Semiconductor device

VOLTAGE MEASUREMENT DEVICE AND VOLTAGE DETECTION METHOD

Semiconductor device

Solid-state imaging apparatus, imaging apparatus, and imaging method

A solid-state imaging apparatus includes pixel cells arranged in a matrix. Each pixel cell includes: a first photodiode that accumulates a signal charge generated by photoelectric conversion; a second photodiode that functions as a first holder that holds a signal charge that overflows from the first photodiode; a second holder; and a first transfer transistor that transfers the signal charge held in the second photodiode to the second holder.

Semiconductor device

Semiconductor device

Chip singulation method

A chip singulation method includes, in stated order: forming a surface supporting layer on an upper surface of a wafer; thinning the wafer from the undersurface to reduce the thickness to at most 30 μm; removing the surface supporting layer from the upper surface; forming a first metal layer and subsequently a second metal layer on the undersurface of the wafer; applying a dicing tape onto an undersurface of the second metal layer; applying, onto the upper surface of the wafer, a process of increasing hydrophilicity of a surface of the wafer; forming a water-soluble protective layer on the surface of the wafer; cutting the wafer, the first metal layer, and the second metal layer by irradiating a predetermined region of the upper surface of the wafer with a laser beam; and removing the water-soluble protective layer from the surface of the wafer using wash water.

SOLID-STATE IMAGING DEVICE

SEMICONDUCTOR LIGHT EMITTING ELEMENT

Solid-state imaging device

A solid-state imaging device includes: a plurality of pixel cells arranged in a matrix. In the solid-state imaging device, each of the plurality of pixel cells includes: a photoelectric converter that generates charge by photoelectric conversion, and holds a potential according to an amount of the charge generated; an initializer that initializes the potential of the photoelectric converter; a comparison section that compares the potential of the photoelectric converter and a predetermined reference signal, and causes the initializer to perform initialization when the potential of the photoelectric converter and the predetermined reference signal match; and a counter that counts a total number of times of initialization performed by the initializer, and outputs a signal corresponding to the total number of times as a first signal indicating an intensity of incident light.

Semiconductor device and method of manufacturing semiconductor device

A semiconductor device includes: a channel layer not containing Al; a barrier layer above the channel layer containing Al; a recess; and an ohmic electrode in the recess, which is in ohmic contact with a two-dimensional electron gas layer. An Al composition ratio distribution of the barrier layer has a maximum point at a first position. The semiconductor device includes: a first inclined surface of the barrier layer which includes the first position and is in contact with the ohmic electrode; and a second inclined surface of the barrier layer which intersects the first inclined surface on a lower side of the first inclined surface, and is in contact with the ohmic electrode. To the surface of the substrate, an angle of the second inclined surface is smaller than an angle of the first inclined surface. A position of the first intersection line is lower than the first position.

VOLTAGE MEASUREMENT DEVICE, VOLTAGE DETECTION CIRCUIT, AND DEVICE ADDRESS GENERATION METHOD

Semiconductor device

A semiconductor device includes: a first electrode provided on a semiconductor multilayer structure; a second electrode provided on a substrate; and a bonding metal layer which bonds the first electrode and the second electrode together. The bonding metal layer includes a gap inside.

Semiconductor device

A semiconductor device includes a first transistor disposed in a first region of a semiconductor layer and a second transistor disposed in a second region of the semiconductor layer, and includes, on the surface of the semiconductor layer, first source pads, a first gate pad, second source pads, and a second gate pad. In the plan view of the semiconductor layer, the first and second transistors are aligned in a first direction; the first gate pad is disposed such that none of the first source pads is disposed between the first gate pad and a side parallel to the first direction and located closest to the first gate pad; and the second gate pad is disposed such that none of the second source pads is disposed between the second gate pad and a side parallel to the first direction and located closest to the second gate pad.

DISTANCE MEASURING DEVICE

INTEGRATED CIRCUIT, BATTERY MONITORING DEVICE, AND BATTERY MONITORING SYSTEM

Power amplifier device

A power amplifier device includes: a first power supply terminal for inputting a first power supply voltage; a first transistor for power amplification that (i) includes a first gate to which a bias voltage is applied, and (ii) is supplied with power from the first power supply terminal; a second power supply terminal for inputting a second power supply voltage lower than the first power supply voltage; a second transistor for monitoring that (i) includes a second gate to which the bias voltage is applied, (ii) is supplied with power from the first power supply terminal or the second power supply terminal, and (iii) imitates an operation of the first transistor; and a bias circuit that is supplied with power from the second power supply terminal and generates and adjusts the bias voltage according to a drain current or a source current of the second transistor.

COMMUNICATION SYSTEM AND COMMUNICATION METHOD

Semiconductor device

Provided is a semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device and includes: a transistor element including a first electrode, a second electrode, and a control electrode which controls a conduction state between the first electrode and the second electrode; a plurality of first resistor elements each including a first electrode and a second electrode, the first electrodes of the first resistor elements being electrically connected to the second electrode of the transistor element; one or more external resistance terminals to which the second electrodes of the plurality of first resistor elements are physically connected; a first external terminal electrically connected to the first electrode of the transistor element; and an external control terminal electrically connected to the control electrode. The one or more external resistance terminals, the first external terminal, and the external control terminal are external connection terminals ...

Solid-state imaging device including driver circuits comprising multi-stage buffer elements

A solid-state imaging device includes: pixels disposed in a matrix of pixel rows and pixel columns; control wires provided for the pixel rows or the pixel columns, and each connected to at least two pixels out of the pixels, the at least two pixels being included in one of the pixel rows or the pixel columns for which the control wire is provided; drive circuits that are provided for the control wires, each include buffer elements in at least two stages, and each output a control signal to one of the control wires for which the drive circuit is provided, the buffer elements in the at least two stages being connected in series; and a first wire that short-circuits output wires of the buffer elements in one of the at least two stages in at least two of the plurality of drive circuits.

Semiconductor device

Provided is a first vertical field effect transistor in which first source regions and first connection portions via which a first body region is connected to a first source electrode are disposed alternately and cyclically in a first direction in which first trenches extend. In a second direction orthogonal to the first direction, Lxm≤Lxr≤0.20 μm holds true where Lxm denotes a distance between adjacent first trenches and Lxr denotes the inner width of a first trench. The lengths of the first connection portions are in a convergence region in which the on-resistance of the vertical field effect transistor at the time when a voltage having a specification value is applied to first gate conductors to supply current having a specification value does not decrease noticeably even when the lengths of the first connection portions are made much shorter.

Semiconductor laser element

A semiconductor laser element includes: an n-type cladding layer disposed above an n-type semiconductor substrate (a chip-like substrate); an active layer disposed above the n-type cladding layer; and a p-type cladding layer disposed above the active layer, in which the active layer includes a well layer and a barrier layer, an energy band gap of the barrier layer is larger than an energy band gap of the n-type cladding layer, and a refractive index of the barrier layer is higher than a refractive index of the n-type cladding layer.

Semiconductor device

A semiconductor device includes: a first latch circuit that includes a first inverting circuit, a second inverting circuit, a third inverting circuit, and a fourth inverting circuit; a first first-type well region; a second first-type well region; and a second-type well region. In a plan view, a distance between a drain of a first-type MOS transistor in the first inverting circuit and a drain of a first-type MOS transistor in the third inverting circuit is longer than a distance between the drain of the first-type MOS transistor in the first inverting circuit and a drain of a first-type MOS transistor in the fourth inverting circuit.

Electromagnetic valve drive device

An electromagnetic valve drive device which supplies a hold current with a prescribed fluctuation range to an electromagnetic coil of an electromagnetic valve after a current peak when a supply of electricity starts has passed includes: a power supplier which intermittently applies a drive voltage to the electromagnetic coil; a detector which detects the hold current; a first comparator which compares a detected current by the detector with a first threshold value; a filter which performs integration processing on an output of the first comparator; a second comparator which compares an output of the filter with a second threshold value to generate an output signal used for generating a control signal for controlling the power supplier; and a control signal generator which generates the control signal for controlling the power supplier based on the output signal of the second comparator, wherein the filter is a count-up/down type digital filter.

Chip singulation method

A chip singulation method includes, in stated order: forming a surface supporting layer on an upper surface of a wafer; thinning the wafer from the undersurface to reduce the thickness to at most 30 μm; removing the surface supporting layer from the upper surface; forming a first metal layer and subsequently a second metal layer on the undersurface of the wafer; applying a dicing tape onto an undersurface of the second metal layer; applying, onto the upper surface of the wafer, a process of increasing hydrophilicity of a surface of the wafer; forming a water-soluble protective layer on the surface of the wafer; cutting the wafer, the first metal layer, and the second metal layer by irradiating a predetermined region of the upper surface of the wafer with a laser beam; and removing the water-soluble protective layer from the surface of the wafer using wash water.

Semiconductor device

Power amplifier device

A power amplifier device includes: a first power supply terminal for inputting a first power supply voltage; a first transistor for power amplification that (i) includes a first gate to which a bias voltage is applied, and (ii) is supplied with power from the first power supply terminal; a second power supply terminal for inputting a second power supply voltage lower than the first power supply voltage; a second transistor for monitoring that (i) includes a second gate to which the bias voltage is applied, (ii) is supplied with power from the first power supply terminal or the second power supply terminal, and (iii) imitates an operation of the first transistor; and a bias circuit that is supplied with power from the second power supply terminal and generates and adjusts the bias voltage according to a drain current or a source current of the second transistor.

SEMICONDUCTOR LIGHT EMITTING ELEMENT AND SEMICONDUCTOR LIGHT EMITTING DEVICE

Electromagnetic valve driving device

An electromagnetic valve driving device which drives a fuel injection valve having a solenoid coil, includes: a regenerative switching element disposed between a first end portion of the solenoid coil and the ground; and a control unit configured to control the regenerative switching element to be in an ON state or an OFF state, wherein the control unit includes: a voltage detection unit configured to detect a voltage of the first end portion of the solenoid coil; and an abnormality detection unit configured to detect an abnormality of the regenerative switching element on the basis of the voltage detected by the voltage detection unit.

Light-emitting device

A light-emitting device including: a mounting substrate including a mounting surface; a light-emitting element disposed on the mounting surface; a light transmissive component disposed on the light-emitting element; and a resin component directly contacting and covering a side surface of the light-emitting element and a side surface of the light transmissive component. The resin component includes a peripheral portion that directly contacts and covers the side surface of the light transmissive component, a protrusion that protrudes from the peripheral portion, and a cover portion that directly contacts and covers an outer edge portion of a topmost surface of the light transmissive component. The height from the mounting surface to a top of the cover portion is greater than a height from the mounting surface to the topmost surface of the light transmissive component, and the topmost surface of the light transmissive component includes a region exposed from the resin component.

Semiconductor device

Semiconductor device

A semiconductor device includes: a mounting board; and a semiconductor element disposed on the mounting board via metal bumps, wherein the semiconductor element includes a semiconductor stacked structure and first electrodes, the mounting board includes second electrodes, the metal bumps include a second layer in contact with the second electrodes of the semiconductor element and a first layer located on a side opposite to the second electrodes, an average crystal grain size of crystals included in the second layer is larger than an average crystal grain size of crystals included in the first layer, and the first layer is spaced apart from the second electrodes of the semiconductor element.

Semiconductor device

In a first vertical field-effect transistor in which first source regions and first connectors each of which electrically connects a first body region and a first source electrode are alternately and periodically disposed in a first direction (Y direction) in which a first trench extends, a ratio of LS [μm] to LB [μm] is at least 1/7 and at most 1/3, where LS denotes a length of one of the first source regions in the first direction, and LB denotes a length of one of the first connectors in the first direction, and LB≤−0.024×(VGS)2+0.633×VGS−0.721 is satisfied for a voltage VGS [V] of a specification value of a semiconductor device, the voltage VGS being applied to a first gate conductor with reference to an electric potential of the first source electrode.

Semiconductor device

A semiconductor device includes: a semiconductor layer in a rectangular shape in a plan view; a transistor provided in a first region; and a drain lead-out region provided in a second region. A border line is a straight line parallel to longer sides of the semiconductor layer. The first region includes a plurality of source pads and gate pads. The second region includes a plurality of drain pads. One gate pad among the gate pads is disposed to dispose none of the plurality of source pads between (i) the one gate pad and (ii) one longer side and one shorter side. One drain pad among the plurality of drain pads is in the same shape as the one gate pad and is disposed close to a second vertex. The plurality of source pads include a source pad that is in a rectangular shape or an obround shape having a longitudinal direction parallel to the longer sides of the semiconductor layer.

IMAGING UNIT, ENDOSCOPE, AND METHOD FOR PRODUCING IMAGING UNIT

SEMICONDUCTOR DEVICE

Biological state detecting apparatus and biological state detection method

A biological state detecting apparatus which generates biological information of a person, light sources which emit light having a first wavelength and light having a second wavelength, respectively, an imaging device which receives reflected light of the emitted light, a controller which controls the light sources, an arithmetic operator which reads out a first image and a second image from the imaging device and performs an arithmetic operation thereon, and a state estimator which generates the biological information of the person. The arithmetic operator generates a distance image based on the first image and the second image.

Illumination device and light-emitting module

An illumination device includes a first light source that emits first light having a first peak wavelength which is highest in intensity in a wavelength range from near-ultraviolet to green in an emission spectrum; a second light source that emits second light having a second peak wavelength which is highest in intensity in a wavelength range from near-ultraviolet to green in an emission spectrum, the second light illuminating a position identical to a position illuminated by the first light; and a detection device that detects whether an object is present at a given position, wherein the second peak wavelength is shorter than the first peak wavelength, and a luminous flux of the first light is decreased and a luminous flux of the second light is increased when the detection device detects that the object is present at the predetermined position.

Semiconductor device

A semiconductor device that is of a face-down mounted chip-size package type, discharges electric charges stored in an electric storage device (battery), and has a power loss area ratio of at least 0.4 (W/mm2) obtained by dividing a power loss (W) in the semiconductor device at time of the discharge by an area (mm2) of the semiconductor device, the semiconductor device comprising: a field-effect transistor of a horizontal type and a resistor that are connected in series in stated order between an inflow terminal and an outflow terminal; and a control circuit that causes a discharge current to be constant without depending on an applied voltage between the inflow terminal and the outflow terminal. A difference between a maximum temperature of a field-effect transistor portion and a temperature of a resistor portion is within five degrees Celsius in a discharge period.

Semiconductor device

Light source unit, illumination device, processing equipment, and deflection element

A light source unit includes: a first light emission point from which a first beam is emitted; a second light emission point from which a second beam is emitted and which is disposed apart from the first light emission point in a second direction perpendicular to a first direction; a deflection element that deflects the first and/or second beam; and a first condensing optical element that focuses, on a light collection surface, the first and second beams. The first beam at the first light emission point overlaps the second beam at the second light emission point in a third direction, and on the light collection surface, the first and second beams overlap each other in the second direction and are separate from each other in the third direction.