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05-01-2012 дата публикации

High-temperature activation process

Номер: US20120000247A1

Автор: Daniel Burgard, James Hinkle, Joshua Conley, Stephen Murphy, Thomas Truman

Принадлежит: Individual

A method for processing a coated glass substrate may include a high-temperature activation process.

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Номер записи: 1

05-01-2012 дата публикации

Hybrid laser arc welding process and apparatus

Номер: US20120000892A1

Автор: Daniel Anthony Nowak, Paul Stephen Dimascio

Принадлежит: General Electric Co

A welding method and apparatus for welding workpieces together by conducting a laser beam welding process on a joint region that includes a weld seam defined by and between faying surfaces of the workpieces, and then conducting a hybrid laser arc welding process on the joint region. The laser beam welding process entails causing a first laser beam to travel along the joint region, penetrate the weld seam and form a weldment. The hybrid laser arc welding process remelts the weldment by simultaneously causing an electric arc and a second laser beam to overlap and travel along the joint region and form a weld pool in the weldment. On cooling, a weld joint is formed within the joint region and its weld seam.

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Номер записи: 2

05-01-2012 дата публикации

High Throughput Solar Cell Ablation System

Номер: US20120003788A1

Автор: Gabriel Harley, John Viatella, Peter John Cousins, Thomas Pass

Принадлежит: Individual

A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source.

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Номер записи: 3

27-12-2014 дата публикации

Приварной элемент с функциональной частью на головке

Номер: RU0000149330U1

Автор: Геральд КЮН, Дитмар РОТОЙТ

Принадлежит: Форд Глобал Технолоджис, ЛЛК

1. Приварной элемент, содержащий функциональную часть (3) и ножку (4) с привариваемым концом (2), выполненную в виде привариваемого стержня.2. Приварной элемент по п.1, в котором ножка (4) выполнена из свариваемого материала, в частности из свариваемого металла.3. Приварной элемент по п.1, в котором ножка (4) имеет на привариваемом конце (2) фланцеобразное расширение (9).4. Приварной элемент по п.1, в котором функциональная часть (3) расположена на головке ножки (4), расположенной напротив привариваемого конца (2).5. Приварной элемент по п.1, в котором ножка (4) выполнена в виде цельной детали.6. Приварной элемент по п.1, в котором привариваемый конец (2) имеет округлую грибовидную форму.7. Приварной элемент по п.1, который сформирован в виде цельной детали из основного свариваемого материала.8. Приварной элемент по п.1, который представляет собой цельную деталь, выштампованную из листовой стали.9. Приварной элемент по п.1, который представляет собой цельную деталь, выпрессованную из пруткового материала. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 149 330 U1 (51) МПК B23K 9/20 (2006.01) B23K 101/20 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ТИТУЛЬНЫЙ (21)(22) Заявка: ЛИСТ ОПИСАНИЯ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ 2013152053/02, 24.04.2012 (24) Дата начала отсчета срока действия патента: 24.04.2012 (72) Автор(ы): РОТОЙТ Дитмар (DE), КЮН Геральд (DE) (73) Патентообладатель(и): Форд Глобал Технолоджис, ЛЛК (US) Приоритет(ы): (30) Конвенционный приоритет: R U 23.05.2011 DE 102011076261.2 (45) Опубликовано: 27.12.2014 Бюл. № 36 (86) Заявка PCT: EP 2012/057424 (24.04.2012) (87) Публикация заявки PCT: WO 2012/159833 (29.11.2012) U 1 1 4 9 3 3 0 R U (54) ПРИВАРНОЙ ЭЛЕМЕНТ С ФУНКЦИОНАЛЬНОЙ ЧАСТЬЮ НА ГОЛОВКЕ (57) Формула полезной модели 1. Приварной элемент, содержащий функциональную часть (3) и ножку (4) с привариваемым концом (2), выполненную в виде привариваемого стержня. 2. Приварной элемент по п.1, в котором ножка (4) выполнена из свариваемого материала, в ...

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Номер записи: 4

12-01-2012 дата публикации

Particle Embedded Polymer Stent and Method of Manufacture

Номер: US20120010691A1

Автор: Gerry Clarke

Принадлежит: Medtronic Vascular Inc

A particle embedded polymer stent and method of manufacture, which includes a stent delivery system having a catheter; a balloon operably attached to the catheter; and a polymer stent disposed on the balloon, the stent comprising struts interconnected to form a tubular body. Each of the struts includes in cross section a drug-free core region; and a drug region surrounding and immediately adjacent to the core region, the drug region including drug particles. The drug-free core region and the drug region are made of a single polymer, the single polymer having a drug-safe softening temperature.

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Номер записи: 5

19-01-2012 дата публикации

Device and method for cooling rail weld zone

Номер: US20120012296A1

Автор: Kenichi Karimine, Mitsugu Kajiwara, Seiji Sugiyama

Принадлежит: Individual

A device for cooling a rail weld zone according to the invention includes a first cooler cooling a head portion of the rail weld zone, a second cooler cooling a rail web portion of the rail weld zone, and a control section controlling the first and second coolers. The first cooler includes a first temperature detecting section that detects the temperature of the head portion, and a first ejection section that ejects a first cooling fluid to the head portion. The second cooler includes a second temperature detecting section that detects the temperature of the rail web portion, and a second ejection section that ejects a second cooling fluid to the rail web portion. The control section individually changes the kinds, the flow rates, and the flow velocities of the first and second cooling fluids while cooling the head portion and the rail web portion.

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Номер записи: 6

19-01-2012 дата публикации

Method for Cutting C-Mn Steel with a Fiber Laser

Номер: US20120012570A1

Автор: Francis Briand, Hakim Maazaoui, Karim Chouf

Принадлежит: La Soudure Autogene Francaise, LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude

The invention relates to a laser cutting method for cutting a C—Mn steel workpiece, characterized in that laser beam generation means comprising at least one silica fiber with an ytterbium-doped core is used to generate the laser beam. Preferably, the ytterbium-based fiber has a wavelength between 1.07 and 1.1 μ m, preferably 1.07 μ m, the quality factor of the laser beam is between 0.33 and 8 mm.mrad, and the laser beam has a power of between 0.1 and 25 kW. The assistance gas for the laser beam is chosen from nitrogen, helium, argon, oxygen, CO 2 and mixtures thereof, and, optionally, it further contains one or more additional compounds chosen from H 2 and CH 4 .

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Номер записи: 7

19-01-2012 дата публикации

Laser marking method

Номер: US20120013699A1

Автор: Hiroyasu Ueta, Minoru Inuzuka, Yutaka Tsujimoto

Принадлежит: Nidek Co Ltd, Shikibo Ltd, Shizuoka Prefecture

This invention provides a laser marking method that can form a very minute mark of a predetermined shape, such as a letter or pattern, with clarity and high solidity, on the surface of a substrate. The laser marking method of the invention comprises the steps of (1) depositing a coloring material on the surface of a substrate of thermoplastic material to form a thin film of the coloring material, and (2) applying a laser beam to the thin film of the coloring material in conformity with a predetermined marking shape to cause the portions of the substrate irradiated with the laser beam to soften and to cause the thus softened portions to mix with the coloring material, thereby developing the predetermined marking shape on the surface of the substrate.

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Номер записи: 8

26-01-2012 дата публикации

Method and apparatus for the force-fitting connection of glass-like components to metals

Номер: US20120017641A1

Автор: Egbert Wenninger, Franz Bachmeir, Stephan Leitenmeier, Wolfgang Friedl

Принадлежит: Grenzebach Maschinenbau GmbH

The invention relates to a method and to a device for force-fit connecting glass-like components to metals, particularly for connecting a glass plate ( 2 ) to a large-scale mounting element ( 19 ) as a central connecting element, particularly made of metal, having the following characteristics: a) an input and control device ( 6 ) for inputting process data, b) a storage and positioning device ( 15 ) for supplying individual fastener elements ( 1 ) as support elements of a central connection element ( 20 ), c) having mounting and fixing means ( 3 ) for fixing a glass plate ( 2 ), d) a thickness measuring device ( 7 ) for measuring the thickness of each of the components to be connected and layers of the same, e) a measuring machine ( 8 ) for measuring the resonant frequency of the glass plate ( 2 ) and a surface sensor ( 10 ) for determining the roughness of the glass plate ( 2 ), f) a sliding device ( 11 ) for pressing together the components to be connected by means of an ultrasonic horn ( 4 ), g) a device for generating ultrasonics by means of an ultrasonic horn ( 4 ), and a computer program for performing the method.

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Номер записи: 9

26-01-2012 дата публикации

High strength steel pipe for low-temperature usage having excellent buckling resistance and toughness of welded heat affected zone and method for producing the same

Номер: US20120018028A1

Автор: Junji Shimamura, Mitsuhiro Okatsu, Nobuo Shikanai, Nobuyuki Ishikawa

Принадлежит: JFE Steel Corp

An APIX100-grade high strength steel pipe includes a base material containing, in mass percentage, C: more than 0.03% and 0.08% or less, Si: 0.01% to 0.5%, Mn: 1.5% to 3.0%, P: 0.015% or less, S: 0.005% or less, Al: 0.01% to 0.08%, Nb: 0.005% to 0.025%, Ti: 0.005% to 0.025%, N: 0.001% to 0.010%, O: 0.005% or less, and B: 0.0003% to 0.0020%, further contains one or more of Cu, Ni, Cr, Mo, and V, satisfies 0.19≦P cm ≦0.25, the balance being Fe and unavoidable impurities, and has a TS of 760 to 930 MPa, a uniform elongation of 5% or more, and a YR of 85% or less; the seam weld metal has a specific composition.

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Номер записи: 10

26-01-2012 дата публикации

Conductive Grounding Pad

Номер: US20120018211A1

Автор: Alf Martin Book

Принадлежит: Individual

Compressible grounding pads with two conductor layers separated by a compressible foam layer comprise: (A) A first conductor layer, e.g., copper foil; (B) A first adhesive layer in direct contact with a part of the first conductor layer, the first conductor layer extending beyond the first adhesive layer; (C) A foam layer in direct contact with one facial side of the first adhesive layer; (D) A second adhesive layer in direct contact with the opposite facial side of foam layer; (E) A second conductor layer, e.g., copper foil, in direct contact with the second adhesive layer, the second conductor layer extending beyond the second adhesive layer such that the second conductor layer joins with the first conductor layer; (F) An electrically conductive third adhesive layer in direct contact with the facial surface opposite the facial surface that is in direct contact with the second conductor layer; and (G) An optional release liner in direct contact with the third adhesive layer.

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Номер записи: 11

26-01-2012 дата публикации

Method and Apparatus for Forming a Wave Form Used to Make Wound Stents

Номер: US20120018496A1

Автор: Erik Griswold, Gerard Clery, Pj Carmody, Sean Moynihan

Принадлежит: Medtronic Vascular Inc

A method for forming a wave form for a stent includes clamping a formable material to a first die including a forming portion; drawing the formable material with the first die in a first direction; clamping the formable material to a second die at a location spaced from the first die, the second die including a forming surface; moving a forming member in between the first die and the second die in a second direction substantially perpendicular to the first direction and into contact with the formable material; and deforming the formable material by moving the forming member in the second direction while moving the first die towards the second die and/or moving the second die towards the first die.

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Номер записи: 12

26-01-2012 дата публикации

Process for joining carbon steel part and zirconia ceramic part and composite articles made by same

Номер: US20120021245A1

Автор: Cheng-Shi Chen, Hsin-Pei Chang, Huann-Wu Chiang, Wen-Feng Hu, Wen-Rong Chen

Принадлежит: Hon Hai Precision Industry Co Ltd, Hongfujin Precision Industry Shenzhen Co Ltd

A process for joining a carbon steel part and a zirconia ceramic part, comprising steps of: providing a metal part made of carbon steel, a ceramic part made of zirconia ceramic, and a titanium foil; bringing the metal part, ceramic part, and titanium foil into contact, with the titanium foil inserted between the metal part and ceramic part; applying a joining pressure of about 10˜50 MPa to the parts to be joined; and simultaneously applying a pulse electric current to the parts while the joining pressure is applied for heating up the parts to a joining temperature of about 800° C. to about 1100° C. at a rate of about 50˜600° C./min, maintaining the joining temperature for about 10˜50 minutes.

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Номер записи: 13

02-02-2012 дата публикации

Soldering apparatus

Номер: US20120024938A1

Автор: Minoru Yamamoto, Shinji Yoshino, Toshinori Mimura

Принадлежит: Panasonic Corp

A solder drawing member ( 402 ) is detachably attached on the outer side of a jet nozzle ( 303 ) that jets molten solder pumped from a solder tank ( 102 ) storing the molten solder. The solder drawing member ( 402 ) is made of a material having higher wettability to the molten solder than the surface material of the jet nozzle ( 303 ). Thus a force of separating the solder from a point to be soldered can be increased by a surface tension of the molten solder flowing on the solder drawing member ( 402 ), thereby reducing bridge phenomena and icicle phenomena.

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Номер записи: 14

02-02-2012 дата публикации

Method to dice back-contact solar cells

Номер: US20120025837A1

Автор: Douglas H. Rose, Karen Elizabeth Wilson, Zachary Kinyon

Принадлежит: SunPower Corp

A method of processing of solar cells includes determining that a back-contact solar cell is defective. The back-contact solar cell includes a first plurality of interconnect pads at a first edge thereof, and a second plurality of interconnect pads at a second, opposed thereof, the first and second pluralities of interconnect pads having opposite operational charges. The back-contact solar cell is then diced to define at least first and second back-contact solar cell sections. The first back-contact solar cell section has at least two interconnect pads, of the plurality of interconnect pads, at respective opposed edges thereof.

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Номер записи: 15

02-02-2012 дата публикации

Methods of temporally varying the laser intensity during scribing a photovoltaic device

Номер: US20120028404A1

Автор: Jonathan Mack Frey

Принадлежит: Primestar Solar Inc

Methods for laser scribing a film stack including a plurality of thin film layers on a substrate are provided. A pulse of a laser beam is applied to the film stack, where the laser beam has a power that varies as a function of time during the pulse according to a predetermined power cycle. For example, the pulse can have a pulse lasting about 0.1 nanoseconds to about 500 nanoseconds. This pulse of the laser beam can be repeated across the film stack to form a scribe line through at least one of the thin film layers on the substrate. Such methods are particularly useful in laser scribing a cadmium telluride thin-film based photovoltaic device.

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Номер записи: 16

09-02-2012 дата публикации

Gas delivery system for reducing oxidation in wire bonding operations

Номер: US20120031877A1

Автор: Gary S. Gillotti, Peter J. Van Emmerik, Stanley Szczesniak

Принадлежит: Kulicke and Soffa Industries Inc

A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.

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Номер записи: 17

09-02-2012 дата публикации

Low deflection bi-metal rotor seals

Номер: US20120032404A1

Автор: David C. Seib, Mark Joseph Kuzdzal

Принадлежит: Dresser Rand Co

A seal assembly for use in a turbomachine is provided. The seal assembly has an annular division wall with outside and inside surfaces, a carrier ring disposed adjacent the inside surface of the annular division wall, and a sealing substrate metallurgically-bonded to an inner-most surface of the carrier ring. The sealing substrate is machined to form a seal surface that can be disposed proximate a rotor and maintained substantially parallel thereto during operation of the turbomachine.

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Номер записи: 18

16-02-2012 дата публикации

Piston for an internal combustion engine and method for its production

Номер: US20120037113A1

Автор: Matthias Seifried, Rainer Scharp

Принадлежит: MAHLE International GmbH

A method for the production of a piston has the following method steps: (a) providing a blank of a piston base body, having an outer joining surface, an inner joining surface and a circumferential lower cooling channel part that runs between the two joining surfaces, (b) providing a blank of a piston ring element, having an outer joining surface, an inner joining surface and a circumferential upper cooling channel part that runs between the two joining surfaces, (c) forming a circumferential widened region on at least one joining surface, the widened region extending toward the related cooling channel part, (d) connecting the blank of the piston base body with the blank of the piston ring element by way of their joining surfaces, by friction welding, to produce a piston blank, and (e) machining the piston blank further and/or finish-machining it to produce a piston.

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Номер записи: 19

16-02-2012 дата публикации

Polymer tubing laser micromachining

Номер: US20120037609A1

Автор: David Gaudiosi, Gordon Masor, Michael Greenberg, Michael Mielke, Tim Booth

Принадлежит: Individual

An apparatus for athermal ablation of a workpiece. The apparatus may include a laser device to direct a laser beam at the workpiece to remove a plurality of sections from the workpiece by athermal ablation. The removal may occur in a plurality of discrete motions that cause the laser beam to trace along outer perimeters of the sections in a specific order maintaining mechanical stability of the plurality of sections. The apparatus may further include a process gas nozzle to deliver process gas coaxially with the laser beam to clear debris and cool the workpiece, and a workpiece holder to hold and maneuver the workpiece during the removal of the plurality of sections.

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Номер записи: 20

16-02-2012 дата публикации

Capillary and ultrasonic transducer for ultrasonic bonding

Номер: US20120037687A1

Автор: Takayoshi Matsumura

Принадлежит: Fujitsu Ltd

A capillary is attached to an ultrasonic transducer of a wire-bonding apparatus. The capillary includes a first part configured to be attached to the ultrasonic transducer, and a second part other than the first part and extending from the first part. The first part has a shape different from a shape of the second part so that the first part has a flexure rigidity larger than the second part.

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Номер записи: 21

23-02-2012 дата публикации

Packaging Integrated Circuits

Номер: US20120043650A1

Автор: Liang Kng Ian Koh, Richard Mangapul Sinaga

Принадлежит: INFINEON TECHNOLOGIES AG

An integrated circuit 15 is placed onto a lead frame 101 having lead fingers 109 of substantially constant thickness along their length. Wires are formed from the lead fingers 109 to corresponding electrical contacts the integrated circuit. Following the wire bonding process, the thickness of the tips of the lead fingers 109 is reduced by a laser process, to form tips of reduced thickness desirable for a subsequent moulding operation. Thus, at the time of the wire bonding the tips of the fingers 109 need not have a gap beneath them, so that more secure wire bonds to the lead fingers 109 can be formed.

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Номер записи: 22

01-03-2012 дата публикации

Buffer Layer to Enhance Photo and/or Laser Sintering

Номер: US20120049384A1

Автор: Mohshi Yang, Peter B. Laxton, Zvi Yaniv

Принадлежит: Ishihara Chemical Co Ltd

Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned metal layer and the substrate. Vias are formed through the layer of material having the low thermal conductivity thereby exposing portions of the patterned metal layer. A film of conductive ink is then coated over the layer of material having the low thermal conductivity and into the vias to thereby coat the portions of the patterned metal layer, and then sintered. The film of conductive ink coated over the portion of the patterned metal layer does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.

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Номер записи: 23

01-03-2012 дата публикации

Apparatus and method for laser scribing

Номер: US20120052605A1

Автор: Yu Sung JANG

Принадлежит: JANG Yu Sung

Provided is an apparatus for laser scribing. The laser scribing apparatus may include: a first laser emitter to emit a laser for a thickness measurement while moving towards a first axial direction of a substrate where a plurality of light emitting devices is formed; a laser receiver to receive a reflected laser when the laser emitted from the first laser emitter is reflected from the substrate; a thickness measurement unit to measure a thickness of the substrate based on a strength of the leaser received by the laser receiver; and a second laser emitter to generate a scribing line on the substrate by emitting a laser towards a first axial direction and a second axial direction of the substrate while adjusting a laser emission location based on the measured thickness.

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Номер записи: 24

08-03-2012 дата публикации

Spot-welding method and spot-welding device

Номер: US20120055910A1

Автор: Keigo Kimura, Kensuke Sakai

Принадлежит: Fuji Jukogyo KK

When spot-welding a workpiece including a thin plate, a first thick plate, and a second thick plate, the workpiece is clamped by a fixed electrode in contact with the second thick plate, a movable electrode in contact with the thin plate, and control-pressure applying unit set adjacent to the movable electrode and in contact with the thin plate. Pressure is applied to the second thick plate by the fixed electrode, and pressure and control pressure are respectively applied by the movable electrode and the control-pressure applying unit to the thin plate. The pressure from the fixed electrode is controlled to be smaller than the pressure from the movable electrode. The current density between the thin plate and the first thick plate increases.

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Номер записи: 25

15-03-2012 дата публикации

Method of fabricating a stimulation lead for delivering electrical pulses to tissue of a patient

Номер: US20120061358A1

Автор: Homar Cisneros

Принадлежит: Advanced Neuromodulation Systems Inc

In one embodiment, a method of fabricating stimulation leads, the method comprises: providing a spool of polymer film; providing a plurality of payout carriers of wires; drawing the polymer film from the spool and the wires from the plurality of payout carriers over a rotating drum, wherein the drum comprises a plurality of grooves over an outer circumferential surface of the drum for directing the wires from the plurality of payout carriers, wherein a distance of each groove from an edge of the drum is varied about the circumference of the drum; bonding the wires to the polymer film while performing the drawing to form an intermediate assembly comprising the polymer film as a carrier with the bonded wires in a repeating pattern along a length of the intermediate assembly.

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Номер записи: 26

15-03-2012 дата публикации

Weldable Metal Article

Номер: US20120064367A1

Автор: Andrew Norman, Sabine Spangel

Принадлежит: Individual

The invention relates to an extruded or rolled clad metal article having a core metal layer and a cladding metal layer on at least one surface of the core layer, wherein the metals of the core metal layer and the cladding metal layer are each aluminium alloys, preferably an aluminium-magnesium alloy, having at least Sc in a range of 0.05% to 1%, and wherein the Sc-content in the core metal layer is lower than in the cladding metal layer. This further relates to a welded structure incorporating such a metal article.

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Номер записи: 27

22-03-2012 дата публикации

Solder adhesive and a production method for the same, and an electronic device comprising the same

Номер: US20120067629A1

Автор: Seung Jun Jang, Sung Chul Kim, Yong Cheol Chu, Yong Un Jang, Yoon Sang Son

Принадлежит: Duksan Hi Metal Co Ltd

The present invention relates to a solder adhesive and a production method for the same, and to an electronic device comprising the same, and more specifically it relates to a solder adhesive comprising an alloy including tin and having a melting point of from 130 to 300° C., a first binder including a rosin compound, and a second binder having a thermosetting resin, as well as to a production method for the same and an electronic device comprising the same.

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Номер записи: 28

22-03-2012 дата публикации

Package substrate unit and method for manufacturing package substrate unit

Номер: US20120067635A1

Автор: Hideaki Yoshimura, Hitoshi Suzuki, Hnin Nway San Nang, Kazuya Arai, Kei Fukui, Shinpei Ikegami, Yasuhito Takahashi

Принадлежит: Fujitsu Ltd

A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.

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Номер записи: 29

22-03-2012 дата публикации

Defect correcting apparatus and defect correcting method

Номер: US20120071056A1

Автор: Akiko Oka, Gaku Izumi, Tomoaki Honda

Принадлежит: Sony Corp

The present disclosure provides a defect correcting apparatus including a defect detecting device configured to detect a defect within a repetitive pattern in a multilayer substrate a defect correcting device configured to correct the defect in the multilayer substrate by a specified defect correcting method, and a control device configured to, when the defect detected by the defect detecting device is detected overlapping a region in which occurrence of an interlayer short-circuit defect is assumed, generate an object corresponding to the defect correcting method for the interlayer short-circuit defect, and controlling the defect correcting device for correcting the defect using the generated object.

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Номер записи: 30

29-03-2012 дата публикации

Method of bonding titanium to stainless steel

Номер: US20120073114A1

Автор: Attila Antalfy, Guangqiang Jiang

Принадлежит: ALFRED E MANN FOUNDATION FOR SCIENTIFIC RESEARCH

A method of bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a laminated titanium-nickel filler material placed between the two parts and heated at a temperature that is less than the melting point of either the stainless steel part or the titanium part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the stainless steel part and the titanium part. The bonded component assembly is optionally treated with acid to remove any residual free nickel and nickel salts, to assure a biocompatible component assembly, if implanted in living tissue.

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Номер записи: 31

29-03-2012 дата публикации

Adjustable Clamshell Assembly Fixture

Номер: US20120073353A1

Автор: John T. McNally

Принадлежит: Magna International Inc

A system for forming different types of clamshell components including a moveable base, a stationary base, and a squeezer assembly capable of accommodating different types of clamshell components having different lengths, shapes, locations of piercings. The squeezer assembly includes interchangeable squeezer elements. To switch between forming a first type of clamshell component and a second type of clamshell component, one of the two bases is moved relative to the other of the two bases and/or squeezer units for forming the first type of clamshell component are replaced with squeezer units for forming the second type of clamshell component. Reconfiguring the bases and interchanging the squeezers of a clamshell tool, instead of replacing an entire clamshell tool with a different clamshell tool, minimizes lost productivity time, reduces capital costs, and eliminates the problem of storing several different clamshell assembly tools.

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Номер записи: 32

29-03-2012 дата публикации

Method and device for positioning a first pipe with respect to a second pipe

Номер: US20120074205A1

Автор: Jean-Francois Dagenais

Принадлежит: Serimax SAS

This invention relates to a method for axial positioning of a first pipe with respect to a second pipe for the welding of said pipes at their ends thereof of which the faces have been previously machined and define a joint plane, according to which a plurality of jacks are distributed around the first and second pipes, and said jacks are connected to a central processing and control unit. According to the invention, the movement of each of the jacks is controlled with respect to said external surface of the first and/or second pipe so as to align and center the internal end surfaces of the first and second pipes. The invention also relates to an associated device.

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Номер записи: 33

29-03-2012 дата публикации

Tubular beam with single center leg

Номер: US20120074720A1

Автор: Brian Malkowski, Brian Oxley, Daniel Gatti, Doug Witte, Ed Pendergrass, Kannan Ramamoorthy, Thomas Johnson

Принадлежит: Shape Corp

A reinforcement beam for a vehicle bumper system comprises a single sheet deformed to define first and second tubes sharing a common single center wall. A channel rib is formed on each tubes and a crevice rib over the center leg forms a third rib. Edges of the sheet are deformed to a radius so that their surface consistently engages an associated radiused corner formed on ends of the center leg, which facilitates consistent abutting line engagement of material surfaces, and thus facilitates consistent welding. In a preferred beam, front wall sections of each tube are coplanar and form a face of the beam, with each channel rib and crevice rib providing added stiffness to the beam, and yet nothing extends forward of the coplanar front wall sections. Related apparatus and methods are also disclosed.

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Номер записи: 34

19-04-2012 дата публикации

Niobium based superconducting radio frequency(scrf) cavities comprising niobium components joined by laser welding, method and apparatus for manufacturing such cavities

Номер: US20120094839A1

Автор: Brahma Nand Upadhyay, Chandrakant Pithawa, Pradeep Kumar Kush, Prashant Khare, Purushottam Das Gupta, Sindhunil Barman Roy, Vinod Chandra Sahni

Принадлежит: India Atomic Energy Department of

Niobium or its alloy based Superconducting Radio Frequency (SCRF) Cavities involving atleast one laser beam welded components in the SCRF cavity welded from inside surface of the wall of cavity directed to achieving more than half the thickness to full depth penetration with minimum HAZ, minimizing distortion and shrinkage. The method ensures improved weld quality and surface finish substantially free of any weld defects. Also disclosed is the welding nozzle system and welding rigs adapted to facilitate such laser welding of the Niobium or its alloy based Superconducting Radio Frequency (SCRF) Cavities. The invention is thus directed to enhancing productivity, ensuring consistent quality and reliability, enhanced weld penetration with minimum HAZ, smooth finish of weld joints at possible reduced costs.

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Номер записи: 35

26-04-2012 дата публикации

Housing and method for making the same

Номер: US20120097687A1

Автор: Fa-Guang Shi, Jing-Hui You, Zi-Ming Tang

Принадлежит: Futaihua Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd

A housing includes a bottom housing and a top housing. The bottom housing includes a connecting surface. The top housing includes a bottom surface. The connecting surface is fixed to the bottom surface by welding. A receiving groove is defined in the bottom surface, for receiving the molten slag generated and collected during a welding process.

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Номер записи: 36

03-05-2012 дата публикации

Method for manufacturing semiconductor device

Номер: US20120108013A1

Автор: Atsushi Fujisawa, Hiroshi Fujii

Принадлежит: Renesas Electronics Corp

In QFN packages for vehicles which are required to have high reliability, the side surface of leads is mostly covered with lead-to-lead resin protrusions, which prevent smooth formation of solder fillets during reflow mounting. When the lead-to-lead protrusions are mechanically removed using a punching die, there is a high possibility of causing cracks of the main body of the package or terminal deformation. When a spacing is provided between the punching die and the main body of the package in order to avoid such damages, a resin residue is produced to hinder complete removal of this lead-to-lead resin protrusion. The present invention provides a method for manufacturing semiconductor device of a QFN type package using multiple leadframes having a dam bar for tying external end portions of a plurality of leads. This method includes a step of removing a sealing resin filled between the circumference of a mold cavity and the dam bar by using laser and then carrying out surface treatment, for example, solder plating.

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Номер записи: 37

10-05-2012 дата публикации

Laser ashing of polyimide for semiconductor manufacturing

Номер: US20120111496A1

Автор: Luc Guerin, Maxime Cadotte, Steve Whitehead, Van Thanh Truong

Принадлежит: International Business Machines Corp

A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.

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Номер записи: 38

17-05-2012 дата публикации

Method and Control Device for Monitoring the Quality of Spot Welds of a Resistance Welding Gun Comprising the Outputting of a Warning Message

Номер: US20120118861A1

Автор: Denis Court, Juergen Haeufgloeckner, Klaus Ehrhardt, Micha Bertsch, Michael Ripper, Norbert Krämer

Принадлежит: ROBERT BOSCH GMBH

A method for monitoring and/or regulating the quality of spot welds of a resistance welding gun includes measuring and storing measured values during the execution of resistance spot welds at different points on a workpiece. The measured values represent a voltage, a current, a resistance, a welding time, an energy, a force on welding contacts and/or an output during the production of a resistance spot weld. The method also includes comparing the measured values with a reference measurement value. The reference measurement value represents a corresponding voltage, a current, a resistance, a welding time, an energy, a force on welding contacts and/or an output during the production of a corresponding resistance spot weld. The method also includes outputting a warning message when, during the comparison, it is established that a predetermined number of successive measured values is outside a predefined tolerance band from the reference measurement value.

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Номер записи: 39

24-05-2012 дата публикации

Inert environment enclosure

Номер: US20120125975A1

Автор: Frederick W. Wagner, Larry E. Yanaros

Принадлежит: FLEXTRONICS AP LLC

A novel inert environment enclosure includes an object inlet where production objects enter the enclosure and an object outlet where the production objects exit. At least one of the object inlet and the object outlet includes both a top-side flow obstructer and a bottom-side flow obstructer for preventing air from entering the enclosure. In a particular embodiment, the top-side flow obstructer and the bottom-side flow obstructer each include a curtain constructed from a flexible fabric having a plurality of individual adjacent fingers. In another particular embodiment, the inert environment enclosure is a nitrogen hood that houses a wave soldering machine. A inert gas nozzle is mounted at or near the inlet and/or the outlet. The inert environment enclosure maintains a positive pressure with respect to the surrounding environment when production objects are passed through the enclosure.

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Номер записи: 40

24-05-2012 дата публикации

Process for reducing aluminium pick-up, and ultrasonic welding device

Номер: US20120125976A1

Автор: Ernst Steiner

Принадлежит: SCHUNK SONOSYSTEMS GMBH

A process for reducing aluminum pick-up and adherence during the ultrasonic welding of aluminum braids which are welded in a vertically and/or horizontally adjustable compression chamber of an ultrasonic welding device. The static tool parts which delimit the compression chamber have working surfaces made from polycrystalline diamond (PCD).

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Номер записи: 41

31-05-2012 дата публикации

Laser processing method

Номер: US20120131958A1

Автор: Hideki Shimoi, Keisuke Araki

Принадлежит: Hamamatsu Photonics KK

A laser processing method of converging a laser light into an object to be processed made of glass so as to form a modified region and etching the object along the modified region so as to form a through hole in the object comprises a browning step of discoloring at least a part of the object by browning; a laser light converging step of forming the modified region in the discolored part of the object by converging the laser light into the object after the browning step; and an etching step of etching the object after the laser light converging step so as to advance the etching selectively along the modified region and form the through hole.

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Номер записи: 42

31-05-2012 дата публикации

Cleaving apparatus for a band-like glass film and cleaving method for a band-like glass film

Номер: US20120131962A1

Автор: Hiroki Mori, Hiroshi Adachi, Kaoru Mitsugi, Naohiro IKAI

Принадлежит: Nippon Electric Glass Co Ltd

A cleaving apparatus holds at least one surface (effective surface) of a band-like glass film in a non-contact state to suppress a situation that wavy portions reach a region in which the band-like glass film is to be cleaved. The cleaving apparatus cleaves the band-like glass film, which is being conveyed in a longitudinal direction thereof, along a conveyance direction thereof using a thermal stress generated through localized heating and cooling of a heated region. The localized heating and the cooling is performed on a preset cleaving line extending along the conveyance direction of the band-like glass film. The cleaving apparatus includes an air knife for supplying air to a front surface of the band-like glass film to retain the film on a conveyor at a position on an upstream side of a cleaving region in the conveyance direction.

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Номер записи: 43

31-05-2012 дата публикации

Orthogonal integrated cleaving device

Номер: US20120132628A1

Автор: Mark T. Kosmowski, Mehmet E. Alpay

Принадлежит: Electro Scientific Industries Inc

An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.

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Номер записи: 44

31-05-2012 дата публикации

method of manufacturing a component

Номер: US20120135198A1

Автор: Oliver M. Strother

Принадлежит: Rolls Royce PLC

A method of manufacturing a component having first and second layers, the first and/or second layers including one or more depressions provided on a surface of the respective layer. The method including: arranging the first and second layers so that they face one another and with the depressions on inner facing surfaces of the layers; diffusion bonding the first and second layers together about their edges; applying a first differential pressure across each of the first and second layers to evacuate an inner space defined by the layers, thereby forming one or more depressions on an outer facing surface of the first or second layer; and applying a second differential pressure across each of the first and second layers to expand the inner space defined by the layers.

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Номер записи: 45

31-05-2012 дата публикации

Pollution control device and inorganic fiber sheet material with a fused edge

Номер: US20120135205A1

Автор: Richard P. Merry

Принадлежит: 3M Innovative Properties Co

Inorganic fiber mounting and insulating sheet materials for use in pollution control devices with at least one edge of the inorganic fiber sheet material having at least one group of two or more fibers fused together. A pollution control device comprising such a sheet material. A process for cutting at least one section from a sheet containing inorganic fiber material, where the sheet material is suitable for use in a pollution control device. The fibrous sheet material is cut so that the cut edge has at least one group of two or more fibers fused together. A laser beam can be used to cut the desired section out of the inorganic fiber sheet material.

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Номер записи: 46

31-05-2012 дата публикации

Method and apparatus for cutting a brittle-material substrate, and window glass for vehicle obtained by the method

Номер: US20120135847A1

Автор: Akinori Matsumoto, Isao Saito, Yasuji Fukasawa

Принадлежит: Asahi Glass Co Ltd

A method for cutting a brittle-material substrate by irradiating a converged laser beam on a brittle-material substrate along first and second cutting lines intersecting each other at least at one point, includes forming scribe lines along the first and the second cutting lines on a surface of the brittle-material substrate, and relatively moving an irradiation position of the laser beam on the surface of the brittle-material substrate along the scribe lines to cut the brittle-material substrate at a forward position of the irradiation position in the moving direction of the irradiation position. The irradiation of the laser beam is limited in a region in the vicinity of an intersection where the first and the second cutting lines intersect.

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Номер записи: 47

14-06-2012 дата публикации

Aluminum alloy heat exchanger and method of producing refrigerant tube used for the heat exchanger

Номер: US20120145365A1

Автор: Naoki Yamashita, Yasunaga Itoh, Yuji Hisatomi

Принадлежит: Sumitomo Light Metal Industries Ltd

An aluminum alloy heat exchanger is produced by applying a coating material that is prepared by adding a binder to a mixture of an Si powder and a Zn-containing compound flux powder to a surface of an aluminum alloy refrigerant tube, assembling a bare fin that is formed of an Al—Mn—Zn alloy with the refrigerant tube, and brazing the refrigerant tube and the bare fin by heating in an atmosphere-controlled furnace, the refrigerant tube being an extruded product of an aluminum alloy that comprises 0.5 to 1.7% (mass %, hereinafter the same) of Mn, less than 0.10% of Cu, and less than 0.10% of Si, with the balance being Al and unavoidable impurities, a mixing ratio of the Si powder to the Zn-containing compound flux powder being 10:90 to 40:60, the binder being added in an amount of 5 to 40% based on the total amount of the coating material, the coating material being applied to an outer surface of the refrigerant tube so that the total amount of the Si powder and the Zn-containing compound flux powder is 5 to 30 g/m 2 , the surface of the refrigerant tube subjected to brazing having a potential lower than that of an area of the refrigerant tube that is deeper than a diffusion depth of Si and Zn by 20 to 200 mV, and a potential of the fin being lower than that of a deep area of the refrigerant tube.

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Номер записи: 48

14-06-2012 дата публикации

System for reeling pipeline

Номер: US20120148348A1

Автор: Lyle Glennis Stockstill, Lylyn Hingle Stockstill

Принадлежит: Lylyn Hingle Stockstill

A pipe reeling system can be positioned in a location adjacent a dock to prepare spools of wound pipeline. The pipe segments are delivered to the facility from a steel mill or other manufacturer and placed on one or more pipe storage racks in a first orientation. The pipe segments are then moved to an elevated pipe feeding bed, from which they are fed in a second direction, transverse to the first direction through a plurality of weld stations. The pipe segments welded end-to-end form a continuous pipe unit, which is transferred to a spool and wound thereon. The spools can be prepared in advance of a request from a pipeline operator and stored in the facility on the reels until required.

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Номер записи: 49

28-06-2012 дата публикации

Device for supplying an inert gas to a wave soldering installation

Номер: US20120160898A1

Автор: Fernand Heine, Marc Leturmy

Принадлежит: LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude

The invention relates to a device for supplying inert gas in order to protect the surface of a solder bath in a wave soldering installation and the components to be soldered against oxidation. Wave soldering installations form solder waves over which parts to be soldered are transported. The parts to be soldered are generally electronic printed circuit boards which have electronic components soldered onto their undersides by the solder wave making contact with the printed circuit board.

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Номер записи: 50

28-06-2012 дата публикации

Cutting/polishing tool and manufacturing method thereof

Номер: US20120164927A1

Автор: Jeong-Hun Suh

Принадлежит: INSSTEK Inc, Shinhan Diamond Ind Co Ltd

There are provided a cutting/polishing tool that may be readily manufactured and have an improved cutting performance, and a manufacturing method thereof. The method for manufacturing the cutting/polishing tool including at least one cutting/polishing body may comprise preparing a tool body, and forming a cladding layer including cutting material particles by spraying, onto an outer surface of the tool body, the cutting material particles and a metal powder having a specific gravity greater than a specific gravity of the cutting material particles while heating the outer surface of the tool body using a heating device installed in a lower side of the outer surface of the tool body so that the metal powder is deposited on the outer surface of the tool body, wherein the cladding layer configures the at least one cutting/polishing body.

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Номер записи: 51

05-07-2012 дата публикации

Substrate bonding method and semiconductor device

Номер: US20120168954A1

Автор: Toshihiro Seko

Принадлежит: Stanley Electric Co Ltd

A first Sn absorption layer is formed on a principal surface of a first substrate, the first Sn absorption layer being made of metal absorbing Sn from AuSn alloy and lowering a relative proportion of Sn in the AuSn alloy. A second Sn absorption layer is formed on a principal surface of a second substrate, the second Sn absorption layer being made of metal absorbing Sn from AuSn alloy and lowering a relative proportion of Sn in the AuSn alloy. A solder layer made of AuSn alloy is formed at least on one Sn absorption layer of the first and second Sn absorption layers. The first and second substrates are bonded together by melting the solder layer in a state that the first and second substrates are in contact with each other, with the principal surfaces of the first and second substrates facing each other.

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Номер записи: 52

19-07-2012 дата публикации

Method and System for Mitigation of Particulate Inclusions in Optical Materials

Номер: US20120180527A1

Автор: John Allyn Caird, Kathleen Irene SCHAFFERS

Принадлежит: Lawrence Livermore National Security LLC

A method of fabricating an optical material includes providing input materials having a material softening temperature, melting the input materials, and flowing the melted input materials into a laser inclusion mitigation system. The melted input materials comprise one or more inclusions. The method also includes irradiating the input materials using a laser beam, fragmenting the one or more inclusions in response to the irradiating, and reducing a temperature of the input materials to less than the material softening temperature. The method further includes forming an optical material and annealing the optical material.

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Номер записи: 53

19-07-2012 дата публикации

Laminate armor and related methods

Номер: US20120180630A1

Автор: Henry S. Chu, Thomas A. Zagula, Thomas M. Lillo

Принадлежит: Battelle Energy Alliance Llc

Laminate armor and methods of manufacturing laminate armor are disclosed. Specifically, laminate armor plates comprising a commercially pure titanium layer and a titanium alloy layer bonded to the commercially pure titanium outer layer are disclosed, wherein an average thickness of the titanium alloy inner layer is about four times an average thickness of the commercially pure titanium outer layer. In use, the titanium alloy layer is positioned facing an area to be protected. Additionally, roll-bonding methods for manufacturing laminate armor plates are disclosed.

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Номер записи: 54

26-07-2012 дата публикации

Structural element for a motor vehicle

Номер: US20120187738A1

Автор: Andreas Dannheisig, Bernd Gross, Christian Hübsch, Dirk Angermann, Dirk Eckenroth, Hans-Georg Werner, Joshua Hesterberg, Martin Oren, Praveen Koparde, Robin Ndagijimana, Stefan Funk, Vedat Nuyan, Vikas Wayal, Wolfgang Pellenz, Yaniv Oren

Принадлежит: Johnson Controls GmbH

The invention relates to a structural element ( 100 ) of a motor vehicle, in particular of a motor vehicle seat, wherein the structural element ( 100 ) comprises a first component ( 101 ) and a second component ( 102 ). In an overlap region ( 103 ), the first component ( 101 ) and the second component ( 102 ) have a formed-closed connection, or a form-closed and form-closed connection, wherein the connection in the overlap region ( 103 ) can be produced by an electromagnetic pulse shaping method, wherein the first component comprises at least one form-closed moulding ( 600 ), wherein the second component can be moulded into the at least one form-closed moulding ( 600 ).

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Номер записи: 55

02-08-2012 дата публикации

Solder, soldering method, and semiconductor device

Номер: US20120193800A1

Автор: Keisuke Uenishi, Nobuhiro Imaizumi, Seiki Sakuyama, Tetsuhiro Nakanishi, Toshiya Akamatsu

Принадлежит: Fujitsu Ltd

A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight.

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Номер записи: 56

09-08-2012 дата публикации

Method for making an opening in a substrate

Номер: US20120198977A1

Автор: Christian Kohlmeier, Florian Roick, Stefan Boenigk

Принадлежит: LPKF Laser and Electronics AG

A method for making an opening in a substrate includes creating a cutting path in the substrate for cutting out a polygonal area along predetermined side paths which enclose the opening and are connected to each other via respective corner points. The cutting path is started in an internal region of the polygonal area at a distance from the side paths. The cutting path is continued in a recess in the internal region to a start point on a first one of the side paths, the start point being disposed along the first one of the side paths at a substantial distance from each of the respective corner points so as to divide the first one of the side paths into a long side path portion and a short side path portion. The cutting path is continued, from the start point, along each of the side paths.

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Номер записи: 57

09-08-2012 дата публикации

Tin-silver bonding and method thereof

Номер: US20120199635A1

Автор: Cheng-Yi Liu, Ming-Chung Kuo

Принадлежит: National Central University

A Sn—Ag bonding and a method thereof are revealed. By means of a bonding layer formed by tin and silver between wafers, the stress released by diffusion and bonding between tin(Sn) and silver(Ag) is larger than the stress released by diffusion and bonding of conventional gold-silver bonding. Moreover, a Sn—Ag bonding method of the present invention forms Sn—Ag bonding at low temperature and releases more stress so as to reduce thermal stress generated during wafer bonding effectively. And after wafer bonding, the high temperature processes can be performed.

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Номер записи: 58

09-08-2012 дата публикации

Core runout ceiling for turbine components

Номер: US20120201662A1

Автор: Kevin J. Ryan, Paul C. McClay, Paul M. Lutjen, Paul S. Bean

Принадлежит: Individual

A method of closing off a mold plug opening in a turbine component includes the steps of inserting a weld member into an opening to be closed, and to abut a necked portion within a passage leading from the opening. Heat is applied to the weld member, such that a surface of the weld member in contact with the necked portion liquefies, and such that the weld member adheres to the necked portion, closing off the opening. The weld member and application of heat are selected such that the entirety of the weld member does not liquefy, but remains in the opening, without ever having liquefied. A turbine component formed by the method is also disclosed.

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Номер записи: 59

09-08-2012 дата публикации

Method and apparatus for forming the separating lines of a photovoltaic module with series-connected cells

Номер: US20120202313A1

Автор: Walter Psyk

Принадлежит: SCHOTT SOLAR AG

For forming the separating lines, ( 5, 6, 7 ) which are produced in the functional layers ( 2, 3, 4 ) deposited on a transparent substrate ( 1 ) during manufacture of a photovoltaic module with series-connected cells (C 1 , C 2 , . . . ), there are used laser scanners ( 8 ) whose laser beam ( 14 ) produces in the field ( 17 ) scanned thereby a plurality of adjacent separating line sections ( 18 ) in the functional layer ( 2, 3, 4 ). The laser scanners ( 8 ) are then moved relative to the coated substrate ( 1 ) in the direction (Y) of the separating lines ( 5, 6, 7 ) by a distance corresponding at the most to the length (L) of the scanned field ( 17 ) to thereby form continuous separating lines ( 5, 6, 7 ) through mutually flush separating line sections ( 18 ).

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Номер записи: 60

16-08-2012 дата публикации

Scanned laser light source

Номер: US20120205347A1

Автор: Abhilash J. Mayur, Alexander Goldin, Dean C. Jennings, Leonid M. Tertitski, Mark Yam, Paul A. O'Brien, Vernon Behrens

Принадлежит: Applied Materials Inc

The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

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Номер записи: 61

16-08-2012 дата публикации

Method and device for welding parts with spot contact or short line contact in the joining region and joining device

Номер: US20120205350A1

Автор: Uwe Stadtmueller

Принадлежит: Individual

Parts are welded by way of a laser beam, wherein the parts are oriented and fixed relative to each other, a laser beam is introduced into an upper part from above and centered relative to a joint point and fuses only the inner region directly above the joint point, while the upper part and the lower part are pressed against each other and therefore move toward one another, wherein the fused region of the upper part penetrates the material of the particular lower part, which has likewise fused in the meantime. Laser welding makes it possible to weld the parts so as to form products having nearly any type of geometry with much less effort than with resistance welding or capacitor discharge welding. The welding device needs only hold and fix the parts to be welded, and apply the slight surface pressure required.

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Номер записи: 62

23-08-2012 дата публикации

Plating of ceramic matrix composite parts as joining method in gas turbine hardware

Номер: US20120210718A1

Автор: Andres Garcia-Crespo, Benjamin Paul Lacy

Принадлежит: General Electric Co

Method of joining a ceramic matrix composite article to a metallic component by providing the ceramic matrix composite article with a metallic region which bonds to the metallic component.

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Номер записи: 63

30-08-2012 дата публикации

Repair alignment method and apparatus for turbine components

Номер: US20120216402A1

Автор: Gary R. Peters, Hai Sam, Michael Gary Krizansky

Принадлежит: General Electric Co

A turbine component repair apparatus includes: a first die having male and female halves for clamping a first section of a turbine blade with a platform and a root portion of an airfoil, the first die having a recess shaped to receive the root portion and retain a faying surface thereof in predetermined alignment; and a second die having male and female halves for clamping a repair section which defines a tip portion of the airfoil, the second die having a second recess shaped to receive the tip portion and retain a faying surface of the tip portion in predetermined alignment. The first and second dies have mating front faces configured to align their bottom surfaces in a common plane. A alignment device is removably attached to the second die to temporarily align the repair section in the absence of the male half of the second die.

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Номер записи: 64

30-08-2012 дата публикации

Method and device for producing a component of a turbomachine

Номер: US20120217226A1

Автор: Erwin Bayer, Sven-J. Hiller

Принадлежит: MTU AERO ENGINES GMBH

The invention relates to a method for producing a component ( 10 ) of a turbomachine, especially a structural part of a turbine or a compressor, the method being a generative production method for the layer-by-layer buildup of the component ( 10 ). After production of one or more successive component layers pressure is applied to at least sections of the surface of the most recently produced component layer ( 12 ), the pressure being induced by laser or plasma. The invention further relates to a device for producing a component ( 10 ) of a turbomachine, especially a structural part of a turbine or a compressor, the device ( 26 ) comprising at least one powder feed ( 28 ) for the deposition of at least one powder component material ( 16 ) onto a component platform, at least one radiation source ( 14 ) for a local layer-by-layer fusion or sintering of the component material ( 16 ) and at least one laser radiation source ( 20 ) or at least one plasma impulse source.

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Номер записи: 65

06-09-2012 дата публикации

Laser processing method and laser processing device

Номер: US20120223061A1

Автор: Etsuji Ohmura, Takafumi Atsumi, Yuji Ikeda

Принадлежит: Aisin Seiki Co Ltd

A laser processing method for forming a modification region serving as a starting point of cutting inside a member to be cut along a planned cutting line by relatively moving an optical axis of a condenser lens along the planned cutting line of the member and by irradiating the member with focused laser light, wherein a plurality of cross-sectional focused spots is simultaneously formed on a section which is perpendicular to the optical axis of the condenser lens at positions having a predetermined depth from a surface of the member and which is parallel to the surface and, at that time, at least one cross-sectional focused spot of the plurality of cross-sectional focused spots is formed on a projection line of the planned cutting line onto the cross section to form one or more inside modification regions having a desired shape.

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Номер записи: 66

06-09-2012 дата публикации

Annealing method and annealing apparatus

Номер: US20120225568A1

Автор: Dorel Toma, Hongyu Yue, Junjun Liu, Yusaku Izawa

Принадлежит: Tokyo Electron Ltd

An annealing method irradiates a target object, having a film formed on its surface, with a laser beam to perform an annealing process to the target object. The surface of the target object is irradiated with the laser beam obliquely at an incident angle that is determined to achieve an improved laser absorptance of the film.

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Номер записи: 67

13-09-2012 дата публикации

Apparatus and method for optical isolation

Номер: US20120229910A1

Автор: Michael Kevan Durkin, Stewart Thomas Ingram

Принадлежит: SPI LASERS UK LTD

Provided herein is an apparatus for optically isolating a light beam from a laser, comprising an optical isolator configured to isolate a light beam having a beam quality; a reference plane; an output connector disposed at the output of the optical isolator, wherein the output connector is configured with a common collimator interface to connect to a collimator which is capable of being mechanically referenced to the reference plane; a first lens arrangement disposed proximal to a distal end of the output connector, wherein the first lens arrangement is selected to provide an output light beam having a predetermined divergence. The laser can be selected from the group consisting of a fiber laser, a disk laser and a rod laser. Also provided herein are a system, a plurality of lasers, and a method of providing a light beam that has a consistent divergence and distance from a reference plane.

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Номер записи: 68

20-09-2012 дата публикации

Method for producing a metal reinforcement for a turbine engine blade

Номер: US20120233859A1

Автор: Bernard Jose Michel Cattiez, Jerome Guinois, Philippe Marolle, Stephane Andre Leveque, Thierry Jean Emile Flesch

Принадлежит: SNECMA SAS

A method for making a metal reinforcement for the leading edge or trailing edge of a turbine engine blade, including: positioning a preform using an equipment positioning the preform in a position such that the preform, at one end thereof, has an area which is capable of receiving a filler metal; and, after the positioning, constructing a base for the metal reinforcement by hard-surfacing with filler metal in the area, in the form of metal beads.

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Номер записи: 69

27-09-2012 дата публикации

Wafer dividing method

Номер: US20120244682A1

Автор: Kei Tanaka

Принадлежит: Disco Corp

In a wafer dividing method, a wafer is held by a chuck table of a laser beam processing apparatus. A modified layer is formed by radiating a laser beam having a wavelength that transmits the laser beam through the wafer, while adjusting the beam convergence point to a position inside of the wafer, so as to form a pair of modified layers the interval of which is greater than the width of a cutting edge of a cutting blade and smaller than the width of planned dividing lines, on the back side of the wafer at both sides of each of the planned dividing lines. The wafer is adhered to a dicing tape and divided into individual devices by cutting along the dividing lines.

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Номер записи: 70

04-10-2012 дата публикации

Point-welding clamp structure

Номер: US20120248672A1

Автор: Yang Jen YUNG

Принадлежит: Individual

A point-welding clamp structure for side by side tightly clamping and locating different plate-shaped metal pieces in their true relative positions so as to facilitate the point-welding operation. The point-welding clamp structure includes a body section and a base section for clamping the different metal pieces. A second adjustment section is disposed on the body section and a third adjustment section is disposed on the base section. By means of operating the second and third adjustment sections, the metal pieces with different thickness can be securely clamped and located by the point-welding clamp structure.

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Номер записи: 71

18-10-2012 дата публикации

Method for producing semiconductor light-emitting chip and semiconductor light-emitting chip

Номер: US20120261678A1

Автор: Daisuke Hiraiwa, Takehiko OKABE

Принадлежит: Showa Denko KK

In producing a semiconductor light-emitting chip whose substrate is composed of a sapphire single crystal, cracking in semiconductor light-emitting elements in the obtained semiconductor light-emitting chip is suppressed. A semiconductor light-emitting chip is obtained by forming, on an element-group formation substrate on a front surface of which semiconductor light-emitting elements are formed, the front surface being composed of a C-plane of a sapphire single crystal, dividing grooves extending toward a first direction along an M-plane of the sapphire single crystal and the front surface of the substrate from a substrate front surface side (step 103 ), forming first modified regions extending toward the first direction and second modified regions extending along the substrate front surface and toward a second direction different from the first direction in the substrate (step 104 and step 105 ), and dividing the element-group formation substrate using the first modified regions and the second modified regions (step 106 ).

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Номер записи: 72

25-10-2012 дата публикации

Method for dicing wafer stack

Номер: US20120267351A1

Автор: Shih-Tsun Huang

Принадлежит: Lingsen Precision Industries Ltd

A method for dicing a wafer stack having a first wafer and a second wafer stacked under the first wafer includes the steps of cutting the first wafer by a cutting blade to form a first cutting location on the first wafer, then cutting the first wafer by a laser stealth dicing process to form a second cutting location on the first wafer, and then removing the portion defined by the first and second cutting locations. In this way, it can avoid the to-be-removed portion from flying off from the first wafer during cutting.

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Номер записи: 73

01-11-2012 дата публикации

Laser match honing system and method

Номер: US20120273471A1

Автор: Fernanda Rojas, Frank Meyer, Harald-Thomas Stumpp, Jannis Stemmann

Принадлежит: ROBERT BOSCH GMBH

A laser match honing system and method are provided for processing one of a pair of mechanically matching components ( 1, 2 ) having matching portions ( 12, 22, 16, 26 ) that will be fitted with each other. A dimension of the matching portion ( 12, 16 ) of the first component ( 1 ) is measured and is then used for calculating the desired dimension of the corresponding matching portion ( 22, 26 ) of the second component ( 2 ). An actual dimension of the matching portion ( 22, 26 ) of the second component ( 2 ) is also measured. Then, the matching portion ( 22, 26 ) of the second component ( 2 ) is honed by laser beam in the condition that the actual dimension is not equal to the desired dimension.

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Номер записи: 74

01-11-2012 дата публикации

Laser processing systems and methods for beam dithering and skiving

Номер: US20120273472A1

Автор: Alexander A. Myachin, Andrew Berwick, Mark A. Unrath

Принадлежит: Electro Scientific Industries Inc

A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.

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Номер записи: 75

08-11-2012 дата публикации

High-corrosion-resistant aluminum alloy brazing sheet, method of manufacturing such sheet, and corrosive-resistant heat exchanger using such sheet

Номер: US20120279694A1

Автор: Akio Niikura, Makoto Ando, Masafumi Saito, Masaki Harada, Sadayuki Kamiya, Taketoshi Toyoma, Yoichi Kojima, Yoshiyuki Oya

Принадлежит: Denso Corp

Problem To provide an aluminum alloy brazing sheet, featuring a good brazing property that prevents diffusion of molten filler material in a core material of the aluminum alloy brazing sheet during a brazing process and exhibiting a superior corrosion resistance to an exhaust gas condensate water after the brazing process, a method of manufacturing the aluminum alloy brazing sheet, and a high corrosion-resistant heat exchanger using the aluminum alloy brazing sheet. Resolving Means A high corrosion-resistant aluminum alloy brazing sheet comprises a core material composed of an aluminum alloy, a sacrificial anode material cladded on one surface of the core material, and a filler material composed of an Al/Si-based alloy and cladded on another surface of said core material, and is characterized in that the sacrificial anode material is composed of an aluminum alloy which contains Si falling within a range of 2.5-7.0 mass %, Zn falling a range of 1.0-5.5 mass %, Fe falling within a range of 0.05-1.0 mass %, and which is composed of the balance Al and the inevitable impurities, and that a clad thickness of the sacrificial anode material falling within a range of 25-80 μm. Also, there is provided a method of manufacturing the aluminum alloy brazing sheet, and a high corrosion-resistant heat exchanger using the aluminum alloy brazing sheet.

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Номер записи: 76

22-11-2012 дата публикации

Soldered aluminum heat exchanger

Номер: US20120292001A1

Автор: Andreas Eilemann, Bernd Gruenenwald, Matthias Goerdeler, Matthias Traub, Matthias Tuerpe

Принадлежит: Behr GmbH and Co KG

A soldered aluminum heat exchanger, having tubes made of a core material through which tubes a coolant flows, and the tubes being connected to at least one header by means of an inner soldered joint; having a protective plating on the inner face of the core material comprising aluminum and using four-layer technology; having an inner solder plating on the protective plating; and having an outer solder plating on the outer face of the tube facing away from the coolant face.

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Номер записи: 77

29-11-2012 дата публикации

Method for processing rubber surface and sealing member

Номер: US20120299250A1

Автор: Chihiro Asanuma, Makoto Hino, Ritsuko Yokota, Tatsuo Katayama, Tomohisa Yamamoto, Yutaka Mitooka

Принадлежит: Uchiyama Manufacturing Corp

A method for processing a rubber surface and a sealing member treated with the method. In the first mode, a rubber surface is formed with a large number of small dimples in a regularly dotted pattern by irradiating laser beams from a laser irradiation device. In the second mode, a skin layer of the rubber surface is removed by irradiating laser beams from the laser irradiation device. In the third mode, the first mode and the third mode are combined. A sealing member comprises rubber including a seal lip part for elastically and slidably contacting a counterpart member, wherein a sliding contact surface of the seal lip part contacting the counterpart member is treated with one of the first, the second and the third modes of the method for processing a rubber surface.

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Номер записи: 78

29-11-2012 дата публикации

Apparatus and method for repair of defects in an electronic energy control or display device

Номер: US20120302122A1

Автор: Harvey KALWEIT, Neil L. Sbar

Принадлежит: Sage Electrochromics Inc

An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.

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Номер записи: 79

06-12-2012 дата публикации

Live welding method and arrangement for aluminum electrolytic cell under series full current

Номер: US20120305630A1

Автор: Bin Cao, Tao Yang

Принадлежит: China Aluminum International Engineering Corp ltd

A device using the live welding method for aluminum electrolytic cell overhauling under series full current consists of short-circuit buses at the bottom of the cell ( 1 ), pillar buses ( 2 ), an anode bus ( 3 ), a balance bus ( 4 ), a inter-cell standby bus ( 5 ), a door-shaped pillar clamp ( 6 ), an arcuate clamp ( 7 ) of anode buses, a current conversion switch ( 8, a mechanical switching device ( 9 ) for the short-circuit port, a voltage sensor and wires thereof ( 10 ), a temperature sensor and wires thereof ( 11 ), a system ( 12 ) for data acquiring, displaying, analyzing and alarming, an A-side welding area ( 13 ), a B-side welding area ( 14 ) and compression-joint points ( 15 ) on pillar soft belts of overhauling cells; and the live welding method comprises the following steps: when welding is required to be performed in some zone, the currents of short-circuit buses at the bottom of the cell ( 1 ) and pillar buses ( 2 ) which influence the welding area most are cut off, the serial currents are shunted to other pillar buses ( 2 ), other buses at the bottom of the cell ( 1 ) and the inter-cell standby buses ( 5 ) such that the magnetic field intensity at the welding area can be lowered to the extent that welding can be performed so as to perform welding, and such a device and method can achieve live welding of aluminum electrolytic cells overhauling under series full current.

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Номер записи: 80

20-12-2012 дата публикации

Method for making a metal reinforcement for the blade of a turbine engine

Номер: US20120317810A1

Автор: Dominique Magnaudeix, Gilles Charles Casimir Klein, Philippe Marolle, Stephane Andre Leveque

Принадлежит: SNECMA SAS

A method for making a metal reinforcement for the leading edge or trailing edge of the blade of a turbine engine that includes making a metal insert defining the base of the metal reinforcement; positioning the metal insert at the end of a blank of a shaping tool, the blank repeating the shape of the turbine-engine blade; shaping a planar metal sheet on the metal insert and the blank of the shaping tool using a superplastic hot-shaping method.

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Номер записи: 81

20-12-2012 дата публикации

Semiconductor module manufacturing method, semiconductor module, and manufacturing device

Номер: US20120319253A1

Автор: HIROKI Mizuno

Принадлежит: Toyota Motor Corp

In the disclosed method for manufacturing a semiconductor module, a metal layer and a cooler, which have different coefficients of thermal expansion from each other, are joined into a single unit via an insulating resin sheet. A work, comprising a semiconductor element placed on the metal layer with solder interposed therebetween, is fed into a reflow furnace. The work, in that state, is heated in the reflow furnace, thereby mounting the semiconductor element to the metal layer. The heating is carried out such that the temperature of the cooler and the temperature of the metal layer differ by an amount that make the cooler and the metal layer undergo the same amount of thermal expansion as each other.

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Номер записи: 82

20-12-2012 дата публикации

High corrosion resistant equipment for a plant

Номер: US20120321904A1

Автор: Haruo Akahoshi, Katsuhito Takahashi, Kenya Ohashi, Ryo Ishibashi, Seunghwan Park, Shinya Imano

Принадлежит: HITACHI LTD

Provided is high corrosion resistant equipment for a plant having the lining structure which exhibits high reliability against breaking of a joining portion over a long use period. The high corrosion resistant equipment for a plant includes a lining plate and a support portion which are made of a high corrosion resistance material and a structural material portion made of a steel material or the like. The lining plate and the support portion include a joining portion to which friction stirring is applied. The support portion is assembled into or fastened to the structural material portion by means of the geometrical structure with a gap interposed between the support portion and the structural material portion. Due to such a constitution, high corrosion resistant equipment for a plant having the lining which exhibits high reliability can be acquired.

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Номер записи: 83

20-12-2012 дата публикации

Water soluble mask for substrate dicing by laser and plasma etch

Номер: US20120322233A1

Автор: AJAY Kumar, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Wei-Sheng Lei

Принадлежит: Applied Materials Inc

Methods of dicing substrates having a plurality of ICs. A method includes forming a mask comprising a water soluble material layer over the semiconductor substrate. The mask is patterned with a femtosecond laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the substrate between the ICs. The substrate is then etched through the gaps in the patterned mask to singulate the IC and the water soluble material layer washed off.

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Номер записи: 84

20-12-2012 дата публикации

In-situ deposited mask layer for device singulation by laser scribing and plasma etch

Номер: US20120322234A1

Автор: AJAY Kumar, Banqiu Wu, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Wei-Sheng Lei

Принадлежит: Applied Materials Inc

Methods of dicing substrates by both laser scribing and plasma etching. A method includes forming an in-situ mask with a plasma etch chamber by accumulating a thickness of plasma deposited polymer to protect IC bump surfaces from a subsequent plasma etch. Second mask materials, such as a water soluble mask material may be utilized along with the plasma deposited polymer. At least some portion of the mask is patterned with a femtosecond laser scribing process to provide a patterned mask with trenches. The patterning exposing regions of the substrate between the ICs in which the substrate is plasma etched to singulate the IC and the water soluble material layer washed off.

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Номер записи: 85

20-12-2012 дата публикации

Laser and plasma etch wafer dicing using water-soluble die attach film

Номер: US20120322238A1

Автор: AJAY Kumar, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Wei-Sheng Lei

Принадлежит: Individual

Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. A method includes forming a mask above the semiconductor wafer. The semiconductor wafer is disposed on a water-soluble die attach film. The mask covers and protects the integrated circuits. The mask is patterned with a laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then etched through the gaps in the patterned mask to form singulated integrated circuits. The water-soluble die attach film is then patterned with an aqueous solution.

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Номер записи: 86

27-12-2012 дата публикации

Hot Rivet Connection and Method for the Production Thereof

Номер: US20120328360A1

Автор: Bernard Ziegler, Bernd Koppitz, Heiko Steinmetz, Rudolf Reinhardt, Tobias Schuster

Принадлежит: DAIMLER AG

A method for non-releasable fixing of at least one component to a further component is provided in which a hot rivet is introduced into an opening of the at least one first component and an end face of a shank of the hot rivet is welded to a surface of the further component. Subsequently, with plastic deformation of the hot rivet, the shank of the hot rivet is compressed until a head of the hot rivet lies with a pre-stressing force at least in areas on a surface of the at least one component. The pre-stressing force, with which the head of the hot rivet lies at least in areas on the surface of the at least one component, is adjusted to a predefined value.

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Номер записи: 87

27-12-2012 дата публикации

Laser processing method

Номер: US20120329247A1

Автор: Takeshi Sakamoto

Принадлежит: Hamamatsu Photonics KK

For modulating laser light for forming a modified region SD 3 at an intermediate position between a position closer to a rear face 21 and a position closer to a front face 3 with respect to an object 1, a quality pattern J having a first brightness region extending in a direction substantially orthogonal to a line 5 and second brightness regions located on both sides of the first brightness region in the extending direction of the line 5 is used. After forming modified regions SD 1, SD 2 at positions closer to the rear face 21 but before forming modified regions SD 4, SD 5 at positions closer to the rear face 21 while using the front face 3 as a laser light entrance surface, the modified region SD 3 is formed at the intermediate position by irradiation with laser light modulated according to a modulation pattern including the quality pattern J.

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Номер записи: 88

03-01-2013 дата публикации

method for brazing a surface of a metallic substrate

Номер: US20130001277A1

Автор: Ingo Reinkensmeier, Sebastian Piegert

Принадлежит: SIEMENS AG

A method for brazing a surface of a metallic substrate having a generally passive metal oxide layer includes activating the surface of the metallic substrate by machining the metallic substrate with a hard metal tool, grit blasting powdered particles of an activating material on the surface, and wetting the grit blasted surface of the metallic substrate with a filler material at a brazing temperature, wherein the activating material is reactive with the metal oxide layer at the brazing temperature.

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Номер записи: 89

03-01-2013 дата публикации

Laser ablation tooling via distributed patterned masks

Номер: US20130003030A1

Автор: Thomas R.J. Corrigan

Принадлежит: 3M Innovative Properties Co

A distributed patterned mask for use in a laser ablation process to image a complete pattern onto a substrate. The mask has a plurality of apertures for transmission of light and non-transmissive areas around the apertures. When the apertures for the distributed pattern are repeatedly imaged on a substrate, structures within the distributed pattern merge within different areas of the imaged pattern to create the complete pattern with distributed stitch lines in order to reduce or eliminate the stitching effect in laser ablation. The mask can also form a sparse and distributed pattern including apertures that individually form merging portions of the complete pattern and collectively form a distributed pattern.

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Номер записи: 90

10-01-2013 дата публикации

Removal apparatuses for semiconductor chips and methods of removing semiconductor chips

Номер: US20130008020A1

Автор: Jaeyong Park, Junyoung Ko, Kyhyun Jung, Whasu Sin

Принадлежит: SAMSUNG ELECTRONICS CO LTD

A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board. A method of removing a semiconductor chip from a board may include loading the board, on which the semiconductor chip is mounted by bumps, on a stage; irradiating a laser beam into the semiconductor chip to melt the bumps and to separate the semiconductor chip from the board; continuously irradiating the laser beam into the board on which solder pillars, that are residues of the bumps, remain to melt the solder pillars; and removing the solder pillars.

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Номер записи: 91

10-01-2013 дата публикации

Orbital Welding Apparatus

Номер: US20130008881A1

Автор: Paul John Berbakov

Принадлежит: Individual

A pipe welding arrangement that allows for real-time independent control of all carriages, torches, and ancillary components by design. The invention uses a split-ring race that is mounted on a backing ring of similar design. Numerous welding heads are mounted on carriages that are distributed at set intervals along the circumference of the race. The left and right side race and backing ring assemblies are split at the twelve o'clock and six o'clock positions. They can be decoupled and spread apart horizontally to facilitate installation and for clearing obstacles. Alignment tools (tapered pins) facilitate assembly. Locking devices located near each split interface, coupled with the alignment pins, assure that the race acts as a continuous unit during the welding operation. Linear actuators mounted on the backing rings maintain concentricity between the race and the welded tube and act as a positive clamping system.

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Номер записи: 92

10-01-2013 дата публикации

Joined heterogeneous materials and joining method therefor

Номер: US20130011183A1

Автор: Takanori Yahaba, Tsutomu Kobayashi

Принадлежит: Honda Motor Co Ltd

Disclosed is a joined heterogeneous material in which a carbon steel material ( 11 ) and an aluminum material ( 12 ) have joined via friction-stir welding. The region of a weld zone ( 15 ) with a low lift-up amount in a plastic flow area ( 17 ) created during friction-stir welding is located on one side of the aluminum material ( 12 ) with respect to the weld zone ( 15 ), created by a welding probe ( 14 ). The region of the weld zone ( 15 ) with a high plastic flow area ( 17 ) lift-up amount is located on the other side of the aluminum material ( 12 ).

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Номер записи: 93

10-01-2013 дата публикации

METHOD FOR ASSEMBLING, JOINING PARTS MADE OF SiC-BASED MATERIALS BY NON-REACTIVE BRAZING, BRAZING COMPOSITIONS, AND JOINT AND ASSEMBLY OBTAINED BY SAID METHOD

Номер: US20130011185A1

Автор: Jean-François Henne, Valérie CHAUMAT

Принадлежит: Commissariat a lEnergie Atomique et aux Energies Alternatives CEA

A method for joining, assembling, at least two parts made of silicon carbide-based materials by non-reactive brazing is provided. According to the method, the parts are contacted with a non-reactive brazing composition, the assembly formed by the parts and the brazing composition is heated to a brazing temperature sufficient to melt the brazing composition totally or at least partly, and the parts and the brazing composition are cooled so that, after solidification of the brazing composition, a moderately refractory joint is formed; wherein the non-reactive brazing composition is a binary alloy consisting in atomic percentages, of 60% to 66% silicon and 34 to 40% nickel. A brazing composition as defined above is also provided. A paste, suspension of braze alloy comprising a powder of the brazing composition and an organic binder is provided. In addition, a joint and assembly obtained with the foregoing method is provided.

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Номер записи: 94

17-01-2013 дата публикации

Laser processing machine

Номер: US20130015166A1

Автор: Chun-Hao Li

Принадлежит: Individual

A laser processing machine includes a cavity, a laser system, at least one processing platform, and at least one upper motion platform. The laser system is disposed at a lower part inside the cavity, and used for outputting a laser beam. A traveling direction of the laser beam is opposite to the gravity direction. The processing platform is disposed at an upper part inside the cavity, and includes an adsorption surface and a connection surface facing each other. The adsorption surface is located below the connection surface, and is used for adsorbing a workpiece. The upper motion platform is disposed at the upper part inside the cavity, and is correspondingly connected to the connection surface of the processing platform, in order to cause the processing platform to move.

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Номер записи: 95

17-01-2013 дата публикации

Device for cutting plastic products provided in a continuous plastic band for use in the medical sector

Номер: US20130017289A1

Автор: Heinz Kieburg, Reiner Franzke

Принадлежит: B Braun Melsungen AG

Devices for cutting interconnected plastic products for use in the medical sector provided in a continuous band of plastic, comprising a laser, a laser control system and an optical acquisition and data processing unit are disclosed. Devices for the manufacture of plastic products, such as fillable or filled plastic containers for use in the medical sector, comprising a device for cutting interconnected plastic products provided in a continuous band of plastic as well as a process for cutting interconnected plastic products provided in a continuous band of plastic are disclosed. The optical acquisition unit may determine positional data for the interconnected plastic products provided in the band. From the positional data a cutting pattern may be calculated and transmitted to the laser control system. According to this cutting pattern, the position, intensity and focal point of the laser may be controlled by the laser control system, which may comprise a focusing optic, a deflection means and a beam-forming means.

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Номер записи: 96

17-01-2013 дата публикации

Introducer sheath with braided filament securement mechanism

Номер: US20130018318A1

Автор: Kurt J. Tekulve, Mahendran Ravichandran, Michael D. Deckard, Michelle Reynolds

Принадлежит: Cook Medical Technologies LLC

A tubular body for a medical device for insertion within a body passageway of a patient. The tubular body includes a tubular inner liner. A braided member is disposed along an outer surface of the liner. The braided member includes intersecting filaments and cells defined by the filaments. A securement mechanism, such as radiopaque solder, is disposed along a circumferential region of the braided member. The securement mechanism is attached to portions of the filaments and spans the cells that correspond to the circumferential region to inhibit relative movement of filament ends. An outer surface of the securement mechanism is sized to extend radially outward to a position up to an outer surface of the braided member to not add to the overall wall thickness of the tubular body. An outer jacket is positioned longitudinally around the braided member and connected to the inner liner.

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Номер записи: 97

24-01-2013 дата публикации

Braze alloy for high-temperature brazing and methods for repairing or producing components using a braze alloy

Номер: US20130020377A1

Автор: Alexander Stankowski, Daniel Beckel

Принадлежит: Individual

In a Ni-based, Co-based, or Ni—Co-based braze alloy ( 1 ) for high-temperature brazing of components ( 7 ) of modular structure and for repairing damaged components ( 7 ) which are formed of single crystal or directionally solidified superalloys using said braze alloy ( 1 ), the braze alloy has a first metallic powder component ( 2 ) having particle sizes in the nanometer range and a second metallic powder component ( 3 ) having particle sizes in the micrometer range. The surface of the particles of the second powder component ( 3 ) is thinly coated with particles of the first powder component ( 2 ). The braze alloy ( 1 ) additionally includes grain boundary stabilizing elements as alloying elements. In addition, melting point depressants can be present in the braze alloy ( 1 ) in a commercially common quantity or with a considerably increased proportion. Both the melting temperature of the braze alloy ( 1 ) and the probability of recrystallization are advantageously reduced.

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Номер записи: 98

24-01-2013 дата публикации

Grooved circuit board accommodating mixed-size components

Номер: US20130021763A1

Автор: FAN LI, Jie Huang, Surinder JASSAL

Принадлежит: Research in Motion Ltd

A circuit board, associated assembly, and method of manufacture. The circuit board comprises an elongated groove, extending into the circuit board, for accommodating a footing of a large component such as an RF shield. The groove allows solder paste to be deposited therein via a stencil, to a depth greater than the stencil thickness. Thus the same stencil can be used for depositing solder paste for both small and large components.

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Номер записи: 99

31-01-2013 дата публикации

Apparatus and method for cohesive joining

Номер: US20130028659A1

Автор: Alois Leitner, Roland Rechberger

Принадлежит: VOESTALPINE STAHL GMBH

The invention relates to an apparatus and to a process for cohesively joining two plates ( 1 and 2 ) having differing melting points, one of which plates, the end plate ( 1 ), includes a light metal material, in particular aluminum material, and the other of which plates, the connecting plate ( 2 ), includes an iron and/or titanium material, wherein a coating ( 9 ) preferably on the basis of zinc or aluminum is provided at least partially on at least one of the abutting faces ( 3′, 3 ″) of the abutting edge ( 3 ) of the connecting plate ( 2 ) which extend inclined with respect to one another, in which process both plates ( 1 and 2 ) are joined together by braze welding so as to abut against one another along their common joint using an additional material ( 5 ) on the basis of light metal, in particular on the basis of aluminum. In order to provide advantageous process conditions, the invention proposes that a recess ( 10 ) be made, before joining, in the abutting edge ( 4 ) of the end plate ( 1 ) for receiving at least part of the coated abutting edge ( 3 ) of the connecting plate ( 2 ), wherein, during joining, braze welding is carried out at least partially over a flank ( 11 or 12 ) of the recess ( 10 ) overlapping the coating ( 9 ) of the connecting plate part.

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Номер записи: 100

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