СИСТЕМА И СПОСОБ ДЛЯ ОБРАБОТКИ ОБЪЕКТОВ С ИСПОЛЬЗОВАНИЕМ ЛАЗЕРА

Изобретение относится к системе и способу лазерной обработки и может быть использовано для маркировки, сварки, сверления, резания и тепловой обработки различных конструкций в машиностроении. Система содержит устройство подачи объектов с предварительным расположением их на опорной поверхности, поддон для опоры объектов, гальванометрическую головку, лазерный источник и компьютер. Гальванометрическая головка состоит из первой широкоугольной камеры с фокусирующей линзой и с первым фильтром, расположенным на выходе первой камеры, второй узконаправленной камеры с фокусирующей линзой и со вторым фильтром, расположенным на выходе второй камеры, направляющего зеркала, гальванометрических отклоняющих зеркал и линзы, которая отображает, по меньшей мере, один объект, расположенный на поддоне. В компьютере установлено программное обеспечение распознавания формы для контролирования работы указанной первой камеры, указанной второй камеры, указанного лазерного источника и средств управления перемещением ...

СПОСОБ УПРАВЛЕНИЯ ПРОЦЕССОМ ЛАЗЕРНОЙ РЕЗКИ И УСТРОЙСТВО ЛАЗЕРНОЙ РЕЗКИ ДЛЯ ЕГО ОСУЩЕСТВЛЕНИЯ

Группа изобретений относится к способу и устройству для лазерной резки. Согласно настоящему изобретению процессом лазерной резки управляют, используя в качестве опорного сигнала одну или несколько линий спектра испускания, характерных для излучения, испускаемого вспомогательным газом или газообразной примесью, находящейся в объеме материала, облучаемого сфокусированным лазерным лучом, сфокусированным лазерной головкой (12), при этом на основании определенного сигнала проводится корректировка по меньшей мере одного из следующих контролируемых параметров: мощность лазерного излучения, частота и коэффициент заполнения лазерных импульсов, давление вспомогательного газа, испускаемого соплом (16), являющимся частью лазерной головки (12), скорость перемещения лазерной головки (12) относительно заготовки (P), расстояние между лазерной головкой (12) и поверхностью (S) заготовки (P), и расстояние между фокусом (F) лазерного луча и поверхностью (S) заготовки (P). Техническим результатом является улучшение ...

СПОСОБ СВАРКИ, СОВМЕЩАЮЩИЙ В СЕБЕ ИСПОЛЬЗОВАНИЕ ЛАЗЕРНОГО ПУЧКА И ЭЛЕКТРИЧЕСКОЙ ДУГИ С ПЛАВЯЩИМСЯ ЭЛЕКТРОДОМ, ДЛЯ СБОРКИ УКЛАДЫВАЕМЫХ ВСТЫК МЕТАЛЛИЧЕСКИХ ТРУБ С ЦЕЛЬЮ ФОРМИРОВАНИЯ МЕТАЛЛИЧЕСКИХ ТРУБОПРОВОДОВ

... 1. Способ сварки, в частности трубчатых изделий типа укладываемых встык металлических труб для формирования металлических трубопроводов, в соответствии с которым проплавление выполняют снаружи, отличающийся тем, что формируют единственную сварочную ванну под одновременным воздействием, по меньшей мере, одного лазерного пучка (1), передаваемого по оптическому волокну, и, по меньшей мере, одной электрической дуги в среде защитного газа, генерируемой из плавящегося электрода (2а), образующего присадочный материал. ! 2. Способ по п.1, отличающийся тем, что проплавление выполняют с подаваемой на свариваемые трубы мощностью лазера, менее или равной 6 кВт, и с использованием горелки для электродуговой сварки типа горелки MIG мощностью более 8 кВт. ! 3. Способ по п.1, отличающийся тем, что независимо друг от друга раздельно регулируют положение точки фокусировки лазерного пучка (1), интервал между точкой фокусировки (1а) лазерного пучка (1) и положением точки (2b) удара электрической дуги, а также ...

ГОЛОВКА ДЛЯ ЛАЗЕРНОЙ СВАРКИ

... 1. Головка (1) для лазерной сварки для сваривания металлических частей с, по меньшей мере, одним ходом лучей для сваривающего луча (2) и средствами для оптической регистрации положения сварного шва на первой позиции (9) измерения, причем средства для оптической регистрации положения сварного шва обеспечивают расположение первой позиции (9) измерения, по меньшей мере, в направлении (6) сваривания с опережением положения (8) сварки сваривающего луча (2) и, по меньшей мере, в зависимости от латерального отклонения сварного шва от заданного положения создают корректирующий сигнал для коррекции положения (8) сварки сваривающего (2) луча, причем расстояние первой позиции (9) измерения при опережении положения (9) сварки сваривающего луча выбрано так, что созданный корректирующий сигнал может применяться непосредственно, в частности, без опережающего расчета, для управления средствами (7) коррекции положения (8) сварки сваривающего луча (2), отличающаяся тем, что в ходе лучей сваривающего луча ...

УСТРОЙСТВО И СПОСОБ РЕЗАНИЯ ЛАЗЕРОМ С АВТОМАТИЧЕСКИМ РЕГУЛИРОВАНИЕМ ИМПУЛЬСОВ ГАЗА ПО ЧАСТОТЕ ИЛИ ПО ДАВЛЕНИЮ

... 1. Способ автоматического резания при помощи лазера, включающий в себя нагнетание потока газа в место резания, чтобы удалять шлаки и газы, производимые в ходе резания, при этом нагнетание осуществляют импульсами, отличающийся тем, что непрерывно измеряют интенсивность обратного рассеяния света лазера и изменяют либо частоту, либо давление, либо одновременно частоту и давление импульсов, поддерживая эту интенсивность на минимуме.2. Способ автоматического резания по п. 1, отличающийся тем, что частоту или давление меняют пошагово.3. Способ автоматического резания по п. 2, отличающийся тем, что значение шага частоты составляет от 1 Гц до 3 Гц.4. Способ автоматического резания по п. 2, отличающийся тем, что шаги давления имеют значение меньше 1 бар.5. Способ автоматического резания по любому из пп. 1-4, отличающийся тем, что частота или давление находится в пределах, и при достижении пределов производят увеличение мощности лазера.6. Способ автоматического резания по п. 3, отличающийся тем, ...

ЛАЗЕРНОЕ СОПЛО С ВНУТРЕННИМ ПОДВИЖНЫМ ЭЛЕМЕНТОМ И НАРУЖНЫМ КОЖУХОМ

Integrated sensor and focus adjuster for high power laser - determines focusing error using quadrant detector and sends corrective control signals to piezoelectric or magnetostrictive actuators

The partially transparent reflecting plate is provided with cooling ducts. A pressure proof stable shaped housing is formed by a baseplate (11), a housing body (10), a ring shaped flexible element designed in the manner of a spring bellows and a reflecting plate (13). A quadrant detector (14) with a preconnected light chopper (15), as well as two or more adjusting elements (16) are arranged at the outer edge of the baseplate (11) for the correction of the direction are mounted on the base and fixing plate (11). The correction elements (16) react on the top end of the pressure proof housing across the ring shaped flexible element (12) onto the edge of the reflecting plate (13). A holographic optical pattern (13a) in the form of a rotation symemtrical Fresnel lens is applied on the rear side of the reflecting plate (13). The four quadrant detector (14) is assigned an electronic unit (14a), which determines the angular deviation amount of the laser beam (20) and delivers a correction control ...

Verfahren zur Ausrichtung eines Laserstrahles auf die Oeffnung einer Düse und Fokussierkopf zur Laserstrahlbearbeitung.

Fehlerkompensationsverfahren zum Glätten einer Fläche einer durchsichtigen Platte

Vorrichtung zum Remote-Bearbeiten von Werkstücken mittels eines Laserbearbeitungsstrahls

VERFAHREN ZUR UEBERWACHUNG DES BEARBEITUNGSPROZESSES MIT EINER HOCHLEISTUNGSENERGIEQUELLE, INSBESONDERE EINEM LASER, UND BEARBEITUNGSOPTIK ZUR DURCHFUEHRUNG DESSELBEN

Anzeigevorrichtung und deren Herstellungsverfahren

Tragbares Informationsendgerät (7200), umfassend:ein erstes flexibles Substrat (301);eine erste Klebeschicht (318a) über dem ersten flexiblen Substrat (301);eine erste organische Harzschicht (320a) über der ersten Klebeschicht (318a);ein Isolierfilm (321a) über der ersten organischen Harzschicht (320a);einen Transistor (552) über dem Isolierfilm (321a);ein EL-Element (572), das elektrisch mit dem Transistor (552) verbunden ist;eine zweite organische Harzschicht (320b) über dem EL-Element (572);eine zweite Klebeschicht (318b) über der zweiten organischen Harzschicht (320b); undein zweites flexibles Substrat (307) über der zweiten Klebeschicht (318b),wobei eine Dicke der ersten organischen Harzschicht (320a) kleiner als oder gleich 20 µm ist, undwobei mindestens ein Teil eines Anzeigeabschnitts (7202) des tragbaren Informationsendgeräts (7200) eine gekrümmte Oberfläche aufweist.

Laser-Chipschneidvorrichtung

Laser-Chipschneidvorrichtung, die veranlasst, dass Laserlicht, von welchem eine Konzentrationsstelle zu dem Inneren eines Wafers angeordnet ist, durch die Oberfläche des Wafers einfällt, während das Laserlicht gescannt wird, und den Wafer durch Ausbilden eines modifizierten Bereichs innerhalb des Wafers in Chips zerschneidet, um den Wafer in einzelne Chips zu teilen, wobei die Laser-Chipschneidvorrichtung folgendes aufweist: eine Positionserfassungsvorrichtung, die eine Position bezüglich der Dickenrichtung der Oberfläche des Wafers bei der Einfallstelle des Laserlichts erfasst; eine zweite Positionserfassungsvorrichtung, die getrennt von der ersten Positionsvorrichtung vorgesehen ist und eine Position bezüglich der Dickenrichtung der Oberfläche des Wafers im Voraus erfasst; und einen Steuerabschnitt, der die Position bezüglich der Dickenrichtung der Konzentrationsposition innerhalb des Wafers steuert, wobei der Steuerabschnitt dann, wenn das Laserlicht von der Außenseite einer Peripherie ...

Vorrichtung und Verfahren zum automatischen Ausrichten einer Schweissvorrichtung zum Stumpfschweissen von Werkstücken

Verfahren zum Behandeln eines Substrates und entsprechende Vorrichtung

Verfahren zum Behandeln eines Substrats (10), um darauf ein Muster zu erzeugen, mit den folgenden Schritten, dass ein Substrat (10) vorgesehen wird; eine Substratbehandlungsvorrichtung (121) vorgesehen wird; ein Steuersystem (110, 111) vorgesehen wird; ein Verschiebemechanismus verwendet wird, eine kontinuierliche relative Verschiebung zwischen dem Substrat (10) und der Behandlungsvorrichtung (121) zu bewirken, der ein Verschiebesignal liefert, das die Verschiebung angibt; das Steuersystem (110, 111) verwendet wird, das Verschiebesignal zu überwachen und zu bewirken, dass die Behandlungsvorrichtung (121) das Substrat (10) in Intervallen behandelt, um so das Muster zu erzeugen, während die kontinuierliche Verschiebung erfolgt, wobei das Steuersystem (110, 111) einen Taktvergleichsschritt zur Synchronisation des Verschiebesignals mit den Intervallen ausführt, wobei die relative Verschiebung eine Winkelbewegung um eine Achse herum ist und das Muster um diese Achse herum ausgebildet wird, dadurch ...

Method of reducing or preventing oscillation amplitudes on a welding seam of a laser optics for making a laser welding seam, involves isolating the tool across the machining line

The method involves using a tool (2) which is isolated or at least cushioned against the natural frequency of the robot gripper arm (1) and/or oscillations appearing as impact. The oscillation of the tool across the machining line is isolated or damped. An Independent claim is also included for a device for carrying out the method.

Verfahren und Laserschneidmaschine zum Laserschneiden kleiner Öffnungen

Das erfindungsgemäße Verfahren zum Laserschneiden von Öffnungen (2), welche Öffnungskonturen mit Radien von kleiner als 5 mm aufweisen, in ein insbesondere metallisches Werkstück (3) einer Werkstückdicke von höchstens 2 mm mittels eines Laserstrahls (4) und eines Schneidgases (11), die beide aus einer Schneiddüse (10) eines Laserschneidkopfs (6) austreten, wobei das Werkstück (3) und der Laserschneidkopf (6) relativ zueinander in mindestens einer ersten Richtung (X) bewegt werden und der Laserstrahl (4) von einer in dem Laserschneidkopf (6) vor der Schneiddüse (9) angeordneten Scanneroptik (8) in der ersten und einer dazu schräg verlaufenden, zweiten Richtung (X, Y) auf das Werkstück (3) abgelenkt wird, umfasst jeweils folgende Verfahrensschritte zum Schneiden der Öffnungen (2): a) Erzeugen eines durchgehenden Einstichlochs (14) im Werkstück (3) durch Einstechen des Laserstrahls (4) in das Werkstück (5) an einer Position innerhalb einer zu schneidenden Öffnung (2) mit ersten Prozessparametern ...

VORRICHTUNG UND VERFAHREN ZUM FUEGEN MIT LASERSTRAHLUNG

Method for welding

The method concerns welding of workpieces (10) displaced relative to welding energy sources. These sources comprise at least one high-energy radiation source (11) such as a laser producing a weld seam (12) via formation of a vapour capillary (13), and at least one other energy source (14) producing an electric arc (16) which simultaneously lands within the weld zone (15). During welding the two energy sources are kept apart so that the arc (16) lands either within the joint region heated by the high-energy radiation and not cooled down to the surrounding temperature, or within the joint region not yet undergone welding.

Induktiver Sensor für thermische Bearbeitungsmaschinen

Die Erfindung betrifft einen induktiven Sensor für thermische Bearbeitungsmaschinen, insbesondere für Brennschneidmaschinen, zur induktiven Messung des Arbeitsabstandes eines Plasma-, Autogen- oder Laser-Werkzeugs von einem Werkstück (5). DOLLAR A Erfindungsgemäß wird dadurch, daß der induktive Sensor (1) aus einem durch mindestens eine Koaxialleitung (3) mit einer elektronischen Schaltung (4) geschalteten Sensorring (2) besteht, ein einfaches und kostengünstiges Meßgerät zur induktiven Werkzeug-Werkstück-Abstgandsmessung für Brennschneidmaschinen mit Plasma-, Autogen- oder Laser-Werkzeug zur Verfügung gestellt.

Apparatus for laser welding

The invention relates to an apparatus for laser welding. The adjustment of the distance between the focal point of the focused laser light and the surface of the workpieces to be welded and, in particular, the guidance of the focal point at the set distance from the surface along the vertical contour of the welding groove of three-dimensional weld seams, is effected by observation of the emission of radiation by the plasma buffer above the welding location. For this purpose, an optoelectronic transducer is directed continuously at the welding location and measures the radiation intensity of the plasma, which changes especially if the welding depth changes. The output signals are compared in a control unit with a set point for an optimum weld seam determined in prior test welds. In the event of deviations from this value, an actuator is actuated in order to adjust the position of the focal point. Since the welding depth is indirectly observed, the welding quality is simultaneously also monitored ...

Laserstrahlschweissvorrichtung

Powder coating control method involving powder coating head, coating track, for application of coating to workpiece and focussed laser beam generally useful for powder coating with at least one parameter held constant during coating

Powder coating control involving powder coating head, a coating track for application of the coating to a workpiece (2), focussing a laser beam (3) through the head via a focal point and a convergent powder stream (7) guiding via the powder stream focal point onto the workpiece. An independent claim is included for a device for powder coating control as described above.

POSITIONIERVORRICHTUNG MIT EINER SCHEIBE MIT EINEM GESCHLOSSENEN GASSYSTEM ZUR ERZEUGUNG EINES FLUIDKISSENS

A LASER PROCESSING APPARATUS

... 1284809 Photo-electric control systems MITSUBISHI ELECTRIC CORP 11 June 1970 28435/70 Heading G1A [Also in Division G3] In a laser processing apparatus in which a laser beam 2 is focused at a point 4 on a workpiece 5, to form a hole or a slot, and a monitor beam 15 is focused at the same point 4 and after reflection therefrom is focused by an optical system 10, 9, 16, 17 at a point F 0 , a plate 18 containing a pinhole is vibrated in a direction perpendicular to the optic axis of the lens 17 about the point F 0 , thereby modulating the output from a photo-cell 20. This output is amplified and supplied to a phase sensitive detector 22 whose D.C. output drives a servomotor 24 to adjust the distance between the lens 3 and workpiece 5 to restore the focal point 4 to the surface of the workpiece. This restoring movement may be a movement of the lens 3 alone, a movement of the entire assembly 100, or a movement of the workpiece. The monitor light source 14 may be a lamp or a second, low-power ...

Laser beam welding apparatus

The position of a workpiece (W) delivered into a welding station by a feed mechanism (18) is detected by CCD cameras (124, 126) of position detectors (20, 22), and a positioning error of the workpiece (W) with respect to a reference position is determined on the basis of the detected position. After training data for welding robots (12, 14) is corrected on the basis of the determined positioning error, scan heads (82, 84) on distal ends of the welding robots (12, 14) are inserted into the workpiece (W) to predetermined positions and are actuated to weld the workpiece (W) at a plurality of locations thereof with a laser beam (L) from a laser source (16). Work clamps 128 hold the workpiece and also discharge inert gas in the welding region.

Laser beam machining apparatus and laser beam machining method

A laser beam machining apparatus forms blind holes at predetermined intervals in a workpiece by intermittently irradiating a laser beam from a laser nozzle to the workpiece while the laser nozzle and the workpiece being moved relatively. During the time the workpiece is subjected to machining, the electrostatic capacity between the support member 11 and the laser nozzle is detected by an electrostatic capacity sensor 19 while the workpiece made of conductive material is supported on the support member. The irradiation output power is controlled by a control unit which operates to vary the number of output pulses from the laser nozzle each time one hole is formed according to the result detected in response to variation in the thickness of the workpiece.

Apparatus for delivering laser energy to a remote location

Shaped-beam laser texturing of magnetic media

Aom modulation techniques for improving laser system performance

Method and apparatus of very much faster 3D printer

A 3D printer that is mostly twenty to thirty times faster than existing 3D printers. Pixel-based Raster images are converted into Scalable Vector Graphic (SVG) images, which are then categorized as lines, curves and surface areas. For each category, faster printing methods for printing with pre-formed shapes such as rods, boards, arcs, etc., are disclosed. Pre-formed shapes may be made of plastic/thermoplastic/polymer or sintering materials, as desired. Sintering materials may be cladded/coated with appropriate materials such as solder, copper, and thermoplastics. The new print-head, which has a fixed portion and a replaceable portion, has a mechanism to draw upon pre-formed shapes to print. The replaceable portion has varying shapes and sizes of placement holes, and a mechanism to signal which replaceable portion has been mounted. The print-head incorporates mechanisms to heat and tack the pre-formed shapes. The invention discloses methods to use multiple print-heads to further speed up ...

Real time target topography during laser processing

Laser engraver mirror adjustment system

PROCEDURE AND ARRANGEMENT FOR ALIGNING A LASER BEAM

SYSTEM AND ASSOCIATED PROCEDURE FOR CORRECTING A LASER BEAM DEFLECTING SYSTEM

SYSTEM AND PROCEDURE FOR OPTIMIZING THE INDICATION MARKING ACHIEVEMENT

PLANT AND PROCEDURE FOR THE LASER WELDING AS WELL AS LASER WELD

DEVICE FOR THE REMOTE WORKING ON OF WORKPIECES OF MEANS OF A LASER WORKING ON JET

PROCEDURE AND DEVICE FOR THE ROBOTUNTERSTÜTZTEN AND REMOTE CONTROLLED LASER WELDING WITH SIMPLIFIED CONTROL OF THE FOCUSING DIRECTION OF THE LASER BEAM

PROCEDURE FOR THE COMPENSATION OF POSITION DEVIATIONS OF A DIAL OR A SIGN RELATIVE TO INSCRIPTION EQUIPMENT

LASER PROCESSING MACHINE

NAHTVERFOLGUNGSSENSOR

PROCEDURE AND DEVICE FOR THE DETERMINATION OF A LATERAL RELATIVE MOTION BETWEEN A WORKING ON HEAD AND A WORKPIECE

MACHINE TOOL TO LASER CUTTINGS OF SHEET METAL AND PIPE MATERIALS WITH FIBER LASER FOR THE TRANSMISSION OF THE LASER BEAM

DEVICE FOR ENGRAVING

PROCEDURE FOR INTENDING a characteristic FOR the ACCURACY of SEAM DEPTH CONTROL

NOZZLE FOR LASER CUTTING MACHINE

Laser beam welding head, USE of THIS LASERSTRAHLSCHWEIßKOPFES AND PROCEDURE FOR the jet welding

PROCEDURE AND MECHANISM FOR ADJUSTMENT A WORKING ON POSITION

LASER BEAM PROCESSING PROCEDURE

DEVICE AS A CHECK OF THE ENERGY AND/OR THE POSITION OF A PULSED AND SCANNED LASER BEAM

PROCEDURE AND MECHANISM FOR ADJUSTMENT A WORKING ON POSITION

PROCEDURE FOR ADJUSTING THE REFERENCE SYSTEM IN GIANT BURST MODE OF A WORKING LASER APPARATUS.

PROCEDURE AND DEVICE FOR WORKING ON ARBITRARY ONE 3D-FORMFLÄCHEN of MEANS LASER

HYBRID WELDING METHOD WITH LASER AND ELECTRICAL ARC, IN PARTICULAR OF PASSENGER CAR WORKPIECES AND TUBES

DEVICE AND PROCEDURE FOR THE SURFACE STRUCTURING OF MOVED FLOOR COVERINGS

INTERFEROMETRIC MEASURING OF LASER ABLATION

SYSTEM AND PROCEDURE FOR OPTIMIZING THE INDICATION MARKING ACHIEVEMENT

SYSTEM AND PROCEDURE FOR OPTIMIZING THE INDICATION MARKING ACHIEVEMENT

SYSTEM AND PROCEDURE FOR OPTIMIZING THE INDICATION MARKING ACHIEVEMENT

SYSTEM AND PROCEDURE FOR OPTIMIZING THE INDICATION MARKING ACHIEVEMENT

SYSTEM AND PROCEDURE FOR OPTIMIZING THE INDICATION MARKING ACHIEVEMENT

SYSTEM AND PROCEDURE FOR OPTIMIZING THE INDICATION MARKING ACHIEVEMENT

SYSTEM AND PROCEDURE FOR OPTIMIZING THE INDICATION MARKING ACHIEVEMENT

SYSTEM AND PROCEDURE FOR OPTIMIZING THE INDICATION MARKING ACHIEVEMENT

SYSTEM AND PROCEDURE FOR OPTIMIZING THE INDICATION MARKING ACHIEVEMENT

SYSTEM AND PROCEDURE FOR OPTIMIZING THE INDICATION MARKING ACHIEVEMENT

SYSTEM AND PROCEDURE FOR OPTIMIZING THE INDICATION MARKING ACHIEVEMENT

Uv laser system and method for single pulse severing of ic fuses

PULSED HIGH ENERGY DENSITY WELDING

Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site

SYSTEM AND METHOD FOR MOVING A HIGH-POWER LASER BEAM FOCUS POINT

Device and method for processing material by means of focused electromagnetic radiation

The invention relates to a device for processing material (M) by means of focused electromagnetic radiation comprising: a source (10), which emits electromagnetic radiation (12), means (14, 16, 18, 22, 26) for directing the radiation at the material (M), means (28) for focusing the radiation on or in the material (M), an apparatus (20) for producing a pattern (32) in the beam path of the electromagnetic radiation, an at least partially reflective surface (30) in the beam path in front of the focus (F) of the focused radiation, wherein said pattern (32) is imaged on said at least partially reflective surface (30) by means of at least some of said means for directing the radiation and said means for focusing the radiation, at least one detector (D1, D2), onto which an image of the pattern (32) of said surface (30) is reflected and which produces electrical signals corresponding to said image, wherein the image contains a piece of information about the position of the focal point (F), a computer ...

METHOD FOR ALIGNING A SUBSTRATE ON A STAGE

METHOD AND APPARATUS FOR SPLITTING SEMICONDUCOR WAFER

Processing device and method for producing moving body

This processing device (1) comprises: a light irradiation device (11) that irradiates a surface of an object (S, SF) with processing light (EL); and a control device (18) that controls the light irradiation device by using information related to a characteristic of the surface of the object.

INTELLIGENT LASER JOINING HEAD

APPARATUS FOR THE SCANNING OF WORKING LEVELS

An apparatus for scanning the working level of a cutting tool relative to the surface of a workpiece and provided with a scanning arm adapted to move relative to the surface of the work piece and movable in response to an irregularity in the surface for opening a switch thereby to disconnect the cutting tool from a source of power.

DEVICE AND METHOD FOR MACHINING WORKPIECES

Should several simultaneously-operating, functional elements (2) be required on processing workpieces (10, 11), a particular support arrangement for the functional elements is thus required, in order to hold the above in the working position thereof, even in the case of curved machining paths. Said support arrangement comprises a base (12) with supports for the functional elements arranged thereon in adjustable positions. The supports are preferably in the form of ring structures (60) and the functional elements arranged in the inner volume thereof, whereby a drive mechanism works externally on the supports, to turn the same.

ADDITIVE MANUFACTURING APPARATUS WITH A CHAMBER AND A REMOVABLY-MOUNTABLE OPTICAL MODULE; METHOD OF PREPARING A LASER PROCESSING APPARATUS WITH SUCH REMOVABLY-MOUNTABLE OPTICAL MODULE

An additive manufacturing apparatus comprises a processing chamber (100) defining a window (110) for receiving a laser beam and an optical module (10) The optical module is removably-mountable to the processing chamber for delivering the laser beam through the window. The optical module contains optical components for focusing and steering the laser beam and a controlled atmosphere can be maintained within the module.

ADDITIVE MANUFACTURING APPARATUS WITH REMOVABLY-MOUNTABLE OPTICAL MODULE, AND CORRESPONDING OPTICAL MODULE MOUNTING METHOD

An additive manufacturing apparatus comprises a processing chamber (100) defining a window (110) for receiving a laser beam and an optical module (10) The optical module is removably-mountable to the processing chamber for delivering the laser beam through the window. The optical module contains optical components for focusing and steering the laser beam and a controlled atmosphere can be maintained within the module.

BEAM ALIGNMENT SYSTEM FOR LASER WELDING SYSTEM

Apparatus is disclosed for aligning a laser beam used to perform laser machining operations. The aligning apparatus of this invention is used with laser machining apparatus comprising a laser for emitting a laser beam along a path and a laser lens assembly disposed within the path and movable along an axis for variably focusing the laser beam at a plurality of different focal spot corresponding to the plurality of laser machining operations. The alignment apparatus takes the form of an adjustable mirror, which is disposed to intercept the laser beam and to align at least a portion of the path with the axis of the laser lens assembly, whereby the lateral displacement of each of said plurality of focal spots from the axis is reduced as the laser focusing assembly is moved along its axis.

LASER WELDING OF A SLEEVE WITHIN A TUBE

A METHOD FOR PRODUCING A TUBULAR FRAME

The method according to the invention makes it possible to produce actual cutting contours on tubes (R) with only rough tolerances, to which contours others of the tubes (R) can be joined and welded, wherein, as a result of the actual cutting contours being modified, the rough shape tolerance of the tubes (R) does not enter the tolerance chain, or enters the latter only a little, for the tubes (R) to be fully welded to form a tubular frame. It also allows the automated reception of only pre-oriented tubes (R) by a gripping arm and the infeed thereof to a laser cutting device.

PROCESSING APPARATUS, PROCESSING SYSTEM, AND MANUFACTURING METHOD OF MOVABLE BODY

This processing device (1) comprises: a light irradiation device (11) that irradiates a surface of an object (S, SF) with processing light (EL); and a measurement device (71i, 71j) that measures a position, relative to the object, of an irradiation region (EA) formed on the surface of the object by the light irradiation device.

AUTOMATIC CALIBRATION FOR A ROBOT OPTICAL SENSOR

Systems and methods are provided for automatic intrinsic and extrinsic calibration for a robot optical sensor. An implementation includes an optical sensor; a robot arm; a calibration chart; one or more processors; and a memory storing instructions that cause the one or more processors to perform operations that includes: determining a set of poses for calibrating the first optical sensor; generating, based at least on the set of poses, pose data comprising three dimensional (3D) position and orientation data; moving, based at least on the pose data, the robot arm into a plurality of poses; at each pose of the plurality of poses, capturing a set of images of the calibration chart with the first optical sensor and recording a pose; calculating intrinsic calibration parameters, based at least on the set of captured images; and calculating extrinsic calibration parameters, based at least on the set of captured images.

UV LASER SYSTEM AND METHOD FOR SINGLE PULSE SEVERING OF IC FUSES

A Q-switched, diode-pumped, solid-state (DPSS) laser (54) employs harmonic generation through nonlinear crystals (72) to generate UV light (74) for both link processing and target alignment. The type and geometry of the nonlinear crystals (72) are selected, and their temperatures are precisely controlled, to produce focused spot sizes with excellent beam quality for severing of IC fuses. A fraction of the laser output (56) can be utilized in a secondary target alignment system (50). An imaging optics module (52) may be employed to further enhance the shape quality of either or both of the secondary and primary beams. Each beam passes through a detection module (100) that measures the incident and reflected light. The two beams pass through a common combiner to facilitate calibration and alignment of the beams and subsequent link processing.

SYSTEM AND METHOD OF MACHINING OBJECTS USING A LASER

La présente invention concerne un système d'usinage d'objets (11) à l'aide d'un laser, qui comprend :- une alimentation d'objets,- un plateau (10) support d'objets,- une tête galvanométrique (12) comportant : une première caméra grand champ (13), en sortie de laquelle est disposé un premier filtre (15), une seconde caméra petit champ (16), en sortie de laquelle est disposé un second filtre (18), un miroir de guidage (20), des miroirs de guidage (21, 22), une lentille (23) qui permet de visualiser au moins un objet (11), ou la partie à usiner, situé sur le plateau (10),- une source laser (24),- un calculateur (25) muni d'un logiciel de reconnaissance de forme (26).

MACHINE TOOL FOR LASER CUTTING OF SHEET AND PIPE MATERIALS USING A OPTICAL FIBRE FOR TRANSMITTING THE LASER BEAM

METHOD FOR REMOVING COATING MATERIAL FROM A COOLING HOLE OF A GAS TURBINE ENGINE COMPONENT

METHOD AND SYSTEM FOR DETERMINING THE POSITION AND ALIGNMENT OF A SURFACE OF AN OBJECT IN RELATION TO A LASER BEAM

... ²²²The present invention generally relates to a method and system for determining ²the position and alignment of a plane in relation to an intersecting axis and ²using that known position and alignment to allow for corrections to be made ²when using the plane as a reference plane. More particularly, the invention ²relates to a method and system for determining the angle of tilt of a planar ²surface in relation to a laser beam, and using the determined angle of tilt to ²calculate a correction factor to be applied to the laser beam. Briefly stated, ²the method and system ultimately calculates a correction factor, z-offset, ²that is applied when using the laser beam in a procedure.² ...

RADIATION BEAM POSITION SENSOR

An apparatus for detecting the position of a primary beam of electromagnetic radiation, the apparatus including a leaky mirror for reflecting the primary beam and for extracting from the primary beam a secondary team and a position sensitive detector for detecting the spatial position of the secondary beam, wherein the leaky mirror comprises a material which has a transmissivity of less than 0.2 for the radiation of the primary beam and the position sensitive detector is arranged in the path of the secondary beam after transmission by the leaky mirror, the position of the secondary beam providing a measure of the position of the primary beam.

DEVICE FOR HOLDING A PART AND APPLICATION OF THE DEVICE

A device for holding a part comprises a retainer member provided for applyi ng and holding the part and having a convexly spherical surface section which i s received in a concavely spherical surface section of a receptacle member. To enable moveme nt of the spherical surface sections relative to one another, the device includes an arrangement for forming a temporary friction-free air bearing between the two surface sections, whic h can be removed once the surfaces of the two parts have been brought into the desired alignment and engagement to fix the receptacle and retainer members in position.

Aufzeichnungsgerät mit Regeleinrichtung zur Stabilisierung der Brennflecklage eines optischen Linsensystems

Vorrichtung zur Erfassung der Lage des Schweisspunktes und des Schweissstosses zu schweissender Materialien

Laser processing method and laser processing apparatus

The present disclosure relates to laser processing and a laser processing apparatus for processing materials using laser. Processing performed after loading a wafer on a work stage and a laser processing apparatus for implementing such processing, among others, are disclosed. The laser processing includes loading a wafer on a work stage; determining the number of chips formed on the wafer loaded on the work stage, performing chip defect inspection and aligning the wafer while moving the work stage; measuring a height of a surface of the wafer loaded on the work stage using a displacement sensor; monitoring output power of a processing laser using a power meter; and shifting the work stage while irradiating a laser beam on the wafer to process the wafer.

Apparatus and method for laser scribing

Provided is an apparatus for laser scribing. The laser scribing apparatus may include: a first laser emitter to emit a laser for a thickness measurement while moving towards a first axial direction of a substrate where a plurality of light emitting devices is formed; a laser receiver to receive a reflected laser when the laser emitted from the first laser emitter is reflected from the substrate; a thickness measurement unit to measure a thickness of the substrate based on a strength of the leaser received by the laser receiver; and a second laser emitter to generate a scribing line on the substrate by emitting a laser towards a first axial direction and a second axial direction of the substrate while adjusting a laser emission location based on the measured thickness.

Method and System for Mitigation of Particulate Inclusions in Optical Materials

A method of fabricating an optical material includes providing input materials having a material softening temperature, melting the input materials, and flowing the melted input materials into a laser inclusion mitigation system. The melted input materials comprise one or more inclusions. The method also includes irradiating the input materials using a laser beam, fragmenting the one or more inclusions in response to the irradiating, and reducing a temperature of the input materials to less than the material softening temperature. The method further includes forming an optical material and annealing the optical material.

Laser engraver capable of automatic defocusing

A laser engraver capable of automatic defocusing is provided, which includes a control end and a device end. The control end includes a data processing module, in which the data processing module is used for a user to set a defocusing distance and select a processing mode by a user, so as to define and set parameters, and form an operation signal. The device end includes a control module and a laser output module, in which the control module is used for receiving the operation signal and controlling the laser output module to change a focal distance according to the operation signal, so as to form the automatic defocusing.

Method and apparatus for forming the separating lines of a photovoltaic module with series-connected cells

For forming the separating lines, ( 5, 6, 7 ) which are produced in the functional layers ( 2, 3, 4 ) deposited on a transparent substrate ( 1 ) during manufacture of a photovoltaic module with series-connected cells (C 1 , C 2 , . . . ), there are used laser scanners ( 8 ) whose laser beam ( 14 ) produces in the field ( 17 ) scanned thereby a plurality of adjacent separating line sections ( 18 ) in the functional layer ( 2, 3, 4 ). The laser scanners ( 8 ) are then moved relative to the coated substrate ( 1 ) in the direction (Y) of the separating lines ( 5, 6, 7 ) by a distance corresponding at the most to the length (L) of the scanned field ( 17 ) to thereby form continuous separating lines ( 5, 6, 7 ) through mutually flush separating line sections ( 18 ).

Scanned laser light source

The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

Method and device for welding parts with spot contact or short line contact in the joining region and joining device

Parts are welded by way of a laser beam, wherein the parts are oriented and fixed relative to each other, a laser beam is introduced into an upper part from above and centered relative to a joint point and fuses only the inner region directly above the joint point, while the upper part and the lower part are pressed against each other and therefore move toward one another, wherein the fused region of the upper part penetrates the material of the particular lower part, which has likewise fused in the meantime. Laser welding makes it possible to weld the parts so as to form products having nearly any type of geometry with much less effort than with resistance welding or capacitor discharge welding. The welding device needs only hold and fix the parts to be welded, and apply the slight surface pressure required.

Laser processing method and laser processing device

A laser processing method for forming a modification region serving as a starting point of cutting inside a member to be cut along a planned cutting line by relatively moving an optical axis of a condenser lens along the planned cutting line of the member and by irradiating the member with focused laser light, wherein a plurality of cross-sectional focused spots is simultaneously formed on a section which is perpendicular to the optical axis of the condenser lens at positions having a predetermined depth from a surface of the member and which is parallel to the surface and, at that time, at least one cross-sectional focused spot of the plurality of cross-sectional focused spots is formed on a projection line of the planned cutting line onto the cross section to form one or more inside modification regions having a desired shape.

Laser match honing system and method

A laser match honing system and method are provided for processing one of a pair of mechanically matching components ( 1, 2 ) having matching portions ( 12, 22, 16, 26 ) that will be fitted with each other. A dimension of the matching portion ( 12, 16 ) of the first component ( 1 ) is measured and is then used for calculating the desired dimension of the corresponding matching portion ( 22, 26 ) of the second component ( 2 ). An actual dimension of the matching portion ( 22, 26 ) of the second component ( 2 ) is also measured. Then, the matching portion ( 22, 26 ) of the second component ( 2 ) is honed by laser beam in the condition that the actual dimension is not equal to the desired dimension.

Assembly for Precision Datum Alignment and Method of Use

A calibration assembly has a base and mounting elements to mount the base to a laser. The base has a front, middle and rear portions that are used to align the calibration assembly to the laser to cleave optical fibers with the laser. The front portion has a channel to receive the optical fibers, the middle portion has openings to confirm alignment of the laser; and the rear portion has a rear opening used to adjust the pitch and roll of the laser.

METHOD AND DEVICE FOR LASER-JOINING SHEET METAL PARTS

The invention relates to a device and to an associated method for joining sheet metal parts, each with a flange, by laser, wherein the flanges of the sheet metal parts () are joined into one connecting flange. The device has a clamping device () for clamping the sheet metal parts () to be joined in a main clamping direction running transversely to the connecting flange and a beam guidance system for a laser beam (). Moreover, the device has a compensation shaft () which tracks the laser beam () according to a relative movement between the connecting flange and a guidance apparatus. 1. A device for joining sheet metal parts each with a flange , by laser , wherein the flanges of the sheet metal parts are joined into one connecting flange , in which the flanges of the sheets to be joined abut flat against each other and thus form a joint with a flange planewherein the device has clamping device to clamp the sheet metal parts to be joined in a main clamping direction running transversely to the connecting flange and a beam guidance system for a laser beam which is designed to route a laser beam substantially parallel to the connecting flange and transverse to the clamping direction to a front side of at least one of the flanges of the sheet metal parts to be joined,whereinthe device further comprises a compensation shaft which, when the device is connected to a guidance apparatus, tracks the laser beam according to a relative motion between the connecting flange and the guidance apparatuscharacterized in that the beam guidance system has at least one optical element with which a beam angle at which the laser beam runs on a plane perpendicular to the main clamping direction is to be influenced in such a way that switching between different beam angles is possible in the area of a possible processing point such that in each instance a lateral angle is produced away from a sheet part projecting beyond the joint andthat the device has an apparatus for monitoring the ...

HIGH-POWER LASER FOCUSING APPARATUS WITH PRESSURIZED HOUSING AND AERODYNAMIC WINDOW

A high-powered laser beam focusing apparatus for use in laser welding applications that includes a laser having a beam delivery fiber for generating a laser beam and a housing adapted to receive the beam delivery fiber. The housing further includes a first internal chamber adapted to receive a flow of pressurized gas; a second internal chamber; and an aerodynamic window positioned between the first chamber and the second chamber. 1. A high-powered laser beam focusing apparatus , comprising;(a) a laser beam delivery fiber for transmitting a laser beam; (i) a first chamber, wherein the first chamber is adapted to receive a flow of pressurized gas;', '(ii) a second chamber; and', '(iii) an aerodynamic window positioned between the first chamber and the second chamber., '(b) a housing adapted to receive the beam delivery fiber, wherein the housing further includes2. The apparatus of claim 1 , further comprising a focusing optic connected to the housing and facing into the first chamber claim 1 , wherein the focusing optic is operative to receive claim 1 , focus claim 1 , and redirect the laser beam into the aerodynamic window.3. The apparatus of claim 2 , further comprising a reimaging optic connected to the housing and facing into the second chamber claim 2 , wherein the reimaging optic is operative to receive the laser beam exiting the aerodynamic window and reimage and redirect the laser beam onto a work surface.4. The apparatus of claim 3 , further comprising a source of pressurized gas connected to the first chamber claim 3 , wherein the flow of gas into the first chamber and the geometric characteristics of the aerodynamic window are operative to prevent debris generated at the work surface from passing through the aerodynamic window and entering the first chamber.5. The apparatus of claim 1 , wherein the laser is a high-power YAG laser claim 1 , fiber laser claim 1 , or disk laser.6. The apparatus of claim 2 , wherein the focusing optic is an asymmetric asphere ...

LASER PROCESSING MACHINE

A processing machine includes mirrors and to reflect a beam L oscillated from a laser oscillator to a predetermined surface on which a workpiece is arranged, optical axis operating mechanisms and to position an optical axis of the beam L at a desired target irradiation position by changing directions of the mirrors and, a camera sensor to capture an image of the target irradiation position and its periphery reflected in the mirror, and an error calibration mechanism to detect an error between the target irradiation position instructed to the optical axis operating mechanisms and an actual position of the optical axis of the beam L in the predetermined surface by referring to the image captured by the camera sensor. A correction amount to the optical axis operating mechanisms and is determined based on the error to irradiate the target irradiation position with the beam L during processing. 1. A laser processing machine to apply processing by irradiating a workpiece with a laser beam , comprising:a mirror to reflect the laser beam oscillated from a laser oscillator to a predetermined surface on which the workpiece is arranged;an optical axis operating mechanism to position an optical axis of the laser beam at a desired target irradiation position in the predetermined surface by changing a direction of the mirror;a camera sensor to capture an image of the target irradiation position and its periphery in the predetermined surface reflected in the mirror; andan error calibration mechanism to detect an error between the target irradiation position instructed to the optical axis operating mechanism and an actual position of the optical axis of the laser beam in the predetermined surface, by referring to the image captured by the camera sensor,wherein a correction amount to be instructed to the optical axis operating mechanism can be determined based on the error in order to irradiate the target irradiation position with the laser beam during processing.2. A laser ...

Laser machining head

The invention relates to a laser machining head for a laser machining machine, comprising a mount ( 2 ) for a sensor part ( 3 ) formed from electrically conductive material, an outer insulation part ( 4 ) made from electrically insulating material, preferably made from plastic, for electrical shielding and an inner insulation part ( 5 ) inserted within the outer insulation part ( 4 ) as radiation shield, wherein the inner insulation part ( 5 ) is formed from metal and is electrically insulated from the sensor part ( 3 ).

Device and Method for Joining Workpieces by Means of a Laser Beam and Movable Pressing Element

The invention relates to a method and a device for joining workpieces by means of a laser beam, wherein the device comprises: a scanner optics for guiding the laser beam; a press element, which, during the joining process, is pressed along a pressing direction onto at least one of the workpieces; and a housing, which houses the scanner optics and the laser beam running from the scanner optics towards the workpieces, wherein the press element forms a part of the housing and is movable relative to the rest of the housing by at least one degree of movement freedom. 11357. A laser welding device () for joining workpieces ( , ) by means of a laser beam () , comprising:{'b': 9', '7, 'a scanner optics () for guiding the laser beam (),'}{'b': 13', '15', '3', '3', '5, 'a press element (,), which, during the joining process, is pressed along a pressing direction onto at least one of the workpieces () in order to fix the workpieces (, ),'}{'b': 27', '9', '7', '3', '5, 'a housing (), which houses the scanner optics () and the laser beam () running from the scanner optics towards the workpieces (, ),'}{'b': 13', '15', '27, 'wherein the press element (, ) forms a part of the housing () and is movable relative to the rest of the housing by at least one degree of movement freedom.'}29337. The laser welding device according to claim 1 , wherein the e scanner optics () comprises at least one movable scanner mirror () for guiding the laser beam ().35150. The laser welding device according to claim 1 , wherein the press element () is mounted on the rest of the housing pivotably about an axis running substantially perpendicularly with respect to the pressing direction ().41315. The laser welding device according to claim 1 , wherein the press element ( claim 1 , ) is mounted on the rest of the housing so as to be movable along the pressing direction.55153. The laser welding device according to claim 1 , wherein the press element () comprises a press portion () made of a flexible ...

Laser marking

A method and apparatus is disclosed for producing precision marks for a metrological scale in the form of a stainless steel ribbon. A laser is used to produce ultra-short pulses which have a fluence at the ribbon such that ablation takes place. The laser light can be scanned via scanner and the pitch of the marks can be controlled. The ablative technique causes little thermal input and improves the accuracy of the scale.

ACOUSTO-OPTIC DEFLECTOR APPLICATIONS IN LASER PROCESSING OF DIELECTRIC OR OTHER MATERIALS

A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem to effectively widen a laser beam spot along a direction perpendicular to the processing trajectory. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction to selectively shape the feature in the dither direction. The shaping may be used to intersect features on the workpiece. The AOD subsystem may also provide rastering, galvo error position correction, power modulation, and/or through-the-lens viewing of and alignment to the workpiece. 1. A method for dithering a laser beam to process features in a workpiece , the method comprising:imparting, using a first positioning system, first relative movement of a laser beam spot position along a processing trajectory;imparting, using a second positioning system, second relative movement of the laser beam spot position along a dither direction relative to the processing trajectory, wherein the second relative movement is superimposed on the first relative movement, and wherein the second relative movement is at a substantially higher velocity than that of the first relative movement;amplitude modulating, using the second positioning system, a laser beam based on a specific feature characteristic at one or more corresponding target locations on the workpiece; andemitting the laser beam to the workpiece during the second relative movement to effectively widen a laser beam spot at the workpiece in the dither direction.2. The method of claim 1 , further comprising:controlling one or more acousto-optic ...

Laser processing machine, in particular laser cutting machine, and method for centering a laser beam, in particular a focused laser beam

Laser processing machines (LM), in particular laser cutting machines with long-wave laser radiation (in particular CO 2 laser), including at least one laser processing head ( 1 ), having interior ( 2 ) and nozzle ( 3 ) with nozzle orifice ( 4 ) for allowing a primary beam ( 5 ), in particular a focused laser working beam, to pass through and onto a work piece ( 6 ) and to align a gas current enveloping the beam, and an alignment device ( 15 ) with several sensors ( 13 ) for centering the primary beam ( 5 ), in particular a focused laser working beam, and the nozzle orifice ( 4 ) relative to each other. At least one conversion unit ( 9 ), in particular a conversion edge, is provided in the area of the nozzle orifice ( 4 ) for converting the primary beam ( 5 ) contacting it or impacting on it into one or more secondary electromagnetic heat beams ( 10 ) along at least one propagation direction ( 10 A) in direction of the sensors ( 13 ). The sensors ( 13 ) are configured as radiation sensors and arranged in the interior ( 2 ) of the laser processing head ( 1 ) or the nozzle ( 3 ).

OPTICAL SCANNING DEVICE AND LASER MACHINING DEVICE

An optical scanning device includes: a light projector configured to radiate light while causing the light to make angular movement at a constant speed; and a light reflector configured to reflect the light radiated from the light projector to guide the light to an intended irradiated point on a predetermined scanning line. The light reflector includes a plurality of reflecting portions and reflects, at least twice, the light radiated from the light projector to guide the light to the intended irradiated point. The reflecting portions each include a plurality of reflecting surfaces. A length of an optical path from the light projector to the irradiated point is substantially constant for all of irradiated points on the scanning line, and a scanning speed, on the scanning line, of the light radiated from the light projector is substantially constant. 1. An optical scanning device comprising:a light projector configured to radiate light while causing the light to make angular movement at a constant speed; anda light reflector configured to reflect the light radiated from the light projector to guide the light to an intended irradiated point on a predetermined scanning line, whereinthe light reflector includes a plurality of reflecting portions and reflects, at least twice, the light radiated from the light projector to guide the light to the intended irradiated point, the reflecting portions each including a plurality of reflecting surfaces, anda length of an optical path from the light projector to the irradiated point is substantially constant for all of irradiated points on the scanning line, and a scanning speed, on the scanning line, of the light radiated from the light projector is substantially constant.2. The optical scanning device according to claim 1 , wherein at least one of the reflecting surfaces is a flat surface.3. The optical scanning device according to claim 1 , wherein the light projector includes a rotating multifaceted mirror configured to rotate ...

FEMTOSESCOND LASER SYSTEM FOR THE EXACT MANIPULATION OF MATERIAL AND TISSUES

A device for the exact manipulation of material, especially of organic material, includes a pulsed laser system with a radiation source, said radiation source being a cavity-dumped fs oscillator. 1. A device for precise machining of a material , comprising:a pulsed laser system having a beam source,wherein the beam source includes a cavity-dumped fs oscillator.2. The device as recited in claim 1 , wherein the material is an organic material.3. The device as recited in claim 1 , further comprising a beam apparatus for at least one of a beam formation claim 1 , a beam guidance claim 1 , a beam deflection and a beam focussing.4. The device as recited in claim 3 , wherein the beam apparatus is programmable.5. The device as recited in claim 1 , further comprising a holding device configured to one of position and fix the material.6. The device as recited in claim 1 , wherein the cavity-dumped fs oscillator is configured to provide laser pulses having a pulse energy of 100 nJ to 100 μJ.7. The device as recited in claim 6 , wherein the pulse energy is 1 μJ.8. The device as recited in claim 1 , wherein the cavity-dumped fs oscillator is configured to provide laser pulses with repetition rates from 10 kHz to 10 MHz.9. The device as recited in claim 1 , wherein the beam apparatus is configured to apply a working beam of the beam source to the material in a geometrically predeterminable form and in a chronologically predeterminable course.10. The device as recited in claim 9 , wherein the beam apparatus includes a beam deflection device and wherein the a repetition rate of the working beam is changeable during application of the working beam to the material.11. A method for applying a laser beam to a material claim 9 , the method comprising:providing a laser beam having fs pulses using a cavity-dumped fs oscillator beam source;directing the laser beam on the material so as to destroy a cohesion of the material in a focus of the laser beam using photodismption.12. The method as ...

Laser processing method and device

A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided. This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S 11 and S 12 ) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S 13 and S 14 ) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.

APPARATUS AND METHOD FOR MONITORING LASER WELDING BEAD

An apparatus for monitoring a laser welding bead irradiates a laser to a surface of a welding bead when welding with a laser welding machine, collects a signal reflected from the surface of the welding bead as an image signal, and then extracts at least one feature variable of a bead shape using the collected image signal. Then, the apparatus for monitoring the laser welding bead determines welding defects using the at least one feature variable, and controls an operation of the laser welding machine according to whether or not the welding defects are generated. 1. An apparatus for monitoring a welding bead generated by welding of a laser welding machine , the apparatus comprising:a vision sensor part irradiating a laser to a surface of the welding bead and collecting a signal reflected from the surface of the welding bead as an image signal; anda terminal part measuring a bead shape from the collected image signal, extracting at least one feature variable from the bead shape, determining welding defects using the at least one feature variable, and classifying defective forms at the time of determining the welding defects.2. The apparatus of claim 1 , wherein claim 1 ,when the terminal part determines normal welding, the terminal part instructs the laser welding machine to perform welding at a next position.3. The apparatus of claim 1 , wherein claim 1 ,when the terminal part determines the welding defects, the terminal part instructs the laser welding machine to perform welding at a next position or stop the welding according to a selection of a user.4. The apparatus of claim 1 , whereinthe vision sensor part includes:a laser scan camera including a charge-coupled device (CCD) sensor converting the signal reflected from the surface of the welding bead into an image signal; anda telecentric lens passing only a signal parallel to an optical axis among the signals reflected from the surface of the welding bead to the laser scan camera.5. The apparatus of claim 1 , ...

Laser processing apparatus

The present disclosure provides a laser processing apparatus. A laser processing apparatus includes a laser generator, a laser amplifier, a chromatic dispersion tuner and an optical focusing unit. The laser generator is configured to generate ultrashort pulse laser having chirp characteristics by simultaneously generating a plurality of wavelengths. The laser amplifier is configured to amplify the laser generated by the laser generator. The chromatic dispersion tuner is configured to adjust chirp and pulse width of the laser output from the laser amplifier. The optical focusing unit is configured to irradiate a workpiece with the laser after adjusting the depth of focus of the laser with the chirp and the pulse width adjusted by the chromatic dispersion tuner.

HANDHELD PULSED LASER DEVICE FOR CLEANING OR TREATING A SURFACE

The present invention relates to a handheld pulsed laser device for cleaning or treating a surface, comprising a laser source, a focal distance adjuster and a beam deflector. The laser source is configured to emit a pulsed laser beam and the focal distance adjuster, is configured to change a focal distance of the beam. The beam deflector may comprise at least one movable mirror onto which the beam is deflected, wherein the deflector is configured to deflect the beam to scan the beam along the surface. 1. A handheld pulsed laser device for cleaning or treating a surface , comprising:a laser source, configured to emit a pulsed laser beam;a focal distance adjuster, configured to change a focal distance of the beam, and;a beam deflector, configured to deflect the beam to scan the beam along the surface;at least one sensor, configured to provide a sensor signal, representative for of a parameter that is related to a characteristic of the surface; anda control unit, configured to control the beam deflector to scan the beam along the surface in an, at least, two-dimensional pattern, based on the sensor signal.2. The pulsed laser device according to claim 1 , wherein the pattern of the beam comprises an outer contour and wherein the outer contour is filled-up by the beam with a back-and-forth scanning movement within the outer contour.3. The pulsed laser device according to claim 2 , wherein the back-and-forth scanning movement is superpositioned with a sinusoidal pattern.4. The pulsed laser device according to claim 2 , wherein the back-and-forth scanning movement is superpositioned with a spiral pattern.5. The pulsed laser device according to claim 1 , wherein the beam deflector comprises at least one mirror claim 1 , which is tiltable around at least one perpendicular axis.6. The pulsed laser device according to claim 1 , wherein the focal distance adjuster comprises a movable lens element and a piezo-element claim 1 , which is configured move the movable lens element to ...

LASER PROCESSING SYSTEM

There is provided a laser processing system including: a robot; a laser emission section provided on the robot; an irradiation path calculation section configured to calculate an irradiation path of a laser beam emitted from the laser emission section using information on a position of the robot; a determination section configured to determine whether the irradiation path calculated passes through an allowable irradiation region that is predetermined; and a laser-output reduction section configured to reduce output of the laser beam to be emitted to the irradiation path to a second output lower than a first output for processing in accordance with a determination by the determination section that the irradiation path does not pass through the allowable irradiation region. 1. A laser processing system comprising:a robot;a laser emission section provided on the robot;an irradiation path calculation section configured to calculate an irradiation path of a laser beam emitted from the laser emission section using information on a position of the robot;a determination section configured to determine whether the irradiation path calculated passes through an allowable irradiation region that is predetermined; anda laser-output reduction section configured to reduce output of the laser beam to be emitted to the irradiation path to a second output lower than a first output for processing in accordance with a determination by the determination section that the irradiation path does not pass through the allowable irradiation region.2. The laser processing system according to claim 1 , whereinthe laser emission section includes a scanner configured to perform scan operation, andthe irradiation path calculation section calculates the irradiation path further using information on a position of the scan operation of the scanner.3. The laser processing system according to claim 2 , whereinthe scanner includes a mirror configured to perform the scan operation and a motor configured ...

Machining Head for a Laser Machining Device

A processing head for a laser processing device adapted for processing a workpiece using laser radiation has: adjustable focusing optics to focus laser radiation in a focal spot having an adjustable distance from the processing head; an optical coherence tomograph to measure a distance between the processing head and the workpiece by measuring an optical interference between measuring light reflected by the workpiece and measuring light not reflected by the workpiece; a path length modulator that can change, synchronously with and dependent on a change of the focal spot distance from the processing head, an optical path length in an optical path along which measuring light propagates; a scanning device, which deflects the laser radiation in different directions; and a control device, which i) controls a focal length of the focusing optics in such a way that the focal spot is situated at a desired location on the workpiece, ii) receives, from the coherence tomograph, information representing the distance between the processing head and the workpiece, and iii) uses information received from the coherence tomograph for a continuous correction of a positioning of the focal spot on the workpiece. 1. A processing head for a laser processing device adapted for the processing of a workpiece using laser radiation , wherein the processing head comprises;adjustable focusing optics configured to focus the laser radiation in a focal spot having an adjustable distance from the processing head;an optical coherence tomograph configured to measure a distance between the processing head and the workpiece by measuring an optical interference between measuring light, which was reflected by the workpiece, and measuring light, which was not reflected by the workpiece;a path length modulator that is configured to change, synchronously with and dependent on a change of the distance of the focal spot from the processing head, an optical path length in an optical path along which measuring ...

CALIBRATION TEST PIECE FOR GALVANOMETRIC LASER CALIBRATION

Some embodiments may include a galvanometric laser system, comprising: a laser device to generate a laser beam; an X-Y scan head module to position the laser beam on a work piece, the X-Y scan head module including a laser ingress to receive the laser beam and a laser egress to output the laser beam; a support platen located below the laser egress; an in-machine imaging system integrated with the galvanometric laser, wherein a camera of the in-machine imaging system is arranged to view a surface of an object located on the support platen using one or more optical components of the X-Y scan head module to generate assessment data associated with a calibration of the X-Y scan head module by imaging the surface of the object, wherein a calibration fiducial is located on the surface of the object. 1. A galvanometric laser system , comprising:a laser device to generate a laser beam;an X-Y scan head module to position the laser beam on a work piece, the X-Y scan head module including a laser ingress to receive the laser beam and a laser egress to output the laser beam;a support platen located below the laser egress and arranged to receive a work piece;an in-machine imaging system integrated with the galvanometric laser, wherein a camera of the in-machine imaging system is arranged to use one or more optical components of the X-Y scan head module to view an object located on the support platen; anda calibration test piece to place on the support platen during a calibration routine prior to positioning the laser beam on the work piece, the calibration test piece with a planar surface including a calibration fiducial usable by the camera to generate calibration data associated with a calibration of the X-Y scan head module.2. The galvanometric laser system of claim 1 , further comprising a selective optic located between the laser ingress and the laser device claim 1 , the selective optic being optically transmissive to the laser beam and optically non-transmissive to light ...

LASER PROCESSING APPARATUS

Disclosed herein is a laser processing apparatus that includes a laser generation unit configured to generate a laser beam to process a workpiece, a first fluid jet generation unit configured to generate and inject a first fluid jet to deliver the laser beam to the workpiece, and a second fluid jet generation unit configured to inject a second fluid jet around the laser beam, wherein the first and second fluid jets are simultaneously or selectively injected. 1. A laser processing apparatus , comprising:a laser generation unit configured to generate a laser beam to process a workpiece;a first fluid jet generation unit configured to generate and inject a first fluid jet into a first fluid to deliver the laser to the workpiece;a second fluid jet generation unit configured to inject a second fluid jet to a second fluid around the laser beam; andan assist injection unit configured to inject an assist fluid to the workpiece,wherein the first fluid of the first fluid jet and the assist fluid of the assist injection unit are supplied by the same pump, respectively, as the same fluid.2. The laser processing apparatus according to claim 1 , wherein the first fluid jet is a liquid claim 1 , and the second fluid jet is a gas.3. The laser processing apparatus according to claim 1 , wherein one of the first and second fluid jets is water claim 1 , and the other is a liquid containing water.4. The laser processing apparatus according to claim 1 , wherein the first fluid jet generation unit comprises:a first fluid chamber configured to accommodate a first fluid for generating the first fluid jet;a water supply section configured to supply the first fluid to the first fluid chamber; anda nozzle configured to inject the first fluid in the first fluid chamber to the workpiece.5. The laser processing apparatus according to claim 1 , wherein the second fluid jet generation unit comprises:a second fluid chamber configured to accommodate a second fluid;a second fluid supply section ...

Systems and methods for use in welding pipe segments of a pipeline

A system for welding two pipes includes a first pipe clamp, a second pipe clamp, a weld torch, an inspection detector, a motor, one or more processors, and a grinder. The weld torch is configured to create a weld joint between the pipes at an interface region between the pipes. The inspection detector is configured to emit an inspection beam of radiation. The motor is operatively associated with the inspection detector to direct the inspection beam of radiation along the weld joint between the pipes. The one or more processors are operatively associated with the inspection detector to determine a profile of the weld joint between the pipes. The grinder is configured to grind at least a portion of the weld joint between the pipes based on the profile of the weld joint between the pipes.

Method for producing a pre-coated metal sheet

This method for preparing a pre-coated metal sheet for welding thereof to another pre-coated metal sheet, containing the following successive steps: 133-. (canceled)34. A method for preparing a pre-coated metal sheet for welding thereof to another pre-coated metal sheet , comprising the following successive steps:providing a pre-coated metal sheet comprising a metal substrate provided, on at least one of its faces, with a pre-coating layer, thenremoving, on at least one face of said pre-coated metal sheet, at least part of said pre-coating layer so as to form a removal zone, said removal being done by an impact of a laser beam on said pre-coating layer, the removal step comprising, over the course of the removal, the relative displacement of said laser beam with respect to the metal sheet in a direction of advance,wherein during the removal, the laser beam is inclined relative to the face of the metal sheet such that the orthogonal projection of the laser beam on said face of the metal sheet is located in the zone of the metal sheet in which the removal has already been done, and wherein the laser beam forms an angle of inclination comprised between 12° and 50° with the direction normal to the face of the metal sheet.35. The method according to claim 34 , wherein the pre-coating layer is a layer of aluminum claim 34 , an aluminum-based layer or a layer of aluminum alloy.36. The method according to claim 34 , wherein the pre-coating layer is a layer of aluminum alloy further comprising silicon.37. The method according to claim 34 , wherein the angle of inclination of the laser beam is comprised between 15° and 45°.38. The method according to claim 34 , wherein the angle of inclination of the laser beam is comprised between 20° and 40°.39. The method according to claim 34 , wherein the angle of inclination of the laser beam is comprised between 25° and 40°.40. The method according to claim 34 , wherein the angle of inclination of the laser beam is comprised between 25 ...

LASER MACHINING DEVICE

A laser processing apparatus includes a support portion, a first laser processing head, a second laser processing head, a first vertical movement mechanism, a second vertical movement mechanism, a first horizontal movement mechanism, a second horizontal movement mechanism, and a controller configured to control rotation of the support portion, emission of a first and a second laser lights from the first and the second laser processing heads, and movement of a first and a second focusing points. 1. A laser processing apparatus comprising:a support portion on which a target is placed, the support portion being rotatable about an axis along a vertical direction;a first laser processing head configured to irradiate the target placed on the support portion with a first laser light to form a first modified region in the target;a second laser processing head configured to irradiate the target placed on the support portion with a second laser light to form a second modified region in the target;a first vertical movement mechanism configured to move at least one of the support portion and the first laser processing head to make a first focusing point move along the vertical direction, the first focusing point being a focusing point of the first laser light;a second vertical movement mechanism configured to move at least one of the support portion and the second laser processing head to make a second focusing point move along the vertical direction, the second focusing point being a focusing point of the second laser light;a first horizontal movement mechanism configured to move at least one of the support portion and the first laser processing head to make the first focusing point move in a horizontal direction;a second horizontal movement mechanism configured to move at least one of the support portion and the second laser processing head to make the second focusing point move along the horizontal direction; anda controller configured to control rotation of the support ...

LASER MACHINING DEVICE AND LASER MACHINING METHOD

Provided are a laser machining device and a laser machining method capable of stably operating an autofocus function without causing an unfavorable state such as an overshoot etc. A laser machining device and a laser machining method of the present invention performs a normal AF (autofocus) control when a scan position of the machining laser light and the detecting laser light is located in a work central portion, and performs a slow-tracking AF (autofocus) control with a trackability to a displacement of a main surface of a work reduced to be lower than a trackability of the normal AF control when the scan position of the machining laser light and the detecting laser light is located in a work end portion. 1. A laser machining device which condenses a machining laser light inside a work to form a modified region inside the work along a planned dividing line , the laser machining device comprising:a condensing lens configured to condense the machining laser light and a detecting laser light toward the work;a scanner configured to relatively move the condensing lens and the work in a direction orthogonal to an optical axis direction of the condensing lens, to scan the machining laser light and the detecting laser light over the work;an adjuster configured to adjust a distance between the condensing lens and the work;a detector configured to detect a reflected light to output a detection signal according to a height of a main surface of the work, the reflected light being the detecting laser light reflected on the main surface of the work;a first controller configured to control, based on the detection signal output by the detector, the adjuster so as to cause a light condensing point of the detecting laser light to track a displacement of the main surface of the work, in case where a scan position of the machining laser light and the detecting laser light is in a central portion of the work; anda second controller configured to control, based on the detection signal ...

ROOM TEMPERATURE GLASS-TO-GLASS, GLASS-TO-PLASTIC AND GLASS-TO-CERAMIC/SEMICONDUCTOR BONDING

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates. 1. An apparatus for room temperature laser bonding comprising:an x-axis motion stage mounted to a base;a y-axis motion stage mounted to the x-axis motion stage;a substrate alignment fixture mounted on the y-axis motion stage, said alignment fixture adapted to align and secure at least two substrates with a mutual interface as a workpiece;a gantry mounted to the base and supporting alignment optics for a laser to focus on the workpiece in the alignment fixture; anda controller for translation of the x-axis motion stage and y-axis motion stage for motion of the focused laser on the workpiece.2. The apparatus as defined in wherein the substrate alignment fixture comprises:a mounting structure to mount the alignment fixture to the y-axis stage;a vertically translating engagement slider supported by translation rods extending from the mounting structure;an expansion device positioned intermediate the engagement slider and the mounting structure for vertical adjustment of the engagement slider;a workpiece holding frame to support the workpiece;risers extending upward from the mounting structure to receive an optical flat to be positioned over the holding frame; anda securing plate mounted with spacers to fix the optical flat to the risers;whereby retraction of the expansion device ...

Laser Processing Robot System for Performing Laser Processing Using Robot

A laser processing robot system, in which an augmented reality processing technology is used to enable a processing laser beam and its irradiation position to be safely and easily seen, is provided. A laser processing robot system includes an image processing device having an augmented reality image processing unit for performing augmented reality image processing for an actual image including an image of a robot captured by an imaging device. The augmented reality image processing unit is adapted to superimpose a virtual image representing at least one of a laser beam obtained by assuming that the laser beam is emitted from a laser irradiation device to a workpiece, and an irradiation position of the laser beam, onto the actual image, and to display the superimposed image on the display device. 1. A laser processing robot system for performing laser processing of a workpiece , using a robot having an arm to which a laser irradiation device for emitting a laser beam for processing is attached , the laser processing robot system comprising:a robot control device which causes the robot to perform an operation of the laser processing without output of the laser beam;an imaging device for capturing an actual image including the robot which is caused to perform an operation of the laser processing without output of the laser beam;a display device for displaying, in real time, the actual image; andan image processing device which is connected to the robot control device and which has an augmented reality image processing unit for performing augmented reality image processing of the actual image, whereinthe augmented reality image processing unit is adapted to superimpose a virtual image representing at least one of a laser beam obtained by assuming that the laser beam is emitted from the laser irradiation device to the workpiece, and an irradiation position of the laser beam, onto the actual image, and to display the superimposed image on the display device.2. The laser ...

METHODS FOR ALIGNING MULTIPLE OPTICAL SURFACES USING SPHERES

A method for aligning multiple optical components in an optical system including placing a sphere at a first position that is at a center of curvature of a first optical component, and aligning a focus of a first reference signal with the sphere at the first position. Then, moving the sphere along an axis of optical symmetry to a second position that is at a center of curvature of a second optical component, and aligning a focus of a second reference signal with the sphere at the second position. The first optical component is aligned with the first reference signal and fixing the first optical component, and the second optical component is aligned with the second reference signal and fixing the second optical component. 1. A method for aligning multiple optical components in an optical system comprising:placing a sphere at a first position that is at a predetermined center of curvature of a first optical component;aligning a focus of a first reference signal with the sphere at the first position;moving the sphere along an axis of optical symmetry to a second position that is at a predetermined center of curvature of a second optical component;aligning a focus of a second reference signal with the sphere at the second position;aligning the first optical component with the first reference signal and fixing the first optical component; andaligning the second optical component with the second reference signal and fixing the second optical component.2. The method of claim 1 , wherein the first reference signal and the second reference signal are selected from lasers of an interferometer and a source of a point source microscope.3. The method of claim 1 , wherein the first reference signal and the second reference signal are lasers of an interferometer.4. The method of claim 1 , wherein the first optical component and the second optical component are mirrors.5. The method of claim 1 , wherein at least one of the first optical component and the second optical component is ...

LASER MACHINING ROBOT SYSTEM

A laser machining robot system that simplifies programming of a scanner operation is provided. A laser machining robot system includes a robot controller that controls a robot that performs remote laser machining and a scanner controller that controls a scanner. The robot controller includes: a machining information input unit that inputs machining information; a G-code generation unit that generates a G-code program using the machining information; and a G-code communication unit that transmits the G-code program to the scanner controller. The scanner controller includes a scanner program processing unit that applies the G-code program as a scanner operation program for operating the scanner. 1. A laser machining robot system including a robot controller that controls a robot that performs remote laser machining and a scanner controller that controls a scanner , whereinthe robot controller includes:a machining information input unit that inputs machining information;a G-code generation unit that generates a G-code program using the machining information; anda G-code communication unit that transmits the G-code program to the scanner controller, andthe scanner controller includes a scanner program processing unit that applies the G-code program as a scanner operation program for operating the scanner.2. The laser machining robot system according to claim 1 , whereinthe robot controller further includes a storage unit that stores a template program, andthe G-code generation unit generates the G-code program by editing the template program stored in the storage unit using the machining information.3. A laser machining robot system including a robot controller that controls a robot that performs remote laser machining and a scanner controller that controls a scanner claim 1 , whereinthe robot controller includes:a machining information input unit that inputs machining information; anda machining information communication unit that transmits the machining information to ...

LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

A laser processing device and a laser processing method. The laser processing device includes a cutting table, configured to load a workpiece to be processed; a distance-measuring unit, configured to perform distance measurement on the workpiece along a predetermined processing path to obtain three-dimensional processing data of the workpiece; and a laser processing unit, configured to process the workpiece by using laser light according to the three-dimensional processing data. 1. A laser processing device , comprising:a cutting table, configured to load a workpiece to be processed;a distance-measuring unit, configured to perform distance measurement on the workpiece along a predetermined processing path to obtain three-dimensional processing data of the workpiece; anda laser processing unit, configured to process the workpiece according to the three-dimensional processing data.2. The laser processing device according to claim 1 , wherein the distance-measuring unit comprises:a signal transmitter, configured to transmit a first distance-measuring signal to the workpiece;a signal receiver, configured to receive a second distance-measuring signal, the second distance-measuring signal being a signal returned to the signal receiver after the first distance-measuring signal is reflected by the workpiece; anda data processor, configured to process the first distance-measuring signal and the second distance-measuring signal to obtain the three-dimensional processing data of the workpiece.3. The laser processing device according to claim 2 , wherein the first distance-measuring signal is a laser signal or an ultrasonic signal.4. The laser processing device according to claim 1 , further comprising a memory claim 1 ,wherein the memory is configured to receive and save the three-dimensional processing data from the distance-measuring unit, and the three-dimensional processing data is provided to the laser processing unit.5. The laser processing device according to claim 1 , ...

Golf club head hosel marking

A method and a related system of forming laser etched indicia on an external surface of the golf club. The method includes directing a laser beam onto a golf club head, and etching a prescribed indicia into the golf club head. The etching is generated by at least one of: (i) rotating the golf club head relative to the laser beam; and (ii) rotating the laser beam relative to the golf club head.

LASER WIRE FEEDING SYSTEM

A laser wire feeding system includes a wire feeding device, a laser device, a first controller, and a second controller, and the first and second controllers are provided for sensing whether or not the wire feeding device normally conveys wires and whether or not a wire output end of the wire feeding device shifts is offset from the laser irradiation position of the laser device, and driving a motor to shift a horizontal shifting seat fixed with the wire feeding device to fine tune the wire feeding position according to the offset position. 1. A laser wire feeding system , comprising:a wire feeding device, for conveying and outputting a metal wire from a wire input end to a wire output end by a power source;a laser device, for melting and welding the metal wire outputted from the wire output end, and having a camera lens and a screen installed thereto, and the camera lens being provided for shooting an image of the wire output end and displaying the image of the wire output end on the screen, and using the beam irradiation position of the laser device as a reference point of the screen;a metal substrate, serving as a working surface for the laser device to weld the metal wire;a fixed seat, fixed to the laser device;a horizontal shifting seat, including a first motor installed thereto, and a second motor installed between the fixed seat and the horizontal shifting seat, so that the horizontal shifting seat can be shifted by using a driving shaft of the second motor as the axis;a vertical shifting seat, secured to the wire feeding device, and a driving shaft of the first motor being passed and fixed to the vertical shifting seat, so that the vertical shifting seat can be shifted by using the driving shaft of the first motor as the axis;a first controller, having two conductive wires coupled thereto, and ends of the two conductive wires being contacted with the metal wire and the metal substrate respectively to form a circuit, and capable of sensing a signal of the ...

AXIS CALIBRATION OF BEAM PROCESSING MACHINES

In a method for determining a deviation of a spatial orientation of a beam axis (S) of a beam processing machine from a spatial nominal orientation (S) of the beam axis (S), contour sections (KA, KB) are cut with a processing beam into a test workpiece from two sides of the workpiece. The contour sections (KA, KB) extend parallel to a nominal orientation of a rotation axis (B, C), where the rotation axis is to be calibrated. The contour sections (KA, KA) are probed from one side of the test workpiece by a measuring device for determining the spatial position of the contour sections (KA, KB). Deviation of the spatial orientation of the beam axis (S) of the beam processing machine from the spatial nominal orientation (S) is determined based on the spatial positions of the contour sections (KA, KB). 1. A method for determining a deviation of a spatial orientation of a beam axis of a beam processing machine from a nominal orientation of the beam axis , the beam processing machine having a rotation axis that is to be calibrated , and a measuring device , the method comprising:cutting, into a test workpiece, a first contour section and a second contour section by a processing beam from a first side and a second side of the test workpiece, respectively, wherein the first side is delimited by a first surface of the test workpiece and the second side is delimited by a second surface of the test work piece and each of the first and the second contour sections extend parallel to a nominal orientation of the rotation axis that is to be calibrated,probing, by the measuring device and from one side of the test workpiece, the first and the second contour sections to determine a spatial position of each of the first and the second contour sections, anddetermining a deviation of the spatial orientation of the beam axis of the beam processing machine from the nominal orientation by comparing the spatial positions of the first and the second contour sections with respective nominal ...

BORESIGHTING A LASER TO AN IMAGING SENSOR SYSTEMS AND METHODS

Techniques are disclosed for an improved boresighting apparatus and related method for boresighting a light source to an imaging sensor, and for an improved material to be used in a target object in such a boresighting apparatus. For example, an apparatus for use in boresighting may include a catadioptric element and a target object, where the catadioptric element is configured to focus a laser beam from the light source and also to collimate light emitted from the target object at a different wavelength than the laser beam to be detected by the imaging sensor for indicating the location of the focused laser beam. The target object may, for example, comprises a fluorescent optical material doped with one or more optically active ions to absorb light having the wavelength of the laser beam and emit light in one or more wavebands detectable by the imaging sensors. 1. An apparatus for use in boresighting a light source emitting a laser beam at a first wavelength to an imaging sensor having a detectable waveband , the apparatus comprising:a catadioptric element configured to transmit and focus the laser beam onto a location in a focal plane;a target object positioned substantially at the focal plane and configured to emit, from a spot corresponding to the location of the focused laser beam, light having a second wavelength within the detectable waveband of the imaging sensor in response to receiving the laser beam having the first wavelength; andwherein the catadioptric element is further configured as a collimating mirror to reflect the emitted light from the spot on the target object into a collimated emitted light having the second wavelength to be detected by the imaging sensor for indicating the location of the focused laser beam.2. The apparatus of claim 1 , wherein the catadioptric element is a positive meniscus lens with an outer surface having a first radius of curvature and an inner surface having a second radius of curvature larger than the first radius of ...

METHOD AND DEVICE FOR MEASURING AND CONTROLLING A DISTANCE BETWEEN A MACHINING HEAD AND A WORKPIECE

The invention pertains to measuring, adjusting and/or controlling a distance between a machining head, particularly a laser machining head, and a workpiece, comprising a measurement light source, a beam splitter that splits the light of the measurement light source into a measurement light beam and a reference light beam, a reference arm, through which the reference light beam is guided, an optical system for coupling the measurement light beam into a processing beam path featuring a focusing lens, an optical device for superimposing the measurement light beam, and a measurement and evaluation unit. 1. A method for measuring and adjusting a distance between a machining head , particularly a laser machining head , and a workpiece , in whichlight of a measurement light source is split into a measurement light beam and a reference light beam that is coupled into a reference arm,the measurement light beam is coupled into a processing beam path and bundled or focused on a workpiece surface by a focusing lens of the processing beam path,the measurement light beam reflected on the workpiece surface is superimposed with the reflected reference light beam from the reference arm, anda measurement and evaluation unit evaluates the information contained in the superimposed measurement and reference light beams based on the path difference between the measurement arm and the reference arm in order to obtain information on the distance between the machining head and the workpiece and to generate a corresponding distance or adjustment signal.2. The method according to claim 1 , characterized in that the measurement light beam is essentially bundled or focused in an interaction zone between a processing beam and the workpiece coaxial to the processing beam.3. The method according to claim 1 , characterized in that the measurement light beam is coupled into the processing beam path with an incline or a parallel offset relative to the optical axis of the processing beam path such ...

SENSOR SYSTEM FOR DIRECTLY CALIBRATING HIGH POWER DENSITY LASERS USED IN DIRECT METAL LASER MELTING

A three dimensional printing system includes a laser system, a beam splitter, a pinhole, a sensor, and a controller. The laser system emits a light beam of varying diameter carrying at least 100 watts of optical power along an optical path. The laser has an imaging plane along the optical path which can be coincident or close to a focal plane at which the beam has a minimum diameter. The beam splitter is positioned along the optical path to receive the beam and to transmit most of the optical power and to reflect remaining optical power. The pinhole is positioned along the optical path at the imaging plane to receive the reflected beam having a minimal diameter. The controller is configured to analyze a signal from the sensor to determine intensity and distribution parameters for the light beam. 1. A three dimensional printing system comprising:a laser system that emits a beam of varying diameter carrying at least 100 watts of optical power along an optical path, the laser having an imaging plane which is located at or near a focal plane at which the beam has a minimum beam diameter;a beam splitter positioned along the optical path to receive the beam and to transmit most of the optical powder and to reflect remaining optical power;a pinhole positioned along the optical path at the imaging plane to receive the reflected beam;a sensor positioned along the optical path to receive the beam from the pinhole; anda controller configured to analyze a signal from the sensor to determine intensity and other parameters for the beam.2. The three dimensional printing system of wherein the laser system includes a two dimensional scanning system whereby the beam scans along the pinhole along two axes.3. The three dimensional printing system of wherein the controller controls the laser system including the scanning system.4. The three dimensional printing system of wherein the beam converges between the laser system and the beam splitter claim 1 , the beam diameter at the beam ...

Sensor Device for Scanning Laser Processing of a Workpiece by Means of a Laser Beam Deflected About a Pivot Point

The invention relates to a sensor device for scanning laser processing of a workpiece by means of a laser beam deflected about a pivot point, said device comprising a holding device and at least two sensors, wherein the holding device is formed by a matrix- or honeycomb-shaped arrangement of sleeves, consisting of individual sleeves whose sleeve axes intersect at a point of intersection (P) outside the holding device, and the at least two sensors each being arranged in one of the sleeves such that their sensor axis coincides with the sleeve axis. The holding device advantageously is a monolithic component produced in a generative manufacturing process. 1. A sensor device for scanning laser processing of a workpiece by a laser beam deflected about a pivot point , the device comprising:a holding device being formed by a matrix- or honeycomb-shaped arrangement of firmly interconnected sleeves comprised of individual sleeves open on at least one side, each sleeve having a sleeve axis, the sleeve axes intersecting at a point of intersection (P) outside the holding device; andat least two sensors, each of the at least two sensors having a sensor axis and being arranged in one of the sleeves such that their sensor axis coincides with the sleeve axis.2. The sensor device according to claim 1 , wherein each sleeve has a sleeve wall which is bounded by a first end face and a second end face or a bottom face claim 1 , and wherein the point of intersection (P) is located on a side of the first end face of each sleeve.3. The sensor device according to claim 2 , wherein first end faces of each sleeve form a contiguous mating surface which is adapted to a surface contour of the workpiece to be processed in a processing area.4. The sensor device according to claim 3 , wherein at least some of the first end faces are provided with spacers facing away from the holding device and wherein the workpiece to be processed can be applied against the spacers.5. The sensor device according to ...

Marking system for decorating workpieces

A marking system for decorating one or more workpieces includes a plurality of marking stations that can mark product images on blank workpieces to produce product workpieces, at least some of which have different sizes, shapes, materials, or a combination thereof, a control system that can select one of the plurality of marking stations and send product image data to the selected one of the plurality of marking stations, and a robotic manipulator that can transport a blank workpiece to the selected marking station under the control of the robotic manipulator. The selected marking station can mark the product image the blank workpiece based on the product image data which produces a product workpiece. The robotic manipulator can remove the product workpiece from the selected one of the plurality of marking stations. 1. A marking system for decorating one or more workpieces , comprising:a plurality of marking stations configured to mark product images on blank workpieces to produce product workpieces, at least some of which have different sizes, shapes, materials, or a combination thereof;a control system configured to select one of the plurality of marking stations and send product image data to the selected one of the plurality of marking stations; anda robotic manipulator configured to transport a blank workpiece to the selected one of the plurality of marking stations under the control of the robotic manipulator,wherein the selected one of the plurality of marking stations is configured to mark the product image the blank workpiece based on the product image data which produces a product workpiece,wherein the robotic manipulator is configured to remove the product workpiece from the selected one of the plurality of marking stations.2. The marking system of claim 1 , wherein at least one of the blank workpieces is labeled with a blank workpiece identification code claim 1 , the marking system further comprising:a workpiece scanner configured to scan the blank ...

CALIBRATED LASER PRINTING METHOD

The present disclosure relates to a calibrated laser printing method, which is a pre-laser machining operation of wafers and comprises steps as follows: a piece of calibration glass is carried and leveled by a leveling system; a plurality of target points are marked on the piece of calibration glass by a laser system based on data of default positions of the plurality of target points on the piece of calibration glass; true positions of the target points on the piece of calibration glass are measured by an image system; data of measured true positions is transmitted to a resetting system; the piece of calibration glass is shifted to a next location by a displacement system on which the leveling system is carried for repetitive executions of above steps in the case of measurement not completed; data between default and true positions of the target points is compared; a reflecting mirror is deflected by an angle for calibrations of laser beams projected on a wafer in the case of any offset between default and true positions of the target points out of specification. 1. A calibrated laser printing method , comprising steps as follows:(a) a piece of calibration glass is carried and leveled by a leveling system;(b) a plurality of target points are marked on the piece of calibration glass by a laser system based on data of default positions of the plurality of target points on the piece of calibration glass;(c) true positions of the target points on the piece of calibration glass are measured by an image system;(d) data of measured true positions is transmitted to a resetting system;(e) the piece of calibration glass is shifted to a next location by a displacement system on which the leveling system is carried for repetitive executions from (b) to (e);(f) data between default and true positions of the target points is compared;(g) a reflecting mirror is deflected by an angle for calibrations of laser beams projected on a wafer in the case of any offset between default and ...

SYSTEM AND METHODS FOR COMPENSATING FOR CALIBRATION PLATE IRREGULARITIES IN ADDITIVE MANUFACTURING SYSTEMS

A method of aligning at least one laser beam of an additive manufacturing arrangement. The method includes measuring a surface of the calibration plate at a plurality of measurement points using the coordinate measuring machine. The method further includes generating a correction field based on the plurality of measurement points using the coordinate measuring machine. The method further includes writing at least one fiducial mark on the surface of the calibration plate using the at least one laser beam. The method further includes generating calibration data for the surface of the calibration plate using the calibration system. The method also includes aligning the laser beam within the additive manufacturing system based on the calibration data and the correction field using the computing device by comparing a position of the fiducial mark from the calibration data with the correction field to determine a corrected position of the laser beam. 1. A method of aligning at least one laser beam in an additive manufacturing arrangement , the additive manufacturing arrangement including an additive manufacturing system , a coordinate measuring machine , a calibration system , and a computing device , said method comprising:positioning a calibration plate in the coordinate measuring machine;measuring a surface of the calibration plate at a plurality of measurement points using the coordinate measuring machine;generating a correction field based on the plurality of measurement points using the coordinate measuring machine;positioning the calibration plate in the additive manufacturing system;writing at least one fiducial mark on the surface of the calibration plate using the at least one laser beam;positioning the calibration plate in the calibration system;generating calibration data for the surface of the calibration plate using the calibration system; andaligning the at least one laser beam within the additive manufacturing system based on the calibration data and the ...

METHOD FOR THE OPTOINJECTION OF EXOGENOUS MATERIAL INTO A BIOLOGICAL CELL

A method for the optoinjection of exogenous material in a recipient biological cell is disclosed and comprises: placing a biological cell on a planar surface of a substrate, transmitting a sub-ns pulsed laser beam through a variable convergence/divergence collimator; focusing the laser beam in a focal spot positioned along an axial direction substantially perpendicular to the substrate; moving the focal spot towards the cell along the axial direction by continuously varying the electric control signal from a first amplitude value a second amplitude value the second amplitude value of the control signal is selected such that the second axial position is positioned inside the cell. 1. A method for the optoinjection of exogenous material into a recipient biological cell , wherein the cell comprises a cell membrane which encloses it , the method comprising:(a) placing a biological cell on a planar surface of a substrate, the cell having a basal surface resting on the planar surface of the substrate and an apical surface opposite the basal surface and in contact with a fluid solution which contains exogenous material;(b) transmitting a sub-ns pulsed laser beam through a variable convergence/divergence collimator, the collimator comprising a lens with focal length tunable by means of a variable amplitude control electrical signal;(c) directing the laser beam, having passed through the collimator, through an objective lens configured to focus the laser beam along an optical axis in a focal spot, the optical axis defining an axial direction substantially perpendicular to the planar surface of the substrate, such that the focal spot is positioned along the axial direction;{'sub': i', 'i, '(d) setting the electric control signal to a first amplitude value which defines a first focal length of the lens, corresponding to a first axial position zof the focal spot along the optical axis, wherein the first amplitude value of the control signal is selected such that the first axial ...

Laser machining device

A laser machining device machines a machining target subject by irradiating the converged laser beam output from each laser diode of a plurality of laser diodes connected in series to each other. A machining laser beam output-power driving circuit Q 1 outputs a machining laser beam by driving the plurality of laser diodes 11 a - 11 d, 13 . A guide light output-power driving circuit Q 2 outputs a guide light by driving a partial laser diode 13 of the plurality of laser diodes. A selection means SW 1 , SW 2 selects the guide light output-power driving circuit on determining the position and selects the machining laser output-power driving circuit on a laser machining. A setup value comparison circuit 16 controls the electric current flowing through the part of laser diodes to be below the electric current setup value to output the guide light having electric current not higher than the predetermined value.

Trimming Device and Method for Cutting Metal Hollow Bodies

A trimming device for metal hollow bodies, including a machine frame on which a workpiece round table is mounted for rotation about an axis of rotation and on which a cutting device is located, wherein the workpiece round table includes a plurality of holding devices designed for holding a metal hollow body each for carrying out a trimming operation, and wherein the cutting device is designed for providing a cutting beam, in particular a laser beam, for a contactless trimming operation on the metal hollow body, wherein a drive device is designed for providing a rotary step movement for the workpiece round table is assigned to the workpiece round table. 1. A trimming device for metal hollow bodies , the device comprising a machine frame on which a workpiece round table is mounted for rotation about an axis of rotation and on which a cutting device is located , wherein the workpiece round table comprises a plurality of holding devices designed for holding a metal hollow body each for carrying out a trimming operation , and wherein the cutting device is designed for providing a cutting beam , for a contactless trimming operation on the metal hollow body and wherein a drive device designed for providing a rotary step movement for the workpiece round table is assigned to the workpiece round table.2. A trimming device according to claim 1 , wherein the drive device is designed as a gearless electric direct drive and/or the cutting device is designed for providing a laser beam.3. A trimming device according to claim 1 , wherein the holding device comprises a clamping means claim 1 , which is mounted on the workpiece round table for rotation about a machining axis and which is designed for holding a region claim 1 , of the metal hollow body4. A trimming device according to claim 3 , wherein the holding device comprises a holding means claim 3 , which is located adjacent to the clamping means and extends along the machining axis and which has an adhesion surface for a metal ...

GLASS SUBSTRATE

A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 μm or less. Perpendicularity expressed by P=t/tranges from 1.00000 to 1.00015, where P is the perpendicularity, tis the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and tis the thickness of the glass substrate. 1. A glass substrate comprising:a first surface and a second surface that are opposite to each other with a plurality of through holes piercing through the glass substrate from the first surface to the second surface,wherein each of five through holes randomly selected from the plurality of through holes includes a first opening at the first surface and a second opening at the second surface,an approximate circle of the first opening has a diameter greater than a diameter of an approximate circle of the second opening,the first opening has a roundness of 5 μm or less, and{'sub': c', '0', 'c', '0, 'a perpendicularity expressed by P=t/tranges from 1.00000 to 1.00015, where P is the perpendicularity, tis a distance between a center of the approximate circle of the first opening and a center of the approximate circle of the second opening, and tis a thickness of the glass substrate.'}2. The glass substrate as claimed in claim 1 , whereinthe first opening has a substantially circular shape, andthe diameter of the approximate circle of the first opening ranges from 20 μm to 160 μm.3. The glass substrate as claimed in claim 2 , whereinthe second ...

LASER MACHINING APPARATUS WITH WORKPIECE POSITION ADJUSTING CAPABILITY RELATIVE TO FOCAL POINT OF LASER BEAM

In a laser machining apparatus, an optical member converges a laser beam for machining a workpiece disposed on a mounting surface perpendicular to a first direction and maintains a focal point of the converged laser beam in a focal plane located at a focal position in the first direction. A visible light irradiating device irradiates a visible light in the first direction, thereby projecting a focus target on the workpiece. A pointer beam emitting device emits a pointer beam toward the mounting surface at a prescribed inclination angle. A controller is configured to perform: modifying a positional relationship between the focus target and the pointer beam in a second direction perpendicular to the first direction according to position information related to a projecting position of one of the focus target and the pointer beam in the first direction; and projecting the focus target and the pointer beam onto the workpiece. 1. A laser machining apparatus comprising:a laser beam emitting device configured to emit a laser beam for machining a workpiece disposed on a mounting surface perpendicular to a first direction;a scanner configured to scan the laser beam emitted from the laser beam emitting device;an optical member configured to converge the laser beam scanned by the scanner and maintain a focal point of the converged laser beam in a focal plane perpendicular to the first direction, the focal plane being located at a focal position in the first direction;a visible light irradiating device configured to irradiate a visible light in the first direction, thereby projecting a focus target on the workpiece;a pointer beam emitting device configured to emit a pointer beam toward the mounting surface at a prescribed inclination angle relative to the first direction, the pointer beam and the focus target being used for adjusting the focal position of the laser beam relative to the workpiece;an input device configured to receive position information related to a projecting ...

Laser welding systems for aluminum alloys and methods of laser welding aluminum alloys

Systems and methods of a laser welding device to weld aluminum are disclosed. The device includes a laser generator to generate welding-type lasing power and a lens to focus the welding-type lasing power at a focal point on an aluminum workpiece to generate a weld puddle. A laser scanner to control the lens to move the focal point of the welding-type lasing power in multiple dimensions over the aluminum workpiece during welding, the laser generator and the laser scanner to perform the welding without filler metal being added to the workpiece.

Machining Apparatus for Laser Machining a Workpiece, Set of Parts for a Machining Apparatus for Laser Machining a Workpiece and Method for Laser Machining a Workpiece using such Machining Apparatus

A machining apparatus for laser machining a workpiece () in a machining zone () is provided, having a first interface () for a machining laser source for generating a machining laser beam (), an outlet opening () for the machining laser beam (), In an optical system between the first interface () and the outlet opening (), which has at least one laser beam guiding device () having at least one movable surface () and at least one actuator (), with which the movable surface () is dynamically adjustable, and a cooling device () for cooling the at least one actuator (), wherein the cooling device () has at least one primary circuit () through which a first cooling fluid can flow without contact with the actuator (). Furthermore, a set of parts for a machining apparatus for laser machining a workpiece () and a method of laser machining a workpiece () using such machining apparatus are also provided. 117-. (canceled)18. A machining apparatus for laser machining a workpiece in a machining zone , in particular for laser cutting , in particular a laser machining head , having a first interface for a machining laser source for generating a machining laser beam;an outlet opening for the machining laser beam;an optical system between the first interface and the outlet opening, which has at least one laser beam guiding device having at least one movable surface and at least one actuator, with which the movable surface is dynamically adjustable; anda cooling device for cooling the at least one actuator, wherein the cooling device has at least one primary circuit through which a first cooling fluid can flow without contact with the actuator;characterized in that the cooling device has a closed secondary circuit, through which a second cooling fluid can flow in contact with the actuator and which can be cooled by a first of the primary circuits.19. The machining apparatus according to claim 18 ,wherein the cooling device has at least one element selected from an interior, in which ...

APPARATUS FOR ADDITIVELY MANUFACTURING OF THREE-DIMENSIONAL OBJECTS

Apparatus () for additively manufacturing of three-dimensional objects () by means of successive layerwise selective irradiation and consolidation of layers of a build material () which can be consolidated by means of an energy beam (), wherein the apparatus () comprises a scanning unit () configured to scan the energy beam () over at least a part of a build plane (), a focusing unit () is provided that is configured to control a focal position () of the energy beam () via a positioning of at least one optical component of the focusing unit () and/or a positioning of the focusing unit () relative to the build plane (). 112345164571513144515157. Apparatus () for additively manufacturing of three-dimensional objects () by means of successive layerwise selective irradiation and consolidation of layers of a build material () which can be consolidated by means of an energy beam ( , ) , wherein the apparatus () comprises a scanning unit () configured to scan the energy beam ( , ) over at least a part of a build plane () , characterized by a focusing unit () configured to control a focal position ( , ) of the energy beam ( , ) via a positioning of at least one optical component of the focusing unit () and/or a positioning of the focusing unit () relative to the build plane ().2154591. Apparatus according to claim 1 , characterized in that an energy beam source and/or the focusing unit () is associated with at least one calibration means configured to change the focal position of the energy beam ( claim 1 , ) with respect to a defined point of a build module () of the apparatus ().315. Apparatus according to claim 1 , characterized in that the focusing unit () comprises at least one optical lens or a lens system.4171561716. Apparatus according to claim 1 , characterized by a control unit () configured to control the focusing unit () and/or the scanning unit () claim 1 , wherein the control unit () is configured to receive calibration information of at least one focus ...

Method of producing projection path data, processing method, and cam system

A method of producing a projection path data to be used in forming a desired shape by projecting a laser beam into a material, the method includes a first step of converting two-dimensional information representing the desired shape in two dimensions in an XYZ coordinate system into three-dimensional information in an XYZ coordinate system, and a second step of producing the projection path data based on the three-dimensional information that has been converted.

LASER WELDING METHOD

A plurality of values measured are relatively compared to determine an optical axis deviation direction in which an optical axis of a measurement beam S deviates from a laser beam L. In performing laser welding in the optical axis deviation direction, an irradiation position of the measurement beam S is changed so that the irradiation position of the measurement beam S is moved to a rear side of the center of the optical axis of the laser beam L in the welding direction. 1. A laser welding method for welding a weld portion by using a laser beam , the method comprising:emitting, to the weld portion, the laser beam and a measurement beam coaxially aligned with the laser beam, the measurement beam having a wavelength different from a wavelength of the laser beam;measuring a penetration depth of the weld portion in accordance with the measurement beam reflected on the weld portion during the laser welding;determining an optical axis deviation direction in which an optical axis of the measurement beam deviates from the laser beam, by relatively comparing a plurality of values measured; andin performing the laser welding in the optical axis deviation direction, changing an irradiation position of the measurement beam so that the irradiation position of the measurement beam is moved to a rear side of a center of an optical axis of the laser beam, in a welding direction.2. The laser welding method of claim 1 , whereinin the measuring of the penetration depth of the weld portion, while performing laser welding, an irradiation position of the laser beam and the irradiation position of the measurement beam are moved in at least a first direction, a second direction opposite to the first direction, a third direction crossing the first direction, or a fourth direction opposite to the third direction.3. The laser welding method of claim 1 , whereinin the measuring of the penetration depth of the weld portion, laser welding is performed, by moving the irradiation position of the ...

Substrate processing apparatus and substrate processing method

A substrate processing apparatus configured to process a substrate includes a holder configured to hold, in a combined substrate in which a first substrate and a second substrate are bonded to each other, the second substrate; and a modifying device configured to form, to an inside of the first substrate held by the holder, a peripheral modification layer by radiating laser light for periphery along a boundary between a peripheral portion of the first substrate as a removing target and a central portion thereof, and, also, configured to form an internal modification layer by radiating laser light for internal surface along a plane direction of the first substrate. The modifying device switches the laser light for periphery and the laser light for internal surface by adjusting at least a shape or a number of the laser light for periphery and the laser light for internal surface.

Laser processing method, semiconductor device manufacturing method, and examination device

An inspecting device includes a stage configured to support a wafer in which a plurality of rows of modified regions are formed in a semiconductor substrate, a light source configured to output light, an objective lens configured to pass light propagated through the semiconductor substrate, a light detection part configured to detect light passing through the objective lens, and an inspection part configured to inspect whether or not there is a tip of a fracture in an inspection region between a first modified region closest to a front surface of the semiconductor substrate and a second modified region closest to the first modified region. The objective lens aligns a focus from the back surface side in an inspection region. The light detection part detects light propagating in the semiconductor substrate from the front surface side to the back surface side.

LASER TREATMENT DEVICE

An adapter for coupling a laser treatment device to an object for treatment. The adapter has an input side, which may be fixed relative to the laser treatment device, by a locking mechanism and which may be fixed to the object, for alignment of the object relative to the laser treatment device. A scanned laser beam is introduced on the input side, from the laser treatment device, along a beam path to the object with a reference structure. The reference structure lies on the beam path of the adapter and may be optically detected by means of the laser beam scanned over the region. 1. (canceled)2. An adapter for coupling an eye to be treated in ophthalmic surgery with a laser treatment device , the adapter comprising:an adapter input side, being fixable relative to the laser treatment device via a locking mechanism;an adapter beam path,a scanned region that is part of the adapter input side, wherein a laser beam, having been supplied to be scanned over the scanned region, is transmitted along the adapter beam path, wherein the adapter beam path starts at the scanned region and the laser beam passes through the scanned region and along the adapter beam path when being scanned during laser treatment; anda reference structure, the reference structure being located in the adapter beam path such that the reference structure can be illuminated by laser radiation being scanned over the scanned region, wherein the reference structure is adapted to absorb or reflect the laser radiation to make the reference structure optically detectable; andwherein the reference structure encodes information about the adapter.3. The adapter as claimed in claim 2 , wherein the information encoded by the reference structure includes an adapter ID.4. The adapter as claimed in claim 2 , wherein the information encoded by the reference structure includes an adapter type.5. The adapter as claimed in claim 2 , further comprising an adapter output side claim 2 , through which laser radiation supplied ...

Laser welder alignment system

A laser welder alignment system includes a laser welder, a camera associated with the laser welder configured to capture images of a loaded product within the laser welder, and a controller in communicative association with the laser welder and the camera. The controller receives visualization data from the camera and, based on the visualization data, forms and sends positioning instructions to the laser welder instructing the laser welder so as to position the loaded product at a proper weld start. The laser welder alignment system also verifies proper positioning of the loaded product within the laser welder, and verifies proper rotation of the loaded component by determining whether the rotating product has a wobble that exceeds a pre-defined wobble tolerance.

LASER STRUCTURE

The present invention relates to an improved laser structure comprising a laser generation module and an optical component. The laser generation module outputs laser beams to the optical component. A composite substrate to be cut comprises at least two board layers of different materials, and an upper surface of each of the at least two board layers is a cutting starting point of the each of the at least two board layers. The optical component is used to transform the laser beams to laser beams having at least two focal depths so as to be respectively focused on the upper surface of the each of the at least two board layers mentioned above, and to achieve effect of enhancing cutting efficiency of the composite substrate. 1. A laser structure used for form cutting channels on a composite substrate , comprising a laser generation module , and the laser generation module outputting laser beams to an optical component , wherein the composite substrate comprises at least two board layers of different materials , and an upper surface of each of the at least two board layers is a cutting starting point of the each of the at least two board layers , the optical component is to transform the laser beams to laser beams having at least two focal depths and being respectively focused on the upper surface of the each of the at least two board layers.2. The laser structure as claimed in claim 1 , wherein the optical component comprises a plurality of different curvatures.3. The laser structure as claimed in claim 1 , wherein the optical component comprises a beam splitter and a focal convergent lens claim 1 , the laser beams output from the laser generation module sequentially pass through the beam splitter and the focal convergent lens claim 1 , and the focal convergent lens comprises a plurality of different curvatures.4. The laser structure as claimed in claim 1 , wherein the each of the at least two board layers are made from a selective one of metal material claim 1 , ...

Laser Processor and Laser Processing Method

A laser processing machine includes a first focal point change amount calculating unit for calculating the time difference between an irradiation period during which a laser beam is irradiated from a laser processing head and a down time, or calculating the amount of change in focal point position from a detected temperature of an optical system in its entirety. A second focal point change amount unit calculates the amount of change in focal point position relative to a temperature change of a protective glass. A focal point position correcting unit causes a processing machine main body control device to correct the focal point position with the use of the sum of the change amounts of focal point position calculated by the first and second focal point change amount calculating units. 1. A laser processing machine being operable to repeat switch-on and switch off of a laser beam irradiated upon a work , comprising:a laser processing head having an optical system, including a plurality of optical elements, and a focal point position adjusting mechanism for the optical system;a laser oscillator;a moving mechanism to relatively move the laser processing head relative to the work;a control device to control the focal point position adjusting mechanism, the laser oscillator and the moving mechanism;a first focal point change amount calculating unit to calculate a difference between an irradiation time and a down time of irradiation of the laser beam from the laser processing head, or an amount of change in a focal point position from a detection value of a temperature of the optical system as a whole;a second focal point change amount calculating unit to calculate an amount of change in the focal point position from a detection value of the temperature of an optical element of the optical system, which is closest to a processing point, relative to a temperature change of an optical element closest to the processing point; anda focal point position correcting unit to cause ...

Laser apparatus for welding

A laser apparatus for welding is disclosed. The laser apparatus includes: a laser optic head adapted and configured to modify a spot size of a laser beam oscillated by a laser oscillator and to project the laser beam into a joining portion of joining members, wherein the laser optic head is adapted and configured to modify the spot size to selectively perform brazing or welding. A method of selectively brazing or welding according to one or more exemplary embodiments of the present invention includes: providing a laser apparatus of as described herein; and actuating the laser optic head to modify the spot size of the laser beam and project the laser beam into the joining portion of the joining members to selectively perform brazing or welding.

LASER BEAM MACHINE AND ALIGNMENT ADJUSTING METHOD

This laser processing machine, which processes a work piece mounted on a table by irradiating the work piece with a laser light, is provided with: an optical head having a nozzle that sprays a liquid to form a columnar liquid flow and introducing a laser light into the nozzle and shining said light; and an alignment adjustment device having a reflector that is disposed so as to face the optical head and reflects the laser light, and a light-shielding portion around the portion of the reflector that reflects the laser light, and adjusting the position or orientation of introduction of the laser light into the columnar liquid flow. 1. A laser beam machine for machining a workpiece by irradiating a laser beam to the workpiece mounted to a table , characterized by:an optical head having a nozzle configure to discharge liquid to form a pillar-like liquid flow, the optical head introducing a laser beam into the nozzle to irradiate; andan alignment adjusting device, having a reflecting plate, disposed to face the optical head, for reflecting the laser beam, and a shielding part disposed around a portion of the reflecting plate, the portion being adapted to reflect the laser, the alignment adjusting device being configure to adjust the incident position and angle of the laser beam relative to the pillar-like liquid flow.2. The laser beam machine according to claim 1 , wherein the optical head comprises an optical system configured to lead the laser beam from a laser oscillator to the nozzle claim 1 , a camera configured to capture an image of the nozzle and the reflecting plate claim 1 , and a housing configure to enclose the optical system and the camera claim 1 , the nozzle being disposed on a bottom face of the housing claim 1 ,Wherein the alignment adjusting device is disposed in the laser beam machine at a position allowing the shielding member to contact intimately with the bottom face of the housing to enclose the nozzle.3. The laser beam machine according to claim 2 ...

APPARATUS AND METHOD FOR BEAM DIAGNOSIS ON LASER PROCESSING OPTICS

Apparatus for determining geometrical parameters of a laser beam includes an optical system, a device for output coupling radiation, a beam diagnostic device, and a reflector element. The optical system focuses the laser beam into a processing region. The device for output coupling radiation couples out radiation that runs through the optical system in a direction opposite to a direction of the laser beam. The reflector element has a first surface which is partially reflecting and curved, where the curvature is equal to a mean curvature of a wave front of the laser beam in a positioning region of the reflector element. 1. An apparatus for determining geometrical parameters of a laser beam , comprising:an optical system configured to focus the laser beam into a processing region,a device for output coupling of radiation that travels in a direction opposite to a direction of travel of the laser beam through the optical system,a beam diagnostic device, anda first reflector element with a first surface,wherein the first reflector element is placeable in a positioning region between the optical system and the processing region,wherein the first surface of the first reflector element is partially reflecting and is curved,wherein a curvature of the first surface is equal to a mean curvature of a wave front of a focused laser beam in the positioning region of the first reflector element, andwherein the focused laser beam is focused by the optical system.2. The apparatus according to claim 1 , wherein the first surface of the first reflector element is set concentrically to the wave front of the focused laser beam.3. The apparatus according to claim 1 , wherein a center of curvature of the first surface of the first reflector element is set to a target position of a laser beam focus of the focused laser beam.4. The apparatus according to claim 1 , further comprising a positioning apparatus claim 1 , wherein the first reflector element is coupled to the positioning apparatus ...

PATTERN EDITOR FOR GENERATING FUNCTIONAL TEXTURES

A computer-implemented method for generating laser engraving instructions for performing a patterning process on a workpiece surface includes receiving a first input value indicating a first laser-pulse pattern and a second input value for a laser parameter associated with a laser-engraving system; and generating a machine-command sequence for the laser-engraving system based on the first input value and the second input value. 1. A computer-implemented method for generating laser engraving instructions for performing a patterning process on a workpiece surface , the method comprising:receiving a first input value indicating a first laser-pulse pattern and a second input value for a laser parameter associated with a laser-engraving system; andgenerating a machine-command sequence for the laser-engraving system based on the first input value and the second input value.2. The computer-implemented method of claim 1 , further comprising receiving a third input value for a geometric parameter associated with the first laser-pulse pattern claim 1 , wherein the machine-command sequence is generated based on the third input value as well.3. The computer-implemented method of claim 2 , wherein the geometric parameter comprises a number of laser-engraving phases included in the patterning process claim 2 , a spacing between lines included in the first laser-pulse pattern claim 2 , an offset distance between a first line associated with a first laser-engraving phase included in the patterning process and a second line associated with a second laser-engraving phase included in the patterning process claim 2 , or an offset angle between the first line and the second line.4. The computer-implemented method of claim 1 , wherein the first laser-pulse pattern comprises a grid pattern that includes multiple lines claim 1 , a grid pattern that includes multiple curves claim 1 , a grid pattern that includes multiple polylines claim 1 , or a grid pattern that includes multiple ...

METHOD AND LASER PROCESSING MACHINING FOR LASER WELDING A FIRST AND A SECOND WORKPIECE PORTION

The invention relates to methods for laser welding a first and a second workpiece portion with a laser beam that is guided using a laser machining head along a joining gap formed between the workpiece portions, in which method the laser beam is focused and a filler is lined up with the joining gap. At least one gap width of the joining gap of the workpiece portions to be welded is detected and evaluated along the course of the joining gap and compared with at least a first and a second gap measurement. If a detected gap width is within the first gap measurement, the feeding of the filler to the joining gap is stopped and a beam profile of the laser beam is set with a point or annular focus, and if a detected gap width is within the second gap measurement, a feeding of the filler is actuated. 125-. (canceled)27. The method of claim 26 , wherein detecting the joining gap comprises detecting the joining gap by a sensor system during a teach-in mode for detecting the course of the joining gap or immediately before introducing the welded seam coaxially relative to the laser beam or in advance.28. The method of claim 26 , wherein the first gap size is selected based at least on a material thickness of the workpiece portions to be welded claim 26 , and the first gap size is smaller than the material thickness of the workpiece portions to be welded claim 26 , and wherein the first gap size is equal to or less than a share of 15% of the material thickness of the workpiece portions to be welded.29. The method of claim 28 , wherein the first gap size is equal to or less than a share of 10% of the material thickness of the workpiece portions to be welded.30. The method if claim 26 , wherein the additional substance is supplied to the joining gap in advance in the welding direction in relation to the beam axis of the laser beam.31. The method of claim 26 , wherein the additional substance comprises one of an additional wire supplied via a wire supply device or a powder supplied ...

LASER BEAM POSITIONING SYSTEM, LASER PROCESSING DEVICE AND CONTROL METHOD

A method is provided of controlling a laser processing device with at least one laser. The method includes setting an optical path of the laser processing device by at least one rotatable mirror; a first triggering of the laser at a first point in time so as to generate a first laser spot; continuously adjusting, the optical path of the laser processing device; and a second triggering of the laser at a second point in time so as to generate a second laser spot. The method also includes, before the second triggering: determining the second point in time so that the position of the second laser spot has a desired distance, along the path, to the position of the first laser spot. 1. A method of controlling a laser processing device having at least one laser , comprising:setting an optical path of the laser processing device by at least one deflection element, including at least one rotatable mirror, so that a path point which can be generated by a laser beam following the optical path lies on a desired path on or in an object;a first triggering of the laser at a first point in time so as to generate a first laser spot;adjusting, in particular continuously adjusting, the optical path of the laser processing device by the at least one rotatable mirror, so that a path point which can be generated by the laser beam following the optical path lies on the desired path;a second triggering of the laser at a second point in time so as to generate a second laser spot;wherein the method comprises the following step before the second triggering:determining the second point in time on the basis of at least one of a target position, a first or a higher time derivative thereof, and a first or a higher time derivative of an actual position of the path point of the optical path along the desired path, so that a position of the second laser spot has a desired distance, along the desired path, to a position of the first laser spot.2. The method according to claim 1 , wherein the second ...

Method and device for magnetic domain refinement of oriented electrical steel plate

To optimize equipment and processes to enhance magnetic domain refinement efficiency and to enhance workability to improve processing capability, a method of refining a magnetic domain of a grain-oriented electrical steel plate includes zigzag controlling for transferring the steel plate without being inclined in right and left directions along a production line center, steel plate support roll position adjusting for controlling a position of the steel plate in up and down directions while supporting the steel plate, laser beam irradiating for irradiating a laser beam to a surface of the steel plate to melt the steel plate to form a groove in the surface of the steel plate, and removing for absorbing and removing radiant heat due to reflection of the laser beam irradiated to the surface of the steel plate during the laser beam irradiating.

NANOPOSITIONER AND METHOD OF MAKING

A tunable, all-optical, coupling method for a high-Q silica microsphere and an optical waveguide is disclosed. By means of a novel optical nanopositioning method, induced thermal expansion of an asymmetric microsphere stem for laser powers up to 211 mW is observed and used to fine tune the microsphere-waveguide coupling. Microcavity displacements ranging from (0.61±0.13)−(3.49±0.13) μm and nanometer scale sensitivities varying from (2.81±0.08)−(17.08±0.76) nm/mW are obtained. Additionally, an apparent linear dependency of coupling distance on stem laser heating is achieved. Using these methods, coupling can be altered such that the differing and customizable coupling regimes can be achieved. 1. A method of fabricating a nanopositioner environment , comprising:attaching a weight to the bottom of a predetermined length of a first fiber;a CO2 laser side-heating the first fiber, where the CO2 laser is located perpendicular to a central axis of the first fiber;applying side-heat to the first fiber, thereby deforming a core of the first fiber;warping the core in such a way that the core is shifted to one side of the first fiber;focusing a beam to a spot size smaller than a diameter of the first fiber;adjusting the position of the CO2 laser such that the heating occurs predominantly on one side of the first fiber;inducing an asymmetry by reducing the spot size;pulsing the laser power in order to mimic an etching-like process via ablation; therebycarving the asymmetry out of the first fiber thereby creating an asymmetric stem;obtaining a predetermined geometry in the asymmetric stem suitable for preventing laser light from passing unimpeded through the first fiber;melting a tip of the first fiber such that the melted tip of the asymmetric stem assumes a spherical morphology thereby forming a microsphere.2. The method of claim 1 , further comprising:broad-focus laser heating of the microsphere; therebyreducing surface irregularities.3. The method of claim 1 , further ...

METHOD OF PROCESSING WAFER

A method of processing a wafer having a plurality of intersecting streets on a face side thereof with protrusions on the streets includes a holding step of holding a protective sheet of a wafer unit on a holding table, an upper surface heightwise position detecting step of detecting a heightwise position of an upper surface of a reverse side of the wafer along the streets, and a laser beam applying step of applying a laser beam having a wavelength transmittable through the wafer to the wafer from the reverse side thereof along the streets while positioning a focused point of the laser beam within the wafer on the basis of the heightwise position, to thereby form modified layers in the wafer along the streets. 1. A method of processing a wafer having a plurality of intersecting streets on a face side thereof with protrusions on the streets , the method comprising:a laying step of laying the face side of the wafer on a curable resin of a protective member including a protective sheet and the curable resin disposed on the protective sheet and curable by an external stimulus, with a resin film interposed between the face side of the wafer and the curable resin, embedding the protrusions on the face side of the wafer in the curable resin, to thereby render a reverse side of the wafer flat;after the laying step, a wafer unit forming step of applying the external stimulus to the curable resin to cure the curable resin into a cured resin layer, thereby forming a wafer unit including the protective sheet, the cured resin layer on the protective sheet, the resin film on the cured resin layer, and the wafer disposed on the resin film with the reverse side of the wafer being exposed;a holding step of holding the protective sheet of the wafer unit on a holding table;after the holding step, an upper surface heightwise position detecting step of detecting a heightwise position of an upper surface of the reverse side of the wafer along the streets; anda laser beam applying step of ...

METHOD AND SYSTEM FOR LASER FOCUS PLANE DETERMINATION IN A LASER SCRIBING PROCESS

In embodiments, a method of laser scribing a mask disposed over a semiconductor wafer includes determining a height of the semiconductor over which a mask layer is disposed prior to laser scribing the mask layer. In one embodiment the method includes: determining a height of the semiconductor wafer under the mask in a dicing street using an optical sensor and patterning the mask with a laser scribing process. The laser scribing process focuses a scribing laser beam at a plane corresponding to the determined height of the semiconductor wafer in the dicing street. Examples of determining the height of the semiconductor wafer can include directing a laser beam to the dicing street of the semiconductor wafer, which is transmitted through the mask and reflected from the wafer, and identifying an image on a surface of the wafer under the mask with a camera. 1. A method of laser scribing a mask disposed over a semiconductor wafer , the method comprising:determining a height of the semiconductor wafer under the mask in a dicing street using an optical sensor; andpatterning the mask with a laser scribing process, the laser scribing process to focus a scribing laser beam at a plane corresponding to the determined height of the semiconductor wafer in the dicing street.2. The method of claim 1 , wherein determining the height of the semiconductor wafer under the mask in the dicing street using the optical sensor comprises:directing a laser beam to the dicing street of the semiconductor wafer, the laser beam to be transmitted through the mask and reflect from a layer disposed under the mask;detecting, with the optical sensor, a height of the layer disposed under the mask based on the reflected laser beam; anddetermining the height of the semiconductor wafer based on the detected height of the layer disposed under the mask.3. The method of claim 1 , wherein determining the height of the semiconductor wafer under the mask in the dicing street using the optical sensor comprises: ...

BEAM MACHINING OF WORKPIECES

Methods, devices, apparatus, and systems are described for separating workpiece parts from workpieces using a focused machining beam. The methods include creating a trough in the workpiece using the focused machining beam, the trough being created along at least one section of a contour of the at least one workpiece part to be separated from the workpiece, altering a focal position of the machining beam such that the machining beam has a smaller beam diameter on the workpiece, and creating a gap in the workpiece using the machining beam with the altered focal position along at least one section of the contour of the at least one workpiece part to be separated from the workpiece. The gap is created at least partially within the trough. 1. A method of beam machining of a workpiece , from which at least one workpiece part is to be separated , using a focused machining beam , the method comprising:creating a trough in the workpiece using the focused machining beam, wherein the trough is created along at least one section of a contour of the at least one workpiece part to be separated from the workpiece;altering a focal position of the machining beam such that the machining beam has a smaller beam diameter on the workpiece; andcreating a gap in the workpiece using the machining beam with the altered focal position along the at least one section of the contour of the at least one workpiece part to be separated from the workpiece, wherein the gap is created at least partially within the trough.2. The method of claim 1 , wherein creating the gap in the workpiece comprises creating a closed gap along the contour of the at least one workpiece part to cut the at least one workpiece part free.3. The method of claim 1 , wherein creating the gap in the workpiece comprises creating a gap interrupted by at least one web along the contour of the at least one workpiece part.4. The method of claim 1 , wherein claim 1 , after separating the at least one workpiece part from the ...

LASER MACHINING DEVICE AND LASER MACHINING METHOD

A laser processing apparatus that performs laser processing on an object to be processed by irradiating the object with laser light along a line to process includes a support table, a laser light source, a converging unit, a moving unit, an actuator, a displacement sensor, a temperature sensor, and a control unit. The control unit calculates the amount of driving of a converging unit that is performed by the actuator on the basis of a displacement of an incidence surface measured by the displacement sensor and a temperature of the converging unit detected by the temperature sensor, and controls the actuator such that the converging unit is driven according to the amount of driving when the moving unit relatively moves a converging point. 1: A laser processing apparatus that performs laser processing on an object to be processed by irradiating the object with laser light along a line to process , the laser processing apparatus comprising:a support table that supports the object;a laser light source that outputs the laser light;a converging unit including a converging lens for converging the laser light on the object supported by the support table;a moving unit that moves at least one of the support table and the converging unit along an incidence surface of the laser light in the object and relatively moves a converging point of the laser light along the line to process;an actuator for driving the converging unit in a direction crossing the incidence surface;a displacement sensor that measures a displacement of the incidence surface along the line to process;a temperature sensor that detects a temperature of the converging unit; anda control unit that calculates the amount of driving of the converging unit by the actuator on the basis of the displacement of the incidence surface measured by the displacement sensor and the temperature of the converging unit detected by the temperature sensor, and controls the actuator such that the converging unit is driven according ...

Laser Alignment Apparatus and System for Alignment of Output Fiber of a Fiber Laser

A laser alignment system is used to align an output fiber with a fiber laser, for example, when coupling a feeding fiber to a process fiber using a beam coupler or switch. The alignment system includes a laser alignment apparatus that is coupled at a first end to the output fiber and at a second end to a beam dump/power meter. The alignment apparatus defines a light passage and a light capture chamber along the light passage. When light is not aligned into the core of the output fiber, at least a portion of the light passing out of the output fiber will be captured by the light capture chamber and detected by a photodetector in optical communication with the light capture chamber. By monitoring the readings of the photodetector, the output fiber may be properly aligned with the laser light from the fiber laser. 1. A laser alignment apparatus comprising:at least one housing defining a light passage extending from a first end to a second end and a light capture chamber located along the light passage, the light capture chamber having a reflective arcuate inner surface and an inner wall defining a central aperture coaxial with the light passage, wherein the inner wall extends toward the first end and separates the aperture from a portion of the light capture chamber, and wherein the reflective arcuate inner surface of the light capture chamber is configured to reflect light passing from the first end toward the second end when the light is outside the central aperture;at least one photodetector in optical communications with the light capture chamber; anda fiber coupler adapter coupled to the first end of the housing for receiving a fiber coupler at one end of an output fiber optically coupled to a fiber laser.2. The laser alignment apparatus of wherein the fiber coupler adapter is removably mounted to the housing with fasteners.3. The laser alignment apparatus of wherein at least one housing includes an outer housing and an inner housing.4. The laser alignment ...

Laser beam cutting/shaping a glass substrate

An apparatus includes a beam splitter and a plurality of mirrors. The beam splitter is positioned to receive a laser beam from a source and split the received laser beam to a first plurality of split laser beams and a second plurality of split laser beams. The plurality of mirrors is configured to direct the first plurality of split laser beams and further configured to direct the second plurality of split laser beams. The first plurality of split laser beams is directed by the plurality of mirrors is configured to cut a glass substrate. The second plurality of split laser beams is directed by the plurality of mirrors is configured to shape the glass substrate.

Shaping a glass substrate after cutting

A method includes projecting a first energy beam onto an annular edge of a glass substrate. A first portion of the annular edge of the glass substrate is removed with the first energy beam. Removing the first portion increases the roundness of the annular edge of the glass substrate. A second energy beam is projected onto the annular edge of the glass substrate. A second portion of the annular edge of the glass substrate is removed with the second energy beam. Removing the second portion increases the roundness of the annular edge of the glass substrate.

METHOD FOR IDENTIFYING JOINING POINTS OF WORKPIECES AND LASER MACHINING HEAD COMPRISING A DEVICE FOR CARRYING OUT THIS METHOD

A method is provided for identifying joining positions of workpieces. A laser machining head includes a housing through which a work laser beam path is guided. A device for carrying out the method for identifying joining positions of workpieces includes: a camera for capturing images of a joint of workpieces, the viewing beam path of which is coupled coaxially into the work laser beam path; and an illumination device, the illumination beam path of which is coupled coaxially into the viewing beam path and into the work laser beam path. In the method, images of a joint are captured by a camera, and from the images of the joint measurement data for the joining positions is determined. The measurement data is associated with the course of the joint. A model of the course of the joint is determined from a part of the measurement data, the model providing a measurement curve which is output for controlling a joining process and/or for determining additional quality characteristics. 1. A method for identifying joining positions of workpieces prior to welding , wherein:images of a joint are captured by means of a camera; andmeasurement data for the joining positions associated with the course of the joint are determined from the images of the joint,a model of the joint course fitted to the original measurement data being determined from a part of the measurement data, the model being output as a measurement curve for controlling a joining process and/or for determining further quality characteristics.2. The method according to claim 1 , wherein the workpieces are illuminated coaxially to a viewing beam path of the camera.3. The method according to claim 1 , wherein the viewing beam path of the camera for capturing the images of the joint is coaxially coupled into a working laser beam path.4. The method according to claim 1 , wherein measurement data are removed component-dependently from the measurement data associated with the course of the joint claim 1 , and that the ...

MEASURING DEVICE FOR DETERMINING A DISTANCE BETWEEN A LASER PROCESSING HEAD AND A WORKPIECE, LASER PROCESSING SYSTEM INCLUDING THE SAME AND METHOD FOR DETERMINING A DISTANCE BETWEEN A LASER PROCESSING HEAD AND A WORKPIECE

A measuring device determines a distance between a processing head for a laser processing system configured to process a workpiece with a laser beam and the workpiece. The measuring device includes an optical coherence tomograph to measure a distance between the processing head and workpiece. In the optical coherence tomograph, measuring light generated by a measuring light source and reflected by the workpiece interferes with measuring light reflected in a reference arm with two or more reference stages. The stages include a first reference stage configured such that the measuring light reflected therein travels a first optical path length, and a second reference stage configured such that the measuring light reflected therein travels a second optical path length different from the first length, wherein the measuring light reflected by the workpiece interferes with reflected measuring light of the first reference stage and reflected measuring light of the second reference stage. 1. A measuring device for determining a distance between a laser processing head and a workpiece , comprising: a measuring arm for guiding measuring light reflected from the workpiece; and', 'a reference arm with two or more reference stages having different optical path lengths; and, 'an optical coherence tomograph configured to determine a distance between the processing head and the workpiece, the optical coherence tomograph comprising;'}an evaluation unit configured to determine the distance based on a superposition of measuring light from the measuring arm and measuring light from the reference arm.2. The measuring device according to claim 1 , wherein the optical coherence tomograph is configured to superpose the measuring light reflected by the workpiece and the measuring light reflected in the two or more reference stages.3. The measuring device according to claim 1 , wherein the evaluation unit is configured to determine the distance based on an interference between the measuring ...

Gas Nozzle Having a Displaceable Valve Sleeve

This disclosure describes laser machining head gas nozzles that have an exit opening for passage of a laser beam onto a workpiece; an annular gap surrounding the exit opening; and a sleeve disposed and guided displaceably within the annular gap for axial displacement between a rearward and a forward position. The sleeve projects beyond the exit opening at least in the forward position, and the sleeve is tiltably mounted in the annular gap. 1. A gas nozzle for a laser machining head , the gas nozzle comprising:an exit opening for passage of a laser beam onto a workpiece;an annular gap surrounding the exit opening; anda sleeve disposed and guided displaceably within the annular gap for axial displacement between a rearward and a forward position,wherein the sleeve projects beyond the exit opening at least in the forward position, andwherein the sleeve is tiltably mounted in the annular gap.2. The gas nozzle of claim 1 , wherein the sleeve has an externally encircling pointed or spherical centering bead that is displaceably guided and tiltably mounted on an external wall of the annular gap.3. The gas nozzle of claim 1 , wherein (i) an external wall of the annular gap tapers in a conical manner in a forward direction or (ii) a sleeve wall on an external side tapers in a conical manner in a rearwards direction claim 1 , or both (i) and (ii).4. The gas nozzle of claim 1 , wherein the exit opening is formed by a nozzle exit opening of an inner nozzle for directing a core gas flow onto the workpiece.5. The gas nozzle of claim 4 , wherein the annular gap is formed in an outer nozzle for directing an annular gas flow onto the workpiece and the sleeve in the rearward and forward positions opens a nozzle cross-sectional area of the outer nozzle to a different degree.6. The gas nozzle of claim 5 , wherein the inner nozzle and the outer nozzle are formed in a nozzle body claim 5 , and a nozzle bore of the inner nozzle and the annular gap of the outer nozzle are interconnected by ...

EDGE CHAMFERING METHODS

Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a COlaser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or COlasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape. 1. A glass article including at least one chamfered edge having a plurality of defect lines extending at least 250 μm , the defect lines each having a diameter less than or equal to about 5μm.2. The glass article of claim 1 , wherein the glass article comprises chemically strengthened glass.3. The glass article of claim 1 , wherein the glass article comprises non-strengthened glass.4. The glass article of claim 1 , wherein the chamfered edge has an Ra surface roughness less than about 0.5 μm.5. The glass article of claim 1 , wherein the chamfered edge has subsurface damage up to a depth less than or equal to about 75 μm. This application is a divisional of U.S. patent application Ser. No. 14/530,410 filed Oct. 31, 2014, which claims the benefit of U.S. Provisional Application No. 61/917,213 filed on Dec. 17, 2013 as well as the benefit of U.S. Provisional Application No. 62/022,885 filed on Jul. 10, 2014 the entire disclosures of which are incorporated herein by reference.In all cases where glass panels are cut for applications in architectural, automotive, consumer electronics, to mention a few areas, there will be edges, which will very likely require attention. There are as many ...

Robotic laser-guide device for laser shock peening

A robotic laser-guiding device for laser shock peening includes a laser-guiding arm, a reflecting mirror and a manipulator. The laser-guiding arm includes a laser entry tube, a laser-guiding tube, a laser exit tube and a laser shock head sequentially connected. The laser entry tube is rotatably connected to the laser-guiding tube through a joint. The laser-guiding tube is rotatably connected to the laser exit tube through a joint. The laser entry tube is connected to a laser generator. Each joint is provided with the reflecting mirror. The laser emitted by the laser generator passes through the laser entry tube, one reflecting mirror, the laser-guiding tube, another reflecting mirror, the laser exit tube and the laser shock head to irradiate a part, so as to perform the laser shock peening.

WELDING APPARATUS

A welding apparatus includes a multi-axis robotic arm having a first end; a welding tool attached to the first end; an image acquisition device attached to the first end and having a light filtering system; the image acquisition device is configured to monitor a welding target and to provide an image of the welding target to an operator; a control unit is configured to control the robotic arm and the welding tool; an input interface for a human operator is associated to the control unit and is configured to provide an input signal to the control unit and to control the robotic arm and welding tool substantially in real time. 1. Welding apparatus comprising a multi-axis robotic arm having a first end; a welding tool attached to the first end; an image acquisition device attached to the first end , having a light filtering system , the image acquisition device being configured to monitor a welding target and to provide an image of the welding target to an operator; a control unit configured to control the robotic arm and the welding tool; an input interface for a human operator , the input interface being associated to the control unit and configured to provide an input signal to the control unit and to control the robotic arm and welding tool substantially in real time.2. The welding apparatus according to claim 1 , wherein the input interface comprises a haptic interface or a joystick.3. The welding apparatus according to claim 1 , also comprising a scanner positioned on the first end of the robotic arm upstream of the welding tool with respect to an advancing welding direction and configured to provide substantially in real time a scan of at least part of a work piece.4. The welding apparatus according to claim 1 , wherein the input interface is configured to suggest a preferred welding direction as a function of the scan.5. The welding apparatus according to claim 1 , wherein the input interface is configured to provide a force feedback to the operator as a ...

LASER PROCESSING MACHINE

Provided is a laser processing machine that processes a workpiece W using a laser beam. The laser processing machine comprises: first to fourth prisms that are disposed in order along an optical path of the laser beam from an upstream side; first to fourth spindles that respectively and independently hold the first to fourth prisms ; first to fourth holding means that respectively and rotatably hold the first to fourth spindles ; first to fourth motors that are respectively composed of rotors that are respectively fixed to the first to fourth spindles , and stators that are respectively fixed to the first to fourth holding means ; and prism moving means that move the first prism and/or the second prism 110-. (canceled)11. A laser processing machine that performs processing on a workpiece using a laser beam , comprising:a first prism, a second prism, a third prism, and a fourth prism that are disposed in order from an upstream side on an optical path of the laser beam;a first spindle, a second spindle, a third spindle, and a fourth spindle that respectively and independently hold the first prism, the second prism, the third prism, and the fourth prism;first holding means, second holding means, third holding means, and fourth holding means for respectively and rotatably holding the first spindle, the second spindle, the third spindle, and the fourth spindle;a first motor, a second motor, a third motor, and a fourth motor including rotors respectively fixed to the first spindle, the second spindle, the third spindle, and the fourth spindle, and stators respectively fixed to the first holding means, the second holding means, the third holding means, and the fourth holding means;prism moving means for moving at least one of the first prism and the second prism; anda parallel flat plate that is provided in the second spindle so as to be capable of being tilted with respect to an optical axis and disposed downstream of the second prism on the optical path,wherein the first ...

APPARATUS FOR AUTOMATIC JET ANGLE ADJUSTMENT

The invention relates to an apparatus for machining a workpiece with a laser beam . The apparatus comprises a machining unit configured to provide a pressurized fluid jet and to couple the laser beam into the fluid jet . It further comprises a motion unit configured to rotate the machining unit around an x-axis and/or y-axis, a determining unit configured to determine a first angle between the fluid jet and the y-axis and/or a second angle between the fluid jet and the x-axis, and a processing unit configured to control the motion unit to rotate the machining unit 102 around the x-axis based on the first angle and/or around the y-axis based on the second angle. 1100101100. Apparatus () for machining a workpiece with a laser beam () , the apparatus () comprising{'b': 102', '103', '101', '103, 'a machining unit () configured to provide a pressurized fluid jet () and to couple the laser beam () into the fluid jet (),'}{'b': 104', '102, 'a motion unit () configured to rotate the machining unit () around an x-axis and/or y-axis,'}{'b': 105', '103', '103, 'a determining unit () configured to determine a first angle between the fluid jet () and the y-axis and/or a second angle between the fluid jet () and the x-axis, and'}{'b': 106', '104', '102, 'a processing unit () configured to control the motion unit () to rotate the machining unit () around the x-axis based on the first angle and/or around the y-axis based on the second angle.'}2100. Apparatus () according to claim 1 , wherein{'b': 106', '104', '102, 'the processing unit () is configured to control the motion unit () to rotate the machining unit () by a first adjustment angle around the x-axis and/or by a second adjustment angle around the y-axis,'}the first adjustment angle being defined by a difference between a first target angle and the first angle, andthe second adjustment angle being defined by a difference between a second target angle and the second angle.3100. Apparatus () according to claim 1 , wherein{'b': ...

LASER PROCESSING DEVICE AND OPERATION CHECKING METHOD

There is provided a laser processing device that includes a laser light source configured to output laser light, a spatial light modulator configured to modulate the laser light output from the laser light source according to a phase pattern and emit the modulated laser light, an objective lens configured to converge the laser light emitted from the spatial light modulator onto an object, a controller configured to control a phase pattern to be displayed on the spatial light modulator, and a determiner configured to determine whether operation of the spatial light modulator is normal, in which the controller performs switching control in which the phase pattern to be displayed on the spatial light modulator is switched, and the determiner makes the determination on the basis of a change in intensity of the laser light emitted from the spatial light modulator between before the switching control and after the switching control. 1: A laser processing device having at least a first mode in which an object is irradiated with laser light to perform laser processing and a second mode different from the first mode , the laser processing device comprising:a laser light source configured to output the laser light;a spatial light modulator configured to modulate the laser light output from the laser light source according to a phase pattern and emit the laser light;an objective lens configured to converge the laser light emitted from the spatial light modulator onto the object;a controller configured to control a phase pattern to be displayed on the spatial light modulator; anda determiner configured to determine whether operation of the spatial light modulator is normal when the second mode is being executed, whereinthe controller performs switching control in which the phase pattern to be displayed on the spatial light modulator is switched when the second mode is being executed, andthe determiner makes the determination on the basis of a change in intensity of the laser ...

LASER WELDING OF COATED STEELS ASSISTED BY THE FORMATION OF AT LEAST ONE PRELIMINARY WELD DEPOSIT

A method of laser welding a workpiece stack-up () that includes at least two overlapping steel workpieces, at least one of which includes a surface coating of a zinc-based material. The method includes forming at least one preliminary weld deposit () in the workpiece stack-up () and, thereafter, forming a principal laser weld joint. The formation of the principal laser spot weld joint involves advancing a principal welding laser beam () relative to a plane of the top surface () of the workpiece stack-up () along a beam travel pattern () that lies within an annular weld area (). The beam travel pattern () of the principal welding laser beam () surrounds a center area () on the plane of the top surface () that spans the at least one preliminary weld deposit () formed in the workpiece stack-up (). 1. A method of laser welding a workpiece stack-up that includes at least two overlapping steel workpieces , the method comprising:providing a workpiece stack-up that includes overlapping steel workpieces, the workpiece stack-up comprising at least a first steel workpiece and a second steel workpiece, the first steel workpiece providing a top surface of the workpiece stack-up and the second steel workpiece providing a bottom surface of the workpiece stack-up, wherein a faying interface is established between each pair of adjacent overlapping steel workpieces within the workpiece stack-up, and wherein at least one of the steel workpieces in the workpiece stack-up includes a surface coating of a zinc-based material;directing a preliminary welding laser beam at an initial spot location on the top surface of the workpiece stack-up, the preliminary welding laser beam impinging the top surface and creating a preliminary molten steel weld pool that penetrates into the workpiece stack-up from the top surface towards the bottom surface;ceasing transmission of the preliminary welding laser beam at the initial spot location to cause the preliminary molten steel weld pool to solidify into ...

Method and device for etching patterns inside objects

Systems and methods for etching complex patterns on an interior surface of a hollow object are disclosed. A method generally includes positioning a laser system within the hollow object with a focal point of the laser focused on the interior surface, and operating the laser system to form the complex pattern on the interior surface. Motion of the laser system and the hollow object is controlled by a motion control system configured to provide rotation and/or translation about a longitudinal axis of one or both of the hollow object and the laser system based on the complex pattern, and change a positional relationship between a reflector and a focusing lens of the laser system to accommodate a change in distance between the reflector and the interior surface of the hollow object.

LASER TRANSFER APPARATUS AND TRANSFER METHOD USING THE SAME

The application is related to a laser transfer apparatus and a method performed by the laser transfer apparatus. The laser transfer apparatus may include: a laser oscillator configured to perform irradiation with a laser beam; a first stage movably disposed below the laser oscillator; a second stage movably disposed below the first stage; a flatness measurement sensor; and a controller. The controller may be configured to control, once a transfer substrate on which a plurality of light emitting diodes (LEDs) are arranged is loaded on the first stage, and a target substrate is loaded on the second stage, the flatness measurement sensor to measure flatness of each of the transfer substrate and the target substrate, and adjust a height of at least one of the first stage or the second stage based on the flatness. 1. A laser transfer apparatus comprising:a laser oscillator configured to perform irradiation with a laser beam;a first stage movably disposed below the laser oscillator;a second stage movably disposed below the first stage;a flatness measurement sensor; and once a transfer substrate on which a plurality of light emitting diodes (LEDs) are arranged is loaded on the first stage, and a target substrate is loaded on the second stage, control the flatness measurement sensor to measure flatness of each of the transfer substrate and the target substrate, respectively; and', 'adjust a height of at least one of the first stage or the second stage based on the flatness., 'a controller, wherein the controller is configured to2. The laser transfer apparatus as claimed in claim 1 , wherein the controller is further configured to:move the first and second stages to move the transfer substrate and the target substrate to transferring positions, respectively, andpredict respective arrival times of the first and second stages at the transferring positions based on moving speeds of the first and second stages, respectively, to control a laser irradiation timing of the laser ...

Machining Head for a Laser Machining Device

The invention relates to a machining head for a laser machining device, which is equipped for machining a workpiece () using laser radiation (). The laser machining head comprises an adjustable focusing optical unit (), which focuses the laser radiation () in a focal spot (). The distance between the focal spot () and a machining head can be modified by modifying the focal length of the focusing optical unit (). A scanning apparatus () deflects the laser radiation () in different directions. An optical coherence tomography device () measures a distance between the treatment head and the workpiece (). Here, measuring light (), which was generated by a measuring light source () and reflected by the workpiece (), interferes in the coherence tomography device () with measuring light, which traveled an optical path length in a reference arm (). A path-length modulator () is disposed in the reference arm () and it updates the optical path length in the reference arm () synchronously with, and dependent on, a change in the focal length of the focusing optical unit (). 2. The processing head of claim 1 , wherein claim 1 , when the focal length of the focusing optics changes by Δd claim 1 , the path length modulator changes the optical path length in the reference arm by 2Δd.3. The processing head of claim 1 , wherein the optical coherence tomograph is an FD-OCT.4. The processing head of claim 1 , wherein the path length modulator comprises a displaceable mirror claim 1 , which is arranged in a folded beam path in such a way that on a shifting of the mirror by the distance s the optical path length changes by at least 8s.5. The processing head of claim 4 , wherein the path length modulator has an optical axis and two pairs of reflecting plane surfaces which are respectively arranged at an angle of 90° to one another and at 45° with respect to the optical axis claim 4 , the pairs being arranged in a manner rotated azimuthally with respect to the optical axis by an angle of 60 ...

Method for Measuring the Distance Between a Workpiece and a Machining Head of a Laser Machining Apparatus

According to a method for measuring the distance between a workpiece and a machining head of a laser machining apparatus, a machining head is provided, which has a housing that has an interior and an opening for emergence of the laser radiation from the machining head. The laser radiation is directed on to the workpiece, after it has passed through the interior and the opening. An object beam is directed on to the workpiece by a light source of an optical coherence tomograph in such a manner that the object beam passes through the interior and the opening before being incident upon the workpiece. In addition to the object beam, a measuring beam passes through the interior. The measuring beam is used to compensate falsifications of the measured distance that have been caused by pressure fluctuations in the interior. The measuring beam in this case may be reflected at a reflective face that is formed on an inner face of an outlet nozzle that comprises the opening, which inner face delimits the interior. 2. The method of claim 1 , wherein the measuring beam is reflected at a reflective face that is formed on an inner face of the housing of the machining head that delimits the interior.3. The method of claim 2 , wherein the reflective face is formed on the inner face of an outlet nozzle that comprises the opening claim 2 , and wherein claim 2 , during the measurement of the distance claim 2 , a pressurized gas emerges from the opening in addition to the laser radiation and the object beam.4. The method of claim 1 , wherein the measuring beam is likewise generated by the light source of the coherence tomograph claim 1 , and wherein a reflection of the measuring beam is superimposed with a further beam generated by the light source.5. The method of claim 4 , wherein fluctuations of the optical path length of the measuring beam claim 4 , which are caused by pressure fluctuations claim 4 , are determined from a superimposition of the measuring beam with the further beam ...

Laser Processing Head Comprising a Lens Interchange System

A laser processing head, by means of which lenses in the beam path of the laser beam may be interchanged for the purposes of changing the beam diameter at the workpiece, wherein the laser processing head may have a structurally simple and compact embodiment. 1. A laser processing head with a lens interchange system comprising:a frame swivelable about an axis of rotation; andtwo lenses with different focal lengths, each lens attached to the frame;wherein the lens interchange system is configured to selectively bring each of the two lenses into a beam path of a laser beam in the laser processing head;wherein the axis of rotation extends perpendicular to a direction of a laser beam axis of the laser beam and perpendicular to a plane of rotation that comprises the optical axes of the two lenses,wherein the optical axes of both lenses cross at a crossing point, andwherein the optical axes of the two lenses are each spaced a substantially equal distance from the axis of rotation in the plane of rotation.2. The laser processing head of claim 1 , wherein the axis of rotation intersects an angle bisector between the optical axes of the two lenses.3. The laser processing head of claim 1 , wherein the lens planes of the two lenses intersect in a straight vertex line such that the axis of rotation is parallel to the straight vertex line and at a distance from the straight vertex line.4. The laser processing head of claim 1 , wherein the axis of rotation extends through the crossing point.5. The laser processing head of claim 1 , wherein the optical axes of the two lenses intersect at right angles.6. The laser processing head of claim 1 , wherein the frame and the axis of rotation are configured in such a way that the two lenses are swiveled into the beam path of the laser beam at positions offset by a distance AZ along laser beam axis.7. The laser processing head of claim 6 , wherein the distance AZ corresponds to the difference in the focal lengths of the two lenses.8. The ...

Laser processing apparatus and optical adjustment method

A laser processing apparatus emits processing light, measurement light, processing guide light, and measurement guide light with which a surface of a workpiece is irradiated. Respective wavelengths of the processing guide light and the measurement guide light are set to wavelengths at which a deviation amount between an irradiation position of the processing guide light and an irradiation position of the measurement guide light due to a chromatic aberration of magnification of a lens, and a deviation amount between an irradiation position of the processing light and an irradiation position of the measurement light due to the chromatic aberration of magnification of the lens are equal to each other. Therefore, positioning of spot positions of a plurality of laser lights having different output differences can be realized with high accuracy and high speed.

LASER DEVICE AND LASER PROCESSING DEVICE USING SAME

A laser device includes a laser oscillator emitting a laser beam, and an optical unit receiving the laser beam and emitting the laser beam to outside. The optical unit includes: a partially transmissive mirror reflecting a part of the laser beam toward the outside while transmitting a remaining part of the laser beam; a diffusion plate diffusing the laser beam passed through the partially transmissive mirror and deflecting the laser beam in a predetermined direction, at a predetermined diffusion angle; and a photodiode receiving the laser beam deflected by the diffusion plate, and outputting an electric signal. The laser device is configured such that deviation of an optical axis of the laser beam is monitored based on an output signal of the photodiode. 1. A laser device comprising:a laser oscillator emitting a laser beam, and an optical unit receiving the laser beam emitted from the laser oscillator and emitting the laser beam to outside,the optical unit including: a partially transmissive mirror reflecting a part of the laser beam toward the outside while transmitting a remaining part of the laser beam; a light deflecting member diffusing a laser beam passed through the partially transmissive mirror and deflecting the laser beam in a predetermined direction, at a predetermined diffusion angle; and a light receiver receiving the laser beam deflected by the light deflecting member and outputting an electric signal,the laser device being configured such that deviation of the optical axis of the laser beam is monitored based on an output signal of the light receiver.2. The laser device of claim 1 , whereinthe light receiving surface of the light receiver has a width equal to or smaller than a half value width of a laser beam deflected by the light deflecting member on the light receiving surface.3. The laser device of claim 1 , whereinthe laser oscillator is configured to stop laser oscillation in a case in which an output signal of the light receiver decreasing by a ...

DEVICE AND METHOD FOR SEPARATING A TEMPORARILY BONDED SUBSTRATE STACK

A method for separating a temporarily bonded substrate stack by bombardment of a joining layer of the substrate stack by means of laser beams emitted by a laser, characterised in that laser beams of the laser reflected and/or transmitted at the temporarily bonded substrate stack are detected during the bombardment of the joining layer with the laser beams. The invention also relates to a corresponding device. 19-. (canceled)10. A method for separating a temporarily bonded substrate stack , said method comprising:bombarding a joining layer of the temporarily bonded substrate stack by means of laser beams emitted by a laser;detecting the laser beams of the laser that are reflected and/or transmitted at the temporarily bonded substrate stack during the bombarding of the joining layer with the laser beams; andmonitoring and/or adapting parameters of the laser during the bombarding of the joining layer.11. The method according to claim 10 , wherein the method includes detecting the reflected and/or transmitted laser beams of the laser before the bombarding of the joining layer with the laser beams at the temporarily bonded substrate stack or a reference substrate stack.12. The method according to claim 10 , wherein the method includes controlling a beam shape and/or an intensity profile of the laser beams by means of the detected laser beams.13. The method according to claim 10 , wherein the bombarding of the joining layer takes place in a scanned manner with the laser beams.14. The method according to claim 10 , wherein the method includes evaluating the detected laser beams to control a process for separating the temporarily bonded substrate stack.15. A device for separating a temporarily bonded substrate stack claim 10 , said device comprising:means for bombardment of a joining layer of a substrate stack by means of laser beams emitted by a laser;detection means for detecting the laser beams of the laser reflected and/or transmitted at the temporarily bonded substrate ...

LASER MACHINING SYSTEM AND METHOD FOR MACHINING A WORKPIECE USING A LASER BEAM

A machining head is provided for a laser machining system configured to machine a workpiece using a laser beam. The machining head includes a housing having an opening for emitting the laser beam from the machining head; at least one reflective reference at the housing; and a measuring device configured to direct an optical measurement beam towards the opening and the at least one reflective reference. The measuring device is further configured to determine a distance (d) between the end portion and the workpiece on the basis of a first reflection (A) of the optical measurement beam from the at least one reflective reference and a second reflection (B) of the optical measurement beam from the workpiece. 1. A laser machining system for machining a workpiece using a laser beam , comprising:a machining head with a housing having an opening for emitting said laser beam from said machining head, and at least one reflective reference for reflecting a measurement beam; anda measuring device configured to direct an optical measurement beam through said opening onto said workpiece and onto said reflective reference, said optical measurement beam passing through said opening substantially in parallel to said laser beam,{'b': '1', 'wherein said measuring device is further configured to determine a distance (d) between said machining head and said workpiece based on a first reflection (A) of said optical measurement beam from said reflective reference and on a second reflection (B) of said optical measurement beam from said workpiece, and to determine a machining depth and/or a distance to a machining ground based on said first reflection (A) and a third reflection (C) from a machining point of said laser beam.'}21. The laser machining system according to claim 1 , wherein said measuring device is configured to determine said distance (d) between an end portion of said machining head and said workpiece while taking into account a known offset (z) between said reflective ...

Time of flight camera for welding machine vision

A machine-vision-assisted welding system comprises welding equipment, a time of Flight (ToF) camera operable to generate a three-dimensional depth map of a welding scene, digital image processing circuitry operable to extract welding information from the 3D depth map, and circuitry operable to control a function of the welding equipment based on the extracted welding information. The welding equipment may comprise, for example, arc welding equipment that forms an arc during a welding operation, and a light source of the ToF camera may emit light whose spectrum comprises a peak that is centered at a first wavelength, wherein the first wavelength is selected such that a power of the peak is at least a threshold amount above a power of light from the arc at the first wavelength.

NOVEL THERMAL PROCESSING APPARATUS

The present invention generally relates to an optical system that is able to reliably deliver a uniform amount of energy across an anneal region contained on a surface of a substrate. The optical system is adapted to deliver, or project, a uniform amount of energy having a desired two-dimensional shape on a desired region on the surface of the substrate. An energy source for the optical system is typically a plurality of lasers, which are combined to form the energy field. 1. An apparatus for thermally processing a substrate , comprising:a source of electromagnetic energy operable to produce pulses of electromagnetic energy;a substrate support operable to move a substrate with respect to the electromagnetic energy; andan optical system disposed between the source of electromagnetic energy and the substrate support, the optical system comprising a pulse combiner, a pulse shaper, a homogenizer, and an aperture member having an energy blocking member embedded therein, wherein the energy blocking member is disposed at a focal plane of the electromagnetic energy.2. The apparatus of claim 1 , wherein the pulse combiner comprises a combining optic with a selecting surface and two rotatable polarizing filters.3. The apparatus of claim 1 , wherein the aperture member comprises enclosed edges.4. The apparatus of claim 2 , wherein the homogenizer comprises two microlens arrays.5. The apparatus of claim 3 , wherein the pulse shaper comprises a plurality of mirror pairs and a plurality of splitters claim 3 , wherein two mirror pairs are a different distance from a datum of the pulse shaper.6. The apparatus of claim 4 , wherein each of the two microlens arrays has a square shape.7. The apparatus of claim 6 , wherein the pulse combiner comprises a diagnostic module with a detector that detects the temporal shape of a pulse and a detector that detects the energy content of the pulse.8. The apparatus of claim 5 , further comprising an imaging system with a sampling optic optically ...

Method for Processing a Workpiece and Processing Device

A method for processing a workpiece with a processing device which has a processing head which can be moved at a defined speed and distance from a surface of the workpiece, the method comprising at least partially detecting a surface topography of the workpiece to be processed, determining a minimum desired operating distance of the processing head from the workpiece with reference to the detected surface topography of the workpiece and a trailing spacing of the processing head associated with the defined speed, and processing the workpiece with the processing head at the established minimum desired operating distance of the processing head from the workpiece.