least one of a clearance or a dielectric constant between the surface A and the electric wiring part B, and a clearance or a dielectric constant between the electric wiring part B and the electric wiring part C is set to be locally varied.3. The optical modulator according to claim 1 ,wherein in the means for preventing a resonance mode or the like, at least any one of a pillar electrically connecting the surface A and the electric wiring part with each other or a pillar electrically connecting the electric wiring part B and the electric wiring part with each other is provided.4. The optical ...

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26-01-2017 дата публикации

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

Номер: US20170027054A1
Принадлежит:

A flexible circuit board includes an insulating layer, a linear signal line, a plurality of grounding lines, a metal coating layer, a circuit layer and an electromagnetic shielding layer. The insulating layer includes a first face and a second face. The metal coating layer covers the linear signal line on the first face. The metal coating layer has a thickness less than that of the linear signal line, and an electrical conductivity larger than that of the linear signal line. The grounding lines are at two opposite sides of the linear signal line on the first face. The circuit layer is on the second face. The electromagnetic shielding layer covers the linear signal line and the grounding lines. The linear signal line and the grounding lines are between the electromagnetic shielding layer and the circuit layer. A method for manufacturing the flexible circuit board is also provided. 1. A flexible circuit board comprising:an insulating layer comprising a first face and a second face opposite to the first face;a linear signal line located on the first face of the insulating layer;a metal coating layer covering the linear signal line on the first face of the insulating layer, and having a thickness less than that of the linear signal line, and an electrical conductivity larger than that of the linear signal line;a plurality of grounding lines located on the first face of the insulating layer, and located at two opposite sides of the linear signal line;a circuit layer located on the second face of the insulating layer; andan electromagnetic shielding layer covering the linear signal line and the grounding lines;wherein the linear signal line and the grounding lines are located between the electromagnetic shielding layer and the circuit layer.2. The flexible circuit board of claim 1 , further comprising a protecting layer covering the linear signal line claim 1 , wherein the protecting layer is located between the linear signal line and the electromagnetic shielding layer.3 ...

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26-01-2017 дата публикации

Mems Film for Semiconductor Device Test Socket Including Mems Bump

Номер: US20170027056A1
Принадлежит:

A microelectromechanical system (MEMS) film for a test socket is arranged between a semiconductor device and a test apparatus for performing an electrical test of the semiconductor device and includes a flexible bare film and a plurality of round-type MEMS bumps on the bare film, each of the MEMS bumps being formed on the bare film by using a MEMS processing technique, having an electrical contact with an electrode pad of the test apparatus or a conductive ball of the semiconductor device, and having a contact surface rounded from an edge side toward a center side in a convex manner in a direction toward the electrode pad or the conductive ball. 1. A microelectromechanical system (MEMS) film for a test socket configured to be arranged between a semiconductor device and a test apparatus for performing an electrical test of the semiconductor device , the MEMS film comprising:a flexible bare film; anda plurality of round-type MEMS bumps on the bare film, each of the MEMS bumps being formed on the bare film by using a MEMS processing technique, having an electrical contact with an electrode pad of the test apparatus or a conductive ball of the semiconductor device, and having a contact surface rounded from an edge side toward a center side in a convex manner in a direction toward the electrode pad or the conductive ball.2. The MEMS film according to claim 1 , further comprising a straight or curved groove at least partially around each of the MEMS bumps.3. The MEMS film according to claim 1 , whereinthe MEMS bumps include at least a plurality of first bumps and a plurality of second bumps,the bare film is molded with polyimide that allows a roll-to-roll continuous process and mounted on a supporting member having at least an upper surface and a lower surface in a manner that the bare film wraps the supporting member,the first bumps are arranged in an area corresponding to the upper surface and brought into contact with the conductive ball, andthe second bumps are ...

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24-04-2014 дата публикации

FOLDABLE DISPLAY DEVICE

Номер: US20140111954A1
Автор: KEE In-seo, LEE Sang-Wol
Принадлежит: Samsung Display Co., Ltd.

A foldable display device including a case that stably supports a flexible display panel for improving user convenience is disclosed. In one aspect, the foldable display device includes a flexible display panel including a foldable area between lateral plane areas thereof and a pair of front cases surrounding a front perimeter of the flexible display panel. The device also includes a pair of bottom cases coupled with the pair of front cases to house the flexible display panel and a biaxial hinge member mounted to the bottom case in the foldable area to connect the pair of front cases to respective rotation points. 1. A foldable display device comprising:a flexible display panel including a pair of lateral plane areas and a foldable area formed between the lateral plane areas;a pair of front cases surrounding a front perimeter of the flexible display panel, wherein each of the front cases has a rotation point about which the front cases at least partially rotate, wherein the rotation points are adjacent to the foldable area;a pair of bottom cases respectively coupled with the front cases to house the flexible display panel; anda biaxial hinge member formed at one of the front and bottom cases in the foldable area to connect the rotation points of the front cases to each other.2. The foldable display device of claim 1 , wherein each of the bottom cases comprises a lateral plane portion corresponding to the plane areas and wherein the foldable display device further comprises a curved portion connecting the lateral plane portions in an area corresponding to the foldable area.3. The foldable display device of claim 2 , wherein the curved portion comprises two half-curved portions respectively connected to the lateral plane portions and wherein the two half-curved portions are connected through a hinge portion and configured to be folded or unfolded.4. The foldable display device of claim 3 , wherein the biaxial hinge member comprises:a body disposed in an outer side of ...

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23-01-2020 дата публикации

Flexible Circuit Board, Light Bar, Light Source and Display Device

Номер: US20200025997A1
Принадлежит:

The present disclosure provides a flexible circuit board, a light bar, a light source and a display device. The light source includes a flexible circuit board having at least one effective welding portion and a light bar having at least one effective pad, the at least one effective welding portion being in one-to-one correspondence with the at least one effective pad, and the effective welding portion being fixed to a corresponding effective pad to transmit a signal loaded by itself to the corresponding effective pad. The flexible circuit board further includes at least one auxiliary welding portion, the light bar further includes at least one auxiliary pad that is in one-to-one correspondence with the at least one auxiliary welding portion, and the auxiliary welding portion is fixed to a corresponding auxiliary pad to enhance the firm fixing between the flexible circuit board and the light bar. 1. A flexible circuit board for being fixed to a light bar to provided a signal for the light bar , the flexible circuit board comprising:at least one effective welding portion configured to be fixed to a corresponding effective pad on the light bar and to transmit a signal loaded by itself to the corresponding effective pad; andat least one auxiliary welding portion configured to be fixed to a corresponding auxiliary pad on the light bar to enhance firm fixing between the flexible circuit board and the light bar.2. The flexible circuit board according to claim 1 , further comprising:a circuit body;at least one lead portion leading out of the circuit body; andat least one fixing portion disposed in one-to-one correspondence with the at least one lead portion,wherein each fixing portion is connected to an end of a corresponding lead portion, the effective welding portion and the auxiliary welding portion are both disposed on the at least one fixing portion, and each fixing portion is provided with at least one effective welding portion and at least one auxiliary welding ...

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28-01-2016 дата публикации

FLEXIBLE DISPLAY APPARATUS, FLEXIBLE DISPLAY MOTHERBOARD AND METHOD FOR MANUFACTURING FLEXIBLE DISPLAY MOTHERBOARD

Номер: US20160029473A1
Принадлежит:

A flexible display motherboard is disclosed. The motherboard includes a first group of flexible display units, where the first group includes at least one flexible display unit. The motherboard also includes a second group of flexible display units, where the second group includes at least one flexible display unit. The motherboard also includes one or more first grooves between the first and second groups. 1. A flexible display motherboard , comprising:a first group of flexible display units, the first group comprising at least one flexible display unit;a second group of flexible display units, the second group comprising at least one flexible display unit; andone or more first grooves between the first and second groups.2. The flexible display motherboard according to claim 1 , further comprising:a flexible substrate;a buffer layer on a surface of the flexible substrate; and a plurality of gate lines,', 'a gate insulating layer,', 'a plurality of data lines, and', 'a passivation layer,', 'wherein the first grooves are formed in at least one of the buffer layer, the gate insulating layer, and the passivation layer., 'a display device on a surface of the buffer layer, wherein the display device comprises3. The flexible display motherboard according to claim 2 , wherein the buffer layer comprises at least one of a silicon oxide thin film and a silicon oxide-silicon nitride thin film.4. The flexible display motherboard according to claim 2 , wherein the flexible substrate comprises plastic.5. The flexible display motherboard according to claim 2 , wherein the first grooves are formed by etching the buffer layer claim 2 , and wherein a depth of the first grooves is equal to or less than a thickness of the buffer layer.6. The flexible display motherboard according to claim 5 , wherein a difference between the depth of the plurality of first grooves and the thickness of the buffer layer is between about 0.05 μm and about 0.1 μm.7. The flexible display motherboard ...

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28-01-2016 дата публикации

ROLLABLE DISPLAY DEVICE

Номер: US20160029474A1
Автор: CHO Seok-Hyo, Park Chul
Принадлежит: LG DISPLAY CO., LTD.

A rollable display device includes a display panel for displaying an image, a printed circuit board connected to an edge of the display panel, and a roller which the display panel is rolled onto or unrolled from. The roller has a cylindrical shape having an inner space, and the printed circuit board is disposed in the inner space. 1. A display device comprising:a flexible display panel; a curved surface having a first end and a second end; and', 'a slit extending longitudinally along the curved surface of the roller; and, 'a roller on which the flexible display panel is selectively wound and unwound, the roller havinga printed circuit board connected to the flexible display panel, the printed circuit board being located within the roller.2. The display device of claim 1 , wherein the slit extends from the first end of the curved surface to the second end of the curved surface.3. The display device of claim 1 , wherein the roller is configured to rotate about an axis of rotation claim 1 , and the slit extends parallel to the axis of rotation.4. The display device of claim 1 , further comprising a connector interconnecting one end of the flexible display panel to the printed circuit board.5. The display device of claim 4 , wherein the connector is located within the slit.6. The display device of claim 1 , further comprising a pin connecting the printed circuit board to the roller.7. The display device of claim 6 , wherein the pin has a first end located in a through hole provided in the roller claim 6 ,wherein the pin extends through a pin hole provided in the printed circuit board, and wherein the pin has a second end located in a pin receiving portion provided in the roller.8. The display device of claim 7 , wherein the pin receiving portion is a fixing groove provided in the roller.9. The display device of claim 1 , wherein the roller is a circular cylinder.10. The display device of claim 1 , wherein the curved surface of the roller forms a tube having a hollow ...

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28-01-2016 дата публикации

FLEXIBLE TRANSPARENT ELECTRODE AND METHOD FOR MANUFACTURING SAME

Номер: US20160029475A1
Автор: HWANG Jungho, Park Jaehong
Принадлежит:

A flexible transparent electrode and a method for manufacturing the same are provided. The flexible transparent electrode includes: a substrate made of a flexible and transparent material, and a metal pattern which is formed on the substrate in a mesh form and has an electroconductive metal material, wherein the metal pattern is formed by being patterned on an upper side of the substrate using an electrohydrodynamic jet printing method and being sintered, and the electrohydrodynamic jet printing method is a method of forming a metal pattern on the upper side of the substrate after applying AC voltage of a predetermined power to the substrate and an injection nozzle of an electrohydrodynamic jet printing device. The flexible transparent electrode and the method for manufacturing the same can manufacture transparent electrode of a flexible structure through more simplified processes and reduce manufacturing costs. 1. A flexible transparent electrode comprising:a substrate made of a flexible and transparent material; anda metal pattern which is formed on the substrate in a mesh form and has an electroconductive metal material,wherein the metal pattern is formed by being patterned on an upper side of the substrate using an electrohydrodynamic jet printing method and being sintered,wherein the electrohydrodynamic jet printing method is a method of forming a metal pattern on the upper side of the substrate after applying AC voltage of a predetermined power to the substrate and an injection nozzle of an electrohydrodynamic jet printing device, andwherein in the electrohydrodynamic jet printing method, an injection cycle of the injection nozzle of the electrohydrodynamic jet printing device and an AC cycle are in integer multiple relationship with each other, and the injection nozzle carries out injection at the highest voltage or the lowest voltage of AC voltage.2. The flexible transparent electrode according to claim 1 , wherein the material of the substrate is at least ...

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28-01-2016 дата публикации

PRODUCTION METHOD OF COMPONENT-EMBEDDED SUBSTRATE, AND COMPONENT-EMBEDDED SUBSTRATE

Номер: US20160029489A1
Принадлежит:

A component-embedded substrate includes a cavity including through-holes penetrating through resin sheets in a stacked body of resin sheets having flexibility. An electronic chip component including external electrodes is disposed in the cavity. The resin sheet on which the electronic chip component is located is provided with through-holes into which conductive pastes are filled. The resin sheet includes cut-away portions communicating with a through-hole and located at a distance from each other across the through-hole. When this stacked body is hot-pressed, the conductive pastes overflow from the through-holes. However, the overflowing conductive pastes enter the cut-away portions. 1. A production method of a component-embedded substrate for producing a component-embedded substrate by stacking a plurality of resin sheets , each having thermoplasticity , and by performing hot pressing to the stacked resin sheets with an electronic chip component being held between the resin sheets , the production method comprising:a step of forming a through-hole, into which a conductive paste is filled, at a position of the resin sheets corresponding to an external electrode of the electronic chip component;a step of forming a cavity and a cut-away portion on one of the resin sheets corresponding to a position where the electronic chip component is to be disposed, the cavity having an area that is the same or substantially the same as an area of the electronic chip component in a plan view, the cavity having an outer shape following an outer shape of the electronic chip component, the cut-away portion communicating with the cavity;a step of inserting the electronic chip component into the cavity; anda step of stacking the plurality of resin sheets with the electronic chip component being disposed into the cavity, and performing hot pressing to stacked resin sheets; whereinthe external electrode includes a first external electrode and a second external electrode provided ...

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29-01-2015 дата публикации

FOLDABLE DISPLAY

Номер: US20150029652A1
Принадлежит: Samsung Display Co., Ltd.

A foldable display is disclosed. In one aspect, the foldable display includes a base substrate including a flexible area and a rigid area disposed at one or more sides of the flexible area. The foldable display also includes an image display device provided on the base substrate. The base substrate includes a matrix and a textile implanted in the matrix. The textile includes a flexible part corresponding to the flexible area and a rigid part corresponding to the rigid area. The rigid part is weaved differently from the flexible part.

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