Laser device for drilling holes in components of a fluid injection device

The laser machining device is provided for drilling holes in components of a fluid injection device, particularly for injecting fuel into a combustion engine. The laser resonator is formed by an optically pumped diode laser solid state active medium. The resonator is arranged for supplying primary pulses in the microsecond range. Modulation means are arranged between the resonator and a machining head for modulating the amplitude of the primary pulses supplied by the resonator, so as to obtain a secondary pulse train of smaller length for each of said pulses.

Device provided with at least one laser diode and assembly including such a device and a connector to an electric power supply

The device is provided with at least one laser diode (2) and two electric connecting members for connection to an electric power supply (8) for supplying said at least one laser diode. It includes two elements (14, 16) which can be elastically deformed or moved, which are conductive electrically and arranged in a base electrically insulated from the two connecting members. The two elastically deformable or moveable elements are electrically connected and arranged so as to abut against two respective contact surfaces (34, 36) of the two connecting members when the device is not connected to said power supply by means of an external connector (40) which is complementary to the two electric connecting members. The two elastically deformable or moveable elements are respectively separated from the two connecting members when the external connector is introduced or are able to be respectively separated from said two connecting members when the external connector is introduced.

PULSED LASER MACHINING METHOD AND PULSED LASER MACHINING EQUIPMENT, IN PARTICULAR FOR WELDING WITH VARIATION OF THE POWER OF EACH LASER PULSE

A laser machining method includes A) generating, by a laser source, a laser beam having an initial wavelength between 700 and 1200 nanometers of laser pulses; B) doubling frequency of one part of the laser beam by a non-linear crystal; C) varying power throughout each emitted laser pulse so that the power profile has a maximum peak power or part of the pulse with a maximum power in an initial sub-period, and throughout an intermediate sub-period of longer duration than the initial sub-period, a lower power than the maximum power. The maximum power value is at least two times higher than the mean power throughout the laser pulse and an increase time to maximum power from a start of each laser pulse is less than 0.3 milliseconds. The machining method can concern welding highly reflective metals, copper, gold, silver, or an alloy including one of these metals. 128-. (canceled)29. A laser machining method comprising:A) generating, by a laser source, a laser beam having a wavelength of between 700 and 1200 nanometers formed of a series of laser pulses;B) doubling the frequency of one part of said laser beam by a non-linear crystal;C) varying luminous power emitted during each laser pulse so that the power profile at the initial wavelength throughout a period of the laser pulse has, in an initial sub-period, a power peak with a maximum power or part of the pulse with a maximum power and, in an intermediate sub-period of longer duration than the initial sub-period and occurring thereafter, a lower power than the maximum power throughout the entire intermediate sub-period, the maximum power having a value at least two times higher than the mean power throughout the period of the laser pulse and an increase time to the maximum power from the start of each laser pulse being less than 0.3 millisecond (300 μs).30. The laser machining method according to claim 29 , wherein the duration of the initial sub-period is less than two milliseconds (2 ms).31. The laser machining method ...

FIBRE OPTIC LASER MACHINING EQUIPMENT FOR ETCHING GROOVES FORMING INCIPIENT CRACKS

The laser machining equipment for etching grooves in a wall of a mechanical part, in particular of a connecting rod for a spark ignition engine, is provided with a fibre optic laser device and arranged to supply laser pulses. The fibre optic laser device is controlled so that said laser pulses have a peak power of more than 400 W and at least two times greater than the maximum mean power of said laser device and in that the duration of said laser pulses is below or within the nanosecond range (1 ns to 1000 ns). According to a first embodiment, the fibre optic laser device is controlled in a quasi continuous wave (QCW) mode. According to a second preferred embodiment, the fibre optic laser device is controlled in a Q-switch mode. The selected operating modes increase machining efficiency and produce a groove with an optimum transverse profile, particularly with a small mean radius of curvature at the bottom of the groove which then allows precise subsequent fracturing of the mechanical part with less force. 1. A method of etching at least one groove in a lateral wall or surface of a mechanical part by laser pulses supplied by a fiber optic laser device , the groove defining an incipient crack for subsequent fracturing of the mechanical part into at least two pieces , the method comprising:controlling the fiber optic laser device so that the laser pulses have a peak power of more than 400 W and at least two times greater than the mean maximum power of the laser device, andwherein a duration of the laser pulses is below or within the nanosecond range of 1 ns to 1000 ns.2. The etching method according to claim 1 , wherein the fiber optic laser device operates in a quasi continuous wave mode.3. The etching method according to claim 2 , wherein the laser pulses have a peak power of between 400 W and 3000 W.4. The etching method according to claim 1 , wherein the fiber optic laser device is operated in a Q-switch mode.5. The etching method according to claim 1 , wherein ...

Laser Device Formed By a Stack of Laser Diodes

The laser device (22) is formed by a stack of laser diodes (4) arranged on plates (6) formed of a material that is electrically conductive and a good heat conductor. In order to obtain a high level of heat evacuation efficiency towards the cooling body (10) and to prevent electric short-circuiting problems, each plate has at the bottom end (24) thereof, an electrically insulating layer deposited on the surface thereof prior to being fixed to the cooling body by a securing material (26) that is preferably a good heat conductor, formed in particular by a braze layer. According to the invention, the insulating layer covers the end face of each plate and also goes up along the lateral faces of the latter over a certain height. The securing material is arranged under the end of the plate and also partially covers the insulating layer along the lateral faces of the plate.

Process to produce a workpiece surface on a rod-shaped workpiece

A process to produce a workpiece surface or a groove inner surface on a rod-shaped, especially cylindrical workpiece. From the workpiece, a rotary tool is supposed to be produced. The material removal is done using laser beam pulses, which are directed through a deflection device onto points of incidence within a pulse area with a specified outside contour on the workpiece. Multiple machine axis drives position the workpiece and the deflection device relative to one another so that the pulse area is oriented essentially at right angles to the emission direction of the laser beam pulses and at right angles to the section of the tool surface that has already been produced and that borders the pulse area. While the material is being removed, the at least one machine axis drive moves the pulse area relative to the workpiece along a specified path of motion while maintaining the orientation.

Laser device which is used to pierce holes in components of a fluid-injection device

The laser machining device is provided for drilling holes in components of a fluid injection device, particularly for injecting fuel into a combustion engine. The laser resonator is formed by an optically pumped diode laser solid state active medium. The resonator is arranged for supplying primary pulses in the microsecond range. Modulation means are arranged between the resonator and a machining head for modulating the amplitude of the primary pulses supplied by the resonator, so as to obtain a secondary pulse train of smaller length for each of said pulses.

Laser device formed by a stack of laser diodes

The laser device (22) is formed by a stack of laser diodes (4) arranged on plates (6) formed of a material that is electrically conductive and a good heat conductor. In order to obtain a high level of heat evacuation efficiency towards the cooling body (10) and to prevent electric short-circuiting problems, each plate has at the bottom end (24) thereof, an electrically insulating layer deposited on the surface thereof prior to being fixed to the cooling body by a securing material (26) that is preferably a good heat conductor, formed in particular by a braze layer. According to the invention, the insulating layer covers the end face of each plate and also goes up along the lateral faces of the latter over a certain height. The securing material is arranged under the end of the plate and also partially covers the insulating layer along the lateral faces of the plate.

FIBRE OPTIC LASER MACHINING EQUIPMENT FOR ETCHING GROOVES FORMING INCIPIENT CRACKS

A laser machining equipment for etching grooves in a wall of a mechanical part, or in a connecting rod for a spark ignition engine, includes a fiber optic laser device arranged to supply laser pulses. The fiber optic laser device is controlled so that laser pulses have a peak power of more than 400 W and at least two times greater than maximum mean power of the laser device, and duration of the laser pulses is below or within the nanosecond range of 1 ns to 1000 ns. The fiber optic laser device can be controlled in a quasi continuous wave (QCW) mode, or can be controlled in a Q-switch mode. The selected operating modes increase machining efficiency and produce a groove with an optimum transverse profile, particularly with a small mean radius of curvature at a bottom of the groove which then allows precise subsequent fracturing of the mechanical part with less force.

Process to produce a workpiece surface on a rod-shaped workpiece

A process to produce a workpiece surface or a groove inner surface on a rod-shaped, especially cylindrical workpiece. From the workpiece, a rotary tool is supposed to be produced. The material removal is done using laser beam pulses, which are directed through a deflection device onto points of incidence within a pulse area with a specified outside contour on the workpiece. Multiple machine axis drives position the workpiece and the deflection device relative to one another so that the pulse area is oriented essentially at right angles to the emission direction of the laser beam pulses and at right angles to the section of the tool surface that has already been produced and that borders the pulse area. While the material is being removed, the at least one machine axis drive moves the pulse area relative to the workpiece along a specified path of motion while maintaining the orientation.

Milbemycin derivatives for combating insects and parasites

Milbemycin D derivatives of the formula I with a carbohydrate residue in position 5 <IMAGE> in which A, B, C, k and m have the stated definitions, can be used for controlling insect ecto- and endoparasites, especially nematodes which are animal parasites. The compounds can be used as such or in the form of suitable agents.

13-Beta-sugar derivatives of milbemycine, their preparation and use as ekto- and endo-parasitic agents for treatment of animals and plants

There are described parasiticidally and insecticidally highly-active substances of the formula I <IMAGE> where R1 is hydrogen or a protective group; R2 represents methyl, ethyl, isopropyl or sec.-butyl; and R represents a sugar radical, and their preparation starting from the correspondingly substituted 13 beta -hydroxy-milbemycins.

Milbemycin derivatives with pesticide properties

Pesticides

Insecticides and parasiticides

The present invention relates to novel 5-oximino-13β-carbonylthiomilbemycin derivatives of formula I, to their preparation and to the use thereof for controlling pests. The invention further relates to pesticidal compositions which contain at least one of these compounds as active ingredient. The novel compounds have the general formula I ##STR1## wherein R 1 is hydrogen or an alkyl, cycloalkyl or acyl group, R 2 is methyl, ethyl, isopropyl or sec-butyl, or is the ##STR2## group, wherein X is methyl, ehtyl or isopropyl, and R is hydrogen or an unsubstituted or substituted straight chain or branched C 1 -C 18 alkyl group, an unsubstituted or substituted cycloaliphatic group of 3 to 10 carbon atoms, an unsubstituted or substituted C 2 -C 6 alkenyl group, an unsubstituted or substituted C 2 -C 6 alkynyl group, an unsubstituted or substituted phenyl group or an unsubstituted or substituted benzyl group.

Production of epoxymilbemycin by utilization of microorganism

(57)【要約】 【課題】植物の吸液虫、食害虫、線虫や動物の寄生虫類 の防除に有効なエポキシミルベマイシンの微生物利用に よる製法の提供。 【解決手段】液相中に溶解した式ＩＩＩのミルベマイシ ンに、１４，１５−エポキシ化反応を行うことのできる ストレプトマイセス種の微生物（ＡＴＣＣ３１５６０， ３１５６１等）を該反応を行うのに十分な時間接触させ ることからなる式ＩＩの１４，１５−エポキシ−ミルベ マイシンの微生物利用による一段階製法。 【化１】 〔基の例：Ｒ 1 ’，Ｒ 3 ＝メチル，エチル，イソプロピ ル，第二ブチル基等、Ａ’，Ｒ 4 ＝−Ｃ（ＯＨ）Ｈ−， ＞Ｃ＝Ｎ〜ＯＨ等〕

Pesticidal 13b-substituted milbemycin derivatives

Device having at least a diode laser, assembly comprising such a device and a connector for electrical power supply

13-halomilbemycin derivatives,their preparation and composition containing them

Macrolide compounds, their preparation and their use

13BETA-MILBEMYCINE DERIVATIVES AND THEIR PREPARATION AND USE

MACROLIDE DERIVATIVES, THEIR PRODUCTION AND THEIR USE.

Derivatives of 13-beta-alkyl-mylbemycin for combating animal and plant parasites

Es werden parasitizid und insektizid hochaktive Wirkstoffe der Formel I <IMAGE> worin R für C1-C10-Alkyl steht: R1 Wasserstoff, eine Silylgruppe oder einen Zuckerrest repräsentiert; und R2 für Methyl, Ethyl, Isopropyl oder sek.-Butyl steht, beschrieben, sowie ihre Herstellung ausgehend von den entsprechend substituierten 15-Ester- bzw. 13β-Ester-Milbemycinen. Parasiticidal and insecticidal highly active substances of the formula I <IMAGE> in which R represents C1-C10-alkyl: R1 represents hydrogen, a silyl group or a sugar residue; and R2 represents methyl, ethyl, isopropyl or sec-butyl, and their preparation starting from the correspondingly substituted 15-ester or 13β-ester milbemycins.

Device and method for structuring solar modules using a laser

The invention relates to a device and a method for structuring modules, in particular large format modules such as solar modules. This device comprises holding means for holding a module (SM) and at least one laser means for emitting a laser beam (CB, CB', FB') towards a surface of the module (SM) for structuring the module. A beam-shaping means (A) is positioned in the optical path of the laser beam (CB, CB', FB') between the laser means and the surface of the module (SM) to be structured.

13-0-substd. milbemycin derivs. - with insecticidal, acaricidal, nematocidal and anthelmintic activity, prepd. by etherification of 13-0 unsubstituted cpds

Milbemycin (avermectin) derivs. of formula (I) are new: R1=H or a protecting gps; R2=methyl, ethyl, isopropyl or sec-butyl; R=oxacycloalkyl which is opt. further substd. and which opt. contains an endocyclic double bond. USE - Pesticides, especially insecticides and acaricides, suitable for use against ecto-and endoparasites in animals, as well as in plant protection and in the hygiene sector. (I) an also active against plant nematodes and particularily against helminths, including endoparasitic nematodes.

3-aminobenzoylphenylureas.

Macrolide compounds their preparation and their use

Macrolide compounds, their preparation and their use

Pesticidal 13b-substituted milbemycin derivatives

Method for the material-removing laser machining of a workpiece

Die Erfindung betrifft ein Verfahren zum materialabtragenden Bearbeiten eines Werkstücks (16) durch LaserstrahlImpulse (P). Die LaserstrahlImpulse (P) werden auf Auftreffstellen (27) auf die Oberfläche (31) eines abzutragenden Volumens (V) des Werkstücks (16) gerichtet, um Material von dem abzutragenden Volumen (V) zu entfernen. Durch das Entfernen des abzutragenden Volumens (V) entsteht am Werkstück (16) eine neue, herzustellende Konturfläche (29). Ein Auftreffwinkel (a) der LaserstrahlImpulse (P) relativ zu der herzustellenden Konturfläche (29) wird während des Abtragens zumindest des Teils des abzutragenden Volumens (V), der unmittelbar an die herzustellende Konturfläche (29) angrenzt, gemäß einer vorgegebenen Bedingung eingestellt. Gemäß dieser Bedingung ist der Auftreffwinkel gleich groß wie ein Schwellenwinkel (as) oder etwas kleiner. Der Schwellenwinkel (as) entspricht dem Auftreffwinkel, an dem eine effektive Laserenergiedichte (Eeff) an der Auftreffstelle (27) der Laserstrahlimpulse (P) an der herzustellenden Konturfläche (29) gleich groß ist wie eine Schwellenfluenz (Fs). Ein Materialabtrag findet an einer Auftreffstelle (27) nur dann statt, wenn die effektive Laserenergiedichte (Eeff) größer ist als die Schwellenfluenz (Fs). Dadurch kann erreicht werden, dass nur solche Volumenelemente des abzutragenden Volumens (V) entfernt werden, die sich an die gewünschte herzustellende Konturfläche (29) anschließen. Durch das Steuern oder Regeln des Auftreffwinkels (a) kann somit sehr genau die gewünschte Konturfläche (29) an dem Werkstück (16) erzeugt werden.

Laser device formed by a stack of laser diodes

The laser device (22) is formed by a stack of laser diodes (4) placed on wafers (6) made of an electrically conductive material and having a good heat conductivity. In order to obtain a good efficiency in the evacuation of heat toward the cooling body (10) and to avoid the problems associated with an electrical short circuit, each wafer has, on its lower end (24), an electrically non-conductive layer placed on its surface before fastening to the cooling body by a fastening material (26) that preferably conducts heat well, formed, in particular, by a solder layer. According to the invention, the non-conductive layer covers the end side of each wafer and rises along the lateral sides thereof at a certain height. The invention provides that the fastening material is placed under the end of the wafer and that it also partially covers the non-conductive layer along the lateral sides of the wafer.

PROCESS FOR THE PREPARATION OF MACROLID COMPOUNDS AND ANTI-HELMINTH COMPOSITIONS, ACARICIDES AND INSECTICIDES CONTAINING THEM

13β-alkylmilbemycin derivatives for controlling parasites of animals and plants

The invention relates to parasiticidally and insecticidally highly active compounds of formula I ##STR1## wherein R is C 1 -C 10 alkyl; R 1 is hydrogen, a silyl group or a sugar residue; and R 2 is methyl, ethyl, isopropyl or sec-butyl, and to the preparation thereof starting from suitably substituted 15-ester or 13β-ester milbemycins.

13.beta.-MILBEMYCIN DERIVATIVES FOR CONTROLLING ECTO- AND ENDOPARASITES OF PLANTS AND ANIMALS

5-15178/+ 13.beta.-Milbemycin derivatives for controlling ecto- and endoparasites of plants and animals Abstract of the Disclosure The invention relates to parasiticidally and insecticidally highly active compounds of formula I (I) wherein R1 is hydrogen or a protecting group; R2 is methyl, ethyl, isopropyl or sec-butyl; and R is a radical R3 which is bound through oxygen or sulfur and is selected from the group consisting of C1-C10alkyl, C1-C10halo-alkyl, C1-C10hydroxyalkyl, C1-C10mercaptoalkyl, C2-C10alkoxy-alkyl, C3-C10alkoxyalkoxyalkyl, hydroxy- or mercapto-substituted C3-C10alkoxyalkoxyalkyl, C4-C15alkoxyalkoxyalkoxyalkyl, hydroxy-or mercapto-substituted C4-C15alkoxyalkoxyalkoxyalkyl; C2-C10-alkenyl, C2-C10haloalkenyl, C2-C10alkynyl, C2-C10haloalkynyl, phenyl which is unsubstituted or substituted by halogen, C1-C3-alkyl, C1-C3haloalkyl, C1-C3alkoxy, C1-C3haloalkoxy, cyano and/or nitro, snd benzyl which is unsubstituted or substituted by halogen, C1-C3alkyl, C1-C3haloalkyl, C1-C3alkoxy, C1-C3halo-alkoxy, cyano and/or nitro, or R is one of the groups -SH or -S-C(O)OR4, wherein R4 is C1-C10alkyl, C1-C10haloalkyl, or a phenyl or benzyl group which is unsubstituted or substituted by halogen, C1-C3alkyl, C1-C3haloalkyl, C1-C3alkoxy, C1-C3halo-alkoxy, cyano and/or nitro, and to the preparation thereof starting from suitably substituted 15-hydroxy- or 13.beta.-hydroxymilbemycins of formula II.

Multifunctional device for structuring large format modules

The present invention relates to a multifunctional device (1) for structuring large format modules, in particular solar modules, comprising means (20, 21) for holding and displacing a large format module (TFM) and at least one laser head (31, 32, 33, 34) for structuring the surface (S) of the large format module (TFM), the at least one laser head (31, 32, 33, 34) being arranged in a way movable with respect to the large format module (TFM), in which device at least one laser source (41, 42, 43, 44) is positioned at a fixed position, the laser beams being supplied from the at least one laser source (41, 42, 43, 44) to the at least one laser head (31, 32, 33, 34) by means of a fibre-based guide (51, 52, 53, 54). The present invention also relates to a corresponding method for structuring large format modules.

Vorrichtung, die mindestens eine laserdiode umfasst, anordnung mit einer derartigen vorrichtung und einem stecker zur elektrischen stromversorgung

Procedimiento para la fabricación de una superficie de pieza de trabajo en una pieza de trabajo en forma de barra

La invención se refiere a un método para producir una superficie de pieza de trabajo (23) o una superficie interna de ranura (25) en una pieza de trabajo (11) en forma de barra, en particular cilíndrica. A partir de la pieza de trabajo (11) se pretende producir una herramienta giratoria (40). La eliminación de material para producir la superficie de la pieza de trabajo (23) se lleva a cabo con la ayuda de pulsos de rayos láser (B) que se dirigen a través de un dispositivo deflector (14) sobre puntos de impacto (31) dentro de un área de pulso (22) con un predeterminado contorno exterior (K) y sobre la pieza de trabajo (11). El posicionamiento entre la pieza de trabajo (11) y el dispositivo de desviación (14) se obtiene aquí a través de una pluralidad de accionamientos del eje de la máquina (18) de tal manera que el área del pulso (22) está orientada sustancialmente en ángulo recto a la dirección de emisión (R) de los pulsos del rayo láser y en ángulo recto con la parte de la superficie de la pieza de trabajo (23) que ya se ha producido y se une al área del pulso (22). Durante la eliminación de material, el área de impulsos (22) se mueve a través del al menos un accionamiento del eje de la máquina (18) a lo largo de una trayectoria de movimiento predeterminada (38) mientras se mantiene la orientación relativa a la pieza de trabajo (11). (Traducción automática con Google Translate, sin valor legal)

Menetelmä lääkeaineina käyttökelpoisten milbemysiinin johdannaisten valmistamiseksi

Procedimiento de grabado de, como mínimo, una ranura para formar un inicio de rotura con ayuda de un dispositivo láser con fibra óptica

Procedimiento de grabado de, como mínimo, una ranura (8,9; 30) en una pared lateral o una superficie de unapieza mecánica (4; 84) por medio de impulsos láser facilitados por un dispositivo láser con fibra óptica, definiendodicha ranura un inicio de rotura para la fractura posterior de esta pieza mecánica en un mínimo de dos partes,caracterizándose este procedimiento de grabado porque el dispositivo láser con fibra óptica está controlado demanera que dichos impulsos láser presentan una potencia de cresta superior a 400W y, por lo menos, dos vecessuperior a la potencia media máxima de dicho dispositivo láser, y porque la duración de dichos impulsos láser seencuentra en el campo de los nanosegundos (1 ns a 1000 ns) o inferior.

Fiber-optic laser-machining equipment for etching grooves forming incipient cracks

Procedimiento de grabado de, como mínimo, una ranura para formar un inicio de rotura con ayuda de un dispositivo láser con fibra óptica

Método de gravação por um dispositivo a laser de fibra ótica e equipamentos de usinagem para realização do método

equipamento de usinagem a laser de fibra óptica para a gravação de ranhuras formado fendas incipientes. o equipamento de laser para a usinagem de decapagem ranhuras uma parade de uma peça mecânica, em particular, de uma biela para um motor de ignição por faísca, é provido de um dispositivo de laser de fibra óptica e disposto de modo a fornecer pulsos de laser. o dispositivo de laser de fibra óptica é controlada de modo que o referido impulso de laser tem uma potência de pico de mais de 400 w, e pelo menos duas vezes maior do que a potência máxima média do referido dispositivo de laser e em que a duração dos referidos impulsos laser está abaixo ou dentro do faixa de monossegundos (1ns a 1000 ns) . de acordo com uma primeira forma de realização, o dispositivo de laser de fibra óptica é controlada de um modo contínuo de onda quasi (qcw). de acordo com segunda forma de realização preferida, o dispositivo de laser de fibra óptica é controlada de um modo q-interruptor. os modos de funcionamento selecionados aumentar a eficiência da máquina e produzir um sulco com um perfil transversal óptima, em particular com um pequeno raio médio de curvatura do fundo da ranhura, que permite então que fratura subsequente preciso da parte mecânica com menos força.

Device for structuring large format modules

The present invention relates to a device (1) for structuring large format modules, in particular solar modules, comprising means (20, 21) for holding and displacing a large format module (SM) and at least one laser head (31, 32, 33, 34) for structuring the surface of the large format module (SM), the at least one laser head (31, 32, 33, 34) being arranged in a way movable in at least two directions beneath the large format module (SM), in which device at least one laser source (41, 42, 43, 44) is positioned at a fixed position, the laser beams being supplied from the at least one laser source (41, 42, 43, 44) to the at least one laser head (31, 32, 33, 34) by means of a fibre-based guide (51, 52, 53, 54). The present invention also relates to a corresponding method for structuring large format modules.

Laservorrichtung, die zur herstellung von löchern in bauteilen einer fluideinspritzvorrichtung verwendet wird

Menetelmä lääkeaineina käyttökelpoisten milbemysiinin johdannaisten valmistamiseksi

Menetelmä lääkeaineina käyttökelpoisten milbemysiinin johdannaisten valmistamiseksi

Laservorrichtung, die zur herstellung von löchern in bauteilen einer fluideinspritzvorrichtung verwendet wird

Device for structuring large format modules

DISPOSITIF LASER POUR PERCER DES TROUS DANS DES COMPOSANTS D&apos;UN DISPOSITIF D INJECTION D UN FLUIDE

Dispositif laser pour percer des trous dans des composants d'un dispositif d'injection d'un fluide

Le dispositif d'usinage laser est prévu pour percer des trous dans des composants d'un dispositif d'injection d'un fluide, notamment d'un carburant dans un moteur à combustion. Le résonateur laser (4) est formé par un milieu actif solide pompé optiquement au moyen de diodes laser. Le résonateur est agencé pour fournir des impulsions primaires dans le domaine des microsecondes. Entre le résonateur et une tête d'usinage (24) sont agencés des moyens de modulation (8) permettant de moduler l'amplitude des impulsions primaires fournies par le résonateur, de manière à obtenir pour chacune de ces impulsions un train d'impulsions secondaires de durée inférieure.

Dispositif laser forme par un empilement de diodes laser

Le dispositif laser (22) est formé par un empilement de diodes laser (4) agencées sur des plaquettes (6) formées d'un matériau électriquement conducteur et ayant une bonne conductivité thermique. Pour obtenir une bonne efficacité de l'évacuation de chaleur en direction du corps de refroidissement (10) et éviter des problèmes de court-circuit électrique, chaque plaquette présente à son extrémité inférieure (24) une couche électriquement isolante déposée sur sa surface préalablement à la fixation au corps de refroidissement par un matériau de fixation (26) de préférence bon conducteur de chaleur, formé en particulier par une couche de brasure. Selon l'invention, la couche isolante présente une certaine épaisseur qui est suffisante pour permettre au matériau de fixation de couvrir en partie les faces latérales des couches isolantes et le matériau de fixation est prévu traversant entre les plaquettes, c'est-à-dire qu'il forme une couche continue sur le corps de refroidissement.

Method of inspecting bearing pillow for crosshead articulated joint of heavy-dusty diesel engine, method of dismantling a connecting-rod of such engine, set of assembling and disassembling toolss for such engines and heavy-duty diesel engine as such

Method for the material-removing laser machining of a workpiece

A method for the material-removing machining of a workpiece by laser beam pulses. The laser beam pulses are directed to impact points on the surface of a volume to be removed of the workpiece in order to cut away material from the volume to be removed. Cutting away the volume to be removed results in a new contour surface to be produced on the workpiece. An impact angle of the laser beam pulses relative to the contour surface to be produced is set in accordance with a predefined condition during the removal of at least part of the volume to be removed that directly adjoins the contour surface to be produced. According to this condition, the impact angle is the same as a threshold angle (as), or somewhat smaller. The threshold angle corresponds to the impact angle at which an effective laser energy density at the impact point of the laser beam pulses on the contour surface to be produced is equal to a threshold fluence. Material is only removed at an impact point if the effective laser energy density is greater than the threshold fluence. As a result, only those volume elements of the volume to be removed that are adjacent to the desired contour surface to be produced are cut away. By controlling, in an open- or closed-loop manner, the impact angle it is therefore possible to generate with very high precision the desired contour surface on the workpiece.