Wire saw

The present invention provides a wire saw which cuts a workpiece using a cutting wire and is capable of adjusting wire tension with high responsiveness. The wire saw includes first and second workpiece cutting units 1 A and 1 B. Each of the workpiece cutting units 1 A and 1 B includes a pair of guide rollers 10 a and 10 b around which a wire W is wound to form a workpiece-cutting wire group. The wire saw further includes a tension detector 18 which detects tension in the wire W between the workpiece cutting units 1 A and 1 B, and a control device 50 . The control device 50 changes a rotational speed of the guide rollers 10 a and 10 b of at least one of the workpiece cutting units based on the tension detected by the tension detector 18 so as to keep the tension within an acceptable range.

METHOD FOR SIMULTANEOUSLY CUTTING A MULTIPLICITY OF WAFERS FROM A WORKPIECE

A method for simultaneously cutting a multiplicity of wafers from a cylindrical workpiece having an axis and a notch applied parallel to the axis in a lateral surface of the workpiece includes applying a cut-in beam on the workpiece where the cut-in beam has a head end and a foot end. The head end is inserted into the notch of the workpiece. The workpiece is held with a feed device so as to position an axis of the work piece parallel to the axes of cylindrical wire guide rollers of a wire saw. The cut-in beam is moved through a planar wire web, where the planar wire web has sections of wire arranged parallel to one another and perpendicular to the axes of the wire guide roller. The wire sections are moved the longitudinal wire direction in the presence of abrasives. 1: A method for simultaneously cutting a multiplicity of wafers from a cylindrical workpiece having an axis and a notch applied parallel to the axis in a lateral surface of the workpiece , the method comprising:applying a cut-in beam on the workpiece, the cut-in beam having a front end, a rear end, a head end and a foot end, where the head end of the cut-in beam is inserted with a form fit into the notch of the workpiece and the foot end of the cut-in beam protrudes out of the notch;holding the workpiece with a feed device so as to position an axis of the work piece parallel to axes of a cylindrical wire guide rollers of a wire saw;moving the cut-in beam of the workpiece, using the feed device, in a feed direction perpendicularly through a planar wire web, where the planar wire web has sections of wire arranged parallel to one another and perpendicular to the axes of the wire guide roller, the wire sections being guided multiple times in a spiral around grooves in the wire guide rollers such that the cut in beam is moved first with the foot end against the wire web and the work piece is moved first with the notch against the wire web; andmoving the wire sections in the longitudinal wire direction by ...

WIRE SAW EXCAVATION APPARATUS CAPABLE OF CHANGING CUTTING LINE IN ACCORDANCE WITH CUTTING SECTION AND TUNNEL EXCAVATION METHOD USING SAME

The present invention relates to a wire saw excavation apparatus that is installed on a plurality of entry holes drilled according to a cutting section of a target surface of rock to be excavated so that the target surface is excavated by using wire saws, and more particularly, to a wire saw excavation apparatus that mounts N pulleys on one entry arm to cut the rock in N directions all at once, thereby remarkably improving the work efficiency. 1. A wire saw excavation method comprising the steps of:drilling a plurality of entry holes selectively on the edge lines and the crossing points of lattice type cutting lines of a target surface of rock to be excavated and inserting a plurality of entry arms into the plurality of entry holes, each entry arm having multi-directional pulleys on which wire saws are wired according to directions thereof so as to segmentedly cut the entire section of the rock to be excavated to removable sizes all at once through the wire saws; collecting to a driving roller the wire saws that are located in horizontal, vertical, and diagonal directions in such a manner as to rotate in different directions from one another to perform the cutting operations for cutting sections; and operating the driving roller with a support force generated from a support frame supporting the entry arms inserted into the entry holes to segmentedly cut the edge lines and the lattice type cutting sections of the target surface to the removable sizes all at once.2. A wire saw excavation apparatus for segmentedly cutting the entire section of rock to be excavated all at once , the apparatus comprising:two or more multi-directional entry arm pulleys inserted into entry holes drilled on the crossing points of the cutting lines of the entire section of the rock to be excavated in such a manner as to be mounted selectively on the end portions of entry arms in any one direction of horizontal, vertical, and diagonal directions, the number of pulleys inserted into each entry ...

METHOD FOR SLICING WAFERS FROM A WORKPIECE USING A SAWING WIRE

A method for slicing wafers from a workpiece using a sawing wire, wherein at least two wire guide rolls clamp a wire web, each wire guide roll having a multiplicity of grooves in its lateral surface, wherein at least one groove in which no wire is inserted during the wire sawing is present alongside a wire-guiding groove and, after wear on the wire-guiding grooves or after a defined number of sawing processes, the sawing wire is wound over into the previously unoccupied grooves that are not yet worn or used, respectively. 1. A method for slicing a wafer from a workpiece using a sawing wire , the method comprising:forming a wire web with the sawing wire, the wire web comprising a multiplicity of wire sections arranged parallel, and the wire web being clamped at least by two wire guide rolls; andguiding the sawing wire by the at least two wire guide rolls through wire-guiding grooves, the wire-guiding grooves having a distance A between each another, in two lateral surfaces,wherein at least one further groove, in which no wire is inserted during the wire sawing, is present alongside a wire-guiding groove.2. The method of claim 1 , wherein the distance A between two wire-guiding grooves is constant over an entire length of the wire guide roll.3. The method of claim 1 , wherein the distance A between two wire-guiding grooves decreases from a wire inlet side to a wire outlet side.4. The method of claim 1 , wherein a width B of the wire-guiding grooves and the further groove is identical over an entire length of the wire guide roll.5. The method of claim 1 , wherein a width B of the wire-guiding grooves and the further groove decreases from a wire inlet side to a wire outlet side.6. The method of claim 1 , further comprising:winding the sawing wire over into a closest adjacent groove not yet guiding a sawing wire, once the wire-guiding grooves are worn.7. The method of claim 1 , further comprising:periodically winding the sawing wire over into a closest adjacent groove ...

METHODS AND SYSTEM FOR CONTROLLING A SURFACE PROFILE OF A WAFER

Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. Based on the measured amount of displacement of the sidewall, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall. 1. A method for controlling a surface profile of a wafer sliced from an ingot with a wire saw , the method comprising:measuring an amount of displacement of a sidewall of a frame of the wire saw, the sidewall connected to a bearing of a wire guide supporting a wire web in the wire saw;determining a pressure profile for adjusting a position of the sidewall based on measured amount of displacement of the sidewall; andapplying pressure to the sidewall with a mechanical actuator according to the determined pressure profile to control the position of the sidewall.2. The method of claim 1 , wherein measuring an amount of displacement of a sidewall comprises measuring a relative amount of displacement of the sidewall relative to another portion of the wire saw frame.3. The method of further comprising fine tuning a position of the wire guide comprising:measuring a relative amount of displacement between the wire guide and the sidewall to generate wire guide displacement data; andcontrolling the position of the wire guide based on the wire guide displacement data.4. The method of claim 3 , wherein the mechanical actuator is a first mechanical actuator claim 3 , and wherein controlling the position of the wire guide comprises:connecting a second mechanical actuator to the bearing of a wire guide; andaxially displacing the bearing relative to the frame of the wire saw with the second mechanical actuator.5. ...

Articulating band saw and method

An articulating band saw apparatus provides a frame that includes a vertically extending section having upper and lower end portions. An elevator moves between the upper and lower end portions of the frame. A first hydraulic actuator is supported on the elevator for movement therewith. A first arm provides arm end portions, the first arm supported by the first hydraulic actuator. An end of the first arm supporting a second hydraulic actuator that is spaced away from the first hydraulic actuator. The second hydraulic actuator supports a second arm. An endless band type saw is mounted on the free end of the second arm generally opposite the second actuator. The band saw is movable by articulation of the first and second actuators and resulting movement of the first and second arms. In one embodiment, the band saw is a diamond wire saw.

Method and apparatus for resuming the wire sawing process of a workpiece after an unplanned interruption

A substantial reduction in scrap produced by an interrupted process for the sawing of a workpiece into a multiplicity of wafers with a wire saw caused by wire breakage, is made possible by detecting the exact or approximate position of the wire break, repairing or replacing the sawing wire, and rethreading the sawing wire web into the saw kerfs, while excluding the kerf in which breakage occurred.

Device for splitting moving material web

Изобретение относитс  к промышленности строительных материалов и может найти при.менение при производстве мине- раловатных изделий. Цель изобретени  - повышение надежности резки минераловат- ного ковра. Держатель резательных элементов выполнен в виде пространственной рамы, совершающей возвратно-поступательные движени  с помош,ью кривошипно- шатунного привода. На верхних гран х рамы смонтированы перематываюш.ие барабаны с эластичными режуш.ими элементами , образуюш,ими несколько последовательных р дов. 2 ил. Q S The invention relates to the building materials industry and can be used in the manufacture of mineral wool products. The purpose of the invention is to increase the reliability of cutting a mineral wool carpet. The holder of the cutting elements is made in the form of a spatial frame, reciprocating with the help of a crank drive rod. On the upper edges of the frame, there are mounted rewindable drums with elastic cutting elements, forming several successive rows of them. 2 Il. Q S

Diamond wire saw

FIELD: process engineering. SUBSTANCE: invention relates to processing of hard and fragile non-metals, particularly, to silicon ingot cutter. Diamond wire saw includes cells of diamond wire webs wound on parallel reels to cut the blanks at table for cutting. Note here that diameter of at least one next web in direction of cutting of larger than that of previous web located ahead in cutting direction. This allows higher efficiency of silicon use for production purposes since made cuts are narrower while silicon plate depth is greater. EFFECT: development of silicon ingot cutter. 11 cl, 8 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 558 561 C2 (51) МПК B28D 5/04 (2006.01) B23D 57/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ (21)(22) Заявка: ИЗОБРЕТЕНИЯ К ПАТЕНТУ 2013116724/03, 29.02.2012 (24) Дата начала отсчета срока действия патента: 29.02.2012 (72) Автор(ы): СОН Жинксинь (CN) (73) Патентообладатель(и): Гуйлинь Чемпион Юнион Даймонд Ко., Лтд (CN) Приоритет(ы): (30) Конвенционный приоритет: R U 29.04.2011 CN 201110112869.1 (43) Дата публикации заявки: 20.10.2014 Бюл. № 29 (45) Опубликовано: 10.08.2015 Бюл. № 22 2 5 5 8 5 6 1 (56) Список документов, цитированных в отчете о поиске: DE 19739966 A1, 18.03.1999. US 3395204 A, 30.07.1968. EP 1745875 A2, 24.01.2007. DE 202008008720 U1, 16.10.2008 (85) Дата начала рассмотрения заявки PCT на национальной фазе: 12.04.2013 (86) Заявка PCT: 2 5 5 8 5 6 1 R U (87) Публикация заявки PCT: C 2 C 2 CN 2012/071788 (29.02.2012) WO 2012/146084 (01.11.2012) Адрес для переписки: 107078, Москва, а/я 265, ООО "Прозоровский и партнеры" (54) АЛМАЗНАЯ ПРОВОЛОЧНАЯ ПИЛА (57) Реферат: Изобретение относится к устройству для обработки твердых и хрупких неметаллических материалов, в частности к устройству для разрезания слитков кремния. Алмазная проволочная пила, содержащая ячейки из алмазных проволочных полотен, намотанных на параллельные катушки с возможностью резания заготовки на столике для резки, причем ...

DIAMOND WIRE SAW

1. Алмазная проволочная пила, содержащая алмазное проволочное полотно (2), при этом:по крайней мере, два алмазных проволочных полотна расположены спереди и сзади режущей рабочей поверхности вдоль направления рабочей подачи или, по крайней мере, две группы алмазных проволочных полотен (2) расположены спереди и сзади более чем одной из расположенных параллельно режущих рабочих поверхностей;причем алмазные проволочные полотна (2) в одной группе расположены параллельно друг другу, образуя режущую ячеистую поверхность, где диаметр последнего алмазного проволочного полотна или последующей группы алмазных проволочных полотен (2) равен или больше, чем у предыдущего алмазного полотна (2) или предыдущей группы алмазных проволочных полотен (2).2. Алмазная проволочная пила по п.1, отличающаяся тем, что режущая ячеистая поверхность образована намоткой одного или более протяженного алмазного проволочного полотна (2) на одной группе катушек (3).3. Алмазная проволочная пила по п.2, отличающаяся тем, что в одной группе катушек (3) прямоугольная ячейка образована, по меньшей мере, двумя катушками (3), треугольная ячейка образована тремя катушками (3), многоугольная ячейка образована большим числом катушек (3).4. Алмазная проволочная пила по п.3, отличающееся тем, что четыре катушки (3) расположены в четырех углах, образуя прямоугольную форму проволочной ячейки.5. Алмазная проволочная пила по п.4, отличающаяся тем, что прямоугольная проволочная ячейка состоит из двух или более групп, и каждая из групп прямоугольной проволочной ячейки объединена с остальными с образованием двухслойной или многослойной поверхности режущей ячейки.6. Алмазная пр РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (51) МПК B28D 5/04 (13) 2013 116 724 A (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ЗАЯВКА НА ИЗОБРЕТЕНИЕ (21)(22) Заявка: 2013116724/03, 29.02.2012 (71) Заявитель(и): Гуйлинь Чемпион Юнион Даймонд Ко., Лтд (CN) Приоритет(ы): (30) Конвенционный приоритет: 29.04.2011 CN 201110112869.1 (85) ...

It is cut into the method for many especially slices of uniform thickness simultaneously by workpiece

用于沿着严格的凸状切割面从圆柱形工件同时切割出许多切片的方法，包括借助于安装条带和线锯的供给器具以工件的轴线平行于线导辊的轴线地保持工件；借助于供给设备通过线锯的线栅垂直地从上方移动工件，其中线栅是通过围绕线导辊缠绕线并且垂直于线导辊的轴线地在线导辊的凹槽中引导其而由相互平行并且在一个平面内的许多线部分形成的；并且向线部分供给作为切割器具的载液中的坚硬物质的悬浮液，而具有纵向张力的线部分由于线导辊的转动在第一旋转方向和与第一旋转方向相反的第二旋转方向之间的连续交变的结果而相对于工件作相对运动，其中在沿第一方向转动期间，线被移动第一长度，并且在沿第二方向转动期间，线被移动第二长度，并且第二长度被选择成以致比第一长度短，其特征在于，在切割操作开始时，选择第一纵向线张力，并且在切割操作结束时，选择第二纵向线张力，其中第一纵向张力被选择成以便大于第二纵向张力。

Wire-saw excavation apparatus that can change the cutting line according to the cutting section tunnel excavation method using the same

본 발명은 굴착하고자 하는 암반의 대상면의 절단구획에 따라 천공된 복수의 진입공에 설치되어 와이어-쏘를 이용하여 상기 대상면을 굴착하는 와이어-쏘 굴착장치에 관한 것으로서, 특히 본 발명의 일 실시예에 따른 와이어-쏘 굴착장치는 하나의 지지암에 N개의 풀리를 설치함으로써 N개의 방향으로 암석을 1회에 절단할 수 있어 작업효율을 현저히 향상시킬 수 있다. The present invention relates to a wire-saw excavation apparatus for excavating the target surface using a wire-saw installed in a plurality of entry holes drilled according to the cut section of the target surface of the rock to be excavated, and in particular, one of the present invention. The wire-saw excavation apparatus according to the embodiment can cut rocks in N directions at once by installing N pulleys on one support arm, and thus work efficiency can be remarkably improved.

METHOD AND MACHINE FOR MANUFACTURING SEMICONDUCTOR, PHOTOVOLTAIC CELL TYPE OR SIMILAR ELECTRONIC COMPONENT

The invention relates to a method for producing a semiconductor, of the photovoltaic cell type, or similar electronic components. According to the invention, at least one silicon wafer is cut from the cross-section of a silicon rod and, after doping, a substrate is assembled on either side of the silicon wafer and the latter is cut into two parts through the thickness of the silicon, so as to form two semiconductor units each comprising a substrate and a thin silicon film.

METHOD AND MACHINE FOR MANUFACTURING SEMICONDUCTOR, PHOTOVOLTAIC CELL TYPE OR SIMILAR ELECTRONIC COMPONENT

Procédé de fabrication d'un semi-conducteur, du type cellule photovoltaïque ou composants électroniques similaires, permettant à partir d'un barreau de silicium, de découper au moins une galette de silicium dans la section transversale dudit barreau de silicium, puis après dopage, d'assembler un substrat de chaque côté de ladite galette de silicium, et de la couper en deux parties dans l'épaisseur du silicium, pour former deux unités semiconductrices comportant chacune un substrat et une fine couche de silicium. A method of manufacturing a semiconductor, such as a photovoltaic cell or similar electronic components, allowing, starting from a silicon bar, to cut at least one silicon wafer in the cross section of said silicon bar, and then after doping, assembling a substrate on each side of said silicon wafer, and cutting it into two parts in the thickness of the silicon, to form two semiconductor units each comprising a substrate and a thin layer of silicon.

METHOD AND DEVICE FOR MACHINING ANODES FOR THE PREPARATION OF ALUMINUM BY ELECTROLYSIS

CYLINDRICAL-TYPE SPRING FOR USE AT HIGH TEMPERATURES AND PROCESS FOR PRODUCING SUCH A SPRING

Cutting wire cutting device adopting the form of a closed loop

Le dispositif (100) de découpe d’un objet comporte un fil (101) de découpe. Ce fil (101) de découpe se présente sous la forme d’une boucle fermée et est agencé de sorte à permettre une découpe simultanée de l’objet en au moins trois parties. Figure à publier avec l’abrégé : Fig. 1 The device (100) for cutting an object comprises a cutting wire (101). This cutting wire (101) is in the form of a closed loop and is arranged so as to allow simultaneous cutting of the object into at least three parts. Figure to be published with the abstract: Fig. 1

CUTTING DEVICE, IN PARTICULAR BETWEEN TWO ZONES OF DIFFERENT HARDNESS

CE DISPOSITIF COMPREND UNE CHAINE QUI COMPORTE, REPARTIS SUR SA LONGUEUR, D'UNE PART, DES ELEMENTS DE COUPE 8 DONT CHACUN PRESENTE UNE SECTION POLYGONALE DONT LES ARETES 12 SONT TRANCHANTES, ET D'AUTRE PART, DES ELEMENTS INTERCALAIRES 9 DONT LA SURFACE EXTERIEURE EST SITUEE A UNE DISTANCE MAXIMALE DU CENTRE DE LA CHAINE INFERIEURE A LA DISTANCE ENTRE LEDIT CENTRE ET LES ARETES TRANCHANTES DES ELEMENTS DE COUPE, LES ELEMENTS INTERCALAIRES 9 ET LES ELEMENTS DE COUPE 8 ETANT MONTES DE FACON A POUVOIR PIVOTER AUTOUR DE L'AXE DE LA CHAINE. APPLICATION A LA DECOUPE DE LA VIANDE. THIS DEVICE INCLUDES A CHAIN WHICH INCLUDES, DISTRIBUTED OVER ITS LENGTH, ON THE ONE HAND, CUTTING ELEMENTS 8 EACH OF WHICH HAS A POLYGONAL SECTION WHOSE EDGES 12 ARE SHARP, AND ON THE OTHER HAND, INTERCALAR ELEMENTS 9 WHOSE EXTERNAL SURFACE IS SITUATED AT A MAXIMUM DISTANCE FROM THE CENTER OF THE LOWER CHAIN THAN THE DISTANCE BETWEEN THE CENTER AND THE SHARP EDGES OF THE CUTTING ELEMENTS, THE INTERCALING ELEMENTS 9 AND THE CUTTING ELEMENTS 8 BEING MOUNTED TO BE ABLE TO PIVOT AROUND THE AXIS OF CHAIN. APPLICATION TO THE CUTTING OF MEAT.

Blade mounting system for fret saw - blade jaws are locked by spring loaded slides on frame arms

The fret saw has a U shaped frame with cylindrical sockets on the ends of the arms. Jaws grip the ends of the blades and have threaded extension shafts which pass through the sockets and receive a handle or a wing nut. To prevent rotation of the jaws once they have been set each arm of the frame carries a sliding sleeve which has a lower extension abutting a face of the polygonal section end of its respective pair of jaws. Compression springs extend between the sleeves and studs threading into the arms of the frame; the sleeves having slots which receive similar studs which are used to lock the sleeves in position, the system allowing a simple blade locking to be achieved.

Method and device for cutting aerated concrete

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Cutting wire cutting device adopting the form of a closed loop

Le dispositif (100) de découpe d’un objet comporte un fil (101) de découpe. Ce fil (101) de découpe se présente sous la forme d’une boucle fermée et est agencé de sorte à permettre une découpe simultanée de l’objet en au moins trois parties. Figure à publier avec l’abrégé : Fig. 1 The device (100) for cutting an object comprises a cutting wire (101). This cutting wire (101) is in the form of a closed loop and is arranged so as to allow simultaneous cutting of the object into at least three parts. Figure to be published with the abstract: Fig. 1

Device for cutting stone

The invention relates to a device for cutting stone along paths comprising non-linear parts, including at least one cable cutting device which can move in a vertical direction and which includes an endless cable guided by pulleys, at least one of which is driven in rotation, and cams controlling the movement of the cutting device in a second substantially horizontal direction, characterised in that it comprises two cable cutting devices 2, 3 mounted on the same framework 1 and whose vertical displacement is controlled by the same control means 1, but in opposite directions, the device furthermore including for each cutting device a pair of guide cams 12 which interact directly with the pulleys 3 of the cutting devices 2, the means 6 for controlling the pulleys 3 of the cutting devices 2 being mounted directly on these devices 2.

Method for simultaneously cutting a multiplicity of slices of particularly uniform thickness from a workpiece

엄격하게 볼록한 커팅 면들을 따라, 원통형의 워크피스로부터 다수의 슬라이스들을 동시에 커팅하기 위한 방법으로서, 마운팅 스트립 및 와이어 소오(saw)의 공급 수단에 의해 와이어 가이드 롤러들의 축들에 평행한 워크피스의 축으로 워크피스를 유지하는 단계; 와이어 소오의 그리드를 통해, 공급 디바이스에 의해 위로부터 수직으로 워크피스를 이동시키는 단계를 포함하며, 그리드는 와이어 가이드 롤러들 주변에 와이어를 감고 와이어 가이드 롤러들의 축들에 수직인 와이어 가이드 롤러들에서의 그루브들에 가이드함으로써 서로 평행하며 일 평면에서 진행하는 다수의 와이어 부분들로 형성되며; 그리고 와이어 부분들에 커팅 수단으로서 캐리어 액체에 딱딱한 물질들의 서스펜션을 공급하는 단계를 포함하며, 길이방향 장력을 가지는 와이어 부분들은 회전의 제 1 방향과 회전의 제 1 방향과 반대인 회전의 제 2 방향 사이의 계속적인 변경으로 와이어 가이드 롤러들의 회전 결과로서 워크피스에 관한 상대적 움직임을 설명하며, 제 1 방향에서의 회전 동안, 와이어가 제 1 길이만큼 이동되며, 제 2 방향에서의 회전 동안, 와이어가 제 2 길이만큼 이동되며, 제 2 길이는 제 1 길이보다 더 짧도록 선택되며, 커팅 동작의 시작시에 제 1 길이방향 와이어 장력이 선택되며, 커팅 동작의 종료시에 제 2 길이방향 와이어 장력이 선택되며, 제 1 길이방향 장력은 제 2 길이방향 장력보다 더 크도록 선택된다. A method for simultaneously cutting a plurality of slices from a cylindrical workpiece along rigidly convex cutting planes, comprising the steps of: providing a plurality of slices in parallel with the axes of the workpieces parallel to the axes of the wire guide rollers by means of the mounting strips and wire saws Maintaining a workpiece; Moving the workpiece vertically from above by a feeding device through a grid of wire loops, the grid comprising a plurality of wire guide rollers A plurality of wire portions parallel to each other and guiding in one plane by guiding the grooves; And providing a suspension of rigid materials in the carrier liquid as cutting means to the wire portions, wherein the wire portions having longitudinal tensions are in a first direction of rotation and a second direction of rotation opposite to the first direction of rotation The wire is moved by a first length during rotation in the first direction and during rotation in the second direction the wire is moved in the first direction, The second length is selected to be shorter than the first length, the first longitudinal wire tension is selected at the beginning of the cutting operation, the second longitudinal wire tension is selected at the end of the cutting operation, And the first ...

Method and apparatus for resuming the wire sawing process of a workpiece after an unscheduled interruption

Die vorliegende Erfindung bezieht sich auf ein Verfahren zur Wiederaufnahme eines unterbrochenen Prozesses zum Zersägen eines Werkstückes in eine Vielzahl von Scheiben mit einer Drahtsäge, die einen mit Schneidkorn belegten Sägedraht, beispielsweise einen Diamantsägedraht, benutzt. Das erfindungsgemäße Verfahren wird hier am Beispiel eines Prozesses zum Zersägen eines Werkstückes aus Halbleitermaterial in eine Vielzahl von Scheiben mit einer Diamantdrahtsäge dargestellt, eignet sich aber auch für Werkstücke aus anderen Materialien. Darüber hinaus umfasst die vorliegende Erfindung auch eine Vorrichtung zum Zersägen eines Werkstückes in eine Vielzahl von Scheiben mit einem Sägedraht, wobei diese Vorrichtung die Erkennung der Position eines Drahtrisses ermöglicht. The present invention relates to a method of resuming an interrupted process of sawing a workpiece into a plurality of disks with a wire saw using a cutting wire covered with cutting grain, for example a diamond saw wire. The method according to the invention is illustrated here using the example of a process for sawing a workpiece made of semiconductor material into a plurality of disks with a diamond wire saw, but is also suitable for workpieces made of other materials. In addition, the present invention also includes an apparatus for sawing a workpiece into a plurality of disks with a saw wire, which apparatus enables detection of the position of a wire tear.

Device for improved sawing of a piece into thin slices

Dispositif de sciage de pièces en tranches fines par une nappe de fils (2) parallèles recouverts d'une barbotine, caractérisé par la présence d'une ou plusieurs pièces (3) placées à proximité de l'objet (1) à scier de telle manière qu'elles provoquent, par leur présence, une homogénéisation en pression et en quantité de la barbotine à proximité de l'entrée du fil dans la pièce (1) à scier.

Method and machine for producing a semiconductor, of the photovoltaic cell type, or a similar electronic component

The invention relates to a method for producing a semiconductor, of the photovoltaic cell type, or similar electronic components. According to the invention, at least one silicon wafer is cut from the cross-section of a silicon rod and, after doping, a substrate is assembled on either side of the silicon wafer and the latter is cut into two parts through the thickness of the silicon, so as to form two semiconductor units each comprising a substrate and a thin silicon film.

Metal wire and saw wire

於含有鎢之金屬線中，金屬線中鎢之含有率為90 wt%以上，金屬線之拉伸強度為4000 MPa以上，金屬線之彈性模數為350 GPa以上且450 GPa以下，金屬線之線徑為60 μm以下，金屬線之與線軸正交之剖面之平均結晶粒度為0.20 μm以下。

HIGH-TEMPERATURE TYPE CYLINDRICAL TYPE SPRING AND METHOD FOR PRODUCING SUCH SPRING

L'INVENTION CONCERNE UN RESSORT 10 DE TYPE CYLINDRIQUE UTILISABLE AUX HAUTES TEMPERATURES ET SON PROCEDE DE REALISATION. IL EST REMARQUABLE EN CE QU'IL EST CONSTITUE D'UN TUBE CYLINDRIQUE CREUX, EN MATERIAU REFRACTAIRE NON METALLIQUE, QUI PRESENTE DES EVIDEMENTS NON JOINTIFS 11 A 11 DE HAUTEUR H, SELON DES BANDES, DISTANTES ENTRE ELLES DE E, SENSIBLEMENT PERPENDICULAIRES A L'AXE DU TUBE CYLINDRIQUE CREUX, CES EVIDEMENTS ETANT REPARTIS DANS LE TUBE SELON UNE DISPOSITION HELICOIDALE, CHAQUE EVIDEMENT 11 A 11 ETANT CONSTITUE PAR UN CYLINDRE DE HAUTEUR H, DONT LA GENERATRICE SE DEPLACE PARALLELEMENT A L'AXE DU TUBE SUR UNE COURBE FERMEE FORMEE D'UNE PARTIE DU CONTOUR D'UNE SECTION SENSIBLEMENT DROITE DU TUBE CYLINDRIQUE CREUX, COMPRENANT UNE PORTION DES CONTOURS RELATIFS AUX FACES INTERNE ET EXTERNE DU TUBE CYLINDRIQUE CREUX, LA COURBE FERMEE SUBISSANT, POUR DEUX EVIDEMENTS VOISINS, UNE ROTATION PAR RAPPORT A L'AXE DU TUBE CYLINDRIQUE CREUX. LE MATERIAU REFRACTAIRE NON METALLIQUE PEUT ETRE DU QUARTZ, DU NITRURE DE BORE OU DU CARBONE. IL TROUVE SON APPLICATION DANS LA TRANSMISSION DE MOUVEMENT AUX HAUTES TEMPERATURES EN PARTICULIER LORSQUE DES CONDITIONS DE PARFAITE PROPRETE SONT DESIREES COMME, PAR EXEMPLE, DANS LE CAS DE LA METALLURGIE DES SEMI-CONDUCTEURS. APPLICATION: METALLURGIE DES SEMI-CONDUCTEURS, MECANIQUE DES HAUTES TEMPERATURES. THE INVENTION CONCERNS A SPRING 10 OF CYLINDRICAL TYPE USABLE AT HIGH TEMPERATURES AND ITS EMBODIMENT PROCESS. IT IS REMARKABLE IN THAT IT IS CONSTITUTED OF A HOLLOW CYLINDRICAL TUBE, IN NON-METALLIC REFRACTORY MATERIAL, WHICH SHOWS NON-JOINING RECESSES 11 TO 11 OF HEIGHT H, ACCORDING TO THE BANDS, DISTANT BETWEEN THEM FROM E, SENSITIVELY PERPENDICULAR '' AXIS OF THE HOLLOW CYLINDRICAL TUBE, THESE RECESSES BEING DISTRIBUTED IN THE TUBE ACCORDING TO A HELICOIDAL ARRANGEMENT, EACH RECESS 11 TO 11 BEING CONSTITUTED BY A CYLINDER OF HEIGHT H, WHOSE GENERATOR IS MOVING PARALLEL WITH THE AXIS OF THE ...

Device for cutting gas concrete

The method and the device involve using cutting wires driven reciprocally in their longitudinal direction.Wire ends (57) are held in position by means of wire end holders (55) which are guided in their lengthwise direction relative to a cutting structure (14).The average cutting speed V is at least six times higher than the material carrying speed S and the wire end holders are driven with a frequency of more than 10 Hz., and preferably with a frequency of more than 25 Hz., e.g. a frequency of approximatively 50 Hz.

Wire-saw excavation apparatus and tunnel excavation method using the same

Multi wire stone block cutting machine

A multi-wire machine for cutting blocks of natural or artificial stone, comprising: wire loops (2) with diamond inserts with almost identical length; a motor drum (22) for driving the cutting motion of the wires with diamond inserts; a single tensioning device (23) of each wire loop with diamond inserts; at least one wire guide roller (21) upstream and one downstream of the stone block being cut; and having in the return section (15) of the path of the wire loops (2) with diamond inserts an assembly (14) with spacer roller (1) between the wires with contiguous diamond inserts, provided with grooves (5) for inserting the contiguous wires, and mounted on the structure (12) of the multi-wire machine; the rotation axis (A) of the spacer roller (1) is adjusted at an angle (B) other than a right angle, so as to impress a rotation motion thereon to the single wire (2) with diamond inserts supported in the groove thereof; furthermore, the spacer roller (1) is provided with an outer coating with the grooves (5) obtained on a layer of elastic-plastic material (6) provided on the cylindrical outer surface of the spacer roller.

Method and apparatus for dicing semiconductor wafers

A method and apparatus for dicing a semiconductor wafer in which the wafer is bowed or bent by forcing it into contact with a spherical surface having parallel grooves therein and in which an array of parallel wire saws that are in registration with the grooves is forced against the wafer for sawing parallel channels therethrough. A second array of parallel wire saws that are orthogonal to the wires of the first array is provided spaced therefrom for sawing parallel channels through the wafer that are orthogonal to the channels produced by the first array of parallel wire saws.

Methods and system for controlling a surface profile of a wafer

Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. Based on the measured amount of displacement of the sidewall, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.

Diamond wire saw device

Method and apparatus for cutting highly brittle material

Method for cutting a multiplicity of slices from workpieces by means of a wire saw during a sequence of cut-off operations

一種用於在分為初始切割和後續切割的系列切斷操作期間藉助於線鋸從工件上切割多個切片的方法，其中，該線鋸包含鋸線的移動線區段的線陣列以及致動裝置，該線陣列在二個線導輥之間的平面內張緊，其中，該二個線導輥中的每一個均支撐在固定軸承和浮動軸承之間。該方法包含：在每次切斷操作期間，在存在對工件起研磨作用的工作流體和硬質材料的情況下，藉助於致動裝置使各個工件沿垂直於工件軸且垂直於線陣列平面的進給方向進給穿過線陣列。

A method of resuming the wire sawing process of a workpiece after an unscheduled interruption

Verfahren zur Wiederaufnahme eines unterbrochenen Prozesses zum Zersägen eines Werkstücks (5) in eine Vielzahl von Scheiben mit einer Drahtsäge, umfassend einen Sägedraht (3), der ein aus vielen parallel angeordneten Drahtabschnitten bestehendes Drahtgatter (4) aufspannt, wobei der Sägedraht (3) mit einer Vorwärtsbewegung von einer Sendespule (1a) abgewickelt wird, über mindestens eine drehbare Umlenkrolle (2) in das Drahtgatter (4) geführt wird, das Drahtgatter (4) über mindestens eine weitere drehbare Umlenkrolle (2) wieder verlässt, auf eine Empfängerspule (1b) aufgewickelt wird und der Sägedraht (3) vor der Unterbrechung abwechselnd in zeitlich definierten Intervallen um eine Länge L1 vorwärts und um eine Länge L2 rückwärts bewegt wurde; wobei das Drahtgatter (4) zur Wiederaufnahme des unterbrochenen Prozesses unter Vorwärtsbewegung mit einer ersten Geschwindigkeit v1 des Sägedrahtes (3) in die vorhandenen Sägespalte des Werkstückes (5) unter Zugabe eines flüssigen Sägemediums eindringt bis das Drahtgatter (4) bzw. das Werkstück (5) an der Position der Unterbrechung des Drahtsägeprozesses angelangt ist, und wobei der Sägedraht (3) zum Stillstand kommt, wobei der Draht (3) bei der Wiederaufnahme des Sägevorganges abwechselnd in zeitlich definierten Intervallen eine Länge L3 mit einer Geschwindigkeit v vorwärts und eine Länge L4 mit einer Geschwindigkeit v‘ rückwärts bewegt wird, wobei L4 kleiner als L3 ist und eine Vorwärtsbewegung und eine Rückwärtsbewegung einem Zyklus Z entsprechen, und bei jeder, jeder zweiten oder nach einer beliebigen Anzahl von Vorwärtsbewegungen die bei der Vorwärtsbewegung abgewickelte Drahtlänge L3 verlängert wird, bis die Drahtlänge L3 der Drahtlänge L1 der Vorwärtsbewegung vor der Unterbrechung entspricht. A process for resuming an interrupted process for sawing a workpiece (5) into a plurality of disks with a wire saw, comprising a saw wire (3) which spans a wire gate (4) consisting of many parallel wire sections, the saw wire (3) ...

Method and apparatus for detecting wire break of wire saw

와이어 열을 형성하기 위해 복수의 처리 롤러(8, 9) 주위에 감긴 워크 처리 와이어(3)를 갖고, 처리 롤러(8, 9)가 회전하여 와이어 열을 주행시키고, 워크(13)가 와이어 열과 서로 접촉하게 되어 워크(13)가 절단되는 실톱(2)의 와이어 단선을 감지하는 방법을 제공한다. 상기 방법에서, 와이어(3)의 이동 경로의 일부를 구성하는 와이어(3)는 동일한 방식으로 와이어 열과 근접하여 주행될 수 있다. 와이어 열에 근접하여 주행하는 와이어부는 단선 감지부(3a)로 사용되고, 단선 감지부(3a)에서 와이어(3)의 장력의 변화나 행동과 같은 변이가 감지되어, 와이어 열에서 발생하는 와이어(3)의 단선이 감지된다. The work processing wires 3 are wound around the plurality of processing rollers 8 and 9 to form the wire rows, the processing rollers 8 and 9 rotate to travel the wire rows, and the work 13 is connected to the wire rows. It comes in contact with each other to provide a method for detecting the wire disconnection of the jigsaw 2 is cut. In this way, the wires 3 constituting part of the path of movement of the wires 3 can run in close proximity to the wire rows in the same way. The wire part traveling in close proximity to the wire row is used as the disconnection detection unit 3a. In the disconnection detection unit 3a, a change such as a change in tension or behavior of the wire 3 is detected, and the wire 3 generated in the wire row is detected. The disconnection of is detected.

Carving device,in particular between two areas of different hardness

Wire saw

In a wire saw that serves for cutting polygonal, columnar bricks out of an ingot of a generally inorganic crystalline material, more particularly a semiconductor material, a cutting yoke (5) having at least two angularly offset saw wire fields is provided that is displaceable in the saw feed direction (7). The yoke is coupled to a carrier (38) by means of an assembly of two rails (40, 42). In this manner, the yoke (5) is easily removable from the process chamber (1) of the wire saw by pulling one rail (42) out of the other rail (40) in order to perform maintenance operations etc. The saw wire in the cutting yoke (5) is guided in an essentially meander-shaped path so that the cutting wire essentially only extends in the wire fields (sections 14, 16) and on the sides of the frame (20) of the cutting yoke (5).

Wire saw and wire cutting method

Patent FR2231486B2

Wire sawing

Drahtsäge zum Sägen mindestens eines Werkstücks (30) mittels einem oder mehrerer Sägedrähte, die zwischen Drahtführungsmitteln (3, 4, 5, 6) aufgespannt sind und die ein Feld aus äquidistant nebeneinander liegenden Sägedrähten bilden, dadurch gekennzeichnet, dass die Drahtsäge mindestens zwei Sägefelder (10, 20) umfasst, wobei jedes Sägefeld einen unabhängigen Drahtantrieb (12, 22) aufweist.

Method of cutting of hard-material blocks into plates by wire saw and wire saw intended for method realization

FIELD: mechanical engineering. SUBSTANCE: method relates to cutting of hard-material blocks particularly of semiconductors, glass and ceramics into plates by action of easily fed abrasive and endless circulating strong carrying members. Since the latter passes through peripheral recesses of rollers, it forms chain with parallel axles of roller system. Material being cut is forced through this chain. Strong carrying member, which is saw wire passes through peripheral recesses of roller system rollers consisting of at least one pair of deflecting rollers and at least one pair of guide rollers mounted for rotation in opposite directions. Material being cut is forced into strong carrying member so that it is directed, respectively, to two adjacent cuts of block in opposite directions. In this case, plane- parallelism of walls of cut plates without bevels is obtained with required speed cutting process continuity preserved, that is without power-consuming reversal of direction of strong carrying member movement. EFFECT: enhanced efficiency. 6 cl, 6 dwg

Multiwire sawing machine for the cutting of material in block form

The sawing machine comprises a guide pulley composed of a plurality of wheels of the same diameter, coaxial and mutually juxtaposed side by side in a pack on a corresponding shaft or the like According to the invention, in said wheel pack of the guide pulley (P2) a wheel (P21) presenting at least an external circumferential groove (P21') and a wheel (P22) presenting a plurality of external circumferential grooves (P22') are alternated in a repetitive sequence. Said wheels (P21, P22) comprise a radially internal part (P21.1, P22.1), at which they are mutually juxtaposed in a pack. Each wheel (P21) presenting at least a groove (P21') comprises a radially external part (P21.2) having an external annular rim (P21.3) of lesser width than the thickness of said internal part (P21-1) thereof, while each wheel (P22) presenting a plurality of grooves (P22') comprises a radially external part (P22.2) having an external annular rim (P22.3) of a width greater than the thickness of said internal part (P22.1) thereof, and which overlaps, laterally, partially and in a freely revolving manner, the radially internal part (P21.1) of each wheel (P21) adjacent and presenting at least a groove (P21')

PROCESS AND DEVICE FOR CUTTING DEVICE OF ALVEOLAR BETA

Method and device for cutting gas concrete

In order to decrease shocks and vibrations to plastic gas concrete during cutting thereof with wires, the cutting wires are guided and driven separately from one another in a cutting frame.

Wire-saw excavation apparatus and tunnel excavation method using the same

A wire-saw excavation apparatus comprising a plurality of entry arms (10) with pulleys (12) installed in each direction at an end and with a wire-saw (W) wired through the pulleys, a support frame (20), and a driving unit/roller (30). A tunnel excavation method, using the wire-saw excavation apparatus, includes the steps of (a) drilling a plurality of entry holes (51-54) on the target surface (1) of the rock along a cutting section (C), (b) inserting into the entry holes the entry arms with the wire- saw wired through the pulleys to correspond with multi-directional cutting lines (L) of the cutting section, (c) installing a support frame comprising a matrix structure having at least a first frame (21) placed in direction 1 and at least a second frame (22) placed at direction 2 to correspond with the cutting section, and a having plurality of insertion holes (23) to insert the entry arms therein, and (d) operating the driving roller to cause the wire-saw to cut the rock at the cutting section.

Method and machine carrier for producing thin slices from a block of material

Die Erfindung Verfahren zur Herstellung von dünnen Scheiben aus einem Materialblock durch Zertrennen mittels einer Multi-Drahtsäge (1) mit einer Vielzahl von Drahtschlaufen, wobei der Materialblock vor dem Zertrennen auf mehrere parallel mit Abstand zueinander verlaufende Opferstreifen (7; 7') aufgeklebt wird und die Opferstreifen auf einen Maschinenträger (3; 3') der Multi-Drahtsäge aufgeklebt werden. Des Weiteren betrifft sie einen Maschinenträger einer Multi-Drahtsäge zur Durchführung eines solchen Verfahrens. The invention Process for the production of thin slices from a block of material by cutting by means of a multi-wire saw (1) with a plurality of wire loops, the block of material being glued to several parallel and spaced-apart sacrificial strips (7; 7 ') prior to cutting and the sacrificial strips are glued onto a machine carrier (3; 3 ') of the multi-wire saw. It also relates to a machine carrier of a multi-wire saw for carrying out such a method.

Device for controlling parallel alignment of guide rollers in wire saw apparatus

The present invention relates to a device for controlling parallel alignment of guide rollers used in a wire saw apparatus, and more specifically, to a device for controlling parallel alignment of guide rollers used in a wire saw apparatus, capable of easily controlling parallel alignment of the guide rollers by pressing a guide roller in one direction using a control member, which is moved linearly.

Machining device using a cutting wire to produce slots in an anode to be used for the production of aluminium by electrolysis

A machining device (10), for the production of a slot (76) in an anode (16) for the production of aluminium by electrolysis, comprises : (A) two flywheels (48, 64); (B) a cylindrical cutting wire encircling the flywheels to form a cutting portion extending between the flywheels; (C) a rotary drive mechanism for one of the flywheels for sawing the slot; (D) an aspirator for the particles issuing from the sawing operation. An independent claim is also included for the production of a slot in an anode using this machining device.

Sewing with friction wire

Sawing device

本发明涉及一种用于锯切硅块的锯切装置(1)，该锯切装置包括至少一个用于锯切硅块的锯线(7)，该锯线在基本状态下在纵向上延伸，通过至少一个导向装置(8)在预先给定的、具有多个锯线回环的锯线场域(9)中引导并且能利用卷绕-张紧装置(10)在分段地与锯线(7)的纵向一致的运动方向上以锯线速度(v D )运动通过锯线场域，其中所述锯线场域(9)包括两个子场域(13、14)，它们分别包括多个锯线回环，其中第一子场域(13)通过锯线(7)的第一部段形成，而第二子场域(14)通过锯线(7)的第二部段形成，其中所述部段构造成在基本状态中在纵向上分别简单相关且无重叠。

Roller for support and/or guide of diamond wires in multi-wire machine for cutting blocks of artificial or natural stone

A roller or drum for support and/or guide of diamond wires in multi-wire machines for cutting blocks of artificial or natural stone, comprising: rotating support organs the roller or drum on a pivot or axis of support; a covering (8) made from soft material equipped with grooves (7, 9) for housing, supporting and guiding closed loop adjacent diamond wires; and it is characterized in that the roller or drum in subdivided into at least two sections (2, 3, 4, 32 or 42) or roller or drum constituting at least two parts of roller or drum, for supporting and guiding a number of adjacent diamond wires equal to or more than two per part of roller or drum; correspondingly, each section has its respective part or roller or drum equipped with supporting and rotating organs for each part which are independent and connected to a supporting and rotating axis or pivot of the roller or drum. In a form of construction, the supporting axis or pivot is subdivided into parts of supporting axis or pivot of a width corresponding to the width of the parts of roller of the said sections (2, 3, 4 or 32); the rotating support organs on the corresponding part of supporting axis or pivot allow the section of roller or drum to be separate or joined to the adjacent sections by means of the connection/assembly parts of supporting axis or pivot drawn together. In a further form of construction, the dismantling of the hub (46) and the relative rotating modular body (41 ) of part/section (42) occurs by means of the dismantling of a flange coupling equipped with ears (44, 45) connected through openings (51) and grooves (48) in the opposite flange.

Stone cutting machine

A stone cutting machine is disclosed comprising a frame, a sliding beam movably supported on the frame, and one or more flexible wires having a plurality of cutting or honing segments projecting from the periphery thereof carried tautly by the beam. Motor means are provided for rotating and axially reciprocating the wire and for moving the sliding beam supporting the wire on the frame.

Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes

A method uses a wire saw to cut slices from a workpiece. The wire saw has an array of saw wire tensioned in a plane between two rollers supported between fixed and floating bearings. During a cut-off operation, the workpiece is fed through the wire array with simultaneous axial movement of the floating bearings by adjusting the temperature of the fixed bearings with a cooling fluid in accordance with the temperature of the cooling fluid being in dependence on a depth of cut and correlating with a first correction profile, which specifies the travel of the floating bearings in dependence on the depth of cut. Also, the workpiece is fed through the wire array while simultaneously moving the workpiece along the workpiece axis in accordance with a second correction profile, specifying the travel of the workpiece. The first and second correction profiles are opposed to a shape deviation.

Plate cutting method and cutting device for hard material block using jigsaw

본 발명은 헐거운 상태로 가해지는 연마제 및, 로울러 장치의 공축 로울러의 주변 그루브내에 가이드되어 계속적으로 선회하는 방식으로 고정된 캐리어의 작용에 의해 경질 재료의 블록을 판형 절편으로 절단하는 방법에 관한 것으로서, 1쌍 이상의 편향 로울러 및 1쌍 이상의 가이드 로울러로 구성되는 로울러 시스템의 로울러 주변 그루브내에서 동작하는 캐리어를, 블록내의 각각 인접하는 2개 절단부에서 반대 방향으로 절단을 수행하는 방식으로, 절단시킬 재료내로 가압시킴으로써 공정을 달성하게 된다.

It is cut into the method for the section of many uniform thickness simultaneously by workpiece

用于沿着严格的凸状切割面从圆柱形工件同时切割出许多切片的方法，包括借助于安装条带和线锯的供给器具以工件的轴线平行于线导辊的轴线地保持工件；借助于供给设备通过线锯的线栅垂直地从上方移动工件，其中线栅是通过围绕线导辊缠绕线并且垂直于线导辊的轴线地在线导辊的凹槽中引导其而由相互平行并且在一个平面内的许多线部分形成的；并且向线部分供给作为切割器具的载液中的坚硬物质的悬浮液，而具有纵向张力的线部分由于线导辊的转动在第一旋转方向和与第一旋转方向相反的第二旋转方向之间的连续交变的结果而相对于工件作相对运动，其中在沿第一方向转动期间，线被移动第一长度，并且在沿第二方向转动期间，线被移动第二长度，并且第二长度被选择成以致比第一长度短，其特征在于，在切割操作开始时，选择第一纵向线张力，并且在切割操作结束时，选择第二纵向线张力，其中第一纵向张力被选择成以便大于第二纵向张力。

Device for cutting meat from bone: chain with cutters which swivel

Wire saw device and method for operating same

A wire management unit adapted for a wire saw device (200; 300; 400; 500) having a wire (213) forming a wire web for cutting is described. The wire management unit includes a pulley moving device (240; 440); at least one pulley (220; 520) for redirecting the wire and adapted for guiding the wire to the wire web, wherein the at least one pulley is connected to the pulley moving device and is adapted to rotate around a pulley axis; a spool (212) for providing a wire towards the wire web during unwinding of the wire from the spool, wherein the spool includes a rotation axis (212a) and a wire carrying area (213a) with a length along the direction of the rotational axis; and wherein the pulley moving device is adapted to move the at least one pulley along the direction of the rotation axis.

Wire saw

Provided is a wire saw which uses a cutting wire to cut a workpiece, this wire saw being such that wire tension can be adjusted with high responsiveness. The wire saw has first and second workpiece cutting sections (1A, 1B). The workpiece cutting sections (1A, 1B) each comprise a pair of guide rollers (10a, 10b). A wire (W) is passed over these guide rollers, resulting in workpiece cutting wire groups being formed. This wire saw is further provided with a control device (50) and a tension detection device (18) which detects the tension of the wire (W) between the workpiece cutting sections (1A, 1B). On the basis of the tension detected by the tension detection device (18), the control device (50) changes the rotational speed of the guide rollers (10a, 10b) of at least one of the workpiece cutting sections so that tension will be brought within an acceptable range.

CUTTING DEVICE, ESPECIALLY BETWEEN TWO DIFFERENT HARDNESS AREAS

Wire sawing device

The wire saw for sawing a work piece, e.g. to make silicon wafers for electronic applications, has two or more sawing fields ( 10, 20 ) each having a number of saw wires ( 11, 21 ) stretched between respective wire guiding cylinders ( 3, 4; 5, 6 ). The sawing fields are disposed one above the other. A first sawing field ( 10 ) includes deflection rollers ( 7 ) for deflecting slack sides ( 14 ) of its saw wires that face a second sawing field ( 20 ). The slack sides ( 14 ) of the saw wires of the first sawing field are guided over the deflection rollers ( 7 ) so as to deflect the saw wires and thus increase distances of their slack sides ( 14 ) to sawing sides ( 23 ) of the saw wires of the second sawing field ( 20 ).

A method for cutting a shell-type object, a cutter system and a vessel equipped with the cutter system

An object of the invention is achieved by a method for cutting an elongated shell-type object. The method may comprise acts of - providing a gantry defining a portal and comprising a wire grid operable in the portal; - operating the wire grid, whilst - moving the shell-type object through the wire grid along a lateral-axis (Z) substantially perpendicular to the portal. The method is performed by a stationary gantry, where the shell-type object is moved through the portal. Thereby, the method is simplified as there is no need for a rail system for moving the gantry.

Apparatus and method for chopping vertically oriented objects

The invention relates to an apparatus (1) for chopping vertically oriented objects (30). The apparatus (1) has a cell (2) with a housing (3), a frame element (4), at least one fastening means (12) and at least one holding element (13). The housing (3) is formed with a top side (7) and an underside (8) and at least two openings (9, 10), wherein the top side (7) has an opening (9) for receiving the object (30). The cell (2) is configured to be movable in a vertical direction of movement (14) by actuation of the at least one holding element (13) and in a horizontal direction of movement (15) by actuation of the frame element (4). Arranged within the cell (2) is at least one cutting device (18). The invention also relates to a method for chopping vertically oriented objects (30).

Wire saw and method for cutting a slice from a workpiece

Method and device for cutting gas concrete

The method and the device involve using cutting wires driven reciprocally in their longitudinal direction. Wire ends (57) are held in position by means of wire end holders (55) which are guided in their lengthwise direction relative to a cutting structure (14). The average cutting speed V is at least six times higher than the material carrying speed S and the wire end holders are driven with a frequency of more than 10 Hz., and preferably with a frequency of more than 25 Hz., e.g. a frequency of approximatively 50 Hz.

Wire saw equipment

Sawing with abrasive trad

Anordning for tilforming av et antall tynne skiver fra minst to like blokker. Anordningen innbefatter en matespole (1) for tilføring av tråd, et øvre par (3a, 3b) og et nedre par (3c, 3d) av parallelle og innbyrdes avstandsplasserte rulleføringer, samt en oppsamlingsspole (4). En tråd fra matespolen går rundt suksessive spor i rulleføringene, fra nær matespolen og til nær oppsamlingsspolen, slik at det derved dannes en firesidet kontinuerlig bane av tråder over rulleføringenes lengde. Langs rulleføringene blir tråden avledet rundt i det minste to trinsehjul (5a, 5b), slik at derved tråden fjernes fra banen etter at den har passert en rulleføring på et bestemt sted. Tråden føres tilbake til banen via en etterfølgende rulleføring, på et sted som er sideveis forskjøvet fra det sted hvor tråden forlater banen, slik at det derved dannes et gap i trådbanen, hvilket gap deler trådbanen i to atskilte avsnitt, og det ikke kan skje noen skjæring i dette gapet.

DEVICE FOR REGULATING THE DRIVE OF THE CUTTING WIRE OF A WIRE SAW.

Method for separating slices from a workpiece with a sawing wire

Gegenstand der Erfindung ist Verfahren zum Abtrennen von Scheiben von einem Werkstück mit einem Sägedraht, wobei mindestens zwei Drahtführungsrollen ein Drahtgatter aufspannen. Jede Drahtführungsrolle weist in ihrer Mantelfläche eine Vielzahl von Rillen auf, wobei neben einer drahtführenden Rille mindestens eine Rille vorhanden ist, in der während des Drahtsägens kein Draht eingelegt ist und nach dem Verschleiß der drahtführenden Rillen der Sägedraht in die noch nicht verschlissenen, vorher unbelegten Rillen umgewickelt wird. The invention relates to a method for separating discs from a workpiece with a saw wire, wherein at least two wire guide rollers span a wire gate. Each wire guide roller has in its lateral surface a plurality of grooves, wherein in addition to a wire-guiding groove at least one groove is present in the wire saws during the wire sawing no wire and after the wear of the wire-guiding grooves of the saw wire in the not yet worn, previously unoccupied grooves is wrapped.

Silicon rod cutting system

本申请实施例提供了一种硅棒切割系统，包括：机座，所述机座具有至少两个间隔设置的切割工位；至少两个切割装置，固定在所述机座之上，所述切割装置和所述切割工位一一对应；其中，所述切割装置用于对切割工位处的硅棒进行切割；上下料装置，与所述机座固定；其中，所述上下料装置用于圆形的硅棒上料和切割形成的方棒下料；转运装置，安装在所述机座之上且位于所述切割工位之间；其中，所述转运装置用于将所述上下料装置上料的硅棒转运至所述切割工位，且用于将所述切割工位上形成的方棒转运至所述上下料装置。本申请实施例的硅棒切割系统至少两个切割工位共用一个上下料装置和一个转动装置，使得硅棒切割系统的部件较少，占用的空间也较小。

Abrasive wire sawing

A DEVICE FOR CUTTING AN ANIMAL AT THE INTERFACE LEVEL BETWEEN TWO ZONES OF DIFFERENT HARDNESS.

A method for cutting multiple slices from a workpiece with a wire saw during a series of cutting motions

一連の切断動作中にワイヤソーによって被加工物から複数のスライスを切断する方法であって、上記切断動作は、初期の切断と後続の切断とに分割され、上記ワイヤソーは、ソーワイヤの可動ワイヤセクションのワイヤアレイと、駆動装置とを備え、上記ワイヤアレイは、２つのワイヤガイドローラ間の平面において張力をかけられており、上記２つのワイヤガイドローラの各々は、固定軸受と浮動軸受との間に支持されている。一実施形態によれば、上記方法は、各上記切断動作中に、作動流体および上記被加工物に対して研磨するように作用する硬質材料の存在下で、上記駆動装置によって送り方向に沿って上記ワイヤアレイを通るようにそれぞれの被加工物をある送り速度で送るステップを備え、上記送り方向は、被加工物軸に対して垂直であるとともに、上記ワイヤアレイの上記平面に対して垂直であり、上記送るステップは、各上記切断動作中に、第１の温度プロファイルの仕様に従って冷却流体を用いて上記固定軸受の温度を調整することによって、上記浮動軸受の同時軸方向移動とともに、上記ワイヤアレイを通るように上記被加工物を送るステップを備え、上記第１の温度プロファイルは、切込み深さに依存して上記冷却流体の温度を指定し、上記切込み深さに依存して上記浮動軸受の動きを指定する第１の補正プロファイルと相互に関係があり、上記送るステップはさらに、上記被加工物の動きを指定する第２の補正プロファイルの仕様に従って作動要素によって上記被加工物軸に沿って上記被加工物を移動させるのと同時に、上記ワイヤアレイを通るように上記被加工物を送るステップを備え、上記第１の補正プロファイルおよび上記第２の補正プロファイルは、形状偏差と異なるものであり、上記方法はさらに、各上記切断動作中および／または各上記切断動作前に上記形状偏差を判断するステップと、上記切込み深さに依存して、上記送り速度、単位時間当たりに上記ワイヤアレイに供給される作動流体の量、上記作動流体の温度、ワイヤ速度、上記切断動作当たりのワイヤ消費量、およびワイヤ張力などの動作パラメータを設定するステップとを備える、方法。

Multiingot multisliing device using rotary device

The present invention relates to a multi-ingot multi-slicing apparatus using a rotary device. More particularly, the present invention relates to an apparatus which rotatably fixes an ingot to be cut by a wire slicing device to improve the cutting power of the ingot, thereby increasing the cutting speed to reduce the cutting time, and simultaneously cutting two or more ingots, thereby improving the production efficiency. Accordingly, according to the present invention, it is possible to increase the cutting speed of the ingot by fixing the ingot to be cut by the wire slicing device so as to be rotatable, and has the effect of increasing production efficiency by cutting two or more multiple ingots at the same time.

Wire-saw excavation apparatus and tunnel excavation method using the same

A wire-saw excavation apparatus comprising a plurality of entry arms (10) with pulleys (12) installed in each direction at an end and with a wire-saw (W) wired through the pulleys, a support frame (20), and a driving unit/roller (30). A tunnel excavation method, using the wire-saw excavation apparatus, includes the steps of (a) drilling a plurality of entry holes (51-54) on the target surface (1) of the rock along a cutting section (C), (b) inserting into the entry holes the entry arms with the wire- saw wired through the pulleys to correspond with multi-directional cutting lines (L) of the cutting section, (c) installing a support frame comprising a matrix structure having at least a first frame (21) placed in direction 1 and at least a second frame (22) placed at direction 2 to correspond with the cutting section, and a having plurality of insertion holes (23) to insert the entry arms therein, and (d) operating the driving roller to cause the wire-saw to cut the rock at the cutting section.

MACHINE FOR CUTTING BLOCKS AND CUTTING PROCEDURE

Diamond wire saw and producing method thereof

본 발명은 중심에 구비되는 와이어; 및 다이아몬드분말과 탄성수지를 포함하는 혼합물을 상기 와이어의 적어도 일부에 코팅하여 형성되는 코팅부;로 이루어지고, 상기 코팅부는 상기 혼합물을 상기 와이어에 사출성형되어 일체로 구비되는 다이아몬드 와이어 쏘우 및 이의 제조방법에 관한 것이다.

diamond wire machine for cutting natural or artificial stone

máquima de corte a fio diamantado para pedra natural e artificial com uma planta de limpeza sem fio. uma máquina de corte de fio diamantado para pedra natural ou artificial, que compreende: sistema de distribuição de água (12) para o arrefecimento dentro do corte feito pelo fio diamantado na pedra; pelo menos um laço fechado de fio diamantado (3) que, na sequência de uma linha fechada de movimento, repete a corte durante o seu movimento mais profundamente para dentro da pedra; elementos rotativos (4, 5) para o apoio, motorização e tensionamento do fio diamantado, que apresenta um sistema de limpeza adicional para o fio diamatado, que apresenta um sistemade limpeza adicional para o fio diamantado, que apresenta um sistema de limpeza adicional para o fio diamantado, com pelo menos uma área de lavagem (13) imediatamente após o corte e mais, durante a execução do fio, em relação ao primeiro elemento de apoio e motorização (4) do dito fio, dito fio entrando em contato com este depois do corte, o sistema de limpeza que compreende um conjunto de filtração e bombeamento (19) para a recirculaçção da água que abastece a área de lavagem sob alta pressão. são decritas formas de construção com mais áreas de limpeza do que as ditas áreas de limpeza acima, e o conjunto de filtração e bombeamento para a recirculação da água de limpeza. diamond wire cutting machine for natural and artificial stone with a cordless cleaning plant. a diamond wire cutting machine for natural or artificial stone, comprising: water distribution system (12) for cooling within the cut made by the diamond wire in the stone; at least one closed loop of diamond wire (3) which, following a closed line of movement, repeats the cut during its movement more deeply into the stone; rotating elements (4, 5) for the support, motorization and tensioning of the diamond wire, which presents an additional cleaning system for the diamond wire, which presents an additional cleaning system for the diamond wire, which ...

Method and device for simultaneously separating a plurality of discs from a workpiece

The invention relates to a method and a wire saw for simultaneously separating a plurality of discs from a workpiece during a separation process. The method is characterized in that a nonlinear distance function dTAR(WP) is selected on the basis of a target thickness characteristic function TTAR(WP), a distance function dINI(WP), and a thickness characteristic function TINI(WP), wherein dTAR(WP) correlates adjacent grooves in the jacket of the wire guiding rollers at one position WP to a distance during the separation process; TINI(WP) correlates discs which have been obtained during multiple previous separation processes with the wire saw at the position WP to a thickness characteristic measured on the discs; dINI(WP) correlates adjacent grooves in the jacket of the wire guiding rollers at the position WP to a distance during the previous separation processes; TTAR(WP) correlates discs which have been separated at the position WP during the separation process to a target thickness value; and WP indicates the axial position of the adjacent grooves with respect to the axes of the wire guiding rollers.

CUTTING DEVICE, ESPECIALLY BETWEEN TWO POINTS OF DIFFERENT HARDNESS.

Roller for supporting and/or guiding of diamond wires in multi-wire machines for cutting blocks of artificial or natural stone

Abrasive wire sawing

一种用于从至少两个类似的块形成多个薄片的设备，该设备包括用于供给线丝的供线卷轴(1)，上对(3a、3b)和下对(3c、3d)平行间隔开的滚轮导向器和收线卷轴(4)；来自供线卷轴的线丝绕着沿滚轮导向器连续的凹槽穿过，从邻近供线卷轴至靠近收线卷轴，以形成沿滚轮导向器长度的四边连续的线丝网。线丝沿滚轮导向器间隔开，在线丝在预定点通过滚轮导向器之后，线丝围绕至少两个滑轮(5a、5b)转移，以使线丝从所述网移去，并经由后续滚轮导向器在某一点上把线丝重新引入所述网，该某一点横向地偏离线丝离开该网的点，从而在线丝网中存在将所述网分为两个独立部分的间隙，并且在该间隙上不会出现切割作用。

Multi-wire frame and method for cutting blocks of stone material into slabs

A multi-wire frame (12) for cutting blocks of stone material into slabs comprises: at least two columns (14, 16), each of which has, mounted thereon, at least one slide (18, 20) designed to move along the respective column (14, 16); each slide being provided with at least one drum (24, 26), one of which is motor-driven and the others of the idle transmission type, designed to engage a plurality of diamond wires (28, 30) which extend between them. The frame also comprises two wire-guiding rollers (38, 40) provided at the ends of a cutting section of the diamond wires. The frame comprises means for detecting the force applied to the multi-wire frame during the cutting action. An associated method for cutting blocks of stone material into slabs is also described.

Verfahren und schneideinrichtung zum schneiden von schneidfesten leichtbetonkuchen in leichtbetonformkörper sowie verfahren und vorrichtung zur herstellung von leichtbetonformkörpern

Machine for multiple wire cutting of stone materials

A machine (1) for multiple wire cutting of stone materials comprises a supporting structure (2), a plurality of cutting devices (7) mounted parallel with each other on the supporting structure (2) and a supporting device (12) for the cutting devices (7). Each cutting device (7) comprises at least one idle pulley (8), one motor-driven pulley (9) and a cutting wire (10), wound in a loop around the motor-driven pulley (9) and the idle pulley (8). The supporting device (12) comprises two supporting portions (18) located on opposite sides of the cutting devices (7) and at least one movable part (20), at one of the supporting portions (18). The movable part (20) has at least one housing (23) for the cutting wire (10) on its outer surface (22) and slides between a first position (24) and a second position (25). The machine (1) comprises, in communication with the housing (23), a longitudinal passage (29), for housing at least one cutting wire (10), the passage being made on the supporting device (12) and/or on the supporting structure (2).

Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes

A method cuts slices from workpieces using a wire saw having a wire array, which is tensioned in a plane between two wire guide rollers supported between fixed and floating bearings and having a chamber and a shell. The workpiece is fed through the wire array along a feed direction perpendicular to a workpiece axis, while simultaneously changing the shells' lengths by adjusting a temperature of the chambers with a first cooling fluid in accordance with a first correction profile specifying a change in the shells' lengths based on the depth of cut. The floating bearings are simultaneously axially moved by adjusting a temperature of the fixed bearings with a second cooling fluid in accordance with a second correction profile, which specifies a travel of the floating bearings based on the depth of cut. The first correction profile and the second correction profile are opposed to a shape deviation.

Articulating band saw and method

An articulating band saw apparatus provides a frame that includes a vertically extending section having upper and lower end portions. An elevator moves between the upper and lower end portions of the frame. A first hydraulic actuator is supported on the elevator for movement therewith. A first arm provides arm end portions, the first arm supported by the first hydraulic actuator. An end of the first arm supporting a second hydraulic actuator that is spaced away from the first hydraulic actuator. The second hydraulic actuator supports a second arm. An endless band type saw is mounted on the free end of the second arm generally opposite the second actuator. The band saw is movable by articulation of the first and second actuators and resulting movement of the first and second arms. In one embodiment, the band saw is a diamond wire saw.

Articulating band saw and method

An articulating band saw apparatus provides a frame that includes a vertically extending section having upper and lower end portions. An elevator moves between the upper and lower end portions of the frame. A first hydraulic actuator is supported on the elevator for movement therewith. A first arm provides arm end portions, the first arm supported by the first hydraulic actuator. An end of the first arm supporting a second hydraulic actuator that is spaced away from the first hydraulic actuator. The second hydraulic actuator supports a second arm. An endless band type saw is mounted on the free end of the second arm generally opposite the second actuator. The band saw is movable by articulation of the first and second actuators and resulting movement of the first and second arms. In one embodiment, the band saw is a diamond wire saw.

Machine for multiple wire cutting of stone materials

A machine (1) for multiple wire cutting of stone materials comprises a supporting structure (2), a plurality of cutting devices (7) mounted parallel with each other on the supporting structure (2) and a supporting device (12) for the cutting devices (7). Each cutting device (7) comprises at least one idle pulley (8), one motor-driven pulley (9) and a cutting wire (10), wound in a loop around the motor-driven pulley (9) and the idle pulley (8). The supporting device (12) comprises two supporting portions (18) located on opposite sides of the cutting devices (7) and at least one movable part (20), at one of the supporting portions (18). The movable part (20) has at least one housing (23) for the cutting wire (10) on its outer surface (22) and slides between a first position (24) and a second position (25). The machine (1) comprises, in communication with the housing (23), a longitudinal passage (29), for housing at least one cutting wire (10), the passage being made on the supporting device (12) and/or on the supporting structure (2).

一連の切断動作中にワイヤソーによってワークピースから複数のスライスを切断するための方法

初回切断と後続切断とに分けられる一連の切断動作中に、ワイヤソーによってワークピースから複数のスライスを切断するための方法であって、ワイヤソーは、ソーワイヤの可動ワイヤ区域のワイヤアレイと駆動装置とを備え、ワイヤアレイには２つのワイヤガイドローラ間の平面において張力がかけられ、２つのワイヤガイドローラの各々は固定軸受と浮動軸受との間において支持され、少なくとも１つのチャンバとシェルとを備え、当該シェルはワイヤガイドローラのコアを取り囲んでおり、当該シェルにはワイヤ区域のためのガイド溝が構築され、本方法は、各々の切断動作中に、ワークピースに研磨作用する作動流体および硬質材料の存在下で、駆動装置によって、ワークピース軸に対して垂直であるとともにワイヤアレイの平面に対して垂直である送り方向に沿ってワイヤアレイを通してそれぞれのワークピースを送り込むステップを含み、上記送り込むステップは、各々の切断動作中に、第１の温度プロファイルの仕様に従って第１の冷却流体でワイヤガイドローラのチャンバの温度を調整することによって２つのワイヤガイドローラのシェルの長さを変更しながら同時にワイヤアレイを通してワークピースを送り込むステップを含み、第１の温度プロファイルは、切断深さに依存して第１の冷却流体の温度を特定し、切断深さに依存してシェルの長さの変化を特定する第１の補正プロファイルと相関し、上記送り込むステップはさらに、各々の切断動作中に、ワークピースの移動を特定する第２の補正プロファイルの仕様に従って、駆動要素によってワークピースをワークピース軸に沿って移動させると同時に、ワイヤアレイを通してワークピースを送り込むステップを含み、第１の補正プロファイルおよび第２の補正プロファイルは、形状偏差と異なり、本方法はさらに、各々の切断動作の前に形状偏差を判定するステップを含む。

一种多工位环形超声线锯工作台

本发明公开了材料加工技术领域的一种多工位环形超声线锯工作台，包括工作台、传动机构、切割机构、储存机构和支撑机构，支撑机构支撑在地面上，且支撑机构支撑工作台，工作台内设置有储存机构，且工作台上固定安装有传动机构，传动机构与切割机构活动连接，且切割机构在工作台上，工作台包括工作面、工位和控制器，切割机构在工位上，将四个工位平均分布在环形工作台上，且每相邻两个工作台之间均设置凹型仓，有利于增加空间利用率，便于企业的管理，将需要加工的板件推入线锯下，挡板和与线锯相连接的连接块相适设置能避免板材在切割时发生移动从而造成资源浪费，也提高了安全性。

Mehrdrahtsägemaschine zum schneiden von material in blockform

Wire saw device and method for operating same

A wire saw device for sawing semiconductor material is provided, the wire saw device comprising a wire guide device ( 110 ) adapted to guide a wire for forming at least one wire web ( 200 ) for sawing the semiconductor material, and at least one wire management unit ( 130 ) for providing a wire to the wire guide device, wherein the wire guide device ( 110 ) and the at least one wire management unit ( 130 ) are adapted to provide the at least one wire web such that an effective cutting area rate of 12 m 2 /h or more is provided.

Silicon rod cutting system

A silicon rod cutting system, including: a machine base (1), wherein the machine base has at least two cutting stations, which are disposed at intervals; at least two cutting devices (4), which are fixed on the machine base, wherein the cutting devices are in one-to-one correspondence with the cutting stations, and the cutting devices are configured to cut a silicon rods on the cutting stations; a loading and unloading device (2), which is fixed with the machine base, wherein the loading and unloading device is configured to load a round silicon rod and unloading a square rod formed by cutting; and a transfer device (3), which is disposed on the machine base and is disposed between the cutting stations, wherein the transfer device is configured transfer, to the cutting station, the silicon rod loaded by the loading and unloading device, and transfer the square rod formed on the cutting stations to the loading and unloading device. The at least two cutting stations of the silicon rod cutting system share one loading and unloading device and one transfer device, so that the components of the silicon rod cutting system are fewer, and the occupied space is relatively small.

從工件同時切割多個切片的方法和設備

用於在切割操作期間從工件同時切割多個切片的方法和線鋸。該方法的特徵在於，根據目標厚度特徵值函數TTAR （WP）、 間距函數dINI（WP）、及厚度特徵值函數TINI （WP）選擇非線性間距函數dTAR（WP），dTAR （WP）為在切割操作期間在位置WP處的鋸線導輥之殼體中的相鄰凹槽指定間距，TINI（WP）為多個之前切割操作期間由線鋸在位置WP處獲得的切片指定在該等切片上測量的厚度特徵值，dINI（WP）為之前切割操作期間在位置WP處的鋸線導輥之殼體中的相鄰凹槽指定間距，TTAR（WP）為在切割操作期間在位置WP處切下的切片指定目標厚度特徵值，以及WP表示相鄰凹槽相對於鋸線導輥之軸的軸向位置。

와이어 쏘

본 발명은 와이어 쏘에 관한 것이다. 본 발명의 일 실시예에 따른 와이어 쏘는, 시계 방향 또는 반시계 방향으로 회전이 가능하고, 적어도 하나는 단면의 형상이 타원인 복수 개의 롤러; 및 상기 복수 개의 롤러에 감긴 와이어;를 포함하고, 상기 와이어는 상기 롤러가 시계 방향 또는 반시계 방향으로 회전함에 따라, 피가공물을 절삭하는 와이어의 경사 방향이 가변되는 것을 특징으로 한다.

一連の切断動作中にワイヤソーによって被加工物から複数のスライスを切断する方法