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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 21531. Отображено 100.
08-11-2017 дата публикации

Режущий инструмент из твердого сплава с многослойным покрытием

Номер: RU0000174874U1

Полезная модель относится к нанесению износостойких слоев на режущий инструмент, в частности к нанесению покрытий высокоскоростным сверхзвуковым напылением на твердосплавный режущий инструмент, и может быть использована во всех областях машиностроения, связанных с механической обработкой металлов, в том числе легких сплавов, в частности никелевых, титановых, алюминиевых.Технический результат достигается тем, что режущий инструмент из твердого сплава с многослойным покрытием представляет собой композит, содержащий первый, нижний, адгезионный слоя из никеля, второй слой из материала с эффектом памяти формы, износостойкий слой и дополнительно упрочняющий слой, при этом второй слой из материала с эффектом памяти формы состоит из Ti-Ni-Ta при следующем соотношении, мас. %третий, упрочняющий слой, из cBN-Ni при следующем соотношении, мас. %:а четвертый, износостойкий, слой из наноалмазных частиц и кобальта при следующем соотношении, мас. %:Толщина адгезионного первого слоя находится в пределах 100-150 мкм, второго слоя 550-650 мкм, третьего, упрочняющего слоя, 550-600 мкм, четвертого, износостойкого, слоя 500-550 мкм при этом общая толщина композита составляет 1,70-1,95 мм. В четвертом, износостойком, слое используют наноалмазные частицы размером от 35-60 нм. Техническим результатом является повышение прочностных характеристик слоев, в частности адгезии, износостойкости, прочности. РОССИЙСКАЯ ФЕДЕРАЦИЯ 19 11 зе а сазе а (13 7 ВУ “174 874 41 (51) МПК В23В 27/4 (2006.01) С23С 14/06 (2006.01) ВЗ2В 15/04 (2006.01) ан ель тал ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21)(22) Заявка: 2016145852, 22.11.2016 (24) Дата начала отсчета срока действия патента: 22.11.2016 Дата регистрации: 08.11.2017 Приоритет(ы): (22) Дата подачи заявки: 22.11.2016 (45) Опубликовано: 08.11.2017 Бюл. № 31 Адрес для переписки: 350072, Краснодар, ул. Московская, 2, ФГБОУ ВО "КубГТУ", отдел интеллектуальной и промышленной собственности, начальнику ОИПС ...

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02-02-2012 дата публикации

Device housing and method for making the same

Номер: US20120027968A1

A device housing is provided. The device housing includes a substrate, and an anti-fingerprint film formed on the substrate. The anti-fingerprint film is a metal-nitrogen-oxygen compound coating. A method for making the device housing is also described there.

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09-02-2012 дата публикации

Film forming apparatus and film forming method

Номер: US20120031748A1
Автор: Shigenori Ishihara
Принадлежит: Canon Anelva Corp

The present invention provides a film forming apparatus and a film forming method which are unlikely to be affected by changes in size and shape of a shield board caused by a recovery process. A film forming apparatus includes a shield board surrounding a sputtering space between a process-target substrate on a stage and a target facing each other in a vacuum chamber, and forms a film on the process-target substrate by causing at least one kind of reactive gas and a film forming material to react with each other. The film forming apparatus is configured to control a ratio of the flow rate of the gas to be introduced into the sputtering space to the flow rate of the gas to be introduced into a space between an inner wall of the vacuum chamber and the shield board, based on a pressure value of the sputtering space measured by pressure detection means.

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09-02-2012 дата публикации

Coating method

Номер: US20120034379A1
Автор: Chung-Pei Wang
Принадлежит: Hon Hai Precision Industry Co Ltd

A coating method includes following steps. A workpiece having a flat surface is provided. The surface includes a coating region and a pattern region. A tape mask having a through hole, whose shape and size conforms to the pattern region, is attached onto the flat surface of workpiece to cover the coating region, thus exposing the pattern region. A screen printing stencil is placed on the tape mask. Ink is spread over the screen printing stencil printing stencil, and squeezed into the through hole over the pattern region. The ink is solidified. The tape mask is removed from the workpiece. A metallic coating is formed on the coating region of the flat surface and the solidified ink on the pattern region is removed.

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09-02-2012 дата публикации

Article and method for manufacturing same

Номер: US20120034452A1

An article includes a substrate and a color layer deposited on the substrate. The color layer has an L* value between about 36 to about 48, an a* value between about 4 to about 5, and a b* value between about 2 to about 4 in the CIE L*a*b* color space.

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16-02-2012 дата публикации

Coating, article coated with coating, and method for manufacturing article

Номер: US20120040163A1

A coating includes a zirconium yttrium carbon-nitride layer including a first surface and an opposite second surface, the atomic carbon content and the atomic nitrogen content in the zirconium yttrium carbon-nitride layer gradually increasing from the first surface to the second surface.

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01-03-2012 дата публикации

Article and method for manufacturing same

Номер: US20120052290A1

An article includes a substrate; and a color layer deposited on the substrate, wherein the color layer is a zirconium carbon-nitride layer; the color layer has an L* value between about 28 to about 32, an a* value between about −1 to about 1, and a b* value between about −1 to about 1 in the CIE L*a*b* color space.

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15-03-2012 дата публикации

Metal pattern formation system

Номер: US20120060708A1
Принадлежит: Individual

The invention discloses a metal pattern formation system produced in the following steps: an organic liquid is first printed on a substrate to form a base pattern. A metal is then evaporated to generate several metal particles for covering the printed substrate. At last, the substrate is heated to vaporize the base pattern, and the metal particles adhered to the substrate forms a metal pattern complementary to the base pattern.

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15-03-2012 дата публикации

Ito-coated article for use with touch panel display assemblies, and/or method of making the same

Номер: US20120064234A1
Автор: Alexey Krasnov
Принадлежит: Guardian Industries Corp

Certain example embodiments of this invention relate to techniques for making a coated article including a transparent conductive indium-tin-oxide (ITO) film supported by a heat treated glass substrate. A substantially sub-oxidized ITO or metallic indium-tin (InSn) film is sputter-deposited onto a glass substrate at room temperature. The glass substrate with the as-deposited film thereon is subjected to elevated temperatures. Thermal tempering or heat strengthening causes the as-deposited film to be transformed into a crystalline transparent conductive ITO film. Advantageously, this may reduce the cost of touch panel assemblies, e.g., because of the higher rates of the ITO deposition in the metallic mode. The cost of touch-panel assemblies may be further reduced through the use of float glass.

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19-04-2012 дата публикации

Thin film deposition apparatus for continuous deposition, and mask unit and crucible unit included in thin film deposition apparatus

Номер: US20120090544A1
Автор: II-Soo PARK, Mu-gyeom Kim
Принадлежит: Samsung Mobile Display Co Ltd

A thin film deposition apparatus for performing continuous deposition, and a mask unit and a crucible unit that are included in the thin film deposition apparatus. A thin film deposition apparatus includes a moving unit configured to move a substrate as a deposition target; a mask unit configured to selectively pass vapor of a deposition source toward the substrate; and a crucible unit including a plurality of crucibles accommodating the deposition source and proceeding along a circulation path passing through the mask unit.

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19-04-2012 дата публикации

Method of treating the surface of a soda lime silica glass substrate, surface-treated glass substrate, and device incorporating the same

Номер: US20120091475A1
Автор: Scott V. Thomsen
Принадлежит: Guardian Industries Corp

Certain example embodiments of this invention relate to methods of treating the surface of a soda lime silica glass substrate, e.g., a soda lime silica alkali ion glass substrate, and the resulting surface-treated glass articles. More particularly, certain example embodiments of this invention relate to methods of removing a top surface portion of a glass substrate using ion sources. During or after removal of this portion, the glass may then be coated with another layer, to be used as a capping layer. In certain example embodiments, the glass substrate coated with a capping layer may be used as a color filter and/or TFT substrate in an electronic device. In other example embodiments, the glass substrate with the capping layer thereon may be used in a variety of display devices.

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19-04-2012 дата публикации

Coated article and method for making the same

Номер: US20120094095A1

A coated article is described. The coated article includes a substrate, a combining layer formed on the substrate, a plurality of chromium nitride layers and a plurality of copper-zinc alloy layers formed on the combining layer. The combining layer is a chromium layer. Each chromium nitride layer interleaves with one copper-zinc alloy layer. A method for making the coated article is also described.

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03-05-2012 дата публикации

Thin-film formation system and organic el device manufacturing system

Номер: US20120103254A1
Автор: Tomokazu Sushihara
Принадлежит: Canon Inc

Provided is thin-film formation system including: a first conveying mechanism to convey a substrate and a deposition mask to a substrate carry-in position; a second conveying mechanism to convey the substrate and the deposition mask aligned by an alignment mechanism placed at the substrate carry-in position; a film formation mechanism to laminate a layer of organic material on the substrate in a film formation interval of the second conveying mechanism; and a third conveying mechanism to convey the substrate and the deposition mask which have passed the film formation interval from a carry-out position, in which at least one of the first conveying mechanism and the third conveying mechanism is placed parallel to the second conveying mechanism.

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03-05-2012 дата публикации

Article made of aluminum or aluminum alloy and method for manufacturing

Номер: US20120107606A1

An article includes a substrate made of aluminum or aluminum alloy, an insulating coating formed on the substrate, and an anticorrosive coating formed on the insulating coating. The insulating coating is composed of electrically insulating ceramic material or polymer. The anticorrosive coating is a ceramic coating formed by physical vapor deposition.

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10-05-2012 дата публикации

Cooled pvd shield

Номер: US20120111273A1
Принадлежит: Individual

The present invention generally comprises a top shield for shielding a shadow frame within a PVD chamber. The top shield may remain in a stationary position and at least partially shield the shadow frame to reduce the amount of material that may deposit on the shadow frame during processing. The top shield may be cooled to reduce the amount of fluxuation in temperature of the top shield and shadow frame during processing and/or during down time.

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14-06-2012 дата публикации

Methods for depositing metal in high aspect ratio features

Номер: US20120149192A1
Принадлежит: Applied Materials Inc

Methods of depositing metal in high aspect ratio features are provided herein. In some embodiments, a method of processing a substrate includes applying RF power at VHF frequency to a target comprising metal disposed in the PVD chamber above the substrate to form a plasma from a plasma-forming gas, sputtering metal atoms from the target using the plasma while maintaining a first pressure in the PVD chamber sufficient to ionize a predominant portion of the sputtered metal atoms, depositing the ionized metal atoms on a bottom surface of the opening and on a first surface of the substrate, applying a first RF power to redistribute at least some of the deposited metal atoms from the bottom surface and upper surface to sidewalls of the opening, and repeating the deposition the redistribution processes until a first layer of metal is deposited on substantially all surfaces of the opening.

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21-06-2012 дата публикации

Thermoelectric material including coating layers, method of preparing the thermoelectric material, and thermoelectric device including the thermoelectric material

Номер: US20120152294A1
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A thermoelectric material includes powders having a surface coated with an inorganic material. The thermoelectric material includes a thermoelectric semiconductor powder and a coating layer on an outer surface of the thermoelectric semiconductor powders.

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28-06-2012 дата публикации

High-temperature jointed assemblies and wear-resistant coating systems therefor

Номер: US20120160348A1
Принадлежит: General Electric Co

Wear-resistant coating systems suitable for protecting surfaces subjected to contact wear at high temperatures, such as surfaces of an assembly comprising high-temperature components of gas turbine engines. The components have surfaces in wear contact with each other. One of the surfaces has a wear-resistant coating system thereon so as to be in wear contact with the surface of the other component. The wear-resistant coating system contains alternating layers of TiAlN and CrN.

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28-06-2012 дата публикации

Coated article and method for making same

Номер: US20120164481A1

A coated article is described. The coated article includes a stainless steel substrate, a bonding layer formed on the substrate, and a hard layer formed on the bonding layer. The bonding layer is a nickel-chromium alloy layer. The hard layer is a nickel-chromium-boron-nitrogen layer. The mass percentage of nitrogen within the hard layer is gradually increased from the area near the bonding layer to the area away from the bonding layer. A method for making the coated article is also described.

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28-06-2012 дата публикации

Tape base for superconducting wire, and superconducting wire

Номер: US20120165199A1
Автор: Hiroyuki Fukushima
Принадлежит: Furukawa Electric Co Ltd

A tape-shaped base for a superconducting wire, which simplifies the intermediate layer and thus enables production of a superconducting wire at lower cost, and which is capable of improving the characteristics (such as electrical conduction and handling properties) of a superconducting wire; and a superconducting wire. Specifically disclosed is a tape-shaped base for a superconducting wire, which is obtained by forming an intermediate layer on a metal substrate. In the tape-shaped base for a superconducting wire a biaxially oriented layer of the intermediate layer is configured of a niobium monoxide (NbO) layer that is formed by depositing vapor deposition particles from a vapor deposition source on a film formation surface.

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05-07-2012 дата публикации

Alignment master glass for tensioning vapor deposition mask, method for manufacturing the same, and method for tensioning vapor deposition mask using the same

Номер: US20120167822A1
Автор: Sang-Shin Lee
Принадлежит: Samsung Mobile Display Co Ltd

An alignment master glass for aligning a plurality of openings of a vapor deposition mask for tensioning the vapor deposition mask, the alignment master glass includes a transparent substrate, and reflective film patterns on at least one surface of the transparent substrate, the reflective film patterns being only at locations corresponding to the plurality of openings of the vapor deposition mask.

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05-07-2012 дата публикации

Coated article and method for making the same

Номер: US20120171416A1

A coated article is described. The coated article includes a substrate, a magnesium oxide-alumina compound layer formed on the substrate, and an anti-fingerprint layer formed on the magnesium oxide-alumina compound layer. The anti-fingerprint layer is a layer of magnesium-aluminum-oxygen-fluorine having the chemical formula of MgAlO x F y , wherein 0<x<2.5, 0<y<5. A method for making the coated article is also described.

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05-07-2012 дата публикации

Method and apparatus for masking substrates for deposition

Номер: US20120171807A1
Принадлежит: Intevac Inc

Disclosed are methods and apparatus for masking of substrates for deposition, and subsequent lifting of the mask with deposited material. Masking materials are utilized that can be used in high temperatures and vacuum environment. The masking material has minimal outgassing once inside a vacuum chamber and withstand the temperatures during deposition process. The mask is inkjeted over the wafers and, after deposition, removed using agitation, such as ultrasonic agitation, or using laser burn off.

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12-07-2012 дата публикации

Method of fabricating piezoelectric materials with opposite c-axis orientations

Номер: US20120177816A1

In accordance with a representative embodiment, a method, comprises: providing a substrate; forming a first piezoelectric layer having a compression-negative (C N ) polarity over the substrate; and forming a second piezoelectric layer having a compression-positive (C P ) over the substrate and adjacent to the first piezoelectric layer.

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12-07-2012 дата публикации

Arrangement for Holding a Substrate in a Material Deposition Apparatus

Номер: US20120178190A1
Принадлежит: Individual

An arrangement ( 1 ) for holding a substrate ( 10 ) in a material deposition apparatus, which substrate ( 10 ) has a deposition side ( 10 a ) upon which material (M) is to be deposited, and which arrangement ( 1 ) comprises: a shadow mask ( 20 ) comprising a number of deposition openings (Di); a support structure ( 30 ) comprising a number of surround openings (Si); and a support structure holding means ( 6 ) for holding the support mask ( 30 ) and/or a substrate holding means ( 5 ) for holding the substrate ( 10 ), such that the support structure ( 30 ) is on the same side as the deposition side ( 10 a ) of the substrate ( 10 ), and the shadow mask ( 20 ) is positioned between the substrate ( 10 ) and the support structure ( 30 ) such that at least one deposition opening (Di) of the shadow mask ( 10 ) lies within a corresponding surround opening (Si) of the support structure ( 30 ).

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19-07-2012 дата публикации

Vapor deposition method and vapor deposition apparatus

Номер: US20120183676A1
Принадлежит: Sharp Corp

The present invention (i) uses a mask unit ( 80 ) including: a shadow mask ( 81 ) that has an opening ( 82 ) and that is smaller in area than a vapor deposition region ( 210 ) of a film formation substrate ( 200 ) and; a vapor deposition source ( 85 ) that has a emission hole ( 86 ) for emitting a vapor deposition particle, the emission hole ( 86 ) being provided so as to face the shadow mask ( 81 ), the shadow mask ( 81 ) and the vapor deposition source ( 85 ) being fixed in position relative to each other, (ii) adjusts an amount of a void between the shadow mask ( 81 ) and the film formation substrate ( 200 ), (iii) moves at least a first one of the mask unit ( 80 ) and the film formation substrate ( 200 ) relative to a second one thereof while uniformly maintaining the amount of the void between the mask unit ( 80 ) and the film formation substrate ( 200 ), and (iv) sequentially deposit the vapor deposition particle onto the vapor deposition region ( 210 ) through the opening ( 82 ) of the shadow mask ( 81 ). This makes it possible to form a high-resolution vapor deposition pattern on a large-sized substrate.

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19-07-2012 дата публикации

Coated article and method for making the same

Номер: US20120183805A1

A coated article includes a substrate and a color layer formed on the substrate. The substrate is made of aluminum or aluminum alloy. The color layer includes an aluminum layer formed on the substrate and an aluminum oxide layer formed on the aluminum layer. In the CIE LAB color system, L* coordinate of the color layer is between 75 and 100, a* coordinate of the color layer is between −1 and 1, b* coordinate of the color layer is between −1 and 1. The coated article has a white color.

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26-07-2012 дата публикации

Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using thin film deposition apparatus

Номер: US20120186517A1
Принадлежит: Samsung Display Co Ltd

A thin film deposition apparatus to remove static electricity generated between a substrate and a mask, and a method of manufacturing an organic light-emitting display device using the thin film deposition apparatus.

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23-08-2012 дата публикации

Method of coating metal shell with pure white film

Номер: US20120211353A1
Принадлежит: Hon Hai Precision Industry Co Ltd

A method of coating a pure white film includes a first step of providing a metal shell, a second step of forming a bonding layer on a surface of the metal shell by a first magnetron sputtering process, and a third step of forming a pure white layer on a surface of the bonding layer by a second magnetron sputtering process. The bonding layer includes chromium nitride. In the second process, aluminum and chromium corporately serves as targets. Oxygen serves as a reactive gas. A ratio of a bombarding power of the aluminum to that of the chromium is about 12:1. A bias voltage ranges from 180 volts to 220 volts. The second magnetron sputtering process lasts for about 58 to 62 minutes and goes on under a temperature ranged from 180° C. to 220° C. And the pure white layer includes aluminum oxide and chromium oxide.

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23-08-2012 дата публикации

Method for producing indium tin oxide layer with controlled surface resistance

Номер: US20120213949A1

The invention relates to a method for producing a transparent indium tin oxide conductive layer on a substrate. The method involves using a target having a low indium-to-tin ratio in a low temperature manufacturing process (less than 200° C.), and introducing a plasma gas and a reaction gas into the reaction chamber to allow sputtering of an indium tin oxide layer on the substrate under a low oxygen environment, followed by subjecting the sputtered substrate to a heat treatment at 150˜200° C. for 60˜90 minutes. The indium tin oxide layer thus produced will crystallize completely and have the advantageous properties of low surface resistance and high uniformity.

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20-09-2012 дата публикации

Deposition Mask and Method of Manufacturing the Same

Номер: US20120234236A1
Принадлежит: Samsung Mobile Display Co Ltd

A deposition mask comprises a mask frame having an open window defined in a center thereof, a first mask sheet placed on the mask frame and including a plurality of open regions and a separation region which separates the open regions, and a second mask sheet placed on the first mask sheet and including a first aperture portion in a region which contacts the separation region of the first mask sheet.

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27-09-2012 дата публикации

Coated article having antibacterial effect and method for making the same

Номер: US20120244375A1

A coated article is described. The coated article includes a substrate, a bonding layer formed on the substrate, a plurality of nickel-chromium-nitrogen layers and a plurality of silver-cerium alloy layers formed on the bonding layer. The bonding layer is a nickel-chromium layer. Each nickel-chromium-nitrogen layer interleaves with one silver-cerium alloy layer. One of the nickel-chromium-nitrogen layers is directly formed on the bonding layer. A method for making the coated article is also described.

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27-09-2012 дата публикации

Coated article and method of making the same

Номер: US20120244382A1

A coated article includes a bonding layer, an iridium layer, a chromium oxynitride layer and a chromium nitride layer formed on a substrate in that order. The substrate is made of die steel.

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11-10-2012 дата публикации

Closed loop sputtering controlled to enhance electrical characteristics in deposited layer

Номер: US20120256155A1
Принадлежит: Intermolecular Inc

This disclosure provides a method of fabricating a semiconductor device layer and an associated memory cell. Empirical data may be used to generate a hysteresis curve associated with deposition for a metal-insulator-metal structure, with curve measurements reflecting variance of an electrical property as a function of cathode voltage used during a sputtering process. By generating at least one voltage level to be used during the sputtering process, where the voltage reflects a suitable value for the electrical property from among the values obtainable in mixed-mode deposition, a semiconductor device layer may be produced with improved characteristics and durability. A multistable memory cell or array of such cells manufactured according to this process can, for a set of given materials, be fabricated to have minimal leakage or “off” current characteristics (I leak or I off , respectively) or a maximum ratio of “on” current to “off” current (I on /I off ).

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25-10-2012 дата публикации

Mask Frame Assembly for Thin Film Deposition

Номер: US20120266813A1
Автор: Jeremy Hong
Принадлежит: Samsung Mobile Display Co Ltd

A mask frame assembly for depositing a deposition material on a deposition substrate comprises a mask frame including an opening and frames surrounding the opening, and a mask coupled on the mask frame. A deformation prevention unit is formed on at least one region of the mask. Since the deformation prevention unit is formed on a peripheral portion of a deposition pattern in the mask, deformation of the mask in a vertical direction may be reduced. Accordingly, defective attaching of the mask to the substrate may be reduced.

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01-11-2012 дата публикации

Process for surface treating iron-based alloy and article

Номер: US20120276408A1

A process for surface treating iron-based alloy includes providing a substrate made of iron-based alloy. A chromium layer is then formed on the substrate by vacuum sputtering. A silicon oxide layer, an alumina layer, and a boron nitride layer are formed in that order by vacuum evaporation.

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01-11-2012 дата публикации

Process for surface treating iron-based alloy and article

Номер: US20120276413A1

A process for surface treating iron-based alloy includes providing a substrate made of iron-based alloy. A chromium-oxygen-nitrogen layer is then formed on the substrate by sputtering. An iridium layer is formed on the chromium-oxygen-nitrogen layer by sputtering. A boron-nitrogen layer is next formed on the iridium layer by sputtering.

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22-11-2012 дата публикации

Laminate and process for its production

Номер: US20120295116A1
Принадлежит: Asahi Glass Co Ltd

To provide a laminate excellent in weather resistance, moisture-proof property, adhesion between layers and its long-term stability, and a process for its production. A laminate comprising a substrate sheet containing a fluororesin, an adhesive layer, and a moisture-proof layer containing, as the main component, at least one inorganic compound selected from the group consisting of an inorganic oxide, an inorganic nitride and an inorganic oxynitride, laminated in this order, wherein the adhesive layer contains, as the main component, at least one metal oxide selected from the group consisting of zirconium oxide, tantalum oxide and hafnium oxide.

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20-12-2012 дата публикации

Pinhole-Free Dielectric Thin Film Fabrication

Номер: US20120318664A1
Принадлежит: Applied Materials Inc

A method of depositing a dielectric thin film may include: depositing a thin layer of dielectric; stopping deposition of the dielectric layer, and modifying the gas in the chamber if desired; inducing and maintaining a plasma in the vicinity of the substrate to provide ion bombardment of the deposited layer of dielectric; and repeating the depositing, stopping and inducing and maintaining steps until a desired thickness of dielectric is deposited. A variation on this method may include, in place of the repeating step: depositing a thick layer of lower quality dielectric; depositing a thin layer of high quality dielectric; stopping deposition of the dielectric layer, and modifying the gas in the chamber if desired; and inducing and maintaining a plasma in the vicinity of the substrate to provide ion bombardment of the deposited layer of dielectric. The thick layer of dielectric may be deposited more rapidly than the thin layers.

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24-01-2013 дата публикации

Film Forming Method and Method for Manufacturing Film-Formation Substrate

Номер: US20130022757A1
Принадлежит: Sharp Corp

One embodiment of the present invention is a film forming method including the steps of forming an absorption layer 12 over one surface of a first substrate 11 ; forming a layer 16 containing a high molecular compound over the absorption layer; removing an impurity in the layer containing the high molecular compound by performing a first heat treatment on the layer 16 ; forming a material layer 18 containing a first film formation material and a second film formation material over the layer 16 ; performing a second heat treatment to form a mixed layer 19 in which the material layer and the layer 16 are mixed over the absorption layer; and performing third heat treatment to form a layer 19 a containing the first film formation material and the second film formation material on a film-formation target surface of a second substrate.

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24-01-2013 дата публикации

Coated article having antibacterial effect and method for making the same

Номер: US20130022835A1

A coated article is described. The coated article includes a substrate, a copper layer formed on the substrate, a compound copper-zinc layer formed on the copper layer, and a zinc oxide layer formed on the compound copper-zinc layer. A method for making the coated article is also described.

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28-02-2013 дата публикации

Transparent conductive zinc oxide film, process for production thereof, and use thereof

Номер: US20130048060A1
Принадлежит: Tosoh Corp

A transparent conductive zinc oxide based film according to the present invention contains Ti, Al and Zn in such a proportion that satisfies the following formulae (1), (2) and (3) in terms of atomic ratio, and has a plurality of surface textures different in size on a surface, wherein a center-line average surface roughness Ra of the surface of the transparent conductive film is 30 nm to 200 nm, and an average value of widths of the surface textures is 100 nm to 10 μm. 0.001≦Ti/(Zn+Al+Ti)≦0.079.  (1) 0.001≦Al/(Zn+Al+Ti)≦0.079  (2) 0.010≦(Ti+Al)/(Zn+Al+Ti)≦0.080  (3)

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07-03-2013 дата публикации

Substrate made of an aluminum-silicon alloy or crystalline silicon, metal mirror, method for the production thereof, and use thereof

Номер: US20130057952A1

The invention relates to a substrate made of an aluminium-silicon alloy or crystalline silicon to which a polishable layer is applied and also to a metal mirror which comprises this substrate. Furthermore, the invention relates to a method for the production of metal mirrors and also the use of the metal mirror according to the invention.

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14-03-2013 дата публикации

Vapor deposition mask, and manufacturing method and manufacturing device for organic el element using vapor deposition mask

Номер: US20130064969A1
Принадлежит: Sharp Corp

A vapor deposition mask ( 70 ) includes a first layer ( 71 ), a second layer ( 72 ) and a third layer ( 73 ) in this order. A plurality of first openings ( 71 h ), a plurality of second openings ( 72 h ) and a plurality of third openings ( 73 h ) are formed respectively in the first layer, the second layer and the third layer. The first openings, the second openings and the third openings communicate with each other, thereby constituting mask openings ( 75 ). The opening dimension of the second openings is larger than the opening dimension of the first openings and is larger than the opening dimension of the third openings. With this configuration, it is possible to prevent reduction of the opening dimension of the mask openings or clogging of the mask openings due to the vapor deposition particles adhering to the mask openings.

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21-03-2013 дата публикации

Evaporation device and evaporation apparatus

Номер: US20130068160A1

An evaporation device and an evaporation apparatus applying the same are adapted to performing evaporation process to an object to be coated. The evaporation device includes a tape carrier and a mask. The tape carrier has a heating region. The object to be coated is located over the heating region and is adapted to move along a feeding direction. The tape carrier is adapted to carry a coating material to pass through the heating region. The coating material is heated in the heating region and evaporated. The mask having an opening between the heating region and the object to be coated is disposed in the periphery of the heating region. The evaporated coating material is adapted to pass through the opening and coated on the object.

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04-04-2013 дата публикации

In-line deposition system and process for deposition of a thin film layer

Номер: US20130084669A1
Принадлежит: Primestar Solar Inc

An apparatus for vapor deposition of a sublimated source material as a thin film on a substrate is provided. The apparatus includes a receptacle configured to hold a source material and a distribution plate positioned above the receptacle. The distribution plate defines a pattern of passages therethrough. The apparatus also includes a conveyor configured to travel in a continuous loop such that its transfer surface passes above the distribution plate in a first direction to receive thereon sublimated source material passing through the passages of the distribution plate. The conveyor is also configured to travel in a second direction while carrying a substrate on its raised edges. A heating system heats the conveyor while it travels in the second direction to transfer the source material from the transfer surface to the substrate. A process is provided for vapor deposition of a sublimated source material to form thin film.

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18-04-2013 дата публикации

Method for Manufacturing Shielding

Номер: US20130092527A1
Принадлежит: Chenming Mold Industrial Corp

A method for manufacturing shielding which uses multiple vacuum sputtering methods to produce shielding on single IC chip. The method comprises the following steps: using covering fixtures to cover a plurality of IC chips and fixing these IC chips on a work support; vacuumizing the chamber to a pretreatment vacuum level; keeping pumping an ionizable gas into the chamber and performing ion bombardment on the material for IC packaging on the surface of these IC chips in order to produce carbon dangling bond connection layer on the material when the vacuum level of the chamber reaches the work vacuum level; performing multiple vacuum sputtering method to sequentially form a first coating layer, a second coating layer and a third coating layer on the carbon dangling bond connection layer; and breaking the vacuum status of the chamber and taking out the coated IC chips.

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25-04-2013 дата публикации

TRANSPARENT CONDUCTIVE COMPOSITION, TARGET, TRANSPARENT CONDUCTIVE THIN FILM USING THE TARGET AND METHOD FOR FABRICATING THE SAME

Номер: US20130098754A1

Disclosed are a transparent conductive composition including a material of the following formula, a target, a transparent conductive thin film using the target, and a method for fabricating the same. The disclosed transparent conductive composition and transparent conductive thin film have superior conductivity (low resistivity) and high light transmittance. Especially, they may be usefully applied for the flexible electronic devices, which may be called the core of the future display industry, because they have low resistivity of not greater than 10Ω·cm and a high light transmittance of at least 90% even when deposition is carried out at room temperature. 16-. (canceled)7. A method for fabricating a transparent conductive thin film comprising:{'sub': x', '1-x, 'preparing a target for fabricating a transparent conductive thin film comprising a material of the formula AlZnO through exploration of a composition of the formula via evaluation of electrical and optical properties upon deposition at differing positions,'}wherein the deposition deposits zinc oxide and aluminum oxide continuously on a substrate by off-axis RF sputtering using sputter guns, respectively loaded with zinc oxide and aluminum oxide, at an angle of 90° to the substrate with varying compositions at differing positions of the substrate, andwherein x is within the range of 0.04≦x≦0.063; anddepositing the target on a substrate by sputtering it at room temperature.8. The method for fabricating a transparent conductive thin film according to claim 7 , wherein x is within the range of 0.042≦x≦0.055.9. The method for fabricating a transparent conductive thin film according to claim 7 , wherein the depositing the target on a substrate by sputtering it at room temperature is performed at a pressure of 1 to 10 mTorr.10. The method for fabricating a transparent conductive thin film according to claim 8 , wherein the depositing the target on a substrate by sputtering it at room temperature is performed at a ...

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25-04-2013 дата публикации

Device housing and method for making the same

Номер: US20130101765A1

A device housing includes a substrate and a decorative article formed in the substrate. The substrate defines a cutout therein and the decorative article is received in the cutout and bonded with the substrate. The decorative article is a glass article which is formed in the cutout by molding softened glass material into the cutout. A method for making the device housing is also provided.

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25-04-2013 дата публикации

SPUTTERING TARGET, TRANSPARENT CONDUCTIVE FILM AND TRANSPARENT ELECTRODE

Номер: US20130101807A1
Принадлежит: IDEMITSU KOSAN CO., LTD.

A sputtering target including indium, tin, zinc and oxygen, and including a hexagonal layered compound, a spinel structure compound and a bixbyite structure compound. 1. (canceled)2. The method according to claim 9 , wherein in the sputtering target claim 9 , the hexagonal layered compound is shown by InO(ZnO) claim 9 , the spinel structure compound is shown by ZnSnO claim 9 , and the bixbyite structure compound shown by InO.3. The method according to claim 2 , wherein in the sputtering target claim 2 , the atomic ratio of In/(In+Sn+Zn) is in a range of 0.33 to 0.6 and the atomic ratio of Sn/(In+Sn+Zn) is in a range of 0.05 to 0.15.4. The method according to claim 9 , wherein in the sputtering target claim 9 , in X-ray diffraction claim 9 , the maximum peak intensity Iof the hexagonal layered compound claim 9 , the maximum peak intensity Iof the spinel structure compound claim 9 , and the maximum peak intensity Iof the bixbyite structure compound satisfy the following relationship:{'br': None, 'sub': 1', '3, 'I/Iis in a range of 0.05 to 20; and'}{'br': None, 'sub': 1', '2, 'I/Iis in a range of 0.05 to 20.'}5. The method according to claim 9 , wherein the sputtering target claim 9 , comprises an indium-tin-zinc oxide having a three-phase structure of an In-rich phase claim 9 , an Sn-rich phase and a Zn-rich phase.6. The method according to claim 9 , wherein in the sputtering target claim 9 , particles of the hexagonal layered compound and the bixbyite structure compound are dispersed in the matrix of the spinel structure compound.7. The method according to claim 9 , wherein the sputtering target claim 9 , has a bulk resistance in a range of 0.2 to 10 mΩ·cm.8. The method according to claim 9 , wherein the sputtering target claim 9 , has a theoretical relative density of 90% or more.9. A method for producing the sputtering target comprising indium claim 9 , tin claim 9 , zinc and oxygen claim 9 , and comprising a hexagonal layered compound claim 9 , a spinel structure ...

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02-05-2013 дата публикации

TRANSPARENT CONDUCTIVE FILM AND MANUFACTURING METHOD THEREFOR

Номер: US20130105301A1
Принадлежит: NITTO DENKO CORPORATION

An object of the present invention is to manufacture a long transparent conductive film comprising a transparent film substrate and a crystalline indium composite oxide film formed on the transparent film substrate. The manufacturing method of the present invention includes an amorphous laminate formation step of forming an amorphous film of an indium composite oxide containing indium and a tetravalent metal on the long transparent film substrate with a sputtering method, and a crystallization step of continuously feeding the long transparent film substrate on which the amorphous film is formed into a furnace and crystallizing the amorphous film. The indium composite oxide preferably contains more than 0 parts by weight and 15 parts by weight or less of the tetravalent metal based on 100 parts by weight of the total of indium and the tetravalent metal. 1. A method for manufacturing a long transparent conductive film comprising a long transparent film substrate and a crystalline indium composite oxide film formed on the long transparent film substrate , the method comprising:an amorphous laminate formation step of forming an amorphous film of an indium composite oxide containing indium and a tetravalent metal on the long transparent film substrate with a sputtering method, anda crystallization step of continuously feeding the long transparent film substrate on which the amorphous film is formed into a furnace and crystallizing the amorphous film, whereinthe indium composite oxide contains more than 0 parts by weight and 15 parts by weight or less of the tetravalent metal based on 100 parts by weight of the total of indium and the tetravalent metal.2. The method for manufacturing a transparent conductive film according to claim 1 , wherein the inside of a sputtering machine is vented to have a vacuum of 1×10Pa or less before the amorphous film is formed in the amorphous laminate formation step.3. The method for manufacturing a transparent conductive film according to ...

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02-05-2013 дата публикации

Method for deposition

Номер: US20130108789A1
Принадлежит: General Electric Co

Embodiments of the present invention include a method. The method includes producing a first vapor from a solid source material, reacting hydrogen telluride to form a second vapor comprising tellurium, and depositing on a support a coating material comprising tellurium within a deposition environment, the deposition environment comprising the first vapor and the second vapor. Another embodiment is a system. The system includes a deposition chamber disposed to contain a deposition environment in fluid communication with a support; a solid source material disposed in fluid communication with the deposition chamber; and a hydrogen telluride source in fluid communication in fluid communication with the deposition chamber.

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23-05-2013 дата публикации

Method for producing piezoelectric thin-film element, piezoelectric thin-film element, and member for piezoelectric thin-film element

Номер: US20130127293A1
Принадлежит: Murata Manufacturing Co Ltd

Provided is a method for producing a piezoelectric thin-film element including a piezoelectric thin-film layer having good surface morphology and high crystallinity. The method includes forming a lower electrode layer on a substrate; forming a piezoelectric thin-film buffer layer on the lower electrode layer at a relatively low film-formation temperature; forming a piezoelectric thin-film layer on the piezoelectric thin-film buffer layer at a film-formation temperature that is higher than the film-formation temperature for the piezoelectric thin-film buffer layer; and forming an upper electrode layer on the piezoelectric thin-film layer.

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30-05-2013 дата публикации

Mask for Deposition and Manufacturing Method of the Same

Номер: US20130133573A1
Принадлежит: Samsung Mobile Display Co Ltd

A deposition mask includes a mask main body and a coating layer. The mask main body includes a plurality of slits penetrating the mask main body. The coating layer is coated on an entire surface of the mask main body. The coating layer is made of a material different from a material of the main body, and it has a magnetic force stronger than that of the main body. Each of the slits has an open area, and a thickness of the coating layer controls a width of the open area. A photolithography process is used to form the plurality of slits.

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30-05-2013 дата публикации

METHOD FOR MANUFACTURING SPUTTERING TARGET AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Номер: US20130133808A1

When an oxide semiconductor is deposited by a sputtering method, there is a difference in composition between a sputtering target and a film deposited using the sputtering target in some cases depending on a material of the oxide semiconductor. In manufacturing a sputtering target containing zinc oxide, a crystal which contains zinc oxide is formed in advance, the crystal is crushed, and then a predetermined amount of zinc oxide is added and mixed. After that, the resulting object is sintered to form the sputtering target. The composition of the sputtering target is adjusted by setting the proportion of zinc in the sputtering target higher than that of zinc in a film having a desired composition which is obtained at last, in consideration of the amount of zinc which is reduced at the time of deposition by a sputtering method, the amount of zinc which is reduced at the time of sintering, and the like. 1. A method for manufacturing a sputtering target , comprising the steps of:performing first baking on a plurality of metal oxides to form a crystal;crushing the crystal into a powder;performing second baking on the powder and zinc oxide to form a sintered body;performing a mechanical processing on the sintered body to form a target;performing a heat treatment on the target; andattaching the target to a backing plate.2. The method for manufacturing a sputtering target according to claim 1 , wherein a temperature of each of the first baking and the second baking is 1200° C. to 1500° C. inclusive.3. The method for manufacturing a sputtering target according to claim 1 , wherein the first baking and the second baking are performed with application of mechanical pressure.4. The method for manufacturing a sputtering target according to claim 1 , wherein a cross section of the target has a tapered portion.5. The method for manufacturing a sputtering target according to claim 1 , wherein a temperature of the heat treatment is 425° C. to 750° C. inclusive.6. The method for ...

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30-05-2013 дата публикации

Mixed targets for forming a cadmium doped tin oxide buffer layer in a thin film photovoltaic devices

Номер: US20130134037A1
Принадлежит: Primestar Solar Inc

Ceramic sputtering targets and mixed metal targets are generally provided for forming a resistive transparent buffer layer. The ceramic sputtering target can include tin, oxygen, and cadmium (and optionally zinc) in relative amounts such that cadmium is included in an atomic amount that is less than 33% of a total atomic amount of tin and cadmium. For example, the ceramic sputtering target can include tin oxide and cadmium oxide (and optionally zinc oxide) in relative amounts such that cadmium (and optional zinc) is included in an atomic amount that is less than 33% of a total atomic amount of tin and cadmium (and optional zinc). The mixed metal sputtering target can include tin and cadmium such that cadmium is included in an atomic amount that is less than 33% of a total atomic amount of tin and cadmium. The mixed metal sputtering target can further include zinc.

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30-05-2013 дата публикации

Method of generating high purity bismuth oxide

Номер: US20130136919A1
Принадлежит: Intermolecular Inc

A method for forming and protecting high quality bismuth oxide films comprises depositing a transparent thin film on a substrate comprising one of Si, alkali metals, or alkaline earth metals. The transparent thin film is stable at room temperature and at higher temperatures and serves as a diffusion barrier for the diffusion of impurities from the substrate into the bismuth oxide. Reactive sputtering, sputtering from a compound target, or reactive evaporation are used to deposit a bismuth oxide film above the diffusion barrier.

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30-05-2013 дата публикации

METHOD OF GENERATING HIGH PURITY BISMUTH OXIDE

Номер: US20130136921A1
Принадлежит: Intermolecular Inc.

A method for forming and protecting high quality bismuth oxide films comprises depositing a transparent thin film on a substrate comprising one of Si, alkali metals, or alkaline earth metals. The transparent thin film is stable at room temperature and at higher temperatures and serves as a diffusion barrier for the diffusion of impurities from the substrate into the bismuth oxide. Reactive sputtering, sputtering from a compound target, or reactive evaporation are used to deposit a bismuth oxide film above the diffusion barrier. 1. A device structure comprising:a transparent substrate, wherein the transparent substrate comprises glass, and wherein the substrate comprises at least one of Si or alkali metals, or alkaline earth metals;a first layer, wherein the first layer is transparent and wherein the first layer is operable as a diffusion barrier, and wherein the first layer is one of a transparent conductive oxide material or a dielectric material; anda bismuth oxide layer.2. The device structure of wherein the first layer is at least one of SnO claim 1 , Al-doped tin oxide (Al:SnOx) claim 1 , Mg-doped tin oxide (Mg:SnOx) SnZnO claim 1 , tin-doped aluminum oxide (Sn:AlOx) claim 1 , tin-doped magnesium oxide (Sn:MgOx) claim 1 , indium tin oxide (ITO) claim 1 , TiO claim 1 , SiTiO claim 1 , or SiN.3. The device structure of wherein the first layer is TiO.4. The device structure of wherein the first layer has a thickness between about 0.5 nm and about 100 nm.5. The device structure of wherein the first layer has a thickness between about 3 nm and about 15 nm.6. The device structure of wherein the thickness of the first layer is about 10 nm.7. The device structure of wherein the bismuth oxide layer has a thickness between about 10 nm and about 1000 nm.8. The device structure of wherein the bismuth oxide layer has a thickness of about 100 nm.9. The device structure of wherein the bismuth oxide layer has a thickness between about 10 nm and about 1000 nm.10. The device ...

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06-06-2013 дата публикации

OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME

Номер: US20130140175A1
Принадлежит: IDEMITSU KOSAN CO., LTD.

A field effect transistor including a semiconductor layer including a composite oxide which contains In, Zn, and one or more elements X selected from the group consisting of Zr, Hf, Ge, Si, Ti, Mn, W, Mo, V, Cu, Ni, Co, Fe, Cr, Nb, Al, B, Sc, Y and lanthanoids in the following atomic ratios (1) to (3): 1. A target comprising a composite oxide which comprises In , Zn , and one or more elements X selected from the group consisting of Zr , Hf , Ge , Si , Ti , Mn , W , Mo , V , Cu , Ni , Co , Fe , Cr , Nb , Al , B , Sc , Y , La , Ce , Pr , Nd , Sm , Eu , Gd , Tb , Dy , Ho , Er , Tm , Yb and Lu in the following atomic ratios (1) to (3):{'br': None, 'In/(In+Zn)=0.2 to 0.8\u2003\u2003(1)'}{'br': None, 'In/(In+X)=0.29 to 0.99\u2003\u2003(2)'}{'br': None, 'Zn/(X+Zn)=0.29 to 0.99\u2003\u2003(3).'}2. The target according to claim 1 , wherein In/(In+Zn)=0.3 to 0.75 claim 1 , In/(In+X)=0.59 to 0.98 claim 1 , and Zn/(X+Zn)=0.45 to 0.98.3. The target according to claim 1 , wherein In/(In+Zn)=0.35 to 0.7 claim 1 , In/(In+X)=0.6 to 0.97 claim 1 , and Zn/(X+Zn)=0.6 to 0.98.4. The target according to claim 1 , comprising a composite oxide which comprises In claim 1 , Zn claim 1 , and one or more elements X selected from the group consisting of Zr claim 1 , Hf claim 1 , Ge claim 1 , Si claim 1 , Ti claim 1 , Mn claim 1 , Mo claim 1 , V claim 1 , Cu claim 1 , Co claim 1 , Cr claim 1 , Nb claim 1 , Al claim 1 , B claim 1 , Sc claim 1 , Y claim 1 , Ce claim 1 , Pr claim 1 , Nd claim 1 , Sm claim 1 , Eu claim 1 , Gd claim 1 , Tb claim 1 , Dy claim 1 , Er claim 1 , Tm claim 1 , Yb and Lu.5. The target according to claim 1 , comprising a composite oxide which comprises In claim 1 , Zn claim 1 , and one or more elements X selected from the group consisting of Zr claim 1 , Hf claim 1 , Ge claim 1 , Si claim 1 , Ti claim 1 , Mn claim 1 , Mo claim 1 , V claim 1 , Cu claim 1 , Co claim 1 , Cr claim 1 , Nb claim 1 , Al claim 1 , B claim 1 , Sc claim 1 , and Y.6. The target according to claim 1 , ...

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06-06-2013 дата публикации

SPUTTERING TARGET

Номер: US20130140502A1
Принадлежит:

An oxide sintered body including an oxide of indium (In), gallium (Ga), and positive trivalent and/or positive tetravalent metal X, wherein the amount of the metal X relative to the total amount of In and Ga is 100 to 10000 ppm (weight). 1. An oxide sintered body comprising an oxide of indium (In) , gallium (Ga) , and positive trivalent and/or positive tetravalent metal X , whereinthe amount of the metal X relative to the total amount of In and Ga is 100 to 10000 ppm (weight).2. The oxide sintered body according to claim 1 , wherein the metal X is one or more selected from Sn claim 1 , Zr claim 1 , Ti claim 1 , Ge and Hf.3. The oxide sintered body according to claim 1 , wherein the metal X comprises Sn.4. The oxide sintered body according to any of claim 1 , wherein an atomic ratio Ga/(Ga+In) is 0.005 to 0.15.5. The oxide sintered body according to any of claim 1 , wherein the bulk resistivity is 10 mΩcm or less.6. The oxide sintered body according to any of claim 1 , wherein the particle size of dispersed gallium is 1 μm or less.7. The oxide sintered body according to any of claim 1 , wherein gallium and metal X are dispersed in the solid-solution state in the bixbyite structure of InO.8. A method for producing the oxide sintered body according to any of claim 1 , comprising the steps of:mixing indium compound powder having an average particle size of less than 2 μm, gallium compound powder having an average particle size of less than 2 μm and metal X compound powder having an average particle size of less than 2 μm such that the atomic ratio Ga/(In+Ga) becomes 0.001 to 0.10 and the amount of the metal X relative to the total amount of In and Ga becomes 100 to 10000 ppm;shaping the mixture to prepare a shaped body; andfiring the shaped body at 1200 to 1600° C. for 2 to 96 hours.9. The method for producing an oxide sintered body according to claim 8 , wherein the firing is conducted in the atmosphere of oxygen or under pressure.10. A sputtering target comprising the ...

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06-06-2013 дата публикации

Device housing and method for making same

Номер: US20130143063A1
Автор: Da-Hua Cao, Xu Liu

The device housing includes a substrate having a bonding layer, a hard layer, and a color layer formed thereon, and in that order. The bonding layer is made of metal. The hard layer substantially consists of elemental Cr and elemental C. The color layer substantially consists of elemental Cr, elemental O, and elemental N. The atomic ratio of the elemental Cr, elemental O, and elemental N within the color layer is about (0.8-1.0):(1.2-1.5):(0.3-0.5). The color layer provides a bright blue color for the device housing. A method for making the device housing is also described.

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20-06-2013 дата публикации

Multilayer transparent electroconductive film and method for manufacturing same, as well as thin-film solar cell and method for manufacturing same

Номер: US20130153024A1
Принадлежит: SUMITOMO METAL MINING CO LTD

A multilayer transparent electroconductive film is obtained by stacking a transparent electroconductive film (II) on a transparent electroconductive film (I), and in this structure, the transparent electroconductive film (I) contains one or more added elements selected from aluminum and gallium, and the content of the added elements is in a range represented by −2.18×[Al]+1.74≦[Ga]≦−1.92×[Al]+6.10. The transparent electroconductive film (II) contains one or more added elements selected from aluminum and gallium, and the content of the added elements is in a range represented by −[Al]+0.30≦[Ga]≦−2.68×[Al]+1.74. In this case, [Al] is the aluminum content expressed as the atomic ratio (%) Al/(Zn+Al) and [Ga] is the gallium content expressed as the atomic ratio (%) Ga/(Zn+Ga).

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20-06-2013 дата публикации

MULTILAYER NITRIDE HARD COATINGS

Номер: US20130157023A1
Принадлежит: Kennametal lnc.

A wear resistant multilayer nitride hard coating for substrates. The hard coating includes a first layer of titanium aluminum nitride and a second layer comprising a plurality of sublayer groups. Each sublayer group includes a first sublayer of titanium silicon nitride and a second sublayer of titanium aluminum nitride. The composition of the titanium aluminum nitride, both in the first layer and in the sublayer groups, is (TiAl)N, wherein 0.4≦x≦0.6. The composition of the titanium silicon nitride sublayers is (TiSi)N, wherein 0.85≦y≦0.98, and all of the silicon is in solid solution in the titanium silicon nitride such that no silicon phase or silicon nitride phase exists in this sublayer. The combined amount of aluminum and silicon present in the sublayer groups being narrowly controlled such that the sum of x and y is in the range of 1.38 to 1.46. 1. A hard coating for a substrate comprising:{'sub': z', '1-x, 'a first layer deposited by physical vapor deposition comprising (TiAl)N, wherein 0.4≦z≦0.6; and'}{'sub': y', '1-y', 'x', '1-x, 'a second layer deposited by physical vapor deposition having a plurality of sublayer groups, a sublayer group comprising a first sublayer of (TiSi)N, wherein 0.85≦y≦0.98, and a second sublayer of (TiAl)N, wherein 0.4≦z≦0.6;'}wherein neither a pure silicon phase nor a pure silicon nitride phase is present in the first sublayer and the sum or x and y is in the range of 1.38 to 1.46.2. The hard coating of claim 1 , wherein the first layer accounts for 20 to 60 percent of the overall coating thickness.3. The hard coating of claim 1 , wherein the thickness of the sublayer group is in the range of 3 to 20 nm.4. The hard coating of claim 1 , wherein the sublayer groups are adjacently stacked.5. The hard coating of claim 1 , wherein x and z are substantially equal in value.6. The hard coating of claim 1 , wherein x and z are different in value.7. The hard coating of claim 1 , wherein the (TiAl)N of the first layer comprises hexagonal close- ...

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04-07-2013 дата публикации

Hard coating layer and method for forming the same

Номер: US20130171474A1
Автор: Jae-In Jeong, Ji-Hoon YANG

The present invention relates to hard coating layer and a method for forming the hard coating layer. A method for forming hard coating layer which comprises: washing a substrate; installing the washed substrate in a vacuum equipment, and vacuating the chamber of the vacuum equipment; cleaning the substrate; forming oblique coating layer on the substrate; and forming vertical coating layer, vertically to the substrate, on the oblique coating layer by applying bias-voltage after forming oblique coating layer is provided. According to present invention, hardness of coating layer may be enhanced by forming a oblique coating layer and vertical coating layer on a substrate.

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25-07-2013 дата публикации

Method for manufacturing conductive film roll

Номер: US20130186547A1
Принадлежит: Nitto Denko Corp

A method for manufacturing a conductive film roll includes step (A), step (B), and step (C). Step (A) is laminating a first transparent conductor layer and a first metal layer on one surface of a film substrate while rewinding a first roll of the film substrate to obtain a first laminate. Step (B) is conveying the first laminate in air while rewinding a second roll and forming an oxidized coated layer on a surface of the first metal layer to obtain a second laminate. Step (C) is manufacturing a third laminate by laminating a second transparent conductor layer and a second metal layer on the other surface of the film substrate to obtain a fourth roll. Operation effects of the oxidized coated layer prevents blocking.

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01-08-2013 дата публикации

Shadow mask and compensating design method thereof

Номер: US20130192521A1
Принадлежит: Innolux Corp

The disclosure provides a compensating design method for a shadow mask including: providing a first shadow mask having a first opening pattern and a first material pattern; disposing the first shadow mask on a substrate having a predetermined depositing film area with first and second sides; performing a deposition process by using the first shadow mask as a mask to form a film on an actual depositing film area, wherein the distance between the first and the third sides is a first bias, and the distance between the second and the fourth sides is a second bias, and a single side gray zone of the actual depositing film area relative to the predetermined depositing film area is substantially half of the sum of the first and the second biases; and designing a second shadow mask according to the single side gray zone.

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01-08-2013 дата публикации

Reflective substrate and method of manufacturing the same

Номер: US20130194652A1

A reflective substrate, the transmittance of visible light of which is improved, and a method of manufacturing the same. The reflective substrate includes a glass substrate, an oxide or nitride film formed on the glass substrate, and vanadium dioxide (VO 2 ) film formed on the oxide or nitride film.

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01-08-2013 дата публикации

Vapor deposition method, vapor deposition device and organic el display device

Номер: US20130196454A1
Принадлежит: Sharp Corp

A coating film ( 90 ) is formed by causing vapor deposition particles ( 91 ) discharged from a vapor deposition source opening ( 61 ) of a vapor deposition source ( 60 ) to pass through a space between a plurality of control plates ( 81 ) of a control plate unit ( 80 ) and a mask opening ( 71 ) of a vapor deposition mask in this order and adhere to a substrate, while the substrate ( 10 ) is moved relative to the vapor deposition mask ( 70 ) in a state in which the substrate ( 10 ) and the vapor deposition mask ( 70 ) are spaced apart at a fixed interval. A difference in the amount of thermal expansion between the vapor deposition source and the control plate unit is detected and corrected. It is thereby possible to form, at a desired position on a large-sized substrate, the coating film in which edge blur and variations in the edge blur are suppressed.

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15-08-2013 дата публикации

Ferromagnetic Sputtering Target

Номер: US20130206592A1
Принадлежит: JX NIPPON MINING & METALS CORPORATION

Provided is a ferromagnetic sputtering target having a metal composition comprising 20 mol % or less of Cr, 5 mol % or more of Pt, and the balance of Co, wherein the target includes a metal base (A) and two different phases (B) and (C) in the metal base (A), the phase (B) being a Co—Ru alloy phase containing 30 mol % or more of Ru, and the phase (C) being a metal or alloy phase primarily composed of Co or a Co alloy. The present invention improves the leakage magnetic flux to provide a ferromagnetic sputtering target that can perform stable discharge with a magnetron sputtering device. 1. A ferromagnetic sputtering target having a metal composition comprising 20 mol % or less of Cr , 0.5 mol % or more and 30 mol % or less of Ru , and the balance of Co , wherein the target includes a metal base (A) and two different phases (B) and (C) in the metal base (A) , the phase (B) being a Co—Ru alloy phase containing 30 mol % or more of Ru , and the phase (C) being a metal or alloy phase primarily composed of Co or a Co alloy.2. A ferromagnetic sputtering target having a metal composition comprising 20 mol % or less of Cr , 0.5 mol % or more and 30 mol % or less of Ru , 0.5 mol % or more of Pt , and the balance of Co , wherein the target structure includes a metal base (A) and two different phases (B) and (C) in the metal base (A) , the phase (B) being a Co—Ru alloy phase containing 30 mol % or more of Ru , and the phase (C) being a metal or alloy phase primarily composed of Co or a Co alloy.3. The ferromagnetic sputtering target according to claim 2 , wherein the metal or alloy phase (C) contains 90 mol % or more of Co.4. The ferromagnetic sputtering target according to claim 3 , further comprising 0.5 mol % or more and 10 mol % or less of at least one element selected from the group consisting of B claim 3 , Ti claim 3 , V claim 3 , Mn claim 3 , Zr claim 3 , Nb claim 3 , Ru claim 3 , Mo claim 3 , Ta claim 3 , W claim 3 , Si claim 3 , and Al.5. The ferromagnetic sputtering ...

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03-10-2013 дата публикации

Method For Manufacturing A Thin Film On A Substrate

Номер: US20130260026A1
Принадлежит: SIEMENS AG

A method for maufacturing a thin film on a substrate may include: coupling the substrate to a pretensioning facility such that the substrate with the pretensioning facility is isotropically extended in the surface, wherein the substrate is held elastically under pressure with a predetermined pretension; depositing a thin film material on the substrate with a deposition method, in which by applying heat to the thin film material, this is deposited on the substrate so that a thin film with the thin film material is embodied on the substrate; decoupling the substrate from the pretensioning facility; cooling the thin film accompanied by a shrinkage, wherein the predetermined pretension is at least high enough that the appearance of a tensile stress in the thin film is prevented in the case of shrinkage.

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17-10-2013 дата публикации

Deposition method, deposition film, and method for producing organic electroluminescence display device

Номер: US20130273679A1
Принадлежит: Sharp Corp

A vapor deposition method of the present invention includes the steps of (i) preparing a mask unit including a shadow mask ( 81 ) and a vapor deposition source ( 85 ) fixed in position relative to each other, (ii) while moving at least one of the mask unit and the film formation substrate ( 200 ) relative to the other, depositing a vapor deposition flow, emitted from the vapor deposition source ( 85 ), onto a vapor deposition region ( 210 ), and (iii) adjusting the position of a second shutter ( 111 ) so that the second shutter ( 111 ) blocks a vapor deposition flow traveling toward the vapor deposition unnecessary region ( 210 ).

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24-10-2013 дата публикации

SINTERED OXIDE MATERIAL, METHOD FOR MANUFACTURING SAME, SPUTTERING TARGET, OXIDE TRANSPARENT ELECTRICALLY CONDUCTIVE FILM, METHOD FOR MANUFACTURING SAME, AND SOLAR CELL

Номер: US20130276879A1
Принадлежит: TOSOH CORPORATION

The invention provides an oxide sintered compact composed of a crystal phase which consists of a bixbite-type oxide phase and a perovskite-type oxide phase, or a bixbite-type oxide phase, the crystal phase having indium, tin, strontium and oxygen as the constituent elements, and the indium, the tin and the strontium contents satisfying formulas (1) and (2) in terms of atomic ratio, as well as a sputtering target. There are further provided an oxide transparent conductive film formed using the sputtering target, and a solar cell. 2. The oxide sintered compact according to claim 1 , which is composed of the crystal phase which consists of the bixbite-type oxide phase and the perovskite-type oxide phase claim 1 ,both the bixbite-type oxide phase and the perovskite-type oxide phase containing indium, tin, strontium and oxygen as constituent elements, andwherein the oxide sintered compact contains no tin oxide phase or strontium oxide phase.3. The oxide sintered compact according to claim 1 , wherein strontium is present only in the perovskite-type oxide phase.4. The oxide sintered compact according to claim 1 , wherein the mean particle size of the perovskite-type oxide phase is no greater than 5 μm.6. A sputtering target comprising an oxide sintered compact according to .7. A method for manufacturing an oxide transparent conductive film claim 6 , comprising a step of sputtering using a sputtering target according to .9. An oxide transparent conductive film obtained by the manufacturing method according to .13. The solar cell according to claim 10 , wherein the photoelectric conversion layer is a silicon-based semiconductor.14. The solar cell according to claim 10 , wherein the photoelectric conversion layer is a compound semiconductor.15. The solar cell according to claim 14 , wherein the compound semiconductor has a p-type zinc blende-related structure.16. The solar cell according to claim 15 , wherein the compound semiconductor with a p-type zinc blende-related ...

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31-10-2013 дата публикации

METHODS OF MAKING DEVICES

Номер: US20130287931A1
Принадлежит:

The method of making devices is disclosed herein. More particularly, a method of manufacturing a device, comprises: vacuum depositing a device-forming metal onto an unpatterned, exterior surface of a generally cylindrical substrate to form a generally tubular, unpatterned crystalline metal film under at least one vacuum deposition process condition selected from at least one of chamber pressure, deposition pressure, and partial pressure of a process gas, said at least one process condition optimized to substantially eliminate formation of chemical and intra- and intergranular precipitates in the bulk material; and removing the deposited generally tubular, unpatterned crystalline metal film from the generally cylindrical substrate. 1. A method of manufacturing a device , comprising:a. vacuum depositing a device-forming metal onto an unpatterned, exterior surface of a generally cylindrical substrate to form a generally tubular, unpatterned crystalline metal film under at least one vacuum deposition process condition selected from at least one of chamber pressure, deposition pressure, and partial pressure of a process gas, said at least one process condition optimized to substantially eliminate formation of chemical and intra- and intergranular precipitates in the bulk material; andb. removing the deposited generally tubular, unpatterned crystalline metal film from the generally cylindrical substrate.2. The method according to claim 1 , further comprising a step of depositing a sacrificial material layer onto the substrate prior to step (a) and removing the sacrificial material layer in order to remove the deposited generally tubular claim 1 , unpatterned crystalline metal film from the substrate in step (b) claim 1 , and wherein the process condition controlled is a deposition rate and the deposition rate is no less than about 20 nm/sec.3. The method according to claim 1 , wherein step (a) is conducted by ion beam-assisted evaporative deposition.4. The method ...

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14-11-2013 дата публикации

Method for depositing a transparent barrier layer system

Номер: US20130302536A1

The invention relates to a method for producing a transparent bather layer system, wherein in a vacuum chamber at least two transparent barrier layers and a transparent intermediate layer disposed between the two barrier layers are deposited on a transparent plastic film, wherein for deposition of the barrier layers aluminium is vaporised and simultaneously at least one first reactive gas is introduced into the vacuum chamber and wherein for deposition of the intermediate layer aluminium is vaporised and simultaneously at least one second reactive gas and a gaseous or vaporous organic component are introduced into the vacuum chamber.

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21-11-2013 дата публикации

APPARATUS FOR DEPOSITING ORGANIC MATERIAL AND DEPOSITING METHOD THEREOF

Номер: US20130309403A1
Принадлежит:

An apparatus for depositing an organic material and a depositing method thereof, wherein a deposition process is performed with respect to a second substrate while transfer and alignment processes are performed with respect to a first substrate in a chamber, so that loss of an organic material wasted in the transfer and alignment processes can be reduced, thereby maximizing material efficiency and minimizing a processing tack time. The apparatus includes a chamber having an interior divided into a first substrate deposition area and a second substrate deposition area, an organic material deposition source transferred to within ones of the first and second substrate deposition areas to spray particles of an organic material onto respective ones of first and second substrates and a first transferring unit to rotate the organic material deposition source in a first direction from one of the first and second substrate deposition areas to an other of the first and second substrate deposition areas. 17-. (canceled)8. A method of depositing an organic material , comprising:transferring a first substrate into a first substrate deposition area of a chamber and performing an alignment process on the first substrate;transferring a deposition source to within the first substrate deposition area to perform a deposition process on the first substrate after completion of the alignment process on the first substrate;transferring a second substrate into a second substrate deposition area of the chamber and performing an alignment process on the transferred second substrate while the deposition process on the first substrate is being performed;transferring the deposition source to the second substrate deposition area by rotating the deposition source in a first direction when the deposition process on the first substrate and the alignment process on the second substrate are completed; andtransferring the deposition source within the second substrate deposition area to perform the ...

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21-11-2013 дата публикации

HARD LAMINAR COATING

Номер: US20130309467A1
Автор: Toihara Takaomi
Принадлежит: OSG CORPORATION

It is provided a hard laminar coating consisting of a plurality of films including two kinds of films in the form of a first film and a second film having respective different compositions and alternately laminated on a surface of a base structure, wherein the first film is an oxide or an oxynitride of (TiB), while the second film is TiB. 1. A hard laminar coating consisting of a plurality of films including two kinds of films in the form of a first film and a second film having respective different compositions and alternately laminated on a surface of a base structure , wherein said first film is an oxide or an oxynitride of (TiB) , while said second film is TiB.2. The hard laminar coating according to claim 1 , wherein an atomic ratio a in said first film satisfies 0.02≧a≧0.7 claim 1 , and a thickness of said first film is no less than 0.1 μm and no more than 5.0 μm claim 1 , while a thickness of said second film is no less than 0.1 μm and no more than 5.0 μm claim 1 , said hard laminar coating having a total thickness of no less than 0.2 μm and no more than 10.0 μm.3. The hard laminar coating according to claim 1 , wherein said hard laminar coating consists of no less than 2 and no more than 100 layers claim 1 , which are laminated on each other. The present invention relates to a hard laminar coating including two kinds of films having respective different compositions and alternately laminated on a surface of a base structure, and more particularly to an improvement of properties of the hard laminar coating.Various hard laminar coatings including two kinds of films in the form of a first film and a second film having respective different compositions and alternately laminated on each other have been proposed, as a wear resistant hard laminar coating provided on a surface of a base structure of a tool of a high-speed tool steel or a cemented carbide. Patent Documents 1 and 2 disclose examples of such hard laminar coatings, wherein two kinds of films formed of ...

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21-11-2013 дата публикации

SLIDING MEMBER AND METHOD FOR MANUFACTURING THE SAME

Номер: US20130309522A1

Provided is a sliding member having slidability and abrasion resistance both at satisfactory levels. This sliding member has a sliding surface including a base and a filling part. The base includes a first material and bears regularly arranged concavities. The filling part includes a second material and is arranged in the sliding surface to fill the concavities. The first material includes one selected from the group consisting of a metallic material, a ceramic material, and a carbonaceous material. The second material includes at least one selected from the group consisting of a metallic material, a ceramic material, and a carbonaceous material. The first and second materials differ from each other in at least one of frictional coefficient and hardness. The base and the filling part are substantially flush with each other in the sliding surface. 1. A sliding member comprising a sliding surface , the sliding surface comprising:a base; and the base comprising a first material and having concavities regularly arranged in the sliding surface; and', 'the filling part comprising a second material and arranged in the sliding surface to fill the concavities,, 'a filling part,'}wherein:the first material comprises one material selected from the group consisting of metallic materials, ceramic materials, and carbonaceous materials;the second material comprises at least one material selected from the group consisting of metallic materials, ceramic materials, and carbonaceous materials;the first and second materials differ from each other in at least one of frictional coefficient and hardness; andthe base and the filling part are substantially flush with each other in the sliding surface.2. A sliding member comprising a sliding surface , the sliding surface comprising:a base;a filling part; and the base comprising a first material and having concavities regularly arranged in the sliding surface;', 'the filling part comprising a second material and arranged in the sliding ...

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28-11-2013 дата публикации

OXIDE SINTERED BODY AND SPUTTERING TARGET

Номер: US20130313110A1
Принадлежит: KOBELCO RESEARCH INSTITUTE, INC.

Provided is an oxide sintered body suitably used for the production of an oxide semiconductor film for a display device, wherein the oxide sintered body has both high conductivity and relative density, and is capable of depositing an oxide semiconductor film having high carrier mobility. This oxide sintered body is obtained by mixing and sintering powders of zinc oxide, tin oxide and indium oxide, and when an EPMA in-plane compositional mapping is performed on the oxide sintered body the percentage of the area in which Sn concentration is 10 to 50 mass % in the measurement area is 70 area percent or more. 1. An oxide sintered body , comprising: powders of zinc oxide , tin oxide , and indium oxide ,wherein when an EPMA in-plane compositional mapping is performed on the oxide sintered body, a percentage of an area in which Sn concentration is from 10 to 50 mass % in a measurement area is 70 area % or more.2. The oxide sintered body according to claim 1 , wherein when the EPMA in-plane compositional mapping is performed on the oxide sintered body claim 1 , a percentage of an area in which In concentration is from 2 to 35 mass % in a measurement area is 70 area % or more.3. The oxide sintered body according to claim 1 , whereina ratio of [In]/([Zn]+[Sn]+[In]) is from 0.01 to 0.30,a ratio of [Sn]/([Zn]+[Sn]) is from 0.20 to 0.60, and[Zn], [Sn], and [In] represent contents by atomic % of respective metal elements in the oxide sintered body.4. The oxide sintered body according to claim 3 , whereinthe ratio of [In]/([Zn]+[Sn]+[In]) is from 0.10 to 0.30; andthe ratio of [Sn]/([Zn]+[Sn]) is from 0.33 to 0.60.5. The oxide sintered body according to claim 1 , wherein the oxide sintered body has a relative density of 90% or more claim 1 , and a specific resistance of 1 Ω·cm or less.6. A sputtering target claim 1 , comprising the oxide sintered body according to claim 1 , wherein the sputtering target has a relative density of 90% or more claim 1 , and a specific resistance of 1 ...

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28-11-2013 дата публикации

Oxide semiconductor field effect transistor and method for manufacturing the same

Номер: US20130313548A1
Принадлежит: Idemitsu Kosan Co Ltd

A field effect transistor including a semiconductor layer including a composite oxide which contains In, Zn, and one or more elements X selected from the group consisting of Zr, Hf, Ge, Si, Ti, Mn, W, Mo, V, Cu, Ni, Co, Fe, Cr, Nb, Al, B, Sc, Y and lanthanoids in the following atomic ratios (1) to (3): In/(In+Zn)=0.2 to 0.8  (1) In/(In+X)=0.29 to 0.99  (2) Zn/(X+Zn)=0.29 to 0.99  (3).

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05-12-2013 дата публикации

Method for coating with an evaporation material

Номер: US20130323407A1
Автор: Anton Lang, Paul Wurzinger
Принадлежит: LEICA MIKROSYSTEME GMBH

An apparatus for depositing a material layer on a sample inside a vacuum chamber comprises a sample stage ( 100 ) for arranging at least one sample ( 103 a, 103 b, 103 c, 103 d ); an evaporation source ( 101, 201 ), connected to a current source, for a thread-shaped evaporation material ( 102, 202 ); a quartz oscillator ( 105 ) for measuring the deposited material layer thickness; and an evaluation device ( 113 ) associated with the oscillator ( 105 ). An electronic control system ( 112 ) associated with the evaporation source ( 101, 201 ) is configured to deliver electric current in the form of at least two current pulses having a pulse length less than or equal to 1 s. The evaluation device ( 113 ) takes into account transient decay behavior of the oscillator ( 105 ) immediately after a current pulse to derive the material layer thickness deposited after each pulse. The invention further relates to a method that can be carried out using said apparatus.

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05-12-2013 дата публикации

Zinc oxide film-forming composition, zinc oxide film production method, and zinc compound

Номер: US20130323413A1
Принадлежит: Adeka Corp

Disclosed are a composition for forming a zinc oxide-based film, said composition containing, as an essential component, a zinc compound represented by the following formula (1): wherein R 1 and R 2 mutually independently represent an alkyl group having 1 to 4 carbon atoms, a process for producing the zinc oxide-based film, and the zinc compound. The composition makes it possible to form a high-quality zinc oxide-based film, which has transparency, homogeneity and electrical conductivity, at a low temperature of 300° C. or lower.

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05-12-2013 дата публикации

Vapor deposition particle emitting device, vapor deposition apparatus, vapor deposition method

Номер: US20130323882A1
Принадлежит: Individual

A vapor deposition particle injection device ( 30 ) includes a vapor deposition particle generating section ( 41 ), at least one nozzle stage made of an intermediate nozzle section ( 51 ), a vapor deposition particle emitting nozzle section ( 61 ), and heat exchangers ( 43, 63, 53 ). The vapor deposition particle emitting nozzle section ( 61 ) is controlled so as to be at a temperature lower than a temperature at which a vapor deposition material turns into gas. Meanwhile, the intermediate nozzle section ( 51 ) is controlled by the heat exchanger ( 53 ) so as to be at a temperature between a temperature of the vapor deposition particle generating section ( 41 ) and a temperature of the vapor deposition particle emitting nozzle section ( 61 ).

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02-01-2014 дата публикации

SPUTTERING TARGET AND OXIDE SEMICONDUCTOR FILM

Номер: US20140001040A1
Принадлежит: IDEMITSU KOSAN CO., LTD.

A sputtering target containing oxides of indium (In), gallium (Ga) and zinc (Zn), which includes a compound shown by ZnGaOand a compound shown by InGaZnO. 113-. (canceled)14. A sputtering target comprising a compound shown by InGaZnOas a main component , which further contains a metal element with an atomic valency of positive tetravalency or higher wherein the content of the metal element with an atomic valency of positive tetravalency or higher is 100 ppm to 10000 ppm relative to the total metal elements in the sputtering target.15. (canceled)16. The sputtering target according to claim 14 , wherein the content of the metal element with an atomic valency of positive tetravalency or higher is 200 ppm to 5000 ppm relative to the total metal elements in the sputtering target.17. The sputtering target according to claim 14 , wherein the content of the metal element with an atomic valency of positive tetravalency or higher is 500 ppm to 2000 ppm relative to the total metal elements in the sputtering target.18. The sputtering target according to claim 14 , which has a bulk resistance of less than 1×10Ωcm.19. The sputtering target according to claim 14 , wherein the metal element with an atomic valency of positive tetravalency or higher is at least one element selected from the group consisting of tin claim 14 , zirconium claim 14 , germanium claim 14 , cerium claim 14 , niobium claim 14 , tantalum claim 14 , molybdenum and tungsten.2023-. (canceled) The invention relates to a sputtering target and an oxide semiconductor film.An oxide semiconductor film comprising a metal complex oxide has a high degree of mobility and visible light transmission, and is used as a switching device, a driving circuit device or the like of a liquid crystal display, a thin film electroluminescence display, an electrophoresis display, a moving particle display or the like.Examples of an oxide semiconductor film comprising a metal complex oxide include an oxide semiconductor film comprising an ...

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02-01-2014 дата публикации

Vapor deposition device, vapor deposition method, and method for producing organic el display device

Номер: US20140004641A1
Принадлежит: Sharp Corp

A vapor deposition device ( 1 ) performs a vapor deposition treatment to form a luminescent layer ( 47 ) having a predetermined pattern on a film formation substrate ( 40 ). The vapor deposition device includes: a nozzle ( 13 ) having a plurality of injection holes ( 16 ) from which vapor deposition particles ( 17 ), which constitute the luminescent layer, are injected toward the film formation substrate when the vapor deposition treatment is carried out; and a plurality of control plates ( 20 ) provided between the nozzle and the film formation substrate and restricting an incident angle, with respect to the film formation substrate, of the vapor deposition particles injected from the plurality of injection holes. The nozzle includes: a nozzle main body ( 14 b ) in a container shape having an opening ( 14 c ) on a surface thereof on a film formation substrate side and (ii) a plurality of blocks ( 15 ) covering the opening and separated from each other, each of the plurality of blocks having the plurality of injection holes. The above arrangement allows a vapor-deposited film pattern to be formed with high definition.

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16-01-2014 дата публикации

Deposition particle emitting device, deposition particle emission method, and deposition device

Номер: US20140014036A1
Принадлежит: Sharp Corp

A vapor deposition particle emitting device of the present invention includes: a nozzle section ( 110 ) having emission holes ( 111 ) from which gaseous vapor deposition particles are emitted out; a heating plate unit ( 100 ), provided in the nozzle section ( 110 ), which is made up of heating plates ( 101 ) each having a surface on which a vapor deposition material remains as a result of adherence of vapor deposition particles to the surface; and a heating device ( 160 ) for heating the vapor deposition material, which is thus remaining on the surface of each of the heating plates ( 101 ), so that a temperature of the vapor deposition material is not less than a temperature at which to become transformed into gaseous form.

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30-01-2014 дата публикации

SPUTTERING PROCESS FOR SPUTTERING A TARGET OF CARBON

Номер: US20140027269A1
Принадлежит: Ionautics AB

The sputtering process according to the present disclosure comprises providing a target consisting of carbon in a sputtering apparatus, introducing a process gas essentially consisting of a neon or a gas mixture comprising at least 60% neon into said apparatus, applying a pulsed power discharge to said target in order to create a plasma of said process gas, sputtering said target by means of said plasma. The process is able to ionize a significant amount of sputtered carbon atoms. 1. Sputtering process for sputtering a target consisting of carbon , the process comprisingproviding a target essentially consisting of carbon in a magnetron sputtering apparatus or in a hollow cathode sputtering apparatus,introducing a process gas into said apparatus, the process gas essentially consisting of neon or a gas mixture comprising at least 60% neon,{'sup': '2', 'applying a pulsed electric power discharge to said target in order to create a plasma, wherein the peak power of each pulse is at least 0.1 kW per each cmof the active target surface area,'}sputtering said target by means of said plasma and ionizing sputtered carbon atoms by said plasma.2. Sputtering process in accordance with whereby said gas mixture further comprises at least one second noble gas other than neon.3. Sputtering process in accordance with wherein said gas mixture comprises at least 75% neon.4. Sputtering process in accordance with wherein said at least one second noble gas is argon.5. Sputtering process in accordance with wherein said process gas essentially consists of up to 10% of argon claim 4 , the remainder being neon.6. Sputtering process in accordance wherein said at least one second noble gas is krypton.7. Sputtering process in accordance with wherein said gas mixture further comprises a reactive gas.8. Sputtering process in accordance with wherein the peak power of each pulse is at least 1 kW per each cmof the active target surface area.9. Sputtering process in accordance with wherein the ...

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30-01-2014 дата публикации

AMORPHOUS CARBON FILM AND METHOD FOR FORMING SAME

Номер: US20140030512A1
Принадлежит: NTN CORPORATION

The present invention provides a film formation method capable of forming a favorable amorphous carbon film under a low vacuum by using a bipolar-type PBII apparatus and the amorphous carbon film to be produced by the film formation method. The film formation method is carried out to form the amorphous carbon film under a low vacuum (1000 to 30000 Pa) by using a power source for the bipolar-type PBII apparatus. There are provided inside a chamber () a power source side electrode () connected to a power source () for the PBII apparatus and a grounding side electrode () opposed to the power source side electrode (). A base material () is disposed on one of the power source side electrode () and the grounding side electrode (). Plasma of a noble gas and that of a hydrocarbon-based gas are generated between the base material () and the electrode where the base material () is not disposed to form the amorphous carbon film on a surface of the base material (). 1. A method for forming an amorphous carbon film under a low vacuum by using a power source for a bipolar-type plasma-based ion implantation apparatus ,wherein a power source side electrode connected to said power source for said plasma-based ion implantation apparatus and a grounding side electrode opposed to said power source side electrode are provided inside a chamber; a base material is disposed on one of said power source side electrode and said grounding side electrode; and plasma of a noble gas and that of a hydrocarbon-based gas are generated between said base material and said electrode where said base material is not disposed to form said amorphous carbon film on a surface of said base material.2. A method for forming an amorphous carbon film according to claim 1 , wherein a degree of vacuum inside said chamber is set to 1000 to 30000 Pa.3. A method for forming an amorphous carbon film according to claim 1 , wherein said hydrocarbon-based gas is introduced between said electrodes through a nozzle provided ...

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06-02-2014 дата публикации

Multifunctional Electrode

Номер: US20140038380A1
Принадлежит: Intermolecular Inc, Toshiba Corp

A nonvolatile memory element is disclosed comprising a first electrode, a near-stoichiometric metal oxide memory layer having bistable resistance, and a second electrode in contact with the near-stoichiometric metal oxide memory layer. At least one electrode is a resistive electrode comprising a sub-stoichiometric transition metal nitride or oxynitride, and has a resistivity between 0.1 and 10 Ωcm. The resistive electrode provides the functionality of an embedded current-limiting resistor and also serves as a source and sink of oxygen vacancies for setting and resetting the resistance state of the metal oxide layer. Novel fabrication methods for the second electrode are also disclosed.

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13-02-2014 дата публикации

Method for forming sputtering target

Номер: US20140042674A1
Автор: Shunpei Yamazaki
Принадлежит: Semiconductor Energy Laboratory Co Ltd

To provide a sputtering target which enables an oxide film containing a plurality of metal elements and having high crystallinity. A plurality of raw materials are mixed and first baking is performed thereon, whereby a crystalline oxide is formed. The crystalline oxide is ground to form a crystalline oxide powder. The crystalline oxide powder is mixed with water and an organic substance to make slurry, and the slurry is poured into a mold provided with a filter. The water and the organic substance are removed from the slurry through the filter, so that a molded body is formed. The residual water and the residual organic substance in the molded body are removed, and then second baking is performed.

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13-02-2014 дата публикации

Coating material for aluminum die casting mold and method of manufacturing the coating material

Номер: US20140044944A1
Принадлежит: Hyundai Motor Co, Kia Motors Corp

Disclosed is a coating material for an aluminum die casting mold and a method of manufacturing the coating material. The coating material includes a CrN bonding layer formed on a surface of a substrate, a TiAlN/CrN nano multi-layer disposed on a surface of the CrN bonding layer, and a TiAlN/CrSi(C)N nano multi-layer disposed on a surface of the TiAlN/CrSiCN nano multi-layer. The coating material for an aluminum die casting mold may maintain the physical properties of a mold under a high temperature environment due to the superior seizure resistance, heat resistance and high-temperature stability of the coating material, thereby extending the lifespan of the mold.

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06-03-2014 дата публикации

HYDROPHILIC COATINGS, METHODS FOR DEPOSITING HYDROPHILIC COATINGS AND IMPROVED DEPOSITION TECHNOLOGY FOR THIN FILMS

Номер: US20140061028A1
Автор: Hartig Klaus
Принадлежит: CARDINAL CG COMPANY

The invention provides certain embodiments that involve sputtering techniques for applying a mixed oxide film comprising silica and titania. In these embodiments, the techniques involve sputtering at least two targets in a common chamber (e.g., in a shared gaseous atmosphere). A first of these targets includes silicon, while a second of the targets includes titanium. Further, the invention provides embodiments involving a substrate bearing a hydrophilic coating, which can be deposited by sputtering or any other suitable thin film deposition technique. The invention also provides techniques and apparatuses useful for depositing a wide variety of coating types. For example, the invention provides thin film deposition technologies in which sputtering apparatuses or other thin film deposition apparatuses are employed. 1. A method for depositing coatings onto substrates , the method comprising:a) providing a coater having a substrate transport system defining a path of substrate travel extending through the coater, wherein one or more lower sputtering target(s) are mounted below the path of substrate travel or one or more upper sputtering target(s) are mounted above the path of substrate travel;b) providing an engineered glass sheet, the engineered glass sheet having a desired outer thickness defining a major surface of the engineered glass sheet, the engineered glass sheet being formed as part of a float glass process, the desired outer thickness providing a foundation for a hydrophilic coating, said desired outer thickness having a different composition than glass forming a core of the engineered glass sheet;c) positioning the engineered glass sheet on the transport system and conveying the glass sheet along the path of substrate travel, such that the desired outer thickness of the engineered glass sheet is conveyed over the one or more lower target(s) or under the one or more upper target(s); andd) sputtering the one or more lower target(s) or the one or more upper ...

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06-03-2014 дата публикации

MULTI-LAYER COATING AND METHOD FOR FORMING THE SAME

Номер: US20140065394A1
Принадлежит: HYUNDAI MOTOR COMPANY

Disclosed is a multi-layer coating formed by repeatedly and sequentially laminating first coating layers composed of TiN and second coating layers composed of TiAgN on a surface, and a method of forming the same. 1. A multi-layer coating comprising a plurality of alternating first coating layers composed of TiN and second coating layers composed of TiAgN.2. The multi-layer coating according to claim 1 , wherein each of the first coating layers and the second coating layers have an individual thickness of about 20˜300 nm.3. The multi-layer coating according to claim 1 , comprising a total of about 10˜30 first coating layers and second coating layers.4. The multi-coating layer according to claim 1 , comprising about 7˜20 at % Ag based on the entire atoms making up the second coating layer.5. A method of forming a multi-layer coating using a physical vapor deposition (PVD) device claim 1 , a Ti target claim 1 , an Ag target and Ngas claim 1 , the method comprising:{'sub': '2', 'a first coating step of coating a first coating layer of TiN on a base material surface by injecting Ngas as atmosphere gas and applying current to a Ti target;'}{'sub': '2', 'a second step of coating a second coating layer of TiAgN on the first coating layer by injecting Ngas as atmosphere gas and applying current to both of the Ti target and a Ag target; and'}a laminating step of repeatedly and sequentially laminating a plurality of first coating layers and second coating layer by repeatedly turning the current applied to the Ag target OFF and ON.6. The multi-layer coating method according to claim 5 , wherein the atmosphere gas is Ngas or Ar gas.7. The multi-layer coating method according to claim 5 , wherein the Ti target is installed at a sputter source unit and the Ag target is installed at an arc source unit to apply current.8. The multi-layer coating method according to claim 7 , wherein a current of about 1˜2.5 A is applied to the sputter source unit.9. The multi-layer coating method ...

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27-03-2014 дата публикации

Low emissivity coating stack and double glazing glass

Номер: US20140087100A1
Автор: Kazuya Yaoita
Принадлежит: Asahi Glass Co Ltd

To provide a low emissivity coating stack having a low emissivity for heat rays and having high visible light transmittance and near infrared transmittance. A low emissivity coating stack 1 comprising a transparent substrate 2 , and a thin film laminate portion 3 having at least a first titanium oxide-containing layer 31 containing an oxide of titanium, a low emissivity metal layer 33 containing silver as the main component and a second titanium oxide-containing layer 34 containing an oxide of titanium formed in this order on the transparent substrate 2 , which has a surface resistivity of at most 3.3Ω/□ and has a solar heat gain coefficient of at least 0.60 when formed into double glazing glass.

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03-04-2014 дата публикации

MAGNETIC STACK INCLUDING TiN-X INTERMEDIATE LAYER

Номер: US20140093748A1
Принадлежит: SEAGATE TECHNOLOGY LLC

A magnetic stack includes a substrate, a magnetic recording layer, and a TiN—X layer disposed between the substrate and the magnetic recording layer. In the TiN—X layer, X is a dopant comprising at least one of MgO, TiO, TiO, ZrN, ZrO, ZrO, HfN, HfO, AlN, and AlO. 1. A stack , comprising;a substrate;a magnetic recording layer; anda TiN-X layer disposed between the substrate and the magnetic recording layer, wherein X is a dopant.2. The stack of claim 1 , wherein X comprises at least one of MgO claim 1 , TiO claim 1 , TiO claim 1 , ZrN claim 1 , ZrO claim 1 , ZrO claim 1 , HfN claim 1 , HfO claim 1 , AlN claim 1 , and AlO.3. The stack of claim 1 , wherein the magnetic recording layer comprises:{'sub': '3', 'magnetic crystalline grains comprising at least one of FePt, FeXPt alloy, FePd, FeXPd, CoPt; and'}a non-magnetic segregant disposed between the crystalline grains and comprising at least one of an oxide, nitride, boride, and carbide material.4. The stack of claim 1 , wherein X is TiOand X is present in the TiN-X layer in an amount greater than 0 and less than or equal to about 40 vol. %.5. The stack of claim 1 , wherein X is ZnOand X is present in the TiN-X layer in an amount greater than 0 and less than or equal to about 30 vol. %.6. The stack of claim 1 , wherein:{'sub': '2', 'X comprises TiO; and'}the magnetic recording layer comprises magnetic crystalline grains and non-magnetic segregant disposed between the crystalline grains and the crystalline grains have an average diameter in the plane of the magnetic layer that is less than about 8.5 nm.7. The stack of claim 1 , wherein:{'sub': '2', 'X comprises ZnO; and'}the magnetic recording layer comprises magnetic crystalline grains and non-magnetic segregant disposed between the crystalline grains and the crystalline grains have an average diameter in the plane of the magnetic layer that is less than about 6 nm.8. The stack of claim 1 , wherein the magnetic recording layer comprises magnetic crystalline grains of ...

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06-01-2022 дата публикации

METAL MASK STRIP, METAL MASK PLATE, AND MANUFACTURING METHOD THEREOF

Номер: US20220002858A1
Автор: CHEN Yungsheng, JIANG Qian
Принадлежит:

The present invention provides a metal mask strip, a metal mask plate, and a manufacturing method thereof. The metal mask strip includes at least two mask sub-portions, which include: a non-light-transmitting region disposed at one end of the metal mask strip; a multiuse region disposed on a configuration side of a preset dividing line of a length of the metal mask strip, wherein the configuration side is on a same side as the non-light-transmitting region; and at least one light-transmitting region disposed between the non-light-transmitting region and the multiuse region. 1. A metal mask strip , comprising at least two mask sub-portions , wherein each of the mask sub-portions comprises:a non-light-transmitting region disposed at one end of the metal mask strip;a multiuse region disposed on a configuration side of a preset dividing line of a length of the metal mask strip, wherein the configuration side is on a same side as the non-light-transmitting region; andat least one light-transmitting region disposed between the non-light-transmitting region and the multiuse region.2. The metal mask strip according to claim 1 , wherein the metal mask strip comprises two mask sub-portions claim 1 , one of the mask sub-portions is disposed on one side of the metal mask strip claim 1 , and the other one of the mask sub-portions is disposed on the other side of the metal mask strip.3. The metal mask strip according to claim 2 , wherein lengths of the two mask sub-portions are equal.4. The metal mask strip according to claim 1 , wherein the multiuse region is a non-light-transmitting region when the metal mask strip is used in a first production line; andthe multiuse region is a light-transmitting region when the metal mask strip is used in a second production line.5. The metal mask strip according to claim 1 , wherein a first opening is defined at a configuration end of the non-light-transmitting region claim 1 , a second opening is defined at an end of the multiuse region ...

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06-01-2022 дата публикации

MASK ASSEMBLY AND DEPOSITION APPARATUS INCLUDING THE SAME

Номер: US20220002860A1
Автор: Lee Young Kwang
Принадлежит:

A mask assembly and a deposition apparatus including the same are provided. A mask assembly includes: a frame in which a frame opening is defined; a plurality of support sticks coupled with the frame to overlap the frame opening, each of the plurality of support sticks extending in a first direction, and the support sticks being arranged in a second direction crossing the first direction; and a mask on the frame and the support sticks, and extending in the second direction, and the support sticks have a magnetic moment of about 10 emu/g or more and about 100 emu/g or less. 1. A mask assembly comprising:a frame in which a frame opening is defined;a plurality of support sticks coupled with the frame to overlap the frame opening, each of the plurality of support sticks extending in a first direction, and the support sticks being arranged in a second direction crossing the first direction; anda mask on the frame and the support sticks, and extending in the second direction,wherein the support sticks have a magnetic moment of about 10 emu/g or more and about 100 emu/g or less.2. The mask assembly of claim 1 , wherein the mask has a magnetic moment greater than that of the support sticks.3. The mask assembly of claim 1 , wherein each of the support sticks has a thickness of about 20 μm or more and about 200 μm or less.4. The mask assembly of claim 1 , wherein each of the support sticks comprises stainless steel claim 1 , and the mask comprises nickel or nickel alloy.5. The mask assembly of claim 1 , wherein the mask comprises a plurality of deposition holes claim 1 ,a portion of the plurality of deposition holes are covered by the support sticks, andremaining ones of the plurality of deposition holes are exposed by the support sticks.6. The mask assembly of claim 1 , wherein the frame comprises:a first extension portion and a second extension portion, which face each other in the first direction; anda third extension portion and a fourth extension portion, which face each ...

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06-01-2022 дата публикации

Article Including a Wavelength Selective Absorbing Material

Номер: US20220003905A1
Принадлежит: VIAVI SOLUTIONS INC.

An article including a stack of layers including a high refractive index layer and a low refractive index layer; wherein at least one layer of the stack includes a wavelength selective absorbing material; and wherein the stack of layers has a transparent region with an edge at a wavelength in which light is absorbed by the wavelength selective absorbing material, and a reflection band with an edge at a wavelength in which light is reflected is disclosed. Compositions and optical devices including the article are also disclosed. Additionally, there is disclosed a method of making the article, the composition, and the optical device. 1. An article , comprising:a stack of layers including a high refractive index layer and a low refractive index layer;wherein at least one layer of the stack includes a wavelength selective absorbing material; andwherein the stack of layers has a transparent region with an edge at a wavelength in which light is absorbed by the wavelength selective absorbing material, and a reflection band with an edge at a wavelength in which light is reflected by the wavelength selective absorbing material.2. The article of claim 1 , wherein the high refractive index layer includes the wavelength selective absorbing material.3. The article of claim 1 , wherein the low refractive index layer includes the wavelength selective absorbing material.4. The article of claim 1 , wherein both the high refractive index layer and the low refractive index layer include the wavelength selective absorbing material.5. The article of claim 1 , wherein the wavelength selective absorbing material includes a metal sulfide claim 1 , a ternary system claim 1 , a metal oxide claim 1 , a pigment claim 1 , a dye claim 1 , and combinations thereof.6. The article of claim 5 , wherein the metal sulfide is chosen from copper (I) sulfide claim 5 , tin sulfide claim 5 , nickel sulfide claim 5 , silver sulfide claim 5 , lead sulfide claim 5 , molybdenum sulfide claim 5 , iron disulfide ...

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04-01-2018 дата публикации

METHOD FOR CREATING PATTERNS

Номер: US20180001582A1

The invention relates in particular to a method for creating patterns in a layer () to be etched, starting from a stack comprising at least the layer () to be etched and a masking, layer () on top of the layer () to be etched, the masking layer () having at least one pattern (), the method comprising at least; 1. A method for creating patterns in a layer to be etched , starting from a stack comprising at least the layer to be etched and a masking layer on top of the layer to be etched , the masking layer having at least one pattern , the method comprising:a) modifying at least one zone of the layer to be etched via ion implantation vertically in line with said at least one pattern of said masking layer; b1) enlarging said at least one pattern of said masking layer, said masking layer having been preserved after the step of modification in order to carry out the enlargement step, the enlarging being carried out in such a way as to enlarge said at least one pattern in a plane in which the layer to be etched mainly extends;', 'b2) modifying at least one zone of the layer to be etched via ion implantation vertically in line with the at least one enlarged pattern of said masking layer, the implantation being carried out over a depth less than the implantation depth of the preceding modification step; and, 'b) at least one sequence of steps comprisingc) removing the modified zones, the removal comprising etching the modified zones selectively with respect to the non-modified zones of the layer to be etched, said etching being wet etching,wherein the masking layer is a hard mask or the stack comprises a buffer layer positioned between the masking layer and the layer to be etched and covering, the layer to be etched during the implantation.2. The method according to claim 1 , wherein the etching uses a solution of tetramethylammonium hydroxide or hydrofluoric acid (HF).3. The method according to claim 1 , wherein the stack comprises a buffer layer positioned between the ...

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06-01-2022 дата публикации

DISPLAY SUBSTRATE, FINE METAL MASK SET AND DISPLAY DEVICE

Номер: US20220005885A1
Автор: Du Sen, JI Fengli, XIAO Leifang
Принадлежит:

A display substrate includes a plurality of first pixels and a plurality of second pixels alternately arranged in a first direction and a second direction. Each of the first pixels includes a first sub-pixel and a second sub-pixel, and each of the second pixels includes a third sub-pixel and a second sub-pixel. The second sub-pixels are evenly arranged in a matrix. The first sub-pixel and the third sub-pixel are both in a polygonal shape, and are alternately arranged in the first direction and the second direction. For one first sub-pixel and one third sub-pixel adjacent to each other in the first direction, a line connecting a vertex of the one first sub-pixel closest to the one third sub-pixel with a vertex of the one third sub-pixel closest to the one first sub-pixel intersects an extension line in the first direction and an extension line in the second direction. 1. A display substrate , wherein the display substrate comprises a plurality of sub-pixel groups , the plurality of sub-pixel groups are arranged in a first direction or a second direction , and at least one sub-pixel group comprises two first sub-pixels , two second sub-pixels and four third sub-pixels ,wherein, in the at least one sub-pixel group, each of the four third sub-pixels comprises at least one pair of parallel sides, and multiple pairs of parallel sides of the four third sub-pixels are parallel to one another, the multiple pairs of parallel sides of the four third sub-pixels are respectively parallel to at least one side of the first sub-pixel, and the multiple pairs of parallel sides of the four third sub-pixels are respectively parallel to at least one side of the second sub-pixel; andin the at least one sub-pixel group, one first sub-pixel and one second sub-pixel are located on a first side of the four third sub-pixels, and the other first sub-pixel and the other second sub-pixel are located on a second side of the four third sub-pixels, the second side is opposite to the first side, the ...

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04-01-2018 дата публикации

DEPOSITION MASK, DEPOSITION DEVICE, AND DEPOSITION MASK MANUFACTURING METHOD

Номер: US20180002803A1
Принадлежит: SHARP KABUSHIKI KAISHA

The present invention is directed to a method for manufacturing a vapor deposition mask () which includes a mask section () and a mask frame (). The mask section () includes an alloy containing iron and nickel. The method includes a heat treatment step of carrying out heat treatment with respect to the mask section () in a state in which end parts of the mask section () are fixed to the mask frame () while tension is applied to the mask section (). 1. A method for manufacturing a vapor deposition mask which includes a mask section and a mask frame , the mask section being provided with an opening for forming a film of a vapor deposition material on a film formation target substrate , and the mask section including an alloy containing iron and nickel ,said method comprising:a heat treatment step of carrying out heat treatment with respect to the mask section in a state in which end parts of the mask section are fixed to the mask frame while tension is applied to the mask section.2. The method as set forth in claim 1 , wherein:the alloy has a plurality of crystal faces; andin the heat treatment step, the heat treatment is carried out such that degrees of orientation ofall of the plurality of crystal faces become equal to or lower than 60%.3. The method as set forth in claim 1 , wherein:in the heat treatment step, annealing is carried out at a temperature at which the alloy is recrystallized.4. The method as set forth in claim 3 , wherein:in the heat treatment step, annealing of the mask section is carried out at 650° C. or higher.5. The method as set forth in claim 1 , further comprising:an opening forming step of forming an opening in the mask section,the heat treatment step being carried out after the opening forming step.6. The method as set forth in claim 1 , further comprising:an opening forming step of forming an opening in the mask section,the opening forming step being carried out after the heat treatment step.7. The method as set forth in claim 5 , wherein:in ...

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