СПОСОБ ИЗГОТОВЛЕНИЯ ПОВЕРХНОСТНОГО ПОКРЫТИЯ С ТИСНЕНОЙ ПЕЧАТНОЙ ПОВЕРХНОСТЬЮ

Настоящее изобретение относится к способу изготовления поверхностного покрытия с тисненой печатной поверхностью. Подложку (16) непрерывно перемещают через производственную линию, при этом на упомянутой подложке (16) сначала выполняют печатный узор в печатном оборудовании (12), и затем в устройстве (14) для тиснения выполняют тисненый узор, совмещенный с печатным узором. Печатное оборудование (12) изготавливает печатный узор в линию с изготовлением тисненого узора. В процессе печати в печатном оборудовании (12) печатный узор растягивают или сжимают, динамически реагируя на индикаторы несовпадения печатного узора и тисненого узора так, чтобы корректировать или предотвращать эти несовпадения. Также настоящее изобретение относится к производственной линии для осуществления этого способа. Техническим результатом изобретения является корректировка и предотвращение деформации печатного узора. 2 н. и 13 з.п. ф-лы, 5 ил.

СПОСОБ ЗАМЕНЫ ЗАЩИТНОГО СТЕКЛА ДИСПЛЕЙНОГО МОДУЛЯ ДЛЯ МОБИЛЬНЫХ УСТРОЙСТВ

Изобретение относится к способу замены поврежденного защитного стекла дисплейного модуля для мобильных устройств. Техническим результатом является повышение безопасности замены защитного стекла дисплейного модуля для сохранения работоспособности дисплея и обеспечение качества дисплейного модуля после ремонта на уровне, присущем заводскому, а также повышение эффективности способа, в том числе за счет сокращения времени ремонта. Технический результат достигается способом замены защитного стекла дисплейного модуля, который включает демонтаж состоящего из функционального компонента и защитного стекла дисплейного модуля из рамы, снятие поврежденного стекла с дисплея, очистку поверхности дисплея от остатков клея, доочистку дисплея от пыли, скрепление неповрежденного стекла с дисплеем посредством клея и удаление остатков воздуха между неповрежденным стеклом и дисплеем. При этом перед демонтажом дисплейного модуля из рамы и снятием поврежденного стекла с дисплея, заклеивают скотчем поврежденную ...

СПОСОБ РЕМОНТА РАССЛОЕНИЙ В ИЗДЕЛИИ, ВЫПОЛНЕННОМ ИЗ КОМПОЗИЦИОННОГО МАТЕРИАЛА

Изобретение относится к способам ремонта расслоений в изделиях, выполненных из композиционных материалов. Способ ремонта расслоений в изделии, выполненном из композиционного материала, заключается в том, что в зоне расслоения сверлят одно отверстие на глубину 0,7-0,8 толщины стенки изделия, соединяют его со штуцером подачи технологического газа, затем подают газ низкого давления в указанное отверстие, далее в зоне расслоения сверлят другие отверстия, с шагом 100 -150 мм, на глубину фактического залегания расслоения до выхода газа через эти отверстия, затем каждое просверленное отверстие закрывают пробкой, после просверливания достаточного количества отверстий пробки и штуцер из указанных отверстий удаляют, затем через одно или несколько отверстий закачивают адгезив до тех пор, пока он не пойдет из всех отверстий далее адгезив полимеризуют. Указанный способ позволяет сохранить структуру материала и его прочностные характеристики. 1 ил.

УПАКОВКА

... 1. Легко открываемая упаковка, содержащая: ! две расположенные на расстоянии друг от друга первую и вторую стенки, выполненные и соединенные друг с другом для образования полости между ними, ! указанные стенки, имеющие периферийные кромки и герметично соединенные вместе на периферийном соединении, по существу, вдоль кромок, причем часть указанного периферийного соединения включает, по меньшей мере, две проводящие поверхности и электрически размягчаемый адгезив, ! причем, по меньшей мере, две проводящие поверхности в направлении от полости к периферийному соединению, по меньшей мере, частично проходят за первую и вторую стенки, и ! при этом проводящие поверхности выполнены с возможностью пропускания через устройство подачи напряжения. ! 2. Упаковка по п.1, в которой стенки содержат, по меньшей мере, один проводящий полимер. ! 3. Упаковка по любому из пп.1 и 2, в которой первая проводящая поверхность расположена на первой стенке, а вторая проводящая поверхность расположена на второй стенке ...

Kühlvorrichtung und Verfahren zum Kühlen eines aus mehreren Schichten bestehenden Laminatverbundes

Kühlvorrichtung für einen aus mehreren Schichten bestehenden Laminatverbund (14),- mit einem Gehäuse (19), welches eine Transportstrecke zumindest teilweise umgibt, entlang welcher der zumindest eine Laminatverbund (14) verfahren wird,- mit einer an dem Gehäuse (19) vorgesehenen Eingangsöffnung (21) und Ausgangsöffnung (22), und- mit beidseitig zur Transportstrecke in dem Gehäuse (19) angeordneten Kühleinrichtungen (28, 29), welche gemeinsam zumindest eine Luftströmung erzeugen, welche die Transportstrecke kreuzt und eine Kühlstrecke für den zumindest einen Laminatverbund (14) bildet.

PROCEDURE FOR GLUING A CONSTRUCTION UNIT A GEGENFLÄCHE AND DEVICE ON FOR ITS EXECUTION

PROCESS FOR THE PRODUCTION OF IMPROVED METALLIZED FILMS

Improved metallized films are produced by transferring a protective layer onto a metal layer from the side of the film remote from the metal layer. The transfer preferably takes place in the metallizer shortly after metallization and before the metal layer is exposed to the atmosphere which reduces the tendency of the metal to oxidize leading to a purer metal layer with enhanced barrier properties.

METHOD OF APPLYING AUTOMOTIVE PRIMER-SURFACER USING A SQUEEGEE

A method for refinishing a damaged area of a substrate, such as an existing finish on a vehicle which includes the steps of preparing a damaged area for refinishing, by cleaning and/or sanding, providing a multi-component coating composition which includes at least two components having functional groups reactive with each other in a crosslinking reaction and spreading the coating composition onto the area to be refinished using a squeegee applicator.

METHODS OF REFURBISHING AN ADHERED COMPONENT AND COMPOSITES COMPRISING ADHERED COMPONENTS

A composite comprising adhered components and method of refurbishing such composites are described herein. The composite includes a first component, a second component, and the first component being adhered to the second component using an adhesive stack. The adhesive stack comprises a first adhesive-impregnated scrim layer disposed between the first component and the second component and a bulk adhesive layer disposed between the first component and the second component.

A DELAMINABLE PACKAGING LAMINATE AND A METHOD OF PRODUCING THE SAME

The disclosure relates to a laminated packaging material (10) comprising a layer (11) of paper or paperboard and outer, liquid-tight coatings (12, 13) of plastic on both sides of the paper or paperboard web (11). In order to facilitate material recycling after use of the laminated packaging material (10), the packaging material (10) is provided with layers (14, 15) of watersoluble polymer between the paper or paperboard layer (11) and each respective outer plastic coating (12, 13), the layers (14, 15) serving as adhesive or binder. At the same time as the adhesive or binder layers (14, 15) bond together the individual layers with good adhesion for the formation of a wellintegrated packaging material, they make possible the ready separation or delamination of the packaging material after use, by treatment of the material, preferably comminuted into smaller pieces, with hot water at approximately 40-60 ~C, whereby the adhesive or binder layers (14, 15) are dissolved and leave behind easily ...

Butt joint for plates and/or profiles

The butt joint has a connector (3) in two vertical grooves (14,24) forming a cavity along the butt ends (40,42) of the plates (1,2) and/or profiles (1a,2a). Two shreaders are flat on the outside and are stuck to the corresponding walls (121,131,221,231) of the grooves. They can be moved towards the cover surfaces (122,132,222,232) of the plates, or profiles. Spring biased member detachably lock the spreaders in the grooves.

Procedure for treating the surface of GRP components plates.

Die Erfindung betrifft ein Verfahren zum Behandeln von zerkratzten oder porösen Oberflächen von Faserverbundplatten, vorzugsweise von Schaltafeln, die aus einer Luftporen enthaltenden Kernschicht aus glasfaserverstärktem Polypropylen und kompakten Deckschichten aus glasfaserverstärktem Polypropylen bestehen, wobei man auf die zerkratzte oder poröse Oberfläche eine Polypropylenfolie heiss aufpresst.

Method for through repair of a composite structure comprising three skins and two core layers

The invention concerns a composite structure consisting of two outer skins (2, 3) and an inner core (1) therebetween, wherein a portion (6) of one of the outer skins (2) must be replaced, with pressure of a backing block (8) and suction. The repair is carried out by drilling a venting hole (14) in the opposite outer skin (3) to evacuate the air in the cells of the core (1), thereby enhancing the bonding of the new portion (6) on the core (1).

PROCESS OF REPAIR Of an ACOUSTIC PANEL Of ATTENUATION

PROCEEDED OF CROSSING REPAIR OF COMPOSITE STRUCTURE HAS THREE SKINS AND TWO LAYERS Of HEART

PROCEEDED OF CROSSING REPAIR OF COMPOSITE STRUCTURE HAS THREE SKINS AND TWO LAYERS Of HEART

PROCEEDED OF CROSSING REPAIR OF COMPOSITE STRUCTURE HAS THREE SKINS AND TWO LAYERS Of HEART

HEATED SHOWERHEAD ASSEMBLY

... 본 발명은 일반적으로, 처리 가스를 처리 챔버의 내측으로 공급하는데 사용될 수 있는 가열식 샤워헤드 조립체를 포함한다. 처리 챔버는 에칭 챔버일 수 있다. 처리 가스가 처리 챔버로부터 배기될 때, 기판의 균일한 처리가 어려울 수 있다. 처리 가스가 기판으로부터 멀리 그리고 진공 펌프 쪽으로 흡인되기 때문에, 에칭의 경우에 플라즈마가 기판 전체에 걸쳐 균일하지 않을 수 있다. 불균일한 플라즈마는 불균일한 에칭을 초래할 수 있다. 불균일한 에칭을 방지하기 위해, 샤워헤드 조립체는 각각, 독립적으로 제어가능한 가스의 유입과 온도를 제어할 수 있는 두 개의 영역으로 분리될 수 있다. 제 1 영역은 기판의 주변부에 대응하지만 제 2 영역은 기판의 중앙에 대응한다. 샤워헤드의 영역들을 통해 온도와 가스 유동을 독립적으로 제어함으로써, 기판의 에칭 균일도가 증가될 수 있다.

METHOD FOR MANUFACTURING LAMINATED BODY

Apparatus and process for producing laminated sheet

MULTILAYER OPTICAL FILM WITH MELT ZONE TO CONTROL DELAMINATION

Polymeric multilayer optical films, and laminate bodies that include such films, are provided with a melt zone that extends between a first and second portion of the multilayer optical film. If a shearing operation or other external influence acts on the film in the first portion that causes delamination of individual layers of the multilayer optical film, the melt zone is effective to prevent the delamination from propagating from the first portion to the second portion. The melt zone is characterized at least in part by a deformation of individual layers of the multilayer optical film. The melt zone can be positioned to extend along and proximate to some or all of a periphery of the multilayer optical film.

Process for producing a surface covering with an embossed printed surface

A process for producing a surface covering with an embossed printed surface is described. A substrate (16) is continuously moved through a production line, and this substrate (16) is first provided, in a printing equipment (12), with a printed pattern and thereafter, in an embossing equipment (14), with an embossed pattern, which is registered with the printed pattern. The printing equipment (12) produces the printed pattern in-line with the production of the embossed pattern. During printing in the printing equipment (12), the printed pattern is stretched or compressed, dynamically responsive to indicators of misalignments between the printed pattern and the embossed pattern, so as to correct or prevent the misalignments. A production line for carrying out this process is also proposed.

Method and apparatus for fabricating semiconductor device

A method of fabricating a semiconductor device includes preparing a semiconductor substrate having a surface and a mechanical strength; adhering a reinforcing plate to the surface of the semiconductor substrate with an adhesive to increase the mechanical strength of the semiconductor substrate and processing the semiconductor substrate; and immersing the semiconductor substrate with the reinforcing plate in a heated solvent to melt and dissolve the adhesive, thereby separating the semiconductor substrate from the reinforcing plate. An apparatus for performing the methods includes a holder for holding the semiconductor substrate with the reinforcing plate; a container for accommodating the holder and for containing a solvent that dissolves the adhesive and a heater for heating the solvent. When the adhesive between the semiconductor substrate and the reinforcing plate is sufficiently dissolved by the solvent, the semiconductor substrate is separated from the reinforcing plate. Therefore, ...

ENCAPSULATION FILM

Provided are an encapsulating film, an electronic device and a method of manufacturing the same. An encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided.

СПОСОБ КАПИТАЛЬНОГО РЕМОНТА КОМПОЗИТНОЙ КОНСТРУКЦИИ С ТРЕМЯ ОБШИВКАМИ И ДВУМЯ ВНУТРЕННИМИ СЛОЯМИ

Изобретение относится к способу капитального ремонта двойных многослойных композитных конструкций, содержащих два слоя ячеистого внутреннего заполнения между парой внешних обшивок и среднюю обшивку, расположенную между обоими внутренними слоями. Техническим результатом заявленного изобретения является сокращение времени, требуемого для ремонта, без ухудшения при этом качества. Технический результат достигается в способе капитального ремонта конструкции из композитного материала, содержащей последовательно первую внешнюю обшивку, первый ячеистый внутренний слой, среднюю обшивку, второй ячеистый внутренний слой, вторую внешнюю обшивку. При этом способ включает замену участков внешних обшивок, средней обшивки и внутренних слоев новыми участками. Затем на новый участок первой внешней обшивки и вокруг него накладывают жесткую прижимную форму. Потом осуществляют прижатие прижимной формой к конструкции из композитного материала. Затем проводят отверждение новых участков внешних обшивок и средней ...

Способ усиления защиты и устранения вредящих факторов установки дополнительного защитного стекла

Изобретение относится к способу усиления защиты дисплейного модуля смартфона или аналогичного устройства с дисплейным модулем. Способ характеризуется установкой дополнительного защитного стекла на основное защитное стекло дисплея устройства. После установки дополнительного защитного стекла на защитное стекло дисплейного модуля устройства по краям между дополнительным защитным стеклом и рамкой устройства или основным защитным стеклом дисплейного модуля равномерным слоем наносится ультрафиолетовый клей, вручную выравнивается для плавного перехода краёв дополнительного защитного стекла в рамку устройства или основное защитное стекло дисплейного модуля, после чего устройство проходит обработку ультрафиолетовым светом для отвердевания нанесенного ультрафиолетового клея. Технический результат изобретения заключается в том, что при застывании ультрафиолетового клея дополнительное защитное стекло по краям усиливается, вследствие чего обеспечивается амортизация краёв дополнительного защитного стекла ...

СПОСОБ РЕМОНТА ЗВУКОПОГЛОЩАЮЩЕЙ ПАНЕЛИ

... 1. Способ (200) ремонта звукопоглощающей панели (100), содержащей структурирующую оболочку (120) из металлического материала, резистивный слой (110) из металлического материала и ячеистую структуру (130) в качестве звукопоглощающего материала, наложенную непосредственно на структурирующую оболочку (120) и резистивный слой (110), отличающийся тем, что содержит по меньшей мере один этап (203), на котором в толщу указанной панели (100) вводят по меньшей мере один армирующий стержень (30), и этап (204, 206), на котором прикрепляют указанный стержень (30) посредством сварки в контролируемой атмосфере соответственно к структурирующей оболочке (120) и к резистивному слою (110).2. Способ по п.1, в котором прикрепляют указанный стержень (30) последовательно к резистивному слою (110) и к структурирующей оболочке (120) панели (100).3. Способ по п.1, в котором армирующий стержень (30) вводят поперек ячеистой структуры (130) и ориентируют перпендикулярно к плоскостям резистивного слоя (110) и структурирующей ...

УСТРОЙСТВО ГАЗОВОЙ ЗАЩИТЫ

... 1. Устройство газовой защиты, используемое на этапе сварки звукопоглощающей панели (100) в контролируемой атмосфере, содержащее средство инжекции инертного газа в указанную панель (100) и средство приема газовой горелки (40), отличающееся тем, что средство инжекции инертного газа содержит диффузор (54) инертного газа, установленный на периферии средства приема сварочной горелки (40).2. Устройство по п.1, отличающееся тем, что выполнено с возможностью взаимодействия со сварочной горелкой (40) и обеспечения сварки под прямым углом и на обратной стороне свариваемых поверхностей панели (100).3. Устройство по п.2, отличающееся тем, что средство приема сварочной горелки (40) имеет гнездо, выполненное с возможностью принимать в себя сварочную горелку (40) и обеспечивать возможность ее прохода через камеру указанного устройства, причем диффузор (54) имеет кольцо (541), установленное соосно с указанным гнездом, принимающим в себя сварочную горелку (40).4. Устройство по любому из пп.1-3, отличающееся ...

СОСТАВ ТКАНЕЙ, ВКЛЮЧАЮЩИЙ В СЕБЯ ЭЛАСТИЧНЫЕ ВОЛОКНА

... 1. Изделие, содержащее многонаправленную ткань из первых усиливающих прядей волокна, проходящих в первом направлении, и вторых усиливающих прядей волокна, проходящих во втором направлении, причем части нитей в первых прядях волокна проходят за пределы границы ткани и являются распределенными, а пряди внедрены в смолу.2. Изделие по п. 1, в котором нити во вторых прядях также проходят за пределы границы ткани и являются распределенными.3. Изделие по п. 1, в котором нити в пределах границы ткани обеспечивают структурную прочность вдоль первого и второго направлений, причем нити, проходящие за пределы границы, обеспечивают структурную прочность в только первом направлении.4. Изделие по п. 1, в котором ткань содержит несколько рядов связанных нитей, причем распределенные нити находятся в меньшем числе рядов.5. Изделие по п. 1, в котором ткань имеет ткацкое переплетение прядей.6. Изделие по п. 5, в котором нити, проходящие за пределы границы, разрежены таким образом, что не поддерживаются поперечными ...

КОМПОЗИЦИИ, ПРИГОДНЫЕ ДЛЯ ИСПОЛЬЗОВАНИЯ В КАЧЕСТВЕ СОСТАВОВ ДЛЯ ЗАДЕЛКИ ШВОВ, И СВЯЗАННЫЕ С НИМИ СПОСОБЫ

... 1. Композиция, содержащая воду, наполнитель, включающий один или несколько материалов из карбоната кальция, сульфата кальция дигидрата или сульфата кальция полугидрата, связующее, и, опционально, биоцид, при этом кондиционированный образец композиции свободен от формальдегида через 24 ч. ! 2. Композиция по п.1, отличающаяся тем, что композиция представляет собой композицию отверждающегося типа, дополнительно содержащую замедлитель схватывания в количестве, составляющем от примерно 0,01 до примерно 10 мас.%, при этом сульфат кальция полугидрат присутствует в количестве, составляющем от примерно 40 до примерно 90 мас.%, а связующее присутствует в количестве, составляющем от примерно 0,1 до примерно 15 мас.%. ! 3. Композиция по п.1, отличающаяся тем, что композиция представляет собой композицию высыхающего типа, которая по существу свободна от сульфата кальция полугидрата, и содержит от примерно 20 до примерно 95 мас.% сульфата кальция дигидрата, карбоната кальция или их смеси, при этом связующее ...

СПОСОБ ОБНОВЛЕНИЯ МНОГОСЛОЙНОЙ СТРУКТУРЫ

... 1. Неразрушающий способ обновления защитного слоя, нанесенного на подложку, включающий стадиюэлектрохимического восстановления слоя термически выращенного оксида, распложенного поверх подложки и защитного слоя, при электрохимических условиях, достаточных для того, чтобы свести к минимуму или устранить слой термически выращенного оксида.2. Способ по п.1, в котором стадию электрохимического восстановления проводят путем приложения к слою термически выращенного оксида внешнего напряжения в диапазоне от приблизительно 0,5 В до приблизительно 20 В.3. Способ по п.1, в котором стадия электрохимического восстановления дополнительно включает стадию нагревания защитного слоя и подложки в температурных условиях, достаточных для того, чтобы вызвать диффузию ионов оксида из слоя термически выращенного оксида в защитный слой.4. Способ по п.1, включающий присоединение первого электрода к электропроводному материалу, нанесенному на защитный слой, для обеспечения электрохимического соединения.5. Способ ...

Kühlvorrichtung und Verfahren zum Kühlen eines aus mehreren Schichten bestehenden Laminatverbundes

Die Erfindung betrifft eine Kühlvorrichtung und ein Verfahren für einen aus mehreren Schichten bestehenden Laminatverbund (14), mit einem Gehäuse (19), welches eine Transportstrecke zumindest teilweise umgibt, entlang welcher der zumindest eine Laminatverbund (14) verfahren wird, mit einer an dem Gehäuse (19) vorgesehenen Eingangsöffnung (21) und Ausgangsöffnung (22), und mit beidseitig zur Transportstrecke in dem Gehäuse (19) angeordneten Kühleinrichtungen (28, 29), welche gemeinsam zumindest eine Luftströmung erzeugen, die die Transportstrecke kreuzt und eine Kühlstrecke für den zumindest einen Laminatverbund (14) bildet.

Verfahren zur Oberflächenmodifizierung von Substraten

Method for detecting defective sandwich component at aircraft construction, involves loading measuring chamber with predetermined pressure, and detecting and evaluating pressure adjusted in measuring chamber

The method involves forming a measuring chamber (18) i.e. air measuring chamber, in a core device (16) e.g. foam material core device and/or metal foam core device and/or honeycomb core device, of a sandwich component (10), where the chamber comprises an end, which is opened outwardly. The measuring chamber is loaded with predetermined pressure, and the pressure adjusted in the measuring chamber is detected and evaluated. The predetermined pressure is produced as predetermined low, vacuum and/or high pressure in the measuring chamber. Independent claims are also included for the following: (1) a device for detecting a defective sandwich component at aircraft construction (2) a sandwich component comprising two cover layers.

VERFAHREN ZUR VERSTÄRKUNG EINER DOPPELSCHALENKONSTRUKTION

Method and apparatus for manufacturing insulating panels

PROCEDURE FOR THE PRODUCTION OF FLEXIBLE SURFACE FILTER MATERIAL AGAINST POLLUTANTS AND USE SUCH ONE OF SURFACE FILTER MATERIAL

DELAMINIERBARES PACKING LAMINATE AND PROCEDURE FOR ITS PRODUCTION

PROCEDURE FOR LAYING ON VEHICLE FILLER ASSISTANCE OF A SPACHTELS

REPARIER-LAMINAT UND SEINE VERWENDUNG

PROCEDURE FOR THE REPAIR OF THE SURFACE OF A PART FROM A SUPERALLOY

Thin film forming process

Color formulation selection process with visual display

A computer-implemented method of repairing a vehicle is disclosed. The method includes steps of estimating the cost of performing repairs to a damaged vehicle and determining a refinish paint formulation for refinishing a vehicle by conducting a computer-based search for a refinish paint formulation that best matches the vehicle's original finish prior to performing the repair work on the vehicle, where the repair work comprises performing any body work, mechanical systems work and/or electrical systems work and refinishing the vehicle.

GLASS REPAIR APPARATUS AND METHOD THEREFORE

A windscreen heater is used for heating a windscreen prior to and/or during resin repair. The heated windscreen promotes the flow of resin to repair the windscreen. The device is mounted to the windscreen and has a port enabling viewing of a target zone of the windscreen. A heater element is positioned in the region of the port in order to effect heating of the windscreen.

IMPROVED METALLIZED FILMS

Metallized films having enhanced barrier properties consist of a first polymer layer, a barrier layer, and a metal layer coated with a heat seal and/or printable layer which has been transferred onto the metal layer.

COMPOSITIONS SUITABLE FOR USE AS JOINT COMPOUNDS AND RELATED METHODS

The invention provides a composition useful as a joint compound comprising water, a filler comprising one or more of calcium carbonate, calcium sulfate dihydrate or calcium sulfate hemihydrate, a binder and/or a biocide, wherein the composition after curing is formaldehyde-free.

GAS SHIELDING DEVICE

L'invention concerne un dispositif de protection gazeuse mis en uvre lors d'une étape de soudage sous atmosphère controlée d'un panneau d'atténuation acoustique (100) comprenant des moyens d'injection de gaz inerte sur ledit panneau (100) et des moyens de réception d'une torche de soudage (40) caractérisé en ce que les moyens d'injection de gaz inerte comprennent un diffuseur (54) de gaz inerte monté à la périphérie des moyens de réception de la torche de soudage (40).

SCRATCH-RESISTANT, SELF-LAMINATED PRINTED MATERIALS AND METHODS FOR MAKING SAME

A method is provided for producing a unique printable multi-layer composite structural material (10B), and in turn a unique scratch-resistant, selflaminated printed material (10A). A printable multi-layer composite structural material is formed which includes a first underlying substrate (11) capable of being transported through a printing device, a second layer (16) formed on the first layer which is flowable when heated to at least its melting point and being fusible below its melting point, and a third layer (22) formed on the second layer which is printable. The third layer is also permeable so that when the second layer is in a flowable state it permeates through and about said third layer. The printable multi-layer composite structural material is capable of forming a scratch-resistant, self-laminated printed material by (a) printing a predetermined image (26) onto the third layer, (b) heating the second layer until it is in a flowable state and permeates through and about the third ...

PROCESS FOR PRODUCING A SURFACE COVERING WITH AN EMBOSSED PRINTED SURFACE

DEVICE AND METHOD FOR COATING FALSE WALL PANELS WITH A REHABILITATION DEVICE

PROCEEDED OF CROSSING REPAIR OF COMPOSITE STRUCTURE HAS THREE SKINS AND TWO LAYERS Of HEART

PROCEEDED OF CROSSING REPAIR OF COMPOSITE STRUCTURE HAS THREE SKINS AND TWO LAYERS Of HEART

PROCEEDED OF CROSSING REPAIR OF COMPOSITE STRUCTURE HAS THREE SKINS AND TWO LAYERS Of HEART

PROCEEDED OF CROSSING REPAIR OF COMPOSITE STRUCTURE HAS THREE SKINS AND TWO LAYERS Of HEART

PROCEEDED OF CROSSING REPAIR OF COMPOSITE STRUCTURE HAS THREE SKINS AND TWO LAYERS Of HEART

METHOD AND APPARATUS FOR SEPARATING A DONOR FILM FROM A SUBSTRATE WITHOUT SPOTS

PURPOSE: A method and apparatus for separating a donor film from a substrate are provided to simultaneously separate a top film and a bottom film and constantly maintain tension, a web angle, and a separation force. CONSTITUTION: A first roller(210) is arranged in a donor film(110). A second roller(220) is arranged in a supporter side corresponding to the first roller. A first gripper(310) withdraws the donor film. A second gripper(320) withdraws a supporter. A first peeling roller(410) is engaged with a first roller and supports the donor film by interposing the donor film withdrawn by the first gripper. A second peeling roller(420) is engaged with a second roller and supports the supporter by interposing the supporter withdrawn by the second gripper. COPYRIGHT KIPO 2013 ...

METHOD FOR REPAIRING A SOUND ATTENUATION PANEL

COMPOSITE SELF-HEALING SYSTEM

An advanced reflexive structure system is disclosed. The reflexive system mimics the pain withdrawal reflex on which the human body relies. The reflexive system incorporates a continuous health and performance monitoring system via an embedded dielectric film, an adaptive composite structure based on shape memory composite material, and an intelligence system which will be interfaced with both the health/performance sensors and the adaptive structure. When activated shape memory polymer will recover its structural integrity via shape recovery and a reptation healing process. These features enable the use of SMP as an adaptive structure in the proposed reflexive system. The development of a reflexive system for structures will enable increased safety and security and demonstrate a better understanding of integrated performance systems. This reflexive technology could find immediate implementation on all current and future systems and future implementation on platforms such as the International ...

SCRATCH-RESISTANT, SELF-LAMINATED PRINTED MATERIALS AND METHODS FOR MAKING SAME

A method is provided for producing a unique printable multi-layer composite structural material (10B), and in turn a unique scratch-resistant, self-laminated printed material (10A). A printable multi-layer composite structural material is formed which includes a first underlying substrate (11) capable of being transported through a printing device, a second layer (16) formed on the first layer which is flowable when heated to at least its melting point and being fusible below its melting point, and a third layer (22) formed on the second layer which is printable. The third layer is also permeable so that when the second layer is in a flowable state it permeates through and about said third layer. The printable multi-layer composite structural material is capable of forming a scratch-resistant, self-laminated printed material by (a) printing a predetermined image (26) onto the third layer, (b) heating the second layer until it is in a flowable state and permeates through and about the third ...

Automated production and installation of patches for reworking structures

An area of a composite laminate structure is reworked by scarfing the area, generating a 3-D map of the scarfed area, and installing a rework patch that is built based on the 3-D map.

Method and system for reworking a composite laminate

A method for reworking a composite laminate comprising a plurality of tapes, comprising the following steps: detecting the occurrence of a defect on a tape of composite material while the tape is being laid up; continuing the lay-up of the defective tape until a tape length is formed which surpasses a manufacturing length of the tape; catching the part of the defective tape that surpasses the manufacturing length of the tap; cutting the defective tape in the part of the defective tape that surpasses the manufacturing length of the tape; removing from the laminate the caught defective tape by the catching system, and laying-up a replacement tape in the place of the removed defective tape.

Windshield repair apparatus and method

An apparatus for repairing windshields and the method for using the apparatus wherein a liquid, curable resin material is forced into cracks in the windshield, using an apparatus mounted directly to the windshield, and which provides a high injection pressure and subsequently a vacuum so that the crack is completely filled, and air bubbles are removed from the filling resin during the time the resin cures. The apparatus in one form includes a disposable, simple-to-make injector that seals positively around the opening of the crack so that the resin is forced into place, and by reversing the injector, a suitable vacuum can be applied to the injected resin for removal of air bubbles.

Multi-Stage Debulk and Compaction of Thick Composite Repair Laminates

A method for fabricating a repair laminate for a composite part having an exposed surface includes applying a release film to the exposed surface and forming an uncured ply stack assembly on the release film. The uncured ply stack assembly is formed by forming and compacting a series of uncured ply stacks. The release film and ply stack assembly is then removed from the exposed surface. A bonding material is then applied to the exposed surface, and the uncured ply stack assembly is applied to the bonding material. The ply stack assembly and bonding material are then cured.

Method for manufacturing electronic device

Provided is a method of manufacturing an electronic device. An electronic device having excellent moisture blocking property and durability may be provided by the method.

Composite component comprising indicator layers and method for manufacturing it

A method for manufacturing a composite component (5) is disclosed. It comprises the steps of a) placing fibre rovings (3) in a mould until a particular thickness of fibre roving material is reached, b) placing an indicator layer (4) onto the roving material (3), c) placing fibre rovings (3) onto the indicator layer until a particular thickness of fibre roving material is reached, d) repeating the steps b) and c) until a predetermined final thickness of fibre roving material is reached, and e) casting the composite component (5).

Process for the adhesion of a component to a surface and apparatus for such a process

Композитные ткани, содержащие распределительные нити

Предложено изделие, содержащее многонаправленную ткань из первых усиливающих жгутов волокна, проходящих в первом направлении, и вторых усиливающих жгутов волокна, проходящих во втором направлении. Нити в первых жгутах волокна проходят за пределы границы ткани и являются распределенными. Жгуты внедрены в смолу. 4 н. и 15 з.п. ф-лы, 13 ил.

КОМПОЗИЦИИ, ПРИГОДНЫЕ ДЛЯ ИСПОЛЬЗОВАНИЯ В КАЧЕСТВЕ СОСТАВОВ ДЛЯ ЗАДЕЛКИ ШВОВ, И СВЯЗАННЫЕ С НИМИ СПОСОБЫ

Изобретение относится к композиции, пригодной для использования в качестве состава для заделки швов. Композиция содержит воду, наполнитель, связующее и биоцид. Наполнитель выбирают из одного или нескольких материалов, выбранных из карбоната кальция, сульфата кальция дигидрата или сульфата кальция полугидрата. Связующее выбирают из группы, состоящей из винил-, акрил- и стиролсодержащих соединений, полимеров или сополимеров винил-, акрил- и стиролсодержащих соединений, крахмалов, казеина и их смесей. Биоцид включает изотиазолинон. Кондиционированный образец композиции становится свободен от формальдегида через 24 часа. Композиция обладает улучшенными свойствами и эксплуатационными характеристиками. 7 з.п. ф-лы, 3 табл., 1 пр.

СПОСОБ ИЗГОТОВЛЕНИЯ ПОВЕРХНОСТНОГО ПОКРЫТИЯ С ТИСНЕНОЙ ПЕЧАТНОЙ ПОВЕРХНОСТЬЮ

Verfahren zum Aufkleben eines Bauteils auf eine Gegenfläche und Vorrichtung zu seiner Durchführung

Beim Abziehen einer Schutzfolie (4) von einer Klebeschicht (3) eines Bauteils (2) wird mit einem Ionenblasgerät (7) in den sich beim Abziehen der Schutzfolie (4) öffnenden Spalt (6) zwischen der Klebeschicht (3) und der Schutzfolie (4) ein ionisierter Gasstrom geblasen. Dadurch werden beim Abziehen entstehende elektrostatische Ladungen sofort neutralisiert.

Removing coatings from coated film, esp. polyester film

A process for removing the coating from coated film, esp. coated polyester film, comprises treatment at elevated temp. with an aq. alkaline decoating soln. contg. a glycol diether of formula R1-O-(CmH2mO)n-R2 (I). R1, R2 = 1-3C alkyl; m, n = 2 or 3.

Apparatus for vehicle registration plate assembly

An apparatus for assembling a vehicle registration plate holds one component, such as a transparent plastics panel 5, in a fixed position, and brings a second component, such as a retroreflective sheet 8, progressively into contact with the plastics panel by using a release mechanism. The first and second componenets have respective retaining means 1, 10. A compression means, such as a roller, traverses to bond the retroreflective sheet to the plastics panel. The retaining means may comprises peripheral side walls. The release mechanism may include a plurality of independently retractable rectangular tabs 7 on which the retroreflective sheet rests (figure 2). The second retaining means may include a flexible membrane with perforations, through which suction 11 is applied to hold the retroreflective sheet. Alternatively the second retaining means may include a pad 14 which adheres the retroreflective sheet in a flat position, with the pad being able to then curve to bring the sheet progressively ...

Aircraft frame structure, method of making an aircraft frame structure, method of repairing an aircraft and aircraft component

Method and apparatus for manufacturing insulating panels

REPAIRING LAMINATE AND ITS USE

GAP RIGGING DEVICE FOR LAMINATING ROLLERS

REPAIRING LAMINATE AND ITS USE

PROCEDURE FOR THE CONTINUOUS REPAIR THREE SKINS AND TWO NUCLEAR SITUATIONS OF COMPREHENSIVE ONES COMPOUND STRUCTURE

PROCEDURE AND ARRANGEMENT FOR THE REPAIR OF DAMAGE ON SURFACES WITH RELIEF DESIGN STRUCTURE, IN PARTICULAR SURFACES WITH ITSELF REPETITION RELIEF DESIGN

COMPOSITE MATERIALS AND PROCESS

System and method for a railway car door repair

Method and apparatus for repairing composite materials

METHOD AND APPARATUS FOR REPAIRING COMPOSITE A method of bonding materials (26, 28) may comprise defining a bond interface (32) between two materials (26, 28) in a cure zone on a surface (44) of an object (40), and non-conductively heating the bond interface (32) without directly heating the surface outside of the cure zone. Non-conductively heating the bond interface (32) may involve applying microwave radiation to the bond interface (32). Fig. 3B 1-24 0-20 20-h212 TEP ENSOR 2 4 8 32 1222 240--- 232- 2 36- 24 2200b4 -120O:NT O E 22 236-1-f,----11- 44 ...

BUTT JOINTS FOR PANELS AND/OR SECTIONS

Method and apparatus for repairing composite materials

METHOD AND APPARATUS FOR REPAIRING COMPOSITE A method of bonding materials (26, 28) may comprise defining a bond interface (32) between two materials (26, 28) in a cure zone on a surface (44) of an object (40), and non-conductively heating the bond interface (32) without directly heating the surface outside of the cure zone. Non-conductively heating the bond interface (32) may involve applying microwave radiation to the bond interface (32). Fig. 3B 1-24 0-20 20-h212 TEP ENSOR 2 4 8 32 1222 240--- 232- 2 36- 24 2200b4 -120O:NT O E 22 236-1-f,----11- 44 ...

COMPOSITE MATERIALS AND PROCESS

METHODS OF FABRICATION OF COMPOSITE REPAIR PARTS AND RELATED KITS

Composite laminates fabricated from one or more respective laminae of composite material (e.g., fiber-reinforced polymers) may be pre-formed and fully cured, yet configured to be selectively conformable to a desired radius of curvature. To repair a damaged composite structure, a plurality of such composite laminates may be bonded together to form a repair part that may be bolted to or otherwise secured to the damaged composite structure, thereby repairing the structure using repair parts that may match the parent material of the damaged composite structure. Methods of forming said repair parts from a plurality of such composite laminates may provide advantages in costs and lead time, over conventional techniques. Kits may include a plurality of such pre-formed and cured composite laminates that may be stacked and combined together in a plurality of different arrangements to create a customizable repair part for a given damaged composite structure.

METHOD FOR THROUGH-REPAIR OF A COMPOSITE STRUCTURE COMPRISING THREE SKINS AND TWO CORE LAYERS

The invention concerns a method whereby repair portions (6, 20, 21, 22 and 23), set through two core layers (16, 19), for example with honeycomb structure and three polymer skins (2, 3, 17) two of which being outer skins and the third an intermediate skin interposed between the two core layers to provide a composite structure, are installed and the polymer is vacuum hardened. An backing block (8) is pressed on one of the skins (2) to ensure a good appearance and a good surface quality. The invention is characterized in that vents (24) are provided through the intermediate skin (21) and optionally through the skin (2) receiving the anvil form for proper degassing of the underlying cellular core (20).

LAMINATE STRUCTURE AND METHOD OF PRODUCING THE SAME

MULTI-STAGE DEBULK AND COMPACTION OF THICK COMPOSITE REPAIR LAMINATES

A method for fabricating a repair laminate for a composite part having an exposed surface includes applying a release film to the exposed surface and forming an uncured ply stack assembly on the release film. The uncured ply stack assembly is formed by forming and compacting a series of uncured ply stacks. The release film and ply stack assembly is then removed from the exposed surface. A bonding material is then applied to the exposed surface, and the uncured ply stack assembly is applied to the bonding material. The ply stack assembly and bonding material are then cured.

DEVICES FOR MECHANICALLY APPLYING A FLEXIBLE MULTI-LAYER BODY MEMBER WHICH IS ADHERENT ON ITS ONE SIDE TO THE SURFACE OF A WORKPIECE

The device serves for mechanically applying to the surface of a work piece a flexible multi-layer body member which is adherent on it one side and is composed of a supporting layer, an adhesive layer and a draw-off protection foil covering said adhesive layer. Said device comprises the following partial devices: (a) a supporting table for supporting said multi-layer body member; (b) separating device for separating said protection foil from said multi-layer body member in a marginal zone; (c) a draw-off device for drawing off said protection foil from said multi-layer body member; and (d) a transporter provided with a vacuum gripper for lifting said multi-layer body member off from said supporting table, for moving it past said draw-off device, and for deposing it - if necessary after heating it by means of a heating device - onto the surface of said work piece.

THIN FILM FORMING PROCESS

A process for producing an SOI substrate is disclosed which is useful for saving resources and lowering production cost. Further, a process for producing a photoelectric conversion device such as a solar cell is disclosed which can successfully separate a substrate by a porous Si layer, does not require a strong adhesion between a substrate and a jig, and can save resources and lower production cost. In a substrate having a porous layer on a nonporous layer and further having on the porous layer a layer small in porosity, the nonporous layer and the layer small in porosity are separated by the porous layer to form a thin film. A metal wire is wound around a side surface of the substrate, and a current is made to flow into the metal wire to generate a heat from the metal wire and transfer the heat preferentially to the porous layer, thus conducting the separation. The separated substrate is used for producing an SOI substrate and the separated nonporous Si layer is reutilized in a process ...

THIN FILM FORMING PROCESS

A process for producing an SOI substrate is disclosed which is useful for saving resources and lowering production cost. Further, a process for producing a photoelectric conversion device such as a solar cell is disclosed which can successfully separate a substrate by a porous Si layer, does not require a strong adhesion between a substrate and a jig, and can save resources and lower production cost. In a substrate having a porous layer on a nonporous layer and further having on the porous layer a layer small in porosity, the nonporous layer and the layer small in porosity are separated by the porous layer to form a thin film. A metal wire is wound around a side surface of the substrate, and a current is made to flow into the metal wire to generate a heat from the metal wire and transfer the heat preferentially to the porous layer, thus conducting the separation. The separated substrate is used for producing an SOI substrate and the separated nonporous Si layer is reutilized in a process ...

PROCEEDED OF CROSSING REPAIR OF COMPOSITE STRUCTURE HAS THREE SKINS AND TWO LAYERS Of HEART

PROCEEDED OF CROSSING REPAIR OF COMPOSITE STRUCTURE HAS THREE SKINS AND TWO LAYERS Of HEART

PROCEEDED OF CROSSING REPAIR OF COMPOSITE STRUCTURE HAS THREE SKINS AND TWO LAYERS Of HEART

Apparatus for laminating a film on a wafer

An apparatus for laminating a film on a wafer includes a cutting mechanism and a laminating mechanism. The cutting mechanism has a cutting device disposed thereon for pre-cutting a dry film. The cutting mechanism has a supporter disposed adjacent to the cutting device for positioning a wafer. The cutting mechanism has a suction member disposed and corresponding to the cutting device for sucking the cut dry film to allow the cutting device pre-cutting the dry film and moving the cut dry film to the supporter. The laminating mechanism has a first lower member provided for positioning the wafer and a first upper member disposed above the first lower member for laminating the cut dry film with electrically heating to adhere the cut dry film on the wafer.

Laser ashing of polyimide for semiconductor manufacturing

A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.

Peeling apparatus and manufacturing apparatus of semiconductor device

To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.

Systems and Methods For Ultrasonically Cleaving A Bonded Wafer Pair

Systems and methods for the ultrasonic cleaving of bonded wafer pairs are described. The system includes a tank for containing a volume of liquid, a wafer boat having a recess formed therein for receiving the bonded wafer pair. The recess has a pair of opposing, spaced-apart sidewalls disposed at an angle from a vertical axis. An ultrasonic agitator is configured to ultrasonically agitate the volume of liquid. The ultrasonic agitation of the volume of liquid results in the cleaving of the bonded wafer pair.

Production of extruded foam

A method of producing a laminated body of structural thermoplastic foam, the method comprising the step of successively extruding a plurality of foam layers from an extrusion die, each next layer being extruded onto a previously extruded layer to form a stack of mutually bonded layers.

Adhesive fastening elements for holding a workpiece and methods of de-bonding a workpiece from an adhesive fastening element

An adhesive fastening element includes a first member and a second member adjacent to the first member and movable relative to the first member along a longitudinal axis of the adhesive fastening element, wherein a bond is formed by an adhesive between the workpiece and the first and second members of the adhesive fastening element. A method for debonding a workpiece from an adhesive fastening element includes moving the second member away from the workpiece and breaks the bond between the second member and the workpiece and moving the first and second members such that the second member moves towards the workpiece and applies a force to the workpiece so as to break the bond between the first member and the workpiece, and to de-bond the workpiece from the adhesive fastening element.

Method and apparatus for detaching plates joined to each other

A workpiece composed of a glass plate and a display panel joined to each other via an adhesive sheet is suction-held on both surfaces thereof by a pair of upper and lower holding members. The glass plate is detached from the display panel through swinging downward one end of the lower holding member around a support shaft provided on the other end side thereof with an entire surface of the glass plate being held in a planar state with a suction surface of the lower holding member.

Method and apparatus for peeling donor film from substrate

A method and an apparatus for peeling a donor film from a substrate are disclosed. In one embodiment, the donor film peeling apparatus includes i) a first roller disposed on a side of the donor film, ii) a second roller disposed on a side of the support at a position corresponding to the first roller and iii) first and second grippers configured to withdraw the donor film and support, respectively. The apparatus may further include i) first and second peeling rollers engaged with the first and second rollers with the donor film and support withdrawn by the first and second grippers being interposed therebetween to support the withdrawn donor film and support, respectively, and ii) an insertion mechanism disposed in at least one of the first and second peeling rollers and inserted between the bonded donor film and support.

HEAT-EXPANDABLE REMOVABLE PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET, AND METHOD OF REMOVING THE SAME

The heat-expandable removable pressure-sensitive adhesive tape of the present invention includes at least a blowing agent-containing pressure-sensitive adhesive layer A, a microparticle-containing viscoelastic substrate B, a peelable or peel-assisting film layer C, and a pressure-sensitive adhesive layer D. A multilayer structure containing at least the peelable or peel-assisting film layer C and the pressure-sensitive adhesive layer D is arranged on at least one side of the blowing agent-containing pressure-sensitive adhesive layer A where the blowing agent-containing pressure-sensitive adhesive layer A is in direct contact with the peelable or peel-assisting film layer C. The peelable or peel-assisting film layer C can be removed from the blowing agent-containing pressure-sensitive adhesive layer A by heat treatment after storage in an atmosphere of 75° C. for 8 weeks. 1. A heat-expandable removable pressure-sensitive adhesive tape or sheet , at least comprising:a blowing agent-containing pressure-sensitive adhesive layer A;a microparticle-containing viscoelastic substrate B;a peelable or peel-assisting film layer C; anda pressure-sensitive adhesive layer D,wherein a multilayer structure containing at least the peelable or peel-assisting film layer C and the pressure-sensitive adhesive layer D is arranged on at least one side of the blowing agent-containing pressure-sensitive adhesive layer A, the blowing agent-containing pressure-sensitive adhesive layer A is in direct contact with the peelable or peel-assisting film layer C, and the peelable or peel-assisting film layer C is optionally removed from the blowing agent-containing pressure-sensitive adhesive layer A by heat treatment after storage in an atmosphere of 75° C. for 8 weeks.2. The heat-expandable removable pressure-sensitive adhesive tape or sheet according to claim 1 , wherein the multilayer structure containing at least the peelable or peel-assisting film layer C and the pressure-sensitive adhesive ...

PAPER STRIPPING MEMBER AND IMAGE FORMING APPARATUS

A paper stripping member is removably supported by a supporting member disposed facing a circumferential surface of a photoreceptor drum, and strips a paper sheet off the circumferential surface. The paper stripping member includes an acute-shaped stripping nail, a holding member and a cover member. The holding member is configured removably from the supporting member, and holds the stripping nail in such a manner that the stripping nail extends toward the circumferential surface. The cover member is configured removably from the holding member, and covers at least part of the stripping nail in the extending direction of the stripping nail in a state where the cover member is attached to the holding member. 1. A paper stripping member that is removably supported by a predetermined supporting member disposed facing a circumferential surface of a rotary body and that strips a paper sheet off the circumferential surface , the paper stripping member comprising:an acute-shaped stripping nail;a holding member that is configured removably from the supporting member and that holds the stripping nail in such a manner that the stripping nail extends toward the circumferential surface; anda cover member that is configured removably from the holding member and that covers at least part of the stripping nail in an extending direction toward which the stripping nail extends in a state where the cover member is attached to the holding member.2. The paper stripping member as claimed in claim 1 , whereinthe holding member includes a first hole; andthe cover member, being made of an elastic resin, includes a first protruded portion elastically fittable in the first hole.3. The paper stripping member as claimed in claim 1 , whereinthe holding member further includes a first rib extending in one direction; andthe cover member further includes a guide groove guided by the first rib.4. The paper stripping member as claimed in wherein the first rib is provided parallelly with the ...

METHOD OF DETACHING PLATES

Disclosed is a method for detaching two plates bonded through a double-coated pressure-sensitive adhesive sheet without substantially applying such a force (load) to the plates as to cause large distortion (deformation) leading to fracture or breakage of the plates. The method detaches two plates bonded through a double-coated pressure-sensitive adhesive sheet by applying a force to at least one of the two plates at least in a direction normal to the plate at such a temperature that the double-coated pressure-sensitive adhesive sheet has a storage elastic modulus of 1.0×10Pa or more as measured by dynamic viscoelastic measurement. 1. A method of detaching two plates bonded through a double-coated pressure-sensitive adhesive sheet ,{'sup': '7', 'the method comprising the step of applying a force to at least one of the two plates at least in a direction normal to the plate at such a temperature that the double-coated pressure-sensitive adhesive sheet has a storage elastic modulus of 1.0×10Pa or more as measured by dynamic viscoelastic measurement.'}2. The method of claim 1 , wherein the double-coated pressure-sensitive adhesive sheet has a storage elastic modulus of 1.0×10Pa or less at 23° C. as measured by dynamic viscoelastic measurement.3. The method of claim 1 , wherein the step of applying the force includes preparing a tool having at least a wedge-shaped head; and inserting a tapered thin edge of the wedge-shaped head of the tool between the two plates from a lateral side of the double-coated pressure-sensitive adhesive sheet.4. The method of claim 1 , wherein the double-coated pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition including an acrylic polymer obtained through polymerization of a monomer component claim 1 , or a partial polymer of the monomer component claim 1 , andwherein the monomer component comprises a (meth)acrylic alkyl ester whose alkyl moiety being a linear or ...

SHEET SEPARATION APPARATUS AND SEPARATION METHOD, AND SHEET ATTACHING APPARATUS AND ATTACHING METHOD

A sheet peeling device includes: a feeder that feeds a material sheet and a peeling unit that peels the adhesive sheet from the peeling sheet. The peeling unit includes: a peeling member having a bending edge for folding back the peeling sheet; and a following unit that forms an anti-bending area with irregularities at least on the adhesive sheet in the feeding direction. The peeling member includes a guide surface continuous to the bending edge and guides the material sheet; and a first irregularity formed on the guide surface in the feeding direction and is open on the bending edge. The following unit includes a guide member interposing the material sheet with the peeling member and having a second irregularity to fit to the first irregularity. The second irregularity includes a convex portion that extends to the bending edge in the feeding direction corresponding to the first irregularity. 2. The sheet peeling apparatus according to claim 1 , further comprising a driving device capable of adjusting a distance between the peeling member and the guide member.3. The sheet peeling apparatus according to claim 1 , whereinthe first irregularity is a groove formed on the guide surface and having an open end on the bending edge, andthe second irregularity extends to a position opposite to the groove in the bending edge with the raw sheet interposed between the second irregularity and the groove.4. The sheet peeling apparatus according to claim 1 , whereinthe peeling member comprises a suction unit having a suction hole for sucking the release liner of the raw sheet,the first irregularity is a groove formed in the guide surface, andthe suction hole is provided in the groove.5. A sheet peeling method of peeling an adhesive sheet from a raw sheet claim 1 , the adhesive sheet comprising a base sheet and an adhesive layer provided on one surface of the base sheet claim 1 , the raw sheet comprising the adhesive sheet and a belt-like release liner to which the adhesive sheet is ...

APPARATUS AND METHOD FOR PEELING PROTECTIVE FILM AND METHOD FOR FABRICATING STEREOSCOPIC IMAGE DISPLAY DEVICE

An apparatus for peeling a protective film is provided to remove air bubbles in a film member with the protective film peeled, by moving a peeling unit so that the peeling unit performs peeling at a different position for each peeling process. The apparatus includes: a cylindrical plate for rotating a film member attached to the outer peripheral surface thereof, the film member having a protective film attached to the front surface thereof; a peeling unit comprising a peeling roller disposed at a side portion of the cylindrical plate to peel the protective film from the film member and a clamp for holding the peeled portion of the protective film; and a first moving unit for moving the peeling unit backward from the cylindrical plate to peel the protective film, wherein the peeling unit is moved along an axial direction of the cylindrical plate so that the peeling unit is contacted to the a different position of the protection film for each peeling process. 1. An apparatus for peeling a protective film , the apparatus comprising:a cylindrical plate that rotates a film member attached to the outer peripheral surface thereof, the film member having a protective film attached to the front surface thereof;a peeling unit comprising a peeling roller disposed at a side portion of the cylindrical plate to peel the protective film from the film member and a clamp for holding the peeled portion of the protective film; anda first moving unit that moves the peeling unit backward from the cylindrical plate to peel the protective film,wherein the peeling unit is moved along an axial direction of the cylindrical plate so that the peeling unit is contacted to the a different position of the protection film for each peeling process.2. The apparatus of claim 1 , further comprising a second moving unit disposed on top of the first moving unit to move the peeling unit to maintain uniformly a distance from the outer peripheral surface of the cylindrical plate.3. The apparatus of claim 2 ...

METHOD FOR STRIPPING A WAFER FROM A CARRIER

Method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer. The method includes the steps of accommodating the carrier-wafer combination on a receiving means, breaking the connection provided by the interconnect layer by a connection release means, and stripping the wafer from the carrier, or stripping the carrier from the wafer by stripping means. 1. Method for stripping a wafer from a carrier , wherein the carrier is fixed to the wafer by an interconnect layer that provides a connection between the carrier and the wafer , the method comprising the following steps:receiving a carrier-wafer combination on a receiving means, said carrier-wafer combination comprised of the carrier and the wafer, wherein the interconnect layer provides the connection between the carrier and the wafer at a peripheral edge of the carrier-wafer combination;supplying a solvent for dissolving the interconnect layer;rotating the carrier-wafer combination to contact the peripheral edge of the carrier-wafer with the solvent, thereby unfixing the connection between the carrier and the wafer; andstripping the wafer from the carrier or stripping the carrier from the wafer.2. Method for stripping according to claim 1 , wherein said solvent is supplied through a fluid line to a working chamber claim 1 , wherein at least a portion of the peripheral edge of said carrier-wafer combination rotates through the working chamber to contact the peripheral edge of the carrier-wafer with the solvent.3. Method for stripping according to claim 1 , wherein said steps of supplying the solvent and rotating the carrier-wafer combination to contact the peripheral edge of the carrier-wafer with the solvent are carried out at a temperature in a range from 0° C. to 350° C.4. Method for stripping according to claim 1 , wherein the interconnect layer includes an adhesive at the peripheral edge of the carrier-wafer combination.5. Method for stripping according to claim 4 , wherein ...

Label for Removable Attachment to an Article

A label for removable application to an article such as a beverage bottle includes a backing layer () comprising a laminate of a bi-axially oriented polyester such as PET () and a bi-axially oriented polypropylene (). The polyester film () has a lower coefficient of thermal expansion than the polypropylene film (). Consequently, when the label is heated, it will tend to curl and this effect can be used to assist in the removal of the label from the article in a hot washing bath during recycling of the article. 1. A label which is removable from an article when heated , the label comprising a backing layer which is a polymeric film and an adhesive layer for bonding the label to the article , the material of the backing layer being such that the backing layer expands when subjected to heat , there being differential expansion between the opposite faces of the backing layer so that the label tends to curl into a curved configuration with the adhesive layer on the outside of the curve.2. A label as claimed in claim 1 , in which the backing layer comprises a laminate of two film materials having different coefficients of thermal expansion claim 1 , wherein the coefficient of thermal expansion of the film material nearer to the adhesive layer is not less than double the coefficient of thermal expansion of the film material further from the adhesive layer.3. (canceled)4. A label as claimed in claim 2 , in which one of the film materials is polypropylene.5. A label as claimed in claim 4 , in which the polypropylene film has a modulus of elasticity in the machine direction which is not less than 2000 N/mmand not more than 2500 N/mm.6. A label as claimed in claim 4 , in which the modulus of elasticity of the polymer film in the transverse direction is not less than 3000 N/mmand not more than 4000 N/mm.7. A label as claimed in claim 2 , in which one of the film materials is a polyester.8. A label as claimed in claim 4 , in which the polypropylene film is disposed adjacent the ...

Method for Repairing and/or Strengthening Pipes

A method for effecting a repair and/or strengthening of a pipe. The method comprises cleaning an affected area of a surface of the pipe to provide a cleaned surface of the pipe surface for an area requiring repair; applying a continuous strip around the pipe from a portion prior to the affected area and allowing the continuous strip to extend to a portion after the affected area. The continuous strip forms a spiral sleeve spaced from the pipe surface to provide an annular chamber between the pipe surface and the spiral sleeve. 1. A method for effecting at least one of a repair and strengthening of a pipe , the method comprising:cleaning an affected area of a surface of the pipe to provide a cleaned surface of the pipe surface for an area requiring repair;applying a continuous strip around the pipe from a portion prior to the affected area and allowing the continuous strip to extend to a portion after the affected area, the continuous strip forming a spiral sleeve spaced from the pipe surface to provide an annular chamber between the pipe surface and the spiral sleeve.2. A method as claimed in claim 1 , wherein the continuous strip is a fibre reinforced claim 1 , mechanically-sealing claim 1 , polymer strip.3. A method as claimed in claim 2 , wherein continuous strip is a carbon-fibre reinforced HDPE strip.4. A method as claimed in claim 1 , wherein the continuous strip is formed into the spiral sleeve by at least one of: overlapping claim 1 , and interlocking.5. A method as claimed in claim 1 , wherein the annular chamber is subsequently filled with a filling material for providing a bond between the pipe and the spiral sleeve claim 1 , the filling material being selected from the group consisting of: a structural resin claim 1 , and a grout. This application is a divisional of U.S. patent application Ser. No. 12/666,610, filed Dec. 23, 2009, now U.S. Pat. No. 8,388,785, which is the U.S. National Phase of International Application No. PCT/MY2008/00058, entitled “ ...

Multi-Stage Debulk and Compaction of Thick Composite Repair Laminates

A method for fabricating a repair laminate for a composite part having an exposed surface includes applying a release film to the exposed surface and forming an uncured ply stack assembly on the release film. The uncured ply stack assembly is formed by forming and compacting a series of uncured ply stacks. The release film and ply stack assembly is then removed from the exposed surface. A bonding material is then applied to the exposed surface, and the uncured ply stack assembly is applied to the bonding material. The ply stack assembly and bonding material are then cured. 1. A method for fabricating a repair laminate for a composite part having an exposed surface , comprising:applying a release film to the exposed surface, the release film being in direct contact with the exposed surface;applying a first ply stack to the release film, the first ply stack having a first plurality of uncured plies, the first ply stack being in direct contact with the release film;compacting the first plurality of uncured plies;applying a second ply stack to the first ply stack, the second ply stack having a second plurality of uncured plies;compacting the second plurality of uncured plies;removing the release film and the first and second ply stacks from the composite part;applying bonding material to the exposed surface;forming a ply stack assembly from the first ply stack and the second ply stack;bonding the ply stack assembly to the exposed surface with the bonding material; andcuring the ply stack assembly and the bonding material;wherein the first ply stack is compacted prior to the second ply stack being applied and subsequently compacted; andwherein the temperature during compacting is below a curing temperature.2. The method according to claim 1 , wherein at least one of the first and second pluralities of uncured plies includes polymeric-matrix composite materials.3. The method according to claim 1 , wherein at least one of the first and second ply stacks comprises:fewer ...

METHOD FOR DISASSEMBLING BONDED BODY, AND ADHESIVE

Provided is a method for disassembling a bonded body, whereby the bonded body can be easily disassembled and peeled. The method for disassembling a bonded body formed by bonding substrates with an adhesive comprises irradiating light having a wavelength of 280 nm or more such that irradiation energy is 1000-5000000 mJ/cmat a wavelength of 365 nm while heating the bonded body to 150° C.-300° C. 1. A method for disassembling a bonded body formed by bonding substrates with an adhesive , comprising irradiating light having a wavelength of 280 nm or more such that irradiation energy is 1000-5000000 mJ/cmat a wavelength of 365 nm while heating the bonded body to 150° C-300° C.2. A method for disassembling a bonded body according to claim 1 , wherein the adhesive employed for the bonded body is an acrylic and/or epoxy adhesive.3. A method for disassembling a bonded body according to claim 1 , wherein the adhesive employed for the bonded body contains (A) a (meth)acrylate and (B) a polymerization initiator.4. A method for disassembling a bonded body according to claim 1 , wherein the adhesive employed for the bonded body is an ultraviolet curable acrylic adhesive containing (A-1) one or two or more (meth)acrylates having one or more (meth)acryloyl groups at a molecular terminal or on a side chain claim 1 , and having a main chain backbone selected from the group consisting of polybutadiene claim 1 , polyisoprene claim 1 , and a hydrogenated form of these two claim 1 , (A-2) isobornyl(meth)acrylate claim 1 , (A-3) a hydroxyl group-containing (meth)acrylate claim 1 , and (B-1) a photopolymerization initiator.5. A method for disassembling a bonded body according to claim 1 , wherein the adhesive employed for the bonded body is an ultraviolet curable acrylic adhesive containing (A-4) a multifunctional (meth)acrylate claim 1 , and (B-1) a photopolymerization initiator.6. A method for disassembling a bonded body according to claim 1 , wherein the adhesive employed for the bonded ...

METHOD OF SEPARATING TWO ADHERED PLATES

A method of reusably separating two plates adhered to each other via an adhesive sheet or a curable resin layer, including 1. A method of separating two plates adhered to each other via an adhesive sheet or a curable resin layer , comprisingrelatively rotating the two plates using the vertical line penetrating opposing faces of the two plates as a rotation axis and then relatively moving the two plates in parallel.2. The method according to claim 1 , wherein the rotation axis in the relative rotation of the two plates is a vertical line penetrating the gravity center (center) or near the gravity center of the opposing faces of the two plates.3. The method according to claim 1 , wherein claim 1 , in the relative rotation of the two plates claim 1 , they are accelerated by initial motion and claim 1 , the speed of rotation of the two plates after the initial motion is not less than 0.01 (degrees/sec) and less than 50 (degrees/sec).4. The method according to claim 3 , wherein the initial motion occurs within 1 second from the start of the rotation.5. The method according to claim 4 , wherein the acceleration in the initial motion is less than 30000 (degrees/sec).6. The method according to claim 1 , wherein the two plates are optical plates and the adhesive sheet is a transparent adhesive sheet.7. The method according to claim 6 , wherein the two optical plates are provided on a display surface side of a flat panel display.8. The method according to claim 7 , wherein the two optical plates are a display panel and a touch panel claim 7 , a display panel and a transparent plate for protection claim 7 , or a touch panel and a transparent plate for protection.9. The method according to claim 1 , wherein the two plates are adhered to each other via an adhesive sheet or curable resin layer having an area approximately the same as that of the opposing surfaces of the two plates.10. The method according to claim 1 , wherein the adhesive sheet is an acrylic adhesive sheet ...

CORE JOINER AND CUTTER APPARATUS

An automatic core joiner and cutter apparatus for use in the recycling of used cores and the manufacture of new conjoined cores is disclosed. The apparatus combines an infeed unit, a milling unit, and an outfeed unit, all controlled by a PC. The used core is milled by the infeed milling bit and the core remnant is milled by the outfeed milling bit. A glue applicator applies glue to at least one of the milled surfaces and the milled surfaces are mated together to produce a new conjoined core. The infeed cutting and milling operations and the outfeed cutting and milling operations are controlled by the controller and performed at the same time. 1. The apparatus of wherein the outfeed cutter and milling bit are positioned on a vertical slide and a horizontal slide claim 2 , wherein the controller controls movement of the outfeed milling bit into engagement with the interior surface of the core remnant.2. A process for automatically performing cutting and milling operations on a used core and a core remnant to provide mating milled surfaces on the adjacent ends of the used core and core remnant and placing the mating surfaces into engagement with each other to produce a conjoined core claim 2 , such process including the steps of:positioning a used core proximate an infeed cutting blade and infeed milling bit and positioning the adjacent end of a core remnant in a position proximate an outfeed cutting blade and an outfeed milling bit;cutting the used end of the used core with the infeed cutting blade to produce a clean end and cutting the used end of the core remnant with the outfeed cutting blade to produce a clean end;milling the clean end of the used core with the infeed milling bit to produce a mating surface and milling the clean end of the core remnant with the outfeed milling bit to produce a mating surface;applying glue to at least one of the mating surfaces; andjoining the mating surfaces of the used core and core remnant to produce a conjoined core.3. The ...

METHOD OF STRIPPING MULTIPLE PLIES OF A PRESSURE-SENSITIVE ADHESIVE LAYER, AND A PRESSURE-SENSITIVE ADHESIVE LAYER USED THEREIN

The present invention provides a method of stripping multiple plies of a pressure-sensitive adhesive layer, capable of easily separating and dismantling the joint portion in a short time, without affecting the adherend involved. The stripping method of the present invention strips the multiple plies of a pressure-sensitive adhesive layer, including a pressure-sensitive adhesive body having at least a pressure-sensitive adhesive layer containing heat-expandable fine particles and an adherend, the pressure-sensitive adhesive body and the adherend being laminated on each other, and the multiple plies of a pressure-sensitive adhesive layer contain a coloring matter component, and the pressure-sensitive adhesive body and the adherend are stripped from each other, by irradiating the coloring matter with a laser light beam having a wavelength coinciding with the absorption wavelength of the coloring matter and by expanding the heat-expandable fine particles with the aid of the heat thus generated. 1. A method of stripping multiple plies of a pressure-sensitive adhesive layer , comprising a pressure-sensitive adhesive body having at least a pressure-sensitive adhesive layer containing heat-expandable fine particles and an adherend , the pressure-sensitive adhesive body and the adherend being laminated on each other ,wherein the multiple plies of a pressure-sensitive adhesive layer contain a coloring matter component, andthe pressure-sensitive adhesive body and the adherend are stripped from each other, by irradiating the coloring matter with a laser light beam having a wavelength coinciding with the absorption wavelength of the coloring matter and by expanding the heat-expandable fine particles with the aid of the heat thus generated.2. The method of stripping multiple plies of a pressure-sensitive adhesive layer according to claim 1 , wherein the pressure-sensitive adhesive layer contains the coloring matter component.3. The method of stripping multiple plies of a pressure ...

REPAIR OF DELAMINATED PLATES WITH PIEZOELECTRIC MATERIALS

A piezoelectric patch can be used to repair a defective structure having a plate configuration. The piezoelectric patch can be energized with an applied voltage that is configured to sustain the loading arising from the plate. The applied voltages and electrodes of the patch can be configured based on a numerical model and a finite element method (FEM). 1. A system comprising:a piezoelectric patch having a planar surface configured for affixation to a structural plate, and having a plurality of segments, each segment having a pair of electrodes;a data source configured to provide data corresponding to the plate;a processor coupled to the data source and configured to execute an algorithm to determine a voltage corresponding to each segment of the plurality of segments; anda power supply having a plurality of outputs coupled to the plurality of pairs of electrodes, the processor configured to provide a signal to modulate the outputs.2. The system of wherein a first segment of the plurality of segments is electrically isolated from a second segment of the plurality of segments.3. The system of wherein the data source includes a sensor coupled to the plate.4. The system of further including a user input coupled to the processor claim 1 , the user input configured to receive an estimated load.5. The system of wherein the processor is configured to modulate a voltage of the outputs.6. A patch comprising:a piezoelectric material having a planar surface, the planar surface configured for affixation to a structural plate; anda plurality of pairs of electrodes coupled to the piezoelectric material, the plurality of pairs of electrodes corresponding to a plurality of segments of the piezoelectric material, wherein each segment is electrically isolated from at least one other segment.7. The patch of wherein the segments are in parallel alignment.8. A method comprising:affixing a piezoelectric patch to a structural plate, the patch having a plurality of pairs of electrical ...

LABELS

The present invention provides a film of an oriented material which exhibits the property of expansion in at least one of its machine and transverse directions at a first temperature and of shrinkage at a second, higher, shrink onset temperature, the film having been annealed after orientation at a temperature above the first temperature and selected with reference to an intended recycling wash-off process to promote expansion of the film at the selected temperature of the wash-off process. 1. A film of an oriented material which exhibits the property of expansion in at least one of its machine and transverse directions at a first temperature and of shrinkage at a second , higher , shrink onset temperature , the film having been annealed after orientation at a temperature above the first temperature and selected with reference to an intended recycling wash-off process to promote expansion of the film at the selected temperature of the wash-off process.2. The film of claim 1 , which upon exposure to a wash fluid having a temperature at or greater than the first temperature but beneath the shrink onset temperature of the film claim 1 , the film expands in at least one direction.3. The film of claim 2 , wherein the expansion in the wash fluid is by:a. no more than 15% in any single direction, orb. an amount such that the area of the film is increased by no more than 15%.4. The film of claim 3 , wherein the expansion is by about 5% or less in any single direction.5. The film of claim 4 , wherein the expansion is by about 2% or less in any single direction.6. The film of claim 3 , wherein the area expansion is 10% or less.7. The film of claim 6 , wherein the area expansion is 5% or less.8. The film of claim 2 , wherein the film does not curl substantially in the wash.9. The film of claim 2 , wherein the first temperature is the minimum temperature of the wash fluid required to cause the film to expand.10. The film of claim 2 , wherein the first temperature is 40° C. or ...

Adhesive Balancing Weight With Adhesive Tape System

The invention relates to an adhesive balancing weight 1 having an adhesive tape system, wherein the adhesive tape system is formed from a tape base between a first adhesive layer 7 for fastening the weight body 8 onto the adhesive tape system and a second adhesive layer 3 for fastening the adhesive balancing weight itself. When the adhesive weight is pulled off, no layer should be damaged, particularly not the vulnerable leveling layer, in order to avoid leaving any remnant behind on the adhesive surface. This is achieved, while maintaining the customary advantages of an adhesive weight of this type, by embodying the tape base as a first base film 4.

Component adhesive bonding structure and component separation method

A configuration includes the adhesive member to adhesively bond components together and a thermo-expandable material to expand upon being heated in the way of being disposed between at least one of the components adhesively bonded together by the adhesive member and the adhesive member and to push the adhesive member in a direction of getting apart from at least one of the components.

Method to Produce a Textile Product and a Textile Product Resulting from the Same

A method for manufacturing a textile product includes the steps of providing an intermediate product formed by a backing having a front surface and a back surface, and yarns applied into the backing, the yarns extending from the front surface of the backing material, feeding the intermediate product along a body having a heated surface, the back surface being pressed against the heated surface, to at least partly melt the yarns present in the intermediate product to form the textile product, wherein the part of the back surface that is pressed against the heated surface has a relative speed with respect to the heated surface, and a device enabling applications of this method and to a floor covering incorporating such a textile product connected to a dimensionally stable carrier sheet using thermo reversible covalent interactions. 1. A method for manufacturing a textile product comprising:providing an intermediate product comprising a backing having a front surface and a back surface, and yarns applied into the backing, the yarns extending from the front surface of the backing material,feeding the intermediate product along a body having a heated surface, the back surface being pressed against the said heated surface, to at least partly melt the yarns present in the intermediate product to form the textile product, andproviding a relative speed of the part of the back surface that is pressed against the heated surface with respect to the heated surface.2. A method according to claim 1 , wherein the heated surface is an edge of a blade.3. A method according to claim 2 , wherein the step of feeding includes the step of feeding the intermediate product between the blade and a rotating drum facing the blade.4. A method according to claim 2 , further including the step of vibrating the blade when pressed against the back surface.5. A method according to claim 4 , wherein the frequency of vibrating is between 5000 and 50000 Hz.6. A method according to claim 2 , further ...

Apparatus and method of separating wafer from carrier

A method of separating a wafer from a carrier includes placing a wafer assembly on a platform. The wafer assembly includes the wafer, the carrier, and a layer of wax between the wafer and the carrier. A wafer frame is mounted on the wafer of the wafer assembly. The layer of wax is softened. The wafer and the wafer frame mounted thereon are separated, by a first robot arm, from the carrier.

Aluminum alloy composite and method for joining thereof

The object of the present invention is to strongly join an aluminum alloy part with an FRP prepreg. An object obtained by subjecting an aluminum alloy to a suitable liquid treatment so as to form a surface having large, micron-order irregularities and also fine irregularities with a period of several tens of nanometers, eliminating the presence of sodium ions from the surface and additionally forming a surface film of aluminum oxide, which is thicker than a natural oxide layer, has been found to have a powerful adhesive strength with epoxy-based adhesives. By simultaneously curing an FRP prepreg which uses the same epoxy-based adhesive in the matrix, an integral composite or structure in which FRP and aluminum alloy have been united at a joining strength of unprecedented magnitude is produced.

Pre-Cut Multilayer Packaging Material

The present invention relates to a pre-cut multilayer packaging material comprising a plurality of successive entirely cut layers with the exception of one layer, said layer being only partially cut.

PEELING DEVICE, PEELING SYSTEM AND PEELING METHOD

A peeling device for peeling off a substrate to be processed and a support substrate from an overlapped substrate, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive, which includes: a first holding unit configured to heat the substrate to be processed and configured to hold the substrate to be processed; a second holding unit configured to heat the support substrate and configured to hold the support substrate; a moving mechanism configured to horizontally move at least one of the first holding unit and the second holding unit relative to each other; and an inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed or a bonding surface of the support substrate. 1. A peeling device for peeling off a substrate to be processed and a support substrate from an overlapped substrate , the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive , the peeling device comprising:a first holding unit provided with a heating mechanism to heat the substrate to be processed and configured to hold the substrate to be processed;a second holding unit provided with a heating mechanism to heat the support substrate and configured to hold the support substrate;a moving mechanism configured to move at least one of the first holding unit and the second holding unit relative to each other in a horizontal direction; andan inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed or a bonding surface of the support substrate,wherein the inert gas supply mechanism includes a porous portion with a plurality of holes formed therein and a gas supply pipe connected to the porous portion to supply the inert gas to the porous portion, andwherein the porous portion is provided to be vertically spaced apart from the bonding surface of the substrate to be ...

Peeling system, peeling method, and computer storage medium

A peeling system includes: a carry-in/carry-out station that loads/unloads substrates to be processed, support substrates, or stacked substrates in which these are made to adhere; a peeling process station that carries out prescribed processing on substrates to be processed, support substrates and stacked substrates; and a transport station provided between the carry-in/carry-out station and the peeling process station. The peeling process station has a peeling device that peels the stacked substrates, a first washing apparatus that washes peeled substrates to be processed, and a second washing apparatus that washes the peeled support substrates. The pressure inside the transport station is a positive pressure in relation to the pressure inside the peeling device, the pressure inside the first washing apparatus, and the pressure inside the second washing apparatus. The pressure inside a transport apparatus is a positive pressure in relation to the pressure inside the peeling device and the pressure inside the first washing apparatus.

SEPARATION METHOD, SEPARATION APPARATUS, AND SEPARATION SYSTEM

A method includes: a first step of disposing the superposed substrate at a position where the superposed substrate is not in contact with a first holding unit and a second holding unit in a space between the first holding unit and the second holding unit, and supplying an inert gas into the space; a second step of thereafter relatively moving the first holding unit and the second holding unit in the vertical direction, and holding the processing target substrate by the first holding unit and holding the supporting substrate by the second holding unit; and a third step of thereafter relatively moving the first holding unit and the second holding unit in the horizontal direction while heating the processing target substrate held by the first holding unit and the supporting substrate held by the second holding unit, to separate the processing target substrate and the supporting substrate from each other. 1. A separation method of separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive , into the processing target substrate and the supporting substrate using a separation apparatus , a first holding unit that includes a heating mechanism for heating the processing target substrate and holds the processing target substrate;', 'a second holding unit that includes a heating mechanism for heating the supporting substrate and holds the supporting substrate;', 'a raising and lowering mechanism that raises and lowers the superposed substrate in a vertical direction between the first holding unit and the second holding unit;', 'a moving mechanism that relatively moves at least the first holding unit or the second holding unit in a vertical direction and a horizontal direction; and', 'a gas supply part that supplies an inert gas into a space between the first holding unit and the second holding unit,, 'the separation apparatus comprisingthe separation method comprising:a first step of disposing the ...

DEVICE FOR RELEASING AN INTERCONNECT LAYER THAT PROVIDES CONNECTION BETWEEN A CARRIER AND A WAFER

A device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination. The device includes rotation means for rotation of the carrier-wafer combination in a release position, and a connection release means for providing an immersion bath that receives the carrier-wafer combination. 1. Device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination , said device comprising:a rotation means for rotation of the carrier-wafer combination in a release position; and a working chamber in which at least a section of the peripheral edge of the carrier-wafer combination can be accommodated in the working chamber, and', 'means for delivering a solvent to the working chamber, said solvent for dissolving the interconnect layer at the peripheral edge of the carrier-wafer combination., 'a connection release means for providing an immersion bath that receives the carrier-wafer combination, said connection release means including2. Device according to claim 1 , wherein the solvent acts at the peripheral edge of the carrier-wafer combination.3. Device according to claim 1 , wherein the connection release means has a U-shaped cross section that defines said working chamber.4. Device according to claim 1 , wherein said working chamber is defined by a pair of legs and a side wall claim 1 , said working chamber open towards the carrier-wafer combination.5. Device according to claim 1 , wherein said device further comprises:a receiving means for receiving the carrier-wafer combination on a receiving plane having a tilt angle to the horizontal that is between 5° and 90°.6. Device according to claim 5 , wherein said tilt angle is between 25° and 90°.7. Device according to claim 6 , wherein said tilt angle is between 45° and 90°.8. Device according to claim 7 , wherein said tilt angle is 90°.9. Device according to claim 1 , wherein the connection ...

DEVICE AND METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE

Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate. 1. A method for at least partially detaching a product substrate from a carrier substrate wherein the product substrate and the carrier substrate are bonded together by a connecting layer , said method comprising steps of:exposing the connecting layer to fluid materials that include a connection detachment material for dissolving the connecting layer, andexposing the connecting layer to sound waves produced by a sound generating material for accelerating the rate that the product substrate is detached from the carrier substrate.3. The method of claim 1 ,whereinthe connection detachment material acts only in the area of the periphery of the product substrate.4. The method of claim 1 , 'rotating the carrier substrate and the product substrate using a rotation device, wherein only a portion of the periphery of the carrier substrate and the product substrate is in contact with the connection detachment material at any given time and wherein rotation of the carrier substrate and the product substrate provides contact along the entire periphery of the carrier substrate and the product substrate.', 'further comprising the step of5. The method of claim 1 , 'the connecting layer is applied as a glue only in a peripheral area of the carrier substrate and the product substrate.', 'wherein'} ...

SURROGATE PATCH ASSEMBLY FOR A REWORK AREA OF A COMPOSITE STRUCTURE

A surrogate patch assembly for a rework area of a structure comprises a surrogate patch body which may be formed of a material for drawing moisture from the rework area. The patch assembly may include a sensor mounted to the surrogate patch body. The sensor may comprise a thermal sensor for sensing the temperature of the rework area and the surrogate patch body. The sensor may comprise a moisture sensor for sensing moisture drawn into the surrogate patch body. 1. A surrogate patch assembly for a rework area of a structure , comprising:a surrogate patch body formed of a material for drawing moisture from the rework area; and a thermal sensor for sensing a temperature of at least one of the rework area and the surrogate patch body; and', 'a moisture sensor for sensing moisture in the surrogate patch body., 'at least one sensor mounted to the surrogate patch body and being configured as one of the following2. The surrogate patch assembly of wherein:the moisture sensor comprises at least one of a moisture detection strip and an electrochemical impedance spectroscopy (EIS) sensor.3. The surrogate patch assembly of wherein:the surrogate patch body includes a top surface having a plurality of moisture sensors mounted thereon.4. The surrogate patch assembly of wherein:the surrogate patch body has top and bottom surfaces, at least one of the sensors being mounted in one of the following locations: the top surface, the bottom surface, embedded within the surrogate patch body between the top and bottom surfaces.5. The surrogate patch assembly of wherein:the surrogate patch body comprises a plurality of layers;at least one of the sensors being interposed between a pair of the layers.6. The surrogate patch assembly of wherein:the material comprises one of natural and synthetic material including at least one of the following: wool, cotton, silk, linen, polyester, nylon, acrylic.7. The surrogate patch assembly of wherein:the material comprises felt.8. The surrogate patch assembly ...

Bendable carrier mount, device and method for releasing a carrier substrate

A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the product substrate.

METHODS AND SYSTEM FOR PRODUCING ON-DEMAND REDUCTION IN COUPLING STRENGTH OF PRESSURE-SENSITIVE ADHESIVES

The systems and methods of the present disclosure relate to safely coupling and decoupling various solid objects with the use of pressure-sensitive adhesive. In particular, the disclosure relates to methods and systems for delivering vibrational energy to a pressure-sensitive coupled structure, sufficient to decrease coupling strength of the pressure-sensitive adhesive as well as to de couple or reposition the coupled objects. 1104-. (canceled)105. A method of decoupling a first object from a second object , the first object being coupled to the second object by a pressure-sensitive adhesive (PSA) and requiring a first force to be decoupled , the method comprising:decreasing a coupling strength of the PSA by delivering an amount of vibrational energy to one or more of the first object, the second object and the PSA,wherein: 'the second force is less than the first force; and', 'the coupling strength of the PSA is reduced to require a second force to decouple the first and second objects, and'}at least partially decoupling the first and second objects by applying the second force.106. The method as recited in claim 105 , further comprising delivering the vibrational energy proximate to or at an edge of one or more of the first and second objects or at a peel interface of the first object or the second object and the PSA.107. The method as recited in claim 105 , wherein at least partially decoupling comprises moving the first object or the second object in a first direction which may be substantially perpendicular to an interface between the first object or the second object and the PSA.108. The method as recited in claim 105 , wherein one or more of the first and second objects comprise a flexible material such as a sheet claim 105 , strip claim 105 , block claim 105 , or combination thereof.109. The method as recited in claim 105 , wherein one or more of the first and second objects comprise a rigid material such as animal or mammalian skin claim 105 , bone or other ...

THERMOPLASTIC COATING AND REMOVAL USING BONDING INTERFACE WITH CATALYTIC NANOPARTICLES

The present disclosure generally describes techniques suitable for use in the construction or recycling of composite materials. An article may comprise a thermoplastic coupled to a bonding interface layer, with a coating layer applied to the surface of the bonding interface layer. A bonding interface layer may comprise catalytic nanoparticles embedded within and/or encapsulated by one or more radiatively unstable polymers. Application of ionizing radiation to the article may release a catalyst at the bonding interface. Application of heat and/or stress to the article may enhance catalytic degradation of the remaining bonding interface and uncoupling of the thermoplastic from the coating layer. Embodiments of methods, compositions, articles and/or systems may be disclosed and claimed. 112.-. (canceled)13. A method for removing a coating from an article of manufacture , the method comprising:applying ionizing radiation to the article of manufacture, wherein the article comprises a coating layer, a thermoplastic surface, and a bonding interface, the bonding interface disposed between and coupled to the thermoplastic surface and the coating layer, wherein the bonding interface comprises radiatively unstable polymers and catalytic nanoparticles embedded within the radiatively unstable polymers, and wherein application of ionizing radiation facilitates release of the catalytic nanoparticles from the radiatively unstable polymers at the bonding interface of the article; andapplying one or more of heat or force to the article to enhance catalytic degradation of the bonding interface of the article.14. The method of claim 13 , wherein applying one or more of heat or force comprises applying force to the article along a plane of the bonding interface of the article.15. The method of claim 13 , wherein applying one or more of heat or force comprises applying heat and force to the article.16. The method of claim 13 , further comprising uncoupling the coating layer from the ...

Adhesive Patch and Method of Using the Same

The disclosure provides, in part, adhesive patches for repairing damaged surfaces of health care devices. In one of its aspects the disclosure provides a method of repairing the surface of health care device by applying an adhesive patch over a damaged portion of the surface, the patch comprising a film layer and an adhesive layer. In another one of its aspects, the disclosure provides an adhesive patch for repairing the surface of a health care device comprising a film layer and an adhesive layer. 1. A repair patch for health care devices , said patch comprising a film layer and an adhesive wherein the patch has an average edge thickness of 10 mil or less.2. A repair patch for health care devices , said patch comprising a film layer and an adhesive wherein the patch has an average of elongation of 30% or greater.3. A repair patch for health care devices , said patch comprising a film layer and an adhesive wherein the patch has an adhesion value of at least about 2.5 lbs/inch.4. A patch according to any of to , comprising an antimicrobial agent.5. A patch according to any of to , wherein the film layer comprises polyethylene , polyurethane , polypropylene , nylon , silicone , polyamide , polyester , polyvinyl , or a combination thereof.6. A patch according to any of to , wherein the film layer comprises polyvinyl , polyurethane , or a combination thereof.7. A patch according to any of to , wherein the adhesive is a pressure-sensitive adhesive.8. A patch according to any of to , wherein the adhesive is comprised within an adhesive layer.9. A patch according to any of to , wherein the adhesive is comprised within an adhesive layer and the layer comprises acrylic.10. A patch according to any of to , wherein the patch comprises a film layer and an adhesive layer , each layer having an average thickness of from 1 to 9 mils , wherein the average thickness of the two layers does not exceed 10 mils.11. A patch according to any of to , wherein the health care device is a ...

FILM PEELING APPARATUS AND FILM PEELING METHOD USING THE SAME

A film peeling apparatus includes a peeling pin that push-lifts a first end portion of a cut portion of a film toward a second end portion of the cut portion, a peeling roller that push-lifts the second end portion of the cut portion toward the first end portion of the cut portion by closely contacting the second end portion of the cut portion and rotating, and an absorbing unit that absorbs and removes the cut portion of the film push-lifted by the peeling pin and peeling roller. 1. A film peeling apparatus , comprising:a peeling pin that push-lifts a first end portion of a cut portion of a film toward a second end portion of the cut portion;a peeling roller that push-lifts the second end portion of the cut portion toward the first end portion of the cut portion by closely contacting the second end portion of the cut portion and rotating; andan absorbing unit that absorbs and removes the cut portion of the film push-lifted by the peeling pin and peeling roller.2. The film peeling apparatus of claim 1 , further comprising a gap probe that measures a distance between a panel on which the film is located and the film peeling apparatus and that determines whether the cut portion is properly removed based on the measured distance.3. The film peeling apparatus of claim 1 , wherein the absorbing unit includes:an absorbing nozzle that contacts the cut portion;a vacuum pump that applies an absorbing force to the absorbing nozzle;an absorbing tube that interconnects the absorbing nozzle and the vacuum pump; anda scrap case, into which the cut portion is introduced via the absorbing tube and in which the introduced cut portion is housed.4. The film peeling apparatus of claim 1 , wherein the peeling pin is made of a plastic material or a metal.5. The film peeling apparatus of claim 4 , wherein the peeling pin is made of a plastic material that includes a polyether ether ketone.6. The film peeling apparatus of claim 4 , wherein the peeling pin is made of a metal that includes a ...

Double-sided pressure-sensitive adhesive sheet, laminate and method for peeling plates

A double-sided pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer containing an acrylic polymer formed of a component comprising, as an essential monomer component, an alkyl (meth)acrylate having an alkyl group having 9 or less carbon atoms. A shear storage elastic modulus at 23° C. of the pressure-sensitive adhesive layer, which is measured by dynamic viscoelasticity measurement, is 5.0×10 5 Pa or less, and a shear storage elastic modulus at −50° C. of the pressure-sensitive adhesive layer, which is measured by dynamic viscoelasticity measurement, is 1.0×10 8 Pa or more.

Labels Compatible with Recycling

The present invention relates to adhesive compositions, facestocks and/or packaging labels containing same, where such compositions, facestocks and/or labels are designed to facilitate the recyclability of a plastic article formed from any suitable polymer or mixture of polymers (e.g., a polyethylene terephthalate (PET), recycled polyethylene terephthalate (rPET), high density polyethylene (HDPE), polyvinyl chloride (PVC), low density polyethylene (LDPE), polypropylene (PP), polystyrene (PS), polyesters, recycled polyesters, polylacticacid (PLA), biopolymers, cellulose or other types of polymers or plastics). In another embodiment, the present invention relates to a method for removing an adhesive composition, facestock and/or packaging label containing same, from a plastic article that is to be recycled and/or subjected to multi-generational recycling. 1. A method of removing a facestock/adhesive construction from one or more articles to be recycled , the method comprising the steps of: a face layer, wherein the face layer is formed from a facestock material selected from olefin polymers, polystyrene, PET, rPET, polylactic acid, biopolymers, cellulose, and combinations thereof; and', 'an adhesive layer,, '(a) supplying at least one article to be later recycled, the article having attached thereto at least one facestock/adhesive construction including'}wherein the facestock is able to be removed from a plastic or metal article in a manner that enables recycling of the plastic or metal article; and(b) subjecting the article containing the at least one facestock/adhesive construction to at least one caustic solution until the facestock/adhesive construction releases from the article to be recycled.2. The method of claim 1 , wherein the temperature of the caustic solution is between 75° C. and 95° C.3. The method of claim 1 , where the concentration of caustic material in the caustic solution is 10% or less.4. The method of any of claim 1 , where the caustic solution ...

DELAMINATION SYSTEM

A delamination system delaminates a laminated substrate, in which a first substrate and a second substrate are bonded together, into the first substrate and the second substrate. The delamination system has a first processing block processing the laminated substrate or the delaminated first substrate and a second processing block processing the delaminated second substrate. The first processing block has a delamination station having a delamination device that delaminates the laminated substrate transferred by a first transfer device into the first substrate and the second substrate. The second processing block has a second cleaning station and a delivery station. The second cleaning station has a second cleaning device cleaning the delaminated second substrate. The delivery station is disposed between the second cleaning station and the delamination station. The delivery station receives the delaminated second substrate from the delamination station and delivers it to the second cleaning station. 1. A delamination system for delaminating a laminated substrate , in which a first substrate and a second substrate are bonded together , into the first substrate and the second substrate , the laminated substrate disposed in an opening of a frame , the opening having a diameter larger than the laminated substrate , the laminated substrate being held by the frame with a non-bonding surface of the first substrate attached to a tape provided in the opening , the delamination system comprising:a first processing block configured to process at least one of the laminated substrate and the delaminated first substrate; anda second processing block configured to process the delaminated second substrate, wherein the first processing block comprises:a carry-in/carry-out station in which the laminated substrate held by the frame or the delaminated first substrate is placed;a first transfer device configured to transfer at least one of the delaminated first substrate and the laminated ...

Discretely Tailored Multi-Zone Bondline for Fail-Safe Structural Repair

A repair patch for reworking an inconsistent area of a composite structure includes a patch body adapted to cover the inconsistent area and having a first patch region, a second patch region outside the first patch region and a first separation zone between the first patch region and the second patch region, with the first patch region, the first separation zone and the second patch region having increasing interlaminar fracture toughness from a center to an edge of the patch body; and a layer of adhesive for bonding the patch body to the composite structure.

SEPARATION APPARATUS, SEPARATION SYSTEM AND SEPARATION METHOD

A separation apparatus according to the present disclosure includes a first holding unit, a cutting unit, a measuring unit and a position adjusting unit. The first holding unit holds a first substrate of a superposed substrate formed by joining the first substrate and a second substrate. The cutting unit cuts a joining portion of the first substrate and the second substrate. The measuring unit measures a distance from a predetermined measurement reference position to a holding surface of the first holding unit or to an object interposed between the measurement reference position and the holding surface. The position adjusting unit adjusts a cutting position of the cutting unit based on a result of the measuring unit and information acquired in advance with respect to a thickness of the superposed substrate. 1. A separation apparatus for separating a superposed substrate formed by joining a first substrate and a second substrate , the separation apparatus comprising:a first holding unit configured to hold the first substrate of the superposed substrate;a cutting unit configured to cut a joining portion of the first substrate and the second substrate;a measuring unit configured to measure a distance from a predetermined measurement reference position to a holding surface of the first holding unit or to an object interposed between the measurement reference position and the holding surface; anda position adjusting unit configured to adjust a cutting position of the cutting unit based on a result of the measuring unit and information acquired in advance with respect to a thickness of the superposed substrate.2. The separation apparatus of claim 1 , wherein the cutting unit performs cutting into the joining portion when the difference between the thickness calculated by using the distance from the measurement reference position to the holding surface and the distance from the measurement reference position to the superposed substrate held in the first holding unit claim ...

Film peeling method and film peeling device for film-coated flat wire

A film peeling method for a film-coated flat wire that is performed by a film peeling device including: a rotational holder that can rotationally convey in a perpendicular direction to a rotational axis; a positioning mechanism that positions a film-coated flat wire in a longitudinal direction; and a working section that is provided in plural, aligned at specified intervals, and works an end portion of the film-coated flat wire, the method includes: holding the film-coated flat wire that is cut in a specified length in advance by the rotational holder; rotationally conveying the film-coated flat wire that is held by the rotational holder in the perpendicular direction to the rotational axis; positioning the conveyed film-coated flat wire by the positioning mechanism; and working the end portion of the film-coated flat wire by the working section.

DELAMINATION DEVICE

Provided is a delamination device of delaminating a laminated substrate obtained by bonding a first substrate and a second substrate, the laminated substrate being disposed in an opening of a frame, the opening having a diameter larger than that of the laminated substrate, and the laminated substrate being held by the frame with a non-bonding surface of the first substrate attached to a tape provided in the opening. The delamination device includes: a first holding unit configured to hold the second substrate of the laminated substrate from above; a second holding unit configured to hold the first substrate of the laminated substrate from below through the tape; and a moving mechanism configured to move the first holding unit in a direction away from the second holding unit. 1. A delamination device of delaminating a laminated substrate obtained by bonding a first substrate and a second substrate , the laminated substrate being disposed in an opening of a frame , the opening having a diameter larger than that of the laminated substrate , and the laminated substrate being held by the frame with a non-bonding surface of the first substrate attached to a tape provided in the opening , the delamination device comprising:a first holding unit configured to hold the second substrate of the laminated substrate from above;a second holding unit configured to hold the first substrate of the laminated substrate from below through the tape; anda moving mechanism configured to move the first holding unit in a direction away from the second holding unit.2. The device of claim 1 , further comprising:a local movement unit configured to move a portion of an outer periphery of the first holding unit in the direction away from the second holding unit.3. The device of claim 1 , further comprising:a frame holding unit configured to hold the frame from below.4. The device of claim 3 , wherein the frame holding unit is configured to hold the frame in a location lower than a location at ...

FILM PEELING DEVICE

A film peeling device for peeling a film from a substrate including a transfer module configured to transfer the substrate that is arranged in a vertical direction with respect to a bottom surface of the substrate, and a peeling module configured to peel the film from the substrate transferred by the transfer module. 1. A film peeling device for peeling a film from a substrate , the film peeling device comprising:a transfer module configured to transfer the substrate that is arranged in a vertical direction with respect to a bottom surface of the substrate; anda peeling module configured to peel the film from the substrate transferred by the transfer module.2. The film peeling device of claim 1 , wherein the transfer module comprises:a front substrate transfer unit at a front side of the peeling module and configured to shift the substrate to the peeling module; anda rear substrate transfer unit at a rear side of the peeling module and configured to shift the substrate peeled by the peeling module.3. The film peeling device of claim 2 , wherein the front transfer unit and the rear transfer unit respectively comprise:an extending guide extended in a substrate transfer direction;a substrate gripper installed on the extending guide, shiftable along the extending guide, and fixable to a side of the substrate; anda first drive motor configured to shift the substrate gripper along the extending guide.4. The film peeling device of claim 3 , wherein the extending guide claim 3 , the substrate gripper claim 3 , and the first drive motor are arranged as a pair at a top and a bottom of the substrate claim 3 , respectively.5. The film peeling device of claim 3 , wherein the extending guides of the front substrate transfer unit and the rear substrate transfer unit are separated from each other.6. The film peeling device of claim 3 , wherein the extending guides of the front substrate transfer unit and the rear substrate transfer unit are integrally formed.7. The film peeling ...

Cartridge and tubular container triming and refinishing apparatus for lnk and label removal and method of use

A device for removing a thin outer layer from the surface of a cartridge or tubular container such as a caulk cartridge for removal of ink, contaminant, adhesive, or printed or stamped label from the outside of the cartridge. The apparatus includes cartridge hopper and a cartridge handling mandrel or plunger which automatically removes a cartridge from the hopper aligning same for insertion of the cartridge axially through the throat of a spinning ring which contains at least one and preferably a plurality of inwardly extending knifes. The spinning knife distal end trims or peels off the label, adhesive, ink, imperfections, or even a thin film from an outer layer of a selected thickness effectively reconditioning the cartridge for reuse to be filled with virgin material or to be used as uncontaminated re-ground material to be sold as scrap. 1. A cartridge and tubular container refinishing apparatus , comprising:a base plate;a label removing unit being rigidly attached to said base plate, said label removing unit including a frame comprising two vertical end walls with a bushing type bearing rigidly attached horizontally therebetween, said bushing having a cylinder rotatably held therewithin, said cylinder being open at both ends and being caused to spin by a motor driven belt drivingly engaged at a front end thereof, said cylinder having a knife-holding ring rigidly connected to a rear end face thereof, said cylinder and said knife ring being configured to allow said cartridge to pass axially therethrough, said ring having at least one slot allowing at least one knife to be adjustably held therein, said ring having at least one threaded aperture formed therein and at least one screw threaded into said at least one threaded aperture for engaging and rigidly securing said knife, said knife having a label shaving edge extending inward toward an axial center of said knife-holding ring, said frame having a first cartridge hopper on one side adjacent to said horizontal ...

CURVED DISPLAY PANEL MANUFACTURING METHOD

A curved display panel manufacturing method is provided. The curved display panel manufacturing method in which a display panel in a desired curved shape is manufactured using a prefabricated flat liquid crystal panel including a lower substrate and an upper substrate formed of glass and opposite each other, each of the lower substrate and an upper substrate being provided with a polarizing plate, and a liquid crystal layer formed between the lower substrate and the upper substrate, includes separating the polarizing plates from the lower substrate and the upper substrate, removing the outer surface of the liquid crystal panel to reduce the lower substrate and the upper substrate from which the polarizing plates are separated to a designated thickness, and bending the liquid crystal panel having the removed outer surface in a desired curved shape. 1. A curved display panel manufacturing method in which a display panel in a desired curved shape is manufactured using a prefabricated flat liquid crystal panel including a lower substrate and an upper substrate formed of glass and opposite each other , each of the lower substrate and an upper substrate being provided with a polarizing plate , and a liquid crystal layer formed between the lower substrate and the upper substrate , comprising:separating the polarizing plates from the lower substrate and the upper substrate;removing the outer surface of the liquid crystal panel to reduce the lower substrate and the upper substrate from which the polarizing plates are separated to a designated thickness;bending the liquid crystal panel having the removed outer surface in a desired curved shape; andattaching prefabricated transparent substrates bent in the same curved shape as the desired curved shape to the liquid crystal panel bent in the desired curved shape using an adhesive so as to maintain the curved shape of the liquid crystal panel.2. The curved display panel manufacturing method according to claim 1 , further ...

Adhesive sheet for protecting back face of solar battery module, and solar battery module using the same

An adhesive sheet for protecting the back face of a solar battery module includes a synthetic resin substrate layer, and an adhesive compound layer laminated on the back face side of the substrate layer, and the adhesive compound layer having an average thickness of 0.01 mm or greater and 1 mm or less.

Apparatus for temporary bonding of substrate on a carrier and method thereof

An apparatus for temporarily bonding a substrate on a carrier includes an electrically conductive adhesion layer disposed between the carrier and the substrate, and a current supply source configured to apply a current to the electrically conductive adhesion layer.

ADHESIVE PATCH AND METHOD OF USING THE SAME

The disclosure provides, in part, adhesive patches for repairing damaged surfaces of health care devices. In one of its aspects the disclosure provides a method of repairing the surface of health care device by applying an adhesive patch over a damaged portion of the surface, the patch comprising a film layer and an adhesive layer. In another one of its aspects, the disclosure provides an adhesive patch for repairing the surface of a health care device comprising a film layer and an adhesive layer. 1. A repair patch for repairing a damaged surface of a healthcare device , said patch comprising a film layer and a permanent adhesive layer , wherein the permanent adhesive layer is between the film layer and the damaged surface and is applied directly to the damaged surface , wherein the permanent adhesive layer has an adhesion value between the permanent adhesive layer and the damaged surface to which the patch is applied of 2.5 lbs/in or greater 7 days after application at a temperature of 16-21° C. and a relative humidity of 15-50% to reduce the risk of peeling or separation of the patch from the damaged surface , and wherein the adhesion value is measured by ASTM D3330.2. The repair patch of claim 1 , wherein the patch has an average edge thickness of 10 mil or less.3. The repair patch of claim 1 , wherein said film layer includes a material selected from the group consisting of polyethylene claim 1 , polyurethane claim 1 , polypropylene claim 1 , nylon claim 1 , silicone claim 1 , polyamide claim 1 , polyester claim 1 , and polyvinyl.4. The repair patch of claim 1 , wherein the healthcare device is selected from the group consisting of mattresses claim 1 , patient exam tables claim 1 , chairs claim 1 , stretchers claim 1 , cots claim 1 , and treatment beds.5. The repair patch of claim 1 , wherein the film layer is selected to provide a covering over a damaged portion of a surface that is durable claim 1 , flexible claim 1 , and resistant to cleaning products.6. The ...

RECORDING MEDIUM, RECORDED MATTER, AND METHODS OF MANUFACTURING THE MEDIUM AND THE MATTER

A recording medium, including: an ink-receiving layer configured to receive an ink for inkjet recording; and a transparent sheet having a total luminous transmittance of 50% or more, wherein the recoding medium has a layered structure in which the transparent sheet and the ink-receiving layer are sequentially stacked, and the ink-receiving layer includes a gap-absorption-type ink-receiving layer including a composition including at least inorganic fine particles and polyvinyl alcohol having a weight-average polymerization degree of 2,000 or more and 5,000 or less and a saponification degree of 70 mol % or more and 90 mol % or less. 140-. (canceled)41. A method of manufacturing a recorded matter comprising an image support on which an image is supported and a transferring material on which the image is recorded ,wherein the transferring material comprises:(a) an ink-receiving layer configured to receive an ink for inkjet recording;(b) a transparent sheet having a total luminous transmittance of 50% or more;(c) a releasing layer comprising a composition including a release agent; and(d) a base material sheet serving as a support for the releasing layer,wherein the transferring material has a layered structure in which the ink-receiving layer, the transparent sheet, the releasing layer, and the base material sheet are sequentially stacked, and the transparent sheet and the ink-receiving layer are in abutment with each other,wherein the ink-receiving layer comprises a gap-absorption-type ink-receiving layer comprising a composition including alumina fine particles having an average particle diameter of 120 nm or more and 200 nm or less, and polyvinyl alcohol having a weight average polymerization degree of 2,000 or more and 5,000 or less and a saponification degree of 70 mol % or more and 90 mol % or less, and wherein a content of the polyvinyl alcohol in the ink-receiving layer is 3.3 parts by mass or more and 100 parts by mass or less with respect to 100 parts by mass ...

Protected Substrate

A protected substrate includes a planar substrate having a surface and a burn-off temporary protective layer positioned over at least a portion of the surface. The burn-off temporary protective layer includes a wax, a polyolefin, a polyester, a polycarbonate, a polyether, or some combination thereof. The burn-off temporary protective layer is removable by a heat treatment process that does not substantially damage the surface. Various other protected substrates and methods for protecting a substrate are also disclosed. 1. A protected substrate , comprising:a planar substrate comprising a surface;a temporary protective layer positioned over at least a portion of the surface;a first temporary protective sheet positioned over at least a first portion of the surface; anda second temporary protective sheet positioned over at least a second portion the surface, wherein an overlapping portion of the second temporary protective sheet overlaps an overlapping portion of the first temporary protective sheet at an overlap;wherein a gap is defined by the overlap between the second temporary protective sheet and a portion of the surface,wherein a portion of the temporary protective layer is positioned between the second temporary protective sheet and the portion of the surface.2. The protected substrate of claim 1 , wherein the temporary protective layer is removable by burning claim 1 , vaporizing claim 1 , removing using a solvent claim 1 , or peeling.3. The protected substrate of claim 1 , wherein the planar substrate comprises glass.4. The protected substrate of claim 1 , further comprising a functional coating positioned over the surface and between the surface and the temporary protective layer.5. The protected substrate of claim 4 , wherein the functional coating comprises a low-E coating layer.6. The protected substrate of claim 1 , wherein the temporary protective layer comprises a material comprising a wax claim 1 , an organic oil claim 1 , a polyolefin claim 1 , a poly ...

THERMALLY CONDUCTIVE DE-BONDING AID

Touchscreen computing devices are often assembled by applying an adhesive to an interface perimeter between a cover glass and a chassis. Occasionally, a device is de-bonded to troubleshoot errors in the functionality of the device. The adhesive often is resistant to releasing the bond between the cover glass and a chassis by mechanical force and the cover glass may be damaged during disassembly. Passive and/or active de-bonding aids facilitate transfer of thermal energy to the adhesive in a manner that avoids or minimizes the transfer of thermal energy to heat-sensitive components of the device. 1. A computing device display comprising:a chassis;a cover glass;a thermally sensitive adhesive oriented between the cover glass and the chassis and extending about an entire perimeter of the display; anda thermally conductive de-bonding aid including a passive array of thermally conductive pads also oriented between the cover glass and the chassis and located in multiple discrete sections of the perimeter of the display spaced apart from a sensitive component mounted within the display.2. The computing device display of claim 1 , wherein the thermally conductive de-bonding aid further includes an active de-bonding aid.3. The computing device display of claim 1 , wherein the sensitive component is one of a camera and an antenna.4. The computing device display of claim 1 , further comprising:a mask also oriented between the cover glass and the chassis and extending about the entire perimeter of the display, wherein the thermally conductive de-bonding aid is oriented between the mask and the chassis.5. The computing device display of claim 1 , wherein the thermally conductive de-bonding aid is screen-printed onto the cover glass.6. (canceled)7. The computing device display of claim 1 , wherein the thermally conductive de-bonding aid includes a thermally conductive powder entrained adhesive.8. The computing device display of claim 2 , wherein the active de-bonding aid includes ...

ELECTRICAL DEBONDING TYPE ADHESIVE SHEET, JOINED BODY, AND DEBONDING METHOD FOR JOINED BODY

An object of a first embodiment of the present invention is to provide an electrical debonding type adhesive sheet which can be applied while inhibiting the trapping of air bubbles and while easily avoiding surface irregularities, etc., and which gives a joined body that can be easily debonded. The electrical debonding type adhesive sheet according to the first embodiment of the present invention includes a substrate for voltage application, a first adhesive layer, which is constituted of an electrically debondable adhesive and is formed on an electroconductive surface of the substrate for voltage application, and a second adhesive layer, which is formed on the opposite surface of the substrate for voltage application, the electrical debonding type adhesive sheet including a plurality of linked parts and a linking part which links the plurality of linked parts to each other. 1. An electrical debonding type adhesive sheet comprising a substrate for voltage application in which at least one surface has electrical conductivity , a first adhesive layer , which is constituted of an electrically debondable adhesive and is formed on the electroconductive surface of the substrate for voltage application , and a second adhesive layer , which is formed on that surface of the substrate for voltage application which is on the reverse side from the first adhesive layer ,the electrical debonding type adhesive sheet including a plurality of linked parts and a linking part which links the plurality of linked parts to each other.2. The electrical debonding type adhesive sheet according to claim 1 , which has a comb shape.3. A joined body comprising the electrical debonding type adhesive sheet according to claim 1 , a first adherend claim 1 , which is adhered to the first adhesive layer claim 1 , and a second adherend claim 1 , which is adhered to the second adhesive layer claim 1 ,wherein the first adherend is electroconductive.4. A joined body comprising a first adherend claim 1 , ...

SUPPORT ASSEMBLY FOR USE IN SEMICONDUCTOR MANUFACTURING TOOLS WITH A FUSIBLE BOND

A support assembly includes a first functional element, a second functional element adjacent to the cooling plate, and an adhesive layer disposed between the cooling plate and the substrate. An intermediate layer is disposed between the cooling plate and the substrate. The intermediate layer has a melting temperature less than a temperature that the adhesive layer melts or decomposes at in order to provide for recycling of the support assemblycar. 1. A support assembly comprising:a cooling plate;a substrate adjacent to the cooling plate;an adhesive layer disposed between the cooling plate and the substrate; andan intermediate layer disposed between the cooling plate and the substrate, the intermediate layer having a melting temperature less than a temperature that the adhesive layer melts or decomposes at.2. The support assembly of claim 1 , wherein the intermediate layer is disposed on the cooling plate.3. The support assembly of claim 1 , wherein the intermediate layer is applied using a layered process.4. The support assembly of claim 1 , further comprising a heater disposed between the cooling plate and the substrate.5. The support assembly of claim 4 , wherein the intermediate layer is disposed between the heater and the cooling plate.6. The support assembly of claim 4 , wherein the intermediate layer is disposed between the heater and the substrate.7. The support assembly of claim 4 , wherein the intermediate layer is a first intermediate layer claim 4 , the first intermediate layer disposed between the heater and the cooling plate claim 4 , and the support assembly further comprises a second intermediate layer disposed between the heater and the substrate claim 4 , the second intermediate layer having a melting point less than a temperature that the adhesive layer melts or decomposes at.8. The support assembly of claim 1 , further comprising a heater embedded within the substrate.9. The support assembly of claim 1 , wherein a major constituent of the adhesive ...

ADHESIVE COMPOSITION FOR PEELING OFF BY IRRADIATION WITH LIGHT, LAYERED PRODUCT, AND PRODUCTION METHOD AND PEELING METHOD FOR LAYERED PRODUCT

An adhesive composition for use in debonding with light irradiation, which composition can achieve debonding through irradiation with light, characterized in that the adhesive composition contains an adhesive component (S) and a light-absorbing organic compound (X); and the light-absorbing organic compound (X) contains, in the molecule thereof, one or more aromatic rings, one or more rings each containing a heteroatom forming the ring, and one or more groups selected from among a carbonyl group and a thiocarbonyl group. 115-. (canceled)16. An adhesive composition for use in debonding with light irradiation , which composition can achieve debonding through irradiation with light , wherein:the adhesive composition comprises an adhesive component (S) and a light-absorbing organic compound (X); andthe light-absorbing organic compound (X) contains, in the molecule thereof, one or more aromatic rings, one or more rings each containing a heteroatom forming the ring, and one or more groups selected from among a carbonyl group and a thiocarbonyl group.17. The adhesive composition for use in debonding with light irradiation according to claim 16 , which composition can achieve debonding through irradiation with light claim 16 , wherein:the adhesive composition comprises an adhesive component (S) and a light-absorbing organic compound (X); andthe light-absorbing organic compound (X) contains, in the molecule thereof, one or more aromatic rings, one or more rings each containing a heteroatom forming the ring, and one or more carbonyl or thiocarbonyl groups.18. The adhesive composition for use in debonding with light irradiation according to claim 16 , wherein the light-absorbing organic compound (X) contains claim 16 , in the molecule thereof claim 16 , two or more aromatic rings claim 16 , two or more rings each containing a heteroatom forming the ring claim 16 , and two or more carbonyl or thiocarbonyl groups.19. The adhesive composition for use in debonding with light ...

FEEDER DEVICE

The present invention includes a tape peeling mechanism provided with a peeling member configured to enter a leading end surface in a feeding direction of fed component supply tape made from carrier tape and cover tape so as to peel the cover tape from the carrier tape, enabling a component to be supplied from at a component supply position, wherein the peeling member is displaced upwards after entering the leading end surface of the carrier tape as the component supply tape is fed. Accordingly, cover tape is reliably peeled without damaging components, and changeover work on the leading end of the component supply tape is not required. 1. A feeder device comprising:a tape feeding mechanism configured to feed component supply tape made from carrier tape that stores components respectively in many component storage sections formed in a lengthwise direction of the tape and cover tape attached to a specified attachment surface on an upper surface of the carrier tape that prevents the components from falling from the component storage sections; anda tape peeling mechanism provided with a peeling member configured to enter a leading end surface in a feeding direction of the fed component supply tape so as to peel the cover tape from the carrier tape as the component supply tape is fed thereby enabling the component to be supplied from the component storage section of the carrier tape at a component supply position,whereinthe peeling member is displaced upwards after entering the leading end surface of the carrier tape as the component supply tape is fed.2. The feeder device according to claim 1 , whereinthe peeling member has a leading end section configured to enter the leading end surface of the carrier tape first, the leading end section being formed including a leading end upper edge arranged lower than an upper surface height of the carrier tape and a lower surface configured to lower heading rearwards from the leading end upper edge.3. The feeder device according ...

System for Developing Composite Repair Patches on Aircraft or Other Composite Structures

A system for generating a repair patch for a damaged area of a composite structure may include a scanning module, a repair patch model generator and a cutting tool. The scanning module may be deployed at the location of the damaged composite structure. The scanning module may be configured to scan the damaged area to generate scanned data indicative of a shape, size and/or contours of the damaged area. The repair patch model generator may include processing circuitry configured to obtain the scanned data, obtain parent ply information of the damaged composite structure, and generating a patch model of a repair patch including size and shape definition for each of a plurality of plies based on the scanned data and the parent ply information. The cutting tool may be configured to receive cutting files based on the patch model to generate a plurality of cut plies that combine to form the repair patch. 16-. (canceled)7. A system for generating a repair patch for a damaged area of a composite structure , the system comprising:a scanning module deployable on-site at a location of the composite structure, the scanning module being configured to scan the damaged area to generate scanned data indicative of a shape, size and/or contours of the damaged area; obtain the scanned data;', 'obtain parent ply information of the composite structure; and', 'generate a patch model of a repair patch including size and shape definition for each of a plurality of plies based on the scanned data and the parent ply information, wherein the patch model is generated on-site at the location of the composite structure; and, 'a repair patch model generator comprising processing circuitry configured toa cutting tool located remote from the location of the composite structure and configured to receive cutting files based on the patch model to generate a plurality of cut plies that are separately cut and assembled remote from the location of the composite structure to form the repair patch for ...

PEELING APPARATUS FOR ALUMINUM PLATE MATERIAL AND METHOD FOR PEELING ALUMINUM PLATE MATERIAL

A peeling apparatus for an aluminum plate material is configured to be able to peel one or a plurality of aluminum plate materials from a stack of aluminum plate materials in which a plurality of aluminum plate materials are pressure-annealed and adhered to each other. The peeling apparatus includes a vibration transmitting section that is configured to be able to abut an outer peripheral surface of an aluminum plate material and is configured to be able to apply vibration along a stacking direction of the stack to the aluminum plate material, and a transducer that generates the vibration, and transmits the vibration to the vibration transmitting section. 1. A peeling apparatus for an aluminum plate material configured to be able to peel one or a plurality of aluminum plate materials from a stack of aluminum plate materials in which a plurality of aluminum plate materials are pressure-annealed and adhered to each other , comprising:a vibration transmitting section that is configured to be able to abut an outer peripheral surface of the aluminum plate material, and is configured to be able to apply vibration along a stacking direction of the stack to the aluminum plate material; anda transducer that is connected to the vibration transmitting section, generates the vibration, and transmits the vibration to the vibration transmitting section.2. The peeling apparatus for an aluminum plate material according to claim 1 , further comprising a moving mechanism configured to be able to relatively move the vibration transmitting section and the aluminum plate material.3. The peeling apparatus for an aluminum plate material according to claim 1 , wherein the vibration transmitting section abuts on a position that is 50 μm or more from an end surface in a plate thickness direction of the aluminum plate material toward a plate thickness center side claim 1 , of the outer peripheral surface of the aluminum plate material.4. The peeling apparatus for an aluminum plate material ...

EASILY PEELABLE LAMINATE LABEL, PRODUCTION METHOD THEREOF, USAGE METHOD THEREOF, ADHEREND WITH EASILY PEELABLE LAMINATE LABEL, AND OPENING DETERMINATION METHOD

The present invention provides an easily peelable laminate label including a base layer A, a brittle layer B, a visually recognizable layer C, an inhibition layer D, and a pressure-sensitive adhesive layer E; the brittle layer B, the visually recognizable layer C, and the inhibition layer D being laminated in this order between the base layer A and the pressure-sensitive adhesive layer E; the brittle layer B and the visually recognizable layer C being in contact with each other, the visually recognizable layer C and the inhibition layer D being in contact with each other, the inhibition layer D being disposed in a discontinuous pattern; and a form of failure when the easily peelable laminate label is subjected to 180° peeling being delamination and/or adhesive failure at an interface between the inhibition layer D and the layer in contact with the inhibition layer D. 1. An easily peelable laminate label comprisinga base layer A, a brittle layer B, a visually recognizable layer C, an inhibition layer D, and a pressure-sensitive adhesive layer E;the brittle layer B, the visually recognizable layer C, and the inhibition layer D being laminated in this order between the base layer A and the pressure-sensitive adhesive layer E;the brittle layer B and the visually recognizable layer C being in contact with each other;the visually recognizable layer C and the inhibition layer D being in contact with each other, the inhibition layer D being disposed in a discontinuous pattern; anda form of failure according to JIS K6866:1999 when the easily peelable laminate label is subjected to 180° peeling in accordance with JIS K6854-2:1999 being delamination (DF) and/or adhesive failure (AF) at an interface between the inhibition layer D and the layer in contact with the inhibition layer D in a portion where the inhibition layer D is provided and cohesive failure (CSF) of the brittle layer B in a portion where the inhibition layer D is not provided.2. The easily peelable laminate label ...

SYSTEM AND METHOD FOR REMOVAL OF A LAYER

A system includes a gripper device to grasp a disposable proxy. The gripper device is moveable to position a pressure sensitive adhesive in contact with the disposable proxy and apply a pressure force to adhere the pressure sensitive adhesive to the disposable proxy. The gripper device is moveable to position the pressure sensitive adhesive in contact with an edge portion of a first layer of a plurality of layers and apply a pressure force to adhere the pressure sensitive adhesive to the edge portion of the first layer. The system further includes a cutting device moveable to apply a cutting force to separate a sacrificial corner portion of the first layer proximate the edge portion of the first layer from a remaining portion of the first layer. The gripper device is movable to peel the remaining portion of the first layer from one or more remaining layers of the plurality of layers. 1. A system comprising:a gripper device configured to grasp a disposable proxy, wherein the gripper device is moveable to position a pressure sensitive adhesive in contact with the disposable proxy and apply a pressure force to adhere the pressure sensitive adhesive to the disposable proxy and remove the pressure sensitive adhesive from a dispenser, and wherein the gripper device is moveable to position the pressure sensitive adhesive in contact with an edge portion of a first layer of a plurality of layers and apply a pressure force to adhere the pressure sensitive adhesive to the edge portion of the first layer; anda support device, wherein the plurality of layers are held by a support surface of the support device;wherein the gripper device is movable to peel the first layer entirely from the one or more remaining layers of the plurality of layers.2. The system of claim 1 , wherein the system is an automated robotic system.3. The system of claim 1 , further comprising a cutting device moveable to apply a cutting force to separate a sacrificial corner portion of the first layer ...

RECYCLING OF COMPOSITES CONTAINING LAYERS UNSUITABLE FOR RECYCLING

An added layer attached to a textile sheet using polymeric adhesive placed over a textile sheet or between the textile sheet and an added layer is removed by applying heat or a solvent and at least one of an abrasive action, squeezing, or shaving action to remove the adhesive layer or both the added layer and the adhesive sublayer and to prepare the textile sheet for recycling into a new textile structure, preferably into a textile sheet performing the same function as the original textile sheet. 1. A method for processing a composite comprising a first layer and an added layer for recycling , the method comprising:applying heat, solvent or heat and solvent to the composite to liquefy the added layer without melting or dissolving the first layer;removing liquified added layer;forcing at least a portion of liquified added layer from the first layer; andprocessing the first layer with the added layer in a recycling process to generate a recycled raw material used for incorporation in a new composite.2. The method of claim 1 , wherein forcing at least a portion of the liquified added out of the first layer comprises squeezing the first layer.3. The method of claim 1 , wherein removing liquified added layer and forcing at least a portion of the liquified added out of the first layer comprise blowing heated air through the first layer claim 1 , applying suction to the first layer or blowing heated air through the first layer and applying suction to the first layer.4. The method of claim 1 , wherein the solvent comprises a ketone claim 1 , a paraffinic solvent or a napthenic solvent.5. The method of claim 1 , wherein the added layer comprises a pressure sensitive adhesive.6. The method of claim 1 , wherein the composite further comprises an adhesive layer between the added layer and the first layer to attach the added layer to the first layer;applying heat, solvent or heat and solvent further comprises applying heat, solvent or heat and solvent to the composite to liquefy ...

Glue filling method for multilayer thin film sensor structure

A glue filling method for a multilayer thin film sensor structure is disclosed herein. Two outer layers of a composite heat-resistant membrane are carved to have desired patterned holes; an inner layer is interposed between two outer layers to form a layered structure. The composite heat-resistant membrane is stuck onto the multilayer thin film sensor structure with the patterned holes aligned to an electric-conduction through-hole of the multilayer thin film sensor structure to form a filling region. A conductive glue is filled into the filling region. Sustained by the inner-layer heat-resistant membrane, the conductive glue protrudes from the patterned hole to cover a portion of the conductive metals on the surface of the multilayer thin film sensor structure. Thereby are simultaneously achieved a water-proof effect, an airtight effect and a fine interface compatibility.

LAMINATE, METHOD OF PEELING LAMINATE, AND METHOD OF MANUFACTURING FLEXIBLE DEVICE

A method of peeling a laminate according to the disclosure includes: forming a first adhesive layer on a first substrate, the first adhesive layer having adhesive force that satisfies the following Expression (1) and one or both of the following Expressions (2) and (3); firmly attaching a second substrate onto the first adhesive layer; forming a first functional layer on the second substrate; and peeling off the first substrate from the second substrate. 2. The method according to claim 1 , wherein the first adhesive layer has the adhesive force that satisfies the Expression (1) and both of the Expressions (2) and (3).3. The method according to claim 1 , further comprising forming a release layer on a surface claim 1 , of the second substrate claim 1 , that is to be firmly attached onto the first adhesive layer claim 1 , before the firmly attaching of the second substrate onto the first adhesive layer.4. The method according to claim 1 , further comprising forming a release layer on the first substrate before the forming of the first adhesive layer.5. The method according to claim 3 , wherein the release layer is made of an inorganic material.6. The method according to claim 1 , further comprising claim 1 , upon the forming of the first functional layer on the second substrate that is firmly attached onto the first substrate with the first adhesive layer in between claim 1 , making a cut on a peripheral part of the first functional layer and forming thereafter a protective film on the first functional layer.7. The method according to claim 1 , further comprising:firmly attaching a fourth substrate onto a third substrate with a second adhesive layer in between;attaching the fourth substrate and the second substrate to each other to cause the fourth substrate and the second substrate to be opposed to each other; andpeeling off the third substrate followed by the peeling off of the first substrate, after the attaching of the fourth substrate and the second substrate to ...

PROCESSING METHOD AND PROCESSING APPARATUS

A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate. 1. A processing method of processing a laminate in which a substrate , an adhesive layer , a release layer that is modified when absorbing light , and a supporting member are laminated in this order , the processing method comprising:a release layer removing process of modifying the release layer by irradiating the release layer with light, removing the supporting member from the laminate, and applying a stripping solution for removal of the release layer onto the release layer to remove the release layer; andan adhesive layer dissolving process of applying a dissolving solution for dissolution of the adhesive layer onto the adhesive layer to dissolve the adhesive layer.2. The processing method according to claim 1 , further comprising:a washing process of applying a washing solution, which removes the stripping solution that remains on the adhesive layer after the release layer removing process, between the release layer removing process and the adhesive layer dissolving process.3. The processing method according to claim 2 , further comprising:a drying process of drying the adhesive layer between the washing process and the adhesive layer dissolving process.4. The processing method according to claim 1 , wherein the stripping solution is composed of a material that does not dissolve the adhesive layer.5. The processing method according to claim 4 , wherein the stripping solution is alkaline.6. The processing method according to claim 5 , wherein the stripping solution is an amine-based compound.7. The ...

Tape dispenser and take-up reel for tape backing

This invention generally relates to a tape dispenser with automatic backing removal more particularly including a spindle rotatably mounted for receiving said supply of tape; a pinch roller set in tension having an adjustment to set the drag for the tape supply passing through the pinch rollers that convert a pull of the tape to a rotary motion; a take-up spindle for spooling the protective backing layer when separated from the tape; a set of drag washers to maintain an pre-set tension as the protective backing is spooled onto the take up spindle; a first gear responsive to the rotary motion of the pinch roller set and a second gear responsive to the motion of the first gear and axially attached to the take-up spindle for spooling the protective backing.

SEPARATION METHOD AND BONDING METHOD FOR ADHEREND

A separation method for an adherend according to the present invention allows members to firmly bond to each other by recovery of adhesive force when a predetermined time elapses after a voltage has been applied and can easily separate the adherend by applying the voltage again, and a bonding method for an adherend according to the present invention allows members to firmly bond to each other by recovery of adhesive force when a predetermined time elapses after a voltage has been applied. 1. A separation method for an adherend , comprising:a first voltage application step of applying a voltage to an electrolyte-containing adhesive layer to change an adhesive force so as to generate a potential difference in a thickness direction of the electrolyte-containing adhesive layer in a state where the electrolyte-containing adhesive layer in an adhesive sheet containing at least the electrolyte-containing adhesive layer is allowed to bond to an adherend;a bonding maintenance step of recovering the adhesive force by allowing a predetermined time to elapse in the state where the electrolyte-containing adhesive layer is allowed to bond to the adherend, after the first voltage application step;a second voltage application step of applying a voltage to the electrolyte-containing adhesive layer to change the adhesive force so as to generate a potential difference in the thickness direction of the electrolyte-containing adhesive layer in the state where the electrolyte-containing adhesive layer is allowed to bond to the adherend, after the bonding maintenance step; anda separation step of separating the electrolyte-containing adhesive layer and the adherend.2. The separation method for an adherend according to claim 1 , wherein the second voltage application step and the separation step are performed at the same time.3. The separation method for an adherend according to claim 1 , wherein the separation step is performed after the second voltage application step.4. The separation ...

GLASS PROCESSING APPARATUS AND METHODS

A glass processing apparatus can comprise a first suction device positioned to receive one or more of a first protective layer or a second protective layer. The glass processing apparatus can further comprise a diverting apparatus positioned to receive the first and second protective layer. The diverting apparatus may be movable to direct the first protective layer along a first travel path and the second protective layer along a second travel path. The glass processing apparatus can further comprise a first processing apparatus positioned to receive the first protective layer and produce a first processed product from the first protective layer. The glass processing apparatus can also comprise a second processing apparatus positioned to receive the second protective layer and produce a second processed product different than the first processed product, from the second protective layer. In some embodiments, methods for processing glass with a glass processing apparatus. 1. A glass processing apparatus comprising:a first suction device positioned to receive one or more of a first protective layer from a first glass ribbon or a second protective layer from one or more of the first glass ribbon or a second glass ribbon, the second protective layer different than the first protective layer;a diverting apparatus positioned to receive the first protective layer and the second protective layer, the diverting apparatus movable to direct the first protective layer along a first travel path and the second protective layer along a second travel path;a first processing apparatus positioned to receive the first protective layer from the diverting apparatus and produce a first processed product from the first protective layer; anda second processing apparatus positioned to receive the second protective layer from the diverting apparatus and produce a second processed product different than the first processed product, from the second protective layer.2. The glass processing ...

SPRAY FOR KITCHENS AND RESTROOMS

A method for temporarily protecting a hard surface by selecting a surface, applying a dose of liquid solution on the selected surface, waiting for the dose of liquid solution to solidify into a sheet, and removing the sheet from the surface. At least one dose of liquid solution is stored in a solid form in a container, and the sheet of solidified material can be removed by peeling.

Label Dispenser Apparatus

A label dispenser apparatus configured for dispensing labels from a plurality of rolls of a carrier film having labels disposed thereon. The label dispenser apparatus includes a lower roll retaining member and a upper tape guide assembly. The lower roll retaining member includes a front edge, a back edge and a concave surface therebetween. The concave surface being configured to cradle a roll of film having labels disposed thereon. The upper tape guide assembly is spaced apart therefrom and includes a peel shaft, a support shaft and a carrier shaft. The film guide path extends behind and around the peel shaft, between the peel shaft and the support shaft, looping around the support shaft and over the carrier shaft, such that a label is released by the movement around the peel shaft, and the label path proceeds directly over the support shaft and the carrier shaft. 1. A label dispenser apparatus configured for dispensing labels from a plurality of rolls of a carrier film having labels disposed thereon , the label dispenser apparatus having at least one label dispensing unit comprising:a lower roll retaining member extending from a first side to a second side, the lower roll retaining member including a front edge, a back edge and a concave surface therebetween, the concave surface being configured to cradle a roll of film having labels disposed thereon; a peel shaft comprising a rod that extends substantially parallel to the back edge of the lower roll retaining member, and configured to be above the plurality of rolls of carrier film having labels disposed thereon; and', 'a support shaft extending generally parallel to the peel shaft positioned outboard of the peel shaft, and vertically closer to the lower roll retaining member; and', 'a carrier shaft extending generally parallel to the peel shaft and the support shaft, and positioned so as to be substantially proximate the front edge of the lower roll retaining member and configured to be above the plurality of ...

Apparatus, hybrid laminated body, method, and materials for temporary substrate support

A hybrid laminated body is provided that includes a light-transmitting support, a latent release layer disposed upon the light-transmitting support, a joining layer disposed upon the latent release layer, and a thermoplastic priming layer disposed upon the joining layer. The hybrid laminated body can further include a substrate to be processed such as, for example, a silicon wafer to be ground. Also provided is a method for manufacturing the provided laminated body.

APPARATUS FOR STRIPPING FLEXIBLE DEVICE

A apparatus for stripping flexible device including: a chassis; a stage; a pick-up device mounted on the chassis through a pivot shaft parallel to a bearing surface, the pick-up device being movable with respect to the stage along a direction perpendicular to a rotation axis of the pivot shaft and parallel with the bearing surface of the stage, and having a surface facing the stage, and having a fixing mechanism configured to fasten a lateral side of the flexible device; an auxiliary device which is mounted on the chassis, an end part of the auxiliary device providing a force to the flexible substrate for its separation from the carrier plate at a separation position between the flexible substrate of the flexible device and the carrier plate when the flexible device is picked up from the carrier plate by the pick-up device; a first driving device mounted on the chassis.

SANDWICH PANEL DISBOND REPAIR

A structural panel for an aircraft nacelle may comprise a first skin, a second skin, and a core sandwiched between them. A disbond may be present between the first skin and the core. A plurality of layers of blueprint film adhesive may be positioned over the disbond. The structural panel may be vacuum bagged, and the blueprint film adhesive may be heated. The blueprint film adhesive may flow through perforations in the first skin and bond the first skin to the core. 1. A method of repairing a disbond in a structural sandwich panel comprising:positioning a film adhesive adjacent to a skin of the sandwich panel around a disbond between the skin and a core of the sandwich panel;coupling a first release film over the film adhesive;coupling a breather cloth over the film adhesive;enclosing the disbond in a vacuum bag; andapplying heat to the film adhesive.2. The method of claim 1 , further comprising drilling perforations in the skin prior to the coupling the first release film to the skin.3. The method of claim 1 , wherein the sandwich panel comprises an acoustic sandwich panel.4. The method of claim 1 , further comprising drilling the film adhesive out of perforations in the skin.5. The method of claim 1 , further comprising positioning the sandwich panel such that an interior surface of the skin is facing away from a direction of gravity during the applying heat.6. The method of claim 1 , wherein the heat is applied by a heat blanket.7. The method of claim 1 , further comprising using ambient pressure to force the film adhesive through perforations in the skin.8. The method of claim 7 , wherein after forcing the film adhesive through the perforations claim 7 , a thickness of the film adhesive is less than 20% of a thickness of the sandwich panel.9. The method of claim 1 , wherein the film adhesive comprises a blueprint adhesive.10. A repair method for a structural acoustic panel having a first skin claim 1 , a second skin claim 1 , and a cellular core bonded between ...

Heating Layer For Film Removal

Embodiments of the presently disclosed system include a thin thermoplastic or thermosetting polymer film loaded with non-polymeric inclusions that are susceptible to heating under a time-varying magnetic field. Insertion of this additional heating layer into a structural or semi-structural heterogeneous laminate provides an “on-demand” de-bonding site for laminate deconstruction. For example, in some embodiments when the heating layer is inserted between a cured Carbon-Fiber Reinforced Plastic (CFRP) layer and a Polymeric/Metallic film stackup layer, the heating layer can be selectively heated above its softening point (e.g., by using energy absorbed from a locally-applied time-varying magnetic field) to allow for ease of applique separation from the CFRP layer. 1. A system for installation or removal of appliques , the system comprising: a lightning strike protection layer mounted to the surface of an aircraft;', 'a heating layer positioned between the surface of the aircraft and the lightning protection layer, the heating layer comprising a polymer and magnetic material; and', 'an adhesive layer adhering the lightning protection layer and the heating layer to the surface of the aircraft; and, 'an applique comprisinga magnetic field source for generating a variable frequency magnetic field.2. The system of wherein the magnetic material comprises a magnetic material with a Curie point temperature within a temperature range at which adhesive bonds in the adhesive layer will de-bond.3. The system of wherein the magnetic field source comprises a source that generates a magnetic field selected to cause the magnetic material to reach the Curie point temperature within the temperature range at which the adhesive bonds in the adhesive layer will de-bond.4. The system of wherein the magnetic field source comprises a coil that generates a magnetic field in the range of 15-300 KHz.5. The system of wherein the surface layer comprises a lightning strike protection layer further ...

MANUFACTURING APPARATUS AND MANUFACTURING METHOD FOR CLEANING WEB MEMBER

There is provided a manufacturing apparatus for manufacturing a cleaning web member by intermittently cutting a continuous web member at a product pitch in a transport direction, the continuous web member having a base sheet continuous in the transport direction and a fiber bundle placed on and secured to the base sheet with a direction of fibers being along the transport direction. The manufacturing apparatus includes: an intermittent transport mechanism; a cutter mechanism; a sensor; and a control section. The control section controls a transport amount related to the intermittent transport by the intermittent transport mechanism based on information of the displacement amount output from the sensor. 16-. (canceled)7. A manufacturing apparatus for manufacturing a cleaning web member by intermittently cutting a continuous web member at a product pitch in a transport direction , a base sheet continuous in the transport direction and', 'a fiber bundle placed on and secured to the base sheet with a direction of fibers being along the transport direction, comprising:, 'the continuous web member having'}an intermittent transport mechanism that intermittently transports the continuous web member in the transport direction; that is disposed downstream from the intermittent transport mechanism in the transport direction, and', 'that produce a downstream end portion of the continuous web member as the cleaning web member by cutting and separating the downstream end portion from the continuous web member while transport of the continuous web member is suspended;, 'a cutter mechanism'} that measures a displacement amount of a stop position of a predetermined region of the continuous web member from a target stop position, while transport of the continuous web member is suspended, the measurement being performed at a measurement position which is a position upstream from the intermittent transport mechanism in the transport direction,', [ images one surface of the continuous ...

STRUCTURAL PRE-CURED REPAIR PATCH FOR REPAIR TO HIGHLY LOADED PRIMARY AND SECONDARY STRUCTURAL COMPONENTS

Provided is a method a method for reworking an article. The method includes forming a patch over an area of a composite structure requiring rework. The forming includes placing a first film-adhesive over the area of the composite structure requiring rework, wherein the first film-adhesive extends over a first surface area of the structure including beyond an entirety of the area requiring rework, placing a first pre-cured ply stack over the first film-adhesive, wherein the first pre-cured ply stack extends over a second surface area of the composite structure; placing a second film-adhesive over the first pre-cured ply stack, wherein the second film-adhesive extends over a third surface area of the composite structure; and placing a second pre-cured ply stack over the second film-adhesive, wherein the second pre-cured ply stack extends over a fourth surface area of the composite structure. 1. A method for reworking an article , comprising: placing a first film-adhesive over the area of the composite structure requiring rework, wherein the first film-adhesive extends over a first surface area of the composite structure including beyond an entirety of the area requiring rework,', 'placing a first pre-cured ply stack over the first film-adhesive, wherein the first pre-cured ply stack extends over a second surface area of the composite structure;', 'placing a second film-adhesive over the first pre-cured ply stack, wherein the second film-adhesive extends over a third surface area of the composite structure; and', 'placing a second pre-cured ply stack over the second film-adhesive, wherein the second pre-cured ply stack extends over a fourth surface area of the composite structure., 'forming a patch over an area of a composite structure requiring rework, the forming comprising'}2. The method of claim 1 , wherein the first surface area is larger than the second surface area.3. The method of claim 1 , wherein the second surface area is smaller than the third surface area. ...

METHODS AND SYSTEMS FOR SEPARATING A PLURALITY OF DIRECTED SELF-ASSEMBLED DIAMAGNETIC COMPONENTS

Methods for separating a plurality of diamagnetic directed self-assembled diamagnetic components are provided. One method includes, for instance: contacting a release substrate to the plurality of diamagnetic components, the plurality of diamagnetic components including a non-diamagnetic component affixed to a diamagnetic portion by a first adhesive, and removing the release substrate, the non-diamagnetic component being affixed to a final substrate by a second adhesive and the release substrate being affixed to the diamagnetic portion by a third adhesive, and wherein the removing removes the diamagnetic portion and at least a portion of the first adhesive from the non-diamagnetic component. 1. A method for separating a plurality of diamagnetic components , the method comprising:contacting a release substrate to the plurality of diamagnetic components, the plurality of diamagnetic components including a non-diamagnetic component affixed to a diamagnetic portion by a first adhesive; andremoving the release substrate, the non-diamagnetic component being affixed to a final substrate by a second adhesive and the release substrate being affixed to the diamagnetic portion by a third adhesive, and wherein the removing removes the diamagnetic portion and at least a portion of the first adhesive from the non-diamagnetic component.2. The method of claim 1 , wherein the first adhesive has a first adhesion force which is weaker than a second adhesion force of the second adhesive and a third adhesion force of the third adhesive.3. The method of claim 1 , wherein the plurality of diamagnetic components are affixed to the final substrate prior to the contacting.4. The method of claim 1 , wherein the plurality of diamagnetic components are affixed to the final substrate following the contacting.5. The method of claim 1 , wherein the removing includes lifting claim 1 , peeling claim 1 , or shearing.6. The method of claim 1 , wherein the first claim 1 , second claim 1 , and third ...

ON DEMAND RADIATION INDUCED CONSTRUCTIVE AND DECONSTRUCTIVE CHEMICAL REACTIONS

A method is provided for decomposition of a polymeric article, wherein the polymeric article contains a polymer and one or more energy modulation agents, by applying an applied energy to the polymeric article, wherein the one or more energy modulation agents convert the applied energy into an emitted energy sufficient to cause bond destruction within the polymer. 1. A method for de-bonding objects contained in an article at an interface between the objects , wherein the objects are joined at the interface through an intermediate layer , comprising:providing the article comprising the objects bonded at the interface through the intermediate layer, wherein the intermediate layer comprises an adhesive layer formed by curing a curable adhesive composition by application of a first x-ray source having a first x-ray energy, wherein the curable adhesive composition comprises one or more curable monomers and one or more energy modulation agents, whereby the one or more energy modulation agents convert the first x-ray energy into an initiation energy which initiates polymerization of the one or more monomers and thus cause curing of the curable adhesive composition;applying to the article a second x-ray energy from a second x-ray source, wherein the second x-ray energy is different from the first x-ray energy, and wherein the second x-ray energy is converted by the one or more energy modulation agents into an energy that is sufficient to cause destruction of bonds within the intermediate layer; andseparating the objects from one another.2. The method of claim 1 , wherein the first x-ray energy is lower energy than the second x-ray energy.3. The method of claim 1 , wherein the first x-ray energy is higher energy than the second x-ray energy.4. The method of claim 2 , wherein the first x-ray energy is from 1 kV to 250 kV claim 2 , and the second x-ray energy is 1 MV or higher.5. The method of claim 1 , wherein the first x-ray energy has an energy of from 1 kV to 200 kV.6. The ...

PHOTOREVERSIBLE ADHESIVE AGENT

When conventional photo-reactive compounds are to be liquefied with the application of light, liquefaction thereof is time-consuming due to poor sensitivity to ultraviolet light. In the case of conventional photo-reactive compounds, disadvantageously, light does not penetrate through layers to be adhered to each other when such layers are thick. Thus, peeling is not sufficiently performed. Accordingly, it is an object of the present invention to overcome such drawbacks of conventional photo-reactive compounds and provide a photo-reactive adhesive agent exhibiting high sensitivity to light for fluidization and capable of easy peeling. This invention provides a photo-reactive pressure-sensitive adhesive agent comprising, as a main component, a polymeric compound with a weight average molecular weight of 3,000 to 800,000 represented by General Formula (1): 2. The photo-reactive pressure-sensitive adhesive agent according to claim 1 , which can be fluidized and peeled with the application of light.3. The photo-reactive pressure-sensitive adhesive agent according to claim 2 , which is fluidized and peeled with the application of ultraviolet light in the wavelength range of 350 to 390 nm at the light exposure dose of 0.05 to 10 J/cm.4. The photo-reactive pressure-sensitive adhesive agent according to claim 1 , which can be non-fluidized with the application of light in a wavelength range different from that of the light used for fluidization to adhere objects to each other.5. The photo-reactive pressure-sensitive adhesive agent according to claim 4 , which is non-fluidized with the application of light in the wavelength range of 420 to 600 nm.6. The photo-reactive pressure-sensitive adhesive agent according to claim 1 , which can repeat adhesion and peeling via reversible non-fluidization and fluidization with the application of lights in different wavelength ranges.7. A method of adhesion and peeling with the use of the photo-reactive pressure-sensitive adhesive agent ...

METHODS FOR FORMING COMPOSITE STRUCTURES

A method is provided in one example embodiment and may include forming a ply stack comprising a plurality of uncured composite plies, wherein one or more uncured composite ply of the plurality of uncured composite plies comprises a plurality of perforations that extend, at least partially, through a thickness of the one or more uncured composite ply; and compacting the ply stack to form a composite structure. The plurality of perforations may provide paths for volatiles to be removed through the thickness of the one or more uncured composite ply of the ply stack during the compacting. Volatiles may also be removed through edges of the ply stack during the compacting. In some instances, all uncured composite plies of the ply stack may include a plurality of perforations that extend, at least partially, through the thickness of each uncured composite ply. 1. A method comprising:forming a ply stack comprising a plurality of uncured composite plies, wherein one or more uncured composite ply of the plurality of uncured composite plies comprises a plurality of perforations that extend, at least partially, through a thickness of the one or more uncured composite ply; andcompacting the ply stack to form a composite structure.2. The method of claim 1 , wherein compacting the ply stack further comprises:encapsulating the ply stack within a bag; andincreasing a vacuum level within the bag to increase external pressure on the bag and the composite structure.3. The method of claim 1 , wherein the plurality of perforations provide paths for volatiles to be removed through the thickness of the one or more uncured composite ply of the ply stack during the compacting.4. The method of claim 3 , wherein volatiles are also removed through edges of the ply stack during the compacting.5. The method of claim 1 , wherein the ply stack comprises at least 14 uncured composite plies.6. The method of claim 1 , wherein the plurality of perforations are provided for one or more areas of the one ...

Method and Apparatus for Display Screen Shield Replacement

A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.

LABEL PEELING DEVICE

According to one embodiment, a label peeling device includes a tray, a pressing unit, and a control unit. The tray is configured to support a label sheet thereon. The pressing unit is configured to be driven in a direction perpendicular to a conveyance direction of the label sheet. The control unit is configured to drive the pressing unit toward a central portion of the label sheet supported on the tray. The control unit performs peeling control to peel a liner sheet and a label body of the label sheet from each other by pressing an edge of the label sheet and thereby curving the label sheet. 1. A post-processing apparatus , comprising:a sheet conveyance path including an entrance and an exit and configured to convey a label sheet in a sheet conveyance direction from the entrance to the exit;a guide along the sheet conveyance path to move in a direction perpendicular to the sheet conveyance direction; anda control unit configured to move the guide to align the label sheet in the direction perpendicular to the sheet conveyance direction and to move the guide toward a central portion of the label sheet while the label sheet is on the sheet conveyance path to peel a label body from the label sheet.2. The post-processing apparatus according to claim 1 , wherein the guide positions the label sheet in the direction perpendicular to the sheet conveyance direction.3. The post-processing apparatus according to claim 1 , wherein the guide includes a pair of alignment plates spaced from each other in the direction perpendicular to the sheet conveyance direction claim 1 , and the pair of alignment plates are positioned so each alignment plate contacts a lateral edge of the label sheet while the label sheet is on the sheet conveyance path.4. The post-processing apparatus according to claim 3 , wherein the control unit is configured to peel the label body from the label sheet by moving the pair of alignment plates toward each other.5. The post-processing apparatus according to ...

LASER LIFT OFF SYSTEMS AND METHODS THAT OVERLAP IRRADIATION ZONES TO PROVIDE MULTIPLE PULSES OF LASER IRRADIATION PER LOCATION AT AN INTERFACE BETWEEN LAYERS TO BE SEPARATED

Laser lift off systems and methods overlap irradiation zones to provide multiple pulses of laser irradiation per location at the interface between layers of material to be separated. To overlap irradiation zones, the laser lift off systems and methods provide stepwise relative movement between a pulsed laser beam and a workpiece. The laser irradiation may be provided by a non-homogeneous laser beam with a smooth spatial distribution of energy across the beam profile. The pulses of laser irradiation from the non-homogenous beam may irradiate the overlapping irradiation zones such that each of the locations at the interface is exposed to different portions of the non-homogeneous beam for each of the multiple pulses of the laser irradiation, thereby resulting in self-homogenization. Thus, the number of the multiple pulses of laser irradiation per location is generally sufficient to provide the self-homogenization and to separate the layers of material. 1. A laser lift off method for separating layers of material , the method comprising:providing a workpiece including at least first and second layers of material;generating pulses of laser irradiation by a non-homogenous laser beam with a smooth spatial distribution of energy;directing the laser beam through one of the first and second layers of material to an interface of the first and second layers of material such that a beam spot is formed by the at least one non-homogenous laser beam at the interface; andmoving at least one of the non-homogenous laser beam and the workpiece in a stepwise manner such that the pulses of the laser irradiation irradiate overlapping irradiation zones corresponding to the beam spots formed at the interface between the first and second layers, wherein the irradiation zones are overlapped such that locations at the interface are exposed to multiple pulses of the laser irradiation, wherein each of the locations at the interface is exposed to a different portion of the beam spot for each of ...

BENDABLE CARRIER MOUNT, DEVICE AND METHOD FOR RELEASING A CARRIER SUBSTRATE

A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the carrier substrate.

PROCEDURE OF PROCESSING A WORKPIECE AND AN APPARATUS DESIGNED FOR THE PROCEDURE

The present invention provides a procedure of processing a workpiece such as backside grinding of a device wafer and an apparatus designed for the procedure. The procedure comprises (1) preparing a bonded stack comprising (e.g. consisting of) a carrier layer, a workpiece layer, and an interposer layer therebetween; (2) processing the workpiece layer; and (3) delivering a gas jet at the junction between two adjacent layers in the stack to separate or debond the two adjacent layers. Technical merits of the invention include enhanced efficiency, higher wafer throughput, reduced stress on workpiece surface, and uniformly distributed stress and avoidance of device wafer breakage and internal device damage, among others. 1. A procedure of processing a workpiece , comprising (1) preparing a bonded stack comprising a carrier layer , a workpiece layer , and an interposer layer therebetween; (2) processing the workpiece layer; and (3) delivering a gas jet at the junction between two adjacent layers in the stack to separate or debond said two adjacent layers.2. The procedure according to claim 1 , wherein said two adjacent layers are the carrier layer and the interposer layer.3. The procedure according to claim 1 , wherein said carrier layer is made of a material selected from glass claim 1 , silicon claim 1 , ceramics claim 1 , sapphire claim 1 , quartz claim 1 , polysilicon claim 1 , silicon dioxide claim 1 , silicon-germanium claim 1 , silicon (oxy)nitride claim 1 , Gallium Nitride (GaN) claim 1 , gallium arsenide (GaAs) claim 1 , gallium phosphide (GaP) claim 1 , gallium arsenide phosphide (GaAsP) claim 1 , silicon carbide (SiC) claim 1 , metals such as copper claim 1 , aluminum claim 1 , gold claim 1 , tungsten claim 1 , tantalum; low k dielectrics claim 1 , polymer dielectrics claim 1 , and metal nitrides and silicides.4. The procedure according to claim 1 , further comprising a step of pretreating the bonding surface of the carrier layer before the step of preparing ...

MELAMINE RESIN DECORATIVE SHEET AND METHOD OF REFURBISHING FINISHED SURFACE

A melamine resin decorative sheet of the present invention includes a laminate structure of a surface layer and a core layer, in which the surface layer is configured of a surface layer material composed of a surface layer base material which carries a resin containing a melamine resin on a first surface side that serves as a design surface and which carries a solid content of a thermoplastic emulsion resin on a second surface side that contacts with the core layer, and in which the core layer is configured of a heat dissipative material layer. 1. A melamine resin decorative sheet comprising:a laminate structure of a surface layer and a core layer,wherein the surface layer is configured of a surface layer material composed of a surface layer base material which carries a resin containing a melamine resin on a first surface side that serves as a design surface and which carries a solid content of a thermoplastic emulsion resin on a second surface side that contacts with the core layer, andwherein the core layer is configured of a heat dissipative material layer.2. The melamine resin decorative sheet according to claim 1 ,wherein the heat dissipative material layer is a metallic layer.3. The melamine resin decorative sheet according to claim 2 ,wherein the metallic layer is an aluminum layer.4. The melamine resin decorative sheet according to claim 1 , further comprising:an adhesive layer between the surface layer and the core layer.5. The melamine resin decorative sheet according to claim 4 ,wherein the adhesive layer is configured of an adhesive layer base material that carries a solid content of a thermosetting resin.6. The melamine resin decorative sheet according to claim 5 ,wherein the adhesive layer base material is a glass cloth.7. The melamine resin decorative sheet according to claim 1 ,wherein the solid content of the thermoplastic emulsion resin includes emulsion resin particles having an average particle diameter of 30 nm to 100 nm.8. The melamine resin ...

EFFECTIVE COMPOUND SUBSTRATE FOR NON-DESTRUCTIVE EPITAXIAL LIFT-OFF

The present disclosure relates to compound substrates for use in epitaxial lift-off. In one implementation, a compound substrate may include a diced wafer layer formed of a plurality of wafer pieces and a wafer-receiving layer having a surface. The wafer layer may have a bottom surface and a top surface, and the bottom surface of the wafer layer may be attached to the surface of the wafer-receiving layer. 1. A compound substrate for use in epitaxial lift-off of a device having an expected size , comprising:a diced wafer layer formed of a plurality of wafer pieces, wherein the wafer layer has a bottom surface and a top surface; anda wafer-receiving layer having a surface, wherein the bottom surface of the wafer layer is attached to the surface of the wafer-receiving layer.2. The compound substrate of claim 1 , wherein the wafer-receiving layer comprises at least one semiconductor.3. The compound substrate of claim 2 , wherein the wafer-receiving layer comprises silicon.4. The compound substrate of claim 1 , wherein the wafer-receiving layer comprises at least one crystalline solid.5. The compound substrate of claim 4 , wherein the wafer-receiving layer comprises quartz.6. The compound substrate of claim 1 , wherein the wafer layer comprises at least one III-V semiconductor.7. The compound substrate of claim 6 , wherein the at least one III-V semiconductor comprises GaAs.8. The compound substrate of claim 1 , wherein the size of each wafer piece is smaller than the expected size of the device.9. The compound substrate of claim 1 , wherein the size of each wafer piece is larger than the expected size of the device.10. The compound substrate of claim 1 , wherein the plurality of wafer pieces are uniformly sized.11. The compound substrate of claim 1 , further comprising:an active device region,wherein the active device region is disposed on the wafer layer.12. The compound substrate of claim 11 , further comprising:one or more sacrificial layers,wherein the one or more ...

Methods and apparatus for fabricating and cutting flexible glass and polymer composite structures

Methods and apparatus provide for: sourcing an ultra-thin glass sheet having first and second opposing major surfaces and perimeter edges therebetween, the glass sheet having a thickness between the first and second surfaces of less than about 400 microns; adhering at least one polymer layer directly or indirectly to at least one of the first and second surfaces of the glass sheet to form a laminated structure; and cutting the laminated structure using at least one of the following techniques: shear cutting, burst cutting, slit cutting, and crush cutting.

Stripping device and method

A stripping device and method for stripping a plastic film from a glass substrate are provided. The stripping device at includes a roller and a support member. The support member is disposed at a position where the plastic film is separated from the glass substrate. The support member supports and/or stretches the stripped plastic film. The roller is used to roll up the plastic film supported and/or stretched by the support member. Because the support member stretches and/or supports the plastic film as it is removed from the glass substrate, the plastic film is bent at a rounded angle. This reduces the stress generated in the plastic film during bending, thereby decreasing cracks in the plastic film and improving the overall useable yield of the plastic film.

METHOD AND DEVICE FOR MENDING DAMAGED AREAS IN FIBER COMPOSITE COMPONENTS

A method for mending damaged areas in fiber composite components formed from a plurality of unidirectional fiber layers includes the steps of automatically lifting at least one fiber layer of the fiber composite component at a cutting edge of the at least one fiber layer using a delaminating device, removing the at least one fiber layer in the extension direction of the fiber orientation of the at least one fiber layer, and separating off the removed at least one fiber layer in a defined manner at a separating edge defined by a separation device placed on the fiber composite component. 1. A method for mending damaged areas in fiber composite components formed from a plurality of unidirectional fiber layers , the method comprising:automatically lifting at least one fiber layer of the fiber composite component at a cutting edge of the at least one fiber layer using a delaminating device;removing the at least one fiber layer in the extension direction of the fiber orientation of the at least one fiber layer; andseparating off the removed at least one fiber layer in a defined manner at a separating edge defined by a separation device placed on the fiber composite component.2. The method according to claim 1 , further comprising:forming the cutting edge of the at least one fiber layer by cutting perpendicularly through the fiber layer using a cutting device.3. The method according to claim 1 , further comprising:non-invasively determining the depth of the damage to the damaged area to be mended of the fiber composite component using a sensor device.4. The method according to claim 3 , wherein the sensor device comprises an ultrasound sensor claim 3 , an eddy current sensor claim 3 , an infrared sensor or a radar sensor.5. The method according to claim 1 , wherein the delaminating device comprises a delaminating blade which is guided under the fiber layer when the at least one fiber layer of the fiber composite component is automatically lifted.6. The method according to ...

Composite Panel Tool

A method and apparatus for holding a panel. A rigid frame is secured on an aircraft on a rework area on the aircraft. A carrier is attached to the rigid frame. The panel is held on the carrier and the carrier moves the panel about a plurality of axes. The panel moves with the carrier such that the panel has a desired position relative to a rework opening in the rework area. The panel is attached to the aircraft while the panel is held in the desired position relative to the rework opening. 1. A method for holding a panel , the method comprising:securing a rigid frame on an aircraft on a rework area on the aircraft;attaching a carrier to the rigid frame, wherein the panel is held on the carrier and the carrier moves the panel about a plurality of axes;moving the panel with the carrier such that the panel has a desired position relative to a rework opening in the rework area; andattaching the panel to the aircraft while the panel is held in the desired position relative to the rework opening.2. The method of further comprising:forming the rework opening in the rework area.3. The method of claim 1 , wherein the panel floats within the rework opening when attached to the aircraft such that a gap is present between a periphery of the panel and a fuselage of the aircraft claim 1 , wherein a load on the panel from the fuselage is reduced during operation of the aircraft.4. The method of further comprising:sealing the gap between the panel and the fuselage.5. The method of further comprising:moving the carrier such that the panel has the desired position relative to the rework opening;moving the panel about the plurality of axes such that the panel has a position over the rework opening;marking the panel from a comparison of the panel to the rework opening with the panel over the rework opening; andtrimming the panel for attachment to the aircraft when the panel is in the desired position in the rework opening.6. The method of further comprising:repeating the marking step ...

PEELING APPARATUS

A peeling apparatus according to an embodiment includes: a conveyance roller configured to convey a laminate made by peelably laminating a first substrate and a second substrate including an opening; a peel roller arranged facing the conveyance roller with the laminate interposed in between, and configured to peel the second substrate from the first substrate; a winding roller arranged away from the peel roller, and configured to wind the second substrate peeled from the first substrate; and an auxiliary winding roller arranged between the peel roller and the winding roller, and including a stepped portion configured to maintain a width of the opening. 1. A peeling apparatus comprising:a conveyance roller configured to convey a laminate made by peelably laminating a first substrate and a second substrate including an opening;a peel roller arranged facing the conveyance roller with the laminate interposed in between, and configured to peel the second substrate from the first substrate;a winding roller arranged away from the peel roller, and configured to wind the second substrate peeled from the first substrate; andan auxiliary winding roller arranged between the peel roller and the winding roller, and including a stepped portion configured to maintain a width of the opening.2. The peeling apparatus according to claim 1 , whereinthe second substrate comprises two intact portions located at two sides of the opening in a direction intersecting a winding direction of the second substrate; and a roller main body, and', 'the stepped portion projecting from an outer peripheral surface of the roller main body in an area, between the two intact portions, facing the opening of the second substrate., 'the auxiliary winding roller comprises3. The peeling apparatus according to claim 2 , wherein the stepped portion comprises:a first projection portion configured to come into contact with one of the two intact portions, anda second projection portion arranged away from the first ...

METHOD AND DEVICE FOR DETACHING A SUBSTRATE FROM A SUBSTRATE STACK

A method and device for detaching a carrier substrate from a substrate stack, which is formed by the carrier substrate and a product substrate, as well as a bonding layer bonding the carrier substrate and the product substrate. The bonding layer has an adhesive strength for bonding the carrier substrate and the product substrate, and the adhesive strength is at least partially reduced by a beam of electromagnetic radiation directed at least predominantly on the bonding layer. 19-. (canceled)10. A method for detaching a carrier substrate from a substrate stack that is comprised of the carrier substrate , a product substrate , and a bonding layer that bonds the carrier substrate and the product substrate , wherein the bonding layer has an adhesive strength for bonding the carrier substrate and the product substrate , said method comprising:directing a beam of electromagnetic radiation on the bonding layer to at least partially reduce said adhesive strength, wherein the electromagnetic radiation is a laser beam that is focused directly onto the bonding layer.11. The method according to claim 10 , wherein less than 50% of an amount of the electromagnetic radiation of the beam is absorbed by the carrier substrate and/or the product substrate.12. The method according to claim 10 , wherein the bonding layer comprises a material that is softened by the electromagnetic radiation.13. The method according to claim 12 , wherein the material of the bonding layer is selected from one of the following:silicones, and/orplastics.14. The method according to claim 13 , wherein the plastics are thermoplastics claim 13 , and/or thermosetting plastics claim 13 , and/or elastomers.15. The method according to claim 13 , wherein the material of the bonding layer is mixed with at least one additive.16. The method according to claim 10 , wherein the adhesive strength of the bonding layer is constituted so as to act at least predominantly in a peripheral edge region of the substrate stack.17. ...

Dry apply protective methods

A system for protecting a surface of a substrate includes a protective film, which is configured to be applied and secured to the surface, as well as a backing on an adherent surface of the protective film and an application tape over an exterior surface of the protective film. Protruding features, such as tabs, adjacent to different peripheral edges of the protective film may enable removal of the backing and the application tape from the protective film, and may include features that indicate the order in which each protruding feature is to be grasped to peel its corresponding element away from the protective film. Methods of using such a system are also disclosed.

AZOBENZENE DERIVATIVE, PREPARATION METHOD THEREOF, AZOPHENYL LIGHT CONTROL REVERSIBLE ADHESIVE AND METHOD OF USING THE SAME

An azobenzene derivative, a preparation method of the azobenzene derivative, an azophenyl light control reversible adhesive, and a method of using the azophenyl light control reversible adhesive are disclosed. The azobenzene derivative has a molecular structure as P1 or P2. In the abovementioned preparation method, the azobenzene derivative P1 or P2 is obtained from an esterification reaction of an azophenyl group, 3,4,5-tripentyloxybenzoic acid or 3,4,5-tri(dodecyloxy)benzoic acid, and 2,2′-dihydroxy-1,1′-binaphthol. The melting point of the azobenzene derivative P1 or P2 is modified commonly by alkyl chains and binaphthol to be slightly higher than room temperature. 2. A preparation method of an azobenzene derivative according to claim 1 , wherein an azobenzene derivative P1 or P2 is obtained from an esterification reaction of an azophenyl group claim 1 , 3 claim 1 ,4 claim 1 ,5-tripentyloxybenzoic acid or 3 claim 1 ,4 claim 1 ,5-tri(dodecyloxy)benzoic acid claim 1 , and 2 claim 1 ,2′-dihydroxy-1 claim 1 ,1′-binaphthol.3. The preparation method of the azobenzene derivative according to claim 2 , wherein a reaction medium for the esterification reaction of an azophenyl group claim 2 , 3 claim 2 ,4 claim 2 ,5-tripentyloxybenzoic acid or 3 claim 2 ,4 claim 2 ,5-tri(dodecyloxy)benzoic acid claim 2 , and 2 claim 2 ,2′-dihydroxy-1 claim 2 ,1′-binaphthol is water claim 2 , and adding the above three raw materials into water to react together claim 2 , so as to obtain the azobenzene derivative P1 or P2.4. The preparation method of the azobenzene derivative according to claim 2 , wherein a reaction time is 20-40 minutes.5. The preparation method of the azobenzene derivative according to claim 2 , wherein a reaction temperature is 20-30° C.6. The preparation method of the azobenzene derivative according to claim 2 , wherein an amount ratio of the azophenyl group to 3 claim 2 ,4 claim 2 ,5-tripentyloxybenzoic acid or 3 claim 2 ,4 claim 2 ,5-tri(dodecyloxy)benzoic acid to 2 ...

METHOD FOR ISOLATING FLEXIBLE FILM FROM SUPPORT SUBSTRATE

Method for isolating a flexible film from a support substrate and method for fabricating an electronic device are provided. The method for isolating a flexible film from a support substrate includes providing a substrate with a top surface. A surface treatment is subjected to the top surface of the substrate, forming a top surface with detachment characteristics. A flexible film is formed on the top surface with detachment characteristics. The flexible film within the top surface with detachment characteristics is cut and isolated. 2. The method as claimed in claim 1 , wherein the support substrate comprises a metallic substrate claim 1 , a plastic substrate claim 1 , a ceramic substrate claim 1 , a glass substrate claim 1 , or a silicon wafer.3. The method as claimed in claim 1 , after subjecting the top surface of the support substrate to the surface treatment claim 1 , functional groups of the treated top surface of the support substrate claim 1 , which are able to form bonds with the flexible film claim 1 , are consumed claim 1 , covered or displaced.4. The method as claimed in claim 3 , wherein the functional groups which are able to be bonded with the flexible film comprises hydroxyl group claim 3 , carboxyl group claim 3 , amino group claim 3 , or ester group.5. The method as claimed in claim 3 , wherein the bonds formed between the top surface of the support substrate and the flexible film comprises an ionic bond claim 3 , a covalent bond or a hydrogen bond.6. The method as claimed in claim 1 , wherein the chemical agent comprises chloromethyl trimethylsilane claim 1 , 2-bromopropane claim 1 , trimethyl fluorosilane claim 1 , trimethyl bromosilane claim 1 , trimethyl iodosilane claim 1 , trimethylsilyl cyanide claim 1 , thionyl chloride claim 1 , lithium diisopropylamide claim 1 , phosphorus trichloride claim 1 , sulfuryl chloride claim 1 , or combinations thereof.7. The method as claimed in claim 1 , wherein the chemical agent is formed on the top surface ...

PROTECTIVE SHEET AUTOMATIC PEELING APPARATUS AND PROTECTIVE SHEET AUTOMATIC PEELING METHOD

Provided is an automatable peeling apparatus for peeling a protective sheet from a prepreg sheet. This peeling apparatus is equipped with a loading unit a prepreg sheet conveying unit a leading end position detection unit air spraying units a peeling state detection unit protective sheet gripping/conveying units an extraction unit and a control unit The control apparatus controls the loading unit the prepreg sheet conveying unit the leading end position detection unit the air spraying units the peeling state detection unit the protective sheet gripping/conveying units and the extraction unit The first spraying mechanism sprays first air onto the front of the end face of the prepreg sheet. The second spraying mechanism sprays second air and fourth air onto the peeling boundary of the protective sheet. 1. A protective sheet automatic peeling apparatus comprising:a loading unit for receiving a prepreg sheet with protective sheets attached thereto;a prepreg sheet conveying unit for delivering the prepreg sheet in a feeding direction;a leading end position detection unit for detecting whether a leading end position of the prepreg sheet arrives at a predetermined position;an air spraying unit for spraying air onto the prepreg sheet or/and the protective sheets;a protective sheet gripping/conveying unit for gripping the protective sheets peeled off by the air from the air spraying unit and delivering the protective sheets in a direction opposite to the feeding direction;an extraction unit for extracting the prepreg sheet delivered in the feeding direction after the protective sheets are peeled therefrom; anda control unit for controlling each unit.2. The protective sheet automatic peeling apparatus according to claim 1 , wherein the control unit executes:processing for causing the prepreg sheet conveying unit to deliver the prepreg sheet with the protective sheets attached thereto from the loading unit;processing for causing the leading end position detection unit to ...