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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Применить Всего найдено 8. Отображено 8.
03-06-2014 дата публикации

Semiconductor package configured to electrically couple to a printed circuit board and method of providing same

Номер: US0008742569B2
Автор: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam, LO CHI KWONG, WAN LIK HANG, TAM MING WA
Принадлежит: Ubotic Intellectual Property Co. Ltd., LO CHI KWONG, WAN LIK HANG, TAM MING WA, UBOTIC INTELLECTUAL PROPERTY CO LTD, UBOTIC INTELLECTUAL PROPERTY CO. LTD.

In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base coupled to the lid and having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. At least one of the lid or the base can have at least one port hole. The one or more first electrically conductive leads can be configured to couple to the printed circuit board. Other embodiments are disclosed.

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Номер записи: 1
20-12-2012 дата публикации

SEMICONDUCTOR PACKAGE FOR MEMS DEVICE AND METHOD OF MANUFACTURING SAME

Номер: US20120319256A1
Автор: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam, LO CHI KWONG, WAN LIK HANG, TAM MING WA
Принадлежит: UBOTIC INTELLECTUAL PROPERTY COMPANY LIMITED

In some embodiments, a semiconductor package can include: (a) a base having a cavity; (b) an interposer coupled to the base and at least partially over the cavity such that the interposer and the base form a back chamber, the interposer has a first opening into the back chamber; (c) a micro-electro-mechanical system device located over the interposer at the first opening; and (d) a lid coupled to the base. Other embodiments also are disclosed.

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Номер записи: 2
07-02-2013 дата публикации

SEMICONDUCTOR PACKAGE CONFIGURED TO ELECTRICALLY COUPLE TO A PRINTED CIRCUIT BOARD AND METHOD OF PROVIDING SAME

Номер: US20130032905A1
Автор: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam, LO CHI KWONG, WAN LIK HANG, TAM MING WA
Принадлежит: UBOTIC INTELLECTUAL PROPERTY CO. LTD.

In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base coupled to the lid and having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. At least one of the lid or the base can have at least one port hole. The one or more first electrically conductive leads can be configured to couple to the printed circuit board. Other embodiments are disclosed. 2. The semiconductor package of claim 1 , wherein:the one or more second electrically conductive leads are configured to couple to the printed circuit board.331.-. (canceled)32. The semiconductor package of claim 1 , further comprising:one or more second semiconductor devices mechanically coupled to the base and electrically coupled to the one or more second electrically conductive leads.33. The semiconductor package of claim 1 , further comprising:one or more second micro-electrical-mechanical system devices mechanically coupled to the base and electrically coupled to the one or more second electrically conductive leads.34. The semiconductor package of claim 1 , wherein:the one or more first micro-electrical-mechanical system devices are coupled to the one or more first electrically conductive leads using wires.35. The semiconductor package of claim 1 , wherein:the one or more first semiconductor devices are coupled to the one or more first electrically conductive leads using wires.36. The semiconductor package of claim 1 , wherein:the one or more ...

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Номер записи: 3
07-10-2014 дата публикации

Air cavity package configured to electrically couple to a printed circuit board and method of providing same

Номер: US0008853564B2
Автор: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam, LO CHI KWONG, WAN LIK HANG, TAM MING WA
Принадлежит: Ubotic Intellectual Property Co. Ltd., LO CHI KWONG, WAN LIK HANG, TAM MING WA, UBOTIC INTELLECTUAL PROPERTY CO LTD, UBOTIC INTELLECTUAL PROPERTY CO. LTD.

In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base having a top, a bottom and one or more sides between the top and the bottom, the base having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. The lid can be coupled to the base and at least one of the lid or the base has at least one port hole. The one or more second electrically conductive leads can be configured to couple to the printed circuit board at ...

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Номер записи: 4
19-08-2014 дата публикации

Semiconductor package for MEMS device and method of manufacturing same

Номер: US0008809974B2
Автор: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
Принадлежит: Ubotic Intellectual Property Company Limited

In some embodiments, a semiconductor package can include: (a) a base having a cavity; (b) an interposer coupled to the base and at least partially over the cavity such that the interposer and the base form a back chamber, the interposer has a first opening into the back chamber; (c) a micro-electro-mechanical system device located over the interposer at the first opening; and (d) a lid coupled to the base. Other embodiments also are disclosed.

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Номер записи: 5
23-05-2013 дата публикации

AIR CAVITY PACKAGE CONFIGURED TO ELECTRICALLY COUPLE TO A PRINTED CIRCUIT BOARD AND METHOD OF PROVIDING SAME

Номер: US20130128487A1
Автор: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
Принадлежит: UBOTIC INTELLECTUAL PROPERTY CO. LTD.

In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base having a top, a bottom and one or more sides between the top and the bottom, the base having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. The lid can be coupled to the base and at least one of the lid or the base has at least one port hole. The one or more second electrically conductive leads can be configured to couple to the printed circuit board at a first side of the one or more sides of the base. Other embodiments are disclosed.

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Номер записи: 6
30-07-2020 дата публикации

MEMS Package, MEMS Microphone and Method of Manufacturing the MEMS Package

Номер: US20200245076A1
Автор: Hironobu Hayashi, Jumpei Tsuchiya, Koichi Shiozawa, Lik Hang Ken Wan, Masashi Shiraishi, Toyotaka Kobayashi
Принадлежит: SAE Magnetics HK Ltd

A MEMS package has a MEMS chip, a package substrate which the MEMS chip is adhered, a chip-cover which wraps the MEMS chip, and a cover-supporting part which supports the chip-cover from the inside. In the MEMS package, the chip-cover is supported by the cover-supporting part to form a back chamber, surrounded by the chip-cover and the package substrate.

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Номер записи: 7
05-06-2018 дата публикации

Sensor package and method of manufacture

Номер: US09991194B1
Автор: Ken Lik Hang Wan, Ming-Wa TAM, Wa San Leung
Принадлежит: UBOTIC Co Ltd

A method of manufacture and a substrate for sensor packages is provided. The method involves premolding a lead frame with strips having V-grooves; cutting the substrate partially, and plating the exposed surfaces of the lead frame. The method subsequently involves attaching a die to a dies pad and connecting wires between the die and leads to form a sensor package. The sensor package is separated from the substrate by snapping along the score line. The substrate for assembly of sensor packages as well as substrate of sensor packages is manufactured using at least part of the method of manufacture.

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Номер записи: 8