Настройки

Укажите год
-

Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

Подробнее
-

Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

Подробнее

Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Укажите год
Укажите год
Применить Всего найдено 2. Отображено 2.
24-04-2012 дата публикации

Semiconductor device including conductive lines with fine line width and method of fabricating the same

Номер: US0008164119B2
Автор: Hyeoung-Won Seo, Byung-Hyug Roh, Seong-Goo Kim, Sang-Min Jeon, SEO HYEOUNG-WON, ROH BYUNG-HYUG, KIM SEONG-GOO, JEON SANG-MIN
Принадлежит: Samsung Electronics Co., Ltd., SEO HYEOUNG-WON, ROH BYUNG-HYUG, KIM SEONG-GOO, JEON SANG-MIN, SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO., LTD.

A semiconductor device comprises a semiconductor substrate including a first core region and a second core region between which a cell array region is interposed, a first conductive line and a second conductive line extending to the first core region across the cell array region, and a third conductive line and a fourth conductive line extending to the second core region across the cell array region, wherein a line width of the first through fourth conductive lines is smaller than a resolution limit in a lithography process.

Подробнее
Номер записи: 1
21-03-2017 дата публикации

Chip-stacked semiconductor package and method of manufacturing the same

Номер: US0009601465B2
Автор: Un-Byoung Kang, Tae-Je Cho, Byung-Hyug Roh, KANG UN-BYOUNG, CHO TAE-JE, ROH BYUNG-HYUG, Kang Un-Byoung, Cho Tae-Je, Roh Byung-Hyug
Принадлежит: SAMSUNG ELECTRONICS CO., LTD., KANG UN-BYOUNG, CHO TAE-JE, ROH BYUNG-HYUG, SAMSUNG ELECTRONICS CO LTD, Kang Un-Byoung, Cho Tae-Je, Roh Byung-Hyug

A chip-stacked semiconductor package includes a first chip having a first front surface, a first back surface, and a first connection member on the first front surface, the first back surface being opposite to the first front surface; a second chip having a second front surface, a second back surface, a second connection member and a first through-silicon via (TSV) electrically connected to the second connection member, the second back surface opposite to the second front surface, and the second connection member on the second front face; and a first sealing member between the first front surface and the second front surface, the first sealing member filling a space between the first connection member and the second connection member, the first connection member of the first chip and the second connection member of the second chip being symmetric with respect to each other.

Подробнее
Номер записи: 2