МНОГОЛУЧЕВАЯ ЛАЗЕРНАЯ СИСТЕМА И СПОСОБЫ СВАРКИ

Изобретение относится к лазерной системе с многолучевым выходным излучением (варианты) и способу сварки заготовок. Система представляет мультиволоконную лазерную систему, подающую выходное излучение по меньшей мере по трем волокнам, расположенным по окружности или же выходное излучение по меньшей мере четырех отдельных лазеров из одного рабочего кабеля. Изобретение позволяет управлять по меньшей мере тремя лазерными модулями и подавать, соответственно, их выходное излучение в заранее заданной последовательности внутри одного рабочего кабеля, обеспечивая таким образом множество стадий обработки заготовки, которая ранее требовала отдельной оптической системы для каждого луча. Выходное излучение по меньшей мере трех лазеров оптимизировано для применения в создании точечных сварных соединений, шовных сварных соединений или виртуальных осцилляционных сварных соединений при использовании для шовной сварки. 3 н. и 17 з.п. ф-лы, 10 ил.

ЛАЗЕРНЫЙ ИСТОЧНИК, В ЧАСТНОСТИ, ДЛЯ ТЕХНОЛОГИЧЕСКИХ ПРОЦЕССОВ

Лазерный источник содержит блок генерации лазерного луча, содержащий диодные лазерные источники для генерации первого лазерного луча, блок оптического усиления для накачки первым лазерным лучом и излучения второго лазерного луча, и оптический блок переключения и адресации лазерного луча, расположенный между блоком генерации и блоком оптического усиления и содержащий первую оптическую линию для транспортировки первого лазерного луча к первому выходу, вторую оптическую линию для транспортировки первого лазерного луча к усилительному модулю блока оптического усиления, и селекторное устройство, расположенное между входом и первой и второй оптическими линиями для направления первого лазерного луча к первой оптической линии, чтобы генерировать лазерный луч, имеющий более высокую мощность и более низкое качество на первом выходе, или к второй оптической линии, чтобы генерировать лазерный луч, имеющий меньшую мощность и более высокое качество на втором выходе. Блок оптического усиления содержит ...

АДАПТИВНОЕ ФОРМИРОВАНИЕ ЛАЗЕРНОГО ПУЧКА

Изобретение относится к области адаптивного формирования лазерных пучков. Способ и устройство для реализации адаптивного расщепления частично когерентного светового пучка посредством пространственного модулятора света (ПМС) заключается в том, что создают частично когерентный первичный световой пучок из коллимированного лазерного пучка от лазера, создают распределение поля в дальней зоне, модулируя по фазе ПМС, направляют для отражения на отображающем элементе ПМС, предотвращая формирование первичного когерентного светового пучка каким-либо движущимся элементом, выводят из первичного светового пучка, после ПМС, контрольный и главный пучок, направляют распределение поля в дальней зоне, на съемочную камеры и измеряют контрольный пучок камерой, при этом обеспечивают соответствие динамическому диапазону камеры посредством регулятора переменной интенсивности для управления интенсивностью контрольного пучка независимо от средней мощности указанного по меньшей мере одного главного пучка, конфигурируют ...

Способ резки хрупких неметаллических материалов

Изобретение относится к способам резки неметаллических хрупких материалов, преимущественно стекла, кварца и сапфира, и может использоваться при производстве смартфонов и любых других устройств с сенсорными панелями, при изготовлении приборов электротехники и микроэлектроники. Способ резки хрупких неметаллических материалов включает локальное воздействие на линии реза пучком излучения импульсно-периодического лазера, при этом варьируют энергию, воздействуя излучением ближнего и среднего ИК диапазона спектра с длительностью суммарного импульса 60-100 *10с, следующего с частотой от 14 до 20 кГц и энергией в импульсе от 0,35 мДж до 0,7 мДж, при средней суммарной мощности излучения на всех длинах волн 5-10 Вт. Воздействуют пучком импульсного лазера с одновременной генерацией на 8 длинах волн в ИК диапазоне спектра соответственно 1,03; 1,09; 2,6; 2,69; 2,92; 3,01; 3,06; 6,45 мкм. Для осуществления криволинейной резки сначала задают контур фигуры сфокусированным лазерным излучением с диаметром ...

СПОСОБ ЗАПИСИ ИНФОРМАЦИИ ВНУТРИ КРИСТАЛЛА АЛМАЗА

Изобретение относится к технологии создания внутри алмазов изображений, несущих информацию различного назначения, например, кода идентификации, метки, идентифицирующие алмазы. Способ записи информации внутри кристалла алмаза 1 включает проектирование информационного элемента в виде метки с помощью устройства 10, подготовку поверхности кристалла, позиционирование кристалла с использованием средств 2, 5, 6, 7, 8, 9 для создания информационного элемента, формирование информационного элемента путем воздействия излучением лазера 11 на кристалл, контроль создания информационного элемента и корректировку информационного элемента, при этом предварительно кристалл алмаза 1 размечают на бриллианты, проводят исследование кристалла на наличие макроскопических дефектов, создают его объемную цифровую модель с учетом внутренней дефектности кристалла, в том числе топологии поверхности, проектирование информационного элемента осуществляют так, чтобы он находился в требуемом месте будущего бриллианта, и ...

СПОСОБ ЛАЗЕРНОЙ СВАРКИ ЗА ОДИН ПРОХОД Т-ОБРАЗНОГО УЗЛА ИЗ МЕТАЛЛИЧЕСКИХ ЭЛЕМЕНТОВ

... 1. Способ лазерной сварки для узла из металлических элементов, расположенных в форме Т, при этом ножка Т-образного узла образована пластиной (10, 30) с параллельными поверхностями, причем узел является доступным только со стороны головки Т-образного узла через наружную поверхность, при этом способ содержит следующие стадии: сборки Т-образного узла из элементов, смежных друг с другом, лазерной сварки узла через наружную поверхность головки Т-образного узла с помощью двух сварочных швов, выполняемых одновременно и параллельно друг другу и перпендикулярно наружной поверхности головки Т-образного узла, так что каждая из двух осей (21) сварки является касательной к одной из поверхностей пластины (10, 30), образующей ножку Т-образного узла. 2. Способ лазерной сварки по п.1, отличающийся тем, что два сварочных шва выполняют одновременно с помощью двухфокусной сварочной головки (20). 3. Способ лазерной сварки по п.1, отличающийся тем, что пластину (10) ножки снабжают лапками (11) заданной длины ...

МНОГОЛУЧЕВАЯ ЛАЗЕРНАЯ СИСТЕМА И СПОСОБЫ СВАРКИ

Gerät zum Schneiden und/oder Schweißen flexibler Verpackung

VERFAHREN UND VORRICHTUNG ZUM PERFORIEREN VON ZIGARETTEN UND DERGLEICHEN MITTELS LASERSTRAHLEN.

Laserstrahlabzweigvorrichtung

VORRICHTUNG ZUM PERFORIEREN EINES HUELLMATERIALSTREIFENS FUER ARTIKEL DER TABAKVERARBEITENDEN INDUSTRIE

Verfahren, Vorrichtung und Beugungsgitter zum Trennen von Halbleiterelementen, die auf einem Substrat gebildet werden, durch Änderung besagten Beugungsgitters

Verfahren zum Trennen von Halbleiterelementen, die auf einem Substrat gebildet werden, wie Halbleiterelementen, die in einem Wafer aus Halbleitermaterial gebildet werden, unter Verwendung eines Lasers, der mindestens einen primären Laserstrahl produziert, wobei besagter mindestens ein primäre Laserstrahl in eine Vielzahl von sekundären Laserstrahlen unter Verwendung eines ersten Beugungsgitters aufgetrennt wird, das eine erste Gitterstruktur besitzt und durch Auftreffen lassen des besagten mindestens einen primären Laserstrahls auf besagte erste Beugungsstruktur, und wobei mindestens eine erste Rille durch Bewegen des besagten Lasers relativ zu besagtem Substrat in eine erste Richtung gebildet wird, besagtes Verfahren ferner umfassend einen Schritt zur Bildung mindestens einer zweiten Rille durch Bewegen des besagten Lasers relativ zu besagtem Substrat in eine zweite Richtung, charakterisiert dadurch, dass besagte zweite Gitterstruktur durch besagtes erstes Beugungsgitter umfasst ist, und ...

Apparat und Verfahren für eine X&Y-Senkrechtschnittrichtungsbearbeitung mit einer festgelegten Strahltrennung unter Verwendung einer 45° Strahlaufteilungsorientierung

Ein X & Y-Senkrechtschnittapparat zum Ritzen eines Paares von parallelen Schnitten auf ein planares Werkstück, wobei die Werkstückebene mit einer X-Achse und einer Y-Achse angeordnet ist, wobei der Apparat enthält: eine Laservorrichtung, wobei die Laservorrichtung mindestens zwei Strahlen einschließlich eines ersten Strahls und eines zweiten Strahls erzeugt, wobei der erste Strahl und der zweite Strahl an einem ersten und einem zweiten Auftreffpunkt auf das Werkstück auftreffen, wobei der erste und der zweite Auftreffpunkt diagonal bezüglich der X- und der Y-Achse des Werkstücks angeordnet sind; und mindestens ein Betätigungsglied, um den ersten und den zweiten Auftreffpunkt zu bewegen, um ein Paar von parallelen Schnitten zu ritzen.

Anlage zur Strukturierung von Solarmodulen

Bei einer Anlage (1) zur Strukturierung von Solarmodulen (2), umfassend ein Transportsystem (3) zum Transport eines Solarmoduls (2) in einer Transportebene in eine erste Achsrichtung (8) und einer ersten Querachse (10, 20) mit enem Strukturierungswerkzeug (11, 22), ist das Transportsystem (3) als Luftkissensystem ausgebildet.

Elektro- oder magneto-optische Anordnung zur Herstellung und Bearbeitung von integrierten Schaltungen und aehnlichen Objekten

BEUGUNGSOPTIK MIT ZUSAMMENGESETZTER APERTUR UND VERÄNDERLICHER BRENNWEITE UND LASERSCHNEIDEVORRICHTUNG MIT DIESER OPTIK

Anordnung zur Abtastung einer Objektfläche mit mehreren Laserstrahlen und Verfahren zum Betrieb der Anordnung

Die vorliegende Erfindung betrifft eine Anordnung zur Abtastung einer Objektfläche mit Laserstrahlung, die wenigstens einen Strahlteiler zur Aufteilung eines eingekoppelten Laserstrahls in mehrere Teilstrahlen, eine Scaneinrichtung zur Abtastung eines Bereiches der Objektfläche mit den Teilstrahlen sowie eine zwischen dem Strahlteiler und der Scaneinrichtung angeordneten Abbildungsoptik aufweist, die zur Abbildung des Strahlteilers in die Scaneinrichtung ausgebildet ist und einen Zwischenfokus erzeugt, in dem die Teilstrahlen räumlich getrennt voneinander sind. Im Bereich des Zwischenfokus ist ein Strahlversatzmodul angeordnet, das für jeden oder wenigstens einige der Teilstrahlen getrennt wenigstens ein drehbar gelagertes, optisch transparentes planparalleles Element mit wenigstens einem Aktor aufweist, durch den das Element gedreht werden kann. Das planparallele Element ist dabei so im Strahlengang des Teilstrahls angeordnet, dass der Teilstrahl beim Durchgang durch das Element einen ...

Laserbearbeitungsanlage mit wählbarer Wellenlänge des Bearbeitungsstrahls

Strahlführungssystem (3) für eine Laserbearbeitungsanlage (1) zum wählbaren Bearbeiten eines Werkstücks (8) mit einem primären Laserbearbeitungsstrahl (6) und/oder einem auf dem Laserbearbeitungsstrahl basierenden frequenzkonvertierten Bearbeitungsstrahl (44), miteinem Strahleingang (3') zum Aufnehmen eines zu einem Werkstück (8) zu führenden Laserstrahls (34),einem Polarisationszustand-einstellenden Element (38) zum Bereitstellen eines ersten Polarisationszustands (36A) oder eines zweiten Polarisationszustands (36B) oder einer Überlagerung des ersten Polarisationszustands (36A) und des zweiten Polarisationszustands (36B) des zu führenden Laserstrahls (34),einer Frequenzkonversionseinheit (30, 30A, 30B) mit einer Metamaterialstruktur (42), die den Laserstrahl (34) im ersten Polarisationszustand (36A) nicht frequenzkonvertiert und als den primären Laserbearbeitungsstrahl (6) weiterführt und die für den Laserstrahl (34) im zweiten Polarisationszustand (36B) eine auf der Metamaterialstruktur ...

Vorrichtung, Anordnung und Verfahren zur Interferenzstrukturierung von flächigen Proben

Vorrichtung zur Interferenzstrukturierung einer flächigen Probe (P) mit einem Laser (1), einem im Strahlengang des Lasers angeordneten ein- oder mehrteiligen Fokussierelement (3, 3a, 3b), mit dem die Laserstrahlung (2) in einer ersten Raumrichtung (y) fokussierbar ist, einem Probenvolumen (5), in dem die flächige Probe (P) in einem Interferenzbereich (6) platzierbar ist, einem im Strahlengang des Lasers (1) angeordneten ersten Prisma (4), einem im Strahlengang des Lasers (1) vor dem ersten Prisma (4) angeordneten weiteren, zweiten Prisma (13), mit dem die Laserstrahlung (2) auf zwei erste Strahlenbündel (2a', 2b') so aufteilbar ist, dass diese ersten Strahlenbündel (2a', 2b') zumindest teilweise getrennt voneinander sind, bevor sie auf das erste Prisma (4) auftreffen, wobei die ersten Strahlenbündel (2a', 2b') mit dem ersten Prisma (4) in einer zweiten Raumrichtung (x) als zweite Strahlenbündel (2a, 2b) so auf das Probenvolumen (5) richtbar sind, dass die beiden zweiten Strahlenbündel ( ...

Verfahren und Vorrichtung zum Schweißverbinden zweier Bauteile

The invention concerns a device for connecting two components (2, 4) by welding with a laser beam (22), the components overlapping in a partial region of their mutually facing surfaces. According to the invention, the device comprises an optical beam divider (18) which has an inlet for the laser beam (22) and a device (20) for alternately distributing the laser beam (22) to a plurality of outlets (16). Each of the outlets (16) is optically coupled via a beam-guiding device (14) to a laser welding head (12) which contains a focusing and deflection lens system for guiding the focused laser beam (22) over the surface of the component (4) facing the laser welding head (12).

Laserstrahlmaschine

Laserbestrahlungsgerät

MULTIPLE-POINT WELDING APPLIANCE, ESPECIALLY FOR VEHICLE BODIES

Laserstrahlschweissvorrichtung

Mikrobildaufzeichnungsvorrichtung

Vorrichtung zum Umschalten eines Laserstrahls, Laserbearbeitungsvorrichtung

Die Erfindung schafft eine Umschaltvorrichtung zum selektiven Schalten eines linear polarisierten Eingangslaserstrahls (110a) in einen ersten Ausgangslaserstrahl (130a) oder in einen zweiten Ausgangslaserstrahl (160a). Die Umschaltvorrichtung umfasst ein primäres optisches Umschaltelement mit einem primären optischen Element (EOM) zum gezielten Drehen der Polarisationsrichtung des Eingangslaserstrahls (110a) und einem nachgeschalteten primären polarisationsabhängigen Reflektor (R), welcher den Eingangslaserstrahl abhängig von seiner Polarisationsrichtung in einen ersten Strahlengang (120a) oder in einen zweiten Strahlengang (150a) lenkt. In jedem der beiden Strahlengänge (120a bzw. 150a) ist jeweils ein weiteres optisches Umschaltelement mit einem sekundären optischen Element (EOM1 bzw. EOM2) zum gezielten Drehen der Polarisationsrichtung des jeweiligen Laserstrahls (120b bzw. 150b) und mit einem sekundären polarisationsabhängigen Reflektor (R1 bzw. R2) vorgesehen, welcher den jeweiligen ...

Oberflächenmodifikationsverfahren und- vorrichtung

Verfahren zur räumlich periodischen Modifikation einer Oberfläche eines Substrates in einer Probenebene (P), wobei die Substratoberfläche mit einem der einzubringenden Struktur entsprechenden Beleuchtungsmuster einer Energiedichte oberhalb einer Prozessschwelle der Substratoberfläche bestrahlt wird, dadurch gekennzeichnet, dass das Beleuchtungsmuster mittels Beugung eines konvergierenden Eingangsstrahls (10) und Überlagerung resultierender, gebeugter Teilstrahlen (122) in einem Gitter-Interferometer erzeugt wird, wobei vor dem Gitter-Interferometer angeordnete Strahlformungsmittel (40; 40') den Eingangsstrahl (10) derart konvergieren lassen, dass wenigstens eine Komponente seiner gebeugten Teilstrahlen in der Nachbarschaft der Probenebene (P) eine Strahltaille aufweist.

VERFAHREN UND VORRICHTUNG ZUR BEHANDLUNG VON WERKSTUECKEN MITTELS LASERSTRAHLUNG

Vorrichtung zur Substratbehandlung mittels Laserstrahlung

Vorrichtung zur Substratbehandlung mittels Laserstrahlung, mit einem Drehspiegel (16), durch den ein einfallender Laserstrahl reflektiert wird und über eine Anordnung (24) von nebeneinander liegenden Fokussierlinsen (24i-24n) schwenkbar ist, die in einem ihrer Brennweite entsprechenden Abstand vom bewegten, vorzugsweise durch eine bewegte Materialbahn gebildeten Substrat (10) angeordnet sind, wobei der einfallende Laserstrahl durch eine Eintrittslinsenanordnung aus einer oder mehreren hintereinander angeordneten Linsen (14, 14') auf den Drehspiegel (16) fokussiert wird und zwischen dem Drehspiegel (16) und der Anordnung (24) von in einem ihrer Brennweite entsprechenden Abstand vom Substrat (10) angeordneten nebeneinander liegenden Fokussierlinsen (24i-24n,) eine Anordnung (18) von nebeneinander liegenden Kollimatorlinsen (18i-18n) vorgesehen ist, die in einem ihrer Brennweite entsprechenden Abstand vom Drehspiegel (16) angeordnet sind, dadurch gekennzeichnet, dass zumindest zwei jeweils ...

CIGARETTE MANUFACTURE

Cigarette manufacture

Various arrangements are disclosed for perforation by laser of cigarettes carried on a fluted drum without rolling. In one arrangement (Figures 1-3) rings of reflectors (8, 14) movable with the drum (12) intercept and direct a continuous laser beam (18). In another arrangement (Figure 4, 5) cigarettes (28) are perforated while being conveyed past a fixed focus pulsed beam (32) which has a selected profile and is redirected between passing cigarettes to perforate cigarettes at other positions. Other arrangements include using a rotating disc (Figures 6-8) or rotary stepped reflector (Figures 9, 13, 14) to share a beam between different or produce two rows of perforations on a cigarette, using a continuous reflective surface (Figures 10, 11) to reflect a rotating beam at passing cigarettes, and causing a beam to partially track a moving cigarette (Figure 12). ...

Method and apparatus for laser beam welding of overlapping sheets

While steel sheets, overlapping each other, (W1, W2) are positioned and held by a holding mechanism (12), a first laser beam (L1) is applied to a heating region (P1) of the steel sheet (W1) to space the steel sheet (W1) from the other steel sheet (W2) by a predetermined distance. A second laser beam (L2) is applied to a welding region (P2) to weld the steel sheets (W1, W2) and is moved the welding direction in synchronism with the first base beam (L1). An amount of heat applied by the first laser beam (L1), a moving speed of the first laser beam (L1), and a focused spot diameter of the first laser beam (L1) are set to keep the sheet (W1) irradiated with the first laser beam (L1) in an unmelted state and plastically deform the sheet (W1).

Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus, and substrate cutting method using the substrate cutting apparatus

Multiple-wavelength laser micromachining of semiconductor devices

A specially shaped laser pulse energy profile (98, 104, 156) characterized by different laser wavelengths at different times of the profile provides reduced, controlled jitter to enable semiconductor device micromachining that achieves high quality processing and a smaller possible spot size.

Light beam switching system for optical fibres

A system for directing successive beam pulses of a pulsed laser into different optical fibers, for transmission therethrough, is disclosed. The system comprises at least one lens, a plurality of optical fibers with the tips thereof positioned proximate a focal point of the lens, and at least one galvanometer driven mirror for directing a laser beam through the lens for focusing separately onto each fiber tip. The galvanometer, driven by computer generated position addresses, moves the mirror, between laser pulses, to predetermined positions each effective to direct the laser beam, through the lens, into one of the fiber tips for transmission via the fiber to a remote workstation location. In a first illustrated embodiment, a single mirror is mounted to direct the laser beam into fiber tips positioned substantially in the same plane and proximate the focal points of eight lenses. In a second illustrated embodiment, two mirrors are respectively mounted to scan the laser beam along "x" and ...

Substrate cutting apparatus equipped with a scribing apparatus

LASER PATTERN GENERATION APPARATUS

Semiconductor structure processing using multiple laser beam spots

Methods and systems process electrically conductive links on or within a semiconductor substrate (740) using multiple laser beams. For example, a method utilizes N series of laser pulses to obtain a throughput benefit, wherein N / 2. The links are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. The N series of laser pulses propagate along N respective beam axes until incident upon selected links. The pattern of resulting laser spots may be on links in N distinct rows, on distinct links in the same row, or on the same link, either partially or completely overlapping. The resulting laser spots may be offset from one another in the lengthwise direction of the rows or offset from one another in a direction perpendicular to the lengthwise direction of the rows, or both.

Laser apparatus and method having plural excitation sources with associated beam splitting arrangements for adaptive control

A laser 100, and method of operating a laser, including: at least two independently controllable excitation sources 110, 120, preferably laser diodes, that produce input beams for pumping the gain medium 102, preferably a crystalline gain medium such as a Thulium-doped Yttrium Lithium Fluoride slab; beam splitters 132, 134, preferably a polarising beam splitter, for splitting the input beams into sub-beams; and, beam guiding arrangements 136, 138, 140, 142, preferably mirrors, for guiding the sub-beams from the excitation source, such that the sub-beams from each input beam are directed inwardly towards opposite ends of the gain medium. Each excitation source may be aligned with, and directed towards, an end of the gain medium. Preferably, one of the sub-beams is not re-directed and is already aligned with an end of the gain medium. The sub-beams from an excitation source may be parallel with each other when directed inwardly to the gain medium, with the sub-beams from one excitation source ...

PIERCING DEVICE FOR PIERCING VENTILATING HOLES IN CIGARETTES OR SIMILAR SMOKING COMMODITIES

OPTICAL FIBER HOLDER

Cigarette manufacture

LASER CUTTINGS OF THIN-LAYERED METALLIC WORKPIECES WITH A LENS WITH TWO FOCAL LENGTHS

LASER PROCESSING MACHINE

EINRICHTUNG ZUR BEARBEITUNG VON WERKSTUCKEN MITTELS LASERSTRAHLEN

BAUTEILFÜGEANLAGE UND VERFAHREN ZUM FÜGEN VON BAUTEILEN

LASER WORKING ON DEVICE

DEVICE FOR THE INSCRIPTION OF THES SUBJECT OF MEANS LASER BEAMS

VERFAHREN UND VORRICHTUNG ZUM ERZEUGEN VON PERFORATIONEN IN STABFOERMIGEN GEGENSTAENDEN

REPAIR OF THE STATIONARY POETRY OF A ROTOR

LASER WORKING ON DEVICE AND LASER MANUFACTURING PROCESS WITH DOUBLE OR MEHRFACHSPOT MEANS OF A GALVANOSCANNERS

PROCEDURE FOR CUTTING USING A FOCUSED RADIATION POINT WITH MORE VARIABLE ASTIGMATIK

METHOD FOR IMPROVING THE COATABILITY OF A METAL STRIP

Den Gegenstand dieser Erfindung bildet ein Verfahren zur Behandlung eines Metallbandes (1). Dabei wird das Metallband (1) in einem Ofen (2) wärmebehandelt und nachfolgend in einer Beschichtungsanlage (3) beschichtet. Erfindungsgemäß werden nach der Wärmebehandlung und vor der Beschichtung Oberflächenoxide am Metallband (1) mit Hilfe eines Lasers (5) entfernt.

PROCEDURE AND DEVICE FOR PRODUCING PERFORATIONS IN ROD-SHAPED ARTICLES

DEVICE AND PROCEDURE FOR MODIFYING A WORKPIECE SURFACE BY PHOTON RADIATION

PROCEDURE FOR THE PRODUCTION OF AN INJECTOR PLATE OF AN INK JET PRINTER

DEVICE FOR THE TREATMENT OF A NUMBER OF LASER BEAMS

DEVICE FOR PERFORATING WITH A LASER

PROCEDURE AND APPARATUS FOR THE PRODUCTION OF A CYLINDRICAL SHEET METAL PACKING BY LASER BEAM WELDING.

PROCEDURE FOR CONTACTLESS CLEARING AWAY OF MATERIAL OF THE SURFACE OF A GLASS ARTICLE AND A DEVICE FOR THE EXECUTION OF THE PROCEDURE.

ENGRAVING PROCEDURE AND - DEVICE FOR A HYDRAULIC TRANSMISSION ROLE WITH LASER BEAMS

METHOD AND APPARATUS FOR lASER BEAMSwARM UP OF PLASTICS DEGRADATION

PROCEDURE AND DEVICE FOR CUTTING VORIMPRÄGNAT

PROCEDURE FOR WORKING ON A MATERIALES MEANS LASER BEAM TREATMENT

MATERIAL IRRADIATOR AND PROCEDURE FOR THE ENTERPRISE OF MATERIAL IRRADIATORS

Procedure and arrangement for the stop welding with laser radiation

sCANNEDwORKPIECEmARK OF A

LASER CUTTINGS OF THIN-LAYERED METALLIC WORKPIECES WITH A LENS WITH TWO FOCAL LENGTHS

LASER CUTTINGS OF THIN-LAYERED METALLIC WORKPIECES WITH A LENS WITH TWO FOCAL LENGTHS

LASER CUTTINGS OF THIN-LAYERED METALLIC WORKPIECES WITH A LENS WITH TWO FOCAL LENGTHS

LASER CUTTINGS OF THIN-LAYERED METALLIC WORKPIECES WITH A LENS WITH TWO FOCAL LENGTHS

LASER CUTTINGS OF THIN-LAYERED METALLIC WORKPIECES WITH A LENS WITH TWO FOCAL LENGTHS

LASER CUTTINGS OF THIN-LAYERED METALLIC WORKPIECES WITH A LENS WITH TWO FOCAL LENGTHS

LASER CUTTINGS OF THIN-LAYERED METALLIC WORKPIECES WITH A LENS WITH TWO FOCAL LENGTHS

LASER CUTTINGS OF THIN-LAYERED METALLIC WORKPIECES WITH A LENS WITH TWO FOCAL LENGTHS

Uv laser system and method for single pulse severing of ic fuses

LASER BEAM INJECTING SYSTEM

Descaling metal with a laser having a very short pulse width and high average power

"A DEVICE FOR GENERATING A PLURALITY OF LASER BEAMS"

The invention relates to a device for generating a plurality of laser beams. The device comprises: - a laser source (10) emitting an initial beam (F) at P wavelengths; - a wavelength splitter (12) assembly for splitting the initial beam into N intermediate beams where N ~ P, each intermediate beam (FI) containing a group of wavelengths comprising at least one wavelength; and - N' energy splitter assemblies (14, 16, ...) where N' ~ N for splitting an intermediate beam (FI) into n i divisional beams (FD), each of the n i divisional beams having substantially the same energy, whereby K divisional beams (FD) are obtained with K = N - N' + n i ...

METHOD AND DEVICE FOR OVERLAPPING WELDING OF TWO COATED METAL SHEETS WITH A BEAM OF HIGH ENERGY DENSITY

L'invention concerne un procédé de soudage par recouvrement ô l'aide d'un faisceau ô haute densité d'énergie (11) de deux tôles (1, 2) revêtues, caractérisé en ce que l'on sépare le faisceau (11) en un premier sous faisceau (12) traversant les deux tôles (1, 2) revêtues et formant dans cette zone un premier bain de métal fondu (18) et en un second sous faisceau (13) non traversant et formant un second bain de métal fondu (19) dont la profondeur est inférieure ô l'épaisseur de la tôle revêtue supérieure (1) et chevauchant au moins une partie du premier bain de métal fondu (18) pour favoriser l'évacuation de la vapeur du matériau de revêtement et on dirige sur le second bain de métal fondu (19) un jet de gaz neutre ô haute vitesse d'éjection pour former ô la surface du second bain de métal fondu une cuvette (22).

DISPOSITIF DE FOCALISATION MULTIPLE

PROCESSING A MEMORY LINK WITH A SET OF AT LEAST TWO LASER PULSES

A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 500 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single "pulse" by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

LASER SOLDERING APPARATUS

LASER SOLDERING APPARATUS A laser soldering apparatus and method for soldering chip components to circuit modules. Optical means are provided to simultaneously focus coherent laser beams toward solder at opposing ends of a chip component. The energy thus provided reflows the solder and two joints are simultaneously formed when the solder cools.

LASER BEAM WELDING APPARATUS

Welding apparatus featuring a right angle beam handling tube for directing a fixed laser beam from an entrance to the tube to a rotatably supported output reflector in a focus head mounted on an outlet of the tube. The tube has upstream and downstream duct sections which are independently extendible and retractable relative to their juncture, the juncture and a laser beam translating mirror mounted therein being movable only in a linear direction coincident with the incoming beam axis along the upstream duct section to ensure beam alignment with the entrance and outlet of the right angle beam handling tube while permitting the distances therebetween to vary to selectively position the focus head relative to a workpiece.

FOCUSING OPTICS FOR LASER CUTTING

L'invention porte sur un élément optique (21) utilisable pour la découpe laser d'un matériau (26), comportant au moins un dioptre asphérique (22) conformé pour focaliser les rayons (30) du faisceau incident sur un segment de droite (25) situé sur l'axe optique (29) de l'élément (21) optique. L'élément optique (21) est de type transmissif (21) ou réfléchissant. Par exemple, l'élément optique est formé d'une lentille (21) dont le dioptre (22) asphérique est défini par un rayon de courbure (24) continûment variable en fonction de la distance à l'axe optique (29) de la lentille. Le faisceau laser est assisté par un gaz d'assistance contenant au moins un composé choisi parmi l'azote, l'oxygène, l'hélium, l'argon et leurs mélanges.

PROFILING ARRANGEMENT WITH A PROFILING MACHINE AND WITH A WELDING DEVICE

A profiling arrangement (1) with a ~ machine (2) including several roller-type forming tools (6) and with a welding device (3) positioned in its processing path makes possible the application of more than one weld joint to a workpiece (51, 52, 53, or 54) to be manufactured. The welding device includes a single energy source and this source is connected with at least two welding device (9) and (10) for producing both weld joints. The energy produced by welding device (3) is divided aver the individual welding heads (9 and 10). This is especially favorable in the case of a welding device (3) with a laser-beam source. The laser beam can be split into several partial laser beams and guided to the individual laser-beam welding heads.

METHOD AND APPRATUS FOR LASER BEAM WELDING OF OVERLAPPING SHEETS

While steel sheets, overlapping each other, (W1, W2) are positioned and held by a holding mechanism (12), a first laser beam (L1) is applied to a heating region (P1) of the steel sheet (W1) to space the steel sheet (W1) from the other steel sheet (W2) by a predetermined distance. A second laser beam (L2) is applied to a welding region (P2) to weld the steel sheets (W1, W2) and is moved the welding direction in synchronism with the first base beam (L1). An amount of heat applied by the first laser beam (L1), a moving speed of the first laser beam (L1), and a focused spot diameter of the first laser beam (L1) are set to keep the sheet (W1) irradiated with the first laser beam (L1) in an unmelted state and plastically deform the sheet (W1).

OPTICAL PERFORATING APPARATUS AND SYSTEM

LASER WELDING APPARATUS AND MANUFACTURING METHOD OF COMPONENT

A radiator in a laser welding apparatus radiates a beam to a main region and an auxiliary region on a welding surface. The auxiliary region is positioned to be adjacent to the main region or to be apart from the main region. A welding direction is a direction in which a beam radiation region moves during laser welding. The auxiliary region includes at least an area positioned on a forward side of the main region in the welding direction. The radiator radiates the beam in a setting such that at least one peak occurs in each of the main region and the auxiliary region.

LASER WELDING APPARATUS AND MANUFACTURING METHOD OF COMPONENT

A radiator in a laser welding apparatus radiates a beam to a main region and an auxiliary region on a welding surface. The auxiliary region is positioned to be adjacent to the main region or to be apart from the main region. A welding direction is a direction in which a beam radiation region moves during laser welding. The auxiliary region includes at least an area positioned on a forward side of the main region in the welding direction. The radiator radiates the beam in a setting such that at least one peak occurs in each of the main region and the auxiliary region.

METHOD AND APPARATUS FOR FORMING REFRACTORY TUBING

UV LASER SYSTEM AND METHOD FOR SINGLE PULSE SEVERING OF IC FUSES

A Q-switched, diode-pumped, solid-state (DPSS) laser (54) employs harmonic generation through nonlinear crystals (72) to generate UV light (74) for both link processing and target alignment. The type and geometry of the nonlinear crystals (72) are selected, and their temperatures are precisely controlled, to produce focused spot sizes with excellent beam quality for severing of IC fuses. A fraction of the laser output (56) can be utilized in a secondary target alignment system (50). An imaging optics module (52) may be employed to further enhance the shape quality of either or both of the secondary and primary beams. Each beam passes through a detection module (100) that measures the incident and reflected light. The two beams pass through a common combiner to facilitate calibration and alignment of the beams and subsequent link processing.

LASER ANNEALING METHOD AND LASER ANNEALING APPARATUS

Energy distribution in a short axis direction of a rectangular beam to be applied on an amorphous semiconductor film (amorphous silicon and the like) is made uniform. The energy distribution in the short axis direction of the rectangular beam can be made uniform by a cylindrical lens array (26) or a waveguide (36), and light focusing optical systems (28, 44) or by an optical system including a diffractive optical element. The range of effective energy applied on the amorphous semiconductor film is widened, and that makes it possible to increase the speed of transferring a substrate (3). Thus, performance of laser annealing process is improved.

LASER WELDING HEAD WITH DUAL MOVABLE MIRRORS PROVIDING BEAM MOVEMENT AND LASER WELDING SYSTEMS AND METHODS USING SAME

A laser welding head with movable mirrors may be used to perform welding operations, for example, with wobble patterns and/or seam finding/tracking and following. The movable mirrors provide a wobbling movement of one or more beams within a relatively small field of view, for example, defined by a scan angle of 1-2°. The movable mirrors may be galvanometer mirrors that are controllable by a control system including a galvo controller. The laser welding head may also include a diffractive optical element to shape the beam or beams being moved. The control system may also be used to control the fiber laser, for example, in response to the position of the beams relative to the workpiece and/or a sensed condition in the welding head such as a thermal condition proximate one of the mirrors.

PROCESS AND APPARATUS FOR ETCHING AN IMAGE WITHIN A SOLID ARTICLE

An apparatus and process for etching an image within a solid article (15) including the steps of focusing a laser (12) to a focal point (14) within the article (15) and positioning the article (15) with respect to the focal point (14). The laser (11) is fired so that local disruption occurs within the article (15) to form the image within the article.

METHOD OF AND APPARATUS FOR WELDING WORKPIECE WITH LASER BEAMS

A laser beam welding apparatus has a first laser oscillator for applying a laser beam to a right-hand automobile door, a second laser oscillator for applying a laser beam to a left-hand automobile door, and first through fourth laser beam path changing mechanisms for changing the laser beam path of the laser beam from the first laser oscillator in the event of a failure of the second laser oscillator, and changing the laser beam path of the laser beam from the second laser oscillator in the event of a failure of the first laser oscillator. Even when one of the laser beam oscillators fails to operate due to a malfunction, an overall welding line combined with the laser beam welding apparatus does not need to be shut down, and the laser beam welding apparatus can smoothly and efficiently weld the workpieces.

Vorrichtung zur Herstellung von integrierten Schaltungen

Hybrid laser arc welding process and apparatus

A welding method and apparatus for welding workpieces together by conducting a laser beam welding process on a joint region that includes a weld seam defined by and between faying surfaces of the workpieces, and then conducting a hybrid laser arc welding process on the joint region. The laser beam welding process entails causing a first laser beam to travel along the joint region, penetrate the weld seam and form a weldment. The hybrid laser arc welding process remelts the weldment by simultaneously causing an electric arc and a second laser beam to overlap and travel along the joint region and form a weld pool in the weldment. On cooling, a weld joint is formed within the joint region and its weld seam.

High Throughput Solar Cell Ablation System

A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source.

Герметичный корпус

Полезная модель представляет собой герметичный корпус и может быть использована при изготовлении герметичного ввода лазерного излучения в рабочий объем технологических установок, осуществляющих обработку материалов в вакууме или в среде инертных газов. Стенка герметичного корпуса через прокладку с двухсторонней отбортовкой, выполненную из титана, с обеих сторон которой расположена алюминиевая фольга, соединена по всему периметру с входным окном. Окно выполнено из прозрачного в заданном оптическом диапазоне материала и имеет конусоцилиндросферическую форму, коническая поверхность входного окна обращена навстречу лазерному пучку, а сферическая поверхность - внутрь герметичного корпуса. Техническим результатом является расширение функциональных возможностей корпуса за счет фокусировки лазерного излучения в кольцо. 1 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 169 601 U1 (51) МПК B23K 26/067 (2006.01) H01J 17/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ФОРМУЛА ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ РОССИЙСКОЙ ФЕДЕРАЦИИ (21)(22) Заявка: 2016120886, 27.05.2016 (24) Дата начала отсчета срока действия патента: 27.05.2016 24.03.2017 Приоритет(ы): (22) Дата подачи заявки: 27.05.2016 Адрес для переписки: 101000, Москва, Моспочтамт, а/я 918, ФГУП "ВНИИА", начальнику отдела 36, С.В. Жмайло (56) Список документов, цитированных в отчете о поиске: RU156784U1, 20.11.2015. RU119935U1, 27.08.2012. RU156783U1, 20.11.2015. RU155777U1, 20.10.2015. 1 6 9 6 0 1 (45) Опубликовано: 24.03.2017 Бюл. № 9 (73) Патентообладатель(и): Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова" (ФГУП "ВНИИА") (RU) R U Дата регистрации: (72) Автор(ы): Вышинский Павел Николаевич (RU), Коваленко Александр Фёдорович (RU), Федорищев Олег Николаевич (RU), Осипов Геннадий Станиславович (RU) 1 6 9 6 0 1 R U (57) Формула полезной модели Герметичный корпус с входным окном для ввода лазерного излучения в установку для обработки ...

Optical device and laser beam machining apparatus having optical device

An optical device includes: a beam splitter by which a laser beam oscillated from an oscillator is branched into a first branch beam going ahead through transmission and a second branch beam going ahead through reflection; a first mirror by which the first branch beam going out of the beam splitter is reflected to go again toward the beam splitter; a second mirror by which the second branch beam going out of the beam splitter is reflected to go again toward the beam splitter; and a circular disk-like rotating unit for integrally rotating the first mirror and a second mirror, with a laser beam branch point in the beam splitter as a center of rotation.

Laser processing method and laser processing device

A laser processing method for forming a modification region serving as a starting point of cutting inside a member to be cut along a planned cutting line by relatively moving an optical axis of a condenser lens along the planned cutting line of the member and by irradiating the member with focused laser light, wherein a plurality of cross-sectional focused spots is simultaneously formed on a section which is perpendicular to the optical axis of the condenser lens at positions having a predetermined depth from a surface of the member and which is parallel to the surface and, at that time, at least one cross-sectional focused spot of the plurality of cross-sectional focused spots is formed on a projection line of the planned cutting line onto the cross section to form one or more inside modification regions having a desired shape.

Laser machining device and laser machining method

A laser machining device 1 comprises a laser light source 10 , a spatial light modulator 20 , a controller 22 , a converging optical system 30 , and a shielding member 40 . The phase-modulating spatial light modulator 20 inputs a laser beam outputted from the laser light source 10 , displays a hologram modulating a phase of the laser beam at each of a plurality of pixels arranged two-dimensionally, and outputs the phase-modulated laser beam. The controller 22 causes the spatial light modulator 20 to display a plurality of holograms sequentially, lets the converging optical system 30 converge the laser beam outputted from the spatial light modulator 20 at converging positions having a fixed number of M, selectively places N converging positions out of the M converging positions into a machining region 91 , and machines an object to be machined 90.

Method and apparatus for irradiating a semiconductor material surface by laser energy

An apparatus for irradiating semiconductor material is disclosed having, a laser generating a primary laser beam, an optical system and a means for shaping the primary laser beam, comprising a plurality of apertures for shaping the primary laser beam into a plurality of secondary laser beams. Wherein the shape and/or size of the individual apertures corresponds to that of a common region of a semiconductor material layer to be irradiated. The optical system is adapted for superposing the secondary laser beams to irradiate said common region. Further, the use of such an apparatus in semiconductor device manufacturing is disclosed.

LASER CRYSTALLIZATION AND POLYCRYSTAL EFFICIENCY IMPROVEMENT FOR THIN FILM SOLAR

Apparatus and methods of thermally processing semiconductor substrates are disclosed. Aspects of the apparatus include a source of intense radiation and a rotating energy distributor that distributes the intense radiation to a rectifier. The rectifier directs the radiation toward the substrate. Aspects of the method include using a rotating energy distributor to distribute pulsed energy to a substrate for processing. The rotational rate of the energy distributor is set based on the pulse repetition rate of the energy source. A substrate may be continuously translated with respect to the energy distributor at a rate set based on the pulse repetition rate of the energy source. 1. An apparatus for thermal processing of semiconductor substrates , comprising:a source of a rectangular laser light field;a rotating polygonal mirror disposed in an optical path of the rectangular laser light field and generating a plurality of reflected laser pulses having a rectangular shape and angularly distributed across a reflection field; anda rectifier disposed across the reflection field and above a work surface, and having one or more light-directing elements that direct the rectangular laser pulses from the reflection field toward the work surface.2. The apparatus of claim 1 , wherein the rectifier is a linear member disposed along an axis perpendicular to the optical path of the laser light field incident on the rotating polygonal mirror.3. The apparatus of claim 2 , wherein the rectifier comprises a plurality of optical elements.4. The apparatus of claim 2 , wherein the work surface comprises a conveyor movable in a direction substantially parallel to the optical path of the laser light incident on the rotating polygonal mirror.5. The apparatus of claim 3 , wherein the rectifier comprises a plurality of mirrors.6. The apparatus of claim 5 , wherein the rectifier further comprises a plurality of lenses.7. The apparatus of claim 6 , wherein each of the plurality of lenses has an ...

Method of and apparatus for personalising a series of portable objects

Embodiments of the invention provide a method of and apparatus for graphically marking a series of portable objects, such as a card, each portable object being graphically marked on a respective zone by a respective marking device, wherein the marking devices are configured to perform the same marking operation simultaneously on a plurality of portable objects.

Optical irradiation device for a system for producing three-dimensional work pieces by irradiating powder layers of a powdered raw material using laser radiation

An optical irradiation device is provided which includes a multimode optical fiber suitable for the central wavelength of a beam of light having a first beam profile which enters through an input connection for multimode guidance; a switching device, which can be switched between a first and second light conducting state and is configured to conduct the beam of light entering through the input connection in the first light conducting state to an output connection, such that the beam of light has the first beam profile on emerging from the output connection, and guides the beam of light entering the input connection to the output connection by the multimode optical fiber in the second light conducting state, so that the beam of light has a second beam profile different from the first beam profile on emerging from the output connection by the multimode guidance in the multimode optical fiber.

Fibre optic laser machining equipment for etching grooves forming incipient cracks

A laser machining equipment for etching grooves in a wall of a mechanical part, or in a connecting rod for a spark ignition engine, includes a fiber optic laser device arranged to supply laser pulses. The fiber optic laser device is controlled so that laser pulses have a peak power of more than 400 W and at least two times greater than maximum mean power of the laser device, and duration of the laser pulses is below or within the nanosecond range of 1 ns to 1000 ns. The fiber optic laser device can be controlled in a quasi continuous wave (QCW) mode, or can be controlled in a Q-switch mode. The selected operating modes increase machining efficiency and produce a groove with an optimum transverse profile, particularly with a small mean radius of curvature at a bottom of the groove which then allows precise subsequent fracturing of the mechanical part with less force.

LASER PROCESSING MACHINE

A processing machine includes mirrors and to reflect a beam L oscillated from a laser oscillator to a predetermined surface on which a workpiece is arranged, optical axis operating mechanisms and to position an optical axis of the beam L at a desired target irradiation position by changing directions of the mirrors and, a camera sensor to capture an image of the target irradiation position and its periphery reflected in the mirror, and an error calibration mechanism to detect an error between the target irradiation position instructed to the optical axis operating mechanisms and an actual position of the optical axis of the beam L in the predetermined surface by referring to the image captured by the camera sensor. A correction amount to the optical axis operating mechanisms and is determined based on the error to irradiate the target irradiation position with the beam L during processing. 1. A laser processing machine to apply processing by irradiating a workpiece with a laser beam , comprising:a mirror to reflect the laser beam oscillated from a laser oscillator to a predetermined surface on which the workpiece is arranged;an optical axis operating mechanism to position an optical axis of the laser beam at a desired target irradiation position in the predetermined surface by changing a direction of the mirror;a camera sensor to capture an image of the target irradiation position and its periphery in the predetermined surface reflected in the mirror; andan error calibration mechanism to detect an error between the target irradiation position instructed to the optical axis operating mechanism and an actual position of the optical axis of the laser beam in the predetermined surface, by referring to the image captured by the camera sensor,wherein a correction amount to be instructed to the optical axis operating mechanism can be determined based on the error in order to irradiate the target irradiation position with the laser beam during processing.2. A laser ...

SINGLE-SCAN LINE-SCAN CRYSTALLIZATION USING SUPERIMPOSED SCANNING ELEMENTS

The disclosure relates to methods and systems for single-scan line-scan crystallization using superimposed scanning elements. In one aspect, the method includes generating a plurality of laser beam pulses from a pulsed laser source, wherein each laser beam pulse has a fluence selected to melt the thin film and, upon cooling, induce crystallization in the thin film; directing a first laser beam pulse onto a thin film using a first beam path; advancing the thin film at a constant first scan velocity in a first direction; and deflecting a second laser beam pulse from the first beam path to a second beam path using an optical scanning element such that the deflection results in the film experiencing a second scan velocity of the laser beam pulses relative to the thin film, wherein the second scan velocity is less than the first scan velocity. 1. A method for processing a thin film , the method comprising:generating a plurality of laser beam pulses from a pulsed laser source, wherein each laser beam pulse has a fluence selected to melt the thin film and, upon cooling, induce crystallization in the thin film;directing a first laser beam pulse onto a thin film using a first beam path;advancing the thin film at a constant first scan velocity in a first direction; anddeflecting a second laser beam pulse from the first beam path to a second beam path using an optical scanning element such that the deflection results in the film experiencing a second scan velocity of the laser beam pulses relative to the thin film,wherein the second scan velocity is less than the first scan velocity.2. The method of claim 1 , wherein each laser beam pulse has a fluence selected to completely melt the thin film.3. The method of claim 1 , wherein the crystallization comprises a sequential lateral solidification (SLS) process.4. The method of claim 1 , wherein each laser beam pulse has a fluence selected to partially melt the thin film.5. The method of claim 1 , wherein the crystallization ...

Systems and methods for processing thin films

Methods and systems for processing a thin film are disclosed. Thin films are loaded onto two different loading fixtures, laser beam pulses are split into first and second laser beam pulses, the thin film loaded on one loading fixture is irradiated with the first laser beam pulses to induce crystallization while the thin film loaded on the other loading fixture is irradiated with the second laser beam pulses. At least a portion of the thin film loaded on the first and second loading fixtures is irradiated. The laser source system includes first and second laser sources and an integrator that combines the laser beam pulses to form combined laser beam pulses. The methods and system further utilize additional loading fixtures for processing additional thin film samples. The irradiation of additional thin film samples can be performed while thin film samples are being loaded onto the remaining loading fixtures.

Method for partitioning and incoherently summing a coherent beam

A method and apparatus for decorrelating coherent light from a light source, such as a pulsed laser, in both time and space in an effort to provide intense and uniform illumination are provided. For some embodiments employing a pulsed light source, the output pulse may be stretched relative to the input pulse width. The methods and apparatus described herein may be incorporated into any application where intense, uniform illumination is desired, such as pulsed laser annealing, welding, ablating, and wafer stepper illuminating.

LASER MACHINING DEVICE

There is proposed a laser machining device () for a laser workpiece machining operation, having a laser () for producing laser radiation (), and having at least two laser tools (), to which the laser radiation () can be supplied by means of an optical-fibre cable (). According to the invention, the optical-fibre cable () has an input-side end () having at least two optical fibre cores (′) and a plurality of output-side ends (′) each having one of the optical fibre cores (′), the optical fibre cores (′) each being connected to one of the laser tools (′). A switching device () is preferably provided for selectively coupling the laser radiation () in one or more of the optical fibre cores (′) of the optical-fibre cable (). 11818. Laser machining device for a laser workpiece machining operation , having a laser for producing laser radiation , and having at least two laser tools ( , ′) , to which the laser radiation can be supplied by means of an optical-fibre cable ,{'b': 22', '22', '26', '26', '22', '22, 'characterised in that the optical-fibre cable has an input-side end having at least two optical fibre cores (, ′) and a plurality of output-side ends (, ′) each having one of the optical fibre cores (, ′),'}{'b': 22', '22', '18', '18, 'the optical fibre cores (, ′) each being connected to one of the laser tools (, ′), and'}{'b': 22', '22, 'that a switching device is provided for selectively coupling the laser radiation in one or more of the optical fibre cores (, ′) of the optical-fibre cable.'}2. (canceled)3. Laser machining device according to claim 1 , characterised in that there are provided connection means claim 1 , by way of which the input-side end of the optical-fibre cable is positioned in a defined position and in a defined rotation position with respect to the switching device.4. Laser machining device according to claim 3 , characterised in that the connection means has a connection socket which is arranged on the switching device and a connection plug ...

LASER PROCESSING APPARATUS

A laser processing apparatus includes a laser generator for generating laser beams, a diffraction optic element for dividing the laser beam generated by the laser generator into a plurality of sub-laser beams, and a beam number controller for controlling the number of the plurality of sub-laser beams. Accordingly, the diffractive optic element that splits a laser beam generated by the laser beam generator into a plurality of sub-laser beams and the beam number controller that controls the number of sub-laser beams are provided so that the processing speed of a processing target can be improved and, at the same time, the number of laser beams can be promptly controlled, thereby promptly forming various patterns of the processing target. 1. A laser processing apparatus , comprising:a laser generator for generating laser beams;a diffraction optic element for dividing the laser beam generated by the laser generator into a plurality of sub-laser beams; anda beam number controller for controlling a number of the plurality of sub-laser beams.2. The laser processing apparatus of claim 1 , the beam number controller comprising a beam blocking device for partially blocking the plurality of sub-laser beams and a location controller for controlling a location of the beam blocking device.3. The laser processing apparatus of claim 2 , the location controller comprising a horizontal location controller for controlling a horizontal location of the beam blocking device and a vertical location controller for controlling a vertical location of the beam blocking device.4. The laser processing apparatus of claim 3 , the beam blocking device comprising a horizontal blocking unit and a vertical blocking unit disposed perpendicular to the horizontal blocking unit.5. The laser processing apparatus of claim 4 , the vertical blocking unit being connected to an end of the horizontal blocking unit.6. The laser processing apparatus of claim 5 , the beam blocking device being formed in a shape of ...

Systems and methods for processing thin films

The present disclosure is directed to methods and systems for processing a thin film samples. In an exemplary method, semiconductor thin films are loaded onto two different loading fixtures, laser beam pulses generated by a laser source system are split into first laser beam pulses and second laser beam pulses, the thin film loaded on one loading fixture is irradiated with the first laser beam pulses to induce crystallization while the thin film loaded on the other loading fixture is irradiated with the second laser beam pulses. In a preferred embodiment, at least a portion of the thin film that is loaded on the first loading fixture is irradiated while at least a portion of the thin film that is loaded on the second loading fixture is also being irradiated. In an exemplary embodiment, the laser source system includes first and second laser sources and an integrator that combines the laser beam pulses generated by the first and second laser sources to form combined laser beam pulses. In certain exemplary embodiments, the methods and system further utilize additional loading fixtures for processing additional thin film samples. In such methods and systems, the irradiation of thin film samples loaded on some of the loading fixtures can be performed while thin film samples are being loaded onto the remaining loading fixtures. In certain exemplary methods and systems, the crystallization processing of the semiconductor thin film samples can consist of a sequential lateral solidification (SLS) process.

LASER METHOD WITH DIFFERENT LASER BEAM AREAS WITHIN A BEAM AND DEVICES

Use of a laser beam () which has one external and one internal laser beam area () with different intensities enables a higher temperature gradient to be produced in the z-direction. 113-. (canceled)14. A method for applying a laser beam to a substrate for heating the substrate where the laser beam impinges on the substrate , the method comprising:applying a laser beam to impinge on the substrate, impinging the laser beam to have two different laser beam areas which impinge on the substrate, wherein the two different laser beam areas differ in at least one of output of the laser beam areas and wavelengths of the laser beam areas; andwherein the laser beam has a radially internal laser beam area, and a surrounding radially external laser beam area, and the external laser beam area completely surrounding the internal laser beam area.15. The method as claimed in claim 14 , in which the external laser beam area has an intensity such that the external laser beam areas does not melt the substrate or a material supplied to the substrate to be impinged upon on the substrate.16. The method as claimed in claim 14 , wherein the substrate to be impinged upon is metallic.17. The method as claimed in claim 14 , further comprising remelting a crack in the substrate at the laser beam areas.18. The method as claimed in claim 14 , further comprising:applying a welding material to the substrate on which the laser beam is impinging and performing deposition welding on the material by impinging the laser beam such that the deposition welding takes place.19. The method as claimed in claim 14 , further comprising:impinging the laser beam on the substrate such that the internal laser beam area is arranged concentrically within the area surrounded by the external laser beam area.20. The method as claimed in claim 14 , wherein an intensity or an output of the internal laser beam area is at least 20% greater than an intensity or an output of the external laser beam area for either causing more ...

LASER TEXTURING OF STEEL STRIP

A method and an arrangement for finishing a steel strip including the texturing of the steel strip wherein a texture is applied to the surface of a moving steel strip by means of a single laser beam or a plurality of laser beams directed at the surface of a moving steel strip, and wherein the single laser beam or the plurality of laser beams are position controlled to apply a predetermined texture pattern on the surface of the moving steel strip. 1. A method for finishing a steel strip comprising the texturing of the steel strip wherein a texture is applied to the surface of a moving steel strip , wherein ,a single laser beam or a plurality of laser beams is directed at the surface of a moving steel strip, andthe single laser beam or the plurality of laser beams are position controlled to apply a predetermined texture pattern on the surface of the moving steel strip.2. The method according to claim 1 , wherein the laser beams are divided in groups each with a single laser beam or a plurality of laser beams claim 1 , which groups are controlled separately.3. The method according to claim 2 , wherein the groups of laser beams are positioned over the width and/or direction of movement of the steel strip with respect to each other.4. The method according to claim 2 , wherein the groups of laser beams are controlled such that adjacent parts of the texture are applied with different groups of laser beams wherein the groups have different positions with respect to each other.5. The method according to claim 2 , wherein two or more groups of laser beams are controlled to form an interference pattern with a power density distribution suitable for texturing of the moving steel strip.6. The method according to claim 2 , wherein the control comprises the control of one or more of the laser beams and the position thereof within one or more of the different groups of laser beams.7. The method according to claim 1 , wherein the control comprises the focussing of laser beams into ...

CO2 LASER WITH RAPID POWER CONTROL

Subject matter of the invention is a COlaser that permits a rapid power modulation, particularly a highly efficient Q-switching. The key concept is the sub-division of the resonator into a high-power branch, containing inter alia the active medium (), and a low-power feedback branch (), in which the power-sensitive beam-shaping elements, particularly the modulators, are arranged. This is made possible by a suitable arrangement of a polarisation beam splitter () and a λ/4-phase shifter (). The free adjustability of an angle φ between said two components permits the extremely flexible realisation of various operating modes, particularly the optimisation of the feedback degree during pulse generation. 1. A COlaser comprising:a resonator closed at both ends by resonator end mirrors and containing an active medium, and comprising electrodes for a pump energy supply,wherein the resonator is sub-divided along a resonator axis extending perpendicularly to the resonator end mirrors, between the resonator end mirrors into a high-power branch and a feedback path,wherein the high-power branch and the feedback branch are separated from one another by a polarisation beam splitter for coupling out part of a laser beam generated in the resonator,wherein in the high-power branch between a first of the resonator end mirrors and the polarisation beam splitter the active medium and a λ/4-phase shifter is disposed,wherein in the feedback branch between a second of the resonator end mirrors and the polarisation beam splitter elements for beam-shaping are disposed,wherein the λ/4-phase shifter and the polarisation beam splitter are arranged to be turned with respect to one another by an angle φ, and that about an axis of rotation having at least one component of rotation in parallel to the resonator axis or about the resonator axis,wherein the resonator axis extends either in a straight line or in a bent line through the polarisation beam splitter, andwherein the second resonator end ...

PROCESSING OPTICAL UNIT, LASER PROCESSING APPARATUS AND METHOD FOR LASER PROCESSING

A processing optical unit for workpiece processing includes a birefringent polarizer configured to split at least one input laser beam into a pair of partial beams polarized perpendicularly to one another. The processing optical unit further includes a focusing optical unit arranged downstream of the birefringent polarizer in the beam path and configured to focus the pair of partial beams onto focus zones in a focal plane. The processing optical unit is configured to produce at least partly overlapping focus zones of the pair of partial beams. 1. A processing optical unit for workpiece processing , comprising:a birefringent polarizer configured to split at least one input laser beam into a pair of partial beams polarized perpendicularly to one another, anda focusing optical unit arranged downstream of the birefringent polarizer in the beam path and configured to focus the pair of partial beams onto focus zones in a focal plane,wherein the processing optical unit is configured to produce at least partly overlapping focus zones of the pair of partial beams.2. The processing optical unit as claimed in claim 1 , wherein the birefringent polarizer element is configured to produce a position offset claim 1 , an angle offset claim 1 , or a combination of position offset and angle offset between the pair of partial beams.3. The processing optical unit as claimed in claim 2 , wherein the birefringent polarizer element is configured to produce an angle offset and is arranged in a plane that is optically conjugate with respect to the focal plane.4. The processing optical unit as claimed in claim 2 , wherein the polarizer element is configured to produce a position offset and is arranged upstream of a further optical unit in the beam path claim 2 , wherein the processing optical unit is configured to image the position offset between the pair of partial beams into the focal plane.5. The processing optical unit as claimed in claim 1 , wherein the processing optical unit is ...

Si SUBSTRATE MANUFACTURING METHOD

An Si substrate manufacturing method includes a separation band forming step of forming a separation band through positioning a focal point of a laser beam with a wavelength having transmissibility with respect to Si to a depth, equivalent to a thickness of an Si substrate to be manufactured, from a flat surface of an Si ingot and irradiating the Si ingot with the laser beam while relatively moving the focal point and the Si ingot in a direction < parallel to a cross line at which a crystal plane { and a crystal plane { intersect or a direction [ orthogonal to the cross line, and an indexing feed step of executing indexing feed of the focal point and the Si ingot relatively in a direction orthogonal to a direction in which the separation band is formed. 1100. A silicon substrate manufacturing method for manufacturing a silicon substrate from a silicon ingot in which a crystal plane () is made to be a flat surface , the silicon substrate manufacturing method comprising:{'b': 110', '100', '111', '110, 'a separation band forming step of forming a separation band through positioning a focal point of a laser beam with a wavelength having transmissibility with respect to silicon to a depth equivalent to a thickness of the silicon substrate to be manufactured from the flat surface and irradiating the silicon ingot with the laser beam while relatively moving the focal point and the silicon ingot in a direction <> parallel to a cross line at which a crystal plane {} and a crystal plane {} intersect or a direction [] orthogonal to the cross line;'}an indexing feed step of executing indexing feed of the focal point and the silicon ingot relatively in a direction orthogonal to a direction in which the separation band is formed; and{'b': '100', 'a wafer manufacturing step of repeatedly executing the separation band forming step and the indexing feed step to form a separation layer parallel to the crystal plane () as a whole inside the silicon ingot and separating the silicon ...

LASER PROCESSING APPARATUS

A laser processing apparatus includes: a chuck table that holds a workpiece; a laser beam applying unit that applies a pulsed laser beam having a predetermined line width to the workpiece held by the chuck table; and a processing feeding unit that performs relative processing feeding of the chuck table and the laser beam applying unit. The laser beam applying unit includes: a laser oscillator that oscillates the pulsed laser beam; a focusing device that focuses the pulsed laser beam oscillated by the laser oscillator; and a pulse width adjustment unit that is disposed between the laser oscillator and the focusing device and that generates a time difference in a wavelength region of the pulsed laser beam in the predetermined line width, thereby adjusting the pulse width. 1. A laser processing apparatus comprising:a chuck table that holds a workpiece;a laser beam applying unit that applies a pulsed laser beam of a wavelength having a predetermined line width to the workpiece held by the chuck table; anda processing feeding unit that performs relative processing feeding of the chuck table and the laser beam applying unit, a laser oscillator that oscillates the pulsed laser beam,', 'a focusing device that focuses the pulsed laser beam oscillated by the laser oscillator, and', 'a pulse width adjustment unit that is disposed between the laser oscillator and the focusing device and that generates a time difference in a wavelength region of the pulsed laser beam in the line width, thereby adjusting pulse width., 'wherein the laser beam applying unit includes'}2. The laser processing apparatus according to claim 1 ,wherein the laser beam applying unit further includes a polarization beam splitter that splits the pulsed laser beam oscillated by the laser oscillator,the focusing device focuses the pulsed laser beam reflected by the polarization beam splitter, andthe pulse width adjustment unit is disposed on the opposite side of the polarization beam splitter from the laser ...

SEMICONDUCTOR PROCESSING APPARATUS USING LASER

Provided is a semiconductor processing apparatus, including a first laser beam irradiation unit having a first variable beam expanding telescope and a first galvanometer scanner transferring a first laser beam having a first wavelength, a second laser beam irradiation unit having a second variable beam expanding telescope and a second galvanometer scanner transferring a second laser beam having a second wavelength, and a telecentric lens. 1. A semiconductor processing apparatus , comprising:a first laser beam irradiation unit including a first variable beam expanding telescope and a first galvanometer scanner transferring a first laser beam having a first wavelength;a second laser beam irradiation unit including a second variable beam expanding telescope and a second galvanometer scanner transferring a second laser beam having a second wavelength; anda telecentric lens.2. The semiconductor processing apparatus according to claim 1 , wherein the telecentric lens includes:a first telecentric lens configured to receive the first laser beam from the first laser beam irradiation unit; anda second telecentric lens configured to receive the second laser beam from the second laser beam irradiation unit.3. The semiconductor processing apparatus according to claim 2 , wherein the first telecentric lens and the second telecentric lens each include a diameter aperture claim 2 , a concave lens claim 2 , an aspherical lens claim 2 , and a convex lens.4. The semiconductor processing apparatus according to claim 1 , wherein the first laser beam has a wavelength of an infrared ray area band.5. The semiconductor processing apparatus according to claim 1 , wherein the second laser beam has a wavelength of a visible ray area band.6. The semiconductor processing apparatus according to claim 1 , wherein the first galvanometer scanner includes:a first X-direction galvanometer scanner configured to scan with the first laser beam in an X-direction; anda first Y-direction galvanometer ...

SENSOR SYSTEM FOR DIRECTLY CALIBRATING HIGH POWER DENSITY LASERS USED IN DIRECT METAL LASER MELTING

A three dimensional printing system includes a laser system, a beam splitter, a pinhole, a sensor, and a controller. The laser system emits a light beam of varying diameter carrying at least 100 watts of optical power along an optical path. The laser has an imaging plane along the optical path which can be coincident or close to a focal plane at which the beam has a minimum diameter. The beam splitter is positioned along the optical path to receive the beam and to transmit most of the optical power and to reflect remaining optical power. The pinhole is positioned along the optical path at the imaging plane to receive the reflected beam having a minimal diameter. The controller is configured to analyze a signal from the sensor to determine intensity and distribution parameters for the light beam. 1. A three dimensional printing system comprising:a laser system that emits a beam of varying diameter carrying at least 100 watts of optical power along an optical path, the laser having an imaging plane which is located at or near a focal plane at which the beam has a minimum beam diameter;a beam splitter positioned along the optical path to receive the beam and to transmit most of the optical powder and to reflect remaining optical power;a pinhole positioned along the optical path at the imaging plane to receive the reflected beam;a sensor positioned along the optical path to receive the beam from the pinhole; anda controller configured to analyze a signal from the sensor to determine intensity and other parameters for the beam.2. The three dimensional printing system of wherein the laser system includes a two dimensional scanning system whereby the beam scans along the pinhole along two axes.3. The three dimensional printing system of wherein the controller controls the laser system including the scanning system.4. The three dimensional printing system of wherein the beam converges between the laser system and the beam splitter claim 1 , the beam diameter at the beam ...

LASER ANNEALING APPARATUS AND LASER ANNEALING METHOD USING THE SAME

A laser annealing apparatus includes a beam splitter that splits a laser beam emitted from a laser source into a reflection light beam and a transmission light beam, a beam vibrator that makes an irradiation point of the reflection light beam or the transmission light beam vibrate in a predetermined direction, a beam inverter that inverts the reflection light beam or the transmission light beam, and a light collector that collects the reflection light and the transmission light.

LASER PROCESSING METHOD AND LASER PROCESSING DEVICE AND SEALED TYPE BATTERY

Provided is a laser processing method including overlapping a plurality of plate-shaped members that include a first plate-shaped member disposed on one end side of an overlapping direction and a second plate-shaped member disposed on the other end side of the overlapping direction; branching a laser beam into a first branched laser beam and a second branched laser beam; irradiating the first plate-shaped member with the first branched laser beam and the second branched laser beam in a state where the first branched laser beam and the second branched laser beam are emitted in parallel; forming line-shaped melting portions on the first plate-shaped member by moving the branched laser beams in a direction intersecting a direction in which the branched laser beams are aligned; and joining overlapped plate-shaped members in a state where the melting portion formed by using the first branched laser beam and the melting portion formed by using the second branched laser beam are connected to each other in the second plate-shaped member and the melting portions do not penetrate the second plate-shaped member. 1. A laser processing method comprising:overlapping a plurality of plate-shaped members that include a first plate-shaped member disposed on one end side of an overlapping direction and a second plate-shaped member disposed on the other end side of the overlapping direction;branching a laser beam into a first branched laser beam and a second branched laser beam;irradiating the first plate-shaped member with the first branched laser beam and the second branched laser beam in a state where the first branched laser beam and the second branched laser beam are emitted in parallel;forming line-shaped melting portions along a surface of the first plate-shaped member by relatively moving the first branched laser beam and the second branched laser beam with respect to the first plate-shaped member in a direction intersecting a direction in which the first branched laser beam ...

ADDITIVE MANUFACTURING MACHINE CONDENSATE MONITORING

An additive manufacturing machine includes a laser light source, a beam entry window, a recoater, a plurality of light sources attached to the recoater, a photosensor, and a controller. The laser light source emits laser light to selectively melt one or more portions of a working layer of a powder bed during additive manufacturing of a part. The beam entry window is positioned between the powder bed and the laser light source. The recoater moves across the powder bed to spread the working layer. The photo sensor senses intensity of light emitted by each of the plurality of light sources through the beam entry window. The controller correlates sensed intensity of the light emitted by each of the plurality of light sources through the beam entry window to corresponding positions on the beam entry window based on locations of each of the plurality of light sources. 1. An additive manufacturing machine comprising:a laser light source that emits laser light to selectively melt one or more portions of a working layer of a powder bed during additive manufacturing of a part;a beam entry window positioned between the powder bed and the laser light source;a recoater that moves across the powder bed to spread the working layer;a plurality of light sources attached to the recoater;a photosensor, positioned between the laser light source and the beam entry window, that senses intensity of light emitted by each of the plurality of light sources through the beam entry window; and correlates sensed intensity of the light emitted by each of the plurality of light sources through the beam entry window to corresponding positions on the beam entry window based on locations of each of the plurality of light sources relative to the beam entry window during illumination of each of the plurality of light sources; and', 'outputs one or more parameters relating to transmittance of the beam entry window based on the sensed intensity of the light emitted by each of the plurality of light ...

A GRAIN-ORIENTED SILICON STEEL HAVING HEAT-RESISTANT MAGNETIC DOMAIN AND MANUFACTURING METHOD THEREOF

A heat-resistant magnetic domain refined grain-oriented silicon steel, a single-sided surface or a double-sided surface of which has several parallel grooves which are formed in a grooving manner, each groove extends in the width direction of the heat-resistant magnetic domain refined grain-oriented silicon steel, and the several parallel grooves are uniformly distributed along the rolling direction of the heat-resistant magnetic domain refined grain-oriented silicon steel. Each groove which extends in the width direction of the heat-resistant magnetic domain refined grain-oriented silicon steel is formed by splicing several sub-grooves which extend in the width direction of the heat-resistant magnetic domain refined grain-oriented silicon steel. The manufacturing method for a heat-resistant magnetic domain refined grain-oriented silicon steel comprises the step of: forming grooves on a single-sided surface or a double-sided surface of a heat-resistant magnetic domain refined grain-oriented silicon steel in a laser grooving manner, a laser beam of the laser grooving is divided into several sub-beams by a beam splitter, and the several sub-beams form the several sub-grooves which are spliced into the same groove. 1. A grain-oriented silicon steel having heat-resistant refined magnetic domain , characterized by multiple parallel grooves formed by grooving on surface of one side or of both sides of the grain-oriented silicon steel , wherein each groove extends in the width direction of the grain-oriented silicon steel , and said multiple parallel grooves are uniformly distributed along the rolling direction of the grain-oriented silicon steel having heat-resistant refined magnetic domain.2. The grain-oriented silicon steel having heat-resistant refined magnetic domain according to claim 1 , wherein said each groove that extends in the width direction of the grain-oriented silicon steel is formed by splicing multiple sub-grooves that extend in the width direction of the ...

LASER NANOSTRUCTURED SURFACE PREPARATION FOR JOINING MATERIALS

A joined article includes a first component having a laser-treated surface portion and a second component having a laser-treated surface portion. An adhesive joins the first component to the second component at the treated surface portion. A method of making a joined article form components and a system for making joined articles are also disclosed. 1. A joined article , comprising:a first component having an interference laser-treated surface portion;a second component having an interference laser-treated surface portion;an adhesive joining the first component to the second component at the treated surface portion.2. The joined article of claim 1 , wherein the interference laser-treated surface portions comprise features comprising at least one selected from the group consisting of depressions claim 1 , channels and holes.3. The joined article of claim 2 , wherein the features have a periodicity.4. The joined article of claim 3 , wherein the periodicity is between 0.5-50 μm.5. The joined article of claim 3 , wherein the periodicity varies by no more than ±5%.6. The joined article of claim 1 , wherein the interference laser is a multiple-beam interference laser claim 1 , wherein an original laser beam is split into at least 2 beams which are then refocused over the same spot on the component surface.7. The joined article of claim 1 , wherein the joined article treated according to the invention has a tensile strength that is at least 10% greater than a baseline tensile strength of an untreated article.8. The joined article of claim 1 , wherein the joined article treated according to the invention has a ductility that is at least 100% greater than a baseline joint of an untreated article.9. The joined article of claim 1 , wherein the interference laser-treated surface portion of the first component and the interference laser-treated portion of the second component are dissimilar materials.10. The joined article of claim 1 , wherein one of the interference laser- ...

Semiconductor laser oscillator

A semiconductor laser oscillator includes laser diode modules. A temperature sensor directly or indirectly detects a temperature of at least one of the laser diode modules. A collimating lens collimates respective lasers emitted from the laser diode modules. A grating performs spectrum beam coupling for the lasers emitted from the collimating lens. An incident angle varying mechanism changes incident angles of the respective lasers, at which the lasers emitted from the collimating lens are incident onto the grating in response to the temperature detected by the temperature sensor.

MANUFACTURING METHOD FOR WELDED STRUCTURE

A manufacturing method includes i) emitting a primary laser beam along a primary trajectory on a boundary between a first member and a second member by a welding apparatus; ii) emitting an advanced laser beam along an advanced trajectory that does not overlap the primary trajectory by the welding apparatus; and iii) emitting a subsequent laser beam along a subsequent trajectory that does not overlap the primary trajectory and the advanced trajectory by the welding apparatus. 1. A manufacturing method for a welded structure , the welded structure being manufactured by joining a boundary between a first member and a second member that abut against each other by laser welding using a welding apparatus , and the welding apparatus that emits a primary laser beam scanning the boundary between the first member and the second member , an advanced laser beam that an irradiation position of the advanced laser beam is in front of an irradiation position of the primary laser beam in a direction of movement , and a subsequent laser beam that an irradiation position of the subsequent laser beam is at rear of the irradiation position of the primary laser beam in the direction of movement , the manufacturing method comprising:emitting the primary laser beam along a primary trajectory on the boundary between the first member and the second member by the welding apparatus;emitting the advanced laser beam along an advanced trajectory that does not overlap the primary trajectory by the welding apparatus; andemitting the subsequent laser beam along a subsequent trajectory that does not overlap the primary trajectory and the advanced trajectory by the welding apparatus.2. The manufacturing method according to claim 1 , wherein the advanced laser beam and the subsequent laser beam are emitted by the welding apparatus such that the irradiation position of the advanced laser beam and the irradiation position of the subsequent laser beam become symmetrical about an inclination axis claim 1 , ...

LASER-PROCESSING APPARATUS, METHODS OF OPERATING THE SAME, AND METHODS OF PROCESSING WORKPIECES USING THE SAME

Numerous embodiments are disclosed. In one, a laser-processing apparatus includes a positioner arranged within a beam path along which a beam of laser energy is propagatable. A controller may be used to control an operation of the positioner to deflect the beam path within first and second primary angular ranges, and to deflect the beam path to a plurality of angles within each of the first and second primary angular ranges. In another, an integrated beam dump system includes a frame; and a pickoff mirror and beam dump coupled to the frame. In still another, a wavefront correction optic includes a mirror having a reflective surface having a shape characterized by a particular ratio of fringe Zernike terms Z4 and Z9. Many more embodiments are disclosed. 1. A laser-processing apparatus , comprising:a laser source operative to generate a beam of laser energy, wherein the beam of laser energy is propagatable along a beam path;a first positioner arranged within the beam path, wherein the first positioner is operative to deflect the beam path; anda controller coupled to the first positioner,wherein the controller is configured to control an operation of the first positioner to deflect the beam path within a first primary angular range and within a second primary angular range, wherein the second primary angular range does not overlap the first angular range and is not contiguous with the first primary angular range, andwherein the controller is further configured to control an operation of the first positioner to deflect the beam path to a first plurality of angles within the first primary angular range and to a second plurality of angles within second primary angular range.2. The apparatus of claim 1 , wherein the laser source is operative to generate a beam of laser energy having a wavelength in the ultraviolet (UV) range of the electromagnetic spectrum.3. The apparatus of claim 1 , wherein the laser source is operative to generate a beam of laser energy having a ...

Laser drilling of metal foils for assembly in an electrolytic capacitor

A capacitor and methods of processing an anode metal foil are presented. The capacitor includes a housing, one or more anodes disposed within the housing, one or more cathodes disposed within the housing, one or more separators disposed between an adjacent anode and cathode, and an electrolyte disposed around the one or more anodes, one or more cathodes, and one or more separators within the housing. The one or more anodes each include a metal foil that includes a first plurality of tunnels through a thickness of the metal foil in a first ordered arrangement, the first ordered arrangement being a close packed hexagonal array arrangement, and having a first diameter, and a second plurality of tunnels through the thickness of the metal foil having a second ordered arrangement and a second diameter greater than the first diameter.

Method and Arrangement for Generating a Laser Beam Having a Differing Beam Profile Characteristic by Means of a Multi-Clad Fiber

The invention concerns a method for generating a laser beam () with different beam profile characteristics, whereby a laser beam () is coupled into one fiber end () of a multi-clad fiber (), in particular a double-clad fiber, and emitted from the other fiber end () of the multi-clad fiber () and whereby, to generate different beam profile characteristics of the output laser beam (), the input laser beam () is electively coupled either at least into the inner fiber core () of the multi-clad fiber () or at least into at least one outer ring core () of the multi-clad fiber (), as well as a corresponding arrangement (). 1. A method comprising:coupling an input laser beam into a fiber end of an optical fiber that has at least an inner fiber core and an outer ring core, wherein coupling an input laser beam comprises electively coupling a first laser beam into the inner fiber core alone or coupling a different, second laser beam into both the inner fiber core and the outer ring core; andgenerating an output laser beam by interaction of the input laser beam with the optical fiber, wherein a beam profile characteristic of the output laser beam differs depending upon the elective coupling.2. The method of claim 1 , wherein the optical fiber is a multi-clad fiber comprising at least the inner fiber core claim 1 , a first cladding surrounding the inner fiber core claim 1 , the outer ring core claim 1 , and a second cladding surrounding the outer ring core.3. A method comprising:coupling an input laser beam into a fiber end of an optical fiber that has at least an inner fiber core and an outer ring core, wherein coupling an input laser beam comprises electively coupling either a first laser beam into the inner fiber core alone or coupling a different, second laser beam into the outer ring core alone; andgenerating an output laser beam by interaction of the input laser beam with the optical fiber, wherein a beam profile characteristic of the output laser beam differs depending ...

Laser processing apparatus

A laser processing apparatus includes a beam splitting unit disposed between a pulsed laser beam oscillating unit and a condenser. The beam splitting unit includes a half-wave plate that rotates the plane of polarization of a pulsed laser beam, a birefringent lens that splits the pulsed laser beam that has passed through the half-wave plate into ordinary light and extraordinary light, the birefringent lens being formed by joining two kinds of crystalline bodies to each other across a curved plane of a concave surface and a convex surface, and a splitting angle adjusting unit that moves the birefringent lens in a direction orthogonal to the pulsed laser beam that has passed through the half-wave plate to change the angle of incidence with respect to the curved plane and adjust a beam splitting angle.

WELDING METHOD AND WELDING APPARATUS

A welding method includes: arranging a workpiece containing copper in a region to be irradiated with laser light; and irradiating the workpiece with the laser light to melt and weld an irradiated portion of the workpiece. Further, the laser light is formed of a main beam and a plurality of sub beams, and a ratio of power of the main beam to total power of the plurality of sub beams is 72:1 to 3:7. 1. A welding method comprising:arranging a workpiece containing copper in a region to be irradiated with laser light; andirradiating the workpiece with the laser light to melt and weld an irradiated portion of the workpiece, whereinthe laser light is formed of a main beam and a plurality of sub beams, anda ratio of power of the main beam to total power of the plurality of sub beams is 72:1 to 3:7.2. The welding method according to claim 1 , wherein the plurality of sub beams are located so as to surround an outer periphery of the main beam.3. The welding method according to claim 2 , wherein the plurality of sub beams are located so as to form an approximate ring shape centered at the main beam.4. The welding method according to claim 3 , wherein a distance between a center of a sub beam that is most adjacent to the main beam and a center of the main beam is 75 μm to 400 μm.5. The welding method according to claim 1 , further comprising:moving the laser light and the workpiece relative to each other while the workpiece is irradiated with the laser light, thereby causing the laser light to sweep over the workpiece, whereinat least some of the plurality of sub beams are located anterior to the main beam in a sweep direction.6. The welding method according to claim 1 , whereinthe workpiece includes at least two members to be welded, andthe workpiece is arranged in a region to be irradiated with the laser light such that the at least two members overlap with each other, come into contact with each other, or are adjacent to each other.7. The welding method according to claim 1 ...

PROCESSING DEVICE

A processing device forms, in an object to be processed, a modified spot constituting a modified region. The processing device includes a first irradiation unit configured to irradiate the object with first light to temporarily increase absorptivity in a partial region of the object as compared with the absorptivity before irradiation of the first light, and a second irradiation unit configured to irradiate the partial region with second light in an absorptivity increase period in which the absorptivity of the partial region is temporarily increased. 1. A processing device for forming , in an object to be processed , a modified spot constituting a modified region , the processing device comprising:a first irradiation unit configured to irradiate the object with first light to temporarily increase absorptivity in a partial region of the object as compared with the absorptivity before irradiation of the first light; anda second irradiation unit configured to irradiate the partial region with second light in an absorptivity increase period in which the absorptivity of the partial region is temporarily increased.2. The processing device according to claim 1 , wherein energy of the second light is greater than energy of the first light.3. The processing device according to claim 1 , wherein peak intensity of the second light is lower than peak intensity of the first light.4. The processing device according to claim 1 , wherein a wavelength of the second light is different from a wavelength of the first light.5. The processing device according to claim 1 , wherein the second light is light with which no modified spot is formed when being singly applied to the object.6. The processing device according to claim 1 , wherein an irradiation direction of the second light with respect to the object is different from an irradiation direction of the first light with respect to the object.7. The processing device according to claim 1 , wherein an angle at which the second light ...

LASER ANNEALING APPARATUS

Provided is a laser annealing apparatus that may include: a laser light source section configured to output pulsed laser light to be applied to a thin film formed on a workpiece; a pulse width varying section configured to vary a pulse width of the pulsed laser light; a melt state measuring section configured to detect that the thin film irradiated with the pulsed laser light is in a melt state; and a controlling section configured to determine, based on a result of detection by the melt state measuring section, a duration of time during which the thin film is in the melt state, and to control the pulse width varying section to allow the duration of time to be of a predetermined length. 1. A laser annealing apparatus , comprising:a laser light source section configured to output pulsed laser light to be applied to a thin film formed on a workpiece;a pulse width varying section configured to vary a pulse width of the pulsed laser light;a melt state measuring section configured to detect that the thin film irradiated with the pulsed laser light is in a melt state; anda controlling section configured to determine, based on a result of detection by the melt state measuring section, a duration of time during which the thin film is in the melt state, and to control the pulse width varying section to allow the duration of time to be of a predetermined length.2. The laser annealing apparatus according to claim 1 , wherein the melt state measuring section measures one of reflectance of the thin film formed on the workpiece and transmittance of the workpiece to detect that the thin film is in the melt state.3. The laser annealing apparatus according to claim 1 , wherein the pulse width varying section is an optical pulse stretcher.4. The laser annealing apparatus according to claim 1 , further comprising a liquid supplying section configured to supply a liquid to a surface of the workpiece.5. The laser annealing apparatus according to claim 1 , wherein the melt state ...

Laser beam cutting/shaping a glass substrate

An apparatus includes a beam splitter and a plurality of mirrors. The beam splitter is positioned to receive a laser beam from a source and split the received laser beam to a first plurality of split laser beams and a second plurality of split laser beams. The plurality of mirrors is configured to direct the first plurality of split laser beams and further configured to direct the second plurality of split laser beams. The first plurality of split laser beams is directed by the plurality of mirrors is configured to cut a glass substrate. The second plurality of split laser beams is directed by the plurality of mirrors is configured to shape the glass substrate.

Shaping a glass substrate after cutting

A method includes projecting a first energy beam onto an annular edge of a glass substrate. A first portion of the annular edge of the glass substrate is removed with the first energy beam. Removing the first portion increases the roundness of the annular edge of the glass substrate. A second energy beam is projected onto the annular edge of the glass substrate. A second portion of the annular edge of the glass substrate is removed with the second energy beam. Removing the second portion increases the roundness of the annular edge of the glass substrate.

Laser Machining Systems and Methods with Vision Correction and/or Tracking

Vision correction and tracking systems may be used in laser machining systems and methods to improve the accuracy of the machining. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The vision correction and/or tracking systems may be used to provide scribe line alignment and uniformity based on detected parameters of the scribe lines and/or changes in the workpiece. 1. A laser machining system comprising:a part handling system including a workpiece support surface for supporting a workpiece to be machined;at least one laser source for generating at least one processing laser beam;an optical head including a beam delivery system for receiving the at least one processing laser beam and for directing the processing laser beam at the workpiece; anda workpiece tracking system for tracking changes in the workpiece as the processing laser beam moves relative to the workpiece and for adjusting at least one parameter of the processing laser beam in response to the changes in the workpiece, wherein the workpiece tracking system includes at least a laser interferometer sensor for measuring a processing distance to the workpiece.2. The laser machining system of wherein the at least one laser interferometer sensor measures a processing distance to at least one surface of the workpiece claim 1 , and wherein the workpiece tracking system tracks changes in the processing distance to the surface of the workpiece.3. The laser machining system of wherein the at least one laser interferometer sensor measures a processing distance to a process plane of the workpiece and wherein the workpiece tracking system tracks changes in the processing distance to the process plane of the workpiece.4. The laser machining system of wherein the process plane of ...

POLYMERIC STENT AND LASER SYSTEM FOR MANUFACTURING THE SAME

Methods of manufacturing polymeric stents by forming a pattern on a polylactic acid tube using a second harmonic generator laser and polylactic acid polymeric stents having a pattern formed using a second harmonic generator laser. 113-. (canceled)15. The polylactic acid polymeric stent of claim 14 , wherein the polylactic acid polymeric stent has a polydisperity index of 1 to 2.18. A laser system for cutting a pattern on a polylactic acid tube claim 14 , comprising:a laser that generates a first laser beam having a first wavelength between 940 nm to 1,552 nm;a second harmonic generator through which the first laser beam passes to create a second laser beam with a second wavelength between 470 nm to 776 nm, wherein the second laser beam is adapted to cut the pattern on the polylactic acid tube; andwherein the second harmonic generator laser has a pulse width of 1 fs to 900 fs and a repetition rate of 2 kHz to 200 kHz.19. The laser system of claim 18 , wherein the first wavelength is between 1 claim 18 ,000 nm to 1 claim 18 ,100 nm.20. The laser system of claim 18 , wherein the second wavelength is 500 nm to 550 nm.21. The laser system of claim 18 , wherein the second harmonic generator laser is a neodymium-doped laser claim 18 , a ytterbium-doped laser claim 18 , an erbium-doped laser claim 18 , or a hybrid fiber laser.22. The laser system of claim 18 , wherein the power of the laser is between 0.1 W to 10 W before or after being converted into the second harmonic generator laser.23. The laser system of claim 18 , wherein the spot size generated by the second harmonic generator laser is between about 1 μm to 50 μm.24. The laser system of claim 18 , wherein the second harmonic generator laser has a pulse width of 1 fs to 10 fs.25. The laser system of claim 18 , wherein the diameter of the polylactic acid tube is about 0.3× to about 1× of the inner diameter of a human blood vessel.26. The laser system of claim 18 , wherein the diameter of the polylactic acid tube is ...

LASER BEAM SPOT SHAPE DETECTION METHOD

Disclosed herein is a laser beam spot shape detection method for detecting a spot shape of a laser beam oscillated by laser beam oscillator and collected by a condenser in a laser machining apparatus, the laser beam spot shape detection method including: a concave mirror holding step of holding a concave mirror having a spherical face forming a reflecting face with a chuck table; a focal point positioning step of positioning the focal point of the condenser in a proximity including the center of the spherical face forming the reflecting face of the concave mirror held by the chuck table; a laser beam irradiation step of irradiating a laser beam onto the held concave mirror, and an imaging step of capturing images of reflected light with a camera. 1. A laser beam spot shape detection method for detecting a spot shape of a laser beam oscillated by laser beam oscillation means and collected by a condenser in a laser machining apparatus , the laser machining apparatus including:a chuck table operable to hold a workpiece; anda laser beam irradiation unit operable to irradiate a workpiece held by the chuck table with a laser beam,the laser beam irradiation unit having laser beam oscillation means adapted to oscillate a laser beam, and a condenser adapted to collect the laser beam oscillated by the laser beam oscillation means and irradiate the laser beam onto the workpiece held by the chuck table,the laser beam spot shape detection method comprising:a concave mirror holding step of holding a concave mirror having a spherical face forming a reflecting face with the chuck table;a beam splitting means positioning step of positioning beam splitting means at an acting position between the laser beam oscillation means and the condenser, the beam splitting means passing a laser beam from the laser beam oscillation means to the condenser and guiding reflected light, which is collected by the condenser and reflected by the reflecting face of the concave mirror held by the chuck ...

Laser irradiation apparatus

A laser irradiation apparatus includes a laser beam generator that generates a first laser beam, a beam expander that expands the first laser beam and outputs the expanded first laser beam as a second laser beam, a beam splitter that splits the second laser beam into third laser beams and outputs the third laser beams, and a beam condenser that condenses the third laser beams and outputs condensed third laser beams. The beam expander includes a first lens having a first focal length and a second lens having a second focal length. The first lens is disposed between the laser beam generator and the second lens, the second lens is disposed between the first lens and the beam splitter, and the laser beam generator is spaced apart from the first lens by the first focal length.

LASER MACHINING DEVICE AND LASER MACHINING METHOD

A laser processing device converges laser light at an object to be processed having a silicon part containing silicon mounted on a glass part containing glass with a resin part interposed therebetween so as to form a modified region within the object along a line to cut. The laser processing device comprises a laser light source emitting the laser light, a spatial light modulator modulating the laser light emitted from the laser light source, and a converging optical system converging the laser light modulated by the spatial light modulator at the object. When forming the modified region in the glass part, the spatial light modulator displays an axicon lens pattern as a modulation pattern so as to form converging points at a plurality of positions juxtaposed close to each other along a laser light irradiation direction. 1. A laser processing device for converging laser light at an object to be processed having a silicon part containing silicon mounted on a glass part containing glass with a resin part interposed therebetween so as to form a modified region within the object along a line to cut , the laser processing device comprising:a laser light source emitting the laser light;a spatial light modulator modulating the laser light emitted from the laser light source; anda converging optical system converging the laser light modulated by the spatial light modulator at the object;wherein, when forming the modified region in the glass part, the spatial light modulator displays an axicon lens pattern as a modulation pattern so as to form converging points at a plurality of positions juxtaposed close to each other along a laser light irradiation direction.2. A laser processing device according to claim 1 , wherein the laser processing device forms a plurality of modified spots within the object along the line and lets a plurality of the modified regions form the modified region;wherein, when forming the modified region in the glass part, the spatial light modulator forms ...

LASER KEYHOLE WELDING STRUCTURE OF ALUMINUM MATERIAL AND LASER KEYHOLE WELDING METHOD

Disclosed is a laser keyhole welding structure and a keyhole welding method of an aluminum material which stably suppress the generation of sputtering to ensure a reliable electrical connection and obtain a mechanically strong connection. To achieve this, a laser keyhole welding structure of an aluminum material is formed by welding an aluminum material element constituting an electronic component by irradiating a laser beam to the electronic component, in which a tapered portion spread angle (θ) of an upper portion of a welding nugget to be formed is 45° or less. Also disclosed is a laser keyhole welding structure of an aluminum material. 111-. (canceled)12. A laser keyhole welding structure of an aluminum material for welding an aluminum material element constituting the electronic component by irradiating a laser beam to the electronic component , whereinan angle of divergence (θ) of the tapered portion of the upper portion of the weld nugget to be formed is 45° or less.13. The laser keyhole welding structure of the aluminum material according to claim 12 , whereinthe ratio (I/H) between the difference (I) between the half value (ES) of the width of the upper surface of the welding nugget in the cross-sectional shape and the half value (H/2) of the width (H) of the welding nugget in half (G/2) of the total depth (G) of the welding nugget, and the width (H) of the welding nugget is 0.27 or more.14. The laser keyhole welding structure of the aluminum material according to claim 12 , whereinthe aluminum material is a A1000 system mainly composed of AL components.15. The laser keyhole welding structure of the aluminum material according to claim 13 , whereinthe aluminum material is a A1000 system mainly composed of AL components.16. A laser keyhole welding method of an aluminum material for welding an aluminum material element constituting the electronic component by irradiating a laser beam to the electronic component claim 13 , whereinthe laser light has a beam ...

Apparatus and method of improving beam shaping and beam homogenization

The present invention generally relates to an optical system that is able to reliably deliver a uniform amount of energy across an anneal region contained on a surface of a substrate. The optical system is adapted to deliver, or project, a uniform amount of energy having a desired two-dimensional shape on a desired region on the surface of the substrate. Typically, the anneal regions may be square or rectangular in shape. Generally, the optical system and methods of the present invention are used to preferentially anneal one or more regions found within the anneal regions by delivering enough energy to cause the one or more regions to re-melt and solidify.

MULTIPLE BEAM LASER SYSTEM FOR FORMING STENTS

A system and method for precision cutting using multiple laser beams is described. The system and method includes a combination of optical components that split the output of a single laser into multiple beams, with the power, polarization status and spot size of each split beam being individually controllable, while providing a circularly polarized beam at the surface of a work piece to be cut by the laser beam. A system and method for tracking manufacture of individual stents is also provided. 119-. (canceled)20. A method of simultaneously cutting a pattern into multiple stents using the output of a single laser , comprising:providing a single laser;emitting a first linearly polarized laser beam from the single laser;transmitting and reflecting the first linearly polarized laser beam into a second linearly polarized laser beam and a third linearly polarized laser beam using a first beam splitter;transmitting and reflecting the second linearly polarized laser beam into a fourth linearly polarized laser beam and a fifth linearly polarized laser beam using a second beam splitter;transmitting and splitting the third linearly polarized laser beam into a sixth linearly polarized laser beam and a seventh linearly polarized laser beam using a third beam splitter;positioning a half wave plate in an optical path of each of the fourth, fifth, sixth and seventh laser beams, and rotating the half wave plate to alter the polarization direction of each laser beam;positioning a polarizer in the optical path of each of the fourth, fifth, sixth and seventh laser beams and adjusting the laser power of the laser beam at a selected polarization direction;positioning an adjustable beam expander in the optical path of each of the fourth, fifth, sixth and seventh laser beams for adjusting the size of the laser beam;positioning a quarter-wave plate in the path of each of the fourth, fifth, sixth and seventh laser beams after the beam splitter and any intervening mirrors for introducing ...

METHOD AND DEVICE FOR MACHINING A MATERIAL LAYER USING ENERGETIC RADIATION

The invention relates to a method and a device for machining a material layer using energetic radiation to produce three-dimensional components by melting a particulate material in layers. In the method, one or more energetic beams of one or more beam sources are directed onto a layer to be machined and guided over the layer by a dynamic beam guidance system. The method is characterized in that at least one of the energetic beams is divided into multiple individual beams by modulation over time, which are directed onto the layer to be machined in a spatially separated manner. The separation is carried out such that the sum of the power of the individual beams corresponds to the power of the respective energetic beam minus power losses caused by the separation process. 1. Method for machining a material layer using energetic radiation , in particular in order to produce three-dimensional components by melting a particulate material in layers , in whichone or more energetic beams of one or more beam sources are directed onto a layer to be machined and guided over the layer by means of a dynamic beam guidance system in order to machine regions of the layer,characterized in thatat least one of the energetic beams is separated into multiple individual beams by modulation over time, said individual beams being directed onto the layer to be machined in a spatially separated manner, wherein the separation is carried out in such manner that the sum of the power of the individual beams corresponds to the power of the respective energetic beam minus power losses caused by the separation process.2. Method according to claim 1 ,characterized in thateach individual beam is directed onto the layer to be machined by its own dynamic beam deflection device.3. Method according to claim 1 ,characterized in thatthe energetic beam is separated into the individual beams in alternating manner by said modulation over time.4. Method according to claim 2 ,characterized in thatthe energetic ...

OPTICAL MODULE AND LIGHT EXPOSURE DEVICE

An optical module (A) includes a polarization beam splitter (A), polarization elements ( and ) having nonreciprocal optical activity and respectively arranged on an optical path of a first polarization component (L) transmitted through a light splitting surface () in irradiation light (L) and an optical path of a second polarization component (L) reflected in the light splitting surface (), a first reflective SLM () that modulates and reflects a first polarization component (L) passing through the first polarization element (), and a second reflective SLM () that modulates and reflects the second polarization component (L) passing through the second polarization element (). First modulation light (L) passing through the polarization element () again and then reflected by the light splitting surface () and second modulation light (L) passing through the polarization element () again and then transmitted through the light splitting surface () are combined with each other. 1. An optical module for modulating irradiation light output from a light source to generate modulation light , the optical module comprising:a polarization beam splitter including a light splitting surface configured to reflect an s-polarization component included in the irradiation light and transmit a p-polarization component;a first polarization element having nonreciprocal optical activity to rotate a polarization plane, and arranged on an optical path of a first polarization component transmitted through the light splitting surface in the irradiation light;a first reflective spatial light modulator configured to modulate the first polarization component passing through the first polarization element to generate first modulation light, and reflect the first modulation light to the first polarization element;a second polarization element having nonreciprocal optical activity to rotate a polarization plane, and arranged on an optical path of a second polarization component reflected by the light ...

PARALLEL ASSEMBLY OF DISCRETE COMPONENTS ONTO A SUBSTRATE

A method includes transferring multiple discrete components from a first substrate to a second substrate, including illuminating multiple regions on a top surface of a dynamic release layer, the dynamic release layer adhering the multiple discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The illuminating induces a plastic deformation in each of the irradiated regions of the dynamic release layer. The plastic deformation causes at least some of the discrete components to be concurrently released from the first substrate. 1. A method comprising:{'claim-text': ['individually transferring each of one or more first discrete components from the substrate to a first destination using a first laser-assisted transfer process, the first discrete components not satisfying a quality criterion; and', 'transferring multiple second discrete components from the substrate to a second destination using a second laser-assisted transfer process, the second discrete components satisfying the quality criterion.'], '#text': 'transferring multiple discrete components from a substrate, the discrete components being adhered to the substrate by a dynamic release layer, the transferring including:'}2. The method of claim 1 , in which transferring the multiple second discrete components comprises transferring fewer than all of the second discrete components such that one or more second discrete components remain adhered to the substrate.3. The method of claim 2 , comprising individually transferring each of one or more of the second discrete components that remain adhered to the substrate to the second destination.4. The method of claim 3 , in which the multiple second discrete components form an array of discrete components at the second destination claim 3 , andin which individually transferring each of one or more of the second discrete components that remain comprises transferring each remaining ...

LASER CUTTING OF MATERIALS WITH INTENSITY MAPPING OPTICAL SYSTEM

A method of laser processing a workpiece, the method comprising focusing a pulsed laser beam into a laser beam focal line directed into the workpiece, the laser beam focal line generating an induced absorption within the material, and the induced absorption producing a defect line along the laser beam focal line within the workpiece, wherein the focal line has length L and a substantially uniform intensity profile such that the peak intensity distribution over at least 85% of the length L of the focal line does not vary by more 40%, and preferably by no more than 30 or 20% from its mean peak intensity. 1. A method of laser processing a workpiece , the method comprising:focusing a pulsed laser beam into a laser beam focal line directed into the workpiece, the laser beam focal line generating an induced absorption within the material, and the induced absorption producing a defect line along the laser beam focal line within the workpiece,wherein said focal line having length L and a substantially uniform intensity profile such that the peak intensity distribution over at least 85% of the length L of the focal line does not vary by more 20% from mean peak intensity.2. The method of claim 1 , further utilizing an optical system comprising at least one aspheric surface.3. The method of claim 1 , further utilizing an optical system comprising at least two aspheric surfaces.4. The method of claim 2 , wherein said aspheric surface is a curved surface of a refractive or a reflective element.5. The method of claim 1 , wherein said focal line has a substantially uniform intensity profile such that the peak intensity distribution over at least 90% of the length L of the focal line does not vary by more 20% from mean peak intensity.6. The method of claim 1 , wherein said focal line has a substantially uniform intensity profile such that the intensity distribution over the length L of the focal line does not vary by more 20% from mean peak intensity.7. The method of claim 1 , ...

APPARATUS FOR ADDITIVELY MANUFACTURING OF THREE-DIMENSIONAL OBJECTS

Apparatus () for additively manufacturing of three-dimensional objects () by means of successive layerwise selective irradiation and consolidation of layers of a build material () which can be consolidated by means of an energy beam (), wherein a measuring unit () is provided that is configured to generate information relating to a collimated part () of the energy beam () and information relating to a focused part () of the energy beam (). 11234514166474. Apparatus () for additively manufacturing of three-dimensional objects () by means of successive layerwise selective irradiation and consolidation of layers of a build material () which can be consolidated by means of an energy beam () , characterized by a measuring unit () comprising at least one measuring device ( , ) configured to generate information relating to a collimated part () of the energy beam () and information relating to a focused part () of the energy beam ().25. Apparatus according to claim 1 , characterized in that the measuring unit () comprises:{'b': 8', '10', '11', '9', '10', '11', '12', '13', '10', '14', '15', '12', '12', '11', '11', '16, 'a first beam splitter () located between a collimating optic () and a focusing optic (), wherein a first optical beam path () extends from the collimating optic () through the focusing optic () onto a build plane () and a second optical beam path () extends from the collimating optic () to a first measuring device () and a third optical beam path () extends from the build plane () and/or a surface between the build plane () and the focusing optic () through the focusing optic () to a second measuring device (), wherein'}{'b': 14', '6', '4, 'the first measuring device () is configured to generate information relating to a collimated part () of the energy beam () and wherein'}{'b': 16', '12', '7', '4, 'the second measuring device () is configured to generate information relating to radiation emitted from a zone of the build plane () and/or to generate ...

MACHINE COMPONENT CLADDING STRATEGY

Cladding and remanufacturing a machine component includes directing cleaning and welding beams split from an incident laser beam toward the machine component, and moving the machine component relative the cleaning and welding beams such that the welding beam trails behind the cleaning beam along a common travel path. A surface of the machine component is decontaminated by the cleaning beam, whilst a cladding material is melted via the welding beam such that upon solidifying the cladding material forms a coating metallurgically bonded to base material and previously deposited cladding material of the machine component. 1. A method of cladding a machine component comprising the steps of:splitting an incident laser beam into a cleaning beam and a welding beam;directing the cleaning and welding beams toward a machine component such that the cleaning and welding beams impinge upon a surface of the machine component;moving the machine component relative the cleaning and welding beams such that the welding beam trails behind the cleaning beam along a common travel path upon the surface;decontaminating the surface along the common travel path via the cleaning beam; andmelting a cladding material via the welding beam such that the melted cladding material contacts the decontaminated surface along the common travel path and upon solidifying bonds to material of the machine component forming the surface.2. The method of wherein the surface is substantially cylindrical and defines a center axis claim 1 , and the step of moving includes axially advancing the machine component relative the cleaning and welding beams.3. The method of wherein the material forming the surface includes a base material of the machine component and cladding material in the form of a previously deposited bead claim 2 , such that the melted cladding material upon solidifying forms a newly deposited bead overlapping the previously deposited bead.4. The method of wherein the step of moving further includes ...

TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER

Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed. 1. A laser-based system for modification of a transparent material , comprising:a pulsed laser apparatus generating a pulsed laser output comprising at least one pulse having a pulse width in the range from about 10 fs to 100 ps;a multifocus beam generator receiving said output, said generator configured to form a plurality of focused beams using said pulsed laser output, each focused beam having a beam waist, said beam waists spaced depthwise relative to said material, at least one beam waist of said plurality of focused beams being within said material and causing modification of said material, said plurality of focused beams comprising different polarizations or different wavelengths generated in different optical paths;a motion system to produce relative movement between said material and said focused beams; anda controller coupled to said pulsed laser apparatus and to said motion system, and controlling said system in such a way that said ...

LASER MACHINING APPARATUS

A laser machining apparatus has a laser beam irradiation unit that includes: a pulsed laser oscillator that oscillates a pulsed laser beam at a given repetition frequency; first and second condensers that collect the pulsed laser beam oscillated by the pulsed laser oscillator; and a beam splitting unit arranged between the pulsed laser oscillator and the first and second condensers to split the pulsed laser beam oscillated by the pulsed laser oscillator and direct the resultant beams alternately toward the first and second condensers. The beam splitting unit includes a photoelastic modulator that has a piezo element and a synthetic quartz formed in one piece and modulates the laser beam so that a polarization plane of the laser beam is alternately at 0 and 90 degrees by applying, to the piezo element, a high frequency voltage at a frequency that matches the natural frequency of the synthetic quartz. 1. A laser machining apparatus comprising:chuck table operable to hold a workpiece; andlaser beam irradiation means operable to irradiate the workpiece held by the chuck table with a laser beam, a pulsed laser oscillator adapted to oscillate a pulsed laser beam at a given repetition frequency,', 'first and second condensers adapted to collect the pulsed laser beam oscillated by the pulsed laser oscillator, and', 'beam splitting means arranged between the pulsed laser oscillator and the first and second condensers to split the pulsed laser beam oscillated by the pulsed laser oscillator and direct the resultant beams alternately toward the first and second condensers,', 'the beam splitting means including a photoelastic modulator that has a piezo element and synthetic quartz formed in one piece and modulates the laser beam so that a polarization plane of the laser beam is alternately at 0 and 90 degrees by applying, to the piezo element, a high frequency voltage at a frequency that matches the natural frequency of the synthetic quartz., 'the laser beam irradiation means ...

Laser light irradiating device

There is provided a laser light irradiating device that includes a spatial light modulator configured to modulate laser light output from a laser light source according to a phase pattern and emit the modulated laser light, an objective lens configured to converge the laser light emitted from the spatial light modulator onto the object, a focusing lens arranged between the spatial light modulator and the objective lens in an optical path of the laser light and configured to focus the laser light, and a slit member arranged at a focal position on a rear side of the focusing lens in the optical path of the laser light and configured to block a part of the laser light.

LASER PROCESSING SYSTEM

A laser processing system includes a laser source, an optical splitting unit, a frequency conversion unit and at least one optical mixer. The optical splitting unit is provided to divide light emitted by the laser source into a first light and a second light, and the first light and the second light have the same wavelength range. The frequency conversion unit is provided to convert the second light into a working light. The working light includes a frequency converted light, and the frequency converted light and the second light have different wavelength ranges. The optical mixer is provided to mix the first light with the frequency converted light. 1. A laser processing system , comprising:a laser source;an optical splitting unit provided to divide light emitted by the laser source into a first light and a second light, with the first light and the second light having same wavelength range;a frequency conversion unit provided to convert the second light into a working light, wherein the working light comprises a frequency converted light, the frequency converted light and the second light have different wavelength ranges; andat least one optical mixer provided to mix the first light with the frequency converted light.2. The laser processing system according to claim 1 , wherein the laser source is a monochromatic laser source.3. The laser processing system according to claim 1 , further comprising a light intensity adjustment unit claim 1 , wherein the optical splitting unit is disposed between the laser source and the light intensity adjustment unit claim 1 , and the light intensity adjustment unit is provided to adjust light intensity of the first light.4. The laser processing system according to claim 1 , further comprising a light intensity adjustment unit disposed between the optical splitting unit and the frequency conversion unit claim 1 , and the light intensity adjustment unit is provided to adjust light intensity of the second light.5. The laser ...

WELDING METHOD AND WELDING DEVICE

An adjustment of the amount of energy in at least one specific applying unit is executed when energy is applied to a cylindrical member pair in which another cylindrical member is inserted inside a cylindrical member to melt and weld the cylindrical member pair in a circumferential direction. The adjustment is executed in association with a rotation angle to satisfy a relationship of Pd+Pw>θ, wherein Pd is an output decease rotation angle that decreases the energy amount from a steady energy amount HP applied from the specific applying unit in a welding end process, Pw is an overlap rotation angle at which the irradiation parts around the cylindrical member pair overlap with the steady energy amount HP, and θ is a separation angle between the specific applying unit and another applying unit adjacent to each other in a rotation direction around the axis. 1. A welding method for circumferentially melting and welding a cylindrical member pair in which another cylindrical member is inserted inside a cylindrical member , comprising:a rotation welding step that relatively rotates an applying unit which applies energy for melting and welding the cylindrical member pair and the cylindrical member pair around an axis of the cylindrical member pair, and applies the energy from the applying unit to the cylindrical member pair to rotate an irradiation part of the energy applied from the applying unit around the axis; andan adjusting step that adjusts the amount of energy applied to the cylindrical member pair from the applying unit in association with a rotation angle of the cylindrical member pair around the axis, whereinin the adjusting step,the adjustment of the amount of energy in a specific applying unit which is at least one of the applying units arranged in two or more locations in a circumferential direction of the cylindrical member pair is executed in association with a rotation angle to satisfy a relationship of Pd+Pw>θ, wherein Pd is an output decease rotation angle ...

SYSTEM AND METHOD FOR MINIMIZING THE EFFECTS OF SENSOR ORIENTATION IN SMART OPTICAL MONITORING SYSTEMS

A smart additive manufacturing system uses a spectrometer to collect emission spectra along an optical axis from a laser-generated plasma plume, and wherein the laser beam and the optical axis of the emission spectra are co-axial, at least in the vicinity of the melt pool, thereby minimizing the fluctuation of spectral signals caused by ambient pressure/gas variations. The laser beam passes through a beam splitter prior to reaching the work piece, and the emission spectra from the work piece are redirected by the beam splitter to the spectrometer, and wherein the laser beam and the optical axis of the emission spectra are co-axial between the work piece and the beam splitter. The beam splitter may be a dichroic mirror or other type of beam splitter, including holographic beam splitters, and spectral filtering may be carried out with separate optical elements, as long as the overall goal of on-axis excitation and collection is achieved. 1. An additive manufacturing system , comprising:a laser outputting a beam of light onto work piece so as to form a melt pool with a laser-generated plasma plume;a spectrometer operative to collect emission spectra along an optical axis from the laser-generated plasma plume; andwherein the laser beam and the optical axis of the emission spectra are co-axial at least in the vicinity of the melt pool.2. The additive manufacturing system of claim 1 , wherein:the laser passes through a beam splitter prior to reaching the work piece;the emission spectra from the work piece are redirected by the beam splitter to the spectrometer; andthe laser beam and the optical axis of the emission spectra are co-axial between the work piece and the beam splitter.3. The system of claim 1 , wherein the beam splitter is a dichroic mirror.4. The system of claim 1 , wherein the beam splitter is selected to function as a short-pass or as a long-pass filter.5. The system of claim 1 , wherein the choice of a short-pass or a long-pass filter is based on the type ...

RADIATIVE WAFER CUTTING USING SELECTIVE FOCUSING DEPTHS

Semiconductor wafer cutting is optimised by directing a plurality of laser beams at the wafer, with the laser beams being focused so that at least some of their respective focal points are located at different depths throughout the wafer. 1. A laser cutting apparatus for cutting a semiconductor wafer along a cut line of the wafer , comprising:a planar wafer support surface having a plane operative to support a semiconductor wafer thereon in use,a laser supply operative to produce a plurality of output laser beams,a beam focuser located in an optical path of each output laser beam operative to focus each said laser beam at a respective focal point, the wafer support surface being movable relative to the beam focuser in a direction parallel to the plane of the wafer support surface, andan actuator operative to relatively move the wafer support surface and beam focuser in a direction parallel to the plane of the wafer support surface so that in use the focal point of each output laser beam follows the cut line of the wafer during said relative movement,wherein the focal point of at least one output laser beam is located at a different distance from the plane of the wafer support surface than the focal point of at least one other output laser beam.2. The laser cutting apparatus of claim 1 , wherein the laser supply comprises a laser source operative to emit a source laser beam along an optical path and a beam divider located along the optical path of the source laser beam to split the source laser beam into the plurality of output laser beams.3. A laser cutting apparatus according to claim 2 , wherein the beam divider comprises a diffractive optical element.4. The laser cutting apparatus of claim 3 , wherein the diffractive optical element is operative to produce at least two output laser beams having different divergences.5. The laser supply apparatus of claim 3 , wherein the diffractive optical element is operative to produce at least two output laser beams having ...

Turbocharger shaft and wheel assembly

A system can include a controller; a force applicator; a rotatable shaft centering collet; a drive mechanism that rotates the rotatable shaft centering collect; and a laser beam unit.

Turbocharger shaft and wheel assembly

A method can include co-axially locating a turbine wheel and a shaft where a force applicator applies an axially directed force to the turbine wheel, where the turbine wheel transfers at least a portion of the force to shaft and where a rotatable shaft collet supports the shaft; rotating the rotatable shaft collet; energizing at least one laser beam; and, via the at least one laser beam, forming a weld between the turbine wheel and the shaft.

Laser Beam Joining Method and Laser Machining Optics

The invention relates to a method for joining workpieces () using a laser beam (), wherein the laser beam () is focused onto a focal plane downstream of the machining plane in the beam propagation direction and subdivided into a plurality of partial beams () by means of a beam dividing device (). The subdivision is effected in a geometric manner, i.e. the partial beam cross sections emerge from a division of the geometric form of the beam cross section of the laser beam (). The partial beams () are guided onto the machining plane () in a crossed manner and with an offset from one another in such a way that an extended laser focus () is formed. The radiation intensity distribution of the superposed partial beams () in the machining plane () along a line perpendicular to the seam joint respectively has a maximum at the end regions thereof. As a result thereof and as a result of the spatially extended region of high radiation intensity on both sides along the seam joint compared to the prior art, there is, firstly, an improvement in the edge connection and hence in the quality of the seam joint and, secondly, an increase in the process efficiency. 2719181213. The method for joining according to claim 1 , characterized in that the laser beam () is subdivided into two partial beams () of equal geometric shape and equal radiation intensity distribution of the partial beam cross sections claim 1 , wherein a first maximum of the radiation intensity of the laser focus () is located on the first workpiece () and a second maximum of the radiation intensity is located on the second workpiece ().371918818. The method for joining according to claim 1 , characterized in that the laser beam () is subdivided into four partial beams () of equal geometric shape and equal radiation intensity distribution of the partial beam cross sections claim 1 , wherein the laser focus () exhibits a rectangular shape in the machining plane () and wherein each corner of said rectangular laser focus ...

WELDING METHOD AND WELDING APPARATUS

A welding method includes: placing a workpiece including aluminum in a region to which laser light is emitted; and irradiating the laser light to the workpiece to melt an irradiated portion of the work piece to perform welding. Further, the laser light is formed of a main beam and plural auxiliary beams, and the plural auxiliary beams are positioned so as to surround a periphery of the main beam. 1. A welding method comprising:placing a workpiece including aluminum in a region to which laser light is emitted; andirradiating the laser light to the workpiece to melt an irradiated portion of the work piece to perform welding, whereinthe laser light is formed of a main beam and plural auxiliary beams, andthe plural auxiliary beams are positioned so as to surround a periphery of the main beam.2. The welding method according to claim 1 , wherein a ratio between power of the main beam and a total power of the plural auxiliary beams is 0:10 to 4:6.3. The welding method according to claim 1 , wherein the plural auxiliary beams are positioned so as to form an approximate ring shape with the main beam as a center of the approximate ring shape.4. The welding method according to claim 1 , whereinthe laser light and the workpiece are moved relatively to each other so that the laser light sweeps the workpiece to perform welding by melting, andat least one of the plural auxiliary beams is positioned in front, in a sweep direction, of the main beam.5. The welding method according to claim 1 , wherein the workpiece includes at least two members to be welded together claim 1 , and when the workpiece is placed in the region to which the laser light is emitted claim 1 , the at least two members are superimposed onto each other claim 1 , brought into contact with each other claim 1 , or placed adjacently to each other.6. The welding method according to claim 1 , wherein the laser light is split into the main beam and the plural auxiliary beams by a beam shaper and emitted to the ...

Turbocharger shaft and wheel assembly

A unit for a turbocharger can include a turbine wheel portion that includes a turbine wheel material and a turbine wheel axis; a shaft portion that includes a shaft material and a shaft axis; a first weld that includes a first average axial position over a first azimuthal span and first weld composition formed of a greater proportion of the turbine wheel material than the shaft material; and a second weld that includes a second average axial position over a second azimuthal span and second weld composition formed of a greater proportion of the turbine wheel material than the shaft material, where a sum of the first azimuthal span and the second azimuthal span is approximately 360 degrees, where the first average axial position differs from the second average axial position, and where the first weld composition differs from the second weld composition.

METHOD AND DEVICE FOR SHAPING RADIATION FOR LASER PROCESSING

A method and a laser assemblage are described for material processing, such that in a laser assemblage, a laser beam is focused onto a processing/imaging plane and the laser beam can be adapted in terms of its intensity distribution by way of at least one beam shaper. Provision is made in this context that in order to avoid uniformity defects in the processing/imaging plane, the laser beam is split by way of at least one beam splitter into at least two partial or individual beams, and the partial or individual beams are differently influenced, or each partial or individual beam is constituted from a laser source having a different wavelength, in such a way that after they are combined and focused onto the processing/imaging plane they form an output beam having an intensity profile, adjacent intensity maxima of the intensity profile differing in terms of their light properties. It is thereby possible to prevent the occurrence of obtrusive interference so that obtrusive speckle patterns are largely eliminated, with the result that beam shaping quality, in particular for laser processing processes, can be considerably improved. 115.-. (canceled)16. A method for beam shaping in a laser processing process , comprising:in a laser assemblage, focusing a laser beam onto a processing/imaging plane;adapting an intensity distribution of the laser beam by way of at least one beam shaper; andin order to avoid uniformity defects in the processing/imaging plane, splitting the laser beam by way of at least one beam splitter into at least two partial or individual beams, wherein one of the partial or individual beams are differently influenced and each partial or individual beam is constituted from a laser source having a different wavelength, in such a way that after the partial or individual beams are combined and focused onto the processing/imaging plane, the partial or individual beams form an output beam having an intensity profile, wherein adjacent intensity maxima of the ...

IMAGE HEATING APPARATUS

An image heating apparatus includes a first rotatable member, a second rotatable member, a laser light irradiation portion, and a cleaning member. The cleaning member is provided in a position other than a position where laser light emitted from the laser light irradiation portion toward the nip is blocked. 1. An image heating apparatus for heating an image on a recording material with laser light , said image heating apparatus comprising:a first rotatable member through which the laser light passes and which is contactable to the image on the recording material;a second rotatable member pressing said first rotatable member to form a nip in which the recording material is nipped and fed;a laser light irradiation portion provided outside said first rotatable member and configured to irradiate the nip with the laser light by emitting the laser light so as to enter said first rotatable member from the outside of said first rotatable member; anda cleaning member configured to clean said first rotatable member in contact with a surface of said first rotatable member,wherein said cleaning member is provided in a position other than a position where the laser light emitted from said laser light irradiation portion toward the nip is blocked.2. An image heating apparatus according to claim 1 , wherein said first rotatable member is formed with a cylindrical glass member.3. An image heating apparatus according to claim 2 , wherein said first rotatable member includes a transparent rubber layer and a transparent fluorine-containing layer on the glass member.4. An image heating apparatus according to claim 1 , wherein with respect to a rotational direction of said first rotatable member claim 1 , said cleaning member is disposed on a side upstream of a position where the laser light entering said first rotatable member and said first rotatable member cross each other and downstream of the nip.5. An image heating apparatus according to claim 1 , wherein said cleaning member is a ...

Laser Beam Splitting and Angle Adjusting Device

The present invention relates to a laser beam splitting and angle adjusting device. The device comprises a design of a multibeam module disposed between a plurality of laser units and a refractor to allow light beams emitted out from the plurality of laser units being modulated by the multibeam module so as to perform scan photolithography on photomask patterns. Different cutting purposes can be achieved through adjusting an arrangement of light beams in order to accomplish effects including deepening depths of cutting, and adjusting or controlling a size of groove widths of groove cutting, and so on. 1. A laser beam splitting and angle adjusting device , comprising a plurality of laser units , a refractor and a convergent lens , the plurality of laser units emitting a light beam being refracted by the refractor toward the convergent lens , wherein a multibeam module is disposed between the plurality of laser units and the refractor , and the light beam emitted out from the plurality of laser units is modulated by the multibeam module in order to perform scan photolithography.2. The laser beam splitting and angle adjusting device as claimed in claim 1 , wherein the light beam emitted out from the plurality of laser units is further modulated by the multibeam module to generate multi-beams claim 1 , and the multi-beams are modulated to adjust a beam arrangement angle thereof as in a straight beam arrangement through corresponding rotating adjustment of the multibeam module so as to deepen cutting depths.3. The laser beam splitting and angle adjusting device as claimed in claim 1 , wherein the light beam emitted out from the plurality of laser units is further modulated by the multibeam module to generate multi-beams claim 1 , and the multi-beams are modulated to adjust a beam arrangement angle thereof as in an oblique beam arrangement through corresponding rotating adjustment of the multibeam module so as to control a groove width of groove cutting.4. The laser beam ...

Laser beam irradiation apparatus

A laser beam irradiation apparatus includes a laser light source, a controller for controlling energy of light generated by the laser source, a first optical system for adjusting a shape of light that has passed through the controller, a scanner for adjusting the direction of light that has passed through the first optical system, and an F-theta lens for reducing a beam that has passed through the scanner.

Welding method and welding apparatus

A welding method includes: disposing a workpiece formed by stacking a plurality of metal foils in an area to be irradiated with laser light that contains a plurality of beams; irradiating a surface of the workpiece with the beams of the laser light by dispersing positions of the beams such that centers of the beams do not overlap with each other within a prescribed area on the surface; melting an irradiated part of the workpiece and performing welding; and setting each of the beams to have a power density with which no hole opens in the metal foils, and setting the power density of the beams and dispersing irradiating positions to be emitted so as to form a weld pool penetrating the workpiece by the beams.

Laser processing apparatus

A laser processing apparatus includes a first chuck table for holding a first workpiece, moving units for moving the first chuck table in X and Y directions, and a first focusing unit for focusing a first laser beam to the first workpiece. A second chuck table holds a second workpiece. Other moving units move the second chuck table in the X direction and Y directions, and a second focusing unit focuses a second laser beam to the second workpiece. A laser oscillator produces an original laser beam, and an optical system branches the original laser beam into the first laser beam and the second laser beam, and leads the first and second laser beams to the first and second focusing units, respectively.

POLARIZATION MODULE AND LASER APPARATUS INCLUDING THE SAME

A polarization module and a laser exposure apparatus have a polarization module including a first lens and a second lens that reduce a one-directional length of a cross-section of an incident laser beam having an optical axis. A polarization beam splitter divides the laser beam passing through the first and second lenses into two laser beams that are polarized in different directions with respect to each other. A first prism lens and a second prism lens emit an output laser beam by controlling the two laser beams that are divided by the polarization beam splitter to positions that are symmetrical with respect to the optical axis. At least one half wave plate is disposed between the polarization beam splitter and the first prism lens. 1. A polarization module comprising:a first lens and a second lens that, together, reduce a first-directional length of a cross-section of an incident laser beam having an optical axis;a polarization beam splitter that divides the laser beam passing through the first and second lenses into two laser beams that are polarized in different directions with respect to each other;a first prism lens and a second prism lens that produce an output laser beam by controlling the two laser beams that are divided by the polarization beam splitter to positions that are symmetrical with respect to the optical axis; andat least one half wave plate disposed between the polarization beam splitter and the first prism lens.2. The polarization module of claim 1 , wherein an area of a cross-section of the output laser beam is substantially the same as an area of a cross-section of the incident laser beam.3. The polarization module of claim 2 , wherein the output laser beam includes a first output laser beam and a second output laser beam that have a same polarization direction.4. The polarization module of claim 3 , wherein a shape of the cross-section of the output laser beam is substantially the same as a shape of the cross-section of the incident laser ...

LASER PROCESSING APPARATUS

Disclosed herein is a laser processing apparatus including first and second laser mechanisms, a laser oscillator for oscillating an original laser beam, an optical system for branching the original laser beam into first and second laser beams, and first and second operation panels for respectively setting first and second processing conditions for the first and second laser mechanisms. The first and second laser mechanisms include first and second chuck tables for holding first and second workpieces, first and second X moving units for moving the first and second chuck tables in an X direction, first and second Y moving units for moving the first and second chuck tables in a Y direction perpendicular to the X direction, and first and second focusing units for focusing the first and second laser beams to the first and second workpieces held on the first and second chuck tables, respectively. 1. A laser processing apparatus comprising:a first laser mechanism including a first chuck table for holding a first workpiece, first X moving means for moving said first chuck table in an X direction, first Y moving means for moving said first chuck table in a Y direction perpendicular to said X direction, and first focusing means for focusing a first laser beam to said first workpiece held on said first chuck table;a second laser mechanism including a second chuck table for holding a second workpiece, second X moving means for moving said second chuck table in said X direction, second Y moving means for moving said second chuck table in said Y direction, and second focusing means for focusing a second laser beam to said second workpiece held on said second chuck table;a laser oscillator for oscillating an original laser beam;an optical system for branching said original laser beam oscillated by said laser oscillator into said first laser beam and said second laser beam and leading said first and second laser beams to said first and second focusing means, respectively;a first ...

Method of ablating and printing on firearms and the resulting product

A method of customizing the surface of a firearm and a resulting customized firearm includes laser ablating a predetermined metallic surface area of the firearm. An image that fits within the borders of the laser ablated surface is then ink-printed onto the laser ablated surface of the firearm.

TEMPERATURE SENSING APPARATUS, LASER PROCESSING SYSTEM, AND TEMPERATURE MEASURING METHOD

A temperature sensing apparatus configured to measure a temperature distribution of a surface to be measured is provided. The temperature sensing apparatus includes a lens set, a filtering module, a plurality of sensor arrays, and a processing unit. The lens set is configured to receive radiation from the surface to be measured. The filtering module is configured to filter the radiation from the lens set into a plurality of radiation portions respectively having different wavelengths. The sensor arrays are configured to respectively sense the radiation portions. The processing unit is configured to calculate an intensity ratio distribution of the radiation between the different wavelengths according to the radiation portions respectively sensed by the sensor arrays and determine the temperature distribution according to the intensity ratio distribution. A laser processing system and a temperature measuring method are also provided. 1. A temperature sensing apparatus configured to measure a temperature distribution of a surface to be measured , the temperature sensing apparatus comprising:a lens set configured to receive radiation from the surface to be measured;a filtering module configured to filter the radiation from the lens set into a plurality of radiation portions respectively having different wavelengths;a plurality of sensor arrays configured to respectively sense the radiation portions; anda processing unit configured to calculate an intensity ratio distribution of the radiation between the different wavelengths according to the radiation portions respectively sensed by the sensor arrays and determine the temperature distribution according to the intensity ratio distribution.2. The temperature sensing apparatus according to claim 1 , wherein a refresh rate of each of the sensor arrays is greater than or equal to 1 kHz.3. The temperature sensing apparatus according to claim 1 , wherein each of the sensor arrays comprises a plurality of optical sensors ...

LASER PROCESSING APPARATUS

A laser beam applying unit of a laser processing apparatus includes a beam splitter disposed on a first optical path connecting a laser oscillator and a condenser, a wide band light source disposed on a second optical path branched by the beam splitter, a spectroscope that is disposed between the wide band light source and the beam splitter and that branches the laser beam from the second optical path to a third optical path, and a Z position detection unit that is disposed on the third optical path branched by the spectroscope and that detects the position in a Z-axis direction of a workpiece according to an intensity of light corresponding to the wavelength of return light that is generated when the light of the wide band light source is condensed by the condenser and is reflected by the workpiece held by a chuck table. 1. A laser processing apparatus comprising:a chuck table that holds a workpiece;a laser beam applying unit that applies a laser beam to the workpiece held by the chuck table to process the workpiece;an X-axis feeding mechanism that performs relative processing feeding of the chuck table and the laser beam applying unit in an X-axis direction;a Y-axis feeding mechanism that performs relative processing feeding of the chuck table and the laser beam applying unit in a Y-axis direction orthogonal to the X-axis direction; anda control unit, a laser oscillator that oscillates laser,', 'a condenser that condenses the laser beam emitted from the laser oscillator onto the workpiece held by the chuck table at any position in a Z-axis direction orthogonal to the X-axis direction and the Y-axis direction,', 'a beam splitter disposed on a first optical path connecting the laser oscillator and the condenser,', 'a wide band light source disposed on a second optical path branched by the beam splitter,', 'a spectroscope that is disposed between the wide band light source and the beam splitter and that branches the laser beam from the second optical path to a third ...

Printer nozzle structure

A nozzle structure for discharging printing material onto a substrate is presented. The nozzle structure comprises a tubular member having a distal part that faces the printing plane when in operation and defining an elongated inner cavity along the tubular member for placement a filament printing material. The tubular member comprises light input ports on the proximal part thereof for directing light toward inner surfaces thereof. The tubular member has an elongated tube portion and a distal tip portion at the distal part thereof, configured and operable as a light guide trapping and guiding the input light along the tubular member in a general direction toward the distal part, thereby continuously transferring light field to distal regions of the elongated inner cavity. The distal tip portion is configured to allow the trapped light to escape towards the printing plane, thereby heating a location on the printing plane facing the nozzle.

APPARATUSES AND METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING NON-AXISYMMETRIC BEAM SPOTS

A method for laser processing a transparent workpiece includes forming a contour line that includes defects, by directing a pulsed laser beam output by a beam source through an aspheric optical element positioned offset in a radial direction from the beam pathway and into the transparent workpiece such that the portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece that produces a defect within the transparent workpiece. The portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, an effective spot size w, and a non-axisymmetric beam cross section having a minimum Rayleigh range Zin an x-direction and a minimum Rayleigh range Zin a y-direction. Further, the smaller of Zand Zis greater than 2. The method of claim 1 , further comprising translating the transparent workpiece and the pulsed laser beam relative to each other along the contour line claim 1 , thereby laser forming a plurality of defects along the contour line within the transparent workpiece.3. The method of claim 2 , further comprising directing an infrared laser beam onto the transparent workpiece along or near the contour line to separate the transparent workpiece along the contour line.4. The method of claim 1 , wherein the aspheric optical element comprises a refractive axicon claim 1 , a reflective axicon claim 1 , waxicon claim 1 , negative axicon claim 1 , a spatial light modulator claim 1 , a diffractive optic claim 1 , or a cubically shaped optical element.5. The method of claim 1 , wherein:the aspheric optical element is offset from the beam pathway in the radial direction by an offset distance; andthe offset distance is a distance from about 10% to about 75% of a cross sectional diameter of the pulsed laser beam at a contact location between the pulsed laser beam and the aspheric optical element.6. The method of claim 1 , wherein the dimensionless divergence factor ...

ADJUSTABLE SPATIAL FILTER FOR LASER SCRIBING APPARATUS

An apparatus for radiatively scribing a substantially planar semiconductor substrate along a scribelane that extends between opposing rows of semiconductor devices on a target surface of the substrate, said scribelane having a length extending parallel to a first direction and a width extending parallel to a second direction, these first and second directions lying respectively parallel to X and Y axes of a Cartesian coordinate system, comprising: 1. An apparatus for radiatively scribing a substantially planar semiconductor substrate along a scribelane that extends between opposing rows of semiconductor devices on a target surface of the substrate , said scribelane having a length extending parallel to a first direction and a width extending parallel to a second direction , these first and second directions lying respectively parallel to X and Y axes of a Cartesian coordinate system , comprising:a substrate holder for holding the substrate;an illuminator for producing an adjustable array of several light beams;a projection system for focusing said light beams onto said target surface of the substrate when held on the substrate holder;an actuator system for causing relative displacement of the substrate holder with respect to said light beams parallel to an XY plane,wherein the apparatus further comprises:an adjustable spatial filter located between said illuminator and said substrate holder, comprising a plurality of motorized plates whose position can be adjusted so as to at least partially block selectable light beams of said array.2. An apparatus according to claim 1 , wherein: a first plurality of light beams with mutually different X coordinates;', 'a second plurality of light beams with mutually different Y coordinates;, 'said illuminator is embodied to produce an array in which there is at least one of a first peripheral subset of said first plurality of light beams;', 'a second peripheral subset of said second plurality of light beams, located outside a ...

LASER WELDER

A laser welder controls a focus and direction of a laser beam received from a laser oscillator through optical fiber and radiating the controlled laser beam. The laser welder may include a housing; a beam transmission unit expanding a beam size and simultaneously switching direction of the laser beam; a first radiation unit switching direction of the laser beam by reflecting part of the laser beam through a slot mirror and simultaneously reducing the beam size within the housing, thus forming a focus in a first welding unit through a first beam port; and a second radiation unit expanding and reducing a remainder of the laser beam received through the slot mirror of the first radiation unit and simultaneously switching a direction of the remainder, thus forming a focus in a second welding unit through a second beam port. 1. A laser welder for controlling a focus and direction of a laser beam received from a laser oscillator through an optical fiber and radiating a controlled laser beam , the laser welder comprising:a housing including a first beam port and a second beam port formed in a lower part of the housing;a beam transmission unit to expand a beam size of the laser beam received through the optical fiber, simultaneously switch the direction of the laser beam, and send the laser beam within the housing;a first radiation unit to switch a direction of the laser beam by reflecting a portion of the laser beam received from the beam transmission unit through a slotted mirror and simultaneously reduce the beam size of the laser beam within the housing, thus forming a focus in a first welding unit through the first beam port; anda second radiation unit to expand and reduce a beam size of a remainder portion of the laser beam received from the beam transmission unit through the slotted mirror of the first radiation unit and simultaneously switch a direction of the remainder portion of the laser beam within the housing, thus forming a focus in a second welding unit ...

HIGH THROUGHPUT LASER PROCESSING

A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source. 1. A method of fabricating a solar cell , the method comprising:splitting a laser beam from a laser source into a first laser beam along a first laser beam path and a second laser beam along a second laser beam path;applying the first laser beam to a first wafer at a first station according to a first pattern;moving the first wafer from the first station to a second station; andapplying the second laser beam to the first wafer at the second station according to a second pattern.2. The method of claim 1 , wherein said applying the first and second laser beams includes ablating material from the first wafer in accordance with the first and second patterns claim 1 , respectively.3. The method of claim 1 , wherein said applying the first and second laser beams includes heating material from the first wafer in accordance with the first and second patterns claim 1 , respectively.4. The method of claim 1 , wherein said applying the first and second laser beams forms contact holes that expose a diffusion region of a solar cell being fabricated on the wafer claim 1 , and further comprising forming a metal contact into the contact holes to electrically connect to the diffusion region.5. The method of claim 1 , wherein said applying the second laser beam includes applying the second laser beam according to the second pattern that is a mirror image of the first pattern.6. The method of claim 1 , wherein said applying ...

APPARATUS AND METHOD FOR CUTTING MULTILAYER MATERIAL

An apparatus for cutting a multilayer material includes a splitter module and a uniaxial crystal element. The splitter module, located in a transmission path of an incident light beam, is used for splitting the incident light beam into a first polarized light beam and a second polarized light beam. The uniaxial crystal element is disposed adjacent to the splitter module and on a transmission path of the first polarized light beam and the second polarized light beam. The first polarized light beam and the second polarized light beam pass through the uniaxial crystal element individually by having the first polarized light beam and the second polarized light in correspondence to different index of refractions, so that two focuses with different focal lengths can be obtained. In addition, a method for cutting a multilayer material method is also provided. 1. An apparatus for cutting a multilayer material , comprising:a splitter module, located on a transmission path of an incident light beam, being to split the incident light beam into a first polarized light beam and a second polarized light beam; anda uniaxial crystal element, located close to the splitter module, having an optical axis perpendicular to a normal line of the uniaxial crystal element; wherein the uniaxial crystal element is located on both transmission paths of the first polarized light beam and the second polarized light beam, the first polarized light beam and the second polarized light beam pass through the uniaxial crystal element individually by having the first polarized light beam corresponding to a first refractive index and the second polarized light beam corresponding to a second refractive index different to the first refractive index, thus the first polarized light beam has a first focus, the second polarized light beam has a second focus, and a focal length of the first focus is different to that of the second focus.2. The apparatus for cutting a multilayer material of claim 1 , further ...

METHOD AND APPARATUS FOR MANUFACTURING FINNED TUBES

A method for producing ribbed pipes, in which a first pipe base body is ribbed on its outer side, in particular helically, with a first band, to which end the first band is secured to the first pipe base body using a first laser beam. While the first band is being secured to the first pipe base body using the first laser beam, a second pipe base body is ribbed on its outer side with a second band, to which end the second band is secured to the second pipe base body using a second laser beam, wherein the first and second laser beams come from the same laser source. 110-. (canceled)11. A method for producing ribbed pipes , comprising the steps of:ribbing and outer side of a first pipe base body with a first band, including securing the first band to the first pipe base body using a first laser beam;and, while the first band is being secured to the first pipe base body using the first laser beam, ribbing and outer side of a second pipe base body with a second band, including securing the second band to the second pipe base body using a second laser beam, wherein the first and second laser beams come from a common laser source.12. The method according to claim 11 , including helically ribbing the base bodies.13. The method according to claim 11 , including displacing or driving the pipe base bodies relative to the laser source and/or the laser beams.14. The method according to claim 13 , including displacing or driving the pipe base bodies linearly and/or substantially at a common speed.15. The method according to claim 13 , including stopping the pipe base bodies independently of one another to change band material.16. The method according to claim 11 , including arranging outlets for the two laser beams and/or the laser source substantially between the pipe base bodies.17. The method according to claim 16 , including arranging the outlets between holders associated with the pipe base bodies.18. The method according to claim 11 , including supplying the bands to the ...

BEAM DISTRIBUTOR

A rectilinear beam distributor capable of maintaining visibility of visible light emitted from a guide laser is provided. In a beam distributor, a beam direction changing unit has a dichroic property that the beam direction changing unit reflects an incident beam and transmits a visible light. A guide laser is disposed so as to move with movement of the beam direction changing unit in an optical axis direction of the incident beam when oscillating the visible light so that the visible light passes through the beam direction changing unit and the optical axis thereof is identical to a reflection beam. 1. A beam distributor comprising:a housing through which a beam passes;one or more beam incidence openings;one or more beam exiting openings;a beam direction changing unit that changes a direction of a beam incident into the housing from the beam incidence opening so that the beam is guided to the beam exiting opening;a first driving device that moves the beam direction changing unit in an optical axis direction of an incident beam;a position detection device that detects a position of the beam direction changing unit;a control device that controls the first driving device;a recording device that records position information of a position of the position detection device; anda guide laser that oscillates a visible light,the control device controlling the first driving device on the basis of a signal from the position detection device and moving the beam direction changing unit to a position corresponding to the position information recorded on the recording device in the optical axis direction of the incident beam so that the incident beam is reflected from the beam direction changing unit and a reflection beam is guided to the beam exiting opening, whereinthe beam direction changing unit has a dichroic property that the beam direction changing unit reflects the incident beam and transmits the visible light, andthe guide laser is disposed so as to move with movement of ...

3D PRINTING METHOD AND APPARATUS

A printing apparatus for printing a three-dimensional object, including an operative surface; a printing head comprising a frame attached pivotally to at least one control arm, wherein the frame is rotatable about an axis disposed at a point of attachment between the frame and control arm; a plurality of powder dispensers connected at a plurality of positions along the frame, the powder dispensers being configured to deposit multiple layers of powder onto the operative surface simultaneously when the printing head travels relative to the operative surface; and an energy source for emitting at least one energy beam onto at least one layer of powder. 1. A printing apparatus for printing a three-dimensional object , comprising:an operative surface;a printing head comprising a frame attached pivotally to at least one control arm, wherein the frame is rotatable about an axis disposed at a point of attachment between the frame and control arm;a plurality of powder dispensers connected at a plurality of positions along the frame, the powder dispensers being configured to deposit multiple layers of powder onto the operative surface simultaneously when the printing head travels relative to the operative surface; andan energy source for emitting at least one energy beam onto at least one layer of powder.2. The printing apparatus according to claim 1 , wherein the energy source emits energy beams onto two or more layers of powder simultaneously.3. The printing apparatus according to claim 1 , wherein the energy source emits an energy beam onto individual layers of powder in a sequence.4. The printing apparatus according to claim 3 , wherein the energy beam is applied to each powder layer for a sufficient period of time such that the powder is heated or energized causing it to melt or sinter before the energy beam is applied to the next layer in the plurality.5. The printing apparatus according to claim 3 , wherein the energy beam is applied to each powder layer for a ...

APPARATUSES AND METHODS FOR SYNCHRONOUS MULTI-LASER PROCESSING OF TRANSPARENT WORKPIECES

A method for laser processing a transparent workpiece includes focusing a pulsed laser beam output by a pulsed laser beam source into a pulsed laser beam focal line directed into the transparent workpiece, thereby forming a pulsed laser beam spot on the transparent workpiece and producing a defect within the transparent workpiece, directing an infrared laser beam output onto the transparent workpiece to form an annular infrared beam spot that circumscribes the pulsed laser beam spot at the imaging surface and heats the transparent workpiece. Further, the method includes translating the transparent workpiece and the pulsed laser beam focal line relative to each other along a separation path and translating the transparent workpiece and the annular infrared beam spot relative to each other along the separation path synchronous with the translation of the transparent workpiece and the pulsed laser beam focal line relative to each other. 1. A method for laser processing a transparent workpiece , the method comprising: the pulsed laser beam focal line generates an induced absorption within the transparent workpiece; and', 'the induced absorption produces a defect along the pulsed laser beam focal line within the transparent workpiece;, 'focusing a pulsed laser beam output by a pulsed laser beam source into a pulsed laser beam focal line oriented along a beam propagation direction and directed into the transparent workpiece, thereby forming a pulsed laser beam spot on an imaging surface of the transparent workpiece, wherein the infrared beam spot is spaced a spacing distance from the pulsed laser beam spot at the imaging surface; and', 'the infrared laser beam heats the transparent workpiece;, 'directing an infrared laser beam output by an infrared beam source onto the transparent workpiece such that the infrared laser beam forms an infrared beam spot on the imaging surface, whereintranslating the transparent workpiece and the pulsed laser beam focal line relative to each ...

DEPOSITION MASK MANUFACTURING METHOD AND MANUFACTURING APPARATUS THEREOF

A method of manufacturing a deposition mask includes: a splitting process in which a laser beam irradiated from a light source is split into a plurality of laser beams; a scanning process in which the plurality of laser beams are simultaneously scanned onto the mask substrate; and a tuning process in which irradiation states of the plurality of laser beams are finely changed to correspond to shapes of the plurality of pattern holes while the plurality of laser beams are scanned. 1. A method of manufacturing a deposition mask , the method comprising:disposing a mask substrate on a stage; andirradiating a laser beam onto the mask substrate to form a plurality of pattern holes, irradiating the laser beam from a light source;', 'splitting the irradiated laser beam into a plurality of laser beams;', 'scanning the plurality of laser beams simultaneously onto the mask substrate; and', 'tuning an irradiation state of the plurality of laser beams to correspond to shapes of the plurality of pattern holes while the plurality of laser beams are scanned., 'wherein irradiating the laser beam onto the mask substrate comprises2. The method of claim 1 , wherein the tuning comprises adjusting a movement path of the plurality of laser beams to allow the plurality laser beams to circle areas of the plurality of pattern holes.3. The method of claim 2 , wherein the tuning further comprises adjusting a number of irradiations of the laser beam within the areas of the plurality of pattern holes.4. The method of claim 2 , wherein the tuning further comprises adjusting a power of the laser beam within the areas of the plurality of pattern holes.5. The method of claim 1 , wherein the scanning is performed to gradually form the plurality of pattern holes by allowing the laser beam to pass an area of each of the plurality of pattern holes multiple times claim 1 , andthe tuning is performed to gradually decrease an area where the laser beam is irradiated within areas of the plurality of pattern ...

LASER CONDUCTION MODE WELDING OF ALUMINUM ALLOYS WITH CROSS DUAL LASER BEAMS

A method of laser welding aluminum alloy workpieces with dual laser beams arranged in a cross-beam orientation is disclosed. The method comprises directing dual laser beams, which include a first laser beam and a second laser beam, at and along a weld seam established between the aluminum alloy workpieces together with a filler wire. The first laser beam includes a first longitudinal axis and the second laser beam includes a second longitudinal axis. When arranged in the cross-beam orientation, a plane that intersects the first longitudinal axis and the second longitudinal axis of the first and second laser beams, respectively, forms a line where it meets the aluminum alloy workpieces that is oriented transverse to the weld seam. 1. A method of laser welding aluminum alloy workpieces , the method comprising:providing a first aluminum alloy workpiece and a second aluminum alloy workpiece that are brought together to form a weld seam;directing dual laser beams toward the weld seam established between the aluminum alloy workpieces, the dual laser beams comprising a first laser beam extending along a first longitudinal axis and a second laser beam extending along a second longitudinal axis, and wherein a plane that intersects the first and the second longitudinal axes of the first and second laser beams forms a line where the plane meets the first and second aluminum alloy workpieces that is transverse to the weld seam;moving the dual laser beams along the weld seam together with a filler wire without producing a keyhole that penetrates into the first and second aluminum alloy workpieces, the filler wire having a working end that tracks the weld seam and is impinged by both the first and second laser beams at the weld seam; andmelting the working end of the filler wire with the dual laser beams to deposit molten filler material along the weld seam as the dual laser beams and the filler wire are moved along the weld seam, the molten filler material solidifying behind the ...

Method of manufacturing display apparatus

A method of manufacturing a display apparatus includes forming a flexible substrate on a first surface of a carrier substrate, forming a display device on the flexible substrate, and ablating the carrier substrate by radiating a plurality of laser beams on a second surface of the carrier substrate, the second surface being opposite the first surface, such that the plurality of laser beams is incident on the second surface at different angles, passes through the carrier substrate, and is overlappingly focused on a first region of a boundary surface between the carrier substrate and the flexible substrate.

METHOD OF LASER IRRADIATION OF A PATTERNED SEMICONDUCTOR DEVICE

Disclosed is a method of laser irradiation of a patterned semiconductor device including a periodic array of sub-wavelength fin-like structures, all fin-like structures upstanding from a base face of the semiconductor device and defining an upper face of the periodic array opposite the base face, each fin-like structure having: a width along a first direction parallel to the base face of the order of magnitude or smaller than the laser wavelength; a length along a second direction parallel to the base face and perpendicular to the first direction at least 3 times greater than the width; and a height along a third direction perpendicular to the base face. The method includes: generating a UV pulsed laser beam using a laser module; and irradiating at least a portion of the upper face with the laser beam. 1. Method of laser irradiation of a patterned semiconductor device comprising a periodic array of sub-wavelength fin-like structures , all fin-like structures upstanding from a base face of said semiconductor device and defining an upper face of said periodic array opposite to said base face , each fin-like structure having:a width along a first direction parallel to said base face, said width being of the order of magnitude or smaller than the laser wavelength;a length along a second direction parallel to said base face and perpendicular to said first direction, said length being at least 3 times greater than said width; anda height along a third direction perpendicular to said base face,said method of laser irradiation comprising the steps of:generating a UV pulsed laser beam by means of a laser module;irradiating at least a portion of said upper face of the periodic array of fin-like structures with said laser beam,wherein the method further comprises imparting a controlled state of polarization to said laser beam so as to selectively control the amount of energy of the laser beam coupled locally to each fin-like structure along the third direction.2. The method of ...

LASER-PROCESSING HEAD AND LASER-PROCESSING MACHINE COMPRISING SAME

A laser processing head comprising a focusing device for focusing a processing laser beam onto a workpiece, the focusing device arranged in a processing beam path, an optical imaging device comprising a detector, wherein the optical imaging device is configured to image observation radiation from a processing region of the workpiece onto the detector along an observation beam path passing through the focusing device, a beam splitter for separating the observation beam path from the processing beam path of the processing laser beam, imaging optics arranged in the observation beam path between the beam splitter and the detector; and a stop arranged between the imaging optics and the detector, wherein the stop is spaced apart from the detector, and wherein the imaging optics is configured to produce an image of the stop in the processing beam path of the processing laser beam between the beam splitter and the workpiece. 1. A laser processing head comprising:a focusing device for focusing a processing laser beam onto a workpiece to be machined, wherein the focusing device is arranged in a processing beam path of the processing laser beam;an optical imaging device comprising a detector, wherein the optical imaging device is configured to image observation radiation from a processing region of the workpiece onto the detector along an observation beam path passing through the focusing device;a beam splitter for separating the observation beam path from the processing beam path;an imaging optics arranged in the observation beam path between the beam splitter and the detector; anda stop arranged between the imaging optics and the detector, wherein the stop is spaced apart from the detector, and wherein the imaging optics is configured to produce an image of the stop in the processing beam path of the processing laser beam between the beam splitter and the workpiece.2. The laser processing head of claim 1 , wherein the imaging optics is configured to produce the image of the ...

LASER MACHINING DEVICE AND LASER MACHINING METHOD

A laser processing device includes: a laser light source; a converging optical system; and a reflective spatial light modulator modulating the laser light such that the laser light is caused to branch into at least first processing light and second processing light, and the first processing light is converged at a first converging point and the second processing light is converged at a second converging point. In a case in which W is a radius of the first processing light at a front face of the object, W is a radius of the second processing light at the front face, and D is a distance between the first converging point and the second converging point when viewed from a direction orthogonal to the front face, the reflective spatial light modulator modulates the laser light such that D>W+W is satisfied. 1. A laser processing device for converging laser light at an object to be processed so as to form a modified region within the object along a line to cut , the laser processing device comprising:a laser light source emitting the laser light;a converging optical system converging the laser light emitted from the laser light source at the object; anda spatial light modulator modulating the laser light emitted from the laser light source such that the laser light is caused to branch into at least first processing light and second processing light, and the first processing light is converged at a first converging point and the second processing light is converged at a second converging point by the converging optical system, whereinthe first converging point and the second converging point have a positional relationship in which the first converging point is positioned at a first surface side as an opposite side to the laser light entrance side of the object with respect to the second converging point, and the first converging point is positioned at an anterior side in a relative moving direction of the laser light along the line with respect to the second converging ...

PARALLEL DIRECT METAL LASER MELTING

A method of creating an article of manufacture is provided, which includes directing multiple laser beams to a single galvanometer; and dynamically repositioning the multiple laser beams in counterpart paths using the single galvanometer to shine the multiple laser beams on and melt a first powder material and, upon solidification of the melted first powder material, forming a first series of duplicate three dimensional structures, where each of the multiple laser beams is used to form at least one of the first series of duplicate three dimensional structures. 1. A method of creating an article of manufacture , the method comprising:(a) directing multiple laser beams to a single galvanometer;(b) controlling the single galvanometer to concurrently and proportionally reposition each of the laser beams to a different location within a container housing a first powder material to melt at least a portion of the first powder material;(c) applying additional first powder material to a location where the first powder material was previously melted;(d) controlling the single galvanometer to concurrently and proportionally reposition each of the laser beams to a different location within the container housing the additional first powder material to melt at least a portion of the additional first powder material; and(e) repeating steps (c) and (d) sequentially to form multiple three dimensional objects.2. The method of claim 1 , wherein the act of directing multiple laser beams to the single galvanometer includes splitting a primary laser beam into the multiple laser beams.3. The method of claim 2 , wherein the act of splitting of the primary laser beam includes creating the multiple laser beams each having the same power.4. The method of claim 1 , wherein the primary laser beam comprises a 1000 Watt or greater laser beam.5. The method of claim 1 , wherein a solid state laser is utilized to generate the multiple laser beams.6. The method of claim 5 , wherein the multiple laser ...

LASER DRILLING OF METAL FOILS FOR ASSEMBLY IN AN ELECTROLYTIC CAPACITOR

A capacitor and methods of processing an anode metal foil are presented. The capacitor includes a housing, one or more anodes disposed within the housing, one or more cathodes disposed within the housing, one or more separators disposed between an adjacent anode and cathode, and an electrolyte disposed around the one or more anodes, one or more cathodes, and one or more separators within the housing. The one or more anodes each include a metal foil that includes a first plurality of tunnels through a thickness of the metal foil in a first ordered arrangement, the first ordered arrangement being a close packed hexagonal array arrangement, and having a first diameter, and a second plurality of tunnels through the thickness of the metal foil having a second ordered arrangement and a second diameter greater than the first diameter. 1. An electrolytic capacitor , comprising:a housing;one or more anodes disposed within the housing, wherein at least one of the anodes comprises a metal foil that includes a first plurality of tunnels through a thickness of the metal foil in a first ordered close packed hexagonal array arrangement and each having a first diameter, and a second plurality of tunnels through the thickness of the metal foil having a second ordered arrangement and each having a second diameter greater than the first diameter;one or more cathodes disposed within the housing;one or more separators disposed between an adjacent anode and cathode; andan electrolyte disposed around the one or more anodes, one or more cathodes, and one or more separators within the housing.2. The electrolytic capacitor of claim 1 , wherein each of the one or more anodes comprises an aluminum foil.3. The electrolytic capacitor of claim 2 , wherein the first plurality of tunnels through the aluminum foil each have a diameter between 1 micron and 3 microns claim 2 , and the second plurality of tunnels through the aluminum foil each have a diameter between 5 microns and 10 microns.4. The ...

METHOD AND ARRANGEMENT FOR GENERATING A LASER BEAM HAVING A DIFFERING BEAM PROFILE CHARACTERISTIC BY A MULTI-CLAD FIBER

Methods and systems for generating a laser beam with different beam profile characteristics are provided. In one aspect, a method includes coupling an input laser beam into one fiber end of a multi-clad fiber, in particular a double-clad fiber and emitting an output laser beam from the other fiber end of the multi-clad fiber. To generate different beam profile characteristics of the output laser beam, the input laser beam is electively coupled either at least into the inner fiber core of the multi-clad fiber or at least into at least one outer ring core of the multi-clad fiber, or a first sub-beam of the input laser beam is coupled into at least into the inner fiber core of the multi-clad fiber and a second, different sub-beam of the input laser beam is coupled at least into the at least one outer ring core of the multi-clad fiber. 1. A method of generating a laser beam with different beam profile characteristics , comprising: coupling the input laser beam at least into an inner fiber core of the multi-clad fiber, and', 'coupling the input laser beam at least into at least one outer ring core of the multi-clad fiber; and, 'coupling an input laser beam into a first fiber end of a multi-clad fiber, wherein the coupling comprises electively one of'}emitting an output laser beam from a second fiber end of the multi-clad fiber.2. The method of claim 1 , wherein coupling the input laser beam into the first fiber end of the multi-clad fiber comprises:relatively moving the input laser beam and a coupling-side face of the multi-clad fiber in a direction transverse to the input laser beam.3. The method of claim 1 , wherein coupling the input laser beam into the first fiber end of the multi-clad fiber comprises:projecting the input laser beam with respectively different beam cross-sections onto a coupling-side face of the multi-clad fiber, wherein the different beam cross-sections of the input laser beam comprise respectively different beam diameters.4. (canceled)5. (canceled) ...

APPARATUS AND METHOD FOR FABRICATING PERIODIC MICRO-PATTERN BY LASER BEAMS

The invention provides an apparatus for fabricating a periodic micro-pattern by laser beams. The apparatus includes an ultrafast laser light source configured to generate an output laser beam. A diffraction optical element is configured to divide the output laser beam into a plurality of diffractive laser beams. A confocal system is configured to focus the plurality of diffractive laser beams on a focal point, so that the plurality of diffractive laser beams produces an interference light beam with interference phenomena. The interference light beam ablates a surface of an element to fabricate a periodic micro-pattern on the surface of the element. The confocal system includes a first lens, a second lens and a light shielding mask. The plurality of diffractive laser beams passes through the first lens, the light shielding mask and the second lens in sequence. 1. An apparatus for fabricating a periodic micro-pattern by laser beam , comprising:an ultrafast laser light source configured to generate an output laser beam;a diffraction optical element configured to divide the output laser beam into a plurality of diffractive laser beams; and a first lens configured for the plurality of diffractive laser beams being incident thereto to produce a plurality of first collimated laser beams;', 'a light shielding mask having a plurality of holes, configured for the plurality of first collimated laser beams being incident thereto to produce a plurality of second collimated laser beams; and', 'a second lens configured to focus the plurality of second collimated laser beams to a focal point of the second lens,', 'wherein the first lens, the second lens and the light shielding mask are arranged along an optical axis of the output laser beam, and the light shielding mask is disposed between the first lens and the second lens, so that the plurality of diffractive laser beams passes through the first lens, the light shielding mask and the second lens in sequence., 'a confocal system ...

LASER FIBER ARRAY FOR SINGULATING SEMICONDUCTOR WAFERS

An apparatus for cutting a substrate comprises first and second lasers, and first and second optical fibers each having an input end and an output end opposite to the input end, wherein the input ends of the first and second optical fibers are connected to the first and second lasers respectively. The output ends of the first and second optical fibers are movable relative to the substrate and are configured to image first and second laser beams onto the substrate simultaneously for cutting the substrate. 1. An apparatus for cutting a substrate , the apparatus comprising:first and second lasers: andfirst and second optical fibers, each having an input end and an output end opposite to the input end, the input ends of the first and second optical fibers being connected to the first and second lasers respectively;wherein the output ends of the first and second optical fibers are movable relative to the substrate and are configured to image first and second laser beams onto the substrate simultaneously for cutting the substrate.2. The apparatus as claimed in claim 1 , further comprising a controller system which is operative to selectively activate or deactivate each laser such that operation of one laser is independent from the other laser3. The apparatus as claimed in claim 2 , wherein the controller system includes a separate laser controller coupled to each laser for controlling operating parameters used with the operation of the lasers independently of each other.4. The apparatus as claimed in claim 1 , wherein the laser beam output from the first and second lasers are merged and focused onto different points on the substrate at the same time via a lens assembly.5. The apparatus as claimed in claim 1 , wherein the first laser generates a laser beam of a different wavelength or at a different frequency from that generated by the second laser.6. The apparatus as claimed in claim 5 , wherein the first laser is an infrared laser and the second laser is an ultraviolet ...