МНОГОЛУЧЕВАЯ ЛАЗЕРНАЯ СИСТЕМА И СПОСОБЫ СВАРКИ

Изобретение относится к лазерной системе с многолучевым выходным излучением (варианты) и способу сварки заготовок. Система представляет мультиволоконную лазерную систему, подающую выходное излучение по меньшей мере по трем волокнам, расположенным по окружности или же выходное излучение по меньшей мере четырех отдельных лазеров из одного рабочего кабеля. Изобретение позволяет управлять по меньшей мере тремя лазерными модулями и подавать, соответственно, их выходное излучение в заранее заданной последовательности внутри одного рабочего кабеля, обеспечивая таким образом множество стадий обработки заготовки, которая ранее требовала отдельной оптической системы для каждого луча. Выходное излучение по меньшей мере трех лазеров оптимизировано для применения в создании точечных сварных соединений, шовных сварных соединений или виртуальных осцилляционных сварных соединений при использовании для шовной сварки. 3 н. и 17 з.п. ф-лы, 10 ил.

Устройство для лазерного термоупрочнения резьбы и способ лазерного термоупрочнения резьбы

Группа изобретений относится к устройству и способу лазерного термоупрочнения резьбы и может быть применена в машиностроительной, нефтедобывающей и других отраслях промышленности. Поверхность резьбовой канавки обрабатывают лазерным пучком. Профиль интенсивности лазерного пучка изменяют таким образом, чтобы интенсивность лазерного излучения по его краям превышала интенсивность лазерного излучения в его центральной области. Технический результат заключается в снижении риска уменьшения толщины закаленного слоя, получаемого на поверхности резьбовой канавки в процессе ее обработки лазерным пучком. 2 н. и 9 з.п. ф-лы, 2 ил.

СПОСОБ СТЫКОВОЙ ЛАЗЕРНОЙ СВАРКИ ДВУХ МЕТАЛЛИЧЕСКИХ ЛИСТОВ ПЕРВЫМ И ВТОРЫМ ПЕРЕДНИМИ ЛАЗЕРНЫМИ ЛУЧАМИ И ЗАДНИМ ЛАЗЕРНЫМ ЛУЧОМ

Изобретение относится к способу стыковой лазерной сварки двух металлических листов (2, 4). Обеспечивают наличие первого металлического листа (2) и второго металлического листа (4), осуществляют стыковую сварку металлических листов (2, 4) в направлении сварки. Стыковая сварка содержит одновременное испускание: первого переднего лазерного луча (12), образующего первое переднее пятно (18) на пересечении с первым металлическим листом (2) и генерирующего первое переднее сквозное проплавление в первом металлическом листе (2) у первого переднего пятна (18), второго переднего лазерного луча (14), образующего второе переднее пятно (20) на пересечении со вторым металлическим листом (4) и генерирующего второе переднее сквозное проплавление во втором металлическом листе (4) у второго переднего пятна (20), и заднего лазерного луча (16), образующего заднее пятно (22) на первом и втором металлических листах (2, 4) и генерирующего заднее сквозное проплавление в первом и втором металлических листах (2, ...

МНОГОЛУЧЕВАЯ ЛАЗЕРНАЯ СИСТЕМА И СПОСОБЫ СВАРКИ

VERFAHREN UND VORRICHTUNG ZUM ABSTIMMEN DER EIGENFREQUENZ EINES SCHWINGKOERPERS AUS PIEZOELEKTRISCHEM KRISTALL

Druckkopf

Verfahren und Vorrichtung zur Verwendung analoger Testsignale in digitaler Umgebung

Modular aufgebauter, gepulster Mehrwellenlängen-Festkörperlaser für medizinische Therapieverfahren

Laser-beam working - using additional energy source to maintain plasma energy coupling capability during time in cycle when main laser beam is switched off

Method of working a workpiece with a laser beam consists of directing the laser beam onto the workpiece for a short time (T1) with an intensity (1b) which is above the lower level (Ic) at which a surface plasma is produced but below an upper level (Id) at which a laser beam induced detonation wave is produced. The beam is cyclically broken and replaced during the non-working stage by a second energy beam. The duration of the second beam is much longer than that of the first beam which built the plasma and has an intensity (IL2) which avoids any beam induced detonation waves. After a predetermined time (Tr) the first beam is renewed for the required time (T1). ADVANTAGE - The second energy beam ensures that the plasma is not fully extinguished and retains an energy coupling through it. This unbroken energy coupling increases the coupling rate of the energy over the working time thereby increasing the working efficiency without fear of detonation waves.

Anordnung zur Fabrikation mikrooptischer Elemente

Abtragvorrichtung zur Krümmungskorrektur der Hornhaut.

Method and apparatus for treatment of workpiece surfaces

Laser radiation (16, 20) from wavelength ranges near infrared or the visible and ultraviolet spectrum is applied to the workpiece surfaces under nitrogen atmosphere. An ND yag laser (18) and an excimer laser (14) are separated from one another. Their beams (20, 16) are oriented coaxially using a beam splitter (22), and reach the workpiece surface (10) via an optical unit (24).

Medical laser probe for hard tissue treatment

Laser probe, detachably fitted at the front end of a handle for treating hard organic tissue, consists of an optical fibre (9) with a core (25) and a cladding (27) and has a refractive index distribution in which the refractive index at the centre of the core is lower than that in the surrounding core region, the probe being used with laser light of wavelength 1.0-5.5 microns, output energy 1-2500 mJ, pulse width 1-9 msec. and pulse cycle 1-200 pulses per sec. The core (25) consists of SiO2 with a lower GeO2 concentration in its peripheral region than that in its central region; a fluorine-containing SiO2 interlayer (26) is provided between the core (25) and cladding (27); and the cladding (27) consists purely of SiO2.

Tubular inductive element with airgap - is manufactured by focussing laser beam on axially moving outer surface for elongated holes

Tubular inductive component is manufactured with an airgap to produce a high magnetic reluctance. The material is a hard, brittle ceramic which has magnetic properties, and a conductor is fed through the hollow of the tube. A laser beam is concentrated on the outer surface of the tube to cause part of the material to evaporate. The tube is then moved in the axial direction relative to the beam which produces a longitudinal slot in the outer surface of the material. The guide slab has a V shaped channel for sealing the workpiece. The size and shape of the elongated holes can be controlled. The focussing of the beam is such that the material structure of the remote wall will remain unaffected.

Structuring the surface of materials

Material such as glass, plastic, semiconductor material, wood or ceramic is surface worked using a laser beam of wavelength 1.4-3.0 mu m.

Vorrichtung zum Materialabtragen bei Werkstücken mittels Laserstrahl

Die Erfindung betrifft eine Vorrichtung zum Abtragen von Material bei einem Werkstück mittels eines Laserstrahles, insbesondere eine Laserbohrvorrichtung, umfassend eine Laseranordnung zur Erzeugung eines Laserstrahles, der aus wenigstens einem Laserpuls besteht, der durch Parameterwerte wie z. B. Pulsdauer, Pulsabstand, Laserwellenlänge, Laserintensität charakterisiert ist. DOLLAR A Um eine derartige Vorrichtung hinsichtlich Abtragungsfortschritt und Abtragungspräzision zu verbessern, wird erfindungsgemäß vorgeschlagen, die Laseranordnung so auszugestalten, daß sie wenigstens zwei Typen von Laserpulsen erzeugt, die sich hinsichtlich mindestens eines Parameterwertes unterscheiden.

LASERSTRAHLSCHWEISSEN.

Verfahren und Vorrichtung zur Formung von Strahlung für die Laserbearbeitung

Die Erfindung betrifft ein Verfahren und eine Laseranordnung zur Materialbearbeitung, wobei in einer Laseranordnung ein Laserstrahl auf eine Bearbeitungs-/ Abbildungsebene fokussiert und der Laserstrahl mittels mindestens eines Strahlformers hinsichtlich seiner Intensitätsverteilung angepasst werden kann. Dabei ist vorgesehen, dass der Laserstrahl zur Vermeidung von Uniformitätsfehlern in der Bearbeitungs-/ Abbildungsebene mittels mindestens eines Strahlteilers in mindestens zwei Teil- oder Einzelstrahlen aufgeteilt wird und die Teil- oder Einzelstrahlen derart unterschiedlich beeinflusst werden oder jeder Teil- oder Einzelstrahl aus einer Laserquelle mit unterschiedlicher Wellenlänge gebildet wird, dass diese nach deren Zusammenführung und Fokussierung auf die Bearbeitungs-/ Abbildungsebene einen Ausgangsstrahl mit einem Intensitätsprofil bilden, wobei benachbarte Intensitätsmaxima des Intensitätsprofils sich in ihren Lichteigenschaften unterscheiden. Damit kann eine störende Interferenzbildung ...

Laserbearbeitungsanlage mit wählbarer Wellenlänge des Bearbeitungsstrahls

Strahlführungssystem (3) für eine Laserbearbeitungsanlage (1) zum wählbaren Bearbeiten eines Werkstücks (8) mit einem primären Laserbearbeitungsstrahl (6) und/oder einem auf dem Laserbearbeitungsstrahl basierenden frequenzkonvertierten Bearbeitungsstrahl (44), miteinem Strahleingang (3') zum Aufnehmen eines zu einem Werkstück (8) zu führenden Laserstrahls (34),einem Polarisationszustand-einstellenden Element (38) zum Bereitstellen eines ersten Polarisationszustands (36A) oder eines zweiten Polarisationszustands (36B) oder einer Überlagerung des ersten Polarisationszustands (36A) und des zweiten Polarisationszustands (36B) des zu führenden Laserstrahls (34),einer Frequenzkonversionseinheit (30, 30A, 30B) mit einer Metamaterialstruktur (42), die den Laserstrahl (34) im ersten Polarisationszustand (36A) nicht frequenzkonvertiert und als den primären Laserbearbeitungsstrahl (6) weiterführt und die für den Laserstrahl (34) im zweiten Polarisationszustand (36B) eine auf der Metamaterialstruktur ...

Verfahren und Vorrichtung zur Formung von Strahlung für die Laserbearbeitung

Verfahren zur Strahlformung bei einem Laserbearbeitungsprozess, bei dem in einer Laseranordnung (20) ein Laserstrahl (22) auf eine Bearbeitungs- / Abbildungsebene (29) fokussiert und der Laserstrahl (22) mittels mindestens eines Strahlformers (26, 30) hinsichtlich seiner Intensitätsverteilung angepasst werden kann, wobei der Laserstrahl (22) zur Vermeidung von Uniformitätsfehlern in der Bearbeitungs-/ Abbildungsebene (29) mittels mindestens eines Strahlteilers (23) in mindestens zwei Teil- oder Einzelstrahlen (24, 25, 35) aufgeteilt wird und die Teil- oder Einzelstrahlen derart unterschiedlich beeinflusst werden oder jeder Teil- oder Einzelstrahl aus einer Laserquelle (21) mit unterschiedlicher Wellenlänge gebildet wird, dass diese nach deren Zusammenführung und Fokussierung auf die Bearbeitungs-/ Abbildungsebene (29) einen Ausgangsstrahl (28) mit einem Intensitätsprofil (28.1) bilden, wobei benachbarte Intensitätsmaxima des Intensitätsprofils (28.1) sich in zumindest einer Lichteigenschaft ...

Laser hand=held tool for medical treatment of teeth, bone and soft tissue - has interchangeable tubular tip insert contg. optical fibre and lens

The laser tool has a hand grip (2) with an interchangeable tubular insert (9) carrying an optical fibre (11) fitted at the front end. The inset (9) has at least one lens (16) at the tip. The insert (9) includes a spacing member (17) between lens (16) and an optical fibre end (11) with a central bore for the laser beam. The tip of the insert (9) has a coaxial outer sleeve (14) with an outer retaining lip (15) for the lens (16). ADVANTAGE - Little wear of optical fibre ends provides precise laser emission.

Laserstrahlschweissvorrichtung

Einrichtung zur Strahlbeeinflussung bei der Werkstückbearbeitung mit einem Hochenergielaserstrahl

Laserstrahl-Bearbeitungsmaschine mit erstem und zweitem Strahlführungsteil zum Verkürzen der Länge des optischen Weges, der gleichmässig während der Laserbearbeitung behalten wird

Vorrichtung und Verfahren zum Herstellen kundenspezifischer weicher Kontaktlinsen

Die vorliegende Erfindung bezieht sich auf eine Vorrichtung und ein Verfahren zum Herstellen kundenspezifischer weicher Kontaktlinsen, bei dem ein vorgeformter Kontaktlinsen-Rohling entsprechend der Daten einer refraktiven Messung nachbearbeitet wird. Gegenüber herkömmlichen Herstellungsverfahren zeichnet sich das erfindungsgemäße Verfahren dadurch aus, dass die refraktive Messung an einem Auge mit aufsitzender, hydratisierter Kontaktlinse durchgeführt wird, während anschließend die Nachbearbeitung an einem zur Kontaktlinse herstellungsgleichen Kontaktlinsen-Rohling vor dessen Hydratisierung durchgeführt wird.

Method for ablating, joining, penetrating or surface treating workpieces with laser radiation, comprises moving focused laser radiation on working path relative to workpiece, where the relative motion is guided with varying velocities

The method for ablating, joining, penetrating or surface treating materials/workpieces with laser radiation, comprises moving the focused laser radiation on working path relative to the workpiece, where the relative motion is guided with varying velocities during the processing and a process parameter for a velocity or velocity region (G1, G2) is modulated. The modulation is adjusted in frequency, duty factor, amplitude and/or modulation pattern depending on the velocity of the working path, and the actualization of the parameter is carried out before the termination of the modulation period. The method for ablating, joining, penetrating or surface treating materials/workpieces with laser radiation, comprises moving the focused laser radiation on working path relative to the workpiece, where the relative motion is guided with varying velocities during the processing and a process parameter for a velocity or velocity region (G1, G2) is modulated. The modulation is adjusted in frequency, ...

Apparatus and method for making a laser beam uniform by multi-dimensional bending of optic fibers

Solid state laser apparatus

A slab-shaped laser medium 1, excited by a lamp 2 and cooled by a flow of water 5, is supported at side surfaces 12 by support members 5. Deviations 52 from a smooth plane surface are formed at an inner surface of the support members 5, facing the slab, or at a back surface. The deviations, in the form of grooves or concavities, can be used to control the temperature distribution of the laser medium. They may provide a coolant path, e.g. for a flow of water. The distribution of pitch, area and/or depth of the deviations can be varied in the longitudinal and/or transverse direction of the laser medium 1.

Optical transmission and solid state laser devices using graded index optical fibre

An optical transmission device 800 has a graded index optical fiber 9 having a core of diameter s , refractive index n 0 at a center of the core, and a difference * capital Greek delta *n between refractive indexes of the center of the core and a peripheral section of the core; an optical fiber incident system 8 and a laser emitting device 10. The focusing lens holder 101 and/or optic fibre holder 102 are movable. Beam splitter 14 and laser beam monitor 15 may control movable device 104.

Laser beam machine

LASER PATTERN GENERATION APPARATUS

Shaped-beam laser texturing of magnetic media

Laser cutting apparatus

Laser cutting apparatus comprises a laser (20), means (24,25) for directing the output beam of the laser on to a workpiece (26), and means such as a quarter-wave plate (27) for producing circular polarization of the laser output beam. The laser may include within its optical cavity an element which produces stable linear polarization of the output beam. The quarter-wave plate (27) then covers the polarization into circular polarization.

LASER CUTTING APPARATUS

Ink jet head nozzle plate manufacturing method,ink jet head nozzle plate manufacuturing apparatus,ink jet head nozzle plate,ink jet head,and ink jet recording

MODULATING LASER BEAM

Solid state laser apparatus and laser machining apparatus

Solid state laser apparatus and laser machining apparatus

Methods and systems for spectral beam-combining

Process for Producing products using holography technology and apparatus thereof.

DEVICE AND PROCEDURE FOR THE LASER TREATMENT

PROCEDURE FOR THE PRODUCTION OF A POLYMER COURSE WITH SOFT AND SEIDIGEM FEELING DURING CONTACT

APPLIKATIONSANORDNUNG FÜR LASERSTRAHLUNG

LASER MANUFACTURING PROCESS

LASER CORRECTION OF SEHFEHLERN AT THE NATURAL EYEPIECE

LASER APPARATUS FOR MATERIAL PROCESSING.

PROCEDURE AND DEVICE FOR CONNECTING WORKPIECES FROM PLASTIC IN THREE-DIMENSIONAL FORM OF MEANS LASER BEAM

LASER HEAD IN A LASER BEAM PROCESSING MACHINE WITH CHANGE NOZZLES

PROCEDURE FOR WORKING ON A MATERIALES MEANS LASER BEAM TREATMENT

PROCEDURE FOR THE PRODUCTION OF MICRO DRILLINGS

Polymeric web exhibiting a soft and silky tactile impression

Machine for laser working of tubes and profiled sections with a scanning system for scanning the tube or profiled section to be worked

The machine comprises: a working head (12) with a focussing device (18) arranged to focus a laser beam on the surface of the tube or profiled section (T) to be worked, a carriage (26) on which the working head (12) is mounted and a scanning system (20) arranged to scan at least a portion of the outline of the cross-section of the tube or profiled section (T). The carriage (26) is able to translate with respect to the tube or profiled section (T) both in a longitudinal direction (x) coinciding with the longitudinal axis of the tube or profiled section (T) and in a transverse direction (y). The scanning system (20) comprises at least one laser scanning module (20) comprising a laser emitter (22) arranged to emit a light blade (L) with which to illuminate a portion of the tube or profiled section (T) and a camera (24) arranged to acquire an image of the portion of tube or profiled section (T) illuminated by the light blade (L). The working head (12) and the at least one laser scanning module ...

System and assemblage for producing microtexturized substrates and implants

METHOD AND DEVICE FOR COMPLETELY CORRECTING VISUAL DEFECTS OF THE HUMAN EYE

... ²²The invention relates to a method and to a device for completely correcting ²visual ²defects of the human eye. The invention mentions combinations of measuring and ²²treatment methods that allow the complete correction of defects of the human ²eye if ²applied according to the invention. Measuring methods are used that precisely ²detect the ²surface of the cornea and that also register the aberrations that occur in the ²beam path ²up to the retina. The computer-assisted evaluation of these measurement ²results ²combined with the calculation of optimally corrected lenses (for example after ²a cataract ²operation) or of optimally correcting cornea surfaces makes it possible to ²produce a ²patient-specific lens and/or to shape the retina so that it optimally corrects ²the aberration. ²To this end, the invention preferably uses a spot scanning excimer laser ²system and ²makes use of the topography of the eye.² ...

DIODE LASER SOLDERING SYSTEM

A laser soldering system wherein a plurality of laser beams are simultaneously directed to a plurality of spatially separate locations on a printed circuit board for simultaneously soldering. Each of the laser beams is formed by combining the outputs of a plurality of fiber cables, each of which is connected to an individual laser diode.

LASER PULSE PICKING EMPLOYING CONTROLLED AOM LOADING

A laser (126) and an AOM (10) are pulsed at substantially regular and substantially similar constant high repetition rates to provide working laser outputs (40) with variable noimpingement intervals (50) without sacrificing laser pulse-to-pulse energy stability. When a working laser output (40) is demanded, an RF pulse (38) is applied to the AOM (10) in coincidence with the laser output pulse (24) to transmit the laser pulse to a target. When no working laser output (40) is demanded, an RF pulse (38) is applied to the AOM (10) in noncoincidence with the laser output (24), so that the laser pulse is blocked. Thus, the average thermal loading on the AOM (10) remains substantially constant regardless of how randomly the working laser outputs (40) are demanded. The AOM (10) can also be employed to control the energy of the working laser output (40) by controlling the power of the RF pulse (38) applied. When the RF power is changed, the duration (44) of the RF pulse (38) is modified to maintain ...

LASER MACHINING SYSTEMS AND METHODS

A laser machining method includes directing, from an F-theta lens having a long focal length of greater than about 250 millimeters, a laser beam at a non-perpendicular beam tilt angle from an optical axis of the lens having a top-hat profile and a narrow beam divergence angle of between about 1 degree and about 3 degrees towards a workpiece on a stage movable in at least an X-direction and a Y-direction, engaging the directed laser beam with the workpiece disposed in the usable field of view, moving the workpiece and the directed laser beam relative to each other, and removing portions of the workpiece with the directed laser beam to define a machined surface.

LASER MACHINING SYSTEMS AND METHODS

A laser machining method includes directing, from an F-theta lens having a long focal length of greater than about 250 millimeters, a laser beam at a non- perpendicular beam tilt angle from an optical axis of the lens having a top-hat profile and a narrow beam divergence angle of between about 1 degree and about 3 degrees towards a workpiece on a stage movable in at least an X-direction and a Y-direction, engaging the directed laser beam with the workpiece disposed in the usable field of view, moving the workpiece and the directed laser beam relative to each other, and removing portions of the workpiece with the directed laser beam to define a machined surface.

HOLLOW CORE WAVEGUIDE FOR LASER GENERATION OF ULTRASONIC WAVES

A laser transmission system for an ultrasonic workpiece detection system operating in the wavelength range be-tween 3um and 5um. The system comprises a source (102) coupled via a first lens assembly (104) and first hollow core waveguide to an optical fibre (108). The system optical exit comprises a further hollow core waveguide (110) coupling the optical fibre to an exit lens assembly (112).

METHOD FOR PRODUCING A STEEL PROFILED ELEMENT

The invention pertains to the field of steel processing and steel production, in particular of the production of steel profiled elements. The invention relates to a method for producing a steel profiled element, comprising the following steps: providing a workpiece (2, 44, 52), in particular a steel blank, preferably a steel strip blank; forming a weakened point (10) in the region of a planned bend of the workpiece (2, 44, 52); and bending the workpiece (2, 44, 52) to produce a bend in the workpiece (2, 44, 52). After the bending, the weakened point (10) is strengthened by welding.

IMPROVED PRINT QUALITY LASER MARKER

Laser marker apparatus for marking indicia onto a substrate includes an exit lens having a focal length, a plurality of lasers, a plurality of turning mirrors, and at least one directing mirror. The surface of the substrate to be marked is positioned generally at the focal plane of the lens. The plurality of lasers is arranged so that their energy output beams are oriented in a generally parallel relationship. The plurality of turning mirrors are positioned along the beam path of each respective laser and are oriented to reflect the output beams at predetermined angles. The directing mirrors redirect the output beams to form a column of spaced apart spots on the substrate. One of the directing mirrors is then moved in a first direction so as to form another column of spots on the substrate. Movement in another direction forms a third column of spots on the substrate. The columns are interleaved to create a composite column of higher resolution for marking Alpha-numeric characters.

TWO DIMENSIONAL SCAN AMPLIFIER LASER

The disclosure is directed to a laser amplifier system utilizing a pair of scanning mirrors (28,44) driven in tandem by piezo actuators (29). A low power laser beam (13) is directed between the pair of scanning mirrors (28,44). Each bounce of the laser beam (13) between the mirrors (28,44) discretely increases the power of the beam and changes the angle of exit of the beam from the amplifier providing for precise angular beam exit control.

MULTI-WAVELENGTH LASER OPTIC SYSTEM FOR PROBE STATION AND LASER CUTTING

A probe station which includes a base machine (10), a probe platen (17) mounted on the base machine (10), and a single passive air cooled Nd:YAG laser (100), mounted with a microscope (22). The single laser supplies an output beam to a first non-linear crystal (106) for generating the second harmonic of the fundamental output wavelength. A mirror (107) then directs the beam at a 90 degree angle through a polarizer (108) to repolarize the fundamental wavelength. The beam then passes to a second non-linear crystal (109) for generating the third and fourth harmonic of the fundamental wavelength. A reflecting mirror (111) then directs the beam to a variable attenuator (112) to select the appropriate output wavelength in the infrared (1064 nm), in the green (532 mm), or in the ultraviolet (355 or 266 mm).

SYSTEM AND PROCESS FOR MARKING OR PERFORATING

The invention relates to a system for marking or perforating by laser and to a marking or perforation process in said system, which is comprised of at least one laser (19) which produces a beam, a supply unit for at least one laser (19), a control means (12) with a control program which controls the laser (19), a deflector (16) particularly an optical-acoustic deflector which produces different beam deflection angles, in this case an optical system traversed by the beam, which produces a marking or a perforation configured like a matrix of points (nxm) on a surface of a product in relative motion between the product to be marked or perforated and the laser beam. The supply unit and/or the deflector (16) may be controlled by the control program. The system of the invention provides for a dynamic control of the marking or perforation resolution in a vertical direction.

OBLIQUE ANGLE LASER SHOCK PROCESSING

The invention relates to a method and apparatus for improving properties of a solid material by providing shockwaves therethrough. The method includes controlling the incident angle .theta. of the laser beam applied to the workpiece so that the required residual stresses are created in the workpiece. Particular methods of control such as lenses, polarizers, and particular transparent overlay geometries are shown. The apparatus includes structure for controlling the position and incident angle of the laser beam then controlling the polarization and/or the shape of the incident impact area, based on such incident angle .theta..

Force feed air-cooled electric machine - has fan circulating cooling air through stator-rotor cores and over outer heat exchanger

The air cooled electric machine has a fan mounted at one end of the rotor to draw cool air through the stator/rotor assembly to an antechamber. From the antechamber the fan draws out the warm air and passes it through to a second chamber lying along the outside surface of the stator assembly. The air leaves this second chamber radially through slits and enters the heat exchanger. After leaving the heat exchanger it passes back to the stator/rotor assembly. The heat exchanger consisting of axially parallel pipes carrying a cooling fluid. The heat exchanger is divided into segments distributed around the entire outside surface of the machine.

PROCEDURE AND DEVICE FOR THE PRODUCTION OF FILTER CIGARETTES.

PROCEDURE AND DEVICE FOR MODULATING A LASER BEAM.

Method and device for adjusting an invisible beam of particles or waves

In order when adjusting a laser beam (4) to be able to see both the irradiated object (2) and the beam itself at a point of interest, the beam is periodically interrupted by means of an optomechanical chopper (5). The chopper consists of a sectored disc (5) having transparent and opaque zones (5a, 5b). The latter are coated with an indicator which converts the invisible laser light directly into visible light. ...

SURGICAL TREATMENT DEVICE USING A POWER BEAM HAVING GENERATOR ENVELOPE.

QUENCHING METHOD SIMILAR ELEMENTS SEPARATE, INTEGRAL WITH A COMMON SUPPORT AND REGULARLY SPACED FROM ONE ANOTHER AND DEVICE FOR IMPLEMENTING SAID METHOD.

Method of etching a timepiece and timing element obtained by such a method.

L’invention concerne un procédé de gravage d’un élément (1), comprenant une application sur l’élément d’un faisceau laser (5) dont les impulsions durent chacune moins d’une picoseconde, de sorte à réaliser un usinage pour enlèvement de matière sur l’élément et une coloration de la surface de fond (6) d’usinage. L’invention concerne également un élément obtenu par la mise en œuvre du procédé selon l’invention, un mécanisme horloger comprenant un tel élément ainsi qu’une pièce d’horlogerie comprenant un tel mécanisme ou un tel élément.

Procedure and mechanism for the material treatment by means of a laser beam as well as uses of this mechanism.

Deformation-cash mirror, in particular for a laser beam material processing mechanism.

Weld assembly includes light guide that is flexible to permit exit end of light guide to be aligned with weld line

A weld assembly comprises a laser source that generates laser radiation, and a light guide having entrance (22) and exit surfaces (24). The laser radiation (20) enters the light guide, passes through the light guide and exits the light guide. The exit surface is spaced from a workpiece, and the light guide is flexible to permit the light guide to be aligned with a weld line.

METHOD FOR IMPROVING SURFACE BY LASER TREATMENT

DEVICE FOR MARKING OBJECT, CONTAINING AT LEAST ONE GAS LASER AND RADIATOR

METHOD TO INCREASE THE QUALITY OF NY SURFACE BY MEANS OF LASER TREATMENT

APPARATUS FOR MARKING AN OBJECT WITH AT LEAST ONE GAS LASER AND HEAT DISSIPATOR

Laser processing machine with redundant axes

In the case of a laser processing machine (1) for processing workpieces (2) by means of a laser beam (3), comprising a work support (4) for workpieces (2) to be processed, a traversing unit (5), which can be made to traverse along one or a least two main axes (X, Y) in relation to the work support (4), and an optical processing unit (6), which is provided on the traversing unit (5) and focuses the laser beam (3) on the workpiece (2) to be processed, it is provided that the processing unit (6) is mounted pivotably at its one end (6a) with respect to the work support (4) on the traversing unit (5) about one or at least two additional axes (A, B), that a drive (7) is respectively provided for each additional axis (A, B) on the traversing unit (5) or on the processing unit (6) for deflecting the other end (6b) of the processing unit (6) with respect to the work support (4); about the respective additional axis (A, B), and that a controller (8) is provided, which divides a desired path of the ...

Polymeric web exhibiting a soft and silky tactile impression

A polymeric web exhibiting a soft and silky tactile impression on at least one side thereof is disclosed. The silky feeling side of the web exhibits a pattern of discrete hair-like fibrils, each of the hair-like fibrils being a protruded extension of the web surface and having a side wall defining an open proximal portion and a closed distal portion. The hair-like fibrils exhibit a maximum lateral cross-sectional diameter of between 2 and 5 mils, and an aspect ratio from 1 to 3. Methods and apparatus for making the polymeric web utilize a three-dimensional forming structure having a pluralityof protrusions being generally columnar forms having an average aspect ratio of at least about 1.

For drilling quality management and analysis process and system

Device of ablation of matter, in particular for dentistry

Dispositif d'ablation de matière, notamment une pièce à main (1) pour la dentisterie, comprenant des moyens optiques (6, 16, 22, 32) pour la propagation et le guidage jusqu'à une surface de travail d'un faisceau de lumière cohérente (10), ainsi que des moyens de canalisation (24, 30) pour amener un fluide sous pression jusqu'à la tête de travail (5) du dispositif et une buse (20) située dans ladite tête de travail en aval desdits moyens de canalisation et communiquant avec ces derniers pour former un jet (32) de fluide liquide. Le dispositif est caractérisé en ce qu'il comprend une chambre (30) de détente en amont de ladite buse (20) et en ce que l'axe optique (18) du faisceau de lumière cohérente (10) est aligné sur l'axe central du canal de la buse (20), ledit jet (32) de fluide liquide servant de guide d'onde entre ladite tête de travail (5) et la surface de travail.

Plugging device of a beam having to intermittently strike a given point

La présente invention concerne un dispositif obturateur. Ce dispositif comprend essentiellement trois disques (1, 2, 3) comportant chacun une ouverture (1a, 2a, 3a) autorisant la transmission d'un faisceau (L) et des moyens de commande (M1, M2, M3) pour animer ces disques d'un mouvement périodique, ces moyens de commande agissant de façon telle que les ouvertures (1a, 2a, 3a) se trouvert, à des intervalles de temps prédéterminés, dans une position alignée autorisant la transmission du faisceau jusqu'à une cible quelconque. Ce dispositif s'applique notamment à l'obturation périodique d'un faisceau laser continu permettant par exemple des opérations de soudage ou de positionnement de pièces quelconques dans l'espace.

A METHOD FOR MODULATING A LASER BEAM

PROCEDE DE TRANSMISSION D'UN FAISCEAU LASER ET DISPOSITIF DE TRANSMISSION

PROCEDE DE TRANSMISSION D'UN FAISCEAU LASER POUR EFFECTUER DES OPERATIONS DE FABRICATION. IL CONSISTE A: -ENGENDRER UN FAISEAU LASER PULSE 12 AYANT UNE LONGUEUR D'ONDE DANS L'INFRAROUGE PROCHE OU LE VISIBLE; -FOCALISER CE FAISCEAU LASER VERS UN EMPLACEMENT DE PETITE TAILLE SUR L'EXTREMITE D'UN COEUR 14 D'UNE OPTIQUE A FIBRE UNIQUE 11; -TRANSMETTRE L'ENERGIE AVEC UNE PUISSANCE DE CRETE DU KILOWATT AU MOYEN DE L'OPTIQUE A FIBRES; ET -REFOCALISER LE FAISCEAU EMERGEANT SUR UNE PIECE 21 AVEC UNE DENSITE DE PUISSANCE SUFFISANTE POUR LE TRAVAIL DU MATERIAU. APPLICATION AUX LASERS.

LASER TOOL

PROCEDE ET APPAREIL DE MODULATION D'UN FAISCEAU LASER

L'INVENTION CONCERNE UN APPAREIL DE MODULATION D'UN FAISCEAU LASER. ELLE SE RAPPORTE A UN APPAREIL QUI COMPORTE QUATRE DISQUES ROTATIFS 53, 55, 57 ET 59 AYANT CHACUN PLUSIEURS TROUS ET TOURNANT DE MANIERE QUE LEURS TROUS VIENNENT EN FACE LES UNS DES AUTRES DANS L'ALIGNEMENT D'UN PASSAGE 31 D'UN FAISCEAU LASER. LES DISQUES ENTRAINES SIMULTANEMENT EN ROTATION PROVOQUENT L'OUVERTURE DU PASSAGE A PARTIR DU CENTRE, SI BIEN QUE TOUTE L'ENERGIE CONTENUE DANS LE CENTRE DU FAISCEAU LASER EST TRANSMISE MAIS QUE L'ENERGIE DES BORDS N'EST PAS TRANSMISE. LA REPARTITION D'ENERGIE DU FAISCEAU EST DONC MIEUX DEFINIE ET LE TRAITEMENT REALISE PEUT ETRE PLUS PRECIS. APPLICATION AUX MACHINES D'USINAGE PAR FAISCEAU LASER.

DIFFRACTIVE OPTICS HAS SYNTHESIS Of OPENING AND LASER DEVICE OF CUTTING INCORPORATING SUCH an OPTICS

GENERATING DEVICE Of ENVELOPE Of a BEAM OF POWER

Formation of semiconductor thin film comprises modulating amplitude of homogenized light in direction of relative motion of light to base layer and projecting amplitude-modulated light on non-single crystal semiconductor layer

L'invention se rapporte à un procédé et appareil pour fabriquer un film mince semi-conducteur. L'appareil comporte un laser à dimère ionisé (1) comme source de lumière, un homogénéisateur (3) de la distribution d'intensité de la lumière laser, un masque (5) modulant l'amplitude de façon que l'amplitude de la lumière soit augmentée dans la direction du mouvement relatif de la lumière au substrat amorphe (9), un système optique (6) pour projeter la lumière sur la surface d'un semi-conducteur non-monocristallin (10) formé sur le substrat amorphe (9) de sorte qu'une énergie d'irradiation prédéterminée peut être obtenue, un déphaseur (8) pour réaliser un point de basse température dans la surface irradiée par la lumière, et un étage de substrat apte à déplacer la lumière relativement au substrat amorphe (9) pour permettre un balayage dans les directions X-Y. L'invention s'applique notamment à la fabrication de films semi-conducteurs.

LASER HEAD OF FOCUSING FOR SOLID LASER INSTALLATION

PROCESS AND INSPECTING DEVICE OF THE POWER TRANSMITTED BY A LASER BEAM IN A POINT OF REFERENCE, DEVICE AND PROCESS OF BRAZING

APPARATUS OF REGULATION OF CHARACTERISTICS Of a Beam of light, IN PARTICULAR Of a LASER OF POWER

Crystallization system of silicon and crystallization method of silicon

ULTRA-BROAD BANDWIDTH LASER GLASSES FOR SHORT-PULSE AND HIGH PEAK POWER LASERS

Hybrid laser arc welding process and apparatus

A welding method and apparatus for welding workpieces together by conducting a laser beam welding process on a joint region that includes a weld seam defined by and between faying surfaces of the workpieces, and then conducting a hybrid laser arc welding process on the joint region. The laser beam welding process entails causing a first laser beam to travel along the joint region, penetrate the weld seam and form a weldment. The hybrid laser arc welding process remelts the weldment by simultaneously causing an electric arc and a second laser beam to overlap and travel along the joint region and form a weld pool in the weldment. On cooling, a weld joint is formed within the joint region and its weld seam.

High Throughput Solar Cell Ablation System

A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source.

Установка для лазерной обработки кольцевым пучком

Полезная модель относится к оборудованию для лазерной обработки и может быть использована для изготовления шайб из тугоплавких металлических или изоляционных неметаллических пластин.Техническим результатом полезной модели, совпадающим с задачей, на решение которой она направлена, является повышение производительности установки для лазерной обработки при изготовлении шайб.Технический результат достигается тем, что в установке для лазерной обработки кольцевым пучком, содержащей лазер и расположенные на оси лазерного пучка телескопический преобразователь диаметра лазерного пучка, состоящий из отрицательной линзы и положительной линзы, коническую линзу и фокусирующую линзу, коническая линза выполнена монолитной, состоящей из конуса с углом при его основании, рассчитываемом по уравнению, связывающему фокусное расстояние фокусирующей линзы, показатель преломления материала конической линзы и внутренний диаметр получаемой в результате обработки шайбы, и усеченного конуса с углом при его большем основании, рассчитываемом по уравнению, связывающему фокусное расстояние фокусирующей линзы, показатель преломления материала конической линзы и внешний диаметр получаемой в результате обработки шайбы, радиус меньшего основания усеченного конуса равен радиусу основания конуса, радиус большего основания усеченного конуса выполняют не менее радиуса пучка лазерного излучения после телескопического преобразователя, который рассчитывают по формуле, связывающей радиус конуса, внешний и внутренний диаметр получаемой шайбы. 1 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 168 922 U1 (51) МПК B23K 26/00 (2014.01) B23K 26/064 (2014.01) B23K 26/073 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ФОРМУЛА ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ РОССИЙСКОЙ ФЕДЕРАЦИИ (21)(22) Заявка: 2016125274, 24.06.2016 (24) Дата начала отсчета срока действия патента: 24.06.2016 (72) Автор(ы): Коваленко Александр Фёдорович (RU) Дата регистрации: 28.02.2017 Приоритет(ы): (22) Дата подачи заявки: 24.06.2016 ...

Герметичный корпус

Полезная модель представляет собой герметичный корпус и может быть использована при изготовлении герметичного ввода лазерного излучения в рабочий объем технологических установок, осуществляющих обработку материалов в вакууме или в среде инертных газов. Стенка герметичного корпуса через прокладку с двухсторонней отбортовкой, выполненную из титана, с обеих сторон которой расположена алюминиевая фольга, соединена по всему периметру с входным окном. Окно выполнено из прозрачного в заданном оптическом диапазоне материала и имеет конусоцилиндросферическую форму, коническая поверхность входного окна обращена навстречу лазерному пучку, а сферическая поверхность - внутрь герметичного корпуса. Техническим результатом является расширение функциональных возможностей корпуса за счет фокусировки лазерного излучения в кольцо. 1 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 169 601 U1 (51) МПК B23K 26/067 (2006.01) H01J 17/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ФОРМУЛА ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ РОССИЙСКОЙ ФЕДЕРАЦИИ (21)(22) Заявка: 2016120886, 27.05.2016 (24) Дата начала отсчета срока действия патента: 27.05.2016 24.03.2017 Приоритет(ы): (22) Дата подачи заявки: 27.05.2016 Адрес для переписки: 101000, Москва, Моспочтамт, а/я 918, ФГУП "ВНИИА", начальнику отдела 36, С.В. Жмайло (56) Список документов, цитированных в отчете о поиске: RU156784U1, 20.11.2015. RU119935U1, 27.08.2012. RU156783U1, 20.11.2015. RU155777U1, 20.10.2015. 1 6 9 6 0 1 (45) Опубликовано: 24.03.2017 Бюл. № 9 (73) Патентообладатель(и): Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова" (ФГУП "ВНИИА") (RU) R U Дата регистрации: (72) Автор(ы): Вышинский Павел Николаевич (RU), Коваленко Александр Фёдорович (RU), Федорищев Олег Николаевич (RU), Осипов Геннадий Станиславович (RU) 1 6 9 6 0 1 R U (57) Формула полезной модели Герметичный корпус с входным окном для ввода лазерного излучения в установку для обработки ...

Лазерная оптическая головка

Полезная модель относится к области обработки материалов лазерным лучом, а именно к процессам лазерной сварки, резки, сверления отверстий. При выполнении технологического режима - лазерной резки или сверлении отверстий движение внутреннего подвижного корпуса (3) с внутренним соплом (4) вниз осуществляется ручным штурвалом (5). При выполнении технологического режима - лазерной резки или сверлении отверстий движение внутреннего подвижного корпуса (3) с внутренним соплом (4) вверх происходит аналогичным образом. Перемещение осуществляется по рейке (13), установленной на внутреннем подвижном корпусе (3), где шестерня (12) закреплена на валу (10). Длина хода рейки (13) достигает до 10±0,025 мм, которая получена опытным путем. Для обеспечения резки или сверления отверстий металлов толщиной от 1 мм до 20 мм длина хода рейки (13) равна 5÷10 мм, при этом расстояние между срезом внутреннего сопла (4) и зоной обработки равно диаметру съемной насадки (17) 0,2±0,02 мм. Для обеспечения резки металлов толщиной от 20 мм до 40 мм длина хода рейки (13) равной 1÷5 мм, при этом расстояние между срезом внутреннего сопла 4 и зоной обработки равно диаметру съемной насадки (17) 0,5±0,02 мм. Для обеспечения сварки металлов толщиной от 1 мм до 20 мм расстояние между срезом внутреннего сопла (4) и зоной сварки равно двойному диаметру съемной насадки (17) 0,4±0,02 мм. Уменьшая или увеличивая размер фокусного пятна можно добиться высокого качества обрабатываемых деталей, выполненных резкой, сверлением отверстий или сваркой. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 191 258 U1 (51) МПК B23K 26/14 (2014.01) B23K 26/064 (2014.01) B23K 26/70 (2014.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК B23K 26/14 (2019.05); B23K 26/064 (2019.05); B23K 26/70 (2019.05) (21)(22) Заявка: 2019113412, 29.04.2019 (24) Дата начала отсчета срока действия патента: 31.07.2019 Приоритет(ы): (22) Дата подачи заявки: 29.04.2019 (45) Опубликовано: 31.07.2019 Бюл. № ...

Laser irradiation apparatus

A laser irradiation apparatus for irradiating a laser beam to a semiconductor layer including a plurality of pixel areas, the apparatus includes a laser generator generating the laser beam, and an optical switching unit time-dividing the laser beam generated from the laser generator and transmitting a plurality of time-divided laser beams to a plurality of optical systems. The apparatus includes a first optical system of the plurality of optical systems that receives a first time-divided laser beam and irradiates a first laser slit beam along a first irradiation direction, and a second optical system of the plurality of optical systems that receives a second time-divided laser beam and irradiates a second laser slit beam along a second irradiation direction that is parallel with the first irradiation direction. The first laser slit beam and the second laser slit beam crystallize partial areas at a same location in the respective pixel areas.

Method for Cutting C-Mn Steel with a Fiber Laser

The invention relates to a laser cutting method for cutting a C—Mn steel workpiece, characterized in that laser beam generation means comprising at least one silica fiber with an ytterbium-doped core is used to generate the laser beam. Preferably, the ytterbium-based fiber has a wavelength between 1.07 and 1.1 μ m, preferably 1.07 μ m, the quality factor of the laser beam is between 0.33 and 8 mm.mrad, and the laser beam has a power of between 0.1 and 25 kW. The assistance gas for the laser beam is chosen from nitrogen, helium, argon, oxygen, CO 2 and mixtures thereof, and, optionally, it further contains one or more additional compounds chosen from H 2 and CH 4 .

Automated beam marker

A beam marking system is disclosed for marking on beams with a marking device. The beam marking system includes a beam marking device configured to mark on the surface of a beam. A movable arm is coupled to the marking device. The movable arm has at least three movable components that collectively move the beam marking device along or about at least three axes. A controller is in electronic communication with the movable arm and the marking device. The controller controlling the movement of the at least three movable components of the movable arm and controlling the operation of the marking device. In some instances, the beam marking system can automatically mark beams, such as metal beams used in heavy construction projects in a rapid and accurate manner.

Optical device and laser beam machining apparatus having optical device

An optical device includes: a beam splitter by which a laser beam oscillated from an oscillator is branched into a first branch beam going ahead through transmission and a second branch beam going ahead through reflection; a first mirror by which the first branch beam going out of the beam splitter is reflected to go again toward the beam splitter; a second mirror by which the second branch beam going out of the beam splitter is reflected to go again toward the beam splitter; and a circular disk-like rotating unit for integrally rotating the first mirror and a second mirror, with a laser beam branch point in the beam splitter as a center of rotation.

Methods of temporally varying the laser intensity during scribing a photovoltaic device

Methods for laser scribing a film stack including a plurality of thin film layers on a substrate are provided. A pulse of a laser beam is applied to the film stack, where the laser beam has a power that varies as a function of time during the pulse according to a predetermined power cycle. For example, the pulse can have a pulse lasting about 0.1 nanoseconds to about 500 nanoseconds. This pulse of the laser beam can be repeated across the film stack to form a scribe line through at least one of the thin film layers on the substrate. Such methods are particularly useful in laser scribing a cadmium telluride thin-film based photovoltaic device.

Laser irradiation apparatus, laser irradiation method, fabrication method for thin film semiconductor device and fabrication method for display apparatus

A laser irradiation apparatus, including: an optical system configured to form laser light of a linear cross section to be irradiated on an irradiation object; and a cutting member having a light blocking portion configured to block the laser light formed in the linear cross section by the optical system to cut the laser light so as to have a predetermined length along a line longitudinal direction; the light blocking portion having a plurality of fins provided on the light blocking portion thereof so as to fetch and absorb the laser light.

Defect correcting apparatus and defect correcting method

The present disclosure provides a defect correcting apparatus including a defect detecting device configured to detect a defect within a repetitive pattern in a multilayer substrate a defect correcting device configured to correct the defect in the multilayer substrate by a specified defect correcting method, and a control device configured to, when the defect detected by the defect detecting device is detected overlapping a region in which occurrence of an interlayer short-circuit defect is assumed, generate an object corresponding to the defect correcting method for the interlayer short-circuit defect, and controlling the defect correcting device for correcting the defect using the generated object.

Tubular beam with single center leg

A reinforcement beam for a vehicle bumper system comprises a single sheet deformed to define first and second tubes sharing a common single center wall. A channel rib is formed on each tubes and a crevice rib over the center leg forms a third rib. Edges of the sheet are deformed to a radius so that their surface consistently engages an associated radiused corner formed on ends of the center leg, which facilitates consistent abutting line engagement of material surfaces, and thus facilitates consistent welding. In a preferred beam, front wall sections of each tube are coplanar and form a face of the beam, with each channel rib and crevice rib providing added stiffness to the beam, and yet nothing extends forward of the coplanar front wall sections. Related apparatus and methods are also disclosed.

Beam guiding bellows for laser cutting machine, and method of manufacturing beam guiding bellows for laser cutting machine

Disclosed are a novel beam guiding bellows for laser cutting machine, and a method of manufacturing the beam guiding bellows for laser cutting machine, which no longer need a process of placing any special plates such as reflective plates, therefore enabling manufacturing in a shorter time at low costs. The beam guiding bellows is configured by a plurality of stacked sheet bodies integrally folded so as to alternately form hill sections and valley sections, and is thereby made freely expandable and retractable in the overall length as angles of the hill sections and valley sections vary, wherein the inner sheet body disposed innermostly is composed of a material capable of protecting the inner sheet body by absorbing or reflecting the laser light having been scattered or reversed, or having, formed on the inner surface thereof, a protective layer composed of a material capable of protecting the inner sheet body by absorbing or reflecting the laser light, and the inner sheet body has protruding flaps which are formed, automatically in the process of folding it together with the other sheet bodies to thereby form the hill sections and the valley sections alternately, so as to project further inwardly from the apexes of the valley sections.

Device for simultaneously processing the circumference of a workpiece with laser beams

A device for simultaneously processing a circumference of a workpiece includes a plurality of laser-lens modules and a waveguide. The modules each include a diode laser and a lens system and is configured to emit a laser beam radially in a shared radiation plane. The waveguide includes a lower part and an upper part that together form a cavity enclosing the radiation plane. The laser-lens modules are configured so that the laser is reflected repeatedly between a bottom surface and a cover surface and propagates in an unaffected manner within the radiation plane so as to form a beam spot that strikes the workpiece with a homogeneous energy distribution. The beam spot has a height based on a distance between the surfaces and a width based on a divergence angle in the radiation plane and a distance of the module from the workpiece surface.

Substrate with shaped cooling holes and methods of manufacture

A substrate having one or more shaped effusion cooling holes formed therein. Each shaped cooling hole has a bore angled relative to an exit surface of the combustor liner. One end of the bore is an inlet formed in an inlet surface of the combustor liner. The other end of the bore is an outlet formed in the exit surface of the combustor liner. The outlet has a shaped portion that expands in only one dimension. Also methods for making the shaped cooling holes.

On-The-Fly Manipulation Of Spot Size And Cutting Speed For Real-Time Control Of Trench Depth And Width In Laser Operations

Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.

Method and System for Mitigation of Particulate Inclusions in Optical Materials

A method of fabricating an optical material includes providing input materials having a material softening temperature, melting the input materials, and flowing the melted input materials into a laser inclusion mitigation system. The melted input materials comprise one or more inclusions. The method also includes irradiating the input materials using a laser beam, fragmenting the one or more inclusions in response to the irradiating, and reducing a temperature of the input materials to less than the material softening temperature. The method further includes forming an optical material and annealing the optical material.

Scanned laser light source

The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

Laser machining apparatus with switchable laser system and laser machining method

A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.

Laser processing method and laser processing device

A laser processing method for forming a modification region serving as a starting point of cutting inside a member to be cut along a planned cutting line by relatively moving an optical axis of a condenser lens along the planned cutting line of the member and by irradiating the member with focused laser light, wherein a plurality of cross-sectional focused spots is simultaneously formed on a section which is perpendicular to the optical axis of the condenser lens at positions having a predetermined depth from a surface of the member and which is parallel to the surface and, at that time, at least one cross-sectional focused spot of the plurality of cross-sectional focused spots is formed on a projection line of the planned cutting line onto the cross section to form one or more inside modification regions having a desired shape.

Wafer dividing method

In a wafer dividing method, a wafer is held by a chuck table of a laser beam processing apparatus. A modified layer is formed by radiating a laser beam having a wavelength that transmits the laser beam through the wafer, while adjusting the beam convergence point to a position inside of the wafer, so as to form a pair of modified layers the interval of which is greater than the width of a cutting edge of a cutting blade and smaller than the width of planned dividing lines, on the back side of the wafer at both sides of each of the planned dividing lines. The wafer is adhered to a dicing tape and divided into individual devices by cutting along the dividing lines.

Annealing apparatus using two wavelengths of continuous wave laser radiation

A thermal processing apparatus and method in which a first laser source, for example, a CO 2 emitting at 10.6 μm is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO 2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

Method for producing semiconductor light-emitting chip and semiconductor light-emitting chip

In producing a semiconductor light-emitting chip whose substrate is composed of a sapphire single crystal, cracking in semiconductor light-emitting elements in the obtained semiconductor light-emitting chip is suppressed. A semiconductor light-emitting chip is obtained by forming, on an element-group formation substrate on a front surface of which semiconductor light-emitting elements are formed, the front surface being composed of a C-plane of a sapphire single crystal, dividing grooves extending toward a first direction along an M-plane of the sapphire single crystal and the front surface of the substrate from a substrate front surface side (step 103 ), forming first modified regions extending toward the first direction and second modified regions extending along the substrate front surface and toward a second direction different from the first direction in the substrate (step 104 and step 105 ), and dividing the element-group formation substrate using the first modified regions and the second modified regions (step 106 ).

Laser processing systems and methods for beam dithering and skiving

A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.

Apparatus and method for repair of defects in an electronic energy control or display device

An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.

Pulsed light generation method

The present invention relates to a method of enabling generation of pulsed lights each having a narrow pulse width and high effective pulse energys. A pulse light source has a MOPA structure, and comprises a single semiconductor laser, a bandpass filter and an optical fiber amplifier. The single semiconductor laser outputs two or more pulsed lights separated by a predetermined interval, for each period given according to a predetermined repetition frequency. The bandpass filter attenuates one of the shorter wavelength side and the longer wavelength side, in the wavelength band of input pulsed lights.

Water soluble mask for substrate dicing by laser and plasma etch

Methods of dicing substrates having a plurality of ICs. A method includes forming a mask comprising a water soluble material layer over the semiconductor substrate. The mask is patterned with a femtosecond laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the substrate between the ICs. The substrate is then etched through the gaps in the patterned mask to singulate the IC and the water soluble material layer washed off.

In-situ deposited mask layer for device singulation by laser scribing and plasma etch

Methods of dicing substrates by both laser scribing and plasma etching. A method includes forming an in-situ mask with a plasma etch chamber by accumulating a thickness of plasma deposited polymer to protect IC bump surfaces from a subsequent plasma etch. Second mask materials, such as a water soluble mask material may be utilized along with the plasma deposited polymer. At least some portion of the mask is patterned with a femtosecond laser scribing process to provide a patterned mask with trenches. The patterning exposing regions of the substrate between the ICs in which the substrate is plasma etched to singulate the IC and the water soluble material layer washed off.

Laser and plasma etch wafer dicing using water-soluble die attach film

Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. A method includes forming a mask above the semiconductor wafer. The semiconductor wafer is disposed on a water-soluble die attach film. The mask covers and protects the integrated circuits. The mask is patterned with a laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then etched through the gaps in the patterned mask to form singulated integrated circuits. The water-soluble die attach film is then patterned with an aqueous solution.

Laser ablation tooling via distributed patterned masks

A distributed patterned mask for use in a laser ablation process to image a complete pattern onto a substrate. The mask has a plurality of apertures for transmission of light and non-transmissive areas around the apertures. When the apertures for the distributed pattern are repeatedly imaged on a substrate, structures within the distributed pattern merge within different areas of the imaged pattern to create the complete pattern with distributed stitch lines in order to reduce or eliminate the stitching effect in laser ablation. The mask can also form a sparse and distributed pattern including apertures that individually form merging portions of the complete pattern and collectively form a distributed pattern.

Serial irradiation of a substrate by multiple radiation sources

A system for configuring and utilizing J electromagnetic radiation sources (J≧2) to serially irradiate a substrate. Each source has a different function of wavelength and angular distribution of emitted radiation. The substrate includes a base layer and I stacks (I≧2; J≦I) thereon. P j denotes a normally incident energy flux on each stack from source j. In each of I independent exposure steps, the I stacks are concurrently exposed to radiation from the J sources. V i and S i respectively denote an actual and target energy flux transmitted into the substrate via stack i in exposure step i (i=1, . . . , I). t(i) and P t(i) are computed such that: V i is maximal through deployment of source t(i) as compared with deployment of any other source for i=1, . . . , I; and an error E being a function of |V 1 −S 1 |, |V 2 −S 2 |, . . . , |V I −S I | is about minimized with respect to P i (i=1, . . . , I).

Method and Apparatus for Three Dimensional Large Area Welding and Sealing of Optically Transparent Materials

Methods and systems for three dimensional large area welding and sealing of optically transparent materials are disclosed, including generating a beam of ultra-short pulses from an ultra-short pulsed laser; directing the beam to an acoustic-optic modulator to control the repetition rate of the beam; directing the beam to an attenuator after passing through the acoustic-optic modulator to control the energy of the beam; directing the beam to a focusing lens after passing through the attenuator to focus the beam between a top substrate and a bottom substrate in order to weld the top substrate to the bottom substrate, wherein the top substrate and the bottom substrate are in intimate contact; and controlling the position of the top substrate and the bottom substrate relative to the beam using a three-axis stage in order to weld the top substrate to the bottom substrate at different points. Other embodiments are described and claimed.

Laser machining device and laser machining method

A laser machining device 1 comprises a laser light source 10 , a spatial light modulator 20 , a controller 22 , a converging optical system 30 , and a shielding member 40 . The phase-modulating spatial light modulator 20 inputs a laser beam outputted from the laser light source 10 , displays a hologram modulating a phase of the laser beam at each of a plurality of pixels arranged two-dimensionally, and outputs the phase-modulated laser beam. The controller 22 causes the spatial light modulator 20 to display a plurality of holograms sequentially, lets the converging optical system 30 converge the laser beam outputted from the spatial light modulator 20 at converging positions having a fixed number of M, selectively places N converging positions out of the M converging positions into a machining region 91 , and machines an object to be machined 90.

Method and apparatus for irradiating a semiconductor material surface by laser energy

An apparatus for irradiating semiconductor material is disclosed having, a laser generating a primary laser beam, an optical system and a means for shaping the primary laser beam, comprising a plurality of apertures for shaping the primary laser beam into a plurality of secondary laser beams. Wherein the shape and/or size of the individual apertures corresponds to that of a common region of a semiconductor material layer to be irradiated. The optical system is adapted for superposing the secondary laser beams to irradiate said common region. Further, the use of such an apparatus in semiconductor device manufacturing is disclosed.

Method for patterning nano particles

The invention provides a simple and inexpensive method to assemble nanomaterials into millimeter lengths. The method can be used to generate optical, sensing, electronic, magnetic and or catalytic materials. Also provided is a substrate comprised of fused nanoparticles. The invention also provides a diode comprised of assembled nanoparticles.

Laser crystallization apparatus and laser crystallization method using the same

A laser crystallization device is provided, which includes a vibration device vibrating a laser beam along its long axis, wherein a vibration frequency at which the laser beam vibrates is satisfied by Equation 1 below. F<(P*f)/ (2*W)   Equation 1 where F is the mirror vibration frequency, W is the laser beam width, P is the laser scan pitch, and f is the laser pulse frequency.

Transparent material processing with an ultrashort pulse laser

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.

LASER CRYSTALLIZATION AND POLYCRYSTAL EFFICIENCY IMPROVEMENT FOR THIN FILM SOLAR

Apparatus and methods of thermally processing semiconductor substrates are disclosed. Aspects of the apparatus include a source of intense radiation and a rotating energy distributor that distributes the intense radiation to a rectifier. The rectifier directs the radiation toward the substrate. Aspects of the method include using a rotating energy distributor to distribute pulsed energy to a substrate for processing. The rotational rate of the energy distributor is set based on the pulse repetition rate of the energy source. A substrate may be continuously translated with respect to the energy distributor at a rate set based on the pulse repetition rate of the energy source. 1. An apparatus for thermal processing of semiconductor substrates , comprising:a source of a rectangular laser light field;a rotating polygonal mirror disposed in an optical path of the rectangular laser light field and generating a plurality of reflected laser pulses having a rectangular shape and angularly distributed across a reflection field; anda rectifier disposed across the reflection field and above a work surface, and having one or more light-directing elements that direct the rectangular laser pulses from the reflection field toward the work surface.2. The apparatus of claim 1 , wherein the rectifier is a linear member disposed along an axis perpendicular to the optical path of the laser light field incident on the rotating polygonal mirror.3. The apparatus of claim 2 , wherein the rectifier comprises a plurality of optical elements.4. The apparatus of claim 2 , wherein the work surface comprises a conveyor movable in a direction substantially parallel to the optical path of the laser light incident on the rotating polygonal mirror.5. The apparatus of claim 3 , wherein the rectifier comprises a plurality of mirrors.6. The apparatus of claim 5 , wherein the rectifier further comprises a plurality of lenses.7. The apparatus of claim 6 , wherein each of the plurality of lenses has an ...

Device for Adjusting a Beam Profile, Laser Processing Machine and Method for Producing The Device

The invention relates to a device for adjusting a beam profile of a laser beam, which is guided in a light guide of a fibre optic cable provided with a protective sleeve, wherein the device comprises a deformation device for deforming the light guide in a section of the fibre optic cable not enclosed by the protective sleeve, a housing, which is designed to surround the light guide at least in the section not enclosed by the protective sleeve, and also two holders provided at opposite ends of the housing for fixing in each case one end of a section of the protective sleeve, wherein the holders each comprise an opening for feeding the light guide to the deformation device. The invention also relates to a laser processing machine having such a device and to an associated production method.

Method of and apparatus for personalising a series of portable objects

Embodiments of the invention provide a method of and apparatus for graphically marking a series of portable objects, such as a card, each portable object being graphically marked on a respective zone by a respective marking device, wherein the marking devices are configured to perform the same marking operation simultaneously on a plurality of portable objects.

Optical irradiation device for a system for producing three-dimensional work pieces by irradiating powder layers of a powdered raw material using laser radiation

An optical irradiation device is provided which includes a multimode optical fiber suitable for the central wavelength of a beam of light having a first beam profile which enters through an input connection for multimode guidance; a switching device, which can be switched between a first and second light conducting state and is configured to conduct the beam of light entering through the input connection in the first light conducting state to an output connection, such that the beam of light has the first beam profile on emerging from the output connection, and guides the beam of light entering the input connection to the output connection by the multimode optical fiber in the second light conducting state, so that the beam of light has a second beam profile different from the first beam profile on emerging from the output connection by the multimode guidance in the multimode optical fiber.

Fibre optic laser machining equipment for etching grooves forming incipient cracks

A laser machining equipment for etching grooves in a wall of a mechanical part, or in a connecting rod for a spark ignition engine, includes a fiber optic laser device arranged to supply laser pulses. The fiber optic laser device is controlled so that laser pulses have a peak power of more than 400 W and at least two times greater than maximum mean power of the laser device, and duration of the laser pulses is below or within the nanosecond range of 1 ns to 1000 ns. The fiber optic laser device can be controlled in a quasi continuous wave (QCW) mode, or can be controlled in a Q-switch mode. The selected operating modes increase machining efficiency and produce a groove with an optimum transverse profile, particularly with a small mean radius of curvature at a bottom of the groove which then allows precise subsequent fracturing of the mechanical part with less force.

LASER OPTICS WITH PASSIVE SEAM TRACKING

The present invention relates to a device for guiding a laser beam along a target path, particularly a joint. It has a laser beam input module that guides an incident laser beam onto a swiveling beam guiding device downstream from the laser beam input module. The beam guiding device projects the laser beam onto the target path. Said beam guiding device comprises a tactile sensor connected to the swiveling optic that is designed to perform a tactile scan of the target path and to deflect the swiveling optic appropriately. According to the invention, an intermediate focal point is located in the beam path of the laser beam between laser beam input module and swiveling optic. Moreover, the swivel axis of the swiveling optic runs through the intermediate focal point. 2. Device as set forth in claim 1 , characterized in that the laser beam input module is designed to focus the laser beam onto the intermediate focal point and the swiveling optic is designed to reproduce the intermediate focal point on the target path.3. Device as set forth in claim 2 , characterized in that the laser beam input module has an optical fiber and intermediate imaging optic claim 2 , with the intermediate imaging optic being designed to reproduce an end of the optical fiber facing it on the intermediate focal point.4. Device as set forth in claim 1 , characterized in that the laser beam input module is embodied as an optical fiber and the intermediate focal point is located on the side of the optical fiber facing the swiveling optic and the swiveling optic is designed to reproduce the intermediate focal point on the target path.5. Device as set forth in claim 1 , characterized in that laser beam input module is designed to generate a non-focused beam path and the swiveling optic possesses a virtual intermediate focus that forms the intermediate focal point and is located in the collimated beam path.6. Device as set forth in claim 1 , whereinthe tactile sensor and the swiveling optic are ...

LASER CUTTING SYSTEM AND METHODS FOR CREATING SELF-RETAINING SUTURES

A laser-machining system and method is disclosed for forming retainers on a suture thread. The laser system is preferably a femtosecond laser system which is capable of creating submicron features on the suture thread while preserving strength of the suture thread. The laser-machining system enables creation of retainers and self-retaining suture systems in configurations which are difficult and/or impossible to achieve using mechanical cutting technology. 1. A method for making a self-retaining suture comprising;(a) providing a suture thread having a surface;(b) identifying a first volume of suture material on the surface of the thread;(c) identifying a second volume of suture material from within the first volume of suture material;(d) directing a laser beam at the suture thread to ablate all of the suture material within the first volume of suture material with the exception of the second volume of suture material whereby the second volume of suture material forms a tissue retainer protruding from laser cut surface of the suture thread; and(e) repeating steps (b), (c) and (d) to generate a plurality of tissue retainers protruding from the suture thread.2. The method of claim 1 , wherein step (c) comprises identifying a second volume of suture material from within the first volume of suture material the second volume being less than 50% of the first volume.3. The method of claim 1 , wherein step (c) comprises identifying a second volume of suture material from within the first volume of suture material the second volume being less than 25% of the first volume.4. The method of claim 1 , wherein:step (c) comprises identifying a conical subvolume of suture material from within the volume of suture material wherein the subvolume of suture material; andstep (d) comprises directing a laser beam at the suture thread to ablate all of the suture material within the selected volume of suture material with the exception of the conical subvolume of suture material whereby the ...

LASER MICRO/NANO PROCESSING SYSTEM AND METHOD

A laser micro/nano processing system () comprises: a laser light source used to provide a first laser beam having a first wavelength and a second laser beam having a second wavelength different from the first wavelength, with the pulse width of the first laser beam being in the range from a nanosecond to a femtosecond; an optical focusing assembly used to focus the first laser beam and the second laser beam to the same focal point; and a micro mobile platform () controlled by a computer. Also disclosed are a method for micro/nano-processing photosensitive materials with a laser and a method for fabricating a device with a micro/nano structure using laser two-photon direct writing technology. In the system and methods, spatial and temporal overlapping of two laser beams is utilized, so as to obtain a micro/nano structure with a processing resolution higher than that of a single laser beam, using an average power lower than that of a single laser beam. 1. A laser micro/nano fabrication system , comprising:a laser light source for providing a first laser beam having a first wavelength and a second laser beam having a second wavelength being different from the first wavelength, the first laser beam having a pulse width in range of nanosecond to femtosecond;an optical focusing assembly for focusing the first laser beam and the second laser beam to a same focal point; anda computer controlled micromovement stage.2. The laser micro/nano fabrication system of claim 1 , wherein the first laser beam has a repetition frequency in range of 1 Hz-200 MHz claim 1 , and a wavelength in range of 157 nm-1064 nm.3. The micro/nano fabrication system of claim 1 , whereinThe second laser beam has a pulse width in range of nanosecond to femtosecond, andthe system further comprises a optical delay assembly for adjusting the optical path of the first laser beam or the optical path of the second laser beam such that the lag between the times when the first laser beam and the second laser ...

LASER PROCESSING MACHINE

A processing machine includes mirrors and to reflect a beam L oscillated from a laser oscillator to a predetermined surface on which a workpiece is arranged, optical axis operating mechanisms and to position an optical axis of the beam L at a desired target irradiation position by changing directions of the mirrors and, a camera sensor to capture an image of the target irradiation position and its periphery reflected in the mirror, and an error calibration mechanism to detect an error between the target irradiation position instructed to the optical axis operating mechanisms and an actual position of the optical axis of the beam L in the predetermined surface by referring to the image captured by the camera sensor. A correction amount to the optical axis operating mechanisms and is determined based on the error to irradiate the target irradiation position with the beam L during processing. 1. A laser processing machine to apply processing by irradiating a workpiece with a laser beam , comprising:a mirror to reflect the laser beam oscillated from a laser oscillator to a predetermined surface on which the workpiece is arranged;an optical axis operating mechanism to position an optical axis of the laser beam at a desired target irradiation position in the predetermined surface by changing a direction of the mirror;a camera sensor to capture an image of the target irradiation position and its periphery in the predetermined surface reflected in the mirror; andan error calibration mechanism to detect an error between the target irradiation position instructed to the optical axis operating mechanism and an actual position of the optical axis of the laser beam in the predetermined surface, by referring to the image captured by the camera sensor,wherein a correction amount to be instructed to the optical axis operating mechanism can be determined based on the error in order to irradiate the target irradiation position with the laser beam during processing.2. A laser ...

Processing method for wafer

A wafer has, on a front face thereof, a device region in which a device is formed in regions partitioned by a plurality of scheduled division lines. An outer peripheral region surrounds the device region. A reflecting film of a predetermined width is formed from the outermost periphery of the wafer on a rear face of the wafer corresponding to the outer peripheral region. The front face side of the wafer is held in a chuck table, and a focal point of a pulsed laser beam of a wavelength having permeability through the wafer is positioned in the inside of the wafer corresponding to the scheduled division lines. The pulsed laser beam is irradiated from the rear face side of the wafer to form modified layers individually serving as a start point of division along the scheduled division lines in the inside of the wafer.

Laser Puncher for Punching Hole on Tipping Paper in a Curved Manner

The present invention discloses a laser puncher for punching holes on tipping paper in a curve manner, which comprises a panel, a light guiding cylinder, a laser connected with the light guiding cylinder, a transmission system driving a piece of tipping paper to move and at least one focusing optical head and at least one driving motor is fixed on the panel, a screw shaft is connected with the driving shaft of the driving motor, a nut is connected with the screw shaft and fixedly connected with a connecting rod, the other end of which is fixedly connected with at least one moving optical cylinder, one end of which is provided with the light guiding cylinder, and the other end of which penetrates the panel to be fixedly connected with the focusing optical head, the external periphery of the moving optical cylinder is provided with an anti-rotation linear bearing, which is fixed on the panel, and the driving motor drives the focusing optical head to reciprocate back and forth via the screw shaft, the nut, the connecting rod and the moving optical cylinder. The present invention can increase the identifiability of tipping papers on which holes are punched with a laser puncher as well as the air permeability of tipping papers. 1. A laser puncher for punching holes on tipping paper in a curved manner , comprising;a panel;a light guiding cylinder;a laser connected with the light guiding cylinder;a transmission system driving a piece of tipping paper to move; andat least one focusing optical head, wherein at least one driving motor is fixed on the panel, a screw shaft is connected with the driving shaft of the driving motor, a nut is connected with the screw shaft and fixedly connected with a connecting rod, the other end of which is fixedly connected with at least one moving optical cylinder, one end of which is fitted glidingly in the light guiding cylinder, and the other end of which penetrates the panel to be fixedly connected with the focusing optical head, the ...

LASER BEAM MACHINING DEVICE AND A PROCESS OF LASER MACHINING COMPRISING A SINGLE LENS FOR LIGHT FOCUSSING

A laser beam machining device () is provided, in which unfocused light (A) from a light exit point (B) is radiated onto a single lens (), where in the lens () focuses the laser light (A) and guides it onto a machining point of a work piece (). A distance (m, m) between the lens () and the light exit point (B) and a distance (l, l) between the lens () and the machining point of the workpiece () and a distance between the light exit point (B) and the aforementioned machining point can be varied. Moreover, a process of usage of a laser beam machining device () is provided. 119-. (canceled)20. A laser machining apparatus comprising:a light exit outlet configured to emit unfocused laser light;a lens situated in the direction of radiation of laser light emitted by said light exit outlet, said lens separated by a first controllably-variable distance from said light exit outlet;a laser machining locus disposed after said lens, said laser machining locus separated from said lens by a second controllably-variable distance, said laser machining locus separated from light exit outlet by a third controllably-variable distance;a drive system configured to controllably adjust the first controllably-variable distance, the second controllably-variable distance, and the third controllably-variable distance; andsaid drive system being operatively connected to said lens and to said light exit outlet.21. The laser machining apparatus as claimed in wherein:said lens is aspheric.22. A laser machining apparatus as claimed in further comprising:at least one aspheric surface on said lens, said at least one aspheric surface being shaped with an even asphericity.23. The laser machining apparatus as claimed in wherein:said lens is made of ZnS.24. The laser machining apparatus as claimed in wherein:the Strehl ratio is greater than 0.9 over operational ranges of the first, second, and third controllably-variable distances.25. The laser machining apparatus as claimed in wherein:said drive system ...

SINGLE-SCAN LINE-SCAN CRYSTALLIZATION USING SUPERIMPOSED SCANNING ELEMENTS

The disclosure relates to methods and systems for single-scan line-scan crystallization using superimposed scanning elements. In one aspect, the method includes generating a plurality of laser beam pulses from a pulsed laser source, wherein each laser beam pulse has a fluence selected to melt the thin film and, upon cooling, induce crystallization in the thin film; directing a first laser beam pulse onto a thin film using a first beam path; advancing the thin film at a constant first scan velocity in a first direction; and deflecting a second laser beam pulse from the first beam path to a second beam path using an optical scanning element such that the deflection results in the film experiencing a second scan velocity of the laser beam pulses relative to the thin film, wherein the second scan velocity is less than the first scan velocity. 1. A method for processing a thin film , the method comprising:generating a plurality of laser beam pulses from a pulsed laser source, wherein each laser beam pulse has a fluence selected to melt the thin film and, upon cooling, induce crystallization in the thin film;directing a first laser beam pulse onto a thin film using a first beam path;advancing the thin film at a constant first scan velocity in a first direction; anddeflecting a second laser beam pulse from the first beam path to a second beam path using an optical scanning element such that the deflection results in the film experiencing a second scan velocity of the laser beam pulses relative to the thin film,wherein the second scan velocity is less than the first scan velocity.2. The method of claim 1 , wherein each laser beam pulse has a fluence selected to completely melt the thin film.3. The method of claim 1 , wherein the crystallization comprises a sequential lateral solidification (SLS) process.4. The method of claim 1 , wherein each laser beam pulse has a fluence selected to partially melt the thin film.5. The method of claim 1 , wherein the crystallization ...

Laser apparatus and laser materials processing apparatus provided with same

A laser apparatus of the present invention has a first laser oscillator that emits a first laser beam; a passive fiber that is a double-clad fiber that transmits the first laser beam through a core; and a second laser oscillator that emits a second laser beam that is coupled into inner cladding of the passive fiber. Additionally, a laser materials processing apparatus of the present invention is provided with the laser apparatus; and an irradiation optical system having a collimating lens and a condenser lens.

LASER MACHINING APPARATUS AND LASER MACHINING CONTROL DEVICE

The laser machining apparatus includes a transmission fiber that transmits laser light emitted from a laser oscillator through the fiber, a machining head that emits the laser light, which is sent from the transmission fiber, vertically to a main surface of a machining object and sends reflected light, which is reflected coaxially with the laser light by the machining object, to the transmission fiber, a reflected light monitoring unit that detects a reflected light intensity of the reflected light sent from the transmission fiber, and a control device that controls the laser oscillator and the machining head, in which the control device includes a determining unit that, at a time when laser machining is started, determines whether the machining object corresponds to a machining condition or not in laser machining on the basis of the reflected light intensity. 18.-. (canceled)9. A laser machining apparatus comprising:a transmission fiber that transmits laser light emitted from a laser oscillator through the fiber;a machining head that emits the laser light, which is sent from the transmission fiber, vertically to a main surface of a machining object and sends reflected light, which is reflected coaxially with the laser light by the machining object, to the transmission fiber;a reflected-light-intensity detecting unit that detects a reflected light intensity of the reflected light sent from the transmission fiber; anda control device that controls the laser oscillator and the machining head, whereinthe control device includes a determining unit that, at a time when laser machining is started, determines whether the machining object corresponds to a machining condition in laser machining or not on a basis of the reflected light intensity, andthe determining unit compares a measurement time measured from when the piercing is started to when the reflected light intensity decreases to a predetermined value with a first specified range relating to a measurement time ...

Apparatus and method for repair of defects in an electronic energy control or display device

An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.

Piezoelectric substrate for the study of biomolecules

A method of forming extremely small pores in a substrate may be used to produce, for example, an apparatus for the study of biological molecules, by providing a small pore in a piezoelectric substrate having electrodes, the latter that may be energized to change the pore dimensions.

Laser marking

A method and apparatus is disclosed for producing precision marks for a metrological scale in the form of a stainless steel ribbon. A laser is used to produce ultra-short pulses which have a fluence at the ribbon such that ablation takes place. The laser light can be scanned via scanner and the pitch of the marks can be controlled. The ablative technique causes little thermal input and improves the accuracy of the scale.

Method and Apparatus to Fabricate Vias in Substrates for Gallium Nitride MMICs

A system for fabricating vias in SiC and CVD diamond substrates through controlled laser ablation using short pulse lengths and short wavelengths.

Method for Forming Superior Local Conductivity in Self-Organized Nanodots of Transparent Conductive Film by Femtosecond Laser

A simple method is developed in the present invention for fabricating periodic ripple microstructures on the surface of an ITO film by using single-beam femtosecond laser pulses. The periodic ripple microstructures composed of self-organized nanodots can be directly fabricated through the irradiation of the femtosecond laser, without scanning. The ripple spacing of ˜800 nm, ˜400 nm and ˜200 nm observed in the periodic ripple microstructures can be attributed to the interference between the incident light and the scattering light of the femtosecond laser from the surface of the ITO film. In the present invention, the self-organized dots are formed by the constructive interference formed in the surface of the ITO film, where includes higher energy to break the In—O and Sn—O bonds and then form the In—In bonds. Therefore, the dots have higher surface current greater than other disconstructive regions of the ITO film.

Laser cutting method optimized in terms of mass defect per unit length

The invention relates to an optimized laser cutting method for cutting a part from a material by means of a cutting system comprising: a laser source for producing a laser beam having a certain power; and a cutting head comprising an end nozzle for passage of a cutting laser beam, said method being characterized in that it comprises a step of determining the cutting power Pd such that: Pd=Max(Popt;λe) where Max is the mathematical operator of the maximum, Popt is an optimal power of the laser beam of the cutting system, which is predetermined in accordance with the part to be cut, and/or with cutting parameters and/or with system parameters, to minimize the mass defect per unit length of the part when the part is being cut, λ is a leading coefficient representing the number of kW required for cutting the part per mm of the thickness of the part, and e is the thickness of the part in mm.

LASER PROCESSING HEAD, LASER PROCESSING APPARATUS, OPTICAL SYSTEM OF LASER PROCESSING APPARATUS, LASER PROCESSING METHOD, AND LASER FOCUSING METHOD

A laser cutting apparatus () includes a laser processing head () that receives a laser beam emitted by a laser oscillator () and that uses a spherical lens for converging the laser beam so as to cause the intensity distribution of the laser beam to have a caldera-like shape, in which the intensity of the laser beam is higher in a peripheral area than in a central area, at the position of a workpiece (). Moreover, the laser processing head () radiates the laser beam whose focal position is displaced from the position of the workpiece () to the workpiece (). Therefore, the laser cutting apparatus () performs an inversion on the laser beam by using the spherical aberration of the spherical lens. Consequently, with a simple configuration, a laser beam whose inner area and outer area are inverted at the position of the workpiece () can be generated, and the processing direction for processing the workpiece () is not limited. 1. A laser processing head included in a laser processing apparatus that processes a workpiece by irradiating the workpiece with a laser beam ,wherein at least one of a spherical lens and an aspherical lens capable of generating spherical aberration, which are provided for converging the laser beam, causes an intensity distribution of the laser beam to have a caldera-like shape, in which the intensity of the laser beam is higher in a peripheral area than in a central area, at a position of the workpiece, and the laser beam whose focal position is displaced from the position of the workpiece is radiated onto the workpiece.2. The laser processing head according to claim 1 , wherein the intensity distribution of the laser beam at the position of the workpiece is ring-shaped.3. The laser processing head according to wherein the intensity distribution of the laser beam at the position of the workpiece is non-ring-shaped.4. The laser processing head according to claim 3 , wherein the intensity distribution of the laser beam at the position of the workpiece ...

LASER MACHINING APPARATUS

A laser machining apparatus includes a chuck table for holding a workpiece, and an irradiation unit which irradiates a laser beam upon the workpiece held on the chuck table. The laser beam irradiation unit includes a condenser which condenses the laser beam and irradiates the condensed laser beam upon the workpiece held on the chuck table. The condenser includes first and second condenser lenses arrayed in series in an advancing direction of the laser beam, a first moving unit having a first driving source for moving the first condenser lens in a first direction perpendicular to an optical axis of the first condenser lens, and a second moving unit having a second driving source for moving the second condenser lens in a second direction perpendicular to the first direction. 1. A laser machining apparatus , comprising:workpiece holding means for holding a workpiece; andlaser beam irradiation means including laser beam oscillation means for oscillating a laser beam, and a condenser for condensing the laser beam oscillated by the laser beam oscillation means and irradiating the condensed laser beam upon the workpiece held on the workpiece holding means; first and second condenser lenses arrayed in series in an advancing direction of the laser beam,', 'first moving means having a first driving source for moving the first condenser lens in a first direction perpendicular to an optical axis of the first condenser lens, and', 'second moving means having a second driving source for moving the second condenser lens in a second direction perpendicular to the first direction, and, 'wherein the condenser includes'} 'power supplying means for supplying power to the first driving source of the first moving means and the second driving source of the second moving means.', 'the laser machining apparatus further comprises2. The laser machining apparatus according to claim 1 , wherein the first driving source and the second driving source are each configured from a piezoelectric ...

LASER PROCESSING MACHINE, LASER CUTTING MACHINE, AND METHOD FOR ADJUSTING A FOCUSED LASER BEAM

Laser processing machines and methods for adjusting focused laser beams. Laser processing heads have nozzle with openings admitting primary laser beam. An orientation device is included, as well as at least one sensor to mutually center primary beam and opening of nozzle. A first beam handling unit is arranged near the nozzle opening and may convert primary beam into a secondary wide-band heat beam, and then may emit this secondary beam towards a sensor; or may reflect/scatter at least a portion of the primary beam towards sensor. The sensor detecting the converted secondary beam is arranged within the laser processing head. In an adjustment process, a primary beam may be converted into a wide-band heat radiation as secondary radiation at the beam handling unit, and emitted and/or diverted into a scattered/reflex beam towards the sensor. Respective position of nozzle opening center and primary beam is calculated from sensor-measured values, and nozzle center and beam center are automatically displaced to mutual center. The axial position of beam focus may be also be measured and set via the nozzle centering procedure. 1. A laser processing machine comprising:a laser processing head, said laser processing head having an interior, said interior having an interior wall, said interior wall being disposed about a central axis;a nozzle associated with said laser processing head, said nozzle having a nozzle opening for a focused laser beam, said nozzle opening having at least one edge;a beam handling unit disposed near said nozzle opening, said beam handling unit being made of a material converting a focused laser beam at said at least one nozzle opening edge to a wide-band heat beam, said beam handling unit positioned to emit the wide-band heat beam as a secondary electromagnetic radiation beam in a propagation direction back into said interior and away from said nozzle opening and said beam handling unit;a beam reflector disposed in said laser processing head to reflect ...

LASER MACHINE, LASER MACHINE SYSTEM

A laser machine (), in particular for drilling, cutting, welding or engraving, comprising at least one laser light source () for generating a laser beam () and an optical system () to guide and/or manipulate the laser beam (), whereby the optical system () comprises at least one tool (), in particular an optical lens () or a nozzle, which is attached to an interchangeable tool holder (). It is provided that a guiding system () for the tool holder () is configured such that the tool holder () can only be slid sideways into or out of a tool bay () provided by the laser machine (), the guiding system () comprising an operable locking system () for restraining the movement of the tool holder () in the tool bay (). 1. A laser machine comprising at least one laser light source for generating a laser beam , an optical system to guide and/or manipulate the laser beam , the optical system comprises at least one tool , attached to an interchangeable tool holder , a guiding system for the tool holder is configured such that the tool holder can only be slid sideways into or out of a tool bay provided by the laser machine , the guiding system comprising an operable locking system for restraining the movement of the tool holder in the tool bay.2. A laser machine according to claim 1 , wherein the at least one tool is an optical lens.3. A laser machine according to claim 1 , wherein the at least one tool is a nozzle.4. A laser machine according to claim 1 , wherein the guiding system comprises at least one guiding rail attached to one of the tool holder and the tool bay and at least one guiding slot to engage with the guiding rail attached to the other of the tool bay and the tool holder.5. A laser machine according to claim 1 , wherein the locking system comprises at least one moveable locking piston and/or at least one operable locking magnet.6. A laser machine according to claim 5 , wherein the locking piston is actuated by compressed air claim 5 , wherein movement of the tool ...

Monitoring method and apparatus for excimer laser annealing process

A method is disclosed evaluating a silicon layer crystallized by irradiation with pulses form an excimer-laser. The crystallization produces periodic features on the crystalized layer dependent on the number of and energy density in the pulses to which the layer has been exposed. An area of the layer is illuminated with light. A detector is arranged to detect light diffracted from the illuminated area and to determine from the detected diffracted light the energy density in the pulses to which the layer has been exposed.

Laser reinforced direct bonding of optical components

A method for the laser reinforced direct bonding of two optical components having a respective bonding surface and a reinforced optical assembly made thereby are provided. The method includes a first step of assembling the two optical components by direct bonding of their respective bonding surface together, thereby defining a direct-bonded interface therebetween. The method further includes a second step of reinforcing the direct-bonded interface with a weld seam including at least one substantially continuous reinforcing weld line forming a dosed shape enclosing a sealed direct-bonded region. Each weld line is inscribed by focusing ultrashort laser pulses at the direct-bonding interface so as to generate non-linear optical phenomena inducing a localized junction between the two optical components. Advantageously, embodiments of the present invention provide reinforced optical assemblies exhibiting hermetic and mechanically resistant bonds over a large area as well as negligible alteration of their optical transmission properties.

Systems and methods for processing thin films

Methods and systems for processing a thin film are disclosed. Thin films are loaded onto two different loading fixtures, laser beam pulses are split into first and second laser beam pulses, the thin film loaded on one loading fixture is irradiated with the first laser beam pulses to induce crystallization while the thin film loaded on the other loading fixture is irradiated with the second laser beam pulses. At least a portion of the thin film loaded on the first and second loading fixtures is irradiated. The laser source system includes first and second laser sources and an integrator that combines the laser beam pulses to form combined laser beam pulses. The methods and system further utilize additional loading fixtures for processing additional thin film samples. The irradiation of additional thin film samples can be performed while thin film samples are being loaded onto the remaining loading fixtures.

Methods, devices, systems for joining materials and resulting articles

A method, article of manufacture, and system for joining different materials is described. In a principal embodiment, two articles, for example different metals, are placed in proximity to one another with an interfacial area. One article is heated using a laser that is scanned across from a point remote from the interface to a point at or just short of the interface. In embodiments, the interfacial bond region is characterized by a homogenous mixed phase region with very low to substantially no brittle intermetallics.

Method for partitioning and incoherently summing a coherent beam

A method and apparatus for decorrelating coherent light from a light source, such as a pulsed laser, in both time and space in an effort to provide intense and uniform illumination are provided. For some embodiments employing a pulsed light source, the output pulse may be stretched relative to the input pulse width. The methods and apparatus described herein may be incorporated into any application where intense, uniform illumination is desired, such as pulsed laser annealing, welding, ablating, and wafer stepper illuminating.

INFINITE THICKNESS LASER PROCESSING SYSTEM

A laser material processing system comprises: a housing defining an engraving chamber, an xy laser beam steering system, and a non-telescoping sliding focus mechanism. The housing includes a removable bottom panel that allows processing of workpieces that exceed dimensions of the engraving chamber and allows stacking of the system on modular attachments for specialized functions. The focus mechanism includes a carriage mirror subassembly attached to the x-axis carriage, a sliding member moveably attached to the carriage mirror subassembly, and a focusing lens subassembly attached perpendicularly to the lower end of the sliding member. The carriage mirror subassembly and the focusing lens subassembly are configured to receive and focus a laser beam to a focal point. The focusing lens subassembly is adjusted along a z-axis by disengaging the locking component and vertically sliding the sliding member and is locked into a position by engaging the locking component with the sliding member. 1. A laser processing system comprising:a housing defining an engraving chamber; the xy laser beam steering system comprising', 'a first y-axis rail,', 'a second y-axis rail parallel to the first y-axis rail,', 'a first y-axis carriage moveably mounted to the first y-axis rail,', 'a second y-axis carriage moveably mounted to the second x-axis rail,', 'an x-axis rail perpendicular to both the first y-axis rail and the second y-axis rail wherein a first end of the x-axis rail is adjoined to the first y-axis carriage and a second end of the x-axis rail is adjoined to the second y-axis carriage, and', 'an x-axis carriage moveably mounted to the x-axis rail; and, 'an xy laser beam steering system located inside the engraving chamber,'} a carriage mirror subassembly attached to the x-axis carriage,', a linear guiding component and', 'a locking component, and, 'a sliding member moveably attached to the carriage mirror subassembly, the sliding member comprising'}, 'a focusing lens subassembly ...

Method and apparatus for marking an article

Numerous embodiments of methods and apparatus for marking articles are disclosed. In one embodiment, a method of marking an article includes providing an article having a preliminary visual appearance; modifying a region of the article; and directing a plurality of optical pulses into the modified region of the article. The plurality of optical pulses can be configured to produce a visible mark on the article. Generally, the mark can be characterized as having a modified visual appearance different from the preliminary visual appearance.

LASER MACHINING DEVICE

There is proposed a laser machining device () for a laser workpiece machining operation, having a laser () for producing laser radiation (), and having at least two laser tools (), to which the laser radiation () can be supplied by means of an optical-fibre cable (). According to the invention, the optical-fibre cable () has an input-side end () having at least two optical fibre cores (′) and a plurality of output-side ends (′) each having one of the optical fibre cores (′), the optical fibre cores (′) each being connected to one of the laser tools (′). A switching device () is preferably provided for selectively coupling the laser radiation () in one or more of the optical fibre cores (′) of the optical-fibre cable (). 11818. Laser machining device for a laser workpiece machining operation , having a laser for producing laser radiation , and having at least two laser tools ( , ′) , to which the laser radiation can be supplied by means of an optical-fibre cable ,{'b': 22', '22', '26', '26', '22', '22, 'characterised in that the optical-fibre cable has an input-side end having at least two optical fibre cores (, ′) and a plurality of output-side ends (, ′) each having one of the optical fibre cores (, ′),'}{'b': 22', '22', '18', '18, 'the optical fibre cores (, ′) each being connected to one of the laser tools (, ′), and'}{'b': 22', '22, 'that a switching device is provided for selectively coupling the laser radiation in one or more of the optical fibre cores (, ′) of the optical-fibre cable.'}2. (canceled)3. Laser machining device according to claim 1 , characterised in that there are provided connection means claim 1 , by way of which the input-side end of the optical-fibre cable is positioned in a defined position and in a defined rotation position with respect to the switching device.4. Laser machining device according to claim 3 , characterised in that the connection means has a connection socket which is arranged on the switching device and a connection plug ...

LASER PROCESSING APPARATUS

A laser processing apparatus has an optical transmitting unit for guiding a laser beam to a focusing unit. The optical transmitting unit includes a focusing lens for focusing the laser beam, an optical fiber unit for inputting the focused laser beam and guiding it to the focusing unit. The optical fiber unit includes an LMA fiber for inputting the focused laser beam. The LMA fiber has a large-diameter core covered with a cladding, a transmitting fiber provided by an SM fiber or a PM fiber. The transmitting fiber has a small-diameter core covered with a cladding, the small-diameter core having a diameter corresponding to the wavelength of the laser beam oscillated by the laser oscillator. A connector connects the LMA fiber and the transmitting fiber so that these fibers are axially aligned with each other. 1. A laser processing apparatus comprising:a chuck table for holding a workpiece; andlaser beam applying means for applying a laser beam to said workpiece held on said chuck table, said laser beam applying means including a laser oscillator for oscillating said laser beam, focusing means for focusing said laser beam oscillated by said laser oscillator and applying said laser beam focused to said workpiece held on said chuck table, and optical transmitting means for guiding said laser beam oscillated by said laser oscillator to said focusing means;said optical transmitting means including a focusing lens for focusing said laser beam oscillated by said laser oscillator and optical fiber means for inputting said laser beam focused by said focusing lens and guiding said laser beam to said focusing means; a large mode area fiber for inputting said laser beam oscillated by said laser oscillator and focused by said focusing lens, said large mode area fiber having a large-diameter core covered with a cladding,', 'a transmitting fiber provided by a single mode fiber or a polarization maintaining fiber, said transmitting fiber having a small-diameter core covered with a ...

Laser welding consumable

A system and method for heating a filler wire (consumable) using a laser in brazing, cladding, building up, filling, overlaying, welding, and joining applications. The filler wire includes a first surface that absorbs energy from a laser beam and a second surface separated from said first surface by a thickness t that is in a range of 0.010 inch to 0.045 inch. A cross-sectional shape of the filler wire includes at least one bend toward the laser beam along a length of the cross-sectional shape. The cross-sectional shape has a projected width w that is in a range of 0.030 inch to 0.095 inch.

CUTTING TOOL AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME

Provided is a technology for manufacturing cutting tools that is capable of providing cutting tools that have a cut surface whose surface is uniformly smooth and that have a stable performance. Provided are a cutting tool manufacturing method in which a cutting tool material is cut by using, as a laser beam, a laser beam formed by combining two linearly polarized laser beams so that the directions of polarization of the two linearly polarized laser beams are at right angles to each other; a cutting tool manufacturing method in which a circularly polarized laser beam is used as a laser beam; a cutting tool manufacturing method in which a randomly polarized laser beam is used as a laser beam; a cutting tool manufactured by the manufacturing method; a cutting tool manufacturing apparatus that includes means for generating a combined laser beam formed of two linearly polarized laser beams, the directions of polarization of the two linearly polarized laser beams being at right angles to each other and an optical system that guides the combined laser beam to the cutting tool material; a cutting tool manufacturing apparatus that includes means for generating a circularly polarized laser beam; and a cutting tool manufacturing apparatus that includes means for generating a randomly polarized laser beam. 120.-. (canceled)21. A cutting tool manufacturing method for manufacturing a cutting tool by cutting a cutting tool material into a predetermined shape by causing a laser beam to scan the cutting tool material ,wherein a cutting-edge ridgeline is formed by forming a horning surface on a ridge line along which a surface of the cutting tool material on a side where the laser beam enters and a processed surface of the cutting tool material processed by the laser beam intersect.22. The cutting tool manufacturing method according to claim 21 ,wherein the cutting tool material is cut by using, as the laser beam, a laser beam formed by combining two linearly polarized laser beams so ...

Leads incorporating a laser processed electrode

Medical devices may include an electrode that has been processed to increase its surface area. In some cases, an electrode may be processed using an ultrafast laser to produce an electrode surface that includes macrostructures formed within the electrode surface and nanostructures formed on the macrostructures. The nanostructures may be formed of material that was removed from the electrode surface in forming the macrostructures.

LASER NOZZLE WITH MOBILE ELEMENT

The invention relates to a laser nozzle that can be used in laser cutting, notably with a fibre or disc laser, comprising a nozzle body comprising an axial housing passing axially through said nozzle body and comprising a first outlet orifice situated at the front face of the nozzle body, and a movable element comprising a skirt-forming front part arranged in the axial housing of the nozzle body, said movable element being capable of translational movement in the axial housing of the nozzle body and comprising an axial passage with a second outlet orifice opening onto the skirt-forming front part. 111-. (canceled)12. A laser nozzle comprising:a nozzle body comprising an axial housing passing axially through said nozzle body and comprising a first outlet orifice situated at the front face of the nozzle body anda movable element comprising a front part forming a skirt, arranged in the axial housing of the nozzle body, said movable element being capable of translational movement in the axial housing of the nozzle body and comprising an axial passage with a second outlet orifice emerging at the front part forming a skirt, wherein:the movable element is able to move translationally in the axial housing in the direction of the first outlet orifice under the effect of a gas pressure exerted on the movable element until the front part forming a skirt of the movable element comes to project outside the axial housing through the first outlet orifice in the front face of the nozzle body, andan elastic element is arranged in the axial housing, between the nozzle body and the movable element, said elastic element exerting an elastic return force on the movable element tending to oppose the translation movement in the axial housing in the direction of the first outlet orifice.13. The nozzle of wherein the movable element moves translationally in the axial housing in the direction of the first outlet orifice situated at the front face of the nozzle body claim 12 , the front part ...

PULSE WIDTH CONTROLLER

A pulse width controller for a thermal processing system is disclosed. Pulsed electromagnetic radiation is directed through a rotatable wave plate to a polarizing beam splitter, which reflects and transmits according to the phase angle of the wave plate. Radiation transmitted by the polarizing beam splitter is directed into an optical circuit that returns the radiation to the polarizing beam splitter after a transit time. A second rotatable wave plate is positioned in the optical circuit. The polarizing beam splitter reflects and transmits the returned radiation according to the phase angle of the second rotatable wave plate. A second pulse width controller may be nested in the optical circuit, and any number of pulse width controllers may be nested. 1. An optical apparatus , comprising:a first rotatable wave plate having an optical axis;a polarizing beam splitter with a reflecting axis and a transmitting axis, wherein the transmitting axis is substantially parallel to the optical axis of the first rotatable wave plate;a first reflector positioned along the transmitting axis and propagating a first deflected electromagnetic radiation along a first deflection axis; anda second reflector positioned to receive electromagnetic radiation originating from the first reflector and propagate a return electromagnetic radiation along the reflecting axis.2. The optical apparatus of claim 1 , further comprising a second rotatable wave plate having an optical axis substantially parallel to the reflecting axis of the polarizing beam splitter.3. The optical apparatus of claim 1 , wherein the second reflector is positioned along the first deflection axis.4. The optical apparatus of claim 1 , further comprising a third reflector positioned along the first deflection axis and facing a second deflection axis claim 1 , and the second reflector is positioned along the second deflection axis.5. The optical apparatus of claim 2 , further comprising a first actuator coupled to the first ...

Laser welding method

A laser welding method includes emitting two laser beams along a weld line from an upper surface side of a workpiece, the two laser beams being transmitted through different optical fibers and having in-focus spot diameters of 0.3 mm or larger; emitting the laser beams such that a leading laser beam of the two laser beams and a trailing laser beam of the two laser beams are each inclined toward a direction in which welding proceeds at an incident angle with respect to a direction perpendicular to an upper surface of the workpiece, the leading laser beam being ahead of the trailing laser beam on the upper surface of the workpiece in the direction in which welding proceeds, the trailing laser beam being behind the leading laser beam; and setting the incident angle of the leading laser beam to be larger than the incident angle of the trailing laser beam.

BEAM SHAPERS, ANNEALING SYSTEMS EMPLOYING THE SAME, METHODS OF HEAT TREATING SUBSTRATES AND METHODS OF FABRICATING SEMICONDUCTOR DEVICES

A treatment system comprises an energy source that generates a energy beam that is emitted along an energy beam pathway. A beam section shaper is positioned along the energy beam pathway that receives an incident energy beam and modifies a section shape thereof to output a shape-modified energy beam. A beam intensity shaper is positioned along the energy beam pathway that receives an incident energy beam having a first intensity profile and outputs an intensity-modified energy beam having a second intensity profile, wherein the first intensity profile has a relative maximum average intensity at a center region thereof and wherein the second intensity profile has a relative minimum average intensity at a center region thereof. 1. A treatment system comprising:an energy source that generates a energy beam that is emitted along an energy beam pathway;a beam section shaper positioned along the energy beam pathway that receives an incident energy beam and modifies a section shape thereof to output a shape-modified energy beam; anda beam intensity shaper positioned along the energy beam pathway that receives an incident energy beam having a first intensity profile and outputs an intensity-modified energy beam having a second intensity profile, wherein the first intensity profile has a relative maximum average intensity at a center region thereof and wherein the second intensity profile has a relative minimum average intensity at a center region thereof.2. The treatment system of claim 1 , further comprising:a stage positioned along the energy beam pathway at which a substrate is positioned and at which the intensity-modified energy beam is incident.3. The treatment system of wherein the stage is constructed and arranged to receive a substrate.4. The treatment system of wherein the substrate comprises one or more of a photomask and wafer.5. The treatment system of wherein the substrate comprises a chip.6. The treatment system of wherein the stage is constructed and ...

System and method for manufacturing an airfoil

A system for manufacturing an airfoil includes a laser beam and a first fluid column surrounding the laser beam to create a confined laser beam directed at the airfoil. A liquid flowing inside the airfoil disrupts the first fluid column inside the airfoil. A method for manufacturing an airfoil includes confining a laser beam inside a first fluid column to create a confined laser beam and directing the confined laser beam at a surface of the airfoil. The method further includes creating a hole through the surface of the airfoil with the confined laser beam, flowing a liquid inside the airfoil, and disrupting the first fluid column with the liquid flowing inside the airfoil.

LASER PROCESSING APPARATUS

A laser processing apparatus includes a laser generator for generating laser beams, a diffraction optic element for dividing the laser beam generated by the laser generator into a plurality of sub-laser beams, and a beam number controller for controlling the number of the plurality of sub-laser beams. Accordingly, the diffractive optic element that splits a laser beam generated by the laser beam generator into a plurality of sub-laser beams and the beam number controller that controls the number of sub-laser beams are provided so that the processing speed of a processing target can be improved and, at the same time, the number of laser beams can be promptly controlled, thereby promptly forming various patterns of the processing target. 1. A laser processing apparatus , comprising:a laser generator for generating laser beams;a diffraction optic element for dividing the laser beam generated by the laser generator into a plurality of sub-laser beams; anda beam number controller for controlling a number of the plurality of sub-laser beams.2. The laser processing apparatus of claim 1 , the beam number controller comprising a beam blocking device for partially blocking the plurality of sub-laser beams and a location controller for controlling a location of the beam blocking device.3. The laser processing apparatus of claim 2 , the location controller comprising a horizontal location controller for controlling a horizontal location of the beam blocking device and a vertical location controller for controlling a vertical location of the beam blocking device.4. The laser processing apparatus of claim 3 , the beam blocking device comprising a horizontal blocking unit and a vertical blocking unit disposed perpendicular to the horizontal blocking unit.5. The laser processing apparatus of claim 4 , the vertical blocking unit being connected to an end of the horizontal blocking unit.6. The laser processing apparatus of claim 5 , the beam blocking device being formed in a shape of ...

LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

[Object] 122-. (canceled)23. A laser processing apparatus which processes a workpiece by guiding laser beams emitted from a laser oscillator , focusing the laser beams , and irradiating a surface of the workpiece with the focused laser beams , the laser processing apparatus comprising:at least one laser oscillator configured to emit the laser beams;a plurality of optical fibers configured to transmit the emitted laser beams; andat least one optical element configured to focus the laser beams emitted from the optical fibers and irradiate the surface of the workpiece with the focused laser beams,wherein, at output ends of the optical fibers, the output ends of the plurality of optical fibers are placed in one or a plurality of ring shapes, andwherein laser beams transmitted through the plurality of optical fibers placed on at least an outermost ring of the ring shapes each have a linear polarization, and polarization directions of the linearly polarized laser beams emitted from the output ends of the plurality of optical fibers are arranged radially around a center of the outermost ring.24. The laser processing apparatus according to claim 23 , wherein one of the optical fibers is further placed at a central part of the ring.25. The laser processing apparatus according to claim 23 ,wherein the output ends of the plurality of optical fibers are placed in a plurality of ring shapes which share a common center, andwherein, through the optical fibers placed in the ring shapes inside the outermost ring, polarized laser beams are transmitted, the polarized laser beams having polarization directions arranged radially around a center of the ring.26. The laser processing apparatus according to claim 23 ,wherein the output ends of the plurality of optical fibers are placed in a plurality of ring shapes which share a common center, andwherein, through the optical fibers placed in the ring shapes inside the outermost ring, laser beams are transmitted, the laser beams being non- ...

Formation Of Laser Induced Periodic Surface Structures (LIPSS) With Picosecond Pulses

A method of forming a laser induced periodic surface structure (LIPSS), comprises directing a beam of picosecond laser pulses across the surface of a polycrystalline material to pattern the material with a LIPSS, where the laser pulses have a time duration of no greater than a selected pulse duration T and a pulse fluence above a threshold value of about H; wherein the laser pulses are directed across the surface so as to expose the polycrystalline material to at least a selected dosage; wherein T is 40 ps and the selected dosage is 20 J/mm; and wherein H is in J/cmand is given by H=[0.0284×ln (T)]+0.0195. Also disclosed are methods for forming a LIPSS on a semiconductor, for solid colorization of materials, and for forming cone-like features and/or regions of grating-like features where the grating-like features are oriented in substantially different directions. 1. A method of forming a laser induced periodic surface structure (LIPSS) , comprising:directing a beam of picosecond laser pulses across the surface of a material to pattern the material with a LIPSS, the laser pulses having a time duration of no greater than a selected pulse duration T and a pulse fluence above a threshold value of about H, and wherein the laser pulses are directed across the surface so as to expose the material to at least a selected dosage;wherein T is 40 ps;{'sup': '2', 'wherein the selected dosage is 20 J/mm; and'}{'sup': '2', 'wherein H is in J/cmand is given by H=[0.0284×ln (T)]+0.0195.'}2. The method of wherein the material comprises a polycrystalline material.3. The method of wherein T is 25 ps.4. The method of wherein T is 15 ps.5. The method of wherein the selected dosage is 40 J/mm.6. The method of wherein the selected dosage is 60 J/mm.7. The method of wherein the dosage is not greater than 300 J/mm.8. The method of wherein the LIPSS comprises grating like features wherein substantially all of the grating like features are substantially similarly oriented.9. The method of ...

FEMTOSESCOND LASER SYSTEM FOR THE EXACT MANIPULATION OF MATERIAL AND TISSUES

A device for the exact manipulation of material, especially of organic material, includes a pulsed laser system with a radiation source, said radiation source being a cavity-dumped fs oscillator. 1. A device for precise machining of a material , comprising:a pulsed laser system having a beam source,wherein the beam source includes a cavity-dumped fs oscillator.2. The device as recited in claim 1 , wherein the material is an organic material.3. The device as recited in claim 1 , further comprising a beam apparatus for at least one of a beam formation claim 1 , a beam guidance claim 1 , a beam deflection and a beam focussing.4. The device as recited in claim 3 , wherein the beam apparatus is programmable.5. The device as recited in claim 1 , further comprising a holding device configured to one of position and fix the material.6. The device as recited in claim 1 , wherein the cavity-dumped fs oscillator is configured to provide laser pulses having a pulse energy of 100 nJ to 100 μJ.7. The device as recited in claim 6 , wherein the pulse energy is 1 μJ.8. The device as recited in claim 1 , wherein the cavity-dumped fs oscillator is configured to provide laser pulses with repetition rates from 10 kHz to 10 MHz.9. The device as recited in claim 1 , wherein the beam apparatus is configured to apply a working beam of the beam source to the material in a geometrically predeterminable form and in a chronologically predeterminable course.10. The device as recited in claim 9 , wherein the beam apparatus includes a beam deflection device and wherein the a repetition rate of the working beam is changeable during application of the working beam to the material.11. A method for applying a laser beam to a material claim 9 , the method comprising:providing a laser beam having fs pulses using a cavity-dumped fs oscillator beam source;directing the laser beam on the material so as to destroy a cohesion of the material in a focus of the laser beam using photodismption.12. The method as ...

Laser processing method and device

A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided. This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S 11 and S 12 ) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S 13 and S 14 ) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.

LASER PROCESSING SYSTEMS AND METHODS FOR BEAM DITHERING AND SKIVING

A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width. 18-. (canceled)9. A laser processing system comprising:a first positioning system for imparting first relative movement of a laser beam path along a beam trajectory with respect to a surface of the workpiece;one or more processors for determining a second relative movement of the laser beam path along a plurality of dither rows, the second relative movement superimposed on the first relative movement at a predetermined angle with respect to the beam trajectory, the determination of the second relative movement including compensation for changes in a processing velocity along the beam trajectory so as to maintain the predetermined angle for each of the plurality of dither rows;a second positioning system for imparting the second relative movement of the laser beam path; anda laser source for emitting a plurality of laser beam pulses to the workpiece at a plurality of spot locations along the plurality of dither rows to widen a trench in a direction defined by the predetermined angle.10. The system of claim 9 , wherein the predetermined angle is substantially perpendicular to ...

LASER PROCESSING MACHINE

An optical system head of the laser processing machine includes a focusing optical system configured to deflect and condense an incident laser beam so that a target object to be processed is irradiated and a deflecting direction adjusting unit configured to adjust the direction of deflection of the laser beams about at least two axes perpendicular or substantially perpendicular to each other. A nozzle holding head of the laser processing machine includes a cutting nozzle configured to blow a cutting gas at a site of the target object, at which the laser beam is irradiated, and a nozzle position adjusting unit configured to adjust the position of the cutting nozzle in a top plane parallel or substantially parallel to the target object. The optical system head and the nozzle holding head are separately supported by an optical system nozzle support member configured to selectively advance or retract in three axis directions relative to the target object. 14-. (canceled)5. A laser processing machine comprising:an optical system head including a focusing optical system configured to irradiate a target object to be processed by deflecting and condensing a laser beam incident thereupon, and a deflecting direction adjusting unit configured to adjust a direction of deflection of the laser beam from the focusing optical system about at least two axes perpendicular or substantially perpendicular to each other;a nozzle holding head including a cutting nozzle configured to blow a cutting gas to a site of the target object to be processed which is irradiated by the laser beam, and a nozzle position adjusting unit configured to adjust a position of the cutting nozzle in a top plan parallel or substantially parallel to the target object to be processed in synchronism with an operation of the deflecting direction adjusting unit; andan optical system nozzle support member configured to be selectively advanced or retracted relative to the target object in three axis directions ...

GOLF CLUB HEAD AND MANUFACTURING METHOD FOR SAME

A golf club head includes a heel portion, a toe portion, a hosel, and a striking face. The striking face includes a plurality of scorelines each having an average depth no less than about 0.10 mm, a plurality of micro-grooves each having an average depth no greater than about 0.010 mm, and a plurality of textured surface treatment regions superimposed on the micro-grooves so as to at least partially intersect the micro-grooves. 1. A method comprising:(a) mechanically milling a striking face of a golf club head having a central region and a toe region thereby forming a plurality of generally parallel arcuate grooves that extend at least partially into the toe region;(b) forming a plurality of scorelines in the striking face, the scorelines extending horizontally and comprising an average scoreline width, a scoreline heel-ward extent that is coincident with a central region heel-ward extent, and a scoreline toe-ward extent that is coincident with a central region toe-ward extent; and(c) forming by material removal a plurality of horizontally-oriented lines at least in the central region interspersed between, and spaced from, the plurality of scorelines, the plurality of horizontally-oriented lines having an average line width less than the average scoreline width.2. The method of claim 1 , further comprising claim 1 , subsequent to step (a) and prior to step (c) claim 1 , applying a media blast to a portion of the striking face.3. The method of claim 1 , wherein the step (c) comprises forming the horizontally-oriented lines as to be substantially confined to the central region.4. The method of claim 1 , wherein the step (c) further comprises forming the plurality of horizontally-oriented lines by mechanical milling.5. The method of claim 1 , wherein the step (c) comprises forming the horizontally-oriented lines at a concentration of no less than 2 lines between each adjacently-located pair of scorelines of the plurality of scorelines.6. The method of claim 5 , wherein ...

THIN-FILM DEVICES AND FABRICATION

Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations. 122-. (canceled)23. A method of fabricating an optical device , the method comprising , in the following order:depositing a lower transparent conductor layer on a substantially transparent substrate;depositing a defect mitigation insulating (DMIL) layer on the lower transparent conductor layer;removing material down to the DMIL and a predefined depth of material from the lower transparent conductor layer in regions at predefined locations in a bus bar expose area along a side of the substantially transparent substrate;depositing an electrochromic device stack over the substantially transparent substrate; andremoving the electrochromic device stack at the predefined locations to expose the lower transparent conductor layer.24. The method of fabricating the optical device of claim 23 , wherein removing the electrochromic device stack at the predefined locations forms spaced punch through areas penetrating into the lower transparent conductor layer; and further comprising filling the spaced punch through areas with a material to form a bus bar.25. The method of fabricating the optical device of claim 24 ,wherein the spaced punch through areas form a plurality of separated scribe lines along the side of the substantially transparent substrate; andwherein the electrochromic device stack is at least partially intact between the separated scribe lines.26. The method of fabricating the optical device of claim 23 , wherein the bus bar ...

LASER DRILLING AND MACHINING ENHANCEMENT USING GATED CW AND SHORT PULSED LASERS

The present disclosure relates to a laser system for processing a material. The system may make use of a laser configured to intermittently generate a first laser pulse of a first duration and a first average power, at a spot on a surface of the material being processed, and a second laser pulse having a second duration and a second peak power. The second duration may be shorter than the first duration by a factor of at least 100, and directed at the spot. The second laser pulse is generated after the first laser pulse is generated. The first laser pulse is used to heat the spot on the surface of the material, while the second laser pulse induces a melt motion and material ejection of molten material from the melt pool. 1. A laser system for processing a material , the laser system comprising:a laser configured to intermittently generate a first laser pulse of a first duration and a first average power, at a spot on a surface of the material being processed, and a second laser pulse having a second duration and a second peak power, the second duration being shorter than the first duration by a factor of at least 1000, and directed at the spot, and the second laser pulse being generated after the first laser pulse is generated; andthe first laser pulse from the laser is configured to at least heat the spot on the surface of the material, while the second laser pulse induces material ejection from the spot.2. The laser system of claim 1 , wherein the laser comprises:a gated continuous wave (CW) laser; anda pulsed laser.3. The laser system of claim 1 , further comprising a controller for controlling the laser.4. The laser system of claim 2 , further comprising a controller for controlling the CW laser and the pulsed laser.5. The laser system of claim 1 , wherein the first laser pulse has a duration of about 10 μs to 500 μs.6. The laser system of claim 1 , wherein the second laser pulse has a duration of about 1 μs to 100 μs.7. The laser system of claim 1 , wherein the ...

CURVED QUASI-NON-DIFFRACTING LASER BEAMS FOR LASER PROCESSING OF TRANSPARENT WORKPIECES

A method for processing a transparent workpiece comprises directing a laser beam oriented along a beam path into the transparent workpiece such that a portion of the laser beam directed into the transparent workpiece is a laser beam focal arc and generates an induced absorption within the transparent workpiece, the induced absorption producing a defect within the transparent workpiece. The laser beam focal arc has a wavelength λ, a spot size w, and a Rayleigh range Zthat is greater than 2. The method of claim 1 ,wherein the curvature is defined by a line shift direction that deviates from an unaffected beam propagation direction, and{'sub': p', 'p, 'wherein the line shift direction varies in the x-direction according to a line shift function x(z) or the line shift direction varies in the y-direction according to a line shift function y(z); and'}{'sub': p', 'p, 'wherein the z-direction is the unaffected beam propagation direction and at least one of x(z) and y(z) is non-zero.'}3. The method of claim 2 , wherein the line shift function x(z) claim 2 , the line shift function y(z) claim 2 , or both comprise a hyperbola claim 2 , a parabola claim 2 , a circle claim 2 , an ellipse claim 2 , a logarithmic function claim 2 , an exponential function claim 2 , portions thereof claim 2 , or combinations thereof.4. The method of claim 2 , wherein the line shift function x(z) or the line shift function y(z) is 0.5. The method of claim 2 , wherein the defect has a central axis not aligned with the unaffected beam propagation direction.6. The method of claim 2 , wherein the unaffected beam propagation direction z is oriented at a non-normal angle of incidence to the transparent workpiece.7. The method of claim 1 , wherein the curvature is produced by impinging the laser beam on a phase-altering optical element.8. The method of claim 7 , wherein the phase-altering optical element comprises a spatial light modulator or adaptive optic.9. The method of claim 7 , wherein the phase- ...

Method for Nano-Structuring Polmer Materials Using Pulsed Laser Radiation in an Inert Atmosphere

In a method for generating a surface having a solid polymeric material, which has surface structures with dimensions in the sub-micrometer range, the untreated surface, on which the structures are to be generated and which are accessible to laser radiation, is scanned once or multiple times using a pulsed laser beam in an inert gas atmosphere in such a way that adjacent light spots of the laser beam adjoin each other in a gapless manner or overlap and a certain range of a specified relation between process parameters is observed.

Laser processing apparatus

The present disclosure provides a laser processing apparatus. A laser processing apparatus includes a laser generator, a laser amplifier, a chromatic dispersion tuner and an optical focusing unit. The laser generator is configured to generate ultrashort pulse laser having chirp characteristics by simultaneously generating a plurality of wavelengths. The laser amplifier is configured to amplify the laser generated by the laser generator. The chromatic dispersion tuner is configured to adjust chirp and pulse width of the laser output from the laser amplifier. The optical focusing unit is configured to irradiate a workpiece with the laser after adjusting the depth of focus of the laser with the chirp and the pulse width adjusted by the chromatic dispersion tuner.

LASER SYSTEM AND METHOD FOR PROCESSING SAPPHIRE

Laser processing of sapphire is performed using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm (hereinafter “QCW laser”). Laser processing of sapphire using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 10%) and in an inert gas atmosphere such as argon or helium. Laser processing of sapphire using a QCW laser may further include the use of an assist laser having a shorter wavelength and/or pulse duration to modify a property of the sapphire substrate to form absorption centers, which facilitate coupling of the laser light pulses of the QCW laser into the sapphire. 1. A method for laser processing a sapphire substrate , the method comprising:periodically switching on a power source to pulse a continuous wave laser, thereby operating the laser in a quasi-continuous wave (“QCW”) mode so as to emit consecutive pulses of laser light at a wavelength ranging between about 1060 nm and about 1070 nm;focusing the pulses of laser light at the sapphire substrate; andlaser processing the sapphire substrate with the pulses of laser light.2. The method of further comprising supplying inert gas in a vicinity of the sapphire substrate.3. The method of claim 2 , wherein the inert gas is selected from the group consisting of argon and helium.4. The method of claim 1 , wherein laser processing the sapphire substrate is selected from the group consisting of cutting claim 1 , scribing claim 1 , and drilling.5. The method of claim 1 , wherein laser processing includes cutting with a speed between about 10 and 40 inches per minute claim 1 , and wherein the sapphire substrate has a thickness between about 0.1 and about 1 mm.6. The method of claim 1 , wherein the laser is an ytterbium fiber laser.7. The method of claim 1 , wherein the laser is operated with a duty cycle ranging between about 1% and about 10%.8. The method of claim 1 , wherein ...

METHOD FOR JOINING DIFFERENT KINDS OF PLATES

The present invention relates to a joining method, and more specifically relates to a method for joining different kinds of plates that joins at least two plate members of which materials thereof are different from each other through laser welding. For this, a method for joining different kinds of plates according to an exemplary embodiment of the present invention may include disposing a first plate and a second plate, materials of which are different from each other, such that they are overlapped with each other, and joining the first plate and the second plate by irradiating a laser beam at a predetermined inclination angle and in a regular pattern onto the overlapped portion of the two plates. 1. A method for joining different kinds of plates , comprising:disposing a first plate and a second plate, materials thereof being different from each other, such that they are overlapped with each other; andjoining the first plate and second plate by irradiating a laser beam at a predetermine inclination angle and in a regular pattern onto the overlapped portion of the two plates.2. The method for joining different kinds of plates of claim 1 , wherein the first plate is made of aluminum and the second plate is disposed on the first plate and is made of steel of which a melting point is higher than that of the first plate.3. The method for joining different kinds of plates of claim 2 , wherein the laser beam is outputted as a regular pulse wave.4. The method for joining different kinds of plates of claim 2 , wherein a welding pool of the second plate is charged in a key hole formed on the first plate between the first plate and the second plate.5. The method for joining different kinds of plates of claim 2 , wherein the laser beam performs conduction welding that can form a welding pool on a plate member through a non-focus part.6. The method for joining different kinds of plates of claim 5 , wherein the laser beam is irradiated such that the diameter of the laser beam ...

Machining Head for a Laser Machining Device

A processing head for a laser processing device adapted for processing a workpiece using laser radiation has: adjustable focusing optics to focus laser radiation in a focal spot having an adjustable distance from the processing head; an optical coherence tomograph to measure a distance between the processing head and the workpiece by measuring an optical interference between measuring light reflected by the workpiece and measuring light not reflected by the workpiece; a path length modulator that can change, synchronously with and dependent on a change of the focal spot distance from the processing head, an optical path length in an optical path along which measuring light propagates; a scanning device, which deflects the laser radiation in different directions; and a control device, which i) controls a focal length of the focusing optics in such a way that the focal spot is situated at a desired location on the workpiece, ii) receives, from the coherence tomograph, information representing the distance between the processing head and the workpiece, and iii) uses information received from the coherence tomograph for a continuous correction of a positioning of the focal spot on the workpiece. 1. A processing head for a laser processing device adapted for the processing of a workpiece using laser radiation , wherein the processing head comprises;adjustable focusing optics configured to focus the laser radiation in a focal spot having an adjustable distance from the processing head;an optical coherence tomograph configured to measure a distance between the processing head and the workpiece by measuring an optical interference between measuring light, which was reflected by the workpiece, and measuring light, which was not reflected by the workpiece;a path length modulator that is configured to change, synchronously with and dependent on a change of the distance of the focal spot from the processing head, an optical path length in an optical path along which measuring ...

LASER PROCESSING APPARATUS

Disclosed herein is a laser processing apparatus that includes a laser generation unit configured to generate a laser beam to process a workpiece, a first fluid jet generation unit configured to generate and inject a first fluid jet to deliver the laser beam to the workpiece, and a second fluid jet generation unit configured to inject a second fluid jet around the laser beam, wherein the first and second fluid jets are simultaneously or selectively injected. 1. A laser processing apparatus , comprising:a laser generation unit configured to generate a laser beam to process a workpiece;a first fluid jet generation unit configured to generate and inject a first fluid jet into a first fluid to deliver the laser to the workpiece;a second fluid jet generation unit configured to inject a second fluid jet to a second fluid around the laser beam; andan assist injection unit configured to inject an assist fluid to the workpiece,wherein the first fluid of the first fluid jet and the assist fluid of the assist injection unit are supplied by the same pump, respectively, as the same fluid.2. The laser processing apparatus according to claim 1 , wherein the first fluid jet is a liquid claim 1 , and the second fluid jet is a gas.3. The laser processing apparatus according to claim 1 , wherein one of the first and second fluid jets is water claim 1 , and the other is a liquid containing water.4. The laser processing apparatus according to claim 1 , wherein the first fluid jet generation unit comprises:a first fluid chamber configured to accommodate a first fluid for generating the first fluid jet;a water supply section configured to supply the first fluid to the first fluid chamber; anda nozzle configured to inject the first fluid in the first fluid chamber to the workpiece.5. The laser processing apparatus according to claim 1 , wherein the second fluid jet generation unit comprises:a second fluid chamber configured to accommodate a second fluid;a second fluid supply section ...

METHOD AND APPARATUS FOR USE IN LASER SHOCK PEENING

An apparatus may include a diode-pumped solid-state laser oscillator configured to output a pulsed laser beam, a modulator configured to modify an energy and a temporal profile of the pulsed laser beam, and an amplifier configured to amplify an energy of the pulse laser beam. A modified and amplified beam to laser peen a target part may have an energy of about 5J to about 10 J, an average power (defined as energy (J) x frequency (Hz)) of from about 25 W to about 200 W, with a flattop beam uniformity of less than about 0.2. The diode-pumped solid-state oscillator may be configured to output a beam having both a single longitudinal mode and a single transverse mode, and to produce and output beams at a frequency of about 20 Hz. 130-. (canceled)31. A system comprising:a diode-pumped solid-state laser (DPSSL) oscillator configured to generate a pulsed laser beam having a first set of laser beam characteristics;a modulator configured to modify the pulsed laser beam to generate a modulated pulsed laser beam, wherein the modulated pulsed laser beam has a second set of laser beam characteristics;a multi-stage amplifier configured to modify the modulated pulsed laser beam to generate a first pulsed laser beam, wherein the first pulsed laser beam has a third set of laser beam characteristics, and further configured to modify the first pulse laser beam to generate a second pulsed laser beam, wherein the second pulsed laser beam has a fourth set of laser beam characteristics; anda beam delivery system configured to deliver the second pulsed laser beam to a target part to laser shock peen the target part.32. The system of claim 31 ,wherein the first set of laser beam characteristics comprises a first energy, a first temporal profile, and a first spatial profile;wherein the second set of laser beam characteristics comprises a second energy, a second temporal profile, and the first spatial profile;wherein the third set of laser beam characteristics comprises a third energy, a ...

Laser wire processing device

A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.

Method for decorating parts and decorated parts

A method for decorating a given part is designed to print designs onto a coat layer deteriorating the coat layer on the surface of the given part. In the coat layer-forming process, in spreading the metallic-coating material containing aluminum flake onto the surface of the resin compact, the coat layer is formed on the surface of it. In a laser-printing process, a laser is irradiated on the condition of being able to maintain the same state of the coat layer before and after irradiating the laser, so as to reduce the aspect ratio of the micronized-metallic powder, which is the average value of the ratio of the maximum dimension of the micronized-metallic powder to the average value of the minimum dimension of the micronized-metallic powder, which laser irradiation eventually thermally deforms the first scale-shaped micronized-metallic powder into a spherical shape in the coat layer to print designs on the film.