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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 10874. Отображено 100.
09-02-2012 дата публикации

Microphone and accelerometer

Номер: US20120033832A1
Автор: Geert Langereis, Martijn Goossens, Twan Van Lippen
Принадлежит: NXP BV

The invention relates to a method for manufacturing a micromachined microphone and an accelerometer from a wafer 1 having a first layer 2 , the method comprising the steps of dividing the first layer 2 into a microphone layer 5 and into an accelerometer layer 6 , covering a front side of the microphone layer 5 and a front side of the accelerometer layer 6 with a continuous second layer 7 , covering the second layer 7 with a third layer 8 , forming a plurality of trenches 9 in the third layer 8 , removing a part 10 of the wafer 1 below a back side of the microphone layer 5 , forming at least two wafer trenches 11 in the wafer 1 below a back side of the accelerometer layer 6 , and removing a part 12, 13 of the second layer 7 through the plurality of trenches 9 formed in the third layer 8 . The micromachined microphone and the accelerometer according to the invention is advantageous over prior art as it allows for body noise cancellation in order to minimize structure borne sound.

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Номер записи: 1
29-03-2012 дата публикации

Phantom Power Circuit

Номер: US20120076325A1
Автор: Hiroshi Akino
Принадлежит: Audio Technica KK

A phantom power circuit has a detection circuit and a limiting circuit, the detection circuit detecting a pulse current generated in association with connection or disconnection of a condenser microphone, the limiting circuit limiting the output of the condenser microphone. The detection circuit detects a pulse current generated between input terminals of the condenser microphone. The limiting circuit reduces the output from the condenser microphone when the detection circuit detects the pulse current.

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Номер записи: 2
19-04-2012 дата публикации

Semiconductor component having a micromechanical microphone structure

Номер: US20120091545A1
Автор: Arnim Hoechst, Frank Reichenbach, Thomas Buck
Принадлежит: ROBERT BOSCH GMBH

A simple and cost-effective form of implementing a semiconductor component having a micromechanical microphone structure, including an acoustically active diaphragm as a deflectable electrode of a microphone capacitor, a stationary, acoustically permeable counterelement as a counter electrode of the microphone capacitor, and means for applying a charging voltage between the deflectable electrode and the counter electrode of the microphone capacitor. In order to not impair the functionality of this semiconductor component, even during overload situations in which contact occurs between the diaphragm and the counter electrode, the deflectable electrode and the counter electrode of the microphone capacitor are counter-doped, at least in places, so that they form a diode in the event of contact. In addition, the polarity of the charging voltage between the deflectable electrode and the counter electrode is such that the diode is switched in the blocking direction.

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Номер записи: 3
17-05-2012 дата публикации

Picture-exhibiting device with audio system

Номер: US20120117839A1
Автор: Dar-Ming Chiang, Shen-Lung Liang, Shu-Ru Lin, Tzu-Ju Lu
Принадлежит: Taiwan Electrets Electronics Co Ltd

A picture-exhibiting device with an audio system which can be used to demonstrate paintings or photos. The picture-exhibiting device with an audio system includes a frame, a picture fixed on the frame, an electret speaker positioned on the backside of the picture, a fixer disposed at a back side of the picture, a back frame fixed on the frame, a cover covering part of the back frame and the electret speaker, a post amplifier coupling the electret speaker, and an audio signal provider coupling the post amplifier.

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Номер записи: 4
07-06-2012 дата публикации

Mems microphone

Номер: US20120139066A1
Автор: Chang Han Je, Jaewoo Lee, Jongdae Kim, Woo Seok Yang
Принадлежит: Electronics and Telecommunications Research Institute ETRI

Disclosed is a micro electro mechanical system (MEMS) microphone including: a substrate; an acoustic chamber formed by processing the substrate; a lower electrode formed on the acoustic chamber and fixed to the substrate; a diaphragm formed over the lower electrode so as to be spaced apart from the lower electrode by a predetermined interval; and a diaphragm discharge hole formed at a central portion of the diaphragm. According to an exemplary embodiment of the present disclosure, attenuation generated by an air layer between the diaphragm and the lower electrode in a MEMS microphone may be effectively reduced, thereby making it possible to obtain high sensitivity characteristics and reduce a time and a cost required for removing a sacrificial layer between the diaphragm and the lower electrode.

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Номер записи: 5
14-06-2012 дата публикации

Electrostatic Loudspeaker System

Номер: US20120148074A1
Автор: Gaston Bastiaens, Ronald Buining
Принадлежит: Individual

An electrostatic loudspeaker (ESL) system includes a damping screen adjacent an outside surface of at least one of its stators to reduce distortion of acoustic output rendered by the loudspeaker's diaphragm, including effects of resonance of the diaphragm. A resilient excursion limiter placed adjacent an inside surface of at least one of the stators prevents contact of the diaphragm with the stator. A conductive portion of the diaphragm is printed with a conductive ink layer that includes conductive nanofibers. The loudspeaker system includes a dipole-radiating ESL element, an unbaffled or partially baffled dynamic loudspeaker and a baffled monopole-radiating dynamic loudspeaker (subwoofer), all essentially co-planar. The unbaffled or partially baffled dynamic loudspeaker provides a smooth transition in sound between the dipole-radiating ESL element and the monopole-radiating subwoofer. The ESL system includes two or more invertedly-driven ESL elements of different sizes, each element handling a different range of frequencies.

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Номер записи: 6
26-07-2012 дата публикации

Micromechanical Microphone Device and Method for Producing a Micromechanical Microphone Device

Номер: US20120189143A1
Автор: Alexander Buhmann, Ando Feyh
Принадлежит: ROBERT BOSCH GMBH

A micromechanical microphone device includes a membrane that is mounted in an elastically deflectable manner above a substrate and that has at least one gate electrode. The device further includes a source region and a drain region provided in or on the substrate with a channel region therebetween. The channel region is at least partly covered by the gate electrode and is spaced apart from the gate electrode by a gap. The membrane is deflectable under the influence of sound in such a way that the gap is variable.

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Номер записи: 7
06-09-2012 дата публикации

Resettable high-voltage capable high impedance biasing network for capacitive sensors

Номер: US20120223770A1
Автор: John M. Muza
Принадлежит: ROBERT BOSCH GMBH

A high-voltage MEMS biasing network. The network has a reset mode wherein a capacitive sensor is charged, and a functional mode wherein the MEMS biasing network provides a high impedance between the capacitive sensor and a bias voltage source. The network includes a biasing circuit, a mirror circuit, and a control circuit. The biasing circuit and the mirror circuit have a charging state and a high impedance state. The control circuit includes a first branch that controls the biasing circuit and a second branch that controls the mirror circuit. The biasing network receives a logic control signal, the first branch puts the biasing circuit into the charging state when the logic control signal is a first logic signal, and puts the biasing circuit into the high impedance state when the logic control signal is a second logic signal.

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Номер записи: 8
06-09-2012 дата публикации

Mems-microphone

Номер: US20120224726A1
Автор: Andreas Beer, Anton Leidl, Matthias Jungkunz, Wolfgang Pahl
Принадлежит: EPCOS AG

A MEMS microphone having an improved noise performance due to reduced DC leakage current is provided. For that, a minimum distance between a signal line of the MEMS microphone and other conducting structures is maintained. Further, a DC guard structure fencing at least a section of the signal line is provided.

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Номер записи: 9
04-10-2012 дата публикации

Multi-membrane microphone for high-amplitude audio capture

Номер: US20120250884A1
Автор: Andrew Duncan Phelps, Mikko Veli Aimo Suvanto
Принадлежит: Nokia Oyj

Disclosed herein are apparatus, method, and computer program product whereby a device receives an acoustic signal. In response to the received acoustic signal, the device outputs electrical signals from a first input audio transducer and a second input audio transducer. The second input audio transducer is less sensitive than the first input audio transducer.

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Номер записи: 10
04-10-2012 дата публикации

Programmable microphone

Номер: US20120250910A1
Автор: Claus Erdmann Fuerst, Henrik Thomsen, Jens Jorge Gaarde Henriksen, Mohammad Shajaan
Принадлежит: Audioasics AS

A semiconductor die with an integrated electronic circuit, configured so as to be mounted in a housing with a capacitive transducer e.g. a microphone. A first circuit is configured to receive an input signal from the transducer at an input node and to provide an output signal at a pad of the semiconductor die. The integrated electronic circuit comprises an active switch device with a control input, coupled to a pad of the semiconductor die, to operatively engage or disengage a second circuit interconnected with the first circuit so as to operate the integrated electronic circuit in a mode selected by the control input. That is, a programmable or controllable transducer. The second circuit is interconnected with the first circuit so as to be separate from the input node. Thereby less noise is induced, a more precise control of the circuit is obtainable and more advanced control options are possible.

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Номер записи: 11
01-11-2012 дата публикации

Surface-Mounted Microphone Arrays on Flexible Printed Circuit Boards

Номер: US20120275621A1
Автор: Gary W. Elko
Принадлежит: MH Acoustics LLC

A microphone array, having a three-dimensional (3D) shape, has a plurality of microphone devices mounted onto (at least one) flexible printed circuit board (PCB), which is bent to achieve the 3D dimensional shape. Output signals from the microphone devices can be combined (e.g., by weighted or unweighted summation or differencing) to form sub-element output signals and/or element output signals, and ultimately a single array output signal for the microphone array. The PCB may be uniformly flexible or may have rigid sections interconnected by flexible portions. Possible 3D shapes include (without limitation) cylinders, spirals, serpentines, and polyhedrons, each formed from a single flexible PCB. Alternatively, the microphone array may be an assembly of multiple, interconnecting sub-arrays, each having two or more rigid portions separated by one or more flexible portions, where each sub-array has at least one cut-out portion for receiving a rigid portion of another sub-array.

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Номер записи: 12
15-11-2012 дата публикации

Stereo microphone

Номер: US20120288101A1
Автор: Hiroshi Akino, Shioto Okita
Принадлежит: Audio Technica KK

A stereo microphone has four condenser microphone units having respective directional axes in the same horizontal plane. The four units each have unidirectivity and a quadrangular shape viewed from the direction of the directional axis. The units are disposed by rotating the directional axes of adjacent units by 90°. A pair of two units diagonally positioned and having the directional axes directed at 180° to each other collaborate with each other to form a pair of bidirectional microphone units.

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Номер записи: 13
15-11-2012 дата публикации

Microphone

Номер: US20120288113A1
Автор: Hiroshi Akino, Shioto Okita
Принадлежит: Audio Technica KK

A microphone includes a plurality of microphone units; in which the microphone units include a first group of microphone units and a second group of microphone units, the first group of microphone units and the second group of microphone units are disposed alternately, the first group of microphone units are connected in series such that outputs from the first group of microphone units are added and outputted as an added output, the second group of microphone units are connected in series such that outputs from the second group of microphone units are added and outputted as another added output, and the added output of one of the first group of microphone units and the second group of microphone units is output from a hot terminal as a balanced output and the other added output is output from a cold terminal as a balanced output.

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Номер записи: 14
29-11-2012 дата публикации

Sender communications for wireless power transfer

Номер: US20120299540A1
Автор: Meredith Perry
Принадлежит: Ubeam Inc

A signal generator generates an electrical signal that is sent to an amplifier, which increases the power of the signal using power from a power source. The amplified signal is fed to a sender transducer to generate ultrasonic waves that can be focused and sent to a receiver. The receiver transducer converts the ultrasonic waves back into electrical energy and stores it in an energy storage device, such as a battery, or uses the electrical energy to power a device. In this way, a device can be remotely charged or powered without having to be tethered to an electrical outlet.

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Номер записи: 15
29-11-2012 дата публикации

Receiver communications for wireless power transfer

Номер: US20120300588A1
Автор: Meredith Perry
Принадлежит: Ubeam Inc

A signal generator generates an electrical signal that is sent to an amplifier, which increases the power of the signal using power from a power source. The amplified signal is fed to a sender transducer to generate ultrasonic waves that can be focused and sent to a receiver. The receiver transducer converts the ultrasonic waves back into electrical energy and stores it in an energy storage device, such as a battery, or uses the electrical energy to power a device. In this way, a device can be remotely charged or powered without having to be tethered to an electrical outlet.

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Номер записи: 16
06-12-2012 дата публикации

Plate, Transducer and Methods for Making and Operating a Transducer

Номер: US20120308053A1
Автор: Alfons Dehe
Принадлежит: INFINEON TECHNOLOGIES AG

A plate, a transducer, a method for making a transducer, and a method for operating a transducer are disclosed. An embodiment comprises a plate comprising a first material layer comprising a first stress, a second material layer arranged beneath the first material layer, the second material layer comprising a second stress, an opening arranged in the first material layer and the second material layer, and an extension extending into opening, wherein the extension comprises a portion of the first material layer and a portion of the second material layer, and wherein the extension is curved away from a top surface of the plate based on a difference in the first stress and the second stress.

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Номер записи: 17
06-12-2012 дата публикации

Combined micro-electro-mechanical systems microphone and method for manufacturing the same

Номер: US20120308066A1
Автор: Hung-Jen Chen, Kuan-Hsun Chiu, Kuo-Hsiang Li, Yung-Ta Chen
Принадлежит: Merry Electronics Co Ltd

A combined MicroElectroMechanical Systems (MEMS) microphone includes a first substrate, a second substrate, a vibrating diaphragm, a backplate, and an accommodating slot. The first substrate has a first chamber, the vibrating diaphragm is disposed on the first chamber, the second substrate has a second chamber, one side of the backplate is disposed on the second chamber, and the other side of the backplate is disposed on the vibrating diaphragm, so that the second substrate is combined with the first substrate. In addition, the backplate has multiple sound holes, and the accommodating slot is disposed between the first substrate and the second substrate to form a space between the vibrating diaphragm and the backplate.

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Номер записи: 18
17-01-2013 дата публикации

Mems microphone overtravel stop structure

Номер: US20130016859A1
Автор: Thomas Buck
Принадлежит: ROBERT BOSCH GMBH

A MEMS microphone. The MEMS microphone includes a membrane, a spring, and a first layer having a backplate, and a first OTS structure. The spring has a first end coupled to the membrane, and a second end mounted to a support. The first OTS structure is released from the backplate and coupled to a structure other than the backplate, and is configured to stop movement of the membrane in a first direction after the membrane has moved a predetermined distance.

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Номер записи: 19
31-01-2013 дата публикации

Lid, fabricating method thereof, and mems package made thereby

Номер: US20130028450A1
Автор: Ivan Micallef, Kun-Chen Tsai, Mario Cortese, Mark A. Azzopardi, Shih-Ping Hsu
Принадлежит: STMICROELECTRONICS SRL, Unimicron Technology Corp

A lid for a MEMS device and the relative manufacturing method. The lid includes: a first board with opposite first and second surfaces having first and second metal layers disposed thereon, respectively, wherein a through cavity extends through the first board and the first and second metal layers; a second board with opposite third and fourth surfaces; an adhesive layer sandwiched between the second surface of the first board and the third surface of the second board to couple the first and second boards together such that the through cavity is closed by the second board, thereby forming a recess; and a first conductor layer coating the bottom and the side surfaces of the recess.

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Номер записи: 20
31-01-2013 дата публикации

Monolithic Silicon Microphone

Номер: US20130028459A1
Автор: Yunlong Wang
Принадлежит: Individual

A monolithic silicon microphone including a first backplate, a second backplate and a diaphragm displaced between said first backplate and said second backplate. Said first backplate is supported by a silicon substrate with one or more perforation holes. Said second substrate is attached to a perforated plate which itself is supported on said substrate. Said monolithic silicon microphone has integrated signal conditioning circuit, and is said diaphragm, said first backplate, said second backplate, and said signal conditioning circuit are electrically interconnected. Signals from said diaphragm, said first backplate, and said second backplate are fed into said signal conditioning circuit, and are amplified differentially.

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Номер записи: 21
21-02-2013 дата публикации

Electret loudspeaker device

Номер: US20130044905A1
Автор: Chih-Kung Lee, Han-Lung Chen, Hsu-Ching Liao, Wen-Hsin Hsiao, Yu-Chi Chen
Принадлежит: National Taiwan University NTU

An electret loudspeaker device including a diaphragm, a first perforated electrode and a first spacer is provided. The diaphragm has an electret layer and an electrode layer. The first perforated electrode is stacked on a side of the diaphragm near the electret layer, and has multiple holes. The first spacer is stacked between the diaphragm and the first perforated electrode, and includes a first distribution area and plural second distribution areas. The first distribution area has first openings penetrating through the first spacer, and each first opening has a first opening space volume between the diaphragm and the first perforated electrode. Each second distribution area has second openings penetrating through the first spacer, and each second opening has a second opening space volume between the diaphragm and the first perforated electrode. A difference between the first and the second opening space volumes is greater than 10%.

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Номер записи: 22
21-02-2013 дата публикации

Electret loudspeaker device

Номер: US20130044906A1
Автор: Chih-Kung Lee, Han-Lung Chen, Hsu-Ching Liao, Wen-Hsin Hsiao, Yu-Chi Chen
Принадлежит: National Taiwan University NTU

An electret loudspeaker device including a diaphragm, a first perforated electrode and a first spacer is provided. The diaphragm includes a first electret, a second electret, a polymer layer and an electrode layer. At least one layer of the first electret or the second electret is formed by expanded polytetrafluoroethylene. The second electret is stacked on one side of the first electret, while the electrode layer is stacked on the opposite side of the first electret. The polymer layer is made of a hydrophobic material and is disposed on the second electret. The first perforated electrode is stacked on a first spacer and close to the polymer layer. The first spacer disposed to between the diaphragm and the first perforated electrode supports the first perforated electrode over the diaphragm and defines a first chamber. A fabrication method of the electret loudspeaker device is also provided.

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Номер записи: 23
28-03-2013 дата публикации

Electrostatic parallel plate actuators whose moving elements are driven only by electrostatic force and methods useful in conjunction therewith

Номер: US20130076275A1
Автор: Daniel Lewin, Eric Andreas Haber, Meir Ben Simon, Shay Kaplan, Yuval Cohen
Принадлежит: Audio Pixels Ltd

An actuator apparatus is provided that includes at least one actuator device, each actuator device including an array of moving elements, each individual moving element is operative to be constrained to travel alternately back and forth along a respective axis responsive to an individual first electrostatic force operative thereupon, wherein each moving element has an at-rest position and is driven away from its at rest position solely by the first electrostatic force; and at least one electrode operative to apply a controlled temporal sequence of potential differences with at least one individual moving element from among the array of moving elements thereby to selectably generate the first electrostatic force; and a controller operative to receive the digital input signal and to control at least one of the at least one electrode and the individual moving element to apply the sequence of potential differences.

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Номер записи: 24
11-04-2013 дата публикации

Condenser microphone

Номер: US20130089222A1
Автор: Hiroshi Akino
Принадлежит: Audio Technica KK

The present invention has: a condenser microphone unit which performs electroacoustic conversion according to a change in an electrostatic capacitance between a diaphragm and a fixed pole; a non-inverting amplifier which is connected to one of the diaphragm and the fixed pole, and which has an impedance converter which converts an output impedance of the microphone unit into a low impedance; an inverting amplifier which receives an input of an output signal of the non-inverting amplifier through an input resistance, and which has a feedback resistance; and a variable resistor which is connected between an output of the non-inverting amplifier and an output of the inverting amplifier, and in which a wiper is connected to the diaphragm or the fixed pole, whichever is not connected to the non-inverting amplifier, and the sensitivity changes according to the position of the wiper of the variable resistor.

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Номер записи: 25
18-04-2013 дата публикации

COMPACT, HIGHLY INTEGRATED MICROPHONE ASSEMBLY

Номер: US20130094674A1
Автор: Kirkpatrick Galen, Lautenschlager Eric J.
Принадлежит:

A microelectromechanical (MEMS) microphone assembly includes a MEMS structure, a base portion, and a lid. The MEMS structure includes a diaphragm that responds to changes in sound pressure and the MEMS structure contributes to a vertical dimension of the assembly. The MEMS structure is supported by the base portion. The lid partially but not completely encloses the MEMS structure, such that the portion of the MEMS structure is not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly. 1. A microelectromechanical (MEMS) microphone assembly , the assembly comprising:a MEMS structure, the MEMS structure including a diaphragm that responds to changes in sound pressure, the MEMS structure contributing to a vertical dimension of the assembly;a base portion, the MEMS structure being supported by the base portion; anda lid, the lid partially but not completely enclosing the MEMS structure, such that a portion of the MEMS structure not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly.2. The assembly of wherein a port is disposed through the lid.3. The assembly of wherein a port is disposed through the base portion.4. The assembly of further comprising an integrated circuit coupled to the MEMS structure.5. The assembly of wherein the integrated circuit is mounted in a flip-chip type configuration.6. The assembly of wherein the portion of the MEMS structure not surrounded by the lid is directly exposed to the external environment.7. The assembly of wherein the portion of the MEMS structure not surrounded by the lid is covered with a thin film. This patent claims benefit under 35 U.S.C. §119 (e) to U.S. Provisional Application No. 61/475,913 entitled “Compact, Highly Integrated Microphone Architecture And Method Of Manufacture” filed Apr. 15, 2011 having attorney docket number 8354-99386-US the ...

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Номер записи: 26
18-04-2013 дата публикации

Electret Condenser Microphone

Номер: US20130094676A1
Автор: Motonaga Hidenori, MURAOKA Tetsuji, Nakanishi Kensuke
Принадлежит: HOSIDEN CORPORATION

An electret condenser microphoneelectret condenser microphone includes a capsule, diaphragm ring with attached diaphragm, back electrode plate having an electret-dielectric-film-coated surface facing the diaphragm, insulating spacer with space between the back electrode plate and the diaphragm, impedance converter, flexible printed circuit board in which a hollow cylinder, a flange projecting radially from an edge of the hollow cylinder on one end face facing the back electrode plate, and a rear plate blocking the other end face of the hollow cylinder are integrally formed, in which the impedance converter is placed on a surface of the rear plate facing the back electrode plate, and gate ring electrically connecting the back electrode plate to wiring on the flexible printed circuit board. An edge on an open side of the capsule bends inwardly to fit against the flange of the flexible printed circuit board. 1. An electret condenser microphone comprising:a capsule that includes a first hollow cylinder and a front plate blocking one end face of the first hollow cylinder, the capsule being made of metal material;a diaphragm ring that has one surface in contact with an inner surface of the front plate and the other surface to which a diaphragm is attached;a back electrode plate that has a surface with which an electret dielectric film is coated, the surface facing the diaphragm, the back electrode plate being made of metal material;an insulating spacer that is annularly formed and present between the back electrode plate and the diaphragm to keep a space between the back electrode plate and the diaphragm;an impedance converter that performs impedance conversion of an electric signal generated on the back electrode plate and extracts a converted signal;a flexible printed circuit board in which a second hollow cylinder, a flange that projects radially from an edge of the second hollow cylinder on one end face of the second hollow cylinder that faces the back electrode plate ...

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Номер записи: 27
18-04-2013 дата публикации

Microphone Unit, Method of Manufacturing Microphone Unit, Electronic Apparatus, Substrate for Microphone Unit and Method of Manufacturing Substrate for Microphone Unit

Номер: US20130094689A1
Автор: Fuminori Tanaka, Yuji Ushiyama
Принадлежит: Funai Electric Co Ltd, Hitachi Chemical Co Ltd

This microphone unit includes a vibrating portion converting a sound to an electric signal, a substrate having a first surface where the vibrating portion is set and a second surface opposite to the first surface and including a hollow portion transmitting a sound therein, and a coating layer formed on an inner surface of the hollow portion of the substrate. The substrate further includes a first substrate sound hole portion provided on the first surface for causing the hollow portion and the vibrating portion to communicate with each other, a second substrate sound hole portion provided on the first surface for causing the hollow portion and the exterior to communicate with each other, and a coating liquid draining hole portion provided on the second surface for causing the hollow portion and the exterior to communicate with each other.

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Номер записи: 28
02-05-2013 дата публикации

MEMS Microphone with Spring Suspended Backplate

Номер: US20130108084A1
Автор: Zhang Xin
Принадлежит: ANALOG DEVICES, INC.

A MEMS microphone has a base, a backplate, and a backplate spring suspending the backplate from the base. The microphone also has a diaphragm forming a variable capacitor with the backplate. 1. A MEMS microphone comprising:a base;a backplate having a plurality of apertures;a backplate spring suspending the backplate from the base; anda diaphragm forming a variable capacitor with the backplate.2. The MEMS microphone as defined by wherein when the microphone is stationary claim 1 , the backplate spring has a spring constant that is high enough to cause the backplate to remain substantially stationary upon receipt of audio signals having amplitudes on the order of magnitude of the human speaking voice.3. The MEMS microphone as defined by wherein the backplate spring comprises a serpentine shape.4. The MEMS microphone as defined by wherein the backplate spring is substantially solid and circumscribes the backplate.5. The MEMS microphone as defined by wherein the backplate has a thickness claim 4 , the backplate spring having a thickness that is less than the thickness of the backplate.6. The MEMS microphone as defined by wherein the backplate spring comprises at least one tether.7. The MEMS microphone as defined by wherein the tether is solid.8. The MEMS microphone as defined by wherein the diaphragm has a diaphragm spring with a diaphragm spring constant claim 1 , the backplate spring having a backplate spring constant claim 1 , the backplate spring constant being at least ten times larger than the diaphragm spring constant.9. A method of reducing stress on a MEMS microphone backplate claim 1 , the method comprising:providing a base;supporting a diaphragm on the base; andforming a variable capacitor by spacing a backplate from the diaphragm, the backplate being connected to the base with at least one spring configured to reduce stress on the backplate.10. The method as defined by further comprising applying an incident audio signal of a spoken human voice against the ...

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Номер записи: 29
02-05-2013 дата публикации

ELECTROSTATIC LOUDSPEAKER

Номер: US20130108086A1
Автор: Takano Yasuaki, YAMASHITA Masayoshi
Принадлежит: YAMAHA CORPORATION

An electrostatic loudspeaker includes: a vibrating member; an electrode disposed so as to be opposed to the vibrating member; a spacer member disposed on an opposite side of a face of the electrode, which is opposed to the vibrating member, and having acoustic transmission property; and a cover member disposed on an opposite side of a face of the spacer member, which is opposed to the electrode, and having waterproof property and insulation property. 1. An electrostatic loudspeaker comprising:a vibrating member;an electrode disposed so as to be opposed to the vibrating member;a spacer member disposed on an opposite side of a face of the electrode, which is opposed to the vibrating member, and having acoustic transmission property; anda cover member disposed on an opposite side of a face of the spacer member, which is opposed to the electrode, and having waterproof property and insulation property.2. The electrostatic loudspeaker according to claim 1 , whereinthe electrode has acoustic transmission property,the vibrating member is a vibrating membrane,an elastic member having elasticity, insulation property, and acoustic transmission property, is disposed between the vibrating membrane and the electrode,the spacer member is a first cover member having elasticity,the cover member is a second cover member having acoustic transmission property, anda third cover member having acoustic transmission property is disposed on an opposite side of a face of the second cover member, which is opposed to the first cover member.3. The electrostatic loudspeaker according to claim 2 , wherein the second cover member includes a conductive membrane formed on an entire area of at least one face of the second cover member claim 2 , and the conductive membrane is electrically connected to a ground of a drive circuit configured to supply an acoustic signal to the electrode.4. The electrostatic loudspeaker according to claim 2 , whereinthe first cover member is a pair of first cover members ...

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Номер записи: 30
02-05-2013 дата публикации

ELECTROSTATIC LOUDSPEAKER

Номер: US20130108087A1
Автор: Matsubara Yoshikatsu, Muroi Kunimasa, Takano Yasuaki
Принадлежит: YAMAHA CORPORATION

An electrostatic loudspeaker includes: a first electrode having acoustic transmission property; a second electrode having acoustic transmission property, and disposed so as to be opposed to the first electrode; a vibrating member having conductibility, and disposed between the first electrode and the second electrode; a first elastic member having elasticity, insulation property, and acoustic transmission property, and disposed between the vibrating member and the first electrode; a second elastic member having elasticity, insulation property, and acoustic transmission property, and disposed between the vibrating member and the second electrode; and a first separation member having insulation property and acoustic transmission property, and disposed on an opposite side of a face of the first electrode, which is opposed to the first elastic member. 1. An electrostatic loudspeaker comprising:a first electrode having acoustic transmission property;a second electrode having acoustic transmission property, and disposed so as to be opposed to the first electrode;a vibrating member having conductibility, and disposed between the first electrode and the second electrode;a first elastic member having elasticity, insulation property, and acoustic transmission property, and disposed between the vibrating member and the first electrode;a second elastic member having elasticity, insulation property, and acoustic transmission property, and disposed between the vibrating member and the second electrode; anda first separation member having insulation property and acoustic transmission property, and disposed on an opposite side of a face of the first electrode, which is opposed to the first elastic member.2. The electrostatic loudspeaker according to claim 1 , further comprising:a second separation member having insulation property and acoustic transmission property, and disposed on an opposite side of a face of the second electrode, which is opposed to the second elastic member.3. ...

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Номер записи: 31
16-05-2013 дата публикации

Miniaturized Electrical Component Comprising an MEMS and an ASIC and Production Method

Номер: US20130119492A1
Автор: Anton Leidl, Gregor Feiertag, Hans Krueger, Wolfgang Pahl
Принадлежит: EPCOS AG

The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.

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Номер записи: 32
16-05-2013 дата публикации

Sound Transducer with Interdigitated First and Second Sets of Comb Fingers

Номер: US20130121509A1
Автор: Alfons Dehe, Shu-Ting Hsu
Принадлежит: INFINEON TECHNOLOGIES AG

A sound transducer includes a substrate with a cavity with extending from a first surface of the substrate, a body at least partially covering the cavity and being connected to the substrate by at least one resilient hinge, a first set of comb fingers mounted to the substrate, and a second set of comb fingers mounted to the body. The first set of comb fingers and the second set of comb fingers are interdigitated and configured to create an electrostatic force driving the body in a direction perpendicular to the first surface of the substrate. The body and the at least one resilient hinge are configured for a resonant or a near-resonant excitation by the electrostatic force.

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Номер записи: 33
23-05-2013 дата публикации

Air cavity package configured to electrically couple to a printed circuit board and method of providing same

Номер: US20130128487A1
Автор: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
Принадлежит: UBOTIC INTELLECTUAL PROPERTY CO Ltd

In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base having a top, a bottom and one or more sides between the top and the bottom, the base having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. The lid can be coupled to the base and at least one of the lid or the base has at least one port hole. The one or more second electrically conductive leads can be configured to couple to the printed circuit board at a first side of the one or more sides of the base. Other embodiments are disclosed.

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Номер записи: 34
23-05-2013 дата публикации

ELECTROSTATIC LOUDSPEAKER AND METHOD OF PRODUCING ELECTROSTATIC LOUDSPEAKER

Номер: US20130129121A1
Автор: YAMASHITA Masayoshi
Принадлежит: YAMAHA CORPORATION

An electrostatic loudspeaker includes: a first electrode; a second electrode which is opposed to the first electrode; and a vibrating member which is disposed between the first electrode and the second electrode and in which an insulation membrane and a conductive membrane are stacked, the insulation membrane being disposed on both end faces of the vibrating member in a direction of the stacking. 1. An electrostatic loudspeaker compressing:a first electrode;a second electrode which is opposed to the first electrode; anda vibrating member which is disposed between the first electrode and the second electrode and in which an insulation membrane and a conductive membrane are stacked, the insulation membrane being disposed on both end faces of the vibrating member in a direction of the stacking.2. The electrostatic loudspeaker according to claim 1 , wherein the vibrating member is formed by folding a sheet in which the conductive membrane is formed on the insulation membrane.3. The electrostatic loudspeaker according to claim 2 , wherein the vibrating member is formed by folding the sheet into two parts.4. The electrostatic loudspeaker according to claim 1 , wherein the vibrating member is formed by stacking two sheets claim 1 , in which the insulation membrane and the conductive membrane are stacked claim 1 , so that the insulation membrane is disposed outside.5. A method of producing an electrostatic loudspeaker claim 1 , the method comprising:a first step of stacking an insulation membrane and a conductive membrane to form a vibrating member, the insulation membrane being disposed on both end faces of the vibrating member in a direction of the stacking; anda second step of disposing a first electrode, a second electrode and the vibrating member so that the vibrating member formed in the first step is disposed between the first electrode and the second electrode which are opposed to each other.6. The method according to claim 5 , wherein claim 5 , in the first step ...

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Номер записи: 35
23-05-2013 дата публикации

Microphone unit

Номер: US20130129133A1
Автор: Fuminori Tanaka, Ryusuke Horibe, Takeshi Inoda
Принадлежит: Funai Electric Co Ltd

A microphone unit ( 1 ) is provided with an electro-acoustic transducer ( 13 ) which converts acoustic signals into electric signals on the basis of the oscillation of a diaphragm ( 134 ), and a housing ( 10 ) which contains the electro-acoustic transducer ( 13 ). The housing ( 10 ) is provided with: a first sound conduction space (SP 1 ) that guides sound waves from the outside to one side of the diaphragm ( 134 ) via at least one first aperture ( 18 ) formed on the exterior of the housing ( 10 ); and a second sound conduction space (SP 2 ) that guides sound waves from the outside to the other side of the diaphragm ( 134 ) via at least one second aperture ( 19 ) formed on the exterior of the housing ( 10 ). The total square area of at least one first aperture ( 18 ) and the total square area of at least one second aperture ( 19 ) are not the same.

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Номер записи: 36
30-05-2013 дата публикации

Mems microphone

Номер: US20130136291A1
Автор: Sang Ho Lee, Yong Hyun Shim
Принадлежит: BSE Co Ltd

A MEMS microphone includes a case having sidewalls, a top wall, and an opened bottom; a PCB attached to the bottom of the case; a MEMS chip, which is arranged on the PCB and includes an inner-MEMS space; and at least one sound hole formed through a surface of the case for introduction of external sounds, wherein an internal communicating unit which forms a sound path via which the sound hole and the inside-MEMS space communicate with each other is arranged inside the case such that external sounds introduced via the sound hole pass through the sound path and enter the inner-MEMS space.

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Номер записи: 37
06-06-2013 дата публикации

Mems acoustic transducer and method for fabricating the same

Номер: US20130140655A1
Автор: Chien-Nan YEH, Chin-Hung Wang, Hsin-Li Lee, Jien-Ming Chen, Li-Chi Pan, Tzong-Che Ho
Принадлежит: Industrial Technology Research Institute ITRI

A MEMS acoustic transducer is provided, which includes a substrate, a MEMS chip, and a housing. The substrate has a first opening area and a lower electrode layer disposed over a surface of the substrate, wherein the first opening area includes at least one hole allowing acoustic pressure to enter the MEMS acoustic transducer. The MEMS chip is disposed over the surface of the substrate, including a second opening area and an upper electrode layer partially sealing the second opening area, wherein the upper electrode layer and the lower electrode layer, which are parallel to each other and have a gap therebetween, form an induction capacitor. The housing is disposed over the MEMS chip or the surface of the substrate creating a cavity with the MEMS chip or the substrate. In addition, a method for fabricating the above MEMS acoustic transducer is also provided.

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Номер записи: 38
13-06-2013 дата публикации

Dynamic Microphone Unit and Dynamic Microphone

Номер: US20130148836A1
Автор: AKINO Hiroshi
Принадлежит:

A dynamic microphone unit includes: a diaphragm that vibrates in response to received sound waves; a voice coil that is fixed to the diaphragm and vibrates together with the diaphragm; a magnetic circuit that generates a magnetic field in a magnetic gap, the voice coil being disposed in the magnetic gap; a resonator that is disposed adjacent to the obverse of the diaphragm; and a noise canceling coil that is fixed to a surface of the resonator so as to face a position of fixing the voice coil, the surface facing the diaphragm. The noise canceling coil is connected in series with the voice coil and has a winding direction different from that of the voice coil. 1. A dynamic microphone unit comprising:a diaphragm that vibrates in response to received sound waves;a voice coil that is fixed to the diaphragm and vibrates together with the diaphragm;a magnetic circuit that generates a magnetic field in a magnetic gap, the voice coil being disposed in the magnetic gap;a resonator that is disposed adjacent to the obverse of the diaphragm; anda noise canceling coil fixed to a surface of the resonator, the surface facing a surface of the diaphragm, the noise cancelling coil facing the voice coil.2. The dynamic microphone unit according to claim 1 , whereinthe noise canceling coil is connected in series with the voice coil, anda winding direction of the noise canceling coil being different from a winding direction of the voice coil.3. The dynamic microphone unit according to claim 1 , wherein the resonator has a convex surface on its surface that faces the diaphragm claim 1 , the convex surface being formed along a circle concentric with the voice coil claim 1 , the noise canceling coil being aligned along the convex surface.4. The dynamic microphone unit according to claim 1 , wherein the noise canceling coil has the same wound diameter as that of the voice coil.5. The dynamic microphone unit according to claim 1 , wherein the noise canceling coil has the same number of turns ...

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Номер записи: 39
20-06-2013 дата публикации

System and Method of Reducing Noise in a MEMS Device

Номер: US20130152686A1
Автор: Srinivasan Venkatraman
Принадлежит: Analog Devices Inc

A MEMS system has an input for receiving a plurality of frequency division multiplexed variable capacitance signals, and a readout node electrically coupled with the input. Each variable capacitance signal is produced by a variable capacitor and has data relating to movement of microstructure associated with that variable capacitor. Moreover, each variable capacitance signal is produced by a variable capacitor that is different from the variable capacitor producing any of the other variable capacitance signals. The system further has a mixer electrically coupled with the readout node, and an output electrically coupled with the mixer. The mixer is configured to substantially continuously receive the plural variable capacitance signals. In addition, the output has an output interface for delivering the plurality of variable capacitance signals in parallel. The signals at the output should represent real time signals, as compared to stale sample and hold signals used in prior art systems.

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Номер записи: 40
20-06-2013 дата публикации

Acoustic Apparatus And Method Of Manufacturing

Номер: US20130156235A1
Автор: Wickstrom Timothy K.
Принадлежит:

A microphone assembly comprising includes a base, at least one side wall, and a cover. The side wall is disposed on the base. The cover is coupled to the at least one side wall. The base, the side wall, and the cover form a cavity and the cavity has a MEMS device disposed therein. A top port extends through the cover and a first channel extends through the side wall. The first channel is arranged so as to communicate with the top port. A bottom port extends through the base. The MEMS device is disposed over the bottom port. A second channel is formed and extends along a bottom surface of the base. The second channel extends between and communicates with the first channel and the bottom port. Sound received by the top port is received at the MEMS device. 1. A microphone assembly comprising:a base;at least one side wall disposed on the base;a cover coupled to the at least one side wall, wherein the base, the at least one side wall, and the cover form a cavity, the cavity having a MEMS device disposed therein;a top port extending through the cover;a first channel extending through the at least one side wall, the first channel arranged so as to communicate with the top port;a bottom port extending through the base, wherein the MEMS device is disposed over the bottom port;a second channel formed and extending along a bottom surface of the base, the second channel extending between and communicating with the first channel and the bottom port;such that sound energy received by the top port passes through the first channel, the second channel, and the bottom port and is received at the MEMS device.2. The microphone assembly of wherein a solder ring claim 1 , the bottom surface of the base claim 1 , and a mounting substrate form the second channel.3. The microphone assembly of wherein the base comprises a printed circuit board.4. The microphone assembly of further comprising an integrated circuit disposed in the cavity and coupled to the MEMS device.5. The microphone ...

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Номер записи: 41
27-06-2013 дата публикации

MEMS Tilt Sensor

Номер: US20130160547A1
Автор: Eric J. Lautenschlager, Sung Bok Lee
Принадлежит: Knowles Electronics LLC

An acoustic sensor includes a back plate; at least one back plate electrode coupled to the back plate; a proof of mass with the proof of mass elastically coupled to the back plate; and a proof of mass electrode coupled to the proof of mass. Movement of the sensor causes a capacitance between the proof of mass electrode and the at least one back plate electrode to vary and the capacitance represents a magnitude of the movement of the sensor.

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Номер записи: 42
04-07-2013 дата публикации

SPEAKER UNIT

Номер: US20130170677A1
Автор: Enomoto Tsutomu
Принадлежит: SONY CORPORATION

Disclosed herein is a speaker unit, including: a magnetic circuit having a magnet and a coil; a vibrating plate adapted to be vibrated by a drive force of the magnetic circuit; and a frame having a circuit mounting portion to which the magnetic circuit is mounted, an edge mounting portion to which an edge of the vibrating plate is mounted, and plural leg portions through which the circuit mounting portion and the edge mounting portion are coupled to each other and which are provided in spaced relation to one another in a circumferential direction, wherein irregularity portions are provided in the plural leg portions, respectively, and forms of the irregularity portions are made different from each other at least in two of the leg portions. 1. A speaker unit , comprising:a magnetic circuit having a magnet and a coil;a vibrating plate adapted to be vibrated by a drive force of said magnetic circuit; and a circuit mounting portion to which said magnetic circuit is mounted,', 'an edge mounting portion to which an edge of said vibrating plate is mounted, and', 'plural leg portions through which said circuit mounting portion and said edge mounting portion are coupled to each other and which are provided in spaced relation to one another in a circumferential direction,, 'a frame having'}wherein irregularity portions are provided in said plural leg portions, respectively, and forms of said irregularity portions are made different from each other at least in two of said leg portions.2. The speaker unit according to claim 1 , wherein of the forms of said irregularity portions claim 1 , sizes are made different from each other.3. The speaker unit according to claim 1 , wherein of the forms of said irregularity portions claim 1 , shapes are made different from each other.4. The speaker unit according to claim 1 , wherein of the forms of said irregularity portions claim 1 , numbers are made different from each other.5. The speaker unit according to claim 1 , whereinsaid leg ...

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Номер записи: 43
25-07-2013 дата публикации

Acoustic sensor and method of manufacturing the same

Номер: US20130185928A1
Автор: Chang Han Je, Jaewoo Lee, Jongdae Kim, Woo Seok Yang
Принадлежит: Electronics and Telecommunications Research Institute ETRI

Provided is an acoustic sensor. The acoustic sensor includes: a substrate including sidewall portions and a bottom portion extending from a bottom of the sidewall portions; a lower electrode fixed at the substrate and including a concave portion and a convex portion, the concave portion including a first hole on a middle region of the bottom, the convex portion including a second hole on an edge region of the bottom; diaphragms facing the concave portion of the lower electrode, with a vibration space therebetween; diaphragm supporters provided on the lower electrode at a side of the diaphragm and having a top surface having the same height as the diaphragm; and an acoustic chamber provided in a space between the bottom portion and the sidewall portions below the lower electrode.

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Номер записи: 44
01-08-2013 дата публикации

CROSSOVER DOUBLE SPEAKER

Номер: US20130195293A1
Автор: KO Ju-Heon
Принадлежит: Youngbo Engineering Industries, Inc.

Disclosed is a crossover double speaker having a small speaker and a large speaker on the upper side and on the lower side thereof. The crossover double speaker includes a cover integrally formed on the outer circumference of a flange of the yoke; a frame disposed below the cover; a first speaker unit including a first magnet disposed in a first speaker space, a first vibration plate arranged over the first magnet, and a first voice coil inserted into a first air gap; and a second speaker unit including a second magnet disposed in a second speaker space, a second vibration plate arranged between the yoke and the frame, and a second voice coil inserted into a second air gap. The yoke has sound release holes to output the sound generated from the second speaker unit in the direction of the first speaker unit. 1. A crossover double speaker , which includes a yoke of a roughly U shape having a bottom , a cylinder portion integrally formed on the outer circumference of the bottom , and a flange extending outward from the top end of the cylinder portion; a first speaker unit having a first magnet arranged in a first speaker space provided by the bottom and the cylinder portion of the yoke; and a second speaker unit having a second magnet arranged in a second speaker space provided below the yoke , wherein a sound generated from the second speaker unit of the lower side is outputted in the direction of the first speaker unit , the crossover double speaker comprising:a cover which is integrally formed on the outer circumference of a flange of the yoke and extends downward from the flange of the yoke at a predetermined interval radially so as to surround the cylinder portion of the yoke that provides the first speaker space therein; anda frame which is disposed below the cover so as to provide the second speaker space,wherein the first speaker unit comprises a first magnetic plate attached to the top face of the first magnet, a first vibration plate in which the outer ...

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Номер записи: 45
12-09-2013 дата публикации

Electret-Based Accelerometer

Номер: US20130233078A1
Автор: Michael J. Sinclair
Принадлежит: Microsoft Corp

An electret accelerometer is provided in which a diaphragm, an electret, a back plate and an electronic circuit are placed in a sealed casing to prevent external acoustic signals from reaching the diaphragm.

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Номер записи: 46
05-12-2013 дата публикации

Micro-electro-mechanical system microphone chip with expanded back chamber

Номер: US20130322661A1
Автор: Chun-Chieh Wang, Hung-Jen Chen, Kuan-Hsun Chiu, Min-Li Hsu
Принадлежит: Merry Electronics Co Ltd

A MEMS microphone chip with an expanded back chamber includes a first chip unit and a second chip unit. The first chip unit has a first substrate, a vibration membrane layer is formed. above an end of the first substrate, and a space is formed below the vibration membrane layer of the first substrate, so that the vibration membrane layer is suspended above the first substrate to vibrate. The second chip unit has a second substrate to couple with another end of the first substrate, and a groove is formed in the second substrate with. a width larger than that of the space; when the first substrate and the second substrate are coupled together, the groove and the space are connected together to act as the back chamber of the vibration membrane layer.

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Номер записи: 47
02-01-2014 дата публикации

Polymer speaker

Номер: US20140003634A1
Автор: Hitoshi Yoshikawa, Katsuhiko Nakano, Mitsuyoshi Kondo, Takamasa Ito
Принадлежит: Sumitomo Riko Co Ltd

A polymer speaker is configured to include an electrostrictive element having an elastomer or resin dielectric layer and a plurality of electrode layers arranged on the front and back surfaces of the dielectric layer. The electrode layers are formed from a conductive material including a polymer binder and a conductor and having a modulus of elasticity of 100 MPa or less. The spring constant of the electrode layers in the surface direction is smaller than the spring constant of the dielectric layer in the surface direction. The volume resistivity of the electrode layers is 200 Ω·cm or less. The polymer speaker provides a practical sound pressure in a wide frequency region from low frequencies to high frequencies.

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Номер записи: 48
09-01-2014 дата публикации

Capacitive transducer

Номер: US20140007693A1
Автор: Kazutoshi Torashima, Takahiro Akiyama
Принадлежит: Canon Inc

Provided is a capacitive transducer including an element including a plurality of cells: each of the plurality of cells including: a first electrode; and a vibrating film including a second electrode, the second electrode being opposed to the first electrode with a gap; and a vibrating film supporting portion that supports the vibrating film so as to form the gap, in which the element includes a first cell and a second cell, the first cell including the vibrating film having a first spring constant, the second cell including the vibrating film having a second spring constant lower than the first spring constant; and a voltage to be applied between the first electrode and the second electrode of the first cell is higher than a voltage to be applied between the first electrode and the second electrode of the second cell.

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Номер записи: 49
09-01-2014 дата публикации

CAPACITIVE TRANSDUCER, CAPACITIVE TRANSDUCER MANUFACTURING METHOD, AND OBJECT INFORMATION ACQUISITION APPARATUS

Номер: US20140010388A1
Автор: Akiyama Takahiro, Torashima Kazutoshi
Принадлежит:

Provided is a capacitive transducer having broadband frequency characteristics. The capacitive transducer includes an element which has multiple kinds of cells, each cell including: a first electrode; a vibrating film including a second electrode, the second electrode being opposed to the first electrode with a gap; and a support portion that supports the vibrating film so as to form the gap. The multiple kinds of cells have different ratios of an area of one of the first electrode and the second electrode to an area of the gap when viewed from a normal direction of the vibrating film. The first electrodes or the second electrodes in the multiple kinds of cells are electrically connected together. 1. A capacitive transducer , comprising an element which has multiple kinds of cells , each cell comprising:a first electrode;a vibrating film comprising a second electrode, the second electrode being opposed to the first electrode with a gap; anda support portion that supports the vibrating film so as to form the gap,wherein the multiple kinds of cells have different ratios of an area of one of the first electrode and the second electrode to an area of the gap when viewed from a normal direction of the vibrating film, andwherein the first electrodes or the second electrodes in the multiple kinds of cells are electrically connected together.2. A capacitive transducer according to claim 1 , wherein the vibrating films of the multiple kinds of cells each have an equal spring constant.3. A capacitive transducer according to claim 1 ,wherein the vibrating films of the multiple kinds of cells each have a different spring constant, andwherein the ratio of the area of the one of the first electrode and the second electrode to the area of the gap in a cell having a large spring constant of the vibrating film is larger than the ratio of the area of the one of the first electrode and the second electrode to the area of the gap in a cell having a small spring constant of the ...

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Номер записи: 50
16-01-2014 дата публикации

Mems device

Номер: US20140016798A1
Автор: Anthony Traynor, Richard Ian Laming
Принадлежит: Wolfson Microelectronics plc

A method of fabricating a micro-electrical-mechanical system (MEMS) apparatus on a substrate comprises the steps of processing the substrate so as to fabricate an electronic circuit; depositing a first electrode that is operably coupled with the electronic circuit; depositing a membrane so that it is mechanically coupled to the first electrode; applying a sacrificial layer; depositing a structural layer and a second electrode that is operably coupled with the electronic circuit so that the sacrificial layer is disposed between the membrane and the structural layer so as to form a preliminary structure; singulating the substrate; and removing the sacrificial layer so as to form a MEMS structure, in which the step of singulating the substrate is carried out before the step of removing the sacrificial layer.

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Номер записи: 51
06-02-2014 дата публикации

Microphone and Method to Position a Membrane Between Two Backplates

Номер: US20140037121A1
Автор: Mortensen Dennis
Принадлежит: EPCOS AG

A microphone includes two backplates. A membrane is located between the two backplates. A voltage source applies a first bias voltage to the membrane and the first backplate and applies a second bias voltage to the membrane and the second backplate. A control unit adjusts the first and the second bias voltage. A method to center the membrane in a final electro-mechanic equilibrium position between the two backplates in a microphone is also disclosed. 114-. (canceled)15. A microphone comprising:first and second backplates;a membrane located between the first and second backplates;a voltage source configured to apply a first bias voltage to the membrane and the first backplate and a second bias voltage to the membrane and the second backplate; anda control unit configured to adjust the first and the second bias voltage.16. The microphone according to claim 15 , wherein the voltage source comprises a first voltage source configured to apply the first bias voltage to the membrane and the first backplate and a second voltage source configured to apply the second bias voltage to the membrane and the second backplate.17. The microphone according to claim 15 , wherein the control unit comprises an adjustable voltage pump.18. The microphone according to claim 15 , further comprising a measurement circuit configured to measure a collapse voltage between the membrane and the first backplate and a collapse voltage between the membrane and the second backplate.19. The microphone according to claim 15 , further comprising a measurement circuit configured to measure a capacitance between the membrane and the first backplate and a further capacitance between the membrane and the second backplate.20. The microphone according to claim 15 , wherein the microphone is a MEMS microphone.21. The microphone according to claim 15 ,wherein the membrane and the first and second backplates are realized on a first chip;wherein the control unit and the voltage source are integrated in an ...

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Номер записи: 52
13-02-2014 дата публикации

FLAT TYPE SPEAKER HAVING DAMPER-LEAD PLATE OF PCB VOICE COIL PLATE

Номер: US20140044287A1
Автор: Kim Dong-Man, Kwon Yong-Ji
Принадлежит: EXELWAY INC.

The present invention relates to a flat type speaker, and more particularly, to a flat type speaker having a damper-lead plate of a PCB voice coil plate, which improves the quality deterioration due to the reduction of production process and the disconnection of a lead wire, by being attached to the top of a voice coil plate, increases vibration efficiency, and eliminates the lead wire connection of the voice coil. The flat type speaker having a damper-lead plate of a PCB voice coil plate according to the present invention comprises: a pair of magnetic bodies having a magnet and a yoke formed side by side, separated at a predetermined interval; a voice coil plate inserted in the space between the magnetic bodies, and having formed thereon a voice coil with a spiral pattern printed thereon; a damper-lead plate having a first damper-lead plate and a second damper-lead plate, which are physically separated, each having +, − terminals formed on the front ends thereof, wherein the first and the second damper-lead plates are each equipped with a coil plate spline, which adheres to the upper end of the voice coil plate, and at least one wing spline having one end thereof connected to the coil plate spline and the other end connected to the + or − terminals; and a vibration plate, which vibrates from the vibration received from the voice coil plate, while being contacted to the upper end portion of the damper-lead plate. 1. A flat type speaker having damper-lead plates for a PCB voice coil plate , comprising:a pair of magnetic bodies spaced apart from each other at a specific interval, formed side by side, and each having a magnet and yorks formed therein;a voice coil plate inserted into an interval between the magnetic bodies and having a voice coil spirally patterned and printed formed therein;damper-lead plates comprising first and second damper-lead plates physically separated and having + and − terminals formed at respective front ends of the damper-lead plates, ...

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Номер записи: 53
06-03-2014 дата публикации

Vibrating panel device for electromagnetic vibrator and its manufacture method

Номер: US20140064525A1
Автор: Huang Xinmin
Принадлежит:

The present invention includes a vibrating panel device for an electromagnetic vibrator, which includes at least one vibrating panel device. The vibrating panel module includes a base, a vibrating panel and an upper suspension, wherein an inner edge and an outer edge of the upper suspension are respectively connected with the base and the vibrating panel, and form an integrated whole body. Further, two vibrating panel modules are fixedly connected in opposite directions to form the vibrating panel device. By unique structures of the vibrating panel device, when the voice coil drives the vibrating panel to actuate, shaking of the vibrating panels is offset due to interactions between a pair of the suspensions and a pair of the vibrating panels, in such a manner that the voice coil drives the vibrating panel to process vertical up-and-down stroke, so as to replace a conventional damper. 1. A vibrating panel device for an electromagnetic vibrator comprising at least one vibrating panel module , wherein said vibrating panel module comprises a base , a vibrating panel and an upper suspension , an inner edge and an outer edge of said upper suspension are respectively connected with said vibrating panel and said base , so as to form an integrated whole body , wherein two of said vibrating panel modules are fixedly connected in opposite directions to form said vibrating panel device.2. The vibrating panel device for the electromagnetic vibrator claim 1 , as recited in claim 1 , wherein said base comprises a first button and a first button hole claim 1 , wherein said first button is mounted on a first side bottom of said base claim 1 , and said first button hole is mounted on a second side bottom of said base which is opposite to the first side bottom surface for coupling with said first button claim 1 , in such a manner that when a pair of said vibrating panel modules are adopted claim 1 , by rotating a vibrating panel module thereof for 180 degrees claim 1 , said first ...

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Номер записи: 54
13-03-2014 дата публикации

Dual Single-Crystal Backplate Microphone System and Method Of Fabricating Same

Номер: US20140072152A1
Автор: Chen Li, Chen Thomas D., Yang Kuang L.
Принадлежит: InvenSense, Inc.

A dual backplate MEMS microphone system includes a flexible diaphragm sandwiched between two single-crystal silicon backplates. Such a MEMS microphone system may be formed by fabricating each backplate in a separate wafer, and then transferring one backplate from its wafer to the other wafer, to form two separate capacitors with the diaphragm. 1. A dual-backplate microphone comprising:a first backplate layer comprising a first conductive, single-crystal backplate;a second backplate layer comprising a second conductive, single-crystal backplate; anda conductive diaphragm movably sandwiched between and electrically isolated from the first and second backplates, wherein the backplates and diaphragm form a stack such that the diaphragm forms a first variable capacitor with the first backplate and a second variable capacitor with the second backplate.2. A dual-backplate microphone according to claim 1 , the microphone further comprising a first insulating layer between the first backplate layer and the diaphragm claim 1 , and a second insulating layer between the second backplate layer and the diaphragm.3. A dual-backplate microphone according to claim 1 , the second backplate layer further comprising:a second backplate contact electrically coupled to the second backplate; anda diaphragm contact electrically coupled to the diaphragm.4. A dual-backplate microphone according to claim 3 , the second backplate layer further comprising a first backplate contact electrically coupled to the first backplate.5. A dual-backplate microphone according to claim 1 , the first backplate layer further comprising a first side and a second side claim 1 , the first side facing the diaphragm claim 1 , and the second side comprising a backside cavity.6. A dual-backplate microphone according to claim 1 , the second backplate layer further comprising a first side and a second side claim 1 , the first side facing the diaphragm claim 1 , and the second side comprising a backside cavity.7. A dual ...

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Номер записи: 55
27-03-2014 дата публикации

Micro electro mechanical system (mems) microphone and fabrication method thereof

Номер: US20140084394A1
Автор: Chang Han Je
Принадлежит: Electronics and Telecommunications Research Institute ETRI

Provided is a structure for improving performance of a micro electro mechanical system (MEMS) microphone by preventing deformation from occurring due to a residual stress and a package stress of a membrane and by decreasing membrane rigidity. A MEMS microphone according to the present disclosure includes a backplate formed on a substrate, an insulating layer formed on the substrate to surround the backplate; a membrane formed to be separate from above the backplate by a predetermined interval; a membrane supporting portion configured to connect the membrane to the substrate; and a buffering portion formed in a double spring structure between the membrane and the membrane supporting portion.

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Номер записи: 56
03-04-2014 дата публикации

Electret sheet

Номер: US20140091249A1
Автор: Kazuho Uchida, Takazumi Okabayashi, Yoshiro Tajitsu
Принадлежит: KANSAI UNIVERSITY, Sekisui Chemical Co Ltd

Provided is an electret having high piezoelectric properties. An electret sheet of the invention is characterized in that it comprises a synthetic resin sheet is electrified by injecting electric charges thereinto, that the synthetic resin sheet comprises two types of synthetic resins incompatible with each other, and that these synthetic resins form a phase separated structure and are cross-linked through a polyfunctional monomer. Therefore, positive and negative charges in an apparently polarized state are present in the interfacial portions between the two types of synthetic resins incompatible with each other. By applying an external force to the electret sheet to deform it, the relative positions of these positive and negative charges are changed, and these changes cause a favorable electrical response. Therefore, the electret sheet has high piezoelectric properties.

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Номер записи: 57
03-04-2014 дата публикации

Switchable attenuation circuit for mems microphone sy

Номер: US20140093102A1
Автор: Jens Gaarde Henriksen, Olafur Mar Josefsson
Принадлежит: InvenSense Inc

A switch control circuit monitors a signal produced by a MEMS or other capacitor microphone. When a criterion is met, for example when the amplitude of the monitored signal exceeds a threshold or the monitored signal has been clipped or analysis of the monitored signal indicates clipping is imminent or likely, the switch control circuit operates one or more switches so as to selectively connect one or more capacitors to a signal line from the microphone, i.e., so as to connect a selected capacitance to the signal line to attenuate the signal from the microphone and, therefore, avoid clipping. The switches may be MOSFET, MEMS or other types of switches co-located with the microphone in a common semiconductor package. Similarly, the capacitors, a circuit that processes the signals from the microphone and/or the switch control circuit may be co-located with the microphone in a common semiconductor package.

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Номер записи: 58
10-04-2014 дата публикации

Method and apparatus for capturing and rendering an audio scene

Номер: US20140098980A1
Автор: Klaus KAETEL
Принадлежит: Individual

The method of capturing an audio scene includes acquiring sounds having first and second directivities to obtain first and second acquisition signals, respectively, the first directivity being higher than the second directivity, the steps of acquiring being performed simultaneously, and both acquisition signals together representing the audio scene; separately storing the first and second acquisition signals or mixing individual channels in the acquisition signals to obtain first and second mixed signal, respectively, and separately storing the first and second mixed signals, or transmitting the first and second mixed signals or the first and second acquisition signals to a loudspeaker setup and rendering the first mixed signal or the first acquisition signal using a loudspeaker arrangement having a first directivity and simultaneously rendering the second mixed signal or the second acquisition signal using a loudspeaker arrangement having a second directivity, the second loudspeaker directivity being lower than the first one.

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Номер записи: 59
07-01-2021 дата публикации

CAPACITIVE SENSOR

Номер: US20210000383A1
Автор: HUSSAIN Muhammad Mustafa, KHAN Sherjeel
Принадлежит:

A capacitive sensor includes a sensor body having a cavity. The sensor body is non-electrically conductive. The sensor also includes a first diaphragm having a metallic conductor layer. The first diaphragm is arranged on the sensor body on a first side of the cavity. The sensor further includes a second diaphragm having a metallic conductor layer. The second diaphragm is arranged on the sensor body on a second side of the cavity. An air gap is formed in the cavity between the first and second diaphragms, the air gap having a height equal to a height of the sensor body. 1. A capacitive sensor , comprising:a sensor body having a cavity wherein the sensor body is non-electrically conductive;a first diaphragm comprising a metallic conductor layer, wherein the first diaphragm is arranged on the sensor body on a first side of the cavity; anda second diaphragm comprising a metallic conductor layer, wherein the second diaphragm is arranged on the sensor body on a second side of the cavity wherein an air gap is formed in the cavity between the first and second diaphragms, the air gap having a height equal to a height of the sensor body.2. The capacitive sensor of claim 1 , wherein the first and second diaphragms further comprise a support layer arranged under the metallic conductor layer.3. The capacitive sensor of claim 2 , wherein the support layer comprises polyimide.4. The capacitive sensor of claim 1 , wherein the sensor body comprises a plurality of layers of double-sided tape.5. The capacitive sensor of claim 1 , wherein a first electrode electrically coupled to the first diaphragm and a second electrode electrically coupled to the second diaphragm laterally extend beyond the sensor body.6. The capacitive sensor of claim 1 , wherein the metallic conductor comprises aluminum foil.7. The capacitive sensor of claim 1 , wherein the second diaphragm has a thickness and lateral dimensions so that the second diaphragm resonates in a frequency range of 100-1200 Hz.8. The ...

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Номер записи: 60
01-01-2015 дата публикации

MEMS MICROPHONE

Номер: US20150001648A1
Автор: LEE Sang Ho, SHIM Yong Hyun
Принадлежит: BSE CO., LTD.

A micro-electro mechanical system (MEMS) microphone includes: a printed circuit substrate; a MEMS chip that is combined with the printed circuit substrate and has a MEMS inner space; and a case that is combined with the printed circuit substrate, accommodates the MEMS chip, and forms an inner space that is separated from an external space, wherein the case is a double-type case including an inner case and an outer case, a medium acoustic path space is formed between the inner case and the outer case, and the printed circuit substrate includes a substrate acoustic path that connects the medium acoustic path space to the MEMS inner space of the MEMS chip so that external sound passing through the sound hole enters the MEMS inner space of the MEMS chip after passing through the medium acoustic path space. 1. A micro-electro mechanical system (MEMS) microphone comprising:a printed circuit substrate;a MEMS chip that is combined with the printed circuit substrate and has a MEMS inner space; anda case that is combined with the printed circuit substrate, accommodates the MEMS chip, and forms an inner space that is separated from an external space,wherein the case comprises an inner case and an outer case,the inner space is formed by combining a lower edge of the inner case with the printed circuit substrate,the outer case is formed to surround the inner case at an outside of the inner space, a lower edge thereof is combined with the printed circuit substrate so that a medium acoustic path space is formed between the inner case and the outer case, and comprises a sound hole so that external sound enters the medium acoustic path space, andthe printed circuit substrate comprises a substrate acoustic path that connects the medium acoustic path space to the MEMS inner space of the MEMS chip so that the external sound that passes through the sound hole enters the MEMS inner space of the MEMS chip after passing through the medium acoustic path space.2. The MEMS microphone of claim ...

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Номер записи: 61
07-01-2021 дата публикации

Semiconductor Device, Microphone and Methods for Forming a Semiconductor Device

Номер: US20210002132A1
Автор: Kahn Markus, Kaiser Anna-Katharina, Pirk Soenke, Steinbrenner Juergen, Straeussnigg Julia-Magdalena
Принадлежит:

A semiconductor device comprises a structured metal layer. The structured metal layer lies above a semiconductor substrate. In addition, a thickness of the structured metal layer is more than 100 nm. Furthermore, the semiconductor device comprises a covering layer. The covering layer lies adjacent to at least one part of a front side of the structured metal layer and adjacent to a side wall of the structured metal layer. In addition, the covering layer comprises amorphous silicon carbide. 1. A method for forming a semiconductor device , the method comprising:forming a structured metal layer above a semiconductor substrate, wherein a thickness of the structured metal layer is more than 100 nm; andforming a covering layer after forming the structured metal layer, such that the covering layer lies adjacent to a front side of the structured metal layer and adjacent to a side wall of the structured metal layer, wherein the covering layer comprises amorphous silicon carbide doped or alloyed with chromium (Cr).2. The method as claimed in claim 1 , wherein forming the covering layer is carried out at a temperature of less than 450° C.3. The method as claimed in claim 1 , wherein the covering layer is formed by performing a plasma deposition claim 1 , and wherein the plasma deposition is carried out at a pressure of less than 70 kPa.4. The method as claimed in claim 3 , wherein helium is used as dilution gas during the plasma deposition.5. The method as claimed in claim 4 , wherein a helium concentration during the plasma deposition is more than 20%.6. The method as claimed in claim 1 , further comprising producing a membrane structure of the semiconductor device.7. The method as claimed in claim 6 , further comprising removing a sacrificial layer below the membrane structure after forming the covering layer in order to form a cutout below the membrane structure.8. The method as claimed in claim 7 , wherein the sacrificial layer is an oxide layer claim 7 , and wherein ...

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Номер записи: 62
04-01-2018 дата публикации

MEMS DEVICES AND PROCESSES

Номер: US20180002159A1
Автор: BOYD Euan James, CARGILL Scott Lyall, JENKINS Colin Robert, Laming Richard Ian
Принадлежит: Cirrus Logic International Semiconductor Ltd.

The application describes MEMS transducer having a flexible membrane and which seeks to alleviate and/or redistribute stresses within the membrane layer. A membrane having a first/active region and a second/inactive region is described. 1. A MEMS transducer comprising a membrane supported relative to a substrate , the membrane comprising a central region and plurality of stress distributing arms which extend laterally from the central region.2. A MEMS transducer as claimed in claim 1 , each stress distributing arm comprises one or more mount structures which support the membrane layer in a fixed relation to the substrate.3. A MEMS transducer as claimed in claim 2 , wherein the mount structures are provided at claim 2 , or near claim 2 , the periphery of the membrane.4. A MEMS transducer as claimed in claim 1 , wherein the stress distributing arms are disposed relative to the central region of the membrane such that the intrinsic stress distribution across the membrane varies in a controlled way.5. A MEMS transducer as claimed in claim 1 , wherein the stress distributing arms are spaced evenly around the central region of the membrane.6. A MEMS transducer as claimed in claim 1 , wherein the central region and the plurality of stress distributing arms form a first region of the membrane and wherein the membrane further comprises a second region.7. A MEMS transducer as claimed in claim 6 , wherein the transducer comprises an electrode which is coupled to the first region of the membrane.8. A MEMS transducer as claimed in claim 6 , further comprising at least one vent structure provided in the second region of the membrane.9. A MEMS transducer as claimed in claim 1 , wherein the membrane is generally square or rectangular in shape.10. A MEMS transducer as claimed in claim 2 , further comprising one or more stress redistribution structures which are provided so as to redistribute stress in the membrane arising in the region of the mount structures.11. A MEMS transducer ...

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Номер записи: 63
04-01-2018 дата публикации

MEMS DEVICE AND PROCESS

Номер: US20180002160A1
Автор: GRAHAM Clive Robert, JENKINS Colin Robert, PIECHOCINSKI Marek Sebastian
Принадлежит: Cirrus Logic International Semiconductor Ltd.

The application describes MEMS transducer structures comprising a membrane structure having a flexible membrane layer and at least one electrode layer. The electrode layer is spaced from the flexible membrane layer such that at least one air volume extends between the material of the electrode layer and the membrane layer. The electrode layer is supported relative to the flexible membrane by means of a support structure which extends between the first electrode layer and the flexible membrane layer. 1. A MEMS transducer comprising a membrane structure , the membrane structure comprising a flexible membrane layer and a first electrode layer , the first electrode layer being supported relative to the flexible membrane layer so as to be spaced from the flexible membrane layer.2. A MEMS transducer as claimed in claim 1 , wherein at least one air volume extends between the material of the first electrode layer and the membrane layer.3. A MEMS transducer as claimed in claim 1 , wherein the membrane structure comprises a second electrode layer claim 1 , said second electrode layer being disposed on the opposite side of the flexible membrane to the first electrode.4. A MEMS transducer as claimed in claim 3 , wherein the second electrode layer is supported relative to the flexible membrane layer so as to be spaced from the flexible membrane layer.5. A MEMS transducer as claimed in claim 1 , wherein the first electrode layer comprises a continuous sheet of material.6. A MEMS transducer as claimed in claim 1 , wherein the first electrode layer comprises one or more openings.7. MEMS transducer as claimed in claim 1 , wherein the first electrode layer comprises a lattice structure.8. A MEMS transducer as claimed in claim 1 , wherein the first electrode layer is supported relative to the flexible membrane by means of a support structure which extends between the first electrode layer and the flexible membrane layer.9. A MEMS transducer as claimed in claim 3 , wherein the second ...

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Номер записи: 64
04-01-2018 дата публикации

Mems device and process

Номер: US20180002161A1
Автор: Clive Robert Graham, Colin Robert Jenkins, Scott Lyall Cargill
Принадлежит: Cirrus Logic International Semiconductor Ltd

The present application describes MEMS transducer having a membrane and a membrane electrode. The membrane and membrane electrode form a two-layer structure. The membrane electrode is in the form of a lattice of conductive material. The pitch of the lattice and/or the size of the openings varies from a central region of the membrane electrode to a region laterally outside the central region.

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Номер записи: 65
04-01-2018 дата публикации

MICROMECHANICAL STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Номер: US20180002167A1
Автор: Denifl Guenter, Frischmuth Tobias, Grille Thomas, Hedenig Ursula, Kahn Markus, Maurer Daniel, Schmid Ulrich, Schneider Michael
Принадлежит:

A micromechanical structure in accordance with various embodiments may include: a substrate; and a functional structure arranged at the substrate; wherein the functional structure includes a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region; and wherein at least a section of the functional region has an elastic modulus in the range from about 5 GPa to about 70 GPa. 1. A micromechanical structure , comprising:a substrate; anda functional structure arranged at the substrate;wherein the functional structure comprises a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region; andwherein at least a section of the functional region has an elastic modulus in the range from about 5 GPa to about 70 GPa.2. The micromechanical structure of claim 1 , wherein the at least a section comprises a material having a density in the range from about 1 g/cmto about 16 g/cm.3. The micromechanical structure of claim 1 , wherein the at least a section comprises a material having a coefficient of thermal expansion (CTE) in the range from about 1·10/Kelvin to about 6·10/Kelvin.4. The micromechanical structure of claim 1 , wherein the at least a section comprises a compound material comprising at least two elements.5. The micromechanical structure of claim 1 , wherein the at least a section comprises amorphous hydrogenated silicon carbide (a-SiC:H).6. The micromechanical structure of claim 5 , wherein the a-SiC:H has a carbon content in the range from about 1 at.-% to about 99 at.-%.7. The micromechanical structure of claim 5 , wherein the a-SiC:H has a hydrogen content in the range from about 1 at.-% to about 66 at.-%.8. The micromechanical structure of claim 1 , wherein the at least a section comprises amorphous hydrogenated carbon (a-C:H).9. The micromechanical structure of claim 1 , wherein the at least a section comprises a base material that is ...

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Номер записи: 66
04-01-2018 дата публикации

MEMS DEVICES AND PROCESSES

Номер: US20180002168A1
Автор: BOYD Euan James, CARGILL Scott Lyall, JENKINS Colin Robert, Laming Richard Ian
Принадлежит: Cirrus Logic International Semiconductor Ltd.

The application describes MEMS transducer having a flexible membrane and which seeks to alleviate and/or redistribute stresses within the membrane layer. A membrane having a first/active region and a second/inactive region is described. 1. A MEMS transducer comprising a membrane and at least one mount structure for supporting the membrane relative to a substrate to provide a flexible membrane , and further comprising one or more stress diffusing structures provided in said membrane so as to diffuse stress in the region of the mount structure.2. A MEMS transducer as claimed in claim 1 , wherein the stress diffusing structure comprises a slit which extends through the membrane.3. A MEMS transducer as claimed in claim 2 , wherein the slit is curved or arcuate in form.4. A MEMS transducer as claimed in claim 2 , wherein the slit is C-shaped or U-shaped.5. A MEMS transducer as claimed in claim 1 , the membrane comprising a central region and plurality of stress distributing arms which extend laterally from the central region claim 1 , wherein each stress distributing arm comprises at least one of said at least one mount structures.6. (canceled)7. A MEMS transducer as claimed in claim 1 , wherein a plurality of said mount structures are provided at claim 1 , or near claim 1 , the periphery of the membrane.8. (canceled)9. A MEMS transducer as claimed in claim 5 , wherein the stress distributing arms are spaced evenly around the central region of the membrane.10. A MEMS transducer as claimed in claim 5 , wherein the central region and the plurality of stress distributing arms form a first region of the membrane and wherein the membrane further comprises a second region.11. A MEMS transducer as claimed in claim 10 , wherein the transducer comprises an electrode which is coupled to the first region of the membrane.12. A MEMS transducer as claimed in claim 10 , further comprising at least one vent structure provided in the second region of the membrane.13. A MEMS transducer as ...

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Номер записи: 67
02-01-2020 дата публикации

MEMS Package and Method of Manufacturing the Same

Номер: US20200002160A1
Автор: Hayashi Hironobu, Kobayashi Toyotaka, Shiraishi Masashi
Принадлежит:

A MEMS package has a MEMS chip, and a package substrate which the MEMS chip is adhered. The MEMS chip has an element substrate which a movable element is formed. The MEMS package has a plurality of bonding bumps adhered to both of an opposing surface, of the element substrate and the package substrate. The MEMS package has unevenly arranged structure which all the plurality of bonding bumps are unevenly arranged in a part of the opposing surface. 1. A MEMS package comprising:a MEMS chip, and a package substrate which the MEMS chip is adhered;wherein the MEMS chip comprises an element substrate which a movable element is formed,wherein the MEMS package comprises a plurality of bonding bumps adhered to both an opposing surface, of the element substrate, which opposes the package substrate and the package substrate,wherein the MEMS package comprises an unevenly arranged structure which all the plurality of bonding bumps are unevenly arranged in a part of the opposing surface.2. The MEMS package according to claim 1 ,wherein the opposing surface comprises a boding area, which all the plurality of bonding bumps are arranged, and a non-bonding area, which the bonding bumps are not arranged, the size of the non-bonding area is larger than the size of the boding area.3. The MEMS package according to claim 1 ,wherein the opposing surface comprises a boding area, which all the plurality of bonding bumps are arranged, and a non-bonding area, which the bonding bumps are not arranged, the size of the non-bonding area is larger than the size of the boding area,wherein the MEMS package further comprises a dummy bump which is arranged in the non-bonding area, and which is adhered to the opposing surface and is not adhered to the package substrate.4. The MEMS package according to claim 2 ,wherein the element substrate is formed in a rectangular-shape in a plan view,wherein the bonding area is assigned to an area including only one of the four corner parts of the opposing surface.5. ...

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Номер записи: 68
01-01-2015 дата публикации

CONDENSER MICROPHONE

Номер: US20150003645A1
Автор: AKINO Hiroshi
Принадлежит: KABUSHIKI KAISHA AUDIO-TECHNICA

A handheld condenser microphone is provided with a condenser microphone unit having two unidirectional condenser elements. A conductive fabric is put between a lock ring and the second condenser element , when an acoustic-electric transducer is fixed inside a unit case by fastening force of the lock ring 1. A handheld condenser microphone comprising:a microphone unit having an electrostatic acoustic-electric transducer inside a unit case;a unit supporting portion having a cylinder to which the unit case is detachably coupled and a circuit board housed in the cylinder for outputting a sound signal, the unit supporting portion being supported by a microphone chassis, first and second condenser elements each of which includes a diaphragm stretching over a diaphragm supporting member and a fixed pole having acoustic holes, the diaphragm and the fixed pole being disposed to face each other via a spacer ring; and', 'insulation bases each of which has an opening to contain an acoustic resistance material at a substantially central portion, the insulation bases being disposed between the respective fixed poles of the first and second condenser elements,, 'wherein the acoustic-electric transducer comprisesa conductive fabric having both conductivity and elasticity is provided over an outer face of one of the diaphragm supporting members supporting a diaphragm which serves as a rear acoustic terminal,a relay rod which electrically connects the one of the diaphragm supporting members to the circuit board is provided in the unit supporting portion, andwhen the unit case is connected to the cylinder, the relay rod contacts the conductive fabric so that the one of the diaphragm supporting members is electrically connected to the circuit board.2. The condenser microphone according to claim 1 , further comprising a lock ring which is mounted inside the unit case and which presses the acoustic-electric transducer from the side of the one of the diaphragm supporting members to fix ...

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Номер записи: 69
01-01-2015 дата публикации

ACOUSTIC GENERATOR, ACOUSTIC GENERATION DEVICE, AND ELECTRONIC DEVICE

Номер: US20150003646A1
Автор: KAMITANI Satoru, Nakamura Shigenobu
Принадлежит: KYOCERA CORPORATION

An object is to provide a preferable frequency characteristic of a sound pressure. For achieving the object, an acoustic generator according to an embodiment includes a piezoelectric element (exciter), a flat vibration plate, and a frame body. The piezoelectric element receives input of an electric signal and vibrates. The piezoelectric element is attached to the vibration plate, and the vibration plate vibrates together with the piezoelectric element with the vibration of the piezoelectric element. The frame body is provided on an outer circumferential portion of the vibration plate. Corners on an inner circumferential surface of the frame body include at least curved surfaces, and at least one of the corners has a shape different from the shape of the other corners. 1. An acoustic generator comprising:an exciter that receives input of an electric signal and vibrates;a vibration plate to which the exciter is attached and that vibrates together with the exciter with vibration of the exciter; anda frame body that is provided on an outer circumferential portion of the vibration plate, whereincorners on an inner circumferential surface of the frame body include at least curved surfaces, andat least one of the corners has a shape different from the shape of the other corners.2. The acoustic generator according to claim 1 , whereinthe corners have R shapes with circular arc curves when viewed in a plan view of the flame body, anda curvature of at least one of the corners is different from the curvature of the other corners.3. The acoustic generator according to claim 1 , wherein at least one of the corners does not have an R shape with a quarter circular arc curve.4. The acoustic generator according to claim 1 , whereinthe frame body supports the vibration plate by holding the vibration plate between two frame members,a curvature of at least one of the corners in one of the frame members is different from the curvature of the corresponding corner in the other frame ...

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Номер записи: 70
01-01-2015 дата публикации

Electronic device with large back volume for electromechanical transducer

Номер: US20150003659A1
Автор: Theuss Horst
Принадлежит:

An electronic device comprising a substrate, a cover delimiting at least a part of a main surface of the substrate to thereby form a cover-substrate arrangement enclosing a hollow space and having a through hole, an electroacoustic transducer configured for converting between an electric signal and an acoustic signal and being mounted on the substrate acoustically coupled with the hollow space in such a way that the hollow space constitutes a back volume of the electroacoustic transducer, wherein the electroacoustic transducer provides an acoustical coupling between the hollow space and an exterior of the cover-substrate arrangement via the through hole, an electronic chip mounted within the cover-substrate arrangement and electrically coupled with the electroacoustic transducer for communicating electric signals between the electronic chip and the electroacoustic transducer, and at least one electronic member mounted on the substrate within the cover-substrate arrangement and configured for providing an electronic function. 1. An electronic device , comprising:a substrate;a cover delimiting at least a part of a main surface of the substrate from an exterior to thereby form a cover-substrate arrangement enclosing a hollow space and having a through hole;an electroacoustic transducer configured for converting between an acoustic signal and an electric signal and being mounted on the substrate acoustically coupled to the hollow space in such a way that the hollow space constitutes a back volume of the electroacoustic transducer, wherein the electroacoustic transducer provides an acoustical coupling between the hollow space and an exterior of the cover-substrate arrangement via the through hole;an electronic chip mounted within the cover-substrate arrangement and electrically coupled with the electroacoustic transducer for communicating electric signals between the electronic chip and the electroacoustic transducer; andat least one electronic member mounted on the ...

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Номер записи: 71
01-01-2015 дата публикации

Systems and methods for using a speaker as a microphone in a mobile device

Номер: US20150003660A9
Автор: Eric Swanson, John L. Melanson
Принадлежит: Cirrus Logic Inc

In accordance with methods and systems of the present disclosure, a mobile device may include an enclosure adapted such that the enclosure is readily transported by a user of the mobile device, a speaker associated with the enclosure for generating sound, and a controller within the enclosure, communicatively coupled to the speaker. The controller may be configured to receive a signal from the speaker, the signal induced at least in part by sound incident on the speaker other than sound generated by the speaker and process the signal.

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Номер записи: 72
13-01-2022 дата публикации

Sound producing package structure and manufacturing method thereof

Номер: US20220009768A1
Автор: Chiung C. Lo, Jemm Yue Liang
Принадлежит: Xmems Labs Inc

A sound producing package structure includes a plurality of chips disposed within a cavity. The chips includes a first chip and a second chip, the first chip includes a first sound producing membrane and a first actuator attached to the first sound producing membrane, and a second chip includes a second sound producing membrane and a second actuator attached to the second sound producing membrane. The first sound producing membrane and the second sound producing membrane are actuated toward a center of the cavity in a synchronous fashion so as to produce a sound pressure.

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Номер записи: 73
13-01-2022 дата публикации

MEMS SPEAKER

Номер: US20220014853A1
Автор: HATIPOGLU Gokhan, HRUDEY Peter C., ILLKORUR Onur I., VIEITES Pablo Seoane, Wilk Christopher
Принадлежит:

Aspects of the subject technology relate to electronic devices having speakers such as microelectromechanical systems (MEMS) speakers. A MEMS speaker can include an electrostatically driven, corrugated MEMS structure to move air without a magnet, coil, or traditional speaker membrane, and thus provide a low-power, compact speaker with a large acoustically active area in a small volume. Neighboring folds in the corrugated MEMS structure may form pairs of MEMS electrodes that can be pushed together and/or pulled apart to deform the MEMS structure in a breathing motion that generates pressure differentials on opposing sides of the corrugated MEMS structure to generate sound. Additional modes of operation are described. 1. A speaker , comprising:a front volume;a back volume; anda corrugated microelectromechanical systems (MEMS) structure disposed between the front volume and the back volume.2. The speaker of claim 1 , wherein the corrugated MEMS structure comprises a single contiguous structure that extends claim 1 , in a first dimension claim 1 , from a first edge to a second edge claim 1 , and includes a plurality of alternating folds disposed between the first edge and the second edge.3. The speaker of claim 2 , wherein the corrugated MEMS structure comprises a plurality of MEMS electrodes claim 2 , each forming a part of the single contiguous structure claim 2 , the part extending in a second dimension perpendicular to the first dimension claim 2 , between a corresponding pair of the plurality of alternating folds.4. The speaker of claim 3 , wherein first edge and second edge are fixed.5. The speaker of claim 4 , wherein the first edge and the second edge are each fixed to a corresponding resilient connector.6. The speaker of claim 3 , wherein the first edge and the second edge are floating edges.7. The speaker of claim 6 , further comprising at least one anchor beam that extends from one of the plurality of alternating folds to a support structure.8. The speaker of ...

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Номер записи: 74
05-01-2017 дата публикации

MICROELECTROMECHANICAL MICROPHONE

Номер: US20170006368A1
Автор: BARBARA Paul Anthony, Brioschi Roberto, Formosa Kevin, Gritti Alex
Принадлежит:

A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip. 1. A microelectromechanical microphone comprising:a substrate;a sensor chip bonded to the substrate and integrating a microelectromechanical acoustic transducer; anda control chip bonded to the substrate and operatively coupled to the sensor chip, the sensor chip having a first portion that is overlying and bonded to the control chip.2. The microelectromechanical microphone according to claim 1 , wherein the control chip has a first face claim 1 , wherein the first portion of the sensor chip is bonded to the first face of the control chip claim 1 , wherein the acoustic transducer includes a transduction member acoustically communicating with a sound port in the substrate.3. The microelectromechanical microphone according to claim 2 , wherein the substrate includes an assembly base claim 2 , the sensor chip has a second portion coupled to the base.4. The microelectromechanical microphone according to claim 3 , comprising an adhesive layer that is partially on the base and partially on the first face of the control chip along a perimeter of the sensor chip claim 3 , the sensor chip being bonded to the base and to the control chip through the adhesive layer.5. The microelectromechanical microphone according to claim 3 , wherein the base has a first thickness and the control chip has a second thickness that is substantially the same thickness as the first thickness.6. The microelectromechanical microphone according to claim 3 , wherein the base extends around the sound port.7. The ...

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Номер записи: 75
05-01-2017 дата публикации

Mems dual comb drive

Номер: US20170006386A1
Автор: Mordehai MARGALIT
Принадлежит: EMPIRE TECHNOLOGY DEVELOPMENT LLC

Techniques described herein generally include methods and systems related to a speaker device comprises a planar oscillation element configured to generate an ultrasonic acoustic signal, a shutter element, a first comb drive, and a second comb drive. The shutter element is configured to cover an opening that is positioned to receive the ultrasonic acoustic signal to modulate the ultrasonic acoustic signal such that an audio signal is generated. The first comb drive is coupled to the shutter element and configured to displace the shutter element in a first direction and the second comb drive is coupled to the shutter element and configured to displace the shutter element in a second direction.

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Номер записи: 76
04-01-2018 дата публикации

Impedance Circuit for a Charge Pump Arrangement and Charge Pump Arrangement

Номер: US20180006553A1
Автор: HANZLIK Tomasz, Rocca Gino, Sassene Daifi Haoues
Принадлежит:

An impedance circuit for a charge pump arrangement and a charge pump arrangement are disclosed. In an embodiment, the impedance circuit includes a first current mirror circuit with a first bias serving as a current input terminal, a first output serving as a current output terminal and a first input for coupling with a pre-selected potential. The impedance circuit further includes a first charge pump for biasing the first current mirror circuit with a first reference current, wherein the first charge pump includes a first biasing output coupled with the first bias of the first current mirror circuit. 111-. (canceled)12. An impedance circuit for a charge pump arrangement , the impedance circuit comprising:a first current mirror circuit with a first bias serving as a current input terminal, a first output serving as a current output terminal and a first input for coupling with a pre-selected potential;a first charge pump for biasing the first current mirror circuit with a first reference current, wherein the first charge pump comprises a first biasing output coupled with the first bias of the first current mirror circuit;a second current mirror circuit with a second bias serving as a current input terminal, a second output serving as a current output terminal and a second input for coupling with the pre-selected potential; anda second charge pump for biasing the second current mirror circuit with a second reference current, wherein the second charge pump comprises a second biasing output coupled with the second bias of the second current mirror circuit.13. The impedance circuit according to claim 12 , wherein the first charge pump is configured to provide the first reference current with an absolute value equal to or smaller than 1 nA for biasing the first current mirror circuit.14. The impedance circuit according to claim 12 , wherein the second charge pump is configured to provide the second reference current with an absolute value equal to or smaller than 1 nA for ...

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Номер записи: 77
07-01-2016 дата публикации

ELECTROSTATIC MEMBRANE PUMP/TRANSDUCER AND METHODS TO MAKE AND USE SAME

Номер: US20160007124A1
Автор: Pinkerton Joseph F.
Принадлежит: CLEAN ENERGY LABS, LLC

An improved electrostatic membrane pump/transducer having an array of electrostatic membrane pump transducers that utilize a venturi channel. The electrically conductive membrane of the electrostatic membrane pump transducers can be a polymer membrane coated with a conductive coating. The electrostatic membrane pump transducers can be optionally controlled such that one set is out of phase with another set. 1. A device comprising an electrostatic membrane-based venturi pump system , wherein the electrostatic membrane-based venturi pump system comprises an array of electrostatic membrane pump transducers , wherein(a) the array of electrostatic membrane pump transducers comprise a first set comprising one or more first electrostatic membrane pump transducers,(b) the array of electrostatic membrane pump transducers comprise a second set comprising one or more second electrostatic membrane pump transducers, and (i) a chamber,', '(ii) an electrically conductive solid stator having an electrically conductive solid stator hole, wherein (A) the electrically conductive solid stator bounds part of the chamber and (B) is operable to allow fluid to flow into and out of the chamber through the electrically conductive solid stator hole,', '(iii) a venturi exit plate having a venturi exit plate hole, wherein (A) the venturi exit plate is located outside the chamber and (B) the venturi exit plate is operable to allow the fluid to flow out of the electrostatic membrane pump transducer through the venturi exit plate hole,', '(iv) a spacer located between the electrically conductive solid stator and the venturi exit plate to create a space therebetween,', '(v) a venturi channel located outside the first chamber, wherein the venturi channel is operable to allow fluid to flow from outside the first electrostatic membrane pump transducer to the space between the electrically conductive solid stator and the venturi exit plate and exit through the venturi exit plate hole,', '(vi) a first ...

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Номер записи: 78
07-01-2021 дата публикации

SMART SENSOR FOR ALWAYS-ON OPERATION

Номер: US20210006895A1
Автор: Assaderaghi Fariborz, CORNELIUS Peter, Khenkin Aleksey S.
Принадлежит:

Smart sensors comprising one or more microelectromechanical systems (MEMS) sensors and a digital signal processor (DSP) in a sensor package are described. An exemplary smart sensor can comprise a MEMS acoustic sensor or microphone and a DSP housed in a package or enclosure comprising a substrate and a lid and a package substrate that defines a back cavity for the MEMS acoustic sensor or microphone. Provided implementations can also comprise a MEMS motion sensor housed in the package or enclosure. Embodiments of the subject disclosure can provide improved power management and battery life from a single charge by intelligently responding to trigger events or wake events while also providing an always on sensor that persistently detects the trigger events or wake events. In addition, various physical configurations of smart sensors and MEMS sensor or microphone packages are described. 1. A sensor , comprising:a microelectromechanical systems (MEMS) acoustic sensor configured to generate an audio signal and associated with a back cavity;{'sup': '2', 'a digital signal processor (DSP) located in the back cavity and configured to generate a control signal, comprising at least one of an interrupt control signal or an Inter-Integrated Circuit (IC) signal and separate from the audio signal, for a system processor external to the MEMS acoustic sensor, in response to receiving a signal from the MEMS acoustic sensor, wherein the control signal is based at least in part on the audio signal, and wherein the DSP located in the back cavity is configured to generate a wake-up signal in response to processing the signal from the MEMS acoustic sensor; and'}a package comprising a lid and a package substrate, wherein the package has a port adapted to receive acoustic waves, and wherein the package houses the MEMS acoustic sensor and defines the back cavity associated with the MEMS acoustic sensor.2. The sensor of claim 1 , wherein the DSP located in the back cavity comprises a wake-up ...

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Номер записи: 79
07-01-2021 дата публикации

MEMS Microphone

Номер: US20210006908A1
Автор: Cettl Bernd, Straeussnigg Dietmar
Принадлежит:

Embodiments provide a MEMS microphone comprising a MEMS microphone unit and a modulator connected downstream the MEMS microphone unit. The modulator is configured to apply a defined phase shift to a signal to be modulated. 1. A system comprising: a subtractor configured to receive an input signal at a first input, and configured to subtract a signal at a second input from the input signal;', 'a loop filter having an input coupled to an output of the subtractor;', 'a phase shifter having an input coupled to an output of the loop filter; and', 'a quantizer having an input coupled to the output of the phase shifter and an output coupled to the second input of the subtractor., 'at least one modulator comprising'}2. The system of claim 1 , wherein the phase shifter comprises:a delay block having an input coupled to the output of the loop filter;a first combiner having a first input coupled to the output of the loop filter and a second input coupled to an output of the delay block;a digital gain unit having an input coupled to an output of the first combiner; anda second combiner having a first input coupled to an output of the digital gain unit, a second input coupled to the output of the delay block and an output coupled to an output of the phase shifter.3. The system of claim 2 , whereinthe at least one modulator comprises a first modulator and a second modulator; anda gain of the digital gain unit of the first modulator is different from a gain of the digital gain unit of the second modulator.4. The system of claim 3 , further comprising:a first MEMS microphone having an output coupled to the first modulator; anda second MEMS microphone having an output coupled to the second modulator.5. The system of claim 1 , wherein the phase shifter is configured to apply a phase shift that reduces limit cycles of the at least one modulator.6. A modulator comprising:a subtractor configured to receive an input signal at a first input, and configured to subtract a signal at a second ...

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Номер записи: 80
04-01-2018 дата публикации

MEMS DEVICE AND PROCESS

Номер: US20180007473A1
Автор: CARGILL Scott Lyall
Принадлежит: Cirrus Logic International Semiconductor Ltd.

The application describes MEMS transducers comprising a flexible membrane supported at a supporting edge relative to a substrate and further comprising one or more unbound edges. The shape of the unbound edge is selected so that the flexible membrane tends to bend along more than one bend axis in the region of the supporting edge. 1. A MEMS transducer comprising a flexible membrane supported at a supporting edge relative to a substrate , the flexible membrane comprising a first unbound edge , wherein the first unbound edge traces a path from a first endpoint at , or near , a first end of the supporting edge ,wherein a first path segment is defined between first and second path points on the first unbound edge,and wherein the first path segment traces a path which varies in distance from a straight line path between the first and second path points, the first path segment comprising at least two bendpoints at which the flexible membrane tends to bend in response to a given deflection of the flexible membrane.2. A MEMS transducer as claimed in claim 1 , comprising a second unbound edge which traces a path from a first endpoint at claim 1 , or near claim 1 , a second end of the supporting edge claim 1 ,wherein a second path segment of the second unbound edge is defined between first and second path points on the second unbound edge,and wherein the second path segment traces a path which varies in distance from a straight line path between the first and second path points, the second path segment comprising one or more bendpoints at which the flexible membrane tends to bend in response to a given deflection of the flexible membrane.3. A MEMS transducer as claimed in claim 2 , wherein a bendpoint of the first segment corresponds to a bendpoint of the second segment claim 2 , said corresponding bendpoints forming a pair of bendpoints.4. A MEMS transducer as claimed in claim 3 , wherein a line intersecting the pair of bendpoints defines a bend axis of the flexible membrane ...

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Номер записи: 81
04-01-2018 дата публикации

MEMS DEVICES AND PROCESSES

Номер: US20180007474A1
Автор: BOYD Euan James, CARGILL Scott Lyall, JENKINS Colin Robert
Принадлежит: Cirrus Logic International Semiconductor Ltd.

A MEMS transducer structure comprises a substrate comprising a cavity. A membrane layer is supported relative to the substrate to provide a flexible membrane. A peripheral edge of the cavity defines at least one perimeter region that is convex with reference to the center of the cavity. The peripheral edge of the cavity may further define at least one perimeter region that is concave with reference to the center of the cavity. 1. A MEMS transducer structure comprising:a substrate, the substrate comprising a cavity;a membrane layer supported relative to the substrate to provide a flexible membrane;wherein a peripheral edge of the cavity defines at least one perimeter region that is convex with reference to the center of the cavity.2. A MEMS transducer as claimed in claim 1 , wherein the peripheral edge of the cavity further defines at least one perimeter region that is concave with reference to the center of the cavity.3. A MEMS transducer as claimed in claim 1 , wherein the membrane comprises an active central region and a plurality of support arms which extend laterally from the active central region for supporting the active central region of the membrane.4. A MEMS transducer as claimed in claim 3 , wherein a convex portion of the peripheral edge of the cavity underlies a center region of a support arm of the membrane.5. A MEMS transducer as claimed in claim 4 , wherein the apex of a convex portion substantially underlies the center of a supporting arm in a width wise direction.6. A MEMS transducer as claimed in claim 3 , wherein a concave portion of the peripheral edge of the cavity underlies an edge of a support arm.7. A MEMS transducer as claimed in claim 3 , wherein a convex portion is positioned around the periphery of the cavity such that claim 3 , upon deflection of the flexible membrane during use towards the cavity claim 3 , the flexible membrane makes contact with the convex portion of the peripheral edge of the cavity prior to another portion of the ...

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Номер записи: 82
02-01-2020 дата публикации

SPEAKER STRUCTURAL LAYER AND DISPLAY DEVICE

Номер: US20200007980A1
Автор: Fang Jian-Shuen, Hsu Li-Chih, HSUEH Chih-Ling
Принадлежит: AU OPTRONICS CORPORATION

A speaker structural layer includes speaker units arranged in array. At least one of the speaker units includes a first electrode, a second electrode and a diaphragm. The second electrode is opposite to the first electrode. The diaphragm is disposed between the first electrode and the second electrode. 1. A speaker structural layer , comprising:a plurality of speaker units arranged in array, wherein at least one of the speaker units comprises:a first electrode;a second electrode, disposed opposite to the first electrode; anda diaphragm, disposed between the first electrode and the second electrode.2. The speaker structural layer as claimed in claim 1 , wherein the diaphragms of the speaker units are connected to each other to form a diaphragm layer.3. The speaker structural layer as claimed in claim 2 , further comprising a frame at least disposed to opposite two sides of the diaphragm layer.4. The speaker structural layer as claimed in claim 2 , further comprising a carrier substrate disposed below the speaker units claim 2 , wherein the first electrodes are located between the diaphragm layer and the carrier substrate.5. The speaker structural layer as claimed in claim 4 , further comprising a support structure disposed on the carrier substrate and located between the carrier substrate and the diaphragm layer.6. The speaker structural layer as claimed in claim 1 , wherein the diaphragms of the speaker units are disposed separately from each other.7. The speaker structural layer as claimed in claim 6 , further comprising a carrier substrate disposed below the speaker units claim 6 , wherein the first electrodes are located between the diaphragms and the carrier substrate.8. The speaker structural layer as claimed in claim 7 , further comprising a support structure disposed on the carrier substrate and located between the carrier substrate and the diaphragms.9. The speaker structural layer as claimed in claim 6 , wherein in each of the speaker units claim 6 , the ...

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Номер записи: 83
02-01-2020 дата публикации

ACOUSTIC MICROELECTRONIC DEVICE

Номер: US20200007991A1
Автор: COUTIER Caroline, FANGET Stephane, ROBERT Philippe
Принадлежит: Commissariat A L'Energie Atomique Et Aux Energies Alternatives

An acoustic microelectronic device includes a support, a set of at least one membrane suspended on a face of the support above a cavity by an anchoring zone, and at least one acoustic insulation trench arranged adjacent to the membrane. The device includes at least one bridge connecting the portions of two opposite edges of the trench and located overhanging at least one zone of the trench so as to form, in the zone of the trench, an acoustic insulation box below the bridge. 1. An acoustic-type microelectronic device comprising a support , a set of at least one membrane suspended on a face of the support above a cavity by an anchoring zone , and at least one acoustic insulation trench arranged adjacent to the membrane , the device comprising at least one bridge connecting the portions of two edges opposite the trench in order to connect the support to the anchoring zone of the membrane , the bridge being located overhanging at least one zone of the trench so as to form , in said zone of the trench , an acoustic insulation box below the bridge.2. The device according to claim 1 , wherein the trench forms a closed edge around the set of at least one membrane.3. The device according to claim 1 , wherein the bridge is overhanging only one portion of the trench.4. The device according to claim 1 , comprising at least one electrical connection element passing over the bridge.5. The device according to claim 4 , comprising at least one electrode above the membrane and in electrical continuity with one of the at least one connection element.6. The device according to claim 5 , comprising a stack comprising a first electrode in contact with an upper face of the membrane claim 5 , a piezoelectric layer and a second electrode claim 5 , the first electrode being in electrical continuity with a first connection element claim 5 , the second electrode being in electrical continuity with a second connection element.7. The device according to claim 1 , wherein the set comprises a ...

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Номер записи: 84
02-01-2020 дата публикации

HIGH PERFORMANCE SEALED-GAP CAPACITIVE MICROPHONE WITH VARIOUS GAP GEOMETRIES

Номер: US20200007992A1
Автор: Atalar Abdullah, Koymen Hayrettin, Koymen Itir, Tasdelen Akif Sinan, Yilmaz Mehmet
Принадлежит:

Some preferred embodiments include a microphone system for receiving sound waves, the microphone including a back plate, a radiation plate, first and second electrodes, first and second insulator layers, a power source and a microphone controller. The radiation plate is clamped to the back plate so that there is a hermetically sealed regular convex polygon-, ellipse-, or regular convex elliptic polygon-shaped gap between the radiation plate and the back plate. The first electrode is fixedly attached to a side of the back plate proximate to the gap. The second electrode is fixedly attached to a side of the radiation plate. The insulator layers are attached to the back plate and/or the radiation plate, on respective gap sides thereof, so that the insulator layers are between the electrodes. The microphone controller is configured to use the power source to drive the microphone at a selected operating point comprising normalized static mechanical force, bias voltage, and relative bias voltage level. Relevant dimensions of the gap, and a thickness of the radiation plate, are determined using the selected operating point so that a sensitivity of the microphone at the selected operating point is an optimum sensitivity for the selected operating point. 2. The microphone system of claim 1 , wherein the gap comprises a hole machined into the substrate claim 1 , and the back plate comprises a portion of the substrate forming a floor of the gap.4. The microphone system of claim 1 ,wherein the first electrode covers at least 80% of the area of the back plate on the side of the back plate proximate to the gap, andwherein the second electrode covers at least 80% of the area of the radiation plate on the side of the radiation plate proximate to the gap.5. The microphone system of claim 1 , wherein the sound waves are human-audible and the gap contains a vacuum.6. The microphone system of claim 1 , wherein both insulator layers are fixedly coupled to the radiation plate claim 1 , ...

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Номер записи: 85
12-01-2017 дата публикации

MICROPHONE AND CONTROL METHOD THEREFOR

Номер: US20170008759A1
Автор: Yoo Ilseon
Принадлежит:

A microphone includes a case including a sound hole; a sound element which outputs a sound output signal based on a sound signal that enters the case through the sound hole; and a semiconductor chip connected to the sound element and configured to adjust an applied voltage which is applied to the sound element in accordance with the sound output signal. A rigidity of a vibration layer of the sound element is adjusted in accordance with the applied voltage. 1. A microphone , comprising:a case including a sound hole;a sound element which outputs a sound output signal based on a sound signal that enters the case through the sound hole; anda semiconductor chip connected to the sound element and configured to adjust an applied voltage which is applied to the sound element in accordance with the sound output signal;wherein a rigidity of a vibration layer of the sound element is adjusted in accordance with the applied voltage.2. The microphone of claim 1 , wherein:the semiconductor chip measures an output sound pressure of the sound output signal and compares the output sound pressure and a predetermined set sound pressure to adjust the applied voltage.3. The microphone of claim 2 , wherein:the semiconductor chip lowers the applied voltage when the output sound pressure is equal to or higher than the set sound pressure.4. The microphone of claim 1 , wherein:the sound element includes:a substrate;a vibration layer disposed on the substrate; anda fixed layer which is disposed to be spaced apart from the vibration layer by a predetermined interval.5. The microphone of claim 4 , wherein:the semiconductor chip applies the applied voltage between the vibration layer and the fixed layer.6. The microphone of claim 5 , wherein:the applied voltage is inversely proportional to the rigidity of the vibration layer.7. The microphone of claim 5 , wherein:the applied voltage is proportional to the output sound pressure of the sound output signal.8. The microphone of claim 1 , wherein:the ...

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Номер записи: 86
11-01-2018 дата публикации

STRAIN AND PRESSURE SENSING DEVICE, MICROPHONE, METHOD FOR MANUFACTURING STRAIN AND PRESSURE SENSING DEVICE, AND METHOD FOR MANUFACTURING MICROPHONE

Номер: US20180009656A1
Автор: Fuji Yoshihiko, FUKUZAWA Hideaki, Hara Michiko, HORI Akio, Kojima Akihiro, OHGURO Tatsuya, Sugizaki Yoshiaki, Takayanagi Mariko
Принадлежит: KABUSHIKI KAISHA TOSHIBA

According to one embodiment, a strain and pressure sensing device includes a semiconductor circuit unit and a sensing unit. The semiconductor circuit unit includes a semiconductor substrate and a transistor. The transistor is provided on a semiconductor substrate. The sensing unit is provided on the semiconductor circuit unit, and has space and non-space portions. The non-space portion is juxtaposed with the space portion. The sensing unit further includes a movable beam, a strain sensing element unit, and first and second buried interconnects. The movable beam has fixed and movable portions, and includes first and second interconnect layers. The fixed portion is fixed to the non-space portion. The movable portion is separated from the transistor and extends from the fixed portion into the space portion. The strain sensing element unit is fixed to the movable portion. The first and second buried interconnects are provided in the non-space portion. 1. (canceled)2. A sensor , comprising:a supporter;a beam including a movable portion, an end of the movable portion being fixed to the supporter, the end extending in a first direction; anda sensing element fixed to the movable portion, the sensing element including a first magnetic layer, a direction of a first magnetization of the first magnetic layer being along the first direction.3. The device according to claim 2 , wherein the sensing element further includes:the second magnetic layer; andan intermediate layer provided between the first magnetic layer and the second magnetic layer, the intermediate layer being nonmagnetic.4. The device according to claim 3 , wherein an electrical resistance between the first magnetic layer and the second magnetic layer changes in accordance with a deformation of the movable portion.5. The device according to claim 3 , wherein the second magnetic layer is a magnetization free layer.6. The device according to claim 3 , wherein at least one of the first magnetic layer and the second ...

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Номер записи: 87
14-01-2021 дата публикации

MICROPHONE AND MANUFACTURING METHOD THEREOF

Номер: US20210009407A1
Автор: Yoo Il Seon
Принадлежит:

A microphone includes a substrate having a first sound hole formed therein, a sound-sensing module mounted on the substrate so as to be aligned with the first sound hole, a signal-processing chip mounted on the substrate so as to be electrically connected to the sound-sensing module, a cover mounted on the substrate so as to accommodate the sound-sensing module therein and including a filter accommodation portion having a second sound hole formed therein, and a sound delay filter elastically accommodated in the filter accommodation portion so as to be aligned with the second sound hole. The microphone has a simplified structure, and can be manufactured to as to improve the stability and reliability thereof. 1. A microphone , comprising:a substrate having a first sound hole formed therein;a sound-sensing module mounted on the substrate, the sound-sensing module being aligned with the first sound hole;a signal-processing chip mounted on the substrate, the signal-processing chip being electrically connected to the sound-sensing module;a cover mounted on the substrate, the cover accommodating the sound-sensing module therein, the cover comprising a filter accommodation portion having a second sound hole formed therein; anda sound delay filter elastically accommodated in the filter accommodation portion, the sound delay filter being aligned with the second sound hole.2. The microphone according to claim 1 , wherein the sound delay filter comprises:a filter substrate having a filter hole formed therein; andan elastic pattern integrally formed with at least one end portion of the filter substrate, the elastic pattern being elastically disposed between an inner wall of the filter accommodation portion and the filter substrate.3. The microphone according to claim 2 , wherein the elastic pattern comprises:a contact pattern spaced apart from the end portion of the filter substrate, the contact pattern being in contact with the inner wall of the filter accommodation portion; ...

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Номер записи: 88
09-01-2020 дата публикации

TRANSCONDUCTANCE AMPLIFIER

Номер: US20200010315A1
Автор: Furst Claus Erdmann, Tingleff Jens
Принадлежит: Knowles Electronics, LLC

The present disclosure relates to an integrated circuit comprising a transconductance amplifier which is connectable to a microelectromechanical systems (MEMS) transducer. The transconductance amplifier comprises a first input coupled to a first current conveyor and a second input coupled to a second current conveyor for converting a single-ended or differential transducer signal voltage into an intermediate signal current representative of the transducer signal voltage through a shared reference resistor. The transconductance amplifier further comprises first and second output circuits coupled to the shared reference resistor and being configured to convert the intermediate current signal into a corresponding differential output current signal through first and second output terminals for driving a load. 1. An integrated circuit comprising:a MEMS transducer; and a first input coupled to a first current conveyor and a second input coupled to a second current conveyor for converting a single-ended or a differential transducer signal voltage into an intermediate signal current representative of the transducer signal voltage through a shared reference resistor; and', 'a first output circuit and a second output circuit coupled to the shared reference resistor and configured to convert the intermediate current signal into a corresponding differential output current signal through a first output terminal and a second output terminal for driving a load., 'a transconductance amplifier coupled to the MEMS transducer, the transconductance amplifier comprising2. The integrated circuit of claim 1 , wherein:the first output circuit comprises a first class AB output stage and a first output bias circuit configured to set a predetermined quiescent current through the first class AB output stage; andthe second output circuit comprises a second class AB output stage and a second output bias circuit configured to set a predetermined quiescent current through the second class AB ...

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Номер записи: 89
09-01-2020 дата публикации

MEMS MICROPHONE AND PREPARATION METHOD THEREOF

Номер: US20200010316A1
Автор: Hu Yonggang
Принадлежит:

A MEMS microphone comprises a substrate (), a lower electrode layer (), a sacrificial layer (), a stress layer (), and an upper electrode layer (). The substrate () is centrally provided with a first opening (), and the lower electrode layer () stretches across the substrate (). The sacrificial layer (), the stress layer (), and the upper electrode layer () are sequentially laminated on the lower electrode layer (), and a second opening () is provided on the sacrificial layer () and the stress layer (). The second opening () is provided in correspondence with the first opening (). A stress direction of the stress layer () is reverse to a warpage direction of the substrate (). 1. An MEMS microphone , comprising a substrate , a lower electrode layer , a sacrificial layer , a stress layer , and an upper electrode layer; wherein the substrate defines a first opening in a middle portion thereof , the lower electrode layer spans the substrate; the sacrificial layer , the stress layer , and the upper electrode layer are sequentially laminated on the lower electrode layer; the sacrificial layer and the stress layer define a second opening corresponding to the first opening; a stress direction of the stress layer is opposite to a warping direction of the substrate.2. The MEMS microphone according to claim 1 , wherein the stress layer is a silicon nitride layer.3. The MEMS microphone according to claim 1 , wherein the stress layer is located at a periphery of a vibration active area of the upper electrode layer or the lower electrode layer claim 1 , and the vibration activity area is a position corresponding to the second opening.4. The MEMS microphone according to claim 1 , wherein the upper electrode layer is a flexible film serving as a diaphragm claim 1 , and the lower electrode layer is a rigid film serving as a back plate.5. The MEMS microphone according to claim 1 , wherein the upper electrode layer is a rigid film serving as a back plate claim 1 , and the lower ...

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Номер записи: 90
27-01-2022 дата публикации

Microphone capsule, microphone arrangement with a plurality of microphone capsules and method for calibrating a microphone array

Номер: US20220030360A1
Автор: NOWAK Alexander
Принадлежит: Sennheiser electronic GmbH & Co. KG

Microphone capsules for condenser or electret microphones often exhibit individual deviations from a desired ideal behavior, e.g. the frequency response and phase response. Particularly if a plurality of microphone capsules are interconnected to form a microphone array, suitable microphone capsules must be found in a selection process. Some of these deviations can be corrected electronically, e.g. by filtering with a corresponding filter that is individually adapted. An improved microphone capsule, with which an automatic selection and automatic assembly of circuit boards with microphone capsules is facilitated, comprises an electrostatic sound transducer, an amplifier element that outputs an amplified output signal of the electrostatic sound transducer, and at least one electronic memory element. Data obtained by a measurement and relating to the individual frequency response or phase response of the respective microphone capsule can be stored therein. The data can be read out during manufacturing and during operation, which enables automatic sorting of the capsules during production and automatic calibration of the target circuit in operation. 1. A microphone capsule with a housing and , in the housing ,an electrostatic sound transducer;a first electronic circuit with an amplifier element, which receives a signal from the electrostatic sound transducer and outputs an amplified output signal, wherein the amplifier element is arranged on a circuit board; andelectrical connectors at least for the amplified output signal and a reference potential; at least one further electrical connector and', 'a second electronic circuit with at least one electronic memory element adapted for storing data thereon that relate to the individual frequency response or phase response of the microphone capsule,', 'wherein the memory element is arranged on said circuit board and can be read out via the at least one further electrical connector., 'wherein the housing of the microphone ...

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Номер записи: 91
14-01-2016 дата публикации

Digital Microphone Interface

Номер: US20160012007A1
Автор: Dai Wei-Wen, Popper Robert A.
Принадлежит:

A plurality of sensors are coupled to a data transmission bus and a command line. A marker is transmitted across the command transmission line. The marker is sensed at each of the plurality of the sensors. At each of the plurality of sensors, data is transmitted over the data bus at a predetermined time from the marker. Each predetermined time for each of the plurality of sensors is different from the predetermined time at the other sensors. Data transmitted from each of the plurality of sensors does not interfere with data transmitted from others of the plurality of sensors. 1. A method , comprising:coupling a plurality of sensors to a data transmission bus and a command line;transmitting a marker across the command transmission line;sensing the marker at each of the plurality of sensors;at each of the plurality of sensors, transmitting data over the data bus at a predetermined time from the marker, such that each predetermined time for each of the plurality of sensors is different from the predetermined time at the other sensors, and such that data transmitted from each of the plurality of microphones does not interfere with data transmitted from others of the plurality of sensors.2. The method of wherein the plurality of sensors comprise a plurality of proximity sensors claim 1 , a plurality of ambient light sensors claim 1 , or a plurality of micro electro mechanical system (MEMS) microphones.3. The method of claim 1 , wherein the marker comprises a word strobe (WS) signal.4. The method of claim 1 , further comprising transmitting a clock signal to each of the plurality of sensors.5. The method of claim 4 , wherein a frequency of the clock signal is at least partially effective to configure each of the plurality of sensors.6. The method of claim 4 , wherein a frequency of the clock signal relates to a number of the sensors that are coupled to the data bus.7. The method of claim 1 , wherein the marker comprises a word strobe (WS) claim 1 , and the word strobe is ...

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Номер записи: 92
12-01-2017 дата публикации

MICROPHONE AND MANUFACTURING METHOD THEREOF

Номер: US20170011752A1
Автор: Yoo Ilseon
Принадлежит:

A microphone includes: a case that is vibrated by a vibration signal, a sound inlet through which a sound signal is input being formed at a portion of the case; a first sound element that is formed in the case at a position corresponding to the sound inlet and receives the sound signal and the vibration signal to output a first initial signal; a second sound element that is formed to be adjacent to the first sound element and receives the vibration signal to output a second initial signal; and a semiconductor chip that is connected to the first sound element and the second sound element and receives the first initial signal and the second initial signal to output a final signal. 1. A microphone comprising:a case that is vibrated by a vibration signal, a sound inlet through which a sound signal is input being formed at a portion of the case;a first sound element that is formed in the case at a position corresponding to the sound inlet and receives the sound signal and the vibration signal to output a first initial signal;a second sound element that is formed to be adjacent to the first sound element and receives the vibration signal to output a second initial signal; anda semiconductor chip that is connected to the first sound element and the second sound element and receives the first initial signal and the second initial signal to output a final signal.2. The microphone of claim 1 , wherein the semiconductor chip: i) divides the first initial signal into a sound signal and a vibration signal claim 1 , ii) modulates a phase of the second initial signal claim 1 , iii) merges the first initial signal with the divided sound signal and vibration signal claim 1 , and iv) merges the second initial signal with the phase-modulated signal to cancel the vibration signal and extract the sound signal.3. The microphone of claim 1 , wherein an air passage is formed at a side of a lower portion of the second sound element.4. The microphone of claim 1 , wherein the case includes:a ...

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Номер записи: 93
11-01-2018 дата публикации

SPLIT SIGNAL DIFFERENTIAL MEMS MICROPHONE

Номер: US20180012588A1
Автор: Albers John J., Froehlich Thomas
Принадлежит: Knowles Electronics, LLC

An integrated circuit includes a first amplifier and a second amplifier. A first impedance matching circuit is coupled to the first amplifier, a first charge pump, and a single MEMS transducer. A second impedance matching circuit is coupled to the second amplifier, a second charge pump, and to the single MEMS transducer. A first capacitive load as measured at an input of first amplifier, and a second capacitive load as measured at an input of the second amplifier exist. The first capacitive load and the second capacitive load are balanced with respect to each other. A single pressure change causes the single MEMS transducer to create a first electrical signal and a second electrical signal. Both the first electrical signal and the second electrical signal are matched or approximately matched in magnitude, and 180 degrees or approximately 180 degrees out of phase with respect to each other. 1. An integrated circuit , comprising:a first amplifier;a second amplifier;a first impedance matching network coupled to the first amplifier, a first charge pump, and a single MEMS transducer;a second impedance matching network coupled to the second amplifier, a second charge pump, and the single MEMS transducer;a first capacitive load; anda second capacitive load, wherein the first capacitive load and the second capacitive load are sized to equalize total capacitance including parasitic capacitances of an interconnect and the single MEMS transducer; andwherein a single pressure change causes the single MEMS transducer to create a first electrical signal and a second electrical signal, each of the first electrical signal and the second electrical signal being matched or approximately matched in magnitude, and 180 degrees or approximately 180 degrees out of phase with respect to each other.2. The integrated circuit of claim 1 , wherein an electrical bias is applied across the single MEMS transducer by the first charge pump and the second charge pump.3. The integrated circuit of ...

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Номер записи: 94
12-01-2017 дата публикации

MICROPHONE

Номер: US20170013355A1
Автор: Kim Hyunsoo, Yoo Ilseon
Принадлежит:

A microphone includes a case including a plurality of sound holes; a first sound device installed at positions corresponding to at least two sound holes in the case; a second sound device spaced apart from the first sound device in the case and installed at a position corresponding to at least one sound hole; and a semiconductor chip electrically connected to the first sound device and the second sound device, where the at least two sound holes formed in the positions corresponding to the first sound device are each formed in upper and lower surfaces of the case on the basis of the first sound device. 1. A microphone comprising:a case in which a plurality of sound holes are formed;a first sound device mounted in the case and installed at a position corresponding to at least two sound holes formed in an upper surface and a lower surface of the case, respectively;a second sound device mounted in the case, installed to be spaced apart from the first sound device by a predetermined interval, and installed at a position corresponding to another sound hole formed in the case; anda semiconductor chip electrically connected to the first sound device and the second sound device.2. The microphone of claim 1 , wherein:the first sound device and the second sound device are omnidirectional sound devices.3. The microphone of claim 1 , wherein:the first sound device receives sound source signals through each of the at least two sound holes formed in the upper and lower surfaces of the case and transmits a first sound output signal, which is a bi-directional signal, to the semiconductor chip.4. The microphone of claim 3 , wherein:the semiconductor chip receives a second sound output signal, which is an omnidirectional signal, from the second sound device, and outputs a final sound signal, which is a uni-directional signal, using the first sound output signal and the second sound output signal.5. The microphone of claim 1 , wherein:the semiconductor chip is electrically connected to ...

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Номер записи: 95
12-01-2017 дата публикации

MICROELECTROMECHANICAL MICROPHONE HAVING A STATIONARY INNER REGION

Номер: US20170013363A1
Автор: BERGER Renata Melamud, Bharatan Sushil, Chen Thomas
Принадлежит:

A microelectromechanical microphone has a stationary region or another type of mechanically supported region that can mitigate or avoid mechanical instabilities in the microelectromechanical microphone. The stationary region can be formed in a diaphragm of the microelectromechanical microphone by rigidly attaching, via a rigid dielectric member, an inner portion of the diaphragm to a backplate of the microelectromechanical microphone. The rigid dielectric member can extend between the backplate and the diaphragm. In certain embodiments, the dielectric member can be hollow, forming a shell that is centrosymmetric or has another type of symmetry. In other embodiments, the dielectric member can define a core-shell structure, where an outer shell of a first dielectric material defines an inner opening filled with a second dielectric material. Multiple dielectric members can rigidly attach the diaphragm to the backplate. An extended dielectric member can rigidly attach a non-planar diaphragm to a backplate. 1. A microelectromechanical microphone , comprising:a stationary plate defining multiple openings; anda movable plate defining an outer portion and an inner opening substantially centered at geometric center of the movable plate,the movable plate is rigidly attached to the stationary plate via a hollow dielectric member extending from a surface of the stationary plate to a surface of the movable plate in a vicinity of the inner opening, wherein a region containing an interface between with the movable plate and the hollow dielectric member is acoustically inactive.2. The microelectromechanical microphone of claim 1 , wherein the hollow dielectric member defines a substantially centrosymmetric shell having a thickness and defining a cross-section claim 1 , and wherein a ratio between a width of the cross-section and the thickness is in a range from about 10 to about 25.3. The microelectromechanical microphone of claim 2 , wherein the stationary plate comprises silicon ...

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Номер записи: 96
12-01-2017 дата публикации

APPARATUS AND METHODS FOR INDIVIDUAL ADDRESSING AND NOISE REDUCTION IN ACTUATOR ARRAYS

Номер: US20170013368A1
Автор: Ben Simon Meir, Cohen Yuval, Haber Eric Andreas, Kaplan Shay, Lewin Daniel
Принадлежит:

Apparatus for generating a target physical effect, at least one attribute of which corresponds to at least one characteristic of a digital input signal sampled periodically, the apparatus comprising a multiplicity of electrostatic actuator elements, each comprising a moving element moving between first and second electrodes, the multiplicity of electrostatic actuator elements including Nr first subsets (R-subsets) of actuator elements and Nc second subsets (C-subsets) of actuator elements, wherein a first partitioning of the multiplicity of actuator elements yields the Nr first subsets (R-subsets) and a second partitioning of the multiplicity of actuator elements yields the Nc second subsets (C-subsets); a first plurality of Nr electrical connections (R-wires) interconnecting the moving elements of actuator elements in each R-subset, such that the moving element of any actuator element in each individual R-subset is electrically connected to the moving elements of all other actuator elements in the individual R-subset, and electrically isolated from the moving elements of all actuator elements not in the individual R-subset; a second plurality of Nc electrical connections (A-wires) interconnecting the first electrodes of actuator elements in each C-subset, such that the first electrode of any actuator element in each individual C-subset is electrically connected to the first electrode of all other actuator elements in the individual C-subset, and electrically isolated from all actuator elements not in the individual C-subset; a third plurality of Nc electrical connections (B-wires) interconnecting the second electrodes of actuator elements in each C-subset, such that the second electrode of any actuator element in each individual C-subset is electrically connected to the second electrode of all other actuator elements in the individual C-subset, and electrically isolated from all actuator elements not in the individual C-subset; and a controller electrically. 126-. ...

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Номер записи: 97
12-01-2017 дата публикации

Micro Speaker

Номер: US20170013383A1
Автор: Yang Zhang
Принадлежит: AAC Technologies Pte Ltd

A micro speaker is disclosed. The micro speaker includes a vibration system including a diaphragm and a voice coil for driving the diaphragm, the diaphragm including a conductive dome a suspension surrounding the conductive dome; a magnetic circuit system including a lower plate, a first magnetic part on the lower plate, a second magnetic part on the lower plate, a pole plate attached to the first magnetic part and including a plurality of units, one of the first and second magnetic part being a permanent magnet for forming a magnetic gap; capacitors formed by the conductive dome and the units of the pole plate for outputting electrical signals according to vibrations of the diaphragm and for detecting real-time replacement of the diaphragm.

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Номер записи: 98
11-01-2018 дата публикации

TRANSDUCER PACKAGE WITH THROUGH-VIAS

Номер: US20180014099A1
Автор: Loeppert Pete
Принадлежит: Knowles Electronics, LLC

A microphone includes a microelectromechanical system (MEMS) die configured to sense an acoustic signal, a base, and a lid. The base has a top surface and a bottom surface. The bottom surface includes a first electrical pad and a second electrical pad. The first electrical pad and the second electrical pad are configured to transmit an electrical signal indicative of the acoustic signal. The lid has a top surface and a bottom surface. The lid includes a cavity that surrounds the MEMS die. The top surface of the lid includes a third electrical pad and a fourth electrical pad. The first electrical pad and the third electrical pad are electrically connected, and the second electrical pad and the fourth electrical pad are electrically connected. 1. A microphone comprising:a microelectromechanical system (MEMS) die configured to sense an acoustic signal,a base with a top surface and a bottom surface, wherein the bottom surface comprises a first electrical pad and a second electrical pad, wherein the first electrical pad and the second electrical pad are configured to transmit an electrical signal indicative of the acoustic signal; anda lid with a top surface and a bottom surface, wherein the lid comprises a cavity that surrounds the MEMS die, and wherein the top surface of the lid comprises a third electrical pad and a fourth electrical pad, wherein the first electrical pad and the third electrical pad are electrically connected, and wherein the second electrical pad and the fourth electrical pad are electrically connected.2. The microphone of claim 1 , wherein the base comprises a port that allows the acoustic signal to pass through the base.3. The microphone of claim 1 , wherein the first electrical pad and the third electrical pad are electrically connected by way of a first via through the lid claim 1 , and wherein the second electrical pad and fourth electrical pad are electrically connected by way of a second via through the lid.4. The microphone of claim 1 , ...

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Номер записи: 99
11-01-2018 дата публикации

SENSOR ARRANGEMENT HAVING AN OPTIMIZED GROUP DELAY AND SIGNAL PROCESSING METHOD

Номер: US20180014124A1
Автор: Bach Elmar, Caspani Alessandro, Straeussnigg Dietmar, Wiesbauer Andreas
Принадлежит:

In various embodiments, a circuit arrangement is provided. The circuit arrangement includes a sensor set up to provide an analogue signal, an analogue/digital converter set up to receive the analogue signal and to provide a first signal, and a first filter set up to receive a signal based on the first signal and to provide a second signal. The first filter is set up in such a manner that the second signal is allowed through without amplification or substantially without amplification in a frequency range of approximately 20 Hz to approximately 10 kHz, and the second signal has a gain of greater than 0 dB at least above a predefined frequency which is greater than approximately 20 kHz. 1. A circuit arrangement , comprising:a sensor set up to provide an analogue signal;an analogue/digital converter set up to receive the analogue signal and to provide a first signal;a first filter set up to receive a signal based on the first signal and to provide a second signal; the second signal is allowed through without amplification or substantially without amplification in a frequency range of approximately 20 Hz to approximately 10 kHz, and', 'the second signal has a gain of greater than 0 dB at least above a predefined frequency which is greater than approximately 20 kHz., 'the first filter being set up in such a manner that2. The circuit arrangement of claim 1 , further comprising:a second filter which is connected to the analogue/digital converter and is set up to provide a third signal based on the first signal.3. The circuit arrangement of claim 2 ,wherein the second filter is set up as a frequency-selective filter to process the signal received by the second filter in such a manner that an amplitude of the signal received by the second filter is reduced in a predefined frequency range, the predefined frequency range having a frequency of greater than 20 kHz.4. The circuit arrangement of claim 1 , further comprising:a modulator which is connected to the analogue/digital ...

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Номер записи: 100