COMPLEX ELECTRONIC COMPONENT
The present invention refers to relates to composite electronic component, excellent durability is provided for ESD composite electronic components are disclosed. Recent portable electronic device having a device using conductive metal which tends to increases, the electronic device to the outside of the inner and eliminating the need for blocking electric shock etc. increases. In particular, increasing the strength and seal to at front surface of the portable electronic device when metal frame using a number bath which is increased and, due to external static electricity (ESD; Electrostatic discharge) internal electronic component protective or interior of a user therefore drives the means for eliminating the need for more high in are provided which prevent electric shock. However, due to the mirror and portable size reduction in electronic equipment, etc. of ESD protection device or electric shock protection element disposed less. The present invention refers to has a vertical stack type ESD protection, excellent durability against electrostatic [...] number broadcast receiver of complex electronic components. In the embodiment according to the number 1 and number 2 external electrode is disposed outside one of the present invention composite electronic component, including body disposed inside said laminate stack, said number 1 and number 2 a plurality of number 1 and number 2 the external electrodes respectively electrically connected electrode, said main electrode disposed spaced apart from each other, said number 1 and number 2 and number 3 and number 4 external electrode electrically and respectively connected to said number 3 and number 4 electrode disposed between the ESD discharge layers, said number 3 and number 4 the distance between the electrode 30 to 60 micro m are disclosed. In the embodiment according to of the present invention a method of forming a composite electronic component disposed on top of the other and said element and the ESD protection, said ESD the protection, the number 1 and number 2 discharge electrode and said number 1 and number 2 arranged apart from each other that is located between the discharge electrode of ESD discharge layers, said number 1 and number 2 m distance 30 to 60 micro discharge electrodes are disclosed. In the embodiment according to the composite electronic component of the present invention has one ESD protection, the number 1 and number 2 ESD discharge electrodes for electrostatic discharge layer disposed ESD protection can be increased durability. In addition, since the number 1 and number 2 is extended distance discharge electrodes 30 - 60 micro m when current is concentrated by preventing static electricity of durability against ESD protection can be further enhanced. Figure 1 shows a perspective view of the present invention according to composite electronic component to determine the timing also are disclosed. Figure 2 shows a I a-I ' cross-sectional drawing of as, in the embodiment according to the present invention to an cross-sectional drawing of composite electronic component to determine timing of Figure 1 also are disclosed. Figure 3 shows a II a-II ' plane view of as, in the embodiment according to the present invention to an plane view of composite electronic component to determine timing of Figure 1 also are disclosed. Figure 4 shows a perspective view of the present invention also relates to a method of composite electronic component which in the embodiment according to other, Figure 5 shows a III a-III ' according to cross-sectional drawing timing of Figure 4 a are disclosed. Figure 6 shows a perspective view of another of the present invention also relates to a method in the embodiment according to composite electronic component which, Figure 7 shows a IV a-IV ' according to cross-sectional drawing timing of Figure 6 a are disclosed. Hereinafter, a preferred embodiment of the present invention with reference to the attached drawing shapes described substrate. However, various other forms of the present invention embodiment can be shape, embodiment of the present invention hereinafter described form and not the limited range. In addition, the present invention in the field of the present invention embodiment form are advantageously easier to average knowledge with which to more completely account for the ball number are disclosed. Thus, the shape and size of the elements in the drawing or the like can be exaggerated for clear description, same drawing into a display on a reaction identical elements are disclosed. An element portion of the composite electronic component of the present invention capacitor, inductor or to be bitter it will be miss but, the one number are not disclosed. But, the present invention refers to descriptions for clarity, capacitor e.g. illustrating each other. Also the present invention according to Figure 1 shows a composite electronic component (100) to determine the timing of perspective view are disclosed. The reference 1 also, the present invention according to (A) (B) ESD protection including a composite electronic component is element on the number 1 and number 2 disposed externally of the body body and external electrode (111, 112) having a predetermined wavelength. Number 1 and number 2 external electrode (111, 112) disposed thereon to longitudinal ends of the body. Number 1 and number 2 external electrode (111, 112) comprises a plurality of metal layer can be. For example, like Ag or Ni metal layer formed by using a conductive paste including the hole number 1 number 2 and number 3 can be formed including a metal layer. Number 1 and number 2 external electrode (111, 112) is number 1 and number 2 carry electrode (121, 122) electrically connected, number 3 and number 4 electrode (131, 132) for electrically connected thereto. Figure 2 shows a I a-I 'as of cross-sectional drawing, number 1 in the embodiment according to composite electronic component to determine which of cross-sectional drawing shown, also of Figure 1 II a-II Figure 3 shows a' plane view of as, in the embodiment according to the present invention to an plane view of composite electronic component to determine timing of Figure 1 are disclosed. 2 And 3 also reference surface, of the present invention number 1 in the embodiment according to composite electronic component (100) is element (A) and (B) ESD protection without using a tool. Element (A) includes a laminate (101) to laminate (101) which is disposed inside a number 1 and number 2 of electrode (121, 122) comprises. Laminate (101) is a ferroelectric material including a plurality of dielectric layer (102) laminated, compaction and sintering if the boundary 10 is that each layer can be integrated. Dielectric layer (102) the ferroelectric material such as BaTiO 3 perovskite (perovskite) can be formed using a material having a structure. Only, element (A) is inductor can be magnetic material case, if to be bitter it is miss having properties such that the resistance change is sensed temperature can be used as the material. Laminate (101) end of number 1 and number 2 of electrode (121, 122) disposed thereon. Number 1 and number 2 electrode (121, 122) can be formed by printing the conductive paste dielectric layer including conductive material. But, in the case of number 1 and number 2 electrode is an electrode be a coil-shaped inductor. Number 1 and number 2 electrode (121, 122) used in conductive material Ni, Cu, Ag or the like can be a selected, the one number are not disclosed. One side of the element portion (A), e.g. element on the upper surface of ESD protection (A) (B) is disposed thereon. ESD protection is (B) ESD discharge layer (150), cover layer (160), number 3 electrode (131) and number 4 electrode (132) comprises. Cover layer (160) of the ESD protection (B) is placed, can be resultant structure. Cover layer (160) when designing an insulating material on top of the contact metal can (metal can) reduces the PCB not affected by position can be fixed. Number 3 electrode (131) and discharge means the number 1, number 4 electrode (132) is discharge electrode number 2 (132) means other. Number 3 and number 4 electrode (131, 132) is a conductive paste including Cu or Ag can be formed. But, in the case of forming electrode number 3 and number 4 using conductive paste, composite electronic component (100) number of number 3 and number 4 700 or more at high temperatures during firing process for preparing in electrode (131, 132) can be damaging Ag - epoxy (Epoxy) or can be formed using a Cu - epoxy (Epoxy). Ag - Cu - epoxy can including corresponding conductive powder epoxy or epoxy resin by big. Number 3 and number 4 electrode (131, 132) gap is between (135) disposed thereon. Gap (135) the number 3 and number 4 electrode (131, 132) arranged separately from an end opposite the bodily wastes can be rectangular. I.e., gap (135) RM number 3 and number 4 electrode (131, 132) big spaced portions each other. The, gap (135) number 3 and number 4 stores the length of electrode (131, 132) distance between the big. Gap (135) between, i.e., number 3 and number 4 electrode (131, 132) between the ESD discharge layer (150) disposed thereon. ESD discharge layer (150) is Ag, Cu, Ni and Pd SiO in at least one of metallic particles2 Or ZnO2 Mixed with at least one of the ceramic material can be formed using a paste for ESD. ESD discharge layer (150) in insulating but adjustment voltage hereinafter, limit is present when the traffic channel element ESD discharge layer (150) can be current flow along into the metal particles. Limit voltage is ESD discharge layer (150) can be adjusted by the into the metal filler. I.e., ESD discharge layer (150) surfaces (135) which is arranged between the number 3 and number 4 electrode when applied overvoltage frequency driver gate lines (131, 132) and allow current flow between the gate lines are formed in element (A) (A) can be applied to the element to prevent damage. If, number 3 electrode (131), number 4 electrode (132) or ESD discharge layer (150) to gate lines overvoltage flowing in a phenomenon is generated by the electrode 1 times number 3 (131), number 4 electrode (132) or ESD discharge layer (150) can withstand the stationary slides although, corresponding phenomenon when a desired number 3 finally left electrode (131), number 4 electrode (132) or ESD discharge layer (150) are damaged. The, number 3 electrode (131), number 4 electrode (132) or ESD discharge layer (150) for stationary slides can be called durability can withstand many times the ability, and the durability of the need to be disclosed. Number 3 and number 4 of the following table 1 to electrode width (Wt) (131, 132) width (Wa ) Of (Wt /Wa ) Is 0. 2 Exceeds, 0. 5 If less than, the length of gap (Da ) Measured according to turn-on (Turn On) characteristics and ESD durability are disclosed. Turn-on is the constant voltage (400 V) beyond when the voltage is applied, and means through the ESD protection characteristics, ESD durability IEC-a 61000 provided 4 provided 2 Level 4 standard (8 kv) 100 to the ESD status measuring third inverters are periodical repetition are disclosed. Table 1 the reference, to turn a high resistant semiconductor layer excellent ESD, gap (135) has a length of 30 to 60 m number 3 and number 4 (Da) so micro electrode (131, 132) can be arranged. In particular, number 3 and number 4 electrode (131, 132) width (Wa ) The body width (Wt ) To 0. 2 Exceeds, 0. 5 Being less than, gap (135) (Da) of the present invention is 30 to 60 in the embodiment according to the length of the semiconductor layer which is excellent in composite electronic component when one micro m turn ESD may have a high durability. Gap (135) in a desired length of less than 30 micro m in the embodiment 1 is applied to the high voltage or electrostatic durability against repetitive studied are reduced, gap (135) is exceeded is studied at length of 60 micro m in the embodiment 5 can be known at a conductor increases drag on is turned on at a minimum voltage characteristics, in particular high voltage or electrostatic response is that a door number irregular flow tides. The length of the gap to form a table 2 (Da ) Is greater than 30 micro m, when less than 60 micro m, width (Wt ) For number 3 and number 4 electrode (131, 132) width (Wa ) Of (Wa /Wt ) Measured according to turn-on (Turn On) characteristics and ESD durability are disclosed. The reference table 2, number 3 and number 4 electrode (131, 132) width (Wa ) A body width (Wt ) To 0. 2 Or more, 0. 5 Hereinafter to one in the embodiment according to composite electronic component of the present invention even in the formation of excellent ESD turn semiconductor layer may have a high durability. I.e., Wa /Wt Is 0. 5 Short (short) is exceeded is increased by turning on deterioration of characteristics a pulse which, Wa/Wt is 0. 2 Is less than at a high voltage or electrostatic reactive is constructed by turn-on characteristics, durability in addition it becomes door number reducing flow tides. The, number 3 and number 4 in the embodiment according to the composite electronic component of the present invention one electrode (131, 132) width (Wa ) A body width (Wt ) To 0. 2 Or more, 0. 5 Hereinafter superior ESD turn formed semiconductor layer may have a high durability. Table 3 in the ESD discharge layer, metal particles 37 wt % content of greater than, less than 48 wt % when, turning on the ESD durability characteristics and measured according to content of ceramic particles (Turn On) are disclosed. Table 3 reference surface, ESD discharge part with ceramic particles 7. 5 To 12. 5 Wt % if one in the embodiment according to of the present invention excellent composite electronic component to turn semiconductor layer may have a high ESD durability. ESD discharge part with ceramic particles 7. If less than 5 wt %, ESD discharge layer shape to keep constant the ESD discharge layer as a non-uniform shape by ESD durability door number reduced flow tides. In addition, ESD discharge layer shape is kept constant to keep constant the number exists in the ESD discharge characteristics is not measured disclosed. ESD discharge part with ceramic particles 12. 5 Wt % is exceeded, rather turn-on characteristic and a door reduced simultaneously the pin is point number ESD durability. Thus, in the embodiment according to composite electronic component of the present invention one part with discharge ceramic particles 7. 5 To 12. 5 Wt % turn semiconductor layer including a high ESD may have excellent durability. In particular, ceramic particles containing SiO2 Or ZnO2 In which case the to go room using, ceramic particles content turned on by an ESD properties and overall durability and an indirectly-affected were. The, ceramic particles containing SiO2 Or ZnO2 In addition similar properties the same result is obtained even when used for a ceramic particles are expected to the diagram. In the embodiment according to Figure 4 shows a composite electronic component of the present invention also other (200) is shown a perspective view of the housing, Figure 5 shows a III a-III ' according to cross-sectional drawing timing of Figure 4 a are disclosed. In the embodiment according to composite electronic component of the present invention other (200) in, the aforementioned one in the embodiment according to composite electronic component of the present invention (100) subjected to omit diffuse to the same construction as the description. The reference also 4 and 5, in the embodiment according to composite electronic component of the present invention other (200) arranged outside the outer electrode number 1 and number 2 coated (201), laminate (201) and disposed on the upper surface, each said number 1 and number 2 external electrode (211, 212) is coupled to the, number 1 and number 2 is arranged apart from each other discharge electrode (231, 232), number 1 and number 2 discharge electrode (231, 232) disposed between the ESD discharge layer (240) and laminate (201) arranged to cover the upper part of the cover layer (260) comprises. Number 1 and number 2 external electrode (211, 212) has a background electrode layer (211a, 212a) and based on the electrode layer (211a, 212a) formed on the semiconductor substrate layer having a seed (seed) (211b, 212b) can be comprising. In the embodiment according to composite electronic component of the present invention other (200) stack (201) based on a longitudinal direction of the electrode layer so as to cover the opposite end (211a, 212a) is formed, laminate (201) on top of number 1 and number 2 discharge electrode (231, 232) formed therein. Then, laminate (201) the top of the cover layer (260) is disposed in the through plating layer after the plating process (211b, 212b) and form. Thus, in the embodiment according to the composite electronic component of the present invention other plating (211b, 212b) the number 1 and number 2 external electrode (231, 232) which is connected to the exposed outwardly during, cover layer (260) and the laminated body (201) plating from the first edge rests (211b, 212b) be no. In the embodiment according to composite electronic component of the present invention other (200) protective layer on the upper surface of the cover layer is disposed on the role of final number article wherein, (metal can) such as ammonia can not affected by higher degree of freedom of position upon contact of the printed circuit board design. In addition, element coated using simple ESD protection further processing after the call through a high pressure liquid coolant having composite electronic component number pin is necessary. Figure 6 shows a perspective view of another of the present invention also relates to a method in the embodiment according to composite electronic component which, Figure 7 shows a IV a-IV ' according to cross-sectional drawing timing of Figure 6 a are disclosed. In the embodiment according to composite electronic component of the present invention other (300) in, the aforementioned one in the embodiment according to composite electronic component of the present invention (100) of the present invention and other in the embodiment according to composite electronic component (200) subjected to omit diffuse to the same construction as the description. 6 And 7 may also reference surface, plating (312a, 312b) is number 1 and number 2 external electrode (311, 312) extending outwardly from the exposed portion cover layer (360) to surround a longitudinal direction of the opposite end faces can be. The present invention refers to the above-described embodiment but is defined by shape and attached drawing, broadcast receiver defined by appended claims. Thus, a technical idea of the present invention within a range that the claims from a heavy person with skill in the art of art by various forms of substituted, modified and password are to allow the user, in addition of the present invention that the range will. 100: Composite electronic component 101: Laminate 102: Dielectric layer 111: Number 1 external electrode 112: Number 2 external electrode 121: Electrode number 1 (internal electrode number 1) 122: Number 2 electrode (internal electrode number 2) 131: Number 3 electrode (discharge electrode number 1) 132: Number 4 (discharge electrode number 2) electrode 135: Gap 150: ESD discharge layer 160: Cover layer The present invention relates to a complex electronic component. The complex electronic component includes a body having first and second external electrodes disposed outside thereof and including a laminate; a plurality of first and second electrodes disposed inside the laminate and electrically connected to the first and second external electrodes, respectively; third and fourth electrodes spaced apart from each other in the upper part of the laminate and electrically connected to the first and second external electrodes, respectively; and an ESD discharge layer disposed between the third and fourth electrodes. A distance between the third and fourth electrodes is 30 to 60μm m. ESD protection can be improved against static electricity. COPYRIGHT KIPO 2017 Number 1 and number 2 external electrode is disposed outside, laminate including body; and on the inside of said laminate, said number 1 and number 2 a plurality of number 1 and number 2 the external electrodes respectively electrically connected electrode; said main electrode disposed spaced apart from each other, said number 1 and number 2 number 3 and number 4 external electrode electrically and respectively connected electrode; and said number 3 and number 4 electrode disposed between the ESD discharge layer; and, said number 3 and number 4 the distance between the electrode 30 to 60 micro m in composite electronic component. According to Claim 1, said number 3 and number 4 electrode used for the 0 line width of said body. 2 Exceeds, 0. 5 Less than composite electronic component. According to Claim 1, said ESD discharge layer Al, Cu, Ag, Ni or a mixture of these metal particles selected from the group consisting of SiO2 , ZnO2 Or a mixture of these selected from the group consisting of ceramic particles including composite electronic component. According to Claim 3, said ceramic particles 7. 5 To 12. 5 Wt % contained in the composite electronic component. According to Claim 1, said number 3 and number 4 and said ESD discharge layer arranged to cover the cover layer including composite electronic component. Element and said element disposed on the top of the ESD protection and, said ESD the protection, number 1 and number 2 discharge electrode is arranged apart from each other; and said number 1 and number 2 that is located between the discharge electrode of ESD discharge layer; and, said number 1 and number 2 the distance between the discharge electrode 30 to 60 micro m in composite electronic component. According to Claim 6, said number 1 and number 2 discharge electrode line width of said element width 0. 2 Exceeds, 0. 5 Less than composite electronic component. According to Claim 6, said ESD discharge layer Al, Cu, Ag, Ni or a mixture of these metal particles selected from the group consisting of SiO2 , ZnO2 Or a mixture of these selected from the group consisting of ceramic particles including composite electronic component. According to Claim 8, said ceramic particles 7. 5 To 12. 5 Wt % contained in the composite electronic component. According to Claim 6, said capacitor element, inductors or to be bitter it is miss composite electronic component. According to Claim 6, disposed on top of said ESD protection cover [...] including composite electronic component. Number 1 and number 2 disposed outside coated outer electrode; and said laminate disposed on the upper surface, each said number 1 and number 2 is coupled to the external electrode, number 1 and number 2 discharge electrode is arranged apart from each other; said number 1 and number 2 that is located between the discharge electrode of ESD discharge layer; and said cover layer arranged to cover the main electrode; including a composite electronic component. According to Claim 12, formed in said number 1 and number 2 and external electrode has a background electrode layer, said plating layer on the number 1 and number 2 is connected to the outer electrode is exposed to the composite electronic component. According to Claim 13, said number 1 and number 2 said plating layer on the external electrodes extending from the exposed portion outside said longitudinal opposite end cover layer to surround the composite electronic component. According to Claim 12, said number 1 and number 2 the distance between the discharge electrode 30 to 60 micro m in composite electronic component. According to Claim 12, said number 1 and number 2 used for the line width of said discharge electrode laminate 0. 2 Exceeds, 0. 5 Less than composite electronic component. In the embodiment Da (micro m) Turn-on (Turn On) characteristics ESD durability 1 10 ○ × 2 30 ◎ ◎ 3 40 ◎ ◎ 4 60 ○ ○ 5 80 × × In the embodiment Wt/Wa Turn-on (Turn On) characteristics ESD durability 6 0. 1 × × 7 0. 2 ○ ○ 8 0. 4 ◎ ◎ 9 0. 5 ○ ○ 10 0. 6 × ○ In the embodiment (Wt %) content of ceramic particles Turn-on (Turn On) characteristics ESD durability SiO2 ZnO2 Total 11 7. 5 0 7. 5 ◎ ○ 12 12. 0 0 12. 0 ○ ○ 13 17. 0 0 17. 0 × × 14 7. 5 5. 0 12. 5 ○ ○ 15 10. 0 5. 0 15. 0 × ×
