MASK FRAME ASSEMBLY AND DEPOSITION APPARATUS USING SAME
The present invention refers to for evaporation a thin film of a mask used in a frame assembly and using the same relates to deposition device. The anode generally organic light emitting display device a light-emitting layer and the holes and the electrons injected recombined in principle to emit light Image with a display device as that may be embodied as, a luminous layer between anode and the cathode is inserted laminate-structure. However, emitted from the light emitting high efficiency include structure said in this respect, to said provided as an intermediate least one of said light emitting layer together electron injection layer, electron transport layer, hole transport layer, and a hole-injecting layer, or the like used selectively adds of wet liquid to flow down. On the other hand, organic light emitting display device in relation to a variety of intermediate layer and of electrodes and the tail gas burner can be which method, of one method is method is deposited. Deposition method on the organic light emitting device using the connection pin when the connection the, of intended identical to the mask frame assembly aligns and onto the substrate, the mask frame assembly the substrate through the raw material in the thin films the deposition chamber is maintained at the desired pattern is especially form a thin film of the. Of a thin film of the present invention in the embodiment the mask frame assembly using the same provides a deposition device. Of the present invention embodiment is formed pattern hole relate the perforated region and one region void-free pattern hole alternately along the direction which are disposed in the mask and, said radio interface unit, connected with a mask contains a frame, said said porosity region of said void region thickness is gradually receding from and coupled with a main provides mask frame assembly. Said mask said its stretched condition along one direction said both can be connected to a frame. Said mask of stick type is may comprise an mask. Said laminated peripheral ring consists of adjacent thickened regions of void between porosity two reference points of a symmetrical. and may be shaped. Among said thick most region void said shaft pipe, acting as the fulcrum can be region. Furthermore, deposition source of the present invention embodiment relate, number 1 of the substrate facing said deposition source side to the output face and serving mask frame assembly and, said number 1 number 2 a and an opposite surface of said substrate is arranged inside said substrate a magnetic force to said mask frame assembly includes magnet a plant to reduce costs, said mask frame assembly a pattern hole is formed porosity region and one region void-free pattern hole alternately along the direction which are disposed in the mask and, said radio interface unit, connected with a mask contains a frame, said porosity region is thickened regions of void said receding from is thickened gradually provides a deposition device. Said magnet between the substrate and said substrate is the pressurizing can be is further provided. Said mask said its stretched condition along one direction said both can be connected to a frame. Said mask of stick type is may comprise an mask. Said laminated peripheral ring consists of adjacent thickened regions of void between porosity two reference points of a symmetrical. and may be shaped. Among said thick most region void said shaft pipe, acting as the fulcrum can be region. The aforementioned addition the other side of the, characterized, front drawing of hereinafter, clearly from the detailed description of the invention and claim is will occur. According to an embodiment of the present invention mask frame assembly and deposition device and magnetic forces acting on the mask according to microware filld of stress is and guides light, and relieving wave mask adhesion improver for mask substrate pass through. The mask frame assembly depositing operations the power-control product production is wafer temperature can be ensured by. Also Figure 1 shows a device according to one embodiment of the present invention it is shown a. plane from the deposition. Figure 2 shows a deposition device multiplexing the Pn codes separation it is shown a mask frame assembly is perspective view of Figure 1. Cutting along the line Figure 3 shows a III-III is cross-sectional drawing of Figure 2. Deposition shown in 1 also also Figure 4 shows a device manufactured by using the organic light emitting device. plane from the exhibit. The present invention refers to various conversion thereby, the cold air flows that can apply various embodiment which may have bar, specific drawing illustrated in the embodiment are defined in the description are disclosed and. rapidly and to reduce a memory. The present effect of the invention and features, and achieving the method a refers to in particular a plant processing waste fractions with drawing in the embodiment are a clarified that will. However the present invention refers to hereinafter in a disclosure in the embodiment defined in rather than in various forms may be embodied in. Hereinafter, reference to drawing with an account which of the present invention in the embodiment are detailed, drawing when describe an reference to the corresponding components equal to or the same drawing is impart code of a local terminal is dispensed to the described. In the embodiment of in hereinafter, contextually representation a plurality of differently it is apparent that without the carelessly, includes multiple representations. In the embodiment of in hereinafter, a set of terms, such as. having or comprising a specification to the features, or components the presence of means which is used, another aspect of one or more the probability of is added or components while removing the pre the not. In the embodiment of in hereinafter, film, region, such as components on the other portion in or on the when that the, when directly on the of the other portions as well as, other films to its intermediate, region, components such as is inserted includes a double-. For facilitating of drawing in the size of components are can be or contracts the map picture. E.g., each configuration shown in drawing described size and thickness for facilitating of arbitrarily representing sleeve regulates the, necessarily the present invention not limited to shown. Alternatively substracte any embodiment, where possible, implementing a process order specific to differ from the order of described a subsequent heat treatment is performed after. For example, continuously the described cassette on an unloading substantially concurrently and may be performed, so that a lower interconnection is formed described and vice versa can be and the processing advances to step order. Figure 1 shows a deposition device according to one embodiment also shown and this, Figure 2 its deposition device multiplexing the Pn codes shown mask frame assembly which, Figure 3 shows a III-III cross section cutting along the line is of Figure 2. First, as shown in 1 also said deposition device a, substrate (200) to deposition of a chamber defining a workspace (600) and a, the chamber (600) installed in deposition won (500) and, said substrate (200) won (500) deposition of opposite respectively arranged at a mask frame assembly (100) and, said mask frame assembly (100) substrate for fluid to be pulled into a magnetic force (200) is adhered on the magnet (400) such as is arranged. References 700 has a magnet (400) to magnetic force of substrate caused by its own weight before (200) to allow a user to smoothly mask frame assembly (100) and the substrate (200) through a developing gap exhibits the pressurizing main is. Deposition of this construction forms fine air layer between the deposition in device, said deposition won (500) a deposition gas is generated in said mask frame assembly (100) of pattern hole (111a) through the substrate (200) is deposited, thus directing their pattern hole (111a) substrate corresponding to (200) is is performed and to. Wherein, said mask frame assembly (100) surfaces of a pluralities structure of, as shown in also 2, frame (120) and, frame (120) at their ends device is fixed in close plurality of mask (110) is provided. Frame (120) the mask frame assembly (100) in order to expose the bonding pad is easily by forming the teeth in, central opening (121) is formed rectangular shape of wet liquid to flow down. The frame (120) a pair of facially opposed mask number of sides (110) is fixed welding, for instance, and run both ends of. Said mask (110) has a plurality of stick type as masks is divided display rod, said pattern hole (111a) a porosity region (111) and, pattern hole-free void region (112) are alternately arranged on the both ends those for which the frame as said (120) is welded to. Mask (110) of high member but may be one of, and faced to the cut unit when be-dried to sag phenomenon may, divided into mask stick-type number and drawing the. And, in Figure 1 formed at a rim of a through disclosed on opening (121) for exhibit several mask (110) but shown only, actual manufacturing after completion is formed with an opening (121) the mask (110) so that when a gate electrode layer for filling completely into. Each mask (110) the as porosity region (111) and shutdown region (112) is complete with, the clamping area across the state before a check out welding (113) also provided. Mask (110) a frame (120) when welded to corresponding mask (110) a porosity region (111) and shutdown region (112) a are alternately arranged on the long side direction (A1, A2; constitution: the one-way hereinafter) followed by tensile in pulled taut in welding where it is heated, photoresist pattern (110) for gripping when pulling on the both ends are provided on the parts on which portions said clamping area (113) is. The clamping region (113) a welding is connected to the is cutting. Said porosity region (111) a plurality of pattern hole (111a) are formed into an area of, vapor deposition is deposited on a semiconductor substrate the pattern hole (111a) mask as it passes through the cylinder (110) is closely attached to the a substrate (200) is formed on thin film. Said void region (112) the pattern hole (111a) since there is no deposition occur. non. Reference 3 also and are urged against the void region (112) to illustrate the structure of time as large as that of all the gen on. As said void region (112) a deposition are maintained as the second of the zone containing the originally masked but not (110), and to maintain the strength of the part make. I.e., porosity region (111) the many pattern hole (111a) since the-punched are of a relatively hard. weak. Therefore, mask (110) or easily makes levels of rigidity, not curved in order to ensure a void region (112) the porosity region (111) is formed thick compared to. State of the SP heads and, if void region (112) thickness of porosity region (111), i.e., is thickened abruptly compared to, cause so that when a squeeze charged as a kind of, frame (120) welding mask (110) tensile the photoresist at a portion at which stress does not wave is focused can be is weak section easy. As well as, magnet (400) by a magnetic force applied to the where these when a squeeze charged as a kind of a region, and composed of a peripheral portion and magnetic force-dried to deviation substrate (200) stuck to the well can be along body includes a pump and a gas. As such mask (110) in stress and magnetic force deviation increased if there is the, substrate (200) is firmly attached to is bad, deposition shadow such as. a producing method thereof. Therefore, the present in the embodiment in the void region (112), such as porosity region 3 also thickness of (111) according to separating from the gradually is thickened in a structure of wet liquid to flow down. I.e., two porosity region (111) between the void region (112) based on the faces, (C) point element at the center a plane which is defined, for example, thick and, the point (C) installed through both based on the gradually varying in their thickness. on a seat. A plurality of data in one access, porosity region (111) and shutdown region (112) since do not are, mask (110) in tensile stress to a boundary area between the flange or player for the treatment of severely is wave concentrated in a magnetic force-dried to deviation substrate (200) poses problems, such as a strong is bad firmly attached to can be is. With this structure, the mask frame assembly for (100) the connection pin when the connection, said frame (200) and a plurality of stick-type mask (110) preparing a each. Frame (200) a centrally opening (201) is frame a is formed, mask (110) the such as porosity region (111) and shutdown region (112) and clamping area (113) is prepared stick-type with. And, prepared mask (110) both ends of which should be at the clamping area (113) to tension (not shown) to grasp the mask (110) pulls the printed tape of one direction, a long side direction made in the next frame (200) to to the base plate. Fixing after the clamping area (113) can be cut. away. In such a way several mask (110) turn frame with (200) opening open and shut off by the pressure welding (121) to multiple fill. The, mask (110) of porosity region (111) and shutdown region (112) and a step abruptly varying the boundary between constitution: high + O2 + ar gas is is formed, is focused boundary tension [...] of traveling vehicle, where occurrence of a one waveguide hardly occur. As such mask (110) of porosity region (111) and shutdown region (112) between body causes a steep step without boundary, microware filld stress and magnetic force deviation of installed rotatably on the base panel (not shown) since the directly received by the very adhesion to a, predetermined distance the power deposition by a the free surfaces. While, the present invention according to mask frame assembly (100) has various which can be used for thin film deposition, such as an organic light emitting display of the counter electrodes membrane or an organic device a zipper type junction zone in which can be used. Figure 4 shows a embodiment a are also the first deoxygenator mask frame assembly (100) using organic light emitting display can be an example of device is shown in the surface. Also 4 refers to surface, substrate (320) on buffer layer (330) being arranged for receipt of, these buffer layers (330) mounted on an upper portion TFT comprises the rectangular plate like nut 3. The semiconductor active layer TFT (331) and, active layer is crystallized (331) diffusion barrier layer formed to cover a filled with the gate insulating film (332) and, gate insulating layer (332) gate electrode (333) has. Gate electrode (333) so as to cover the interlayer insulating film (334) is formed, interlayer insulating film (334) on top of source and drain electrodes (335) is formed. Source and drain electrodes (335) the gate insulating layer of the gate (332) and interlayer dielectric film (334) the substrate having the active layer by a layout (331) of the source region and the drain region is electrically connected to. And, source and drain electrodes (335) cathode in organic light emitting devices (OLED) of pixel electrodes (321) is are connected. Pixel electrode (321) the planarization film (337) being formed in the upper part which, pixel electrodes (321) each pixel 307 (Pixel defining layer: 338) is formed. And, the pixel 307 (338) is formed the opening part of a predetermined, organic light emitting device is used for covering a organic (OLED) (326) is formed, counter electrode thereon (327) is is deposited. In double, e.g. said organic is used for covering a (326) said porosity region during the formation of a (111) of pattern hole (111a) is used for covering a organic said is (326) so as to correspond to a mask frame assembly said (100) and prepared to existing at the surface of a silicon deposition, substrate such as by establishing an optical fiber at a (200) and mask (110) in adhesion between can cause the gate. Furthermore, counter electrode (327) even in the event of said to corresponds to the pattern as a mask frame assembly (100) and prepared to use of, substrate (200) and mask (110) the adhesion of the portion of the thermal conductivity can cause the gate. One shown in the present invention refers to drawing and thereby, the cold air flows embodiment restrains the described with reference to an exemplary, the purpose: to avoid a typically encountered in field having knowledge of embodiment and various modifications therefrom grow the first deoxygenator changeable will understand that. Therefore, the scope of protection of the present invention technical true a claim the idea is decided by the will should be. 100: mask frame assembly 110: mask 111: porosity region 111a: pattern hole 112: void region 113: clamping area 120: frame 200: substrate 400: magnet 500: deposition won 600: chamber According to an embodiment of the present invention, a mask frame assembly comprises: a mask wherein a perforated area with a pattern hole and a non-perforated area without a pattern hole are alternately placed in one direction; and a frame joined to the mask. The further the non-perforated area of the mask gets away from the perforated area, the more the non-perforated area of the mask gradually thickens. COPYRIGHT KIPO 2015 Pattern hole a porosity region and one region void-free pattern hole alternately along the direction which are disposed in the mask and, said radio interface unit, connected with a mask contains a frame, said said porosity region of said void region thickness is gradually receding from is thickened a mask frame assembly. According to Claim 1, said said mask the its stretched condition along one direction said both coupled to frame mask frame assembly. According to Claim 1, is said mask including mask frame assembly of stick type mask. According to Claim 1, said laminated peripheral ring consists of adjacent thickened regions of void between porosity two symmetrical reference point of a shape a mask frame assembly. According to Claim 4, said void region among said shaft pipe, acting as the fulcrum in the region of the final a mask frame assembly. Deposition source, number 1 of the substrate facing said deposition source side to the output face and serving mask frame assembly and, said number 1 number 2 a and an opposite surface of said substrate is arranged inside said substrate a magnetic force to said mask frame assembly includes magnet a plant to reduce costs, said mask frame assembly a pattern hole is formed porosity region and one region void-free pattern hole alternately along the direction which are disposed in the mask and, said radio interface unit, connected with a mask contains a frame, said porosity region is thickened regions of void said receding from a deposition device is thickened gradually. According to Claim 6, said magnet between the substrate and said substrate is the pressurizing device deposition is further provided. According to Claim 6, said mask along one direction said both the its stretched condition said deposition connected to a frame device. According to Claim 6, is said mask including mask deposition of stick type device. According to Claim 6, said laminated peripheral ring consists of adjacent thickened regions of void between porosity two symmetrical reference point of a shape a deposition device. According to Claim 10, said void region among said shaft pipe, acting as the fulcrum a deposited most thick region device.
