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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 8. Отображено 8.
16-08-2016 дата публикации

Ultrasound transducer and method for manufacturing an ultrasound transducer

Номер: US0009419202B2
Принадлежит: General Electric Company, GEN ELECTRIC

An ultrasound transducer includes an acoustic layer having a front side and an opposite back side. The acoustic layer is configured to convert electrical signals into ultrasound waves to be transmitted from the front side toward a target. The acoustic layer is configured to convert received ultrasound waves into electrical signals. A lens is connected to the front side of the acoustic layer. A heat sink is connected to the back side of the acoustic layer. A flex circuit is disposed between the acoustic layer and the heat sink. The flex circuit includes a backside matching layer incorporated into a body of the flex circuit. The backside matching layer is connected in thermal communication with the acoustic layer and the heat sink such that the backside matching layer is configured to conduct heat from the acoustic layer to the heat sink.

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12-01-2012 дата публикации

Thermal Transfer and Acoustic Matching Layers for Ultrasound Transducer

Номер: US20120007471A1
Автор: Tai Alan Chi-Chung
Принадлежит: GENERAL ELECTRIC COMPANY

Ultrasound transducers and methods of making ultrasound transducers with improved thermal characteristics are provided. An ultrasound transducer can include: a backing, a piezoelectric element attached to the backing, a first matching layer attached to the piezoelectric element, and a second matching layer attached to the first matching layer. The first matching layer can comprise metal and can have a thermal conductivity of about greater than 30 W/mK. The second matching layer can have a thermal conductivity of about 0.5-300 W/mK. The first matching layer can have an acoustic impedance of about 10-20 MRayl, and the second matching layer can have a lower acoustic impedance. The first matching layer can be thicker than the second matching layer. The ultrasound transducer can include a lens and a matching layer disposed between the piezoelectric element and the lens can be configured to conduct heat from the piezoelectric element to the backing. 1. An ultrasound transducer comprising:a backing;a piezoelectric element attached to the backing, the piezoelectric element configured to convert electrical signals into ultrasound waves to be transmitted toward a target, the piezoelectric element configured to convert received ultrasound waves into electrical signals;a first matching layer attached to the piezoelectric element, the first matching layer having a first acoustic impedance and a thermal conductivity of about greater than 30 W/mK; anda second matching layer attached to the first matching layer, the second matching layer having a second acoustic impedance that is lower than the first acoustic impedance.2. The ultrasound transducer of claim 1 , wherein the first acoustic impedance is about 10-20 MRayl.3. The ultrasound transducer of claim 1 , wherein the first matching layer has a first thickness claim 1 , and wherein the second matching layer has a second thickness that is less than the first thickness.4. The ultrasound transducer of claim 1 , wherein the second ...

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28-11-2013 дата публикации

ULTRASOUND TRANSDUCER AND METHOD FOR MANUFACTURING AN ULTRASOUND TRANSDUCER

Номер: US20130315035A1
Автор: Tai Alan Chi-Chung
Принадлежит: GENERAL ELECTRIC COMPANY

An ultrasound transducer includes an array of acoustic elements, an integrated circuit, and an interposer. The interposer includes conductive elements for electrically connecting the acoustic elements to the integrated circuit. The conductive elements are electrically connected to the integrated circuit. Solder is engaged between the acoustic elements and the conductive elements of the interposer such that the conductive elements of the interposer are electrically connected to the acoustic elements through the solder. 1. An ultrasound transducer comprising:an array of acoustic elements;an integrated circuit;an interposer comprising conductive elements for electrically connecting the acoustic elements to the integrated circuit, the conductive elements being electrically connected to the integrated circuit; andsolder that is engaged between the acoustic elements and the conductive elements of the interposer such that the conductive elements of the interposer are electrically connected to the acoustic elements through the solder.2. The ultrasound transducer of claim 1 , wherein the solder is a first solder layer claim 1 , the ultrasound transducer further comprising a second solder layer that is engaged between the integrated circuit and the conductive elements of the interposer such that the conductive elements of the interposer are electrically connected to the integrated circuit through the solder.3. The ultrasound transducer of claim 1 , wherein the interposer comprises at least one of a flex circuit or a flex cable.4. The ultrasound transducer of claim 1 , wherein the acoustic elements comprise dematching layers claim 1 , the solder being engaged with the dematching layers such that the acoustic elements are electrically connected to the conductive elements interposer through the solder.5. The ultrasound transducer of claim 1 , wherein the array of acoustic elements is one of a one-dimensional (1D) array claim 1 , a 1.5D array claim 1 , a 1.75D array claim 1 , or ...

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25-12-2014 дата публикации

ULTRASOUND TRANSDUCER AND METHOD FOR MANUFACTURING AN ULTRASOUND TRANSDUCER

Номер: US20140375171A1
Автор: Tai Alan Chi-Chung
Принадлежит:

An ultrasound transducer includes an acoustic layer having a front side and an opposite back side. The acoustic layer is configured to convert electrical signals into ultrasound waves to be transmitted from the front side toward a target. The acoustic layer is configured to convert received ultrasound waves into electrical signals. A lens is connected to the front side of the acoustic layer. A heat sink is connected to the back side of the acoustic layer. A flex circuit is disposed between the acoustic layer and the heat sink. The flex circuit includes a backside matching layer incorporated into a body of the flex circuit. The backside matching layer is connected in thermal communication with the acoustic layer and the heat sink such that the backside matching layer is configured to conduct heat from the acoustic layer to the heat sink. 1. An ultrasound transducer comprising:an acoustic layer having a front side and an opposite back side, the acoustic layer being configured to convert electrical signals into ultrasound waves to be transmitted from the front side toward a target, the acoustic layer being configured to convert received ultrasound waves into electrical signals;a lens connected to the front side of the acoustic layer;a heat sink connected to the back side of the acoustic layer; anda flex circuit disposed between the acoustic layer and the heat sink, the flex circuit comprising a backside matching layer incorporated into a body of the flex circuit, wherein the backside matching layer is connected in thermal communication with the acoustic layer and the heat sink such that the backside matching layer is configured to conduct heat from the acoustic layer to the heat sink.2. The ultrasound transducer of claim 1 , wherein the backside matching layer is an interior layer of the body of the flex circuit.3. The ultrasound transducer of claim 1 , wherein the backside matching layer is an exterior layer of the body of the flex circuit.4. The ultrasound transducer ...

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28-12-2010 дата публикации

Automatic signal-optimizing transducer assembly for blood flow measurement

Номер: US7857763B2
Автор: Alan Chi-Chung Tai
Принадлежит: Alan Chi-Chung Tai

The invention uses a transducer and ultrasound system to form and direct ultrasound beams through the blood stream that will detect the Doppler shift in frequency between the beams and the return echo off the blood. The transducer can be secured onto the surface of the patient's skin with a transducer housing holder. A 1-D transducer, subject to an optimized angle with respect to the blood vessel, will generate and direct ultrasound beams electronically through a blood vessel below the skin and analyze the received echo, searching for the maximum signal amplitude of the Doppler frequency shift from the blood. Furthermore, the device continuously controls the direction of the ultrasound beams to achieve maximum return signal amplitude. Then, the condition and trend of the blood flow is recorded and displayed continuously over the desired diagnostic interval the device is in use.

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04-09-2009 дата публикации

DEVICE FOR INCREASING THE SENSITIVITY OF ULTRASONIC TRANSDUCERS

Номер: FR2928224A1
Принадлежит: General Electric Co

Empilage acoustique (150) destiné à servir dans un transducteur ultrasonore à fréquence centrale, comprenant une couche de matériau piézoélectrique polarisé (154) et au moins une couche d'adaptation d'impédance (164, 168). La couche de matériau piézoélectrique polarisé (154) à des faces supérieure et inférieure (166, 170) et est constituée d'un matériau piézoélectrique polarisé ayant une première impédance acoustique. La couche de matériau piézoélectrique polarisé (154) a une première épaisseur (190) et l'empilage acoustique (150) a une impédance électrique de sortie dépendant de la première épaisseur (190). Les couches d'adaptation d'impédance (164, 168) sont conçues pour se fixer aux faces supérieure et inférieure (166, 170) de la couche de matériau piézoélectrique polarisé (154) et ont une deuxième ou une troisième épaisseur (192) ou (194). Les couches d'adaptation d'impédance (164, 168) sont constituées d'un ou de plusieurs matériaux qui ont une impédance acoustique sensiblement similaire à la première impédance acoustique. La couche de matériau piézoélectrique polarisé (154) et les couches d'adaptation d'impédance (166, 168) forment une épaisseur (152) de résonance acoustique. La fréquence centrale du transducteur dépend de l'épaisseur (152) de résonance acoustique. An acoustic stack (150) for use in a center frequency ultrasonic transducer, comprising a layer of polarized piezoelectric material (154) and at least one impedance matching layer (164, 168). The layer of polarized piezoelectric material (154) has upper and lower faces (166, 170) and is made of a polarized piezoelectric material having a first acoustic impedance. The layer of polarized piezoelectric material (154) has a first thickness (190) and the acoustic stack (150) has an output electrical impedance dependent on the first thickness (190). The impedance matching layers (164, 168) are adapted to attach to the upper and lower faces (166, 170) of the ...

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13-01-2012 дата публикации

THERMAL TRANSFER AND ACOUSTIC ADAPTATION LAYERS FOR ULTRASOUND TRANSDUCER

Номер: FR2962533A1
Автор: Alan Chi-Chung Tai
Принадлежит: General Electric Co

L'invention porte sur des transducteurs ultrasonores et des procédés de fabrication de transducteurs ultrasonores ayant des caractéristiques thermiques améliorées. Un transducteur ultrasonore (200) peut comprendre: un support (110), un élément piézoélectrique (108) fixé au support (110), une première couche d'adaptation (206) fixée à l'élément piézoélectrique (108), et une deuxième couche d'adaptation (205) fixée à la première couche d'adaptation (206). La première couche d'adaptation (206) peut comprendre un métal et peut avoir une conductivité thermique supérieure à environ 30 W/mK. La deuxième couche d'adaptation (205) peut avoir une conductivité thermique d'environ 0,5-300 W/mK. La première couche d'adaptation (206) peut avoir une impédance acoustique d'environ 10-20 MRayl, et la deuxième couche d'adaptation (205) peut avoir une impédance acoustique plus faible. La première couche d'adaptation (206) peut être plus épaisse que la deuxième couche d'adaptation (205). Le transducteur ultrasonore (200) peut comprendre une lentille (102), et une couche d'adaptation (206) placée entre l'élément piézoélectrique (108) et la lentille (102) peut être configurée pour conduire la chaleur de l'élément piézoélectrique (108) au support (110). Ultrasonic transducers and methods of making ultrasonic transducers having improved thermal characteristics are disclosed. An ultrasonic transducer (200) may include: a support (110), a piezoelectric element (108) attached to the support (110), a first matching layer (206) attached to the piezoelectric element (108), and a second an adaptation layer (205) attached to the first matching layer (206). The first matching layer (206) may comprise a metal and may have a thermal conductivity greater than about 30 W / mK. The second matching layer (205) may have a thermal conductivity of about 0.5-300 W / mK. The first matching layer (206) may have an acoustic impedance of about 10-20 ...

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29-11-2013 дата публикации

ECHOGRAPHIC TRANSDUCER AND METHOD FOR MANUFACTURING AN ECHOGRAPHIC TRANSDUCER

Номер: FR2991127A1
Автор: Alan Chi-Chung Tai
Принадлежит: General Electric Co

Transducteur échographique (16) comportant une matrice d'éléments acoustiques (14), un circuit intégré (36) et un intercalaire (38). L'intercalaire comprend des éléments conducteurs (58) pour connecter électriquement les éléments acoustiques au circuit intégré. Les éléments conducteurs sont connectés électriquement au circuit intégré. De la brasure (46) est insérée entre les éléments acoustiques et les éléments conducteurs de l'intercalaire de façon que les éléments conducteurs de l'intercalaire soient connectés électriquement aux éléments acoustiques par l'intermédiaire de la brasure. An ultrasound transducer (16) comprising an array of acoustic elements (14), an integrated circuit (36) and an interlayer (38). The spacer includes conductive elements (58) for electrically connecting the acoustic elements to the integrated circuit. The conductive elements are electrically connected to the integrated circuit. Solder (46) is inserted between the acoustic elements and the conductive elements of the spacer so that the conductive elements of the spacer are electrically connected to the acoustic elements through the solder.

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