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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 72740. Отображено 100.
05-01-2012 дата публикации

High-temperature activation process

Номер: US20120000247A1
Автор: Daniel Burgard, James Hinkle, Joshua Conley, Stephen Murphy, Thomas Truman
Принадлежит: Individual

A method for processing a coated glass substrate may include a high-temperature activation process.

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Номер записи: 1
05-01-2012 дата публикации

Hybrid laser arc welding process and apparatus

Номер: US20120000892A1
Автор: Daniel Anthony Nowak, Paul Stephen Dimascio
Принадлежит: General Electric Co

A welding method and apparatus for welding workpieces together by conducting a laser beam welding process on a joint region that includes a weld seam defined by and between faying surfaces of the workpieces, and then conducting a hybrid laser arc welding process on the joint region. The laser beam welding process entails causing a first laser beam to travel along the joint region, penetrate the weld seam and form a weldment. The hybrid laser arc welding process remelts the weldment by simultaneously causing an electric arc and a second laser beam to overlap and travel along the joint region and form a weld pool in the weldment. On cooling, a weld joint is formed within the joint region and its weld seam.

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Номер записи: 2
11-03-2020 дата публикации

Подводная лазерная режущая насадка

Номер: RU0000196666U1
Автор: Александр Григорьевич Красюков, Александр Дмитриевич Белых, Борис Васильевич Мартынов, Дмитрий Дмитриевич Метляев, Роман Евгеньевич Романов, Сергей Сергеевич Балабанов
Принадлежит: Акционерное общество "Государственный научный центр Российской Федерации Троицкий институт инновационных и термоядерных исследований" (АО "ГНЦ РФ ТРИНИТИ")

Полезная модель относится к области резки металлов под водой и может быть использована для подводных работ по разделительной резке металлоконструкций при ведении ремонтно-восстановительных работ и утилизации морских нефтедобывающих платформ после прекращения их эксплуатации. Устройство содержит газовую камеру, цилиндрический канал для подвода лазерного излучения и режущего газа и присоединенный к газовой камере трубопровод для подачи защитного газа, цилиндрический канал для подвода лазерного излучения и режущего газа установлен соосно с продольной осью газовой камеры. Технический результат - упрощение конструкции. Достигается тем, что трубопровод для подачи защитного газа присоединен к газовой камере так, что ось трубопровода для подачи защитного газа перпендикулярна оси газовой камеры, но с ней не пересекается. 1 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 196 666 U1 (51) МПК B23K 26/38 (2014.01) B23K 26/14 (2014.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК B23K 26/38 (2020.01); B23K 26/14 (2020.01) (21)(22) Заявка: 2019127321, 29.08.2019 (24) Дата начала отсчета срока действия патента: Дата регистрации: 11.03.2020 (73) Патентообладатель(и): Акционерное общество "Государственный научный центр Российской Федерации Троицкий институт инновационных и термоядерных исследований" (АО "ГНЦ РФ ТРИНИТИ") (RU) (45) Опубликовано: 11.03.2020 Бюл. № 8 Адрес для переписки: 108840, Москва, г. Троицк, ул. Пушковых, владение 12, АО "ГНЦ РФ ТРИНИТИ", Генеральному директору Д.В. Маркову U 1 1 9 6 6 6 6 R U (54) ПОДВОДНАЯ ЛАЗЕРНАЯ РЕЖУЩАЯ НАСАДКА (57) Реферат: Полезная модель относится к области резки для подачи защитного газа, цилиндрический металлов под водой и может быть использована канал для подвода лазерного излучения и для подводных работ по разделительной резке режущего газа установлен соосно с продольной металлоконструкций при ведении ремонтноосью газовой камеры. Технический результат восстановительных работ и ...

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Номер записи: 3
02-04-2021 дата публикации

Станок лазерной резки с защитой от излучения непосредственно в зоне реза

Номер: RU0000203405U1
Автор: Игорь Юрьевич Муковнин
Принадлежит: Общество с ограниченной ответственностью "СПЕЦВЕНТРЕШЕНИЕ"

Полезная модель относится к станку для лазерной резки с защитой от излучения непосредственно в зоне реза. Станок содержит станину (1) на опорных ножках, рабочий стол (2), продольные (3) и поперечные (4) направляющие, ролики (5), траверсу (6), раму (7), внешний защитный кожух (8), лазерную головку (9) с механизмом (10) ее перемещения и внутренний защитный кожух (11). Рабочий стол (2) закреплен на станине (1). К рабочему столу (2) при помощи роликов (5), расположенных на продольных направляющих (3), закреплена траверса (6). Рама (7) расположена над рабочим столом (2). Сверху рамы (7) расположен внешний защитный кожух (8) с дверцами и смотровыми окнами. Внутри внешнего защитного кожуха (8) расположена головка (9) для лазерной резки с механизмом ее перемещения (10). Внутренний защитный кожух (11) для защиты непосредственно в зоне реза жестко прикреплен к соплу (12) лазерной головки и охватывает ее по всему периметру. 9 з.п. ф-лы, 3 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 203 405 U1 (51) МПК B23K 26/38 (2014.01) B23K 26/70 (2014.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК B23K 26/38 (2020.08); B23K 26/70 (2020.08) (21)(22) Заявка: 2020138268, 20.11.2020 (24) Дата начала отсчета срока действия патента: (73) Патентообладатель(и): Общество с ограниченной ответственностью "СПЕЦВЕНТРЕШЕНИЕ" (RU) Дата регистрации: 02.04.2021 (45) Опубликовано: 02.04.2021 Бюл. № 10 2 0 3 4 0 5 R U (54) СТАНОК ЛАЗЕРНОЙ РЕЗКИ С ЗАЩИТОЙ ОТ ИЗЛУЧЕНИЯ НЕПОСРЕДСТВЕННО В ЗОНЕ РЕЗА (57) Реферат: Полезная модель относится к станку для направляющих (3), закреплена траверса (6). Рама лазерной резки с защитой от излучения (7) расположена над рабочим столом (2). Сверху непосредственно в зоне реза. Станок содержит рамы (7) расположен внешний защитный кожух станину (1) на опорных ножках, рабочий стол (2), (8) с дверцами и смотровыми окнами. Внутри продольные (3) и поперечные (4) направляющие, внешнего защитного кожуха (8) расположена ролики (5), ...

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Номер записи: 4
28-10-2021 дата публикации

Станок лазерной резки с доступом в рабочую зону

Номер: RU0000207442U1
Автор: Игорь Юрьевич Муковнин
Принадлежит: Общество с ограниченной ответственностью "СПЕЦВЕНТРЕШЕНИЕ"

Полезная модель относится к станкам для лазерной резки материала с доступом в рабочую зону. Станок содержит станину, рабочий стол, продольные и поперечные направляющие, ролики, траверсу, раму, защитный кожух, головку лазерной резки и механизм перемещения головки лазерной резки. Рабочий стол закрепляется на станине. К рабочему столу при помощи роликов на продольных направляющих закреплена траверса. Рама расположена над рабочим столом, прикрыта защитным кожухом с дверцами и смотровыми окнами. Головка лазерной резки с механизмом его перемещения установлена на поперечной направляющей непосредственно внутри защитного кожуха. Дверцы закреплены в верхней части кожуха при помощи петель и состоят из двух частей, расположенных под прямым углом друг к другу и объединяемых при помощи петель. Технический результат состоит в обеспечении повышенной надежности конструкции. 8 з.п. ф-лы, 2 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 207 442 U1 (51) МПК B23K 26/38 (2014.01) B23K 26/70 (2014.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК B23K 26/38 (2021.05); B23K 26/70 (2021.05) (21)(22) Заявка: 2020138270, 20.11.2020 (24) Дата начала отсчета срока действия патента: (73) Патентообладатель(и): Общество с ограниченной ответственностью "СПЕЦВЕНТРЕШЕНИЕ" (RU) Дата регистрации: 28.10.2021 (45) Опубликовано: 28.10.2021 Бюл. № 31 2 0 7 4 4 2 R U (54) СТАНОК ЛАЗЕРНОЙ РЕЗКИ С ДОСТУПОМ В РАБОЧУЮ ЗОНУ (57) Реферат: Полезная модель относится к станкам для смотровыми окнами. Головка лазерной резки с лазерной резки материала с доступом в рабочую механизмом его перемещения установлена на зону. Станок содержит станину, рабочий стол, поперечной направляющей непосредственно продольные и поперечные направляющие, внутри защитного кожуха. Дверцы закреплены ролики, траверсу, раму, защитный кожух, головку в верхней части кожуха при помощи петель и лазерной резки и механизм перемещения головки состоят из двух частей, расположенных под лазерной резки. ...

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Номер записи: 5
19-01-2012 дата публикации

Method for Cutting C-Mn Steel with a Fiber Laser

Номер: US20120012570A1
Автор: Francis Briand, Hakim Maazaoui, Karim Chouf
Принадлежит: La Soudure Autogene Francaise, LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude

The invention relates to a laser cutting method for cutting a C—Mn steel workpiece, characterized in that laser beam generation means comprising at least one silica fiber with an ytterbium-doped core is used to generate the laser beam. Preferably, the ytterbium-based fiber has a wavelength between 1.07 and 1.1 μ m, preferably 1.07 μ m, the quality factor of the laser beam is between 0.33 and 8 mm.mrad, and the laser beam has a power of between 0.1 and 25 kW. The assistance gas for the laser beam is chosen from nitrogen, helium, argon, oxygen, CO 2 and mixtures thereof, and, optionally, it further contains one or more additional compounds chosen from H 2 and CH 4 .

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Номер записи: 6
19-01-2012 дата публикации

Automated beam marker

Номер: US20120013661A1
Автор: James M. Smelser
Принадлежит: Individual

A beam marking system is disclosed for marking on beams with a marking device. The beam marking system includes a beam marking device configured to mark on the surface of a beam. A movable arm is coupled to the marking device. The movable arm has at least three movable components that collectively move the beam marking device along or about at least three axes. A controller is in electronic communication with the movable arm and the marking device. The controller controlling the movement of the at least three movable components of the movable arm and controlling the operation of the marking device. In some instances, the beam marking system can automatically mark beams, such as metal beams used in heavy construction projects in a rapid and accurate manner.

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Номер записи: 7
19-01-2012 дата публикации

Laser marking method

Номер: US20120013699A1
Автор: Hiroyasu Ueta, Minoru Inuzuka, Yutaka Tsujimoto
Принадлежит: Nidek Co Ltd, Shikibo Ltd, Shizuoka Prefecture

This invention provides a laser marking method that can form a very minute mark of a predetermined shape, such as a letter or pattern, with clarity and high solidity, on the surface of a substrate. The laser marking method of the invention comprises the steps of (1) depositing a coloring material on the surface of a substrate of thermoplastic material to form a thin film of the coloring material, and (2) applying a laser beam to the thin film of the coloring material in conformity with a predetermined marking shape to cause the portions of the substrate irradiated with the laser beam to soften and to cause the thus softened portions to mix with the coloring material, thereby developing the predetermined marking shape on the surface of the substrate.

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Номер записи: 8
26-01-2012 дата публикации

Connector, method of manufacturing the connector and apparatus for manufacturing the connector

Номер: US20120021649A1
Автор: Fumio Ishibashi, Hiroshi Akimoto, Takahiro Yamaji, Takushi Yoshida, Yuko Motojima
Принадлежит: Japan Aviation Electronics Industry Ltd

A connector comprises a base insulator, a plurality of elongated plate shaped contacts arranged on the base insulator, and a cover insulator arranged to hold the contacts in cooperation with the base insulator and welded to the base insulator, the base insulator is provided with a pair of openings arranged to face each other across each of holders and to intersect with the direction in which the holders are arranged.

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Номер записи: 9
02-02-2012 дата публикации

Method to dice back-contact solar cells

Номер: US20120025837A1
Автор: Douglas H. Rose, Karen Elizabeth Wilson, Zachary Kinyon
Принадлежит: SunPower Corp

A method of processing of solar cells includes determining that a back-contact solar cell is defective. The back-contact solar cell includes a first plurality of interconnect pads at a first edge thereof, and a second plurality of interconnect pads at a second, opposed thereof, the first and second pluralities of interconnect pads having opposite operational charges. The back-contact solar cell is then diced to define at least first and second back-contact solar cell sections. The first back-contact solar cell section has at least two interconnect pads, of the plurality of interconnect pads, at respective opposed edges thereof.

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Номер записи: 10
02-02-2012 дата публикации

Methods of temporally varying the laser intensity during scribing a photovoltaic device

Номер: US20120028404A1
Автор: Jonathan Mack Frey
Принадлежит: Primestar Solar Inc

Methods for laser scribing a film stack including a plurality of thin film layers on a substrate are provided. A pulse of a laser beam is applied to the film stack, where the laser beam has a power that varies as a function of time during the pulse according to a predetermined power cycle. For example, the pulse can have a pulse lasting about 0.1 nanoseconds to about 500 nanoseconds. This pulse of the laser beam can be repeated across the film stack to form a scribe line through at least one of the thin film layers on the substrate. Such methods are particularly useful in laser scribing a cadmium telluride thin-film based photovoltaic device.

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Номер записи: 11
09-02-2012 дата публикации

Low deflection bi-metal rotor seals

Номер: US20120032404A1
Автор: David C. Seib, Mark Joseph Kuzdzal
Принадлежит: Dresser Rand Co

A seal assembly for use in a turbomachine is provided. The seal assembly has an annular division wall with outside and inside surfaces, a carrier ring disposed adjacent the inside surface of the annular division wall, and a sealing substrate metallurgically-bonded to an inner-most surface of the carrier ring. The sealing substrate is machined to form a seal surface that can be disposed proximate a rotor and maintained substantially parallel thereto during operation of the turbomachine.

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Номер записи: 12
16-02-2012 дата публикации

Polymer tubing laser micromachining

Номер: US20120037609A1
Автор: David Gaudiosi, Gordon Masor, Michael Greenberg, Michael Mielke, Tim Booth
Принадлежит: Individual

An apparatus for athermal ablation of a workpiece. The apparatus may include a laser device to direct a laser beam at the workpiece to remove a plurality of sections from the workpiece by athermal ablation. The removal may occur in a plurality of discrete motions that cause the laser beam to trace along outer perimeters of the sections in a specific order maintaining mechanical stability of the plurality of sections. The apparatus may further include a process gas nozzle to deliver process gas coaxially with the laser beam to clear debris and cool the workpiece, and a workpiece holder to hold and maneuver the workpiece during the removal of the plurality of sections.

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Номер записи: 13
23-02-2012 дата публикации

Packaging Integrated Circuits

Номер: US20120043650A1
Автор: Liang Kng Ian Koh, Richard Mangapul Sinaga
Принадлежит: INFINEON TECHNOLOGIES AG

An integrated circuit 15 is placed onto a lead frame 101 having lead fingers 109 of substantially constant thickness along their length. Wires are formed from the lead fingers 109 to corresponding electrical contacts the integrated circuit. Following the wire bonding process, the thickness of the tips of the lead fingers 109 is reduced by a laser process, to form tips of reduced thickness desirable for a subsequent moulding operation. Thus, at the time of the wire bonding the tips of the fingers 109 need not have a gap beneath them, so that more secure wire bonds to the lead fingers 109 can be formed.

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Номер записи: 14
01-03-2012 дата публикации

Buffer Layer to Enhance Photo and/or Laser Sintering

Номер: US20120049384A1
Автор: Mohshi Yang, Peter B. Laxton, Zvi Yaniv
Принадлежит: Ishihara Chemical Co Ltd

Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned metal layer and the substrate. Vias are formed through the layer of material having the low thermal conductivity thereby exposing portions of the patterned metal layer. A film of conductive ink is then coated over the layer of material having the low thermal conductivity and into the vias to thereby coat the portions of the patterned metal layer, and then sintered. The film of conductive ink coated over the portion of the patterned metal layer does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.

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Номер записи: 15
15-03-2012 дата публикации

Weldable Metal Article

Номер: US20120064367A1
Автор: Andrew Norman, Sabine Spangel
Принадлежит: Individual

The invention relates to an extruded or rolled clad metal article having a core metal layer and a cladding metal layer on at least one surface of the core layer, wherein the metals of the core metal layer and the cladding metal layer are each aluminium alloys, preferably an aluminium-magnesium alloy, having at least Sc in a range of 0.05% to 1%, and wherein the Sc-content in the core metal layer is lower than in the cladding metal layer. This further relates to a welded structure incorporating such a metal article.

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Номер записи: 16
22-03-2012 дата публикации

Defect correcting apparatus and defect correcting method

Номер: US20120071056A1
Автор: Akiko Oka, Gaku Izumi, Tomoaki Honda
Принадлежит: Sony Corp

The present disclosure provides a defect correcting apparatus including a defect detecting device configured to detect a defect within a repetitive pattern in a multilayer substrate a defect correcting device configured to correct the defect in the multilayer substrate by a specified defect correcting method, and a control device configured to, when the defect detected by the defect detecting device is detected overlapping a region in which occurrence of an interlayer short-circuit defect is assumed, generate an object corresponding to the defect correcting method for the interlayer short-circuit defect, and controlling the defect correcting device for correcting the defect using the generated object.

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Номер записи: 17
29-03-2012 дата публикации

Tubular beam with single center leg

Номер: US20120074720A1
Автор: Brian Malkowski, Brian Oxley, Daniel Gatti, Doug Witte, Ed Pendergrass, Kannan Ramamoorthy, Thomas Johnson
Принадлежит: Shape Corp

A reinforcement beam for a vehicle bumper system comprises a single sheet deformed to define first and second tubes sharing a common single center wall. A channel rib is formed on each tubes and a crevice rib over the center leg forms a third rib. Edges of the sheet are deformed to a radius so that their surface consistently engages an associated radiused corner formed on ends of the center leg, which facilitates consistent abutting line engagement of material surfaces, and thus facilitates consistent welding. In a preferred beam, front wall sections of each tube are coplanar and form a face of the beam, with each channel rib and crevice rib providing added stiffness to the beam, and yet nothing extends forward of the coplanar front wall sections. Related apparatus and methods are also disclosed.

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Номер записи: 18
05-04-2012 дата публикации

Beam guiding bellows for laser cutting machine, and method of manufacturing beam guiding bellows for laser cutting machine

Номер: US20120081808A1
Автор: Norio Nagai, Yoshio Nishida
Принадлежит: Individual

Disclosed are a novel beam guiding bellows for laser cutting machine, and a method of manufacturing the beam guiding bellows for laser cutting machine, which no longer need a process of placing any special plates such as reflective plates, therefore enabling manufacturing in a shorter time at low costs. The beam guiding bellows is configured by a plurality of stacked sheet bodies integrally folded so as to alternately form hill sections and valley sections, and is thereby made freely expandable and retractable in the overall length as angles of the hill sections and valley sections vary, wherein the inner sheet body disposed innermostly is composed of a material capable of protecting the inner sheet body by absorbing or reflecting the laser light having been scattered or reversed, or having, formed on the inner surface thereof, a protective layer composed of a material capable of protecting the inner sheet body by absorbing or reflecting the laser light, and the inner sheet body has protruding flaps which are formed, automatically in the process of folding it together with the other sheet bodies to thereby form the hill sections and the valley sections alternately, so as to project further inwardly from the apexes of the valley sections.

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Номер записи: 19
12-04-2012 дата публикации

Method of detecting pattern formed on non-exposed surface of workpiece

Номер: US20120086797A1
Автор: Kenji Furuta
Принадлежит: Disco Corp

A method of detecting an object of detection formed in the inside of or on a non-exposed surface of a workpiece having a rugged exposed surface, the detection being made on the exposed surface side of the workpiece by use of an imaging unit. The detecting method includes: a flattening step of coating the exposed surface of the workpiece with a liquid resin transmissive to the wavelength of light to be detected by the imaging unit so as to flatten the exposed surface of the workpiece; and a detecting step of detecting the object of detection formed in the inside of or on the non-exposed surface of the workpiece by use of the imaging unit on the exposed surface side of the workpiece coated with the liquid resin, after the flattening step.

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Номер записи: 20
19-04-2012 дата публикации

Cutting Tool

Номер: US20120090183A1
Автор: Campbell Wallace, Ken Nelson, Manjit Lall, Stephen Cadden, Steve Chatters
Принадлежит: BPB Ltd

There is provided a cutting tool ( 100 ) which is capable of performing cutting operations on a variety of materials such as, for example, plasterboard, glass, wood, laminated wood, cardboard, Perspex (Trade Mark), tiles, plastics or the like. The cutting tool ( 100 ) comprises an upper and lower part ( 102,104 ), said upper and lower parts ( 102,104 ) being separated by spacing means which are preferably retractable, the upper and lower parts ( 102,104 ) comprising at least one cutting device ( 116 ), and wherein the upper and lower parts ( 102,104 ) are held together with magnetic attraction.

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Номер записи: 21
19-04-2012 дата публикации

Niobium based superconducting radio frequency(scrf) cavities comprising niobium components joined by laser welding, method and apparatus for manufacturing such cavities

Номер: US20120094839A1
Автор: Brahma Nand Upadhyay, Chandrakant Pithawa, Pradeep Kumar Kush, Prashant Khare, Purushottam Das Gupta, Sindhunil Barman Roy, Vinod Chandra Sahni
Принадлежит: India Atomic Energy Department of

Niobium or its alloy based Superconducting Radio Frequency (SCRF) Cavities involving atleast one laser beam welded components in the SCRF cavity welded from inside surface of the wall of cavity directed to achieving more than half the thickness to full depth penetration with minimum HAZ, minimizing distortion and shrinkage. The method ensures improved weld quality and surface finish substantially free of any weld defects. Also disclosed is the welding nozzle system and welding rigs adapted to facilitate such laser welding of the Niobium or its alloy based Superconducting Radio Frequency (SCRF) Cavities. The invention is thus directed to enhancing productivity, ensuring consistent quality and reliability, enhanced weld penetration with minimum HAZ, smooth finish of weld joints at possible reduced costs.

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Номер записи: 22
03-05-2012 дата публикации

Substrate with shaped cooling holes and methods of manufacture

Номер: US20120102959A1
Автор: John Howard Starkweather
Принадлежит: General Electric Co

A substrate having one or more shaped effusion cooling holes formed therein. Each shaped cooling hole has a bore angled relative to an exit surface of the combustor liner. One end of the bore is an inlet formed in an inlet surface of the combustor liner. The other end of the bore is an outlet formed in the exit surface of the combustor liner. The outlet has a shaped portion that expands in only one dimension. Also methods for making the shaped cooling holes.

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Номер записи: 23
24-05-2012 дата публикации

Multilayered printed circuit board and manufacturing method thereof

Номер: US20120125680A1
Автор: Atsushi Shouda, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada, Kouji Asano, Kouta Noda, Naohiro Hirose, Naoto Ishida
Принадлежит: Ibiden Co Ltd

An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22 , the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20 a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.

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Номер записи: 24
31-05-2012 дата публикации

Laser processing method

Номер: US20120131958A1
Автор: Hideki Shimoi, Keisuke Araki
Принадлежит: Hamamatsu Photonics KK

A laser processing method of converging a laser light into an object to be processed made of glass so as to form a modified region and etching the object along the modified region so as to form a through hole in the object comprises a browning step of discoloring at least a part of the object by browning; a laser light converging step of forming the modified region in the discolored part of the object by converging the laser light into the object after the browning step; and an etching step of etching the object after the laser light converging step so as to advance the etching selectively along the modified region and form the through hole.

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Номер записи: 25
31-05-2012 дата публикации

Cleaving apparatus for a band-like glass film and cleaving method for a band-like glass film

Номер: US20120131962A1
Автор: Hiroki Mori, Hiroshi Adachi, Kaoru Mitsugi, Naohiro IKAI
Принадлежит: Nippon Electric Glass Co Ltd

A cleaving apparatus holds at least one surface (effective surface) of a band-like glass film in a non-contact state to suppress a situation that wavy portions reach a region in which the band-like glass film is to be cleaved. The cleaving apparatus cleaves the band-like glass film, which is being conveyed in a longitudinal direction thereof, along a conveyance direction thereof using a thermal stress generated through localized heating and cooling of a heated region. The localized heating and the cooling is performed on a preset cleaving line extending along the conveyance direction of the band-like glass film. The cleaving apparatus includes an air knife for supplying air to a front surface of the band-like glass film to retain the film on a conveyor at a position on an upstream side of a cleaving region in the conveyance direction.

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Номер записи: 26
31-05-2012 дата публикации

Orthogonal integrated cleaving device

Номер: US20120132628A1
Автор: Mark T. Kosmowski, Mehmet E. Alpay
Принадлежит: Electro Scientific Industries Inc

An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.

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Номер записи: 27
14-06-2012 дата публикации

Laser processing system and overlay welding method

Номер: US20120145683A1
Автор: Hirotsugu Kawanaka, Masanori Miyagi, Takeshi Tsukamoto
Принадлежит: HITACHI LTD

A laser processing system includes a laser processing head, a powder supply device, and a controller. The powder supply device supplies powder to the laser processing head. The laser processing head includes: a laser emission unit which irradiates a workpiece with laser light; and a powder supply unit which receives the powder supplied from a powder supply device to the laser processing head, and can supply the powder to a laser spot on the workpiece. The powder supply unit includes: a powder discharge unit which can discharge the powder toward the laser spot on the workpiece; and a powder-supply control mechanism which controls the amount of the powder to be supplied to the powder discharge unit, by distributing to the powder discharge unit at least a part of a flow of the powder supplied from the powder supply device. The controller controls the distributing by the powder-supply control mechanism.

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Номер записи: 28
14-06-2012 дата публикации

On-The-Fly Manipulation Of Spot Size And Cutting Speed For Real-Time Control Of Trench Depth And Width In Laser Operations

Номер: US20120145686A1
Автор: Brian Johansen, David Childers, Mehmet E. Alpay
Принадлежит: Electro Scientific Industries Inc

Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.

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Номер записи: 29
28-06-2012 дата публикации

Cutting/polishing tool and manufacturing method thereof

Номер: US20120164927A1
Автор: Jeong-Hun Suh
Принадлежит: INSSTEK Inc, Shinhan Diamond Ind Co Ltd

There are provided a cutting/polishing tool that may be readily manufactured and have an improved cutting performance, and a manufacturing method thereof. The method for manufacturing the cutting/polishing tool including at least one cutting/polishing body may comprise preparing a tool body, and forming a cladding layer including cutting material particles by spraying, onto an outer surface of the tool body, the cutting material particles and a metal powder having a specific gravity greater than a specific gravity of the cutting material particles while heating the outer surface of the tool body using a heating device installed in a lower side of the outer surface of the tool body so that the metal powder is deposited on the outer surface of the tool body, wherein the cladding layer configures the at least one cutting/polishing body.

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Номер записи: 30
12-07-2012 дата публикации

Automated repair method and system

Номер: US20120179285A1
Автор: Dimitrios Thomaidis, Rolf WILKENHÖNER, Torsten Melzer-Jokisch
Принадлежит: SIEMENS AG

A method and system for automated repair of a machine component is provided. According to the proposed method, a first geometry of the component, including a damaged portion of the component, is digitalized. A trough is then machined over the damaged portion of the component. The machining is numerically controlled using digitalized geometrical data of the first geometry of the component. A second geometry of the component is then digitalized subsequent to the machining, the second geometry including the trough. Subsequently, a material is deposited over the trough. The deposition of the material is numerically controlled digitalized geometrical data of the second geometry of the component.

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Номер записи: 31
26-07-2012 дата публикации

Laser engraver capable of automatic defocusing

Номер: US20120187097A1
Автор: Jang-Yie WU, Po-Hung Lin
Принадлежит: Great Computer Corp

A laser engraver capable of automatic defocusing is provided, which includes a control end and a device end. The control end includes a data processing module, in which the data processing module is used for a user to set a defocusing distance and select a processing mode by a user, so as to define and set parameters, and form an operation signal. The device end includes a control module and a laser output module, in which the control module is used for receiving the operation signal and controlling the laser output module to change a focal distance according to the operation signal, so as to form the automatic defocusing.

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Номер записи: 32
09-08-2012 дата публикации

Method for making an opening in a substrate

Номер: US20120198977A1
Автор: Christian Kohlmeier, Florian Roick, Stefan Boenigk
Принадлежит: LPKF Laser and Electronics AG

A method for making an opening in a substrate includes creating a cutting path in the substrate for cutting out a polygonal area along predetermined side paths which enclose the opening and are connected to each other via respective corner points. The cutting path is started in an internal region of the polygonal area at a distance from the side paths. The cutting path is continued in a recess in the internal region to a start point on a first one of the side paths, the start point being disposed along the first one of the side paths at a substantial distance from each of the respective corner points so as to divide the first one of the side paths into a long side path portion and a short side path portion. The cutting path is continued, from the start point, along each of the side paths.

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Номер записи: 33
09-08-2012 дата публикации

Method and apparatus for forming the separating lines of a photovoltaic module with series-connected cells

Номер: US20120202313A1
Автор: Walter Psyk
Принадлежит: SCHOTT SOLAR AG

For forming the separating lines, ( 5, 6, 7 ) which are produced in the functional layers ( 2, 3, 4 ) deposited on a transparent substrate ( 1 ) during manufacture of a photovoltaic module with series-connected cells (C 1 , C 2 , . . . ), there are used laser scanners ( 8 ) whose laser beam ( 14 ) produces in the field ( 17 ) scanned thereby a plurality of adjacent separating line sections ( 18 ) in the functional layer ( 2, 3, 4 ). The laser scanners ( 8 ) are then moved relative to the coated substrate ( 1 ) in the direction (Y) of the separating lines ( 5, 6, 7 ) by a distance corresponding at the most to the length (L) of the scanned field ( 17 ) to thereby form continuous separating lines ( 5, 6, 7 ) through mutually flush separating line sections ( 18 ).

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Номер записи: 34
16-08-2012 дата публикации

Scanned laser light source

Номер: US20120205347A1
Автор: Abhilash J. Mayur, Alexander Goldin, Dean C. Jennings, Leonid M. Tertitski, Mark Yam, Paul A. O'Brien, Vernon Behrens
Принадлежит: Applied Materials Inc

The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

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Номер записи: 35
16-08-2012 дата публикации

Laser machining apparatus with switchable laser system and laser machining method

Номер: US20120205356A1
Автор: Christoph Plüss
Принадлежит: Individual

A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.

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Номер записи: 36
30-08-2012 дата публикации

Method and device for producing a component of a turbomachine

Номер: US20120217226A1
Автор: Erwin Bayer, Sven-J. Hiller
Принадлежит: MTU AERO ENGINES GMBH

The invention relates to a method for producing a component ( 10 ) of a turbomachine, especially a structural part of a turbine or a compressor, the method being a generative production method for the layer-by-layer buildup of the component ( 10 ). After production of one or more successive component layers pressure is applied to at least sections of the surface of the most recently produced component layer ( 12 ), the pressure being induced by laser or plasma. The invention further relates to a device for producing a component ( 10 ) of a turbomachine, especially a structural part of a turbine or a compressor, the device ( 26 ) comprising at least one powder feed ( 28 ) for the deposition of at least one powder component material ( 16 ) onto a component platform, at least one radiation source ( 14 ) for a local layer-by-layer fusion or sintering of the component material ( 16 ) and at least one laser radiation source ( 20 ) or at least one plasma impulse source.

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Номер записи: 37
06-09-2012 дата публикации

Laser processing method and laser processing device

Номер: US20120223061A1
Автор: Etsuji Ohmura, Takafumi Atsumi, Yuji Ikeda
Принадлежит: Aisin Seiki Co Ltd

A laser processing method for forming a modification region serving as a starting point of cutting inside a member to be cut along a planned cutting line by relatively moving an optical axis of a condenser lens along the planned cutting line of the member and by irradiating the member with focused laser light, wherein a plurality of cross-sectional focused spots is simultaneously formed on a section which is perpendicular to the optical axis of the condenser lens at positions having a predetermined depth from a surface of the member and which is parallel to the surface and, at that time, at least one cross-sectional focused spot of the plurality of cross-sectional focused spots is formed on a projection line of the planned cutting line onto the cross section to form one or more inside modification regions having a desired shape.

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Номер записи: 38
06-09-2012 дата публикации

Annealing method and annealing apparatus

Номер: US20120225568A1
Автор: Dorel Toma, Hongyu Yue, Junjun Liu, Yusaku Izawa
Принадлежит: Tokyo Electron Ltd

An annealing method irradiates a target object, having a film formed on its surface, with a laser beam to perform an annealing process to the target object. The surface of the target object is irradiated with the laser beam obliquely at an incident angle that is determined to achieve an improved laser absorptance of the film.

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Номер записи: 39
13-09-2012 дата публикации

Apparatus and method for optical isolation

Номер: US20120229910A1
Автор: Michael Kevan Durkin, Stewart Thomas Ingram
Принадлежит: SPI LASERS UK LTD

Provided herein is an apparatus for optically isolating a light beam from a laser, comprising an optical isolator configured to isolate a light beam having a beam quality; a reference plane; an output connector disposed at the output of the optical isolator, wherein the output connector is configured with a common collimator interface to connect to a collimator which is capable of being mechanically referenced to the reference plane; a first lens arrangement disposed proximal to a distal end of the output connector, wherein the first lens arrangement is selected to provide an output light beam having a predetermined divergence. The laser can be selected from the group consisting of a fiber laser, a disk laser and a rod laser. Also provided herein are a system, a plurality of lasers, and a method of providing a light beam that has a consistent divergence and distance from a reference plane.

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Номер записи: 40
20-09-2012 дата публикации

Method and Device for Machining a Workpiece

Номер: US20120234888A1
Автор: Andreas Lenk, RÜDIGER Garn
Принадлежит: Continental Automotive GmbH

A method and related device for machining a workpiece is provided, wherein material of the workpiece is removed in a machining region by a non-contact removal process. The workpiece is excited by means of an excitation oscillation having a natural resonant frequency of the workpiece, or a composite comprising the workpiece and a coupling element that is rigidly coupled to the workpiece is excited by means of an excitation oscillation having a joint natural resonant frequency of the workpiece and the coupling element. The natural resonant frequency is selected such that in the machining region an oscillation occurs that has a maximum oscillation amplitude in relation to the excitation amplitude of the excitation oscillation.

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Номер записи: 41
27-09-2012 дата публикации

Wafer dividing method

Номер: US20120244682A1
Автор: Kei Tanaka
Принадлежит: Disco Corp

In a wafer dividing method, a wafer is held by a chuck table of a laser beam processing apparatus. A modified layer is formed by radiating a laser beam having a wavelength that transmits the laser beam through the wafer, while adjusting the beam convergence point to a position inside of the wafer, so as to form a pair of modified layers the interval of which is greater than the width of a cutting edge of a cutting blade and smaller than the width of planned dividing lines, on the back side of the wafer at both sides of each of the planned dividing lines. The wafer is adhered to a dicing tape and divided into individual devices by cutting along the dividing lines.

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Номер записи: 42
18-10-2012 дата публикации

Annealing apparatus using two wavelengths of continuous wave laser radiation

Номер: US20120261395A1
Автор: Aaron Hunter, Abhilash J. Mayur, Bruce Adams, Dean Jennings, Haifan Liang, Joseph Michael Ranish, Mark Yam, Vijay Parihar
Принадлежит: Individual

A thermal processing apparatus and method in which a first laser source, for example, a CO 2 emitting at 10.6 μm is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO 2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

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Номер записи: 43
18-10-2012 дата публикации

Method for producing semiconductor light-emitting chip and semiconductor light-emitting chip

Номер: US20120261678A1
Автор: Daisuke Hiraiwa, Takehiko OKABE
Принадлежит: Showa Denko KK

In producing a semiconductor light-emitting chip whose substrate is composed of a sapphire single crystal, cracking in semiconductor light-emitting elements in the obtained semiconductor light-emitting chip is suppressed. A semiconductor light-emitting chip is obtained by forming, on an element-group formation substrate on a front surface of which semiconductor light-emitting elements are formed, the front surface being composed of a C-plane of a sapphire single crystal, dividing grooves extending toward a first direction along an M-plane of the sapphire single crystal and the front surface of the substrate from a substrate front surface side (step 103 ), forming first modified regions extending toward the first direction and second modified regions extending along the substrate front surface and toward a second direction different from the first direction in the substrate (step 104 and step 105 ), and dividing the element-group formation substrate using the first modified regions and the second modified regions (step 106 ).

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Номер записи: 44
01-11-2012 дата публикации

Laser match honing system and method

Номер: US20120273471A1
Автор: Fernanda Rojas, Frank Meyer, Harald-Thomas Stumpp, Jannis Stemmann
Принадлежит: ROBERT BOSCH GMBH

A laser match honing system and method are provided for processing one of a pair of mechanically matching components ( 1, 2 ) having matching portions ( 12, 22, 16, 26 ) that will be fitted with each other. A dimension of the matching portion ( 12, 16 ) of the first component ( 1 ) is measured and is then used for calculating the desired dimension of the corresponding matching portion ( 22, 26 ) of the second component ( 2 ). An actual dimension of the matching portion ( 22, 26 ) of the second component ( 2 ) is also measured. Then, the matching portion ( 22, 26 ) of the second component ( 2 ) is honed by laser beam in the condition that the actual dimension is not equal to the desired dimension.

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Номер записи: 45
01-11-2012 дата публикации

Laser processing systems and methods for beam dithering and skiving

Номер: US20120273472A1
Автор: Alexander A. Myachin, Andrew Berwick, Mark A. Unrath
Принадлежит: Electro Scientific Industries Inc

A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.

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Номер записи: 46
15-11-2012 дата публикации

Optical module

Номер: US20120288242A1
Автор: Ikuo Ogawa, Ryoichi Kasahara, Toshiki Nishizawa, Yuji Mitsuhashi
Принадлежит: Nippon Telegraph and Telephone Corp, NTT Electronics Corp

An optical module including a flat-plate-shaped base having a predetermined thickness, an optical semiconductor package which is mounted on a plane of the flat-plate-shaped base to air-tightly seal an active optical element, a waveguide optical element which wave-guides light from an optical fiber or to an optical fiber and which is mounted on the plane of the flat-plate-shaped base, an optical lens which connects the optical semiconductor package and the waveguide optical element and which is mounted on the plane of the flat-plate-shaped base, and a frame-equipped lid which covers the optical semiconductor package, the waveguide optical element, and the optical lens and which is fixed onto the plane of the flat-plate-shaped base.

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Номер записи: 47
22-11-2012 дата публикации

Cochlear electrode array

Номер: US20120296405A1
Автор: Chuladatta Thenuwara, Timothy Beerling
Принадлежит: ADVANCED BIONICS LLC

A cochlear lead includes a plurality of electrode assemblies partially embedded in a flexible body configured to stimulate an auditory nerve from within a cochlea. Each of the electrode assemblies includes a flexible electrically conductive material forming a plurality of support structures and an electrode pad attached a support structure, the electrode pad having a surface that is configured to be exposed to cochlear tissue and fluids and has a charge transfer to the cochlear tissue and fluids that is higher than the flexible electrically conductive material.

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Номер записи: 48
29-11-2012 дата публикации

Method for processing rubber surface and sealing member

Номер: US20120299250A1
Автор: Chihiro Asanuma, Makoto Hino, Ritsuko Yokota, Tatsuo Katayama, Tomohisa Yamamoto, Yutaka Mitooka
Принадлежит: Uchiyama Manufacturing Corp

A method for processing a rubber surface and a sealing member treated with the method. In the first mode, a rubber surface is formed with a large number of small dimples in a regularly dotted pattern by irradiating laser beams from a laser irradiation device. In the second mode, a skin layer of the rubber surface is removed by irradiating laser beams from the laser irradiation device. In the third mode, the first mode and the third mode are combined. A sealing member comprises rubber including a seal lip part for elastically and slidably contacting a counterpart member, wherein a sliding contact surface of the seal lip part contacting the counterpart member is treated with one of the first, the second and the third modes of the method for processing a rubber surface.

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Номер записи: 49
29-11-2012 дата публикации

Apparatus and method for repair of defects in an electronic energy control or display device

Номер: US20120302122A1
Автор: Harvey KALWEIT, Neil L. Sbar
Принадлежит: Sage Electrochromics Inc

An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.

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Номер записи: 50
20-12-2012 дата публикации

Water soluble mask for substrate dicing by laser and plasma etch

Номер: US20120322233A1
Автор: AJAY Kumar, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Wei-Sheng Lei
Принадлежит: Applied Materials Inc

Methods of dicing substrates having a plurality of ICs. A method includes forming a mask comprising a water soluble material layer over the semiconductor substrate. The mask is patterned with a femtosecond laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the substrate between the ICs. The substrate is then etched through the gaps in the patterned mask to singulate the IC and the water soluble material layer washed off.

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Номер записи: 51
20-12-2012 дата публикации

In-situ deposited mask layer for device singulation by laser scribing and plasma etch

Номер: US20120322234A1
Автор: AJAY Kumar, Banqiu Wu, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Wei-Sheng Lei
Принадлежит: Applied Materials Inc

Methods of dicing substrates by both laser scribing and plasma etching. A method includes forming an in-situ mask with a plasma etch chamber by accumulating a thickness of plasma deposited polymer to protect IC bump surfaces from a subsequent plasma etch. Second mask materials, such as a water soluble mask material may be utilized along with the plasma deposited polymer. At least some portion of the mask is patterned with a femtosecond laser scribing process to provide a patterned mask with trenches. The patterning exposing regions of the substrate between the ICs in which the substrate is plasma etched to singulate the IC and the water soluble material layer washed off.

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Номер записи: 52
20-12-2012 дата публикации

Laser and plasma etch wafer dicing using water-soluble die attach film

Номер: US20120322238A1
Автор: AJAY Kumar, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Wei-Sheng Lei
Принадлежит: Individual

Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. A method includes forming a mask above the semiconductor wafer. The semiconductor wafer is disposed on a water-soluble die attach film. The mask covers and protects the integrated circuits. The mask is patterned with a laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then etched through the gaps in the patterned mask to form singulated integrated circuits. The water-soluble die attach film is then patterned with an aqueous solution.

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Номер записи: 53
03-01-2013 дата публикации

Laser ablation tooling via distributed patterned masks

Номер: US20130003030A1
Автор: Thomas R.J. Corrigan
Принадлежит: 3M Innovative Properties Co

A distributed patterned mask for use in a laser ablation process to image a complete pattern onto a substrate. The mask has a plurality of apertures for transmission of light and non-transmissive areas around the apertures. When the apertures for the distributed pattern are repeatedly imaged on a substrate, structures within the distributed pattern merge within different areas of the imaged pattern to create the complete pattern with distributed stitch lines in order to reduce or eliminate the stitching effect in laser ablation. The mask can also form a sparse and distributed pattern including apertures that individually form merging portions of the complete pattern and collectively form a distributed pattern.

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Номер записи: 54
10-01-2013 дата публикации

Removal apparatuses for semiconductor chips and methods of removing semiconductor chips

Номер: US20130008020A1
Автор: Jaeyong Park, Junyoung Ko, Kyhyun Jung, Whasu Sin
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board. A method of removing a semiconductor chip from a board may include loading the board, on which the semiconductor chip is mounted by bumps, on a stage; irradiating a laser beam into the semiconductor chip to melt the bumps and to separate the semiconductor chip from the board; continuously irradiating the laser beam into the board on which solder pillars, that are residues of the bumps, remain to melt the solder pillars; and removing the solder pillars.

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Номер записи: 55
17-01-2013 дата публикации

Laser processing machine

Номер: US20130015166A1
Автор: Chun-Hao Li
Принадлежит: Individual

A laser processing machine includes a cavity, a laser system, at least one processing platform, and at least one upper motion platform. The laser system is disposed at a lower part inside the cavity, and used for outputting a laser beam. A traveling direction of the laser beam is opposite to the gravity direction. The processing platform is disposed at an upper part inside the cavity, and includes an adsorption surface and a connection surface facing each other. The adsorption surface is located below the connection surface, and is used for adsorbing a workpiece. The upper motion platform is disposed at the upper part inside the cavity, and is correspondingly connected to the connection surface of the processing platform, in order to cause the processing platform to move.

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Номер записи: 56
17-01-2013 дата публикации

Device for cutting plastic products provided in a continuous plastic band for use in the medical sector

Номер: US20130017289A1
Автор: Heinz Kieburg, Reiner Franzke
Принадлежит: B Braun Melsungen AG

Devices for cutting interconnected plastic products for use in the medical sector provided in a continuous band of plastic, comprising a laser, a laser control system and an optical acquisition and data processing unit are disclosed. Devices for the manufacture of plastic products, such as fillable or filled plastic containers for use in the medical sector, comprising a device for cutting interconnected plastic products provided in a continuous band of plastic as well as a process for cutting interconnected plastic products provided in a continuous band of plastic are disclosed. The optical acquisition unit may determine positional data for the interconnected plastic products provided in the band. From the positional data a cutting pattern may be calculated and transmitted to the laser control system. According to this cutting pattern, the position, intensity and focal point of the laser may be controlled by the laser control system, which may comprise a focusing optic, a deflection means and a beam-forming means.

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Номер записи: 57
14-02-2013 дата публикации

System and method for component material addition

Номер: US20130040074A1
Автор: Dave Keicher, Ed Tucker, Gregory Thomas Krause
Принадлежит: Individual

A system is disclosed for depositing material on a component. The system includes a deposition device operatively coupled to a fiber optic Nd:YAG laser. The deposition device includes a focusing prism that focuses the Nd:YAG laser at a focal area on a bladed disk, where the focal area on the bladed disk is between two blades of the disk. The system further includes an imaging means that views the focal area of the component. The imaging means and the fiber optic Nd:YAG laser each are positioned in a substantially similar optical relationship to the focal area on the bladed disk. The system further includes an additive material delivery means that delivers additive material to the component at the focal area on the component.

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Номер записи: 58
28-02-2013 дата публикации

Method for manufacturing sealing disks

Номер: US20130048614A1
Автор: Francois Chevalley, Jürg Lanz, Marcel Oberholzer
Принадлежит: SOUDRONIC AG

Sealing disks ( 44 ) for producing peel-off lids comprising lid rings having a peel-off foil sealed onto the lid ring are produced in that an annular sealing part made of steel ( 54 ) is fastened on a main plate ( 53 ) made of copper, for example by electron-beam welding, whereupon the sealing part is hardened by laser hardening. In this way, a sealing disk having good thermal conductivity and high wear resistance can be favorably produced.

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Номер записи: 59
28-02-2013 дата публикации

Method for partially stripping a defined area of a conductive layer

Номер: US20130048618A1
Автор: Bostjan Podobnik, Drago Kovacic, Jan Van Aalst
Принадлежит: LPKF Laser and Electronics AG

A method for partial detachment of a defined area of a conductive layer using a laser beam includes forming a conductor track with a defined path from the conductive layer on the substrate, the path defining main axes. The area is segmented into zones. A linear recess is provided along a respective perimeter of each of the zones. Each of the zones has a strip shape such that the recesses extend along paths that are substantially straight lines not parallel to either of the main axes. One of the zones to be removed is heated using laser radiation until adhesion of the conductive layer to the substrate is substantially reduced and the zone to be removed is detached in a surface-wide manner from the substrate under external influences. Laser-beam parameters are set such that only the conductive layer is removed without affecting an underlying substrate.

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Номер записи: 60
28-02-2013 дата публикации

Apparatus and Methods for Annealing Wafers

Номер: US20130052837A1
Автор: Li-Ting Wang, Pei-Ren Jeng, Tai-Chun Huang, Tze-Liang Lee, Yi-Chao Wang, Yu-Chang Lin
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

A method includes performing an anneal on a wafer. The wafer includes a wafer-edge region, and an inner region encircled by the wafer-edge region. During the anneal, a first power applied on a portion of the wafer-edge region is at least lower than a second power for annealing the inner region.

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Номер записи: 61
14-03-2013 дата публикации

Limiting energy leakage during laser scoring of vehicle airbag coverings

Номер: US20130065041A1
Автор: Aaron Wisniewski, Mathew Barr
Принадлежит: Faurecia Interior Systems Inc

A covering for use over a vehicle airbag includes a skin layer and an attached foam layer. The foam layer is constructed from a polymer-based material that includes a polymer portion and an additive, and the additive may be selected to affect the energy transmission characteristics of the foam layer material when the covering is subjected to a laser scoring process that uses a laser light beam having a characteristic wavelength. The additive may decrease the amount of light energy transmitted through the material at the characteristic wavelength to limit the amount of energy leakage from one cut location to another during laser scoring. The decrease in light transmission through the material may be accompanied by an increase in the light absorption of the material, an increase in the amount of light reflected by the material, and/or an increase in a laser cutting rate of the material per unit energy.

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Номер записи: 62
21-03-2013 дата публикации

Method and Apparatus for Three Dimensional Large Area Welding and Sealing of Optically Transparent Materials

Номер: US20130068384A1
Автор: Huan Huang, Jian Liu
Принадлежит: PolarOnyx Inc

Methods and systems for three dimensional large area welding and sealing of optically transparent materials are disclosed, including generating a beam of ultra-short pulses from an ultra-short pulsed laser; directing the beam to an acoustic-optic modulator to control the repetition rate of the beam; directing the beam to an attenuator after passing through the acoustic-optic modulator to control the energy of the beam; directing the beam to a focusing lens after passing through the attenuator to focus the beam between a top substrate and a bottom substrate in order to weld the top substrate to the bottom substrate, wherein the top substrate and the bottom substrate are in intimate contact; and controlling the position of the top substrate and the bottom substrate relative to the beam using a three-axis stage in order to weld the top substrate to the bottom substrate at different points. Other embodiments are described and claimed.

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Номер записи: 63
21-03-2013 дата публикации

METHOD FOR FORMING METAL MEMBRANE

Номер: US20130068735A1
Автор: Abe Genryu, Fujii Hidetoshi, Fukusumi Masao, Mizuno Tadashi, Morisada Yoshiaki, Nagaoka Toru
Принадлежит:

The present invention provides a method of forming a metal coating having a microstructure as well as a structural member having a metal coating formed by the method. In particular, the invention provides an advantageous method of forming a metal coating in which minute carbides are uniformly dispersed. The method of forming the metal coating of the present invention includes the steps of cladding a surface of the substrate with metal powder by a laser cladding method and forming the metal coating having a microstructure by applying a friction stir processing to the cladded region. 1. A method of forming a metal coating on a substrate , the method comprising the steps of:cladding a surface of the substrate with a metal powder by a laser cladding method; andforming the metal coating comprising a microstructure by applying a friction stir processing to the cladded region of the substrate.2. The method of claim 1 , wherein the metal powder comprises a chromium carbide.3. The method of claim 1 , wherein the metal powder comprises a vanadium carbide.4. The method of claim 1 , wherein the laser cladding method is conducted by supplying the metal powder and emitting a laser along an equivalent axis.5. A structural member comprising a metal coating formed by the method of . This application is a national phase application under 35 U.S.C. §371 of International Application Serial No. PCT/JP2011/057394, filed on Mar. 25, 2011, and claims the priority under 35 U.S.C. §119 to Japan Patent Application No. 2010-070680, filed on Mar. 25, 2010, which are hereby expressly incorporated by reference in their entirety for all purposes.The present invention relates to a method of forming a metal coating having a microstructure and a structural member having the metal coating formed by the method. In particular, the invention relates to an advantageous method of forming a metal coating in which fine carbides are uniformly dispersed. The term “microstructure” in the present invention means ...

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Номер записи: 64
21-03-2013 дата публикации

Systems and processes that singulate materials

Номер: US20130068736A1
Автор: Michael Mielke, Ramanujapuram A. Srinivas, Thor Wilbanks, Tim Booth
Принадлежит: Individual

Systems and methods for material singulation. According to some embodiments, methods for material singulation may include applying a first laser output to the material, the first laser output causing a modification of a material property of the material when exposed to the first laser output; and applying a second laser output to the material that was exposed to the first laser output to cause singulation of the material in such a way that surfaces created by the singulation of the material are substantially free from defects.

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Номер записи: 65
21-03-2013 дата публикации

CUTTING PROCESS AND CUTTING DEVICE

Номер: US20130068737A1
Автор: SAITO Isao
Принадлежит: Asahi Glass Company, Limited

In a process for cutting a work piece by irradiating a front surface of the work piece with first heating light and second heating light and moving the irradiation regions and of each light along a planned cutting line on the front surface , the first heating light has a width W extending in a direction orthogonal to the moving direction thereof on a certain area of the front surface , the width of the first heating light being set so as to be smaller than a width W of the second heating light extending in a direction orthogonal to the moving direction of the second heating light, and the irradiation region of the first heating light being moved in tandem with the irradiation region of the second heating light , which precedes the first irradiation region. 1. A process for cutting a work piece by irradiating first and second irradiation regions on a front surface of the work piece with first heating light and second heating light and relatively moving the first and second irradiation regions along a planned cutting line on the front surface;wherein a width of the first irradiation region extending in a direction orthogonal to the moving direction thereof is smaller than a width of the second irradiation region extending in a direction orthogonal to the moving direction thereof, and the first irradiation region is moved in tandem with the second irradiation region preceding the first irradiation region.2. The process according to claim 1 , wherein the second irradiation region moves such that a center of gravity thereof is displaced toward a portion of the work piece on one of both sides of the planned cutting line claim 1 , which has a greater rigidity.3. The process according to claim 1 , wherein the planned cutting line is located in a portion of the work piece claim 1 , which is away from a central region of the work piece and closer to a lateral side claim 1 , and the second irradiation region moves such that a center of gravity thereof is displaced toward the ...

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Номер записи: 66
21-03-2013 дата публикации

LASER CUTTING HEAD AND METHOD FOR CUTTING A WORKPIECE BY MEANS OF A LASER CUTTING HEAD

Номер: US20130068738A1
Автор: Genannt Ingo Stork, Schürmann Burt
Принадлежит: Precitec KG

The invention relates to a device () for cutting a workpiece () by means of a working laser beam (), comprising a housing (), through which a path is made for the working laser beam () and which has a focusing lens () for focusing the working laser beam () onto the workpiece () to be cut within a working area (), a lighting device () with a light source () for the incoherent lighting of the working area () of the workpiece () to be cut, a camera (), coupled coaxially into the path of the working laser beam, for observing the working area () of the workpiece () to be cut, wherein an optical filter, which is substantially opaque to the working laser beam (), is arranged ahead of the camera () in the path of the observation beam (), and comprising a processing unit (), which is designed for processing image data from the camera (), in order to determine the geometry and quality of a slit () produced in the workpiece () by the working laser beam (), wherein the optical filter is an optical bandpass filter () and the light source () of the lighting device () is of such a nature that it has an at least local radiating maximum in the wavelength pass band of the bandpass filter (), in order to make it possible for the camera () to record a grey-scale image of the working area () in which both reflections by the working laser beam () and emissions of the material vapour of the workpiece () are minimized. 2. The device as claimed in claim 1 , wherein the processing unit is designed to process image data from the camera in order to determine a current width (d′) of the cut slit.3. The device as claimed in claim 1 , further comprising a cutting nozzle through which the working laser beam aid the observation beam path of the camera run and through which a cutting gas is led claim 1 , as a result of which during a cutting operation a material of the workpiece to be cut that is fused by the working laser beam is blown downward from the cut slit.4. The device as claimed in claim 1 ...

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Номер записи: 67
21-03-2013 дата публикации

LASER PROCESSING METHOD

Номер: US20130068739A1
Автор: SUGIURA Ryuji
Принадлежит: HAMAMATSU PHOTONICS K.K.

To provide a laser processing method which is capable of enhancing the dividing performance according to a required quality. By irradiating an object to be processed with a laser light L having a pulse waveform in which its half width and its bottom width are equal to one another, a plurality of modified spots are formed along a line to cut inside the object, and a modified region is formed with the plurality of modified spots. Here, a laser light source controls a drive power source by a laser light source controller to switch among a pulse waveform among first to third pulse waveforms according to a PE value of the laser light L. In the case of a low PE value, a first pulse waveform formed such that a peak value is located on its first half side and into a saw-blade shape is set as the pulse waveform, and in the case of a high PE value, a second pulse waveform formed such that a peak value is located on its latter half side and into a saw-blade shape is set as the pulse waveform. 1. A laser processing method for forming a modified region along a line to cut in an object to be processed by collecting a laser light onto the object , the method comprising:a modified region forming step of forming a plurality of modified spots along the line by irradiating the object with the laser light having a pulse waveform in which its half width and a time width from a rise to a fall are equal to one another, to form the modified region with the plurality of modified spots, wherein, in the modified region forming step,in the case where pulse energy of the laser light is at a first value lower than a predetermined value, a first pulse waveform formed such that a peak value is located on its first half side and into a saw-blade shape is set as the pulse waveform, andin the case where the pulse energy is at a second value higher than the predetermined value, a second pulse waveform formed such that a peak value is located on its latter half side and into a saw-blade shape is set as ...

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Номер записи: 68
21-03-2013 дата публикации

Laser machining device and laser machining method

Номер: US20130068742A1
Автор: Haruyasu Ito, Naoya Matsumoto, Norihiro Fukuchi, Takashi Inoue, Yuu Takiguchi
Принадлежит: Hamamatsu Photonics KK

A laser machining device 1 comprises a laser light source 10 , a spatial light modulator 20 , a controller 22 , a converging optical system 30 , and a shielding member 40 . The phase-modulating spatial light modulator 20 inputs a laser beam outputted from the laser light source 10 , displays a hologram modulating a phase of the laser beam at each of a plurality of pixels arranged two-dimensionally, and outputs the phase-modulated laser beam. The controller 22 causes the spatial light modulator 20 to display a plurality of holograms sequentially, lets the converging optical system 30 converge the laser beam outputted from the spatial light modulator 20 at converging positions having a fixed number of M, selectively places N converging positions out of the M converging positions into a machining region 91 , and machines an object to be machined 90.

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Номер записи: 69
28-03-2013 дата публикации

High precision, rapid laser hole drilling

Номер: US20130075373A1
Автор: Chang Jim J., Comaskey Brian J., Friedman Herbert W.
Принадлежит:

A laser system produces a first laser beam for rapidly removing the bulk of material in an area to form a ragged hole. The laser system produces a second laser beam for accurately cleaning up the ragged hole so that the final hole has dimensions of high precision. 1. Apparatus for drilling holes in a first material positioned on a second material , wherein said first material has a bottom surface , comprising ,a laser system that produces a first laser beam for rapidly removing the bulk of material in an area in said first material to form a ragged hole in said first material,a control connected to said laser system that controls said laser that produces a first laser beam for rapidly removing the bulk of material in an area in said first material to form a ragged hole in said first material and stops said first laser beam in forming a ragged hole before said ragged hole reaches said bottom surface leaving a membrane between said ragged hole and said bottom surface, anda second laser beam for accurately cleaning up said ragged hole so that the final hole has dimensions of high precision, wherein said control connected to said laser system controls said second laser beam for accurately cleaning up said ragged hole so that the final hole has dimensions of high precision and for producing said final hole that has dimensions of high precisions is produced through said membrane to said bottom surface providing said final hole that has dimensions of high precisions through the first material to the second material.2. The apparatus of wherein said first laser beam is an infra-red laser beam.3. The apparatus of wherein said second laser beam is a low power claim 1 , short wavelength laser beam.4. The apparatus of wherein said first laser beam is an infra-red laser beam and said second laser beam is a low power claim 1 , short wavelength laser beam.5. The apparatus of wherein said laser system has an ablative mode for producing said first laser beam for rapidly removing the ...

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Номер записи: 70
04-04-2013 дата публикации

COMPOSITE KNIFE BLADE

Номер: US20130081283A1
Автор: Lewis Darrell
Принадлежит: KAI U.S.A., LTD. DBA KERSHAW KNIVES

A composite knife blade includes a cutting-edge piece of a first alloy, a back piece of a second alloy different from the first alloy, the cutting-edge piece and the back piece are brazed together at a serpentine joint. The cutting-edge piece has a high Rockwell hardness value, as compared to a hardness of the back piece. A method of manufacture of the knife blade includes fine blanking the back piece of from a sheet of the second alloy, laser cutting the cutting-edge piece from a sheet of the first alloy, and brazing the first piece to the second piece to form a composite blade. The composite blade is then cooled from the brazing temperature to an austenizing temperature of the cutting-edge piece, and quenched, to harden the cutting-edge piece. 1. A knife blade comprising:a cutting-edge piece of a first material, the cutting-edge piece including a sharpened cutting-edge and a serpentine joint edge different from the cutting-edge;a back piece of a second material different from the first material, the back piece including a spine edge and a serpentine joint edge, wherein the serpentine joint edge of the back piece is interlocked with the serpentine joint edge of the cutting-edge piece; anda brazed joint having brazing material positioned between the serpentine joint edges of the cutting-edge piece and the back piece, the brazing material selected from among copper, bronze, gold, silver, and nickel, wherein the brazed joint has a serpentine shape as viewed in a side elevation,wherein a space is provided between the serpentine joint edge of the back piece and the serpentine joint edge of the cutting-edge piece to have enabled a slip-fit assembly of the cutting-edge piece and the back piece along only a direction perpendicular to a side surface of the knife blade to hold the back piece and the cutting-edge piece together, and to have ensured proper brazing of the back piece to the cutting edge piece.2. The knife blade of wherein the first material is a first alloy ...

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Номер записи: 71
04-04-2013 дата публикации

METHOD OF ABLATING A THREE-DIMENSIONAL SURFACE USING A LASER ABLATION DEVICE AND THROUGH THE USE OF A CALIBRATION STEP; DEVICE FOR IMPLEMENTING SUCH A METHOD

Номер: US20130082037A1
Автор: Champonnois François, Laval Bertrand
Принадлежит:

The invention relates to a method characterized in that it comprises—a step (E) of calibrating a device, whereby—a galvanometric head illuminates along two axes a calibration plate, situated at a depth, in order to illuminate a plurality of determined points of the calibration plate, while a camera observes said calibration plate, a control unit establishing a relationship between, on the one hand, the position of illumination of each of the illuminated points of the calibration plate at the depth, and, on the other hand, the position observed by the camera of the illuminated points; the calibration plate being successively positioned at a plurality of depths during the calibration step so as to allow a plurality of illuminations by the head, of observations by the camera and of relationships to he established by the control unit; the control unit establishes a correspondence relationship,—a step (E) of determining the three-dimensional shape of the surface that is to be ablated, from the calibration step (E), by triangulation, and—a step (ES) of ablating the three-dimensional surface whereby the control milt controls the galvanometric head as a function of the determined shape of the surface in order to focus and to direct, along axes that define a plane and to a depth, the beam onto the surface that is to be ablated. The invention also relates to a device for implementing an aforementioned method, 1122. A process for ablation of a three-dimensional surface () by means of an ablation device () , the device () comprising:{'b': 3', '4, 'a laser source () for generating a pulsed laser beam ();'}{'b': 6', '4', '1, 'an optical module () for focussing and directing, according to axes defining a plane (X, Y) and according to a depth (z), the beam () on the surface () to be ablated;'}{'b': '10', 'at least one observation camera () of the surface to be ablated; and'}{'b': 9', '6', '10, 'a control unit () attached to the module () and to the camera ();'}the process being ...

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Номер записи: 72
04-04-2013 дата публикации

Method for patterning nano particles

Номер: US20130084451A1
Автор: John T. Bahns, Liaohai Chen, Stephen K. Gray, Subramanian Sankaranarayanan
Принадлежит: UChicago Argonne LLC

The invention provides a simple and inexpensive method to assemble nanomaterials into millimeter lengths. The method can be used to generate optical, sensing, electronic, magnetic and or catalytic materials. Also provided is a substrate comprised of fused nanoparticles. The invention also provides a diode comprised of assembled nanoparticles.

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Номер записи: 73
11-04-2013 дата публикации

METHOD FOR PRODUCING A DOUBLE-LAYER OR TRIPLE-LAYER SOUND-ABSORBING PANEL AND CORRESPONDING SOUND-ABSORBING PANEL

Номер: US20130087408A1
Автор: MÄDER Marco
Принадлежит: AKUSTIK & INNOVATION GMBH

A method for producing a double-layer or triple-layer sound-absorbing panel () is specified, said panel consisting of a support panel () and at least one cover panel or coating () of the support panel (), the cover panel or coating () being fixedly connected to the support panel (). In this case, an open-pore () support panel is provided as the support panel () and the sound-absorbing panel () is arranged on each side () provided with a cover panel or coating () with a device opposing said side emitting a laser beam, the upper face () of said panel () being subjected to the laser beam, which is designed to burn away material from the cover panel or coating () facing said laser beam over the depth in the direction of the laser beam in a plurality of holes (). In this case, the laser beam acting on the panel () is designed such that the waist of the laser beam is focused on a plane parallel to the lower face of the cover panel or top layer () such that the holes () are continuous through the cover panel or top layer (), and a lower hole opening/hole end () is produced in the support panel () itself so that the surroundings are connected to the open-pore support panel () via an air connection (). 110-. (canceled)11. A method for producing a sound-absorbing panel comprising an open-pore support panel having two side surfaces and a cover panel or coating of the support panel , wherein the cover panel or coating being fixedly connected on one of the side surfaces of the open-pore support panel; comprising the method steps of:arranging the sound-absorbing panel with the side surface provided with said cover panel or coating in front of a laser device adapted to emit a laser beam,subjecting the side surface of said panel to the laser beam emitted from the laser, which laser beam is adapted to burn away material from the cover panel or coating facing said laser beam over the depth in the direction of the laser beam in a plurality of holes,wherein the laser beam acting on the ...

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Номер записи: 74
11-04-2013 дата публикации

Laser-based lap welding of sheet metal components using laser induced protuberances to control gap

Номер: US20130087540A1
Автор: Boris Shulkin, Hongping Gu
Принадлежит: Magna International Inc

A method for laser welding first and second components is provided including moving a laser beam across a portion of a surface of the first component at a speed sufficient to generate protuberances on the surface of the first component by means of a humping effect, juxtaposing said first and second components such that opposed surfaces of the first and second components are separated by said protuberances on the surface of the first component, and laser welding said first and second components by scanning the laser beam in a region in which said surfaces are separated by said protuberances. The height of the protuberances can be controlled by controlling a scanning speed of the laser beam.

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Номер записи: 75
11-04-2013 дата публикации

Ablation method for die attach film

Номер: US20130087949A1
Автор: Nobuyasu Kitahara
Принадлежит: Disco Corp

An ablation method of applying a laser beam to a die attach film to perform ablation. The ablation method includes a protective film forming step of applying a liquid resin containing a fine powder of oxide having absorptivity to the wavelength of the laser beam to at least a subject area of the die attach film to be ablated, thereby forming a protective film containing the fine powder on at least the subject area of the die attach film, and a laser processing step of applying the laser beam to the subject area coated with the protective film, thereby performing ablation through the protective film to the subject area of the die attach film after performing the protective film forming step.

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Номер записи: 76
18-04-2013 дата публикации

Optical device and method for manufacturing the optical device

Номер: US20130094800A1
Автор: Kaoru Yoda, Masafumi Ide, Shinpei Fukaya
Принадлежит: Citizen Holdings Co Ltd

The invention provides an optical device and an optical device manufacturing method wherein provisions are made to be able to precisely align an optical fiber relative to a substrate without heating the substrate and to maintain the optimum alignment condition for an extended period of time. More specifically, the invention provides an optical device manufacturing method which includes the steps of forming a first metallic film on a portion of a substrate, forming a second metallic film on a portion of the outer circumference of an optical fiber, and bonding together the first metallic film and the second metallic film by surface activated bonding,, and an optical device manufactured by such a manufacturing method.

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Номер записи: 77
18-04-2013 дата публикации

Transparent material processing with an ultrashort pulse laser

Номер: US20130095260A1
Автор: Alan Y. Arai, Fumiyo Yoshino, James Bovatsek
Принадлежит: IMRA America Inc

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.

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Номер записи: 78
25-04-2013 дата публикации

Laser machining apparatus

Номер: US20130098876A1
Автор: Izuru Hori, Kenichi Fukami, Masahiro Koike, Shin Yoshida, Takuo Kobayashi
Принадлежит: Honda Motor Co Ltd

A laser machining apparatus is provided with: a workpiece support unit; a machining head; and a machining head moving unit. The workpiece support unit includes: an end support part that supports a width end of a workpiece; and an inside support part that supports an inside portion of the workpiece in a width direction. The end support part is movable in a longitudinal direction independently from the inside support part in response to a movement of the machining head.

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Номер записи: 79
02-05-2013 дата публикации

PUDDLE FORMING AND SHAPING WITH PRIMARY AND SECONDARY LASERS

Номер: US20130105447A1
Автор: Haake John M.
Принадлежит: TITANOVA INC

A material processing system for a base material is provided. The system includes a feeder having a distal end proximate to a surface location of the base material. The feeder supplies a deposit material to the surface location. The deposit material has a width having a first side and a second side. A first laser is directed to the deposit material at the surface location. The first laser is directed across the width from the first side to the second side. A second laser is directed to a desired location within the width. A control system drives the process of cladding the deposit material. The control system includes a shape controller to control the movement of the secondary laser along the deposit material based on feedback from a sensor. 1. A material processing system for a base material comprising:a feeder having a distal end proximate to a surface location of the base material, wherein said feeder supplies a deposit material to said surface location, said deposit material having a width having a first side and a second side;a first laser directed to said deposit material at said surface location, wherein said first laser is directed across said width from said first side to said second side; anda second laser directed to a desired location within said width.2. The invention of claim 1 , wherein said deposit material is comprised of a powder claim 1 , wire or strip claim 1 , wherein said first laser is comprised of a line source diode laser having a first power level claim 1 , and wherein a second power level of said second laser is less than approximately one fourth of said first power level.3. The invention of further comprising a sensor and a shape controller claim 1 , said shape controller connected to said second laser claim 1 , wherein said sensor monitors the deposit material and said shape controller positions said second laser relative to said first side and said second side based on feedback from said sensor.4. The invention of claim 1 , wherein said ...

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Номер записи: 80
02-05-2013 дата публикации

Laser repairing apparatus and laser repairing method for substrate

Номер: US20130105451A1
Автор: Guoxiao BAI, Haisheng ZHAO, Weisong Yang
Принадлежит: Beijing BOE Optoelectronics Technology Co Ltd

According to embodiments of the present invention, there are disclosed a laser repairing apparatus and a laser repairing method for a substrate. The laser repairing apparatus comprises: a laser emitter; and a light transmission sheet with a light-shielding pattern, wherein a laser emitted by the laser emitter is used to cut a superfluous remainder of an electrode on the substrate, the light transmission sheet is located between the laser emitter and the substrate, and as compared with a pattern of the electrode on the substrate, the light-shielding pattern on the light transmission sheet has the same shape and a size at a predetermined ratio.

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Номер записи: 81
09-05-2013 дата публикации

LASER PROCESSING MACHINE

Номер: US20130112671A1
Автор: Broger David, Bugmann Tobias, Cathry Daniel, Imboden Ernest, Perrin Thierry
Принадлежит: BYSTRONIC LASER AG

Laser processing machines, such as laser cutting machine (LM), including a work table receiving workpiece (W), and work arm () with a laser cutting head (). Laser cutting head () includes nozzle receiving device () and nozzle (D). Via nozzle (D) laser beam () may be directed onto work piece (W). Machine (LM) includes main drives moving work arm () and/or the laser cutting head () on X-Y-Z axes to process work piece (W), as well as an alignment unit to adjust laser beam (). An adjusting station () includes receiving unit () fixing nozzle (D) and/or the nozzle receiving device () during centering of nozzle (D). The alignment unit has head element (B) in laser cutting head (). Head element (B) receives nozzle (D) and/or the nozzle receiving device () and is slidable in X-Y directions, via the main drives. Head element (B) may be fixed in a selected position, within the laser cutting head (), via clamping device () releasable during nozzle centering at adjusting station (). 114-. (canceled)15. A laser processing machine comprising:a work arm;a laser cutting head mounted on said work arm;a nozzle receiver arranged in said work arm;a nozzle configured to pass a laser beam, said nozzle connected to said nozzle receiver;an alignment unit for adjusting the laser beam relative to said nozzle, said alignment unit including a head arrangement receiving said nozzle receiver;an adjusting station, said adjusting station including a receiving unit configured to fix said nozzle against movement;said alignment unit including a releasable clamping device configured to controllably release said nozzle for relative movement relative to said work arm and said laser cutting head; and,main drives operatively connected to controllably move said work arm and said laser cutting head relative to said nozzle when said receiving unit fixes said nozzle against movement and said clamping device releases said nozzle, said main drives operatively connected to controllably move said work arm, said ...

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Номер записи: 82
16-05-2013 дата публикации

Method and Device for Laser Material Processing of a Workpiece

Номер: US20130119026A1
Автор: Haecker Tobias, Hesse Tim, Kaiser Tobias, Speker Nicolai
Принадлежит: TRUMPF WERKZEUGMASCHINEN GMBH + CO. KG

Cutting a workpiece with a laser beam includes using the laser beam to melt and/or vaporize at least a portion of the workpiece, and moving at least one of the workpiece and the laser beam relative to one another to form a cutting front on the workpiece, in which the laser beam includes either at least two different radially polarized beam portions offset relative to each along an advancing direction of the laser beam, or multiple laser beam strips extending along the advancing direction of the laser beam. Each laser beam strip has a different linear polarization direction, and the advancing direction corresponds to a direction along which the workpiece is cut by the laser beam. 1. A method for cutting a workpiece with a laser beam , the method comprising:using the laser beam to melt and/or vaporize at least a portion of the workpiece;moving at least one of the workpiece and the laser beam relative to one another in an advancing direction to form a cutting front on the workpiece,wherein the laser beam comprises either at least two different radially polarized beam portions offset relative to each other along the advancing direction, or a plurality of laser beam strips extending along the advancing direction, wherein each laser beam strip has a different linear polarization direction, and wherein the advancing direction corresponds to a direction along which the workpiece is cut by the laser beam.2. The method according to claim 1 , wherein the laser beam comprises the plurality of laser beam strips claim 1 , the linear polarization direction of each laser beam strip subtends a corresponding angle to a longitudinal center plane of the laser beam claim 1 , and an angle size increases from the beam strips arranged near the longitudinal center plane toward the beam strips arranged furthest from the longitudinal center plane.3. The method according to claim 1 , wherein the laser beam comprises the two different radially polarized beam portions claim 1 ,wherein the at ...

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Номер записи: 83
16-05-2013 дата публикации

Method and apparatus for heat treating the wafer-shaped base material of a solar cell, in particular a crystalline or polycrystalline silicon solar cell

Номер: US20130119030A1
Автор: Paul Alexander Harten
Принадлежит: Limo Patentverwaltung GmbH and Co KG

A method and an apparatus for heat treating a wafer-shaped base material of a solar cell, in particular of a crystalline or polycrystalline silicon solar cell, wherein the device comprises at least one laser light source ( 4 a, 4 b ).

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Номер записи: 84
23-05-2013 дата публикации

CARDBOARD-HANDLING SYSTEM AND METHOD

Номер: US20130126489A1
Автор: BUSCHULTE RAINER
Принадлежит: HIGHCON SYSTEMS LTD

A cardboard-handling system with a rule-die associated to a first drum and a counter die associated to a second drum for pre-treating cardboards. A cardboard-alignmentor on a first side of the rule-die and counter-die aligns and conveys a cardboard together with one or more synchronized-cardboard transferors toward a side-gripper conveyor. The side-gripper conveyor transfers the cardboard toward and through the rule-die and counter-die drums for pre-treatment of the cardboard. Next the side-gripper conveyor conveys the cardboard toward and through a laser-treatment module to be further pre-treated. The side gripper conveyor movement is synchronized with a laser-treatment module for which a base with a plurality of protruding elements has moving capabilities and is synchronized with the side-gripper conveyor (via a timing belt for example). 1. A laser-treatment module , comprising:a laser; andan under-laser raiser comprising: a base with a plurality of protruding elements;wherein one or more cardboards are placed on a top surface of one or more of the protruding elements and a beam from the laser pre-treats the cardboard.2. The laser-treatment module of claim 1 , further comprising a coupling mechanism that couples the one or more cardboards to the top surface of the protruding elements.3. The laser-treatment module of claim 2 , wherein the coupling mechanism comprises a suction mechanism substantially beneath the base.4. The laser-treatment module of claim 2 , wherein the coupling mechanism comprises: air flowing toward a cardboard in substantially perpendicular to the top surface of the cardboard.5. The laser-treatment module of claim 4 , wherein the dynamic-shape shutter comprise a plurality of shafts linked together as a blanket and wrapped around a pivot.6. The laser-treatment module of claim 4 , wherein the size of the top surface of the protruding elements minimizes heating when in contact with the beam from the laser.7. The laser-treatment module of claim 2 , ...

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Номер записи: 85
30-05-2013 дата публикации

Electrosurgical unit with micro/nano structure and the manufacturing method thereof

Номер: US20130138103A1
Автор: Cen-Ying Lin, Chung-Wei Cheng, Keng-Liang Ou, Pei-Wen PENG, Weng-Peng TSENG
Принадлежит: Industrial Technology Research Institute ITRI, Taipei Medical University TMU

An electrosurgical unit having micro/nano structure formed thereon and the manufacturing method thereof are disclosed, in which the electrosurgical unit is formed by the irradiation of a laser beam upon a blade so as to have a hybrid of micro/nano elements formed on the surface of the blade. The application of the hybrid of micro/nano elements on the surface of the blade has proven to be a valuable asset not only in providing a non-stick surface and a good heat dissipation ability to the blade, but also in providing a electrosurgical blade that will not release any toxic material under high temperature.

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Номер записи: 86
06-06-2013 дата публикации

DEPOSITION OF SUPERALLOYS USING POWDERED FLUX AND METAL

Номер: US20130140278A1
Автор: Bruck Gerald J., Kamel Ahmed
Принадлежит:

A method for depositing superalloy materials. A layer of powder () disposed over a superalloy substrate () is heated with an energy beam () to form a layer of superalloy cladding () and a layer of slag (). The layer of powder includes flux material and alloy material, formed either as separate powders or as a hybrid particle powder. A layer of powdered flux material () may be placed over a layer of powdered metal (), or the flux and metal powders may be mixed together (). An extrudable filler material () such as nickel, nickel-chromium or nickel-chromium-cobalt wire or strip may be added to the melt pool to combine with the melted powder to give the superalloy cladding the composition of a desired superalloy material. 1. A method comprising:cleaning a surface of a superalloy substrate, the superalloy substrate comprising a composition beyond a zone of weldability defined on a graph of superalloys plotting titanium content verses aluminum content, wherein the zone of weldability is upper bounded by a line intersecting the titanium content axis at 6 wt. % and intersecting the aluminum content axis at 3 wt. %;pre-placing or feeding a layer of powdered material comprising flux material and metal material onto the cleaned surface;melting the powdered material into a melt pool and floating slag layer, the melt pool having a composition of a desired superalloy material comprising a composition beyond the zone of weldability;allowing the melt pool and slag layer to cool and solidify, leaving a layer of the desired superalloy material clad over the superalloy substrate; andpost weld heat treating the clad superalloy material and substrate superalloy material without weld solidification cracking and strain age cracking.2. The method of claim 1 , further comprising:pre-placing the layer of powdered material as mixed flux and superalloy powder to a depth from 2.5 to 5.5 mm; andmelting the powdered material with laser energy at a power level from 0.6 to 2 kilowatts using ...

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Номер записи: 87
06-06-2013 дата публикации

LASER RE-MELT REPAIR OF SUPERALLOYS USING FLUX

Номер: US20130140279A1
Автор: Bruck Gerald J., Kamel Ahmed
Принадлежит:

A method of repairing service-induced surface cracks () in a superalloy component (). A layer of powdered flux material () is applied over the cracks and is melted with a laser beam () to form a re-melted zone () of the superalloy material under a layer of slag (). The slag cleanses the melt pool of contaminants that may have been trapped in the cracks, thereby eliminating the need for pre-melting fluoride ion cleaning. Optionally, alloy feed material may be applied with the powdered flux material to augment the volume of the melt or to modify the composition of the re-melted zone. 1. A method comprising:applying powdered flux material to a surface of a superalloy substrate containing a defect;traversing an energy beam across the surface to form a re-melted zone in the substrate covered by an overlying slag layer; andallowing the re-melted zone to solidify under the slag layer to form a repaired surface free of the defect.2. The method of claim 1 , wherein the energy beam is a laser beam.3. The method of claim 1 , further comprising applying a filler material to the surface during the step of traversing an energy beam such that melted filler material is additive to the re-melted zone.4. The method of claim 3 , further comprising applying the filler material to the surface as powdered alloy material.5. The method of claim 4 , wherein a mesh size range of the powdered alloy material overlaps with a mesh size range of the powdered flux material.6. The method of claim 3 , further comprising applying the filler material as wire or strip material.7. The method of claim 1 , wherein the superalloy substrate comprises a composition beyond a zone of weldability defined on a graph of superalloys plotting titanium content verses aluminum content claim 1 , wherein the zone of weldability is upper bounded by a line intersecting the titanium content axis at 6 wt. % and intersecting the aluminum content axis at 3 wt. %.8. The method of claim 1 , further comprising applying heat to ...

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Номер записи: 88
06-06-2013 дата публикации

Discontinuous section tower tube

Номер: US20130140868A1
Автор: Masroor Fahim, Peter James Moegling, Robert Joseph Hazlewood, Todd Rupert Muck
Принадлежит: Toyota Motor Engineering and Manufacturing North America Inc

A belt integrated seat tower for a seat system. The seat tower can include a single piece of bent sheet metal in the form of an elongated discontinuous section tube having a first longitudinal edge and a second longitudinal edge adjacent to the first longitudinal edge. A butt weld can join the first and second longitudinal edges to form a lapless seam and a generally flat weld surface.

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Номер записи: 89
06-06-2013 дата публикации

PROCESS AND APPARATUS FOR APPLYING LAYERS OF MATERIAL TO A WORKPIECE MADE OF TIAL

Номер: US20130143068A1
Автор: Dudziak Sonja, Grueninger Albert, Hanrieder Herbert, Richter Karl-Hermann
Принадлежит: MTU AERO ENGINES GMBH

A method for depositing material layers on a workpiece made of a material which contains a titanium aluminide includes the steps of preparing the workpiece; heating the workpiece in a localized region by induction to a predefined preheating temperature; and depositing an additive, preferably in powder form, on the heated surface of the workpiece by build-up welding, in particular laser build-up welding, plasma build-up welding, micro-plasma build-up welding, TIG build-up welding or micro-TIG build-up welding; said additive including a titanium aluminide. 117-. (canceled)18. A method for depositing at least one layer of material on a workpiece made of a material including a titanium aluminide , the method comprising the steps of:heating the workpiece in a localized region by induction to a predefined preheating temperature, the heating creating a heated surface of the workpiece; anddepositing an additive including titanium aluminide on the heated surface of the workpiece by build-up welding.19. The method as recited in wherein the build-up welding includes at least one of: laser build-up welding claim 18 , laser powder build-up welding claim 18 , plasma build-up welding claim 18 , micro-plasma build-up welding claim 18 , TIG build-up welding and micro-TIG build-up welding20. The method as recited in wherein the additive is in powder form.21. The method as recited in wherein the preheating temperature is at or above a critical temperature of a brittle-ductile phase transition of the material.22. The method as recited in wherein the preheating temperature is between 700° C. and 800° C.23. The method as recited in wherein the preheating temperature is below a predetermined second critical temperature of the material.24. The method as recited in wherein the additive includes a hard material.25. The method as recited in wherein the content of hard material in the additive is between 15% and 90%.26. The method as recited in wherein the hard material is titanium carbide.27. ...

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Номер записи: 90
13-06-2013 дата публикации

METHODS AND SYSTEMS FOR USE IN LASER MACHINING

Номер: US20130146570A1
Автор: Bertch Timothy C., Carmichael James A., Forsman Andrew C., Johnson Billy L., Lundgren Erik H., Moeller Charles P.
Принадлежит: General Atomics

The present embodiments providing methods, systems and apparatuses of protecting a surface during laser machining. In some embodiments, a method of protecting a surface during laser machining comprises: directing a fluid into a cavity of an object being laser machined, where the fluid does not have laser absorption properties; and directing a plurality of laser pulses at a wall of the object being laser machined, where the laser pulses are configured to form a hole through the wall such that at least one laser pulse passes through the hole and enters the cavity while the fluid is directed into the cavity such that the laser pulse is incident on the fluid and a surface together in order to inhibit backwall damage. 1. A method of protecting a surface during laser machining , comprising:directing a fluid into a cavity of an object being laser machined, where the fluid does not have laser absorption properties; anddirecting a plurality of laser pulses at a wall of the object being laser machined, where the laser pulses are configured to form a hole through the wall such that at least one laser pulse passes through the hole and enters the cavity while the fluid is directed into the cavity such that the laser pulse is incident on the fluid and a surface together in order to inhibit backwall damage.2. The method of claim 1 , further comprising:positioning a protection substrate having the surface within the cavity such that the laser pulse passing through the hole and into the cavity is incident upon the surface of the protection substrate; andwherein the directing the fluid into the cavity comprises directing the fluid to be in contact with the surface of the protection substrate upon which the laser pulse is incident.3. The method of claim 2 , wherein the positioning the protection substrate comprises:positioning a fluid redirecting element juxtaposed to the protection substrate;directing the fluid to be in contact with the surface of the protection substrate comprises ...

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Номер записи: 91
13-06-2013 дата публикации

Anti-spatter composition

Номер: US20130146571A1
Автор: Gigi P. Streeter, James M. Noe, Michael G. Palmiter
Принадлежит: Barnes Group Inc

An anti-spatter composition for use with the laser cutting of titanium or titanium containing materials. The anti-spatter composition includes Lecithin and one or more organic solvents. The one or more organic solvents are absent halogen and halogen containing compound. The anti-spatter composition can also include surfactant and water. The surfactant is generally halogen free.

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Номер записи: 92
13-06-2013 дата публикации

LASER CUTTING DEVICE AND LASER CUTTING METHOD

Номер: US20130146572A1
Автор: Watanabe Masao
Принадлежит:

An object is to obtain a laser cutting device and a laser cutting method with which a thick processing item can be cut by using laser light whose wavelength is shorter than that of COlaser light. With a laser cutting device (), a laser emitting unit () emits a laser beam (YAG-based laser light whose wavelength is shorter than that of COlaser light) for cutting a processing item (), an optical system () focuses the laser beam so that the laser beam has an elliptical cross-sectional shape and so that a long-axis direction of the ellipse is aligned with a direction in which cutting of the processing item () progresses, and thus, the elliptically-focused laser beam contributes to raising the temperature of a molten pool inside the processing item (). 1. A laser cutting device comprising:{'sub': '2', 'an emitting unit for emitting a laser beam for cutting a processing item that has a thickness to form a molten pool inside thereof when irradiated with a laser beam, whose wavelength is shorter than that of COlaser light; and'}a focusing unit for focusing the laser beam so that the laser beam emitted from the emitting unit has an elliptical cross-sectional shape and so that a long-axis direction of the ellipse is aligned with a direction in which cutting of the processing item progresses.2. The laser cutting device according to claim 1 , wherein the focusing unit includes:a cylindrical lens that focuses the laser beam so that the laser beam emitted from the emitting unit has an elliptical cross-sectional shape; anda rotating unit for rotating the cylindrical lens so that a long-axis direction of the laser beam focused by the cylindrical lens is aligned with the direction in which cutting of the processing item progresses.3. The laser cutting device according to claim 1 , wherein the laser beam is fiber laser light.4. The laser cutting device according to claim 1 , wherein the laser beam is disk laser light.5. A laser cutting method comprising:{'sub': '2', 'a first stage of ...

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Номер записи: 93
20-06-2013 дата публикации

OVERLAY WELDING METHOD AND OVERLAY WELDING APPARATUS

Номер: US20130153543A1
Автор: Tsubota Shuho, Tsuruta Yohei
Принадлежит: MITSUBISHI HEAVY INDUSTRIES, LTD.

To facilitate overlay welding while securing a certain hardness of an overlaid portion and preventing welding defects, an overlay welding method for performing overlay welding on a surface P to be overlaid of a base material includes a preparing step of forming a bottomed depression with the surface P to be overlaid being a circumferential surface thereof, and an overlaying step at which a filler material is fed toward a bottom face of the depression and a laser beam as a heat source is irradiated on the bottom face of the depression to which the filler material is fed, thereby forming an overlaid portion W reaching the surface P to be overlaid, while filling the bottom face of the depression with a melted filler material. 1. An overlay welding method for performing overlay welding on a surface to be overlaid of a base material , the method comprising:a preparing step of forming a bottomed depression, with the surface to be overlaid being a circumferential surface thereof; andan overlaying step at which a filler material is fed toward a bottom face of the depression, and a laser beam as a heat source is irradiated on the bottom face of the depression to which the filler material is fed, thereby forming an overlaid portion reaching the surface to be overlaid, while filling the bottom face of the depression with the melted filler material.2. The overlay welding method according to claim 1 , wherein a new overlaid portion is further layered on the formed overlaid portion at the overlaying step.3. The overlay welding method according to claim 1 , wherein the filler material is heated and fed at the overlaying step.4. The overlay welding method according to claim 1 , wherein at the overlaying step claim 1 , the base material is preheated before forming the overlaid portion claim 1 , and the base material is post-heated after the overlaid portion is formed.5. The overlay welding method according to claim 1 , wherein at the overlaying step claim 1 , feeding of the filler ...

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Номер записи: 94
20-06-2013 дата публикации

REOPENING OF COOLING-AIR BORES USING A NANOSECOND LASER IN THE MICROSECOND RANGE

Номер: US20130153548A1
Автор: Massa Andrea, Wilkenhöner Rolf, Wollnik Adrian
Принадлежит:

A process for reopening cooling-air holes by a laser in order to remove coat down is provided. A nanosecond laser is provided and used for reopening the holes, wherein pulse times between 1 μs and 20 μs and a pulse frequency between 20 kHz and 40 kHz provided by the nanosecond laser are used. 1. A process for reopening cooling-air holes by a laser in order to remove coat down , comprising:providing and using a nanosecond laser, andopening holes with the nanosecond laser in order to remove coating material,wherein pulse times between 1 μs and 20 μs and a pulse frequency between 20 kHz and 40 kHz, provided by the nanosecond laser, are used.2. The process as claimed in claim 1 , wherein pulse times of 10 μs are used.3. The process as claimed in claim 1 , wherein a pulse frequency of 30 kHz is used.4. The process as claimed in claim 1 , wherein a laser power between 180 W and 200 W is used.5. The process as claimed in claim 1 , wherein the nanosecond laser is an ablation laser claim 1 , and wherein the ablation laser is moved over a surface to be removed at a feed rate of between 200 mm/s and 300 mm/s claim 1 , in particular at 250 mm/s.6. The process as claimed in claim 1 , wherein a cylindrical part is cleared away from a first coat down claim 1 , and wherein a diffuser region is cleared away from a second coat down.7. The process as claimed in claim 6 , wherein the nanosecond laser is used with pulse times of less than 800 ns claim 6 , in particular less than 600 ns claim 6 , for removal of the second coat down from the diffuser region.8. The process as claimed in claim 6 , wherein the nanosecond laser is used with identical laser parameters for removal of the first coat down from the cylindrical part and for removal of the second coat down from the diffuser region.9. The process as claimed in claim 6 , wherein the first and/or second coat downs are removed in layers.10. The process as claimed in claim 6 , wherein metallic and/or ceramic coat downs are removed. This ...

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Номер записи: 95
20-06-2013 дата публикации

APPARATUS AND METHOD FOR THE INTERFERENCE PATTERNING OF PLANAR SAMPLES

Номер: US20130153553A1
Автор: LASAGNI Andres Fabian
Принадлежит: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.

Apparatus for interference patterning of a planar sample including a laser and a focusing arrangement positioned in a beam path of the laser so that the laser beam is imaged in a first spatial direction in a focused manner into a sample volume in which the planar sample is positioned. An expanding and splitting arrangement is positioned downstream of the focusing arrangement for the laser beam, whilst maintaining the focused imaging in a first spatial direction which can be expanded in a second spatial direction, and which can be split into two partial beams. These two partial beams can be directed onto the sample volume. 1. Apparatus for the interference patterning of a planar sample (P) comprising{'b': '1', 'a laser (),'}{'b': 2', '1', '3, 'a focusing arrangement () positioned in the beam path of the laser (), by means of which focusing arrangement the laser beam (L) can be imaged in a first spatial direction (y) in a focused manner into a sample volume () in which the planar sample (P) can be positioned or is positioned,'}{'b': 4', '2', '3, 'claim-text': can be expanded in a second spatial direction (x, w), which is not parallel to the first spatial direction (y), and is preferably orthogonal to the first spatial direction (y),', {'b': 1', '2, 'can be split into two partial beams (L, L)'}], 'an expanding and splitting arrangement () positioned downstream of the focusing arrangement () in the beam path, by means of which expanding and splitting arrangement the laser beam (L), whilst maintaining the focused imaging into the sample volume () in the first spatial direction (y)'} {'b': 1', '2', '3', '1', '2', '3', '5, 'in the form of these two partial beams (L, L) can be directed onto the sample volume () such that the two partial beams (L, L) interfere within the sample volume () in an interference region ().'}, 'and'}2. Apparatus according to claim 1 ,characterized in that{'b': 2', '9', '3, 'the focusing arrangement () is a beam-cross-section-altering focusing ...

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Номер записи: 96
20-06-2013 дата публикации

Fibre optic laser machining equipment for etching grooves forming incipient cracks

Номер: US20130153554A1
Автор: Bruno Frei, Rudolf Von Niederhaeusern, Ulrich Duerr
Принадлежит: Rofin Lasag AG

A laser machining equipment for etching grooves in a wall of a mechanical part, or in a connecting rod for a spark ignition engine, includes a fiber optic laser device arranged to supply laser pulses. The fiber optic laser device is controlled so that laser pulses have a peak power of more than 400 W and at least two times greater than maximum mean power of the laser device, and duration of the laser pulses is below or within the nanosecond range of 1 ns to 1000 ns. The fiber optic laser device can be controlled in a quasi continuous wave (QCW) mode, or can be controlled in a Q-switch mode. The selected operating modes increase machining efficiency and produce a groove with an optimum transverse profile, particularly with a small mean radius of curvature at a bottom of the groove which then allows precise subsequent fracturing of the mechanical part with less force.

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Номер записи: 97
20-06-2013 дата публикации

PROCESS FOR LASER MACHINING A LAYER SYSTEM HAVING A CERAMIC LAYER

Номер: US20130153555A1
Автор: KILIANI STEFAN WERNER, LADRU FRANCIS-JURJEN
Принадлежит:

A process of laser machining a layer system is provided. The layer system has at least one metallic substrate and an outer ceramic layer. After laser machining the layer system, a layer thickness of the outer ceramic layer is reduced by a laser process and/or a smoothing process. The laser machining includes creating a plurality of passage holes using a diffuser. 1. A process of laser machining a layer system , comprising:providing a layer system with at least one metallic substrate and an outer ceramic layer,laser machining the layer system,reducing a layer thickness of the outer ceramic layer,wherein the laser machining comprises creating a plurality of passage holes using a diffuser.2. The process as claimed in claim 1 , wherein a laser process is used for the reducing of the layer thickness of the outer ceramic layer.3. The process as claimed in claim 1 , wherein a smoothing process is used for reducing the layer thickness of the layer.4. The process as claimed in claim 1 , wherein the layer thickness of the outer ceramic layer is reduced by 30 μm to 80 μm.5. The process as claimed in claim 1 , wherein the laser machining of the layer system is performed without masking the outer ceramic layer.62. The process as claimed in claim 1 , wherein the layer thickness of the outer ceramic layer is reduced between 30 μm and 80 μm.7. The process as claimed in claim 6 , wherein the laser machining of the layer system is performed without masking the outer ceramic layer. This application claims priority of European Patent Application No. 11193801.5 EP filed Dec. 15, 2011. All of the applications are incorporated by reference herein in their entirety.A process of laser machining of a layer system which has a ceramic layer is provided.High-temperature components, such as turbine blades or vanes, have an outer ceramic layer for thermal insulation. This ceramic thermal barrier coating is applied to a metallic adhesion promoter layer or a metallic substrate. Furthermore, passage ...

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Номер записи: 98
27-06-2013 дата публикации

Laser Cavity Exhibiting Low Noise

Номер: US20130161295A1
Автор: Tominaga Keisuke
Принадлежит: OFS FITEL, LLC

Inventive single cavities for use in a high power fiber laser systems are described that include a high reflective grating, a gain fiber, an output coupler having a bandwidth in the range of 1 nm to 2 nm; and an output fiber connected to the single cavity that supplies power from the single cavity. The single cavity can be used in a wide variety of applications, including welding, cutting, brazing or drilling a material, or to seed a downstream amplifier. 1. A cavity for use in a high power fiber laser system , comprising:a reflective grating;a gain fiber;an output coupler, the output coupler having a bandwidth in the range of 1 nm to 2 nm; andan output fiber connected to the single cavity laser that supplies power from the single cavity.2. The cavity of claim 1 , further comprising a pump diode.3. The cavity of claim 1 , wherein the bandwidth of the output coupler is in the range of 1.2 nm to 2 nm.4. The cavity of claim 1 , wherein the bandwidth of the output coupler is in the range of 1.4 to 2 nm.5. The cavity of claim 1 , wherein the bandwidth of the output coupler is in the range of 1.6 to 2 nm.6. The cavity of claim 1 , wherein the high reflective grating and the output coupler comprise Bragg gratings.7. The cavity of claim 1 , wherein the output fiber is a multimode fiber.8. The cavity of claim 1 , further comprising a pump source to introduce pump light into the gain fiber claim 1 , the pump source comprising a plurality of pump diodes connected to the single cavity through a pump combiner.9. The cavity of claim 8 , wherein the wavelengths of the pump diodes are in the range of 900 nm to 990 nm.10. The cavity of claim 8 , wherein the number of longitudinal modes in the laser cavity is increased compared to a system that uses an output coupler having a lower bandwidth.11. The cavity of claim 10 , wherein nonlinear effects caused by Stimulated Raman scattering are reduced compared to a single cavity laser that uses an output coupler having a lower bandwidth.12. ...

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Номер записи: 99
27-06-2013 дата публикации

APPARATUS FOR THE SELECTIVE SEPARATION OF TWO LAYERS OF MATERIAL USING AN ULTRASHORT PULSE SOURCE OF ELECTROMAGNETIC RADIATION

Номер: US20130164506A1
Автор: Clark William George
Принадлежит:

A direct-write apparatus and end use device for selective separation of at least one layer of material from another layer of material at the interface between them using a beam of electromagnetic radiation from an ultrashort pulse source is disclosed. 1. An apparatus for separating at least one layer of material from another layer of material comprising: an ultrashort pulse source of electromagnetic radiation generating a beam consisting of at least one pulse and at least one component selected from a group comprising at least one element to direct the beam to an interface , at least one element chosen to shape the spatial profile of the beam , at least one element to shape the temporal profile of the beam , at least one element to control the polarization of the beam , at least one element to control the beam pointing direction , at least one element to control the fluence of the pulse incident on an interface between at least two layers of material , at least one element to move the beam in any direction with respect to the interface , and at least one controller to control the beam so that at least one layer of material is separated from the other layer of material at the interface in a predetermined pattern.2. The apparatus of claim 1 , wherein the ultrashort pulse source of electromagnetic radiation generates a beam of pulses with pulse width chosen to be in the range of between 10 femtoseconds and 1 picosecond claim 1 , one picosecond claim 1 , or between 1 picosecond and 100 picoseconds.3. The apparatus of further comprising an ultrashort pulse source of electromagnetic radiation includes a diode pumped or CW lamp pumped solid state source preferably of pulse width ranging from 1 fs to 100 ps claim 1 , pulse energy 1 nanoJoule to 1 milliJoule and the pulse repetition rate in a range of 1 Hz to 5 gigahertz (GHz.)4. The apparatus of wherein the ultrashort pulse source of electromagnetic radiation has a center wavelength of operation chosen to be within the ...

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Номер записи: 100